<?xml version="1.0" encoding="UTF-8"?>
<tw-patent-applications total-count="1930"> 
  <tw-patent-application no="1" publication-number="202620267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113118492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使紡織製品脫膠的方法</chinese-title>  
        <english-title>METHOD FOR REMOVING ADHESIVES FROM TEXTILE PRODUCTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">D06B1/00</main-classification>  
        <further-classification edition="200601120260213B">D06M13/144</further-classification>  
        <further-classification edition="200601120260213B">D06B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人紡織產業綜合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許鎮守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN-SHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮巽雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, SUN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使紡織製品脫膠的方法包括：接收包括基布層、膠體及膜層的紡織製品，其中膜層由膠體貼附於基布層上；將紡織製品浸泡於脫膠劑中，使膠體由紡織製品脫離，其中膠體包括第一聚氨酯，脫膠劑包括甲氧基醇溶劑及弱酸，且當將弱酸以0.50重量百分濃度溶於甲氧基醇溶劑中而形成溶液時，溶液具有6至7的酸鹼(pH)值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for removing adhesives from textile products includes: receiving a textile product including a base colth layer, an adhesive and, a film layer, in which the film layer is attached to the base colth layer by the adhesive; soaking the textile product in an adhesive-removing agent to remove the adhesive from the textile product , in which the adhesive includes a first polyurethane, the adhesive-removing agent includes a methoxy alcohol solvent and a weak acid, and when the weak acid is dissolved in the methoxy alcohol solvent at a weight percent concentration of 0.50% to form a solution, the solution has a pH value of 6 to 7.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:紡織製品</p>  
        <p type="p">110:基布層</p>  
        <p type="p">120:膠體</p>  
        <p type="p">130:膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2" publication-number="202619896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113126645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貼合裝置及貼合部件的製造方法</chinese-title>  
        <english-title>BONDING APPARATUS AND METHOD FOR MANUFACTURING BONDED OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B32B37/00</main-classification>  
        <further-classification edition="200601120260213B">B29C65/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商歐利生股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIGIN COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本勇樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村井寛幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種貼合裝置，包括台座、補正移動裝置及位移感測器。台座保持與其接觸面所接觸之貼合目標物。補正移動裝置可以補正台座的假想參考平面於第一直線方向、第二直線方向、第一旋轉方向、第二旋轉方向及第三旋轉方向上移動。位移感測器對應台座所保持之貼合目標物的至少三處，測量相對貼合目標物參考位置的位移。貼合部件的製造方法為，透過貼合裝置，將貼合目標物保持於台座，並補正移動裝置作動，以使台座所保持之貼合目標物補正移動，並將補正移動完成後之貼合目標物貼合至被貼合部件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bonding apparatus includes a stage holding a bonding object that has contacted a contact face, a correction movement device capable of correction movement of the virtual reference plane of the stage in the first linear direction, the second linear direction, the first rotational direction, the second rotational direction, and the third rotational direction, and a displacement meter that measures displacement from a bonding object reference position at least three points on the bonding object that has been held by the stage. A method for manufacturing bonded object includes, by using the bonding apparatus, holding the bonding object by the stage, moving for correction, by operating the correction movement device, the bonding object that has been held by the stage, and bonding a object to be bonded to the bonding object that have been moved for correction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:貼合裝置</p>  
        <p type="p">10:台座</p>  
        <p type="p">11:接觸面</p>  
        <p type="p">18:升降裝置</p>  
        <p type="p">20:補正移動裝置</p>  
        <p type="p">21:第一補正裝置</p>  
        <p type="p">22:第二補正裝置</p>  
        <p type="p">23:第三補正裝置</p>  
        <p type="p">30:位移感測器</p>  
        <p type="p">31:第一位移感測器</p>  
        <p type="p">32:第二位移感測器</p>  
        <p type="p">33:第三位移感測器</p>  
        <p type="p">35:位移感測器移動裝置</p>  
        <p type="p">37:攝影裝置</p>  
        <p type="p">40:第二部件支撐裝置</p>  
        <p type="p">41:保持部件</p>  
        <p type="p">42:軸部件</p>  
        <p type="p">43:反轉裝置</p>  
        <p type="p">45:位移感測器</p>  
        <p type="p">47:攝影裝置</p>  
        <p type="p">49:塗佈裝置</p>  
        <p type="p">50:控制裝置</p>  
        <p type="p">51:處理器</p>  
        <p type="p">52:記憶體</p>  
        <p type="p">53:存儲裝置</p>  
        <p type="p">81:第一部件</p>  
        <p type="p">82:第二部件</p>  
        <p type="p">D1:第一直線方向</p>  
        <p type="p">D2:第二直線方向</p>  
        <p type="p">D3:第三直線方向</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p>  
        <p type="p">P3:第三位置</p>  
        <p type="p">R1:第一旋轉方向</p>  
        <p type="p">R2:第二旋轉方向</p>  
        <p type="p">R3:第三旋轉方向</p>  
        <p type="p">VF:假想參考平面</p>  
        <p type="p">x:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3" publication-number="202619895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113131600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信機器用基材膜、捲繞體、通信機器用構件及通信機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B32B27/32</main-classification>  
        <further-classification edition="200601120260213B">C08J5/18</further-classification>  
        <further-classification edition="202501120260213B">C08L23/26</further-classification>  
        <further-classification edition="200601120260213B">H01Q1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木星冴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, SEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種低介電特性優異且與金屬體之接著性優異之樹脂膜。本發明係關於一種通信機器用基材膜，其含有改性聚烯烴(A)，且構成通信機器用基材膜之樹脂包含烯烴單元50質量%以上作為構成單體單元。又，本發明係關於一種具有通信機器用基材膜之通信機器用構件、通信機器、天線及扁平電纜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="4" publication-number="202620357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱結構及其製造方法</chinese-title>  
        <english-title>HEAT CONDUCTION STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">F28D15/04</main-classification>  
        <further-classification edition="200601120260204B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高柏科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>T-GLOBAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾炫鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSUAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUAN-CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊岳龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUEH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭酩献</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, MING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭首席</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種導熱結構及其製造方法，導熱結構包括均溫板、熱管及第二毛細結構，均溫板包括上板、下板及第一腔室，第一腔室是由上板及下板界定形成，且上板包括開孔及由開孔背向第一腔室所延伸出的凸緣；熱管包含管身，管身包含開口端及封閉端，且內壁包含第一毛細結構及第二腔室，第一腔室連通第二腔室；第二毛細結構貼合於上板的第一腔室內，且延伸至管身的第一毛細結構上，使第二毛細結構一部分以片狀結構與第一毛細結構一部分相互疊合，俾使第二毛細結構存在於第一腔室及第二腔室中；據此，藉由片狀結構的相互疊合，讓導熱性能更加穩定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a heat conductive structure and a manufacturing method thereof. The heat conductive structure includes a vapor chamber, a heat pipe and a second capillary structure. The vapor chamber includes an upper plate, a lower plate and a first chamber. The first chamber is defined by an upper plate and a lower plate, and the upper plate includes an opening and a flange extending from the opening toward the first chamber. The heat pipe includes a tube body, the tube body includes an open end and a closed end, and the inner wall includes a first capillary structure and a second chamber, and the first chamber is connected to the second chamber. The second capillary structure is attached to the first chamber of the upper plate and extends to the first capillary structure of the tube body, so that a part of the second capillary structure overlaps with a part of the first capillary structure in a sheet-like structure, so that the second capillary structure overlaps with the first capillary structure. Two capillary structures exist in the first chamber and the second chamber. Accordingly, the heat conductivity is more stable through the mutual superposition of the sheet structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導熱結構</p>  
        <p type="p">12:均溫板</p>  
        <p type="p">122:上板</p>  
        <p type="p">1224:開孔</p>  
        <p type="p">1226:凸緣</p>  
        <p type="p">124:下板</p>  
        <p type="p">14:熱管</p>  
        <p type="p">142:管身</p>  
        <p type="p">1422:第一毛細結構</p>  
        <p type="p">144:開口端</p>  
        <p type="p">146:封閉端</p>  
        <p type="p">16:第二毛細結構</p>  
        <p type="p">162:片狀結構</p>  
        <p type="p">S1:第一腔室</p>  
        <p type="p">S2:第二腔室</p>  
        <p type="p">P:片狀頂點</p>  
        <p type="p">h1:疊合高度</p>  
        <p type="p">h2:凸緣高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="5" publication-number="202619683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>健康數據檢測方法及其系統</chinese-title>  
        <english-title>HEALTH DATA DETECTION METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">A61B5/11</main-classification>  
        <further-classification edition="202101120260213B">A61B5/25</further-classification>  
        <further-classification edition="202101120260213B">A61B5/296</further-classification>  
        <further-classification edition="202101120260213B">A61B5/389</further-classification>  
        <further-classification edition="201801120260213B">G16H50/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智遊科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIFREE INTERACTIVE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張虔祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　柏彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, POH-THONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連偉志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, WEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露書提出一種健康數據檢測方法，包括：建立一健康數據產生器；透過複數個步態感測器感測複數個步態數據並得到複數個步態數據特徵；透過複數個表面肌電訊號感測器感測複數個表面肌電訊號，並自該複數個表面肌電訊號中擷取複數個表面肌電數據特徵；將該複數個步態數據特徵和該複數個表面肌電數據特徵輸入該健康數據產生器，得到一健康數據。本揭露書提出一種同時利用表面肌電數據和步態數據以評估使用者健康狀況的方法。此將有助於醫療團隊更準確地了解患者的下肢功能與平衡狀況，增加復健及評估的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a health data detection method including establishing a health data generator; capturing multiple gait data by multiple gait sensors and obtaining multiple gait data features; capturing multiple surface electromyography (sEMG) signals by multiple sEMG sensors and obtaining multiple sEMG data features; transmitting the gait data features and sEMG data features to the health data generator to produce health data. This disclosure provides a method that utilizes both sEMG data and gait data simultaneously to evaluate the patient's health condition. This approach may assist medical personal to obtain a more accurate understanding of the patient’s lower limb function, thereby enhancing the efficiency of rehabilitation and evaluation processes.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="6" publication-number="202620886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141744</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疾病治療之特定候選藥物的篩選方法及甲氨蝶呤或甲硝唑用於治療嗜中性白血球炎症介導的疾病患者之用途</chinese-title>  
        <english-title>METHOD FOR IDENTIFYING SPECIFIC DRUG CANDIDATES FOR DISEASE TREATMENT AND USE OF A METHOTREXATE OR METRONIDAZOLE FOR THE TREATMENT OF A PATIENT WITH A NEUTROPHILIC INFLAMMATION-MEDIATED DISORDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250701B">G16B30/10</main-classification>  
        <further-classification edition="201901120250701B">G16B30/20</further-classification>  
        <further-classification edition="201801120250701B">G16H50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯泰名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, TAI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, VINCENT B. BELTRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林芳平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, FANG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張兆良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHAW-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種藥物識別方法，可評估針對特定疾病的候選藥物，從中找出對治療該疾病最有效的藥物。此外，該方法還提出了將選定的藥物甲氨蝶呤或甲硝唑的新適應症，用於治療由嗜中性白血球炎症介導的疾病，針對異常的CD177+嗜中性白血球群集。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a drug identifying method designed to evaluate specific candidate drugs for targeted diseases, identifying those most effective for treating the condition. And a new indication of the selected drugs methotrexate or metronidazole for the treatment of diseases mediated by neutrophilic inflammation targeting the aberrant CD177 &lt;sup&gt;+&lt;/sup&gt;neutrophil subpopulation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="7" publication-number="202621040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低雜訊放大電路</chinese-title>  
        <english-title>LOW NOISE AMPLIFIER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">H03F3/189</main-classification>  
        <further-classification edition="200601120250204B">H03F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢威光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEXAWAVE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢浩育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳筱青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅聖凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, SHENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟駿逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">低雜訊放大電路包括放大電路、第一雜訊消除電路、追隨電路、第二雜訊消除電路，和阻抗匹配電路。放大電路接收射頻訊號，透過電感性峰值技術增加射頻訊號通過放大電路的高頻響應，且透過電阻回授技術穩定放大電路的工作狀態。第一雜訊消除電路電性連接放大電路，用以抑制射頻訊號的雜訊。追隨電路電性連接第一雜訊消除電路，用以整合經過放大和雜訊消除的射頻訊號，且將射頻訊號輸出至節點。第二雜訊消除電路透過節點電性連接追隨電路，產生反相雜訊，用以消除雜訊。阻抗匹配電路電性連接節點，用以執行阻抗匹配且輸出射頻訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A low noise amplifier circuit includes an amplifier circuit, a first noise cancellation circuit, a follower circuit, a second noise cancellation circuit, and an impedance matching circuit. The amplifier circuit receives an RF signal, increases a high-frequency response of the RF signal passing through the amplifier circuit through an inductive gain peaking technology, and stabilizes a working state of the amplifier circuit through resistive feedback technology. The first noise cancellation circuit is electrically connected to the amplifier circuit and suppresses a noise of the RF signal. The follower circuit is electrically connected to the first noise cancellation circuit, integrates the amplified and noise-cancelled RF signal, and outputs the RF signal to a node. The second noise cancellation circuit is electrically connected to the follower circuit through the node and generates a reverse-phase noise to cancel the noise. The impedance matching circuit is electrically connected to the node, performs impedance matching, and outputs the RF signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:低雜訊放大電路</p>  
        <p type="p">102:放大電路</p>  
        <p type="p">104:第一雜訊消除電路</p>  
        <p type="p">106:追隨電路</p>  
        <p type="p">108:第二雜訊消除電路</p>  
        <p type="p">110:阻抗匹配電路</p>  
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:電壓</p>  
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;,C&lt;sub&gt;f&lt;/sub&gt;:電容</p>  
        <p type="p">L&lt;sub&gt;G1&lt;/sub&gt;,L&lt;sub&gt;s&lt;/sub&gt;:電感</p>  
        <p type="p">M&lt;sub&gt;1&lt;/sub&gt;:電晶體</p>  
        <p type="p">R&lt;sub&gt;f&lt;/sub&gt;:回授電阻</p>  
        <p type="p">V&lt;sub&gt;G1&lt;/sub&gt;:第一偏壓</p>  
        <p type="p">R&lt;sub&gt;G&lt;/sub&gt;:電阻</p>  
        <p type="p">L&lt;sub&gt;D1&lt;/sub&gt;,L&lt;sub&gt;D2&lt;/sub&gt;,L&lt;sub&gt;G2&lt;/sub&gt;:電感</p>  
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;,C&lt;sub&gt;3&lt;/sub&gt;:電容</p>  
        <p type="p">M&lt;sub&gt;2&lt;/sub&gt;:電晶體</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">C&lt;sub&gt;4&lt;/sub&gt;:電容</p>  
        <p type="p">M&lt;sub&gt;3&lt;/sub&gt;:電晶體</p>  
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;:電阻</p>  
        <p type="p">A:節點</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:電感</p>  
        <p type="p">M&lt;sub&gt;4&lt;/sub&gt;:電晶體</p>  
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;:電阻</p>  
        <p type="p">V&lt;sub&gt;G2&lt;/sub&gt;:第二偏壓</p>  
        <p type="p">C5,C6:電容</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:電感</p>  
        <p type="p">V&lt;sub&gt;out&lt;/sub&gt;:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="8" publication-number="202621521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有金屬柱的封裝晶片</chinese-title>  
        <english-title>PACKAGED CHIP WITH METAL PILLARS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="200601120260223B">H01Q1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢威光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEXAWAVE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢浩育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟駿逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊成發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHANG-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙振邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHEN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝晶片包括天線電路板、元件電路板，以及複數金屬柱。天線電路板設置複數天線單元。元件電路板設置於天線電路板的下方，且設置第一射頻前端電路。金屬柱耦接於天線電路板和元件電路板之間。金屬柱的垂直高度相等於天線電路板和元件電路板之間的垂直距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaged chip includes an antenna circuit board, a component circuit board, and a plurality of metal pillars. The antenna circuit board disposes a plurality of antenna units. The component circuit board is disposed under the antenna circuit board, and disposes a first RF front-end circuit. The metal pillars are coupled between the antenna circuit board and the component circuit board. A vertical height of the metal pillars is equal to a vertical distance between the antenna circuit board and the component circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝晶片</p>  
        <p type="p">102:天線電路板</p>  
        <p type="p">104:元件電路板</p>  
        <p type="p">106:金屬柱</p>  
        <p type="p">108:天線單元</p>  
        <p type="p">110:第一射頻前端電路</p>  
        <p type="p">112:第二射頻前端電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="9" publication-number="202621345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效率多功能整合型柔性鈣鈦礦光伏電池與矽光子傳輸模組</chinese-title>  
        <english-title>HIGH-EFFICIENCY MULTI-FUNCTIONAL INTEGRATED FLEXIBLE PEROVSKITE PHOTOVOLTAIC CELLS AND SILICON PHOTONIC TRANSMISSION MODULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250512B">H10K85/50</main-classification>  
        <further-classification edition="202301120250512B">H10K30/57</further-classification>  
        <further-classification edition="202301120250512B">H10K77/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞元科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLLARCHIP TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾棨斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHI-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">這種先進的鈣鈦礦光伏薄膜結構實現了50%的效率，整合了矽光子傳輸，為高效能太陽能發電和即時光通訊提供了多功能平台。此薄膜的結構包括專為增強光子吸收、高效電荷傳輸和熱穩定性而定制的層，同時將光子晶體直接嵌入量子點增強鈣鈦礦吸收層中。這種配置優化了光捕獲和波導，並得到矽光子波導和調製器的進一步支持，可實現高速資料傳輸。額外的熱電和熱管理層確保運作穩定性和能量回收。該技術非常適合需要發電和通訊功能的應用，例如智慧表面、物聯網網路和自主系統，為未來的能源和數據需求提供可持續、多功能的解決方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This advanced Perovskite-OPV film structure, achieving 50% efficiency, integrates silicon photonic transmission to provide a multifunctional platform for both high-efficiency solar power generation and real-time optical communication. The film’s structure includes layers tailored for enhanced photon absorption, efficient charge transport, and thermal stability, while embedding photonic crystals directly within a quantum dot-enhanced perovskite absorber layer. This configuration optimizes light trapping and wave guiding, further supported by silicon photonic waveguides and modulators that enable high-speed data transmission. Additional thermoelectric and heat management layers ensure operational stability and energy recovery. The technology is ideal for applications requiring both power generation and communication capabilities, such as smart surfaces, IoT networks, and autonomous systems, offering a sustainable, versatile solution for future energy and data demands.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1.&lt;b&gt;抗反射層&lt;/b&gt;:減少光線反射，增強光吸收</p>  
        <p type="p">2.&lt;b&gt;透明導電氧化層&lt;/b&gt;:傳導電流且保持透明，讓光線穿透</p>  
        <p type="p">3.&lt;b&gt;量子點增強鈣鈦礦吸收層，內嵌光子晶體&lt;/b&gt;:擴展光吸收範圍並提高效率</p>  
        <p type="p">4.&lt;b&gt;隧道結層&lt;/b&gt;:提供電荷轉移通道，防止再結合</p>  
        <p type="p">5.&lt;b&gt;矽光子吸收層&lt;/b&gt;:作為光子波導和調變器的基底</p>  
        <p type="p">6.&lt;b&gt;電子傳輸層，含表面電漿粒子&lt;/b&gt;:增強電子傳輸並提高光吸收</p>  
        <p type="p">7.&lt;b&gt;電洞傳輸層，含表面電漿粒子&lt;/b&gt;:優化電洞傳輸，降低損耗</p>  
        <p type="p">8.&lt;b&gt;矽光子波導與調變層&lt;/b&gt;:支援高速度數據傳輸</p>  
        <p type="p">9.&lt;b&gt;熱電材料層&lt;/b&gt;:熱能回收，維持熱穩定性</p>  
        <p type="p">10.&lt;b&gt;散熱層&lt;/b&gt;:高效散熱，防止過熱</p>  
        <p type="p">11.&lt;b&gt;底部電極層&lt;/b&gt;:收集並傳導電流，完成電路</p>  
        <p type="p">12.&lt;b&gt;矽光子接收器與光檢測層&lt;/b&gt;:將光信號轉換為電信號，用於數據接收</p>  
        <p type="p">13.&lt;b&gt;基材層&lt;/b&gt;:支撐整體結構，提供穩定基礎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="10" publication-number="202620424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物感測器及其製作方法</chinese-title>  
        <english-title>BIOSENSOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G01N27/416</main-classification>  
        <further-classification edition="200601120241204B">G01N27/327</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向前生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEAP BIOCHIP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN,CHIUN-JYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種生物感測器及其製作方法。生物感測器包括承載基板、第一絕緣層、第二絕緣層、第一導電線路層、第二導電線路層、多個第一導電貫穿層、多個第二導電貫穿層、多個第一裸露電極以及多個第二裸露電極。多個第一導電貫穿層穿過第二絕緣層。多個第二導電貫穿層穿過第二絕緣層。每一個第一裸露電極電性連接於相對應的第一導電貫穿層。每一個第二裸露電極電性連接於相對應的第二導電貫穿層。藉此，第一裸露電極可以透過相對應的第一導電貫穿層以電性連接於第一導電線路層且與第一導電線路層相距一第一預定距離，並且使得第二裸露電極可以透過相對應的第二導電貫穿層以電性連接於第二導電線路層且與第二導電線路層相距一第二預定距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a biosensor and a method of manufacturing the same. The biosensor includes a carrier substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive penetration layers, a plurality of second conductive penetration layers, a plurality of first exposed electrodes and a plurality of second exposed electrodes. The plurality of first conductive penetration layers pass through the second insulating layer. The plurality of second conductive penetration layers pass through the second insulating layer. Each first exposed electrode is electrically connected to the corresponding first conductive penetration layer. Each second exposed electrode is electrically connected to the corresponding second conductive penetration layer. Thereby, the first exposed electrode can be electrically connected to the first conductive circuit layer through the corresponding first conductive penetration layer and be separated from the first conductive circuit layer by a first predetermined distance, and the second exposed electrode can be electrically connected to the second conductive circuit layer through the corresponding second conductive penetration layer and be separated from the second conductive circuit layer by a second predetermined distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:生物感測器</p>  
        <p type="p">2B:第二絕緣層</p>  
        <p type="p">3A:第一導電線路層</p>  
        <p type="p">31A:第一延伸部</p>  
        <p type="p">32A:第一線路部</p>  
        <p type="p">3B:第二導電線路層</p>  
        <p type="p">31B:第二延伸部</p>  
        <p type="p">32B:第二線路部</p>  
        <p type="p">3C:第三導電線路層</p>  
        <p type="p">4A:第一導電貫穿層</p>  
        <p type="p">4B:第二導電貫穿層</p>  
        <p type="p">4C:第三導電貫穿層</p>  
        <p type="p">5A:第一裸露電極</p>  
        <p type="p">5B:第二裸露電極</p>  
        <p type="p">5C:第三裸露電極</p>  
        <p type="p">V1:第一通孔陣列</p>  
        <p type="p">V2:第二通孔陣列</p>  
        <p type="p">E1:第一電極陣列</p>  
        <p type="p">E2:第二電極陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="11" publication-number="202621182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>終端裝置行為塑模方法</chinese-title>  
        <english-title>TERMINAL DEVICE BEHAVIOR MODELING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250512B">H04W88/02</main-classification>  
        <further-classification edition="202101120250512B">H04W12/121</further-classification>  
        <further-classification edition="202101120250512B">H04W12/30</further-classification>  
        <further-classification edition="201901120250512B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱勁翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪志軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃川源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUAN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡雨龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種終端裝置行為塑模方法，包括：藉由伺服器蒐集終端裝置的串流資料，並對串流資料進行預處理以產生特徵資料集；藉由伺服器針對已預處理串流資料進行正規化，確認分群模型所需的模型參數；基於特徵資料集以及模型參數建構分群模型，藉由伺服器透過分群模型輸出包含疑似異常終端的離群清單；藉由伺服器基於異常規則比對離群清單以判定離群清單中的疑似異常終端是否為異常終端；以及響應於判定疑似異常終端為異常終端，藉由伺服器將異常終端分群至異常名單中，響應於判定疑似異常終端不為異常終端，藉由伺服器更新該分群模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A terminal device behavior modeling method includes collecting streaming data of the terminal device through a server, and preprocessing the streaming data to generate a feature data set; and performing regular processing on the preprocessed streaming data through the server, and confirming model parameters required for a grouping model; constructing the grouping model based on the feature data set and the model parameters through the server, and outputting an outlier list containing suspected abnormal terminals through the grouping model; comparing the outliers based with anomaly rules to determine whether a suspected abnormal terminal in the outlier list is an abnormal terminal through the server; and the server classifies the abnormal terminal into an abnormal list in response to determining that the suspected abnormal terminal is an abnormal terminal, and updating the group model through the server in response to determining that the suspected abnormal terminal is not the abnormal terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:終端裝置行為塑模方法</p>  
        <p type="p">S100~S700:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="12" publication-number="202621256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁阻式隨機存取記憶體及其製作方法</chinese-title>  
        <english-title>MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B61/00</main-classification>  
        <further-classification edition="202301120241202B">H10N50/01</further-classification>  
        <further-classification edition="202301120241202B">H10N50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慧琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許清樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁宸毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory, MRAM)元件的方法，其主要先提供一基底包含一MRAM區域以及一邏輯區域，然後形成第一金屬間介電層於基底上，利用第一圖案化遮罩去除該第一金屬間介電層以形成第一接觸洞開口於MRAM區域以及第二接觸洞開口於邏輯區域，形成一金屬氮化物層於第一接觸洞開口以及第二接觸洞開口內，去除邏輯區域之部分金屬氮化物層以及部分第一金屬間介電層以形成一溝渠開口，再形成一金屬層於第一接觸洞開口、第二接觸洞開口以及溝渠開口內以於MRAM區域形成第一金屬內連線以及於邏輯區域形成第二金屬內連線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a magnetoresistive random access memory (MRAM) device includes first providing a substrate having a MRAM region and a logic region, forming a first inter-metal dielectric (IMD) layer on the substrate, using a first patterned mask to remove the first IMD layer for forming a first via opening on the MRAM region and a second via opening on the logic region, forming a metal nitride layer in the first via opening and the second via opening, removing part of the metal nitride layer and part of the first IMD layer on the logic region for forming a trench opening, and forming a metal layer in the first via opening, the second via opening, and the trench opening for forming a first metal interconnection on the MRAM region and a second metal interconnection on the logic region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:MRAM區域</p>  
        <p type="p">16:邏輯區域</p>  
        <p type="p">18:層間介電層</p>  
        <p type="p">20:金屬內連線結構</p>  
        <p type="p">22:金屬內連線結構</p>  
        <p type="p">24:金屬間介電層</p>  
        <p type="p">26:金屬內連線</p>  
        <p type="p">28:停止層</p>  
        <p type="p">30:金屬間介電層</p>  
        <p type="p">32:金屬內連線</p>  
        <p type="p">34:阻障層</p>  
        <p type="p">36:金屬層</p>  
        <p type="p">42:下電極</p>  
        <p type="p">44:固定層</p>  
        <p type="p">46:阻障層</p>  
        <p type="p">48:自由層</p>  
        <p type="p">50:上電極</p>  
        <p type="p">52:MTJ</p>  
        <p type="p">56:側壁子</p>  
        <p type="p">58:金屬間介電層</p>  
        <p type="p">60:阻障層</p>  
        <p type="p">62:金屬層</p>  
        <p type="p">64:金屬內連線</p>  
        <p type="p">66:停止層</p>  
        <p type="p">72:停止層</p>  
        <p type="p">74:停止層</p>  
        <p type="p">76:金屬間介電層</p>  
        <p type="p">80:金屬氮化物層</p>  
        <p type="p">104:阻障層</p>  
        <p type="p">106:金屬層</p>  
        <p type="p">108:金屬內連線</p>  
        <p type="p">110:接觸洞導體</p>  
        <p type="p">112:接觸洞導體</p>  
        <p type="p">114:溝渠導體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="13" publication-number="202619873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合纖維布料的回收造粒方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">B29B17/04</main-classification>  
        <further-classification edition="200601120241205B">B29B9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弘裕企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONMYUE ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉博宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合纖維布料的回收造粒方法，包含下列步驟：獲取複數複合纖維布料，該些複合纖維布料由複數複合紗線製成；粉碎該些複合纖維布料，取得由該些複合紗線所裁切而成的複數複合纖維碎料；將該些複合纖維碎料與複數塑膠粒料投入一混練機中熔融混練，形成一混合材料；對該混合材料進行造粒加工，從而得到具有商業價值的複數母粒，該些母粒能依據產品需求透過多種加工手段將該些母粒再製成品；該複合纖維布料的回收造粒方法不僅減少回收過程中的污染，還能將該些複合纖維加工成具有商業價值的再製品，實現回收利用之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="14" publication-number="202620600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧滑鼠、智慧鍵盤及智慧觸控板</chinese-title>  
        <english-title>SMART MOUSE, SMART KEYBOARD AND SMART TOUCHPAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250204B">G06F3/033</main-classification>  
        <further-classification edition="200601120250204B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佩儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧滑鼠、智慧鍵盤及智慧觸控板。智慧滑鼠包括一移動感測模組、一訊號攔截單元、一推論模型及一控制單元。移動感測模組用以感測智慧滑鼠的移動，以輸出數個移動訊號。訊號攔截單元用以攔截這些移動訊號。推論模型用以至少依據這些移動訊號，推論出一主機正在運行之一應用程式的一應用程式類型。控制單元用以依據應用程式類型調整智慧滑鼠之至少一參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A smart mouse, a smart keyboard and a smart touchpad are provided. The smart mouse includes a motion sensing module, a signal interception unit, an inference model and a control unit. The motion sensing module is used to sense a movement of the smart mouse to output a plurality of movement signals. The signal interception unit is used to intercept the movement signals. The inference model is used to infer an application type of an application being run by a host according to the movement signals. The control unit is used to adjust a parameter of the smart mouse according to the application type.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:智慧滑鼠</p>  
        <p type="p">110:移動感測模組</p>  
        <p type="p">120:滾輪模組</p>  
        <p type="p">130:按鍵模組</p>  
        <p type="p">140:訊號攔截單元</p>  
        <p type="p">150:推論模型</p>  
        <p type="p">160:控制單元</p>  
        <p type="p">400:主機</p>  
        <p type="p">AP4:應用程式</p>  
        <p type="p">S11:移動訊號</p>  
        <p type="p">S12:滾動訊號</p>  
        <p type="p">S13:按壓訊號</p>  
        <p type="p">TY4:應用程式類型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="15" publication-number="202621122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器、電子裝置及其遊戲影片的處理方法</chinese-title>  
        <english-title>SERVER, ELECTRONIC DEVICE AND GAME VIDEO PROCESSING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241204B">H04N21/2347</main-classification>  
        <further-classification edition="201301120241204B">G06F21/64</further-classification>  
        <further-classification edition="200601120241204B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服器、電子裝置及其遊戲影片的處理方法。電子裝置之遊戲影片的處理方法包括以下步驟。錄製一遊戲影片，並記錄遊戲影片中的數個遊戲事件。將遊戲影片之這些遊戲事件編輯成一遊戲歷程。將遊戲影片之遊戲歷程及一相關資訊儲存為一影片資訊。建立遊戲影片與影片資訊之一防偽標籤。依據一篩選設定檔，判斷遊戲影片是否符合至少一篩選條件。若遊戲影片符合至少一篩選條件，則判斷電子裝置是否取得一影片上傳許可令牌。若電子裝置取得影片上傳許可令牌，則將遊戲影片、影片資訊及防偽標籤上傳至伺服器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server, an electronic device and a game video processing method thereof are provided. The game video processing method of the electronic device includes the following steps. A game video is recorded and a plurality of game events in the game video are recorded. The game events of the game video are edited into a game history. The game history and a related information of the game video are stored as a video information. An anti-counterfeiting label for the game video and the video information is created. Whether the game video meets at least one filtering condition is determined according to a filtering profile. If the game video meets the at least one filtering condition, whether the electronic device obtains a video upload permission token is determined. If the electronic device obtains the video upload permission token, the game video, the video information and the anti-counterfeiting label are uploaded to the server.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102,S103,S104,S105,S106,S107,S108,S109,S110:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="16" publication-number="202621104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊會議之立體顯示方法及視訊會議系統</chinese-title>  
        <english-title>THREE-DIMENSIONAL DISPLAY METHOD FOR VIDEO CONFERENCE AND VIDEO CONFERENCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04N7/15</main-classification>  
        <further-classification edition="201801120250203B">H04N13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李季剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHI-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和　佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTERO CLARES, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡沛陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視訊會議之立體顯示方法及視訊會議系統。視訊會議之立體顯示方法包括以下步驟。一第一電子裝置生成一影像。第一電子裝置於影像編碼入一隱藏浮水印。第一電子裝置傳輸影像至一第二電子裝置。第二電子裝置將影像顯示於一顯示畫面之一視窗。第二電子裝置於顯示畫面搜尋一矩形框。第二電子裝置判斷於矩形框是否解碼出隱藏浮水印。若於矩形框解碼出隱藏浮水印，則第二電子裝置對矩形框之內容進行立體成像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional display method for video conference and the video conference system are provided. The three-dimensional display method includes the following steps. A first electronic device generates an image. The first electronic device encodes a hidden watermark in the image. The first electronic device transmits the image to a second electronic device. The second electronic device displays the image in a window of a display screen. The second electronic device searches for a rectangular frame on the display screen. The second electronic device determines whether the hidden watermark is decoded in the rectangular frame. If the hidden watermark is decoded in the rectangular frame, the second electronic device performs a stereoscopic imaging on the content of the rectangular frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一電子裝置</p>  
        <p type="p">200:第二電子裝置</p>  
        <p type="p">S110,S130,S140,S210,S220,S230,S240,250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="17" publication-number="202621105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊會議系統及應用其之立體建模方法</chinese-title>  
        <english-title>VIDEO CONFERENCE SYSTEM AND THREE-DIMENSIONAL MODELING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04N7/15</main-classification>  
        <further-classification edition="201801120250203B">H04N13/20</further-classification>  
        <further-classification edition="201801120250203B">H04N13/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李季剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHI-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐文正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傑生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和　佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTERO CLARES, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視訊會議系統及應用其之立體建模方法。視訊會議之立體建模方法包括以下步驟。一移動式影像擷取裝置對一物體拍攝數張相片，並記錄各相片對應之一建模資訊。移動式影像擷取裝置傳輸相片及建模資訊至一第一電子裝置。第一電子裝置將各建模資訊以一隱藏浮水印之方式編碼入各相片。第一電子裝置傳遞具有隱藏浮水印之相片至一第二電子裝置。第二電子裝置接收具有隱藏浮水印之相片。第二電子裝置對各相片之各隱藏浮水印解碼出各建模資訊。第二電子裝置依據相片及建模資訊，建立一立體模型。第二電子裝置展示立體模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A video conference system and a three-dimensional modeling method using the same are provided. The three-dimensional modeling method of the video conferencing includes the following steps. A portable image capture device obtains a plurality of photos of an object and records a plurality of modeling information corresponding to the photos. The portable image capture device transmits the photos and the modeling information to a first electronic device. The first electronic device encodes each of the modeling information into each of the photos through a hidden watermark. The first electronic device transmits the photos with the hidden watermarks to a second electronic device. The second electronic device receives the photos with the hidden watermarks. The second electronic device decodes each of the hidden watermarks of each of the photos to obtain each of a plurality of modeling information. The second electronic device creates a three-dimensional model according to the photos and modeling information. The second electronic device displays the three-dimensional model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一電子裝置</p>  
        <p type="p">200:第二電子裝置</p>  
        <p type="p">700:移動式影像擷取裝置</p>  
        <p type="p">S110,S120,S130,S700,S710:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="18" publication-number="202619811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續式廢棄尿布回收系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241130B">B09B3/00</main-classification>  
        <further-classification edition="202201120241130B">B09B3/35</further-classification>  
        <further-classification edition="200601120241130B">B29B17/00</further-classification>  
        <further-classification edition="200601120241130B">A61F13/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菁鉐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝維洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李榮唐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種連續式廢棄尿布回收系統，主要包含粉碎裝置、分離裝置及過濾裝置。該系統可將廢棄尿布回收處理，並將處理過的尿布再生利用者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:粉碎裝置</p>  
        <p type="p">20:分離裝置</p>  
        <p type="p">21:料筒</p>  
        <p type="p">211:孔洞</p>  
        <p type="p">22:噴灑管路</p>  
        <p type="p">23:承接盤</p>  
        <p type="p">30:過濾裝置</p>  
        <p type="p">31:入水端</p>  
        <p type="p">32:出水端</p>  
        <p type="p">33:過濾網層</p>  
        <p type="p">A:輸送帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="19" publication-number="202620329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141846</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支撐裝置及顯示設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">F16M11/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商冠捷投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支撐裝置，包含承載機構及沿左右方向反向設置二支撐腳。該承載架具有兩個沿左右方向反向設置的定位面。每一支撐腳組裝於定位面其中之一時定位在第一角度位置，每一支撐腳組裝於定位面其中另一時定位在與第一角度位置相異的第二角度位置。當支撐腳各自在第一角度位置時，支撐腳將承載架支撐在第一高度位置。當支撐腳各自在第二角度位置時，支撐腳將承載架支撐在第二高度位置。透過支撐腳設置於第一角度位置或第二角度位置，將承載架有第一高度位置或第二高度位置的不同高度變化，方便依據使用者的需求調整至所需的高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:承載機構</p>  
        <p type="p">41:承載架</p>  
        <p type="p">4111:平面部</p>  
        <p type="p">4112:斜面部</p>  
        <p type="p">412:前端</p>  
        <p type="p">413:後端</p>  
        <p type="p">414:螺孔</p>  
        <p type="p">415:第一卡合部</p>  
        <p type="p">42:螺絲</p>  
        <p type="p">5:支撐腳</p>  
        <p type="p">51:支撐面</p>  
        <p type="p">511:第一支撐面</p>  
        <p type="p">512:第二支撐面</p>  
        <p type="p">52:第二卡合部</p>  
        <p type="p">53:穿孔</p>  
        <p type="p">531:小孔部</p>  
        <p type="p">532:大孔部</p>  
        <p type="p">533:擋止肩面</p>  
        <p type="p">534:第一擋止面部</p>  
        <p type="p">535:第二擋止面部</p>  
        <p type="p">54:緩衝墊</p>  
        <p type="p">55:止滑墊</p>  
        <p type="p">Y:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="20" publication-number="202621103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有影像旋轉功能的投影裝置</chinese-title>  
        <english-title>PROJECTION DEVICE WITH IMAGE ROTATION FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H04N5/74</main-classification>  
        <further-classification edition="200601120250108B">G03B21/14</further-classification>  
        <further-classification edition="200601120250108B">G06F9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明基電通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENQ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施嘉南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIA-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有影像旋轉功能的投影裝置，其包含有一投影模組、一偵測器以及一運算控制器。該投影模組用來輸出一投射影像。該偵測器包含一偵測面，用來取得一目標物件相對於該偵測面的位置資訊。該運算控制器電連接該投影模組與該偵測器。該運算控制器係根據該位置資訊計算該目標物件在一第一相對位置與一第二相對位置相對於該偵測面的一角度變化量，並產生一控制指令至該投影模組利用該角度變化量調整該投射影像之一旋轉方位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A projection device with an image rotation function includes a projection module, a detector and an operation processor. The projection module emits a projection image. The detector has a detection surface used to acquire a position datum of a target object relative to the detection surface. The operation processor is electrically connected to the projection module and the detector. The operation processor computes angle change of the target object relative to the detection surface between a first relative position and a second relative position in accordance with the position datum, so as to generate a control command towards the projection module for adjusting a rotation direction of the projection image via the angle change.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:投影裝置</p>  
        <p type="p">12:投影模組</p>  
        <p type="p">14:偵測器</p>  
        <p type="p">16:運算控制器</p>  
        <p type="p">18:角動量感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="21" publication-number="202620212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含鐵合金靶材及其製法</chinese-title>  
        <english-title>FERROUS ALLOY SPUTTERING TARGET AND METHOD OF PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241108B">C22C27/04</main-classification>  
        <further-classification edition="202301120241108B">C22C1/04</further-classification>  
        <further-classification edition="200601120241108B">C23C14/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光洋應用材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLAR APPLIED MATERIALS TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳衍任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭惠文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作關於一種含鐵合金靶材，其包含鐵、鉬、第一添加金屬（鈦、銅、鍺或其組合）及/或第二添加金屬（鈷、錳、銀、金、鈀、鉑、銠或其組合）；以含鐵合金靶材之原子總數為基準，鐵含量為25 at%至55 at%，且其鐵鉬合金球形晶粒的平均粒徑小於80微米。此外，本創作另關於含鐵合金靶材之製法，其包括選用D95小於125微米的鐵鉬合金霧化粉末為原料，並經混粉、燒結後所製得。藉由前揭技術手段，本創作能具體減少含鐵合金靶材的金相微孔洞數量，提升靶材導電均勻性、降低濺鍍製程中發生異常電弧放電的次數，全面提升含鐵合金靶材的品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a ferrous alloy sputtering target, containing iron (Fe), molybdenum (Mo), a first additive metal (Ti, Cu, Ge, or any combinations thereof) and/or a second additive metal (Co, Mn, Ag, Au, Pd, Pt, Rh, or any combinations thereof). The ferrous alloy sputtering target contains iron in an amount of 25 at% to 55 at% based on the total atoms of the target and has spherical Fe-Mo alloy grains having an average particle size less than 80 μm. Provided is also a method of preparing the ferrous alloy sputtering target, which is prepared by adopting Fe-Mo alloy atomized powder with a D95 of less than 125 μm as raw material, mixing raw material powders, and sintering steps. The foresaid technical means can reduce the number of metallurgical micropores in the target, improve the conductivity uniformity of the target, and decrease the number of arcing during sputtering, thereby comprehensively improving the quality of the ferrous alloy sputtering target.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="22" publication-number="202620482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光耦合校正方法、系統與紀錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">G02B6/26</main-classification>  
        <further-classification edition="200601120250108B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>思衛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JETEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇恬鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, TIAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光耦合校正方法，用於透過奈米級驅動設備來校正光纖陣列與待測物之間的相對位置，光耦合校正方法適用於在電子裝置上執行，光耦合校正方法包含：將奈米級驅動設備的旋轉中心設定於鄰近待測物；搜尋最佳耦光點；沿第一座標軸旋轉，收集多筆第一校正資料；根據多筆第一校正資料，計算第一旋轉中心偏差值；當第一旋轉中心偏差值大於第一閾值，校正旋轉中心的設定值；沿第二座標軸旋轉，收集多筆第二校正資料；根據多筆第二校正資料，計算第二旋轉中心偏差值；當第二旋轉中心偏差值大於第二閾值，校正旋轉中心的設定值；以及根據由第一旋轉中心偏差值及第二旋轉中心偏差值所校正的該旋轉中心的設定值，使旋轉中心校正於待測物上。光耦合校正方法適用於使奈米級驅動設備的旋轉中心校正於待測物上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101-S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="23" publication-number="202620655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有擴充功能的PCIe通訊模組</chinese-title>  
        <english-title>PCIE COMMUNICATION MODULE WITH EXPANDED FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F13/38</main-classification>  
        <further-classification edition="200601120250203B">G06G1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曉鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIAO CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張塘欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TAN HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張祐銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃渝詳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有擴充功能的PCIe通訊模組包括PCIe主卡、擴充卡及通訊連接模組，且PCIe主卡包括處理器、第一通訊介面、邊緣連接器及鄰近該處理器的第一連接器。擴充卡包括第二通訊介面，且第二通訊介面、通訊連接模組及第一連接器形成高速通訊訊號通路。高速通訊訊號通路被配置為將第二通訊介面所提供的通訊訊號傳輸至處理器，且處理器將通訊訊號進行處理後，通過邊緣連接器傳輸至外部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A PCIe communication module with expanded functions includes a main PCIe card, an expansion card and a coaxial connecting module, and the main PCIe card includes a processor, a first Communication Interface, an edge connector and a first connector nearby the processor. The expansion card includes a second communication interface, and the second communication interface, the coaxial connecting module and the first connector are collectively forming a high-speed communication signal path. The high-speed communication signal path is configured to transmit a communication signal provided by the second communication interface to the processor, and the processor transmit the communication signal to outside via the edge connector after a signal processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:PCIe通訊模組</p>  
        <p type="p">12:第一電路板</p>  
        <p type="p">14:處理器</p>  
        <p type="p">16:第一通訊介面</p>  
        <p type="p">18:邊緣連接器</p>  
        <p type="p">20:第一連接器</p>  
        <p type="p">3:通訊連接模組</p>  
        <p type="p">32:電纜</p>  
        <p type="p">34:第二連接器</p>  
        <p type="p">36:連接組件</p>  
        <p type="p">362:限位件</p>  
        <p type="p">L1~Ln:連接線</p>  
        <p type="p">4:擴充卡</p>  
        <p type="p">42:第二電路板</p>  
        <p type="p">44:第二通訊介面</p>  
        <p type="p">442A:電源接腳</p>  
        <p type="p">442B:訊號接腳</p>  
        <p type="p">200-1:第一外部裝置</p>  
        <p type="p">200-2:第二外部裝置</p>  
        <p type="p">200-3:第三外部裝置</p>  
        <p type="p">Sc1:第一通訊訊號</p>  
        <p type="p">Sc2:第二通訊訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="24" publication-number="202620508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭戴顯示系統與其顯示虛擬物件的方法</chinese-title>  
        <english-title>HEAD MOUNTED DISPLAY SYSTEM AND DISPLAY METHOD FOR DISPLAY VIRTUAL OBJECT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G02B27/01</main-classification>  
        <further-classification edition="200601120250203B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡議元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, I-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹淩帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, LING-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭思華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SZU-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種頭戴顯示系統與其顯示虛擬物件的方法。由外部顯示裝置顯示多個預設標記。由一頭戴顯示裝置上的影像擷取裝置朝外部顯示裝置擷取一環境影像。環境影像包括分別對應於多個預設標記的多個標記物件。根據環境影像中的多個標記物件，決定外部顯示裝置的實際螢幕尺寸。根據外部顯示裝置的實際螢幕尺寸，透過頭戴顯示裝置顯示虛擬物件。實際螢幕尺寸用以決定虛擬物件的顯示尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head mounted display system and a display method for display virtual object thereof are provided. A plurality of preset markers are displayed by an external display device. The image capturing device on a head mounted display device captures an environment image towards the external display device. The environment image includes a plurality of marker objects respectively corresponding to the preset markers. An actual screen size of the external display device is determined based on the marker objects in the environment image. A virtual object is display through the head-mounted display device according to the actual screen size of the external display device. The actual screen size is used to determine the display size of the virtual object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="25" publication-number="202620004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陶瓷複合材料與瓷嘴</chinese-title>  
        <english-title>CERAMIC COMPOSITE MATERIAL AND CAPILLARY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C04B35/584</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202501120260223B">H10H20/857</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游懷真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUAI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐訓慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSUN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">陶瓷複合材料係由粉體燒結而成，其中粉體包括氮化矽、碳化矽、第一金屬氧化物、與第二金屬氧化物，且氮化矽與該碳化矽的重量比例為100:0.5至100:12。第一金屬氧化物可為氧化鋁，且第二金屬氧化物可為氧化釔。另一方面，第一金屬氧化物可為氧化鎂，且第二金屬氧化物可為氧化鈰。此陶瓷複合材料可用於瓷嘴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ceramic composite material is formed by sintering powder, and the powder includes silicon nitride, silicon carbide, first metal oxide, and second metal oxide. The silicon nitride and the silicon carbide have a weight ratio of 100:0.5 to 100:12. The first metal oxide is aluminum oxide, and the second metal oxide is yttrium oxide. On the other hand, the first metal oxide is magnesium oxide, and the second metal oxide is cerium oxide. The ceramic composite material can be used as a capillary.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="26" publication-number="202619815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將鋁廢料壓固封閉加熱擠出鋁型材的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">B21C23/01</main-classification>  
        <further-classification edition="200601120241129B">B21C23/02</further-classification>  
        <further-classification edition="200601120241129B">B21C29/00</further-classification>  
        <further-classification edition="200601120241129B">B21C31/00</further-classification>  
        <further-classification edition="202201120241129B">B09B3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常琪鋁業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種將鋁廢料壓固封閉加熱擠出鋁型材的製造方法，其包含有：將鋁廢料回收，該鋁廢料係為乾淨無雜質；將該鋁廢料置入擠壓機壓固成為鋁胚，該擠壓機係在250kg/cm &lt;sup&gt;2&lt;/sup&gt;以上的壓力擠壓，該鋁胚係為密合一體成型圓柱狀；將該鋁胚置入加熱爐封閉加熱升溫，該加熱爐溫度係為460˚C〜510˚C，以提高該鋁胚可塑性和降低形變阻力；將升溫後的該鋁胚置入擠型機擠出鋁型材，該鋁型材係為預定形狀的棒、管、片或線；如此，該鋁廢料壓固封閉加熱擠出鋁型材的過程，不會有高溫熔解產生的污煙，可減少碳排放及製程，不僅環保節能更可節省工時及降低成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="27" publication-number="202620457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車用模組化雷達裝置</chinese-title>  
        <english-title>AUTOMOTIVE MODULAR RADAR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241128B">G01S13/931</main-classification>  
        <further-classification edition="200601120241128B">B60R11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智易科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹益鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭信郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車用模組化雷達裝置，包括支架模組及雷達模組。支架模組包括支架，支架包括結合板及固定板，結合板用以固定於車輛，固定板的底邊設置於結合板，固定板的底邊與側邊之間具有角度，角度大於0度且小於90度。雷達模組包括一雷達，雷達包括外殼、電路板、天線模組及處理單元，外殼的一側固定於固定板的側邊，電路板設置於外殼中，天線模組設置於電路板上，處理單元設置於該電路板上並且電性連接天線模組。外殼包覆電路板、天線模組及處理單元，以隔絕外界水氣及灰塵。藉此，本發明能夠藉由更換支架模組調整雷達模組的角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automotive modular radar device includes a bracket module and a radar module. The bracket module includes a bracket. The bracket includes a connected plate and a fixed plate. The connected plate is used to be fixed to the vehicle. The bottom edge of the fixed plate is disposed on the connected plate. An angle is formed between the bottom edge and the side of the fixed plate, and the angle is greater than 0 degrees and less than 90 degrees. The radar module includes a radar. The radar includes a casing, a circuit board, an antenna module and a processing unit. One side of the casing is fixed on the side of the fixed plate. The circuit board is disposed in the casing. The antenna module is disposed on the circuit board. The processing unit is disposed on the circuit board and electrically connected to the antenna module. The casing covers the circuit board, antenna module and processing unit to isolate external moisture and dust. Such that, the present invention can adjust the angle of the radar module by replacing the bracket module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支架模組</p>  
        <p type="p">11:第一支架</p>  
        <p type="p">111:結合板</p>  
        <p type="p">112:固定板</p>  
        <p type="p">1121:底邊</p>  
        <p type="p">1122:第一側邊</p>  
        <p type="p">1123:第二側邊</p>  
        <p type="p">114:緊固件</p>  
        <p type="p">20:雷達模組</p>  
        <p type="p">21:第一雷達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="28" publication-number="202619693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調角度的睡眠呼吸口腔矯正器</chinese-title>  
        <english-title>MANDIBULAR ADVANCEMENT DEVICE WITH ADJUSTABLE ANGLE FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61F5/56</main-classification>  
        <further-classification edition="200601120241130B">A61M16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝殼生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARESMILE BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈瑞祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, JUI HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭元傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUAN CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係一種可調角度的睡眠呼吸口腔矯正器，包含下牙套及上牙套。下牙套包含第一本體及自第一本體凸伸的一對翼片，該對翼片分別設置有樞轉孔。上牙套包含第二本體及凸設在第二本體二側面的一對凸塊；其中，上牙套透過凸塊穿置翼片的樞轉孔而能夠相對下牙套作轉動。藉此達到調整上牙套及下牙套之間的咬合角度的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mandibular advancement device includes a lower brace and an upper brace. The lower brace includes a first body and a pair of fins protruding from the first body. A pivot hole is defined on each of the pair of wings. The upper braces include a second body and a pair of bumps protruding from two sides of the second body. The upper brace rotates relative to the lower brace through the bumps inserting in the pivot holes of the wings. Thus, the angle between the upper brace and lower brace may be adjusted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可調角度的睡眠呼吸口腔矯正器</p>  
        <p type="p">10:下牙套</p>  
        <p type="p">11:第一本體</p>  
        <p type="p">12:翼片</p>  
        <p type="p">120:樞轉孔</p>  
        <p type="p">121:根部</p>  
        <p type="p">122:頭部</p>  
        <p type="p">123:圓弧面</p>  
        <p type="p">20:上牙套</p>  
        <p type="p">21:第二本體</p>  
        <p type="p">22:凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="29" publication-number="202619765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數位握力訓練系統</chinese-title>  
        <english-title>DIGITAL GRIP STRENGTH TRAINING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A63B23/16</main-classification>  
        <further-classification edition="200601120241130B">A63B24/00</further-classification>  
        <further-classification edition="200601120241130B">A63B71/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLEGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳百薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PAI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種數位握力訓練系統，其包含：接觸式感應裝置及終控裝置，接觸式感應裝置具有設置於握力訓練器之感壓模組，使用者操控握力訓練器時，感壓模組依據握力強度及頻率產生握力訊號；終控裝置搭載應用程式，應用程式存有自適化參數表及複數互動遊戲，自適化參數表具有對應不同互動遊戲之握力強度範圍值及握力頻率範圍值，應用程式處理握力訊號並與自適化參數表比對，以獲取匹配之互動遊戲，使用者依據顯示之互動遊戲持續操控握力訓練器，當握力訊號與當前對應之握力強度範圍值或握力頻率值不同時，將根據自適化參數表調整互動遊戲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a digital grip strength training system that includes: a contact sensing device and a terminal control device. The contact sensing device has a pressure-sensing module installed in a grip strength trainer. When a user operates the grip strength trainer, the pressure-sensing module generates grip strength signals based on grip strength intensity and frequency. The terminal control device is equipped with an application that contains an adaptive parameter table and multiple interactive games. The adaptive parameter table includes grip strength range values and grip strength frequency range values corresponding to different interactive games. The application processes the grip strength signals and compares them with the adaptive parameter table to obtain matching interactive games. The user continues to operate the grip strength trainer according to the displayed interactive game. When the grip strength signal differs from the currently corresponding grip strength range value or grip strength frequency value, the interactive game will be adjusted based on the adaptive parameter table</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:數位握力訓練系統</p>  
        <p type="p">10:接觸式感應裝置</p>  
        <p type="p">11:感壓模組</p>  
        <p type="p">12:處理模組</p>  
        <p type="p">13:電源模組</p>  
        <p type="p">20:終控裝置</p>  
        <p type="p">21:應用程式</p>  
        <p type="p">22:互動模組</p>  
        <p type="p">221:互動控制單元</p>  
        <p type="p">222:關卡控制單元</p>  
        <p type="p">223:內容生成單元</p>  
        <p type="p">224:邏輯處理單元</p>  
        <p type="p">23:資料模組</p>  
        <p type="p">231:個人化單元</p>  
        <p type="p">232:展示單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="30" publication-number="202619696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩滾輪的射出成形方法</chinese-title>  
        <english-title>INJECTION MOLDING METHOD FOR A MASSAGE ROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61H15/00</main-classification>  
        <further-classification edition="200601120241130B">A61H9/00</further-classification>  
        <further-classification edition="200601120241130B">A61H37/00</further-classification>  
        <further-classification edition="200601120241130B">B29C45/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>允揚工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN YANG INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種按摩滾輪的射出成形方法，其包括下列步驟：提供一中空軸管；將中空軸管放置於一射出成形裝置之一模具內，中空軸管與模具間具有一成形空間；以及將一成形材料沿垂直於中空軸管之一軸線方向朝成形空間注射，使中空軸管的外周緣成形一包覆層，以製作出按摩滾輪。藉此方法能夠減少成品的表面結合線和毛邊產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides an injection molding method for a massage roller, which includes the following steps: providing a hollow shaft tube; placing the hollow shaft tube inside a mold of an injection molding device, where there is a forming space between the hollow shaft tube and the mold; and injecting a molding material into the forming space in a direction perpendicular to an axis of the hollow shaft tube, forming an encapsulation layer around the outer periphery of the hollow shaft tube to produce the massage roller. This method can reduce the formation of surface parting lines and flash on the finished product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="31" publication-number="202619927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合式自行車座墊</chinese-title>  
        <english-title>COMBINED BICYCLE SEAT CUSHION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">B62J1/02</main-classification>  
        <further-classification edition="202001120241130B">B62J9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鋐光實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VP COMPONENTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種組合式自行車座墊，其包括一基座、一表層件及一定位件。基座具有一頂部及一邊緣繞設於頂部，邊緣內側具有一組接部；表層件具有一座面及一自座面周緣向下延伸的包覆部，座面設於頂部上，包覆部包覆住邊緣及組接部；定位件以可拆卸方式安裝在組接部，以抑制包覆部外翻脫離組接部。藉此，本揭露方便使用者進行更換維修，對於損壞部分亦易於回收處理，減少環保問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a combined bicycle seat cushion, which includes a base, a surface layer, and a positioning component. The base has a top portion and an edge surrounding the top portion, with a coupling section on the inner side of the edge. The surface layer has a seating surface and a covering portion that extends downward from the periphery of the seating surface. The seating surface is positioned on the top portion, and the covering portion wraps around the edge and the coupling section. The positioning component is detachably installed on the coupling section to prevent the covering portion from flipping outward and detaching from the coupling section. Thus, this disclosure facilitates easy replacement and repair for users, and the damaged parts are easy to recycle, reducing environmental issues.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:組合式自行車座墊</p>  
        <p type="p">10:基座</p>  
        <p type="p">101:插槽</p>  
        <p type="p">12:底部</p>  
        <p type="p">121:內環槽</p>  
        <p type="p">13:邊緣</p>  
        <p type="p">14:組接部</p>  
        <p type="p">15:第一貫穿孔</p>  
        <p type="p">20:表層件</p>  
        <p type="p">21:座面</p>  
        <p type="p">22:包覆部</p>  
        <p type="p">221:第一包覆邊</p>  
        <p type="p">222:第二包覆邊</p>  
        <p type="p">223:填充塊</p>  
        <p type="p">224:定位孔</p>  
        <p type="p">23:第二貫穿孔</p>  
        <p type="p">231:內凹槽</p>  
        <p type="p">30:定位件</p>  
        <p type="p">31:彈性卡榫</p>  
        <p type="p">40:座弓</p>  
        <p type="p">41:插設部</p>  
        <p type="p">50:限位件</p>  
        <p type="p">51:卡塊</p>  
        <p type="p">52:通氣孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="32" publication-number="202619629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油脂替代品製法、油皮製法及油脂檢測方法</chinese-title>  
        <english-title>GREASE SUBSTITUTE PREPARATION METHOD AND OIL LEATHER PREPARATION METHOD AND OIL DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241106B">A23D9/02</main-classification>  
        <further-classification edition="200601120241106B">A21D2/14</further-classification>  
        <further-classification edition="200601120241106B">G01N21/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹國靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姵吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種油脂替代品的製備方法，包含：將蜂蠟與植物油依據7~15：85~93的一重量比例進行混合，然後在一預定溫度以及一預定時間下持續加熱攪拌，直到該蜂蠟完全溶解在該植物油中而形成一混合液，接著將該混合液放置於室溫下形成凝膠塊，而得到油脂替代品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for preparing a grease substitute is disclosed, including: mixing beeswax and vegetable oil in a weight ratio of 7 to 15: 85 to 93, and then continuing to heat and stir at a predetermined temperature and a predetermined time until the beeswax is completely dissolved in the vegetable oil to form a mixed liquid, and then placing the mixed liquid at room temperature to form a gel mass. As a result, a grease substitute is obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:槽體</p>  
        <p type="p">2:加熱元件</p>  
        <p type="p">3:油脂煙霧感知器</p>  
        <p type="p">4:光敏感測器</p>  
        <p type="p">5:恒溫導電度感測器</p>  
        <p type="p">6:電化學感測器</p>  
        <p type="p">7:資料處理 裝置</p>  
        <p type="p">8:鼓風機</p>  
        <p type="p">9:油凝膠試樣盤</p>  
        <p type="p">10:泵吸元件</p>  
        <p type="p">11:煙霧進入通道</p>  
        <p type="p">12:煙霧排出通道</p>  
        <p type="p">13:溫度控制裝置</p>  
        <p type="p">14:感測元件裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="33" publication-number="202620284"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提昇封閉循環發電系統之效率與發電量的冷卻方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F01K7/02</main-classification>  
        <further-classification edition="200601120241204B">F03G7/06</further-classification>  
        <further-classification edition="200601120241204B">F01K27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提昇封閉循環發電系統之效率與發電量的冷卻方法，尤特指溫差發電循環系統係由升壓泵、蒸發器、膨脹作功元件、冷凝器與發電機組成，其中在高溫高壓汽體降壓膨脹時，利用冷卻方法來讓工作流體處於膨脹降壓與冷卻同時進行狀態，藉此提升膨脹作功的機械能，進而增加發電量與系統發電效率。尤其應用在有機朗肯循環系統上更能發揮其功效，可有效且充分將低溫熱源回收並發電，達成節能減碳之最大效益，為其特徵者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:升壓泵</p>  
        <p type="p">2:蒸發器</p>  
        <p type="p">3:膨脹作功元件</p>  
        <p type="p">31:工作流體入口</p>  
        <p type="p">32:工作流體出口</p>  
        <p type="p">4:冷凝器</p>  
        <p type="p">5:發電機</p>  
        <p type="p">A:流量計</p>  
        <p type="p">B:油分離器</p>  
        <p type="p">C:油泵浦</p>  
        <p type="p">D:儲液槽</p>  
        <p type="p">E:熱電耦</p>  
        <p type="p">P:壓力計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="34" publication-number="202620801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於車輛特徵分析與統計之系統、方法及電腦程式產品</chinese-title>  
        <english-title>SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR VEHICLE FEATURE ANALYSIS AND STATISTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250701B">G06V20/54</main-classification>  
        <further-classification edition="202201120250701B">G06V20/58</further-classification>  
        <further-classification edition="202201120250701B">G06V10/40</further-classification>  
        <further-classification edition="202201120250701B">G06V10/44</further-classification>  
        <further-classification edition="200601120250701B">G08G1/017</further-classification>  
        <further-classification edition="200601120250701B">G08G1/052</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃少鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIAO-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱敬淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於車輛特徵分析與統計之系統、方法及電腦程式產品，包括對連續影像之各幀畫面進行特徵分析以偵測出複數個第一及第二特徵區域進而辨識出複數個第一及第二識別資訊，接著根據複數個第一與第二特徵區域之間的關聯性進行特徵配對以產生包含第一及/或第二識別資訊的特徵配對結果，且特徵配對結果中各個第一或第二特徵區域可作為主特徵區域，爾後根據特徵配對結果對連續影像進行特徵統計，以於主特徵區域的出現幀數在統計幀數範圍內到達輸出閾值時，輸出該主特徵區域及與其配對的第一及/或第二識別資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system, a method, and a computer program product for vehicle feature analysis and statistics are provided. Feature analysis is performed on each frame in continuous images to detect a plurality of first feature areas and a plurality of second feature areas, and then to recognize a plurality of first identification information and a plurality of second identification information. Feature matching is performed based on a correlation between the plurality of first and second feature areas to generate a feature matching result containing the first and/or second identification information, and each first or second feature area in the feature matching result is considered as a main feature area. Feature statistics is performed on the continuous images based on the feature matching result, whereby when a main feature area has a number of occurrence frames that reaches an output threshold within a statistical number of frames range, the main feature area and the first and/or second identification information matched thereto are output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21~S24:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="35" publication-number="202620702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧的超維邏輯判斷、超維邏輯推論和超維邏輯思考訓練系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06N5/04</main-classification>  
        <further-classification edition="201901120250203B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李守忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHOU CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李守忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHOU CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種人工智慧的超維邏輯判斷、超維邏輯推論和超維邏輯思考訓練系統及其方法，人工智慧的超維邏輯判斷、超維邏輯推論和超維邏輯思考訓練系統包含神經網路模組、超維邏輯數據資料庫、地基邏輯模組、四維邏輯模組、超維邏輯思考訓練模組、超維邏輯判斷模組與超維邏輯推論模組。本發明透過人工智慧融會貫通形式邏輯、思考邏輯與各種思考模式，並形成一種全新的邏輯模式，再藉由人工智慧推論出合乎邏輯的決定，以及作出理性決策。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:超維邏輯數據資料庫</p>  
        <p type="p">11:地基邏輯模組</p>  
        <p type="p">12:四維邏輯模組</p>  
        <p type="p">13:神經網路模組</p>  
        <p type="p">14:超維邏輯思考訓練模組</p>  
        <p type="p">15:超維邏輯判斷模組</p>  
        <p type="p">16:標示模組</p>  
        <p type="p">17:顯示模組</p>  
        <p type="p">18:超維邏輯推論模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="36" publication-number="202619929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維列印自行車坐墊</chinese-title>  
        <english-title>3D PRINTED BICYCLE SADDLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">B62J1/18</main-classification>  
        <further-classification edition="200601120241130B">B62K19/36</further-classification>  
        <further-classification edition="200601120241130B">B29C44/06</further-classification>  
        <further-classification edition="201701120241130B">B29C64/10</further-classification>  
        <further-classification edition="201501120241130B">B33Y10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宸大增材製造（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPLIFI TECH (XIAMEN) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李心慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高維君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種三維列印自行車坐墊，其包括底殼和設置於底殼上的彈性墊，其中彈性墊具有包括坐骨區的三維列印網狀晶格結構，且坐骨區的晶格單元是多孔螺旋曲面晶格。坐骨區的壓縮應力(σ)和壓縮應變(ε)滿足以下關係式：0≤ε≤0.2時，0 MPa≤σ≤0.23 MPa；0.2≤ε≤0.6時，0.1 MPa≤σ≤0.35 MPa；以及0.6≤ε≤0.65時，0.15 MPa≤σ≤0.45 MPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provide a 3D printed bicycle saddle including a base case and an elastic pad disposed on the base case, where the elastic pad has a 3D printed network crystal structure including an ischial region, and the ischial region has a gyroid crystal as an unit cell. The compressive stress (σ) and the compressive strain (ε) of the ischial region meet the following condition: 0 MPa ≤ σ ≤ 0.23 MPa while 0 ≤ ε ≤ 0.2; 0.1 MPa ≤ σ ≤ 0.35 MPa while 0.2 ≤ ε ≤ 0.6; and 0.15 MPa ≤ σ ≤ 0.45 MPa while 0.6 ≤ ε ≤ 0.65.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300a,300b,300c:區域</p>  
        <p type="p">310,320,330:曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="37" publication-number="202620276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖具控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">E05B47/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一德金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>I-TEK METAL MFG. CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈奕廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, I-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝依良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鎖具控制方法，包括一個鎖具以及取得一個控制權限的一個管理者行動裝置，所述管理者行動裝置可以將所述鎖具設定為一個普通模式、一個常開模式與一個勿擾模式，所述管理者行動裝置可以授予一個使用權限給至少一個使用者行動裝置以及至少一個門禁卡，所述管理者行動裝置、所述使用者行動裝置以及所述門禁卡允許對進入所述普通模式的所述鎖具解鎖，進入所述勿擾模式的所述門鎖只允許所述管理者行動裝置解鎖，而進入所述常開模式的所述鎖具會保持解鎖。所述鎖具可以讀取所述門禁卡的一個門禁卡識別資料用來使所述門禁卡取得所述使用權限。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S47:選擇模式程序</p>  
        <p type="p">S471:是否連線？</p>  
        <p type="p">S472:取消</p>  
        <p type="p">S473:是否需要認證？</p>  
        <p type="p">S474:認證是否成功？</p>  
        <p type="p">S475:保持普通模式</p>  
        <p type="p">S476:進入所選模式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="38" publication-number="202620905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性裝置</chinese-title>  
        <english-title>MAGNETIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H01F7/20</main-classification>  
        <further-classification edition="200601120241128B">H01F5/02</further-classification>  
        <further-classification edition="200601120241128B">C30B30/04</further-classification>  
        <further-classification edition="200601120241128B">C30B15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇　恩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZFOLI, AMIR.R.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種磁性裝置，其包含有一電磁模組及至少一外罩。電磁模組呈環狀，電磁模組具有一內圈；外罩設置於電磁模組外周，外罩具有一容置區及一開口，容置區與開口連通；其中，電磁模組位於容置區，而外罩的開口對應於電磁模組的內圈位置設置。藉此，本揭露可以獲得更多的磁通量，從而有助於製造技術領域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic device containing an electromagnetic module and at least an outer cover. The electromagnetic module is ring-shaped, and the electromagnetic module has an inner ring; The outer cover is arranged on the periphery of the electromagnetic module, and the outer cover has a containment area and an opening, and the containment area is connected with the opening; The electromagnetic module is located in the containment area, and the opening of the outer cover corresponds to the position setting of the inner ring of the electromagnetic module. Thus, the disclosure can obtain more magnetic flux, which can contribute to the field of manufacturing technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:磁性裝置</p>  
        <p type="p">10:電磁模組</p>  
        <p type="p">11:內圈</p>  
        <p type="p">12:第一電磁模組</p>  
        <p type="p">13:第二電磁模組</p>  
        <p type="p">14:導電體</p>  
        <p type="p">141:中空部</p>  
        <p type="p">142:內徑</p>  
        <p type="p">143:外徑</p>  
        <p type="p">20:外罩</p>  
        <p type="p">21:容置區</p>  
        <p type="p">21a:第一容置區</p>  
        <p type="p">21b:第二容置區</p>  
        <p type="p">22:開口</p>  
        <p type="p">23:第一外罩</p>  
        <p type="p">24:第二外罩</p>  
        <p type="p">30:冷卻模組</p>  
        <p type="p">C:軸線</p>  
        <p type="p">D1:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="39" publication-number="202620714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碼頭管理系統</chinese-title>  
        <english-title>DOCK MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250108B">G06Q10/06</main-classification>  
        <further-classification edition="202401120250108B">G06Q10/08</further-classification>  
        <further-classification edition="202401120250108B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永聯物流開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLY LOGISTIC PROPERTY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種碼頭管理系統，其包含有一承運端模組、一管理端模組及一現場端模組。承運端模組提供登錄一預約資訊，承運端模組依預約資訊生成一預約憑證；管理端模組與承運端模組耦接，管理端模組具有一管理資訊，管理資訊對應於預約資訊，管理資訊顯示於終端裝置；現場端模組與承運端模組和管理端模組耦接，當預約憑證輸入於現場端模組時，現場端模組生成一報到資訊，報到資訊顯示於終端裝置，現場端模組將報到資訊傳送予管理端模組。藉此，令物流業者能有效安排貨物裝卸流程，達到提升運作效率、降低錯誤發生率及提高作業安全性之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dock management system, which comprises a carrier-end module, a management-end module and a field-end module. The carrier-end module provides a reservation information, and the carrier-end module generates an appointment voucher according to the reservation information; the management-end module is coupled with the carrier-end module, and the management-end module has a management information, and the management information corresponds to the reservation information, and the management information is displayed in the terminal device; The field-end module is coupled with the carrier-end module and the management-end module, when the reservation voucher is input into the field-end module, the field-end module generates a check-in information, the check-in information is displayed in the terminal device, and the field-end module transmits the check-in information to the management-end module. Thus, logistics operators can effectively arrange the cargo handling process, so as to improve operational efficiency, reduce the incidence of errors and improve operational safety.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:碼頭管理系統</p>  
        <p type="p">1:伺服器</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">10:承運端模組</p>  
        <p type="p">20:管理端模組</p>  
        <p type="p">22:指派單元</p>  
        <p type="p">23:更新單元</p>  
        <p type="p">24:權限單元</p>  
        <p type="p">25:預約單元</p>  
        <p type="p">26:廠商管理單元</p>  
        <p type="p">30:現場端模組</p>  
        <p type="p">32:作業總覽單元</p>  
        <p type="p">40:智能監視模組</p>  
        <p type="p">42:閒置推播單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="40" publication-number="202620343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預防商用冰箱電熱高溫之控制方法</chinese-title>  
        <english-title>CONTROL METHOD FOR PREVENTING HIGH TEMPERATURE OF ELECTRICAL HEATING OF COMMERCIAL REFRIGERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F25D29/00</main-classification>  
        <further-classification edition="200601120241204B">F25D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得意科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEI TEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許德濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TE-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種預防商用冰箱電熱高溫之控制方法，其包含下列步驟：啟動一商用冰箱；檢測該商用冰箱的一運作狀況；當該運作狀況為一正常狀況時，根據該商用冰箱的一除霧操作參數表來開啟與關閉設置在該商用冰箱上的一加熱線；週期性地檢測該商用冰箱的該運作狀況；以及當該運作狀況由該正常狀況轉變為一故障狀況時，關閉該加熱線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control method for preventing high temperature of electrical heating of commercial refrigerator is provided in the present invention. The control method for preventing high temperature of electrical heating of commercial refrigerator includes the following steps: turning on a commercial refrigerator; detecting an operating status of the commercial refrigerator; in response to the operating status is a normal condition, turning on and turning off a heating wire provided on the commercial refrigerator according to a defogging operation parameter table of the commercial refrigerator; periodically detecting the operating status of the commercial refrigerator; and in response to the operating status changes from the normal condition to a fault condition, turning off the heating wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:預防商用冰箱電熱高溫之控制方法</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S140:步驟</p>  
        <p type="p">S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="41" publication-number="202621522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朋程科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACTRON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡欣昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉敬文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種功率模組，包含一散熱基板、一載板、一連線基板、一功率電晶體晶片組、複數個導電件、複數個外接導腳與一封裝體。該載板設置於該散熱基板，該載板包括一絕緣板體與一圖案化金屬線路層；該連線基板設置於該圖案化金屬線路層，該連線基板包括一多層金屬連線結構；該功率電晶體晶片組設置於該連線基板上且功率電晶體晶片透過該多層金屬連線結構彼此電性連接；該些導電件電性連接該載板的圖案化金屬線路層；該些外接導腳設置於該圖案化金屬線路層；該封裝體封裝該散熱基板、該載板、該連線基板、該功率電晶體晶片組與該些外接導腳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:散熱基板</p>  
        <p type="p">102:頂面</p>  
        <p type="p">12:載板</p>  
        <p type="p">14:絕緣板體</p>  
        <p type="p">16:圖案化金屬線路層</p>  
        <p type="p">162:導電部</p>  
        <p type="p">20:連線基板</p>  
        <p type="p">20a:高側連線基板</p>  
        <p type="p">20b:低側連線基板</p>  
        <p type="p">46a:電源導腳</p>  
        <p type="p">46b:接地導腳</p>  
        <p type="p">46c:輸出導腳</p>  
        <p type="p">46d:高側控制導腳</p>  
        <p type="p">46e:低側控制導腳</p>  
        <p type="p">46f:高側感測導腳</p>  
        <p type="p">46g:低側感測導腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="42" publication-number="202620344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商用冰箱的冷凍系統節能方法</chinese-title>  
        <english-title>ENERGY CONSERVATION METHOD FOR REFRIGERATION SYSTEM OF COMMERCIAL REFRIGERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F25D29/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得意科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEI TEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許德濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TE-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種商用冰箱的冷凍系統節能方法，其包含下列步驟：根據一散熱器溫度與一冷凍系統所在環境的一環境溫度之間的一散熱器風扇溫差，來控制一冷凝器散熱風扇轉速；根據一蒸發器溫度與一壓縮機的一低壓吸入溫度之間的一溫度差值，來控制一電子膨脹閥的一開度；根據該環境溫度，來微調該電子膨脹閥的該開度；以及根據一庫內溫度與一設定溫度的之間的一溫差，來控制該壓縮機的運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy conservation method for refrigeration system of commercial refrigerator is provided in the present application. The energy conservation method for refrigeration system of commercial refrigerator includes the following steps: controlling a rotation speed of condenser cooling fan according to a radiator fan temperature difference between a radiator temperature and an environment temperature of an environment where a refrigeration system located; controlling an opening degree of an electronic expansion valve according to a temperature difference between an evaporator temperature and a low pressure suction temperature of a compressor; fine-tuning the opening degree of the electronic expansion valve according to the environment temperature; and controlling an operation of the compressor according to a temperature difference between a temperature in the commercial refrigerator and a setting temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:商用冰箱的冷凍系統節能方法</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S132:步驟</p>  
        <p type="p">S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="43" publication-number="202620000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卜作嵐材料、其製備方法及其製品</chinese-title>  
        <english-title>POZZOLANIC MATERIAL, PREPARING METHOD THEREOF AND PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241122B">C04B18/04</main-classification>  
        <further-classification edition="200601120241122B">C04B14/22</further-classification>  
        <further-classification edition="200601120241122B">C04B28/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣水泥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TCC GROUP HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱鈺文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施乃權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, NAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐暐東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYU, WEI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳憶婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李崧銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SONG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製備卜作嵐材料之方法，其包括下列步驟：收集廢玻璃；將廢玻璃進行破碎至預定尺寸之廢玻璃顆粒；以及將廢玻璃顆粒進行研磨，以取得預定粒徑及預定粒徑分布之細磨玻璃粉，以作為卜作嵐材料。本發明更進一步提供藉由該方法所製備得之卜作嵐材料，以及利用該卜作嵐材料所製造的製品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for preparing a pozzolanic material, which includes the following steps: collecting waste glass; crushing the waste glass into waste glass particles with a predetermined size; and grinding the waste glass particles to obtain finely ground glass powder with a predetermined particle size and a predetermined particle size distribution as the pozzolanic material. The present invention further provides a pozzolanic material prepared by this method, as well as products manufactured using the pozzolanic material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="44" publication-number="202619738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於提升運動表現的乳酸菌發酵物、其製備方法、及包含該乳酸菌發酵物的食品組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250501B">A61K35/747</main-classification>  
        <further-classification edition="200601120250501B">A61P1/00</further-classification>  
        <further-classification edition="200601120250501B">A61P3/00</further-classification>  
        <further-classification edition="200601120250501B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜寧騰能生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIONIN BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃江鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀之軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JHIH-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳褕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, IU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於提升運動表現的乳酸菌發酵物，該乳酸菌發酵物是經由兩階段的發酵步驟所得，在第一階段的發酵步驟中是將含有黑糖的發酵基底與青木瓜酵素混合進行發酵獲得第一發酵產物，在第二階段的發酵步驟則是將去活性的第一發酵產物與乳酸菌群混合進行發酵獲得第二發酵產物，將第二發酵產物利用分離手段進行固液分離，所得液體即為該乳酸菌發酵物。利用本發明之用於提升運動表現的乳酸菌發酵物所製成的食品組合物可以有效地提升長時間耐力運動的運動表現，可以發展為耐力運動的有效補充飲品，應用於長跑、馬拉松、自行車、划船等競技運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="45" publication-number="202620003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負碳無機聚合漿體、負碳無機聚合物及其製備方法</chinese-title>  
        <english-title>NEGATIVE CARBON INORGANIC POLYMER SLURRY, NEGATIVE CARBON INORGANIC POLYMER AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C04B28/00</main-classification>  
        <further-classification edition="200601120241205B">C04B12/00</further-classification>  
        <further-classification edition="200601120241205B">C04B18/08</further-classification>  
        <further-classification edition="200601120241205B">C04B18/14</further-classification>  
        <further-classification edition="200601320241205B">C04B111/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施姵彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PEI TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅鎬德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HAO DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIA-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭大偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TA WUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韋皞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高得崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, DE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪匡聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, KUANG SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏鈺佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YU-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種負碳無機聚合漿體、負碳無機聚合物及其製備方法，藉由將二氧化碳封入氫氧化物溶液後，再進行無機聚合漿體的製備(依序與矽酸鈉溶液、飛灰及爐石粉進行混合)，形成具碳封存功能之負碳無機聚合漿體。且，此製備方法所形成的負碳無機聚合漿體，不僅製備成本低外，且其後續製備的負碳無機聚合物更具有一定的經濟價值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a negative carbon inorganic polymer slurry, a negative carbon inorganic polymer and a preparation method thereof. After sealing carbon dioxide into a hydroxide solution, the inorganic polymer slurry is prepared (sequentially mixed with a sodium silicate solution, fly ash and furnace stone powder are mixed) to form a carbon-negative inorganic polymer slurry with carbon sequestration function. Moreover, the negative carbon inorganic polymer slurry formed by this preparation method not only has low preparation cost, but also the negative carbon inorganic polymer subsequently prepared has certain economic value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="46" publication-number="202620532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光圈模組、包括光圈模組之鏡頭模組以及攝影機裝置</chinese-title>  
        <english-title>APERTURE MODULE, LENS MODULE INCLUDING THE SAME, AND CAMERA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250516B">G03B9/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNGGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯太岏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROH, TAEWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金中喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNGCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李現重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNJOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種光圈模組，其包括：一外殼；一旋轉主體，其安置於該外殼上方；一球體構件，其安置於該外殼與該旋轉主體之間；一磁體，其安置於該旋轉主體上；一線圈，其經組態以與該磁體相互作用以使該旋轉主體旋轉；一葉片部件，其連接至該旋轉主體且包括一開口，該開口形成為其大小根據該旋轉主體之旋轉而變化；以及一磁性主體，其安置於該外殼中且經組態以與該磁體產生吸引力。該磁性主體在一光軸方向上不與該磁體重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an aperture module including a housing, a rotary body disposed above the housing, a ball member disposed between the housing and the rotary body, a magnet disposed on the rotary body, a coil configured to interact with the magnet to rotate the rotary body, a blade part connected to the rotary body and including an opening formed to be varied in size in accordance with rotation of the rotary body, and a magnetic body disposed in the housing and configured to generate attractive force with the magnet. The magnetic body does not overlap the magnet in an optical-axis direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:滾動構件</p>  
        <p type="p">70:加強構件</p>  
        <p type="p">70A:第一加強構件</p>  
        <p type="p">70B:第二加強構件</p>  
        <p type="p">70C:第三加強構件</p>  
        <p type="p">70D:第四加強構件</p>  
        <p type="p">86:磁性主體</p>  
        <p type="p">95:磁性主體</p>  
        <p type="p">95A:第一磁性主體</p>  
        <p type="p">95B:第二磁性主體</p>  
        <p type="p">110:旋轉主體</p>  
        <p type="p">120:線圈</p>  
        <p type="p">120A:第一線圈單元</p>  
        <p type="p">120B:第二線圈單元</p>  
        <p type="p">130:磁體</p>  
        <p type="p">130A:第一磁體單元</p>  
        <p type="p">130B:第二磁體單元</p>  
        <p type="p">140:外殼</p>  
        <p type="p">150:葉片部件</p>  
        <p type="p">150A:葉片</p>  
        <p type="p">150B:葉片</p>  
        <p type="p">150C:葉片</p>  
        <p type="p">150D:葉片</p>  
        <p type="p">150E:葉片</p>  
        <p type="p">150F:葉片</p>  
        <p type="p">160:支撐板</p>  
        <p type="p">190:電路板</p>  
        <p type="p">201:開口</p>  
        <p type="p">205:開口</p>  
        <p type="p">300:罩蓋構件</p>  
        <p type="p">301:上部板</p>  
        <p type="p">302:側板</p>  
        <p type="p">303:開口</p>  
        <p type="p">401:開口</p>  
        <p type="p">501:開口</p>  
        <p type="p">B1:球體構件/端子</p>  
        <p type="p">B2:球體構件/端子</p>  
        <p type="p">B3:球體構件</p>  
        <p type="p">B4:球體構件</p>  
        <p type="p">OA:第一方向</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="47" publication-number="202620307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同動雙軸樞轉裝置</chinese-title>  
        <english-title>SIMULTANEOUS TWO-AXIS SWIVEL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241108B">F16C11/04</main-classification>  
        <further-classification edition="200601120241108B">H05K7/14</further-classification>  
        <further-classification edition="200601120241108B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連鋐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN HONG ART CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許景堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JING YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種同動雙軸樞轉裝置， 包括一滑動軸套、二軸心、四傳動軸套、四第一承架、以及二第二承架；滑動軸套具有一基部、以及二軸心套並分別設於基部二側；二軸心分別樞設於二軸心套內並由其軸向的前、後方突伸而出；四傳動軸套皆具有一固定部、以及由固定部上朝徑向延伸而出的一搭接部，且各固定部皆穿置於各軸心所突伸而出的部位上；四第一承架皆具有一套部、以及由套部上向外延伸而出的一側架，且各套部皆套接於各軸心所突伸而出的部位上，以將各傳動軸套之固定部沿著各軸心而朝向各軸心套作限位，而各搭接部則連接於各側架；二第二承架分別跨置於各軸心上之二第一承架的側架之間；其中，滑動軸套之各軸心套於朝向各軸心突出的方向上皆設有一滑動斜緣，且各傳動軸套之固定部上係延著各軸心的軸向而突設有一固定斜緣，而固定斜緣係與滑動斜緣相接觸作螺旋滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A simultaneous two-axis swivel device having a sliding sleeve, two shafts, four transmission sleeves, four first carrying brackets, and two second carrying brackets is provided. The sliding sleeve has a base portion and two shaft sleeves respectively arranged on two sides of the base portion. The shafts are pivoting in the shaft sleeves and respectively protruding from a front and a rear of axis thereof. The transmission sleeves respectively have a fixing portion and an overlap portion extended from a top of the fixing portion. The fixing portions are arranged on a portion of the shafts protruding from the shaft sleeves. The first carrying brackets respectively have a sleeve portion and a side bracket extended outward the sleeve portion. The sleeve portions are adapted to sheathe the portion of the shafts protruding from the shaft sleeves to limit the fixing portions. The overlap portions are connected to the side brackets. The second brackets are respectively straddling between the side brackets. A sliding bevel is arranged on each of the shaft sleeves facing the shafts. A fixing bevel is arranged on each of the fixing portions. The sliding bevels contact the fixing bevels to slide rotatably.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:保護套</p>  
        <p type="p">2:軸心</p>  
        <p type="p">20:限位架</p>  
        <p type="p">21:扣片</p>  
        <p type="p">22:護蓋</p>  
        <p type="p">3:傳動軸套</p>  
        <p type="p">30:固定部</p>  
        <p type="p">31:搭接部</p>  
        <p type="p">4:第一承架</p>  
        <p type="p">40:套部</p>  
        <p type="p">400:套孔</p>  
        <p type="p">41:側架</p>  
        <p type="p">5:第二承架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="48" publication-number="202619853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴油嘴拆卸工具</chinese-title>  
        <english-title>FUEL INJECTOR REMOVAL TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25B27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上裕汽車零件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG YU AUTO PARTS COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝和橙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊億</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴油嘴拆卸工具，用於夾固一噴油嘴以進行拆卸作業，噴油嘴拆卸工具包含一本體，本體有一第一夾爪、一第二夾爪及一支撐部，第一夾爪與第二夾爪連接於支撐部沿一Z軸方向的兩端，且第一夾爪與第二夾爪朝一X軸方向延伸，使第一夾爪、第二夾爪與支撐部共同構成一容置空間以固定噴油嘴，X軸方向垂直Z軸方向。透過第一夾爪、第二夾爪與支撐部共同形成的容置空間，能穩固夾持噴油嘴，在將噴油嘴從引擎拆卸的過程中，能減少對噴油嘴和引擎的損壞風險，提升拆卸噴油嘴的效率，縮短維修時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fuel injector removal tool is provided for clamping a fuel injector to facilitate its removal. The fuel injector removal tool includes a main body with a first jaw, a second jaw, and a support portion. The first and second jaws are connected to opposite ends of the support portion along a Z-axis, with both jaws extending along an X-axis, perpendicular to the Z-axis. Together, the first jaw, second jaw, and support portion define a receiving space that securely holds the fuel injector in place. The receiving space formed by the jaws and support portion provides stable clamping for the fuel injector, reducing the risk of damage to the injector and engine during removal. This design improves fuel injector removal efficiency and reduces maintenance time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:第一夾爪</p>  
        <p type="p">111:第一槽</p>  
        <p type="p">12:第二夾爪</p>  
        <p type="p">121:第二槽</p>  
        <p type="p">13:支撐部</p>  
        <p type="p">131:第一支撐段</p>  
        <p type="p">132:第二支撐段</p>  
        <p type="p">14:容置空間</p>  
        <p type="p">151:第一圓角</p>  
        <p type="p">152:第二圓角</p>  
        <p type="p">153:第三圓角</p>  
        <p type="p">L:虛擬軸線</p>  
        <p type="p">F:自由端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="49" publication-number="202619854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>套覆式噴油嘴拆卸工具</chinese-title>  
        <english-title>SLEEVE-TYPE FUEL INJECTOR REMOVAL TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25B27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上裕汽車零件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG YU AUTO PARTS COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝和橙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊億</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種套覆式噴油嘴拆卸工具，用於夾固噴油嘴以進行拆卸作業。該套覆式噴油嘴拆卸工具包含一聯接件、一套環及一套筒，聯接件結合於噴油嘴的一端；套環固定於噴油嘴外部，具有第一定位結構；套筒同時套設於聯接件及套環外部，套筒內壁設有第二定位結構及止擋緣，第二定位結構與第一定位結構相結合，且止擋緣抵接於撐抵緣。藉由上述結構，本揭露之套覆式噴油嘴拆卸工具適用於無法以常規工具拔除噴油嘴的情況下使用，能提供穩定的包覆性及適應較大的拆卸力，確保能夠成功及快速地將噴油嘴從引擎拆卸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sleeve-type fuel injector removal tool is designed to clamp and remove fuel injectors. The tool includes a coupling member, a collar, and a sleeve. The coupling member attaches to one end of the fuel injector, while the collar is fixed around the exterior of the fuel injector and features a first positioning structure. The sleeve is positioned over both the coupling member and the collar, with its inner wall equipped with a second positioning structure and a stop edge. The second positioning structure interlocks with the first positioning structure, and the stop edge abuts against a support edge. With this configuration, the disclosed sleeve-type fuel injector removal tool is suitable for cases where conventional tools cannot remove the fuel injector. It provides stable coverage and accommodates greater removal force, ensuring the fuel injector can be removed from the engine effectively and efficiently.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聯接件</p>  
        <p type="p">11:連結部</p>  
        <p type="p">13:拔取部</p>  
        <p type="p">14:撐抵緣</p>  
        <p type="p">20:套環</p>  
        <p type="p">21:第一定位結構</p>  
        <p type="p">22:開口</p>  
        <p type="p">30:套筒</p>  
        <p type="p">32:止擋緣</p>  
        <p type="p">33:倒角頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="50" publication-number="202620892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療器械管理系統及其方法</chinese-title>  
        <english-title>MEDICAL DEVICE MANAGEMENT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241202B">G16H40/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯彤實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN TONG CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施閔涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, MIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游世任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, SHIH-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊芯詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSIN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種醫療器械管理系統，其包含器械容置裝置、資料儲存模組、識別模組及器械監測裝置。器械容置裝置用以存放醫療器械；資料儲存模組儲存有對應器械監測裝置的識別資料；識別模組的識別標籤設於器械容置裝置之外周緣，且能夠讓識別器進行辨識以取得識別資料；器械監測裝置對器械容置裝置進行秤重動作，以取得器械容置裝置的當前重量資料，器械監測裝置能夠對器械容置裝置中的醫療器械進行取像動作，以分析出醫療器械的當前品項資料，器械容置裝置若分析出當前重量資料或當前品項資料有異常，則輸出異常訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A medical device management system, which includes a device storage unit, a data storage module, an identification module, and a device monitoring unit. The device storage unit is used to store medical devices; the data storage module stores identification data corresponding to the device monitoring unit; the identification module has an identification label placed on the outer periphery of the device storage unit, allowing a reader to identify and obtain the identification data. The device monitoring unit weighs the device storage unit to obtain current weight data and captures images of the medical devices in the storage unit to analyze the current item data. If the current weight data or item data is determined to be abnormal, the device storage unit outputs an alert signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:醫療器械管理系統</p>  
        <p type="p">10:器械容置裝置</p>  
        <p type="p">20:資料儲存模組</p>  
        <p type="p">30:識別模組</p>  
        <p type="p">31:識別標籤</p>  
        <p type="p">32:識別器</p>  
        <p type="p">40:器械監測裝置</p>  
        <p type="p">41:測量取像模組</p>  
        <p type="p">42:異常分析模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="51" publication-number="202619855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴油嘴拆卸組件</chinese-title>  
        <english-title>FUEL INJECTOR REMOVAL ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25B27/02</main-classification>  
        <further-classification edition="200601120241204B">F02M63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上裕汽車零件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG YU AUTO PARTS COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝和橙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊億</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示為一種噴油嘴拆卸組件，適用於拆卸安裝於引擎上的噴油嘴，噴油嘴拆卸組件包含支撐組件、定位件、鎖接部及拆卸工具。支撐組件安裝於引擎外部；定位件設置於支撐組件遠離引擎的一側，並設有通孔；鎖接部具有連結部，鎖接部的一端固定於噴油嘴頂部，另一端穿伸於通孔中，且連結部位於通孔下方；拆卸工具可同時套固於鎖接部與噴油嘴的部分表面，且拆卸工具撐抵於撐抵緣，安裝後再使用拔取工具，即可實現噴油嘴的快速拆卸。本揭示噴油嘴拆卸組件的結構簡單，安裝容易，能有效提高拆卸噴油嘴的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a fuel injector removal assembly suitable for removing fuel injectors mounted on an engine. The fuel injector removal assembly includes a support component, a positioning member, a locking section, and a removal tool. The support component is mounted outside the engine, and the positioning member is arranged on the side of the support component facing away from the engine, featuring a through-hole. The locking section includes a connecting part, with one end of the locking section fixed to the top of the fuel injector and the other end extending through the through-hole, where the connecting part is positioned below the through-hole. The removal tool is configured to fit over both the locking section and a portion of the injector’s outer surface and rests against a supporting edge. When installed, a pulling tool can then be employed to achieve quick removal of the injector. This fuel injector removal assembly is characterized by a simple structure, easy installation, and improved efficiency in removing fuel injectors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐組件</p>  
        <p type="p">11:滑軌</p>  
        <p type="p">13:限位槽</p>  
        <p type="p">20:定位件</p>  
        <p type="p">30:鎖接部</p>  
        <p type="p">31:第一聯接件</p>  
        <p type="p">311:第一結合部</p>  
        <p type="p">321:連結部</p>  
        <p type="p">323:第三結合部</p>  
        <p type="p">40:拆卸工具</p>  
        <p type="p">42:第一夾爪</p>  
        <p type="p">43:第二夾爪</p>  
        <p type="p">50:軸承</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="52" publication-number="202619686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>骨釘拔除器</chinese-title>  
        <english-title>BONE SCREW EXTRACTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61B17/00</main-classification>  
        <further-classification edition="200601120241130B">A61B17/88</further-classification>  
        <further-classification edition="200601120241130B">A61B17/86</further-classification>  
        <further-classification edition="201601120241130B">A61B34/00</further-classification>  
        <further-classification edition="201601120241130B">A61B90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚醫療財團法人林口長庚紀念醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG GUNG MEMORIAL HOSPITAL, LINKOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昌辰鑫生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRANSIN BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高福成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, FU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅安志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林傑茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEH-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林南光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, NAN-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃芓瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳易哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YI-JHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種骨釘拔除器及其使用方法，骨釘拔除器包含一骨釘連接座以及一操作桿。骨釘連接座包含一連接座本體以及一組接柱體。連接座本體包含一本體部以及二延伸臂。本體部是連結於操作桿，二延伸臂係自本體部同向延伸出，藉以與本體部共同圍構出一骨釘組接空間。組接柱體係穿過骨釘組接空間而分別組接於二延伸臂，用以置入一椎體骨釘之一頂部凹槽，並在受到固定件固定組接於椎體骨釘，藉此使用者可透過操作桿驅動骨釘連接座旋轉拔除椎體骨釘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bone screw extractor and a method for assembling a bone screw with the bone screw extractor. The bone screw extractor includes a bone screw connector and an operating rod. The bone screw connector consists of a connector body and an assembly post. The connector body includes a main body and two extension arms. The main body is connected to the operating rod, and the two extension arms extend in the same direction from the main body, forming a bone screw assembly space together with the main body. The assembly post passes through the bone screw assembly space and connects to the two extension arms. It is designed to fit into a top recess of a vertebral bone screw and is secured to the vertebral bone screw by a fixed member. This allows the user to rotate the bone screw connector via the operating rod to extract the vertebral bone screw.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:骨釘拔除器</p>  
        <p type="p">11:萬向接頭</p>  
        <p type="p">12:骨釘連接座</p>  
        <p type="p">13:操作桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="53" publication-number="202620405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速軸承損壞分析方法</chinese-title>  
        <english-title>METHOD FOR RAPID BEARING DAMAGE ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241204B">G01M13/045</main-classification>  
        <further-classification edition="200601120241204B">G06F17/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡振凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JENN-KAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳秋璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIOU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快速軸承損壞分析方法，包含以下步驟：以一演算法訓練一模型資料並產生一模態資訊模型，流程包括：獲取一測試軸承的一振動訊號，將其轉換為一振動頻譜，並對該振動頻譜進行平滑化、影像化及模態資訊標註，接著以該演算法以該振動頻譜做為該模型資料進行影像辨識訓練。之後，載入該模態資訊模型辨識一軸承的一模態資訊並進行損壞分析以產生一診斷結果。此過程包括：獲取該軸承的該振動訊號，轉換為該振動頻譜，平滑化後使用該模態資訊模型辨識該模態資訊，透過該模態資訊進行一帶通濾波處理，並進行一解調處理以得到一特徵頻率，最終生成一診斷結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for rapid bearing damage analysis includes the following steps: using an algorithm to train a model data and generating a modal information model, which includes obtaining a vibration signal from a test bearing, converting it into a vibration spectrum, and then smoothing, imaging, and labeling the vibration spectrum with modal information. The vibration spectrum is then used as the model data for image recognition training with the algorithm. Next, the modal information model is loaded to identify the modal information of a bearing and perform damage analysis to generate a diagnostic result. This process includes obtaining the vibration signal of the bearing, converting the vibration signal into a vibration spectrum, smoothing the vibration signal, using the modal information model to identify the modal information, processing the vibration signal and spectrum through a bandpass filter, and performing a demodulation process to obtain a characteristic frequency, ultimately generating a diagnostic result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100-S200:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="54" publication-number="202620123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物及其應用</chinese-title>  
        <english-title>RESIN COMPOSITION AND USES OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241107B">C08L63/02</main-classification>  
        <further-classification edition="200601120241107B">C08L63/00</further-classification>  
        <further-classification edition="201801120241107B">C08K3/013</further-classification>  
        <further-classification edition="200601120241107B">C08K3/22</further-classification>  
        <further-classification edition="200601120241107B">B32B27/20</further-classification>  
        <further-classification edition="200601120241107B">H05K3/28</further-classification>  
        <further-classification edition="200601120241107B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台燿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN UNION TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物，其包含（A）環氧樹脂、（B）雙環戊二烯型酚樹脂、以及（C）第一填料。該第一填料係具有1微米至4微米之D50粒徑的勃姆石。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition is provided. The resin composition comprises (A) an epoxy resin, (B) a dicyclopentadiene-based phenol resin, and (C) a first filler. The first filler is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">：無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="55" publication-number="202620826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250210B">G09G3/32</main-classification>  
        <further-classification edition="200601120250210B">G09G3/00</further-classification>  
        <further-classification edition="202501120250210B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏育淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YU CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁健森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHIEN-SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括基板、多個第一晶片連接線結構、多個發光元件、第一絕緣層、失效微晶片、多個第二晶片連接線結構以及修復微晶片。第一晶片連接線結構位於基板之上，且從晶片放置區往外延伸。第一絕緣層位於基板之上，且橫向地環繞失效微晶片，且失效微晶片至少部分連接至第一晶片連接線結構。第二晶片連接線結構位於第一絕緣層之上，且至少部分電性連接至第一晶片連接線結構。修復微晶片位於第一絕緣層上。修復微晶片至少部分重疊於失效微晶片。修復微晶片通過第二晶片連接線電性連接至發光元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate, first chip connection line structures, light-emitting elements, a first insulating layer, a failed microchip, second chip connection line structures and a repair microchip. The first chip connection line structures are located above the substrate and extends outward from a chip placement area. The first insulating layer is located above the substrate and laterally surrounds the failed microchip, and the failed microchip is at least partially connected to the first chip connection line structures. The second chip connection line structures are located above the first insulating layer and are at least partially electrically connected to the first chip connection line structures. The repair microchip is located above the first insulating layer. The repair microchip at least partially overlaps the failed microchip. The repair microchip is electrically connected to the light-emitting elements through the second chip connection lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:顯示裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:緩衝層</p>  
        <p type="p">110A,110B:第一微晶片</p>  
        <p type="p">113:第一晶片接墊</p>  
        <p type="p">115,215,S:連接結構</p>  
        <p type="p">120A:第一晶片連接線結構</p>  
        <p type="p">120A-1:第一部分</p>  
        <p type="p">120A-2:第二部分</p>  
        <p type="p">122A:第一晶片接合墊</p>  
        <p type="p">123A:第一連接線</p>  
        <p type="p">124A:第一連接墊</p>  
        <p type="p">130A:第二晶片連接線結構</p>  
        <p type="p">132A:第一修復接墊</p>  
        <p type="p">133A:第二連接線</p>  
        <p type="p">134A,:第一導電填充部</p>  
        <p type="p">135A:訊號輸出線</p>  
        <p type="p">140:第一絕緣層</p>  
        <p type="p">152:第一發光二極體接合墊</p>  
        <p type="p">154:第二發光二極體接合墊</p>  
        <p type="p">210:修復微晶片</p>  
        <p type="p">213:第二晶片接墊</p>  
        <p type="p">310:發光元件</p>  
        <p type="p">E:電極</p>  
        <p type="p">O1:第一開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="56" publication-number="202621399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆晶封裝機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification>  
        <further-classification edition="200601120260223B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易發精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙立文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余世琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡杰安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種覆晶封裝機，其包括有：一載體收放裝置，具有一放料站、一載體輸送軌道與一收料站，而利用該載體輸送軌道將載體由該放料站輸送至該收料站；一晶片封裝裝置，設置於該放料站與該收料站之間，而將一可升降之壓合頭設置於該載體輸送軌道上方，且將一可升降之壓合平台相對該壓合頭設置於該載體輸送軌道下方，該壓合頭與該壓合平台具有加熱器；一晶圓平台，設置於該晶片封裝裝置的側邊而可於平行該載體輸送軌道之軸向平移；以及一晶片拾取裝置，將一拾取頭設置於一三軸機械手，該拾取頭利用該三軸機械手於垂直該載體輸送軌道之平移軸、升降軸及旋轉軸三軸移動，而自該晶圓平台拾取晶片，並將晶片移交給該壓合頭。藉此，用以解決先前技術會因接(壓)合頭與接(壓)合平台的外移接料，導致壓合精度及壓合溫度不穩定之問題，而令壓合頭與壓合平台原地升降進行壓合封裝，具有提升壓合精度及壓合溫度穩定性之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:載體收放裝置</p>  
        <p type="p">11:放料站</p>  
        <p type="p">12:載體輸送軌道</p>  
        <p type="p">13:收料站</p>  
        <p type="p">20:晶片封裝裝置</p>  
        <p type="p">30:晶圓平台</p>  
        <p type="p">40:晶片拾取裝置</p>  
        <p type="p">50:晶圓卡匣平台</p>  
        <p type="p">60:晶圓上料裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="57" publication-number="202620379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛擬場域的移動路徑推薦方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G01C21/20</main-classification>  
        <further-classification edition="200601120250203B">G06F3/01</further-classification>  
        <further-classification edition="201101120250203B">G06T19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴丞峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴丞峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種虛擬場域的移動路徑推薦方法，於處理器執行且包含：取得真實場域地圖與虛擬場域地圖；於真實場域地圖的真實可活動範圍內設置虛擬場域地圖的起點與終點；排列虛擬場域地圖的位置，使虛擬場域地圖的虛擬地圖範圍與真實可活動範圍具有最大重疊面積；於虛擬場域地圖中，根據節點數量、起點與終點產生不同的多個路徑，以將位於真實可活動範圍內之長度較長的路徑設為推薦路徑；控制顯示器顯示推薦路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01,S02,S03,S04,S05,S06,S07,S08:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="58" publication-number="202620398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子裝置液冷系統之漏液監控及預測方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR MONITORING AND PREDICTING LEAKAGE IN LIQUID COOLING SYSTEMS FOR ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G01M3/24</main-classification>  
        <further-classification edition="200601120241204B">G06N3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯同揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, TUNG YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盤立平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, LIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高盟超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, MENG CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡竹嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHU CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示有關漏液監控技術。在一些實施例中，實時接收管路內流體流動之即時音頻訊號；且將即時音頻訊號轉換成一時頻譜圖；以及對該時頻譜圖執行影像辨識，以判斷該管路是否有漏液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A leak detection technology is disclosed. In some embodiments, real-time audio signals of fluid flow within a conduit are received; the real-time audio signals are converted into a time-frequency spectrogram; and image recognition is performed on the time-frequency spectrogram to determine whether there is a leak in the conduit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:漏液監控及預測系統</p>  
        <p type="p">2:接收模組</p>  
        <p type="p">3:處理器</p>  
        <p type="p">4:儲存模組</p>  
        <p type="p">21:車載音訊匯流排</p>  
        <p type="p">22:微型收音單元</p>  
        <p type="p">CDU:冷卻液監控主機</p>  
        <p type="p">D:電子裝置</p>  
        <p type="p">D1:水冷板</p>  
        <p type="p">P:管路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="59" publication-number="202620962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸波裝置</chinese-title>  
        <english-title>ELECTROMAGNETIC WAVE ABSORBING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H01Q1/48</main-classification>  
        <further-classification edition="200601120241204B">H01Q1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>微星科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO-STAR INT'L CO., LIMITED.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商微盟電子（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSI ELECTRONICS (KUN SHAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾冠學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, KUAN-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊振坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHEN-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳兆宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡可峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, KE-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吸波裝置，設置於電子裝置內部中的天線淨空區之外，且吸波裝置包含吸波圖案部、吸波電路以及接地部。吸波圖案的長度對應於吸收波頻的可諧振長度。吸波電路至少包含衰減器。接地部連接吸波圖案部及該吸波電路。在此，主要透過吸波圖案部吸收可能造成天線干擾的電磁波頻段、再透過吸波電路將其轉換為熱能，而能夠達到訊噪比提升的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electromagnetic wave absorbing device is provided outside the antenna clearance area within an electronic device, and the electromagnetic wave absorbing device includes a wave absorbing pattern portion, a wave absorbing circuit and a grounding portion. The length of the absorbing pattern portion corresponds to a resonant length of an absorbed wave frequency. The wave absorbing circuit at least includes an attenuator The ground section is connected to wave absorbing pattern portion and the wave absorbing circuit . Here, the wave absorbing pattern portion is mainly used to absorb the electromagnetic wave frequency band that may cause antenna interference, and then converted into heat energy through the wave absorbing circuit, thereby achieving the effect of improving the signal-to-noise ratio.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸波裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:吸波圖案部</p>  
        <p type="p">21:第一吸波圖案</p>  
        <p type="p">23:第二吸波圖案</p>  
        <p type="p">30:吸波電路</p>  
        <p type="p">31:負載阻抗</p>  
        <p type="p">33:衰減器</p>  
        <p type="p">35:傳輸線</p>  
        <p type="p">40:接地部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="60" publication-number="202620624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧處理器與尋找極值的方法</chinese-title>  
        <english-title>INTELLIGENCE PROCESSING UNIT AND METHOD OF FINDING EXTREME VALUE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F9/06</main-classification>  
        <further-classification edition="200601120250203B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜匯策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HUI-CE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">智慧處理器包含第一記憶體、第二記憶體以及向量核電路。第一記憶體儲存一批量資料。第二記憶體儲存一遮罩資料。向量核電路用以：尋找該批量資料的複數個資料值中的一第一極值，並儲存該第一極值以及該第一極值的一第一位置索引值至該第一記憶體；根據該第一位置索引值調整該遮罩資料中的一對應位元；以及根據該對應位元尋找該複數個資料值中的一第二極值，並儲存該第二極值以及該第二極值的一第二位置索引值至該第一記憶體，其中該第二極值不同於該第一極值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent processing unit includes a first memory, a second memory, and a vector core circuit. The first memory stores batch data. The second memory stores mask data. The vector core circuit is configured to: find a first extremum value among a plurality of data values in the batch data, and store the first extremum value and a first location index value of the first extremum value to the first memory; adjust a corresponding bit in the mask data according to the first location index value; and find a second extremum value among the plurality of data values according to the corresponding bit, and store the second extremum value and a second location index value of the second extremum value to the first memory, in which the second extremum value is different from the first extremum value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:智慧處理器</p>  
        <p type="p">101:主記憶體</p>  
        <p type="p">110:向量核電路</p>  
        <p type="p">120,130:記憶體</p>  
        <p type="p">140:直接記憶體存取控制器</p>  
        <p type="p">150:控制器電路</p>  
        <p type="p">BD:批量資料</p>  
        <p type="p">CMD:預設指令</p>  
        <p type="p">M1~MK:位置索引值</p>  
        <p type="p">MD:遮罩資料</p>  
        <p type="p">N1~NK:極值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="61" publication-number="202619838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142016</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導磁載台</chinese-title>  
        <english-title>MAGNETIC CONDUCTIVE STAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B23Q3/154</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃惟泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導磁載台包含一第一導磁組及一第二導磁組，該第一導磁組的一第一磁性件與該第二導磁組的一第二磁性件之間具有一空間，該空間用以容置一待加工件，以在一磨削加工過程中，藉由該第一磁性件及該第二磁性件使該待加工件受磁，並產生電渦流，且在電渦流與磁場相互作用下產生阻尼效應，進而提高該待加工件的導熱率，以降低一研磨輪磨損率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic conductive stage includes a first magnetic conductive assembly and a second magnetic conductive assembly. A space exists between a first magnetic element of the first magnetic conductive assembly and a second magnetic element of the second magnetic conductive assembly. During grinding process, a workpiece placed in the space is magnetized by the first and second magnetic elements to generate eddy current, and damping effect induced by eddy current and magnetic field can further enhance thermal conductivity of the workpiece to lower wear rate of a grinding wheel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:導磁載台</p>  
        <p type="p">110:第一導磁組</p>  
        <p type="p">111:第一基座</p>  
        <p type="p">111a:第一基部</p>  
        <p type="p">111b:第一載部</p>  
        <p type="p">111c:第一長槽孔</p>  
        <p type="p">111d:第一迫緊件</p>  
        <p type="p">111e:第一穿孔</p>  
        <p type="p">112:第一磁性件</p>  
        <p type="p">112a:第一導磁面</p>  
        <p type="p">120:第二導磁組</p>  
        <p type="p">121:第二基座</p>  
        <p type="p">121a:第二基部</p>  
        <p type="p">121b:第二載部</p>  
        <p type="p">121d:第二迫緊件</p>  
        <p type="p">122:第二磁性件</p>  
        <p type="p">122a:第二導磁面</p>  
        <p type="p">130:空間</p>  
        <p type="p">140:第一固定件</p>  
        <p type="p">150:螺栓</p>  
        <p type="p">200:夾座模組</p>  
        <p type="p">300:待加工件</p>  
        <p type="p">400:工作台</p>  
        <p type="p">A:第一夾角</p>  
        <p type="p">X:第一軸線</p>  
        <p type="p">Y:第二軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="62" publication-number="202620112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改善耐衝擊強度與表面電阻值的半導體元件盒及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR COMPONENT BOX WITH IMPROVED IMPACT STRENGTH AND SURFACE RESISTIVITY, AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08K3/04</main-classification>  
        <further-classification edition="200601120260223B">C08L45/00</further-classification>  
        <further-classification edition="200601120260223B">C08L101/12</further-classification>  
        <further-classification edition="200601120260223B">B65G49/07</further-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification>  
        <further-classification edition="201101120260223B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍱德股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YES-TEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔慶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, QING-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SONG-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴明德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MING-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體元件盒，其至少一部分由聚合物組成物形成，該聚合物組成物包括以下成分：聚合物樹脂100重量份；耐衝擊改質劑11至28重量份；以及導電性增強劑2至9重量份。本發明的功效在於，半導體元件盒能夠有效防止靜電積聚，並具備良好的抗衝擊性能，從而保護半導體元件盒內部的半導體元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor component box, at least a portion of which is formed from a polymer composition comprising the following components: 100 parts by weight of a polymer resin; 11 to 28 parts by weight of an impact modifier; and 2 to 9 parts by weight of a conductive enhancer. The effect of the present invention is that the semiconductor component box can effectively prevent the accumulation of static electricity and exhibits good impact resistance, thereby protecting the semiconductor components inside.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="63" publication-number="202621180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多鏈路傳輸系統以及多鏈路傳輸方法</chinese-title>  
        <english-title>MULTI-LINK OPERATION TRANSMISSION SYSTEM AND MULTI-LINK OPERATION TRANSMISSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">H04W76/15</main-classification>  
        <further-classification edition="200601120250203B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JHE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">多鏈路傳輸系統包含傳輸資訊裝置、強化學習裝置以及回饋裝置。傳輸資訊裝置可透過多個通道以初始傳輸狀態傳送複數個封包給接收端。回饋裝置用以回饋初始傳輸狀態以及傳輸結果。強化學習裝置用以根據回饋裝置提供之初始傳輸狀態以及傳輸結果以提供傳輸速率至傳輸資訊裝置，以使傳輸資訊裝置之傳輸速率符合複數個通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-link operation transmission system includes a transmission information device, a reinforcement learning device, and a feedback device. The transmission information device is configured to transmit a plurality of packages to a receiving device with an initial transmission state through a plurality of channels. The feedback device is configured to feed back the initial transmission state and a transmission result. The reinforcement learning device is configured to provide a transmission rate to the transmission information device according to the initial transmission state and the transmission result provided by the feedback device such that the transmission rate of the transmission information device conforms to the plurality of channels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多鏈路傳輸系統</p>  
        <p type="p">110:傳輸資訊裝置</p>  
        <p type="p">120:強化學習裝置</p>  
        <p type="p">130:回饋裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="64" publication-number="202620519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及其陣列基板</chinese-title>  
        <english-title>DISPLAY PANEL AND ARRAY SUBSTRATE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241106B">G02F1/1335</main-classification>  
        <further-classification edition="200601120241106B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀚宇彩晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>焦佑麒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIAO, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳一通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JHIH-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅世鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, SHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳炯璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種顯示面板及其陣列基板，該陣列基板包括一基板及多個像素單元，該基板具有彼此平行相對的二表面，該些多個像素單元設置於該基板上，該些多個像素單元中的至少一者包括：一主動元件、一反射結構及一絕緣結構，該反射結構具有重疊的一反射層及一像素電極，該反射結構鄰設於該基板的該二表面中的一者，該絕緣結構設置於該主動元件周圍，該絕緣結構具有至少一導接孔，該主動元件與該像素電極經該至少一導接孔相互電連接。藉此，可有效降低反射層製作品質受到製程影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel and an array substrate thereof are disclosed, which includes a substrate and a plurality of pixel units, wherein the substrate has two surfaces that are parallel and opposite to each other, the plurality of pixel units are disposed on the substrate, and at least one of the plurality of pixel units includes an active element, a reflective structure, and an insulation structure, wherein the reflective structure has a reflective layer and a pixel electrode overlapping with each other and is adjacent to one of the two surfaces of the substrate, the insulation structure is disposed around the active element and has at least one conductive hole, and the active element and the pixel electrode are electrically connected to each other through the at least one conductive hole. This way, the impact of the manufacturing process on the production quality of the reflective layer can be effectively reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:顯示面板</p>  
        <p type="p">4A:陣列基板</p>  
        <p type="p">4B:彩膜基板</p>  
        <p type="p">4C:顯示介質層</p>  
        <p type="p">41:基板</p>  
        <p type="p">42:主動元件</p>  
        <p type="p">43:反射結構</p>  
        <p type="p">431:反射層</p>  
        <p type="p">432:像素電極</p>  
        <p type="p">44:絕緣結構</p>  
        <p type="p">441、442:無機材料層</p>  
        <p type="p">44a:導接孔</p>  
        <p type="p">45:有機材料層</p>  
        <p type="p">L1、L2:光線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="65" publication-number="202621400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種提升透射窗之光熱輻射透射率應用於氣密反應腔體的裝置與方法</chinese-title>  
        <english-title>A DEVICE AND METHOD FOR INCREASING PHOTOTHERMAL RADIATION TRANSMISSION RATE OF TRANSMISSION WINDOW OF AN AIRTIGHT ENCLOSED CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="200601120260223B">H05B6/00</further-classification>  
        <further-classification edition="200601120260223B">F16J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">以光熱輻射為加熱源之半導體氣密反應腔體若因物理與或化學乃至成本等等自然與或社會因素，而需隔絕光熱輻射之加熱源（以下簡稱光熱輻射源）於氣密反應腔體內環境之外，為使光熱輻射源之光熱輻射能量與/或功率與/或功率密度得以投射光熱輻射能量與/或功率與/或功率密度至氣密反應腔體內之被加熱物，需一具備良好光熱輻射透射率特性之透射窗使能達成前述目的。習知技術使用的透射窗因獨具邊緣支撐氣密反應腔體內外氣壓差而使透射窗受材料力學與結構力學之極限而受侷限在一厚度以上，本發明旨在透過創新設計突破該侷限性，不只顯著降低透射窗厚度將低材料成本，對光熱輻射透射率的提升降低運作成本，光熱輻射透射材料選擇範圍的擴增，使可大幅提高光熱輻射源對氣密反應腔體內被加熱物的加熱溫度上限，以及大幅減少氣密反應腔體內對透射窗內側表面被本發明所獲致大幅降溫效果後之反應副產品的大幅減少乃至斷絕，帶給產業界關於設備妥善率，半導體製造良率與維修成本的顯著優化等等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">For any airtight reaction chamber using photothermal radiation as the heating source in semiconductor application which needs to keep the photothermal radiation heating source(s) outside from of the airtight reaction chamber for isolation from physical and/or chemical reaction, or any other reason, in order to make the photothermal radiation of the thermal radiation heating source can project photothermal radiation energy and/or power onto the heated object in the airtight reaction chamber. A transmission window with good photothermal radiation transmission characteristics is required to achieve the aforementioned purpose. The transmission window used in the conventional technology is limited to a thickness of no less than a certain thickness due to the air pressure difference between the inside and outside of the airtight reaction chamber with simple support, ie. , the thickness of the transmission window is subject to the limits of material mechanics and structural mechanics. The present invention aims to break through this problem through innovative design. Limitations, not only significantly reducing the thickness of the transmission window will lower the material costs directly, but also improving the photothermal radiation transmittance and reducing operating costs as well. The expansion of the selection range of photothermal radiation transmission materials can greatly increase the photothermal radiation as a heating source for airtightness. The upper limit of the heating temperature of the object to be heated in the reaction chamber, as well as the significant reduction or even elimination of reaction by-products after the inner surface of the transmission window is greatly cooled in the airtight reaction chamber, has brought to the industry concerns about equipment availability and semiconductor manufacturing yield with significant optimization of maintenance costs, and so on.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">01:一或多個光熱輻射源</p>  
        <p type="p">02:一或多個光熱輻射源基座</p>  
        <p type="p">03:一或多個透射窗固定座</p>  
        <p type="p">04:氣密反應腔體</p>  
        <p type="p">05:一或多個吹掃與/或清潔與/或稀釋與/或隔離與/或惰性氣體入口通道</p>  
        <p type="p">06:一或多個吹掃與/或清潔與/或稀釋與/或隔離與/或惰性與/或反應氣體入口通道</p>  
        <p type="p">07:一或多個透射窗</p>  
        <p type="p">08:一或多個吹掃與/或清潔與/或稀釋與/或隔離與/或惰性氣體出口通道</p>  
        <p type="p">09:一或多個吹掃與/或清潔與/或稀釋與/或隔離與/或惰性與/或反應氣體出口通道</p>  
        <p type="p">10:一或多個光熱輻射場</p>  
        <p type="p">11:固定一或多個光熱輻射源基座與氣密反應腔體之緊固元件</p>  
        <p type="p">12:固定一或多個透射窗與氣密反應腔體之緊固元件</p>  
        <p type="p">13:使一或多個透射窗與氣密反應腔體之間達成氣密條件之密封元件</p>  
        <p type="p">14:一或多個基片</p>  
        <p type="p">16:固定一或多個透射窗固定座於一或多個光熱輻射源基座之固定座</p>  
        <p type="p">17:固定一或多個透射窗之固定座於光熱輻射源基座之固定座的緊固元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="66" publication-number="202621159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運用統計數據取得功率補償值的方法與無線通訊模組</chinese-title>  
        <english-title>METHOD FOR OBTAINING POWER COMPENSATION VALUES WITH STATISTICAL DATA AND WIRELESS COMMUNICATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250203B">H04W52/18</main-classification>  
        <further-classification edition="200901120250203B">H04W52/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUREWAVE TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓定衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, TING-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳悟一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡馨尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HSIN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>危宇甜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YU-TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪偉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種運用統計數據取得功率補償值的方法與無線通訊模組，無線通訊模組中的無線通訊電路通過天線發送具有一發射功率的無線射頻訊號，以及以一記憶體儲存運用統計數據得出此無線通訊模組的一組功率補償值。其中得出多個功率補償值的方法包括，先取得多個無線通訊模組在多個頻率下的功率補償值的統計數據，根據統計數據中每個頻率下的多個功率補償值的數據特徵估算出各無線通訊模組在每個頻率的一筆功率補償值，再將對應多個頻率的多個功率補償值寫入記憶體中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for obtaining power compensation values with statistical data and a wireless communication module are provided. The wireless communication module includes a wireless communication circuit that transmits wireless radio-frequency signals with a transmitting power, and a memory used to store a set of power-compensation values that are obtained using statistical data under multiple frequencies. In the method, the statistical data of the power-compensation values under multiple frequencies for the multiple wireless communication modules is obtained, the data characteristics of the statistical data is referred to for estimating a power-compensation value corresponding to each frequency of the wireless communication module. After that, the multiple power-compensation values are written into the memory of the wireless communication module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:測試平台</p>  
        <p type="p">201:測試儀器</p>  
        <p type="p">207:運算電路</p>  
        <p type="p">203:統計表</p>  
        <p type="p">205:功率補償清單</p>  
        <p type="p">200:無線通訊模組</p>  
        <p type="p">211:無線通訊電路</p>  
        <p type="p">213:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="67" publication-number="202620308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">F16C11/04</main-classification>  
        <further-classification edition="200601120250109B">G06F1/16</further-classification>  
        <further-classification edition="200601120250109B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮睦淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONG, MU-CHERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宗儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TSUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括一第一主體、一第二主體、一樞軸模組及一連接殼體。第二主體可樞轉地連接於第一主體。樞軸模組包括一第一扭力部及一第二扭力部。第一扭力部的轉動扭力小於第二扭力部的轉動扭力。部分的樞軸模組可動地位於連接殼體內。連接殼體包括一第一連接殼體、一第二連接殼體及一第三連接殼體。第一連接殼體可動地連接於第一主體且可動地連接於第二連接殼體。第三連接殼體及可動地連接於第二主體，且可動地連接於第二連接殼體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a first body, a second body, a pivot module and a connection casing is provided. The second body is pivotably connected to the first body. The pivot module includes a first torsion portion and a second torsion portion. A rotational torsion of the first torsion portion is smaller than a rotational torsion of the second torsion portion. Part of the pivot module is movably located in the connection casing. The connection casing includes a first connection casing, a second connection casing and a third connection casing. The first connection casing is movably connected to the first body and is movably connected to the second connection casing. The third connection casing is movably connected to the second body and is movably connected to the second connection casing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M1:第一狀態</p>  
        <p type="p">S1、S2、S3、S4:壁面</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">110:第一主體</p>  
        <p type="p">120:第二主體</p>  
        <p type="p">121:顯示模組</p>  
        <p type="p">122:顯示面</p>  
        <p type="p">123:主體殼體</p>  
        <p type="p">130:樞軸模組</p>  
        <p type="p">131:第一扭力部</p>  
        <p type="p">132:第二扭力部</p>  
        <p type="p">133:第一連接件</p>  
        <p type="p">134:第二連接件</p>  
        <p type="p">135:第三連接件</p>  
        <p type="p">140:連接殼體</p>  
        <p type="p">141:第一連接殼體</p>  
        <p type="p">142:第二連接殼體</p>  
        <p type="p">1421、1422:凹溝</p>  
        <p type="p">1423:開槽</p>  
        <p type="p">143:第三連接殼體</p>  
        <p type="p">144:外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="68" publication-number="202620606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其檢測方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND DETECTION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G06F3/041</main-classification>  
        <further-classification edition="200601120241204B">G06F11/273</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭玠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIEH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高煒盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐懿丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, YI-DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括面板與電路板。面板包括基板、第一信號傳遞線、控制線、複數條第一共同電壓線、複數個第一開關元件與驅動晶片。基板包括主動區與鄰近主動區的周邊區。第一信號傳遞線與控制線設置於周邊區。第一共同電壓線設置於主動區。第一開關元件耦接於第一共同電壓線與第一信號傳遞線之間。在顯示階段，電路板透過控制線提供第一電壓至第一開關元件，使第一共同電壓線耦接第一信號傳遞線。在感測階段，驅動晶片提供感測信號至第一共同電壓線，電路板透過控制線提供第二電壓至第一開關元件，使第一共同電壓線不耦接第一信號傳遞線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a panel and a circuit panel. The panel includes a substrate, a first signal transmission line, a control line, first common voltage lines, first switch components and a driving chip. The substrate includes an active area and a peripheral area surrounding the active area. The first signal transmission signal line and the control signal line are disposed in the peripheral area. The first common voltage lines are disposed in the active area. The first switch components are coupled between the first common voltage lines and the first signal transmission line. In a display mode, the circuit board provides a first voltage to the first switch components through the control line, so that the first common voltage lines are coupled to the first signal transmission line. In a sensing mode, the driving chip provides a sensing signal to the first common voltage lines, the circuit board provides a second voltage to the first switch components through the control line, so that the first common voltage lines are not coupled to the first transmission line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:面板</p>  
        <p type="p">120:基板</p>  
        <p type="p">121:主動區</p>  
        <p type="p">122:周邊區</p>  
        <p type="p">123:第一側</p>  
        <p type="p">124:第二側</p>  
        <p type="p">130:第一信號傳遞線</p>  
        <p type="p">132:控制線</p>  
        <p type="p">134:第一共同電壓線</p>  
        <p type="p">140:驅動晶片</p>  
        <p type="p">150:電路板</p>  
        <p type="p">160:第二信號傳遞線</p>  
        <p type="p">162:第二共同電壓線</p>  
        <p type="p">170,194,196,198:連接墊</p>  
        <p type="p">180:第一共同電極</p>  
        <p type="p">182:第二共同電極</p>  
        <p type="p">184:第一通孔</p>  
        <p type="p">186:第二通孔</p>  
        <p type="p">187:像素</p>  
        <p type="p">188:掃描線</p>  
        <p type="p">189:數據線</p>  
        <p type="p">190:第一開關元件</p>  
        <p type="p">192:第二開關元件</p>  
        <p type="p">D1,D2:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="69" publication-number="202620266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用水溶解布的鏤空繩繡工藝</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">D05C7/08</main-classification>  
        <further-classification edition="200601120241204B">D05C17/00</further-classification>  
        <further-classification edition="200601120241204B">A43D8/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉健煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉健煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之利用水溶解布的鏤空繩繡工藝，其係將一設計圖案繩繡繡於一水溶解布上，該設計圖案繩繡與水溶解布一起結合於物件本體，然後以水沖洗，水溶解布溶解脫落，該設計圖案繩繡形成鏤空狀態直接結合於物件本體，乾燥後即成為具有設計圖案的鏤空繩繡工藝；本發明之利用水溶解布的鏤空繩繡工藝，以水溶解布作為設計圖案繩繡的承載體，可以準確有效地將設計圖案繩繡與物件本體固定結合，再利用水溶解布的水溶解特性，去除水溶解布，有效達成製作鏤空繩繡工藝的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:設計圖案繩繡</p>  
        <p type="p">11:車縫線</p>  
        <p type="p">2:水溶解布</p>  
        <p type="p">3:物件本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="70" publication-number="202620656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機板及具有此主機板之電子裝置</chinese-title>  
        <english-title>MAIN BOARD AND ELECTRONIC DEVICE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F13/38</main-classification>  
        <further-classification edition="200601120250203B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒秉翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, PING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬立謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, LI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種主機板。此主機板包含一板體、一中央處理單元插槽、一記憶體插槽、複數訊號傳輸線路以及一時鐘驅動器。其中，中央處理單元插槽設於板體，且適於安裝一中央處理單元。記憶體插槽設於板體，且適於安裝一記憶體。複數訊號傳輸線路設於板體。中央處理單元插槽係透過複數訊號傳輸線路電性連接於記憶體插槽，且複數訊號傳輸線路包含一第一時鐘線路，第一時鐘線路適於傳送一時鐘訊號。時鐘驅動器設於第一時鐘線路。本案並提供具有此主機板之一電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A main board comprising a board body, a CPU slot, a memory slot, a plurality signal transmission routes, and a clock driver is provided. The CPU slot is disposed on the board body and is adapted to connect a CPU, the memory slot is disposed on the board body and is adapted to connect a memory. The plurality of signal transmission routes is disposed on the board body. The CPU slot is electrically coupled to the memory slot through the plurality of the signal transmission routes, and the plurality of signal transmission routes comprises a first clock route, which is adapted to transmit a clock signal. The clock driver is disposed on the first clock route. An electronic device having the main board is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機板</p>  
        <p type="p">120:中央處理單元插槽</p>  
        <p type="p">130:記憶體插槽</p>  
        <p type="p">140:訊號傳輸線路</p>  
        <p type="p">142:第一時鐘線路</p>  
        <p type="p">150:時鐘驅動器</p>  
        <p type="p">144:第一控制線路</p>  
        <p type="p">170:記憶體偵測單元</p>  
        <p type="p">CK:時鐘訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="71" publication-number="202621143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊方法及通訊系統</chinese-title>  
        <english-title>COMMUNICATION METHOD AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250203B">H04W24/10</main-classification>  
        <further-classification edition="202301120250203B">H04W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種通訊方法及通訊系統。通訊方法包括：配置用戶設備與基地台依據預定配置資料進行通訊，預定配置資料中定義指示預先配置傳送策略或競爭傳送策略的量測間隙傳輸規範，且基地台為每一用戶設備分配周期性的多個量測間隙及多個傳送資源；以及配置每一用戶設備在判斷有當前量測間隙發生時，判斷當前量測間隙是否與任一該些傳送資源衝突；響應於判斷當前量測間隙與任一該些傳送資源衝突，則依據量測間隙傳輸規範，利用當前量測間隙進行資料傳輸；及響應於判斷當前量測間隙並未與傳送資源衝突，則利用當前量測間隙進行通道品質量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and a communication system are provided. The communication method includes: configuring a user equipment to communicate with a base station according to predetermined configuration data that defines a measurement gap transmission specification indicating a preconfigured transmission strategy or a competitive transmission strategy, and the base station allocates a plurality of periodic measurement gaps and a plurality of transmission resources to each user equipment; configuring each user equipment to determine whether a current measurement gap conflicts with any of the transmission resources when determining that a current measurement gap occurs; in response to determining that the current measurement gap conflicts with any of the transmission resources, using the current measurement gap for data transmission according to the measurement gap transmission specification; and in response to determining that the current measurement gap does not conflict with any of the transmission resources, using the current measurement gap to perform channel quality measurement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="72" publication-number="202621218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉接模組、機箱及資料處理裝置</chinese-title>  
        <english-title>ADAPTER MODULE, CHASSIS AND DATA PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">H05K7/10</main-classification>  
        <further-classification edition="200601120241128B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃威立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉接模組，適於設置於一殼體中且與至少一電子組件電性連接或電性斷開。轉接模組包含一托架以及一操作件。操作件設置於托架上。當操作件位於一鎖定位置時，托架與殼體鎖定，且至少一電子組件與轉接模組電性連接。當至少一電子組件與轉接模組電性斷開時，操作件可自鎖定位置轉換至一釋鎖位置而使托架自殼體釋鎖。轉接模組可應用於機箱與資料處理裝置，以方便元件的維修與替換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adapter module is adapted to be disposed in a casing and is electrically connected with or electrically disconnected from at least one electronic component. The adapter module includes a bracket and an operating member. The operating member is disposed on the bracket. When the operating member is located at a locked position, the bracket and the casing are locked and the at least one electronic component is electrically connected to the adapter module. When the at least one electronic component is electrically disconnected from the adapter module, the operating member is able to be converted from the locked position to an unlocked position to unlock the bracket from the casing. The adapter module may be applied to a chassis and a data processing device to facilitate component maintenance and replacement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:機箱</p>  
        <p type="p">14:電子組件</p>  
        <p type="p">120:殼體</p>  
        <p type="p">122,124:轉接模組</p>  
        <p type="p">1200,1204:卡合孔</p>  
        <p type="p">1202:組裝槽</p>  
        <p type="p">1206:組裝孔</p>  
        <p type="p">1220,1240:托架</p>  
        <p type="p">1248:框架</p>  
        <p type="p">1250:電源夾</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="73" publication-number="202621332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件</chinese-title>  
        <english-title>LIGHT-EMITTING ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/85</main-classification>  
        <further-classification edition="202501120250102B">H10H20/851</further-classification>  
        <further-classification edition="200601120250102B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭豐榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, FENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂啟揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘佳杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, JIA-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, WEI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱榮堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, JUNG-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李名京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光元件，包括光源以及覆蓋光源的封裝層。發光元件的能量功率分布曲線具有一凹部，且所述凹部位於1.4 eV至1.6 eV之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting element includes a light source and an encapsulation layer covering the light source. An energy power distribution curve of the light-emitting element has a concave portion located between 1.4 eV and 1.6 eV.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:能量功率分布曲線</p>  
        <p type="p">2022:凹部</p>  
        <p type="p">A:斜率轉折點</p>  
        <p type="p">B:斜率轉折點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="74" publication-number="202619742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>促進苷氨酸－Ｎ－甲基轉移酶表現之組成物</chinese-title>  
        <english-title>COMPOSITIONS FOR PROMOTING THE EXPRESSION OF GLYCINE N-METHYLTRANSFERASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K36/65</main-classification>  
        <further-classification edition="200601120250501B">A61K36/79</further-classification>  
        <further-classification edition="200601120250501B">A61K36/258</further-classification>  
        <further-classification edition="200601120250501B">A61P1/16</further-classification>  
        <further-classification edition="200601120250501B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤生生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE ONE BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-MING ARTHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含白芍萃取物、五味子萃取物、石榴萃取物以及人蔘萃取物之組成物。該組成物或是包含該組成物的營養補充品、醫藥組成物可顯著促進個體苷氨酸-N-甲基轉移酶之表現，因而可應用於抗老化、脂肪肝或肝癌等營養補充品或醫藥品之產品上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a composition comprising extracts of White peony root (&lt;i&gt;Paeonia lactiflora&lt;/i&gt;), Schisandra Fructus (&lt;i&gt;Schisandra chinensis&lt;/i&gt;), pomegranate (&lt;i&gt;Punica granatum&lt;/i&gt;), and ginseng (&lt;i&gt;Panax ginseng&lt;/i&gt; C.A. Meyer). The composition, or dietary supplements and pharmaceutical compositions containing them can significantly increase the expression of glycine-N-methyltransferase (GNMT) in individuals. These unique characteristics make the present invention applicable to developing dietary supplements and pharmaceuticals for anti-aging, fatty liver, or liver cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="75" publication-number="202620605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電路及其操作方法</chinese-title>  
        <english-title>DRIVING CIRCUIT AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250303B">G06F3/0362</main-classification>  
        <further-classification edition="201301120250303B">G06F3/048</further-classification>  
        <further-classification edition="200601120250303B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林吳維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適用於旋鈕設備的驅動電路及其操作方法。驅動電路包括多個觸碰感應電極以及控制電路。旋鈕設備包括旋鈕以及觸控面板。旋鈕設置於觸控面板上。多個觸碰感應電極以及控制電路設置於觸控面板中。多個觸碰感應電極耦接觸控面板中的多個像素開關。控制電路耦接多個觸碰感應電極。控制電路在觸碰期間中，提供偏置電壓至多個觸碰感應電極中的第一觸碰感應電極，以使第一觸碰感應電極所耦接的第一像素開關根據觸碰控制信號以及偏置電壓維持被關斷。如此，驅動電路能夠避免旋鈕設備的視覺效果在觸碰期間中發生異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving circuit and an operating method thereof which are suitable for a knob apparatus are provided. The driving circuit includes multiple touch-sensing electrodes and a controlling circuit. The knob apparatus includes a knob and a touch panel. The knob is disposed on the touch panel. The touch-sensing electrodes and the controlling circuit are disposed in the touch panel. The touch-sensing electrodes are coupled to multiple pixel switches of the touch panel. The controlling circuit is coupled to the touch-sensing electrodes. During a touch period, the controlling circuit provides an offset voltage to a first touch-sensing electrode of the touch-sensing electrodes, such that a first pixel switch coupled to the first touch-sensing electrode maintains being turned off according to a touch-controlling signal and the offset voltage. Thereby, the driving circuit is capable of avoiding a visual effect of the knob apparatus being abnormal during the touch period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:旋鈕設備</p>  
        <p type="p">100:驅動電路</p>  
        <p type="p">110:觸控面板</p>  
        <p type="p">111a~111N:觸碰感應電極</p>  
        <p type="p">121a~122N、122M:像素開關</p>  
        <p type="p">130:控制電路</p>  
        <p type="p">KB:旋鈕</p>  
        <p type="p">S1:偏置電壓</p>  
        <p type="p">SGT:觸碰控制信號</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="76" publication-number="202621082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種乙太網路電源供應器、降壓控制電路及其控制方法</chinese-title>  
        <english-title>AN ETHERNET POWER SOURCE EQUIPMENT, VOLTAGE REDUCTION CONTROL CIRCUIT AND METHOD OF CONTROL THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04L12/10</main-classification>  
        <further-classification edition="200601120250203B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜冠賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, KUAN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林軒辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSUAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種乙太網路電源供應器用以耦接負載設備，且乙太網路電源供應器包括電源供應裝置、輸出控制電路、路徑控制電路及控制模組。當輸出控制電路偵測負載設備未耦接乙太網路電源供應器的輸出端時，路徑控制電路斷路輸出端至控制模組的供電路徑，且輸出控制電路將輸出電壓調整至第一電壓，以使控制模組進入禁用狀態。當輸出控制電路偵測負載設備耦接輸出端時，路徑控制電路短路供電路徑，且輸出控制電路將輸出電壓調整至該第二電壓，以使控制模組進入啟用狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An Ethernet power source equipment is configured to be coupled to a powered device, and the Ethernet power source equipment includes a power supply device, an output control circuit, a path control circuit and a control module. When the output control circuit detects that the powered device is not coupled to an output end of the Ethernet power source equipment, the path control circuit break-circuits a power supply path from the output end to the control module, and the output control circuit adjusts an output voltage to a first voltage, so that the control module enters a disabled state. When the output control circuit detects that the powered device is coupled to the output end, the path control circuit short-circuits the power supply path, and the output control circuit adjusts the output voltage to a second voltage, so that the control module enters an enabled state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Bn:第一端</p>  
        <p type="p">Bp:第二端</p>  
        <p type="p">4:輸出控制電路</p>  
        <p type="p">40:分壓電路</p>  
        <p type="p">42:穩壓電路</p>  
        <p type="p">44:回授電路</p>  
        <p type="p">46:箝位電路</p>  
        <p type="p">Vo:輸出電壓</p>  
        <p type="p">Vo1:第一電壓</p>  
        <p type="p">Vo2:第二電壓</p>  
        <p type="p">Vz:箝位電壓</p>  
        <p type="p">Vr:穩壓電壓</p>  
        <p type="p">Ss:偵測訊號</p>  
        <p type="p">Sf:回授訊號</p>  
        <p type="p">Sf1:第一回授訊號</p>  
        <p type="p">Sf2:第二回授訊號</p>  
        <p type="p">R:阻抗</p>  
        <p type="p">R1:第一阻抗</p>  
        <p type="p">R2:第二阻抗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="77" publication-number="202619862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械手臂的控制方法及其控制系統</chinese-title>  
        <english-title>CONTROL METHOD FOR ROBOTIC ARM AND CONTROL SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25J9/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達明機器人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHMAN ROBOT INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李慶韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奎佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUEI-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一方面提出一種機械手臂的控制方法。控制方法包括利用驅動器輸出第一驅動力以控制機械手臂位於第一位置，利用驅動器輸出第二驅動力以控制機械手臂位於第二位置。第二位置不同於第一位置。控制方法同樣包括第一驅動力與第二驅動力分別包含抗摩擦力及運動力。抗摩擦力大於運動力。控制方法同樣包括利用控制迴路、第一位置與第二位置調整第二驅動力，以控制機械手臂。第一位置與第二位置相關於機械手臂的摩擦力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control method of a robotic arm is provided by an aspect of the present disclosure. The control method comprises using a driver for outputting a first driving force to control the robotic arm held in a first position, and using the driver for outputting a second driving force to control the robotic arm held in a second position. The second position is different to the first position. The control method also comprises the first driving force and the second driving force respectively having an anti-friction force and a motion force. The anti-friction force is greater than the motion force. The control method also comprises using a control loop, the first position and the second position for adjusting the second driving force to control the robotic arm. The first position and the second position are related to a friction force of the robotic arm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:控制系統</p>  
        <p type="p">110:增益調整模組</p>  
        <p type="p">111:增益映射曲線</p>  
        <p type="p">120:控制器</p>  
        <p type="p">130:速度控制器</p>  
        <p type="p">130S:速度控制訊號</p>  
        <p type="p">140:電流控制器</p>  
        <p type="p">150:速度計算器</p>  
        <p type="p">200:機械手臂</p>  
        <p type="p">210:關節馬達</p>  
        <p type="p">220:位置編碼器</p>  
        <p type="p">230:電流感知器</p>  
        <p type="p">Ctrl_Crt:控制電流</p>  
        <p type="p">G_Now:當下增益值</p>  
        <p type="p">Motor_Crt:馬達電流</p>  
        <p type="p">Pos:轉動狀態</p>  
        <p type="p">Pos_Actual:實際位置資訊</p>  
        <p type="p">Pos_Cmd:命令位置資訊</p>  
        <p type="p">Pos_Err:位置絕對差值</p>  
        <p type="p">Spd_Actual:實際速度資訊</p>  
        <p type="p">Spd_Ctrl:速度控制資訊</p>  
        <p type="p">Spd_Diff:速度絕對差值</p>  
        <p type="p">Tor_Actual:實際力矩資訊</p>  
        <p type="p">Tor_Cmd:力矩命令資訊</p>  
        <p type="p">Tor_Cmd_Last:前次力矩命令資訊</p>  
        <p type="p">Tor_Cmd_Now:當下力矩命令資訊</p>  
        <p type="p">Tor_Diff:力矩絕對差值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="78" publication-number="202621324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能光伏板層壓前的一體化封裝設備</chinese-title>  
        <english-title>INTEGRATIVE PACKAGING EQUIPMENT FOR SOLAR PV PANEL BEFORE LAMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10F71/00</main-classification>  
        <further-classification edition="202501120260223B">H10F10/00</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威光自動化科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAS AUTOMATION CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭冠群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUAN-CHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭富元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈維揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種太陽能光伏板層壓前的一體化封裝設備，包括在一機檯上形成X軸向的一主輸送道，用以間隔佈設多個複材加工區，該主輸送道滑組一底玻上料平檯和一背玻上料平檯，該主輸送道並銜接一膠膜作業區；該主輸送道和該底玻上料平檯之間配置有一底玻傳動器，用以帶動一底玻移動進、出所述複材加工區；該膠膜作業區配置有一膠膜傳動器，用以搬運該適應性膠膜沿該X軸向複合於該底玻上；該背玻上料平檯配置有一背玻傳動器，用以帶動該背玻貼附於該底玻上，據以節省設備的配置空間並縮減加工工時。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an integrative packaging equipment for solar PV panel before lamination, including a housing, a main conveyor is formed in the housing along X-axis, multiple working areas of composites are arranged at the main conveyor, a bottom glass feeding platform and a back glass feeding platform are slid on the main conveyor, a film operation area is connected with main conveyor; and a bottom glass actuator is arranged between the main conveyor and the bottom glass feeding platform, so as to drive a bottom glass moves in and out of the multiple working areas of composites; a film actuator is arranged on the film operation area, so as to transport an adaptive film to paste on the bottom glass along X-axis; so that, an arranger space og the packaging equipment can be frugal, and reduce processing man-hours of the PV panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機檯</p>  
        <p type="p">11:檯面</p>  
        <p type="p">20:主輸送道</p>  
        <p type="p">30:底玻上料平檯</p>  
        <p type="p">40:膠膜作業區</p>  
        <p type="p">41:膠膜傳動器</p>  
        <p type="p">42:膠膜裁孔機</p>  
        <p type="p">421:驅動樁</p>  
        <p type="p">422:鉆檯</p>  
        <p type="p">43:膠膜裁邊機</p>  
        <p type="p">44:膠膜擷取器</p>  
        <p type="p">45:膠膜供料機</p>  
        <p type="p">462:動力拉料滑檯</p>  
        <p type="p">47:膠膜裁斷機</p>  
        <p type="p">60:複材加工區</p>  
        <p type="p">61:絕緣膠帶貼帶機</p>  
        <p type="p">62:匯流條貼帶機</p>  
        <p type="p">63:引流條貼帶機</p>  
        <p type="p">64:防水膠帶貼帶機</p>  
        <p type="p">80:底玻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="79" publication-number="202621401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撕膜機</chinese-title>  
        <english-title>FILM PEELER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">B32B38/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志聖工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C SUN MFG. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林英菘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊佳裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃梓銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種撕膜機，包含基板支撐件及撕膜裝置。撕膜裝置可與基板支撐件相對移動，且撕膜裝置包含基座、膠帶饋送機構及旋轉動力源。基座對應基板支撐件設置。膠帶饋送機構包含可旋轉地設置於基座的膠帶饋送件、膠帶供給件及膠帶捲收件。旋轉動力源與膠帶饋送件連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A film peeler includes a substrate carrier and a film peeling device. The film peeling device is movable relative to the substrate carrier, and the film peeling device includes a base, a tape feed mechanism, and a rotary power source. The base is disposed corresponding to the substrate carrier. The tape feed mechanism includes a tape feeder, a tape mounting member and a tape rewinding member rotatably disposed on the base. The rotary power source is connected to the tape feeder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:撕膜機</p>  
        <p type="p">10:基板支撐件</p>  
        <p type="p">20:撕膜裝置</p>  
        <p type="p">210:基座</p>  
        <p type="p">220:膠帶饋送機構</p>  
        <p type="p">221:膠帶饋送件</p>  
        <p type="p">221a:膠帶拾取單元</p>  
        <p type="p">221b:膠帶饋送單元</p>  
        <p type="p">222:膠帶供給件</p>  
        <p type="p">223:膠帶捲收件</p>  
        <p type="p">230:旋轉動力源</p>  
        <p type="p">240:第一張力控制結構</p>  
        <p type="p">241:第一膠帶捲徑檢測器</p>  
        <p type="p">242:第一轉矩馬達</p>  
        <p type="p">250:第二張力控制結構</p>  
        <p type="p">251:第二膠帶捲徑檢測器</p>  
        <p type="p">252:第二轉矩馬達</p>  
        <p type="p">260:膜料檢測器</p>  
        <p type="p">270:動力源</p>  
        <p type="p">30:膠帶料卷</p>  
        <p type="p">40:捲收膜卷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="80" publication-number="202621351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溝槽式電容結構及其製造方法</chinese-title>  
        <english-title>TRENCH CAPACITANCE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10N97/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳輝煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HWI-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林維昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溝槽式電容結構包括具有溝槽的矽基底、數個多晶矽間隙壁、數個導電部以及介電層。多晶矽間隙壁設置於溝槽內，以將該溝槽隔成數個狹縫，且每個多晶矽間隙壁的底部與矽基底接觸。導電部則形成於狹縫中。介電層設置於多晶矽間隙壁與導電部之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A trench capacitance structure includes a silicon substrate with a trench, a plurality of polysilicon spacers, a plurality of conductive portions, and a dielectric layer. The plurality of polysilicon spacers is disposed in the trench in order to partition the trench into a plurality of slits, and each of the polysilicon spacers contacts with the silicon substrate. The plurality of conductive portions is formed in the plurality of slits. The dielectric layer is disposed between the plurality of polysilicon spacers and the plurality of conductive portions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:矽基底</p>  
        <p type="p">102:多晶矽間隙壁</p>  
        <p type="p">104:介電層</p>  
        <p type="p">C1、C2:導電部</p>  
        <p type="p">C1t、C2t:頂面</p>  
        <p type="p">s1、s2:狹縫</p>  
        <p type="p">t1、t2:厚度</p>  
        <p type="p">T1、T2:溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="81" publication-number="202621349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電流誘發翻轉之氧化物人工反鐵磁自旋軌道結構</chinese-title>  
        <english-title>CURRENT-INDUCED SYNTHETIC ANTIFERROMAGNETIC SPIN-ORBIT TORQUE STRUCTURE WITH AN OXIDE SPACER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250122B">H10N50/80</main-classification>  
        <further-classification edition="202301120250122B">H10N50/10</further-classification>  
        <further-classification edition="202301120250122B">H10B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾院介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種具有人工反鐵磁結構的自旋軌道矩磁性元件，包含一自旋軌道矩層來提供一自旋電流、一由第一鐵磁層、氧化鎳交換耦合層以及第二鐵磁層堆疊而成的人工反鐵磁結構、以及一覆蓋層位於該人工反鐵磁結構上。此氧化物人工反鐵磁結構之磁電裝置，經電流誘發自旋軌道矩，可實現零場翻轉，並可作為磁阻式隨機存取記憶體（MRAM）之自由層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spin-orbit torque (SOT) magnetic device with synthetic antiferromagnetic (SAF) structure, including a SOT layer for providing a spin current, a SAF structure composed of a first ferromagnetic layer, a nickel oxide (NiO) exchange coupling layer and a second ferromagnetic layer, and a capping layer on the SAF structure. This magnetoelectric device of oxide SAF structure can achieve zero-field flipping through current-induced SOT, and can be used as the free layer of a magnetoresistive random access memory (MRAM)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:SOT磁性元件</p>  
        <p type="p">100:自旋軌道矩層</p>  
        <p type="p">104:第一鐵磁層</p>  
        <p type="p">106:氧化鎳交換耦合層</p>  
        <p type="p">108:第二鐵磁層</p>  
        <p type="p">110:人工反鐵磁結構</p>  
        <p type="p">112:覆蓋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="82" publication-number="202620954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有控溫與消防功能的電池模組與電池系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241230B">H01M10/60</main-classification>  
        <further-classification edition="201401120241230B">H01M10/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明曜科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETI CA BATTERY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳偉臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有控溫與消防功能的電池模組與電池系統，電池模組包含電池槽、多個電池芯和水冷板。電池槽的頂部敞開，電池芯設置在電池槽內的絕緣冷卻液中，水冷板則覆蓋於電池槽頂部。水冷板底部設有延伸至電池芯之間的間隙的多個導熱件，水冷板內設有冷卻通道並在水冷板兩側形成與冷卻通道連通的進水口與出水口，以造成冷卻水的循環流動來幫助散熱。水冷板底側設有與冷卻通道連通的開孔和將開孔密封的防水塞頭，防水塞頭會因高壓或高熱發生脫離或破壞，使冷卻通道內的冷卻水流入電池槽內，以對電池槽進行降溫，從而達到消防效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電池模組</p>  
        <p type="p">10:電池槽</p>  
        <p type="p">11:絕緣冷卻液</p>  
        <p type="p">12:開口</p>  
        <p type="p">20:電池芯</p>  
        <p type="p">30:水冷板</p>  
        <p type="p">31:導熱件</p>  
        <p type="p">32:冷卻通道</p>  
        <p type="p">33:進水口</p>  
        <p type="p">34:出水口</p>  
        <p type="p">35:開孔</p>  
        <p type="p">36:防水塞頭</p>  
        <p type="p">40:冷卻水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="83" publication-number="202619937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120241226B">B62M6/45</main-classification>  
        <further-classification edition="201301120241226B">B62K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車輛，包含一車架、一安裝於該車架上的乘坐單元、一安裝於該車架且低於該乘坐單元的置腳單元、一安裝於該車架並位於該乘坐單元下方的供電單元、一安裝於該車架且位於該供電單元下方的動力單元，及一固定於該動力單元，並用以運作而執行該動力單元的換檔作業的換檔單元。其中，該動力單元包括一連接於該供電單元的動力馬達。該換檔單元直接安裝於該動力單元，不僅安裝較為便利，在位置相對接近的情況下，即不需要透過鋼索的方式傳遞換檔的作動力，換檔作業也就不會因鋼索的狀態受到不良影響，故換檔操作更為精準可靠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:動力單元</p>  
        <p type="p">60:動力馬達</p>  
        <p type="p">61:馬達殼體</p>  
        <p type="p">62:傳動內蓋</p>  
        <p type="p">63:傳動外蓋</p>  
        <p type="p">7:換檔單元</p>  
        <p type="p">70:模組殼體</p>  
        <p type="p">71:作動馬達</p>  
        <p type="p">72:傳動機構</p>  
        <p type="p">721:傳遞齒輪</p>  
        <p type="p">7211:扇形齒</p>  
        <p type="p">7212:環形齒</p>  
        <p type="p">73:輸入件</p>  
        <p type="p">731:桿部</p>  
        <p type="p">74:位置感測器</p>  
        <p type="p">75:資訊輸出件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="84" publication-number="202620836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混和驅動式電子裝置</chinese-title>  
        <english-title>HYBRID DRIVE ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250512B">G09G3/3233</main-classification>  
        <further-classification edition="202501120250512B">H10H29/30</further-classification>  
        <further-classification edition="202301120250512B">H10K59/10</further-classification>  
        <further-classification edition="202001120250512B">H05B45/325</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUAN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含電子單元、積體電路、第一電晶體及第二電晶體。積體電路用以提供控制訊號。第一電晶體具有第一半導體、第一端、第二端以及第一控制端，其中第一端電連接至電源，第二端電連接至電子單元。第二電晶體具有第二半導體、第三端、第四端以及第二控制端，其中第三端用以接收控制訊號，第四端電連接至第一電晶體的第一控制端，且第二控制端用以接收開關訊號。第一電晶體具有第一通道寬長比，第二電晶體具有第二通道寬長比，且第一通道寬長比與第二通道寬長比的比值大於或等於0.03且小於或等於80.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes an electronic unit, an integrated circuit, a first transistor and a second transistor. The integrated circuit is configured to provide a control signal. The first transistor includes a first semiconductor, a first terminal, a second terminal and a first control terminal. The first terminal is electrically connected to a power source, the second terminal is electrically connected to the electronic unit. The second transistor includes a second semiconductor, a third terminal, a fourth terminal and a second control terminal. The third terminal is configured to receive the control signal, the fourth terminal is electrically connected to the first control terminal of the first transistor, and the second control terminal is configured to receive a switch signal. The first transistor has a first channel width-to-length ratio, the second transistor has a second channel width-to-length ratio, and a ratio of the first channel width-to-length ratio to the second channel width-to-length ratio is greater than or equal to 0.03 and less than or equal to 80.5</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">11:積體電路</p>  
        <p type="p">VS:控制訊號</p>  
        <p type="p">GL1-GL3:控制端</p>  
        <p type="p">E1-E6:端</p>  
        <p type="p">SCAN:開關訊號</p>  
        <p type="p">TP:掃描電晶體</p>  
        <p type="p">TS:開關電晶體</p>  
        <p type="p">TD:驅動電晶體</p>  
        <p type="p">VG:閘極電壓</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">CP:電容</p>  
        <p type="p">EC1:第一端</p>  
        <p type="p">EC2:第二端</p>  
        <p type="p">Id:電流</p>  
        <p type="p">12:電子單元</p>  
        <p type="p">13:脈衝幅度調製電路</p>  
        <p type="p">PX:像素</p>  
        <p type="p">PVDD、PVSS:電壓</p>  
        <p type="p">DATA:資料訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="85" publication-number="202619977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從含鉛鋅廢棄物分離回收氧化鋅與氧化鉛的方法</chinese-title>  
        <english-title>A METHOD OF SEPARATION AND RECOVERY OF ZINC OXIDE AND LEAD OXIDE FROM LEAD- AND ZINC- CONTAINING WASTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C01G9/02</main-classification>  
        <further-classification edition="200601120241205B">C01G21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN JHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韻璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUN-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種從含鉛鋅廢棄物分離回收氧化鋅與氧化鉛的方法，包括：將含鉛鋅廢棄物與硫酸鹽混合以進行硫酸化焙燒，得到硫酸鋅及硫酸鉛；對焙燒產物進行水浸漬後進行固液分離，得到含硫酸鋅的水浸漬液及含硫酸鉛的水浸漬液殘渣。在水浸漬液中添加氫氧化鈉以生成氫氧化鋅沉澱物，固液分離後再對氫氧化鋅沉澱物進行氧化焙燒，可獲得高品位之氧化鋅；對水浸漬殘渣進行氯化鈉浸漬處理後，添加碳酸鈉以生成碳酸鉛沉澱物，固液分離後再對碳酸鉛沉澱物進行氧化焙燒，可獲得高品位之氧化鉛。本發明的方法可以大量減少浸漬處理液及浸漬殘渣的處理成本，且可促進鋅及鉛金屬資源的回收循環再利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of separation and recovery of zinc oxide and lead oxide from lead- and zinc- containing waste, comprising: mixing lead- and zinc-containing waste with sulfate for sulfate roasting to obtain zinc sulfate and lead sulfate; leaching the roasted product with water, followed by solid-liquid separation to obtain leachate containing zinc sulfate and leaching residue containing lead sulfate. Sodium hydroxide is added to the leachate to produce the precipitate of zinc hydroxide, and the precipitate of zinc hydroxide is then subjected to solid-liquid separation, followed by oxidation roasting of the precipitate of zinc hydroxide to obtain high-grade zinc oxide. The leaching residue is leached with sodium chloride, followed by the addition of sodium carbonate to produce the precipitate of lead carbonate. The precipitate of lead carbonate is then subjected to solid-liquid separation, and the precipitate of lead carbonate is further processed through oxidation roasting to obtain high-grade lead oxide. The present method can significantly reduce the treatment costs of leaching solutions and leaching residues, and promote the recycling and reuse of zinc and lead metal resources.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a:含鉛鋅的廢棄物</p>  
        <p type="p">b:硫酸化焙燒產物</p>  
        <p type="p">c:水浸漬液</p>  
        <p type="p">d:水浸漬殘渣</p>  
        <p type="p">e:氫氧化鋅沉澱物</p>  
        <p type="p">f:氧化鋅</p>  
        <p type="p">g:氯化鈉浸漬液</p>  
        <p type="p">h:碳酸鉛沉澱物</p>  
        <p type="p">i:氧化鉛</p>  
        <p type="p">S1:硫酸化焙燒步驟</p>  
        <p type="p">S2:水浸漬步驟</p>  
        <p type="p">S3:固液分離步驟</p>  
        <p type="p">S4:氫氧化鈉沉澱步驟</p>  
        <p type="p">S5:第一氧化焙燒步驟</p>  
        <p type="p">S6:氯化鈉浸漬步驟</p>  
        <p type="p">S7:碳酸鈉沉澱步驟</p>  
        <p type="p">S8:第二氧化焙燒步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="86" publication-number="202621222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">H05K7/18</main-classification>  
        <further-classification edition="200601120250109B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹昕瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, THIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌裝置，包含一外軌單元、一中軌單元及一內軌單元。外軌單元包括一外軌，外軌具有一外第一端及一相反於外第一端的外第二端及至少一鄰近外第二端的外擋塊。中軌單元包括一可活動地設置於外軌的中軌及一樞設於中軌的卡掣件，中軌具有一鄰近外第一端的中第一端及一相反於中第一端的中第二端，卡掣件可受外擋塊擋止以防止中軌相對於外軌移動。內軌單元包括一可活動地設置於中軌的內軌及一設置於內軌的帶動件，當內軌自中第一端移動至中第二端的過程中，帶動件可推抵卡掣件向上樞轉以解除卡掣件與外擋塊的擋止關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:滑軌裝置</p>  
        <p type="p">1:外軌單元</p>  
        <p type="p">11:外軌</p>  
        <p type="p">111:活動面</p>  
        <p type="p">112:外第一端</p>  
        <p type="p">113:外第二端</p>  
        <p type="p">114:外擋塊</p>  
        <p type="p">12:外擋止件</p>  
        <p type="p">13:珠條</p>  
        <p type="p">14:外支撐件</p>  
        <p type="p">2:中軌單元</p>  
        <p type="p">21:中軌</p>  
        <p type="p">211:中外面</p>  
        <p type="p">212:中內面</p>  
        <p type="p">213:中第一端</p>  
        <p type="p">214:中第二端</p>  
        <p type="p">3:內軌單元</p>  
        <p type="p">31:內軌</p>  
        <p type="p">311:內中面</p>  
        <p type="p">33:操作件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="87" publication-number="202620557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於生成式AI與鑒別式AI連動的決策與回歸的人性化多目標優化方法</chinese-title>  
        <english-title>A DECISION-MAKING AND REGRESSION METHOD FOR HUMANIZED MULTI-OBJECTIVE OPTIMIZATION BASED ON THE INTERACTION BETWEEN GENERATIVE AI AND DISCRIMINATIVE AI</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G05B13/02</main-classification>  
        <further-classification edition="201901120250203B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覺文郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JYWE, WEN-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳學鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUEH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決CNC 加工過程中難以體現實際使用者的主觀偏好、難以達到全局優化的問題，本發明提供一種基於生成式AI與鑒別式AI連動的決策與回歸的人性化多目標優化方法，利用生成式AI及/或鑒別式AI執行步驟包括：步驟1、讀取過往加工參數與紀錄；步驟2、訓練資料；步驟3、數據調取；步驟4、參數優化；步驟5、完成參數優化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To address the difficulty of reflecting the actual user's subjective preferences and achieving global optimization in CNC machining processes, this invention provides a humanized multi-objective optimization method for decision-making and regression based on the interaction between generative AI and discriminative AI. The steps executed using generative AI and/or discriminative AI include: Step 1: Retrieving past processing parameters and records; Step 2: Training the data; Step 3: Data retrieval; Step 4: Parameter optimization; Step 5: Completion of parameter optimization.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:過往加工參數與紀錄</p>  
        <p type="p">21:資料拆分</p>  
        <p type="p">22:特徵轉換</p>  
        <p type="p">23:結果標籤標注</p>  
        <p type="p">24:帕雷托前沿選取</p>  
        <p type="p">31:需求描述</p>  
        <p type="p">32:數據抓取</p>  
        <p type="p">33:訓練</p>  
        <p type="p">41:資料預處理</p>  
        <p type="p">42:回歸</p>  
        <p type="p">43:組合</p>  
        <p type="p">44:潤飾</p>  
        <p type="p">5:完成參數優化</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="88" publication-number="202620319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拉引機及其使用方法</chinese-title>  
        <english-title>TRACTION MACHINE AND USING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F16H7/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拉引機及其使用方法，其中拉引機包含一基座、至少二上滾輪組件、至少二下滾輪組件、一驅動單元、一傳動皮帶以及一張力調整裝置。上滾輪組件可轉動地設置於基座。下滾輪組件可轉動地設置於基座。二上滾輪組件分別與二下滾輪組件共同形成二拉引空間。入料口透過二拉引空間連通於出料口。驅動單元連接於二下滾輪組件並用以驅動二下滾輪組件轉動。傳動皮帶套設於二下滾輪組件。張力調整裝置設置於基座並連接於二下滾輪組件至少其中一者。張力調整裝置用以調整二下滾輪組件之間的距離，而調整傳動皮帶承受的張力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A traction machine and a using method thereof, where the traction machine includes a base, at least two upper roller assemblies, at least two lower roller assemblies, a driving unit, a belt and a tension adjusting device. The upper roller assemblies and the lower roller assemblies are rotatably disposed on the base, and together form two traction spaces. The inlet is connected to the outlet via the tow traction spaces. The driving unit is connected to the lower roller assemblies and configured to rotate the same. The belt is sleeved on the two lower roller assemblies. The tension adjusting device is disposed on the based and connected to the two lower roller assemblies. The tension adjusting device is configured to adjust the distance between the two lower roller assemblies to adjust the tension applied on the belt.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:拉引機</p>  
        <p type="p">100:基座</p>  
        <p type="p">101:入料口</p>  
        <p type="p">102:出料口</p>  
        <p type="p">110:底板</p>  
        <p type="p">120:側板</p>  
        <p type="p">130:頂板</p>  
        <p type="p">200:上滾輪組件</p>  
        <p type="p">250:抵壓組件</p>  
        <p type="p">300,350:下滾輪組件</p>  
        <p type="p">400:驅動單元</p>  
        <p type="p">500:譯碼器</p>  
        <p type="p">600:傳動皮帶</p>  
        <p type="p">700:張力調整裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="89" publication-number="202619931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機車的擋風件結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B62J17/04</main-classification>  
        <further-classification edition="200601120241204B">B62J23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種機車的擋風件結構，機車至少包括有車架單元，該車架單元外周罩設有車體蓋單元；該車體蓋單元至少具有前車體蓋與連結於該前車體蓋前端上的擋風件組；該擋風件組具有主擋風件與連結於該主擋風件下方二側上的副擋風件；該副擋風件的最外端相對於該主擋風件之最外端更遠離該車輛的上下方向的車體中心線；藉此一方面可確保該擋風件組的擋風面積，並同時可使構成該擋風件組的每個構件小型化，可使整體的該擋風件組的成本大大的降低，同時由於該主擋風件的小型化因此重量變輕，而無需另由該車架單元的前端加設支架來供該主擋風件連結，從而可有效的降低該轉向機構的整體重量，進而可提升該轉向機構的操控性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">2:車架單元</p>  
        <p type="p">21:頭管</p>  
        <p type="p">251:上側車架</p>  
        <p type="p">291:鎖固部</p>  
        <p type="p">292:鎖固孔</p>  
        <p type="p">5:車體蓋單元</p>  
        <p type="p">52:擋風件組</p>  
        <p type="p">521:主擋風件</p>  
        <p type="p">5211:連結鎖固部</p>  
        <p type="p">5212:連結鎖孔</p>  
        <p type="p">522:副擋風件</p>  
        <p type="p">5221:第一連結面</p>  
        <p type="p">52211:連結孔</p>  
        <p type="p">5222:第二連結面</p>  
        <p type="p">52221:傾斜面</p>  
        <p type="p">52222:延伸面</p>  
        <p type="p">52223:鎖孔</p>  
        <p type="p">52224:鎖孔</p>  
        <p type="p">53:前車體蓋</p>  
        <p type="p">531:連結部</p>  
        <p type="p">532:穿孔</p>  
        <p type="p">54:側車體蓋</p>  
        <p type="p">7:鎖設件</p>  
        <p type="p">71:鎖設孔</p>  
        <p type="p">72:連結鎖設孔</p>  
        <p type="p">9:前方向燈支撐座</p>  
        <p type="p">91:前方向燈</p>  
        <p type="p">H:散熱器</p>  
        <p type="p">L:大燈</p>  
        <p type="p">S:鎖固元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="90" publication-number="202619932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機車的擋風件構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B62J17/04</main-classification>  
        <further-classification edition="200601120241204B">B62J23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種機車的擋風件構造，機車至少包括有車架單元，該車架單元外周罩設有車體蓋單元；該車體蓋單元至少具有前車體蓋與連結於該前車體蓋前端上的擋風件組；該擋風件組具有主擋風件與連結於該主擋風件下方二側上的副擋風件；該機車於前方二側設有前方向燈，該前方向燈的發光部露出於該副擋風件外，該副擋風件至少有一部分係可將該前方向燈連結處予以遮蔽；藉此可使構成該擋風件組的每個構件小型化，可使整體的該擋風件組的成本大大的降低，同時由於該主擋風件的小型化因此重量變輕，而無需另由該車架單元的前端加設支架來供該主擋風件連結，從而可有效的降低該轉向機構的整體重量，進而可提升該轉向機構的操控性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">5:車體蓋單元</p>  
        <p type="p">52:擋風件組</p>  
        <p type="p">521:主擋風件</p>  
        <p type="p">5211:連結鎖固部</p>  
        <p type="p">53:前車體蓋</p>  
        <p type="p">531:延伸部</p>  
        <p type="p">532:鎖固座</p>  
        <p type="p">533:鎖設塊</p>  
        <p type="p">54:側車體蓋</p>  
        <p type="p">8:連結件</p>  
        <p type="p">81:鎖固部</p>  
        <p type="p">82:連結部</p>  
        <p type="p">9:前方向燈</p>  
        <p type="p">91:發光部</p>  
        <p type="p">L:大燈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="91" publication-number="202619690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>口腔定位件</chinese-title>  
        <english-title>ORAL POSITIONING COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241125B">A61C5/80</main-classification>  
        <further-classification edition="200601120241125B">A61F5/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁麗雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-SIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茵慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王躍鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王珮驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種口腔定位件，用以解決無法有效率地診斷磨牙症的問題。係包含：一上固定套，具有一容槽，一外側壁及一內側壁分別位於該容槽的相對二側，該上固定套的外側壁及該上固定套的內側壁連接一咬合面；一下固定套，具有一容槽，一外側壁及一內側壁分別位於該下固定套的容槽的相對二側，該下固定套的外側壁及該下固定套的內側壁連接一咬合面；及一壓力感測模組，鄰近於該上固定套的咬合面或/及該下固定套的咬合面，用以感測該上固定套之咬合面與該下固定套之咬合面的壓力訊號。藉此可以達成達到提升診斷精確性的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oral positioning component is used to solve the problem of being unable to efficiently diagnose bruxism. Includes: an upper fixed sleeve with a receptacle, an outer side wall and an inner wall located on opposite sides of the receptacle respectively, and the outer side wall of the upper fixed sleeve and the inner wall of the upper fixed sleeve are connected to an occlusal surface; The lower fixed sleeve has a receptacle, an outer wall and an inner wall respectively located on opposite sides of the receptacle of the lower fixed sleeve, and the outer wall of the lower fixed sleeve and the inner wall of the lower fixed sleeve are connected to an occlusal surface; and a pressure sensing module, adjacent to the occlusal surface of the upper fixed sleeve or/and the occlusal surface of the lower fixed sleeve, for sensing pressure signals of the occlusal surface of the upper fixed sleeve and the occlusal surface of the lower fixed sleeve . This can achieve the effect of improving diagnostic accuracy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:上固定套</p>  
        <p type="p">11,21:容槽</p>  
        <p type="p">12,22:外側壁</p>  
        <p type="p">13,23:內側壁</p>  
        <p type="p">14,24:咬合面</p>  
        <p type="p">15,25:栓部</p>  
        <p type="p">2:下固定套</p>  
        <p type="p">3:壓力感測模組</p>  
        <p type="p">31:金屬線段</p>  
        <p type="p">4:定位件</p>  
        <p type="p">41:第一連接段</p>  
        <p type="p">41a,42a:結合孔</p>  
        <p type="p">42:第二連接段</p>  
        <p type="p">43:彈性部</p>  
        <p type="p">5:壓舌件</p>  
        <p type="p">51:導流孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="92" publication-number="202620673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件分類模型訓練方法、訓練物件分類模型的運算裝置、物件辨識裝置及物件辨識方法</chinese-title>  
        <english-title>OBJECT CLASSIFICATION MODEL TRAINING METHOD, COMPUTATION DEVICE FOR TRAINING OBJECT CLASSIFICATION MODEL, OBJECT RECOGNITION DEVICE, AND OBJECT RECOGNITION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06F18/24</main-classification>  
        <further-classification edition="202001120250203B">G06F30/27</further-classification>  
        <further-classification edition="202301120250203B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊青翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHING HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DI, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭力瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, LI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王尉任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物件分類模型訓練方法、訓練物件分類模型的運算裝置、物件辨識裝置及物件辨識方法，其中該物件分類模型訓練方法包含：讀取複數模型檔案，各該模型檔案包含一虛擬物件三維模型；根據一旋轉取像排程分別對該複數模型檔案中的虛擬物件三維模型進行二維取像以產生複數二維影像，各該虛擬物件三維模型在該複數二維影像中的方位彼此不同；利用對應於各該虛擬物件三維模型的該複數二維影像產生一訓練資料集；以及分別將對應於該複數模型檔案的虛擬物件三維模型的訓練資料集輸入一待訓練模型進行訓練，以獲得一物件分類模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object classification model training method, a computation device for training an object classification model, an object recognition device, and an object recognition method are provided. The object classification model training method comprises steps of: receiving multiple model files each respectively having a virtual object 3D model; generating multiple 2D images of each virtual object 3D model by a rotation image-capturing schedule, wherein the positions of the virtual object 3D model in the multiple 2D images are different; generating a training data set for each virtual object 3D model based on the multiple 2D images of each virtual object 3D model; and training an untrained model according to the training data sets corresponding to the virtual object 3D models of the multiple model files to obtain an object classification model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01,S02,S03,S04:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="93" publication-number="202621193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>節能照明系統</chinese-title>  
        <english-title>ENERGY SAVING LIGHTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241204B">H05B47/115</main-classification>  
        <further-classification edition="201501120241204B">F21V23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金頓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING DESIGN INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施俊名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHUN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鼎杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種節能照明系統，其包含複數免變壓器之發光元件、一微處理器、一操控單元、至少一感測器及一電源供應器。該操控單元與該微處理器電性連接，以產生一控制訊號，並將該控制訊號傳給該微處理器，該感測器與該微處理器電性連接並有一感測範圍，該感測器偵測到有物體在該感測範圍內移動時即產生一感測訊號，並將該感測訊號傳給該微處理器。該電源供應器與該微處理器及該些發光元件電性連接，該微處理器根據該控制訊號或該感測訊號產生一調整訊號，以調整該電源供應器的輸出功率以及發光元件的亮度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy-saving lighting system includes a plurality of transformer-free light-emitting elements, a microprocessor, a control unit, at least one sensor, and a power supply. The control unit is electrically connected to the microprocessor to generate a control signal and transmit the control signal to the microprocessor. The sensor(s) is electrically connected to the microprocessor and has a sensing range. When the sensor(s) detects an object moving within the sensing range, it generates a sensing signal and transmits the sensing signal to the microprocessor. The power supply is electrically connected to the microprocessor and the light-emitting elements. Based on the control signal or the sensing signal, the microprocessor generates an adjustment signal to regulate the output power of the power supply and adjust the brightness of the light-emitting elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:節能照明系統</p>  
        <p type="p">10A、10B、10C:免變壓器發光元件</p>  
        <p type="p">20:微處理器</p>  
        <p type="p">30:操控單元</p>  
        <p type="p">40:感測器</p>  
        <p type="p">60:電源供應器</p>  
        <p type="p">60A:變壓器</p>  
        <p type="p">AS:調整訊號</p>  
        <p type="p">CS1:第一控制訊號</p>  
        <p type="p">SS:感測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="94" publication-number="202620985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插頭連接器、插座連接器及線纜組件</chinese-title>  
        <english-title>PLUG CONNECTOR, RECEPTACLE CONNECTOR AND CABLE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241127B">H01R24/20</main-classification>  
        <further-classification edition="201101120241127B">H01R24/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種插頭連接器，包括：絕緣本體，其設有對接部，所述對接部設有對接面及貫穿所述對接面的兩個對接孔，所述對接部具有相對的第一長外表面及第二長外表面，以及連接所述第一、第二長外表面的兩個短外表面；及兩個端子組件，其分別位於對應的對接孔內；其中，所述第一長外表面設有向第二長外表面方向凹陷且依序排列的第一鍵槽、第二鍵槽、第三鍵槽，所述第二長外表面設有向第一長外表面方向凹陷且依序排列的第四鍵槽、第五鍵槽、第六鍵槽，所述第二鍵槽的寬度大於所述第五鍵槽的寬度，但所述第二鍵槽的凹陷深度小於所述第五鍵槽的凹陷深度。與習知技術相比，本發明的鍵槽結構，在滿足防呆的功能下，外形更加完美，防呆功能更好。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plug connector includes an insulating housing having a mating portion with a mating face and two mating holes, and two terminal assemblies received in the mating holes respectively. The mating portion has a first long face and a second long face. The first long face has a first key recess, a second key recess and a third key recess. The second long face has a fourth key recess, a fifth key recess and a sixth key recess. The second key recess is wider but deeper than the fifth key recess. Therefore, the plug connector has an improved key feature and a more ingenious structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:插頭連接器</p>  
        <p type="p">11:對接部</p>  
        <p type="p">113:拐角</p>  
        <p type="p">132:第二鍵槽</p>  
        <p type="p">135:第五鍵槽</p>  
        <p type="p">23:線纜</p>  
        <p type="p">200:插座連接器</p>  
        <p type="p">44:定位柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="95" publication-number="202620190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹿科動物之幹細胞凍乾粉、其製備方法、其用途、及凍乾粉組合物</chinese-title>  
        <english-title>LYOPHILIZATE POWDER OF STEM CELLS FROM CERVIDS, PREPARATION METHOD THEREOF, USE THEREOF AND COMPOSITION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250501B">C12N5/071</main-classification>  
        <further-classification edition="201501120250501B">A61K35/12</further-classification>  
        <further-classification edition="200601120250501B">A61P19/00</further-classification>  
        <further-classification edition="200601120250501B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永立榮生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>U-NEURON BIOMEDICAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃翔弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱育昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱嬿樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曉芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSIAO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鹿科動物之幹細胞凍乾粉，包含得自鹿茸幹細胞之凍乾粉以及條件培養基之凍乾粉。此鹿茸幹細胞之凍乾粉包含全細胞組分的全細胞凍乾粉，且此條件培養基為培養鹿茸幹細胞後之條件培養基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Lyophilizate powder of stem cells from cervids includes lyophilized powder from stem cells of an antler and lyophilized powder from a conditioned medium. The lyophilized powder from stem cells of an antler includes whole cell lyophilized powder from whole cell components, and the conditioned medium is the conditioned medium after culturing the stem cells of an antler.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="96" publication-number="202620950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態電池加壓裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120241227B">H01M10/052</main-classification>  
        <further-classification edition="201001120241227B">H01M10/058</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方富民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, FU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾智賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾世昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游國輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, GWO-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種固態電池加壓裝置，係包括：一底座，該底座上方係容置複數堆疊之固態電池芯；至少二加壓桿，該二加壓桿之下緣係分別以固定螺絲鎖固於該底座兩側；一加壓板，係設置於該些固態電池芯上方，其兩側分別以固定螺絲鎖固於該二加壓桿之上緣；至少二楔型壓塊，係分別被一止滑螺絲推動使其貼合於該加壓板上緣兩側，該楔型壓塊之斜面正向與該止滑螺絲之鎖入軸向間具有一夾角；以及複數彈性介面，係分別設置於該底座與該固態電池芯間、該複數固態電池芯間、該固態電池芯與該加壓板。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:底座</p>  
        <p type="p">11A:固態電池芯</p>  
        <p type="p">12:加壓桿</p>  
        <p type="p">12A:固定螺絲</p>  
        <p type="p">13:加壓板</p>  
        <p type="p">14:楔型壓塊</p>  
        <p type="p">14A:止滑螺絲</p>  
        <p type="p">15:彈性介面</p>  
        <p type="p">ψ:內縮角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="97" publication-number="202621010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142145</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達輸出調整裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H02K7/116</main-classification>  
        <further-classification edition="200601120241204B">F16H49/00</further-classification>  
        <further-classification edition="201601120241204B">H02K11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝叔達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳尚儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王啟凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHII-KAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚品均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, PIN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種馬達輸出調整裝置，係包括：一馬達；一減速機，係與該馬達之輸出軸同軸結合、並將該馬達產生之扭力傳至一負載端；一扭力感測器，係位於該減速機不與該馬達結合之一端，以一環形件與該減速機結合，用於量測該負載端反饋回該減速機之阻力數值；以及一控制單元，係接收該扭力感測器所量測到之阻力數值訊號，用以調整該馬達之輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:馬達</p>  
        <p type="p">11A:軸承</p>  
        <p type="p">11B:馬達之外殼</p>  
        <p type="p">12:減速機</p>  
        <p type="p">12A:減速機之外殼</p>  
        <p type="p">13:扭力感測器</p>  
        <p type="p">13A:環形件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="98" publication-number="202620309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樞紐器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">F16C11/04</main-classification>  
        <further-classification edition="200601120241128B">H05K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫禾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINHER TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴南海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, NAN-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樞紐器，包含一基座、一弧形安裝件及二扭力組件。該基座成形一安裝空間及二設於該安裝空間二相對側的第一軌道。該弧形安裝件具有一位於該安裝空間並活動於該二第一軌道的弧形部及一連接該弧形部的安裝部，該弧形部界定出一第一虛擬軸心，該安裝部二相對側成形有二第二軌道。該二扭力組件分別具有一設於該基座二相對側其一的軸，一設於該軸的扭力提供件及一連動桿，該連動桿具有一與該第一虛擬軸心位置相異的第二虛擬軸心，該連動桿一端與該軸連接並接觸該扭力提供件，該連動桿另一端連接該二第二軌道其中之一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:樞紐器</p>  
        <p type="p">21:基座</p>  
        <p type="p">212:第一軌道</p>  
        <p type="p">213:安裝板</p>  
        <p type="p">216:組接板</p>  
        <p type="p">217:擋板</p>  
        <p type="p">219:組裝凸塊</p>  
        <p type="p">22:弧形安裝件</p>  
        <p type="p">221:弧形部</p>  
        <p type="p">222:安裝部</p>  
        <p type="p">226:凸塊</p>  
        <p type="p">23:扭力組件</p>  
        <p type="p">231:軸</p>  
        <p type="p">232:扭力提供件</p>  
        <p type="p">233:連動桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="99" publication-number="202620215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面抗電漿蝕刻的薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C14/06</main-classification>  
        <further-classification edition="200601120260223B">C23C16/44</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUEI-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-CHON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種表面抗電漿蝕刻的薄膜，其中底膜(陽極處理膜)的化合物包含Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、AlOOH、或Al(OH)&lt;sub&gt;3&lt;/sub&gt;，工作膜(熱噴塗膜)的化合物包含Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、YOF、YF&lt;sub&gt;3&lt;/sub&gt;、或YAZ，封孔膜(氣膠膜)的化合物包含釔化合物；底膜(陽極處理膜)經過封孔後的孔隙度小於5%，工作膜(熱噴塗膜)的孔隙度小於10%，封孔膜(氣膠膜)的孔隙度小於1%，本發明可比傳統的鍍膜技術高數十倍的速度形成薄膜，所鍍的高緻密度薄膜其孔隙率可降低至1%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:鋁基材</p>  
        <p type="p">2:底膜</p>  
        <p type="p">3:工作膜</p>  
        <p type="p">4:封孔膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="100" publication-number="202619899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單絲印刷網布的製作方法、單絲印刷網版及單絲印刷複合網版</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B41F15/34</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉和股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張高明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種單絲印刷網布的製作方法，包括以下步驟：拉伸複數條線紗並進行整線；將整完線的該等線紗穿過一鋼筘以進行一第一階段間距調整；將經過該鋼筘的該等線紗穿過一鋼筘治具以進行一第二階段間距調整；以及將經過該鋼筘治具的該等線紗與一高分子材料膜層進行壓合，以成為該單絲印刷網布，其中，該等線紗皆向同方向延伸且彼此平行。再者，本發明亦提供一種單絲印刷網版及單絲印刷複合網版。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S103、S105、S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="101" publication-number="202620688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學組成物的成分及功效分析模型建立方法及該模型的系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06G7/48</main-classification>  
        <further-classification edition="200601120241202B">G06G7/58</further-classification>  
        <further-classification edition="202301120241202B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱立華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡湘源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱立華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡湘源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致浤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化學組成物的成分及功效分析模型建立方法，包含以下步驟：建立一資料庫，資料庫中儲存有複數化學組成物資料；建立一成份功效矩陣；利用一關聯規則學習算法，取得各成份與各功效間的一關連規則；將複數成分功效對中的複數特定成分及複數對應功效各自定義為一節點，建構一成分功效關連網絡；取得各成分功效對的一條件概率；加總前述分析數據，得到一分析結果。本發明另提供一種化學組成物的成分及功效分析模型系統。藉由本發明提供的方法及其所建構的分析模型，來取得一種化學組成物的新療效及應用方向，以及對於特定療效的一種化學組成物的新成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:化學組成物的成分及功效分析模型建立方法</p>  
        <p type="p">S10、S11、S12、S13、S14、S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="102" publication-number="202619835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大尺寸導光板之定位裁切方法及定位裁切設備</chinese-title>  
        <english-title>POSITIONING AND CUTTING METHOD AND EQUIPMENT FOR LARGE-SIZED LIGHT GUIDE PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241204B">B23K26/38</main-classification>  
        <further-classification edition="201401120241204B">B23K26/402</further-classification>  
        <further-classification edition="201401120241204B">B23K26/042</further-classification>  
        <further-classification edition="201401120241204B">B23K26/082</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂林光電科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL LIGHTING TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳奇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊易宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, I-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之大尺寸導光板之定位裁切方法及定位裁切設備，包含於生產動線方向依序設置觸發偵測器、第一及第二影像擷取器；使連續式生產導光板體朝生產動線方向前進，其上定義有安全切割區及網點設計區，並具有位於安全切割區之觸發靶及位於網點設計區呈前後排列之第一及第二定位靶；當觸發偵測器偵測到任一觸發靶時發出訊號予第一及第二影像擷取器，以同時作動分別取得包含第一、第二定位靶之第一、第二影像；計算第一及第二影像取得網點設計區之尺寸及位置；驅動雷射切割機依據尺寸及位置切割連續式生產導光板體。據此，以利精準切割導光板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A positioning and cutting method and equipment for large-sized light guide plate are disclosed. It includes sequentially setting a trigger detector, a first image capture device, and a second image capture device along a production line direction. A continuously produced light guide plate moves forward along the production line, with a plurality of safe cutting zones and a plurality of pattern design zones defined on the light guide plate. The light guide plate also contains a plurality of trigger targets located in the safe cutting zones, and a plurality of first and second positioning targets arranged in front-to-back order in the pattern design zones When the trigger detector detects any trigger target, it sends a signal to both the first and second image capture devices, causing them to simultaneously capture a first image containing the first positioning target and a second image containing the second positioning target. The dimensions and position of the pattern design zone are calculated from the first and second images. A laser cutter is then driven to cut the continuously produced light guide plate based on the calculated dimensions and position. This process ensures precise cutting of the light guide plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S05:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="103" publication-number="202620769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能源管理方法、系統及建築</chinese-title>  
        <english-title>ENERGY MANAGING METHOD, SYSTEM, AND BUILDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241223B">G06Q50/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, YU-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能源管理方法、系統及建築，方法應用於目標建築；目標建築上的不同高度上分別設置有儲水單元；多個儲水單元之間藉由輸水管道連接；輸水管道上設置有閥門以及水力發電單元；該方法包括：根據目標建築的用電需求和/或供電情況，確定目標建築是否存在電能補充需求；若存在電能補充需求，控制第一儲水單元與第二儲水單元之間的輸水管道上的閥門開放，以使得第一儲水單元與第二儲水單元之間水流的動能驅動水力發電單元發電；其中，第一儲水單元的設置位置高於第二儲水單元的設置位置；藉由水力發電單元產生的電能為目標建築供能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy managing method, an energy managing system, and a building are provided. The energy managing method is applied to an object building, multiple water storage units are installed at different heights on the object building. The multiple water storage units are connected through water pipelines, valves and a hydroelectric power generation unit are installed in the water pipelines. The energy managing method includes: determining whether a demand for electricity replenishment exists at the object building according to an electricity demand and/or a power supply situation of the object building; If the demand for electricity replenishment exists at the object building, controlling a valve in a water pipeline between a first water storage unit and a second water storage unit to open, so that a kinetic energy of water flow between the first water storage unit and the second water storage unit drives the hydroelectric power generation unit to generate electricity; using the electricity generated by the hydroelectric power unit to power the object building. An installation position of the first water storage unit is higher than an installation position of the second water storage unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101、102、103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="104" publication-number="202621252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極結構及其製造方法</chinese-title>  
        <english-title>GATE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B41/30</main-classification>  
        <further-classification edition="202301120260223B">H10B41/35</further-classification>  
        <further-classification edition="202301120260223B">H10B43/30</further-classification>  
        <further-classification edition="202301120260223B">H10B43/35</further-classification>  
        <further-classification edition="202501120260223B">H10D64/00</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202501120260223B">H10D48/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡世寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHIH-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹玉佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, YU-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳伯倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, BO-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閘極結構及其製造方法。所述閘極結構包括閘極元件、第一間隙壁、頂蓋層、硬罩幕層以及第二間隙壁。所述閘極元件設置於基底上。所述第一間隙壁設置於所述閘極元件的側壁上。所述頂蓋層設置於所述閘極元件的頂面上。所述硬罩幕層設置於所述頂蓋層上。所述第二間隙壁設置於所述硬罩幕層的側壁、所述頂蓋層的側壁以及所述第一間隙壁的側壁上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a gate structure and a manufacturing method thereof. The gate structure includes a gate device, a first spacer, a cap layer, a hard mask layer and a second spacer. The gate device is disposed on a substrate. The first spacer is disposed on a sidewall of the gate device. The cap layer is disposed on a top surface of the gate device. The hard mask layer is disposed on the cap layer. The second spacer is disposed on a sidewall of the hard mask layer, a sidewall of the cap layer and a sidewall of the first spacer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:閘極結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102A:穿隧介電層</p>  
        <p type="p">104A:浮置閘極</p>  
        <p type="p">106A:閘間介電層</p>  
        <p type="p">108A:控制閘極</p>  
        <p type="p">109:閘極元件</p>  
        <p type="p">110A:頂蓋層</p>  
        <p type="p">114:第一間隙壁</p>  
        <p type="p">116:第二間隙壁</p>  
        <p type="p">120A:第一子硬罩幕層</p>  
        <p type="p">122A:第二子硬罩幕層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="105" publication-number="202619769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羽毛球之人造球頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241119B">A63B67/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>開駿興業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃嘉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉昉昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種羽毛球之人造球頭，包括：一實體部，以及一球頭皮膜。其中實體部是一種採用微發泡射出成型技術(MuCell)製成且具有微氣泡的一體成型結構，實體部的材料組成包含：重量百分比50%至60%之熱可塑性彈性體(TPR)、重量百分比30%至40%之天然木屑，以及重量百分比5%至10%之黏著劑。球頭皮膜利用黏膠黏著並且包覆於實體部之外側表面。本發明利用微發泡射出成型技術製成之人造球頭，係為一次成型，不需二次加工或切削，可以提高生產速度；另一方面，實體部的材料組成大幅減少天然木材的含量，可以減少自然資源的消耗，具有環保的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:實體部</p>  
        <p type="p">11:主體部</p>  
        <p type="p">111:插置孔</p>  
        <p type="p">12:前端部</p>  
        <p type="p">20:球頭皮膜</p>  
        <p type="p">B:微氣泡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="106" publication-number="202621036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於驅動馬達的驅動裝置及其操作方法</chinese-title>  
        <english-title>DRIVE DEVICE FOR DRIVING MOTOR AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H02P27/06</main-classification>  
        <further-classification edition="200601120241231B">H02P3/20</further-classification>  
        <further-classification edition="200601120241231B">H02J7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞福儲能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APH EPOWER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JYH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇修賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾筠棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, YUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於驅動馬達的驅動裝置以及用於驅動裝置的操作方法。驅動裝置包括電池模組、轉換電路、儲能電路以及控制開關。轉換電路耦接於馬達、電池模組的第一電源端以及電池模組的第二電源端。控制開關與儲能電路串聯耦接於第一電源端與第二電源端之間。當位於第一電源端的電壓值高於第一設定電壓值時，驅動裝置導通控制開關以使儲能電路儲存位於第一電源端的電能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving device for driving a motor and an operating method for the driving device are provided. The driving device includes a battery module, a conversion circuit, an energy storage circuit and a control switch. The conversion circuit is coupled to the motor, a first power terminal of the battery module and a second power terminal of the battery module. The control switch and the energy storage circuit are coupled in series between the first power terminal and the second power terminal. When a voltage value at the first power terminal is higher than a first setting voltage value, the driving device turns on the control switch to enable the energy storage circuit to store electrical energy at the first power terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:驅動裝置</p>  
        <p type="p">110:電池模組</p>  
        <p type="p">120:轉換電路</p>  
        <p type="p">130:儲能電路</p>  
        <p type="p">140:控制開關</p>  
        <p type="p">D1、D2、D3、D4、D5、D6、DB:二極體</p>  
        <p type="p">MTR:馬達</p>  
        <p type="p">PB1、PB2:電池電能</p>  
        <p type="p">PS1、PS2、PS3、PS4、PS5、PS6:功率開關</p>  
        <p type="p">S1、S2、S3、S4、S5、S6、SSWB:開關訊號</p>  
        <p type="p">T1:第一電源端</p>  
        <p type="p">T2:第二電源端</p>  
        <p type="p">TB:電晶體</p>  
        <p type="p">V1:電壓值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="107" publication-number="202620259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>農業秸稈無溶劑回收生產紡織纖維技術</chinese-title>  
        <english-title>SOLVENT-FREE RECYCLING TECHNOLOGY FOR PRODUCING TEXTILE FIBERS FROM AGRICULTURAL STRAW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">D01C1/00</main-classification>  
        <further-classification edition="202201120241118B">B09B3/00</further-classification>  
        <further-classification edition="200601120241118B">D06M10/00</further-classification>  
        <further-classification edition="200601120241118B">D01F9/00</further-classification>  
        <further-classification edition="200601320241118B">D06M101/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞元科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLLARCHIP TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾棨斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHI-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了一種將農業秸稈轉化為適合服裝生產的紡織級纖維的無溶劑方法。此方法結合機械預處理、高溫蒸氣、超音波振動和酵素催化，無需化學溶劑即可生產高品質、柔軟的纖維，減少對環境的影響並優化纖維品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention describes a solvent-free process for converting agricultural straw into textile-grade fibers suitable for garment production. Using a combination of mechanical pre-treatment, high-temperature steam, ultrasonic vibration, and enzyme catalysis, this method enables the production of high-quality, soft fibers without chemical solvents, reducing environmental impact and optimizing fiber quality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:&lt;b&gt;稻草圖標：&lt;/b&gt;表示原料來源，標示為收集稻草的起點</p>  
        <p type="p">2:&lt;b&gt;剪刀/切割符號：&lt;/b&gt;代表稻草的物理預處理，經由機械切割與粉碎，以便後續處理</p>  
        <p type="p">3:&lt;b&gt;蒸汽符號：&lt;/b&gt;指示高溫蒸汽處理，用於軟化稻草纖維，使其內部結構鬆散，利於無溶劑分離</p>  
        <p type="p">4:&lt;b&gt;擠壓機械符號：&lt;/b&gt;標示機械擠壓分離設備，依靠物理擠壓將纖維素分離出來，無需化學溶劑</p>  
        <p type="p">5:&lt;b&gt;超聲波波形符號：&lt;/b&gt;表示超聲波處理階段，用於增強纖維分離效果，並軟化纖維</p>  
        <p type="p">6:&lt;b&gt;酶符號：&lt;/b&gt;代表酶催化處理，用於進一步分解木質素，無化學溶劑，環保性高</p>  
        <p type="p">7:&lt;b&gt;水流箭頭符號：&lt;/b&gt;指示高壓水流增強技術，進一步提升纖維強度與均勻性</p>  
        <p type="p">8:&lt;b&gt;品質管理符號：&lt;/b&gt;檢測纖維質量好壞</p>  
        <p type="p">9:&lt;b&gt;紡紗符號(線軸)：&lt;/b&gt;代表紡紗過程，將處理好的纖維捻成線材，便於後續出貨</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="108" publication-number="202619752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面異質性高分子人工水晶體、其製備方法及用於抗貼附、抗細胞遷移、抗發炎及抗後囊混濁的用途</chinese-title>  
        <english-title>BILATERAL HETEROGENEOUS POLYMER-BASED ARTIFICIAL INTRAOCULAR LENS, PREPARATION PROCESS THEREOF AND USE FOR ANTIFOULING, ANTI-CELL MIGRATION, ANTI-INFLAMMATION AND ANTI-POSTERIOR CAPSULE OPACIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241212B">A61L27/20</main-classification>  
        <further-classification edition="200601120241212B">A61L27/52</further-classification>  
        <further-classification edition="200601120241212B">A61F2/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王子威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊承叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雙面異質性高分子人工水晶體、其製備方法及用於抗貼附、抗細胞遷移、抗發炎及抗後囊混濁的用途。本發明雙面異質性高分子人工水晶體藉由多種功效實驗，達到抗貼附、抗細胞遷移、抗發炎及抗後囊混濁之效果，並具有可折疊、高透光、抗貼附的雙面異質性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a bilateral heterogeneous polymer-based artificial intraocular lens, the preparation process thereof and the use of the bilateral heterogeneous polymer-based artificial intraocular lens for antifouling, anti-cell migration, anti-inflammation and anti-posterior capsule opacification. The bilateral heterogeneous polymer-based artificial intraocular lens of the present disclosure achieves the effect of antifouling, anti-cell migration, anti-inflammation and anti-posterior capsule opacification through various efficacy experiments, and has foldable, highly transparent, antifouling bilateral heterogeneous properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中間區域</p>  
        <p type="p">2:周圍區域</p>  
        <p type="p">3:支撐腳</p>  
        <p type="p">4:鏡面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="109" publication-number="202619635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非編織鞋面及其製作方法</chinese-title>  
        <english-title>NONWOVEN SHOE UPPER AND FABRICATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250306B">A43B1/00</main-classification>  
        <further-classification edition="200601120250306B">A43B23/02</further-classification>  
        <further-classification edition="201001120250306B">B29D35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宸大增材製造（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPLIFI TECH (XIAMEN) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳力瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種非編織鞋面具有內表面及外表面，並且包含基礎層及表層。基礎層的表面定義出內表面，並且基礎層包含堆疊相交的複數條第一聚合物線段，其中用於定義內表面之第一聚合物線段中相交的任兩者構成第一接合點。表層設置於基礎層上，表層的表面定義出外表面，並且表層包含堆疊相交的複數條第二聚合物線段，其中用於定義外表面之第二聚合物線段中相交的任兩者構成第二接合點。第一接合點的下表面及構成第一接合點的第一聚合物線段的下表面為實質平坦，而第二接合點的厚度為構成第二接合點的第二聚合物線段中任一者的厚度的135%至200%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nonwoven shoe upper having an inner surface and an outer surface includes a base layer and a surface layer. A surface of the base layer defines the inner surface, and the base layer includes a plurality of first polymer line segments stacked and intersecting with each other, in which any two of the first polymer line segments used to define the inner surface that intersect constitute a first joint point. The surface layer is disposed on the base layer and defines the outer surface, and the surface layer includes a plurality of second polymer line segments stacked and intersecting with each other, in which any two of the second polymer line segments used to define the outer surface that intersect constitute the second joint point. A lower surface of the first joint point and lower surfaces of the first polymer line segments that constitute the first joint point are substantially planar, and a thickness of the second joint point is 135% to 200% of a thickness of any one of the second polymer line segments that constitute the second joint point.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10B:外表面</p>  
        <p type="p">P2:第二聚合物線段</p>  
        <p type="p">C2:第二接合點</p>  
        <p type="p">SP2,SC2:上表面</p>  
        <p type="p">H2:厚度</p>  
        <p type="p">W2:線寬</p>  
        <p type="p">C-C':線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="110" publication-number="202619774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>田徑監控系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A63B71/06</main-classification>  
        <further-classification edition="200601120241204B">G07C1/24</further-classification>  
        <further-classification edition="200601120241204B">G06K19/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊正輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬上閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, SHANG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種田徑監控系統，包含身分識別裝置、起跑指示裝置、訊息提示裝置、測距感測裝置，及控制裝置。該身分識別裝置具有設置在跑者的身分識別標籤。該測距感測裝置能於往下感測到跑者時產生跑者訊號。該控制裝置會被起跑指示裝置之起跑訊號觸發而開始計時，並會於接續被跑者訊號觸發時，取得當前計時時間以得到比賽計時資料，並將該身分識別標籤的該身分識別資料與該比賽計時資料綁定以建立比賽記錄。透過該田徑監控系統的設計，可用以自動化感測並建立每一跑者的比賽記錄，可大幅提高田徑場設備水準，並有助於提高田徑比賽或訓練的品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:田徑監控系統</p>  
        <p type="p">3:身分識別裝置</p>  
        <p type="p">31:身分識別標籤</p>  
        <p type="p">32:無線感應讀取器</p>  
        <p type="p">4:起跑指示裝置</p>  
        <p type="p">41:發令槍</p>  
        <p type="p">42:電子炮</p>  
        <p type="p">5:訊息提示裝置</p>  
        <p type="p">51:顯示器</p>  
        <p type="p">52:警示器</p>  
        <p type="p">6:測距感測裝置</p>  
        <p type="p">71:風速感測裝置</p>  
        <p type="p">72:影像擷取裝置</p>  
        <p type="p">8:控制裝置</p>  
        <p type="p">81:計時模組</p>  
        <p type="p">82:通訊模組</p>  
        <p type="p">83:控制模組</p>  
        <p type="p">831:分道競賽模式</p>  
        <p type="p">832:計圈競賽模式</p>  
        <p type="p">833:訓練模式</p>  
        <p type="p">900:電子設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="111" publication-number="202621198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板結構及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250306B">H05K1/02</main-classification>  
        <further-classification edition="200601120250306B">H05K1/14</further-classification>  
        <further-classification edition="200601120250306B">H05K3/36</further-classification>  
        <further-classification edition="200601120250306B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖偉宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-PEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電路板結構及其製造方法。電路板結構包括基底層、第一電路層、支撐材料層、增層材料層及第二電路層。第一電路層設置於基底層上。支撐材料層設置於基底層上，並位於第一電路層的一側。增層材料層設置於第一電路層及支撐材料層上。第二電路層設置於增層材料層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a base layer, a first circuit layer, a support material layer, a build-up material layer, and a second circuit layer. The first circuit layer is disposed on the base layer. The support material layer is disposed on the base layer and on one side of the first circuit layer. The build-up material layer is disposed on the first circuit layer and the support material layer. The second circuit layer is disposed on the build-up material layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:電路板結構</p>  
        <p type="p">10:基底層</p>  
        <p type="p">14:第一電路層</p>  
        <p type="p">15:支撐材料層</p>  
        <p type="p">16:增層材料層</p>  
        <p type="p">16a:上表面</p>  
        <p type="p">16b:上表面</p>  
        <p type="p">17:第二電路層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="112" publication-number="202621142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容量基站及其管理方法</chinese-title>  
        <english-title>CAPACITY BOOSTER CELL AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250203B">H04W24/02</main-classification>  
        <further-classification edition="200901120250203B">H04W52/02</further-classification>  
        <further-classification edition="200901120250203B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許獻聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIEN TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種容量基站及其管理方法。該容量基站基於一運行模式、一節能過渡模式及一節能模式，提供至少一終端裝置一通訊服務。當處於該運行模式，該容量基站基於對應該容量基站的一預測負載資訊，判斷是否將該容量基站切換至該節能過渡模式。當處於該節能過渡模式，該容量基站移交對應該至少一終端裝置之該通訊服務至至少一鄰近基站。響應於完成移交該至少一終端裝置之該通訊服務，該容量基站切換至該節能模式，其中被切換至該節能模式之該容量基站暫停提供該通訊服務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A capacity booster cell and control method thereof are provided. The capacity booster cell provides a communication service for at least one terminal apparatus based on an active mode, an energy saving transition mode, and an energy saving mode. In the active mode, the capacity booster cell determines whether to switch to the energy saving transition mode based on a predicted load information. In the energy saving transition mode, the capacity booster cell hands over the communication service of the at least one terminal apparatus to at least one neighbor cell. In response to completing handing over the communication service of the at least one terminal apparatus, the capacity booster cell is switched to the energy saving mode, wherein the capacity booster cell in the energy saving mode is suspended from providing the communication service.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ACT:運行模式</p>  
        <p type="p">EST:節能過渡模式</p>  
        <p type="p">ES:節能模式</p>  
        <p type="p">AT:運行過渡模式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="113" publication-number="202620622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軟體啟用方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR SOFTWARE ACTIVATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250204B">G06F8/61</main-classification>  
        <further-classification edition="201301120250204B">G06F21/44</further-classification>  
        <further-classification edition="202401120250204B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神基科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>危仁靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, JEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林峻暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軟體啟用方法包含下列步驟。由啟用伺服器獲取根據來自客戶的當前訂單的應用程式的商品貨號所創建的安裝程式，且提供安裝程式以及啟用程式。由用戶裝置執行安裝程式以安裝或更新應用程式，且在完成安裝程式的安裝後執行啟用程式。在用戶裝置執行啟用程式且允許網路存取時，啟用伺服器用以進行下列步驟。獲取來自客戶的過往採購訂單所包含的複數個裝置序號。根據裝置序號，驗證用戶裝置的裝置資訊以產生驗證狀態。若驗證狀態為驗證通過，提供授權碼予用戶裝置。基於授權碼使用戶裝置上的應用程式的執行有效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A software activation method includes the following steps. An installation program created according to a stock keeping unit of an application program in a current order from a customer is obtained by an activation server, and the installation program and an enable program are provided. The installation program is executed by a user device to install or update the application program, and after the installation of the installation program is completed, the activation server performs the following steps. A plurality of device serial numbers included in a past purchase order from the customer are obtained. Device information of the user device is verified according to the device serial numbers to generate a verification status. If the verification status is a pass value, a license key is provided to the user device. The execution for the application program in the user device is activated based on the license key</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:軟體啟用方法</p>  
        <p type="p">302:計算裝置</p>  
        <p type="p">308:啟用伺服器</p>  
        <p type="p">312:用戶裝置</p>  
        <p type="p">340,342,343,344,346,348,350,351,352:步驟</p>  
        <p type="p">354,356,357,358,360,361,362,364:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="114" publication-number="202619901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紋理塗料施作工法</chinese-title>  
        <english-title>TEXTURE PAINT APPLICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B44C1/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, I-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, I-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗融</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種紋理塗料施作工法，包含一紋理成型步驟及一修飾步驟，該紋理成型步驟係在一基材層上設有一紋理塗料層，該紋理塗料層於自身表面形成有複數紋理部。該修飾步驟在該紋理塗料層上設有一修飾層，該修飾層為有色且具有部分透明度，藉以修飾紋理呈現效果不符預期的紋理塗料層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a texture paint application method, which includes a texture forming step and a modification step. The texture forming step is to provide a texture paint layer on a base material layer, and the texture paint layer forms a plurality of texture parts on its surface. In the modification step, a modification layer is provided on the texture paint layer. The modification layer is colored and partially transparent, so as to modify the texture paint layer whose texture rendering effect is not as expected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(1):基材層</p>  
        <p type="p">(2):底漆層</p>  
        <p type="p">(3):紋理塗料層</p>  
        <p type="p">(31):紋理部</p>  
        <p type="p">(4):修飾層</p>  
        <p type="p">(5):透明保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="115" publication-number="202619784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>淨化粗焦爐氣之方法及粗焦爐氣淨化系統</chinese-title>  
        <english-title>A METHOD OF PURIFYING CRUDE COKE OVEN GAS AND CRUDE COKE OVEN GAS PURIFICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B01D53/52</main-classification>  
        <further-classification edition="200601120241204B">B01D53/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝政廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李豪業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　哲夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEFFREY, DANIEL-WARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方銘君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, MING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝喻丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種淨化粗焦爐氣之方法，係在一粗焦爐氣淨化系統中執行，該粗焦爐氣淨化系統包含相互連通的一洗滌塔及一蒸餾塔，該方法包含步驟：使粗焦爐氣進入該洗滌塔，並且接觸該洗滌塔中的濃氨水、液鹼與含氨水溶液，而產出焦爐氣以及一廢液鹼與含氨水混合液；以及：使該廢液鹼與含氨水混合液進入該蒸餾塔，並與硫酸接觸，以產出含氨水產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of purifying crude coke oven gas, which is performed in a crude coke oven gas purification system. The crude coke oven gas purification system includes a scrubber and a distillation tower connected to each other. The method includes steps of: introducing crude coke oven gas into the scrubber to contact concentrated ammonia water, liquid alkali and ammonia-containing aqueous solution in the scrubber tower, so as to produce a purified coke oven gas and a waste liquid alkali and ammonia-containing water mixture; and introducing the waste liquid alkali and ammonia-containing water solution into the distillation tower to contact sulfuric acid, so as to produce an ammonia-containing aqueous product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10至S20:本發明的淨化粗焦爐氣之方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="116" publication-number="202620819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142179</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>葉克膜混成學習系統</chinese-title>  
        <english-title>EXTRACORPOREAL MEMBRANE OXYGENATION BLENDED LEARNING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">G09B9/00</main-classification>  
        <further-classification edition="200601120250228B">G09B23/28</further-classification>  
        <further-classification edition="201801120250228B">G16H50/20</further-classification>  
        <further-classification edition="201901120250228B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北護理健康大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF NURSING AND HEALTH SCIENCES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖珮宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PEI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴韋良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEI LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YEN CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白大尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種葉克膜混成學習系統，包含：葉克膜混成學習資料庫；系統伺服器，其包含後端控制程式，該後端控制程式經配置以存取該葉克膜混成學習資料庫；以及葉克膜線上學習裝置，其與該系統伺服器分離配置並通訊連結，並包含葉克膜混成學習應用程式，且提供給使用者操作；以及葉克膜實體學習輔助計算裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an extracorporeal membrane oxygenation (ECMO) blended learning system, comprising: an ECMO blended learning database; a system server comprising a backend control program configured to access the ECMO blended learning database; an ECMO online learning device, which is separately configured from and communicatively connected to the system server, and comprises an ECMO blended learning application for a user to operate; an ECMO physical learning aided computing device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:葉克膜混成學習系統</p>  
        <p type="p">100:葉克膜線上學習裝置</p>  
        <p type="p">120:智慧手機</p>  
        <p type="p">125:桌上型電腦</p>  
        <p type="p">130:筆記型電腦</p>  
        <p type="p">135:行動裝置</p>  
        <p type="p">140:平板裝置</p>  
        <p type="p">150:學習對象</p>  
        <p type="p">200:系統伺服器</p>  
        <p type="p">250:葉克膜混成學習資料庫</p>  
        <p type="p">300:網際網路</p>  
        <p type="p">400:葉克膜實體學習輔助計算裝置</p>  
        <p type="p">401:桌上型電腦</p>  
        <p type="p">402:筆記型電腦</p>  
        <p type="p">450:實體教學人員</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="117" publication-number="202620616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具身份辨識功能之列印系統及列印方法</chinese-title>  
        <english-title>PRINTING SYSTEM WITH IDENTITY RECOGNITION FUNCTION AND PRINTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241216B">G06F3/12</main-classification>  
        <further-classification edition="201301120241216B">G06F21/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東友科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琳瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LIN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種具身份辨識功能之列印系統，包含使用者端裝置及列印裝置。使用者端裝置接收列印指令，且列印指令包含數位文件資料及第一生物特徵訊息。列印裝置包含第一處理器、列印單元及第一生物特徵擷取單元。第一生物特徵擷取單元依據第二設定操作產生第二生物特徵訊息，並將第二生物特徵訊息傳送至第一處理器。第一處理器接收並解析列印指令，並將第一生物特徵訊息與第二生物特徵訊息執行比對與辨識作業，以產生辨識結果。第一處理器根據辨識結果，控制列印單元對數位文件資料執行列印作業，以產生紙本文件，或不執行列印作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A printing system with identity recognition function is disclosed and includes a user device and a printing device. The user device receives a printing command, and the printing command includes a digital document and a first biometric information. The printing device includes a first processor, a printing unit and a first biometric capture unit. The first biometric capture unit generates a second biometric information according to a second operation, and the second biometric information is transmitted to the first processor. The first processor receives and parses the print command, and performs a comparison and recognition operation according to the first biometric information and the second biometric information, so as to generate a recognition result. According to the recognition result, the first processor controls the printing unit to perform a printing operation on the digital document data to generate a paper document, or not to perform the printing operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:列印系統</p>  
        <p type="p">1:使用者端裝置</p>  
        <p type="p">11:第二處理器</p>  
        <p type="p">12:輸入單元</p>  
        <p type="p">13:第二生物特徵擷取單元</p>  
        <p type="p">14:第二儲存單元</p>  
        <p type="p">2:列印裝置</p>  
        <p type="p">21:第一處理器</p>  
        <p type="p">22:列印單元</p>  
        <p type="p">23:第一生物特徵擷取單元</p>  
        <p type="p">24:操控單元</p>  
        <p type="p">241:使用者介面</p>  
        <p type="p">25:第一儲存單元</p>  
        <p type="p">3:通訊網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="118" publication-number="202620431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用奈米級微波探針於原子力顯微鏡中偵測半導體載子的方法</chinese-title>  
        <english-title>METHOD FOR DETECTING SEMICONDUCTOR CARRIERS USING A NANO-SCALE MICROWAVE PROBE IN ATOMIC FORCE MICROSCOPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250109B">G01Q60/24</main-classification>  
        <further-classification edition="201001120250109B">G01Q60/34</further-classification>  
        <further-classification edition="201001120250109B">G01Q60/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温賜安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, SI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉懿德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, YI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金天慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, TIEN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用奈米級微波探針配合原子力顯微鏡來偵測半導體載子的方式，其在於透過確定最佳載波頻率來優化微波訊號在原子力顯微鏡系統中的傳輸，以進行高頻測量。該方法包括操作原子力顯微鏡於敲擊模式，從原子力顯微鏡探針發射微波訊號，對訊號進行振幅調變，並掃描半導體樣品以偵測邊帶訊號。所偵測的邊帶訊號被分析，以識別後續測量（如掃描微波阻抗顯微鏡與邊帶靜電力顯微鏡）的最佳載波頻率。本發明進一步採用了阻抗匹配技術，包括雙支與多株阻抗匹配，以提升微波訊號傳輸的效率。此方法能產生半導體樣品的詳細載子分佈圖，提供關於半導體樣品電性的重要見解。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method and system for detecting semiconductor carriers using a nano-scale microwave probe in conjunction with atomic force microscopy (AFM). The invention focuses on optimizing the transmission of microwave signals through the AFM system by determining the optimal carrier frequency for high-frequency measurements. The method includes operating the AFM in tapping mode, emitting a microwave signal from the AFM tip, modulating the amplitude of the signal, and scanning the semiconductor sample to detect sideband signals. The detected sideband signals are analyzed to identify the optimal carrier frequency for subsequent measurements, such as Scanning Microwave Impedance Microscopy (sMIM) and Sideband Electrostatic Force Microscopy (Sideband-EFM). The invention further employs impedance matching techniques, including double-stub and multi-stub tuning, to enhance the efficiency of microwave signal transmission. The method enables the generation of a detailed carrier distribution map of the semiconductor sample, providing critical insights into the sample's electrical properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S160:流程圖步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="119" publication-number="202620834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素電路、OLED顯示裝置及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241202B">G09G3/3225</main-classification>  
        <further-classification edition="200601120241202B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京歐錸德微電子技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLED IC MICROELECTRONICS (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雪岭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚仲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席悅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種畫素電路，用以和一OLED元件組成一個OLED畫素單元，從而應用在包含X×Y個OLED畫素單元的一OLED顯示面板中。本發明之畫素電路包括：一驅動單元、一第一儲存電容、一第二儲存電容、一第一調光單元、一第二調光單元、以及一初始化單元。特別地，本發明以四個TFT元件組成所述驅動單元且以三個TFT元件組成所述初始化單元，並且，令該第一調光單元和該第二調光單元皆包含一個TFT元件。依此設計，本發明之畫素電路具有以下優點：(1)改善短期殘像；(2)實現對於所述驅動單元所包含的驅動TFT元件的Vth補償；(3)滿足低刷新率(如：1Hz)的應用需求；以及(4)在skip frames時間區間內改善Vth電壓飄移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:OLED元件</p>  
        <p type="p">2:畫素電路</p>  
        <p type="p">21:驅動單元</p>  
        <p type="p">21C1:第一控制端</p>  
        <p type="p">21C2:第二控制端</p>  
        <p type="p">21C3:第三控制端</p>  
        <p type="p">21T1:第一電性端</p>  
        <p type="p">21T2:第二電性端</p>  
        <p type="p">21T3:第三電性端</p>  
        <p type="p">21T4:第四電性端</p>  
        <p type="p">21T5:第五電性端</p>  
        <p type="p">22:第一調光單元</p>  
        <p type="p">22T1:第一電性端</p>  
        <p type="p">22T2:第二電性端</p>  
        <p type="p">22C0:控制端</p>  
        <p type="p">23:第二調光單元</p>  
        <p type="p">23T1:第一電性端</p>  
        <p type="p">23T2:第二電性端</p>  
        <p type="p">23C0:控制端</p>  
        <p type="p">24:初始化單元</p>  
        <p type="p">24T1:第一電性端</p>  
        <p type="p">24T2:第二電性端</p>  
        <p type="p">24T3:第三電性端</p>  
        <p type="p">24T4:第四電性端</p>  
        <p type="p">24C0:控制端</p>  
        <p type="p">C1:第一儲存電容</p>  
        <p type="p">C2:第二儲存電容</p>  
        <p type="p">M1:第一TFT元件</p>  
        <p type="p">M2:第二TFT元件</p>  
        <p type="p">M3:第三TFT元件</p>  
        <p type="p">M4:第四TFT元件</p>  
        <p type="p">M5:第五TFT元件</p>  
        <p type="p">M6:第六TFT元件</p>  
        <p type="p">M7:第七TFT元件</p>  
        <p type="p">M8:第八TFT元件</p>  
        <p type="p">N1:第一共接點</p>  
        <p type="p">N2:第二共接點</p>  
        <p type="p">N3:第三共接點</p>  
        <p type="p">N4:第四共接點</p>  
        <p type="p">N5:第五共接點</p>  
        <p type="p">N6:第六共接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="120" publication-number="202620281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動平面門窗橫拉結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">E06B3/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晟鈺智能全球有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動平面門窗橫拉結構，其包括一滑軌組件與一移動門窗，該滑軌組件包括一軌道托架、二導引座與一主動滑輪組，該主動滑輪組架設在該軌道托架的第一導軌上，該二導引座固設在該軌道托架上，每一導引座上設有與該軌道托架的第二導軌連接的弧形導軌，該移動門窗架的頂部固設有二移動導桿，該移動導桿伸入該第二導軌中，且其中一移動導桿與該主動滑輪組以一傳動件相接。藉此設計，該移動門窗能移動至與建築物之固定面位於同平面的位置而關閉該建築物上所設的開口，形成平坦、美觀的表面，並且在該移動門窗與該固定面之間形成良好的密封效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:滑軌組件</p>  
        <p type="p">11:軌道托架</p>  
        <p type="p">112:第二導軌</p>  
        <p type="p">12:導引座</p>  
        <p type="p">121:弧形導軌</p>  
        <p type="p">131:主動滑輪</p>  
        <p type="p">20:移動門窗</p>  
        <p type="p">21:移動導桿</p>  
        <p type="p">22:傳動件</p>  
        <p type="p">31:開口</p>  
        <p type="p">32:固定面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="121" publication-number="202620601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142187</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊加型觸控鍵盤裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250204B">G06F3/033</main-classification>  
        <further-classification edition="200601120250204B">G06F3/041</further-classification>  
        <further-classification edition="200601120250204B">H01H13/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>幸芯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭漢平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周敬禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周恒生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種疊加型觸控鍵盤裝置，其包含有觸控感應單元及鍵帽。觸控電極模組包含有柔性覆蓋層及柔性觸控感應單元。柔性觸控感應單元設置於柔性覆蓋層的下表面。鍵帽設置於柔性觸控感應單元的下方。如此一來，配置有觸控電極模組的疊加型觸控鍵盤裝置即可提供觸控功能及鍵盤的輸入功能，藉此無須另外配置觸控面板，藉此縮小配置疊加型觸控鍵盤裝置的電子裝置的整體體積，使得電子裝置能更便於攜帶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:柔性覆蓋層</p>  
        <p type="p">111:上表面</p>  
        <p type="p">112:下表面</p>  
        <p type="p">121:第一電極</p>  
        <p type="p">1211:跨橋</p>  
        <p type="p">122:第二電極</p>  
        <p type="p">123:第一薄膜</p>  
        <p type="p">1231:第一上表面</p>  
        <p type="p">1232:第一下表面</p>  
        <p type="p">20:鍵帽</p>  
        <p type="p">30:剪刀腳支撐架</p>  
        <p type="p">31:薄膜單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="122" publication-number="202620778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訓練系統、訓練方法、調光系統以及調光方法</chinese-title>  
        <english-title>TRAINING SYSTEM, TRAINING METHOD, DIMMING SYSTEM, AND DIMMING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250512B">G06T5/60</main-classification>  
        <further-classification edition="202301120250512B">G06N3/08</further-classification>  
        <further-classification edition="202301120250512B">G06N3/0464</further-classification>  
        <further-classification edition="200601120250512B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種訓練系統、訓練方法、調光系統、調光方法、內儲程式之電腦可讀取記錄媒體以及非暫時性電腦程式產品，其中訓練方法用於訓練待訓練神經網路模組，由處理模組執行；待訓練神經網路模組包含目標影像產生模組、待訓練神經網路以及光分布產生模組；訓練方法包含在一個訓練回合中執行：反覆地執行：將訓練集中的訓練影像作為輸入影像；對訓練影像的中間補償影像以及光分布執行卷積運算以產生卷積影像；以及基於卷積影像以及目標影像獲得損失；以及基於所有在前述步驟所得的損失的平均以及更新演算法，更新多個參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a training system, a training method, a dimming system, a dimming method, a computer readable recording medium with stored program, and a non-transitory computer program product. The training method is used for training a neural network module to be trained and is executed by a processing module; the neural network module to be trained comprises a target image generation module, a neural network to be trained, and a light distribution generation module; the training method comprises executing in oneepoch: repeatedly executing: using a training image in the training set as the input image; performing a convolution operation on the intermediate compensation image and the light distribution to generate a convolution image; and obtaining a loss based on the convolution image and the target image; and updating multiple parameters based on a average of all losses obtained in the preceding step and a update algorithm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:訓練系統</p>  
        <p type="p">101:處理模組</p>  
        <p type="p">102:待訓練神經網路模組</p>  
        <p type="p">103:目標影像產生模組</p>  
        <p type="p">104:待訓練神經網路</p>  
        <p type="p">105:光分布產生模組</p>  
        <p type="p">106:輸入影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="123" publication-number="202621011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Z軸振動馬達</chinese-title>  
        <english-title>VIBRATION MOTOR WITH VIBRATION IN THE DIRECTION OF Z-AXIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241218B">H02K33/04</main-classification>  
        <further-classification edition="200601120241218B">H02K1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台睿精工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPRAY MEMS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉錦松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIN-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張騏麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡孝名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HSIAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供Z軸振動馬達，包括：動子載座以及定子部。其中，該動子載座具有：懸吊彈片以及線圈組；該定子部具有：定子部本體以及軟性電路板。該懸吊彈片為長片形設置於動子載座的相對兩側，並且該懸吊彈片的一端連接動子載座相對另一端連接定子部；以及該線圈組設置於動子載座上，並且具有線圈以及導磁件。該線圈以振動軸向為中心軸捲繞，該導磁件位於線圈中心。該定子部的相對兩側連接懸吊彈片，用以在定子部與動子載座之間形成氣隙；該定子部本體為盒狀可容納該動子載座，並且定子部與動子載座皆為導磁材質；以及該軟性電路板設置於定子部本體上電性連接線圈組，用以供給驅動電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vibration motor with vibration in the direction of Z-axis is provided, which includes a mover carrier and a stator part. Wherein, the mover carrier includes a suspension spring and a coil group. The stator part includes a stator part body and a flexible printed circuit. The suspension spring is a long piece and is arranged on opposite sides of the mover carrier, wherein one end of the suspension spring is connected to the mover carrier and the other end is connected to the stator part. The coil assembly is arranged on the mover carrier, and which including a coil and a magnetically conductive part. The coil is wound with the vibration axis as the central axis. The magnetically conductive part is located at the center of the coil. The opposite sides of the stator part are connected with suspension spring to form an air gap between the stator part and the mover carrier. The stator part body is box-shaped to accommodate the mover carrier. The stator part and the mover carried are made of magnetically conductive material. The flexible printed circuit is arranged on the stator body and electrically connected to the coil group for supplying driving voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:動子載座</p>  
        <p type="p">10:固定塊</p>  
        <p type="p">11:懸吊彈片</p>  
        <p type="p">110:嵌合空間</p>  
        <p type="p">111:連接部</p>  
        <p type="p">112:折彎部</p>  
        <p type="p">113:自由端</p>  
        <p type="p">114:上彈片</p>  
        <p type="p">115:下彈片</p>  
        <p type="p">12:線圈組</p>  
        <p type="p">121:線圈</p>  
        <p type="p">122:導磁件</p>  
        <p type="p">2:定子部</p>  
        <p type="p">21:定子部本體</p>  
        <p type="p">22:軟性電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="124" publication-number="202621021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換式電子負載</chinese-title>  
        <english-title>SWITCHING ELECTRONIC LOAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250110B">H02M3/04</main-classification>  
        <further-classification edition="202001120250110B">G01R31/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳健銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種切換式電子負載，用於測試直流電源供應器。所述切換式電子負載包含連接端、切換式電路以及電感性元件。所述連接端用以電性連接直流電源供應器的輸出端。所述切換式電路依據測試命令，選擇性地提供第一電壓範圍的第一直流電壓或第二電壓範圍的第二直流電壓。所述電感性元件電性連接於連接端與切換式電路之間。其中第一電壓範圍不小於零電壓，第二電壓範圍小於零電壓。其中測試命令關聯於直流電源供應器提供的輸出電壓與輸出電流，輸出電壓為正電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a switching electronic load for testing a DC power supply. The switching electronic load comprises a connection end, a switching circuit, and an inductive component. The connecting end is used to electrically connect an output end of the DC power supply. The switching circuit selectively provides a first DC voltage in a first voltage range or a second DC voltage in a second voltage range according to a test command. The inductive element is electrically connected between the connection end and the switching circuit. The first voltage range is not less than zero voltage, and the second voltage range is less than zero voltage. The test command is related to an output voltage and an output current provided by the DC power supply, and the output voltage is a positive voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:切換式電子負載</p>  
        <p type="p">10:連接端</p>  
        <p type="p">12:切換式電路</p>  
        <p type="p">14:電感性元件</p>  
        <p type="p">2:直流電源供應器</p>  
        <p type="p">20:輸出端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="125" publication-number="202621023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142204</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有正負輸出電壓的電源供應電路</chinese-title>  
        <english-title>POWER SUPPLY CIRCUIT HAVING POSITIVE AND NEGATIVE OUTPUT VOLTAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H02M3/156</main-classification>  
        <further-classification edition="200601120250303B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具有正負輸出電壓的電源供應電路。本發明的電源供應電路包含初級側電路、變壓器以及次級側電路。初級側電路包含諧振轉換器。變壓器包含初級側線圈以及次級側線圈。次級側電路包含正電壓輸出電路以及負電壓輸出電路。諧振轉換器連接初級側線圈。正電壓輸出電路以及負電壓輸出電路連接次級側線圈，配置以分別輸出正輸出電壓以及負輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply circuit having positive and negative output voltages is provided. The power supply circuit includes a primary side circuit, a transformer, and a secondary side circuit. The primary side circuit includes a resonant converter. The transformer includes a primary side winding and a secondary side winding. The secondary side circuit includes a positive voltage output circuit and a negative voltage output circuit. The resonant converter is connected to the primary side winding. The positive voltage output circuit and the negative voltage output circuit are connected to the secondary side winding, and are respectively configured to output a positive output voltage and a negative output voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">PRYT1:初級側電路</p>  
        <p type="p">PR1:諧振轉換器</p>  
        <p type="p">TR:變壓器</p>  
        <p type="p">TC1:初級側線圈</p>  
        <p type="p">TC21:第一子次級側線圈</p>  
        <p type="p">TC22:第二子次級側線圈</p>  
        <p type="p">SEDT1:次級側電路</p>  
        <p type="p">VA1:正電壓輸出電路</p>  
        <p type="p">VB1:負電壓輸出電路</p>  
        <p type="p">VOUTP:正輸出電壓</p>  
        <p type="p">VOUTN:負輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="126" publication-number="202620520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">G02F1/1335</main-classification>  
        <further-classification edition="200601120250113B">G02F1/1343</further-classification>  
        <further-classification edition="200601120250113B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾宇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YU-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HONG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柜宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐旭寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSU-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種顯示裝置，包含：一背光模組；一光調整單元，設置於背光模組上，且包含：一第一基板；一第二基板，與第一基板對應設置；一液晶層，設置於第一基板與第二基板之間；以及一第一電極層，設置於第一基板與液晶層之間，且包含多個第一圖案；以及一顯示單元，設置於光調整單元上；其中，多個第一圖案的每一個具有一第一寬度，且多個第一圖案的其中兩個相鄰第一圖案具有一第一距離，第一寬度與第一距離的比值大於或等於0.5且小於或等於7.5，且液晶層的相位延遲大於或等於500 nm且小於或等於2700 nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An display device is provided, wherein the display device compries a backlight module; a light adjustment unit is disposed on the backlight module and comprises: a first substrate; a second substrate is disposed corresponding to the first substrate; a liquid crystal layer is disposed between the first substrate and the second substrate; and a first electrode layer is disposed between the first substrate and the liquid crystal layer, and comprises a plurality of first patterns; and a display unit is disposed on on the light adjustment unit. Each of the plurality of first patterns has a first width, two adjacent first patterns of the plurality of first patterns have a first distance, a ratio of the first width and the first distance is greater than or equal to 0.5 and less than or equal to 7.5, and a phase retardation of the liquid crystal layer is greater than or equal to 500 nm and less than or equal to 2700 nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:背光模組</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">2:光調整單元</p>  
        <p type="p">21:第一基板</p>  
        <p type="p">22:第二基板</p>  
        <p type="p">24:第一電極層</p>  
        <p type="p">241:第一圖案</p>  
        <p type="p">2411:第一電極</p>  
        <p type="p">2412:第二電極</p>  
        <p type="p">26:第一配向膜</p>  
        <p type="p">27:第二配向膜</p>  
        <p type="p">3:顯示單元</p>  
        <p type="p">31:第三偏光片</p>  
        <p type="p">32:第三基板</p>  
        <p type="p">33:第三電極層</p>  
        <p type="p">34:第四基板</p>  
        <p type="p">35:第四偏光片</p>  
        <p type="p">a:角度</p>  
        <p type="p">P1:第一間距</p>  
        <p type="p">S1:第一距離</p>  
        <p type="p">W1:第一寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="127" publication-number="202620657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通用序列匯流排供電裝置和偵測非正常硬重置的方法</chinese-title>  
        <english-title>UNIVERSAL SERIAL BUS POWER DELIVERY DEVICE AND METHOD OF INVALID HARD RESET DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">G06F13/38</main-classification>  
        <further-classification edition="200601120250204B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種通用序列匯流排供電裝置，包括位元偵測器、封包起始(SOP)週期計數器、重置偵測器以及旗標產生器。位元偵測器接收並偵測輸入資料訊號，並響應於輸入資料訊號中的前置碼位元組輸出具有第一位準的前置碼確認訊號。SOP週期計數器在前置碼確認訊號具有第二位準時開始計數，並輸出具有第一位準的SOP致能訊號。重置偵測器接收並判斷輸入資料訊號是否具有相關於硬重置的編碼，以輸出非正常硬重置訊號和K編碼確認訊號。旗標產生器接收SOP致能訊號、非正常硬重置訊號、K編碼確認訊號以及重置致能訊號，以將非正常硬重置旗標輸出至事件紀錄器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An universal serial bus power delivery device including a bit detector, a start of package (SOP) period counter, a reset detector, and a flag generator is provided. The bit detector receives and detects an input data signal, and output a preamble confirmation signal having a first level in response to a preamble set in the input data signal. The SOP period counter starts counting when the preamble confirmation signal has a second level, and outputs a SOP enable signal having the first level. The reset detector receives and determines whether the input data signal has codes related to hard reset, and outputs an invalid hard reset signal and a K code confirmation signal. The flag generator receives the SOP enable signal, the invalid hard reset signal, the K code confirmation signal, and a reset enable signal, and outputs an invalid hard reset flag to an event recorder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:通用序列匯流排(USB)供電(PD)裝置</p>  
        <p type="p">210:位元產生器</p>  
        <p type="p">220:位移暫存器</p>  
        <p type="p">230:位元偵測器</p>  
        <p type="p">232:匯流排閒置偵測器</p>  
        <p type="p">234:位元比較器</p>  
        <p type="p">240:封包起始(SOP)週期計數器</p>  
        <p type="p">250:重置偵測器</p>  
        <p type="p">252:非正常硬重置偵測器</p>  
        <p type="p">254:K編碼比較器</p>  
        <p type="p">260:旗標產生器</p>  
        <p type="p">270:事件紀錄器</p>  
        <p type="p">OAS:輸入訊號</p>  
        <p type="p">DBS:數位訊號</p>  
        <p type="p">Din:輸入資料訊號</p>  
        <p type="p">BI:匯流排閒置訊號</p>  
        <p type="p">PB_OK:前置碼確認訊號</p>  
        <p type="p">SOP_ON:封包起始(SOP)致能訊號</p>  
        <p type="p">IHR:非正常硬重置訊號</p>  
        <p type="p">ASC:K編碼確認訊號</p>  
        <p type="p">CSE:重置致能訊號</p>  
        <p type="p">IRD:非正常硬重置旗標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="128" publication-number="202619697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴洗鼻裝置</chinese-title>  
        <english-title>NASAL RINSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">A61H35/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北群醫學科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴洗鼻裝置，主要包括一下殼體及一第二中空管所構成；該下殼體其內具有一分隔壁分隔，形成第一空間與第二空間，該第一空間凸設有第一中空管，其一端的第一噴嘴從該底面凸出，並設有第一開口，而另一端的進氣管則向該第一空間的相反側延伸；該第二中空管係以第二噴嘴對應覆蓋該第一噴嘴而形成第一空腔，再以形狀相異的結合孔套設該第一中空管外周面形成部分未接觸的間隙，當流體從第一開口流出產生負壓，透過該間隙吸取該第一空間的清潔液，使流體會在該第一空腔與清潔液混合形成氣流，再通過該第二開口噴出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nasal rinsing device primarily comprises a lower housing and a second hollow tube. The lower housing is internally divided by a partition wall, creating a first and second space. The first space has a protruding first hollow tube, with one end forming a first nozzle that extends out from the bottom surface and includes a first opening. The other end has an air intake tube that extends in the opposite direction of the first space. The second hollow tube is equipped with a second nozzle that covers the first nozzle, forming a first cavity. The outer surface of the first hollow tube is partially covered by a coupling hole with a different shape, creating a gap that is not fully in contact. When fluid flows out from the first opening, it creates a negative pressure that draws cleaning liquid from the first space through the gap. This causes the fluid to mix with the cleaning liquid in the first cavity, forming an airflow, which then exits through the second opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:下殼體</p>  
        <p type="p">11:周壁</p>  
        <p type="p">13:第一中空管</p>  
        <p type="p">131:第一噴嘴</p>  
        <p type="p">133:第一開口</p>  
        <p type="p">14:分隔壁</p>  
        <p type="p">15:第一空間</p>  
        <p type="p">16:第二空間</p>  
        <p type="p">2:蓋體</p>  
        <p type="p">21:內框</p>  
        <p type="p">22:側壁</p>  
        <p type="p">23:第三噴嘴</p>  
        <p type="p">25:開孔</p>  
        <p type="p">26:引流壁</p>  
        <p type="p">3:第二中空管</p>  
        <p type="p">31:第二噴嘴</p>  
        <p type="p">32:結合孔</p>  
        <p type="p">33:套設端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="129" publication-number="202619698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸鼻裝置</chinese-title>  
        <english-title>NASAL SUCTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">A61H35/04</main-classification>  
        <further-classification edition="200601120241128B">A61M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北群醫學科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吸鼻裝置，係設置於連接頭上，並與負壓空氣耦接，其包括：杯罩、杯體及杯蓋，當該杯蓋蓋合於該杯體後，將該杯體安裝在該連接頭上，該杯罩則覆蓋並固定該杯體及該杯蓋於該連接頭，其特徵在於：其中該吸鼻裝置首先界定吸入孔至第一凹槽之間的第一氣流路徑，該路徑由第一中間空間、上部空間及第二中間空間構成，同時從該第一凹槽至該抽氣管之間形成由第一下部空間及第二下部空間組成的第二氣流路徑；其中該杯體的外壁上具備第一作用面，且該第一作用面與相鄰的兩個面之間設有該第一凹槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nasal suction device is mounted on a connector and coupled with a negative pressure air source. It includes a cup cover, a cup body, and a cup lid. When the cup lid is attached to the cup body, the cup body is then installed on the connector, and the cup cover encloses and secures both the cup body and the cup lid onto the connector. The device is characterized in that it first defines a first airflow path between the suction port and the first groove. This path is composed of a first intermediate space, an upper space, and a second intermediate space. Additionally, a second airflow path is formed between the first groove and the suction tube, consisting of a first lower space and a second lower space. The outer wall of the cup body features a first acting surface, and the first groove is located between the two adjacent surfaces of the first acting surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:吸嘴</p>  
        <p type="p">3:杯罩</p>  
        <p type="p">31:吸入孔</p>  
        <p type="p">32:排出孔</p>  
        <p type="p">33:頂面</p>  
        <p type="p">34:周壁</p>  
        <p type="p">35:限位凸塊</p>  
        <p type="p">4:杯體</p>  
        <p type="p">41:頂部壁</p>  
        <p type="p">421:第一底部壁</p>  
        <p type="p">431:第一缺口</p>  
        <p type="p">44:第一作用面</p>  
        <p type="p">45:第一凹槽</p>  
        <p type="p">46:底面</p>  
        <p type="p">5:杯蓋</p>  
        <p type="p">51:頂面</p>  
        <p type="p">52:凸體</p>  
        <p type="p">53:連通孔</p>  
        <p type="p">100:吸鼻裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="130" publication-number="202620327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>理線裝置及顯示器的支架</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250110B">F16M11/04</main-classification>  
        <further-classification edition="200601120250110B">F16M11/18</further-classification>  
        <further-classification edition="200601120250110B">H02G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商冠捷投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIA-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧永亟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, YUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種理線裝置包含一導軌及一理線機構。該導軌沿一高度方向延伸。該理線機構能沿該高度方向升降滑動地連接於該導軌並且能被操作而在一鎖定狀態及一解鎖狀態之間變換，在該鎖定狀態時，該理線機構鎖定於該導軌，在該解鎖狀態時，該理線機構能沿該高度方向升降滑動以調整高度。透過操作該理線機構從該鎖定狀態轉換至該解鎖狀態後，將該理線機構於該導軌上滑動。該理線機構方便依據使用者的需求調整至所需的高度再理線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:導軌</p>  
        <p type="p">5:理線機構</p>  
        <p type="p">6:滑動理線扣</p>  
        <p type="p">7:鎖定理線扣</p>  
        <p type="p">X:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="131" publication-number="202620967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援寬頻操作之行動裝置</chinese-title>  
        <english-title>MOBILE DEVICE SUPPORTING WIDEBAND OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250203B">H01Q5/30</main-classification>  
        <further-classification edition="200601120250203B">H01Q1/22</further-classification>  
        <further-classification edition="200601120250203B">H01Q1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張琨盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支援寬頻操作之行動裝置，包括：一饋入輻射部、一第一輻射部、一短路輻射部、一第二輻射部、一第三輻射部，以及一第四輻射部。饋入輻射部具有一饋入點。第一輻射部係鄰近於饋入輻射部。第一輻射部係經由短路輻射部耦接至一接地電位。第二輻射部係耦接至短路輻射部。第三輻射部係耦接至第一輻射部，其中第三輻射部係鄰近於饋入輻射部。第四輻射部係耦接至接地電位，其中第四輻射部係鄰近於饋入輻射部。饋入輻射部、第一輻射部、短路輻射部、第二輻射部、第三輻射部，以及第四輻射部係共同形成行動裝置之一天線結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mobile device supporting wideband operations includes a feeding radiation element, a first radiation element, a shorting radiation element, a second radiation element, a third radiation element, and a fourth radiation element. The feeding radiation element has a feeding point. The first radiation element is adjacent to the feeding radiation element. The first radiation element is coupled through the shorting radiation element to a ground voltage. The second radiation element is coupled to the shorting radiation element. The third radiation element is coupled to the first radiation element. The third radiation element is adjacent to the feeding radiation element. The fourth radiation element is coupled to the ground voltage. The fourth radiation element is adjacent to the feeding radiation element. An antenna structure of the mobile device is formed by the feeding radiation element, the first radiation element, the shorting radiation element, the second radiation element, the third radiation element, and the fourth radiation element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:行動裝置</p>  
        <p type="p">110:饋入輻射部</p>  
        <p type="p">111:饋入輻射部之第一端</p>  
        <p type="p">112:饋入輻射部之第二端</p>  
        <p type="p">114:饋入輻射部之第一部份</p>  
        <p type="p">115:饋入輻射部之第二部份</p>  
        <p type="p">120:第一輻射部</p>  
        <p type="p">121:第一輻射部之第一端</p>  
        <p type="p">122:第一輻射部之第二端</p>  
        <p type="p">126:第一輻射部之梯形增寬部份</p>  
        <p type="p">130:短路輻射部</p>  
        <p type="p">131:短路輻射部之第一端</p>  
        <p type="p">132:短路輻射部之第二端</p>  
        <p type="p">140:第二輻射部</p>  
        <p type="p">141:第二輻射部之第一端</p>  
        <p type="p">142:第二輻射部之第二端</p>  
        <p type="p">150:第三輻射部</p>  
        <p type="p">151:第三輻射部之第一端</p>  
        <p type="p">152:第三輻射部之第二端</p>  
        <p type="p">160:第四輻射部</p>  
        <p type="p">161:第四輻射部之第一端</p>  
        <p type="p">162:第四輻射部之第二端</p>  
        <p type="p">170:介質基板</p>  
        <p type="p">190:信號源</p>  
        <p type="p">CP:連接點</p>  
        <p type="p">FP:饋入點</p>  
        <p type="p">GC1:第一耦合間隙</p>  
        <p type="p">GC2:第二耦合間隙</p>  
        <p type="p">GC3:第三耦合間隙</p>  
        <p type="p">L1,L2,L3,L4,L5,L6:長度</p>  
        <p type="p">VSS:接地電位</p>  
        <p type="p">θ:鈍夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="132" publication-number="202620217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濺鍍設備</chinese-title>  
        <english-title>SPUTTERING COATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">C23C14/34</main-classification>  
        <further-classification edition="200601120250113B">C23C14/04</further-classification>  
        <further-classification edition="200601120250113B">C23C14/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汎銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSSCORPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳紀綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUNG CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃邦浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BANG HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐立科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明乃揭示一種濺鍍設備，包括：一真空腔體，其內部充有一具能量的離子化氣體；一濺鍍頭，設置於該真空腔體之上方；一靶材，固定於該濺鍍頭上，該靶材可被該具能量的離子化氣體轟擊而產生複數濺鍍原子；一樣品載台，設置於該真空腔體之下方，且面向該靶材，其中該樣品載台是用以乘載一樣品，該樣品具有一待檢測區；以及一遮罩，設置於該樣品載台與該靶材之間，該遮罩具有一開口，且該開口對應於該樣品的該待檢測區，藉由該遮罩使該等濺鍍原子僅能通過該開口並在該樣品的該待檢測區形成一局部鍍膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:濺鍍設備</p>  
        <p type="p">210:真空腔體</p>  
        <p type="p">220:具能量的離子化氣體</p>  
        <p type="p">230:濺鍍頭</p>  
        <p type="p">240:靶材</p>  
        <p type="p">250:濺鍍原子</p>  
        <p type="p">260:樣品載台</p>  
        <p type="p">280:樣品</p>  
        <p type="p">285:待檢測區</p>  
        <p type="p">288:局部鍍膜</p>  
        <p type="p">290:遮罩</p>  
        <p type="p">295:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="133" publication-number="202620381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼器</chinese-title>  
        <english-title>ENCODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250925B">G01D5/02</main-classification>  
        <further-classification edition="201301120250925B">G06F3/0362</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧春成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">編碼器包括從動輪、外殼、承載座、導磁正齒輪以及磁鐵。從動輪包括第一側盤面、第二側盤面、第一軸套以及第二軸套。外殼具有第一軸孔。承載座包括第一容置槽，第一容置槽具有第二軸孔。從動輪夾設於外殼與承載座之間，第一軸套置入第一軸孔內，第二軸套置入第二軸孔內。導磁正齒輪設置於從動輪上，並且與從動輪同步轉動。導磁正齒輪包含複數個齒。磁鐵設置於導磁正齒輪的外圍但不與導磁正齒輪接觸。磁鐵對複數個齒具有磁吸力，當從動輪轉動時，複數個齒係依序接近並遠離磁鐵，進而讓導磁正齒輪產生間歇性的轉動阻力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An encoder includes a driven wheel, a housing, a bearing base, a magnetic spur gear and a magnet. The driven wheel includes a first side disk surface, a second side disk surface, a first shaft sleeve and a second shaft sleeve. The housing has a first shaft hole. The bearing base includes a first accommodation groove, and the first accommodation groove has a second shaft hole. The driven wheel is clamped between the housing and the bearing base, the first shaft sleeve is placed in the first shaft hole, and the second shaft sleeve is placed in the second shaft hole. The magnetic spur gear is arranged on the driven wheel and rotates synchronously with the driven wheel. The magnetic spur gear contains a plurality of teeth. The magnet is arranged on the periphery of the magnetic conduction spur gear but does not contact the magnetic conduction spur gear. The magnet has magnetic attraction to the magnetic spur gear. When the driven wheel rotates, the plurality of teeth approach and move away from the magnet in sequence, causing the magnetic gear to generate intermittent rotational resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:編碼器</p>  
        <p type="p">11:從動輪</p>  
        <p type="p">111:第一側盤面</p>  
        <p type="p">113:第一軸套</p>  
        <p type="p">1131:第一貫孔</p>  
        <p type="p">1132:第一截面</p>  
        <p type="p">115:定位凸塊</p>  
        <p type="p">115H:高度</p>  
        <p type="p">116:環形光柵</p>  
        <p type="p">1161:光阻隔部</p>  
        <p type="p">1162:光穿透部</p>  
        <p type="p">12:外殼</p>  
        <p type="p">121:第一軸孔</p>  
        <p type="p">122:定位孔</p>  
        <p type="p">123:固定片</p>  
        <p type="p">13:承載座</p>  
        <p type="p">131:第一容置槽</p>  
        <p type="p">1311:開口</p>  
        <p type="p">1312:第二軸孔</p>  
        <p type="p">132:第二容置槽</p>  
        <p type="p">1321:開口</p>  
        <p type="p">134:卡扣</p>  
        <p type="p">135:貫孔</p>  
        <p type="p">14:導磁正齒輪</p>  
        <p type="p">141:第三軸孔</p>  
        <p type="p">142:齒</p>  
        <p type="p">142W:齒寬</p>  
        <p type="p">143:齒間</p>  
        <p type="p">15:磁鐵</p>  
        <p type="p">16:光學式轉動感測器</p>  
        <p type="p">161:光發射端</p>  
        <p type="p">162:光接收端</p>  
        <p type="p">163:電路基板</p>  
        <p type="p">17:旋轉軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="134" publication-number="202620472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G02B5/20</main-classification>  
        <further-classification edition="200601120241204B">G02B5/30</further-classification>  
        <further-classification edition="200601120241204B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉承霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HONG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋立偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含第一基板、第二基板、顯示介質層、彩色濾光層以及視角屏障層。第二基板相對於第一基板設置，且包含面對第一基板的第一表面以及背對第一基板的第二表面。顯示介質層設置於第一基板與第二基板之間。彩色濾光層設置於顯示介質層與第二基板之間。視角屏障層接觸第一表面以及第二表面的其中一者。並且，於第一表面的法線方向上，第二基板的厚度小於第一基板的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a first substrate, a second substrate, a display medium layer, a color filter layer and a viewing-angle barrier layer. The second substrate is disposed opposite to the first substrate and includes a first surface facing the first substrate and a second surface facing away from the first substrate. The display medium layer is disposed between the first substrate and the second substrate. The color filter layer is disposed between the display medium layer and the second substrate. The viewing-angle barrier layer contacts one of the first surface and the second surface. Furthermore, in the normal direction of the first surface, the thickness of the second substrate is smaller than the thickness of the first substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">200:第二基板</p>  
        <p type="p">200a:第一表面</p>  
        <p type="p">200b:第二表面</p>  
        <p type="p">300:顯示介質層</p>  
        <p type="p">302A、302B:配向層</p>  
        <p type="p">304:驅動電路層</p>  
        <p type="p">306:彩色濾光層</p>  
        <p type="p">308:遮光層</p>  
        <p type="p">310:黏著層</p>  
        <p type="p">312:偏光層</p>  
        <p type="p">400:視角屏障層</p>  
        <p type="p">402:平坦層</p>  
        <p type="p">DU:顯示單元層</p>  
        <p type="p">h:距離</p>  
        <p type="p">T100、T200:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="135" publication-number="202621363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="202601120260223B">H10W46/00</further-classification>  
        <further-classification edition="202001120260223B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林川嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUAN-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鉅富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHU-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先形成第一金屬間介電層於基底上以及第一金屬內連線於第一金屬間介電層內，然後形成一接觸墊於第一金屬間介電層上，形成一保護層於接觸墊上，去除部分保護層並暴露接觸墊，對接觸墊進行一晶片探偵測試，去除接觸墊以形成一凹槽，形成一介電層並完全填滿凹槽，再形成一第二金屬內連線於介電層內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric ((IMD) layer on the substrate and a first metal interconnection in the first IMD layer, forming a bonding pad on the first IMD layer, forming a passivation layer on the bonding pad, removing part of the passivation layer to expose the bonding pad, performing a chip probing test on the bonding pad, removing the bonding pad to form a recess, forming a dielectric layer to fill the recess completely, and forming a second metal interconnection in the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:金屬內連線</p>  
        <p type="p">16:金屬內連線</p>  
        <p type="p">18:金屬間介電層</p>  
        <p type="p">22:保護層</p>  
        <p type="p">26:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="136" publication-number="202620894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生理訊號分析方法及指令集</chinese-title>  
        <english-title>PHYSIOLOGICAL SIGNAL ANALYSIS METHOD AND INSTRUCTION SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241128B">G16H50/20</main-classification>  
        <further-classification edition="200601120241128B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮富勝有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRW LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇主勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHU SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生理訊號分析方法，包含：讀取包含生理訊號的原始數據；對原始數據進行標準化處理以獲得標準化數據；對標準化數據依照觀測窗口期進行切分處理以獲得切分數據；對切分數據進行濾波處理以獲得濾波數據；對濾波訊號進行微分處理以獲得微分數據；對微分數據進行篩選處理以保留微分數據中的斜率範圍內的第一部分數據；以及對第一部分數據進行分群處理以獲得生理訊號的周期資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A physiological signal analysis method comprising: reading raw data containing a physiological signal; standardizing the raw data to obtain standardized data; splitting the standardized data according to an observation window period to obtain segmented data; filtering the segmented data to obtain filtered data; differentiating the filtered signal to obtain differential data; screening the differential data to preserve a first part of the differential data within a slope range; and performing a clustering processing on the first part of the differential data to obtain a periodic information of the physiological signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:生理訊號分析方法</p>  
        <p type="p">101-107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="137" publication-number="202620120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發泡體及使用其的物品</chinese-title>  
        <english-title>FOAM AND ARTICLE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250901B">C08L23/08</main-classification>  
        <further-classification edition="200601120250901B">C08L53/00</further-classification>  
        <further-classification edition="200601120250901B">C08L53/02</further-classification>  
        <further-classification edition="200601120250901B">C08L101/00</further-classification>  
        <further-classification edition="200601120250901B">C08K5/14</further-classification>  
        <further-classification edition="200601120250901B">C08K5/23</further-classification>  
        <further-classification edition="200601120250901B">C08J9/10</further-classification>  
        <further-classification edition="200601120250901B">A43B13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長榮化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LCY CHEMICAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　天華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, RICHARD TIEN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利宇晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YU-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑋勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王又民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YOU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由發泡一樹脂組成物所形成的發泡體，包括：(A-B)n-OH、(B-A)n-OH、A(B-A)n-OH或B(A-B)n-OH的一羥基封端氫化苯乙烯嵌段共聚物，於端部具有一羥基，其中A嵌段於包括一苯乙烯單體單元，而B嵌段包括一共軛二烯單體單元；其中羥基封端氫化苯乙烯嵌段共聚物包括10至60 wt%的苯乙烯單體單元；40 mol%或以上的共軛二烯單體單元被氫化；羥基封端氫化苯乙烯嵌段共聚物的重量平均分子量為30000至200000；於氫化前，羥基封端氫化苯乙烯嵌段共聚物的共軛二烯單體單元中的1,2-乙烯基鍵含量為5至 60 mole%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A foam is obtained by foaming a resin composition, which comprises a hydroxyl-terminated hydrogenated styrenic block copolymer of (A-B)n-OH, (B-A)n-OH , A(B-A)n-OH, or B(A-B)n-OH having a hydroxyl group at the terminal; wherein the A block comprises a styrene monomer unit and the B block comprises a conjugated diene monomer unit; wherein the hydroxyl-terminated hydrogenated styrenic block copolymer comprises 10 ~ 60 % by weight of the styrene monomer unit; 40 mol % or more of the conjugated diene monomer unit is hydrogenated; and the hydrogenated styrenic block copolymer has a weight average molecular weight of about 30000 to about 200000; the 1,2-vinyl bond content in the conjugated diene monomer unit of the hydroxyl-terminated hydrogenated styrenic block copolymer is in the range of 5 to 60 mole % prior to hydrogenation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="138" publication-number="202619905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪胎氣嘴</chinese-title>  
        <english-title>TIRE VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">B60C29/06</main-classification>  
        <further-classification edition="200601120250113B">B60C23/04</further-classification>  
        <further-classification edition="200601120250113B">F16K15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿米瑟工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE LEGION ENGINEERING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫　韋恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, WAYNE-IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種輪胎氣嘴，包括：一管件，包括一內面、一內部通道及一大徑管段，該內部通道由該內面所界定且延伸穿過該大徑管段；及一閥組，包括一密封部，可活動地插設於該內部通道，可作動使得該密封部抵接於該內面而阻斷該內部通道、或使得該密封部不抵接於該內面而不阻斷該內部通道；其中，當該管件穿設於一輪框時，該大徑管段穿入至該輪框的一內部空間，該密封部抵接於該內面的位置是位於該輪框的內部空間中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a tire valve, wherein the tire valve includes: a tubular member including an inner surface, an internal channel and an enlarged section, the internal channel being defined by the inner surface and extending through the enlarged section; and a valve assembly including a sealing portion, movably inserted in the internal channel, and being operable to drive the sealing portion to engage with the inner surface to block the internal channel or disengage from the inner surface to unblock the internal channel; wherein when the tubular member is disposed through a rim, the enlarged section is inserted in an internal room of the rim, and a position where the sealing portion engages with the inner surface is located in the internal room of the rim.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:輪胎氣嘴</p>  
        <p type="p">10:管件</p>  
        <p type="p">13:大徑管段</p>  
        <p type="p">40:固緊件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="139" publication-number="202621455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶錠裂片完成之偵測方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DETECTING COMPLETION OF INGOT SPLITTING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/00</main-classification>  
        <further-classification edition="200601120260223B">B28D5/00</further-classification>  
        <further-classification edition="201401120260223B">B23K26/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯志諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶錠裂片完成之偵測方法及系統，該方法包含：由上、下吸盤吸附晶錠頂面與底面，設有荷重元的上吸盤對頂面施以拉力同時超音波源提供超音波振動作用於晶錠；荷重元檢知上吸盤之拉力低於設定值時，停止超音波振動；上側及下側真空壓力表檢知上吸盤與晶圓間及下吸盤與晶錠底面間若非真空則進行異常處理；負壓比例調壓閥偵測上吸盤與晶圓間的真空壓力若小於門檻值則進行異常處理；關閉上吸盤之真空並將晶圓釋放於承接盤，光電近接檢知器檢知晶圓表面若有破裂則進行異常處理；牙叉真空壓力表偵測牙叉吸盤與晶圓間若非真空則進行異常處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for detecting the completion of crystal ingot splitting process are provided. The method includes the following steps: Adsorbing the both sides of the crystal ingot respectively by an upper and a lower suction nuzzles. The upper suction nuzzle with a load unit exerts a pulling force upward on the top surface while an ultrasonic source provides ultrasonic vibration on the crystal ingot, and if the load cell detects the pulling force is less than a setting value, the ultrasonic vibration stops; The upper and the lower vacuum pressure gauges equipped with for detecting whether there is no vacuum between the nuzzles and the surfaces, if not, proceeds a failure process. The negative pressure proportional pressure regulating valve equipped with for detecting whether the vacuum pressure between the upper suction nuzzle and the wafer is less than the threshold, if yes, proceeds a failure process; After the vacuum of the upper suction nuzzle is closed and the wafer is released to the receiving plate, the photoelectric proximity detector detecting whether the wafer cracks, if yes, proceeds a failure process; And the fork vacuum pressure gauge detects whether there is no vacuum between the fork suction nuzzle and the wafer, if yes, proceeds a failure process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶錠裂片完成之偵測方法流程</p>  
        <p type="p">202~218:晶錠裂片完成之偵測方法流程之步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="140" publication-number="202620467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142256</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微結構透鏡</chinese-title>  
        <english-title>LENS WITH MICRO-STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">G02B3/02</main-classification>  
        <further-classification edition="200601120250113B">G02B3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微結構透鏡，其包括透鏡主體以及多個微結構。透鏡主體具有底面以及弧形表面。多個微結構配置於透鏡主體的弧形表面上，其中各個微結構分別具有圓形外緣，從透鏡主體的上方觀之，多個微結構的多個圓形外緣的圓心落在相同的位置，且多個圓形外緣彼此間呈等間距排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens with micro-structures including a lens body and micro-structures is provided. The lens body includes a bottom surface and a curved surface. The micro-structures are disposed on the spherical surface of the lens body, wherein each of the micro-structures includes a circular outer edge respectively. In view from atop of the lens body, the center points of the micro-structures located at the same position, and the circular outer edges of the micro-structures are arranged at equal intervals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微結構透鏡</p>  
        <p type="p">110:透鏡主體</p>  
        <p type="p">110B:底面</p>  
        <p type="p">110S:弧形表面</p>  
        <p type="p">112:底座部分</p>  
        <p type="p">114:弧形部分</p>  
        <p type="p">120:微結構</p>  
        <p type="p">200:發光二極體晶片</p>  
        <p type="p">250:封裝膠體</p>  
        <p type="p">300:電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="141" publication-number="202620260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掺雜金屬矽化合物之奈米纖維材料及其製造方法</chinese-title>  
        <english-title>METAL-DOPED SILICON COMPOUND NANO-FIBER MATERIAL AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">D01D5/00</main-classification>  
        <further-classification edition="200601120241220B">D01F1/02</further-classification>  
        <further-classification edition="200601120241220B">D01F9/10</further-classification>  
        <further-classification edition="200601120241220B">D01F11/00</further-classification>  
        <further-classification edition="201101120241220B">B82Y30/00</further-classification>  
        <further-classification edition="201101120241220B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞長學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHANG-SHIUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞長學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHANG-SHIUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種奈米纖維材料之製造方法包含：製備至少一聚合物溶液材料；製備至少一金屬與矽化合物混合材料；將該聚合物溶液材料及金屬與矽化合物混合材料進行一混合作業，以便獲得至少一聚合物/金屬與矽化合物混合材料；將該聚合物/金屬與矽化合物混合材料進行一靜電紡絲作業，以便獲得至少一初步靜電紡絲奈米纖維材料；及將該初步靜電紡絲奈米纖維材料進行一熱處理作業，以便獲得至少一掺雜金屬矽化合物之奈米纖維材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method for nano-fiber materials includes: prefabricating at least one polymer liquid; prefabricating at least one mixture of metal and silicon compound; mixing the mixture of metal and silicon compound with the polymer liquid in a mixing process to obtain at least one mixture material of polymer/ metal and silicon compound; processing the mixture material of polymer/ metal and silicon compound in an electrospinning process to obtain at least one preliminary electrospinned nano-fiber material; and processing the preliminary electrospinned nano-fiber material with a thermal treatment process to obtain a metal-doped silicon compound nano-fiber material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:奈米纖維材料</p>  
        <p type="p">11:聚合物材料</p>  
        <p type="p">12:掺雜金屬材料</p>  
        <p type="p">101:聚合物/金屬與矽化合物混合材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="142" publication-number="202620132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具生物分解性吸水複合材料及其製備方法</chinese-title>  
        <english-title>BIODEGRADABLE WATER-ABSORBING COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">C08L89/00</main-classification>  
        <further-classification edition="200601120241220B">C08L101/14</further-classification>  
        <further-classification edition="200601120241220B">C08L101/16</further-classification>  
        <further-classification edition="200601120241220B">C08K5/053</further-classification>  
        <further-classification edition="200601120241220B">C08K5/1539</further-classification>  
        <further-classification edition="200601120241220B">C08K5/20</further-classification>  
        <further-classification edition="200601120241220B">C08K5/357</further-classification>  
        <further-classification edition="200601120241220B">A61F13/15</further-classification>  
        <further-classification edition="200601120241220B">A61F13/53</further-classification>  
        <further-classification edition="200601120241220B">A61L15/20</further-classification>  
        <further-classification edition="200601120241220B">A61L15/32</further-classification>  
        <further-classification edition="200601120241220B">A61L15/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳億乘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具生物分解性吸水複合材料，包含一卵白成分、一醯化劑及一交聯劑；卵白成分之複數種蛋白質的含量介於3~5wt%；醯化劑與卵白成分之蛋白質的部分胺基產生反應，使卵白成分具有親水基團，且醯化劑的添加量基於蛋白質的重量介於0.05~0.5g/g；交聯劑與卵白成分之蛋白質的另一部分胺基或羥基產生鍵結，交聯劑的添加量基於蛋白質的重量介於0.1~0.7g/g，使得具生物分解性吸水複合材料能被自然生物分解且具備吸水及保水功能，而另一實施例提供製備具生物分解性吸水複合材料的方法經過簡化步驟，達到提升製程效率、提供環境友善具吸水性複合材料及減少能源損耗的效益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biodegradable water-absorbing composite material comprises an albumin component, an acylating agent, and a crosslinking agent. The content of various proteins in the albumin component ranges between 3-5 wt%. The acylating agent reacts with certain amine groups of the proteins in the albumin component, enabling the albumin component to acquire hydrophilic groups, with the addition amount of the acylating agent being between 0.05-0.5 g per gram of protein. The cross-linking agent forms bonds with other amine or hydroxyl groups in the proteins of the albumin component, with the addition amount of the cross-linking agent ranging between 0.1-0.7 g per gram of protein. This configuration allows the biodegradable water-absorbing composite material to be naturally biodegraded and possess both water-absorbing and water-retaining functions. Another embodiment provides a simplified preparation method for the biodegradable water-absorbing composite material, achieving enhanced process efficiency, offering an environmentally friendly water-absorbing composite material, and reducing energy consumption.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="143" publication-number="202619643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可掀起的密閉式容器</chinese-title>  
        <english-title>COSMETIC CONTAINER WITH A LID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A45D33/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>儷寶化粧品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIBO COSMETICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIAO YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的容器，包括：一個底座，其邊緣形成一個缺口；一個蓋子，包括：一個連接部，其凸出該蓋子並能置入該缺口；一個中心孔，其形成該連接部；多個樞接部，在該中心孔中；至少一個通道，其位於該中心孔而能連接相鄰的二該樞接部；以及一根銷，其裝入該底座並穿過該連接部的中心孔，該通道供該銷通過，各該樞接部輪流接收該銷，支持該蓋子覆蓋該底座或掀開，帶動該連接部相對該缺口移動。本發明利用該中心孔的多個樞接部，變換該銷在該連接部的樞接位置，提升該蓋子覆蓋該底座的密閉性，使承載化妝品的容器能穩定且平順地掀開或關閉，克服香味流失或變質硬化等問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cosmetic container includes a base, a lid assembly and a pin. The base includes a cutout in an edge. The lid assembly includes a lug extending in the cutout and including an aperture. The aperture includes two terminal portions and a reduced portion between the terminal portions. The pin includes two ends extending in the base and a middle section movable between the first and second terminal portions of the aperture via the reduced portion of the aperture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:銷</p>  
        <p type="p">31:內蓋</p>  
        <p type="p">32:環片</p>  
        <p type="p">34:連接部</p>  
        <p type="p">35:圓孔</p>  
        <p type="p">36:槽</p>  
        <p type="p">40:墊圈</p>  
        <p type="p">41:中心孔</p>  
        <p type="p">42:長肋</p>  
        <p type="p">43:短肋</p>  
        <p type="p">44:隆起部</p>  
        <p type="p">45:第一樞接部</p>  
        <p type="p">46:第二樞接部</p>  
        <p type="p">341:虛線位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="144" publication-number="202620804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>肢體關鍵點辨識裝置及其方法</chinese-title>  
        <english-title>LIMB KEY POINT IDENTIFICATION DEVICE AND METHOD THEROF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">G06V40/10</main-classification>  
        <further-classification edition="201701120250203B">G06T7/246</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁睿群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, JUEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YU-JE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種肢體關鍵點辨識裝置，包含攝影機以及運算電路。攝影機用以拍攝影像資料。影像資料包含多個幀。運算電路自攝影機接收所述多個幀，用以：對多個幀的第一幀執行第一操作，其中第一操作利用多個關鍵點定位第一幀中的人體；響應於多個幀的當前幀非為第一幀且信心度高於信心標準，對當前幀執行第二操作，其中第二操作追蹤當前幀的所述多個關鍵點，並根據當前幀的多個關鍵點調整信心度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Limb key point identification device includes a camera and a computing circuit. The camera is configured to capture an image data. The image data includes a plurality of frames. The computing circuit receives the frames from the camera, configured to: performing a first operation to a first frame of the frames, wherein the first operation locates a human body of the first frame by using a plurality of key points; in response to a current frame of the frames not being the first frame and a confidence level being higher than a confidence standard, performing a second operation to the current frame, wherein the second operation tracks the key points of the current frame and adjusts the confidence level based on the key points of the current frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:肢體關鍵點辨識裝置</p>  
        <p type="p">110:攝影機</p>  
        <p type="p">120:運算電路</p>  
        <p type="p">HBI_1:影像資料</p>  
        <p type="p">HB1:人體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="145" publication-number="202620642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能追蹤系統及其操作方法</chinese-title>  
        <english-title>INTELLIGENT TRACKING SYSTEM AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F11/34</main-classification>  
        <further-classification edition="200601120250203B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張筑鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭坤平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, KUN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能追蹤系統，包括處理器與儲存裝置。處理器用以存取儲存裝置所儲存之服務內容解析模組、遙測內容解析模組、跨度模組及遙測儲存模組，以執行服務內容解析模組、遙測內容解析模組、跨度模組及遙測儲存模。處理器執行如下內容。透過服務內容解析模組，對服務資料進行解析，以取得一般內容與遙測內容。透過遙測內容解析模組，對遙測內容進行解析，以取得自定義資料。透過跨度模組，對服務資料添加至少一日誌，以產生跨度資料。透過遙測儲存模組，將跨度資料、一般內容、遙測內容與自定義資料儲存至資料庫，以形成追蹤資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent tracking system includes a processor and a storage device. The processor is used to access a service content analysis module, a remote sensing payload analysis module, a span module and a remote sensing storage module to execute the service content analysis module, the remote sensing payload analysis module, the span module and the remote sensing storage module. The processing executes the following contents. The service content analysis module is used to analyze service data to obtain a general content and a remote sensing payload. The remote sensing payload analysis module is used to analyze the remote sensing payload to obtain customized data. The span module is used to add at least one log to the service data to generate span data. The remote sensing storage module is used to store the span data, the general content, the remote sensing payload and the customized data in a database to form tracking data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:智能追蹤系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:儲存裝置</p>  
        <p type="p">130:服務內容解析模組</p>  
        <p type="p">140:遙測內容解析模組</p>  
        <p type="p">150:跨度模組</p>  
        <p type="p">160:遙測儲存模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="146" publication-number="202619808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極的清潔方法</chinese-title>  
        <english-title>ELECTRODE CLEANING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B08B7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁特電子企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIGHT ELECTRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏奕韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林品萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PIN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾智勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIN YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高仕棻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, SHIH FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張貴雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUEI-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電極的清潔方法，包括以下步驟。將第一電極置入電解槽中，並電連接至外部電源，外部電源電連接電解槽中的第二電極。由外部電源提供正電壓至第一電極，使第一電極進行氧化反應，進而使附著於第一電極的雜質脫落。停止提供正電壓，使第一電極與第二電極之間自然放電。由外部電源提供負電壓至第一電極，使第一電極進行還原反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrode cleaning method includes the following steps. An electrode is placed in an electrolytic tank and electrically connected to an external power source. The external power source is electrically connected to a second electrode in the electrolytic tank. A positive voltage is applied to the electrode by the external power source to cause an oxidation reaction at the electrode, thereby removing impurities attached to the electrode. The positive voltage is stopped being applied to cause a natural discharge between the electrode and the second electrode. A negative voltage is applied to the electrode by the external power source to cause a reduction reaction at the electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a:步驟(a)</p>  
        <p type="p">b:步驟(b)</p>  
        <p type="p">c:步驟(c)</p>  
        <p type="p">d:步驟(d)</p>  
        <p type="p">e:步驟(e)</p>  
        <p type="p">f:步驟(f)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="147" publication-number="202621258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁阻隨機存取記憶體及其製作方法</chinese-title>  
        <english-title>MRAM AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B63/00</main-classification>  
        <further-classification edition="202301120241202B">H10N50/80</further-classification>  
        <further-classification edition="202301120241202B">H10N50/10</further-classification>  
        <further-classification edition="202301120241202B">H10N50/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王意晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程家甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鈞耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁阻隨機存取記憶體包含一下電極、一磁性穿隧接面、一上蓋層和一上電極由下至上依序堆疊，其中磁性穿隧接面包含一自由層，上蓋層包含由一鎂層、一氧化鎂層、一氧化鉭層和一第一鉭層所組成的一混合物層，混合物層接觸自由層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An MRAM includes a bottom electrode, a magnetic tunnel junction, a cap layer and a top electrode stacked in sequence from bottom to top. The magnetic tunnel junction includes a free layer. The cap layer includes a mixture layer. The mixture layer includes a magnesium layer, a magnesium oxide layer, a tantalum oxide layer and a first tantalum layer. The mixture layer contacts the free layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:自由層</p>  
        <p type="p">26:鎂層</p>  
        <p type="p">28:氧氣</p>  
        <p type="p">T1:第一厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="148" publication-number="202619621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑切鋸</chinese-title>  
        <english-title>SLIDE-CUTTING SAW ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">A01G3/025</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄紫琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄紫琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種滑切鋸，其特點主要包括：一延伸桿，沿著立軸向延伸而界定形成頂、底端；一握柄部，設於延伸桿底端以供使用者手部握持；一鋸齒片設於延伸桿頂端，該鋸齒片形成有單向鋸齒；一樹枝限位架，包括立架部及橫架部，橫架部藉由支軸樞組接於延伸桿頂端對應處，立架部則與鋸齒片之單向鋸齒之間相對界定形成樹枝置入空間；一夾制座滑設於樹枝限位架；一彈力夾緊手段用以產生彈性側壓推力，從而驅使樹枝限位架之夾制座能夠保持抵靠於樹枝的狀態，使樹枝被鋸切過程中具有朝鋸齒片方向推進的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a slide-cutting saw assembly comprising an extension rod, a handle portion, a saw blade, a branch positioning frame, a clamping seat, and an elastic clamping means. The extension rod extends along a vertical axis and defines a top and a bottom end. A handle portion is provided at the bottom end of the extension rod for user grip. The saw blade is disposed at the top end of the extension rod, the saw blade being formed with unidirectional teeth. The branch positioning frame comprises a vertical frame portion and a transverse frame portion, with the transverse frame portion pivotally connected to the corresponding top end of the extension rod by a support shaft. The vertical frame portion and the unidirectional teeth of the saw blade define a branch insertion space therebetween. The clamping seat is slidably positioned on the branch positioning frame. The elastic clamping means is configured to produce an elastic side pressure, thereby urging the clamping seat of the branch positioning frame to maintain a position against a branch, such that the branch advances toward the saw blade during the cutting process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:延伸桿</p>  
        <p type="p">11:頂端</p>  
        <p type="p">12:底端</p>  
        <p type="p">20:握柄部</p>  
        <p type="p">30:鋸齒片</p>  
        <p type="p">31:上端</p>  
        <p type="p">32:下端</p>  
        <p type="p">33:背側</p>  
        <p type="p">34:作用側</p>  
        <p type="p">35:單向鋸齒</p>  
        <p type="p">40:樹枝限位架</p>  
        <p type="p">41:立架部</p>  
        <p type="p">42:橫架部</p>  
        <p type="p">43:支軸</p>  
        <p type="p">44:受動部件</p>  
        <p type="p">45:樹枝置入空間</p>  
        <p type="p">50:夾制座</p>  
        <p type="p">60:彈性襯墊</p>  
        <p type="p">61:凹弧面</p>  
        <p type="p">70:升降活動架</p>  
        <p type="p">71:頂部</p>  
        <p type="p">72:底部</p>  
        <p type="p">73:限位架部</p>  
        <p type="p">80:鎖定構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="149" publication-number="202619780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分流器結構及分流器結構的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B01D35/30</main-classification>  
        <further-classification edition="200601120241204B">B01D27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱舟濾材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敏華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作分流器結構包含一上蓋部及一分流部，上蓋部具有一配合管及一組裝壁，配合管具有一連接段，分流部位於配合管中，並具有一中央管、複數肋片及一連接座，中央管穿入配合管中並形成一中央流道，中央管與配合管之間形成一外圍流道，肋片設於中央管的外圍，且與配合管的內壁有間隙，連接座抵靠並連接該連接段。本創作的製造方法係分別提供一上蓋及一分流件，將分流件組裝入上蓋中，透過熔接將上蓋與分流件結合製成分流器結構，能降低成本。該分流器結構藉由該組裝壁組設至一濾心，中央流道及外圍流道配合濾心的種類提供不同的過濾路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:上蓋部</p>  
        <p type="p">11:配合管</p>  
        <p type="p">111:配合孔</p>  
        <p type="p">112:連接段</p>  
        <p type="p">113:對位段</p>  
        <p type="p">12:組裝壁</p>  
        <p type="p">20:分流部</p>  
        <p type="p">21:中央管</p>  
        <p type="p">211:中央流道</p>  
        <p type="p">22:肋片</p>  
        <p type="p">23:連接座</p>  
        <p type="p">231:穿孔</p>  
        <p type="p">24:外圍流道</p>  
        <p type="p">25:延伸管</p>  
        <p type="p">30:濾心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="150" publication-number="202619986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機能水生成回收裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241223B">C02F9/00</main-classification>  
        <further-classification edition="202301120241223B">C02F1/00</further-classification>  
        <further-classification edition="202301120241223B">C02F1/28</further-classification>  
        <further-classification edition="202301120241223B">C02F1/40</further-classification>  
        <further-classification edition="202301120241223B">C02F1/44</further-classification>  
        <further-classification edition="202301120241223B">C02F1/461</further-classification>  
        <further-classification edition="202301120241223B">C02F1/78</further-classification>  
        <further-classification edition="200601120241223B">C02F7/00</further-classification>  
        <further-classification edition="201101120241223B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林福興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林福興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是提供一種機能水生成回收裝置及其製造方法，主要係藉由該入水單元的自來水入水裝置將自來水部分引入自來水冷卻儲存槽，部分引入電解水模組使其產生酸性電解水，部分引入核心超純水生成裝置，以分解產生臭氧水、鹼性電解水及碳酸水透過清洗機、過濾及油水分離作業，以產生可清洗半導體的超純水，清洗完成的超純水並可透過本發明的回收過濾製程，以達到機能水重複回收使用，以大幅降低廢水排放量，達到水資源環保綠能回收再利用之機能水生成回收裝置及其製造方法之技術領域。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">A:前置作業流程區段</p>  
        <p type="p">B:後置作業流程區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="151" publication-number="202619900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滾筒式清潔器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">B41F35/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓔珞雲國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIAN, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滾筒式清潔器，適用於清潔一印刷版，並包含一握持單元及一滾筒單元。該握持單元包括一握柄及一沿一左右方向延伸且可樞轉地穿設於該握柄的轉軸結構。該滾筒單元安裝於該轉軸結構且適用於吸附液體，該滾筒單元能夠以該轉軸結構為軸心轉動，而在該印刷版的表面上相對滾動，藉此，能讓該印刷版表面不同處的多餘液體隨著該滾筒單元滾動而被吸附，減少該滾筒式清潔器在該印刷版表面同一處反覆清潔的機率，進而有效清潔該印刷版，達到清潔度提升的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:握持單元</p>  
        <p type="p">11:握柄</p>  
        <p type="p">111:中空孔</p>  
        <p type="p">112:底部凹槽</p>  
        <p type="p">112a:底部狹縫</p>  
        <p type="p">113:頂部狹縫</p>  
        <p type="p">12:轉軸結構</p>  
        <p type="p">121:軸承</p>  
        <p type="p">122:樞軸</p>  
        <p type="p">122a:固定孔</p>  
        <p type="p">123:安裝件</p>  
        <p type="p">124:固定件</p>  
        <p type="p">125:本體部</p>  
        <p type="p">126:凸條</p>  
        <p type="p">127:固定部</p>  
        <p type="p">128:限位部</p>  
        <p type="p">129:安裝部</p>  
        <p type="p">132:發光元件</p>  
        <p type="p">14:遮蓋</p>  
        <p type="p">21:滾筒</p>  
        <p type="p">211:外周面</p>  
        <p type="p">212:端面</p>  
        <p type="p">21a:第一安裝孔</p>  
        <p type="p">3:滾筒片體</p>  
        <p type="p">31:第二安裝孔</p>  
        <p type="p">X:前後方向</p>  
        <p type="p">Y:左右方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="152" publication-number="202619908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電用的端子組及其端子座</chinese-title>  
        <english-title>TERMINAL SET FOR CHARGING AND TERMINAL BLOCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241119B">B60L53/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳憲儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳美蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江進豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JINN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充電用的端子組，包含一端子座，及一可卸離地插接於該端子座的端子頭。該端子座包括一根部，及數個由該根部沿一軸線的方向延伸且彼此相間隔的彈片。每一該彈片具有一相反於該根部的開口端、一鄰近該開口端的第一錐面，及一鄰近該第一錐面且位於該第一錐面與該根部間的第二錐面。該第二錐面的內徑不小於該第一錐面的內徑。藉此，磨耗前的端子頭、或磨耗後的端子頭，都能夠以面接觸的型態接觸於該等第一錐面、該等第二錐面之至少一者，進而提升該端子座與該端子頭的接觸面積，及減少導通電流時的電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A terminal set for charging comprising a terminal block and a terminal head removably inserted into the terminal block. The terminal block includes a root, and a number of splinters extending from the root in the direction of an axis and spaced apart from each other. Each of the shrapnel has an open end opposite to the root, a first taper adjacent to the open end, and a second taper adjacent to the first taper and located between the first taper and the root. The second taper has an inner diameter which is not smaller than the inner diameter of the first taper. Hereby, the terminal head before wear, or the terminal head after wear, can be contacted with at least one of the first taper and the second taper in a face-to-face contact state, thereby enhancing the contact area between the terminal holder and the terminal head, and reducing the resistance during conduction of current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:端子座</p>  
        <p type="p">41:根部</p>  
        <p type="p">42:彈片</p>  
        <p type="p">422:第一錐面</p>  
        <p type="p">423:第二錐面</p>  
        <p type="p">425:平面</p>  
        <p type="p">426:第三錐面</p>  
        <p type="p">5:端子頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="153" publication-number="202621277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有隔離深N型井的隔離結構的半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE WITH ISOLATION STRUCTURE FOR ISOLATING DEEP N-WELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張日謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉昱辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易成名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIH, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種具有用以隔離深N型井的隔離結構的半導體結構，其包含一第一深N型井與一第二深N型井，一深N型井隔離結構位於該第一深N型井與該第二深N型井之間並隔離兩者，其中該深N型井隔離結構包含一P型隔離井以及一形成在該P型隔離井中的P型摻雜區、一第一N型井位於該第一深N型井中並連接到一第一工作電壓、以及一第二N型井位於該第二深N型井中並連接到一第二工作電壓，其中該第一工作電壓與該第二工作電壓不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure with isolation structure for isolating deep N-wells (DNWs), including a first DNW and a second DNW, an DNW isolation structure isolating between the first DNW and second DNW, wherein the DNW isolation structure includes an isolating P-well and a P-type doped region in the isolating P-well, a first N-well in the first DNW and connected to a first operating voltage, and a second N-well in the second DNW and connected to a second operating voltage, wherein the first operating voltage is different from the second operating voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">100a:第一區域</p>  
        <p type="p">100b:第二區域</p>  
        <p type="p">100N:NMOS區域</p>  
        <p type="p">100P:PMOS區域</p>  
        <p type="p">102:淺溝槽隔離結構</p>  
        <p type="p">103:深N型井隔離結構(DNW隔離結構)</p>  
        <p type="p">106:P型摻雜區</p>  
        <p type="p">D:汲極</p>  
        <p type="p">DNW1:第一深N型井</p>  
        <p type="p">DNW2:第二深N型井</p>  
        <p type="p">IPW:P型隔離井</p>  
        <p type="p">NMOS:N型金屬氧化物半導體</p>  
        <p type="p">NW1:第一N型井</p>  
        <p type="p">NW2:第二N型井</p>  
        <p type="p">PMOS:P型金屬氧化物半導體</p>  
        <p type="p">S:源極</p>  
        <p type="p">V&lt;sub&gt;dd1&lt;/sub&gt;:第一工作電壓</p>  
        <p type="p">V&lt;sub&gt;dd2&lt;/sub&gt;:第二工作電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="154" publication-number="202620696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142309</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器學習模型的訓練方法與主機系統</chinese-title>  
        <english-title>TRAINING METHOD FOR MACHINE LEARNING MODEL AND HOST SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250204B">G06N3/08</main-classification>  
        <further-classification edition="201901120250204B">G06N20/00</further-classification>  
        <further-classification edition="202001120250204B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鈺豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYU, JIAN PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　皓智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, AN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種機器學習模型的訓練方法與主機系統。此主機系統包含可複寫式非揮發性記憶體模組。訓練方法包含：執行機器學習模型的訓練程序，其中在訓練程序的一時期的一迭代，將迭代產生的暫態資料以及回溯資料儲存在可複寫式非揮發性記憶體模組；若主機系統發生異常使得迭代中斷，從可複寫式非揮發性記憶體模組中讀取暫態資料以及回溯資料，根據回溯資料決定迭代的一階段，並根據暫態資料執行此階段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a training method for a machine learning model and a host system. The host system includes a rewritable non-volatile memory module. The training method includes: executing a training process of the machine learning model, wherein in an iteration at an epoch of the training process, storing transient data and backtracking data generated by the iteration in the rewritable non-volatile memory module; if an abnormality occurs in the host system causing an interruption in the iteration, reading the transient data and backtracking data from the rewritable non-volatile memory module, determining a stage of the iteration based on the backtracking data, and resuming the stage according to the transient data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">33:可複寫式非揮發性記憶體模組</p>  
        <p type="p">111:處理器</p>  
        <p type="p">410:前向傳播</p>  
        <p type="p">420:反向傳播</p>  
        <p type="p">510:更新階段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="155" publication-number="202620110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性聚酯彈性體的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF THERMOPLASTIC POLYESTER ELASTOMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C08J11/24</main-classification>  
        <further-classification edition="200601120241205B">C08J11/26</further-classification>  
        <further-classification edition="200601120241205B">C08G63/183</further-classification>  
        <further-classification edition="200601120241205B">C08G63/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章鑑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHANG-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MONG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱塑性聚酯彈性體的製造方法，包括以下步驟：提供聚酯回收物，聚酯回收物包括聚對苯二甲酸乙二酯；執行第一解聚步驟，其包括將所述聚酯回收物與聚對苯二甲酸乙二酯寡聚物混合而進行押出解聚，以至少獲得聚對苯二甲酸乙二酯多聚物；以及執行聚合步驟，其包括添加長鏈型聚烷基二元醇而進行聚合反應，以至少獲得熱塑性聚酯彈性體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of thermoplastic polyester elastomer including the following steps is provided: providing a recycled polyester product including polyethylene terephthalate; performing a first depolymerization step including extrusion depolymerization of a mixture including the recycled polyester product and polyethylene terephthalate oligomer to obtain at least polyethylene terephthalate polymer; and performing a polymerization step including adding a long-chain poly(alkyl diol) to perform a polymerization reaction to obtain at least a thermoplastic polyester elastomer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S105、S110、S120、S130、S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="156" publication-number="202620248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合銅箔及其製造方法</chinese-title>  
        <english-title>COMPOSITE COPPER FOIL AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241108B">C25D7/06</main-classification>  
        <further-classification edition="200601120241108B">C25D3/38</further-classification>  
        <further-classification edition="200601120241108B">C25D21/12</further-classification>  
        <further-classification edition="200601120241108B">B32B15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEN TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仲妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合銅箔，其包括第一銅箔、第二銅箔以及絕緣接合層。絕緣接合層位於第一銅箔與第二銅箔之間。絕緣接合層的厚度小於5微米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite copper foil including a first copper foil, a second copper foil and an insulating bonding layer is provided. The insulating bonding layer is disposed between the first copper foil and the second copper foil. A thickness of the insulating bonding layer is less than 5 micrometers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20、S30、S40、S50、S60:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="157" publication-number="202620592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源管理裝置及電源管理的方法</chinese-title>  
        <english-title>POWER MANAGEMENT DEVICE AND METHOD FOR POWER MANAGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F1/26</main-classification>  
        <further-classification edition="200601120250303B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪浩翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HAO-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源管理裝置及電源管理的方法。電源管理裝置包括電源輸入端、穩壓器、電源轉換電路以及電源控制器。穩壓器基於電源輸入端上的輸入電壓提供第一電源電壓。電源轉換電路基於第一電源電壓及輸入電壓而產生第二電源電壓。電源控制器基於所述第二電源電壓而被啟動。在啟動完電源控制器後，電源控制器偵測系統電源狀態來控制穩壓器的電源。當系統電源狀態是關機狀態時，電源控制器關閉穩壓器的電源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power management device and a power management method. The power management device includes a power input terminal, a voltage regulator, a power conversion circuit, and a power controller. The voltage regulator provides a first power voltage based on an input voltage on the power input terminal. The power conversion circuit generates a second power voltage based on the first power voltage and the input voltage. The power controller is enabled based on the second power voltage. After starting the power controller, the power controller detects a system power state to control the power supply of the voltage regulator. When the system power state is off, the power controller turns off the power supply of the voltage regulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源管理裝置</p>  
        <p type="p">102:電池</p>  
        <p type="p">105:變壓器</p>  
        <p type="p">110:電池充電電路</p>  
        <p type="p">112:電池充電控制器</p>  
        <p type="p">115:充放電開關</p>  
        <p type="p">120:穩壓器</p>  
        <p type="p">130:電源轉換電路</p>  
        <p type="p">132:重置電路</p>  
        <p type="p">134:電源開關</p>  
        <p type="p">136:降壓轉換器</p>  
        <p type="p">140:電源控制器</p>  
        <p type="p">150:系統裝置</p>  
        <p type="p">162、165、172、175:蕭特基二極體</p>  
        <p type="p">P1、P2:電源路徑</p>  
        <p type="p">PD_IN:電源輸送電壓</p>  
        <p type="p">SYS_G:電源輸入端</p>  
        <p type="p">EN:致能端</p>  
        <p type="p">P_IN:電源輸入端</p>  
        <p type="p">P_OUT:電源輸出端</p>  
        <p type="p">+3VA_G:第一電源電壓</p>  
        <p type="p">+3VA:第二電源電壓</p>  
        <p type="p">PM1:P型電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="158" publication-number="202619914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池能源站之電池數量監控管理方法及系統</chinese-title>  
        <english-title>BATTERY QUANTITY MONITORING AND MANAGEMENT METHODS AND SYSTEMS FOR BATTERY ENERGY STATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250207B">B60L53/68</main-classification>  
        <further-classification edition="201901120250207B">B60L53/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉育睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯一安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池能源站之電池數量監控管理方法及系統。首先，於一遠端伺服器提供相應一電池能源站中複數電池之一預設電池數量。接著，電池能源站對於電池進行充電，並提供電池進行一電池交換作業。電池能源站透過一網路將目前於電池能源站中電池之一第一電池數量傳送至遠端伺服器。遠端伺服器判斷預設電池數量及第一電池數量是否相符合，且當預設電池數量及第一電池數量並未相符合時，產生一警示通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Battery quantity monitoring and management method and system for battery energy stations are provided. First, a preset battery quantity corresponding to a plurality of batteries in a battery energy station is provided in a remote sever. Then, the battery energy station charges the batteries and provides the batteries for a battery exchange operation. The battery energy station transmits a first battery quantity of the batteries currently in the battery energy station to the remote server through a network. The remote server determines whether the preset battery quantity and the first battery quantity match, and generates a warning notification when the preset battery quantity and the first battery quantity do not match.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420、S430、S440、S450:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="159" publication-number="202620674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於虛擬分身的舞蹈著作舉證系統及其方法</chinese-title>  
        <english-title>EVIDENCE SYSTEM FOR DANCE COPYRIGHT BASED ON VIRTUAL AVATAR AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250113B">G06F21/30</main-classification>  
        <further-classification edition="201301120250113B">G06F21/62</further-classification>  
        <further-classification edition="201301120250113B">G06F21/64</further-classification>  
        <further-classification edition="202201120250113B">G06V40/20</further-classification>  
        <further-classification edition="201201120250113B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, TA WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於虛擬分身的舞蹈著作舉證系統及其方法，透過傳感器及動作捕捉技術捕捉使用者姿態，再結合成像技術生成虛擬分身，並且使虛擬分身與使用者姿態維持一致的動作，當虛擬分身生成後，允許動態調整虛擬分身的動作及生成相應的調整紀錄，以及允許輸入編舞筆記。接著，再將使用者姿態、調整紀錄及編舞筆記一併作為舞蹈舉證訊息以進行儲存，以及對舞蹈舉證訊息進行簽章後發布至區塊鏈網路作為舞蹈著作的舉證依據，藉以達到提高舞蹈著作的舉證便利性及不可否認性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An evidence system for dance copyright based on virtual avatar and method thereof is disclosed. By capturing the user's posture through sensors and motion capture technology, then combining imaging techniques to generate a virtual avatar that maintains consistent movements with the user's posture, while allowing dynamic adjustments to the virtual avatar's actions and generating corresponding adjustment records when the virtual avatar is generated, as well as permitting the input of choreography notes. Subsequently, the user's posture, adjustment records, and choreography notes are stored together as dance evidence information, which is then signed and published to a blockchain network as evidence for the dance copyright. The mechanism is help to improve the convenience and undeniability of dance copyright evidence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:動作捕捉裝置</p>  
        <p type="p">120:電腦主機</p>  
        <p type="p">121:非暫態電腦可讀儲存媒體</p>  
        <p type="p">122:硬體處理器</p>  
        <p type="p">130:區塊鏈網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="160" publication-number="202620846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於AI監控預測的虛擬人行為安全管理系統及其方法</chinese-title>  
        <english-title>BEHAVIOR SAFETY MANAGEMENT SYSTEM FOR VIRTUAL HUMAN BASED ON AI MONITORING AND PREDICTION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250205B">G10L25/51</main-classification>  
        <further-classification edition="201301120250205B">G10L25/30</further-classification>  
        <further-classification edition="202201120250205B">G06V20/52</further-classification>  
        <further-classification edition="200601120250205B">G06N3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>占毅鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, YI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於AI監控預測的虛擬人行為安全管理系統及其方法，透過即時監控由使用者操控的虛擬人物與其他虛擬人物的對談，以及搭配人聲識別技術及語音轉文字技術，將語音對談內容轉換為文字訊息，再通過檢索強化生成（Retrieval-Augmented Generation, RAG）技術來生成對談預測訊息，並輸入至預先訓練完成的安全防護語言模型以預測虛擬人物是否符合不當行為特徵，若符合則即時限制使用者對虛擬人物的操控，藉以達到提高虛擬世界的互動安全性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A behavior safety management system for virtual human based on ai monitoring and prediction and method thereof is disclosed. By monitoring real-time conversations between user-controlled virtual characters and other virtual characters, along with voice recognition and speech-to-text technologies to convert spoken dialogue into text messages, the system employs Retrieval-Augmented Generation (RAG) to generate predictive dialogue messages. These messages are then input into a pre-trained safety language model to predict whether the virtual character exhibits inappropriate behavior characteristics. If such characteristics are identified, the system will promptly restrict the user's control over the virtual character. The mechanism is help to improve the interaction safety in the virtual world.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟210:硬體處理器載入預先訓練完成的一安全防護語言模型</p>  
        <p type="p">步驟220:當使用者操作一虛擬人物進行對談時，該硬體處理器擷取該虛擬人物的對談以生成一對談語音，並且通過人聲識別技術及語音轉文字技術將該對談語音轉換為多個對談訊息</p>  
        <p type="p">步驟230:該硬體處理器通過檢索強化生成(Retrieval-Augmented Generation,RAG)的一檢索器，從一外部知識庫檢索與所述對談訊息相關的多個知識訊息，並且由檢索強化生成的一生成器根據所述知識訊息及自然語言處理(Natural Language Processing,NLP)技術，生成準確且具高度相關性的一對談預測訊息</p>  
        <p type="p">步驟240:該硬體處理器將該對談預測訊息輸入至該安全防護語言模型以預測該虛擬人物是否符合一不當行為特徵，若是，即時禁止所述使用者對該虛擬人物的操控</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="161" publication-number="202620842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於AI學習觀察的虛擬人演化系統及其方法</chinese-title>  
        <english-title>VIRTUAL HUMAN EVOLUTION SYSTEM BASED ON AI LEARNING OBSERVATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241204B">G10L15/06</main-classification>  
        <further-classification edition="201301120241204B">G10L15/28</further-classification>  
        <further-classification edition="202001120241204B">G06F40/30</further-classification>  
        <further-classification edition="201901120241204B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, TA WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秋龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, QIU LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於AI學習觀察的虛擬人演化系統及其方法，透過在虛擬人物觸發對談事件時，持續錄製語音以生成完整對談語音，並且通過語音轉文字技術將完整語音轉換為完整對談訊息，再將完整對談訊息作為新訓練資料以輸入至預先訓練完成的語言模型，以便對語言模型進行重新訓練，以及將完整對談訊息輸入至個性分析模型以獲得真人個性資料，並且根據真人個性資料動態調整虛擬人物的虛擬個性資料，藉以達到提高虛擬人物的互動契合性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A virtual human evolution system based on ai learning observation and method thereof is disclosed. By continuously recording voice to generate complete dialogue audio when the virtual human triggers a conversation event, the audio is converted into a complete dialogue message using speech-to-text technology. This complete dialogue message is then used as new training data and input into the pre-trained language model for retraining. Additionally, the complete dialogue message is input into the personality analysis model to obtain real personality data, which is then used to dynamically adjust the virtual human's virtual personality data based on the real personality information. The mechanism is help to improve the interaction compatibility of virtual human.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟210:於初始時，硬體處理器載入一個性分析模型，以及載入與一虛擬人物相應的一虛擬個性資料及一語言模型，其中，該個性分析模型及該語言模型皆為預先訓練完成的機器學習模型</p>  
        <p type="p">步驟220:當該硬體處理器偵測到該虛擬人物觸發一對談事件時，持續錄製該虛擬人物的語音以生成一完整對談語音，並且通過語音轉文字技術將該完整對談語音轉換為一完整對談訊息</p>  
        <p type="p">步驟230:該硬體處理器將該完整對談訊息作為一新訓練資料，並且將該新訓練資料輸入至預先訓練完成的該語言模型，用以對該語言模型進行重新訓練</p>  
        <p type="p">步驟240:該硬體處理器將該完整對談訊息輸入至該個性分析模型以輸出一真人個性資料，並且根據該真人個性資料動態調整該虛擬人物的該虛擬個性資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="162" publication-number="202619770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據對手擊球行為模擬進行桌球對戰訓練之裝置及方法</chinese-title>  
        <english-title>DEVICE FOR GIVING TABLE TENNIS SIMULATION TRAINING BASED ON HITTING BEHAVIOR OF OPPONENT AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A63B69/00</main-classification>  
        <further-classification edition="200601120241130B">A63B67/04</further-classification>  
        <further-classification edition="200601120241130B">A63B71/06</further-classification>  
        <further-classification edition="202201120241130B">G06V40/20</further-classification>  
        <further-classification edition="202201120241130B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔慶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, QING CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張洪濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONG TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據對手擊球行為模擬進行桌球對戰訓練之裝置及方法，其透過分析歷史對打影像以取得桌球之運動狀態與多個球員之擊球行為，並依據運動狀態與球員之擊球行為訓練與各球員對應之各機器學習模型後，使用實境技術顯示虛擬選手與虛擬桌球，當輪到虛擬選手擊球時，使用與虛擬選手對應之球員之機器學習模型產生虛擬選手之虛擬擊球行為並依據虛擬擊球行為產生虛擬桌球之運動狀態，而當輪到使用者擊球時，依據使用者目標擊球行為使用與使用者對應之機器學習模型產生虛擬桌球之運動狀態，最後使用實境技術顯示虛擬桌球之運動狀態之技術手段，可以對球員的擊球行為即時給予回應，並達成提供球員與虛擬對手進行對打訓練的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for giving a table tennis simulation training based on hitting behavior of an opponent and a method thereof are provided. By analyzing historical playing videos to obtain motion status of a ball of table tennis and the hitting behaviors of players, training each machine learning model corresponding to each of the players based on the movement status and player's batting behavior, using a reality technology to display a virtual player and a virtual ball of table tennis, using the machine learning model of one of the player corresponding to the virtual player to generate virtual hitting behaviors of the virtual player and generating virtual motion status of the virtual ball based on the virtual hitting behavior when it is the virtual player's turn to hit the virtual ball, using the machine learning model corresponding to a user to generate virtual motion status of the virtual ball based on the user's target hitting behavior when it is the user's turn to hit the virtual ball, and using the reality technology to display the virtual motion status of virtual ball, the device and the method can provide instant response to player's hitting behavior, and can achieve the effect of providing players with a virtual opponent for sparring training.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟310:取得多個桌球活動之歷史對打影像</p>  
        <p type="p">步驟320:分析歷史對打影像以取得桌球之運動狀態與球員之擊球行為</p>  
        <p type="p">步驟330:依據運動狀態與各球員之擊球行為訓練與各球員對應之各機器學習模型</p>  
        <p type="p">步驟340:產生虛擬選手與虛擬桌球，並使用實境技術顯示虛擬選手與虛擬桌球</p>  
        <p type="p">步驟350:在輪到虛擬選手擊球時，依據虛擬桌球之運動狀態、虛擬選手之當前位置、使用者之當前位置使用與虛擬選手對應之球員之機器學習模型產生虛擬選手之虛擬擊球行為，並依據虛擬擊球行為重新產生虛擬桌球之運動狀態，及使用實境技術顯示虛擬選手之虛擬擊球動作與虛擬桌球之運動狀態</p>  
        <p type="p">步驟370:在輪到使用者擊球時，依虛擬桌球之運動狀態與使用者之目標擊球動作使用與使用者對應之機器學習模型重新產生虛擬桌球之運動狀態，並使用實境技術顯示虛擬桌球之運動狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="163" publication-number="202620843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供數位相框具語音互動與智慧生成之系統及其方法</chinese-title>  
        <english-title>PROVIDING DIGITAL PHOTO FRAME WITH VOICE INTERACTION AND INTELLIGENCE GENERATION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G10L15/22</main-classification>  
        <further-classification edition="200601120250203B">G10L15/26</further-classification>  
        <further-classification edition="200601120250203B">G06F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞卓佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, ZHUO JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供數位相框具語音互動與智慧生成之系統及其方法，數位相框提供互動語音至圖像編修伺服器，圖像編修伺服器使用語音轉文字技術轉換為文字訊息，圖像編修伺服器透過應用程式介面提供文字訊息至人工智慧平台，由人工智慧平台反饋包含執行指令的文字回應，圖像編修伺服器使用通用人工智慧模型執行文字回應所包含的執行指令，自數位相框取得數位圖像並加以編輯或是修改為編修數位圖像或自數位相框取得數位圖像並加以編輯或是修改為編修數位圖像，數位相框依據編修數位圖像所包含的多模態資訊進行顯示或數位相框依據編修數位圖像所包含的多模態資訊進行顯示以及播放，藉此可以達成提供語音互動與智慧編修生成數位圖像的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A providing digital photo frame with voice interaction and intelligence generation system and a method are provided. Interaction voice is provided to image edition and modification server from digital photo frame. Text message is converted by using speech-to-text technology according to interaction voice by image edition and modification server. Text message is provided to artificial intelligence platform from image edition and modification server through application programming interface. Text response which is included execute instruction is feedback to image edition and modification server from artificial intelligence platform through application programming interface. Text response which is included execute instruction is executed by using general artificial intelligence model by image edition and modification server. Digital image is edited or modified to generate edition and modification digital image by image edition and modification server or digital image is edited and modified to generate edition and modification digital image by image edition and modification server. Edition and modification digital image is displayed according to multimodal information of edition and modification digital image by digital photo frame or edition and modification digital image is displayed and played according to multimodal information of edition and modification digital image by digital photo frame. Therefore, the efficiency of providing voice interaction and intelligence edition and modification to generate digital image may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:數位相框</p>  
        <p type="p">20:人工智慧平台</p>  
        <p type="p">30:圖像編修伺服器</p>  
        <p type="p">31:非暫態計算機可讀儲存媒體</p>  
        <p type="p">32:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="164" publication-number="202621071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動功率控制電路</chinese-title>  
        <english-title>AUTOMATIC POWER CONTROL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250204B">H04B10/564</main-classification>  
        <further-classification edition="200601120250204B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連恩微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳培煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳憲穀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIEN-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種光通訊晶片的自動功率控制電路，耦接於一數位控制單元與一直流-直流轉換器。該自動功率控制電路包括：一數位類比轉換器，耦接於該數位控制單元，該數位類比轉換器接收該數位控制單元所產生的一數位碼以產生一數位類比轉換器輸出電壓；一輸出緩衝電路，耦接於該數位類比轉換器與該直流-直流轉換器，該輸出緩衝電路提供一內部節點電壓；以及一類比數位轉換器，耦接於該輸出緩衝電路與該數位控制單元，該類比數位轉換器透過該數位類比轉換器控制該直流-直流轉換器所輸出的一供應電壓，使得該供應電壓與該內部節點電壓之間的一壓差維持在一正常工作範圍區間內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application provides an automatic power control circuit for an optical communication chip, coupled to a digital control unit and a DC-DC converter. The automatic power control circuit includes: a digital-to-analog converter (DAC) coupled to the digital control unit, where the DAC receives a digital code generated by the digital control unit to produce a DAC output voltage; an output buffer circuit coupled to the DAC and the DC-DC converter, the output buffer circuit providing an internal node voltage; and an analog-to-digital converter (ADC), coupled to the output buffer circuit and the digital control unit, wherein the ADC controls a supply voltage of the DC-DC converter through the DAC, ensuring that a voltage difference between the supply voltage and the internal node voltage remains within a normal operating range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:數位控制單元</p>  
        <p type="p">20:DC-DC轉換器</p>  
        <p type="p">30:數位類比轉換器(DAC)</p>  
        <p type="p">40:負載</p>  
        <p type="p">RLOAD:負載電阻</p>  
        <p type="p">MP:電晶體</p>  
        <p type="p">105A:輸出緩衝電路</p>  
        <p type="p">100A:電壓模式數位類比轉換器(VDAC)</p>  
        <p type="p">EA:誤差放大器</p>  
        <p type="p">110:分壓電路</p>  
        <p type="p">R1、R2:電阻</p>  
        <p type="p">120:類比數位轉換器(ADC)</p>  
        <p type="p">50A:自動功率控制電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="165" publication-number="202619677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內視鏡裝置及其轉向模組</chinese-title>  
        <english-title>ENDOSCOPE DEVICE AND STEERING MODULE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">A61B1/005</main-classification>  
        <further-classification edition="200601120241202B">A61B1/012</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳顥言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAO-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SU-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">轉向模組包括模組外旋轉件及模組內旋轉件。模組外旋轉件包括第一模組配合部。模組內旋轉件相對模組外旋轉件可轉動地穿過模組外旋轉件，且包括第二模組配合部。第一模組配合部及第二模組配合部用以與內視鏡裝置之底座連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A steering module includes a module outer rotating element and a module inner rotating element. The module outer rotating element includes a first module fitting portion. The module inner rotating element is rotatable relative to the module outer rotating element and passes through the module outer rotating element, and includes a second module fitting portion. The first module fitting portion and the second module fitting portion are configured to connect with a base of an endoscope device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:底座</p>  
        <p type="p">200:第一轉向模組</p>  
        <p type="p">205e:端面</p>  
        <p type="p">210:模組外旋轉件</p>  
        <p type="p">2122:第二軸部</p>  
        <p type="p">212a:第一模組配合部</p>  
        <p type="p">215:模組內旋轉件</p>  
        <p type="p">2152B:第二軸部</p>  
        <p type="p">2152C:第一模組定位部</p>  
        <p type="p">2152a:第二模組配合部</p>  
        <p type="p">273:抵壓部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="166" publication-number="202620680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用隱寫處理提供加密功能的系統</chinese-title>  
        <english-title>SYSTEM THAT UTILIZES STEGANOGRAPHY TO PROVIDE ENCRYPTION FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250205B">G06F21/60</main-classification>  
        <further-classification edition="201301120250205B">G06F21/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪正祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳廷恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TING-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃淑賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡佑丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種利用隱寫處理提供加密功能的系統，其包括一隱寫處理模組、一準確度分析模組及一量化指標模組。隱寫處理模組將製造加工圖資料轉換為一灰階圖資料，隱寫處理模組將隱藏程式碼編碼為二進制資料，並依據一最小有效位元方程式對灰階圖資料與二進制資料進行隱寫處理，從而獲得一隱寫圖資料；準確度分析模組與隱寫處理模組耦接，準確度分析模組用於取得一致性值；量化指標模組與準確度分析模組耦接，量化指標模組依據一均方誤差方程式取得一相似度值，並將分析結果輸出於終端裝置。藉此，本申請能提高智慧製造領域資料處理之安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system that utilizes steganography to provide encryption function, which comprises a steganography module, an accuracy analysis module and a quantitative index module. The steganography module converts the manufacturing processing drawing data into a grayscale graph data, and the steganography module encodes the hidden code into binary data, and carries out steganography processing on the grayscale graph data and the binary data according to a least significant bit equation, so as to obtain a steganography graph data; The accuracy analysis module is coupled with the steganography module, and the accuracy analysis module is used to obtain the consistency value. The quantitative index module is coupled with the accuracy analysis module, and the quantitative index module obtains a similarity value according to a mean square error equation, and outputs the analysis results to the terminal device. Thus, the present application can improve the security of data processing in the field of intelligent manufacturing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">1:伺服器</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">10:隱寫處理模組</p>  
        <p type="p">20:準確度分析模組</p>  
        <p type="p">30:量化指標模組</p>  
        <p type="p">40:品質分析模組</p>  
        <p type="p">50:安全評估模組</p>  
        <p type="p">60:像素檢測模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="167" publication-number="202619860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人關節裝置</chinese-title>  
        <english-title>ROBOT JOINT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">B25J9/08</main-classification>  
        <further-classification edition="200601120250107B">B25J9/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳顥言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAO-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SU-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">機器人關節裝置包括關節件、第一樞轉件、第二樞轉件及第三樞轉件。關節件包括第一樞軸、第二樞軸及第三樞軸。第一樞轉件樞接於第一樞軸。第二樞轉件樞接於第二樞軸。第三樞轉件樞接於第三樞軸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robot joint device includes a joint element, a first pivot element, a second pivot element and a third pivot element. The joint element includes a first pivot shaft, a second pivot shaft and a third pivot shaft. The first pivot element is pivotally connected to the first pivot shaft. The second pivot element is pivotally connected to the second pivot shaft. The third pivot element is pivotally connected to the third pivot shaft.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100’:機器人關節裝置</p>  
        <p type="p">110:關節件</p>  
        <p type="p">120:第一樞轉件</p>  
        <p type="p">130:第二樞轉件</p>  
        <p type="p">140:第三樞轉件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="168" publication-number="202620490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光通訊裝置以及光通訊裝置的使用方法</chinese-title>  
        <english-title>OPTICAL COMMUNICATION DEVICE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G02B6/42</main-classification>  
        <further-classification edition="200601120241204B">H01R13/641</further-classification>  
        <further-classification edition="201101120241204B">H01R12/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煜軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光通訊裝置以及光通訊裝置的使用方法。光通訊裝置包括殼體、定位結構以及變形傳感器。殼體包括前開口以及鄰近於上述前開口的內彈片。定位結構設置於上述殼體，且包括鄰近於上述內彈片的外彈片。變形傳感器設置於上述內彈片以及上述外彈片之間。當光通訊模組插入上述殼體內且使上述內彈片變形時，上述變形傳感器發出變形訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical communication device and the operation method thereof are provided. The optical communication device includes a housing, a positioning structure, and a deformation sensor. The housing includes a front opening and an inner elastic sheet adjacent to the front opening. The positioning structure is disposed on the housing, and includes an outer elastic sheet adjacent to the inner elastic sheet. The deformation sensor is between the inner elastic sheet and the outer elastic sheet. When the optical communication module is inserted into the housing and deforms the inner elastic sheet, the deformation sensor transmits deformation signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光通訊裝置</p>  
        <p type="p">10:路板</p>  
        <p type="p">30:殼體</p>  
        <p type="p">31:底板</p>  
        <p type="p">32:側壁</p>  
        <p type="p">33:頂板</p>  
        <p type="p">34:後壁</p>  
        <p type="p">35:內彈片</p>  
        <p type="p">36:結合結構</p>  
        <p type="p">37:連接塊</p>  
        <p type="p">40:定位結構</p>  
        <p type="p">42:結合片</p>  
        <p type="p">43:連接片</p>  
        <p type="p">44:定位彈片</p>  
        <p type="p">45:外彈片</p>  
        <p type="p">50:變形傳感器</p>  
        <p type="p">60:距離傳感器</p>  
        <p type="p">70:發光模組</p>  
        <p type="p">71:第一光源</p>  
        <p type="p">72:第二光源</p>  
        <p type="p">D1:插置方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="169" publication-number="202619971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造非晶矽顆粒之方法及執行該方法之製造設備</chinese-title>  
        <english-title>METHOD OF MANUFACTURING AMORPHOUS SILICON PARTICLES AND MANUFACTURING EQUIPMENT IMPLEMENTING SUCH METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C01B33/039</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍星材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUE STAR ADVANCED MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, CHUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造複數顆非晶矽顆粒之方法，先於惰性氣體中，加熱複數塊鹼金屬塊以及包含複數顆初始矽顆粒之矽源以形成第一產物，其中第一產物包含由複數顆初始矽顆粒與複數塊鹼金屬塊反應而成之複數顆津特耳相化合物。接著，本發明之方法繼續於惰性氣體中，將第一產物浸入醇類或鹵素中且於醇類或鹵素的沸騰溫度以下維持一時間長度以對複數顆津特耳相化合物執行脫鹼金屬製程，進而形成第二產物。最後，本發明之方法對第二產物執行分離、清洗製程，以獲得第三產物。第三產物包含複數顆非晶矽顆粒以及殘餘鹼金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a plurality of amorphous silicon is, firstly, to heat a plurality of alkali metal chunks and a silicon source including a plurality of initial silicon particles to form a first product in an inert gas atmosphere, the first product includes a plurality of Zintl phase compounds formed by reacting the plurality of initial silicon particles with the plurality of alkali metal chunks. Next, the method of the invention is to immerse the first product in an alcohol or a halogen continuously in the inert gas atmosphere and at a temperature below the boiling point of the alcohol or the halogen for a period of time to perform a dealkalization process on the Zintl phase compounds to form a second product. Finally, the method of the invention is to perform a separation process and a washing process on the second product to obtain a third product. The third product includes the plurality of amorphous silicon particles and a residual amount of alkali metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:方法</p>  
        <p type="p">S10~S22:流程步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="170" publication-number="202620297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇裝置及其控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">F04D27/00</main-classification>  
        <further-classification edition="200601120250117B">F04D25/16</further-classification>  
        <further-classification edition="201601120250117B">H02P7/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迎廣科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IN WIN DEVELOPMENT INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風扇裝置及其控制方法，該風扇裝置包含一主機板、一與該主機板電連接的控制板，以及數個與該控制板電連接的風扇。該主機板與該控制板共同執行驅動該等風扇的一風扇控制方法。該主機板以分時多工的方式發送一分時多工控制訊號給該控制板，該控制板根據該分時多工控制訊號產生數個驅動訊號後發送給該等風扇以令該等風扇運轉，達成本發明分別發送不同的控制訊號給不同的風扇，以令風扇使用適當的轉速進行散熱，藉此提升電源的利用效率的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:分時多工控制訊號</p>  
        <p type="p">21:風扇控制訊號</p>  
        <p type="p">22:控制終點訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="171" publication-number="202621092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路節能管控系統、方法及電腦可讀媒介</chinese-title>  
        <english-title>NETWORK ENERGY-SAVING MANAGEMENT CONTROL SYSTEM, METHOD AND COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L41/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周愉捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YU-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種網路節能管控系統、方法及電腦可讀媒介，係將複數網路傳輸裝置配置於能服務複數用戶端之網路上，且複數用戶端可具有相同或不同之網路路徑需求與頻寬需求，以由至少一控制器管控複數網路傳輸裝置。再者，控制器之網路路徑計算管理模組可針對複數用戶端之網路路徑需求計算出多種可行之網路路徑組合，以由全網能耗模擬模組採用模擬方式將複數用戶端之頻寬需求套用至多種網路路徑組合之主要網路路徑上而計算出多種網路路徑組合之全網能耗數據。另外，網路路徑計算管理模組可選用全網最低能耗之網路路徑組合，以供網路路徑規則供裝模組對複數網路傳輸裝置進行複數用戶端之主要與備援網路路徑之網路路徑規則之供裝或更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a network energy-saving management control system, method and computer readable medium. Multiple network transmission devices are configured on a network that can serve multiple clients, the multiple clients may have same or different network path requirements and bandwidth requirements, and at least one controller controls the multiple network transmission devices. Furthermore, a network path calculation management module of the controller can calculate a variety of feasible network path combinations based on the network path requirements of the multiple clients, and a whole network energy consumption simulation module uses a simulation method to apply the bandwidth requirements of the multiple clients to main network paths of the various network path combinations to calculate whole network energy consumption data of the various network path combinations. In addition, the network path calculation management module can select the network path combination with the lowest energy consumption in the entire network, so that a network path rule provisioning module is used to install or update network path rules for primary and backup network paths of the multiple clients on the multiple network transmission devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:網路節能管控系統</p>  
        <p type="p">10:網路傳輸裝置</p>  
        <p type="p">20:控制器</p>  
        <p type="p">21:用戶需求管理模組</p>  
        <p type="p">211:用戶需求</p>  
        <p type="p">22:網路資訊收集模組</p>  
        <p type="p">221:網路資訊</p>  
        <p type="p">23:網路路徑計算管理模組</p>  
        <p type="p">231:網路路徑組合</p>  
        <p type="p">24:全網能耗模擬模組</p>  
        <p type="p">241:全網能耗數據</p>  
        <p type="p">25:網路路徑規則供裝模組</p>  
        <p type="p">251:網路路徑規則</p>  
        <p type="p">26:網路傳輸裝置管控介面</p>  
        <p type="p">A:用戶端</p>  
        <p type="p">B:主要網路路徑</p>  
        <p type="p">N:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="172" publication-number="202621534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉星語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施智元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要提供一嵌埋有電子元件之包覆層，再於該包覆層上依序形成佈線結構與線路結構，且形成強化盲孔於該線路結構中，以分散該佈線結構與線路結構中之應力，因而避免該佈線結構或線路結構發生碎裂之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package is made by providing a encapsulating layer with embedded electronic components, then sequentially forming a wiring structure and a circuit structure on the encapsulating layer, and forming reinforced vias in the circuit structure to disperse the stress in the wiring structure and circuit structure, thereby avoiding the problem of cracking of the wiring structure or circuit structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">21:強化盲孔</p>  
        <p type="p">22:電子元件</p>  
        <p type="p">22b:非作用面</p>  
        <p type="p">23:包覆層</p>  
        <p type="p">23b:第二表面</p>  
        <p type="p">24:佈線結構</p>  
        <p type="p">240:絕緣層</p>  
        <p type="p">241:佈線層</p>  
        <p type="p">242:第一導電盲孔</p>  
        <p type="p">25:線路結構</p>  
        <p type="p">250:介電層</p>  
        <p type="p">251:線路層</p>  
        <p type="p">252:第二導電盲孔</p>  
        <p type="p">26:導電元件</p>  
        <p type="p">B:垂直投影區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="173" publication-number="202621141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動部署系統及其方法</chinese-title>  
        <english-title>AUTOMATIC DEPLOYMENT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250203B">H04W16/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠傳電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAR EASTONE TELECOMMUNICATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈立翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, LI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳浡禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方凱田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, KAI-TEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江華珮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUA-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旗達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, CHYI-DAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林紀宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖哲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TUNG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銘偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種自動部署系統及其方法，自動部署系統包括輸入單元、模擬單元及部署單元，輸入單元接收在沒有訊號路徑再分配器的狀態下的使用者設備的第一實際傳輸資訊，模擬單元接收模擬參數，並根據模擬參數而模擬生成第一模擬資訊以及第二模擬資訊，部署單元根據第一實際傳輸資訊、第一模擬資訊以及第二模擬資訊訓練生成預測部署模型，預測部署模型根據第二實際傳輸資訊生成預測部署資訊。自動部署方法，則是基於自動部署訊號路徑再分配系統生成預測部署資訊的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an automatic deployment system and method thereof. The system for automatic deployment of signal path redistributors includes an input unit, a simulation unit, and a deployment unit. The input unit receives first actual transmission information of user devices in the absence of signal path redistributors. The simulation unit receives simulation parameters and generates first simulation information and second simulation information based on the simulation parameters. The deployment unit trains and generates a prediction deployment model using the first actual transmission information, first simulation information, and second simulation information. The prediction deployment model generates prediction deployment information based on the second actual transmission information. The method for automatic deployment of signal path redistributors involves steps related to utilizing the automatic deployment system to generate prediction deployment information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:輸入單元</p>  
        <p type="p">2:模擬單元</p>  
        <p type="p">3:部署單元</p>  
        <p type="p">4:基地台</p>  
        <p type="p">5:使用者設備</p>  
        <p type="p">6:訊號路徑再分配器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="174" publication-number="202621101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電話隱碼與來電推播之系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04M3/42</main-classification>  
        <further-classification edition="200601120250203B">H04L12/18</further-classification>  
        <further-classification edition="202201120250203B">H04L67/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一零四資訊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王少谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃君毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃家培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嵩榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電話隱碼與來電推播之系統及方法，包括一取號模組及一推播模組，當一會員資料庫中儲存的任一求職者的履歷被存取時，取號模組產生與該履歷相關聯之一電話代碼，其中，電話代碼和履歷中之電話號碼被儲存於一隱碼平台，且電話代碼和一固定代表號組成一組唯一號碼；當任一求才者撥打唯一號碼時，推播模組接收一來電通知，並產生推播訊息給電話號碼所對應之求職者的求職應用程式，其中，來電通知係由隱碼平台傳送給推播模組，隱碼平台係根據唯一號碼中的電話代碼查詢出對應之電話號碼以傳送來電通知，推播訊息顯示第一求才者的訊息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電話隱碼與來電推播之系統</p>  
        <p type="p">100:求職網站伺服器</p>  
        <p type="p">12:取號模組</p>  
        <p type="p">14:推播模組</p>  
        <p type="p">16:會員資料庫</p>  
        <p type="p">20:隱碼平台</p>  
        <p type="p">30:求才者</p>  
        <p type="p">32:求職者</p>  
        <p type="p">34:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="175" publication-number="202619762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滅火系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A62C3/07</main-classification>  
        <further-classification edition="200601120241130B">A62C3/00</further-classification>  
        <further-classification edition="200601120241130B">A62C37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海絲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYFIBER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂文裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滅火系統適用於車輛，並包含在車輛上方的支架單元及防火單元。支架單元包括彼此間隔的第一、二區域。防火單元包括設置於支架單元上的捲軸，及可脫離地捲繞於捲軸的防火布。防火單元能相對於支架單元自捲繞狀態變換到展開狀態。在捲繞狀態時，該捲軸位於第一區域，且防火布捲繞於捲軸。在展開狀態時，捲軸位於第二區域，且防火布脫離捲軸並能披覆於車輛。由於防火單元能相對於支架單元自捲繞狀態變換到展開狀態時，將防火布展開並覆蓋在車輛上。因此，該滅火系統不需要人員靠近車輛，即可完成防火布覆蓋於車輛的作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支架單元</p>  
        <p type="p">11:第一區域</p>  
        <p type="p">12:第二區域</p>  
        <p type="p">13:架體</p>  
        <p type="p">131:導引部</p>  
        <p type="p">132:擋部</p>  
        <p type="p">2:固定件單元</p>  
        <p type="p">21:固定塊</p>  
        <p type="p">3:防火單元</p>  
        <p type="p">31:捲軸</p>  
        <p type="p">32:防火布</p>  
        <p type="p">321:第一端部</p>  
        <p type="p">322:第二端部</p>  
        <p type="p">4:阻擋單元</p>  
        <p type="p">41:樞接部</p>  
        <p type="p">5:感測單元</p>  
        <p type="p">6:控制單元</p>  
        <p type="p">91:車輛</p>  
        <p type="p">92:側牆</p>  
        <p type="p">921:壁面</p>  
        <p type="p">93:天花板</p>  
        <p type="p">931:壁面</p>  
        <p type="p">L:長向方向</p>  
        <p type="p">H1:高度</p>  
        <p type="p">H2:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="176" publication-number="202620454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水平調節機構</chinese-title>  
        <english-title>LEVELING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G01S7/481</main-classification>  
        <further-classification edition="202001120241204B">G01S7/491</further-classification>  
        <further-classification edition="200601120241204B">G01S7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗鍵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水平調節機構包含支架、平台、活動連接件以及至少一配重塊。平台配置以承托光學測量儀。活動連接件連接於平台與支架之間，並配置以容許平台相對支架繞第一軸線以及第二軸線轉動。配重塊連接平台，活動連接件至少部分沿第三軸線位於平台與配重塊之間。第一軸線、第二軸線與第三軸線彼此垂直。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A leveling mechanism includes a frame, a platform, an articulating connector and at least one counterweight. The platform is configured to support an optical measurement equipment. The articulating connector is connected between the platform and the frame, and is configured to allow the platform to rotate relative to the frame about a first axis and a second axis. The counterweight is connected with the platform. The articulating connector is least partially located between the platform and the frame along a third axis. The first axis, the second axis and the third axis are perpendicular to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:水平調節機構</p>  
        <p type="p">110:支架</p>  
        <p type="p">111:主架</p>  
        <p type="p">112:懸臂</p>  
        <p type="p">112a:第一端</p>  
        <p type="p">112b:第二端</p>  
        <p type="p">120:平台</p>  
        <p type="p">121:板體</p>  
        <p type="p">122:連接部</p>  
        <p type="p">123:連接杆</p>  
        <p type="p">130:活動連接件</p>  
        <p type="p">140:配重塊</p>  
        <p type="p">200:光學測量儀</p>  
        <p type="p">X1:第一軸線</p>  
        <p type="p">X2:第二軸線</p>  
        <p type="p">X3:第三軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="177" publication-number="202620384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射性能監控系統及其操作方法</chinese-title>  
        <english-title>MONITORING SYSTEM OF LASER PERFORMANCE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G01J1/24</main-classification>  
        <further-classification edition="200601120241231B">H01S3/1055</further-classification>  
        <further-classification edition="200601120241231B">H01S5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇丰彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, FENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳伯群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射性能監控系統及其操作方法，雷射性能監控系統包括一處理器、一功率調整單元及一功率監控單元。利用功率監控單元對雷射的功率進行量測，並控制半波片的轉動角度，能夠調整雷射之電磁波偏振特性來補償雷射之平均功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A monitoring system of laser performance and an operation method thereof are provided. The monitoring system comprises a processor, a power adjustment unit, and a power monitoring unit. The power monitoring unit is used to measure the power of the laser and control the rotation angle of the half waveplate to adjust the electromagnetic wave polarization characteristics of the laser to compensate for the average power of the laser.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:處理器</p>  
        <p type="p">3:功率調整單元</p>  
        <p type="p">31:半波片</p>  
        <p type="p">32:偏振分光鏡</p>  
        <p type="p">4:功率監控單元</p>  
        <p type="p">41:第一反射鏡</p>  
        <p type="p">42:功率計</p>  
        <p type="p">43:工作平台</p>  
        <p type="p">5:寬度量測器</p>  
        <p type="p">6:寬度調整單元</p>  
        <p type="p">61:光柵</p>  
        <p type="p">62:稜鏡</p>  
        <p type="p">63:第二反射鏡</p>  
        <p type="p">7:震盪器</p>  
        <p type="p">L1、L2、L3、L4、L5、L6:光路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="178" publication-number="202619943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物流箱之箱蓋固定裝置</chinese-title>  
        <english-title>DEVICE FOR SECURING LIDS OF A LOGISTICS BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">B65D25/02</main-classification>  
        <further-classification edition="200601120241130B">B65D25/10</further-classification>  
        <further-classification edition="200601120241130B">B65D25/20</further-classification>  
        <further-classification edition="200601120241130B">B65D55/02</further-classification>  
        <further-classification edition="200601120241130B">B65D50/00</further-classification>  
        <further-classification edition="200601120241130B">B65D81/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大智通文化行銷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISDOM DISTRIBUTION SERVICE CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林暐盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI- SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡博程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, BO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物流箱之箱蓋固定裝置，係用於設置在一物流箱的箱蓋開啟側，包含一支架、一擋部、一套桿與一套筒。該擋部係設置在該支架上，並對應在該箱蓋的開啟側。該套桿係橫向地設置在該擋部或該支架上，且該套桿高於該擋部。該套筒係活動式地套設在該套桿上，使得該套筒可至少於該套桿上縱向地移動。當該箱蓋朝向開啟側打開後，可越過該套筒，並最終由該擋部止擋於該箱蓋的外側，該套筒則會抵在該箱蓋的內側，藉由將該箱蓋傾斜地夾在該套筒與該擋部之間，達到將該箱蓋固定，以保持該箱蓋以一定角度開啟，方便該物流箱內貨物的裝卸操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a device for securing lids of a logistics box. The device is installed on the opening side of the lid of a logistics box, and includes a bracket, a stopper, a holder, and a roller. The stopper is disposed on the bracket and corresponds to the opening side of the box cover. The holder is disposed transversely on the stopper or the bracket and is at a position higher than the stopper. The roller is movably mounted on the holder, allowing the roller to move longitudinally along the holder. When the box cover is opened toward the opening side, it can pass over the roller and is finally stopped by the stopper on the outside of the box cover, and the roller locates inside of the box cover. By sandwiching the box cover obliquely between the roller and the stopper, the box cover is secured to keep the box cover open at a certain angle, thereby facilitating the loading and unloading of goods in the logistics box.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定裝置</p>  
        <p type="p">30:支架</p>  
        <p type="p">40:擋部</p>  
        <p type="p">50:套桿</p>  
        <p type="p">51:端部</p>  
        <p type="p">52:結合件</p>  
        <p type="p">521:調整孔</p>  
        <p type="p">53:勾起部</p>  
        <p type="p">60:套筒</p>  
        <p type="p">61:穿孔</p>  
        <p type="p">62:圓弧面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="179" publication-number="202620953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將廢鋰離子電池電極粉中的金屬粉與石墨粉分離之方法</chinese-title>  
        <english-title>A METHOD OF SEPARATION OF METAL POWDER AND GRAPHITE POWDER IN SPENT LITHIUM ION BATTERY ELECTRODE POWDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241122B">H01M10/54</main-classification>  
        <further-classification edition="202201120241122B">B09B3/00</further-classification>  
        <further-classification edition="201701120241122B">C01B32/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾步青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, BU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN JHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種將廢鋰離子電池電極粉中的金屬粉與石墨粉分離之方法，透過對電極粉進行水熱處理使電極粉中的有機黏合劑分解，隨後進行固液分離以得到已去除有機黏合劑之電極粉，並於水中分散形成漿體，隨後添加有機溶劑充分混合後靜置，以形成水相及有機溶劑相，使石墨粉移至有機溶劑相，金屬粉停留於水相。因此，可對金屬粉與石墨粉進行直接分離，富集濃縮有價金屬，作為後續冶金純化製程的有利前處理方法，可以有效降低後續製程之處理量及處理成本以及對環境的衝擊，並且可促進金屬資源與石墨的回收再利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for separation of metal powder and graphite powder in spent lithium ion battery electrode powder, in which the electrode powder is subjected to hydrothermal treatment to allow the decomposition of the organic adhesive, followed by solid-liquid separation to obtain electrode powder in which the organic adhesive is removed, which is then dispersed in water to form a slurry; subsequently, an organic solvent is added therein, after sufficient mixing followed by rest, an aqueous phase and an organic solvent phase are formed, in which the graphite powder is transferred to the organic solvent phase and the metal powder remains in the aqueous phase. This enables the direct separation of metal powder and graphite powder, and the enrichment of valuable metals. As an advantageous pretreatment method, this approach effectively reduces the processing amount, cost, and environmental impact of the subsequent metallurgical purification processes. Additionally, this facilitates the recycling of metal resources and graphite.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:水熱處理步驟</p>  
        <p type="p">S2:分散步驟</p>  
        <p type="p">S3:相分離步驟</p>  
        <p type="p">S4:液-液分離步驟</p>  
        <p type="p">S5:固-液分離步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="180" publication-number="202621081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>惡意連線偵測方法與惡意連線偵測裝置</chinese-title>  
        <english-title>MALICIOUS CONNECTION DETECTION METHOD AND MALICIOUS CONNECTION DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250205B">H04L9/40</main-classification>  
        <further-classification edition="200601120250205B">H04L12/22</further-classification>  
        <further-classification edition="201301120250205B">G06F21/55</further-classification>  
        <further-classification edition="202101120250205B">H04W12/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安碁資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER CYBER SECURITY INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瓊瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李輝堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUEI-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫孟瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種惡意連線偵測方法與惡意連線偵測裝置。所述方法包括：透過隨機數產生器產生多個參考值，其中參考值用以控制多個第一連線中的任兩個連線之間的時間間隔；根據參考值產生對應於第一連線的第一連線資料；根據第一連線資料產生訓練資料；根據訓練資料建立訓練資料集並使用訓練資料集訓練資料重建模型；經由通訊介面接收對應於多個第二連線的第二連線資料；根據第二連線資料產生檢測資料；將檢測資料輸入至資料重建模型並根據資料重建模型的輸出獲得對應於檢測資料的重建損失；以及根據重建損失判斷所述第二連線中是否存在惡意連線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A malicious connection detection method and a malicious connection detection device are disclosed. The method includes: generating a plurality of reference values ​​through a random number generator, wherein the reference values are used to control a time interval between any two connections among a plurality of first connections; generating first connection data corresponding to the first connections according to the reference values; generate training data according to the first connection data; establishing a training data set according to the training data and using the training data set to train a data reconstruction model; receiving second connection data corresponding to a plurality of second connections through a communication interface; generating test data according to the second connection data; inputting the test data into the data reconstruction model and obtaining a reconstruction loss corresponding to the test data according to an output of the data reconstruction model; and determining whether the second connections including a malicious connection according to the reconstruction loss.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S901~S904:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="181" publication-number="202620798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多通道虛擬多光譜成像的作物灌溉決策系統</chinese-title>  
        <english-title>CROP IRRIGATION DECISION SYSTEM WITH MULTI-CHANNEL VIRTUAL MULTI-SPECTRAL IMAGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250113B">G06V20/10</main-classification>  
        <further-classification edition="202201120250113B">G06V20/60</further-classification>  
        <further-classification edition="200601120250113B">A01G25/16</further-classification>  
        <further-classification edition="200601120250113B">G06T1/00</further-classification>  
        <further-classification edition="201701120250113B">G06T7/90</further-classification>  
        <further-classification edition="200601120250113B">G06F17/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱彥煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊𦵴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁育臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多通道虛擬多光譜成像的作物灌溉決策系統，包括：一影像拍攝裝置，配置用以拍攝一作物的影像；一影像資料庫模組，配置用以儲存該作物的影像；一影像處理模組，配置用以透過一植生指數ExGRadj或ExRGB生成一去背後作物的影像；一多通道虛擬多光譜模組，配置用以獲得在多個不同波長下的該去背後作物的影像，並透過一擬合函數將該去背後作物的影像轉換為多個多光譜影像；一特徵分析模組，配置用以對該多個多光譜影像進行分析，以得到多個影像特徵資料；以及一用水需求模組，配置用以利用該多個影像特徵資料決定該作物的用水需求狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a crop irrigation decision system with multi-channel virtual multi-spectral imaging, including: an image capturing device configured to capture an image of a crop; an image database module configured to store the image of the crop; an image processing module configured to generate a background-removed image of the crop through a vegetation index ExGRadj or ExRGB; a multi-channel virtual multispectral module configured to obtain the removed-background images of the crop at multiple different wavelengths, and convert the background-removed images of the crop to multispectral images through a fitting function; a feature analysis module configured to analyze the multispectral images to obtain multiple image feature data ; and a water demand module configured to determine the water demand status of the crop using the multiple image feature data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多通道虛擬多光譜成像的作物灌溉決策系統</p>  
        <p type="p">100:影像拍攝裝置</p>  
        <p type="p">110:影像資料庫模組</p>  
        <p type="p">120:影像處理模組</p>  
        <p type="p">130:多通道虛擬多光譜模組</p>  
        <p type="p">140:特徵分析模組</p>  
        <p type="p">150:用水需求模組</p>  
        <p type="p">160:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="182" publication-number="202620794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批量辨識物件和估值的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">G06V10/82</main-classification>  
        <further-classification edition="202301120250203B">G06N3/045</further-classification>  
        <further-classification edition="202301120250203B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元鑫國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李枏彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林庭寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉昱伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一批量辨識物件和估值的方法係由一處理器執行以下步驟：自一影像感測單元接收一批物件的影像訊號；使用一人工智慧模型分析該影像訊號而得到該批物件中複數物件類型各所對應的一使用量；自一通訊單元接收該些物件類型的市價，且根據該些使用量和該些市價計算一整體估值；其中，該人工智慧模型以一自定義模型串接取代一預訓練模型的頂層；當分析該影像訊號時，該人工智慧模型依序使用該預訓練模型的至少一卷積層以及該自定義模型的一全域平均池化層和一自定義層而得到該批物件的該用量資訊，藉此省去人工估算該整體估值的時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="183" publication-number="202620499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142396</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏡頭總成</chinese-title>  
        <english-title>LENS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250115B">G02B13/00</main-classification>  
        <further-classification edition="200601120250115B">G02B11/30</further-classification>  
        <further-classification edition="200601120250115B">G02B27/18</further-classification>  
        <further-classification edition="200601120250115B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTPELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉肇懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供本揭露係提供一種鏡頭總成，適用於微型投影系統，且由物側至成像側依序包含：一光圈；一第一透鏡，具有正屈光度；一第二透鏡，具有負屈光度；一第三透鏡，具有正屈光度；一第四透鏡，具有正屈光度；一第五透鏡，具有負屈光度；以及一顯示面板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens assembly which is suitable for a micro-projection system is disclosed, including in order from the object side to the imaging side: an aperture; a first lens with positive refractive power; and a second lens with negative refractive power; a third lens with positive refractive power; a fourth lens with positive refractive power; a fifth lens with negative refractive power; and a display panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鏡頭總成</p>  
        <p type="p">10:光圈</p>  
        <p type="p">20:顯示面板</p>  
        <p type="p">30:第一透鏡</p>  
        <p type="p">40:第二透鏡</p>  
        <p type="p">50:第三透鏡</p>  
        <p type="p">60:第四透鏡</p>  
        <p type="p">70:第五透鏡</p>  
        <p type="p">80:光軸</p>  
        <p type="p">90:光線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="184" publication-number="202620577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142398</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過轉速判斷動作狀態之電動工具</chinese-title>  
        <english-title>POWER TOOL THAT DETERMINE THE STATE OF ACTION BY ROTATIONAL SPEED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G05D13/62</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝程工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWAY INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透過轉速判斷動作狀態之電動工具，包含；一本體；一電動機，可經相位變化驅動而進行轉動；一驅動桿，受該電動機驅動而進行一使工件變形之作動；一處理單元，與該電動機電性相連，該處理單元經操作提供驅動該電動機之相位；一計時器，可計算預定數目相位驅動該電動機的經過時間，一記憶體，可記錄該等相位的經過時間變化；當該處理單元偵測到該等相位的時間有一增加變化，也就是電動機轉速變慢時，會產生一動作變化訊號，並將該動作變化訊號傳送至該處理單元。透過該動作變化訊號可以負載是否有結合，並可產生計數或後續操作之處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a power tool that determine the state of action by rotational speed, comprising; a body; a motor, which can be driven to rotate by phases change; a drive lever, which is driven by the motor to provide a workpiece deformation action; a processing unit, which is electrically connected to the motor, and which operates to provide phases to drive the motor; a timer, which can calculate the time that a predetermined number of phases have passed for the motor; a memory, which can record the change in the time that the phases have passed; when the processing unit detects an increase in the time that the phases have passed, that is, when the motor rotates slower, it can record the change in the time that the phases have passed, it will generate an action change signal, and send the action change signal to the processing unit. This signal can be used to load whether there is a combination or not, and to generate counting or processing of subsequent operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:本體</p>  
        <p type="p">21:電動機</p>  
        <p type="p">24:動力源</p>  
        <p type="p">30:處理單元</p>  
        <p type="p">31:計時器</p>  
        <p type="p">32:記憶體</p>  
        <p type="p">33:相位判斷器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="185" publication-number="202620576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體流量即時調控系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G05D7/06</main-classification>  
        <further-classification edition="200601120241204B">F16K17/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人精密機械研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECISION MACHINERY RESEARCH &amp; DEVELOPMENT CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾顯聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉科甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃崧原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王盈斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流體流量即時調控系統，包含有一閥島，具有一去流孔接收一流體源輸出的流體，一回流孔將流體送回流體源；多個去管路，分別將去流孔中的流體送到一待溫控設備；多個回管路，分別將各去管路送至待溫控設備的流體送回閥島之回流孔；多個感測器，分別接設各回管路，各感測器係可感測其對應的各回管路中之流體得到感測資訊，感測資訊包括流體的溫度及流量；多個流量控制閥，分別接設各回管路；一控制模組，有線或無線連接各流量控制閥及各感測器，即時控制各流量控制閥調整流量。藉此，其可即時控制調整流體流量，更快更準確達到均溫的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:閥島</p>  
        <p type="p">10A:第一閥島</p>  
        <p type="p">10B:第二閥島</p>  
        <p type="p">11:去流孔</p>  
        <p type="p">12:回流孔</p>  
        <p type="p">30:去管路</p>  
        <p type="p">40:電磁閥</p>  
        <p type="p">50:回管路</p>  
        <p type="p">60:感測器</p>  
        <p type="p">70:流量控制閥</p>  
        <p type="p">80:控制模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="186" publication-number="202621189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微波驅動控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H05B6/64</main-classification>  
        <further-classification edition="200601120250512B">H02M7/10</further-classification>  
        <further-classification edition="200601120250512B">H05B41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人精密機械研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECISION MACHINERY RESEARCH &amp; DEVELOPMENT CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王盈斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉科甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勇勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微波驅動控制裝置，包含有一電源轉換器；一第一全橋逆變電路，導接該電源轉換器；一第一變壓電路，導接該第一全橋逆變電路；一倍壓電路，導接該第一變壓電路；一磁控管，導接該倍壓電路，該磁控管具有一燈絲；一燈絲預熱電路，導接該電源轉換器，導接該磁控管之燈絲，於送出高壓至該磁控管之前，使用該燈絲預熱電路先將燈絲進行預熱，並加熱至熱電子發射溫度後才觸發。藉由燈絲預熱電路，可將燈絲進行預熱，再送高壓進行驅動，此可以延長燈絲之壽命。另外，藉由偵測燈絲之電阻值，並藉由燈絲之電阻值與壽命之曲線，預知燈絲之壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電源轉換器</p>  
        <p type="p">20A:第一全橋逆變電路</p>  
        <p type="p">20B:第二全橋逆變電路</p>  
        <p type="p">30A:第一變壓電路</p>  
        <p type="p">30B:第二變壓電路</p>  
        <p type="p">40:倍壓電路</p>  
        <p type="p">50:磁控管</p>  
        <p type="p">60:燈絲預熱電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="187" publication-number="202621123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝像模組</chinese-title>  
        <english-title>CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">H04N23/50</main-classification>  
        <further-classification edition="200601120250203B">G02B27/64</further-classification>  
        <further-classification edition="202301120250203B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立景創新科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXVISIONS INNOVATION TECHNOLOGY CORP. LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡尚瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, KAI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種攝像模組，包含：可撓性組件、感光模組、以及多個致動組件。可撓性組件包括內框、外框及多組肋條組件，並且每一肋條組件耦接於內框及外框之間。感光模組對應內框的中間開口設置於內框上。多個致動組件位於感光模組的周邊並電性連接可撓性組件，用以推動感光模組。每一致動組件包括載板、第一電性接墊及線圈。其中，載板設置於內框上。第一電性接墊位於載板上，並電性連接內框。線圈位於載板上，並電性連接第一電性接墊中之一。可撓性組件設置以提供感光模組的運動自由度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera module comprises a flexible component, a photosensitive module, and multiple actuating components. The flexible component includes an inner frame, an outer frame, and multiple rib assemblies, with each rib assembly coupled between the inner and outer frames. The photosensitive module is arranged on the inner frame corresponding to a central opening of the inner frame. The multiple actuating components are located around the photosensitive module and are electrically connected to the flexible component to drive the photosensitive module. Each actuating component includes a carrier plate, a first electrical contact pad, and coils. The carrier plate is on the inner frame. The first electrical contact pad is on the carrier plate and is electrically connected to the inner frame. The coil is on the carrier plate and is electrically connected to one of the first electrical contact pads. The flexible component is configured to provide freedom degrees of movement for the photosensitive module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:攝像模組</p>  
        <p type="p">10:可撓性組件</p>  
        <p type="p">11:內框</p>  
        <p type="p">12:外框</p>  
        <p type="p">13:肋條組件</p>  
        <p type="p">20:感光模組</p>  
        <p type="p">21:加強件</p>  
        <p type="p">22:感光元件</p>  
        <p type="p">23:感光區</p>  
        <p type="p">30:致動組件</p>  
        <p type="p">31:載板</p>  
        <p type="p">32:第一電性接墊</p>  
        <p type="p">33:線圈</p>  
        <p type="p">34:第二電性接墊</p>  
        <p type="p">35:導孔</p>  
        <p type="p">36:導線</p>  
        <p type="p">38:第三電性接墊</p>  
        <p type="p">39:第四電性接墊</p>  
        <p type="p">OP:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="188" publication-number="202620607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控板裝置</chinese-title>  
        <english-title>TOUCHPAD DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">G06F3/041</main-classification>  
        <further-classification edition="200601120250204B">G06F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柏欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳旻遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖韋齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控板裝置包括基板、觸控面板、支撐件及觸發板。觸控面板位於基板上方且具有內表面，內表面具有組接部、樞接側及擺動側，組接部位於樞接側與擺動側之間，使觸控面板形成一擺動側操作區塊，擺動側操作區塊介於組接部與擺動側之間，擺動側設有開關。支撐件設置於觸控面板之內表面的組接部，支撐件具有朝向內表面之支撐面。觸發板具有上表面、固定側及可活動側，固定側固定於支撐面，上表面與擺動側操作區塊之間保持間距而具有間隔空間，使觸發板能以固定側為支點擺動，開關接觸於上表面且鄰近可活動側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touchpad device includes a substrate, a touch panel, a support member and a trigger plate. The touch panel is located above the substrate and has an inner surface. The inner surface has an assembly portion, a pivot side, and a swing side. The assembly portion is located between the pivot side and the swing side, so that the touch panel forms a swing side operation block. The swing side operation block between the assembly portion and the swing side, the swing side is provided with a switch. The support member is disposed on the assembly portion of the inner surface of the touch panel, and the support member has a support surface facing the inner surface. The trigger plate has an upper surface, a fixed side and a movable side. The fixed side is fixed on the support surface. There is a spacing between the upper surface and the swing side operation block, so that the trigger plate can swing with the fixed side as a fulcrum, and the switch is in contact with the upper surface and adjacent to the movable side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:觸控板裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:間隔件</p>  
        <p type="p">15:頂面</p>  
        <p type="p">20:觸控面板</p>  
        <p type="p">21:內表面</p>  
        <p type="p">22:樞接側</p>  
        <p type="p">23:擺動側</p>  
        <p type="p">231:邊角</p>  
        <p type="p">24:組接部</p>  
        <p type="p">25:擺動側操作區塊</p>  
        <p type="p">26:第一側邊</p>  
        <p type="p">27:第二側邊</p>  
        <p type="p">29:開關</p>  
        <p type="p">291:彈性件</p>  
        <p type="p">30:支撐件</p>  
        <p type="p">31:固定板</p>  
        <p type="p">313:上支撐凸塊</p>  
        <p type="p">32:支撐板</p>  
        <p type="p">321:支撐面</p>  
        <p type="p">322:下支撐凸塊</p>  
        <p type="p">323:第一止擋部</p>  
        <p type="p">33:第一彈性臂</p>  
        <p type="p">34:第二彈性臂</p>  
        <p type="p">35:補強件</p>  
        <p type="p">351:側板</p>  
        <p type="p">352:凹槽</p>  
        <p type="p">353:長條板</p>  
        <p type="p">40:觸發板</p>  
        <p type="p">401:第二止擋部</p>  
        <p type="p">41:固定側</p>  
        <p type="p">411:側邊緣</p>  
        <p type="p">42:可活動側</p>  
        <p type="p">421:凸耳</p>  
        <p type="p">43:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="189" publication-number="202619687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手術縫線感測裝置</chinese-title>  
        <english-title>DEVICE FOR SENSING SURGICAL SUTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B17/04</main-classification>  
        <further-classification edition="201601120241125B">A61B34/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅凱斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, KAI-SZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銘輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種手術縫線感測裝置，其用以植接於一生物組織(如骨骼等)，以感測一縫線施加於該生物組織的張力，該手術縫線感測裝置包含一載體、一無線感測器及一定位柱，該無線感測器設置於該載體的一本體部，該定位柱以一第二接合部活動地樞接於該載體的一第一接合部，使該無線感測器隨著該載體相對該定位柱轉動及/或擺動，以利該無線感測器感測該縫線的張力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for sensing surgical suture is implanted on a biological tissue (e.g. bone) to sense suture tension applied on the biological tissue. The device includes a carrier, a wireless sensor and a positioning pin. The wireless sensor is mounted on a body of the carrier and provided to sense suture tension. A second connection portion of the positioning pin is movably pivoted to a first connecting portion of the carrier such that the wireless sensor can be rotated or swung relative to the positioning pin with the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感測裝置</p>  
        <p type="p">110:載體</p>  
        <p type="p">111:本體部</p>  
        <p type="p">111a:第一表面</p>  
        <p type="p">111b:第二表面</p>  
        <p type="p">111c:邊緣</p>  
        <p type="p">111d:限位孔</p>  
        <p type="p">112:第一接合部</p>  
        <p type="p">120:無線感測器</p>  
        <p type="p">130:定位柱</p>  
        <p type="p">131:柱體部</p>  
        <p type="p">131a:表面</p>  
        <p type="p">131b:限位凹槽</p>  
        <p type="p">132:第二接合部</p>  
        <p type="p">L:縫線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="190" publication-number="202621209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板的乾膜壓合方法</chinese-title>  
        <english-title>DRY FILM PRESS-FIT METHOD FOR CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05K3/28</main-classification>  
        <further-classification edition="200601120241204B">B32B37/10</further-classification>  
        <further-classification edition="200601120241204B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPOD TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, FENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張平平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PING-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉華平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HUA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電路板的乾膜壓合方法，其包含一前置步驟、一前處理步驟、一壓模步驟、一曝光步驟、及一開窗步驟。前置步驟提供一防焊乾膜及一基板；前處理步驟將基板的其中一表面進行清潔；壓模步驟，通過一壓模機將防焊乾膜的一貼合面壓合於基板的表層；曝光步驟，以一光線對貼合於基板的防焊乾膜進行光固化以形成一防焊層；及開窗步驟，將基板上的防焊層通過一顯影劑進行開窗。其中，於曝光步驟後，防焊層定義有一最大厚度及一最小厚度，最大厚度與最小厚度間的一厚度差小於8微米，並且防焊層的一表面粗糙度(Ra)小於0.2微米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a dry film press-fit method for circuit board, which includes a pre-step, a pre-processing step, a press-fit step, an exposure step, and a windowing step. The pre-step provides a solder resist dry film and a substrate; the pre-processing step cleans a surface of the substrate. The press-fit step uses a compression molding machine to press a bonding surface of the solder resist dry film onto the surface of the substrate. The exposure step, using a light to photo-cure the solder resist dry film attached to the substrate to form a solder resist layer. The windowing step, using a developer to open a hole on the solder resist layer on the substrate. After the exposure step, the solder resist layer is defined to have a maximum thickness and a minimum thickness, a thickness difference between the maximum thickness and the minimum thickness is less than 8 microns, and a surface roughness (Ra) of the solder resist layer is less than 0.2 microns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:前置步驟</p>  
        <p type="p">S102:前處理步驟</p>  
        <p type="p">S103:壓模步驟</p>  
        <p type="p">S104:曝光步驟</p>  
        <p type="p">S105:開窗步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="191" publication-number="202621210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142419</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷達板的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING RADAR BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05K3/28</main-classification>  
        <further-classification edition="200601120241204B">B32B37/10</further-classification>  
        <further-classification edition="200601120241204B">B32B37/06</further-classification>  
        <further-classification edition="200601120241204B">H05K3/06</further-classification>  
        <further-classification edition="200601120241204B">C25D7/06</further-classification>  
        <further-classification edition="200601120241204B">H05K3/18</further-classification>  
        <further-classification edition="200601120241204B">H05K3/46</further-classification>  
        <further-classification edition="200601120241204B">C23F1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPOD TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永論</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金銘傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, MING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>屈縣軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HSIEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種雷達板的製造方法，其包含：電鍍金屬銅於基板上以形成電鍍層，電鍍層相對於基板的表面具有第一厚度，並且電鍍層具有第一區域、第二區域、及第三區域；將第一乾膜鋪設於第一區域及第三區域，以使第二區域暴露自所述第一乾膜；減少第二區域的金屬銅，第一區域及第三區域具有第一厚度，並且第二區域具有第二厚度；去除第一乾膜，將第二乾膜鋪設於第一區域、第二區域、及第三區域，並且曝光位於第一區域及第二區域的第二乾膜，以形成天線圖形；依據天線圖形蝕刻第一區域及第二區域，以形成電鍍天線層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for manufacturing radar board. The method for manufacturing radar board includes: electroplating a cooper on a substrate to form an electroplating layer, the electroplating layer has a first thickness relative to a surface of the substrate, and the electroplating layer has a first section, a second section, and a third section; laying a first dry film on the first section and the third section, thereby exposing the second section from the first dry film; reducing the cooper disposed on the second section, so that the first section and the third section have the first thickness, and the second section has a second thickness; removing the first dry film, and laying a second dry film on the first section, the second section, and the third section; exposing the second dry film to form an antenna pattern, and etching the first section and the second section according to the antenna pattern to form an electroplated antenna layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:電鍍步驟</p>  
        <p type="p">S110:第一乾膜鋪設步驟</p>  
        <p type="p">S120:減銅步驟</p>  
        <p type="p">S130:第二乾膜鋪設步驟</p>  
        <p type="p">S140:蝕刻步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="192" publication-number="202620639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軟體重啟方法</chinese-title>  
        <english-title>METHOD FOR RESTARTING SOFTWARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250205B">G06F11/30</main-classification>  
        <further-classification edition="201801120250205B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭思華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SZU-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軟體重啟方法，包括：監控軟體程式在執行階段中是否發生崩潰；當軟體程式於執行階段發生崩潰時，判斷本次崩潰與前次崩潰兩者之間的崩潰時間差，是否超出設定的耐受度範圍；在崩潰時間差超出耐受度範圍的情形下，如果崩潰時間差大於耐受度範圍的上限時，將回復等級的值設為初始值；如果崩潰時間差小於耐受度範圍的下限，將回復等級的值增加既定值。當判斷回復等級不是最高等級(即前述回復等級的值未達到預設值)時，則在將重啟指標致能之後，重新啟動軟體程式；在重新啟動軟體程式後，依據回復等級而進行回復處置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for restarting software includes monitoring whether the software program crashes during its operation; determining if a difference between a current crash time and a previous crash time exceeds a tolerance range when the program crash is detected; setting a recovery level to an initial value when the difference is greater than an upper-limit of the tolerance range or increasing the value of the recovery level when the difference is less than an lower-limit of the tolerance range; enabling a restart flag and then restarting the software program when determining that the recovery level is not a top level; and performing a recover operation according to the recovery level after restarting the software program.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="193" publication-number="202620998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭戴式顯示裝置</chinese-title>  
        <english-title>HEAD-MOUNTED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H02J7/34</main-classification>  
        <further-classification edition="200601120250108B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉元鎧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YUAN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫芃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種頭戴式顯示裝置。頭戴式顯示裝置包括頭戴式顯示器、控制裝置以及擴充電池。控制裝置包括裝置電池以及控制器。控制器控制頭戴式顯示器的運行。擴充電池與控制裝置進行可拆卸式地組裝。在擴充電池與控制裝置完成組裝後，擴充電池對控制裝置進行供電並對裝置電池進行充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head-mounted display device is provided. The head-mounted display device includes a head-mounted display, a control device and an expansion battery. The control device includes a device battery and a controller. The controller controls operation of the head mounted display. The expansion battery is detachably assembled to the control device. After the expansion battery and the control device are assembled, the expansion battery supplies a power to the controller and charges the device battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:頭戴式顯示裝置</p>  
        <p type="p">110:頭戴式顯示器</p>  
        <p type="p">120:控制裝置</p>  
        <p type="p">121:裝置電池</p>  
        <p type="p">122:控制器</p>  
        <p type="p">130:擴充電池</p>  
        <p type="p">P1、P2:電能</p>  
        <p type="p">SD:顯示信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="194" publication-number="202620787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單張影像生成三維模型的方法</chinese-title>  
        <english-title>METHOD OF GENERATING THREE-DIMENSIONAL MODEL FROM SINGLE IMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06T17/00</main-classification>  
        <further-classification edition="201701120250303B">G06T7/11</further-classification>  
        <further-classification edition="202301120250303B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大岳室內裝修工程有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>K.E.A. DESIGN CONSULTANTS,INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李哲榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHE-RUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>房元凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, IUAN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種單張影像生成三維模型的方法，其包含以下步驟：輸入包含組裝產品的複數個二維影像，對產品部件進行人工標記作業，建立部件資料集；訓練部件資料集內的圖資資料，建立語意分割網路模型，語意分割網路模型將圖資資料的圖資特徵轉換成部件影像；輸入待轉換影像，辨識待轉換影像的產品類別，選擇對應的部件資料集；通過語意分割網路模型進行部件分割，將待轉換影像分離為複數個部件；以及通過描述檔中的幾何資訊及物件描述來組合複數個部件，形成三維產品模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of generating three-dimensional model from single image is disclosed. The method includes the following steps: inputting a plurality of two-dimensional images containing an assembled product, conducting manual annotation process to product components for establishing a component data set; training the images in the component data set and establishing a semantic segmentation network model. The semantic segmentation network model converts the graphic characteristics of the graphic data into component images; inputting the image to be converted, identifying the product category of the image to be converted, and selecting the corresponding component data set; conducting component segmentation by the semantic segmentation network model and separating the image to be converted into multiple components; and combining the multiple components by the geometry information and object description in the description file to form a three-dimensional product model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="195" publication-number="202620439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針卡裝置與其組裝方法</chinese-title>  
        <english-title>PROBE CARD DEVICE AND ASSEMBLING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G01R1/073</main-classification>  
        <further-classification edition="200601120241202B">G01R1/067</further-classification>  
        <further-classification edition="200601120241202B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴融暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, RONG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭皓嚴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HAO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂育儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YU-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇偉誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種探針卡裝置與其組裝方法、及側向傳輸探針。所述側向傳輸探針包含一固定段、一測試段、相連於所述固定段與所述測試段之間的一彈簧段、及分別間隔地設置於所述彈簧段相反兩側的兩個側擺臂。所述彈簧段呈連續反向彎曲構造，以構成一初始信號傳輸路徑。每個所述側擺臂具有相連於所述固定段的一連接端部、及鄰近於所述測試段的一自由端部。其中，兩個所述側擺臂能以各自的所述連接端部為支點而相對於所述彈簧段擺動，以使至少一個所述自由端部抵接於所述測試段、而構成短於所述初始信號傳輸路徑的一側向信號傳輸路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a probe card device, an assembling method thereof, and a lateral transmission probe. The lateral transmission probe includes a fixing segment, a testing segment, a spring segment connected in-between the fixing segment and the testing segment, and two lateral awing arms that are arranged at and spaced apart from two opposite sides of the spring segment. The spring segment is a structure having curved parts sequentially connected in opposite directions for defining an initial signal transmission path. Each of the two lateral awing arms has a connection end portion connected to the fixing segment and a free end portion that is arranged adjacent to the testing segment. Each of the two lateral awing arms is swingable relative to the spring segment by using the connection end portion thereof to be a fulcrum, such that the free end portion of at least one of the two lateral awing arms abuts against the testing segment to form a lateral signal transmission path that is shorter than the initial signal transmission path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:探針卡裝置</p>  
        <p type="p">100:探針頭</p>  
        <p type="p">1:第一導板模組</p>  
        <p type="p">11:第一穿孔</p>  
        <p type="p">2:第二導板模組</p>  
        <p type="p">21:第二穿孔</p>  
        <p type="p">3:間隔板</p>  
        <p type="p">4:側向傳輸探針</p>  
        <p type="p">41:固定段</p>  
        <p type="p">411:橫樑</p>  
        <p type="p">412:端部</p>  
        <p type="p">42:測試段</p>  
        <p type="p">43:彈簧段</p>  
        <p type="p">44:側擺臂</p>  
        <p type="p">441:連接端部</p>  
        <p type="p">442:自由端部</p>  
        <p type="p">200:間距轉換板</p>  
        <p type="p">DUT:待測物</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">Ps:側向信號傳輸路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="196" publication-number="202620440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針卡裝置及其高速彈簧探針</chinese-title>  
        <english-title>PROBE CARD DEVICE AND HIGH-SPEED SPRING PROBE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G01R1/073</main-classification>  
        <further-classification edition="200601120241202B">G01R1/067</further-classification>  
        <further-classification edition="200601120241202B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴融暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, RONG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭皓嚴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HAO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂育儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YU-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇偉誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種探針卡裝置及其高速彈簧探針。所述高速彈簧探針具有一固定段、一測試段、及相連於所述固定段與所述測試段之間的一彈簧段。所述彈簧段具有多個彎曲部、及設置於多個所述彎曲部外緣的多個凸點。多個所述彎曲部依序反向相連，以構成一初始信號傳輸路徑。相鄰但未相接的任兩個所述彎曲部之間配置有至少一個所述凸點。當所述高速彈簧探針的所述測試段承受一外力，以使所述彈簧段被壓縮時，多個所述彎曲部與多個所述凸點能夠彼此相接而構成短於所述初始信號傳輸路徑的一第一信號傳輸路徑與一第二信號傳輸路徑的至少其中之一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a probe card device and a high-speed spring probe thereof. The high-speed spring probe has a fixing segment, a testing segment, and a spring segment that is connected in-between the fixing segment and the testing segment. The spring segment has a plurality of curved portions and a plurality of protrusions that are respectively arranged on outer edges of the curved portions. The curved portions are sequentially connected in opposite directions so as to jointly form an initial signal transmission path. Any two of the curved portions adjacent to each other and unconnected to each other are provided with at least one of the protrusions. When the testing segment of the high-speed spring probe receives an external force to compress the spring segment, the curved portions and the protrusions are connected to form at least one of a first signal transmission path and a second signal transmission path that is shorter than the initial signal transmission path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:高速彈簧探針</p>  
        <p type="p">41:固定段</p>  
        <p type="p">42:測試段</p>  
        <p type="p">43:彈簧段</p>  
        <p type="p">431:第一彎曲部</p>  
        <p type="p">432:第二彎曲部</p>  
        <p type="p">433:第一凸點</p>  
        <p type="p">434:第二凸點</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">F1:正向力</p>  
        <p type="p">P1:第一信號傳輸路徑</p>  
        <p type="p">P2:第二信號傳輸路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="197" publication-number="202620767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>材料選配系統</chinese-title>  
        <english-title>MATERIAL SELECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241220B">G06Q50/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宗性</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZONG-SING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊欣樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁伯睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, PO-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張益誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凃明蕙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, MING-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐靖雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾煒翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, WEI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種材料選配系統，用以挑選適用於一顯示裝置的至少一推薦材料組合，該材料選配系統包括一全展開模組、一篩選模組、及一套餐推薦模組。該全展開模組用以列出複數個材料組合，其中該複數個材料組合包括該至少一推薦材料組合。該篩選模組用以根據一篩選條件，從該複數種材料組合產生一篩選結果。該套餐推薦模組用以根據該篩選結果以產生該至少一推薦材料組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a material selection system for selecting at least one recommended material combination suitable for a display device. The material selection system includes a comprehensive expansion module, a filtering module, and a package recommendation module. The comprehensive expansion module is used to list a plurality of material combinations, where the plurality of material combinations include the at least one recommended material combination. The filtering module is used to generate a filtering result from the plurality of material combinations according to a filtering condition. The package recommendation module is used to generate the at least one recommended material combination based on the filtering result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:材料選配系統</p>  
        <p type="p">105:前端介面輸入模組</p>  
        <p type="p">108:規格要望模組</p>  
        <p type="p">110:材料配對器</p>  
        <p type="p">120:顯示單元</p>  
        <p type="p">195:資料庫</p>  
        <p type="p">198:雲端</p>  
        <p type="p">C:推薦材料組合</p>  
        <p type="p">D:客戶規格要望資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="198" publication-number="202620288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142437</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水力發電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">F03B11/00</main-classification>  
        <further-classification edition="200601120250113B">F03B13/10</further-classification>  
        <further-classification edition="200601120250113B">F03B17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>主典興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧順從</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種水力發電裝置，其包含一安裝架及一發電組件，安裝架包含底座、立柱及安裝座，立柱自底座直立延伸而具有高度方向，安裝座的一端結合於底座，且安裝座能結合並定位在立柱於高度方向上的不同位置；發電組件包含有流道管、螺旋式水輪機及發電機，螺旋式水輪機設於流道管內，且連接發電機，流道管固定於安裝座上，隨著安裝座定位在立柱於高度方向上的不同位置，能改變安裝座與底座之間的角度，在水位較低或較高時，皆可對應調節流道管相對於河床的仰角，調整流道管的入水口的高度，達到更好的發電效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:安裝架</p>  
        <p type="p">11:輔助支撐件</p>  
        <p type="p">20:底座</p>  
        <p type="p">30:立柱</p>  
        <p type="p">40:安裝座</p>  
        <p type="p">42:側支撐件</p>  
        <p type="p">43:橫向支撐件</p>  
        <p type="p">50:發電組件</p>  
        <p type="p">60:流道管</p>  
        <p type="p">61:入水口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="199" publication-number="202619622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浮管組合構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250227B">A01K61/54</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作係一種浮管組合構件，其包含塑料材質且分別間隔縱橫排列的縱向浮管及橫向浮管，並於縱向浮管與橫向浮管的交錯銜接處分別設有塑料材質之組接組件，組接組件包含分別設於縱向浮管與橫向浮管的第一組接件及第二組接件，以及穿設於第一組接件及第二組接件之鎖固件，本創作浮管組合構件能提供較長的使用壽命，且藉由分別設置於縱向浮管與橫向浮管的第一組接件及第二組接件相互配合，並搭配鎖固件穿設固定第一組接件與第二組接件，使縱向浮管與橫向浮管能確實固定，能大幅提高浮管組合構件的組裝效率，且透過鎖固件鎖固的方式亦能大幅提高所述浮管組合構件之整體的結構強度及穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:縱向浮管</p>  
        <p type="p">20:橫向浮管</p>  
        <p type="p">30a:組接組件</p>  
        <p type="p">31a:第一組接件</p>  
        <p type="p">312:座部</p>  
        <p type="p">313:延伸部</p>  
        <p type="p">32a:第二組接件</p>  
        <p type="p">322:座部</p>  
        <p type="p">323:延伸部</p>  
        <p type="p">33:鎖固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="200" publication-number="202620247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽基板研磨液的再生裝置及其再生方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR REGENERATING SLURRY FOR POLISHING SILICON CARBIDE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">C25B7/00</main-classification>  
        <further-classification edition="202101120250512B">C25B9/19</further-classification>  
        <further-classification edition="202101120250512B">C25B9/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣永光化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙宗怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, TSUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳威奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李晏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳樸偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭梓民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, TZU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡順宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供的碳化矽基板研磨液的再生裝置，包括：一槽體，包括一頂部、一底部及兩側壁，其中頂部與底部相對，而兩側壁相對；一陰極，設置於槽體內且鄰近於兩側壁的其中一者；一陽極，設置於槽體內且鄰近於兩側壁的另一者；以及兩個以上的隔板，設置於槽體的底部，且位於槽體內及陰極與陽極之間；其中槽體具有一進料口，進料口設置於槽體的頂部，且相對於陽極，進料口鄰近於陰極設置。本發明更提供一種使用前述再生裝置的碳化矽基板研磨液的再生方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a device for regenerating slurry for polishing silicon carbide substrate, comprising: a tank comprising a top portion, a bottom portion and two side walls, wherein the top portion is opposite to the bottom portion and the two side walls are opposite to each other; a cathode disposed in the tank and adjacent to one of the two side walls; an anode disposed in the tank and adjacent to the other one of the two side walls; two or more separator disposed on the bottom portion of the tank and locating in the tank and between the cathode and the anode, wherein the tank has an inlet disposed at the top portion of the tank, and the inlet is disposed closer to the cathode compared to the anode. The present invention further provides a method for regenerating slurry for polishing silicon carbide substrate using the aforesaid device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:再生裝置</p>  
        <p type="p">11:槽體</p>  
        <p type="p">11a:頂部</p>  
        <p type="p">11b:底部</p>  
        <p type="p">11c,11d:側壁</p>  
        <p type="p">111:進料口</p>  
        <p type="p">12:陰極</p>  
        <p type="p">13:陽極</p>  
        <p type="p">14:隔板</p>  
        <p type="p">141:第一隔板</p>  
        <p type="p">142:第二隔板</p>  
        <p type="p">H1,H2:高度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="201" publication-number="202621022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體智慧線之使用方法</chinese-title>  
        <english-title>METHOD FOR USING SEMICONDUCTOR INTELLIGENCE LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H02M3/137</main-classification>  
        <further-classification edition="200601120250418B">H02H7/00</further-classification>  
        <further-classification edition="200601120250418B">H02H3/087</further-classification>  
        <further-classification edition="200601120250418B">H02H3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧昭正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧昭正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明半導體智慧線之使用方法，係設置於第一半導體的輸出特性表的源極電流軸上，具有用閘源極電壓設定，指示輸出特性表上源極電流應用限制之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The method for using semiconductor intelligence line of the invention, which is set on the drain source current axis of the first semiconductor output characteristic, has a gate source voltage setting, which indicates the function of limiting the application limit of the source current on the output characteristic.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">VGS:閘源極電壓</p>  
        <p type="p">ID:汲極電流</p>  
        <p type="p">VDS:汲源極電壓</p>  
        <p type="p">100:半導體智慧線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="202" publication-number="202621232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜態隨機存取記憶體結構以及其製作方法</chinese-title>  
        <english-title>STATIC RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B10/00</main-classification>  
        <further-classification edition="202001120241202B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭有策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHU-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種靜態隨機存取記憶體結構，包含一矽基底，一淺溝隔離位於矽基底上，一第一鰭狀結構連接矽基底，並且突出淺溝隔離，一第一閘極結構，跨越第一鰭狀結構與部分淺溝隔離，使第一閘極結構覆蓋第一鰭狀結構的一頂面以及部分側壁，並且組成靜態隨機存取記憶體的一傳輸閘電晶體(PG)，以及一凸出部，位於第一閘極結構正下方並且位於淺溝隔離上，凸出部覆蓋第一鰭狀結構的至少一邊側壁的部分表面，凸出部的一頂面高於淺溝隔離的一頂面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a static random access memory structure, which comprises a silicon substrate, a shallow trench isolation on the silicon substrate, a first fin structure connected with the silicon substrate and protruding from the shallow trench isolation, a first gate structure spanning the first fin structure and parts of the shallow trench isolation, so that the first gate structure covers a top surface and a part of sidewalls of the first fin structure, and forms a pass gate transistor (PG). And a protruding part located directly below the first gate structure and on the shallow trench isolation, the protruding part covers part of the surface of at least one side wall of the first fin structure, and a top surface of the protruding part is higher than a top surface of the shallow trench isolation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:凸出部</p>  
        <p type="p">F:鰭狀結構</p>  
        <p type="p">G:閘極結構</p>  
        <p type="p">h1:高度</p>  
        <p type="p">h2:高度</p>  
        <p type="p">PD:下拉電晶體</p>  
        <p type="p">PG:傳輸閘電晶體</p>  
        <p type="p">PD-F:PD鰭狀結構</p>  
        <p type="p">PG-F:PG鰭狀結構</p>  
        <p type="p">S:基底(矽基底)</p>  
        <p type="p">STI:淺溝隔離</p>  
        <p type="p">T1:頂面</p>  
        <p type="p">T2:頂面</p>  
        <p type="p">T3:頂面</p>  
        <p type="p">T4:頂面</p>  
        <p type="p">w1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="203" publication-number="202620359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有隔絕縫隙結構之立體均溫板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">F28F3/02</main-classification>  
        <further-classification edition="200601120250113B">F28F9/26</further-classification>  
        <further-classification edition="200601120250113B">F28D15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴耀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴耀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇樞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有隔絕縫隙結構之立體均溫板，包含有：一底均溫板，具有一底板以及一頂板，該頂板具有一連接口；以及包含一直立均溫單元，連接於該底均溫板；其中，該頂板具有上下延伸的一直立牆，該外殼之底部具有向下延伸的一直立段，於該直立牆與該直立段之間形成一縫隙；該直立段與該直立牆之間係為至少部分緊配合關係，且藉由無焊料熔接而形成熔融後固化之複數熔融部，該複數熔融部位於該縫隙底部，前述之緊配合關係及該複數熔融部二者其中至少一者係使該頂毛細材在毛細現象上隔絕於外部而不相通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:底均溫板</p>  
        <p type="p">12:底板</p>  
        <p type="p">121:底毛細材</p>  
        <p type="p">13:容置空間</p>  
        <p type="p">14:頂板</p>  
        <p type="p">141:頂毛細材</p>  
        <p type="p">145:穿孔</p>  
        <p type="p">148:直立牆</p>  
        <p type="p">149:擴口段</p>  
        <p type="p">15:連接口</p>  
        <p type="p">21:直立均溫單元</p>  
        <p type="p">221:底部開口</p>  
        <p type="p">222:直立板</p>  
        <p type="p">228:直立段</p>  
        <p type="p">23:上毛細層</p>  
        <p type="p">24:直立空間</p>  
        <p type="p">27:承窩</p>  
        <p type="p">99:焊料</p>  
        <p type="p">S:縫隙</p>  
        <p type="p">WS:熔融部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="204" publication-number="202621541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製造方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/10</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力成科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERTECH TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張簡上煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHIEN, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅義凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝結構，包括基板、中介模組以及晶片模組。中介模組設置於基板上。中介模組包括第一絕緣層、第二絕緣層與多個虛設端子。第一絕緣層設置於第二絕緣層與基板之間。多個虛設端子直接接觸第一絕緣層與基板且於其電性絕緣。晶片模組設置於中介模組上且通過中介模組電性連接至基板。另提供一種封裝結構的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes a substrate, an interposer module, and a chip module. The interposer module is arranged on the substrate. The interposer module includes a first insulation layer, a second insulation layer, and a plurality of dummy terminals. The first insulating layer is disposed between the second insulating layer and the substrate. The dummy terminals directly contact and are electrically insulated from the first insulating layer and the substrate. The chip module is disposed on the interposer module and is electrically connected to the substrate through the interposer module. A manufacturing method of a package structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:中介模組</p>  
        <p type="p">112:橋接晶片</p>  
        <p type="p">113:封裝體</p>  
        <p type="p">114:導電連接件</p>  
        <p type="p">116:連接端子</p>  
        <p type="p">116a、130a:導電端子</p>  
        <p type="p">116b:虛設端子</p>  
        <p type="p">120:基板</p>  
        <p type="p">120t、130t:頂表面</p>  
        <p type="p">121:外接端子</p>  
        <p type="p">130:晶片模組</p>  
        <p type="p">130s:側表面</p>  
        <p type="p">131:晶片</p>  
        <p type="p">151A、152A:保護件</p>  
        <p type="p">D:堆疊方向</p>  
        <p type="p">PKG1:封裝結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="205" publication-number="202621542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製造方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/10</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力成科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERTECH TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張簡上煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHIEN, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅義凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝結構，包括基板、中介模組、晶片模組以及第一封裝體。中介模組設置於基板上。晶片模組設置於中介模組上。晶片模組通過中介模組電性連接至基板。第一封裝體包封晶片模組與中介模組且直接接觸基板。第一封裝體的底表面與基板的頂表面共面。另提供一種封裝結構的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes a substrate, an interposer module, a chip module, and an first encapsulant. The interposer module is arranged on the substrate. The chip module is arranged on the interposer module. The chip module is electrically connected to the substrate through the interposer module. The first encapsulant encapsulates the chip module and the interposer module and directly contacts the substrate. A bottom surface of the first encapsulant and a top surface of the substrate are coplanar. A manufacturing method of a package structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:中介模組</p>  
        <p type="p">110s、120s、140s:外側壁</p>  
        <p type="p">140b:底表面</p>  
        <p type="p">112:橋接晶片</p>  
        <p type="p">113、140:封裝體</p>  
        <p type="p">114:導電連接件</p>  
        <p type="p">116:連接端子</p>  
        <p type="p">116a、130a:導電端子</p>  
        <p type="p">116b:虛設端子</p>  
        <p type="p">120:基板</p>  
        <p type="p">120t、130t、140t:頂表面</p>  
        <p type="p">121:外接端子</p>  
        <p type="p">130:晶片模組</p>  
        <p type="p">131:晶片</p>  
        <p type="p">140T:厚度</p>  
        <p type="p">A:區域</p>  
        <p type="p">PKG1:封裝結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="206" publication-number="202620521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G02F1/1335</main-classification>  
        <further-classification edition="200601120250102B">G02F1/133</further-classification>  
        <further-classification edition="202501120250102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉展睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括驅動背板、第一發光元件、島狀絕緣結構及導電圖案。驅動背板具有共用電極、子畫素驅動電路、第一接墊、第二接墊及第三接墊。第一接墊及第二接墊電性連接至子畫素驅動電路。第三接墊電性連接至共用電極。第一發光元件的第一電極接合至驅動背板的第一接墊。島狀絕緣結構設置於第一發光元件上。第二接墊及第三接墊位於島狀絕緣結構外。島狀絕緣結構包括第一絕緣層及第二絕緣層。第一絕緣層覆蓋第一發光元件。第二絕緣層設置於第一絕緣層上。第二絕緣層的第一部分延伸至第一絕緣層外。導電圖案設置於島狀絕緣結構上且電性連接至第一發光元件的第二電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes a driving backplane, a first light-emitting element, an island-shaped insulation structure and a conductive pattern. The driving backplane has a common electrode, a sub-pixel driving circuit, a first pad, a second pad and a third pad. The first pad and the second pad are electrically connected to the sub-pixel driving circuit. The third pad is electrically connected to the common electrode. A first electrode of the first light-emitting element is bonded to the first pad of the driving backplane. The island-shaped insulation structure is disposed on the first light-emitting element. The second pad and the third pad are located outside the island-shaped insulation structure. The island-shaped insulation structure includes a first insulation layer and a second insulation layer. The first insulation layer covers the first light emitting element. The second insulation layer is disposed on the first insulation layer. A first portion of the second insulation layer extends outside the first insulation layer. The conductive pattern is disposed on the island-shaped insulating structure and is electrically connected to a second electrode of the first light-emitting element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:子畫素驅動結構</p>  
        <p type="p">111:第一接墊</p>  
        <p type="p">112:第二接墊</p>  
        <p type="p">113:第三接墊</p>  
        <p type="p">114:子畫素驅動電路</p>  
        <p type="p">115:共用電極</p>  
        <p type="p">200:第一發光元件</p>  
        <p type="p">210:第一型半導體層</p>  
        <p type="p">220:第二型半導體層</p>  
        <p type="p">230:第一主動層</p>  
        <p type="p">240:第一電極</p>  
        <p type="p">250:第二電極</p>  
        <p type="p">300:島狀絕緣結構</p>  
        <p type="p">310:第一絕緣層</p>  
        <p type="p">310a、320a:頂面</p>  
        <p type="p">310s:側壁</p>  
        <p type="p">320:第二絕緣層</p>  
        <p type="p">320o:開口</p>  
        <p type="p">320s、324s:側壁</p>  
        <p type="p">322:第一部分</p>  
        <p type="p">324:第二部分</p>  
        <p type="p">400:導電圖案</p>  
        <p type="p">401:第一端</p>  
        <p type="p">402:第二端</p>  
        <p type="p">500:光學結構</p>  
        <p type="p">600:第二發光元件</p>  
        <p type="p">610:第三型半導體層</p>  
        <p type="p">620:第四型半導體層</p>  
        <p type="p">630:第二主動層</p>  
        <p type="p">640:第三電極</p>  
        <p type="p">650:第四電極</p>  
        <p type="p">A:距離</p>  
        <p type="p">BP:驅動背板</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">SPX、SPX1:子畫素</p>  
        <p type="p">I-I’:剖線</p>  
        <p type="p">θ1:第一角度</p>  
        <p type="p">θ2:第二角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="207" publication-number="202620690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數據可視化對齊方法及電子裝置</chinese-title>  
        <english-title>DATA VISUALIZATION ALIGNMENT METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06N3/02</main-classification>  
        <further-classification edition="202201120250303B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種數據可視化對齊方法及電子裝置。所述方法包括下列步驟。將一目標影像輸入至完成訓練的一人工神經網路模型。根據人工神經網路模型的模型輸出，利用基於梯度的可解釋性方法產生分別對應至目標影像的多個像素的多個第一梯度值。利用一映射函數將多個第一梯度值分別映射至一預設數值範圍內而產生多個第二梯度值，並根據預設數值範圍決定一基準值。根據多個第二梯度值與基準值之間的多個差距，決定一色彩映射處理的上限值與下限值。根據上限值與下限值，對多個第二梯度值進行色彩映射處理而獲取一顯著圖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides an data visualization alignment method and an electronic device. The method includes the following steps. A target image is input into a trained artificial neural network model. According to a model output of the artificial neural network model, a gradient-based interpretability method is used to generate a plurality of first gradient values ​​respectively corresponding to pixels of the target image. A mapping function is used to map the first gradient values ​​to a preset value range to generate a plurality of second gradient values, and a reference value is determined according to the preset value range. An upper limit value and a lower limit value for a color mapping process are determined based on differences between the second gradient values ​​and the reference value. The color mapping processing is performed on the second gradient values according to the upper limit value and the lower limit value, ​​to obtain a saliency map.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410~S450:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="208" publication-number="202621127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置與其影像穩定方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND IMAGE STABILIZATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241204B">H04N23/68</main-classification>  
        <further-classification edition="202101120241204B">G03B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳若凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JO-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玟伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種電子裝置與其影像穩定方法。所述方法用於包括影像擷取模組的電子裝置，且影像擷取模組具有光學影像穩定系統。此方法包括下列步驟。偵測電子裝置的運動資訊。當影像擷取模組基於多個圖框週期產生多張連續影像時，決定影像擷取模組的多個圖框週期中的第一圖框週期的非曝光時段。在第一圖框週期的非曝光時段之中，禁能光學影像穩定系統根據運動資訊進行光學影像穩定補償操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and an image stabilization method thereof are provided. The method is adapted to the electronic device including an image capture module, and the image capture module includes an optical image stabilization system. The method includes the following steps. Motion information of the electronic device is detected. When the image capture module generates multiple consecutive images based on multiple frame periods, a non-exposure period of a first frame period among the frame periods of the image capture module is determined. During the non-exposure period of the first frame period, the optical image stabilization system is disabled to perform an optical image stabilization compensation operation based on the motion information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="209" publication-number="202620758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平均收入核算方法及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250205B">G06Q40/03</main-classification>  
        <further-classification edition="202301120250205B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>第一商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIRST COMMERCIAL BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昆霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴橋瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種平均收入核算系統，適用於與一客戶端電子裝置配合，並包含一儲存單元及一處理單元。該儲存單元儲存有多筆內部人事資料及一職等薪水對照表，每一內部人事資料包括一職等，該職等薪水對照表包括多筆分別對應於多個職等的職等薪資資訊。該處理單元電連接該客戶端電子裝置及該儲存單元。該處理單元自該客戶端電子裝置接收一客戶識別資料後，判斷該等內部人事資料中是否存在其中一筆對應於該客戶識別資料的目標內部人事資料，並在判斷為是的情況下，根據該目標內部人事資料的該職等，及對應該職等的該職等薪資資訊，計算出一平均收入結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:平均收入核算系統</p>  
        <p type="p">1:儲存單元</p>  
        <p type="p">2:處理單元</p>  
        <p type="p">10:客戶端電子裝置</p>  
        <p type="p">20:外部資料伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="210" publication-number="202619647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調整椅</chinese-title>  
        <english-title>ADJUSTING CHAIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">A47C7/46</main-classification>  
        <further-classification edition="200601120250113B">A47C7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國睦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERITS HEALTH PRODUCTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭明權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭舜遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種調整椅，包含椅座、背部支架、背靠滑動機構、背靠連桿機構以及驅動機構。背部支架包含第一軌道及第二軌道。第一軌道具有第一導引方向平行背部支架的長度方向。第二軌道與第一軌道間隔排列且具有第二導引方向，第二導引方向平行長度方向。背靠滑動機構包含滑動元件及背靠組件。滑動元件可動地設置於第一軌道。背靠組件連接滑動元件。背靠連桿機構連接背靠組件並受第二軌道導引。驅動機構帶動背部支架相對椅座旋轉，背靠連桿機構連動滑動元件於第一軌道內移動，使背靠組件相對背部支架移動。藉此可提升使用舒適性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an adjusting chair including a seat, a back frame, a backrest sliding mechanism, a backrest linkage mechanism and a driving mechanism. The back frame includes a first rail and a second rail. The first rail has a first guiding direction parallel to a length direction of the back frame. The second rail is arranged with the first rail at an interval and has a second guiding direction parallel to the length direction. The back sliding mechanism includes a sliding element and a backrest assembly. The sliding element is movably disposed at the first rail. The backrest assembly is connected to the sliding element. The backrest linkage mechanism is connected to the backrest assembly and is guided by the second track. As the driving mechanism rotates the back frame relative to the seat, the backrest linkage mechanism drives the sliding element to move in the first rail, and the backrest is moved relative to the back frame. Therefore, using comfort of the adjusting chair is increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:調整椅</p>  
        <p type="p">1100:背部支架</p>  
        <p type="p">1200:背靠滑動機構</p>  
        <p type="p">1500:椅座</p>  
        <p type="p">1600:驅動機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="211" publication-number="202619645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式滅菌層架</chinese-title>  
        <english-title>ADJUSTABLE STERILIZATION SHELF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A47B96/02</main-classification>  
        <further-classification edition="202601120260223B">A61L2/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-SIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高伶甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING-ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調式滅菌層架，用以解決習知滅菌設備的擺放空間受限且滅菌效率差的問題。係包含：一支架，具有直立的數根支柱，該數根支柱圍繞一滅菌空間；及至少一可調式層板，位於該滅菌空間，該至少一可調式層板可上下移動地結合於各該支柱，該至少一可調式層板的相對二邊各具有一導流件，各該導流件之一導流面朝向該滅菌空間，該導流面與該至少一可調式層板的表面之間夾一傾角，該傾角大於90度。藉此可以使滅菌氣體分布均勻以達成提升滅菌效率的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adjustable sterilization shelf is provided to solve the problems of limited space and poor sterilization effect conventional sterilization device. The adjustable sterilization shelf includes a bracket with a plurality of upright pillars, and at least one adjustable plate. The plurality of pillars surround a sterilization space. The at least one adjustable plate is in the sterilization space. The at least one adjustable plate is coupled to each of the pillars in a manner that can move up and down. Each of the opposite sides of the at least one adjustable plate has a flow guide component. One flow guide surface of each flow guide component faces the sterilization space. There is an inclination angle between the guide surface and the surface of the at least one adjustable plate. The inclination angle is greater than 90 degrees. The adjustable sterilization shelf evenly distributes sterilizing gas to improve sterilization efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支架</p>  
        <p type="p">11:支柱</p>  
        <p type="p">11a:定位部</p>  
        <p type="p">2:滑動件</p>  
        <p type="p">2a:承載面</p>  
        <p type="p">21:滑動部</p>  
        <p type="p">21a:導通孔</p>  
        <p type="p">22:卡掣部</p>  
        <p type="p">23:支撐架</p>  
        <p type="p">23a:固定部</p>  
        <p type="p">24:插銷件</p>  
        <p type="p">3:導流件</p>  
        <p type="p">31:凸塊</p>  
        <p type="p">32a:引流面</p>  
        <p type="p">32b:導流面</p>  
        <p type="p">4:可調式層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="212" publication-number="202619682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物資訊感測裝置</chinese-title>  
        <english-title>BIOLOGICAL INFORMATION SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B5/026</main-classification>  
        <further-classification edition="200601120241125B">G01N27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周呈遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, CHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉桂伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, KUEI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高伶甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING-ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃書鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周秉叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PING-RUEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭晏妡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生物資訊感測裝置，用以解決習知血流偵測技術耗費人力且不精確的問題。係包含：一封裝層，由一感測段環繞於一待測物件上；一偵測元件，位於該封裝層之該感測段，該偵測元件具有數個電極以平行且間隔排列，使相鄰之二電極分別偏左或偏右並有且部分段落的投影重疊，左側之一訊號線電性連接偏左的該數個電極，及右側的另一訊號線電性連接偏右的該數個電極；一訊號傳輸元件，位於該封裝層且相對該感測段的另一側，具有至少一線圈及二傳輸線電性連接該至少一線圈，該二傳輸線分別電性連接該二訊號線。藉此可以達成提升感測靈敏度的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biological information sensing device is provided to solve the labor-intensive and inaccurate problems of conventional blood flow detection technology. The device includes an encapsulation layer with a sensing section surrounding an object to be tested, a detection component located in the sensing section of the encapsulation layer, and a signal transmission component located on the other side of the encapsulation layer opposite to the sensing section. The detection component includes a plurality of electrodes arranged in parallel and spaced apart. The two adjacent electrodes are offset to the left or right respectively and the projections of the paragraphs of the two electrodes overlap. A signal line on the left is electrically connected to the plurality of electrodes on the left, and a signal line on the right is electrically connected to the plurality of electrodes on the right. The signal transmission component includes at least one coil and two transmission lines electronically connected to the at least one coil. The two transmission lines are electronically connected to the two signal lines, respectively. The biological information sensing device provides the effect of improving sensing sensitivity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偵測元件</p>  
        <p type="p">11:電極</p>  
        <p type="p">12:訊號線</p>  
        <p type="p">2:訊號傳輸元件</p>  
        <p type="p">21:線圈</p>  
        <p type="p">22:傳輸線</p>  
        <p type="p">3:封裝層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="213" publication-number="202621215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能機櫃</chinese-title>  
        <english-title>MULTIFUNCTIONAL RACK CABINET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241119B">H05K5/02</main-classification>  
        <further-classification edition="200601120241119B">E06B5/10</further-classification>  
        <further-classification edition="200601120241119B">G05B11/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉烜廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇信宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱紹舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHAO-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張勝智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHENG-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仁俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, REN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多功能機櫃包括支撐架、外門、電控箱、第一內門與第二內門。外門樞接於支撐架的邊緣。電控箱連接於支撐架，且包括主開關、至少一控制單元、至少一泵浦開關、至少一感測元件介面與複數個電器元件。第一內門樞接於電控箱的一邊緣且覆蓋控制單元、泵浦開關與感測元件介面，其中主開關從第一內門至少部分露出。第二內門樞接於電控箱的該邊緣且覆蓋電器元件。第一內門位於外門與第二內門之間，且主開關、控制單元、泵浦開關與感測元件介面從第二內門至少部分露出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multifunctional rack cabinet includes a support rack, an outer door, an electric control box, a first inner door, and a second inner door. The outer door is pivotally connected to an edge of the support rack. The electric control box is connected to the support rack and includes a main switch, at least one control unit, at least one pump switch, at least one sensor interface, and plural electrical components. The first inner door is pivotally connected to an edge of the electric control box and covers the control unit, the pump switch, and the sensor interface, wherein the main switch is at least partially exposed through the first inner door. The second inner door is pivotally connected to the edge of the electric control box and covers the electrical components. The first inner door is located between the outer door and the second inner door, and the main switch, the control unit, the pump switch, and the sensor interface are at least partially exposed through the second inner door.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多功能機櫃</p>  
        <p type="p">110:支撐架</p>  
        <p type="p">120:外門</p>  
        <p type="p">130:電控箱</p>  
        <p type="p">131:主開關</p>  
        <p type="p">134:控制單元</p>  
        <p type="p">135:泵浦開關</p>  
        <p type="p">136:感測元件介面</p>  
        <p type="p">137:電器元件</p>  
        <p type="p">140:第一內門</p>  
        <p type="p">160:第二內門</p>  
        <p type="p">162:缺口</p>  
        <p type="p">164:缺口</p>  
        <p type="p">166:開口</p>  
        <p type="p">168:開口</p>  
        <p type="p">170:泵浦</p>  
        <p type="p">190:後門</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="214" publication-number="202620772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於人工智慧的專利核駁分析系統及方法</chinese-title>  
        <english-title>AI-BASED SYSTEM AND METHOD FOR GENERATING PATENT ANALYSIS REPORT IN RESPONSE TO OFFICIAL COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250602B">G06Q50/18</main-classification>  
        <further-classification edition="202001120250602B">G06F40/30</further-classification>  
        <further-classification edition="201901120250602B">G06F16/93</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種專利核駁分析方法，包含：輸入專利文件及核駁意見；利用光學字元辨識(OCR)技術將所述專利文件及核駁意見轉換為可編輯文本；對可編輯文本進行預處理；利用自然語言處理(NLP)技術對預處理後的文本進行分析，以識別出與關鍵資訊相關的實體，其中，實體包含專利範圍、技術特徵和核駁原因；基於識別出的實體，建立知識圖譜(Knowledge Graph)；以及利用檢索增強生成(RAG)技術，根據所述知識圖譜生成答辯建議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A patent rejection analysis method includes the steps of: inputting patent documents and office action/rejection opinions; using Optical Character Recognition (OCR) technology to convert the patent documents and rejection opinions into editable text; preprocessing the editable text; using Natural Language Processing (NLP) technology to analyze the pre-processed text to identify entities related to key information, wherein the entities include patent scope, technical features, and reasons for rejection; constructing a knowledge graph based on the identified entities; and using Retrieval-Augmented Generation (RAG) technology to generate response suggestions based on the knowledge graph.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="215" publication-number="202621352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容陣列</chinese-title>  
        <english-title>CAPACITOR ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10N97/00</main-classification>  
        <further-classification edition="202001120241202B">G06F30/392</further-classification>  
        <further-classification edition="200601120241202B">H03M1/08</further-classification>  
        <further-classification edition="200601120241202B">H03M1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電容陣列包含第一下板、至少一上板、至少一條狀下板、一第一通孔、一第二下板以及第二通孔。至少一上板位於第一下板之上。至少一條狀下板位於第一下板之上，並位於至少一上板的外側。第一通孔連接第一下板與至少一條狀下板。第二下板位於至少一上板與至少一條狀下板之上。第二通孔連接至少一條狀下板與第二下板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A capacitor array includes a first bottom plate, at least one top plate, at least one strip bottom plate, a first via, a second bottom plate, and a second via. The at least one top plate is located above the first bottom plate. The at least one strip bottom plate is located above the first bottom plate and located on outside of the at least one top plate. The first via connects the first bottom plate and the at least one strip bottom plate. The second bottom plate is located above the at least one top plate and the at least one strip bottom plate. The second via connects the at least one bottom plate and the second bottom plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電容陣列</p>  
        <p type="p">111:連接板</p>  
        <p type="p">121、122:接地板</p>  
        <p type="p">131:下板</p>  
        <p type="p">132:接地板</p>  
        <p type="p">141:上板</p>  
        <p type="p">142、143:條狀下板</p>  
        <p type="p">144、145:接地板</p>  
        <p type="p">151:上板</p>  
        <p type="p">152、153:條狀下板</p>  
        <p type="p">154、155:接地板</p>  
        <p type="p">161:上板</p>  
        <p type="p">162、163:條狀下板</p>  
        <p type="p">164、165:接地板</p>  
        <p type="p">171:下板</p>  
        <p type="p">172:接地板</p>  
        <p type="p">M1~M7:金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="216" publication-number="202619963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫氣純化系統以及氫氣純化方法</chinese-title>  
        <english-title>HYDROGEN PURIFICATION SYSTEM AND HYDROGEN PURIFICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">C01B3/50</main-classification>  
        <further-classification edition="200601120260223B">B01D53/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嵩駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡麗端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, LI-DUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氫氣純化系統以及氫氣純化方法。氫氣純化系統包括純化裝置、供水裝置以及含氫氣體供應裝置。純化裝置包括陽極、陰極以及位於陽極與陰極之間的電解質膜。供水裝置與陰極連接並提供液態水到陰極。含氫氣體供應裝置與陽極連接，以將含氫氣體供應到陽極。在進行氫氣純化的過程中，液態水是以不中斷的方式持續供應到陰極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hydrogen purification system and a hydrogen purification method are provided. The hydrogen purification system includes a purification device, a water supply device and a hydrogen-containing gas supply device. The purification device includes an anode, a cathode and an electrolyte membrane located between the anode and the cathode. The water supply device is connected to the cathode and provides liquid water to the cathode. The hydrogen-containing gas supply device is connected to the anode to supply hydrogen-containing gas to the anode. During a hydrogen purification process, the liquid water is continuously supplied to the cathode in an uninterrupted manner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:氫氣純化系統</p>  
        <p type="p">110:純化裝置</p>  
        <p type="p">112:陰極</p>  
        <p type="p">112a:陰極觸媒層</p>  
        <p type="p">112b:陰極氣體擴散層</p>  
        <p type="p">112c:陰極流道</p>  
        <p type="p">113:陰極隔板</p>  
        <p type="p">113a:陰極入口</p>  
        <p type="p">113b:陰極出口</p>  
        <p type="p">114:陽極</p>  
        <p type="p">114a:陽極觸媒層</p>  
        <p type="p">114b:陽極氣體擴散層</p>  
        <p type="p">114c:陽極流道</p>  
        <p type="p">115:陽極隔板</p>  
        <p type="p">115a:陽極入口</p>  
        <p type="p">115b:陽極出口</p>  
        <p type="p">116:電解質膜</p>  
        <p type="p">116a、116b:主表面</p>  
        <p type="p">120:供水裝置</p>  
        <p type="p">130:含氫氣體供應裝置</p>  
        <p type="p">140:氣液分離裝置</p>  
        <p type="p">150:電源</p>  
        <p type="p">160:交流阻抗分析裝置</p>  
        <p type="p">170:控制器</p>  
        <p type="p">180:純化氫氣排放路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="217" publication-number="202621090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於判斷設備故障的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR DETERMINING EQUIPMENT FAILURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L41/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於判斷設備故障的系統及方法。方法包括以下步驟：對至少一相鄰設備的相鄰設備監控數據執行前處理操作來獲得前處理後的相鄰設備監控數據，其中至少一相鄰設備相鄰於目標設備；以及利用前處理後的相鄰設備監控數據來計算出對應於至少一相鄰設備的資訊熵，並且利用資訊熵來判斷出對應於目標設備的故障判斷結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method for determining an equipment failure are provided. The method includes following steps: performing a pre-processing operation on adjacent device monitoring data of at least one adjacent device to obtain the pre-processed adjacent device monitoring data, wherein the at least one adjacent device is adjacent to a target device; and using the pre-processed adjacent device monitoring data to calculate an information entropy corresponding to the at least one adjacent device, and using the information entropy to determine a failure determination result corresponding to the target device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21、S22:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="218" publication-number="202620586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源供應裝置</chinese-title>  
        <english-title>POWER SUPPLY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F1/16</main-classification>  
        <further-classification edition="200601120250303B">G06F1/26</further-classification>  
        <further-classification edition="200601120250303B">G06F1/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光林智能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEOTEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾富欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, FU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種電源供應裝置。此電源供應裝置包括一箱體、一電源供應模組以及一支撐構架。箱體包含一上蓋及一底座。電源供應模組設置於箱體內並接觸上蓋或底座。支撐構架可拆卸地固定於箱體。電源供應模組透過支撐構架固持於箱體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply device is provided. The power supply device comprises a housing body, a power supply module and a supporting frame. The housing body includes an upper cover and a base. The power supply module is installed in the housing body and is in contact with the upper cover or the base. The supporting frame is detachably fixed to the housing body. The power supply module is held in the housing body through the supporting frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:支撐構架</p>  
        <p type="p">130CH:組合孔</p>  
        <p type="p">130EA:彈性抵壓部</p>  
        <p type="p">130ES:彈性支撐部</p>  
        <p type="p">130AD:對位凸點</p>  
        <p type="p">130MH:安裝孔</p>  
        <p type="p">130FH:固定孔</p>  
        <p type="p">131:中板結構</p>  
        <p type="p">132:側板結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="219" publication-number="202620287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>怠速起停系統之發電控制方法</chinese-title>  
        <english-title>POWER GENERATION CONTROL METHOD FOR IDLE STOP-START SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">F02N11/08</main-classification>  
        <further-classification edition="201601120241114B">B60W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾威婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, WEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甯攸威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NING, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種怠速起停系統之發電控制方法，所述怠速起停系統包括一電池系統、一起動兼發電控制系統、一引擎燃油噴射控制系統以及一具有一曲軸之引擎，起動兼發電控制系統包括一起動兼發電控制器及一起動兼發電裝置，起動兼發電控制器分別電連接電池系統及起動兼發電裝置，引擎燃油噴射控制系統通訊連接起動兼發電控制器，起動兼發電裝置係與曲軸同軸設置，引擎燃油噴射控制系統分別電連接電池系統及引擎。藉此，透過本發明之怠速起停系統之發電控制方法，可有效降低引擎在怠速時因為發電產生的損耗而影響引擎運轉狀況，造成熄火情況發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a power generation control method for an idle stop-start vehicle. The idle stop-start vehicle includes a battery system, a starter generator control system, an engine fuel injection control system and an engine with a crankshaft. The starter generator control system includes starter generator controller and a starter generator device. The starter generator controller is electrically connected to the battery system and the starter generator device respectively. The engine fuel injection control system is connected to the starter generator controller by communication. The starter generator device is arranged coaxially with the crankshaft, and the engine fuel injection control system is electrically connected to the battery system and the engine respectively. As such, through the power generation control method of the idle stop-start system of the present invention, the power generation loss of the engine during idling can be effectively reduced, which affects the engine operating condition and causes flameout.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A~H:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="220" publication-number="202619875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速模具加熱裝置</chinese-title>  
        <english-title>RAPID MOLD HEATING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B29C35/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快速模具加熱裝置，其包含一腔體、一模具以及一移動機構。該腔體界定一容置空間用以放置該模具，且該腔體包含一個以上的線圈機構，該線圈機構與一個以上的交流電輸出單元連接，該交流電輸出單元輸出高週波電流通過該線圈機構，對至少部分之該容置空間提供一變換磁場。該移動機構可平移或旋轉該模具，使該模具可在該容置空間中移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rapid mold heating device having a cavity, a mold, and a moving mechanism. The cavity defines a space for placing the mold, and the cavity contains one or more coil mechanisms, the coil mechanism is connected to one or more AC output units, the AC output unit outputs high-frequency electric current through the coil mechanism, providing a changing magnetic field to at least a portion of the accommodating space. The moving mechanism can translate or rotate the mold, making the mold move within the accommodating space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腔體</p>  
        <p type="p">11:線圈機構</p>  
        <p type="p">20:移動機構</p>  
        <p type="p">30:模具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="221" publication-number="202620907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可多相位或高耦合之電感</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01F17/04</main-classification>  
        <further-classification edition="200601120250401B">H01F27/28</further-classification>  
        <further-classification edition="200601120250401B">H01F30/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西北臺慶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂冠儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可多相位或高耦合之電感，其包含：一鐵芯，該鐵芯具有相對的一第一側面及一第二側面，及介於該第一側面及該第二側面之間的一第三側面，且該鐵芯設有間隔配置的複數個容置部；以及複數個線圈繞組，該複數個線圈繞組分別至少包含一第一線圈及一第二線圈，該複數個線圈繞組分別設於該鐵芯的複數個容置部，該第一線圈設有一中空部，該中空部具有一第一長度及一第一寬度，該第一線圈設有一第一彎折部及一第二彎折部，且該第一彎折部及該第二彎折部沿著不同方向彎折，該第一彎折部露出於該鐵芯的第二側面，又該第二線圈設於該第一線圈的中空部，該第二線圈具有一第二長度及一第二寬度，該第一長度大於該第二長度，該第一寬度大於該第二寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:鐵芯</p>  
        <p type="p">11:第一側面</p>  
        <p type="p">12:第二側面</p>  
        <p type="p">13:第三側面</p>  
        <p type="p">2:線圈繞組</p>  
        <p type="p">21:第一線圈</p>  
        <p type="p">22:第二線圈</p>  
        <p type="p">214:第一彎折部</p>  
        <p type="p">215:第二彎折部</p>  
        <p type="p">23:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="222" publication-number="202621402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撕膜裝置及撕膜方法</chinese-title>  
        <english-title>FILM PEELING DEVICE AND FILM PEELING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">B32B43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志聖工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C SUN MFG. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林英菘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴金森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIN SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳均維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JYUN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種撕膜裝置，包含承載座、撕膜機構及位置感測器。承載座具有用以承載貼附有膜料之基板的承載面。撕膜機構包含夾持件以及撕膜件。撕膜件用以剝離膜料，且撕膜件可移動靠近夾持件以共同夾持膜料。位置感測器對應撕膜機構設置，且位置感測器可相對撕膜機構沿著承載面的法線方向移動靠近基板的外表面。根據位置感測器的感測端相對於撕膜件的位移量獲得位移補償值，且撕膜件可根據位移補償值沿著承載面的法線方向移動遠離夾持件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A film peeling device includes a carrier, a peeling mechanism, and a position sensing element. The carrier has a supporting surface for carrying a substrate on which a film is attached. The peeling mechanism includes a clamping member and a peeling member. The clamping member is configured to clamp the film and the peeling member can be moved close to the clamping member to jointly hold the film. The position sensing element is provided in response to the peeling mechanism, and the position sensing element is movable closer to the outer surface of the substrate in a direction normal to the supporting surface with respect to the clamping mechanism. A displacement compensation value is obtained based on the displacement of the sensing end of the position sensing element relative to the peeling member, and the peeling member can be moved away from the clamping member in the direction normal to the supporting surface based on the displacement compensation value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:撕膜裝置</p>  
        <p type="p">10:承載座</p>  
        <p type="p">110:承載面</p>  
        <p type="p">20:撕膜機構</p>  
        <p type="p">210:夾持件</p>  
        <p type="p">220:撕膜件</p>  
        <p type="p">30:位置感測器</p>  
        <p type="p">310:感測端</p>  
        <p type="p">31:伸縮單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="223" publication-number="202620326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接頭輔助套件及接頭模組</chinese-title>  
        <english-title>JOINT AUXILIARY ASSEMBLY AND JOINT ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F16L49/02</main-classification>  
        <further-classification edition="200601120241204B">F16L55/10</further-classification>  
        <further-classification edition="200601220241204B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接頭輔助套件及接頭模組，其中接頭輔助套件包含一組裝筒、一第一彈性元件、一限位筒、一電控組件以及一液體檢測單元。組裝筒的一側具有多個止擋部且組裝筒用以組裝於第一接頭。第一彈性元件設置於組裝筒中且第一彈性元件的一端抵靠於止擋部。限位筒沿組裝筒的一軸向方向可活動地設置於組裝筒。止擋部受限位筒環繞並抵靠於限位筒。電控組件設置於組裝筒。液體檢測單元之至少一部分設置於組裝筒，並電性連接於電控組件。電控組件用以根據液體檢測單元令限位筒活動而使止擋部活動，進而使第一彈性元件將第一接頭及第二接頭斷開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A joint auxiliary assembly and a joint assembly, where the joint auxiliary assembly includes a mounting barrel, a first elastic component, a limiting barrel, an electronic controlling assembly and a detecting component. Blocking parts are located on a side of the mounting barrel, and the mounting barrel is configured to be mounted on the first joint. The first elastic component is disposed in the mounting barrel and an end thereof rests on the blocking parts. The limiting barrel is movably disposed on the mounting barrel along an axial direction thereof. The limiting barrel surrounds and in contact with the parts. The electronic controlling assembly is disposed on the mounting barrel. The detecting component at least partially disposed on the mounting barrel and electrically connected to the electromagnetic assembly. The electronic controlling assembly is configured to move the limiting barrel based on the detecting component to move the blocking parts, thereby disconnecting the first joint and the second joint by the first elastic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:接頭模組</p>  
        <p type="p">100:第一接頭</p>  
        <p type="p">200:第二接頭</p>  
        <p type="p">210:凸部</p>  
        <p type="p">313:止擋部</p>  
        <p type="p">320:第一彈性元件</p>  
        <p type="p">330:限位筒</p>  
        <p type="p">351:磁芯</p>  
        <p type="p">352:線圈</p>  
        <p type="p">353:電路板</p>  
        <p type="p">360:液體檢測單元</p>  
        <p type="p">A:軸向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="224" publication-number="202620535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機機殼組件、機載相機及無人機</chinese-title>  
        <english-title>CAMERA CASING ASSEMBLY, CAMERA AND DRONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250113B">G03B17/08</main-classification>  
        <further-classification edition="202101120250113B">G03B17/12</further-classification>  
        <further-classification edition="202301120250113B">B64C39/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林學治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSUEH CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相機機殼組件，包含一附接機構、一鏡頭承載件及一環形阻水件。鏡頭承載件可轉動地設置於附接機構，附接機構及鏡頭承載件共同形成一馬達容置空間、一環形阻水空間及一環形狹縫，環形阻水空間環繞馬達容置空間，環形狹縫連通於環形阻水空間。環形阻水件設置於環形阻水空間且遮擋環形狹縫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera casing assembly includes an attachment mechanism, a lens support component and an annular waterproof component. The lens support component is rotatably disposed on the attachment mechanism The attachment mechanism and the lens support component together form a motor accommodation space, an annular waterproof space and an annular slot. The annular waterproof space surrounds the motor accommodation space, and the annular slot communicates with the annular waterproof space. The annular waterproof component is disposed in the annular waterproof space and blocks the annular slot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:機載相機</p>  
        <p type="p">21:相機機殼組件</p>  
        <p type="p">211:附接機構</p>  
        <p type="p">2111:附接座</p>  
        <p type="p">2112:第一支臂</p>  
        <p type="p">2113:第二支臂</p>  
        <p type="p">212:鏡頭承載件</p>  
        <p type="p">213:第一環形阻水件</p>  
        <p type="p">217:第二環形阻水件</p>  
        <p type="p">221:第三環形阻水件</p>  
        <p type="p">22:鏡頭組件</p>  
        <p type="p">23:第一馬達組件</p>  
        <p type="p">24:第二馬達組件</p>  
        <p type="p">25:第三馬達組件</p>  
        <p type="p">P1,P2,P3:軸線</p>  
        <p type="p">A,B,C:區域</p>  
        <p type="p">S11:第一馬達容置空間</p>  
        <p type="p">S12:第一環形阻水空間</p>  
        <p type="p">S13:第一環形狹縫</p>  
        <p type="p">S21:第二馬達容置空間</p>  
        <p type="p">S22:第二環形阻水空間</p>  
        <p type="p">S23:第二環形狹縫</p>  
        <p type="p">S31:第三馬達容置空間</p>  
        <p type="p">S32:第三環形阻水空間</p>  
        <p type="p">S33:第三環形狹縫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="225" publication-number="202620890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運用復健醫材的健康照護推薦方法及系統</chinese-title>  
        <english-title>HEALTHCARE RECOMMENDATION METHOD AND SYSTEM USING REHABILITATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241220B">G16H20/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳知霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾運承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHONG, YUN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHI YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林謙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種運用復健醫材的健康照護推薦方法及系統，其中健康照護推薦方法由處理裝置執行，包含：從多個感測裝置取得多筆原始感測資料，根據多個個人化特徵標記所述多筆原始感測資料中之一者以產生標記資料，將所述多筆原始感測資料中之一者輸入預訓練預測模型以產生預測資料，將標記資料及預測資料進行資料融合以產生融合資料，從所述多筆原始感測資料中萃取多維度特徵資料，將融合資料及多維度特徵資料輸入預訓練推論模型以產生運動成效指標，以及根據運動成效指標產生健康照護方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a healthcare recommendation method and system using rehabilitation device, wherein the healthcare recommendation method, performed by a processing device, includes: obtaining pieces of raw sensing data from sensing devices, labeling one of the pieces of raw sensing data according to personalized feature labels to generate labeled data, inputting one of the pieces of raw sensing data to a pre-trained predication model to generate predicted data, performing data fusion on the labeled data and the predicted data to generate fusion data, extracting multi-dimensional feature data from the pieces of raw sensing data, inputting the fusion data and the multi-dimensional feature data into a pre-trained inference model to generate an exercise effectiveness indicator, and generating a healthcare plan based on the exercise effectiveness indicator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S111,S112,S113,S115,S117,S119,S121:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="226" publication-number="202621158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於可解釋性人工智慧的基站功率控制系統及其方法</chinese-title>  
        <english-title>EXPLAINABLE AI BASED BASE STATION POWER CONTROL SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250303B">H04W52/04</main-classification>  
        <further-classification edition="200901120250303B">H04W24/02</further-classification>  
        <further-classification edition="202301120250303B">G06N3/08</further-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張佑群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於可解釋性人工智慧的基站功率控制系統及其方法，用於包括多個RU的ORAN中，包括收集RU的參數資料以及一案場的案場時間資料，建立配置文件；選擇第一預測模型並且依據第一預測模型、配置文件獲取關鍵性能管理參數；選擇第二預測模型，依據第二預測模型、時間序列技術及配置文件獲取案場中同一時段的關鍵性能管理參數的關鍵性能管理參數資料，並且設定預設閾值，以對第二預測模型進行模型訓練；以及將經模型訓練後的第二預測模型部署至案場中，以依據關鍵性能管理參數資料以及預設閾值判斷是否關閉案場中的RU。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An explainable AI based base station power control system and method thereof, used in ORAN including a plurality of Rus, including collecting RU parameter data and case time data of a case, and establishing a configuration file, selecting a first prediction model and obtaining key performance management parameters according to the first prediction model and the configuration file, selecting a second prediction model, and obtaining key performance management parameter data of the key performance management parameters at the same time period in the case according to the second prediction model, time series technology and the configuration file, setting a preset threshold to perform model training on the second prediction model, and deploying the second prediction model after model training to the case site to determine whether to close the RUs in the case site according to the key performance management parameter data and the preset threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於可解釋性人工智慧的基站功率控制系統、基站功率控制系統</p>  
        <p type="p">101:收集模組</p>  
        <p type="p">102:基於可解釋性人工智慧演算法模組</p>  
        <p type="p">103:部署與評估模組</p>  
        <p type="p">1021:第一預測子模組</p>  
        <p type="p">1022:第二預測子模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="227" publication-number="202620278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可改變收合間距的雙軸鉸鏈</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">E05D7/04</main-classification>  
        <further-classification edition="200601120241230B">F16C11/04</further-classification>  
        <further-classification edition="200601120241230B">B65D6/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫禾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINHER TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴南海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, NAN-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可改變收合間距的雙軸鉸鏈，包含一鉸鏈本體及至少一間距調節機構。該鉸鏈本體具有一承架及二平行設置於該承架的第一轉軸。該至少一間距調節機構包含一連接該第一轉軸並相對該鉸鏈本體轉動的連桿，一相對該連桿轉動的基座，及一配置於該基座的限制單元。該連桿設有一限位槽，該限制單元包含一與該限位槽對應的鎖固件及一連接該鎖固件的磁性件。該鎖固件具有一接觸該限位槽並限制該基座轉動的第一狀態，以及一分離該限位槽並允許該基座轉動的第二狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:雙軸鉸鏈</p>  
        <p type="p">21:鉸鏈本體</p>  
        <p type="p">211:承架</p>  
        <p type="p">22:間距調節機構</p>  
        <p type="p">221:連桿</p>  
        <p type="p">222:基座</p>  
        <p type="p">223:限制單元</p>  
        <p type="p">224:第二軸接孔</p>  
        <p type="p">225:軸接結構</p>  
        <p type="p">227:鎖固件</p>  
        <p type="p">228:磁性件</p>  
        <p type="p">229:彈性復位件</p>  
        <p type="p">230:滑座</p>  
        <p type="p">231:銷</p>  
        <p type="p">232:導塊</p>  
        <p type="p">235:蓋板</p>  
        <p type="p">236:第二轉軸</p>  
        <p type="p">237:容置空間</p>  
        <p type="p">238:安裝座</p>  
        <p type="p">239:限制結構</p>  
        <p type="p">240:組裝臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="228" publication-number="202619757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>美容儀</chinese-title>  
        <english-title>BEAUTY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">A61N1/04</main-classification>  
        <further-classification edition="200601120250113B">A61N1/18</further-classification>  
        <further-classification edition="200601120250113B">A61H9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碧波庭國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIBOTING INTERNATIONAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉柏樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PO CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁立彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, LI PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉柏樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PO CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係一種美容儀，包括主殼體、第一電極件及複數第二電極件，主殼體具有貼附部、負壓吸氣口及負壓排氣口，負壓吸氣口設置在貼附部且連通負壓排氣口，第一電極件設置在貼附部，第一電極件包括連接環及複數延伸電極，連接環環繞負壓吸氣口，各延伸電極自連接環朝遠離負壓吸氣口的方向延伸，各第二電極件設置在貼附部，各第二電極件圍繞連接環且與各延伸電極錯位配置，在第一電極件與每一第二電極件之間形成有間隙；藉此，美容儀能夠對皮膚同時起到真空吸附與微電流刺激的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A beauty apparatus having a main case, a first electrode member, and a plurality of second electrode members is provided. The main case has an attaching portion, a negative pressure inlet, and a negative pressure outlet. The negative pressure inlet is arranged on the attaching portion and communicated to the negative pressure outlet. The first electrode member is arranged on the attaching portion and includes a connection ring and a plurality of extending electrodes. The connection ring surrounds the negative pressure inlet. The extending electrodes extend from the connection ring in a direction away from the negative pressure inlet. The second electrode members are arranged on the attaching portion, surround the connection ring, and are misaligned with the extending electrodes. A gap is formed between the first electrode member and each of the second electrode members. The beauty apparatus is therefore simultaneously performing vacuum adsorption and micro-current stimulation on a skin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主殼體</p>  
        <p type="p">101:貼附部</p>  
        <p type="p">102:負壓吸氣口</p>  
        <p type="p">103:負壓排氣口</p>  
        <p type="p">104:按鍵</p>  
        <p type="p">105:視窗</p>  
        <p type="p">11:第一殼體</p>  
        <p type="p">12:第二殼體</p>  
        <p type="p">20:第一電極件</p>  
        <p type="p">21:連接環</p>  
        <p type="p">22:延伸電極</p>  
        <p type="p">23:間隙</p>  
        <p type="p">30:第二電極件</p>  
        <p type="p">50:第三電極件</p>  
        <p type="p">63:透明蓋板</p>  
        <p type="p">80:眼周按摩器</p>  
        <p type="p">81:凸圓柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="229" publication-number="202620908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於乙太網路供電的線圈結構</chinese-title>  
        <english-title>COIL STRUCTURE FOR POWER OVER ETHERNET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01F27/28</main-classification>  
        <further-classification edition="200601120250203B">H01F41/04</further-classification>  
        <further-classification edition="200601120250203B">H04L12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇力新電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHILISIN ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶少英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, SHAOYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔卓斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, ZHUOBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林啟鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線圈結構，包含第一、第二磁環、包含第一至第六單線的第一側單線組、包含第七至第九單線的第二側單線組。第一至第三單線及第七單線絞合為第一絞線，第四至第六單線及第八單線絞合為第二絞線。第一及第二絞線交錯不交疊地纏繞第一磁環。第七至第九單線絞合為第三絞線且延伸纏繞第二磁環。第一磁環第一側的第四單線、第二側的第二單線及第三單線絞合為第四絞線。第一磁環第一側的第五單線及第六單線、及第二側的第一單線絞合為第五絞線。第一磁環第一側的第一至第三單線絞合為第六絞線。第一磁環第二側的第四至第六單線絞合為第七絞線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coil structure includes a first magnetic ring, a second magnetic ring, a first side wire group including first wire to sixth single wire, and a second side wire group including seventh wire to ninth wire. The first wire, the second wire, the third wire, and the seventh wire are twisted into a first twisted wire. The fourth wire, the fifth wire, the sixth wire, and the eighth wire are twisted into a second twisted wire. The first twisted wire and the second twisted wires are wound around the first magnetic ring without overlapping. The seventh wire, the eighth wire, and the ninth wire are twisted outside the first magnetic ring into a third twisted wire, and the third twisted wire extends to wrap around the second magnetic ring. The fourth wire on the first side, the second wire and the third wire on the second side are twisted into a fourth twisted wire. The fifth wire and the sixth wire on the first side and the first wire on the second side are twisted into a fifth twisted wire. The first wire, the second wire, and the third wire on the first side are twisted into a sixth twisted wire. The fourth wire, the fifth wire, and the sixth wire on the second side are twisted into a seventh twisted wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線圈結構</p>  
        <p type="p">101:第一絞線</p>  
        <p type="p">102:第二絞線</p>  
        <p type="p">103:第三絞線</p>  
        <p type="p">104:第四絞線</p>  
        <p type="p">105:第五絞線</p>  
        <p type="p">106:第六絞線</p>  
        <p type="p">107:第七絞線</p>  
        <p type="p">108:第八絞線</p>  
        <p type="p">C1:第一磁環</p>  
        <p type="p">C2:第二磁環</p>  
        <p type="p">G:第八單線</p>  
        <p type="p">N:第七單線</p>  
        <p type="p">R4:第九單線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="230" publication-number="202620661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>特徵篩選方法及特徵篩選系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250303B">G06F16/20</main-classification>  
        <further-classification edition="201901120250303B">G06F16/245</further-classification>  
        <further-classification edition="200601120250303B">G06F17/18</further-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰金融控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃心宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種特徵篩選方法藉由一特徵篩選系統來實施，並包含：對一資料集的多個待分析資料的多個分析變數計算一缺失率及一相異值比率，並根據一缺失率閾值及一相異值比率閾值，對該等分析變數作篩選以產生篩選後的該資料集；對篩選後的該資料集執行一快速相關性濾波演算法，以獲得該等分析變數之其中與一目標變數的一相關性數值大於一設定閾值的多個一階特徵變數，並再根據該等一階特徵變數之間的該等相關性數值決定多個二階特徵變數；將該等二階特徵變數作為篩選結果的多個特徵變數，以用於對該目標變數的模型建立。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理單元</p>  
        <p type="p">2:通訊單元</p>  
        <p type="p">3:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="231" publication-number="202621008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達之定位裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H02K5/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱美電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張裕銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單多年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種馬達之定位裝置，包含一基座及一定位件。該基座包括一殼座體，及一由該殼座體朝上凸伸的軸管。該軸管界定出一容置該馬達之軸承的設置槽，及複數沿軸向開設且彼此環狀間隔排列的穿伸口。該定位件包括一設置於該軸管上且可定位轉軸的蓋座部、至少一由該蓋座部朝下伸置於該設置槽內且靠抵該軸承的壓抵部、複數由該蓋座部朝下延伸且分別通過該等穿伸口的卡扣部，及複數與該等卡扣部沿周向環狀交錯排列且向下延伸壓抵至該定子上方的凸塊部。該定位件可用單一部件同時固定該轉子、該定子，及該軸承，且無需於該設置槽中另外設置部件，降低配置難度且易於拆裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:定子</p>  
        <p type="p">211:支撐架</p>  
        <p type="p">212:矽鋼片</p>  
        <p type="p">213:線圈</p>  
        <p type="p">22:轉子</p>  
        <p type="p">221:轉軸</p>  
        <p type="p">222:環槽</p>  
        <p type="p">23:軸承</p>  
        <p type="p">3:基座</p>  
        <p type="p">31:殼座體</p>  
        <p type="p">32:軸管</p>  
        <p type="p">321:設置槽</p>  
        <p type="p">322:管壁部</p>  
        <p type="p">323:凸座部</p>  
        <p type="p">324:環套部</p>  
        <p type="p">325:定位槽</p>  
        <p type="p">326:穿伸口</p>  
        <p type="p">4:定位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="232" publication-number="202621523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方泓翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, HUNG HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宣人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSUAN JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，該電子封裝件包含有電子模組、設於該電子模組上之光學裝置、以及包覆該光學裝置外表面之保護層，其中，該電子模組包含有線路結構、設於該線路結構上之電子元件、形成於該線路結構上以包覆該電子元件之包覆層，以及形成於該包覆層上之佈線結構，該光學裝置係電性連接該佈線結構，且該保護層為抗水性包覆藥劑以保護光學裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic module, an optical device provided on the electronic module, and a protective layer covering the outer surface of the optical device, wherein the electronic module includes a circuit structure, an electronic component provided on the circuit structure, a coating layer formed on the circuit structure to cover the electronic component, and a wiring structure formed on the coating layer, the optical device is electrically connected to the wiring structure, and the protective layer is water-resistant coating agent to protect the optical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:第一承載件</p>  
        <p type="p">21:電子模組</p>  
        <p type="p">21a:切割廢料</p>  
        <p type="p">211:線路結構</p>  
        <p type="p">212:電子元件</p>  
        <p type="p">214:包覆層</p>  
        <p type="p">215:佈線結構</p>  
        <p type="p">22:光學裝置</p>  
        <p type="p">23:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="233" publication-number="202621149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>來源基站及傳輸方法</chinese-title>  
        <english-title>SOURCE BASE STATION AND TRANSMISSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120241204B">H04W36/08</main-classification>  
        <further-classification edition="200901120241204B">H04W36/06</further-classification>  
        <further-classification edition="200901120241204B">H04W36/18</further-classification>  
        <further-classification edition="200901120241204B">H04W36/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許獻聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIEN TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵宇安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, YU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種來源基站及傳輸方法。一來源基站傳輸一無線資源控制重新配置訊息至一使用者裝置。該無線資源控制重新配置訊息包含一指示訊息及一候選基站清單，且該候選基站清單用以指示複數個候選基站。該來源基站基於自該使用者裝置接收之一預測報告，決定該等候選基站中之一非目標基站。該來源基站傳輸一換手取消請求至該等候選基站中之該非目標基站，以使該非目標基站釋放對應該使用者裝置之一保留資源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A source base station and transmission method are provided. A source base station transmits a radio resource control reconfiguration message to a user device. The radio resource control reconfiguration message includes an indication message and a candidate base station list, and the candidate base station list is used to indicate a plurality of candidate base stations. The source base station determines a non-target base station among the candidate base stations based on a prediction report received from the user device. The source base station transmits a handover cancel request to the non-target base station among the candidate base stations to make the non-target base station release a reserved resource corresponding to the user device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:傳輸方法</p>  
        <p type="p">S701、S703、S705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="234" publication-number="202621121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>獲取網路影音訊息執行分軌處理並結合人工智慧輸出生成媒體的方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR ACCESSING AND SPLITTING ONLINE MULTIMEDIA CONTENT AS WELL AS OUTPUTTING GENERATED MEDIA USING AI TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250303B">H04N21/234</main-classification>  
        <further-classification edition="201101120250303B">H04N21/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種獲取網路影音訊息執行分軌處理並結合人工智慧輸出生成媒體的方法及系統，前述方法包含：一裝置伺服器或一生成式人工智慧伺服器以一應用程式介面技術解析一連結碼後，根據該連結碼以該應用程式介面技術獲取一網路影音訊息，再透過一取樣模組自該網路影音訊息分離出複數分軌訊息、產生至少一生成訊息，並輸出為一生成媒體，該裝置伺服器在該影音播放裝置的一播放介面中播放該生成媒體。藉此，無須跳轉至其他串流平台的網頁或應用程式、無須下載，即可直接獲取網路影音訊息執行分軌處理、輸出生成媒體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:影音播放裝置</p>  
        <p type="p">11:裝置伺服器</p>  
        <p type="p">12:播放介面</p>  
        <p type="p">13:搜尋排序介面</p>  
        <p type="p">14:開通介面</p>  
        <p type="p">15:資料庫</p>  
        <p type="p">2:取樣模組</p>  
        <p type="p">3:生成式人工智慧伺服器</p>  
        <p type="p">A:串流平台</p>  
        <p type="p">A1:應用程式介面伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="235" publication-number="202619735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>竹蜂萃取物用於預防肝纖維化之用途</chinese-title>  
        <english-title>USE OF BAMBOO BEE EXTRACT FOR PREVENTION LIVER FIBROSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250102B">A61K35/64</main-classification>  
        <further-classification edition="200601120250102B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雄醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱依琇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, YI-SHIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周甲三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIA-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏麗雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, LI-XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種竹蜂萃取物用於預防肝纖維化之用途，所述竹蜂萃取物係將竹蜂原料經由水萃法進行萃取後所得；藉由服用所述竹蜂萃取物，可預防肝纖維化，以作為護肝保健品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the use of bamboo bee extract to prevent liver fibrosis, the bamboo bee extract is obtained by extracting bamboo bee raw materials through a water extraction method; by taking the bamboo bee extract, liver fibrosis can be prevented and used as a liver-protecting health product.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="236" publication-number="202619793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保留有效成分之核殼結構材料及其製法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">B01J20/18</main-classification>  
        <further-classification edition="200601120241220B">B01J20/28</further-classification>  
        <further-classification edition="200601120241220B">B01J20/32</further-classification>  
        <further-classification edition="200601120241220B">D01F1/10</further-classification>  
        <further-classification edition="200601120241220B">A61L9/014</further-classification>  
        <further-classification edition="201101120241220B">B82Y30/00</further-classification>  
        <further-classification edition="201101120241220B">B82Y40/00</further-classification>  
        <further-classification edition="200601320241220B">A61L101/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華楙生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA MAO NANO-TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋家嚴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, CHIA-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保留有效成分之核殼結構材料及其製法，使有效成分、比表面積為120m &lt;sup&gt;2&lt;/sup&gt;/g至980m &lt;sup&gt;2&lt;/sup&gt;/g的微奈米孔洞無機質材料，及蒸餾水混合獲得原料組分，再進行水熱處理使有效成分被灌注至微奈米孔洞無機質材料而獲得粉體材料，再以溶膠凝膠法於粉體材料表面形成無機氧化物包覆層，獲得包含有效成分的核殼結構材料，本發明透過高比表面積的微奈米孔洞無機質材料搭配水熱處理及形成無機氧化物包覆層，能讓有機質的有效成分，例如自咖啡渣或茶葉渣中得到的咖啡因、薰衣草中得到的薰衣草萃取物、或艾草得到的艾草萃取物等，穩定存在核殼結構材料中而不易於高溫下散失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a:步驟(a)</p>  
        <p type="p">b:步驟(b)</p>  
        <p type="p">c:步驟(c)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="237" publication-number="202619744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合成胜肽、包含合成胜肽的醫藥組成物及合成胜肽用於治療類澱粉蛋白疾病的用途</chinese-title>  
        <english-title>SYNTHETIC PEPTIDE, PHARMACEUTICAL COMPOSITION COMPRISING SYNTHETIC PEPTIDE, AND USE OF SYNTHETIC PEPTIDE FOR TREATING AMYLOIDOSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K38/16</main-classification>  
        <further-classification edition="200601120250501B">C07K14/435</further-classification>  
        <further-classification edition="200601120250501B">A61P25/00</further-classification>  
        <further-classification edition="200601120250501B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國醫藥大學附設醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA MEDICAL UNIVERSITY HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周德陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, DER-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱紹智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHAO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳美智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仲峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種合成胜肽、包含合成胜肽的醫藥組成物及合成胜肽用於治療類澱粉蛋白疾病的用途。本發明合成胜肽藉由多種功效實驗，達到治療類澱粉蛋白疾病之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a synthetic peptide, a pharmaceutical composition including the synthetic peptide, and a use of the synthetic peptide for treating amyloidosis. The synthetic peptide of the present disclosure achieves the effect of treating amyloidosis through various efficacy experiments.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="238" publication-number="202619858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>修車躺板</chinese-title>  
        <english-title>MECHANIC CREEPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">B25H5/00</main-classification>  
        <further-classification edition="200601120250113B">B60S5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立晏企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖伯霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種修車躺板，其包括：一主體、至少一第一輪組及至少一第二輪組。該主體包含有一第一構件與一第二構件，該第一構件與該第二構件可伸縮地相互連結。該至少一第一輪組設於該第一構件。該至少一第二輪組設於該第二構件。透過該第一構件與該第二構件可伸縮的結構設計，使得該修車躺板可以隨維修人員的身形進行伸縮，進而確實且有效地提供支撐力予不同身長的維修人員。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a mechanic creeper, which includes: a main body, at least a first wheel set and at least a second wheel set. The main body includes a first component and a second component, and the first component and the second component are telescopically connected to each other. The at least one first wheel assembly is provided on the first component. The at least one second wheel assembly is provided on the second component. Through the telescopic structural design of the first member and the second member, the vehicle repair deck can expand and contract according to the body shape of the maintenance personnel, thereby reliably and effectively providing support to maintenance personnel of different heights.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一構件</p>  
        <p type="p">22:第二構件</p>  
        <p type="p">41:第一連結件</p>  
        <p type="p">42:第二連結件</p>  
        <p type="p">43:第三連結件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="239" publication-number="202619907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛拖曳件之製程</chinese-title>  
        <english-title>BUMPER TOW HOOK MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B60D1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台瑞賽車精品有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN RACING PRODUCTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEN YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種車輛拖曳件，其包括：一環鈎體及一連接桿組。該環鈎體係由一框體凹折而成，該環鈎體包含有一穿設部與二擋止部，該穿設部圍構出一穿孔，二該擋止部分別一體凸伸於該穿設部之二側，二該擋止部相互連接以共同形成一勾取部，該勾取部圍構出一勾設孔，該穿孔之開口方向橫向於該勾設孔之開口方向。該連接桿組穿設入該穿孔而與該環鈎體相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a bumper tow hook, which includes: a ring hook body and a connecting rod group. The ring hook system is formed by a concave frame. The ring hook body includes a penetration part and two stop parts. The penetration part surrounds a through hole, and the two stop parts protrude integrally from the through hole. On both sides of the setting portion, the two blocking portions are connected to each other to form a hooking portion. The hooking portion surrounds a hooking hole, and the opening direction of the perforation is transverse to the opening direction of the hooking hole. The connecting rod group is inserted into the through hole and connected with the ring hook body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:環鈎體</p>  
        <p type="p">11:穿設部</p>  
        <p type="p">12:穿孔</p>  
        <p type="p">13:勾取部</p>  
        <p type="p">2:鉚釘</p>  
        <p type="p">52:擋止部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="240" publication-number="202620187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>強韌菌絲結構及其培養方法</chinese-title>  
        <english-title>FIBER STRUCTURE WITH HIGH STRENGTH AND TENACITY AND CULTURE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">C12N1/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人紡織產業綜合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周欣穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HAW-JER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李則緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許惠如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容的一些實施方式提供強韌菌絲結構，包含多孔鏤空支撐載體、培養基布以及菌絲層。多孔鏤空支撐載體，包含支撐骨架以及貫穿該支撐骨架的多個載體孔洞。培養基布設置於多孔鏤空支撐載體上，包含完全鋪設於多孔鏤空支撐載體上的生質型營養纖維以及穿過生質型營養纖維的多個纖維孔洞。菌絲層環繞穿設於載體孔洞以及纖維孔洞中，上下延伸並完全包覆多孔鏤空支撐載體與培養基布，其中各載體孔洞的直徑為10微米至1000微米，並且大於各纖維孔洞。本揭露內容的一些實施方式還提供強韌菌絲結構的培養方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fiber structure with high strength and tenacity is provided in some embodiments of the present disclosure, including: a porous hollow support carrier, a culture cloth and a mycelium layer. The porous hollow support carrier includes a support backbone and a plurality of carrier holes through the support backbone. The culture cloth is disposed on the porous hollow support carrier, including a biogenic nutritional fiber completely paved on the porous hollow support carrier and a plurality of fiber holes through the biogenic nutritional fiber. The mycelium layer surrounds and is disposed in the plurality of carrier holes and the plurality of fiber holes, extends up and down and completely encapsulates the porous hollow support carrier and the culture cloth, in which a diameter of each of the plurality of carrier holes is from 10 μm to 1000 μm, and each of the plurality of carrier holes is larger than each of the plurality of fiber holes. A culture method of a fiber structure with high strength and tenacity is further provided in some embodiments of the present disclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:培養方法</p>  
        <p type="p">S110、S120、S130、S140、S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="241" publication-number="202620821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛故障模擬診斷系統及其使用方法</chinese-title>  
        <english-title>VEHICLE FAULT SIMULATOR DIAGNOSTIC SYSTEM AND USE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241223B">G09B19/16</main-classification>  
        <further-classification edition="201201120241223B">B60W50/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立彰化師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHANGHUA UNIVERSITY OF EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴元隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YUAN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐福龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李依蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種車輛故障模擬診斷系統及其使用方法，所述車輛故障模擬診斷系統包含診斷裝置、輸入裝置及輸出裝置，所述輸入裝置及所述輸出裝置分別與所述診斷裝置電性連接；藉由將所述車輛故障模擬診斷系統串聯設置於車輛系統配線及行車電腦之間，控制所述診斷裝置以模擬各種車輛故障狀況，可供維修技師查修及作為教學使用，以利維修技師可快速判別車輛故障之原因及提升專業能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a vehicle fault simulation diagnostic system and use method thereof. The vehicle fault simulation diagnostic system includes a diagnostic device, an input device and an output device. The input device and the output device are electrically connected to the diagnostic device respectively. By disposing the vehicle fault simulation diagnostic system in series between the wiring of the vehicle system and the driving computer, the diagnostic device is controlled to simulate various vehicle fault conditions, which can be used by maintenance technicians for check, repair and teaching purposes, so that the maintenance technicians can quickly identify the cause of vehicle failures and improve their professional capabilities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛故障模擬診斷系統</p>  
        <p type="p">2:診斷裝置</p>  
        <p type="p">3:輸入裝置</p>  
        <p type="p">4:輸出裝置</p>  
        <p type="p">5:故障模擬控制模組</p>  
        <p type="p">6:中央處理器</p>  
        <p type="p">7:場效電晶體模組</p>  
        <p type="p">8:電壓調整器</p>  
        <p type="p">9:行車電腦插槽</p>  
        <p type="p">10:配線插槽模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="242" publication-number="202620827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250211B">G09G3/32</main-classification>  
        <further-classification edition="200601120250211B">G09G3/00</further-classification>  
        <further-classification edition="202501120250211B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏福呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, FU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括基板、絕緣層、多個第一晶片連接線結構、多個發光元件、失效微晶片以及修復微晶片。絕緣層位於基板之上。第一晶片連接線結構位於絕緣層之上，且從晶片放置區延伸至晶片放置區周圍的多個畫素區中。發光元件分別設置於畫素區之中。失效微晶片位於晶片放置區中。絕緣層橫向地環繞失效微晶片。失效微晶片至少部分連接至第一晶片連接線結構。修復微晶片位於晶片放置區中。修復微晶片通過第一晶片連接線結構電性連接至發光元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate, an insulating layer, first chip connection line structures, light-emitting elements, a failed microchip and a repaired microchip. The insulating layer is located above of the substrate. The first chip connection line structures are located above the insulating layer and extend from a chip placement area to pixel areas around the chip placement area. The light-emitting elements are respectively arranged in the pixel areas. The failed microchip is located in the chip placement area. The insulating layer laterally surrounds the failed microchip. The failed microchip is at least partially connected to the first chip connection line structures. The repair microchip is located in the chip placement area. The repair microchip is electrically connected to the light-emitting elements through the first chip connection line structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:顯示裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:黏著層</p>  
        <p type="p">110A,110B:第一微晶片</p>  
        <p type="p">112,212:主動面</p>  
        <p type="p">113:第一晶片接墊</p>  
        <p type="p">120A:第一晶片連接線結構</p>  
        <p type="p">130:絕緣層</p>  
        <p type="p">132:第一發光二極體接合墊</p>  
        <p type="p">134:第二發光二極體接合墊</p>  
        <p type="p">210:修復微晶片</p>  
        <p type="p">213:第二晶片接墊</p>  
        <p type="p">215:連接結構</p>  
        <p type="p">D1:發光元件</p>  
        <p type="p">ND:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="243" publication-number="202619988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單晶石英材料的加工方法</chinese-title>  
        <english-title>PROCESSING METHOD OF SINGLE-CRYSTAL QUARTZ MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">C03B20/00</main-classification>  
        <further-classification edition="200601120241118B">C30B33/00</further-classification>  
        <further-classification edition="200601120241118B">C30B29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣晶技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TXC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承葦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單晶石英材料的加工方法，包括以下步驟。決定單晶石英材料易產生雙晶之待加工區。使用改質器對單晶石英材料上的待加工區進行改質，使待加工區的加工難度下降。使用加工器在改質後的待加工區對單晶石英材料進行加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing method of single-crystal quartz material includes the following steps. Determining an area to be processed where twin crystals are prone to occur on the single-crystal quartz material. Using a modifier to modify the area to be processed on the single-crystal quartz material, so that processing difficulty of the area to be processed is reduced. Using a processor to process the single-crystal quartz material in a modified area to be processed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S100、S200:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="244" publication-number="202619624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釣魚用沉子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A01K95/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅咸運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅咸運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明釣魚用沉子包含一本體及形成於該本體之外側的複數層狀結構，本體的頂端設有一穿孔，本體的頂端呈錐狀而底端呈弧面狀，且該本體的頂端之寬度小於該本體的底端之寬度，該複數層狀結構由該本體的底端向該本體的頂端延伸且相鄰排列。所述釣魚用沉子用以使釣線之末端綁設的釣鉤下沉，且接觸水底時會發出撞擊聲響而吸引魚類的注意，透過本體之重心低且呈流線型，並具有複數層狀結構的設計，能夠導引水流，降低水阻，達到提升下沉速度的效果，且無須更換所述釣魚用沉子的材質或增加重量，進而有效節省成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:穿孔</p>  
        <p type="p">12:前凹弧部</p>  
        <p type="p">13:後凹弧部</p>  
        <p type="p">20:層狀結構</p>  
        <p type="p">21:峰部</p>  
        <p type="p">22:谷部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="245" publication-number="202620271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有幾何結構的C型鋼的製造方法及其所製造而得的具有幾何結構的C型鋼</chinese-title>  
        <english-title>METHOD OF MANUFACTURING C-SHAPED STEEL WITH GEOMETRIC STRUCTURE AND C-SHAPED STEEL WITH GEOMETRIC STRUCTURE MANUFACTURED THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">E04B1/58</main-classification>  
        <further-classification edition="201001120241128B">E04B1/61</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達豐鐵材行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA FONG STEEL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡永達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUNG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種具有幾何結構的C型鋼的製造方法及其所製造而得的C型鋼，製造方法包含：提供一鋼帶；沿著鋼帶的長邊方向將鋼帶衝壓出複數個條狀溝槽及複數個細切線，其中複數個條狀溝槽以及複數個細切線係穿透於鋼帶，複數個細切線相對於複數個條狀溝槽更為鄰近鋼帶的長邊，且細切線的寬度小於條狀溝槽的寬度；對經衝壓的鋼帶進行滾壓，以獲得中間C型鋼；以及沿著中間C型鋼的短邊方向將中間C型鋼拉寬，使中間C型鋼的複數個條狀溝槽被撐開至一第一預定寬度，以及使複數個細切線被撐開至一第二預定寬度，以獲得具有幾何結構的C型鋼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing C-shaped steel with geometric structure and the C-shaped steel produced therefrom are disclosed. The manufacturing method comprises steps of: providing a steel strip; stamping the steel strip along a direction of a long side of the steel strip to obtain a plurality of strip-shaped grooves and a plurality of fine lines, wherein the plurality of strip-shaped grooves and the plurality of fine lines penetrate the steel strip, and the plurality of fine lines are closer to the long sides of the steel strip than the plurality of strip-shaped grooves, and a width of each of the fine lines is smaller than a width of each of the strip-shaped grooves; rolling the stamped steel strip to obtain a semi-finished C-shaped steel; and stretching the semi-finished C-shaped steel along a direction of a short side of the semi-finished C-shaped steel so that the plurality of strip-shaped grooves are expanded to a first predetermined width, and the plurality of fine lines are expanded to a second predetermined width, so as to obtain a C-shaped steel with geometric structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10至S40:本發明之具有幾何結構的C型鋼的製造方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="246" publication-number="202620969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圓極化天線及通信系統</chinese-title>  
        <english-title>CIRCULARLY POLARIZED ANTENNA AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H01Q21/24</main-classification>  
        <further-classification edition="200601120250303B">H01Q9/06</further-classification>  
        <further-classification edition="200601120250303B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林聖民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種圓極化天線，包括天線部和饋電部，天線部設置於第一基板，天線部包括：第一天線單元，設置於第一基板的頂層；寄生元件，設置於第一基板的中間層；第二天線單元，設置於第一基板的底層；饋電部設置於第二基板，饋電部包括：耦合槽孔，設置於第二基板的頂層；匹配微帶線，設置於第二基板的中間層；饋入線，設置於第二基板的底層；分支線耦合器，設置於第二基板的底層，匹配微帶線通過過孔電連接於饋入線與分支線耦合器之間，通過換層技術加厚基板厚度，優化了天線性能。本發明還提供一種通信系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circularly polarized antenna includes an antenna unit and a feeding unit, and the antenna unit and the feeding unit are stacked up and down; the antenna unit includes a first antenna subunit arranged on a top layer of the first substrate, a parasitic element arranged in a middle layer of the first substrate, and a second antenna subunit arranged on a bottom layer of the first substrate; the feeding unit includes a coupling slot group, arranged on a top layer of the second substrate; a matching microstrip line group, arranged on a middle layer of the second substrate; a feeding line group, arranged on a bottom layer of the second substrate; a branch line coupler, arranged on a bottom layer of the second substrate, wherein the matching microstrip line group is electrically connected between the feeding line group and the branch line coupler through a hole group. The present disclosure further provides a communication system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圓極化天線</p>  
        <p type="p">100:天線部</p>  
        <p type="p">200:饋電部</p>  
        <p type="p">J1:第一基板</p>  
        <p type="p">J2:第二基板</p>  
        <p type="p">T1、T2:頂層</p>  
        <p type="p">M1、M2:中間層</p>  
        <p type="p">B1、B2:底層</p>  
        <p type="p">Ant1:第一天線單元</p>  
        <p type="p">Ant2:第二天線單元</p>  
        <p type="p">P1:寄生元件</p>  
        <p type="p">S:耦合槽孔</p>  
        <p type="p">S1:第一槽孔</p>  
        <p type="p">S2:第二槽孔</p>  
        <p type="p">L:匹配微帶線</p>  
        <p type="p">L1:第一匹配微帶線</p>  
        <p type="p">L2:第二匹配微帶線</p>  
        <p type="p">F:饋入線</p>  
        <p type="p">F1:第一饋入線</p>  
        <p type="p">F2:第二饋入線</p>  
        <p type="p">C:分支線耦合器</p>  
        <p type="p">H1-H4:第一過孔-第四過孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="247" publication-number="202620202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱軋鋼焊接方法</chinese-title>  
        <english-title>WELDING METHOD FOR HOT-ROLLED STEEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">C21D9/46</main-classification>  
        <further-classification edition="200601120241204B">C22C38/54</further-classification>  
        <further-classification edition="200601120241204B">B23K31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王泰翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許閔智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MIN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許登凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱軋鋼焊接方法，包含以下步驟：提供兩熱軋鋼，其中該兩熱軋鋼含有碳為0.18至0.24重量百分比、錳為0.18至0.24重量百分比及硼為0.0005至0.0030重量百分比，或者該兩熱軋鋼的銲接碳當量C.E.大於或等於0.45；對該兩熱軋鋼進行銲接，以形成一銲道；及對該銲道進行一銲道退火處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A welding method for hot-rolled steel is provided. The method includes steps of: providing two hot-rolled steels, wherein each of the two hot-rolled steels contains 0.18 to 0.24 wt.% carbon, 0.18 to 0.24 wt.% manganese, and 0.0005 to 0.0030 wt.% boron, or a welding carbon equivalent C. E. of the two hot-rolled steels is greater than or equal to 0.45; welding the two hot-rolled steels to form a weld run; and performing an annealing treatment on the welding run.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="248" publication-number="202620448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具備多壓塊之半導體封裝構件壓測模組及半導體封裝構件測試設備</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE WORKPRESS MODULE HAVING MULTIPLE PRESSING BLOCKS AND SEMICONDUCTOR PACKAGE TESTING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241204B">G01R31/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂孟恭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MENG-KUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具備多壓塊之半導體封裝構件壓測模組被揭露。具備多壓塊之半導體封裝構件壓測模組包含基座以及多個活動壓塊。基座包括內部腔室及多個開口槽。開口槽連通至內部腔室。活動壓塊容置於基座之開口槽。活動壓塊對應於半導體封裝構件上之不同區域。響應於內部腔室內被充填高壓流體，活動壓塊對該些區域產生下壓力。一種半導體封裝構件測試設備亦被揭露，控制器適於控制流體供應單元以供給高壓流體至基座的內部腔室，並適於透過測試座對半導體封裝構件進行測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package workpress module having multiple pressing blocks is disclosed. The workpress module for a semiconductor package member includes a base and a plurality of movable press blocks. The base includes an internal chamber and a plurality of open slots. The open slots are in communication with the internal chamber. The movable press blocks are received in the open slots of the base. The movable press blocks correspond to areas on the semiconductor package member. In response to the internal chamber being filled with a high-pressure fluid, the movable press blocks generate pressing force toward the areas. A testing device for a semiconductor package is also disclosed, in which a controller is configured to control a fluid supply unit to supply the high-pressure fluid for the internal chamber of the base and configured to perform testing on the semiconductor package member through the testing socket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:具備多壓塊之半導體封裝構件壓測模組</p>  
        <p type="p">3:基座</p>  
        <p type="p">301:上殼體</p>  
        <p type="p">302:下殼體</p>  
        <p type="p">303:密封件</p>  
        <p type="p">304:環形槽</p>  
        <p type="p">31:內部腔室</p>  
        <p type="p">311:第一腔室</p>  
        <p type="p">312:第二腔室</p>  
        <p type="p">32:開口槽</p>  
        <p type="p">321:第一開口槽</p>  
        <p type="p">322:第二開口槽</p>  
        <p type="p">323:徑向延伸部</p>  
        <p type="p">324:軸向貫通部</p>  
        <p type="p">33:固定壓塊</p>  
        <p type="p">4:活動壓塊</p>  
        <p type="p">41:徑向凸緣</p>  
        <p type="p">42:軸向本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="249" publication-number="202620683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>解鎖電路的功能的方法</chinese-title>  
        <english-title>METHOD FOR UNLOCKING A FUNCTION OF A CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250217B">G06F21/70</main-classification>  
        <further-classification edition="201301120250217B">G06F21/60</further-classification>  
        <further-classification edition="202201120250217B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神雲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石智強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種解鎖電路的功能的方法，適用於控制電路，包含:控制電路依據第二金鑰解密已加密的第一資料。第二金鑰是依據第一金鑰產生。第一資料是依據第一金鑰加密。控制電路比對解密後的第一資料及儲存於控制電路的第二資料；及當控制電路比對解密後的第一資料及第二資料的結果為相符，控制電路解鎖控制電路的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for unlocking a function of a circuit, applicable to a control circuit, comprising: decrypting, by the control circuit, encrypted first data using a second key, wherein the second key is generated based on a first key, and the first data is encrypted using the first key; comparing, by the control circuit, the decrypted first data with second data stored in the control circuit; and unlocking, by the control circuit, a function of the control circuit when the result of the comparison between the decrypted first data and the second data is consistent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S051~S054:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="250" publication-number="202619756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療用袋的閥裝置</chinese-title>  
        <english-title>VALVE DEVICE FOR A MEDICAL BAG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61M39/22</main-classification>  
        <further-classification edition="200601120241130B">A61M1/00</further-classification>  
        <further-classification edition="200601120241130B">A61F5/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾傑科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALGER TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辜雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, YA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜國賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, GUO-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種醫療用袋的閥裝置，其設置於醫療用袋的底端，閥裝置包括一連接件與一切換件。連接件具有一第一安裝部及一自第一安裝部延伸出的導流管，導流管連通設置於醫療用袋；切換件具有一第二安裝部及一自第二安裝部延伸出的排液管，第二安裝部設於第一安裝部，使切換件相對連接件於一開啟位置及一關閉位置之間旋轉；當在關閉位置時，導流管與排液管不連通，排液管相對導流管呈上揚狀，避免排液管誤觸到地面或是外界異物，防止感染問題發生。而在開啟位置時，導流管與排液管連通，以供排放醫療用袋的液體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a valve device for a medical bag, positioned at the bottom end of the medical bag. The valve device includes a connector and a switching member. The connector has a first mounting portion and a flow guide tube extending from the first mounting portion, with the flow guide tube in communication with the medical bag. The switching member has a second mounting portion and a drainage tube extending from the second mounting portion. The second mounting portion is positioned on the first mounting portion, allowing the switching member to rotate relative to the connector between an open position and a closed position. In the closed position, the flow guide tube and the drainage tube are not connected, and the drainage tube is angled upwards relative to the flow guide tube to prevent the drainage tube from accidentally touching the ground or external objects, thus preventing infection issues. In the open position, the flow guide tube and the drainage tube are connected to allow the liquid in the medical bag to be discharged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:閥裝置</p>  
        <p type="p">10:連接件</p>  
        <p type="p">11:第一安裝部</p>  
        <p type="p">12:導流管</p>  
        <p type="p">20:切換件</p>  
        <p type="p">21:第二安裝部</p>  
        <p type="p">22:排液管</p>  
        <p type="p">200:醫療用袋</p>  
        <p type="p">201:限位部</p>  
        <p type="p">202:限位槽</p>  
        <p type="p">203:開放端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="251" publication-number="202620560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量測標準平板並補償空間精度系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR MEASURING STANDARD FLAT PLATE AND COMPENSATING SPATIAL ACCURACY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G05B19/404</main-classification>  
        <further-classification edition="200601120241231B">G01B11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覺文郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JYWE, WEN-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張祐維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾政中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, JHENG-JHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳晨仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種量測標準平板並補償空間精度系統及其方法。該系統包括一工具機，包括一工作台、一主軸及一控制器，該主軸位於該工作台的正上方，該控制器設置在該工具機上並電性連接該工作台及該主軸；一標準平板，固定在該工作台上，並設置有多個球形透鏡；一感測頭模組，固定在該主軸的一刀把上，設置有中央形成一量測點的一感測器組，各該球形透鏡移動至該量測點以量測一偏移程度；及一訊號處理模組，可拆卸地設置在該工具機外，並有線或無線訊號連接該感測頭模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a system and method for measuring standard flat plate and compensating spatial accuracy. The system involves a machine tool, including a workbench, a spindle and a controller, the spindle is located directly above the workbench, and the controller is provided on the machine tool and electrically connected to the workbench and the spindle; a standard flat plate, fixed on the workbench and provided with multiple spherical lenses; a sensor head module, fixed on a tool handle of the spindle and provided with a sensor group forming a measuring point in the center, each spherical lens moves to the measurement point to measure a degree of deflection; and a signal processing module, detachably installed outside the machine tool and connected to the sensing head module through wired or wireless signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工具機</p>  
        <p type="p">11:底座</p>  
        <p type="p">12:滑座</p>  
        <p type="p">13:搖擺座</p>  
        <p type="p">14:工作台</p>  
        <p type="p">15:立柱</p>  
        <p type="p">16:主軸</p>  
        <p type="p">17:主軸頭</p>  
        <p type="p">171:刀把</p>  
        <p type="p">18:控制器</p>  
        <p type="p">20:標準平板</p>  
        <p type="p">30:感測頭模組</p>  
        <p type="p">40:訊號處理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="252" publication-number="202620866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體內運算系統及其SRAM陣列</chinese-title>  
        <english-title>IN-MEMORY COMPUTING SYSTEM AND SRAM ARRAY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">G11C11/417</main-classification>  
        <further-classification edition="200601120250207B">G11C11/54</further-classification>  
        <further-classification edition="200601120250207B">G11C7/12</further-classification>  
        <further-classification edition="200601120250207B">G11C7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王朝欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅証耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童　凱霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOLENTINO, LEAN KARLO SANTOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯志穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, JHIH-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑　弗里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALLING, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體內運算系統之SRAM陣列具有SRAM單元及預放電電晶體，SRAM單元具有電晶體對、傳輸電晶體、上拉電晶體、防擾動電晶體，電晶體對具有第一電晶體及第二電晶體，第一電晶體及第二電晶體接收該電源電壓並電性連接該儲存節點及該反儲存節點，傳輸電晶體電性連接該反儲存節點及傳輸節點，該上拉電晶體接收該電源電壓並電性連接該傳輸節點，該防擾動電晶體電性連接該傳輸節點及反位元節點，該放電電晶體電性連接該儲存節點、該反儲存節點及接地端，該預放電電晶體電性連接反位元節點及該接地端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An SRAM array of an in-memory computing system includes SRAM cells and pre-discharge transistors. The SRAM cells have a transistor pair, transmission transistors, pull-up transistors, and disturbance prevention transistors. The transistor pair consists of a first transistor and a second transistor. The first transistor and the second transistor receive the supply voltage and are electrically connected to the storage node and the complementary storage node. The transmission transistor is electrically connected to the complementary storage node and the transmission node. The pull-up transistor receives the supply voltage and is electrically connected to the transmission node. The disturbance prevention transistor is electrically connected to the transmission node and the complementary bit node. The discharge transistor is electrically connected to the storage node, the complementary storage node, and the ground terminal. The pre-discharge transistor is electrically connected to the complementary bit node and the ground terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:SRAM陣列</p>  
        <p type="p">111:SRAM單元</p>  
        <p type="p">111a:電晶體對</p>  
        <p type="p">112:預放電電晶體</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">M&lt;sub&gt;n1&lt;/sub&gt;:傳輸電晶體</p>  
        <p type="p">M&lt;sub&gt;n2&lt;/sub&gt;:防擾動電晶體</p>  
        <p type="p">M&lt;sub&gt;n3&lt;/sub&gt;:放電電晶體</p>  
        <p type="p">M&lt;sub&gt;n4&lt;/sub&gt;:第一電晶體</p>  
        <p type="p">M&lt;sub&gt;n5&lt;/sub&gt;:第二電晶體</p>  
        <p type="p">M&lt;sub&gt;p1&lt;/sub&gt;:上拉電晶體</p>  
        <p type="p">Q:儲存節點</p>  
        <p type="p">Qb:反儲存節點</p>  
        <p type="p">WLO:本地位元線訊號</p>  
        <p type="p">WA:寫入訊號</p>  
        <p type="p">WL:字元線訊號</p>  
        <p type="p">N&lt;sub&gt;c&lt;/sub&gt;:傳輸節點</p>  
        <p type="p">BLBx:反位元節點</p>  
        <p type="p">preD:預放電控制訊號</p>  
        <p type="p">BLx:位元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="253" publication-number="202619909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電槍及充電設備</chinese-title>  
        <english-title>CHARGING GUN AND CHARGING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241230B">B60L53/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐浩淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充電槍及充電設備，充電槍包括殼體、充電頭、及發光件，殼體內開設有安裝腔，所述安裝腔供連接線穿過，所述連接線的一端電連接於一供電裝置；充電頭可拆卸地連接於所述殼體的一端，所述充電頭與所述連接線的另一端電連接；發光件連接於所述充電頭，所述發光件位於所述安裝腔內，所述充電頭被配置為將所述發光件發出的光線引導至所述充電頭外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to charging gun and charging equipment. The charging gun comprises a shell, a charging head, and a light-emitting part. The shell is provided with a mounting chamber. The mounting chamber is provided for connecting wire to pass through, and one end of the connecting wire is electrically connected with a power supply device. The charging head is detachable connected with one end of the shell, and the charging head is electrically connected with the other end of the connecting wire. The light-emitting part is connected to the charging head, the light-emitting part is located in the mounting chamber, and the charging head is configured to guide the light emitted by the light-emitting part to the outside of the charging head.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:充電槍</p>  
        <p type="p">10:殼體</p>  
        <p type="p">11:第一殼部</p>  
        <p type="p">12:第二殼部</p>  
        <p type="p">14:按鍵結構</p>  
        <p type="p">20:充電頭</p>  
        <p type="p">30:連接線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="254" publication-number="202620823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">G09G3/20</main-classification>  
        <further-classification edition="200601120250114B">G09G5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宜宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鴻光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HONG-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂璨朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSAN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含：一基板；一掃描線，設置於該基板上且用於輸出一第一訊號；一第一數據線，設置於該基板上且與該掃描線交錯，其中，該第一數據線用於輸出一第二訊號；一第一子像素，設置於該基板上，其中，該第一子像素接收該第一訊號和該第二訊號；以及一第二子像素，設置於該基板上，其中，該第二子像素接收該第一訊號和該第二訊號；其中，該第一子像素的顏色與該第二子像素的顏色相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which comprises: a substrate; a scan line disposed on the substrate and used to output a first signal; a first data line disposed on the substrate and intersecting with the scan line, wherein the first data line is used to output a second signal; a first sub-pixel disposed on the substrate, wherein the first sub-pixel receives the first signal and the second signal; and a second sub-pixel disposed on the substrate, wherein the second sub-pixel receives the first signal and the second signal; wherein the a color of the first sub-pixel is the same as a color of the second sub-pixel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2、21:掃描線</p>  
        <p type="p">21A:第一部分</p>  
        <p type="p">21B:第二部分</p>  
        <p type="p">3:數據線</p>  
        <p type="p">31:第一數據線</p>  
        <p type="p">31A:第三部分</p>  
        <p type="p">31B:第四部分</p>  
        <p type="p">32:第二數據線</p>  
        <p type="p">32A:第五部分</p>  
        <p type="p">32B:第六部分</p>  
        <p type="p">33:第三數據線</p>  
        <p type="p">33A:第七部分</p>  
        <p type="p">33B:第八部分</p>  
        <p type="p">4:子像素</p>  
        <p type="p">41:第一子像素</p>  
        <p type="p">42:第二子像素</p>  
        <p type="p">43:第三子像素</p>  
        <p type="p">44:第四子像素</p>  
        <p type="p">e1、e2:邊緣</p>  
        <p type="p">D1:第一驅動元件</p>  
        <p type="p">D2:第二驅動元件</p>  
        <p type="p">TFT:電晶體</p>  
        <p type="p">L1:長度</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="255" publication-number="202620822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高色彩純度的顯示裝置及其色轉換結構</chinese-title>  
        <english-title>DISPLAY DEVICE WITH HIGH COLOR PURITY AND COLOR CONVERSION STRUCTURE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G09F9/33</main-classification>  
        <further-classification edition="200601120241204B">G02B5/20</further-classification>  
        <further-classification edition="201501120241204B">G02B1/111</further-classification>  
        <further-classification edition="200601120241204B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏齊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARVATEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZONG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡育昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧薪亦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HSIN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘錫明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, SHYI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊峰輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, FENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具有高色彩純度的顯示裝置及其色轉換結構。該色轉換結構用於對一藍光基板發出的光進行轉換，且該色轉換結構包括一色轉換層、一第一濾光層及一第二濾光層。該色轉換層包括一藍光透射區域、一綠色轉換區域及一紅色轉換區域，該第一濾光層設置於該色轉換層上，且該第一濾光層包括位置對應於該藍光透射區域的另一藍光透射區域，該第二濾光層設置於該第一濾光層上。該第一濾光層與該第二濾光層可過濾不同比例的藍光，以提升紅光和綠光的色純度，同時保證藍光的亮度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device with high color purity and a color conversion structure thereof are provided. The color conversion structure is configured to convert light emitted by a blue light panel. The color conversion structure includes a color conversion layer, a first filtering layer, and a second filtering layer. The color conversion layer includes a blue light permeable region, a green conversion region, and a red conversion region. The first filtering layer is disposed on the color conversion layer, and includes another blue light permeable region that corresponds in position to the blue light permeable region. The second filtering layer is disposed on the first filtering layer. The first filtering layer and the second filtering layer can filter different percentages of blue light, so as to improve the color purity of red light and green light as well as ensuring the brightness of blue light.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Z:顯示裝置</p>  
        <p type="p">1:藍光基板</p>  
        <p type="p">11:第一藍光發射元件</p>  
        <p type="p">110:發光面</p>  
        <p type="p">12:第二藍光發射元件</p>  
        <p type="p">120:發光面</p>  
        <p type="p">13:第三藍光發射元件</p>  
        <p type="p">130:發光面</p>  
        <p type="p">2:色轉換結構</p>  
        <p type="p">21:色轉換層</p>  
        <p type="p">211:藍光透射區域</p>  
        <p type="p">212:綠色轉換區域</p>  
        <p type="p">213:紅色轉換區域</p>  
        <p type="p">214:黑色矩陣</p>  
        <p type="p">22:第一濾光層</p>  
        <p type="p">221:藍光透射區域</p>  
        <p type="p">222:第一藍光阻隔區域</p>  
        <p type="p">23:第二濾光層</p>  
        <p type="p">231:第二藍光阻隔區域</p>  
        <p type="p">231A:厚層區域</p>  
        <p type="p">231B:薄層區域</p>  
        <p type="p">24:圖案化金屬層</p>  
        <p type="p">241:金屬間隔物</p>  
        <p type="p">3:透明蓋板</p>  
        <p type="p">300:內表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="256" publication-number="202619814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼捲表面粗糙度的控制方法</chinese-title>  
        <english-title>METHOD FOR CONTROLLING SURFACE ROUGHNESS OF STEEL COIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B21B45/00</main-classification>  
        <further-classification edition="201201120241204B">G06Q50/04</further-classification>  
        <further-classification edition="201901120241204B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禹州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鋼捲表面粗糙度的控制方法，由處理裝置執行且包含取得數顆歷史鋼捲各自之歷史基本資料及歷史生產製程資料，以作為模型訓練集，其中歷史生產製程資料包含軋延裝置對此些歷史鋼捲軋延時所應用的數顆歷史軋延參數；以及運用表面粗糙度演算法基於模型訓練集訓練人工智慧模型為鋼捲表面粗糙度模型，使鋼捲表面粗糙度模型依據實際鋼捲之實際基本資料及實際生產製程資料計算實際鋼捲的表面粗糙度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for controlling surface roughness of steel coil, which is performed by a processing device and includes obtaining historical basic data and historical production process data of several historical steel coils as a model training set, in which the historical production process data include several historical rolling parameters applied by a rolling device to the historical steel coils; and using a surface roughness algorithm to train an artificial intelligence model as a steel coil surface roughness model based on the model training set, so that the steel coil surface roughness model can calculate surface roughness of an actual steel coil based on an actual basic data and an actual production process data of the actual steel coil.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鋼捲表面粗糙度的控制方法</p>  
        <p type="p">110:模型建立步驟</p>  
        <p type="p">111,112:步驟</p>  
        <p type="p">120:實際應用步驟</p>  
        <p type="p">121,122:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="257" publication-number="202620432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微型化層疊式封裝之測試插座及其測試探針</chinese-title>  
        <english-title>MINIATURE STACKED PACKAGE TEST SOCKET AND ITS TEST PROBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G01R1/04</main-classification>  
        <further-classification edition="200601120241127B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳崨科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JG TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉柏榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡正榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之微型化層疊式封裝之測試插座及其測試探針，包括：第一測試基座，凹設有第一插槽，該第一插槽中央位置容設複數單動探針，該第一測試基座之槽壁朝該複數單動探針的方向延伸第一抵設部及第二抵設部，該第一抵設部高度表面設有導板，該第二抵設部鄰靠該複數單動探針，該導板之厚度為1.45mm；第二測試基座，具有插設於該第一測試基座之第一插槽的第二插部，該第二插部具有與該第一測試基座之複數單動探針相對應之複數單動探針，各單動探針之總長度介於1.4mm至2mm之間，且該第二插部底部對應該第一抵設部及該第二抵設部具有第一抵靠部及第二抵靠部，該第一抵靠部與容置空間之間的厚度為0.6mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The miniaturized stacked package test socket and its test probe of the present invention include: a first test base, a first slot is recessed, and a plurality of single-action probes are accommodated in the center of the first slot. A groove wall of a test base extends a first resisting portion and a second resisting portion toward the direction of the plurality of single-action probes. The height surface of the first resisting portion is provided with a guide plate, and the second resisting portion is adjacent to the A plurality of single-action probes, the thickness of the guide plate is 1.45mm; the second test base has a second plug part inserted into the first slot of the first test base, the second plug part has a plurality of single-action probes corresponding to a plurality of single-action probes of a test base, the total length of each single-action probe is between 1.4mm and 2 mm, and the bottom of the second insertion part corresponds to the first resistance part And the second resisting part has a first resisting part and a second resisting part, and the thickness between the first resisting part and the accommodation space is 0.6 mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一測試基座</p>  
        <p type="p">10、24:單動探針</p>  
        <p type="p">11:第一抵設部</p>  
        <p type="p">12:第二抵設部</p>  
        <p type="p">13:導板</p>  
        <p type="p">14:第一插槽</p>  
        <p type="p">15:負載板</p>  
        <p type="p">2:第二測試基座</p>  
        <p type="p">20:第一抵靠部</p>  
        <p type="p">21:第二抵靠部</p>  
        <p type="p">22:容置空間</p>  
        <p type="p">23:轉接板</p>  
        <p type="p">25:第二插部</p>  
        <p type="p">3:積體電路元件測試機台</p>  
        <p type="p">4:吸嘴軸</p>  
        <p type="p">5:晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="258" publication-number="202619792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環烷型胺基硬化劑連續製備的反應系統及其製備的方法</chinese-title>  
        <english-title>REACTION SYSTEM FOR CONTINUOUS PREPARATION OF NAPHTHENIC AMINE-BASED HARDENER AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">B01J19/00</main-classification>  
        <further-classification edition="200601120241205B">C07C209/72</further-classification>  
        <further-classification edition="200601120241205B">C07C211/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳榮祖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNG-TSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種環烷型胺基硬化劑連續製備的反應系統及其製備的方法。系統包含微通道反應器模組、漿料入料單元及氫氣供應單元。漿料入料單元用以提供漿料至微通道反應器模組。漿料包含原料、溶劑、觸媒，且原料為4,4’-二氨基二苯甲烷（MDA）。氫氣供應單元用以提供氫氣至微通道反應器模組，以與漿料進行氣-液接觸，並進行氫化反應，以形成包含4,4’-二氨基-二環己基甲烷（PACM）的產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a reaction system for the continuous preparation of a naphthenic amine-based hardener and a preparation method thereof. The reaction system includes a microchannel reactor module, a slurry feeding unit, and a hydrogen supply unit. The slurry feeding unit is used to supply slurry to the microchannel reactor module. The slurry includes a raw material, a solvent, and a catalyst, where the raw material is 4,4’-methylene dianiline (MDA). The hydrogen supply unit provides hydrogen to the microchannel reactor module for gas-liquid contact with the slurry, facilitating a hydrogenation reaction to form a product containing 4,4’-diamino dicyclohexyl methane (PACM).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:環烷型胺基硬化劑連續製備的反應系統</p>  
        <p type="p">MR:微通道反應器模組</p>  
        <p type="p">MR1:第一微通道單元</p>  
        <p type="p">MR11:第一微通道</p>  
        <p type="p">MR2:第二微通道單元</p>  
        <p type="p">MR21:第二微通道</p>  
        <p type="p">MR3:第三微通道單元</p>  
        <p type="p">MR31:第三微通道</p>  
        <p type="p">1:漿料入料單元</p>  
        <p type="p">11:漿料預混單元</p>  
        <p type="p">12:漿料儲料單元</p>  
        <p type="p">2:氫氣供應單元</p>  
        <p type="p">3:產物暫存單元</p>  
        <p type="p">4:產物過濾單元</p>  
        <p type="p">5:產物收集單元</p>  
        <p type="p">FS:漿料</p>  
        <p type="p">Fg:氫氣</p>  
        <p type="p">P’:粗產物</p>  
        <p type="p">P:產物</p>  
        <p type="p">R:迴流觸媒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="259" publication-number="202620358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管路導引模組、液冷裝置及資料處理系統</chinese-title>  
        <english-title>PIPELINE GUIDING MODULE, LIQUID COOLING DEVICE AND DATA PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">F28F1/12</main-classification>  
        <further-classification edition="200601120241127B">F28D5/00</further-classification>  
        <further-classification edition="200601120241127B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡兆言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHAO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種管路導引模組，包含一基座、一浮動件以及一第一彈性件。基座具有一容置孔以及一第一限位結構。浮動件可浮動地設置於容置孔中。第一彈性件沿容置孔之一軸向設置，且夾置於第一限位結構與浮動件之間。管路導引模組可應用於液冷裝置及資料處理系統，以抵銷管路彎曲應力，避免管路與接頭的連接處產生洩漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pipeline guiding module includes a base, a floating member and a first elastic member. The base has an accommodating hole and a first restraining structure. The floating member is floatingly disposed in the accommodating hole. The first elastic member is disposed along an axial direction of the accommodating hole and sandwiched between the first restraining structure and the floating member. The pipeline guiding module may be applied to a liquid cooling device and a data processing system to offset a bending stress of a pipeline and avoid leakage at a connection between the pipeline and a joint.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">162:管路導引模組</p>  
        <p type="p">1620:基座</p>  
        <p type="p">1620a,1620b:固定塊</p>  
        <p type="p">1622:浮動件</p>  
        <p type="p">1624:第一彈性件</p>  
        <p type="p">1630:固定件</p>  
        <p type="p">16200:容置孔</p>  
        <p type="p">16202:第一限位結構</p>  
        <p type="p">16206:擋板</p>  
        <p type="p">16224:第二管路接頭</p>  
        <p type="p">X,Z:徑向</p>  
        <p type="p">Y:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="260" publication-number="202620824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示驅動裝置以及其供應電壓的產生方法</chinese-title>  
        <english-title>DISPLAY DRIVING DEIVCE AND SUPPLY VOLTAGE GENERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">G09G3/20</main-classification>  
        <further-classification edition="201301120250113B">G06F3/038</further-classification>  
        <further-classification edition="200601120250113B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奕力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILI TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁嘉碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIA-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示驅動裝置以及其供應電壓的產生方法被提出。顯示驅動裝置包括控制電路以及電壓產生電路。控制電路根據時序控制資訊來判斷顯示驅動裝置的負載狀態，並根據負載狀態來產生指標信號。電壓產生電路根據參考電壓以產生供應電壓。電壓產生電路根據指標信號，透過抬升參考電壓的電壓值來抬升供應電壓的電壓值，或者，電壓產生電路根據指標信號來抬升工作電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display driving device and a supply voltage generating method thereof are provided. The display driving device includes a control circuit and a voltage generating circuit. The control circuit determines a load state of the display driving device according to timing sequential control information, and generates an indication signal according to the load state. The voltage generating circuit generates a supply voltage according to a reference voltage. The voltage generating circuit rises a voltage value of the reference voltage to rise a voltage value of the supply voltage according to the indication signal, or the voltage generating circuit rises a working current according to the indication signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示驅動裝置</p>  
        <p type="p">110:控制電路</p>  
        <p type="p">120:電壓產生電路</p>  
        <p type="p">FG:指標信號</p>  
        <p type="p">VDI:顯示影像資料</p>  
        <p type="p">VSUP:供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="261" publication-number="202620121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高氯含量透明阻燃板材及其聚氯乙烯組成物</chinese-title>  
        <english-title>TRANSPARENT FLAME-RETARDANT PLATE HAVING HIGH CHLORINE CONTENT AND POLYVINYL CHLORIDE COMPOSITION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241122B">C08L27/06</main-classification>  
        <further-classification edition="200601120241122B">C08K5/521</further-classification>  
        <further-classification edition="200601120241122B">C08K3/22</further-classification>  
        <further-classification edition="200601120241122B">C09K21/14</further-classification>  
        <further-classification edition="200601120241122B">C09K21/08</further-classification>  
        <further-classification edition="200601120241122B">B32B27/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉騏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, CI-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種高氯含量透明阻燃板材，是由一聚氯乙烯組成物所製成，該聚氯乙烯組成物包含100重量份之一聚氯乙烯原料組分、0.1至1重量份之至少一成碳劑以及2至5重量份之至少一熱穩定劑。該聚氯乙烯原料組分包含一聚氯乙烯原料及一氯化聚氯乙烯原料，且該聚氯乙烯原料與該氯化聚氯乙烯原料的含量比為1:1.22至1:4。因此，該高氯含量透明阻燃板材具有52%至60%的一氯含量、不小於60%的一透光度及不大於10%的一霧度，並且在5 mm之厚度條件下具有根據FM4910標準之小於6的火焰延燒指數（FPI）及小於0.4的發煙指數（SDI）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent flame-retardant plate having a high chlorine content is made of a polyvinyl chloride composition that includes 100 parts by weight of a polyvinyl chloride raw material component, 0.1 to 1 part by weight of at least one carbon forming agent, and 2 to 5 parts by weight of at least one heat stabilizer. The polyvinyl chloride raw material component includes a polyvinyl chloride raw material and a chlorinated polyvinyl chloride raw material in a content ratio of 1:1.22 to 1:4. Therefore, the transparent flame-retardant plate has a chlorine content from 52% to 60%, a transmittance of not less than 60%, and a haze of not more than 10%, and has a fire propagation index (FPI) of less than 6 and a smoke damage index (SDI) of less than 0.4 according to the FM4910 standard under the condition of having a thickness of 5 mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3:製作方法步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="262" publication-number="202621267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向及單向垂直式溝槽瞬態電壓抑制器</chinese-title>  
        <english-title>BIDIRECTIONAL AND UNIDIRECTIONAL VERTICAL-TRENCH TRANSIENT VOLTAGE SUPPRESSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D8/80</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源芯半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IPU SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳梓誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種雙向及單向垂直式溝槽瞬態電壓抑制器。雙向垂直式溝槽瞬態電壓抑制器包括電壓抑制元件、第一隔離結構、第二隔離結構及第三隔離結構。每一電壓抑制元件包括半導體基板、磊晶層、阱層、第一埋層、第一摻雜區、觸發摻雜區及第二摻雜區。磊晶層設置在半導體基板上且表面定義有相鄰的第一區域及第二區域。阱層形成在磊晶層中，且將磊晶層分隔為第一子磊晶層及第二子磊晶層。第一埋層嵌合於半導體基板及磊晶層之間。第一摻雜區及觸發摻雜區形成在第一子磊晶層中。第二摻雜區形成在第二子磊晶層中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bidirectional vertical-trench transient voltage suppressor and a unidirectional vertical-trench transient voltage suppressor are provided. The bidirectional vertical trench transient voltage suppressor includes a voltage suppression element, a first isolation structure, a second isolation structure and a third isolation structure. Each voltage suppression element includes a semiconductor substrate, an epitaxial layer, a well layer, a first buried layer, a first doping region, a trigger doping region and a second doping region. The epitaxial layer is disposed on the semiconductor substrate and has adjacent first and second regions defined on a surface thereof. The well layer is formed in the epitaxial layer and separates the epitaxial layer into a first sub-epitaxial layer and a second sub-epitaxial layer. The first buried layer is embedded between the semiconductor substrate and the epitaxial layer. The first doping region and the trigger doping region are formed in the first sub-epitaxial layer. The second doped region is formed in the second sub-epitaxial layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙向垂直式溝槽瞬態電壓抑制器</p>  
        <p type="p">T1:電壓抑制元件</p>  
        <p type="p">EP1:磊晶層</p>  
        <p type="p">EP11:第一子磊晶層</p>  
        <p type="p">EP12:第二子磊晶層</p>  
        <p type="p">W1:阱層</p>  
        <p type="p">TC1:第一隔離結構</p>  
        <p type="p">TC2:第二隔離結構</p>  
        <p type="p">D11:第一摻雜區</p>  
        <p type="p">D12:第二摻雜區</p>  
        <p type="p">Dt:觸發摻雜區</p>  
        <p type="p">TC3:第三隔離結構</p>  
        <p type="p">TC31:第一子隔離結構</p>  
        <p type="p">TC32:第二子隔離結構</p>  
        <p type="p">X,Y:方向</p>  
        <p type="p">A-A,B-B:剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="263" publication-number="202620844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>語音辨識系統與相關的語音辨識方法</chinese-title>  
        <english-title>SPEECH RECOGNITION SYSTEMS AND RELATED SPEECH RECOGNITION METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250205B">G10L17/14</main-classification>  
        <further-classification edition="201301120250205B">G10L15/28</further-classification>  
        <further-classification edition="201301120250205B">G10L25/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙盈盈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, YING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種語音辨識系統，其包含有處理電路與記憶體。該處理電路用以執行：分別接收多個聲音訊號；分別對該多個聲音訊號進行時域至頻域的轉換操作以產生多個頻域訊號；使用一形態學濾波器來分別對該多個頻域訊號進行濾波操作以產生多個濾波後背景圖；根據該多個濾波後背景圖以分別產生多個初始語音指紋，其中該多個初始語音指紋中的每一個初始語音指紋包含了所對應之該濾波後背景圖中多個峰值所對應的時間與頻點；根據該多個初始語音指紋以產生至少一語音指紋；以及將該至少一語音指紋儲存於該記憶體中，以供進行語音辨識使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a speech recognition system, which includes a processing circuit and a memory. The processing circuit is configured to perform the steps of: respectively receive multiple sound signals; perform time domain to frequency domain conversion operations on the multiple sound signals to generate multiple frequency domain signals; use a morphological filter to respectively filter the multiple frequency domain signals to generate multiple filtered backgrounds; generating multiple initial voice fingerprints according to the multiple filtered backgrounds, respectively, wherein each of the multiple initial voice fingerprints includes times and frequencies corresponding to multiple peaks in the filtered backgrounds; generating at least one voice fingerprint according to the multiple initial voice fingerprints; and storing the at least one voice fingerprint in the memory for speech recognition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200~212:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="264" publication-number="202619912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於認證的控制裝置以及操作方法</chinese-title>  
        <english-title>CONTROL DEVICE AND OPERATING METHOD FOR CERTIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250303B">B60L53/60</main-classification>  
        <further-classification edition="201901120250303B">B60L53/10</further-classification>  
        <further-classification edition="201901120250303B">B60L53/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於認證的控制裝置以及操作方法。控制裝置包括連接端、傳輸端、第一開關、第二開關、控制器以及訊號處理電路。連接端傳輸近接導引訊號。傳輸端傳輸虛擬近接導引訊號。虛擬近接導引訊號在設定參數範圍內。第一開關耦接於連接端與傳輸端之間。第二開關的第一端耦接於連接端。控制器耦接於第二開關的第二端。控制器響應於設定參數範圍內的近接導引訊號導通第二開關並斷開第一開關以進入第一狀態。訊號處理電路在第一狀態接收設定參數範圍內的虛擬近接導引訊號，將虛擬近接導引訊號轉換為溝通資料，並將溝通資料提供至控制器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control device and an operating method for certification are provided. The control device includes a connection terminal, a transmission terminal, a first switch, a second switch, a controller and a signal processing circuit. The connecting terminal transmits a proximity pilot signal. The transmission terminal transmits a virtual proximity pilot signal. The virtual proximity pilot signal is within a setting parameter range. The first switch is coupled between the connection terminal and the transmission terminal. A first end of the second switch is coupled to the connection terminal. The controller is coupled to a second end of the second switch. The controller turns on the second switch and turns off the first switch in response to a proximity pilot signal within the setting parameter range to enter a first state. The signal processing circuit receives the virtual proximity pilot signal within the setting parameter range in the first state, converts the virtual proximity pilot signal into a communication data, and provides the communication data to the controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:控制裝置</p>  
        <p type="p">110:控制器</p>  
        <p type="p">120:訊號處理電路</p>  
        <p type="p">DD:識別碼</p>  
        <p type="p">EVH:電動載具</p>  
        <p type="p">P1:連接端</p>  
        <p type="p">P2:傳輸端</p>  
        <p type="p">PP1:近接導引端</p>  
        <p type="p">SN1:第一溝通資料</p>  
        <p type="p">SN2:第二溝通資料</p>  
        <p type="p">SPP:近接導引訊號</p>  
        <p type="p">SPP1:第一虛擬近接導引訊號</p>  
        <p type="p">SPP2:第二虛擬近接導引訊號</p>  
        <p type="p">SW1、SW2:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="265" publication-number="202620477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導光裝置及近眼顯示器</chinese-title>  
        <english-title>LIGHT GUIDE DEVICE AND NEAR-EYE DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G02B6/10</main-classification>  
        <further-classification edition="200601120241127B">G02B27/44</further-classification>  
        <further-classification edition="200601120241127B">G02B27/28</further-classification>  
        <further-classification edition="200601120241127B">G02B27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅翊戩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導光裝置，包含導光板、繞射光柵以及相位延遲元件。繞射光柵配置於導光板的第一表面上。當光束入射繞射光柵，繞射光柵適於產生多個繞射光束。該些繞射光束包括主繞射光束，主繞射光束在導光板內傳遞。相位延遲元件配置於主繞射光束的傳遞路徑上。主繞射光束在入射相位延遲元件前具有第一偏振態，主繞射光束在離開相位延遲元件時具有第二偏振態，第一偏振態與第二偏振態不同。一種近眼顯示器亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light guide device including a light guide plate, a diffraction grating and a phase delay element is provided. The diffraction grating is disposed on a first surface of the light guide plate. The diffraction grating is used to provide a plurality of diffraction beams, while a light beam is incident to the diffraction grating. The diffraction beams include a main diffraction beam, and the main diffraction beam propagates in the light guide plate. The phase delay element is disposed on a path of the main diffraction beam. The main diffraction beam has a first polarization state before being incident to the phase delay element. The main diffraction beam has a second polarization state when leaving the phase delay element. The first polarization state is different from the second polarization state. A near-eye display is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導光裝置</p>  
        <p type="p">100A:繞射光柵</p>  
        <p type="p">200:導光板</p>  
        <p type="p">201、202:表面</p>  
        <p type="p">300A:相位延遲元件</p>  
        <p type="p">L:光束</p>  
        <p type="p">L1:主繞射光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="266" publication-number="202619847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力棘輪扳手頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">B25B13/46</main-classification>  
        <further-classification edition="201201120250114B">F16H57/022</further-classification>  
        <further-classification edition="200601120250114B">F16H1/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨動力氣動股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江旭環</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種動力棘輪扳手頭，包括有一外殼、一齒輪組、一曲柄組及一棘輪組，該外殼設有一鎖固部，該齒輪組設有一鎖固環、一齒環及一行星齒輪座，該鎖固環與該外殼相結合且設有一前鎖合部及一後鎖合部，該前鎖合部設於該鎖固環鄰近前端的內表面且與該鎖固部相結合，該後鎖合部設於該鎖固環鄰近後端的內表面且與該前鎖合部相間隔設置，該齒環與該鎖固環相結合且於外表面設有一螺紋部，該齒環的前端經由該螺紋部而與該鎖固環的後鎖合部相結合，該曲柄組設於該外殼內且與該齒輪組相結合並設有一曲柄軸，該棘輪組與該外殼及該曲柄組相結合且設有一棘輪軛、一傳動軸及一旋控鈕，藉以提供一種能提升結構強度、提高傳動穩定性且能延長使用壽命的動力棘輪扳手頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外殼</p>  
        <p type="p">11:封閉端</p>  
        <p type="p">21:鎖固環</p>  
        <p type="p">22:齒環</p>  
        <p type="p">221:螺紋部</p>  
        <p type="p">42:傳動軸</p>  
        <p type="p">43:旋控鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="267" publication-number="202621216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H05K5/02</main-classification>  
        <further-classification edition="200601120241127B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾迎楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾竣懋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAN-JHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高敏哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, MIN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昆霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括第一機體、第二機體以及樞軸結構，其中第二機體包括第一殼體以及第二殼體，第一殼體具有朝向第二殼體的表面以及自表面突起的第一階以及第二階，第一階的高度大於第二階的高度；樞軸結構包括轉軸以及鎖固片，其中轉軸連接於第一機體以及第二機體，鎖固片鄰近於轉軸且具有依序連接的第一組裝部、第二組裝部以及第三組裝部，第一組裝部承靠並固定於第一階，而第二組裝部承靠並固定於第二階，第三組裝部包覆至少部分的轉軸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a first body, a second body with a first casing and a second casing and a hinge structure is provided. The first casing has a top surface facing the second casing, first step and second step protrude from the top surface. A height of the first step is higher than a height of the second step. The hinge structure includes a rotating shaft and a locking piece. The rotating shaft is connected to the first body and the second body. The locking piece is configured adjacent to the rotating shaft and has a first assembly part, a second assembly part and a third assembly part connected in sequence, wherein the first assembly part is supported and fixed on the first step, the second assembly part is supported and fixed on the second step, and the third assembly part covers at least part of the rotating shaft.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">42:樞軸結構</p>  
        <p type="p">421:轉軸</p>  
        <p type="p">422:鎖固片</p>  
        <p type="p">4221:第一組裝部</p>  
        <p type="p">4222:第二組裝部</p>  
        <p type="p">4223:第三組裝部</p>  
        <p type="p">4224:連接部</p>  
        <p type="p">5:第二機體</p>  
        <p type="p">51:第一殼體</p>  
        <p type="p">51a:表面</p>  
        <p type="p">511:第一階</p>  
        <p type="p">512:第二階</p>  
        <p type="p">6:鎖固件</p>  
        <p type="p">7:緩衝片</p>  
        <p type="p">71:避讓區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="268" publication-number="202620314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低荷載煞車來令之製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A LOW-LOAD BRAKE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F16D69/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得義興企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE YI HSING INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡明城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明低荷載煞車來令之製造方法，其包含有準備及成型等步驟，首先該準備步驟備有橡膠、金鋼砂、玻璃纖維及金屬片，再將該金屬片定位，並取30~60%重量百分比之橡膠，2~20%重量百分比之金鋼砂及5~30%重量百分比之玻璃纖維，且前述總和為100%重量百分比進行加熱混煉成混合物，該混合物再進行出料成型（即成型步驟），以成型為一體化且低荷載（500公斤以下）之煞車來令成品，故此一製造方法不僅大幅降低加工時間與成本外，並且簡化加工程序而製造出結構強度佳之煞車來令成品，同時前述配方所形成之煞車材更能提升制動性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a low-load brake structure includes a preparation step and a forming step. In the preparation step, a metal sheet and materials including rubber, emery sand, and glass fiber are prepared. In the forming step, 100 wt% of the materials including 30~60 wt% of the rubber, 2~20 wt% of the emery sand, and 5~30 wt% of the glass fiber are adapted to be heated and mixed to thereby obtain a mixture. The mixture is then adapted to cover the metal sheet and form a brake pad after being cooled. The brake pad and the metal sheet are therefore combined together to further form an integrated brake structure with the low-load below 500 kg. Accordingly, the method facilitates in a reduction of the processing time and costs and in an increase of the strength of the brake structure while simplifying the processing procedures. The brake pad is also provided with improved braking effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:低荷載煞車來令之製造方法</p>  
        <p type="p">31:準備步驟</p>  
        <p type="p">32:成型步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="269" publication-number="202620738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行動捐款電子支付方法及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250207B">G06Q20/14</main-classification>  
        <further-classification edition="201201120250207B">G06Q20/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>第一商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIRST COMMERCIAL BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高芳如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江盈樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種行動捐款電子支付系統，適用於與一消費端電子裝置配合，並包含一電連接該消費端電子裝置的處理單元，及一電連接該處理單元並儲存有多個捐款規則的儲存單元。該處理單元自該消費端電子裝置接收一捐款意願確認後，產生並傳送多個捐款規則選項至該消費端電子裝置，並於自該消費端電子裝置接收一指示該等捐款規則選項其中一者的規則選定回覆及一包含一應付金額的支付請求後，根據該規則選定回覆指示的該捐款規則選項對應的該捐款規則及該應付金額計算出一捐款金額，並執行對應於該應付金額的一支付程序及對應於該捐款金額的一捐款程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:行動捐款電子支付系統</p>  
        <p type="p">1:處理單元</p>  
        <p type="p">2:儲存單元</p>  
        <p type="p">10:消費端電子裝置</p>  
        <p type="p">20:區塊鏈系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="270" publication-number="202620322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥組</chinese-title>  
        <english-title>VALVE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F16K1/46</main-classification>  
        <further-classification edition="200601120241204B">F16K1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEN-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎧宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KAI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閥組，包含一閥座與一閥芯，閥座包括一第一流道，且第一流道具有一入口、一出口以及一介於入口與出口之間的一第一錐面段，閥芯設置於閥座的第一流道中並且包括一頭部以及一第二流道，頭部包括一面向入口的平面以及一與第一錐面段配合的第二錐面段，第二流道包括至少一形成於第二錐面段並且用於供由入口進入的流體通過的斜向段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A valve assembly includes a valve seat and a valve core, the valve seat including a first passageway, the first passageway including an inlet, an outlet and a first ridged end section between the inlet and the outlet, the valve core being disposed in the first passageway of the valve seat and including a head portion and a second passageway, the head portion including an inlet facing plane and a second ridged end section mating with the first ridged end section, the second passageway including at least one angled section formed on the second ridged end section and adapted to pass through fluid entering by the inlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:閥組</p>  
        <p type="p">1:閥座</p>  
        <p type="p">12:第一座體</p>  
        <p type="p">13:第二座體</p>  
        <p type="p">13a:第二內螺紋段</p>  
        <p type="p">13b:第三內螺紋段</p>  
        <p type="p">2:閥芯</p>  
        <p type="p">21:頭部</p>  
        <p type="p">211:平面</p>  
        <p type="p">221:斜向段</p>  
        <p type="p">222:第二錐面段</p>  
        <p type="p">23:尾部</p>  
        <p type="p">3:密封環</p>  
        <p type="p">4:密封銅片</p>  
        <p type="p">5:彈性元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="271" publication-number="202620452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池電壓模擬裝置及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250205B">G01R31/367</main-classification>  
        <further-classification edition="202001120250205B">G01R31/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>至上電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, REN-HER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鈞群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫昆霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張冠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池電壓模擬裝置，包含一與一控制模組電連接的訊號處理模組，以及一電連接該訊號處理模組電壓模擬模組。該訊號處理模組用於在接收到一來自於該控制模組且指示出一指定電壓準位的模擬指令時，根據該模擬指令輸出一電壓值取決於該指定電壓準位的參考電壓訊號至該電壓模擬模組，其中，該指定電壓準位是由使用者所設定。該電壓模擬模組用於根據該參考電壓訊號產生並輸出一電壓值取決於該指定電壓準位的模擬輸出電壓，且該模擬輸出電壓用於表示單一個可充電電池的電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:訊號驅動模組</p>  
        <p type="p">50:電池電壓模擬裝置</p>  
        <p type="p">1:電能處理模組</p>  
        <p type="p">11:第一電壓轉換器</p>  
        <p type="p">12:第二電壓轉換器</p>  
        <p type="p">2:訊號處理模組</p>  
        <p type="p">21:訊號隔離單元</p>  
        <p type="p">211:隔離訊號輸入端</p>  
        <p type="p">212:隔離訊號輸出端</p>  
        <p type="p">22:數位類比轉換器</p>  
        <p type="p">3:電壓模擬模組</p>  
        <p type="p">31:運算放大器</p>  
        <p type="p">311:非反相輸入端</p>  
        <p type="p">312:反相輸入端</p>  
        <p type="p">313:運算輸出端</p>  
        <p type="p">32:增益設定單元</p>  
        <p type="p">33:驅動輔助單元</p>  
        <p type="p">34:電流限制單元</p>  
        <p type="p">35:模擬電壓輸出端</p>  
        <p type="p">GND:參考電位端</p>  
        <p type="p">Vo:模擬輸出電壓</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="272" publication-number="202621205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單片浸泡設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05K3/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敍豐企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECLAT FOREVER MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周政均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種單片浸泡設備，其包含架體、移載機構、浸泡機構、清洗機構及烘乾機構。架體包括有路徑導引模組及電控模組，路徑導引模組設於架體之頂部，電控模組設於電連接路徑導引模組；移載機構設於路徑導引模組且電連接電控模組；浸泡機構設於架體且位於移載機構之一側並電連接電控模組；清洗機構設於架體且位於浸泡機構之一側並電連接電控模組；烘乾機構設於架體且位於清洗機構之一側並電連接電控模組。藉此，可於使用時利用移載機構逐一將單片電路板夾持至浸泡機構、清洗機構及烘乾機構，以進行各電路板之浸泡、清洗與烘乾，而達到方便且迅速移動各電路板，並避免欲浸泡之藥水產生較大之波動，以維持電路板之製作良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:架體</p>  
        <p type="p">11:路徑導引模組</p>  
        <p type="p">12:電控模組</p>  
        <p type="p">2:移載機構</p>  
        <p type="p">21:升降模組</p>  
        <p type="p">22:夾具</p>  
        <p type="p">23:板材吸附模組</p>  
        <p type="p">3:浸泡機構</p>  
        <p type="p">31:藥水槽</p>  
        <p type="p">32:清潔模組</p>  
        <p type="p">33:第一氣體導引模組</p>  
        <p type="p">4:清洗機構</p>  
        <p type="p">41:水洗槽</p>  
        <p type="p">42:第二氣體導引模組</p>  
        <p type="p">5:烘乾機構</p>  
        <p type="p">51:烘乾槽</p>  
        <p type="p">511:第三層架</p>  
        <p type="p">52:蓋體</p>  
        <p type="p">6:放料機構</p>  
        <p type="p">7:收料機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="273" publication-number="202619887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對排聚苯乙烯低傳輸損耗電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">B32B7/12</main-classification>  
        <further-classification edition="200601120250418B">B32B15/04</further-classification>  
        <further-classification edition="200601120250418B">B32B15/082</further-classification>  
        <further-classification edition="200601120250418B">B32B27/30</further-classification>  
        <further-classification edition="200601120250418B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田祐欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田智晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, TOMOHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>入江達彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIE, MICHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉木朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKI, TOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供一種適合電子電路基板用途的剝離強度及傳輸損耗優異的疊層體。 &lt;br/&gt;本發明關於一種疊層體，其依序疊層有樹脂層(i)、黏接層(ii)、金屬層(iii)，其中，前述樹脂層(i)含有具有對排結構之苯乙烯系聚合物(A)，前述樹脂層(i)在縱向(MD)及橫向(TD)之線膨脹係數為10~80ppm/℃，MD/TD的比滿足0.6~1.4的範圍，前述樹脂層(i)與前述黏接層(ii)的層間的剝離強度為0.3kN/m以上，前述疊層體在頻率40GHz之傳輸損耗的絕對值為5.0dB/100mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="274" publication-number="202620289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直立型風機裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250422B">F03D13/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣電力股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李耀誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳憲政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁富彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭為陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種直立型風機裝置，主要係透過一軸部、一第一轉體及一第二轉體之設計，且該第一轉體係裝設於該軸部之直軸上端，而該第二轉體係位於該軸部之直軸上，並透過風力讓設於該軸部之直軸上端的第一轉體及位於該軸部之直軸上的第二轉體進行旋動，以帶動該軸部之直軸的轉動而產生風力發電，藉此，使具有能提升該直軸的低風速及高風速之轉動效能，並能增進該直軸的風力發電之效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:軸部</p>  
        <p type="p">11:直軸</p>  
        <p type="p">12:基座</p>  
        <p type="p">20:第一轉體</p>  
        <p type="p">21:第一板體</p>  
        <p type="p">22:第二板體</p>  
        <p type="p">23:中心軸</p>  
        <p type="p">24:第一弧形片</p>  
        <p type="p">25:第二弧形片</p>  
        <p type="p">26:葉片</p>  
        <p type="p">30:第二轉體</p>  
        <p type="p">31:第一弧形體</p>  
        <p type="p">32:第二弧形體</p>  
        <p type="p">33:固定件</p>  
        <p type="p">34:護套</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="275" publication-number="202621219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運動結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">F16B1/02</main-classification>  
        <further-classification edition="200601120241130B">F16B1/04</further-classification>  
        <further-classification edition="200601120241130B">F16B19/02</further-classification>  
        <further-classification edition="200601120241130B">F16B21/00</further-classification>  
        <further-classification edition="200601120241130B">F16B21/06</further-classification>  
        <further-classification edition="200601120241130B">F16B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍鐌科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIVETECH TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鼎瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIA CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種運動結構及其運動方法，運動結構包含操動件、傳動件及運動件。操動件活動設於座體；傳動件活動設於座體且活動對接操動件之一端；運動件活動設於座體且一端活動對接傳動件，並運動件之另一端用以與對應物體抵推扣接或抵推解扣，或運動件與對應物體抵推以帶動物體移動，或運動件與對應物體抵推以帶動物體槓桿省力移動。藉此，可將座體與物體組合，且施力於操動件以配合傳動件帶動運動件與對應物體抵推扣接或抵推解扣，以完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:運動結構</p>  
        <p type="p">11:操動件</p>  
        <p type="p">111:施力部</p>  
        <p type="p">112:第一嚙合部</p>  
        <p type="p">1121:第一齒狀體</p>  
        <p type="p">113:第一組接部</p>  
        <p type="p">114:固定部</p>  
        <p type="p">1141:栓體</p>  
        <p type="p">1142:彈性元件</p>  
        <p type="p">12:傳動件</p>  
        <p type="p">121:第二嚙合部</p>  
        <p type="p">1211:第二齒狀體</p>  
        <p type="p">122:第二組接部</p>  
        <p type="p">13:運動件</p>  
        <p type="p">131:第三嚙合部</p>  
        <p type="p">1311:第三齒狀體</p>  
        <p type="p">132:第三組接部</p>  
        <p type="p">133:第一抵頂部</p>  
        <p type="p">134:第二抵頂部</p>  
        <p type="p">135:扣接部</p>  
        <p type="p">10:座體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="276" publication-number="202619760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器</chinese-title>  
        <english-title>CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A61Q13/00</main-classification>  
        <further-classification edition="200601120241204B">C11D3/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種容器係包括：一具有容置空間之容器本體以及裝載於該容置空間中之流體，其中，該流體係包含草本萃取物，且該草本萃取物係來自艾草、抹草及/或香茅，故本發明之容器以草本萃取物取代習知人工化學調和物，因而不會嗆鼻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A container comprise a container body having an accommodation space filling with a fluid, wherein the fluid includes a herbaceous extract, and the herbaceous extract is made of mugwood, leguminosae and/or lemongrass. Therefore, the container uses herbaceous extract instead of conventional artificial chemical concoctions to keep people from choking.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:容器</p>  
        <p type="p">10:容器本體</p>  
        <p type="p">10a:瓶本體</p>  
        <p type="p">10b:按壓式噴嘴頭</p>  
        <p type="p">100:導管</p>  
        <p type="p">11:流體</p>  
        <p type="p">12:草本萃取物</p>  
        <p type="p">13:除臭物</p>  
        <p type="p">S:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="277" publication-number="202620596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調降功耗裝置及調降功耗方法</chinese-title>  
        <english-title>POWER REDUCTION DEVICE AND POWER REDUCTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250207B">G06F1/3203</main-classification>  
        <further-classification edition="200601120250207B">G06F9/455</further-classification>  
        <further-classification edition="202501120250207B">G06F11/36</further-classification>  
        <further-classification edition="200601120250207B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種調降功耗裝置包含第一主控器、處理器及電源管理器。電源管理器包含模型加速演算法。第一主控器用以輸出第一主動傳輸信號。模型加速演算法用以根據第一主動傳輸信號控制處理器的時鐘源或處理器的電源以調降處理器的功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power reduction device includes a first master element, a processor, and a power management unit. The power management unit includes a model acceleration algorithm. The model acceleration algorithm is configured to control a clock source or a power supply to reduce a power of the processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:調降功耗裝置</p>  
        <p type="p">10:微控制器</p>  
        <p type="p">20:時鐘源</p>  
        <p type="p">30:電源</p>  
        <p type="p">110:第一主控器/主控器</p>  
        <p type="p">111:第二主控器/主控器</p>  
        <p type="p">120:處理器</p>  
        <p type="p">12:電源管理器</p>  
        <p type="p">900:匯流排</p>  
        <p type="p">910:串列週邊介面</p>  
        <p type="p">920:積體匯流排電路</p>  
        <p type="p">930:其他元件</p>  
        <p type="p">SM1:第一主動傳輸信號/主動傳輸信號</p>  
        <p type="p">SM2:第二主動傳輸信號/主動傳輸信號</p>  
        <p type="p">SPC:程式計數器信號</p>  
        <p type="p">SC1:第一控制信號</p>  
        <p type="p">SC2:第二控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="278" publication-number="202620397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螢光示蹤劑及其用於即時偵測洩油的方法</chinese-title>  
        <english-title>FLUORESCENT TRACER AND METHOD OF DETECTING FOR REAL-TIME OIL LEAKAGE DETECTION USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">G01M3/20</main-classification>  
        <further-classification edition="200601120241205B">B21B38/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林一信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊登元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種螢光示蹤劑及其用於即時偵測洩油的方法。螢光示蹤劑包含特定含量的螢光染色劑、油性向上劑、極壓劑及溶劑。藉由併用油性向上劑及極壓劑，可穩定螢光染色劑之結構，從而延長螢光示蹤劑之使用壽命，且不對油品的品質及機械設備的運作產生負面影響，可應用於即時偵測洩油的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to a fluorescent tracer and a method of detecting real-time oil leakage using the same. The fluorescent tracer includes specific amounts of a fluorescent dye, an oiliness improver, an extreme pressure agent, and a solvent. By adding both oiliness additives and extreme pressure agent, the structure of the fluorescent tracer can be stable, so the service life of the fluorescent tracer can be lengthened, and the addition of the fluorescent tracer does not adversely influence oil quality and the operation of the mechanical device. Therefore, the fluorescent tracer can be applied on the method of detecting real-time oil leakage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510,530,550,570,590:曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="279" publication-number="202619646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>椅子頭枕組件</chinese-title>  
        <english-title>CHAIR HEADREST ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">A47C7/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣力達企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATEC INTERNATIONAL TEAM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳得峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TE-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種椅子頭枕組件，包括一個相對於連接於椅背的支撐架可作為單一單元垂直調節的頭枕本體。頭枕本體通過樞軸樞接於支撐架頂部，該樞軸穿過頭枕本體後部左右兩側垂直延伸的略帶曲線的開口。滑軌帶有齒牙安裝於後部內表面，並有一個阻尼齒輪機構樞接於樞軸，與滑軌嚙合。此嚙合允許頭枕本體進行受控的垂直及角度調節，提供平滑的移動並在無需額外鎖定機構的情況下保持頭枕位置。簡化的結構通過消除對使用者頸部的干擾，提升了使用者的舒適度並減少了製造的複雜性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chair headrest assembly includes a headrest body vertically adjustable as a single unit relative to a support frame attached to a chair backrest. The headrest body is pivotally connected to a pivot shaft at the top of the support frame, with the pivot shaft passing through vertically extending, slightly curved openings on both sides of the rear portion of the headrest body. A sliding rail with teeth is installed on the inner surface of the rear portion, and a damping gear mechanism pivotally connected to the pivot shaft engages the sliding rail. The engagement allows for controlled vertical and angular adjustment of the headrest body, providing smooth movement and maintaining the headrest position without additional locking mechanisms. The simplified structure enhances user comfort by eliminating interference with the user's neck and reduces manufacturing complexity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:椅子頭枕組件</p>  
        <p type="p">110:支撐架</p>  
        <p type="p">112:中央支撐柱</p>  
        <p type="p">1122:樞軸</p>  
        <p type="p">120:頭枕本體</p>  
        <p type="p">122:後部</p>  
        <p type="p">1222:扣件</p>  
        <p type="p">124:前部</p>  
        <p type="p">1226:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="280" publication-number="202621403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗電漿侵蝕元件結構與其製造方法</chinese-title>  
        <english-title>PLASMA-EROSION-RESISTANT COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P34/00</further-classification>  
        <further-classification edition="200601120260223B">B32B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翔名科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEEDBACK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱國揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIOU, GUO-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抗電漿侵蝕元件結構與其製造方法，特別是用於半導體製程之相關設備或設施的元件。該元件結構包括多層結構，包括由不鏽鋼合金、鋁合金、高分子或陶瓷材料製成的基材；一層由金屬氧化物、氟化物或氮化物構成的表面塗層，該塗層通過等離子噴塗、氣溶膠噴塗、物理氣相沉積、原子層沉積或電漿增強化學氣相沉積技術沉積而成；以及通過使用惰性氣體進行離子轟擊，使該塗層進一步緻密化的表面改質層。此多層結構大幅提升了元件表面之硬度、密度及耐磨性，增強了抗電漿侵蝕的能力，並有效減少因塗層剝落而產生的粉塵。本發明不僅提升了元件的耐用性，還有效降低了製程中的顆粒污染，滿足了先進半導體製造中的嚴苛需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasma-erosion-resistant component structure and its manufacturing method are provided, especially for use in semiconductor processing equipment. The structure comprises a multi-layered assembly including a component substrate selected from stainless steel alloys, aluminum alloys, polymer materials, or ceramic materials; a surface coating composed of metal oxides, fluorides, or nitrides, applied via deposition methods such as plasma spraying, aerosol deposition, physical vapor deposition, atomic layer deposition, or plasma-enhanced chemical vapor deposition; and a surface-modified coating formed by densifying the surface coating through ion bombardment using inert gases. This multi-layered configuration enhances hardness, density, and wear resistance, thereby improving plasma-erosion resistance and reducing dust generation caused by coating peeling. The invention offers superior durability and reduced particulate contamination, addressing critical challenges in advanced semiconductor fabrication processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抗電漿侵蝕元件結構(元件結構)</p>  
        <p type="p">110:基材</p>  
        <p type="p">120:塗層</p>  
        <p type="p">130:表面改質層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="281" publication-number="202620770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>淨零建築設計整合碳排與能源管理方法</chinese-title>  
        <english-title>NET-ZERO BUILDING DESIGN INTEGRATES CARBON AND ENERGY MANAGEMENT APPROACHES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241223B">G06Q50/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐庭嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, TING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張亦葳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, YI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宸瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅昇宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種淨零建築設計整合碳排與能源管理方法，以淨零建築為目標來進行電力調度分配最佳化流程，藉由一系列步驟流程來判斷現階段的建築用電負載、綠電發電量及儲能設備電量是否能夠達成淨零目標，當未能達成淨零目標時，調整建築用電負載，直到達成淨零目標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides net-zero building design integrating carbon and energy management approaches. This invention would like to optimize power dispatching and distribution to achieve net-zero building. This invention utilizes a series of steps to determine whether a building electrical load, a green power generation capacity and an energy storage device power can achieve the net-zero building target. When the net-zero building target is not achieved, the building electrical load is adjusted until the net-zero building target is achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S17:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="282" publication-number="202621067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纖陣列測試系統</chinese-title>  
        <english-title>FIBER ARRAY TESTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241226B">H04B10/07</main-classification>  
        <further-classification edition="200601120241226B">G01M11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂引棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YIN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭漢檥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭棫璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光纖陣列測試系統包含光源、光學基板、待測稜鏡及接收器。光源用以產生光訊號。光學基板面對於光源，用以傳遞光訊號。待測稜鏡置於光學基板上，用以接收光訊號，並將光訊號反射，以產生反射光訊號。接收器用以接收反射光訊號。光學基板及待測稜鏡組成光纖陣列的部分。反射光訊號在接收器上形成投影區域。投影區域內的光資訊用以測試光纖陣列是否異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fiber array testing system includes a light source, an optical substrate, a tested prism, and a receiver. The light source generates a light signal. The optical substrate faces the light source and is used for transmitting the light signal. The tested prism is disposed on the optical substrate and used for receiving the light signal and reflecting the light signal to generate a reflected light signal. The receiver receives the reflected light signal. The optical substrate and the tested prism form a portion of a fiber array. The reflected light signal forms a projection region on the receiver. Light information within the projection region is used for testing for anomalies in the fiber array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光纖陣列測試系統</p>  
        <p type="p">10:光源</p>  
        <p type="p">10a:鏡頭</p>  
        <p type="p">LA:準直光</p>  
        <p type="p">11:光學基板</p>  
        <p type="p">12:待測稜鏡</p>  
        <p type="p">13:接收器</p>  
        <p type="p">14:可動稜鏡</p>  
        <p type="p">12a及14a:第一面</p>  
        <p type="p">12b及14b:第二面</p>  
        <p type="p">12c及14c:第三面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="283" publication-number="202619869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁力干擾監測方法、磁力干擾監測系統及輪式機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25J19/02</main-classification>  
        <further-classification edition="200601120241204B">G01R33/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優式機器人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URSROBOT AI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東憬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳忠侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳招成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁力干擾監測方法，藉由包含一磁力計及一處理模組的一磁力干擾監測系統實施，該磁力計產生分別對應於三軸的三個磁力感測資料，該方法包含：於一靜置階段，該處理模組透過一靜置姿態角資料將該等磁力感測資料轉換成以慣性座標表示的三個靜置磁力轉換資料；該處理模組分別根據各該靜置磁力轉換資料產生一磁力正常範圍；於一監測階段，該處理模組透過一當前姿態角資料將該等磁力感測資料轉換成以慣性座標表示的三個當前磁力轉換資料；及該處理模組判斷各該當前磁力轉換資料是否落在對應的該磁力正常範圍以產生一監測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S03:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="284" publication-number="202620900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>速度計算方法、速度計算系統及輪式機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G21C21/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優式機器人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URSROBOT AI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東憬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳忠侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳招成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種速度計算方法，藉由一速度計算系統實施，速度計算系統包含一衛星定位模組、一計速模組及一處理模組，衛星定位模組持續計算出一第一當前速度資料，計速模組持續計算出一第二當前速度資料，方法包含：當衛星定位模組接收衛星訊號資料的收訊狀態良好時，處理模組根據第一當前速度資料及第二當前速度資料計算出一適於將第二當前速度資料轉換成至少近似於第一當前速度資料的轉換係數資料；及當收訊狀態轉為不良時，處理模組使用轉換係數資料將第二當前速度資料轉換成一校正速度資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01、S02:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="285" publication-number="202620791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在媒合平台即時展示設計之方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250114B">G06T19/00</main-classification>  
        <further-classification edition="200601120250114B">G06T17/00</further-classification>  
        <further-classification edition="200601120250114B">G06T1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿哲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種在媒合平台即時展示設計之方法，係包括：由一媒合平台端之一媒合平台裝置與至少一設計者端之一設計端裝置連線，以接收該設計端裝置上傳的一設計圖像，並儲存在該媒合平台裝置之一媒合資料庫中；由該媒合平台裝置的一媒合處理單元將該設計圖像列印在一特定物件上並形成有一展示物件；該媒合平台端再將該展示物件置放在一旋轉平台上且由一影像擷取模組拍攝該展示物件，並由一控制機台控制該旋轉平台旋轉，而該影像擷取模組環物拍攝該展示物件並產生有複數2D物件圖像；再由一影像處理裝置接收該等2D物件圖像且進行編輯及封裝並上傳至一雲端伺服器，該雲端伺服器編輯該些2D物件圖像且產生有一3D環物影像，並儲存在該雲端伺服器之一伺服資料庫中；該雲端伺服器再將該3D環物影像嵌入媒合平台端之一展示網站中且於展示網站中產生有一展示連結資訊；及至少一消費端裝置可透過所述展示網站或展示連結資訊在伺服資料庫中觀看該展示物件之3D環物影像，進而達到可將設計者設計圖像形成於實品上並於媒合平台上供消費者以3D環物影像觀看之功效者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">步驟S1~步驟S6</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="286" publication-number="202621137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於行動邊緣運算應用的行動終端的識別系統及其方法</chinese-title>  
        <english-title>MOBILE TERMINAL IDENTIFICATION SYSTEM AND METHOD BASE ON MOBILE EDGE COMUPUTING APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">H04W4/02</main-classification>  
        <further-classification edition="200901120250303B">H04W8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江漢鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HAN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUEH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭凱中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KAI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於行動邊緣運算應用的行動終端的識別系統及其方法，識別方法包括經由基地台接收第一行動終端設備發送的信令封包及識別請求，並傳送信令封包及識別請求；對信令封包及識別請求進行解析，以獲取第一行動終端設備的第一識別資訊，並傳送第一識別資訊；依據第一識別資訊及識別資訊獲取識別結果資訊，並且傳送識別結果資訊；以及依據識別結果資訊對訊務封包標識身份代碼與位置代碼後傳送至本地應用服務或者依據應用場域需求對訊務封包進行處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mobile terminal identification system and method base on mobile edge computing application is provided, the identification method includes receiving a signaling packet and an identification request sent by a first mobile terminal device via a base station, and transmitting the signaling packet and the identification request; parsing the signaling packet and the identification request to obtain a first identification information of the first mobile terminal device and transmitting the first identification information; obtaining an identification result information according to the first identification information and the identification information, and sending the identification result information; marking an identity code and a location code on a data packet according to the identification result information and then sending it to a local application service or processing the data packet according to application field requirements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於行動邊緣運算應用的行動終端的識別系統</p>  
        <p type="p">20:行動終端設備</p>  
        <p type="p">30:基地台</p>  
        <p type="p">40:本地應用服務</p>  
        <p type="p">11:封包處理模組</p>  
        <p type="p">12:識別模組</p>  
        <p type="p">13:用戶設備資料管控模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="287" publication-number="202619676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙層立式翻蓋洗碗機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">A47L15/00</main-classification>  
        <further-classification edition="200601120250113B">A47L15/42</further-classification>  
        <further-classification edition="200601120250113B">A47L15/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑀鍶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖玗杋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙層立式翻蓋洗碗機，具有箱體，箱體從上至下依次分隔有烘乾倉、清洗倉和供液倉，清洗倉內放置有雙層碗框，清洗倉內設置有若干噴淋組件，供液倉內設置有供液組件，供液組件的出液口上設置有主輸液管，烘乾倉內設置有烘乾組件，主輸液管與噴淋組件連通，且其內徑自下而上逐級變小以降低位於不同高度的噴淋組件之間的噴淋壓力差。本發明通過將主輸液管的內徑自下而上逐級變小，用於抵消因高度差而存在的壓力損失，從而使得位於不同高度的噴淋組件以幾乎相等的壓力噴出清洗液對餐具進行清洗，進而使得兩層餐具清潔度差別小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:箱體</p>  
        <p type="p">11:烘乾倉</p>  
        <p type="p">12:清洗倉</p>  
        <p type="p">13:供液倉</p>  
        <p type="p">14:觀察門</p>  
        <p type="p">2:碗框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="288" publication-number="202620338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可自行排除異常運轉狀況的空調裝置用排水裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F24F13/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合利美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭裕明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇樞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可自行排除異常運轉狀況的空調裝置用排水裝置，包含有：一主殼體；一驅動馬達；一控制模組，儲存有一控制邏輯；一排水葉輪；以及一下殼體具有一入水口及一出水管；其中，該控制模組執行該控制邏輯，該控制邏輯包含有：A：在正常運轉時，係控制該驅動馬達依一第一方向運轉，即正轉；B：該電流偵測單元所偵測到的電流值大於一預定臨界值時，該微控制器控制該驅動馬達逆轉，並在之後改為正常運轉；以及C：該控制模組計算前述控制該驅動馬達逆轉的次數，在累積預定次數後控制該驅動馬達停止運轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:驅動馬達</p>  
        <p type="p">31:控制模組</p>  
        <p type="p">32:控制邏輯</p>  
        <p type="p">34:電流偵測單元</p>  
        <p type="p">36:微控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="289" publication-number="202620449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電凸塊量測方法與系統以及偏移計算方法</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR MEASURING CONDUCTIVE BUMP AND METHOD FOR CALCULATING OFFSET THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01R31/28</main-classification>  
        <further-classification edition="201701120260223B">G06T7/30</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯仲禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾松樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, SUNG HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導電凸塊量測方法與系統以及偏移計算方法，能自動拍攝電子封裝件之透視影像，並自動量測該透視影像中之導電凸塊與參照物之邊界，以自動計算該導電凸塊之偏移值，俾解決習知人工處理之低精準度與低效率的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for measuring conductive bumps of an electronic package and a method for calculating offsets of the conductive bumps are provided, which can automatically capture a see-through image of the electronic package, and automatically measure the boundaries of the conductive bumps and traces in the see-through image to automatically calculate the offset values of the conductive bumps, so as to solve the problem of low precision and low efficiency of conventional manual processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:樣品/電子封裝件</p>  
        <p type="p">301:承載結構</p>  
        <p type="p">302:導電凸塊</p>  
        <p type="p">303:電子元件</p>  
        <p type="p">31:影像裝置</p>  
        <p type="p">311:承載平台</p>  
        <p type="p">312:影像感測器</p>  
        <p type="p">313:顯示器</p>  
        <p type="p">32:計算裝置</p>  
        <p type="p">33:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="290" publication-number="202620689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有無線射頻辨識功能的擴充裝置及方法</chinese-title>  
        <english-title>EXPANSION DEVICE AND METHOD HAVING A RADIO FREQUENCY IDENTIFICATION FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G06K19/067</main-classification>  
        <further-classification edition="200901120241204B">H04W80/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華精測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA PRECISION TEST TECH. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾文君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, WEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倬昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHO YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種具有無線射頻辨識功能的擴充裝置及方法。該擴充裝置包括：一天線，配置以偵測一標籤；一射頻辨識晶片，連接所述天線，所述射頻辨識晶片用以獲取所述天線偵測所述標籤的第一標籤資訊；一通訊介面模組，與一外部設備通訊連接；以及一微控制器，分別與所述射頻辨識晶片和所述通訊介面模組連接，所述微控制器依據所述通訊介面模組配置的通信協定，用以轉換所述第一標籤資訊成與所述通信協定相匹配的第二標籤資訊，並透過所述通訊介面模組傳輸所述第二標籤資訊至所述外部設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an expansion device and method having a radio frequency identification (RFID) function. The expansion device includesan antenna configured to detect a tag; an RFID chip coupled to said antenna, said RFID chip being configured to obtain first tag information of said tag detected by said antenna; a communication interface module communicatively coupled to an external device; and a microcontroller coupled to said RFID chip and said communication interface module, respectively, said microcontroller being configured to convert said first tag informationintosecond tag information matching said communication protocol based on a communication protocol configured by said communication interface module, and to transmit said second tag information to said external device through said communication interface module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:擴充裝置</p>  
        <p type="p">200:外部設備</p>  
        <p type="p">101:天線</p>  
        <p type="p">102:射頻辨識晶片</p>  
        <p type="p">103:通訊介面模組</p>  
        <p type="p">104:微控制器</p>  
        <p type="p">105:顯示模組</p>  
        <p type="p">106:輸入介面模組</p>  
        <p type="p">107:儲存模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="291" publication-number="202619685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於心電圖與多模型融合的失眠偵測方法</chinese-title>  
        <english-title>METHOD FOR INSOMNIA DETECTION BASED ON ELECTROCARDIOGRAM AND MULTI-MODEL FUSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241230B">A61B5/346</main-classification>  
        <further-classification edition="201801120241230B">G16H50/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉政育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明基於心電圖與多模型融合的失眠偵測方法，其採用睡眠資料庫所提供選自不同受測者的心電圖訊號，分別建立為訓練、驗證與測試深度學習模型所需的第一資料集與第二資料集，並利用二配合演算的損失函數與優化器建立為偵測技術，以取得最佳化的深度學習模型，藉此由一全連接類神經網路模型與最佳化該深度學習模型結合，以多模型融合形態對輸入之受測者的心電圖訊號進行演算、分析，最終輸出分類結果，有效提升分類準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for insomnia detection based on electrocardiogram and multi-model fusion includes respectively building a first data collection and a second data collection that are adapted to train, verify, and test a deep-learning model by using electrocardiogram signals of different subjects in a sleep database. Loss function and an optimizer are applied as detection building means, thereby obtaining the optimum deep-learning model. The multi-model fusion is achieved by combining the optimum deep-learning model and a fully-connected artificial neural network model to calculate and analyze the electrocardiogram signals of the subjects and further output an result of classification, thereby effectively improving the accuracy of classification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:基於心電圖與多模型融合的失眠偵測方法</p>  
        <p type="p">31:訊號預處理</p>  
        <p type="p">32:建立偵測模型</p>  
        <p type="p">33:建立資料集</p>  
        <p type="p">34:訓練、驗證與測試模型</p>  
        <p type="p">35:多模型融合</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="292" publication-number="202619764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>下肢復健裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">A63B23/04</main-classification>  
        <further-classification edition="200601120241230B">A61H1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚學校財團法人長庚科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭冰如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉杏元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許定洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林侑潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佩諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓卉蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雅宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁照為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周鈺庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種下肢復健裝置，包含具第一軌道之基座；支架結構，包含上、下支架組，分別供使用者膝上、下段之下肢部位放置，且上、下支架組一端相互樞轉設置；前支架組，設於下支架組另一端並與其為樞轉設置，前支架組另一端設有對應置於第一軌道內前後滑動之第一滑動輪組；伸縮後支架，一端與下支架組中段為樞轉設置，另一端與基座一端部樞轉設置，其中伸縮後支架可拖曳下支架組前後移動而改變上、下支架組之間夾角；足踝支架組，一側與下支架組樞轉設置；滑撐座，為碗狀結構並與足踝支架組另一側為固定設置，內面設有第二及第三軌道，且第二軌道投影至基座係落於第一軌道之路徑或延長線上，第三軌道與第二軌道相互垂直，其中第一滑動輪組滑動時滑撐座維持與基座之間距和夾角；足踝塊為半球形體而設於碗狀結構且底面設有第二滑動輪組，其為轉向輪結構而可於第二或第三軌道內移動以改變足踝塊於滑撐座內之位置。據此，係可提供具特殊結構設計而便於使用者進行下肢復健運動之輔具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:下肢復健裝置</p>  
        <p type="p">10:基座</p>  
        <p type="p">101:第一軌道</p>  
        <p type="p">11:支架結構</p>  
        <p type="p">111:上支架組</p>  
        <p type="p">112:下支架組</p>  
        <p type="p">113:前支架組</p>  
        <p type="p">1131:第一滑動輪組</p>  
        <p type="p">114:伸縮後支架</p>  
        <p type="p">115:足踝支架組</p>  
        <p type="p">12:滑撐座</p>  
        <p type="p">122:第二軌道</p>  
        <p type="p">123:第三軌道</p>  
        <p type="p">13:足踝塊</p>  
        <p type="p">131:第二滑動輪組</p>  
        <p type="p">9:使用者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="293" publication-number="202620339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能板支架組件</chinese-title>  
        <english-title>SOLAR PANEL BRACKET ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241127B">F24S25/61</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元融科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN-RON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種太陽能板支架組件，其包含：一底座，其於兩側端分別向下傾斜設置有一斜板，斜板分別設置有一定位部件；一支撐架，其係對應組接於該底座之頂端，且該支撐架於一端面縱向形成一對應連通於該鏤空部之滑槽； &lt;br/&gt;一伸縮架，其係對應縱向滑動設置於該支撐架內，且該伸縮架於一端設置有至少一對應於該滑槽之組接孔；所述組接孔係分別對應組設一固接元件，所述固接元件係透過貫穿於所述組接孔及該滑槽，以對應迫緊定位該伸縮架縱向伸縮於該支撐架之位置；藉此，本發明係可透過斜板間形成之空間以對應組接於一浪板上，藉可利於架設於具有浪板之屋頂上，亦可透過定位部件直接鎖固於地面或屋頂，且伸縮架頂端係用以對應架設太陽能板，並可透過伸縮架定位於支撐架之位置，亦可進行太陽能板之調整，藉可因應太陽能板之環境而對應進行其架設，使提升本發明之靈活性；同時，本發明透過其組接方式，使具有高度之穩固性，可抵禦18級之風速，且透過其材質配置，以可具有高度抗腐蝕之特性，可應用於CX腐蝕等級之環境，並具有高度之使用年限，以可提升本發明整體之強度與使用壽命，使確保太陽能板可穩固定位並長時間運作，以有助於提升供電之效能者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a solar panel bracket assembly, which includes a base with a slant plate disposed at each of its two side ends, each slant plate having a positioning component; a support stand, which is assembled to the top of the base, and the support stand has a pair of longitudinally formed sliding grooves at one end, which correspond and communicate with the chute of hollowed-out portion; a telescopic stand, which is longitudinally slidable disposed within the support stand, and has at least one connecting hole at one end that corresponds to the chute; the connecting hole is provided with a fastening component, which is inserted through the connecting hole and the chute to securely position the telescopic stand in the longitudinal direction within the support stand. Thus, the present invention can be connected to a ribbed board via the space between the slant plates, facilitating installation on rooftops with ribbed boards. It can also be directly locked to the ground or roof via the positioning components. The top of the telescopic stand is used to mount the solar panel, and the position of the telescopic stand can be adjusted within the support stand. This allows for adjustments to the solar panel according to environmental factors, enhancing the flexibility of the invention. At the meantime, the assembly method provides high stability, enabling it to withstand wind speeds of up to level 18. Additionally, the materials used have high corrosion resistance, making it suitable for environments with a CX corrosion grade. The design also ensures a long service life, improving the overall strength and durability of the invention, ensuring that the solar panels remain securely in place for long-term operation, thus helping to enhance the power supply efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:底座</p>  
        <p type="p">11:斜板</p>  
        <p type="p">12:空間</p>  
        <p type="p">13:定位部件</p>  
        <p type="p">15:延伸板</p>  
        <p type="p">2:支撐架</p>  
        <p type="p">21:鏤空部</p>  
        <p type="p">22:滑槽</p>  
        <p type="p">231:定位單元</p>  
        <p type="p">3:伸縮架</p>  
        <p type="p">311:固接元件</p>  
        <p type="p">32:支撐板</p>  
        <p type="p">33:槽口</p>  
        <p type="p">341:定位元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="294" publication-number="202620353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低噪緩震液冷裝置</chinese-title>  
        <english-title>LOW-NOISE CUSHIONING LIQUID COOLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F28D1/06</main-classification>  
        <further-classification edition="200601120241204B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳昂湃技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN APALTEK CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖啟能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, QINENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭達高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, DAGAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳敏銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MINRUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係一種低噪緩震液冷裝置，包括主體、泵浦、發光模組、中層套筒、外殼及光學模組，泵浦設於主體，發光模組設於主體上並遮蔽泵浦的一部分，中層套筒套設主體且具有內壁、內部空間及複數吸音減震結構，內壁圍繞出內部空間，主體、發光模組及泵浦位於內部空間內，各吸音減震結構係自內壁延伸而出，外殼固定於主體且罩蓋中層套筒，外殼具有通孔，通孔連通內部空間，光學模組卡設在該些吸音減震結構之間且位於發光模組及通孔之間；藉此，中層套筒能有效吸收泵浦高速運作時產生的噪音與震動，並讓光學模組不需要依靠額外元件即可安裝固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A low-noise cushioning liquid cooling device having a main body, a pump, a light-emitting module, a middle sleeve, an outer shell, and an optical module is provided. The pump is arranged on the main body. The light-emitting module is arranged on the main body and covers a part of the pump. The middle sleeve is sleeved on the main body and has an inner wall, an inner space surrounded by the inner wall, and a plurality of sound-absorbing and shock-absorbing structures extended from the inner wall. The main body, the light-emitting module, and the pump are located in the inner space. The outer shell is fixed to the main body and covers the middle sleeve. The outer shell has a through hole communicated to the inner space. The optical module is arranged between the sound-absorbing and shock-absorbing structures and located between the light-emitting module and the through hole. The middle sleeve may absorb a noise and shocks generated by the pump during operating, and the optical module may be fixed without additional members.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主體</p>  
        <p type="p">13:入液接口</p>  
        <p type="p">14:出液接口</p>  
        <p type="p">20:泵浦</p>  
        <p type="p">30:發光模組</p>  
        <p type="p">31:安裝板</p>  
        <p type="p">32:發光元件</p>  
        <p type="p">40:中層套筒</p>  
        <p type="p">43:吸音減震結構</p>  
        <p type="p">50:外殼</p>  
        <p type="p">60:光學模組</p>  
        <p type="p">70:第二透光鏡</p>  
        <p type="p">90:底座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="295" publication-number="202620637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142802</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運算資源管理方法以及運算裝置</chinese-title>  
        <english-title>COMPUTING RESOURCE MANAGEMENT METHOD AND COMPUTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F9/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳藺剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LING-KAMG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">運算資源管理方法用於管理包含多個處理核心的運算裝置，處理核心每一者各自包含多個處理器執行緒，處理器執行緒分別用以執行運算程序。運算資源管理方法包含下列步驟：取得靜態運算需求；根據靜態運算需求設定執行緒需求量；根據執行緒需求量決定可離線執行緒數量；根據可離線執行緒數量，以每一處理核心為最小單位將該些處理器執行緒的一部分屏蔽於運算資源池之外；以及，由任務排程器將運算程序各自分配於運算資源池之內的處理器執行緒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computing resource management method is used for managing a computing device including multiple processing cores. Each of the processing cores contains multiple processor threads. These processor threads are used to execute computational processes. The computing resource management method includes steps of: obtaining a static computing demand; setting a thread demand quantity based on the static computational demand; determining a number of offlineable threads based on the thread demand quantity; blocking a portion of these processor threads from the computing resource pool, using each processing core as a smallest unit, according to the number of offlineable threads; and utilizing a task scheduler to allocate the computational processes to the processor threads within the computational resource pool.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:運算資源管理方法</p>  
        <p type="p">S510,S520,S530,S540:步驟</p>  
        <p type="p">S550,S560,S570,S580:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="296" publication-number="202619739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經植物乳桿菌（Ｌａｃｔｏｂａｃｉｌｌｕｓ　ｐｌａｎｔａｒｕｍ）發酵之薄荷蒸餾副產物（ＦＭＡＲ），其製法及其於製備飼料添加組成物之應用</chinese-title>  
        <english-title>FERMENTED MENTHA ARVENSIS RESIDUE (FMAR) WITH LACTOBACILLUS PLANTARUM, PRODUCING METHOD AND USE THEREOF IN MAKING FEED ADDITIVE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241219B">A61K35/747</main-classification>  
        <further-classification edition="200601120241219B">A61K36/534</further-classification>  
        <further-classification edition="200601120241219B">A61P39/06</further-classification>  
        <further-classification edition="200601120241219B">A61P1/00</further-classification>  
        <further-classification edition="201601120241219B">A23K10/18</further-classification>  
        <further-classification edition="201601120241219B">A23K10/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李滋泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種經由植物乳桿菌(&lt;i&gt;Lactobacillus plantarum&lt;/i&gt;)發酵而得之薄荷蒸餾副產物(FMAR)，其酚類物質中的類黃酮苷(flavonoid glycoside)在發酵過程被轉化為生物活性和利用率較高之醣苷配基(flavonoid aglvcone)。本發明之薄荷蒸餾副產物發酵物可做為家禽飼料添加物，用於改善家禽之氧化壓力狀態、降低發炎反應及改善腸道菌相。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a fermented product of &lt;i&gt;Mentha arvensis&lt;/i&gt; residue (FMAR) which is characterized by fermenting &lt;i&gt;Mentha arvensis&lt;/i&gt; residue with &lt;i&gt;Lactobacillus plantarum&lt;/i&gt;. The fermented product may be used as a broiler feed additive composition to improve oxidative stress, inhibit poultry inflammatory responses in poultry, and reduce the number of harmful bacteria in the intestines of broilers.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="297" publication-number="202620808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>門禁管制系統及其方法</chinese-title>  
        <english-title>ACCESS CONTROL SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250114B">G07C9/22</main-classification>  
        <further-classification edition="202001120250114B">G07C9/29</further-classification>  
        <further-classification edition="201301120250114B">G06F21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠傳電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAR EASTONE TELECOMMUNICATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王明賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-SHYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭水樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHUI-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江華珮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUA-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旗達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, CHYI-DAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宗仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TSUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖哲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種門禁管制系統，包含一電子鎖、一儲存單元、一感應卡讀取器以及一控制單元。儲存單元儲存一排班表，排班表包含多筆排班人員資料。感應卡讀取器讀取一感應卡，以取得一人員資訊。當感應卡讀取器讀取感應卡時，控制單元根據人員資訊自儲存單元取得這些排班人員資料其中之一，且控制單元判斷一當前時間是否與其中之一的排班人員資料所對應的排班時段欄位相符。當控制單元判斷當前時間與其中之一的排班人員資料所對應的排班時段欄位相符時，控制單元開啟電子鎖。此外，本發明再提出一種門禁管制方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An access control system including an electronic lock, a storage unit, a proximity card reader and a control unit is provided. The storage unit stores a shift schedule including multiple scheduled personnel data. The proximity card reader reads a proximity card to obtain personnel information. When the proximity card reader reads the proximity card, the control unit obtains one of the scheduled personnel data from the storage unit according to the personnel information, and the control unit determines whether the current time matches the time slot field corresponding to the one of the scheduled personnel data. When the control unit determines that the current time matches the time slot field corresponding to the one of the scheduled personnel data, the control unit unlock the electronic lock. Furthermore, an access control method is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:門禁管制系統</p>  
        <p type="p">110:電子鎖</p>  
        <p type="p">120:儲存單元</p>  
        <p type="p">130:感應卡讀取器</p>  
        <p type="p">140:控制單元</p>  
        <p type="p">A0、A1~AN:感應卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="298" publication-number="202619936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調把手位置的自行車龍頭組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">B62K21/16</main-classification>  
        <further-classification edition="200601120250114B">B62K21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈞成金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種可調把手位置的自行車龍頭組，包含：一車把豎管、一龍頭、一把手及一封閉件，該車把豎管與自行車前叉連動，該龍頭可為一體或分離設置於該車把豎管上端，並有非圓形的延伸管，該把手中間位置設有一組裝部，該把手以該組裝部可調整位置地組設於該延伸管上，該封閉件組設固定於該組裝部底側，用於對該延伸管施加壓力，使得該組裝部與該延伸管之間形成固定。藉以，而可靈活改變把手與車把豎管之間的距離，以滿足騎行者的需求，不僅提升騎行的舒適性與效率，還簡化生產過程，降低製造成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車把豎管</p>  
        <p type="p">20:龍頭</p>  
        <p type="p">21:延伸管</p>  
        <p type="p">211:中空部</p>  
        <p type="p">212:封蓋</p>  
        <p type="p">22:長槽</p>  
        <p type="p">23:刻度</p>  
        <p type="p">24:束套部</p>  
        <p type="p">241:開槽</p>  
        <p type="p">242:螺固元件</p>  
        <p type="p">30:把手</p>  
        <p type="p">31:組裝部</p>  
        <p type="p">311:滑槽</p>  
        <p type="p">312:螺孔</p>  
        <p type="p">40:封閉件</p>  
        <p type="p">41:固定孔</p>  
        <p type="p">42:螺固元件</p>  
        <p type="p">43:貫孔</p>  
        <p type="p">44:壓迫件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="299" publication-number="202621034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>振動能收集系統及方法</chinese-title>  
        <english-title>VIBRATION ENERGY COLLECTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H02N2/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, YU-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種振動能收集系統，用於收集畜牧養殖過程中至少一生物體產生的振動能，包括：能量轉換裝置，與至少一生物體接觸，用於基於壓電效應感測所述至少一生物體在活動過程中的振動並將所述振動轉換為電訊號；以及儲能裝置，與所述能量收集裝置電連接，用於基於所述電訊號儲存電能。本申請還提供一種振動能收集方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a vibration energy collection system for collecting vibration energy generated by at least one animal in a breeding process. The vibration energy collection system includes an energy conversion device and an energy storage device connected to the energy conversion device. The energy conversion device is in contact with the animal and is used to sense vibrations of the animal during a moving process based on a piezoelectric effect and to convert the vibration into an electrical signal. The energy storage device is used to store electrical energy based on the electrical signal. The present disclosure also provides a vibration energy collection method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:振動能收集系統</p>  
        <p type="p">10:能量轉換裝置</p>  
        <p type="p">20:儲能裝置</p>  
        <p type="p">30:用電裝置</p>  
        <p type="p">200:生物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="300" publication-number="202620713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>待稽核資料的數位化方法和數位化系統</chinese-title>  
        <english-title>DIGITALIZING METHOD AND SYSTEM FOR TO-BE-AUDITED DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">G06Q10/00</main-classification>  
        <further-classification edition="202301120260223B">G06Q40/12</further-classification>  
        <further-classification edition="201901120260223B">G06N20/00</further-classification>  
        <further-classification edition="202301120260223B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾法數位股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALFA DIGITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李以琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, ELIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種待稽核資料的數位化方法包含：識別用戶端提供的待查核的稽核清冊檔和各佐證檔中的字元，並利用人工智慧技術，將待查核的稽核清冊檔的字元編列成多個待稽核資料列以及從各佐證檔的字元中選出多筆佐證資料；然後將該些待稽核資料列和該些佐證檔配對，並且計算所有待稽核資料列的所有待稽核數值的待稽核總值及所有佐證檔的所有佐證數值的佐證總值；最後判斷該待稽核總值和該佐證總值的一致性，以驗證待稽核資料列與佐證檔的匹配的正確性。藉此，可自動且正確地數位化待稽核資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A digitalizing method for to-be-audited data includes: recognizing characters in a to-be-checked inventory file and supporting files, and compiling to-be-audited data rows from the characters of the to-be-checked inventory file and selecting instances of supporting data by AI technology; then, pairing to-be-audited data row and supporting file, adding up all to-be-audited values of the to-be-audited data rows to generate a to-be-audited total value, and adding up all supporting values of the supporting files to generate a supporting total value; and finally, checking consistency between the to-be-audited total value and the supporting total value to verify correctness of pairs of to-be-audited data row and supporting file. Therefore, the to-be-audited data can be automatically and correctly digitalized.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="301" publication-number="202620570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>避障運動載具</chinese-title>  
        <english-title>OBSTABLE AVOIDANCE MOTION CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241223B">G05D1/622</main-classification>  
        <further-classification edition="202401120241223B">G05D1/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘永太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YUNG-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHANG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種避障運動載具，其包括運動底座及旋轉模組。運動底座設置用以自主移動、轉向及旋轉。旋轉模組設置在運動底座上，並包括旋轉軸致動器及旋轉載板。旋轉軸致動器固定在運動底座上。旋轉載板設置在旋轉軸致動器上方並連接旋轉軸致動器，其中旋轉軸致動器設置用以旋轉以帶動旋轉載板相對於運動底座旋轉。避障運動載具可更包括第一平移模組及/或第二平移模組，以使第一平移模組的第一載板可沿第一水平軸移動及/或第二平移模組的第二載板可沿第二水平軸移動，以實現避障運動載具於水平方向上的避障性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An obstacle avoidance motion carrier includes a motion base and a rotation module. The motion base is configured to autonomously move, turn and rotate. The rotation module is disposed on the motion base and includes a rotation axis actuator and a rotation carrier plate. The rotation axis actuator is fixed on the motion base. The rotation carrier plate is disposed on the rotation axis actuator and connected to the rotation axis actuator, in which the rotation axis actuator is configured to rotate to drive the rotation carrier plate to rotate relative to the motion base. The obstacle avoidance motion carrier may further include a first horizontal movement module and/or a second horizontal movement module, so that a first carrier plate of the first horizontal movement module can move along a first horizontal axis and/or a second carrier plate of the second horizontal movement module can move along a second horizontal axis to achieve obstacle avoidance performance of the obstacle avoidance motion carrier in horizontal direction(s).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:主動輪</p>  
        <p type="p">112:從動輪</p>  
        <p type="p">120:旋轉模組</p>  
        <p type="p">121:旋轉軸致動器</p>  
        <p type="p">122:旋轉載板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="302" publication-number="202619824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射掃描系統及其方法</chinese-title>  
        <english-title>LASER SCANNING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250114B">B23K26/062</main-classification>  
        <further-classification edition="201401120250114B">B23K26/064</further-classification>  
        <further-classification edition="200601120250114B">G02B26/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新代科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNTEC TECHNOLOGY CO.LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜孜卉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, ZI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江禹安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡隸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭欽仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG, CHIN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射掃描系統及其方法，該控制單元接收加工檔與振鏡掃描模式計算用以驅動該振鏡驅動單元的掃描作動，且該振鏡的掃描作動實施為完全覆蓋該加工檔的一第一掃描路徑；該控制單元再根據該加工檔與該第一掃描路徑調整計算出一第二掃描路徑，且該第二掃描路徑將該加工檔區分為至少一等間距範圍的掃描路徑；最後，該控制單元再根據該第二掃描路徑輸出一振鏡掃描命令給該振鏡驅動單元，並輸出一開關命令給該雷射源，用以執行雷射加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser scanning system and method thereof. The control unit receives the processing file and the galvanometer scanning mode to calculate a scanning action for driving the galvanometer driving unit. And the scanning action of the galvanometer is implemented as a first scanning path that completely covers the processing file. The control unit then adjusts and calculates a second scanning path based on the processing file and the first scanning path. And the second scanning path divides the processing area into at least one equally spaced scanning path. Finally, the control unit outputs a galvanometer scanning command to the galvanometer driving unit according to the second scanning path. And output a switch command to the laser source to perform laser processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:雷射源</p>  
        <p type="p">120:振鏡驅動單元</p>  
        <p type="p">121:振鏡</p>  
        <p type="p">130:輸入單元</p>  
        <p type="p">131:加工檔</p>  
        <p type="p">140:儲存單元</p>  
        <p type="p">141:振鏡掃描模式</p>  
        <p type="p">150:控制單元</p>  
        <p type="p">151:振鏡掃描命令</p>  
        <p type="p">152:開關命令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="303" publication-number="202620845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聲音傳輸方法及其通訊裝置</chinese-title>  
        <english-title>SOUND TRANSMISSION METHOD AND COMMUNICATION DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250205B">G10L21/06</main-classification>  
        <further-classification edition="201301120250205B">G10L25/03</further-classification>  
        <further-classification edition="201301120250205B">G10L25/69</further-classification>  
        <further-classification edition="200601120250205B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明基電通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENQ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡振成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHEN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聲音傳輸方法，其係應用於一通訊裝置。該聲音傳輸方法包含有該通訊裝置之一運算單元將取得的一音頻訊號分解為具有一特定聲音元素的至少一音軌，該運算單元將該至少一音軌轉換為一符號文本，以及該運算單元利用該通訊裝置之一收發器傳送該符號文本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sound transmission method is applied to a communication device and includes utilizing an operation processor of the communication device to decompose an audio signal into at least one audio track having a specific sound element, utilizing the operation processor to transform the at least one audio track into a symbolic text, and utilizing a transceiver of the communication device to transmit the symbolic text.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S102、S104、S106、S108、S110、S112、S114、S116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="304" publication-number="202620119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡用液體組成物及隱形眼鏡產品</chinese-title>  
        <english-title>LIQUID COMPOSITION FOR CONTACT LENSES AND CONTACT LENS PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C08L5/08</main-classification>  
        <further-classification edition="200601120241205B">C08L43/02</further-classification>  
        <further-classification edition="200601120241205B">C08K3/16</further-classification>  
        <further-classification edition="200601120241205B">C08K3/38</further-classification>  
        <further-classification edition="200601120241205B">C08K3/32</further-classification>  
        <further-classification edition="200601120241205B">G02C7/04</further-classification>  
        <further-classification edition="200601120241205B">G02C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶碩光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGAVISION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張漢宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳君涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯彥均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃民揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MIN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉瑋安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種隱形眼鏡用液體組成物及隱形眼鏡產品，其包含：第一親水性成分、第二親水性成分、無機鹽類、及液態水。第一親水性成分含量不大於1重量%。第一親水性成分為一具有磷酸膽鹼（phosphorylcholine）基的聚合物，且具有不小於4,000 Da 的一第一重量平均分子量。第二親水性成分的含量不大於1重量%。第二親水性成分為一玻尿酸或其鹽，且具有不大於10,000 Da的一第二重量平均分子量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid composition for contact lenses and a contact lens product, which include: a first hydrophilic component, a second hydrophilic component, inorganic salts, and liquid water. The content of the first hydrophilic component is not more than 1% by weight. The first hydrophilic component is a polymer having a phosphorylcholine group and has a first weight average molecular weight of not less than 4,000 Da. The content of the second hydrophilic component is not more than 1% by weight. The second hydrophilic component is hyaluronic acid or a salt thereof, and has a second weight average molecular weight of not more than 10,000 Da.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="305" publication-number="202621053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>準位偏移器</chinese-title>  
        <english-title>LEVEL SHIFTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H03K19/0185</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙祐磁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, YU-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程智修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JHIH-SIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種準位偏移器，設置於晶粒中。準位偏移器包括上拉電晶體、第一下拉電晶體、第二下拉電晶體以及控制電路。上拉電晶體的第一端接收高於晶粒的基底電壓的第一電源電壓。第一下拉電晶體的第一端接收低於基底電壓的第二電源電壓。第二下拉電晶體耦接於第一下拉電晶體與上拉電晶體之間。上拉電晶體的第二端耦接至準位偏移器的輸出端。控制電路的輸入端耦接至準位偏移器的輸入端。控制電路的不同輸出端分別耦接至上拉電晶體、第二下拉電晶體與第一下拉電晶體的控制端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a level shifter arranged in a die. The level shifter includes a pull-up transistor, a first pull-down transistor, a second pull-down transistor and a control circuit. A first terminal of the pull-up transistor receives a first power voltage higher than a substrate voltage of the die. A first terminal of the first pull-down transistor receives a second power voltage lower than the substrate voltage. The second pull-down transistor is coupled between the first pull-down transistor and the pull-up transistor. A second terminal of the pull-up transistor is coupled to an output terminal of the level shifter. An input terminal of the control circuit is coupled to an input terminal of the level shifter. Different output terminals of the control circuit are respectively coupled to the control terminals of the pull-up transistor, the second pull-down transistor and the first pull-down transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:準位偏移器</p>  
        <p type="p">210:控制電路</p>  
        <p type="p">211:邏輯電路</p>  
        <p type="p">212、213、214、215:驅動器</p>  
        <p type="p">LVSH_IN2:輸入端</p>  
        <p type="p">LVSH_OUT2:輸出端</p>  
        <p type="p">N21、N22:下拉電晶體</p>  
        <p type="p">N23:電荷分享電晶體</p>  
        <p type="p">P21:上拉電晶體</p>  
        <p type="p">VBOOT、VBOOT_REG:節點電壓</p>  
        <p type="p">VCS2:電荷分享電壓</p>  
        <p type="p">VGBS、VGCS、VGHS、VGLS:控制訊號</p>  
        <p type="p">VGH2、VGL2、VHS_REG、VLS_REG:電源電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="306" publication-number="202619702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層微型顆粒及其製造方法</chinese-title>  
        <english-title>MULTI-LAYERED MICRO-PARTICLES AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K9/16</main-classification>  
        <further-classification edition="200601120250501B">A61K47/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葡萄王生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAPE KING BIO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勁初</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炎鍊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靖倚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林定威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱心彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HSIN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多層微型顆粒及其製造方法，多層微型顆粒包含核心、內層及外層，內層係由活性成分及輔料混合而成，且可透過外層達成減緩吸濕及緩釋的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclose provides a multi-layered micro-particle and the manufacturing method thereof. The multi-layered micro-particle comprises a core, inner layer, and outer layer. The inner layer can contain mixed active substances and excipients, and the outer layer can achieve the effects of moisture absorption reduction and controlled release.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多層微型顆粒</p>  
        <p type="p">10:核心</p>  
        <p type="p">20:內層</p>  
        <p type="p">30:外層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="307" publication-number="202619637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鞋用強化結構</chinese-title>  
        <english-title>REINFORCED STRUCTURE FOR FOOTWEAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">A43B13/14</main-classification>  
        <further-classification edition="200601120250116B">A43B13/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鞋用強化結構，其包含至少二個強化構造以及複數個桿體，複數個該桿體間隔地設置於各該強化構造之間，各該桿體之一長度方向的至少一部分設於一共平面，使相鄰的二個該強化構造與該共平面形成一間隔，並在各該強化構造以及各該桿體之間使用至少一連接結構朝一寬度方向連接，並使該鞋用強化構造可以於該長度方向以及該寬度方向延伸，當該鞋用強化結構用於一鞋底時可使該鞋底達到高穩定性，並且可以平衡整體鞋子的剛性以及靈活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reinforced structure for footwear includes at least two reinforcement structures and multiple rods. These rods are spaced apart between each reinforcement structure, with at least a portion of the length direction of each rod positioned on a common plane. This arrangement creates a gap between two adjacent reinforcement structures and connects the reinforcement structures and the rods using at least one connecting structure in the width direction. This shoe reinforcement structure can extend in both the length and width directions, allowing the sole to achieve high stability while balancing the overall rigidity and flexibility of the shoe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鞋用強化結構</p>  
        <p type="p">11A,11B:強化構造</p>  
        <p type="p">111:桿體</p>  
        <p type="p">112A,112B:連接部</p>  
        <p type="p">12:連接結構</p>  
        <p type="p">A:足前區</p>  
        <p type="p">B:足弓區</p>  
        <p type="p">C:足跟區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="308" publication-number="202620817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工程測量計算試題生成系統及方法</chinese-title>  
        <english-title>ENGINEERING MEASUREMENT CALCULATION TEST QUESTION GENERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">G09B7/00</main-classification>  
        <further-classification edition="202001120250206B">G06F30/10</further-classification>  
        <further-classification edition="201201120250206B">G06Q50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立彰化師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHANGHUA UNIVERSITY OF EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭武田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, WU-TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚凱超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KAI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種工程測量計算試題生成系統，其設置於應用程式，終端裝置執行應用程式，系統包含有一試卷介面模組、一隨機生成模組及一匯出模組。試卷介面模組具有至少一試卷資料，試卷資料具有編號欄位，供使用者填寫編號資料；隨機生成模組與試卷介面模組耦接，隨機生成模組接收試卷資料，隨機生成模組生成計算資訊資料與解題資訊資料，當使用者每次於編號欄位填寫編號資料時，隨機生成模組會產生不同的作答試卷資料及解答試卷資料；匯出模組與隨機生成模組耦接，藉以將試卷資料匯出至終端裝置。藉此，令使用者能有效進行試題練習。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An engineering measurement calculation test question generation system, which is arranged in an application, and the terminal device executes the application, and the system comprises a test paper interface module, a random generation module and an export module. The test paper interface module has at least one test paper data, and the test paper data has a numbering field for the user to fill in the numbered data; The random generation module is coupled with the test paper interface module, the random generation module receives the test paper data, the random generation module generates the calculation information data and the solution information data, and when the user fills in the number data in the number field each time, the random generation module will produce different answer test paper data and answer test paper data; The export module is coupled with the random generation module to export the test paper data to the terminal device. Thus, users can effectively practice the test questions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工程測量計算試題生成系統</p>  
        <p type="p">1:應用程式</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">10:試卷介面模組</p>  
        <p type="p">12:鎖定單元</p>  
        <p type="p">20:隨機生成模組</p>  
        <p type="p">30:匯出模組</p>  
        <p type="p">40:試卷資料庫</p>  
        <p type="p">50:輸出裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="309" publication-number="202621043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單級雜訊濾波器</chinese-title>  
        <english-title>SINGLE-STAGE NOISE FILTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250208B">H03H7/01</main-classification>  
        <further-classification edition="200601120250208B">H03H9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚宇桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAU, YEU-TORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種單級雜訊濾波器，其包含有一第一線圈組、一耦合電容組及一第二線圈組。第一線圈組具有一第一連接端；耦合電容組與第一線圈組連接，耦合電容組具有一第一耦合電容、一第二耦合電容及一第三耦合電容，第一耦合電容具有一第一耦合端及一第二耦合端，第一耦合端與第二耦合端分別連接於第二耦合電容與第三耦合電容；第二線圈組與耦合電容組連接，第二線圈組具有一第二連接端，第二連接端與第一耦合電容的第二耦合端連接，使第一耦合電容連接於第一線圈組與第二線圈組之間。藉此，本揭露能有效消除差模雜訊及共模雜訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A single-stage noise filter consisting of a first coil bank, a coupling capacitor bank, and a second coil bank. The first coil bank has a first connecting end; The coupling capacitor bank is connected with the first coil bank, the coupling capacitance bank has a first coupling capacitance, a second coupling capacitor and a third coupling capacitance, the first coupling capacitor has a first coupling end and a second coupling end, and the first coupling end and the second coupling end are respectively connected to the second coupling capacitor and the third coupling capacitance; The second coil bank is connected with the coupling capacitor bank, the second coil bank has a second connecting end, and the second connecting end is connected with the second coupling end of the first coupling capacitor, so that the first coupling capacitor is connected between the first coil bank and the second coil bank. Thus, this disclosure can effectively eliminate differential mode noise and common mode noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:單級雜訊濾波器</p>  
        <p type="p">10:第一線圈組</p>  
        <p type="p">11:第一繞組</p>  
        <p type="p">12:第二繞組</p>  
        <p type="p">20:耦合電容組</p>  
        <p type="p">21:第一耦合電容</p>  
        <p type="p">211:第一耦合端</p>  
        <p type="p">212:第二耦合端</p>  
        <p type="p">22:第二耦合電容</p>  
        <p type="p">23:第三耦合電容</p>  
        <p type="p">30:第二線圈組</p>  
        <p type="p">31:第三繞組</p>  
        <p type="p">32:第四繞組</p>  
        <p type="p">40:整流器</p>  
        <p type="p">41:第一輸出端</p>  
        <p type="p">42:第二輸出端</p>  
        <p type="p">50:功率因數修正器</p>  
        <p type="p">51:第一電容</p>  
        <p type="p">52:第一電感</p>  
        <p type="p">53:第一二極體</p>  
        <p type="p">54:電晶體</p>  
        <p type="p">55:第二電容</p>  
        <p type="p">56:第二二極體</p>  
        <p type="p">57:第三電容</p>  
        <p type="p">60:降壓器</p>  
        <p type="p">61:第四電容</p>  
        <p type="p">62:電阻</p>  
        <p type="p">63:第二電感</p>  
        <p type="p">64:第三二極體</p>  
        <p type="p">65:第四二極體</p>  
        <p type="p">66:第五電容</p>  
        <p type="p">67:第六電容</p>  
        <p type="p">68:第七電容</p>  
        <p type="p">AC:交流電源</p>  
        <p type="p">GND:接地</p>  
        <p type="p">LISN:電源阻抗穩定電路</p>  
        <p type="p">P1:第一連接端</p>  
        <p type="p">P2:第二連接端</p>  
        <p type="p">S:電源電路</p>  
        <p type="p">SW:開關</p>  
        <p type="p">T:變壓器</p>  
        <p type="p">T1:一次側線圈</p>  
        <p type="p">T2:二次側線圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="310" publication-number="202620522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射式顯示面板</chinese-title>  
        <english-title>REFLECTIVE DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀚宇彩晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉政諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高翎誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張少謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHAO-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱靖雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, JING-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅祈恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, QI-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種反射式顯示面板包括第一基板、第二基板、第一畫素結構、第二畫素結構、彩色濾光層及顯示介質層。顯示介質層設置在第一基板與第二基板之間。第一基板上的第一畫素結構與第二畫素結構分別具有第一反射電極與第二反射電極。彩色濾光層設置在第一反射電極與第二反射電極各自的反射面的一側，且包括濾光顏色彼此不同的第一濾光圖案和第二濾光圖案。第一濾光圖案在第一反射電極的反射面上的正投影面積對第一反射電極的反射面的面積的百分比值大於第二濾光圖案在第二反射電極的反射面上的正投影面積對第二反射電極的反射面的面積的百分比值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reflective display panel including a first substrate, a second substrate, a first pixel structure, a second pixel structure, a color filter layer and a display medium layer is provided. The display medium layer is disposed between the first substrate and the second substrate. The first pixel structure and the second pixel structure on first substrate respectively have a first reflective electrode and a second reflective electrode. The color filter layer is disposed on a side of a reflective surface of each of the first reflective electrode and the second reflective electrode, and includes a first filter pattern and a second filter pattern having different filter colors. A percentage of an orthographic projection area of the first filter pattern on the reflective surface of the first reflective electrode to an area of the reflective surface of the first reflective electrode is greater than a percentage of an orthographic projection area of the second filter pattern on the reflective surface of the second reflective electrode to an area of the reflective surface of the second reflective electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:反射式顯示面板</p>  
        <p type="p">CFL:彩色濾光層</p>  
        <p type="p">FP1、FP2、FP3:濾光圖案</p>  
        <p type="p">OP1、OP2:開口</p>  
        <p type="p">PX1、PX2、PX3:畫素結構</p>  
        <p type="p">RE1、RE2、RE3:反射電極</p>  
        <p type="p">TP1、TP2:透明圖案</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="311" publication-number="202620511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭戴式裝置</chinese-title>  
        <english-title>HEAD-MOUNTED DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G02B27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱正弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, JENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, WEN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種頭戴式裝置，包括一支架、一彈性連動架及一驅動結構。支架包括一弧形彈性主體及兩夾持部，其中兩夾持部分別位於弧形彈性主體的相反兩端。彈性連動架位於弧形彈性主體的一側，且具有兩連接端及位於兩連接端之間的一第一中央部，兩連接端連接於弧形彈性主體。驅動結構配置於弧形彈性主體與第一中央部之間，其中驅動結構適於驅動第一中央部遠離弧形彈性主體，使彈性連動架帶動弧形彈性主體擴張而讓兩夾持部彼此遠離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head-mounted device includes a bracket, an elastic linkage and a driving structure. The bracket includes an arc-shaped elastic body and two clamping parts. The two clamping parts are respectively located at opposite ends of the arc-shaped elastic body. The elastic linkage is located at a side of the arc-shaped elastic body, and has two connecting ends and a first central part located between the two connecting ends. The two connecting ends are connected to the arc-shaped elastic body. The driving structure is disposed between the arc-shaped elastic body and the first central part, wherein the driving structure is adapted to drive the first central part away from the arc-shaped elastic body, so that the elastic linkage drives the arc-shaped elastic body to expand, such that the two clamping parts are away from each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:支架</p>  
        <p type="p">112:弧形彈性主體</p>  
        <p type="p">1121:第二中央部</p>  
        <p type="p">114:夾持部</p>  
        <p type="p">120:彈性連動架</p>  
        <p type="p">122:連接端</p>  
        <p type="p">124:第一中央部</p>  
        <p type="p">130:驅動結構</p>  
        <p type="p">132:按壓片</p>  
        <p type="p">1321:基端</p>  
        <p type="p">1322:抵頂端</p>  
        <p type="p">140:緩衝材</p>  
        <p type="p">D:方向</p>  
        <p type="p">S:弧面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="312" publication-number="202620697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人工智慧溝通工具的訓練方法以及電子裝置</chinese-title>  
        <english-title>TRAINING METHOD FOR ARTIFICIAL INTELLIGENCE COMMUNICATION TOOL AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250207B">G06N3/08</main-classification>  
        <further-classification edition="202001120250207B">G06F30/27</further-classification>  
        <further-classification edition="200601120250207B">G06N3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭秉超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, ADRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於人工智慧溝通工具的訓練方法以及以及電子裝置。訓練方法包括：由人工智慧溝通工具提供溝通結果，並接收對應於溝通結果的修正提示；由提示分析模型依據修正提示產生至少一答案，並依據所述至少一答案產生修正提示與至少一答案之間的至少一相似度；以及由提示分析模型分析依據至少一相似度從所述至少一答案中選擇出優化答案，依據優化答案來修正溝通結果以產生修正後溝通結果，並將修正後溝通結果提供至人工智慧溝通工具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A training method for artificial intelligence communication tools and an electronic device are provided. The training method includes: providing communication results by the artificial intelligence communication tool, and receiving correction prompts corresponding to the communication results; generating at least one answer based on the correction prompts by a prompt analysis model, and generating at least one similarity between the correction prompts and at least one answer based on at least one answer; and selecting an optimize answer from at least one answer based on the at least one similarity by prompt analysis model analysis, correcting the communication result based on the optimize answer to generate a corrected communication result, the corrected communication results are provided to the artificial intelligence communication tool.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:訓練方法</p>  
        <p type="p">S110~S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="313" publication-number="202619678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內視鏡裝置及其內視影像擷取模組</chinese-title>  
        <english-title>ENDOSCOPE DEVICE AND ENDOSCOPE IMAGE CAPTURING MODULE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B1/005</main-classification>  
        <further-classification edition="200601120241125B">A61B1/05</further-classification>  
        <further-classification edition="200601120241125B">A61B1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮晶生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTEK BIOTECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡永隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾德昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, TE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧錫新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOO, HSI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種內視鏡裝置包含中空管及內視影像擷取模組。內視影像擷取模組連接於中空管之伸入前端且包含殼體、內裝支架及可撓性電路板。內裝支架具有主支架部及二支架臂部，二支架臂部各自可撓曲地連接於主支架部之兩側且向前延伸以界定容置凹口。可撓性電路板具有主板部、二側臂板部及鏡頭板部，二側臂板部分別安裝有照明光源且向前彎折形成以設置於二支架臂部上，使得可撓性電路板安裝於內裝支架上。鏡頭板部自主板部向前延伸以彎折裝設於主支架部上且容設於容置凹口中。二支架臂部可撓曲地抵接殼體之內壁，使得內裝支架可拆卸地插設於殼體中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An endoscope device includes a tube and an image capturing module. The image capturing module is connected to a front end of the tube and includes a housing, a flexible circuit board, and an inner holder having a main frame and two arms flexibly connected to two sides of the main frame and extending forward to define a notch. The flexible circuit board has a main board, two lateral boards and a lens board. The two lateral boards have light sources mounted thereon and bend forward to be disposed on the two arms, so that the flexible circuit board mounted on the inner holder. The lens board extends forward from the main board to be bent and mounted on the main frame and contained within the notch. The two arms flexibly abut against an inner wall of the housing to make the inner holder detachably inserted into the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:內視影像擷取模組</p>  
        <p type="p">16:殼體</p>  
        <p type="p">18:內裝支架</p>  
        <p type="p">20:可撓性電路板</p>  
        <p type="p">22:主支架部</p>  
        <p type="p">24:支架臂部</p>  
        <p type="p">25:可撓臂段</p>  
        <p type="p">26:容置凹口</p>  
        <p type="p">28:主板部</p>  
        <p type="p">30:側臂板部</p>  
        <p type="p">32:鏡頭板部</p>  
        <p type="p">34:照明光源</p>  
        <p type="p">V:垂直中心面</p>  
        <p type="p">S:安裝空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="314" publication-number="202619634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>香菇梗切除輸送結構</chinese-title>  
        <english-title>MUSHROOM STEM REMOVAL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A23N15/04</main-classification>  
        <further-classification edition="200601120241130B">A23N15/00</further-classification>  
        <further-classification edition="200601120241130B">B65G15/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種香菇梗切除輸送結構，包含有：一基架；一驅動裝置，設於該基架；一輸送裝置，設於該基架，具有複數個輸送帶並排設置並連接於該驅動裝置，被該驅動裝置驅動而沿一移動方向轉動，用以輸送複數個香菇；其中每二該相鄰之輸送帶之間形成有一間隙，用以容置該等香菇之香菇梗；一投放裝置，具有複數個中空之投放件位於該輸送裝置之一端上方分別對應於該輸送裝置之該等間隙；每一該投放件內部具有一投放通道，兩端分別具有一開口，用以供投放該等香菇至該等輸送帶；一切斷裝置，具有複數個切刀組分別位於該等輸送帶下方，用以切斷通過該切刀組之該等香菇之香菇梗；以及一撥動裝置，具有複數個撥動件分別對應於該輸送裝置之該等間隙，用以在接觸該等香菇時將該香菇撥動成香菇梗伸入該間隙的方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mushroom stem removal structure comprises: a base frame; a driving device installed on the base frame; a conveying device installed on the base frame, having multiple conveyor belts arranged in parallel and connected to the driving device, driven by the driving device to rotate along a moving direction to convey multiple mushrooms. A gap is formed between each pair of adjacent conveyor belts to accommodate the mushroom stems; a dispensing device with multiple hollow dispensing components positioned above one end of the conveying device, corresponding to each gap of the conveying device. Each dispensing device has an internal dispensing channel with openings at both ends, allowing the mushrooms to be dispensed onto the conveyor belts; a cutting device with multiple cutter assemblies located below the conveyor belts, used to cut the stems of the mushrooms passing through the cutter assemblies; and a pushing device with multiple pushing elements corresponding to each gap of the conveying device, designed to adjust the orientation of each mushroom so that the stem extends into the gap upon contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:香菇梗切除輸送結構</p>  
        <p type="p">10:基架</p>  
        <p type="p">20:驅動裝置</p>  
        <p type="p">30:輸送裝置</p>  
        <p type="p">40:投放裝置</p>  
        <p type="p">50:切斷裝置</p>  
        <p type="p">60:撥動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="315" publication-number="202621093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於行動網路的網路功能修復程序之決策系統及其方法</chinese-title>  
        <english-title>DECISION-MAKING SYSTEM IN THE NETWORK FUNCTION RESTORATION PROCEDURES OF MOBILE NETWORK AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L41/14</main-classification>  
        <further-classification edition="202201120250303B">H04L41/149</further-classification>  
        <further-classification edition="202201120250303B">H04L41/16</further-classification>  
        <further-classification edition="200901120250303B">H04W24/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周漢平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HAN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於行動網路的網路功能修復程序之決策系統及其方法，系統包括資料收集模組、資料預處理模組、機器學習模組以及最佳化演算法與決策生成模組。資料收集模組獲取網路功能狀態相關資料。資料預處理模組對網路功能狀態相關資料進行轉換處理。機器學習模組依據各預測模型以及網路功能狀態相關資料獲取與各預測模型對應的各修復建議概率分佈，並且依據各預測模型的權重以及各修復建議概率分佈獲取修復程序決策。最佳化演算法與決策生成模組依據最佳化演算法以及修復程序決策獲取最佳修復程序決策。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A decision-making system in the network function restoration procedures of mobile network and method thereof are provided, the system includes a data collection module, a data preprocessing module, a machine learning module and an optimization algorithm and decision generation module. The data collection module obtains network function status related data. The data preprocessing module converts the network function status related data. The machine learning module obtains each repair recommendation probability distribution corresponding to each prediction model according to each prediction model and the network functional status related data, and obtains a repair program decision according to weight of each prediction model and each repair recommendation probability distribution. The optimization algorithm and decision generation module obtains a best repair program decision according to an optimization algorithm and the repair program decision.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:資料收集模組</p>  
        <p type="p">20:資料預處理模組</p>  
        <p type="p">30:機器學習模組</p>  
        <p type="p">40:最佳化演算法與決策生成模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="316" publication-number="202619681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測裝置和偵測方法</chinese-title>  
        <english-title>DETECTION DEVICE AND DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A61B5/0205</main-classification>  
        <further-classification edition="200601120241204B">A61B5/021</further-classification>  
        <further-classification edition="200601120241204B">A61B5/0235</further-classification>  
        <further-classification edition="200601120241204B">A61B5/1455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊熠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測裝置，包括：一聲音產生器、一光學發射器、一複合波導、一光學接收器、一處理器，以及一外殼元件。聲音產生器可產生一聲音信號。光學發射器可產生一入射光信號。複合波導可傳送聲音信號和入射光信號至一人體部份，使得人體部份回傳一反射光信號至複合波導。複合波導更可根據入射光信號和反射光信號來產生一混合光信號。光學接收器可接收混合光信號。處理器係耦接至光學接收器，其中處理器可根據混合光信號來取得人體部份之一生理資訊。聲音產生器、光學發射器、複合波導、光學接收器，以及處理器皆設置於外殼元件之內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection device includes a sound generator, an optical transmitter, a compound waveguide, an optical receiver, a processor, and a housing element. The sound generator generates a sound signal. The optical transmitter generates an incident light signal. The compound waveguide transmits the sound signal and the incident light signal to a human body portion. Thus, the human body portion transmits a reflected light signal back to the compound waveguide. The compound waveguide further generates a mixed light signal according to the incident light signal and the reflected light signal. The optical receiver receives the mixed light signal. The processor is coupled to the optical receiver. The processor obtains the physiological information of the human body portion according to the mixed light signal. The sound generator, the optical transmitter, the compound waveguide, the optical receiver, and the processor are disposed inside the housing element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:偵測裝置</p>  
        <p type="p">110:聲音產生器</p>  
        <p type="p">120:光學發射器</p>  
        <p type="p">130:複合波導</p>  
        <p type="p">140:光學接收器</p>  
        <p type="p">150:處理器</p>  
        <p type="p">160:外殼元件</p>  
        <p type="p">190:人體部份</p>  
        <p type="p">IA:生理資訊</p>  
        <p type="p">SR:反射光信號</p>  
        <p type="p">ST:入射光信號</p>  
        <p type="p">SU:聲音信號</p>  
        <p type="p">SX:混合光信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="317" publication-number="202620872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體布局圖案以及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR LAYOUT PATTERN AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">G11C15/04</main-classification>  
        <further-classification edition="202001120250206B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭有策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHU-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊孟屏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MENG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體布局圖案，包含一基底，基底上有兩個內容可定址記憶體(Content Addressable Memory, CAM)單元排列於一對稱軸的兩側，以及一第一匹配線(matching line，ML)導電層以及一第二匹配線導電層位於基底上，其中從一上視圖來看，第一匹配線導電層以及第二匹配線導電層與兩個內容可定址記憶體單元之間的對稱軸重疊，且沿著對稱軸的方向排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a semiconductor layout pattern, which comprises a substrate, wherein two content addressable memory cells are disposed on the substrate and arranged on two sides of an axis of symmetry, and a first matching line conductive layer and a second matching line conductive layer are located on the substrate, wherein from a top view, the first matching line conductive layer and the second matching line conductive layer overlap the symmetry axis between the two content addressable memory cells and are arranged along the direction of the symmetry axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:十電晶體單元(內容可定址記憶體)</p>  
        <p type="p">4:十電晶體單元(內容可定址記憶體)</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLB:位元線</p>  
        <p type="p">E1:交界線(對稱軸)</p>  
        <p type="p">F:鰭狀結構</p>  
        <p type="p">G:閘極結構</p>  
        <p type="p">MD:導電層</p>  
        <p type="p">MD1:導電層(第一匹配線導電層)</p>  
        <p type="p">MD4:導電層(第二匹配線導電層)</p>  
        <p type="p">MD5:導電層(位元線導電層)</p>  
        <p type="p">MD6:導電層(Vcc電壓源導電層)</p>  
        <p type="p">MD7:導電層(Vss電壓源導電層)</p>  
        <p type="p">MD8:導電層(第一Vss電壓源導電層)</p>  
        <p type="p">MD9:導電層(第二Vss電壓源導電層)</p>  
        <p type="p">MD10:導電層(Vcc電壓源導電層)</p>  
        <p type="p">MD11:導電層(位元線導電層)</p>  
        <p type="p">MD12:導電層(第三Vss電壓源導電層)</p>  
        <p type="p">ML:匹配線</p>  
        <p type="p">MP:導電層</p>  
        <p type="p">PU1:第一上拉電晶體</p>  
        <p type="p">PU2:第二上拉電晶體</p>  
        <p type="p">PD1:第一下拉電晶體</p>  
        <p type="p">PD2:第二下拉電晶體</p>  
        <p type="p">PG1:第一傳輸閘電晶體</p>  
        <p type="p">PG2:第二傳輸閘電晶體</p>  
        <p type="p">R1、R2:區域</p>  
        <p type="p">SL1:搜尋線</p>  
        <p type="p">SL2:搜尋線</p>  
        <p type="p">SL1B:搜尋線</p>  
        <p type="p">SL2B:搜尋線</p>  
        <p type="p">T1:第一電晶體</p>  
        <p type="p">T2:第二電晶體</p>  
        <p type="p">T3:第三電晶體</p>  
        <p type="p">T4:第四電晶體</p>  
        <p type="p">V0:接觸通孔</p>  
        <p type="p">Vcc:電壓源</p>  
        <p type="p">Vss:電壓源</p>  
        <p type="p">WL1:字元線</p>  
        <p type="p">WL2:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="318" publication-number="202620762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資產弱點告警方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF ASSET VULNERABILITY ALARM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250207B">G06Q40/06</main-classification>  
        <further-classification edition="202301120250207B">G06Q10/06</further-classification>  
        <further-classification edition="200601120250207B">G06Q90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬皇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒宗諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, ZONG-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資產弱點告警系統，包含一用來執行以下操作的伺服器：獲得多個待分析軟硬體資產每一者的資產資料；根據一弱點資料集及該等資產資料，獲得至少一潛在弱點及每一潛在弱點的一潛在弱點資料；利用一漏洞預測評分系統產生每一潛在弱點的一弱點利用分數；利用生成式人工智慧技術產生每一潛在弱點的一弱點描述摘要及一弱點修復建議；根據每一潛在弱點的該潛在弱點資料、該弱點利用分數、該弱點描述摘要及該弱點修復建議產生相對應的資產弱點紀錄並將其儲存；根據該至少一資產弱點紀錄產生一資產弱點報告並將其發送至一用戶端裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system of asset vulnerability alarm includes a server that is configured to perform the following operations: obtaining asset data for each of multiple to-be-analyzed software and hardware assets; obtaining at least one potential vulnerability and a potential vulnerability data for each potential vulnerability based on a vulnerability data set and the asset data; utilizing an exploit prediction scoring system to generate a vulnerability exploitation score for each potential vulnerability; utilizing generative artificial intelligence technology to generate a vulnerability description summary and a vulnerability repair recommendation for each potential vulnerability; generating a corresponding asset vulnerability record based on the potential vulnerability data, the vulnerability exploitation score, the vulnerability description summary and the vulnerability repair recommendation of each potential vulnerability; storing the at least one asset vulnerability record; and generating an asset vulnerability report based on the at least one asset vulnerability record and send it to a client device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資產弱點告警系統</p>  
        <p type="p">11:伺服器</p>  
        <p type="p">111:儲存模組</p>  
        <p type="p">112:弱點管理模組</p>  
        <p type="p">113:資產發現模組</p>  
        <p type="p">114:弱點識別模組</p>  
        <p type="p">115:資產弱點評估模組</p>  
        <p type="p">116:告警模組</p>  
        <p type="p">12:弱點追蹤平臺</p>  
        <p type="p">2:用戶端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="319" publication-number="202620585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>時脈自控電路以及時脈訊號產生方法</chinese-title>  
        <english-title>CLOCK SELF-CONTROL CIRCUIT AND CLOCK SIGNAL GENERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250205B">G06F1/04</main-classification>  
        <further-classification edition="201401120250205B">H03K5/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳匯尊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-TZUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江協翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSIEH-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種時脈自控電路，包含：一時脈訊號產生電路，用以根據一時脈致能訊號產生一目標時脈訊號；以及一目標電路，用以接收該目標時脈訊號，根據該目標時脈訊號動作且用以產生該時脈致能訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clock automatic control circuit comprising: a clock signal generating circuit for generating a target clock signal based on a clock enable signal; and a target circuit for receiving the target clock signal, acting according to the target clock signal and generating the clock enable signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:時脈自控電路</p>  
        <p type="p">101:時脈訊號產生電路</p>  
        <p type="p">103:目標電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="320" publication-number="202619848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棘輪扳手頭及其驅動裝置改良結構</chinese-title>  
        <english-title>IMPROVED STRUCTURE OF A RATCHET WRENCH HEAD AND ITS DRIVING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250115B">B25B13/46</main-classification>  
        <further-classification edition="200601120250115B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田勤工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYAN CHYNIS INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林峻羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種棘輪扳手頭及其驅動裝置改良結構，其應用樞接於一控制握柄，係包括一工具頭座、一驅動組及一傳動組，其中該驅動組設有驅動傘齒柱，而該傳動組設有相對嚙合進行傳動之中空傘齒盤，且該驅動組及傳動組容設於工具頭座中，使其運行之轉速可自由配制，另該傳動組設有相互嚙合之傳動中空前棘齒柱及傳動中空後棘齒固定環，以進行順時針定點轉動與逆時針止動控制，增加結構運行強度及耐用度，以達結構耐用性、結構穩定性及使用功能性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an improved structure for a ratchet wrench head and its driving mechanism, pivotally connected to a control handle. This structure includes a tool head base, a driving assembly, and a transmission assembly. The driving assembly comprises a drive bevel gear post, while the transmission assembly features a hollow bevel gear disk that meshes with the drive gear for torque transmission. Both assemblies are housed within the tool head base, allowing the operational speed to be freely adjusted. Additionally, the transmission assembly includes an interlocking hollow front ratchet post and a hollow rear ratchet fixing ring, providing clockwise rotation control and counterclockwise locking. This design enhances the operational strength, durability, structural stability, and functional performance of the ratchet wrench head.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工具頭座</p>  
        <p type="p">11:上傳動座部</p>  
        <p type="p">110:前開口</p>  
        <p type="p">111:傳動內容置腔</p>  
        <p type="p">112:後開口</p>  
        <p type="p">113:環緣內表面</p>  
        <p type="p">113A:定位凸塊</p>  
        <p type="p">113B:卡制凹環槽</p>  
        <p type="p">12:下驅動座部</p>  
        <p type="p">120:驅動內容置腔</p>  
        <p type="p">121:定位容置區段</p>  
        <p type="p">122:階級環槽</p>  
        <p type="p">20:驅動組</p>  
        <p type="p">21:驅動傘齒柱</p>  
        <p type="p">210:垂直向驅動傘齒盤</p>  
        <p type="p">22:驅動軸承</p>  
        <p type="p">23:中空固定盤</p>  
        <p type="p">30:傳動組</p>  
        <p type="p">31:前傳動組件</p>  
        <p type="p">310:起子頭</p>  
        <p type="p">311:前封蓋穿孔環</p>  
        <p type="p">312:傳動中空傘齒盤</p>  
        <p type="p">313:傳動中空前棘齒柱</p>  
        <p type="p">313A:前棘齒部</p>  
        <p type="p">314:抵持固定環</p>  
        <p type="p">32:後固定組件</p>  
        <p type="p">320:傳動中空後棘齒固定環</p>  
        <p type="p">320A:後棘齒部</p>  
        <p type="p">320B:定位卡槽</p>  
        <p type="p">321:後封蓋穿孔環</p>  
        <p type="p">322:抵持彈簧</p>  
        <p type="p">33:彈性固定片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="321" publication-number="202620210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅鎳合金及其製造方法</chinese-title>  
        <english-title>COPPER-NICKEL ALLOY AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241115B">C22C9/06</main-classification>  
        <further-classification edition="200601120241115B">C22C1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣承學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHENG HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種銅鎳合金及其製造方法。基於銅鎳合金的重量為100 wt%，銅鎳合金包含10 wt%至30 wt%的鎳；0.4 wt%至2 wt%的鐵；0.5 wt%至1.2 wt%的錳；0.02 wt%至0.2 wt%的硼；以及其餘為銅及不可避免的雜質。藉此，可提高銅鎳合金的耐蝕性，並改善其加工成形性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A copper-nickel alloy and a method of forming the same are provided. Based on a weight of the cooper-nickel alloy as 100 wt%, the cooper-nickel alloy includes nickel in a range between 10 wt% and 30 wt%, iron in a range between 0.4 wt% and 2 wt%, manganese in range between 0.5 wt% and 1.2 wt%, boron in a range between 0.02 wt% and 0.2 wt%, and the rest is copper and unavoidable impurities. Therefore, a corrosion-resistance of the cooper-nickel alloy can be increased, and a formability of the cooper-nickel alloy ingo can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="322" publication-number="202620198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測肺炎披衣菌的引子對、套組及方法</chinese-title>  
        <english-title>PRIMER PAIR, KIT AND METHOD FOR DETECTING CHLAMYDIA PNEUMONIAE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250501B">C12Q1/689</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈玉涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張琇惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種檢測肺炎披衣菌的引子對，引子對包含針對肽聚醣相關脂蛋白(Pal)基因的順向引子以及逆向引子，且Pal基因包含如SEQ ID NO:15所示的核苷酸序列。順向引子的長度為15至25個核苷酸，且係對應於SEQ ID NO:15所示的第1至33個位點之間的核苷酸序列。逆向引子的長度為15至30個核苷酸，且係對應於SEQ ID NO:15的第64至123個位點之間的核苷酸序列。本揭露亦提供一種包含前述引子對之檢測肺炎披衣菌的套組，以及使用前述引子對之檢測檢測肺炎披衣菌的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A primer pair for detecting Chlamydia pneumoniae is provided. The primer pair includes a forward primer and a reverse primer targeting the nucleic acid sequence of the peptidoglycan-associated lipoprotein (Pal) gene. The Pal gene includes the nucleotide sequence shown in SEQ ID NO:15. The length of the forward primer is 15-25 nucleotides and corresponds to the nucleotide sequence between positions 1 to 33 shown in SEQ ID NO:15. The length of the reverse primer is 15-30 nucleotides and corresponds to the nucleotide sequence between positions 64 to 123 of SEQ ID NO:15. A kit for detecting Chlamydia pneumoniae including the aforementioned primer pair is also provided. A method for detecting Chlamydia pneumoniae using the aforementioned primer pair is also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="323" publication-number="202620776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>叫車系統及其使用方法</chinese-title>  
        <english-title>RIDE-HAILING SYSTEM AND METHOD OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250205B">G06Q50/47</main-classification>  
        <further-classification edition="202301120250205B">G06Q10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TOM RAY-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TOM RAY-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種叫車系統，其包括：一叫車伺服器、一乘客設備及一司機設備。乘客設備具有一第一電子裝置及一辨識器，且辨識器具又複數光源。司機設備設置於該派遣車輛上，並具有一第二電子裝置及一顯示裝置。叫車伺服器用以接收第一電子裝置發送的叫車訊號，並在搜尋到派遣車輛後，將一派車資訊分別發送至第一及第二電子裝置，使第一及第二電子裝置根據派車資訊分別控制辨識器的各光源及派遣車輛上的顯示裝置產生相同的識別效果，進而供彼此辨識。故，本發明可為乘客及司機提供良好的辨識效果，避免搭錯車的情況發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:辨識器</p>  
        <p type="p">220:控制元件</p>  
        <p type="p">221:本體</p>  
        <p type="p">221A:第一端</p>  
        <p type="p">221B:第二端</p>  
        <p type="p">222:光源</p>  
        <p type="p">223:電源部</p>  
        <p type="p">224:開關部</p>  
        <p type="p">225:緊急求救部</p>  
        <p type="p">32:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="324" publication-number="202620877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置的操作方法</chinese-title>  
        <english-title>METHOD FOR OPERATING MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G11C16/10</main-classification>  
        <further-classification edition="200601120250303B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦啟元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, CHI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在此提供了一種記憶體裝置的操作方法。要進行操作的一記憶體裝置包括一第0字元線至一第M字元線，連接至該記憶體裝置的一區塊的複數個記憶胞。該操作方法包括在N1個抹寫週期內從第0字元線往第M字元線寫入該區塊，以及在N2個抹寫週期內從第M字元線往第0字元線寫入該區塊，其中，N1和N2是正整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for operating a memory device is provided. The memory device to be operated includes a 0 &lt;sup&gt;th&lt;/sup&gt;word line to a M &lt;sup&gt;th&lt;/sup&gt;word line connected to memory cells of a block of the memory device. The method includes programming the block from the 0 &lt;sup&gt;th&lt;/sup&gt;word line to the M &lt;sup&gt;th&lt;/sup&gt;word line for N1 program-erase cycles and programming the block from the M &lt;sup&gt;th&lt;/sup&gt;word line to the 0 &lt;sup&gt;th&lt;/sup&gt;word line for N2 program-erase cycles, wherein N1 and N2 are positive integers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="325" publication-number="202620698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>終端裝置及用於外部LLM服務的安全詢問方法</chinese-title>  
        <english-title>EDGE DEVICE AND SECURE QUERY METHOD FOR EXTERNAL LLM SERVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N3/08</main-classification>  
        <further-classification edition="202301120250303B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昱銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於外部LLM服務的安全提問方法被提供。安全提問方法包括接收AI提問。安全提問方法同樣包括根據AI提問，處理儲存於終端裝置的記憶體中的私有資料，以得到私有提示。安全提問方法同樣包括傳送AI提問至第二語言生成模型。安全提問方法同樣包括接收由第二語言生成模型根據AI提問所產生的初始回答。安全提問方法同樣包括輸入初始回答及私有提示至終端裝置的第一語言生成模型，以得到由終端裝置的第一語言生成模型所產生的最終回答。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A secure query method for external LLM service is provided. The secure query method comprises receiving an AI query. The secure query method also comprises processing private data stored in a memory of the edge device to obtain a private prompt according to the AI query. The secure query method also comprises transmitting the AI query to a second language generation model. The secure query method also comprises receiving an initial response generated by the second language generation model according to the AI query. The secure query method also comprises inputting the initial response and the private prompt to a first language generation model of the edge device, for obtaining a final response generated by the first language generation model of the edge device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:終端裝置</p>  
        <p type="p">110:使用者介面</p>  
        <p type="p">111:AI提問</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:記憶體</p>  
        <p type="p">131:私有資料</p>  
        <p type="p">132:私有提示</p>  
        <p type="p">140:神經引擎</p>  
        <p type="p">141:SLM</p>  
        <p type="p">142:SLM回答</p>  
        <p type="p">150:通訊模組</p>  
        <p type="p">200:雲端伺服器</p>  
        <p type="p">210:LLM服務</p>  
        <p type="p">211:LLM回答</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="326" publication-number="202620703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多模型推論之系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N5/04</main-classification>  
        <further-classification edition="202001120250303B">G06F40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡米爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMEO INFOTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊雅晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃如玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧怡婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高紀靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳珞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉姿嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭閔云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴佳敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱泊寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多模型推論之系統，包括一輸入輸出介面，用以接收一問題訊息，問題訊息包括一個或複數文件；一儲存模組，儲存複數種大語言模型；一轉接路由模組，連接輸入輸出介面，轉接路由模組接收問題訊息，分析問題訊息之複雜度，以配對出適合處理問題訊息之一被選大語言模型；以及一運算模組，連接轉接路由模組及儲存模組，從儲存模組中讀取出被選大語言模型並執行，以利用被選大語言模型分析問題訊息，並產生一分析報告，將分析報告通過輸入輸出介面輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多模型推論之系統</p>  
        <p type="p">12:輸入輸出介面</p>  
        <p type="p">14:儲存模組</p>  
        <p type="p">142:大語言模型</p>  
        <p type="p">16:轉接路由模組</p>  
        <p type="p">18:運算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="327" publication-number="202621047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合式射頻濾波器</chinese-title>  
        <english-title>MIXED RADIO FREQUENCY FILTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250208B">H03H9/64</main-classification>  
        <further-classification edition="200601120250208B">H03H9/42</further-classification>  
        <further-classification edition="200601120250208B">H03H7/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立積電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宥鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種混合式射頻濾波器，包括第一收發端、第二收發端、第一串聯電容、第二串聯電容、第一串聯諧振器及第二串聯諧振器。第一串聯電容、第一串聯諧振器、第二串聯諧振器、第二串聯電容依序串聯耦接於第一收發端與第二收發端之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mixed radio frequency filter includes a first transceiver terminal, a second transceiver terminal, a first series capacitor, a second series capacitor, a first series resonator and a second series resonator. The first series capacitor, the first series resonator, the second series resonator, and the second series capacitor are serially coupled between the first transceiver terminal and the second transceiver terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:混合式射頻濾波器</p>  
        <p type="p">TR1,TR2:收發端</p>  
        <p type="p">12,14:匹配電路</p>  
        <p type="p">CS1~CS4:串聯電容</p>  
        <p type="p">RS1~RS2:串聯諧振器</p>  
        <p type="p">CP1~CP2:並聯電容</p>  
        <p type="p">RP1~RP3:並聯諧振器</p>  
        <p type="p">N1~N5:節點</p>  
        <p type="p">L1:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="328" publication-number="202620304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運動結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F16B21/06</main-classification>  
        <further-classification edition="200601120260223B">F16B5/06</further-classification>  
        <further-classification edition="200601120260223B">F16B19/02</further-classification>  
        <further-classification edition="200601220260223B">H01R13/633</further-classification>  
        <further-classification edition="202601220260223B">H10W40/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍隆國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鼎瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種運動結構及其運動方法，其包含身部、作動部及運動部。作動部與身部活動組合；運動部設於身部，作動部運動以使運動部運動，用以使運動部扣接被扣部。藉此，可使身部設於物體，且由作動部使運動部與被扣部扣接或解扣，以完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:運動結構</p>  
        <p type="p">11:身部</p>  
        <p type="p">111:第一擋抵部</p>  
        <p type="p">112:限制部</p>  
        <p type="p">113:組接部</p>  
        <p type="p">12:作動部</p>  
        <p type="p">121:第二擋抵部</p>  
        <p type="p">122:組合部</p>  
        <p type="p">123:接合部</p>  
        <p type="p">124:讓位部</p>  
        <p type="p">125:推抵部</p>  
        <p type="p">13:運動部</p>  
        <p type="p">14:彈性元件</p>  
        <p type="p">10:另一物體</p>  
        <p type="p">101:被扣部</p>  
        <p type="p">20:物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="329" publication-number="202621268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽金氧半導體場效電晶體及其製造方法</chinese-title>  
        <english-title>SILICON CARBIDE METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/01</main-classification>  
        <further-classification edition="202501120250102B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>積亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王培仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃品硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PIN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種碳化矽金氧半導體場效電晶體之製造方法，包括以下步驟：提供碳化矽基板；於碳化矽基板上形成N型碳化矽磊晶層，其中N型碳化矽磊晶層包括頂面；於N型碳化矽磊晶層內且鄰接頂面處形成二摻雜結構，其中每一摻雜結構包括P型井、N型摻雜區及P型摻雜區，N型摻雜區位於P型井內，且P型摻雜區位於P型井內且鄰接N型摻雜區；於頂面上沉積富矽氮化物薄膜；於富矽氮化物薄膜上沉積閘極氧化層，其中藉由富矽氮化物薄膜隔絕閘極氧化層及碳化矽基板；針對閘極氧化層執行後氧化退火製程；以及於閘極氧化層上形成閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for manufacturing a silicon carbide metal oxygen semiconductor field effect transistor, which includes the following steps: providing a SiC substrate; forming a N-type SiC epitaxial layer with a top surface on the SiC substrate; forming two doping structures in the N-type SiC epitaxial layer adjacent to a top surface, wherein each doping structure includes a P well, a N+ doping region and an P+ doping region, the N+ doping region is located in the P well, and the P+ doping region is located in the P well and adjacent to the N+ doping region; depositing a silicon-rich nitride film on the top surface; depositing a gate oxide layer on the silicon-rich nitride film, wherein the gate oxide layer and the N-type SiC epitaxial layer are insulated by the silicon-rich nitride film; performing a post oxide annealing process for the gate oxide layer; and forming a gate structure on the gate oxide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:碳化矽金氧半導體場效電晶體</p>  
        <p type="p">10:碳化矽基板</p>  
        <p type="p">20:N型碳化矽磊晶層</p>  
        <p type="p">21:頂面</p>  
        <p type="p">30:摻雜結構</p>  
        <p type="p">31:P型井</p>  
        <p type="p">32:N型摻雜區</p>  
        <p type="p">33:P型摻雜區</p>  
        <p type="p">40:富矽氮化物薄膜</p>  
        <p type="p">50:閘極氧化層</p>  
        <p type="p">60:閘極結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="330" publication-number="202619754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣管插管輔助裝置及即時判斷氣管內管位置正確性之方法</chinese-title>  
        <english-title>TRACHEAL INTUBATION AUXILIARY DEVICE AND METHOD FOR REAL TIME DETERMINING POSITION CORRECTNESS OF ENDOTRACHEAL TUBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61M16/04</main-classification>  
        <further-classification edition="201601120241125B">A61B34/10</further-classification>  
        <further-classification edition="201601120241125B">A61B34/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國醫藥大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝凱生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KAI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氣管插管輔助裝置及即時判斷氣管內管位置正確性之方法。即時判斷氣管內管位置正確性之方法包含提供氣管插管輔助裝置、進行影像擷取步驟、進行範圍選取步驟和進行影像判讀步驟。氣管插管輔助裝置包含紅外線溫度感測器和處理器，以紅外線溫度感測器擷取包含氣管內管和受試者的工作空間的熱影像，並以處理器比對第一取樣區之第一溫度區間和第二取樣區之第二溫度區間，以判斷氣管內管之位置正確性。藉此，本發明之即時判斷氣管內管位置正確性之方法可以快速且正確的即時輔助判斷氣管內管的位置是否正確。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tracheal intubation auxiliary device and a method for real time determining a position correctness of an endotracheal tube are provided. The method for real time determining the position correctness of the endotracheal tube includes providing the tracheal intubation auxiliary device, performing an image acquisition step, performing a range selection step, and performing an image interpretation step. The tracheal intubation auxiliary device includes an infrared temperature sensor and a processor. The infrared temperature sensor is used to capture a thermal image of a working space including the endotracheal tube and a subject, and the processor is used to compare a first temperature range of a first sampling area with a second temperature range of a second sampling area to determine the position correctness of the endotracheal tube. Therefore, the method for real time determining the position correctness of the endotracheal tube of the present disclosure can quickly and accurately assist in real time determining whether a position of the endotracheal tube is correct.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:即時判斷氣管內管位置正確性之方法</p>  
        <p type="p">410,420,430,440:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="331" publication-number="202620660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援多國語言檔案處理的電腦系統及方法</chinese-title>  
        <english-title>COMPUTER SYSTEM AND METHOD FOR SUPPORTING MULTI-LANGUAGE FILE PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250217B">G06F16/10</main-classification>  
        <further-classification edition="201801120250217B">G06F8/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊怡賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種支援多國語言檔案處理的電腦系統，包含儲存單元及處理單元。儲存單元儲存圖形使用者介面(Graphical User Interface；GUI)程式及檔案。處理單元從儲存單元載入GUI程式，以執行以下步驟：接收檔案的檔案名稱，其中檔案名稱以第一國語言表示，並且遵循第一字符編碼標準；為檔案名稱建立別名(alias name)，其中別名以第二國語言表示，並且遵循第一字符編碼標準；連結別名至檔案，致使檔案名稱和別名都參考檔案；以及將別名轉為遵循第二字符編碼標準，以對別名參考之檔案啟動遵循第二字符編碼標準之底層處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer system for supporting multi-language file processing is provided. The computer system includes a storage unit and a processing unit. The storage unit stores a graphical user interface (GUI) program and a file. The processing unit loads the GUI program from the storage unit to perform the following steps: receiving a file name of the file, which is expressed in the first language and follows the first character encoding standard; creating an alias name for the file name, which is expressed in the second language and follows the first character encoding standard; linking the alias name to the file so that both the file name and the alias name refer to the file; converting the alias name to follow the second character encoding standard, so as to enforce low-level processing that follows the second character encoding standard on the file which the alias name refers to.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:方法</p>  
        <p type="p">201~205:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="332" publication-number="202619845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍍銅陶瓷基板的研磨方法</chinese-title>  
        <english-title>GRINDING METHOD OF COPPER-PLATED CERAMIC SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">B24B37/08</main-classification>  
        <further-classification edition="200601120260223B">B24B7/17</further-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立誠光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECOCERA OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李忠義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUNG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊明安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MING AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾明勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, MING HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鍍銅陶瓷基板的研磨方法包括：固定鍍銅陶瓷基板於治具；設置治具於雙面研磨系統中；使雙面研磨系統的下磨盤與鍍銅陶瓷基板的第一面上的第一銅層接觸；使雙面研磨系統的上磨盤與鍍銅陶瓷基板的第二面上的第二銅層接觸；使下磨盤、上磨盤及治具旋轉；及使下磨盤研磨鍍銅陶瓷基板的第一面上的第一銅層，且使上磨盤研磨鍍銅陶瓷基板的第二面上的第二銅層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A grinding method of a copper-plated ceramic substrate, including: fixing a copper-plated ceramic substrate in a fixture; setting the fixture in a double-sided grinding system; contacting a lower grinding disc of the double-sided grinding system and a first copper layer on a first side of the copper plated ceramic substrate; contacting an upper grinding disc of the double-sided grinding system and a second copper layer on a second side of the copper plated ceramic substrate; rotating the lower grinding disc, the upper grinding disc and the fixture; and grinding the first copper layer on the first side of the copper plated ceramic substrate by the lower grinding disc; and grinding the second copper layer on the second side of the copper plated ceramic substrate by the upper grinding disc.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S06:研磨方法步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="333" publication-number="202620191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增殖造血幹細胞與生成造血祖細胞的造血幹細胞增殖培養基以及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120241125B">C12N5/074</main-classification>  
        <further-classification edition="201001120241125B">C12N5/077</further-classification>  
        <further-classification edition="201001120241125B">C12N5/0789</further-classification>  
        <further-classification edition="200601120241125B">C12M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人食品工業發展研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOOD INDUSTRY RESEARCH AND DEVELOPMENT INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇敏汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, MING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫政浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, CHENG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種造血幹細胞增殖培養基，其包含有：一基礎培養基、血小板生成素(TPO)、幹細胞因子(SCF)、介白素-3 (IL-3)、IL-6、Flt-3配位子(FL)、胰島素、運鐵蛋白、人類血清白蛋白(HSA)、UM729以及SR1。本發明亦揭示該造血幹細胞增殖培養基可被用來增殖造血幹細胞以及生成造血祖細胞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="334" publication-number="202620943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造具矽顆粒、碳層及氧化鋅包覆之複合電極顆粒的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250115B">H01M4/139</main-classification>  
        <further-classification edition="201001120250115B">H01M4/131</further-classification>  
        <further-classification edition="201001120250115B">H01M4/133</further-classification>  
        <further-classification edition="201001120250115B">H01M4/134</further-classification>  
        <further-classification edition="201701120250115B">C01B32/158</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱志鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造具矽顆粒、碳層及氧化鋅包覆之複合電極顆粒的方法，該方法包含下列步驟：步驟500：取多個矽顆粒、高分子材料、瀝青以及醇類溶液，應用一研磨機充分混合及研磨；部分該矽顆粒會生成氧化矽層包覆在該矽顆粒表面而形成複合矽顆粒；步驟510：將多個多孔性碳顆粒加入該研磨機中繼續混合研磨；其中該多孔性碳顆粒表面具有多個孔洞，其可吸收膨脹的該矽顆粒；步驟520：將上述材料置入一減壓濃縮機中以得到混合物粉末；步驟530：將該混合物粉末置入一燒結爐中進行氣氛燒結，其中該混合物粉末中的該瀝青及該高分子材料會形成一碳層包覆在各該多孔性碳顆粒外表面，而該多個矽顆粒及該多個複合矽顆粒會分布在各該碳層內，整體形成一第一顆粒，而在該燒結爐內，存在多個該第一顆粒；步驟540：取多個氧化鋅顆粒與該多個第一顆粒應用一滾動式混合機進行混合處理，使得各該第一顆粒外表面被多個氧化鋅顆粒形成的氧化鋅層包覆，整體形成該複合電極顆粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="335" publication-number="202620951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具矽層、碳層及氧化鋅層包覆之複合電極顆粒</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250512B">H01M10/052</main-classification>  
        <further-classification edition="201001120250512B">H01M4/131</further-classification>  
        <further-classification edition="201001120250512B">H01M4/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱志鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具矽層、碳層及氧化鋅層包覆之複合電極顆粒，主要使用於固態或類固態電池的電極，其中各該複合電極顆粒包含：一多孔性碳顆粒，其表面具有多個孔洞；一矽層包覆在該多孔性碳顆粒外表面；該矽層以連續薄膜的形式包覆在該多孔性碳顆粒；其中該矽層中的矽材也會填充該多孔性碳顆粒之孔洞中；一不定型碳層包覆在該矽層的外圍；該不定型碳層為連續的結構包覆在該矽層外；一氧化鋅層包覆該不定型碳層外圍，該氧化鋅層係由多個氧化鋅分子所形成的連續薄膜包覆在該不定型碳層外圍，當鋰離子充填入該矽層使得該矽層膨脹時，該氧化鋅層可產生良好的延展效果因此保護內層的其他顆粒。該氧化鋅層外表面尚包覆一氧化鋁層；該氧化鋁層係由多個氧化鋁分子所形成的連續薄膜包覆在該氧化鋅層外圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">30:多孔性碳顆粒</p>  
        <p type="p">32:矽層</p>  
        <p type="p">36:不定型碳層</p>  
        <p type="p">37:氧化鋅層</p>  
        <p type="p">40:複合電極顆粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="336" publication-number="202620952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具矽顆粒、碳層及氧化鋅層包覆之複合電極顆粒</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250512B">H01M10/052</main-classification>  
        <further-classification edition="201001120250512B">H01M4/131</further-classification>  
        <further-classification edition="201001120250512B">H01M4/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱志鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具矽顆粒、碳層及氧化鋅層包覆之複合電極顆粒，各該複合電極顆粒包含：一多孔性碳顆粒，其表面具有多個孔洞；一不定型碳層包覆在該多孔性碳顆粒的外表面；多個矽顆粒分布在不定型碳層內；該多個矽顆粒中有一部分的該矽顆粒的外表面包覆氧化矽(SiOx)層；以及一氧化鋅層包覆該不定型碳層外圍，該氧化鋅層係由多個氧化鋅顆粒所形成的連續層包覆在該不定型碳層外圍，該氧化鋅層可產生良好的延展效果因此保護內層的其他顆粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">30:多孔性碳顆粒</p>  
        <p type="p">32:矽顆粒</p>  
        <p type="p">36:不定型碳層</p>  
        <p type="p">37:氧化鋅層</p>  
        <p type="p">40:複合電極顆粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="337" publication-number="202620561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於工具機之位移補償方法，及具有位移補償功能的工具機與其控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G05B19/404</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發得科技工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FACTORY AUTOMATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪文斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭永和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YUNG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於工具機之位移補償方法，及具有位移補償功能的工具機與其控制裝置，該位移補償方法是量測取得一液靜壓載台機構之油腔部中之液壓油壓力，並根據所述油腔部之有效承載總面積與該壓力值計算得到一工件的估算重量。接著，根據所述工件之一預定重量與該估算重量的差值大小，決定以該預定重量或該估算重量來演算得到位移補償值。然後，根據得到之該位移補償值控制一傳動機構對該液靜壓載台機構之傳動位移距離進行補償。透過工具機與該位移補償方法之設計，有助於提高所述工件的位移精度，進而提高所述工件的加工精密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701~705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="338" publication-number="202620285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>汽車排氣碳固化系統</chinese-title>  
        <english-title>AUTOMOTIVE EXHAUST CARBON SOLIDIFICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F01N3/08</main-classification>  
        <further-classification edition="201001120241204B">F01N13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立彰化師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHANGHUA UNIVERSITY OF EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐子惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TZU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳性惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊煒章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張諄萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉順億</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHUN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張紹勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHAO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露一種汽車排氣碳固化系統，其包含偵測控制裝置、裝置行走空間、氣體收集裝置及碳固化裝置。偵測控制裝置偵測車輛之排氣管的位置資訊，以及排氣管的氣體排放資訊，若氣體排放資訊為排氣管有氣體排出，則偵測控制裝置根據前述資訊輸出控制訊號；氣體收集裝置設於裝置行走空間內並耦接於偵測控制裝置，氣體收集裝置能夠根據控制訊號行走於裝置行走空間，並收集排氣管排出的所述氣體；碳固化裝置選擇性地與排氣部相互連通，氣體收集裝置能夠將被收集的所述氣體輸入至碳固化裝置進行碳固化處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automotive exhaust carbon solidification system, which includes a detection and control device, a movement space for the device, a gas collection unit, and a carbon solidification unit. The detection and control device detects the positional information of a vehicle's exhaust pipe and the gas emission information from the exhaust pipe. If the emission information indicates that gas is being released from the exhaust pipe, the detection and control device outputs a control signal based on this information. The gas collection unit is positioned within the movement space and coupled to the detection and control device, allowing it to move within the space in response to the control signal and collect the gas emitted from the exhaust pipe. The carbon solidification unit can selectively communicate with the exhaust section, allowing the gas collection unit to transfer the collected gas into the carbon solidification unit for carbon solidification processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:汽車排氣碳固化系統</p>  
        <p type="p">10:偵測控制裝置</p>  
        <p type="p">11:位置偵測單元</p>  
        <p type="p">12:排氣偵測單元</p>  
        <p type="p">13:控制單元</p>  
        <p type="p">20:裝置行走空間</p>  
        <p type="p">30:氣體收集裝置</p>  
        <p type="p">40:碳固化裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="339" publication-number="202620460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學測距模組</chinese-title>  
        <english-title>OPTICAL RANGING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G01S17/08</main-classification>  
        <further-classification edition="200601120241127B">G01S7/481</further-classification>  
        <further-classification edition="200601120241127B">G01S7/483</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新鉅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁永福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YUNG FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳烱弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIUNG HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學測距模組，定義有一物側及與該物側相對之一元件側，並包括：一光學發射單元；一光學接收單元；一支撐蓋，包括一頂部及一連接該頂部之環形側壁，其中該頂部具有一物側表面，該環形側壁具有一外表面，該頂部包括由該物側貫穿至該元件側的兩個開口，該光學發射單元及該光學接收單元分別設置於該兩個開口；一基座，設置於該支撐蓋朝向該元件側之一側，並與該支撐蓋之間定義有一第一容置空間及一第二容置空間；一導電膜，設置於該支撐蓋之該頂部之該物側表面及該環形側壁之該外表面；以及一抗反射膜，覆蓋於該支撐蓋之該頂部之該導電膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical ranging module defining an object side and an element side opposite to the object side, and the optical ranging module comprising: an optical emitter; an optical receiver; a supporting unit including a top and a surrounding sidewall connected to the top, wherein the top has an external surface, the surrounding sidewall has an external surface, the top includes two openings penetrating from the object side to the element side, the optical emitter and the optical receiver is respectively disposed at the two openings; a base disposed on one side of the support unit facing the element side and defining a first accommodation space and a second accommodation space with the supporting unit; a conductive film disposed on the object-side surface of the top of the support unit and the external surface of the sounding sidewall; and an anti-reflective film covering the conductive film of the top of the supporting unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">O:物側</p>  
        <p type="p">E:元件側</p>  
        <p type="p">b11:第一開口</p>  
        <p type="p">b12:第二開口</p>  
        <p type="p">1:光學測距模組</p>  
        <p type="p">110:光學發射單元</p>  
        <p type="p">120:光學接收單元</p>  
        <p type="p">130:支撐蓋</p>  
        <p type="p">140:基座</p>  
        <p type="p">150:導電膜</p>  
        <p type="p">160:抗反射膜</p>  
        <p type="p">170:驅動元件</p>  
        <p type="p">180:控制元件</p>  
        <p type="p">G1:導電膠</p>  
        <p type="p">T:目標物</p>  
        <p type="p">SP11:第一容置空間</p>  
        <p type="p">SP12:第二容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="340" publication-number="202620504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142982</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可攜式載體之複合型放大裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G02B15/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為涉及一種可攜式載體之複合型放大裝置，包括一固定件、一支撐件、及一放大裝置，所述固定件係得與一使用者手部穿戴或是與一可攜式載體相互結合，而支撐件係設於固定件上，又放大裝置設於支撐件背離固定件之端處，當固定件與使用者手部結合時，可攜式載體得持於手掌上，使用者不僅可觀看可攜式載體上之圖文，更可用於觀看紙類平面圖文，此即為手持型應用。再當固定件與具有顯示螢幕之可攜式載體結合時，可方便使用者佈置於桌面上觀看可攜式載體上之圖文，此即為桌上型應用。而上述兩種應用合稱為複合型應用，故，整體而言複合型應用的放大裝置非常輕巧方便，可滿足所有使用者以取得最適合自身的放大倍率，並得以快速與可攜式載體調整定位，圖文數倍放大影像清晰，可增加使用者之沉浸感情境。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:固定件</p>  
        <p type="p">2:支撐件</p>  
        <p type="p">3:放大裝置</p>  
        <p type="p">6:磁鐵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="341" publication-number="202619650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陳列架之結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">A47F5/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大入創作有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA RUH CREATIVE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏良忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種陳列架之結構，結構包括有一活動蓋體、一包含有一頂層層架及至少一第二層架之商品陳列架、一文宣設置部、一活動裝飾件、二結合座、複數勾扣部、複數磁吸部、二包含有複數勾扣件及複數磁性元件之縱向裝飾件、一橫向標示件、一標示設置部、及二包含有一高度調節部及一固定部之調節機構。藉上述結構，在頂層層架上用活動蓋體隔出一個小型倉儲空間，並以文宣設置部及活動裝飾件創造出醒目的廣告空間，配合結合座上的勾扣部及磁吸部，使縱向裝飾件與活動裝飾件皆可簡單快速的拆裝，而橫向標示件則可透過調節機構配合第二層架的高度進行微調，進而讓整體可模組化的結合於商品陳列架。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:商品陳列架</p>  
        <p type="p">11:頂層層架</p>  
        <p type="p">12:第二層架</p>  
        <p type="p">13:儲物空間</p>  
        <p type="p">2:活動蓋體</p>  
        <p type="p">21:文宣設置部</p>  
        <p type="p">22:活動裝飾件</p>  
        <p type="p">3:結合座</p>  
        <p type="p">4:縱向裝飾件</p>  
        <p type="p">5:橫向標示件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="342" publication-number="202620681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於壓縮檔案的資料結構產品及電腦程式產品</chinese-title>  
        <english-title>DATA STRUCTURE PRODUCT AND COMPUTER PROGRAM PRODUCT FOR COMPRESSED FILE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250217B">G06F21/60</main-classification>  
        <further-classification edition="201301120250217B">G06F21/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭孟池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, MENG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一方面為一種資料結構產品，用於儲存以進階加密標準(Advanced Encryption Standard, AES)加密的壓縮檔案。資料結構產品包含檔頭(header)、串接於檔頭的串接檔案，以及包含被壓縮格式以壓縮密碼加密壓縮的原始資料的加密壓縮資料。串接檔案包含QR code圖檔，表示壓縮密碼由進階加密標準加密後產生的明碼文字以及對應使用於加密產生明碼文字的密鑰的隨機碼(seed)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aspect of the present disclosure features a data structure product for storing a compressed file encrypted by advanced encryption standard, AES. The data structure product comprises a header, a concatenate file concatenating the header, and an encrypted compressed data including a raw data encrypted and compressed with a compressed password in a compressed format. The concatenate file comprises a QR code image file representing a plain text generated from the compressed password encrypted by the AES, and a seed corresponding to a key for encrypting to generate the plain text.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電腦程式</p>  
        <p type="p">110:加密壓縮模組</p>  
        <p type="p">120:進階加密標準模組</p>  
        <p type="p">130:QR code轉換模組</p>  
        <p type="p">140:串接模組</p>  
        <p type="p">CF:壓縮檔案</p>  
        <p type="p">CPW:壓縮密碼</p>  
        <p type="p">ECD:加密壓縮資料</p>  
        <p type="p">PT:明碼文字</p>  
        <p type="p">QI:QR code圖檔</p>  
        <p type="p">RD:原始資料</p>  
        <p type="p">SD:隨機碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="343" publication-number="202619825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝調控裝置及雷射加工系統</chinese-title>  
        <english-title>PULSE CONTROL DEVICE AND LASER PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241204B">B23K26/062</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嘉右</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIA-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何福順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, FU-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐尚聿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋育誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種脈衝調控裝置及包含其的雷射加工系統，適用於多個種子雷射驅動器。脈衝調控裝置包含多個脈衝產生電路以及一脈衝延遲調整電路。所述多個脈衝產生電路分別用於根據多個脈衝設定資料產生多個脈衝訊號，所述多個脈衝設定資料各至少包含一脈衝頻率。脈衝延遲調整電路連接於脈衝產生電路，用於根據一參考訊號控制所述多個脈衝訊號之間的一間隔時間，並分別輸出經調整的多個脈衝訊號至多個種子雷射驅動器。所述參考訊號為所述多個脈衝訊號中之一者或是一標準訊號，且所述多個脈衝設定資料各自的脈衝頻率對應的時長不同於所述間隔時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pulse control device and a laser processing system including thereof, wherein the pulse control device is applicable for a plurality of seed laser drivers. The pulse control device includes a plurality of pulse generation circuits and a pulse delay adjustment circuit. The plurality of pulse generation circuits are respectively configured to generate a plurality of pulse signals according to pulse setting data, and each of the pulse setting data includes at least one pulse frequency. The pulse delay adjustment circuit is connected to the plurality of pulse generation circuits and is configured to control an interval time between the plurality of pulse signals according to a reference signal, and output the plurality of adjusted pulse signals to the plurality of seed laser drivers respectively. The reference signal is one of the plurality of pulse signals or a standard signal, and the duration corresponding to the pulse frequency of each of the pulse setting data is different from the interval time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射加工系統</p>  
        <p type="p">11:脈衝調控裝置</p>  
        <p type="p">111:脈衝產生電路</p>  
        <p type="p">112:脈衝延遲調整電路</p>  
        <p type="p">12:種子雷射驅動器</p>  
        <p type="p">13:種子雷射光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="344" publication-number="202621024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換裝置</chinese-title>  
        <english-title>POWER CONVERSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">H02M3/156</main-classification>  
        <further-classification edition="200601120250207B">H02M1/08</further-classification>  
        <further-classification edition="200701120250207B">H02M1/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源轉換裝置，至少包括電壓轉換器、諧振轉換器、反饋電路、輸出電路與控制增益電路。電壓轉換器，用於接收輸入差動電壓，並且將輸入差動電壓轉換為第一中繼電壓。諧振轉換器，用於將第一中繼電壓轉換為第二中繼電壓。反饋電路，經由反饋路徑耦接於諧振轉換器。輸出電路，用於根據輸出差動電壓產生輸出電壓。控制增益電路，用於執行控制機制以調整第一中繼電壓與輸出電壓。電源轉換裝置的電壓總增益關聯於輸出電壓與輸入電壓的第一比例值，並且控制增益電路根據控制機制調整電壓總增益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power conversion device, includes at least a voltage converter, a resonant converter, a feedback circuit, an output circuit and a control gain circuit. The voltage converter is used for receiving an input differential voltage, and converting the input differential voltage into a first relay voltage. The resonant converter is used for converting the first relay voltage into a second relay voltage. The feedback circuit, is coupled to the resonant converter through a feedback path. The output circuit, is used for generating an output voltage based on an output differential voltage. The control gain circuit, is use for executing a control mechanism to adjust the first relay voltage and the output voltage. A voltage total gain of the power conversion device is associated with a first ratio value of the output voltage and an input voltage, and the control gain circuit adjusts the voltage total gain according to the control mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:電源轉換裝置</p>  
        <p type="p">10:輸入電路</p>  
        <p type="p">100:電壓轉換器</p>  
        <p type="p">200:諧振轉換器</p>  
        <p type="p">250:變壓器</p>  
        <p type="p">300:整流器</p>  
        <p type="p">200:輸出電路</p>  
        <p type="p">400:反饋電路</p>  
        <p type="p">450:耦合電路</p>  
        <p type="p">500:第二控制電路</p>  
        <p type="p">510:過溫保護電路</p>  
        <p type="p">600:電壓控制增益電路</p>  
        <p type="p">700:第一控制電路</p>  
        <p type="p">Vi:輸入電壓</p>  
        <p type="p">(Vi1,Vi2):輸入差動電壓</p>  
        <p type="p">Vb:第一中繼電壓</p>  
        <p type="p">Vb’:第二中繼電壓</p>  
        <p type="p">Vb”:第三中繼電壓</p>  
        <p type="p">(Vo1,Vo2):輸出差動電壓</p>  
        <p type="p">Vo:輸出電壓</p>  
        <p type="p">DR1:監測結果</p>  
        <p type="p">PW1:脈衝寬度調變訊號</p>  
        <p type="p">510:過溫保護電路</p>  
        <p type="p">GC1:增益控制訊號</p>  
        <p type="p">C1:控制訊號</p>  
        <p type="p">PS:一次側</p>  
        <p type="p">SS:二次側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="345" publication-number="202620736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>押標金以電子票據支付之系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR USING ELECTRONIC NOTE ON BID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250205B">G06Q20/02</main-classification>  
        <further-classification edition="201201120250205B">G06Q20/38</further-classification>  
        <further-classification edition="201201120250205B">G06Q10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人台灣票據交換所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE TAIWAN CLEARING HOUSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種押標金以電子票據支付之系統及其方法。押標金以電子票據支付之系統包括票據電子化系統、開票銀行裝置、託收銀行裝置以及招標機關裝置。票據電子化系統從開票銀行裝置接收對應於電子票據的簽發交易訊息。招標機關裝置根據押標金廠商名單記錄檔來請求託收銀行裝置執行退還操作以及提示操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method for using an electronic note on a bid is provided. The system for using the electronic note on the bid includes an electronic note system, an issuing bank device, a collection bank device, and a bidding organization device. The electronic note system receives a sign transaction message corresponding to the electronic note from the issuing bank device. The bidding organization device requests the collecting bank device to perform a refund operation and a prompting operation based on a bid vendor list record file.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:押標金以電子票據支付之系統</p>  
        <p type="p">11:票據電子化系統</p>  
        <p type="p">12:開票銀行裝置</p>  
        <p type="p">14:投標廠商裝置</p>  
        <p type="p">15:政府電子採購網裝置</p>  
        <p type="p">16:託收銀行裝置</p>  
        <p type="p">17:招標機關裝置</p>  
        <p type="p">S1、S2、S3、S4、S5、S6、S7、S8、S9、S10、S11、S12、S13、S14、S15、S16、S17、S18:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="346" publication-number="202620737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>票據電子化系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR ELECTRONIC NOTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241203B">G06Q20/06</main-classification>  
        <further-classification edition="202301120241203B">G06Q40/02</further-classification>  
        <further-classification edition="202301120241203B">G06Q40/03</further-classification>  
        <further-classification edition="201201120241203B">G06Q10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人台灣票據交換所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE TAIWAN CLEARING HOUSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種票據電子化系統及其方法。本揭露的票據電子化系統及其方法可用電子化的方式來執行電子票據的簽發、背書轉讓、退回、撤銷付款委託、變更提示日以及融資註記。基此，可大幅地提高處理電子票據的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method for electronic note is provided. The system and the method for electronic note in the present disclosure can electronically execute issuance, endorsement transfer, return, cancellation of payment entrustment, change of presentation date and financing notes of electronic note. Based on this, the efficiency of processing electronic note can be greatly improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:票據電子化系統</p>  
        <p type="p">110:收發器</p>  
        <p type="p">130:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="347" publication-number="202620562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造任務派工系統及方法</chinese-title>  
        <english-title>MANUFACTURING TASK DISPATCH SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">G05B19/418</main-classification>  
        <further-classification edition="200601120250206B">G05B19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林上鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHANG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃少谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAO-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊善荏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHAN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊佳瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出一種製造任務派工系統及方法，所述方法包括下列步驟：處理裝置取得派工設定檔，並依據派工設定檔產生並發送多個工單至多個控制裝置，其中多個控制裝置各自通訊連接加工機，每個控制裝置依據一工單控制一加工機執行一製造任務，並在製造任務完成後發送一執行狀態至處理裝置，以及當執行狀態符合派工設定檔中指定條件時，處理裝置發送一通知至該控制裝置以控制對應的加工機重新執行對應的製造任務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing task dispatch system and method is proposed, wherein the method includes the following steps: A processing device obtains a work profile, generates work orders and sends to corresponding control devices based on the profile, wherein the control devices are communication-connected respectively to processing machines. Each control device controls corresponding processing machine to perform a manufacturing task according to the work order and sends an execution result to the processing device after the manufacturing task is completed. And when the execution result meets a specified condition of the work profile, the processing device sends a notification to the control device to instruct the corresponding processing machine to re-execute the manufacturing task again.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="348" publication-number="202620816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同理心情緒互動訓練教具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">G09B1/00</main-classification>  
        <further-classification edition="200601120250116B">G09B5/06</further-classification>  
        <further-classification edition="200601120250116B">A63H33/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺中科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAICHUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王譔博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管珮羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉巧盈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作為一種同理心情緒互動訓練教具，供一兒童使用，其包含一教具本體與複數情緒積木，其中該教具本體具有一收容空間、一置入口、一感應器與一能夠播放複數語音的播放器，該複數情緒積木分別具有相異且對應該複數語音的一識別標籤與對應該識別標籤的一識別外觀，且該複數情緒積木依據擁有的該識別外觀而代表特定情緒；據此，當兒童認知到特定情緒時，可以拾取對應的該情緒積木，並經由該置入口置入該收容空間，該教具本體透過該感應器取得該情緒積木的該識別標籤，並經由該播放器播放對應的該語音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:教具本體</p>  
        <p type="p">101:發聲孔</p>  
        <p type="p">11:收容空間</p>  
        <p type="p">12:置入口</p>  
        <p type="p">20:情緒積木</p>  
        <p type="p">21:識別標籤</p>  
        <p type="p">22:識別外觀</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="349" publication-number="202621224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241113B">H05K7/20</main-classification>  
        <further-classification edition="200601120241113B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>億光電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERLIGHT ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖偉勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王永成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUNG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子組件，包含一電路板、一功率晶片以及一散熱器。功率晶片設置於電路板上並具有一第一散熱面。第一散熱面背對電路板。散熱器包含一散熱鰭片及至少一組裝件。散熱鰭片具有一第二散熱面。第二散熱面熱耦接於第一散熱面，並且第二散熱面的面積不小於第一散熱面的面積，使整個第一散熱面與第二散熱面接觸。功率晶片介於散熱鰭片及電路板之間。至少一組裝件的相異側分別組裝於散熱鰭片及電路板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic assembly including a circuit board, a power chip and a heat sink. The power chip is disposed on the circuit board and has a first heat dissipation surface facing away from the circuit board. The heat sink includes a fin assembly and at least one assembling component. The fin assembly has a second heat dissipation surface thermally coupled to the first heat dissipation surface. The area of the second heat dissipation surface is no less than the area of the first heat dissipation surface so that an entire of the first heat dissipation surface is in contact with the second heat dissipation surface. The power chip is located between the fin assembly and the circuit board. Different sides of the at least one assembling component are assembled to the fin assembly and the circuit board, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子組件</p>  
        <p type="p">100:電路板</p>  
        <p type="p">101:鎖固孔</p>  
        <p type="p">102:接墊</p>  
        <p type="p">200:功率晶片</p>  
        <p type="p">210:晶片本體</p>  
        <p type="p">220:引腳</p>  
        <p type="p">230:散熱片</p>  
        <p type="p">231:第一散熱面</p>  
        <p type="p">300:散熱器</p>  
        <p type="p">310:散熱鰭片</p>  
        <p type="p">311:第二散熱面</p>  
        <p type="p">320:組裝件</p>  
        <p type="p">321:銜接部</p>  
        <p type="p">322:安裝部</p>  
        <p type="p">323:鎖固部</p>  
        <p type="p">324:鎖固孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="350" publication-number="202619684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>眼睛房水葡萄糖濃度非侵入／旋光介質活性量測系統和方法</chinese-title>  
        <english-title>METHOD AND SYSTEM OF NON-INVASIVE OPTICAL ROTATION ANGLE SENSING POLARIMETER FOR AQUEOUS GLUCOSE CONCENTRATION MEASUREMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">A61B5/1455</main-classification>  
        <further-classification edition="200601120250512B">G01J4/04</further-classification>  
        <further-classification edition="200601120250512B">G01N21/23</further-classification>  
        <further-classification edition="200601120250512B">G02B5/30</further-classification>  
        <further-classification edition="200601120250512B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾盟生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙啓喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周立德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">眼睛房水的葡萄糖濃度非侵入式量測系統，包括：線偏振準直光源，以線偏振起始角度沿行進光軸發出入射偏振光束穿透角膜入射至房水，產生出射偏振光束；定義入射偏振光束的線偏振起始角度為沿行進光軸行進方向45度旋轉角；第一偏振分光器，使出射偏振光束分為兩束偏振方向正交的出射偏振光束分量，分別沿各別行進光軸方向0度和90度旋轉角偏振；二光感測器，分別量測兩出射偏振光束分量的光強度；運算處理器，將前述光強度相減，取得與偏振角度旋轉量相依的史托克向量S&lt;sub&gt;1&lt;/sub&gt;分量；及將出射偏振光束分量的光強度相加作為標準值，對S&lt;sub&gt;1&lt;/sub&gt;分量歸一化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a system of non-invasive optical rotation angle sensing polarimeter for aqueous glucose concentration measurement. A linear polarization angle is set at 45° along propagation axis, the polarized beam transmitting aqueous humor and the polarized beam splitter whose polarization directions are orthogonal at 0° and 90° of rotation in the directions of propagation axes; difference of intensities of the orthogonal polarization components is measured in a balanced detector configuration able to obtain Stokes vector component S&lt;sub&gt;1&lt;/sub&gt; which relates to the optical rotation angle and aqueous glucose concentration under common noise rejection mode, the sum of the intensities to normalize S&lt;sub&gt;1&lt;/sub&gt; enables reduction of the optical intensity fluctuation noise too.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30’:準直光源</p>  
        <p type="p">31’:波長濾光片</p>  
        <p type="p">32’:線偏振片</p>  
        <p type="p">331’、332’:非偏振分光器</p>  
        <p type="p">341’:第一偏振分光器</p>  
        <p type="p">342’:第二偏振分光器</p>  
        <p type="p">343’:偏振分光器</p>  
        <p type="p">3410’、3420’、3430’、340''':非偏振分光器</p>  
        <p type="p">351’、352’、353’、354’、355’、356’:線偏振片</p>  
        <p type="p">361’、362’、363’、364’、365’、366’:光感測器</p>  
        <p type="p">37’:線性雙折射補償器</p>  
        <p type="p">38’:運算處理器</p>  
        <p type="p">39’:調制器</p>  
        <p type="p">40’:入射偏振光束</p>  
        <p type="p">42’、43’、44’、48’、49’:出射偏振光束</p>  
        <p type="p">451’、452’、461’、462’:出射偏振光束分量</p>  
        <p type="p">51’、52’、53’:史托克向量分析模組</p>  
        <p type="p">60’~68’、69’:步驟</p>  
        <p type="p">θ&lt;sub&gt;0&lt;/sub&gt;:線偏振起始角度</p>  
        <p type="p">δ:偏振角度的旋轉量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="351" publication-number="202620677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>票券驗證系統及方法</chinese-title>  
        <english-title>TICKET VERIFICATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F21/35</main-classification>  
        <further-classification edition="201201120250203B">G06Q10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權可易資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGHTEXCHANGE INFORMATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種票券驗證系統，包含驗證裝置及行動裝置。驗證裝置用於掃描行動裝置的至少一第一階驗證碼，於至少一第一階驗證碼通過驗證後，朝行動裝置傳輸第二階驗證碼，根據是否於傳輸第二階驗證碼後的第一預定時間內從行動裝置掃描到第二階驗證碼，判斷行動裝置的連網狀態，從而輸出允許入場訊號或通知訊號。行動裝置連接於該驗證裝置，行動裝置用於顯示至少一第一階驗證碼並在接收後顯示第二階驗證碼。一種票券驗證方法包含以一驗證裝置執行，透過利用兩階段的驗證碼進行驗證，可避免驗證碼遭側拍等盜用的狀況，可有效解決票券偽造的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ticket verification system includes a verification device and a mobile device. The verification device is used to scan at least one first-stage verification code of the mobile device, and after at least one first-stage verification code passes the verification, transmit the second-stage verification code to the mobile device. Scan the second-stage verification code from the mobile device within a predetermined time to determine the network status of the mobile device, thereby outputting an entry permission signal or notification signal. The mobile device is connected to the verification device, and the mobile device is used to display at least one first-stage verification code and display the second-stage verification code after receiving it. A ticket verification method includes execution by a verification device. By using a two-stage verification code for verification, the verification code can be avoided from being stolen by side shots, etc., and can effectively solve the problem of ticket forgery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:票券驗證系統</p>  
        <p type="p">11:行動裝置</p>  
        <p type="p">12:驗證裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="352" publication-number="202620768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁鋼鐵損值的預估方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">G06Q50/04</main-classification>  
        <further-classification edition="202601120260223B">C21D8/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪敏榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MIN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康振榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電磁鋼鐵損值的預估方法，藉由一控制單元來實施，該控制單元訊號連接一電磁鋼生產系統，該電磁鋼生產系統包含一用於將多種原料進行煉鋼以獲得一待熱軋鋼材的煉鋼單元，及一用於根據該待熱軋鋼材進行熱軋以獲得一待冷軋鋼材的熱軋單元，並包含：(A) 自所使用之該等原料所對應的多筆原料特徵資料中，獲得多筆對應多種目標原料的目標原料特徵資料，每一目標原料為該等原料的其中一者；(B) 獲得該熱軋單元處理該待熱軋鋼材的一熱軋溫度；(C) 根據該等目標原料特徵資料及該熱軋溫度，利用一鐵損值預測模型，獲得一對應該待冷軋鋼材的一鐵損值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S08:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="353" publication-number="202620017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子液體的製備方法</chinese-title>  
        <english-title>PREPARATION METHOD OF IONIC LIQUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C07C303/40</main-classification>  
        <further-classification edition="200601120241205B">C07C311/48</further-classification>  
        <further-classification edition="200601120241205B">C07D207/06</further-classification>  
        <further-classification edition="200601120241205B">C07D233/58</further-classification>  
        <further-classification edition="200601120241205B">B01J19/08</further-classification>  
        <further-classification edition="201001120241205B">H01M10/052</further-classification>  
        <further-classification edition="201001120241205B">H01M10/0568</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芯量科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋兆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宣妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王品涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曾隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSENG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製備離子液體的方法包括以下步驟。使含鹵化合物與第一化合物反應形成第二化合物。含鹵化合物包括鹵烴、磺醯鹵或其組合。第一化合物包括具有三級胺基的胺化合物、膦類化合物或其組合。第二化合物包括第一四級銨鹽、第一季鏻鹽或其組合。使第二化合物與鋰鹽在微波裝置中進行反應以形成第三化合物。第三化合物包括第二四級銨鹽、第二季鏻鹽或其組合。第二化合物和第三化合物的陰離子不同。微波裝置的微波功率為700瓦至1400瓦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of preparing an ionic liquid includes the following steps. A halogen-containing compound is reacted with a first compound to form a second compound. The halogen-containing compound includes a halohydrocarbon, a sulfonyl halide, or a combination thereof. The first compound includes an amine compound having a tertiary amine group, a tertiary phosphine compound, or a combination thereof. The second compound includes a first quaternary ammonium salt, a first quaternary phosphonium salt, or a combination thereof. The second compound and a lithium salt are reacted in a microwave device to form a third compound. The third compound includes a second quaternary ammonium salt, a second quaternary phosphonium salt, or a combination thereof. Anions of the second compound and the third compound are different. A microwave power of the microwave device is 700 watts to 1400 watts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110、120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="354" publication-number="202620899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合AR、IoT與AI辨識之水產養殖場域遠端視訊顧問系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241128B">G16Y10/15</main-classification>  
        <further-classification edition="202001120241128B">G16Y40/20</further-classification>  
        <further-classification edition="201701120241128B">A01K61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>實踐大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合AR、IoT與AI辨識之水產養殖場域遠端視訊顧問系統包含：一指導端主機及一指導端操作輔具；與該指導端主機連接的一邊緣主機；與該邊緣主機連接的至少一IoT裝置；一操作端包含：與該邊緣主機連接的且具有擴增實境功能的一視覺輔具；與該指導端操作輔具連接的一操作端操作輔具；由該邊緣主機所執行的一水產養殖管控子系統其經由該邊緣主機發出一工序指令給該視覺輔具，該操作端操作輔具與該指導端操作輔具之間可進行影像通話。該操作端因此能遵循該工序指令，在水產養殖場域中正確與快速完成被指定的事項並得到所需的指導，可達成本發明的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:整合AR、IoT與AI辨識之水產養殖場域遠端視訊顧問系統</p>  
        <p type="p">2:指導端</p>  
        <p type="p">3:操作端</p>  
        <p type="p">4:IoT裝置</p>  
        <p type="p">10:邊緣主機</p>  
        <p type="p">11:水產養殖管控子系統</p>  
        <p type="p">21:指導端主機</p>  
        <p type="p">22:指導端操作輔具</p>  
        <p type="p">31:視覺輔具</p>  
        <p type="p">32:操作端操作輔具</p>  
        <p type="p">100:雲平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="355" publication-number="202621524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉星語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施智元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要提供一嵌埋有電子元件之包覆層，再於該包覆層上依序形成佈線結構與線路結構，且該線路結構中形成有斷開部，以分散該佈線結構與線路結構中之應力，因而避免該佈線結構或線路結構發生碎裂之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package is made by providing a encapsulating layer with embedded electronic components, then sequentially forming a wiring structure and a circuit structure on the encapsulating layer, and forming cutting off portions in the circuit structure to disperse the stress in the wiring structure and circuit structure, thereby avoiding the problem of cracking of the wiring structure or circuit structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">210:斷開部</p>  
        <p type="p">22:電子元件</p>  
        <p type="p">22b:非作用面</p>  
        <p type="p">23:包覆層</p>  
        <p type="p">23b:第二表面</p>  
        <p type="p">24:佈線結構</p>  
        <p type="p">240:絕緣層</p>  
        <p type="p">241:佈線層</p>  
        <p type="p">242:第一導電盲孔</p>  
        <p type="p">25:線路結構</p>  
        <p type="p">250:介電層</p>  
        <p type="p">251:線路層</p>  
        <p type="p">252:第二導電盲孔</p>  
        <p type="p">26:導電元件</p>  
        <p type="p">B:垂直投影區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="356" publication-number="202620958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車電池自動滅火阻斷裝置及其自動滅火阻斷方法</chinese-title>  
        <english-title>AUTOMATIC FIRE EXTINGUISHING AND BLOCKING DEVICE FOR ELECTRIC VEHICLE BATTERY AND ITS AUTOMATIC FIRE EXTINGUISHING AND BLOCKING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241128B">H01M50/383</main-classification>  
        <further-classification edition="202101120241128B">H01M50/131</further-classification>  
        <further-classification edition="202101120241128B">H01M50/143</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐崇平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐崇平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紹良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車電池自動滅火阻斷裝置，包括一電動車電池自動滅火阻斷模組，係用於一電動車電池模組，該電動車電池模組包括至少一電動車電池單元，該電動車電池自動滅火阻斷模組為一多層封裝結構，該多層封裝結構包含一第一自動滅火阻斷內層、一第一自動滅火阻斷中間層和一自動滅火阻斷外層，其中該第一自動滅火阻斷中間層包含由壓力填充之一第一滅火材料，該第一自動滅火阻斷內層和該電動車電池單元間形成一通風散熱空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic fire extinguishing and blocking device for electric vehicle batteries, including an automatic fire extinguishing and blocking module for electric vehicle batteries, the electric vehicle battery module includes at least one electric vehicle battery unit, the battery automatic fire extinguishing blocking module is a multi-layer packaging structure, the multi-layer packaging structure includes a first automatic fire extinguishing blocking inner layer, a first automatic fire extinguishing blocking middle layer and an automatic fire extinguishing blocking outer layer, wherein the first automatic fire-extinguishing blocking middle layer contains a first fire-extinguishing material filled by pressure, a ventilation and heat dissipation space is formed between the first automatic fire-extinguishing blocking inner layer and the electric vehicle battery unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電動車電池模組</p>  
        <p type="p">20:電動車電池自動滅火阻斷裝置</p>  
        <p type="p">AA’:剖面方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="357" publication-number="202620970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可插拔模組及電子裝置</chinese-title>  
        <english-title>PLUGGABLE MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241231B">H01R12/70</main-classification>  
        <further-classification edition="200601120241231B">H01R13/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉廷政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TING-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可插拔模組，用以安裝於一電子裝置並具有一插入方向及一拔出方向，插入方向及拔出方向互相平行並反向，可插拔模組包含一外連接器、一內連接器及一座體。外連接器為一同軸連接器並包含複數外端子。內連接器沿拔出方向與外連接器相對地設置並包含複數內端子，其通信連接外端子。外連接器及內連接器容置於座體。藉此，有助於實施同軸連接器與其他通信介面之間的轉接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pluggable module is configured to be installed in an electronic device and has a plug-in direction and a pull-out direction. The plug-in direction and the pull-out direction are parallel and opposite to each other. The pluggable module includes an outer connector, an inner connector and a base. The outer connector is a coaxial connector and includes a plurality of outer terminals. The inner connector is disposed opposite to the outer connector along the pull-out direction and includes a plurality of inner terminals, which are communicatively connected to the outer terminals. The outer connector and the inner connector are accommodated by the base. Therefore, it is beneficial to adapt between a coaxial connector and another communication interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可插拔模組</p>  
        <p type="p">101:外端點</p>  
        <p type="p">110:拉拔元件</p>  
        <p type="p">111:樞軸</p>  
        <p type="p">112:拉拔外表面</p>  
        <p type="p">113:第一拉拔部</p>  
        <p type="p">114:拉拔區</p>  
        <p type="p">115:避讓開口</p>  
        <p type="p">116:推動區</p>  
        <p type="p">118:第二拉拔部</p>  
        <p type="p">120:前顎元件</p>  
        <p type="p">122:前顎外表面</p>  
        <p type="p">130:插銷元件</p>  
        <p type="p">136:觸發區</p>  
        <p type="p">140:外連接器</p>  
        <p type="p">148:外端子</p>  
        <p type="p">150:電路板</p>  
        <p type="p">160:內連接器</p>  
        <p type="p">168:內端子</p>  
        <p type="p">170:座體</p>  
        <p type="p">171:第一座件</p>  
        <p type="p">172:第二座件</p>  
        <p type="p">173:第二扣部</p>  
        <p type="p">182:蓋件</p>  
        <p type="p">183:金屬架</p>  
        <p type="p">a2:夾角</p>  
        <p type="p">y1:拔出方向</p>  
        <p type="p">y2:插入方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="358" publication-number="202620847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具情緒感知的虛擬人物表情調整系統及其方法</chinese-title>  
        <english-title>VIRTUAL PERFORMER EXPRESSION ADJUSTMENT SYSTEM WITH EMOTION-AWARE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250217B">G10L25/63</main-classification>  
        <further-classification edition="201301120250217B">G10L25/30</further-classification>  
        <further-classification edition="202201120250217B">G06V40/16</further-classification>  
        <further-classification edition="202201120250217B">G06V10/20</further-classification>  
        <further-classification edition="202301120250217B">G06N3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙海虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHA, HAI HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具情緒感知的虛擬藝人表情調整系統及其方法，透過在初始時載入語音訊號及其相應的情緒訊息作為訓練資料，再將其輸入至人工智慧模型進行訓練以生成情緒識別模型，接著，接收使用者語音進行特徵擷取、標準化及降維處理後，輸入至情緒識別模型以獲得情緒狀態，然後執行臉部表情生成運算以基於情緒狀態生成相應的人臉關鍵點，並且即時根據人臉關鍵點調整虛擬藝人的臉部模型參數，用以動態顯示虛擬藝人的臉部表情，藉以達到提高虛擬藝人的表情真實性與豐富性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A virtual performer expression adjustment system with emotion-aware and method thereof is disclosed. By initially loading voice signals and their corresponding emotional information as training data, inputting them into an artificial intelligence (AI) model to train and generate an emotion recognition model, subsequently receiving user voice for feature extraction, normalization, and dimensionality reduction, and inputting the processed voice into the emotion recognition model to obtain an emotional state, then performing facial expression generation calculations to generate corresponding facial landmarks based on the emotional state, and dynamically adjusting the virtual performer’s facial model parameters in real-time according to the facial landmarks to display the virtual performer’s facial expression. The mechanism is help to improve the authenticity and richness of virtual performer expression.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟210:將一情緒語音資料庫與一電腦主機連接，其中，該情緒語音資料庫儲存多個語音訊號及每一所述語音訊號各自對應的一情緒訊息</p>  
        <p type="p">步驟220:該電腦主機於初始時，自該情緒語音資料庫載入所述語音訊號及其相應的所述情緒訊息作為一訓練資料，並且將該訓練資料輸入至人工智慧模型進行訓練以生成一情緒識別模型</p>  
        <p type="p">步驟230:該電腦主機接收一使用者語音以進行特徵擷取、標準化及降維處理，並且將處理後的該使用者語音輸入至該情緒識別模型以獲得一情緒狀態</p>  
        <p type="p">步驟240:該電腦主機執行一臉部表情生成運算以基於所述情緒狀態生成相應的多個人臉關鍵點(Facial Landmarks)，並且即時根據所述人臉關鍵點調整一虛擬藝人的多個臉部模型參數，用以動態顯示該虛擬藝人的臉部表情</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="359" publication-number="202619771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析拳擊動作以提供拳擊訓練建議之裝置及方法</chinese-title>  
        <english-title>DEVICE FOR ANALYZING BOXING MOVES TO PROVIDE BOXING TRAINING SUGGESTIONS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250115B">A63B69/00</main-classification>  
        <further-classification edition="200601120250115B">A63B71/06</further-classification>  
        <further-classification edition="200601120250115B">G06F3/01</further-classification>  
        <further-classification edition="201901120250115B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析拳擊動作以提供拳擊訓練建議之裝置及方法，其透過分析比賽對手的歷史比賽影像以產生比賽對手的對手行動訊息，並使用依據比賽對手之對手行動訊息訓練出的機器學習模型模擬比賽對手的行動策略與動作模式後，依據行動策略與動作模式透過實境技術提供使用者與虛擬對手進行對打練習，並分析使用者在對打練習中的對打動作以產生目標動作訊息，及依據目標動作訊息產生與比賽對手對應之訓練建議之技術手段，可以依據使用者動作即時作出反應並依據使用者表現提供改進建議，並達成真實模擬對手反應並給予整體性改進建議的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for analyzing boxing moves to provide boxing training suggestions and a method thereof are provided. By analyzing historical game images of an opponent to generate opponent action data of the opponent, using a machine learning model trained based on the opponent action data to simulate action strategies and action patterns of the opponent, using reality technology to provide a user with a virtual opponent for a fight practice based on the action strategies and the action patterns, analyzing fight movements of the user during the fight practice to generate target movement data, and generating training suggestions corresponding to the opponent based on the target action data, the device and the method can respond immediately to user actions and provide improvement suggestions based on user actions, and can achieve the effect of truly simulating opponent reactions and giving overall improvement suggestions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟310:取得包含比賽對手之歷史比賽影像</p>  
        <p type="p">步驟320:分析歷史比賽影像以產生比賽對手之對手行動訊息</p>  
        <p type="p">步驟330:依據對手行動訊息訓練機器學習模型</p>  
        <p type="p">步驟340:使用機器學習模型產生模擬比賽對手之虛擬對手之行動策略與動作模式</p>  
        <p type="p">步驟350:依據行動策略與動作模式透過實境技術提供使用者以對打動作與虛擬對手進行對打練習</p>  
        <p type="p">步驟360:取得與對打動作對應之對打動作資料</p>  
        <p type="p">步驟370:分析對打動作資料以取得使用者之目標動作訊息</p>  
        <p type="p">步驟380:依據目標動作訊息產生與比賽對手對應之訓練建議</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="360" publication-number="202619766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析瑜伽動作與生理狀況以產生練習計畫之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR ANALYZING YOGA MOVEMENTS AND PHYSIOLOGICAL CONDITIONS TO GENERATE PRACTICE PLAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">A63B24/00</main-classification>  
        <further-classification edition="201801120241127B">G16H20/30</further-classification>  
        <further-classification edition="202201120241127B">G06V40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析瑜伽動作與生理狀況以產生練習計畫之裝置及方法，其透過分析使用者影像以產生使用者的初始姿勢資料，並依據使用者的初始姿勢資料及與使用者影像同步收集的生理狀態資料判斷使用者的初始身體狀態，及選擇與初始身體狀態相符的瑜伽動作以產生訓練計畫後，依據訓練計畫中之瑜伽動作的示範動作資料使用實境技術模擬並顯示虛擬教練進行動作示範與要點說明之技術手段，可以提供即時動作指導以讓使用者確認姿勢是否正確，並達成提供個人練習計畫的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for analyzing yoga movements and physiological conditions to generate a practice plan and a method thereof are provided. By analyzing videos of a user to generate initial posture data of the user, determining an initial physical state of the user based on the initial posture data and physiological state data of the user collected simultaneously with the videos, selecting yoga movements that are consistent with the initial physical state to generate a practice plan, and using a reality technology to simulate and display the virtual coach to demonstrate the yoga movements and explain key points of the yoga movements based on the demonstration data of the yoga movements in the practice plan, the device and the method can providing real-time action guidance to allow users to confirm whether postures of yoga movements are correct, and can achieve the effect of providing personal practice plans.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟310:取得使用者影像及同步收集之生理狀態資料</p>  
        <p type="p">步驟320:分析使用者影像以產生與生理狀態資料對應之初始姿勢資料</p>  
        <p type="p">步驟330:依據初始姿勢資料及生理狀態資料判斷使用者之初始身體狀態</p>  
        <p type="p">步驟340:選擇與初始身體狀態相符之瑜伽動作以產生練習計畫，練習計畫包含瑜伽動作及對應之練習時間</p>  
        <p type="p">步驟350:使用實境技術模擬虛擬教練</p>  
        <p type="p">步驟361:載入與當前之瑜伽動作對應之示範動作資料</p>  
        <p type="p">步驟365:依據示範動作資料使用實境技術模擬並顯示虛擬教練進行當前之瑜伽動作及說明動作要點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="361" publication-number="202620587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑鼠滾輪模組</chinese-title>  
        <english-title>MOUSE SCROLL WHEEL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250115B">G06F1/16</main-classification>  
        <further-classification edition="201301120250115B">G06F3/0354</further-classification>  
        <further-classification edition="201301120250115B">G06F3/0362</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾慶林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, QING-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧春成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種滑鼠滾輪模組，包括：滾輪、編碼轉盤及軟性連接結構。滾輪包括滾輪本體及轉軸，轉軸的一端具有多邊形柱體；編碼轉盤具有第一軸管，第一軸管具有軸孔；軟性連接結構配置於軸孔中，並具有連接段，連接段的內表面上具有相連的多個連接面，連接面係對應於多邊形柱體。多邊形柱體伸入軸孔，連接面與多邊形柱體相互緊密地貼合，以連接滾輪及編碼轉盤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a mouse scroll wheel module, including: a scroll wheel, an encoding disk, and a flexible connection structure. The scroll wheel includes a wheel body and a rotating shaft, one end of the rotating shaft has a polygonal column; the encoding disk has a first shaft tube, and the first shaft tube has a shaft hole; the flexible connection structure is disposed within the shaft hole and has a connection section, the inner surface of the connection section has multiple connected contact surfaces that correspond to the polygonal column. The polygonal column extends into the shaft hole, and the contact surfaces closely fit with the polygonal column to connect the scroll wheel and the encoding disk.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F1:連接面</p>  
        <p type="p">F2:第一導引面</p>  
        <p type="p">O1:軸孔</p>  
        <p type="p">TB1:第一軸管</p>  
        <p type="p">TB2:第二軸管</p>  
        <p type="p">13:編碼轉盤</p>  
        <p type="p">131:第一管體部</p>  
        <p type="p">132:溝槽結構</p>  
        <p type="p">133:第二管體部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="362" publication-number="202621110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>眼動操作牽引系統</chinese-title>  
        <english-title>EYE-MOVEMENT OPERATED TRACTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241223B">H04N13/383</main-classification>  
        <further-classification edition="200601120241223B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSE INNOVATION CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玠佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種眼動操作牽引系統，係具有一眼動偵測設備及一使用者設備，其中該使用者設備用以啟動一應用程式，該應用程式係至少包含有一視覺焦點判斷單元、一凝視判斷單元、一座標牽引單元，該應用程式透過該眼動偵測設備取得一視覺焦點位置後，能夠判斷並設定該視覺焦點位置為一凝視座標點，而該應用程式更能夠判斷該凝視座標點是否具有任一目標物，若是該該凝視座標點具有任一目標物，該座標牽引單元係將該操作標記物移動到該目標物之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to an eye-movement operated traction system. The system contains an eye movement detection device and a user device. The user device is used to launch an application. The application contains at least a visual focus judgment unit, a gaze judgment unit, and a coordinate traction unit. After obtaining a visual focus position through the eye movement detection device, the application determines and sets the visual focus position as a gaze coordinate point. The application also determines whether there is any target object around the operation coordinate point of an operation marker. If the first coordinate range has any target object, the coordinate traction unit moves the operation marker to the position of the target object, and the visual focus position obtained by the eye movement detection device moves following the movement of the operation marker.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:眼動偵測設備</p>  
        <p type="p">2:使用者設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="363" publication-number="202620715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於平台工程之資料網格管理系統及其電腦可讀儲存介質</chinese-title>  
        <english-title>PLATFORM ENGINEERING-BASED DATA MESH MANAGEMENT SYSTEM AND COMPUTER READABLE STORAGE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/06</main-classification>  
        <further-classification edition="202301120250303B">G06Q10/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於平台工程之資料網格管理系統及其電腦可讀儲存介質，包括PBC業務功能組件群、應用於資料網格中的分散式自主業務能力資料組件群以及資料管理組件。PBC業務功能組件群包括複數個PBC業務功能組件，每一PBC業務功能組件用以封裝與各業務功能對應的各業務邏輯。分散式自主業務能力資料組件群包括複數個儲存與各業務功能對應的各資料的業務領域資料組件，每一業務領域資料組件包括複數個儲存被組合為各資料的各子資料的業務功能資料元件。資料管理組件供使用者管理各資料或各子資料，並且資料網格將各資料轉換後提供給各PBC業務功能組件使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A platform engineering-based data mesh management system and computer readable storage medium thereof are provided, the system includes a PBC business function component group, a distributed autonomous business capability data component group and a data management component applied in a data grid. The PBC business function component group includes a plurality of PBC business function components. Each PBC business function component is used to encapsulate each business logic corresponding to each business function. The distributed autonomous business capability data component group includes a plurality of business domain data components that store data corresponding to each business function. Each business domain data component includes a plurality of business function data components that store sub-data that are combined into the data. The data management component allows users to manage each data or each sub-data, and the data grid converts each data and provides it to each PBC business function component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資料網格管理系統</p>  
        <p type="p">10:PBC業務功能組件群</p>  
        <p type="p">11:資料網格</p>  
        <p type="p">100:分散式自主業務能力資料組件群</p>  
        <p type="p">200:資料管理組件</p>  
        <p type="p">201:資料目錄元件</p>  
        <p type="p">202:資料存儲元件</p>  
        <p type="p">203:資料查詢元件</p>  
        <p type="p">204:資料管道元件</p>  
        <p type="p">205:資料治理元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="364" publication-number="202620334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃燒裝置控制系統及燃燒裝置控制方法</chinese-title>  
        <english-title>COMBUSTION DEVICE CONTROL SYSTEM AND COMBUSTION DEVICE CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F23N5/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李達生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DA-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種燃燒裝置控制系執行運作：處理器基於複數個初始燃燒參數，執行自動控制模式，以獲得複數個時間點各者的燃燒趨勢分數；複數個感測器獲得該燃燒室於複數個時間點之第一時間點的第一燃燒光波長；處理器基於第一燃燒光波長，評估第一時間點之燃燒情況，以獲得燃燒狀態分數；處理器基於對應第一時間點的燃燒趨勢分數及燃燒狀態分數，輸出第二時間點之控制訊號到複數個氣閥控制器，第二時間點晚於第一時間點；第一進氣孔及第二進氣孔各者之氣閥控制器基於第二時間點之控制訊號，分別調節第一進氣孔之第一氣體及第二進氣孔之第二氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A combustion device control system performs operations: executing an automatic control mode according to a plurality of initial combustion parameters by a processor to obtain combustion trend scores at each of a plurality of time points; obtaining a first combustion light wavelength of a combustion chamber at a first time point of the time points; evaluating a combustion situation at the first time point according to the first combustion light wavelength to obtain a combustion state score; outputting control signals at a second time point to a plurality of valve controllers according to the combustion trend score and the combustion state score corresponding to the first time point, which the second time point is later than the first time point; and adjusting a first gas in the first air inlet and a second gas in the second air inlet according to the control signals at the second time point by air valve controllers of each of the first air inlet and the second air inlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:燃燒裝置控制系統</p>  
        <p type="p">110:感測器</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:顯示裝置</p>  
        <p type="p">900:燃燒裝置</p>  
        <p type="p">910:燃燒室</p>  
        <p type="p">GC:氣閥控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="365" publication-number="202620255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以微圖形化碳化矽籽晶圓用於單晶成長</chinese-title>  
        <english-title>USING A SURFACE MICRO-PATTERNING SILICON CARBIDE SEED TO CRYSTAL GROWTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C30B23/00</main-classification>  
        <further-classification edition="200601120241205B">C30B23/02</further-classification>  
        <further-classification edition="200601120241205B">C30B29/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力拓半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEAP SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭凱起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, KAI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孝惇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種以微圖形化碳化矽籽晶圓用於單晶成長的方法，係以表面微圖形化碳化矽晶圓而作為籽晶圓，有助於控制晶體成長時的晶型，使得晶型依所需的碳化矽結晶成長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method for using a surface micro-patterning silicon carbide seed to crystal growth, the surface micro-patterning silicon carbide wafer is used as a seed wafer, the invention helps to control the crystal form during crystal growth, so that the crystal form depends on the desired silicon carbide crystal growth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:步驟</p>  
        <p type="p">12:步驟</p>  
        <p type="p">13:步驟</p>  
        <p type="p">14:步驟</p>  
        <p type="p">15:步驟</p>  
        <p type="p">16:步驟</p>  
        <p type="p">17:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="366" publication-number="202619679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拋棄式輸尿管內視鏡</chinese-title>  
        <english-title>DISPOSABLE CYSTOSCOPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61B1/307</main-classification>  
        <further-classification edition="200601120241125B">A61B1/005</further-classification>  
        <further-classification edition="200601120241125B">A61B1/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晉弘科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIMAGING INTEGRATED SOLUTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾于維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俊安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHUN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭淑芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拋棄式輸尿管內視鏡，包括殼體、推拉桿組件及切換閥。殼體內設有推桿軌道與抵靠部，抵靠部位於推桿軌道的一側。推拉桿組件包括桿體與閥件軸，桿體的一端連接閥件軸。切換閥包括第一閥體通道、彈性密封件、閥體開口、第一灌洗通道與抽吸通道。彈性密封件設在第一閥體通道內，並將第一閥體通道區分成灌洗區及抽吸區，第一灌洗通道的一端開口連通灌洗區，抽吸通道的一端開口連通抽吸區。推拉桿組件帶動彈性密封件在第一閥體通道內移動，在彈性密封件位於灌洗區，閥體開口與抽吸區導通，在彈性密封件位於抽吸區，閥體開口與灌洗區導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disposable cystoscopy comprises a housing, a push-pull rod assembly, and a switching valve. The housing contains a push rod track and an abutment part. &lt;br/&gt;The abutment part positioned on one side of the push rod track. The push-pull rod assembly includes a rod body and a valve shaft. One end of the rod body connected to the valve shaft. The switching valve includes a first valve passage, an elastic seal element, a valve body opening, a first irrigation channel, and a suction channel. The elastic seal element is positioned within the first valve passage, dividing it into an irrigation area and a suction area. One end of the first irrigation channel connects to the irrigation area, and one end of the suction channel connects to the suction area. The push-pull rod assembly moves the elastic seal element within the first valve passage. When the elastic seal element is in the irrigation area, the valve body opening connects with the suction area, and when the elastic seal element is in the suction area, the valve body opening connects with the irrigation area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">21:桿體</p>  
        <p type="p">22:閥件軸</p>  
        <p type="p">31:第一閥體通道</p>  
        <p type="p">311:閥口</p>  
        <p type="p">32:彈性密封件</p>  
        <p type="p">33:閥體開口</p>  
        <p type="p">34:第一灌洗通道</p>  
        <p type="p">35:抽吸通道</p>  
        <p type="p">42:第二閥體通道</p>  
        <p type="p">422:閥口</p>  
        <p type="p">44:第二灌洗通道</p>  
        <p type="p">46:插入管</p>  
        <p type="p">W:工作通道</p>  
        <p type="p">A1:灌洗區</p>  
        <p type="p">A2:抽吸區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="367" publication-number="202620671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廟宇活動通知系統</chinese-title>  
        <english-title>A NOTIFICATION SYSTEM OF TEMPLE ACTIVITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">G06F17/40</main-classification>  
        <further-classification edition="202401120250206B">G06Q50/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韋体</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韋体</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種廟宇活動通知系統，其包含有資料庫模組、管理模組及使用者模組；其中，管理者可透過該管理模組之管理單元介面，於該資料庫模組之活動資料庫中建立活動資訊時，可將該活動資訊透過該管理模組傳送至通訊軟體上，而使用者可透過該使用者模組與該通訊軟體進行連接，可透過該通訊軟體接收活動訊息、報名活動及活動提醒等，因此能有效減少管理者在廟宇活動管理上之工作量，提升活動管理工作之效率，同時使用者也能即時收到活動訊息與提醒，有效避免活動訊息之漏失，提升整體活動之參與率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A notification system of temple activities includes a database module, a management module, and a user module. A manager uses a management unit interface to create information of activities in an activity database of the database module. The information of activities can be sent to communication software via the management module. A user uses the user module to communicate with the communication software, thereby receiving activity messages, registration information, and activity reminders via the communication software. For the manager, the workload of the management of temple activities can be efficiently reduced to increase the management efficiency. For the user, the user can receive the activity messages and reminders instantly, and the occurrence of missing messages can be effeiciently prevented, which helps increase the rate of participating in the activities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:廟宇活動通知系統</p>  
        <p type="p">31:資料庫模組</p>  
        <p type="p">32:管理模組</p>  
        <p type="p">33:使用者模組</p>  
        <p type="p">311:會員資料庫</p>  
        <p type="p">312:活動資料庫</p>  
        <p type="p">313:報名資料庫</p>  
        <p type="p">321:管理單元介面</p>  
        <p type="p">322:發送單元</p>  
        <p type="p">323:接收單元</p>  
        <p type="p">331:使用者介面</p>  
        <p type="p">332:收發單元</p>  
        <p type="p">4:通訊軟體</p>  
        <p type="p">41:註冊單元</p>  
        <p type="p">42:訊息單元</p>  
        <p type="p">43:報名單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="368" publication-number="202620773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廟宇問事求籤系統</chinese-title>  
        <english-title>A SYSTEM OF ASKING QUESTIONS AND DRAWING LOTS APPLIED TO TEMPLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250207B">G06Q50/22</main-classification>  
        <further-classification edition="201201120250207B">G06Q10/02</further-classification>  
        <further-classification edition="200601120250207B">G06Q90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韋体</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韋体</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種廟宇問事求籤系統，其包含有資料庫模組、處理模組及管理者介面及使用者介面；其中，該處理模組具有一與該資料庫模組連接之處理單元，分別與該處理單元連接之抽籤單元、確認單元、解籤單元，以及一與該處理單元連接之操作整合軟體；因此，該管理者可以藉由該管理者介面對於有註冊之使用者及籤詩進行管理，使用者可透過該使用者介面以連接該處理模組進而得到該求籤結果，且該求籤結果可選擇透過該操作整合軟體進行傳送分享，故使用者可不需親自到廟宇內即可達到問事求籤之效果，以利廟宇達到即時服務使用者之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system of asking questions and drawing lots applied to temples includes a database module, a processing module, a manager interface, and a user interface. The processing module includes a processing unit connected to the database module. The processing module also includes a drawing unit, a confirming unit, and an unscrambling unit respectively connected to the processing unit, and an integration software connected to the processing unit. Accordingly, a manager can use the manager interface to manage registered users and fortune sticks drawn by the users. A user can connect the processing module by using the user interface, thereby getting the result of the fortune stick. The result of the fortune stick can be sent and shared via the integration software. Therefore, the user can ask questions and draw a fortune stick without visiting each temple in person, which allows the temple to provide the users with instant services.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:廟宇問事求籤系統</p>  
        <p type="p">31:資料庫模組</p>  
        <p type="p">32:處理模組</p>  
        <p type="p">33:管理者介面</p>  
        <p type="p">34:使用者介面</p>  
        <p type="p">311:會員資料庫</p>  
        <p type="p">312:籤詩資料庫</p>  
        <p type="p">321:處理單元</p>  
        <p type="p">322:抽籤單元</p>  
        <p type="p">323:確認單元</p>  
        <p type="p">324:解籤單元</p>  
        <p type="p">325:操作整合軟體(圖式要改字)</p>  
        <p type="p">326:發送單元(圖式有標326)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="369" publication-number="202620336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱水器強制排氣管修飾蓋結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">F24D19/00</main-classification>  
        <further-classification edition="200601120250116B">F24D19/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸泰工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張金發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種熱水器強制排氣管修飾蓋結構，主要係包含一管狀本體及一底蓋以及一連接片。其中，該管狀本體係設有一階部及一設於內緣之嵌槽，以供一O形環嵌置於該嵌槽；該底蓋係設有內垣部，由該內垣部以水平、垂直彎折後連接一外垣部；該連接片係概呈L狀，以供連接管狀本體及底蓋。本發明之修飾蓋係供組裝於天花板孔，以供連接熱水器之上、下強制排氣管。藉由底蓋內垣部與管狀本體所形成之間隙，使下強制排氣管不會與天花板孔直接接觸，進而使熱水器的使用更為安全，且因上、下強制排氣管皆為順接狀態，配合O形環得以構成更佳之氣密效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:管狀本體</p>  
        <p type="p">51:第一階部</p>  
        <p type="p">6:底蓋</p>  
        <p type="p">60:內垣部</p>  
        <p type="p">61:水平延伸段</p>  
        <p type="p">62:垂直彎折段</p>  
        <p type="p">63:水平彎折段</p>  
        <p type="p">64:外垣部</p>  
        <p type="p">66:固定孔</p>  
        <p type="p">67:螺孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="370" publication-number="202619753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行動式動靜脈瘻管居家照護系統之血流偵測防護系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61M1/36</main-classification>  
        <further-classification edition="200601120241130B">A61B5/026</further-classification>  
        <further-classification edition="201801120241130B">G16H10/00</further-classification>  
        <further-classification edition="200601120241130B">G08B21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚學校財團法人長庚科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱小鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種行動式動靜脈瘻管居家照護系統之血流偵測防護機制，包括一冷熱雙效敷墊、一血管檢測裝置及一控制主機。其中，該冷熱雙效敷墊及該血管檢測裝置係電性連接該控制主機，使用該冷敷墊對病患的動靜脈瘻管進行冷敷、熱敷或交替冷、熱敷等復健工作，以及該血管檢測裝置安裝於該冷熱雙效敷墊之一側，透過該控制主機來調整確認冷敷時的各項控制設定，當使用冷敷減緩血流跟新陳代謝時，該血管檢測裝置會即時監控偵測血管通路的血流速，並避免冷敷溫度過低或使用時間過久造成血流量減少所產生的局部損傷，以提高使用時的安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:行動式動靜脈瘻管居家照護系統之血流偵測防護機制</p>  
        <p type="p">11:冷熱雙效敷墊</p>  
        <p type="p">111:第一電力源</p>  
        <p type="p">112:第一感應模組</p>  
        <p type="p">1121:溫度感測器</p>  
        <p type="p">1122:計時器</p>  
        <p type="p">1123:顯示單元</p>  
        <p type="p">113:第一藍芽通訊控制器</p>  
        <p type="p">12:血管檢測裝置</p>  
        <p type="p">121:第二電力源</p>  
        <p type="p">122:第二感應模組</p>  
        <p type="p">123:第二藍芽通訊控制器</p>  
        <p type="p">13:控制主機</p>  
        <p type="p">14:警示裝置</p>  
        <p type="p">141:指示燈</p>  
        <p type="p">142:蜂鳴器</p>  
        <p type="p">2:動靜脈瘻管</p>  
        <p type="p">SN1:操作訊號</p>  
        <p type="p">SN2:流速訊號</p>  
        <p type="p">SN3:驅動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="371" publication-number="202619741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>白樺樹液用於改善記憶力之用途</chinese-title>  
        <english-title>USE OF BIRCH SAP FOR IMPROVING MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">A61K36/185</main-classification>  
        <further-classification edition="200601120241202B">A61K31/70</further-classification>  
        <further-classification edition="200601120241202B">A61K31/715</further-classification>  
        <further-classification edition="200601120241202B">A61P25/28</further-classification>  
        <further-classification edition="200601120241202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健康力股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DR. ADVICE CORPORATION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王素珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SU-JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪啓峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃千芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種白樺( &lt;i&gt;Betula platyphylla&lt;/i&gt;)樹液萃取物在製備醫藥品或健康食品上的用途，該醫藥品或健康食品有助於改善記憶障礙。本案所述白樺萃取物相關製品具有高效、安全、方便的特性，可以醫藥品、飲食干預或營養保健品等方式有效治療、預防或減緩記憶障礙。本發明亦提供使用該白樺萃取物治療、預防或減緩記憶障礙的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a birch ( &lt;i&gt;Betula platyphylla&lt;/i&gt;) sap extract for use in the preparation a medication or health product. The medication or health product may help improve disturbance of memory. The birch sap extract-related products of the present disclosure have the characteristics of highly efficient, safe and convenient, and can effectively treat, prevent or slow down disturbance of memory in the form of pharmaceuticals, dietary intervention or health food supplements. The present disclosure also provides a method of treating, preventing or slowing down disturbance of memory with the birch sap extract-related products.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="372" publication-number="202621059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錄音模組及其積分-微分調變器</chinese-title>  
        <english-title>RECORDING MODULE AND ITS SIGMA-DELTA MODULATOR (SDM)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H03M3/00</main-classification>  
        <further-classification edition="200601120250203B">H03M1/12</further-classification>  
        <further-classification edition="200601120250203B">H03F3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖珮君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種錄音模組及其積分-微分調變器。積分-微分調變器透過第一輸入端耦接驅動電路，並且接收該驅動電路所輸出之中間訊號。積分-微分調變器包含運算放大器、第一及第二取樣電容器以及第一及第二積分電容器。運算放大器具有第二輸入端、第三輸入端及輸出端。第一取樣電容器的兩端分別耦接該第一及第二輸入端，用來取樣該中間訊號。第二取樣電容器的兩端分別耦接該第一及第二輸入端，用來取樣該中間訊號。第一積分電容器的兩端分別耦接該第二輸入端及該輸出端。第二積分電容器的兩端分別耦接該第二輸入端及該輸出端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a recording module and its sigma-delta modulator (SDM). The SDM is coupled to a driving circuit through a first input terminal and receives an intermediate signal outputted by the driving circuit. The SDM includes an operational amplifier, first and second sampling capacitors, and first and second integrating capacitors. The operational amplifier has a second input terminal, a third input terminal, and an output terminal. Two terminals of the first sampling capacitor are respectively coupled to the first and second input terminals for sampling the intermediate signal. Two terminals of the second sampling capacitor are respectively coupled to the first and second input terminals for sampling the intermediate signal. Two terminals of the first integrating capacitor are respectively coupled to the second input terminal and the output terminal. Two terminals of the second integrating capacitor are respectively coupled to the second input terminal and the output terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202,Nc,Nd,Nf,Nx,Ny:輸入端</p>  
        <p type="p">210:錄音模組</p>  
        <p type="p">212:驅動電路</p>  
        <p type="p">214:SDM(積分-微分調變器)</p>  
        <p type="p">305,312:運算放大器</p>  
        <p type="p">310,320:積分器</p>  
        <p type="p">Ci1,Ci2:積分電容器</p>  
        <p type="p">Cs1,Cs2:取樣電容器</p>  
        <p type="p">D1:數位碼</p>  
        <p type="p">Na1,Na2,Nb1,Nb2:節點</p>  
        <p type="p">Ne,Nz:輸出端</p>  
        <p type="p">Rf,Rs:電阻器</p>  
        <p type="p">Sa1,Sa2,Sb1,Sb2,Sc1,Sc2,Sd1,Sd2,SEL2:開關</p>  
        <p type="p">V-,V+,Vref:參考電壓</p>  
        <p type="p">V1:中間訊號</p>  
        <p type="p">Vin:輸入訊號</p>  
        <p type="p">Vint:積分訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="373" publication-number="202620640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>故障處理方法、電子設備及儲存介質</chinese-title>  
        <english-title>METHOD FOR HANDLING MALFUNCTIONS, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F11/30</main-classification>  
        <further-classification edition="201901120250602B">G06F1/3206</further-classification>  
        <further-classification edition="200601120250602B">G05B19/404</further-classification>  
        <further-classification edition="200601120250602B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘聖中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, SHENG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於電腦技術領域，提供一種故障處理方法、電子設備及儲存介質。該方法若監測到第一設備的工作溫度出現異常，採集第一設備的運行日誌；獲取資料庫中與運行日誌匹配的日誌數據；檢測第二設備的工作溫度是否出現異常趨勢，得到檢測結果，第二設備透過第一設備所處的位置確定；根據檢測結果及日誌數據，確定第一設備及/或第二設備對應的故障處理策略。上述方法能夠及時、有效地監控設備的工作溫度，從而確保設備的穩定運行和性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of computer technology and provides a method for handling malfunctions, an electronic device and a storage medium. The method includes: in response that a working temperature of a first device is abnormal, collecting a running log of the first device; obtaining log data that matches the running log from a database; detecting whether a working temperature of a second device has an abnormal trend, and obtaining a detection result, the second device being determined according to a position where the first device is located; based on the detection result and the log data; determining a fault handling strategy of the first device and/or the second device. The above method can monitor the working temperature of a device in a timely and effective manner, thereby ensuring stable operation and performance of the device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="374" publication-number="202620641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>故障處理方法、電子設備及儲存介質</chinese-title>  
        <english-title>METHOD FOR HANDLING MALFUNCTIONS, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F11/30</main-classification>  
        <further-classification edition="201901120250602B">G06F1/3206</further-classification>  
        <further-classification edition="200601120250602B">G05B19/404</further-classification>  
        <further-classification edition="200601120250602B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘聖中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, SHENG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於電腦技術領域，提供一種故障處理方法、電子設備及儲存介質。該方法採集設備的設備資訊；基於設備資訊，檢測設備是否出現異常；若設備出現異常，從資料庫中獲取與設備資訊中的事件日誌匹配的日誌數據；基於日誌數據，確定設備的解決策略。上述方法能夠快速確定出設備的異常情況，進而及時獲取到有效的解決策略進行故障恢復，從而能夠確保設備的穩定運行和性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of computer technology and provides a method for handling malfunctions, an electronic device and a storage medium. The method includes: collecting device information of a device; detecting whether the device is abnormal based on the device information; in response that the device is abnormal, obtaining log data that matches an event log of the device information from a database; determining a solution strategy for the device according to the log data. The above method can quickly determine an abnormal situation of the device, and then handle malfunctions in time by performing an effective solution strategy, thereby ensuring stable operation and performance of the device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="375" publication-number="202619732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種注射液製劑、配伍藥液及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A61K31/675</main-classification>  
        <further-classification edition="200601120250203B">A61K47/10</further-classification>  
        <further-classification edition="201701120250203B">A61K47/44</further-classification>  
        <further-classification edition="200601120250203B">A61K47/18</further-classification>  
        <further-classification edition="200601120250203B">A61K9/00</further-classification>  
        <further-classification edition="200601120250203B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳艾欣達偉醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENTAWITS PHARMACEUTICALS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段建新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, JIANXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡曉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, XIAOHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于繼兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮美珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUAN, MEIZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申廣彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, GUANGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華世標</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, SHIBIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊世超</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種注射液製劑、配伍藥液及其製備方法，該技術提供的注射液製劑及其配伍藥液經試驗滿足長期臨床試驗和商業生產銷售的要求。一種注射液製劑，其為含有下式Ⅰ化合物的溶液，該溶液的溶劑含有C2~C8的醇，還可含有其他助溶劑或增溶劑。較優的注射液製劑為含有10mg/ml式Ⅰ化合物的DMA、ELP、乙醇混合溶液，其中DMA為助溶劑、ELP為增溶劑。下式Ⅰ化合物的即用型注射用注射液（配伍藥液），其溶劑為水，溶質包括式Ⅰ化合物、DMA、ELP、乙醇、調節等滲試劑、pH調節劑，該注射液中化合物A的濃度為0.016~1.10mg/ml，該注射液的pH為7.4，且為等滲溶液。另外，本發明還公開了上述注射液製劑及其配伍藥液的製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="376" publication-number="202619772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑行運動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250115B">A63B69/00</main-classification>  
        <further-classification edition="200601120250115B">A63C17/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡單綠能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMPLE GREEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高上傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, SHANG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種滑行運動裝置，包含有一貼地件，以止滑材質構成；一滑片，以表面摩擦力小之材質構成，貼設於該貼地件之表面，可供使用者於其上進行滑行運動，該滑片之二端並與貼地件之二端相隔一距離，使該貼地件二端未受滑片覆蓋之部分形成二止滑區，可供使用者於該滑片滑行後踩踏於止滑區而止滑。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:滑行運動裝置</p>  
        <p type="p">12:貼地件</p>  
        <p type="p">14:滑片</p>  
        <p type="p">22:止滑區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="377" publication-number="202620351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續式熔鋁爐之淨化除氣裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F27D3/15</main-classification>  
        <further-classification edition="200601120241204B">F27D7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常琪鋁業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARNG CHYI ALUMINUM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種連續式熔鋁爐之淨化除氣裝置，主要係設有一爐體，該爐體設有一熔解區、一保溫區及一取湯區，該熔解區上設有一熔解加熱機，該保溫區上設有一保溫加熱機；其特徵系在：位於該保溫區之爐體底部設有數個氣體擴散器，各該氣體擴散器均設有連接於惰性氣體輸出裝置之進氣管；如此，藉由於該爐體底部所設之各該氣體擴散器注入惰性氣體，惰性氣體則由該爐體底部往上擴散噴出，可充分地將鋁液中的氣體與雜質吸附並漂浮於鋁液面上，可確實達到提升連續式熔鋁爐中鋁液純淨度之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:爐體</p>  
        <p type="p">10:熔解區</p>  
        <p type="p">11:保溫區</p>  
        <p type="p">12:取湯區</p>  
        <p type="p">2:熔解加熱機</p>  
        <p type="p">3:保溫加熱機</p>  
        <p type="p">4:氣體擴散器</p>  
        <p type="p">40:進氣管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="378" publication-number="202621041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放大器及其操作方法</chinese-title>  
        <english-title>AMPLIFIER AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">H03F3/189</main-classification>  
        <further-classification edition="200601120250206B">H03F3/24</further-classification>  
        <further-classification edition="200601120250206B">H03F1/02</further-classification>  
        <further-classification edition="200601120250206B">H04B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立積電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭天雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, TIEN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳智聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種放大器包括訊號輸入端、訊號輸出端、放大電路、及至少一可變電壓產生電路。該訊號輸入端用來接收輸入訊號。該訊號輸出端用來輸出放大訊號。該放大電路之電晶體包括第一端、第二端、控制端、及體端，其中該控制端耦接於該訊號輸入端，該第二端耦接於該訊號輸出端，及該體端的連接狀態為浮接狀態。該至少一可變電壓產生電路耦接於放大電路的電晶體。在轉態期間，該電晶體的該第二端與該第一端之間具有第一電壓差，且在穩態期間具有第二電壓差。第一電壓差大於該第二電壓差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An amplifier includes a signal input terminal, a signal output terminal, an amplification circuit, and at least one variable voltage generation circuit. The signal input terminal is used for receiving an input signal. The signal output terminal is used for outputting an amplified signal. An transistor of the amplification circuit includes a first terminal, a second terminal, a control terminal, and a body terminal, where the control terminal is coupled to the signal input terminal, the second terminal is coupled to the signal output terminal, and the body terminal is in a floating state. The at least one variable voltage generation circuit is coupled to the transistor of the amplification circuit. During a transition period, a first voltage difference presents between the second terminal and the first terminal of the transistor, and during a steady period, a second voltage difference presents therebetween. The first voltage difference is greater than the second voltage difference.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:放大器</p>  
        <p type="p">101:放大電路</p>  
        <p type="p">110:可變電壓產生電路</p>  
        <p type="p">N1,N2:節點</p>  
        <p type="p">NIN:訊號輸入端</p>  
        <p type="p">NOUT:訊號輸出端</p>  
        <p type="p">SIN:輸入訊號</p>  
        <p type="p">SOUT:放大訊號</p>  
        <p type="p">T1:電晶體</p>  
        <p type="p">V1,V2:電壓位準</p>  
        <p type="p">VDD:操作電壓端</p>  
        <p type="p">VDS:電壓差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="379" publication-number="202620795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖譜建立及比對方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">G06V10/82</main-classification>  
        <further-classification edition="202201120250303B">G06V10/40</further-classification>  
        <further-classification edition="202301120250303B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>逢甲大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林維崙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種圖譜建立及比對方法，透過一物件辨識模型辨識一待測圖像以產生複數檢測框，一處理單元根據該複數檢測框建立該待測圖像的一待測圖譜，且建立該待測圖譜與一已知圖譜群之間的關係，該處理單元根據該待測圖譜與該已知圖譜群之間的關係計算該已知圖譜群中各已知圖譜的一主類別節點值，並將各該已知圖譜的主類別節點值輸入一歸一化指數函數，以計算該待測圖譜與各該已知圖譜之間的複數總關聯權重值；本方法能使該待測圖像對應的該待測圖譜與各該已知圖譜建立關聯，進而使神經網路理解該待測圖像與各該已知圖譜的潛在關係而可採取後續流程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="380" publication-number="202619695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>床架聯結構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">A61G7/05</main-classification>  
        <further-classification edition="200601120250116B">A47C19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東庚企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG KENG ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅秋香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種床架，包括：一個床板架、一個底座、多個聯結件與多個緊固件。該床板架有二根長桿與多根短桿，該短桿跨接二該長桿。該聯結件包括：一片長板，其固定該長桿上；一片短板，其相對該長板彎折一個角度；多個連接孔，形成該短板。該緊固件穿過該連接孔並結合該底座，該底座連到該床板架的下方。該床架採用組合式機械結構，改良聯結關係，不僅縮減床架拆卸後的體積，適用容積較小的包裝容器，而且搬運空間較小，提升運輸效率，在現場能夠快速地組裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聯結件</p>  
        <p type="p">11:長板</p>  
        <p type="p">12:短板</p>  
        <p type="p">16:角肋</p>  
        <p type="p">20:床板架</p>  
        <p type="p">21:長桿</p>  
        <p type="p">22:內側</p>  
        <p type="p">23:短桿</p>  
        <p type="p">24:固定座</p>  
        <p type="p">26:緊固件</p>  
        <p type="p">27:底座</p>  
        <p type="p">28:框</p>  
        <p type="p">29:腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="381" publication-number="202619638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鞋體支撐結構及其鞋體</chinese-title>  
        <english-title>FOOTWEAR SUPPORTING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A43B13/14</main-classification>  
        <further-classification edition="200601120241130B">A43B17/02</further-classification>  
        <further-classification edition="200601120241130B">A43B23/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鞋體支撐結構，其為一框體包含一支撐構件，該支撐構件包含至少一U型結構，該U型結構朝向該框體內或是與該框體之間形成一夾角的突出，以提供該鞋體支撐性以及防護性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A frame-shaped footwear supporting structure has a supporting component. The support member has a U-shaped structure extends toward the inside of the frame or extends and forms an angle with the frame, which is applied for provide support and protection to the footwear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鞋面支撐結構</p>  
        <p type="p">11:支撐構件</p>  
        <p type="p">111:共平面彎曲部</p>  
        <p type="p">112:立式彎曲部</p>  
        <p type="p">12:前掌部</p>  
        <p type="p">13:中足部</p>  
        <p type="p">131:內側部</p>  
        <p type="p">132:外側部</p>  
        <p type="p">14:後跟部</p>  
        <p type="p">A:平面</p>  
        <p type="p">B:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="382" publication-number="202619639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具適應高彎折的支撐結構及其人身物品</chinese-title>  
        <english-title>SUPPORT STRUCTURE WITH BENDING FLEXIBILITY AND PERSONAL PROTECTIVE EQUIPMENT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A43B13/14</main-classification>  
        <further-classification edition="200601120241130B">A43B13/18</further-classification>  
        <further-classification edition="200601120241130B">A43B17/02</further-classification>  
        <further-classification edition="200601120241130B">A43B23/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具適應高彎折的支撐結構，其包含一棒材、一彎曲部，該彎曲部為該棒材任一部位所需的弧狀結構，該彎曲部包含至少一U型結構於該彎曲部上形成一類波浪結構，使支撐結構具備結構強度以並同時具備適應彎折能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A support structures with bending flexibility has a main body and a bending portion. The bending portion is mounted on a curve segment of the main body. The bending portion has at least one U-shaped structure which forms a wave-like structure on the curve segment, that make the support structure with strength and the flexibility to adapt a bending.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:棒材</p>  
        <p type="p">11:彎曲部</p>  
        <p type="p">111:U型結構</p>  
        <p type="p">112:開口</p>  
        <p type="p">113:第一彎曲部</p>  
        <p type="p">114:第二彎曲部</p>  
        <p type="p">P:水平平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="383" publication-number="202619640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開放式彈性結構</chinese-title>  
        <english-title>OPEN-ENDED FLEXIBLE STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">A43B17/14</main-classification>  
        <further-classification edition="200601120250324B">B32B5/02</further-classification>  
        <further-classification edition="201901120250324B">B32B7/02</further-classification>  
        <further-classification edition="200601120250324B">B32B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種開放式彈性結構，其包含複數個彈性體，各該彈性體之間透過一固定部固定於一片體，使得各該彈性體之末端具有一長度方向空間，其中，各該彈性體之間至少一部份具有延伸空間，使各該彈性體形成一彈性區以及一剛性區，使得該片體整體或是局部具有支撐力以及彈性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An open-ended flexible structure has multiple flexible bodies, each connected to a plate via a fixed component. The ends of each flexible body have spatial freedom in the length direction. The space between these flexible bodies includes an extension zone. The flexible bodies form a flexible region and a rigid region. This structure provides the plate, either in whole or in part, with support and elasticity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:片體</p>  
        <p type="p">20:彈性體結構</p>  
        <p type="p">21:彈性體</p>  
        <p type="p">22:固定部</p>  
        <p type="p">23:彈性區</p>  
        <p type="p">24:剛性區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="384" publication-number="202620812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有預警功能的電器系統及預警方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">G08B21/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何國維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, KOU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有預警功能的電器系統，包含一電器、一鄰近該電器的收音單元、一訊號連接於該收音單元的訊號分析單元，及一訊號連接於該訊號分析單元的電控單元。該收音單元用於接收一聲波，且轉換該聲波為一電信號。該訊號分析單元用於接收該電信號，且根據該電信號獲得一相關於該聲波的聲音訊息，該聲音訊息包括分貝值。該電控單元用於接收該聲音訊息，且根據該聲音訊息進行判斷，在該聲波的分貝值大於一閥值時，生成一警示訊息。藉此，通過分析該聲波，在該電器發生故障前先提醒使用者、或服務商，進而延長該電器的使用壽命，及提升使用安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S08:步驟流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="385" publication-number="202620759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具選擇權（期權）建倉設定功能的全自動交易程式的裝置</chinese-title>  
        <english-title>DEVICE WITH A FULLY AUTOMATIC PROGRAM HAVING SETTING FUNCTION OF OPENING POSITIONS IN OPTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250121B">G06Q40/04</main-classification>  
        <further-classification edition="201301120250121B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具選擇權(期權)建倉設定功能的全自動人工智能交易程式的裝置，具有一記憶體與一螢幕，並與一證券期貨公司伺服器之通訊模組連線，包含：一通訊模組，一程式交易連線模組、一螢幕介面產生模組、一成交數據統計模組、一建倉參數設定模組、一自動下單整合模組、一或多個處理器；螢幕介面產生模組產生一使用者介面於該螢幕，其至少包括程式交易參數設定畫面，包含：一動態自動調適價位設定欄、一買賣上限值設定區、一買賣下限值設定區、一委託口數設定欄、一自動下單時間間距設定欄，其中，該買賣上限值設定區包括一第一點數設定欄、一第一買賣檔位設定欄，該買賣下限值設定區包括一第二點數設定欄、一第二買賣檔位設定欄；建倉參數設定模組讀取該動態自動調適價位設定欄、該委託口數設定欄、該自動下單時間間距設定欄，該第一點數設定欄、該第一買賣檔位設定欄，該第二點數設定欄、該第二買賣檔位設定欄的值，並決定為一建倉參數後，傳遞給一自動下單整合模組以進行該些委託單之下單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device with a fully automatic AI program having setting function of opening positions in options multi-leg strategy, which has a memory and a screen, and is connected to a communication module of a server of a securities and futures company, including: a communication module, a group, a program trading connection module, a screen interface generation module, a transaction data statistics module, a position opening parameter setting module, an automatic order integration module, one or more processors; screen interface generation, the module generates a user interface on the screen, includes a program transaction parameter setting screen, including: a dynamic automatic adjustment price setting column, a trading upper limit setting area, a trading lower limit setting area, an order quantity setting column and an automatic order time interval setting column, the trading upper limit setting area includes a first point setting column and a first trading level setting column, the trading lower limit the value setting area includes a second point setting column and a second trading level setting column; the position setting parameter setting module reads the dynamic automatic adjustment price setting column, the order number setting column, and the automatic placement column, the values of the single time interval setting column, the first point setting column, the first trading level setting column, the second point setting column, and the second trading level setting column are determined to be a position, after the parameters are passed, they are passed to an automatic order integration module to place the orders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:具選擇權自動交易程式的裝置</p>  
        <p type="p">11:螢幕</p>  
        <p type="p">12:通訊模組</p>  
        <p type="p">13:處理器</p>  
        <p type="p">14:記憶體</p>  
        <p type="p">15:使用者介面</p>  
        <p type="p">16:應用程式</p>  
        <p type="p">900:證券期貨公司伺服器</p>  
        <p type="p">902:通訊模組</p>  
        <p type="p">903:處理器</p>  
        <p type="p">904:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="386" publication-number="202620760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具選擇權（期權）穩步清倉功能的全自動交易程式的裝置</chinese-title>  
        <english-title>DEVICE WITH A FULLY AUTOMATIC PROGRAM HAVING FUNCTION OF OPTIONS WITH CLOSING POSITIONS IN STABLIZED MANNER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250303B">G06Q40/04</main-classification>  
        <further-classification edition="202301120250303B">G06Q40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具選擇權(期權)穩步清倉功能的全自動人工智能交易程式的裝置，具有一記憶體與一螢幕，並與一證券期貨公司伺服器之通訊模組連線，包含：一通訊模組、一程式交易連線模組、一螢幕介面產生模組、一成交數據統計模組、一建倉參數設定模組、一自動下單整合模組、一或多個處理器；螢幕介面產生模組產生一使用者介面於該螢幕，其至少包括程式交易參數設定畫面，包含：一動態自動調適價位設定欄、至少一平倉順序參數選項、一委託口數設定欄、一自動下單時間間距設定欄；穩步清倉設定模組讀取動態自動調適價位設定欄、該委託口數設定欄、該自動下單時間間距設定欄，該至少一平倉順序參數選項被選擇的一平倉邏輯，該並決定為一平倉參數後，傳遞給一自動下單整合模組以進行該些委託單之下單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device with a fully automatic AI program having function of options with closing positions in stabilized manner, has a memory and a screen, and is connected to a communication module of a securities and futures company server, including: a communication module, a program A trading connection module, a screen interface generation module, a transaction data statistics module, a position opening parameter setting module, an automatic order integration module, and one or more processors; the screen interface generation module generates a user interface is on this screen, which at least includes a program trading parameter setting screen, including: a dynamic automatic adjustment price setting column, at least one closing order parameter option, an order quantity setting column, and an automatic order time interval setting column; the steady liquidation setting module reads the dynamic automatic adjustment price setting column, the order number setting column, the automatic order time interval setting column, and the closing order in which at least one closing sequence parameter option is selected after the logic is determined as a position closing parameter, it is passed to an automatic order integration module to place orders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:具選擇權自動交易程式的裝置</p>  
        <p type="p">11:螢幕</p>  
        <p type="p">12:通訊模組</p>  
        <p type="p">13:處理器</p>  
        <p type="p">14:記憶體</p>  
        <p type="p">15:使用者介面</p>  
        <p type="p">16:應用程式</p>  
        <p type="p">900:證券期貨公司伺服器</p>  
        <p type="p">902:通訊模組</p>  
        <p type="p">903:處理器</p>  
        <p type="p">904:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="387" publication-number="202620761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具選擇權（期權）指定清倉功能的全自動交易程式的裝置</chinese-title>  
        <english-title>DEVICE WITH A FULLY AUTOMATIC PROGRAM HAVING FUNCTION OF OPTIONS WITH CLOSING POSITIONS IN PART DESIGNED MANNER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250208B">G06Q40/04</main-classification>  
        <further-classification edition="201301120250208B">G06F3/048</further-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛常浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEN, CHANG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具選擇權(期權)指定清倉功能的全自動人工智能交易程式的裝置，具有一記憶體與一螢幕，並與一證券期貨公司伺服器之通訊模組連線，包含：一通訊模組、一程式交易連線模組、一螢幕介面產生模組、一成交數據統計模組、一建倉參數設定模組、一自動下單整合模組、一或多個處理器；螢幕介面產生模組產生一使用者介面於該螢幕，其至少包括程式交易參數設定畫面，包含：一動態自動調適價位設定欄、至少一平倉順序參數選項、一委託口數設定欄、一自動下單時間間距設定欄，一指定清倉庫存選項與一指定清倉部位選項至少其一；指定清倉設定模組讀取動態自動調適價位設定欄、該委託口數設定欄、該自動下單時間間距設定欄，該至少一平倉順序參數選項被選擇的一平倉邏輯，該指定清倉庫存選項與該指定清倉部位選項至少其一的一指定平倉庫存，該並決定為一平倉參數後，傳遞給一自動下單整合模組以進行該些委託單之下單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device with a fully automatic AI program having function of options with closing positions in part designated manner, has a memory and a screen and is connected to a communication module of a securities and futures company server, includes: a communication module and a program, a trading connection module, a screen interface generation module, a transaction data statistics module, a position opening parameter setting module, an automatic order integration module, and one or more processors; the screen interface generation module generates a user interface on this screen, includes a program trading parameter setting screen, including: a dynamic automatic adjustment price setting column, at least one closing order parameter option, an order quantity setting column, and an automatic order time interval setting column, at least one of a designated closing inventory option and a designated closing position option; the designated closing setting module reads the dynamic automatic adjustment price setting column, the order number setting column, and the automatic order time interval setting column, a liquidation logic in which the at least one liquidation sequence parameter option is selected, a designated liquidation inventory of at least one of the designated liquidation stock option and the designated liquidation position option, and the combination is determined as a liquidation parameter and then passed to an automatic order integration module to place orders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:具選擇權自動交易程式的裝置</p>  
        <p type="p">11:螢幕</p>  
        <p type="p">12:通訊模組</p>  
        <p type="p">13:處理器</p>  
        <p type="p">14:記憶體</p>  
        <p type="p">15:使用者介面</p>  
        <p type="p">16:應用程式</p>  
        <p type="p">900:證券期貨公司伺服器</p>  
        <p type="p">902:通訊模組</p>  
        <p type="p">903:處理器</p>  
        <p type="p">904:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="388" publication-number="202621300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橫向擴散金屬氧化物半導體及其製造方法</chinese-title>  
        <english-title>LDMOS AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260203B">H10D84/80</main-classification>  
        <further-classification edition="202601120260203B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUAN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種橫向擴散金屬氧化物半導體，包含多條間隔排列的鰭部，其中每一該鰭部具有一凹陷區域，位於該些凹陷區域上的淺溝槽隔離結構構成一厚氧化層、一閘極越過該些鰭部，其中該厚氧化層靠近該閘極的一側並與該閘極部分重疊、以及一源極與一汲極分別位於該閘極兩側的每一該鰭部，其中該厚氧化層從該閘極延伸出至該汲極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A LDMOS is provided in the present invention, including multiple fins spaced apart, wherein each fin has a recess region, a shallow trench isolation in those recess regions forms a thick oxide layer, a gate crosses over those fins, wherein the thick oxide layer is close to one side of the gate and partially overlaps the gate, and a source and a drain respectively at two sides of the gate in each fin, wherein the thick oxide layer extends outside the gate to the drains.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">102:淺溝槽隔離結構</p>  
        <p type="p">104:閘極氧化層</p>  
        <p type="p">106:厚氧化層</p>  
        <p type="p">108:P型井</p>  
        <p type="p">110:N型漂移區</p>  
        <p type="p">112:間隔壁</p>  
        <p type="p">B:基極</p>  
        <p type="p">D:汲極</p>  
        <p type="p">G:閘極</p>  
        <p type="p">R:凹陷區域</p>  
        <p type="p">S:源極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="389" publication-number="202619636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運動鞋、具有鞋釘的運動鞋的鞋底結構及其製造方法</chinese-title>  
        <english-title>SPORT SHOE, SOLE STRUCTURE OF SPORT SHOE WITH SHOE STUDS, AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">A43B5/02</main-classification>  
        <further-classification edition="200601120250116B">A43B13/18</further-classification>  
        <further-classification edition="200601120250116B">A43B13/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>開曼群島商志強國際企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPORTS GEAR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>開爾福　博納法蘭茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAEUFER, BERNHARD FRANZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有鞋釘的運動鞋的鞋底結構包括：由第一彈性材料製成且相互分離的多個內釘元件；設有供內釘元件穿過的多個外底孔的一外底層，外底孔的孔面連接內釘元件的頂部；以及由第二彈性材料製成且彼此分離的多個外釘元件，形成於內釘元件上，包圍內釘元件或被內釘元件包圍，並與外底層隔開。各個內釘元件和在其上形成的外釘元件共同形成鞋釘。在鞋釘中，從外釘元件與外底層之間的間隙可看見內釘元件。第一彈性材料的彈性高於第二彈性材料的彈性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sole structure of a sport shoe with shoe studs includes: inner cleat elements separated from each other and made of a first elastic material; an outsole layer including outsole holes through which the inner cleat elements pass, and hole surfaces of the outsole holes connecting with top portions of the inner cleat elements; and outer cleat elements, formed on and surrounding or being surrounded by the inner cleat elements, separated from each other and from the outsole layer, made of a second elastic material. Each of the inner cleat elements and the outer cleat element formed thereon together form the shoe stud. In the shoe stud, the inner cleat element is visible from a gap between the outer cleat element and the outsole layer. Elasticity of the first elastic material is higher than elasticity of the second elastic material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:內釘元件</p>  
        <p type="p">215:上階部</p>  
        <p type="p">216:下階部</p>  
        <p type="p">216A:下階部</p>  
        <p type="p">216B:下階部</p>  
        <p type="p">216C:下階部</p>  
        <p type="p">22:外釘元件</p>  
        <p type="p">225:釘孔</p>  
        <p type="p">226:凹槽</p>  
        <p type="p">31:外底層</p>  
        <p type="p">32:外底孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="390" publication-number="202621225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於液冷燒機裝置之水箱及其除氣方法</chinese-title>  
        <english-title>TANK ADAPTED FOR LIQUID-COOLING BURN-IN APPARATUS AND DEGAS METHOD FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05K7/20</main-classification>  
        <further-classification edition="200601120241204B">G06F1/20</further-classification>  
        <further-classification edition="200601120241204B">F28D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊士博國際商業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EXPERT INTERNATIONAL MERCANTILE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫偉志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何佳君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種適用於液冷燒機裝置之水箱。液冷迴路運行過程中所混入的氣泡，若該氣泡未經妥當的處理，在密閉系統中可能造成泵浦及管路之破壞。本發明之水箱主要針對排氣設計，液體流通過時將氣泡去除，並使氣泡不再混入液體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a tank adapted for liquid-cooling burn-in apparatus. In liquid loop operation, bubbles could be introduced into the liquid which may cause damages to the pump and delivery pipe of the closed system. The tank according to the invention is mainly designed for degas such that the bubbles is able to be removed and kept from being introduced back into the liquid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">51:進液埠</p>  
        <p type="p">52:出液埠</p>  
        <p type="p">541:排氣孔</p>  
        <p type="p">55:儲液區</p>  
        <p type="p">551:水位</p>  
        <p type="p">56:排氣區</p>  
        <p type="p">61:上擾流片</p>  
        <p type="p">62:下擾流片</p>  
        <p type="p">G:氣艙</p>  
        <p type="p">BB:氣泡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="391" publication-number="202620513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光控超表面結構及其製作方法</chinese-title>  
        <english-title>LCM STRUCTURE AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B27/10</main-classification>  
        <further-classification edition="200601120260223B">G02F1/1333</further-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification>  
        <further-classification edition="202601120260223B">H10P50/26</further-classification>  
        <further-classification edition="200601120260223B">C09K13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭致瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱崇益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光控超表面結構包含一複合介電層，其中複合介電層包含一氮化碳化矽層、一氧化層和一氮化矽層由下至上堆疊，一第一金屬欄杆由一底座和一金屬條組成，其中埋入於氧化矽層和氮化碳化矽層的第一金屬欄杆定義為一底座，埋入氮化矽層以及凸出於氮化矽層之上的第一金屬欄杆定義為一金屬條，在氧化矽層中的底座的寬度往氮化碳化矽層的方向連續地逐漸增大，一第二金屬欄杆設置於第一金屬欄杆之一側，第二金屬欄杆和第一金屬欄杆的結構相同，一空隙設置於第一金屬欄杆和第二金屬欄杆之間，複數個液晶填滿空隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An LCM structure includes a composite dielectric layer, wherein the composite dielectric layer includes a nitrogen doped silicon caribe layer, an oxide layer and a silicon nitride layer stacked from bottom to top. A first metal rail includes a pedestal and a metal strip. The first metal rail embedded in the silicon oxide layer and the silicon nitride carbide layer is defined as the pedestal, and the first metal railing embedded in the silicon nitride layer and protruding above the silicon nitride layer is defined as the metal strip. The width of the pedestal in the silicon oxide layer continuously and gradually increases along a direction toward the nitrogen doped silicon caribe layer. A second metal rail is disposed on one side of the first metal rail. The structure of the first metal rail is the same as the structure of the second metal rail. A gap is disposed between the first metal rail and the second metal rail. Nemours liquid crystals fill the gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一介電層</p>  
        <p type="p">10a:氧化矽層</p>  
        <p type="p">10b:氮化碳化矽層</p>  
        <p type="p">12:複合介電層</p>  
        <p type="p">12a:氮化碳化矽層</p>  
        <p type="p">12b:氧化層</p>  
        <p type="p">12c:氮化矽層</p>  
        <p type="p">14:第二介電層</p>  
        <p type="p">16:第一導線</p>  
        <p type="p">18:第一插塞</p>  
        <p type="p">24:擴散阻障層</p>  
        <p type="p">26:金屬層</p>  
        <p type="p">30:保護層</p>  
        <p type="p">32:液晶</p>  
        <p type="p">34a:第一金屬欄杆</p>  
        <p type="p">34b:第二金屬欄杆</p>  
        <p type="p">36:底座</p>  
        <p type="p">38:金屬條</p>  
        <p type="p">40:銅導線結構</p>  
        <p type="p">42:第二導線</p>  
        <p type="p">44:反射層</p>  
        <p type="p">100:光控超表面結構</p>  
        <p type="p">A:邏輯元件區</p>  
        <p type="p">B:光學元件區</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W3:寬度</p>  
        <p type="p">W4:寬度</p>  
        <p type="p">W5:寬度</p>  
        <p type="p">W6:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="392" publication-number="202619659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於咖啡機的清洗裝置及清洗方法</chinese-title>  
        <english-title>CLEANING DEVICE AND CLEANING METHOD FOR COFFEE MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">A47J31/60</main-classification>  
        <further-classification edition="200601120241226B">A47J31/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　永德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　永德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於用於一咖啡機的清洗裝置及清洗方法。該咖啡機包含一連接埠。該清洗裝置包括：一殼體及設置於該殼體中的一間隔件。該殼體包含：一第一側，其經構型以適於附接至並密封該咖啡機之該連接埠，該第一側界定一第一開口於其中；及一第二側，其與該第一側相對。該間隔件經構形以將該殼體之內部界定為一第一腔室以及一第二腔室，其中，該第一腔室在鄰近該殼體之該第二側處與該第二腔室流體連接，該第二腔室與該殼體之該第一側之該第一開口流體連接。一種清洗方法，其利用前述清洗裝置清洗該咖啡機之內部流體管線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is related to a cleaning device and cleaning method for a coffee machine. The coffee machine includes a connection port. The cleaning device comprises a housing and a spacer disposed in the housing. The housing includes: a first side configured to be attached to and seal the connection port of the coffee machine, the first side defining a first opening therein and a second side opposite to the first side. The spacer is configured to define a first chamber and a second chamber inside the housing, wherein the first chamber is fluidly connected to the second chamber at a portion adjacent to the second side of the housing, and the second chamber is fluidly connected to the first opening at the first side of the housing. The cleaning method uses the aforementioned cleaning device to cleaning the pipes in the coffee machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:清洗裝置</p>  
        <p type="p">202:殼體</p>  
        <p type="p">204:第一側</p>  
        <p type="p">205:卡扣結構</p>  
        <p type="p">206:第二側</p>  
        <p type="p">208:第一開口</p>  
        <p type="p">210:洩壓閥</p>  
        <p type="p">211:洩壓口</p>  
        <p type="p">212:緊固件</p>  
        <p type="p">213:非圓形法蘭</p>  
        <p type="p">214:墊片</p>  
        <p type="p">215:頂針</p>  
        <p type="p">216:杯</p>  
        <p type="p">217:圓筒形本體</p>  
        <p type="p">218:第三側</p>  
        <p type="p">219:O型環</p>  
        <p type="p">220:第四側</p>  
        <p type="p">221:突起</p>  
        <p type="p">222:凹陷</p>  
        <p type="p">223:非圓形凹槽</p>  
        <p type="p">224:第二開口</p>  
        <p type="p">226:中空圓柱體</p>  
        <p type="p">251:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="393" publication-number="202620733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用照片案件通報的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REPORTING USING PHOTO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/10</main-classification>  
        <further-classification edition="202201120250303B">G06V10/70</further-classification>  
        <further-classification edition="202201120250303B">G06V10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡翠文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUEY WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王怡婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣佩真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種利用照片案件通報的系統及方法。所述方法包括以下步驟：由照片鑑別模組利用深度學習技術來鑑別照片是否為偽造照片；由照片分析模組利用人工智慧模型來分析出照片中的物件；由拍攝位置獲得模組獲得照片的拍攝位置；由情境識別模組利用情境識別技術來識別出對應於照片的情境；由案件分類模組獲得對應於照片的案件類別；以及由案件處理模組傳送案件通報訊息至拍攝位置當地對應機關裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method for reporting using a photo are provided. The method includes following steps: using, by a photo identification module, a deep learning technology to identify whether the photo is a fake photo; using, by a photo analysis module, an artificial intelligence model to analyze an object in the photo; obtaining, by a shooting position obtaining module, a shooting position of the photo; using, by a situation recognition module, a situation recognition technology to identify a situation corresponding to the photo; obtaining, by a case classification module, a case category corresponding to the photo; and transmitting, by a case processing module, a reporting message to a shooting position local agency device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201、S202、S203、S204、S205、S206:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="394" publication-number="202619857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釘槍之可封閉的釘匣結構</chinese-title>  
        <english-title>CLOSEABLE NAIL BOX STRUCTURE OF NAIL GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">B25C1/00</main-classification>  
        <further-classification edition="200601120250116B">B25C5/16</further-classification>  
        <further-classification edition="200601120250116B">B25C7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑽全實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASSO INDUSTRY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>留貴鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, GUEY HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請係關於一種釘槍之可封閉的釘匣結構，包括釘排置放座、蓋體及推釘組件，釘排置放座包括支架及置釘台，支架呈L型且其頂端連接在握柄部，置釘台一端連接於出釘部另一端與支架連接；蓋體沿著置釘台配置並包括樞接釘排置放座的立板及位於握柄部和置釘台間並連接立板的橫板，在橫板設有平行於立板的止擋牆，蓋體可樞轉地與置釘台形成有開啟位置和封閉位置；推釘組件包括推釘件，推釘件可沿著置釘台與蓋體間移動，且鄰近止擋牆設有鎖臂，蓋體在封閉位置時鎖臂和止擋牆相互限位，蓋體在開啟位置時鎖臂脫離止擋牆限制。藉此，不會因為震動而使蓋體產生翻轉，並讓釘子能夠沿著軌道的動線推進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a closeable nail box structure of a nail gun having a nail row holder, a cover and a nail pushing assembly. The nail row holder has a bracket and a nail platform. The bracket is of a L-shape and connected with a handle via a top thereof. The nail platform has one end is connected to a nail output part and another end connected to the bracket. The cover is arranged along the nail platform and provided with a up-right plate pivoted with the nail row holder and a horizontal plate which is disposed between the handle and the nail platform and connected with the vertical plate. A wall parallel to the up-right plate is provided on the horizontal plate. The cover may pivoted relative to the nail platform to an open position and a closed position. The nail pushing assembly has a nail pushing piece which is movable along a space between the nail platform and the cover. A lock arm is provided adjacent to the wall. When the cover is at the closed position, the lock arm and the wall are limited by each other. When the cover is at the open position, the lock arm is released from the wall.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可封閉的釘匣結構</p>  
        <p type="p">11:支架</p>  
        <p type="p">12:置釘台</p>  
        <p type="p">20:蓋體</p>  
        <p type="p">30:推釘組件</p>  
        <p type="p">7:釘排</p>  
        <p type="p">8:釘槍</p>  
        <p type="p">81:握柄部</p>  
        <p type="p">82:出釘部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="395" publication-number="202620539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>罩幕模組及其罩幕圖案轉移方法</chinese-title>  
        <english-title>PHOTOMASK MODULE AND PHOTOMASK PATTERN TRANSFER METHOD APPLYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260203B">G03F1/50</main-classification>  
        <further-classification edition="201201120260203B">G03F1/58</further-classification>  
        <further-classification edition="202601120260203B">H10P76/00</further-classification>  
        <further-classification edition="202601120260203B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝君逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤春祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧柏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, BO-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種罩幕模組，包括第一罩幕以及第二罩幕。第一罩幕包括一個主線路圖案。第二罩幕包括一個銲墊圖案，銲墊圖案包括一個銲墊本體圖案部以及一個延伸圖案部。其中，延伸圖案部自銲墊本體圖案部向外延伸，當第一罩幕和第二罩幕重疊時，延伸圖案部至少一部分被主線路圖案所圍繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photomask module includes a first photomask and a second photomask. The first photomask includes a main circuit pattern. The second photomask includes a pad pattern, and the pad pattern includes a pad body pattern portion and an extension pattern portion. The extended pattern portion extends outward from the pad body pattern portion. When the first photomask and the second photomask overlap, the extension pattern portion is at least partially surrounded by the main circuit pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:罩幕模組</p>  
        <p type="p">11:第一罩幕</p>  
        <p type="p">12:第二罩幕</p>  
        <p type="p">100:電路設計圖案</p>  
        <p type="p">110:主線路圖案</p>  
        <p type="p">111:子線路圖案</p>  
        <p type="p">120:銲墊圖案</p>  
        <p type="p">121:銲墊本體圖案部</p>  
        <p type="p">122:延伸圖案部</p>  
        <p type="p">122a:子延伸圖案部</p>  
        <p type="p">122b:子延伸圖案部</p>  
        <p type="p">122c:子延伸圖案部</p>  
        <p type="p">122t:端部</p>  
        <p type="p">123:連接介面</p>  
        <p type="p">124:輔助圖案</p>  
        <p type="p">124a:本體部</p>  
        <p type="p">124b:延伸部</p>  
        <p type="p">P111:寬度</p>  
        <p type="p">P121:寬度</p>  
        <p type="p">P122:寬度</p>  
        <p type="p">P123:寬度</p>  
        <p type="p">P124:寬度</p>  
        <p type="p">P111n:鄰接部寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="396" publication-number="202619882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共模製鞋部件及其製備方法</chinese-title>  
        <english-title>CO-MOLDED SHOE COMPONENT AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250106B">B29D35/12</main-classification>  
        <further-classification edition="200601120250106B">B29C44/16</further-classification>  
        <further-classification edition="200601120250106B">A43B13/28</further-classification>  
        <further-classification edition="200601320250106B">B29L31/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豐泰企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG TAY ENTERPRISES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種共模製鞋部件及其製備方法，其中該鞋部件包括一大底及一中底，該大底的一側具有複數個定錨結構，該些定錨結構可以是凸起、凹陷或是貫穿孔的型態；該中底係透過一超臨界流體進行物理發泡所成型並同時結合該大底，該中底的一部分完全結合該些定錨結構，藉此以增加接觸表面積的方式來實現強化該大底與該中底結合後的牢固性。該製備方法是將已製備完成的該大底移置一模具中，透過控制該模具內的氣體壓力值，並於注入一熱可塑性發泡流體材料後，利用洩壓方式使該熱可塑性發泡流體材料發泡成型該中底並與該大底結合為一體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A co-molded shoe component and a method of manufacturing the same are provided. The shoe component includes an outsole and a midsole. A side of the outsole has a plurality of anchor structures. Each anchor structure is a protrusion, a recess, or a through hole. The midsole is formed by physically foaming with a supercritical fluid and is engaged with the outsole during the formation of the midsole. A part of the midsole is completely engaged with the anchor structures, thereby enhancing the engaging stability between the outsole and the midsole by increasing a contact area. The method of manufacturing the co-molded shoe component includes placing the outsole, which is provided in advance, in a mold; controlling an air pressure in the mold; injecting a thermoplastic foaming fluid; and releasing the air pressure to foam the thermoplastic foaming fluid to form the midsole and engage the midsole with the outsole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鞋部件</p>  
        <p type="p">10:大底</p>  
        <p type="p">20:中底</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="397" publication-number="202620742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>綠能商家與消費者媒合與綠能支付回饋系統及其方法</chinese-title>  
        <english-title>MATCHING GREEN ENERGY MERCHANT AND GREEN ENERGY CONSUMER AND GREEN ENERGY PAYMENT FEEDBACK SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241226B">G06Q20/38</main-classification>  
        <further-classification edition="202301120241226B">G06Q30/0207</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彰化商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉人毓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種綠能商家與消費者媒合與綠能支付回饋系統及其方法，商家端透過銀行端申請綠色電子收款服務以取得綠能資格，消費端與綠能帳戶或是綠能信用卡綁定以取得綠能資格，由銀行端基於非綠能消費資訊以及綠能消費資訊的消費類型次數提供具綠能資格的商家端與具綠能資格的消費端的媒合，且商家端與消費端使用綠能支付進行交易時，消費者端更進一步自銀行端獲得綠能虛擬幣的回饋，進而使得實現綠能消費循環，藉此可以達成提供綠能商家與綠能消費者媒合與提供綠能消費循環的綠能支付的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A matching green energy merchant and green energy consumer and green energy payment feedback system and a method thereof are provided. Green electronic payment service is applied to obtain green energy qualification by merchant terminal through bank terminal. Green energy account or green energy credit card is bound by consumer terminal to obtain green energy qualification. Merchant terminal with green energy qualification and consumer terminal with green energy qualification are matched by bank terminal based on number of consumption types of non-green energy consumption information and number of consumption types of green energy consumption information. Feedback of green energy virtual currency is obtained by consumer terminal from bank terminal when merchant terminal and consumer terminal use green energy payment for transaction to realize green energy consumption cycle. Therefore, the efficiency of matching green energy merchants and green energy consumers and providing green energy payment for green energy consumption cycle may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:商家端</p>  
        <p type="p">20:消費端</p>  
        <p type="p">30:銀行端</p>  
        <p type="p">31:點數資料庫</p>  
        <p type="p">32:商家端交易歷史資料庫</p>  
        <p type="p">33:消費端交易歷史資料庫</p>  
        <p type="p">34:傳輸模組</p>  
        <p type="p">35:媒合模組</p>  
        <p type="p">36:查詢模組</p>  
        <p type="p">37:回饋計算模組</p>  
        <p type="p">38:點數累積模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="398" publication-number="202620392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱效能判斷裝置、馬達驅控器以及充電系統</chinese-title>  
        <english-title>HEAT DISSIPATION PERFORMANCE DETERMINATION DEVICE,MOTOR DRIVER CONTROLLER AND CHARGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241203B">G01K13/00</main-classification>  
        <further-classification edition="201601120241203B">H02K11/25</further-classification>  
        <further-classification edition="200601120241203B">H02J7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周歆苹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳至強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱效能判斷裝置，適用於散熱元件，包含：預充電路、惠斯登電橋以及控制元件。預充電路具有電源正極連接端。惠斯登電橋具有電源負極連接端，且用於貼附於散熱元件的表面上，且可直接接觸散熱元件。惠斯登電橋包括第一電阻器到第四電阻器以及跨接電阻器，惠斯登電橋的四個電阻器中的至少一者為壓力電阻器。控制元件用於判斷跨接電阻器的兩端之間的電壓差，以及於電壓差與閾值電壓的比較結果指示散熱效能異常時，控制預充電路不透過電源正極連接端接收電力。本發明可用於馬達驅控器以及充電系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation performance determination device, adapted to a heat dissipation element, includes: a pre-charge circuit, a Wheatstone bridge and a control element. The pre-charge circuit has a positive power connection terminal. The Wheatstone bridge includes a first resistor to a fourth resistor and a cross resistor. At least one of the first resistor to the fourth resistor is a pressure resistor. The control element is configured to determine a voltage difference between two terminals of the cross resistor, and control the pre-charge circuit to not receive power through the positive power connection terminal when a comparison result between the voltage difference and a threshold voltage indicates an abnormal heat dissipation performance. The present disclosure may be applied to a motor driver controller and charging system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:散熱效能判斷裝置</p>  
        <p type="p">111:惠斯登電橋</p>  
        <p type="p">1111:第一電阻器</p>  
        <p type="p">1112:第二電阻器</p>  
        <p type="p">1113:第三電阻器</p>  
        <p type="p">1114:第四電阻器</p>  
        <p type="p">1115:跨接電阻器</p>  
        <p type="p">112:預充電路</p>  
        <p type="p">113:控制元件</p>  
        <p type="p">110a:電源負極連接端</p>  
        <p type="p">110b:電源正極連接端</p>  
        <p type="p">T1:第一連接點</p>  
        <p type="p">T2:第二連接點</p>  
        <p type="p">T3:第三連接點</p>  
        <p type="p">T4:第四連接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="399" publication-number="202619980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含油脂廢水處理方法</chinese-title>  
        <english-title>OILY WASTEWATER TREATMENT METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241125B">C02F1/40</main-classification>  
        <further-classification edition="202301120241125B">C02F1/56</further-classification>  
        <further-classification edition="202301120241125B">C02F3/26</further-classification>  
        <further-classification edition="202301120241125B">C02F1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張良宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張良宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃嘉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳保全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PAO-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許俊男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含油脂廢水處理方法，包括以下步驟：廢水投入步驟、加壓浮除步驟、油泥蒐集步驟、膠羽形成步驟以及脫水壓泥步驟。其中，該廢水投入步驟提供含油脂廢水並導入浮除槽。加壓浮除步驟藉由浮除槽噴出的氣泡，使含油脂廢水中的雜質漂浮於表面。油泥蒐集步驟藉由刮除機構將漂浮於含油脂廢水表面的雜質刮除蒐集形成油泥，再送往油泥引流道。膠羽形成步驟在油泥中加入混凝劑，使油泥絮凝膠羽。脫水壓泥步驟擠壓油泥濾出多餘水分，使膠羽形成泥餅。該混凝劑包含：調理劑以及高分子絮凝劑，該調理劑為貝類廢棄物能夠改變油泥的界達電位增加絮凝效果，以及提高油泥鹼度抑制酸敗臭味產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an oily wastewater treatment methods, which includes the following steps a wastewater input step, a dissolved air flotation step, a sludge collection step, a floc formation step, and a dewatering step. In the wastewater input step, oily wastewater is introduced into the flotation tank. The dissolved air flotation step utilizes bubbles from the flotation tank to float the impurities to the surface of oily wastewater. The sludge collection step uses a scraping mechanism to scrape off the impurities floating on the surface of oily wastewater and collect them as sludge, which is then sent to the sludge diversion channel. In the floc formation step, a coagulant is added to the sludge to make the sludge flocculate floc. The dewatering step involves the sludge t squeezed out excess water, so that the floc forms mud cakes. The coagulant includes a conditioner and a polymer flocculant. The conditioner is made from shellfish waste , and alters the zeta potential of the sludge to enhance the flocculation effect and increases the alkalinity to prevent the production of rancid odors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:廢水投入步驟</p>  
        <p type="p">S2:加壓浮除步驟</p>  
        <p type="p">S3:油泥蒐集步驟</p>  
        <p type="p">S4:膠羽形成步驟</p>  
        <p type="p">S5:脫水壓泥步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="400" publication-number="202620813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143204</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車的電子圍籬控制系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G08B21/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏佳騰動力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭正欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃立洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張竣智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王昱棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動車的電子圍籬控制系統，包含一協作裝置與一車輛控制裝置，該協作裝置接收一即時定位座標，當該協作裝置的一處理器判斷該即時定位座標超出一導航地圖資訊的一範圍邊界時，輸出一限速值及一警報訊息中的至少一者；該車輛控制裝置設置於一電動車並通信連接該協作裝置，當該車輛控制裝置的控制器收到該限速值且判斷該電動車的車速大於或等於該限速值時，調整輸出至該電動車的一動力馬達的驅動電流，使該動力馬達的轉速低於或等於一目標轉速，當該車輛控制裝置的控制器收到該警報訊息時，控制該電動車發出警報。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:協作裝置</p>  
        <p type="p">11:處理器</p>  
        <p type="p">12:衛星定位接收器</p>  
        <p type="p">13:儲存器</p>  
        <p type="p">14:第一通信介面</p>  
        <p type="p">15:行動通信介面</p>  
        <p type="p">20:車輛控制裝置</p>  
        <p type="p">21:控制器</p>  
        <p type="p">22:第二通信介面</p>  
        <p type="p">30:動力馬達</p>  
        <p type="p">31:馬達控制器</p>  
        <p type="p">32:把手位置感知器</p>  
        <p type="p">33:傳動機構</p>  
        <p type="p">34:驅動輪</p>  
        <p type="p">35:車速計</p>  
        <p type="p">40:伺服器</p>  
        <p type="p">P:即時定位座標</p>  
        <p type="p">M:導航地圖資訊</p>  
        <p type="p">I:驅動電流</p>  
        <p type="p">S1:驅動命令</p>  
        <p type="p">θ:把手位置信號</p>  
        <p type="p">V:車速</p>  
        <p type="p">Wm:轉速</p>  
        <p type="p">N1:限速值</p>  
        <p type="p">N2:警報訊息</p>  
        <p type="p">N3:通知訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="401" publication-number="202619778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過濾件</chinese-title>  
        <english-title>A FILTER ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B01D29/15</main-classification>  
        <further-classification edition="200601120241125B">B01D29/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高伶甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING-ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-SIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彥晧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種過濾件，用以解決習知過濾件過濾的效果不佳的問題。係包含：一殼體，具有一第一殼體及一第二殼體，該第一殼體具有一入液口，該第二殼體具有一出液口；一導流件，該導流件具有一導流槽，該導流槽連通該入液口及該出液口，該導流槽具有數個流道，該數個流道的寬度由該入液口朝該出液口的液流方向成逐漸減小分布；及至少一過濾件，該至少一過濾件具有一過濾部，該過濾部位於該導流槽及該第一殼體的一收集槽之間，該收集槽藉由一濾液通道連通該殼體的一濾液出口。藉此可以達成提升過濾效率功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A filter element is used to solve the problem of poor filtration effect of conventional filter elements. Includes: a housing with a first housing and a second housing, the first housing has a liquid inlet, the second housing has a liquid outlet; a flow guide, the flow guide has a flow guide groove that communicates with the liquid inlet and the liquid outlet. The guide groove has several flow channels, and the width of the several flow channels extends from the liquid inlet to the liquid outlet. The liquid flow direction gradually decreases in distribution; and at least one filter element, the at least one filter element has a filter part, the filter part is located between the guide groove and a collection groove of the first housing, the collection groove is connected to a filtrate outlet of the housing through a filtrate channel. This can achieve the effect of improving filtration efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">1a:第一殼體</p>  
        <p type="p">1b:第二殼體</p>  
        <p type="p">11:入液口</p>  
        <p type="p">12:出液口</p>  
        <p type="p">13,15:收集槽</p>  
        <p type="p">14:濾液出口</p>  
        <p type="p">2:導流件</p>  
        <p type="p">2a:第一表面</p>  
        <p type="p">2b:第二表面</p>  
        <p type="p">21:導流槽</p>  
        <p type="p">21a:第一端</p>  
        <p type="p">21b:第二端</p>  
        <p type="p">22:連通孔</p>  
        <p type="p">23:截流肋</p>  
        <p type="p">23a:剪切端</p>  
        <p type="p">231:第一截流肋</p>  
        <p type="p">232:第二截流肋</p>  
        <p type="p">233:第三截流肋</p>  
        <p type="p">24:貫通孔</p>  
        <p type="p">3:過濾件</p>  
        <p type="p">31:過濾部</p>  
        <p type="p">32:貫孔</p>  
        <p type="p">R1:流道</p>  
        <p type="p">R2:支流道</p>  
        <p type="p">H:貫孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="402" publication-number="202619935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機車結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B62K11/02</main-classification>  
        <further-classification edition="200601120241230B">B62K25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種機車結構，機車至少包括有車架單元，該車架單元具有頭管，由該頭管朝車體後方延設的主車架，該主車架朝車體後方連接有左右一對的連接板架；該連接板架樞設有後搖臂；該後搖臂與該車架單元之間設有後避震器；該後避震器以上樞接部與該車架單元樞接；該連接板架外側蓋設有板架蓋，該連接板架上至少開設有貫通的開口部，該板架蓋對應該開口部開設有維修口部；由車體側視觀視，可由該維修口部與該開口部可觀視到該後避震器的該上樞接部；藉此可使該後避震器朝車體前方設置，從而可使機車整體部件配設緊緻化；更可便利該後避震器的維修工程進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:機車</p>  
        <p type="p">2:車架單元</p>  
        <p type="p">21:頭管</p>  
        <p type="p">22:聯板機構</p>  
        <p type="p">221:上聯板</p>  
        <p type="p">222:下聯板</p>  
        <p type="p">23:轉向機構</p>  
        <p type="p">231:轉向把手</p>  
        <p type="p">24:前叉單元</p>  
        <p type="p">25:主車架</p>  
        <p type="p">251:上側車架</p>  
        <p type="p">2511:傾斜段</p>  
        <p type="p">2512:延伸段</p>  
        <p type="p">252:下側車架</p>  
        <p type="p">26:連接板架</p>  
        <p type="p">26a:第一開口部</p>  
        <p type="p">26b:第二開口部</p>  
        <p type="p">263:第一連桿</p>  
        <p type="p">2631:樞接部</p>  
        <p type="p">264:第二連桿</p>  
        <p type="p">27:後車架</p>  
        <p type="p">271:上升段</p>  
        <p type="p">272:延設段</p>  
        <p type="p">28:後搖臂</p>  
        <p type="p">3:動力單元</p>  
        <p type="p">31:汽缸部</p>  
        <p type="p">32:傳動部</p>  
        <p type="p">321:帶動件</p>  
        <p type="p">6:後避震器</p>  
        <p type="p">62:下樞接部</p>  
        <p type="p">B:置物箱</p>  
        <p type="p">C:空氣過濾裝置</p>  
        <p type="p">H:散熱器</p>  
        <p type="p">M:排氣裝置</p>  
        <p type="p">P:腳踏桿</p>  
        <p type="p">T:燃油箱</p>  
        <p type="p">FW:前輪</p>  
        <p type="p">RW:後輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="403" publication-number="202619826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工系統及光學繞射元件</chinese-title>  
        <english-title>LASER PROCESSING SYSTEM AND OPTICAL DIFFRACTION ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241128B">B23K26/064</main-classification>  
        <further-classification edition="200601120241128B">G02B27/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JYUN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑞彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳峻明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林于中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射加工系統及光學繞射元件，用於對一待加工物進行內部改質。雷射加工系統包含雷射光源、光學繞射元件及聚焦鏡組。光學繞射元件光耦合於雷射光源，且具有彼此交錯排列的第一及第二週期結構，第一週期結構的第一微結構的數量大於第二週期結構的第二微結構的數量。光學繞射元件用於產生彼此交錯排列的第一繞射光及第二繞射光。聚焦鏡組光耦合於光學繞射元件，用於將所述繞射光聚焦於待加工物內部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser processing system and an optical diffraction element used for internal modification to an object are disclosed. The laser processing system includes a laser light source, an optical diffraction element and a focusing lens set. The optical diffraction element is optically coupled to the laser light source, and has first and second periodic structures staggered with each other. The number of the plurality of first microstructures of the first periodic structures is greater than the number of the plurality of second microstructures of the second periodic structures. The optical diffraction element is configured to generate first diffracted lights and second diffracted lights alternatively. And the focusing lens set is optically coupled to the optical diffraction element and configured to focus the diffracted light into the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射加工系統</p>  
        <p type="p">11:雷射光源</p>  
        <p type="p">12:光學繞射元件</p>  
        <p type="p">13:聚焦鏡組</p>  
        <p type="p">P:加工平台</p>  
        <p type="p">M:反射鏡</p>  
        <p type="p">W:待加工物</p>  
        <p type="p">L1:雷射光束</p>  
        <p type="p">L2:繞射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="404" publication-number="202619703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微針貼片</chinese-title>  
        <english-title>MICRONEEDLE PATCHE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K9/70</main-classification>  
        <further-classification edition="200601120250501B">A61M37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達運精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李忠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊芸珮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUN-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">微針貼片包括基底層及多個微針結構。基底層具有第一表面，且基底層由基底材料製成。微針結構設置於第一表面，且每一微針結構包含微針外層及微針內層，微針外層由外層材料製成，微針外層與第一表面連接，且微針外層具有微針腔；微針內層由內層材料製成，微針內層設置於微針腔內。基底材料及外層材料包含至少一種親水性材料，內層材料包含至少一種固態油脂。微針貼片透過固態油脂攜帶脂溶性功效成分，並使脂溶性功效成分能順利地運輸進入使用者的體內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microneedle patch includes a base layer and microneedle structures. The base layer has a first surface, and the base layer is made of a base material. The microneedle structures are disposed on the first surface, and each microneedle structure includes a microneedle outer layer and a microneedle inner layer. The microneedle outer layer connected to the first surface is made of an outer-layer material, and has a microneedle cavity; the microneedle inner layer is made of an inner-layer material, and is arranged in the microneedle cavity. The base material and the outer-layer material include at least one hydrophilic material, and the inner-layer material includes at least one solid grease. The microneedle patch uses solid oil to carry fat-soluble functional ingredients and allows the fat-soluble functional ingredients to be smoothly transported into the user's body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微針貼片</p>  
        <p type="p">10:基底層</p>  
        <p type="p">12:第一表面</p>  
        <p type="p">20:微針結構</p>  
        <p type="p">22:微針外層</p>  
        <p type="p">221:外表面</p>  
        <p type="p">24:微針內層</p>  
        <p type="p">241:側表面</p>  
        <p type="p">S:微針腔</p>  
        <p type="p">SW:側壁</p>  
        <p type="p">D1:壁厚</p>  
        <p type="p">H1:基底高度</p>  
        <p type="p">H2:微針高度</p>  
        <p type="p">W1:外層最大寬度</p>  
        <p type="p">W2:內層最大寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="405" publication-number="202619816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬圓柱擠壓方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B21C25/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常琪鋁業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種金屬圓柱擠壓方法，包含有：a.利用第一壓缸將擠壓機之蓋體開啟，置入金屬物料於入料室後關閉該蓋體；b.進行第一次擠壓：利用第二壓缸將該金屬物料由側面擠壓至擠壓室；c.進行第二次擠壓：利用第三壓缸將該金屬物料由頂面擠壓；d.進行第三次擠壓：利用第四壓缸將該金屬物料由後面擠壓成圓柱；e.利用第五壓缸將該擠壓機之閘門開啟，再利用該第四壓缸推出該圓柱；如此，該金屬物料經過三次擠壓成該圓柱，該圓柱密合一體，具完整性符合預定長度，不僅擠壓效果好，該金屬物料更可大量處理，達到金屬圓柱擠壓產品最佳標準化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="406" publication-number="202619800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>便攜式塗佈裝置</chinese-title>  
        <english-title>PORTABLE COATING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B05B13/00</main-classification>  
        <further-classification edition="200601120241125B">B05C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宗鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZONG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡國諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, KUO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳憲儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡博期</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, PO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃致軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種便攜式塗佈裝置，用以將塗層溶液塗佈於太陽能板上。便攜式塗佈裝置包括塗佈器與供料模組。塗佈器包括本體與軟性塗佈頭，本體具有緩衝室與狹縫，狹縫的一端連通緩衝室，狹縫的另一端抵接軟性塗佈頭。供料模組包括彼此連接的容置桶、定壓泵與管路，容置桶盛裝塗層溶液，管路連接在本體的緩衝室該容置桶之間，定壓泵設置於管路，以將塗層溶液從容置桶經由管路而傳送並填充至緩衝室，且驅動塗層溶液經由緩衝室流入狹縫再流至軟性塗佈頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A portable coating device for applying coating onto a solar panel including an applicator and a supply module is provided. The applicator includes a main body and a soft applying head, wherein the main body has a buffer chamber and a slit. One end of the slit is communicated with the buffer chamber, and another end of the slit leans against the soft applying head. The supply module includes a receiving tank filled with the coating in liquid, a pump generating constant pressure, and a pipe connected between the receiving tank and the buffer chamber. The pump disposed to the pipe to transfer the coating in liquid from the receiving tank to the buffer chamber by passing the pipe, and to drive the coating in liquid to move from the buffer chamber to the soft applying head via the slit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:便攜式塗佈裝置</p>  
        <p type="p">110:塗佈器</p>  
        <p type="p">111:本體</p>  
        <p type="p">112:軟性塗佈頭</p>  
        <p type="p">120:扶桿</p>  
        <p type="p">130:傳動模組</p>  
        <p type="p">131:馬達</p>  
        <p type="p">132:皮帶輪組</p>  
        <p type="p">133:傳動軸</p>  
        <p type="p">134:傳動輪</p>  
        <p type="p">140:第一支架</p>  
        <p type="p">141:主架</p>  
        <p type="p">142:前置延伸架</p>  
        <p type="p">143:固定環</p>  
        <p type="p">150:鋼索</p>  
        <p type="p">160:管路</p>  
        <p type="p">170:容置桶</p>  
        <p type="p">180:定壓泵</p>  
        <p type="p">190:第二支架</p>  
        <p type="p">200:太陽能板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="407" publication-number="202620670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>駕駛安全績效評分方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G06F17/18</main-classification>  
        <further-classification edition="202301120241230B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人中華顧問工程司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉又升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇昭銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐奉璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種駕駛安全績效評分方法，係通過警示事件的分類與風險權重分配，為駕駛員提供全面的安全績效評分體系，幫助管理者即時掌握駕駛員的安全表現並進行及時的管理干預，有效提升駕駛行為的安全性，從而減少交通事故的發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">s1~s17:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="408" publication-number="202620988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接裝置之導接件及導電模組的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">H01R43/16</main-classification>  
        <further-classification edition="200601120241227B">B23P9/02</further-classification>  
        <further-classification edition="200601120241227B">H01R43/20</further-classification>  
        <further-classification edition="200601120241227B">C23C16/44</further-classification>  
        <further-classification edition="200601120241227B">H01R13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商全球連接器科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GITECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接裝置之導接件的製造方法，包含一預備材料的預備步驟、一滾壓導電材料而使晶格延伸並且定義出至少一導電部的成型步驟、一以介電材料製成介電層的塑型步驟，及一將導電部與介電層組裝為所述導接件的組裝步驟。另，本發明亦提供一種電連接裝置之導電模組的製造方法，包含一預備多個導接件及多個形狀對應每一該導接件的中介板的準備步驟，及一將該等半成品板與該等中介板交錯地以一疊合方向相互疊合而製成該導電模組的整合步驟。以本發明製成的導接件及導電模組，能因應更小尺度之電子元件的連接需求，組裝為品質較佳的電連接裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:預備步驟</p>  
        <p type="p">11:成型步驟</p>  
        <p type="p">111:滾壓流程</p>  
        <p type="p">112:定義流程</p>  
        <p type="p">116:鍍附流程</p>  
        <p type="p">117:塗層流程</p>  
        <p type="p">12:塑型步驟</p>  
        <p type="p">13:組裝步驟</p>  
        <p type="p">131:貼合流程</p>  
        <p type="p">132:切分流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="409" publication-number="202621432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種晶圓檢測系統及其方法</chinese-title>  
        <english-title>A WAFER INSPECTION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="200601120260223B">B24B49/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大量科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA LIANG TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張聰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSUNG-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JUN-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係提供一種晶圓檢測系統及其方法，該晶圓檢測系統藉由同軸背投影取像裝置的上背投影模組及下背投影模組，將同軸光線引導至堆疊晶圓之周圍邊緣的上方及下方，以分別獲取該周圍邊緣的正面背投影影像及背面背投影影像，並將兩影像座標系轉換成同一座標系。此外，本揭露之晶圓檢測系統亦藉由側光取像裝置，將側光光線引導至該堆疊晶圓之周圍邊緣的側邊，進而獲取該周圍邊緣的高對比影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a wafer inspection system and an inspecting method thereof. The wafer inspection system uses an upper back projection module and a lower back projection module of a coaxial back projection imaging device to guide a coaxial light to an upper side and a lower side of a peripheral edge of each of stacked wafers and obtain a front back projection image and a rear back projection image of the peripheral edge respectively, and then the coordinate systems of the two images are converted into the same coordinate system. In addition, the wafer inspection system of the present disclosure also uses a side-light imaging device to guide side-light light to the sides of the peripheral edges of the stacked wafers, thereby obtaining high-contrast images of the peripheral edges.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓檢測系統</p>  
        <p type="p">10:目標物</p>  
        <p type="p">11:第一平台</p>  
        <p type="p">12:第二平台</p>  
        <p type="p">13:第三平台</p>  
        <p type="p">14:同軸背投影取像裝置</p>  
        <p type="p">141:上背投影模組</p>  
        <p type="p">142:下背投影模組</p>  
        <p type="p">141a:第一取像元件</p>  
        <p type="p">141b:第一透鏡元件</p>  
        <p type="p">141c:第一同軸光源</p>  
        <p type="p">141d:第一分光元件</p>  
        <p type="p">142a:第二取像元件</p>  
        <p type="p">142b:第二透鏡元件</p>  
        <p type="p">142c:第二同軸光源</p>  
        <p type="p">142d:第二分光元件</p>  
        <p type="p">15:側光取像裝置</p>  
        <p type="p">16:座標校正裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="410" publication-number="202620325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>母接頭對接結構</chinese-title>  
        <english-title>FEMALE COUPLER CONNECTION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250210B">F16L21/02</main-classification>  
        <further-classification edition="200601120250210B">F16B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITECK CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐安賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, AN-SZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種母接頭對接結構，具有本體、卡扣模組、套接彈簧及拉套。該本體內部設有一貫通的插接通道，並具有對接段，該對接段設置弦槽，該弦槽內具有連通該插接通道的通孔。該卡扣模組環設於該對接段，該卡扣模組至少部分扣接該弦槽，並於扣接處樞設一栓體。該栓體延伸通過該通孔進入該插接通道形成一作動部，並被該套接彈簧及該等通孔的內壁限位。該套接彈簧兩端分別抵撐該卡扣模組及該對接段的一環狀定位槽。該拉套設置於該卡扣模組外周緣，且被該卡扣模組的前端抵撐；通過拉動該拉套令該栓體擺動以對插入該插接通道的公接頭進行鎖定或解鎖。藉此，本發明之結構設計可使得母接頭具有較短的操作行程以利接頭對接之鎖定及解鎖者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:公接頭</p>  
        <p type="p">12:卡槽</p>  
        <p type="p">2:本體</p>  
        <p type="p">210:弦槽</p>  
        <p type="p">3:套接彈簧</p>  
        <p type="p">41:栓體</p>  
        <p type="p">411:軸部</p>  
        <p type="p">412:作動部</p>  
        <p type="p">412a:頂端面</p>  
        <p type="p">413a:前側壁</p>  
        <p type="p">413b:前頂抵面</p>  
        <p type="p">414a:後側壁</p>  
        <p type="p">414b:後頂抵面</p>  
        <p type="p">42:固定架</p>  
        <p type="p">43:彈簧推板</p>  
        <p type="p">5:拉套</p>  
        <p type="p">51:連動部</p>  
        <p type="p">52:限位環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="411" publication-number="202620784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於音樂元素的服裝動態調整系統及其方法</chinese-title>  
        <english-title>DYNAMIC CLOTHING ADJUSTMENT SYSTEM BASED ON MUSICAL ELEMENT AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241204B">G06T13/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉苗苗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MIAO MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於音樂元素的服裝動態調整系統及其方法，透過儲存服飾物件及對應的第一音樂元素訊息，以及儲存預先訓練完成的音樂元素識別模型，並且於初始時，電腦主機產生允許穿戴服飾物件的虛擬人物以進行顯示，以及在偵測到音樂表演時，持續接收音樂訊號且輸入至音樂元素識別模型以獲得與音樂訊號相應的第二音樂元素訊息，再根據第一、第二音樂元素訊息的比對結果載入服飾物件並穿戴至虛擬人物，並且持續比對不同時間點的第二音樂元素訊息，以便在差異超出預設時調整虛擬人物的服飾物件，藉以達到提高虛擬人物的服飾與音樂的協調性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dynamic clothing adjustment system based on musical element and method thereof is disclosed. By providing a dynamic clothing adjustment system based on musical elements and its method, this system stores clothing objects and corresponding first musical element information, as well as a pre-trained musical element recognition model. Initially, the computer generates a virtual character that allows the wearing of clothing objects for display. Upon detecting a musical performance, the system continuously receives music signals and inputs them into the musical element recognition model to obtain corresponding second musical element information. Based on the comparison results of the first and second musical element information, the system loads clothing objects and dresses the virtual character. It continuously compares second musical element information at different time points to dynamically adjust the clothing objects of the virtual character when the differences exceed a preset threshold. The mechanism is help to improve the coordination of virtual characters' clothing with music.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:服裝資料庫</p>  
        <p type="p">120:電腦主機</p>  
        <p type="p">121:非暫態電腦可讀儲存媒體</p>  
        <p type="p">122:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="412" publication-number="202620860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性記憶體結構</chinese-title>  
        <english-title>MAGNETIC MEMORY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250208B">G11C11/02</main-classification>  
        <further-classification edition="202301120250208B">H10B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王子嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZIH-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括以下構件。第二參考層位於第一參考層上。資料儲存自由層位於第一參考層與第二參考層之間。第一加速翻轉自由層位於資料儲存自由層與第一參考層之間。第二加速翻轉自由層位於資料儲存自由層與第二參考層之間。第一阻障層位於第一加速翻轉自由層與第一參考層之間。第二阻障層位於第二加速翻轉自由層與第二參考層之間。第一間隔層位於資料儲存自由層與第一加速翻轉自由層之間。第二間隔層位於資料儲存自由層與第二加速翻轉自由層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic memory structure including the following components is provided. A second reference layer is located on a first reference layer. A data storage free layer is located between the first reference layer and the second reference layer. A first switching accelerator free layer is located between the data storage free layer and the first reference layer. A second switching accelerator free layer is located between the data storage free layer and the second reference layer. A first barrier layer is located between the first switching accelerator free layer and the first reference layer. A second barrier layer is located between the switching accelerator free layer and the second reference layer. A first spacer layer is located between the data storage free layer and the first switching accelerator free layer. The second spacer layer is located between the data storage free layer and the second switching accelerator free layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:磁性記憶體結構</p>  
        <p type="p">100,102:參考層</p>  
        <p type="p">104:資料儲存自由層</p>  
        <p type="p">106,108:加速翻轉自由層</p>  
        <p type="p">110,112:阻障層</p>  
        <p type="p">114,116:間隔層</p>  
        <p type="p">118,120:導電層</p>  
        <p type="p">D1:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="413" publication-number="202619999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143230</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輕質粒料及輕質粒料之製備方法</chinese-title>  
        <english-title>LIGHTWEIGHT AGGREGATES AND MANUFACTURING METHOD OF THE LIGHTWEIGHT AGGREGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C04B14/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興磊資源回收股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XINGLEI RESOURCE RECYCLING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴聰銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TSUNG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍隆寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, LUNG KWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴聰銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TSUNG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍隆寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, LUNG KWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種輕質粒料以及該輕質粒料之製備方法。所述製備方法包含下列步驟：材料準備步驟，從預定粉土質原料中收集粒徑為75μm以下之預定原料；造條步驟，將該預定原料在未另外添加或混合發泡劑或發氣物質之情況下製成至少一泥條；擠壓造粒步驟，將該至少一泥條在真空條件下擠壓造粒成平均值為2~30 mm粒徑範圍內之預定粒徑之複數個生料球；以及燒結步驟，將未另外添加或混合發泡劑或發氣物質之該些生料球在旋轉窯中依序通過預熱段、燒結段及冷卻段以燒結成為複數個輕質粒料。燒結段之預定燒結溫度係落於1120℃至1160℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention proposes a type of lightweight aggregates and a manufacturing method for the same. The manufacturing method includes the following steps: a material preparation step, collecting a predetermined raw material with particle size of less than 75 μm from a predetermined fine soil raw material; a strip forming step, forming the predetermined raw material into at least one strip without adding or mixing any foaming agents or gas-evolving substances; an extrusion granulation step, extruding in a vacuo condition the at least one strip into a plurality of raw material balls with an average particle size of a predetermined particle size in the range of 2-30 mm; and a sintering step, passing the raw material balls without adding or mixing any foaming agents or gas-evolving substances sequentially through a preheating section, a sintering section, and a cooling section in a rotary kiln to sinter them into a plurality of lightweight aggregates. The predetermined sintering temperature of the sintering section ranges from 1120°C to 1160°C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:製備方法</p>  
        <p type="p">S0:材料準備步驟</p>  
        <p type="p">S1:造條步驟</p>  
        <p type="p">S2:擠壓造粒步驟</p>  
        <p type="p">S3:燒結步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="414" publication-number="202621187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱總成及車載攝像系統</chinese-title>  
        <english-title>HEATING ASSEMBLY AND VEHICLE CAMERA SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05B3/84</main-classification>  
        <further-classification edition="200601120241204B">H05B3/04</further-classification>  
        <further-classification edition="202101120241204B">G03B17/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商祥達光學（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TPK GLASS SOLUTIONS (XIAMEN) INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉婷英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭太獅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, TAI-SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓安倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, AN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峯誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種加熱總成包含電熱板、主熱導層、覆蓋主熱導層的第一絕緣層、覆蓋第一絕緣層的副熱導層以及驅動電源。電熱板包含玻璃層、設置於玻璃層上的透明導體層以及位於玻璃層與透明導體層之間的裝飾層。裝飾層定義透光窗區以及不透光區。主熱導層包含兩電連接體分別設置於透明導體層上的相對兩側。透明導體層於電連接體之間具有第一線阻抗。副熱導層包含不透明的金屬或金屬組合物，對應裝飾層形成圖案化連續佈線，並與主熱導層至少部分重疊。副熱導層具有與第一線阻抗匹配的第二線阻抗。驅動電源對主熱導層與副熱導層以並聯方式施加驅動電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heating assembly includes an electric heating plate, a primary thermal conductive layer, a first insulating layer covering the primary thermal conductive layer, an auxiliary thermal conductive layer covering the first insulating layer, and a driving power supply. The electric heating plate includes a glass layer, a transparent conductor layer disposed on the glass layer, and a decorative layer located between the glass layer and the transparent conductor layer. The decorative layer defines a light-transmitting window area and a light-impermeable area. The primary thermal conductive layer includes two electrical connectors respectively disposed on opposite sides of the transparent conductor layer. The transparent conductor layer has a first line impedance between the electrical connectors. The auxiliary thermal conductive layer contains an opaque metal or metal composition, forms a patterned continuous wiring corresponding to the decorative layer, and at least partially overlaps the primary thermal conductive layer. The auxiliary thermally conductive layer has a second line impedance matching the first line impedance. The driving power supply applies a driving voltage to the primary thermal conductive layer and the auxiliary thermal conductive layer in parallel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車載攝像系統</p>  
        <p type="p">100:加熱總成</p>  
        <p type="p">110:電熱板</p>  
        <p type="p">111:玻璃層</p>  
        <p type="p">112:透明導體層</p>  
        <p type="p">113:裝飾層</p>  
        <p type="p">113a:透光窗區</p>  
        <p type="p">113b:不透光區</p>  
        <p type="p">120:主熱導層</p>  
        <p type="p">130:第一絕緣層</p>  
        <p type="p">140:副熱導層</p>  
        <p type="p">150:第二絕緣層</p>  
        <p type="p">170:第一抗反射層</p>  
        <p type="p">180:第二抗反射層</p>  
        <p type="p">190:疏水性塗層</p>  
        <p type="p">200:鏡頭</p>  
        <p type="p">D:堆疊方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="415" publication-number="202619852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棘輪裝置</chinese-title>  
        <english-title>RATCHET MECHANISM FOR RATCHET WRENCHES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">B25B23/00</main-classification>  
        <further-classification edition="200601120250116B">B25B13/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HE-QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HE-QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種棘輪裝置，包括扳手頭部設棘輪空間及轉向孔，棘輪空間向轉向孔一側凹設有凹弧槽，棘輪空間設置棘輪轉向控制裝置，轉向孔設置轉向裝置；棘輪轉向控制裝置包括圓柱體棘輪及第一、第二掣動塊；第一及第二掣動塊設棘齒、背向輪齒之方向則形成有掣動槽、兩側設有圓弧部，且第一及第二掣動塊兩端形成一具厚度(Ｈ、ｈ)之貼抵部，且第一掣動塊之厚度Ｈ大於第二掣動塊之厚度ｈ；固定件將棘輪轉向控制裝置固定至棘輪空間內；轉向裝置包括撥動件及第一及第二頂掣孔，第一及第二頂掣孔分別對應第一及第二掣動塊，第一及第二頂掣孔分別容置第一及第二頂掣頭及第一及第二頂掣彈簧，第一及第二頂掣彈簧彈頂之第一及第二頂掣頭在第一及第二掣動槽內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ratchet wrench includes a wrench head with a ratchet space and a hole which communicates with the ratchet space. The ratchet space accommodates a ratchet-pawl assembly. The hole accommodates a direction-switching device. The ratchet-pawl assembly includes a ratchet and first and second pawls. The first and second pawls have pawl teeth on the first side thereof, and recessed areas on the second side thereof. Both ends of the first and second pawls have arc portions. The first and second pawls form abutting portions with thicknesses at two ends of the first side thereof. The thickness of the abutting portions of the first pawl is greater than the thickness of the abutting portions of the second pawl. The direction-switching device includes a toggle member which has first and second beads respectively pushed by first and second springs so as to be engaged with the first and second recessed areas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:扳手頭部</p>  
        <p type="p">11:棘輪空間</p>  
        <p type="p">12:轉向孔</p>  
        <p type="p">13:凹弧槽</p>  
        <p type="p">20:棘輪轉向控制裝置</p>  
        <p type="p">21:棘輪</p>  
        <p type="p">211:輪齒</p>  
        <p type="p">22:第一掣動塊</p>  
        <p type="p">221:棘齒</p>  
        <p type="p">222:第一掣動槽</p>  
        <p type="p">223:圓弧部</p>  
        <p type="p">224:貼抵部</p>  
        <p type="p">23:第二掣動塊</p>  
        <p type="p">231:棘齒</p>  
        <p type="p">233:圓弧部</p>  
        <p type="p">234:貼抵部</p>  
        <p type="p">30:轉向裝置</p>  
        <p type="p">31:撥動件</p>  
        <p type="p">321:第一頂掣孔</p>  
        <p type="p">322:第二頂掣孔</p>  
        <p type="p">331:第一頂掣頭</p>  
        <p type="p">332:第二頂掣頭</p>  
        <p type="p">341:第一頂掣彈簧</p>  
        <p type="p">342:第二頂掣彈簧</p>  
        <p type="p">40:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="416" publication-number="202619849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棘輪扳手裝置</chinese-title>  
        <english-title>RATCHET WRENCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">B25B13/46</main-classification>  
        <further-classification edition="200601120250116B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HE-QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HE-QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種棘輪扳手裝置，包括扳手頭部設棘輪空間及轉向孔，棘輪空間向轉向孔之一側凹設凹弧槽，棘輪空間設棘輪轉向控制裝置，轉向孔設轉向裝置；棘輪轉向控制裝置包括圓柱體棘輪及第一、第二掣動塊；第一及第二掣動塊面向輪齒方向設棘齒、背向輪齒之方向有掣動槽、第一及第二掣動塊之兩側設有圓弧部，棘齒咬合棘輪輪齒，各掣動槽形成第一及第二轉動弧部，掣動槽兩側末端設回頂部；固定件將棘輪轉向控制裝置固定至棘輪空間內；及轉向裝置包括撥動件及二頂掣孔，各頂掣孔分別對應第一及第二掣動塊，第一及第二掣動塊之棘齒分別咬合對應之齒凹部及齒尖側，各頂掣孔分別容置頂掣頭及頂掣彈簧，使得受頂掣彈簧彈頂之頂掣頭可以頂掣在掣動塊之轉動弧部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ratchet wrench includes a wrench head which accommodates a ratchet-pawl assembly and a direction-switching device. The ratchet-pawl assembly includes a ratchet, and first and second pawls. The first and second pawls have pawl teeth for being engaged with the ratchet teeth of the ratchet. A recessed area is formed on each first and second pawls and face away from the ratchet teeth. Each recessed area forms first and second recessed curve portions, and two recessed curve portions. The direction-switching device includes a toggle member and two cavities. Each cavity accommodates a bead and spring which pushes the bead to move in the recessed areas of the first and second pawls and push the pawl teeth with the ratchet teeth of the ratchet. The pawl teeth of the first and second pawls are respectively engage with corresponding tooth valleys and tooth tip sides of the ratchet teeth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:扳手頭部</p>  
        <p type="p">11:棘輪空間</p>  
        <p type="p">12:轉向孔</p>  
        <p type="p">13:凹弧槽</p>  
        <p type="p">20:棘輪轉向控制裝置</p>  
        <p type="p">21:棘輪</p>  
        <p type="p">210:輪齒</p>  
        <p type="p">22:第一掣動塊</p>  
        <p type="p">221:棘齒</p>  
        <p type="p">222:掣動槽</p>  
        <p type="p">223:圓弧部</p>  
        <p type="p">2221:第一轉動弧部</p>  
        <p type="p">2222:第二轉動弧部</p>  
        <p type="p">2223:回頂部</p>  
        <p type="p">23:第二掣動塊</p>  
        <p type="p">231:棘齒</p>  
        <p type="p">232:掣動槽</p>  
        <p type="p">233:圓弧部</p>  
        <p type="p">2321:第一轉動弧部</p>  
        <p type="p">2322:第二轉動弧部</p>  
        <p type="p">2323:回頂部</p>  
        <p type="p">30:轉向裝置</p>  
        <p type="p">31:撥動件</p>  
        <p type="p">321、322:頂掣孔</p>  
        <p type="p">331、332:頂掣頭</p>  
        <p type="p">341、342:頂掣彈簧</p>  
        <p type="p">40:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="417" publication-number="202620818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>語言互動學習系統及方法</chinese-title>  
        <english-title>LANGUAGE INTERACTION LEARNING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">G09B7/00</main-classification>  
        <further-classification edition="200601120241130B">G09B19/04</further-classification>  
        <further-classification edition="200601120241130B">G09B23/30</further-classification>  
        <further-classification edition="200601120241130B">G09B5/00</further-classification>  
        <further-classification edition="202001120241130B">G06F40/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾培榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, PEI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭博閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, BO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姿妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, BO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種語言互動學習系統，包含一麥克風單元、一揚聲單元、一顯示單元、一儲存單元及一控制單元。該儲存單元儲存一語言資料庫、複數學習畫面及複數預定回答，每一該學習畫面界定一提問區域。該控制單元具有一語音識別模組、一文字生成模組及一語音合成模組，該語音合成模組輸出對應於該提問區域的信號至該揚聲單元，該語音識別模組將該麥克風單元之輸入轉為一回答文字訊息，該文字生成模組判斷該回答文字訊息是否符合該提問區域對應的該預定回答，若否，該文字生成模組根據該回答文字訊息讀取該語言資料庫而產生一引導對話，並輸出為語音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A language interaction learning system includes a microphone unit, an audio speaker unit, a display unit, a storage unit, and a control unit. The storage unit stores a language database, a plurality of learning frames and a plurality of predetermined answers, each of the learning frames defining an question region. The control unit includes a speech recognition module, a text generation module and a speech synthesis module, the speech synthesis module outputting a signal corresponding to the question region to the audio speaker unit, the speech recognition module converting an input of the microphone unit into an answer text message, the text generation module determining whether the answer text message matches the predetermined answer corresponding to the question region, if not, the text generation module reading the language database according to the answer text message to generate a guided dialogue, and outputting the guided dialogue as voice.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:麥克風單元</p>  
        <p type="p">3:揚聲單元</p>  
        <p type="p">4:顯示單元</p>  
        <p type="p">5:輸入單元</p>  
        <p type="p">6:儲存單元</p>  
        <p type="p">61:語言資料庫</p>  
        <p type="p">611:安全機制資料集</p>  
        <p type="p">612:對齊資料集</p>  
        <p type="p">62:學習畫面</p>  
        <p type="p">63:預定回答</p>  
        <p type="p">64:仿說模式</p>  
        <p type="p">65:圖卡模式</p>  
        <p type="p">66:繪本模式</p>  
        <p type="p">661:故事資料</p>  
        <p type="p">67:對話模式</p>  
        <p type="p">671:地圖資料</p>  
        <p type="p">7:控制單元</p>  
        <p type="p">71:語音識別模組</p>  
        <p type="p">72:文字生成模組</p>  
        <p type="p">73:語音合成模組</p>  
        <p type="p">74:控制模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="418" publication-number="202619880"> 
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      <tif no="1" file="202619880.zip"/>
    </tif-files>
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      <isuno>10</isuno>  
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        <document-id> 
          <doc-number>202619880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貼膜模組及其貼膜方法</chinese-title>  
        <english-title>TAPE MOUNTING ASSEMBLY AND TAPE MOUNTING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B29C63/02</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志聖工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C SUN MFG. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宇祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種貼膜模組，適用於貼膜裝置，包括真空網板結構以及膜料。真空網板結構包含第一框架、彈性層、第二框架以及透氣層，其中第一框架具有至少一抽氣流道；彈性層與第一框架連接設置；第二框架與第一框架對應緊密設置；透氣層與第二框架連接設置；膜料設置於透氣層下。真空網板結構之第一框架、彈性層及透氣層共同定義一密閉空間，且至少一抽氣流道與密閉空間相連通，藉由真空泵透過至少一抽氣流道對密閉空間抽氣，使透氣層產生吸附力，以使膜料吸附於透氣層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tape mounting assembly is disclosed. The tape mounting assembly is used in a tap mounting apparatus, and includes a vacuum screen structure and a tape material. The vacuum screen structure includes a first frame, an elastic layer, a second frame and a breathable layer, wherein at least one gas extraction channel is arranged in the first frame, the elastic layer is connected to the first frame, the second frame is closely arranged corresponding to the first frame, the breathable layer is connected to the second frame, and the tape material is placed under the breathable layer. The first frame, the elastic layer and the breathable layer of the vacuum mesh structure corporately define a closed space, and the at least one gas extraction channel is connected with the closed space. By using a vacuum pump to evacuate the closed space through at least one air extraction channel, it generates an adsorption force on the breathable layer, so that the tape material is adsorbed on the breathable layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:貼膜裝置</p>  
        <p type="p">10:貼膜模組</p>  
        <p type="p">11:上腔體</p>  
        <p type="p">110:第一流道</p>  
        <p type="p">110a:第一開口</p>  
        <p type="p">12:下腔體</p>  
        <p type="p">120:第二流道</p>  
        <p type="p">121:基座</p>  
        <p type="p">13:真空網板結構</p>  
        <p type="p">131:第一框架</p>  
        <p type="p">131a:抽氣流道</p>  
        <p type="p">132:彈性層</p>  
        <p type="p">133:第二框架</p>  
        <p type="p">134:透氣層</p>  
        <p type="p">135:密閉空間</p>  
        <p type="p">14:膜料</p>  
        <p type="p">15:密封環</p>  
        <p type="p">16:基板</p>  
        <p type="p">17:閥門結構</p>  
        <p type="p">2:真空泵</p>  
        <p type="p">20、21、30、31:連通管</p>  
        <p type="p">3:氣體泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="419" publication-number="202620739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示暨感應式信用卡消費累計系統及其方法</chinese-title>  
        <english-title>DISPLAY AND CONTACTLESS CREDIT CARD CONSUMPTION ACCUMULATION SYSTEM AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250206B">G06Q20/24</main-classification>  
        <further-classification edition="201201120250206B">G06Q20/34</further-classification>  
        <further-classification edition="202301120250206B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅冠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, GUAN JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種顯示暨感應式信用卡消費累計系統，包括顯示信用卡。顯示信用卡包括卡片本體、傳輸單元、顯示單元及處理器。傳輸單元設置於卡片本體的正面、背面或內。顯示單元設置於卡片本體的正面且外露於卡片本體的正面。處理器設置於卡片本體中，且包括連接模組、計算模組及顯示模組。連接模組接收本次交易金額。計算模組產生本期消費總金額。顯示模組將本期消費總金額顯示於顯示單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide a display and contactless credit card consumption accumulation system, including a display credit card. The display credit card includes a card body, a transmission unit, a display unit and a processor. The sensing unit is disposed on a front side or a back side, or in of the card body. The display unit is disposed on the front side of the card body and exposed on the front side of the card body. The processor is installed in the card body, and includes a connection module, a computing module and a display module. The connection module receives a timely transaction amount. The computing module generates a total consumption amount of a current period. The display module displays the total consumption amount of the current period on the display unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示暨感應式信用卡消費累計系統</p>  
        <p type="p">110:第一傳輸單元</p>  
        <p type="p">120:第二傳輸單元</p>  
        <p type="p">130:第三傳輸單元</p>  
        <p type="p">135:第一記憶體單元</p>  
        <p type="p">140:電力單元</p>  
        <p type="p">150:顯示單元</p>  
        <p type="p">160:第二記憶體單元</p>  
        <p type="p">170:處理器</p>  
        <p type="p">202:支付裝置</p>  
        <p type="p">204:輸入輸出裝置</p>  
        <p type="p">206:帳務資料伺服器</p>  
        <p type="p">210:連接模組</p>  
        <p type="p">220:記憶模組</p>  
        <p type="p">230:計算模組</p>  
        <p type="p">240:顯示模組</p>  
        <p type="p">250:電力模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="420" publication-number="202620330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天然氣混氫閥站及其控制方法</chinese-title>  
        <english-title>VALVE STATION FOR HYDROGEN BLENDING IN NATURAL GAS AND ITS CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F17D3/01</main-classification>  
        <further-classification edition="200601120241204B">F16K31/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, WEI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種天然氣混氫閥站及其控制方法。天然氣混氫閥站用以連接加熱設備。天然氣混氫閥站包含天然氣流量感測器、氫氣流量控制閥、控制系統、混合器及可調控閥門組。天然氣流量感測器用以測量天然氣的流量。氫氣流量控制閥用以控制氫氣流量。控制系統用以根據天然氣的流量和混氫比設定值計算氫氣流量，並控制氫氣流量控制閥。混合器用以混合天然氣與氫氣，並輸出至加熱設備。當混氫比設定值為0時，可調控閥門組連通天然氣源與加熱設備；當混氫比設定值大於0時，可調控閥門組連通天然氣源、氫氣源與混合器，實現氫氣與天然氣的混合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a valve station for hydrogen blending in natural gas and a control method thereof. The valve station is designed to be connected to heating equipment. The valve station includes a natural gas flow sensor, a hydrogen flow control valve, a control system, a mixer, and an adjustable valve assembly. The natural gas flow sensor is used to measure the flow of natural gas. The hydrogen flow control valve is used to control the flow of hydrogen. The control system is used to calculate a hydrogen flow rate based on the flow of natural gas and a preset blending ratio, and it is used to control the hydrogen flow control valve accordingly. The mixer is used to mix natural gas and hydrogen and output the mixture into the heating equipment. When the preset blending ratio is 0, the adjustable valve assembly is controlled to connect a natural gas source directly to the heating equipment. When the preset blending ratio is greater than 0, the adjustable valve assembly is controlled to connect the natural gas source, a hydrogen source, and the mixer to achieve the blending of hydrogen and natural gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:天然氣混氫閥站</p>  
        <p type="p">10:天然氣流量感測器</p>  
        <p type="p">20:氫氣流量控制閥</p>  
        <p type="p">30:控制系統</p>  
        <p type="p">40:混合器</p>  
        <p type="p">41:第一輸入口</p>  
        <p type="p">42:第二輸入口</p>  
        <p type="p">43:輸出口</p>  
        <p type="p">50:可調控閥門組</p>  
        <p type="p">51:第一閥</p>  
        <p type="p">52:第二閥</p>  
        <p type="p">53:第三閥</p>  
        <p type="p">70:天然氣供給管道</p>  
        <p type="p">71:第一支管</p>  
        <p type="p">72:第二支管</p>  
        <p type="p">80:氫氣供給管道</p>  
        <p type="p">90:氣體輸出管道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="421" publication-number="202621139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用戶交通方式的判斷系統及其方法</chinese-title>  
        <english-title>DETERMINING A USER'S TRANSPORTATION MODE SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250207B">H04W4/30</main-classification>  
        <further-classification edition="200601120250207B">G08G1/123</further-classification>  
        <further-classification edition="202301120250207B">G06Q10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MENG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳行悌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSING-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊巧意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JHAO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用戶交通方式判斷方法，包括取得多筆交通路徑資料，其每一筆交通路徑資料包括由多個基地台的地理位置資訊所形成的一路徑文本串；根據一地理編碼方式轉碼多個基地台的地理位置資訊形成轉碼後的多筆交通路徑資料；根據轉碼後的多筆交通路徑資料建立多筆路徑文本知識例，每一筆路徑文本知識例包括一路徑文本串以及對應的交通方式；以及根據用戶交通路徑的第一路徑文本串比對多筆路徑文本知識例的路徑文本串，以根據至少一路徑文本知識例的交通方式決定該用戶的交通方式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The method for determining a user's transportation mode includes obtaining transportation route data, each of transportation data includes a route text string formed by the geographical location information of base stations; transcoding the geographical location information of the base stations according to a geocoding method to form the transcoded transportation route data; creating route text knowledge examples based on the transcoded transportation route data, each of the route text knowledge examples includes a route text string and the corresponding transportation method ; and comparing the first route text string of a user's transportation path with the route text strings of the route text knowledge examples to determine the user's transportation mode based on the transportation mode of at least one route text knowledge example</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶交通方式判斷系統</p>  
        <p type="p">120:交通方式建立裝置</p>  
        <p type="p">130:路線知識庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="422" publication-number="202621500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介電壁下方具有凹形區域之端子結構及具有其之半導體封裝體</chinese-title>  
        <english-title>TERMINAL STRUCTURE WITH DEPRESSION REGION BELOW DIELECTRIC WALL AND SEMICONDUCTOR PACKAGE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/20</main-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺橋半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIDGE SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　文強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHARLES W. C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王家忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIACHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳珮雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">互連基板的端子結構配置有凹形區域並包括導電元件、裂紋抑制介電壁及界面介電層。重疊於凹形區域上之裂紋抑制介電壁為裂紋抑制介電架的一部分，裂紋抑制介電架可降低因塗佈界面介電層而引起的彎翹。凹形區域具有位於端子結構周緣之開放側端、與開放側端相對且由導電元件之朝外側向表面形成的封閉側端、以及位於導電元件頂表面與底表面間之水平處的凹入表面。據此，端子結構之凹形區域可透過促進焊料填角之形成來提高焊接點之可檢測性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A terminal structure of an interconnect substrate is configured with a depression region and includes an electrically conductive element, a crack-inhibiting dielectric wall and an interfacial dielectric layer. The crack-inhibiting dielectric wall, superimposed over the depression region, is a part of a crack-inhibiting dielectric frame which can reduce warpage caused by the application of the interfacial dielectric layer. The depression region has an open lateral end at a periphery of the terminal structure, a closed lateral end opposite to the open lateral end and formed by an outward lateral surface of the electrically conductive element, and a depression surface at a level between top and bottom surfaces of the electrically conductive element. Accordingly, the depression region of the terminal structure can enhance the inspectability of solder joints by promoting the formation of solder fillets..</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:互連基板</p>  
        <p type="p">10:引線架面板</p>  
        <p type="p">101:互連單元</p>  
        <p type="p">103:單元部分</p>  
        <p type="p">10A:單元引線架</p>  
        <p type="p">11:支撐架</p>  
        <p type="p">12:凹形區域</p>  
        <p type="p">13:導電元件</p>  
        <p type="p">15:導熱墊</p>  
        <p type="p">21:裂紋抑制介電架</p>  
        <p type="p">23:界面介電層</p>  
        <p type="p">201:隔室</p>  
        <p type="p">D:深度</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="423" publication-number="202621456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板貫孔與背孔同心度檢測方法</chinese-title>  
        <english-title>CONCENTRICITY DETECTION METHOD OF THROUGH HOLE AND BACK HOLE IN CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/00</main-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification>  
        <further-classification edition="202201120260223B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大量科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA LIANG TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡禎祈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋漢釧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>焦新峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板貫孔與背孔同心度檢測方法，其包括：第一影像擷取步驟：擷取第二表面的影像而得到一第一影像；第一影像辨識步驟：對第一影像進行辨識，以得到貫孔於第二表面之開口的第一中心C1的第一座標值(x &lt;sub&gt;1&lt;/sub&gt;, y &lt;sub&gt;1&lt;/sub&gt;)；第二影像擷取步驟：擷取第二表面的影像而得到一第二影像；第二影像辨識步驟：對第二影像進行辨識，以得到背孔於該第二表面之開口的第二中心C2的第二座標值(x &lt;sub&gt;2&lt;/sub&gt;, y &lt;sub&gt;2&lt;/sub&gt;)；以及偏移量計算步驟：計算第一座標值(x &lt;sub&gt;1&lt;/sub&gt;, y &lt;sub&gt;1&lt;/sub&gt;)與第二座標值(x &lt;sub&gt;2&lt;/sub&gt;, y &lt;sub&gt;2&lt;/sub&gt;)之間的偏移量Ca，其中 &lt;img align="absmiddle" height="45px" width="263px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for detecting the concentricity of through holes and back holes of a circuit board, which includes: a first image capturing step: capturing an image of the second surface to obtain a first image; a first image recognition step: performing an image processing on the first image identify to obtain the first coordinate value (x &lt;sub&gt;1&lt;/sub&gt;, y &lt;sub&gt;1&lt;/sub&gt;) of the first center C1 of the opening of the through hole on the first surface; the second image capture step: capture the image of the second surface to obtain a second image; The second image recognition step: recognize the second image to obtain the second coordinate value (x &lt;sub&gt;2&lt;/sub&gt;, y &lt;sub&gt;2&lt;/sub&gt;) of the second center C2 of the opening of the back hole on the second surface; and the first offset calculation step: calculating the first offset Ca between the first coordinate value (x &lt;sub&gt;1&lt;/sub&gt;, y &lt;sub&gt;1&lt;/sub&gt;) and the second coordinate value (x &lt;sub&gt;2&lt;/sub&gt;, y &lt;sub&gt;2&lt;/sub&gt;), where &lt;img align="absmiddle" height="40px" width="261px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S18:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="424" publication-number="202620272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膠合集成竹梁及其製造方法</chinese-title>  
        <english-title>GLUED LAMINATED BAMBOO BEAM AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">E04C2/16</main-classification>  
        <further-classification edition="200601120241204B">E04B1/04</further-classification>  
        <further-classification edition="200601120241204B">E04B1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉玉祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周昀柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YUN-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾采倪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHONG, CAI-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗融</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種膠合集成竹梁，包含複數竹條，在該些竹條之間透過膠合形成包含至少一層積竹(laminated bamboo)之一建築構件，其中該些竹條皆有複數竹節部，該些竹條彼此之間的該些竹節部至少一部份相互錯開或/及避開該建築構件的一中間部，藉此改善強度，並使結構更為穩定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glued laminated bamboo beam includes a plurality of bamboo strips. The bamboo strips are glued to form a structural element having at least one laminated bamboo layer. The bamboo strips each have a plurality of nodes. The nodes of the bamboo strips are at least partially staggered or/and are staggered from a middle portion of the structural element, thereby improving strength and enabling the structure of the structural element more stable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(100):建築構件</p>  
        <p type="p">(1):腹板</p>  
        <p type="p">(2):翼板</p>  
        <p type="p">(10)(20):膠合竹板層</p>  
        <p type="p">(101)(201):層積竹</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="425" publication-number="202620763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連鎖店鋪保險管理系統及其方法</chinese-title>  
        <english-title>CHAIN STORE INSURANCE MANAGEMENT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250206B">G06Q40/08</main-classification>  
        <further-classification edition="202301120250206B">G06Q10/063</further-classification>  
        <further-classification edition="200601120250206B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易安網保險經紀人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EINSURE INSURANCE BROKER CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全家便利商店股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN FAMILYMART CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王定凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DING KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁應運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YING YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇筠琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YUN CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種連鎖店鋪保險管理系統，包括總部輸入輸出裝置及處理器。處理器包括連鎖保險申請模組、連鎖保險存取模組、連鎖保險案件模組及連鎖保險理賠模組。連鎖保險申請模組為至少一連鎖店鋪申請保險給付請求。連鎖保險存取模組接收及傳輸保險給付請求。連鎖保險案件模組建立理賠案件。連鎖保險理賠模組根據理賠案件的保險事故資料及理賠證明文件，為至少一連鎖店鋪的進行理賠作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide a chain store insurance management system, including a headquarters input/output device and a processor. The processor includes a chain insurance application module, a chain insurance access module, a chain insurance case module and a chain insurance claim settlement module. The chain insurance application module applies for an insurance benefit request for at least one chain store. The chain insurance access module receives and transmits the insurance benefit request. The chain insurance case module creates a claims case. The chain insurance claim settlement module performs a claim settlement operation for the at least one chain store based on the insurance accident information and the claim settlement certification documents of the claim case.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第一輸入輸出裝置/總部輸入輸出裝置</p>  
        <p type="p">104:第二輸入輸出裝置/店鋪輸入輸出裝置</p>  
        <p type="p">106:第三輸入輸出裝置/擔當輸入輸出裝置</p>  
        <p type="p">210:連鎖總部管理模組</p>  
        <p type="p">212:連鎖保險申請模組</p>  
        <p type="p">214:連鎖保險記錄模組</p>  
        <p type="p">216:連鎖保險存取模組</p>  
        <p type="p">310:連鎖保險模組</p>  
        <p type="p">312:連鎖保險案件模組</p>  
        <p type="p">314:案件狀態存取模組</p>  
        <p type="p">410:連鎖保險經紀模組</p>  
        <p type="p">412:連鎖保險理賠模組</p>  
        <p type="p">414:連鎖保險計算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="426" publication-number="202620764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連鎖店鋪保險管理系統及其方法</chinese-title>  
        <english-title>CHAIN STORE INSURANCE MANAGEMENT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250206B">G06Q40/08</main-classification>  
        <further-classification edition="202301120250206B">G06Q10/06</further-classification>  
        <further-classification edition="200601120250206B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易安網保險經紀人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EINSURE INSURANCE BROKER CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全家便利商店股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN FAMILYMART CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王定凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DING KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁應運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YING YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇筠琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YUN CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的一些實施例提供一種連鎖店鋪保險管理系統，包括總部輸入輸出裝置、店鋪輸入輸出狀置及處理器。處理器包括連鎖保險申請模組、連鎖保險記錄模組、連鎖保險存取模組、連鎖保險案件模組及保險案件查詢模組。連鎖保險申請模組申請一保險給付請求並產生案件進度。連鎖保險記錄模組更新案件進度。連鎖保險存取模組接收並傳輸保險給付請求。連鎖保險案件模組建立理賠案件，且由連鎖保險記錄模組更新理賠案件的案件進度。保險案件查詢模組提供給至少一連鎖店鋪的店長查詢至少一連鎖店鋪的該理賠案件的案件進度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a chain store insurance management system, including a headquarters input/output device, a store input/output device, and a processor. The processor includes a chain insurance application module, a chain insurance record module, a chain insurance access module, a chain insurance case module and an insurance case query module. The chain insurance application module applies for an insurance benefit request and generates a case progress. The chain insurance record module updates the case progress. The chain insurance access module receives and transmits the insurance benefit request. The chain insurance case module creates a claim case, and the chain insurance record module updates the case progress of the claim case. The insurance case query module provides a store manager of at least one chain store to query the case progress of the claim case of the at least one chain store.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第一輸入輸出裝置/總部輸入輸出裝置</p>  
        <p type="p">104:第二輸入輸出裝置/店鋪輸入輸出裝置</p>  
        <p type="p">106:第三輸入輸出裝置/擔當輸入輸出裝置</p>  
        <p type="p">210:連鎖總部管理模組</p>  
        <p type="p">212:連鎖保險申請模組</p>  
        <p type="p">214:連鎖保險記錄模組</p>  
        <p type="p">216:連鎖保險存取模組</p>  
        <p type="p">510:連鎖店鋪查詢模組</p>  
        <p type="p">512:保險案件查詢模組</p>  
        <p type="p">514:案件進度存取模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="427" publication-number="202619785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理高濃度VOCs廢氣的PDR-RTO設備</chinese-title>  
        <english-title>PDR-RTO FOR THE ABATEMENT OF HIGH CONCENTRATION VOCS LADEN GASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250505B">B01D53/74</main-classification>  
        <further-classification edition="200601120250505B">F23G7/06</further-classification>  
        <further-classification edition="202501120250505B">F27D17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特拉斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATLAS INNOTEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張榮興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, RON HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">高濃度VOCs廢氣具有易燃、易爆的特性，常造成石化、化學、塑膠、橡膠產業重大財務損失及人員傷害。本發明利用PDR（高溫脈衝波反應器）技術解除高濃度VOCs廢氣易燃、易爆特性的威脅，並整合爆轟、燃燒、防爆及能源回收技術，提出一種處理高濃度VOCs廢氣的PDR-RTO設備，包含將低濃度VOCs廢氣與高濃度VOCs廢氣分流引入PDR-RTO設備，其中低濃度VOCs廢氣利用RTO（蓄熱再生型熱氧化器）的入氣口導入PDR-RTO設備，高濃度VOCs廢氣利用PDR（高溫脈衝波反應器）導入PDR-RTO設備；低濃度VOCs廢氣經由RTO的蓄熱床預熱、高溫氧化處理並利用蓄熱床回收燃燒所產生能源，使得VOCs廢氣能被徹底破壞處理；高濃度VOCs廢氣經由PDR導入RTO的高溫氧化反應室，VOCs廢氣經爆轟破壞後，再經高溫徹底氧化，部分高溫廢氣利用側置的廢熱回收鍋爐回收能源產生蒸汽；由於PDR使用高溫爆轟技術，其能量密度為傳統燃燒技術的一億倍以上，且在PDR的爆轟管內其速度高達每秒一千米以上，因此，PDR可以承受VOCs廢氣的瞬間流量變化及濃度變化，不會影響其安全操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">High-concentration VOCs laden gas is flammable and explosive, which often causes major financial losses and personal injuries in the petrochemical, chemical, plastic and rubber industries. The present invention utilizes PDR (Pulse Detonation reactor) technology to eliminate the threat of flammable and explosive characteristics of high-concentration VOCs laden gas, and integrates detonation, combustion, explosion-proof and energy recovery technologies, and proposes a PDR-RTO equipment for the abatement of high-concentration VOCs laden gas, which comprises introducing low-concentration VOCs laden gas and high-concentration VOCs laden gas into PDR-RTO equipment, wherein low-concentration VOCs laden gas is introduced into PDR-RTO equipment through the gas inlet of RTO, the high-concentration VOCs laden gas is introduced into the PDR-RTO equipment through PDR (Pulse Detonation Reactor); the low-concentration VOCs laden gas is preheated by the regenerative bed of RTO, thermal oxidized at high temperature in combustion chamber of RTO, and the energy generated by combustion is recovered by the regenerative bed, so that the VOCs laden gas can be completely destroyed. The high-concentration VOCs laden gas is introduced into the high-temperature Combustion Chamber of the RTO through PDR, and the VOCs laden gas is destroyed by detonation, and then completely oxidized at high temperature in the Combustion Chamber of RTO, and part of the high-temperature exhaust gas is used to recover energy from the side-mounted waste heat recovery boiler to produce steam. PDR uses high-temperature detonation technology, its energy density is more than 100 million times that of traditional combustion technology, and its speed in the detonation tube of PDR is as high as more than 1 kilometer per second, so PDR can withstand the instantaneous flow rate and concentration change of VOCs laden gas without affecting its safe operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理高濃度VOCs廢氣的PDR-RTO設備</p>  
        <p type="p">2:RTO設備</p>  
        <p type="p">3:廢熱回收鍋爐</p>  
        <p type="p">10:第一蓄熱床</p>  
        <p type="p">11:第一蓄熱床的入氣室</p>  
        <p type="p">12:第一蓄熱床的陶瓷蓄熱床</p>  
        <p type="p">13:第一蓄熱床的混氣室</p>  
        <p type="p">14:第一蓄熱床的耐火爐壁</p>  
        <p type="p">15:第一蓄熱床的入口火焰防阻器</p>  
        <p type="p">20:第二蓄熱床</p>  
        <p type="p">21:第二蓄熱床的入氣室</p>  
        <p type="p">22:第二蓄熱床的陶瓷蓄熱床</p>  
        <p type="p">23:第二蓄熱床的混氣室</p>  
        <p type="p">24:第二蓄熱床的耐火爐壁</p>  
        <p type="p">25:第二蓄熱床的入口火焰防阻器</p>  
        <p type="p">30:第三蓄熱床</p>  
        <p type="p">31:第三蓄熱床的入氣室</p>  
        <p type="p">32:第三蓄熱床的陶瓷蓄熱床</p>  
        <p type="p">33:第三蓄熱床的混氣室</p>  
        <p type="p">34:第三蓄熱床的耐火爐壁</p>  
        <p type="p">35:第三蓄熱床的入口火焰防阻器</p>  
        <p type="p">40:高溫氧化反應室</p>  
        <p type="p">41:高溫氧化反應室耐火爐壁</p>  
        <p type="p">42:高溫氧化反應室的內部</p>  
        <p type="p">43:高溫氧化反應室溫度控制器</p>  
        <p type="p">44:高溫氧化反應室旁通管道</p>  
        <p type="p">50:輔助燃料</p>  
        <p type="p">51:燃料供應管線</p>  
        <p type="p">52:燃料控制閥</p>  
        <p type="p">53:燃料流量控制器</p>  
        <p type="p">54:燃燒空燃比計算</p>  
        <p type="p">56:燃燒機</p>  
        <p type="p">60:燃燒空氣</p>  
        <p type="p">61:燃燒空氣風車</p>  
        <p type="p">62:燃燒空氣控制閥</p>  
        <p type="p">63:燃燒空氣管線</p>  
        <p type="p">64:燃燒空氣流量控制器</p>  
        <p type="p">69:高濃度VOCs廢氣旁通閥門</p>  
        <p type="p">70:高濃度VOCs廢氣</p>  
        <p type="p">71:高濃度VOCs廢氣變頻增壓風機</p>  
        <p type="p">72:防爆轟型火焰防阻器</p>  
        <p type="p">73:高濃度VOCs廢氣流量控制器</p>  
        <p type="p">74:高濃度VOCs廢氣管線</p>  
        <p type="p">75:高濃度VOCs廢氣壓力控制器</p>  
        <p type="p">76:高濃度VOCs廢氣配比空氣流量控制器</p>  
        <p type="p">77:配比空氣流量計算器</p>  
        <p type="p">78:配比空氣管線</p>  
        <p type="p">79:配比空氣流量調節閥</p>  
        <p type="p">80:PDR高溫脈衝波反應器</p>  
        <p type="p">81:PDR二次空氣配氣室</p>  
        <p type="p">100:低濃度VOCs廢氣</p>  
        <p type="p">101:低濃度VOCs廢氣入氣管線</p>  
        <p type="p">102:低濃度VOCs廢氣入氣閥</p>  
        <p type="p">103:低濃度VOCs廢氣旁通管線</p>  
        <p type="p">104:低濃度VOCs廢氣旁通閥</p>  
        <p type="p">105:低濃度VOCs廢氣旁通</p>  
        <p type="p">106:旁通空氣調節閥</p>  
        <p type="p">107:旁通空氣管線</p>  
        <p type="p">108:第一蓄熱床入氣閥</p>  
        <p type="p">109:第二蓄熱床入氣閥</p>  
        <p type="p">110:第三蓄熱床入氣閥</p>  
        <p type="p">111:旁通空氣</p>  
        <p type="p">112:清理風車</p>  
        <p type="p">113:主誘引風車</p>  
        <p type="p">114:煙囪</p>  
        <p type="p">115:第一蓄熱床排氣閥</p>  
        <p type="p">116:第二蓄熱床排氣閥</p>  
        <p type="p">117:第三蓄熱床排氣閥</p>  
        <p type="p">118:第一蓄熱床清理排氣閥</p>  
        <p type="p">119:第二蓄熱床清理排氣閥</p>  
        <p type="p">120:第三蓄熱床清理排氣閥</p>  
        <p type="p">121:VOCs廢氣入氣管</p>  
        <p type="p">122:VOCs廢氣入氣匯流管</p>  
        <p type="p">123:第一蓄熱床入氣管</p>  
        <p type="p">124:第二蓄熱床入氣管</p>  
        <p type="p">125:第三蓄熱床入氣管</p>  
        <p type="p">131:第一蓄熱床排氣管</p>  
        <p type="p">132:第二蓄熱床排氣管</p>  
        <p type="p">133:第三蓄熱床排氣管</p>  
        <p type="p">134:蓄熱床排氣匯流管</p>  
        <p type="p">135:出口管線</p>  
        <p type="p">136:主誘引風車出口管線</p>  
        <p type="p">137:蓄熱床排氣匯流管溫度控制器</p>  
        <p type="p">138:流量控制閥門</p>  
        <p type="p">141:第一蓄熱床清理排氣管</p>  
        <p type="p">142:第二蓄熱床清理排氣管</p>  
        <p type="p">143:第三蓄熱床清理排氣管</p>  
        <p type="p">144:蓄熱床清理排氣匯流管</p>  
        <p type="p">145:蓄熱床清理排氣管線</p>  
        <p type="p">146:清理排氣匯流管</p>  
        <p type="p">200:去離子水</p>  
        <p type="p">201:去離子水供水管線</p>  
        <p type="p">202:脫氣槽</p>  
        <p type="p">203:去離子水給水泵浦</p>  
        <p type="p">204:去離子水給水流量控制器</p>  
        <p type="p">205:去離子水給水流量控制閥</p>  
        <p type="p">206:去離子水給水管線</p>  
        <p type="p">207:鍋爐水預熱管排</p>  
        <p type="p">208:鍋爐水管線</p>  
        <p type="p">209:鍋爐水預熱器</p>  
        <p type="p">220:下集箱</p>  
        <p type="p">221:上集箱</p>  
        <p type="p">222:廢熱回收鍋爐管排</p>  
        <p type="p">223:廢熱回收鍋爐艙</p>  
        <p type="p">224:上升管</p>  
        <p type="p">225:下降管</p>  
        <p type="p">230:蒸汽鼓</p>  
        <p type="p">231:氣液分離裝置</p>  
        <p type="p">232:蒸汽鼓液位控制器</p>  
        <p type="p">240:蒸汽管線</p>  
        <p type="p">241:蒸汽鼓壓力控制器</p>  
        <p type="p">242:蒸汽流量調節閥</p>  
        <p type="p">244:蒸汽流量控制器</p>  
        <p type="p">245:蒸汽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="428" publication-number="202620793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測模型的重新訓練方法與裝置及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>METHOD AND DEVICE FOR RETRAINING DETECTION MODEL, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">G06V10/70</main-classification>  
        <further-classification edition="202301120250303B">G06N3/08</further-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃源福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUAN FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢測模型的重新訓練方法與裝置及非暫態電腦可讀取儲存媒體。所述方法包括：獲得一物體檢測模型的精確度資訊；及重新訓練物體檢測模型，根據一精確度監督模型估測到精確度資訊為異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and device for retraining detection model, and a non-transitory computer-readable storage medium are provided. The method includes: obtaining accuracy information of an object detection model; and retraining the object detection model based on an accuracy supervision model estimating the accuracy information as abnormal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:產品</p>  
        <p type="p">1:產品照片</p>  
        <p type="p">2:重新訓練裝置</p>  
        <p type="p">3:輸入單元</p>  
        <p type="p">4:運算單元</p>  
        <p type="p">5:非暫態電腦可讀取儲存媒體</p>  
        <p type="p">6:物體檢測模型</p>  
        <p type="p">7:精確度監督模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="429" publication-number="202621057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>類比數位轉換裝置及類比數位轉換方法</chinese-title>  
        <english-title>ANALOG TO DIGITAL CONVERTER AND ANALOG TO DIGITAL CONVERSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03M1/12</main-classification>  
        <further-classification edition="200601120250303B">H03M1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪瑋謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, WEI-CIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">類比數位轉換裝置包含開關、電容陣列、比較電路以及邏輯控制電路。開關用以根據取樣信號以取樣至少一輸入信號。電容陣列包含複數個電容，複數個電容用以儲存至少一輸入信號。比較電路用以根據電容陣列之複數個電容儲存的至少一輸入信號以產生比較結果。邏輯控制電路用以根據轉換結束信號或取樣信號以分別重置複數個電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analog to digital converter includes a switch, a capacitor array, a comparator, and a logical control circuit. The switch is configured to sample at least one input signal according to a sampling signal. The capacitor array includes a plurality of capacitors. The plurality of capacitors are configured to store the at least one input signal. The comparator is configured to generate a comparing result according to the at least one input signal stored in the plurality of capacitors of the capacitor array. The logical control circuit is configured to respectively reset the plurality of capacitors according to a conversion end signal or the sampling signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:類比數位轉換裝置</p>  
        <p type="p">110:開關</p>  
        <p type="p">120:電容陣列</p>  
        <p type="p">130:比較電路</p>  
        <p type="p">140:邏輯控制電路</p>  
        <p type="p">150:開關</p>  
        <p type="p">160:開關</p>  
        <p type="p">B1~B10:資料</p>  
        <p type="p">C1~C10:電容</p>  
        <p type="p">Clks:取樣信號</p>  
        <p type="p">Clkc:致能信號</p>  
        <p type="p">Clkin:時脈輸入</p>  
        <p type="p">Vip、Vin:輸入信號</p>  
        <p type="p">Vref:參考信號</p>  
        <p type="p">Vcap_p&amp;lt;1：10&amp;gt;、Vcap_n&amp;lt;1「10&amp;gt;:位元信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="430" publication-number="202620841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噪音監測方法、電子設備及儲存介質</chinese-title>  
        <english-title>METHOD FOR MONITORING NOISE, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G10L15/02</main-classification>  
        <further-classification edition="200601120241204B">G01H17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周育楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錦斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於電腦技術領域，提供一種噪音監測方法、電子設備及儲存介質。該方法獲取第一時間段的噪音資料；確定第一時間段的噪音資料對應的頻譜圖。根據噪音資料對應的頻譜圖，透過第一預設模型，得到第一時間段的噪音資料對應的來源資訊。根據來源資訊，確定預警閥值。透過第二預設模型對第一時間段的噪音資料進行預測，得到第二時間段的噪音強度，第二時間段在第一時間段之後。若第二時間段的噪音強度大於或者等於預警閥值，觸發預警。上述方法能夠及時觸發噪音警報，避免噪音對用戶造成影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of computer technology, and provides a method for monitoring noise, an electronic device and a storage medium. The method includes: obtaining noise data within a first time period, and determining a spectrogram corresponding to the noise data within the first time period. According to the spectrogram corresponding to the noise data, source information corresponding to the noise data within the first time period is obtained through a first preset model. According to the source information, a warning threshold is determined. The noise data within the first time period is predicted by using the second preset model, and a noise intensity within a second time period is obtained, and the second time period is after the first time period. In response that the noise intensity within the second time period is greater than or equal to the warning threshold, a warning is triggered. The above method can trigger a noise alarm in time to avoid people being affected by noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S206:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="431" publication-number="202621439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塔形吸嘴</chinese-title>  
        <english-title>TOWER-LIKE NOZZLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>均華精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLANT MICRO. MACHINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　語尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EE-SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉黃頌凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU HUANG, SONG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種塔形吸嘴，其包含一支撐件、連接於所述支撐件的一側的一塑形層、圍繞於所述塑形層外側的一固定件、及固定於支撐件與固定件之間的一吸取層。支撐件形成有一吸氣通道。吸取層具有一工作區塊、及自所述工作區塊周緣延伸的一固定區塊，所述工作區塊覆蓋且壓迫於所述塑形層而彎曲，以使所述工作區塊的一中心段呈突出狀。工作區塊具有非位於同一平面的多個吸附孔，其連通於吸氣通道而能用於吸附一物件，令貼附於中心段的物件的部位呈突出狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a tower-like nozzle. The tower-like nozzle includes a supporting component, a shaping layer connected to the supporting component, a fixing component surrounding at an outer side of the shaping layer, and an absorption layer fixed between the supporting component and the shaping layer. The supporting component has an air-suction channel. The absorption layer has a working section and a fixing section extending from an outer periphery of the working section. The working section covers and presses the shaping layer so that a center segment of the working section is bent to have a protruding shape. The working section has a plurality of adsorption holes that are not arranged at the same plane and that are in spatial communication with the air-suction channel for suction of an object, so that the object attached to the center segment is bent to have a protruding shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:塔形吸嘴</p>  
        <p type="p">1:支撐件</p>  
        <p type="p">11:吸氣通道</p>  
        <p type="p">2:塑形層</p>  
        <p type="p">21a:氣流通道</p>  
        <p type="p">213:第三塑形塊</p>  
        <p type="p">2131:凸出部</p>  
        <p type="p">2132:基部</p>  
        <p type="p">3:固定件</p>  
        <p type="p">4:吸取層</p>  
        <p type="p">41:工作區塊</p>  
        <p type="p">411:吸附孔</p>  
        <p type="p">S1:中心段</p>  
        <p type="p">S2:連接段</p>  
        <p type="p">42:固定區塊</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p>  
        <p type="p">H1:第一距離</p>  
        <p type="p">H2:第二距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="432" publication-number="202621404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片剝離系統及晶片推頂裝置</chinese-title>  
        <english-title>CHIP PEELING SYSTEM AND CHIP EJECTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>均華精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLANT MICRO. MACHINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　語尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EE-SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉黃頌凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU HUANG, SONG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳健平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種晶片剝離系統及晶片推頂裝置。晶片推頂裝置能用來推頂一晶圓的第一晶片、或第二晶片。晶片推頂裝置包含載台、頂針座結構、及殼體。頂針座結構包含第一推頂機構、第二推頂機構、內頂針座、多個第一頂針、外頂針座及多個第二頂針。殼體具有對應於多個第一頂針及多個第二頂針的多個頂針孔。當第一推頂機構沿預設方向移動推升內頂針座時，多個第一頂針穿出頂針孔而推頂第一晶片。當第二推頂機構沿預設方向移動時，內頂針座及外頂針座同時被推升，多個第一頂針及多個第二頂針穿出頂針孔而推頂第二晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a chip peeling system and a chip ejecting device. The chip ejecting device configured for pushing a first chip or a second chip includes a carrier, an ejector pin holder structure, and a case. The ejector pin holder structure includes a first ejecting mechanism, a second ejecting mechanism, an inner ejector pin holder, a plurality of first ejector pins, an outer ejector pin holder, and a plurality of second ejector pins. The case has a plurality of ejector pin holes arranged in positions corresponding to the first ejector pins and the second ejector pins. When the first ejecting mechanism moves in a preset direction to push up the inner ejector pin holder, the first ejector pins pass through the ejector pin holes so as to push the first chip. When the second ejecting mechanism moves in the preset direction, the inner ejector pin holder and the outer ejector pin holder are jointly pushed up, and the first ejector pins and the second ejector pins pass through the ejector pin holes so as to push the second chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:晶片推頂裝置</p>  
        <p type="p">31:載台</p>  
        <p type="p">311:凸出部</p>  
        <p type="p">32:頂針座結構</p>  
        <p type="p">321:第一推頂機構</p>  
        <p type="p">322:第二推頂機構</p>  
        <p type="p">323:內頂針座</p>  
        <p type="p">324:外頂針座</p>  
        <p type="p">325:第一頂針</p>  
        <p type="p">326:第二頂針</p>  
        <p type="p">33:殼體</p>  
        <p type="p">331:頂針孔</p>  
        <p type="p">332:固定部</p>  
        <p type="p">S:中心切面</p>  
        <p type="p">D:預設方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="433" publication-number="202620807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於環境自我調整貝葉斯網路的車輛故障診斷方法和系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR DIAGNOSING VEHICLE FAULTS BASED ON ENVIRONMENT-ADAPTIVE BAYESIAN NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G07C5/08</main-classification>  
        <further-classification edition="202301120250203B">G06N5/01</further-classification>  
        <further-classification edition="202301120250203B">G06N7/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海科絡達雲軟體技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAROTA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章鑫傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XINJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種基於環境自我調整貝葉斯網路的車輛故障診斷方法。該方法可以包括：在車輛故障檢測系統中接收車輛的故障表現的輸入；根據故障表現，從包含多個加權關聯故障樹模型的庫中選擇最優的加權關聯故障樹模型；將加權關聯故障樹模型映射至環境自我調整貝葉斯網路；計算環境自我調整貝葉斯網路中的每個葉節點的可信度；和根據可信度生成故障排序和故障狀態資訊，並進行多媒體故障報警。本發明的車輛故障診斷方法不僅在多變場景中表現出優越的環境適應性，還可實現車輛故障的快速、精準診斷，有力支持車輛的可靠運行和預防性維護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method for diagnosing vehicle faults based on an environment-adaptive Bayesian network, the method comprising receiving an input of a faulty symptom of a vehicle into a vehicle fault detection system; selecting an optimal weighted association fault tree model from a library comprising a plurality of weighted association fault tree models, based on the faulty symptom; mapping the optimal weighted association fault tree model to an environment-adaptive Bayesian network; calculating a credibility of each leaf node within the environment-adaptive Bayesian network; and generating a fault ranking and a fault status information based on the credibility of each leaf node within the environment-adaptive Bayesian network, and initiating a multimedia fault alert. The method for diagnosing vehicle faults demonstrated of the disclosure exhibits remarkable adaptability to varying scenarios and facilitates rapid and accurate diagnosis of vehicle faults, supporting reliable operation and preventive maintenance of vehicles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:在車輛故障檢測系統中接收車輛的故障表現</p>  
        <p type="p">S2:根據故障表現，從包含多種加權關聯故障樹模型的庫中選擇最優的加權關聯故障樹模型</p>  
        <p type="p">S3:將加權關聯故障樹模型映射至環境自我調整貝葉斯網路</p>  
        <p type="p">S4:計算環境自我調整貝葉斯網路中的每個葉節點的可信度</p>  
        <p type="p">S5:根據可信度輸出故障排序和故障狀態資訊，並進行多媒體故障報警</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="434" publication-number="202621254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體及其製造方法</chinese-title>  
        <english-title>FLASH MEMORY AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250305B">H10B41/42</main-classification>  
        <further-classification edition="202301120250305B">H10B41/30</further-classification>  
        <further-classification edition="202301120250305B">H10B43/30</further-classification>  
        <further-classification edition="202501120250305B">H10D64/01</further-classification>  
        <further-classification edition="202501120250305B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SSU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快閃記憶體及其製造方法。半導體構包括基底、第一閘極元件、第一摻雜區、第一間隙壁、頂蓋層、硬罩幕層、第一接觸窗、第一保護層、第二保護層、第二閘極元件、第二摻雜區以及第二間隙壁。第一保護層設置於第一接觸窗與硬罩幕層、頂蓋層以及第一間隙壁之間。第二保護層設置於第一保護層與第一接觸窗、頂蓋層、第一間隙壁以及基底之間。第二閘極元件設置周邊區中的基底上。第二摻雜區設置於第二閘極元件兩側的基底中。第二間隙壁設置於第二閘極元件的側壁上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a flash memory and a manufacturing method thereof. The flash memory includes a substrate, a first gate device, first doped regions, a first spacer, a cover layer, a hard mask layer, first contacts, a first protective layer, a second protective layer, a second gate device, second doped regions and a second spacer. The first protective layer is disposed between the first contacts and the hard mask layer, the cover layer and the first spacer. The second protective layer is disposed between the first protective layer and the first contacts, the cover layer, the first spacer and the substrate. The second gate device is disposed on the substrate in the peripheral region. The second doped regions are disposed in the substrate at two sides of the second gate device. The second spacer is disposed on the sidewalls of the second gate device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:快閃記憶體</p>  
        <p type="p">100:基底</p>  
        <p type="p">100a:記憶體區</p>  
        <p type="p">100b:周邊區</p>  
        <p type="p">102:第一閘極元件</p>  
        <p type="p">102a:穿隧介電層</p>  
        <p type="p">102b:浮置閘極</p>  
        <p type="p">102c:閘間介電層</p>  
        <p type="p">102d:控制閘極</p>  
        <p type="p">104:頂蓋層</p>  
        <p type="p">105:第一摻雜區</p>  
        <p type="p">106:第二閘極元件</p>  
        <p type="p">106a:閘介電層</p>  
        <p type="p">106b:閘極</p>  
        <p type="p">108:襯層</p>  
        <p type="p">108a:第一間隙壁</p>  
        <p type="p">112:第一介電材料</p>  
        <p type="p">112’:第二保護層</p>  
        <p type="p">114:第二介電材料</p>  
        <p type="p">114’:第一保護層</p>  
        <p type="p">115:硬罩幕層</p>  
        <p type="p">116:第一子硬罩幕層</p>  
        <p type="p">118:第二子硬罩幕層</p>  
        <p type="p">122:輕摻雜區</p>  
        <p type="p">123:第二間隙壁</p>  
        <p type="p">124:第二摻雜區</p>  
        <p type="p">126:介電層</p>  
        <p type="p">130:第一接觸窗</p>  
        <p type="p">132:第二接觸窗</p>  
        <p type="p">H1:第一接觸窗開孔</p>  
        <p type="p">H2:第二接觸窗開孔</p>  
        <p type="p">R:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="435" publication-number="202620349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熔鋁爐之氣體擴散器結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F27D1/00</main-classification>  
        <further-classification edition="200601120241204B">C21B7/00</further-classification>  
        <further-classification edition="200601120241204B">C22B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常琪鋁業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARNG CHYI ALUMINUM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種熔鋁爐之氣體擴散器結構，係於熔鋁爐之爐體底部佈設有數個氣體擴散器，該氣體擴散器主要係於其外部設為隔熱部，該隔熱部係為隔熱耐火材所製成，該氣體擴散器之上部中間設有一曝氣區，該曝氣區係由具毛細孔之耐火材所製成，該曝氣區之厚度為該氣體擴散器高度的三分之一至二分之一，該曝氣區下方設有氣室，該氣室係呈上窄下寬之錐狀形，該氣體擴散器之底部設有一墊片，該墊片上設有一進氣管，該進氣管係連通至該氣室內；如此，藉由於該熔鋁爐之爐體底部所設之各該氣體擴散器注入惰性氣體，惰性氣體則由該爐體底部經該氣體擴散器往上擴散噴出，可充分地將熔鋁爐內之鋁液中的氣體與雜質吸附並向上漂浮於鋁液面上，可確實達到提升熔鋁爐中鋁液純淨度之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:氣體擴散器</p>  
        <p type="p">20:隔熱部</p>  
        <p type="p">21:曝氣區</p>  
        <p type="p">22:氣室</p>  
        <p type="p">23:墊片</p>  
        <p type="p">24:進氣管</p>  
        <p type="p">H:高度</p>  
        <p type="p">L:厚度</p>  
        <p type="p">30:爐體底部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="436" publication-number="202621338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半穿透鈣鈦礦太陽能電池模組與堆疊型太陽能電池模組</chinese-title>  
        <english-title>TRANSLUCENT PEROVSKITE SOLAR CELL MODULE AND TANDEM SOLAR CELL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250204B">H10K30/15</main-classification>  
        <further-classification edition="202301120250204B">H10K30/57</further-classification>  
        <further-classification edition="202301120250204B">H10K30/81</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉峻銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱培庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半穿透鈣鈦礦太陽能電池模組與堆疊型太陽能電池模組。半穿透鈣鈦礦太陽能電池模組包括多個半穿透鈣鈦礦太陽能電池。每個半穿透鈣鈦礦太陽能電池包括依序堆疊的透明陰極、電子傳輸層、吸收層、電洞傳輸層、緩衝層以及透明陽極。至少一個半穿透鈣鈦礦太陽能電池的透明陽極與相鄰的半穿透鈣鈦礦太陽能電池的透明陰極之間具有重疊區域。緩衝層延伸於所述重疊區域內的透明陰極上。穿透鈣鈦礦太陽能電池模組還包含金屬圖案層，位於所述重疊區域內的緩衝層與透明陰極之間，以串聯該至少一個半穿透鈣鈦礦太陽能電池的透明陽極與相鄰半穿透鈣鈦礦太陽能電池的透明陰極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A translucent perovskite solar cell module and a tandem solar cell module are provided. The translucent perovskite solar cell module includes a plurality of translucent perovskite solar cells. Each of the translucent perovskite solar cell includes a transparent anode, an electron transport layer, an absorption layer, a hole transport layer, a buffer layer and a transparent cathode stacked in sequence. &lt;br/&gt;An overlapping area is formed between the transparent anode of at least one translucent perovskite solar cell and the transparent cathode of an adjacent translucent perovskite solar cell. The buffer layer extends over the transparent cathode within the overlapping area. The translucent perovskite solar cell module further includes a metal pattern layer between the buffer layer and the transparent cathode within the overlapping area to connect the transparent anode of the at least one translucent perovskite solar cell and the transparent cathode of adjacent translucent perovskite solar cells in series.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">100:鈣鈦礦太陽能電池模組</p>  
        <p type="p">102a、102b:鈣鈦礦太陽能電池</p>  
        <p type="p">104:重疊區域</p>  
        <p type="p">106:金屬圖案層</p>  
        <p type="p">AB:吸收層</p>  
        <p type="p">BF:緩衝層</p>  
        <p type="p">ETL:電子傳輸層</p>  
        <p type="p">HTL:電洞傳輸層</p>  
        <p type="p">P1:第一切割道</p>  
        <p type="p">P2:第二切割道</p>  
        <p type="p">P3:第三切割道</p>  
        <p type="p">TA:透明陰極</p>  
        <p type="p">TC:透明陽極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="437" publication-number="202620006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐高溫裝置及其製造方法</chinese-title>  
        <english-title>HIGH-TEMPERATURE RESISTANT DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">C04B41/89</main-classification>  
        <further-classification edition="201701120241231B">C01B32/907</further-classification>  
        <further-classification edition="200601120241231B">C30B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐煜翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁雪萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, HSUEH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耐高溫裝置的製造方法，包括提供一鉭基材作為裝置本體，在含氧環境中對鉭基材進行氧化處理，使鉭基材的表面生成一鉭的氧化物層，然後將氧化處理後的鉭基材埋在含碳物質中，並在惰性氣體中進行碳化反應，以使所述鉭的氧化物層轉變為一碳化鉭層。所述氧化處理的溫度介於100ºC與1100ºC之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a high-temperature resistant device includes providing a tantalum base material as a device body, performing an oxidation treatment on the tantalum base material in an oxygen-containing environment to form an oxide of tantalum layer on the surface of the tantalum base material, and then embedding the tantalum base material after the oxidation treatment in a carbonaceous matter for performing a carbonization reaction in an inert gas, so that the oxide of tantalum layer is transformed into a tantalum carbide layer. A temperature of the oxidation treatment is between 100℃ and 1100℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、110、120、130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="438" publication-number="202620712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程與設備整合式數位雙生的方法與系統</chinese-title>  
        <english-title>PROCESS AND EQUIPMENT INTEGRATED DIGITAL TWIN METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241204B">G06N20/10</main-classification>  
        <further-classification edition="201201120241204B">G06Q50/04</further-classification>  
        <further-classification edition="200601120241204B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張語軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-HSIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃博煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露所提供的製程與設備整合式數位雙生方法與系統，其可同時考量製程與設備之間的交互影響。由於設備健康狀況、製程配方、品質目標等資訊皆會影響到最佳的製程參數，透過整合設備健康預測以及品質預測，可建立製程與設備整合式數位雙生模型，並且用其所推薦的製程參數可同時改善產品品質以及產線效率，提升製造業者生產競爭力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The process and equipment integrated digital twin method and system provided in this disclosure can simultaneously consider the interaction between the process and equipment. Since equipment health status, process recipes and quality targets will affect the optimal process parameters, by integrating equipment health prediction and quality prediction, an integrated digital twin model of the process and equipment can be established, and the recommended parameters process being used can simultaneously improve product quality and production line efficiency, enhancing the production competitiveness of manufacturers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130、S140、S150、S160:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="439" publication-number="202621108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視差的自動調節方法與系統</chinese-title>  
        <english-title>AUTOMATIC DISPARITY ADJUSTMENT METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250108B">H04N13/31</main-classification>  
        <further-classification edition="202001120250108B">G02B30/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塗宗偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, TSUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視差的自動調節系統，包括一對相機及一控制器。此對相機用以拍攝一物體，以獲得一第一影像與一第二影像。此對相機包括兩個鏡頭，兩個鏡頭間存在一距離。控制器電信連接至此對相機，且經配置以執行：利用一第一校正矩陣校正第一影像，且利用一第二校正矩陣校正第二影像；裁切第一校正影像與第二校正影像；根據一立體顯示器至一使用者的眼睛的一觀看距離定義一雙眼合焦距離的一舒適範圍；根據舒適範圍、第一裁切後的影像及第二裁切後的影像計算出一修正後的雙眼視差。一種視差的自動調節方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic disparity adjustment system includes a pair of cameras and a controller. The pair of cameras are configured to photograph an object, so as to obtain a first image and a second image. The pair of cameras include two lenses with a distance therebetween. The controller is signally coupled to the pair of cameras, and configured to execute: correcting the first image by a first correction matrix and correcting the second image by a second correction matrix; cropping a first corrected image and a second corrected image; defining a comfortable range of a binocular vergence distance according to a viewing distance from a stereoscopic display to eyes of a user; calculating a corrected binocular disparity according to the comfortable range, a first cropped image, and a second cropped image. An automatic disparity adjustment method is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:物體</p>  
        <p type="p">60:眼睛</p>  
        <p type="p">100:視差的自動調節系統</p>  
        <p type="p">110:控制器</p>  
        <p type="p">200:相機</p>  
        <p type="p">210、220:鏡頭</p>  
        <p type="p">300:立體顯示器</p>  
        <p type="p">310:相機、兩相機或距離感測器</p>  
        <p type="p">d:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="440" publication-number="202621278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼克森微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKO SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帥群微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER GROUP SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐松年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, SUNG-NIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HO-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許修文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構。半導體結構包括基板、第一摻雜類型磊晶層、至少一閘極結構、複數個第二摻雜類型磊晶層、複數個摻雜區以及複數個源極區。第一摻雜類型磊晶層設置於基板上。至少一閘極結構設置於第一摻雜類型磊晶層上，並在第一方向上延伸。第二摻雜類型磊晶層設置於閘極結構兩側與第一摻雜類型磊晶層上，其中至少一閘極結構的底部低於第二摻雜類型磊晶層的底部。複數個摻雜區在第一方向上間隔設置，且包覆閘極結構的兩側的複數個底部邊角。複數個源極區設置在至少一閘極結構的兩側與第二摻雜類型磊晶層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate, a first doped type epitaxial layer, at least one gate structure, a plurality of second doped type epitaxial layers, a plurality of doped regions, and a plurality of source regions. The first doped type epitaxial layer is disposed on the substrate. The at least one gate structure is disposed on the first doped type epitaxial layer and extends in the first direction. The second doped type epitaxial layers are disposed on both sides of the at least one gate structure and on the first doped type epitaxial layer, in which a bottom of the at least one gate structure is lower the bottoms of the second doped type epitaxial layers. The doped regions are spaced apart in the first direction and cover a plurality of bottom corners on both sides of the gate structure. The source regions are disposed on both sides of the at least one gate structure and on the second doped type epitaxial layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:第一摻雜類型磊晶層</p>  
        <p type="p">140:閘極結構</p>  
        <p type="p">1401:第一閘極結構</p>  
        <p type="p">1402:第二閘極結構</p>  
        <p type="p">142:閘極氧化層</p>  
        <p type="p">143:底部邊角</p>  
        <p type="p">144:閘極層</p>  
        <p type="p">145:底部</p>  
        <p type="p">150:第二摻雜類型磊晶層</p>  
        <p type="p">155:底部</p>  
        <p type="p">160:摻雜區</p>  
        <p type="p">170:源極區</p>  
        <p type="p">180:P型重摻雜區</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="441" publication-number="202621330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆晶發光二極體</chinese-title>  
        <english-title>FLIP CHIP LIGHT EMITTING DIODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250204B">H10H20/83</main-classification>  
        <further-classification edition="202501120250204B">H10H20/831</further-classification>  
        <further-classification edition="202501120250204B">H10H20/832</further-classification>  
        <further-classification edition="202501120250204B">H10H20/833</further-classification>  
        <further-classification edition="202501120250204B">H10H20/841</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭羽彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳皇名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUANG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種覆晶發光二極體，包括基材、發光結構、P型電極結構及N型電極結構。發光結構位於基材上且包括磷化鎵層及半導體磊晶結構，且磷化鎵層位於基材及半導體磊晶結構之間。半導體磊晶結構包括依序形成之P型電流散佈層、發光層、N型半導體層及透明歐姆接觸層。P型電極結構位於發光結構之磷化鎵層上，且N型電極結構位於透明歐姆接觸層上。其中N型半導體層包括分佈式布拉格反射鏡，且分佈式布拉格反射鏡位於發光層及N型電極結構之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a flip-chip light-emitting diode, which includes a substrate, a light-emitting structure, a P-type electrode structure and an N-type electrode structure. The light-emitting structure is located on the substrate and includes a gallium phosphide layer and a semiconductor epitaxial structure, and the gallium phosphide layer is located between the substrate and the semiconductor epitaxial structure. The semiconductor epitaxial structure includes a P-type current spreading layer, a light-emitting layer, an N-type semiconductor layer and a transparent ohmic contact layer formed in sequence. The P-type electrode structure is located on the gallium phosphide layer of the light-emitting structure, and the N-type electrode structure is located on the transparent ohmic contact layer. The N-type semiconductor layer includes a distributed bragg reflector, and the distributed bragg reflector is located between the light-emitting layer and the N-type electrode structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:覆晶發光二極體</p>  
        <p type="p">10:基材</p>  
        <p type="p">20:發光結構</p>  
        <p type="p">21:磷化鎵層</p>  
        <p type="p">22:半導體磊晶結構</p>  
        <p type="p">221:P型電流散佈層</p>  
        <p type="p">222:發光層</p>  
        <p type="p">223:N型半導體層</p>  
        <p type="p">224:透明歐姆接觸層</p>  
        <p type="p">30:P型電極結構</p>  
        <p type="p">31:指狀電極部</p>  
        <p type="p">32:墊片部</p>  
        <p type="p">40:N型電極結構</p>  
        <p type="p">41:電流侷限層</p>  
        <p type="p">411:開孔</p>  
        <p type="p">42:金屬反射層</p>  
        <p type="p">421:歐姆接觸結構</p>  
        <p type="p">43:墊片部</p>  
        <p type="p">DBR:分佈式布拉格反射鏡</p>  
        <p type="p">ODR:全方位反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="442" publication-number="202621331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水平式發光二極體及其製造方法</chinese-title>  
        <english-title>HORIZONTAL LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250204B">H10H20/832</main-classification>  
        <further-classification edition="202501120250204B">H10H20/83</further-classification>  
        <further-classification edition="202501120250204B">H10H20/822</further-classification>  
        <further-classification edition="202501120250204B">H10H20/821</further-classification>  
        <further-classification edition="202501120250204B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鴻達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭羽彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種水平式發光二極體及其製造方法，水平式發光二極體包含一永久基板、一磊晶複合層、一第一導電型電極、一第二導電型電極及一歐姆接觸層。其中，磊晶複合層具有發光波段為1100~2000奈米（nm）之一發光層，設置於永久基板上。第一導電型電極設置於永久基板上，電性連接至磊晶複合層。第二導電型電極設置於磊晶複合層上，電性連接至磊晶複合層，且與第一導電型電極位於永久基板同側。歐姆接觸層與第一導電型電極間形成歐姆接觸，並夾置於磊晶複合層與第一導電型電極間。其中，歐姆接觸層之一厚度不大於1微米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A horizontal light-emitting diode (LED) and its manufacturing method are provided. The horizontal LED comprises a permanent substrate, an epitaxial composite layer, a first conductive-type electrode, a second conductive-type electrode, and an ohmic contact layer. The epitaxial composite layer includes a light-emitting layer with an emission wavelength in the range of 1100 to 2000 nanometers which is disposed on the permanent substrate. The first conductive-type electrode is disposed on the permanent substrate and electrically connected to the epitaxial composite layer. The second conductive-type electrode is disposed on the epitaxial composite layer, electrically connected to it, and is arranged on the same side of the permanent substrate as the first conductive-type electrode. The ohmic contact layer forms an ohmic contact with the first conductive-type electrode and is sandwiched between the epitaxial composite layer and the first conductive-type electrode. The thickness of the ohmic contact layer is no more than 1 micron.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:N型歐姆接觸層</p>  
        <p type="p">103:第二化合物半導體層</p>  
        <p type="p">104:發光層</p>  
        <p type="p">105:第一化合物半導體層</p>  
        <p type="p">106:P型歐姆接觸層</p>  
        <p type="p">107:金屬疊層</p>  
        <p type="p">108:基板鍵合層</p>  
        <p type="p">109:永久基板</p>  
        <p type="p">111:第一導電型電極</p>  
        <p type="p">112:第二導電型電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="443" publication-number="202619761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減速回收繩體之防墜器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">A62B1/14</main-classification>  
        <further-classification edition="200601120250116B">A62B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>振鋒企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKE INDUSTRIAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪暐傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嘉賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁子倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種減速回收繩體之防墜器，係於外殼內固定一主軸，於主軸套合一轉轂，於主軸與轉轂之間結合一渦捲彈簧，於轉轂纏繞一伸出外殼的繩體，於轉轂的一側結合一制動組件，於外殼內固定可供制動組件接合的煞車裝置，於轉轂內設置一減速組件，係於主軸固定一阻尼器支架，於阻尼器支架固定與主軸間隔開的旋轉阻尼器，於轉轂的內壁部固定與轉轂同心的連動齒輪用以嚙合旋轉阻尼器；藉此，當繩體被拉出外殼後，透過旋轉阻尼器所提供的阻尼作用可降低轉轂捲回繩體的力量，如此能避免繩體被轉轂捲回時速度過快可能發生的危險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:繩體</p>  
        <p type="p">22:主軸框架</p>  
        <p type="p">221:吊環座</p>  
        <p type="p">222:側板</p>  
        <p type="p">223:連桿</p>  
        <p type="p">225:側板穿孔</p>  
        <p type="p">24:主軸</p>  
        <p type="p">241:支架固定部</p>  
        <p type="p">242:套筒固定部</p>  
        <p type="p">25:煞車裝置</p>  
        <p type="p">26:轉轂</p>  
        <p type="p">261:轉轂軸孔</p>  
        <p type="p">262:繩槽</p>  
        <p type="p">263:渦捲彈簧室</p>  
        <p type="p">264:減速組件室</p>  
        <p type="p">265:內壁部</p>  
        <p type="p">266:法藍部</p>  
        <p type="p">268:蓋板</p>  
        <p type="p">28:渦捲彈簧</p>  
        <p type="p">31:壓縮彈簧</p>  
        <p type="p">32:阻尼器支架</p>  
        <p type="p">33:隔板</p>  
        <p type="p">331:隔板穿孔</p>  
        <p type="p">34:旋轉阻尼器</p>  
        <p type="p">36:連動齒輪座</p>  
        <p type="p">38:連動齒輪</p>  
        <p type="p">L:軸心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="444" publication-number="202619934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪椅專用之無障礙三輪機車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250116B">B62K5/023</main-classification>  
        <further-classification edition="200601120250116B">B62K21/00</further-classification>  
        <further-classification edition="201301120250116B">B62K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪力東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪力東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李朝枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓世喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏廣炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輪椅專用之無障礙三輪機車，其係包含一車架主體、一傳動單元、一車身升降單元及一前輪轉向單元，該車架主體具有一前車架及一後車架，該車身升降單元包括二拖曳臂、二後避震器及二電動推桿，各該拖曳臂樞接各該後避震器，同時各該拖曳臂的側邊藉由一連接件樞接於該後車架，各該後避震器的另端係樞接各該電動推桿的一端，各該電動推桿另端係固定於該前車架，藉此，透過該等電動推桿的作動，同時連動各該後避震器，使各該後避震器推動各該拖曳臂，進而可帶動該前車架與該後車架進行上升或下降，藉以減少該後車架與地面的高低差，使該車架主體之導引板放下時可降低傾斜角度並能更貼近地面，俾供輪椅的使用者上下機車更為方便，同時能避免因該導引板傾斜角度過大造成輪椅翻覆的危險性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">100:輪椅專用之無障礙三輪機車</p>  
        <p type="p">10:車架主體</p>  
        <p type="p">13:車殼體</p>  
        <p type="p">131:導引板</p>  
        <p type="p">14:容置空間</p>  
        <p type="p">15:遮棚</p>  
        <p type="p">25:後車輪</p>  
        <p type="p">65:前車輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="445" publication-number="202621325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光感測器和其製造方法</chinese-title>  
        <english-title>PHOTODETECTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250211B">H10F71/00</main-classification>  
        <further-classification edition="202501120250211B">H10F77/20</further-classification>  
        <further-classification edition="200601120250211B">C23C14/34</further-classification>  
        <further-classification edition="202501120250211B">H10F30/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俐文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱聖緣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, SHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露書提出一種光感測器製造方法，包括：取得一基板；以一第一流量於一製程機台中填充氬氣，一第二流量填充氧氣，並將一主動層濺鍍沈積至該基板上；以一第三流量於該製程機台中填充氬氣，並將一電極層濺鍍沈積至該主動層上。本揭露書提出的光感測器製造方法在沈積主動層時，透過控制氬氣和氧氣流入製程機台的流量，以調變氧化鋅薄膜中的缺陷，使氧化鋅沈積於基板的狀態更穩定，使得主動層和電極層之間不需要額外的緩衝層，藉此可以提高製成的效率，也能降低製程成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for manufacturing a photodetector, including obtaining a substrate; filling argon at a first flow rate and oxygen at a second flow rate into a processing machine, depositing an active layer onto the substrate by sputtering, filling argon at a third flow rate into the processing machine, and depositing an electrode layer onto the active layer by sputtering. The method provided in this disclosure allows for a more stable deposition of zinc oxide on the substrate by controlling the flow rates of argon and oxygen which flow into the process machine. Such that, there is no need for an additional buffer layer between the active and electrode layers, thereby enhancing manufacturing efficiency and reducing production costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(100):光感測器</p>  
        <p type="p">(1):基板</p>  
        <p type="p">(2):主動層</p>  
        <p type="p">(3):電極層</p>  
        <p type="p">(31):叉指狀電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="446" publication-number="202620464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏振分光膜堆結構和偏極化分光元件</chinese-title>  
        <english-title>POLARIZING AND LIGHT-SPLITTING FILM STACKED STRUCTURE AND POLARIZING BEAM SPLITTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">G02B1/08</main-classification>  
        <further-classification edition="201901120250116B">B32B7/023</further-classification>  
        <further-classification edition="200601120250116B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤米科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VACTRONICS TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSANG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆正堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, CHENG-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘泓任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偏振分光膜堆結構包含交錯地堆疊的多個高折射層和多個低折射層，該偏振分光膜堆結構對在一特定波段的第一偏振光在入射角45度的穿透率T1與該偏振分光膜堆結構對在該特定波段的第二偏振光在入射角45度的穿透率T2符合T2/T1＞1000，且該第一偏振光的偏振方向垂直於該第二偏振光的偏振方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polarizing and light-splitting film stacked structure includes high refraction layers and low refraction layers alternatively stacked up with the high refraction layers, a transmittance T1 of the polarizing and light-splitting film with respect to first polarized light in a specific waveband at an incidence angle of 45° and a transmittance T2 of the polarizing and light-splitting film with respect to second polarized light in the specific band of at the incidence angle of 45° satisfy T2/T1＞1000, and the first and second polarized light are orthogonal to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:偏振分光膜堆結構</p>  
        <p type="p">21_1:膜層</p>  
        <p type="p">22_1:膜層</p>  
        <p type="p">21_(M-1):膜層</p>  
        <p type="p">22_N:膜層</p>  
        <p type="p">21_M:膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="447" publication-number="202619708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>３＇，４＇－二羥基苯乙基茴香酸酯、其製備方法及其用途</chinese-title>  
        <english-title>3', 4'-DIHYDROXYPHENETHYLANISATE, ITS PREPARATION METHOD AND USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">A61K31/21</main-classification>  
        <further-classification edition="200601120250701B">A61K31/075</further-classification>  
        <further-classification edition="200601120250701B">A61K31/047</further-classification>  
        <further-classification edition="202201120250701B">C12P7/62</further-classification>  
        <further-classification edition="200601120250701B">A61P17/18</further-classification>  
        <further-classification edition="200601120250701B">A61P35/00</further-classification>  
        <further-classification edition="200601120250701B">A61P29/00</further-classification>  
        <further-classification edition="200601120250701B">A61Q19/00</further-classification>  
        <further-classification edition="200601120250701B">A61K8/37</further-classification>  
        <further-classification edition="200601120250701B">A61K8/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺南大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF TAINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李姿萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳征祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種3', 4'-二羥基苯乙基茴香酸酯（3', 4'-Dihydroxyphenethylanisate）、其製備方法及其用途，3', 4'-二羥基苯乙基茴香酸酯為一種新化合物，其係可透過巨型芽孢桿菌酪氨酸酶（BmTYR）生物轉化；於生物活性試驗中，3', 4'-二羥基苯乙基茴香酸酯具強效之自由基清除活性、抗炎活性、抗黑色素瘤活性，及抗黑色素生成活性；顯見，本發明於生物技術工業中確實極具潛在用途者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides 3', 4'-Dihydroxyphenethylanisate, its preparation method and use. 3', 4'-Dihydroxyphenethylanisate is a new compound that can be biotransformed by Bacillus megaterium tyrosinase (BmTYR). In bioactivity assays, 3', 4'-Dihydroxyphenethylanisate exhibits strong free radical scavenging activity, anti-inflammatory activity, anti-melanoma activity, and anti-melanogenesis activity. These results indicate that this invention has significant potential applications in the biotechnology industry.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="448" publication-number="202621449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件擷取裝置及潔淨單元</chinese-title>  
        <english-title>OBJECT RETRIEVAL DEVICE AND CLEAN UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260224B">H10P72/76</main-classification>  
        <further-classification edition="202601120260224B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>均華精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLANT MICRO. MACHINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　語尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EE-SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, NAI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種物件擷取裝置及潔淨單元。物件擷取裝置用來擷取物件，並且防止污染物接觸物件。物件擷取裝置包含承載物件的工作台、第一潔淨單元、及第二潔淨單元。第一潔淨單元包含殼體、連接於殼體旋轉頭模組、及通過排氣管路連接於殼體的負壓單元。旋轉頭模組包含旋轉件及多個擷取頭。旋轉件與殼體共同形成一配置腔室、且能夠沿著旋轉方向轉動。多個擷取頭沿旋轉方向間隔地排列，並且能夠沿高度方向往復移動，用以擷取物件。負壓單元連通於配置腔室，用以產生吸附力，以令落於配置腔室之內的污染物經由排氣管路排出配置腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an object retrieval device and a clean unit. The object retrieval device is configured for retrieving an object and preventing a pollutant from contacting the object. The object retrieval device includes a worktable for carrying the object, a first clean unit, and a second clean unit. The first clean unit includes a case, a rotating head module, and a negative pressure unit that is connected to the case through an exhaust pipe. The rotating head module includes a rotating component and a plurality of retrieval heads, the rotating component and the case jointly define a configuration chamber, and the rotating component is rotatable along a rotation direction. The retrieval heads are spaced apart from each other along the rotation direction, and the retrieval heads are movable along a height direction to retrieve the object. The negative pressure unit is in spatial communication with the configuration chamber and is configured to generate an adsorption force so as to discharge the pollutant from the configuration chamber through the exhaust pipeline.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一潔淨單元</p>  
        <p type="p">11:殼體</p>  
        <p type="p">12:旋轉頭模組</p>  
        <p type="p">121:旋轉件</p>  
        <p type="p">1211:突出部</p>  
        <p type="p">122:擷取頭</p>  
        <p type="p">13:排氣管路</p>  
        <p type="p">14:負壓單元</p>  
        <p type="p">15:攝像機</p>  
        <p type="p">22:支架</p>  
        <p type="p">222:固定架</p>  
        <p type="p">A1:配置腔室</p>  
        <p type="p">S1:第一氣縫</p>  
        <p type="p">S2:第二氣縫</p>  
        <p type="p">P:污染物</p>  
        <p type="p">D1:旋轉方向</p>  
        <p type="p">D2:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="449" publication-number="202620590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱機構</chinese-title>  
        <english-title>HEAT DISSIPATION MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">G06F1/20</main-classification>  
        <further-classification edition="200601120241224B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃頌銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SUNG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱英哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, ING-JER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱機構，適用於筆記型電腦，筆記型電腦包含至少一熱源，散熱機構包括均溫板、多個立柱、毛細結構、工作流體、多個第一鰭片以及至少一風扇。均溫板具有相對的第一面與第二面，第一面與第二面之間形成第一腔室。第二面接觸熱源。立柱由第二面向外突出而形成。各立柱具有第二腔室，連通第一腔室而形成封閉式腔體。毛細結構配置於第一腔室與第二腔室的壁面。工作流體填充於第一腔室與第二腔室。第一鰭片位於第二面上且彼此層疊地套設於立柱，各第一鰭片環繞立柱的至少部分。風扇配置在筆記型電腦內，風扇具有至少一出風口，朝向第一鰭片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation mechanism provided for a laptop computer includes a vapor chamber, standing columns, a capillary structure, a working fluid, first fins, and at least one fan. The vapor chamber has a first surface and a second surface opposite to each other, a first cavity is formed between the first and the second surfaces. The second surface contacts at least one heat source of the laptop computer. The standing columns protruding from the second surface each has a second chamber communicated the first chamber to form a closed cavity, wherein the capillary structure is disposed on inner walls of the first cavity and the second cavity, and the working fluid is filled in the closed cavity. The first fins located above the second surface are sheathed onto the standing columns in layers. The fan disposed in the laptop computer has at least one outlet facing to the first fins.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:筆記型電腦</p>  
        <p type="p">11:機殼</p>  
        <p type="p">11a:散熱孔</p>  
        <p type="p">100:散熱機構</p>  
        <p type="p">110:均溫板</p>  
        <p type="p">120:立柱</p>  
        <p type="p">150:鰭片</p>  
        <p type="p">161:第一風扇</p>  
        <p type="p">161a:第一出風口</p>  
        <p type="p">161b:第一副出風口</p>  
        <p type="p">162:第二風扇</p>  
        <p type="p">162a:第二出風口</p>  
        <p type="p">200:電子板件</p>  
        <p type="p">210、220:熱源</p>  
        <p type="p">180:螺絲</p>  
        <p type="p">S1:第一面</p>  
        <p type="p">S2:第二面</p>  
        <p type="p">X-Y-Z:直角座標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="450" publication-number="202620887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分子比對系統及其方法</chinese-title>  
        <english-title>MOLECULAR MATCHING SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250512B">G16C20/20</main-classification>  
        <further-classification edition="201901120250512B">G16C20/70</further-classification>  
        <further-classification edition="202301120250512B">G06N3/0455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張思忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SZU-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳又彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-ZHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供的分子比對系統及其方法，可在取得物質分析結果後，根據分子清單與匹配程度數值與知識管理系統中的相關問題及對應權重，使用關聯性資料庫，以AI LLM進行判斷與計算，進一步確定造成破壞的化合物的分子種類。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a molecular matching system and method thereof, which can use a relevance database according to a molecular list and HQI, and multiple queries and corresponding multiple weights from a KM system after obtaining a substance analysis result, and can be determined and calculated by AI LLM, to determined which molecular type is a molecular of destruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:程序</p>  
        <p type="p">S310,S320,S330,S340,S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="451" publication-number="202619850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手工具內孔限位件結構改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25B13/46</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>靖旺有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊德川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種手工具內孔限位件結構改良，包含：一扳手本體及一限位件，該扳手本體具有一握柄及一工作端，該工作端裝配有一棘輪，該棘輪內孔設有一內環槽，該限位件由一橢圓環圈的一側設置一開口構成，具有變形彈性，該限位件設有一第一卡抵部、一第二卡抵部、一第二卡抵部及二彈夾部，組裝於該內環槽內，該第一卡抵部、該第二卡抵部及該第三卡抵部與該內環槽的內壁卡抵定位，確保限位件在任何角度下都能與內環槽對正，方便套筒插入內孔，提升使用便利性，並有效防止限位件滑動產生噪音，從而提升使用體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:扳手本體</p>  
        <p type="p">11:握柄</p>  
        <p type="p">12:工作端</p>  
        <p type="p">121:容置孔</p>  
        <p type="p">13:棘輪</p>  
        <p type="p">131:內孔</p>  
        <p type="p">132:內環槽</p>  
        <p type="p">133:內環槽</p>  
        <p type="p">134:內環槽</p>  
        <p type="p">20:限位件</p>  
        <p type="p">21:橢圓環圈</p>  
        <p type="p">22:開口</p>  
        <p type="p">23:第一卡抵部</p>  
        <p type="p">24:第二卡抵部</p>  
        <p type="p">25:第三卡抵部</p>  
        <p type="p">26:彈夾部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="452" publication-number="202620411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分條鋼帶之孔洞及邊裂檢測系統及其方法</chinese-title>  
        <english-title>HOLE AND EDGE CRACK DETECTION SYSTEM FOR SLIT STEEL STRIP AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G01N21/88</main-classification>  
        <further-classification edition="201701120241230B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, PO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊詠宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分條鋼帶之孔洞及邊裂檢測系統，包含：一發光元件，裝設於至少一分條鋼帶下方，用以作為至少一分條鋼帶之背光光源；至少一影像擷取裝置，裝設於對應於發光元件之至少一分條鋼帶上方，用以取得至少一分條鋼帶之一鋼帶影像；以及一檢測伺服器，與至少一影像擷取裝置連接並用以接收鋼帶影像，並包含：一分條鋼帶分析模組，用以分析鋼帶影像之至少一條帶亮區及至少一條帶暗區，以將至少一條帶暗區分割為至少一分條鋼帶影像；以及一孔洞邊裂分析模組，用以分別偵測至少一分條鋼帶影像之一瑕疵亮區，並判斷瑕疵亮區為孔洞或邊裂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hole and edge crack detection system for slit steel strip includes: a light emitting element, installed below at least one slit steel strip and used as a backlight source for the at least one slit steel strip; at least one image capture device, installed above the at least one steel strip corresponding to the light emitting element, used for obtaining a steel strip image of the at least one steel strip; and a detection server, connected to the at least one image capture device and used for receiving the steel strip image. The detection server includes: a slit steel strip analysis module, used for analyzing at least one strip bright area and at least one strip dark area of the steel strip image, and dividing the at least one strip dark area as at least one slit steel strip image; and a hole and edge crack analysis module, used for detecting a bright defect area in the slit steel strip image, and determining whether the bright defect area is a hole or an edge crack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:分條鋼帶之孔洞及邊裂檢測系統</p>  
        <p type="p">110:線形發光元件</p>  
        <p type="p">120:線形影像擷取裝置</p>  
        <p type="p">130:檢測伺服器</p>  
        <p type="p">131:分條鋼帶分析模組</p>  
        <p type="p">132:孔洞邊裂分析模組</p>  
        <p type="p">140:分條鋼帶資料庫</p>  
        <p type="p">F1:孔洞</p>  
        <p type="p">F2:邊裂</p>  
        <p type="p">D:方向</p>  
        <p type="p">S:分條鋼帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="453" publication-number="202621236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構、半導體結構的形成方法及檢測方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE AND INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260203B">H10B12/00</main-classification>  
        <further-classification edition="202601120260203B">H10W46/00</further-classification>  
        <further-classification edition="202601120260203B">H10P74/00</further-classification>  
        <further-classification edition="202001120260203B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昶鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體結構，半導體結構包含位於半導體基底的第一區中的第一主動區、位於第一主動區中的第一閘極電極、以及設置於第一閘極電極之上的第一介電蓋層。第一閘極電極包含第一功函數層、位於第一功函數層之上的第二功函數層、介於第一功函數層與第二功函數層之間的第一阻障層、以及位於第二功函數層之上的金屬蓋層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a first active region in a first region of a semiconductor substrate, a first gate electrode in the first active region, and a first dielectric capping layer disposed on the first gate electrode. The first gate electrode includes a first work function layer, a second work function layer over the first work function layer, a first barrier layer between the first and second work function layers, and a metal capping layer over the second work function layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50A:第一區</p>  
        <p type="p">50B:第二區</p>  
        <p type="p">100:半導體結構</p>  
        <p type="p">102:半導體基底</p>  
        <p type="p">104A,104B:主動區</p>  
        <p type="p">106:隔離結構</p>  
        <p type="p">109:介電層</p>  
        <p type="p">110:閘極介電層</p>  
        <p type="p">112:絕緣層</p>  
        <p type="p">114:第一閘極襯層</p>  
        <p type="p">116:第一功函數層</p>  
        <p type="p">118:第二閘極襯層</p>  
        <p type="p">120:第二功函數層</p>  
        <p type="p">124B:金屬蓋層</p>  
        <p type="p">128A,128B:閘極電極</p>  
        <p type="p">130A,130B:介電蓋層</p>  
        <p type="p">132,134:遮罩層</p>  
        <p type="p">136A,136B:開口</p>  
        <p type="p">D2:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="454" publication-number="202619736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蜂花粉萃取物及其製備方法</chinese-title>  
        <english-title>BEE POLLEN EXTRACT AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241125B">A61K35/644</main-classification>  
        <further-classification edition="200601120241125B">A61P39/06</further-classification>  
        <further-classification edition="201601120241125B">A23L21/20</further-classification>  
        <further-classification edition="201601120241125B">A23P10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東海大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNGHAI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱致穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種蜂花粉萃取物及其製備方法，藉由將蜂花粉與葡萄糖混合獲得一混合物，將所述混合物經由擠壓造粒處理獲得造粒混合物，再以溶劑萃取所述造粒混合物，即獲得所述蜂花粉萃取物。所述蜂花粉萃取物除了可改善蜂花粉之特殊氣味外，並同樣具有高抗氧化功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a bee pollen extract and preparation method thereof. A mixture is obtained by mixing bee pollen and glucose, the mixture is subjected to extrusion granulation to obtain a granulation mixture, and then the granulation is extracted with a solvent. the bee pollen extract is obtained. The bee pollen extract can not only improve the special smell of bee pollen, but also has high antioxidant effect.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="455" publication-number="202620593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療超音波用途的主機板及直流電力供應電路</chinese-title>  
        <english-title>A MOTHERBOARD AND DC POWER SUPPLY CIRCUIT FOR MEDICAL ULTRASONIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G06F1/26</main-classification>  
        <further-classification edition="200601120241204B">G06F1/10</further-classification>  
        <further-classification edition="200601120241204B">A61B8/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姬仲和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, CHUNG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴辰銜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHEN SHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種醫療超音波用途的主機板設備，包含核心電路、周邊電路，及用於供電的直流電力供應電路，直流電力供應電路包括處理器電源供應裝置、同頻異相時脈控制器，及多個局部電源供應裝置。系統就緒訊號指示工作狀態時，同頻異相時脈控制器根據核心時脈訊號產生多個頻率相同且不同相位的相位移時脈訊號。處理器電源供應裝置及局部電源供應裝置分別根據核心時脈訊號及相位移時脈訊號，分別產生核心轉換電力及周邊轉換電力。藉由同頻率且不同相位的相位移時脈訊號產生周邊轉換電力，使所生成的電磁干擾頻率來源減少從而提升超音波成像的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motherboard equipment for medical ultrasonic use includes a core circuit, a peripheral circuit and a DC power supply circuit for supplying power, the DC power supply circuit including a processor power supply device, an intra - frequency heterophasic clock controller and a plurality of local power supply devices, the intra - frequency heterophasic clock controller generating a plurality of phase - shifted clock signals of the same frequency and different phases according to the core clock signal when the system ready signal indicates an operating state. The processor power supply device and the local power supply device generate a core conversion power and a peripheral conversion power according to the core clock signal and the phase - shifted clock signal, respectively. Based on the phase shifted clock signals having the same frequency and different phases, the peripheral conversion power is generated so that the electromagnetic interference frequency source generated is reduced, thereby improving accuracy of ultrasonic imaging.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機板</p>  
        <p type="p">1:直流電力供應電路</p>  
        <p type="p">11:總電源供應裝置</p>  
        <p type="p">12:局部電源供應裝置</p>  
        <p type="p">13:處理器電源供應裝置</p>  
        <p type="p">14:同頻異相時脈控制器</p>  
        <p type="p">2:周邊電路</p>  
        <p type="p">3:核心電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="456" publication-number="202620040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製備治療子宮頸癌藥物之醫藥組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C07K16/18</main-classification>  
        <further-classification edition="200601120250501B">A61K39/395</further-classification>  
        <further-classification edition="200601120250501B">A61K47/22</further-classification>  
        <further-classification edition="200601120250501B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孿生智庫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏秋偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHYOU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊久滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIANG, GIOU-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游惠茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種用於製備治療子宮頸癌藥物之醫藥組合物，該醫藥組合物係為低濃度 IgY 蛋黃體免疫球蛋白與抗氧化劑，該抗氧化劑為維生素C 或α-生育醇。其中各成分適當比例濃度之該醫藥組合物對 HeLa cell（海拉細胞） 有抑制作用，可以進而運用於製備治療子宮頸癌藥物之醫藥組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="457" publication-number="202620785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛擬分身模擬創作之系統及其方法</chinese-title>  
        <english-title>SIMULATION CREATION SYSTEM FOR VIRTUAL AVATAR AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241204B">G06T13/40</main-classification>  
        <further-classification edition="201101120241204B">G06T13/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, TA WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種虛擬分身模擬創作之系統及其方法，透過動作捕捉技術擷取繪畫的動作以生成向量化的繪畫動作訊息，並且作為生成式人工智慧模型的訓練資料以便在訓練完成後形成繪畫動作模型，以及通過成像技術生成虛擬分身。接著，將提示詞及虛擬分身輸入至繪畫動作模型以產生具有繪畫動作的虛擬分身，以及通過生成對抗網路的生成器根據提示詞生成繪畫圖像，再由判別器反饋繪畫圖像的真偽至生成器以作為調整繪畫圖像的依據。然後，在調整完成的繪畫圖像上覆蓋遮罩，並且根據虛擬分身持有的畫具與遮罩的重疊區域移除相應的遮罩，直到虛擬分身的動作停止或遮罩完全被移除為止，藉以達到提高虛擬分身的創作擬真性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A simulation creation system for virtual avatar and method thereof is disclosed. By capturing drawing actions through motion capture technology to generate vectorized drawing action data, which serves as training material for generative AI models, ultimately forming a drawing action model after training. Additionally, imaging technology is used to create a virtual avatar. Next, prompts and the virtual avatar are input into the drawing action model to produce a virtual avatar with drawing actions. The generator of a generative adversarial network generates drawing images based on the prompts, while the discriminator provides feedback on the authenticity of the drawing images to the generator, serving as a basis for adjusting the images. Then, a mask is applied to the adjusted drawing images, and corresponding areas of the mask are removed based on the tools held by the virtual avatar and the overlapping regions of the mask, until the virtual avatar's actions stop or the mask is completely removed. The mechanism is help to improve the realism of virtual avatar creation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:動作捕捉裝置</p>  
        <p type="p">120:電腦主機</p>  
        <p type="p">121:非暫態電腦可讀儲存媒體</p>  
        <p type="p">122:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="458" publication-number="202620786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於虛擬分身的舞蹈查詢與推演系統及其方法</chinese-title>  
        <english-title>DANCE QUERY AND SIMULATION SYSTEM BASED ON VIRTUAL AVATAR AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250117B">G06V40/20</main-classification>  
        <further-classification edition="202201120250117B">G06V10/70</further-classification>  
        <further-classification edition="201101120250117B">G06T13/20</further-classification>  
        <further-classification edition="201101120250117B">G06T13/40</further-classification>  
        <further-classification edition="202301120250117B">G06F18/2325</further-classification>  
        <further-classification edition="201901120250117B">G06F16/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUAN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於虛擬分身的舞蹈查詢與推演系統及其方法，透過動作捕捉技術持續捕捉使用者的舞蹈動作以向量化成為第一舞蹈動作訊息，並且生成相應的虛擬分身，接著將提示詞及第一舞蹈動作訊息輸入至預先訓練完成的多模態生成式人工智慧模型，使其輸出特徵相符的第二舞蹈動作訊息，並據以生成相應的推演虛擬分身，再提示使用者進行與推演虛擬分身相同的動作，進而形成第三舞蹈動作訊息，然後分析第二、三舞蹈動作訊息的相似度，再根據相似度的高低排序顯示推演虛擬分身以作為舞蹈推演的參考依據，藉以達到利用虛擬分身提高編舞效率之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dance query and simulation system based on virtual avatar and method thereof is disclosed. By continuously capturing the user's dance movements through motion capture technology, the first dance motion data is vectorized to generate a corresponding virtual avatar. Then, the prompt and the first dance motion data are input into a pre-trained multimodal generative AI model, which outputs the second dance motion data that aligns with the features. Based on this, a corresponding projected virtual avatar is generated, prompting the user to perform the same movements as the projected avatar, thereby creating the third dance motion data. Next, the similarity between the second and third dance motion data is analyzed, and the projected virtual avatars are ranked and displayed based on the level of similarity, serving as a reference for dance choreography. The mechanism is help to improve the choreography efficiency according to the virtual avatar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:動作捕捉裝置</p>  
        <p type="p">311a~311n:傳感器</p>  
        <p type="p">320:使用者</p>  
        <p type="p">330:虛擬分身</p>  
        <p type="p">341,342:推演虛擬分身</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="459" publication-number="202621226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143380</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷伺服器機櫃</chinese-title>  
        <english-title>LIQUID COOLING SERVER RACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H05K7/20</main-classification>  
        <further-classification edition="200601120250102B">H05K7/14</further-classification>  
        <further-classification edition="200601120250102B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃適欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃識維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係一種液冷伺服器機櫃，包括機架、伺服器、配流排、配電排、複數液冷管及電纜線，伺服器設於機架內且與機架形成有第一空間、第二空間及二側邊空間，第一空間與第二空間位於伺服器的相對兩側，各側邊空間位於伺服器的另外相對兩側，配流排與配電排設於機架且位於側邊空間內，各液冷管對應第一空間配置且兩端分別連接配流排及伺服器對應第一空間的一側，電纜線對應第二空間配置且兩端分別連接配電排及伺服器對應第二空間的一側；藉此可有效形成水電分離以符合安規、並提升電纜線的散熱效率、且能夠方便各液冷管與電纜線的理線及維護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling server rack having a cabinet, a server, a coolant distribution manifold (CDM), a power distribution Unit (PDU), a plurality of liquid pipes, and an electric cable is provided. The server is arranged in the cabinet and forms a first space, a second space, and two side spaces together with the cabinet. The first space and the second space are located on two opposite sides of the server. The side spaces are located on other two opposite sides of the server. The CDM and the PDU are arranged on the cabinet and located in the side spaces. The liquid pipes are corresponding to the first space, and two ends of each of the liquid pipes are respectively connected to the CDU and a side of the server corresponding to the first space. The electric cable is corresponding to the second space, and two ends of the electric cable are respectively connected to the PDM and a side of the server corresponding to the second space. Thus, the liquid and the electric may be separated to comply with safety regulations, a cooling efficiency of the electric cable may be improved, and the liquid pipes and the electric cable may be conveniently organized and maintained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機架</p>  
        <p type="p">101:門板</p>  
        <p type="p">11:第一空間</p>  
        <p type="p">12:第二空間</p>  
        <p type="p">13:側邊空間</p>  
        <p type="p">20:伺服器</p>  
        <p type="p">30:配流排</p>  
        <p type="p">40:配電排</p>  
        <p type="p">50:液冷管</p>  
        <p type="p">60:電纜線</p>  
        <p type="p">70:承載架</p>  
        <p type="p">71:固定板</p>  
        <p type="p">72:連接板</p>  
        <p type="p">73:遮蔽板</p>  
        <p type="p">74:補強板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="460" publication-number="202620517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防窺模組及防窺顯示裝置</chinese-title>  
        <english-title>ANTI-PEEPING MODULE AND ANTI-PEEPING DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G02F1/133</main-classification>  
        <further-classification edition="200601120241127B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達運精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JIAN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈文臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種部分防窺模組，包含防窺片、第一上導光板及第一光源。第一上導光板設置於防窺片的一側。第一上導光板包含第一入光面、第一出光面、第一底面及多個第一微結構，第一微結構設置於第一出光面及第一底面其中之一，其中第一上導光板具有鄰接的至少一的第一區塊及至少一個第二區塊。第一微結構在第一區塊的平均分布密度大於第一微結構在第二區塊的平均分布密度。第一光源設置於第一入光面的一側。一種包含部分防窺模組的部分防窺顯示裝置亦被提供。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A partial anti-peeping module includes a privacy-preventing film, a first upper light guide plate, and a first light source. The first upper light guide plate is disposed on the side of the privacy-preventing film. The first upper light guide plate includes a first light incident surface, a first light emitting surface, a first bottom surface and a plurality of first microstructures. The first microstructures are disposed on one of the first light emitting surface and the first bottom surface, wherein the first upper light guide plate has at least one first block and at least one second block connected. The average distribution density of the first microstructures on one of the first block more than the average distribution density of the first microstructures on one of the second block. A partial anti-peeping display device including a partial anti-peeping module is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:部分防窺模組</p>  
        <p type="p">10:第一上導光板</p>  
        <p type="p">12:第一入光面</p>  
        <p type="p">14:第一底面</p>  
        <p type="p">16:第一出光面</p>  
        <p type="p">18:第一微結構</p>  
        <p type="p">40:防窺片</p>  
        <p type="p">50:第一光源</p>  
        <p type="p">D1:第一深度</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">A1:第一區塊</p>  
        <p type="p">A2:第二區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="461" publication-number="202620237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有晶圓邊緣溫度補償設計的化學氣相沉積系統</chinese-title>  
        <english-title>CHEMICAL VAPOR DEPOSITION SYSTEM HAVING TEMPERATURE COMPENSATING DESIGN FOR WAFER EDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241122B">C23C16/54</main-classification>  
        <further-classification edition="200601120241122B">C23C16/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢民科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERMES-EPITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林公璿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUNG HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱建欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIEN CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化學氣相沉積系統，其可在進行沉積製程時降低晶圓承載器對晶圓的邊緣溫度的影響，並可對晶圓的邊緣進行溫度補償，使得晶圓在邊緣區域與其他區域的磊晶層具有相同均勻的特性，從而提高產品的良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical vapor deposition system, which can reduce the influence of the wafer holder on the edge temperature of the wafer during the deposition process. The system can also compensate the edge temperature of the wafer so that the epitaxial layers of the edge region have same uniform characteristics as that of other regions of wafer, thereby improving the yield.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:晶圓承載器</p>  
        <p type="p">5:均熱板</p>  
        <p type="p">43:延伸結構</p>  
        <p type="p">51:溫度補償區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="462" publication-number="202620186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兼具量產與客製化之細胞培養系統</chinese-title>  
        <english-title>CELL CULTURE SYSTEM WITH BOTH MASS PRODUCTION AND CUSTOMIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M1/24</main-classification>  
        <further-classification edition="200601120241125B">C12M1/34</further-classification>  
        <further-classification edition="200601120241125B">C12M1/36</further-classification>  
        <further-classification edition="200601120241125B">C12M3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美榮生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELLFABS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱運輸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, YUN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林上智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂建安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIEN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪志洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兼具量產與客製化之細胞培養系統，包括：一細胞培養室用於培養複數個細胞培養瓶，且該細胞培養室內設置有一移載機，且該移載機用於夾持該細胞培養瓶，一主軌道由該細胞培養室的出入口處延伸至該檢測區域、該換液區域及該收成區域，且該主軌道上滑行有至少一自走承載盤，該自走承載盤提供該移載機放置與拿取該細胞培養瓶，一智能管理系統執行細胞培養流程控制該移載機與該自走承載盤，將該細胞培養瓶運送至該檢測區域進行細胞檢測，並透過人工智慧方式自動依據細胞培養狀態調整細胞培養流程，藉此兼具有量產與客製化培養細胞之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cell culture system with both mass production and customization capabilities, comprising: a cell culture chamber for culturing multiple cell culture bottles, with a transfer mechanism installed inside the chamber for gripping the cell culture bottles; a main track extending from the entrance/exit of the cell culture chamber to the inspection area, medium exchange area, and harvesting area, with at least one autonomous carrier tray sliding on the main track, providing placement and retrieval of cell culture bottles by the transfer mechanism; and an intelligent management system that controls the cell culture process, operating the transfer mechanism and autonomous carrier tray to transport the cell culture bottles to the inspection area for cell analysis. The system uses artificial intelligence to automatically adjust the cell culture process based on the status of cell culture, thus achieving both mass production and customized cell culture effectiveness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:細胞培養室</p>  
        <p type="p">11:細胞培養瓶</p>  
        <p type="p">13:移載機</p>  
        <p type="p">135:影像鏡頭</p>  
        <p type="p">136:標記確認器</p>  
        <p type="p">14:搖晃機</p>  
        <p type="p">20:檢測區域</p>  
        <p type="p">30:換液區域</p>  
        <p type="p">31:換液針筒</p>  
        <p type="p">32:第一供料軌道</p>  
        <p type="p">33:培養液筒</p>  
        <p type="p">34:廢液筒</p>  
        <p type="p">40:收成區域</p>  
        <p type="p">41:收成瓶</p>  
        <p type="p">42:第二供料軌道</p>  
        <p type="p">43:收成針筒</p>  
        <p type="p">50:主軌道</p>  
        <p type="p">51:自走承載盤</p>  
        <p type="p">60:智能管理系統</p>  
        <p type="p">61:培養履歷</p>  
        <p type="p">62:行動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="463" publication-number="202619911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能源儲存設備之排水系統及該能源儲存設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241204B">B60L53/30</main-classification>  
        <further-classification edition="201901120241204B">B60L53/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太康精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉益村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧脩塵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提出一種能源儲存設備的排水系統，其具有至少一立管、至少一出水管、以及至少一橫管。立管沿上下方向延伸，且立管具有一下端部。出水管連接於下端部且與立管互相連通。出水管貫穿形成有一導出口。橫管連接於立管且與立管互相連通。橫管具有至少一入水口，入水口貫穿形成於橫管的側壁。本創作的優點在於能作為能源儲存設備中系統性的排水手段，因此不必額外在能源儲存設備中接入軟管進行排水，可以降低堵塞或管道脫落導致水在能源儲存設備內四處蔓延的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:排水系統</p>  
        <p type="p">21:立管</p>  
        <p type="p">211:下端部</p>  
        <p type="p">22:橫管</p>  
        <p type="p">23:出水管</p>  
        <p type="p">231:匯聚部</p>  
        <p type="p">232:導出口</p>  
        <p type="p">24:導流管</p>  
        <p type="p">241:出水口</p>  
        <p type="p">25:網柵</p>  
        <p type="p">30:插槽裝置</p>  
        <p type="p">31:前端部</p>  
        <p type="p">32:後端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="464" publication-number="202621035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143398</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能節能致動線圈構件</chinese-title>  
        <english-title>INTELLIGENCE-ENERGY-CONSERVATION ACTUATOR COIL ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241204B">H02P25/032</main-classification>  
        <further-classification edition="200601120241204B">H02K33/00</further-classification>  
        <further-classification edition="200601120241204B">F16K31/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>承康科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGNETIC INTEGRATED TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王福基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FU CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝勝騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHENG TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能節能致動線圈構件，用於智能且節能地驅動機電裝置，包含：電流控制裝置以及導電線圈。電流控制裝置的電流控制器提供工作電流且根據來自定時器的定時通知訊號而輸出電流量低於該工作電流的輔助作業電流。導電線圈因應於所接收的工作電流以及輔助作業電流，而產生並施加工作磁力以及輔助作業磁力至導電線圈所對應的磁力作用區。磁力作用區係供機電裝置對應設置，機電裝置的可動部件自初始位置受工作磁力牽引而位移至作動位置，且輔助作業磁力使可動部件維持在作動位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligence-energy-conservation actuator coil assembly used for driving an electromechanical device in a manner of intelligence and energy-conservation, comprises: a current controlling device and a conductive coil. A current controller of the current controlling device provides working current and outputs, according to a timer notification signal from a timer, auxiliary working current being lower than the working current. The conductive coil generates a working magnetic force and an auxiliary operating force and applies the working magnetic force and the auxiliary operating force to a magnetic field in response to the received working current and the received auxiliary working current. The magnetic field is provided to arrange the electromechanical device, a movable part of the electromechanical device, by the working magnetic force, is driven to move from an initial position to an operating position, and the auxiliary operating force keeps the movable part at the operating position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:智能節能致動線圈構件</p>  
        <p type="p">1:電流控制裝置</p>  
        <p type="p">2:導電線圈</p>  
        <p type="p">20:磁力作用區</p>  
        <p type="p">3:基殼體</p>  
        <p type="p">31:容置孔</p>  
        <p type="p">M:機電裝置</p>  
        <p type="p">S:可動部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="465" publication-number="202620298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇剎車機構</chinese-title>  
        <english-title>FAN BRAKE MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250305B">F04D29/00</main-classification>  
        <further-classification edition="200601120250305B">F16D63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇鋐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐志程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風扇剎車機構，包括一風扇單元及一剎車單元。風扇單元包括一框體及一扇葉，框體垂設一軸筒，扇葉設有一具有一樞接部之軸心以軸設於軸筒內。剎車單元包括一剎車基座及一剎車模組，剎車基座設有制動爪。剎車模組包括一本體、容設於本體中的至少一活動件及與活動件對應設置的限位銷。本體設有貫通槽對應接合樞接部，以將剎車模組樞設於軸心。活動件的一端具有爪部，活動件的另一端設有風阻器，且活動件介於爪部與風阻器之間設有與限位銷相對的限位槽。活動件可活動地位於本體中。當風扇失效而無法正常運作時，因氣流回流使扇葉反向旋轉，風扇剎車機構將被驅動以產生剎車功能，而當風扇正常運作時，剎車功能會被取消，故可達到反覆作動剎車功能，且不須對風扇剎車機構供電驅動，風扇電路板也不需加裝剎車控制功能，與現有設計的共用性佳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:風扇剎車機構</p>  
        <p type="p">10:風扇單元</p>  
        <p type="p">100:框體</p>  
        <p type="p">110:軸筒</p>  
        <p type="p">101:扇葉</p>  
        <p type="p">102:軸心</p>  
        <p type="p">103:上軸承</p>  
        <p type="p">104:下軸承</p>  
        <p type="p">1021:樞接部</p>  
        <p type="p">20:剎車單元</p>  
        <p type="p">210:剎車基座</p>  
        <p type="p">220:剎車模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="466" publication-number="202620987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車用射頻連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241231B">H01R24/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡連精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU LANE ASSOCIATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施文栓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, WEN-SHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐建達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIAN-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高靖宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHING TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車用射頻連接器，其包括一外導體，其形成的一中空管體的一前段包覆一設有一中心導體的絕緣膠芯，其中該中心導體耦接於一同軸電纜線的一導電銅線，以形成訊號的電性連接；而該中空管體的一後段則包覆一壓接套管和該同軸電纜線的一外皮，其中該壓接套管是壓接於該同軸電纜線之一端部裸露的一網狀導電體，而該網狀導電體的一自由端在該壓接套管的一外端緣形成一與該外導體接觸的反摺段，使該外導體、該壓接套管和該網狀導電體形成接地的電性連接；其特徵在於該絕緣膠芯的一後段設有套接一金屬環的一凹環部，其中該金屬環與該外導體形成接觸，藉以調節該外導體至該中心導體的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:同軸電纜線</p>  
        <p type="p">11:導電銅線</p>  
        <p type="p">12:網狀導電體</p>  
        <p type="p">13:外皮</p>  
        <p type="p">2:壓接套管</p>  
        <p type="p">3:中心導體</p>  
        <p type="p">4:絕緣膠芯</p>  
        <p type="p">41:凹環部</p>  
        <p type="p">5:外導體</p>  
        <p type="p">51:第一凸筋</p>  
        <p type="p">52:第二凸筋</p>  
        <p type="p">53:第三凸筋</p>  
        <p type="p">6:金屬環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="467" publication-number="202621326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切割晶圓之製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR DICING A WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10F71/00</main-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈佳蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種切割晶圓之製造方法，其中晶圓上具有複數個非垂直內角之晶粒。製造方法包含以下步驟：首先，排列晶圓上該等晶粒使各晶粒之邊緣彼此對齊排列成一直線，其中相鄰晶粒間環繞出一分隔區。其次，設置複數個標定物於各分隔區中。接著，初始影像定位各標定物後，沿各晶粒彼此對齊之邊緣，直線切割晶圓。旋轉晶圓一角度並影像定位各標定物後，沿各晶粒彼此對齊且尚未切割之邊緣，直線切割晶圓。最終，重複前一步驟直至全部直線切割各晶粒之各邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method for dicing a wafer having multiple non-rectangular dies is provided. The manufacturing method comprises the following steps. First, arrange the dies on the wafer such that the edges of each die are aligned in a straight line and partitions are formed between the adjacent dies. Next, multiple markers are disposed individually in each partition. Then, after initially imaging and locating each marker, a straight dicing is performed along the aligned edges of the dies. After rotating the wafer to a new angle and imaging to locate each marker, a straight dicing along another set of aligned and uncut edges of the dies are performed. Finally, repeat the previous step until all edges of each die have been straight-cut.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:晶粒</p>  
        <p type="p">30:分隔區</p>  
        <p type="p">40:標定物</p>  
        <p type="p">50:晶圓</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:第一斜率直線</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:第二斜率直線</p>  
        <p type="p">L&lt;sub&gt;3&lt;/sub&gt;:第三斜率直線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="468" publication-number="202619906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪胎氣嘴</chinese-title>  
        <english-title>TIRE VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B60C29/06</main-classification>  
        <further-classification edition="200601120241125B">B60C23/04</further-classification>  
        <further-classification edition="200601120241125B">F16K15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿米瑟工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE LEGION ENGINEERING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫　韋恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, WAYNE-IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種輪胎氣嘴，包括：一管件，包括一內面、一內部通道及一第一螺紋，該內部通道由該內面所界定；一閥組，包括一密封部，可活動地插設於該內部通道，可作動使得該密封部抵接於該內面而阻斷該內部通道、或使得該密封部不抵接於該內面而不阻斷該內部通道；及一套件，包括一接口及一第二螺紋，該第二螺紋螺鎖於該第一螺紋，該套件供迫抵於一輪框以將該輪胎氣嘴固緊至該輪框，該接口連通該內部通道，該接口供一充放氣裝置可拆卸地組接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tire valve is provided, wherein the tire valve includes: a tubular member including an inner surface, an internal channel and a first threaded portion, the internal channel being defined by the inner surface; a valve assembly including a sealing portion, movably inserted in the internal channel, and being operable to drive the sealing portion to engage with the inner surface to block the internal channel or disengage from the inner surface to unblock the internal channel; and a sleeve member including a connection opening and a second threaded portion, the second threaded portion being screwed to the first threaded portion, the sleeve member being configured to urge and secure the tire valve to a rim, the connection opening being in communication with the internal channel and configured for an inflation and deflation device to be detachably assembled thereto.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:輪胎氣嘴</p>  
        <p type="p">10:管件</p>  
        <p type="p">14:大徑管段</p>  
        <p type="p">16:端蓋</p>  
        <p type="p">30:套件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="469" publication-number="202621274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250509B">H10D30/47</main-classification>  
        <further-classification edition="202501120250509B">H10D62/10</further-classification>  
        <further-classification edition="202501120250509B">H10D62/53</further-classification>  
        <further-classification edition="202501120250509B">H10D62/80</further-classification>  
        <further-classification edition="202501120250509B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉伯淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIANG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括基底、導電層以及半導體元件。基底包括第一表面、與第一表面相對的第二表面、從第一表面往第二表面延伸的至少一絕緣空腔以及貫穿基底的貫孔。導電層填入貫孔內。半導體元件配置在第二表面上，且半導體元件與導電層電性連接，其中至少一絕緣空腔對應於半導體元件分佈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure including a substrate, a conductive layer and a semiconductor device is provided. The substrate includes a first surface, a second surface opposite to the first surface, at least one insulating vacancy extending from the first surface toward the second surface, and a through hole passing through the substrate. The conductive layer fills in the through hole. The semiconductor device is disposed on the second surface and electrically connected to the conductive layer, wherein the at least one insulating vacancy is distributed corresponding to the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">100A’:第一表面</p>  
        <p type="p">100B:第二表面</p>  
        <p type="p">102:半導體元件</p>  
        <p type="p">102G:閘極</p>  
        <p type="p">102GC:閘極接觸導體</p>  
        <p type="p">102GI:閘絕緣層</p>  
        <p type="p">102S:源極</p>  
        <p type="p">102SC:源極接觸導體</p>  
        <p type="p">102D:汲極</p>  
        <p type="p">102DC:汲極接觸導體</p>  
        <p type="p">102C:通道層</p>  
        <p type="p">104:接合介電層</p>  
        <p type="p">110:緩衝化合物半導體層</p>  
        <p type="p">112:保護層</p>  
        <p type="p">114:襯層</p>  
        <p type="p">116:晶種層</p>  
        <p type="p">120:導電層</p>  
        <p type="p">122:支撐基底</p>  
        <p type="p">C:絕緣空腔</p>  
        <p type="p">CP:接觸插塞</p>  
        <p type="p">TH:貫孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="470" publication-number="202621102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像處理系統</chinese-title>  
        <english-title>IMAGE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04N1/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東友科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琳瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LIN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種影像處理系統，其藉由可攜式通訊裝置中之影像處理模組執行一通訊連接功能，以將本地端或遠端的影像擷取設備、列印設備及可攜式通訊裝置相互通訊連接，以作為一虛擬多功能事務機使用，藉此可不受空間限制地達到多功能事務機便利性的優點，簡化使用者的操作作業，且使用者可利用可攜式通訊裝置提供之使用者介面直接操作列印作業，達到更具靈活性與便利性之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image processing system executes a communication connecting function through an image processing module in a portable communication device. Consequently, image capturing devices, and printing devices in the local side or the remote side and the portable communication device are in communication with each other and collaboratively served as a virtual multi-function printer. This image processing system provides the convenience of using the multi-function printer without spatial limitations and simplifies associated operations. Furthermore, users can directly operate printing tasks through a user interface provided by the portable communication device. Consequently, flexibility and convenience of performing the printing tasks will be enhanced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:影像處理系統</p>  
        <p type="p">2:伺服器</p>  
        <p type="p">21:處理器</p>  
        <p type="p">22:儲存單元</p>  
        <p type="p">23:通訊單元</p>  
        <p type="p">24:編輯模組</p>  
        <p type="p">3:影像擷取設備</p>  
        <p type="p">31:處理器</p>  
        <p type="p">32:掃描單元</p>  
        <p type="p">33:通訊單元</p>  
        <p type="p">4:列印設備</p>  
        <p type="p">41:處理器</p>  
        <p type="p">42:列印單元</p>  
        <p type="p">43:通訊單元</p>  
        <p type="p">5:可攜式通訊裝置</p>  
        <p type="p">51:處理器</p>  
        <p type="p">52:通訊單元</p>  
        <p type="p">6:影像處理模組</p>  
        <p type="p">7:使用者介面</p>  
        <p type="p">8:儲存裝置</p>  
        <p type="p">81:處理器</p>  
        <p type="p">82:儲存單元</p>  
        <p type="p">83:通訊單元</p>  
        <p type="p">W:網域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="471" publication-number="202620916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插片式繼電器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H01H45/14</main-classification>  
        <further-classification edition="200601220241204B">H01H49/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松川精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳頌仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種插片式繼電器，包含：一底座；一外蓋，係罩蓋該底座而形成一容置空間；一線輪，靠設於該底座並具有一容置槽及複數個線輪端子，該等線輪端子係部分穿設該底座；一鐵心，設於該容置槽；一漆包線，係纏繞於該線輪外表面，該漆包線與該等線輪端子電性連接；一支架，設於該線輪一側；一磁極，係為L型片體，具有一第一段部與一第二段部，其中該第一段部設於該鐵心一側，該第二段部開設有一開孔；一彈簧片，具有一彎折段與一卡固段，該彎折段係穿設該開孔而靠抵該磁極，該卡固段係卡固於該支架；其中該等線輪端子通電後該磁極之該第一段部受磁吸靠抵於該鐵心，並於該線輪端子斷電後該磁極之該第一段部受該彈簧片之彈力復歸原位，而使該磁極相對該支架為樞轉擺動；一插片，係固接於該磁極之該第二段部；一共用端子，設於該容置空間內；一中彈片，一端與該共用端子固接，另一端係受該插片活動靠抵穿設；其中該中彈片具有二活動接點；及二常開端子，係固定且穿設於該底座，該常開端子分別具有一固定接點，且該等固定接點係對應該等活動接點位置設置。據此，利用在同個線路上兩組開合結構實現兩倍導通間距以提高在高壓或惡劣環境適用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:底座</p>  
        <p type="p">11:外蓋</p>  
        <p type="p">12:線輪</p>  
        <p type="p">122:線輪端子</p>  
        <p type="p">13:鐵心</p>  
        <p type="p">14:漆包線</p>  
        <p type="p">15:支架</p>  
        <p type="p">16:磁極</p>  
        <p type="p">161:第一段部</p>  
        <p type="p">162:第二段部</p>  
        <p type="p">1621:開孔</p>  
        <p type="p">17:彈簧片</p>  
        <p type="p">171:彎折段</p>  
        <p type="p">18:插片</p>  
        <p type="p">19:共用端子</p>  
        <p type="p">192:第二側面</p>  
        <p type="p">20:中彈片</p>  
        <p type="p">201:活動接點</p>  
        <p type="p">21:常開端子</p>  
        <p type="p">22:安裝部</p>  
        <p type="p">221:安裝槽</p>  
        <p type="p">222:門框結構</p>  
        <p type="p">23:接點板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="472" publication-number="202620889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>居家照護自動化服藥監測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">G16H20/10</main-classification>  
        <further-classification edition="201801120250303B">G16H40/67</further-classification>  
        <further-classification edition="201801120250303B">G16H40/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚學校財團法人長庚科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱小鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祐民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王靖宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種居家照護自動化服藥監測系統，包括一使用者資料庫、一臉部識別單元、至少一智慧型給藥單元及一肢體動作辨識單元。其中該使用者資料庫儲放至少一照護人員及複數個被照護人員的資訊，依據一處方箋完成對應的用藥指引資料，透過該臉部辨識單元辨識一操作人員的臉部資料以確認其身份而進入設定模式或給藥模式，操作模式供根據該處方箋裝填個別藥物，給藥模式供用藥指引資料輸出藥物及提示如何食用，最後透過該肢體動作辨識單元分析該被照護人員是否正確且有效地服用，並將其食用狀況記錄下來以確認其用藥時間及狀況而便於追蹤藥效者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:居家照護自動化服藥監測系統</p>  
        <p type="p">11:使用者資料庫</p>  
        <p type="p">12:臉部識別單元</p>  
        <p type="p">13:智慧型給藥單元</p>  
        <p type="p">131:儲藥容器</p>  
        <p type="p">1311:分隔空間</p>  
        <p type="p">132:給藥機構</p>  
        <p type="p">133:提示模組</p>  
        <p type="p">134:條碼辨識單元</p>  
        <p type="p">135:用藥指示條碼</p>  
        <p type="p">136:藥品辨識單元</p>  
        <p type="p">137:手動輸入及列印模組</p>  
        <p type="p">14:肢體動作辨識單元</p>  
        <p type="p">141:動作資料庫</p>  
        <p type="p">142:攝影鏡頭</p>  
        <p type="p">USER1:照護人員</p>  
        <p type="p">USER2:被照護人員</p>  
        <p type="p">MODE1:操作模式</p>  
        <p type="p">MODE2:給藥模式</p>  
        <p type="p">N1:處方箋</p>  
        <p type="p">N2:用藥指引資料</p>  
        <p type="p">N3:二維條碼資訊</p>  
        <p type="p">N4:動作資料</p>  
        <p type="p">N5:動作代碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="473" publication-number="202619694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放射遠紅外線的發熱裝置</chinese-title>  
        <english-title>A WARMING DEVICE FOR RADIATING FAR INFRARED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61F7/12</main-classification>  
        <further-classification edition="200601120241130B">A61F7/00</further-classification>  
        <further-classification edition="200601120241130B">A61N5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友睦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>H &amp; H-T CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡泉凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHUAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡泉凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHUAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易定芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明放射遠紅外線的發熱裝置，包含：物件、放射膜與拋棄式發熱件，物件的物件主體連接物件的可撓物體，使得物件主體與可撓物體之間形成有縫隙空間與相鄰縫隙空間的側邊縫隙，放射膜具有透明層與石墨層來被連接在物件主體的外露開口，拋棄式發熱件具有透氣袋與發熱材，發熱材能接觸空氣後產生熱能，其中，物件主體與可撓物體兩者的中央區域能分開，使得側邊縫隙被改變成側邊開口，拋棄式發熱件能從側邊開口放入或移出縫隙空間來被更換，藉此，石墨層在接收熱能後，遠紅外線將被石墨層產生而穿透透明層，使得發熱裝置能持續發熱來給使用者使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a warming device comprising an object, a radiation film, and a disposable warmer pad. The object includes a main body and a flexible body connected to the main body, so that a slit space and a side slit adjacent to the slit space are formed between the main body and the flexible body. The radiation film comprises a transparent layer and a graphite layer, and the radiation film is connected to an exposed opening on the main body. The disposable warmer pad comprises a ventilation bag and a warming material. The warming material is capable of generating a thermal energy when the warming material is in contact with the air. When the main body and the flexible body are partially separated from each other, the side slit is changed into a side opening. The disposable warmer pad can be replaced by being put into the slit space or taken out from the slit space. Therefore, when the graphite layer receives the thermal energy, far infrared radiation will be generated by the graphite layer and penetrate the transparent layer, making the warming device keep providing warmth to the users.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發熱裝置</p>  
        <p type="p">10:物件</p>  
        <p type="p">11:物件主體</p>  
        <p type="p">12:可撓物體</p>  
        <p type="p">123:開孔</p>  
        <p type="p">124:外緣</p>  
        <p type="p">14:外露開口</p>  
        <p type="p">15:側邊</p>  
        <p type="p">16:縫隙空間</p>  
        <p type="p">17:側邊縫隙</p>  
        <p type="p">19:側邊開口</p>  
        <p type="p">20:放射膜</p>  
        <p type="p">30:拋棄式發熱件</p>  
        <p type="p">31:透氣袋</p>  
        <p type="p">32:發熱材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="474" publication-number="202619851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棘輪起子</chinese-title>  
        <english-title>RATCHET DRIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">B25B15/04</main-classification>  
        <further-classification edition="200601120250116B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特典工具股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAM TOOLS CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江水來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, SHUI-LAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種棘輪起子，其包括：一握持單元、一驅動桿、一旋轉件、一定位組件及一棘輪機構。該握持單元包含有相連接之一握部與一基座。該驅動桿可相對轉動地設於該基座。該旋轉件沿該軸向組設於該基座且可以該驅動桿為軸相對轉動，於面向該驅動桿之內面沿該周向設有呈間隔配置之一第一定位孔、二第二定位孔與二推抵部，該第一定位孔位於二該第二定位孔之間。該定位組件設於該驅動桿可沿該徑向嵌入該第一定位孔與二該第二定位孔其中一者。該棘輪機構包含有一棘齒環與二卡掣組件，該棘齒環環設於該基座，該二卡掣組件設於該驅動桿而可選擇性地卡抵於該棘齒環，各該卡掣組件包含有一致動部、一卡齒部、一彈簧與一底座，該致動部與該卡齒部連接成一體，該致動部之部分係位於該推抵部之移動路徑上，該卡齒部、該彈簧與該底座呈直線配置，該卡齒部之背向該底座之一側設有複數凸齒，該彈簧彈抵於該卡齒部與該底座之間，以令該複數凸齒常態地具有與該棘齒環相嚙合之趨勢，該底座滑靠於該棘齒環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a ratchet screwdriver, which includes: a holding unit, a driving rod, a rotating part, a positioning component and a ratchet mechanism. The holding unit includes a connected holding portion and a base. The driving rod is rotatably mounted on the base. The rotary member is assembled on the base along the axial direction and can rotate relative to the driving rod as an axis. A first positioning hole, two second positioning holes and a second positioning hole are arranged at intervals along the circumferential direction on the inner surface facing the driving rod. Two pushing parts, the first positioning hole is located between the two second positioning holes. The positioning component is provided on the driving rod and can be inserted into one of the first positioning hole and the second positioning hole along the radial direction. The ratchet mechanism includes a ratchet ring and two catch components. The ratchet ring is provided on the base. The two catch components are provided on the drive rod and can selectively engage with the ratchet ring. The latch component includes an actuating part, a latch part, a spring and a base. The actuating part is integrally connected with the latch part. Part of the actuating part is located on the moving path of the pushing part. The latching tooth portion, the spring and the base are arranged in a straight line. A plurality of convex teeth are provided on a side of the latching tooth portion facing away from the base. The spring springs against the space between the latching tooth portion and the base. The plurality of convex teeth normally have a tendency to mesh with the ratchet ring, and the base slides against the ratchet ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:握部</p>  
        <p type="p">12:基座</p>  
        <p type="p">13:螺栓</p>  
        <p type="p">24:第一容置槽</p>  
        <p type="p">25:第二容置槽</p>  
        <p type="p">3:旋轉件</p>  
        <p type="p">34:凹凸結構</p>  
        <p type="p">4:定位組件</p>  
        <p type="p">41:彈性體</p>  
        <p type="p">42:定位件</p>  
        <p type="p">51:棘齒環</p>  
        <p type="p">52:卡掣組件</p>  
        <p type="p">53:致動部</p>  
        <p type="p">541:凸齒</p>  
        <p type="p">56:彈簧</p>  
        <p type="p">57:底座</p>  
        <p type="p">58:導引壁</p>  
        <p type="p">6:容置槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="475" publication-number="202619941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>飛行裝置及其控制方法</chinese-title>  
        <english-title>FLYING APPARATUS AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241230B">B64C39/02</main-classification>  
        <further-classification edition="200601120241230B">B64C17/00</further-classification>  
        <further-classification edition="202301120241230B">B64U20/80</further-classification>  
        <further-classification edition="202301320241230B">B64U101/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅兆呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫逸倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, YI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種飛行裝置及其控制方法。該裝置取得於一時間區間中量測的複數個磁場數據。該裝置基於該些磁場數據，計算複數個朝向方位。該裝置基於對應該時間區間的複數個位移紀錄，計算複數個位移方位。該裝置比對該些朝向方位以及該些位移方位，判斷該飛行裝置於該時間區間是否受到一磁干擾。響應於判斷該飛行裝置受到該磁干擾，該裝置執行一迴避運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flying apparatus and control method thereof are provided. The flying apparatus obtains magnetic field data measured in a time interval. The flying apparatus calculates orientations based on the magnetic field data. The flying apparatus calculates speed vectors based on path records corresponding to the time interval. The flying apparatus compares the orientations and the speed vectors to determine whether the flying apparatus is subject to magnetic interference in the tine interval. In response to determining that the flying apparatus is subject to magnetic interference, the flying apparatus executes an avoidance operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:飛行裝置控制方法</p>  
        <p type="p">S201~S205:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="476" publication-number="202619812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋰電池組拆卸設備</chinese-title>  
        <english-title>LITHIUM BATTERY PACK DISASSEMBLING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241127B">B09B3/30</main-classification>  
        <further-classification edition="202201320241127B">B09B101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺南大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF TAINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何麗貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HER, LI-JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提出一種鋰電池組拆卸設備，其用以拆卸一電池組，電池組包含複數鋰電池及兩電池套，兩電池套分別連接於該等鋰電池的兩端。本創作的鋰電池組拆卸設備包含一電池架及至少一拆卸裝置。電池架用以設置電池組。拆卸裝置設置於電池架旁，其包含一夾爪組件及一移動器。夾爪組件能夾持電池組，夾爪組件連接於移動器，移動器驅動夾爪組件沿拆卸裝置的軸向方向相對電池架移動，藉此將兩電池套互相分離。相較於手工以刀具拆解，本創作能快速且便捷的拆卸電池組，故能提高電池組的回收效率、節省人力、及降低電池組廢棄回收的成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lithium battery pack disassembling apparatus is configured to disassemble a battery pack. The battery pack comprises multiple batteries and two covers, and the two covers are respectively connected to two ends of the batteries. The lithium battery pack disassembling apparatus comprises a battery rack and at least one disassembling device. The battery rack is for implementing the battery pack. The disassembling device is disposed adjacent to the battery rack, and the disassembling device has a claw assembly and a driver. The claw assembly is capable of clamping the battery pack, and the claw assembly is connected to the driver. The driver drives the claw assembly to move along an axial direction with respect to the battery rack, thereby separating the two covers from each other. Compared with disassembling manually with knives, the lithium battery pack disassembling apparatus may disassemble the battery pack rapidly and easily, increasing efficiency of recycling the battery packs, and manpower and a cost of discarding and recycling would be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池架</p>  
        <p type="p">20:拆卸裝置</p>  
        <p type="p">B:電池組</p>  
        <p type="p">B1:鋰電池</p>  
        <p type="p">B2:電池套</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="477" publication-number="202619803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膠槍</chinese-title>  
        <english-title>CAULKING GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">B05C17/005</main-classification>  
        <further-classification edition="200601120241130B">B05C5/00</further-classification>  
        <further-classification edition="200601120241130B">B05C21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翔宣富企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIANG SYUAN FU ENTERPRISE CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHEN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種膠槍，包括：一槍體、一推桿、一帶動件、一壓柄及一樞接機構。該推桿可移動地設於該槍體；該帶動件可活動地設於該槍體中且可帶動該推桿；該壓柄可樞擺地設於該槍體且包括一可與該帶動件相抵接之抵推部；該樞接機構包括一連接該壓柄與該槍體之樞接件及至少一設於該槍體之限位件，該樞接件包括一第一樞部及一第二樞部，該至少一限位件可相對該樞接件調整位置以使該壓柄以該第一樞部及該第二樞部其中一者為一樞擺中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A caulking gun is provided, including: a gun body, a push rod, a driving member, a lever and a pivot mechanism. The push rod is movably disposed on the gun body, and the driving member is movably disposed on the gun body and drives the push rod to move. The lever is swingably disposed on the gun body and includes an abutting portion which is abuttable against the driving member. The pivot mechanism includes a pivoting member connected with the lever and the gun body and at least one restricting member disposed on the gun body. The pivoting member includes a first pivoting portion and a second pivoting portion, and a position of the at least one restricting member is adjustable relative to the pivoting member so that one of the first pivoting portion and the second pivoting portion is served as a pivot axis and the lever is pivotable about the pivot axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:推桿</p>  
        <p type="p">30:帶動件</p>  
        <p type="p">40:壓柄</p>  
        <p type="p">41:抵推部</p>  
        <p type="p">50:樞接機構</p>  
        <p type="p">51:樞接件</p>  
        <p type="p">52:限位件</p>  
        <p type="p">C:樞擺中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="478" publication-number="202619866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>護理機器人</chinese-title>  
        <english-title>NURSE ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">B25J11/00</main-classification>  
        <further-classification edition="200601120250117B">B25J19/00</further-classification>  
        <further-classification edition="200601120250117B">B25J19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>疆域醫創科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛英瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, YING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林聯宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐英嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為護理機器人，包含頭部、軀體、手臂及底座，其中頭部包含螢幕及相機，可以螢幕上的操作介面與護理師互動，相機則可以進行人臉辨識或物件辨識，其中手臂具有七個自由度，可以完成物件夾取、餐盤托送、門把開關，其中軀體具有收納空間可以收納多種醫療物資，底座則包含多個感測模組，可以順暢的在醫院內移動，本發明之護理機器人可與護理人員協作，節省護理人員的體力及時間，減輕重複性高且單調的工作內容，使護理人員可以騰出更多時間關懷患者健康，解決醫護人力稀缺之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nurse robot comprises a head, a body, an arm, and a base, designed to assist nurses in routine tasks. The head comprises a screen and a camera, wherein the screen displays a user interface enabling human-computer interaction, and the camera supports facial recognition and object detection. The arm, with seven degrees of freedom, is configured to pick objects, hold trays, and open doors. The body comprises an accommodation space for medical supplies. The base comprises a plurality of sensor modules, allowing smooth navigation within the hospital. The nurse robot is designed to assist nurses with routine tasks, reducing physical strain and time demands. This enables nursing staff to dedicate more attention to patient care and solve the issue of medical workforce shortages.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:護理機器人</p>  
        <p type="p">2:軀體</p>  
        <p type="p">21:本體</p>  
        <p type="p">211:抽頭</p>  
        <p type="p">212:NFC感應部</p>  
        <p type="p">22:升降部</p>  
        <p type="p">23:頸部</p>  
        <p type="p">3:頭部</p>  
        <p type="p">30:頭部殼體</p>  
        <p type="p">31:螢幕</p>  
        <p type="p">33:相機單元</p>  
        <p type="p">4:底座</p>  
        <p type="p">40:底座殼體</p>  
        <p type="p">41:驅動模組</p>  
        <p type="p">42:秤重單元</p>  
        <p type="p">44:紅外線感測模組</p>  
        <p type="p">45:超音波感測模組</p>  
        <p type="p">46:深度感測模組</p>  
        <p type="p">47:光達感測模組</p>  
        <p type="p">5:手臂</p>  
        <p type="p">51:上手臂</p>  
        <p type="p">511:上短臂</p>  
        <p type="p">512:上長臂</p>  
        <p type="p">52:手肘</p>  
        <p type="p">521:第一中臂</p>  
        <p type="p">522:第二中臂</p>  
        <p type="p">523:第一中轉軸</p>  
        <p type="p">524:第二中轉軸</p>  
        <p type="p">525:第三中轉軸</p>  
        <p type="p">53:下手臂</p>  
        <p type="p">531:下長臂</p>  
        <p type="p">532:下短臂</p>  
        <p type="p">533:配件接口</p>  
        <p type="p">534:手部深度感測模組</p>  
        <p type="p">54:配件</p>  
        <p type="p">541:觸覺感測器</p>  
        <p type="p">6:箱體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="479" publication-number="202620658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速切埠方法及切換器</chinese-title>  
        <english-title>METHEOD FOR QUICKLY SWITCHING PORT AND SWITCHING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">G06F13/38</main-classification>  
        <further-classification edition="200601120250207B">G06F13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏正自動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATEN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAN-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林礽俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於切換器的快速切埠方法，其中，切換器電性連接於第一影像源、第二影像源以及顯示器，第一影像源以及第二影像源支援一數位影像協定，該方法包括：透過該切換器輸出該第一影像源的影像訊號給該顯示器，當該切換器接收一切換訊號以切換選擇輸出該第二影像源的影像訊號給該顯示器時，該切換器向該第二影像源詢問關於該數位影像協定的版本資訊，而且不向該顯示器詢問延伸顯示識別資訊，然後，再透過該切換器將該版本資訊傳給該顯示器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for quickly switching ports applied in a switch electrically coupled to a first image source, a second image source and a display, wherein the first image source and the second image source respectively support a digital image communication protocol. The method comprises steps of: outputting an image signal of the first image source to the display through the switch; selectively switching and outputting an image signal of the second image source to the display when the switch receives a switching signal; inquiring the second image source about a version information with respect to the digital image communication protocol without inquiring the display about an Extended Display Identification Data (EDID) through the switch; and finally, transmitting the version information to the display through the switch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:快速切埠方法</p>  
        <p type="p">20~22:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="480" publication-number="202620328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143446</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式固定裝置</chinese-title>  
        <english-title>ADJUSTABLE FIXING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">F16M11/04</main-classification>  
        <further-classification edition="200601120250324B">F16M11/26</further-classification>  
        <further-classification edition="200601120250324B">H05K7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美國商百應股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALYX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　秉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, BENSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許祐誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種可調式固定裝置，包括固定座和調節組件。該固定座包括主體平台、設置於主體平台上的夾持結構，以及設置於主體平台上的多個固定孔。該調節組件包括底板、伸縮桿和轉動部，其中底板一側透過固定孔與固定座的主體平台連接，伸縮桿的一端與底板的另一側連接，轉動部則設置於伸縮桿的另一端。該夾持結構包括U型支架、安裝於U型支架上的緊固螺栓，以及設置於U型支架上的壓力感測器。本發明具有結構簡單、安裝便利、操作容易等優點，並透過感測器及控制模組提供即時監控功能，可廣泛應用於各種固定需求場合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an adjustable fixing device, comprising a mounting base and an adjusting assembly. The mounting base includes a main platform, a clamping structure arranged on the main platform, and multiple fixing holes on the main platform. The adjusting assembly includes a base plate, a telescopic rod, and a rotating part, wherein one side of the base plate connects to the main platform through the fixing holes, one end of the telescopic rod connects to the other side of the base plate, and the rotating part is arranged on the other end of the telescopic rod. The clamping structure includes a U-shaped bracket, a fastening bolt installed on the U-shaped bracket, and a pressure sensor arranged on the U-shaped bracket. The invention features simple structure, easy installation, convenient operation, and provides real-time monitoring via sensors and control modules, suitable for various fixing applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可調式固定裝置</p>  
        <p type="p">10:固定座</p>  
        <p type="p">11:主體平台</p>  
        <p type="p">12:U型支架</p>  
        <p type="p">13:緊固螺栓</p>  
        <p type="p">14:固定孔</p>  
        <p type="p">15:固定件</p>  
        <p type="p">20:調節組件</p>  
        <p type="p">21:底板</p>  
        <p type="p">22:伸縮桿</p>  
        <p type="p">221:外管</p>  
        <p type="p">222:內管</p>  
        <p type="p">223:鎖固件</p>  
        <p type="p">23:轉動部</p>  
        <p type="p">C:夾持結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="481" publication-number="202620518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G02F1/133</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘泰吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, TAI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡永富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種顯示裝置，包含：一顯示面板，包含：一第一基板；一第二基板，與該第一基板相對設置；以及一光調控元件，設置於該第一基板與該第二基板之間；一背光模組，與該顯示面板相對設置，其中，該背光模組包含至少一光學膜片；以及一支撐板，設置於該顯示面板與該背光模組之間；其中，該第一基板具有一第一厚度，該第二基板具有一第二厚度，該支撐板具有一第三厚度，且該第三厚度大於或等於該第一厚度與該第二厚度的總和。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device is provided, which comprises: a display panel comprising: a first substrate; a second substrate disposed opposite to the first substrate; and a light modulation element disposed between the first substrate and the second substrate; a backlight module disposed opposite to the display panel, wherein the backlight module comprises at least one optical film; and a support plate disposed between the display panel and the backlight module; wherein the first substrate has a first thickness, the second substrate has a second thickness, the support plate has a third thickness, and the third thickness is greater than or equal to a sum of the first thickness and the second thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示面板</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">11s1、12s1:上表面</p>  
        <p type="p">11s2、12s2:下表面</p>  
        <p type="p">13:光調控元件</p>  
        <p type="p">14:框膠</p>  
        <p type="p">15:第一偏光片</p>  
        <p type="p">16:第二偏光片</p>  
        <p type="p">2:背光模組</p>  
        <p type="p">3:支撐板</p>  
        <p type="p">3s1:上表面</p>  
        <p type="p">3s2:下表面</p>  
        <p type="p">4:黏著元件</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p>  
        <p type="p">T3:第三厚度</p>  
        <p type="p">X、Y:方向</p>  
        <p type="p">Z:俯視方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="482" publication-number="202620523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G02F1/13357</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許瑋宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含：一背光模組，包含：一導光板；多個光源，鄰近該導光板的一入光側且沿一第一方向排列；一第一光學元件，設置於該導光板上且具有多個第一稜鏡結構；其中，該些第一稜鏡結構中的至少一者沿該第一方向延伸，且該些第一稜鏡結構朝向該導光板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which comprises: a backlight module comprising: a light guide plate; a plurality of light sources disposed adjacent to a light incident side of the light guide plate and arranged along a first direction; a first optical element disposed on the light guide plate and having a plurality of first prism structures; wherein at least one of the plurality of first prism structures extends along the first direction, and the plurality of the prism structures face the light guide plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導光板</p>  
        <p type="p">1s1:入光側</p>  
        <p type="p">11:網點結構</p>  
        <p type="p">2:光源</p>  
        <p type="p">3:第一光學元件</p>  
        <p type="p">31:第一稜鏡結構</p>  
        <p type="p">32:基材</p>  
        <p type="p">4:第二光學元件</p>  
        <p type="p">41:第二稜鏡結構</p>  
        <p type="p">42:基材</p>  
        <p type="p">5:第三光學元件</p>  
        <p type="p">51:第三稜鏡結構</p>  
        <p type="p">52:基材</p>  
        <p type="p">6:功能層</p>  
        <p type="p">7:反射元件</p>  
        <p type="p">θ2:第二頂角</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第一方向</p>  
        <p type="p">Z:法線方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="483" publication-number="202621525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝元件及其製造方法</chinese-title>  
        <english-title>PACKAGING COMPONENT AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉樹橿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHU-JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝元件，包括一基板、一第一線路結構、一第二線路結構、一貫孔、一金屬層及一封裝層。基板包括一第一面、一第二面及一預留區，第一面相對於第二面。第一線路結構設置於第一面且圍繞預留區而形成一第一開口。第二線路結構設置於第二面且圍繞預留區而形成一第二開口。貫孔設置於預留區。金屬層設置於第一開口及第二開口且填充於貫孔。金屬層連接第一線路結構及第二線路結構，而使第一線路結構電性連接於第二線路結構。封裝層設置於第一開口及第二開口且覆蓋金屬層。此外，製造此封裝元件的方法亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging component including a substrate, a first circuit structure, a second circuit structure, a via, a metal layer and a packaging layer is provided. The substrate includes a first surface, a second surface and a reserved area. The first surface is opposite to the second surface. The first circuit structure is disposed on the first surface and surrounds the reserved area to form a first opening. The second circuit structure is disposed on the second surface and surrounds the reserved area to form a second opening. The via is provided in the reserved area. The metal layer is disposed on the first opening and the second opening and fills the via. The metal layer connects the first circuit structure and the second circuit structure, so that the first circuit structure is electrically connected to the second circuit structure. The packaging layer is disposed on the first opening and the second opening and covers the metal layer. In addition, a method of manufacturing the packaging component is also mentioned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D2:寬度</p>  
        <p type="p">D3、D4:距離</p>  
        <p type="p">H1:厚度</p>  
        <p type="p">H2:深度</p>  
        <p type="p">H3、H4:間隙</p>  
        <p type="p">P2:第二連接開口</p>  
        <p type="p">P4:第四連接開口</p>  
        <p type="p">100:封裝元件</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:第一面</p>  
        <p type="p">112:第二面</p>  
        <p type="p">113:預留區</p>  
        <p type="p">120:第一線路結構</p>  
        <p type="p">121:第一開口</p>  
        <p type="p">122:第一重佈線層</p>  
        <p type="p">1221、1321:側邊</p>  
        <p type="p">1224、1324:表面</p>  
        <p type="p">126、136:頂表面</p>  
        <p type="p">130:第二線路結構</p>  
        <p type="p">131:第二開口</p>  
        <p type="p">132:第三重佈線層</p>  
        <p type="p">140:貫孔</p>  
        <p type="p">141、142:邊緣</p>  
        <p type="p">150:金屬層</p>  
        <p type="p">151:上表面</p>  
        <p type="p">152:下表面</p>  
        <p type="p">180:封裝層</p>  
        <p type="p">181、182:外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="484" publication-number="202620310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樞軸模組及電子裝置</chinese-title>  
        <english-title>PIVOT MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16C11/04</main-classification>  
        <further-classification edition="200601120241230B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇峰正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, FENGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樞軸模組。樞軸模組包括主軸體、主連接件、滑動件及活動件。主軸體包括第一連動部。主連接件可樞轉地設置於主軸體，且包括滑槽。滑動件可動地連接於主軸體及主連接件，且包括第二連動部及第一從動部，第二連動部接觸主軸體的第一連動部。活動件包括第二從動部，第二從動部穿設於滑槽且接觸於第一從動部。主連接件適於相對於主軸體轉動並帶動滑動件於主軸體上移動，使第一從動部驅動活動件相對於主軸體作動。此外，一種電子裝置亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pivot module including a main shaft, a main connecting member, a sliding member and a movable member is provided. The main shaft includes a first linkage part. The main connecting member is pivotally disposed to the main shaft, and includes a groove. The sliding member is movably connected to the main shaft and the main connecting member, and includes a second linkage part and a first driven part, the second linkage part contacts the first linkage part of the main shaft. The movable member includes a second driven part inserted through the groove and in contact with the first driven part. The main connecting member is adapted to rotate relative to the main shaft and drive the sliding member to move on the main shaft, so that the first driven part drives the movable member to move relative to the main shaft. In addition, an electronic device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E1:第一端</p>  
        <p type="p">E3:第三端</p>  
        <p type="p">E6:端</p>  
        <p type="p">L1:轉動軸線</p>  
        <p type="p">L2:延伸線</p>  
        <p type="p">M1:第一狀態</p>  
        <p type="p">X-Y-Z:直角座標</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">120:第二機體</p>  
        <p type="p">121:滑槽</p>  
        <p type="p">123:第一部分</p>  
        <p type="p">124:第二部分</p>  
        <p type="p">200:樞軸模組</p>  
        <p type="p">210:主軸體</p>  
        <p type="p">211:第一連動部</p>  
        <p type="p">212:底面</p>  
        <p type="p">213:頂面</p>  
        <p type="p">216:主軸</p>  
        <p type="p">217:板體</p>  
        <p type="p">220:主連接件</p>  
        <p type="p">221:滑槽</p>  
        <p type="p">225:連接槽</p>  
        <p type="p">230:滑動件</p>  
        <p type="p">231:第二連動部</p>  
        <p type="p">232:第一從動部</p>  
        <p type="p">233:滑動主體</p>  
        <p type="p">234:凸起</p>  
        <p type="p">235:斜面</p>  
        <p type="p">240:活動件</p>  
        <p type="p">241:第二從動部</p>  
        <p type="p">242:第三從動部</p>  
        <p type="p">243:活動主體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="485" publication-number="202620556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手錶單手操作系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">G04B47/00</main-classification>  
        <further-classification edition="201001120250117B">G04G21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行空科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKIWALK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張天僑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TIEN-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種手錶單手操作系統，包含有一智慧手錶、一多軸感測器、一光學感測器及一處理單元，該智慧手錶包含一操作單元，可於該智慧手錶之螢幕顯示一時間畫面及一選單畫面，該智慧手錶之錶體一側並設有一透光部，該多軸感測器係設置於錶體內，用以偵測手指捏合、放開之動作產生的震動波，該光學感測器係設置於錶體內並對應透光部，用以偵測手指捏合、放開及手臂移動之過程中光線之變化，該處理單元係電性連接該多軸感測器、光學感測器，係可接收多軸感測器與光學感測器之偵測訊號，以計算不同手勢動作之震動波及光強度資訊，並可透過震動波及光強度資訊辨識手指及手臂之動作為手指之捏合、放開或手臂之移動，進而可使該操作單元進入解鎖、鎖定或可被點擊啟動之狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:智慧手錶</p>  
        <p type="p">12:多軸感測器</p>  
        <p type="p">14:光學感測器</p>  
        <p type="p">16:處理單元</p>  
        <p type="p">3:操作單元</p>  
        <p type="p">4:中控單元</p>  
        <p type="p">5:時間畫面</p>  
        <p type="p">6:選單畫面</p>  
        <p type="p">7:功能圖塊</p>  
        <p type="p">24:運算模組</p>  
        <p type="p">26:控制模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="486" publication-number="202620749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳權交易支援系統</chinese-title>  
        <english-title>CARBON CREDIT TRADE SUPPORT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241230B">G06Q30/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞福儲能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APH EPOWER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍翊家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, YI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃一耘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇修賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種碳權交易支援系統。碳權交易決策支援模組依據碳權購買需求數據、碳權出售數據以及多個碳權交易平台的碳權交易數據計算交易需求匹配度，依據預設匹配度、交易需求匹配度、碳權購買需求數據以及碳權出售數據提供碳權交易合約，依據上述多個碳權交易平台的碳權交易數據計算碳權預測價格，並依據碳權預測價格提供交易決策建議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A carbon credit trade support system is provided. A carbon credit trading decision support module calculates a matching degree of transaction demand based on carbon credit purchase demand data, carbon credit sale data, and carbon credit trading data from multiple carbon credit trading platforms, provides a carbon credit trading contract based on a preset matching degree, the matching degree of transaction demand, the carbon credit purchase demand data, and the carbon credit sale data, calculates a predicted carbon credit price based on the carbon credit trading data from the multiple carbon credit trading platforms, and provides a trading decision suggestion based on the predicted carbon credit price.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:碳權交易支援系統</p>  
        <p type="p">102:碳權交易決策支援模組</p>  
        <p type="p">104:資料庫</p>  
        <p type="p">106:使用者介面單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="487" publication-number="202619777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>去除過濾器中的氣泡的方法</chinese-title>  
        <english-title>METHOD OF REMOVING BUBBLES IN FILTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">B01D19/02</main-classification>  
        <further-classification edition="200601120241127B">B01D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉嘉緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHIA WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹紘睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, HUNG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">去除過濾器中的氣泡的方法包括以下步驟。提供化學液供應系統，化學液供應系統包括過濾器及除泡裝置，其中過濾器包括濾芯，除泡裝置包括氣液分離槽。執行化學液補充製程，以將化學液通過過濾器進料到氣液分離槽中，直到化學液在氣液分離槽中達到預定液位。執行第一側除泡製程，使化學液自氣液分離槽沿第一循環路徑循環地流動，以去除濾芯的第一側的氣泡。執行第二側除泡製程，使化學液自氣液分離槽沿第二循環路徑循環地流動，以去除濾芯的第二側的氣泡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of removing bubbles in a filter includes following steps. A chemical solution supply system is provided. The chemical solution supply system includes a filter and a bubble removing device. The filter includes a filter element. The bubble removing device includes a gas-liquid separation tank. A chemical solution supply process is performed to feed a chemical solution to the gas-liquid separation tank through the filter until the chemical solution reaches a predetermined liquid level in the gas-liquid separation tank. A first bubble removing process is performed to make the chemical solution flow cyclically along a first circulating path to remove bubbles at a first side of the filter element. A second bubble removing process is performed to make the chemical solution flow cyclically along a second circulating path to remove bubbles at a second side of the filter element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:化學液供應系統</p>  
        <p type="p">100:過濾器</p>  
        <p type="p">102:濾芯</p>  
        <p type="p">102a:第一側</p>  
        <p type="p">102b:第二側</p>  
        <p type="p">200:除泡裝置</p>  
        <p type="p">210:氣液分離槽</p>  
        <p type="p">212:液位感測器</p>  
        <p type="p">220:泵浦</p>  
        <p type="p">230:氣泡偵側器</p>  
        <p type="p">E1:入口端</p>  
        <p type="p">E2:出口端</p>  
        <p type="p">E3:第一排放端</p>  
        <p type="p">E4:第二排放端</p>  
        <p type="p">E5:第三排放端</p>  
        <p type="p">H:高液位</p>  
        <p type="p">L:低液位</p>  
        <p type="p">M:中液位</p>  
        <p type="p">S:化學液</p>  
        <p type="p">S’:經過濾的化學液</p>  
        <p type="p">V1:進料閥</p>  
        <p type="p">V2:出料閥</p>  
        <p type="p">V3,V4,V5:排放閥</p>  
        <p type="p">V6,V7:循環入口閥</p>  
        <p type="p">V8,V9:循環出口閥</p>  
        <p type="p">V10:排氣閥</p>  
        <p type="p">W:廢液</p>  
        <p type="p">p1:進料管線</p>  
        <p type="p">p2:出料管線</p>  
        <p type="p">p3,p4,p5,p10:排放管線</p>  
        <p type="p">p6:進料循環管線</p>  
        <p type="p">p7:出料循環管線</p>  
        <p type="p">p8:N&lt;sub&gt;2&lt;/sub&gt;管線</p>  
        <p type="p">p9:排氣管線</p>  
        <p type="p">p61:第一進料循環管線</p>  
        <p type="p">p62:第二進料循環管線</p>  
        <p type="p">p63:第三進料循環管線</p>  
        <p type="p">p71:第一出料循環管線</p>  
        <p type="p">p72:第二出料循環管線</p>  
        <p type="p">p73:第三出料循環管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="488" publication-number="202619856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於安裝密封圈的手工具</chinese-title>  
        <english-title>WATERPROOF RUBBER RING EASY TO APPLY HAND TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B25B27/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建國科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施慧珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岱岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TAI-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種用於安裝密封圈的手工具，包含：二相互樞設連接的臂桿，該二臂桿一端設置一撐開段，另一端結合一握柄，而可通過相對按壓該二握柄，利用槓桿原理使該二臂桿的撐開段張開，該二臂桿的撐開段末端設有一彎弧尖嘴，並在距離該彎弧尖嘴一段距離的位置設有一擋止部；藉此，俾達結構簡單，製造成本低，使用時可輕鬆撐開密封圈進行安裝，以及適用於各種尺寸和材質的密封圈，具有廣泛的應用性和適用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:臂桿</p>  
        <p type="p">11:撐開段</p>  
        <p type="p">111:彎弧尖嘴</p>  
        <p type="p">112:擋止部</p>  
        <p type="p">12:柄桿</p>  
        <p type="p">13:樞接部</p>  
        <p type="p">131:樞接孔</p>  
        <p type="p">14:彎曲段</p>  
        <p type="p">20:握柄</p>  
        <p type="p">21:插孔</p>  
        <p type="p">30:樞軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="489" publication-number="202619877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射出物理發泡內靴及用射出物理發泡製備內靴的方法</chinese-title>  
        <english-title>INJECTION PHYSICAL FOAMING INNER BOOT AND METHOD OF MANUFACTURING INNER BOOT USING INJECTION PHYSICAL FOAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">B29C44/34</main-classification>  
        <further-classification edition="200601120241231B">A43B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豐泰企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG TAY ENTERPRISES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種射出物理發泡內靴包含一鞋形部及一筒身部，該鞋形部包含一前足段及一後足段，前足段的硬度大於後足段的硬度；筒身部自鞋形部之後足段向上延伸，其中鞋形部及筒身部為一體成型，鞋形部與筒身部分別包含一熱塑性材料且不包含一架橋劑及一化學發泡劑，鞋形部與筒身部的比重範圍分別為0.1~0.3g/cm &lt;sup&gt;3&lt;/sup&gt;，且前足段的硬度大於筒身部的硬度，致使鞋形部與筒身部具備輕量化功效，且鞋形部與筒身部均能回收利用，提供環境保護的效益，另一實施例提供用射出物理發泡製備內靴的方法，藉由射出物理發泡方式一次發泡獲得該射出物理發泡內靴，以加快製程效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An injection physical foaming inner boot includes a shoe-shaped portion and a tubular portion. The shoe-shaped portion includes a forefoot section and a hindfoot section, the hardness of the forefoot section is greater than the hardness of the hindfoot section. The tubular portion extends upward from the hindfoot section of the shoe-shaped portion, wherein the shoe-shaped portion and the tubular portion are integrally molded. The material of the shoe-shaped portion and the material of the tubular portion are each selected from thermoplastic material and no a cross-linking agent and no a chemical foaming agent is provided. The each of the specific gravity of the shoe-shaped portion and the tubular portion ranges from 0.1 to 0.3 g/cm³, and the hardness of the forefoot section is greater than the hardness of the tubular portion. Therefore, the both of the shoe-shaped and the tubular portions having lightweight properties, and the both of the shoe-shaped and the tubular portions could be recyclability, providing environmental friendly benefits. In another embodiment, a method of manufacturing the inner boot using injection physical foaming, obtaining the inner boot by the injection physical foaming process at one time, enhances manufacturing efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:射出物理發泡內靴</p>  
        <p type="p">10:鞋形部</p>  
        <p type="p">11:前足段</p>  
        <p type="p">12:後足段</p>  
        <p type="p">20:筒身部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="490" publication-number="202620700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運算系統、人工智慧外接裝置及其操作方法</chinese-title>  
        <english-title>COMPUTING SYSTEM, ARTIFICIAL INTELLIGENCE EXTERNAL DEVICE AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06N3/10</main-classification>  
        <further-classification edition="201801120250303B">G06F9/44</further-classification>  
        <further-classification edition="200601120250303B">G06F13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世濠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳千茱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江志文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIH-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種運算系統、人工智慧外接裝置及其操作方法。運算系統包括電子裝置以及人工智慧外接裝置。電子裝置包括輸入單元、顯示單元、第一傳輸介面以及第一運算單元。人工智慧外接裝置透過可插拔的方式設置在電子裝置。人工智慧外接裝置包括第二傳輸介面以及人工智慧模型儲存單元。人工智慧模型儲存單元儲存人工智慧模型。當第一運算單元透過輸入單元接收輸入指令時，人工智慧外接裝置執行人工智慧模型，並且將基於輸入指令所產生的第一標記指令輸入至人工智慧模型，以產第二標記指令。第一運算單元根據基於第二標記指令所產生的輸出資訊來透過顯示單元顯示回應內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computing system, an artificial intelligence external device and an operating method thereof are provided. The computing system includes an electronic device and an artificial intelligence external device. The electronic device includes an input unit, a display unit, a first transmission interface and a first computing unit. The artificial intelligence external device is installed in the electronic device in a pluggable manner. The artificial intelligence external device includes a second transmission interface and an artificial intelligence model storage unit. The artificial intelligence model storage unit stores an artificial intelligence model. When the first computing unit receives an input instruction through the input unit, the artificial intelligence external device executes the artificial intelligence model, and inputs a first marking instruction generated based on the input instruction into the artificial intelligence model to generate a second marking instruction. The first computing unit displays a response content through the display unit according to an output information generated based on the second marking instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:運算系統</p>  
        <p type="p">110:電子裝置</p>  
        <p type="p">111:第一運算單元</p>  
        <p type="p">112:第一傳輸介面</p>  
        <p type="p">113:輸入單元</p>  
        <p type="p">114:顯示單元</p>  
        <p type="p">120:人工智慧外接裝置</p>  
        <p type="p">122:第二傳輸介面</p>  
        <p type="p">123:人工智慧模型儲存單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="491" publication-number="202620540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於拼接式微影製程的光罩以及其製作方法與使用方法</chinese-title>  
        <english-title>PHOTOMASK FOR STITCHING LITHOGRAPHY PROCESS, METHOD OF MANUFACTURING AND METHOD OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">G03F1/70</main-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林傳傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於拼接式微影製程的光罩，以將佈局圖案轉移至光阻上，佈局圖案包括相連的第一圖案、第三圖案以及第五圖案，光罩，包括：先曝光罩，包括先曝光區與先曝拼接區，其中先曝光區包括第一圖案、先曝拼接區包括第二圖案；以及後曝光罩，包括後曝光區與後曝拼接區，其中後曝光區包括第三圖案、後曝拼接區包括第四圖案； 其中先曝拼接區與後曝拼接區在曝光時重疊、第二圖案與第四圖案在曝光時重疊，以在曝光後形成第五圖案，若光罩的圖案為不透光，則第二圖案或第四圖案之一為對第五圖案的變大調整，且若光罩的圖案為透光，則第二圖案或第四圖案之一為對第五圖案的變小調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photomask for stitching lithography process, to transfer a layout pattern to a photoresist, the layout pattern comprises a first pattern, a third pattern and a fifth pattern, the photomask, include: a pre-exposing mask comprises a pre-exposing area and a pre-exposing stitching area, wherein the pre-exposing area comprises a first pattern, and the pre-exposing stitching area comprises a second pattern; and a post-exposing mask comprises a post-exposing area and a post-exposing stitching area, wherein the post-exposing area comprises a third pattern, and the post-exposing stitching area comprises a fourth pattern; and wherein the first-exposure stitching area and the post-exposure stitching area overlap during exposure, the second pattern and the fourth pattern overlap during exposure, so as to form the fifth pattern after the exposure, if the pattern of the photomask is opaque, then one of the second pattern or the fourth pattern is an enlargement adjustment of the fifth pattern, and if the pattern of the photomask is transparent, then one of the second pattern or the fourth pattern is a narrowing adjustment of the fifth pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:先曝光罩</p>  
        <p type="p">AE:先曝光區</p>  
        <p type="p">AS:先曝拼接區</p>  
        <p type="p">B’:後曝光罩</p>  
        <p type="p">BE:後曝光區</p>  
        <p type="p">BS’:後曝拼接區</p>  
        <p type="p">CD、CD’:關鍵尺寸</p>  
        <p type="p">P1、P’1、P'''1:第一圖案</p>  
        <p type="p">P2、P’2、P'''2:第二圖案</p>  
        <p type="p">P3:第三圖案</p>  
        <p type="p">P4’:第四圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="492" publication-number="202620978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可拆換介面連接器結構</chinese-title>  
        <english-title>A DETACHABLE INTERFACE CONNECTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">H01R13/42</main-classification>  
        <further-classification edition="200601120250117B">H01R13/629</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭紹堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHAO TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉堂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TANG AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可拆換介面連接器結構，係用以將介面連接器固定於可攜式電子裝置中，包括：固定件本體，固定件本體可動地插設於殼體中形成內部空間，其截面呈π型，由按壓部及卡合部體成形所構成；介面連接器組件，固定容置於容置區內，更包括：固定基板，包含連接面及固定面；介面連接器，垂直設置於固定基板的固定面；以及導電端子，設置於固定基板的連接面，並電性連接介面連接器；以及連接器插座，垂直設置於主機板上，當介面連接器組件固定容置於容置區，且固定件本體插設於內部空間時，使導電端子緊密抵靠連接器插座。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detachable interface connector structure is used to fix the interface connector in a portable electronic device, including: a fixing part body, which is movably inserted into the housing to form an internal space, and its cross-section It is π-shaped and consists of a pressing part and a snapping part. The interface connector component is fixedly accommodated in the accommodation area, and further includes: a fixed substrate, including a connecting surface and a fixing surface; the interface connector is installed vertically in a fixed surface of the fixed substrate; and conductive terminals, which are arranged on the connection surface of the fixed substrate and are electrically connected to the interface connector; and a connector socket, which is arranged vertically on the motherboard, when the interface connector assembly is fixedly accommodated in the accommodation area , and when the fixing piece body is inserted into the internal space, the conductive terminals are tightly pressed against the connector socket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:固定件本體</p>  
        <p type="p">111:按壓部</p>  
        <p type="p">112:卡合部</p>  
        <p type="p">12:介面連接器組件</p>  
        <p type="p">121:固定基板</p>  
        <p type="p">122:介面連接器</p>  
        <p type="p">13:連接器插座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="493" publication-number="202619829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射電弧複合銲接方法及不銹鋼銲道</chinese-title>  
        <english-title>LASER ARC HYBRID WELDING METHOD AND STAINLESS STEEL WELD BEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250117B">B23K26/346</main-classification>  
        <further-classification edition="201401120250117B">B23K26/348</further-classification>  
        <further-classification edition="201401120250117B">B23K26/21</further-classification>  
        <further-classification edition="202501120250117B">B23K37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳隆佃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LUNG TIEN,</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江祺璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江昀宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YUN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪博煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, PO YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MING HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射電弧複合銲接方法，其用以形成一不銹鋼銲道，該雷射電弧複合銲接方法包括下列步驟：提供具有Y型接頭的兩個不銹鋼母材板件；以一雷射銲接製程及一電弧銲接製程同時對該Y型接頭沿一銲接方向進行一道次對銲接合，以完成該不銹鋼銲道；其中該不銹鋼銲道具有一上寬下窄的剖面。本發明透過雷射電弧複合銲接方法，利用Y型接頭的尺寸設計，以一道次方式進行對銲接合，達到低熱輸入且快速的銲接製程，降低肥粒鐵組織比例，提升不銹鋼低溫衝擊韌性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser arc hybrid welding method is used to form a stainless steel weld bead. The laser arc hybrid welding method includes the following steps: providing two stainless steel base metal plates having a Y-shaped joint; simultaneously using a laser welding process and an arc welding process to perform butt welding on the Y-shaped joint along a welding direction so as to complete the stainless steel weld bead; wherein the stainless steel weld bead has a cross section that is wide at the top and narrow at the bottom. This invention uses the laser arc hybrid welding method and utilizes the size design of the Y-shaped joint to perform butt welding in one pass, thereby achieving a low heat input and fast welding process, reducing the proportion of fat iron structure, and improving the low-temperature impact toughness of stainless steel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="494" publication-number="202620208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔鋁合金碳材複合材料的製造方法及多孔鋁浮材</chinese-title>  
        <english-title>MANUFACTURING METHOD OF POROUS ALUMINUM ALLOY CARBON MATERIAL COMPOSITE MATERIAL AND POROUS ALUMINUM FLOATING MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">C22C1/08</main-classification>  
        <further-classification edition="200601120241120B">C22C21/00</further-classification>  
        <further-classification edition="200601120241120B">B32B15/20</further-classification>  
        <further-classification edition="200601120241120B">B32B3/10</further-classification>  
        <further-classification edition="200601120241120B">B22D25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIAN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭勝元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHENG YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多孔鋁合金碳材複合材料的製造方法包括：將一鋁合金材料熔融形成一鋁合金熔湯；控制該鋁合金熔湯的工作溫度，使該鋁合金熔湯維持在半固態；將陶瓷粉末投入該半固態鋁合金熔湯中；將碳材投入該半固態鋁合金熔湯中；攪拌該半固態鋁合金熔湯，使該陶瓷粉末及碳材均勻分散於該半固態鋁合金熔湯中；將氣體注入該半固態鋁合金熔湯中，以形成含氣體泡沫的半固態鋁合金熔湯；以及將該含氣體泡沫的半固態鋁合金熔湯固化成內部充滿數個未完全連通的孔洞的多孔鋁合金碳材複合材料，並作為一多孔鋁浮材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing porous aluminum alloy carbon material composite materials includes: melting an aluminum alloy material to form an aluminum alloy molten soup; controlling the working temperature of the aluminum alloy molten soup to maintain the aluminum alloy molten soup in a semi-solid state; putting ceramicpowder into the semi-solid aluminum alloy molten soup; putting the carbon material into the semi-solid aluminum alloy molten soup; stirring the semi-solid aluminum alloy molten soup so that the ceramic powder and carbon material are evenly dispersed in the semi-solid aluminum alloy molten soup in; injecting gas into the semi-solid aluminum alloy molten soup to form a semi-solid aluminum alloy molten soup containing gas foam; and solidifying the semi-solid aluminum alloy molten soup containing gas foam into a porous aluminum alloy carbon material composite material whose an interior is filled with several holes incompletely communicated with one another.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="495" publication-number="202620143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有木質素的水性塗料組成物的塗層</chinese-title>  
        <english-title>COATING OF WATER-BASED COATING COMPOSITION CONTAINING LIGNIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">C09D197/00</main-classification>  
        <further-classification edition="200601120241129B">C09D125/08</further-classification>  
        <further-classification edition="200601120241129B">C09D133/02</further-classification>  
        <further-classification edition="201801120241129B">C09D7/40</further-classification>  
        <further-classification edition="201801120241129B">C09D7/61</further-classification>  
        <further-classification edition="200601120241129B">C09D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊高樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, KAO-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUI-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含有木質素的水性塗料組成物，包含：35至45重量百分比的成膜物質；35至45重量百分比的顏填料；5至15重量百分比的塗料助劑；及5至20重量百分比的去離子水，其中該成膜物質包含丙烯酸共聚物溶液及木質素磺酸鹽水溶液，該顏填料包括鈦白粉、高嶺土、滑石粉及碳酸鈣，該塗料助劑包括增稠劑、分散劑、成膜助劑、消泡劑、防腐劑及pH調整劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a water-based coating composition containing lignin, comprising: 35 to 45 weight percent of film-forming materials; 35 to 45 weight percent of pigment fillers; 5 to 15 weight percent of coating additives; and 5 to 20 weight percent of deionized water, wherein the film-forming materials include an acrylic copolymer solution and a lignosulfonate aqueous solution, the pigment fillers include titanium dioxide, kaolin, talc, and calcium carbonate, and the coating additives include thickeners, dispersants, coalescing agents, defoamers, preservatives, and pH adjusters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:基質混合步驟</p>  
        <p type="p">S2:顏填料混合步驟</p>  
        <p type="p">S3:成膜物質混合步驟</p>  
        <p type="p">S4:塗料助劑混合步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="496" publication-number="202619817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鋼筋彎曲機之固定底座</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250217B">B21D43/00</main-classification>  
        <further-classification edition="200601120250217B">B23Q1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>品昆機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何昭彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種用於鋼筋彎曲機之固定底座，其包含有一底板、至少一煞車片本體以及一控制模組。底板具有一第一側與一第二側，於第一側設置鋼筋彎曲機之一機台模組。煞車片本體設置於底板之第二側，煞車片本體具有一煞車板、一煞車部與一加固部，煞車部與加固部形成於煞車板之同一側的表面，加固部位於煞車部的底側且由煞車板向外延伸凸出，煞車部抵接於鋼筋彎曲機之一軌道的側面，加固部之頂面則抵接於軌道之內面。藉此，固定底座之煞車片本體能將機台模組牢固地固定於軌道上，使機台模組在進行鋼筋彎曲作業後仍能保持正確的精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:固定底座</p>  
        <p type="p">21:底板</p>  
        <p type="p">211:第一側</p>  
        <p type="p">212:第二側</p>  
        <p type="p">224:前煞車片</p>  
        <p type="p">2321:驅動端</p>  
        <p type="p">2322:被動端</p>  
        <p type="p">233:前連桿</p>  
        <p type="p">234:後連桿</p>  
        <p type="p">24:前板</p>  
        <p type="p">25:煞車片固定座</p>  
        <p type="p">251:座部</p>  
        <p type="p">252:銜接部</p>  
        <p type="p">27:第一固定塊</p>  
        <p type="p">28:第二固定塊</p>  
        <p type="p">30:滾輪固定座</p>  
        <p type="p">32:滾輪定位板</p>  
        <p type="p">33:滾輪槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="497" publication-number="202620548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負型感光性組成物及其用途</chinese-title>  
        <english-title>NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G03F7/038</main-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣永光化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERLIGHT CHEMICAL INDUSTRIAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉湘渝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, SIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種負型感光性組成物及其用途，其中，負型感光性組成物包括：50至60重量百分比之鹼可溶性樹脂；10至20重量百分比之丙烯酸單體或其寡聚物；3至8重量百分比之光起始劑；0.3至1重量百分比之附著劑，其中該附著劑為一含氮的矽烷化合物；以及餘量的溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a negative photosensitive resin composition and a use thereof. The negative photosensitive resin composition comprises: 50 to 60 wt% of a alkali soluble resin; 10 to 20 wt% of an acrylic monomer or an oligomer thereof; 3 to 8 wt% of a photo initiator; 0.3 to 1 wt% of an adhesion agent, which is a nitrogen-containing silane compound; and rest of a solvent.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="498" publication-number="202620790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>位姿圖生成方法及其裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241204B">G06T17/05</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優式機器人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URSROBOT AI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昱翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世又</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連豊力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳忠侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳招成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種位姿圖生成方法，經由一位姿圖生成裝置實施，該位姿圖生成裝置包含一處理模組、一用於接收一連串定位訊號且訊號連接該處理模組的定位模組及一訊號連接該處理模組並用於獲得一連串感測資料的視覺慣性模組。當該處理模組接收到一初始定位訊號及一初始感測資料時，該處理模組在一位姿圖建立一對應該初始定位訊號的初始位姿，該處理模組根據一下一位姿及相對於該下一位姿的前一位姿，各自所對應的定位訊號的強度獲得一對應於該下一位姿及該前一位姿之連接關係的一權重，該處理模組根據所有的權重優化該位姿圖以獲得一優化後位姿圖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11~16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="499" publication-number="202620902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同位素衰變能量集能裝置</chinese-title>  
        <english-title>RADIATION DECAY ENERGY HARVESTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">G21H1/12</main-classification>  
        <further-classification edition="202501120250613B">H10F77/45</further-classification>  
        <further-classification edition="202501120250613B">H10F77/80</further-classification>  
        <further-classification edition="202501120250613B">H10F19/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟金祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, CHIN-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何沂叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬翊峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, TYNG-WOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種收集同位素衰變能量並轉換為電能的集能裝置，包含一圓柱狀的供電模組，及位於該供電模組兩端的永久磁鐵，該供電模組包括一位於一可撓性薄膜太陽能板表面的光轉換層，該光轉換層具有一高分子基膜及多數分散於該高分子基膜的複合量子點，該等複合量子點分別具有多數可放射ß粒子之放射性同位素的配體，且該等永久磁鐵控制該等配體所放射的ß粒子的散射軌跡，該等複合量子點同時具有放射ß粒子及吸收ß粒子能量進而放出螢光的效果，再加上該等永久磁鐵限制ß粒子散射軌跡，以有效增加ß粒子碰撞量子點而可增強螢光發射的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A harvesting device for harvesting energy from isotope decay and converting it into electrical power. The harvesting device includes a cylindrical power-generating module with two permanent magnets positioned at each end. The power-generating module consists of a rollable thin-film solar panel covered by a light conversion layer. This light conversion layer is composed of a polymer base film embedded with composite quantum dots. These composite quantum dots have ligands containing various radioactive isotopes capable of emitting ß particles. The permanent magnets guide the trajectories of the emitted ß particles, enhancing their interaction with the quantum dots. Through this mechanism, the quantum dots absorb energy of ß particles and emit fluorescence. The presence of the permanent magnets effectively focuses the ß particles' paths, increasing collisions with the quantum dots and thus boosting fluorescence emission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:罩殼</p>  
        <p type="p">21:殼體</p>  
        <p type="p">22:穿孔</p>  
        <p type="p">3:供電模組</p>  
        <p type="p">31:可撓性薄膜太陽能板</p>  
        <p type="p">32:光轉換層</p>  
        <p type="p">33:隔離層</p>  
        <p type="p">4:永久磁鐵</p>  
        <p type="p">5:導線單元</p>  
        <p type="p">51:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="500" publication-number="202620170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自發光複合材料</chinese-title>  
        <english-title>SELF-LUMINOUS COMPOSITE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C09K11/02</main-classification>  
        <further-classification edition="200601120250402B">C09K11/08</further-classification>  
        <further-classification edition="200601120250402B">C09K11/56</further-classification>  
        <further-classification edition="200601120250402B">C09K11/62</further-classification>  
        <further-classification edition="200601120250402B">C09K11/88</further-classification>  
        <further-classification edition="201101120250402B">B82Y20/00</further-classification>  
        <further-classification edition="201101120250402B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟金祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, CHIN-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何沂叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬翊峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, TYNG-WOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自發光複合材料，包含一聚合物基質、多個分散於該聚合物基質的複合量子點，及多個分散於該聚合物基質的奈米金屬粒子，每一該複合量子點包括一量子點及多個連接於表面並具有可放射ß粒子之放射性同位素的配體，且該等複合量子點的平均粒徑介於2至12奈米，每一該量子點包含一核體，及一包覆該核體外表面的殼體。其中，該核體的結構為M1C1，該殼體的結構為M2C2，該M1是選自鎘、鋅，及銦的其中至少一者，該C1是選自硒，及硫的其中至少一者，該M2是選自鋅，該C2是選自硫，及硒的其中至少一者，且該等配體選自具有放射性同位素的脂肪酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-luminous composite material comprises a polymer matrix, a plurality of composite quantum dots dispersed in the polymer matrix, and a plurality of nano-metallic particles dispersed in the polymer matrix. Each of the composite quantum dots include a quantum dot and a plurality of ligands connecting to a surface and having radioactive isotopes that emit ß particles. An average particle diameter of the composite quantum dots ranges from 2 to 12 nm. Each of the quantum dots comprises a core and a shell enclosing the outer surface of the core. Wherein the structure of the core is M1C1, and the structure of the shell is M2C2. The M1 is at least one selected from cadmium, zinc, and indium, the C1 is at least one selected from selenium, and sulfur. The M2 is selected from zinc, and the C2 is at least one selected from sulfur, and selenium. The ligands are selected from fatty acids having radioactive isotopes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:聚合物基質</p>  
        <p type="p">3:複合量子點</p>  
        <p type="p">31:核體</p>  
        <p type="p">32:殼體</p>  
        <p type="p">33:配體</p>  
        <p type="p">4:奈米金屬粒子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="501" publication-number="202620347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續型乾傘機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">F26B15/00</main-classification>  
        <further-classification edition="200601120241231B">F26B25/02</further-classification>  
        <further-classification edition="200601120241231B">F26B5/16</further-classification>  
        <further-classification edition="200601120241231B">F26B11/00</further-classification>  
        <further-classification edition="200601120241231B">F26B7/00</further-classification>  
        <further-classification edition="200601120241231B">A45B25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奕錕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奕錕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭繼傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連續型乾傘機，包括座體、第一吸水模組、第二吸水模組及軌道架。座體具有第一、二側壁，內部設有第一、二凹部，並連接通道及容置空間。第一吸水模組位於第一凹部內，包含複數第一吸水元件、連動組件與驅動元件；第二吸水模組位於第二凹部內，包括複數定位座與複數第二吸水元件。軌道架具有封閉端與開放端，開放端朝下延伸並連接兩側壁，開放端與封閉端之間設有滑移段。使用時，雨傘由開放端進入通道並掛在軌道架上，透過第一吸水模組帶動旋轉，使雨水被第一與第二吸水元件吸收，最後滑移至封閉端完成乾燥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:座體</p>  
        <p type="p">11:第一側壁</p>  
        <p type="p">111:第一凹部</p>  
        <p type="p">12:第二側壁</p>  
        <p type="p">13:通道</p>  
        <p type="p">15:接水板</p>  
        <p type="p">16:自動排水閥</p>  
        <p type="p">2:第一吸水模組</p>  
        <p type="p">21:第一吸水元件</p>  
        <p type="p">22:連動組件</p>  
        <p type="p">221:軸動元件</p>  
        <p type="p">222:連動元件</p>  
        <p type="p">23:驅動元件</p>  
        <p type="p">3:第二吸水模組</p>  
        <p type="p">31:定位座</p>  
        <p type="p">32:第二吸水元件</p>  
        <p type="p">33:動力元件</p>  
        <p type="p">4:軌道架</p>  
        <p type="p">41:封閉端</p>  
        <p type="p">42:開放端</p>  
        <p type="p">43:滑移段</p>  
        <p type="p">44:固定座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="502" publication-number="202620774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產業碳排係數產製方法</chinese-title>  
        <english-title>A METHOD FOR PRODUCE SECTOR-SPECIFIC AVERAGE EMISSION　FACTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250120B">G06Q50/26</main-classification>  
        <further-classification edition="200601120250120B">G06F17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福爾摩沙氣候智慧服務有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA CLIMATE SMART SERVICE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹榮軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, JUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉憶玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, I-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡采佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSAI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林暐盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種產業碳排係數產製方法。該方法包括一前置步驟：統計主計處的每個產業的各產業中類有揭露碳排放量的公司數量，並且計算每個產業的碳強度總和；以及一決定步驟：依據每個產業的各產業中類有揭露碳排放量的公司數量，決定一產業碳排係數的一計算方式。依據主計處的產業類別分類，建立每個產業的碳排係數。亦考量「極端值」的偏誤，當該產業公司超過5家時，會把最大及最小碳強度的數值移除，以避免影響整體數據。另外，將「關鍵重點公司」納入判斷，標準化產業碳排係數建置方法，以改善排放量估算的資料完整性與可使用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for produce sector-specific average emission factors. The method involves a preliminary step: gathering statistics on a number of companies disclosing carbon emissions in each industry of the Accounting and Accounting Office and calculating a total carbon intensity of each industry; and a decision step: determining a calculation method for a carbon emission coefficient of an industry based on the number of companies in each industry that have disclosed carbon emissions. the carbon emission coefficient of each industry is established based on the industrial category classification of the Chief Accountant Office. The error of "extreme values" is also considered. When there are more than 5 companies in the industry, the maximum and minimum carbon emission intensity values ​​will be removed to avoid affecting the overall data. In addition, "critical key companies" will be included in the judgment and the construction method of industrial carbon emission coefficients will be standardized to improve the data integrity and usability of emission estimation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S120:步驟</p>  
        <p type="p">C1~C5:碳排係數</p>  
        <p type="p">L11~L14、L21~L23:階層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="503" publication-number="202620102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有聚氧化烯（聚）甘油系烷氧基矽烷的組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251009B">C08G77/18</main-classification>  
        <further-classification edition="201801120251009B">C09D7/47</further-classification>  
        <further-classification edition="200601120251009B">C09D183/02</further-classification>  
        <further-classification edition="200601120251009B">C08L83/12</further-classification>  
        <further-classification edition="200601120251009B">C08F2/10</further-classification>  
        <further-classification edition="200601120251009B">C10M145/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阪本藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO YAKUHIN KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門田慎生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONDA, SHIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柿倉友華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKIKURA, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷畑由紀子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIHATA, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松川公洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUKAWA, KIMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種組成物，在用於對薄膜等基材進行塗佈或作為薄膜製作等時，可以得到具有柔軟性但對水污或油污不易被污染的硬化塗膜或硬化薄膜。&lt;br/&gt;可藉由一種組成物而解決，其含有[A]具有聚氧化烯縮合於平均聚合度為1～100的(聚)甘油而成之骨架，且在末端具有複數個烷氧基矽烷基之聚氧化烯(聚)甘油系烷氧基矽烷，[B]矽酸酯寡聚物，及[C]聚矽氧系調平劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="504" publication-number="202620265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防水透濕線材及其織物</chinese-title>  
        <english-title>WATERPROOF AND BREATHABLE WIRE AND FABRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241230B">D03D15/292</main-classification>  
        <further-classification edition="202101120241230B">D03D15/527</further-classification>  
        <further-classification edition="200601120241230B">D03D1/00</further-classification>  
        <further-classification edition="200601120241230B">B32B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立綺實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVA POLYTEC COMPOSITES CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種防水透濕線材、織物及其製造方法，該防水透濕線材為一多芯纖維，其包含至少二個纖維以及一包覆樹脂，複數個該多芯纖維交織形成一布材，使各該多芯纖維之間形成一孔隙，至少二個該多芯纖維於交織過程中至少一部份相互抵靠而各自形成一彎折段。該布材經一加熱溫度以及一壓力後，該包覆樹脂經由該加熱溫度及該壓力後熔融變形流動於各該纖維之外周圍，各該纖維則朝向其對應的該多芯纖維徑向地分散並重新排列且同時填補該孔隙，使該防水透濕織物的整體厚度大幅減少且該包覆樹脂均勻分布形成具有一平滑表面之該防水透濕織物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a waterproof and breathable wire, fabric and manufacturing method thereof, the waterproof and breathable wire is a multi-core fiber comprising at least two fibers and a coating resin. Multiple such multi-core fibers are interwoven to form a fabric, creating voids between each of the multi-core fibers. During the interweaving process, at least two of the multi-core fibers partially contact each other, each forming a bend segment. After the fabric is subjected to a heating temperature and pressure, the coating resin melts, deforms, and flows around the periphery of each fiber due to the heating temperature and pressure. Each fiber then disperses and rearranges radially towards its corresponding multi-core fiber while simultaneously filling the voids, resulting in a significant reduction in the overall thickness of the waterproof and breathable fabric, with the coating resin evenly distributed to form a smooth surface on the waterproof and breathable fabric.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多芯纖維</p>  
        <p type="p">11:纖維</p>  
        <p type="p">12:包覆樹脂</p>  
        <p type="p">13:孔隙</p>  
        <p type="p">14:彎折段</p>  
        <p type="p">15:交疊間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="505" publication-number="202620283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動門的控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">E06B9/68</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李其宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電動門的控制裝置，該控制裝置包含一機電供電單元以及一數位控制單元，該機電供電單元對至少一馬達提供啟動需要的電力，該數位控制單元包含至少一運算晶片，該數位控制單元對該機電供電單元提供至少一驅動訊號。進一步地，該控制裝置僅具單一市電輸入端，該控制裝置具有一連接該市電輸入端的電力傳遞單元，該電力傳遞單元未對來自該市電輸入端的一交流電力進行整流濾波，該電力傳遞單元將來自該市電輸入端取得的電力分別提供給該機電供電單元與該數位控制單元，該數位控制單元的用電與該機電供電單元的用電互不影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:控制裝置</p>  
        <p type="p">21:機電供電單元</p>  
        <p type="p">211:第一電力轉換電路</p>  
        <p type="p">22:數位控制單元</p>  
        <p type="p">221:運算晶片</p>  
        <p type="p">222:驅動訊號</p>  
        <p type="p">223:第二電力轉換電路</p>  
        <p type="p">23:市電輸入端</p>  
        <p type="p">24:電力傳遞單元</p>  
        <p type="p">50:電動門</p>  
        <p type="p">51:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="506" publication-number="202620459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光達系統及光達掃描方法</chinese-title>  
        <english-title>LIDAR SYSTEM AND LIDAR SCANNING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G01S17/06</main-classification>  
        <further-classification edition="200601120241127B">G01S7/481</further-classification>  
        <further-classification edition="200601120241127B">B60W40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡家瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李益志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露有關於一種光達系統及光達掃描方法，藉由光束轉向分階模組選擇性將雷射光轉向分階，並藉由光訊號接收模組接收對應雷射光的反射光及將反射光轉換為反射訊號。接著，藉由專注區域電路模組接收反射訊號並根據反射訊號選擇性地產生啟動脈衝，及藉由控制模組於當接收到啟動脈衝時，控制光束轉向分階模組將雷射光轉向分階，以同時分別對掃描範圍及專注掃描範圍進行掃描。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a LiDAR system and a LiDAR scanning method, which, by a beam steering and splitting module, selectively steers and splits a laser beam, and, by a light signal receiving module, receives a reflecting beam corresponding to the laser beam and transforms the reflecting beam into a reflecting signal. Then, by a focus zone circuit module, receives the reflecting signal and selectively generates an activating pulse according to the reflecting signal, and, by a control module, controls the beam steering and splitting module to steer and split the laser beam, for respectively and simultaneously scanning a scanning range and a focus scanning range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光達系統</p>  
        <p type="p">110:光束轉向分階模組</p>  
        <p type="p">111:雷射發射單元</p>  
        <p type="p">112:光學轉向單元</p>  
        <p type="p">113:光學轉向驅動單元</p>  
        <p type="p">120:光訊號接收模組</p>  
        <p type="p">121:光電二極體</p>  
        <p type="p">122:第二放大器</p>  
        <p type="p">130:專注區域電路模組</p>  
        <p type="p">131:時間數位轉換單元</p>  
        <p type="p">132:訊號過濾單元</p>  
        <p type="p">133:時脈訊號產生器</p>  
        <p type="p">134:第一放大器</p>  
        <p type="p">140:控制模組</p>  
        <p type="p">141:第一控制單元</p>  
        <p type="p">142:第二控制單元</p>  
        <p type="p">150A:掃描範圍</p>  
        <p type="p">150B:專注掃描範圍</p>  
        <p type="p">210:目標物</p>  
        <p type="p">AD:開啟距離</p>  
        <p type="p">AP:啟動脈衝</p>  
        <p type="p">CD:控制資料</p>  
        <p type="p">CS:時脈訊號</p>  
        <p type="p">IP:數位傳輸訊號</p>  
        <p type="p">L:雷射光</p>  
        <p type="p">L1:第一分光</p>  
        <p type="p">L2:第二分光</p>  
        <p type="p">RL,RL1,RL2:反射光</p>  
        <p type="p">RS:反射訊號</p>  
        <p type="p">SCD:轉向控制資料</p>  
        <p type="p">SD:狀態資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="507" publication-number="202620282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層結構之節能視窗及其用途</chinese-title>  
        <english-title>MULTI-LAYERED WINDOW OF ENERGY SAVING AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">E06B3/663</main-classification>  
        <further-classification edition="200601120241204B">E06B3/67</further-classification>  
        <further-classification edition="200601120241204B">B32B17/06</further-classification>  
        <further-classification edition="201901120241204B">B32B7/023</further-classification>  
        <further-classification edition="201901120241204B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>業闊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉姍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種多層結構之節能視窗，其包括一第一透明導電板、至少一中間層以及一第二透明導電板，其中，該第一透明導電板與該第二透明導電板皆包括一玻璃基板以及形成於該玻璃基板之上的一透明導電層。依據本發明之設計，該透明導電層的片電阻低於100Ω/□。如此設計，當本發明所述多層結構之節能視窗應用為一建築物的窗戶或一汽車的車窗時，係能夠大幅減少入射陽光能量(熱能)，藉此方式有效抑制室內溫度升高，從而可以減輕該建築物的空調設備的負荷以及運轉時間，達到節能省碳以及大幅降低空調使用成本之有益效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a multi-layered window of energy saving, which comprises a first transparent conductive (TC) plate, at least one intermediate layer and a second TC plate, wherein the first TC plate and the second TC plate all consist of a glass substrate and a TC layer formed on the glass substrate. According to the present invention, the TC layer has a sheet resistance lower than 100 Ω/□. As such, in case of this multi-layered window being adopted as a window of a building or a car door, the heat energy of a sunlight is significantly reduced while the sunlight passes through the window. As a result, the interior temperature of the building or the car is well controlled so as to not rise with the continuous exposure of the sunlight. Therefore, the load of the air conditioning equipment of the building or the car is correspondingly controlled, such that the operation time of the air conditioning equipment can be optionally shortened, thereby conserving energy to reduce carbon emission and lower the use cost of the air conditioning equipment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多層結構之節能視窗</p>  
        <p type="p">11:第一透明導電板</p>  
        <p type="p">111:第一玻璃基板</p>  
        <p type="p">112:第一透明導電層</p>  
        <p type="p">12:透光中間層</p>  
        <p type="p">13:第二透明導電板</p>  
        <p type="p">131:第二玻璃基板</p>  
        <p type="p">132:第二透明導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="508" publication-number="202620089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱固化低介電常數散熱絕緣預浸體樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">C08G18/32</main-classification>  
        <further-classification edition="200601120241220B">C08G18/75</further-classification>  
        <further-classification edition="200601120241220B">C08L75/04</further-classification>  
        <further-classification edition="200601120241220B">C08L63/00</further-classification>  
        <further-classification edition="200601120241220B">C08K3/36</further-classification>  
        <further-classification edition="200601120241220B">C08K3/38</further-classification>  
        <further-classification edition="200601120241220B">C08J5/24</further-classification>  
        <further-classification edition="200601120241220B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川裕工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳國富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎萬華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐道雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供韌性及接著強度優異、可以實現低介電常數散熱的絕緣預浸體樹脂組成物，係用於一印刷電路板之低介電常數散熱絕緣層製備，其介電常數Dk≦3.10(40GHz)，損耗因數Df≦0.015(40GHz)，導熱系數K&lt;img align="absmiddle" height="14px" width="12px" file="d10006.TIF" alt="其他非圖式ed10006.png" img-content="character" orientation="portrait" inline="no" giffile="ed10006.png"/&gt;0.8W/m．k。更詳細而言，此預浸體樹脂組成物係由含有(x)一酸修飾聚胺脂寡聚物(A1或A2)，具有一羧基(-COOH)以及一烴基、(y)一熱固化黏合劑，具有一熱固化官能基、(z)一高導熱係數低介電常數填充劑形成。該樹脂組成物中的前述酸修飾寡聚物樹脂(x)的含量為50~80質量%，前述熱固化黏合劑(y)的含量為3~40質量%，前述高導熱係數低介電常數填充劑(z)的含量為10~40質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:膜狀載體</p>  
        <p type="p">2:低介電散熱預浸體</p>  
        <p type="p">3:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="509" publication-number="202620137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高散熱低介電防焊油墨樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250402B">C09D11/03</main-classification>  
        <further-classification edition="201401120250402B">C09D11/101</further-classification>  
        <further-classification edition="201401120250402B">C09D11/102</further-classification>  
        <further-classification edition="201401120250402B">C09D11/106</further-classification>  
        <further-classification edition="201401120250402B">C09D11/108</further-classification>  
        <further-classification edition="200601120250402B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川裕工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳國富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎萬華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐道雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種高散熱低介電防焊油墨樹脂組成物，具有優異解析性，耐熱性及高延伸率，其介電常數Dk≦3.10(40GHz)，損耗因數Df≦0.015(40GHz)，導熱系數K&lt;img align="absmiddle" height="18px" width="12px" file="d10006.TIF" alt="其他非圖式ed10006.png" img-content="character" orientation="portrait" inline="no" giffile="ed10006.png"/&gt;0.8W/m．k。本發明之光硬化性樹脂組成物，其特徵係包含(A)光可聚合、鹼可溶性預聚物(oligomer)A1、A2或兩者任意混合：30~70重量%，其具有羧基(-COOH)及光固化不飽和官能基；(B)苯乙烯馬來酸酐(SMA)樹脂：10~20重量%；(C)光聚合乙烯基單體：5~20重量%；(D)環氧樹脂：5~20重量%；(E)石油樹脂：2~10重量%；(F)光聚合起始劑：3~10重量%；(G)中空無機填充劑：5~20重量%；(H)高導熱係數低介電常數填充劑15~40重量%；(I)促進劑：0.5~2.0重量%；(J)有機溶劑：15~40重量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="510" publication-number="202619801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗佈頭模具</chinese-title>  
        <english-title>COATING DIE HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B05C5/02</main-classification>  
        <further-classification edition="200601120241204B">B05C11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳平耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉達人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DAR-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, WEN-BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種塗佈頭模具。塗佈頭模具包括一上模板、一下模板以及一間隔片。上模板沿著一第一方向與一第二方向延伸，上模板在第一方向上的延伸距離大於上模板在第二方向的延伸距離，且第一方向垂直於第二方向。下模板設置於上模板下。間隔片設置於上模板與下模板之間。上模板、下模板與間隔片之間的空間形成一分流管，分流管在一第三方向上具有一深度，第三方向垂直於第一方向與第二方向。分流管在第二方向上的寬度為W，在第三方向上的深度為DE，且W/DE≥5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coating head mold is provided. The coating head mold includes an upper die block, a lower die block and a shim. The upper die block extends along a first direction and a second direction, an extension distance of the upper template in the first direction is greater than an extension distance of the upper die block in the second direction, and the first direction is perpendicular to the second direction. The lower die block is disposed under the upper die block. The shim is disposed between the upper die block and the lower die block. A slot gap between the upper die block, the lower die block and the shim forms a manifold. The manifold has a depth in a third direction, and the third direction is perpendicular to the first direction and the second direction. The width of the manifold in the second direction is W, the depth of the manifold in the third direction is DE, and W/DE≥5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:塗佈頭模具</p>  
        <p type="p">110:上模板</p>  
        <p type="p">122:分流管</p>  
        <p type="p">122t,124t:頂面</p>  
        <p type="p">124:狹縫</p>  
        <p type="p">130:間隔片</p>  
        <p type="p">150:下模板</p>  
        <p type="p">150h:凹槽</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DE,DE1:深度</p>  
        <p type="p">W,W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="511" publication-number="202620694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於人工智慧物聯網的無線網狀類神經網路控制系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250324B">G06N3/063</main-classification>  
        <further-classification edition="202301120250324B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汯鉅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHLINK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙宏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, HUNG JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種應用於人工智慧物聯網的無線網狀類神經網路控制系統，包含至少一類神經網路控制器，各類神經網路控制器具有自我學習裝置、服務開通裝置、感知裝置與控制裝置。本發明係使用類神經網路與深度學習（強化學習）的技術，故本發明可以根據實際環境自我學習與調整，以提高應用效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:中樞主控裝置</p>  
        <p type="p">140:中樞主控通訊單元</p>  
        <p type="p">20:類神經網路控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="512" publication-number="202620960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">H01Q1/00</main-classification>  
        <further-classification edition="200601120241125B">H01Q1/52</further-classification>  
        <further-classification edition="200601120241125B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明泰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA NETWORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林光偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇德昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線系統，包括有一基板、一金屬散熱器以及一天線組件，該金屬散熱器設置於該基板上方，該金屬散熱器包含一本體及一散熱結構，該散熱結構設置於該本體上，該本體具有一凹部，該凹部自該本體之周緣內凹形成；該天線包含一微帶線及一輻射段，該微帶線設置於該基板表面且耦接至一信號源，該輻射段與該本體連接並設置於該凹部中，該輻射段一端設置於鄰近該微帶線的位置，該輻射段由該微帶線所耦合激發。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:天線系統</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:金屬散熱器</p>  
        <p type="p">22:本體</p>  
        <p type="p">221,221’:凹部</p>  
        <p type="p">221a:第一側邊</p>  
        <p type="p">221b:第二側邊</p>  
        <p type="p">221c:第三側邊</p>  
        <p type="p">22a:第一邊</p>  
        <p type="p">22b:第二邊</p>  
        <p type="p">24:散熱結構</p>  
        <p type="p">241:散熱鰭片</p>  
        <p type="p">40,40’:天線組件</p>  
        <p type="p">42,42’:微帶線</p>  
        <p type="p">44,44’:輻射段</p>  
        <p type="p">50:結合柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="513" publication-number="202620277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌機構</chinese-title>  
        <english-title>SLIDE RAIL MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241126B">E05B65/464</main-classification>  
        <further-classification edition="201701120241126B">A47B88/49</further-classification>  
        <further-classification edition="200601120241126B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川湖科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川益科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳庚金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊順和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周繼志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌機構包含一第一滑軌總成、一第二滑軌總成以及一鎖件。每一滑軌總成皆包含一第一軌與一第二軌可相對該第一軌位移。當該第一滑軌總成的第二軌開啟的過程中可帶動該鎖件，使該鎖件上的一輔助特徵能夠阻擋該第二滑軌總成的第二軌而防止該第二滑軌總成的第二軌開啟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slide rail mechanism includes a first slide rail assembly, a second slide rail assembly and a locking member. Each of the slide rail assemblies includes a first rail and a second rail displaceable with respect to the first rail. During a process of the second rail of the first slide rail assembly being opened, the locking member can be moved such that an auxiliary feature arranged on the locking member is configured to block the second rail of the second slide rail assembly for preventing the second rail of the second slide rail assembly from opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:機架</p>  
        <p type="p">22a:第一柱部</p>  
        <p type="p">22b:第二柱部</p>  
        <p type="p">24:第一滑軌總成</p>  
        <p type="p">26:第二滑軌總成</p>  
        <p type="p">28:第三滑軌總成</p>  
        <p type="p">30:鎖件</p>  
        <p type="p">32:安裝件</p>  
        <p type="p">38:第一限位特徵</p>  
        <p type="p">42:第一軌</p>  
        <p type="p">44:第二軌</p>  
        <p type="p">45:第三軌</p>  
        <p type="p">46:支架</p>  
        <p type="p">L1:第一側</p>  
        <p type="p">L2:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="514" publication-number="202621223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌機構</chinese-title>  
        <english-title>SLIDE RAIL MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H05K7/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川湖科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川益科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳庚金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊順和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周繼志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌機構包含一第一滑軌總成、一第二滑軌總成以及一鎖件。每一滑軌總成皆包含一第一軌與一第二軌可相對該第一軌位移。該第一滑軌總成的第二軌與該第二滑軌總成的第二軌皆可相對第一軌從一收合位置往一開啟方向位移一距離而到達一工作位置。當該第一滑軌總成的第二軌從該收合位置或該工作位置往該開啟方向開啟的過程中可帶動該鎖件，使該鎖件上的一輔助特徵能夠阻擋該第二滑軌總成的第二軌從工作位置開啟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slide rail mechanism includes a first slide rail assembly, a second slide rail assembly and a locking member. Each of the slide rail assemblies includes a first rail and a second rail displaceable with respect to the first rail. Both of the second rails of the first slide rail assembly and the second slide rail assembly are displaceable relative to the first rails from a retracted position to a working position by a distance in an opening direction. During a process of the second rail of the first slide rail assembly being opened from the retracted position or the working position in the opening direction, the locking member can be moved such that an auxiliary feature arranged on the locking member is configured to block the second rail of the second slide rail assembly for opening from the working position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">223:機架</p>  
        <p type="p">200:第一滑軌總成</p>  
        <p type="p">206:第二滑軌總成</p>  
        <p type="p">204,210:第一軌</p>  
        <p type="p">202,208:第二軌</p>  
        <p type="p">224,226:第三軌</p>  
        <p type="p">216:第一工作裝置</p>  
        <p type="p">212:第一輔助特徵</p>  
        <p type="p">218:第二工作裝置</p>  
        <p type="p">214:第二輔助特徵</p>  
        <p type="p">220:第一支架</p>  
        <p type="p">222:第二支架</p>  
        <p type="p">230:鎖件</p>  
        <p type="p">D1:開啟方向</p>  
        <p type="p">f:前端部</p>  
        <p type="p">G:距離</p>  
        <p type="p">M1:第一電子設備</p>  
        <p type="p">M2:第二電子設備</p>  
        <p type="p">P1:第一預定位置</p>  
        <p type="p">R:收合位置</p>  
        <p type="p">r:後端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="515" publication-number="202621502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統級晶片整合架構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/60</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202301120260223B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旋碼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統級晶片整合架構，包括一單晶片系統晶片、一特殊積體電路晶片、一或多個動態隨機存取記憶體層。該特殊積體電路晶片堆疊於該單晶片系統晶片。該動態隨機存取記憶體層，堆疊於該特殊積體電路晶片。其中，該動態隨機存取記憶體層與該特殊積體電路晶片之間以及該特殊積體電路晶片與該單晶片系統晶片之間是經由矽穿孔而連接，使該特殊積體電路晶片與該單晶片系統晶片之間形成一高資料頻寬介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統級晶片整合架構</p>  
        <p type="p">110:單晶片系統晶片</p>  
        <p type="p">120:特殊積體電路晶片</p>  
        <p type="p">130:動態隨機存取記憶體層</p>  
        <p type="p">131:記憶體單元</p>  
        <p type="p">140:修復電路</p>  
        <p type="p">150:矽穿孔</p>  
        <p type="p">160:矽穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="516" publication-number="202620857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體的晶片整合結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G11C8/06</main-classification>  
        <further-classification edition="200601120241204B">G11C29/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旋碼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體的晶片整合結構，包括一記憶體單元以及一特殊應用積體電路晶片。該記憶體單元包括一或多個堆疊的記憶體晶片，該記憶體晶片分別具有一第一資料暫存器。該特殊應用積體電路晶片具有一第二資料暫存器，其中，該記憶體單元的該第一資料暫存器與該特殊應用積體電路晶片的該第二資料暫存器透過一晶片間介面相耦合。其中，該晶片整合結構透過設置於該特殊應用積體電路晶片的一或多個高資料頻寬介面對外進行資料傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體晶片整合結構</p>  
        <p type="p">10:記憶體單元</p>  
        <p type="p">11:記憶體晶片</p>  
        <p type="p">111:第一資料暫存器</p>  
        <p type="p">112:記憶體陣列</p>  
        <p type="p">113:輸入/輸出閘</p>  
        <p type="p">114:列解碼器</p>  
        <p type="p">115:行址多路復用器</p>  
        <p type="p">116:第一冗餘記憶體</p>  
        <p type="p">20:特殊應用積體電路單元</p>  
        <p type="p">21:特殊應用積體電路晶片</p>  
        <p type="p">211:第二資料暫存器</p>  
        <p type="p">212:修復電路</p>  
        <p type="p">213:冗餘記憶體</p>  
        <p type="p">214:可編程記憶體</p>  
        <p type="p">215:行列解碼器</p>  
        <p type="p">216:第二冗餘記憶體</p>  
        <p type="p">30:晶片間介面</p>  
        <p type="p">40:高資料頻寬介面</p>  
        <p type="p">41:資料傳輸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="517" publication-number="202621227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H05K7/20</main-classification>  
        <further-classification edition="200601120250102B">F28D1/02</further-classification>  
        <further-classification edition="200601120250102B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商莫仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLEX, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許坤霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液冷組件，適用於供一冷卻液體通入流經以執行散熱工作，並包含一主體、數個散熱座及一彈性密封件。該主體界定出數個供該冷卻液體流經以執行散熱工作的散熱區、一供該冷卻液體流入其中至少兩個該散熱區的入水分流道，及一供該冷卻液體自另外至少兩個該散熱區流出的出水分流道。該入水分流道具有分別連接該其中至少兩個散熱區的入水分流支道，該出水分流道具有分別連接該另外至少兩個散熱區的出水分流支道。本發明藉由該入水分流道及該出水分流道，將進出該等散熱區的通道一分為多，有效降低進出通道的液壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主體</p>  
        <p type="p">100:散熱區</p>  
        <p type="p">11:入水孔</p>  
        <p type="p">12:入水分流道</p>  
        <p type="p">121:入水分流主道</p>  
        <p type="p">122:入水分流支道</p>  
        <p type="p">123:入水連通端部</p>  
        <p type="p">13:出水孔</p>  
        <p type="p">14:出水分流道</p>  
        <p type="p">141:出水分流主道</p>  
        <p type="p">142:出水分流支道</p>  
        <p type="p">143:出水連通端部</p>  
        <p type="p">15:固定部</p>  
        <p type="p">16:圍壁</p>  
        <p type="p">161:第一壁部</p>  
        <p type="p">162:第二壁部</p>  
        <p type="p">2:散熱座</p>  
        <p type="p">22:周緣</p>  
        <p type="p">23:散熱鰭片</p>  
        <p type="p">24:突柱</p>  
        <p type="p">25:彈簧</p>  
        <p type="p">3:彈性密封件</p>  
        <p type="p">4:入水管</p>  
        <p type="p">5:出水管</p>  
        <p type="p">D1:入水管徑</p>  
        <p type="p">D2:出水管徑</p>  
        <p type="p">D3:入水分流口徑</p>  
        <p type="p">D4:出水分流口徑</p>  
        <p type="p">D5:入水連通口徑</p>  
        <p type="p">D6:出水連通口徑</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="518" publication-number="202620462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異物偵測方法及系統</chinese-title>  
        <english-title>OBSTACLE DETECTION METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241226B">G01S17/93</main-classification>  
        <further-classification edition="202001120241226B">G01S17/89</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHIH SHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佩娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種異物偵測方法及系統。異物偵測方法包含以處理裝置執行：以光達感測器進行感測以取得在光達感測器的感測範圍中的多個第一點雲，其中感測範圍與移動載具的行進方向相匹配，根據第一點雲取得多個非地面點，從非地面點取得多個第一邊界點及多個第二邊界點，根據第一邊界點與第二邊界點的平均以取得路徑中心線，根據預設框選範圍以路徑中心線建立偵測剖面，以及利用偵測剖面進行偵測並輸出偵測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An obstacle detection method and system. The obstacle detection method, performed by a processing device, includes: performing sensing by a lidar sensor to obtain first point clouds at a sensing range of the lidar sensor, wherein the sensing range matches a moving direction of a mobile vehicle, obtaining non-ground points according to the first point clouds, obtaining first boundary points and second boundary points from the non-ground points, obtaining a path centerline according to an average of the first boundary points and the second boundary points, using the path centerline to build a detection cross section according to a default encircle range, and using the detection cross section to perform detection and outputting a detection result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S109,S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="519" publication-number="202620544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印設備</chinese-title>  
        <english-title>IMPRINTING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G03F7/00</main-classification>  
        <further-classification edition="200601120250512B">B29C51/20</further-classification>  
        <further-classification edition="200601120250512B">B29C59/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳來毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓印設備，包含一基板、一加熱盤以及至少一變形抑制組件。加熱盤在一壓印方向上相對於基板設置。所述至少一變形抑制組件設置於基板與加熱盤之間。所述至少一變形抑制組件包含一第一線性調整件。第一線性調整件包含一第一滑軌以及一第一滑塊。第一滑軌與第一滑塊在垂直於壓印方向的一第一方向上相對可移動地設置。第一滑軌與第一滑塊的其中一者直接或間接地連接於基板與加熱盤的其中一者，第一滑軌與第一滑塊的另外一者直接或間接地連接基板與加熱盤的另外一者，以提供加熱盤相對於基板沿第一方向移動的自由度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imprinting apparatus includes a substrate, a heating plate and at least one deformation suppressor. The heating plate is disposed opposite to the substrate along an imprinting direction. The at least one deformation suppressor is disposed between the substrate and the heating plate. The at least one suppressor includes a first linear regulator. The first linear regulator includes a first rail and a first block that are movably disposed with respect to each other along a first direction perpendicular to the imprinting direction. One of the first rail and the first block is directly or indirectly connected to one of the substrate and the heating plate, and another one of the first rail and the first block is directly or indirectly connected to another one of the substrate and the heating plate, which provides degrees of freedom of the heating plate with respect to the substrate along the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板</p>  
        <p type="p">12:加熱盤</p>  
        <p type="p">121:階梯狀穿孔</p>  
        <p type="p">122:凹槽</p>  
        <p type="p">13:變形抑制組件</p>  
        <p type="p">131:第一線性調整件</p>  
        <p type="p">1311:第一滑軌</p>  
        <p type="p">1312:第一滑塊</p>  
        <p type="p">132:第二線性調整件</p>  
        <p type="p">1321:第二滑軌</p>  
        <p type="p">1322:第二滑塊</p>  
        <p type="p">133:周向調整件</p>  
        <p type="p">1331:座體</p>  
        <p type="p">1332:止推軸承</p>  
        <p type="p">134:隔熱墊</p>  
        <p type="p">135:螺栓</p>  
        <p type="p">136:彈簧</p>  
        <p type="p">137:金屬塊</p>  
        <p type="p">1b:驅動件</p>  
        <p type="p">AA:工件</p>  
        <p type="p">BB:模具</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">DC:周向方向</p>  
        <p type="p">DP:壓印方向</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="520" publication-number="202620559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人節點調度方法及系統</chinese-title>  
        <english-title>ROBOT NODE ALLOCATION METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250218B">G05B19/02</main-classification>  
        <further-classification edition="202301120250218B">H04W72/20</further-classification>  
        <further-classification edition="201801120250218B">H04W76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KUO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游國樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KUO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機器人節點調度方法及系統。機器人節點調度方法包含：建立包含多個連結器的網路結構，當所述多個連結器的多筆遙測資料符合預設條件時，自其中一個連結器取得移動載具的位置資訊，並將所述一個連結器作為起始點，決定另一個連結器作為第一目標點，取得起始點至第一目標點的最短路徑作為第一轉發路徑，根據第一轉發路徑傳送來自移動載具的資料至第一目標點，至少根據所述多筆遙測資料、位置資訊、移動載具的速度資訊及調度決策參數決定第二轉發路徑，以及根據第二轉發路徑傳送來自第一目標點的資料至第二轉發路徑的目標點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a robot node allocation method and system. The robot node allocation method includes: building a network structure including linkers, obtaining location information of a mobile vehicle from one of the linkers when the telemetry data of the linkers match a default standard, using said one of the linkers as a starting point, determining another linker as a first target point, obtaining a shortest path from the starting point to the first target point as a first forwarding path, transmitting data from the mobile vehicle to the first target point according to the first forwarding path, determining a second forwarding path at least according to the pieces of telemetry data, the location information, velocity information of the mobile vehicle and an allocation decision parameter, and transmitting data from the first target point to a target point of the second forwarding path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102,S103,S105,S107,S109,S111,S113,S115,S117,S119,S121,S123:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="521" publication-number="202621220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固定支架及主機板組件</chinese-title>  
        <english-title>FIXING FRAME AND MOTHERBOARD ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">H05K7/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭秀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSIU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝漢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HAN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主機板組件包含主機板及固定支架。主機板具有電連接器，電連接器供電路板插接。固定支架為一體成形件，且包含底部、第一豎牆部、第二豎牆部、第一彈性變形部、頂部、第二彈性變形部及卡扣彈臂部。底部固定於主機板，第一豎牆部及第二豎牆部相分離地豎立於底部，頂部之一側透過第一彈性變形部連接於第一豎牆部，頂部的另一側抵靠於第二豎牆部，而令底部、第一豎牆部、第二豎牆部、第一彈性變形部及頂部共同圍繞一限位空間以限位電路板，卡扣彈臂部透過第二彈性變形部連接於頂部遠離第一豎牆部的一側，且卡扣彈臂部卡固於第二豎牆部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motherboard assembly includes a motherboard and a fixing frame. The motherboard has an electrical connector for a circuit board to inserted therein. The fixing frame is formed as one piece and includes a bottom portion, a first wall portion, a second wall portion, a first elastic portion, a top portion, a second elastic portion and an engagement arm portion. The bottom portion is fixed on the motherboard. The first wall portion and the second wall portion stand on the bottom portion and are spaced apart from each other. One side of the top portion is connected to the first wall portion via the first elastic portion. Another side of the top portion is in contact with the second wall portion, and the bottom portion, the first wall portion, the second wall portion, a first elastic portion and the top portion together form a positioning space for positioning the circuit board. The engagement arm portion is connected to one side of the top portion located away from the first wall portion via the second elastic portion. The engagement arm portion is engaged with the second wall portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主機板組件</p>  
        <p type="p">2:電路板</p>  
        <p type="p">10:主機板</p>  
        <p type="p">20:固定支架</p>  
        <p type="p">30:鎖固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="522" publication-number="202621221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及理線架組</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CABLE MANAGING ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H05K7/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭秀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSIU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝漢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HAN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含一機殼、一理線架組以及至少一線纜。理線架組包含一理線架體以及一活動式蓋體。理線架體設置於機殼，並具有至少一理線槽。活動式蓋體之一端連接於理線架體，且活動式蓋體可相對理線架體滑動與轉動。至少一線纜可分離地設置於至少一理線槽。其中，透過活動式蓋體之一端相對理線架體滑動與轉動，以令活動式蓋體之另一端可分離地固定於理線架體，而使至少一線纜定位於至少一理線槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a chassis, a cable managing assembly and at least one cable. The cable managing assembly includes a cable managing cage and a movable cover. The cable managing cage is disposed on the chassis, and has at least one cable managing recess. An end of the movable cover is connected to the cable managing cage, and the movable cover can be slipped and rotated relative to the cable managing cage. The at least one cable can be detachably disposed at the at least one cable managing recess. The at least one cable is positioned at the at least one cable managing recess through slipping and rotating an end of the movable cover relative to the cable managing cage so that the other end of the movable cover can be detachably fixed to the cable managing cage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">20:機殼</p>  
        <p type="p">30:理線架組</p>  
        <p type="p">31:理線架體</p>  
        <p type="p">311:理線槽</p>  
        <p type="p">32:活動式蓋體</p>  
        <p type="p">40:線纜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="523" publication-number="202619654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合式公媽龕</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">A47G33/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡彥弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡彥弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種複合式公媽龕，設有一龕座及數個儲存容器，該龕座於內部設有一容室，於該容室內設有數個間隔設置的隔板，將該容室分隔成數個擺放空間，該數個儲存容器係設置於該龕座的容室內且位於其中一該擺放空間，各該儲存容器於外表面具有一標示符號，且各該儲存容器設有一儲存空間，於各該儲存容器內能放置一位或多位祖先的香灰、骨灰或遺物等相關物品，且各該儲存容器能經由各該隔板而間隔擺放於該龕座的容室內，不需再另外購買塔位或墓地進行存放，有效降低費用及祭拜所需的時間，於各該儲存容器下方設置所述的調整座，能讓後世子孫調整相對應儲存容器的方位，提供符合該祖先的風水方位，提供一種能方便使用、節省成本且能靈活調整的複合式公媽龕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:龕座</p>  
        <p type="p">11:容室</p>  
        <p type="p">12:隔板</p>  
        <p type="p">13:擺放空間</p>  
        <p type="p">14:定位肋條</p>  
        <p type="p">15:封板</p>  
        <p type="p">20:儲存容器</p>  
        <p type="p">21:標示符號</p>  
        <p type="p">22:儲存空間</p>  
        <p type="p">23:頂蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="524" publication-number="202620996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向充電器、充電系統及其操作方法</chinese-title>  
        <english-title>BIDIRECTIONAL CHARGER, CHARGING SYSTEM AND METHOD OF OPERATION THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H02J7/04</main-classification>  
        <further-classification edition="201901120250303B">B60L58/10</further-classification>  
        <further-classification edition="201901120250303B">B60L53/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全漢企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FSP TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUAN JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹國傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KUO CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙向充電器包括電源轉換電路與控制模組。電源轉換電路用以轉換電子裝置的第一電源與電池模組的第二電源，且控制模組通過與該電子裝置進行交握通訊而選擇性的將電源轉換電路的操作模式設定為充電模式或饋電模式。當操作模式設定為充電模式時，控制模組控制電源轉換電路將第一電源轉換為第二電源，以對電池模組充電。當操作模式設定為饋電模式時，控制模組控制電源轉換電路將第二電源轉換為第一電源，以對電子裝置饋電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bidirectional charger includes a power conversion circuit and a control module. The power conversion circuit is used to convert a first power source of an electronic device and a second power source of a battery module, and the control module selectively sets an operating mode of the power conversion circuit to a sink mode or source mode by performing a handshake communication with the electronic device. When the operating mode is set to the sink mode, the control module controls the power conversion circuit to convert the first power source into the second power source to charge the battery module. When the operating mode is set to the source mode, the control module controls the power conversion circuit to convert the second power source into the first power source to feed the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙向充電器</p>  
        <p type="p">100A:Type-C連接埠</p>  
        <p type="p">100B:模組端連接部</p>  
        <p type="p">1:電源轉換電路</p>  
        <p type="p">2:控制模組</p>  
        <p type="p">20:控制裝置</p>  
        <p type="p">22:控制電路</p>  
        <p type="p">200:電動載具</p>  
        <p type="p">200A:電池模組</p>  
        <p type="p">300:電子裝置</p>  
        <p type="p">300A:供電裝置</p>  
        <p type="p">300B:受電裝置</p>  
        <p type="p">Pin:輸入電源</p>  
        <p type="p">P1:第一電源</p>  
        <p type="p">P2:第二電源</p>  
        <p type="p">Sh:交握通訊</p>  
        <p type="p">Bp:電池參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="525" publication-number="202620730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貨櫃碼頭船邊裝卸配對輔助系統、方法及電腦程式產品</chinese-title>  
        <english-title>ASSISTANT SYSTEM AND METHOD FOR SHIPSIDE LOADING AND UNLOADING MATCHING AT CONTAINER PORT AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241231B">G06Q10/083</main-classification>  
        <further-classification edition="200601120241231B">B65G67/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊偉志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏勝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIA, SHENG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐綉瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, HSIU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一種貨櫃碼頭船邊裝卸配對輔助系統、方法及電腦程式產品。當起重機進行貨櫃吊掛裝卸作業時，貨櫃特徵辨識模組取得由起重機所吊掛之貨櫃的貨櫃辨識資訊；複數個拖車定位模組與起重機定位模組則分別回報複數個拖車定位資訊與起重機定位資訊給配對模組；配對模組依據複數個拖車定位資訊與起重機定位資訊決定出符合條件的拖車，進而與貨櫃進行配對，以送出配對結果給理貨人員參考。本系統實現貨櫃與拖車之自動化配對技術，藉以減少人工查驗的疏失並改善貨櫃錯誤吊掛的情況，更可提高貨櫃裝卸的正確性並加速貨櫃碼頭作業的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An assistant system and an assistant method for shipside loading and unloading matching at a container port and a computer program product are disclosed. When a crane performs container hanging and loading/ unloading operations, a container feature identification module is configured to obtain a container identification information of a container hung on the crane; a plurality of truck positioning modules and a crane positioning module are configured to reply a plurality of truck positioning information and a crane positioning information, respectively, to a matching module; the matching module is configured to determine a truck that meets a condition based on the plurality of truck positioning information and the crane positioning information, and then to match the truck with the container to send a matching result to a tally staff for reference. This system realizes the automatic matching technology of containers and trucks, thereby reducing the manual inspection errors and improving the situation of wrongly hanging containers. It can also improve the accuracy of container loading and unloading and speed up the efficiency of container port operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:貨櫃特徵辨識模組</p>  
        <p type="p">22:起重機定位模組</p>  
        <p type="p">23a、23b、23c:拖車定位模組</p>  
        <p type="p">24:配對模組</p>  
        <p type="p">25:讀取裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="526" publication-number="202621526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹俊德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHAN, JYUN-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇品境</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, PIN-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧汶瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪良易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, LIANG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要在電子元件之非作用面上定義有第一區域及第二區域，該第一區域為非作用面之中心區域，該第二區域為非作用面之外圍區域，並將第一導熱介面材設於該第一區域，且將第二導熱介面材設於該第二區域，以供後續將散熱結構接置於該第一導熱介面材及該第二導熱介面材上時，得以減少應力及翹曲產生，同時強化導熱介面材與散熱結構之間的黏著力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and manufacturing method thereof is provided, which define a first area and a second area on non-active surface of an electronic component. The first area is the central area of the non-active surface, and the second area is the peripheral area of the non-active surface. A first thermally conductive interface material is provided in the first area, and a second thermally conductive interface material is provided in the second area, so that when a heat dissipation structure can be subsequently connected to the first thermally conductive interface material and the second thermally conductive interface material, the stress and warpage can be reduced, and the adhesion between the thermal interface material and the heat dissipation structure can be strengthened.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">21:承載結構</p>  
        <p type="p">213:膠黏層</p>  
        <p type="p">22:電子元件</p>  
        <p type="p">23:第一導熱介面材</p>  
        <p type="p">24:第二導熱介面材</p>  
        <p type="p">25:散熱結構</p>  
        <p type="p">251:頂片</p>  
        <p type="p">252:支撐腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="527" publication-number="202620608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筆記型電腦及其控制方法</chinese-title>  
        <english-title>NOTEBOOK COMPUTER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">G06F3/041</main-classification>  
        <further-classification edition="200601120250320B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾緒祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHYU, RUEY-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱培序</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PEI-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂政閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, CHENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種筆記型電腦及其控制方法。筆記型電腦之控制方法包括以下步驟。以一觸控板之一外環感測線路及一觸控感測線路感測一觸控筆與觸控板之一近接距離。依據觸控筆與觸控板之近接距離，控制觸控板之一振動單元之一可振程度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A notebook computer and a control method thereof are provided. The control method of the notebook computer includes the following steps. An outer ring sensing circuit and a touch sensing circuit of a touch panel are used to sense a proximity distance between a stylus and the touch panel. A vibrating degree of a vibration unit of the touch panel is controlled according to the proximity distance between the stylus and the touch panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="528" publication-number="202620153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶</chinese-title>  
        <english-title>ADHESIVE TAPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241121B">C09J11/06</main-classification>  
        <further-classification edition="201801120241121B">C09J7/30</further-classification>  
        <further-classification edition="200601120241121B">B32B7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長興材料工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETERNAL MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡安益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, AN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡育朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李侑勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YU-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊郁沁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種黏著帶，其包含基材及設置於該基材上之黏著劑組合物，其中該黏著劑組合物包含丙烯酸系樹脂、交聯劑及羅氏一型光起始劑，其中體積為約36 mm &lt;sup&gt;3&lt;/sup&gt;之該黏著劑組合物，於標準狀態下、20 ml之密閉空間內，經波長為365 nm之紫外光輻射固化後所產生之該羅氏一型光起始劑之裂片含量，以氣相層析-質譜法量測為小於10 ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an adhesive tape comprising a base material and an adhesive composition disposed on the base material. The adhesive composition comprises an acrylic resin, a crosslinking agent, and a Norrish-type I photoinitiator. After UV radiation curing at a wavelength of 365 nm, the adhesive composition with a volume of approximately 36 mm³ generates a split content of the Norrish-type I photoinitiator in a sealed space of 20 ml under standard conditions, measured by gas chromatography-mass spectrometry (GC-MS), which is less than 10 ppm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="529" publication-number="202621124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於載具的影像同步方法以及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE OF SYNCHRONIZING IMAGES APPLIED TO VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H04N23/60</main-classification>  
        <further-classification edition="200601120250303B">H04N7/18</further-classification>  
        <further-classification edition="202201120250303B">B60R1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弘真科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NETKLASS TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用於載具的影像同步方法，包括：根據多個攝影電路與處理器之間的多個延遲時間計算載具上的記憶體中的多個緩衝佇列各自的緩衝幀數；經由傳輸電路控制多個攝影電路以多個拍攝方向分別拍攝載具周圍以產生多個影像串流，並控制傳輸電路將多個影像串流分別傳送至多個緩衝佇列；檢測各緩衝佇列中暫存的影像串流的佇列幀數；以及根據各緩衝佇列的緩衝幀數以及佇列幀數判斷是否取出多個緩衝佇列中各自暫存的影像串流的首幀，進而將所有首幀合併為合併影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of synchronizing images applied to vehicles is disclosed, which includes: calculating a buffer frame number for each of multiple buffer queues in a memory of a vehicle based on multiple delay times between multiple camera circuits and a processor; controlling the multiple camera circuits through a transmission circuit to shoot around the vehicle in multiple shooting directions to generate multiple image streams, and controlling the transmission circuit to respectively transmit the multiple image streams to the multiple buffer queues in the memory; detecting a queue frame number of the image stream temporarily stored in each of the multiple buffer queues; determining whether to capture a top frame of the image stream temporarily stored in each of the multiple buffer queues based on the buffer frame numbers and the queue frame numbers, thereby combining all top frames into a combined image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410~S460:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="530" publication-number="202619983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效率穩定製作小分子團活化水的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">C02F1/48</main-classification>  
        <further-classification edition="202301120241202B">C02F1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴大立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴大立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂文勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高效率穩定製作小分子團活化水的方法，設有一具入水口及出水口的水槽本體，內部形成儲水空間；設有一水過濾單元及一濁度監測單元於儲水空間，並裝置於靠近入水口處；設有一陶瓷、礦物及磁性複合材料組成之纖維網布及網布輸送裝置，使纖維網布能於網布輸送裝置各滾輪上受驅動馬達啟動作輸送，令纖維網布輸送過程一部分沉浸於水中，另一部分露出於水面；設有一遠紅外線光源裝置及一通磁裝置，使纖維網布輸送過程受遠紅外線光源裝置及通磁裝置作用；藉此，通過相關電子迴路與電控程式及監測裝置整合監控後，纖維網布受遠紅外線光源裝置照射及一通磁裝置作用後賦含能量源，使纖維網布於水中對水進行過濾，達到能高效率且穩定產製小分子團水的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:水槽本體</p>  
        <p type="p">11:入水口</p>  
        <p type="p">12:出水口</p>  
        <p type="p">13:儲水空間</p>  
        <p type="p">20:水過濾單元</p>  
        <p type="p">30:濁度監測單元</p>  
        <p type="p">40:陶瓷、礦物及磁性複合材料組成之纖維網布</p>  
        <p type="p">50:網布輸送裝置</p>  
        <p type="p">51:主動滾輪</p>  
        <p type="p">52:從動滾輪</p>  
        <p type="p">54:遠紅外線光源裝置</p>  
        <p type="p">55:通磁裝置</p>  
        <p type="p">56:底板</p>  
        <p type="p">541、551:狹縫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="531" publication-number="202619660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烤肉爐</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">A47J37/07</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨量資產管理有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何湘茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種烤肉爐，包含一爐架單元、一燃料架單元及一遮蔽單元。該爐架單元包括多數架板，該等架板圍繞形成出一容置空間，每一架板具有一貫穿區域。該燃料架單元包括多數燃料架組，每一燃料架組具有一圍壁及一集灰盒，該圍壁具有多數網孔。該遮蔽單元包括多數互相組接且分別設置於所對應的燃料架組外的遮板，每一遮板具有多數可連通至所對應的網孔的透氣孔。整體結構簡單，且可達到無煙烤肉目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:爐架單元</p>  
        <p type="p">11:架板</p>  
        <p type="p">117:插槽</p>  
        <p type="p">20:燃料架單元</p>  
        <p type="p">201:燃料架組</p>  
        <p type="p">21:圍壁</p>  
        <p type="p">22:燃料室</p>  
        <p type="p">221:容室</p>  
        <p type="p">23:隔框件</p>  
        <p type="p">24:集灰盒</p>  
        <p type="p">25:網孔</p>  
        <p type="p">30:遮蔽單元</p>  
        <p type="p">31:遮板</p>  
        <p type="p">32:樞軸</p>  
        <p type="p">40:吊掛單元</p>  
        <p type="p">41:主掛架</p>  
        <p type="p">42:叉桿</p>  
        <p type="p">50:集油盒</p>  
        <p type="p">60:木炭</p>  
        <p type="p">L:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="532" publication-number="202620765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>進銷項或其他憑證OCR資料萃取方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241122B">G06Q40/12</main-classification>  
        <further-classification edition="202301120241122B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上百整合行銷有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕縢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕縢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王朝鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種進銷項或其他憑證OCR資料萃取方法，包括以下步驟：先將一憑證之圖像檔轉換爲一憑證字串；接着建立一資訊項目清單；然後藉由一處理單元套用文字萃取方法從憑證字串萃取會計資訊及金額資料，並核驗會計資訊之資訊格式是否正確，在將資訊格式正確的會計資訊寫回對應的會計項目；最後以一檢核單元驗證金額資料並判斷金額資料是否異常。本發明以多種文字萃取方式精準萃取會計資訊，縮短資料萃取時間，並同步核驗會計資訊，提高申報準確率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S114:步驟流程圖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="533" publication-number="202620803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>進銷項及其他憑證辨識系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241121B">G06V30/20</main-classification>  
        <further-classification edition="202201120241121B">G06V30/10</further-classification>  
        <further-classification edition="202201120241121B">G06V10/40</further-classification>  
        <further-classification edition="202301120241121B">G06Q40/12</further-classification>  
        <further-classification edition="201201120241121B">G06Q30/04</further-classification>  
        <further-classification edition="202301120241121B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上百整合行銷有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕縢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕縢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王朝鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種進銷項及其他憑證辨識系統，包括有一憑證影像處理單元、一憑證分析中心及一辨識結果顯示程式。憑證影像處理單元將一進銷項憑證生成一圖像檔。憑證分析中心接收圖像檔，同時建立一憑證單元，並於憑證單元內建立一申報用資訊項目清單，圖像檔於一雲端平台經光學字元辨識，產生一文字資訊，再回傳至憑證單元。憑證分析中心還包括一文字處理單元，從文字資訊萃取憑證資訊，藉由憑證分析中心檢核並判斷憑證資訊是否異常，再寫入憑證單元中。辨識結果顯示程式於一終端控制裝置顯示辨識結果，以供用戶核對及調整憑證資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:進銷項資料分開之營業稅申報程式</p>  
        <p type="p">11:銷項憑證資料介面</p>  
        <p type="p">12:進項憑證資料介面</p>  
        <p type="p">2:憑證影像處理單元</p>  
        <p type="p">3:憑證分析中心</p>  
        <p type="p">31:憑證單元</p>  
        <p type="p">311:圖像檔</p>  
        <p type="p">312:文字資訊</p>  
        <p type="p">32:申報用資訊項目清單</p>  
        <p type="p">33:文字處理單元</p>  
        <p type="p">34:核驗單元</p>  
        <p type="p">4:辨識結果顯示程式</p>  
        <p type="p">41:辨識結果總覽介面</p>  
        <p type="p">43:辨識結果檢核介面</p>  
        <p type="p">100:終端控制單元</p>  
        <p type="p">200:伺服器</p>  
        <p type="p">300:雲端平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="534" publication-number="202619642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具任意卡固功能之置物袋</chinese-title>  
        <english-title>STORAGE BAG WITH ARBITRARY LOCKING FUNCTIONALITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A45C13/10</main-classification>  
        <further-classification edition="200601120241130B">A45F3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡若鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JO-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIA-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晶瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴天琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具任意卡固功能之置物袋包含袋體、基座、滑槽 &lt;u&gt;及&lt;/u&gt;卡固座。基座設置於袋體中。物體放置於基座之表面上。卡固座可位移式設於基座上之滑槽上。卡固座包含中空滑座、第一彈性元件及伸縮擋桿，其中中空滑座之底側可動式設於滑槽中，伸縮擋桿藉由第一彈性元件可伸縮式設於中空滑座之凹槽中且伸縮擋桿之頂側可伸縮式凸出於該基座之該表面。置物袋更包含第二彈性元件用以連接相鄰之卡固座。當卡固座沿著滑槽移動至物體之外側後，即可自動使得伸縮擋桿之頂側凸出於基座之表面，藉以隨著物體之外形卡固物體之外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A storage bag with arbitrary locking functionality comprises a bag body, a base, a sliding groove, and a locking seat. The base is installed within the bag body. An object is placed on the surface of the base. The locking seat is movably installed on a sliding groove of the base. The locking seat includes a hollow sliding seat, a first elastic element, and a retractable stopper rod. The bottom side of the hollow sliding seat is movably installed in the sliding groove, and the retractable stopper rod is telescopically installed in the recess of the hollow sliding seat by the first elastic element, with the top side of the retractable stopper rod telescopically protruding from the surface of the base. The storage bag also includes a second elastic element for connecting two adjacent locking seats. When the locking seat moves a position corresponding to the outer side of the object along the sliding groove, the top side of the retractable stopper rod automatically protrudes from the surface of the base, securing the outer side of the object along its shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:袋體</p>  
        <p type="p">20:基座</p>  
        <p type="p">22:表面</p>  
        <p type="p">30:滑槽</p>  
        <p type="p">40:卡固座</p>  
        <p type="p">42:中空滑座</p>  
        <p type="p">43:凹槽</p>  
        <p type="p">46:伸縮擋桿</p>  
        <p type="p">50:第二彈性元件</p>  
        <p type="p">70:連接板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="535" publication-number="202619656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動沖泡機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">A47J31/06</main-classification>  
        <further-classification edition="200601120250117B">A47J31/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興日光股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張千偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種自動沖泡機，其包含一機殼，機殼具有一前開口及一下開口；一浸泡腔，其具有一腔口、一排水孔及至少一注水孔，浸泡腔設置於機殼內且腔口與前開口相連通，排水孔與下開口相連通；一過濾組件，其包含一濾筒、一驅動裝置及一傳動件，濾筒可轉動的設置於浸泡腔內，驅動裝置設置於浸泡腔，傳動件的一端連接濾筒，另一端連接驅動裝置；一供水部，其包含一鍋爐、一泵浦、一第一閥體及一主管路，主管路連接鍋爐、泵浦、第一閥體及注水孔，並可將鍋爐內的液體輸送到浸泡腔內；藉由將水輸送進入到浸泡腔時，驅動濾筒旋轉，使得濾筒中的茶葉透過離心力及浮力可懸浮於濾筒中產生較為蓬鬆的狀態，藉此達到進水後水流可快速無阻礙的填充於茶葉之間，具有均勻沖泡茶葉之功效，避免茶葉產生浸泡時間不一而影響茶湯味之情形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機殼</p>  
        <p type="p">14:前開口</p>  
        <p type="p">15:後開口</p>  
        <p type="p">16:下開口</p>  
        <p type="p">30:開閉門</p>  
        <p type="p">60:控制面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="536" publication-number="202620893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於各睡眠階段心電圖分析的失眠偵測方法</chinese-title>  
        <english-title>METHOD FOR INSOMNIA DETECTION BASED ON ELECTROCARDIOGRAM ANALYSIS ACROSS DIFFERENT SLEEP STAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250123B">G16H50/00</main-classification>  
        <further-classification edition="200601120250123B">A61B5/02</further-classification>  
        <further-classification edition="202301120250123B">G06N3/0464</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明基於各睡眠階段心電圖分析的失眠偵測方法，包含有訊號預處理及偵測分類等步驟，即先對輸入之受測者的整晚睡眠心電圖訊號進行分類、區分及合併分段後，以取得三個睡眠階段之30秒鐘心電圖訊號，並以卷積神經網路技術之深度學習模型與配合演算之損失函數、優化器建立為偵測模型，且採用睡眠資料庫所提供選自不同受測者的心電圖訊號，建立對該深度學習模型進行訓練、驗證與測試之所需的資料集，以取得最佳化模型，再以最佳化模型對取得之三個睡眠階段的心電圖訊號進行演算、分析的偵測處理，最終輸出分類結果，有效提升分類準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for insomnia detection based on electrocardiogram analysis across different sleep stages includes a signal preprocessing step and a detection and classification step. The inputted full-night sleep electrocardiogram signal of a subject is classified, distinguished, combined and divided to thereby obtain thirty-seconds electrocardiogram signals of three sleep stages. A deep-learning model based on the convolutional neural network technology is cooperated with loss function and an optimizer that are applied for calculation to build a detection model. Electrocardiogram signals of different subjects in a sleep database are adapted to build a data collection which is applied to train, verify, and test the deep-learning model, thereby obtaining the optimum model. The optimum model is adapted to conduct a detection treatment of calculation and analysis of the electrocardiogram signals of three sleep stages, and further output an result of classification, thereby effectively improving the accuracy of classification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:基於各睡眠階段心電圖分析的失眠偵測方法</p>  
        <p type="p">31:訊號預處理</p>  
        <p type="p">32:偵測分類</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="537" publication-number="202621009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力直線運動發電機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H02K7/06</main-classification>  
        <further-classification edition="200601120241231B">H02K7/116</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾達輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾達輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動力直線運動發電機構，其包含：一直線運動單元，其包括有一軸體及一滑設於該軸體上的滑移件，該滑移件樞設有一連桿，該連桿的另一端樞設有一塊體，該滑移件連接一動力單元。一齒輪傳動單元，其包括有一內齒輪及一與該內齒輪嚙合的齒輪，該齒輪與該塊體結合，以及一發電單元，其包括有一傳動模組及一發電模組，該傳動模組包括有一驅動軸及一與該驅動軸結合的驅動輪，該齒輪的中心與該驅動輪樞接，該驅動軸與該發電模組連接，藉由該動力單元推動該滑移件於該軸體上往復移動，該連桿帶動該齒輪於該內齒輪中移轉動，同時該齒輪帶動該驅動輪轉動，該驅動輪與該驅動軸同步旋轉，以帶動該發電模組而產生電力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:直線運動單元</p>  
        <p type="p">11:軸體</p>  
        <p type="p">111:固定座</p>  
        <p type="p">112:板體</p>  
        <p type="p">12:滑移件</p>  
        <p type="p">121:線性軸承</p>  
        <p type="p">122:驅動滑塊</p>  
        <p type="p">13:連桿</p>  
        <p type="p">14:塊體</p>  
        <p type="p">141:第一段部</p>  
        <p type="p">142:第二段部</p>  
        <p type="p">20:齒輪傳動單元</p>  
        <p type="p">21:內齒輪</p>  
        <p type="p">211:墊塊</p>  
        <p type="p">22:齒輪</p>  
        <p type="p">312:驅動輪</p>  
        <p type="p">313:鏈條</p>  
        <p type="p">32:發電模組</p>  
        <p type="p">321:齒輪箱</p>  
        <p type="p">322:發電機馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="538" publication-number="202620799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>邊坡監測之方法</chinese-title>  
        <english-title>METHODS OF SLOPE MONITORING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250120B">G06V20/13</main-classification>  
        <further-classification edition="200601120250120B">G01S13/87</further-classification>  
        <further-classification edition="200601120250120B">G01S13/89</further-classification>  
        <further-classification edition="200601120250120B">G01V8/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣世曦工程顧問股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CECI ENGINEERING CONSULTANTS, INC., TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柔妃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ROU-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭弘翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李魁士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, KWEI-SHR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUG, CHIA-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種邊坡監測之方法，透過整合多顆不同波長之衛星，其透過第一衛星於第一時間擷取目標地理區域產生第一影像並傳輸至控制單元，第一衛星於第二時間擷取目標地理區域產生第二影像並傳輸至控制單元，控制單元對第一影像以及第二影像進行影像對篩選，控制單元對第一影像以及第二影像進行配准，產生合併影像，並計算合併影像之相位，並刪除誤差，控制單元從合併影像中取得地表特徵值，並對地表特徵值進行離群檢測方法，以取得誤差觀測量，控制單元將誤差觀測量刪除後解算合併影像，並以此取得地表變形資訊，後續針對活動動性高的區塊，採用雷達角反射器與GNSS聯合監測演算方法，複核邊坡變形資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a method for slope monitoring, which integrates multiple satellites of different wavelengths. The first satellite captures the target geographic area to generate a first image at the first time and transmits it to the control unit. At the second time, the first satellite captures the target geographic area to generate a second image and transmits it to the control unit. The control unit filters and registers the first and second images to produce a merged image, calculates the phase of the merged image, and removes errors. The control unit obtains surface feature values from the merged image and conducts outlier detection on these values to obtain error observation quantities. After removing the error observation quantities, the control unit computes the merged image to obtain surface deformation information. For areas with high activity, a radar corner reflector and GNSS joint monitoring algorithm are employed to review slope deformation information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10-S70:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="539" publication-number="202620980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多件式電連接器</chinese-title>  
        <english-title>MODULAR ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H01R13/506</main-classification>  
        <further-classification edition="201101120241230B">H01R12/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐虞企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞唐虞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃睦容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多件式電連接器，該多件式電連接器係可設置於電子設備中以傳輸訊號，該多件式電連接器係由多件的電連接器子構件組合而構成，因此，在該多件式電連接器設計完成後，仍然可以藉由調整組合的多件電連接器子構件，而達成客製化調整電連接器的對接結構與導電端子數量，使該多件式電連接器可以適用於各式電子設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modular electrical connector designed to be installed in electronic devices for signal transmission, this multi-component electrical connector is assembled from multiple sub-connector components. This modular structure allows for customization even after the design is complete. By adjusting the combination of sub-connector components, the connector’s mating structure and number of conductive terminals can be tailored, making it adaptable for various electronic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多件式電連接器</p>  
        <p type="p">11:主要電連接器子構件</p>  
        <p type="p">111:主要絕緣膠芯</p>  
        <p type="p">1111:主要膠芯對接埠</p>  
        <p type="p">11110:主要膠芯對接埠端子穿設空間</p>  
        <p type="p">1112:主要膠芯端子定位結構</p>  
        <p type="p">12:次要電連接器子構件</p>  
        <p type="p">12110:次要膠芯對接埠端子穿設空間</p>  
        <p type="p">A:電連接器膠芯對接埠總成</p>  
        <p type="p">2:主要導電線材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="540" publication-number="202620909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繞線結構及包含繞線結構的磁性元件</chinese-title>  
        <english-title>WINDING STRUCTURE AND MAGNETIC COMPONENT INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">H01F27/28</main-classification>  
        <further-classification edition="200601120250117B">H01F27/30</further-classification>  
        <further-classification edition="200601120250117B">H01F27/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘俊智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, JUN-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳名章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種繞線結構包含繞線架、第一繞組及第二繞組。繞線架包含兩葉片及連接在兩葉片之間的繞線軸，繞線軸包含第一區段及第二區段。第一繞組包含纏繞於繞線軸的第一區段的第一線段、連接第一線段的一端的第一引線端、纏繞於繞線軸的第二區段的第二線段、連接第二線段的一端的第二引線端、以及連接在第一、第二線段之間第四線段。第二繞組包含第三引線端、第四引線端以及連接在第三、第四引線端之間的第三線段，第三線段纏繞於繞線軸的第二區段，並與第一繞組的第二線段堆疊設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A winding structure includes a bobbin, a first winding and a second winding. The bobbin includes two blades and a winding shaft connected between the two blades and including two sections. The first winding includes (1) a first wire segment wound on a first section of the winding shaft, (2) a first terminal portion connected to one end of the first wire segment, (3) a second wire segment wound on a second section of the winding shaft, (4) a second terminal portion connected to one end of the second wire segment, and (4) a fourth wire segment connected between the first and second wire segments. The second winding includes a third terminal portion, a fourth terminal portion, and a third wire segment connected between the third and fourth terminal portions. The third wire segment is wound on the second section of the winding shaft and is in a stack arrangement with the second wire segment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:鐵芯</p>  
        <p type="p">30:繞線架</p>  
        <p type="p">31:第一區段</p>  
        <p type="p">32:第二區段</p>  
        <p type="p">33:繞線軸</p>  
        <p type="p">35:葉片</p>  
        <p type="p">54:第四線段</p>  
        <p type="p">56:第一線段</p>  
        <p type="p">57:第二線段</p>  
        <p type="p">65:第三線段</p>  
        <p type="p">R:軸向</p>  
        <p type="p">W1:第一繞線寬度</p>  
        <p type="p">W2:第二繞線寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="541" publication-number="202620839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖像畫質調節裝置及圖像畫質調節方法</chinese-title>  
        <english-title>IMAGE QUALITY ADJUSTMENT DEVICE AND IMAGE QUALITY ADJUSTMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G09G5/39</main-classification>  
        <further-classification edition="202401120250303B">G06T5/90</further-classification>  
        <further-classification edition="202401120250303B">G06T5/60</further-classification>  
        <further-classification edition="200601120250303B">G06T1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾鷺輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, LU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈劍楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, JIAN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭貴鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUEI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供一種圖像畫質調節方法，包括：獲取當前幀圖像；識別所述當前幀圖像中的目標物件及確認其在所述當前幀圖像中佔據的目標區域；當所述目標區域在所述當前幀圖像中的面積比例超過閾值時，確定所述目標區域的目標區域畫質參數和所述當前幀圖像中的非目標區域的非目標區域畫質參數，其中所述目標區域畫質參數和所述非目標區域畫質參數不同，所述非目標區域為所述當前幀圖像中目標區域之外的至少部分區域。本申請藉由對目標區域和非目標區域施加不同的畫質參數進行畫質調節，可提升圖像顯示效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment of the present application provides an image quality adjustment method that includes: obtaining a current frame image; identifying a target object in the current frame image and determining the target area occupied by the target object within the current frame image; when an area ratio of the target area in the current frame image exceeds a threshold value, determining a target area quality parameter for the target area and a non-target area quality parameter for the non-target area in the current frame image, where the target area quality parameter is different from the non-target area quality parameter, and the non-target area comprises at least part of the area outside the target area in the current frame image. The present application enhances image display effects by applying different quality parameters to the target area and the non-target area for image quality adjustment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21~S26:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="542" publication-number="202621066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊系統以及通訊方法</chinese-title>  
        <english-title>COMMUNICATION SYSTEM AND COMMUNICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04B7/185</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種通訊系統以及通訊方法。此通訊方法包括：經由系統參數，預先得到一頻域補償參數以及一時域補償參數；以及，在主要同步訊號廣播之後，透過上述補償參數，調整原始的預設頻帶與預設時間，並據以在基地台進行接收訊號，以補償頻率偏移以及時間延遲。在一較佳實施例中，此方法還包括：計算出多個相似度計量，據以判斷出是否存在一處於活動狀態的特定使用者設備，並透過峰值搜尋，獲得對應於特定使用者設備的殘餘頻率誤差估計值以及殘餘時間誤差估計值。傳送上述估計至使用者設備，以提供使用者設備進行必要的調整。 &lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication system and a communication method are provided in the embodiments of the present invention. The method includes: pre-acquiring frequency and time domain compensation parameters based on system parameters. After broadcasting the primary synchronization signal, the original preset frequency band and time are adjusted using these parameters to compensate for a common frequency offset and a common time delay at the base station. In the preferred embodiment, the method further includes: calculating likelihood measures to identify active user equipment; performing peak searching to estimate residual frequency and time errors; and communicating these estimates to the user equipment for necessary adjustments. &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1501~S1505:本發明一較佳實施例的通訊方法之流程步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="543" publication-number="202619823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於摩擦攪拌焊接的收尾孔填料方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">B23K20/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中興電工機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG HSIN ELECTRIC &amp; MACHINERY MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鴻濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於摩擦攪拌焊接的收尾孔填料方法，包括以下步驟：提供一分離式鑽頭；使用一治具連接該分離式鑽頭；移動該治具，使該分離式鑽頭壓接進入一工件的收尾孔；以及旋轉該治具，使該分離式鑽頭與該收尾孔的周緣發生摩擦攪拌，直至該分離式鑽頭融合於該工件。本發明的用於摩擦攪拌焊接的收尾孔填料方法可以徹底解決摩擦攪拌銲接所產生的收尾孔缺陷問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S108:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="544" publication-number="202620363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車用水冷散熱器</chinese-title>  
        <english-title>AUTOMOBILE LIQUID-COOLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">F28F9/26</main-classification>  
        <further-classification edition="200601120250121B">F28F9/00</further-classification>  
        <further-classification edition="200601120250121B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾姆勒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMULAIRE THERMAL TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊景明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHING-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊瑞珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, REUI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車用水冷散熱器包括上蓋及下蓋。上蓋及下蓋之間形成有供冷卻液流動的彎曲狀流道，且彎曲狀流道具有相間隔的多個流道腔及至少兩個連通於多個流道腔的水孔。上蓋及下蓋之間形成有圍繞彎曲狀流道的第一雷射焊接結構，且上蓋及下蓋於相間隔的流道腔與流道腔之間形成有第二雷射焊接結構。下蓋具有相對的第一接觸面及第二接觸面，下蓋的第一接觸面接觸流過多個流道腔的冷卻液，下蓋的第二接觸面形成有多個凸台，至少有兩個凸台形狀與其他的凸台形狀不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automobile liquid-cooler includes a top cover and a bottom cover. A curved flow channel for a coolant to flow is formed between the top cover and the bottom cover, and the curved flow channel has a plurality of flow cavities arranged at intervals and at least two water holes communicated with the plurality of flow cavities. A first laser welding structure surrounding the curved flow channel is formed between the top cover and the bottom cover, and a second laser welding structure is formed between the top cover and the bottom cover and is located between the flow cavities arranged at intervals. The bottom cover has a first contact surface and a second contact surface opposite to each other. The first contact surface of the bottom cover contacts the coolant in the flow channel cavities. The second contact surface of the bottom cover is formed with a plurality of bumps, at least two of which are different in shape from the other bumps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:上蓋</p>  
        <p type="p">3:彎曲狀流道</p>  
        <p type="p">31:流道腔</p>  
        <p type="p">32:水孔</p>  
        <p type="p">4:第一雷射焊接結構</p>  
        <p type="p">5:第二雷射焊接結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="545" publication-number="202621044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻濾波器</chinese-title>  
        <english-title>RADIO FREQUENCY FILTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250208B">H03H7/01</main-classification>  
        <further-classification edition="200601120250208B">H03H9/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立積電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊金龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種射頻濾波器，包括第一收發端、第二收發端、第一串聯諧振器、至少一第一並聯諧振器、至少一第二並聯諧振器、第一電容、第二電容、第一電感、第二電感及第三電感。第一串聯諧振器耦接於第一收發端與第二收發端之間，至少一第一並聯諧振器耦接於第一串聯諧振器與第一節點之間，至少一第二並聯諧振器耦接於第一串聯諧振器與第二節點之間，第一電容與至少一第一並聯諧振器並聯，第二電容與至少一第二並聯諧振器並聯，第一電感耦接於第一收發端，第二電感耦接於第二收發端，第三電感耦接於第一電感與參考節點之間及第二電感與參考節點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radio frequency filter includes a first transceiver terminal, a second transceiver terminal, a first series resonator, at least a first parallel resonator, at least a second parallel resonator, a first capacitor, a second capacitor, a first inductor, a second inductor and a third inductor. The first series resonator is coupled between the first transceiver terminal and the second transceiver terminal. The at least one first parallel resonator is coupled between the first series resonator and a first node. The at least one second parallel resonator is coupled between the first series resonator and a second node. The first capacitor is coupled in parallel with the at least one first parallel resonator. The second capacitor is coupled in parallel with at least one second parallel resonator. The first inductor is coupled to the first transceiver terminal. The second inductor is coupled to the second transceiver terminal. The third inductor is coupled between the first inductor and a reference node and between the second inductor and the reference node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:射頻濾波器</p>  
        <p type="p">S1至S6:串聯諧振器</p>  
        <p type="p">P1至P6:並聯諧振器</p>  
        <p type="p">C1、C2:電容</p>  
        <p type="p">L1至L7:電感</p>  
        <p type="p">Lp:電感</p>  
        <p type="p">LM1、LM2:匹配電感</p>  
        <p type="p">CM1、CM2:匹配電容</p>  
        <p type="p">TR1、TR2:收發端</p>  
        <p type="p">N1至N6:節點</p>  
        <p type="p">Nref:參考節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="546" publication-number="202620746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動提款機操作驗證方法及其運算裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241206B">G06Q20/40</main-classification>  
        <further-classification edition="201201120241206B">G06Q20/34</further-classification>  
        <further-classification edition="202301120241206B">G06Q40/02</further-classification>  
        <further-classification edition="200601120241206B">G07F19/00</further-classification>  
        <further-classification edition="202201120241206B">G06V40/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>第一商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIRST COMMERCIAL BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉韋杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝忠欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動提款機操作驗證方法，藉由一運算裝置實施，該運算裝置經由一通訊網路連接一自動提款機，該運算裝置儲存有數個對應數個客戶的帳戶資訊，及數個對應該等帳戶資訊且用於評估一使用者之操作行為的風險預測模型，每當該運算裝置接收到來自該自動提款機且相關於一待分析客戶對該自動提款機之操作行為的一行為資料時，該運算裝置根據該行為資料利用對應於一目標帳戶資訊的該風險預測模型得到一相關於該待分析客戶之該行為資料的風險估計並判定該風險估計是否超過一風險閾值，從而防範以自動提款機盜領財物的可能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21~26:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="547" publication-number="202620682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料管理系統及資料管理方法</chinese-title>  
        <english-title>DATA MANAGEMENT SYSTEM AND DATA MANAGEMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250208B">G06F21/60</main-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification>  
        <further-classification edition="202301120250208B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉山商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳照元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖子慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TZU-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴竹君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛子珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, TZU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鉦育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料管理系統，包含一儲存單元及與其電連接的一處理單元。儲存單元儲存多個具有一使用者權限的使用者帳號及一具有一管理者權限的管理者帳號，且包含多個分別對應於該等使用者帳號的資料上傳區及一資料讀取區。使用者權限允許各使用者帳號寫入對應的資料上傳區及讀取資料讀取區的資料，且禁止各使用者帳號寫入資料讀取區及非對應的該等資料上傳區。管理者權限允許管理者帳號讀取該等資料上傳區的資料及寫入資料讀取區，且禁止管理者帳號寫入該等資料上傳區。處理單元根據使用者權限及管理者權限管制使用者帳號或管理者帳號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data management system comprises a storage unit and a processing unit electrically connected thereto. The storage unit stores a plurality of user accounts each having a user access and an administrator account having an administrator access and comprises a plurality of data uploading areas which correspond respectively to the user accounts and a data reading area. The user access allows each of the user accounts to write a corresponding one of the data uploading areas and to read data from the data reading area, and prohibits each of the user accounts from writing into the data reading area and a non-corresponding one of the data uploading areas. The administrator access allows the administrator account to read data from the data uploading areas and to write into the data reading areas, and prohibits the administrator account from writing into the data uploading areas. The processing unit controls the user account or the administrator account in accordance with the user access and the administrator access.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:資料管理系統</p>  
        <p type="p">1:儲存單元</p>  
        <p type="p">11:資料上傳區</p>  
        <p type="p">12:資料讀取區</p>  
        <p type="p">2:處理單元</p>  
        <p type="p">200:終端電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="548" publication-number="202620740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>信用卡遞延交易管理方法及其系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250303B">G06Q20/24</main-classification>  
        <further-classification edition="201201120250303B">G06Q20/34</further-classification>  
        <further-classification edition="201201120250303B">G06Q20/38</further-classification>  
        <further-classification edition="202301120250303B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱基商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張焜泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉麗玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙質信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉玫蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘芷棻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祐鋌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種信用卡遞延交易管理系統，適用於一信用卡交易裝置及一信用卡交易伺服器，該信用卡遞延交易管理系統包含一遞延交易管理伺服器及一核銷驗證伺服器。該遞延交易管理伺服器接收該刷卡資訊及該遞延交易資訊以建立一遞延交易紀錄，接著，該核銷驗證伺服器接收該遞延交易資訊並傳送該遞延交易資訊到該遞延交易管理伺服器，若該遞延交易管理伺服器依據該遞延交易資訊檢核對應之該遞延交易紀錄存在而判定同意核銷，則更新該遞延交易資訊及傳送一同意核銷訊息至該核銷驗證伺服器，該核銷驗證伺服器傳送一核銷驗證成功訊息至該信用卡交易裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:信用卡遞延交易管理系統</p>  
        <p type="p">11:遞延交易管理伺服器</p>  
        <p type="p">12:核銷驗證伺服器</p>  
        <p type="p">2:信用卡交易裝置</p>  
        <p type="p">3:信用卡交易伺服器</p>  
        <p type="p">4:電子裝置</p>  
        <p type="p">5:電信網路伺服器</p>  
        <p type="p">6:行動通訊裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="549" publication-number="202620788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像收集方法及影像擷取裝置</chinese-title>  
        <english-title>IMAGE COLLECTION METHODS AND IMAGE CAPTURE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06T17/00</main-classification>  
        <further-classification edition="201701120250303B">G06T7/50</further-classification>  
        <further-classification edition="201701120250303B">G06T7/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃羿寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林應誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YIN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳欣怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何丹期</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, TAN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像收集方法及影像擷取裝置。該方法包括：根據已擷取的目標物件的一或多個第一影像，獲取一或多個第一影像各自的第一涵蓋密度資料，以決定一或多個再拍攝位置；根據一或多個再拍攝位置，渲染對應一或多個再拍攝位置的一或多個拍攝位置建議標記於影像擷取裝置所即時顯示的對應現實空間的畫面內；以及若影像擷取裝置的當前位置及當前視角符合目標拍攝位置建議標記，自動對目標物件擷取對應目標拍攝位置建議標記的目標第二影像。藉此，本公開提供一種能夠有效引導使用者完成3D物件建模所需之影像收集的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image collection method and an image capturing device. The method includes: obtaining first coverage density data of one or more first images based on captured first images of a target object to determine one or more re-shooting positions; rendering one or more shooting position suggestion marks corresponding to the one or more re-shooting positions in a scene corresponding to a real space displayed in real-time by the image capturing device; and when a current position and a current viewing angle of the image capturing device match a target shooting position suggestion mark, automatically capturing a target second image of the target object corresponding to the target shooting position suggestion mark. Thereby, this disclosure provides a method that can effectively guide users to complete image collection required for 3D object modeling.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="550" publication-number="202620716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理配送請求之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR PROCESSING A SHIPPING REQUEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250509B">G06Q10/06</main-classification>  
        <further-classification edition="202401120250509B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250509B">G06Q30/06</further-classification>  
        <further-classification edition="202301120250509B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250509B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁蘇魯　普拉提克　拉詹德蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYSURU, PRATHIK RAJENDRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>什理坎德　尼基萊什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRIKHANDE, NIKHILESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用以處理配送請求之技術。本發明之一態樣之藉由電子裝置而實行之處理商品配送請求的方法可包括如下步驟：獲得請求配送複數個商品之複數個配送請求，上述配送請求包括出發地、目的地或商品中之至少一者之資訊；基於上述複數個配送請求而產生複數個任務，上述一個以上之任務對應於上述出發地與上述目的地之間的至少一部分區間之配送作業；產生包括上述複數個任務中之與第1區間之配送作業對應之一個以上之任務的第1行程；及確定與上述第1行程對應之運輸資訊，上述運輸資訊包括用於上述第1行程之運輸工具及上述運輸工具之司機之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="551" publication-number="202621293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率半導體結構</chinese-title>  
        <english-title>POWER SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250324B">H10D62/80</main-classification>  
        <further-classification edition="202501120250324B">H10D48/30</further-classification>  
        <further-classification edition="202501120250324B">H10D48/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏程昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHENG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳權威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴文聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳厚潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HOU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種功率半導體結構，其包含一含鎵氧化物基板、一含鎵氧化物半導體層、一散熱內溝槽、一金屬基板及至少一對P型半導體材及N型半導體材。其中，含鎵氧化物半導體層設置於含鎵氧化物基板上。散熱內溝槽環繞含鎵氧化物半導體層，且設置於含鎵氧化物基板上。金屬基板導熱連接於散熱內溝槽，至少一對P型半導體材及N型半導體材分別連接於該金屬基板之二端。當導通一外部電流流入N型半導體材且經金屬基板流至P型半導體材時，含鎵氧化物半導體層產生之熱能經散熱內溝槽而被金屬基板吸收後，再由P型半導體材及N型半導體材相對於金屬基板之一相對端放熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power semiconductor structure is provided. The power semiconductor structure comprises a containing-gallium oxide substrate, a containing-gallium oxide semiconductor layer, a thermal inner trench, a metal substrate and at least one pair of P-type semiconductor material and N-type semiconductor material. The metal oxide semiconductor layer is disposed on the containing-gallium oxide substrate. The thermal inner trench surrounds the containing-gallium oxide semiconductor layer and is disposed on the containing-gallium oxide substrate. The metal substrate is thermally connected to the thermal inner trench, and the at least one pair of P-type semiconductor materials and N-type semiconductor materials are respectively connected to two ends of the metal substrate. When an external current flows into the N-type semiconductor material and flows through the metal substrate to the P-type semiconductor material, the heat energy generated by the containing-gallium oxide semiconductor layer is absorbed by the metal substrate through the thermal inner trench, and then dissipated by opposite ends of the P-type semiconductor material and the N-type semiconductor material opposite to the metal substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:含鎵氧化物基板</p>  
        <p type="p">11:主動區域</p>  
        <p type="p">12:散熱內溝槽</p>  
        <p type="p">13:金屬基板</p>  
        <p type="p">14:N型半導體材</p>  
        <p type="p">15:P型半導體材</p>  
        <p type="p">16:散熱外溝槽</p>  
        <p type="p">17:散熱環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="552" publication-number="202620021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組合物及其方法</chinese-title>  
        <english-title>COMPOUNDS, COMPOSITIONS AND METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D333/38</main-classification>  
        <further-classification edition="200601120251103B">C07D453/04</further-classification>  
        <further-classification edition="200601120251103B">C07D405/12</further-classification>  
        <further-classification edition="200601120251103B">C07D317/32</further-classification>  
        <further-classification edition="200601120251103B">C07D405/14</further-classification>  
        <further-classification edition="200601120251103B">C07D409/12</further-classification>  
        <further-classification edition="200601120251103B">C07D417/12</further-classification>  
        <further-classification edition="200601120251103B">C07D413/12</further-classification>  
        <further-classification edition="200601120251103B">A61K31/381</further-classification>  
        <further-classification edition="200601120251103B">A61K31/49</further-classification>  
        <further-classification edition="200601120251103B">A61K31/443</further-classification>  
        <further-classification edition="200601120251103B">A61K31/357</further-classification>  
        <further-classification edition="200601120251103B">A61K31/496</further-classification>  
        <further-classification edition="200601120251103B">A61K31/4436</further-classification>  
        <further-classification edition="200601120251103B">A61K31/506</further-classification>  
        <further-classification edition="200601120251103B">A61K31/422</further-classification>  
        <further-classification edition="200601120251103B">A61K31/4155</further-classification>  
        <further-classification edition="200601120251103B">A61K31/444</further-classification>  
        <further-classification edition="200601120251103B">A61P25/00</further-classification>  
        <further-classification edition="200601120251103B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商陽光安津（南京）生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IONGEN THERAPEUTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷曉光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XIAOGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖道紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, DAOHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">除其他外，本公開提供了式I的化合物或其鹽。在一些實施方案中，所提供的化合物可用作Nav1.8拮抗劑。在一些實施方案中，本公開提供了預防或治療與Nav1.8相關的病症、紊亂或疾病的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Among other things, the present disclosure provides compounds of formula I or salts thereof. In some embodiments, provided compounds are useful as Nav1.8 antagonists. In some embodiments, the present disclosure provides methods for preventing or treating Nav1.8-associated conditions, disorders or diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="553" publication-number="202621042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高線性度之混合式差動放大器及其方法</chinese-title>  
        <english-title>HYBRID DIFFERENTIAL AMPLIFIER WITH HIGH LINEARITY AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F3/45</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫紹茗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, SHAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭鳴均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, MING-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">混合式差動放大器，根據差動輸入訊號(具有基礎頻率)產生差動輸出訊號，包括：第一放大器，配置為電感切換式轉換器；及第二放大器，配置為另一類放大器。第一與第二放大器分別根據差動輸入訊號的第一與第二輸入訊號分別產生差動輸出訊號的第一與第二輸出訊號。第一或第二放大器之其中一者更根據回授產生第一或第二輸出訊號，藉此差動輸出訊號線性相關於差動輸入訊號；另外一者更將第一或第二輸入訊號量化處理，使得第二輸出訊號包括相關於基礎頻率的階梯波。量化處理包括：根據第一或第二輸入訊號與至少一閾值位準，以產生量化輸出訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid differential amplifier generates a differential output signal by a differential input signal having a fundamental frequency, comprising: a first amplifier configured as an inductive switching converter; and a second amplifier configured as another type of amplifier. The first and second amplifiers respectively generate first and second output signals of the differential output signal based on first and second input signals of the differential input signal. One of the first or second amplifiers further generates the first or second output signal based on feedback, thereby the differential output signal is linearly related to the differential input signal; the other amplifier further performs a quantization processing on the first or second input signal, thereby the second output signal includes a staircase wave related to the fundamental frequency. The quantization processing includes generating a quantized output signal based on the first or second input signal and at least one threshold level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LMU:輸出上限</p>  
        <p type="p">LML:輸出下限</p>  
        <p type="p">GND:接地位準</p>  
        <p type="p">ST1:第一階梯位準</p>  
        <p type="p">ST2:第二階梯位準</p>  
        <p type="p">Vod:差動輸出訊號</p>  
        <p type="p">Von:第二輸出訊號</p>  
        <p type="p">Vop:第一輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="554" publication-number="202620299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇卡與電子裝置</chinese-title>  
        <english-title>FAN CARD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">F04D29/54</main-classification>  
        <further-classification edition="200601120250121B">F04D25/06</further-classification>  
        <further-classification edition="200601120250121B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>四零四科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOXA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉育佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇瑀喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YU-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏昌旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHANG-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風扇卡，包括一風扇單元及一導流組件。風扇單元包括一轉軸及自轉軸向外延伸的多個扇葉。導流組件設置於風扇單元旁，且包括一第一出風口及一第二出風口。風扇單元朝向第一出風口，第一出風口的面積小於這些扇葉所環繞出的面積。第二出風口與第一出風口朝向不同方向。進入風扇單元的氣流通過導流組件，而自第一出風口與第二出風口出風。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fan card includes a fan unit and a flow guide assembly. The fan unit includes a rotating shaft and fan blades extending outward from the rotating shaft. The flow guide assembly is disposed next to the fan unit and includes a first air outlet and a second air outlet. The fan unit faces towards the first air outlet. An area of the first air outlet is smaller than an area surrounded by the fan blades. The second air outlet and the first air outlet face different directions. Airflow entering the fan unit passes through the air guide assembly and is discharged from the first air outlet and the second air outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:軸線</p>  
        <p type="p">A1、A2:直徑</p>  
        <p type="p">D:方向</p>  
        <p type="p">D1、D2:口徑</p>  
        <p type="p">L、L1~L3:長度</p>  
        <p type="p">100:風扇卡</p>  
        <p type="p">110:風扇單元</p>  
        <p type="p">112:轉軸</p>  
        <p type="p">114:扇葉</p>  
        <p type="p">116:側壁</p>  
        <p type="p">120:導流組件</p>  
        <p type="p">121:第一出風口</p>  
        <p type="p">122:第二出風口</p>  
        <p type="p">123:第一導流部分</p>  
        <p type="p">124:表面</p>  
        <p type="p">125:第二導流部分</p>  
        <p type="p">126:斜面</p>  
        <p type="p">127:第三導流部分</p>  
        <p type="p">130:底殼</p>  
        <p type="p">131:底板</p>  
        <p type="p">132:第一區</p>  
        <p type="p">133:第二區</p>  
        <p type="p">134:第三區</p>  
        <p type="p">135:墊高件</p>  
        <p type="p">136:漸高部</p>  
        <p type="p">137:等高部</p>  
        <p type="p">140:內整流結構</p>  
        <p type="p">150:蓋體</p>  
        <p type="p">155:罩體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="555" publication-number="202621405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共用式真空吸附裝置及包含其的檢測系統</chinese-title>  
        <english-title>MULTI-USAGE VACUUM ADSORPTION DEVICE AND AN INSPECTION SYSTEM COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="200601120260223B">B65G47/91</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>由田新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTECHZONE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒嘉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴憲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HSIEN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種共用式真空吸附裝置，包括一真空吸附載台以及模組化基板治具。真空吸附載台具有一設置平台，並於真空吸附載台的上表面設置有至少一真空吸附單元。模組化基板治具可替換地設置於設置平台。真空吸附載台及模組化基板治具的上表面組成一吸附表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a multi-usage vacuum adsorption device, which includes a vacuum adsorption platform and a modular substrate fixture. The vacuum adsorption platform has a mounting platform, and at least one vacuum adsorption unit disposed on upper surface of the vacuum adsorption platform. The modular substrate fixture is replaceably mounted on the mounting platform. The upper surfaces of the vacuum adsorption platform and the modular substrate fixture form an adsorption surface together. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:共用式真空吸附裝置</p>  
        <p type="p">B:基板</p>  
        <p type="p">10:真空吸附載台</p>  
        <p type="p">11:真空載台底座</p>  
        <p type="p">12:內部陶瓷載台</p>  
        <p type="p">121:真空吸附單元</p>  
        <p type="p">1211:真空頂升針</p>  
        <p type="p">20:模組化基板治具</p>  
        <p type="p">20a:第一模組化基板治具</p>  
        <p type="p">21:環狀底座</p>  
        <p type="p">211:第一環形槽</p>  
        <p type="p">212:第二環形槽</p>  
        <p type="p">22:第一環形彈性部</p>  
        <p type="p">23:第二環形彈性部</p>  
        <p type="p">A1:第一真空吸附區域</p>  
        <p type="p">A2:第二真空吸附區域</p>  
        <p type="p">J1:真空吸附單元</p>  
        <p type="p">S:吸附表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="556" publication-number="202619652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>杯套</chinese-title>  
        <english-title>CUP SLEEVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">A47G19/22</main-classification>  
        <further-classification edition="200601120250121B">B65D25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道華顧問股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEEP &amp; FAR CONSULTANTS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有翻摺式結構的杯套，用於套置於一杯體的外圍，該杯套包含：一杯套本體以及一翻摺件。該杯套本體包括一上緣及一下緣，且該翻摺件與該杯套本體的該上緣或該下緣連接，可進行內翻或外摺後形成一阻隔件， 其中該阻隔件概呈為一環形肋狀結構，使該杯套本體套置於該杯體的外圍時，產生抗脫落/隔熱效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a cup sleeve with a folding structure, designed to be placed around an exterior of a cup. The cup sleeve includes: a cup sleeve body and a folding piece. The cup sleeve body includes an upper edge and a lower edge, and the folding piece is connected to the upper edge or the lower edge of the cup sleeve body, wherein the folding piece can be folded inward or outward to form a barrier. The barrier is generally in the form of an annular ribbed structure, which provides anti-slip and heat insulating effects when the cup sleeve body is placed around the exterior of the cup.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:杯套</p>  
        <p type="p">100:杯套本體</p>  
        <p type="p">102:上緣</p>  
        <p type="p">103:下緣</p>  
        <p type="p">200:翻摺式結構</p>  
        <p type="p">201:上緣長方形翻摺件</p>  
        <p type="p">202:下緣長方形翻摺件</p>  
        <p type="p">203a、203b:翻摺線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="557" publication-number="202620088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚胺基甲酸酯組合物</chinese-title>  
        <english-title>POLYURETHANE COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C08G18/08</main-classification>  
        <further-classification edition="200601120250501B">C08G18/56</further-classification>  
        <further-classification edition="200601120250501B">C08G18/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商Ｂ4塑料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>B4PLASTICS BV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪　威爾德曼　史提芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE WILDEMAN, STEFAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汎　提爾柏格　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN TILBURG, KRISTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於聚胺基甲酸酯組合物。特定言之，本發明係關於可用於形成聚胺基甲酸酯之聚縮醛及多元醇以及製備方法。本發明進一步係關於聚胺基甲酸酯塗層用於活性成分之持續、修飾或延遲釋放之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to polyurethane compositions. Particularly, polyacetals and polyols that can be utilized to form a polyurethane and methods for preparation. The invention further relates to the use of polyurethane coatings for sustained, modified or delayed release for an active ingredient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="558" publication-number="202620086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經聚胺基甲酸酯塗覆之肥料</chinese-title>  
        <english-title>POLYURETHANE COATED FERTILIZERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">C08G2/30</main-classification>  
        <further-classification edition="200601120250701B">C08G18/18</further-classification>  
        <further-classification edition="200601120250701B">C08G18/54</further-classification>  
        <further-classification edition="200601120250701B">C08G18/56</further-classification>  
        <further-classification edition="200601120250701B">C08G18/76</further-classification>  
        <further-classification edition="202001120250701B">C05G3/40</further-classification>  
        <further-classification edition="202001120250701B">C05G5/12</further-classification>  
        <further-classification edition="202001120250701B">C05G5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商普蘭塔寇特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLANTACOTE NV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汎德哈連　土恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANDERHALLEN, TOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林坎默　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLINKHAMMER, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於經聚胺基甲酸酯塗覆之肥料、其用途及製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to polyurethane coated fertilizers, uses and production methods thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="559" publication-number="202620332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防爆一體式液位開關暨溫度傳感器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F23D14/72</main-classification>  
        <further-classification edition="200601120241204B">F23D14/66</further-classification>  
        <further-classification edition="200601120241204B">G01F23/38</further-classification>  
        <further-classification edition="200601120241204B">G01F23/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗鴻防爆冷氣有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瀚文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種防爆一體式液位開關暨溫度傳感器，其主要包含有一防爆本體、一感測模組以及一中繼模組，該防爆本體內設有該中繼模組，並其一端組設置該感測模組，使該感測模組所電性連接之一溫度感測單元與液位偵測位置之至少一液位偵感測單元先電性連接該中繼模組之一端子連接單元，並將溫度訊號與液位訊號傳輸至該端子連接單元另端所電性連接之一處理模組，使該處理模組可以控制進行液體加熱之一加熱模組作動狀態，如此，不僅可同時偵測液位與溫度，還可減少製造成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:防爆一體式液位開關暨溫度傳感器</p>  
        <p type="p">10:防爆本體</p>  
        <p type="p">11:第一防爆單元</p>  
        <p type="p">12:第二防爆單元</p>  
        <p type="p">13:纜線連接單元</p>  
        <p type="p">131:纜線通道</p>  
        <p type="p">20:感測模組</p>  
        <p type="p">21:容置管體</p>  
        <p type="p">22:第一磁性浮球</p>  
        <p type="p">23:第二磁性浮球</p>  
        <p type="p">24:第一上限位器</p>  
        <p type="p">26:第二上限位器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="560" publication-number="202620635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用程式介面排程管理系統及其方法</chinese-title>  
        <english-title>API SCHEDULING MANAGEMENT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250324B">G06F9/445</main-classification>  
        <further-classification edition="201801120250324B">G06F8/30</further-classification>  
        <further-classification edition="201901120250324B">G06F16/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奐廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公懋典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, MAO-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種API排程管理系統，其包含記憶體資料庫、關聯式資料庫、前端介面模組、工作執行模組及自動化管理模組。前端介面模組設置以從使用者介面接收API工作相應的API排程設定，及將API排程設定同步至記憶體資料庫及關聯式資料庫。工作執行模組設置以根據記憶體資料庫中的API排程設定，執行相應的API工作。自動化管理模組設置以檢查記憶體資料庫與關聯式資料庫中的API排程設定是否一致。響應於發現不一致，自動化管理模組更設置以關閉工作執行模組，對齊記憶體資料庫與關聯式資料庫中的API排程設定，及啟動工作執行模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An API scheduling management system is provided, which includes an in-memory database, a relational database, a front-end interface module, a job execution module, and an automated management module. The front-end interface module is configured to receive API scheduling settings corresponding to API jobs from a user interface and synchronize the API scheduling settings to the in-memory database and the relational database. The job execution module is configured to execute corresponding API jobs based on the API scheduling settings in the in-memory database. The automated management module is configured to check whether the API scheduling settings in the in-memory database and the relational database are consistent. In response to detecting an inconsistency between the API scheduling settings in the in-memory database and the relational database, the automated management module is further configured to shut down the job execution module, align the API scheduling settings between the in-memory database and the relational database, and start the job execution module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:API排程管理系統</p>  
        <p type="p">101:前端介面模組</p>  
        <p type="p">102:記憶體資料庫</p>  
        <p type="p">103:關聯式資料庫</p>  
        <p type="p">104:工作執行模組</p>  
        <p type="p">105:自動化管理模組</p>  
        <p type="p">110:使用者介面</p>  
        <p type="p">120:文件資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="561" publication-number="202620751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理用戶點數的禮品網絡線上商城系統</chinese-title>  
        <english-title>GIFT NETWORK ONLINE MALL SYSTEM FOR MANAGING USER POINTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250210B">G06Q30/0207</main-classification>  
        <further-classification edition="202301120250210B">G06Q10/06</further-classification>  
        <further-classification edition="202301120250210B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫宇數位有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CINYU DIGITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳延任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設計用於透過集中化數位平台管理用戶點數的禮品網絡線上商城系統。該禮品網絡線上商城系統允許用戶註冊並透過參與各商家定義的活動來累積點數，提供相較於傳統禮品點數計劃更高的靈活性。用戶可以使用累積的點數兌換各種產品，並在平台內將點數轉移或贈送給其他用戶，以增強用戶的互動及社群參與度。商家則獲得了全面的管理工具，用於處理禮品供應、會員資訊及促銷活動，並能自訂入口網站的視覺布局和廣告投放，以符合其品牌策略。透過以強大的數位點數管理模組取代傳統的紙本禮品點數計劃，本發明有效降低了爭議及行政負擔，提供了一個可擴展且用戶友好的現代禮品點數計劃管理解決方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gift network online mall system designed to manage user loyalty points through a centralized digital platform is disclosed. This system enables users to register and accumulate points by engaging in activities defined by individual merchants, offering enhanced flexibility over traditional loyalty programs. Users can redeem accumulated points for a variety of products, as well as transfer or gift points to other users within the platform, fostering increased engagement and community interaction. Merchants are provided with comprehensive management tools to handle gift offerings, member information, and promotional activities, while also customizing the visual layout and advertisements of their portals to align with their branding strategies. By replacing conventional paper-based loyalty schemes with a robust digital point management system that includes timestamped transactions, the invention minimizes disputes and administrative burdens, offering a scalable and user-friendly solution for modern loyalty program management.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:禮品網絡線上商城系統</p>  
        <p type="p">105:資料庫</p>  
        <p type="p">110:用戶介面模組</p>  
        <p type="p">120:點數管理模組</p>  
        <p type="p">130:兌換模組</p>  
        <p type="p">140:點數轉移模組</p>  
        <p type="p">150:商家介面模組</p>  
        <p type="p">160:會員資訊管理模組</p>  
        <p type="p">170:審核工作流程模組</p>  
        <p type="p">180:商家入口管理模組</p>  
        <p type="p">190:報告模組</p>  
        <p type="p">10、20:客戶端裝置</p>  
        <p type="p">30:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="562" publication-number="202620743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛擬物品交易促進系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR FACILITATING VIRTUAL ITEM BROKERAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250210B">G06Q20/38</main-classification>  
        <further-classification edition="202301120250210B">G06Q30/06</further-classification>  
        <further-classification edition="201201120250210B">G06Q40/04</further-classification>  
        <further-classification edition="201401120250210B">A63F13/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫宇數位有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CINYU DIGITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳延任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於促進線上遊戲環境中虛擬物品交易的電腦化系統及方法。該系統包括一個使用者介面，供買家和賣家提交詳細的買單和賣單，一個訂單管理模組用於存儲和追踪訂單，以及一個管理審核模組根據預定標準批准交易。一個先進的匹配引擎使用能夠處理多方匹配的複雜算法配對已批准的買單和賣單，以優化交易完成度。此外，系統還配備了一個分類模組用於分類虛擬物品、一個報告與分析模組用於生成可自訂的統計報告，以及一個通知模組用於即時向使用者更新信息。該平台簡化了虛擬物品交易，增強了安全性，並提供專為經紀人設計的專用工具，從而提升虛擬物品市場的效率和使用者體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computerized system and method for facilitating the brokerage of virtual items within online gaming environments. The system includes a user interface for buyers and sellers to submit detailed buy and sell orders, an order management module to store and track orders, and an administrative review module for approving transactions based on predefined criteria. A sophisticated matching engine pairs approved buy and sell orders using advanced algorithms capable of multi-party matching to optimize transaction fulfillment. Additionally, the system features a classification module for categorizing virtual items, a reporting and analytics module for generating customizable statistical reports, and a notification module for real-time user updates. This platform streamlines virtual item transactions, enhances security, and provides specialized tools tailored for brokers, thereby improving efficiency and user experience in the virtual item marketplace.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:智慧型電子裝置</p>  
        <p type="p">20:伺服器</p>  
        <p type="p">100:虛擬物品交易促進系統</p>  
        <p type="p">110:使用者介面模組</p>  
        <p type="p">120:訂單管理模組</p>  
        <p type="p">130:管理審核模組</p>  
        <p type="p">140:匹配模組</p>  
        <p type="p">150:分類模組</p>  
        <p type="p">160:報告與分析模組</p>  
        <p type="p">170:通知模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="563" publication-number="202621037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達控制器</chinese-title>  
        <english-title>MOTOR CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250324B">H02P29/60</main-classification>  
        <further-classification edition="201601120250324B">H02P29/40</further-classification>  
        <further-classification edition="201601120250324B">H02P21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致新科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL MIXED-MODE TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李榮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, RONG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種馬達控制器用以驅動一馬達。該馬達控制器具有一開關電路、一控制電路、以及一霍爾感測器。該霍爾感測器用以產生一霍爾信號至該控制電路。該控制電路用以產生一調變後之霍爾信號至該開關電路。該調變後之霍爾信號係藉由該霍爾信號之一平均計算及該霍爾信號之一正緣同步或一負緣同步而產生。該馬達控制器係用以減少噪音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor controller is used for driving a motor. The motor controller comprises a switch circuit, a control circuit, and a Hall sensor. The Hall sensor is configured to generate a Hall signal to the control circuit. The control circuit is configured to generate a modulated Hall signal to the switch circuit. The modulated Hall signal is generated by an average calculation of the Hall signal and a positive-edge synchronization or a negative-edge synchronization of the Hall signal. The motor controller is configured to reduce noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:馬達控制器</p>  
        <p type="p">100:開關電路</p>  
        <p type="p">110:控制電路</p>  
        <p type="p">120:霍爾感測器</p>  
        <p type="p">L:馬達線圈</p>  
        <p type="p">IL:馬達電流</p>  
        <p type="p">Vh:霍爾信號</p>  
        <p type="p">Vmh:調變後之霍爾信號</p>  
        <p type="p">Vro:轉速偵測信號</p>  
        <p type="p">RO:轉速信號輸出腳位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="564" publication-number="202619883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具複合材料之散熱構造</chinese-title>  
        <english-title>COMPOSITE HEAT-DISSIPATION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B32B5/32</main-classification>  
        <further-classification edition="202601120260223B">H10W40/25</further-classification>  
        <further-classification edition="200601120260223B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIANG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃玉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具複合材料之散熱構造包含一第一散熱層及一第二散熱層，該第一散熱層具有一第一黏著材、複數個第一顆粒及複數個第一孔隙，該第一黏著材經熔融後黏合該些第一顆粒，該第二散熱層以一第二黏著材與該第一散熱層相結合，該第一散熱層的一第一孔隙率不同該第二散熱層的一第二孔隙率，藉由該第一散熱層或該第二散熱層結合一熱源，以進行散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite heat-dissipation structure includes a first heat-dissipation layer and a second heat-dissipation layer. The first heat-dissipation layer includes a first adhesive, first particles and first pores, and the first particles are adhered with each other by the melted first adhesive. A second adhesive of the second heat-dissipation layer is connected to the first heat-dissipation layer. Porosities of the first and second heat-dissipation layers are different, and the first or second heat-dissipation layer is provided to contact a heat source for heat dissipation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱構造</p>  
        <p type="p">110:第一散熱層</p>  
        <p type="p">111:第一黏著材</p>  
        <p type="p">112:第一顆粒</p>  
        <p type="p">113:第一孔隙</p>  
        <p type="p">120:第二散熱層</p>  
        <p type="p">121:第二黏著材</p>  
        <p type="p">122:第二顆粒</p>  
        <p type="p">123:第二孔隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="565" publication-number="202621135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多驅動型減震揚聲器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H04R9/02</main-classification>  
        <further-classification edition="200601120250108B">H04R1/02</further-classification>  
        <further-classification edition="200601120250108B">H04R5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富祐鴻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTUNE GRAND TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾明軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MING JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江厚生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HOU SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫珈鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN,CHIA LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅泰均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, TAI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多驅動型減震揚聲器，包含喇叭座、發聲組件、複數磁迴組件及減震組件。喇叭座設有複數設置部；發聲組件包括有振膜及複數音圈，振膜設於喇叭座，音圈設於設置部且連接於振膜；磁迴組件包括有導磁座及導磁單元，導磁單元設於導磁座，音圈活動設於導磁單元外；減震組件連接喇叭座與磁迴組件，減震組件包括有彈片及複數固定環，彈片設有複數限位環體，彈片之兩側分別連接於喇叭座之兩側，限位環體連接於導磁座，固定環連接於導磁座與限位環體。藉此，本發明之多驅動型減震揚聲器可利用減震組件增加承受功率，發揮較佳之減震效果，以避免發聲組件於大功率輸出時產生歪斜、偏振等失真之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多驅動型減震揚聲器</p>  
        <p type="p">11:喇叭座</p>  
        <p type="p">111:設置部</p>  
        <p type="p">112:電路板</p>  
        <p type="p">113:組裝部</p>  
        <p type="p">114:階面部</p>  
        <p type="p">12:發聲組件</p>  
        <p type="p">121:振膜</p>  
        <p type="p">122:音圈</p>  
        <p type="p">1221:引線</p>  
        <p type="p">13:磁迴組件</p>  
        <p type="p">131:導磁座</p>  
        <p type="p">132:導磁單元</p>  
        <p type="p">1321:導磁板</p>  
        <p type="p">1322:磁鐵</p>  
        <p type="p">14:減震組件</p>  
        <p type="p">141:彈片</p>  
        <p type="p">1411:限位環體</p>  
        <p type="p">1412:避讓部</p>  
        <p type="p">1413:對接部</p>  
        <p type="p">1414:彈性臂</p>  
        <p type="p">1415:連接臂</p>  
        <p type="p">142:固定環</p>  
        <p type="p">1421:橫向組接凸緣</p>  
        <p type="p">1422:縱向組接凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="566" publication-number="202619794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具組合吸附之蜂巢狀化學濾網</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">B01J20/18</main-classification>  
        <further-classification edition="200601120241129B">B01J20/28</further-classification>  
        <further-classification edition="200601120241129B">B01D39/14</further-classification>  
        <further-classification edition="202201120241129B">B01D46/00</further-classification>  
        <further-classification edition="200601120241129B">B01D53/04</further-classification>  
        <further-classification edition="200601120241129B">A61L9/014</further-classification>  
        <further-classification edition="202101120241129B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華懋科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上海華懋環保節能設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扶亞民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種具組合吸附之蜂巢狀化學濾網，主要是包括有一第一吸附材、一第一沸石吸附劑、一第二吸附材及一第二沸石吸附劑之組合設計，該第一吸附材之蜂巢結構與該第二吸附材之蜂巢結構係分別以複數玻璃纖維、複數碳纖維之其中任一或其組合為基材，而該第一沸石吸附劑與該第二沸石吸附劑係分別透過至少一溶液長晶於該第一吸附材與該第二吸附材之複數玻璃纖維、該複數碳纖維之其中任一或其組合的內徑中，而該第一吸附材與該第二吸附材分別於垂直氣流方向的截面積之孔隙率(Porosity)係大於等於58%且小於等於90%，其中該第一吸附材與該第二吸附材係以組合方式呈現，藉此，以透過組合來達到多重吸附之效能，並具有提高吸附劑之吸附量及不燃性的特點。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:第一吸附材</p>  
        <p type="p">20:第一沸石吸附劑</p>  
        <p type="p">30:第二吸附材</p>  
        <p type="p">40:第二沸石吸附劑</p>  
        <p type="p">50:層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="567" publication-number="202619795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具混合吸附之蜂巢狀化學濾網</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">B01J20/18</main-classification>  
        <further-classification edition="200601120241129B">B01J20/28</further-classification>  
        <further-classification edition="200601120241129B">B01D39/14</further-classification>  
        <further-classification edition="202201120241129B">B01D46/00</further-classification>  
        <further-classification edition="200601120241129B">B01D53/04</further-classification>  
        <further-classification edition="200601120241129B">A61L9/014</further-classification>  
        <further-classification edition="202101120241129B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華懋科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上海華懋環保節能設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扶亞民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種具混合吸附之蜂巢狀化學濾網，主要是包括有至少一吸附材及至少二吸附劑之組合設計，該吸附材之蜂巢結構係以複數玻璃纖維、複數碳纖維之其中任一或其組合為基材，而該吸附材於垂直氣流方向的截面積之孔隙率(Porosity)係大於等於58%且小於等於90%，另該至少二吸附劑係分別為一第一沸石吸附劑及一第二沸石吸附劑，該第一沸石吸附劑及該第二沸石吸附劑係透過至少一溶液長晶於該複數玻璃纖維、該複數碳纖維之其中任一或其組合的內徑中，且其內徑中該第一沸石吸附劑及該第二沸石吸附劑係以混合方式呈現，藉此，使能提升該吸附材的使用壽命，並具有提高該吸附劑之吸附量，以達到增加吸附之效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:吸附材</p>  
        <p type="p">20:吸附劑</p>  
        <p type="p">30:層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="568" publication-number="202619796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具區域吸附之蜂巢狀化學濾網</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">B01J20/18</main-classification>  
        <further-classification edition="200601120250121B">B01J20/28</further-classification>  
        <further-classification edition="200601120250121B">B01D39/14</further-classification>  
        <further-classification edition="202201120250121B">B01D46/00</further-classification>  
        <further-classification edition="200601120250121B">A61L9/014</further-classification>  
        <further-classification edition="202101120250121B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華懋科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上海華懋環保節能設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扶亞民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種具區域吸附之蜂巢狀化學濾網，主要是包括有至少一吸附材及至少二吸附劑之組合設計，該吸附材之蜂巢結構係以複數玻璃纖維、複數碳纖維之其中任一或其組合為基材，而該吸附材於垂直氣流方向的截面積之孔隙率(Porosity)係大於等於58%且小於等於90%，另該至少二吸附劑係分別透過至少一溶液長晶於該複數玻璃纖維、該複數碳纖維之其中任一或其組合的內徑中，而其內徑中係分設有一第一區域及一第二區域，該第一區域係位於垂直氣流上游處，並長晶該第一沸石吸附劑，該第二區域係位於垂直氣流下游處，並長晶該第二沸石吸附劑，藉此，使能提升該吸附材的使用壽命，並具有提高該吸附劑之吸附量，以達到增加吸附之效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:吸附材</p>  
        <p type="p">111:第一區域</p>  
        <p type="p">112:第二區域</p>  
        <p type="p">20:吸附劑</p>  
        <p type="p">30:層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="569" publication-number="202619946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可撕除內藏式邊條之容器</chinese-title>  
        <english-title>CONTAINER COMPRISING REMOVABLE EMBEDDED EDGE STRIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">B65D41/32</main-classification>  
        <further-classification edition="200601120241130B">B65D55/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚墩股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIGOURPLASTIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝承峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, ALBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具有可撕除內藏式邊條之容器，其特點主要在於具有一可撕除內藏式邊條連設於盒體與掀啟式蓋體之間，以作為掀啟式蓋體的連接鉸鍊部位之用，該可撕除內藏式邊條包括第一及第二側波形預斷線且定義出一X軸線，第一與第二側波形預斷線均包括數個波峰部及波谷部，波峰部相對遠離X軸線，波谷部則相對鄰近X軸線，且令其各連接點位於波峰部位置處，令各連接點的撕除變形方向與盒體框邊部位的面延伸方向一致，且令可撕除內藏式邊條於未撕除狀態下，係垂向夾置於第一與第二側波形預斷線的各波谷部之間呈內藏式型態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a container comprising a removable embedded edge strip positioned between a box body and a lift-open cover. The removable embedded edge strip functions as a connecting hinge for the lift-open cover. The edge strip comprises a first and a second side with pre-weakened wave-shaped tear lines, defining an X-axis. Each of the first and second side tear lines includes a plurality of crest portions and trough portions, wherein each crest portion is positioned relatively distant from the X-axis, while each trough portion is relatively proximate to the X-axis. Each connection point is located at the crest portions, aligning the tear deformation direction of each connection point with the surface extension direction of the box body frame edge. In an un-torn state, the removable embedded edge strip is vertically clamped in an embedded form between the trough portions of the first and second side wave-shaped tear lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:盒體</p>  
        <p type="p">12:框邊部位</p>  
        <p type="p">121:第一連接段</p>  
        <p type="p">20:掀啟式蓋體</p>  
        <p type="p">21:掀啟側</p>  
        <p type="p">212:第二連接段</p>  
        <p type="p">23:環框</p>  
        <p type="p">30:可撕除內藏式邊條</p>  
        <p type="p">31:第一側波形預斷線</p>  
        <p type="p">32:第二側波形預斷線</p>  
        <p type="p">33:波峰部</p>  
        <p type="p">34:波谷部</p>  
        <p type="p">35:連接點</p>  
        <p type="p">40:拉持片</p>  
        <p type="p">50:增厚區塊</p>  
        <p type="p">X:軸線</p>  
        <p type="p">註：本圖中之7非元件符號，係表示該標示處之剖面呈現於圖7。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="570" publication-number="202621237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有電容結構的半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/00</main-classification>  
        <further-classification edition="202301120241202B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有電容結構的半導體裝置及其形成方法被提出。具有電容結構的半導體裝置包括基底、多個內支撐層、外支撐結構以及多個電容結構。基底具有陣列區和周邊區。內支撐層設置於基底上的陣列區中。外支撐結構的第一支撐部設置於基底上的周邊區中。外支撐結構的第二支撐部包括連接這些內支撐層的連接部及設置於第一支撐部上的頂延伸部。頂延伸部的厚度與這些內支撐層中最遠離基底的一者的厚度不同。各電容結構穿過這些內支撐層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device with a capacitor structure and its formation method are provided. The semiconductor device with the capacitor structure includes a substrate, multiple inner support layers, an outer support structure, and multiple capacitor structures. The substrate has an array region and a peripheral region. The inner support layers are arranged in the array region on the substrate. A first support part of the outer support structure is arranged in the peripheral region on the substrate. A second support part of the outer support structure includes a connecting part that connects these inner support layers and a top extension part disposed on the first support layer. The thickness of the top extension part is different from the thickness of the one of these inner support layers that is farthest from the substrate. Each capacitor structure passes through these inner support layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">A1:陣列區</p>  
        <p type="p">A2:周邊區</p>  
        <p type="p">102:接觸插塞</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">108:底隔離層</p>  
        <p type="p">120M,120T:內支撐層</p>  
        <p type="p">121:第一支撐層</p>  
        <p type="p">122:第二支撐層</p>  
        <p type="p">151:第一介電層</p>  
        <p type="p">152:第二介電層</p>  
        <p type="p">108a,160a:頂表面</p>  
        <p type="p">160:第一支撐部</p>  
        <p type="p">161:第二支撐部</p>  
        <p type="p">160b:底表面</p>  
        <p type="p">1611:連接部</p>  
        <p type="p">1611w:內側壁</p>  
        <p type="p">1612:頂延伸部</p>  
        <p type="p">180:外支撐結構</p>  
        <p type="p">210:底電極</p>  
        <p type="p">230:介電層</p>  
        <p type="p">230s:表面</p>  
        <p type="p">250:頂電極</p>  
        <p type="p">2700U:導電材料層的上部</p>  
        <p type="p">270:導電填充層</p>  
        <p type="p">280:金屬層</p>  
        <p type="p">160PA,280PA:垂直投影範圍</p>  
        <p type="p">SC:電容結構</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="571" publication-number="202620867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜態隨機存取記憶體的布局圖案以及其製作方法</chinese-title>  
        <english-title>LAYOUT PATTERN OF STATIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250213B">G11C11/417</main-classification>  
        <further-classification edition="202301120250213B">H10B10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種靜態隨機存取記憶體(SRAM)單元的布局圖案，至少包含一區域內包含有一SRAM單元，該SRAM單元包含有複數個鰭狀結構位於一基底上，其中複數個閘極結構跨越複數個鰭狀結構，構成一第一上拉電晶體PU1、一第二上拉電晶體PU2、一第一下拉電晶體PD1、一第二下拉電晶體PD2、一第一傳輸閘電晶體PG1A、一第二傳輸閘電晶體PG1B、一第三傳輸閘電晶體PG2A、一第四傳輸閘電晶體PG2B位於該基底上，其中從一上視圖來看，該第一上拉電晶體PU1與該第二上拉電晶體PU2在該Y方向上相互對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a layout pattern of static random access memory (SRAM) cell, which at least comprises an SRAM cell in a region, wherein the SRAM cell comprises a plurality of fin structures on a substrate, wherein a plurality of gate structures span the plurality of fin structures so as to form a first pull-up transistor PU1, a second pull-up transistor PU2, a first pull-down transistor PD1, a second pull-down transistor PD2, a first pass gate transistor PG1A, a second pass gate transistor PG1B, a third pass gate transistor PG2A and a pass gate transistor PG2B are located on the substrate, wherein the first pull-up transistor PU1 and the second pull-up transistor PU2 are aligned with each other in a Y direction when viewed from a top view.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60A:第一區域連接層</p>  
        <p type="p">60B:第一區域連接層</p>  
        <p type="p">BL1:位元線</p>  
        <p type="p">BL2:位元線</p>  
        <p type="p">BL3:位元線</p>  
        <p type="p">BL4:位元線</p>  
        <p type="p">CT:接觸柱</p>  
        <p type="p">F:鰭狀結構</p>  
        <p type="p">F11:鰭狀結構</p>  
        <p type="p">F12:鰭狀結構</p>  
        <p type="p">F13:鰭狀結構</p>  
        <p type="p">G:閘極結構</p>  
        <p type="p">G11:第一閘極結構</p>  
        <p type="p">G12:第二閘極結構</p>  
        <p type="p">G13:第三閘極結構</p>  
        <p type="p">G14:第四閘極結構</p>  
        <p type="p">G15:第五閘極結構</p>  
        <p type="p">G16:第六閘極結構</p>  
        <p type="p">G17:第七閘極結構</p>  
        <p type="p">G18:第八閘極結構</p>  
        <p type="p">MD:金屬層</p>  
        <p type="p">MD1:金屬層</p>  
        <p type="p">MD2:金屬層</p>  
        <p type="p">MD3:金屬層</p>  
        <p type="p">MP:金屬層</p>  
        <p type="p">MP1:金屬層</p>  
        <p type="p">MP2:金屬層</p>  
        <p type="p">PU1:第一上拉電晶體</p>  
        <p type="p">PU2:第二上拉電晶體</p>  
        <p type="p">PD1-L:左半第一下拉電晶體</p>  
        <p type="p">PD1-R:右半第一下拉電晶體</p>  
        <p type="p">PD2-L:左半第二下拉電晶體</p>  
        <p type="p">PD2-R:右半第二下拉電晶體</p>  
        <p type="p">PG1A:第一傳輸閘電晶體</p>  
        <p type="p">PG1B:第二傳輸閘電晶體</p>  
        <p type="p">PG2A:第三傳輸閘電晶體</p>  
        <p type="p">PG2B:第四傳輸閘電晶體</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">Vcc:電壓源</p>  
        <p type="p">Vss:電壓源</p>  
        <p type="p">WL1:字元線</p>  
        <p type="p">WL2:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="572" publication-number="202620425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超聲波掃瞄顯微鏡裝置</chinese-title>  
        <english-title>SCANNING ACOUSTIC MICROSCOPE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">G01N29/24</main-classification>  
        <further-classification edition="200601120241127B">G01N29/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日揚科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGHLIGHT TECH CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉哲甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHE-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林軒宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴天琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超聲波掃瞄顯微鏡(Scanning Acoustic Microscope，SAM)裝置包含載台、超聲波掃瞄顯微鏡以及至少一隔離元件。載台係用以承載至少一待測物。隔離元件係用以使得待測物與檢測液之間呈現隔離狀態。其中超聲波掃瞄顯微鏡係經由檢測探頭提供超聲波穿透過檢測液及貼附於待測物上之隔離元件，藉以對載台上之待測物進行超聲波掃瞄檢測程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scanning acoustic microscope (SAM) apparatus comprises a platform, a scanning acoustic microscope, and at least one isolation element. The platform is used to hold at least one object to be tested. The isolation element is used to isolate the object to be tested from the detection liquid. The scanning acoustic microscope, through a detection probe, provides ultrasonic waves that penetrate the detection liquid and the isolation element attached to the object to be tested, thereby performing an ultrasonic scanning detection on the object to be tested on the platform.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:超聲波掃瞄顯微鏡裝置</p>  
        <p type="p">20:載台</p>  
        <p type="p">22:置物平台</p>  
        <p type="p">40:超聲波掃瞄顯微鏡</p>  
        <p type="p">42:檢測探頭</p>  
        <p type="p">42a:超聲波發射器</p>  
        <p type="p">42b:超聲波接收器</p>  
        <p type="p">44:檢測液</p>  
        <p type="p">50:隔離元件</p>  
        <p type="p">100:待測物</p>  
        <p type="p">110:量測區</p>  
        <p type="p">120:物件</p>  
        <p type="p">F:外力</p>  
        <p type="p">F1:吸力</p>  
        <p type="p">F2:推力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="573" publication-number="202619755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微針貼片及其可溶性膜與經皮吸收組成物</chinese-title>  
        <english-title>MICTONEEDLE PATCH, AND SOLUBLE FILM AND TRANSDERMAL ABSOPRTION COMPOSITION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">A61M37/00</main-classification>  
        <further-classification edition="200601120241230B">A61K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達運精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳琬婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊芸珮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUN-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉伊真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微針貼片，其包含微針層及載體層。微針層包括基底層及多個微針。微針由含有果膠及玻尿酸之溶液所形成，且彼此間隔設置於基底層上。基底層具有相對之第一面及第二面。多個微針位於第一面，而微針層以基底層之第二面設置於載體層上。本發明還一種經皮吸收組成物，其包含果膠及玻尿酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microneedle patch comprises a microneedle layer and a carrier layer. The microneedle layer includes a base layer and a plurality of microneedles. The microneedles are formed from a solution containing pectin and hyaluronic acid, disposed on the case layer, and are spaced apart from each other. The base layer has a first side and a second side opposite to each other. The plurality of microneedles are located on the first side, and the microneedle layer is disposed on the carrier layer with the second side of the base layer. The present invention also provides a transdermal absorption composition, which contains pectin and hyaluronic acid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微針貼片</p>  
        <p type="p">10:微針層(膜)</p>  
        <p type="p">100:微針</p>  
        <p type="p">150:基底層</p>  
        <p type="p">151:第一面</p>  
        <p type="p">152:第二面</p>  
        <p type="p">20:載體層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="574" publication-number="202619938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳踏車中置馬達組裝結構</chinese-title>  
        <english-title>BICYCLE MID-MOUNTED MOTOR ASSEMBLY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250121B">B62M6/55</main-classification>  
        <further-classification edition="201001120250121B">B62M6/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八達創新科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATECH TOTALSOLUTION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>燁冠國際興業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEGUAN INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚立和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, LI HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田騏禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, CHI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係指一種腳踏車中置馬達組裝結構，其供應用於一腳踏車之一車架上，該車架具有組設一曲柄軸之一軸通管，供驅動一前鏈輪，該中置馬達組裝結構包含有一馬達及一離合組所組成，而該離合組具有一曲柄軸套、一支撐軸套、一離合輪、一殼罩及一傳動輪，其可利用該曲柄軸與該軸通管上分別套設該曲柄軸套及鎖設該支撐軸套，使得該離合輪、該殼罩及該傳動輪可被有效的對位與定位，能有效強化軸向鎖固力與徑向支撐力，使其動力傳輸更為平穩與確實，同時可以避免使用後因振動而鬆脫，且不致因嚙合性不佳而磨損，有效延長其使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention refers to a bicycle mid-mounted motor assembly structure, which is employed on a bicycle frame. The frame has an axle tube that mounts a crankshaft, which drives a front chainring. The mid-mounted motor assembly structure includes a motor and a clutch assembly, where the clutch assembly consists of a crankshaft sleeve, a support shaft sleeve, a clutch wheel, a cover, and a drive wheel. With the crankshaft sleeve and support shaft sleeve mounted on the crankshaft and axle tube respectively, the clutch wheel, cover, and drive wheel can be effectively aligned and positioned, strongly enhancing axial locking force and radial support. The design ensures more smooth and reliable power transmission, prevents loosening due to vibration during use, and minimizes wear caused by poor engagement, thereby effectively extending its service life.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:軸通管</p>  
        <p type="p">12:螺紋段</p>  
        <p type="p">16:曲柄軸</p>  
        <p type="p">18:第二直嵌齒</p>  
        <p type="p">300:離合組</p>  
        <p type="p">30:曲柄軸套</p>  
        <p type="p">31:第一直嵌齒</p>  
        <p type="p">32:凸軸部</p>  
        <p type="p">322:第一螺鎖段</p>  
        <p type="p">33:第一嚙齒段</p>  
        <p type="p">34:第一軸承</p>  
        <p type="p">35:固定鎖帽</p>  
        <p type="p">36:第二螺鎖段</p>  
        <p type="p">40:支撐軸套</p>  
        <p type="p">41:螺鎖凸套</p>  
        <p type="p">44:環扣</p>  
        <p type="p">50:離合輪</p>  
        <p type="p">51:第二嚙齒段</p>  
        <p type="p">54:離合鍵</p>  
        <p type="p">55:第二軸承</p>  
        <p type="p">56:壓板</p>  
        <p type="p">58:螺栓</p>  
        <p type="p">60:殼罩</p>  
        <p type="p">61:凸軸套</p>  
        <p type="p">62:擋緣</p>  
        <p type="p">66:環狀殼蓋</p>  
        <p type="p">70:傳動輪</p>  
        <p type="p">71:嚙齒</p>  
        <p type="p">75:離合嚙齒</p>  
        <p type="p">78:第三軸承</p>  
        <p type="p">90:前鏈輪</p>  
        <p type="p">93:鎖固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="575" publication-number="202620461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測模組</chinese-title>  
        <english-title>DETECTING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G01S17/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞洲光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA OPTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林献琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIEN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測模組，其包括一發射組件、一第一光學元件以及一接收組件。發射組件發射一偵測光線，發射組件包括一第一光源以及一第二光源，偵測光線包括第一光源所發射之一第一光束，以及第二光源所發射之一第二光束。第一光學元件包含沿一第一方向延伸的一光軸。第一光源以及第二光源沿一第二方向設置，且第二光源與光軸具有一間距，第二方向與第一方向垂直。第一光束出射第一光學元件後照射一第一區域，第二光束出射第一光學元件後照射一第二區域，且第一區域與第二區域不重疊。偵測光線通過第一光學元件後，被一物體反射形成一反射光線，反射光線被接收組件接收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection module includes an emitting component, a first optical component and a receiving component. The emitting component emits a detection light. The emitting component includes a first light source and a second light source. The detection light includes a first light beam emitted by the first light source and a second light beam emitted by the second light source. The first optical element includes an optical axis extending along a first direction. The first light source and the second light source are arranged along a second direction, and there is a distance between the second light source and the optical axis. The second direction is perpendicular to the first direction. The first light beam exits the first optical element and then illuminates a first area, the second light beam exits the first optical element and then illuminates a second area, and the first area and the second area do not overlap. After the detection light passes through the first optical element, it is reflected by an object to form a reflected light, and the reflected light is received by the receiving component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1&lt;sub&gt;2&lt;/sub&gt;:偵測模組</p>  
        <p type="p">10&lt;sub&gt;2&lt;/sub&gt;:發射組件</p>  
        <p type="p">11&lt;sub&gt;2&lt;/sub&gt;:第一光源</p>  
        <p type="p">12&lt;sub&gt;2&lt;/sub&gt;:第二光源</p>  
        <p type="p">20&lt;sub&gt;2&lt;/sub&gt;:第一光學元件</p>  
        <p type="p">30&lt;sub&gt;2&lt;/sub&gt;:接收組件</p>  
        <p type="p">31&lt;sub&gt;2&lt;/sub&gt;:光感測器</p>  
        <p type="p">32&lt;sub&gt;2&lt;/sub&gt;:窄通濾光片</p>  
        <p type="p">40&lt;sub&gt;2&lt;/sub&gt;:第二光學元件</p>  
        <p type="p">70&lt;sub&gt;2&lt;/sub&gt;:轉向鏡</p>  
        <p type="p">71&lt;sub&gt;2&lt;/sub&gt;:反射面</p>  
        <p type="p">72&lt;sub&gt;2&lt;/sub&gt;:支架</p>  
        <p type="p">73&lt;sub&gt;2&lt;/sub&gt;:遮蔽件</p>  
        <p type="p">80&lt;sub&gt;2&lt;/sub&gt;:窗口件</p>  
        <p type="p">90&lt;sub&gt;2&lt;/sub&gt;:控制組件</p>  
        <p type="p">91&lt;sub&gt;2&lt;/sub&gt;:控制件</p>  
        <p type="p">92&lt;sub&gt;2&lt;/sub&gt;:位置感測件</p>  
        <p type="p">100&lt;sub&gt;2&lt;/sub&gt;:驅動件</p>  
        <p type="p">731&lt;sub&gt;2&lt;/sub&gt;:遮蔽件本體</p>  
        <p type="p">732&lt;sub&gt;2&lt;/sub&gt;:遮蔽件感測部</p>  
        <p type="p">A1&lt;sub&gt;2&lt;/sub&gt;:遠端區域</p>  
        <p type="p">A2&lt;sub&gt;2&lt;/sub&gt;:近端區域</p>  
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;:軸線</p>  
        <p type="p">D1&lt;sub&gt;2&lt;/sub&gt;:第一方向</p>  
        <p type="p">D2&lt;sub&gt;2&lt;/sub&gt;:第二方向</p>  
        <p type="p">D3&lt;sub&gt;2&lt;/sub&gt;:第三方向</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:偵測光線</p>  
        <p type="p">L1&lt;sub&gt;2&lt;/sub&gt;:第一光束</p>  
        <p type="p">L2&lt;sub&gt;2&lt;/sub&gt;:第二光束</p>  
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;:反射光束</p>  
        <p type="p">R1&lt;sub&gt;2&lt;/sub&gt;:第一反射光束</p>  
        <p type="p">R2&lt;sub&gt;2&lt;/sub&gt;:第二反射光束</p>  
        <p type="p">S1&lt;sub&gt;2&lt;/sub&gt;:第一物體</p>  
        <p type="p">S2&lt;sub&gt;2&lt;/sub&gt;:第二物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="576" publication-number="202619818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調整式之搓牙機</chinese-title>  
        <english-title>ADJUSTABLE THREAD ROLLING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B21H3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長薔機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN CHANGE MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯景鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明調整式之搓牙機，其主要在於該搓牙機具有一活動式設置於一機台上之導軌，利用該導軌具有一本體，以及一凸伸於該本體上之傾斜面，其中，該本體兩側分別開設有長槽孔，且該長槽孔上裝設有一鎖固件，藉由將該鎖固件鎖設至該長槽孔，以使該本體定位於該機台上；是以，若一滑動板與該導軌因長久滑移摩擦產生磨耗而產生不當間隙時，該導軌可藉由鬆放該鎖固件而呈位移，且可移動該導軌直到該傾斜面與該滑動板底部貼合，故該活動式之導軌有利於延長該搓牙機之使用壽命，亦達該搓牙機之穩定作動以維持該搓牙機作動之性能、精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adjustable thread rolling machine mainly includes a guiding track which is movably disposed on a base of the thread rolling machine. The guiding track includes a main body and an inclined surface projecting from the main body. Long slots are formed on two sides of the main body. A fastening unit is disposed on the long slot, and the main body is positioned on the base by fastening the fastening unit to the long slot. If an improper space is formed between a sliding board and the guiding track because of the abrasion caused by long-term sliding friction, the guiding track can be moved by unfastening the fastening unit. The guiding track moves until the inclined surface is in contact with a bottom of the sliding board. Therefore, the movable guiding track helps prolong the service life of the thread rolling machine and also attains a stable operation of the thread rolling machine to maintain the working performance and the accuracy of the operation of the thread rolling machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:搓牙機</p>  
        <p type="p">31:機台</p>  
        <p type="p">32:導軌</p>  
        <p type="p">321:本體</p>  
        <p type="p">322:傾斜面</p>  
        <p type="p">323:長槽孔</p>  
        <p type="p">33:進料裝置</p>  
        <p type="p">34:驅動裝置</p>  
        <p type="p">35:固定牙板</p>  
        <p type="p">36:活動牙板</p>  
        <p type="p">37:滑動板</p>  
        <p type="p">A:鎖固件</p>  
        <p type="p">B:胚料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="577" publication-number="202620368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143810</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快拆式防彈背心</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">F41H1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳有權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳有權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳川仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之快拆式防彈背心包含一護背、一護胸、二護腰及一快拆繩。護背具有一上固定環和一下固定環，護胸具有二肩帶，各肩帶以一第一固定孔可拆卸地套設於護背之上固定環，各護腰具有一腰墊及一固定帶，腰墊之一端可分離地設於護胸，腰墊之另一端連接固定帶，固定帶以一第二固定孔可拆卸地套設於護背之下固定環，快拆繩可拆卸地穿設於護背之上、下固定環。藉此，只要將快拆繩抽離護背之上、下固定環，即可快速地完成護背、護胸及二護腰的拆解。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:快拆式防彈背心</p>  
        <p type="p">20:護背</p>  
        <p type="p">22:墊體</p>  
        <p type="p">30:護胸</p>  
        <p type="p">31:胸墊</p>  
        <p type="p">32:肩帶</p>  
        <p type="p">33:前遮布</p>  
        <p type="p">34:護肩套</p>  
        <p type="p">40:護腰</p>  
        <p type="p">41:腰墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="578" publication-number="202620815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>停車格狀態判斷方法</chinese-title>  
        <english-title>DETERMINING PARKING SPACE STATUS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G08G1/14</main-classification>  
        <further-classification edition="200601120241230B">G06T1/40</further-classification>  
        <further-classification edition="200601120241230B">G07C1/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭達人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TA ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種停車格狀態判斷方法，適用於對應一停車格的狀態判斷系統。該狀態判斷系統包括一鏡頭模組及一處理器。該方法包括：經由該鏡頭模組，擷取該停車格的多個環境影像；經由該處理器，反應於判定每個環境影像存在一目標物件，決定對應該目標物件的目標邊界框；並經由該處理器，根據該目標邊界框的目標參考點和一基準線段之間的第一正交距離的變化，判斷對應該停車格的停車狀態為進入狀態、離開狀態或占用狀態，其中該基準線段為該停車格的邊線且遠離環境影像的下邊界。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining a parking space status, applicable to a status determination system corresponding to a parking space. The status determination system comprises a camera module and a processor. The method includes: obtaining, by the camera module, a plurality of environment images of the parking space; determining, by the processor in response to determining that a target object exists in each environment image, a target bounding box corresponding to the target object; and determining, by the processor according to a change in a first orthogonal distance between a target reference point of the target bounding box and a baseline segment, that a parking status corresponding to the parking space is an entering status, a leaving status, or an occupied status, wherein the baseline segment is an edge line of the parking space and is away from a lower boundary of the environment image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S910~S930:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="579" publication-number="202621106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體圖像顯示系統與其立體圖像產生方法</chinese-title>  
        <english-title>STEREOSCOPIC IMAGE DISPLAY SYSTEM AND STEREOSCOPIC IMAGE GENERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">H04N13/106</main-classification>  
        <further-classification edition="201801120250303B">H04N13/128</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和　佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTERO CLARES, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體圖像顯示系統與其立體圖像產生方法。此方法包括下列步驟。獲取一輸入圖幀與輸入圖幀的深度資訊。識別輸入圖幀的場景類型。根據輸入圖幀的場景類型，決定相機投影處理的投影參數。根據投影參數與深度資訊，將輸入圖幀中的多個像素投影至一立體座標系，以獲取立體座標系下的多個場景立體座標。根據多個場景立體座標，產生包括左眼影像與右眼影像的並排影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An stereoscopic image display system and a stereoscopic image generation method thereof are disclosed. The method includes the following steps. An input frame and depth information of the input frame are obtained. A scene type of the input frame is recognized. According to the scene type of the input frame, a projection parameter of a camera projection processing is determined. According to the projection parameter and the depth information, multiple pixels of the input frame are projected to a stereoscopic coordinate system to obtain multiple scene stereoscopic coordinates in the stereoscopic coordinate system. Based on the scene stereoscopic coordinates, a side-by-side image including a left-eye image and a right-eye image is generated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="580" publication-number="202620155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著組成物及黏著劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">C09J133/02</main-classification>  
        <further-classification edition="200601120241120B">C09J133/08</further-classification>  
        <further-classification edition="200601120241120B">C09J11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝一化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINY CHEMICAL INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫啓發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHI-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種黏著組成物包含改質肉桂酸單體、丙二醇甲醚丙烯酸酯單體、起始劑及溶劑。該改質肉桂酸單體由包括肉桂酸、甲基丙烯酸2-羥乙酯及催化劑的反應組分經酯化反應所形成。該溶劑包括丙二醇甲醚醋酸酯及乙酸正丁酯。其中，該乙酸正丁酯的用量高於該丙二醇甲醚醋酸酯的用量。本發明黏著劑由黏著組成物經交聯反應所形成，包含式(A)所示的改質肉桂酸單體結構單元及式(B)所示的丙二醇甲醚丙烯酸酯單體結構單元。本發明提供一種新穎的黏著劑，且能藉由反覆照射不同光源改變其接著力，以使黏著劑能反覆使用並讓兩物件彼此相分離或相黏合。 &lt;br/&gt;&lt;img align="absmiddle" height="239px" width="293px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="581" publication-number="202619688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>萬向骨板</chinese-title>  
        <english-title>UNIVERSAL BONE PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61B17/58</main-classification>  
        <further-classification edition="200601120241130B">A61B17/80</further-classification>  
        <further-classification edition="200601120241130B">A61B17/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王躍鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茵慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦俠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-SIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧韋智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曜洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YAO-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種萬向骨板，用以解決習知骨板難以彎折的問題。係包含：一第一板體，具有一第一樞接部，該第一樞接部具有一第一軸線，該第一樞接部具有一第二軸線，該第二軸線垂直於該第一軸線，該第一樞接部具有一樞接槽，該樞接槽於該第一樞接部形成二開口，各該開口具有一最大開口寬度；及一第二板體，具有一第二樞接部，該第二樞接部具有二樞接孔，該二樞接孔由該第二軸線對位於該樞接槽，一栓件分別穿伸結合於該二樞接孔以及該樞接槽，使該第一板體與該第二板體以該第一軸線及該第二軸線分別進行相對樞轉。藉此可以達成提升手術順暢性功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A universal bone plate is used to solve the problem that conventional bone plates are difficult to bend. Includes: a first plate body with a first pivot portion, the first pivot portion has a first axis, the first pivot portion has a second axis, and the second axis is perpendicular to the first axis. axis, the first pivot portion has a pivot groove, the pivot groove forms two openings in the first pivot portion, each opening has a maximum opening width; and a second plate body has a second pivot .The second pivot portion has two pivot holes, the two pivot holes are aligned with the pivot groove from the second axis, and a bolt is extended through and combined with the two pivot holes and the pivot groove respectively. , causing the first plate body and the second plate body to relatively pivot along the first axis and the second axis respectively. This can achieve the effect of improving the smoothness of surgery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一板體</p>  
        <p type="p">11,21:固定部</p>  
        <p type="p">11a,21a:結合面</p>  
        <p type="p">12,22:貫穿孔</p>  
        <p type="p">13:第一樞接部</p>  
        <p type="p">14:樞接槽</p>  
        <p type="p">14a:開口</p>  
        <p type="p">141:中央孔部</p>  
        <p type="p">142:扇形槽部</p>  
        <p type="p">2:第二板體</p>  
        <p type="p">23:第二樞接部</p>  
        <p type="p">23a:樞接孔</p>  
        <p type="p">231:內螺紋</p>  
        <p type="p">24:延伸臂</p>  
        <p type="p">25:栓件</p>  
        <p type="p">251:外螺紋</p>  
        <p type="p">252:擴徑部</p>  
        <p type="p">T:骨釘</p>  
        <p type="p">O1:第一軸線</p>  
        <p type="p">O2:第二軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="582" publication-number="202620594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防止通用序列匯流排過熱的方法以及防止通用序列匯流排過熱的供電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G06F1/26</main-classification>  
        <further-classification edition="200601120250324B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶豐科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉金邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝依良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種防止通用序列匯流排過熱的方法以及防止通用序列匯流排過熱的供電裝置，包括一個供電端供電給所述供電裝置，所述供電裝置設置有一個溫度偵測裝置以及一個通用序列匯流排（插座端），所述溫度偵測裝置偵測所述通用序列匯流排的溫度並且隨著溫度變化感變電阻值，透過偵測到所述溫度偵測元件的輸出端的分壓電壓是否異常，而控制所述供電端供電或不供電給所述通用序列匯流排，使得所述通用序列匯流排的工作溫度不會過高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S111:供電端對第一電路供電</p>  
        <p type="p">S113:對溫度偵測元件供電</p>  
        <p type="p">S115:電壓值是否異常？</p>  
        <p type="p">S117:供電端不供電給第二電路</p>  
        <p type="p">S119:通用序列匯流排不供電</p>  
        <p type="p">S120:分壓電壓值是否低於重啟電壓？</p>  
        <p type="p">S131:供電端供電給第二電路</p>  
        <p type="p">S133:是否與負載電連接？</p>  
        <p type="p">S135:對需充電負載充電</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="583" publication-number="202619804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具有潤滑液注入之多孔表面及其製備方法</chinese-title>  
        <english-title>A POROUS SURFACE HAVING SLIPPERY LUBRICANT-INFUSED AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">B05D1/00</main-classification>  
        <further-classification edition="200601120241205B">B05D3/02</further-classification>  
        <further-classification edition="200601120241205B">B05D5/08</further-classification>  
        <further-classification edition="200601120241205B">B05D7/24</further-classification>  
        <further-classification edition="201101120241205B">B82Y30/00</further-classification>  
        <further-classification edition="201101120241205B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>振興醫療財團法人振興醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG HSIN GENERAL HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏菘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, POSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧凱熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KAI-HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韋彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林棋凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孝惇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種具有潤滑液注入之多孔表面及其製備方法，其製備方法包括:  首先提供基材，再提供多數表面顆粒的組成，接著固著該多數表面顆粒於該基材上，以形成多孔顆粒表面，以及，最終形成潤滑液表面於該多孔顆粒表面。本發明一種具有潤滑液注入之多孔表面，包括基材，多數個第一顆粒聚苯乙烯與多數個第二顆粒二氧化矽形成於該基材的表面上，潤滑劑浸潤多孔表面而形成於多數個第一顆粒，多數個第二顆粒之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a porous surface having slippery lubricant-infused and preparation method thereof, comprising, providing a bulk base; providing a surface particle composition having one or more kinds of surface particles dispersed in one or more dispersion liquids; attaching the surface particles to the bulk base to form porous particle surface; and, forming lubricant surface on the porous particle surface. Also, the present invention provides a porous surface having slippery lubricant-infused, including a base- material. A plurality of first polystyrene particles and a plurality of second silica particles are formed on the surface of the base-material. The lubricant infiltrates the porous surface to form between a plurality of first particles, and a plurality of second particles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:步驟</p>  
        <p type="p">12:步驟</p>  
        <p type="p">14:步驟</p>  
        <p type="p">16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="584" publication-number="202619644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可升降桌體的驅動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">A47B9/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江井精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CSPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可升降桌體的驅動裝置，包含一齒輪箱、複數第一驅動桿、複數第二驅動桿、複數第一連軸器、複數第二連軸器及一驅動馬達，該齒輪箱包括一主齒輪、一嚙合於該主齒輪的斜齒輪，及一與該主齒輪同軸連動的主驅動桿，該等第一驅動桿間隔設置於該主驅動桿的其中一側，該等第二驅動桿間隔設置於該主驅動桿的其中另一側，該等第一連軸器設置於該等第一驅動桿中的一者及該等第一驅動桿中彼此相鄰的兩者之間，該等第二連軸器設置於該等第二驅動桿中的一者及該等第二驅動桿中彼此相鄰的兩者之間，該驅動馬達設置於一桌體底部的中央處，以連動該斜齒輪轉動，而能便於安裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:齒輪箱</p>  
        <p type="p">21:外殼</p>  
        <p type="p">22:主齒輪</p>  
        <p type="p">23:斜齒輪</p>  
        <p type="p">24:主驅動桿</p>  
        <p type="p">3:第一驅動桿</p>  
        <p type="p">4:第二驅動桿</p>  
        <p type="p">5:第一連軸器</p>  
        <p type="p">6:第二連軸器</p>  
        <p type="p">7:驅動馬達</p>  
        <p type="p">93:第一伸縮組</p>  
        <p type="p">94:第二伸縮組</p>  
        <p type="p">X:長方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="585" publication-number="202621255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多位元鐵電電晶體、其製備方法及內容可定址記憶體單元</chinese-title>  
        <english-title>MULTI-BIT FEFET AND MANUFACTURE METHOD THEREOF AND CONTENT ADDRESSABLE MEMORY CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B51/30</main-classification>  
        <further-classification edition="200601120250303B">G11C15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中央大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐英瓚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YING-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡堉秭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白家碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, CHIA-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多位元鐵電電晶體包含半導體基板、介面層以及閘極堆疊結構，並經過電漿處理。半導體基板具有上表面，介面層設置於半導體基板的上表面，閘極堆疊結構設置於介面層遠離半導體基板的一側。閘極堆疊結構包含材料堆疊層及屏障層，屏障層設置於材料堆疊層遠離介面層的一側。經過電漿處理的多位元鐵電電晶體可降低介面缺陷，提升存儲效率及操作的穩定性、耐用性。一種多位元鐵電電晶體的製備方法及包含多位元鐵電電晶體的內容可定址記憶體單元亦被提供。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-bit FeFET treated by plasma includes a semiconductor substrate, an interface layer and a gate stack structure. The semiconductor substrate has an upper surface, the interface layer is disposed on the upper surface of the semiconductor substrate, and the gate stack structure is disposed on a side of the interface layer away from the semiconductor substrate. The gate stack structure includes a material stack layer and a barrier layer. The barrier layer is disposed on a side of the material stack layer away from the interface layer. This multi-bit FeFET may reduce the interface defects and improve the storage efficiency, the operational stability and the durability. A method for manufacturing the multi-bit FeFET and a content addressable memory including the multi-bit ferroelectric transistor are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20、S30、S40:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="586" publication-number="202620820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛擬實境導入葉克膜訓練之學習系統、方法及其電腦可讀媒介</chinese-title>  
        <english-title>TRAINING SYSTEM USING VIRTUAL-REALITY ASSISTED EXTRA-CORPOREAL MEMBRANE OXGENATION, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">G09B9/00</main-classification>  
        <further-classification edition="200601120250204B">G09B23/28</further-classification>  
        <further-classification edition="200601120250204B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛教慈濟醫療財團法人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDDHIST TZU CHI MEDICAL FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹津祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHAN, JINYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONGE, LEE-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUN CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種虛擬實境導入葉克膜訓練之學習系統及其方法，使用者可以選擇不同角色及模擬場景進行學習，進而讓使用者能利用虛擬實境設備進行醫療學習與訓練，特別的是，學習模組提供單人訓練模式以及團隊訓練模式，該單人訓練模式讓使用者單一人學習，該團隊訓練模式則可讓多位使用者同時進行訓練，目的就是要強化整個醫療團隊在手術過程中合作默契，據上，本發明有助於醫療團隊在面臨病患心臟停止的緊急情況下，有效率地建立體外維生支持(ECLS)系統與生命循環維持。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a training system using virtual-reality assisted Extracorporeal membrane oxygenation (ECMO). Users can choose different roles and simulated scenes for learning, thereby allowing the users to use virtual reality equipment for medical learning and training. In particular, a single-person training mode and a team training mode are provided by a learning module. The single-person training mode allows the user to learn alone. The team training mode allows multiple users to train at the same time, and the purpose is to strengthen the tacit cooperation of the entire medical team during the operation. In the present invention, an extracorporeal life support (ECLS) system and life cycle maintenance can be established efficiently by the medical team in the emergency situation of a patient's cardiac arrest. The present invention also provides a computer-readable medium for executing the method of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:虛擬實境導入葉克膜訓練之學習系統</p>  
        <p type="p">10:場景模組</p>  
        <p type="p">11:角色模組</p>  
        <p type="p">12:訓練內容資料庫</p>  
        <p type="p">13:學習模組</p>  
        <p type="p">2:虛擬實境設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="587" publication-number="202621527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260224B">H10W74/00</main-classification>  
        <further-classification edition="202601120260224B">H10W72/20</further-classification>  
        <further-classification edition="202601120260224B">H10W74/01</further-classification>  
        <further-classification edition="202601120260224B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪維伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林維暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要於電子封裝件邊緣形成壩體，以止擋封裝材溢流至下方，因而該封裝材不會接觸下方之導電元件，故於後續回銲該導電元件時能避免該導電元件發生未濕潤的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package has at least one dam at the edge thereof to prevent packaging material from overflowing to the bottom of the electronic package. Therefore, the packaging material is free from contacting with the conductive components forming on the bottom of the electronic package, so the problem of non-wetting of the conductive component can be avoided when the conductive components reflow.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">20:線路結構</p>  
        <p type="p">21:電子元件</p>  
        <p type="p">23:導電柱</p>  
        <p type="p">24:佈線結構</p>  
        <p type="p">240:絕緣層</p>  
        <p type="p">241:佈線層</p>  
        <p type="p">25:包覆層</p>  
        <p type="p">25a:第一表面</p>  
        <p type="p">25b:第二表面</p>  
        <p type="p">26:電子裝置</p>  
        <p type="p">260:導電凸塊</p>  
        <p type="p">27:導電元件</p>  
        <p type="p">28:封裝材</p>  
        <p type="p">29:壩體</p>  
        <p type="p">30:承載結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="588" publication-number="202620623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池之韌體的更新方法、復原方法與備份方法</chinese-title>  
        <english-title>UPDATING METHOD, RECOVERY METHOD AND BACKUP METHOD FOR FIRMWARE OF BATTERY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250208B">G06F8/65</main-classification>  
        <further-classification edition="200601120250208B">G06F13/38</further-classification>  
        <further-classification edition="201301120250208B">G06F21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佩儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池之韌體的更新方法、復原方法與備份方法。電池之韌體的更新方法包括以下步驟。判斷一電子裝置是否收到一更新指令。若電子裝置收到更新指令，則判斷一硬碟之一系統磁碟分割是否存在一韌體備份資料。若硬碟存在韌體備份資料，則判斷更新指令是否存在一第一級密封金鑰或一第二級密封金鑰。若更新指令存在第一級密封金鑰，則對電池之韌體的一第一級資料進行更新。若更新指令存在第二級密封金鑰，則對電池之韌體的第一級資料及一第二級資料進行更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An updating method, a recovery method and a backup method for a firmware of a battery are provided. The updating method for the firmware of the battery includes the following steps. Whether an electronic device has received an update command is determined. If the electronic device receives the update command, whether the firmware backup data is stored in a EFI System Partition (ESP) of a hard disk is determined. If the firmware backup data is stored in the hard disk, whether the update command contains a first seal key or a second seal key is determined. If the update command contains the first seal key, a first-level data of the firmware is updated. If the update command contains the second seal key, the first-level data and a second-level data of the firmware are updated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330,S340,S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="589" publication-number="202621128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測電路及其操作方法</chinese-title>  
        <english-title>SENSING CIRCUIT AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250121B">H04N25/70</main-classification>  
        <further-classification edition="200601120250121B">H03K5/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-JHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈裕棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感測電路及其操作方法。感測電路包括光感測元件、開關元件、比較器電路以及輸出電路。光感測元件在第一節點上產生光感測電壓。開關元件耦接在第一節點以及第二節點之間。比較器電路耦接第一節點以及第二節點。比較器電路比較光感測電壓以及第一參考電壓以在第二節點上產生脈衝寬度電壓。輸出電路耦接第二節點。輸出電路根據脈衝寬度電壓，以基於具有第一電壓值的第二參考電壓產生輸出電壓。第一電壓值大於參考地電壓值。如此，光感測操作的線性度被提高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensing circuit and an operating method thereof are provided. The sensing circuit includes a light sensing element, a switch element, a comparator circuit and an outputting circuit. The light sensing element generates a light sensing voltage at a first node. The switch element is coupled between the first node and a second node. The comparator circuit is coupled to the first node and the second node. The comparator circuit compares the light sensing voltage with a first reference voltage to generate a pulse width voltage at the second node. The outputting circuit is coupled to the second node. The outputting circuit generates an output voltage according to the pulse width voltage, based on the second reference voltage with a first voltage value. The first voltage value is greater than a reference ground voltage value. Thereby, a linearity of light sensing operation is increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感測電路</p>  
        <p type="p">110:光感測元件</p>  
        <p type="p">120:比較器電路</p>  
        <p type="p">130:輸出電路</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">SW1:第一開關元件</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VPD:光感測電壓</p>  
        <p type="p">VPW:脈衝寬度電壓</p>  
        <p type="p">VREF1:第一參考電壓</p>  
        <p type="p">VREF2:第二參考電壓</p>  
        <p type="p">VS:電源電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="590" publication-number="202619651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143846</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>泡茶容器與其泡茶方法</chinese-title>  
        <english-title>CONTAINER FOR BREWING TEA AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">A47G19/14</main-classification>  
        <further-classification edition="200601120250121B">A47J31/00</further-classification>  
        <further-classification edition="200601120250121B">A47J31/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>七三茶堂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>7TEAHOUSE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王明祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章格銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合泡茶、聞香、品茶功能的容器，包括主體、內壺蓋、容器蓋、把柄。主體包含相連接的下部、上部及底部，其中下部與底部構成具有第一空間的內壺身，上部具有第二空間。在主體的內表面以及下部與上部的交界處，下部的第一壁厚大於上部的第二壁厚，從而構成環狀凸緣。內壺蓋置放在環狀凸緣上，並包含向上延伸的椎體。容器蓋置放在上部的容器口。把柄與主體的外表面連接。第一空間用於先後置放茶葉以及第一熱水以產生第一茶湯，第二空間用於在第一茶湯產生後移除內壺蓋以注入第二熱水從而產生第二茶湯。還提供一種使用上述容器的泡茶方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A container capable of brewing, tasting, and scenting tea includes a body, an inner pot lid, a cup lid, and a handle. The body includes an upper part, a lower part on the upper part, and a bottom below the lower part. The lower part and the bottom constitute an inner pot with a first space and the upper part includes a second space. In the inner wall of the body and the junction between the lower part and the upper part, a first wall thickness of the lower part is greater than a second wall thickness of the upper part, thereby forming an annular flange. The inner pot lid is placed on the annular flange and includes a cone extending upward. The cup lid is placed on an opening of the upper part. The handle connects with the outer surface of the body. The first space is used to place tea leaves and a first hot water to produce a first tea liquor. A second hot water is poured into the second space to produce a second tea liquor after producing the first tea liquor and removing the inner pot lid. A method of brewing tea using the above container is further provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:泡茶容器</p>  
        <p type="p">10:主體</p>  
        <p type="p">11:內壺蓋</p>  
        <p type="p">12:容器蓋</p>  
        <p type="p">13:把柄</p>  
        <p type="p">101:下部</p>  
        <p type="p">102:上部</p>  
        <p type="p">103:環狀凸緣</p>  
        <p type="p">104:底部</p>  
        <p type="p">110:錐體</p>  
        <p type="p">111:第一凹部</p>  
        <p type="p">112:內壺蓋延</p>  
        <p type="p">121:容器蓋紐</p>  
        <p type="p">122:第二凹部</p>  
        <p type="p">123:容器蓋延</p>  
        <p type="p">1011:第一空間</p>  
        <p type="p">1021:容器口</p>  
        <p type="p">1022:第二空間</p>  
        <p type="p">1041:圈足</p>  
        <p type="p">H:水平高度</p>  
        <p type="p">T1:第一壁厚</p>  
        <p type="p">T2:第二壁厚</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="591" publication-number="202620947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於燃料電池的電壓量測裝置與燃料電池模組</chinese-title>  
        <english-title>VOLTAGE MEASUREMENT DEVICE FOR FUEL CELL AND FUEL CELL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241127B">H01M8/04537</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏葆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HONG-BAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周裕福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YUH-FWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡英文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YIN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康顧嚴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, KU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉靜蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於燃料電池的電壓量測裝置與燃料電池模組。電壓量測裝置包含電路板、導電膠條與遮罩。電路板包含基板與在基板上的多個電性接點。導電膠條包含交錯配置的多個絕緣部與多個導電部。遮罩配置於電路板與導電膠條之間。遮罩包含彼此分開的多個遮罩開口部。遮罩開口部使多個導電部的一部分暴露。電路板通過電性接點與導電部的該部分電性連接燃料電池以獲取燃料電池的電壓值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage measurement device for a fuel cell and a fuel cell module are provided. The voltage measurement device includes a circuit board, a conductive silicone rubber and a mask. The circuit board includes a substrate and electrical contacts on the substrate. The conductive silicone rubber includes insulating parts and conductive parts arranged alternately. The mask is disposed between the circuit board and the conductive silicone rubber. The mask includes mask openings separated from each other. The mask openings expose a portion of the conductive parts. The circuit board is electrically connected to a fuel cell through the electrical contacts and the portion of the conductive parts to obtain the voltage value of the fuel cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電壓量測裝置</p>  
        <p type="p">110:電路板</p>  
        <p type="p">111:基板</p>  
        <p type="p">112:電子元件</p>  
        <p type="p">113:電性接點</p>  
        <p type="p">130:遮罩</p>  
        <p type="p">132:遮罩開口部</p>  
        <p type="p">134:遮罩本體</p>  
        <p type="p">150:導電膠條</p>  
        <p type="p">152:導電部</p>  
        <p type="p">154:絕緣部</p>  
        <p type="p">200:燃料電池</p>  
        <p type="p">202:電池堆</p>  
        <p type="p">204a,204b:集電板</p>  
        <p type="p">206a,206b:端板</p>  
        <p type="p">212:單電池</p>  
        <p type="p">2121:陽極板</p>  
        <p type="p">2122:膜電極組</p>  
        <p type="p">2123:陰極板</p>  
        <p type="p">S1:間隔</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="592" publication-number="202620883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錯誤更正方法、記憶體儲存裝置及記憶體控制電路單元</chinese-title>  
        <english-title>ERROR HANDLE METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">G11C29/42</main-classification>  
        <further-classification edition="200601120250319B">G11C16/06</further-classification>  
        <further-classification edition="200601120250319B">G06F11/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾士家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, SHIH-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張議方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種錯誤更正方法、記憶體儲存裝置及記憶體控制電路單元。所述錯誤更正方法包括：統計第一錯誤更正流程的第一解碼率，其中第一錯誤更正流程包括基於第一順序被執行的多個解碼操作；以及響應於第一解碼率小於第一閾值，將第一錯誤更正流程切換為第二錯誤更正流程，其中第二錯誤更正流程包括基於第二順序被執行的多個解碼操作，其中第二順序所指示的第一個解碼操作的解碼能力優於第一順序所指示的第一個解碼操作的解碼能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An error handle method, a memory storage device and a memory control circuit unit are provided. The error handle method includes: counting a first decoding rate of a first error handle process, wherein the first error handle process includes a plurality of decoding operations performed based on a first order; and in response to the first decoding rate being less than a first threshold, switching the first error handle process to a second error handle process, wherein the second error handle process includes a plurality of decoding operations performed based on a second order, wherein a decoding capability of a first decoding operation indicated by the second order is better than a decoding capability of a first decoding operation indicated by the first order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1001:步驟(統計第一錯誤更正流程的第一解碼率，其中第一錯誤更正流程包括基於第一順序被執行的多個解碼操作)</p>  
        <p type="p">S1002:步驟(響應於第一解碼率小於第一閾值，將第一錯誤更正流程切換為第二錯誤更正流程，其中第二錯誤更正流程包括基於第二順序被執行的多個解碼操作，其中第二順序所指示的第一個解碼操作的解碼能力優於第一順序所指示的第一個解碼操作的解碼能力)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="593" publication-number="202619830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射電弧複合銲接裝置</chinese-title>  
        <english-title>LASER ARC HYBRID WELDING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241125B">B23K26/346</main-classification>  
        <further-classification edition="201401120241125B">B23K26/348</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人金屬工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江祺璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林典永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DIAN-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童培鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳登益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DENG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射電弧複合銲接裝置包括：一雷射銲接單元，包括一雷射光束；一電弧銲接單元，包括一電弧銲槍；一氣罩，包括一環型內殼、一環型外殼、一內層空間及一外層空間；以及一環型輸氣管，包括一保護氣體入口及複數個吹氣孔，該些吹氣孔之開孔方向朝向加工件；其中該雷射光束穿過該內層空間而射向該加工件，且該電弧銲槍穿過該內層空間而朝向該加工件；該環型內殼朝向該加工件之一端形成一尺寸漸縮的噴嘴，且該噴嘴沿該中心軸突出於該環型外殼之外；以及該外層空間包括一廢氣吸入口及一廢氣排出口，該廢氣吸入口緊鄰該噴嘴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser arc hybrid welding device includes: a laser welding unit, including a laser beam; an arc welding unit, including an arc welding gun; a gas cover, including an annular inner shell, an annular outer shell, and an inner layer space and an outer layer space; and an annular gas tube, including a protective gas inlet and a plurality of blowing holes, opening directions of the blowing holes facing a workpiece; wherein the laser beam is emitted through the inner space toward the workpiece, and the arc welding gun passes through the inner space toward the workpiece; one end of the annular inner shell toward the workpiece is form to a nozzle with tapering size, and the nozzle protrudes from the annular outer shell along the central axis.; and the outer layer space includes a waste gas inlet and a waste gas outlet, the waste gas inlet is adjacent to the nozzle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射電弧複合銲接裝置</p>  
        <p type="p">11:雷射銲接單元</p>  
        <p type="p">111:雷射光束</p>  
        <p type="p">112:鏡筒</p>  
        <p type="p">113:聚焦鏡</p>  
        <p type="p">114:雷射保護鏡</p>  
        <p type="p">12:電弧銲接單元</p>  
        <p type="p">120:銲槍尖端</p>  
        <p type="p">121:電弧銲槍</p>  
        <p type="p">13:氣罩</p>  
        <p type="p">131:環型內殼</p>  
        <p type="p">132:環型外殼</p>  
        <p type="p">133:內層空間</p>  
        <p type="p">134:外層空間</p>  
        <p type="p">1341:廢氣吸入口</p>  
        <p type="p">1342:廢氣排出口</p>  
        <p type="p">135:噴嘴</p>  
        <p type="p">14:氣罩</p>  
        <p type="p">141:保護氣體入口</p>  
        <p type="p">151:保護氣體入口管</p>  
        <p type="p">152:保護氣體供應單元</p>  
        <p type="p">161:廢氣排出管</p>  
        <p type="p">162:抽氣單元</p>  
        <p type="p">2:加工件</p>  
        <p type="p">C1:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="594" publication-number="202620615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態儲存陣列組合</chinese-title>  
        <english-title>DYNAMIC STORAGE ARRAY GROUP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威聯通科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QNAP SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動態調整儲存陣列中儲存裝置組合之方法，係儲存設備根據儲存陣列即時之資料讀寫效能及資料安全性，判斷是否需調整儲存陣列之儲存裝置組合樣態。當儲存陣列資料安全值小於儲存陣列資料安全係數，則將閒置中儲存裝置健康度最高之一儲存裝置加入一儲存陣列之運作中。在符合儲存陣列資料安全值大於儲存陣列資料安全係數前提下，當資料讀寫效能需求值大於資料讀寫效能閾值，則將一儲存陣列中隨機存取效能值最低之一儲存裝置停止運作並閒置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for dynamically adjusting the combination of storage devices in a storage array involves determining whether to adjust the combination of storage devices in the storage array based on the real-time data read/write performance and data security of the storage array. When the data security value of the storage array is less than the data security coefficient of the storage array, one of the idle storage devices with the highest health is added to the operation of the storage array. Under the premise that the data security value of the storage array is greater than the data security coefficient of the storage array, when the data read/write performance demand value is greater than the data read/write performance threshold, one of the storage devices in the storage array with the lowest random access performance is stopped and idled.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202~212:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="595" publication-number="202620348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於帶有莢殼之穀物/果實的乾燥系統與乾燥方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260224B">F26B21/00</main-classification>  
        <further-classification edition="200601120260224B">A23B9/08</further-classification>  
        <further-classification edition="202601120260224B">F26B21/35</further-classification>  
        <further-classification edition="200601120260224B">F26B3/18</further-classification>  
        <further-classification edition="200601120260224B">F26B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>農業部農業試驗所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN AGRICULTURAL RESEARCH INSTITUTE, MINISTRY OF AGRICULTURE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾祥恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIANG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇文瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於帶有莢殼之穀物/果實的乾燥系統與乾燥方法，該乾燥方法包含乾燥步驟與冷卻步驟，於該乾燥步驟，會控制該乾燥系統的熱風裝置將產生的熱氣流由下往上或上往下通過乾燥倉，再使通過該乾燥倉且帶有水氣的熱氣流由該乾燥系統的排氣裝置排至外界。並會於所述穀物/果實的濕度增幅未達F％以上時，改為執行該冷卻步驟，使熱風裝置將未加熱的氣流由下往上或上往下通過乾燥倉，並使該排氣裝置對外強制排氣。透過該乾燥方法設計，能更有效率地自動化進行帶有莢殼之穀物/果實的乾燥處理，並提高所述穀物/果實的乾燥品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">71:預判步驟</p>  
        <p type="p">711:預熱子步驟</p>  
        <p type="p">712:乾燥狀態預判子步驟</p>  
        <p type="p">72:初乾步驟</p>  
        <p type="p">721:第一初乾子步驟</p>  
        <p type="p">722:第二初乾子步驟</p>  
        <p type="p">73:乾燥步驟</p>  
        <p type="p">731:正壓乾燥子步驟</p>  
        <p type="p">732:負壓除水子步驟</p>  
        <p type="p">733:乾燥狀態判斷子步驟</p>  
        <p type="p">74:均質步驟</p>  
        <p type="p">75:冷卻步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="596" publication-number="202620856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置及其初始化方法</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY APPARATUS AND INITIALIZATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G11C7/20</main-classification>  
        <further-classification edition="200601120250324B">G11C11/413</further-classification>  
        <further-classification edition="200601120250324B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉潤林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體記憶體裝置及其初始化方法。半導體記憶體裝置包括記憶體陣列、位址輸入緩衝器、解碼器以及控制電路。記憶體陣列具有多個記憶體區塊。每個記憶體區塊包括多個儲存單元。位址輸入緩衝器經配置以接收位址資料。解碼器經配置以對位址資料進行解碼。控制電路經配置以接收讀取寫入選擇信號及設定信號，且據以依序對記憶體區塊進行初始化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory apparatus and an initialization method thereof are provided. The semiconductor memory apparatus includes a memory array, an address input buffer, a decoder, and a control circuit. The memory array has a plurality of memory blocks. Each of the memory blocks includes a plurality of storage units. The address input buffer is configured to receive address data. The decoder is configured to decode the address data. The control circuit is configured to receive a read write selection signal and a set signal, and accordingly initialize the memory blocks in sequence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體記憶體裝置</p>  
        <p type="p">110:記憶體陣列</p>  
        <p type="p">112_1~112_m:記憶體區塊</p>  
        <p type="p">112_T:目標記憶體區塊</p>  
        <p type="p">114_1~114_n:儲存單元</p>  
        <p type="p">120:位址輸入緩衝器</p>  
        <p type="p">130、130_1、130_2:解碼器、列解碼器、行解碼器</p>  
        <p type="p">140:驅動與感測電路</p>  
        <p type="p">150:資料輸入輸出緩衝器</p>  
        <p type="p">160:控制電路</p>  
        <p type="p">A[9：0]:位址資料</p>  
        <p type="p">CEb:晶片致能信號</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">Din、Dout:輸入資料、輸出資料</p>  
        <p type="p">RWb:讀取寫入選擇信號</p>  
        <p type="p">SET:設定信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="597" publication-number="202619902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車輪圈</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B60B21/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫權工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鈺凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種自行車輪圈，其係一輪圈具有一外環壁、一內環壁，以及兩側各一分別連伸外環壁與內環壁之側壁，側壁與外環壁連接處形成一可供嵌設外胎之延伸部，主要係改變側壁的形態，其係包含一第一側及一第二側，第一側自內環壁側面，在朝向外環壁適處形成一有角度之轉折部，轉折部形成一往外擴伸的第二側，使得第一側與中心線的夾角小於第二側與中心線的夾角，並且於側壁內側與外環壁之間連設至少一強化肋，以有效地提昇輪圈側向應力撞擊的抵抗剛性強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:輪圈</p>  
        <p type="p">11:外環壁</p>  
        <p type="p">12:內環壁</p>  
        <p type="p">13:側壁</p>  
        <p type="p">130:轉折部</p>  
        <p type="p">131:第一側</p>  
        <p type="p">132:第二側</p>  
        <p type="p">14:強化肋</p>  
        <p type="p">141:鏤空部</p>  
        <p type="p">15:延伸部</p>  
        <p type="p">16:勾槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="598" publication-number="202619706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於視神經疾病之治療及/或預防之胺基萘醌化合物</chinese-title>  
        <english-title>AMINONAPHTHOQUINONE COMPOUNDS FOR TREATMENT AND/OR PREVENTION OF OPTIC NEUROPATHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">A61K31/166</main-classification>  
        <further-classification edition="200601120250701B">A61K31/167</further-classification>  
        <further-classification edition="200601120250701B">A61K31/4409</further-classification>  
        <further-classification edition="200601120250701B">A61K31/16</further-classification>  
        <further-classification edition="200601120250701B">A61K31/435</further-classification>  
        <further-classification edition="200601120250701B">A61P27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻　雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻　雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供胺基萘醌化合物用於治療及/或預防視神經疾病的方法及用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods and uses of aminonaphthoquinone compounds in treatment and/or prevention of an optic neuropathy.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="599" publication-number="202621096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143867</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路流量控制系統及其操作方法</chinese-title>  
        <english-title>INTERNET TRAFFIC CONTROLLING SYSTEM AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L47/10</main-classification>  
        <further-classification edition="202201120250303B">H04L67/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴全一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, CHUAN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃承澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾蓹琁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮柏森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, PO-SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁思淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUEN, SZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種網路流量控制系統的操作方法，包括接收第一資料；將第一資料排序並產生序列；偵測網站頁面的參數，並且依據參數產生第一數量；以及依據第一數量將序列中對應的第一資料依序導入網站頁面，其中導入網站頁面的第一資料的數量等於第一數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of operating an internet traffic controlling system, comprising: receiving a first data; arranging the first data and generating a sequence; detecting parameters of a website page, and generating a first number according to the parameters; and directing the corresponding first data of the sequence to the website page according to the first number, wherein a number of the first data directed to the website page is equal to the first number.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:操作方法</p>  
        <p type="p">401~408:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="600" publication-number="202620200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鼓風嘴結構及使用鼓風嘴結構進行噴吹操作的方法</chinese-title>  
        <english-title>PORTED TUYERE STRUCTURE AND METHOD OF USING PORTED TUYERE STRUCTURE FOR BLOWING OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">C21B7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明志科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立聯合大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNITED UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, BO-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聰彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林惠娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUEY-JIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鉉忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSUAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜憲文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, SHAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鼓風嘴結構及使用鼓風嘴結構進行噴吹操作的方法。鼓風嘴結構包含本體、鼓風管以及雙層管結構。本體配置以安裝在高爐的爐壁上，本體具有相對的前端及後端，其中前端位於爐壁的內側，後端位於爐壁的外側。鼓風管延伸在本體中，且配置以輸送鼓風至高爐中。雙層管結構埋設在本體中。雙層管結構從本體之後端延伸至鼓風管並與鼓風管連通，並且包含互相套設之內管與外管。內管之前端開口相對於外管之前端開口內縮，以在其間形成一軸向間距，軸向間距定義一混合區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a ported tuyere structure and a method of using the ported tuyere structure for blowing operation. The ported tuyere structure includes a body, a blower pipe and a double-layer tube structure. The body is configured to be installed on a furnace wall of a blast furnace. The body has a front end and a rear end opposite to each other, in which the front end is located inside the furnace wall and the rear end is located outside the furnace wall. A blower pipe extends within the body and is configured to deliver blast air into the blast furnace. The double-layer pipe structure is embedded in the body. The double-layer tube structure extends from the rear end of the body to the blower pipe and is communicated with the blast duct, and includes an inner tube and an outer tube that are sleeved together. A front end opening of the inner tube is retracted relative to a front end opening of the outer tube, so as to an axial distance is formed therebetween, and the axial distance defines a mixing area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鼓風嘴結構</p>  
        <p type="p">11:本體</p>  
        <p type="p">111:前端</p>  
        <p type="p">112:後端</p>  
        <p type="p">12:鼓風管</p>  
        <p type="p">13:雙層管結構</p>  
        <p type="p">131:內管</p>  
        <p type="p">132:外管</p>  
        <p type="p">W1:爐壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="601" publication-number="202620964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式天線裝置與其相位校正方法</chinese-title>  
        <english-title>INTEGRATED ANTENNA DEVICE AND PHASE CALIBRATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">H01Q3/30</main-classification>  
        <further-classification edition="200601120250304B">H01Q21/00</further-classification>  
        <further-classification edition="201801120250304B">H04B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稜研科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹鈞丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSUAN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林先武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIAN WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合式天線裝置與其相位校正方法。整合式天線裝置包括多個貼片天線單元形成的天線陣列以及波束成型積體電路。天線陣列設置於基板的第一表面上。此些貼片天線單元圍繞天線陣列的一陣列中心而對稱排列，且此些貼片天線單元其中每一者包括第一饋電點與第二饋電點。波束成型積體電路設置於基板的第二表面上，並連接此些貼片天線單元其中每一者的第一饋電點與第二饋電點。此些貼片天線單元其中每一者的第一饋電點與第二饋電點設置於貼片天線單元其中每一者相對於天線陣列的陣列中心的外側，且波束成型積體電路與天線陣列的中心區域重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated antenna device and a phase calibration method thereof are provided. The integrated antenna device includes an antenna array formed by multiple patch antenna units and a beamforming integrated circuit (BFIC). The antenna array is disposed on a first surface of a substrate. The patch antenna units are symmetrically arranged around an array center of the antenna array, and each of the patch antenna units includes a first feed point and a second feed point. The BFIC is disposed on a second surface of the substrate and connected to the first feed point and the second feed point of each of the patch antenna units. The first feed point and the second feed point of each of the patch antenna units are disposed outside each of the patch antenna units relative to the array center of the antenna array, and the BFIC and the central area of the antenna array overlap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合式天線裝置</p>  
        <p type="p">110:連接部</p>  
        <p type="p">120:匯流排介面</p>  
        <p type="p">RF_A,RF_B:射頻信號</p>  
        <p type="p">BFIC1:波束成型積體電路</p>  
        <p type="p">Ant_1~Ant_4:貼片天線單元</p>  
        <p type="p">VDD1,VDD2:外部電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="602" publication-number="202619625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>捕鼠器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">A01M23/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台南家專學校財團法人台南應用科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳廷維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紹恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許育銍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣仲廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宥霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭勝柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝依良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種捕鼠器，包括一個外盒體，所述外盒體包括位於內部的一個誘捕空間，所述外盒體建構成允許一隻老鼠進入所述誘捕空間但不允許所述老鼠從所述誘捕空間移動至所述外盒體外側，所述外盒體內容置一個壓縮氣瓶，當所述誘捕空間內沒有老鼠時，所述壓縮氣瓶不釋放導致窒息的氣體，當有一隻老鼠進入所述所述誘捕空間內時，所述老鼠的體重導致所述壓縮氣瓶釋放使老鼠窒息的氣體進入所述誘捕空間內，使得在所述誘捕空間內的所述老鼠窒息死亡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:捕鼠器</p>  
        <p type="p">20:底座</p>  
        <p type="p">22:第一端</p>  
        <p type="p">24:第二端</p>  
        <p type="p">26:直立部</p>  
        <p type="p">28:水平部</p>  
        <p type="p">30:擋牆</p>  
        <p type="p">32:容置室</p>  
        <p type="p">34:軸接部</p>  
        <p type="p">36:開口</p>  
        <p type="p">38:外樞部</p>  
        <p type="p">40:內樞部</p>  
        <p type="p">42:止逆蓋</p>  
        <p type="p">44:閉合彈簧</p>  
        <p type="p">46:閥體</p>  
        <p type="p">48:觸發開關</p>  
        <p type="p">50:壓縮氣瓶</p>  
        <p type="p">52:觸發件</p>  
        <p type="p">54:內端</p>  
        <p type="p">56:外端</p>  
        <p type="p">57:樞部</p>  
        <p type="p">58:定位部</p>  
        <p type="p">60:內盒體</p>  
        <p type="p">62:進入空間</p>  
        <p type="p">63:氣孔</p>  
        <p type="p">64:定位孔</p>  
        <p type="p">65:入口端</p>  
        <p type="p">66:端蓋</p>  
        <p type="p">68:外蓋</p>  
        <p type="p">70:樞接耳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="603" publication-number="202620744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>即時通訊認證交易平台系統及其處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250303B">G06Q20/38</main-classification>  
        <further-classification edition="201201120250303B">G06Q20/42</further-classification>  
        <further-classification edition="202201120250303B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡政嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種即時通訊認證交易平台系統及其處理方，應用於透過一電信業者之行動裝置的認證，使一用戶透過該行動裝置至一電商平台進行購物消費，並經由該電商平台傳送一信用卡結帳訊息給一金融機構，以通知該金融機構進行線上刷卡交易，該平台系統，包含：一接收模組、一分析模組及一記錄模組，一接收模組，其中該接收模組接收由該金融機構發出一請求查詢及傳送一用戶消費資訊，而藉由分析模組分析該用戶的門號，以得知該用戶行動裝置及門號的當下狀態以及併同該用戶消費資訊整合成一用戶訊息，利用RCS即時簡訊的動態互動模式，提供該金融機構能快速且有效地確認該筆之線上刷卡交易是否為本人消費，以確保安全地進行線上交易。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:即時通訊認證交易平台系統</p>  
        <p type="p">101:接收模組</p>  
        <p type="p">102:分析模組</p>  
        <p type="p">103:記錄模組</p>  
        <p type="p">10:用戶</p>  
        <p type="p">20:行動裝置</p>  
        <p type="p">30:電信業者</p>  
        <p type="p">50:金融機構</p>  
        <p type="p">60:號碼可攜資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="604" publication-number="202619798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維堆疊之光催化裝置</chinese-title>  
        <english-title>3D STACKED PHOTOCATALYTIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260223B">B01J35/39</main-classification>  
        <further-classification edition="202401120260223B">B01J35/50</further-classification>  
        <further-classification edition="200601120260223B">B01D53/62</further-classification>  
        <further-classification edition="200601120260223B">B01D53/86</further-classification>  
        <further-classification edition="202601120260223B">C01B3/04</further-classification>  
        <further-classification edition="201701120260223B">C01B32/40</further-classification>  
        <further-classification edition="200601120260223B">C07C1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周鶴修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HO-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫語恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種三維堆疊之光催化裝置，其包含一支撐架以及一第一集成組件，該第一集成組件包含一第一底板、一第一容置槽以及一第一頂板，該第一底板樞接於該支撐架之一第一樞接孔，該第一容置槽設置於該第一底板之一上方，且該第一容置槽之一內側設置一第一光催化件，該第一頂板設置於該第一容置槽之一上方，其中，一光線依序穿過該第一頂板以及該第一光催化件，使該第一光催化件產生一氣體，並以該第一底板於該第一樞接孔旋轉，並帶動該第一集成組件旋轉，以調整該第一光催化件之照射角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a 3D stacked photocatalytic device, which includes a support frame and a first integrated component. The first integrated component includes a first bottom plate, a first receiving tank and a first top plate. The first bottom plate is pivoted In a first pivot hole of the support frame, the first accommodation groove is provided above one of the first bottom plates, and a first photocatalytic member is provided on the inside of the first accommodation groove, and the first top plate is disposed above one of the first accommodating grooves, wherein a light passes through the first top plate and the first photocatalytic component sequentially, causing the first photocatalytic component to generate a gas, and the first bottom plate is used to The first pivot hole rotates and drives the first integrated component to rotate to adjust the irradiation angle of the first photocatalytic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐架</p>  
        <p type="p">12:第一樞接孔</p>  
        <p type="p">20:第一集成組件</p>  
        <p type="p">22:第一底板</p>  
        <p type="p">24:第一容置槽</p>  
        <p type="p">26:第一頂板</p>  
        <p type="p">262:第一上穿孔</p>  
        <p type="p">B1:第一光催化件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="605" publication-number="202620757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用程式介面暨安全驗證整合服務系統及其方法</chinese-title>  
        <english-title>APPLICATION PROGRAMMING INTERFACE AND SECURITY VERIFICATION INTEGRATED SERVICE SYSTEM AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q40/02</main-classification>  
        <further-classification edition="201201120250303B">G06Q20/40</further-classification>  
        <further-classification edition="201301120250303B">G06F21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MENG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種應用程式介面暨安全驗證整合服務系統，包括輸入輸出裝置、內部伺服器及處理器。處理器包括介面存取模組、接口選擇模組及第二閘道模組。介面存取模組接收請求服務訊號。接口選擇模組請求對應的應用程式介面模組的至少其中一者產生邏輯驗證命令。第二閘道模組向內部伺服器請求對應於金融服務的帳戶資料，並回傳至對應的應用程式介面模組的至少其中一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide an application programming interface and security verification integrated service system, including an input/output device, an internal server, and a processor. The processor includes an interface access module, an interface selection module and a second gateway module. The interface access module receives a service request signal. The interface selection module requests at least one of corresponding application programming interface modules to generate a logic verification request. The second gateway module requests account data corresponding to a financial service from the internal server and returns the account data to the at least one of corresponding application programming interface modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:內部伺服器</p>  
        <p type="p">130:第一閘道模組</p>  
        <p type="p">140:接口選擇模組</p>  
        <p type="p">150:第二閘道模組</p>  
        <p type="p">160:服務處理模組</p>  
        <p type="p">210,212,222,232,242,252,262:應用程式介面模組</p>  
        <p type="p">214,224,234,244,254,264:轉譯模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="606" publication-number="202621424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="202601120260223B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪上博充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAUE, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDOH, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森優一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田知希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在會整批地搬送多片基板並進行處理之基板處理裝置中提高基板搬送精度。 &lt;br/&gt;負載鎖定模組係具有配置在中心位置的周圍之多個台座區域、構成為具有會支撐基板的多個固定支撐銷且能夠在多個台座區域的上方以中心位置作為旋轉軸而旋轉之旋轉支撐部、及構成為能夠沿旋轉方向驅動旋轉支撐部之驅動機構。在負載鎖定模組與第一搬送模組或第二搬送模組之間搬送基板時，第一搬送機器人或第二搬送機器人會相對於固定支撐銷搬送基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20a:負載鎖定模組</p>  
        <p type="p">110:腔室</p>  
        <p type="p">111、112:搬出入口</p>  
        <p type="p">120:旋轉板</p>  
        <p type="p">121:臂部</p>  
        <p type="p">123:固定支撐銷</p>  
        <p type="p">140:台座</p>  
        <p type="p">152:支撐銷</p>  
        <p type="p">R1,R2,R3,R4:台座區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="607" publication-number="202619867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>夾爪裝置</chinese-title>  
        <english-title>GRIPPER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">B25J15/00</main-classification>  
        <further-classification edition="200601120250121B">B25J5/02</further-classification>  
        <further-classification edition="200601120250121B">B25J9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普泰光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROTAI PHOTONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種夾爪裝置，包括移動框部、夾取部以及致動部。移動框部具有一第一貫孔，該移動框部藉由一第一線性位移運動改變位置。夾取部用以夾取一物件，該夾取部具有一夾持結構，容置於該第一貫孔內，該夾持結構具有一容置空間，用以容置一物件。致動部用以於物件位於容置空間內時，推動移動框部進行第一線性位移運動，使得移動框部推擠夾持結構夾持物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gripper device comprising a movable frame part, grasping part, and actuating part. The movable frame part comprises a first through hole. The position of the movable frame part is changed through a first linear movement. The grasping part is utilized to grasp an object. The grasping part has a gripping structure accommodated within the first through hole and an accommodating space for accommodating the object. The actuating part is used to push the movable frame part to perform the first linear movement when the object is within the accommodating space, thereby causing the movable frame to push the gripping structure to grasp the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:夾爪裝置</p>  
        <p type="p">20:固定板</p>  
        <p type="p">20A:第一面</p>  
        <p type="p">20E第一導軌孔</p>  
        <p type="p">20F:導引通孔</p>  
        <p type="p">200:貫通孔</p>  
        <p type="p">21:移動框部</p>  
        <p type="p">22:夾取部</p>  
        <p type="p">220:移動板</p>  
        <p type="p">220a:第三貫孔</p>  
        <p type="p">220e:第四抵靠孔</p>  
        <p type="p">200f:第一鎖孔</p>  
        <p type="p">220g:第二鎖孔</p>  
        <p type="p">220B:第二面</p>  
        <p type="p">221:夾持結構</p>  
        <p type="p">23:致動部</p>  
        <p type="p">230:推板</p>  
        <p type="p">230a:第五貫孔</p>  
        <p type="p">230b:第六貫孔</p>  
        <p type="p">230c:導引通孔</p>  
        <p type="p">230e:第五抵靠孔</p>  
        <p type="p">230B:第二面</p>  
        <p type="p">231:推抵桿</p>  
        <p type="p">231a:抵靠部</p>  
        <p type="p">231b:推抵柱</p>  
        <p type="p">24a:第一彈性恢復元件</p>  
        <p type="p">24b:第二彈性恢復元件</p>  
        <p type="p">24c:第三彈性恢復元件</p>  
        <p type="p">25a、25b:固定元件</p>  
        <p type="p">28:導引柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="608" publication-number="202620699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於聯邦學習的模型訓練方法與系統</chinese-title>  
        <english-title>MODEL TRAINING METHOD AND SYSTEM BASED ON FEDERATED LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250320B">G06N3/098</main-classification>  
        <further-classification edition="201901120250320B">G06N20/00</further-classification>  
        <further-classification edition="202001120250320B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, BO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡婉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, WOAN-SHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祈均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種基於聯邦學習的模型訓練方法，適用於中央伺服器，方法包括從多個裝置分別接收多個第一模型參數組；計算多個裝置中的第一裝置對應的多個第一模型參數組的其中之一與多個裝置中的至少一其他裝置對應的多個第一模型參數組的至少其中之一之間的至少一第一距離；根據至少一第一距離，計算第一裝置對應的至少一第一權重；根據第一權重，計算第一模型參數組的加權平均，以得到第一裝置對應的第二模型參數組；以及發送第一裝置對應的第二模型參數組至第一裝置。此外，使用上述方法的系統亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for implementing model training based on federated learning is provided. The method includes: receiving multiple first model parameter sets respectively from multiple devices; calculating at least one first distance between one of the first model parameter sets corresponding to a first device among the multiple devices and at least one of the first model parameter sets corresponding to at least one other device among the multiple devices; calculating at least one first weight corresponding to the first device based on the at least one first distance; calculating a weighted average of the first model parameter sets based on the at least one first weight to obtain a second model parameter set corresponding to the first device; and sending the second model parameter set corresponding to the first device to the first device. In addition, a system using the method is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210、S220、S230、S240、S250:模型訓練方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="609" publication-number="202620402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於隨機外力之結構健康監測方法</chinese-title>  
        <english-title>A STRUCTURAL HEALTH MONITORING METHOD BASED ON RANDOM EXTERNAL FORCES.</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">G01M7/08</main-classification>  
        <further-classification edition="200601120250620B">G01M7/02</further-classification>  
        <further-classification edition="202301120250620B">G06N3/08</further-classification>  
        <further-classification edition="202201120250620B">G06V10/82</further-classification>  
        <further-classification edition="202201120250620B">G06V10/774</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚昭智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, GEORGE C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高宏宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, HUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林瑋荏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, WEN-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於隨機外力之結構健康監測方法，以隨機擺盪角數據進行運算處理，以此取得並轉換複數個隨機最大擺盪曲線後，產生對應之影像資訊，並以產生之影像資訊進行訓練，而可以獲取結構健康監測模型，藉此將量測之數據與模型重建之影像差異獲取不同堆疊次數之相似度分數，並經累加不同堆疊次數分數運算後，作為損壞嚴重程度之指標，實現小樣本、高精度之結構健康診斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a structural health monitoring method based on random external forces. The method comprises: extracting and transforming multiple random maximum swing curves through processing a random swing angle data to generate a corresponding image information. This image information is then used for training to obtain a structural health monitoring model. By comparing the measured data with the model-reconstructed images, similarity scores for different stacking counts can be obtained. By performing cumulative scoring based on different stacking counts, the score serves as an indicator of damage severity, and thereby achieving a structural health diagnosis with high accuracy based on limited sample sizes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p>  
        <p type="p">S4:步驟</p>  
        <p type="p">S5:步驟</p>  
        <p type="p">S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="610" publication-number="202619969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種稻殼炭及其製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241205B">C01B32/324</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種利用可可莢殼鹼灰為活化劑，將稻殼轉製成具多孔性之稻殼炭之方法。有鑑於可可莢殼鹼灰富含鉀鹽，本發明係將其循環利用為綠色觸媒於多孔性負碳材料之清潔生產，且木質纖維素原料選用國內大宗作物剩餘資材稻殼。本發明藉由適當的稻殼碳化溫度及鹼灰含浸率，可產製出具高孔洞（＞600 m &lt;sup&gt;2&lt;/sup&gt;/g）的稻殼炭產品，其孔洞特性遠優於以往的稻殼炭產品。本發明之稻殼炭亦可應用於工業及民生產業上，達到增匯、減碳、固碳及資源用續循環之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="611" publication-number="202620178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種稻殼炭生質燃料及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">C10L5/44</main-classification>  
        <further-classification edition="202201120241126B">B09B3/35</further-classification>  
        <further-classification edition="202201120241126B">B09B3/70</further-classification>  
        <further-classification edition="202201120241126B">B09B3/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種以稻殼炭為原料的生質燃料及其製備方法，其係包含藉鹼洗去除灰分以及藉焙燒進行碳固化的處理程序，藉由適當的施行條件，可從為農業廢料之稻殼製得高熱值之優異固態生質燃料，且該製備方法簡易又低耗能，同時可減少溫室氣體排放。本發明之生質燃料為結合生物資源與農業循環經濟面向之低碳創新綠色產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="612" publication-number="202620134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性無機雙組分防鏽及防火塗料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C09D1/00</main-classification>  
        <further-classification edition="200601120241205B">C09D5/08</further-classification>  
        <further-classification edition="200601120241205B">C09D5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊浩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱姿蒨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊浩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱姿蒨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水性無機雙組分防鏽及防火塗料，其至少包含以鎂化合物、矽烷、雲母、滑石粉、懸浮劑及二氧化矽為基礎，並以潔淨的水為稀釋溶劑之第一組分（A劑）；以及以磷化合物、鉀化合物、二氧化鈦、滑石粉、懸浮劑及二氧化矽為基礎，並以潔淨的水為稀釋溶劑之第二組分（B劑），使第一組分（A劑）及第二組分（B劑）分別以液態形式存在。俾於使用時，將第一組分（A劑）及第二組分（B劑）以相同比例劑量藉由噴塗方式直接覆蓋在噴塗標的物上，以達到防鏽及防火之目的。本發明因核心成分為天然無機礦物，硬固後乾縮性極微，具有良好之接著性又不易龜裂，且耐高溫及抗紫外線，亦無添加任何高分子化合物，不含揮發性有機物與有毒重金屬，無毒無味，對人體與環境無害，從而能達到符合綠色環保之標準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一組分(A劑)</p>  
        <p type="p">2:第二組分(B劑)</p>  
        <p type="p">3:噴塗</p>  
        <p type="p">4:噴塗標的物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="613" publication-number="202621316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X光感測器和其形成方法</chinese-title>  
        <english-title>X-RAY SENSOR AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F30/29</main-classification>  
        <further-classification edition="202501120250102B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達擎股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO DISPLAY PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宗漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開一些實施方式提供一種包括薄膜電晶體以及光電二極體的X光感測器。薄膜電晶體包括電性連接至第一源極/汲極區域和第二源極/汲極區域且位於兩者上方的氧化物半導體層、覆蓋氧化物半導體層的閘極介電層，以及閘極介電層上的閘極電極，其中閘極電極的垂直投影覆蓋的氧化物半導體層作為薄膜電晶體的通道。光電二極體位於第一源極/汲極區域上，其中氧化物半導體層包括延伸於第二源極/汲極區域頂表面上方的第一氧化物半導體部分、沿著光電二極體側壁延伸的第二氧化物半導體部分以及延伸於光電二極體頂表面上方的第三氧化物半導體部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of this disclosure provide a X-ray sensor including a thin film transistor and a photodiode. The thin film transistor includes an oxide semiconductor layer above and electrically connected to a first and a second source/drain region, a gate dielectric layer covering the oxide semiconductor layer, and a gate electrode on the gate dielectric layer, wherein a portion of the oxide semiconductor layer covered by a vertical projection of the gate electrode acts as a channel of the thin film transistor. The photodiode is on the first source/drain region, wherein the oxide semiconductor layer includes a first oxide semiconductor portion extending above a top surface of the second source/drain region, a second oxide semiconductor portion extending along a sidewall of the photodiode, and a third oxide semiconductor portion extending above a top surface of the photodiode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:X光感測器</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:第一源極/汲極區域</p>  
        <p type="p">104:第二源極/汲極區域</p>  
        <p type="p">105:薄膜電晶體</p>  
        <p type="p">110:光電二極體</p>  
        <p type="p">120:導線層</p>  
        <p type="p">130:第一保護層</p>  
        <p type="p">140:氧化物半導體層</p>  
        <p type="p">142:第一氧化物半導體部分</p>  
        <p type="p">144:第二氧化物半導體部分</p>  
        <p type="p">145:通孔</p>  
        <p type="p">146:第三氧化物半導體部分</p>  
        <p type="p">148:第四氧化物半導體部分</p>  
        <p type="p">150:電極層</p>  
        <p type="p">152:源極/汲極電極</p>  
        <p type="p">154:公共電極</p>  
        <p type="p">160:閘極介電層</p>  
        <p type="p">170:閘極電極</p>  
        <p type="p">172:第一閘極部分</p>  
        <p type="p">174:第二閘極部分</p>  
        <p type="p">176:第三閘極部分</p>  
        <p type="p">178:第四閘極部分</p>  
        <p type="p">180:第二保護層</p>  
        <p type="p">D1,D2:距離</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="614" publication-number="202620305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導通結構及其導通方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16B1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍隆國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鼎瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種導通結構及其導通方法，其包含身部及運動部。身部設有組接部；運動部與身部活動組合，運動部設有與組接部組合之扣接部，並扣接部扣接物體或另一身部。藉此，可使身部以運動部與物體或另一身部扣接或解扣，以完成至少兩物體之快速結合導通與分離，而達到反復快速結合導通與分離之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導通結構</p>  
        <p type="p">11:身部</p>  
        <p type="p">111:組接部</p>  
        <p type="p">112:對接部</p>  
        <p type="p">12:運動部</p>  
        <p type="p">121:扣接部</p>  
        <p type="p">122:操作部</p>  
        <p type="p">123:組接件</p>  
        <p type="p">124:斜面</p>  
        <p type="p">13:彈性元件</p>  
        <p type="p">15:對位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="615" publication-number="202620717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143966</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理配送請求之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR PROCESSING A SHIPPING REQUEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250620B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250620B">G06Q10/087</further-classification>  
        <further-classification edition="202301120250620B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250620B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁蘇魯　普拉提克　拉詹德蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYSURU, PRATHIK RAJENDRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>什理坎德　尼基萊什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRIKHANDE, NIKHILESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用以處理配送請求之技術。本發明之一實施例之方法可包括如下步驟：獲得商品之配送請求，上述配送請求包括出發地、目的地或商品中之至少一者之資訊；基於上述配送請求而產生包括一個以上之任務之第1配送計劃，上述一個以上之任務對應於上述出發地與上述目的地之間之至少一部分區間的配送作業；向第1作業人員終端傳輸上述一個以上之任務中之第1任務；及自上述第1作業人員終端接收上述第1任務之當前狀態之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:電子裝置</p>  
        <p type="p">502:用戶終端</p>  
        <p type="p">504:作業人員終端</p>  
        <p type="p">S510:動作</p>  
        <p type="p">S512:動作</p>  
        <p type="p">S520:動作</p>  
        <p type="p">S530:動作</p>  
        <p type="p">S532:動作</p>  
        <p type="p">S540:動作</p>  
        <p type="p">S542:動作</p>  
        <p type="p">S550:動作</p>  
        <p type="p">S552:動作</p>  
        <p type="p">S560:動作</p>  
        <p type="p">S562:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="616" publication-number="202620629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>向量處理電路與向量處理方法</chinese-title>  
        <english-title>VECTOR PRORVESSING CIRCUIT AND VECTOR PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250602B">G06F9/38</main-classification>  
        <further-classification edition="200601120250602B">G06F9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶心科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDES TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳忠和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHONG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖瑞傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, JUI CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供向量處理電路和向量處理方法。向量處理電路包括指令佇列、多個計算電路和控制電路。指令佇列包括第一縮減指令和第二縮減指令。計算電路具有多個管線階段。控制電路電性連接至指令佇列和計算電路。計算電路在多個時脈中交替產生第一縮減指令和第二縮減指令的結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a vector processing circuit and a vector processing method. The vector processing circuit includes an instruction queue, multiple calculation circuits, and a control circuit. The instruction queue includes a first reduction instruction and a second reduction instruction. The calculation circuits have multiple pipeline stages. The control circuit is electrically connected to the instruction queue and the calculation circuits. The calculation circuits alternatively generates results of the first reduction instruction and the second reduction instruction over multiple clocks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">250:向量暫存器檔</p>  
        <p type="p">260:指令佇列</p>  
        <p type="p">261~263:指令</p>  
        <p type="p">400:向量處理電路</p>  
        <p type="p">410:來源運算元</p>  
        <p type="p">420:選擇電路</p>  
        <p type="p">421~424:多工器</p>  
        <p type="p">430:目標運算元</p>  
        <p type="p">440:控制電路</p>  
        <p type="p">e0~e7:元素</p>  
        <p type="p">P0~P3:計算電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="617" publication-number="202621217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快拆裝置以及快拆裝置的操作方法</chinese-title>  
        <english-title>QUICK DISASSEMBLY DEVICE AND THE OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250512B">H05K5/15</main-classification>  
        <further-classification edition="200601120250512B">F16B21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁秀傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XIU-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快拆裝置以及快拆裝置的操作方法。快拆裝置包括第一連接機構以及第二連接機構。第一連接機構包括第一外殼；內殼可移動地設置於第一外殼內，且包括卡槽，其中卡槽包括鎖固區段、連接區段以及解鎖區段；主彈性元件連接第一外殼以及內殼。第二連接機構包括第二外殼；切換件，可移動地設置於第二外殼內，且包括卡榫；以及側彈性元件，連接於第二外殼以及切換件。當第一連接機構連接於第二連接機構時，卡榫位於卡槽的鎖固區段。當將第一連接機構與第二連接機構分離的過程中，移動內殼至解鎖位置以使卡榫由鎖固區段移動至連接區段，之後釋放內殼使卡榫移動至解鎖區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A quick disassembly device and the operation method thereof. The quick disassembly device includes a first connection mechanism and a second connection mechanism. The first connection mechanism includes a first housing; a shell movably disposed in the first housing, and including a fastening groove, wherein the fastening groove includies a locking segment, a connection segment, and an unlocking segment; a main elastic element connected to the first housing and a shell. The second connection mechanism includes a second housing; a switch element movably disposed in the second housing, and including a latch; and a transverse elastic element connected to the second housing and the switch element. When the first connection mechanism is connected to the second connection mechanism, the latch is in the locking segment of the fastening groove. During the first connection mechanism separating from the second connection mechanism, the shell is moved to an unlock position, so as to move the latch from the locking segment to the connection segment. Afterward, the shell is released to move the latch to the unlocking segment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:快拆裝置</p>  
        <p type="p">A10:第一連接機構</p>  
        <p type="p">A20:第二連接機構</p>  
        <p type="p">10:第一外殼</p>  
        <p type="p">11:底板</p>  
        <p type="p">111:按壓開口</p>  
        <p type="p">12:第一側壁</p>  
        <p type="p">14:側卡扣</p>  
        <p type="p">20:內殼</p>  
        <p type="p">21:內底板</p>  
        <p type="p">22:按壓塊</p>  
        <p type="p">23:內側壁</p>  
        <p type="p">231:扣合槽</p>  
        <p type="p">232:頂面</p>  
        <p type="p">233:避讓槽</p>  
        <p type="p">25:第二導軌</p>  
        <p type="p">27:卡槽</p>  
        <p type="p">271:鎖固區段</p>  
        <p type="p">272:連接區段</p>  
        <p type="p">273:解鎖區段</p>  
        <p type="p">28:滑槽</p>  
        <p type="p">30:主彈性元件</p>  
        <p type="p">40:第二外殼</p>  
        <p type="p">41:頂板</p>  
        <p type="p">42:第二側壁</p>  
        <p type="p">43:第二引導肋</p>  
        <p type="p">44:上擋片</p>  
        <p type="p">47:限位結構</p>  
        <p type="p">50:切換件</p>  
        <p type="p">52:卡榫</p>  
        <p type="p">54:缺口</p>  
        <p type="p">55:傾斜面</p>  
        <p type="p">60:側彈性元件</p>  
        <p type="p">70:下壓組件</p>  
        <p type="p">71:下壓本體</p>  
        <p type="p">72:抵接柱</p>  
        <p type="p">AX1:虛擬軸</p>  
        <p type="p">D1:縱向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="618" publication-number="202620718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理配送請求之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR PROCESSING A SHIPPING REQUEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250620B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250620B">G06Q10/087</further-classification>  
        <further-classification edition="202301120250620B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250620B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁蘇魯　普拉提克　拉詹德蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYSURU, PRATHIK RAJENDRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>什理坎德　尼基萊什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRIKHANDE, NIKHILESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用以處理商品之配送請求之技術。本發明之一態樣之藉由電子裝置而實行之處理商品之配送請求的方法可包括如下步驟：提供第1頁面，該第1頁面係包括用以請求配送上述商品之按鈕者；基於對上述按鈕進行之用戶輸入而提供第2頁面，該第2頁面係包括可輸入發件者之資訊及收件者之資訊之介面者；基於對上述第2頁面進行之用戶輸入而提供第3頁面，該第3頁面係包括可輸入欲配送之商品之資訊之介面、及可選擇期望配送日之介面者；及基於對上述第3頁面進行之用戶輸入而提供第4頁面，該第4頁面係顯示複數個日期及與各日期對應之一個以上之配送運費者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">910:步驟</p>  
        <p type="p">920:步驟</p>  
        <p type="p">930:步驟</p>  
        <p type="p">940:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="619" publication-number="202620780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>執行重新定位的方法、定位裝置及電腦可讀儲存媒體</chinese-title>  
        <english-title>METHOD FOR PERFORMING RELOCATION, POSITIONING DEVICE AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250303B">G06T7/73</main-classification>  
        <further-classification edition="200601120250303B">G01C21/20</further-classification>  
        <further-classification edition="202401120250303B">G05D1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種執行重新定位的方法、定位裝置及電腦可讀儲存媒體。方法包括：執行SLAM以取得多個第一關鍵幀，並在取得各第一關鍵幀時感測對應於各第一關鍵幀的第一環境感測資訊；在定位裝置執行重新定位機制時，感測當下環境感測資訊，並至少透過將當下環境感測資訊與各第一關鍵幀對應的第一環境感測資訊進行比對以在多個第一關鍵幀中找出至少一第二關鍵幀；以及基於至少一第二關鍵幀進行重新定位機制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure provide a method for performing relocation, a positioning device and a computer-readable storage medium. The method includes: executing SLAM to obtain a plurality of first keyframes, and sensing first environment sensing information corresponding to each first keyframe when obtaining each first keyframe; when the positioning device executes a relocation mechanism, sensing current environment sensing information, and at least finding at least one second keyframe among the plurality of first keyframes by comparing the current environment sensing information with the first environment sensing information corresponding to each first keyframe; and performing the relocation mechanism based on the at least one second keyframe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="620" publication-number="202620612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供ＡＢ測試狀態資訊之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR PROVIDING AB TEST STATUS INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250502B">G06F3/048</main-classification>  
        <further-classification edition="200601120250502B">G06F11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘正斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, ZHENGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
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          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之方法可包括如下步驟：一個以上之處理器接收用以對第1頁面實行第1 AB測試之請求；對應於請求，針對第1頁面中包括之複數個區域各者而產生正在實行之其他AB測試之AB測試狀態資訊，AB測試狀態資訊包括複數個區域各者中是否正在實行其他AB測試；針對複數個區域各者而產生用以顯示AB測試狀態資訊之可視化資訊；及將可視化資訊傳輸至終端，以使可視化資訊顯示於終端之第2頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:第2頁面</p>  
        <p type="p">310:區域一</p>  
        <p type="p">311:子區域一</p>  
        <p type="p">312:子區域二</p>  
        <p type="p">320:區域二</p>  
        <p type="p">325:區域三</p>  
        <p type="p">326:第2識別符</p>  
        <p type="p">330:區域四</p>  
        <p type="p">340:光標</p>  
        <p type="p">350:AB測試狀態資訊標記框</p>  
        <p type="p">351:帳戶B</p>  
        <p type="p">352:平台</p>  
        <p type="p">353:測試期間</p>  
        <p type="p">354:測試識別碼</p>  
        <p type="p">355:區域五</p>  
        <p type="p">360:區域六</p>  
        <p type="p">361:第1識別符</p> 
      </representative-img> 
    </description> 
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  <tw-patent-application no="621" publication-number="202619700"> 
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      <isuno>10</isuno>  
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          <doc-number>202619700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種鼠李糖脂自乳化的護膚乳液、製備方法及應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K8/37</main-classification>  
        <further-classification edition="200601120250501B">A61K8/60</further-classification>  
        <further-classification edition="200601120250501B">A61K8/73</further-classification>  
        <further-classification edition="200601120250501B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商萬華化學集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANHUA CHEMICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吴凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棒棒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BANGBANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>纪学顺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, XUESHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周梦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>马洁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種鼠李糖脂自乳化的護膚乳液、製備方法及應用，其中，具體公開了鼠李糖脂在維持皮膚酸鹼度、皮膚保濕或促滲中的應用，並公開了一種鼠李糖脂自乳化的護膚乳液，原料包括水相和油相，所述水相中可含有酸或鹼，鼠李糖脂在護膚乳液中的質量占比≥0.2%；所述護膚乳液的pH值為5.0-6.0。本發明的護膚乳液不僅僅具有高保濕性、高穩定性、高滲透能力，並且還具有長效維持皮膚酸鹼度的優勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
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  <tw-patent-application no="622" publication-number="202620337"> 
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      <tif no="1" file="202620337.zip"/>
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      <isuno>10</isuno>  
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          <doc-number>202620337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能的加濕器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241212B">F24F6/12</main-classification>  
        <further-classification edition="200601120241212B">A61L9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商溢泰（南京）環保科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMFLO (NANJING) ENVIRONMENTAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溢泰實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林慶雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商苔益加公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIGA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
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          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周海鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樊學藺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李洹析</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WON SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種加濕器，包括：殼體；功能模組，設於所述第一容納空間，所述功能模組與殼體內表面間隔設置；加濕模組，設於所述第二容納空間，所述加濕模組用於通過所述連通部向所述第二通孔提供加濕流體；及中框構件，設於所述殼體內，所述中框構件用於分隔以形成所述第一容納空間和所述第二容納空間，並在所述殼體的上部形成所述連通部。通過設置功能模組，使得加濕器根據需求實現多功能加濕效果；通過設置中框構件，將殼體內部劃分為兩個空間，實現分隔且連通的結構設計，使得功能模組的附加功能與加濕模組進行聯動，中框構件設置在中部分擔了殼體的支撐壓力，各模組固定在中框構件上，增加了加濕器內部結構的強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加濕器</p>  
        <p type="p">100:殼體</p>  
        <p type="p">102:底面</p>  
        <p type="p">104:展示板</p>  
        <p type="p">110:第一通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
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          <doc-number>202620138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144731</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物、其製品及其用途</chinese-title>  
        <english-title>RESIN COMPOSITION, ARTICLE MADE THEREFROM, AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">C09D125/10</main-classification>  
        <further-classification edition="200601120241220B">C09D125/14</further-classification>  
        <further-classification edition="200601120241220B">C09D147/00</further-classification>  
        <further-classification edition="200601120241220B">C09D153/00</further-classification>  
        <further-classification edition="200601120241220B">C09D4/06</further-classification>  
        <further-classification edition="201801120241220B">C09D7/62</further-classification>  
        <further-classification edition="200601120241220B">H05K1/03</further-classification>  
        <further-classification edition="200601120241220B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RONGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣雪燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XUEYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組合物，包括：成分(A)：100重量份的未氫化的馬來酸酐改性第一聚烯烴；成分(B)：20重量份至100重量份的丙烯酸酯單體、其寡聚物或其組合，所述丙烯酸酯單體具有兩個以上的不飽和碳碳雙鍵；以及成分(C)：5重量份至160重量份的苯并環丁烯改性第二聚烯烴。此外，本發明還提供一種由上述樹脂組合物製成的製品，上述樹脂組合物和製品在漂錫裂紋率、對銅箔拉力、Z軸熱膨脹率、吸水率、介電損耗等特性中的至少一者得到改善。本發明還提供一種上述樹脂組合物在印刷電路板樹脂填塞製程中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a resin composition, including: component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin; component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or combination thereof, the acrylate monomer has at least two unsaturated carbon-carbon double bonds; and component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin. In addition, the present disclosure also provides an article made from the resin composition. The resin composition and the product have improvements in one or more properties including solder floating crack rate, copper foil peeling strength, percent of thermal expansion at Z-axis, water absorption ratio , and dissipation factor. The present disclosure also provides a use of the resin composition in the resin filling process of printed circuit boards.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="624" publication-number="202620598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環狀互動裝置及人機交互系統</chinese-title>  
        <english-title>RING-SHAPED INTERACTION DEVICE AND HUMAN-COMPUTER INTERACTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/01</main-classification>  
        <further-classification edition="201301120250303B">G06F3/033</further-classification>  
        <further-classification edition="200601120250303B">H03K17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業桓科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周書綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHOU, SHU-CI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種環狀互動裝置，包括：環狀主體，形成有一容納空間；壓電模組，連接於環狀主體上且位於所述容納空間內，所述壓電模組受到壓力時生成第一電訊號；以及磁電轉換模組，位於所述容納空間內，穿過所述磁電轉換模組的磁場的磁場強度發生變化時，所述磁電轉換模組生成第二電訊號；其中，所述環狀互動裝置用於根據所述第一電訊號檢測用戶對所述環狀主體的按壓操作或根據所述第二電訊號檢測用戶對所述環狀主體的轉動操作。本申請還提供一種人機交互系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a ring-shaped interaction device including a ring-shaped body, a piezoelectric module, and a magnetoelectric conversion module. The ring-shaped body is formed with a holding space. The piezoelectric module is in the holding space and connected to the ring-shaped body. The piezoelectric module is used to generate a first electrical signal when the piezoelectric module is subjected to pressure. The magnetoelectric conversion module is in the holding space and is used to generate a second electrical signal when a strength of a magnetic field passing through the magnetoelectric conversion module changes. The ring-shaped interaction device is used to detect a user's pressing operation on the ring-shaped body according to the first electrical signal or the user's rotating operation on the ring-shaped body according to the second electrical signal. The disclosure also provides a human-computer interaction system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:環狀主體</p>  
        <p type="p">101:容納空間</p>  
        <p type="p">11:第一環狀結構</p>  
        <p type="p">12:第二環狀結構</p>  
        <p type="p">20:壓電模組</p>  
        <p type="p">30:磁電轉換模組</p>  
        <p type="p">31:霍爾感測器</p>  
        <p type="p">32:磁鐵</p>  
        <p type="p">40:陀螺儀</p>  
        <p type="p">50:無線傳輸模組</p>  
        <p type="p">60:電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="625" publication-number="202621334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於發光二極體的顏色轉換元件</chinese-title>  
        <english-title>COLOR CONVERSION MEMBER FOR LEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250122B">H10H20/851</main-classification>  
        <further-classification edition="202501120250122B">H10H20/852</further-classification>  
        <further-classification edition="202501120250122B">H10H20/855</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商羅茨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROOTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李星玧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNG YOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宅基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, TAEK GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金淳珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOON MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河宗佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, JONG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的實施例，用於LED的顏色轉換元件包括：使從LED發出的光的顏色轉換並使其通過的以板狀形成的顏色轉換部；覆蓋所述顏色轉換部側面並反射朝向所述顏色轉換部側面傳播的光的光反射部；覆蓋所述光反射部外側並吸收穿透過所述光反射部的光的光吸收部。所述顏色轉換部、所述光反射部及所述光吸收部一體形成，且光發射面形成平坦的板狀結構。所述光反射部反射朝向所述顏色轉換部側面傳播的光，而所述光吸收部去除側向傳播的光，從而提高所發射光的直進性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顏色轉換部</p>  
        <p type="p">3:光反射部</p>  
        <p type="p">5:光吸收部</p>  
        <p type="p">10:顏色轉換元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="626" publication-number="202621100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有組態穩定機制的網路組態更新方法</chinese-title>  
        <english-title>NETWORK CONFIGURATION UPDATING METHOD HAVING CONFIGURATION STABILIZING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251103B">H04L69/324</main-classification>  
        <further-classification edition="202201120251103B">H04L61/30</further-classification>  
        <further-classification edition="200601120251103B">H04L12/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李朝明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈夢舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, MENG-ZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, CUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何益東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有組態穩定機制的網路組態更新方法，應用於網狀網路系統中，包含：使節點裝置中的每一者設置包含父節點裝置的父節點識別資訊、儲存的協助表中所記錄的至少一子節點裝置的子節點識別資訊、長度資訊以及組態資訊識別碼的網路組態資訊，進一步廣播包含網路組態資訊的廣播訊號；使節點裝置中的每一者接收任一其他節點裝置廣播的廣播訊號，並根據組態資訊識別碼判斷廣播訊號包含網路組態資訊，並依長度資訊判斷子節點識別資訊的起始位置，擷取父節點識別資訊及子節點識別資訊；以及根據父節點識別資訊及子節點識別資訊更新儲存的協助表。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A network configuration updating method having configuration stabilizing mechanism used in a mesh network system. Network configuration information including father node identification information, child node identification information recorded in an assistance table, length information and a configuration information identification code is configured by each of node apparatuses to further broadcast a broadcast signal including the network configuration information. The broadcast signal of any other node apparatuses is received by each of the node apparatuses to determine that the broadcast signal includes the network configuration information according to the configuration information identification code, determine an initial position of the child node identification information according to the length information, and retrieve the father node identification information and the child node identification information. The assistance table is updated according to the father node identification information and the child node identification information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:網路組態更新方法</p>  
        <p type="p">S210~S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="627" publication-number="202621083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有防偽裝攻擊機制的網路節點配對方法</chinese-title>  
        <english-title>NETWORK NODES PAIRING METHOD HAVING ANTI-SPOOFING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H04L12/44</main-classification>  
        <further-classification edition="202201120251103B">H04L9/40</further-classification>  
        <further-classification edition="201301120251103B">G06F21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李朝明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, CUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈夢舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, MENG-ZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何益東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有防偽裝攻擊機制的網路節點配對方法，應用於網狀網路系統中，包含：使網狀網路系統中的每一節點裝置根據網狀網路系統的群組資訊做為金鑰，對網路系統識別資訊及自身識別資訊加密，廣播包含加密資訊的信標訊號；使子節點裝置執行掃描程序選擇目標父節點；使子節點裝置根據群組資訊對目標父節點的信標訊號進行合法性驗證，並在目標父節點與子節點裝置具有相同的網路系統識別資訊且目標父節點的自身識別資訊為正確時，判斷目標父節點通過合法性驗證；以及使子節點裝置向目標父節點傳送配對請求訊號進行配對。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A network nodes pairing method having anti-spoofing mechanism is provided used in a mesh network system. Each of node apparatuses in the mesh network system uses group information of the mesh network system as a key to encrypt network system identification information and self identification information to broadcast a beacon signal including encrypted information. A scan process is executed by a child node apparatus to select a target father node. A validity verification process is performed on the beacon signal of the target father node according to the group information by the child node apparatus so as to determine the target father node passes the validity verification process when the target father node and the child node apparatus has the same network system identification information and when the self identification information of the target father node is valid. A pairing request signal is transmitted to the target father node by the child node apparatus to request for pairing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:網路節點配對方法</p>  
        <p type="p">S210~S250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="628" publication-number="202621091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有省電機制的網狀網路運作方法</chinese-title>  
        <english-title>WIRELESS NETWORK OPERATION METHOD HAVING POWER SAVING MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250801B">H04L41/06</main-classification>  
        <further-classification edition="202201120250801B">H04L41/0833</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李朝明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈夢舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, MENG-ZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, CUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何益東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有省電機制的網狀網路運作方法，應用於網狀網路系統中，包含：由根節點裝置自存取點裝置獲取節點裝置的封包暫存狀態；使節點裝置中的每一者設置用以指示封包暫存狀態的節點封包暫存狀態表，並在獨立的週期性廣播時間廣播包含節點封包暫存狀態表的信標訊號；使節點裝置對應接收父節點裝置及子節點裝置廣播的信標訊號；使節點裝置分析信標訊號的節點封包暫存狀態表，據以更新自身的節點封包暫存狀態表；以及使節點裝置在進入休眠，且封包暫存狀態具有暫存指示準位時，根據預設排程喚醒來進行封包傳遞程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless network operation method having power saving mechanism is provided used in a mesh network that includes steps outlined below. Packet storage states of node apparatuses are retrieved by a root node apparatus from an access point apparatus. For each of the node apparatuses, a node packet storage state list indicating the packet storage states is configured and a beacon signal including the node packet storage state list is broadcasted in an independent periodic broadcast time. For each of the node apparatuses, the beacon signal of a father node apparatus and at least one child node apparatus thereof are received. For each of the node apparatuses, the node packet storage state list included by the beacon signal is analyzed to update the node packet storage state list in the node apparatus. For each of the node apparatuses that enters a sleep mode, a predetermined schedule is performed to wake-up to perform a packet transmitting process when the packet storage state of any one of the node apparatus and the child node apparatus thereof has a storage indication level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:網狀網路運作方法</p>  
        <p type="p">S210~S250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="629" publication-number="202620719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上商務分割配送管理方法及其裝置</chinese-title>  
        <english-title>METHOD FOR MANAGING SPLIT SHIPPING OF ONLINE COMMERCE AND APPARATUS THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250203B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250203B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種線上商務中的拆分配送的管理方法及其裝置。具體地，在線上商務中，當買家指定不同的配送地址下單時，管理對不同配送地址的拆分配送的方法及其裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method and an apparatus for managing a divided delivery in online commerce. Specifically, the present disclosure relates to a method and apparatus for managing divided delivery to different delivery addresses, when a buyer performs an order by specifying different delivery addresses in online commerce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶終端</p>  
        <p type="p">200:配送管理系統</p>  
        <p type="p">210:分析單元</p>  
        <p type="p">220:生成單元</p>  
        <p type="p">300:資料庫</p>  
        <p type="p">400:物流中心終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="630" publication-number="202620643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用戶介面測試方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR PERFORMING USER INTERFACE TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250203B">G06F11/36</main-classification>  
        <further-classification edition="200601120250203B">G06F11/22</further-classification>  
        <further-classification edition="201301120250203B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑩瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YINGYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔耀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAOPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用戶介面（User Interface，UI）測試方法及其系統。上述方法包括：獲取作為UI測試對象的應用程式的測試頁面對應的應用程式編程介面（API，Application Programming Interface）資料的步驟，其中，上述測試頁面包括按規定時間單位變化的動態資訊及不變的靜態資訊；利用上述API資料生成將上述動態資訊替換為預設資訊的上述測試頁面的模擬圖像的步驟；獲取與上述API資料對應的基本圖像的步驟；以及藉由比較上述模擬圖像和上述基本圖像，識別上述模擬圖像中與上述基本圖像不同的圖像區域的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method and system for performing a user interface (UI) test. The method includes: obtaining Application Programming Interface (API) data corresponding to a test page of an application that is a UI test target, the test page including dynamic information that changes at regular intervals and static information that does not change; generating a mock image for the test page in which the dynamic information is replaced with preset information using the API data; obtaining a base image corresponding to the API data; and identifying an image area in the mock image that is different from the base image by comparing the mock image with the base image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="631" publication-number="202619921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於數位孿生的車輛故障診斷方法和系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DIAGNOSING VEHICLE FAULTS USING DIGITAL TWIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250121B">B60W50/02</main-classification>  
        <further-classification edition="202001120250121B">G16Y20/10</further-classification>  
        <further-classification edition="202001120250121B">G16Y20/20</further-classification>  
        <further-classification edition="202001120250121B">G16Y40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海科絡達雲軟體技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAROTA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章鑫傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XINJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種基於數位孿生的車輛故障診斷方法和系統。車輛故障診斷方法包括：（S1）收集車輛的車輛資料；（S2）將收集的車輛資料與對應的生成時間戳記和感測器標識碼相關聯地存儲；（S3）根據收集的車輛感測器資料，對車輛是否存在故障進行初步診斷；（S4）當初步診斷結果指示車輛存在故障時，進行車輛故障的數位元孿生診斷；以及（S5）生成故障的視覺化展示。本發明的基於車輛即時數位元孿生模型的車輛故障診斷方法與傳統診斷方法相比，能夠提供更為高效、精確且全面的故障檢測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method and system for diagnosing vehicle faults and system using digital twin. The method can comprise: (S1) collecting a vehicle data of a vehicle; (S2) storing the collected vehicle data in association with respective generation time stamp and sensor identification codes; (S3) performing a preliminary diagnosis of whether the vehicle has a fault based on the collected vehicle sensor data; (S4) performing a digital twin diagnosis of the vehicle fault if the preliminary diagnosis result indicates that the vehicle has a fault; and (S5) generating a visual representation of the fault. In comparison to conventional diagnostic techniques, the real-time digital twin model-based method for diagnosing vehicle faults of the disclosure offers enhanced efficiency, precision, and comprehensive fault detection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:收集車輛的車輛資料</p>  
        <p type="p">S2:存儲收集的車輛資訊</p>  
        <p type="p">S3:車輛故障初步診斷</p>  
        <p type="p">S4:車輛故障數位元孿生診斷</p>  
        <p type="p">S5:生成視覺化故障展示</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="632" publication-number="202620701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>知識圖譜的構建方法以及對車輛故障進行診斷的方法</chinese-title>  
        <english-title>METHOD FOR CONSTRUCTING KNOWLEDGE GRAPH AND METHOD FOR DIAGNOSING VEHICLE FAULTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N5/02</main-classification>  
        <further-classification edition="202301120250303B">G06Q10/20</further-classification>  
        <further-classification edition="202301120250303B">G06N5/022</further-classification>  
        <further-classification edition="200601120250303B">G07C5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海科絡達雲軟體技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAROTA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章鑫傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XINJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種構建用於車輛故障診斷的知識圖譜的方法，該方法包括：建立車輛部件的資料庫；建立異常信號的資料庫；從已知的非結構化故障診斷資料和半結構化故障診斷資料中創建故障知識三元組；以及基於故障知識三元組，將異常信號、車輛部件和維修建議關聯在一起從而構建用於車輛故障診斷的知識圖譜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method for constructing a knowledge graph for vehicle fault diagnosis. The method can comprise creating a database of vehicle components; creating a database of abnormal signals; creating a fault knowledge triple from existing unstructured fault diagnostic data and semi-structured fault diagnostic data; and associating the abnormal signal, the vehicle component and the repair suggestion based on the fault knowledge triples to construct the knowledge graph for vehicle fault diagnosis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301:建立車輛部件的資料庫</p>  
        <p type="p">S302:建立異常信號的資料庫</p>  
        <p type="p">S303:從已知的非結構化故障診斷資料和半結構化故障診斷資料中提取出故障知識三元組</p>  
        <p type="p">S304:基於創建的故障知識三元組，將異常信號、車輛部件和維修建議關聯在一起從而形成用於車輛故障診斷的知識圖譜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="633" publication-number="202620617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>列表畫面提供方法及其系統</chinese-title>  
        <english-title>METHOD FOR PROVIDING LIST PAGE AND SYSTEM FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F3/14</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/02</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/0283</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例的列表畫面提供方法，透過計算裝置執行，其可以包括如下步驟：獲取用於在包括多個物品的列表畫面顯示每個物品資訊的佈局，該佈局包括多個資訊單元的區域；對於該多個資訊單元中的每個資訊單元，確定該資訊單元的預定義的多個顯示類型之一；和使用透過該確定的步驟確定的顯示類型渲染該多個資訊單元中的每個資訊單元，從而渲染該每個物品資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing a list page is performed by a computing device, and may include obtaining a layout for displaying each item information of a list page including a plurality of items, the layout including an area of a plurality of information units, determining any one of a plurality of predefined display types of the information unit, for each of the plurality of information units, and rendering each item information by rendering each of the plurality of information units using the display type determined through the determining of any one of the plurality of predefined display types of the information unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="634" publication-number="202621085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>序列偵測裝置以及序列偵測方法</chinese-title>  
        <english-title>SEQUENCE DETECTION DEVICE AND SEQUENCE DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04L25/03</main-classification>  
        <further-classification edition="200601120250303B">H03M13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種序列偵測裝置，包含一前饋濾波器以及一序列偵測電路。該前饋濾波器用以處理一接收訊號來產生一等化訊號。該序列偵測電路用以對該等化訊號進行序列偵測來產生並輸出一符元序列。該序列偵測電路包含一區域估計電路以及一網格選取電路。該區域估計電路用以將該等化訊號所包含的複數個樣本中的每一樣本分類至複數個區域的其中之一。該網格選取電路用以依據該區域估計電路所輸出之該複數個樣本中的兩個樣本的區域估計結果，來選取複數個網格方案的其中之一來進行分支度量計算。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sequence detection device includes a feed-forward filter and a sequence detection circuit. The feed-forward filter processes a received signal to generate an equalized signal. The sequence detection circuit performs sequence detection upon the equalized signal to generate and output a symbol sequence. The sequence detection circuit includes a region estimation circuit and a trellis selection circuit. The region estimation circuit categorizes each of samples included in the equalized signal into one of regions. The trellis selection circuit selects one of trellis schemes for branch metric calculation according to region estimation results of two of the samples output from the region estimation circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:序列偵測裝置</p>  
        <p type="p">102:前饋濾波器</p>  
        <p type="p">104:序列偵測電路</p>  
        <p type="p">106:區域估計電路</p>  
        <p type="p">108:網格選取電路</p>  
        <p type="p">110:分支度量計算電路</p>  
        <p type="p">112:相加-比較-選取和路徑度量計算電路</p>  
        <p type="p">114:存活路徑和回溯電路</p>  
        <p type="p">116:控制電路</p>  
        <p type="p">S_IN[k]:接收訊號</p>  
        <p type="p">S_FFF:等化訊號</p>  
        <p type="p">h1:通道狀態指標</p>  
        <p type="p">SQ:訊號品質指標</p>  
        <p type="p">S_OUT:符元序列</p>  
        <p type="p">FFF[0]~FFF[n]:前饋等化器係數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="635" publication-number="202620059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物及其製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">C08F2/44</main-classification>  
        <further-classification edition="200601120241226B">C08F283/08</further-classification>  
        <further-classification edition="200601120241226B">C08L71/12</further-classification>  
        <further-classification edition="200601120241226B">C08K5/50</further-classification>  
        <further-classification edition="200601120241226B">C08K5/01</further-classification>  
        <further-classification edition="200601120241226B">C09K21/12</further-classification>  
        <further-classification edition="200601120241226B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中山台光電子材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡志龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李湘南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡聯輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳興法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種樹脂組合物，其包括100重量份的含乙烯基聚苯醚樹脂；10重量份至40重量份的交聯劑；以及20重量份至70重量份的含磷阻燃劑，該含磷阻燃劑包括具有式（I）所示結構的含磷化合物。此外，本發明還公開一種由前述樹脂組合物製成的製品，其包括半固化片、樹脂膜、積層板、印刷電路板或固化絕緣體，且於玻璃轉化溫度、Z軸熱膨脹率、T288耐熱性、阻燃性、阻燃劑遷移、阻燃劑脫落以及交聯間隙等特性中的至少一者獲得改善。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="636" publication-number="202620720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145962</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供商品之補充材料資訊之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR PROVIDING CUSHIONING MATERIAL INFORMATION OF PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250623B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250623B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250623B">G06Q50/40</further-classification>  
        <further-classification edition="200601120250623B">B65D79/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙汝斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣艷陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納得卡尼　耶什萬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADKARNI, YESHWANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴成津</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, AHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成濟賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, JEHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申慶俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KYEONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴佑正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOOJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種提供商品之補充材料資訊之方法之技術。本發明之一態樣之藉由電子裝置而實行之提供商品包裝資訊的方法可包括如下步驟：確定保管有合併包裝之一個以上之商品之目標單元格；及指示輸出作業頁面，該作業頁面包含與保管於上述目標單元格中之第1商品對應之第1商品卡；指示輸出上述作業頁面之步驟包括如下步驟：產生包括第1層及第2層之上述第1商品卡，該第1層包括上述第1商品之資訊，該第2層包括上述第1商品之包裝中所使用之補充材料之資訊，上述第2層係上述第1層之外部層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:作業頁面</p>  
        <p type="p">1110:第1區域</p>  
        <p type="p">1111:商品卡</p>  
        <p type="p">1112:商品卡</p>  
        <p type="p">1113:商品卡</p>  
        <p type="p">1114:商品卡</p>  
        <p type="p">1115:商品卡</p>  
        <p type="p">1116:商品卡</p>  
        <p type="p">1117:商品卡</p>  
        <p type="p">1120:第2區域</p>  
        <p type="p">1130:第3區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="637" publication-number="202620509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近眼顯示裝置以及近眼顯示裝置之製作方法</chinese-title>  
        <english-title>NEAR EYE DISPLAY DEVICE AND MANUFACTURE METHOD OF SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250409B">G02B27/01</main-classification>  
        <further-classification edition="200601120250409B">G02B6/00</further-classification>  
        <further-classification edition="200601120250409B">G02B27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業桓科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖經皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周蔣云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIANG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周賢穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIEN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種近眼顯示裝置，包括顯示屏以及光引導模組。所述顯示屏用於出射圖像光。光引導模組用於接收所述圖像光並且將所述圖像光投射至人眼，以使位於眼盒之位置之所述圖像光被人眼接收。所述顯示屏被設置於從所述眼盒之位置投射至所述光引導模組之多束具有不同視場角之光線聚焦之成像面之位置。本申請還提供一種近眼顯示裝置之製作方法，用於製作上述近眼顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a near eye display device. The near eye display device includes a display screen and an optical guidance module. The display screen is used to emit image light. The optical guidance module is used to receive the image light and project the image light to human eye so that the image light at a position of the eye box is received by the human eye. The display screen is arranged at a position where a plurality of beams of light with different field angles are focused on an imaging surface projected from the position of the eye box to the optical guidance module. The present disclosure also provides a manufacture method of the near eye display device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:近眼顯示裝置</p>  
        <p type="p">1:顯示屏</p>  
        <p type="p">11:蓋板</p>  
        <p type="p">111:顯示面</p>  
        <p type="p">13:顯示模組</p>  
        <p type="p">3:光引導模組</p>  
        <p type="p">31:第一透鏡</p>  
        <p type="p">32:半反半透膜</p>  
        <p type="p">33:第二透鏡</p>  
        <p type="p">34:複合膜層</p>  
        <p type="p">341:相位延遲層</p>  
        <p type="p">343:反射偏振層</p>  
        <p type="p">35:第三透鏡</p>  
        <p type="p">5:眼盒</p>  
        <p type="p">L1:圖像光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="638" publication-number="202620961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線結構及無線通訊裝置</chinese-title>  
        <english-title>ANTENNA STRUCTURE AND WIRELESS COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H01Q1/22</main-classification>  
        <further-classification edition="200601120250602B">H01Q1/12</further-classification>  
        <further-classification edition="200601120250602B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高酩捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, MING-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線結構及無線通訊裝置，包括介質基板及輻射部，輻射部設置於介質基板的表面上，輻射部包括第一輻射臂、第二輻射臂、第三輻射臂及第一連接臂，第一連接臂包括相對的第一端及第二端，第一輻射臂與第二輻射臂分別連接於第一端的相對兩側，第三輻射臂連接於第二端，且第一輻射臂與第三輻射臂位於第一連接臂的同一側，第一輻射臂、第二輻射臂及第三輻射臂分別激發複數頻段的無線訊號，覆蓋較寬的頻率範圍，實現多頻段通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna structure and a wireless communication device are provided, including a dielectric substrate and a radiating portion. The radiating portion is arranged on a surface of the dielectric substrate. The radiating portion includes a first radiating arm, a second radiating arm, a third radiating arm, and a first connecting arm. The first connecting arm includes a first end and a second end opposite to each other, the first radiating arm and the second radiating arm are respectively connected to opposite sides of the first end, the third radiating arm is connected to the second end, the first radiating arm and the third radiating arm are located on the same side of the first connecting arm. The first radiating arm, the second radiating arm, and the third radiating arm respectively excite wireless signals in multiple frequency bands, covering a wide frequency range and realizing multi-band communication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線結構</p>  
        <p type="p">10:介質基板</p>  
        <p type="p">11:第一槽孔</p>  
        <p type="p">12:第二槽孔</p>  
        <p type="p">20:輻射部</p>  
        <p type="p">21:第一輻射臂</p>  
        <p type="p">22:第二輻射臂</p>  
        <p type="p">23:第三輻射臂</p>  
        <p type="p">24:第一連接臂</p>  
        <p type="p">242:第一端</p>  
        <p type="p">244:第二端</p>  
        <p type="p">25:第二連接臂</p>  
        <p type="p">30:接地部</p>  
        <p type="p">40:饋電部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="639" publication-number="202620510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近眼顯示設備的檢測方法及電子設備</chinese-title>  
        <english-title>METHOD FOR DETECTING NEAR EYE DISPLAY AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">G02B27/01</main-classification>  
        <further-classification edition="201701120250613B">G06T7/80</further-classification>  
        <further-classification edition="200601120250613B">G06T5/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業桓科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成科技(成都)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商業成光電（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英特盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭羽眉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃上育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及光學檢測領域，提供一種近眼顯示設備的檢測方法及電子設備。該方法基於多個預設虛像距，獲取對近眼顯示設備顯示的測試點的第一拍攝圖像；根據第一拍攝圖像的清晰度，從第一拍攝圖像中確定第二拍攝圖像；根據第二拍攝圖像對應的預設虛像距，確定測試點在第二拍攝圖像中對應的標準位置；根據測試點在第二拍攝圖像中對應的測量位置及標準位置，確定近眼顯示設備的檢測結果。上述方法能夠提高近眼顯示設備的檢測效率低下及檢測準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of optical detection technology, and provides a method for detecting near eye display and an electronic device. The method includes: obtaining a plurality of first shooting images of a test point displayed by a near eye display, according to a plurality of preset virtual image distances; determining a second shooting image from the plurality of first shooting images, according to a clarity of the each of the plurality of first shooting images; determining a standard position corresponding to the test point in the second shooting image, according to a preset virtual image distance corresponding to the second shooting; determining a detection result of the near eye display, according to a measurement position and the standard position corresponding to the test point in the second shooting image. The above method can improve detection efficiency and accuracy of the near eye display.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="640" publication-number="202621546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有晶粒黏著劑流出屏障的半導體裝置總成</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE ASSEMBLIES WITH DIE ADHESIVE OUTFLOW BARRIERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W76/13</main-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體元件工業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉思新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, SIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田揚海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, YANGHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李根赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KEUNHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓奎煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, GYUWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEONGHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一大致態樣中，一種半導體裝置總成包括一導電構件、設置在該導電構件上的一導電黏著劑、及設置在該導電黏著劑上的一半導體晶粒。該導電黏著劑將該半導體晶粒與該導電構件耦接。該裝置總成進一步包括一屏障，其係包括在該導電構件中。該屏障係鄰近該半導體晶粒的一邊緣，且經組態以抑制該導電黏著劑的流出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a general aspect, a semiconductor device assembly includes a conductive member, a conductive adhesive disposed on the conductive member, and a semiconductor die disposed on the conductive adhesive. The conductive adhesive couples the semiconductor die with the conductive member. The device assembly further includes a barrier included in the conductive member. The barrier is proximate to an edge of the semiconductor die and configured to inhibit outflow of the conductive adhesive.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:引線架</p>  
        <p type="p">110:晶粒附接座</p>  
        <p type="p">110a:晶粒附接表面</p>  
        <p type="p">110b:晶粒附接表面</p>  
        <p type="p">120:屏障</p>  
        <p type="p">130a:信號引線</p>  
        <p type="p">130b:信號引線</p>  
        <p type="p">130c:信號引線</p>  
        <p type="p">130d:信號引線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="641" publication-number="202619944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包裝容器</chinese-title>  
        <english-title>PACKAGING CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">B65D25/26</main-classification>  
        <further-classification edition="200601120250228B">B65D81/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鉍錄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, PIL ROK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開一實施例的用于收容至少一個物品的包裝容器包括：上板，構成包裝容器的上表面；多個側板，構成包裝容器的側面；以及下板，構成包裝容器的下表面，上板、多個側板以及下板中的至少一個板可包括多個墊片及設置在多個墊片之間的支撑部件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging container for accommodating at least one article according to an embodiment of the disclosure includes a top plate forming a top surface of the packaging container, a plurality of side plates forming a side surface of the packaging container, and a bottom plate forming a bottom surface of the packaging container, wherein at least one plate among the top plate, the plurality of side plates, and the bottom plate includes a plurality of sheets and a support member disposed between the plurality of sheets.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:包裝組件</p>  
        <p type="p">110:包裝容器</p>  
        <p type="p">110a:第一容器</p>  
        <p type="p">110b:第二容器</p>  
        <p type="p">120:托盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="642" publication-number="202620412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種檢測設備的測試方法、裝置、電子設備及存儲介質</chinese-title>  
        <english-title>TEST METHOD FOR TESTING DEVICES, DEVICE, ELECTRONIC APPARATUS AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G01N21/88</main-classification>  
        <further-classification edition="201701120250401B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭留洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, LIU-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李慶云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種檢測設備的測試方法、裝置、電子設備及存儲介質，所述測試方法包括：基於預設的調用條件調用預先存儲的不良主機板的標準圖像；對所述標準圖像進行光學檢測，獲得檢測設備的機檢資訊；藉由將所述機檢資訊與預先存儲的所述不良主機板的不良資訊進行對比，確定檢測設備的檢測效果。本申請實現了對檢測設備的檢測效果的自動化測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a test method for testing devices, a device, an electronic apparatus and a storage medium. The test method includes: invoking a pre-stored standard image of a defective motherboard based on a predetermined invoking condition; performing an optical test on the standard image and obtaining machine inspection information of the testing devices; determining a detection effect of the testing devices by comparing the machine inspection information with pre-stored defective information of the defective motherboard. This application can achieve automated testing of the testing effect of the testing devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="643" publication-number="202620441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜連接裝置</chinese-title>  
        <english-title>MEMBRANE CONNECTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G01R1/073</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商芯卓科技（浙江）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XINGR TECHNOLOGIES (ZHEJIANG) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, CHOON LEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HO-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈宗原</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種薄膜連接裝置，包含第一薄膜基板以及多個彈性探針。第一薄膜基板包含多個第一開口貫穿第一薄膜基板。該些彈性探針分別穿過該些第一開口。該些彈性探針分別包含第一端與第二端。該些彈性探針的第一端相互共面，以及該些彈性探針的第二端相互共面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a membrane connecting device. The membrane connecting device includes a first membrane substrate and elastic probes. The first membrane substrate includes first openings penetrating through the first membrane substrate. Each of the elastic probes includes a first end and a second end. The first ends of the elastic probes are coplanar, and the second ends of the elastic probes are coplanar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:測試系統</p>  
        <p type="p">10:測試裝置</p>  
        <p type="p">20:待測物</p>  
        <p type="p">21:接點</p>  
        <p type="p">100:測試插座</p>  
        <p type="p">102:接觸件</p>  
        <p type="p">200:薄膜連接裝置</p>  
        <p type="p">210:薄膜基板</p>  
        <p type="p">220:彈性探針</p>  
        <p type="p">221:第一端</p>  
        <p type="p">222:第二端</p>  
        <p type="p">300:加強件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="644" publication-number="202620881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體非揮發性記憶體的快速金氧半場效電晶體裝置臨界電壓的感測架構</chinese-title>  
        <english-title>FAST MOSFET DEVICE THRESHOLD VOLTAGE SENSING SCHEME FOR SEMICONDUCTOR NON-VOLATILE MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">G11C16/28</main-classification>  
        <further-classification edition="200601120250528B">G11C16/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立鴻半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FS-SEMI SEMICONDUCTOR CORPORATION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王一霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種用於半導體非揮發性記憶體 (NVM) 的非差動感測電路。該電路由一半閂鎖器、一開關元件、一重置裝置、一PMOSFET 裝置和一 NMOSFET 裝置組成。半閂鎖器具有一電壓訊號輸入節點和一數位電壓訊號輸出節點。PMOSFET裝置的源極連接到數位電壓軌，汲極連接到電壓信號輸入節點。NMOSFET 元件的汲極連接到 PMOSFET 元件的閘極、閘極施加一偏壓電壓以及源極連接到一位元線讀取路徑。配合PMOSFET裝置和 NMOSFET 裝置的臨界電壓來調整該電路以感測 NVM單元的臨界電壓。通過感測 NVM單元的臨界電壓狀態，可以快速確定儲存在 NVM單元中的一位元資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A non-differential sensing circuit for semiconductor Non-Volatile Memories (NVMs) is disclosed. The circuit comprises a half latch, a switch device, a reset device, a PMOSFET device and a NMOSFET device. The half latch has a voltage signal input node and a digital voltage signal output node. The PMOSFET device has a source connected to a digital voltage rail and a drain connected to the voltage signal input node. The NMOSFET device has a drain connected to the gate of the PMOSFET device, a gate applied with a bias voltage and a source connected to a bitline path. The circuit is tuned to threshold voltages of the PMOSFET device and the NMOSFET device for sensing the threshold voltage of a NVM cell. By sensing threshold voltage states of the NVM cell, a bit information stored in the NVM cell can be fast determined.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:半導體NVM感測電路</p>  
        <p type="p">401~403、405~406、411~413、421、422、431、Q、432、&lt;img align="absmiddle" height="24px" width="16px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"/&gt;、461:節點</p>  
        <p type="p">420:半閂鎖器</p>  
        <p type="p">410:感測放大器單元</p>  
        <p type="p">430:正反器緩衝器</p>  
        <p type="p">450:位元線充電電路</p>  
        <p type="p">460:讀取路徑</p>  
        <p type="p">462:半導體NVM裝置</p>  
        <p type="p">MP&lt;sub&gt;1&lt;/sub&gt;(414)、MP&lt;sub&gt;2&lt;/sub&gt;~MP&lt;sub&gt;3&lt;/sub&gt;、MP&lt;sub&gt;chg&lt;/sub&gt;(417):PMOSFET裝置</p>  
        <p type="p">MN&lt;sub&gt;3&lt;/sub&gt;(415)、MN&lt;sub&gt;4&lt;/sub&gt;、MN&lt;sub&gt;C&lt;/sub&gt;(416):NMOSFET裝置</p>  
        <p type="p">C&lt;sub&gt;b&lt;/sub&gt;:位元線電容</p>  
        <p type="p">R&lt;sub&gt;b&lt;/sub&gt;:金屬位元線電阻</p>  
        <p type="p">R&lt;sub&gt;bsw&lt;/sub&gt;:導通開關電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="645" publication-number="202620203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼土金屬還原氧化鉭生產鉭粉的方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING TANTALUM POWDER BY REDUCING TANTALUM OXIDE WITH ALKALINE EARTH METAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">C22B5/04</main-classification>  
        <further-classification edition="200601120250206B">C22B34/24</further-classification>  
        <further-classification edition="202201120250206B">B22F1/142</further-classification>  
        <further-classification edition="202201120250206B">B22F1/145</further-classification>  
        <further-classification edition="200601120250206B">H01G9/042</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧夏東方鉭業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGXIA ORIENT TANTALUM INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程越偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭金鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周小軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, XIAOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁宏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董學成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, XUECHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊睿鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RUIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王小明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, WENLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐸民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DUOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種鹼土金屬還原氧化鉭生產鉭粉的方法。具體涉及一種採用鹼土金屬例如鎂（優選鎂顆粒）還原氧化鉭粉末原料製備鉭粉的方法，其特徵是所用氧化鉭粉末原料為費氏粒徑（以μm計）與體密度（以g/cm &lt;sup&gt;3&lt;/sup&gt;計）之比大於1.5的氧化鉭粉末，並在還原過程中採用含氫氣體，優選地所述高純氧化鉭粉末的費氏粒徑與體密度之比優選大於2.0，優選大於3.0，更優選大於3.5，更優選大於4.5；例如2.0-15.0，更優選3.0-5.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for producing tantalum powder by reducing tantalum oxide with an alkaline earth metal. Specifically, the present invention relates to a method for producing tantalum powder by reducing tantalum oxide powder as the raw material with an alkaline earth metal such as magnesium (preferably magnesium particles), which is characterized in that: the tantalum oxide powder as the raw material has a ratio of Fsss particle size (μm) to bulk density (g/cm &lt;sup&gt;3&lt;/sup&gt;) of more than 1.5, a hydrogen-containing gas is used in the reducing step, preferably, the high-purity tantalum oxide powder has a ratio of Fsss particle size to bulk density of more than 2.0, preferably more than 3.0, more preferably more than 3.5, more preferably more than 4.5, for example, from 2.0 to 15.0, more preferably from 3.0 to 5.0.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="646" publication-number="202620204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼土金屬還原氧化鉭製備鉭粉的方法及其應用</chinese-title>  
        <english-title>METHOD FOR PRODUCING TANTALUM POWDER BY REDUCING TANTALUM OXIDE WITH ALKALINE EARTH METAL AND ITS APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">C22B5/04</main-classification>  
        <further-classification edition="200601120250206B">C22B34/24</further-classification>  
        <further-classification edition="202201120250206B">B22F1/142</further-classification>  
        <further-classification edition="202201120250206B">B22F1/145</further-classification>  
        <further-classification edition="200601120250206B">H01G9/042</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧夏東方鉭業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGXIA ORIENT TANTALUM INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程越偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭金鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王東新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DONGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁宏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, WENLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董學成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, XUECHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐸民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DUOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊睿鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RUIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王小明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種鹼土金屬還原氧化鉭生產電容器用鉭粉的方法。具體關於一種採用鹼土金屬例如鎂（較佳為鎂顆粒）還原氧化鉭製備鉭粉的方法，其特徵是該方法包括在含氫氣氛中進行的還原、保溫過程，較佳地，所述的含氫氣氛是純氫或者是氫與惰性氣體的混合氣體；和/或所述含氫氣體藉由通入氣態含氫氣體得到的，或藉由加入含氫物質並使其釋放氫氣得到。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for producing tantalum powder for capacitors by reducing tantalum oxide with an alkaline earth metal. Specifically, the present invention relates to a method for producing tantalum powder by reducing tantalum oxide with an alkaline earth metal such as magnesium (preferably magnesium particles), which is characterized in that: the method comprises steps of reducing, soaking carried out in a hydrogen-containing atmosphere, wherein, preferably, the hydrogen-containing atmosphere is pure hydrogen or a mixed gas of hydrogen and an inert gas, and/or the hydrogen-containing gas is obtained by introducing a gaseous hydrogen-containing gas, or by adding a hydrogen-containing substance and allowing it to release hydrogen.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="647" publication-number="202620205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉭粉的生產方法及其應用</chinese-title>  
        <english-title>METHOD FOR PRODUCING TANTALUM POWDER AND ITS APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">C22B5/04</main-classification>  
        <further-classification edition="200601120250206B">C22B34/24</further-classification>  
        <further-classification edition="202201120250206B">B22F1/142</further-classification>  
        <further-classification edition="202201120250206B">B22F1/145</further-classification>  
        <further-classification edition="200601120250206B">H01G9/042</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧夏東方鉭業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGXIA ORIENT TANTALUM INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程越偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭金鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周小軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, XIAOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁宏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊睿鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RUIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董學成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, XUECHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王小明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, WENLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐸民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DUOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種鉭粉的生產方法以及由該方法得到的鉭粉。該方法的特徵在於：該方法包括在含氫氣氛中進行的燒結過程，較佳地所述的含氫氣氛是純氫或者是氫與惰性氣體的混合氣體；和/或所述含氫氣體藉由通入氣態含氫氣體得到的，或藉由加入含氫物質並使其釋放氫氣得到。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for producing tantalum powder and tantalum powder obtained by the method. The method is characterized in that: the method comprises a sintering step carried out in a hydrogen-containing atmosphere, wherein, preferably, the hydrogen-containing atmosphere is pure hydrogen or a mixed gas of hydrogen and an inert gas, and/or the hydrogen-containing gas is obtained by introducing a gaseous hydrogen-containing gas, or by adding a hydrogen-containing substance and allowing it to release hydrogen.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="648" publication-number="202620789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能移動終端</chinese-title>  
        <english-title>SMART MOBILE TERMINAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06T17/00</main-classification>  
        <further-classification edition="201701120250401B">G06T7/529</further-classification>  
        <further-classification edition="201701120250401B">G06T7/521</further-classification>  
        <further-classification edition="200601120250401B">G01B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新煒科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宣緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種智能移動終端，包括圖像採集模組、掃描模組以及控制模組。掃描模組包括投射模組，所述投射模組用於投射結構光。控制模組與所述投射模組與所述圖像採集模組電連接。其中，所述圖像採集模組用於採集所述結構光投射到待測物品之表面形成之掃描圖像，所述控制模組用於根據所述掃描圖像構建所述待測物品之三維點雲資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a smart mobile terminal. The smart mobile terminal includes an image acquisition module, a scanning module and a control module. The scanning module includes a projection module. The projection module is used to project structured light. The control module is electrically connected with the projection module and the image acquisition module. The image acquisition module is used to collect the scanning image formed by the structural light projected on the surface of the item to be tested. The control module is used to build the three-dimensional point cloud data of the item to be tested according to the scanning image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:智能移動終端</p>  
        <p type="p">1:殼體</p>  
        <p type="p">2:顯示模組</p>  
        <p type="p">21:玻璃蓋板</p>  
        <p type="p">3:掃描模組</p>  
        <p type="p">33:支撐件</p>  
        <p type="p">7:待測物品</p>  
        <p type="p">L0:結構光</p>  
        <p type="p">L2:圖像光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="649" publication-number="202621528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構</chinese-title>  
        <english-title>PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種封裝結構及一種製造一封裝結構之方法。該封裝結構包括一彎曲的可撓性載體、一第一組件以及一可撓性囊封層。該第一組件安置在該彎曲的可撓性載體上。該可撓性囊封層囊封該第一組件及該彎曲的可撓性載體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure and a method of manufacturing a package structure are provided. The package structure includes a bent flexible carrier, a first component, and a flexible encapsulation layer. The first component is disposed on the bent flexible carrier. The flexible encapsulation layer encapsulates the first component and the bent flexible carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:載體</p>  
        <p type="p">10c1:導電層</p>  
        <p type="p">10c2:導電層</p>  
        <p type="p">10s1:第一表面</p>  
        <p type="p">10s2:第二表面</p>  
        <p type="p">11:囊封層</p>  
        <p type="p">13p1:導電襯墊</p>  
        <p type="p">13p2:導電襯墊</p>  
        <p type="p">13p3:導電襯墊</p>  
        <p type="p">13p4:導電襯墊</p>  
        <p type="p">14:組件</p>  
        <p type="p">14s1:第一表面</p>  
        <p type="p">15:組件</p>  
        <p type="p">15s1:第一表面</p>  
        <p type="p">100:封裝結構</p>  
        <p type="p">101:彎曲部分/可彎曲部分</p>  
        <p type="p">101t:頂部部分</p>  
        <p type="p">102:平坦部分</p>  
        <p type="p">103:彎曲部分/可彎曲部分</p>  
        <p type="p">103t:頂部部分</p>  
        <p type="p">104:平坦部分</p>  
        <p type="p">105:彎曲部分/可彎曲部分</p>  
        <p type="p">105t:頂部部分</p>  
        <p type="p">106:平坦部分</p>  
        <p type="p">107:彎曲部分/可彎曲部分</p>  
        <p type="p">107t:頂部部分</p>  
        <p type="p">111:側面/外側/第一表面</p>  
        <p type="p">112:側面/外側/第二表面</p>  
        <p type="p">113:側面/外側/第一側向表面</p>  
        <p type="p">114:側面/外側/第二側向表面</p>  
        <p type="p">D11:第一距離</p>  
        <p type="p">D12:第二距離</p>  
        <p type="p">T10:厚度</p>  
        <p type="p">V1:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="650" publication-number="202619956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸嘴裝置</chinese-title>  
        <english-title>SUCTION NOZZLE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B65G47/91</main-classification>  
        <further-classification edition="200601120260223B">H05K13/04</further-classification>  
        <further-classification edition="202601120260223B">H05K3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUO-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊煒達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及吸料裝置技術領域，尤其涉及一種吸嘴裝置。吸嘴裝置包括吸嘴、旋轉組件、移動組件與安裝板組，旋轉組件與吸嘴驅動連接，以帶動吸嘴繞第一軸線轉動；移動組件與旋轉組件驅動連接，以帶動旋轉組件與吸嘴沿第一軸線之延伸方向移動；旋轉組件位於安裝板組之厚度方向的一側，移動組件安裝於安裝板組，移動組件的至少部分位於安裝板組之厚度方向的另一側。上述設置能夠提升吸嘴裝置的結構分佈之均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to the technical field of suction devices, particularly to a suction nozzle device. The suction nozzle device includes a suction nozzle, a rotating component, a moving component, and an installation plate group. The rotating component is connected to the suction nozzle to drive the suction nozzle to rotate around the first axis; The moving component is connected to the rotating component to drive the rotating component and the suction nozzle to move along the extension direction of the first axis; The rotating component is located on one side of the installation plate group in the thickness direction, and the moving component is installed on the installation plate group, with at least a portion of the moving component located on the other side of the installation plate group in the thickness direction. Through the above settings, the uniformity of the structural distribution of the suction nozzle device can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:吸嘴</p>  
        <p type="p">10:旋轉組件</p>  
        <p type="p">30:安裝板組</p>  
        <p type="p">11:安裝座</p>  
        <p type="p">12:旋轉驅動部件</p>  
        <p type="p">31:安裝基板</p>  
        <p type="p">32:移動板</p>  
        <p type="p">33:變距板</p>  
        <p type="p">330:條形槽</p>  
        <p type="p">40:變距驅動組件</p>  
        <p type="p">41:變距驅動部件</p>  
        <p type="p">42:第二傳動結構</p>  
        <p type="p">420:第一傳動帶輪</p>  
        <p type="p">421:第二傳動帶</p>  
        <p type="p">422:第二傳動帶輪</p>  
        <p type="p">423:傳動絲桿</p>  
        <p type="p">424:傳動塊</p>  
        <p type="p">301:第二滑軌</p>  
        <p type="p">302:第二滑塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="651" publication-number="202620575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空中走行式無人搬運車設備及其操作方法</chinese-title>  
        <english-title>OVERHEAD HOIST TRANSPORT DEVICE AND OPERATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241227B">G05D1/695</main-classification>  
        <further-classification edition="202401120241227B">G05D1/46</further-classification>  
        <further-classification edition="202301120241227B">G06N3/0464</further-classification>  
        <further-classification edition="202401320241227B">G05D109/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡鴻翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HUNG HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊政勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHENG-XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空中走行式無人搬運車設備的操作方法，空中走行式無人搬運車設備包含至少第一車廂和第二車廂。操作方法包含藉由第二車廂上的圖像擷取設備擷取第一車廂的第一圖像、使用第一圖像作為CNN模型的輸入，計算第一車廂和第二車廂之間的回歸距離、根據回歸距離調整第一車廂和第二車廂之間的真實距離、以及執行CNN回歸以根據回歸距離調整圖像擷取設備在第二車廂上的焦點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operation method of the overhead hoist transport device includes acquiring a first image of a first car by an image acquisition device on a second car; calculating a regression distance between the first car and the second car by using the first image as an input of a CNN model; adjusting a real distance between the first car and the second car based on the regression distance; and performing a CNN regression to adjusting a focus of the image acquisition device on the second car based on the regression distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:空中走行式無人搬運車設備</p>  
        <p type="p">110A:第一車廂</p>  
        <p type="p">110B:第二車廂</p>  
        <p type="p">112:第一部分</p>  
        <p type="p">1122:前側</p>  
        <p type="p">1124:後側</p>  
        <p type="p">114:第二部分</p>  
        <p type="p">1142:前側</p>  
        <p type="p">1144:後側</p>  
        <p type="p">120:控制系統</p>  
        <p type="p">130:圖像擷取設備</p>  
        <p type="p">140:線性距離感測器</p>  
        <p type="p">150:曲線距離感測器</p>  
        <p type="p">160:第一反射鏡</p>  
        <p type="p">170:第二反射鏡</p>  
        <p type="p">180:相機</p>  
        <p type="p">D1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="652" publication-number="202621016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開關電源的自適應驅動方法、裝置以及開關電源</chinese-title>  
        <english-title>ADAPTIVE DRIVING METHOD AND DEVICE FOR SWITCHING POWER SUPPLY, AND SWITCHING POWER SUPPLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250708B">H02M1/08</main-classification>  
        <further-classification edition="200601120250708B">H02M7/217</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商上海新進芯微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BCD SHANGHAI MICRO-ELECTRONICS COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應征</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周敬旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JINGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種開關電源的自適應驅動方法、裝置以及開關電源，係關於電力電子技術領域。該方案中，獲取開關電源在當前工況下之多個工作參數；根據多個工作參數判定與當前工況對應之目標上升時間；控制功率開關之驅動電壓在目標上升時間內由初始值上升至預設定導通值，以導通功率開關。可見，本揭露中藉由獲取當前工況下之多個工作參數、判定目標上升時間及控制功率開關導通，達成對開關電源功率開關之精準控制，可以達成全工況下器件溫升與副邊應力之間的平衡，從而延長開關電源之使用壽命，並提高其可靠性及穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides an adaptive driving method and device for a switching power supply, and a switching power supply, relating to the technical field of power electronics. In this solution, multiple operating parameters of the switching power supply are obtained under a current operating condition; a target rise time corresponding to the current operating condition is determined based on the multiple operating parameters; and a driving voltage of a power switch is controlled to rise from an initial value to a preset turn-on value within the target rise time, to turn on the power switch. It can be seen that in the present disclosure, the multiple operating parameters are obtained under the current operating condition, the target rise time is determined, and the power switch is turned on, so that the power switch in the switching power supply can be precisely controlled, achieving a balance between a temperature rise and a secondary stress of a device under all operating conditions, thereby extending the service life of the switching power supply and improving the reliability and stability of the switching power supply.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="653" publication-number="202620250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>翻板裝置及電鍍生產線</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">C25D17/06</main-classification>  
        <further-classification edition="200601120241231B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞宇宙電路板設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　德和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種翻板裝置及電鍍生產線，翻板裝置用在電鍍生產線上，電鍍生產線包括兩個水平電鍍設備，翻板裝置設置在兩個水平電鍍設備之間，翻板裝置包括機架以及送料機構和翻轉機構，送料機構具有供電路板水平放置的水平輸送面，其中一個水平電鍍設備電鍍完成後的電路板進入水平輸送面，送料機構將其沿水平方向送至另一個水平電鍍設備，在輸送過程中，翻轉機構將水平輸送面上的電路板翻面，並使電路板相對側的兩個側邊調換位置，使兩個水平電鍍設備的電鍍輸送機構分別夾持電路板的相對兩側，以使電路板經過兩個水平電鍍設備兩次電鍍後鍍層更均勻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121:第一輸送線</p>  
        <p type="p">122:第二輸送線</p>  
        <p type="p">1231:第一直線電機</p>  
        <p type="p">1232:第一升降機構</p>  
        <p type="p">1233:第一推板件</p>  
        <p type="p">1241:第二直線電機</p>  
        <p type="p">1242:第二推板件</p>  
        <p type="p">125:第三輸送線</p>  
        <p type="p">1251:第二升降機構</p>  
        <p type="p">126:第四輸送線</p>  
        <p type="p">1271:第三直線電機</p>  
        <p type="p">1272:第三推板件</p>  
        <p type="p">1281:第四直線電機</p>  
        <p type="p">1282:第四推板件</p>  
        <p type="p">1291:第五直線電機</p>  
        <p type="p">1292:擋件</p>  
        <p type="p">130:翻轉機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="654" publication-number="202620252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板上料裝置及電鍍設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">C25D21/10</main-classification>  
        <further-classification edition="200601120250108B">C25D17/04</further-classification>  
        <further-classification edition="200601120250108B">H05K3/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞宇宙電路板設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　德和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電路板上料裝置及電鍍設備，電路板上料裝置包括機架以及設置在機架上的上料輸送機構、定位機構以及推料機構，上料輸送機構用於供電路板水平放置並將電路板沿水平方向輸送至電鍍設備的電鍍輸送機構，定位機構用於將上料輸送機構上的電路板定位至預定位置，推料機構包括第一驅動件和第一推料件，第一推料件與第一驅動件驅動連接，第一驅動件用於驅動第一推料件沿第一方向來回移動並帶動電路板移動，以調整相鄰兩個電路板的間距。定位機構可防止電路板位置偏移而傾斜。推料機構調整相鄰電路板間距，可提高電鍍均勻性以及生產效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:定位區域</p>  
        <p type="p">111:轉輥</p>  
        <p type="p">112:摩擦輪</p>  
        <p type="p">113:轉向支撐組件</p>  
        <p type="p">114:驅動電機</p>  
        <p type="p">121:第二驅動件</p>  
        <p type="p">122:第二推料件</p>  
        <p type="p">123:定位件</p>  
        <p type="p">131:第一驅動件</p>  
        <p type="p">132:第一推料件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="655" publication-number="202620251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水平電鍍生產線</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">C25D19/00</main-classification>  
        <further-classification edition="200601120241227B">C25D17/28</further-classification>  
        <further-classification edition="200601120241227B">C25D17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞宇宙電路板設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　德和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種水平電鍍生產線，包括水平電鍍設備和電路板上料裝置。水平電鍍設備包括第一機架和設置在第一機架上的電鍍缸以及水平電鍍輸送裝置，電鍍缸沿第一方向延伸，水平電鍍輸送裝置用於夾持電路板在電鍍缸內移動並進行電鍍，電路板上料裝置包括第二機架以及設置在第二機架上的上料輸送機構，上料輸送機構為具有一定長度的輸送線，上料輸送機構用於供電路板水平放置並將電路板沿水平方向輸送至電鍍設備的水平電鍍輸送裝置，在整個輸送過程中，電路板保持水平不需要通過機械手進行操作，設備佔用空間相較於傳統電鍍設備更小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水平電鍍生產線</p>  
        <p type="p">100:水平電鍍設備</p>  
        <p type="p">110:第一機架</p>  
        <p type="p">120:電鍍缸</p>  
        <p type="p">130:水平電鍍輸送裝置</p>  
        <p type="p">200:電路板上料裝置</p>  
        <p type="p">500:洗板裝置</p>  
        <p type="p">600:乾板裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="656" publication-number="202620755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊提供裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS PROVIDING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250602B">G06Q30/0601</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳立松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LISONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於電子裝置中進行之資訊提供方法。資訊提供方法可包括如下步驟：自用戶之終端接收對與第1物品相關之第1頁面之請求；基於第1物品資訊及用戶之資訊而確認是否需要接入限制；將第1頁面提供至用戶之終端；及於需要接入限制之情形時，藉由第1頁面來限制接入至用以對第1物品進行結算之第2頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S221:步驟</p>  
        <p type="p">S222:步驟</p>  
        <p type="p">S223:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="657" publication-number="202620993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電放電保護裝置</chinese-title>  
        <english-title>ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H02H9/04</main-classification>  
        <further-classification edition="202601120260223B">H10W42/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶焱科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種靜電放電保護裝置，其包含一二極體、一電壓箝位元件、一電子元件、一第一接腳與一第二接腳。二極體包含第一導電型之一第一摻雜區與第二導電型之一第二摻雜區，其中第一導電型與第二導電型相反。電壓箝位元件電性連接第一摻雜區。電子元件包含第一導電型之一第一區域、第二導電型之一第二區域、第一導電型之一第三區域與第二導電型之一第四區域。第一區域電性連接第二摻雜區，第二區域電性連接第一摻雜區與電壓箝位元件，第四區域電性連接電壓箝位元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic discharge protection device includes a diode, a voltage clamping component, an electronic component, a first pin, and a second pin. The diode includes a first doped area of a first conductivity type and a second doped area of a second conductivity type opposite to the first conductivity type. The voltage clamping component is electrically connected to the first doped area. The electronic component includes a first region of the first conductivity type, a second region of the second conductivity type, a third region of the first conductivity type, and a fourth region of the second conductivity type. The first region is electrically connected to the second doped area. The second region is electrically connected to the first doped area and the voltage clamping component. The fourth region is electrically connected to the voltage clamping component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:靜電放電保護裝置</p>  
        <p type="p">20:電壓箝位裝置</p>  
        <p type="p">200:二極體</p>  
        <p type="p">201:電壓箝位元件</p>  
        <p type="p">202:電子元件</p>  
        <p type="p">2020:第一區域</p>  
        <p type="p">2021:第二區域</p>  
        <p type="p">2022:第三區域</p>  
        <p type="p">2023:第四區域</p>  
        <p type="p">203:第一接腳</p>  
        <p type="p">204:第二接腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="658" publication-number="202620636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於ＲＩＳＣ—Ｖ架構的中斷控制方法、裝置及系統</chinese-title>  
        <english-title>INTERRUPT CONTROL METHOD, A DEVICE AND A SYSTEM BASED ON RISC-V ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G06F9/48</main-classification>  
        <further-classification edition="200601120250501B">G06F13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京有竹居網路技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厲航靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HANGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝永吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, YONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴穩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於RISC-V架構的中斷控制方法、裝置及系統。該中斷控制方法包括：響應於當前接收到的中斷信號，驅動全域中斷控制暫存器屏蔽全域中斷；從中斷信號記錄暫存器內獲取所述中斷信號的中斷資訊，並基於中斷資訊識別中斷信號是否是預先設定的偽NMI中斷；識別中斷信號為偽NMI中斷時，啟用NMI中斷處理機制，以響應偽NMI中斷；識別中斷信號為非偽NMI中斷時，啟用普通中斷處理機制，並驅動偽NMI中斷控制暫存器屏蔽新發生的非偽NMI中斷以及啟用NMI中斷處理機制以響應新發生的偽NMI中斷。該中斷控制方法實現了RISC-V架構的NMI中斷處理機制，提高了偽NMI中斷對應單一中斷源的響應速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An Interrupt control method, a device and a system based on RISC-V architecture are provided. The interrupt control method includes: in response to a currently received interrupt signal, driving a global interrupt control register to shield a global interrupt; acquiring the interrupt information of the interrupt signal from an interrupt signal recording register, and identifying whether the interrupt signal is a preset pseudo NMI interrupt based on the interrupt information; when the interrupt signal is identified as a pseudo NMI interrupt, enabling the NMI interrupt processing mechanism to respond to the pseudo NMI interrupt; when the interrupt signal is identified as a non-pseudo NMI interrupt, enabling the normal interrupt processing mechanism, and driving the pseudo NMI interrupt control register to shield the new non-pseudo NMI interrupt and enabling the NMI interrupt handling mechanism to respond to the new pseudo NMI interrupt. The interrupt control method realizes the NMI interrupt processing mechanism of RISC-V architecture and improves the response speed of pseudo-NMI interrupt corresponding to a single interrupt source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="659" publication-number="202621341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素驅動元件、驅動電路結構及形成驅動裝置的方法</chinese-title>  
        <english-title>PIXEL DRIVER DEVICE, DRIVER CIRCUIT STRUCTURE AND METHOD OF FORMING DRIVER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250611B">H10K59/10</main-classification>  
        <further-classification edition="202301120250611B">H10K59/12</further-classification>  
        <further-classification edition="202301120250611B">H10K59/127</further-classification>  
        <further-classification edition="202301120250611B">H10K71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晉宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翔裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何家琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宗士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHUNG-SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">各種揭露的實施例呈現利用整合二極體結構來增強次臨界擺幅和調變閥值電壓的像素驅動電路。傳統僅使用電晶體的設計在實現精確控制和效率方面常常遇到挑戰，受限於其次臨界擺幅和電壓調變能力。各種實施例在不需額外光罩和製程調整的情況下，將先進的MOSFET與二極體串聯整合，以實現對LED電流的先進控制，而無需更大面積代價，並通過元件次臨界工程來減少製程變異。這種電晶體-二極體配置改善亮度、灰階精確度和整體顯示性能，進而改善功率效率、先進顯示均勻性，以及改善發光二極體元件的可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments disclosed presents pixel driver circuits that utilize integrated diode structures to enhance sub-threshold swing and modulate threshold voltage. Conventional transistor-only designs often encounter challenges in achieving precise control and efficiency, limited by their sub-threshold swing and voltage modulation capabilities. Various embodiments incorporate advanced MOSFETs in series with diodes without an additional mask and process knob, enabling advanced control over the LED current without a larger area penalty and less process variation with device sub-threshold engineering. Such transistor-diode configuration improves brightness, gray-scale accuracy, and overall display performance, leading to improved power efficiency, advanced display uniformity, and improved reliability for LED devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:矽化物/矽化物接觸件/金屬矽化物金屬矽化物化合物</p>  
        <p type="p">12:氧化層</p>  
        <p type="p">30:P型井</p>  
        <p type="p">40:基底</p>  
        <p type="p">154、246:P+區域/接面/接面區域</p>  
        <p type="p">220:N+閘極電極/閘極/閘極電極</p>  
        <p type="p">240:汲極/區域</p>  
        <p type="p">242:源極/區域</p>  
        <p type="p">410:抗蝕劑保護氧化物(RPO)</p>  
        <p type="p">3070a:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="660" publication-number="202620442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針頭、探針卡組件及探針頭的製造方法</chinese-title>  
        <english-title>PROBE HEAD, PROBE CARD ASSEMBLY AND METHOD FOR MANUFACTURING PROBE HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G01R1/073</main-classification>  
        <further-classification edition="202001120250303B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃光興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUANG-SING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚書安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, SHU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何修羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HSIOU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯凱驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, KAI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧采寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSAI-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於對待測裝置(DUT)執行電性測試的探針頭包括：包括多個上通孔的上基板；配置在上基板之下的下基板組件，其包括分別對應多個上通孔的多個下通孔；連接在上基板及下基板組件之間的間隔件，以維持上基板及下基板組件之間的間隙；分別延伸通過多個上通孔及多個下通孔的多個第一探針；配置在下基板組件上的互連結構，其包括介電層及電路層；以及配置在互連結構上的多個第二探針，其通過電路層彼此電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe head for performing an electrical test on a device under test (DUT) includes an upper substrate including a plurality of upper through holes, a lower substrate assembly disposed under the upper substrate and including a plurality of lower through holes corresponding to the plurality of upper through holes respectively, a spacer connected between the upper substrate and the lower substrate assembly to maintain a gap between the upper substrate and the lower substrate assembly, a plurality of first probes extending through the plurality of upper through holes and the plurality of lower through holes respectively, an interconnect structure disposed on the lower substrate assembly and comprising a dielectric layer and a circuit layer, and a plurality of second probes disposed on the interconnect structure and electrically connected to one another through the circuit layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:探針頭</p>  
        <p type="p">110:下基板組件</p>  
        <p type="p">112,114,116:下通孔</p>  
        <p type="p">120:上基板</p>  
        <p type="p">122,124,126:上通孔</p>  
        <p type="p">122:輸入/輸出通孔</p>  
        <p type="p">124:接地通孔</p>  
        <p type="p">126:電力通孔</p>  
        <p type="p">130:間隔件</p>  
        <p type="p">142:輸入/輸出探針、第一探針</p>  
        <p type="p">144:接地探針、第一探針</p>  
        <p type="p">146:電力探針、第一探針</p>  
        <p type="p">150:第二探針</p>  
        <p type="p">160:黏著層</p>  
        <p type="p">170:互連結構</p>  
        <p type="p">172:介電層</p>  
        <p type="p">174:回送電路</p>  
        <p type="p">180:固定元件</p>  
        <p type="p">S1:上表面</p>  
        <p type="p">S2:下表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="661" publication-number="202620721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理物品之庫存之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING ITEM IN STOCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250709B">G06Q10/08</main-classification>  
        <further-classification edition="200601120250709B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂庫　阿米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIKOO, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之裝置包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；且上述裝置能夠以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：自用戶終端獲得與第1區位相關聯之一個以上之物品之庫存變更請求；將上述請求輸入至與上述第1區位相關聯之一個以上之佇列中之第1佇列；獲得表示已按照輸入於上述第1佇列中之請求之輸入順序來對輸入於上述第1佇列中之請求進行處理的資訊；基於表示已處理輸入於上述第1佇列中之請求之資訊，依次更新與上述第1區位相關聯之一個以上之物品之庫存資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="662" publication-number="202620400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有洩漏偵測的液態化學品供應系統及相關方法</chinese-title>  
        <english-title>LIQUID CHEMICAL SUPPLY SYSTEM HAVING LEAK DETECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G01M3/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊豐安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FENG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TIEN-TZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾恒毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許敬榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧順展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, SHUN CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾易龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種方法。該方法包括：接收儲存槽，其中保持液態化學品；將入口噴嘴附加到儲存槽，入口噴嘴包括：其中界定第一開口，第一開口與儲存槽內部流體連通；其中界定第二開口，第二開口與儲存槽內部氣體連通；其中界定第三開口；以及與第三開口接觸第一O形環；以及透過液態化學品執行半導體製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is provided. The method includes: receiving a storage tank that holds a liquid chemical therein; attaching an inlet nozzle to the storage tank, the inlet nozzle including: a first opening defined therein, the first opening in fluid communication with an interior of the storage tank; a second opening defined therein, the second opening in gas communication with the interior of the storage tank; a third opening defined therein; and a first O-ring in contact with the third opening; and performing a semiconductor process via the liquid chemical.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">120:儲存槽</p>  
        <p type="p">121:液態化學品</p>  
        <p type="p">122:出口噴嘴</p>  
        <p type="p">124:管</p>  
        <p type="p">126:入口噴嘴</p>  
        <p type="p">1262:氣體入口結構</p>  
        <p type="p">130:供應槽</p>  
        <p type="p">140、142、172:泵</p>  
        <p type="p">144、144A:過濾系統</p>  
        <p type="p">146、148、174:傳輸線</p>  
        <p type="p">150:工具</p>  
        <p type="p">160:氣體供應</p>  
        <p type="p">162、184:氣體傳輸管線</p>  
        <p type="p">166a、166b:流量計</p>  
        <p type="p">168a、168b:閥</p>  
        <p type="p">169:排氣口</p>  
        <p type="p">170:測量設備</p>  
        <p type="p">180:監測系統</p>  
        <p type="p">182:第一閥</p>  
        <p type="p">186:第二閥</p>  
        <p type="p">190:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="663" publication-number="202621543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光子半導體封裝、半導體封裝及其製作方法</chinese-title>  
        <english-title>PHOTONIC SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE AND METHODS OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/10</main-classification>  
        <further-classification edition="200601120260223B">G02B6/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉維綱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯承哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHENG-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧皓彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HAU-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, I-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾李全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, LEE-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光學引擎及製造光學引擎的方法。在實施例中，光學引擎包括矽基板及安裝在矽基板上的光子元件。光子元件包括邊緣耦合器及配置為與一個或多個外部光學元件介接的耦合介面。邊緣耦合器包括在耦合介面處的光子元件邊緣。矽基板包括在耦合介面處的基板耦合邊緣。光子元件邊緣在耦合介面處突出超過基板耦合邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical engines and methods for fabricating optical engines. In embodiments, the optical engine includes a silicon substrate and a photonic component mounted on the silicon substrate. The photonic component includes an edge coupler and a coupling interface configured to interface with one or more external optical components. The edge coupler includes a photonic component edge at the coupling interface. The silicon substrate includes a substrate coupling edge at the coupling interface. The photonic component edge protrudes beyond the substrate coupling edge at the coupling interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:光子元件</p>  
        <p type="p">118:耦合器</p>  
        <p type="p">118a:包覆層</p>  
        <p type="p">118b:光斑尺寸轉換器</p>  
        <p type="p">118c:埋入氧化層</p>  
        <p type="p">120:光</p>  
        <p type="p">122:光纖</p>  
        <p type="p">124:透鏡</p>  
        <p type="p">126:切割平面</p>  
        <p type="p">128:矽突緣</p>  
        <p type="p">140:矽基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="664" publication-number="202621317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250509B">H10F39/12</main-classification>  
        <further-classification edition="202501120250509B">H10F39/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡敏瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃怡文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, I WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">影像感測器元件包括電容結構，該電容結構包含作為介電材料的非晶成分，該非晶成分包括金屬氧化物混合物。非晶成分取代其他方法中使用的晶體金屬氧化物介電層堆疊。與晶體金屬氧化物介電層堆疊相比，非晶成分減少或防止界面缺陷和電子捕獲。單一非晶層避免金屬氧化物之間的界面和金屬氧化物晶體缺陷，電子捕獲容易在其中形成。與使用晶體金屬氧化物介電層堆疊的其他方法相比，所得影像感測器元件表現出減少的延遲。此外，使用包含金屬氧化物混合物的單一非晶層，與使用晶體金屬氧化物介電層堆疊的其他方法相比，增加相應電容結構的電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor device includes a capacitor structure that includes, as a dielectric material, an amorphous composition that includes a mixture of metal oxides. The amorphous composition replaces crystalline metal oxide dielectric layer stacks used in other approaches. The amorphous composition reduces or prevents interface defects and electron traps as compared to the crystalline metal oxide dielectric layer stacks. A single amorphous layer avoids the interfaces between metal oxides and metal oxide crystal defects in which the electron traps can be easily formed. The resulting image sensor device exhibits reduced lag as compared to other approaches that use crystalline metal oxide dielectric layer stacks. In addition, using the single amorphous layer including the mixture of metal oxides increases capacitance of a corresponding capacitor structure as compared to other approaches that use the crystalline metal oxide dielectric layer stacks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">236:底部電極層</p>  
        <p type="p">238:緩衝層</p>  
        <p type="p">240:絕緣層</p>  
        <p type="p">500:實施例</p>  
        <p type="p">ZrO&lt;sub&gt;x&lt;/sub&gt;(502):氧化鋯層</p>  
        <p type="p">Al&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;y&lt;/sub&gt;(504):氧化鋁層</p>  
        <p type="p">600:元素成分</p>  
        <p type="p">602:深度輪廓</p>  
        <p type="p">604:原子百分率</p>  
        <p type="p">606:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="665" publication-number="202619975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151064</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種複合分子篩、其製備方法及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">C01B39/04</main-classification>  
        <further-classification edition="200601120250701B">C01B39/48</further-classification>  
        <further-classification edition="200601120250701B">B01J29/70</further-classification>  
        <further-classification edition="200601120250701B">B01J29/74</further-classification>  
        <further-classification edition="200601120250701B">B01J29/80</further-classification>  
        <further-classification edition="202401120250701B">B01J35/00</further-classification>  
        <further-classification edition="200601120250701B">C10G45/64</further-classification>  
        <further-classification edition="200601120250701B">C07C5/27</further-classification>  
        <further-classification edition="200601120250701B">C07C9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋兆陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, ZHAOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉全杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QUANJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐會青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HUIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈立明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, LIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉紓言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHUYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種複合分子篩、其製備方法及其應用。本發明之複合分子篩的製造方法包括以下步驟：1)提供包含第一模板劑之第一分子篩，然後，2)在第二模板劑及上述包含第一模板劑之第一分子篩的存在下製造第二分子篩，而獲得上述複合分子篩，其中上述第一模板劑與上述第二模板劑彼此之間能夠形成氫鍵。本發明之複合分子篩可改良異構化反應之選擇性，提高單甲基支鏈異構體收率，顯著提高產品收率及產品品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="666" publication-number="202620722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理物品之庫存之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING ITEM IN STOCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250801B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂庫　阿米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIKOO, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之裝置可包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用於藉由上述一個以上之處理器而執行之命令；且上述裝置能夠以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：自用戶終端獲得針對在第1時點保管於一個區位中之一個以上之物品的庫存資訊之回傳請求；響應於上述庫存資訊之回傳請求而獲得事件資訊，該事件資訊包括在上述第1時點之前與上述區位相關聯之物品之庫存發生變化之事件各者之資訊；基於上述事件資訊，產生在上述第1時點保管於上述區位中之上述一個以上之物品之上述庫存資訊；且將上述庫存資訊傳輸至上述用戶終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="667" publication-number="202620537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造微影罩幕的方法以及非暫時性計算機可讀儲存介質</chinese-title>  
        <english-title>METHOD OF FABRICATING LITHOGRAPHY MASK AND NON-TRANSITORY COMPUTER- EADABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251104B">G03F1/22</main-classification>  
        <further-classification edition="201201120251104B">G03F1/36</further-classification>  
        <further-classification edition="202001120251104B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭勇誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANG, YUNG SENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SI TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸裿達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHI-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳尹川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">製造微影罩幕的方法包括接收用於微影製程曝光的目標空間影像；對目標空間影像執行運算式反向微影變換以產生反向空間影像；通過確定分別在不同焦距處計算的兩個或更多個反向空間影像之間的差異來產生反向空間影像梯度；基於反向空間影像確定影像對數斜率；形成反向空間影像、反向空間影像梯度和影像對數斜率的加權和；以及確定對應於超過第一預定閾值的加權和的強度的空間分布的主要罩幕特徵和弧線形次級解析輔助特徵。方法還包括基於成本函數的梯度執行迭代優化以優化微影罩幕布局，使得微影罩幕產生具有改進的焦深的空間影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of fabricating a lithography mask includes receiving a target aerial image for a lithographic process; performing a computational inverse lithography transformation on the target aerial image to generate an inverse aerial image; generating an inverse aerial image gradient by determining differences between two or more inverse aerial images computed at respective different focal distances; determining an image log slope based on the inverse aerial image; forming a weighted sum of the inverse aerial image, the inverse aerial image gradient, and the image log slope; and determining primary mask features and curved sub-resolution assist features that correspond to a spatial distribution of intensities of the weighted sum that exceed a first predetermined threshold. The method further includes performing an iterative optimization based on a gradient of a cost function to optimize a lithography mask layout such that the lithography mask generates an aerial image having improved depth of focus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">802、804、806、808:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="668" publication-number="202620458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於超聲波探測的區分地面低矮障礙物的探測方法</chinese-title>  
        <english-title>DETECTION METHOD APPLIED TO AN ULTRASONIC DETECTION FOR DISTINGUISHING LOW OBSTACLES ON THE GROUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G01S15/88</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商輝創電子科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS (SUZHOU)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯晨铖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHENCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用於超聲波探測的區分地面低矮障礙物的探測方法，採用的超聲波傳感器中集成有一個微控制器、一個超聲波驅動模組和一個超聲波接收模組，其中該超聲波傳感器之一側向外延伸出一個壓電換能器，另一側連接一個主控制器，其探測方法包括第一步至第十步之步驟。本發明之區分地面低矮障礙物的探測方法，在不改變傳感器安裝位置的前提下，在確保豎直障礙物的探測度的同時，利用傳感器在不同驅動頻率下探測角度變化的這一特性，區分出地面物體是否為低矮障礙物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection method applied to ultrasonic detection for distinguishing low obstacles on the ground. The ultrasonic sensor used in the detection method is integrated with a microcontroller, an ultrasonic driving module and an ultrasonic receiving module, wherein one side of the ultrasonic sensor extends outwards with a piezoelectric transducer, and the other side is connected to a main controller. The detection method includes the first to tenth steps. The detection method of the present invention for distinguishing low obstacles on the ground, without changing the installation position of the sensor, utilizes a change between detection angles of the sensor at different driving frequencies while ensuring the detection degree of vertical obstacles. The characteristic of the change between the detection angles can distinguish whether a ground object is a low obstacle.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="669" publication-number="202621134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>振動組件和揚聲器</chinese-title>  
        <english-title>VIBRATION COMPONENT AND SPEAKER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R7/02</main-classification>  
        <further-classification edition="200601120250203B">H04R9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美特科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬華明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, HUAMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅明亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, MINGYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏孝祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XIAOXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例公開了一種振動組件和揚聲器。振動組件包括軛鐵結構、膜片、主磁體和音圈。軛鐵結構包括多個套疊的第一導磁層，並開設有多個第一通孔，膜片設置於軛鐵結構的頂端，主磁體設置於膜片與軛鐵結構形成的腔體的底部，並與軛鐵結構形成環形磁間隙，音圈設置於磁間隙中，並與膜片連接。通過多個第一導磁層套疊形成軛鐵結構，並開設多個第一通孔，以多層的軛鐵結構代替原本軛鐵的支撐及導磁作用，以多孔設置代替原本單通氣孔配合金屬網布的設計，改善了散熱效果，省去複雜結構，提升了產品工作效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a vibration component and a speaker. The vibration component comprises a yoke structure, a diaphragm, a main magnet body and a voice coil. The yoke structure comprises a plurality of first magnetic conductive layers stacked and is disposed with a plurality of first through holes. The diaphragm is disposed on top of the yoke structure, and the main magnet body is disposed on bottom of a cavity formed by the diaphragm and the yoke structure, and forms an annular magnetic gap with the yoke structure. The voice coil is disposed in the magnetic gap and connected to the diaphragm. The yoke structure is formed by stacking the plurality of first magnetic conductive layers, and the plurality of first through holes are opened. Multiple layers of the yoke structure replaces the original yoke for support and magnetic conduction, and the multiple holes disposed replace design of original single ventilation hole cooperated with metal mesh, so as to improve the heat dissipation effect, eliminate complex structures, and improve operation efficiency of product. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:軛鐵結構</p>  
        <p type="p">2:膜片</p>  
        <p type="p">5:粘接層</p>  
        <p type="p">7:電路板組件</p>  
        <p type="p">8:支架結構</p>  
        <p type="p">11:第一導磁層</p>  
        <p type="p">14:第二導磁層</p>  
        <p type="p">15:第二通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="670" publication-number="202620651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器、快閃記憶體控制器的控制方法及其應用的電子裝置</chinese-title>  
        <english-title>FLASH MEMORY CONTROLLER, CONTROL METHOD OF FLASH MEMORY CONTROLLER, AND ELECTRONIC DEVICE APPLYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250528B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250528B">G06F13/14</further-classification>  
        <further-classification edition="200601120250528B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHI-XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快閃記憶體控制器，其用來存取一快閃記憶體模組。快閃記憶體控制器包括緩衝記憶體以及微處理器。緩衝記憶體的一部分區域用來暫存系統內部程式碼中關聯於處理寫入或讀取的寫入讀取命令程式碼。微處理器將緩衝記憶體的部分區域設置為保持記憶體，並在收到代表進入睡眠模式或關機模式的啟停單元命令時，將緩衝記憶體的部分區域設置為非保持記憶體，且在收到休眠命令後，快閃記憶體控制器進入省電模式，並關閉非保持記憶體。本發明還提供一種快閃記憶體控制器的控制方法及其應用的電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory controller for accessing a flash memory module is provided. The flash memory controller includes a buffer memory and a microprocessor. A portion of the buffer memory is used to temporarily store internal system program code associated with processing read and write commands. The microprocessor configures part of the buffer memory as a retention memory, and upon receiving an on/off command from the control unit, indicating entry into sleep mode or shutdown mode, the microprocessor sets the specified area of the buffer memory as non-retention memory. Upon receiving a sleep command, the flash memory controller enters power-saving mode and deactivates the non-retention memory. The invention also provides a control method for the flash memory controller and an electronic device applying the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:記憶裝置</p>  
        <p type="p">110:快閃記憶體模組</p>  
        <p type="p">111:系統區</p>  
        <p type="p">112:資料區</p>  
        <p type="p">113:備用區</p>  
        <p type="p">120:快閃記憶體控制器</p>  
        <p type="p">121:微處理器</p>  
        <p type="p">122:唯讀記憶體</p>  
        <p type="p">122C:程式碼</p>  
        <p type="p">123:記憶體介面</p>  
        <p type="p">124:緩衝記憶體</p>  
        <p type="p">124A:部分區域</p>  
        <p type="p">124B:另一部分區域</p>  
        <p type="p">125:主機介面</p>  
        <p type="p">130:主機端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="671" publication-number="202620874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器、快閃記憶體控制器的控制方法及其應用的電子裝置</chinese-title>  
        <english-title>FLASH MEMORY CONTROLLER, CONTROL METHOD OF FLASH MEMORY CONTROLLER, AND ELECTRONIC DEVICE APPLYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G11C16/06</main-classification>  
        <further-classification edition="200601120250501B">G11C16/30</further-classification>  
        <further-classification edition="201601120250501B">G06F12/0866</further-classification>  
        <further-classification edition="200601120250501B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHI-XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用來存取快閃記憶體模組之快閃記憶體控制器，其包括緩衝記憶體、微處理器以及計數器。緩衝記憶體的部分區域暫存程式碼中關聯於處理寫入或讀取的寫入讀取命令。計數器響應於微處理器連續收到寫入或讀取命令的次數而産生計數值。微處理器將緩衝記憶體的部分區域設置爲非保持記憶體，在收到休眠命令後，當計數值大於等於預設計數值時，將緩衝記憶體的部分區域設置爲保持記憶體後，使快閃記憶體控制器進入省電模式，並關閉非保持記憶體。並且本發明還公開一種快閃記憶體控制器的控制方法及其應用的電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory controller for accessing flash memory modules includes a buffer memory, a microprocessor, and a counter. A portion of the buffer memory temporarily stores write and read commands related to processing the writing or reading of codes. The counter generates a count value in response to the number of times the microprocessor continuously receives write or read commands. The microprocessor sets a portion of the buffer memory as non-retentive memory. After receiving a sleep command, when the count value is greater than or equal to a preset count value, the microprocessor sets the portion of the buffer memory to retentive memory, enabling the flash memory controller to enter a power-saving mode and shut down the non-retentive memory. This invention also discloses a control method for the flash memory controller and its application in electronic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:記憶裝置</p>  
        <p type="p">110:快閃記憶體模組</p>  
        <p type="p">111:系統區</p>  
        <p type="p">112:資料區</p>  
        <p type="p">113:備用區</p>  
        <p type="p">120:快閃記憶體控制器</p>  
        <p type="p">121:微處理器</p>  
        <p type="p">122:唯讀記憶體</p>  
        <p type="p">122C:程式碼</p>  
        <p type="p">123:記憶體介面</p>  
        <p type="p">124:緩衝記憶體</p>  
        <p type="p">124A:部分區域</p>  
        <p type="p">124B:另一部分區域</p>  
        <p type="p">125:主機介面</p>  
        <p type="p">126:計數器</p>  
        <p type="p">130:主機端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="672" publication-number="202621192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性恆流ＬＥＤ電源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">H05B45/345</main-classification>  
        <further-classification edition="202001120250401B">H05B45/357</further-classification>  
        <further-classification edition="202001120250401B">H05B45/395</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范志林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方烈義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種線性恆流發光二極體(Light Emitting Diode，LED)電源。該LED電源包括LED負載單元、第一電容、第二電容、第一開關、第二開關和第三開關，其中，第一電容的第一端通過第一二極體耦接到LED電源的整流後的輸入電壓並且通過第三二極體耦接到LED負載單元，第一電容的第二端通過第一開關和第一電阻耦接到地並且通過第三開關耦接到第二電容的第一端；並且第二電容的第一端還通過第二二極體耦接到整流後的輸入電壓，第二電容的第二端通過第二開關和第二電阻耦接到地。通過給第一和第二電容充電的方式增加輸入電流的導通相位角，提高LED電源的PF值，此外通過第一和第二電容的串聯電路對負載LED放電，這樣在實現高PF值的同時提高LED電源的效率，實現高PF值、高效率的線性恆流LED電源。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">ACIN:交流輸入電壓源</p>  
        <p type="p">C1:第一電容</p>  
        <p type="p">C2:第二電容</p>  
        <p type="p">Co:輸出電容</p>  
        <p type="p">D1:第一二極體</p>  
        <p type="p">D2:第二二極體</p>  
        <p type="p">D3:第三二極體</p>  
        <p type="p">I&lt;sub&gt;in&lt;/sub&gt;:輸入電流</p>  
        <p type="p">LED:發光二極體</p>  
        <p type="p">Rc1:第一電阻</p>  
        <p type="p">Rc2:第二電阻</p>  
        <p type="p">Rcs:電流取樣電阻</p>  
        <p type="p">S1:負載開關</p>  
        <p type="p">Sa:第一開關</p>  
        <p type="p">Sb:第二開關</p>  
        <p type="p">Sc:第三開關</p>  
        <p type="p">Vcs:負載電流採樣電壓</p>  
        <p type="p">Vcs_Sa:Sa支路的電流檢測電阻</p>  
        <p type="p">Vcs_Sb:Sb支路的電流檢測電阻</p>  
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:輸入電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="673" publication-number="202620413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用非線性光學訊號檢測晶圓之系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">G01N21/88</main-classification>  
        <further-classification edition="200601120250226B">G02F1/35</further-classification>  
        <further-classification edition="200601120250226B">G01B11/00</further-classification>  
        <further-classification edition="200601120250226B">G02B27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔚華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊燿州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峯杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用非線性光學訊號檢測晶圓之系統及方法，以一降雜訊模組獲取一待測樣品的出射光，該降雜訊模組核心組件包括一系列的分光鏡組合，以及接收該分光鏡組合的比例光束的光偵測器組合。將該待測樣品的均質區訊號以及在光電轉換過程中將隨機產生的背景雜訊予以削弱，背景雜訊總體降低，以突顯應保留的倍頻訊號，提高訊雜比。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:載台</p>  
        <p type="p">11:待測樣品</p>  
        <p type="p">13:出射光</p>  
        <p type="p">20:光源模組</p>  
        <p type="p">21:基頻光</p>  
        <p type="p">30:降雜訊模組</p>  
        <p type="p">40:訊號處理及成像模組</p>  
        <p type="p">313:第一分光鏡</p>  
        <p type="p">321:第一光偵測器</p>  
        <p type="p">322:第二光偵測器</p>  
        <p type="p">51:第一光束</p>  
        <p type="p">52:第二光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="674" publication-number="202620374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學倍頻技術檢測高深寬比微孔之系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G01B11/22</main-classification>  
        <further-classification edition="200601120250502B">G01B11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔚華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊燿州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峯杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學倍頻技術檢測高深寬比微孔之系統及方法，該微孔包含但不限於矽穿孔(TSV,Through Silicon Via)、玻璃穿孔(TGV,Through-Glass Via)。通過沿著微孔軸方向掃描特定波長的基頻光，激發該微孔與其他材質(包含但不限於空氣)的交界處產生強烈的界面增強倍頻訊號，據以獲得高分辨率及可視化的微孔幾何結構圖像，藉由該圖像可直觀該微孔的形貌或判斷其質量，亦可進一步分析倍頻訊號，實現對微孔尺寸、形狀、表面粗糙度、或瑕疵、裂縫判斷等高精度測量，適用於高深寬比微孔製程監控和品質控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:基頻光</p>  
        <p type="p">20:振鏡系統</p>  
        <p type="p">21:擴束器</p>  
        <p type="p">22:衰減器</p>  
        <p type="p">23:第一透鏡</p>  
        <p type="p">24:振鏡</p>  
        <p type="p">25:第二透鏡</p>  
        <p type="p">30:光偵測器</p>  
        <p type="p">40:訊號處理及圖像模組</p>  
        <p type="p">50:微孔</p>  
        <p type="p">51:待測樣品</p>  
        <p type="p">53:光訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="675" publication-number="202620672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G06F17/40</main-classification>  
        <further-classification edition="201301120250701B">G06F3/048</further-classification>  
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>  
        <further-classification edition="202301120250701B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐開誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, KAICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本文所揭示之實施例，資訊提供方法可包括如下步驟：提供包括物品之評論清單之第1類型頁面；於上述第1類型頁面中，確認上述評論清單所包括之第1評論中包括之內容之選擇資訊；提供顯示第1內容之第2類型頁面，該第1內容係基於上述選擇資訊而確認者；及對應於藉由上述第2類型頁面而獲得之操作資訊，變更並提供上述第2類型頁面中顯示之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器設備</p>  
        <p type="p">200:用戶設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="676" publication-number="202621483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法以及在導孔之中形成柱狀物的方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME AND METHOD OF FORMING PILLAR WITHIN VIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/40</main-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳新瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周孟緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佑廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構及其形成方法。在一些實施例中，一種用於形成半導體裝置的方法包括形成重佈線層，其包括連接導孔及表面架設墊導孔，且通孔各自的頂表面寬度大於底表面寬度。所述方法包括透過多個微凸塊將元件連接到重佈線層，並用模塑及底部填充劑填充元件與重佈線層之間的間隙。所述方法包括回蝕重佈線層以暴露表面架設墊導孔以及將表面架設墊附接至表面架設墊導孔。表面架設墊連接至表面架設墊導孔的底表面寬度，且表面架設墊包括突出部。所述方法包括將裝置連接到表面架設墊的底表面。本揭露更包括一種在導孔之中形成柱狀物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and methods of forming the same. In some embodiments, a method for forming a semiconductor device includes forming a redistribution layer that includes connecting vias and a surface mount pad via and the top surface width of each via is larger than a bottom surface width. The method includes connecting a component to the redistribution layer by a plurality of μ-bumps and filling a gap between the component and the redistribution layer with a mold and an underfill. The method includes etching back the redistribution layer to expose the surface mount pad via and attaching a surface mount pad to the surface mount pad via. The surface mount pad is connected to the bottom surface width of the surface mount pad via and the surface mount pad includes a protrude. The method includes connecting a device to a bottom surface of the surface mount pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">103:重佈線層(RDL)</p>  
        <p type="p">132:輸入/輸出(I/O)元件</p>  
        <p type="p">134:高頻寬記憶體(HBM)元件</p>  
        <p type="p">136:系統單晶片(SoC)元件</p>  
        <p type="p">142:底部填充劑</p>  
        <p type="p">146:模塑</p>  
        <p type="p">166:熱模組</p>  
        <p type="p">hd2:第二水平方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="677" publication-number="202621233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B10/00</main-classification>  
        <further-classification edition="202301120260223B">H10B99/00</further-classification>  
        <further-classification edition="202501120260223B">H10D84/80</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳於貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-BEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體裝置及形成方法。例示性方法包含接收電晶體，包含閘極結構於通道區上方，第一及第二源極∕汲極部件耦合至通道區，及介電結構於第一及第二源極∕汲極部件上方；形成第一溝槽延伸穿過介電結構以露出第一源極∕汲極部件，形成第二溝槽延伸穿過介電結構以露出第二源極∕汲極部件；形成遮罩層覆蓋第一溝槽，遮罩層的開口露出第二溝槽的一部分；在形成遮罩層之後，執行離子佈植製程以形成摻雜區於第二源極∕汲極部件中；以及在執行離子佈植製程之後，形成第一源極∕汲極接觸件於第一溝槽中，形成第二源極∕汲極接觸件於第二溝槽中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods are provided. An exemplary method includes receiving a transistor comprising a gate structure over a channel region, first and second source/drain features coupled to the channel region, and a dielectric structure over the first and the second source/drain features; forming a first trench extending through the dielectric structure to expose the first source/drain feature and a second trench extending through the dielectric structure to expose the second source/drain feature; forming a mask layer covering the first trench, wherein an opening of the mask layer exposes a portion of the second trench; after the forming of the mask layer, performing an ion implantation process to form a doped region in the second source/drain feature; and after the performing of the ion implantation process, forming a first source/drain contact in the first trench and a second source/drain contact in the second trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200A,200B:SRAM單元</p>  
        <p type="p">202:基板</p>  
        <p type="p">209:隔離部件</p>  
        <p type="p">258:摻雜區</p>  
        <p type="p">260:摻雜區</p>  
        <p type="p">PU-1,PU-2:上拉電晶體</p>  
        <p type="p">R-PG:讀取端通過閘極電晶體</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="678" publication-number="202621406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防濺系統</chinese-title>  
        <english-title>SPLASH PREVENTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳國銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金明昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHING, MIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉忠穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭豪毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HAU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昇照</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-CHAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻中一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡正原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">防濺系統包括一個或多個裝置，其被配置為在邊緣密封操作期間減少游離的密封劑顆粒落在晶圓堆疊頂表面和/或底表面的可能性。注入器噴嘴可在使用夾具旋轉晶圓堆疊時將密封劑分配到晶圓堆疊周圍的凹槽中。防濺系統的真空裝置可在晶圓堆疊邊緣提供負壓氣流，該負壓氣流用於收集游離的密封劑顆粒。此外和/或替代地，氣簾裝置可在晶圓堆疊邊緣提供正壓氣流，該正壓氣流可用於消除游離的密封劑顆粒遠離晶圓堆疊邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A splash prevention system includes one or more devices that are configured to reduce the likelihood of errant sealant particles landing on a top and/or a bottom surface of a wafer stack during an edge sealing operation. An injector nozzle may dispense sealant into the groove around the wafer stack as a chuck is used to rotate the wafer stack. A vacuum device of the splash prevention system may provide a negative-pressure gas flow at the edge of the wafer stack, and the negative-pressure gas flow is used to collect errant sealant particles. Additionally and/or alternatively, an air curtain device may provide a positive-pressure gas flow at the edge of the wafer stack, and the positive-pressure gas flow may be used to dispel errant sealant particles away from the edge of the wafer stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體處理工具</p>  
        <p type="p">104:底座</p>  
        <p type="p">106:夾具</p>  
        <p type="p">108:晶圓堆疊</p>  
        <p type="p">108a、108b:基底</p>  
        <p type="p">110:注入器噴嘴</p>  
        <p type="p">114:防濺系統</p>  
        <p type="p">116:頂升銷</p>  
        <p type="p">118:主體部</p>  
        <p type="p">120:安裝凸緣</p>  
        <p type="p">122:凹陷</p>  
        <p type="p">124:真空裝置</p>  
        <p type="p">126:調整元件</p>  
        <p type="p">128:顯示裝置</p>  
        <p type="p">130:氣體出口</p>  
        <p type="p">132:氣簾裝置</p>  
        <p type="p">134:氣體入口</p>  
        <p type="p">136:控制器</p>  
        <p type="p">200:示例實施例</p>  
        <p type="p">202:正壓氣流</p>  
        <p type="p">204:氣體供應管線</p>  
        <p type="p">206:氣孔</p>  
        <p type="p">208:背側表面</p>  
        <p type="p">210:頂表面</p>  
        <p type="p">212:間隙</p>  
        <p type="p">214:負壓氣流</p>  
        <p type="p">216:真空孔</p>  
        <p type="p">218:前側表面</p>  
        <p type="p">220:密封劑</p>  
        <p type="p">222:凹槽</p>  
        <p type="p">224:密封劑顆粒</p>  
        <p type="p">D1、D2:尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="679" publication-number="202621479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/20</main-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/22</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳穎茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YING-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周家玥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIA-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈香谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HSIANG-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置結構及其形成方法。半導體裝置結構包含設置在基板上方的互連結構、設置在互連結構上方的第一介電層、以及設置在第一介電層上的第二介電層。第二介電層包括具有大於約20的k值及小於約5 eV的帶隙的介電材料。半導體裝置結構還包含設置在第二介電層上的第三介電層及設置在第三介電層上的第一導電部件。第一導電部件包含延伸穿過第一介電層、第二介電層、以及第三介電層的第一部分、以及設置在第三介電層上的第二部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes an interconnection structure disposed over a substrate, a first dielectric layer disposed over the interconnection structure, and a second dielectric layer disposed on the first dielectric layer. The second dielectric layer comprises a dielectric material having a k value greater than about 20 and a band gap less than about 5 eV. The semiconductor structure further includes a third dielectric layer disposed on the second dielectric layer and a first conductive feature disposed on the third dielectric layer. The first conductive feature includes a first portion extending through the first dielectric layer, the second dielectric layer, and the third dielectric layer and a second portion disposed on the third dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">102:基板</p>  
        <p type="p">106:互連結構</p>  
        <p type="p">108:金屬間介電層</p>  
        <p type="p">110、116、126、128:介電層</p>  
        <p type="p">112、142、152:導電部件</p>  
        <p type="p">114:蝕刻停止層</p>  
        <p type="p">118:金屬-絕緣體-金屬結構</p>  
        <p type="p">120:第一電極層</p>  
        <p type="p">122:第二電極層</p>  
        <p type="p">124:第三電極層</p>  
        <p type="p">130、146:鈍化層</p>  
        <p type="p">132:緩衝層</p>  
        <p type="p">138:阻障層</p>  
        <p type="p">140:晶種層</p>  
        <p type="p">144:黏著層</p>  
        <p type="p">148:介電材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="680" publication-number="202620020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳酸伸烷酯的製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING ALKYLENE CARBONATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250520B">C07D317/36</main-classification>  
        <further-classification edition="200601120250520B">C07B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, FUMINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山雅子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, MASAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種碳酸伸烷酯之製造方法，係由環氧烷及二氧化碳製造碳酸伸烷酯之方法，其中由廢液在回收碳酸伸烷酯及鹼金屬鹵化物之同時，減少HB的挾帶。&lt;br/&gt;本發明之解決手段為一種碳酸伸烷酯之製造方法，係製造碳酸伸烷酯，包括在鹼金屬鹵化物的存在下使環氧烷與二氧化碳在反應器中反應，而獲得碳酸伸烷酯之反應步驟；將經過前述反應步驟的含有碳酸伸烷酯及鹼金屬鹵化物之混合物(A)進行冷卻之冷卻步驟；及將含有碳酸伸烷酯及鹼金屬鹵化物之固體與母液進行分離之固液分離步驟，並於前述反應器供給在前述固液分離步驟中分離的碳酸伸烷酯及鹼金屬鹵化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a method for producing alkylene carbonate from alkylene oxide and carbon dioxide, in which alkylene carbonate and alkali halide are recovered from waste liquid while reducing entrainment of HB.&lt;br/&gt;A method for producing an alkylene carbonate, the method comprising: a reaction step of reacting an alkylene oxide and carbon dioxide in a reactor in the presence of an alkali halide to obtain an alkylene carbonate; a cooling step of cooling a mixture (A) containing the alkylene carbonate and the alkali halide which has been subjected to the reaction step; and a solid-liquid separation step of separating a solid containing the alkylene carbonate and the alkali halide from a mother liquid; wherein the method supplies the alkylene carbonate separated in the solid-liquid separation step and an alkali halide to the reactor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="681" publication-number="202620652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器及快閃記憶體控制器的資料讀取方法</chinese-title>  
        <english-title>FLASH MEMORY CONTROLLER AND DATA READING METHOD OF FLASH MEMORY CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250501B">G06F13/38</further-classification>  
        <further-classification edition="200601120250501B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李法豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FAHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">快閃記憶體控制器包含控制器電路與排程電路。控制器電路接收主機裝置所發送之多平面讀取命令訊號，以根據所記載之位址資訊來分別讀取快閃記憶體內的多個記憶體平面上對應於位址資訊之多個儲存頁之資料，將該多個第一讀取命令暫存於第一等待列表，將多個第二讀取命令暫存於第二等待列表。排程電路用以將該第一等待列表與該第二等待列表中所暫存之讀取命令重新排序，使多個第一資料輸出時間段錯開多個第二資料輸出時間段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory controller comprises a controller circuit and a scheduler circuit. The controller circuit receives a multi-plane read command signal sent from a host device to respectively read data of storage pages, corresponding to the carried address information, on multiple memory planes within a flash memory. The controller circuit stores the first read commands in the first pending list and stores the second read commands in the second pending list. The scheduler circuit reorders the read commands stored in the first and second pending lists to make first data output time intervals be staggered and not overlap with second data output time intervals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:快閃記憶體控制器</p>  
        <p type="p">101:主機裝置</p>  
        <p type="p">102:快閃記憶體晶片</p>  
        <p type="p">105:控制器電路</p>  
        <p type="p">110:排程電路</p>  
        <p type="p">115:前端電路</p>  
        <p type="p">120:轉換層電路</p>  
        <p type="p">125:後端電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="682" publication-number="202621094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置升級方法及裝置升級系統</chinese-title>  
        <english-title>DEVICE UPGRADE METHOD AND DEVICE UPGRADE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250602B">H04L41/50</main-classification>  
        <further-classification edition="202201120250602B">H04L41/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, JUN-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONG-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇啟源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, QI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置升級方法，包括下列步驟。利用顯示裝置的控制模組與遠端伺服器的信息管理功能模組透過顯示裝置的交換器模組建立網路連線。透過控制模組將裝置信息傳送至信息管理功能模組。透過信息管理功能模組對裝置信息進行驗證處理，並產生裝置升級信息至控制模組。控制模組依據裝置升級信息，由信息管理功能模組下載裝置升級資料，驗證裝置升級資料，以及依據裝置升級資料對顯示裝置的功能裝置進行升級處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device upgrade method includes the following steps. A control module of a display device and an information technology management module of a remote server are used to establish a network connection through a switch module of the display device. The control module is used to transmit device information to the information technology management module. The information technology management module is used to perform a verification process on the device information and generate device upgrade information to the control module. The control module downloads the device upgrade data from the information technology management module according to the device upgrade information, verifies the device upgrade data, and perform an upgrade process on a function device of the display device according to the device upgrade data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S302~S308:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="683" publication-number="202620911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變壓器結構</chinese-title>  
        <english-title>TRANSFORMER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">H01F30/06</main-classification>  
        <further-classification edition="200601120250224B">H01F27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方榮展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, JUNG-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張少東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHAO-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銘成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種變壓器結構，設置於一電路板上，其中前述電路板具有一開孔，前述變壓器結構包括一框架單元、一線圈單元、一鐵芯單元以及至少一ㄇ字形之導電件。前述框架單元設置於前述電路板，其中前述框架單元具有一容置空間，用以容納前述線圈單元以及鐵芯單元，其中至少一部分之前述容置空間位於前述開孔中。前述導電件設置於前述框架單元，並且電性連接前述線圈單元以及前述電路板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transformer structure is provided on a circuit board that has an opening. The transformer structure includes a frame unit, a coil unit, a magnetic core unit, and at least an inverted U-shaped conductive member. The frame unit is disposed on the circuit board and has a receiving space for accommodating the coil unit and the magnetic core unit, and at least a part of the receiving space is located in the opening. The conductive member is disposed on the frame unit and electrically connected between the coil unit and the magnetic core unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:變壓器結構</p>  
        <p type="p">A:中心軸</p>  
        <p type="p">B:電路板</p>  
        <p type="p">B0:開孔</p>  
        <p type="p">C:線圈單元</p>  
        <p type="p">F:框架單元</p>  
        <p type="p">F0:容置空間</p>  
        <p type="p">M:鐵芯單元</p>  
        <p type="p">M1:上鐵芯</p>  
        <p type="p">M2:下鐵芯</p>  
        <p type="p">P:導電件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="684" publication-number="202621484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDCUTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/40</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史朝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, KUO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燕銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片級系統整合結構，其包括第一半導體晶粒、第一絕緣封裝體、第一重佈線電路結構、第一接合結構及第二半導體晶粒。第一絕緣封裝體包覆第一半導體晶粒。第一重佈線電路結構配置在第一半導體晶粒及第一絕緣封裝體上。第一接合結構配置在第一重佈線電路結構上並與其電性連接。第一接合結構包括第一接合介電層及嵌入第一接合介電層中的第一接合導體。第二半導體晶粒包括第二接合結構，第二接合結構包括第二接合介電層及嵌入第二接合介電層中的第二接合導體，其中第一接合介電層與第二接合介電層接合，且第一接合導體與第二接合導體電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system on integrated circuit structure including first semiconductor dies, a first insulating encapsulant, a first redistribution circuit structure, a first bonding structure, and a second semiconductor die is provided. The first insulating encapsulant encapsulates the first semiconductor dies. The first redistribution circuit structure is disposed on the first semiconductor dies and the first insulating encapsulant. The first bonding structure is disposed on and electrically connected to the first redistribution circuit structure. The first bonding structure includes a first bonding dielectric layer and first bonding conductors embedded in the first bonding dielectric layer. The second semiconductor die includes a second bonding structure, the second bonding structure includes a second bonding dielectric layer and second bonding conductors embedded in the second bonding dielectric layer, wherein the first bonding dielectric layer is bonded with the second bonding dielectric layer, and the first bonding conductors are electrically connected to the second bonding conductors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:焊料區域</p>  
        <p type="p">400:元件晶粒</p>  
        <p type="p">410:封裝基板</p>  
        <p type="p">P1、P2:封裝體</p>  
        <p type="p">SS1:晶片級系統整合結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="685" publication-number="202620478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及其製造方法</chinese-title>  
        <english-title>OPTICAL DEVICES AND METHODS OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B6/12</main-classification>  
        <further-classification edition="200601120260223B">G02B6/42</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W76/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉子正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZI-JHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">製造光學裝置的方法，包括在晶粒的基底表面的第一區域上形成多個第一金屬結構，且在晶粒的基底表面的第二區域上形成第二金屬結構，其中第二金屬結構至少與第一金屬結構相比具有不同形狀，且第二金屬結構具有條狀形狀。所述方法可進一步包括透過多個第一金屬結構將晶粒接合到支撐基板，並在晶粒基底表面與支撐基板之間施加底部填充劑。在一些實施例中，從截面圖來看，底部填充劑從支撐基板的頂部表面延伸到晶粒的側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing an optical device that can include forming a plurality of first metal structures on a first region of a base surface of a die and a second metal structure on a second region of the base surface of the die, wherein the second metal structure has a different shape compared to the at least the first metal structure, and the second metal structure has a bar-type shape. The method can further include bonding the die to a supporting substrate through the plurality of the first metal structures, and applying an underfill material between the base surface of the die and the supporting substrate. In some embodiments, in a cross-sectional view, the underfill material extends from a top surface of the supporting substrate to a sidewall of the die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學中介層</p>  
        <p type="p">201:第一主動層</p>  
        <p type="p">203a:邊緣耦合器</p>  
        <p type="p">401:第二絕緣層</p>  
        <p type="p">501:第一金屬化層</p>  
        <p type="p">503:第二光學元件</p>  
        <p type="p">505:第一接合層</p>  
        <p type="p">507:第一接合墊</p>  
        <p type="p">509:第一介電材料</p>  
        <p type="p">511:第三光學元件</p>  
        <p type="p">600:電子積體電路</p>  
        <p type="p">601:第一半導體裝置</p>  
        <p type="p">603、701:半導體基板</p>  
        <p type="p">605:主動裝置</p>  
        <p type="p">607:互連結構</p>  
        <p type="p">609:第二接合層</p>  
        <p type="p">611:第二接合墊</p>  
        <p type="p">613:第一間隙填充材料</p>  
        <p type="p">800:光子積體電路</p>  
        <p type="p">801:第二主動層</p>  
        <p type="p">900:光學封裝</p>  
        <p type="p">901:第一穿裝置通孔</p>  
        <p type="p">903:第三接合層</p>  
        <p type="p">909:第三接合墊</p>  
        <p type="p">912:銅柱</p>  
        <p type="p">913:柱狀凸塊/連接凸塊</p>  
        <p type="p">914:聚合物層</p>  
        <p type="p">915:邊緣壩</p>  
        <p type="p">916:第一側</p>  
        <p type="p">917:焊料帽</p>  
        <p type="p">918:第二側</p>  
        <p type="p">919:側壁</p>  
        <p type="p">920:背側表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="686" publication-number="202621265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及其製作方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/66</main-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林杏芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉克群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KO CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王教瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JAIO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種實施例指向積體電路（IC），其中電容器（例如三維（3D）金屬-絕緣體-金屬（MIM）電容器或類似物）具有著陸在電容器底部通孔上的溝槽段。電容器底部通孔從溝槽段延伸到位於電容器下方的電容器底部導線，以將電容器電耦合到電容器底部導線。溝槽段是電容器多個溝槽段中的一個，多個溝槽段中的額外溝槽段與電容器底部通孔和電容器底部導線所在的導線層級間隔開。這使得額外溝槽段正下方的導線層級部分可用於與電容器無關的訊號布線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of the present disclosure are directed to an integrated circuit (IC) in which a capacitor (e.g., a three-dimensional (3D) metal-insulator-metal (MIM) capacitor or the like) has a trench segment landing on a capacitor-bottom via. The capacitor-bottom via extends from the trench segment to a capacitor-bottom wire that underlies the capacitor to electrically couple the capacitor to the capacitor-bottom wire. The trench segment is one of a plurality of trench segments of the capacitor, and an additional trench segment of the plurality of trench segments is spaced from the capacitor-bottom via and a wire level at which the capacitor-bottom wire is located. This frees a portion of the wire level directly under the additional trench segment for routing of signals unrelated to the capacitor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:剖面圖</p>  
        <p type="p">102:電容器</p>  
        <p type="p">104:溝槽段</p>  
        <p type="p">104a:第一溝槽段</p>  
        <p type="p">104b:第二溝槽段</p>  
        <p type="p">104c:第三溝槽段</p>  
        <p type="p">106b:電容器底部通孔</p>  
        <p type="p">106t:電容器頂部通孔</p>  
        <p type="p">108b:電容器底部導線</p>  
        <p type="p">108m、108n:導線</p>  
        <p type="p">108t:電容器頂部導線</p>  
        <p type="p">110:基底</p>  
        <p type="p">112:介電結構</p>  
        <p type="p">114:互連結構</p>  
        <p type="p">116:底部電極</p>  
        <p type="p">118:電容介電層</p>  
        <p type="p">120:頂部電極</p>  
        <p type="p">V&lt;sub&gt;x&lt;/sub&gt;、V&lt;sub&gt;x+1&lt;/sub&gt;:通孔層級</p>  
        <p type="p">W&lt;sub&gt;x&lt;/sub&gt;、W&lt;sub&gt;x+2&lt;/sub&gt;:導線層級</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="687" publication-number="202620443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探測被測裝置的設備和方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR PROBING DEVICE-UNDER-TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G01R1/073</main-classification>  
        <further-classification edition="200601120250303B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫傳翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHUAN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李函倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林源澧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯凱驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, KAI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">探測被測裝置的設備包括配置在被測裝置上方的夾具、附著到夾具的電路膜、配置在電路膜第一側並朝向被測裝置延伸的第一探針接觸件、配置在電路膜與第一側相反的第二側並朝向夾具延伸的第二探針接觸件以及耦合到第二探針接觸件並通過電路膜電性耦合到第一探針接觸件的第一積體裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film attached to the fixture, first probe contacts disposed on a first side of the circuitry film and extending toward the DUT, second probe contacts disposed on a second side of the circuitry film opposite to the first side and extending toward the fixture, and a first integrated device coupled to the second probe contacts and electrically coupled to the first probe contacts through the circuitry film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:被測裝置</p>  
        <p type="p">15C:接觸件</p>  
        <p type="p">16:吸盤</p>  
        <p type="p">19:固定元件</p>  
        <p type="p">100:探針設備</p>  
        <p type="p">101:載體</p>  
        <p type="p">110:夾具</p>  
        <p type="p">112:基底</p>  
        <p type="p">114:突出部</p>  
        <p type="p">132:第一探針接觸件</p>  
        <p type="p">134:第二探針接觸件</p>  
        <p type="p">142:第一積體裝置</p>  
        <p type="p">144:第二積體裝置</p>  
        <p type="p">150:電路板</p>  
        <p type="p">150a:頂表面</p>  
        <p type="p">150b:底表面</p>  
        <p type="p">152:訊號通道</p>  
        <p type="p">153:導電接觸件</p>  
        <p type="p">1202:第二部分</p>  
        <p type="p">1203:第三部分</p>  
        <p type="p">1421:第一焊點</p>  
        <p type="p">1441:第二焊點</p>  
        <p type="p">TH:孔洞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="688" publication-number="202621529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含混合型ＴＩＭ結構的封裝結構及其形成方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE INCLUDING HYBRID TIM STRUCTURE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖一寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YI-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭博元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王卜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭禮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">封裝結構包括封裝基底、封裝基底上的半導體模組、半導體模組上且附接於封裝基底的封裝蓋以及在半導體模組和封裝蓋之間的混合型熱界面材料（TIM）結構，混合型TIM結構包括TIM層和TIM層中的蒸汽核心散熱器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes a package substrate, a semiconductor module on the package substrate, a package lid on the semiconductor module and attached to the package substrate, and a hybrid thermal interface material (TIM) structure between the semiconductor module and the package lid, including a TIM layer and a vapor core heat spreader in the TIM layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130p:封裝蓋板部分</p>  
        <p type="p">140a:上表面</p>  
        <p type="p">141、142:晶粒</p>  
        <p type="p">151:層</p>  
        <p type="p">170:結構</p>  
        <p type="p">172a:下部TIM部分</p>  
        <p type="p">172aO:下部TIM部分外壁</p>  
        <p type="p">172b:上部TIM部分</p>  
        <p type="p">172bO:上部TIM部分外壁</p>  
        <p type="p">174:蒸氣核心散熱器</p>  
        <p type="p">176:外側蓋</p>  
        <p type="p">177:芯</p>  
        <p type="p">178:內部腔室</p>  
        <p type="p">180a、180b、180c、180d、180e:金屬間化合物層/IMC層</p>  
        <p type="p">S&lt;sub&gt;130p&lt;/sub&gt;:底表面</p>  
        <p type="p">x、y、z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="689" publication-number="202620723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>確認未來時點之商品之銷售量資訊之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD OF IDENTIFYING SALES VOLUME INFORMATION OF ITEM AT FUTURE, ELECTRONIC DEVICE AND RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250701B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250701B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董火明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, HUOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QINGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡馬爾　尤努斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMAL, YUNUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何立文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之各種實施例之藉由電子裝置而實行的確認未來時點之商品之銷售量資訊之方法可包括如下步驟：獲得複數個商品中第1商品之與時段相應之銷售量資訊及上述第1商品之類別資訊；識別上述第1商品是否為期間商品；響應於將上述第1商品識別為期間商品，識別與上述第1商品包括於同一類別中之至少一個第2商品；獲得上述至少一個第2商品之與時段相應之銷售量資訊；及基於上述第1商品之與時段相應之銷售量資訊、類別資訊及上述至少一個第2商品之與時段相應之銷售量資訊，確認未來時點之上述第1商品之銷售量資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">200:外部裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="690" publication-number="202620407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>即時監測臭氧中粒子的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REAL-TIME MONITORING OF PARTICLES IN OZONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250326B">G01N15/075</main-classification>  
        <further-classification edition="200601120250326B">C01B13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明遠精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINESSE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾信華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林侑融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴天琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種即時監測臭氧中粒子的系統及方法包含臭氧還原裝置用以沿著螺旋狀輸送路徑將臭氧源所提供之臭氧加熱還原成氧氣以及粒子計數器用以即時監測氧氣中之粒子。臭氧源係選擇性分流供應一部分的臭氧給臭氧還原裝置與另一部分的臭氧給製程設備，用以在製程設備進行製程的同時，使用粒子計數器即時監測氧氣中之粒子，藉此可預防臭氧所含的其他非臭氧粒子造成汙染，還可證明臭氧產生器作為臭氧源時所提供的臭氧氣體或製程設備作為臭氧源時所排放的臭氧尾氣不具有汙染粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:即時監測臭氧中粒子的系統</p>  
        <p type="p">10:進氣導管</p>  
        <p type="p">12:出氣導管</p>  
        <p type="p">20:氣體輸送管</p>  
        <p type="p">30:加熱元件</p>  
        <p type="p">40:進氣端轉接頭</p>  
        <p type="p">42:出氣端轉接頭</p>  
        <p type="p">50:隔熱元件</p>  
        <p type="p">60:溫度計</p>  
        <p type="p">70:溫度控制元件</p>  
        <p type="p">100:臭氧源</p>  
        <p type="p">110:臭氧</p>  
        <p type="p">120:氧氣</p>  
        <p type="p">300:臭氧還原裝置</p>  
        <p type="p">400:冷卻裝置</p>  
        <p type="p">500:粒子計數器</p>  
        <p type="p">P:螺旋狀輸送路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="691" publication-number="202619709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗痙攣藥物用於治療鉀離子通道異常導致之KCNQ2腦病變及神經發展障礙之用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">A61K31/4015</main-classification>  
        <further-classification edition="200601120250401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山醫學大學附設醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李英齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊世斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一種鉀離子通道異常導致之KCNQ2 腦病變及神經發展障礙，其中，該抗痙攣藥物係為Brivaracetam；意即透過投予一有效量之Brivaracetam至一KCNQ通道異常之患者，係能夠增強野生型或突變型之KCNQ2通道Kv 7.2電流、提早開啟KCNQ通道且能夠延長KCNQ2通道關閉時間，可以改善因KCNQ2突變引起的神經發展遲緩與痙攣，以達到早期改善或治療KCNQ2早發性腦病變及其相關神經發展障礙之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="692" publication-number="202620775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE FOR PROVIDING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250709B">G06Q50/40</main-classification>  
        <further-classification edition="202301120250709B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250709B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250709B">G06Q10/06</further-classification>  
        <further-classification edition="202301120250709B">G06Q10/047</further-classification>  
        <further-classification edition="202301120250709B">G06Q10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王曦晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹樹祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, SHUXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢宇清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, YUQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱龍超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, LONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，公開一種於電子裝置中提供資訊之方法，其包括如下步驟：確認與配送服務相關之配送歷史資訊；基於配送歷史資訊來確認預測模型；確認與配送服務相關之狀態資訊；基於預測模型及狀態資訊來確認設定之時段之配送分配延遲預測資訊；及基於設定之時段之配送分配延遲預測資訊，確定用以調節配送需求及配送供應中之至少一者之配送服務之策略資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:配送員終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="693" publication-number="202620394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣壓檢測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G01L9/12</main-classification>  
        <further-classification edition="200601120250512B">G01L19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方烈義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種氣壓檢測系統，包括：氣壓感測器，被配置為檢測外部氣壓並生成脈衝信號；脈衝計數器，被配置為對脈衝信號在預設時間間隔內的脈衝個數進行計數並生成脈衝計數值；以及第一比較器，被配置為將脈衝計數值和第一預設參考值進行比較，在脈衝計數值大於第一預設參考值的情況下進一步將脈衝計數值和第二預設參考值進行比較，並生成第一比較結果信號作為氣壓檢測信號，其中，第二預設參考值大於第一預設參考值，當脈衝計數值不大於第一預設參考值時，氣壓檢測信號指示外部氣壓發生變化，當脈衝計數值大於第二預設參考值時，氣壓檢測信號指示外部氣壓沒有發生變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">300:氣壓檢測系統</p>  
        <p type="p">302:氣壓感測器</p>  
        <p type="p">304:振盪器</p>  
        <p type="p">306:計數器</p>  
        <p type="p">308,310:比較器</p>  
        <p type="p">312:參考值更新模組</p>  
        <p type="p">Clk:時鐘信號</p>  
        <p type="p">H:預設檢測偏差遲滯值</p>  
        <p type="p">M:預設脈衝計數閾值</p>  
        <p type="p">N:脈衝計數值</p>  
        <p type="p">Q:預設檢測偏差閾值</p>  
        <p type="p">T:預設溫度跟蹤閾值</p>  
        <p type="p">Vcomp1,Vcomp2:比較結果信號</p>  
        <p type="p">Vpulse:脈衝信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="694" publication-number="202621017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>限功率電源適配器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H02M1/08</main-classification>  
        <further-classification edition="200601120250203B">G06F1/26</further-classification>  
        <further-classification edition="200601120250203B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鄭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種限功率電源適配器，包括恆流源、通用序列匯流排介面、連接到通用序列匯流排介面的電源匯流排針腳的輸出控制電晶體、以及用於檢測限功率電源適配器的輸出電流的輸出電流檢測電阻，該限功率電源適配器被配置為：在限功率電源適配器上電工作後但移動終端設備尚未連接到限功率電源適配器時，控制恆流源與通用序列匯流排介面的配置通道針腳之間的連接斷開達預定時間，通過在預定時間內對配置通道針腳處的電壓進行採樣得到第一採樣低電壓，並根據第一採樣低電壓和輸出電流檢測電阻兩端的輸出電流感測電壓的組合判斷是否出現輸出電流檢測電阻和輸出控制電晶體的組合失效。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">Current Sense:輸出電流感測電壓</p>  
        <p type="p">Current:移動終端設備的真實負載電流</p>  
        <p type="p">VBUS,CC:電壓</p>  
        <p type="p">Vcc_H1:第一採樣高電壓</p>  
        <p type="p">Vcc_H2:第二採樣高電壓</p>  
        <p type="p">Vcc_H3:第三採樣高電壓</p>  
        <p type="p">Vcc_H4:第四採樣高電壓</p>  
        <p type="p">Vcc_L1:第一採樣低電壓</p>  
        <p type="p">Vcc_L2:第二採樣低電壓</p>  
        <p type="p">Vcc_L3:第三採樣低電壓</p>  
        <p type="p">Vcc_L4:第四採樣低電壓</p>  
        <p type="p">Vcc_△1:第一電壓差值</p>  
        <p type="p">Vcc_△2:第二電壓差值</p>  
        <p type="p">Vcc_△3:第三電壓差值</p>  
        <p type="p">Vcc_△4:第四電壓差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="695" publication-number="202620753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置及其方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE FOR PROVIDING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250915B">G06Q30/0282</main-classification>  
        <further-classification edition="202301120250915B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250915B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中提供資訊之方法，其包括如下步驟：確認對象模型，該對象模型係基於包括樣本物品之樣本內容之樣本評論及樣本關鍵字而對上述樣本評論設定樣本標籤者；確認包括對象物品之對象內容之對象評論、及上述對象物品之對象關鍵字；藉由上述對象模型，基於上述對象評論及上述對象關鍵字而對上述對象評論設定對象標籤；及提供包括上述對象評論及上述對象標籤之評論資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="696" publication-number="202620971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器模組及電子設備</chinese-title>  
        <english-title>CONNECTOR MODULE AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250502B">H01R12/71</main-classification>  
        <further-classification edition="200601120250502B">H01R13/02</further-classification>  
        <further-classification edition="200601120250502B">H01R13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立德精密工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李錦琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JINQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫正國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHENGGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬佳美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, JIAMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種連接器模組及電子設備。連接器模組包括：連接器本體、主板以及緊鎖組件。連接器本體包括第一導電端子和連接耳。連接耳沿連接器本體的第一方向向外延伸，第一導電端子與連接耳間隔設置在連接器本體的第二方向上。主板設有第一避讓缺口和電接觸位點。第一避讓缺口沿連接器本體的第三方向貫穿主板，電接觸位點與第一導電端子對應設置；連接器本體的至少部分插接在第一避讓缺口中，第一導電端子與電接觸位點抵接並導通。緊鎖組件通過連接耳在第三方向上鎖緊連接器本體和主板。本申請技術方案有效解決了傳統連接器模組與主板之間不能拆卸，整體使用成本高；且二者的整體厚度大，無法滿足厚度裝配空間較小的場景的技術問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a connector module and an electronic apparatus. The connector module includes: a connector body, a main plate and a fastening assembly. The connector body includes a first conductive terminal and a connecting sheet. The connecting sheet extends outward along the first direction of the connector body, and the first conductive terminal and the connecting sheet are separate on the second direction of the connector body. The main plate has a first avoidance opening and an electrical contact point. The first avoidance opening passes through the main plate along the third direction of the connector body, and the electrical contact point corresponds to the first conductive terminal; at least one part of the connector body is inserted into the first avoidance opening, and the first conductive terminal contacts the electrical contact point to conduct. The fastening assembly fastens the connector body and the main plate on the third direction by the connecting sheet. The present disclosure effectively solves the problem that the conventional connector module and the main plate can not be dismantled, the entire using cost of the connector module and the main plate is high, the total thickness of the conventional connector module and the main plate is thicker, and it can not meet the less mounting space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器本體</p>  
        <p type="p">110:第一導電端子</p>  
        <p type="p">120:連接耳</p>  
        <p type="p">130:第二避讓缺口</p>  
        <p type="p">140:第三避讓缺口</p>  
        <p type="p">150:第一殼體</p>  
        <p type="p">151:第一鏤空區</p>  
        <p type="p">152:第二鏤空區</p>  
        <p type="p">160:第二殼體</p>  
        <p type="p">161:第三鏤空區</p>  
        <p type="p">170:控制件</p>  
        <p type="p">180:第二導電端子</p>  
        <p type="p">200:主板</p>  
        <p type="p">210:第一避讓缺口</p>  
        <p type="p">211:第一側壁</p>  
        <p type="p">212:第二側壁</p>  
        <p type="p">213:第三側壁</p>  
        <p type="p">220:電接觸位點</p>  
        <p type="p">300:緊鎖組件</p>  
        <p type="p">310:緊固件</p>  
        <p type="p">320:鎖合件</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="697" publication-number="202620724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其動作方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250701B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250701B">G06Q10/087</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYOUNG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元燦熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, CHAN HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹知英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, JI YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊時</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUN SER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置之動作方法。動作方法可包括如下步驟：確認與物品於物流中心中之入庫作業相關之排程設定狀態為動態狀態抑或靜態狀態；於上述排程設定狀態為上述動態狀態之情形時，確認與進行上述物品之入庫作業時分配之時間槽相關之設定資訊；基於上述設定資訊而提供與上述時間槽之預約相關之UI；及考慮到用戶基於上述UI之選擇資訊來分配時間槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:區域</p>  
        <p type="p">403:區域</p>  
        <p type="p">405:區域</p>  
        <p type="p">M:識別資訊</p>  
        <p type="p">T:識別資訊</p>  
        <p type="p">T-R:識別資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="698" publication-number="202620435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探頭組件和探針卡組件</chinese-title>  
        <english-title>PROBE HEAD ASSEMBLY AND PROBE CARD ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">G01R1/06</main-classification>  
        <further-classification edition="200601120250422B">G01R1/073</further-classification>  
        <further-classification edition="202001120250422B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚書安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, SHU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃光興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUANG-SING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯凱驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, KAI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何修羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HSIOU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種探頭組件和探針卡組件。探頭組件包括探頭結構、感測器單元以及多個導電圖案。探頭組件包括第一基板、第二基板以及多個針。第一基板包括多個針孔。第二基板與第一基板間隔開且包括對應於第一基板的多個針孔的多個針孔。多個針延伸穿過第一基板的多個針孔和第二基板的多個針孔。感測器單元安裝在探頭結構上。多個導電圖案設置在探頭結構上。感測器單元通過多個導電圖案中的第一導電圖案和第二導電圖案分別電性連接至多個針中的第一針和第二針。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe head assembly and a probe card assembly are provided. The probe head assembly includes a probe head structure, a sensor unit and conductive patterns. The probe head structure includes a first substrate, a second substrate and needles. The first substrate includes needle holes. The second substrate is spaced apart from the first substrate and includes needle holes corresponding to the needle holes of the first substrate. The needles extend through the needle holes of the first substrate and the needle holes of the second substrate. The sensor unit is mounted on the probe head structure. The conductive patterns are disposed on the probe head structure. The sensor unit is electrically connected to a first needle and a second needle among the needles through a first conductive pattern and a second conductive pattern among the conductive patterns, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探頭組件</p>  
        <p type="p">110:下基板</p>  
        <p type="p">111、112、113、114、115、116:下通孔</p>  
        <p type="p">120:第一導電圖案</p>  
        <p type="p">122:第二導電圖案</p>  
        <p type="p">124:第一黏著圖案</p>  
        <p type="p">126:第二黏著圖案</p>  
        <p type="p">130:感測器單元</p>  
        <p type="p">132:感測器</p>  
        <p type="p">134、136:接觸墊</p>  
        <p type="p">140:間隔件</p>  
        <p type="p">142、157:固定元件</p>  
        <p type="p">150:上基板</p>  
        <p type="p">151、152、153、154、155、156:上通孔</p>  
        <p type="p">161、162、163、164、165:針</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="699" publication-number="202620436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針、探針卡結構及測試待測裝置的方法</chinese-title>  
        <english-title>PROBE NEEDLE, PROBE CARD STRUCTURE AND METHOD OF TESTING A DEVICE UNDER TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250508B">G01R1/067</main-classification>  
        <further-classification edition="200601120250508B">G01R1/04</further-classification>  
        <further-classification edition="202001120250508B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚書安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, SHU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃光興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUANG-SING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯凱驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, KAI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王垂堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUEI-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於測試待測裝置（DUT）的探針包括一針芯；一針塗層；以及一配置在針塗層和針芯之間的隔離層，其中在針芯的延伸方向上，隔離層延伸超過針塗層且針芯延伸超過隔離層。還提供包括具有針芯、針塗層和隔離層的探針的探針卡結構，以及使用此探針卡結構測試待測裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe needle for testing a device under test (DUT) includes a needle core; a needle coat; and an isolation layer disposed between the needle coat and the needle core, wherein in an extending direction of the needle core, the isolation layer extends exceeding the needle coat and the needle core extends exceeding the isolation layer. A probe card structure including the probe needle having a needle core; a needle coat; and an isolation layer and a method of testing a device under test using the probe card structure are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:探針</p>  
        <p type="p">410:針芯</p>  
        <p type="p">410H:針頭</p>  
        <p type="p">410T:針尖</p>  
        <p type="p">420:針塗層</p>  
        <p type="p">430:隔離層</p>  
        <p type="p">DZ:方向</p>  
        <p type="p">E410、E420、E430:延伸長度</p>  
        <p type="p">X5、X6、X7、X8:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="700" publication-number="202620745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理資訊之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250701B">G06Q20/38</main-classification>  
        <further-classification edition="201201120250701B">G06Q20/22</further-classification>  
        <further-classification edition="202301120250701B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金尚范</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金平錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, PYOG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭雄珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, WOONG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李江濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIANGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙俊峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUNFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中處理資訊之方法，其包括如下步驟：獲得第1請求；判斷是否存在與第1請求處於設定之關係之已獲得之請求；於判斷為第1請求與已獲得之第2請求處於設定之關係之情形時，確認第2請求之處理狀態資訊；及基於第2請求之處理狀態資訊來確定第1請求之處理方式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:顧客之裝置</p>  
        <p type="p">201,202,203,204,205:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="701" publication-number="202621535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張弘旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭軒呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSUAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勢輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHIH-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝包括基板、接合在基板上的半導體裝置、接合在基板上且至少部分環繞半導體裝置的熱膨脹係數(coefficient of thermal expansion, CTE)調節元件，以及配置在基板及半導體裝置之間並包封半導體裝置及CTE調節元件側面的底部填充材料，其中在溫度實質上等於或高於攝氏200度時，CTE調節元件的熱膨脹係數實質上低於底部填充材料的熱膨脹係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a substrate, a semiconductor device bonded over the substrate, a coefficient of thermal expansion (CTE) adjusting component bonded over the substrate and at least partially surrounding the semiconductor device, and an underfill material disposed between the substrate and the semiconductor device and encapsulating side surfaces of the semiconductor device and the CTE adjusting component, wherein a CTE of the CTE adjusting component is substantially lower than a CTE of the underfill material at a temperature being substantially equal to or higher than 200 Celsius.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體封裝</p>  
        <p type="p">600:基板</p>  
        <p type="p">44A,44B,44C:主體</p>  
        <p type="p">56:包封材料</p>  
        <p type="p">201:第一晶粒</p>  
        <p type="p">301:第二晶粒</p>  
        <p type="p">401:晶粒堆疊結構、半導體裝置</p>  
        <p type="p">500:堤壩結構、熱膨脹係數(CTE)調節元件</p>  
        <p type="p">510:黏著劑</p>  
        <p type="p">520:第二側</p>  
        <p type="p">530:第一側</p>  
        <p type="p">700:底部填充材料</p>  
        <p type="p">S1:接合界面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="702" publication-number="202619836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射鑽孔及切割之方法及設備</chinese-title>  
        <english-title>LASER DRILLING AND CUTTING METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260213B">B23K26/38</main-classification>  
        <further-classification edition="201401120260213B">B23K26/40</further-classification>  
        <further-classification edition="201401120260213B">B23K26/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商阿奎雷斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AQUALASE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉巴尼　阿米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RABANI, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特勒史密斯　保羅　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUTLER-SMITH, PAUL WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納斯魯拉希　瓦希德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASROLLAHI, VAHID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係關於一種用於使用一雷射光束(11)處理一晶圓(5)之方法(200)。該方法(200)包含藉由該雷射光束(11)切割該晶圓(5)之一表面。該晶圓(5)在該或各切割操作期間冷卻以減小熱負載。本揭露內容亦係關於一種用於切割一晶圓(5)之切割設備(100)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method (200) for processing a wafer (5) using a laser beam (11). The method (200) comprises cutting a surface of the wafer (5) with the laser beam (11). The wafer (5) is cooled during the or each cutting operation to reduce thermal loads. The present disclosure also relates to a cutting apparatus (100) for cutting a wafer (5).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:工件</p>  
        <p type="p">11:雷射光束</p>  
        <p type="p">100:設備</p>  
        <p type="p">101:雷射源</p>  
        <p type="p">103:工件載體</p>  
        <p type="p">105:四分之一波片</p>  
        <p type="p">107:光束調節單元</p>  
        <p type="p">109:雷射進動模組</p>  
        <p type="p">111:掃描頭</p>  
        <p type="p">113:鏡面</p>  
        <p type="p">115:透鏡</p>  
        <p type="p">121:控制單元</p>  
        <p type="p">133:成像系統</p>  
        <p type="p">143A:第一液體分散裝置</p>  
        <p type="p">145:泵</p>  
        <p type="p">153:驅動機構</p>  
        <p type="p">ASC:掃描區域</p>  
        <p type="p">X:縱向軸線</p>  
        <p type="p">Y:橫向軸線</p>  
        <p type="p">Z:豎直軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="703" publication-number="202621544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其製作方法與晶圓上晶片系統</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME AND CHIP-ON-WAFER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/10</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴杰隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIEH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳憲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言　瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KATHY WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處揭露具有虛置晶粒的半導體裝置與其製作方法。半導體裝置包括內連線結構與一或多個主動裝置貼合至內連線結構，且一或多個主動裝置經由多個導電凸塊電性連接至內連線結構。半導體裝置包括虛置晶粒經由黏著層貼合至內連線結構，其中黏著層包括晶粒貼合膜層、線路上膜層、或非導電膜層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices having dummy dies and methods of fabricating semiconductor devices with dummy dies. A semiconductor device includes an interconnect structure and one or more active devices attached to the interconnect structure, the one or more active devices being electrically connected to the interconnect structure through a plurality of conductive bumps. The semiconductor device includes a dummy die attached to the interconnect structure by an adhesive layer, wherein the adhesive layer comprises one of a die attach film (DAF) layer, a film over wire (FOW) layer, or a non-conductive film (NCF) layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:內連線結構</p>  
        <p type="p">104,106:主動裝置</p>  
        <p type="p">108:導電凸塊</p>  
        <p type="p">110:虛置晶粒</p>  
        <p type="p">112:底填層</p>  
        <p type="p">114:基板</p>  
        <p type="p">116:黏著層</p>  
        <p type="p">118:成型物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="704" publication-number="202621530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴杰隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIEH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳憲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言　瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KATHY WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體結構及其形成方法，在一些實施例中，半導體結構包含重佈線層，重佈線層包含鈍化層及導通孔。再者，半導體結構包含位於鈍化層之上的介電層以及位於導通孔之上的表面貼裝連接器。在一些實施例中，表面貼裝連接器可更位於介電層的一部分之上。此外，半導體結構包含位於表面貼裝連接器與重佈線層之間的金屬襯墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure and methods of making the same. In embodiments, the semiconductor structure includes a redistribution layer. The redistribution layer includes a passivation layer and a via. Further, the semiconductor structure includes a dielectric layer located above the passivation layer and a surface mount connector located above the via. In some embodiments, the surface mount connector may further be located above a portion of the dielectric layer. Additionally, the semiconductor structure includes a metallic liner located between the surface mount connector and the redistribution layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">102:重佈線層</p>  
        <p type="p">104,104a:鈍化層</p>  
        <p type="p">106,107:導通孔</p>  
        <p type="p">108:金屬線</p>  
        <p type="p">110:金屬襯墊</p>  
        <p type="p">114:連接器</p>  
        <p type="p">120:表面貼裝連接器</p>  
        <p type="p">126:介電層</p>  
        <p type="p">290:焊料部分</p>  
        <p type="p">700、800:半導體晶粒</p>  
        <p type="p">780、880:晶粒側接合結構</p>  
        <p type="p">910M:模塑層</p>  
        <p type="p">928:接合墊</p>  
        <p type="p">938:金屬材料</p>  
        <p type="p">940:第一焊料</p>  
        <p type="p">950:底部填充層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="705" publication-number="202620602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容筆</chinese-title>  
        <english-title>CAPACITIVE PEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F3/0354</main-classification>  
        <further-classification edition="200601120250203B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊電子科技（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN ) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YULIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈忱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧經發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JINGFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電容筆，涉及主動式電容筆技術領域。該電容筆包括筆頭、PCB板、壓力傳感組件及筆身，壓力傳感組件與PCB板通訊連接；筆身包括磁吸件及與PCB板電性連接的導電件，壓力傳感組件設置於磁吸件背離筆頭的一端，筆頭能夠通過磁吸件將壓力傳遞至壓力傳感組件，筆頭與磁吸件通過磁吸可拆卸連接，且當筆頭與磁吸件處於磁吸狀態下，筆頭與導電件電性連接。該電容筆提高了更換筆頭的效率，提升使用者體驗，簡化了結構，降低了成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a capacitive pen and relates to the technical field of active capacitive pens. The capacitive pen includes a pen head, a PCB board, a pressure sensing element and a pen body. The pressure sensing element is communicatively connected with the PCB board. The pen body includes a magnetic attraction component and a conductive component electrically connected to the PCB board. The pressure sensing element is disposed on an end of the magnetic piece facing away from the pen tip. The pen tip can transmit pressure to the pressure sensing component through the magnetic attraction component. The pen tip and the magnetic suction piece are detachably connected through magnetic suction. When the pen tip and the magnetic attraction part are in a magnetic attraction state, the pen tip and the conductive part are electrically connected. The capacitive pen improves the efficiency of replacing pen heads, improves user experience, simplifies the structure, and reduces costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:筆頭</p>  
        <p type="p">11:第一連接件</p>  
        <p type="p">111:書寫端</p>  
        <p type="p">112:連接端</p>  
        <p type="p">12:第二連接件</p>  
        <p type="p">13:導電圈</p>  
        <p type="p">14:絕緣套</p>  
        <p type="p">2:筆芯組件</p>  
        <p type="p">21:套筒</p>  
        <p type="p">211:支撐套筒</p>  
        <p type="p">212:定位套筒</p>  
        <p type="p">213:緩衝套環</p>  
        <p type="p">22:壓力感測器</p>  
        <p type="p">23:彈簧</p>  
        <p type="p">24:磁吸件</p>  
        <p type="p">25:頂桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="706" publication-number="202620603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容筆</chinese-title>  
        <english-title>CAPACITIVE PEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F3/0354</main-classification>  
        <further-classification edition="200601120250203B">G06F3/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊電子科技（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN ) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YULIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈忱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧經發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JINGFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電容筆，涉及主動式電容筆技術領域。該電容筆包括筆頭、PCB板、壓力傳感組件及筆身，筆頭包括設置於端部的第一磁吸部和第一導電部；壓力傳感組件與PCB板通訊連接；筆身包括導電件，壓力傳感組件設置於導電件背離筆頭的一端，筆頭能夠通過導電件將壓力傳遞至壓力傳感組件，導電件與PCB板電性連接，導電件朝向筆頭的端面具有第二磁吸部和第二導電部，第一磁吸部抵接於第二磁吸部以使筆頭與筆身磁吸連接，第一導電部抵接於第二導電部以使筆頭與導電件電性連接。該電容筆提高了更換筆頭的效率，提升使用者體驗，簡化了結構，降低了成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a capacitor pen, which relates to the technical field of active capacitor pens. The capacitor pen includes a pen tip, a PCB board, a pressure sensor element and a pen body. The pen tip includes a first magnetic attraction portion and a first conductive portion arranged at the end. The pressure sensor element is communicatively connected to the PCB board. The pen body includes a conductive part. The pressure sensor assembly is arranged at an end of the conductive part away from the pen tip. The pen tip can transmit pressure to the pressure sensor assembly through the conductive part. The conductive part is electrically connected to the PCB board. The end surface of the conductive part facing the pen tip has a second magnetic attraction portion and a second conductive part. The first magnetic attraction portion abuts against the second magnetic attraction portion so that the pen tip is magnetically connected to the pen body. The first conductive part abuts against the second conductive part so that the pen tip is electrically connected to the conductive part. The capacitive pen improves the efficiency of replacing the pen head, enhances the user experience, simplifies the structure and reduces the cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:筆頭</p>  
        <p type="p">11:連接件</p>  
        <p type="p">111:書寫端</p>  
        <p type="p">112:連接端</p>  
        <p type="p">12:第一磁吸件</p>  
        <p type="p">13:絕緣套</p>  
        <p type="p">2:筆芯組件</p>  
        <p type="p">21:套筒</p>  
        <p type="p">211:支撐套筒</p>  
        <p type="p">212:定位套筒</p>  
        <p type="p">213:緩衝套環</p>  
        <p type="p">22:導電件</p>  
        <p type="p">221:定位槽</p>  
        <p type="p">222:第二限位圓臺</p>  
        <p type="p">23:第二磁吸件</p>  
        <p type="p">24:導電墊片</p>  
        <p type="p">25:壓力感測器</p>  
        <p type="p">26:彈性件</p>  
        <p type="p">27:頂桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="707" publication-number="202620273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合式地板及地板組合</chinese-title>  
        <english-title>COMBINABLE FLOOR PANELS AND AN ASSEMBLY OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">E04F15/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>主原木業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUUYUAN WOODEN MFG CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種組合式地板，包括本體、至少一卡扣件、至少一潰縮結構區和膜片。潰縮結構區位於本體與卡扣件之間，潰縮結構區內設有至少一溝體，溝體具有溝底及相對溝底的溝口，溝口開設於下潰縮區表面處，溝體的長度方向依循本體端側的長度方向，溝體的深度方向依循本體的厚度方向，溝底相距下本體表面的距離大於本體的厚度的一半，膜片覆蓋貼合上本體表面、上潰縮區表面及上卡扣表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a combinable floor panel. The combinable floor panel includes a body, at least one engaging part, at least one crushable portion, and a film. The crushable portion is located between the body and the engaging part. The crushable portion includes at least one groove. The groove has a groove bottom and a groove opening opposite to the groove bottom. The groove opening is set at the lower crushable-portion surface. The length direction of the groove follows the length direction of the body end side. The depth direction of the groove follows the thickness direction of the body. The distance between the groove bottom and the lower body surface is greater than half of the thickness of the body. The film covers and is attached to the upper body surface, the upper crushable-portion surface and the upper engaging-part surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體</p>  
        <p type="p">11:上本體表面</p>  
        <p type="p">12:下本體表面</p>  
        <p type="p">13:本體側端</p>  
        <p type="p">21:上卡扣表面</p>  
        <p type="p">22:始端側</p>  
        <p type="p">23:末端側</p>  
        <p type="p">24:下卡扣表面</p>  
        <p type="p">31:上潰縮區表面</p>  
        <p type="p">32:潰縮區端側</p>  
        <p type="p">33:下潰縮區表面</p>  
        <p type="p">35:母件潰縮結構區</p>  
        <p type="p">51:槽部件</p>  
        <p type="p">52:容置槽</p>  
        <p type="p">521:槽底</p>  
        <p type="p">522:槽口</p>  
        <p type="p">523:第一槽側面</p>  
        <p type="p">524:第二槽側面</p>  
        <p type="p">53:周圍部</p>  
        <p type="p">531:第一凸緣</p>  
        <p type="p">532:第二凸緣</p>  
        <p type="p">6:溝體</p>  
        <p type="p">61:溝底</p>  
        <p type="p">62:溝口</p>  
        <p type="p">7:破裂區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="708" publication-number="202620725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以於履行之包裝流程中實行單件組合包裝之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR CONFIGURING TO PERFORM SINGULATION MULTI PACKING IN PACKING PROCESS FOR FULFILLMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250620B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250620B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250620B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣艷陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納得卡尼　耶什萬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADKARNI, YESHWANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾　阿尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYAL, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉吉　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAJI, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娥凜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種方法：於確定為在履行之包裝流程中針對複數個庫存單位實行單件組合包裝之情形時，使複數個庫存單位不移動至實行單件包裝之包裝站，而是直接移動至實行組合包裝之包裝站。&lt;br/&gt;本發明之藉由履行伺服器而實行之方法可包括如下步驟：接收單元內之複數個庫存單位之訂單；響應於訂單而產生訂單之履行中心訂單ID，履行中心訂單ID包括與複數個庫存單位相關聯之資訊；基於履行中心訂單ID，確定是否針對複數個庫存單位實行單件組合包裝；於確定為針對複數個庫存單位實行單件組合包裝之情形時，產生用於針對複數個庫存單位進行組合包裝之第1箱碼；向包裝設備發送請求，該請求係用以於第1包裝站中針對複數個庫存單位實行組合包裝者，第1包裝站使用第1箱碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p>  
        <p type="p">550:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="709" publication-number="202620726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以於訂單履行之包裝流程中實行單體分離組合包裝之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PERFORMING SINGULATION MULTI PACKING IN PACKING PROCESS FOR FULFILLMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250801B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q10/087</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣艷陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納得卡尼　耶什萬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADKARNI, YESHWANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾　阿尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYAL, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉吉　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAJI, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娥凜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種方法，其於確定為在訂單履行之包裝流程中對複數個庫存計量單位實行單體分離組合包裝之情形時，使複數個庫存計量單位不移動至實行單體分離包裝之包裝站，而是直接移動至實行組合包裝之包裝站。&lt;br/&gt;本發明之方法係藉由訂單履行伺服器而實行者，其可包括如下步驟：接收單元內之複數個庫存計量單位之訂單；響應於訂單而產生訂單之履行中心訂單ID，履行中心訂單ID包括與複數個庫存計量單位相關聯之資訊；基於履行中心訂單ID而確定是否對複數個庫存計量單位實行單體分離組合包裝；於確定為對複數個庫存計量單位實行單體分離組合包裝之情形時，針對複數個庫存計量單位而產生用於組合包裝之第1箱碼；向包裝設備發送於第1包裝站中對複數個庫存計量單位實行組合包裝之請求，第1包裝站使用第1箱碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="710" publication-number="202620828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低功率耗損的驅動電路及其降低功率耗損的操作方法</chinese-title>  
        <english-title>DRIVING CIRCUIT FOR POWER CONSUMPTION REDUCTION AND OPERATION METHOD FOR REDUCING POWER CONSUMPTION OF A DRIVING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250602B">G09G3/32</main-classification>  
        <further-classification edition="200601120250602B">G02F1/133</further-classification>  
        <further-classification edition="202001120250602B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降低功率耗損的驅動電路及其操作方法，其係適於驅動一顯示面板，其中，所述的驅動電路包括至少一運算放大器。所述的操作方法包括首先檢測並決定運算放大器之輸入電壓，並且，依據該輸入電壓提供第一操作電壓與第二操作電壓。基於該運算放大器之第一操作電壓與第二操作電壓為可調整的，並且第一操作電壓與第二操作電壓與輸入電壓有關，本發明可使得該運算放大器操作在所述第一操作電壓與第二操作電壓之間的可調變電壓區間。緣此，本發明有效地降低驅動電路的功率消耗，當應用於驅動顯示面板裝置時，可較佳地實現功耗最小化之發明功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving circuit and operation method for reducing power consumption of the driving circuit are provided. The proposed driving circuit is operable to drive a display panel and comprises at least one operational amplifier. An input voltage of the operational amplifier is examined and determined such that a first operation voltage and a second operation voltage of the operational amplifier can be provided. Since the first and second operation voltages of the operational amplifier are adjustable and can be decided associated with its input voltage, the operational amplifier is able to operate in an adaptive voltage range between the first and second operation voltages. As a result, power consumption reduction of the driving circuit can be achieved. As such, it is believed that the present invention is significantly effective in realizing power efficiency optimization result of a driving circuit when it is applied to drive a display panel device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S502:步驟</p>  
        <p type="p">S504:步驟</p>  
        <p type="p">S506:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="711" publication-number="202620727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以於訂單履行之生鮮包裝流程中實行單體分離組合包裝之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR CONFIGURING TO PERFORM SINGULATION MULTI PACKING IN FRESH PACKING PROCESS FOR FULFILLMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250701B">G06Q10/08</main-classification>  
        <further-classification edition="201201120250701B">G06Q50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣艷陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納得卡尼　耶什萬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADKARNI, YESHWANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾　阿尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYAL, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉吉　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAJI, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娥凜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種方法，於確定為對訂單履行之包裝流程中之複數個生鮮SKU實行單體分離組合包裝之情形時，使複數個生鮮SKU不移動至實行單體分離包裝之包裝站而是直接移動至實行生鮮組合包裝之包裝站。&lt;br/&gt;本發明之方法係藉由訂單履行伺服器而實行者，其可包括如下步驟：接收單元內之複數個生鮮SKU之訂單；響應於訂單，產生訂單之生鮮履行中心訂單ID(Fresh FC order ID)，上述生鮮履行中心訂單ID包括與複數個生鮮SKU相關聯之資訊；基於履行中心訂單ID，確定是否對複數個生鮮SKU實行單體分離組合包裝(Singulation Multi Packing，SMP)；於確定為對複數個生鮮SKU實行單體分離組合包裝之情形時，針對複數個生鮮SKU而產生用於生鮮組合包裝之第1箱碼；於確定為對複數個生鮮SKU實行單體分離組合包裝之情形時，針對複數個生鮮SKU而產生用於生鮮組合包裝之第1冷媒劑代碼；及向包裝設備發送於第1包裝站中對複數個生鮮SKU實行生鮮組合包裝之請求，上述第1包裝站使用第1箱碼及第1冷媒劑代碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p>  
        <p type="p">550:步驟</p>  
        <p type="p">560:步驟</p> 
      </representative-img> 
    </description> 
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  <tw-patent-application no="712" publication-number="202620750"> 
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          <doc-number>202620750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供與物品相關聯之關鍵字之方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR PROVIDING KEYWORD ASSOCIATED WITH ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>  
        <further-classification edition="201901120250701B">G06F16/31</further-classification>  
        <further-classification edition="201901120250701B">G06F16/9535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮貴洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, GUIZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電子裝置提供與物品相關聯之關鍵字之方法包括如下步驟：基於用戶之購買歷史而確認與用戶相關聯之至少一個物品；確認與至少一個物品中之第1物品對應之關鍵字集；確定關鍵字集中之將對應於第1物品而顯示於頁面中之代表關鍵字；及將包括代表關鍵字之頁面提供至用戶之終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:順序圖</p>  
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="713" publication-number="202620644"> 
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      <tif no="1" file="202620644.zip"/>
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      <isuno>10</isuno>  
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        <document-id> 
          <doc-number>202620644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>代碼識別方法及用於該方法之電子裝置</chinese-title>  
        <english-title>METHOD FOR IDENTIFYING CODE AND ELECTRONIC APPARATUS THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250703B">G06F11/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李艷鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種代碼識別方法及用於該方法之電子裝置。根據一實施例，藉由電子裝置而實行之代碼識別方法可包括如下步驟：於分析目標代碼中識別AB測試相關方法或特徵旗標相關方法之呼叫鏈；於分析目標代碼中識別相對於現有代碼而發生變更之碼區；基於變更之碼區而識別分析目標代碼之呼叫層級；及利用呼叫鏈及呼叫層級來確認變更之碼區中之不屬於AB測試相關方法或特徵旗標相關方法之範圍內的問題碼區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="714" publication-number="202620728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620728.zip"/>
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      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以於履行之生鮮包裝流程中實行單件分離多重包裝之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PERFORMING SINGULATION MULTI PACKING IN FRESH PACKING PROCESS FOR FULFILLMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251103B">G06Q10/08</main-classification>  
        <further-classification edition="201201120251103B">G06Q50/10</further-classification>  
        <further-classification edition="200601120251103B">B65D81/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣艷陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納得卡尼　耶什萬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADKARNI, YESHWANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾　阿尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYAL, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴華鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HWAJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉吉　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAJI, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娥凜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種如下之方法：於確定在履行之包裝流程中對複數個生鮮庫存單元實行單件分離多重包裝之情形時，使複數個生鮮庫存單元立即移動至實行生鮮多重包裝之包裝工位而不移動至實行單件分離包裝之包裝工位。 &lt;br/&gt;本發明之方法係藉由履行之伺服器而實行者，可包括如下步驟：接收針對格口內之複數個生鮮庫存單元之訂單；響應於訂單而產生訂單之生鮮履行中心訂單ID，生鮮履行中心訂單ID包括與複數個生鮮庫存單元相關聯之資訊；基於生鮮履行中心訂單ID，確定是否對複數個生鮮庫存單元實行單件分離多重包裝；於確定對複數個生鮮庫存單元實行單件分離多重包裝之情形時，針對複數個生鮮庫存單元產生用於生鮮多重包裝之第1箱碼；向包裝設備發送使得於第1包裝工位對複數個生鮮庫存單元實行生鮮多重包裝之請求，第1包裝工位使用第1箱碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="715" publication-number="202619874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多次分型的快拆模組結構</chinese-title>  
        <english-title>MULTIPLE TIMES DIVISION QUICKLY DISASSEMBLED MODULE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B29C33/30</main-classification>  
        <further-classification edition="200601120250325B">B21D37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸新林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬模具技術領域，公開了一種多次分型的快拆模組結構，包括模板組件、模組單元和第一連接件，模板組件包括層疊設置的多個模板，模板組件設有貫穿多個模板的模框孔，模框孔的孔徑沿多個模板的層疊方向從上到下依次遞減並形成多個階梯；模組單元的外徑沿層疊方向從上到下依次遞減並形成多個台階；當模組單元安裝於模框孔內時，多個台階分別支撐於多個階梯上，多個第一連接件貫穿模組單元並連接於多個階梯。本申請可以整體安裝和拆卸每個模框孔內的模組單元，進而實現了單穴產品單穴拆裝，模組單元拆裝時無需拆裝模板組件，利於降低拆裝難度和維護成本，提高維護效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention belongs to the technical field of molds and discloses a multiple times division quickly disassembled module structure, which comprises a template assembly, a module unit and a first connecting piece. The template assembly comprises a plurality of templates arranged in a stack, and the template assembly is disposed with a mold frame holes through multiple templates, apertures of the mold frame holes decrease from top to bottom along stacking direction of the multiple templates and form multiple steps. The outer diameter of the module unit decreases from top to bottom along the stacking direction and form multiple steps. When the module unit is installed in the mold frame hole, the plurality of steps are respectively supported on the plurality of steps, and the plurality of first connecting pieces penetrate the module unit and are connected to the plurality of steps. The invention can integrally install and disassemble the module unit in each mold frame hole, and further realize the disassembly and assembly of single-cavity products. The module unit is disassembled and assembled without disassembling and assembling template components, which is beneficial to reducing the difficulty of disassembly and assembly and maintenance costs, and improving maintenance efficiency. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:模板組件</p>  
        <p type="p">2:模組單元</p>  
        <p type="p">3:第一連接件</p>  
        <p type="p">4:第二連接件</p>  
        <p type="p">5:吊環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="716" publication-number="202620976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器</chinese-title>  
        <english-title>CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01R13/40</main-classification>  
        <further-classification edition="200601120250203B">H01R13/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立德精密工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王元坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUANKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬佳美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, JIAMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種連接器，包括：絕緣座，包括在第一方向上相對設置的第一端和第二端，絕緣座的第一端設置有插口，絕緣座的第二端設置有開口，絕緣座上設置有用於安裝導電端子的容置腔；蓋板，蓋板上設置有遮光部，遮光部與開口連接；其中，遮光部蓋合於開口上，且蓋板蓋合於容置腔上，以遮住從插口經容置腔和開口洩漏出來的光線。由於遮光部蓋合於開口上，蓋板蓋合於容置腔上，因此能夠遮住從插口經容置腔和開口洩漏出來的光線，當電子設備在夜晚進行充電或者與其他電子設備進行數據交換時，避免燈光洩露到連接器的外部，提升了用戶的使用體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a connector including: an insulating base and a cover plate. The insulating base includes a first end and a second end arranged opposite to each other in a first direction. The first end is provided with a socket, while the second end is provided with an opening. The insulating base is also configured with a housing cavity for mounting conductive terminals. The cover plate includes a light-shielding section connected to the opening. The light-shielding section covers the opening, and the cover plate covers the housing cavity, thereby blocking light that would otherwise leak from the socket through the housing cavity and the opening. By having the light-shielding section cover the opening and the cover plate cover the housing cavity, the structure effectively prevents light from leaking out of the connector when an electronic device is charging or exchanging data with other electronic devices at night. This improves the user experience by avoiding unwanted light leakage to the exterior of the connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣座</p>  
        <p type="p">2:導電端子</p>  
        <p type="p">3:蓋板</p>  
        <p type="p">11:限位台</p>  
        <p type="p">31:遮光部</p>  
        <p type="p">101:第一端</p>  
        <p type="p">102:第二端</p>  
        <p type="p">104:開口</p>  
        <p type="p">105:容置腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="717" publication-number="202621336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250330B">H10H29/855</main-classification>  
        <further-classification edition="202501120250330B">H10H29/856</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, I-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開一種電子裝置，包括一第一基板、一電路層、至少一電子單元、一第二基板、一反射層以及一光學層。電路層設置於第一基板上；電子單元設置於第一基板之上、且與電路層電性連接；第二基板相對於第一基板設置、且包括至少一透光區與至少一反光區，透光區相鄰於反光區，且透光區對應於電子單元設置；反射層設置於第二基板鄰近第一基板的一側、且對應於反光區設置；光學層設置於第二基板與電子單元之間、且至少對應於透光區設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an electronic device, which includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer and an optical layer. The circuit layer is disposed on the first substrate. The electronic unit is disposed above the first substrate and electrically connected to the circuit layer. The second substrate is disposed opposite to the first substrate and includes at least one light transmission area and at least one light reflection area. The light transmission area is located next to the light reflection area, and the light transmission area is arranged corresponding to the electronic unit. The reflective layer is disposed at one side of the second substrate close to the first substrate, and is located corresponding to the light reflection area. The optical layer is disposed between the second substrate and the electronic unit, and is located at least corresponding to the light transmission area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:電路層</p>  
        <p type="p">13:電子單元</p>  
        <p type="p">131,132,133:發光元件</p>  
        <p type="p">14:第二基板</p>  
        <p type="p">141:透光區</p>  
        <p type="p">142:反光區</p>  
        <p type="p">15:反射層</p>  
        <p type="p">16:光學層</p>  
        <p type="p">17:中介層</p>  
        <p type="p">18:吸光層</p>  
        <p type="p">L1,L2:環境光</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="718" publication-number="202620754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料更新方法及實行該方法之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR DATA UPDATING AND ELECTRONIC APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250701B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭雄珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, WOONG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴尚勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種資料更新方法，其包括如下步驟：自作業人員終端獲得包括目標物品資訊及動作資訊之資料更新資訊；基於上述資料更新資訊來確認一個以上之更新請求資訊；確認與資料更新相關之作業設定資訊；及向目標伺服器傳輸上述一個以上之更新請求資訊；且基於上述一個以上之更新請求資訊來更新與至少一個目標物品相關之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S250:步驟</p>  
        <p type="p">S270:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="719" publication-number="202621348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種使用SiOC拓撲絕緣體的自旋電流產生裝置及其製造方法</chinese-title>  
        <english-title>SPIN CURRENT DEVICE USING SIOC TOPOLOGICAL INSULATOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10N50/20</main-classification>  
        <further-classification edition="202301120260223B">H10N50/85</further-classification>  
        <further-classification edition="202501120260223B">H10D64/68</further-classification>  
        <further-classification edition="202601120260223B">H10W40/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商拓撲的諾貝爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TINOBEL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳代萊莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, TERESA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種使用SiOC拓撲絕緣體的自旋電流產生裝置及其製造方法，根據本發明的使用SiOC拓撲絕緣體的自旋電流產生裝置，包括：基板200；柵極303，設置在所述基板200上；柵極絕緣膜100，設置在所述基板200和所述柵極303上；源極301，設置在所述柵極絕緣膜100上；及漏極302，設置在所述柵極絕緣膜100上；其中，所述柵極絕緣膜100由SiOC拓撲絕緣體構成，其介電常數為0.01至2.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:柵極絕緣膜</p>  
        <p type="p">200:基板</p>  
        <p type="p">301:源極</p>  
        <p type="p">302:漏極</p>  
        <p type="p">303:柵極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="720" publication-number="202621130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>揚聲器殼體及揚聲器</chinese-title>  
        <english-title>SPEAKER HOUSING AND SPEAKER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250211B">H04R1/02</main-classification>  
        <further-classification edition="200601120250211B">H04R5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美特科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱嘉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JIAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅明亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, MINGYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於揚聲器技術領域，公開了一種揚聲器殼體及揚聲器。揚聲器殼體包括一體成型的外殼和導音結構；外殼設置有裝配腔和安裝口，裝配腔通過安裝口連通於外部，發聲單元能夠通過安裝口伸入裝配腔中；導音結構設置有前腔、出音口和作業口，前腔通過出音口連通於外部，並通過作業口連通於裝配腔，發聲單元安裝於裝配腔中時，封蓋作業口。揚聲器採用上述的揚聲器殼體，結構簡單，降低了組裝技術難度和製造成本，並提高了生產效率，具有良好的實用性和可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention belongs to the technical field of speaker, and discloses a speaker housing and a speaker. The speaker housing includes an integrally formed shell and a sound guide structure. The shell is provided with an assembly cavity and an installation port. The assembly cavity is connected to the outside through the installation port. The sound-emitting unit can extend into the assembly cavity through the installation port. The sound guide structure is provided with a front cavity, a sound outlet and an operating port. The front cavity is connected to the outside through the sound outlet, and is connected to the assembly cavity through the operating port. When the sound-emitting unit is installed in the assembly cavity, the operating port is sealed. The speaker adopts the above-mentioned speaker housing, has a simple structure, reduces the difficulty of the assembly process and the manufacturing cost, and improves the production efficiency, and has good practicality and reliability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外殼</p>  
        <p type="p">12:安裝口</p>  
        <p type="p">22:出音口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="721" publication-number="202619664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋風式吸塵系統及清潔機器人及吸塵方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250331B">A47L11/24</main-classification>  
        <further-classification edition="200601120250331B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商佛山市格林盈璐電器科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周生方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種旋風式吸塵系統及清潔機器人及吸塵方法，吸塵系統包括吸塵口、集塵盒、分離器與負壓發生器，其分離器能夠形成螺旋風流，利用離心力將垃圾從風流中分離出來並收集在集塵盒，從而可替代濾網組件，降低使用成本。並且，加速引導面能夠加快螺旋風流的流速，致使垃圾獲得更大的離心力，更快速、更充分的從分離口脫離，進一步提高垃圾分離效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:吸塵系統</p>  
        <p type="p">1:集塵盒</p>  
        <p type="p">2:分離器</p>  
        <p type="p">2a:進風口</p>  
        <p type="p">2b:出風口</p>  
        <p type="p">22:分離口</p>  
        <p type="p">3:負壓發生器</p>  
        <p type="p">4:吸塵口</p>  
        <p type="p">5:第一管道</p>  
        <p type="p">6:第二管道</p>  
        <p type="p">200:底盤</p>  
        <p type="p">210:滾筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="722" publication-number="202621191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調光控制系統、調光控制裝置、控制晶片及調光控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">H05B45/325</main-classification>  
        <further-classification edition="201601120250401B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及調光控制系統、調光控制裝置、控制晶片及調光控制方法。調光控制系統包括：功率開關，基於開關控制信號而導通或關斷以控制對於燈具的供電；以及控制晶片，生成開關控制信號，其中控制晶片包括：調光控制模組，被配置為基於針對燈具的調光信號生成調光控制信號，其中開關控制信號基於調光控制信號而產生，並且其中在調光信號的開通階段的時間大於等於預設時間的情況下，在調光信號的關斷階段，調光控制信號與調光信號一致地關斷，開關控制信號同步關斷；在調光信號的開通階段的時間小於預設時間的情況下，在調光信號的關斷階段，調光控制信號相對於調光信號延遲開關控制信號的至少一個週期才關斷，開關控制信號繼續至少一個週期後關斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:調光系統</p>  
        <p type="p">301:輸入部分</p>  
        <p type="p">302:控制部分</p>  
        <p type="p">302-1:穩壓模組</p>  
        <p type="p">302-2:PWM檢測模組</p>  
        <p type="p">302-3:MPRT控制模組</p>  
        <p type="p">302-4:電流控制模組</p>  
        <p type="p">302-5:回饋模組</p>  
        <p type="p">302-6:控制邏輯模組</p>  
        <p type="p">303:輸出部分</p>  
        <p type="p">C1:輸入電容</p>  
        <p type="p">C2:第二電容</p>  
        <p type="p">C3:輸出電容</p>  
        <p type="p">CLK:時鐘信號</p>  
        <p type="p">CMP:比較端子(信號)</p>  
        <p type="p">cmp1:第一比較器</p>  
        <p type="p">cmp2:第二比較器</p>  
        <p type="p">CS:採樣端子</p>  
        <p type="p">CS_amp:放大器</p>  
        <p type="p">D1:續流二極體</p>  
        <p type="p">DHC:回饋信號</p>  
        <p type="p">Driver:驅動器</p>  
        <p type="p">EA:誤差放大器</p>  
        <p type="p">EA_ref:內部參考電壓</p>  
        <p type="p">ENA:使能端子</p>  
        <p type="p">GATE:控制端子(開關控制信號)</p>  
        <p type="p">GND:接地端子</p>  
        <p type="p">ISET:電流設置端子</p>  
        <p type="p">L1:電感</p>  
        <p type="p">LDO:穩壓器</p>  
        <p type="p">LED:發光二極體</p>  
        <p type="p">LED1-LEDX:LED端子</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">MPRT_out:MPRT控制信號輸出</p>  
        <p type="p">OSC:振盪器</p>  
        <p type="p">PWM:脈衝寬度調變</p>  
        <p type="p">PWM_in:PWM調光信號</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">Ramp:升降信號</p>  
        <p type="p">S:選擇器</p>  
        <p type="p">U:控制晶片</p>  
        <p type="p">UVLO:欠壓保護器</p>  
        <p type="p">VCC:晶片內部低壓電源</p>  
        <p type="p">VIN:輸入電壓(端子)</p>  
        <p type="p">Vout:輸出電壓</p>  
        <p type="p">Vref&amp;amp;Iref:基準電壓/電流源</p>  
        <p type="p">Vref:基準電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="723" publication-number="202621313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無閘極之連接單元及其製造方法</chinese-title>  
        <english-title>TAP CELLS WITHOUT GATE AND METHODS OF FABRICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D89/10</main-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification>  
        <further-classification edition="202501120260223B">H10D62/13</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202501120260223B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊松鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣振劼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯誌欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHIH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種無閘極連接單元及其製造方法。本揭露的實施例提供了一種包含無閘極結構的拾取元件（例如連接單元）的半導體裝置及其形成方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a semiconductor device including pick-up components, such as TAP cells, without gate structures and methods for forming the semiconductor devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:積體電路佈局、積體設計</p>  
        <p type="p">202:連接區域</p>  
        <p type="p">202h:水平區段</p>  
        <p type="p">202v:垂直區段</p>  
        <p type="p">204:功能單元</p>  
        <p type="p">204b:單元邊界</p>  
        <p type="p">220:連接單元</p>  
        <p type="p">222:主動區域</p>  
        <p type="p">224、226、228:接觸件特徵</p>  
        <p type="p">240:電晶體</p>  
        <p type="p">241:鰭結構</p>  
        <p type="p">242:主動區域</p>  
        <p type="p">244:閘極結構</p>  
        <p type="p">246:源極/汲極接觸件</p>  
        <p type="p">248:閘極接觸件</p>  
        <p type="p">250:接觸件過孔</p>  
        <p type="p">260:虛擬連接單元</p>  
        <p type="p">262:主動區域</p>  
        <p type="p">264、266、268:導電特徵</p>  
        <p type="p">W202v、W202h:寬度</p>  
        <p type="p">L220v:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="724" publication-number="202620729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理退回物品之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR MANAGING FORWARDING ITEM AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250801B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q10/30</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/01</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/016</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250801B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金德誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DUCK SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭形旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HYEONG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俊浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁正賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JEONG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本文所揭示之實施例，電子裝置之退回物品管理方法可包括如下步驟：確認退回候選物品；確認退回候選物品之錯誤確認資訊；基於上述錯誤確認資訊而將上述退回候選物品確認為退回目標物品；確認上述退回目標物品之退回資訊；及將上述退回資訊傳輸至退回相關伺服器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器設備</p>  
        <p type="p">200:用戶設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="725" publication-number="202621004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線充電裝置</chinese-title>  
        <english-title>WIRELESS CHARGING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">H02J50/50</main-classification>  
        <further-classification edition="201601120250501B">H02J50/90</further-classification>  
        <further-classification edition="201601120250501B">H02J50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳和諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HE YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線充電裝置，包括一殼體、一無線充電模組、以及一封閉機構，殼體上具有一置放面與複數通氣孔，且殼體內具有一安裝空間並與置放面相鄰相對，無線充電模組設於安裝空間內以相對於置放面，而各通氣孔則排列於置放面的周圍處，封閉機構設於殼體內並具有一連接部件、以及設於連接部件上的複數封閉塞件，各封閉塞件分別對應於各通氣孔，且連接部件能朝向置放面作相對移動而使各封閉塞件分別對各通氣孔作封閉或開啟。如此，可於充電時才使各封閉塞件將各通氣孔開啟而供空氣流通並提供散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless charging device having a shell, a wireless charging module, and a closed mechanism is provided. The shell has a placement surface and a plurality of airholes and defines a mounting space therein opposite to the placement surface. The wireless charging module is arranged in the mounting space to be opposite to the placement surface. The airholes are arranged around the placement surface. The closed mechanism is arranged in the shell and has a connecting assembly and a plurality of closed plugs arranged on the connecting assembly. The closed plugs are respectively corresponding to the airholes. The connecting assembly is configured to move relative to the placement surface such that the closed plugs closed or open the airholes. The wireless charging device is therefore opening the airholes by the closed plugs to allow air to flow and heat to dissipate during charging.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:無線充電裝置</p>  
        <p type="p">10:殼體</p>  
        <p type="p">101:置放台</p>  
        <p type="p">101a:置放面</p>  
        <p type="p">101b:安裝空間</p>  
        <p type="p">102:通氣孔</p>  
        <p type="p">103:排氣孔</p>  
        <p type="p">104:凹部</p>  
        <p type="p">104a:擋部</p>  
        <p type="p">11:無線充電模組</p>  
        <p type="p">12:封閉機構</p>  
        <p type="p">120:連接部件</p>  
        <p type="p">120a:封閉塞件</p>  
        <p type="p">121:觸動組件</p>  
        <p type="p">121a:觸發部件</p>  
        <p type="p">121b:作動部件</p>  
        <p type="p">13:風扇</p>  
        <p type="p">2:止滑結構</p>  
        <p type="p">20:墊體</p>  
        <p type="p">21:止滑突部</p>  
        <p type="p">22:進氣孔</p>  
        <p type="p">220:通道</p>  
        <p type="p">3:行動裝置</p>  
        <p type="p">30:攝影模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="726" publication-number="202620414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於使用一條件屏蔽自動編碼器之缺陷偵測的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR DEFECT DETECTION USING A CONDITIONAL MASKED AUTOENCODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01N21/88</main-classification>  
        <further-classification edition="200601120260223B">G01N21/95</further-classification>  
        <further-classification edition="201701120260223B">G06T7/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="202301120260223B">G06N3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦特拉斯　亞力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATRAS, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方浩任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, HAWREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉凡法　莫哈瑪卓拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVANFAR, MOHAMMADREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於缺陷偵測之方法，其包含接收一樣本之一光學影像及分割該經接收光學影像，包含複數個影像塊。該方法包含藉由基於特性化資料選擇性屏蔽該等影像塊來產生一屏蔽光學影像。該方法包含將該屏蔽光學影像提供至一第一編碼器。該方法包含接收一設計影像且將其提供至一第二編碼器。該方法包含使用該第一編碼器產生一第一組特徵向量且使用該第二編碼器產生一第二組特徵向量。該方法包含串接來自該第一編碼器之該等特徵向量及來自該第二編碼器之該等特徵向量且使用一解碼器基於該等經串接特徵向量產生該樣本之一參考影像，其中該經產生參考影像係該光學影像及該設計影像之一經重建影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for defect detection includes receiving an optical image of a sample and dividing the received optical image include a plurality of image patches. The method includes generating a masked optical image by selectively masking the image patches based on characterization data. The method includes providing the masked optical image to a fist encoder. The method includes receiving a design image and providing it to a second encoder. The method includes generating a first set of feature vectors using the first encoder and generating a second set of feature vectors using the second encoder. The method includes concatenating the feature vectors from the first encoder and the feature vectors from the second encoder and generating a reference image of the sample based on the concatenated feature vectors using a decoder, where the generated reference image is a reconstructed image of the optical image and the design image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302:步驟</p>  
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p>  
        <p type="p">410:步驟</p>  
        <p type="p">412:步驟</p>  
        <p type="p">414:步驟</p>  
        <p type="p">416:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="727" publication-number="202621031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容載諧振轉換器</chinese-title>  
        <english-title>LOAD TOLERANT RESONANT CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260209B">H02M7/48</main-classification>  
        <further-classification edition="200601120260209B">H02M3/00</further-classification>  
        <further-classification edition="200601120260209B">H02M7/523</further-classification>  
        <further-classification edition="200601120260209B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商普羅卓夫科技創新服務有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲利帕　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHILIPPART, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梵亞克　伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN ARK, BART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾克赫伊斯坦克　伊昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLKHUIS TANKE, ION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種諧振轉換器(100)包括一直流輸入(111)、一交流輸出(161、162)、一切換區段(120)及一諧振器區段(130)。該切換區段包括一對切換裝置(M&lt;sub&gt;1&lt;/sub&gt;、M&lt;sub&gt;2&lt;/sub&gt;)，配置成將一第一電壓節點(112)及一第二電壓節點(113)在一切換頻率下交替地連接至一共享節點(114)。該諧振器區段包括耦接至一第二諧振器網路(150)之一第一諧振器網路(140)，該二者包括一LC諧振電路。該第二諧振器網路包括一電感器(L&lt;sub&gt;3&lt;/sub&gt;)及一電容器(C&lt;sub&gt;3&lt;/sub&gt;)。該電感器之一端子係連接至該第一或第二電壓節點，且該電容器(C&lt;sub&gt;3&lt;/sub&gt;)係連接成，使得在藉該等切換裝置看到之一奇模阻抗的一等效電路中，該電容器分路該交流輸出。該第一諧振器網路(140)及該第二諧振器網路(150)被調諧，以界定出在該切換頻率下及該切換頻率之一第三諧波頻率下跨該對切換裝置之一電壓波形的奇次頻率成分，及短路在該切換頻率之一第二諧波頻率下藉該對切換裝置看到之一偶模阻抗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resonant converter (100) comprises a DC input (111), an AC output (161, 162), a switching section (120) and a resonator section (130). The switching section comprises a pair of switch devices (M1, M2) configured to alternatingly connect a first voltage node (112) and a second voltage node (113) to a shared node (114) at a switching frequency. The resonator section comprises a first resonator network (140) coupled to a second resonator network (150), both comprising a LC tank circuit. The second resonator network comprises an inductor (L&lt;sub&gt;3&lt;/sub&gt;) and a capacitor (C&lt;sub&gt;3&lt;/sub&gt;). A terminal of the inductor is connected to the first or second voltage node and the capacitor (C&lt;sub&gt;3&lt;/sub&gt;) is connected such that in an equivalent electric circuit of an odd mode impedance seen by the switch devices the capacitor shunts the AC output. The first resonator network (140) and the second resonator network (150) are tuned to define odd frequency components of a voltage waveform across the pair of switch devices at the switching frequency and at a third harmonic frequency of the switching frequency, and to short an even mode impedance seen by the pair of switch devices at a second harmonic frequency of the switching frequency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:諧振轉換器</p>  
        <p type="p">104:負載</p>  
        <p type="p">111:輸入</p>  
        <p type="p">112:電壓節點</p>  
        <p type="p">113:電壓節點</p>  
        <p type="p">114:共享節點</p>  
        <p type="p">120:切換區段</p>  
        <p type="p">130:諧振器區段</p>  
        <p type="p">140:第一諧振器網路</p>  
        <p type="p">141:接地</p>  
        <p type="p">142:串聯電路</p>  
        <p type="p">143:中心，中點節點</p>  
        <p type="p">144:T形網路</p>  
        <p type="p">145:中心，中點節點</p>  
        <p type="p">150:第二諧振器網路</p>  
        <p type="p">151:輸出節點</p>  
        <p type="p">152:輸出節點</p>  
        <p type="p">160:輸出區段</p>  
        <p type="p">161:輸出端子</p>  
        <p type="p">162:輸出端子</p>  
        <p type="p">163:中心分接頭</p>  
        <p type="p">165:一次繞組</p>  
        <p type="p">166:二次繞組</p>  
        <p type="p">167:變壓器</p>  
        <p type="p">168:接地</p>  
        <p type="p">170:控制單元</p>  
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;:電容器</p>  
        <p type="p">C&lt;sub&gt;3&lt;/sub&gt;:輸出電容器</p>  
        <p type="p">C&lt;sub&gt;shunt&lt;/sub&gt;:分路電容器</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:第一電感器</p>  
        <p type="p">L&lt;sub&gt;3&lt;/sub&gt;:第二電感器</p>  
        <p type="p">I&lt;sub&gt;d1&lt;/sub&gt;:汲極電流</p>  
        <p type="p">I&lt;sub&gt;d2&lt;/sub&gt;:汲極電流</p>  
        <p type="p">M&lt;sub&gt;1&lt;/sub&gt;:切換裝置</p>  
        <p type="p">M&lt;sub&gt;2&lt;/sub&gt;:切換裝置</p>  
        <p type="p">P&lt;sub&gt;load&lt;/sub&gt;:交流功率</p>  
        <p type="p">V&lt;sub&gt;ds1&lt;/sub&gt;:汲極-源極電壓</p>  
        <p type="p">V&lt;sub&gt;ds2&lt;/sub&gt;:汲極-源極電壓</p>  
        <p type="p">v&lt;sub&gt;g1&lt;/sub&gt;:閘極電壓</p>  
        <p type="p">v&lt;sub&gt;g2&lt;/sub&gt;:閘極電壓</p>  
        <p type="p">Z&lt;sub&gt;load&lt;/sub&gt;:阻抗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="728" publication-number="202620779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於運動估計與補償的影像處理方法、視訊處理器及系統</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD, VIDEO PROCESSOR AND DISPLAY SYSTEM FOR PERFORMING MEMC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250303B">G06T7/20</main-classification>  
        <further-classification edition="200601120250303B">H04N5/262</further-classification>  
        <further-classification edition="200601120250303B">G09G5/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張允揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥菘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIH-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像處理方法，用來使一視訊處理器產生一插補幀，該影像處理方法包含有下列步驟：從一主處理器或一顯示驅動電路接收一觸控資訊；根據該觸控資訊，藉由執行運動估計來找出至少一運動向量；以及利用該至少一運動向量來建構該插補幀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image processing method for a video processor to generate an interpolated frame includes steps of: receiving a touch information from a host processor or a display driver circuit; finding at least one motion vector (MV) by performing motion estimation according to the touch information; and constructing the interpolated frame by using the at least one MV.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:影像處理流程</p>  
        <p type="p">502~506:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="729" publication-number="202619910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電纜護線套及其充電槍</chinese-title>  
        <english-title>CABLE SHEATH AND CHARGE GUN THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251002B">B60L53/16</main-classification>  
        <further-classification edition="200601120251002B">H02G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭兆鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案關於一種電纜護線套及其充電槍，電纜護線套包含內部件及外部件，內部件包含第一卡合部、第二卡合部及兩個第一簍空部，第一卡合部具有第一穿設部，第一穿設部的中心具有第一軸心線，第二卡合部具有第二穿設部，第二穿設部的中心具有第二軸心線，第二軸心線與第一軸心線之間具有夾角，夾角小於170度，第一簍空部位於第一卡合部及第二卡合部之間的連接處，穿設於內部件的壁面，第一簍空部於第一卡合部朝向第二卡合部的方向上具有寬度，外部件包含壁面、第三穿設部及第二簍空部，第三穿設部穿設於外部件的軸向方向，第二簍空部穿設於壁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure discloses a cable sheath and a charge gun. The cable sheath includes an internal component and an external component. The internal component includes a first engagement portion, a second engagement portion and two first hollow portions. The first engagement portion includes a first through-hole. The center of the first engagement portion includes a first axis. The second engagement portion includes a second through-hole. The center of the second through-hole includes a second axis. An angle is formed between the first axis and the second axis. The angle is less than 170 degrees. The two first hollow portions are located at the connection between the first engagement portion and second engagement portion, and pass through the wall of the internal component. Each first hollow portion includes a width in the direction from the first engagement portion toward the second engagement portion. The external component includes a wall, a third through-hole and a second hollow portion. The third through-hole is extended in the axial direction of the external component. The second hollow portion passes through the wall.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電纜護線套</p>  
        <p type="p">4:內部件</p>  
        <p type="p">41:第一卡合部</p>  
        <p type="p">411:外環突出部</p>  
        <p type="p">412:第一穿設部</p>  
        <p type="p">X1:第一軸心線</p>  
        <p type="p">42:第二卡合部</p>  
        <p type="p">X2:第二軸心線</p>  
        <p type="p">A:夾角</p>  
        <p type="p">422:防水圈</p>  
        <p type="p">422a:凹部</p>  
        <p type="p">43:第一簍空部</p>  
        <p type="p">B:第一寬度</p>  
        <p type="p">44:連接部</p>  
        <p type="p">5:外部件</p>  
        <p type="p">51:壁面</p>  
        <p type="p">52:第三穿設部</p>  
        <p type="p">53:第二簍空部</p>  
        <p type="p">X3:第三軸心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="730" publication-number="202621269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260213B">H10D30/01</main-classification>  
        <further-classification edition="202501120260213B">H10D30/43</further-classification>  
        <further-classification edition="202501120260213B">H10D30/67</further-classification>  
        <further-classification edition="202501120260213B">H10D62/10</further-classification>  
        <further-classification edition="202501120260213B">H10D64/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昀昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊芷欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王茂南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MAO-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUAN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施養鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YANG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種半導體結構。所述半導體結構包括基板，所述基板具有電路區、密封環區圍繞電路區、以及切割通道圍繞密封環區，其中切割通道包括第一切割區以及第二切割區設置在第一切割區的兩側上；複數個第一主動區形成在電路區中；複數個第一閘極堆疊形成在電路區中的第一主動區上，第一閘極堆疊包括複數個金屬電極；複數個第二主動區形成在第一切割區中；複數個介電結構形成在第一切割區中的第二主動區上；以及複數個第二閘極堆疊形成在第二切割區中的隔離部件上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure that includes a substrate having a circuit region and a seal ring region surrounding the circuit region, and a dicing lane surrounding the seal ring region, wherein the dicing lane includes a first dicing region and a second dicing region disposed on both sides of the first dicing region; first active regions formed in the circuit region; first gate stacks formed on the first active region in the circuit region, the first gate stacks including metal electrodes; second active regions formed in the first dicing region; dielectric structures formed on the second active regions in the first dicing region; and second gate stacks formed on an isolation feature in the second dicing region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">102:電路區</p>  
        <p type="p">104:密封環區</p>  
        <p type="p">106:切割區</p>  
        <p type="p">108:保護環壁區</p>  
        <p type="p">110:邊界區</p>  
        <p type="p">112:主動區</p>  
        <p type="p">114:閘極堆疊</p>  
        <p type="p">116:第一窗口部分</p>  
        <p type="p">118:第二窗口部分</p>  
        <p type="p">120:第三窗口部分</p>  
        <p type="p">122:第四窗口部分</p>  
        <p type="p">A,B,C,D:角隅</p>  
        <p type="p">AB,BC,CD,AD:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="731" publication-number="202620588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制把手及連接器組件</chinese-title>  
        <english-title>CONTROL HANDLE AND CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G06F1/16</main-classification>  
        <further-classification edition="200601120250502B">G06F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧賀隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉奕辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種控制把手及連接器組件。控制把手包含：兩個把手部、一支撐部及一連接器組件。兩個把手部分別設置有多個操作構件，各個操作構件用以提供使用者操作，以對應產生一控制訊號；支撐部的兩端與兩個把手部連接，控制把手用以固持一電子裝置；連接器組件包含；至少兩個不同類型的連接器，其分別可活動地設置於其中一個把手部；各個連接器能被操作，以突出於把手部的內側；突出於把手部的內側的連接器，用以與被控制把手固持的電子裝置的對接連接器相互插接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a control handle and a connector assembly. The control handle comprises: two handle portions, a support portion, and a connector assembly. Each of the two handle portions is provided with a plurality of operating components, which are used to allow the user to operate the handle and generate a control signal. The two ends of the support portion are connected to the two handle portions, and the control handle is used to secure an electronic device. The connector assembly comprises at least two different types of connectors, which are movably disposed within one of the handle portions. Each connector can be operated to protrude from the inner side of the handle portion. The connector protruding from the inner side of the handle portion is used to engage and connect with the mating connector of the electronic device held by the controlled handle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:把手部</p>  
        <p type="p">10:操作構件</p>  
        <p type="p">12:開口</p>  
        <p type="p">2:支撐部</p>  
        <p type="p">3:連接器組件</p>  
        <p type="p">30:本體</p>  
        <p type="p">31:第一連接器</p>  
        <p type="p">32:第二連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="732" publication-number="202620731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法及用於該方法之電子裝置</chinese-title>  
        <english-title>INFORMATION PROCESSING METHOD AND ELECTRONIC DEVICE THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q10/087</main-classification>  
        <further-classification edition="202401120250801B">G06Q10/083</further-classification>  
        <further-classification edition="202301120250801B">G06Q10/0631</further-classification>  
        <further-classification edition="201901120250801B">G06F16/955</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金德誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DUCK SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭形旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HYEONG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俊浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁正賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JEONG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置之資訊處理方法。具體而言，電子裝置之資訊處理方法可包括如下步驟：確認配送至物流中心之物品之錯誤受理資訊；將用以輸入物品之詳細錯誤資訊之頁面提供至作業人員之終端；及基於錯誤受理資訊及藉由頁面而獲得之詳細錯誤資訊中之至少一部分，產生與物品之退貨作業相關之報告資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="733" publication-number="202620796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可讀性預測裝置及方法</chinese-title>  
        <english-title>TEXT READABILITY PREDICTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">G06V10/82</main-classification>  
        <further-classification edition="202001120250303B">G06F40/00</further-classification>  
        <further-classification edition="202001120250303B">G06F40/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾厚強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HOU-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋曜廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YAO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BERLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳婕瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEH-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可讀性預測裝置及方法，該可讀性預測裝置自一待判斷資料分割出一圖片及對應該圖片之一文本。可讀性預測裝置傳送一提示、該圖片及對應該圖片之該文本至至少一多模態大型語言模型，以產生對應該圖片之一圖片語意。可讀性預測裝置傳送一可讀性特徵至一可讀性模型，以預測對應該待判斷資料之一可讀性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A text readability prediction device and method are provided. The text readability prediction device segments a picture and a text corresponding to the picture from a data to be determined. The text readability prediction device sends a prompt, the picture and the text corresponding to the picture to at least one multimodal large language model to generate a picture semantic corresponding to the picture. The text readability prediction device sends a readability feature to a readability model to predict a readability of the data to be determined.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:可讀性預測方法</p>  
        <p type="p">S501、S503、S505:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="734" publication-number="202621001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有功率切換的無線充電模組及其控制方法</chinese-title>  
        <english-title>POWER SWITCHABLE WIRELESS CHARGING MODULE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260223B">H02J50/10</main-classification>  
        <further-classification edition="201601120260223B">H02J50/00</further-classification>  
        <further-classification edition="202601120260223B">H02J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓欣霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HSIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, RI-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒲仲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PWU, JONG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種具有功率切換的無線充電模組及其控制方法，此無線充電模組包括充電座及無線充電盤，充電座包含座體及第一連接器，座體具有安置區，第一連接器裸露於安置區；無線充電盤可組卸式設置於安置區，無線充電盤包含控制器單元及第二連接器，控制器單元與第二連接器電性連接，第一連接器與第二連接器對接或分離；其中，控制器單元偵測到第一連接器與第二連接器分離時，控制無線充電盤輸出第一充電功率，控制器單元偵測到第一連接器與第二連接器對接時，控制無線充電盤輸出第二充電功率，第二充電功率大於或等於第一充電功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power switchable wireless charging module and a control method thereof are provided. The wireless charging module includes a charging seat and a wireless charging pad. The charging seat includes a seat body having an arrangement area and a first connector exposed on the arrangement area. The wireless charging pad is detachably arranged on the arrangement area and includes a control unit and a second connector electrically connected to the control unit. The first connector is configured to be connected to or detached from the second connector. The control unit controls the wireless charging pad to output a first charging power when detects the first connector is detached from the second connector. The control unit controls the wireless charging pad to output a second charging power greater or equal to the first charging power when detects the first connector is connected to the second connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:無線充電模組</p>  
        <p type="p">1:充電座</p>  
        <p type="p">11:座體</p>  
        <p type="p">111:安置區</p>  
        <p type="p">112:凹陷槽</p>  
        <p type="p">113:盤體容槽</p>  
        <p type="p">114:連接器容槽</p>  
        <p type="p">13:第一連接器</p>  
        <p type="p">14:致冷晶片</p>  
        <p type="p">15:降壓電路</p>  
        <p type="p">16:散熱鰭片</p>  
        <p type="p">2:無線充電盤</p>  
        <p type="p">21:盤體</p>  
        <p type="p">22:無線充電線圈</p>  
        <p type="p">23:控制器單元</p>  
        <p type="p">24:第二連接器</p>  
        <p type="p">25:第三連接器</p>  
        <p type="p">3:梯形座體</p>  
        <p type="p">31:直立斜壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="735" publication-number="202620963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移相器</chinese-title>  
        <english-title>PHASE SHIFTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01Q3/02</main-classification>  
        <further-classification edition="200601120250401B">H01Q1/36</further-classification>  
        <further-classification edition="200601120250401B">H01P1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU LUXSHARE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂康寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, KANGNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種移相器，包括支撐板、電路板、傳動結構和調節結構。其中，電路板放置於支撐板外側，傳動結構設置於支撐板另一側，調節結構設置於電路板外側並與電路板和支撐板轉動連接。傳動結構包括齒輪、齒條桿和弧形內齒輪，齒輪分別與齒條桿和弧形內齒輪嚙合連接，弧形內齒輪與調節結構連接。齒條桿的移動驅動齒輪轉動，並帶動弧形內齒輪轉動，調節結構跟隨弧形內齒輪轉動，使得調節結構的第二帶線與第一帶線的不同位置接觸電連接，實現相位變化的精確控制，減少帶線受到的干擾，便於多個移相器間進行配合，提高移相器可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">​ The present invention discloses a phase shifter. The phase shifter includes a support plate, a circuit board, a transmission structure, and an adjustment structure. The circuit board is positioned on the outer side of the support plate, the transmission structure is arranged on the opposite side of the support plate, and the adjustment structure is positioned on the outer side of the circuit board and is rotatably connected to both the circuit board and the support plate. The transmission structure includes a gear, a rack rod, and an arcuate internal gear. The gear is engaged with both the rack rod and the arcuate internal gear, while the arcuate internal gear is connected to the adjustment structure. The movement of the rack rod drives the gear to rotate, which in turn drives the arcuate internal gear to rotate. The adjustment structure follows the rotation of the arcuate internal gear, allowing the second transmission line of the adjustment structure to make contact and establish an electrical connection with different positions of the first transmission line. This configuration enables precise control of phase variation, reduces interference to the transmission lines, facilitates coordination among multiple phase shifters, and enhances the reliability of the phase shifter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支撐板</p>  
        <p type="p">2:電路板</p>  
        <p type="p">4:調節結構</p>  
        <p type="p">5:限位塊</p>  
        <p type="p">7:銷軸</p>  
        <p type="p">21:第一帶線</p>  
        <p type="p">32:齒條桿</p>  
        <p type="p">33:弧形內齒輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="736" publication-number="202620732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>優化訂單履行程序</chinese-title>  
        <english-title>OPTIMIZING ORDER FULFILLMENT PROCESSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250901B">G06Q10/087</main-classification>  
        <further-classification edition="202401120250901B">G06Q10/08</further-classification>  
        <further-classification edition="201201120250901B">G06Q50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內洛爾　文卡特拉賈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NELLORE, VENKATARAJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬賈裡　哈沙爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANJARI, HARSHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉志欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>軋格　馬尼什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARG, MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉吉　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAJI, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特魯普　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROUP, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在一履行中心處進行訂單履行之方法包含：識別可用於處理對應第一數目個訂單之第一數目個可用收集單元；自該履行中心處之一未履行訂單清單中識別第二數目個未履行訂單，該第二數目個未履行訂單中之每一者將被指派給該第一數目個可用收集單元中之一者以進行包裝，其中該第二數目經選擇使得一效率度量滿足一臨限值條件，該效率度量係基於：(i)由一收集裝置為了自儲存區域收集與該第二數目個未履行訂單對應之組成物品所遍歷之一總距離，及(ii)使用該收集裝置遍歷該總距離所收集之組成物品之一第三數目；以及產生用以指派一或多個特定收集裝置來收集該第三數目個組成物品之一信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of order fulfillment at a fulfillment center includes:identifying a first number of available collection units available for processing a corresponding first number of orders, identifying, from a list of unfulfilled orders at the fulfillment center, a second number of unfulfilled orders each of which is to be assigned to one of the first number of available collection units for packing, where the second number is selected such that an efficiency metric, which is based on (i) a total distance traversed by a collection device to collect the component items corresponding to the second number of unfulfilled orders from the storage area and (ii) a third number of component items collected using the collection device traversing the total distance, satisfies a threshold condition, and generating a signal to assign one or more particular collection devices to collect the third number of component items.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:程序</p>  
        <p type="p">810:步驟</p>  
        <p type="p">820:步驟</p>  
        <p type="p">830:步驟</p>  
        <p type="p">840:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="737" publication-number="202620747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於恢復電子商務平台中未報告之退貨的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR RECOVERING UNREPORTED RETURNS IN E-COMMERCE PLATFORM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/01</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250801B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬蘭帕提　賽　柴坦亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLAMPATI, SAI CHAITANYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森古普塔　斯里吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENGUPTA, SRIJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車田陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHE, TIANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加沙尼　潘卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHANSHANI, PANKAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴哇　加比亞　曼傑特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAWA-CAVIA, MANJEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於處理電子商務交易中退貨之方法包含：接收在與被退貨之一物品相關聯之一識別符中編碼之資訊；獲得指示該物品之狀況之狀況資料；獲得庫存資訊，該庫存資訊包含與對應退貨發票不相關聯之候選退貨交易之識別，其中該等候選退貨交易滿足自一各自退貨程序之一起始以來經過之一時間量符合一第一臨限條件之一條件；基於該狀況資料及一組規則，判定與該物品相關聯之一特定交易；基於該狀況資料，判定關於與該退貨程序相關聯之補償之相對責任在與該特定交易相關聯之一賣家、一客戶及一電子商務提供者當中之一分配；產生表示該相對責任之一資料；及更新與該特定交易相關聯之該賣家之庫存資訊以反映該物品之退貨狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing returns in e-commerce transactions includes: receiving information encoded in an identifier associated with an item being returned; obtaining condition data indicative of condition of the item; obtaining inventory information including identification of candidate return transactions not associated with corresponding return invoices, where the candidate return transactions satisfy a condition in which an amount of elapsed time since an initiation of a respective return process meets a first threshold condition; determining, based on the condition data and a set of rules, a particular transaction associated with the item; determining, based on the condition data, an allocation of relative responsibility among a seller associated with the particular transaction, a customer, and an ecommerce provider regarding compensation associated with the return process; generating a data representing the relative responsibility; and updating inventory information of the seller associated with the particular transaction to reflect return status of the item.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:程序</p>  
        <p type="p">302:步驟</p>  
        <p type="p">304:步驟</p>  
        <p type="p">306:步驟</p>  
        <p type="p">308:步驟</p>  
        <p type="p">310:步驟</p>  
        <p type="p">312:步驟</p>  
        <p type="p">314:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="738" publication-number="202620868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C11/419</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原徳正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, TOKUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可靠性高的記憶系統。&lt;br/&gt;記憶系統是具備非揮發性記憶體及控制器。&lt;br/&gt;非揮發性記憶體是包含：&lt;br/&gt;複數的第1記憶格；&lt;br/&gt;被連接至該等第1記憶格的第1字元線；&lt;br/&gt;複數的第2記憶格；及&lt;br/&gt;被連接至該等第2記憶格的第2字元線。&lt;br/&gt;控制器是被構成可保持：&lt;br/&gt;第1寫入資料，其用於對複數的第1記憶格的寫入；及&lt;br/&gt;第2寫入資料，其用於對複數的第2記憶格的寫入。&lt;br/&gt;又，控制器是被構成可根據第1寫入資料及第2寫入資料來算出再寫入資料。&lt;br/&gt;又，非揮發性記憶體是被構成可執行：&lt;br/&gt;第1寫入動作，其根據從控制器輸入的第1寫入資料來對複數的第1記憶格進行寫入；及&lt;br/&gt;再寫入動作，其根據從控制器輸入的再寫入資料來對複數的第1記憶格的一部分進行寫入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S0~S7:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="739" publication-number="202621311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有鰭式電容器之堆疊半導體裝置</chinese-title>  
        <english-title>STACKED SEMICONDUCTOR DEVICE WITH FIN CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D86/85</main-classification>  
        <further-classification edition="202501120260223B">H10F39/18</further-classification>  
        <further-classification edition="202601120260223B">H10F39/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文成烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUN, SEONG YEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜熙秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HEESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示闡述一種包括安置在一半導體基板中或一半導體基板上的複數個鰭式電容器之堆疊半導體裝置。複數個鰭式電容器經配置以形成一鰭式電容器陣列。複數個鰭式電容器中所包含之一鰭式電容器包括一第一電極、一第二電極及一絕緣材料。第一電極包含一第一平坦部分及自第一平坦部分延伸之複數個第一鰭部。第二電極包含一第二平坦部分及自第二平坦部分延伸之複數個第二鰭部。複數個第一鰭部與複數個第二鰭部巢套，使得複數個第一鰭部及複數個第二鰭部兩者安置在第一平坦部分與第二平坦部分之間。絕緣材料安置在複數個第一鰭部與複數個第二鰭部之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stacked semiconductor device comprising a plurality of fin capacitors disposed in or on a semiconductor substrate is described. The plurality of fin capacitors is arranged to form a fin capacitor array. A fin capacitor included in the plurality of fin capacitors comprising a first electrode, a second electrode, and an insulating material. The first electrode includes a first planar portion and a plurality of first fins extending from the first planar portion. The second electrode includes a second planar portion and a plurality of second fins extending from the second planar portion. The plurality of first fins is nested with the plurality of second fins such that the plurality of first fins and the plurality of second fins are both disposed between the first planar portion and the second planar portion. The insulating material is disposed between the plurality of first fins and the plurality of second fins.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:像素半導體基板/像素單元半導體基板</p>  
        <p type="p">109:接合界面</p>  
        <p type="p">117:浮動擴散部/第一浮動擴散部</p>  
        <p type="p">118:浮動擴散部/第二浮動擴散部</p>  
        <p type="p">125:閘極電介質</p>  
        <p type="p">127:電介質層</p>  
        <p type="p">131:隔離結構</p>  
        <p type="p">151:橫向溢出積分電容器半導體基板</p>  
        <p type="p">154:隔離結構</p>  
        <p type="p">157:電介質層</p>  
        <p type="p">160-XX’:剖面圖</p>  
        <p type="p">161:第一電極/下伏第一電極</p>  
        <p type="p">162:第一平坦部分</p>  
        <p type="p">163:第一鰭部</p>  
        <p type="p">164:絕緣材料</p>  
        <p type="p">165:第二電極</p>  
        <p type="p">166:第二平坦部分</p>  
        <p type="p">167:第二鰭部</p>  
        <p type="p">168:閘極電極</p>  
        <p type="p">169:閘極電極</p>  
        <p type="p">170:閘極電極</p>  
        <p type="p">171:深接觸導通體</p>  
        <p type="p">172:淺接觸導通體</p>  
        <p type="p">177:源極/汲極區域</p>  
        <p type="p">179:源極/汲極區域</p>  
        <p type="p">181:金屬導線</p>  
        <p type="p">188:互連結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="740" publication-number="202621228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷式電源機箱及應用其之液冷式電源機櫃</chinese-title>  
        <english-title>LIQUID-COOLED POWER SUPPLY CHASSIS AND LIQUID-COOLED POWER SUPPLY CABINET USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250327B">H05K7/20</main-classification>  
        <further-classification edition="200601120250327B">F28D5/02</further-classification>  
        <further-classification edition="200601120250327B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱書偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, SHU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁偉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液冷式電源機箱，包括至少一電源供應器、至少一冷板、一冷卻液輸入/輸出單元以及一電力匯流排。冷板與電源供應器熱接觸以吸收一熱能。各冷板具有一冷卻液輸入端以及一冷卻液輸出端。冷卻液輸入/輸出單元包括一第一導管、一第二導管以及一散熱歧管板。第一導管連接冷卻液輸入端及散熱歧管板，第二導管連接冷卻液輸出端及散熱歧管板。電力匯流排包括相對設置的一第一匯流銅排以及一第二匯流銅排，且第一匯流銅排與第二匯流銅排彼此電性絕緣。散熱歧管板與第一匯流銅排及第二匯流銅排熱接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid-cooled power supply chassis includes at least one power supply, at least one cold plate, a coolant input/output unit and a busbar. The cold plate is in thermal contact with the power supply to absorb a heat energy. Each cold plate has a coolant input port and a coolant output port. The coolant input/output unit includes a first conduit, a second conduit and a heat dissipation pipe. The first conduit connects the coolant input port and the heat dissipation pipe, and the second conduit connects the coolant output port and the heat dissipation pipe. The busbar includes a first copper busbar and a second copper busbar that are oppositely arranged, and the first copper busbar and the second copper busbar are electrically insulated from each other. The heat dissipation pipe is in thermal contact with the first and second copper busbar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液冷式電源機箱</p>  
        <p type="p">102:電源供應器</p>  
        <p type="p">104:冷板</p>  
        <p type="p">106:冷卻液輸入/輸出單元</p>  
        <p type="p">107:電源接頭</p>  
        <p type="p">108:電力匯流排</p>  
        <p type="p">111:第一導管</p>  
        <p type="p">112:第二導管</p>  
        <p type="p">118:第一連接埠</p>  
        <p type="p">119:第二連接埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="741" publication-number="202620851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title>MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C7/10</main-classification>  
        <further-classification edition="200601120260223B">G11C7/22</further-classification>  
        <further-classification edition="200601120260223B">G11C29/14</further-classification>  
        <further-classification edition="200601120260223B">G11C11/40</further-classification>  
        <further-classification edition="200601120260223B">G06F13/20</further-classification>  
        <further-classification edition="200601120260223B">G06F12/06</further-classification>  
        <further-classification edition="202301120260223B">H10B12/00</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李性柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEONG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體系統，包括：基板，其具有第一基板側和第二基板側；以及記憶體媒體，其包括安裝在基板之上的第一記憶體堆疊。基板包括第一訊號基板銲盤。第一訊號基板銲盤更靠近第一基板側。第一記憶體堆疊包括第一記憶體晶片和第二記憶體晶片。第一記憶體晶片包括設置成鄰近第一晶片側的第一外晶片銲盤和第一內晶片銲盤。第二記憶體晶片包括設置成鄰近第二記憶體晶片的第一晶片側的第二外晶片銲盤和第二內晶片銲盤。相應的第一訊號基板銲盤、相應的第一內晶片銲盤以及相應的第二內晶片銲盤相互電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system comprises a substrate having a first substrate side and a second substrate side; and a memory media including a first memory stack mounted over the substrate. The substrate includes first signal substrate pads. The first signal substrate pads are closer to the first substrate side. The first memory stack includes a first memory chip and a second memory chip. The first memory chip includes first outer chip pads and first inner chip pads disposed adjacent to a first chip side. The second memory chip includes second outer chip pads and second inner chip pads disposed adjacent to a first chip side of the second memory chip. The corresponding first signal substrate pads, the corresponding first inner chip pads, and the corresponding second inner chip pads are electrically connected to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一記憶體晶片</p>  
        <p type="p">12:第一外晶片銲盤</p>  
        <p type="p">13:第一內晶片銲盤</p>  
        <p type="p">20:第二記憶體晶片</p>  
        <p type="p">22:第二外晶片銲盤</p>  
        <p type="p">23:第二內晶片銲盤</p>  
        <p type="p">30:第三記憶體晶片</p>  
        <p type="p">32:第三外晶片銲盤</p>  
        <p type="p">33:第三內晶片銲盤</p>  
        <p type="p">40:第四記憶體晶片</p>  
        <p type="p">42:第四外晶片銲盤</p>  
        <p type="p">43:第四內晶片銲盤</p>  
        <p type="p">47:第四電源晶片銲盤</p>  
        <p type="p">50:基板</p>  
        <p type="p">51:訊號基板互連</p>  
        <p type="p">53:訊號基板銲盤</p>  
        <p type="p">55:電源基板互連</p>  
        <p type="p">57:電源基板銲盤</p>  
        <p type="p">61:第一接合電線</p>  
        <p type="p">62:第二接合電線</p>  
        <p type="p">63:第三接合電線</p>  
        <p type="p">64:第四接合電線</p>  
        <p type="p">ISa:第一基板側</p>  
        <p type="p">ISb:第二基板側</p>  
        <p type="p">MS:記憶體堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="742" publication-number="202620279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向緩衝拉門反彈控制器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">E05F5/08</main-classification>  
        <further-classification edition="200601120250402B">E05F1/08</further-classification>  
        <further-classification edition="200601120250402B">E05F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商維利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLES S. R. L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉　法蘭柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLA, FRANCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLA, CARLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙向緩衝拉門反彈控制器，其具有一滑動門，該滑動門與一牆面相連，所述滑動門相對於所述牆面固定，所述滑動門包括：一門體，由該門體構成所述滑動門，一移動裝置，用於使該滑動門沿一滑動路徑滑動，讓所述滑動門能介於關閉位置和完全打開位置之間，所述移動裝置包括一個控制裝置，及該控制裝置包括：一第一部分、一第二部分、一連接元件、一彈性回彈裝置與一鎖定機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">(1a):滑動路徑</p>  
        <p type="p">(3):控制裝置</p>  
        <p type="p">(30):第一部分</p>  
        <p type="p">(300):上部</p>  
        <p type="p">(301):延伸導槽</p>  
        <p type="p">(302):本體</p>  
        <p type="p">(31):第二部分</p>  
        <p type="p">(32):連接元件</p>  
        <p type="p">(33):彈性回彈裝置</p>  
        <p type="p">(34):鎖定機構</p>  
        <p type="p">(340):凸輪</p>  
        <p type="p">(341):滑塊</p>  
        <p type="p">(342):彈性臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="743" publication-number="202621385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械研磨板</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING PADS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification>  
        <further-classification edition="201201120260223B">B24B37/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈稘翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, TE-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白睿宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, JUI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉上慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHANG-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張棠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TANG-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃惠琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳科維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">化學機械研磨(CMP)板包括研磨表面，研磨表面包括具有疏水特性的第一區和具有親水特性的第二區。製造化學機械研磨板的方法包括形成化學機械研磨板的研磨表面以包括具有疏水特性的第一區和具有親水特性的第二區。製造半導體裝置的方法包括藉由在旋轉晶圓及CMP板兩者，以及將研磨液供應到化學機械研磨板的研磨表面上時，將晶圓的表面壓靠在化學機械研磨板的研磨表面上來研磨晶圓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemical mechanical polishing (CMP) pad includes a polishing surface including a first region including a hydrophobic character and a second region including a hydrophilic character. A method of manufacturing a CMP pad includes forming a polishing surface of the CMP pad to include a first region including a hydrophobic character and a second region including a hydrophilic character. A method of manufacturing a semiconductor device includes polishing a wafer by pressing a surface of the wafer against a polishing surface of a CMP pad while rotating both the wafer and the CMP pad, and supplying a slurry on the polishing surface of the CMP pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1001,1002:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="744" publication-number="202619831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工設備、雷射加工方法以及遮罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260210B">B23K26/351</main-classification>  
        <further-classification edition="201401120260210B">B23K26/066</further-classification>  
        <further-classification edition="200601120260210B">B23K26/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船山昌彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNAYAMA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山賀勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是在藉由剝蝕加工形成空腔等時，抑制過度加工。其解決手段為在雷射加工設備100中，執行利用矩形的第一遮罩圖案MP1之剝蝕加工。並且，執行利用矩形的第二遮罩圖案MP2之剝蝕加工。第一遮罩圖案MP1之對應於副掃描方向（Y方向）的寬度B1與第二遮罩圖案MP2之對應於副掃描方向（Y方向）的寬度B1不同，寬度較窄的程度為產生在線狀雷射光束LB之兩端部的振鈴（光強度變化部分）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B:底面</p>  
        <p type="p">B0:</p>  
        <p type="p">B1:寬度</p>  
        <p type="p">B2:寬度</p>  
        <p type="p">CR:邊緣部分</p>  
        <p type="p">CW:寬度</p>  
        <p type="p">G:加工區域部分</p>  
        <p type="p">H1:深度</p>  
        <p type="p">HT:深度</p>  
        <p type="p">MP1:第一遮罩圖案</p>  
        <p type="p">MP2:第二遮罩圖案</p>  
        <p type="p">w:寬度</p>  
        <p type="p">W:基板</p>  
        <p type="p">WA:加工圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="745" publication-number="202620346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乾燥盒模組及其浸沒式液冷設備</chinese-title>  
        <english-title>DESICCANT BOX MODULE AND IMMERSION LIQUID COOLING APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">F26B5/16</main-classification>  
        <further-classification edition="200601120250304B">F26B25/00</further-classification>  
        <further-classification edition="200601120250304B">F28D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝顯傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭富升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FU SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高菁穗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, JING-SUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種乾燥盒模組，包含一盒體，用以容納乾燥劑。盒體包含一盒內框、一盒網片及一盒外框，其中盒網片被夾在盒外框與盒內框之間。盒網片形成有多個第一透氣孔，多個第一透氣孔的孔徑小於乾燥劑之粒子的粒徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A desiccant box module includes a box configured to accommodate a desiccant. The box includes an inner frame, a mesh sheet, and an outer frame. The mesh sheet is clamped between the outer frame and the inner frame. The mesh sheet is formed with a plurality of first ventilation holes, and diameters of the first ventilation holes are smaller than sizes of particles of the desiccant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:浸沒式液冷設備</p>  
        <p type="p">10:槽體</p>  
        <p type="p">11:上表面</p>  
        <p type="p">110:第一開口</p>  
        <p type="p">112:第二開口</p>  
        <p type="p">20:乾燥盒模組</p>  
        <p type="p">30:冷凝模組</p>  
        <p type="p">40:支架</p>  
        <p type="p">41:絞鍊</p>  
        <p type="p">42:栓鎖</p>  
        <p type="p">43:鎖扣</p>  
        <p type="p">C1:液體區</p>  
        <p type="p">C2:蒸氣區</p>  
        <p type="p">C3:空氣區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="746" publication-number="202620355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式液冷設備及冷凝模組</chinese-title>  
        <english-title>IMMERSION LIQUID COOLING APPARATUS AND CONDENSER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">F28D15/02</main-classification>  
        <further-classification edition="200601120250304B">F28D1/06</further-classification>  
        <further-classification edition="200601120250304B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝顯傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭富升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FU SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷凝模組，包含一密封板、一入水箱、一出水箱、一連通水箱、多個第一連通管及多個第二連通管。密封板用以密封浸沒式液冷設備的一槽體。入水箱固定於密封板。出水箱固定於密封板。多個第一連通管連接於入水箱與連通水箱之間。多個第二連通管連接於出水箱與連通水箱之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An immersion liquid cooling apparatus and a condenser module are disclosed. The condenser module includes a sealing plate, an inlet water tank, an outlet water tank, a connecting water tank, a plurality of first connecting pipes and a plurality of second connecting pipes. The sealing plate is used to seal a tank of an immersion liquid cooling device. The inlet water tank is fixed to the sealing plate. The outlet water tank is also fixed to the sealing plate. The plurality of first connecting pipes are connected between the inlet water tank and the connecting water tank. The plurality of second connecting pipes are connected between the outlet water tank and the connecting water tank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:浸沒式液冷設備</p>  
        <p type="p">10:槽體</p>  
        <p type="p">12:側牆</p>  
        <p type="p">13:頂面</p>  
        <p type="p">131:開口</p>  
        <p type="p">20:冷凝模組</p>  
        <p type="p">21:密封板</p>  
        <p type="p">26:入液接頭</p>  
        <p type="p">27:出液接頭</p>  
        <p type="p">30:輸送模組</p>  
        <p type="p">40:液體滑道</p>  
        <p type="p">C1:液體區</p>  
        <p type="p">C2:蒸氣區</p>  
        <p type="p">C3:空氣區</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W20:寬度</p>  
        <p type="p">WG:預留寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="747" publication-number="202620156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附黏著片之電子零件，及轉印片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09J133/04</main-classification>  
        <further-classification edition="201801120260223B">C09J7/30</further-classification>  
        <further-classification edition="200601120260223B">H05K3/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田耕治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAODA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯本敬太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUMOTO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種附黏著片之電子零件，其具有：具有基材層與設置於基材層上之紫外線硬化型黏著劑層之黏著片，設置於黏著片之前述紫外線硬化型黏著劑層上之電子零件，電子零件之與紫外線硬化型黏著劑層接觸之面具有絕緣區域與導體區域，紫外線硬化型黏著劑層為黏著劑組成物之熱硬化物，黏著劑組成物包含含有式(2)及(3)之構造單位的(甲基)丙烯酸樹脂(A)。式(2)中，R&lt;sup&gt;3&lt;/sup&gt;表示氫原子或甲基，R&lt;sup&gt;4&lt;/sup&gt;表示碳原子上具有羥基，且與該碳原子鄰接之碳原子上具有從不飽和單羧酸之羧基去除氫原子而成之殘基的基，式(3)中，R&lt;sup&gt;5&lt;/sup&gt;表示氫原子或甲基，R&lt;sup&gt;6&lt;/sup&gt;表示碳原子上具有從不飽和單羧酸之羧基去除氫原子而成之殘基，且與該碳原子鄰接之碳原子上從不飽和單羧酸之羧基去除氫原子而成之殘基的基。&lt;br/&gt;&lt;img align="absmiddle" height="190px" width="577px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="748" publication-number="202620591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷板散熱裝置</chinese-title>  
        <english-title>COLD PLATE COOLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">G06F1/20</main-classification>  
        <further-classification edition="200601120250313B">F28F3/02</further-classification>  
        <further-classification edition="200601120250313B">F28F3/12</further-classification>  
        <further-classification edition="200601120250313B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡士凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銘宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種冷板散熱裝置，包括均溫板、冷卻腔、入流口、出流口和噴流模組。均溫板包括頂部和底部於第一方向上彼此相反設置。底部熱耦合至發熱源，頂部熱耦合至複數個散熱鰭片。冷卻腔設置於均溫板的頂部。複數個散熱鰭片容置於冷卻腔內。入流口和出流口分別連通至冷卻腔。冷卻液體由入流口進入冷卻腔，於冷卻腔與複數個散熱鰭片熱交換後再經由出流口排出。噴流模組包括通口設置於入流口以及冷卻腔之間。通口包括通口總面積小於入流口的開口總面積。冷卻液體流經通口時產生衝擊流朝向複數個散熱鰭片，以對均溫板進行散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cold plate cooling device is disclosed and includes a vapor chamber, a cooling chamber, an inlet, an outlet and a jet module. The vapor chamber includes a top portion and a bottom portion arranged opposite to each other in a first direction. The bottom portion is thermally coupled to a heat source, and the top portion is thermally coupled to a plurality of heat sink fins. The cooling chamber is arranged on the top portion of the vapor chamber. The inlet and the outlet are in fluid communication with the cooling chamber, respectively. A coolant enters the cooling chamber through the inlet, exchanges heat with the plurality of heat sink fins in the cooling chamber, and then is discharged through the outlet. The jet module includes a through hole arranged between the inlet and the cooling chamber. A total through-hole area of the through hole is smaller than a total opening area of the inlet. When the coolant flows through the through hole, an impingement flow is generated toward the plurality of heat sink fins to dissipate heat from the vapor chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:冷板散熱裝置</p>  
        <p type="p">10:均溫板</p>  
        <p type="p">11:頂部</p>  
        <p type="p">12:底部</p>  
        <p type="p">110、121:微結構</p>  
        <p type="p">120:散熱面</p>  
        <p type="p">13:封閉腔體</p>  
        <p type="p">20:冷卻腔</p>  
        <p type="p">21:散熱鰭片</p>  
        <p type="p">22:頂蓋</p>  
        <p type="p">30:入流口</p>  
        <p type="p">40:出流口</p>  
        <p type="p">50:通口</p>  
        <p type="p">51:隔板</p>  
        <p type="p">60:緩衝腔</p>  
        <p type="p">9、90a、90b:發熱源</p>  
        <p type="p">F1:第一流向</p>  
        <p type="p">F2:第二流向</p>  
        <p type="p">J:衝擊流</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="749" publication-number="202620404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸扭曲校正裝置</chinese-title>  
        <english-title>SHAFT DISTORTION CORRECTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260213B">G01M13/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際計測器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI KEISOKUKI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本進一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村內一宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAUCHI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>碓井達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林芳信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於有效率地提升軸扭曲校正裝置的設定切換工序，根據本發明的一態樣，提供一種軸扭曲校正裝置，具備：砧，支持工件；線性導件，在工件的軸方向可移動地支持砧；以及砧移動部，在工件的軸方向移動砧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3a:上段基板</p>  
        <p type="p">10:滾輪砧</p>  
        <p type="p">30:工件驅動部</p>  
        <p type="p">30A:驅動模組</p>  
        <p type="p">30b:基板</p>  
        <p type="p">31:框</p>  
        <p type="p">31f:固定框</p>  
        <p type="p">31m:可動框</p>  
        <p type="p">31p、323:鉸鏈銷</p>  
        <p type="p">32:汽缸</p>  
        <p type="p">33:馬達</p>  
        <p type="p">34:聯軸器</p>  
        <p type="p">35、331:軸</p>  
        <p type="p">36、163:滾輪</p>  
        <p type="p">50:砧移動部</p>  
        <p type="p">51、51f:線性導件</p>  
        <p type="p">53L:滾珠螺桿</p>  
        <p type="p">311:筒部</p>  
        <p type="p">312:軸承</p>  
        <p type="p">511:軌道</p>  
        <p type="p">512:托架</p>  
        <p type="p">531L:螺軸</p>  
        <p type="p">532L:螺帽</p>  
        <p type="p">W:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="750" publication-number="202621302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>A SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/82</main-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>季彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, YAN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種半導體結構。該半導體結構包括基板、電子裝置以及互連結構。該電子裝置設置於基板上。該電子裝置包括第一閘極結構。該互連結構包含位於該電子裝置正上方的第一互連層導電跡線。該第一互連層導電跡線具有第一開口，用於暴露至少一個該第一閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate, electronic devices, and an interconnection structure. The electronic devices are disposed on the substrate. The electronic devices includes first gate structures. The interconnection structure including a first interconnection-level conductive trace is located directly above the electronic devices. The first interconnection-level conductive trace has first openings for exposing at least one of the first gate structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,110,120:方向</p>  
        <p type="p">200T:頂表面</p>  
        <p type="p">200:基板</p>  
        <p type="p">204:隔離特徵</p>  
        <p type="p">250:開口</p>  
        <p type="p">206:阱區</p>  
        <p type="p">208S,208D,208DS:源極/汲極摻雜區</p>  
        <p type="p">210-1,210-2:閘極結構</p>  
        <p type="p">220:電子裝置</p>  
        <p type="p">220T2:選擇電晶體</p>  
        <p type="p">220T1:閘極電晶體</p>  
        <p type="p">230:介電層結構</p>  
        <p type="p">260:互連結構</p>  
        <p type="p">300:有源區域</p>  
        <p type="p">400:光線</p>  
        <p type="p">500A:半導體結構</p>  
        <p type="p">Mtop:第一互連層導電跡線</p>  
        <p type="p">S1:間隔</p>  
        <p type="p">A1,L2:尺寸</p>  
        <p type="p">D1:距離</p>  
        <p type="p">P1:單元間距</p>  
        <p type="p">P2:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="751" publication-number="202620229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於提供前驅物之脈衝之設備、反應器系統、脈衝前驅物至反應腔室之方法</chinese-title>  
        <english-title>APPARATUS FOR PROVIDING PULSE OF PRECURSOR, REACTOR SYSTEM, AND METHOD OF PULSING PRECURSOR TO REACTION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C23C16/455</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威克勒　傑瑞德　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINKLER, JERELD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希納穆西　荷裡哈拉　克里希南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAMOORTHY, HARIHARA KRISHNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希羅　艾瑞克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERO, ERIC JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　任成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ERIC JEN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯　福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷薩寧　皮特里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAISANEN, PETRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAOKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方杜拉利亞　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONDURULIA, KYLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於提供一前驅物之一脈衝的設備、系統、及方法。如本文中所描述之設備、系統、及方法可用以例如快速脈衝一前驅物至一反應器，並在該反應器之一沖洗期間提供相對高的一沖洗氣體之流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus, systems and methods for providing a pulse of a precursor are provided. The apparatus, systems and methods as described herein can be used to, for example, rapidly pulse a precursor to a reactor and provide relatively high flow of a purge gas during a purge of the reactor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統/反應器系統</p>  
        <p type="p">102:反應器</p>  
        <p type="p">104:設備</p>  
        <p type="p">106:真空源</p>  
        <p type="p">108:控制器</p>  
        <p type="p">110:壓力流動控制器</p>  
        <p type="p">112:前驅物源</p>  
        <p type="p">114:載體氣體管線</p>  
        <p type="p">116:前驅物管線</p>  
        <p type="p">118:載體氣體源</p>  
        <p type="p">120:回吸管線</p>  
        <p type="p">121:惰性氣體閥</p>  
        <p type="p">122:容器</p>  
        <p type="p">124:前驅物容器</p>  
        <p type="p">126:前驅物</p>  
        <p type="p">128:前驅物容器入口</p>  
        <p type="p">130:前驅物容器出口</p>  
        <p type="p">132:第一分支</p>  
        <p type="p">134:第二分支</p>  
        <p type="p">136:流動旁路總成</p>  
        <p type="p">138:第一流動旁路管線</p>  
        <p type="p">140:第二流動旁路管線</p>  
        <p type="p">141:出口</p>  
        <p type="p">142:區域</p>  
        <p type="p">144:第一旁路計量閥/計量閥/閥</p>  
        <p type="p">146:第一旁路關斷閥/關斷閥/閥</p>  
        <p type="p">148:第二旁路計量閥/計量閥/閥</p>  
        <p type="p">150:第二旁路關斷閥/關斷閥/閥</p>  
        <p type="p">152:載體氣體計量閥/計量閥/閥</p>  
        <p type="p">154:載體關斷閥/關斷閥/閥</p>  
        <p type="p">156:關斷閥</p>  
        <p type="p">158:孔口</p>  
        <p type="p">160:反應器入口管線</p>  
        <p type="p">162:積儲器</p>  
        <p type="p">164:壓力感測器</p>  
        <p type="p">166:前驅物源總成</p>  
        <p type="p">168:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="752" publication-number="202620315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉阻尼器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">F16F9/12</main-classification>  
        <further-classification edition="200601120260213B">F16F9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>ＴＯＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOK, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村岡勇希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAOKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋場潤一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIBA, JUNICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可適當除去組裝時所產生之氣泡的旋轉阻尼器。根據本發明，提供一種旋轉阻尼器，包括殼體、軸、蓋、及密封構件。殼體呈具有填充空間之有底圓筒狀，並構成為於填充空間填充黏性流體。軸構成為可相對旋轉地裝設於殼體。蓋呈圓筒狀，具有供軸插入的插入孔，並構成為外周面抵接殼體之內周面，內周面抵接密封構件。密封構件呈環狀，並以內周面抵接軸的方式安裝於軸上。殼體之內周面與軸之間，蓋抵接密封構件，藉此使填充空間密閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:旋轉阻尼器</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:軸</p>  
        <p type="p">14a:第1軸部</p>  
        <p type="p">14b:第2軸部</p>  
        <p type="p">14c:第3軸部</p>  
        <p type="p">15a:第1間隙</p>  
        <p type="p">15b:第2間隙</p>  
        <p type="p">16:蓋</p>  
        <p type="p">18:密封構件</p>  
        <p type="p">121:填充空間</p>  
        <p type="p">122:軸承部</p>  
        <p type="p">124:端面</p>  
        <p type="p">125:安裝部</p>  
        <p type="p">126:接合部</p>  
        <p type="p">128:內周面</p>  
        <p type="p">142:凸緣部</p>  
        <p type="p">143:葉片部</p>  
        <p type="p">145:安裝部</p>  
        <p type="p">146:密封構件安裝部</p>  
        <p type="p">163:凸緣部</p>  
        <p type="p">165a:第1面</p>  
        <p type="p">165b:第2面</p>  
        <p type="p">166:接合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="753" publication-number="202621355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成半導體裝置的閘極結構的界面層的方法、形成半導體裝置的結構的方法，以及半導體裝置的結構</chinese-title>  
        <english-title>A METHOD OF FORMING AN INTERFACIAL LAYER OF A GATE STRUCTURE OF A SEMICONDUCTOR DEVICE, A METHOD OF FORMING A STRUCTURE OF A SEMICONDUCTOR DEVICE, AND A STRUCTURE OF A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/40</main-classification>  
        <further-classification edition="202501120260223B">H10D64/01</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202501120260223B">H10D64/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李紳揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHEN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張翔筆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIANG-PI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧俊甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙皇麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, HUANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斌彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PINYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係針對改良一半導體裝置之一閘極結構的一界面層之品質的一方法。該方法包括：在一基體上形成一通道區；以及氧化該通道區之一表面以形成包括氧化矽之界面層。該方法進一步包括：在該界面層上沉積一金屬氧化物(例如，氧化釔)層；施行一退火程序以藉由減少該界面層中之氧空缺的一密度來將該界面層中之氧化矽轉變成二氧化矽；以及移除該金屬氧化物層。該方法進一步包括在該界面層上形成一高k介電層及一閘極電極以形成該閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a method of improving a quality of an interfacial layer of a gate structure of a semiconductor device. The method includes forming a channel region on a substrate and oxidizing a surface of the channel region to form the interfacial layer including silicon oxide. The method further includes depositing a layer of metal oxide (e.g., yttrium oxide) on the interfacial layer, performing an annealing process to transform silicon oxide in the interfacial layer into silicon dioxide by reducing a density of oxygen vacancies in the interfacial layer, and removing the layer of metal oxide. The method further includes forming a high-k dielectric layer and a gate electrode on the interfacial layer to form the gate structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:基體</p>  
        <p type="p">105:電晶體</p>  
        <p type="p">110:鰭片結構</p>  
        <p type="p">115:閘極結構</p>  
        <p type="p">115a:IL</p>  
        <p type="p">115b:閘極介電層</p>  
        <p type="p">115c:閘極電極</p>  
        <p type="p">120:奈米片層，NS層</p>  
        <p type="p">125:S/D磊晶結構</p>  
        <p type="p">130:內間隔件結構</p>  
        <p type="p">135:閘極間隔件</p>  
        <p type="p">138:淺溝槽隔離區，STI區</p>  
        <p type="p">152,154,156:介電層</p>  
        <p type="p">163:S/D接點</p>  
        <p type="p">165:層間介電層，ILD層</p>  
        <p type="p">167:閘極接觸通孔</p>  
        <p type="p">A-B:線</p>  
        <p type="p">Lc:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="754" publication-number="202620485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置封裝及其形成方法與電子裝置</chinese-title>  
        <english-title>DEVICE PACKAGE AND METHODS OF FORMATION AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B6/34</main-classification>  
        <further-classification edition="200601120260223B">G02B6/42</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, TZU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">裝置封裝包括封裝基板以及可包括在封裝基板中的光連接器封裝。光連接器封裝可包括嵌入光連接器封裝中的光纖，且光纖可經定向以將光信號光耦接至封裝基板上的IC晶粒中包括的光柵耦接器。光纖可經配置以從封裝基板之側面、封裝基板之頂部、及/或從封裝基板之部分接收光信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device package includes a package substrate, and an optical connector package may be included in the package substrate. The optical connector package may include an optical fiber embedded in the optical connector package, and the optical fiber may be oriented to optically couple optical signals to a grating coupler included in an IC die on the package substrate. The optical fiber may be arranged to receive the optical signals from the side of the package substrate, the top of the package substrate, and/or from portion of the package substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例實施例</p>  
        <p type="p">102:裝置封裝</p>  
        <p type="p">110:IC晶粒</p>  
        <p type="p">116:底部填充材料</p>  
        <p type="p">122:鈍化層</p>  
        <p type="p">132:光柵耦接器</p>  
        <p type="p">134:光連接器封裝</p>  
        <p type="p">136:介電結構</p>  
        <p type="p">138:光纖</p>  
        <p type="p">140:末端</p>  
        <p type="p">142:末端</p>  
        <p type="p">144:區段</p>  
        <p type="p">146:過渡區段</p>  
        <p type="p">148:包覆層</p>  
        <p type="p">150:反射結構</p>  
        <p type="p">x,z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="755" publication-number="202619789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>臭氧曝氣裝置</chinese-title>  
        <english-title>OZONE AERATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260213B">B01F23/2326</main-classification>  
        <further-classification edition="202301120260213B">C02F1/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本光電科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOTOSCIENCE JAPAN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山越裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKOSHI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於以簡單之構成進行廢臭氧之處理。本發明之臭氧曝氣裝置包含：臭氧生成機(10)，其生成臭氧氣體；臭氧反應裝置(14)，其以前述臭氧生成機生成之臭氧氣體對被處理液體進行曝氣；及構造(16)，其使前述臭氧反應裝置中使用畢之廢臭氧氣體返回前述臭氧生成機之吸氣側。廢臭氧氣體作為臭氧生成機中之原料之一部分重複使用，組入實質上無限之重複使用迴路。因此，無須特別之廢臭氧分解處理設備，能以極簡單之構成進行廢臭氧之處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention seeks to achieve treatment of waste ozone by means of a simple construction. The inventive ozone aeration apparatus includes an ozone generator (10) for generating ozone gas, an ozone reactor (14) for aerating a liquid to be treated with the ozone gas generated by the ozone generator, and a construction (16) for return waste ozone gas having been used in the ozone reactor into an intake side of the ozone generator. The waste ozone gas is reused as part of material in the ozone generator, so that the waste ozone gas is incorporated into a substantially-endless recycling loop. With this arrangement, it is no necessary to provide with a special equipment for decomposing the waste ozone, and thereby treatment of waste ozone is accomplished by a very simple construction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:臭氧生成機</p>  
        <p type="p">11:UV燈</p>  
        <p type="p">12:泵</p>  
        <p type="p">13:噴射器</p>  
        <p type="p">14:臭氧反應塔(臭氧反應裝置)</p>  
        <p type="p">14U:上部空間</p>  
        <p type="p">15:排水口</p>  
        <p type="p">16:配管/構造</p>  
        <p type="p">17:止回閥</p>  
        <p type="p">OZ:臭氧氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="756" publication-number="202621473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成裝置結構的方法及裝置結構</chinese-title>  
        <english-title>METHOD OF FORMING DEVICE STRUCTURE AND DEVICE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUO-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝瑋庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, WEI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泓儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一相變材料切換電路可藉由以下提供：在一基體上形成包括一功率放大器及一低雜訊放大器的一半導體電路；在該功率放大器及該低雜訊放大器上方形成埋置於第一介電材料層中的金屬互連結構；在該等第一介電材料層上方形成一第一相變材料(PCM)開關及一第二PCM開關，其中該第一PCM開關包括一第一電極及一第二電極，且該第二PCM開關包括一第三電極及一第四電極，其中該第二電極係電氣連接至該第三電極以形成一共同電氣節點；且將一射頻(RF)天線電氣連接至該共同電氣節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phase change material switching circuit may be provided by forming a semiconductor circuit including a power amplifier and a low noise amplifier on a substrate; forming metal interconnect structures embedded in first dielectric material layers over the power amplifier and the low noise amplifier; forming a first phase change material (PCM) switch and a second PCM switch over the first dielectric material layers, wherein the first PCM switch includes a first electrode and a second electrode, and the second PCM switch includes a third electrode and a fourth electrode, wherein the second electrode is electrically connected to the third electrode to form a common electrical node; and electrically connecting a radio-frequency (RF) antenna to the common electrical node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8:基體</p>  
        <p type="p">9:半導體材料層</p>  
        <p type="p">21:第一金屬互連結構，連接通孔結構，訊號節點連接通孔結構</p>  
        <p type="p">21A:第一訊號節點連接通孔結構，第一金屬互連結構</p>  
        <p type="p">21B:第二訊號節點連接通孔結構，第一金屬互連結構</p>  
        <p type="p">24:第一介電材料層，通孔級介電材料層</p>  
        <p type="p">26:電極級介電層</p>  
        <p type="p">28:導熱板</p>  
        <p type="p">42:第一金屬板，金屬板</p>  
        <p type="p">45:第二金屬板，金屬板</p>  
        <p type="p">48:第三金屬板，金屬板</p>  
        <p type="p">42B,45B,48B,42M,45M,48M:相應圖案化部分</p>  
        <p type="p">55:條帶部分</p>  
        <p type="p">70:相變材料部分</p>  
        <p type="p">70S1:第一相變區</p>  
        <p type="p">70S2:第二相變區</p>  
        <p type="p">72:外覆介電板，第一外覆介電板</p>  
        <p type="p">74:外覆介電板，第二外覆介電板</p>  
        <p type="p">80:PCM級介電材料層，第二介電材料層</p>  
        <p type="p">90:線路級介電層，第二介電材料層</p>  
        <p type="p">98:金屬線路結構</p>  
        <p type="p">101:第一(PCM)開關，第一PCM開關，第一相變材料(PCM)開關</p>  
        <p type="p">102:第二(PCM)開關，第二PCM開關</p>  
        <p type="p">551:第一加熱器條帶部分</p>  
        <p type="p">552:第二加熱器條帶部分</p>  
        <p type="p">601:第一介電材料層，接觸級介電材料層</p>  
        <p type="p">610:第一介電材料層，第一互連級介電材料層</p>  
        <p type="p">612:第一金屬互連結構，裝置接點通孔結構</p>  
        <p type="p">618:第一金屬互連結構，第一金屬線路結構</p>  
        <p type="p">620:第一介電材料層，第二互連級介電材料層</p>  
        <p type="p">622:金屬通孔結構，第一金屬互連結構，第一金屬通孔結構</p>  
        <p type="p">628:金屬線路結構，第一金屬互連結構，第二金屬線路結構</p>  
        <p type="p">630:第一介電材料層，第三互連級介電材料層</p>  
        <p type="p">632:金屬通孔結構，第一金屬互連結構，第二金屬通孔結構</p>  
        <p type="p">638:金屬線路結構，第一金屬互連結構，第三金屬線路結構</p>  
        <p type="p">640:第一介電材料層，第四互連級介電材料層</p>  
        <p type="p">642:金屬通孔結構，第一金屬互連結構，第三金屬通孔結構</p>  
        <p type="p">648:金屬線路結構，第一金屬互連結構，第四金屬線路結構</p>  
        <p type="p">700:半導體電路</p>  
        <p type="p">701:功率放大器</p>  
        <p type="p">702:低雜訊放大器</p>  
        <p type="p">720:淺溝槽隔離結構</p>  
        <p type="p">732:源極區</p>  
        <p type="p">735:半導體通道</p>  
        <p type="p">738:汲極區</p>  
        <p type="p">742:源極側金屬半導體合金區</p>  
        <p type="p">748:汲極側金屬半導體合金區</p>  
        <p type="p">750:閘極結構</p>  
        <p type="p">752:閘極介電層</p>  
        <p type="p">754:閘極電極</p>  
        <p type="p">756:介電閘極間隔物</p>  
        <p type="p">758:閘極帽蓋介電質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="757" publication-number="202620470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107982</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繞射光學裝置</chinese-title>  
        <english-title>DIFFRACTIVE OPTICAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">G02B5/02</main-classification>  
        <further-classification edition="200601120250423B">G02B6/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>采鈺科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISERA TECHNOLOGIES COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王懷永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUAI-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅柏翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, PO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝錦全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種繞射光學裝置包含波導、發光單元以及超穎表面。波導包含第一橫向表面以及與第一橫向表面相對的第二橫向表面。發光單元直接接觸波導的第一橫向表面，並配置以發出具有初始發散角的光束，其中發光單元包含光源。超穎表面設置於波導的第二橫向表面上，其中超穎表面配置以將光束從波導耦合出去，並於投影平面上投射出光學圖案，其中光學圖案包含負階繞射光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diffractive optical structure includes a waveguide, a light emitting unit, and a metasurface. The waveguide includes a first transverse surface and a second transverse surface opposite to the first transverse surface. The light emitting unit directly contacts the first transverse surface of the waveguide and is configured to emit a light beam with an initial divergence angle, wherein the light emitting unit includes a light source. The metasurface is disposed on the second transverse surface of the waveguide, wherein the metasurface is configured to couple out the light beam from the waveguide and project an optical pattern on a projection plane, wherein the optical pattern includes a negative order diffracted light.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:繞射光學裝置</p>  
        <p type="p">110:波導</p>  
        <p type="p">112:抗反射層</p>  
        <p type="p">120:發光單元</p>  
        <p type="p">122:光源</p>  
        <p type="p">124:表面浮雕光柵</p>  
        <p type="p">130:超穎表面</p>  
        <p type="p">132:基板</p>  
        <p type="p">134:柱</p>  
        <p type="p">140:投影平面</p>  
        <p type="p">-1:-1階繞射光</p>  
        <p type="p">-2:-2階繞射光</p>  
        <p type="p">-3:-3階繞射光</p>  
        <p type="p">-4:-4階繞射光</p>  
        <p type="p">-5:-5階繞射光</p>  
        <p type="p">H&lt;sub&gt;waveguide&lt;/sub&gt;:厚度</p>  
        <p type="p">LB:光束</p>  
        <p type="p">s1:第一橫向表面</p>  
        <p type="p">s2:第二橫向表面</p>  
        <p type="p">θ&lt;sub&gt;0&lt;/sub&gt;:初始出射角</p>  
        <p type="p">θ&lt;sub&gt;i&lt;/sub&gt;:入射角</p>  
        <p type="p">β:初始發散角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="758" publication-number="202620974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子模組、端子模組的製造方法以及端子模組的應用</chinese-title>  
        <english-title>TERMINAL MODULE, METHOD OF MANUFACTURING THE TERMINAL MODULE, AND APPLICATION OF THE TERMINAL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250414B">H01R12/73</main-classification>  
        <further-classification edition="200601120250414B">H01R13/648</further-classification>  
        <further-classification edition="200601120250414B">H01R13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEED TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張華均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種端子模組包括複數第一導電端子、絕緣本體以及第一屏蔽片。前述第一導電端子包括第一導電片、第二導電片以及第一中間部。前述絕緣本體包括第一表面以及第二表面。前述第一導電片暴露於前述第一表面。前述第一中間部包括埋設在前述絕緣本體中的第一埋設部，從而有利於增加前述第一導電端子與前述絕緣本體的結合力。本發明的端子模組能夠取代相關技術中的印刷電路板，從而在尺寸控制和阻抗調節等方面能夠較好地適應高速連接器的發展要求。本發明還揭示了一種端子模組的製造方法以及端子模組的應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A terminal module includes a plurality of first conductive terminals, an insulating body and a first shielding piece. The first conductive terminal includes a first conductive pad, a second conductive pad and a first middle portion. The insulating body includes a first surface and a second surface. The first conductive pad is exposed to the first surface. The first middle portion includes a first embedded portion embedded in the insulating body, thereby increasing a bonding force between the first conductive terminal and the insulating body. The terminal module of the present invention is able to replace a printed circuit board in the related art, so that it can better adapt to the development requirements of high-speed connectors in terms of size control and impedance adjustment. The present invention also discloses a method of manufacturing the terminal module and an application of the terminal module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣本體</p>  
        <p type="p">100:端子模組</p>  
        <p type="p">11:第一表面</p>  
        <p type="p">12:第二表面</p>  
        <p type="p">13:第一覆蓋部</p>  
        <p type="p">211:第一導電片</p>  
        <p type="p">2110:第一保持部</p>  
        <p type="p">212:第二導電片</p>  
        <p type="p">2120:第一固定部</p>  
        <p type="p">213:第一中間部</p>  
        <p type="p">2130:第一埋設部</p>  
        <p type="p">2131:第一連接部</p>  
        <p type="p">2132:第二連接部</p>  
        <p type="p">214:第一凹口</p>  
        <p type="p">215:第一屏蔽板</p>  
        <p type="p">221:第三導電片</p>  
        <p type="p">2210:第二保持部</p>  
        <p type="p">222:第四導電片</p>  
        <p type="p">2220:第二固定部</p>  
        <p type="p">223:第二中間部</p>  
        <p type="p">2230:第二埋設部</p>  
        <p type="p">224:第二凹口</p>  
        <p type="p">225:第二屏蔽板</p>  
        <p type="p">31:第一屏蔽片</p>  
        <p type="p">311:第一板片部</p>  
        <p type="p">32:第二屏蔽片</p>  
        <p type="p">321:第二板片部</p>  
        <p type="p">A1-A1:第一方向</p>  
        <p type="p">A2-A2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="759" publication-number="202620410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嵌入式感測器響應線性化方法</chinese-title>  
        <english-title>EMBEDDED SENSOR RESPONSE LINEARIZATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G01N21/27</main-classification>  
        <further-classification edition="201401120260209B">G01N21/3504</further-classification>  
        <further-classification edition="201401120260209B">G01N21/359</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬德瑞　奧斯曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOWDHURY, USMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜蘭德　威廉Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DURAND, WILLIAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森切斯　馬力歐丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANCHEZ, MARIO DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扎法爾　阿布杜拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAFAR, ABDULLAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩隆　卡斯圖瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARANG, KASTURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴亞蒂　阿米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYATI, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托　昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOE, AUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本文揭示的實施例中，一種用於校準光子感測器的方法包括在各種溫度及壓力環境下利用具有複數個不同的參考氣體混合物的光子感測器收集複數個濃度測量，其中每個參考氣體混合物包括已知的物種濃度，以及實施參數最佳化常式以最小化已知的物種濃度與由光子感測器獲得的複數個濃度測量之間的偏差，其中最佳化常式產生一或多個校準常數。在一實施例中，該方法可進一步包括將一或多個校準常數整合到經修改的濃度公式中，以及將經修改的濃度公式儲存在用於操作光子感測器的控制器中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In embodiments disclosed herein, a method for calibrating a photonic sensor includes collecting a plurality of concentration measurements with a photonic sensor with a plurality of different reference gas mixtures under various temperature and pressure environments, where each reference gas mixture includes a known species concentration, and implementing a parameter optimization routine to minimize deviations between the known species concentrations and the plurality of concentration measurements obtained by the photonic sensor, where the optimization routine generates one or more calibration constants. In an embodiment, the method may further include integrating the one or more calibration constants into a modified concentration formula, and storing the modified concentration formula in a controller used to operate the photonic sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1050:製程</p>  
        <p type="p">1051:操作</p>  
        <p type="p">1052:操作</p>  
        <p type="p">1053:操作</p>  
        <p type="p">1054:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="760" publication-number="202619737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳酸明串球菌LEL168分離株及其培養物在提升鈣吸收與抑制骨吸收上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251201B">A61K35/744</main-classification>  
        <further-classification edition="200601120251201B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生合生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNBIO TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡沛勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程怡蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珈嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-SENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一株乳酸明串球菌( &lt;i&gt;Leuconostoc lactis&lt;/i&gt;) LEL168分離株，其以寄存編號BCRC 911240被寄存於財團法人食品工業發展研究所的生物資源保存及研究中心(BCRC of FIRDI)。該乳酸明串球菌LEL168分離株的培養物可被用來提升鈣吸收與抑制骨吸收(bone resorption)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="761" publication-number="202620873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>  
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">G11C15/04</main-classification>  
        <further-classification edition="200601120250910B">G11C11/409</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體裝置包含記憶體字串。記憶體字串包含第一及第二字串部分。第一字串部分儲存儲存過濾位元，並比較輸入過濾位元與儲存過濾位元。第二字串部分儲存儲存計算位元，並比較輸入計算位元與儲存計算位元， 其中當輸入過濾位元不同於儲存過濾位元時，字串電流信號具有第一電流準位。當輸入過濾位元等於儲存過濾位元且輸入計算位元與儲存計算位元具有第一差值時，字串電流信號具有第二電流準位。當輸入過濾位元等於儲存過濾位元且輸入計算位元與儲存計算位元具有第二差值時，字串電流信號具有第三電流準位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a memory string. The memory string includes a first and a second string portions. The first string portion stores stored filter bits, and compares input filter bits with the stored filter bits. The second string portion stores stored computing bits, and compares input computing bits with the stored computing bits. When the input filter bits is different from the stored filter bits, the string current signal has a first current level, when the input filter bits is equal to the stored filter bits, and the input computing bits has a first difference with the stored computing bits, the string current signal has a second current level, and when the input filter bits is equal to the stored filter bits, and the input computing bits has a second difference with the stored computing bits, the string current signal has a third current level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">MS1:記憶體字串</p>  
        <p type="p">IS1:字串電流信號</p>  
        <p type="p">T1~T12:開關元件</p>  
        <p type="p">CMC1~CMC4、FMC1、FMC2:記憶體單元</p>  
        <p type="p">HVT、LVT:臨界電壓準位</p>  
        <p type="p">VH1、VH2、VH、VL:電壓準位</p>  
        <p type="p">IL0:電流準位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="762" publication-number="202621132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微機電感測器之感測電路</chinese-title>  
        <english-title>A SENSING CIRCUIT OF A MICRO-ELECTROMECHANICAL SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H04R3/06</main-classification>  
        <further-classification edition="200601120260209B">H04R19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊凡聖斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENSENSE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席格　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEEGER, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係利用電壓轉換器將正負反饋電壓施加至麥克風的機電感測器，以促進麥克風靈敏度的提高和失真的減少。一種麥克風包括機電感測器，所述機電感測器包括電容感測元件，電容感測元件包括第一感測節點和第二感測節點；以及電壓轉換器，其包括輸入、第一輸出和第二輸出。電壓轉換器通過將第一電容耦合至第二感測節點，在電壓轉換器的第一輸出和輸入之間形成負反饋回路。第一感測節點係電耦合到電壓轉換器的輸入，且電壓轉換器通過將第二電容耦合至第一感測結點，在電壓轉換裝置的第二輸出和輸入之間形成正反饋回路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Applying positive and negative feedback voltages to an electromechanical sensor of a microphone utilizing a voltage-to-voltage converter to facilitate an improvement in sensitivity and reduction in distortion of the microphone is presented herein. A microphone comprises an electromechanical sensor comprising a capacitive sense element comprising a first sense node and a second sense node; and a voltage-to-voltage converter comprising an input, a first output, and a second output. The voltage-to-voltage converter forms, via a first capacitive coupling to the second sense node, a negative feedback loop between the first output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter. The first sense node is electrically coupled to the input of the voltage-to-voltage converter, and the voltage-to-voltage converter forms, via a second capacitive coupling to the first sense node, a positive feedback loop between the second output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:麥克風</p>  
        <p type="p">110:機電感測器</p>  
        <p type="p">112:電容感測元件</p>  
        <p type="p">120:V2V轉換器</p>  
        <p type="p">130:負反饋電路</p>  
        <p type="p">140:正反饋回路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="763" publication-number="202621014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具飛行電容器混合切換電容轉換器</chinese-title>  
        <english-title>HYBRID SWITCHED CAPACITOR CONVERTER WITH FLYING CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260210B">H02M1/00</main-classification>  
        <further-classification edition="200601120260210B">H02M3/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商奧地利英飛凌科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFINEON TECHNOLOGIES AUSTRIA AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里佐拉蒂　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIZZOLATTI, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾西諾　馬力歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URSINO, MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯柏　馬蒂亞斯　約阿希姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASPER, MATTHIAS JOACHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種例如功率轉換器之類的裝置包含：第一電路路徑，包含串聯地耦接的第一繞組，第一繞組中每一者彼此磁性地耦接；第二電路路徑，包含串聯地耦接的第二繞組，第二繞組中每一者彼此磁性地耦接；及切換電路系統，切換電路系統操作以在使飛行電容器和第一電路路徑串聯電連接與使飛行電容器和第二電路路徑串聯電連接之間選擇性地切換。控制器控制功率轉換器中的切換電路系統，以將輸入電壓轉化為輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus such as a power converter includes: a first circuit path including first windings coupled in series, each of the first windings magnetically coupled to each other; a second circuit path including second windings coupled in series, each of the second windings magnetically coupled to each other; and switch circuitry operative to selectively switch between electrically connecting a flying capacitor in series with the first circuit path and electrically connecting the flying capacitor in series with the second circuit path. A controller controls the switch circuitry in the power converter to convert an input voltage into an output voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">118:負載</p>  
        <p type="p">120、VIN:輸入電壓源</p>  
        <p type="p">121:輸入電流</p>  
        <p type="p">122、122-1、122-2、IOUT:輸出電流</p>  
        <p type="p">130:功率轉換器</p>  
        <p type="p">131:第一電路路徑</p>  
        <p type="p">132:第二電路路徑</p>  
        <p type="p">140:控制器</p>  
        <p type="p">161:多抽頭變壓器、變壓器組合件</p>  
        <p type="p">161-C:磁芯</p>  
        <p type="p">198、N11、N12、N13、N14、N21、N22、N23、N24、N25、N26、N30、N31、N32、G:節點</p>  
        <p type="p">199:參考電壓</p>  
        <p type="p">C1、C2:電容器</p>  
        <p type="p">CFLY:飛行電容器</p>  
        <p type="p">D:汲極節點</p>  
        <p type="p">IC1、IC2:諧振電流</p>  
        <p type="p">ILZVS、IPH1、IPH2、IPH3、IPH4:電流</p>  
        <p type="p">LZVS:漏電感</p>  
        <p type="p">NP1、NP2、NS:匝數</p>  
        <p type="p">NPX:初級繞組</p>  
        <p type="p">NS、NS1、NS2:次級匝數</p>  
        <p type="p">PH1、PH2:第一抽頭節點</p>  
        <p type="p">Q1、Q2、Q3、Q4、Q5、Q6、Q7、Q8:開關</p>  
        <p type="p">S:源極節點</p>  
        <p type="p">S1、S2:控制信號</p>  
        <p type="p">VCFLY:儲存電壓</p>  
        <p type="p">VCRES1:C1兩端的DC電壓</p>  
        <p type="p">VCRES1:C2兩端的DC電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">X1、X2、X3:第一繞組、線圈</p>  
        <p type="p">Y1、Y2、Y3:第二繞組、線圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="764" publication-number="202620415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過流形學習之影像重建</chinese-title>  
        <english-title>IMAGE RECONSTRUCTION VIA MANIFOLD LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">G01N21/88</main-classification>  
        <further-classification edition="202301120260204B">G06N3/088</further-classification>  
        <further-classification edition="202401120260204B">G06T5/60</further-classification>  
        <further-classification edition="201701120260204B">G06T7/00</further-classification>  
        <further-classification edition="201701120260204B">G06T7/10</further-classification>  
        <further-classification edition="202201120260204B">G06V10/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡森堤　勞倫特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARSENTI, LAURENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊　安基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAI, ANKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫巴　拉傑西卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUPPA, RAJASEKHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利曼　羅騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITTMAN, ROTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏夫　卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARF, DROR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於影像重建之方法及系統。一種系統包含一電腦系統，該電腦系統經組態用於將針對一半導體相關樣品產生之一影像分離成小於該影像之圖塊影像。該系統亦包含一神經網路，該神經網路經組態用於將該等圖塊影像之至少一者投影至包含從訓練影像學習之特徵向量之一流形，該等訓練影像之影像品質滿足或超過預定準則。該神經網路亦從該圖塊影像在該流形上所對準至之該等特徵向量重建該圖塊影像，藉此產生具有比該經輸入圖塊影像更佳之一或多個影像品質之一經重建圖塊影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for image reconstruction are provided. One system includes a computer system configured for separating an image generated for a semiconductor-related specimen into patch images smaller than the image. The system also includes a neural network configured for projecting at least one of the patch images to a manifold that includes feature vectors learned from training images whose image quality meets or exceeds predetermined criteria. The neural network also reconstructs the patch image from the feature vectors it aligns to on the manifold thereby generating a reconstructed patch image having one or more image qualities better than the input patch image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">14:樣品</p>  
        <p type="p">16:光源</p>  
        <p type="p">18:光學元件</p>  
        <p type="p">20:透鏡</p>  
        <p type="p">22:載物台</p>  
        <p type="p">24:集光器</p>  
        <p type="p">26:元件</p>  
        <p type="p">28:偵測器</p>  
        <p type="p">30:集光器</p>  
        <p type="p">32:元件</p>  
        <p type="p">34:偵測器</p>  
        <p type="p">36:電腦系統/電腦子系統</p>  
        <p type="p">100:成像子系統</p>  
        <p type="p">102:電腦系統</p>  
        <p type="p">104:神經網路(NN)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="765" publication-number="202620880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料儲存裝置及解碼組合選擇方法</chinese-title>  
        <english-title>DATA STORAGE DEVICE AND DECODING COMBINATION SELECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G11C16/26</main-classification>  
        <further-classification edition="200601120250401B">G11C11/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李法豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FAHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料儲存裝置及解碼組合選擇方法，資料儲存裝置包括非揮發性記憶體以及處理電路，非揮發性記憶體包括多個塊，每一塊包括多個頁，解碼組合選擇方法由處理電路執行以包括：週期性地讀取非揮發性記憶體中的任一頁以更新塊狀態表中的包括該任一頁的第一塊的狀態參數；以及依據塊狀態表中第一塊的狀態參數選擇多種解碼組合的其中之一以對第一塊進行解碼；其中狀態參數包括電荷漏電程度數值、電位偏移程度數值、第一偏移電壓與第二偏移電壓、及分別對應第一偏移電壓與第二偏移電壓的第一位元數目與第二位元數目。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data storage device and a decoding combination selection method are provided, wherein the data storage device includes a non-volatile memory and a processing circuit, wherein the non-volatile memory includes a plurality of blocks, each block includes a plurality of pages, and the decoding combination selection method is executed by the processing circuit to include: periodically reading a page in the non-volatile memory to update state parameters of a first block including the page in a block status table; and selecting one of a plurality of decoding combinations according to the state parameters of the first block in the block status table to decode the first block; wherein the state parameters include a charge leakage degree value, a potential offset degree value, a first offset voltage and a second offset voltage, and a first bit number and a second bit number respectively corresponding to the first offset voltage and the second offset voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="766" publication-number="202621364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無電漿乾式蝕刻方法及用於形成半導體裝置之方法</chinese-title>  
        <english-title>PLASMALESS DRY ETCHING METHOD AND METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification>  
        <further-classification edition="200601120260223B">C23F1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林含諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元榜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUAN-BANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斌彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PINYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種無電漿乾式蝕刻方法。將包括形成於一基體上的一介電質層的一半導體結構置放在一蝕刻腔室中，以執行該無電漿乾式蝕刻方法。一主要蝕刻劑氣體、一第一氣體及一前驅物被引進該腔室中。在該蝕刻程序期間，一鈍化源係產生以阻礙該主要蝕刻劑氣及該第一氣體與該介電質層之反應產生的一第一副產物，且一第二副產物係藉由該第一氣體、該前驅物氣體及該主要蝕刻劑之間的一氣相反應產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasmaless dry etching method is provided. A semiconductor structure including a dielectric layer formed on a substrate is placed into an etching chamber to perform the plasmaless dry etching method. A main etchant gas, a first gas, and a precursor are introduced into the chamber. During the etching process, a passivation source is created to impede a first byproduct created by reaction of the main etchant gas and the first gas with the dielectric layer and a second byproduct is created by a gas phase reaction between the first gas, the precursor gas, and the main etchant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓</p>  
        <p type="p">100:無電漿化學乾式蝕刻器，無電漿化學蝕刻器，乾式蝕刻器</p>  
        <p type="p">102:腔室</p>  
        <p type="p">104:噴淋頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="767" publication-number="202620581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態偏壓緩衝器</chinese-title>  
        <english-title>DYNAMIC BIAS BUFFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G05F1/575</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞加拉　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGARRA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">茲揭露動態偏壓緩衝器的實施例。動態偏壓緩衝器包括動態電流源、輸出節點、共同閘極放大器及定電流源。電源電壓於輸出節點處產生。定電流源經構型以產生具有定電流位準的定電流。動態電流源耦接至共同閘極放大器，以便接收反饋信號，其指示通過共同閘極放大器之共同閘極放大器電流的共同閘極放大器電流位準。動態電流源為響應以根據反饋信號調整可變電流位準，以便將輸出節點處之電源電壓驅動成預定電壓位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of a dynamic bias buffer are disclosed. The dynamic bias buffer includes a dynamic current source, an output node, a common gate amplifier, and a constant current source. A power source voltage is generated at the output node. The constant current source is configured to generate a constant current with a constant current level. The dynamic current source is coupled to the common gate amplifier so as to receive a feedback signal indicative of a common gate amplifier current level of a common gate amplifier current through the common gate amplifier. The dynamic current source is responsive to adjust the variable current level in accordance with the feedback signal so as to drive the power source voltage at the output node to a predetermined voltage level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:動態偏壓緩衝器</p>  
        <p type="p">102:電池節點</p>  
        <p type="p">104:輸出節點</p>  
        <p type="p">106:動態電流源</p>  
        <p type="p">108:共同閘極放大器</p>  
        <p type="p">110:定電流源</p>  
        <p type="p">112:反饋節點</p>  
        <p type="p">114、116:P通道場效電晶體(PFET)</p>  
        <p type="p">118、124、126:電容器</p>  
        <p type="p">120、122:電阻裝置</p>  
        <p type="p">128、130:電池電壓成比例電流源(PBVCS)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="768" publication-number="202621498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109763</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/05</main-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭惟元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王茹立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種電子裝置及其製造方法。電子裝置包括基板、至少一電子單元、黏著層、絕緣層以及導電結構。基板具有至少一個凹陷。電子單元對應設置於凹陷中，且黏著層設置於電子單元與凹陷的底面之間。絕緣層設置於電子單元與凹陷上，且導電結構設置於絕緣層上並穿過絕緣層與電子單元電性連接。凹陷的表面粗糙度大於電子單元的表面粗糙度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, at least one electronic unit, an adhesive layer, an insulating layer, and a conductive structure. The substrate has at least one recess. The electronic unit is correspondingly disposed in the recess, and the adhesive is disposed between the electronic unit and a bottom surface of the recess. The insulating layer is disposed on the electronic unit and the recess, and the conductive structure is disposed on the insulating layer and penetrates through the insulating layer to be electrically connected to the electronic unit. A surface roughness of the recess is greater than a surface roughness of the electronic unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:電子裝置</p>  
        <p type="p">14:電子單元</p>  
        <p type="p">14p:接墊</p>  
        <p type="p">14S1,14S2:表面</p>  
        <p type="p">16:基板</p>  
        <p type="p">16S1:第一表面</p>  
        <p type="p">16S2:第二表面</p>  
        <p type="p">18:黏著層</p>  
        <p type="p">BS:底面</p>  
        <p type="p">D1:間距</p>  
        <p type="p">DR1,DR2,DR3:方向</p>  
        <p type="p">H1,H3:高度</p>  
        <p type="p">H2:厚度</p>  
        <p type="p">IN1:絕緣層</p>  
        <p type="p">SW1,SW2:側壁</p>  
        <p type="p">W1,W2:寬度</p>  
        <p type="p">W3:重疊寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="769" publication-number="202621018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單電感多輸出之混合切換轉換器及其控制方法</chinese-title>  
        <english-title>HYBRID SWITCHING CONVERTER WITH SINGLE INDUCTOR AND MULTIPLE OUTPUTS AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02M1/08</main-classification>  
        <further-classification edition="200601120250701B">H02M3/04</further-classification>  
        <further-classification edition="200601120250701B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯智化</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHIH-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">​一種單電感多輸出之混合切換轉換器，以將輸入電壓轉換為第一與第二輸出電壓。​其包含子切換轉換器，將輸入電壓轉換為中繼電壓；第一與第二輸出開關，分別將中繼電壓轉換為第一與第二輸出電壓。​子切換轉換器包含切換電容分壓電路，進行切換式電容操作，將第一電壓轉換為兩個不同位準之分壓；電感一端耦接於切換電容分壓電路，另一端耦接於第二電壓。​在不同組態下，電感分別耦接於第一電容的負端或正端，實現轉換為二分之一第一電壓與參考電位，或第一電壓與二分之一第一電壓。第一電壓與第二電壓分別對應輸入電壓與中繼電壓其中之一與另一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid switching converter with single inductor and multiple outputs, which converts an input voltage to two output voltages. The converter includes a sub-switching converter converting the input voltage to an intermediate voltage, and two output switches respectively converting the intermediate voltage to the two output voltages. The sub-switching converter includes a switched-capacitor voltage dividing circuit performing switched-capacitor operations to convert a first voltage to two divided voltages. An inductor has a terminal coupled to the switched-capacitor voltage dividing circuit and another terminal coupled to a second voltage. Under different configurations, the inductor is selectively coupled either to a negative or a positive terminal of a first capacitor, thereby realizing conversions between half of the first voltage and a reference potential, or between the first voltage and half of the first voltage. The first voltage and the second voltage correspond respectively to either the input voltage or the intermediate voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:單電感多輸出之混合切換轉換器</p>  
        <p type="p">21:子切換轉換器</p>  
        <p type="p">211:切換電容分壓電路</p>  
        <p type="p">213:控制電路</p>  
        <p type="p">Co1,Co2:輸出電容</p>  
        <p type="p">iL:電感電流</p>  
        <p type="p">Iout1:第一輸出電流</p>  
        <p type="p">Iout2:第二輸出電流</p>  
        <p type="p">L1:電感</p>  
        <p type="p">N1:第一端</p>  
        <p type="p">N2:第二端</p>  
        <p type="p">PWM1:第一組脈寬調變訊號</p>  
        <p type="p">PWM2:第二組脈寬調變訊號</p>  
        <p type="p">Q1,Q2,Q3,Q4:開關</p>  
        <p type="p">Q5,Q6:輸出開關</p>  
        <p type="p">S5:第一分時控制訊號</p>  
        <p type="p">S6:第二分時控制訊號</p>  
        <p type="p">SiL:電感電流訊號</p>  
        <p type="p">V1:第一電壓</p>  
        <p type="p">V2:第二電壓</p>  
        <p type="p">Vfb1:第一回授訊號</p>  
        <p type="p">Vfb2:第二回授訊號</p>  
        <p type="p">Vin:輸入電壓</p>  
        <p type="p">Vm:中繼電壓</p>  
        <p type="p">Vout1:第一輸出電壓</p>  
        <p type="p">Vout2:第二輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="770" publication-number="202621490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W40/22</main-classification>  
        <further-classification edition="202601120260223B">H10W29/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭惟元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>府玠辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHIEH-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王茹立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含電子單元以及電路結構。電路結構電性連接電子單元，電路結構包含第一導電層、第一絕緣層以及第一散熱件，第一絕緣層設置於第一導電層與電子單元之間，且第一散熱件接觸第一導電層。第一散熱件的熱傳導係數大於第一絕緣層的熱傳導係數且小於第一導電層的熱傳導係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes an electronic unit and a circuit structure. The circuit structure is electrically connected to the electronic unit. The circuit structure includes a first conductive layer, a first insulating layer and a first heat dissipation element. The first insulating layer is disposed between the first conductive layer and the electronic unit, and the first heat dissipation element contacts the first conductive layer. The thermal conductivity of the first heat dissipation element is greater than the thermal conductivity of the first insulating layer and less than the thermal conductivity of the first conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:電子裝置</p>  
        <p type="p">100:晶片</p>  
        <p type="p">102:導電墊</p>  
        <p type="p">104:絕緣層</p>  
        <p type="p">200a、200b:絕緣層</p>  
        <p type="p">202a、202b:導電層</p>  
        <p type="p">300A、300A-1、300A-2:第一散熱件</p>  
        <p type="p">300B:第二散熱件</p>  
        <p type="p">300C:第三散熱件</p>  
        <p type="p">400:封裝層</p>  
        <p type="p">402:連接元件</p>  
        <p type="p">CS:電路結構</p>  
        <p type="p">EU:電子單元</p>  
        <p type="p">FN:鰭板結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="771" publication-number="202621407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從一半導體晶圓的一或多個表面移除碎屑的方法、清洗半導體晶圓的方法及用於從半導體晶圓移除碎屑的裝置</chinese-title>  
        <english-title>METHOD OF REMOVING DEBRIS FROM ONE OR MORE SURFACES OF A SEMICONDUCTOR WAFER, METHOD OF CLEANING A SEMICONDUCTOR WAFER AND APPARATUS FOR REMOVING DEBRIS FROM A SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">B08B3/02</further-classification>  
        <further-classification edition="200601120260223B">B08B3/14</further-classification>  
        <further-classification edition="202401120260223B">B08B1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈稘翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, TE-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白睿宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, JUI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳科維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃惠琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張棠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TANG-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種發泡噴嘴裝置及用發泡清洗劑清洗半導體晶圓表面的方法。半導體處理腔室中可包括一或多個發泡噴嘴裝置，用於從晶圓表面清洗碎屑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a foaming nozzle apparatus and method of cleaning a semiconductor wafer surface with a foaming cleaning agent. One or more foaming nozzle apparatuses can be included in a semiconductor processing chamber for cleaning debris from wafer surfaces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S901~S915:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="772" publication-number="202620966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線系統及電子設備</chinese-title>  
        <english-title>AN ANTENNA SYSTEMS AND AN ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250501B">H01Q5/25</main-classification>  
        <further-classification edition="201801120250501B">H04B7/02</further-classification>  
        <further-classification edition="200601120250501B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅澤葵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, ZEKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於天線技術領域，公開了一種天線系統及電子設備，天線系統包括支撐體、第一天線和第二天線，支撐體包括第一安裝區和第二安裝區，第一安裝區具有缺口，第二安裝區位於缺口中；第一天線包括第一天線本體，第一天線本體設置於第一安裝區；第二天線包括第二天線本體，第二天線本體設置於第二安裝區，且第二天線本體與第一天線本體之間具有間隙，以形成第一天線與第二天線的淨空區，第一天線和第二天線為不同類型的天線。本發明提供的天線系統同時具有兩種類型天線的功能，且尺寸可以較小，能夠應用在對空間要求較高的電子設備中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The preset disclosure belongs to the field of antenna technology. The preset disclosure is related to an antenna system and an electronic equipment. The antenna system includes a support body, a first antenna and a second antenna. The support body includes a first installation area and a second installation area. The first installation area has a gap, and the second installation area is located in the gap. The first antenna includes a first antenna body, and the first antenna body is disposed in the first installation area. The second antenna includes a second antenna body, and the second antenna body is disposed in the second installation area. There is a gap between the second antenna body and the first antenna body to form a clearance area between the first antenna and the second antenna. The first antenna and the second antenna are different types of antennas. The antenna system provided by the preset disclosure has the functions of two types of antennas at the same time, may be smaller in size, and may be applied in an electronic equipment with high space requirements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:支撐體</p>  
        <p type="p">101:第一安裝面</p>  
        <p type="p">102:第二安裝面</p>  
        <p type="p">200:第一天線</p>  
        <p type="p">300:第二天線</p>  
        <p type="p">400:淨空區</p>  
        <p type="p">700:接地板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="773" publication-number="202621238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂增富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TSENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種半導體裝置和製造該半導體裝置的方法。該半導體裝置包括一基板；定位在該基板上的一通道層，沿著垂直於該基板的一頂部表面的一第一方向延伸，並包括一倒梯形剖面輪廓；以及一字線，該字線包括一字線介電層和一字線導電層，該字線介電層一致地和側向地環繞該通道層，該字線導電層側向地和部分地環繞該字線介電層，沿著平行於該基板的一頂部表面的一第二方向延伸，並包括一倒梯形剖面輪廓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a channel layer positioned over the substrate, extending along a first direction perpendicular to a top surface of the substrate, and including an inverted trapezoid cross-sectional profile; and a word line including a word-line dielectric layer conformally and laterally surrounding the channel layer, and a word-line conductive layer laterally and partially surrounding the word-line dielectric layer, extending along a second direction parallel to the top surface of the substrate, and including an inverted trapezoid cross-sectional profile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:基板</p>  
        <p type="p">121:介電層</p>  
        <p type="p">123:介電層</p>  
        <p type="p">125:介電層</p>  
        <p type="p">125TS:頂部表面</p>  
        <p type="p">141:中間介電層</p>  
        <p type="p">211:通道層</p>  
        <p type="p">211BS:底部表面</p>  
        <p type="p">211SW:側壁</p>  
        <p type="p">211TS:頂部表面</p>  
        <p type="p">311:位元線</p>  
        <p type="p">313:位元線接觸點</p>  
        <p type="p">410:字線</p>  
        <p type="p">411:字線導電層</p>  
        <p type="p">411BS:底部表面</p>  
        <p type="p">411TS:頂部表面</p>  
        <p type="p">413:字線介電層</p>  
        <p type="p">413TS:頂部表面</p>  
        <p type="p">A-A':線</p>  
        <p type="p">B-B':線</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W3:寬度</p>  
        <p type="p">W4:寬度</p>  
        <p type="p">W6:寬度</p>  
        <p type="p">W7:寬度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="774" publication-number="202621480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/20</main-classification>  
        <further-classification edition="202601120260223B">H10W20/44</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification>  
        <further-classification edition="202301120260223B">H10B99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種半導體裝置和製造半導體裝置的方法。該半導體裝置包括一支撐基板；以及一通道層，其平行於該支撐基板的一頂部表面，沿一第一方向延伸，並沿該第一方向依序包括一汲極、一通道和一源極。該通道的一頂部表面偏離小於其均方根粗糙度的三倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a supporting substrate; and a channel layer positioned parallel to a top surface of the supporting substrate, extending along a first direction, and including, in a sequence along the first direction, a drain, a channel, and a source. A top surface of the channel deviates less than three times its root mean square roughness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:半導體裝置</p>  
        <p type="p">111:底部阻擋層</p>  
        <p type="p">113:頂部介電層</p>  
        <p type="p">115:隔離介電層</p>  
        <p type="p">117:節點覆蓋層</p>  
        <p type="p">119:通道填充介電層</p>  
        <p type="p">121:層間介電質</p>  
        <p type="p">130:儲存節點結構</p>  
        <p type="p">150:通道層</p>  
        <p type="p">151:通道</p>  
        <p type="p">153:源極</p>  
        <p type="p">155:汲極</p>  
        <p type="p">159:界面絕緣層</p>  
        <p type="p">170:字線結構</p>  
        <p type="p">175:字線導電層</p>  
        <p type="p">175TS:頂部表面</p>  
        <p type="p">177:字線覆蓋層</p>  
        <p type="p">177TS:頂部表面</p>  
        <p type="p">179:字線介電層</p>  
        <p type="p">190:位元線</p>  
        <p type="p">210:儲存節點區域</p>  
        <p type="p">220:通道區域</p>  
        <p type="p">221:第一源極/汲極區域</p>  
        <p type="p">223:第二源極/汲極區域</p>  
        <p type="p">230:字線區域</p>  
        <p type="p">240:位元線區域</p>  
        <p type="p">250:隔離區域</p>  
        <p type="p">260:活性區域</p>  
        <p type="p">610:支撐基板</p>  
        <p type="p">A-A':線</p>  
        <p type="p">B-B':線</p>  
        <p type="p">C-C':線</p>  
        <p type="p">D-D':線</p>  
        <p type="p">E-E':線</p>  
        <p type="p">F-F':線</p>  
        <p type="p">TR1:第一層級</p>  
        <p type="p">TR2:第二層級</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="775" publication-number="202620928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻系統及蝕刻方法</chinese-title>  
        <english-title>ETCHING SYSTEM AND ETCHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">H01J37/32</main-classification>  
        <further-classification edition="200601120250422B">G05B13/04</further-classification>  
        <further-classification edition="200601120250422B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃則堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSE-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種蝕刻系統。該蝕刻系統包括一製程腔、一影像和溫度控制元件、一人工智慧控制模組。該製程腔經配置以根據一第一蝕刻配方在一第一晶圓上執行一蝕刻製程。該影像和溫度控制元件經配置以在該蝕刻製程中產生該第一晶圓的一熱影像。人工智慧控制模組經配置以判斷該熱影像是否符合一預定要求。當該熱影像不符合該預定要求時，該人工智慧控制模組經配置以根據多個參數更新該第一蝕刻配方，以產生一第二蝕刻配方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses an etching system. The etching system includes a process chamber, an image and temperature control device, and an artificial intelligence control module. The process chamber is configured to execute an etching process based on a first etching recipe on a first wafer. The image and temperature control device is configured to generate a thermal image of the first wafer during the etching process. The artificial intelligence control module is configured to determine whether the thermal image is compliant with a predetermined requirement. When the thermal image is not compliant with the predetermine requirement, the artificial intelligence control module is configured to update the first etching recipe according to the plurality of parameters so as to generate a second etching recipe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:蝕刻系統</p>  
        <p type="p">100:製程腔</p>  
        <p type="p">200:製程控制元件</p>  
        <p type="p">300:人工智慧(AI)控制模組</p>  
        <p type="p">400:測量元件</p>  
        <p type="p">500:影像和溫度控制元件</p>  
        <p type="p">PM:參數</p>  
        <p type="p">PR:預定要求</p>  
        <p type="p">R1:蝕刻配方</p>  
        <p type="p">R2:蝕刻配方</p>  
        <p type="p">S1:第一狀態</p>  
        <p type="p">S2:第二狀態</p>  
        <p type="p">THI:熱影像</p>  
        <p type="p">TP:溫度資訊</p>  
        <p type="p">W1:晶圓</p>  
        <p type="p">W2:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="776" publication-number="202620109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於合成再生塑膠的單體的製備方法</chinese-title>  
        <english-title>PREPARATION METHOD OF MONOMER FOR SYNTHESISING RECYCLED PLASTIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">C08J11/16</main-classification>  
        <further-classification edition="200601120250801B">C08J11/24</further-classification>  
        <further-classification edition="200601120250801B">C08G64/30</further-classification>  
        <further-classification edition="200601120250801B">C07C37/50</further-classification>  
        <further-classification edition="200601120250801B">C07C37/74</further-classification>  
        <further-classification edition="200601120250801B">C07C37/84</further-classification>  
        <further-classification edition="200601120250801B">C07C39/16</further-classification>  
        <further-classification edition="200601120250801B">C08L69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎭赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JINHYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田炳圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, BYOUNGKUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, MOOHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴泰承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, TAE SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玟周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於合成再生塑膠的單體的製備方法，所述方法包括以下步驟：回收由聚碳酸酯基樹脂解聚反應得到的芳香族二醇化合物的步驟；熔融芳香族二醇化合物的步驟；使熔融的芳香族二醇化合物結晶的步驟；以及獲得結晶的芳香族二醇化合物的步驟，以及使用其之用於合成再生塑膠的單體、再生塑膠與模製物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a preparation method of a monomer for synthesizing recycled plastic, the method comprising the steps of: a step of recovering an aromatic diol compound obtained from the depolymerization reaction of a polycarbonate-based resin; a step of melting the aromatic diol compound; a step of crystallizing the melted aromatic diol compound; and a step of obtaining the crystallized aromatic diol compound, and a monomer for synthesizing recycled plastic, a recycled plastic and a molded product using the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="777" publication-number="202620479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置封裝及其形成方法</chinese-title>  
        <english-title>DEVICE PACKAGE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B6/12</main-classification>  
        <further-classification edition="200601120260223B">G02B6/34</further-classification>  
        <further-classification edition="200601120260223B">G02B5/12</further-classification>  
        <further-classification edition="200601120260223B">G02B6/13</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, TZU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括光柵耦接器及與光柵耦接器相鄰的介電栓塞。介電栓塞界定光信號路徑，光信號經由該光信號路徑傳播至光柵耦接器。為了提供對光信號的增加的限制從而減少散射並減少與其他光信號的串音，在介電栓塞之周邊周圍包括反射器結構。反射器結構由光反射材料形成，諸如一或多個金屬材料。反射器結構可藉由使光信號朝向光柵耦接器反射來降低光信號散射至介電栓塞周圍的半導體裝置層中的可能性。另外及/或其他，反射器結構可藉由使其他光信號反射遠離光柵耦接器來降低光信號由其他光信號干擾的可能性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a grating coupler and a dielectric plug adjacent to the grating coupler. The dielectric plug defines an optical signal path through which optical signals propagate to the grating coupler. To provide increased confinement of optical signals so as to reduce scattering and reduce crosstalk with other optical signals, a reflector structure is included around the perimeter of the dielectric plug. The reflector structure is formed of an optically reflective material such as one or more metal materials. The reflector structure may reduce the likelihood of scattering of the optical signal into the layers of the semiconductor device around the dielectric plug by reflecting the optical signal toward the grating coupler. Additionally and/or alternatively, the reflector structure may reduce the likelihood of other optical signals interfering with the optical signal by reflecting the other optical signals away from the grating coupler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例實施例</p>  
        <p type="p">102:裝置封裝</p>  
        <p type="p">104,106:IC晶粒</p>  
        <p type="p">108:光柵耦接器</p>  
        <p type="p">110:接合介面</p>  
        <p type="p">112,114:接合介電層</p>  
        <p type="p">116,118:接合結構</p>  
        <p type="p">120a,120b:介電填充層</p>  
        <p type="p">122,124,126,128,130:鈍化層</p>  
        <p type="p">132a,132b:基板</p>  
        <p type="p">134a,134b:ILD層</p>  
        <p type="p">136a,136b:IC裝置</p>  
        <p type="p">138a,138b:觸點</p>  
        <p type="p">140a,140b:ILD層</p>  
        <p type="p">142a,142b:ESL</p>  
        <p type="p">144a,144b:導電結構</p>  
        <p type="p">146a,146b:密封環結構</p>  
        <p type="p">148a,148b:鈍化層</p>  
        <p type="p">150a,150b:金屬墊結構</p>  
        <p type="p">152a,152b:金屬墊結構</p>  
        <p type="p">154a,154b:鈍化層</p>  
        <p type="p">156:介電層</p>  
        <p type="p">158a,158b:接合墊</p>  
        <p type="p">160:貫穿基板互連結構</p>  
        <p type="p">162:連接結構</p>  
        <p type="p">164:介電栓塞</p>  
        <p type="p">166:入射光</p>  
        <p type="p">168:反射器結構</p>  
        <p type="p">x,z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="778" publication-number="202620107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>印刷配線板用預浸體、印刷配線板用覆金屬積層板及印刷配線板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08J5/24</main-classification>  
        <further-classification edition="200601120260209B">H05K1/03</further-classification>  
        <further-classification edition="200601120260209B">B32B15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新居大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NII, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉置周平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAOKI, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一情況係一種印刷配線板用預浸體，其相對於包含選自於由在分子中具有碳-碳不飽和雙鍵的聚苯醚化合物、在分子中具有碳-碳不飽和雙鍵的烴系化合物及在分子中具有氟原子的熱固性化合物所構成的群組之至少1種之熱固性化合物100質量份，具備：包含將選自於由二氧化矽、石英玻璃及氧化鎂所構成的群組之至少1種作為材質包含的無機填充材65質量份以上之熱固性組成物或前述熱固性組成物之半硬化物，以及包含在25℃下於5GHz中的介電損耗正切在0.0015以下之液晶聚合物纖維之纖維質基材，且於前述纖維質基材之表面上，藉由X射線光電子能譜法測量之各基團之存在比為指定的關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:預浸體</p>  
        <p type="p">2:硬化物</p>  
        <p type="p">3:纖維質基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="779" publication-number="202621481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有階梯狀字元線介電材料的半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH STEPPED WORD LINE DIELECTRIC AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/20</main-classification>  
        <further-classification edition="202601120260223B">H10W20/43</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202301120260223B">H10B99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭露一種半導體元件及一種半導體元件的製造方法。此半導體元件包括：一通道層，包括：一通道，沿著一第一方向延伸並且包括一第一區及一第二區，沿著該第一方向依序排列；一源極，從該第二區沿著該第一方向延伸；以及一汲極，從該第一區沿著該第一方向的反方向延伸；以及一字元線結構，包括：一內部字元線介電層，圍繞該通道的該第一區；一外部字元線介電層，圍繞該通道的該第二區及該內部字元線介電層；以及一字元線導電層，圍繞該外部字元線介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a channel layer including a channel extending along a first direction and including a first region and a second region in sequence along the first direction, a source extending from the second region along the first direction, and a drain extending from the first region in inverse of the first direction; and a word line structure including an inner word line dielectric layer surrounding the first region of the channel, an outer word line dielectric layer surrounding the second region of the channel and the inner word line dielectric layer, and a word line conductive layer surrounding the outer word line dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:半導體元件</p>  
        <p type="p">113:頂部介電層</p>  
        <p type="p">115:隔離介電層</p>  
        <p type="p">119:通道填充介電層</p>  
        <p type="p">121:層間介電材料</p>  
        <p type="p">130:儲存節點結構</p>  
        <p type="p">170:字元線結構</p>  
        <p type="p">190:位元線</p>  
        <p type="p">210:儲存節點區</p>  
        <p type="p">220:通道區</p>  
        <p type="p">221:第一源極/汲極區</p>  
        <p type="p">223:第二源極/汲極區</p>  
        <p type="p">230:字元線區</p>  
        <p type="p">231:第一區</p>  
        <p type="p">233:第二區</p>  
        <p type="p">240:位元線區</p>  
        <p type="p">250:隔離區</p>  
        <p type="p">260:主動區</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="780" publication-number="202619740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羅伊氏乳酸桿菌羅伊氏亞種LR1349分離株及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251205B">A61K35/747</main-classification>  
        <further-classification edition="200601120251205B">A61P27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生合生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNBIO TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳啟豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許涵茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珈嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-SENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一株羅伊氏乳酸桿菌羅伊氏亞種LR1349，它以寄存編號BCRC 911241被寄存於財團法人食品工業發展研究所(FIRDI)的生物資源保存及研究中心(BCRC)。該羅伊氏乳酸桿菌羅伊氏亞種LR1349分離株可被用來改善藍光-誘發的視網膜損傷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="781" publication-number="202620188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>長雙歧桿菌菌株及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">C12N1/20</main-classification>  
        <further-classification edition="201501120260223B">A61K35/745</further-classification>  
        <further-classification edition="200601120260223B">A61P27/02</further-classification>  
        <further-classification edition="201601120260223B">A23L33/135</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生合生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNBIO TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
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              <chinese-name name-type="organization"> 
                <last-name>吳啟豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許涵茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珈嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林金生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-SENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種長雙歧桿菌菌株，其是選自於由下列所構成之群組：長雙歧桿菌長亞種BL1363，它以寄存編號BCRC 911238被寄存於財團法人食品工業發展研究所的生物資源保存及研究中心；以及長雙歧桿菌長亞種BL531，它以寄存編號BCRC 911239被寄存於財團法人食品工業發展研究所的生物資源保存及研究中心。該長雙歧桿菌菌株可被用來改善藍光-誘發的視網膜損傷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="782" publication-number="202621408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>目標晶圓修復裝置</chinese-title>  
        <english-title>TARGET WAFER REPAIRING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　曉萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAOMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂定勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, DING-SHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳廣行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅唯仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供目標晶圓修復裝置。目標晶圓修復裝置包括配置用於載入目標晶圓的腔室，以及配置用於發射一個或多個子束以照射目標晶圓修復區域的粒子束源。修復裝置還包括配置用於向目標晶圓修復區域注入前驅氣體以修復目標晶圓修復區域中缺陷的至少一個氣體入口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A target wafer repairing apparatus is provided. The target wafer repairing apparatus includes a chamber configured to load a target wafer, and a particle beam source configured to emit one or more beamlets to irradiate a repair region of the target wafer. The repairing apparatus further includes at least one gas inlet configured to inject a precursor gas to the repair region of the target wafer to repair defects in the repair region of the target wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:修復裝置</p>  
        <p type="p">102a:腔室出口</p>  
        <p type="p">102:腔室</p>  
        <p type="p">104a:噴射頭</p>  
        <p type="p">104:粒子束源</p>  
        <p type="p">106:子束</p>  
        <p type="p">108:電極對</p>  
        <p type="p">110:氣體入口</p>  
        <p type="p">110a:前驅氣體氣流</p>  
        <p type="p">112a:偵測光束</p>  
        <p type="p">112b:反射光束</p>  
        <p type="p">112:偵測光束產生器</p>  
        <p type="p">114:偵測器</p>  
        <p type="p">116a:修復區域</p>  
        <p type="p">116:目標晶圓</p>  
        <p type="p">118:晶圓台</p>  
        <p type="p">120:真空泵系統</p>  
        <p type="p">150:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="783" publication-number="202621297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621297.zip"/>
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    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置封裝和其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10D80/00</main-classification>  
        <further-classification edition="202601120260223B">H10W76/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田子容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, TZU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在裝置封裝內的堆疊配置中，第一積體電路晶粒和第二積體電路晶粒接合在一起。第二積體電路晶粒包括結合至第一積體電路晶粒的至少一個接合結構。在形成接合結構之後，接合結構的頂部的側壁上的阻障層被移除，且阻障層由形成於側壁上的介電質內襯取代。介電質內襯的材料移除速率(用於例如化學機械平坦化、研磨及/或化學表面清洗的製程)比阻障內襯的材料移除速率更接近接合結構的材料移除速率。若從接合結構移除太多材料可能會產生空洞，而上述結構可以減少在第一積體電路晶粒與第二積體電路晶粒之間的接合中形成這樣的空洞的可能性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first integrated circuit (IC) die and a second IC die are bonded together in a stacked arrangement in a device package. The second IC die includes at least one bonding structure that is bonded to the first IC die. A barrier layer on sidewalls of a top portion of the bonding structure is removed and replaced with a dielectric liner that is formed on the sidewalls after the bonding structure is formed. The dielectric liner has a material removal rate (e.g., for processes such as CMP, grinding, and/or chemical-based surface cleaning) that is closer to the material removal rate of the bonding structure than the material removal rate of the barrier liner. This reduces the likelihood of the formation of voids in the bond between the first IC die and the second IC die that might otherwise occur due to excessive material removal from the bonding structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例</p>  
        <p type="p">102:半導體晶粒封裝</p>  
        <p type="p">106:積體電路晶粒</p>  
        <p type="p">112:接合介電層</p>  
        <p type="p">134b:層間介電層</p>  
        <p type="p">136b:蝕刻停止層</p>  
        <p type="p">138b:導電結構</p>  
        <p type="p">142b,144b:鈍化層</p>  
        <p type="p">146b:金屬襯墊結構</p>  
        <p type="p">150b:介電層</p>  
        <p type="p">156:接合通孔</p>  
        <p type="p">158:接合襯墊</p>  
        <p type="p">166:部分</p>  
        <p type="p">168:通孔部分</p>  
        <p type="p">170:溝槽部分</p>  
        <p type="p">172:阻障內襯</p>  
        <p type="p">174:介電質內襯</p>  
        <p type="p">176:阻障內襯</p>  
        <p type="p">178:介電質內襯</p>  
        <p type="p">180:接合結構</p>  
        <p type="p">A-A:線</p>  
        <p type="p">D1,D2,D3:尺寸</p>  
        <p type="p">x,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="784" publication-number="202620802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>駕駛疲勞監控方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250630B">G06V20/59</main-classification>  
        <further-classification edition="202201120250630B">G06V40/16</further-classification>  
        <further-classification edition="201201120250630B">B60W40/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商信利半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRULY SEMICONDUCTORS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王治璽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昕愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種駕駛疲勞監控方法，在採用人臉檢測對駕駛圖像進行特徵提取的基礎上，引入了人臉位置預測，並根據人臉預測位置的預測置信度確定是採用人臉檢測對所述駕駛圖像進行特徵提取，還是採用人臉預測對所述駕駛圖像進行特徵提取，只有當所述人臉預測位置的預測置信度未達到置信閾值時，才採用人臉預測對所述駕駛圖像進行特徵提取，減少了採用人臉預測對所述駕駛圖像進行特徵提取的次數，進而節省了算力和時間。本發明還公開了一種實現上述駕駛疲勞監控方法的裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="785" publication-number="202621386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體晶圓基板的相關化學機械拋光系統的漿體臂</chinese-title>  
        <english-title>SLURRY ARM FOR AN ASSOCIATED CHEMICAL POLISHING SYSTEM FOR SEMICONDUCTING WAFER SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白睿宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, JUI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張棠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TANG-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈稘翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池芳儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, FANG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, TE-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種用於半導體晶圓基板的相關化學機械拋光系統的漿體臂，漿體臂包括：漿體臂主體；該漿體臂主體的長度方向設置的複數個孔；控制漿體流經該些孔中的每個孔的閥；及設置以打開或關閉每個閥的控制器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slurry arm for an associated chemical mechanical polishing (CMP) system for semiconducting wafer substrates includes a slurry arm main body; a plurality of holes disposed along a length of the slurry arm main body; a valve controlling slurry flow through each hole of the plurality of holes; and a controller configured to open or close each valve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:拋光台板</p>  
        <p type="p">124:軸</p>  
        <p type="p">130:拋光墊</p>  
        <p type="p">168:控制器</p>  
        <p type="p">300:漿體臂</p>  
        <p type="p">302:控制電路</p>  
        <p type="p">305:箭頭</p>  
        <p type="p">310:漿體臂主體</p>  
        <p type="p">311:長度</p>  
        <p type="p">312:近端</p>  
        <p type="p">314:遠端</p>  
        <p type="p">315:高度</p>  
        <p type="p">316:支撐軸</p>  
        <p type="p">320:孔</p>  
        <p type="p">340:控制器閥</p>  
        <p type="p">342:供應管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="786" publication-number="202620869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及記憶體內計算的操作方法</chinese-title>  
        <english-title>MEMORY SYSTEM AND OPERATION METHOD OF IN-MEMORY COMPUTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250811B">G11C11/54</main-classification>  
        <further-classification edition="200601120250811B">G11C11/40</further-classification>  
        <further-classification edition="200601120250811B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, BO-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡瀚文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體系統包含儲存控制器、記憶體、第一級過濾器及第二級過濾器。儲存控制器用以接收一第一階段結果。記憶體用以對該第一階段結果進行記憶體內運算以產生一第二階段結果。第一級過濾器用以過濾第二階段結果以產生一第三階段結果。第二級過濾器用以過濾第三階段結果以產生一第四階段結果。當第三階段結果中的多個資料結果的一數量大於一預設臨界數量時，記憶體系統輸出第四階段結果，以及當第三階段結果中的資料結果的數量小於或等於預設臨界數量時，記憶體系統輸出第三階段結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system includes a storage controller, a memory, a first level filter and a second level filter. The storage controller configured to receive a first stage result. The memory configured to perform in-memory computing to the first stage result, to generate a second stage result. The first level filter configured to filter the second stage result to generate a third stage result. The second level filter configured to filter the third stage result to generate a fourth stage result. When a quantity of data results in the third stage result is larger than a predetermined threshold quantity, the memory system outputs the fourth stage result, and when the quantity of the data results in the third stage result is smaller than or equal to the predetermined threshold quantity, the memory system outputs the third stage result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DS2、DS4、DS5:階段結果</p>  
        <p type="p">200:系統</p>  
        <p type="p">210:處理裝置</p>  
        <p type="p">220:儲存系統</p>  
        <p type="p">221:儲存控制器</p>  
        <p type="p">222:記憶體</p>  
        <p type="p">MC1~MC4:記憶體晶片</p>  
        <p type="p">FLF1~FLF4:第一級過濾器</p>  
        <p type="p">SLF1:第二級過濾器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="787" publication-number="202621506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有橢圓形電力遞送墊之電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICES HAVING OVAL POWER DELIVERY PADS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/62</main-classification>  
        <further-classification edition="202001120260223B">G06F30/31</further-classification>  
        <further-classification edition="202001320260223B">G06F115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿爾特拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTERA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡笙　梅德　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSAIN, MD ALTAF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪西斯瓦里　亞圖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, ATUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪希卡　瑪赫許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMASHIKAR, MAHESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉馬爾普　安基瑞迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALAMALPU, ANKIREDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科魯魯　克里希納　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLLURU, KRISHNA BHARATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括形成於該電子裝置之一表面上之導電墊。該等導電墊中之各者具有一橢圓形形狀。該等導電墊經耦接以在一外部裝置與該電子裝置之間遞送一電源電壓或一接地電壓中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes conductive pads that are formed on a surface of the electronic device. Each of the conductive pads has an oval shape. The conductive pads are coupled to deliver at least one of a power supply voltage or a ground voltage between an external device and the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">101:第一矩形區</p>  
        <p type="p">102:第二矩形區</p>  
        <p type="p">111,112,113,114:導電墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="788" publication-number="202621270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/01</main-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露實施例提供一種半導體裝置結構及其形成方法。半導體裝置結構包括第一源極/汲極區、第二源極/汲極區，設置相鄰於第一源極/汲極區、以及接觸蝕刻停止層，設置於第一源極/汲極區之上。第一源極/汲極區的第一頂表面被接觸蝕刻停止層覆蓋。結構更包括第一導電部件，設置於第一與第二源極/汲極區之下，且第一導電部件電性連接至第一與第二源極/汲極區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The semiconductor device structure includes a first source/drain region, a second source/drain region disposed adjacent the first source/drain region, and a contact etch stop layer disposed over the first source/drain region. A top surface of the first source/drain region is covered by the contact etch stop layer. The structure further includes a first conductive feature disposed below the first and second source/drain regions, and the first conductive feature is electrically connected to the first and second source/drain regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">118:絕緣材料</p>  
        <p type="p">146s,146s1,146s2:源極區</p>  
        <p type="p">146d,146d1,146d2:汲極區</p>  
        <p type="p">172:閘極電極層</p>  
        <p type="p">232,232d,232e,232f,256,262:導電部件</p>  
        <p type="p">260:介電層</p>  
        <p type="p">L1,L2:假想線</p>  
        <p type="p">X,Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="789" publication-number="202621303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/83</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仕傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的半導體結構包括背側金屬線以及背側接觸件結構，所述背側接觸件結構包括設置在背側金屬線上的條狀部分、從條狀部分延伸的第一導孔、從條狀部分延伸的第二導孔、以及設置在第一導孔與第二導孔之間的突起物。所述半導體結構還包括位於第一導孔上方的第一源極/汲極部件、位於第二導孔上方的第二源極/汲極部件、以及設置在第一導孔與第二導孔之間的閘極隔離部件。所述突起物延伸至閘極隔離部件之中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure according to the present disclosure includes a backside metal line and a backside contact structure that includes a bar portion disposed on the backside metal line, a first via extending from the bar portion, a second via extending from the bar portion, and a protrusion disposed between the first via and the second via. The semiconductor structure also includes a first source/drain feature over the first via, a second source/drain feature over the second via, and a gate isolation feature disposed between the first via and the second via. The protrusion extends into the gate isolation feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:隔離部件</p>  
        <p type="p">109:接觸蝕刻停止層、CESL</p>  
        <p type="p">111:閘極間隔物</p>  
        <p type="p">113、117:層間介電層、ILD層</p>  
        <p type="p">115、145:蝕刻停止、ESL</p>  
        <p type="p">137、138:源極</p>  
        <p type="p">121:閘極隔離部件</p>  
        <p type="p">131:襯層</p>  
        <p type="p">132:金屬填充物、共同接觸件</p>  
        <p type="p">133:頂部ESL</p>  
        <p type="p">135、147:金屬間介電層、IMD層</p>  
        <p type="p">139:矽化物層</p>  
        <p type="p">141、149:接觸件導孔</p>  
        <p type="p">143:前側金屬線</p>  
        <p type="p">164:金屬填充物、背側接點接觸件</p>  
        <p type="p">164-1、164-2:導孔</p>  
        <p type="p">164B:條狀部分</p>  
        <p type="p">166:矽化物部件</p>  
        <p type="p">168:突起物</p>  
        <p type="p">170:背側絕緣層</p>  
        <p type="p">172:背側金屬線</p>  
        <p type="p">200:前驅體結構、半導體結構</p>  
        <p type="p">D1、D2、D3:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="790" publication-number="202619984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗水製造裝置及清洗水製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">C02F1/66</main-classification>  
        <further-classification edition="202301120260223B">C02F1/68</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顔暢子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, NOBUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清洗水製造裝置，在超純水中添加包含pH調整劑及/或氧化還原電位調整劑的藥劑來製造一定濃度的清洗水，所述清洗水製造裝置中，自所述藥劑的添加位置至清洗水製造裝置出口的清洗水的滯留時間為30秒以上。一種清洗水製造方法，使用清洗水製造裝置，在超純水中添加包含pH調整劑及/或氧化還原電位調整劑的藥劑來製造一定濃度的清洗水，所述清洗水製造方法中，將自所述藥劑的添加位置至清洗水製造裝置出口的清洗水的滯留時間設為30秒以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、5、6、8:配管</p>  
        <p type="p">2:罐</p>  
        <p type="p">3:藥液罐</p>  
        <p type="p">4:藥液注入泵</p>  
        <p type="p">7:過濾器</p>  
        <p type="p">9:溶質濃度管理監視器</p>  
        <p type="p">A:連接點/點</p>  
        <p type="p">B:設置溶質濃度管理監視器的位置/設置溶質濃度管理監視器的點/點</p>  
        <p type="p">L:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="791" publication-number="202619985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於膜蒸餾程序之保護試劑</chinese-title>  
        <english-title>PROTECTING REAGENT FOR MEMBRANE DISTILLATION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260210B">C02F1/68</main-classification>  
        <further-classification edition="202301120260210B">C02F5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商埃科萊布美國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECOLAB USA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　宇攀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, IVAN YUPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種水處理組成物，其包含(a)螯合劑，其包含至少兩個羧酸基團；(b)聚合物分散劑；及(c)還原劑，其包含亞硫酸鹽。亦提供一種在用於自水中移除氨之膜蒸餾程序中減少膜積垢之方法及一種使用膜蒸餾系統降低工業廢水中氨含量之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a water treatment composition comprising (a) a chelating agent comprising at least two carboxylate groups; (b) a polymer dispersant; and (c) a reducing agent comprising a sulfite. Also provided is a method of reducing fouling of a membrane in a membrane distillation process for removing ammonia from water and a method of reducing ammonia content in industrial wastewater using a membrane distillation system.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="792" publication-number="202621536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置封裝及製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W76/01</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W20/43</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification>  
        <further-classification edition="202601120260223B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括形成封裝結構，其中形成封裝結構包括附接多個晶粒到載體基板，進行密封製程以使密封劑環繞多個晶粒，以及形成重分佈結構在多個晶粒和密封劑上。重分佈結構電連接到多個晶粒，其中重分佈結構以俯視觀之具有矩形形狀，其中矩形形狀具有具有第一寬度的第一平行邊和具有第二寬度的第二平行邊，其中第一寬度和第二寬度中至少一個大於212毫米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a package structure, where forming the package structure includes attaching a plurality of dies to a carrier substrate, performing an encapsulation process to surround the plurality of dies with an encapsulant, and forming a redistribution structure over the plurality of dies and the encapsulant. The redistribution structure is electrically connected to the plurality of dies, where the redistribution structure has a rectangular shape when seen in a top-down view, where the rectangular shape has first parallel edges having a first width, and second parallel edges having a second width, where at least one of the first width and the second width is greater than 212 mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝結構</p>  
        <p type="p">112:重分佈結構</p>  
        <p type="p">162:第一區</p>  
        <p type="p">W1、W2、W3、W4:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="793" publication-number="202620530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光圈製備方法、光圈、攝像模組及電子設備</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING APERTURE, APERTURE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250417B">G03B9/02</main-classification>  
        <further-classification edition="202101120250417B">G03B9/06</further-classification>  
        <further-classification edition="202101120250417B">G03B30/00</further-classification>  
        <further-classification edition="202301120250417B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例公開了一種光圈製備方法、光圈、攝像模組及電子設備，該方法包括：獲取光圈的光圈檔位、轉子運動參數、導向柱位置和葉片參數；根據光圈檔位、轉子運動參數、導向柱位置或者葉片參數中的至少一項確定導向槽路徑；獲取預設傾轉角規格；在導向槽路徑與導向柱位置之間的路徑傾角不符合預設傾轉角規格時，對導向槽路徑進行分段，建立至少兩個子圓弧段，並在相鄰兩個子圓弧段之間採用G3連續設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a method for manufacturing aperture, an aperture, a camera module and an electronic device. The method comprises: obtaining a aperture shift, a rotor motion parameter, a guide column position and a blade parameter of the aperture; determining a guide groove route according to at least one of the aperture shift, the rotor motion parameter, the guide column position and the blade parameter; obtaining a preset tilt angle; if a route tilt angle between the guide groove route and the guide column position being unequal to the preset tilt angle, dividing the guide groove route, establishing at least two sub-arc segments, and adopting a G3 continuous design between two adjacent sub-arc segments. The present invention can improve dynamic performance of the aperture guide groove, avoid blade rotation stuck and torque oscillation caused by discontinuity of the curvature and curvature radius of the guide groove, and improve the aperture design effect by dividing the blade guide groove route and adopting G3 continuous design between different sub-arc segments. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="794" publication-number="202620849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及其操作方法</chinese-title>  
        <english-title>MEMORY CIRCUIT AND METHOD OF OPERATING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C7/06</main-classification>  
        <further-classification edition="200601120251103B">G11C7/12</further-classification>  
        <further-classification edition="200601120251103B">G11C7/22</further-classification>  
        <further-classification edition="200601120251103B">G11C11/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野智比古</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路，其包括記憶體單元；位元線；互補位元線；耦接至記憶體單元及位元線的通道閘電晶體；耦接至位元線、互補位元線、及通道閘電晶體的感測放大器；以及耦接至第一節點並用以回應於預充電控制信號將第一節點預充電至預充電電壓的預充電電路。感測放大器包括在位元線與互補位元線之間的第一路徑。第一路徑包括用以接收隔離控制信號並耦接在位元線與第一節點之間的第一隔離電晶體；以及用以接收感測放大器啟用信號並耦接在第二節點與第三節點之間的第二反向器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a memory cell, a bit line, a bit line bar, a pass-gate transistor coupled to the memory cell and the bit line, a sense amplifier coupled to the bit line, the bit line bar and the pass-gate transistor, and a pre-charge circuit coupled to the first node, and configured to pre-charge the first node to a pre-charge voltage in response to a pre-charge control signal. The sense amplifier includes a first path between the bit line and the bit line bar. The first path includes a first isolation transistor configured to receive an isolation control signal, and being coupled between the bit line and a first node, and a first inverter configured to receive a sense amplifier enable signal, and being coupled between a second node and a third node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體電路</p>  
        <p type="p">100BL:GIO電路</p>  
        <p type="p">100GC:全域控制電路</p>  
        <p type="p">102A~102D:記憶體分區</p>  
        <p type="p">110AC:WL驅動器電路</p>  
        <p type="p">110AR:記憶體單元陣列</p>  
        <p type="p">110BS:LIO電路</p>  
        <p type="p">110L:記憶庫</p>  
        <p type="p">110LC:區域控制電路</p>  
        <p type="p">110U:記憶庫</p>  
        <p type="p">112:記憶體單元</p>  
        <p type="p">114:電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="795" publication-number="202621177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及應用於支援窄頻物聯網的電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR APPLICATION IN ELECTRONIC DEVICE SUPPORTING NB-IOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250502B">H04W74/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鳳翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FENGXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐穎群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YINGQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒲俊瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, JYUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種應用於支援窄頻物聯網的一電子裝置的方法，其包含有以下步驟：選取一代價函數；模擬出一目標中心頻點上該代價函數的一第一機率密度函數、該目標中心頻點之一第一相鄰中心頻點上該代價函數的一第二機率密度函數、該目標中心頻點之一第二相鄰中心頻點上該代價函數的一第三機率密度函數、以及一純雜訊中心頻點上該代價函數的一第四機率密度函數；以及根據該第一、第二、第三、第四機率密度函數以計算出該電子裝置成功偵測到來自一基地台之一訊框之該目標中心頻點的機率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method applied to an electronic device supporting NB-IoT, which includes the following steps: selecting a cost function; simulating calculating a first probability density function of the cost function at a target center frequency, a second probability density function of the cost function at a first adjacent center frequency of the target center frequency, a third probability density function of the cost function at a second adjacent center frequency of the target center frequency, and a fourth probability density function of the cost function at a pure noise center frequency; and calculating a probability that the electronic device successfully detects the target center frequency of a frame from a cell based on the first probability density function, the second probability density function, the third probability density function and the fourth probability density function.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200~206:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="796" publication-number="202620870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其操作方法以及記憶體內運算裝置</chinese-title>  
        <english-title>MEMORY DEVICE, OPERATING METHOD THEREOF AND PROCESSING-IN-MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C11/54</main-classification>  
        <further-classification edition="200601120251001B">G06N3/06</further-classification>  
        <further-classification edition="200601120251001B">G06F9/28</further-classification>  
        <further-classification edition="200601120251001B">G06F17/16</further-classification>  
        <further-classification edition="200601120251001B">G06T1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宣政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉載勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JAEHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李碩漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUK HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車相薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓圓鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, WONTAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置包括被組配來執行在由權重比例因數及權重元素表示之權重值與由輸入比例因數及輸入元素表示之輸入值間之運算的記憶體內運算(PIM)區塊，該PIM區塊包括：儲存該輸入比例因數的第一比例暫存器檔案；儲存該權重比例因數的第二比例暫存器檔案；儲存該輸入元素的純量暫存器檔案(SRF)；被組配來回應於接收自主機之運算命令而並行地執行在該輸入比例因數與該權重比例因數間之第一運算以及在該輸入元素與該權重元素間之第二運算的複數個算術邏輯單元(ALU)；以及被組配來累加及儲存來自該第一運算及該第二運算的運算結果的累加器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a processing-in-memory (PIM) block configured to perform an operation between a weight value, which is represented by a weight scale factor and a weight element, and an input value, which is represented by an input scale factor and an input element, wherein the PIM block includes a first scale register file storing the input scale factor, a second scale register file storing the weight scale factor, a scalar register file (SRF) storing the input element, a plurality of arithmetic logic units (ALUs) configured to, in response to an operation command received from a host, perform, in parallel, a first operation between the input scale factor and the weight scale factor and a second operation between the input element and the weight element, and an accumulator configured to accumulate and store an operation result from the first operation and the second operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121:PIM區塊</p>  
        <p type="p">122:記憶體組</p>  
        <p type="p">200a:記憶體裝置</p>  
        <p type="p">210:控制電路</p>  
        <p type="p">230:暫存器檔案</p>  
        <p type="p">231:第一比例暫存器檔案</p>  
        <p type="p">232:第二比例暫存器檔案</p>  
        <p type="p">235:純量暫存器檔案</p>  
        <p type="p">237:向量暫存器檔案</p>  
        <p type="p">250:ALU</p>  
        <p type="p">251:第一ALU</p>  
        <p type="p">252:第二ALU</p>  
        <p type="p">257:累加器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="797" publication-number="202619957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種磁性感測器組件</chinese-title>  
        <english-title>A MAGNETIC SENSOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B65G54/02</main-classification>  
        <further-classification edition="200601120260223B">G01D5/14</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification>  
        <further-classification edition="201601120260223B">H02K11/215</further-classification>  
        <further-classification edition="200601120260223B">H02K41/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮漢　克萊門斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIHAN, CLEMENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗戈夫　史芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANGHOFF, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">磁性感測器包括基座、至少一個磁鐵、第一感測元件和第二感測元件。該基座包括第一側和第二側。至少一個磁鐵設置在基座的第一側上，該至少一個磁鐵產生磁通。第一感測元件和第二感測元件設置在第二側上，其中第一感測元件和第二感測元件經配置用來測量磁通密度，而由至少一個磁鐵產生的磁通經配置為沿第一方向通過第一感測元件，並沿與第一方向相反的第二方向通過第二感測元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic sensor comprises a base, at least one magnet, a first sensor element, and a second sensor element. The base including a first side and a second side. The at least one magnet disposed over the first side of the base, the at least one magnet generating magnetic flux. The first sensor element and the second sensor element being disposed over the second side, wherein the first sensor element and second sensor element are configured to measure magnetic flux density, and the magnetic flux generated by the at least one magnet is configured to pass through the first sensor element in a first direction and pass through the second sensor element in a second direction that is opposite to the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:載體</p>  
        <p type="p">206:膜</p>  
        <p type="p">207:第一區域</p>  
        <p type="p">208:第二區域</p>  
        <p type="p">211:底面</p>  
        <p type="p">260:無特徵元件</p>  
        <p type="p">261:上表面</p>  
        <p type="p">271:間隙</p>  
        <p type="p">400:磁性感測器</p>  
        <p type="p">401:縱向軸</p>  
        <p type="p">410:基座/PCB</p>  
        <p type="p">411:第一側</p>  
        <p type="p">412:第二側</p>  
        <p type="p">430:磁鐵</p>  
        <p type="p">431a:第一可用場部分</p>  
        <p type="p">431b:第二可用場部分</p>  
        <p type="p">432:磁場</p>  
        <p type="p">450a:第一感測元件</p>  
        <p type="p">450b:第二感測元件</p>  
        <p type="p">490:向量</p>  
        <p type="p">491:x分量</p>  
        <p type="p">D1:距離</p>  
        <p type="p">F:箭頭標示</p>  
        <p type="p">G1:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="798" publication-number="202620645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉助於基於雜湊的位址映射來進行記憶體裝置的讀取干擾偵測以供資料完整控制之方法及設備</chinese-title>  
        <english-title>METHOD FOR PERFORMING READ-DISTURBANCE DETECTION OF MEMORY DEVICE WITH AID OF HASHING-BASED ADDRESS MAPPING FOR DATA INTEGRITY CONTROL, AND ASSOCIATED APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G06F12/02</main-classification>  
        <further-classification edition="200601120250502B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉助於基於雜湊的位址映射來進行記憶體裝置的讀取干擾偵測以供資料完整控制之方法及設備。該方法可包含：建立讀取計數表，用以記錄關於多個第一位址的多個第一讀取計數；對偵測到讀取操作的一組第二位址進行基於雜湊的位址映射，以將該組第二位址轉換為該多個第一位址中的一組第一位址，以供更新一組第一讀取計數；監控至少一最高第一讀取計數，以確定最高第一讀取計數是否達到一第一讀取計數閾值；對偵測到最高第一讀取計數的第一位址進行反向映射，以將該第一位址轉換為目標第二位址；以及針對目標第二位址進行媒體掃描程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing read-disturbance detection of memory device with aid of hashing-based address mapping for data integrity control and associated apparatus are provided. The method may include: establishing a read count table for recording multiple first read counts with respect to multiple first addresses; performing the hashing-based address mapping on a set of second addresses at which reading operations are detected in order to convert the set of second addresses into a set of first addresses, for updating a set of first read counts; monitoring at least a highest first read count to determine whether the highest first read count reaches a first read count threshold; performing reverse mapping on a first address at which the highest first read count is detected in order to convert the first address into a set of target second addresses; and performing a media scan procedure with respect to the target second addresses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="799" publication-number="202621494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含具有金屬化部分、以及金屬化部分之間的被動裝置及橋接器之中介層封裝的封裝</chinese-title>  
        <english-title>PACKAGE COMPRISING AN INTERPOSER PACKAGE WITH METALLIZATION PORTIONS, AND A PASSIVE DEVICE AND A BRIDGE BETWEEN THE METALLIZATION PORTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W44/00</main-classification>  
        <further-classification edition="202601120260223B">H10W29/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification>  
        <further-classification edition="202601120260223B">H10W70/00</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　彥梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YANMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷恩　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANE, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝，其包含一第一整合裝置；一第二整合裝置；及一封裝中介層，其經耦接至該第一整合裝置及該第二整合裝置。該封裝中介層包含一第一金屬化部分；一第二金屬化部分；一第一囊封層，其經耦接至該第一金屬化部分及該第二金屬化部分；及一被動裝置，其至少部分地位於該第一囊封層中。該第一囊封層及該被動裝置位於該第一金屬化部分與該第二金屬化部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package comprising a first integrated device; a second integrated device; and a package interposer coupled to the first integrated device and the second integrated device. The package interposer comprises a first metallization portion; a second metallization portion; a first encapsulation layer coupled to the first metallization portion and the second metallization portion; and a passive device located at least partially in the first encapsulation layer. The first encapsulation layer and the passive device are located between the first metallization portion and the second metallization portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:板</p>  
        <p type="p">102:封裝中介層</p>  
        <p type="p">105a~b:整合裝置</p>  
        <p type="p">109:囊封層</p>  
        <p type="p">110:板介電層</p>  
        <p type="p">112:板互連件</p>  
        <p type="p">118:焊料互連件</p>  
        <p type="p">120:金屬化部分</p>  
        <p type="p">122:介電層</p>  
        <p type="p">123:金屬化互連件</p>  
        <p type="p">125:柱互連件</p>  
        <p type="p">130:囊封部分</p>  
        <p type="p">132:囊封層</p>  
        <p type="p">133:柱互連件</p>  
        <p type="p">140:金屬化部分</p>  
        <p type="p">142:介電層</p>  
        <p type="p">143:金屬化互連件</p>  
        <p type="p">150a~b:柱互連件</p>  
        <p type="p">152a~b:焊料互連件</p>  
        <p type="p">190:底部填充物</p>  
        <p type="p">203a~b:整合裝置</p>  
        <p type="p">206a~c:橋接器</p>  
        <p type="p">230a~b:柱互連件</p>  
        <p type="p">232a~b:焊料互連件</p>  
        <p type="p">260a~c:橋接器</p>  
        <p type="p">265a~c:柱互連件</p>  
        <p type="p">300:封裝</p>  
        <p type="p">304a~b:被動裝置</p>  
        <p type="p">340a~b:焊料互連件</p>  
        <p type="p">345a~b:柱互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="800" publication-number="202619822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於放電加工的電極導線及其製造方法</chinese-title>  
        <english-title>ELECTRODE WIRE FOR ELECTRICAL DISCHARGE MACHINING AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B23H7/08</main-classification>  
        <further-classification edition="200601120260202B">C23C30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商熱壓製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THERMOCOMPACT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LY, MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋伯　沙維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEBER, XAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電蝕加工之電極導線，包含：金屬線芯（10）具有多個脊部，脊部平行於縱軸，及凹凸介面，包含分佈於周圍表面之週緣的至少75%之低局部極值和高局部極值，以及表面層（12），高、低局部極值間距小於12μm。凹凸介面主要位於下邊界（30）與上邊界（32）之間，下邊界與上邊界間之距離在1µm和5µm之間，上邊界與最外層金屬面之間的距離沿凹凸介面的圓周保持小於4μm，並且表面層完全填充上邊界與周圍表面之間的所有區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The low and high local extrema are less than 12 µm apart. The bumpy interface lies mainly between a lower limit (30) and a upper limit (32), the space between the lower and upper limits being between 1 µm and 5 µm. The upper limit is separated from an outermost metallic face (6) by a distance of less than 4 µm. The surface layer (12) completely fills all regions between the upper limit (32) and the metal core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:縱軸</p>  
        <p type="p">6:外表面</p>  
        <p type="p">10:線芯</p>  
        <p type="p">12:表面層/層</p>  
        <p type="p">22,23,24,25:凸起</p>  
        <p type="p">26,27:凹陷</p>  
        <p type="p">30:下邊界</p>  
        <p type="p">32:上邊界</p>  
        <p type="p">34,35,36,44,45,46,47:分段</p>  
        <p type="p">38,39,41:點</p>  
        <p type="p">50:分段線</p>  
        <p type="p">G&lt;sub&gt;i&lt;/sub&gt;,D&lt;sub&gt;i&lt;/sub&gt;:邊</p>  
        <p type="p">α&lt;sub&gt;i&lt;/sub&gt;:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="801" publication-number="202620984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子連接器和電驅動總成</chinese-title>  
        <english-title>TERMINAL CONNECTOR AND ELECTRIC DRIVE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250703B">H01R13/719</main-classification>  
        <further-classification edition="200601120250703B">H01R13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山聯滔電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTO ELECTRONIC LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樊冬昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, DONGCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種端子連接器和電驅動總成，將端子排的多個導電件和濾波部設置於殼體，將第一連接端和第二連接端分別設置於延伸體的兩端，以對電流進行傳導。由此，在延伸體上設置多個第一段，且多個第一段間隔排列形成設置在磁環內的中間組件。使得導電件利用中間組件可以多次穿過磁環，進而增加了端子排與磁環的耦合強度，提高了磁環對共模雜訊的濾除效果。另一方面，避免在端子連接器上設置電容器。從而，簡化了端子連接器的結構，使得端子連接器的體積更加小巧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a terminal connector and an electric drive assembly. The multiple conductive parts and a filter part of a terminal row are arranged in a housing. A first connecting end and a second connecting end are respectively arranged at two ends of an extension body to conduct a current. A plurality of first sections are arranged on the extension body, and the plurality of first sections are arranged at intervals to form an intermediate component arranged in a magnetic ring. The conductive parts can pass through the magnetic ring multiple times using the intermediate component. The coupling strength between the terminal row and the magnetic ring is increased, which improves the filtering effect of the magnetic ring on common mode noise. On the other hand, it is possible to avoid providing a capacitor on the terminal connector. Therefore, the structure of the terminal connector is simplified, and the terminal connector is more compact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4a:第一導電件</p>  
        <p type="p">11:第一連接端</p>  
        <p type="p">12:第二連接端</p>  
        <p type="p">14:中間組件</p>  
        <p type="p">151:容置間隙</p>  
        <p type="p">153:第一對接頭</p>  
        <p type="p">154:第二對接頭</p>  
        <p type="p">31:磁環</p>  
        <p type="p">311:第一側壁</p>  
        <p type="p">44:連接段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="802" publication-number="202621365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電渦流感測器的標定方法、厚度測量方法及化學機械拋光設備</chinese-title>  
        <english-title>CALIBRATION METHOD, THICKNESS MEASUREMENT METHOD AND CHEMICAL MECHANICAL POLISHING APPARATUS FOR EDDY CURRENT SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="200601120260223B">G01B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華海清科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWATSING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田芳馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, FANGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路新春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王同慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TONGQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, DEWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種用於電渦流感測器的標定方法、厚度測量方法及化學機械拋光設備。該標定方法包括：在對晶圓進行化學機械拋光前，獲取電渦流感測器的信號源產生的第一激勵信號；在對晶圓進行化學機械拋光的過程中，獲取電渦流感測器的信號源產生的第二激勵信號，並獲取電渦流感測器採集到的晶圓信號；根據第一激勵信號和第二激勵信號，對晶圓信號進行修正，得到修正後晶圓信號；建立根據修正後晶圓信號確定的標定資訊與預先確定的晶圓厚度之間的映射關係，以對電渦流感測器進行標定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A calibration method, a thickness measurement method, and a chemical mechanical polishing apparatus for an eddy current sensor are provided in the embodiments of the present application. The calibration method includes: acquiring a first excitation signal generated by a signal source of the eddy current sensor before chemically and mechanically polishing a wafer; acquiring a second excitation signal generated by a signal source of the eddy current sensor during chemically and mechanically polishing the wafer, and acquiring a wafer signal captured by the eddy current sensor; correcting the wafer signal according to the first excitation signal and the second excitation signal, and obtaining a corrected the corrected wafer signal; establishing a mapping relationship between calibration information determined according to the corrected wafer signal and a predetermined wafer thickness for calibrating the eddy current sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="803" publication-number="202619840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓磨削檢測方法、加工方法、裝置、設備</chinese-title>  
        <english-title>WAFER GRINDING MONITORING METHOD, PROCESSING METHOD, DEVICE, AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">B24B37/005</main-classification>  
        <further-classification edition="201201120260223B">B24B37/04</further-classification>  
        <further-classification edition="200601120260223B">B24B55/00</further-classification>  
        <further-classification edition="200601120260223B">B24B49/10</further-classification>  
        <further-classification edition="201201120260223B">B24B37/10</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華海清科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWATSING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, GUOQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱小波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, XIAOBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冬齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONGQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, DEWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳雲龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種晶圓磨削檢測方法、加工方法、裝置、設備。該檢測方法包含：確定步驟，確定晶圓磨削設備的磨輪是否與工作台相接觸；獲取步驟，在確定磨輪與工作台相接觸後，即時獲取晶圓磨削設備的主軸位置和工作台高度；異常步驟，根據主軸位置和工作台高度確定工作台磨削中是否發生異常。本申請將工作台高度的變化和主軸電機位置的變化相結合來判斷磨削過程是否異常，通過同時監測工作台高度和主軸電機位置兩個參數，可以更準確地識別出磨削過程中可能出現的問題，減少了誤判的可能性，提高了檢測的準確性和可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer grinding monitoring method, a processing method, a device, and an apparatus are provided in the embodiments of the present disclosure. The monitoring method comprises: a step of determining whether a grinding wheel of the wafer grinding apparatus is in contact with a table; a step of acquiring, after determining that the grinding wheel is in contact with the table, a spindle position and a table height of the wafer grinding apparatus are acquired in real time; and a step of abnormality, determining whether an abnormality state occurs in the grinding of the table based on the spindle position and the table height. The changes in the table height and changes in the spindle motor position are combined to determine whether the grinding process is abnormal, and by monitoring the two parameters of the table height and the spindle motor position at the same time, problems that may occur in the grinding process can be more accurately identified, and the possibility of false determination is lowered, and the accuracy and reliability of the monitoring is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="804" publication-number="202620946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>片金屬互連件、其形成方法以及包含彼之電化學電池堆疊</chinese-title>  
        <english-title>SHEET METAL INTERCONNECTS, METHODS OF FORMING THEREOF, AND ELECTROCHEMICAL CELL STACKS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260209B">H01M8/0258</main-classification>  
        <further-classification edition="202101120260209B">C25B9/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博隆能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施莫斯　托維斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMAUSS, TRAVIS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯德　亞當　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYRD, ADAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇斯　道爾頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COX, DALTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博恩　沙卡爾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONE, SAGAR R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾　巴塔維　伊瑪德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL BATAWI, EMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於電化學電池堆疊之互連件，其包括具有反應物側及相對空氣側之金屬片、安置於該金屬片之相對第一邊緣及第二邊緣處之反應物入口及反應物出口、安置於該金屬片之該反應物側上的該反應物入口與該反應物出口之間之反應物場、自該反應物場突出且經組態成接觸安置於該金屬片之該反應物側上之電化學電池之第一接觸墊、安置於該金屬片之該空氣側上的該反應物入口與該反應物出口之間之空氣場、自該空氣場突出且經組態成接觸安置於該金屬片之該空氣側上之另一電化學電池之第二接觸墊；及安置於該金屬片之該反應物側上且圍繞該反應物入口、該反應物出口及該反應物場之框架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interconnect for an electrochemical cell stack includes a metal sheet having a reactant side and an opposing air side, a reactant inlet and a reactant outlet disposed at opposing first and second edges of the metal sheet, a reactant field disposed between the reactant inlet and the reactant outlet on the reactant side of the metal sheet, first contact pads protruding from the reactant field and configured to contact an electrochemical cell disposed on the reactant side of the metal sheet, an air field disposed between the reactant inlet and the reactant outlet on the air side of the metal sheet, second contact pads protruding from the air field and configured to contact another electrochemical cell disposed on the air side of the metal sheet; and a frame disposed on the reactant side of the metal sheet and surrounding the reactant inlet, the reactant outlet, and the reactant field.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:互連件</p>  
        <p type="p">202:成型金屬片</p>  
        <p type="p">210:反應物入口</p>  
        <p type="p">212:反應物出口</p>  
        <p type="p">430:空氣場</p>  
        <p type="p">452:電池密封件</p>  
        <p type="p">454:空氣側周邊密封件</p>  
        <p type="p">L6:線</p>  
        <p type="p">L7:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="805" publication-number="202620070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114796</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性組合物、成形品之製造方法及硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08F20/10</main-classification>  
        <further-classification edition="200601120260209B">C08F2/44</further-classification>  
        <further-classification edition="200601120260209B">C08K5/03</further-classification>  
        <further-classification edition="200601120260209B">C09K3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>御供田大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOKUDEN, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小幡寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBATA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村由依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, YUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本早紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, SAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種熱硬化性組合物，其包含：(A)下述式(A)所表示之化合物、(B)熱聚合起始劑、及(C)溴系阻燃劑。 &lt;br/&gt;&lt;img align="absmiddle" height="105px" width="259px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(A)中，R&lt;sup&gt;1&lt;/sup&gt;分別獨立地為氫原子或甲基。R&lt;sup&gt;2&lt;/sup&gt;分別獨立地為單鍵或碳數1～20之伸烷基。Z為經取代或未經取代之成環碳數6～12之脂環式烴基。n為1或2。於n為2之情形時，2個R&lt;sup&gt;1&lt;/sup&gt;及2個R&lt;sup&gt;2&lt;/sup&gt;分別可相同亦可不同)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="806" publication-number="202620489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纖卡扣和光纖適配器</chinese-title>  
        <english-title>OPTICAL FIBER BUCKLE AND OPTICAL FIBER ADAPTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250730B">G02B6/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞訊滔電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN XUNTAO ELECTRONIC CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅從信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高旻聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, MIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林益增</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-TSENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂建文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIEN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光纖卡扣和光纖適配器，光纖卡扣包括內接部，內接部包括內接框和鎖止臂，內接框圍設形成內接槽，內接框沿第一方向插裝於光模組的殼體中，鎖止臂沿第一方向延伸，鎖止臂背離內接槽的一側設有鎖止凸頭，內接框插裝於殼體中時，鎖止凸頭沿與第一方向垂直的第二方向抵靠於殼體的內壁，光纖適配器包括光纖卡扣。內接框保證光纖卡扣穩定地沿第一方向插裝於光模組的殼體中，鎖止臂透過鎖止凸頭沿第二方向抵靠於殼體的內壁，使光纖卡扣插裝於光模組的殼體中時不會晃動，保證光模組中外部光纖和內部光纖耦合傳導的可靠性和穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical fiber buckle and an optical fiber adapter are disclosed. The optical fiber buckle includes an internal connecting portion. The internal connecting portion includes an internal connecting frame and a locking arm. The internal connecting frame is wound to form an internal slot. The internal connecting frame is inserted into a housing of an optical module along a first direction. The locking arm is extended along the first direction. A locking protrusion is disposed on the side of the locking arm away from the internal slot. When the internal connecting frame is inserted into the housing, the locking protrusion is contacted with the internal wall of the housing along a second direction perpendicular to the first direction. The optical fiber adapter includes the optical fiber buckle. The internal connecting frame ensures that the optical fiber buckle is stably inserted into the housing of the optical module along the first direction. The locking arm is contacted with the internal wall of the housing along the second direction through the locking protrusion, so the optical fiber buckle will not shake when inserted into the housing of the optical module. The reliability and stability of the coupling transmission between an external optical fiber and an internal optical fiber in the optical module is ensured.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:內接框</p>  
        <p type="p">1111:內接槽</p>  
        <p type="p">1112:內避讓槽</p>  
        <p type="p">112:鎖止臂</p>  
        <p type="p">1121:鎖止凸頭</p>  
        <p type="p">12:外接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="807" publication-number="202620582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">G05F3/16</main-classification>  
        <further-classification edition="200601120251023B">G05F3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHENG HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嘉富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, YU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路，包括一第一電壓提供電路，其用以提供一第一輸出電壓於一第一輸出節點。該電路包括一測試電路，其耦接至該第一電壓提供電路且用以測試流過該第一輸出節點的一驅動電流。該測試電路包含一電流鏡。該電流鏡包含一第一電晶體，其具有耦接至一測試接腳以接收一測試電流的一第一源極/汲極端。該電流鏡包含一第二電晶體，其具有耦接至該第一輸出節點的一第一源極/汲極端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit includes a first voltage provision circuit configured to provide a first output voltage at a first output node. The circuit includes a test circuit coupled to the first voltage provision circuit and configured to test a driving current flowing through the first output node. The test circuit comprises a current mirror. The current mirror comprises a first transistor having a first source/drain terminal coupled to a test pin configured to receive a test current. The current mirror comprises a second transistor having a first source/drain terminal coupled to the first output node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電路</p>  
        <p type="p">202:LDO穩壓器</p>  
        <p type="p">204:運算放大器</p>  
        <p type="p">206:電晶體</p>  
        <p type="p">208:電阻器</p>  
        <p type="p">210:負載</p>  
        <p type="p">212:測試電路</p>  
        <p type="p">214A~214B:電晶體</p>  
        <p type="p">216:電晶體</p>  
        <p type="p">218:電晶體</p>  
        <p type="p">220:電晶體</p>  
        <p type="p">222:反相器</p>  
        <p type="p">ENB:啟用信號</p>  
        <p type="p">R_DIV:電阻器分壓器</p>  
        <p type="p">V_FB:反饋電壓</p>  
        <p type="p">V_REF:參考電壓</p>  
        <p type="p">M:電晶體</p>  
        <p type="p">M*A:電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="808" publication-number="202620072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高矽含量和高穩定性的光可固化組成物</chinese-title>  
        <english-title>PHOTOCURABLE COMPOSITION WITH HIGH SILICON CONTENT AND HIGH STABILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08F30/08</main-classification>  
        <further-classification edition="200601120260210B">C08F2/48</further-classification>  
        <further-classification edition="200601120260210B">B32B27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥奎斯蒂　卡洛琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCUISTION, CAROLINE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光可固化組成物，其可以包含可聚合材料、不含氟的脫模劑和光引發劑，其中可聚合材料可以包含至少一種具有式(1)結構的含矽單體&lt;br/&gt;&lt;img align="absmiddle" height="104px" width="221px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中R1、R2：-O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;、或烷基、或芳基、或烷芳基；R3、R4：-O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;、烷基、或芳基、或烷芳基；R5：C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;5&lt;/sub&gt;-烷基、或芳基、或烷芳基；R6：-R5-X、或X、或-O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;、或烷基、或芳基、或烷芳基；X：丙烯酸酯或甲基丙烯酸酯；以及n：0至4。光可固化組成物中的矽(Si)含量可以為至少15重量%，基於可聚合材料的總重量；以及不含氟的脫模劑可為炔二醇。光可固化組成物可以具有高穩定性，其穩定性因子(stability factor，SF)為至少14。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photocurable composition can comprise a polymerizable material, a non-fluorine-containing release agent, and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1)&lt;br/&gt;&lt;img align="absmiddle" height="101px" width="221px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;with R1, R2: -O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;, or alkyl, or aryl, or alkylaryl; R3, R4: -O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;, alkyl, or aryl, or alkylaryl; R5: C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;5&lt;/sub&gt;-alkyl, or aryl, or alkylaryl; R6: -R5-X, or X, or –O-Si(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;3&lt;/sub&gt;, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0 – 4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt% based on the total weight of the polymerizable material, and the non-fluorine-containing release agent may be an acetylenic diol. The photocurable composition can have a high stability with a stability factor of at least 14.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="809" publication-number="202620373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光模組及檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G01B11/12</main-classification>  
        <further-classification edition="200601120260210B">G01N21/954</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光成俊泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUNARI, TOSHIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野澤一太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAWA, ITTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種搭載於檢查裝置且能夠抑制檢查精度降低之光模組。&lt;br/&gt;光模組搭載於檢查裝置，該檢查裝置配置於被檢查對象物包圍之空間，對檢查對象物的內周面照射環狀光束而檢查內周面。光模組具備：準直光輸出部，其係沿檢查對象物的軸向輸出準直光；反射鏡，其係配置於從準直光輸出部輸出之準直光所射入之位置，反射準直光而形成在檢查對象物的內周面的圓周方向上擴散之環狀光束；及反射鏡固定構件，其係相對於準直光輸出部固定反射鏡的位置。反射鏡固定構件構成為在圓周方向上的至少一部分範圍內使被反射鏡反射之光直接到達檢查對象物的內周面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光模組</p>  
        <p type="p">11:準直光輸出部</p>  
        <p type="p">11A:準直透鏡</p>  
        <p type="p">12:反射鏡</p>  
        <p type="p">13:反射鏡支撐部</p>  
        <p type="p">14:反射鏡固定構件</p>  
        <p type="p">15:鏡筒</p>  
        <p type="p">23:光纖</p>  
        <p type="p">62:環狀光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="810" publication-number="202621131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電結構及無線耳機</chinese-title>  
        <english-title>CHARGING STRUCTURE AND WIRELESS EARPHONES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H04R1/10</main-classification>  
        <further-classification edition="202601120260223B">H02J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密組件（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION ACCESSORY(SUZHOU)LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦勝勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, SHENGXUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充電結構及無線耳機，該充電結構包括絕緣本體、兩個充電端子及兩個連接件，所述絕緣本體的頂面開設有容納槽，電芯的一端插入所述容納槽內；兩個充電端子均設置於所述絕緣本體中，所述充電端子包括接觸部和焊接部，所述接觸部暴露於所述絕緣本體之外，所述焊接部設置有焊接凸起；所述連接件包括連接段和套環，所述套環開設有焊接孔，兩個所述連接件的所述套環分別藉由所述焊接孔套設於對應的所述焊接凸起上並焊接固定，兩個所述連接件的所述連接段分別連接所述電芯的正極和負極。該充電結構方便焊接定位，並且焊接穩定性較高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charging structure and wireless earphones are provided. The charging structure includes an insulating body, two charging terminals, and two connectors. A top surface of the insulating body is provided with an accommodating groove. One end of a battery cell is inserted into the accommodating groove. The two charging terminals are arranged in the insulating body. The charging terminal includes a contact portion and a welding portion. The contact portion is exposed outside the insulating body. The welding portion is provided with a welding protrusion. The connector includes a connecting section and a collar. The collar is provided with a welding hole. The collars of the two connector are respectively sleeved on the corresponding welding protrusion through the welding hole and fixed by welding. The connecting sections of the two connectors are respectively connected to a positive electrode and a negative electrode of the battery cell. The charging structure facilitates welding positioning and has high welding stability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣本體</p>  
        <p type="p">11:容納槽</p>  
        <p type="p">12:固定凸起</p>  
        <p type="p">13:卡接部</p>  
        <p type="p">2:電芯</p>  
        <p type="p">3:充電端子</p>  
        <p type="p">4:連接件</p>  
        <p type="p">41:連接段</p>  
        <p type="p">42:套環</p>  
        <p type="p">43:絕緣外皮</p>  
        <p type="p">5:焊劑</p>  
        <p type="p">6:支撐塊</p>  
        <p type="p">61:卡緊斜面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="811" publication-number="202621019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低切換式轉換器中之反向恢復電荷的控制電路及方法</chinese-title>  
        <english-title>CONTROL CIRCUIT AND METHOD FOR REDUCING REVERSE RECOVERY CHARGE IN SWITCHING POWER CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">H02M1/08</main-classification>  
        <further-classification edition="200601120250910B">H02M3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱冠任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, KWAN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TA-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種控制電路，用以根據脈寬調變訊號而控制切換式轉換器，其中切換式轉換器包括第一與第二電晶體，共同耦接於切換節點，用以根據脈寬調變訊號切換電感器，以轉換輸入電壓而產生輸出電壓。控制電路包含：驅動電路，用以根據脈寬調變訊號與切換節點上的切換訊號產生切換驅動訊號，以切換第一電晶體；及放大電路，用以於空滯時間，放大切換訊號與參考訊號之差值，以產生放大輸出訊號，且藉由線性負回授操作，控制第一電晶體，以調節切換訊號之電壓不低於預設負電壓，藉此避免第一電晶體的本體二極體順向導通或降低本體二極體之反向恢復電荷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control circuit is configured to control a switching converter based on a pulse-width modulation (PWM) signal. The switching converter includes a first and a second transistor coupled to a switching node for switching an inductor according to the PWM signal to convert an input voltage into an output voltage. The control circuit includes: a driver circuit for generating a switching drive signal to switch the first transistor based on the PWM signal and a switching signal at the switching node; and an amplifier circuit for amplifying a difference between the switching signal and a reference signal to generate an amplified output signal during a dead time for controlling the first transistor through a linear negative feedback operation to regulate the switching signal to be not lower than a predetermined negative voltage, thereby preventing forward conduction of a body diode of the first transistor or reducing the reverse recovery charge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:電感器</p>  
        <p type="p">103:驅動電路</p>  
        <p type="p">203:放大電路</p>  
        <p type="p">300:箝位電路</p>  
        <p type="p">400:非重疊電路</p>  
        <p type="p">2003A:切換式轉換器</p>  
        <p type="p">3003A:控制電路</p>  
        <p type="p">Ctrl1,Ctrl2:控制訊號</p>  
        <p type="p">DL:本體二極體</p>  
        <p type="p">DRVH,DRVL:切換驅動訊號</p>  
        <p type="p">GL:閘極</p>  
        <p type="p">MH:第二電晶體</p>  
        <p type="p">ML:第一電晶體</p>  
        <p type="p">N1:第二開關</p>  
        <p type="p">N2:箝位電晶體</p>  
        <p type="p">P1:第一開關</p>  
        <p type="p">SPH,SPL:訊號</p>  
        <p type="p">SPW:脈寬調變訊號</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">VDC:直流電壓</p>  
        <p type="p">VDRV:驅動電壓</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VO:輸出電壓</p>  
        <p type="p">VOA:放大輸出訊號</p>  
        <p type="p">Vref:參考訊號</p>  
        <p type="p">VSW:切換訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="812" publication-number="202620531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可變光圈及攝像頭模組</chinese-title>  
        <english-title>VARIABLE APERTURE AND A CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250520B">G03B9/02</main-classification>  
        <further-classification edition="202101120250520B">G03B9/06</further-classification>  
        <further-classification edition="202101120250520B">G03B9/10</further-classification>  
        <further-classification edition="202101120250520B">G03B9/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳力禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳富源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, FU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及攝像頭模組技術領域，具體公開了一種可變光圈及攝像頭模組，該可變光圈包括殼體，轉動連接於殼體的轉動件，固定連接於殼體的驅動件，以及多個葉片，每個葉片均與轉動件轉動連接，且每個葉片均與殼體滑動連接，多個葉片圍設成孔徑可調的光圈孔；葉片和殼體中的一個設置有導向槽，另一個連接有導向柱，導向柱插接於導向槽，導向柱的外徑不小於導向槽的槽寬，導向柱和導向槽過盈配合且導向柱具有彈性，導向柱通過產生彈性形變以適應導向槽的槽寬，並且，通過使導向柱具有彈性，當導向柱在沿導向槽滑動時，在導向槽的各個位置處，導向柱的彈性形變的量能夠始終保持穩定，在調整光圈孔的孔徑時，能夠顯著提升對光圈孔的孔徑的控制精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the technical field of camera modules, and specifically discloses a variable aperture and a camera module. The variable aperture comprises a housing, a rotating member rotatably connected to the housing, a driving member fixedly connected to the housing, and a plurality of blades, each of the plurality of blades is rotatably connected to the rotating member, and each blade is sliding connected to the housing. The plurality of blades surround to form an aperture hole with adjustable aperture. One of the blade and the housing is disposed with a guide groove, and the other is disposed with a guide post, the guide post is inserted into the guide groove, an outer diameter of the guide post is not less than a width of the guide groove, the guide post and the guide groove have an interference fit and the guide post is elastic, and the guide post adapts to the width of the guide groove by elastic deformation, and the guide post is made elastic so that when the guide post slides along the guide groove, amplitude of elastic deformation of the guide post remains steady at various positions of the guide groove, the control accuracy of the aperture can be significantly improved when adjusting the aperture.&lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:轉動件</p>  
        <p type="p">3:驅動件</p>  
        <p type="p">4:葉片</p>  
        <p type="p">5:光圈孔</p>  
        <p type="p">6:滾珠</p>  
        <p type="p">7:轉軸</p>  
        <p type="p">8:導向柱</p>  
        <p type="p">11:底座</p>  
        <p type="p">12:罩殼</p>  
        <p type="p">13:容納腔</p>  
        <p type="p">21:第二安裝槽</p>  
        <p type="p">22:第三安裝槽</p>  
        <p type="p">31:線圈</p>  
        <p type="p">32:第一磁鐵</p>  
        <p type="p">33:第二磁鐵</p>  
        <p type="p">41:導向槽</p>  
        <p type="p">111:第二透光孔</p>  
        <p type="p">112:環形凸台</p>  
        <p type="p">113:第一安裝槽</p>  
        <p type="p">114:滾動槽</p>  
        <p type="p">121:第一透光孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="813" publication-number="202621409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多邊形面板翹曲抑制作業平台及其翹曲抑制方法、點膠裝置、面板晶片級底部填充設備和多邊形面板作業方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州銘賽機器人科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曲東升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周典虯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王江坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘龍龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃繼明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多邊形面板翹曲抑制作業平台及多邊形面板翹曲抑制方法、點膠裝置、面板晶片級底部填充設備和多邊形面板作業方法。該多邊形面板翹曲抑制作業平台包括：承載台，用以承載多邊形面板；支撐機構，位於承載台的下方並可沿豎直方向移動，當支撐機構的支撐端凸出於承載台時能夠支撐多邊形面板；頂升機構，能夠驅動支撐機構沿豎直方向上下移動，當支撐機構向上移動時多邊形面板支撐於支撐機構上；當支撐機構向下移動時多邊形面板可承載於承載台上；及複數個壓平機構，一個壓平機構對應承載台的一個側邊，當多邊形面板放置於承載台上時，複數個壓平機構同時向下分別抵壓多邊形面板的複數個邊緣部，使得多邊形面板貼合於承載台。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:承載台</p>  
        <p type="p">3:壓平機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="814" publication-number="202619723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗氧化壓力劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/519</main-classification>  
        <further-classification edition="200601120260202B">A61K31/58</further-classification>  
        <further-classification edition="200601120260202B">A61P39/06</further-classification>  
        <further-classification edition="200601120260202B">A61K8/49</further-classification>  
        <further-classification edition="200601120260202B">A61K8/63</further-classification>  
        <further-classification edition="200601120260202B">A61Q19/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商照化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMITERAS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪田香織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂林秀太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURABAYASHI, SHUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤池紀夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAIKE, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永松朝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMATSU, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種關於至今未知之5-去氮黃素(5-Deazaflavins)衍生物或類似化合物的新用途。一種抗氧化壓力劑以及含有該些之化妝品、準醫藥品、醫藥品，其以下述作為有效成分： &lt;br/&gt;　　下述通式(I)表示之5-去氮黃素化合物， &lt;br/&gt;&lt;img align="absmiddle" height="208px" width="325px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sub&gt;1&lt;/sub&gt;表示氫原子、烷基、鹵素取代烷基、羧基取代烷基或苯基；R&lt;sub&gt;2&lt;/sub&gt;表示烷基、環烷基、苯基取代低級烷基、苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基、低級烷基二取代苯基；R&lt;sub&gt;3&lt;/sub&gt;及R&lt;sub&gt;4&lt;/sub&gt;表示氫原子、低級烷基、鹵素原子、羥基、硝基、氰基、低級烷氧基、苯基取代低級烷氧基、低級烷胺基、苯基取代低級烷胺基或低級烷磺醯基。) &lt;br/&gt;　　下述通式(II)表示之吡啶並二嘧啶(Pyridodipyrimidines)化合物， &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="332px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;3&lt;/sub&gt;表示氫原子、烷基、鹵素取代烷基、羧基取代烷基或苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基、低級烷基二取代苯基；R&lt;sub&gt;2&lt;/sub&gt;表示烷基、環烷基、苯基取代低級烷基、苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基、低級烷基二取代苯基。) &lt;br/&gt;　　下述通式(III)表示之去氮黃素睪固酮(Deazaflavino-testerones)化合物， &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="381px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sub&gt;1&lt;/sub&gt;表示氫原子、烷基、鹵素取代烷基、羧基取代烷基或苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基；R&lt;sub&gt;2&lt;/sub&gt;表示烷基、環烷基、苯基取代低級烷基、苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基、低級烷基二取代苯基。) &lt;br/&gt;　　或下述通式(IV)表示之去氮黃素膽固醇(Deazaflavino-cholesteroles)化合物， &lt;br/&gt;&lt;img align="absmiddle" height="253px" width="391px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sub&gt;1&lt;/sub&gt;表示氫原子、烷基、鹵素取代烷基、羧基取代烷基或苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基；R&lt;sub&gt;2&lt;/sub&gt;表示烷基、環烷基、苯基取代低級烷基、苯基、經鹵素原子或低級烷基或低級烷氧基中的至少一者取代之苯基、低級烷基二取代苯基。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="815" publication-number="202620929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與框格型電漿程序關聯之方法及電漿室</chinese-title>  
        <english-title>METHOD ASSOCIATED WITH FRAME FORM PLASMA PROCESS AND PLASMA CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昀舫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宜臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之實施例提供一種方法，其包括：提供一電漿室，其包括一靜電夾頭及一框接收單元，該框接收單元組配來相對於該靜電夾頭支撐及置位一框，其中該靜電夾頭組配來在不同時間接收該框或沒有該框之一晶圓；將該晶圓置位在該靜電夾頭上而沒有該框；於該晶圓之一正面上施行活化程序；基於一或多個量測來判定使用該電漿室於該晶圓上所施行的該活化程序是否滿足一效能臨界值；將該框，包括安置其上之複數個半導體晶粒，置位在該靜電夾頭上；以及基於判定該活化程序滿足該效能臨界值，於該等複數個半導體晶粒之一正面上施行電漿程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a method that includes providing a plasma chamber including an electrostatic chuck and a frame receiving unit configured to support and position a frame with respect to the electrostatic chuck, wherein the electrostatic chuck is configured to receive, at different times, the frame or a wafer without the frame, positioning the wafer onto the electrostatic chuck without the frame, performing the activation process on a front side of the wafer, determining, based on one or more measurements, whether the activation process performed on the wafer using the plasma chamber satisfies a performance threshold, positioning the frame, including a plurality of semiconductor dies disposed thereon, onto the electrostatic chuck, and performing, based on determining that the activation process satisfies the performance threshold, plasma processing on a front side of the plurality of semiconductor dies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓上晶片半導體封裝程序，程序</p>  
        <p type="p">105:框</p>  
        <p type="p">105b:第二框</p>  
        <p type="p">110:晶圓</p>  
        <p type="p">112:基體</p>  
        <p type="p">115,115b:晶粒</p>  
        <p type="p">120:接合膜層</p>  
        <p type="p">125:通道</p>  
        <p type="p">130:電漿切割程序</p>  
        <p type="p">140:保護層</p>  
        <p type="p">142:黏著膠帶，膠帶</p>  
        <p type="p">145:正面</p>  
        <p type="p">155:背面</p>  
        <p type="p">160:劈分步驟</p>  
        <p type="p">170:清潔程序</p>  
        <p type="p">180:活化程序</p>  
        <p type="p">195:另一晶圓，晶圓</p>  
        <p type="p">202,204,206,208,210,212,214,216,218,220,222:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="816" publication-number="202621510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及形成其之方法</chinese-title>  
        <english-title>PACKAGING STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/655</main-classification>  
        <further-classification edition="202601120260223B">H10W70/63</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾于芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YU-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宜臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">說明了一封裝結構及形成其之方法。在一些實施例中，該結構包括：一穿通孔；一第一半導體晶粒，其安置成鄰近於該穿通孔；一應力釋放層，其安置在該通孔之側表面及該第一半導體晶粒之側表面上；以及一模製材料，其安置在該應力釋放層上且在該穿通孔與該第一半導體晶粒之間。該穿通孔、該半導體晶粒及該模製材料之頂表面係實質上共面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging structure and methods of forming the same are described. In some embodiments, the structure includes a through via, a first semiconductor die disposed adjacent the through via, a stress relief layer disposed on side surfaces of the through via and side surfaces of the first semiconductor die, and a molding material disposed on the stress relief layer and between the through via and the first semiconductor die. Top surfaces of the through via, the semiconductor die, and the molding material are substantially coplanar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">102:載體</p>  
        <p type="p">109:黏著層</p>  
        <p type="p">110:緩衝層</p>  
        <p type="p">120:傳導形貌體</p>  
        <p type="p">130:半導體晶粒</p>  
        <p type="p">132:晶粒附接膜，DAF</p>  
        <p type="p">134:半導體基體</p>  
        <p type="p">150:應力釋放層</p>  
        <p type="p">152:模製材料</p>  
        <p type="p">154:重布層，RDL</p>  
        <p type="p">156:介電層</p>  
        <p type="p">158:傳導形貌體</p>  
        <p type="p">160:凸塊下冶金，UBM</p>  
        <p type="p">162:整合式被動裝置，IPD</p>  
        <p type="p">164:連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="817" publication-number="202621056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>比較電路及操作包括至少一個電晶體的比較電路的方法</chinese-title>  
        <english-title>COMPARISON CIRCUIT AND METHOD OF OPERATING A COMPARISON CIRCUIT INCLUDING AT LEAST ONE TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H03M1/10</main-classification>  
        <further-classification edition="200601120250801B">H03M1/12</further-classification>  
        <further-classification edition="200601120250801B">H03K5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪炯振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, HYEONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹峻燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JUNSUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權五星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, OSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種比較電路包括比較器和多工器。比較器包括至少一個電晶體並基於第一輸入訊號、第二輸入訊號和操作時鐘信號產生第一輸出訊號。多工器在正常模式中，基於控制信號輸出第一時鐘信號作為操作時鐘信號，並且在偏移校準模式中，基於控制信號輸出與第一時鐘信號不同的第二時鐘信號作為操作時鐘信號。在偏移校準模式中，比較電路經組態以通過基於具有相同電平的第一和第二輸入訊號以及操作時鐘信號來降級至少一個電晶體來執行偏移校準操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A comparison circuit includes a comparator and a multiplexer. The comparator includes at least one transistor and generates a first output signal based on a first input signal, a second input signal, and an operating clock signal. The multiplexer, in a normal mode, outputs a first clock signal as the operating clock signal based on a control signal, and in an offset calibration mode, outputs a second clock signal different from the first clock signal as the operating clock signal based on the control signal. In the offset calibration mode, the comparison circuit is configured to perform an offset calibration operation by degrading the at least one transistor based on the first and second input signals having the same voltage level and the operating clock signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:比較電路</p>  
        <p type="p">100:比較器</p>  
        <p type="p">200:多工器</p>  
        <p type="p">OS1:第一輸出訊號</p>  
        <p type="p">IS1:第一輸入訊號</p>  
        <p type="p">IS2:第二輸入訊號</p>  
        <p type="p">OCK:操作時鐘信號</p>  
        <p type="p">CK1:第一時鐘信號</p>  
        <p type="p">CK2:第二時鐘信號</p>  
        <p type="p">CTRL:控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="818" publication-number="202621322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多閘極轉移電晶體之影像感測器像素單元</chinese-title>  
        <english-title>IMAGE SENSOR PIXEL CELL WITH MULTI-GATE TRANSFER TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10F39/18</main-classification>  
        <further-classification edition="202501120260102B">H10D89/10</further-classification>  
        <further-classification edition="202301120260102B">H04N25/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛　杜立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, DULI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉遠良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUANLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAN, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔雲一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, WOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾茲　托瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEURTS, TOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一影像感測器之像素單元包含各自安置於一半導體材料內之一第一光電二極體、一第二光電二極體及一浮動擴散部。該像素單元進一步包含一多閘極轉移電晶體，該多閘極轉移電晶體經組態以將該第一光電二極體及該第二光電二極體選擇性地耦合至該浮動擴散部以便將影像電荷自該第一光電二極體或該第二光電二極體轉移至該浮動擴散部。該多閘極轉移電晶體包含複數個分隔開的閘極電極，該複數個分隔開的閘極電極包含安置成接近於該第一光電二極體之一第一閘極電極、安置成接近於該第二光電二極體之一第二閘極電極及安置成接近於該浮動擴散部之一共用閘極電極。該多閘極轉移電晶體進一步包含安置於半導體基板內該第一光電二極體與該第二光電二極體之間的一隔離結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel cell for an image sensor includes a first photodiode, a second photodiode, and a floating diffusion, each disposed within a semiconductor material. The pixel cell further includes a multi-gate transfer transistor configured to selectively couple the first photodiode and the second photodiode to the floating diffusion to transfer image charge from the first photodiode or the second photodiode to the floating diffusion. The multi-gate transfer transistor includes a plurality of separated gate electrodes including a first gate electrode disposed proximate to the first photodiode, a second gate electrode disposed proximate to the second photodiode, and a shared gate electrode disposed proximate to the floating diffusion. The multi-gate transfer transistor further includes an isolation structure disposed within the semiconductor substrate between the first photodiode and the second photodiode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:像素單元</p>  
        <p type="p">101:半導體材料</p>  
        <p type="p">105-1:第一光電二極體/光電二極體</p>  
        <p type="p">105-2:第二光電二極體/光電二極體</p>  
        <p type="p">110-1:第一閘極電極</p>  
        <p type="p">110-2:第二閘極電極</p>  
        <p type="p">111-1:第一縱向邊</p>  
        <p type="p">111-2:第二縱向邊</p>  
        <p type="p">112:隔離結構</p>  
        <p type="p">113-1:第一長度</p>  
        <p type="p">113-2:第二長度</p>  
        <p type="p">115:共用閘極電極</p>  
        <p type="p">117:第三長度</p>  
        <p type="p">119:第四長度</p>  
        <p type="p">120:浮動擴散部</p>  
        <p type="p">121-1:第三縱向邊</p>  
        <p type="p">121-2:第四縱向邊</p>  
        <p type="p">123:寬度</p>  
        <p type="p">126:浮動擴散部尺寸</p>  
        <p type="p">FD:浮動擴散部</p>  
        <p type="p">PD1:第一光電二極體</p>  
        <p type="p">PD2:第二光電二極體</p>  
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;:第一分隔距離</p>  
        <p type="p">S&lt;sub&gt;2&lt;/sub&gt;:第二分隔距離</p>  
        <p type="p">TX1:第一閘極電極</p>  
        <p type="p">TX2:第二閘極電極</p>  
        <p type="p">TXS:共用閘極電極/共用轉移閘極</p>  
        <p type="p">W-W′:線</p>  
        <p type="p">Y-Y′:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="819" publication-number="202621499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及形成其之方法</chinese-title>  
        <english-title>PACKAGING STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/09</main-classification>  
        <further-classification edition="202601120260223B">H10W70/65</further-classification>  
        <further-classification edition="202601120260223B">H10W90/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昀舫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宜臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">說明了一封裝結構及形成其之方法。在一些實施例中，該結構包括一半導體晶粒及安置於該半導體晶粒上方的一RDL。該RDL包括一第一介電層、安置在該第一介電層上方之一第二介電層，以及一傳導形貌體。該傳導形貌體包括安置於該第一介電層中之一第一部分及安置於該第二介電層中之一第二部分。該RDL進一步包括安置在該第一介電層與該導電形貌體之該第一部分之間的一第一功能層，以及安置在該第一功能層與該傳導形貌體之該第一部分之間的一第一n型絕緣層。該第一n型絕緣層具有比該第一功能層更高之一負離子濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging structure and methods of forming the same are described. In some embodiments, the structure includes a semiconductor die and an RDL disposed over the semiconductor die. The RDL includes a first dielectric layer, a second dielectric layer disposed over the first dielectric layer, and a conductive feature. The conductive feature includes a first portion disposed in the first dielectric layer and a second portion disposed in the second dielectric layer. The RDL further includes a first functional layer disposed between the first dielectric layer and the first portion of the conductive feature and a first n-type insulating layer disposed between the first functional layer and the first portion of the conductive feature. The first n-type insulating layer has a higher concentration of negative ions than the first functional layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">102:載體</p>  
        <p type="p">109:黏著層</p>  
        <p type="p">110:緩衝層</p>  
        <p type="p">111:晶種層</p>  
        <p type="p">120,158:傳導形貌體</p>  
        <p type="p">130:半導體晶粒</p>  
        <p type="p">132:晶粒附接膜，DAF</p>  
        <p type="p">134:半導體基體</p>  
        <p type="p">150:功能層</p>  
        <p type="p">152:模製材料</p>  
        <p type="p">154:重布層，RDL</p>  
        <p type="p">156:介電層</p>  
        <p type="p">160:凸塊下冶金，UBM</p>  
        <p type="p">162:整合式被動裝置，IPD</p>  
        <p type="p">164:連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="820" publication-number="202620994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電保護驅動電路及資料傳輸設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H02H9/04</main-classification>  
        <further-classification edition="200601120260223B">H02H7/20</further-classification>  
        <further-classification edition="202601120260223B">H10W42/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商硅谷數模（上海）半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANALOGIX (SHANGHAI) SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商硅谷數模國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANALOGIX INTERNATIONAL LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>靳佳偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JIAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯中原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, ZHONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種靜電保護驅動電路及資料傳輸設備。其中，該電路關於靜電保護技術領域，包括：第一靜電保護支路，第一靜電保護支路的第一端連接至驅動電路的第一輸出端，第一靜電保護支路的第二端連接至驅動電路的第二輸出端；靜電保護單元，靜電保護單元的第一端與驅動電路的第一輸入端連接，靜電保護單元的第二端與驅動電路的第二輸入端連接，靜電保護單元的第三端與第一靜電保護支路的第四端連接，靜電保護單元的第四端與第一靜電保護支路的第五端連接；第二靜電保護支路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一靜電保護支路</p>  
        <p type="p">12:靜電保護單元</p>  
        <p type="p">13:第二靜電保護支路</p>  
        <p type="p">111:驅動電路的第一輸出端</p>  
        <p type="p">112:驅動電路的第二輸出端</p>  
        <p type="p">121:驅動電路的第一輸入端</p>  
        <p type="p">122:驅動電路的第二輸入端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="821" publication-number="202620829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示驅動裝置及顯示驅動方法</chinese-title>  
        <english-title>DISPLAY DRIVING DEVICE AND DISPLAY DRIVING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250506B">G09G3/32</main-classification>  
        <further-classification edition="200601120250506B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示驅動裝置和顯示驅動方法被提供。顯示驅動裝置包括影像分析模組和亮度調整模組。影像分析模組分析顯示數據以決定顯示影像中對應於顯示數據的亮度增強區域。亮度調整模組耦接至影像分析模組。亮度調整模組執行對應於亮度增強區域的亮度增強操作，並計算亮度增強操作的累積時間。當亮度調整模組判斷累積時間超過第一預設時間長度閾值，亮度調整模組執行對應於亮度增強區域的亮度調光操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display driving device and a display driving method are provided. The display driving device includes an image analysis module and a brightness adjustment module. The image analysis module analyzes a display data to determine a brightness boost region in a display image corresponding to the display data. The brightness adjustment module is coupled to the image analysis module. The brightness adjustment module executes a brightness boost operation corresponding to the brightness boost region, and calculates an accumulated time of the brightness boost operation. When the brightness adjustment module determines the accumulated time exceeds a first preset time length threshold, the brightness adjustment module executes a brightness dimming operation corresponding to the brightness boost region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示驅動裝置</p>  
        <p type="p">101:顯示數據</p>  
        <p type="p">110:影像分析模組</p>  
        <p type="p">120:亮度調整模組</p>  
        <p type="p">200:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="822" publication-number="202621356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>絕緣體上矽基板及其形成方法</chinese-title>  
        <english-title>SILICON-ON-INSULATOR SUBSTRATE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/40</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202501120260223B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝清翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾仲銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUNG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種配置於形成絕緣體上矽(SOI)基板的方法。基板包括犧牲層及位於犧牲層上方的第一基板層。通孔形成在第一基板層的第一基板區周圍直至犧牲層。蝕刻去除犧牲層，形成埋入體積。將第一基板區連接至第一基板層的基板支撐件轉換為介電材料。以第一介電材料填充埋入體積和通孔，進而在第一基板區周圍形成埋入介電層及第一介電側壁。在第一基板層上方形成第二基板層。在第二基板層的第二基板區周圍形成溝槽。以第二介電材料填充溝槽以在連接至第一介電側壁的第二基板區周圍形成第二介電側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for forming a silicon-on-insulator (SOI) substrate are disclosed. A substrate includes a sacrificial layer and a first substrate layer over the sacrificial layer. Vias are formed around a first substrate region of the first substrate layer down to the sacrificial layer. The sacrificial layer is etched away, forming a buried volume. Substrate supports connecting the first substrate region to the first substrate layer are converted into a dielectric material. The buried volume and the vias are filled with a first dielectric material, forming a buried dielectric layer and a first dielectric sidewall around the first substrate region. A second substrate layer is formed over the first substrate layer. A trench is formed around a second substrate region of the second substrate layer. The trench is filled with a second dielectric material to form a second dielectric sidewall around the second substrate region connected to the first dielectric sidewall.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">160:第一基板層</p>  
        <p type="p">210:通孔</p>  
        <p type="p">214:基板支撐件</p>  
        <p type="p">B-B,C-C:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="823" publication-number="202621055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116276</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>小數-N鎖相迴路系統及其控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H03L7/18</main-classification>  
        <further-classification edition="200601120250602B">H03L7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商格科微電子（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍紹君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣昕佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種小數-N鎖相迴路系統及其控制方法。在所述小數-N鎖相迴路系統中，設置多個頻率-相位比較器以及連接至該多個頻率-相位比較器的多工器，並設置連接至該多工器的電荷幫浦模組，包括M位元數的電流電路，透過所述多工器控制電荷幫浦模組對應不同頻率比較器進行頻率及相位比較，產生電流大小的比例，以實現小數分頻比的步階為&lt;img align="absmiddle" height="37px" width="13px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;以實現&lt;img align="absmiddle" height="37px" width="133px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;分頻；其中，&lt;img align="absmiddle" height="37px" width="62px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;表示整數分頻比，&lt;img align="absmiddle" height="25px" width="70px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;表示小數分頻比，&lt;img align="absmiddle" height="24px" width="105px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。本發明無需使用複雜的電路即可實現小數分頻，也無需設置校正電路以降低相位雜訊，從而降低整體電路面積與功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="824" publication-number="202621323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有溝渠隔離結構的影像感測器及畫素</chinese-title>  
        <english-title>IMAGE SENSOR HAVING TRENCH ISOLATION STRUCTURE AND PIXEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250703B">H10F39/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福岡慎平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUOKA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹　古安諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAU, GUANNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像感測器包括多個畫素及形成在畫素之間的多個深溝渠隔離件。深溝渠隔離件包括多個背側深溝渠隔離件和多個前側深溝渠隔離件，背側深溝渠隔離件從基板的背面延伸並從外部圍繞相應的畫素的光電二極體和浮置擴散，前側深溝渠隔離件從基板的前表面延伸且具有面向背側深溝渠隔離件的上端的部分的下端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor includes a plurality of pixels, and deep trench isolations (DTIs) formed between the plurality of pixels. The deep trench isolations include back side deep trench isolations (BDTIs) extending from a back surface of a substrate and surrounding the photodiodes and the floating diffusions of the respective pixels from outside, and front side deep trench isolations (FDTIs) extending from a front surface of the substrate and having lower ends facing part of upper ends of the BDTIs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體基板</p>  
        <p type="p">10BS:背側表面</p>  
        <p type="p">10FS:前側表面</p>  
        <p type="p">12:光電二極體</p>  
        <p type="p">14:浮置擴散區</p>  
        <p type="p">16:絕緣膜</p>  
        <p type="p">18:傳輸閘極</p>  
        <p type="p">18a:水平閘極部分</p>  
        <p type="p">18b:垂直閘極部分</p>  
        <p type="p">20:傳輸電晶體</p>  
        <p type="p">22:背側深溝渠隔離件(BDTI)</p>  
        <p type="p">24:高介電常數介電層</p>  
        <p type="p">26:前側溝渠隔離件(FDTI)</p>  
        <p type="p">26US:上表面</p>  
        <p type="p">30:接觸件</p>  
        <p type="p">A:部分</p>  
        <p type="p">D&lt;sub&gt;FDTI&lt;/sub&gt;:前隔離深度</p>  
        <p type="p">D&lt;sub&gt;G&lt;/sub&gt;:閘極深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="825" publication-number="202621262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有嵌入式電容器的柱</chinese-title>  
        <english-title>PILLAR WITH EMBEDDED CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/60</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇拉吉　普拉卡什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURAJ PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　約翰　宗勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOHN JONG-HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維哈卡　沙彌爾　蘇尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VADHAVKAR, SAMEER SUNIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申憲　健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HEUN GUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡萊拉　法蘭西斯寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARRARA, FRANCESCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯庫德里　安東尼諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCUDERI, ANTONINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊，且係關於一種包括經組態以界定一電容器之一或多個結構的柱。例如，一種裝置包括一晶粒、一基材、及一柱，該柱具有一嵌入式電容器。該柱電連接至該晶粒之一或多個導體及該基材之一或多個導體。該柱包括一第一導電結構及一第二導電結構。該柱亦包括一介電層，該介電層設置在該第一導電結構與該第二導電結構之間以界定該嵌入式電容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication, and to a pillar that includes one or more structures configured to define a capacitor. For example, a device includes a die, a substrate, and a pillar having an embedded capacitor. The pillar is electrically connected to one or more conductors of the die and to one or more conductors of the substrate. The pillar includes a first conductive structure and a second conductive structure. The pillar also includes a dielectric layer disposed between the first conductive structure and the second conductive structure to define the embedded capacitor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">102:晶粒</p>  
        <p type="p">104:基材</p>  
        <p type="p">105:頂部表面</p>  
        <p type="p">106:柱</p>  
        <p type="p">110:第一導電結構；導電結構</p>  
        <p type="p">112:第二導電結構；導電結構</p>  
        <p type="p">114:第一介電層；介電層</p>  
        <p type="p">116:焊料</p>  
        <p type="p">120:額外柱；柱</p>  
        <p type="p">122:積體電路系統</p>  
        <p type="p">131:金屬層</p>  
        <p type="p">132:金屬層</p>  
        <p type="p">134:金屬層</p>  
        <p type="p">136:第二介電層；介電層</p>  
        <p type="p">138:介電層</p>  
        <p type="p">140:厚度</p>  
        <p type="p">142:厚度</p>  
        <p type="p">144:電容耦接路徑；電容耦接信號路徑；AC路徑</p>  
        <p type="p">146:DC信號路徑；直流路徑；DC路徑</p>  
        <p type="p">148:接觸件</p>  
        <p type="p">150:接觸件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="826" publication-number="202621301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/80</main-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="200601120260223B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡塏旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, KAI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旻珈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬義翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, I-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷立煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林益安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YIH-ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RYAN CHIA-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在奈米片釋放製程期間蝕刻奈米結構電晶體的奈米結構通道，以移除奈米結構通道之間的犧牲奈米結構層。控制奈米結構通道的蝕刻以提高蝕刻製程的效率，從而移除奈米結構通道的中心部分的雜質。更詳細地，控制蝕刻的溫度及/或壓力等參數以抵消高能量阻障且增加蝕刻劑吸附。因此，蝕刻製程中之奈米結構通道上的材料移除速度的均勻性得到改善，從而形成具有基本均勻的表面輪廓的奈米結構通道。本文描述的技術可降低奈米結構電晶體的通道電阻，從而可提高奈米結構電晶體的性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Nanostructure channels of a nanostructure transistor are etched during a nanosheet release process for removing sacrificial nanostructure layers between the nanostructure channels. The etching of the nanostructure channels is controlled to increase the efficiency of the etching process such that impurities at central portions of the nanostructure channels are removed. In more detail, parameters such as temperature and/or pressure for etching are controlled to counter the high energy barriers and increase etchant adsorption. As a result, the uniformity in the material removal rates across the nanostructure channels during the etching process is improved so that the nanostructure channels are formed to have a substantially uniform surface profile. The techniques described herein may reduce channel resistance of the nanostructure transistor, which may increase the performance of the nanostructure transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:半導體裝置</p>  
        <p type="p">110:半導體基板</p>  
        <p type="p">220a:第一間隔層</p>  
        <p type="p">220b:第二間隔層</p>  
        <p type="p">310:台面區域</p>  
        <p type="p">315:奈米結構通道</p>  
        <p type="p">410:內間隔物</p>  
        <p type="p">505:緩衝區域</p>  
        <p type="p">510:源極/汲極區域</p>  
        <p type="p">515:覆蓋層</p>  
        <p type="p">605:介電層</p>  
        <p type="p">700:實施</p>  
        <p type="p">705:輪廓部分</p>  
        <p type="p">B-B:截面</p>  
        <p type="p">D1,D2:尺寸</p>  
        <p type="p">X,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="827" publication-number="202619832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射處理平坦化製程的方法</chinese-title>  
        <english-title>A METHOD OF PLANARIZATION PROCESS WITH LASER TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260223B">B23K26/352</main-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JHIH GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括在第二層上形成第一層；對第一層進行雷射處理製程，其中雷射處理製程包括將雷射光束引導到第一層中，其中雷射光束改質第一層；在第一層進行雷射處理製程後，將第一層進行平坦化製程以去除第一層，其中平坦化製程暴露第二層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first layer over a second layer; performing a laser treatment process on the first layer, wherein the laser treatment process includes directing a laser beam into the first layer, wherein the laser beam modifies the first layer; and after performing the laser treatment process on the first layer, performing a planarization process on the first layer to remove the first layer, wherein the planarization process exposes the second layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:下層(層)</p>  
        <p type="p">10A:下部區域</p>  
        <p type="p">10B:上部區域</p>  
        <p type="p">10B’:上部區域</p>  
        <p type="p">30:雷射光源</p>  
        <p type="p">32:雷射光束</p>  
        <p type="p">33:焦點</p>  
        <p type="p">D2:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="828" publication-number="202621531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基材與嵌入半導體晶粒之方法</chinese-title>  
        <english-title>SUBSTRATE AND METHOD OF EMBEDDING SEMICONDUCTOR DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰斯勒　克里斯多福　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TESSLER, CHRISTOPHER LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基材的實施方案可包括：一半導體材料；一重佈線層，其係耦接至該半導體材料的一第一最大平坦表面；及一中空通孔，其係自該半導體材料的一第二最大平坦表面完全延伸穿過該半導體材料的厚度，該中空通孔直接與該重佈線層耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of a substrate may include a semiconductor material; a redistribution layer coupled to a first largest planar surface of the semiconductor material; and a hollow via extending from a second largest planar surface of the semiconductor material completely through a thickness of the semiconductor material, the hollow via directly coupled with the redistribution layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">38:矽基材</p>  
        <p type="p">42:重佈線層</p>  
        <p type="p">44:厚銅跡線</p>  
        <p type="p">48:氧化物層</p>  
        <p type="p">50:第二最大平坦表面</p>  
        <p type="p">52:第一最大平坦表面</p>  
        <p type="p">54:穿矽通孔</p>  
        <p type="p">56:厚銅層</p>  
        <p type="p">58:跡線</p>  
        <p type="p">60:基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="829" publication-number="202621318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成影像感測器封裝的方法</chinese-title>  
        <english-title>METHOD OF FORMING IMAGE SENSOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10F39/12</main-classification>  
        <further-classification edition="202501120260223B">H10D89/60</further-classification>  
        <further-classification edition="202601120260223B">H10W42/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧布古班　喬吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUBGUBAN, JORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯特　加布里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT, GABRIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成影像感測器封裝之方法的實施方案可包括：提供包括影像感測器晶粒的一影像感測器基材；將一光學透射性基材接合至該影像感測器基材；形成複數個電性互連線於該影像感測器基材上；以及在形成該複數個電性互連線之後，將該光學透射性基材薄化至所需厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of a method of forming an image sensor package may include providing an image sensor substrate including image sensor die; bonding an optically transmissive substrate to the image sensor substrate; forming a plurality of electrical interconnects on the image sensor substrate; and, after forming the plurality of electrical interconnects, thinning the optically transmissive substrate to a desired thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:影像感測器基材</p>  
        <p type="p">42:光學透射性基材</p>  
        <p type="p">44:鈦鎢層</p>  
        <p type="p">46:暴露的最大平坦表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="830" publication-number="202621319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測器封裝體</chinese-title>  
        <english-title>IMAGE SENSOR PACKAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10F39/12</main-classification>  
        <further-classification edition="202501120260223B">H10F39/18</further-classification>  
        <further-classification edition="202601120260223B">H10W99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博塔庫爾　斯瓦爾納爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORTHAKUR, SWARNAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾蒙德　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALMOND, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像感測器封裝體，該影像感測器封裝體可包括光學透射蓋，該光學透射蓋包括：第一層耦接至光學透射蓋的最大平坦表面；及複數個奈米結構在該第一層中與光學透射蓋的周邊相鄰。該複數個奈米結構可形成實質上日盲的紫外光通過濾波器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor package may include an optically transmissive cover including a first layer coupled to a largest planar surface of the optically transmissive cover; and a plurality of nanostructures in the first layer located adjacent a perimeter of the optically transmissive cover. The plurality of nanostructures may form a substantially solar-blind ultraviolet light pass filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">38:影像感測器封裝體</p>  
        <p type="p">40:奈米結構</p>  
        <p type="p">42:光學透射蓋</p>  
        <p type="p">44:影像感測器晶粒</p>  
        <p type="p">46:黏合劑</p>  
        <p type="p">48:周邊</p>  
        <p type="p">49:主動區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="831" publication-number="202621298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的形成方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10D84/01</main-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙　竹軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHA, CHU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳思亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成半導體裝置的方法，包括：在基板上方形成導電性特徵；在導電性特徵及基板上方形成介電層；在介電層上方形成多晶材料之一層，其中多晶材料之第一小平面與第二小平面具有不同的晶格密度；在多晶材料之第一小平面上選擇性地吸附材料之分子；在選擇性地吸附材料之分子之後，對多晶材料之層執行平坦化製程，其中平坦化製程在第一小平面處以第一移除速率移除多晶材料，在第二小平面處以第二移除速率移除多晶材料，其中第一小平面上的材料之分子導致第一移除速率與第二移除速率之間的差異減小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a semiconductor device includes: forming an electrically conductive feature over a substrate; forming a dielectric layer over the electrically conductive feature and the substrate; forming a layer of a polycrystalline material over the dielectric layer, where a first facet of the polycrystalline material and a second facet of the polycrystalline material have different lattice densities; selectively adsorbing molecules of a material on the first facet of the polycrystalline material; and after selectively adsorbing molecules of the material, performing a planarization process to the layer of the polycrystalline material, where the planarization process removes the polycrystalline material at a first removal rate at the first facet and removes the polycrystalline material at a second removal rate at the second facet, where the molecules of the material on the first facet cause a decrease in a difference between the first removal rate and the second removal rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">54:第二半導體材料</p>  
        <p type="p">55:內部間隔物</p>  
        <p type="p">99:矽化物區</p>  
        <p type="p">100:NSFET裝置</p>  
        <p type="p">108:閘極間隔層</p>  
        <p type="p">112:源極/汲極區</p>  
        <p type="p">114:第一ILD</p>  
        <p type="p">116:CESL</p>  
        <p type="p">118:閘極接觸插座</p>  
        <p type="p">119:源極/汲極接觸插座</p>  
        <p type="p">120:閘極介電層</p>  
        <p type="p">122:閘電極</p>  
        <p type="p">123:替換閘極結構</p>  
        <p type="p">130:前側互連結構</p>  
        <p type="p">131:通孔</p>  
        <p type="p">132:導電特徵</p>  
        <p type="p">132P:導電特徵</p>  
        <p type="p">134:ESL</p>  
        <p type="p">135:第二ILD</p>  
        <p type="p">136:介電層</p>  
        <p type="p">136T:最頂介電層</p>  
        <p type="p">138:閘極遮罩</p>  
        <p type="p">142:裝置層</p>  
        <p type="p">143:介電材料</p>  
        <p type="p">145:ESL</p>  
        <p type="p">147:襯裡層</p>  
        <p type="p">149:散熱裝置</p>  
        <p type="p">150:虛線</p>  
        <p type="p">151:後側互連結構</p>  
        <p type="p">200:NSFET裝置</p>  
        <p type="p">300:CFET裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="832" publication-number="202621304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/83</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-GING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容的實施方式提供了一種半導體裝置其包括：基板其具有前側和與該基板的前側相對的背側；通道區域其設置在介於第一源極/汲極區域和第二源極/汲極區域之間和在基板的前側上方；閘極結構其設置在通道區域上方；以及第一觸點其設置在基板中，其中第一觸點包括從基板背側延伸的第一側壁和延伸到第一源極/汲極區域的第二側壁，其中第一側壁和第二側壁在第一觸點的一相同側，其中第二側壁沿著從基板背側朝向第一源極/汲極區域的垂直方向水平地更遠離第二源極/汲極區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a semiconductor device that includes a substrate having a frontside and a backside opposite to the frontside of the substrate; a channel region disposed between a first source/drain region and a second source/drain region and over the frontside of the substrate; a gate structure disposed over the channel region; and a first contact disposed in the substrate, wherein the first contact includes a first sidewall extending from the backside of the substrate and a second sidewall extending to the first source/drain region, wherein the first sidewall and the second sidewall are on a same side of the first contact, wherein the second sidewall is horizontally more distant away from the second source/drain region along a vertical direction from the backside of the substrate toward the first source/drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">100A:電晶體結構</p>  
        <p type="p">101:基板</p>  
        <p type="p">101B:背側</p>  
        <p type="p">110:第一奈米結構</p>  
        <p type="p">138:閘極間隔物</p>  
        <p type="p">150:內部間隔物</p>  
        <p type="p">154:隔離填充物</p>  
        <p type="p">158:源極/汲極區域</p>  
        <p type="p">158A:源極/汲極區域</p>  
        <p type="p">158B:源極/汲極區域</p>  
        <p type="p">162:第一層間介電質層</p>  
        <p type="p">172:閘極結構</p>  
        <p type="p">174:第二層間介電質層</p>  
        <p type="p">176:接觸蝕刻停止層</p>  
        <p type="p">178:觸點</p>  
        <p type="p">182:矽化物區域</p>  
        <p type="p">183:前側互連件結構</p>  
        <p type="p">184:導電特徵</p>  
        <p type="p">186:介電層</p>  
        <p type="p">188:載體基板</p>  
        <p type="p">190:接合層</p>  
        <p type="p">192:背側觸點(觸點)</p>  
        <p type="p">192A:第一側壁</p>  
        <p type="p">192B:第二側壁</p>  
        <p type="p">192C:第三側壁</p>  
        <p type="p">192D:第四側壁</p>  
        <p type="p">192E:第一底部</p>  
        <p type="p">192F:第二底部</p>  
        <p type="p">1921:阻障層</p>  
        <p type="p">1922:填充材料</p>  
        <p type="p">193:矽化物區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="833" publication-number="202621384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/68</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮川彰平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAGAWA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾辻正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUJI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春本晶子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARUMOTO, AKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種基板處理方法及基板處理裝置1。基板處理方法係用以處理基板W者。基板W包含第1層31、及第2層32。第1層31例如為包含氧化矽之氧化矽層。於第1層31中，第1露出面31S露出。第1露出面31S例如為氧化矽露出面。第2層32例如為包含氮化矽之氮化矽層。於第2層32中，第2露出面32S露出。第2露出面32S例如為氮化矽露出面。基板處理方法包括蝕刻工序。於蝕刻工序中，將蝕刻液Jn供給至基板W。蝕刻液Jn包含氫氟酸及重水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:第1層</p>  
        <p type="p">31S:第1露出面</p>  
        <p type="p">32:第2層</p>  
        <p type="p">32S:第2露出面</p>  
        <p type="p">D31:第1露出寬度</p>  
        <p type="p">D32:第2露出寬度</p>  
        <p type="p">E31:第1露出面積</p>  
        <p type="p">E32:第2露出面積</p>  
        <p type="p">F31:方向</p>  
        <p type="p">F32:方向</p>  
        <p type="p">H31:第1層之蝕刻量</p>  
        <p type="p">H32:第2層之蝕刻量</p>  
        <p type="p">W:基板</p>  
        <p type="p">W1:面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="834" publication-number="202619981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電去離子水製造系統及其運用方法</chinese-title>  
        <english-title>ELECTRODEIONIZED WATER PRODUCTION SYSTEM AND METHOD OF OPERATING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260203B">C02F1/469</main-classification>  
        <further-classification edition="200601120260203B">B01D61/58</further-classification>  
        <further-classification edition="200601120260203B">B01D61/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴崎賢治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBASAKI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木慶介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種電去離子水製造系統（EDI系統）的運用方法，該系統以具備電去離子水製造裝置（EDI裝置）的方式構成，該運用方法的特徵為包含以下步驟：當設置於第1設置場所P1的EDI裝置10處於運轉狀態，且設置於第2設置場所P2的EDI裝置10處於停止狀態時，將對應第1設置場所P1的供給閥41以及排出閥61關閉，同時將對應第2設置場所P2的供給閥42以及排出閥62打開，令設置於第1設置場所P1的EDI裝置10為停止狀態，並令設置於第2設置場所P2的EDI裝置10為運轉狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of operating an EDI system comprising an EDI device (electrodeionized water production device), wherein when an EDI device 10 provided in a first installation location P1 is in an operational state and an EDI device 10 provided in a second installation location P2 is in a stopped state, a supply valve 41 and a discharge valve 42 corresponding with the first installation location P1 are closed while a supply valve 42 and a discharge valve 62 corresponding with the second installation location P2 are simultaneously opened, thereby placing the EDI device 10 provided in the first installation location P1 in a stopped state and the EDI device 10 provided in the second installation location P2 in an operational state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電去離子水製造裝置(EDI裝置)</p>  
        <p type="p">15:直流電源</p>  
        <p type="p">21C,21D,21E,22C,22D,22E:連接構件</p>  
        <p type="p">23,24:電連接構件</p>  
        <p type="p">30,30C,30D,30E,31C,31D,31E,32C,32D,32E,33C,33D,33E:配管</p>  
        <p type="p">40:入口閥</p>  
        <p type="p">41~43,61~63:閥門</p>  
        <p type="p">41C,41D,41E:開閉閥</p>  
        <p type="p">50C,50D,50E,51C,51D,51E,52C,52D,52E,53C,53D,53E:配管</p>  
        <p type="p">60:出口閥</p>  
        <p type="p">61C,61D,61E:開閉閥</p>  
        <p type="p">70:控制裝置</p>  
        <p type="p">C:濃縮室</p>  
        <p type="p">D:脫鹽室</p>  
        <p type="p">E:電極室</p>  
        <p type="p">P:泵</p>  
        <p type="p">P1~P3:設置場所</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="835" publication-number="202621305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/83</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳於貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-BEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王屏薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例有關於半導體結構以及用以製造半導體結構的方法。方法包括：接收中間結構，中間結構包括n型電晶體及p型電晶體；在n型電晶體及p型電晶體下形成介電結構；形成第一溝槽及第二溝槽，第一溝槽及第二溝槽延伸通過介電結構；第一溝槽暴露n型電晶體的源極/汲極特徵的底面，第二溝槽暴露p型電晶體的源極/汲極特徵的底面；其中，第二溝槽的深度大於第一溝槽的深度；分別在第一溝槽及第二溝槽中形成第一矽化物層及第二矽化物層；以及分別在第一溝槽及第二溝槽中形成第一後側通孔及第二後側通孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor structures and methods of fabricating the semiconductor structures are described. An exemplary method includes receiving an intermediate structure comprising an n-type transistor and a p-type transistor, forming a dielectric structure under the n-type transistor and the p-type transistor, forming a first trench and a second trench each extending through the dielectric structure, the first trench exposing a bottom surface of a source/drain feature of the n-type transistor, the second trench exposing a bottom surface of a source/drain feature of the p-type transistor, wherein a depth of the second trench is greater than a depth of the first trench, forming a first silicide layer and a second silicide layer in the first trench and the second trench, respectively, and forming a first backside via and a second backside via in the first trench and the second trench, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:方法</p>  
        <p type="p">41,42,43,44,45,46,47:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="836" publication-number="202621290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D62/13</main-classification>  
        <further-classification edition="202501120250801B">H10D30/62</further-classification>  
        <further-classification edition="202301120250801B">H10B10/00</further-classification>  
        <further-classification edition="202501120250801B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪連嶸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, LIEN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置結構及其形成方法。半導體裝置結構包括第一源極/汲極區、與第一源極/汲極區相鄰設置的第二源極/汲極區、設置於第一源極/汲極區上方的接觸蝕刻停止層、設置於接觸蝕刻停止層上方的第一層間介電(ILD)層、設置於接觸蝕刻停止層上表面及第一層間介電(ILD)層上表面上方的蝕刻停止層、設置於蝕刻停止層上方的第二層間介電(ILD)層、設置於第一源極/汲極區及第二源極/汲極區下方的第一導電特徵部件、以及設置於第一源極/汲極區及第二源極/汲極區上方的第二導電特徵部件。第二導電特徵部件電性連接至第一及第二源極/汲極區，且第一及第二導電特徵部件彼此接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The semiconductor device structure includes a first source/drain region, a second source/drain region disposed adjacent the first source/drain region, a contact etch stop layer disposed over the first source/drain region, a first interlayer dielectric(ILD)layer disposed over the contact etch stop layer, an etch stop layer disposed over a top surface of the contact etch stop layer and a top surface of the first ILD layer, a second ILD layer disposed over the etch stop layer, a first conductive feature disposed below the first and second source/drain regions, and a second conductive feature disposed above the first and second source/drain regions. The second conductive feature is electrically connected to the first and second source/drain regions, and the first and second conductive features are in contact with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基底</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">116:基底部</p>  
        <p type="p">118:絕緣材料</p>  
        <p type="p">120:隔離區</p>  
        <p type="p">140a:第一部</p>  
        <p type="p">144:介電間隔物</p>  
        <p type="p">146:源極/汲極(S/D)區</p>  
        <p type="p">162:接觸蝕刻停止層(CESL)</p>  
        <p type="p">163:層間介電(ILD)層</p>  
        <p type="p">168:界面層(IL)</p>  
        <p type="p">170:閘極介電層</p>  
        <p type="p">172:閘極電極層</p>  
        <p type="p">174:閘極結構</p>  
        <p type="p">180:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="837" publication-number="202621250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置、唯讀記憶體電路及積體電路裝置的製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE, READ-ONLY MEMORY CIRCUIT AND MANUFACTURING METHOD OF INTEGRATED CIRCUIT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251208B">H10B20/20</main-classification>  
        <further-classification edition="200601120251208B">G11C17/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李紀寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊耀仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃家恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIA-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種IC裝置，包括第一電晶體及第二電晶體，第一電晶體包括耦接至第一字元線且包括第一功函數組態的第一閘極、與第一閘極相鄰並耦接至位元線或參考線中之一者的第一類金屬界定(MD)區段、與第一閘極相鄰且耦接至位元線或參考線中之另一者的第二MD區段；第二電晶體包括耦接至第二字元線且包括不同於第一功函數組態的第二功函數組態的第二閘極、與第二閘極相鄰的第二MD區段、及與第二閘極相鄰且耦接至位元線或參考線中之一者的第三MD區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC device includes a first transistor including a first gate coupled to a first word line and including a first work function configuration, a first metal-like defined (MD) segment adjacent to the first gate and coupled to one of a bit line or reference line, and a second MD segment adjacent to the first gate and coupled to the other of the bit line or the reference line, and a second transistor including a second gate coupled to a second word line and including a second work function configuration different from the first work function configuration, the second MD segment adjacent to the second gate, and a third MD segment adjacent to the second gate and coupled to the one of the bit line or the reference line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體電路</p>  
        <p type="p">110:陣列</p>  
        <p type="p">112:記憶體單元</p>  
        <p type="p">120:字元線驅動器</p>  
        <p type="p">130:讀取介面</p>  
        <p type="p">140:控制電路</p>  
        <p type="p">142:處理器</p>  
        <p type="p">144:儲存媒體</p>  
        <p type="p">WL0~WL3:字元線</p>  
        <p type="p">BL0~BL3:位元線</p>  
        <p type="p">VSS:參考線</p>  
        <p type="p">CTRL:控制信號</p>  
        <p type="p">CTRLB:控制信號匯流排</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="838" publication-number="202620447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析電線束</chinese-title>  
        <english-title>ANALYZING BUNDLES OF WIRES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G01R31/11</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商泰瑞達公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADYNE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈赫爾　圖沙爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOHEL, TUSHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法勒　札卡里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARRER, ZACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例系統經組態以偵測一電線束中的一故障。該電線束包括一第一電線及一第二電線。該系統包括：一第一驅動器，其可與該第一電線電連接及電斷開；一第二驅動器，其可與該第二電線電連接及電斷開；及一控制系統，其用以控制該第一驅動器電連接至該第一電線且將一信號輸出至該第一電線，控制該第二驅動器電連接至該第二電線且將一靜態電壓驅動至該第二電線以使該第二電線能夠充當該第一電線的一信號回路，及基於該第一電線上的該信號之一反射來偵測該第一電線中的一故障。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example system is configured to detect a fault in a bundle of wires. The bundle of wires include a first wire and a second wire. The system includes a first driver that is electrically connectable to, and electrically disconnectable from, the first wire; a second driver that is electrically connectable to, and electrically disconnectable from, the second wire; and a control system to control the first driver to electrically connect to the first wire and to output a signal to the first wire, to control the second driver to electrically connect to the second wire and to drive a static voltage to the second wire to enable the second wire to act as a signal return for the first wire, and to detect a fault in the first wire based on a reflection of the signal on the first wire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52:測試系統；系統；測試儀器</p>  
        <p type="p">54a:測試通道</p>  
        <p type="p">54b:測試通道</p>  
        <p type="p">56a:驅動器電路</p>  
        <p type="p">56b:驅動器電路</p>  
        <p type="p">58a:接收器電路</p>  
        <p type="p">58b:接收器電路</p>  
        <p type="p">60a:傳輸線</p>  
        <p type="p">60b:傳輸線</p>  
        <p type="p">62a:電阻器</p>  
        <p type="p">64a:分路</p>  
        <p type="p">66a:臨限</p>  
        <p type="p">68a:邏輯</p>  
        <p type="p">68b:邏輯</p>  
        <p type="p">70:測試系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="839" publication-number="202621366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔離結構及隔離方法</chinese-title>  
        <english-title>ISOLATION STRUCTURES AND ISOLATION METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李存善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUN-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾仲銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUNG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杭孟琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANG, MENG CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾建霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一種用於形成介電隔離結構或容器的方法中，離子佈植經執行以在基本半導體材料中形成埋入式佈植區。溝槽形成於基本半導體材料中，溝槽觸及埋入式佈植區。埋入式佈植區藉由經由溝槽進行蝕刻來移除，以形成與溝槽連接的側向底切區。側向底切區及溝槽藉由介電材料填充以形成介電隔離結構的介電底部區及環形介電側壁。藉由以兩個或兩個以上循環形成溝槽及填充溝槽，藉由移除埋入式佈植區在此等循環中的一者之後執行，避免基本半導體材料之被包含部分的分離及自坍塌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a method for forming a dielectric isolation structure or container, ion implantation is performed to form a buried implant region in a base semiconductor material. Trenches are formed in the base semiconductor material that access the buried implant region. The buried implant region is removed by etching via the trenches to form a lateral undercut region connected with the trenches. The lateral undercut region and the trenches are filled with dielectric material to form a dielectric bottom region and annular dielectric sidewall of the dielectric isolation structure. By forming of the trenches and the filling of the trenches in two or more iterations, with the removal of the buried implant region being performed after one of these iterations, detachment and self-collapse of the contained portion of base semiconductor material is avoided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:介電隔離結構/介電隔離容器/介電遏制結構</p>  
        <p type="p">12:IC裝置或電路/電子組件</p>  
        <p type="p">14:基本半導體材料</p>  
        <p type="p">14C:部分/被包含部分</p>  
        <p type="p">16:底部部分/介電底部區</p>  
        <p type="p">16E:延伸部</p>  
        <p type="p">18:側壁部分/環形介電側壁/環繞側壁部分</p>  
        <p type="p">20:上表面</p>  
        <p type="p">L1:側向尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="840" publication-number="202621486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>重新佈線層基板及其製造方法</chinese-title>  
        <english-title>REDISTRIBUTION LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/43</main-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇仕傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周佳仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIA-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旋乃仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUAN, NAI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種重新佈線層基板包含頂層、底層、複數中間層以及保護層。頂層包含複數第一導電墊。底層包含複數第二導電墊。複數中間層設置於頂層及底層之間，複數中間層包含複數層間走線，分別連接各第一導電墊及各第二導電墊。保護層覆蓋頂層，保護層包含通孔，通孔於頂層定義投影範圍，部分之複數第一導電墊介於投影範圍之內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A RDL (Redistribution Layer) substrate includes a top layer, a bottom layer, a plurality of intermediate layers, and a protective layer. The top layer includes a plurality of first conductive pads. The bottom layer includes a plurality of second conductive pads. The plurality of intermediate layers is deployed between the top layer and the bottom layer, and the plurality of intermediate layers includes a plurality of interlayer traces, respectively connecting each of the first conductive pads to each of the second conductive pads. The protective layer covers the top layer and includes via holes. The via holes define a projection area on the top layer, wherein a portion of the plurality of first conductive pads is located within the projection area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:重新佈線層基板</p>  
        <p type="p">10:頂層</p>  
        <p type="p">11:第一導電墊</p>  
        <p type="p">14:第三子導電墊</p>  
        <p type="p">15:第四子導電墊</p>  
        <p type="p">20:中間層</p>  
        <p type="p">21:層間走線</p>  
        <p type="p">30:底層</p>  
        <p type="p">31:第二導電墊</p>  
        <p type="p">40:第一保護層</p>  
        <p type="p">41:第一通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="841" publication-number="202621474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202501120260223B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　奕鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNG, ERIC PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>褚立新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, LI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江文智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括相對於複數個電晶體垂直設置並電性耦接該些電晶體的複數個金屬化層。各該金屬化層包括金屬線和金屬穿孔。各該金屬線和各該金屬穿孔耦接至阻障層。金屬線和金屬穿孔各自基本上由包含銅(Cu)、銀(Ag)和碳(C)的第一材料組成。阻障層基本上由包括氮化鋯(ZrN)的第二材料組成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a plurality of metallization layers vertically disposed with respect to and electrically couple to a plurality of transistors. Each of the plurality of metallization layers includes a metal line and a metal via. Each of the metal lines and the metal vias are coupled to a barrier layer. The metal lines and the metal vias each essentially consist of a first material comprising copper (Cu), silver (Ag), and carbon (C). The barrier layer essentially consists of a second material including zirconium nitride (ZrN).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:源極/汲極終端</p>  
        <p type="p">12:閘極終端</p>  
        <p type="p">13:導體結構/金屬線結構</p>  
        <p type="p">14:導體結構/金屬線結構</p>  
        <p type="p">15:導體結構/金屬穿孔結構</p>  
        <p type="p">16:導體結構/金屬穿孔結構</p>  
        <p type="p">18:金屬墊</p>  
        <p type="p">19:重分布層</p>  
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">101F:前表面</p>  
        <p type="p">T1:電晶體</p>  
        <p type="p">L0:金屬線</p>  
        <p type="p">L1:金屬線</p>  
        <p type="p">L2:金屬線</p>  
        <p type="p">L3:金屬線</p>  
        <p type="p">L4:金屬線</p>  
        <p type="p">L5:金屬線</p>  
        <p type="p">L6:金屬線</p>  
        <p type="p">L7:金屬線</p>  
        <p type="p">L8:金屬線</p>  
        <p type="p">L9:金屬線</p>  
        <p type="p">L10:金屬線</p>  
        <p type="p">L11:金屬線</p>  
        <p type="p">L12:金屬線</p>  
        <p type="p">L13:金屬線</p>  
        <p type="p">L14:金屬線</p>  
        <p type="p">L15:金屬線</p>  
        <p type="p">M0:金屬化層</p>  
        <p type="p">M1:金屬化層</p>  
        <p type="p">M2:金屬化層</p>  
        <p type="p">M3:金屬化層</p>  
        <p type="p">M4:金屬化層</p>  
        <p type="p">M5:金屬化層</p>  
        <p type="p">M6:金屬化層</p>  
        <p type="p">M7:金屬化層</p>  
        <p type="p">M8:金屬化層</p>  
        <p type="p">M9:金屬化層</p>  
        <p type="p">M10:金屬化層</p>  
        <p type="p">M11:金屬化層</p>  
        <p type="p">M12:金屬化層</p>  
        <p type="p">M13:金屬化層</p>  
        <p type="p">M14:金屬化層</p>  
        <p type="p">M15:金屬化層</p>  
        <p type="p">V0:金屬穿孔</p>  
        <p type="p">V1:金屬穿孔</p>  
        <p type="p">V2:金屬穿孔</p>  
        <p type="p">V3:金屬穿孔</p>  
        <p type="p">V4:金屬穿孔</p>  
        <p type="p">V5:金屬穿孔</p>  
        <p type="p">V6:金屬穿孔</p>  
        <p type="p">V7:金屬穿孔</p>  
        <p type="p">V8:金屬穿孔</p>  
        <p type="p">V9:金屬穿孔</p>  
        <p type="p">V10:金屬穿孔</p>  
        <p type="p">V11:金屬穿孔</p>  
        <p type="p">V12:金屬穿孔</p>  
        <p type="p">V13:金屬穿孔</p>  
        <p type="p">V14:金屬穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="842" publication-number="202621321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理基材之方法</chinese-title>  
        <english-title>METHOD OF PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10F39/15</main-classification>  
        <further-classification edition="202501120260223B">H10F39/18</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯特　加布里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT, GABRIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理基材之方法的實施方案可包括：提供一半導體基材；在該半導體基材的一周邊，移除該半導體基材之一預定厚度的材料；及施加一黏著劑至該半導體基材的一最大平坦表面。該方法可包括：施加一密封材料在該半導體基材的該周邊；及使用該黏著劑及該密封材料將一光學透射性基材接合至該半導體基材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of a method of processing a substrate may include providing a semiconductor substrate; removing a predetermined thickness of material of the semiconductor substrate at a perimeter of the semiconductor substrate; and applying an adhesive to a largest planar surface of the semiconductor substrate. The method may include applying a sealing material at the perimeter of the semiconductor substrate, and bonding an optically transmissive substrate to the semiconductor substrate using the adhesive and the sealing material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:凹槽</p>  
        <p type="p">28:黏著劑層</p>  
        <p type="p">32:噴嘴</p>  
        <p type="p">34:密封材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="843" publication-number="202621251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116991</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及包含半導體裝置之資料儲存系統</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H10B41/27</main-classification>  
        <further-classification edition="202301120251001B">H10B41/40</further-classification>  
        <further-classification edition="202301120251001B">H10B43/27</further-classification>  
        <further-classification edition="202301120251001B">H10B43/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴昞坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYUNGGON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳炫錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYUNSYEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴峻範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNBEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愼鏞畯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YONGJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳守植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SOOSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珳根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MOONGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包含一第一半導體結構及一第二半導體結構。該第一半導體結構包含：電路元件，其在一第一基體上；一下部互連結構，其與該等電路元件耦接；以及一下部接合結構，其與該下部互連結構耦接。該第二半導體結構包含：一上部接合結構，其接合至該下部接合結構；一傳導層；一堆疊結構，其包含層間絕緣層及閘極電極；複數個分離區，其至少部分地穿透該堆疊結構；通道結構，其包含一通道層且至少部分地穿透該堆疊結構；複數個位址柱，其彼此間隔開一第一分離距離；複數個通道柱，其在該等通道結構下方；以及一上部互連結構，其在該堆疊結構下方、與該等複數個通道柱耦接且與該等複數個位址柱間隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes circuit elements on a first substrate, a lower interconnection structure coupled with the circuit elements, and a lower bonding structure coupled with the lower interconnection structure. The second semiconductor structure includes an upper bonding structure bonded to the lower bonding structure, a conductive layer, a stack structure including interlayer insulating layers and gate electrodes, a plurality of separation regions at least partially penetrating through the stack structure, channel structures including a channel layer and at least partially penetrating through the stack structure, a plurality of address studs spaced apart from each other by a first separation distance, a plurality of channel studs below the channel structures, and an upper interconnection structure below the stack structure, coupled with the plurality of channel studs, and spaced apart from the plurality of address studs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">101:第一基體</p>  
        <p type="p">105:源極/汲極區</p>  
        <p type="p">110:裝置隔離層</p>  
        <p type="p">120:電路元件</p>  
        <p type="p">122:電路閘極介電層</p>  
        <p type="p">124:電路閘極電極</p>  
        <p type="p">126:間隔體層</p>  
        <p type="p">130:下部互連結構</p>  
        <p type="p">135:下部接觸插塞</p>  
        <p type="p">137:下部互連線</p>  
        <p type="p">180:下部接合結構</p>  
        <p type="p">182:下部接合通孔</p>  
        <p type="p">184:下部接合襯墊</p>  
        <p type="p">186:下部接合絕緣層</p>  
        <p type="p">190:下部罩蓋層</p>  
        <p type="p">201:第一傳導層</p>  
        <p type="p">202:第二傳導層</p>  
        <p type="p">220:層間絕緣層</p>  
        <p type="p">222:最下層間絕緣層</p>  
        <p type="p">223:最上層間絕緣層</p>  
        <p type="p">225:中間層間絕緣層</p>  
        <p type="p">230:閘極電極</p>  
        <p type="p">230L:下部閘極電極</p>  
        <p type="p">230U:上部閘極電極</p>  
        <p type="p">264:分離絕緣層</p>  
        <p type="p">266:上部分離絕緣層</p>  
        <p type="p">271:第一上部互連線/上部互連結構</p>  
        <p type="p">272:通道柱</p>  
        <p type="p">273:連接通孔/上部互連結構/上部通孔</p>  
        <p type="p">274:第二上部互連線/上部互連結構</p>  
        <p type="p">275:位址柱</p>  
        <p type="p">280:上部接合結構</p>  
        <p type="p">281:上部接合通孔</p>  
        <p type="p">284:上部接合襯墊</p>  
        <p type="p">286:上部接合絕緣層</p>  
        <p type="p">290:上部罩蓋層</p>  
        <p type="p">B,C:區</p>  
        <p type="p">CH:通道結構</p>  
        <p type="p">CH1:第一通道結構</p>  
        <p type="p">CH2:第二通道結構</p>  
        <p type="p">CSL:共同源極線</p>  
        <p type="p">GS1:第一堆疊結構/下部堆疊結構</p>  
        <p type="p">GS2:第二堆疊結構/上部堆疊結構</p>  
        <p type="p">MSc:位址分離區</p>  
        <p type="p">S1:第一半導體結構</p>  
        <p type="p">S2:第二半導體結構</p>  
        <p type="p">SS:絕緣區</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="844" publication-number="202621516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件的形成方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">形成一半導體元件的方法包括:在互連結構的導電特徵的表面上形成自對準材料(SAM)，其中，互連結構形成在包括電晶體的裝置層的第一側，其中，導電特徵嵌入在互連結構遠離裝置層的最外層介電層中，並且導電特徵的表面被最外層介電層暴露；形成SAM之後，在互連結構的最外層介電層上選擇性地形成介電層；並且在選擇性地形成介電層之後，從導電特徵的表面去除SAM，其中在去除SAM之後，介電層從裝置層延伸得比導電特徵遠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a semiconductor device includes: forming a self-aligned material (SAM) on a surface of a conductive feature of an interconnect structure, where the interconnect structure is formed at a first side of a device layer that includes a transistor, where the conductive feature is embedded in an outermost dielectric layer of the interconnect structure distal from the device layer, and the surface of the conductive feature is exposed by the outermost dielectric layer; after forming the SAM, selectively forming a dielectric layer on the outermost dielectric layer of the interconnect structure; and after selectively forming the dielectric layer, removing the SAM from the surface of the conductive feature, where after removing the SAM, the dielectric layer extends further from the device layer than the conductive feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基板</p>  
        <p type="p">54:奈米結構(半導體材料)</p>  
        <p type="p">55:內間隔層</p>  
        <p type="p">90:半導體鰭(鰭)</p>  
        <p type="p">99:區域</p>  
        <p type="p">100:NSFET元件</p>  
        <p type="p">108:閘極間隔層(閘極間隔物)</p>  
        <p type="p">112:源極/汲極區域</p>  
        <p type="p">114:層間介電質(ILD)</p>  
        <p type="p">116:蝕刻停止層(CESL)</p>  
        <p type="p">118:閘極接觸塞</p>  
        <p type="p">119:源極/汲極接觸塞</p>  
        <p type="p">120:閘極介電層(閘極介電材料)</p>  
        <p type="p">122:閘極電極(閘極電極材料)</p>  
        <p type="p">123:替代閘極結構</p>  
        <p type="p">130:前側互連結構</p>  
        <p type="p">131:通孔</p>  
        <p type="p">132:導電特徵</p>  
        <p type="p">132P:導電特徵(導電圖案)</p>  
        <p type="p">134:蝕刻停止層(ESL)</p>  
        <p type="p">135:第二ILD</p>  
        <p type="p">136:介電層</p>  
        <p type="p">136T:最頂部介電層(最外層介電層)</p>  
        <p type="p">137:自對準材料(SAM)</p>  
        <p type="p">138:閘極遮罩</p>  
        <p type="p">139:介電層</p>  
        <p type="p">142:裝置層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="845" publication-number="202621058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同步時間轉電荷轉換器</chinese-title>  
        <english-title>SYNCHRONOUS TIME-TO-CHARGE CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H03M1/66</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　嘉亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">時間轉電荷轉換器包括：相位偵測器，用以接收第一時脈與第二時脈，並輸出指示該第二時脈與該第一時脈之間的一時間差的相位誤差訊號； 電流源，用以產生一尾電流； 電流導向網路，用以根據該相位誤差訊號將該尾電流導向一第一節點或一第二節點；同步時脈產生器，用以接收該第一時脈並產生與該第一時脈同步但具有獨立決定工作週期的一第三時脈；積分電容，其頂板連接至該第二節點，且其底板由該第三時脈的一反相訊號驅動；開關，設置於第三節點與該第二節點之間，並由該第三時脈控制；以及負載電容，連接至該第三節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A time-to-charge converter (TCC) includes a phase detector configured to receive a first clock and a second clock and output a phase error signal indicative of the time difference between the second clock and the first clock; a current source configured to generate a tail current; a current directing network configured to direct the tail current towards either a first node or a second node based on the phase error signal; a synchronous clock generator configured to receive the first clock and generate a third clock that is synchronous to the first clock but has an independently determined duty cycle; an integration capacitor having a top plate connected to the second node and a bottom plate driven by an inversion of the third clock; a switch positioned between a third node and the second node, controlled by the third clock; and a load capacitor attached to the third node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">I_10:第一支路</p>  
        <p type="p">I_11:第二支路</p>  
        <p type="p">200:時間轉電荷轉換器</p>  
        <p type="p">201:第一節點</p>  
        <p type="p">202:第二節點</p>  
        <p type="p">203:第三節點</p>  
        <p type="p">204:源極節點</p>  
        <p type="p">210:相位偵測器</p>  
        <p type="p">220:電流源</p>  
        <p type="p">230:電流導向網路</p>  
        <p type="p">240:負載</p>  
        <p type="p">260:偏移電荷傳輸電路</p>  
        <p type="p">261:PMOS電晶體</p>  
        <p type="p">262:源極開關</p>  
        <p type="p">263:重置開關</p>  
        <p type="p">270:參考電壓產生器</p>  
        <p type="p">271:電流源</p>  
        <p type="p">272:電阻</p>  
        <p type="p">273:PMOS電晶體</p>  
        <p type="p">280:低阻抗主動負載</p>  
        <p type="p">281:NMOS電晶體</p>  
        <p type="p">290:同步時脈產生器</p>  
        <p type="p">291:反相器</p>  
        <p type="p">CK1:第一時脈</p>  
        <p type="p">CK2:第二時脈</p>  
        <p type="p">CK3:第三時脈</p>  
        <p type="p">CK3B:反相時脈</p>  
        <p type="p">C_I:積分電容</p>  
        <p type="p">C_S:源極電容</p>  
        <p type="p">C_L:負載電容</p>  
        <p type="p">PE:相位誤差訊號</p>  
        <p type="p">SW1:第一開關</p>  
        <p type="p">V_202,V_204:電壓</p>  
        <p type="p">VG_281:閘極偏壓電壓</p>  
        <p type="p">V_DD:電源節點</p>  
        <p type="p">V_REF:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="846" publication-number="202620481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及其製造方法</chinese-title>  
        <english-title>OPTICAL DEVICE AND METHOD OF MANUFACTURE THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">G02B6/13</main-classification>  
        <further-classification edition="200601120250912B">G02B6/136</further-classification>  
        <further-classification edition="200601120250912B">G02B6/32</further-classification>  
        <further-classification edition="200601120250912B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光學裝置和製造方法被呈現，其中第一光學封裝被接收，第一光學封裝包括第一定位開口和插拔開口。插拔件被插入插拔開口和第一定位開口中，以接觸第一光學封裝內的邊緣耦合器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical devices and methods of manufacture are presented in a first optical package is received, the first optical package including a first positioning opening and a receptacle opening. A receptacle is inserted into the receptacle opening and the first positioning opening in order to access an edge coupler within the first optical package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學中介層</p>  
        <p type="p">201:第一主動層</p>  
        <p type="p">203:第一光學元件</p>  
        <p type="p">205:邊緣耦合器</p>  
        <p type="p">401:第二絕緣層</p>  
        <p type="p">501:第一金屬化層</p>  
        <p type="p">503:第二光學元件</p>  
        <p type="p">505:第一接合層</p>  
        <p type="p">507:第一接合墊</p>  
        <p type="p">509:第一介電材料</p>  
        <p type="p">511:第三光學元件</p>  
        <p type="p">601:第一半導體裝置</p>  
        <p type="p">603:半導體基板</p>  
        <p type="p">605:主動元件</p>  
        <p type="p">607:互連結構</p>  
        <p type="p">609:第二接合層</p>  
        <p type="p">611、909:第三接合墊</p>  
        <p type="p">613:第一間隙填充材料</p>  
        <p type="p">701:支撐基板</p>  
        <p type="p">801:第二主動層</p>  
        <p type="p">803:第四光學元件</p>  
        <p type="p">900:第一光學封裝</p>  
        <p type="p">901:元件導孔</p>  
        <p type="p">903:第三接合層</p>  
        <p type="p">911:第五光學元件</p>  
        <p type="p">913:第一外部連接件</p>  
        <p type="p">1101:插拔件</p>  
        <p type="p">1103:光傳輸柱</p>  
        <p type="p">1105:定位結構</p>  
        <p type="p">1107:連接件</p>  
        <p type="p">1111:透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="847" publication-number="202620649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓縮記憶體系統、管理壓縮資料之方法、電子裝置以及相關非暫時性電腦可讀儲存媒體</chinese-title>  
        <english-title>COMPRESSED MEMORY SYSTEM, METHOD OF MANAGING COMPRESSED DATA, ELECTRONIC DEVICE, AND RELATED NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G06F12/06</main-classification>  
        <further-classification edition="200601120251001B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴珍洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JINSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金愈珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, JIHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴性旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SEONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種壓縮記憶體系統及一種管理壓縮資料之方法。該方法包括：將來自原始資料之壓縮資料當中與一前部部分相對應的一第一槽之第一資料儲存於一記憶體之一第一區域中；將一剩餘槽之第二資料儲存於該記憶體之一第二區域中，該剩餘槽包括來自該壓縮資料的除該第一資料以外之資料；以及將與該第二資料相對應之元資料儲存於該記憶體之一第三區域中的一元資料表中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a compressed memory system and a method of managing compressed data. The method including storing, in a first area of a memory, first data of a first slot corresponding to a front part among compressed data from original data, storing, in a second area of the memory, second data of a remaining slot, the remaining slot including data from the compressed data other than the first data, and storing metadata corresponding to the second data in a metadata table in a third area of the memory.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:原始資料</p>  
        <p type="p">320:壓縮資料</p>  
        <p type="p">325:第一槽</p>  
        <p type="p">330:記憶體</p>  
        <p type="p">331:第一區域</p>  
        <p type="p">333:第二區域</p>  
        <p type="p">335:第三區域</p>  
        <p type="p">340:元資料表</p>  
        <p type="p">MD 0,MD 1,MD 2,MD 3:元資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="848" publication-number="202620075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溶出聚乙烯樹脂及以此形成的射出成型構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08F210/16</main-classification>  
        <further-classification edition="200601120260203B">B29C45/00</further-classification>  
        <further-classification edition="200601120260203B">F16L47/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東楚股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原広崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山野直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">議題：提供在將聚乙烯樹脂使用作為射出成型構件尤其接觸高純度藥品或超純水之過濾器、接頭、閥等之情形中，該樹脂的微粒成分及金屬溶出量少，長期保管後的溶出量亦少之聚乙烯樹脂及以此形成的射出成型構件。解決方式：一種聚乙烯樹脂，其為乙烯／α―烯烴共聚物，密度為945～955kg／m&lt;sup&gt;3&lt;/sup&gt;，MFR為1.0～50g／10分鐘，Mw／Mn為3.0～6.0，分子量1000以下的成分為0.30重量%以下，鋁含量相對於聚乙烯樹脂為10PPM以下，鎂含量相對於聚乙烯樹脂為10PPM以下，矽含量相對於聚乙烯樹脂為1PPM以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="849" publication-number="202621086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>序列檢測裝置以及序列檢測方法</chinese-title>  
        <english-title>SEQUENCE DETECTION DEVICE AND SEQUENCE DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H04L25/03</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種序列檢測裝置包含前饋濾波器、回授濾波器、結合電路、決策電路與序列檢測電路。該前饋濾波器處理接收訊號來產生第一等化訊號。該回授濾波器處理符號決策訊號來產生第二等化訊號。該結合電路結合該第一、第二等化訊號來產生樣本訊號。該決策電路對該樣本訊號執行硬決策來產生該符號決策訊號。該序列檢測電路對該第一等化訊號執行序列檢測，並包含區域估計電路與網格選取電路。該區域估計電路將該樣本訊號中的每一樣本分類至一區域。該網格選取電路依據該區域估計電路所輸出之區域估計結果，選取一網格方案以供分支度量計算之用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sequence detection device includes a feed-forward filter, a feedback filter, a combining circuit, a decision circuit, and a sequence detection circuit. The feed-forward filter processes a received signal to generate a first equalized signal. The feedback filter processes a symbol decision signal to generate a second equalized signal. The combining circuit combines the first and second equalized signals to generate a sample signal. The decision circuit performs hard decision upon the sample signal to generate the symbol decision signal. The sequence detection circuit performs sequence detection upon the first equalized signal, and includes a region estimation circuit and a trellis selection circuit. The region estimation circuit categorizes each sample of the sample signal into one region. The trellis selection circuit selects one trellis scheme for branch metric calculation according to region estimation results output from the region estimation circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:序列檢測裝置</p>  
        <p type="p">102:前饋濾波器</p>  
        <p type="p">104:回授濾波器</p>  
        <p type="p">106:序列檢測電路</p>  
        <p type="p">108:結合電路</p>  
        <p type="p">110:決策電路(截剪器)</p>  
        <p type="p">112:區域估計、網格選取暨分支度量計算電路</p>  
        <p type="p">114:加法-比較-選取暨路徑度量計算電路</p>  
        <p type="p">116:存活路徑暨回溯電路</p>  
        <p type="p">118:控制電路</p>  
        <p type="p">FFF[0]-FFF[m]:前饋濾波器係數</p>  
        <p type="p">FBF[0]-FBF[m],h&lt;sub&gt;1&lt;/sub&gt;:回授濾波器係數</p>  
        <p type="p">S_IN[k]:接收訊號</p>  
        <p type="p">S_FBF,S_FFF:等化訊號</p>  
        <p type="p">S_D:符號決策訊號</p>  
        <p type="p">S_S:樣本訊號</p>  
        <p type="p">S_OUT:符號序列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="850" publication-number="202621271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/01</main-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宥均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳以雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王美勻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MEI-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括形成堆疊於基板上，圖案化堆疊與基板以形成第一與第二主動區，形成隔離結構於第一與第二主動區之間，沉積隔離結構保護層於隔離結構上，形成虛置閘極堆疊以越過第一與第二主動區，使第一與第二主動區凹陷以形成第一與第二溝槽；形成第一與第二源極/汲極結構於第一與第二溝槽中， 移除虛置閘極堆疊以形成閘極溝槽，沉積閘極結構於閘極溝槽中以與隔離結構保護層交界，薄化基板與隔離結構，形成背側開口以露出第一源極/汲極結構的下表面，以及形成背側通孔於背側開口中，以與第一源極/汲極結構電性耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a stack on a substrate, patterning the stack and the substrate to form first and second active regions, forming an isolation structure between the first and second active regions, depositing an isolation structure protecting layer on the isolation structure, forming a dummy gate stack across the first and second active regions, recessing the first and second active regions to form first and second trenches, forming first and second source/drain features in the first and second trenches, removing the dummy gate stack to form a gate trench, depositing a gate structure in the gate trench and interfacing the isolation structure protecting layer, thinning the substrate and the isolation structure, forming a backside opening exposing a bottom surface of the first source/drain feature, and forming a backside via in the backside opening and in electrical coupling with the first source/drain feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A-A,B-B,C-C,D-D:剖面</p>  
        <p type="p">202:基板</p>  
        <p type="p">206:犧牲層</p>  
        <p type="p">208:通道層</p>  
        <p type="p">212:鰭狀結構</p>  
        <p type="p">212B:鰭狀基底</p>  
        <p type="p">212SD:源極/汲極區</p>  
        <p type="p">214:隔離結構</p>  
        <p type="p">215:隔離結構保護層</p>  
        <p type="p">216:虛置介電層</p>  
        <p type="p">218:虛置電極層</p>  
        <p type="p">220:虛置閘極堆疊</p>  
        <p type="p">222:閘極頂部硬遮罩層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="851" publication-number="202620898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測免疫反應之方法、系統及其電腦可讀取媒體</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR PREDICTING AN IMMUNE RESPONSE AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250602B">G16H70/40</main-classification>  
        <further-classification edition="201801120250602B">G16H50/20</further-classification>  
        <further-classification edition="200601120250602B">G01N33/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯泰名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, TAI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瀞瑢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JING-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預測免疫反應之方法，包含基因特徵擷取單元提供單細胞之轉錄體資料予深度學習模型，以建立訓練資料集；以及模組建立與優化單元根據訓練資料集建立預測免疫反應模組。一種預測免疫反應之系統，包含基因特徵擷取單元，用以提供單細胞之轉錄體資料予深度學習模型，以建立訓練資料集；以及模組建立與優化單元，用以根據訓練資料集建立預測免疫反應模組。一種電腦可讀取媒體，儲存電腦可執行程式，當電腦載入電腦可執行程式並執行後，能實現所述之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting an immune response includes: a genetic feature extraction unit providing a transcriptomic data of a single cell to a deep learning model to create a training data set; and a model building and optimization unit building an immune response prediction model based on the training data set. A system for predicting the immune response includes: a genetic feature extraction unit used to provide the transcriptomic data of the single cell to the deep learning model to create the training data set; and a model building and optimization unit used to build the immune response prediction model based on the training data set. A computer readable medium storing a computer executable code which, when being executed, causes the method to be implemented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:預測免疫反應之系統</p>  
        <p type="p">10:基因特徵擷取單元</p>  
        <p type="p">20:資料儲存單元</p>  
        <p type="p">30:模組建立與優化單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="852" publication-number="202620650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、操作記憶體裝置之方法及由壓縮記憶體裝置執行之方法</chinese-title>  
        <english-title>MEMORY DEVICE, METHOD OF OPERATING MEMORY DEVICE AND METHOD PERFORMED BY COMPRESSED MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251103B">G06F12/08</main-classification>  
        <further-classification edition="200601120251103B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金愈珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金眞成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINSEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, JIHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴智慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JIHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴珍洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JINSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙淵坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, YEONGON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，其執行回應於自一主機接收到之一讀取請求而判定該讀取請求在一快取中是否被命中，且在一記憶體處理單元中並行地執行用於判定對應於該讀取請求之資料的操作中之至少一者。該記憶體裝置在一快取未中之一情形下，將透過該記憶體處理單元自一記憶體模組獲得之資料傳回至該主機，且在一快取命中之一情形下，將在該快取中命中之資料傳回至該主機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device performs determining whether a read request received from a host is hit in a cache in response to the read request, and at least one of operations for determining data corresponding to the read request in parallel in a memory processing unit. The memory device returns data obtained from a memory module through the memory processing unit to the host in a case of a cache miss, and returns data hit in the cache to the host in a case of a cache hit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">150:主機</p>  
        <p type="p">200:記憶體裝置</p>  
        <p type="p">210:記憶體處理單元</p>  
        <p type="p">230:記憶體模組</p>  
        <p type="p">250:預請求管理器</p>  
        <p type="p">270:快取</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="853" publication-number="202620371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查模組及檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250527B">G01B7/34</main-classification>  
        <further-classification edition="200601120250527B">G01B17/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市川敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIKAWA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種檢查模組，其能夠高感度地對被檢查物的表面的凹凸形狀進行檢測。本揭示的檢查模組10包括：探針構件11，藉由被檢查物OB的表面S的凹凸形狀C而變形並對凹凸形狀C進行檢測；以及感測器部12，維持探針構件11的變形功能並將探針構件11定位，將基於由凹凸形狀C引起的探針構件11的變形而檢測到的凹凸形狀C的凹凸資訊轉換成電訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢查模組</p>  
        <p type="p">11:探針構件</p>  
        <p type="p">12:感測器部</p>  
        <p type="p">C:凹凸形狀</p>  
        <p type="p">OB:被檢查物</p>  
        <p type="p">S:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="854" publication-number="202619992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學強化玻璃及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C03C3/083</main-classification>  
        <further-classification edition="200601120260203B">C03C3/085</further-classification>  
        <further-classification edition="200601120260203B">C03C3/097</further-classification>  
        <further-classification edition="200601120260203B">C03C21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵田将平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種化學強化玻璃及其製造方法，上述化學強化玻璃之4PB強度及尖銳物衝擊強度優異。本發明係一種化學強化玻璃及化學強化玻璃之製造方法，上述化學強化玻璃之表面壓縮應力CS&lt;sub&gt;0&lt;/sub&gt;為1000 MPa以上1600 MPa以下，壓縮應力層深度DOL未達10 μm，板厚中心處之拉伸應力CT&lt;sub&gt;t/2&lt;/sub&gt;為14.0 MPa以下，上述化學強化玻璃之製造方法包括下述[1]，且上述化學強化玻璃之表面壓縮應力CS&lt;sub&gt;0&lt;/sub&gt;為1000 MPa以上1600 MPa以下，壓縮應力層深度DOL未達10 μm，板厚中心處之拉伸應力CT&lt;sub&gt;t/2&lt;/sub&gt;為14.0 MPa以下。 &lt;br/&gt;[1]使玻璃與包含硝酸鉀之無機鹽組合物接觸而進行離子交換</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="855" publication-number="202621281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的形成方法</chinese-title>  
        <english-title>METHODS OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/62</main-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊愷潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一方法包括形成源極/汲極區、在源極/汲極區上方形成接觸蝕刻停止層、在接觸蝕刻停止層上方形成層間介電層、在層間介電層和接觸蝕刻停止層中形成第一接觸塞、以及執行蝕刻製程以在層間介電層和接觸蝕刻停止層中形成溝槽。源極/汲極區和第一接觸塞暴露於溝槽。該方法還包括執行矽化物形成製程以在源極/汲極區的表面上形成矽化物區，並且蝕刻沉積在介電區上和溝槽中的金屬層。當矽化物形成過程開始時，介電區就會暴露出來。在溝槽中形成第二接觸塞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a source/drain region, forming a contact etch stop layer over the source/drain region, forming an inter-layer dielectric over the contact etch stop layer, forming a first contact plug in the inter-layer dielectric and the contact etch stop layer, and performing an etching process to form a trench in the inter-layer dielectric and the contact etch stop layer. The source/drain region and the first contact plug are exposed to the trench. The method further includes performing a silicide formation process to form a silicide region on a surface of the source/drain region, and etching a metal layer that is deposited on dielectric regions and in the trench. The dielectric regions are exposed at a time the silicide formation process is started. A second contact plug is formed in the trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:晶圓</p>  
        <p type="p">32:隔離區/STI區</p>  
        <p type="p">45:鰭片間隔物</p>  
        <p type="p">62L:源極/汲極區(半導體區)</p>  
        <p type="p">62U:源極/汲極區(半導體區)</p>  
        <p type="p">66:第一CESL/第一接觸蝕刻停止層</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:第二CESL</p>  
        <p type="p">72:第二ILD</p>  
        <p type="p">114:介電襯墊</p>  
        <p type="p">116:接觸塞</p>  
        <p type="p">118:蝕刻停止層</p>  
        <p type="p">120:介電層</p>  
        <p type="p">124:介電襯墊</p>  
        <p type="p">130:矽化物區/矽化物層</p>  
        <p type="p">138:金屬氮化矽層</p>  
        <p type="p">150:接觸塞</p>  
        <p type="p">158:矽化物區/矽化物層</p>  
        <p type="p">160:接觸塞</p>  
        <p type="p">162:背面重分佈線(導電特徵)</p>  
        <p type="p">164:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="856" publication-number="202621468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄形高品質氧化物層</chinese-title>  
        <english-title>THIN AND HIGH-QUALITY OXIDE LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/90</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴栽永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔永俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YOUNG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HO CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴智善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JISEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱　恒超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HANSEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史文博格　玖漢尼斯Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWENBERG, JOHANES F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德切柯　寶拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE CECCO, PAOLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑斯　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOWES, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅源輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, ANDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博蘭德　約翰蒂莫西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOLAND, JOHN TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　雷尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORGE, RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處描述的方法和裝置提供了具有可控界面粗糙度的薄型且高品質的氧化物層。在某些實施例中，上述氧化物層是透過以下方式形成的：使用自由基氧化製程以較慢的氧化速率和相對低至中等的溫度，然後在相對高的溫度下進行氮（N&lt;sub&gt;2&lt;/sub&gt;）退火，以增加氧化物層的密度，同時通過誘發氧化物的黏性流動來減輕（例如，放鬆）界面應力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The methods and devices described herein provide for thin and high-quality oxide layers with controlled interfacial roughness. In some embodiments, the aforementioned oxide layers are formed using radical oxidation processes with slow oxidation rates and relatively low-to-moderate temperatures, followed by nitrogen (N&lt;sub&gt;2&lt;/sub&gt;) annealing at relatively high temperatures to densify the oxide layer(s) while also relieving (e.g., relaxing) interfacial stresses by inducing the viscous flow of the oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:區塊</p>  
        <p type="p">320:區塊</p>  
        <p type="p">330:區塊</p>  
        <p type="p">340:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="857" publication-number="202619928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式座桿組件</chinese-title>  
        <english-title>ADJUSTABLE SEATPOST ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B62J1/02</main-classification>  
        <further-classification edition="200601120251201B">B62J1/08</further-classification>  
        <further-classification edition="200601120251201B">B62J1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施朗格　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLANGER, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施朗格　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLANGER, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種座桿組件，其具有：一第一部分，其經構形為包括一座墊；一第二部分，其可相對於第一部分在一縮回方向上移位至一第一位置，且在一軸向伸出方向上移位至相對於第一位置縮回之一第二位置；以及一主動驅動力，其用於驅動該移位。移位範圍介於一完全伸出位置與一完全縮回位置之間，該完全伸出位置與該完全縮回位置之間具有一中間衝程位置。較佳地包括一外部致動器，其功能是將驅動力轉換成對移位之線性致動。較佳地，其中該驅動力由自外部施加至該座桿組件之手動操縱提供。較佳地包括一外部控制器，其中對該控制器之增量式操縱對應於增量式軸向移位。較佳地包括一閂鎖機構以選擇性地限制該軸向移位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A seatpost assembly having: a first portion configured to include a seat; a second portion displaceable relative to the first portion in a retracting direction to a first position and an axially extending direction to a second position retracted relative to the first position; and an active motive force to drive the displacement. The range of displacement is between a fully extended position and a fully retracted position, with a mid-stroke position between. Preferably including an external actuator that is functional to convert the motive force into linear actuation of the displacement. Preferably where the motive force is provided from manual manipulation applied externally to the seatpost assembly. Preferably including an external controller, where incremental manipulation of the controller corresponds to incremental axial displacement. Preferably including a latching mechanism to selectively restrict the axial displacement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">48:座桿組件</p>  
        <p type="p">50:構件(內部構件)</p>  
        <p type="p">52:鍵</p>  
        <p type="p">54:孔</p>  
        <p type="p">55a:第一端</p>  
        <p type="p">60:蓋</p>  
        <p type="p">61:外部螺紋</p>  
        <p type="p">62:孔</p>  
        <p type="p">63:導向軸環</p>  
        <p type="p">64:螺紋(外部螺紋)</p>  
        <p type="p">70:構件(外部構件)</p>  
        <p type="p">72:開口</p>  
        <p type="p">78:蓋</p>  
        <p type="p">80:控制桿組件</p>  
        <p type="p">81:螺紋(外部螺紋)</p>  
        <p type="p">82:桿(控制桿、線性桿)</p>  
        <p type="p">83:孔</p>  
        <p type="p">84:護套</p>  
        <p type="p">85:沉頭孔</p>  
        <p type="p">86a:連接器</p>  
        <p type="p">87a:端部部分</p>  
        <p type="p">90:凸輪組件</p>  
        <p type="p">92:凸輪塊</p>  
        <p type="p">93:阻擋表面</p>  
        <p type="p">94a:凹部</p>  
        <p type="p">94b:凹部</p>  
        <p type="p">96:通道</p>  
        <p type="p">97a:彈簧</p>  
        <p type="p">97b:彈簧</p>  
        <p type="p">100:球</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="858" publication-number="202620777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於理解半導體工件的多尺度自動編碼器</chinese-title>  
        <english-title>MULTI-SCALE AUTOENCODERS FOR SEMICONDUCTOR WORKPIECE UNDERSTANDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260223B">G06T3/40</main-classification>  
        <further-classification edition="201701120260223B">G06T7/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商沃孚半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLFSPEED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康納德　馬修　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONRAD, MATTHEW DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬　布朗特　愛德華　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN BRUNT, EDWARD ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種範例性方法包括獲得半導體工件之工件影像。該範例性方法包括將該工件影像作為輸入提供至機器學習編碼模型。該範例性方法包括自該機器學習編碼模型獲得輸出，該輸出包括與該半導體工件相對應之編碼。該範例性方法包括至少部分地基於該編碼而判定該半導體工件之一或多個特性或至少部分地基於該編碼而調整半導體製造過程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example method includes obtaining a workpiece image of a semiconductor workpiece. The example method includes providing the workpiece image as input to a machine-learned encoding model. The example method includes obtaining an output from the machine-learned encoding model, the output includes an encoding corresponding to the semiconductor workpiece. The example method includes determining one or more characteristics of the semiconductor workpiece based at least in part on the encoding or modifying a semiconductor manufacturing process based at least in part on the encoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工件影像</p>  
        <p type="p">110:工件影像部分</p>  
        <p type="p">120:第一平滑影像</p>  
        <p type="p">122:較低解析度特徵</p>  
        <p type="p">130:第一殘餘影像</p>  
        <p type="p">132:較高解析度特徵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="859" publication-number="202621357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構與其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/40</main-classification>  
        <further-classification edition="202601120260223B">H10P95/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/17</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊愷潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括提供一種結構。該結構包括底部通道層之堆疊、設置在底部通道層之堆疊上方的頂部通道層之堆疊、由底部通道層之堆疊與底部通道層之堆疊夾持的隔離特徵、及包覆於底部通道層中之各者周圍的第一功函數金屬(WFM)層。該方法進一步包括形成包覆於頂部通道層中之各者周圍的第二WFM層，藉由對該結構執行氣體處理在第二WFM層上形成鈍化層，及在鈍化層上方形成金屬填充層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes providing a structure. The structure includes a stack of bottom channel layers, a stack of top channel layers disposed over the stack of bottom channel layers, an isolation feature sandwiched by the stack of bottom channel layers and the stack of bottom channel layers, and a first work function metal (WFM) layer wrapping around each of the bottom channel layers. The method further includes forming a second WFM layer wrapping around each of the top channel layers, forming a passivation layer on the second WFM layer by performing a gas treatment to the structure, and forming a metal fill layer over the passivation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102~110:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="860" publication-number="202620850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及操作記憶體電路的方法</chinese-title>  
        <english-title>MEMORY DEVICE AND METHOD FOR OPERATING MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C7/06</main-classification>  
        <further-classification edition="200601120251001B">G11C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彤誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林谷峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路包括：一第一記憶體單元，其用以儲存一第一資料位元；一第二記憶體單元，其用以儲存一第二資料位元；一感測放大器，其分別經由一資料位元線及一參考位元線耦接至該第一記憶體單元及該第二記憶體單元；一第一開關；及一第二開關。該第一開關選擇地耦接於該資料位元線與該感測放大器的一第一輸入節點之間，且該第二開關選擇地耦接於該參考位元線與該感測放大器的一第二輸入節點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a first memory cell configured to store a first data bit; a second memory configured to store a second data bit; a sense amplifier coupled to the first memory cell and the second memory cell through a data bit line and a reference bit line, respectively; a first switch; and a second switch. The first switch is selectively coupled between the data bit line and a first input node of the sense amplifier, and the second switch is selectively coupled between the reference bit line and a second input node of the sense amplifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:感測放大器</p>  
        <p type="p">320:資料單元</p>  
        <p type="p">322:參考單元</p>  
        <p type="p">330:資料位元線DBL</p>  
        <p type="p">332:參考位元線RBL</p>  
        <p type="p">340:第一開關</p>  
        <p type="p">342:第二開關</p>  
        <p type="p">EN:第二啟用信號</p>  
        <p type="p">ENB:第一啟用信號</p>  
        <p type="p">M1~M11:電晶體</p>  
        <p type="p">PCB:預充電信號</p>  
        <p type="p">Q:信號</p>  
        <p type="p">QB:信號</p>  
        <p type="p">QBi:第二輸入節點</p>  
        <p type="p">Qi:第一輸入節點</p>  
        <p type="p">SWEN:共同開關啟用信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="861" publication-number="202621295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極結構及其形成方法</chinese-title>  
        <english-title>GATE STRUCTURES AND METHODS OF FORMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D64/01</main-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202501120260223B">H10D64/60</further-classification>  
        <further-classification edition="202601120260223B">H10P14/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹舜翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHAN, SHUN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋學昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HSUEH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李啟弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHII-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：形成複數個奈米結構，該些奈米結構包含與第二奈米結構交替堆疊的第一奈米結構；及自該些奈米結構移除該些第一奈米結構以定義該些第二奈米結構之間的凹槽。該方法進一步包括以下步驟：在移除該些第一奈米結構之後，對該些第二奈米結構執行表面修復製程；及在該些第二奈米結構周圍的該些凹槽中形成閘極結構。該表面修復製程增加該些凹槽中的該些第二奈米結構的表面曲率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a plurality of nanostructures, the plurality of nanostructures comprising first nanostructures that are alternatingly stacked with second nanostructures and removing the first nanostructures from the plurality of nanostructures to define recesses between the second nanostructures. The method further includes after removing the first nanostructures, performing a surface repair process on the second nanostructures and forming a gate structure in the recesses around the second nanostructures. The surface repair process increases a curvature of surfaces of the second nanostructures in the recesses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基板</p>  
        <p type="p">50N:n型區域</p>  
        <p type="p">50P:p型區域</p>  
        <p type="p">54A:第二奈米結構</p>  
        <p type="p">54B:第二奈米結構</p>  
        <p type="p">54C:第二奈米結構</p>  
        <p type="p">66:鰭片</p>  
        <p type="p">90:第一內間隔物</p>  
        <p type="p">92:磊晶源極/汲極區域</p>  
        <p type="p">94:接觸蝕刻終止層</p>  
        <p type="p">96:第一層間介電層</p>  
        <p type="p">100:閘極介電層</p>  
        <p type="p">102:閘極電極</p>  
        <p type="p">104:閘極遮罩</p>  
        <p type="p">106:第二層間介電層</p>  
        <p type="p">110:矽化物區域</p>  
        <p type="p">112:觸點</p>  
        <p type="p">114:觸點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="862" publication-number="202619786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改善化學加工廠的流中之酸性氣體及羰基的移除</chinese-title>  
        <english-title>IMPROVING ACID GAS AND CARBONYL REMOVAL IN A STREAM OF A CHEMICAL PROCESSING PLANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">B01D53/74</main-classification>  
        <further-classification edition="200601120260205B">C10G29/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商藝康美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECOLAB USA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑班達姆　薩第什　庫瑪爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMBANDAM, SATHEESH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄克森　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIXON, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普雷斯洛　斯圖瓦特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRESNALL, STEWART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅洛　傑西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELLO, JESSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納吉　凱斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGY, KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於處理工業流之方法、化合物、及組成物。處理流之方法可包括將清除劑添加到流中並將胺添加到流中。流可包括酸性氣體及/或含羰基化合物。清除劑可包括例如硼氫化鈉、硫酸羥胺、乙醛肟、氰基硼氫化鈉、或其任何組合。胺可包括例如乙二胺、乙基乙醇胺、二乙基單乙醇胺、或其任何組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods, compounds, and compositions for treating industrial streams. A method of treating a stream may include adding a scavenger to the stream and adding an amine to the stream. The stream may include an acid gas and/or a carbonyl-containing compound. The scavenger may include, for example, sodium borohydride, hydroxylamine sulfate, acetaldehyde oxime, sodium cyanoborohydride, or any combination thereof. The amine may include, for example, ethylene diamine, ethyl ethanolamine, diethyl monoethanolamine, or any combination thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="863" publication-number="202621306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/83</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉德夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, TEFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體裝置結構及其形成方法。方法包括以下步驟：形成第一及第二鰭形結構，第一鰭形結構包括多個第一半導體層，且第二鰭形結構包括多個第二半導體層。方法進一步包括以下步驟：在多個第一及第二半導體層的每一半導體層的一部分周圍沉積閘極介電層；在閘極介電層上沉積犧牲層；移除犧牲層的第一部分，第一部分設置在多個第一半導體層周圍的閘極介電層的第一部分上；在閘極介電層的第一部分上選擇性地沉積第一功函數層；及移除犧牲層的第二部分，第二部分設置在多個第二半導體層周圍的閘極介電層的第二部分上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The method includes forming first and second fin structures, the first fin structure includes a first plurality of semiconductor layers, and the second fin structure includes a second plurality of semiconductor layers. The method further includes depositing a gate dielectric layer around a portion of each semiconductor layer of the first and second pluralities of semiconductor layers, depositing a sacrificial layer on the gate dielectric layer, removing a first portion of the sacrificial layer disposed on a first portion of the gate dielectric layer around the first plurality of semiconductor layers, selectively depositing a first work function layer on the portion of the gate dielectric layer, and removing a second portion of the sacrificial layer disposed on a second portion of the gate dielectric layer around the second plurality of semiconductor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基板</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">138:閘極間隔物</p>  
        <p type="p">144:介電間隔物</p>  
        <p type="p">146:源極/汲極區域/S/D區域</p>  
        <p type="p">162:接觸蝕刻終止層/CESL</p>  
        <p type="p">164:層間介電層/ILD層</p>  
        <p type="p">170:閘極介電層</p>  
        <p type="p">172:閘極電極層</p>  
        <p type="p">174:閘極結構</p>  
        <p type="p">X、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="864" publication-number="202619982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118179</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有氟化物離子及陽離子的水的處理方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260209B">C02F1/469</main-classification>  
        <further-classification edition="200601120260209B">B01D61/44</further-classification>  
        <further-classification edition="200601120260209B">B01D61/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川勝孝博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKATSU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中馬高明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUUMAN, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林英夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含有氟化物離子及陽離子的水的處理方法及裝置，其中，將含有氟化物離子及陽離子、例如銨離子的水通入電氣再生式離子交換裝置的被處理水室而分離出氟化物離子以及陽離子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:陽極/正極</p>  
        <p type="p">22:陰極/負極</p>  
        <p type="p">23、25:陽離子交換膜</p>  
        <p type="p">24、26:陰離子交換膜</p>  
        <p type="p">31:室/陽極室</p>  
        <p type="p">32:室/酸性水取出室</p>  
        <p type="p">33:室/被處理水室/脫鹽室</p>  
        <p type="p">34:室/鹼性水取出室</p>  
        <p type="p">35:室/陰極室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="865" publication-number="202621464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>摻雜的碳化鎢低K蝕刻硬遮罩</chinese-title>  
        <english-title>DOPED TUNGSTEN CARBIDE LOW-K ETCH HARD MASK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P76/40</main-classification>  
        <further-classification edition="200601120260223B">C23C16/04</further-classification>  
        <further-classification edition="200601120260223B">C23C16/06</further-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾汀　艾古特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYDIN, AYKUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘廣顏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, GUANGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓　新海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, XINHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納基拉曼　卡希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANAKIRAMAN, KARTHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高定民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文的實施例大體而言係關於用於在半導體記憶體元件的膜堆疊上製造和沉積硬遮罩的系統和方法。基板處理系統包括膜形成腔室、電漿蝕刻腔室、被配置為在該膜形成腔室與該電漿蝕刻腔室之間運輸基板的轉移腔室，以及控制器。該控制器被配置為使該基板處理系統使用該膜形成腔室在設置於基板上的膜堆疊上沉積具有金屬材料、含碳材料和摻雜物材料的摻雜硬遮罩；使用該電漿蝕刻腔室對該摻雜硬遮罩和該膜堆疊進行蝕刻，以在該膜堆疊中產生溝槽特徵；以及使用該膜形成腔室在該等溝槽特徵內及該摻雜硬遮罩上沉積散裝(bulk)金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments herein are generally directed to systems and methods for producing and depositing a hard mask on a film stack of a semiconductor memory device. A substrate processing system includes a film formation chamber, a plasma etching chamber, a transfer chamber configured to transport a substrate between the film formation chamber and the plasma etching chamber, and a controller. The controller is configured to cause the substrate processing system to deposit, using the film formation chamber, a doped hard mask having a metal material, a carbon-containing material, and a dopant material on a film stack disposed on a substrate, etch, using the plasma etching chamber, the doped hard mask and the film stack to produce trench features in the film stack, and deposit, using the film formation chamber, a bulk metal in the trench features and on the doped hard mask.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:記憶體元件</p>  
        <p type="p">302:膜堆疊</p>  
        <p type="p">304:介電層</p>  
        <p type="p">306:鈍化層</p>  
        <p type="p">308:黏著層</p>  
        <p type="p">310:摻雜硬遮罩</p>  
        <p type="p">312:金屬材料</p>  
        <p type="p">314:含碳材料</p>  
        <p type="p">316:摻雜物材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="866" publication-number="202621387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及資訊處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD AND INFORMATION PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀越章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKOSHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塙洋祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANAWA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木悠太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理裝置中，藉由向形成有圖案之基板之主面供給包含昇華性物質及溶劑之處理液，而形成處理液之液膜。藉由使溶劑自所形成之液膜蒸發，而於主面形成包含昇華性物質之固化膜。藉由使固化膜昇華，而自主面去除固化膜。此處，於資訊處理裝置中，於使溶劑蒸發期間，基於形成於主面之液膜之吸光度，藉由濃度獲取部來獲取昇華性物質之濃度之經時變化。基於所獲取之濃度之經時變化，藉由預測部來預測於使固化膜昇華之情形時之圖案之塌陷率。於預測之塌陷率為規定之閾值以上之情形時，於使固化膜昇華前藉由輸出部來輸出預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:功能部</p>  
        <p type="p">11:光強度獲取部</p>  
        <p type="p">12:透過率獲取部</p>  
        <p type="p">13:吸光度獲取部</p>  
        <p type="p">14:厚度獲取部</p>  
        <p type="p">15:濃度獲取部</p>  
        <p type="p">16:預測部</p>  
        <p type="p">17:輸出部</p>  
        <p type="p">100:資訊處理裝置</p>  
        <p type="p">140:記憶部</p>  
        <p type="p">160:顯示部</p>  
        <p type="p">200:處理單元</p>  
        <p type="p">300:基板處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="867" publication-number="202620945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解質二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">H01M4/62</main-classification>  
        <further-classification edition="201001120260205B">H01M4/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木嚴太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, GENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤重隼一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJISHIGE, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田下敬光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASHITA, TAKAMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示之非水電解質二次電池包含正極、負極及非水電解質。負極包含負極集電體與配置於負極集電體上之負極合劑層。負極合劑層包含負極活性物質與選自於由羧甲基纖維素及羧甲基纖維素鹽所構成群組中之至少1種纖維素衍生物。負極合劑層中之選自於由多價陽離子及Ag離子所構成群組中之至少1種陽離子之含有率以質量基準計為50ppm以上且300ppm以下。負極合劑層之每單位面積之質量為100g/m&lt;sup&gt;2&lt;/sup&gt;以上且200g/m&lt;sup&gt;2&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="868" publication-number="202620093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻下層膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08G59/18</main-classification>  
        <further-classification edition="200601120260223B">G03F7/11</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="202601120260223B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板岡康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAOKA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方裕斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村護</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光阻下層膜形成用組成物，係含有聚合物（A）及溶劑（B）； &lt;br/&gt;前述聚合物（A）係含有含雜環骨架之結構單元，且該雜環骨架的構成原子中包含硫原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="869" publication-number="202620871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及其操作方法</chinese-title>  
        <english-title>MEMORY CIRCUITS AND METHODS FOR OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C13/00</main-classification>  
        <further-classification edition="202301120251001B">H10B63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鉦峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHENG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒宗成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, YU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山雅義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬行厚雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGYO, ATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路包括：第一記憶體單元及第二記憶體單元，分別通過第一位元線及第二位元線耦接至第一讀出放大器；第三記憶體單元及第四記憶體單元，分別通過第三位元線及第四位元線耦接至第二讀出放大器；參考電路，用以提供分別對應於第一記憶體單元至第四記憶體單元中的任一者的不同操作模式的複數個參考電流位準。參考電路交替地耦接至第一位元線及第三位元線或耦接至第二位元線及第四位元線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a first memory cell and a second memory cell coupled to a first sense amplifier through a first bit line and a second bit line, respectively; a third memory cell and a fourth memory cell coupled to a second sense amplifier through a third bit line and a fourth bit line, respectively; a reference circuit configured to provide a plurality of reference current levels corresponding to different operation modes of any of the first to fourth memory cells, respectively. The reference circuit is alternately coupled to the first bit line and the third bit line or coupled to second bit line and the fourth bit line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1300:方法</p>  
        <p type="p">1310、1320、1330、1340、1350:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="870" publication-number="202620127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、硬化物及其製造方法、以及積層體</chinese-title>  
        <english-title>CURABLE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING THE SAME, AND LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08L77/06</main-classification>  
        <further-classification edition="200601120260223B">C08G69/26</further-classification>  
        <further-classification edition="200601120260223B">C08K3/36</further-classification>  
        <further-classification edition="202601120260223B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇佐勇貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中基貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, MOTOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可獲得在高溫高濕下經過長時間後的接著力及25℃下的接著性優異的硬化物的硬化性組成物、硬化物及其製造方法、以及積層體。本揭示的硬化性組成物包含特定量的下述（I）及（II）中的至少一者的四羧酸改質物（A）、特定量的二氧化矽填料（B）及導熱性填料（C）中的至少一者、硬化劑（D）、以及特定量的樹脂（E）。&lt;br/&gt;（I）：脂肪族四羧酸酐（I-a）與末端具有一個羥基的化合物（I-b1）的反應產物。&lt;br/&gt;（II）：芳香族四羧酸酐（II-a）與分子結構中具有醚鍵的含羥基的化合物（II-b）的反應產物，（II-b）為末端具有一個羥基的化合物（II-b1）及/或末端具有兩個羥基的化合物（II-b2）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="871" publication-number="202620081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118396</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共聚物、組成物及成形體</chinese-title>  
        <english-title>COPOLYMER, COMPOSITION, AND MOLDED ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08F214/26</main-classification>  
        <further-classification edition="200601120260209B">C08L27/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴崎浩輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBASAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田口大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGUCHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係涉及一種共聚物、包含共聚物之組成物、及組成物之成形體，本發明之共聚物包含以四氟乙烯為主體之單元A與以式(1)CF&lt;sub&gt;2&lt;/sub&gt;=CF-CF&lt;sub&gt;2&lt;/sub&gt;-O-Rf&lt;sup&gt;1&lt;/sup&gt;所示化合物為主體之單元B；相對於共聚物中所含之全部單元，單元B之含有率大於2.0莫耳%且在6.0莫耳%以下；相對於共聚物中所含之全部單元，單元A與單元B的合計含有率為90.0莫耳%以上；且，共聚物以每10&lt;sup&gt;6&lt;/sup&gt;個主鏈碳數計之官能基數的合計小於150個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="872" publication-number="202621109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>座標系統的同步系統和同步方法</chinese-title>  
        <english-title>SYNCHRONIZATION SYSTEM AND SYNCHRONIZATION METHOD OF COORDINATE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250613B">H04N13/332</main-classification>  
        <further-classification edition="201801120250613B">H04N13/398</further-classification>  
        <further-classification edition="201801120250613B">H04N13/254</further-classification>  
        <further-classification edition="201701120250613B">G06T7/70</further-classification>  
        <further-classification edition="200601120250613B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許友惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝政翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周蘇剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SU KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種座標系統的同步系統和同步方法。同步方法包含：將第一頭戴顯示裝置通訊連接至第一行動裝置，其中第一行動裝置包含第一光源，其中第一行動裝置與第一頭戴顯示裝置對應於第一座標系統；由第一光源基於第一模式輸出第一光；由第二頭戴顯示裝置根據第一光辨識第一行動裝置，其中第二頭戴顯示裝置對應於第二座標系統；以及由第二頭戴顯示裝置將第一行動裝置作為參考點以同步第二座標系統與第一座標系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A synchronization system and a synchronization method of coordinate system are provided. The synchronization method includes: communicatively connecting a first head-mounted display to a first mobile device, wherein the first mobile device includes a first light source, wherein the first mobile device and the first head-mounted display correspond to a first coordinate system; outputting a first light based on a first mode by the first light source; identifying the first mobile device according to the first light by a second head-mounted display, wherein the second head-mounted display corresponds to a second coordinate system; and using the first mobile device as a reference point to synchronize the second coordinate system with the first coordinate system by the second head-mounted display.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301,S302,S303,S304:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="873" publication-number="202620060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光擴散薄膜用聚合性單體組成物、光擴散薄膜及其製造方法</chinese-title>  
        <english-title>POLYMERIZABLE MONOMER COMPOSITION FOR LIGHT DIFFUSING FILMS, LIGHT DIFFUSING FILM AND METHOD FOR PRODUCING LIGHT DIFFUSING FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F2/44</main-classification>  
        <further-classification edition="200601120260223B">C08F20/00</further-classification>  
        <further-classification edition="200601120260223B">C08F265/04</further-classification>  
        <further-classification edition="200601120260223B">C08L33/04</further-classification>  
        <further-classification edition="200601120260223B">C08L51/06</further-classification>  
        <further-classification edition="200601120260223B">C09D4/00</further-classification>  
        <further-classification edition="201801120260223B">C09D7/65</further-classification>  
        <further-classification edition="200601120260223B">G02B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堅田有信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATADA, ARINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光擴散薄膜用聚合性單體組成物，其係可製作在良好維持光擴散性及光穿透性之同時耐破損性上升之光擴散薄膜的聚合性單體組成物，係含有微粒子與黏結劑用聚合性單體的光擴散薄膜用聚合性單體組成物，其中遵循JIS K 0070量測到之前述微粒子的碘價為35 g／100g以上且100 g／100g以下，前述黏結劑用聚合性單體包含於1分子中具有多個反應性不飽和鍵的交聯性單體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a polymerizable monomer composition configured to produce a light diffusing film which has improved crack resistance while retaining excellent light diffusing properties and light transparency. A polymerizable monomer composition for light diffusing films, comprising fine particles and a polymerizable monomer for binders, wherein the fine particles have an iodine value of 35 g/100g or more and 100 g/100g or less, which is measured according to JIS K 0070, and wherein the polymerizable monomer for binders comprises a crosslinkable monomer which contains reactive unsaturated bonds per molecule.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="874" publication-number="202620549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由光照射抑制電漿誘發之表面劣化</chinese-title>  
        <english-title>SUPPRESSION OF PLASMA-INDUCED SURFACE DEGRADATION BY IRRADIATION OF LIGHT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　戴　克豪夫　馬卡斯　安德納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DE KERKHOF, MARCUS ADRIANUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種曝光設備，其包含： &lt;br/&gt;一殼體，其界定一環境，其中該殼體經組態以自一主輻射源接收一主輻射且含有一電漿，其中該殼體包含一面向電漿表面； &lt;br/&gt;一額外輻射源，其經組態以產生具有300 nm或更大之波長之一額外輻射，且經組態以在該電漿存在時照射該面向電漿表面之至少一部分以產生電子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An exposure apparatus comprising: &lt;br/&gt;an enclosure defining an environment, wherein the enclosure is configured to receive a main radiation from a main radiation source and to contain a plasma, wherein the enclosure comprises a plasma-facing surface; &lt;br/&gt;an additional radiation source configured to generate an additional radiation with wavelength of 300 nm or more and configured to irradiate at least a portion of said plasma-facing surface to generate electrons when the plasma is present.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:輻射源</p>  
        <p type="p">41:高能輻射</p>  
        <p type="p">42:殘餘氣體</p>  
        <p type="p">43:面向電漿表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="875" publication-number="202620160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可電化學脫黏之黏著劑膜</chinese-title>  
        <english-title>ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C09J175/04</main-classification>  
        <further-classification edition="200601120260209B">C08G18/06</further-classification>  
        <further-classification edition="201801120260209B">C09J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特里克　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRICKER, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許納加斯　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUEHNERGARTH, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔夫　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAPF, STEFANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭兵兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, BINGBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈冬梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, DONGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種藉由將水性組合物(a)乾燥而獲得之可固化黏著劑膜(F&lt;sup&gt;a&lt;/sup&gt;)，該水性組合物(a)包含： &lt;br/&gt;水； &lt;br/&gt;a1)至少一種具有至少一個異氰酸酯反應性、活性氫基團之第一聚胺基甲酸酯聚合物，其中該第一聚胺基甲酸酯聚合物係藉由至少一種多異氰酸酯化合物與至少一種多元醇(POHA)之反應獲得，該多元醇具有至少500 g/mol.之數量平均分子量(Mn)且進一步具有選自式(I)、式(II)、式(III)之結構單元或其組合之一或多個結構單元： &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;1&lt;/sup&gt;-Y                                      (I) &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;2&lt;/sup&gt;-CH&lt;sub&gt;2&lt;/sub&gt;-CH(OH)-                    (II) &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;1&lt;/sup&gt;-Y&lt;sup&gt;1&lt;/sup&gt;-X&lt;sup&gt;3&lt;/sup&gt;-CH&lt;sub&gt;2&lt;/sub&gt;-CH(OH)-          (III) &lt;br/&gt;a2)至少一種不同於該第一聚胺基甲酸酯聚合物之第二聚胺基甲酸酯聚合物，該第二聚胺基甲酸酯聚合物具有至少一個異氰酸酯反應性、活性氫基團； &lt;br/&gt;a3)至少一種表面去活化固體多異氰酸酯化合物； &lt;br/&gt;a4)不可聚合電解質；及 &lt;br/&gt;視情況，a5)包括非導電填料、導電填料或其混合物之流變控制劑， &lt;br/&gt;其中該組合物(a)中之-N=C=O基團與活性氫原子之莫耳比率為0.1:1至10:1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curable adhesive film (F&lt;sup&gt;a&lt;/sup&gt;) obtained by the drying of a water-borne composition (a) comprising: &lt;br/&gt;water; &lt;br/&gt;a1) at least one first polyurethane polymer having at least one isocyanate reactive, active hydrogen group, wherein said first polyurethane polymer is obtained by the reaction of at least one polyisocyanate compound with at least one polyol (POHA) which has a number average molecular weight (Mn) of at least 500 g/mol. and which further has one or more structural units chosen from structural units of Formula (I), Formula (II), Formula (III) or combinations thereof: &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;1&lt;/sup&gt;-Y (I) &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;2&lt;/sup&gt;-CH&lt;sub&gt;2&lt;/sub&gt;-CH(OH)- (II) &lt;br/&gt;-CH(OH)-CH&lt;sub&gt;2&lt;/sub&gt;-X&lt;sup&gt;1&lt;/sup&gt;-Y&lt;sup&gt;1&lt;/sup&gt;-X&lt;sup&gt;3&lt;/sup&gt;-CH&lt;sub&gt;2&lt;/sub&gt;-CH(OH)- (III) &lt;br/&gt;a2) at least one second polyurethane polymer which is distinct from said first polyurethane polymer, said second polyurethane polymer having at least one isocyanate reactive, active hydrogen group; &lt;br/&gt;a3) at least one surface-deactivated solid polyisocyanate compound; &lt;br/&gt;a4) non-polymerizable electrolyte; and, &lt;br/&gt;optionally a5) rheology control agent comprising electrically non-conductive fillers, electrically conductive fillers or mixtures thereof, &lt;br/&gt;wherein the molar ratio of -N=C=O groups to active hydrogen atoms in the composition (a) is from 0.1:1 to 10:1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="876" publication-number="202620068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有聚合性多重鍵之聚合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08F8/00</main-classification>  
        <further-classification edition="200601120260209B">C08F20/26</further-classification>  
        <further-classification edition="200601120260209B">C08G59/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田悠太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種具有聚合性多重鍵之聚合物之製造方法，其係包含： &lt;br/&gt;使具有第1官能基之聚合物（A）與具有第2官能基及聚合性多重鍵之化合物（B），在反應容器內且於N-氧基系聚合抑制劑及有機溶劑的存在下，藉由使前述第1官能基與前述第2官能基反應而進行反應，從而製造具有聚合性多重鍵之聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="877" publication-number="202621394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監測超臨界CO₂乾燥之系統及方法</chinese-title>  
        <english-title>SYSTEM AND MEHTOD FOR MONITORING SUPERCRITICAL CO₂ DRYING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P70/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛爾特　尤金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHALYT, EUGENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁錫萬　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACEWAN, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢譯丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BI, YIDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱健輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　友傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示之主題包括藉由檢查廢氣用於監測超臨界CO&lt;sub&gt;2&lt;/sub&gt;乾燥之系統及其方法。該系統包括用以輸送液體CO&lt;sub&gt;2&lt;/sub&gt;之第一泵與用於熱調節劑之第二泵。在下游，加熱器產生超臨界氣體，還存在包括感測器及維持其壓力之背壓閥之偵測器。該感測器監測廢氣溫度以確保乾燥終點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed subject matter includes systems for monitoring of supercritical CO&lt;sub&gt;2&lt;/sub&gt; drying by examining the exhaust, and methods thereof. The system includes a first pump to deliver liquid CO&lt;sub&gt;2&lt;/sub&gt; and a second pump for a thermal moderator. Downstream, a heater generates a supercritical gas, with a detector including a sensor and a back-pressure valve maintaining its pressure. The sensor monitors the exhausted gas temperature to ensure a drying endpoint.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:偵測器</p>  
        <p type="p">102:第一泵</p>  
        <p type="p">104:第二泵</p>  
        <p type="p">106:加熱器</p>  
        <p type="p">108:排氣管</p>  
        <p type="p">110:背壓閥</p>  
        <p type="p">120:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="878" publication-number="202620079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、預浸體、樹脂膜、覆金屬積層板、印刷線路板、半導體封裝體及苊聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F212/32</main-classification>  
        <further-classification edition="200601120260223B">C08F232/08</further-classification>  
        <further-classification edition="200601120260223B">C08J5/24</further-classification>  
        <further-classification edition="200601120260223B">C08J5/18</further-classification>  
        <further-classification edition="200601120260223B">B32B15/08</further-classification>  
        <further-classification edition="202601120260223B">H10W74/47</further-classification>  
        <further-classification edition="200601120260223B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻澤裕二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAZAWA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種硬化性組成物，其包含：苊聚合物(A)；及，具有聚合性基之化合物(B)，其中，符合苊聚合物(A)者除外；前述苊聚合物(A)是苊化合物(a1)與其他含聚合性不飽和鍵化合物(a2)的共聚物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="879" publication-number="202620466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及物品</chinese-title>  
        <english-title>OPTICAL LAMINATE AND ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260209B">G02B1/115</main-classification>  
        <further-classification edition="201501120260209B">G02B1/14</further-classification>  
        <further-classification edition="201901120260209B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田悠之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, YUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久貴行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡会孝典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATARAI, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木嗣人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TSUGUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">該抗反射膜係具備膜基材及光學功能層之抗反射膜，且光學功能層自膜基材側起依序包含光學厚度為25 nm以上43 nm以下之第1高折射率層、光學厚度為54 nm以上69 nm以下之第1低折射率層、光學厚度為278 nm以上308 nm以下之第2高折射率層、及光學厚度為131 nm以上141 nm以下之第2低折射率層，上述抗反射膜之波長940 nm之光之透過率為86%以上，視感反射率Y為1.0%以下，使藉由標準光源D65所產生之波長380 nm～780 nm之光入射時之全反射光於CIE-LAB表色系中之a&lt;sup&gt;＊&lt;/sup&gt;值為-4.0＜a&lt;sup&gt;＊&lt;/sup&gt;＜4.0，b&lt;sup&gt;＊&lt;/sup&gt;值為-15.0＜b&lt;sup&gt;＊&lt;/sup&gt;＜0.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:膜基材</p>  
        <p type="p">20:硬塗層</p>  
        <p type="p">30:密接層</p>  
        <p type="p">40:光學功能層</p>  
        <p type="p">41a:第1高折射率層</p>  
        <p type="p">41b:第2高折射率層</p>  
        <p type="p">42a:第1低折射率層</p>  
        <p type="p">42b:第2低折射率層</p>  
        <p type="p">50:防污層</p>  
        <p type="p">100:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="880" publication-number="202619782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從氣流中過濾顆粒的方法</chinese-title>  
        <english-title>METHOD FOR FILTERING PARTICLES FROM AN AIRFLOW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B01D39/16</main-classification>  
        <further-classification edition="200601120260210B">B03C3/155</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商科德寶性能材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREUDENBERG PERFORMANCE MATERIALS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫特絲　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINTERS, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種從氣流中過濾顆粒的方法，其包含下列步驟：&lt;br/&gt; i)提供一種包含非織物之濾材，其包含具有熱塑性聚合物之纖維，該非織物包含電荷添加劑；&lt;br/&gt; ii)將該包含電荷添加劑之非織物進行靜電帶電，&lt;br/&gt; iii)將氣流中的顆粒進行靜電帶電；及&lt;br/&gt; iv)將包含被靜電帶電的顆粒之氣流傳送通過包含被靜電帶電的包含電荷添加劑之非織物之濾材，而能夠得到高過濾效率，尤其是在低壓降時。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for filtering particles from an airflow is provided comprising the steps of i) providing a filter medium comprising a nonwoven fabric comprising fibers comprising a thermoplastic polymer, the nonwoven fabric comprising a charging additive, ii) electrostatically charging the nonwoven fabric comprising the charging additive, iii) electrostatically charging the particles in the airflow, and iv) passing the airflow comprising the electrostatically charged particles through the filter medium comprising the electrostatically charged nonwoven fabric comprising the charging additive enables to obtain a high filtration efficiency, in particular at a low pressure drop.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="881" publication-number="202621051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙極性結型器件及其使用方法與開關</chinese-title>  
        <english-title>BIPOLAR JUNCTION DEVICES, AND METHODS AND SWITCHES USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H03K17/60</main-classification>  
        <further-classification edition="200601120260223B">H03K17/567</further-classification>  
        <further-classification edition="202501120260223B">H10D10/40</further-classification>  
        <further-classification edition="202601120260223B">H10D80/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商理想能量有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEAL POWER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康納　穆迪特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHANNA, MUDIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>步　健康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, JIANKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余睿陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, RUIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布達爾　Ｒ　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRDAR, R. DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及雙極性結型器件及其使用方法與開關。至少一個示例是雙極性結型器件，包括由部署於N型材料襯底內的N型下區限定的下集射極、由部署於襯底內的P型下區限定的下基極以及上集射極。上集射極包括部署於襯底內的P型上區及部署於襯底上表面上的金屬層。金屬層的第一部分電耦合至P型上區，並且金屬層的第二部分電耦合至襯底。第二部分與第一部分錯位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:雙極性結型器件</p>  
        <p type="p">300:襯底</p>  
        <p type="p">302:N型下區</p>  
        <p type="p">306:P型下區</p>  
        <p type="p">310:P型上區</p>  
        <p type="p">330:N型上區</p>  
        <p type="p">704:上側</p>  
        <p type="p">706:下側</p>  
        <p type="p">708:上溝槽</p>  
        <p type="p">710:遠端</p>  
        <p type="p">714:氧化層</p>  
        <p type="p">716:上接觸溝槽</p>  
        <p type="p">718:遠端</p>  
        <p type="p">724:下基極溝槽</p>  
        <p type="p">728:遠端</p>  
        <p type="p">730:氧化層</p>  
        <p type="p">732:遠端</p>  
        <p type="p">734:下CE溝槽</p>  
        <p type="p">D&lt;sub&gt;T&lt;/sub&gt;:深度</p>  
        <p type="p">D&lt;sub&gt;CT&lt;/sub&gt;:深度</p>  
        <p type="p">D&lt;sub&gt;CET&lt;/sub&gt;:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="882" publication-number="202621354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體供應裝置、氣體供應系統及氣體供應方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/24</main-classification>  
        <further-classification edition="202601120260223B">H10P50/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大陽日酸股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田吉史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙洋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水秀治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, HIDEHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩本竜弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMOTO, TATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氣體供應裝置、氣體供應系統及氣體供應方法，其可於使用工業用氣體的現場有效率地產生並供應該工業用氣體。氣體供應裝置包括：處理部1，自包含原料氣體成分的原料氣體獲得產品氣體與殘渣氣體；殘渣監視部，獲取包含與殘渣氣體的狀態有關的資訊的殘渣資訊；以及回收部，自殘渣氣體回收原料氣體成分，回收部4具有：分離回收機，自殘渣氣體回收原料氣體成分；以及分配部，向分離回收機分配殘渣氣體，分配部基於殘渣資訊，將回收單元切換為串聯、並聯或單獨，分配殘渣氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理部</p>  
        <p type="p">2:分離部</p>  
        <p type="p">3:監視部</p>  
        <p type="p">4:回收部</p>  
        <p type="p">4A:第一回收部</p>  
        <p type="p">4B:第二回收部</p>  
        <p type="p">5:分配部</p>  
        <p type="p">9:處理室</p>  
        <p type="p">10:反應室</p>  
        <p type="p">21:第一分離器</p>  
        <p type="p">22:第二分離器</p>  
        <p type="p">29、72、74、79a、79b、81、82、83、84:配管</p>  
        <p type="p">30:產品監視部</p>  
        <p type="p">31、32:殘渣監視部</p>  
        <p type="p">41:第一分離回收機(回收單元)</p>  
        <p type="p">42:第二分離回收機(回收單元)</p>  
        <p type="p">71:配管(導入部)</p>  
        <p type="p">73:配管(送出部)</p>  
        <p type="p">79:供應配管群組</p>  
        <p type="p">81a、82a:泵</p>  
        <p type="p">85、86:排氣配管</p>  
        <p type="p">89:混合機</p>  
        <p type="p">100:氣體供應裝置</p>  
        <p type="p">200:氣體供應系統</p>  
        <p type="p">C:控制部</p>  
        <p type="p">S:供應源</p>  
        <p type="p">S1、S2:缸體單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="883" publication-number="202620695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運算裝置、系統及其操作方法</chinese-title>  
        <english-title>COMPUTING DEVICE, SYSTEM AND THE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260208B">G06N3/063</main-classification>  
        <further-classification edition="200601120260208B">G06F7/556</further-classification>  
        <further-classification edition="200601120260208B">G06F7/483</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯文昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHWA, WIN-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂樂　艾許文桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LELE, ASHWIN SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張孟凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MENG-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述的實施例提供用於算術邏輯單元計算輸入資料值的指數的系統、裝置及方法，分離器電路將輸入資料值分離為整數部分及小數部分。排程器電路例如基於該輸入資料值的該小數部分動態地判定用於近似該小數部分的指數的項數。泰勒展開計算電路計算補償小數部分的泰勒展開項數之和。然後，將該輸入資料值的該指數計算為該整數部分的該指數與該小數部分的該近似指數的乘積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiment described herein provide systems, apparatuses and methods for an arithmetic logic unit compute an exponential of an input data value, a splitter circuit splits an input data value into an integer portion and a fractional portion. A scheduler circuit dynamically determines a number of terms for approximating an exponential of the factional portion, e.g., based on the fractional part of the input data value. A Taylor expansion computation circuit computing a sum of the number of Taylor expansion terms for the compensated fractional portion. The exponential of the input data value is then computed as a multiplication of the exponential of the integer portion and the approximated exponential of the fractional portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:神經網路模型</p>  
        <p type="p">102:輸入資料</p>  
        <p type="p">105:神經元</p>  
        <p type="p">110:層</p>  
        <p type="p">115:概率</p>  
        <p type="p">120:softmax操作</p>  
        <p type="p">130:輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="884" publication-number="202620939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鋰硫電池之金屬硫族化合物-硒-硫電極</chinese-title>  
        <english-title>METAL CHALCOGENIDE-SELENIUM-SULFUR ELECTRODE FOR LITHIUM SULFUR BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H01M4/04</main-classification>  
        <further-classification edition="201001120260213B">H01M4/136</further-classification>  
        <further-classification edition="200601120260213B">H01M4/38</further-classification>  
        <further-classification edition="201001120260213B">H01M4/58</further-classification>  
        <further-classification edition="201001120260213B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商柯納米克斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONAMIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布克哈特　斯蒂芬　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURKHARDT, STEPHEN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫德斯利　珍妮佛　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAWDSLEY, JENNIFER R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示陰極活性材料層及方法。該陰極活性材料層包括金屬硫族元素、電活性硫轉換陰極材料及電活性硒轉換陰極材料。該陰極活性材料層包括介於5%與75%之間之重量比(w/w)之金屬硫族元素、介於15%與75%之間之重量比(w/w)之電活性硫轉換陰極材料、及介於2%與25%之間之重量比(w/w)之電活性硒轉換陰極材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cathode active material layers and methods are disclosed. The cathode active material layer includes a metal chalcogen, an electroactive sulfur conversion cathode material, and an electroactive selenium conversion cathode material. The cathode active material layer includes the metal chalcogen in a weight ratio (w/w) of between 5% and 75%, the electroactive sulfur conversion cathode material in a weight ratio (w/w) of between 15% and 75%, and the electroactive selenium conversion cathode material in a weight ratio (w/w) of between 2% and 25%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:電化學電池</p>  
        <p type="p">802:負極</p>  
        <p type="p">802a:另外電極層</p>  
        <p type="p">802b:另外電極層</p>  
        <p type="p">804:正極</p>  
        <p type="p">804a:另外電極層</p>  
        <p type="p">804b:另外電極層</p>  
        <p type="p">806:隔板</p>  
        <p type="p">806a:另外隔板</p>  
        <p type="p">806b:另外隔板</p>  
        <p type="p">810:容器</p>  
        <p type="p">812:流體電解質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="885" publication-number="202621272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及形成半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/01</main-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-GING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在形成半導體裝置的奈米結構電晶體之後，從半導體裝置的背面移除半導體裝置的電隔離結構，並以貫穿基板互連結構取代。可以將半導體裝置的背面研磨掉，露出電隔離結構的底部，然後可以透過半導體裝置的背面去除電隔離結構，並從背面用貫穿基板互連結構填充。使用電隔離結構作為貫穿基板互連結構的佔位，使得貫穿基板互連結構能夠以自對準的方式從半導體裝置的背面形成，這增加形成電連接的可靠性和可重複性半導體裝置的背面和正面之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical isolation structure of a semiconductor device is removed from a back side of the semiconductor device after formation of nanostructure transistors of the semiconductor device and replaced with a through-substrate interconnect structure. The back side of the semiconductor device may be grinded down to reveal the bottom of the electrical isolation structure, and the electrical isolation structure may be removed through the back side of the semiconductor device and filled in with the through-substrate interconnect structure from the back side of the semiconductor device. Using the electrical isolation structure as a placeholder for the through-substrate interconnect structure enables the through-substrate interconnect structure to be formed from the back side of the semiconductor device in a self-aligned manner, which increases the reliability and repeatability of forming electrical connections between the back side and a front side of the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1800:製程</p>  
        <p type="p">1810,1820,1830,1840,1850,1860,1870:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="886" publication-number="202620083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於整飾含胺基和／或醯胺基的基材之聚合物</chinese-title>  
        <english-title>POLYMER FOR FINISHING OF SUBSTRATES CONTAINING AMINO AND/OR AMIDE GROUPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08F220/06</main-classification>  
        <further-classification edition="200601120260210B">C08F220/10</further-classification>  
        <further-classification edition="200601120260210B">C08F212/08</further-classification>  
        <further-classification edition="200601120260210B">C08F212/14</further-classification>  
        <further-classification edition="200601120260210B">D06M15/233</further-classification>  
        <further-classification edition="200601120260210B">D06M15/263</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商魯道夫公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUDOLF GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許勒曼　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIELEMANN, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪瑟　克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUSER, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勞恩　萊納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAUN, RAINER WILHELM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種部分中和之聚合物、其製造方法及其用於整飾基材之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a partially neutralized polymer, a method for its production and its use for the finishing of substrates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="887" publication-number="202619893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低折射率層形成用組成物、光學薄膜及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B32B27/18</main-classification>  
        <further-classification edition="201901120260210B">B32B7/023</further-classification>  
        <further-classification edition="201501120260210B">G02B1/111</further-classification>  
        <further-classification edition="201501120260210B">G02B1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種低折射率層形成用組成物，其係含有多官能(甲基)丙烯酸單體(A)、光聚合起始劑(B)、防汙添加劑(C)、內部具有空隙之無機粒子(D)、具有磷酸基之(甲基)丙烯酸單體(E)及溶劑(F)之低折射率層形成用組成物，其中多官能(甲基)丙烯酸單體(A)係於一分子中具有3個以上的(甲基)丙烯醯基、1個以上的羥基，內部具有空隙之無機粒子(D)之含量為固體成分全量之中22～59質量%，具有磷酸基之(甲基)丙烯酸單體(E)之含量為固體成分全量之中0.5～10質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="888" publication-number="202620216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗覆包括多層塗層之基板的方法</chinese-title>  
        <english-title>A METHOD OF COATING A SUBSTRATE INCLUDING A MULTI-LAYER COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C23C14/08</main-classification>  
        <further-classification edition="200601120260209B">C23C14/54</further-classification>  
        <further-classification edition="200601120260209B">C23C16/08</further-classification>  
        <further-classification edition="200601120260209B">C23C16/40</further-classification>  
        <further-classification edition="200601120260209B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利塔　拉克希瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALITA, LAKSHESWAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班凱　約瑟夫弗瑞德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEHNKE, JOSEPH FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英格爾　尼汀Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGLE, NITIN K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博德里　克里斯多佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUDRY, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特拉爾　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRAHLE, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞帕拉　桑尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEPPAELAE, SANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處描述了一種形成多層塗層的方法，包括在腔室部件的表面上沉積包含金屬氧化物層的第一層及包含稀土氟化物層的第二層。該方法進一步包括使用濕清洗製程移除稀土氟化物層上的表面氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein is a method for forming a multi-layer coating including a first layer comprising a metal oxide layer on a surface of a chamber component and a second layer comprising a rare earth fluoride layer on the metal oxide layer. The method further includes removing surface oxidation on the rare earth fluoride layer using a wet clean process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">405:區塊</p>  
        <p type="p">410:區塊</p>  
        <p type="p">415:區塊</p>  
        <p type="p">420:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="889" publication-number="202620545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性著色組成物，及彩色濾光片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G03F7/004</main-classification>  
        <further-classification edition="200601120260210B">G03F7/027</further-classification>  
        <further-classification edition="200601120260210B">C08F2/44</further-classification>  
        <further-classification edition="200601120260210B">C08F220/10</further-classification>  
        <further-classification edition="200601120260210B">G02B5/20</further-classification>  
        <further-classification edition="200601120260210B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下健宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供含有具有高的折射率之共聚物的感光性樹脂組成物。又，提供可得到光透過率良好的樹脂硬化膜之感光性樹脂組成物。進一步地，提供光透過率良好，具有高的折射率之樹脂硬化膜、具備該樹脂硬化膜之影像顯示元件。一種感光性樹脂組成物，其為含有共聚物(A)、反應性稀釋劑(B)、光聚合起始劑(C)，及溶劑(D)之感光性樹脂組成物，其中共聚物(A)，為含有源自含有萘基之(甲基)丙烯酸酯的構成單位(a-1)之共聚物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無&lt;b&gt;  &lt;/b&gt;</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="890" publication-number="202621520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W72/50</main-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-GING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在形成半導體裝置的奈米結構電晶體之後，從半導體裝置的背側移除半導體裝置的電絕緣結構，並以穿過基板互連結構取代。可以研磨半導體裝置的背側以露出電絕緣結構的底部，並且可以透過半導體裝置的背側移除電絕緣結構並從半導體裝置的背側用穿過基板互連結構填充。使用電絕緣結構作為穿過基板互連結構的佔位，使得能夠以自對準方式從半導體裝置的背側形成穿過基板互連結構，這提高了在半導體裝置的背側和前側之間增加形成電連接的可靠性和可重複性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical isolation structure of a semiconductor device is removed from a back side of the semiconductor device after formation of nanostructure transistors of the semiconductor device and replaced with a through-substrate interconnect structure. The back side of the semiconductor device may be grinded down to reveal the bottom of the electrical isolation structure, and the electrical isolation structure may be removed through the back side of the semiconductor device and filled in with the through-substrate interconnect structure from the back side of the semiconductor device. Using the electrical isolation structure as a placeholder for the through-substrate interconnect structure enables the through-substrate interconnect structure to be formed from the back side of the semiconductor device in a self-aligned manner, which increases the reliability and repeatability of forming electrical connections between the back side and a front side of the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:半導體裝置</p>  
        <p type="p">165:鰭片部分</p>  
        <p type="p">310:台面區</p>  
        <p type="p">315:奈米結構通道</p>  
        <p type="p">410:內部間隔物</p>  
        <p type="p">505:緩衝區</p>  
        <p type="p">510:源極/汲極區</p>  
        <p type="p">515:覆蓋層</p>  
        <p type="p">605:層間介電層/ILD層</p>  
        <p type="p">735:介電襯墊</p>  
        <p type="p">805:閘極介電層</p>  
        <p type="p">810:閘極結構</p>  
        <p type="p">1005:源極/汲極接觸件</p>  
        <p type="p">1010:金屬矽化物層</p>  
        <p type="p">1015:襯墊</p>  
        <p type="p">1020:蝕刻停止層/ESL</p>  
        <p type="p">1025:層間介電層/ILD層</p>  
        <p type="p">1030:導電結構</p>  
        <p type="p">1035:襯墊</p>  
        <p type="p">1040:蝕刻停止層/ESL</p>  
        <p type="p">1045:層間介電層/ILD層</p>  
        <p type="p">1050:蝕刻停止層/ESL</p>  
        <p type="p">1105:載體基板</p>  
        <p type="p">1120:源極/汲極接觸件</p>  
        <p type="p">1130:襯墊</p>  
        <p type="p">1135:硬遮罩層</p>  
        <p type="p">1200:示例實施方式</p>  
        <p type="p">1210:穿過基板互連結構</p>  
        <p type="p">1215:襯墊</p>  
        <p type="p">B-B:橫截面</p>  
        <p type="p">x:方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="891" publication-number="202621308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/85</main-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石哲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHE CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鎮瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何韋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, WEI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濟印</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭培仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG, PEI-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成下部電晶體及在下部電晶體上方的上部電晶體。下部電晶體包含半導體基板上方的下部源極/汲極區，下部源極/汲極區包含面向半導體基板的底部側。上部電晶體包括在下部源極/汲極區上方的上部源極/汲極區。方法進一步包含形成觸點開口以暴露下部源極/汲極區之底部側，執行磊晶製程以在下部源極/汲極區上生長半導體層，及形成經由半導體層電連接至下部源極/汲極區的矽化物層。藉由從源極/汲極區之後側再生長低溫磊晶半導體層，降低了下部源極/汲極區之電阻及個別接觸電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a lower transistor and an upper transistor over the lower transistor. The lower transistor comprises a lower source/drain region over a semiconductor substrate, and the lower source/drain region comprises a bottom side facing the semiconductor substrate. The upper transistor comprises an upper source/drain region over the lower source/drain region. The method further comprises forming a contact opening to expose the bottom side of the lower source/drain region, performing an epitaxy process to grow a semiconductor layer on the lower source/drain region, and forming a silicide layer electrically connected to the lower source/drain region through the semiconductor layer. By re-growing low-temperature epitaxy semiconductor layers from the backside of source/drain regions, the resistance of the lower source/drain regions and the respective contact resistance are reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:製程流程</p>  
        <p type="p">302-342:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="892" publication-number="202620959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組及包含電池組之載具</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260212B">H01M50/507</main-classification>  
        <further-classification edition="202101120260212B">H01M50/516</further-classification>  
        <further-classification edition="202101120260212B">H01M50/517</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭仁赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, IN-HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋鐘珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JONG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安埈永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUN-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庸鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺龍赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG-HYUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的一種電池組包括：多個電池單體；匯流條總成，設置於所述多個電池單體的一個側上，且包括與所述多個電池單體的電極連接的子匯流條單元；以及金屬構件，被配置成在匯流條總成的底部處支撐所述多個電池單體，其中子匯流條單元包括單向連接匯流條，所述單向連接匯流條在子匯流條單元在寬度方向上的一個側上連接至所述電池單體的電極，且其中金屬構件在預定位置處部分地連接至單向連接匯流條以具有預定導電面積，進而避免單向連接匯流條中的電流差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery pack according to the present disclosure includes a plurality of battery cells; a bus-bar assembly disposed on one side of the plurality of battery cells and including a sub-bus-bar unit connected to electrodes of the plurality of battery cells; and a metal member configured to support the plurality of battery cells at a bottom of the bus-bar assembly, wherein the sub-bus-bar unit includes a one-way connection bus-bar connected to the electrodes of the battery cells on one side of the sub-bus-bar unit in a width direction, and wherein the metal member is partially connected to the one-way connection bus-bar at a predetermined position to have a predetermined conductive area so as to avoid current differences in the one-way connection bus-bar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池單體</p>  
        <p type="p">110、120:電極</p>  
        <p type="p">210:子匯流條單元</p>  
        <p type="p">220:單向連接匯流條</p>  
        <p type="p">230:雙向連接匯流條</p>  
        <p type="p">300:金屬構件</p>  
        <p type="p">410:側壁</p>  
        <p type="p">420:側結構</p>  
        <p type="p">C:電流</p>  
        <p type="p">SP:串聯連接部分</p>  
        <p type="p">X、Y:軸/方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="893" publication-number="202620956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組及包含其之載具</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260215B">H01M50/296</main-classification>  
        <further-classification edition="202101120260215B">H01M50/505</further-classification>  
        <further-classification edition="202101120260215B">H01M50/249</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安埈永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUN-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鐘善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG-SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋鐘珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JONG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庸鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭仁赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, IN-HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺龍赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG-HYUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例的一種電池組包括：第一單體陣列結構，具有多個電池單體且在一個端部處具有第一端部框架，並且被設置至第一方向上的側；第二單體陣列結構，具有多個電池單體且在一個端部處具有第二端部框架，並且被設置至第二方向上的側以與第一單體陣列結構堆疊；以及第一連接匯流條，被配置成對堆疊於彼此上的第一單體陣列結構與第二單體陣列結構進行電性連接，其中第一端部框架與第二端部框架可具有不同的電極端子結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery pack according to an embodiment of the present disclosure includes: a first cell array structure having a plurality of battery cells and a first end frame at one end, and disposed to a side in a first direction; a second cell array structure having a plurality of battery cells and a second end frame at one end, and disposed to a side in a second direction so as to be stacked with the first cell array structure; and a first connecting bus-bar configured to electrically connect the first cell array structure and the second cell array structure stacked on each other, wherein the first end frame and the second end frame may have different electrode terminal structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一單體陣列結構</p>  
        <p type="p">110、210:電池單體</p>  
        <p type="p">120:第一端部框架</p>  
        <p type="p">200:第二單體陣列結構</p>  
        <p type="p">220:第二端部框架</p>  
        <p type="p">300:第一連接匯流條</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="894" publication-number="202620646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高維特徵向量空間中的多階段搜尋和距離近似的系統與方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR MULTI-STAGE SEARCH AND DISTANCE APPROXIMATION IN HIGH-DIMENSIONAL FEATURE VECTOR SPACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G06F12/02</main-classification>  
        <further-classification edition="201901120250901B">G06F16/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡瀚文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, BO-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淮慕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUAI-MU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於檢索及搜尋資訊的系統、裝置、方法及電路，藉由計算查詢向量及資料集中的特徵向量之間的歐幾里得距離。在一種樣態中，範例方法包含從該控制器接收指示要求的查詢向量。取得多個特徵向量的複數個叢集。決定查詢向量及叢集的多個質心向量之間的複數個距離。從叢集中選擇一或多個叢集，基於查詢向量及叢集的質心向量之間的距離。對於一或多個叢集的每一特徵向量，決定查詢向量及特徵向量之間的一距離。從一或多個叢集中選擇一或多個特徵向量，基於查詢向量及一或多個叢集的多個特徵向量之間的多個距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, devices, methods, and circuits are provided for retrieving and searching information by computing Euclidean distances between a query vector and feature vectors within a dataset. In one aspect, an example method includes receiving a request indicating a query vector. A plurality of clusters of feature vectors are obtained. A plurality of distances between the query vector and centroid vectors of the plurality of clusters are determined. One or more clusters are selected from the plurality of clusters based on the plurality of distances between the query vector and the centroid vectors of the plurality of clusters. For each feature vector of the selected one or more clusters, a distance between the query vector and the feature vector is determined. One or more feature vectors are selected from the one or more clusters based on distances between the query vector and feature vectors of the one or more clusters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">802、804、806、808、810、812:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="895" publication-number="202620471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有金屬氟化物層之反射鏡及其製造方法</chinese-title>  
        <english-title>MIRROR WITH METAL FLUORIDE LAYERS AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02B5/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈特　蓋瑞艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HART, GARY ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種反射鏡，包括：（a）一基板，包含一主表面；（b）一鋁層，安置於該基板之該主表面上，該鋁層具有在50 nm至100 nm之一範圍內的一厚度；（c）一MgF&lt;sub&gt;2&lt;/sub&gt;層，安置於該鋁層上，該MgF&lt;sub&gt;2&lt;/sub&gt;層包含在3.0 nm至7.0 nm之一範圍內的一厚度；及（d）一第二金屬氟化物層，安置於該MgF&lt;sub&gt;2&lt;/sub&gt;層上，該第二金屬氟化物層具有在5.0 nm至40 nm之一範圍內的一厚度。該反射鏡可在115 nm至220 nm之一整個波長範圍內在電磁輻射之一15度入射角下展現大於70%的反射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mirror including: (a) a substrate comprising a primary surface; (b) an aluminum layer disposed on the primary surface of the substrate, the aluminum layer having a thickness within a range of from 50 nm to 100 nm; (c) an MgF&lt;sub&gt;2&lt;/sub&gt; layer disposed on the aluminum layer, the MgF&lt;sub&gt;2&lt;/sub&gt; layer comprising a thickness within a range of from 3.0 nm to 7.0 nm; and (d) a second metal fluoride layer disposed on the MgF&lt;sub&gt;2&lt;/sub&gt; layer, the second metal fluoride layer having a thickness within a range of from 5.0 nm to 40 nm. The mirror can exhibit greater than 70% reflectance at an angle of incidence of 15 degrees of electromagnetic radiation throughout an entirety of a wavelength range of from 115 nm to 220 nm.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="896" publication-number="202620069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚乙烯縮醛樹脂、聚乙烯縮醛樹脂溶液之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08F16/38</main-classification>  
        <further-classification edition="200601120260209B">C08F8/28</further-classification>  
        <further-classification edition="200601120260209B">C08L29/14</further-classification>  
        <further-classification edition="200601120260209B">C04B35/634</further-classification>  
        <further-classification edition="200601120260209B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大東裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOHIGASHI, YUUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織田剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚乙烯縮醛樹脂、及使用該聚乙烯縮醛樹脂之聚乙烯縮醛樹脂溶液之製造方法、陶瓷生坯片（ceramic green sheet）用漿料、陶瓷生坯片及積層陶瓷電容器，該聚乙烯縮醛樹脂能夠獲得樹脂中之雜質較少，機械強度較高之陶瓷生坯片，且能夠製作可靠性優異之積層陶瓷電容器。 &lt;br/&gt;本發明係一種聚乙烯縮醛樹脂，其於「將0.2質量%之乙醇-甲苯（乙醇：甲苯＝50：50）混合溶液中之0.5～1.0 μm尺寸之粒子數設為P（MIX），並將0.2質量%之乙醇溶液中之0.5～1.0 μm尺寸之粒子數設為P（EOH）」之情形時，P（MIX）為1～20000個/10 ml，且P（EOH）/P（MIX）為1.2～7.0；於藉由紅外分光光度計所測得之IR吸收光譜中，在將波數3050～3750 cm&lt;sup&gt;-1&lt;/sup&gt;之範圍內之波峰之最小穿透率設為X（%）時，於「將顯示出滿足[100－（100－X）/2]之穿透率a（%）之波數中之低波數側之波數設為A、高波數側之波數設為B」之情形時，使用上述A、B及藉由&lt;sup&gt;1&lt;/sup&gt;H-NMR所測得之羥基量，利用式（1）所求出之羥基量換算波數寬度為8.31以上。 &lt;br/&gt;羥基量換算波數寬度（cm&lt;sup&gt;-1&lt;/sup&gt;/mol%）＝[（B－A）/羥基量]   （1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="897" publication-number="202620512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>補償音訊資料的頭戴顯示裝置和方法</chinese-title>  
        <english-title>HEAD-MOUNTED DISPLAY AND METHOD FOR COMPENSATING AUDIO DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250618B">G02B27/02</main-classification>  
        <further-classification edition="202201120250618B">G06V10/70</further-classification>  
        <further-classification edition="202201120250618B">G06V10/774</further-classification>  
        <further-classification edition="201301120250618B">G10L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立研</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YAN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種補償音訊資料的頭戴顯示裝置和方法。方法包含：取得多個房間脈衝響應；擷取場域的影像；根據機器學習模型對影像執行影像辨識以取得場域類型資訊；根據場域類型資訊從多個房間脈衝響應中選出第一房間脈衝響應；根據第一房間脈衝響應處理音訊以取得經處理音訊；以及輸出經處理音訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head-mounted display and a method for compensating audio data are provided. The method includes: obtaining a plurality of room impulse responses; capturing an image of a field; performing image recognition to the image according to a machine learning model to obtain field type information; selecting a first room impulse response from the plurality of room impulse responses according to the field type information; processing audio according to the first room impulse response to obtain the processed audio, and outputting the processed audio.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301,S302,S303,S304,S305,S306:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="898" publication-number="202621279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251127B">H10D30/60</main-classification>  
        <further-classification edition="202501120251127B">H10D30/01</further-classification>  
        <further-classification edition="202501120251127B">H10D62/10</further-classification>  
        <further-classification edition="200601120251127B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置及其形成方法。半導體裝置可包括第一源極/汲極區、在第一源極/汲極區之第一側壁上的第一奈米結構、在第一奈米結構周圍的第一閘極結構、在第一源極/汲極區之第一側壁上的第一內部間隔物、在第一源極/汲極區之第二側壁上的第二內部間隔物、在第二內部間隔物之側壁上的第一介電襯裡、及在第一介電襯裡之側壁上的第一隔離特徵。第一內部間隔物可在第一閘極結構與第一源極/汲極區之間。第二內部間隔物可在第一介電襯裡與第一源極/汲極區之間。第一介電襯裡可在第一隔離特徵與第二內部間隔物之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include a first source/drain region, a first nanostructure on a first sidewall of the first source/drain region, a first gate structure around the first nanostructure, a first inner spacer on the first sidewall of the first source/drain region, a second inner spacer on a second sidewall of the first source/drain region, a first dielectric liner on a sidewall of the second inner spacer, and a first isolation feature on a sidewall of the first dielectric liner. The first inner spacer may be between the first gate structure and the first source/drain region. The second inner spacer may be between the first dielectric liner and the first source/drain region. The first dielectric liner may be between the first isolation feature and the second inner spacer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">20':半導體鰭片</p>  
        <p type="p">26L:下部半導體奈米結構</p>  
        <p type="p">26U:上部半導體奈米結構</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">54:內部間隔物</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">62L:下部磊晶源極/汲極區</p>  
        <p type="p">62U:上部磊晶源極/汲極區</p>  
        <p type="p">66:第一CESL</p>  
        <p type="p">68:第一ILD68</p>  
        <p type="p">70:第二CESL</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80L:下部閘電極</p>  
        <p type="p">80U:上部閘電極</p>  
        <p type="p">90:閘極結構</p>  
        <p type="p">90L:上部閘極結構</p>  
        <p type="p">90U:下部閘極結構</p>  
        <p type="p">92:閘極遮罩</p>  
        <p type="p">94:金屬半導體合金區</p>  
        <p type="p">96U:源極/汲極觸點</p>  
        <p type="p">102U:介電襯裡之上部部分</p>  
        <p type="p">103:隔離特徵</p>  
        <p type="p">104:第三CESL</p>  
        <p type="p">106:第三ILD</p>  
        <p type="p">108:閘極觸點</p>  
        <p type="p">110:源極/汲極通孔</p>  
        <p type="p">114:前側互連結構</p>  
        <p type="p">116:介電層</p>  
        <p type="p">118:導電特徵層</p>  
        <p type="p">150:堆疊電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="899" publication-number="202620168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含奈米粒子之介電冷卻液</chinese-title>  
        <english-title>DIELECTRIC COOLING FLUID INCLUDING NANOPARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C09K5/10</main-classification>  
        <further-classification edition="201101120260210B">B82Y30/00</further-classification>  
        <further-classification edition="200601120260210B">H02K9/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商瑟普默技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBMER TECHNOLOGIES SL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫柏　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOPER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇里斯　瓦爾斯　羅瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURIS VALLS, ROMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種混合奈米粒子流體具有：烴基液體；複數不同類型的奈米粒子；及至少一種分散劑，用於使奈米粒子分散在烴基液體內。本發明的介電流體被調適為用作通電的電子組件（諸如，GPU、CPU、主機板等）的介電浸沒冷卻液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid nanoparticle fluid having an hydrocarbon base liquid, a plurality of different types of nanoparticles and at least one dispersant to disperse the nanoparticles within the hydrocarbon base liquid. The present dielectric fluid is adapted for use as a dielectric immersion cooling liquid to transfer heat with energised electronic components such as GPUs, CPUs, motherboards etc.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="900" publication-number="202620094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光照射剝離用之剝離劑組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08G59/40</main-classification>  
        <further-classification edition="200601120260223B">C08G8/04</further-classification>  
        <further-classification edition="200601120260223B">C09J11/06</further-classification>  
        <further-classification edition="200601120260223B">C09J161/04</further-classification>  
        <further-classification edition="200601120260223B">C09J161/20</further-classification>  
        <further-classification edition="200601120260223B">C09J201/06</further-classification>  
        <further-classification edition="200601120260223B">B32B15/08</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳井昌樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臼井友輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種光照射剝離用之剝離劑組成物，其係為了製造扇出型半導體封裝，可於依序具有支撐基板、剝離劑層、金屬層、配線層之積層體中，形成提升與支撐基板之密著性能之剝離劑層。此外，亦提供一種使用該光照射剝離用之剝離劑組成物之積層體、及一種扇出型半導體封裝之製造方法。 &lt;br/&gt;本發明之光照射剝離用之剝離劑組成物，係用以形成積層體中之光照射剝離用之剝離劑層， &lt;br/&gt;前述積層體，係依序積層： &lt;br/&gt;透光性之支撐基板、 &lt;br/&gt;前述光照射剝離用之剝離劑層、 &lt;br/&gt;金屬層、及 &lt;br/&gt;配線層； &lt;br/&gt;前述光照射剝離用之剝離劑組成物，係含有：具有與芳香族環直接鍵結之羥基及與芳香族環直接鍵結之羧基中至少任一者之樹脂、環氧系交聯劑、及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="901" publication-number="202621307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/83</main-classification>  
        <further-classification edition="202501120260223B">H10D30/60</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI-MYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金勝圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEUNG KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KWANG-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪世基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SE KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有改良之整合及效能的半導體裝置。該半導體裝置包括在一第一方向上依序配置之一第一區及一第二區，該半導體裝置包含：一第一主動圖案，其在該第一區中在與該第一方向相交之一第二方向上延伸；一第二主動圖案，其在該第二區中在該第二方向上延伸；一閘極結構，其在該第一主動圖案及該第二主動圖案上在與該第一方向及該第二方向相交之一第三方向上延伸；以及一通孔結構，其在該閘極結構之一側表面上跨越該第一區及該第二區在該第一方向上延伸，其中該通孔結構包括在該第一方向上依序堆疊之一第一通孔圖案及一第二通孔圖案，以及在該第一通孔圖案之上表面上沿著該第二通孔圖案之一側表面延伸的一第一襯套絕緣膜，並且一邊界存在於該第一通孔圖案與該第二通孔圖案之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a semiconductor device with improved integration and performance. The semiconductor device including a first region and a second region sequentially arranged in a first direction, the semiconductor device comprising, a first active pattern extending in a second direction intersecting the first direction in the first region, a second active pattern extending in the second direction in the second region, a gate structure extending in a third direction intersecting the first and second directions on the first and second active patterns and a via structure extending in the first direction across the first and second regions, on a side surface of the gate structure, wherein the via structure includes a first via pattern and a second via pattern sequentially stacked in the first direction, and a first liner insulating film extending along a side surface of the second via pattern, on the upper surface of the first via pattern, and a boundary exists between the first and second via patterns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基體</p>  
        <p type="p">102a:第一表面</p>  
        <p type="p">102b:第二表面</p>  
        <p type="p">160:第一源極/汲極圖案</p>  
        <p type="p">165:第一蝕刻終止膜</p>  
        <p type="p">190:第一層間絕緣膜</p>  
        <p type="p">260:第二源極/汲極圖案</p>  
        <p type="p">265:第二蝕刻終止膜</p>  
        <p type="p">271:矽化物膜</p>  
        <p type="p">272:第三障壁傳導膜</p>  
        <p type="p">274:第三填充傳導膜</p>  
        <p type="p">281b:第一襯套絕緣膜</p>  
        <p type="p">282a:第一障壁傳導膜</p>  
        <p type="p">282b:第二障壁傳導膜</p>  
        <p type="p">284a:第一填充傳導膜</p>  
        <p type="p">284b:第二填充傳導膜</p>  
        <p type="p">290:第二層間絕緣膜</p>  
        <p type="p">310:前側佈線絕緣膜</p>  
        <p type="p">331:第一前側佈線圖案</p>  
        <p type="p">332:第二前側佈線圖案</p>  
        <p type="p">333:第三前側佈線圖案</p>  
        <p type="p">400:背側絕緣膜</p>  
        <p type="p">410:背側佈線絕緣膜</p>  
        <p type="p">421:第一背側接觸圖案</p>  
        <p type="p">422:第二背側接觸圖案</p>  
        <p type="p">431:第一背側佈線圖案</p>  
        <p type="p">432:第二背側佈線圖案</p>  
        <p type="p">472:第四障壁傳導膜</p>  
        <p type="p">474:第四填充傳導膜</p>  
        <p type="p">482:第五障壁傳導膜</p>  
        <p type="p">484:第五填充傳導膜</p>  
        <p type="p">C-C:線</p>  
        <p type="p">BC1:第一背側源極/汲極接點</p>  
        <p type="p">BM:背側佈線圖案</p>  
        <p type="p">BW:背側佈線結構</p>  
        <p type="p">DC1:第一直接接點</p>  
        <p type="p">FC1:第一前側源極/汲極接點</p>  
        <p type="p">FM:前側佈線圖案</p>  
        <p type="p">FW:前側佈線結構</p>  
        <p type="p">I:第一區</p>  
        <p type="p">II:第二區</p>  
        <p type="p">MC1:第一連接接點</p>  
        <p type="p">MC3:第三連接接點</p>  
        <p type="p">R1:區</p>  
        <p type="p">TV1:第一通孔結構</p>  
        <p type="p">TVa:第一通孔圖案</p>  
        <p type="p">TVb:第二通孔圖案</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第三方向</p>  
        <p type="p">Z:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="902" publication-number="202620930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用LC電路控制蝕刻速率的脈衝DC系統及方法</chinese-title>  
        <english-title>PULSED DC SYSTEMS AND METHODS FOR CONTROLLING ETCH RATE USING AN LC CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H01J37/32</main-classification>  
        <further-classification edition="200601120260202B">H05H1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪瑞卡塔諾　艾力西　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARAKHTANOV, ALEXEI M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智　賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俸奭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BONGSEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙臨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露千西　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCCHESI, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍藍德　約翰　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND, JOHN PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含脈衝直流(DC)源。脈衝DC源產生DC電壓信號。該系統包含電感器-電容器(LC)電路，其耦接至脈衝DC源以接收DC電壓信號而輸出方波形電壓。該系統更包含產生RF波形的高頻(HF)射頻(RF)產生器。該系統包含阻抗匹配電路，其耦接至HF RF產生器以接收RF波形而輸出修改過的RF波形。LC電路與阻抗匹配電路在一點耦接以結合修改過的RF波形和方波形電壓。修改過的RF波形與方波形電壓結合以輸出修改過的方波形電壓。該系統包含電漿腔室，其耦接至該點以接收修改過的方波形電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a pulsed direct current (DC) source. The pulsed DC source generates a DC voltage signal. The system includes an inductor-capacitor (LC) circuit coupled to the pulsed DC source to receive the DC voltage signal to output a square waveform voltage. The system further includes a high frequency (HF) radio frequency (RF) generator that generates an RF waveform. The system includes an impedance matching circuit coupled to the HF RF generator to receive the RF waveform to output a modified RF waveform. The LC circuit is coupled to the impedance matching circuit at a point to combine the modified RF waveform with the square waveform voltage. The modified RF waveform is combined with the square waveform voltage to output a modified square waveform voltage. The system includes a plasma chamber coupled to the point to receive the modified square waveform voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:基板</p>  
        <p type="p">SW1:開關</p>  
        <p type="p">100:系統</p>  
        <p type="p">101:方波形電壓</p>  
        <p type="p">102:LC電路、LC濾波器</p>  
        <p type="p">104:脈衝DC源</p>  
        <p type="p">106:高頻RF產生器、HF RFG</p>  
        <p type="p">108:阻抗匹配電路、IMC</p>  
        <p type="p">110:電漿腔室</p>  
        <p type="p">112:主機電腦</p>  
        <p type="p">114:處理器</p>  
        <p type="p">116:記憶體裝置</p>  
        <p type="p">118:基板支持部</p>  
        <p type="p">120:上電極</p>  
        <p type="p">122:馬達和驅動器系統、驅動器和馬達系統</p>  
        <p type="p">124:DC信號、DC電壓信號</p>  
        <p type="p">126:RF波形</p>  
        <p type="p">127:間隙</p>  
        <p type="p">128:傳輸纜線</p>  
        <p type="p">130:傳輸纜線</p>  
        <p type="p">132:RF連接</p>  
        <p type="p">134:輸出</p>  
        <p type="p">136:輸入</p>  
        <p type="p">138:輸出</p>  
        <p type="p">140:RF帶</p>  
        <p type="p">142:RF輸出</p>  
        <p type="p">144:RF傳輸線</p>  
        <p type="p">146:輸入</p>  
        <p type="p">148:RF纜線</p>  
        <p type="p">150:輸出</p>  
        <p type="p">152:控制設定點信號</p>  
        <p type="p">154:控制設定點信號</p>  
        <p type="p">156:修改過的RF波形</p>  
        <p type="p">158:修改過的方波形電壓</p>  
        <p type="p">160:電壓感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="903" publication-number="202621462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造半導體裝置之方法</chinese-title>  
        <english-title>METHOD OF FABRICATING A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P76/00</main-classification>  
        <further-classification edition="202301120260223B">H10B61/00</further-classification>  
        <further-classification edition="202301120260223B">H10B63/00</further-classification>  
        <further-classification edition="202301120260223B">H10B63/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓銀洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, EUNSHOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柄徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYEUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造一半導體裝置之方法可包括在一基體上形成主動圖案。該形成該等主動圖案可包括：在該基體上形成在一第一方向上延伸且在垂直於該第一方向之一第二方向上彼此間隔開的一第一線圖案及一第二線圖案；在該第一線圖案上選擇性地形成一保護圖案；在該第一線圖案及該第二線圖案上形成一蝕刻圖案，以在與該第一方向及該第二方向交叉之一第三方向上延伸；以及移除該第二線圖案之與該蝕刻圖案重疊的一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of fabricating a semiconductor device may include forming active patterns on a substrate. The forming the active patterns may include forming a first line pattern and a second line pattern, which extend in a first direction and are spaced apart from each other in a second direction perpendicular to the first direction, on the substrate, selectively forming a protection pattern on the first line pattern, forming an etching pattern on the first and second line patterns to extend in a third direction crossing the first and second directions, and removing a portion of the second line pattern overlapped with the etching pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基體</p>  
        <p type="p">210:線圖案</p>  
        <p type="p">220:第一遮罩層</p>  
        <p type="p">310:第一保護圖案</p>  
        <p type="p">420B:蝕刻圖案</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">D4:第四方向</p>  
        <p type="p">D5:第五方向</p>  
        <p type="p">D6:第六方向</p>  
        <p type="p">D7:第七方向</p>  
        <p type="p">D8:第八方向</p>  
        <p type="p">D-D',E-E':線</p>  
        <p type="p">OP1:第一開口</p>  
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;,θ&lt;sub&gt;2&lt;/sub&gt;,θ&lt;sub&gt;3&lt;/sub&gt;:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="904" publication-number="202620014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機酸鹽的製造方法及鈣鈦礦型複合氧化物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C07C51/41</main-classification>  
        <further-classification edition="200601120260210B">C01G23/00</further-classification>  
        <further-classification edition="200601120260210B">C07C55/06</further-classification>  
        <further-classification edition="200601120260210B">C07F7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON CHEMICAL INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金輪諒太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAWA, RYOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田智春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, TOMOHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中條雅門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUJO, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>国枝武久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNIEDA, TAKEHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在工業上有利地製造可獲得粒徑小且高結晶的鈣鈦礦型複合氧化物的有機酸鹽的方法。一種有機酸鹽的製造方法，將含有有機酸、A位元素化合物及B位元素化合物中的任一種的溶液（A液）、與含有所述有機酸、A位元素化合物及B位元素化合物中的、所述A液中未含有的兩種的溶液（B液）混合並使其反應，而獲得有機酸鹽，所述有機酸鹽的製造方法的特徵在於，首先，在反應容器中加入所述A液及所述B液中的其中一種溶液、以及相對於所述其中一種溶液的體積為5.0體積%～95.0體積%的粒狀介質，繼而，在所述反應容器內，一邊攪拌所述反應容器內的液體及所述粒狀介質，一邊向所述反應容器內的液體中混合所述A液及所述B液中的另一種溶液並使其反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="905" publication-number="202621239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有氧化物-氮化物-矽(ONP)架構的記憶體連接</chinese-title>  
        <english-title>MEMORY CONNECTION WITH OXIDE-NITRIDE-SILICON (ONP) SCHEME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260212B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金元柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WONJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕卡拉　瑪亨德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAKALA, MAHENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費伊　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREI, MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONG MUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供製造半導體裝置的方法。在基板上形成記憶堆疊，該堆疊包含交替的複數個矽(Si)層和複數個矽鍺(SiGe)層。該記憶堆疊包括字線接觸區和記憶陣列區。形成氧化物-氮化物-矽(ONP)堆疊，並同時對記憶陣列區和字線接觸區進行金屬替代。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of manufacturing a semiconductor device are provided. A memory stack comprising alternating layers of a plurality of silicon (Si) layers and a plurality of silicon germanium (SiGe) layers is formed on a substrate. The memory stack includes a word line contact region and a memory array region. An oxide-nitride-silicon (ONP) stack is formed and a metal replacement is used simultaneously for both the memory array region and for the word line contact region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶裝置</p>  
        <p type="p">101a:字線接觸區</p>  
        <p type="p">101b:記憶陣列區</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:記憶堆疊</p>  
        <p type="p">107:修整的矽(Si)層</p>  
        <p type="p">118:電絕緣材料</p>  
        <p type="p">122:字線金屬</p>  
        <p type="p">124:字線金屬連結</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="906" publication-number="202619843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨系統、晶圓的研磨方法以及化學機械研磨設備</chinese-title>  
        <english-title>POLISHING SYSTEM, METHOD OF POLISHING WAFER, AND CHEMICAL MECHANICAL POLISHING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251121B">B24B37/013</main-classification>  
        <further-classification edition="200601120251121B">G01B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JHIH GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙　竹軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHA, CHU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在實施例中，一種研磨系統可包括研磨平台。該研磨系統亦可包括：研磨墊，位於該研磨平台上；研磨頭，用以保持晶圓與該研磨墊接觸；電容感測器，用以在研磨製程期間量測該晶圓上的介電膜的電容；及控制器，電連接至該電容感測器。該控制器可用以基於該量測電容調整至少一個研磨參數，且當該量測電容在對應於該介電膜的靶厚度的預定範圍內時，暫停該研磨製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a polishing system may include a polishing platen. The polishing system may also include a polishing pad on the polishing platen, a polishing head configured to hold a wafer in contact with the polishing pad, a capacitive sensor configured to measure a capacitance of a dielectric film on the wafer during a polishing process, and a controller electrically connected to the capacitive sensor. The controller maybe be configured to adjust at least one polishing parameter based on the measured capacitance, and halt the polishing process when the measured capacitance is within a predetermined range corresponding to a target thickness of the dielectric film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">150:研磨系統</p>  
        <p type="p">152:研磨平台</p>  
        <p type="p">154:研磨墊</p>  
        <p type="p">156:研磨頭</p>  
        <p type="p">158:晶圓</p>  
        <p type="p">160:感測器</p>  
        <p type="p">162:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="907" publication-number="202620256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由昇華之晶體生長之生長腔室及方法</chinese-title>  
        <english-title>GROWTH CHAMBER AND METHOD FOR CRYSTAL GROWTH BY SUBLIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C30B23/06</main-classification>  
        <further-classification edition="200601120260210B">C30B29/16</further-classification>  
        <further-classification edition="200601120260210B">C30B29/36</further-classification>  
        <further-classification edition="200601120260210B">C30B29/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商水晶匠造瑞典公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XTAL.WORKS SWEDEN AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科丁拿　奧洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORDINA, OLOF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉波　卡爾　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAEPPLE, KARL-DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾馬卡維修斯　內里尤斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARMAKAVICIUS, NERIJUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王孝婉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於在一生長腔室中生長一晶體之方法，該方法(300)包括：將一晶種(180)提供(310)至該生長腔室(100)之一內部容積(110)中，其中該晶體經配置以在該晶種(180)處生長；將包括用於在該晶種(180)處生長該晶體之材料之一源材料(120)提供(320)至該內部容積(110)中，其中該源材料(120)係透氣的；使載氣(130)流動(340)通過該源材料(120)且其後至該晶種(180)；及加熱(350)該內部容積且產生一溫度梯度，由此自該源材料(120)釋放材料且允許該載氣流(130)將該釋放材料輸送至該晶種(180)，藉此在該晶種(180)處生長該晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for growing a crystal in a growth chamber, the method (300) comprises providing (310) a seed crystal (180) into an internal volume (110) of said growth chamber (100), wherein said crystal is arranged to grow at said seed crystal (180); providing (320) a source material (120) comprising material for growing said crystal at said seed crystal (180) into said internal volume (110), wherein the source material (120) is gas-permeable; flowing (340) carrier gas (130) through the source material (120) and thereafter to the seed crystal (180); and heating (350) the internal volume and generating a temperature gradient, thereby releasing material from the source material (120) and allowing the carrier gas flow (130) to transport said released material to the seed crystal (180), whereby the crystal is grown at the seed crystal (180).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">310:提供</p>  
        <p type="p">320:提供</p>  
        <p type="p">330:量測</p>  
        <p type="p">340:流動</p>  
        <p type="p">350:加熱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="908" publication-number="202620296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>渦流鼓風機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250604B">F04D23/00</main-classification>  
        <further-classification edition="200601120250604B">F04D29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立產機系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤朋生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOU, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種無需進行間隔板之變更便能調整性能之渦流鼓風機。&lt;br/&gt;本發明之渦流鼓風機中，間隔板係將配置於吸入通路側之固定間隔板與配置於噴出通路側之工作間隔板重合而構成，藉由使工作間隔板於固定間隔板上滑動，而能夠變更間隔板之形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:外殼</p>  
        <p type="p">401a:工作間隔板</p>  
        <p type="p">401b:固定間隔板</p>  
        <p type="p">402:長孔</p>  
        <p type="p">501:固定用螺絲</p>  
        <p type="p">502:工作用螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="909" publication-number="202620078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陽離子聚合之超低損耗烴樹脂組合物</chinese-title>  
        <english-title>CATIONIC POLYMERIZED ULTRA-LOW LOSS HYDROCARBON RESIN COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F212/14</main-classification>  
        <further-classification edition="200601120260223B">C08F232/08</further-classification>  
        <further-classification edition="200601120260223B">C08F4/00</further-classification>  
        <further-classification edition="200601120260223B">C09D125/02</further-classification>  
        <further-classification edition="200601120260223B">C08J5/24</further-classification>  
        <further-classification edition="200601120260223B">B32B15/08</further-classification>  
        <further-classification edition="200601120260223B">B32B15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商亨斯邁先進材料（瑞士）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯托茲　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STORZ, CHRISTOF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾默　蘇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELMER, SUSANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種組合物，其包括：(a)陽離子聚合起始劑；及(b)基於茚或基於環戊二烯之樹脂；其中該陽離子聚合起始劑係選自由以下組成之群：(i)芳香族鋶鹽基陽離子聚合起始劑；(ii)鏻鹽基陽離子聚合起始劑；(iii)四級銨鹽基陽離子聚合起始劑；(iv)鋁錯合物基陽離子聚合起始劑；(v)芳香族錪鹽基陽離子聚合起始劑；(vi)芳香族重氮鹽基陽離子聚合起始劑；(vii)吡啶鎓基陽離子聚合起始劑及(viii)其混合物。亦闡述自該組合物形成之清漆及塗層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a composition comprising: (a) a cationic polymerization initiator; and (b) an indene based or cyclopentadiene based resin; wherein the cationic polymerization initiator is selected from the group consisting of (i) an aromatic sulfonium salt-based cationic polymerization initiator; (ii) a phosphonium salt-based cationic polymerization initiator; (iii) a quaternary ammonium salt-based cationic polymerization initiator; (iv) an aluminum complex-based cationic polymerization initiator; (v) an aromatic iodonium salt-based cationic polymerization initiator; (vi) an aromatic diazonium salt-based cationic polymerization initiator; (vii) a pyridinium-based cationic polymerization initiator and (viii) a mixture thereof. Also described are varnishes and coatings formed from said composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="910" publication-number="202619974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>核殼粒子及中空粒子的製造方法、核殼粒子及中空粒子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C01B33/18</main-classification>  
        <further-classification edition="200601120260211B">C08K7/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤岡正成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIOKA, MASANARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了透過抑制實心粒子的生成和抑制粒子間的聚集或聚結，來製造粒徑分佈窄的核殼粒子和中空粒子，本發明一態樣之核殼粒子的製造方法，係在界面活性劑的存在下，將含有疏水性有機溶劑及金屬醇鹽的油相混合至由水及/或親水性有機溶劑而成的水相，來形成水包油型(O/W)乳液，而製造以溶劑為核、以金屬氧化物為殼的核殼型粒子</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="911" publication-number="202621367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件的去接合方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE DEBONDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="201401120260223B">B23K26/36</further-classification>  
        <further-classification edition="201401120260223B">B23K26/50</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石哲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHE CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包含接收第一元件部件、接收第二元件部件以及接合第一元件部件的半導體層堆疊與第二元件部件以形成第一堆疊結構。第一元件部件包含設置於半導體層堆疊和第一基材之間的釋放層。第一堆疊結構包含設置於釋放層與第二元件部件之間的半導體層堆疊。方法包含於接合之後，從第一堆疊結構中移除第一基材與釋放層，並重複利用第一基材以形成第二堆疊結構。於一實施例中釋放層是二維層。二維層利於藉由剝離移除第一基材與釋放層。於另一實施例中釋放層是半導體氧化物層／區。半導體氧化物層／區利於藉由雷射處理移除第一基材與釋放層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes receiving a first device component, receiving a second device component, and bonding a semiconductor layer stack of the first device component and the second device component to form a first stacked structure. The first device component includes a release layer disposed between the semiconductor layer stack and a first substrate, and the first stacked structure includes the semiconductor layer stack disposed between the release layer and the second device component. The method includes, after the bonding, removing the first substrate and the release layer from the first stacked structure, and reusing the first substrate to form a second stacked structure. An example release layer is a two-dimensional layer, which facilitates removal of the first substrate and the release layer by peeling. Another example release layer is a semiconductor oxide layer/region, which facilitates removal of the first substrate and the release layer by laser treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">105,110,115,120,125,130:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="912" publication-number="202620553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓處理工具以及處理晶圓的方法</chinese-title>  
        <english-title>WAFER PROCESSING TOOL AND METHOD FOR PROCESSING WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G03F7/42</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅永紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, YONG HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>談建新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, JIAN XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種處理晶圓的方法。該方法包括在晶圓上的鈍化層上方，形成光阻劑層；在鈍化層中，蝕刻一開口；在鈍化層中，蝕刻此開口之後，將晶圓移入第一晶圓載具中，其中第一晶圓載具具有第一盒體及與第一盒體樞接的第一蓋體，且第一盒體及第一蓋體之其中一者具有開口；及執行第一氣體移除製程以經由第一盒體及第一蓋體之所述其中一者的開口將晶圓釋放的氣體自第一晶圓載具中移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a wafer is provided. The method includes forming a photoresist layer over a passivation layer on the wafer; etching an opening in the passivation layer; after etching the opening in the passivation layer, moving the wafer into a first wafer carrier, wherein the first wafer carrier has a first box and a first cover pivotally connected with the first box, and one of the first box and the first cover has an opening; and performing a first gas removal process to remove a gas released from the wafer away from the first wafer carrier through the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓載具</p>  
        <p type="p">200:機架</p>  
        <p type="p">210、210A~210C:機架層</p>  
        <p type="p">220:天花板</p>  
        <p type="p">230:排氣系統</p>  
        <p type="p">GF:氣流</p>  
        <p type="p">WB:晶舟</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="913" publication-number="202620071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化性組合物、固化物、聚合物和抗蝕劑用聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08F20/26</main-classification>  
        <further-classification edition="200601120260210B">C08L33/14</further-classification>  
        <further-classification edition="200601120260210B">G03F7/027</further-classification>  
        <further-classification edition="200601120260210B">G03F7/075</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大阪有機化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川菜生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種能夠用環保型的顯影液進行顯影的固化性組合物。本發明的固化性組合物的特徵在於，含有：包含具有聚氧化烯結構的重複結構單元（a1）的聚合物（A）和/或具有聚氧化烯結構的單體（B）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="914" publication-number="202619889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬複合板材</chinese-title>  
        <english-title>METAL COMPOSITE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260115B">B32B15/08</main-classification>  
        <further-classification edition="200601120260115B">B21D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳榮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃寒青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永蕙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種金屬複合板材，適於經沖壓折彎形成機殼。金屬複合板材包括金屬層、接著層及外觀裝飾層。金屬層具有第一表面、相對於第一表面的第二表面及凹陷於第一表面的凹槽。接著層，覆蓋於第二表面。外觀裝飾層覆蓋於接著層，並透過接著層貼附於金屬層。金屬複合板材經沖壓折彎所形成的機殼具有折彎導角，且折彎導角包含折彎外角與折彎內角。折彎外角處形成有正拔模角或負拔模角，且凹槽落在折彎內角處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metal composite substrate suitable for forming a casing through stamping and bending is provided. The metal composite substrate includes a metal layer, an adhesive layer, and an appearance decoration layer. The metal layer has a first surface, a second surface opposite to the first surface, and a groove recessed in the first surface. The adhesive layer covers the second surface. The appearance decoration layer covers the adhesive layer and is attached to the metal layer through the adhesive layer. The casing formed from the metal composite substrate by stamping and bending has a bending chamfer, which includes a bending outer angle and a bending inner angle. A positive draft angle or a negative draft angle is formed at the bending outer angle, and the groove is located at the bending inner angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:金屬複合板材</p>  
        <p type="p">110:金屬層</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">113:凹槽</p>  
        <p type="p">120:接著層</p>  
        <p type="p">130:外觀裝飾層</p>  
        <p type="p">131:顏色層</p>  
        <p type="p">132:紋路層</p>  
        <p type="p">200:機殼</p>  
        <p type="p">201:折彎導角</p>  
        <p type="p">201a:折彎外角</p>  
        <p type="p">201b:折彎內角</p>  
        <p type="p">201c:折彎圓心</p>  
        <p type="p">A1:角度</p>  
        <p type="p">AL1:弧長</p>  
        <p type="p">R1、R2:半徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="915" publication-number="202621240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維半導體裝置</chinese-title>  
        <english-title>THREE-DIMENSIONAL SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金慧彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓珍優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張殷碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, EUNSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金佑哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WOOCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔知勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維半導體裝置可包括：第一半導體圖案，在第一方向上彼此間隔開；第二半導體圖案，在第二方向上與第一半導體圖案間隔開且在第一方向上彼此間隔開；第一位元線，位於第一半導體圖案上；第二位元線，位於第二半導體圖案上；以及屏蔽圖案，在第二方向上位於第一位元線與第二位元線之間，其中屏蔽圖案包括第一區及第二區，第一區在第二方向上位於第一位元線與第二位元線之間，第二區中的至少一者在第一方向上位於第一區中相應的相鄰第一區之間，且第二區在第二方向上的寬度大於第一區在第二方向上的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional semiconductor device may include first semiconductor patterns spaced apart from each other in a first direction; second semiconductor patterns that are spaced apart from the first semiconductor patterns in a second direction and are spaced apart from each other in the first direction; first bit lines on the first semiconductor patterns; second bit lines on the second semiconductor patterns; and a shielding pattern between the first and second bit lines in the second direction, wherein the shielding pattern includes first regions and second regions, the first regions are between the first and second bit lines in the second direction, at least one of the second regions is between respective adjacent ones of the first regions in the first direction, and a width of the second regions in the second direction is greater than a width of the first regions in the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">A-A':線</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BL1:第一位元線</p>  
        <p type="p">BL2:第二位元線</p>  
        <p type="p">BLW:位元線配線</p>  
        <p type="p">BTR:位元線溝渠</p>  
        <p type="p">CH:通道區</p>  
        <p type="p">CIL:介電層</p>  
        <p type="p">CP:頂蓋圖案</p>  
        <p type="p">CP1:第一頂蓋圖案</p>  
        <p type="p">CP2:第二頂蓋圖案</p>  
        <p type="p">CS:胞元陣列結構</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DSP:資料儲存圖案</p>  
        <p type="p">EA1:第一邊緣部分</p>  
        <p type="p">EA2:第二邊緣部分</p>  
        <p type="p">GE:閘極電極</p>  
        <p type="p">ILD:層間絕緣層</p>  
        <p type="p">IR:插入部分</p>  
        <p type="p">LN:襯墊圖案</p>  
        <p type="p">PE:板狀電極</p>  
        <p type="p">SE:儲存電極</p>  
        <p type="p">SH:屏蔽圖案</p>  
        <p type="p">SP:半導體圖案</p>  
        <p type="p">SP1:第一半導體圖案</p>  
        <p type="p">SP2:第二半導體圖案</p>  
        <p type="p">ST1:第一堆疊結構</p>  
        <p type="p">ST2:第二堆疊結構</p>  
        <p type="p">UIL:上部絕緣層</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="916" publication-number="202620133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波長轉換像素膜、及包括其之顯示裝置</chinese-title>  
        <english-title>WAVELENGTH CONVERTING PIXEL FILMS, AND DISPLAY DEVICES INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C09B57/08</main-classification>  
        <further-classification edition="200601120260211B">C09K11/06</further-classification>  
        <further-classification edition="200601120260211B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郑世俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, SHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢默克　傑弗瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMAKER, JEFFREY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述一種波長轉換像素膜組合物及/或含有該組合物之膜，該膜具有改良的量子效率及色域。該波長轉換像素膜組合物及/或膜包括膜介質、藍光吸收化合物及至少一種光致發光染料，該光致發光染料包括藍光吸收部分及光致發光染料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein is a wavelength converting pixel film composition and/or a film containing the same that has improved quantum efficiency and color gamut. The wavelength converting pixel film composition and/or film includes a film media, a blue light absorbing compound, and at least one photoluminescent dye, the photoluminescent dye including a blue absorbing moiety, and a photoluminescent dye.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="917" publication-number="202620240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於金屬基板化學預處理之包含以胺基酸為主之共聚物的組合物</chinese-title>  
        <english-title>AMINO ACID-BASED COPOLYMER COMPRISING COMPOSITION FOR USE IN CHEMICAL PRETREATMENT OF METALLIC SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">C23C22/05</main-classification>  
        <further-classification edition="200601120260212B">C09D5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商開麥妥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMETALL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基爾弗拉　納瓦勒　蘇爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHELFALLAH, NAWEL SOUAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅特爾　諾丁　海倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROTHER-NOEDING, HELEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科瑟布格　沙巴斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLTZENBURG, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威特勒　賀爾幕特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WITTELER, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種化學預處理之方法，其包括至少步驟1)，亦即，使至少一個基板之至少一個金屬表面至少部分地與水性組合物AC接觸，該組合物AC適合於至少部分地形成塗層膜於該表面上，其中，除了水之外，AC包含至少成分a1)及a2)，亦即，作為成分a1)之鋯、鈦及鉿陽離子中之至少一者，及作為成分a2)之至少一種共聚物，其係可至少從(i)至少一種包含至少一個一級胺基及/或至少兩個二級胺基之胺基酸與(ii)至少一種包含至少兩個烯系不飽和基團之成分之反應獲得；一種可藉由此方法獲得之經化學預處理基板；該水性組合物AC本身；一種可用於其製備之濃縮物；一種組合物AC於提供或改良腐蝕保護及/或黏著之用途；一種塗覆前述經化學預處理基板之方法；及一種可藉由該方法獲得之經塗覆基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method of chemical pretreatment comprising at least step 1), i.e., contacting at least one metallic surface of at least one substrate at least in portion with an aqueous composition AC being suitable to form a coating film at least in portion onto said surface, wherein AC comprises, besides water, at least constituents a1) and a2), i.e., at least one of zirconium, titanium and hafnium cations as constituent a1), and at least one copolymer, which is obtainable at least from reaction of (i) at least one amino acid comprising at least one primary amino group and/or at least two secondary amino groups with (ii) at least one constituent comprising at least two ethylenically unsaturated groups, as constituent a2), to a chemically pretreated substrate obtainable by this method, to the aqueous composition AC as such, to a concentrate usable for its preparation, to a use of composition AC for providing or improving corrosion protection and/or adhesion, to a method of coating an aforementioned chemically pretreated substrate, and to a coated substrate obtainable by said method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="918" publication-number="202619657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>特別是用於飲料的施配裝置以及特別是水龍頭的水分配裝置</chinese-title>  
        <english-title>DISPENSING DEVICE, IN PARTICULAR FOR BEVERAGES AND WATER DISTRIBUTING DEVICE, IN PARTICULAR FAUCET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A47J31/06</main-classification>  
        <further-classification edition="200601120260202B">A47J31/34</further-classification>  
        <further-classification edition="200601120260202B">E03C1/01</further-classification>  
        <further-classification edition="200601120260202B">E03C1/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商吉賽公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GESSI S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉賽　吉安　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GESSI, GIAN LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供用於自用於施配飲料之容器提取之飲料的施配裝置(108)，其較佳地組配來且特別地指定來耦接至用於水施配之一水龍頭(100)；&lt;br/&gt; 用於飲料之該施配裝置(108)包含：&lt;br/&gt;     一支撐本體(108b)；&lt;br/&gt;     一分配本體(108a)，其連接至該支撐本體(108b)且包含組配來允許施配一飲料之一施配部分(109)；&lt;br/&gt; 其中：&lt;br/&gt;     該支撐本體(108b)與該分配本體(108a)中之至少一者組配來保持及/或容納用於施配飲料之一容器(190)之至少一部分；&lt;br/&gt;     該支撐本體(108b)包含組配來從一供應管道(107)接收水之一水供應入口(122)；&lt;br/&gt;     該施配裝置(108)包含至少一個流量控制元件(400)，其以操作方式連接至該支撐本體(108b)且在使用中自該供應管道(107)接收水；&lt;br/&gt; 該流量控制元件(400)具有由該水供應入口(122)供應之至少一個第一入口及組配來將水供應至該支撐本體(108b)及/或該分配本體(108a)之至少一個第一出口(401)，&lt;br/&gt; 並且其中該流量控制元件(400)組配來根據該水之至少一個特性、較佳地為溫度所取的至少一個值來選擇性地允許或阻止朝向用於施配飲料之該容器(190)的水供應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Dispensing device (108) for beverages extracted from containers for dispensing beverages, preferably configured to, and specifically destined to, be coupled to a faucet (100) for water dispensing;&lt;br/&gt; the dispensing device for beverages (108) comprising:&lt;br/&gt; - a supporting body (108b);&lt;br/&gt; - a distributing body (108a) connected to said supporting body (108b) and comprising a dispensing portion (109) configured to allow a dispensing of a beverage;&lt;br/&gt; wherein:&lt;br/&gt; - at least one between said supporting body (108b) and said distributing body (108a) is configured to retain and/or contain at least part of a container for dispensing beverages (190);&lt;br/&gt; - said supporting body (108b) comprises a water supplying inlet (122) configured to receive water from a supplying duct (107);&lt;br/&gt; - said dispensing device (108) comprises at least one flow control element (400) operatively connected to said supporting body (108b), and receiving in use water from said supplying duct (107);&lt;br/&gt; said flow control element (400) having at least one first inlet supplied by said water supplying inlet (122) and at least one first outlet (401) configured to supply water to said supporting body (108b) and/or to said distributing body (108a),&lt;br/&gt; and wherein said flow control element (400) is configured to selectively allow or prevent the water supply toward said container for dispensing beverages (190) according to at least one value assumed by at least one characteristic, preferably the temperature, of said water.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">107:供應管道/入口管道</p>  
        <p type="p">108a:分配本體</p>  
        <p type="p">108b:支撐本體</p>  
        <p type="p">109:施配部分</p>  
        <p type="p">118:保持器/翼片</p>  
        <p type="p">119:保持器</p>  
        <p type="p">122:水供應入口/液體供應入口</p>  
        <p type="p">190:用於施配飲料之容器</p>  
        <p type="p">199:排放管道</p>  
        <p type="p">400:流量控制元件</p>  
        <p type="p">401:第一出口</p>  
        <p type="p">404:資料處理單元</p>  
        <p type="p">405:感測器</p>  
        <p type="p">408:控制閥</p>  
        <p type="p">409:溫度感測器</p>  
        <p type="p">410:泵</p>  
        <p type="p">411:單向閥</p>  
        <p type="p">412:儲罐</p>  
        <p type="p">413:熱敏電阻器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="919" publication-number="202621495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W46/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="202001120260223B">G01R31/26</further-classification>  
        <further-classification edition="200601120260223B">G01R1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭明眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, MYUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珍圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭銀國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, EUNGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙槿彙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KEUN HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許琇行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, SUHAENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括具有前表面及後表面的基板。所述裝置包括第一電晶體，所述第一電晶體設置於基板的前表面上且包括第一閘極電極以及相鄰於第一閘極電極設置的第一源極/汲極圖案。所述裝置包括前表面虛設堆疊結構，所述前表面虛設堆疊結構設置於第一電晶體上且電性浮置，前表面虛設堆疊結構自下端部延伸至上端部，下端部與第一電晶體間隔開。前表面虛設堆疊結構包括交替堆疊的前表面虛設通孔前表面虛設配線，所述前表面虛設通孔前表面虛設配線與第一閘極電極交疊以使得在第一電晶體中產生的熱量經由所述多個前表面虛設通孔及所述多條前表面虛設配線而被傳遞至前表面虛設堆疊結構的上端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate having a front surface and a rear surface. The device includes a first transistor disposed on the front surface of the substrate and including a first gate electrode and first source/drain patterns disposed adjacent to the first gate electrode. The device includes a front surface dummy stack structure disposed on the first transistor and electrically floated, the front surface dummy stack structure extending from a lower end to an upper end, the lower end being spaced apart from the first transistor. The front surface dummy stack structure includes alternately stacked front surface dummy vias front surface dummy wires that overlap the first gate electrode such that heat generated in the first transistor is transferred to the upper end of the front surface dummy stack structure through the plurality of front surface dummy vias and the plurality of front surface dummy wires.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">100B:後表面</p>  
        <p type="p">120:第二層間絕緣層</p>  
        <p type="p">160:下部絕緣層</p>  
        <p type="p">200:支撐基板</p>  
        <p type="p">210:接合絕緣層</p>  
        <p type="p">1000:半導體裝置</p>  
        <p type="p">1000B:下表面</p>  
        <p type="p">1000F:上表面</p>  
        <p type="p">AC:主動接觸件</p>  
        <p type="p">BDS:後表面虛設堆疊結構</p>  
        <p type="p">BI:後表面絕緣層</p>  
        <p type="p">BI(B):最下部後表面絕緣層</p>  
        <p type="p">BSC:後表面接觸件</p>  
        <p type="p">BT:後表面配線</p>  
        <p type="p">BT(B):最下部後表面配線</p>  
        <p type="p">BT(P1):電源配線/最上部後表面配線</p>  
        <p type="p">BT(U):最上部後表面配線</p>  
        <p type="p">BV:後表面通孔</p>  
        <p type="p">BWL(1):後表面配線層/第一後表面配線層</p>  
        <p type="p">BWL(2):後表面配線層/第二後表面配線層</p>  
        <p type="p">BWL(K-1):第K-1後表面配線層</p>  
        <p type="p">BWL(K):第K後表面配線層</p>  
        <p type="p">D1:第一方向/長度方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DB:分隔結構</p>  
        <p type="p">DT1:前表面虛設配線</p>  
        <p type="p">DT2:後表面虛設配線</p>  
        <p type="p">DV1:前表面虛設通孔</p>  
        <p type="p">DV2:後表面虛設通孔</p>  
        <p type="p">FDS:前表面虛設堆疊結構</p>  
        <p type="p">FI:前表面絕緣層</p>  
        <p type="p">FT:前表面配線</p>  
        <p type="p">FT(B):最下部前表面配線</p>  
        <p type="p">FT(U):最上部前表面配線</p>  
        <p type="p">FV:前表面通孔</p>  
        <p type="p">FV(U):最上部前表面通孔</p>  
        <p type="p">FWL(1):前表面配線層/第一前表面配線層/最下部第一前表面配線層</p>  
        <p type="p">FWL(2):前表面配線層/第二前表面配線層</p>  
        <p type="p">FWL(3):前表面配線層/第三前表面配線層</p>  
        <p type="p">FWL(J-1):第j-1前表面配線層</p>  
        <p type="p">FWL(J):第j前表面配線層/最上部第j前表面配線層</p>  
        <p type="p">GC:閘極接觸件</p>  
        <p type="p">GE1:閘極電極/第一閘極電極</p>  
        <p type="p">GE2:閘極電極/第二閘極電極</p>  
        <p type="p">MRS1:配線結構/第一配線結構</p>  
        <p type="p">MRS2:配線結構/第二配線結構</p>  
        <p type="p">MRS3:配線結構/第三配線結構</p>  
        <p type="p">OB:外部連接端子</p>  
        <p type="p">P1、P2:區域</p>  
        <p type="p">SD11:源極/汲極圖案/第十一源極/汲極圖案</p>  
        <p type="p">SD12:源極/汲極圖案/第十二源極/汲極圖案</p>  
        <p type="p">SD21:源極/汲極圖案/第二十一源極/汲極圖案</p>  
        <p type="p">SD22:源極/汲極圖案/第二十二源極/汲極圖案</p>  
        <p type="p">TR1:電晶體/第一電晶體</p>  
        <p type="p">TR2:電晶體/第二電晶體</p>  
        <p type="p">TV:貫穿孔</p>  
        <p type="p">UIP:上部絕緣圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="920" publication-number="202621280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與形成半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251107B">H10D30/60</main-classification>  
        <further-classification edition="202501120251107B">H10D30/62</further-classification>  
        <further-classification edition="202501120251107B">H10D62/10</further-classification>  
        <further-classification edition="202501120251107B">H10D62/80</further-classification>  
        <further-classification edition="202501120251107B">H10D64/20</further-classification>  
        <further-classification edition="200601120251107B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江育賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">形成半導體裝置的方法包括：藉由依序地形成介電材料、犧牲材料、第一半導體材料及第二半導體材料於鰭片上而在鰭片上形成層堆疊；在層堆疊上形成虛設閘極結構；在虛設閘極結構之相對側上形成源極/汲極區；在虛設閘極結構周圍在源極/汲極區上形成層間介電層；移除虛設閘極結構以暴露層堆疊的第一部分；在移除虛設閘極結構之後，選擇性地移除層堆疊之第一部分中的犧牲材料，其中在選擇性地移除之後，層堆疊之第一部分中的第一半導體材料及第二半導體材料分別形成第一通道層及第二通道層；及圍繞第一通道層及第二通道層形成替換閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a semiconductor device includes: forming a layer stack over a fin by successively forming a dielectric material, a sacrificial material, a first semiconductor material, and a second semiconductor material over the fin; forming a dummy gate structure over the layer stack; forming source/drain regions on opposing sides of the dummy gate structure; forming an inter-layer dielectric layer over the source/drain regions around the dummy gate structure; removing the dummy gate structure to expose a first portion of the layer stack; after removing the dummy gate structure, selectively removing the sacrificial material in the first portion of the layer stack, where after the selectively removing, the first semiconductor material and the second semiconductor material in the first portion of the layer stack form a first channel layer and a second channel layer, respectively; and forming a replacement gate structure around the first and the second channel layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">53:層/第一半導體材料/奈米結構</p>  
        <p type="p">54:層/第二半導體材料/奈米結構</p>  
        <p type="p">55:內部間隔物</p>  
        <p type="p">99:區</p>  
        <p type="p">100:奈米結構場效電晶體(NSFET)裝置</p>  
        <p type="p">108:閘極間隔物層/閘極間隔物</p>  
        <p type="p">112:源極/汲極區</p>  
        <p type="p">114:層間介電質(ILD)</p>  
        <p type="p">116:觸點蝕刻終止層(CESL)</p>  
        <p type="p">118:閘極觸點插塞</p>  
        <p type="p">119:源極/汲極觸點插塞</p>  
        <p type="p">120:閘極介電層/閘極介電材料</p>  
        <p type="p">122:閘極電極/閘極電極材料</p>  
        <p type="p">123:替換閘極結構</p>  
        <p type="p">130:前側互連結構</p>  
        <p type="p">131:通孔</p>  
        <p type="p">132:導電特徵</p>  
        <p type="p">132P:導電特徵</p>  
        <p type="p">134:蝕刻終止層(ESL)</p>  
        <p type="p">135:第二層間介電質(ILD)</p>  
        <p type="p">136:介電層</p>  
        <p type="p">136T:介電層</p>  
        <p type="p">138:閘極遮罩</p>  
        <p type="p">142:裝置層</p>  
        <p type="p">143:介電材料</p>  
        <p type="p">145:蝕刻終止層(ESL)</p>  
        <p type="p">147:襯裡層</p>  
        <p type="p">150:虛線</p>  
        <p type="p">151:背側互連結構</p>  
        <p type="p">200:奈米結構場效電晶體(NSFET)裝置</p>  
        <p type="p">300:互補場效電晶體(CFET)裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="921" publication-number="202621080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用記憶體修復資料及環形振盪器之協同物理不可複製函數(PUF)</chinese-title>  
        <english-title>SYNERGISTIC PHYSICAL UNCLONABLE FUNCTION (PUF) USING MEMORY REPAIR DATA AND RING OSCILLATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">H04L9/32</main-classification>  
        <further-classification edition="200601120260204B">H04L9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽普拉斯半導體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYPRESS SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　盛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, SENWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種物理不可複製函數（PUF）裝置。該PUF裝置包含環形振盪器。每一個環形振盪器基於輸入質詢產生振盪訊號。PUF裝置進一步包含計數器。每一個計數器將對應環形振盪器產生的振盪訊號中的振盪次數進行計數，且產生表示振盪次數計數的計數器值。PUF裝置可進一步包含比較器。每一個比較器將計數器值與中位計數器值進行比較，且產生結果值。PUF裝置進一步包含回應產生器，其基於結果值產生第一回應。第一回應可包含位址，該位址用於索引至記憶體裝置中以從記憶體裝置讀取PUF資料及記憶體修復資料。PUF裝置進一步包含PUF輸出產生器，其基於PUF資料及記憶體修復資料產生第二回應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A physical unclonable function (PUF) device is disclosed. The PUF device includes ring oscillators. Each ring oscillator generates an oscillating signal based on an input challenge. The PUF device further includes counters. Each counter counts a number of oscillations in an oscillating signal generated by a corresponding ring oscillator, and produce a counter value representing the counted number of oscillations. The PUF device further includes comparators. Each comparator compares a counter value with a median counter value, and produce a resulting value. The PUF device further includes a response generator that generates a first response based on the resulting values. The first response includes an address used to index into a memory device to read PUF data and memory repair data from the memory device. The PUF device further includes a PUF output generator that generates a second response based on the PUF data and the memory repair data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:過程</p>  
        <p type="p">410、420、430、440、450:步驟</p>  
        <p type="p">PUF:物理不可複製函數</p>  
        <p type="p">SRAM:靜態隨機存取記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="922" publication-number="202620033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>供ALD應用之金屬化合物</chinese-title>  
        <english-title>METAL COMPOUNDS FOR ALD APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C07F17/00</main-classification>  
        <further-classification edition="200601120260213B">C23C16/18</further-classification>  
        <further-classification edition="200601120260213B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾曼　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHLMANN, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克菲爾德　安德烈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERKEFELD, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　簡　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WREE, JAN-LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖里　馬克　馬賽羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATURI, MARK MARCELLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海爾　霍格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIL, HOLGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於鉻、鉬及鎢錯合物及特定而言藉由原子層沈積(ALD)使用該等錯合物作為前體沈積含金屬膜之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to chromium, molybdenum and tungsten complexes and a method of using these complexes as precursors for deposition of metal containing films, in particular by atomic layer deposition (ALD).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="923" publication-number="202620632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生針對記憶體內操作的記憶體內處理請求之方法及其相關非暫態電腦可讀儲存媒體、以及用於記憶體內處理之電子裝置與方法</chinese-title>  
        <english-title>METHOD OF GENERATING PROCESSING-IN-MEMORY (PIM) REQUEST FOR IN-MEMORY OPERATION AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM ASSOCIATED THEREWITH, AND ELECTRONIC DEVICE AND METHOD FOR PIM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251103B">G06F9/44</main-classification>  
        <further-classification edition="200601120251103B">G06F13/14</further-classification>  
        <further-classification edition="201601120251103B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白允雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAIK, YOONAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車相薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於記憶體內處理(PIM)之方法及設備。一種產生針對一記憶體內操作的一PIM請求之方法包括：自一處理器接收用於產生一PIM請求之組態資訊；基於該組態資訊自一命令表獲得關於一PIM請求命令之資訊；以及基於該關於一PIM請求命令之資訊產生一PIM請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus for processing-in-memory (PIM) are disclosed. A method of generating a PIM request for an in-memory operation includes receiving configuration information for generating a PIM request from a processor, obtaining information about a PIM request command from a command table, based on the configuration information, and generating a PIM request based on the information about a PIM request command.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:PIM請求產生模組/PIM請求產生器</p>  
        <p type="p">130:記憶體控制器</p>  
        <p type="p">140:PIM記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="924" publication-number="202621395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有關半導體製造程序之處理器實施方法與相關聯非暫態電腦可讀記錄媒體，及電子裝置</chinese-title>  
        <english-title>PROCESSOR-IMPLEMENTED METHOD WITH RESPECT TO SEMICONDUCTOR MANUFACTURING PROCESS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM ASSOCIATED THEREWITH, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P70/00</main-classification>  
        <further-classification edition="202001120260223B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李載原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAEWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權男暎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, NAMYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種系統、裝置及方法。該方法包括：使用一第一模型，基於關於複數個因素之第一資料而估計第一晶圓之個別第一產率，該等複數個因素關於與該等複數個第一晶圓有關之一半導體製造程序，該第一資料係在該等複數個第一晶圓之該半導體製造程序已完成之前獲得；使用基於該第一模型產生之一第二模型，基於該第一資料、關於該等複數個第一晶圓之所估計之個別第一產率的資料、關於與該半導體製造程序已完成之複數個第二晶圓有關之該等複數個因素的第二資料而產生該等複數個因素之個別產率貢獻值；以及基於該等複數個因素之所產生之個別產率貢獻值而判定該等複數個因素當中貢獻於一產率減小的一或多個因素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a system, device, and method. The method includes estimating, using a first model, respective first yields of first wafers based on first data on a plurality of factors about a semiconductor manufacturing process regarding the plurality of first wafers, the first data obtained before the semiconductor manufacturing process of the plurality of first wafers has been completed, generating, using a second model generated based on the first model, respective yield contribution values of the plurality of factors based on the first data, data on the estimated respective first yields of the plurality of first wafers, second data on the plurality of factors regarding a plurality of second wafers of which the semiconductor manufacturing process has completed, and determining one or more factors, among the plurality of factors, that contribute to a yield reduction based on the generated respective yield contribution values of the plurality of factors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">300:使用者終端機</p>  
        <p type="p">S310,S315,S320,S325,S330,S335,S340,S345,S350,S355,S360,S365:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="925" publication-number="202621296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊裝置結構及其製造方法</chinese-title>  
        <english-title>STACKED DEVICE STRUCTURES AND METHODS OF FABRICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D64/20</main-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種堆疊裝置結構(諸如堆疊電晶體)的閘極堆疊及其製造方法，方法包括在基板上方形成半導體層堆疊。半導體層堆疊包括設置在第二半導體層上方的第一半導體層。方法進一步包括在第二半導體層周圍形成第一類型之金屬閘極層。方法進一步包括在第一類型之金屬閘極層上方形成含鋁隔離層之後，在第一半導體層周圍及含鋁隔離層上方形成第二類型之金屬閘極層。方法進一步包括在形成含鋁隔離層之前，從第一類型之金屬閘極層上方移除原生金屬氧化物層。在一些實施例中，從第一類型之金屬閘極層上方移除原生金屬氧化物層包括執行基於氯的氣體處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Gate stacks for stacked device structures, such as stacked transistors, and methods of fabrication thereof are disclosed. A method includes forming a semiconductor layer stack over a substrate. The semiconductor layer stack includes a first semiconductor layer disposed over a second semiconductor layer. The method further includes forming a first type metal gate layer around the second semiconductor layer. The method further includes, after forming an aluminum-containing isolation layer over the first type metal gate layer, forming a second type metal gate layer around the first semiconductor layer and over the aluminum-containing isolation layer. In some embodiments, the method further includes removing a native metal oxide layer from over the first type metal gate layer before forming the aluminum-containing isolation layer. Removing the native metal oxide layer from over the first type metal gate layer includes performing a chlorine-based gas treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">105~165:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="926" publication-number="202620230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理用多區噴淋頭</chinese-title>  
        <english-title>MULTIZONE SHOWERHEAD FOR SEMICONDUCTOR PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/455</main-classification>  
        <further-classification edition="200601120260223B">B05B1/20</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭曈曈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, TONGTONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　普拉薩納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, PRASANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特瑟　瑞秋　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATZER, RACHEL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特瓦里　卡邁勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEWARI, KAMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淨雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宇希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　麥迪遜　魯恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MADISON WREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯茨　麥可　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTS, MICHAEL PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>考希克　拉芙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAUSHIK, LAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">以複數氣體分佈區域為特徵的多區噴淋頭，複數區域包括內區域或分區以及一或更多周邊區域或分區，第一氣體分佈埠分佈於內區域或分區及一或更多周邊區域或分區。各區域或分區內的第一氣體分佈埠可經由噴淋頭內的分開的流動路徑獲得一或更多氣體，從而允許對不同區域或分區進行分開的氣體輸送。亦可包括可選的第二氣體分佈埠，其用於氣體流動通過噴淋頭，例如從噴淋頭一側流向另一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Multi-zone showerheads featuring multiple gas distribution zones including an interior region or zone and one or more perimeter zones or regions, with first gas distribution ports distributed across both the interior region or zone and the one or more perimeter zones or regions. The first gas distribution ports in each respective zone or region may be provided one or more gases via separate flow paths internal to the showerhead, thereby allowing for segregated gas delivery to the different zones or regions. Optional second gas distribution ports may also be included that may provide for gas flow through the showerhead, e.g., from one side of the showerhead to the other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1110:主體</p>  
        <p type="p">1118:氣體分佈埠</p>  
        <p type="p">1124:氣體入口</p>  
        <p type="p">1126:氣體入口</p>  
        <p type="p">1128:冷卻劑入口</p>  
        <p type="p">1130:冷卻劑出口</p>  
        <p type="p">1132:冷卻通道</p>  
        <p type="p">1134a~b:冷卻充氣部</p>  
        <p type="p">1136a~b:流動分佈特徵部</p>  
        <p type="p">1138:橫向分佈通道</p>  
        <p type="p">1140:橫向饋送通道</p>  
        <p type="p">1152:邊緣饋送充氣部</p>  
        <p type="p">1154:分流特徵部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="927" publication-number="202620082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物、擠製成形體、吹氣成形體、轉注成形體、壓製成形體、射出成形體、被覆電線及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08F214/26</main-classification>  
        <further-classification edition="200601120260213B">C08F216/14</further-classification>  
        <further-classification edition="201901120260213B">B29C48/09</further-classification>  
        <further-classification edition="200601120260213B">B29C45/00</further-classification>  
        <further-classification edition="200601120260213B">H01B3/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田瑞菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, MIZUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田口大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGUCHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種固體組成物，其可形成能展現低著色性及低發泡性且熱重量減少率低、以及具有優異之熱老化試驗後之拉伸強度、耐折性、彎曲強度及彎曲彈性模數的成形體。&lt;br/&gt; 一種固體組成物，包含共聚物及金屬元素，前述共聚物包含以四氟乙烯為主體之單元與以全氟(烷基乙烯基醚)為主體之單元；共聚物中，相對於共聚物中所含之全部單元，以四氟乙烯為主體之單元之含量為96.10~97.10質量%，且相對於共聚物中所含之全部單元，以全氟(烷基乙烯基醚)為主體之單元之含量為2.90~3.90質量%；以共聚物之每10&lt;sup&gt;6&lt;/sup&gt;個碳數計，共聚物所具有之-CF=CF&lt;sub&gt;2&lt;/sub&gt;、-CF&lt;sub&gt;2&lt;/sub&gt;H、-COF、-COOH、-COOCH&lt;sub&gt;3&lt;/sub&gt;、-CONH&lt;sub&gt;2&lt;/sub&gt;及-CH&lt;sub&gt;2&lt;/sub&gt;OH之官能基數的合計為50個以下；遵循ASTM D1238，在溫度372℃之條件下測定之固體組成物的熔體流動速率為11.0~22.0g/10分鐘；共聚物之熔點為298.0℃以上；並且，相對於固體組成物之總質量，金屬元素之含量為0.0100~2.0000質量ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="928" publication-number="202620087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121015</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚氨酯發泡物形成性組合物、多元醇組合物、固體阻燃劑組合物、阻燃劑組合物以及聚氨酯發泡物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08G18/00</main-classification>  
        <further-classification edition="200601120260213B">C08L75/04</further-classification>  
        <further-classification edition="200601120260213B">C08J9/02</further-classification>  
        <further-classification edition="200601120260213B">C09K21/06</further-classification>  
        <further-classification edition="200601320260213B">C08G101/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東楚股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚氨酯發泡物形成性組合物，其為包含液體阻燃劑及固體阻燃劑之聚氨酯發泡物形成性組合物，其中前述固體阻燃劑包含選自由固體含磷阻燃劑、含溴阻燃劑及含硼阻燃劑所組成之群組的兩種以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="929" publication-number="202619879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶聚合物薄膜、覆金屬積層板及其製造方法、以及電路基板及多層電路基板</chinese-title>  
        <english-title>LIQUID CRYSTAL POLYMER FILM, METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B29C55/04</main-classification>  
        <further-classification edition="200601120260213B">C08J5/18</further-classification>  
        <further-classification edition="200601120260213B">B32B15/08</further-classification>  
        <further-classification edition="201901120260213B">B32B7/022</further-classification>  
        <further-classification edition="200601120260213B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木翔真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, SHOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島崇裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中和幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種與金屬片積層而作成覆金屬積層板時，能夠製造外觀優異，力學物性的各向同性優異的覆金屬積層板之液晶聚合物薄膜。前述液晶聚合物薄膜係機械方向的拉伸伸長率&lt;sub&gt;MD&lt;/sub&gt;與橫向方向的拉伸伸長率&lt;sub&gt;TD&lt;/sub&gt;的比(拉伸伸長率&lt;sub&gt;MD&lt;/sub&gt;/拉伸伸長率&lt;sub&gt;TD&lt;/sub&gt;)為0.5以上1.0以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a liquid crystal polymer film which enables a production of a metal-clad laminate having excellent appearance and isotropic mechanical properties when laminated with a metal sheet. The liquid crystal polymer film has a ratio (tensile elongation MD / tensile elongation TD) of a tensile elongation in a machine direction MD to a tensile elongation in a transverse direction TD of 0.5 or more and 1.0 or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:捲出輥</p>  
        <p type="p">2:捲取輥</p>  
        <p type="p">3,4,5,6,7:加熱輥</p>  
        <p type="p">8:前驅物薄膜</p>  
        <p type="p">9,10:導輥</p>  
        <p type="p">11:液晶聚合物薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="930" publication-number="202620944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋰二次電池用正極活性物質、鋰二次電池用正極活性物質之製造方法及鋰二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H01M4/36</main-classification>  
        <further-classification edition="201001120260213B">H01M4/525</further-classification>  
        <further-classification edition="202501120260213B">C01G51/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON CHEMICAL INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, NAOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於用作鋰二次電池的正極活性物質時可賦予優異的高溫保管特性且可降低阻抗的鋰二次電池用正極活性物質之製造方法。一種鋰二次電池用正極活性物質之製造方法，其特徵在於具有：第一混合步驟，將鋰化合物、鈷化合物、及鋁化合物混合而獲得第一混合物；第一煆燒步驟，對所述第一混合物進行煆燒，獲得鋁至少固溶並存在於粒子的內部的含鋁鋰鈷複合氧化物粒子作為第一煆燒物；以及第二混合步驟，將於所述第一煆燒步驟中所獲得的所述第一煆燒物與作為無機氟化物粒子的MgF&lt;sub&gt;2&lt;/sub&gt;及AlF&lt;sub&gt;3&lt;/sub&gt;乾式混合，獲得正極活性物質作為第二混合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="931" publication-number="202620118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理無機粒子、包含其之樹脂複合組成物、及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08K9/04</main-classification>  
        <further-classification edition="200601120260213B">C09C3/10</further-classification>  
        <further-classification edition="200601120260213B">C01B33/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沼尾龍太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUMAO, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木皇遙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAKI, KOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂下良介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKASHITA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐川祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀口知也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIGUCHI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種新穎之表面處理無機粒子，該表面處理不同於先前之利用矽烷偶合劑或矽烷劑之表面處理。&lt;br/&gt; 本發明之表面處理無機粒子之特徵在於：藉由X射線光電子光譜法(XPS)進行測定時，以每單位比表面積計，&lt;br/&gt; 歸屬於C1s之峰之峰值強度c與歸屬於Al2p之峰之峰值強度al的峰值強度比al/c為0.010～0.500，&lt;br/&gt; 歸屬於C1s之峰之峰值強度c與歸屬於Si2p之峰之峰值強度si的峰值強度比si/c為0.010～0.300，或者&lt;br/&gt; 歸屬於C1s之峰之峰值強度c與歸屬於N1s之峰之峰值強度n的峰值強度比n/c為0.010～0.250，&lt;br/&gt; 平均粒徑為0.1～180.0μm，前述比表面積為0.10～5.00m&lt;sup&gt;2&lt;/sup&gt;/g。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="932" publication-number="202620609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嵌入式觸控顯示面板</chinese-title>  
        <english-title>IN-CELL TOUCH DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F3/041</main-classification>  
        <further-classification edition="201601120260202B">G09G3/32</further-classification>  
        <further-classification edition="202501120260202B">H10H29/49</further-classification>  
        <further-classification edition="202501120260202B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張成賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃相守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙恩敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, EUN MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種嵌入式觸控顯示面板包括：第一共同電極，連接至顯示區域中的複數個第一像素；第二共同電極，連接至該顯示區域中的複數個第二像素；以及第一像素驅動器，位於該顯示區域中，並配置以將像素資料寫入該等第一像素及該等第二像素，且將電壓供應至該第一共同電極及該第二共同電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An in-cell touch display panel includes a first common electrode connected to first pixels in a display area, a second common electrode connected to second pixels in the display area, and a first pixel driver in the display area and configured to write pixel data to the first pixels and the second pixels and supply a voltage to the first common electrode and the second common electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:顯示裝置</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">BA:彎曲區域</p>  
        <p type="p">NA:非顯示區域</p>  
        <p type="p">NA1:第一非顯示區域</p>  
        <p type="p">NA2:第二非顯示區域</p>  
        <p type="p">PAD:焊墊部</p>  
        <p type="p">PX:像素</p>  
        <p type="p">TG1,TG2,TG3,TG4,TG(n),TG(n+1),TG(n+2),TG(n+3):觸控群</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="933" publication-number="202621396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於清潔半導體晶圓的裝置、系統和方法</chinese-title>  
        <english-title>APPARATUS, SYSTEM AND METHOD FOR CLEANING SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P70/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P95/00</further-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="200601120260223B">B08B3/04</further-classification>  
        <further-classification edition="200601120260223B">B08B11/00</further-classification>  
        <further-classification edition="200601120260223B">B05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李逢滔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, FENG-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種用於清潔半導體晶圓的裝置和方法。本揭露描述了一種使用由冷卻系統產生的清潔液的清潔系統。該清潔系統包含：冷卻系統，被配置為產生清潔液以及基於第二晶圓的溫度的第二液體冷卻劑的第二流速；控制器，被配置為控制清潔液的溫度；晶圓支架，被配置為保持並旋轉晶圓；第一噴嘴，在晶圓上方並被配置為將清潔液噴灑在晶圓的頂表面上；以及第二噴嘴，在晶圓下方並被配置為將清潔液噴灑在晶圓的底表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes a cleaning system using a cleaning liquid generated by a cooling system. and a second flow rate of the second liquid coolant based on a temperature of the second die. The cleaning system includes a cooling system configured to generate a cleaning liquid, a controller configured to control a temperature of the cleaning liquid, a wafer holder configured to hold and rotate a wafer, a first nozzle above the wafer and configured to spray the cleaning liquid on a top surface of the wafer, and a second nozzle below the wafer and configured to spray the cleaning liquid on a bottom surface of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:清潔系統/冷卻系統</p>  
        <p type="p">102:晶圓支架</p>  
        <p type="p">104:晶圓</p>  
        <p type="p">106、108:噴嘴</p>  
        <p type="p">110:清潔裝置</p>  
        <p type="p">112、114、116:溫度感測器</p>  
        <p type="p">118:管道</p>  
        <p type="p">120:噴嘴</p>  
        <p type="p">122:箭頭</p>  
        <p type="p">124:清潔液</p>  
        <p type="p">126:銷釘</p>  
        <p type="p">128:箭頭</p>  
        <p type="p">130:控制器</p>  
        <p type="p">132、134:閥</p>  
        <p type="p">138:管道</p>  
        <p type="p">140:冷卻系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="934" publication-number="202620748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>指定商品檢測方法、指定商品檢測系統、及電腦程式產品</chinese-title>  
        <english-title>SPECIFIED PRODUCT DETECTION METHOD, SPECIFIED PRODUCT DETECTION SYSTEM, AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">G06Q30/018</main-classification>  
        <further-classification edition="201901120251201B">G06F16/951</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川島崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASHIMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　樹興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, THUC HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付卓奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, ZHUOQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡紘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種指定商品檢測方法、指定商品檢測系統、及電腦程式產品。 &lt;br/&gt;　　指定商品檢測方法，其中，至少一個處理器包含以下：取得複數個商品數據集，複數個商品數據集各自包含關於複數個商品的商品說明，商品說明包含關於對應之商品的含有成分的說明；取得一個以上的關鍵字，一個以上的關鍵字各自表示一個以上的指定成分；藉由對複數個商品數據集使用一個以上的關鍵字進行關鍵字檢索，從複數個商品中提取一個以上的被疑品；從一個以上的被疑品中檢測出一個以上的非含有商品；以及藉由從一個以上的被疑品中排除一個以上的非含有商品，輸出含有商品的清單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:指定商品檢測系統</p>  
        <p type="p">13:數據庫</p>  
        <p type="p">14:網路伺服器</p>  
        <p type="p">15:購買者終端</p>  
        <p type="p">16:銷售者終端</p>  
        <p type="p">17:語言模型</p>  
        <p type="p">20:指定商品檢測裝置</p>  
        <p type="p">21,31,41:處理器</p>  
        <p type="p">22,32,42:記憶體</p>  
        <p type="p">23,33,43:通信IF</p>  
        <p type="p">24,34:程式</p>  
        <p type="p">25:檢測用數據</p>  
        <p type="p">30:學習裝置</p>  
        <p type="p">35:學習數據</p>  
        <p type="p">40:作業者終端</p>  
        <p type="p">46:顯示器</p>  
        <p type="p">60:確認用畫面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="935" publication-number="202619930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將配件附接至行李架的介面及行李架組</chinese-title>  
        <english-title>INTERFACE FOR ATTACHING AN ACCESSORY TO A LUGGAGE RACK AND LUGGAGE RACK SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B62J7/08</main-classification>  
        <further-classification edition="200601120260202B">B62J7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商迪卡儂歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECATHLON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉盧茲　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILLOOTS, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德塞涅　提博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESSEIGNE, THIBAULT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒克萊克　安托萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LECLERCQ, ANTOINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮格　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種用於將配件附接至行李架之介面(100)，此附接介面包含：&lt;br/&gt; 平臺(102)，包括沿著橫向方向彼此相向且藉由至少一個橫向區段(112)彼此連接的第一及第二縱向區段(108、110)，&lt;br/&gt; 夾住手段(120)，包含至少一個佈置在第一縱向區段(108)上的第一掛鈎(122)，及至少一個佈置於第二縱向區段(110)上之第二掛鈎(124)，第一及第二掛鈎的至少一者係在關閉位置與打開位置之間可樞轉地安裝至平臺的樞軸掛鈎(124P)，&lt;br/&gt; 手段(140)，用於將樞軸掛鈎由其關閉位置致動至其打開位置，&lt;br/&gt; 手段(150)，用於鎖定樞軸掛鈎，&lt;br/&gt; 至少一個縱向平移阻擋止動件(160)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an interface (100) for attaching an accessory to a luggage rack, the attachment interface comprises:&lt;br/&gt; - a platform (102) including first and second longitudinal sections (108, 110) opposite to each other along a transverse direction and connected to each other by at least one transverse section (112),&lt;br/&gt; - a clipping means (120) comprising at least one first hook (122) arranged on the first longitudinal section (108) and at least one second hook (124) arranged on the second longitudinal section (110), at least one of the first and second hooks is a pivot hook (124P) pivotably mounted to the platform between a closed position and an open position,&lt;br/&gt; - a means (140) for actuating the pivot hook from its closed position to its open position,&lt;br/&gt; - a means (150) for locking the pivot hook,&lt;br/&gt; - at least one longitudinally translationally blocking stop (160).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:行李架組</p>  
        <p type="p">30:行李架</p>  
        <p type="p">32:第一縱向桿</p>  
        <p type="p">34:第二縱向桿</p>  
        <p type="p">36:橫向桿</p>  
        <p type="p">37:中心橫向桿</p>  
        <p type="p">100:附接介面</p>  
        <p type="p">102:平臺</p>  
        <p type="p">102A:上面</p>  
        <p type="p">102B:下面</p>  
        <p type="p">108:第一縱向區段</p>  
        <p type="p">110:第二縱向區段</p>  
        <p type="p">112:橫向區段</p>  
        <p type="p">113:中心橫向區段</p>  
        <p type="p">120:夾住手段</p>  
        <p type="p">122:第一掛鈎</p>  
        <p type="p">124:第二掛鈎</p>  
        <p type="p">124P:樞軸掛鈎</p>  
        <p type="p">126:凹形面</p>  
        <p type="p">140:手段</p>  
        <p type="p">142:把手</p>  
        <p type="p">160:手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="936" publication-number="202621410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理腔室的密封結構</chinese-title>  
        <english-title>SEALING STRUCTURES FOR PROCESSING CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="201601120260223B">F16J15/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛羅斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROSS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波奈康提　哈利Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONNEKANTI, HARI K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索爾茲　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLTZ, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於處理腔室的密封結構。例如，系統可以包括基底密封結構，以及與基底密封結構表面結合以形成密封結構的彈性體。作為另一個實例，系統可以包括處理腔室的蓋子、處理腔室的主體，以及位於蓋子與主體之間的彈性體密封結構，其中該彈性體密封結構呈帶狀並包含缺乏全氟烷基及/或多氟烷基物質（PFAS）的材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Sealing structures for processing chambers are provided. For example, a system can include a base sealing structure, and an elastomer bonded to a surface of the base sealing structure to form a sealing structure. As another example, a system can include a lid of a processing chamber, a body of processing chamber, an elastomer sealing structure located between the lid and the body, wherein the elastomer sealing structure has a ribbon shape and includes a material that lacks per- and/or polyfluoroalkyl substances (PFAS).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">202:處理腔室</p>  
        <p type="p">204:區域/處理腔室</p>  
        <p type="p">210:密封結構</p>  
        <p type="p">212:基底密封結構</p>  
        <p type="p">214:彈性體</p>  
        <p type="p">216:擴張的末端</p>  
        <p type="p">220-1:法蘭</p>  
        <p type="p">220-2:法蘭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="937" publication-number="202620056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有疏水改質纖維素纖維之組合物之保管方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08B15/00</main-classification>  
        <further-classification edition="200601120260213B">C08L1/02</further-classification>  
        <further-classification edition="200601120260213B">C08J3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大和恭平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMATO, KYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦野超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANO, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種對包含改質纖維素纖維(成分(A))、及於25℃、1氣壓下為液體之非水液體(成分(B))之組合物進行冷藏保管之方法。根據本發明，可提供一種抑制含有改質纖維素纖維之組合物之經時之黏度上升之保管方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="938" publication-number="202619841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械研磨系統、化學機械研磨器件及化學機械研磨的方法</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SYSTEM, CHEMICAL MECHANICAL POLISHING APPARATUS, AND METHOD OF CHEMICAL MECHANICAL POLISHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">B24B37/005</main-classification>  
        <further-classification edition="201201120260223B">B24B37/10</further-classification>  
        <further-classification edition="201201120260223B">B24B37/20</further-classification>  
        <further-classification edition="201201120260223B">B24B37/26</further-classification>  
        <further-classification edition="201201120260223B">B24B37/34</further-classification>  
        <further-classification edition="200601120260223B">B24B49/12</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JHIH GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包括壓板，其配置以保持研磨墊，其中研磨墊包括研磨墊之頂表面中的槽及從槽延伸至研磨墊之底表面的開口；保持器配置以將工件保持在研磨墊之上；及光學檢查裝置在壓板內，其中光學檢查裝置配置以經由研磨墊中的開口量測工件之底表面的特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a platen configured to hold a polishing pad, wherein the polishing pad includes grooves in a top surface of the polishing pad and openings extending from the grooves to a bottom surface of the polishing pad; a holder configured to hold a workpiece above the polishing pad; and optical inspection devices within the platen, wherein the optical inspection devices are configured to measure a characteristic of a bottom surface of the workpiece through the openings in the polishing pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:化學機械研磨(CMP)器件、CMP器件</p>  
        <p type="p">120:研磨機頭</p>  
        <p type="p">130:工件</p>  
        <p type="p">140:壓板</p>  
        <p type="p">141:光學檢查系統、光學偵測系統、檢查系統</p>  
        <p type="p">142:光源</p>  
        <p type="p">144:偵測器</p>  
        <p type="p">150:研磨墊</p>  
        <p type="p">152:透明子墊、子墊</p>  
        <p type="p">153:檢查孔(inspection holes)、檢查孔、連續檢查孔</p>  
        <p type="p">154:子光圈、光圈</p>  
        <p type="p">156:頂墊</p>  
        <p type="p">157:槽</p>  
        <p type="p">158:頂光圈、光圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="939" publication-number="202621496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W46/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭明眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, MYUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珍圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋寅鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, INHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁亨模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HYUNG-MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭銀國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, EUNGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺煜鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, WOOKHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙槿彙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KEUN HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置可包括：基底，包括彼此相對的前表面和後表面；設置在基底的前表面上的第一電晶體，第一電晶體包括第一閘極電極和鄰接第一閘極的兩側的第一源極/汲極圖案；第一電晶體上的第一層間絕緣層；設置在第一層間絕緣層上並連接到第一閘極電極的第一前側偵測結構；鄰接基底的後表面的第一背側偵測結構；以及連接第一前側偵測結構到第一背側偵測結構的第一穿透偵測結構。第一穿透偵測結構可包括穿透第一層間絕緣層的前側接觸件和穿透基底的一部分的第一背側接觸件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a substrate including front and rear surfaces, which are opposite to each other, a first transistor disposed on the front surface of the substrate, the first transistor including a first gate electrode and first source/drain patterns adjacent to both sides of the first gate , a first interlayer insulating layer on the first transistor, a first front-side detection structure disposed on the first interlayer insulating layer and connected to the first gate electrode, a first back-side detection structure adjacent the rear surface of the substrate, and a first penetration detection structure connecting the first front-side detection structure to the first back-side detection structure. The first penetration detection structure may include a front-side contact penetrating the first interlayer insulating layer and a first back-side contact penetrating a portion of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">110:第一層間絕緣層</p>  
        <p type="p">120:第二層間介電層</p>  
        <p type="p">160:下部絕緣層</p>  
        <p type="p">200:支撐基板</p>  
        <p type="p">210:接合絕緣層</p>  
        <p type="p">1000B:後表面</p>  
        <p type="p">1000F:前表面</p>  
        <p type="p">1000:半導體裝置</p>  
        <p type="p">AC:主動接觸件</p>  
        <p type="p">BCA1:第一背側接觸件</p>  
        <p type="p">BCA2:第二背側接觸件</p>  
        <p type="p">BDS1:第一背側偵測結構</p>  
        <p type="p">BDS2:第二背側偵測結構</p>  
        <p type="p">BI,BI(B):背側絕緣層</p>  
        <p type="p">BT,BT(P1),BT(P2),BT(U),BT(B1),BT(B2):背側線路</p>  
        <p type="p">BTS:背側互連結構</p>  
        <p type="p">BV:背側通孔</p>  
        <p type="p">BWL(1),BWL(2)~BWL(K-1),BWL(K):背側互連層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DB:分割結構</p>  
        <p type="p">FCA:前側接觸件</p>  
        <p type="p">FDS1:第一前側偵測結構</p>  
        <p type="p">FDS2:第二前側偵測結構</p>  
        <p type="p">FI:前側絕緣層</p>  
        <p type="p">FT:前側線</p>  
        <p type="p">FV:前側通孔</p>  
        <p type="p">FWL(1),FWL(2),FWL(3)~FWL(J-1),FWL(J):前側互連層</p>  
        <p type="p">GC:閘極接觸件</p>  
        <p type="p">GE,GE(1),GE(2):閘極電極</p>  
        <p type="p">LV1:第一層級</p>  
        <p type="p">LV2:第二層級</p>  
        <p type="p">LV3:第三層級</p>  
        <p type="p">LV4:第四層級</p>  
        <p type="p">LV5:第五層級</p>  
        <p type="p">OB1:第一外部連接端子</p>  
        <p type="p">OB2:第二外部連接端子</p>  
        <p type="p">P1,P2:部分</p>  
        <p type="p">SD,SD(1),SD(2):源極/汲極圖案</p>  
        <p type="p">TDS1:第一穿透偵測結構</p>  
        <p type="p">TR(1),TR(2):電晶體</p>  
        <p type="p">TV:穿透通孔</p>  
        <p type="p">UIP:上部絕緣圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="940" publication-number="202621433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括腔室和感測器之設備以及使用該設備之方法</chinese-title>  
        <english-title>APPARATUS INCLUDING A CHAMBER AND A SENSOR AND A METHOD OF USING THE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="200601120260223B">G01B11/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙克爾頓　史帝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHACKLETON, STEVEN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　炳鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, BYUNG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班柏格　賽西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAMESBERGER, SETH J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加爾文　戴維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALVIN, DAVID MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>首藤伸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHUDO, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田孝宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">設備可以包括腔室、感測器和控制器。腔室可以包括處理區，其中，該腔室可適於沿著基板支撐平面支撐工件。感測器可適於接收適於穿過處理區的輻射光束，並回應於接收輻射光束而產生訊號。輻射光束可以沿著相對於基板支撐平面呈銳角的直線進行傳播，並且感測器位於處理區之外。控制器可適於接收訊號，並回應於接收訊號而判定關於工件的定位的資訊。製造電子裝置的方法可以使用該設備以確保工件在處理腔室內時是適當定位的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus can include a chamber, a sensor, and a controller. The chamber can include a processing zone, wherein the chamber is adapted to support a workpiece along a substrate support plane. The sensor can be adapted to receive a radiation beam adapted to pass through the processing zone and generate a signal in response to receiving the radiation beam. The radiation beam can propagate along a line that is at an acute angle relative to the substrate support plane, and the sensor is outside the processing zone. The controller can be adapted to receive the signal and determine information regarding a position of the workpiece in response to receiving the signal. A method of manufacturing an electronic device can use the apparatus to ensure a workpiece is properly positioned while the workpiece is within a processing chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">622:工件</p>  
        <p type="p">642:感測器殼體</p>  
        <p type="p">644:組件</p>  
        <p type="p">646:輻射光束</p>  
        <p type="p">652:感測器殼體</p>  
        <p type="p">654:組件</p>  
        <p type="p">656:輻射光束</p>  
        <p type="p">662:感測器殼體</p>  
        <p type="p">664:組件</p>  
        <p type="p">666:輻射光束</p>  
        <p type="p">6462:部分</p>  
        <p type="p">6464:部分</p>  
        <p type="p">6562:部分</p>  
        <p type="p">6564:部分</p>  
        <p type="p">6662:部分</p>  
        <p type="p">6664:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="941" publication-number="202620323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">F16K5/20</main-classification>  
        <further-classification edition="200601120260202B">F16K27/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本間學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONMA, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠一邊使大流量的流體流通一邊降低密封部的滑動量的技術。 &lt;br/&gt;  閥係包含在內部具有流體的流道的殼體及設成可相對於該殼體旋轉且可開閉該流道的閥體。該殼體係具有圍繞該流道的殼體密封面。該閥體係在外周部具有在會關閉該流道的閉塞位置與該殼體密封面相對向的閥體密封面。該閥體密封面係在該外周部的全周上朝向會關閉該流道的該閥體的閉塞旋轉方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">70:閥</p>  
        <p type="p">70a:流道</p>  
        <p type="p">70b:流入口</p>  
        <p type="p">70c:流出口</p>  
        <p type="p">71:殼體</p>  
        <p type="p">711:本體部</p>  
        <p type="p">712:流入筒部</p>  
        <p type="p">713:流出筒部</p>  
        <p type="p">714:平坦部</p>  
        <p type="p">715:球面部</p>  
        <p type="p">71h:貫通孔</p>  
        <p type="p">72:第1殼體</p>  
        <p type="p">72f:突緣</p>  
        <p type="p">73:第2殼體</p>  
        <p type="p">73f:突緣</p>  
        <p type="p">74:密封用管體</p>  
        <p type="p">741:內部周壁</p>  
        <p type="p">742:殼體密封面</p>  
        <p type="p">743:外部周壁</p>  
        <p type="p">74f:管體側突緣</p>  
        <p type="p">75:密封構件</p>  
        <p type="p">76:閥體</p>  
        <p type="p">761:主截斷部</p>  
        <p type="p">762:支撐壁</p>  
        <p type="p">763:旋轉軸</p>  
        <p type="p">764:外周部</p>  
        <p type="p">765:閥體密封面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="942" publication-number="202620231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高溫前驅物氣體輸送歧管</chinese-title>  
        <english-title>HIGH TEMPERATURE PRECURSOR GAS DELIVERY MANIFOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C23C16/455</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩斯布魯克　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSBRUCKER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙布藍尼　安納薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBRAMANI, ANANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法澤利　席德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAZELI, SEYYED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科特拉帕　阿倫庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTRAPPA, ARUN KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴吉納哲瑞　錢德拉什卡拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAGINAGERE, CHANDRASHEKARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑達爾　拉姆查朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDAR, RAMCHARAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑拉多斯　艾夫傑尼諾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELATOS, AVGERINOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐士堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIH YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾姆潘特　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMPANTE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩哈斯拉巴　普拉塔梅什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHASTRABUDHE, PRATHAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例係關於一種設備，包含具有氣體入口的熱塊，以及流體耦接至熱塊的氣體入口的氣體管路。在實施例中，基座耦接至熱塊，其中基座包含嵌入的通道，該通道耦接至流體入口。在實施例中，氣隙設置於熱塊的至少一部分與基座的一部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a thermal block with a gas inlet, and a gas line fluidly coupled to the gas inlet of the thermal block. In an embodiment, a base is coupled to the thermal block, where the base includes an embedded channel coupled to a fluid inlet. In an embodiment, an air gap is provided between at least a portion of the thermal block and a portion of the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:氣體輸送歧管</p>  
        <p type="p">121:熱塊</p>  
        <p type="p">122:氣體管路</p>  
        <p type="p">123:氣隙</p>  
        <p type="p">124:流體通道</p>  
        <p type="p">125:第一部分</p>  
        <p type="p">126:第二部分</p>  
        <p type="p">127:氣室</p>  
        <p type="p">128:第三部分</p>  
        <p type="p">129:密封板</p>  
        <p type="p">131:基座</p>  
        <p type="p">132:支撐柱</p>  
        <p type="p">133:中央柱</p>  
        <p type="p">134:檯面</p>  
        <p type="p">151:進口</p>  
        <p type="p">152:側壁表面</p>  
        <p type="p">153:流體進口</p>  
        <p type="p">154:轉彎</p>  
        <p type="p">161:第一部分</p>  
        <p type="p">162:第二部分</p>  
        <p type="p">163:中央開口</p>  
        <p type="p">169:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="943" publication-number="202621459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體產品依據不同狀態改變測試氣體流動路徑的溫度控制裝置</chinese-title>  
        <english-title>TEMPERATURE CONTROL DEVICE FOR SEMICONDUCTOR PRODUCTS TO CHANGE FLOW PATH OF TEST GAS BASED ON DIFFERENT STATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/20</main-classification>  
        <further-classification edition="200601120260223B">G01R31/28</further-classification>  
        <further-classification edition="200601120260223B">G05D23/185</further-classification>  
        <further-classification edition="200601120260223B">F16K1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＡＴＥＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATECO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李澤善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAEK SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金虎男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HO NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文成哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, SUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔Ｓｅ　Ｉ　Ｍｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SE I MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種溫度控制裝置，用於半導體產品，包括：推動單元，配置以相對接近用於裝載半導體產品的測試托盤並包括形成以排出測試氣體的排出口；管道單元，包括排出通道，形成以將測試氣體輸送到排出口；以及流路開閉單元，配置以在初始狀態下防止測試氣體排出到排出口，並在測試狀態下使測試氣體能夠排出到排出口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a temperature control device for a semiconductor product, including: a push unit configured to relatively approach a test tray for carrying the semiconductor product, and including a discharge port formed to discharge the test gas; a duct unit that including a discharge channel formed to deliver the test gas to the discharge port; and a flow path opening/closing unit configured to prevent the test gas from being discharged to the discharge port in an initial state, and to allow the test gas to be discharged to the discharge port in a test state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:溫度控制系統</p>  
        <p type="p">100:溫度控制裝置</p>  
        <p type="p">110:乾燥室</p>  
        <p type="p">120:循環室</p>  
        <p type="p">130:管道單元</p>  
        <p type="p">134:推動單元</p>  
        <p type="p">200:測試器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="944" publication-number="202621309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D84/85</main-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202501120260223B">H10D64/68</further-classification>  
        <further-classification edition="202601120260223B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種方法，包括以下步驟：提供基板；在基板上形成主動區域，其中主動區域包括交替堆疊的複數個第一及第二半導體層；在主動區域上形成閘極介電層；在頂部FET及底部FET的閘極介電層上形成圖案化的第一偶極材料M；以第一溫度T1對閘極介電層進行第一偶極製程；在頂部FET的閘極介電層上形成第二偶極材料M，第二偶極材料M不存在於底部FET的閘極介電層上；以第二溫度T2對閘極介電層進行第二偶極製程，第二溫度T2小於T1，且X不同於M；及在底部FET及頂部FET的閘極介電層上填充功函數金屬材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method that includes providing a substrate; forming active regions on the substrate, wherein the active regions include a plurality of first semiconductor layers and second semiconductor layers alternatively stacked; forming a gate dielectric layer on the active regions; forming a first dipole material M patterned on the gate dielectric layer of top FETs and bottom FETs; performing a first dipole process to the gate dielectric layer with a first temperature T1; forming a second dipole material M on the gate dielectric layer on the top FETs and absent from the gate dielectric layer of the bottom FETs; performing a second dipole process to the gate dielectric layer with a second temperature T2 less than T1 and X being different from M; and filling a work function metal material on the gate dielectric layer of both the bottom FETs and the top FETs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1026:方法</p>  
        <p type="p">1030,1052,1054,1056,1058,1060,1062,1064:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="945" publication-number="202619997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電波穿透體及窗材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C03C17/36</main-classification>  
        <further-classification edition="200601120260202B">E06B3/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤木良教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAGI, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野本博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野谷健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOYA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕨野智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARABINO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福山進二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUYAMA, SHINJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高窗材之電波穿透性。本發明係一種電波穿透體4，其係配置於窗材1之表面之透光性電波穿透體，上述窗材1具備透明板2及積層於透明板之金屬層3，上述電波穿透體4具備導電層41及支持導電層之基材層43，導電層41以具有非導電區域42C、包圍區域42C之導電區域41、及包圍區域41之非導電區域42A、42B之圖案週期性地縱橫配置有複數個，區域41之寬度W為將區域42C之對向之兩邊連結之線段PB、與將區域42A之對向之兩邊連結之線段PA之差之一半，寬度W與區域41間之間隔之一半即GAP/2之組合為W為1.2 mm以上7.4 mm以下且GAP/2為1.2 mm以上2.9 mm以下之組合、或W為11.9 mm以上21.0 mm以下且GAP/2為0.5 mm以上5.5 mm以下之組合，頻率為1 GHz之入射電波穿透上述電波穿透體4後的電波強度大於0 dB。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:電波穿透體(超穎表面膜)</p>  
        <p type="p">41:導電層</p>  
        <p type="p">42A:非導電區域(第2非導電區域)</p>  
        <p type="p">42B:非導電區域(第2非導電區域)</p>  
        <p type="p">42C:非導電區域(第1非導電區域)</p>  
        <p type="p">43:基材層</p>  
        <p type="p">45:保護膜</p>  
        <p type="p">A:部分</p>  
        <p type="p">GAP:間隔</p>  
        <p type="p">PA:線段(第2線段)</p>  
        <p type="p">PB:線段(第1線段)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="946" publication-number="202619661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬桶座裝置及具備該馬桶座裝置之馬桶裝置</chinese-title>  
        <english-title>TOILET SEAT DEVICE AND TOILET DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A47K13/24</main-classification>  
        <further-classification edition="200601120260209B">E03D9/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大林恒心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBAYASHI, KOSHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大賀荘平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井翔大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, SANEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種不易於馬桶座表面產生水垢之馬桶座裝置、及具備該馬桶座裝置之馬桶裝置。馬桶座裝置（1），具備馬桶座（3）、馬桶蓋（4）、第一送風口（50）、第二送風口（51）、送風裝置（6）、第一流路（70）、第二流路（71）、及控制部（8）。控制部（8），實行：第一步驟，使從送風裝置（6）送出之空氣，以未從第二送風口（51）排出的狀態在第一流路（70）流動而從第一送風口（50）排出，藉以使附著在馬桶座（3）的表面（31）之水滴移動；以及第二步驟，使從送風裝置（6）送出之空氣，以未從第一送風口（50）排出的狀態在第二流路（71）流動而從第二送風口（51）排出，藉以使在第一步驟移動之水滴進一步移動。&lt;u&gt;  &lt;/u&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:馬桶座</p>  
        <p type="p">31:表面</p>  
        <p type="p">31a:第一部分</p>  
        <p type="p">31b:第二部分</p>  
        <p type="p">32:頂面</p>  
        <p type="p">5:送風口</p>  
        <p type="p">5a:頂面送風口</p>  
        <p type="p">50:第一送風口</p>  
        <p type="p">51:第二送風口</p>  
        <p type="p">7:流路</p>  
        <p type="p">70:第一流路</p>  
        <p type="p">71:第二流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="947" publication-number="202620222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種電漿增強化學氣相沉積之方法</chinese-title>  
        <english-title>A METHOD OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C23C16/30</main-classification>  
        <further-classification edition="200601120251218B">C23C16/52</further-classification>  
        <further-classification edition="200601120251218B">C23C16/455</further-classification>  
        <further-classification edition="200601120251218B">C23C16/505</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＳＰＴＳ科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPTS TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>客路克　凱瑟林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROOK, KATHRINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伊爾　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROYLE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯辛斯卡　艾米莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUCINSKA, EMILIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕菲特　莫莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARFITT, MOLLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電漿增強化學氣相沉積之方法，其包含以下步驟：將一晶圓在一反應器腔室內支撐在一晶圓支撐件上；使用一高頻RF電源自乙炔氣、氫氣及氬氣產生一電漿；及將一非晶氫化碳膜沉積在該晶圓上；其中在該沉積期間，反應器腔室壓力在1-6托範圍內；且其中在該沉積期間，晶圓支撐件溫度在攝氏200-350度之間；使得所沉積的該非晶氫化碳膜在該晶圓上提供一介電層，該介電層展現出在2 MV/cm之一操作電壓下小於1.0E-07 A/cm&lt;sup&gt;2&lt;/sup&gt;之低漏電流及大於6 MV/cm之一高擊穿電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method of plasma-enhanced chemical vapor deposition comprising the steps of: supporting a wafer within a reactor chamber on a wafer support; generating a plasma from acetylene, hydrogen and argon gases using a high frequency RF power supply; and depositing an amorphous hydrogenated carbon film on the wafer; wherein during the deposition the reactor chamber pressure is within the range 1-6 Torr; and wherein during the deposition the wafer support temperature is between 200-350 degrees Celsius; such that the deposited amorphous hydrogenated carbon film provides a dielectric layer on the wafer exhibiting low leakage currents of less than 1.0E-07 A/cm&lt;sup&gt;2&lt;/sup&gt; at an operating voltage of 2 MV/cm and a high breakdown voltage of more than 6 MV/cm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:PECVD系統</p>  
        <p type="p">2:金屬腔室</p>  
        <p type="p">3:處理區</p>  
        <p type="p">4:鋁噴淋頭</p>  
        <p type="p">5:基板支撐件</p>  
        <p type="p">6:管道</p>  
        <p type="p">7:管道</p>  
        <p type="p">8:隔離閥</p>  
        <p type="p">9:隔離閥</p>  
        <p type="p">10:小孔</p>  
        <p type="p">11:內部氣體分配板</p>  
        <p type="p">12:排氣裝置</p>  
        <p type="p">13:環形均勻性環</p>  
        <p type="p">14:高頻RF源</p>  
        <p type="p">15:低頻RF源</p>  
        <p type="p">16:匹配單元</p>  
        <p type="p">17:匹配單元</p>  
        <p type="p">18:遠端源</p>  
        <p type="p">19:電源</p>  
        <p type="p">20:連接器</p>  
        <p type="p">21:監測裝置</p>  
        <p type="p">22:基板</p>  
        <p type="p">24:系統控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="948" publication-number="202620370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動測試樣本測量裝置及具有自動測試樣本測量裝置的材料測試系統</chinese-title>  
        <english-title>AUTOMATIC TEST SPECIMEN MEASUREMENT APPARATUS AND MATERIAL TESTING SYSTEMS HAVING AUTOMATIC TEST SPECIMEN MEASUREMENT APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G01B3/18</main-classification>  
        <further-classification edition="200601120260210B">G01B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納扎　丹尼爾詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARNAZZA, DANIEL JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法蘭西斯　赫克馬特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANCIS, HEKMAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭露的示例樣本測量裝置包括：第一測量組件，配置為沿第一方向測量第一樣本尺寸，該第一測量組件包括：沿第一方向定向的第一砧座；沿第一方向定向並配置為輸出第一測量值的第一測微計；第一致動器，配置為相對於第一砧座致動第一測微計；以及第二致動器，配置為沿第一方向同時致動第一測微計和第一砧座；以及第二測量組件，配置為沿第二方向測量第二樣本尺寸，第二測量組件包括：沿第二方向定向的第二砧座；沿第二維度定向並配置為輸出第二測量值的第二測微計；以及配置為相對於第二砧座致動第二測微計的第三致動器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed example test specimen measurement apparatus include: a first measurement assembly configured to measure a first specimen dimension in a first direction, the first measurement assembly comprising: a first anvil oriented along the first direction; a first micrometer oriented along the first direction and configured to output a first measurement; a first actuator configured to actuate the first micrometer with respect to the first anvil; and a second actuator configured to actuate the first micrometer and the first anvil simultaneously along the first direction; and a second measurement assembly configured to measure a second specimen dimension in a second direction, the second measurement assembly comprising: a second anvil oriented along the second direction; a second micrometer oriented along the second dimension and configured to output a second measurement; and a third actuator configured to actuate the second micrometer with respect to the second anvil.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:材料測試系統</p>  
        <p type="p">102:材料測試機</p>  
        <p type="p">104:計算系統</p>  
        <p type="p">106:電纜</p>  
        <p type="p">108:機器人機械手</p>  
        <p type="p">110:端效器</p>  
        <p type="p">112:框架</p>  
        <p type="p">114:頂板</p>  
        <p type="p">116:底座</p>  
        <p type="p">118a:立柱</p>  
        <p type="p">118b:立柱</p>  
        <p type="p">120:活動十字頭</p>  
        <p type="p">122:固定裝置</p>  
        <p type="p">122a:下部固定裝置</p>  
        <p type="p">122b:上部固定裝置</p>  
        <p type="p">124:夾具</p>  
        <p type="p">124a:夾具</p>  
        <p type="p">124b:夾具</p>  
        <p type="p">126:測試感測器</p>  
        <p type="p">128:測試樣本</p>  
        <p type="p">130:樣本架</p>  
        <p type="p">132:測試樣本測量裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="949" publication-number="202621241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬訊號或電源線之隔離方案</chinese-title>  
        <english-title>METAL SIGNAL OR POWER LINE ISOLATION SOLUTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260203B">H10B12/00</main-classification>  
        <further-classification edition="202501120260203B">H10D1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　智君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本技術包括形成進階記憶結構及其衍生裝置的方法和系統。方法包括在一或多個特徵的第一側壁、第二側壁和底表面上形成介電材料層，其中第一側壁與第二側壁之間有間距，且底表面位於第一側壁與第二側壁之間。方法包括在第一側壁、第二側壁和底表面上的介電材料層上沉積低電阻率導電材料。方法包括用犧牲隔離材料填充在第一側壁上的低電阻率導電材料與第二側壁上的低電阻率材料之間形成的間隙。方法包括去除底表面的至少一部分，暴露出在底表面上形成的低電阻率導電材料的至少一部分，並去除犧牲隔離材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology includes methods and systems for forming advanced memory structures, and devices therefrom. Methods include forming a dielectric material layer over a first sidewall, a second sidewall, and a bottom surface, of one or more features, where the first sidewall is spaced apart from the second sidewall and the bottom surface is disposed between the first sidewall and the second sidewall. Methods include depositing a low resistivity conductive material on the dielectric material layer on the first sidewall, the second sidewall, and the bottom surface. Methods include filling a gap formed between the low resistivity conductive material on the first sidewall and the low resistivity material on the second sidewall with a sacrificial isolation material. Methods include removing at least a portion of the bottom surface, exposing at least a portion of the low resistivity conductive material formed on the bottom surface and removing the sacrificial isolation material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:半導體結構</p>  
        <p type="p">302:通道/基板材料</p>  
        <p type="p">306:介電材料</p>  
        <p type="p">308:低電阻率導電材料</p>  
        <p type="p">312:介電插塞/介電插塞材料</p>  
        <p type="p">326:間隙</p>  
        <p type="p">332:元件/方框</p>  
        <p type="p">334:第二基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="950" publication-number="202619658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有膠囊釋放技術的施配裝置</chinese-title>  
        <english-title>DISPENSING DEVICE WITH CAPSULES RELEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A47J31/06</main-classification>  
        <further-classification edition="200601120260202B">A47J31/34</further-classification>  
        <further-classification edition="200601120260202B">E03C1/04</further-classification>  
        <further-classification edition="200601120260202B">E03C1/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商吉賽公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GESSI S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉賽　吉安　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GESSI, GIAN LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於由用於施配飲料之容器萃取之飲料的施配裝置(108)，包含：&lt;br/&gt; 一支持本體(108b)；&lt;br/&gt; 一分配本體(108a)，其組配成可分離地連接該支持本體(108b)且包含組配成容許將一飲料分配較佳地在一容器(400)中之一施配部份(109)；&lt;br/&gt; 其中：&lt;br/&gt; 該支持本體(108b)包含一供水入口(122)；&lt;br/&gt; 該分配本體(108a)及/或該支持本體(108b)包含組配成可分離地扣持一用於施配飲料之容器(190)的一扣持件(118、119、119p)；&lt;br/&gt; 且其中該分配本體(108a)及/或該支持本體(108b)至少具有：&lt;br/&gt; 一第一使用組態，其中該扣持件(118、119、119p)扣持該用於施配飲料之容器(190)以容許使該水由該供水入口(122)在該用於施配飲料之容器(190)內且朝向該施配部份(109)流動來施配該飲料；及&lt;br/&gt; 一第二使用組態，其替代該第一使用組態，其中該扣持件(118、119、119p)釋放該用於施配飲料之容器(190)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Dispensing device (108) for beverages extracted from containers for dispensing beverages, comprising:&lt;br/&gt; a supporting body (108b);&lt;br/&gt; a distributing body (108a) configured to be removably connected to said supporting body (108b) and comprising a dispensing portion (109) configured to allow a distribution of a beverage, preferably in a container (400);&lt;br/&gt; wherein:&lt;br/&gt; said supporting body (108b) comprises a water supplying inlet (122);&lt;br/&gt; said distributing body (108a), and/or said supporting body (108b), comprises a retainer (118, 119, 119p) configured to removably retain a container for dispensing beverages (190);&lt;br/&gt; and wherein said distributing body (108a), and/or said supporting body (108b), has at least:&lt;br/&gt; a first use configuration wherein said retainer (118, 119, 119p) retains said container for dispensing beverages (190) to allow a dispensing of said beverage making said water flow from said water supplying inlet (122), within said container for dispensing beverages (190), and toward said dispensing portion (109), and&lt;br/&gt; a second use configuration, alternative to the first use configuration, wherein said retainer (118, 119, 119p) releases said container for dispensing beverages (190).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108f:命令元件</p>  
        <p type="p">111:結合凹部</p>  
        <p type="p">116:打擊表面</p>  
        <p type="p">118:扣持件；第一扣持元件；第二扣持元件</p>  
        <p type="p">119:扣持件；第一扣持元件；第二扣持元件</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="951" publication-number="202621299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10D84/01</main-classification>  
        <further-classification edition="202501120260223B">H10D64/01</further-classification>  
        <further-classification edition="202501120260223B">H10D84/85</further-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202501120260223B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊愷潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖均達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUN-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：形成與多層堆疊相鄰的下源極/汲極區域及上源極/汲極區域，該多層堆疊包含與半導體奈米結構交替堆疊的虛設奈米結構，該些半導體奈米結構包含下半導體奈米結構及上半導體奈米結構；移除該些虛設奈米結構；在該些下半導體奈米結構周圍形成第一閘極介電層且在該些上半導體奈米結構周圍形成第二閘極介電層；在該些第一閘極介電層及該些第二閘極介電層上方形成第一功函數金屬層；在該第一功函數金屬層上方形成第一金屬；對該第一金屬進行第一蝕刻以曝露該第一功函數金屬層；對第一功函數金屬層進行第二蝕刻以曝露該些第二閘極介電層；在該些第二閘極介電層上方形成第二功函數金屬層；及在該第二功函數金屬層上方形成第二金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a lower source/drain region and an upper source/drain region adjacent to a multi-layer stack, the multi-layer stack comprising dummy nanostructures that are alternatingly stacked with semiconductor nanostructures, the semiconductor nanostructures comprising lower semiconductor nanostructures and upper semiconductor nanostructures; removing the dummy nanostructures; forming first gate dielectrics around the lower semiconductor nanostructures and second gate dielectrics around the upper semiconductor nanostructures; forming a first work function metal layer over the first gate dielectrics and the second gate dielectrics; forming a first metal over the first work function metal layer; performing a first etch on the first metal to expose the first work function metal layer; performing a second etch on the first work function metal layer to expose the second gate dielectrics; forming a second work function metal layer over the second gate dielectrics; and forming a second metal over the second work function metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">20':半導體鰭片</p>  
        <p type="p">26L:下半導體奈米結構</p>  
        <p type="p">26U:上半導體奈米結構</p>  
        <p type="p">32:隔離區域</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">78:閘極介電層</p>  
        <p type="p">80L:下閘電極</p>  
        <p type="p">80U:上閘電極</p>  
        <p type="p">82L:下功函數金屬層</p>  
        <p type="p">84L:下縫隙填充金屬</p>  
        <p type="p">84U:上縫隙填充金屬</p>  
        <p type="p">90:閘極結構</p>  
        <p type="p">90L:下閘極結構</p>  
        <p type="p">90U:上閘極結構</p>  
        <p type="p">92:閘極遮罩</p>  
        <p type="p">104:ESL</p>  
        <p type="p">106:第三ILD</p>  
        <p type="p">108:閘極接觸件</p>  
        <p type="p">110:源極/汲極通孔</p>  
        <p type="p">116:介電層</p>  
        <p type="p">118:導電特徵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="952" publication-number="202621242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CXMT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瑞松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, RUISONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐麗華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體器件及其製備方法，半導體器件包括：襯底；共用電極結構沿第一方向迭層設置於襯底上，第一方向與襯底相交；迭層陣列結構包括第一電極結構，第一電極結構沿第一方向迭層設置於襯底上，並與同層設置的共用電極結構電連接；第一引出結構沿第一方向迭層設置並與同層設置的共用電極結構連接，第一引出結構包括相對設置的第一引出線和第一偽線；在第一方向上，不同第一引出結構的第一引出線與第一偽線交替設置；第二引出結構包括第二接觸墊和第二接觸塞，第二接觸墊與對應的第一引出線同層設置並通過對應的第一引出線與對應的共用電極結構電連接；第二接觸塞設置於第二接觸墊上，在第一方向上，第二接觸塞相互錯開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">10:半導體器件</p>  
        <p type="p">20:迭層陣列結構</p>  
        <p type="p">100:襯底</p>  
        <p type="p">200:共用電極結構</p>  
        <p type="p">300:第一電極結構</p>  
        <p type="p">400:第一引出結構</p>  
        <p type="p">401:第一引出線</p>  
        <p type="p">402:第一偽線</p>  
        <p type="p">500:第二引出結構</p>  
        <p type="p">501:第二接觸墊</p>  
        <p type="p">502:第二接觸塞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="953" publication-number="202621369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿蝕刻之方法</chinese-title>  
        <english-title>METHOD OF PLASMA ETCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＳＰＴＳ科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPTS TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡茲米　薩米拉　賓特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAZEMI, SAMIRA BINTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種對一含添加劑之氮化鋁膜進行電感耦接電漿蝕刻的方法，其中該添加劑選自鈧、釔及鉺。該方法包含將一工件置放在一電漿蝕刻室內之一基座總成上，該工件包含其上沉積有該含添加劑之氮化鋁膜之一基板以及安置在該膜上之一抗光蝕遮罩。該方法進一步包含：利用一RF電源向該電漿蝕刻室供電，向該基座總成施加一偏置功率，以及使用一切換製程藉由反覆交替執行以下步驟、經由該抗光蝕遮罩對該含添加劑之氮化鋁膜進行體蝕刻：(i)藉由在一目標室壓力下以實質上相等的流速將一氯化蝕刻氣體及一惰性稀釋氣體饋送至該電漿蝕刻室中而對該膜進行電漿蝕刻，以及(ii)在相同的目標室壓力下使用相同的氯化蝕刻氣體及惰性稀釋氣體對該膜進行電漿蝕刻，其中該惰性稀釋氣體之流速為該氯化蝕刻氣體之流速的至少四倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method of inductively coupled plasma etching an additive-containing aluminium nitride film, wherein the additive is selected from scandium, yttrium and erbium. The method comprises placing a workpiece upon a platen assembly within a plasma etch chamber, the workpiece comprising a substrate having the additive-containing aluminium nitride film deposited thereon and a photoresist mask disposed upon the film. The method further comprises powering the plasma etch chamber with an RF power supply, applying a bias power to the platen assembly, and bulk etching the additive-containing aluminium nitride film through the photoresist mask using a switched process by repeatedly alternating between the steps of (i) plasma etching the film by feeding a chlorinated etching gas and an inert diluent gas to the plasma etch chamber at substantially equal flow rates at a target chamber pressure, and (ii) plasma etching the film using the same chlorinated etching gas and inert diluent gas, at the same target chamber pressure, wherein the flow rate of the inert diluent gas is at least four times the flow rate of the chlorinated etching gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">117:底部平坦溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="954" publication-number="202621411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓載置台</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇佐美太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USAMI, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓載置台10係，包括陶瓷體20、導電性的聚焦環60、外周部塞配置孔25、以及外周部塞55。陶瓷體20具有晶圓載置面21、以及在比晶圓載置面21更外周部的聚焦環載置面26，且內置有第一電極22。聚焦環60被載置於聚焦環載置面26。外周部塞配置孔25位於聚焦環60之下且貫穿陶瓷體20。外周部塞55被設於外周部塞配置孔25且氣體可通過內部。聚焦環60係，在下面62b中位於與外周部塞55相向的位置具有氣體儲留用的凹部63。外周部塞25的上面55a係，被配置於凹部63內而在比聚焦環60的下面62b更高的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓載置台</p>  
        <p type="p">20:陶瓷板(陶瓷體)</p>  
        <p type="p">21:晶圓載置面</p>  
        <p type="p">21a:密封帶</p>  
        <p type="p">21b:圓形小突起</p>  
        <p type="p">21c:基準面</p>  
        <p type="p">22:第一電極</p>  
        <p type="p">23:第二電極</p>  
        <p type="p">24:中央部塞配置孔</p>  
        <p type="p">25:外周部塞配置孔</p>  
        <p type="p">26:聚焦環載置面</p>  
        <p type="p">30:基底板</p>  
        <p type="p">34:氣體孔</p>  
        <p type="p">34a:大徑部</p>  
        <p type="p">40:金屬接合層</p>  
        <p type="p">42:貫穿孔</p>  
        <p type="p">50:中央部塞</p>  
        <p type="p">50a:上面</p>  
        <p type="p">50b:下面</p>  
        <p type="p">55:外周部塞</p>  
        <p type="p">55a:上面</p>  
        <p type="p">55b:下面</p>  
        <p type="p">60:聚焦環</p>  
        <p type="p">62a:上面</p>  
        <p type="p">62b:下面</p>  
        <p type="p">62c:環狀階梯差面</p>  
        <p type="p">63:凹部</p>  
        <p type="p">63a:底面</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="955" publication-number="202621463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P76/00</main-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊孟軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包括以下步驟。提供一基板。提供一第一遮罩在基板的一第一表面上。圖案化第一遮罩，以於第一遮罩中形成一第一開口，且第一開口暴露出基板的一對應部分。提供一第一能量對基板的對應部分進行一第一改質步驟，以在基板中形成一第一改質區域。提供一第二能量對基板的對應部分進行一第二改質步驟，以在基板中形成一第二改質區域，其中第二改質區域與第一改質區域至少部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes steps as follows. A substrate is provided. A first mask is provided on a first surface of the substrate. The first mask is patterned to form a first opening in the first mask, and the first opening exposes a corresponding portion of the substrate. A first energy is provided to perform a first modification step on the corresponding portion of the substrate to form a first modified region in the substrate. A second energy is provided to perform a second modification step on the corresponding portion of the substrate to form a second modified region in the substrate. The second modified region at least partially overlaps the first modified region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">11:對應部分</p>  
        <p type="p">11A,11B:改質區域</p>  
        <p type="p">20:遮罩</p>  
        <p type="p">21:開口</p>  
        <p type="p">AA1:重疊面積</p>  
        <p type="p">F12:焦點</p>  
        <p type="p">HD1:水平方向</p>  
        <p type="p">LS2:雷射光</p>  
        <p type="p">N1:方向</p>  
        <p type="p">P2:能量</p>  
        <p type="p">S1,S2:表面</p>  
        <p type="p">T11,T12:焦深</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="956" publication-number="202619990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附膜物品及其製造方法、以及塗佈液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C03C1/02</main-classification>  
        <further-classification edition="201501120260211B">G02B1/115</further-classification>  
        <further-classification edition="201501120260211B">G02B1/14</further-classification>  
        <further-classification edition="200601120260211B">C09D183/14</further-classification>  
        <further-classification edition="200601120260211B">B05D1/18</further-classification>  
        <further-classification edition="200601120260211B">C09D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶岡利之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJIOKA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市野元太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHINO, GENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉本祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種附膜物品，其能夠以較高之水準同時具備撥水性與撥油性，並且於防污膜之下形成有功能膜之情形時，功能膜之特性不易劣化。 &lt;br/&gt;本發明之附膜物品1具備：基材2、設置於基材2上之功能膜3、及設置於功能膜3上之防污膜4，功能膜3之與防污膜4相接之表面部3A包含氧化矽，防污膜4係藉由具有二甲基矽氧烷單元之聚矽氧被覆功能膜3之表面部3A而構成，且相對於防污膜4之表面4a的15 μL之水之滑落角未達45°，相對於防污膜4之表面4a的1 μL之正十六烷之滑落角未達17°。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="957" publication-number="202619699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系口腔用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A61K8/36</main-classification>  
        <further-classification edition="200601120260209B">A61K8/81</further-classification>  
        <further-classification edition="200601120260209B">A61Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田亮輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種非水系口腔用組合物，其在應用於口腔內時，能夠表現出良好之碳酸感並且提高碳酸氣泡之持續性，從而帶來令人愉悅之使用感。 &lt;br/&gt;即，本發明係一種非水系口腔用組合物，其含有以下成分(A)～(D)： &lt;br/&gt;(A)25℃下之相對介電常數未達10且熔點為0℃以下之非水溶劑 &lt;br/&gt;(B)25℃下為固體之酸 &lt;br/&gt;(C)碳酸鹽 &lt;br/&gt;(D)水溶性高分子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="958" publication-number="202620852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C7/18</main-classification>  
        <further-classification edition="202601120260223B">H10D80/20</further-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴準喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUN HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權虎俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, HO JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金湳健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, NAM-GUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體記憶體裝置包括：一基體，其包括一作用區域；一位元線結構，其在該基體上，該位元線結構包括一胞元傳導線路及一胞元線路罩蓋膜；儲存接點，其等安置在該位元線結構之相對側上且連接至該作用區域；一儲存墊，其在該等儲存接點中之一者上且連接於該等儲存接點中之一者；以及一資料儲存圖案，其在該胞元線路罩蓋膜之一上表面上且連接至該儲存墊，且其中該儲存墊包括一上儲存墊以及安置在該上儲存墊與該儲存接點之間的一下儲存墊，且其中安置在該胞元線路罩蓋膜之該上表面之頂部上的該上儲存墊之一寬度隨著距該胞元線路罩蓋膜之該上表面之距離而增加。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The semiconductor memory device includes a substrate including an active area, a bit line structure on the substrate, the bit line structure including a cell conductive line and a cell line capping film, storage contacts disposed on opposing sides of the bit line structure and connected to the active area, a storage pad on one of the storage contacts and connected to one of the storage contacts, and a data storage pattern on an upper surface of the cell line capping film and connected to the storage pad, and wherein the storage pad includes an upper storage pad, and a lower storage pad disposed between the upper storage pad and the storage contact, and wherein a width of the upper storage pad disposed on top of the upper surface of the cell line capping film increases with distance from the upper surface of the cell line capping film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基體</p>  
        <p type="p">100US:上表面</p>  
        <p type="p">105:胞元元件隔離膜</p>  
        <p type="p">120:儲存接點</p>  
        <p type="p">130:胞元傳導膜，胞元絕緣膜</p>  
        <p type="p">131:第一胞元絕緣膜</p>  
        <p type="p">132:第二胞元絕緣膜</p>  
        <p type="p">140:胞元傳導線路</p>  
        <p type="p">140ST:位元線結構</p>  
        <p type="p">141:第一胞元傳導膜</p>  
        <p type="p">142:第二胞元傳導膜</p>  
        <p type="p">143:第三胞元傳導膜</p>  
        <p type="p">144:胞元線路罩蓋膜</p>  
        <p type="p">144US:上表面</p>  
        <p type="p">146:位元線接點</p>  
        <p type="p">150:胞元線路間隔體</p>  
        <p type="p">151:第一胞元線路間隔體</p>  
        <p type="p">152:第二胞元線路間隔體</p>  
        <p type="p">153:第三胞元線路間隔體</p>  
        <p type="p">154:第四胞元線路間隔體</p>  
        <p type="p">160:儲存墊</p>  
        <p type="p">160B:下儲存墊</p>  
        <p type="p">160U:上儲存墊，儲存墊</p>  
        <p type="p">160U_BS:底表面</p>  
        <p type="p">160U_SW:側壁</p>  
        <p type="p">160U_US:上表面</p>  
        <p type="p">160US:上表面</p>  
        <p type="p">161:下墊矽化物膜</p>  
        <p type="p">162:下墊填充膜</p>  
        <p type="p">180:墊隔離圖案</p>  
        <p type="p">180US:上表面</p>  
        <p type="p">190:資料儲存圖案</p>  
        <p type="p">191:下電極</p>  
        <p type="p">192:電容器介電膜</p>  
        <p type="p">193:上電極</p>  
        <p type="p">292:上蝕刻停止膜</p>  
        <p type="p">B-B:線</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR4:第四方向，方向</p>  
        <p type="p">Q:放大部分，部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="959" publication-number="202620797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260223B">G06V10/82</main-classification>  
        <further-classification edition="202201120260223B">G06V10/56</further-classification>  
        <further-classification edition="200601120260223B">G01N21/95</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＣＫＤ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CKD CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池和義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, KAZUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 提供一種焊料檢查裝置，其可減少在要獲得識別手段時所耗費的勞力或負擔，並且即使在焊盤的尺寸不同的情況下亦可共通地利用該識別手段。&lt;br/&gt; [解決手段]&lt;br/&gt; 令既定的類神經網路，僅以和良品的焊料膏相關的影像資料作為學習資料進行學習而生成AI模型101，對該AI模型101輸入依據藉由相機32d取得之影像資料的檢查用影像資料來取得重建影像資料，藉由比較檢查用影像資料及重建影像資料，來判定焊料膏的良否。學習資料及檢查用影像資料，係將對應於焊盤之4個邊的4個抽出影像之每一者設置於影像框而成，和學習資料相關的影像框以及和檢查用影像資料相關的影像框被設為相同尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">90:類神經網路</p>  
        <p type="p">91:編碼器部</p>  
        <p type="p">92:解碼部</p>  
        <p type="p">93:捲積層</p>  
        <p type="p">95:逆捲積層</p>  
        <p type="p">94,96:過濾器</p>  
        <p type="p">GA,GB:影像資料</p>  
        <p type="p">TA:特徵量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="960" publication-number="202619631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>柑橘風味飲料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A23L2/06</main-classification>  
        <further-classification edition="201901120260209B">C12G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日集團控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日啤酒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI BREWERIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上明大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種增大了柑橘風味飲料之該風味特點之飲料、其製造方法、及增大柑橘風味飲料之該風味特點之方法。 &lt;br/&gt;於柑橘風味飲料中，將鈣濃度設為6.0 mg/l以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="961" publication-number="202620493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統和投影曝光設備</chinese-title>  
        <english-title>OPTICAL SYSTEM AND PROJECTION EXPOSURE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260202B">G02B7/195</main-classification>  
        <further-classification edition="200601120260202B">G03F7/20</further-classification>  
        <further-classification edition="200601120260202B">G02B5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛里森　岡薩雷斯　克里斯欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLEASON GONZALEZ, CRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克諾爾　索倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNORR, SOEREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　俊勇　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA JUNYONG, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於投影曝光設備（1）的光學系統（100、100A、100B），包含：一光學元件（102、102A、102B）；以及一溫度調節介質管線連接件（202A、 202B、202C、202D、202E、202F、202G、 202H、402A、402B、402C），其中該溫度調節介質管線連接件附著於該光學元件（102、102A、102B）和用於將溫度調節介質管線（114）連接至該光學元件；其中該溫度調節介質管線連接件（202A、202B、202C、202D、202E、202F、202G、202H、402A、402B、402C）包含一連接部（214、414），溫度調節介質（K）係由該連接部引導通過；其中該溫度調節介質管線連接件（202A、202B、202C、202D、202E、202F、202G、202H、402A、402B、402C）包含一固定部（230、232、234、236、238、240、434、436、438、440），該固定部連接於該光學元件（102、102A、102B）；以及其中該連接部（214、414）從該固定部（230、232、234、236、238、240、434、436、438、440）機械解耦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical system (100, 100A, 100B) for a projection exposure apparatus (1), having an optical element (102, 102A, 102B), and a temperature-regulating medium line connection (202A, 202B, 202C, 202D, 202E, 202F, 202G, 202H, 402A, 402B, 402C) attached to the optical element (102, 102A, 102B) and serving for connecting a temperature-regulating medium line (114) to the optical element, wherein the temperature-regulating medium line connection (202A, 202B, 202C, 202D, 202E, 202F, 202G, 202H, 402A, 402B, 402C) has a connection portion (214, 414), through which a temperature-regulating medium (K) is guidable, wherein the temperature-regulating medium line connection (202A, 202B, 202C, 202D, 202E, 202F, 202G, 202H, 402A, 402B, 402C) has a securing portion (230, 232, 234, 236, 238, 240, 434, 436, 438, 440), which is connected to the optical element (102, 102A, 102B), and wherein the connection portion (214, 414) is mechanically de-coupled from the securing portion (230, 232, 234, 236, 238, 240, 434, 436, 438, 440).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:光學系統</p>  
        <p type="p">104:基板</p>  
        <p type="p">108:溫度調節通道</p>  
        <p type="p">114:溫度調節介質管線</p>  
        <p type="p">116:基板</p>  
        <p type="p">118:解耦銷</p>  
        <p type="p">120:表面</p>  
        <p type="p">122:中心軸</p>  
        <p type="p">124:外表面</p>  
        <p type="p">126:端面</p>  
        <p type="p">128:凹部</p>  
        <p type="p">130:肩部</p>  
        <p type="p">132:固定法蘭</p>  
        <p type="p">200:連接系統</p>  
        <p type="p">202A:溫度調節介質管線連接件</p>  
        <p type="p">204:密封元件</p>  
        <p type="p">206:密封元件</p>  
        <p type="p">208:安裝元件</p>  
        <p type="p">210:固定元件</p>  
        <p type="p">K:溫度調節介質</p>  
        <p type="p">12:長度</p>  
        <p type="p">11:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="962" publication-number="202621397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理系統、基板處理方法、基板處理程式及電腦可讀取記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P70/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="201401120260223B">B23K26/70</further-classification>  
        <further-classification edition="201401120260223B">B23K26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮城有佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAGI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於對基板固持部所固持之基板照射雷射光並進行處理時，可偵測處理發生異常的可能性並提高基板的良率。&lt;br/&gt; 本發明之處理基板的基板處理系統包含：對該基板照射雷射光的雷射照射裝置及控制裝置；該雷射照射裝置包含：固持該基板的基板固持部，及偵測該基板固持部所固持的該基板之狀態的偵測部；該控制裝置係執行以下控制：當該偵測部所偵測到的該基板之狀態為正常時，在該雷射照射裝置中對該基板照射該雷射光的控制，及當該偵測部所偵測到的該基板之狀態為異常時，在該雷射照射裝置中不對該基板照射該雷射光的控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:雷射照射裝置</p>  
        <p type="p">100:吸盤</p>  
        <p type="p">102:滑台</p>  
        <p type="p">105:基座</p>  
        <p type="p">106:軌道</p>  
        <p type="p">110:雷射照射部</p>  
        <p type="p">111:雷射頭</p>  
        <p type="p">112:光學系統</p>  
        <p type="p">113:透鏡</p>  
        <p type="p">120:偵測部</p>  
        <p type="p">130:拍攝部</p>  
        <p type="p">T:疊合晶圓</p>  
        <p type="p">W:第一晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="963" publication-number="202620164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有經再生之材料之熱管理流體組成物</chinese-title>  
        <english-title>THERMAL MANAGEMENT FLUID COMPOSITIONS CONTAINING RECLAIMED MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C09K5/04</main-classification>  
        <further-classification edition="200601120260213B">C08J9/14</further-classification>  
        <further-classification edition="200601120260213B">C09K3/30</further-classification>  
        <further-classification edition="200601120260213B">C10M171/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭　晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科班　瑪麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAN, MARY E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑　布然克斯　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN-BLANKS, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種組成物，其包括選自下列的至少一種化合物：HFO-1234yf、HFC-32、HFC-134a、HFO-1234ze(E)、HFO-1234ze(Z)、HFO-1252zc、HFC-152a、HFO-1132(E)、HFO-1243yc、HC-290、及其組合，其中該組成物之至少一部分包括經再生之材料。組成物可進一步包括選自下列的一或多種非冷媒組分：潤滑劑、染料、聚合抑制劑、助溶劑、酸清除劑、相容劑、穩定劑、示蹤劑、全氟聚醚、抗磨劑、極壓劑、腐蝕抑制劑、氧化抑制劑、金屬表面能降低劑、金屬表面去活化劑、泡沫控制劑、黏度指數改善劑、流動點下降劑、清潔劑、黏度調整劑、性能增強劑、火焰抑制劑、及其混合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition is provided which includes at least one compound selected from HFO-1234yf, HFC-32, HFC-134a, HFO-1234ze(E), HFO-1234ze(Z), HFO-1252zc, HFC-152a, HFO-1132(E), HFO-1243yc, HC-290 and combinations thereof, wherein at least a portion of the composition includes reclaimed materials. The composition may further include one or more non-refrigerant components selected from a lubricant, a dye, a polymerization inhibitor, a solubilizing agent, an acid scavenger, a compatibilizer, a stabilizer, a tracer, a perfluoropolyether, an anti-wear agent, an extreme pressure agent, a corrosion inhibitor, an oxidation inhibitor, a metal surface energy reducer, a metal surface deactivator, a foam control agent, a viscosity index improver, a pour point depressant, a detergent, a viscosity adjuster, a performance enhancer, a flame suppressant and mixtures thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="964" publication-number="202620369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在彈體的發射之間空中追擊系統的重新定位</chinese-title>  
        <english-title>REPOSITIONING OF AN AERIAL PURSUIT SYSTEM BETWEEN LAUNCHES OF PROJECTILES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">F42B15/01</main-classification>  
        <further-classification edition="200601120260205B">F41B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛克勝企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXON ENTERPRISE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科皮　伊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COPPYE, YVES J.R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加齊亞諾　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAZIANO, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班查巴內　索菲亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEN CHABANE, SOFIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特林　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTLING, DAVID RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾伯格　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KJELLBERG, JOHN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒爾茨　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULTZ, KARL U.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克羅伊　雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCELROY, JACOB P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿拉卡胡　尤哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAKARHU, JUHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空中追擊系統可包括無人空中載具(UAV)、安裝至該UAV之發射器、及耦合至該發射器的彈匣。該彈匣可被組構以接收且容置複數個彈體。該UAV及該發射器可被組構以協作來執行該空中追擊系統之操作。該空中追擊系統可判定在目標上的第一位置。該空中追擊系統可將該複數個彈體之第一彈體朝向該第一位置發射。該空中追擊系統可基於由來自該發射該第一彈體所施予之後座力引起的移動來重新定位該UAV。該空中追擊系統可將該複數個彈體之下一個彈體朝向該目標上之下一個位置發射。該下一個位置可不同於該第一位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aerial pursuit system may comprise an unmanned aerial vehicle (UAV), a launcher mounted to the UAV, and a magazine coupled to the launcher. The magazine may be configured to receive and house a plurality of projectiles. The UAV and the launcher may be configured to cooperate to perform operations of the aerial pursuit system. The aerial pursuit system may determine a first location on a target. The aerial pursuit system may launch a first projectile of the plurality of projectiles towards the first location. The aerial pursuit system may reposition the UAV based on a movement caused by a recoil force imparted from the launching the first projectile. The aerial pursuit system may launch a next projectile of the plurality of projectiles towards a next location on the target. The next location may be different from the first location.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:空中追擊系統</p>  
        <p type="p">101:操作員</p>  
        <p type="p">103:操作控制器</p>  
        <p type="p">105:目標</p>  
        <p type="p">110:無人空中載具(UAV)</p>  
        <p type="p">130:發射器</p>  
        <p type="p">140:彈匣</p>  
        <p type="p">P0:第一彈體</p>  
        <p type="p">L1:第二位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="965" publication-number="202621434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用紅外線成像的線上晶圓定位系統</chinese-title>  
        <english-title>IN-LINE WAFER POSITIONING SYSTEM USING IR IMAGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　貽琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOH, YI KUN KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　翰彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOH, HAN YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, KOK KEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於半導體製造處理工具的監控系統及用於監控半導體製造製程工具的監控方法。該監控系統具有位於處理工具的移送站中的移送機器人上方的反射體。該反射體用於將來自連接至移送站的處理腔室的輻射能量引導至位於移送站上方的照相機，該照相機設計用於量測來自處理腔室的紅外線輻射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Monitoring system for a semiconductor manufacturing processing tool and methods of monitoring a semiconductor manufacturing process tool are described. The monitoring system has a reflector positioned above a transfer robot in a transfer station of the processing tool. The reflector is configured to direct radiant energy from a processing chamber connected to the transfer station to a camera above the transfer station, the camera configured to measure infrared radiation from the processing chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理工具</p>  
        <p type="p">110:移送站</p>  
        <p type="p">110a:天花板</p>  
        <p type="p">111:檢視孔</p>  
        <p type="p">114:移送機器人</p>  
        <p type="p">114a:端效器</p>  
        <p type="p">130:處理腔室</p>  
        <p type="p">176:埠</p>  
        <p type="p">190:系統控制器</p>  
        <p type="p">200:監控系統</p>  
        <p type="p">205:輻射能量</p>  
        <p type="p">210:反射體</p>  
        <p type="p">212:反射體支架</p>  
        <p type="p">220:晶圓</p>  
        <p type="p">230:基板支撐</p>  
        <p type="p">240:升舉銷</p>  
        <p type="p">250:照相機/反射體</p>  
        <p type="p">260:互鎖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="966" publication-number="202620262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異型扁平斷面纖維、布料、及纖維製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">D01F6/02</main-classification>  
        <further-classification edition="200601120260223B">D01F6/00</further-classification>  
        <further-classification edition="200601120260223B">D04B21/12</further-classification>  
        <further-classification edition="202101120260223B">D03D15/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商帝人富瑞特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIJIN FRONTIER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神山三枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYAMA, MIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田泰之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤堂良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODO, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長尾英治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAO, HIDEHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供遮熱性、紫外線遮蔽性、防透性及採光性優異之異型扁平斷面纖維、布料及使用該布料之纖維製品，解決手段係獲得異型扁平斷面纖維後，使用該纖維構成布料及纖維製品，該異型扁平斷面纖維係於纖維斷面形狀中，對於纖維斷面長度方向具有傾斜角度之直線狀部位的數在6~12之範圍內，扁平度在3~6之範圍內，異型度在2~4.5之範圍內，且前述傾斜角度在30˚~70˚之範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:異型扁平斷面纖維斷面之長度方向之最大長</p>  
        <p type="p">B:異型扁平斷面纖維斷面之短邊方向之最大寬度</p>  
        <p type="p">C:異型扁平斷面纖維斷面之短邊方向之切入部間之距離</p>  
        <p type="p">θs:異型扁平斷面纖維斷面之斷面長度方向與各直線狀部位之角度(傾斜角)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="967" publication-number="202621435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶圓概覽影像掃描及膜架載體預對準之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR WAFER OVERVIEW IMAGE SCAN AND PRE-ALIGNMENT OF FILM FRAME CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="200601120260223B">B25J13/08</further-classification>  
        <further-classification edition="200601120260223B">B65G49/07</further-classification>  
        <further-classification edition="200601120260223B">B65G47/90</further-classification>  
        <further-classification edition="201701120260223B">G06T7/00</further-classification>  
        <further-classification edition="200601120260223B">G01N21/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　釗添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, CHOW TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史克威塔拉　賽分</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWITALLA, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統包含經組態以支撐一工件之一膜架載體(FFC)，且該FFC可移除地安置於一FFC旋轉器上。該系統進一步包含經組態以接合該FFC以自該FFC旋轉器移除該FFC之一末端效應器及安置於該末端效應器之一移動路徑中之一掃描器。該掃描器經組態以在與該FFC接合之該末端效應器移動遠離該FFC旋轉器時產生該末端效應器之一概覽影像。該系統進一步包含一處理器，其經組態以自該掃描器接收該概覽影像，根據該概覽影像來判定該FFC與該末端效應器之間的一對準，且根據該FFC與該末端效應器之間的該對準來控制該末端效應器之一移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a film frame carrier (FFC) configured to support a workpiece, and the FFC is removably disposed on an FFC rotator. The system further includes an end effector configured to engage the FFC to remove the FFC from the FFC rotator and a scanner disposed in a movement path of the end effector. The scanner is configured to generate an overview image of the end effector engaged with the FFC as the end effector moves away from the FFC rotator. The system further includes a processor configured to receive the overview image from the scanner, determine an alignment between the FFC and the end effector according to the overview image, and control a movement of the end effector according to the alignment between the FFC and the end effector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:工件</p>  
        <p type="p">110:膜架載體(FFC)</p>  
        <p type="p">120:FFC旋轉器</p>  
        <p type="p">130:末端效應器</p>  
        <p type="p">135:機器人臂</p>  
        <p type="p">140:掃描器</p>  
        <p type="p">150:卡盤</p>  
        <p type="p">160:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="968" publication-number="202620232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C23C16/455</main-classification>  
        <further-classification edition="200601120260213B">H01F27/24</further-classification>  
        <further-classification edition="200601120260213B">H01F27/28</further-classification>  
        <further-classification edition="200601120260213B">H01J37/32</further-classification>  
        <further-classification edition="200601120260213B">H05H1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進藤崇央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種生成感應耦合電漿之電漿處理裝置。 &lt;br/&gt;一種電漿處理裝置，係具備：處理容器；基板保持具，係保持基板且被收容在該處理容器內；以及電漿生成機構，係生成感應耦合電漿；該電漿生成機構係具有：放電室，係具有環繞形狀；天線，係具有磁性體芯及捲繞在該磁性體芯的線圈，在該放電室生成感應電流；以及高頻電源，係對該線圈供應高頻功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理容器</p>  
        <p type="p">2:頂板</p>  
        <p type="p">3:歧管</p>  
        <p type="p">4:密封構件</p>  
        <p type="p">5:晶舟(基板保持具)</p>  
        <p type="p">6:桿</p>  
        <p type="p">7:保溫筒</p>  
        <p type="p">8:台座</p>  
        <p type="p">9:蓋體</p>  
        <p type="p">10:旋轉軸</p>  
        <p type="p">11:磁性流體密封件</p>  
        <p type="p">12:密封構件</p>  
        <p type="p">31:開口</p>  
        <p type="p">32A:放電室</p>  
        <p type="p">33A:環芯(磁性體芯)</p>  
        <p type="p">34A:線圈</p>  
        <p type="p">35:供電線</p>  
        <p type="p">36:匹配器</p>  
        <p type="p">37:同軸電纜</p>  
        <p type="p">38:高頻電源</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="969" publication-number="202621063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊部件</chinese-title>  
        <english-title>COMMUNICATION COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260211B">H04B1/40</main-classification>  
        <further-classification edition="200601120260211B">H04B1/76</further-classification>  
        <further-classification edition="200601120260211B">H01R11/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光興國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPTOMEDIA TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周暉座</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HUI-TSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃明祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通訊部件包含導電件以及控制模組。導電件包含金屬本體、第一下接地針腳、第一上接地針腳、第二下接地針腳以及第二上接地針腳。第一上接地針腳位於第一下接地針腳上方。第二上接地針腳位於第二下接地針腳上方。控制模組連接導電件。控制模組包含電路板、第一接地墊、第二接地墊以及數個端子接觸墊。電路板接觸第一下接地針腳、第一上接地針腳、第二下接地針腳以及第二上接地針腳。第一接地墊接觸第一下接地針腳以及第一上接地針腳。第二接地墊接觸第二下接地針腳以及第二上接地針腳。端子接觸墊位於第一接地墊與第二接地墊之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication component includes a conductive part and a controlling module. The conductive part includes a metal main body, a first lower ground pin, a first upper ground pin, a second lower ground pin, and a second upper ground pin. The first upper ground pin is located over the first lower ground pin. The second upper ground pin is located over the second lower ground pin. The controlling module is connected to the conductive part. The controlling module includes a circuit board, a first ground pad, a second ground pad, and a plurality of terminal contacting pads. The circuit board contacts the first lower ground pin, the first upper ground pin, the second lower ground pin, and the second upper ground pin. The first ground pad contacts the first lower ground pin and the first upper ground pin. The second ground pad contacts the second lower ground pin and the second upper ground pin. The terminal contacting pads are located between the first ground pad and the second ground pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:導電件</p>  
        <p type="p">110a:側面</p>  
        <p type="p">110t:頂面</p>  
        <p type="p">111:金屬本體</p>  
        <p type="p">112:第一下接地針腳</p>  
        <p type="p">113:第二下接地針腳</p>  
        <p type="p">114:第一上接地針腳</p>  
        <p type="p">115:第二上接地針腳</p>  
        <p type="p">116:中央接地針腳</p>  
        <p type="p">120:控制模組</p>  
        <p type="p">121:電路板</p>  
        <p type="p">121A:第一端部</p>  
        <p type="p">121B:第二端部</p>  
        <p type="p">122:第一接地墊</p>  
        <p type="p">123:第二接地墊</p>  
        <p type="p">124:端子接觸墊</p>  
        <p type="p">125:金手指</p>  
        <p type="p">CB1:第一纜線</p>  
        <p type="p">CB2:第二纜線</p>  
        <p type="p">CB3:第三纜線</p>  
        <p type="p">CB4:第四纜線</p>  
        <p type="p">CP1:第一晶片</p>  
        <p type="p">CP2:第二晶片</p>  
        <p type="p">FH:鎖固孔</p>  
        <p type="p">T1:第一訊號端子</p>  
        <p type="p">T2:第二訊號端子</p>  
        <p type="p">T3:第三訊號端子</p>  
        <p type="p">T4:第四訊號端子</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="970" publication-number="202620061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活性能量射線硬化性組成物、硬化物及薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F2/44</main-classification>  
        <further-classification edition="200601120260223B">C08F2/50</further-classification>  
        <further-classification edition="200601120260223B">C08F220/54</further-classification>  
        <further-classification edition="200601120260223B">C08F222/10</further-classification>  
        <further-classification edition="200601120260223B">C08F290/12</further-classification>  
        <further-classification edition="202001120260223B">C08J7/04</further-classification>  
        <further-classification edition="200601120260223B">C09D4/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村彰朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二川裕紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUTAGAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長野尭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所欲解決之課題在於提供一種能夠形成具有優異的防眩性及透明性的硬化塗膜的活性能量射線硬化性組成物、硬化物及薄膜。本發明提供一種活性能量射線硬化性組成物、使用期的硬化物及薄膜，所述活性能量射線硬化性組成物包含環氧（甲基）丙烯酸酯（A）、多官能（甲基）丙烯酸酯（B）、二官能（甲基）丙烯酸酯（C）、有機微粒（D）、四級銨鹽單體（E）及混合溶劑（F）（其中，多官能（甲基）丙烯酸酯（B）不包括環氧（甲基）丙烯酸酯（A）及二官能（甲基）丙烯酸酯（C）。另外，二官能（甲基）丙烯酸酯（C）不包括環氧（甲基）丙烯酸酯（A）。），所述四級銨鹽單體（E）為二甲基胺基丙基丙烯醯胺氯化甲基四級鹽及（甲基）丙烯酸二甲基胺基乙酯四級化物中的至少一者，所述四級銨鹽單體（E）的比例相對於所述環氧（甲基）丙烯酸酯（A）、所述多官能（甲基）丙烯酸酯（B）和所述二官能（甲基）丙烯酸酯（C）的合計100質量份為0.5~10質量份，所述混合溶劑（F）中的比例為質子溶劑/非質子溶劑=50質量%~85質量%/15質量%~50質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="971" publication-number="202620647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具記憶體內處理運算位址產生技術的處理器實施方法及電子裝置</chinese-title>  
        <english-title>PROCESSOR-IMPLEMENTED METHOD AND ELECTRONIC DEVICE WITH PROCESSING-IN-MEMORY COMPUTATION ADDRESS GENERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F12/02</main-classification>  
        <further-classification edition="200601120251201B">G06F12/06</further-classification>  
        <further-classification edition="200601120251201B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車相薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白允雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAIK, YOONAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鉉洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宣政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔珉晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, MINJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種處理器實施方法，其包括：產生與一記憶體內處理(PIM)操作相關之一記憶體請求；回應於該記憶體請求而獲得一PIM運算位址；將該記憶體請求及該PIM運算位址傳輸至一記憶體控制器；以及由該記憶體控制器透過排組混洗來指定一記憶體位址，該排組混洗將該PIM運算位址映射至被混洗至一預設目標排組的一組位址。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor-implemented method including generating a memory request related to a processing-in-memory (PIM) operation, obtaining a PIM computation address in response to the memory request, transmitting, to a memory controller, the memory request and the PIM computation address, and designating, by the memory controller, a memory address through bank shuffling, the bank shuffling mapping the PIM computation address to a set of addresses shuffled to a preset target bank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:電子裝置</p>  
        <p type="p">310:主機系統</p>  
        <p type="p">311:主機處理器</p>  
        <p type="p">312:記憶體控制器</p>  
        <p type="p">320:記憶體裝置</p>  
        <p type="p">321-1,321-2,321-3,321-n:記憶體排組及PIM區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="972" publication-number="202620038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經化學修飾之肽及其用途</chinese-title>  
        <english-title>CHEMICALLY MODIFIED PEPTIDES AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C07K14/605</main-classification>  
        <further-classification edition="200601120260210B">A61K38/26</further-classification>  
        <further-classification edition="200601120260210B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅佐　亞當　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEZO, ADAM R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何榮軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, RONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於經化學修飾之肽及其在治療某些疾病或病症中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to chemically modified peptides and uses thereof in treating certain diseases or disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="973" publication-number="202621425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運裝置及連接方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="200601120260223B">B25J19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野遼平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, RYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喜多川大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤功英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村理紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨口泰生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGUCHI, TAISEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤直紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係使搬運裝置小型化。 &lt;br/&gt;用以搬運被搬運物之搬運裝置具備：收容部、開口部、閘閥、機械臂、第1連接器單元、驅動部及移動機構。收容部收容被搬運物。開口部連接於處理基板之處理裝置。閘閥將開口部開閉。機械臂配置於收容部內部，前端具有終端效應器，可經由開口部，在與處理裝置之間，使用終端效應器來搬運被搬運物。第1連接器單元包含用以從設置於搬運裝置之外部的外部裝置接受對搬運裝置之電力供給的第1連接器。驅動部於將第1連接器單元連接於外部裝置的第2連接器單元之際，使第1連接器單元前進，俾靠近第2連接器單元。移動機構使搬運裝置移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:搬運裝置</p>  
        <p type="p">11:收容部</p>  
        <p type="p">11a:開口部</p>  
        <p type="p">11c:面</p>  
        <p type="p">12:匣</p>  
        <p type="p">13:機械臂</p>  
        <p type="p">14:移動機構</p>  
        <p type="p">20:連接器單元驅動部</p>  
        <p type="p">21:連接器單元</p>  
        <p type="p">30:消耗零件</p>  
        <p type="p">110:蓋部</p>  
        <p type="p">121:台</p>  
        <p type="p">122:驅動部</p>  
        <p type="p">130:終端效應器</p>  
        <p type="p">140:本體部</p>  
        <p type="p">141:車輪</p>  
        <p type="p">150:控制部</p>  
        <p type="p">151:電池</p>  
        <p type="p">152:感測器</p>  
        <p type="p">G1:閘閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="974" publication-number="202621388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨墊、基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification>  
        <further-classification edition="201201120260223B">B24B37/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲富裕一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INATOMI, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土橋和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOBASHI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題係提供一種使具觸媒之研磨墊的研磨性能穩定化之技術。本發明的解決手段係一種研磨墊，用於研磨基板。研磨墊包括：金屬構件，具有觸媒，此觸媒自供給至前述基板之處理液生成與前述基板反應之反應物種；以及固持構件，固持前述金屬構件。前述金屬構件與前述固持構件分別自前述研磨墊中之與前述基板之對向面垂直延伸，且具有一定之橫剖面形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:研磨墊</p>  
        <p type="p">30a:對向面</p>  
        <p type="p">33:金屬構件</p>  
        <p type="p">34:固持構件</p>  
        <p type="p">W:基板</p>  
        <p type="p">Wa:第一主面</p>  
        <p type="p">Wb:第二主面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="975" publication-number="202621511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分支混合撓曲結構</chinese-title>  
        <english-title>BRANCHED HYBRID FLEX STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/68</main-classification>  
        <further-classification edition="202601120260223B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏佐　賽普里恩　艾米卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UZOH, CYPRIAN EMEKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於製造分支基板之方法，這些分支基板具有導電接觸襯墊及用於直接接合晶粒且將其電連接至這些接觸襯墊之混合介電接合表面。分支基板可包括主要部分及混合接合至該主要部分之一或多個分支部分。該分支基板之一些區段可為可撓曲的以允許混合接合至該分支基板之不同區域之組件之間的可變形電連接。可撓曲分支部分可提供兩個組件之經垂直分離層之間的電連接。該方法包括經由混合接合界面將該分支基板之分支部分直接接合至該分支基板之該主要部分，該混合接合界面包含該主要部分及該分支部分之接觸襯墊之間的導電界面以及該主要部分及該分支部分之介電表面之間的經混合接合介電界面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for fabricating branched substrates having conductive contact pads and hybrid dielectric bonding surfaces for directly bonding dies and electrically connecting them to the contact pads. A branched substrate can include a main portion and one or more branch portions hybrid bonded to the main portion. Some sections of the branched substrate can be flexible to allow deformable electrical connection between components that are hybrid bonded to different regions of the branched substrate. A flexible branch portion may provide electrical connection between vertically separated layers of two components. The method includes directly bonding a branch portion of the branched substrate to the main portion of the branched substrate via a hybrid bonding interface comprising a conductive interface between contact pads of the main and branch portions and a hybrid bonded dielectric interface between dielectric surfaces of the of the main and branch portions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">312:主要部分</p>  
        <p type="p">314:分支部分</p>  
        <p type="p">315:分支可撓曲經接合結構</p>  
        <p type="p">316:分支部分</p>  
        <p type="p">318:分支部分</p>  
        <p type="p">322:分支部分</p>  
        <p type="p">325a:組件</p>  
        <p type="p">325b:組件</p>  
        <p type="p">325c:組件</p>  
        <p type="p">325d:組件</p>  
        <p type="p">325e:組件</p>  
        <p type="p">325f:組件</p>  
        <p type="p">325g:組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="976" publication-number="202620293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空泵</chinese-title>  
        <english-title>VACUUM PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">F04C27/02</main-classification>  
        <further-classification edition="200601120260209B">F04C25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　達倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, DARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯普　大衛　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISP, DAVID THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種真空泵(100)，其包括：一第一腔室(112)；一第二腔室(106)；自該第一腔室(112)延伸至該第二腔室(106)中之一可旋轉軸件(110)；繞該軸件(110)延伸並定位於該第一腔室(112)與該第二腔室(106)之間的一或多個密封部件(208)；及繞該軸件(110)延伸之一動態密封元件(206)，該動態密封元件(206)具有面向該第一腔室(112)之一第一側(220)及面向該第二腔室(106)之一相對第二側(222)；其中該動態密封元件(206)經構形以回應於該第一側(220)與該第二側(222)之間的一正壓力差處於或高於一臨限值而軸向變形，使得該第二側(222)接觸該一或多個密封部件(208)之一第一表面，藉此限制及/或防止該第一腔室(112)與該第二腔室(106)之間的流體流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vacuum pump (100) comprising: a first chamber (112); a second chamber (106); a rotatable shaft (110) extending from the first chamber (112) into the second chamber (106); one or more sealing members (208) extending around the shaft (110) and positioned between the first chamber (112) and the second chamber (106); and a dynamic sealing element (206) extending around the shaft (110), the dynamic sealing element (206) having a first side (220) facing towards the first chamber (112) and an opposing second side (222) facing towards the second chamber (106); wherein the dynamic sealing element (206) is configured to, responsive to a positive pressure differential between the first side (220) and the second side (222) being at or above a threshold value, axially deform such that the second side (222) contacts a first surface of the one or more sealing members (208), thereby restricting and/or preventing flow of fluid between the first chamber (112) and the second chamber (106).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:泵送級</p>  
        <p type="p">110:驅動軸件</p>  
        <p type="p">112:潤滑腔室</p>  
        <p type="p">114:外殼部分</p>  
        <p type="p">118:密封系統</p>  
        <p type="p">202:旋轉部分</p>  
        <p type="p">204:固定環</p>  
        <p type="p">206:動態密封元件</p>  
        <p type="p">208:活塞環</p>  
        <p type="p">214:外環</p>  
        <p type="p">216:內環</p>  
        <p type="p">218:接觸表面</p>  
        <p type="p">220:第一側</p>  
        <p type="p">222:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="977" publication-number="202621229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱器扣合結構、屏蔽籠組件和光模組裝置</chinese-title>  
        <english-title>RADIATOR FASTENING STRUCTURE, SHIELDING CAGE COMPONENT AND OPTICAL MODULE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H05K7/20</main-classification>  
        <further-classification edition="200601120250701B">G02B6/42</further-classification>  
        <further-classification edition="200601120250701B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊熱傳科技（惠州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE THERMAL TECHNOLOGIES (HUIZHOU) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, BOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供了一種散熱器扣合結構、屏蔽籠組件和光模組裝置，散熱器扣合結構包括第一扣合件和第二扣合件，第一扣合件和第二扣合件相對應的側面之間透過扣合連接，第一扣合件和第二扣合件扣合之後形成安放散熱器的容納空間，第一扣合件的側面設置有與屏蔽籠扣合連接的卡扣部，頂面設置有用於按壓散熱器的彈性壓片。本實施例的散熱器扣合結構可以形成整體包裹住散熱器並透過彈性壓片壓緊散熱器，防止散熱器在受到外部衝擊或振動時發生位移或鬆動，保證其穩定性和可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a radiator fastening structure, a shielding cage component and an optical module device. The radiator fastening structure includes a first fastening element and a second fastening element. The side surface of the first fastening element and the side surface of the second fastening element corresponding to each other are fastened together. The first fastening element and the second fastening element are fastened together to form an accommodating space for placing a radiator. A buckle portion is disposed on the side surface of the first fastening element and is buckled with a shielding cage. An elastic pressing sheet is disposed on the top surface of the first fastening element for pressing the radiator. The radiator fastening structure of the disclosure wraps the radiator and presses the radiator tightly through the elastic pressing sheet to prevent the radiator from shifting or loosening due to external shock or vibration. The stability and reliability is ensured.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一扣合件</p>  
        <p type="p">10:導向板</p>  
        <p type="p">11:頂板</p>  
        <p type="p">111:第一散熱孔</p>  
        <p type="p">112:彈性壓片</p>  
        <p type="p">12:第一上側板</p>  
        <p type="p">13:第二上側板</p>  
        <p type="p">14:第三上側板</p>  
        <p type="p">16:第一卡扣部</p>  
        <p type="p">17:第二卡扣部</p>  
        <p type="p">18:第五上側板</p>  
        <p type="p">2:第二扣合件</p>  
        <p type="p">21:底板</p>  
        <p type="p">211:第二散熱孔</p>  
        <p type="p">212:避讓孔</p>  
        <p type="p">22:第一下側板</p>  
        <p type="p">23:第二下側板</p>  
        <p type="p">24:第一卡合部</p>  
        <p type="p">25:第三下側板</p>  
        <p type="p">26:第四下側板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="978" publication-number="202620364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置和電子設備</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250727B">F28F9/26</main-classification>  
        <further-classification edition="200601120250727B">F28F3/12</further-classification>  
        <further-classification edition="200601120250727B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊熱傳科技（惠州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE THERMAL TECHNOLOGIES (HUIZHOU) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供了一種散熱裝置和電子設備，散熱裝置中散熱模組包括至少兩個並排設置且串聯連通的第一液冷板，每個第一液冷板包括具有進液口和出液口的液冷流道，位於一端的第一液冷板的進液口與第一入液管連通，位於另一端的第一液冷板的出液口或進液口與第一回液管連通，其餘所有的出液口和進液口中，相鄰兩個出液口之間以及相鄰兩個進液口之間分別透過連接管交錯連通。散熱裝置中相鄰第一液冷板之間透過連接管錯孔串聯連通的方式，增大了連接管的折彎半徑以及可操作性，降低了水流阻力，提高了散熱能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device and an electronic equipment are disclosed. A heat dissipation module in the heat dissipation device includes at least two first liquid cooling plates disposed side by side and connected in series. Each first liquid cooling plate includes a liquid cooling channel provided with a liquid inlet hole and a liquid outlet hole. The liquid inlet hole at one end of the first liquid cooling plate is connected to a first liquid inlet pipe. The liquid outlet hole or the liquid inlet hole at the other end of the liquid cooling plate is connected to a first liquid return pipe. Among the other liquid outlet holes and liquid inlet holes, two adjacent liquid outlet holes and two adjacent liquid inlet holes are respectively connected to each other through connecting pipes. The adjacent first liquid cooling plates in the heat dissipation device are connected in series through the staggered holes and the connecting pipes. The banding radius and operability of the connecting pipes are increased. The resistance of the liquid flow is reduced. The heat dissipation capacity is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱模組</p>  
        <p type="p">1:第一液冷板</p>  
        <p type="p">2:第一入液管</p>  
        <p type="p">3:第一回液管</p>  
        <p type="p">4:連接管</p>  
        <p type="p">7:第一聯通塊</p>  
        <p type="p">8:第二聯通塊</p>  
        <p type="p">9:第一分液器</p>  
        <p type="p">10:第二分液器</p>  
        <p type="p">101:第二入液管</p>  
        <p type="p">102:第二回液管</p>  
        <p type="p">103:主入液管</p>  
        <p type="p">104:主回液管</p>  
        <p type="p">105:第二液冷板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="979" publication-number="202620365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置和電子設備</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250727B">F28F9/26</main-classification>  
        <further-classification edition="200601120250727B">F28F3/12</further-classification>  
        <further-classification edition="200601120250727B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊熱傳科技（惠州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE THERMAL TECHNOLOGIES (HUIZHOU) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種散熱裝置和電子設備，散熱裝置中散熱模組的每個第一液冷板的外側設置有流體連接模組，流體連接模組包括連通孔，流體連接模組和第一液冷板之間形成導引通道，導引通道的一側與連通孔連通，導引通道的另一側與第一液冷板的進液口或出液口連通，每組散熱模組中位於最外側的進液口和出液口分別透過對應的連通孔與第一入液管、第一回液管連通，其餘相鄰兩個第一液冷板上相鄰的出液口和進液口之間分別透過對應的連通孔與連接管的兩端串聯連通。增大相鄰第一液冷板之間連接管的折彎半徑以及可操作性，降低流阻，提高散熱能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device and an electronic equipment are disclosed. A fluid connection module is disposed on the outer side of each first liquid cooling plate of a heat dissipation module in the heat dissipation device. The fluid connection module includes communicating holes. A guide passage is formed between the fluid connection module and the first liquid cooling plate. One side of the guide passage is connected with the communicating holes. The other side of the guide passage is connected with liquid inlet holes and liquid outlet holes of the first liquid cooling plate. The outermost liquid inlet hole and the outermost liquid outlet hole of each heat dissipation module are connected to a first liquid inlet pipe and a first liquid return pipe through the corresponding communicating holes. The liquid outlet holes and the liquid inlet holes adjacent to each other on the other two adjacent first liquid cooling plates are connected in series with the two ends of connecting pipes through the corresponding communicating holes. The banding radius and the operability of the connecting pipes between the adjacent first liquid cooling plates are increased. The resistance of the liquid flow is reduced. The heat dissipation capacity is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱模組</p>  
        <p type="p">1:第一液冷板</p>  
        <p type="p">21:第一聯通塊</p>  
        <p type="p">22:第二聯通塊</p>  
        <p type="p">4:第一入液管</p>  
        <p type="p">5:第一回液管</p>  
        <p type="p">6:連接管</p>  
        <p type="p">7:第一分液器</p>  
        <p type="p">8:第二分液器</p>  
        <p type="p">9:第二液冷板</p>  
        <p type="p">91:第二入液管</p>  
        <p type="p">92:第二回液管</p>  
        <p type="p">101:主入液管</p>  
        <p type="p">102:主回液管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="980" publication-number="202620494"> 
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      <tif no="1" file="202620494.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">G02B11/32</main-classification>  
        <further-classification edition="202101120251128B">G02B7/02</further-classification>  
        <further-classification edition="200601120251128B">G02B9/64</further-classification>  
        <further-classification edition="200601120251128B">G02B13/18</further-classification>  
        <further-classification edition="200601120251128B">G02B15/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺聖日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SEONG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金學哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林台淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, TAE YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括沿光學成像系統的光軸自光學成像系統的物體側朝向光學成像系統的成像平面以上升的數值次序依序設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡及第六透鏡，第一透鏡具有折射力，第二透鏡具有負的折射力，第三透鏡具有正的折射力，第四透鏡具有負的折射力，第五透鏡具有折射力，第六透鏡具有折射力，其中滿足條件表達式0.85 ≤ TTL/f ≤ 1.0及0.5 ≤ f1/f ≤ 1，其中TTL是沿光軸自第一透鏡的物體側表面至成像平面的距離，f是光學成像系統的總焦距，且f1是第一透鏡的焦距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens having a refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a negative refractive power, a fifth lens having a refractive power, and a sixth lens having a refractive power sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the conditional conditions 0.85 ≤ TTL/f ≤ 1.0 and 0.5 ≤ f1/f ≤ 1 are satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane, f is a total focal length of the optical imaging system, and f1 is a focal length of the first lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">F:濾光片</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="981" publication-number="202621129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測裝置及圖像處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260210B">H04N25/773</main-classification>  
        <further-classification edition="202301120260210B">H04N25/704</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田顕鑑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, AKIMIRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可活用SPAD之特徵的光檢測裝置及圖像處理系統。 &lt;br/&gt;本發明之光檢測裝置包含：複數對光電變換元件，其等分別檢測入射之光子；及像素電路，其就前述複數對光電變換元件之每一對，藉由進行由成對之2個光電變換元件檢測到之光子數彼此之比較而輸出由被判定為合焦狀態之成對之2個光電變換元件檢測到之光子數，不輸出由不被判定為合焦狀態之成對之光電變換元件檢測到之光子數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:攝像部</p>  
        <p type="p">12:照度判定部</p>  
        <p type="p">20a,20b:像素</p>  
        <p type="p">21a,21b:光電變換元件</p>  
        <p type="p">22a,22b:電晶體</p>  
        <p type="p">23a,23b:脈衝產生電路</p>  
        <p type="p">24a,24b:計數器</p>  
        <p type="p">25a,25b:像素電路</p>  
        <p type="p">61a,61b:切換開關</p>  
        <p type="p">62a,62b:保持器</p>  
        <p type="p">63:信號產生電路</p>  
        <p type="p">64,65,66:邏輯電路</p>  
        <p type="p">clk:時脈信號</p>  
        <p type="p">FLAG:輸出控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="982" publication-number="202620830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素驅動電路及其驅動方法、顯示基板和顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260211B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛晉飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, JINFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳小川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAOCHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張粲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONG, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙蛟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閆家魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, JIAKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種像素驅動電路及其驅動方法、顯示基板和顯示裝置，其中，像素驅動電路，包括：信號輸入子電路、信號保持子電路和信號輸出子電路；信號輸入子電路被配置為在輸入控制信號端（EM1）、第一電源端（VDD）、第一節點（N1）和第三節點（N3）的信號的控制下，輸入電流源信號端（IREF）的第一電流信號；信號保持子電路被配置為在保持控制信號端（EM2）和接地端（EM2）的信號的控制下，向第二節點（N2）提供第一節點（N1）的信號，向第四節點（N4）提供第三節點（N3）的信號；信號輸出子電路被配置為在第二節點（N2）、第四節點（N4）和第一電源端（VDD）的信號的控制下，向信號輸出節點（OUTN）輸出第二電流信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">EM1:輸入控制信號端</p>  
        <p type="p">EM2:保持控制信號端</p>  
        <p type="p">GND:接地端</p>  
        <p type="p">IREF:電流源信號端</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">N4:第四節點</p>  
        <p type="p">OUTN:信號輸出節點</p>  
        <p type="p">VDD:第一電源端</p>  
        <p type="p">VSS:第二電源端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="983" publication-number="202620041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含抗ＰＣＳＫ９抗體的組成物</chinese-title>  
        <english-title>COMPOSITIONS COMPRISING ANTI-PCSK9 ANTBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/18</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">C07K1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, QIAN VERONICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯寇尼　喬瑟夫　艾德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASCONI, JOSEPH EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯林斯　琳達　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLLINS, LINDA S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康寧漢　卡麥隆　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUNNINGHAM, CAMERON RAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　鍾琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHONGQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬洛尼　安德魯　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALONEY, ANDREW JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了包含抗PCSK9抗體如依洛尤單抗的單體和二聚物的組成物。本文描述了確定包含依洛尤單抗的組成物中二聚物的存在、不存在或量的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions comprising a monomer and a dimer of an anti-PCSK9 antibody such as evolocumab are described herein. Methods of determining the presence, absence, or amount of a dimer in a composition comprising evolocumab are described herein.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="984" publication-number="202621243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括作用部分及位元線之半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING ACTIVE PORTION AND BIT LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓銀洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, EUNSHOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴贊訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, CHANHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全夏英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HAYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所提供者為一種半導體裝置，其包括：一第一作用部分；一隔離區，其在該第一作用部分之一側表面上；以及一位元線，其連接至該第一作用部分，其中該第一作用部分包括與該隔離區接觸之一第一區及從該第一區向上延伸之一第二區，其中該第二區與該隔離區間隔開，且其中該位元線包括：一線部分，其在一第一水平方向上延伸；以及一接觸部分，其在該線部分下面，其中該接觸部分連接至該第一作用部分之該第二區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a semiconductor device including: a first active portion; an isolation region on a side surface of the first active portion; and a bit line connected to the first active portion, wherein the first active portion includes a first region in contact with the isolation region and a second region extending upwardly from the first region, wherein the second region is spaced apart from the isolation region, and wherein the bit line includes: a line portion extending in a first horizontal direction; and a contact portion below the line portion, wherein the contact portion is connected to the second region of the first active portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:緩衝絕緣結構</p>  
        <p type="p">6a:第一絕緣層</p>  
        <p type="p">6b:第二絕緣層</p>  
        <p type="p">6c:第三絕緣層</p>  
        <p type="p">12a:第一傳導層、傳導層、層</p>  
        <p type="p">12b,12c:第二傳導層、傳導層、層</p>  
        <p type="p">30:內間隔件</p>  
        <p type="p">36:插塞間隔件</p>  
        <p type="p">36a:間隔件襯裡</p>  
        <p type="p">36b:間隔件圖案</p>  
        <p type="p">42:中間間隔件</p>  
        <p type="p">45:外間隔件</p>  
        <p type="p">55:下傳導層</p>  
        <p type="p">A:區</p>  
        <p type="p">ACT1(AF1):第一作用區、第一作用部分</p>  
        <p type="p">ACT2(AF2):第二作用區、第二作用部分</p>  
        <p type="p">AF1_U,AF2_U:上表面</p>  
        <p type="p">AP1:第一區</p>  
        <p type="p">AP1S:第一側表面</p>  
        <p type="p">AP2:第二區</p>  
        <p type="p">AP2S:第二側表面、側表面</p>  
        <p type="p">APB:彎曲部分</p>  
        <p type="p">BL(BL1),BL(BL2):元件符號、位元線、位元線結構</p>  
        <p type="p">CP:接觸部分</p>  
        <p type="p">H1,H2:高度差</p>  
        <p type="p">L1:第一層級</p>  
        <p type="p">L2:第二層級</p>  
        <p type="p">L3:第三層級</p>  
        <p type="p">LP:線部分、接觸部分</p>  
        <p type="p">SP:絕緣間隔件結構</p>  
        <p type="p">SP_C:接點間隔件</p>  
        <p type="p">SP_L:線間隔件</p>  
        <p type="p">STI,STIa:隔離區</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="985" publication-number="202620114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含含有烯烴和酸酐官能基的多環烯烴聚合物及三聚氰胺之無鹵無磷低損耗阻燃性組成物</chinese-title>  
        <english-title>HALOGEN FREE AND PHOSPHORUS FREE LOW LOSS FLAME RETARDANT COMPOSITIONS CONTAINING POLYCYCLIC-OLEFINIC POLYMER WITH OLEFINIC AND ANHYDRIDE FUNCTIONALITY AND MELAMINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08K3/22</main-classification>  
        <further-classification edition="200601120260213B">C08K5/3492</further-classification>  
        <further-classification edition="200601120260213B">C08K7/14</further-classification>  
        <further-classification edition="200601120260213B">C08L45/00</further-classification>  
        <further-classification edition="200601120260213B">C08J5/04</further-classification>  
        <further-classification edition="200601120260213B">C08J5/18</further-classification>  
        <further-classification edition="200601120260213B">C08J5/24</further-classification>  
        <further-classification edition="200601120260213B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普羅梅勒斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROMERUS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崁達那拉曲奇　帕拉蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDANARACHCHI, PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之實施形態包括一種組成物，其包含由各種多環烯烴單體形成之聚合物摻混物（其中至少一種單體含有烯烴官能基，另一種單體含有酸酐官能基）、三聚氰胺、蒙脫石及根據需要的其他填料如二氧化矽、交聯劑、自由基起始劑、增黏劑及一種以上合適的添加劑。本發明的組成物在曝光於合適的高溫下時能夠形成各種三維絕緣物如膜。由本發明的組成物形成之物體顯示出至今未能實現的低介電常數、低損耗特性、阻燃性及極高的熱特性。本發明的組成物可用於各種應用中，包括在毫米波雷達天線中作為絕緣材料等。由本發明的組成物形成之膜顯示出至少為V-1的UL-94等級、未達2.8的介電常數（Dk）及未達0.002的介電損耗因數（Df）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments in accordance with the present invention encompass compositions containing a blend of polymers formed from a variety of polycycloolefinic monomers at least one of which monomer contains an olefinic functionality and another monomer contains an anhydride functionality, melamine, montmorillonite and optionally other fillers such as silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="986" publication-number="202621489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在基板處理中使用製程冷卻水之增強型安全系統、用於基板處理系統中之安全保障方法、及用於使用製程冷卻水之基板處理設備的安全系統</chinese-title>  
        <english-title>ENHANCED SAFETY SYSTEM USING PROCESS COOLING WATER IN SUBSTRATE PROCESSING, SAFETY SECURING METHOD USED IN SUBSTRATE PROCESSING SYSTEM, AND SAFETY SYSTEM FOR SUBSTRATE PROCESSING APPARATUS USING PROCESS COOLING WATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W40/00</main-classification>  
        <further-classification edition="200601120260223B">F25D29/00</further-classification>  
        <further-classification edition="200601120260223B">G08B21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托塔帕伊爾　阿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOTTAPPAYIL, ARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGBAEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理中之安全系統包含：一基板處理設備，其經組態以處理基板，該設備包含一腔室及一噴淋頭；一輸入管線，其經組態以自一外部製程冷卻水(PCW)源接收一PCW，以用於冷卻該基板處理設備；一進口閥，其安置於該輸入管線之一入口處，以控制該PCW之輸入；一排洩管線，其經組態以自該基板處理設備收集用於冷卻之該PCW，且排出經收集PCW；複數個通道，其經組態以連接於該輸入管線與該排洩管線之間，且該PCW在該等通道內部流動；以及一安全單元，其經組態以將一壓縮乾燥空氣(CDA)注入該輸入管線中及/或自該等通道及該排洩管線清除該CDA及該PCW。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety system in substrate processing comprises a substrate processing apparatus configured to process the substrates, the apparatus comprising a chamber and a showerhead, an input line configured to receive a process cooling water (PCW) from an outside PCW source for cooling the substrate processing apparatus, an inlet valve disposed at an entrance of the input line to control the input of the PCW, a drain line configured to gather the PCW from the substrate processing apparatus used for cooling and exhaust the gathered PCW, a plurality of channels configured to connect between the input line and the drain line, and the PCW flows inside of the channels and a safety unit configured to inject a compressed dry air (CDA) into the input line and/or purge the CDA and the PCW from the plurality of channels and the drain line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:設備/基板處理設備/系統</p>  
        <p type="p">101:反應腔室/組件</p>  
        <p type="p">102:噴淋頭/組件</p>  
        <p type="p">103:遠端電漿單元/組件</p>  
        <p type="p">110:製程冷卻水(PCW)源</p>  
        <p type="p">120:輸入管線</p>  
        <p type="p">121:排洩管線</p>  
        <p type="p">122:進口閥</p>  
        <p type="p">130:安全單元</p>  
        <p type="p">131:氣箱</p>  
        <p type="p">132:控制器</p>  
        <p type="p">133:閥/進氣閥/空氣輸入閥</p>  
        <p type="p">134:閥/排氣閥/空氣輸出閥</p>  
        <p type="p">135:洩漏托盤</p>  
        <p type="p">A:通道</p>  
        <p type="p">B:通道</p>  
        <p type="p">C:通道</p>  
        <p type="p">M:輸入流動路徑</p>  
        <p type="p">N:輸出流動路徑</p>  
        <p type="p">X:進氣路徑</p>  
        <p type="p">Y:排氣路徑</p>  
        <p type="p">Z:洩漏路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="987" publication-number="202620290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於海上儲存一或多個浮動風力發電機的組成構件的浮動結構及組件</chinese-title>  
        <english-title>FLOATING STRUCTURE FOR AFLOAT STORING A CONSTITUENT MEMBER OF ONE OR MORE FLOATING WIND TURBINES AND ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260209B">F03D13/25</main-classification>  
        <further-classification edition="200601120260209B">B63B35/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商薩菲爾工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAFIER INGENIERIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩菲爾　埃爾查南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAFIER, ELCHANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於浮動結構（2），用於海上儲存一個或多個浮動風力發電機（4）的組成構件，包含浮選裝置，包含至少一個浮選構件（20），配置為浸沒，以及至少一個浮選元件（22），固定至浮選構件（20），海上儲存平台（2）包含至少一個容納空間（12），用於接收浮動風力發電機（4）的組成構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a floating structure (2) for afloat storing a constituent member of one or more floating wind turbines (4), comprising a flotation means comprising at least one flotation member (20) configured to be immersed and at least one flotation element (22) secured to the flotation member (20), the floating storage platform (2) comprising at least one reception volume (12) for receiving a constituent member of the floating wind turbine (4).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:組件</p>  
        <p type="p">2:浮動結構</p>  
        <p type="p">4:浮動風力發電機</p>  
        <p type="p">6:第一縱向端部</p>  
        <p type="p">8:第二縱向端部</p>  
        <p type="p">10:主框架</p>  
        <p type="p">12:容納空間</p>  
        <p type="p">20:浮選構件</p>  
        <p type="p">22:浮選構件/第一浮選元件/第二浮選元件</p>  
        <p type="p">24:繫泊系統</p>  
        <p type="p">26:中位區域</p>  
        <p type="p">28:臂</p>  
        <p type="p">28A:下臂/第一下臂/第二下臂</p>  
        <p type="p">L:縱向軸/縱向方向</p>  
        <p type="p">T:橫向軸</p>  
        <p type="p">V:垂直軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="988" publication-number="202619951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢查及儲存倍縮光罩之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR INSPECTING AND STORING RETICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">B65G1/02</main-classification>  
        <further-classification edition="201201120260204B">G03F1/84</further-classification>  
        <further-classification edition="200601120260204B">B65G49/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐國斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, GUOBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡迪爾卡　阿普爾瓦　曼尼許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHADILKAR, APOORVA MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿努拉達　阿努拉達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANURADHA, ANURADHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYEONG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿戈利　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGOLLI, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷利　約翰　奧斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRALEY, JOHN AUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞巴洛　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEBALLO, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾倫　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOLEN, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述檢查及儲存一倍縮光罩處置器內之倍縮光罩。該倍縮光罩處置器包含一倍縮光罩檢查系統及倍縮光罩儲存器。該檢查及儲存包含：判定該倍縮光罩儲存器中之一儲存位置是否可用，及判定該倍縮光罩檢查系統是否在使用中。回應於判定該儲存位置可用且判定該倍縮光罩檢查系統不在使用中，移動一倍縮光罩以供該倍縮光罩檢查系統檢查。回應於該倍縮光罩滿足一檢查要求，將該倍縮光罩移動至該儲存位置以儲存該倍縮光罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Inspecting and storing reticles within a reticle handler is described. The reticle handler comprises a reticle inspection system and reticle storage. The inspection and storage comprises determining whether a storage location in the reticle storage is available, and determining whether the reticle inspection system is in use. Responsive to determining that the storage location is available and determining that the reticle inspection system is not in use, a reticle is moved for inspection by the reticle inspection system. Responsive to the reticle meeting an inspection requirement, the reticle is moved to the storage location to store the reticle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:系統</p>  
        <p type="p">502:倍縮光罩處置器</p>  
        <p type="p">504:處理器</p>  
        <p type="p">506:倍縮光罩檢查系統</p>  
        <p type="p">508:倍縮光罩儲存器</p>  
        <p type="p">510:微影設備</p>  
        <p type="p">512:移動臂</p>  
        <p type="p">514:夾緊器</p>  
        <p type="p">516:使用者介面</p>  
        <p type="p">518:裝載埠</p>  
        <p type="p">520:儲存位置</p>  
        <p type="p">530:倍縮光罩</p>  
        <p type="p">540:單一倍縮光罩盒</p>  
        <p type="p">550:識別符</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="989" publication-number="202620236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有偏移式上部反射器的腔室配置、半導體處理系統以及製造腔室配置及將材料層沉積至基板上的相關方法</chinese-title>  
        <english-title>CHAMBER ARRANGEMENTS WITH OFFSET UPPER REFLECTORS, SEMICONDUCTOR PROCESSING SYSTEMS, AND RELATED METHODS OF MAKING CHAMBER ARRANGEMENTS AND DEPOSITING MATERIAL LAYERS ONTO SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/46</main-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹姆斯　羅賓森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAMES, ROBINSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科斯拉　奈娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOSLA, NAYNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬德哈里　尼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOUDHARY, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇拉娜　米蒂莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURANA, MITISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彦夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YANFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬希斯瓦蘭　布貝西　巴卜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOTHEESWARAN, BUBESH BABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱巴夫法拉　阿米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJBAFVALA, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密斯金　卡列布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISKIN, CALEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪摩斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMOS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德葉　格雷戈里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEYE, GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吕景璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, JINGXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WENTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周潤鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, ION HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, JUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種腔室配置，該腔室配置包括：一腔室主體，其具有帶有一注入端及一縱向相對之排氣端的一腔室主體；一基板支撐件，其配置於該腔室主體內且經支撐以在該腔室主體中圍繞一旋轉軸旋轉；及一上部反射器，其支撐於該腔室主體上方且在其中限定一側向外部第一弓形凹槽及一側向外部第二弓形凹槽。該側向外部第一弓形凹槽與該旋轉軸分隔一第一弓形凹槽側向偏移，該側向外部第二弓形凹槽與該旋轉軸分隔一第二弓形凹槽側向偏移，且該第二弓形凹槽側向偏移大於或小於該第一弓形凹槽側向偏移。本文亦描述了半導體處理系統及材料層沉積方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chamber arrangement includes a chamber body having a chamber body with an injection end and a longitudinally opposite exhaust end, a substrate support arranged within the chamber body and supported for rotation therein rotation about a rotation axis, and an upper reflector supported above the chamber body and defining therein a laterally-outer first arcuate recess and a laterally-outer second arcuate recess. The laterally-outer first arcuate recess is separated from the rotation axis by a first arcuate recess lateral offset, the laterally outer second arcuate recess separated from the rotation axis by a second arcuate recess lateral offset, and the second arcuate recess lateral offset greater than or less than the first arcuate recess lateral offset. Semiconductor processing systems and material layer deposition methods are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:基板</p>  
        <p type="p">4:材料層</p>  
        <p type="p">104:腔室配置</p>  
        <p type="p">111:下部腔室高度</p>  
        <p type="p">113:上部腔室高度</p>  
        <p type="p">115:閘閥</p>  
        <p type="p">126:腔室主體</p>  
        <p type="p">128:注入凸緣</p>  
        <p type="p">130:排氣凸緣</p>  
        <p type="p">134:分隔件</p>  
        <p type="p">136:基板支撐件</p>  
        <p type="p">138:支撐構件</p>  
        <p type="p">140:軸構件</p>  
        <p type="p">142:升降與旋轉模組</p>  
        <p type="p">144:陶瓷材料</p>  
        <p type="p">146:注入端</p>  
        <p type="p">148:排氣端</p>  
        <p type="p">150:內部</p>  
        <p type="p">152:上壁</p>  
        <p type="p">154:下壁</p>  
        <p type="p">156:第一側壁</p>  
        <p type="p">158:第二側壁</p>  
        <p type="p">160:外部肋</p>  
        <p type="p">162:外表面</p>  
        <p type="p">182:不透明材料</p>  
        <p type="p">184:上部腔室</p>  
        <p type="p">186:下部腔室</p>  
        <p type="p">188:分隔件孔</p>  
        <p type="p">190:旋轉軸</p>  
        <p type="p">192:不透明材料</p>  
        <p type="p">200:上部加熱器元件陣列</p>  
        <p type="p">300:上部反射器</p>  
        <p type="p">400:下部加熱器元件陣列</p>  
        <p type="p">500:下部反射器</p>  
        <p type="p">600:非接觸式溫度感測器/第一基板高溫計</p>  
        <p type="p">604:第二基板高溫計</p>  
        <p type="p">606:第三基板高溫計</p>  
        <p type="p">608:腔室高溫計</p>  
        <p type="p">616:冷卻劑</p>  
        <p type="p">R:旋轉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="990" publication-number="202620317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具備應變計式轉矩檢測裝置之諧波齒輪裝置</chinese-title>  
        <english-title>STRAIN WAVE GEARING EQUIPPED WITH STRAIN GAUGE TYPE TORQUE DETECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">F16H1/32</main-classification>  
        <further-classification edition="200601120260213B">G01L3/02</further-classification>  
        <further-classification edition="200601120260213B">G01L3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商哈默納科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARMONIC DRIVE SYSTEMS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀內雅士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIUCHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井秀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">諧波齒輪裝置(1)具備有應變計式轉矩檢測裝置(5)。應變計(6)的應變計網格(61)，涵蓋外齒齒輪(3)的轂部內側端面(34a)與隔膜內側端面(33a)的交界線(36)，而貼在轂部內側端面(34a)及隔膜內側端面(33a)。相較於將應變計網格(61)全體貼在隔膜內側端面(33a)的情況，可得到旋轉波紋較少且線性度優異的應變計輸出，且能進行高精度的轉矩檢測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:外齒齒輪</p>  
        <p type="p">3a:中心軸線</p>  
        <p type="p">6,6(A1,A2),6(B1,B2),6(C1,C2),6(D1,D2),6(E1,E2),6(F1,F2),6(G1,G2),6(H1,H2):應變計</p>  
        <p type="p">7:轉矩檢測部</p>  
        <p type="p">7A:惠斯登電橋電路</p>  
        <p type="p">31:外齒</p>  
        <p type="p">32:圓筒狀本體部</p>  
        <p type="p">32a:內周面</p>  
        <p type="p">33:隔膜</p>  
        <p type="p">33a:隔膜內側端面</p>  
        <p type="p">34:轂部</p>  
        <p type="p">34a:轂部內側端面</p>  
        <p type="p">34b:圓形外周面</p>  
        <p type="p">35:螺栓孔</p>  
        <p type="p">36:交界線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="991" publication-number="202620085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共聚物、包含共聚物之組合物及其硬化體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08F232/06</main-classification>  
        <further-classification edition="200601120260209B">C08F255/08</further-classification>  
        <further-classification edition="200601120260209B">C08F297/06</further-classification>  
        <further-classification edition="200601120260209B">C09D153/02</further-classification>  
        <further-classification edition="200601120260209B">C08L101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石博久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, HIROHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野辰哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石垣雄平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGAKI, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種α烯烴-環狀烯烴-芳香族乙烯基化合物-芳香族多烯共聚物，其中未硬化狀態之共聚物於測定頻率40 GHz下之介電常數未達2.5，介電損耗正切未達0.0007，25℃下測得之儲存彈性模數未達1000 MPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="992" publication-number="202619787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電去離子裝置及其運轉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B01D61/52</main-classification>  
        <further-classification edition="200601120260202B">B01D61/48</further-classification>  
        <further-classification edition="200601120260202B">B01D61/54</further-classification>  
        <further-classification edition="202301120260202B">C02F1/469</further-classification>  
        <further-classification edition="202301120260202B">C02F1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川晴義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, HARUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部幸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林英夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大河原正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWARA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石飛洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHITOBI, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田力弘道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIKARA, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電去離子裝置1是並列設置子塊3A～子塊3F而成。在該些子塊3A～3F的單元的上側的兩端部形成有配設供水管線4的供水端口4A、供水端口4B。在單元的下側的兩端部形成有配設濃縮水供給管線6的濃縮水供水端口6A、濃縮水供水端口6B。在濃縮水供給管線6的左右兩側分別設置有定流量閥11A、定流量閥11B，並且在濃縮廢水流出管線7的左右兩側分別設置有手動閥12A、手動閥12B。若為此種電去離子裝置，則可效率良好地製造高水質的處理水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電去離子裝置</p>  
        <p type="p">2:框架</p>  
        <p type="p">3A、3B、3C、3D、3E、3F:子塊</p>  
        <p type="p">4:供水管線</p>  
        <p type="p">4A、4B:供水端口</p>  
        <p type="p">5:處理水流出管線</p>  
        <p type="p">5A、5B:處理水流出端口</p>  
        <p type="p">6:濃縮水供給管線</p>  
        <p type="p">6A、6B:濃縮水供水端口</p>  
        <p type="p">7:濃縮廢水流出管線</p>  
        <p type="p">7A、7B:濃縮廢水流出端口</p>  
        <p type="p">8:負極室(陰極室、負極)</p>  
        <p type="p">9:正極室(陽極室、陽極)</p>  
        <p type="p">10:電源箱</p>  
        <p type="p">11A、11B:定流量閥(流量控制部件)</p>  
        <p type="p">12A、12B:手動閥(流量控制部件)</p>  
        <p type="p">W1:被處理水(供水)</p>  
        <p type="p">W2:處理水</p>  
        <p type="p">W3:濃縮水</p>  
        <p type="p">W4:濃縮廢水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="993" publication-number="202621234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123829</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B10/00</main-classification>  
        <further-classification edition="202501120251103B">H10D62/17</further-classification>  
        <further-classification edition="202501120251103B">H10D64/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峰銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包括：主動區，包括半導體鰭片基座、於半導體鰭片基座上的多個奈米結構的堆疊、以及於半導體鰭片基座上的磊晶部件，磊晶部件連接至奈米結構的至少一者，主動區在第一方向上長度延伸。半導體結構更包括：閘極結構，包繞每個奈米結構，閘極結構在第二方向上長度延伸，第二方向垂直於第一方向；以及背側對接接觸件，設置於磊晶部件和閘極結構正下方，且電性連接至磊晶部件和閘極結構。背側對接接觸件的一部分延伸進入閘極結構和磊晶部件中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes an active region including a semiconductor fin base, a stack of nanostructures over the semiconductor fin base, and an epitaxial feature over the semiconductor fin base and connected to at least one of the nanostructures, the active region extending lengthwise in a first direction. The semiconductor structure further includes a gate structure wrapping around each of the nanostructures, the gate structure extending lengthwise in a second direction perpendicular to the first direction, and a backside butted contact disposed directly under and electrically connected to the epitaxial feature and the gate structure. A portion of the backside butted contact extends into the gate structure and the epitaxial feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:閘極結構</p>  
        <p type="p">22’:閘極結構</p>  
        <p type="p">24:閘極結構</p>  
        <p type="p">24’:閘極結構</p>  
        <p type="p">44:第三鰭狀垂直堆疊</p>  
        <p type="p">44b:基部</p>  
        <p type="p">48C:通道構件</p>  
        <p type="p">100:四方單元</p>  
        <p type="p">110:第二介電層</p>  
        <p type="p">112:第二層接觸蝕刻停止層</p>  
        <p type="p">114:第二層間介電層</p>  
        <p type="p">116:第一前側介電層</p>  
        <p type="p">120:源極/汲極部件</p>  
        <p type="p">122:水平</p>  
        <p type="p">124:水平</p>  
        <p type="p">140:前側互連層</p>  
        <p type="p">170:背側互連層</p>  
        <p type="p">172:背側對接接觸件</p>  
        <p type="p">172a:背側對接接觸件</p>  
        <p type="p">172b:背側對接接觸件</p>  
        <p type="p">172c:背側對接接觸件</p>  
        <p type="p">172d:背側對接接觸件</p>  
        <p type="p">174:介電襯層</p>  
        <p type="p">175:矽化物層</p>  
        <p type="p">186:鰭片切割部件</p>  
        <p type="p">Wx:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="994" publication-number="202621389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理裝置</chinese-title>  
        <english-title>PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification>  
        <further-classification edition="201201120260223B">B24B37/07</further-classification>  
        <further-classification edition="201201120260223B">B24B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤裕一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大田浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙田暢行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKADA, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供能夠在短時間內處理基板的技術。處理裝置（1）具備：台（10），構成為以使基板（Wf）的被處理面朝向上方的方式保持基板；台旋轉裝置（20），構成為使台旋轉；多個頭（30a、40a），多個頭分別安裝有面積比基板的被處理面的面積小的處理墊（Pd1、Pd2）；多個頭；多個頭旋轉裝置（50a、55a）；多個按壓裝置（60a、65a），多個按壓裝置分別具有電磁促動器，該電磁促動器構成為，利用電磁力對多個頭分別施加按壓力；以及多個擺動裝置（70a、80a）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理裝置</p>  
        <p type="p">10:台</p>  
        <p type="p">20:台旋轉裝置</p>  
        <p type="p">21:台旋轉軸</p>  
        <p type="p">22:台驅動裝置</p>  
        <p type="p">30a:第一頭/頭</p>  
        <p type="p">30b:第三頭/頭</p>  
        <p type="p">40a:第二頭/頭</p>  
        <p type="p">40b:第四頭/頭</p>  
        <p type="p">50a:第一頭旋轉裝置/頭旋轉裝置</p>  
        <p type="p">50b:第三頭旋轉裝置/頭旋轉裝置</p>  
        <p type="p">51a:頭旋轉軸</p>  
        <p type="p">51b:頭旋轉軸</p>  
        <p type="p">55a:第二頭旋轉裝置/頭旋轉裝置</p>  
        <p type="p">55b:第四頭旋轉裝置/頭旋轉裝置</p>  
        <p type="p">56a:頭旋轉軸</p>  
        <p type="p">56b:頭旋轉軸</p>  
        <p type="p">60a:第一按壓裝置</p>  
        <p type="p">60b:第三按壓裝置</p>  
        <p type="p">65a:第二按壓裝置</p>  
        <p type="p">65b:第四按壓裝置</p>  
        <p type="p">70a:第一擺動裝置</p>  
        <p type="p">70b:第三擺動裝置</p>  
        <p type="p">71a:臂</p>  
        <p type="p">71b:臂</p>  
        <p type="p">72a:擺動軸</p>  
        <p type="p">72b:擺動軸</p>  
        <p type="p">73a:驅動裝置</p>  
        <p type="p">73b:驅動裝置</p>  
        <p type="p">80a:第二擺動裝置</p>  
        <p type="p">80b:第四擺動裝置</p>  
        <p type="p">81a:臂</p>  
        <p type="p">81b:臂</p>  
        <p type="p">82a:擺動軸</p>  
        <p type="p">82b:擺動軸</p>  
        <p type="p">83a:驅動裝置</p>  
        <p type="p">83b:驅動裝置</p>  
        <p type="p">90:處理液供給裝置</p>  
        <p type="p">91:處理液供給噴嘴</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">101:處理器</p>  
        <p type="p">102:存儲裝置</p>  
        <p type="p">110:感測器組</p>  
        <p type="p">111:膜厚感測器</p>  
        <p type="p">120:連接部件</p>  
        <p type="p">Pd1:第一處理墊/處理墊</p>  
        <p type="p">Pd2:第二處理墊/處理墊</p>  
        <p type="p">Pd3:第三處理墊/處理墊</p>  
        <p type="p">Pd4:第四處理墊/處理墊</p>  
        <p type="p">R1:台旋轉軸的旋轉方向</p>  
        <p type="p">R2:多個頭的旋轉方向</p>  
        <p type="p">Wf:基板</p>  
        <p type="p">Wfa:被處理面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="995" publication-number="202619802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高度調整用工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B05C11/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田彰彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田所和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADOKORO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂井勇治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>重本北斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGEMOTO, HOKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]容易調整液處理裝置的杯部之高度。 &lt;br/&gt;　　[解決手段]本公開之一側面相關的高度調整用工具係一種用以調整在對基板進行液處理的液處理裝置中，被配置為包圍保持基板的保持部的杯部之高度的工具。該高度調整用工具具備：能夠載置於保持部上而被形成的基部；以至少一部分位於較基部更上方之方式，被配置在與基部交叉之中心軸周圍的三個作業對象部；被配置在中心軸周圍，並測量杯部之高度的三個以上的測量部；以及被設置於基部上，能夠拆裝地安裝藉由作業者所把持的把持構件之拆裝安裝部。三個作業對象部之各者能夠被連接至在液處理裝置中被設置於保持部之下方並使杯部之高度上下移動的調整構件。三個以上的測量部所含的三個測量部，被配置在中心軸周圍的圓周方向上與三個作業對象部對應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工具</p>  
        <p type="p">110:基部</p>  
        <p type="p">120,120A,120B,120C:作業對象部</p>  
        <p type="p">130,130A,130B:測量部</p>  
        <p type="p">138:支架</p>  
        <p type="p">140:把持構件</p>  
        <p type="p">150:拆裝安裝部</p>  
        <p type="p">164:引導部</p>  
        <p type="p">166:引導部</p>  
        <p type="p">170:中繼連接器</p>  
        <p type="p">Ax1:中心軸</p>  
        <p type="p">D1,D2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="996" publication-number="202619692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸收性物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A61F5/44</main-classification>  
        <further-classification edition="200601120260209B">A61F13/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大王製紙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIO PAPER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>與那霸獎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONAHA, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊東莉菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, RINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田芽依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種吸收性物品，具有不透液性的背片、及被配置於前述背片的肌膚側之肌膚側構造部；前述肌膚側構造部，包含被直接配置於前述背片的肌膚側之吸收體部、及被配置於前述吸收體部的肌膚側之透液性的頂片；具有由前述背片與前述肌膚側構造部沒有固定而成的非固定區域、及包含藉由黏接劑來將前述背片與前述吸收體部和前述頂片的至少一方加以固定的區域且使前述背片與前述肌膚側構造部不可相對滑動的固定區域；在前述非固定區域中的前述背片與前述肌膚側構造部可相對滑動；前述黏接劑，具有自肌膚側和非肌膚側的至少一方在視覺上可識別的顏色。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸收性物品</p>  
        <p type="p">2:背片</p>  
        <p type="p">8:固定區域</p>  
        <p type="p">9:非固定區域</p>  
        <p type="p">bd:吸收體部本體(本體)</p>  
        <p type="p">W:翼</p>  
        <p type="p">CL:前後方向中心線(中心線)</p>  
        <p type="p">D1:前後方向(長邊方向)</p>  
        <p type="p">D2:橫方向(短邊方向、寬度方向)</p>  
        <p type="p">E1:前方區域</p>  
        <p type="p">C:中央區域</p>  
        <p type="p">E2:後方區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="997" publication-number="202620386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置</chinese-title>  
        <english-title>INSPECTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260223B">G01J5/80</main-classification>  
        <further-classification edition="202201120260223B">G01J5/00</further-classification>  
        <further-classification edition="200601120260223B">G01J5/10</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤友和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TOMOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田勝男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUTA, KATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在使用紅外線感測器以非接觸方式測定具有複數個被檢查體之晶圓的表面溫度時，能夠修正產生誤差的因素，並能高精度地進行測定。 &lt;br/&gt;　　本發明是一種檢查裝置，在使電性接觸子接觸晶圓上的被檢查體的電極端子，並透過電性接觸子，使測試儀與被檢查體之間電性連接，從而檢查被檢查體的檢查裝置中，具備：支持晶圓的晶圓支持部、至少以晶圓為測定對象，對晶圓所放射的紅外線進行受光的紅外線受光部、及基於紅外線受光部所受光之紅外線的紅外線放射量，控制測定對象之溫度測定的溫度測定控制部，溫度測定控制部具有修正基於晶圓的紅外線放射量之測定溫度的溫度修正部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:檢查裝置</p>  
        <p type="p">10:溫度測量裝置</p>  
        <p type="p">11:連接配線</p>  
        <p type="p">12:光纖</p>  
        <p type="p">13:紅外線受光部</p>  
        <p type="p">14:探針卡</p>  
        <p type="p">15:探針組裝體</p>  
        <p type="p">16:紅外線感測器</p>  
        <p type="p">17:探針</p>  
        <p type="p">18:電性連接單元</p>  
        <p type="p">19:測試頭</p>  
        <p type="p">20:晶圓</p>  
        <p type="p">30:黑體</p>  
        <p type="p">40:夾具</p>  
        <p type="p">41:黑體載置部</p>  
        <p type="p">50:探針台</p>  
        <p type="p">51:θ軸平台</p>  
        <p type="p">52:Z軸平台</p>  
        <p type="p">53:Y軸平台</p>  
        <p type="p">54:X軸平台</p>  
        <p type="p">61:距離感測器</p>  
        <p type="p">62:光纖</p>  
        <p type="p">100:測定溫度校正部</p>  
        <p type="p">101:溫度取得部</p>  
        <p type="p">102:放射量導出部</p>  
        <p type="p">103:校正部</p>  
        <p type="p">104:記憶部</p>  
        <p type="p">104a:基準表</p>  
        <p type="p">105:溫度導出部</p>  
        <p type="p">110:溫度修正部</p>  
        <p type="p">111:Z位置溫度修正部</p>  
        <p type="p">112:環境溫度修正部</p>  
        <p type="p">113:光纖溫度修正部</p>  
        <p type="p">114:套管溫度修正部</p>  
        <p type="p">120:溫度顯示部</p>  
        <p type="p">191:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="998" publication-number="202620986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插座模組及包括其之插座裝置</chinese-title>  
        <english-title>SOCKET MODULE AND SOCKET DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250721B">H01R24/20</main-classification>  
        <further-classification edition="200601120250721B">H01R13/04</further-classification>  
        <further-classification edition="200601120250721B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐明豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種插座模組。所述插座模組包括蓋件、插座件、彈性件以及第一鎖固件及第二鎖固件。插座件穿設於蓋件上，且插座件包括一第一引腳，其中第一引腳作為接地線。彈性件卡設於蓋件中，電性接觸於插座件，且電性連接於第一引腳。第一鎖固件及第二鎖固件沿著不同方向抵接並擠壓彈性件，彈性件透過第一鎖固件及第二鎖固件鎖固於蓋件中，其中彈性件為一封閉式結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A socket module is provided. The socket module includes a cover member, a socket member, an elastic member, a first locking member and a second locking member. The socket member passes through the cover member, and the socket member includes a first pin. The first pin serves as a ground wire. The elastic member is clamped in the cover member, in electrical contact with the socket member, and is electrically connected to the first pin. The first locking member and the second locking member contact and press the elastic member in different directions. The elastic member is locked in the cover member through the first locking member and the second locking member, and the elastic member has a closed structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:插座模組</p>  
        <p type="p">11a:彈性件</p>  
        <p type="p">111:蓋件</p>  
        <p type="p">112:插座件</p>  
        <p type="p">112a:基座</p>  
        <p type="p">112b:導電環</p>  
        <p type="p">112c1:第一引腳</p>  
        <p type="p">112c2:第二引腳</p>  
        <p type="p">112c3:第三引腳</p>  
        <p type="p">113a:第一鎖固件</p>  
        <p type="p">113b:第二鎖固件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="999" publication-number="202621507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/62</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳美燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王茹立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭仲淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖文祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周佩吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PEI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯焜騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, KUN-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，其包括電子單元、保護層、封裝層、導電構件、接合組件以及外部組件。電子單元包括第一導電墊。保護層設置於電子單元上。封裝層圍繞電子單元以及保護層。導電構件設置於保護層中且重疊第一導電墊。接合組件設置於導電構件上且重疊第一導電墊。外部組件設置於接合組件上且包括第二導電墊。外部組件通過接合組件與導電構件電性連接至第一導電墊。第二導電墊重疊第一導電墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device including an electronic unit including a first conductive pad, a protective layer disposed on the electronic unit, a molding layer surrounding the electronic unit and the protective layer, a conductive component disposed in the protective layer and overlapped with the first conductive pad, a bonding component disposed on the conductive component and overlapped with the first conductive pad, and an external component disposed on the bonding component and including a second conductive pad overlapped with the first conductive pad. The external component is electrically connected to the first conductive pad through the bonding component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:電子單元</p>  
        <p type="p">102:電子元件</p>  
        <p type="p">104:第一導電墊</p>  
        <p type="p">106:鈍化層</p>  
        <p type="p">106t、110t:厚度</p>  
        <p type="p">110:保護層</p>  
        <p type="p">120:封裝層</p>  
        <p type="p">130:導電構件</p>  
        <p type="p">140:接合組件</p>  
        <p type="p">150:外部組件</p>  
        <p type="p">152:電路板</p>  
        <p type="p">154:第二導電墊</p>  
        <p type="p">CP1:連接墊</p>  
        <p type="p">H1:高度</p>  
        <p type="p">UF1:填充層</p>  
        <p type="p">W1、W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1000" publication-number="202620104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、樹脂組成物之製造法、及聚醯亞胺薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">C08J5/18</main-classification>  
        <further-classification edition="200601120260206B">C08F122/40</further-classification>  
        <further-classification edition="200601120260206B">C08G73/10</further-classification>  
        <further-classification edition="200601120260206B">B32B27/06</further-classification>  
        <further-classification edition="200601120260206B">B32B27/34</further-classification>  
        <further-classification edition="200601120260206B">H05K1/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧本奈織美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIMOTO, NAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米蟲治美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEMUSHI, HARUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涌井洋行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKUI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，其係包含含有聚醯亞胺前驅物與溶媒之樹脂組成物，其中前述聚醯亞胺前驅物包含苯均四酸二酐及3,3’,4,4’-聯苯四甲酸二酐作為四甲酸二酐成分，包含2,2’-雙(三氟甲基)聯苯胺作為二胺成分，且為四甲酸二酐成分與二胺成分的共聚物，前述聚醯亞胺前驅物的重量平均分子量為260,000～1,000,000，前述樹脂組成物中的前述聚醯亞胺前驅物的濃度為5～20質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1001" publication-number="202620292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空泵內降低功耗</chinese-title>  
        <english-title>REDUCING POWER CONSUMPTION IN VACUUM PUMPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">F04C25/02</main-classification>  
        <further-classification edition="200601120260210B">F04C28/06</further-classification>  
        <further-classification edition="200601120260210B">F04C28/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯普　大衛　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISP, DAVID THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝靜怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JINGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛費爾德　耐吉爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOFIELD, NIGEL PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種機械真空泵及一種調適一機械真空泵之方法。該機械真空泵可為一螺旋泵，且包括：一泵抽機構，其用於將一氣體自一入口泵抽至一出口；一馬達，其用於驅動該泵抽機構；一止回排氣閥；一槽，其提供與該泵抽機構內之氣體流體連通之一體積；及一控制器，其用於控制該真空泵之操作。該控制器經組態以：判定該泵待進入其中該排氣閥閉合之一待機模式；及在該排氣閥閉合之前提高該泵抽機構之一速度達一預定時間以減少該泵及該槽內之一氣體量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mechanical vacuum pump and method of adapting a mechanical vacuum pump are disclosed. The mechanical vacuum pump may be a screw pump and comprises: a pumping mechanism for pumping a gas from an inlet to an outlet; a motor for driving the pumping mechanism; a non-return exhaust valve; a tank providing a volume in fluid communication with gas within the pumping mechanism; and a controller for controlling operation of the vacuum pump. The controller is configured to: determine that the pump is to enter a standby mode in which the exhaust valve is closed; and boost a speed of the pumping mechanism for a predetermined time prior to the exhaust valve closing to reduce an amount of gas within the pump and the tank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:真空泵/螺旋泵</p>  
        <p type="p">10:排氣口</p>  
        <p type="p">12:排氣閥/止回排氣單向閥</p>  
        <p type="p">30:入口閥/隔離閥</p>  
        <p type="p">32:入口</p>  
        <p type="p">40:泵抽機構</p>  
        <p type="p">50:槽</p>  
        <p type="p">52:槽隔離閥/可控閥</p>  
        <p type="p">54:氣體壓載埠/氣體壓載入口埠</p>  
        <p type="p">60:控制器</p>  
        <p type="p">70:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1002" publication-number="202620129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>絕緣膜形成用感光性樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08L79/08</main-classification>  
        <further-classification edition="200601120260203B">C08G73/16</further-classification>  
        <further-classification edition="200601120260203B">C08F20/56</further-classification>  
        <further-classification edition="200601120260203B">C07C227/22</further-classification>  
        <further-classification edition="200601120260203B">C08F2/48</further-classification>  
        <further-classification edition="200601120260203B">G03F7/028</further-classification>  
        <further-classification edition="201901120260203B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千葉朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIBA, ROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯沼洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINUMA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井秀則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻野浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGINO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敦賀健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUGA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種絕緣膜形成用感光性樹脂組成物，其含有選自由聚醯亞胺、聚醯胺酸、及聚醯胺酸酯構成之群組中之至少1種的聚合物、及有機溶劑， &lt;br/&gt;前述聚合物具有光聚合性基， &lt;br/&gt;前述有機溶劑含有下述式(S)表示之溶劑及該式(S)表示之溶劑以外之標準沸點為160℃以下的有機溶劑，相對於100質量%的前述有機溶劑，含有超過10質量%且65質量%以下的前述式(S)表示之溶劑。 &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="217px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(S)中，R&lt;sub&gt;a&lt;/sub&gt;表示碳原子數2~4的烷基。R&lt;sub&gt;b&lt;/sub&gt;及R&lt;sub&gt;c&lt;/sub&gt;各自獨立地表示碳原子數1~3的烷基。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1003" publication-number="202620280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開啟作動輔助裝置及門窗</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">E05F11/53</main-classification>  
        <further-classification edition="200601120260205B">E05F13/02</further-classification>  
        <further-classification edition="200601120260205B">E05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商驪住股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIXIL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中陸義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, RIKUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種操作性及設計性優異、並且零件件數較少而簡易之構成之開啟作動輔助裝置。開啟作動輔助裝置1具備：基座10，設置於隔扇50、50B之門窗前端框34、44、34B、44B、34C，對隔扇之開啟作動進行輔助，被固定於門窗前端框之主視面；拉手部12，具有操作部12a、支點部12b及作用點部12c，上述操作部12a設置於基座之外部，於對隔扇進行開啟作動時被施加力，上述支點部12b由基座之內部所軸支，具有使操作部相對於基座能夠旋轉之旋轉軸121、121，上述作用點部12c設置於基座之內部，與操作部之旋轉連動而旋轉；及作動部14，設置於作用點部，與操作部及作用點部之旋轉連動，相對於基座能夠突出沒入，於自基座突出時推壓框體2之縱框23、24、23B、24B之進深面，操作部之長邊方向之長度與上述基座之長邊方向之長度大致相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、1A、1B:輔助拉手(開啟作動輔助裝置)</p>  
        <p type="p">2、30、40:框體</p>  
        <p type="p">3:內隔扇</p>  
        <p type="p">4:外隔扇</p>  
        <p type="p">12:拉手部</p>  
        <p type="p">12a:操作部</p>  
        <p type="p">21、31、41:上框</p>  
        <p type="p">22、32、42:下框</p>  
        <p type="p">23、24:縱框</p>  
        <p type="p">33:室內框</p>  
        <p type="p">34、44:門窗前端框</p>  
        <p type="p">43:室外框</p>  
        <p type="p">50:隔扇</p>  
        <p type="p">200:門窗</p>  
        <p type="p">G1、G2:複層玻璃</p>  
        <p type="p">X1:內周側</p>  
        <p type="p">X2:外周側</p>  
        <p type="p">Y1:門窗之進深方向之室內側</p>  
        <p type="p">Y2:門窗之進深方向之室外側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1004" publication-number="202620659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Ｉ３Ｃ錯誤狀態測試策略</chinese-title>  
        <english-title>I3C ERROR STATES TEST STRATEGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G06F13/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微晶片科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROCHIP TECHNOLOGY INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維斯瓦納森　維維克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISWANATHAN, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種用於測試I3C裝置的積體電路(IC)。該IC可包括：開始/停止偵測邏輯區塊，用以接收串列資料線(SDA)信號與串列時脈線(SCL)信號，並輸出開始偵測信號及停止偵測信號；SCL計數器區塊，用以接收該SCL信號及這些開始與停止偵測信號，並輸出SCL計數值、SCL正邊緣偵測信號、及SCL負邊緣偵測信號；SDA反相邏輯區塊，用以接收該SCL計數值、SCL程式化計數值、及這些SCL正邊緣及負邊緣偵測信號，並基於該SCL計數值與該SCL程式化計數值的比較而輸出SDA反相啟用信號；及多工器，用以接收該SDA反相啟用信號，並輸出該SDA信號或反相SDA信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit (IC) for testing an I3C device is provided. The IC may include a start/stop detection logic block to receive a serial data line (SDA) signal and a serial clock line (SCL) signal, and output a start detection signal and a stop detection signal, a SCL counter block to receive the SCL signal and the start and stop detection signals, and output a SCL count value, a SCL positive edge detection signal, and a SCL negative edge detection signal, a SDA inversion logic block to receive the SCL count value, a SCL programmed count value, and the SCL positive and negative edge detection signals, and output a SDA invert enable signal based on a comparison of the SCL count value and the SCL programmed count value, and a multiplexer to receive the SDA invert enable signal, and output the SDA signal or an inverted SDA signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路</p>  
        <p type="p">101:開始/停止偵測邏輯區塊；開始/停止偵測區塊</p>  
        <p type="p">102:SCL計數器區塊</p>  
        <p type="p">103:SDA反相邏輯區塊</p>  
        <p type="p">104:多工器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1005" publication-number="202621450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鍵合頭元件的柔順定位結構</chinese-title>  
        <english-title>COMPLIANT LOCATING STRUCTURE FOR A BOND HEAD ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/76</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商先進科技新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高內加　阿吉　士馬人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUNEKAR, AJIT SHRIMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　漫田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, MANTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　浩創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, HO CHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湋多森　盖瑞　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIDDOWSON, GARY PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG, CHI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鍵合頭元件，其包括：夾頭和具有平面的平面柔順定位結構。夾頭適用於在鍵合過程中保持晶片。平面柔順定位結構包括第一撓性元件和第二撓性元件，第一撓性元件被定位成可以與夾頭的第一側面接觸，第二撓性元件被定位成可以與夾頭的第二側面接觸。夾頭的第一側面和第二側面彼此基本上正交。第一撓性元件和第二撓性元件中的每一者都被佈置成使得其一部分可通過夾頭對撓性元件的移動而偏轉，從而致使第一撓性元件或第二撓性元件沿柔順定位結構的平面對夾頭的第一側面或第二側面施加偏置力，以限制夾頭朝向撓性元件的位置偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鍵合頭組件</p>  
        <p type="p">100:第一集成定位件</p>  
        <p type="p">100':第二集成定位件</p>  
        <p type="p">101:第一框架體</p>  
        <p type="p">101':第二框架體</p>  
        <p type="p">1011、1012:連接元件</p>  
        <p type="p">102:第一撓性元件</p>  
        <p type="p">102':第三撓性元件</p>  
        <p type="p">104:第二撓性元件</p>  
        <p type="p">104':第四撓性元件</p>  
        <p type="p">n1、n2、n3、n4:側面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1006" publication-number="202619837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊接裝置及焊接方法</chinese-title>  
        <english-title>WELDING DEVICE AND WELDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">B23K37/047</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山聯滔電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTO ELECTRONIC LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭系天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, XITIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚澤勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, ZESHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時興興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, XINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐江耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIANGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳劍飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種焊接裝置及焊接方法，該焊接裝置中，第一移動件設於機架，且沿第一方向往復移動；承載台與第一移動件轉動配合，且繞旋轉軸線相對第一移動件轉動，承載台用於放置產品，並帶動產品轉動；鎖接件設於第一移動件，並沿旋轉軸線的方向相對第一移動件移動，以向承載台施壓並使其與第一移動件鎖接；第二移動件設於機架，且沿第二方向往復移動；第三移動件設於第二移動件，且沿第三方向往復移動，旋轉軸線的延伸方向平行第三方向；焊接頭設於第三移動件；承載台帶動產品轉動後，使產品上的至少兩個焊接位置之間的連線平行第二方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A welding device and a welding method are disclosed. In the welding device, a first moving element is disposed on a rack and is moved back and forth along a first direction. A carrying platform is rotatably fitted with the first moving element and is rotated relative to the first moving element around a rotation axis. The carrying platform is used to place a product and drive the product to rotate. A locking element is disposed on the first moving element and is moved relative to the first moving element along the direction of the rotation axis to apply pressure to the carrying platform, so that the locking element is locked with the first moving element. A second moving element is disposed on the rack and is moved back and forth along a second direction. A third moving element is disposed on the second moving element and is moved back and forth along a third direction. The extension direction of the rotation axis is parallel to the third direction. A welding tip is disposed on the third moving element. After the carrying platform drives the product to rotate, a connecting line between at least two welding positions on the product is parallel to the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:產品</p>  
        <p type="p">210:第一移動件</p>  
        <p type="p">220:第二移動件</p>  
        <p type="p">230:第三移動件</p>  
        <p type="p">240:焊接頭</p>  
        <p type="p">300:承載台</p>  
        <p type="p">600:載具</p>  
        <p type="p">710:萬向竹節管</p>  
        <p type="p">720:抽吸管</p>  
        <p type="p">730:相機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1007" publication-number="202619949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃布輥捆包體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B65D81/24</main-classification>  
        <further-classification edition="200601120251224B">B65D85/66</further-classification>  
        <further-classification edition="200601120251224B">B65D85/672</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本優香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣瀬周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSE, AMANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於玻璃布輥搬運時容易維持玻璃布周圍之環境而不易發生玻璃布保管時之吸濕之玻璃布輥捆包體。於一態樣中，提供一種捆包體，其具備玻璃布輥密封體及捆包箱，該密封體包括玻璃布輥、及具有內部空間而至少密封玻璃布輥之膜，玻璃布輥包括中空柱狀之芯管、及捲繞於芯管之玻璃布，捆包箱具有底板、頂板及側板，側板具有與玻璃布輥之軸方向端面對向之輥對向面，輥對向面滿足以下至少一者：(1)輥對向面之至少一者相對於底板而移動自由；(2)輥對向面之至少一者與玻璃布輥之軸方向端面具有最短間隙距離GD而分離，最短間隙距離GD超過5 mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:玻璃布輥捆包體</p>  
        <p type="p">10:玻璃布輥密封體</p>  
        <p type="p">11:玻璃布輥</p>  
        <p type="p">11S:軸方向端面</p>  
        <p type="p">12:膜</p>  
        <p type="p">20:捆包箱</p>  
        <p type="p">21:底板</p>  
        <p type="p">22:頂板</p>  
        <p type="p">23:側板</p>  
        <p type="p">23S:輥對向面</p>  
        <p type="p">111:芯管</p>  
        <p type="p">112:玻璃布</p>  
        <p type="p">H:高度</p>  
        <p type="p">S:內部空間</p>  
        <p type="p">SD:最短距離</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1008" publication-number="202620542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於模擬的缺陷與修復形狀決定</chinese-title>  
        <english-title>SIMULATION-BASED DEFECT AND REPAIR SHAPE DETERMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260210B">G03F1/74</main-classification>  
        <further-classification edition="202001120260210B">G06F30/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORG, NIKLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡卓爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRIEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔博恩　吉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABBONE, GILLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布達施　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDACH, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里諾夫　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHINOW, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維特科夫斯基　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WITKOWSKI, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈內菲爾德　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANEFELD, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱納　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEUNER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克洛斯　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLOS, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐斯特　言斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSTER, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於選擇一修復參數集的方法，該修復參數集用於針對微影之一物件的一缺陷的一基於粒子束之修復，該物件特別是一微影光罩，該方法包括：取得在該缺陷之周圍內該物件的測量輪廓資料；為該缺陷的一修復決定多個修復參數集；至少部分地基於該輪廓資料以及該至少一個修復參數集來取得該物件的至少一個模擬空間影像；以及至少部分基於該模擬空間影像和至少一個預定目標值，從該至少一個修復參數集中選擇用於執行該修復的至少一個第一修復參數集。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for selecting a repair parameter set for a particle-beam-based repair of a defect of an object for lithography, in particular a lithography mask, comprises obtaining measured contour data of the object in surroundings of the defect, determining at least one repair parameter set for a repair of the defect, obtaining at least one simulated aerial image of the object at least partially based on the contour data and the at least one repair parameter set and selecting at least one first repair parameter set from the at least one repair parameter set for performing the repair at least partially based on the simulated aerial image and at least one predetermined target value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110:測量輪廓資料</p>  
        <p type="p">120:輪廓</p>  
        <p type="p">130:模擬空間影像</p>  
        <p type="p">140a:修復參數集</p>  
        <p type="p">140b:修復參數集</p>  
        <p type="p">140b:第一修復參數集</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1009" publication-number="202620912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器和電子設備</chinese-title>  
        <english-title>CAPACITOR AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01G4/232</main-classification>  
        <further-classification edition="200601120250902B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信容科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUSTCAP TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WENYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂理坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LIKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱創輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翔泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIANGTAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHIHHSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種電容器和電子設備。電容器包括載板和電容本體。載板厚度方向的第一側設置有正極引出端、負極引出端和輔助引出端，第二側設置有電容本體。第一側和第二側沿載板的厚度方向相對。電容本體包括正極和負極。正極引出端與正極連接。負極引出端和輔助引出端均與負極連接。沿載板的延伸方向，輔助引出端與正極引出端之間的距離，小於負極引出端與正極引出端之間的距離，該電容器，減小了電容器的厚度和尺寸以及電流的流動路徑，降低了電氣引出電阻和等效串聯電感，提高了電容器的容量和電子設備的使用性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a capacitor and an electronic device. The capacitor includes a carrier board and a capacitor body. A first side of the carrier board in a thickness direction is provided with a positive lead-out terminal, a negative lead-out terminal, and an auxiliary lead-out terminal, and a second side of the carrier board is provided with the capacitor body. The first and second sides are opposite along the thickness direction of the carrier board. The capacitor body includes a positive electrode and a negative electrode. The positive lead-out terminal is connected to the positive electrode. The negative lead-out terminal and auxiliary lead-out terminal are both connected to the negative electrode. Along an extension direction of the carrier board, a distance between the auxiliary lead-out terminal and the positive lead-out terminal is smaller than a distance between the negative lead-out terminal and the positive lead-out terminal. This capacitor decreases a thickness and size of the capacitor as well as a flow path of current, reduces electrical lead-out resistance and equivalent series inductance, and improves capacity of the capacitor and performance of the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:載板</p>  
        <p type="p">110a:第一導電通孔</p>  
        <p type="p">200:第一導電層</p>  
        <p type="p">210:正極引出端</p>  
        <p type="p">220:負極引出端</p>  
        <p type="p">230:輔助引出端</p>  
        <p type="p">300:第二導電層</p>  
        <p type="p">400:絕緣層</p>  
        <p type="p">500:電容本體</p>  
        <p type="p">600:側邊負電極</p>  
        <p type="p">700:側邊正電極</p>  
        <p type="p">820:封裝件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1010" publication-number="202619920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>汽車排檔桿鎖</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260213B">B60R25/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光城貿易股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍平華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明乃係有關一種汽車排檔桿鎖，其至少包括有第一殼體及第二殼體、鉸鏈、鎖芯及鎖孔，透過本發明的第一殼體與第二殼體可將汽車排檔桿頭完全包裹，該第一殼體與第二殼體閉合鎖固後，即可讓竊賊無法按壓到汽車排檔桿頭上的排檔釋放按鈕，進而讓該車輛無法被操作排入檔位，藉此可阻止竊賊將車輛開走，達到汽車防盜的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:第一殼體</p>  
        <p type="p">11:容置部</p>  
        <p type="p">12:嵌槽</p>  
        <p type="p">13:長槽</p>  
        <p type="p">14:螺孔</p>  
        <p type="p">15:凸柱</p>  
        <p type="p">2:第二殼體</p>  
        <p type="p">21:容置部</p>  
        <p type="p">22:凸肋</p>  
        <p type="p">23:缺槽</p>  
        <p type="p">24:長槽</p>  
        <p type="p">25:螺孔</p>  
        <p type="p">26:凸柱</p>  
        <p type="p">3:鉸鏈</p>  
        <p type="p">31:第一鉸鏈片</p>  
        <p type="p">311:固定板</p>  
        <p type="p">312:彎折部</p>  
        <p type="p">313:中空軸管</p>  
        <p type="p">314:螺絲</p>  
        <p type="p">32:第二鉸鏈片</p>  
        <p type="p">321:固定板</p>  
        <p type="p">322:彎折部</p>  
        <p type="p">323:中空軸管</p>  
        <p type="p">324:螺絲</p>  
        <p type="p">33:軸心</p>  
        <p type="p">4:鎖芯</p>  
        <p type="p">41:鎖舌</p>  
        <p type="p">411:缺槽</p>  
        <p type="p">42:鑰匙孔</p>  
        <p type="p">43:蓋板片</p>  
        <p type="p">431:槽道</p>  
        <p type="p">44:螺絲</p>  
        <p type="p">5:鎖孔</p>  
        <p type="p">51:固定桿</p>  
        <p type="p">52:螺絲</p>  
        <p type="p">53:彈簧</p>  
        <p type="p">54:承盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1011" publication-number="202620151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝離劑組成物、積層體、及加工後之半導體基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260206B">C09J7/29</main-classification>  
        <further-classification edition="200601120260206B">C09D9/04</further-classification>  
        <further-classification edition="200601120260206B">G03F7/42</further-classification>  
        <further-classification edition="200601120260206B">C08K5/107</further-classification>  
        <further-classification edition="200601120260206B">C09D5/20</further-classification>  
        <further-classification edition="200601120260206B">C08F2/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥野貴久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUNO, TAKAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳生雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGYU, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤貴文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之剝離劑組成物，係用以形成積層體之剝離劑層， &lt;br/&gt;前述積層體係具有：透光性之支撐基板、於前述支撐基板側具有凸塊之半導體基板、介於前述支撐基板與前述半導體基板之間且與前述半導體基板相接之剝離劑層、及介於前述支撐基板與前述剝離劑層之間且與前述剝離劑層相接之接著劑層，且係用於在前述剝離劑層吸收從前述支撐基板側所照射之光後使前述半導體基板與前述支撐基板分離； &lt;br/&gt;前述剝離劑組成物，係含有選自單寧及類黃酮之多酚化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體基板</p>  
        <p type="p">1a:凸塊</p>  
        <p type="p">2:剝離劑層</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">4:支撐基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1012" publication-number="202620206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於淨化含金屬材料之方法、系統和裝置</chinese-title>  
        <english-title>METHODS, SYSTEMS, AND DEVICES FOR PURIFYING METAL-CONTAINING MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C22B21/00</main-classification>  
        <further-classification edition="200601120260213B">C25C3/04</further-classification>  
        <further-classification edition="200601120260213B">C25C3/18</further-classification>  
        <further-classification edition="200601120260213B">C25C3/24</further-classification>  
        <further-classification edition="200601120260213B">C25C3/28</further-classification>  
        <further-classification edition="200601120260213B">C25C7/06</further-classification>  
        <further-classification edition="200601120260213B">H01M4/46</further-classification>  
        <further-classification edition="200601120260213B">H01M10/39</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福恩能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORM ENERGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏金斯　尼可拉斯　路德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERKINS, NICHOLAS REED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼塞爾　約瑟夫　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANSER, JOSEPH STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩根　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORGAN, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐豪斯　約瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWHOUSE, JOCELYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾曼　撒迦利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORMAN, ZACHARIAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯默　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUMMER, LAINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內勳　利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATION, LEAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷諾茲　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　安娜莉希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, ANNELISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之方法及系統通常係關於含金屬材料之淨化。例如，軟氧化可用於自一卑金屬之一低品質合金產生一無氧產物。該無氧產物可直接電解以產生該卑金屬之一更高品質合金–即，具有更高重量百分比之該卑金屬及，因此，更低重量百分比之雜質元素之一合金。與使用一金屬-空氣電化學電池再循環該卑金屬相比，本發明之方法及系統可促進使用顯著更少能量形成高品質再生金屬(例如，鋁)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems of the present disclosure are generally directed to purification of metal-containing material. For example, soft oxidation may be used to generate an oxygen-free product from a low-quality alloy of a base metal. The oxygen-free product may be electrolyzed directly to generate a higher-quality alloy of the base metal – namely, an alloy with higher weight percentage of the base metal and, thus, lower weight percentage of tramp elements. As compared to recycling the base metal with a metal-air electrochemical cell, the methods and systems of the present disclosure may facilitate forming high-quality recycled metal (e.g., aluminum) using significantly less energy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:放電電池</p>  
        <p type="p">102:蒸餾模組</p>  
        <p type="p">103:電解電池</p>  
        <p type="p">104:陽極</p>  
        <p type="p">105:陰極</p>  
        <p type="p">106:電解質</p>  
        <p type="p">107:電壓源</p>  
        <p type="p">108:冷凝器</p>  
        <p type="p">109:熱交換器</p>  
        <p type="p">110:出口</p>  
        <p type="p">111:入口</p>  
        <p type="p">112:絕緣屏蔽</p>  
        <p type="p">113:回流電路</p>  
        <p type="p">114:電解質貯存器</p>  
        <p type="p">134:絕緣套</p>  
        <p type="p">148:鋁供應源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1013" publication-number="202621235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B10/00</main-classification>  
        <further-classification edition="200601120260223B">G11C7/18</further-classification>  
        <further-classification edition="200601120260223B">G11C8/14</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAO, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　建隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, KIAN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王屏薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體結構，其包含：具有前側與背側的基板；SRAM電路，在基板的前側上形成SRAM記憶單元，每個SRAM位元單元包括交叉耦接兩個反相器、與兩個反相器相連接的兩個寫入通道閘、與兩個反相器相連接的讀取下拉元件，以及與讀取下拉元件相連接的讀取通道閘；並且每個SRAM位元單元分別連接至寫入位元線、寫入反相位元線、讀取位元線RBL、電源線和接地線；其中寫入位元線、寫入反相位元線、讀取位元線、電源線和接地線中的第一子集與第二子集，分別從基板的前側與背側連接至SRAM位元單元中的第一SRAM位元單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure that includes a substrate having a frontside and a backside; a SRAM circuit having SRAM bit cells formed on the frontside of the substrate, wherein each of the SRAM bit cells includes two inverters cross-coupled together, two write pass gates coupled to the two inverters, a read pull-down device coupled to the two inverters, and a read pass gate coupled to the read pull-down device, and wherein each of the SRAM bit cells is connected to a WBL, a WBLB, a RBL, a Vdd and a Vss; a first subset of WBL, WBLB, RBL, Vdd and Vss is connected to a first SRAM bit cell of the SRAM bit cells from the frontside of the substrate; and a second subset of WBL, WBLB, RBL, Vdd and Vss is connected to the first SRAM bit cell from the backside of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">730:方法</p>  
        <p type="p">732,734,736,738,740,742,744,746,748,750,752,754,756:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1014" publication-number="202620931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微波電漿系統的寬頻橫向電磁(TEM)至橫向磁場01(TM01)模態轉換器</chinese-title>  
        <english-title>WIDEBAND TEM TO TM01 MODE CONVERTER FOR MICROWAVE PLASMA SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H01J37/32</main-classification>  
        <further-classification edition="200601120260202B">H01P1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　小康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAOKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔　則敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUNG, TZA-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福斯特　約翰Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORSTER, JOHN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴魯札　桑傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALUJA, SANJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例涉及一種裝置，該裝置包括介電圓盤，具有第一表面和第二表面之間的高度。在一個實施例中，該裝置還包括銷，其插入介電圓盤第一表面的孔中，其中該銷為電導體。在一個實施例中，該銷包括第一部分，具有第一寬度，以及第二部分，具有第二寬度。在一個實施例中，第二寬度大於第一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a dielectric puck with a height between a first surface and a second surface. In an embodiment, the apparatus further includes a pin that is inserted into a hole into the first surface of the dielectric puck, where the pin is electrically conductive. In an embodiment, the pin includes a first portion with a first width, and a second portion with a second width. In an embodiment, the second width is greater than the first width.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微波DRA</p>  
        <p type="p">103:電漿</p>  
        <p type="p">105:板材</p>  
        <p type="p">106:橡膠O型環</p>  
        <p type="p">107:外導體</p>  
        <p type="p">110:介電圓盤</p>  
        <p type="p">111:同軸波導區域</p>  
        <p type="p">112:圓形波導區域</p>  
        <p type="p">113:頂表面</p>  
        <p type="p">114:底表面</p>  
        <p type="p">115:孔</p>  
        <p type="p">120:銷</p>  
        <p type="p">130:微波功率放大器</p>  
        <p type="p">131:第一同軸電纜</p>  
        <p type="p">135:圓錐阻抗變換器(CIT)</p>  
        <p type="p">136:第二同軸電纜</p>  
        <p type="p">D:深度</p>  
        <p type="p">H:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1015" publication-number="202621370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向山広記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAIYAMA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一個例示性實施方式中，蝕刻方法包含如下步驟：(a)將基板提供至腔室內之基板支持部上，基板具備膜及膜上之遮罩，遮罩具有開口；(b)於遮罩上形成含磷膜，含磷膜於劃定開口之側壁上具有突起部；及(c)於(b)之後，對膜進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CY:循環</p>  
        <p type="p">MT1:方法</p>  
        <p type="p">ST1~ST4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1016" publication-number="202621371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向山広記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAIYAMA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一個例示性實施方式中，蝕刻方法包含如下步驟：(a)將基板提供至腔室內之基板支持部上，基板具備膜及膜上之遮罩，遮罩具有開口，膜具有與開口連通之凹部；(b)對於劃定開口之側壁，於劃定凹部之側壁上優先形成含磷膜；及(c)於(b)之後，對凹部進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CY:循環</p>  
        <p type="p">MT1:方法</p>  
        <p type="p">ST1~ST4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1017" publication-number="202619846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件之兩面研磨裝置以及工件之兩面研磨方法</chinese-title>  
        <english-title>DOUBLE-SIDED POLISHING APPARATUS FOR WORKPIECE AND DOUBLE-SIDED POLISHING METHOD FOR WORKPIECE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B24B49/14</main-classification>  
        <further-classification edition="201201120260223B">B24B37/11</further-classification>  
        <further-classification edition="201201120260223B">B24B37/34</further-classification>  
        <further-classification edition="201201120260223B">B24B37/04</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉本諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAMOTO, RYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的為提供工件之兩面研磨裝置以及工件之兩面研磨方法，可改善工件之外周形狀的塌邊。其解決手段為對於複數個漿料供給系統的各一者，個別地調整研磨漿的溫度。 &lt;br/&gt;&lt;i&gt;  &lt;/i&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a double-sided polishing apparatus for workpiece and a double-sided polishing method for workpiece, which improve the roll-off of the peripheral shape of the workpiece. The solution involves individually adjusting the temperature of the polishing slurry for each of the multiple slurry supply systems.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:兩面研磨裝置</p>  
        <p type="p">2:上定盤</p>  
        <p type="p">3:下定盤</p>  
        <p type="p">4:旋轉定盤</p>  
        <p type="p">5:太陽齒輪</p>  
        <p type="p">6:內齒輪</p>  
        <p type="p">7:載板</p>  
        <p type="p">8,8a,8b:漿料排出孔</p>  
        <p type="p">9,9a,9b:漿料供給管</p>  
        <p type="p">10,10a,10b:漿料溫度調整裝置</p>  
        <p type="p">11,11a,11b:溫度測量裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1018" publication-number="202619950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動搬運車及搬運設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B65G1/00</main-classification>  
        <further-classification edition="200601120260223B">B65G67/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊東慎一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島明男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASHIMA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可彈性地從天井搬運車將物品搬運至物品載置裝置的自動搬運車及搬運設備。 &lt;br/&gt;　　自動搬運車(7)行駛於地板面。自動搬運車(7)具備行駛部(11)和容器載置部(12)和開閉部(13)。開閉部(13)被設置在容器載置部(12)的上方，能在位於容器載置部(12)的正上方的第一位置和從容器載置部(12)的正上方偏離的第二位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:天井軌道(軌道)</p>  
        <p type="p">5:天井搬運車</p>  
        <p type="p">6:工作站</p>  
        <p type="p">7:自動搬運車</p>  
        <p type="p">11:行駛部</p>  
        <p type="p">12:容器載置部(物品載置部)</p>  
        <p type="p">13:開閉部</p>  
        <p type="p">61:圍籬</p>  
        <p type="p">62:第一牆壁</p>  
        <p type="p">63:第二牆壁</p>  
        <p type="p">F1:容器(物品)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1019" publication-number="202621213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合導體結構之多層基板的製造方法及可根據該方法製造之多層基板</chinese-title>  
        <english-title>METHOD FOR THE PRODUCTION OF MULTILAYER SUBSTRATES WITH AN INTEGRATED CONDUCTOR STRUCTURE AND MULTILAYER SUBSTRATES PRODUCIBLE ACCORDING TO THE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H05K3/46</main-classification>  
        <further-classification edition="202601120260223B">H10P50/20</further-classification>  
        <further-classification edition="202601120260223B">H10W90/00</further-classification>  
        <further-classification edition="200601120260223B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商吉伯史密德公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEBR. SCHMID GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布奇納　克里斯提恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUCHNER, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密德　克利司堤恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMID, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為製造複數個多層基板(100)，該等多層基板各自具有整合導體結構，將有機介電質層(102)施覆至層狀基底基板(101)，隨後在該層狀基底基板(101)之複數個相鄰導體區(106)中形成複數個導體結構。藉由在分離區(119)中切割該基底基板(101)而達成單粒化該等導體區(106)，該等分離區將該等導體區(106)彼此分離。 &lt;br/&gt;提出在切割該基底基板之前，在該等分離區(119)移除該有機介電質層(102)，由此在該有機介電質層中形成溝槽。較佳地，使該等分離區(119)曝露於電漿以移除有機介電質。 &lt;br/&gt;以此方式製造之多層基板(100)之特性可在於僅由該基底基板(101)之從該導體區(106)突出之部分形成之邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To produce a plurality of multilayer substrates (100), each of which has an integrated conductor structure, a layer (102) of an organic dielectric is applied to a layer-shaped base substrate (101), followed by the formation of a plurality of conductor structures in a plurality of adjacent conductor regions (106) of the layer-shaped base substrate (101). Singulation of the conductor regions (106) is achieved by dicing the base substrate (101) in separation regions (119), which separate the conductor regions (106) from one another. &lt;br/&gt;It is proposed that - prior to dicing the base substrate - the layer (102) of the organic dielectric is removed in the separation regions (119), whereby trenches are formed in the layer of organic dielectric. Preferably, the separation regions (119) are exposed to a plasma to remove the organic dielectric. &lt;br/&gt;A multilayer substrate (100) produced in this manner may be characterized by an edge that is formed solely by a portion of the base substrate (101) protruding from the conductor region (106).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多層基板</p>  
        <p type="p">101:層狀基底基板</p>  
        <p type="p">106:導體區</p>  
        <p type="p">135:突出邊緣</p>  
        <p type="p">d:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1020" publication-number="202621440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓載置台</chinese-title>  
        <english-title>WAFER MOUNTING STAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">H02N13/00</further-classification>  
        <further-classification edition="200601120260223B">B23Q3/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川征樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡育久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, IKUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉本博哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, HIROYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川淑人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, YOSHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小木曽裕佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGISO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臼井康貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可充分地抑制半導體元件之製造程序中的微粒之產生的晶圓載置台。本發明之一實施形態的晶圓載置台具備：陶瓷基材、複數之凸部。該陶瓷基材具有研磨面。該研磨面之突出谷部空間體積Vvv為0.5ml/mm&lt;sup&gt;2&lt;/sup&gt;以下。該複數之凸部設置於該研磨面。該陶瓷基材與該複數之凸部具有彼此相異之結晶構造，該複數之凸部各自之孔隙率係0.1%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a wafer mounting stage that can adequately suppress the production of particles during a semiconductor device production process. A wafer mounting stage according to one aspect of the invention comprises a ceramic base and a plurality of protrusions. The ceramic base has a polished surface. The valley void volume Vvv of the polished surface is 0.5 ml/mm&lt;sup&gt;2&lt;/sup&gt; or less. The plurality of protrusions is provided on the polished surface. The ceramic base and the plurality of protrusions have mutually different crystalline structures. The porosity of each of the plurality of protrusions is 0.1% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:陶瓷基材</p>  
        <p type="p">1a:研磨面</p>  
        <p type="p">2:凸部</p>  
        <p type="p">2a:接觸面</p>  
        <p type="p">4:環</p>  
        <p type="p">5:聚焦環</p>  
        <p type="p">6:冷卻板</p>  
        <p type="p">7:半導體晶圓</p>  
        <p type="p">21:遮蔽帶</p>  
        <p type="p">100:晶圓載置台</p>  
        <p type="p">101:半導體製造裝置</p>  
        <p type="p">L:凸部之最大尺寸</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1021" publication-number="202621372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板表面處理方法</chinese-title>  
        <english-title>SUBSTRATE SURFACE TREATMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日揚科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGHLIGHT TECH CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇崇善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOU, CHWUNG-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉文勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長營</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴天琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板表面處理方法，包含下列步驟：對基板的表面進行平坦化處理步驟；以及對基板的表面進行電漿處理步驟，其中平坦化處理步驟與電漿處理步驟係於基板之表面上非同時地以可調整之順序進行。此基板表面處理方法可解決傳統單一製程或同步式複合製程所引發的諸多技術問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for treating a substrate surface, the method comprising the steps of performing a planarization process on the surface of a substrate; and performing a plasma treatment process on the surface of the substrate. The planarization process and the plasma treatment process are conducted non-simultaneously in an adjustable order relative to one another. The method thereby remedies technical deficiencies associated with conventional single-process or synchronous composite processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:平坦化處理步驟</p>  
        <p type="p">S20:電漿處理步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1022" publication-number="202621441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合的彈簧壓力板的基板支撐組件</chinese-title>  
        <english-title>SUBSTRATE SUPPORT ASSEMBLY HAVING AN INTEGRATED SPRING PRESSURE PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="202601120260223B">H10P72/72</further-classification>  
        <further-classification edition="202601120260223B">H10P72/78</further-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈埃爾　艾希思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEL, ASHISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古塔　蘇雷許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, SURESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普勞蒂　史蒂芬唐納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROUTY, STEPHEN DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板支撐組件包括經配置為支撐基板的陶瓷圓盤，以及與陶瓷圓盤熱連通的冷卻板。該基板支撐組件還包括設置在冷卻板下方的彈簧壓力板。彈簧壓力板包含多個彈簧元件，該等元件配置為各自對冷卻板施加大約相等的力。該基板支撐組件還包括複數個緊固件，該等緊固件配置為將彈簧板和冷卻板可拆卸地耦合到陶瓷圓盤上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate support assembly includes a ceramic puck configured to support a substrate and a cooling plate in thermal communication with the ceramic puck. The substrate support assembly further includes a spring pressure plate disposed beneath the cooling plate. The spring pressure plate includes multiple spring elements configured to each apply an approximately equal force to the cooling plate. The substrate support assembly further includes a plurality of fasteners configured to removably couple the spring plate and the cooling plate to the ceramic puck.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">405:靜電吸盤組件</p>  
        <p type="p">410:靜電圓盤</p>  
        <p type="p">415:上圓盤板</p>  
        <p type="p">420:下圓盤板</p>  
        <p type="p">422:電導通道</p>  
        <p type="p">424:特徵</p>  
        <p type="p">425:低導熱率的墊片</p>  
        <p type="p">426:緊固件</p>  
        <p type="p">427:夾持電極</p>  
        <p type="p">428:特徵</p>  
        <p type="p">429:加熱元件</p>  
        <p type="p">432:氣孔</p>  
        <p type="p">434:多孔插塞</p>  
        <p type="p">435:導管</p>  
        <p type="p">436:散熱器</p>  
        <p type="p">438:O型環</p>  
        <p type="p">440:裝配板</p>  
        <p type="p">442:氣孔</p>  
        <p type="p">444:突起</p>  
        <p type="p">445:O型環</p>  
        <p type="p">450:黏合劑</p>  
        <p type="p">460:彈簧壓力板</p>  
        <p type="p">462:彈簧元件</p>  
        <p type="p">464:彈簧穴</p>  
        <p type="p">480:O型環</p>  
        <p type="p">485:熱間隔墊</p>  
        <p type="p">490:RF墊片</p>  
        <p type="p">494:冷卻板</p>  
        <p type="p">495:基底部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1023" publication-number="202621442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多級動態真空饋通</chinese-title>  
        <english-title>MULTI-STAGE DYNAMIC VACUUM FEEDTHROUGH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瓦米納坦　巴拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWAMINATHAN, BHARATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙布藍尼　安納薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBRAMANI, ANANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍姆德　法札德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOUSHMAND, FARZAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀尼思　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ, LUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例係關於一種裝置，該裝置包括第一配接器，該第一配接器包含複數個第一同心分隔器，以及位於第一配接器上方的第二配接器，其中該第二配接器包含複數個第二同心分隔器。在實施例中，該等第二同心分隔器與該等第一同心分隔器交錯排列。在實施例中，該複數個第一同心分隔器中的各者之間設置有密封介質，並且該等第二同心分隔器插入該密封介質的表面中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a first adapter that includes a plurality of first concentric separators, and a second adapter over the first adapter, where the second adapter includes a plurality of second concentric separators. In an embodiment, the second concentric separators are interleaved with the first concentric separators. In an embodiment, a sealing medium is provided between each of the plurality of first concentric separators, and the second concentric separators are inserted into a surface of the sealing medium.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">520:動態饋通</p>  
        <p type="p">521:第一配接器</p>  
        <p type="p">522:第二配接器</p>  
        <p type="p">523:同心分隔器</p>  
        <p type="p">524:同心分隔器</p>  
        <p type="p">535:密封介質</p>  
        <p type="p">540:外殼</p>  
        <p type="p">541:入口</p>  
        <p type="p">542:軸</p>  
        <p type="p">543:孔</p>  
        <p type="p">545:腔室介面模組</p>  
        <p type="p">546:O型環</p>  
        <p type="p">548:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1024" publication-number="202620124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物、硬化物、半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08L63/02</main-classification>  
        <further-classification edition="200601120260209B">C08L101/12</further-classification>  
        <further-classification edition="200601120260209B">C08G59/22</further-classification>  
        <further-classification edition="200601120260209B">C08G59/16</further-classification>  
        <further-classification edition="200601120260209B">C08K3/22</further-classification>  
        <further-classification edition="200601120260209B">C08K3/36</further-classification>  
        <further-classification edition="201801120260209B">C08K3/011</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂野裕斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGENO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OE, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種於模鑄後晶圓難以產生翹曲的環氧樹脂組成物。又，提供上述環氧樹脂組成物的硬化物、具備上述硬化物的半導體裝置、上述半導體裝置之製造方法。 &lt;br/&gt;　　一種環氧樹脂組成物，包含：環氧樹脂(A)、分子內包含碳酸酯基(-O-(C=O)-O-)及/或醚基(-O-)的化合物(B)、無機填充材(C)及硬化促進劑(D)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1025" publication-number="202620805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於顯示器應用之多感測器與單一控制器配對</chinese-title>  
        <english-title>MULTIPLE SENSOR PAIRING WITH SINGLE CONTROLLER FOR DISPLAY APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260210B">G06V40/13</main-classification>  
        <further-classification edition="200601120260210B">G01S7/52</further-classification>  
        <further-classification edition="200601120260210B">G01S15/89</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　載亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JAE HYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特洛夫曼　潔西卡劉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROHMANN, JESSICA LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬爾傑夫　科斯塔丁季米特洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DJORDJEV, KOSTADIN DIMITROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超音波感測器系統可包含經組態以使用超音波獲得資訊之感測器（例如，指紋感測器）。該超音波感測器系統可進一步包括：一控制器晶片，其經組態以獲得該資訊；及一第一可撓性印刷電路基材，該控制器晶片及一第一感測器安裝於該第一可撓性印刷電路基材上。該第一可撓性印刷電路基材可進一步包含一電連接器。該超音波感測器系統可進一步包括：一第二可撓性印刷電路基材，其經由該電連接器與該第一可撓性印刷電路基材電耦接，一第二感測器安裝於該第二可撓性印刷電路基材上。該第一感測器可經由該第一可撓性印刷電路基材與該控制器晶片電耦接，且該第二感測器可經由該第二可撓性印刷電路基材、該電連接器、及該第一可撓性印刷電路基材與該控制器晶片電耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ultrasonic sensor system may comprise sensors (e.g., fingerprint sensors) configured to obtain information using ultrasonic waves. The ultrasonic sensor system may further include a controller chip configured to obtain the information, and a first flexible printed circuit substrate onto which the controller chip and a first sensor are mounted. The first flexible printed circuit substrate may further comprise an electrical connector. The ultrasonic sensor system may further include a second flexible printed circuit substrate, electrically coupled with the first flexible printed circuit substrate via the electrical connector, onto which a second sensor is mounted. The first sensor may be electrically coupled with the controller chip via the first flexible printed circuit substrate, and the second sensor may be electrically coupled with the controller chip via the second flexible printed circuit substrate, the electrical connector, and the first flexible printed circuit substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:組態</p>  
        <p type="p">810-1:第一感測器</p>  
        <p type="p">810-2:第二感測器</p>  
        <p type="p">820:控制器</p>  
        <p type="p">830:連接器</p>  
        <p type="p">833:子模組</p>  
        <p type="p">835:記憶體</p>  
        <p type="p">837:子模組</p>  
        <p type="p">840:觸控控制器</p>  
        <p type="p">850:應用處理器</p>  
        <p type="p">860:電源</p>  
        <p type="p">870:B2B連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1026" publication-number="202621046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電振動片，壓電振動子及振盪器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H03H9/19</main-classification>  
        <further-classification edition="202301120260209B">H10N30/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商精工電子水晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SII CRYSTAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤雅基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種壓電振動片，可抑制一對振動臂之間的股部發生激振電極間短路。 &lt;br/&gt;　　[解決手段] 壓電振動片(3)具備：壓電板(30)，是具有從基部(35)開始互相往相同方向延伸的一對振動臂(31、32)；以及第1激振電極(41)與第2激振電極(42)，是設置於一對振動臂(31、32)的每一個，並分別於一對振動臂(31、32)的每一個產生電場。基部(35)的前側面(35a)具有股部(50)，該股部50位於一對振動臂(31、32)之間，並設置有第1激振電極(41)與第2激振電極(42)。股部(50)具有：殘渣區域(51)，定義是從壓電板(30)的厚度方向看去，形成有蝕刻殘渣(55)的範圍；以及非殘渣區域(52)，定義是從壓電板(30)的厚度方向看去，未形成有蝕刻殘渣(55)的範圍。基部(35)的側面(35a)，在非殘渣區域(52)中，是對壓電板(30)的厚度方向傾斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:壓電振動子</p>  
        <p type="p">2:封裝</p>  
        <p type="p">3:壓電振動片</p>  
        <p type="p">5:封裝本體</p>  
        <p type="p">10:第1基礎基板</p>  
        <p type="p">11:第2基礎基板</p>  
        <p type="p">12:密封環</p>  
        <p type="p">14A,14B:安裝部</p>  
        <p type="p">15:切缺部</p>  
        <p type="p">20A,20B:電極墊</p>  
        <p type="p">30:壓電板</p>  
        <p type="p">31:第1振動臂(振動臂)</p>  
        <p type="p">32:第2振動臂(振動臂)</p>  
        <p type="p">33:第1支撐臂(支撐臂)</p>  
        <p type="p">34:第2支撐臂(支撐臂)</p>  
        <p type="p">IV:線</p>  
        <p type="p">C:空腔</p>  
        <p type="p">L:長邊方向</p>  
        <p type="p">W:寬度方向</p>  
        <p type="p">T:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1027" publication-number="202620354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>換熱器及使用其的熱泵系統</chinese-title>  
        <english-title>HEAT EXCHANGER AND HEAT PUMP SYSTEM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">F28D7/00</main-classification>  
        <further-classification edition="200601120260209B">F28F9/22</further-classification>  
        <further-classification edition="200601120260209B">F25B39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商約克(無錫)空調冷凍設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YORK (WUXI) AIR CONDITIONING AND REFRIGERATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商泰科消防及安全有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO FIRE &amp; SECURITY GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱金友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, JINYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇秀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, XIUPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾凡飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, FANFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙為崢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, WEIZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案提供一種換熱器，該換熱器具有長度方向、寬度方向及高度方向，包括：殼體、第一換熱管組及第二換熱管組、再分配裝置及驅動裝置，該殼體圍成殼體容腔；第一換熱管組及第二換熱管組位於該殼體容腔中，該第一換熱管組及該第二換熱管組中之換熱管沿著該換熱器之長度方向延伸，並且沿著該換熱器之寬度方向按行配置排佈，該第一換熱管組位於該第二換熱管組上方；該再分配裝置設置在第一換熱管組與第二換熱管組之間，該再分配裝置上設有多行通孔；該驅動裝置與該再分配裝置連接，能夠驅動該再分配裝置沿著該換熱器之寬度方向移動。本申請案中之換熱器在製熱及製冷模式下均有較高的換熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">208:再分配裝置</p>  
        <p type="p">231:第一換熱管組</p>  
        <p type="p">232:第二換熱管組</p>  
        <p type="p">233:第三換熱管組</p>  
        <p type="p">240:驅動裝置</p>  
        <p type="p">243:頂部擋板</p>  
        <p type="p">244:側部擋板</p>  
        <p type="p">245:側部擋板</p>  
        <p type="p">253:第一引流板</p>  
        <p type="p">254:第一引流板</p>  
        <p type="p">255:第二引流板</p>  
        <p type="p">256:第二引流板</p>  
        <p type="p">261:擋板組件</p>  
        <p type="p">265:擋板流體通道</p>  
        <p type="p">266:擋板流體通道</p>  
        <p type="p">267:引流板組件</p>  
        <p type="p">275:流動空間</p>  
        <p type="p">295:導流件</p>  
        <p type="p">296:引流通道</p>  
        <p type="p">298:引流通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1028" publication-number="202619821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄片狀燒結型接合材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260210B">B22F1/05</main-classification>  
        <further-classification edition="200601120260210B">B22F7/08</further-classification>  
        <further-classification edition="200601120260210B">B22F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本斯倍利亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON SUPERIOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巴川集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMOEGAWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田光市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深江信邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKAE, NOBUKUNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮原香織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAHARA, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於薄片狀燒結型接合材、接合前述薄片狀燒結型接合材與接合構件之接合部、使用了該接合部之電氣設備、電子設備、半導體部件或散熱部件；該薄片狀燒結型接合材具有由板狀或箔狀之金屬所構成的金屬層與位於金屬層之兩面之含有金屬奈米粒子及溶劑的具有黏性之接著層，且金屬奈米粒子，為於由金屬原子之集合體所構成的平均粒徑1~200nm之金屬核的周圍，形成有由碳數1~10或12之脂肪族羧酸之一種以上所構成的有機被覆層之複合金屬奈米粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1029" publication-number="202620135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯酸樹脂及其製造方法以及丙烯酸樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C09D5/16</main-classification>  
        <further-classification edition="200601120260209B">C08F220/26</further-classification>  
        <further-classification edition="200601120260209B">C08F20/38</further-classification>  
        <further-classification edition="200601120260209B">C08L33/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本派克乃成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON PARKERIZING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田恭平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, KYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂谷涼子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURAYA, RYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種丙烯酸樹脂，係可對金屬材料形成皮膜，前述皮膜兼具優異的親水性與在浸於水中之環境下之優異的密接耐久性。本發明係關於一種丙烯酸樹脂，係具有N-羥基烷基、巰基及/或硫化物基、以及聚氧伸烷基，巰基及硫化物基的合計數量N&lt;sub&gt;2&lt;/sub&gt;相對於構成聚氧伸烷基之氧伸烷基的數量N&lt;sub&gt;1&lt;/sub&gt;的比(N&lt;sub&gt;2&lt;/sub&gt;/N&lt;sub&gt;1&lt;/sub&gt;)為0.02至1.00之範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1030" publication-number="202619894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體冷媒配管用管</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B32B27/30</main-classification>  
        <further-classification edition="200601120260209B">F16L11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商霓塔股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日置友哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIOKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古山義紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYAMA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可良好地抑制離子的溶出，而且，可在低溫環境下也可良好地發揮功能的液體冷媒配管用管。液體冷媒配管用管1係，包括第一層11以及第二層12。第一層11係，由聚丙烯成形，劃分冷媒的流路10。第二層12係，由動態交聯型熱塑性彈性體成形，層積於第一層11的外周側。第二層12係，具有在低溫下維持第一層11的柔軟性的厚度。第一層11的厚度係，對於第一層11以及第二層12的總厚度被設定為10%以上40%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液體冷媒配管用管</p>  
        <p type="p">10:流路</p>  
        <p type="p">11:第一層</p>  
        <p type="p">12:第二層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1031" publication-number="202619704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自屬於鶯蛤超科之二枚貝生成３，５－二羥基－４－甲氧基苯甲醇（３，５—ｄｉｈｙｄｒｏｘｙ—４—ｍｅｔｈｏｘｙｂｅｎｚｙｌ　ａｌｃｏｈｏｌ）之生成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A61K31/045</main-classification>  
        <further-classification edition="201501120260209B">A61K35/618</further-classification>  
        <further-classification edition="200601120260209B">A61P39/06</further-classification>  
        <further-classification edition="201601120260209B">A23L17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商渡邊牡蠣研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE OYSTER LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺貢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MITSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案發明之課題為提供一種將前述阿古屋貝或扁平鉗蛤之貝肉加熱或加壓，能夠自鶯蛤超科之二枚貝，例如阿古屋貝或扁平鉗蛤之貝肉生成比其他二枚貝更多量且更高濃度之抗氧化物質之DHMBA之生成方法。 &lt;br/&gt;　　作為解決手段，本發明之特徵為將屬於鶯蛤超科之二枚貝之貝肉放入萃取液內，藉由加熱該萃取液，能夠自前述加熱處理後之屬於鶯蛤超科之二枚貝之貝肉生成比其他二枚貝更多量之3,5-二羥基-4-甲氧基苯甲醇(3,5-dihydroxy-4-methoxybenzyl alcohol)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1032" publication-number="202621125"> 
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      <tif no="1" file="202621125.zip"/>
    </tif-files>
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      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理裝置及資料處理方法、以及事件資料輸出感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04N23/60</main-classification>  
        <further-classification edition="202301120260202B">H04N23/54</further-classification>  
        <further-classification edition="202301120260202B">H04N25/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細江隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋宏雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於更提高壓縮率地輸出事件資料。 &lt;br/&gt;基於複數個事件檢測用之像素接收到之光之亮度之變化而檢測事件之發生，基於表示該事件之內容之事件資料之發生密度，變更將事件資料編碼化之編碼化方式之表現方法而壓縮事件資料。例如，基於1列內之事件資料之發生密度，在1列內，將事件資料之X方向之位址變更絕對值與相對值。本技術例如可應用於基於事件之發生而輸出事件資料之EVS。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1033" publication-number="202620225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含摻質膜的成膜方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C23C16/34</main-classification>  
        <further-classification edition="200601120260213B">C23C14/14</further-classification>  
        <further-classification edition="200601120260213B">C23C14/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新柯隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINCRON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>税所慎一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAISHO, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成膜方法，其為了控制膜中的摻質濃度或其分布，在基板（S）形成含金屬摻質的金屬化合物之膜，包括：第一步驟（P1），以反應氣體的流量未達既定值的金屬模式，將前述金屬化合物濺鍍成膜於前述基板；第二步驟（P2），以前述反應氣體的流量為前述既定值以上的反應模式，將前述金屬摻質濺鍍成膜於前述基板，其中同時實施前述第一步驟與前述第二步驟；以及第四步驟（P4），在前述第二步驟的成膜結束且在與其同時或經過既定時間後，結束前述第一步驟的成膜之後，以既定時間的程度繼續對前述基板供應前述反應氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1034" publication-number="202619897"> 
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      <tif no="1" file="202619897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125230</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層基板之製造方法及多層基板製造用的固化性樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B32B37/15</main-classification>  
        <further-classification edition="200601120260213B">B32B37/24</further-classification>  
        <further-classification edition="200601120260213B">B32B27/08</further-classification>  
        <further-classification edition="200601120260213B">B32B27/30</further-classification>  
        <further-classification edition="200601120260213B">H05K1/03</further-classification>  
        <further-classification edition="200601120260213B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KITARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺島嘉孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERASHIMA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多層基板之製造方法，其包括：第1步驟，在基材上形成含有順丁烯二醯亞胺樹脂之第1絕緣樹脂層；第2步驟，形成第2絕緣樹脂層；及第3步驟，至少一併固化第1絕緣樹脂層和第2絕緣樹脂層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1035" publication-number="202619959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B66F7/28</main-classification>  
        <further-classification edition="200601120260209B">B66F7/00</further-classification>  
        <further-classification edition="200601120260209B">B65G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾天斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, TAKATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, JYUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森下良治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種已改進受電部相對於立柱之配置的搬送裝置。物品搬送裝置係具備：立柱，其包括彼此相對的第一側部及第二側部；受電部，其係配置於第一側部與第二側部之間；及供電線，係用於將電力供應給受電部。第一側部及第二側部係包括供供電線通過的配線路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:物品搬送裝置(搬送裝置)</p>  
        <p type="p">20:立柱</p>  
        <p type="p">21:第一側部</p>  
        <p type="p">22:第二側部</p>  
        <p type="p">23:連接部</p>  
        <p type="p">24:突出部</p>  
        <p type="p">25:凹部</p>  
        <p type="p">26:配線路</p>  
        <p type="p">30:升降部</p>  
        <p type="p">40:受電部</p>  
        <p type="p">50:供電線</p>  
        <p type="p">52:繞行配線部</p>  
        <p type="p">60:配重</p>  
        <p type="p">70:固定構件</p>  
        <p type="p">A1:內側開口</p>  
        <p type="p">A2:外側開口</p>  
        <p type="p">P:供電位置</p>  
        <p type="p">R2:第二導輥</p>  
        <p type="p">R3:第三導輥</p>  
        <p type="p">R4:第四導輥</p>  
        <p type="p">R5:第五導輥</p>  
        <p type="p">R6:第六導輥</p>  
        <p type="p">R7:第七導輥</p>  
        <p type="p">S1:內側面</p>  
        <p type="p">S2:外側面</p>  
        <p type="p">X,X1,X2:(左右)方向</p>  
        <p type="p">Y,Y1,Y2:(前後)方向</p>  
        <p type="p">Z:(上下)方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1036" publication-number="202621207"> 
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      <tif no="1" file="202621207.zip"/>
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      <isuno>10</isuno>  
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        <document-id> 
          <doc-number>202621207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背鑽深度確定方法、檢測電路板厚度的方法及加工參數生成方法</chinese-title>  
        <english-title>METHOD FOR DETERMINING BACK DRILLING DEPTH, METHOD FOR DETECTING CIRCUIT BOARD THICKNESS, AND METHOD FOR GENERATING PROCESSING PARAMETERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250805B">H05K3/22</main-classification>  
        <further-classification edition="200601120250805B">H05K3/46</further-classification>  
        <further-classification edition="200601120250805B">H05K3/42</further-classification>  
        <further-classification edition="200601120250805B">G01B21/02</further-classification>  
        <further-classification edition="200601120250805B">G05B19/401</further-classification>  
        <further-classification edition="200601120250805B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州維嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU VEGA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃筱寅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, XIAO YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種背鑽深度確定方法，包括：獲取待加工電路板上的多個孔位的理論厚度和實際厚度；比較每個孔位的理論厚度和實際厚度，確定第一孔位和異常孔位；在多個第一孔位中選擇一個目標孔位，第一次搜索臨近目標孔位的多個第一孔位，獲取搜索到的多個第一孔位的實際厚度，確定目標孔位的修正實際厚度；根據目標孔位的修正實際厚度、理論厚度和理論背鑽深度，確定目標孔位的實際背鑽深度。還申請了一種檢測電路板厚度的方法，以及一種加工參數生成方法。上述方法對待加工電路板上的每個孔位進行單獨修正，提高了背鑽加工精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a method for determining back-drilling depth, including: obtaining theoretical thicknesses and actual thicknesses of multiple hole walls on a circuit board to be processed; comparing the theoretical thickness and actual thickness of each hole wall to determine a first hole wall and an abnormal hole wall; selecting a target hole wall from the multiple first hole walls, searching multiple first hole walls that are adjacent to the target hole wall in a first searching, obtaining the actual thicknesses of the searched multiple first hole walls, and determining a corrected actual thickness of the target hole wall; determining an actual back-drilling depth of the target hole wall according to the corrected actual thickness, the theoretical thickness and a theoretical back-drilling depth of the target hole wall. A method for detecting the thickness of a circuit board and a method for generating processing parameters are also provided. The above methods perform individual corrections on all hole walls in the circuit board to be processed, thereby improving accuracy of a back-drilling processing.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1037" publication-number="202620249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁構件、其製造方法及時鐘外部構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C25D11/04</main-classification>  
        <further-classification edition="200601120260223B">C25D11/22</further-classification>  
        <further-classification edition="200601120260223B">C22C21/06</further-classification>  
        <further-classification edition="200601120260223B">C25B1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＡＣＪ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UACJ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島大希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鋁構件(1)，其具有：由金屬所構成之基材(2)、由鋁之氧化物所構成且設置於基材(2)上之陽極氧化皮膜(3)，及設置於陽極氧化皮膜(3)上且經構成為可反射部分入射光之反射膜(4)。陽極氧化皮膜(3)之厚度為15~600 nm。陽極氧化皮膜(3)具有平均開口直徑為50nm以下之複數個細孔(321)。鋁構件(1)，例如係藉由在酸性或鹼性之電解液中對基材(2)施予陽極氧化處理以形成陽極氧化皮膜(3)，之後，藉由在陽極氧化皮膜(3)上形成反射膜(4)而得到。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鋁構件</p>  
        <p type="p">2:基材</p>  
        <p type="p">3:陽極氧化皮膜</p>  
        <p type="p">4:反射膜</p>  
        <p type="p">31:阻障層</p>  
        <p type="p">32:多孔層</p>  
        <p type="p">321:細孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1038" publication-number="202619758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光構件、光美容模組及美容裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A61N5/06</main-classification>  
        <further-classification edition="200601120260223B">A61B18/20</further-classification>  
        <further-classification edition="200601120260223B">A61H39/00</further-classification>  
        <further-classification edition="200601120260223B">A61H39/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春日井秀紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASUGAI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本龍平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, RYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龜田涼太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEDA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">發光構件(5)是在可以對肌膚(S)照射光(L1)的美容裝置(1)中使用的發光構件。此發光構件(5)具備光源(52)與導光體(51)，前述導光體(51)可以將從光源(52)照射的光(L1)導光至內部，將已導光至內部的光(L1)照射於肌膚(S)。又，導光體(51)具備：第1面(51a)，將從光源(52)照射的光(L1)導光至內部；及第2面(51b)，從第1面(51a)沿著導光的光(L1)的導光方向延伸。並且，第2面(51b)具備可以在接觸肌膚(S)的狀態下將從第1面(51a)導光的光(L1)照射於肌膚(S)的光施術部(51ba)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:發光構件</p>  
        <p type="p">12:構件</p>  
        <p type="p">51:導光體</p>  
        <p type="p">51a:端面(第1面)</p>  
        <p type="p">51b:周面(第2面)</p>  
        <p type="p">51ba:光施術部</p>  
        <p type="p">52:光源</p>  
        <p type="p">52A:一側光源</p>  
        <p type="p">52B:另一側光源</p>  
        <p type="p">122:構件</p>  
        <p type="p">521:LED封裝(封裝光源)</p>  
        <p type="p">5211:LED元件(發光元件)</p>  
        <p type="p">5212:殼體</p>  
        <p type="p">52121:後壁</p>  
        <p type="p">52122:周壁</p>  
        <p type="p">L0:原點</p>  
        <p type="p">L1:光(可見光)</p>  
        <p type="p">Lx:長度(位置)</p>  
        <p type="p">S:肌膚</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1039" publication-number="202620684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設計支援系統及設計支援方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260202B">G06F30/27</main-classification>  
        <further-classification edition="202001120260202B">G06F30/392</further-classification>  
        <further-classification edition="202501120260202B">H10D89/10</further-classification>  
        <further-classification edition="202001320260202B">G06F119/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴﨑宏亀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUSAKI, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">係為基於規格來設計半導體之設計支援系統，並具備有：設計資料用資料庫(71)，係積蓄半導體之過去之設計資料；和分區(partitioning)部(21)，係基於設計資料用資料庫(71)所積蓄的過去之設計資料，來作成將被指示有規格之半導體分割成複數之區塊之分區案；和設計難易度評價部(23)，係基於設計資料用資料庫(71)所積蓄的過去之設計資料，來對於藉由在分區部(21)處之分割結果所得到的各區塊之設計難易度進行評價。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:設計部</p>  
        <p type="p">21:分區(partitioning)部</p>  
        <p type="p">22:配置配線實行部</p>  
        <p type="p">23:設計難易度評價部</p>  
        <p type="p">24:時序佈局驗證部</p>  
        <p type="p">71:設計DB</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1040" publication-number="202620042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含抗突變ＣＡＬＲ抗體之組成物及抗體之製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/18</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商明治製菓藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEIJI SEIKA PHARMA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田陽治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, YOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島崇恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近田翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIKADA, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅野光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASANO, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋敏行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一色明日美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISSHIKI, ASUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於製作與辨識以往的突變CALR蛋白質之抗體辨識不同部位之新穎抗體，提供使其之醫藥。根據本發明，提供一種用於治療腫瘤之組成物，其包含結合於比突變鈣網伴護蛋白的突變部位更N端側，且結合於細胞表面上的前述突變鈣網伴護蛋白之抗體或其抗原結合性片段。根據本發明提供一種抗體之製作方法，其包含篩選結合於細胞表面上的突變鈣網伴護蛋白之抗體或結合於突變鈣網伴護蛋白的二聚體之抗體之步驟，其中抗體為結合於比前述突變鈣網伴護蛋白的突變部位更N端側之抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1041" publication-number="202620268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維用微塑膠纖維產生降低用聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">D06M15/267</main-classification>  
        <further-classification edition="200601120260223B">D06M15/263</further-classification>  
        <further-classification edition="200601120260223B">D06M15/27</further-classification>  
        <further-classification edition="200601120260223B">D06M15/227</further-classification>  
        <further-classification edition="200601120260223B">D06M15/347</further-classification>  
        <further-classification edition="200601120260223B">C11D1/12</further-classification>  
        <further-classification edition="200601120260223B">C11D1/28</further-classification>  
        <further-classification edition="200601120260223B">C11D3/37</further-classification>  
        <further-classification edition="200601120260223B">C11D7/22</further-classification>  
        <further-classification edition="200601120260223B">C08F220/06</further-classification>  
        <further-classification edition="200601120260223B">C08F220/28</further-classification>  
        <further-classification edition="200601120260223B">C08F220/34</further-classification>  
        <further-classification edition="200601120260223B">C08F220/38</further-classification>  
        <further-classification edition="200601120260223B">C08F226/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保元気</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, GENKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒池友哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAIKE, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明開發一種新穎之纖維用微塑膠纖維產生降低用聚合物，其降低將含有合成纖維之纖維或纖維製品洗淨等時產生之微塑膠纖維之量。 &lt;br/&gt;使用包含具有特定之結構單元之聚合物之纖維用微塑膠纖維產生降低用聚合物，對含有合成纖維之纖維或纖維製品進行處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1042" publication-number="202620932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供ＨＦ　ＲＦ訊號至上電極延伸部的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR PROVIDING AN HF RF SIGNAL TO AN UPPER ELECTRODE EXTENSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">H01J37/32</main-classification>  
        <further-classification edition="200601120260204B">H05H1/46</further-classification>  
        <further-classification edition="200601120260204B">H05H1/34</further-classification>  
        <further-classification edition="200601120260204B">H05H1/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪瑞卡塔諾　艾力西　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARAKHTANOV, ALEXEI M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智　賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露千西　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCCHESI, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍藍德　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於控制電漿腔室於邊緣區之處理速率的系統及方法。其中一系統包括產生第一射頻(RF)訊號的第一RF產生器。第一匹配電路接收第一RF訊號後即輸出第一經修改RF訊號。系統包括具有基板支撐件及上電極延伸部的電漿腔室。第一阻抗匹配電路提供第一經修改RF訊號至基板支撐件。上電極係耦接至接地電位或至浮動電位。系統包括產生第二RF訊號的第二RF產生器。第二阻抗匹配電路接收第二RF訊號後即輸出第二經修改RF訊號。第二阻抗匹配電路提供第二經修改RF訊號至上電極延伸部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for controlling a processing rate at an edge region of a plasma chamber are described. One of the systems includes a first radio frequency (RF) generator that generates a first RF signal. A first matching circuit outputs a first modified RF signal upon receiving the first RF signal. The system includes a plasma chamber having a substrate support and an upper electrode extension. The first impedance matching circuit provides the first modified RF signal to the substrate support. The upper electrode is coupled to a ground potential or to a floating potential. The system includes a second RF generator that generates a second RF signal. A second impedance matching circuit outputs a second modified RF signal upon receiving the second RF signal. The second impedance matching circuit provides the second modified RF signal to the upper electrode extension.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:基板之中央區</p>  
        <p type="p">102:上電極延伸部(U.E.E)</p>  
        <p type="p">103:基板之邊緣區</p>  
        <p type="p">104:高頻(HF)射頻(RF)產生器</p>  
        <p type="p">105:上電極總成</p>  
        <p type="p">106:基板支撐件</p>  
        <p type="p">107:上電極的頂面</p>  
        <p type="p">108:主機電腦</p>  
        <p type="p">109:氣體分配板(GDP)的底面</p>  
        <p type="p">110:低頻(LF)射頻(RF)產生器</p>  
        <p type="p">112,114:阻抗匹配電路(IMC)</p>  
        <p type="p">116:電漿腔室</p>  
        <p type="p">118:氣體源系統</p>  
        <p type="p">119:閥系統</p>  
        <p type="p">120:氣體供應管線系統</p>  
        <p type="p">121:驅動器與馬達系統</p>  
        <p type="p">122:處理器</p>  
        <p type="p">123:記憶體裝置</p>  
        <p type="p">124,126:絕緣體環</p>  
        <p type="p">128:間隙</p>  
        <p type="p">129:間隙之主要區</p>  
        <p type="p">130:上電極</p>  
        <p type="p">131:間隙之邊緣區</p>  
        <p type="p">132:氣體分配板(GDP)</p>  
        <p type="p">133,142:傳送纜線</p>  
        <p type="p">134,144:RF纜線</p>  
        <p type="p">135:中央部</p>  
        <p type="p">136,146:輸入</p>  
        <p type="p">137:邊緣部</p>  
        <p type="p">138,148:輸出</p>  
        <p type="p">140,150:RF傳輸線</p>  
        <p type="p">152:頂部牆</p>  
        <p type="p">154:側部牆</p>  
        <p type="p">156:底部牆</p>  
        <p type="p">158:介電窗</p>  
        <p type="p">160:光學感測器</p>  
        <p type="p">166,168,184,190:配方訊號</p>  
        <p type="p">S:基板</p>  
        <p type="p">170,174,182,192:RF訊號</p>  
        <p type="p">172,176,186,194:經修改RF訊號</p>  
        <p type="p">180,188:量測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1043" publication-number="202621230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於冷卻液分配單元之擋板</chinese-title>  
        <english-title>BAFFLES FOR COOLANT DISTRIBUTION UNITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H05K7/20</main-classification>  
        <further-classification edition="200601120260209B">F04D25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商霍弗曼組件公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN ENCLOSURES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坤丹　傑斯旺施　杜爾迦　薩格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNDEM, JESHWANTH DURGA SAGAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻分配單元(CDU)包含：一殼體，其具有一第一端及一第二端；一第一風扇列，其配置於該殼體之該第二端上，該第一風扇列包含用以使空氣自該第一端移動通過該殼體至該第二端之一第一風扇；及一擋板系統，其固定至該殼體之該第二端。該擋板系統包含用以導引來自該第一風扇列之氣流之一第一擋板，該第一擋板具有複數個循序配置之葉片，各葉片界定相對於平行於通過該CDU之一氣流方向之一軸形成一角度之一平面，且該序列中之各葉片相對於該軸以比該序列中之前一葉片更大之一角度定向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling distribution unit (CDU) includes a housing having a first end and a second end, a first fan row arranged on the second end of the housing, the first fan row including a first fan to move air through the housing from the first end to the second end, and a baffle system secured to the second end of the housing. The baffle system includes a first baffle to guide air flow from the first fan row, the first baffle having a plurality of sequentially arranged vanes, each vane defining a plane forming an angle relative to an axis parallel to an airflow direction through the CDU, and each vane in the sequence being oriented at a greater angle relative to the axis than the preceding vane in the sequence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:第一端</p>  
        <p type="p">110:第二端</p>  
        <p type="p">114:風扇</p>  
        <p type="p">302:冷卻液分配單元(CDU)</p>  
        <p type="p">304:第一擋板</p>  
        <p type="p">305:冷卻液分配單元(CDU)殼體</p>  
        <p type="p">306:第二擋板</p>  
        <p type="p">308:第一列</p>  
        <p type="p">310:第二列</p>  
        <p type="p">312:第一側板</p>  
        <p type="p">314:第二側板</p>  
        <p type="p">315:第一側</p>  
        <p type="p">320:擋板系統</p>  
        <p type="p">325:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1044" publication-number="202621381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在半導體基板中處理金屬特徵部的方法</chinese-title>  
        <english-title>METHOD PROCESSING METAL FEATURES IN A SEMICONDUCTOR SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　彥典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YEN-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在半導體基板中處理含金屬特徵部的方法，其中：含金屬特徵部包括側壁，垂直於半導體基板之主表面平面，以及頂表面，具有在頂表面上之硬遮罩帽層，藉由在氣體團簇離子束與主表面平面之間具有從 5°至 85°之第一照射角 度α導引氧化性氣體團簇離子束（GCIB）在主表面平面而被處理，以選擇性地氧化含金屬材料特徵部之至少一部分，以形成氧化金屬層。半導體基板接著藉由反應性離子蝕刻（RIE）處理之乾式電漿蝕刻被處理，以移除氧化金屬層，以提供尺寸調整之含金屬特徵部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of processing metal-containing features in a semiconductor substrate where the metal-containing feature comprises a sidewall normal to the major surface plane of the semiconductor substrate, and a top surface having a hard mask cap layer on the top surface is treated by directing an oxidizing gas cluster ion beam (GCIB) at the major surface plane with a first irradiation angle α between the gas cluster ion beam and the major surface plane of from 5° to 85° to selectively oxidize at least a portion of the metal-containing material feature to form an oxidized metal layer. The semiconductor substrate is then treated by dry plasma etching with a reactive ion etching (RIE) process to remove the oxidized metal layer to provide size adapted metal-containing features.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:含金屬特徵部</p>  
        <p type="p">100b:含金屬特徵部</p>  
        <p type="p">102:側壁</p>  
        <p type="p">104:主表面平面</p>  
        <p type="p">110:頂表面</p>  
        <p type="p">112:硬遮罩帽層</p>  
        <p type="p">115:氧化性氣體團簇離子束(GCIB)</p>  
        <p type="p">120:氧化金屬層</p>  
        <p type="p">α:第一照射角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1045" publication-number="202620455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接收光學系統，感測器系統及雷達裝置</chinese-title>  
        <english-title>RECEIVING OPTICAL SYSTEM, SENSOR SYSTEM AND RADAR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G01S7/481</main-classification>  
        <further-classification edition="200601120260209B">G02B9/62</further-classification>  
        <further-classification edition="200601120260209B">G02B5/20</further-classification>  
        <further-classification edition="200601120260209B">G02B27/10</further-classification>  
        <further-classification edition="200601120260209B">B60W40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金世泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接收光學系統，包含：一第一至第六鏡頭，沿一光軸自一物體側至一感測器側依序配置，其中該第一鏡頭具有負（－）折射力，其中該第二至第六鏡頭中至少一具正（＋）折射力，且該第二鏡頭與該第三鏡頭間的中心間隙為沿該光軸相鄰鏡頭間隙中最大者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The receiving optical system according to an embodiment of the present invention comprises first to sixth lenses disposed sequentially from an object side to a sensor side along an optical axis, wherein the first lens has a negative (-) refractive power, at least one of the second to sixth lenses has a positive (+) refractive power, and among the gaps between adjacent lenses on the optical axis, the gap between the second lens and a center of the second lens is the largest.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:接收光學系統</p>  
        <p type="p">101:第一鏡頭</p>  
        <p type="p">102:第二鏡頭</p>  
        <p type="p">103:第三鏡頭</p>  
        <p type="p">104:第四鏡頭</p>  
        <p type="p">105:第五鏡頭</p>  
        <p type="p">106:第六鏡頭</p>  
        <p type="p">111:濾光片</p>  
        <p type="p">112:蓋板玻璃</p>  
        <p type="p">300:影像感測器</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p>  
        <p type="p">S3:第三表面</p>  
        <p type="p">S4:第四表面</p>  
        <p type="p">S5:第五表面</p>  
        <p type="p">S6:第六表面</p>  
        <p type="p">S7:第七表面</p>  
        <p type="p">S8:第八表面</p>  
        <p type="p">S9:第九表面</p>  
        <p type="p">S10:第十表面</p>  
        <p type="p">S11:第十一表面</p>  
        <p type="p">S12:第十二表面</p>  
        <p type="p">STOP:光圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1046" publication-number="202620372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01B11/06</main-classification>  
        <further-classification edition="200601120260223B">G01B9/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森島康太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHIMA, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體裝置製造方法包含：第1工序，其於在晶圓之表面側形成第1層之狀態下，取得第1層之厚度分佈；第2工序，其藉由對於第1層進行規定之加工處理，而形成第2層；第3工序，其於第2工序後，對於晶圓呈面狀照射光，拍攝來自晶圓之光，基於攝像之信號，導出晶圓之面內之測定參數之分佈；及第4工序，其基於在第1工序中取得之第1層之厚度分佈、及在第3工序中導出之測定參數之分佈，導出第2層之厚度分佈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶圓</p>  
        <p type="p">200b:膜</p>  
        <p type="p">200c:膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1047" publication-number="202619713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＶＡＶ１降解劑的劑型</chinese-title>  
        <english-title>DOSAGE FORMS COMPRISING A VAV1 DEGRADER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/44</main-classification>  
        <further-classification edition="200601120260202B">A61K47/38</further-classification>  
        <further-classification edition="200601120260202B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商蒙特羅莎治療股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTE ROSA THERAPEUTICS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克阿利斯特　蘿拉　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCALLISTER, LAURA ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內加什　伯利恆　吉爾瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGASH, BETHLEHEM GIRMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ET</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧萊因科瓦斯　弗拉基米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLEINIKOVAS, VLADIMIRAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　普拉納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, PRANAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里曾　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITZEN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了包含VAV1降解劑的劑型。更特別地，本文揭露了包含3-(2-氯-4'-(2-側氧基吡啶-1(2H)-基)-[1,1'-聯苯基]-3-基)哌啶-2,6-二酮或其藥學上可接受的鹽的劑型。該等劑型可用於例如治療患有可以藉由降低VAV1水平來治療的障礙或疾病的受試者（例如，人類受試者），該障礙或疾病例如係炎性或自體免疫性障礙、移植環境障礙、或癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are dosage forms comprising a VAV1 degrader. More specifically, disclosed herein are dosage forms comprising 3-(2-chloro-4'-(2-oxopyridin-1(2H)-yl)-[1,1'-biphenyl]-3-yl)piperidine-2,6-dione or a pharmaceutically acceptable salt thereof. These dosage forms are useful, e.g., for treating a subject (e.g., a human subject) having a disorder or disease that can be treated by reducing the level of VAV1, for example an inflammatory or autoimmune disorder, a transplantation setting disorder, or a cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1048" publication-number="202619799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體噴射裝置</chinese-title>  
        <english-title>LIQUID JETTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260210B">B05B12/18</main-classification>  
        <further-classification edition="200601120260210B">E02D5/32</further-classification>  
        <further-classification edition="200601120260210B">E02D7/24</further-classification>  
        <further-classification edition="200601120260210B">E21B7/20</further-classification>  
        <further-classification edition="200601120260210B">F15D1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商沃旭能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORSTED WIND POWER A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏普　詹斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUPP, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於在結構(100)安裝期間挖掘土壤的液體噴射裝置(10)。該液體噴射裝置(10)包括噴嘴(20)和第一液體通道(14)，用於將主液體流(18)輸送到噴嘴(20)，以形成沿第一方向的液體射流(24)。第一方向沿著噴嘴(20)的中心線(26)。噴射裝置(10)進一步包括一個或更多第二液體通道(16)，用於將相應第二液體流(28)輸送到液體噴射(24)，用以將液體射流(24)以一定偏轉角偏轉遠離噴嘴(20)的中心線(26)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Liquid jetting device (10) for excavating soil during installation of a structure (100). The liquid jetting device (10) comprising a nozzle (20) and a first liquid channel (14) for feeding a primary liquid flow (18) to the nozzle (20) for forming a liquid jet (24) in a first direction. The first direction along a centreline (26) of the nozzle (20). The jetting device (10) further comprising one or more second liquid channels (16) for feeding a respective secondary liquid flow (28) into the liquid jet (24) for deflecting the liquid jet (24) at a deflection angle away from a centreline (26) of the nozzle (20).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液體噴射裝置</p>  
        <p type="p">12:主體</p>  
        <p type="p">14:第一液體通道</p>  
        <p type="p">16:第二液體通道</p>  
        <p type="p">18:主液體流</p>  
        <p type="p">20:噴嘴</p>  
        <p type="p">22:出口</p>  
        <p type="p">24:液體射流</p>  
        <p type="p">26:中心線</p>  
        <p type="p">28:第二液體流</p>  
        <p type="p">30:出口</p>  
        <p type="p">32:中心線</p>  
        <p type="p">34:控制器</p>  
        <p type="p">36:閥門</p>  
        <p type="p">α:噴射角度</p>  
        <p type="p">β:偏轉角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1049" publication-number="202620955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓄電元件用容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260223B">H01M50/256</main-classification>  
        <further-classification edition="200601120260223B">H01G2/10</further-classification>  
        <further-classification edition="201301120260223B">H01G11/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八木稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGI, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施形態的蓄電元件用容器是包圍單獨一個或多個蓄電元件並進行輸送、移動時的輸送容器、或者包圍單獨一個或多個蓄電元件並進行保存時的保管容器等蓄電元件用容器。蓄電元件用容器具有在收容蓄電元件的容器主體中的收容該蓄電元件的區域與容器主體的空隙中配置有熱解聚性聚合物的發泡成形體的結構。若為此種蓄電元件用容器，則能夠減少在蓄電元件破損或高溫環境等異常時火勢延燒至容器外部的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1050" publication-number="202621382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/60</main-classification>  
        <further-classification edition="202601120260223B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田恭輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋朋宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理基板之基板處理裝置，且上述裝置包含以下。具備：處理槽，其貯存用以蝕刻上述基板之蝕刻液；基板固持器，其保持基板，並將上述基板浸漬於貯存在上述處理槽之上述蝕刻液中；蝕刻液供給部，其係配置於上述處理槽，將上述蝕刻液供給至上述處理槽之內部者，且至少具有：第1噴出孔，其噴出上述蝕刻液之方向朝向上述基板之上部；及第2噴出孔，其配置於較上述第1噴出孔為下方，噴出上述蝕刻液；氣泡供給部，其配置於上述處理槽，自上述基板之下方對上述蝕刻液供給複數個氣泡；及控制器，其控制對於上述基板之處理；上述控制器控制上述蝕刻液供給部，於蝕刻上述基板之整個期間或部分期間，以自上述第1噴出孔噴出上述蝕刻液之噴出量多於自上述第2噴出孔噴出上述蝕刻液之噴出量之方式，調整上述蝕刻液之噴出量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus includes: a processing tank storing an etching liquid; a substrate holder configured to immerse a substrate in the etching liquid; an etching liquid supply unit configured to supply the etching liquid into the processing tank, and including a first discharge hole in which a direction in which the etching liquid is discharged is directed to an upper portion of the substrate, and a second discharge hole disposed below the first discharge hole; an air bubble supply unit configured to supply air bubbles to the etching liquid from below the substrate; and a controller, wherein the controller controls the etching liquid supply unit to adjust a discharge amount of the etching liquid from the first discharge hole to be larger than a discharge amount of the etching liquid from the second discharge hole in a whole or part of a period of etching the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板處理裝置</p>  
        <p type="p">110:處理槽</p>  
        <p type="p">112:內槽</p>  
        <p type="p">114:外槽</p>  
        <p type="p">115A:底部</p>  
        <p type="p">115B:側壁部</p>  
        <p type="p">116:第1側壁</p>  
        <p type="p">117:第2側壁</p>  
        <p type="p">120:基板保持部</p>  
        <p type="p">122:本體板</p>  
        <p type="p">124:保持棒</p>  
        <p type="p">126:升降單元</p>  
        <p type="p">130:蝕刻供給部</p>  
        <p type="p">131:上蝕刻供給部</p>  
        <p type="p">131a:上噴出孔</p>  
        <p type="p">131X:上蝕刻液供給部</p>  
        <p type="p">131Y:上蝕刻液供給部</p>  
        <p type="p">132:下蝕刻供給部</p>  
        <p type="p">132a:下噴出孔</p>  
        <p type="p">132X:下蝕刻液供給部</p>  
        <p type="p">132Y:下蝕刻液供給部</p>  
        <p type="p">133:底蝕刻供給部</p>  
        <p type="p">133a:底噴出孔</p>  
        <p type="p">133X:底蝕刻液供給部</p>  
        <p type="p">133Y:底蝕刻液供給部</p>  
        <p type="p">134:蝕刻液供給源</p>  
        <p type="p">135:蝕刻液噴出量調整部</p>  
        <p type="p">140:氣泡供給部</p>  
        <p type="p">141:氣泡孔</p>  
        <p type="p">141a:氣泡孔</p>  
        <p type="p">142:氣泡供給管</p>  
        <p type="p">143:氣體供給源</p>  
        <p type="p">145:氣泡噴出量調整部</p>  
        <p type="p">150:排液部</p>  
        <p type="p">151:排液配管</p>  
        <p type="p">160:控制裝置</p>  
        <p type="p">161:控制部</p>  
        <p type="p">162:記憶部</p>  
        <p type="p">LQ:蝕刻液</p>  
        <p type="p">P1:共通配管</p>  
        <p type="p">P2:供給配管</p>  
        <p type="p">P3:共通配管</p>  
        <p type="p">P4:供給配管</p>  
        <p type="p">P5:排液配管</p>  
        <p type="p">X:寬度方向</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Z:鉛直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1051" publication-number="202619710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在手性鈀或鎳催化劑的存在下鏡像選擇性氫化4-取代的2-唑酮</chinese-title>  
        <english-title>ENANTIOSELECTIVE HYDROGENATION OF 4-SUBSTITUTED 2-OXAZOLONES IN PRESENCE OF A CHIRAL PALLADIUM OR NICKEL CATALYST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/4164</main-classification>  
        <further-classification edition="200601120260202B">C07C13/02</further-classification>  
        <further-classification edition="200601120260202B">C07C215/36</further-classification>  
        <further-classification edition="200601120260202B">C07D263/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商拜耳廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾達斯　謝利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALDAS, SHERIF JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾平　朱利歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLPIN, GIULIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布羅姆　迪爾克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROHM, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷斯坦　飛利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLSTEIN, PHILIPP MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖特斯　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOTES, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博拉裘　卡列加　古斯塔沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORRAJO-CALLEJA, GUSTAVO MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林克　阿希姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINK, ACHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯賓德勒　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPINDLER, FELIX HERBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種鏡像選擇性製備手性 4-取代 2-氧雜唑啶酮的方法，該方法透過相應的 4-取代 2-氧雜唑酮的不對稱氫化反應，使用鈀或鎳與手性雙齒 P-配體的組合作為催化劑。然後，這些氧雜唑啶酮可以透過脫羧環開反應轉化為重要的手性砌塊，如對映純手性胺基醇和鹵胺。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for the enantioselective preparation of chiral 4-substituted 2-oxazolidinones via asymmetric hydrogenation of the corresponding 4-substitued 2-oxazolones using a combination of palladium or nickel and a chiral bidentate P-ligand as catalyst. The oxazolidinones can then be converted to important chiral building blocks such as enantiopure chiral aminoalcohols and haloamines via decarboxylative ring opening reaction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1052" publication-number="202620257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以調節流量的擾流凸起和相關的腔室套件、方法及處理腔室</chinese-title>  
        <english-title>DISRUPTIVE FLOW PROTRUSIONS TO ADJUST FLOW, AND RELATED CHAMBER KITS, METHODS, AND PROCESSING CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C30B25/14</main-classification>  
        <further-classification edition="200601120260223B">C30B25/16</further-classification>  
        <further-classification edition="200601120260223B">C30B25/10</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHIAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王夢靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MENGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　佟岳貝奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEUNG, TOI YUE BECKY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　作明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZUOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於半導體處理腔室，並且更特定而言，關於用以調節氣流的擾流凸起。在一或多個實施例中，處理腔室包括基板支撐件、位於基板支撐件上方的板、用以提供跨板與基板支撐件之間的氣流路徑流動的氣體的一或多個氣體入口，以及一或多個凸起，其從板朝向基板支撐件延伸到氣流路徑中，以擾亂氣體在氣流路徑中的流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to semiconductor processing chambers, and more particularly, to disruptive flow protrusions to adjust gas flow. In one or more embodiments, a processing chamber includes a substrate support, a plate above the substrate support, one or more gas inlets to provide gas that flows across a gas flow path between the plate and the substrate support, and one or more protrusions extending from the plate towards the substrate support into the gas flow path to disrupt a flow of the gas in the gas flow path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基板</p>  
        <p type="p">106:基板支撐件</p>  
        <p type="p">107:升舉銷穿孔</p>  
        <p type="p">108:上板</p>  
        <p type="p">110:下板</p>  
        <p type="p">111:隔離板</p>  
        <p type="p">112:流量模組</p>  
        <p type="p">115:凸起</p>  
        <p type="p">116:氣體排放出口</p>  
        <p type="p">118:軸</p>  
        <p type="p">120:控制器</p>  
        <p type="p">121:運動組件</p>  
        <p type="p">123:支撐面</p>  
        <p type="p">132:升舉銷</p>  
        <p type="p">136a:下部</p>  
        <p type="p">136b:上部</p>  
        <p type="p">138:淨化容積</p>  
        <p type="p">141:上熱源</p>  
        <p type="p">143:下熱源</p>  
        <p type="p">145:下熱源模組</p>  
        <p type="p">148:下主體</p>  
        <p type="p">151:製程氣體源</p>  
        <p type="p">152:地板</p>  
        <p type="p">153:清洗氣體源</p>  
        <p type="p">154:蓋子</p>  
        <p type="p">155:上熱源模組</p>  
        <p type="p">156:上主體</p>  
        <p type="p">157:排氣泵</p>  
        <p type="p">162:淨化氣體源</p>  
        <p type="p">164:淨化氣體入口</p>  
        <p type="p">178:排氣系統</p>  
        <p type="p">302:預熱環</p>  
        <p type="p">304:止動件</p>  
        <p type="p">305a:臂</p>  
        <p type="p">305b:臂</p>  
        <p type="p">311:下襯墊</p>  
        <p type="p">1000:處理腔室</p>  
        <p type="p">1010:腔室套件</p>  
        <p type="p">1012:第一外面</p>  
        <p type="p">1013:第二外面</p>  
        <p type="p">1014:第一入口開口</p>  
        <p type="p">1015:第二入口開口</p>  
        <p type="p">1020:上襯墊</p>  
        <p type="p">1021:環形部分</p>  
        <p type="p">1022:內側突出部分</p>  
        <p type="p">1023:入口開口/出口開口</p>  
        <p type="p">1024:內表面</p>  
        <p type="p">1025:出口開口</p>  
        <p type="p">1026:外表面</p>  
        <p type="p">1027:第一延伸部</p>  
        <p type="p">1028:第二延伸部</p>  
        <p type="p">1029:下表面</p>  
        <p type="p">P1:製程氣體</p>  
        <p type="p">P2:淨化氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1053" publication-number="202620933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有用於射頻傳輸線的溝槽的腔室主體</chinese-title>  
        <english-title>CHAMBER BODY WITH TRENCH FOR RF TRANSMISSION LINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">H01J37/32</main-classification>  
        <further-classification edition="200601120260203B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓蒙得四世　愛德華Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMOND, IV, EDWARD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪日諾　狄米奇Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DZILNO, DMITRY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種晶圓處理系統。在一個態樣，晶圓處理系統包括腔室主體，該腔室主體經排列以支撐複數個處理腔室。腔室主體定義了在其內部形成的溝槽的至少一部分。晶圓處理系統還包括設置於溝槽內的傳輸線，用以將電源供應器的輸出與設置於複數個處理腔室中相應腔室內的複數個天線中相應天線電氣耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer processing system is provided. In one aspect, the wafer processing system includes a chamber body arranged to support a plurality of process chambers. The chamber body defines at least a portion of a trench formed within the chamber body. The wafer processing system also includes transmission lines disposed within the trench to electrically couple an output of a power supply with respective ones of a plurality of antennas disposed within respective ones of the plurality of process chambers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:多個處理腔室</p>  
        <p type="p">110A:第一處理腔室</p>  
        <p type="p">110B:第二處理腔室</p>  
        <p type="p">110C:第三處理腔室</p>  
        <p type="p">110D:第四處理腔室</p>  
        <p type="p">111:腔室主體</p>  
        <p type="p">206:傳輸線</p>  
        <p type="p">206A:第一傳輸線</p>  
        <p type="p">206B:第二傳輸線</p>  
        <p type="p">206C:第三傳輸線</p>  
        <p type="p">206D:第四傳輸線</p>  
        <p type="p">302:頂表面</p>  
        <p type="p">304:底表面</p>  
        <p type="p">306:第一側壁表面</p>  
        <p type="p">308:第二側壁表面</p>  
        <p type="p">314:外殼</p>  
        <p type="p">316:第一側</p>  
        <p type="p">318:第二側</p>  
        <p type="p">320:溝槽</p>  
        <p type="p">RP:參考平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1054" publication-number="202620131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125998</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08L83/10</main-classification>  
        <further-classification edition="200601120260223B">C08L63/00</further-classification>  
        <further-classification edition="200601120260223B">C08L79/04</further-classification>  
        <further-classification edition="201801120260223B">C08K3/013</further-classification>  
        <further-classification edition="200601120260223B">C08G59/42</further-classification>  
        <further-classification edition="200601120260223B">C08G73/06</further-classification>  
        <further-classification edition="200601120260223B">C08G77/452</further-classification>  
        <further-classification edition="200601120260223B">B32B27/00</further-classification>  
        <further-classification edition="200601120260223B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滑方奈那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMEKATA, NANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中沢正和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是提供帶來顯示優異的介電特性和優異的密著性的硬化物的樹脂組成物。本發明的解決手段是一種樹脂組成物，其含有：(1A)具有下述式(A-1)所示的結構單元和下述式(A-2)所示的結構單元的聚合物、(B)環氧樹脂、以及(C)無機填充材料。 &lt;br/&gt;　　&lt;img align="absmiddle" height="111px" width="386px" file="ed10074.JPG" alt="ed10074.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(A-1)和式(A-2)中，R&lt;sup&gt;1&lt;/sup&gt;各自獨立地為以選自碳原子、氫原子、氧原子、氮原子、矽原子和硫原子中的原子作為構成原子的一價有機基，並且R&lt;sup&gt;1&lt;/sup&gt;的分子量為250以上，R&lt;sup&gt;1&lt;/sup&gt;不具有乙烯性不飽和基，R&lt;sup&gt;1&lt;/sup&gt;不含三嗪骨架和可經氫化的雙酚骨架中的至少一者。A各自獨立地表示具有可經氫化的雙酚骨架的二價有機基。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1055" publication-number="202620948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制流向燃料電池系統之燃料電池柱之燃料流的燃料入口閥系統</chinese-title>  
        <english-title>FUEL INLET VALVE SYSTEMS FOR CONTROLLING FUEL FLOW TO FUEL CELL COLUMNS OF A FUEL CELL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260213B">H01M8/04746</main-classification>  
        <further-classification edition="200601120260213B">F16K1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博隆能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾塔　格拉　羅德里戈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORTA-GUERRA, RODRIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斑戈　卡蘭帕爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHANGU, KARANPAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿夏瑞　阿第爾　阿巴斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHARY, ADIL ABBAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百美　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAIME, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楚卡　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRUCHA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示控制流向燃料電池柱之燃料流之燃料入口閥系統。其等包含具有耦合至繫定式線性致動器之閥桿之閥，該繫定式線性致動器基於致動器信號來調整閥頭之位置。該閥頭之該位置控制該燃料入口與該燃料電池柱之間的該燃料流。該等致動器信號由控制系統發送，該控制系統可基於該燃料電池柱之健康來調整流向該等燃料電池柱之任何者之該燃料流，從而重新平衡該燃料電池系統，或其類似者。該閥頭包含閥面，該閥面基於其相對於閥座或陶瓷球之位置來調整燃料流，該陶瓷球基於其相對於通向該燃料電池柱之燃料導管內之金屬環之位置來調整燃料流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Fuel inlet valve systems are that control fuel flow to fuel cell columns are disclosed. They include a valve with a valve stem coupled to a captive linear actuator that adjusts the position of the valve head based on actuator signals. The position of the valve head controls the fuel flow between the fuel inlet and the fuel cell column. The actuator signals are sent by a control system that may adjust the fuel flow to any of the fuel cell columns based on health of the fuel cell column, rebalancing the fuel cell system, or the like. The valve head includes a valve face that adjusts fuel flow based on its position with respect to a valve seat or a ceramic ball that adjusts fuel flow based on its position with respect to a metallic ring inside the fuel conduit leading to the fuel cell column.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:熱箱</p>  
        <p type="p">101:控制系統</p>  
        <p type="p">102:信號電纜</p>  
        <p type="p">103:信號線</p>  
        <p type="p">105:放大圖</p>  
        <p type="p">110:燃料入口閥系統</p>  
        <p type="p">115:成形過渡管</p>  
        <p type="p">120:閥座</p>  
        <p type="p">125:閥</p>  
        <p type="p">125a:閥面</p>  
        <p type="p">125b:閥桿</p>  
        <p type="p">127:公螺紋部分</p>  
        <p type="p">130:閥波紋管</p>  
        <p type="p">135:螺紋耦合器</p>  
        <p type="p">137:母螺紋部分</p>  
        <p type="p">139:母螺紋部分</p>  
        <p type="p">140:線性致動器</p>  
        <p type="p">142:公螺紋部分</p>  
        <p type="p">145:致動器安裝座</p>  
        <p type="p">150:燃料入口</p>  
        <p type="p">155:燃料導管</p>  
        <p type="p">160:隔熱材料</p>  
        <p type="p">165:隔熱材料</p>  
        <p type="p">170:下部分閥室</p>  
        <p type="p">175:隔熱室</p>  
        <p type="p">180:上部分閥室</p>  
        <p type="p">185:頂部板</p>  
        <p type="p">190:底部板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1056" publication-number="202620196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＰＴＲＧ１及羥基脲甲基醯基富烯的伴隨式診斷</chinese-title>  
        <english-title>COMPANION DIAGNOSTIC FOR PTRG1 AND HYDROXYUREA METHYLACYLFULVENE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">C12Q1/6876</main-classification>  
        <further-classification edition="201801120260202B">C12Q1/6886</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商藍騰製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTERN PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂亞　基紹爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, KISHOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　阿迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, ADITYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　建利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIANLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種伴隨式診斷方法、套組及整合系統，用於對患者樣本中之前列腺素還原酶1 (PTGR1)表現進行定量。當所量測之表現等於或超過預定臨限值時，選擇該患者來接受羥基脲甲基醯基富烯(LP-184)或相關醯基富烯。本發明能夠實現個人化癌症治療，改良客觀反應率且將引起無效治療的不必要暴露降至最低。亦提供用於治療PTGR1陽性實體腫瘤及血液惡性病的醫藥組合、用途及技術方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A companion diagnostic method, kit, and integrated system for quantifying expression of Prostaglandin Reductase 1 (PTGR1) in a patient sample are disclosed. When the measured expression equals or exceeds a predetermined threshold, the patient is selected to receive hydroxyurea methylacylfulvene (LP-184) or a related acylfulvene. The invention enables personalized cancer therapy, improves objective response rates, and minimizes unnecessary exposure to ineffective treatment. Also provided are pharmaceutical combinations, uses, and claims for treating PTGR1-positive solid tumors and hematological malignancies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1057" publication-number="202621312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10D88/00</main-classification>  
        <further-classification edition="202501120260223B">H10D30/60</further-classification>  
        <further-classification edition="202501120260223B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炳鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, BYUNGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金民佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃東勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, DONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONGKWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元暢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WONCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全在鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, JAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括基底、設置在基底上並在平行於基底表面的第一方向上彼此間隔開的多個電晶體結構，多個電晶體結構中的每一個包括下部主動圖案和在與第一方向相交的第二方向上與下部主動圖案間隔開的上部主動圖案、設置在多個電晶體結構中兩個相鄰電晶體結構之間的閘極切割薄膜、對於每個下部主動圖案，圍繞下部主動圖案的至少第一部分的第一層、以及設置在每個第一層上的第二層。多個電晶體結構中的每一個包括圍繞下部主動圖案的第一部分的第一功函數薄膜和圍繞上部主動圖案的至少第一部分並在第一方向上延伸的第二功函數薄膜，並且閘極切割薄膜穿透第二功函數薄膜以在第二功函數薄膜的第一部分和第二功函數薄膜的第二部分之間形成間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate, a plurality of transistor structures disposed on the substrate and spaced apart from each other in a first direction parallel to a surface of the substrate, each of the plurality of transistor structures including a lower portion active pattern and an upper portion active pattern spaced apart from the lower portion active pattern in a second direction intersecting the first direction, a gate cut film disposed between two adjacent transistor structures of the plurality of transistor structures, for each lower portion active pattern, a first layer that surrounds at least a first portion of the lower portion active pattern, and a second layer disposed on each first layer. Each of the plurality of transistor structures includes a first work-function film surrounding the first portion of the lower portion active pattern and a second work-function film that surrounds at least a first portion of the upper portion active pattern and extends in the first direction, and the gate cut film penetrates through the second work-function film to form a gap between a first part of the second work-function film and a second part of the second work-function film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">100S:表面</p>  
        <p type="p">101:鰭式圖案</p>  
        <p type="p">105:場絕緣膜</p>  
        <p type="p">115:分離絕緣膜</p>  
        <p type="p">115_US,L1_US,WFM1_US:上表面</p>  
        <p type="p">130:閘極介電膜</p>  
        <p type="p">AP1:第一主動圖案</p>  
        <p type="p">AP1_BT:第一下部主動圖案/下部主動圖案</p>  
        <p type="p">AP1_UT:第一上部主動圖案/上部主動圖案</p>  
        <p type="p">AP2:第二主動圖案</p>  
        <p type="p">AP2_BT:第二下部主動圖案/下部主動圖案</p>  
        <p type="p">AP2_UT:第二上部主動圖案/上部主動圖案</p>  
        <p type="p">CB:閘極接觸件</p>  
        <p type="p">CB_b:閘極接觸障壁薄膜</p>  
        <p type="p">CB_f:閘極接觸填充薄膜</p>  
        <p type="p">CT:閘極切割薄膜</p>  
        <p type="p">CT_BS,WFM2_BS:底表面</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">ES1:第一蝕刻停止膜</p>  
        <p type="p">ES2:第二蝕刻停止膜</p>  
        <p type="p">FET1:第一電晶體結構/電晶體結構</p>  
        <p type="p">FET2:第二電晶體結構/電晶體結構</p>  
        <p type="p">GP:閘極覆蓋薄膜</p>  
        <p type="p">ILD1,ILD2:絕緣膜</p>  
        <p type="p">L1:第一層</p>  
        <p type="p">L2:第二層</p>  
        <p type="p">P:部分</p>  
        <p type="p">PC:閘極線路</p>  
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;,T&lt;sub&gt;2&lt;/sub&gt;:長度</p>  
        <p type="p">WFM1:第一功函數薄膜</p>  
        <p type="p">WFM2:第二功函數薄膜</p>  
        <p type="p">WL:配線</p>  
        <p type="p">WL_b:配線障壁薄膜</p>  
        <p type="p">WL_f:配線填充薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1058" publication-number="202619767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高爾夫球桿頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260205B">A63B53/04</main-classification>  
        <further-classification edition="200601120260205B">B32B5/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商普瑞吉股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRGR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原紀彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHARA, NORIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種高爾夫球桿頭，係能夠確保耐久性，並且能夠輕量化、高強度、高反彈性能、高初速區域擴大，且獲得良好之打擊感。 &lt;br/&gt;　　於桿面部(14)以桿面部本體(30)及具備偏壁構造之纖維強化樹脂層(32)構成之中空構造之高爾夫球桿頭(10A)中，將圓形或橢圓形或多角形之複數個第1纖維強化樹脂單位層(36)，以使該等之圖心與桿面部(14)之中心一致之方式層積，而藉此構成纖維強化樹脂層(32)，並將纖維強化樹脂層(32)之厚度，形成為隨著遠離桿面部(14)之中心逐漸變化。如此使纖維不連續部之形狀平滑地變化，並且纖維不連續部不致集中而分散，故能夠確保較長之纖維不連續部之分散距離，而相較於以往有利於防止層間剝離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:纖維強化樹脂層</p>  
        <p type="p">36:第1纖維強化樹脂層</p>  
        <p type="p">36A:桿面用纖維強化樹脂單位層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1059" publication-number="202620223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜方法及成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/30</main-classification>  
        <further-classification edition="200601120260223B">C23C16/50</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, MIYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木奈央子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光成正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUNARI, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛田天太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHIDA, TENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱下大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMASHITA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在光阻膜的圖案不會塌陷的情況下在光阻膜的頂部選擇性成膜出碳系膜。 &lt;br/&gt;  基板係具備含矽膜及形成在該含矽膜上之光阻膜，藉由使該光阻膜局部地不存在而在光阻膜形成有具有底部的多個圖案，相鄰的2個圖案之間的光阻膜係具有頂部，含矽膜係在圖案的底部露出，從至少包含烴氣及氫氣之成膜氣體產生電漿，使基板曝露於電漿以對光阻膜之頂部選擇性成膜出碳系膜， &lt;br/&gt;控制成膜氣體中烴氣及氫氣的流量比率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1060" publication-number="202619970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對碳化矽多型體之深度辨識</chinese-title>  
        <english-title>IN DEPTH POLYTYPE IDENTIFICATION IN SILICON CARBIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260204B">C01B32/956</main-classification>  
        <further-classification edition="200601120260204B">G01N21/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利東皮埃蒙特大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITA DEGLI STUDI DEL PIEMONTE ORIENTALE (UPO)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉　伊麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALA, ELISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙盧堤　賽莫尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERRUTI, SIMONE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格提　喬治爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GATTI, GIORGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞莫羅　魯西諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMELLO, LUCIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莎娜　瑪麗亞　克莉絲緹娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANNA, MARIA CRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬非　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAFFE, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐文慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嫚萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MAN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示判定一碳化矽結構之多型體之方法。對一拉曼微光譜計供電以將一雷射引導於該碳化矽結構之前表面處。該拉曼微光譜計之焦深經調變以在結構之表面下方之不同深度處產生複數個拉曼光譜。該等拉曼光譜用於判定SiC多型體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for determining polytypes of a silicon-carbide structure are disclosed. A Raman microspectrometer is powered to direct a laser at the front surface of the silicon-carbide structure. The depth of focus of the Raman microspectrometer is modulated to generate a plurality of Raman spectra at different depths below the surface of the structure. The Raman spectra are used to determine the SiC polytype.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碳化矽結構/樣本</p>  
        <p type="p">12:前表面</p>  
        <p type="p">25:拉曼微光譜計</p>  
        <p type="p">29:雷射</p>  
        <p type="p">31:線路濾波器</p>  
        <p type="p">35:分束器/攝譜儀</p>  
        <p type="p">39:物鏡/透鏡</p>  
        <p type="p">43:濾波器</p>  
        <p type="p">47:共焦針孔</p>  
        <p type="p">51:鏡</p>  
        <p type="p">53:入口狹縫</p>  
        <p type="p">57:繞射光柵</p>  
        <p type="p">59:鏡</p>  
        <p type="p">65:電荷耦合裝置(CCD)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1061" publication-number="202619864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人系統的演算裝置及模擬方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B25J9/22</main-classification>  
        <further-classification edition="200601220260202B">B25J13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有谷拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARITANI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機器人系統的演算裝置，以進行機器人系統的模擬，機器人系統包括具有複數關節的機器人，以及安裝於機器人並對工作對象物在複數工作點進行預定之工作的工具，所進行的工作係指由工具及工作對象物的其中一個所發生的力及力矩至少其中之一作用於工具及工作對象物的另一個，演算裝置包括至少一個處理器及至少一個記憶體；記憶體內儲存數學模型，處理器執行使用儲存在記憶體內的數學模型，推定機器人、工具及工作對象物至少其中一個的負荷或是變形量；及基於推定出來的負荷或是變形量，探索使二個以上工作點所對應的無論是負荷或是變形量小於等於預定閾值的共通參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1~A6:關節</p>  
        <p type="p">B:軸線</p>  
        <p type="p">C0:機器人座標系</p>  
        <p type="p">C1:前端座標系</p>  
        <p type="p">C2:工具座標系</p>  
        <p type="p">F:地面</p>  
        <p type="p">PW:工作點</p>  
        <p type="p">S:工具</p>  
        <p type="p">X0:軸</p>  
        <p type="p">X1:軸</p>  
        <p type="p">X2:軸</p>  
        <p type="p">Y0:軸</p>  
        <p type="p">Y1:軸</p>  
        <p type="p">Y2:軸</p>  
        <p type="p">Z0:軸</p>  
        <p type="p">Z1:軸</p>  
        <p type="p">Z2:軸</p>  
        <p type="p">J1:第一軸線</p>  
        <p type="p">J2:第二軸線</p>  
        <p type="p">J3:第三軸線</p>  
        <p type="p">J4:第四軸線</p>  
        <p type="p">J5:第五軸線</p>  
        <p type="p">J6:第六軸線</p>  
        <p type="p">10:機器人系統</p>  
        <p type="p">20:機器人</p>  
        <p type="p">21:基座</p>  
        <p type="p">22:旋轉胴體</p>  
        <p type="p">23:第一手臂</p>  
        <p type="p">24:第二手臂</p>  
        <p type="p">25:手腕單元</p>  
        <p type="p">25a:第一手腕元件</p>  
        <p type="p">25b:第二手腕元件</p>  
        <p type="p">25c:第三手腕元件</p>  
        <p type="p">30:電動起子</p>  
        <p type="p">31:本體部</p>  
        <p type="p">35:插座部</p>  
        <p type="p">40:工作對象物</p>  
        <p type="p">50:螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1062" publication-number="202619655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱烹調器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A47J27/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井岡葵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IOKA, AOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實現能夠縮短烹調時間的加熱烹調器。&lt;br/&gt; 加熱烹調器（1）包括：加熱部（22），其對內膽（13）進行加熱；攪拌機構（33），其對所述內膽內部的食材進行攪拌；蓋體溫度感測器（26）；以及控制部（34），其控制所述加熱部和所述攪拌部的動作，在第一規定時間以內進行加熱烹調的第二烹調菜單中，在從開始加熱烹調起到所述蓋體溫度感測器檢測到第一規定溫度的定時開始攪拌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">（無）</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加熱烹調器</p>  
        <p type="p">11:烹調器主體(框體)</p>  
        <p type="p">12:蓋體</p>  
        <p type="p">31:外蓋</p>  
        <p type="p">34:控制部</p>  
        <p type="p">35:馬達</p>  
        <p type="p">36:揚聲器</p>  
        <p type="p">37:操作顯示部</p>  
        <p type="p">371:顯示部</p>  
        <p type="p">372:操作按鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1063" publication-number="202621443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>台座、基板處理裝置、及溫度調整方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田陽一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供能夠適當地調整基板的溫度之技術。 &lt;br/&gt;台座係會調整其載置面上所載置之基板的溫度。台座係具有：載置板部，係具有該載置面；熱交換室，係設置在該載置板部的下方；以及多個噴出部，係在該熱交換室設置成和該載置板部相對向，會向該載置板部噴出液體。該多個噴出部係能夠選擇性或同時執行在混合氣體以將該液體霧化後的狀態下對該載置板部進行噴出的噴霧模式與對該載置板部僅噴出該液體的噴流模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:台座</p>  
        <p type="p">45:載置台</p>  
        <p type="p">45s:載置面</p>  
        <p type="p">47:吸盤頂部</p>  
        <p type="p">471:載置板部</p>  
        <p type="p">471t:頂面</p>  
        <p type="p">472:基部</p>  
        <p type="p">472f:底面</p>  
        <p type="p">473:周壁</p>  
        <p type="p">474:熱交換室</p>  
        <p type="p">475:溫度感測器</p>  
        <p type="p">48:加熱器</p>  
        <p type="p">50:溫度調整機構</p>  
        <p type="p">51:噴出部</p>  
        <p type="p">52:液體供應道</p>  
        <p type="p">53:氣體供應道</p>  
        <p type="p">54:排出道</p>  
        <p type="p">54a:排出口</p>  
        <p type="p">55:循環路徑</p>  
        <p type="p">56:供應路徑</p>  
        <p type="p">57:熱交換器</p>  
        <p type="p">58:泵</p>  
        <p type="p">59:冷卻器</p>  
        <p type="p">60:壓縮機</p>  
        <p type="p">61:排氣路徑</p>  
        <p type="p">62:壓力調整裝置</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1064" publication-number="202620825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示基板和顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G09G3/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京京東方技術開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝学光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUEGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乔勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAO, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刘烺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種顯示基板和顯示裝置。顯示基板包括基底、像素電路和驅動模組，所述基底包括顯示區域和周邊區域，所述像素電路設置於所述顯示區域，所述驅動模組設置於所述周邊區域；所述驅動模組包括多級驅動電路；所述周邊區域包括多個驅動電路區域；所述驅動電路包括電路元件、轉接線和信號線；所述電路元件包括至少一個電晶體和至少一個電容；所述電路元件包括的至少兩電極之間通過所述轉接線電連接；所述電路元件處於的電路元件區域的面積與所述驅動電路區域的面積之間的比值大於0.56而小於1。本揭露所述的顯示基板能夠實現窄邊框。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:第一電容</p>  
        <p type="p">C2:第二電容</p>  
        <p type="p">CB:第二時鐘信號線</p>  
        <p type="p">CK:第一時鐘信號線</p>  
        <p type="p">DX1:第一導電圖形</p>  
        <p type="p">DX2:第二導電圖形</p>  
        <p type="p">H1:第一過孔</p>  
        <p type="p">H2:第二過孔</p>  
        <p type="p">T1:第一電晶體</p>  
        <p type="p">T2:第二電晶體</p>  
        <p type="p">T3:第三電晶體</p>  
        <p type="p">T4:第四電晶體</p>  
        <p type="p">T5:第五電晶體</p>  
        <p type="p">T6:第六電晶體</p>  
        <p type="p">T7:第七電晶體</p>  
        <p type="p">T8:第八電晶體</p>  
        <p type="p">VGH:高電壓線</p>  
        <p type="p">VGL:低電壓線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1065" publication-number="202620920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子透鏡</chinese-title>  
        <english-title>A CHARGED PARTICLE LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H01J37/10</main-classification>  
        <further-classification edition="200601120260213B">H01J37/14</further-classification>  
        <further-classification edition="200601120260213B">H01J37/26</further-classification>  
        <further-classification edition="200601120260213B">H01J37/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦西娜　拉多萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASINA, RADOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞達　博胡斯拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SED'A, BOHUSLAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯托普卡　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOPKA, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯斯納科　尤拉伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSNACKO, JURAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西爾斯　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEARS, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於將帶電粒子束聚焦至放在樣品位置處的樣品的帶電粒子透鏡。所述帶電粒子透鏡包括第一極靴、第二極靴、透鏡線圈和至少一個電壓源。所述第二極靴與所述第一極靴電絕緣並且具有中心孔，其中，所述第二極靴設置為與同樣具有中心孔的所述第一極靴對準，使得所述帶電粒子透鏡的中心軸依次穿過所述第一極靴的中心孔和所述第二極靴的中心孔。所述透鏡線圈佈置為可在所述第一極靴和所述第二極靴處產生磁場，同時配置的至少一個電壓源用於在所述第二極靴與所述樣品之間施加電位差以產生電場。通過所述第一極靴和所述第二極靴中心孔的帶電粒子束，將在所述產生的磁場與產生的電場的共同作用下聚焦於樣品表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charged particle lens for focusing a beam of charged particles towards a sample mounted at a sample position. The charged particle lens comprises a first pole piece, a second pole piece, a lens coil and at least one voltage supply. The second pole piece is electrically insulated from the first pole piece and has a central aperture, wherein the second pole piece is arranged to be aligned with the first pole piece, which also has a central aperture, such that a central axis of the charged particle lens extends through the central aperture of the first pole piece and the second pole piece. The lens coil is arranged to generate a magnetic field at the first pole piece and at the second pole piece, and the at least one voltage supply is arranged to apply a potential difference between the second pole piece and the sample to generate an electric field. The generated magnetic field and generated electric field focuses a beam of charged particles passing through the central apertures of the first and the second pole piece towards the sample.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:樣品</p>  
        <p type="p">114:第一極靴</p>  
        <p type="p">116:第二極靴</p>  
        <p type="p">118:中心軸</p>  
        <p type="p">120:絕緣元件</p>  
        <p type="p">124:增強管</p>  
        <p type="p">130:第一電壓源</p>  
        <p type="p">131:第二電壓源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1066" publication-number="202619715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>哌啶化合物</chinese-title>  
        <english-title>PIPERIDINE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/445</main-classification>  
        <further-classification edition="200601120260202B">C07D211/34</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商特洛治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELO THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威道森　凱薩琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIDDOWSON, KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELL, RORBERT JOSEPH ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於哌啶化合物及其醫藥組成物，其為XPO1的抑制劑且有用於治療諸如癌症之疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to piperidine compounds, and pharmaceutical compositions of the same, that are inhibitors of XPO1 and are useful in the treatment of diseases such as cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1067" publication-number="202620295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>渦輪分子真空泵、泵送組件和泵送設備</chinese-title>  
        <english-title>TURBOMOLECULAR VACUUM PUMP, PUMPING ASSEMBLY AND PUMPING INSTALLATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">F04D19/04</main-classification>  
        <further-classification edition="200601120260210B">F04D27/02</further-classification>  
        <further-classification edition="200601120260210B">F04D29/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商普發真空公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFEIFFER VACUUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瓦雷克　皮埃伊曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAVAREC, PIERRE-EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里亞多　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRIADO, ROMAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴博薩莫雷拉　阿利森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARBOSA MOREIRA, ALYSSON BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯姆　維克多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUM, VICTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種渦輪分子真空泵(1)，包括定子(2)，其包括圍繞吸入埠(4)的固定凸緣(6)，並且其中形成要插入螺釘(300)的複數個通孔(20)，通孔(20)包括形成在固定凸緣(6)的遠端環形部件(22)中的遠端區段(21)。通孔(20)在固定凸緣(6)的近端環形部件(23)的外周處開啟，鄰近遠端環形部件(22)，並且位於渦輪分子真空泵(1)的吸入埠(4)的側邊，以便能夠至少部分地看到渦輪分子真空泵(1)和固定結構壁(101)之間的連接區域(Z)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Turbomolecular vacuum pump (1) including a stator (2) including a fixing flange (6) around a suction port (4) and wherein are formed a plurality of through-holes (20) for the insertion of screws (300), the through-holes (20) including a distal section (21) formed in a distal annular part (22) of the fixing flange (6). The through-holes (20) are opened up at the external periphery in a proximal annular part (23) of the fixing flange (6) adjacent to the distal annular part (22) and situated on the side of the suction port (4) of the turbomolecular vacuum pump (1) in such a manner as to enable at least partial viewing of a connecting zone (Z) between the turbomolecular vacuum pump (1) and the fixed structural wall (101).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:渦輪分子真空泵</p>  
        <p type="p">2:定子</p>  
        <p type="p">2a:殼體</p>  
        <p type="p">2b:高壓套管</p>  
        <p type="p">3:轉子</p>  
        <p type="p">4:吸入埠/埠</p>  
        <p type="p">5:霍爾維克裙部</p>  
        <p type="p">6:固定凸緣</p>  
        <p type="p">7:螺旋槽</p>  
        <p type="p">8:外殼</p>  
        <p type="p">9:環形定子級</p>  
        <p type="p">10:鰭片轉子級</p>  
        <p type="p">11:輪轂</p>  
        <p type="p">12:驅動軸</p>  
        <p type="p">15:內碗</p>  
        <p type="p">16:馬達</p>  
        <p type="p">17:圓頂</p>  
        <p type="p">20:通孔</p>  
        <p type="p">26:環形槽</p>  
        <p type="p">27:密封件</p>  
        <p type="p">100:泵送設備</p>  
        <p type="p">101:固定結構壁</p>  
        <p type="p">102:螺紋孔</p>  
        <p type="p">103:排氣埠</p>  
        <p type="p">200:泵送組件</p>  
        <p type="p">300:螺釘</p>  
        <p type="p">310:螺釘頭</p>  
        <p type="p">I-I:旋轉軸線</p>  
        <p type="p">Z:連接區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1068" publication-number="202620437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用工業擬人機器人之四點探針測量矽材料之電阻率</chinese-title>  
        <english-title>RESISTIVITY MEASUREMENT OF SILICON MATERIAL USING FOUR POINT PROBES ON INDUSTRIAL ANTHROPOMORPHIC ROBOTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01R1/067</main-classification>  
        <further-classification edition="200601120260202B">G01R27/08</further-classification>  
        <further-classification edition="200601120260202B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞更　恩瑞可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGON, ENRICO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡沙林　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASALIN, DANIELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫瑞多　丹倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORELATO, DYLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐瑞茲　雷多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODORIZZI, RENZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於半導體工件之電阻率測量系統包含可圍繞至少六個軸線移動之一擬人臂、連接至該擬人臂之一滑道及一半導體工件支撐件。該擬人臂包含一末端效應器及一電阻率探針。該電阻率探針連接至該末端效應器且經組態以測量一半導體工件之一電阻率。該滑道可選擇性地沿一第七軸線移動，該第七軸線沿該滑道之一長度延伸。該擬人臂及該滑道協作以界定一工作容積。該半導體工件支撐件經構形以在該工作容積內支撐一半導體工件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resistivity measurement system for semiconductor workpieces includes an anthropomorphic arm movable about at least six axes, a sled connected to the anthropomorphic arm, and a semiconductor workpiece support. The anthropomorphic arm includes an end effector and a resistivity probe. The resistivity probe is connected to the end effector and is configured to measure an electrical resistivity of a semiconductor workpiece. The sled is selectively movable along a seventh axis extending along a length of the sled. The anthropomorphic arm and the sled cooperate to define a working volume. The semiconductor workpiece support is configured to support a semiconductor workpiece within the working volume.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">16:控制器</p>  
        <p type="p">20:半導體工件支撐件</p>  
        <p type="p">30:半導體工件</p>  
        <p type="p">32:校準樣本</p>  
        <p type="p">102:滑道</p>  
        <p type="p">104:可移動基座或底板</p>  
        <p type="p">106:軌道</p>  
        <p type="p">108:驅動馬達</p>  
        <p type="p">112a:第一段</p>  
        <p type="p">112b:第二段</p>  
        <p type="p">112c:第三段</p>  
        <p type="p">112d:第四段</p>  
        <p type="p">112e:第五段</p>  
        <p type="p">112f:第六段</p>  
        <p type="p">118:末端效應器</p>  
        <p type="p">118a:順應式底座</p>  
        <p type="p">120:電阻率探針</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1069" publication-number="202621244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、用於半導體裝置的系統和形成半導體結構的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES, SYSTEMS FOR SEMICONDUCTOR DEVICE, AND METHODS OF FORMING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10P14/42</further-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭榮頭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, YOUNG DOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李重建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DON KOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李施優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SIWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露形成半導體結構的方法、半導體裝置和用於半導體裝置的系統。半導體裝置包括第一電極、平行於第一電極延伸的第二電極、第一電極和第二電極之間的第一介電材料、第一電極和第二電極之間的第二介電材料、接觸第一電極的第三電極，第三電極在正交於第一電極和第二電極的方向上延伸、接觸第二電極的第四電極，第四電極在正交於第一電極和第二電極的方向上延伸，其中第一介電材料在第三電極和第四電極之間以及第二介電材料在第一介電材料和第三電極之間，以及第二介電材料在第一介電材料和第四電極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods of forming a semiconductor structure, semiconductor devices and systems for a semiconductor device. The semiconductor devices include a first electrode, a second electrode extending parallel to the first electrode, a first dielectric material between the first electrode and the second electrode, a second dielectric material between the first electrode and the second electrode, a third electrode contacting the first electrode, the third electrode extending in a direction orthogonal to the first electrode and the second electrode, a fourth electrode contacting the second electrode, the fourth electrode extending in a direction orthogonal to the first electrode and the second electrode, with the first dielectric material between the third electrode and the fourth electrode and the second dielectric material between the first dielectric material and the third electrode, and the second dielectric material between the first dielectric material and the fourth electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一半導體裝置</p>  
        <p type="p">102:源極側隔離層</p>  
        <p type="p">104:源極側單元電極</p>  
        <p type="p">105:電極間隔離層</p>  
        <p type="p">106:第一介電材料</p>  
        <p type="p">108:第二介電材料</p>  
        <p type="p">110:垂直電極</p>  
        <p type="p">112:汲極側隔離層</p>  
        <p type="p">114:汲極側單元電極</p>  
        <p type="p">116:水平電極</p>  
        <p type="p">120:個別裝置層</p>  
        <p type="p">130:單元電極</p>  
        <p type="p">A-A':線</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1070" publication-number="202620922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子顯微術的減式缺陷定位</chinese-title>  
        <english-title>SUBTRACTIVE DEFECT LOCALIZATION FOR CHARGED-PARTICLE MICROSCOPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H01J37/26</main-classification>  
        <further-classification edition="201701120260202B">G06T7/00</further-classification>  
        <further-classification edition="202201120260202B">G06V10/25</further-classification>  
        <further-classification edition="202201120260202B">G06V10/26</further-classification>  
        <further-classification edition="202201120260202B">G06V10/82</further-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維尼亞爾斯基　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINIARSKI, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於促進帶電粒子顯微術的減式缺陷定位的系統/技術。在各種實施例中，一系統可存取由一帶電粒子顯微鏡擷取的一影像，其中該影像描繪一樣品；在各個態樣中，該系統可基於執行經訓練為定位該樣品的一感興趣結構的無缺陷版本的一第一機器學習模型來定位該感興趣結構的一或多個有缺陷例示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems/techniques are provided for facilitating subtractive defect localization for charged-particle microscopy. In various embodiments, a system can access an image captured by a charged-particle microscope, wherein the image depicts a specimen. In various aspects, the system can localize one or more defective instantiations of a structure of interest of the specimen, based on execution of a first machine learning model that is trained to localize non-defective versions of the structure of interest.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302:帶電粒子顯微鏡</p>  
        <p type="p">304:樣品</p>  
        <p type="p">306:感興趣結構</p>  
        <p type="p">308:影像</p>  
        <p type="p">309:系統</p>  
        <p type="p">310:處理器</p>  
        <p type="p">312:非暫時性電腦可讀取記憶體</p>  
        <p type="p">313:軟體組件</p>  
        <p type="p">314:存取組件</p>  
        <p type="p">316:無缺陷組件</p>  
        <p type="p">318:缺陷無關組件</p>  
        <p type="p">320:減法組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1071" publication-number="202621373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用光學圖案的基板處理系統</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM USING AN OPTICAL PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P95/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬萊耶夫　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALEEV, IVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於處理基板的方法包括於設置在處理腔室中的基板夾持具上接收基板，以及執行循環製程。循環製程中的一循環包括施加第一脈衝以經由光源在基板之表面上照明光學圖案，以依據光學圖案局部加熱部分的基板之表面。並且，循環製程中的一循環進一步包括施加第二脈衝以產生處理波束以使用光學圖案處理基板，第一脈衝先於第二脈衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a substrate includes receiving the substrate on a substrate holder disposed in a processing chamber, and performing a cyclic process. One cycle of the cyclic process includes applying a first pulse to illuminate, from an optical source, an optical pattern over a surface of the substrate to locally heat portions of the surface of the substrate according to the optical pattern. And one cycle of the cyclic process further includes applying a second pulse to generate a processing beam to process the substrate with the optical pattern, the first pulse preceding the second pulse.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:處理系統</p>  
        <p type="p">110:照明器</p>  
        <p type="p">120:投影透鏡</p>  
        <p type="p">130:腔室蓋</p>  
        <p type="p">140:基板</p>  
        <p type="p">150:基板夾持具</p>  
        <p type="p">160:處理腔室</p>  
        <p type="p">170:控制器</p>  
        <p type="p">180:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1072" publication-number="202621469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低熱板的電力消耗用之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REDUCING ELECTRICAL POWER CONSUMPTION OF HOT PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/90</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="200601120260223B">G03F7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡卡希　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARCASI, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>修里　里歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HULI, LIOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括：接收烘烤設備之處理腔室進入閒置狀態之第一通知；判斷低流率（LFR）模式可開始；及提供引入氣體至處理腔室。引入氣體係包括供應氣體之第一部分。該方法更包括：將引入氣體之流率設定為閒置引入流率；接收處理腔室進入啟動狀態之第二通知；判斷高流率（HFR）模式可開始；及將引入氣體之流率設定為處理引入流率。處理引入流率係大於閒置引入流率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes receiving a first notification that a process chamber of a baking apparatus entered an idle state, determining that a low-flow-rate (LFR) mode can be started, and providing an incoming gas to the process chamber. The incoming gas includes a first portion of a supply gas. The method further includes setting a flow rate of the incoming gas to an idle incoming flow rate, receiving a second notification that the process chamber entered an active state, determining that a high-flow-rate (HFR) mode can be started, and setting the flow rate of the incoming gas to a process incoming flow rate. The process incoming flow rate is greater than the idle incoming flow rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:烘烤設備</p>  
        <p type="p">102:處理腔室</p>  
        <p type="p">104:支撐平台</p>  
        <p type="p">106:背板</p>  
        <p type="p">108:熱板</p>  
        <p type="p">110:晶圓</p>  
        <p type="p">112A,112B:導管</p>  
        <p type="p">114:供應氣體</p>  
        <p type="p">116A:引入氣體</p>  
        <p type="p">116B:引出氣體</p>  
        <p type="p">118:閥</p>  
        <p type="p">120:控制器</p>  
        <p type="p">122:處理器</p>  
        <p type="p">124:記憶體</p>  
        <p type="p">126:軟體指令</p>  
        <p type="p">128:時間閾值</p>  
        <p type="p">130:時間</p>  
        <p type="p">132:處理引入流率(IFR)</p>  
        <p type="p">134:閒置IFR</p>  
        <p type="p">136,138:通知</p>  
        <p type="p">140,142:指令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1073" publication-number="202620613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251113B">G06F3/0488</main-classification>  
        <further-classification edition="200601120251113B">G06F3/041</further-classification>  
        <further-classification edition="200601120251113B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽耀賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫孟儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, JYH-CHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括本體、觸控模組、掌托部、掌托區發光模組以及處理單元。觸控模組設置於本體，用以依據觸控輸入訊號產生啟動訊號。掌托部圍繞觸控模組。掌托部的至少一部份為可透光材料。掌托區發光模組設置於本體且位於觸控模組及掌托部中之至少一者的下方，用以提供掌托區光束至掌托部以顯示出掌托區發光圖案。處理單元電性連接觸控模組以及掌托區發光模組，用以依據啟動訊號啟動相對應的軟體以及產生相對應的掌托區發光訊號控制掌托區發光模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a main body, a touch module, a palm rest portion, a palm rest area lighting module and a processing unit is provided. The touch module is disposed on the main body, and is adapted to generate a launch signal according to a touch input signal. The palm rest portion surrounds the touch module. At least a portion of the palm rest is made of transparent material. The palm rest lighting module is disposed on the main body and located beneath at least one of the touch module and the palm rest portion, and is configured to emit a palm rest light beam toward the palm rest portion to display a palm rest lighting pattern. The processing unit is electrically connected to the touch module and the palm rest lighting module, configured to launch corresponding software based on the launch signal and to generate a corresponding palm rest lighting signal to control the palm rest lighting module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:第一機體</p>  
        <p type="p">112:顯示模組</p>  
        <p type="p">114:攝像模組</p>  
        <p type="p">120:第二機體</p>  
        <p type="p">122:觸控模組</p>  
        <p type="p">1222:啟動圖標</p>  
        <p type="p">124:掌托部</p>  
        <p type="p">128:可拆卸式收音模組</p>  
        <p type="p">1282:收音控制按鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1074" publication-number="202620062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>著色層形成用組成物、光學薄膜及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F2/44</main-classification>  
        <further-classification edition="200601120260223B">C08F20/00</further-classification>  
        <further-classification edition="200601120260223B">C08F20/36</further-classification>  
        <further-classification edition="200601120260223B">C08F265/04</further-classification>  
        <further-classification edition="200601120260223B">C08F290/06</further-classification>  
        <further-classification edition="200601120260223B">C08F4/00</further-classification>  
        <further-classification edition="200601120260223B">C08L101/00</further-classification>  
        <further-classification edition="200601120260223B">C09D201/00</further-classification>  
        <further-classification edition="201801120260223B">C09D7/20</further-classification>  
        <further-classification edition="201501120260223B">G02B1/11</further-classification>  
        <further-classification edition="201501120260223B">G02B1/16</further-classification>  
        <further-classification edition="201501120260223B">G02B1/18</further-classification>  
        <further-classification edition="200601120260223B">G02B5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二俣開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUTAMATA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石丸佳子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIMARU, YOSHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤優衣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之著色層形成用組成物包含色材(A)、光聚合性化合物(B)、光聚合起始劑(C)及有機溶劑(D)，其中前述有機溶劑(D)以下述式(1)所示的對於前述色材(A)的溶解指標[R]小於8.3。&lt;br/&gt; R=[4×(δd-17.8)&lt;sup&gt;2&lt;/sup&gt;+(δp-8.4)&lt;sup&gt;2&lt;/sup&gt;+(δh-5.1)&lt;sup&gt;2&lt;/sup&gt;]&lt;sup&gt;1/2&lt;/sup&gt; ･･･(1)&lt;br/&gt; [式(1)中，δd、δp及δh分別表示漢森溶解度參數中的分散項、極性項及氫鍵項，單位皆為(MPa)&lt;sup&gt;1/2&lt;/sup&gt;]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1075" publication-number="202619759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超音波照射裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A61N7/00</main-classification>  
        <further-classification edition="200601120260223B">A61B8/06</further-classification>  
        <further-classification edition="200601120260223B">A61B8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸一明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島康博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長井裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根岸一明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGISHI, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島康博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長井裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種能實現簡便操作性且可用於心疾患治療之新型超音波照射裝置。 &lt;br/&gt;　　[解決手段]本發明之超音波照射裝置(100)係具備，可安裝於人體胸部體表面之可撓性片狀部材，且至少能進行超音波發送之探頭(10)；以及控制探頭(10)，使探頭(10)以指定強度及間隔發送超音波的控制部(11)乃至控制裝置(1)。探頭(10)垂直於厚度方向的寬度尺寸為跨越2個肋間之大小，為50mm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1076" publication-number="202620128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解液二次電池用層合隔離膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C08L77/10</main-classification>  
        <further-classification edition="202101120260211B">H01M50/417</further-classification>  
        <further-classification edition="200601120260211B">C08J5/18</further-classification>  
        <further-classification edition="202101120260211B">H01M50/491</further-classification>  
        <further-classification edition="201901120260211B">B32B7/035</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中澤敦史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, MASUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種非水電解液二次電池用層合隔離膜，其可提高經組裝的電池的循環特性。本揭示相關的非水電解液二次電池用層合隔離膜，係將多孔質層層合在聚烯烴多孔質薄膜的單面或雙面。非水電解液二次電池用層合隔離膜在30~50℃時的TD方向的平均線膨脹率為3.0×10&lt;sup&gt;-6&lt;/sup&gt;[1/K]以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1077" publication-number="202620528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於廣義馬赫—曾德爾干涉儀之可調交叉網路之校準</chinese-title>  
        <english-title>CALIBRATION OF TUNABLE CROSSING NETWORKS FOR GMZI</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G02F1/225</main-classification>  
        <further-classification edition="200601120260210B">G02B6/12</further-classification>  
        <further-classification edition="202201120260210B">G06N10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商沛思量子公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSIQUANTUM, CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡柏　雨果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CABLE, HUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派　桑尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, SUNIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，一廣義馬赫-曾德爾干涉儀(GMZI)可包含用於輸入諸如量子光(例如單光子)或亮光之光之複數個輸入埠。另外，該GMZI可包含一波導網路，其包含各具有用於干涉該光之多個交叉網路之兩個耦合器網路。該光可使用耦合至各交叉網路之移相器陣列來相移。該等移相器陣列可藉由將光自輸入映射至輸出及自遠離該GMZI之該等輸入及輸出之內陣列至靠近該GMZI之該等輸入或輸出之外陣列連續校準各移相器陣列來校準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, a generalized Mach-Zehnder Interferometer (GMZI) can include a plurality of input ports to input light, such as quantum light (e.g., single photons) or bright light. In addition, the GMZI may include a waveguide network that includes two coupler networks, each having multiple crossing networks to interfere the light. The light can be phase shifted using arrays of phase shifters coupled to each crossing network. The arrays of phase shifters may be calibrated by mapping light from inputs to outputs and calibrating each array of phase shifters in succession, from inner arrays far from the inputs and outputs of the GMZI to outer arrays close to the inputs or outputs of the GMZI.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:光開關</p>  
        <p type="p">305:第一哈德瑪網路</p>  
        <p type="p">310:移相器</p>  
        <p type="p">315:第二哈德瑪網路</p>  
        <p type="p">317:輸入</p>  
        <p type="p">319:輸出埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1078" publication-number="202620480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有交叉網路補償移相器之光開關</chinese-title>  
        <english-title>OPTICAL SWITCHES HAVING CROSSING NETWORK COMPENSATED PHASE SHIFTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">G02B6/12</main-classification>  
        <further-classification edition="202201120260212B">G06N10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商沛思量子公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSIQUANTUM, CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派　桑尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, SUNIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡柏　雨果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CABLE, HUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">獲得複數個校正電壓值且將其等用於驅動一光開關光子積體電路(PIC)中之複數個移相器以校正相位誤差。該光開關PIC包含耦合至該複數個移相器之一第一耦合器網路及耦合至該複數個移相器之一第二耦合器網路。該等校正電壓值係基於回應於在輸入處接收之光而在輸出埠處量測之光功率之組合。光在一輸入處接收且傳播通過該第一耦合器網路。根據基於該複數個校正電壓值之驅動電壓值來驅動該等移相器以將相位調變施加至該光，同時校正該等相位誤差。該光自該複數個移相器傳播通過該第二耦合器網路以自該等輸出埠輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plurality of corrective voltage values are obtained and used to drive a plurality of phase shifters in an optical switch photonic integrated circuit (PIC) to correct for phase errors. The optical switch PIC includes a first coupler network coupled to the plurality of phase shifters, and a second coupler network coupled to the plurality of phase shifters. The corrective voltage values are based on combinations of optical power measured at output ports in response to light received at inputs. Light is received at an input and propagated through the first coupler network. The phase shifters are driven in accordance with drive voltage values based on the plurality of corrective voltage values to apply phase modulations to the light while correcting the phase errors. The light propagates from the plurality of phase shifters through the second coupler network to output from the output ports.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:光開關</p>  
        <p type="p">305:第一哈德瑪網路</p>  
        <p type="p">310:移相器</p>  
        <p type="p">315:第二哈德瑪網路</p>  
        <p type="p">317:輸入</p>  
        <p type="p">319:輸出埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1079" publication-number="202619973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含檸檬酸之膠體二氧化矽及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C01B33/14</main-classification>  
        <further-classification edition="200601120260223B">C01B33/141</further-classification>  
        <further-classification edition="200601120260223B">C09K3/14</further-classification>  
        <further-classification edition="200601120260223B">C09G1/02</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商扶桑化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSO CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野智陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種施加剪切力時0.20μm以上之大小的粗大粒子之生成受到抑制的含檸檬酸之膠體二氧化矽。&lt;br/&gt; 本發明為一種含檸檬酸之膠體二氧化矽，係含有：二氧化矽粒子及檸檬酸；&lt;br/&gt; (1)前述二氧化矽粒子之每單位表面積的矽醇基密度為1.6×10&lt;sup&gt;19&lt;/sup&gt;個/m&lt;sup&gt;2&lt;/sup&gt;至14.5×10&lt;sup&gt;19&lt;/sup&gt;個/m&lt;sup&gt;2&lt;/sup&gt;；&lt;br/&gt; (2)前述二氧化矽粒子之每單位表面積的前述檸檬酸之含量為1.0μg/m&lt;sup&gt;2&lt;/sup&gt;至10.0μg/m&lt;sup&gt;2&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1080" publication-number="202621245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251204B">H10B12/00</main-classification>  
        <further-classification edition="200601120251204B">G11C7/06</further-classification>  
        <further-classification edition="200601120251204B">G11C7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐德泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, DUCKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜奎彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, KYU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體裝置包括：包含多個位元線的第一記憶體胞元陣列；包含對應於多個位元線的多個互補位元線且配置為在第一方向上鄰近於第一記憶體胞元陣列的第二記憶體胞元陣列；以及第一位元線感測放大器陣列，第一位元線感測放大器陣列具有至少一部分在第一記憶體胞元陣列上與第一記憶體胞元陣列重疊且包括多個第一位元線感測放大器，多個第一位元線感測放大器連接至多個位元線中的多個第一位元線和多個互補位元線中的多個第一互補位元線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a first memory cell array including a plurality of bit lines; a second memory cell array including a plurality of complementary bit lines corresponding to the plurality of bit lines, and arranged adjacent to the first memory cell array in a first direction; and a first bit line sense amplifier array having at least a portion overlapping the first memory cell array on the first memory cell array, and including a plurality of first bit line sense amplifiers connected to a plurality of first bit lines among the plurality of bit lines and a plurality of first complementary bit lines among the plurality of complementary bit lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:記憶體裝置</p>  
        <p type="p">BL1:第一位元線</p>  
        <p type="p">BL2:第二位元線</p>  
        <p type="p">BL3:第三位元線</p>  
        <p type="p">BL4:第四位元線</p>  
        <p type="p">BL5:第五位元線</p>  
        <p type="p">BL6:第六位元線</p>  
        <p type="p">BL7:第七位元線</p>  
        <p type="p">BL8:第八位元線</p>  
        <p type="p">BLB1:第一互補位元線</p>  
        <p type="p">BLB2:第二互補位元線</p>  
        <p type="p">BLB3:第三互補位元線</p>  
        <p type="p">BLB4:第四互補位元線</p>  
        <p type="p">BLB5:第五互補位元線</p>  
        <p type="p">BLB6:第六互補位元線</p>  
        <p type="p">BLB7:第七互補位元線</p>  
        <p type="p">BLB8:第八互補位元線</p>  
        <p type="p">BSA1:第一位元線感測放大器陣列/位元線感測放大器陣列</p>  
        <p type="p">BSA2:第二位元線感測放大器陣列/位元線感測放大器陣列</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">MC:記憶體胞元</p>  
        <p type="p">MCA1:第一記憶體胞元陣列/記憶體胞元陣列</p>  
        <p type="p">MCA2:第二記憶體胞元陣列/記憶體胞元陣列</p>  
        <p type="p">SWD:子字元線驅動器區</p>  
        <p type="p">WL1,WL2,WL3,WL4,WL5,WL6,WL7,WL8:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1081" publication-number="202621475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片層積型元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONOZUKA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡憲一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種「可降低因晶片的外周區域之破壞所造成的不良」之晶片層積型元件。 &lt;br/&gt;　　根據實施形態，晶片層積型元件，係具備有：第1晶片，具有第1基板與第1配線層，該第1基板，係具有第1外周面與被前述第1外周面所包圍的第1陣列面，該第1配線層，係被設置於前述第1基板上；第2晶片，具有第2基板與第2配線層，該第2基板，係具有對向於前述第1外周面的第2外周面與被前述第2外周面所包圍並對向於前述第1陣列面的第2陣列面，該第2配線層，係被設置於前述第2陣列面；及複數個連接部，被設置於前述第1陣列面與前述第2陣列面之間，電性連接前述第1配線層與前述第2配線層，前述第2基板，係具有被設置於前述第2外周面的凹部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶片層積型元件</p>  
        <p type="p">10:第1基板</p>  
        <p type="p">11:第1陣列面</p>  
        <p type="p">12:第1外周面</p>  
        <p type="p">20:第2基板</p>  
        <p type="p">21:第2陣列面</p>  
        <p type="p">22:第2外周面</p>  
        <p type="p">23:第3陣列面</p>  
        <p type="p">24:第3外周面</p>  
        <p type="p">25:凹部</p>  
        <p type="p">30:配線部</p>  
        <p type="p">31:第1配線層</p>  
        <p type="p">32:導電通孔</p>  
        <p type="p">33:絕緣層</p>  
        <p type="p">33A:連接孔</p>  
        <p type="p">40:連接部</p>  
        <p type="p">41:第1金屬部</p>  
        <p type="p">42:第2金屬部</p>  
        <p type="p">43:金屬膜</p>  
        <p type="p">52:第2配線層</p>  
        <p type="p">61:第1電極</p>  
        <p type="p">62:第2電極</p>  
        <p type="p">70:絕緣膜</p>  
        <p type="p">101:第1晶片</p>  
        <p type="p">102:第2晶片</p>  
        <p type="p">h1:第1貫通孔</p>  
        <p type="p">h2:第2貫通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1082" publication-number="202621259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非對稱深溝槽MIM電容(ADTMC)</chinese-title>  
        <english-title>ASYMMETRIC DEEP-TRENCH-MIM-CAPACITOR (ADTMC)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260202B">H10D1/00</main-classification>  
        <further-classification edition="202501120260202B">H10D1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯　西恩威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYERS, SEANN WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體元件可以包括基板，該基板可以包括一或多個六邊形溝槽，這些溝槽從基板的第一側延伸進入基板。該裝置可以包括一或多個深溝槽電容（DTC），每個電容形成於相應的六邊形溝槽中。每個DTC可以包括襯墊層，該襯墊層形成在相應的六邊形溝槽內並與基板接觸。該DTC可以包括第一導體層，第一導體層包含第一金屬，該第一導體層形成在相應的六邊形溝槽內並與襯墊層接觸。該DTC可以包括介電層，該層包含介電材料，該介電層形成在相應的六邊形溝槽內並與第一導體層接觸。該DTC可以包括第二導體層，第二導體層包含第二金屬，該第二導體層形成在相應的六邊形溝槽內並與介電層接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a substrate may include one or more hexagonal trenches extending into the substrate from a first side of the substrate. The device may include one or more deep trench capacitors (DTCs), each formed in a respective hexagonal trench. Each DTC may include a liner layer, formed within the respective hexagonal trench and in contact with the substrate. The DTC may include a first conductor layer including a first metal, the first conductor layer formed within the respective hexagonal trench and in contact with the liner layer. The DTC may include a dielectric layer including a dielectric material, the dielectric layer formed within the respective hexagonal trench and in contact with the first conductor layer. The DTC may include a second conductor layer including a second metal, the second conductor layer formed within the respective hexagonal trench and in contact with the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:半導體元件</p>  
        <p type="p">414a~414e:連接</p>  
        <p type="p">418:元件層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1083" publication-number="202621465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造中動態系統的物理資訊人工智慧</chinese-title>  
        <english-title>PHYSICS INFORMED ARTIFICIAL INTELLIGENCE FOR DYNAMIC SYSTEMS IN SEMICONDUCTOR MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/00</main-classification>  
        <further-classification edition="201901120260223B">G06N20/20</further-classification>  
        <further-classification edition="202301120260223B">G06N3/042</further-classification>  
        <further-classification edition="202301120260223B">G06N3/0455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　阿比納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ABHINAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩迪吉　薩瑪內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADIGHI, SAMANEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史羅德　布瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHROEDER, BRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施例描述了一種方法，包括從資料集執行特徵提取處理和特徵融合處理，該資料集包括一或多個腔室設置資料點，其中該資料集由物理屬性模型增強，該模型使用一或多個腔室設置資料點來生成基於物理模型化的腔室內一或多個處理特徵的腔室屬性資料。在一個實施例中，該方法進一步包括在資料集上執行上下文特定的資料分割模組的資料分割處理，以形成修改過的資料集。在一個實施例中，該方法還可以包括在修改過的資料集上訓練機器學習模型，其中訓練該機器學習模型包括最小化損失函數，該損失函數包括正則化目標函數，該目標函數包括基於物理資訊變量的項。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method that includes implementing a feature extraction process and a feature fusion process from a data set that includes one or more chamber setting data points, where the data set is augmented by a physics attributes model that uses the one or more chamber setting data points to generate chamber attribute data of one or more processing characteristics within a chamber based on physics modeling. In an embodiment, the method further includes implementing a data segmentation process on the data set with a context specific data segmentation module to form a modified data set. In an embodiment, the method may further include training a machine learning model on the modified data set, wherein training the machine learning model includes minimizing a loss function that includes a regularized objective function that includes a term based on physics informed variables.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:三維圖</p>  
        <p type="p">101:軸</p>  
        <p type="p">102:軸</p>  
        <p type="p">103:軸</p>  
        <p type="p">105:理想操作空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1084" publication-number="202620957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直連式太陽能板蓄電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260213B">H01M50/296</main-classification>  
        <further-classification edition="202101120260213B">H01M50/204</further-classification>  
        <further-classification edition="201401120260213B">H02S40/38</further-classification>  
        <further-classification edition="201401120260213B">H02S40/36</further-classification>  
        <further-classification edition="201401120260213B">H02S40/30</further-classification>  
        <further-classification edition="201301120260213B">H01G11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商康門乃克科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEC COMNECT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石山大揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIYAMA, TAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種將太陽能板與連接於該太陽能板的二次電池一體化所形成的直連式太陽能板蓄電池。一種使太陽能板(11)與電性連接於該太陽能板(11)的二次電池(12)一體化的直連式太陽能板蓄電池，其特徵為：二次電池(12)具備：抵接電極部，其配置成與太陽能板(11)抵接；及對向電極部，其與抵接電極部成對，藉由前述抵接電極部與前述對向電極部，二次電池(12)以薄板狀形成在太陽能板(11)的背面或內部。進而，具備電性連接於二次電池(12)的受電送電兼用的感應天線15，且藉由在太陽能板(11)的端緣安裝產生無線供電用交流磁場的振盪器，並將該振盪器與感應天線(15)電性連接來形成無線供電部作為特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:太陽能板</p>  
        <p type="p">12:二次電池</p>  
        <p type="p">13:碳散熱層</p>  
        <p type="p">14:絕緣薄膜</p>  
        <p type="p">15:感應天線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1085" publication-number="202619904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磨耗粉之捕集裝置及磨耗粉之捕集方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B60C19/00</main-classification>  
        <further-classification edition="200601120260223B">G01N3/56</further-classification>  
        <further-classification edition="200601120260223B">G01N1/04</further-classification>  
        <further-classification edition="200601120260223B">G01M17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商株式會社上島製作所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESHIMA SEISAKUSHO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶木亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJIKI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江場淳一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBA, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之磨耗粉之捕集裝置，係具備：第一部件，係構成為能夠繞第一軸旋轉；按壓機構，係構成為能夠將能夠繞第二軸旋轉之第二部件按壓於前述第一部件；及捕集部，係捕集前述第二部件藉由與前述第一部件旋轉摩擦所產生之磨耗粉。本發明之磨耗粉之捕集方法，係包含：磨耗步驟，係將繞第二軸旋轉之第二部件按壓於繞第一軸旋轉之第一部件，使前述第一部件與前述第二部件旋轉摩擦；及捕集步驟，係藉由捕集部捕集前述第二部件藉由與旋轉之前述第一部件旋轉摩擦所產生之磨耗粉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:磨耗粉之捕集裝置</p>  
        <p type="p">2:第一部件(模擬路面部件)</p>  
        <p type="p">3:第二部件(橡膠部件)</p>  
        <p type="p">4:按壓機構</p>  
        <p type="p">5:捕集部</p>  
        <p type="p">5a:第一捕集器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1086" publication-number="202619876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層成形裝置及積層成形方法</chinese-title>  
        <english-title>LAMINATED MOLDING APPARATUS AND LAMINATED MOLDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">B29C43/56</main-classification>  
        <further-classification edition="200601120260121B">B29C43/20</further-classification>  
        <further-classification edition="200601120260121B">H05K3/46</further-classification>  
        <further-classification edition="200601120260121B">B30B15/34</further-classification>  
        <further-classification edition="200601120260121B">B29C65/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本隆幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田新之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, SHINNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植田直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種積層成形裝置及積層成形方法，其能夠在不延長設置於真空積層裝置之後段步驟之壓製裝置之壓製時間的情況下，成形嵌入性、平坦性較佳之製品。 &lt;br/&gt;本發明之積層成形裝置11具備：加壓裝置，其具備上下一對加壓面、以及使上述上下一對加壓面於彼此相接或分離之方向移動的加壓機構，其藉由上述上下一對加壓面而對被配置於上述上下一對加壓面間之基板及積層於其上之薄膜進行加壓；及搬送手段，其搬送上述基板及上述薄膜；每當上述上下一對加壓面進行之複數次加壓結束時，上述搬送手段便搬送上述基板及上述薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:積層成形裝置</p>  
        <p type="p">12:真空積層裝置</p>  
        <p type="p">13:第1平坦化壓製裝置</p>  
        <p type="p">14:第2平坦化壓製裝置</p>  
        <p type="p">15,16,17:伺服馬達</p>  
        <p type="p">18:承載薄膜送出裝置</p>  
        <p type="p">19:承載薄膜捲取裝置</p>  
        <p type="p">20:控制裝置</p>  
        <p type="p">21,24:退繞輥</p>  
        <p type="p">22,25:從動輥</p>  
        <p type="p">23:載置平台部</p>  
        <p type="p">31,51,71:底盤</p>  
        <p type="p">32,52,72:上盤</p>  
        <p type="p">33,53,73:連接桿</p>  
        <p type="p">34,54,74:下盤</p>  
        <p type="p">35,55,75:旋轉編碼器</p>  
        <p type="p">36,56,76:伺服放大器</p>  
        <p type="p">37,57,77:滾珠螺桿</p>  
        <p type="p">38,58,78:滾珠螺桿螺帽</p>  
        <p type="p">39,59,79:荷重元</p>  
        <p type="p">40,41,60,61,80,81:加壓塊</p>  
        <p type="p">42,62,82:線性標尺</p>  
        <p type="p">42a,62a,82a:標尺</p>  
        <p type="p">42b,62b,82b:滑塊</p>  
        <p type="p">43:彈性體片材</p>  
        <p type="p">44:金屬製板</p>  
        <p type="p">45,46:外框部</p>  
        <p type="p">47,63,83:筒式加熱器</p>  
        <p type="p">64,84:緩衝材料</p>  
        <p type="p">65,85:金屬製壓板</p>  
        <p type="p">91,93:捲取輥</p>  
        <p type="p">92,94:從動輥</p>  
        <p type="p">95:取出平台部</p>  
        <p type="p">C:腔室</p>  
        <p type="p">F1,F2:承載薄膜</p>  
        <p type="p">P:積層成形品</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1087" publication-number="202621436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片製造裝置</chinese-title>  
        <english-title>WAFER MANUFACTURING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="202601120260223B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商唯亞威應用光學（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIAVI SOLUTIONS SUZHOU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁愛玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, AILING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃衛賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏銀香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YINXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂爾施　馬庫斯　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TILSCH, MARKUS K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及晶片製造裝置。在一些實施方式中，晶片保持裝置包括：夾具結構，該夾具結構用於接收晶片，其中該夾具結構包括相對於標稱塗層平面的第一成角度表面；以及彈簧結構，該彈簧結構用於抵靠第一成角度表面壓縮晶片的一端，其中該彈簧結構包括：彈簧；以及附接到該彈簧的壓縮表面，其中該壓縮表面包括與第一成角度表面匹配的第二成角度表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to a wafer manufacturing apparatus. In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例(晶片製造裝置)</p>  
        <p type="p">110:夾具結構</p>  
        <p type="p">120:彈簧結構</p>  
        <p type="p">122:彈簧</p>  
        <p type="p">124:壓縮表面</p>  
        <p type="p">140:晶片</p>  
        <p type="p">170:塗層源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1088" publication-number="202620139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子機器殼體、其製造方法、及抗反射膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C09D129/14</main-classification>  
        <further-classification edition="201801120260210B">C09D7/61</further-classification>  
        <further-classification edition="202001120260210B">C08J7/04</further-classification>  
        <further-classification edition="201501120260210B">G02B1/111</further-classification>  
        <further-classification edition="200601120260210B">C09D5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索馬龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂爪直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAZUME, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種有效地提昇形成於電子機器殼體的抗反射膜的設計性及耐擦傷性的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。電子機器殼體在殼體本體上具有抗反射膜。抗反射膜由樹脂組成物形成，至少包含A成分和B成分，A成分包含A1成分，B成分包含平均粒徑在2μm以上且6μm以下的B1成分。相對於A成分之B成分的質量比為7以上且14以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1089" publication-number="202620782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校準多頻譜視覺系統的方法</chinese-title>  
        <english-title>METHOD OF CALIBRATING A MULTI-SPECTRAL VISION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260210B">G06T7/80</main-classification>  
        <further-classification edition="200601120260210B">H04N17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商薩羅尼克科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARONIC TECHNOLOGIES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福克斯　羅賓諾維茲　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX-RABINOVITZ, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱里　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAREY, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰勒　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYLOR, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯肯德拉　亞伯拉罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKANDERA, ABRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種校準一視覺系統之方法、系統及非暫時性CRM包含一穿孔校準板及一光學裝置。校準該視覺系統進一步包含：將該光學裝置或該穿孔校準板之至少一者相對於彼此定位於複數個位置處；經由該光學裝置在彼等位置處擷取該穿孔校準板之複數個影像；處理該等影像以分析該穿孔校準板；藉由基於該分析估計該光學裝置之參數來建立一校正；及將該校正應用於藉由該光學裝置擷取之後續影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, system, and non-transitory CRM of calibrating a vision system includes a perforated calibration board and an optical device. Calibrating the vision system further includes positioning at least one of the optical device or the perforated calibration board at a plurality of positions relative to each other; capturing, via the optical device, a plurality of images of the perforated calibration board at those positions; processing the images to analyze the perforated calibration board; establishing a correction by estimating parameters of the optical device based on the analysis; and applying the correction to subsequent images captured by the optical device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多頻譜校準方法</p>  
        <p type="p">102:方塊</p>  
        <p type="p">104:方塊</p>  
        <p type="p">106:方塊</p>  
        <p type="p">108:方塊</p>  
        <p type="p">110:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1090" publication-number="202620002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於加熱珍珠岩之爐及用於操作用於加熱珍珠岩的爐之方法</chinese-title>  
        <english-title>A FURNACE FOR HEATING PERLITE AND A METHOD FOR OPERATING A FURNACE FOR HEATING PERLITE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C04B20/06</main-classification>  
        <further-classification edition="200601120260204B">F27B1/02</further-classification>  
        <further-classification edition="202501120260204B">F27D17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商可耐福高性能材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNAUF PERFORMANCE MATERIALS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑布森　烏韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEBSEN, UWE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於加熱珍珠岩(11)之爐(1)。該爐(1)包含一膨脹管(2)，其從其上端(3)垂直延伸至其下端(4)。該膨脹管(2)圍封一燃燒室(5)，且進一步經組態使得當暴露於溫度時珍珠岩(11)在該燃燒室中係可膨脹的。膨脹的該珍珠岩(11)可在該上端(3)處從該膨脹管(2)排出。一進料裝置(10)經組態使得可將珍珠岩(11)進料至該燃燒室(5)中。一氣體火焰(16)可由一氣體燃燒器(15)產生，且溫度可施加至該燃燒室(5)。一爐套(8)至少在部分長度上在外側上圍繞該膨脹管(2)，形成一中間空間(9)。 &lt;br/&gt;該爐(1)進一步包含：一氣體收集室(12)，氣體可輸送至該氣體收集室中；一第一氣體路徑(14)，位於中間空間(9)中的氣體可經由該第一氣體路徑從該中間空間(9)輸送至該氣體收集室(12)中；及一第二氣體路徑(17)，位於該中間空間(9)中的氣體可經由該第二氣體路徑從該中間空間(9)輸送至該氣體燃燒器(15)。位於該氣體收集室(12)中的該氣體可輸送至該燃燒室(5)中。 &lt;br/&gt;本發明進一步係關於一種用於操作用於加熱珍珠岩的一各別爐(1)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention refers to a furnace (1) for heating perlite (11). The furnace (1) comprises an expansion tube (2) that extends vertically from its upper end (3) to its lower end (4). The expansion tube (2) encloses a firing chamber (5) and is further configured such that perlite (11) is expandable in it when exposed to temperature. The expanded perlite (11) is dischargeable from the expansion tube (2) at the upper end (3). A charging device (10) is configured such that perlite (11) can be charged into the firing chamber (5). A gas flame (16) can be generated by a gas burner (15), and temperature can be applied to said firing chamber (5). A furnace jacket (8) surrounds the expansion tube (2) on the outside at least on a partial length, forming an intermediate space (9). &lt;br/&gt;The furnace (1) further comprises a gas collecting chamber (12) into which gas can be conveyed; a first gas path (14) via which gas located in the intermediate space (9) can be conveyed from the intermediate space (9) into the gas collecting chamber (12); and a second gas path (17) via which gas located in the intermediate space (9) can be conveyed from the intermediate space (9) to the gas burner (15). The gas located in the gas collecting chamber (12) can be conveyed into the firing chamber (5). &lt;br/&gt;The invention further refers to a method for operating a respective furnace (1) for heating perlite.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:爐</p>  
        <p type="p">2:膨脹管</p>  
        <p type="p">3:上端</p>  
        <p type="p">4:下端</p>  
        <p type="p">5:燃燒室</p>  
        <p type="p">6:管線</p>  
        <p type="p">7:第三風扇</p>  
        <p type="p">8:爐套</p>  
        <p type="p">9:中間空間</p>  
        <p type="p">10:進料裝置</p>  
        <p type="p">11:珍珠岩</p>  
        <p type="p">12:氣體收集室</p>  
        <p type="p">13:鋼殼體；殼體</p>  
        <p type="p">14:開口</p>  
        <p type="p">15:氣體燃燒器</p>  
        <p type="p">16:氣體火焰</p>  
        <p type="p">17:氣體管線</p>  
        <p type="p">18:第二風扇</p>  
        <p type="p">19:燃料管線</p>  
        <p type="p">20:氣體來源</p>  
        <p type="p">21:第一風扇</p>  
        <p type="p">22:氣體供應管線</p>  
        <p type="p">23:氣體壓力感測器</p>  
        <p type="p">24:資料線</p>  
        <p type="p">25:電子資料處理裝置</p>  
        <p type="p">26:信號線</p>  
        <p type="p">27:膨脹珍珠岩</p>  
        <p type="p">P1,P2,P3:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1091" publication-number="202621393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過結合熱應力及機械應力之誘導以切割半導體結構之切割系統及方法</chinese-title>  
        <english-title>CLEAVING SYSTEMS AND METHODS FOR CLEAVING SEMICONDUCTOR STRUCTURES BY COMBINED THERMAL AND MECHANICAL STRESS INDUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P54/50</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P90/00</further-classification>  
        <further-classification edition="202601120260223B">H10W10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路特　威廉　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTER, WILLIAM L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞伯查特　彼得　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBRECHT, PETER D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴哈格維特　桑米特　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAGAVAT, SUMEET S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於切割一半導體結構之切割系統及方法。該等系統及方法可涉及熱誘導應力及機械誘導應力之一結合。該切割系統可包含使該半導體結構偏轉之一真空卡盤及在施加真空的同時加熱該結構之一加熱器。熱應力及機械應力之該結合致使該結構沿著一切割平面被切割。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cleaving systems and methods for cleaving a semiconductor structure. The systems and methods may involve a combination of thermally and mechanically induced stress. The cleave system may include a vacuum chuck which deflects the semiconductor structure and a heater which heats the structure while the vacuum is applied. The combination of thermal and mechanical stress causes the structure to cleave along a cleave plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:切割系統</p>  
        <p type="p">11:真空卡盤</p>  
        <p type="p">21:加熱器</p>  
        <p type="p">35:加熱器</p>  
        <p type="p">39:加熱燈</p>  
        <p type="p">40:入口</p>  
        <p type="p">47:真空卡盤外殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1092" publication-number="202621517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於堆疊半導體系統中混合接合之具有電連接之聚合物材料間隙填充</chinese-title>  
        <english-title>POLYMER MATERIAL GAP-FILL WITH ELECTRICAL CONNECTIONS FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W72/20</main-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification>  
        <further-classification edition="202601120260223B">H10W74/47</further-classification>  
        <further-classification edition="202601120260223B">H10W70/63</further-classification>  
        <further-classification edition="202601120260223B">H10P14/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於一堆疊半導體系統之方法、系統及裝置。該堆疊半導體系統可包含一重佈層(RDL)上之一半導體晶粒及至少部分地環繞該半導體晶粒之一聚合物材料。氮化矽材料可在該半導體晶粒上方且在該聚合物材料上。一邏輯晶粒可與該氮化矽材料上之一接合材料混合接合。且一導電柱可至少部分地延伸穿過該氮化矽材料及該聚合物材料且可將該邏輯晶粒與該RDL耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for a stacked semiconductor system are described. The stacked semiconductor system may include a semiconductor die on a redistribution layer (RDL) and a polymer material at least partially surrounding the semiconductor die. A silicon nitride material may be above the semiconductor die and on the polymer material. A logic die may be hybrid bonded with a bonding material on the silicon nitride material. And a conductive post may extend at least partially through the silicon nitride material and the polymer material and may couple the logic die with the RDL.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">205-a:晶粒</p>  
        <p type="p">207:介電材料</p>  
        <p type="p">210:主機處理器</p>  
        <p type="p">212:接觸件</p>  
        <p type="p">215:控制器</p>  
        <p type="p">216:主機介面</p>  
        <p type="p">220-a-1:介面區塊</p>  
        <p type="p">220-a-2:介面區塊</p>  
        <p type="p">221-a-1:匯流排</p>  
        <p type="p">221-a-2:匯流排</p>  
        <p type="p">222-a-1:接觸件</p>  
        <p type="p">222-a-2:接觸件</p>  
        <p type="p">223-a-1:匯流排</p>  
        <p type="p">223-a-2:匯流排</p>  
        <p type="p">225:邏輯區塊</p>  
        <p type="p">230:邏輯區塊</p>  
        <p type="p">231-a-1:匯流排</p>  
        <p type="p">231-a-2:匯流排</p>  
        <p type="p">232:匯流排</p>  
        <p type="p">234:接觸件</p>  
        <p type="p">235:非揮發性儲存器</p>  
        <p type="p">237:感測器</p>  
        <p type="p">240-a-1:晶粒</p>  
        <p type="p">240-a-2:晶粒</p>  
        <p type="p">242:介電材料</p>  
        <p type="p">245-a-1:介面區塊</p>  
        <p type="p">245-a-2:介面區塊</p>  
        <p type="p">246-a-1:匯流排</p>  
        <p type="p">246-a-2:匯流排</p>  
        <p type="p">247-a-1:接觸件</p>  
        <p type="p">247-a-2:接觸件</p>  
        <p type="p">250-a-1:記憶體陣列</p>  
        <p type="p">250-a-2:記憶體陣列</p>  
        <p type="p">251-a-1:匯流排</p>  
        <p type="p">251-a-2:匯流排</p>  
        <p type="p">255-a-1:匯流排</p>  
        <p type="p">255-a-2:匯流排</p>  
        <p type="p">256-a-1:接觸件</p>  
        <p type="p">256-a-2:接觸件</p>  
        <p type="p">257-a-1:接觸件</p>  
        <p type="p">257-a-2:接觸件</p>  
        <p type="p">260-a-1:接觸件</p>  
        <p type="p">260-a-2:接觸件</p>  
        <p type="p">265-a-1:單元</p>  
        <p type="p">265-a-2:單元</p>  
        <p type="p">270-a-1:非揮發性儲存器</p>  
        <p type="p">270-a-2:非揮發性儲存器</p>  
        <p type="p">275-a-1:感測器</p>  
        <p type="p">275-a-2:感測器</p>  
        <p type="p">280-a-1:單元</p>  
        <p type="p">280-a-2:單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1093" publication-number="202619834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括基板層及至少一個物質層的加工對象物的分割方法</chinese-title>  
        <english-title>METHOD FOR DIVIDING WORKPIECE INCLUDING SUBSTRATE LAYER AND AT LEAST ONE MATERIAL ON SUBSTRATE LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260213B">B23K26/364</main-classification>  
        <further-classification edition="201401120260213B">B23K26/0622</further-classification>  
        <further-classification edition="200601120260213B">B23K26/073</further-classification>  
        <further-classification edition="201401120260213B">B23K26/38</further-classification>  
        <further-classification edition="201401120260213B">B23K26/53</further-classification>  
        <further-classification edition="200601320260213B">B23K101/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EO TECHNICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫東洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOHN, DONG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴柾勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金裕錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玄東沅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYUN, DONG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">加工對象物的分割方法包括以下步驟：準備包括基板層，在基板層的上表面形成的至少一個物質層的加工對象物，將雷射光定型成加工束，使加工束在加工方向上相對於加工對象物相對移動一次以上的同時形成自物質層部分地延伸至基板層內部的切割預定槽，沿切割預定槽對加工對象物進行分割。在形成切割預定槽的步驟的相對移動一次以上中的至少一次相對移動中，加工束具有高斯強度輪廓，且藉由具有高斯強度輪廓的加工束在加工對象物形成在與加工方向正交的剖面中呈深度越深及寬度越窄形狀的切割預定槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The method of dividing a processing object includes the following steps: preparing including a substrate layer, at least one material layer of the processing object formed on the upper surface of the substrate layer, shaping a laser beam into a processing beam, forming a cutting pre-determined groove extending partially from the material layer to the inner part of the substrate layer while the processing beam is moved relative to the processing object more than one time in the processing direction, and dividing the processing object along the cutting pre-determined groove. The processing object is divided along the cutting pre-determined groove. During at least one of the steps while the processing beam is moved relative to the processing object more than one time for forming the cutting predetermined groove, the processing beam has a Gaussian intensity profile, and the processing beam having a Gaussian intensity profile is used to form a predetermined cutting groove in a cross section perpendicular to the processing direction in the processing object, which has a shape in which the depth increases and the width decreases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20、S30、S40:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1094" publication-number="202620543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127217</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光阻膜的針孔機率分析方法</chinese-title>  
        <english-title>PINHOLE PROBABILITY ANALYSIS METHODS FOR PHOTORESIST FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260213B">G03F1/84</main-classification>  
        <further-classification edition="201201120260213B">G03F1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張一弛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖拉　莫妮卡　沙沃卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHUR, MONICA SAWKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供基於機率之模擬分析方法，以預測光阻中針孔形成。該方法係基於曝光隨機性及曝光後烘烤無規性，以確定光阻中交聯統計分佈。該方法因膜非均質性更新光阻中交聯分佈。評估乾式顯影對光阻中更新之交聯分佈的影響，以確定與光阻中交聯態閾值量相關的閾值。基於低於該閾值之交聯態數量，可確定針孔形成的機率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probability-based simulation analysis method to predict pinhole formation in a photoresist is provided. The method determines a statistical distribution of cross-linking in the photoresist based on exposure stochastics and post-exposure bake randomness. The method updates the distribution of cross-linking in the photoresist as a result of film inhomogeneity. The effect of dry development on the updated distribution of cross-linking in the photoresist can be evaluated to determine a threshold value associated with a threshold amount of cross-linked states in the photoresist. A probability of pinhole formation can be determined based on the amount of cross-linked states that are below the threshold value.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1095" publication-number="202619747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由投予IL-33拮抗劑治療或預防哮喘之方法</chinese-title>  
        <english-title>METHODS FOR TREATING OR PREVENTING ASTHMA BY ADMINISTERING AN IL-33 ANTAGONIST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K39/395</main-classification>  
        <further-classification edition="200601120260202B">A61K38/17</further-classification>  
        <further-classification edition="200601120260202B">A61P11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲生物技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI BIOTECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古拉烏伊　海倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOULAOUIC, HELENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑瑟爾　安德烈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESSEL, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卜杜萊　勞拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDULAI, RAOLAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特珀　艾里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEPER, ARIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧帝　馬塞拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUDDY, MARCELLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞敏　尼基爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMIN, NIKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈雷爾　西凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAREL, SIVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波迪　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BODDY, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡之祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多科維克　黛博拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUKOVIC, DEBORAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利歐力亞斯　喬吉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALLIOLIAS, GEORGIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於治療或預防患者中的哮喘和相關病症的方法。本發明中特徵的方法包括向有需要的受試者投予包含介白素-33（IL-33）拮抗劑，如抗IL-33抗體的治療組合物。本發明中特徵的方法進一步包括向有需要的受試者投予包含介白素-33（IL-33）拮抗劑如抗IL-33抗體的第一治療組合物，和包含介白素-4受體（IL-4R）拮抗劑如抗IL-4R抗體的第二治療組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides methods for treating or preventing asthma and associated conditions in a patient. The methods featured in the invention comprise administering to a subject in need thereof a therapeutic composition comprising an interleukin-33 (IL-33) antagonist, such as an anti-IL-33 antibody. The methods featured in the invention further comprise administering to a subject in need thereof a first therapeutic composition comprising an interleukin-33 (IL-33) antagonist, such as an anti-IL-33 antibody, and a second therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1096" publication-number="202621273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可堆疊且自對準之TFT結構</chinese-title>  
        <english-title>STACKABLE AND SELF-ALIGNED TFT STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/01</main-classification>  
        <further-classification edition="202501120260223B">H10D30/67</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商齊耐特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZINITE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴萊吉　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARLAGE, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種示例性薄膜電晶體包括源極，該源極包括源極材料主體；以及與源極間隔開的汲極，該汲極包括汲極材料主體。該薄膜電晶體進一步包括在源極與汲極之間的層結構。該層結構包括金屬氧化物半導體通道材料層、介電材料層及閘極材料層。源極、汲極及層結構終止於共同平坦表面。在製造期間，使用諸如蝕刻或化學機械研磨的平坦化以形成該共同平坦表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example thin-film transistor includes a source, including a body of source material, and a drain spaced apart from the source, the drain including a body of drain material. The thin-film transistor further includes a structure of layers between the source and the drain. The structure of layers includes a layer of metal-oxide semiconductor channel material, a layer of dielectric material, and a layer of gate material. The source, the drain, and the structure of layers terminate at a common planar surface. During manufacture, planarization, such as etching or chemical mechanical polishing, is used to form the common planar surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:TFT</p>  
        <p type="p">12:源極</p>  
        <p type="p">14:汲極</p>  
        <p type="p">16:閘極</p>  
        <p type="p">20:平坦基板</p>  
        <p type="p">22:黏著層</p>  
        <p type="p">30:源極材料主體</p>  
        <p type="p">32:汲極材料主體</p>  
        <p type="p">46:源極載流子儲集層</p>  
        <p type="p">48:汲極儲集層</p>  
        <p type="p">50:半導體通道材料主體</p>  
        <p type="p">52:介電材料主體</p>  
        <p type="p">54:閘極材料主體</p>  
        <p type="p">B-B:截面線</p>  
        <p type="p">C-C:截面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1097" publication-number="202620486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極小型因子光纖連接器的轉接器模組</chinese-title>  
        <english-title>ADAPTER MODULE FOR USE WITH VERY SMALL FORM FACTOR FIBER OPTIC CONNECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">G02B6/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萊維頓製造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVITON MANUFACTURING CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福特　大衛　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORD, DAVID P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　喬恩　克拉克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RILEY,JON CLARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示技術係關於一種多光纖連接器總成，其包括位於一轉接器模組部分內之一轉接器部分。轉接器部分經構形有包括至少兩個孔隙之一孔隙，其中該至少兩個孔隙進一步經構形以分別定位多光纖連接器(例如，MMC連接器、極小型連接器等等)。轉接器模組部分可進一步構形有一閂鎖或類似構件，以用於將轉接器模組部分定位於諸如一接插面板等接插裝置之一開口中。位於轉接器部分中之多光纖連接器可分別包括一線性光纖陣列，例如，至少24個、25個、32個、48個等光纖。轉接器模組部分可係一QUICKPORT連接器，其具有大約16 mm之一高度及大約14.5 mm之一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The subject technologies relate to a multi-fiber connector assembly comprising an adapter portion located within an adapter module portion. The adapter portion is configured with an aperture comprising at least two apertures, wherein the at least two apertures are further configured to respectively locate multi-fiber connectors (e.g., MMC connectors, very small form connectors, and the like). The adapter module portion can be further configured with a latch or similar means for locating the adapter module portion in an opening of patching device such as a patch panel, and the like. The multi-fiber connectors located in the adapter portion can respectively comprise a linear array of optical fibers, e.g., at least 24, 25, 32, 48, etc., optical fibers. The adapter module portion can be a QUICKPORT connector having a height of approx. 16mm and a width of approx. 14.5mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:多光纖連接器總成/構形</p>  
        <p type="p">110:轉接器部分</p>  
        <p type="p">120:轉接器模組部分</p>  
        <p type="p">130:雙工孔隙</p>  
        <p type="p">130A:孔隙/第一孔隙部分/孔隙區域/第一孔隙/區域</p>  
        <p type="p">130B:孔隙/第二孔隙部分/孔隙區域/第二孔隙/區域</p>  
        <p type="p">131A:突起</p>  
        <p type="p">131B:突起</p>  
        <p type="p">1008:懸臂閂鎖</p>  
        <p type="p">1009A:保持凸緣</p>  
        <p type="p">1009B:保持凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1098" publication-number="202620245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水電解單元及水電解系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260203B">C25B1/04</main-classification>  
        <further-classification edition="202101120260203B">C25B9/00</further-classification>  
        <further-classification edition="200601120260203B">C25B15/08</further-classification>  
        <further-classification edition="202301120260203B">C02F1/461</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弦卷茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUMAKI, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田島英彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIMA, HIDEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三好崇仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI, TAKAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在水電解單元以及水電解系統中，具備：離子交換膜；陰極側觸媒層，係配置於離子交換膜的一側；陽極側觸媒層，係配置於離子交換膜的另一側；及金屬雜質去除層，係配置於離子交換膜與陰極側觸媒層之間、及離子交換膜與陽極側觸媒層之間之至少任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水電解單元</p>  
        <p type="p">11:陰極側分離器</p>  
        <p type="p">12:陽極側分離器</p>  
        <p type="p">13:膜電極接合體</p>  
        <p type="p">14:電源部</p>  
        <p type="p">21:離子交換膜</p>  
        <p type="p">22:陰極側觸媒層</p>  
        <p type="p">23:陽極側觸媒層</p>  
        <p type="p">24:陰極側供電體</p>  
        <p type="p">25:陽極側供電體</p>  
        <p type="p">26:陰極側金屬雜質去除層</p>  
        <p type="p">27:陽極側金屬雜質去除層</p>  
        <p type="p">L1,L3:電解液供給管線</p>  
        <p type="p">L2,L4:電解液排出管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1099" publication-number="202621310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全空乏絕緣體上矽結構及其製備方法</chinese-title>  
        <english-title>FDSOI STRUCTURES AND METHODS FOR PREPARING FDSOI STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10D86/01</main-classification>  
        <further-classification edition="202501120260223B">H10D86/00</further-classification>  
        <further-classification edition="202601120260223B">H10P90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　慶旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QINGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示全空乏絕緣體上矽結構及用於製備全空乏絕緣體上矽結構之方法。該全空乏絕緣體上矽結構可包含一頂層、一處置結構及安置於該矽頂層與處置結構之間之一介電層。該絕緣體上矽結構之該介電層可由氧化鉿、氧化鋯、氧化鋁或其等之組合構成。在一些實施例中，該介電層相對較厚，諸如至少20 nm或甚至至少50 nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Fully-depleted silicon-on-insulator structures and methods for preparing fully-depleted silicon-on-insulator structures. The fully-depleted silicon-on-insulator structure may include a top layer, a handle structure and a dielectric layer disposed between the silicon top layer and handle structure. The dielectric layer of the silicon-on-insulator structure may be composed of hafnia, zirconia, alumina, or combinations thereof. In some embodiments, the dielectric layer is relatively thick such as at least 20 nm or even at least 50 nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:處置結構</p>  
        <p type="p">15:介電層</p>  
        <p type="p">25:矽頂層</p>  
        <p type="p">30:施體結構</p>  
        <p type="p">31:絕緣體上矽(SOI)結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1100" publication-number="202620049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗促腎上腺皮質激素釋放激素抗體和多囊卵巢症候群</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/26</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＨＢＭ　Ａｌｐｈａ　製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HBM ALPHA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬祖布　約瑟夫　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAJZOUB, JOSEPH A</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　禮樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LI LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　宏杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HONG JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅斯維爾德　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROSVELD, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德拉貝克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRABEK, DUBRAVKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　哈佩恩　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN HAPEREN, RIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪皛皛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAO XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王永强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YONG QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　榮格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　久喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIU QIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了使用特異性結合促腎上腺皮質激素釋放激素(CRH)的抗體及其抗原結合片段來治療多囊卵巢症候群(PCOS)和相關病症的方法。本文還揭示了套組，這些套組包含特異性結合CRH的抗體及其抗原結合片段和在此類方法中使用該抗體及其抗原結合片段的說明書。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1101" publication-number="202620766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於家禽的性能監測和數據收集系統</chinese-title>  
        <english-title>PERFORMANCE MONITORING AND DATA COLLECTION SYSTEM FOR POULTRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251217B">G06Q50/00</main-classification>  
        <further-classification edition="200601120251217B">G01G17/08</further-classification>  
        <further-classification edition="202201120251217B">G06V40/10</further-classification>  
        <further-classification edition="202001120251217B">G16Y40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美國商百應股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALYX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　秉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, BENSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許祐誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種用於家禽的性能監測和數據收集系統，其包括平台、包括至少一個相機的電子設備、重量測量組件、可旋轉懸掛組件、具有多方向旋轉功能的連接機構以及懸吊組件，其中電子設備設置在平台中，重量測量組件設置在平台上。此外，可旋轉懸掛組件連接到重量測量組件，懸吊組件附接到家禽舍的天花板或橫樑，並且重量測量組件和平台通過懸吊組件經由連接機構懸掛在天花板或橫樑下方。因此，平台的擺動可以通過可旋轉懸掛組件和連接機構來平衡，使得可以精確地執行家禽的重量測量和身體生長監測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A performance monitoring and data collection system for poultry is disclosed, which comprises a platform, an electronic device including at least one camera, a weight measuring assembly, a rotatable hanging assembly, a connection mechanism with a function of multi-direction rotatable, and a suspended assembly, of which the electronic device is disposed in the platform, and the weight measuring assembly is disposed on the platform. Moreover, the rotatable hanging assembly is connected to the weight measuring assembly, the suspended assembly is attached to a ceiling or a crossbeam of a poultry house, and the weight measuring assembly and the platform is suspended, by the suspended assembly, under the ceiling or the crossbeam via the connection mechanism. As such, the wobbling of the platform can be balanced by the rotatable hanging assembly and the connection mechanism, such that weight measurement and body growth monitoring of the poultry can be carried out precisely.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:性能監測和數據收集系統</p>  
        <p type="p">11:平台</p>  
        <p type="p">12:第一電子設備</p>  
        <p type="p">12C:相機</p>  
        <p type="p">13:重量測量組件</p>  
        <p type="p">14:可旋轉懸掛組件</p>  
        <p type="p">15:鉤環螺栓單元</p>  
        <p type="p">16:連接機構</p>  
        <p type="p">17:懸吊組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1102" publication-number="202621512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>器件連結體之製造方法以及器件連結體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/69</main-classification>  
        <further-classification edition="200601120260223B">H05K1/02</further-classification>  
        <further-classification edition="200601120260223B">H05K3/20</further-classification>  
        <further-classification edition="200601120260223B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥山哲雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUYAMA, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徳田桂也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUDA, KAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森尾恵梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIO, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實現一種器件連結體，係具有球面等之無法自平面以不伸縮地形成的複雜曲面。本發明之器件連結體之製造方法，係包含：步驟A，係準備第一積層體，前述第一積層體依序具有無機基板、樹脂層、以及以保持間隔的方式裝載於樹脂層上之複數個器件；步驟B，係於第一積層體上，以覆蓋複數個器件及間隔部分的方式形成熱塑彈性體層而獲得第二積層體；以及步驟C，係剝離無機基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1103" publication-number="202621013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高力低振動圓柱型線性馬達</chinese-title>  
        <english-title>HIGH FORCE LOW VIBRATION CYLINDRICAL LINEAR MOTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H02K41/03</main-classification>  
        <further-classification edition="200601120260202B">H02K9/19</further-classification>  
        <further-classification edition="200601120260202B">H02K9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申泰熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, TAEHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬尼　奈森　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINNEY, NATHAN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃馬　阿爾瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMA, ARJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西哲曼　匹德　米裘　席威斯德　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIJMANS, PETER MICHEL SILVESTER MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅福斯　約翰內斯　馬里努斯　瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROVERS, JOHANNES MARINUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布斯卓恩　可瑞恩　弗瑞德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUSTRAAN, KRIJN FREDERIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種圓柱型線性馬達，其減小或消除齒槽效應轉矩(cogging)且可提供較高效冷卻以達成較高加速度。該圓柱型線性馬達包括用於高效冷卻之一新穎結構。在一些實施例中，存在一圓柱型線性動子，其包括諸如海爾貝克(Halbach)磁體之磁體，該等磁體呈一徑向結構配置，使得該等磁體之定向徑向地均勻。該圓柱型動子周圍係以三個為一組重複堆疊之一系列圓形(圓盤形)線圈、圓形冷卻板及圓形背鐵電樞(backiron armature)。在其他實施例中，新線性馬達包括不同徑向大小之圓柱型冷卻板，該等圓柱型冷卻板各自圍繞該圓柱型動子同心地間隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cylindrical linear motor is described that reduces or eliminates cogging and can provide more efficient cooling to achieve higher acceleration. The cylindrical linear motor includes a novel structure for efficient cooling. In some embodiments, there is a cylindrical linear mover that includes magnets, such as Halbach magnets, arranged in a radial structure such that the orientation of the magnets is radially uniform. Surrounding the cylindrical mover are a series of circular (disc-shaped) coils, circular cooling plates, and circular backiron armatures stacked repeatedly in sets of three. In other embodiments, the new linear motor includes cylindrical cooling plates of different radial sizes, each concentrically spaced around the cylindrical mover.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:圖示</p>  
        <p type="p">402:電線圈</p>  
        <p type="p">404:圓形冷卻板</p>  
        <p type="p">406:墊圈</p>  
        <p type="p">408:槽</p>  
        <p type="p">410:圓形背鐵電樞</p>  
        <p type="p">415:圖示</p>  
        <p type="p">420:圖示</p>  
        <p type="p">422:外引線</p>  
        <p type="p">424:內引線</p>  
        <p type="p">426:圓形冷卻板</p>  
        <p type="p">428:背鐵電樞</p>  
        <p type="p">430:電線圈</p>  
        <p type="p">432:圓柱型動子</p>  
        <p type="p">440:圖示</p>  
        <p type="p">442:冷卻表面</p>  
        <p type="p">444:電線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1104" publication-number="202620177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超高溫蒸汽加速煤炭變質演化生烴製備天然氣的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR PREPARING NATURAL GAS BY ACCELERATING METAMORPHISM, EVOLUTION AND HYDROCARBON GENERATION OF COAL USING ULTRA-HIGH TEMPERATURE VAPOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C10L3/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商華燃氣有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWA NATURAL GAS COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　忠勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於天然氣製備技術領域，涉及一種超高溫蒸汽加速煤炭變質演化生烴製備天然氣的系統及方法。所述系統包括：進料裝置，用於煤粉的氣動進料；加速煤炭變質演化生烴反應器，所述加速煤炭變質演化生烴反應器設置有物料蒸汽入口、煤粉入口和產出物出口，所述物料蒸汽入口與物料蒸汽供應裝置連接，用於輸入物料蒸汽，所述煤粉入口與所述進料裝置連接；加熱部件，所述加熱部件用於加熱所述加速煤炭變質演化生烴反應器。本發明的天然氣製備系統和方法是建立在研究煤層氣成因機理上的衍生技術，具有不加氧氣參與煤氣化、不加氫氣參與碳反應的特徵，顛覆了傳統煤製天然氣技術理念，能效高、耗能低、甲烷產出率高、節能效果顯著，是實現煤炭高效清潔梯級利用的先進能源轉化技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:進料裝置</p>  
        <p type="p">5:脫塵器</p>  
        <p type="p">7:物料蒸汽供應裝置</p>  
        <p type="p">8:加熱部件</p>  
        <p type="p">11:增壓裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1105" publication-number="202621015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260121B">H02M1/00</main-classification>  
        <further-classification edition="200601120260121B">H02M1/08</further-classification>  
        <further-classification edition="200601120260121B">H02M3/335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙韞玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王金帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃秋凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電源轉換器，其為一種低變壓器變比的磁集成倍流整流電路，通過調整同步整流電晶體與相應橋臂的連接方式，既能提升系統有效占空比，同時也降低了電路的增益。由此電源轉換器在相同輸出電壓的情況下可以降低變壓器的匝比，從而能夠減小變壓器損耗以及降低變壓器的成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C&lt;sub&gt;o&lt;/sub&gt;:輸出電容</p>  
        <p type="p">g1:公共節點</p>  
        <p type="p">L&lt;sub&gt;m1&lt;/sub&gt;,L&lt;sub&gt;m2&lt;/sub&gt;,L&lt;sub&gt;m3&lt;/sub&gt;:電感</p>  
        <p type="p">P1,P2,P3:一次側線圈</p>  
        <p type="p">Q&lt;sub&gt;1H&lt;/sub&gt;,Q&lt;sub&gt;2H&lt;/sub&gt;,Q&lt;sub&gt;3H&lt;/sub&gt;:上開關電晶體</p>  
        <p type="p">Q&lt;sub&gt;1L&lt;/sub&gt;,Q&lt;sub&gt;2L&lt;/sub&gt;,Q&lt;sub&gt;3L&lt;/sub&gt;:下開關電晶體</p>  
        <p type="p">S1,S2,S3:二次側線圈</p>  
        <p type="p">SR&lt;sub&gt;1&lt;/sub&gt;,SR&lt;sub&gt;2&lt;/sub&gt;,SR&lt;sub&gt;3&lt;/sub&gt;:整流電晶體</p>  
        <p type="p">T1,T2,T3:變壓器單元</p>  
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:輸入電壓</p>  
        <p type="p">V&lt;sub&gt;o&lt;/sub&gt;:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1106" publication-number="202620385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學感測器配置的校準</chinese-title>  
        <english-title>CALIBRATION OF AN OPTICAL SENSOR ARRANGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01J3/02</main-classification>  
        <further-classification edition="200601120260202B">G01J3/28</further-classification>  
        <further-classification edition="200601120260202B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列支敦斯登商英飛康股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFICON AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱瑟　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAISER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於校準光學感測器配置的靈敏度之校準裝置，其中該校準裝置包括：&lt;br/&gt; 一反射元件，其具有一反射區域，該反射區域包括多個方位不同的反射面；&lt;br/&gt; 一光源，其能夠提供光，並且配置成使得來自該光源的該發散光能夠照射該反射區域；&lt;br/&gt; 該光學感測器配置，其要被校準，其中該光學感測器配置具有用於接收入射光的一入射開口以及用於偵測經由該入射開口接收的光之至少一個感測器，以及其中該入射開口朝向該反射區域；以及&lt;br/&gt; 一不透光外殼，其防止來自該校準裝置外部的光進入該入射開口。&lt;br/&gt; 本發明進一步係有關於一種方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Calibration device for calibrating the sensitivity of an optical sensor arrangement, wherein the calibration device comprises &lt;br/&gt; - a reflecting element with a reflecting region, said reflecting region comprising a multiplicity of reflecting faces varying in their orientation,&lt;br/&gt; - a light source able to provide light and arranged such that said divergent light from the light source is able to illuminate said reflecting region,&lt;br/&gt; - the optical sensor arrangement to be calibrated, wherein the optical sensor arrangement has an entrance opening for receiving incoming light and has at least a sensor for detecting light received through the entrance opening, and wherein said entrance opening is oriented towards said reflecting region, and&lt;br/&gt; - a light tight casing preventing light of origin outside the calibration device from entering said entrance opening.&lt;br/&gt; The invention is further directed to a method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:校準裝置</p>  
        <p type="p">11:光學感測器配置</p>  
        <p type="p">12:感測器</p>  
        <p type="p">13:反射元件</p>  
        <p type="p">14:反射區域</p>  
        <p type="p">15,15':角度方位</p>  
        <p type="p">16:不透光外殼</p>  
        <p type="p">17:光源</p>  
        <p type="p">18:光路</p>  
        <p type="p">19:透鏡</p>  
        <p type="p">20:彎管元件</p>  
        <p type="p">21:彎管元件的第一端</p>  
        <p type="p">22:彎管元件的第二端</p>  
        <p type="p">24:入射開口</p>  
        <p type="p">α:角度範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1107" publication-number="202621027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換電路及其控制方法</chinese-title>  
        <english-title>POWER CONVERSION CIRCUIT AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H02M3/335</main-classification>  
        <further-classification edition="200601120251103B">H02M3/24</further-classification>  
        <further-classification edition="200601120251103B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊大勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TA-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林梓誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以將輸入電壓轉換至輸出電壓之諧振式電源轉換電路包括諧振電容、變壓器、上橋電晶體、下橋電晶體以及控制電路。諧振電容耦接於諧振節點以及接地端之間，諧振節點產生諧振電壓。變壓器包括耦接於切換節點以及諧振節點之間之初級線圈以及次級線圈。上橋電晶體將輸入電壓提供至切換節點。下橋電晶體將切換節點耦接至接地端。當上橋電晶體以及下橋電晶體皆關斷後，控制電路先判斷諧振電壓小於既定臨限值，再驅動上橋電晶體以及下橋電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power conversion circuit for converting an input voltage to an output voltage includes a resonant capacitor, a transformer, a high-side transistor, a low-side transistor, and a control circuit. The resonant capacitor is coupled between a resonant node and a ground, and a resonant voltage is generated at the resonant node. The transformer includes a primary coil coupled between a switch node and a resonant node and a secondary coil. The high-side transistor provides the input voltage to the switch node, and the low-side transistor couples the switch node to the ground. When the high-side transistor and the low-side transistor are both turned off, the control circuit determines that the resonant voltage is less than a predetermined threshold and then drives the high-side transistor and the low-side transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:電源轉換電路</p>  
        <p type="p">111:上橋電晶體</p>  
        <p type="p">111D:上橋寄生二極體</p>  
        <p type="p">112:下橋電晶體</p>  
        <p type="p">112D:下橋寄生二極體</p>  
        <p type="p">120:電壓產生電路</p>  
        <p type="p">130:整流電路</p>  
        <p type="p">330:控制電路</p>  
        <p type="p">340:次級控制電路</p>  
        <p type="p">160:位準移位電路</p>  
        <p type="p">CR:諧振電容</p>  
        <p type="p">TM:變壓器</p>  
        <p type="p">PD:光耦合元件</p>  
        <p type="p">HSD:上橋驅動電路</p>  
        <p type="p">LSD:下橋驅動電路</p>  
        <p type="p">HSG:上橋閘極驅動信號</p>  
        <p type="p">LSG:下橋閘極驅動信號</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">SW:切換節點</p>  
        <p type="p">NR:諧振節點</p>  
        <p type="p">VCR:諧振電壓</p>  
        <p type="p">PS:初級線圈</p>  
        <p type="p">SS:次級線圈</p>  
        <p type="p">AS:輔助線圈</p>  
        <p type="p">NA:輔助節點</p>  
        <p type="p">VNA:助線圈電壓</p>  
        <p type="p">IOUT:輸出電流</p>  
        <p type="p">IP:初級電流</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">RD1:第一分壓電阻</p>  
        <p type="p">RD2:第二分壓電阻</p>  
        <p type="p">TR:整流電晶體</p>  
        <p type="p">DR:整流寄生二極體</p>  
        <p type="p">COUT:輸出電容</p>  
        <p type="p">VD:汲極電壓</p>  
        <p type="p">IFB:回授電流</p>  
        <p type="p">VFB:回授電壓</p>  
        <p type="p">SH:上橋驅動信號</p>  
        <p type="p">SL:下橋驅動信號</p>  
        <p type="p">HSG:上橋閘極驅動信號</p>  
        <p type="p">LSG:下橋閘極驅動信號</p>  
        <p type="p">310:第一放電電路</p>  
        <p type="p">RDG:放電電阻</p>  
        <p type="p">RDT:偵測電阻</p>  
        <p type="p">ADJ:調整信號</p>  
        <p type="p">VCTL:控制電壓</p>  
        <p type="p">DMG:退磁電壓</p>  
        <p type="p">320:第二放電電路</p>  
        <p type="p">ROD:輸出放電電阻</p>  
        <p type="p">SWD:放電開關</p>  
        <p type="p">BLD:放電信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1108" publication-number="202620927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調整水的製造裝置及調整水的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">H01J37/317</main-classification>  
        <further-classification edition="202301120260203B">C02F1/46</further-classification>  
        <further-classification edition="202301120260203B">C02F1/20</further-classification>  
        <further-classification edition="202301120260203B">C02F1/42</further-classification>  
        <further-classification edition="202301120260203B">C02F1/44</further-classification>  
        <further-classification edition="200601120260203B">G01N27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種調整水的製造裝置，該製造裝置包括：摻雜劑元素的濃度調整裝置，對含有摻雜劑成分的濃度調整劑控制其添加量，並將其添加至處理對象水中；以及水質監視裝置，對添加有濃度調整劑的處理對象水、或調整水中的摻雜劑元素的濃度進行測定，該製造裝置包括雜質成分的去除裝置，所述雜質成分的去除裝置自可添加濃度調整劑的處理對象水或濃度調整劑中選擇性地去除與摻雜劑成分不同的雜質成分的至少一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:調整水的製造裝置/製造裝置</p>  
        <p type="p">10:摻雜劑元素的濃度調整裝置/濃度調整裝置</p>  
        <p type="p">12:收容有濃度調整劑的罐/罐</p>  
        <p type="p">14L:供給管線</p>  
        <p type="p">20:雜質成分的去除裝置/去除裝置</p>  
        <p type="p">30:水質監視裝置/監視裝置</p>  
        <p type="p">40:控制裝置</p>  
        <p type="p">W:超純水等處理對象水/處理對象水</p>  
        <p type="p">L1、L2:移送管線</p>  
        <p type="p">UP:使用點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1109" publication-number="202621214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板及半導體封裝</chinese-title>  
        <english-title>CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H05K3/46</main-classification>  
        <further-classification edition="200601120260223B">H05K3/40</further-classification>  
        <further-classification edition="200601120260223B">H05K1/03</further-classification>  
        <further-classification edition="202601120260223B">H05K3/34</further-classification>  
        <further-classification edition="200601120260223B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權拏暻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, NA KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鐘天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG CHEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板，包含：一絕緣層，其包含複數個填充物；且一線路層，其設置於該絕緣層上，其中該絕緣層的每個填充物包含一接觸元件，該接觸元件與該線路層接觸，且其朝向該絕緣層底面的表面曲率與朝向該線路層的另一表面曲率彼此不同，一絕緣層頂面具有朝向底面凹陷的一凹面，且該接觸元件至少一部垂直重疊於該凹面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a circuit board. The circuit board includes an insulating layer including a plurality of fillers, and a line layer disposed on the insulating layer. Each of the fillers of the insulating layer includes a contact member which is in contact with the line layer and of which a curvature of one surface facing a bottom surface of the insulating layer and a curvature of the other surface facing the line layer are different from each other, a top surface of the insulating layer has a concave surface that is concave toward the bottom surface, and at least a portion of the contact member overlaps vertically the concave surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:第一保護層</p>  
        <p type="p">141:凹面</p>  
        <p type="p">160:第五線路層</p>  
        <p type="p">300:接觸元件</p>  
        <p type="p">302:表面</p>  
        <p type="p">304:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1110" publication-number="202620399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分流通道氣體噴頭測試固定裝置</chinese-title>  
        <english-title>SPLIT CHANNEL GAS SHOWERHEAD TEST FIXTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">G01M3/26</main-classification>  
        <further-classification edition="200601120260213B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　穎峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FRANK WING-FUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳典曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DIEN-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村山祐二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAYAMA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　杉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張艾晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, AI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了噴頭組件測試固定裝置和測試多通道噴頭通道間洩漏的方法。該洩漏測試固定裝置包括：夾具底座，該夾具底座具有複數個壓縮元件固定裝置底座；密封板，該密封板具有複數個突起；墊片，該墊片位於該密封板上；以及夾具，該夾具被配置為緊固該噴頭組件，使得面板的前表面與該墊片接觸，並且該密封板上的該複數個突起阻擋該面板的前表面中的開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are showerhead assembly test fixtures and methods for testing leakage between multi-channel showerhead channels. The leak test fixture comprises a fixture base with a plurality of compression elements, a seal plate with a plurality of protrusions, a gasket on the seal plate, and a clamp configured to secure the showerhead assembly so that the front surface of the faceplate is in contact with the gasket and the plurality of protrusions on the seal plate block the openings in the front surface of the faceplate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:噴頭組件</p>  
        <p type="p">105:前表面</p>  
        <p type="p">140:開口</p>  
        <p type="p">300:噴頭組件洩漏測試固定裝置</p>  
        <p type="p">310:固定裝置底座</p>  
        <p type="p">312:頂表面</p>  
        <p type="p">314:底表面</p>  
        <p type="p">320:壓縮元件</p>  
        <p type="p">330:對準銷</p>  
        <p type="p">340:密封板</p>  
        <p type="p">342:頂表面</p>  
        <p type="p">344:底表面</p>  
        <p type="p">350:突起</p>  
        <p type="p">360:墊片</p>  
        <p type="p">362:頂表面</p>  
        <p type="p">364:底表面</p>  
        <p type="p">370:夾具</p>  
        <p type="p">380:測試歧管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1111" publication-number="202620972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子模組、連接器和連接器組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260213B">H01R12/72</main-classification>  
        <further-classification edition="200601120260213B">H01R13/24</further-classification>  
        <further-classification edition="200601120260213B">H01R13/405</further-classification>  
        <further-classification edition="200601120260213B">H01R13/502</further-classification>  
        <further-classification edition="200601120260213B">H01R13/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞春明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUNMING (RICHARD)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈興杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, XINGJIE (STEVEN)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙光明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUANGMING (SUNY)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YAN (BILL)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種端子模組、連接器和連接器組件。所述端子模組包括：一排端子，每個端子包括L型固定部以及與所述L型固定部的兩端分別相連的彈性臂和焊接腳；和絕緣體，被注塑在所述一排端子的L型固定部上，使得所述一排端子的L型固定部被保持在所述絕緣體中，所述絕緣體適於被安裝和固定到連接器殼體中，以保證所述端子的彈性臂能夠與插入所述連接器殼體中的對配連接器的對配端子穩定且可靠地電接觸。在本發明中，端子的整個L型固定部被保持在絕緣體中，並且絕緣體被牢固地安裝在連接器殼體中，提高了端子的彈性臂的結構強度，保證端子的彈性臂能夠與對配端子穩定且可靠地電接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣體</p>  
        <p type="p">2:端子</p>  
        <p type="p">10:主體部</p>  
        <p type="p">11:定位肋</p>  
        <p type="p">11a:側部定位肋</p>  
        <p type="p">11b:頂部定位肋</p>  
        <p type="p">21:彈性臂</p>  
        <p type="p">22:焊接腳</p>  
        <p type="p">100:端子模組</p>  
        <p type="p">X:橫向</p>  
        <p type="p">Y:縱向</p>  
        <p type="p">Z:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1112" publication-number="202621412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="200601120260223B">G03F7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井仁司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理裝置具備腔室、基板保持部、及回轉機構。腔室具有連通內部與外部、供搬入及搬出基板之開口。基板保持部配置於腔室內，逐片保持基板。回轉機構藉由使基板保持部回轉，而於腔室內，使基板保持部於利用處理液對基板進行處理之複數個處理位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus includes a chamber, a substrate holding portion, and a turning mechanism. The chamber has an opening through which the inside and the outside communicate with each other and a substrate is carried in and out. The substrate holding portion is disposed in the chamber and holds the substrate one by one. The turning mechanism turns the substrate holding portion to move the substrate holding portion between a plurality of processing positions at which the substrate is processed with the processing liquid in the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理單元</p>  
        <p type="p">11:腔室</p>  
        <p type="p">12:開口</p>  
        <p type="p">12a:第1開口</p>  
        <p type="p">12b:第2開口</p>  
        <p type="p">13:擋板</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">101:控制裝置</p>  
        <p type="p">102:控制部</p>  
        <p type="p">104:記憶部</p>  
        <p type="p">111:通路</p>  
        <p type="p">200:基板保持部</p>  
        <p type="p">200a:基端部</p>  
        <p type="p">200b:前端部</p>  
        <p type="p">400:浸漬槽</p>  
        <p type="p">C200:圓</p>  
        <p type="p">CR:中心機器人</p>  
        <p type="p">IR:傳載機器人</p>  
        <p type="p">L200:回轉軸線</p>  
        <p type="p">LP:裝載埠</p>  
        <p type="p">Q:處理位置</p>  
        <p type="p">Q1:處理位置</p>  
        <p type="p">Q2:處理位置</p>  
        <p type="p">W:基板</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1113" publication-number="202621002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力轉移</chinese-title>  
        <english-title>WIRELESS POWER TRANSFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260210B">H02J50/12</main-classification>  
        <further-classification edition="201601120260210B">H02J50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德瑞克　喬翰尼斯　威爾赫摩斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRAAK, JOHANNES WILHELMUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎本斯　帕司可　李奧納德　瑪麗亞　西奧多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEBENS, PASCAL LEONARD MARIA THEODOOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路洛福斯　克拉斯　雅各布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LULOFS, KLAAS JAKOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線電力傳輸器(101)回應於由一驅動器(201)產生的一驅動信號而經由從一電力轉移線圈(103)產生的一電磁電力轉移信號將電力提供至一電力接收器(105)。一通訊電路(207)從該電力接收器(105)接收電力設定點值，且一電力控制器(211)取決於該等電力設定點值控制該驅動信號的一電力位準參數。一開迴路控制(703)從該等電力設定點值產生開迴路控制值，且一閉迴路控制電路(701)從該等電力設定點值產生閉迴路控制值。一第一電路(705)組合此等值以產生輸出控制值，該等輸出控制值由一第二電路(707)使用以設定該電力位準參數。一調適器(709)取決於至該電力接收器的一電力轉移的一電力轉移位準而調適該組合的該等相對權重。 &lt;br/&gt;圖2</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless power transmitter (101) provides power to a power receiver (105) via an electromagnetic power transfer signal generated from a power transfer coil (103) in response to a drive signal generated by a driver (201). A communication circuit (207) receives power setpoint values from the power receiver (105) and a power controller (211) controls a power level parameter of the drive signal in dependence on the power setpoint values. An open loop control (703) generates open loop control values and a closed loop control circuit (701) generates closed loop control values from the power setpoint values. A first circuit (705) combines these to generate output control values which by a second circuit (707) is used to set the power level parameter. An adapter (709) adapts the relative weights of the combination in dependence on a power transfer level for a power transfer to the power receiver.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:傳輸器線圈或電感器；傳輸器線圈/電感器；傳輸器線圈</p>  
        <p type="p">201:驅動器</p>  
        <p type="p">203:電容器</p>  
        <p type="p">205:電力傳輸器控制器</p>  
        <p type="p">207:電力傳輸器通訊器；第一通訊器</p>  
        <p type="p">209:第一通訊線圈；通訊線圈</p>  
        <p type="p">211:電力傳輸器電力控制器電路；電力控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1114" publication-number="202620550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影設備之感測器系統的方法</chinese-title>  
        <english-title>METHOD FOR USE WITH A SENSOR SYSTEM OF A LITHOGRAPHIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊波寧特　吉凡尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMPONENTE, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫辛克　巴特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORSINK, BART JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特　亨德里克斯　杰拉爾杜斯　朱利葉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BART, HENDRICUS GERARDUS JULIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦勒伯斯　艾瑞克　裘漢斯　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALLERBOS, ERIK JOHANNES MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於一種用於一感測器系統之方法。該感測器系統包含：一反射標記，其包含一反射繞射光柵；及複數個感測器，其包含一第一感測器及一第二感測器。該第一感測器包含一第一透射繞射光柵及一第一輻射偵測器，且該第二感測器包含一第二透射繞射光柵及一第二輻射偵測器。該方法包含利用該第一感測器量測自該反射標記反射之輻射；利用該第二感測器量測自該反射標記反射之輻射；及基於利用該第一感測器對自該反射標記反射之輻射的該量測及利用該第二感測器對自該反射標記反射之輻射的該量測而判定與該第一透射繞射光柵及該第二透射繞射光柵之相對位置的一改變相關聯之一誤差分量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for use with a sensor system. The sensor system comprises a reflective mark comprising a reflective diffraction grating and a plurality of sensors comprising a first sensor and a second sensor. The first sensor comprises a first transmissive diffraction grating and a first radiation detector, and the second sensor comprises a second transmissive diffraction grating and a second radiation detector. The method comprises measuring radiation reflected from the reflective mark with the first sensor; measuring radiation reflected from the reflective mark with the second sensor; and determining an error component associated with a change in the relative position of the first transmissive diffraction grating and the second transmissive diffraction grating based on the measurement of radiation reflected from the reflective mark with the first sensor and the measurement of radiation reflected from the reflective mark with the second sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">304:基準件</p>  
        <p type="p">313:感測器板</p>  
        <p type="p">3011:反射標記</p>  
        <p type="p">3012:反射標記</p>  
        <p type="p">3013:反射標記</p>  
        <p type="p">3014:反射標記</p>  
        <p type="p">3015:反射標記</p>  
        <p type="p">3111:透射標記</p>  
        <p type="p">3112:透射標記</p>  
        <p type="p">3113:透射標記</p>  
        <p type="p">3114:透射標記</p>  
        <p type="p">3115:透射標記</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1115" publication-number="202620934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導流環和電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張一川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種導流環和電漿處理裝置，導流環設置在電漿處理裝置的反應腔內，反應腔內設有用於承載晶圓的基座，導流環包括氣流引導部、排氣部和連接部；氣流引導部圍繞基座設置；排氣部位於氣流引導部的下方，排氣部上開設有第一氣道；連接部連接氣流引導部和排氣部，連接部上開設有第二氣道。本發明的導流環和電漿處理裝置，通過將導流環的排氣部設置在氣流引導部的下方，使排氣區域遠離基座上方區域，減小因排氣部附近的氣流流動對基座上方氣壓變化的影響，提高基座上晶圓上方不同區域氣壓的均勻性，提高晶圓上各處加工的均一性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電漿處理裝置</p>  
        <p type="p">100:導流環</p>  
        <p type="p">110:氣流引導部</p>  
        <p type="p">120:排氣部</p>  
        <p type="p">121:第一氣道</p>  
        <p type="p">130:連接部</p>  
        <p type="p">131:第二氣道</p>  
        <p type="p">W:晶圓</p>  
        <p type="p">210:基座</p>  
        <p type="p">220:內壁</p>  
        <p type="p">230:氣體供應裝置</p>  
        <p type="p">240:抽氣口</p>  
        <p type="p">A:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1116" publication-number="202620165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低熔點的合金熱介面材料</chinese-title>  
        <english-title>LOW MELTING ALLOY THERMAL INTERFACE MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C09K5/06</main-classification>  
        <further-classification edition="200601120260203B">C08L83/07</further-classification>  
        <further-classification edition="200601120260203B">C08L83/06</further-classification>  
        <further-classification edition="200601120260203B">C09K11/62</further-classification>  
        <further-classification edition="200601120260203B">C08K3/08</further-classification>  
        <further-classification edition="200601120260203B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱拉姆　拉德什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEWRAM, RADESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何思遙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, SIYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種熱介面材料，其包含基質材料；包含複數個金屬液滴之第一組分，該複數個金屬液滴具有小於約30℃之熔點溫度；及具有固相之第二組分，該固相包含縱橫比大於約2:1之顆粒，至少一部分該等顆粒分散於該基質材料中，其中該第二組分具有介於約30℃及約90℃之間之熔點溫度，在該溫度下該第二組分自該固相轉變為液相，其中該液相中之該第二組分可溶於該基質材料中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal interface material includes a matrix material; a first component including a plurality of metal droplets, the plurality of metal droplets having a melting point temperature of less than about 30 °C; and a second component having a solid phase including particles having an aspect ratio greater than about 2:1, at least a portion of the particles being dispersed in the matrix material, wherein the second component has a melting point temperature of between about 30 °C and about 90 °C at which the second component transitions from the solid phase to a liquid phase, wherein the second component in the liquid phase may be soluble in the matrix material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1117" publication-number="202620935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理裝置及其上電極組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/32</main-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體處理裝置及其上電極組件，上電極組件包括安裝基板和氣體噴淋頭。安裝基板包括安裝主體，安裝主體的中心區域厚度小於邊緣區域厚度，減小受熱後安裝主體從中心區域到邊緣區域在豎直方向的熱膨脹尺寸差異，在安裝基板和容納安裝基板的腔室頂蓋之間預留安裝間隙，安裝基板和腔室頂蓋之間採用間隙固定方式，使安裝基板受熱膨脹時產生的熱應力充分釋放，將安裝主體直接與安裝連接部連接，使安裝基板在水平方向發生熱膨脹的力線相同，減小安裝基板受到的熱應力，縮短導熱距離，減小安裝基板不同區域的溫差，減小安裝基板發生凸起形變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腔室主體</p>  
        <p type="p">101:腔室側壁</p>  
        <p type="p">2:腔室蓋</p>  
        <p type="p">21:腔室蓋下表面</p>  
        <p type="p">201:開口</p>  
        <p type="p">301:安裝基板</p>  
        <p type="p">302:氣體噴淋頭</p>  
        <p type="p">303:安裝主體</p>  
        <p type="p">3031:安裝主體下表面</p>  
        <p type="p">3032:安裝主體上表面</p>  
        <p type="p">3033:安裝主體中心區域</p>  
        <p type="p">3034:安裝主體邊緣區域</p>  
        <p type="p">305:安裝連接部</p>  
        <p type="p">3051:安裝連接部下表面</p>  
        <p type="p">306:氣體擋板</p>  
        <p type="p">307:冷卻管道</p>  
        <p type="p">308:加熱器</p>  
        <p type="p">309:間隙</p>  
        <p type="p">4:基座</p>  
        <p type="p">5:待處理基片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1118" publication-number="202620707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理系統及模型優化方法</chinese-title>  
        <english-title>DATA PROCESSING SYSTEM AND MODEL OPTIMIZATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260102B">G06N20/00</main-classification>  
        <further-classification edition="202301120260102B">G06N3/08</further-classification>  
        <further-classification edition="200601120260102B">G06F11/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝秉勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PING-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭韋良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, WEI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪明郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料處理系統，用於對在平台上執行的第一模型進行優化，該資料處理系統包括：第一處理單元，被配置為捕獲該第一模型的一組統計資料，並根據該統計資料生成追蹤資料，其中該追蹤資料指示該第一模型的性能指標；以及第二處理單元，被配置為執行第二模型以分析該追蹤資料所指示的該性能指標，以便為該第一模型生成建議資料，其中該建議資料包括優化該第一模型的建議和/或指示該第一模型性能瓶頸的瓶頸指示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data processing system, for performing a model optimization for a first model which is executed on a platform, the data processing system comprising: a first processing unit, configured to capture a set of statistical data of the first model, and generate a trace data based on the statistical data, wherein the trace data indicates a plurality of performance metrics of the first model; and a second processing unit, configured to execute a second model to analyze the performance metrics indicated by the trace data, so as to generate an advice data for the first model, wherein the advice data comprises a suggestion for optimizing the first model and/or a bottleneck identification for indicating a bottleneck of performance of the first model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2000:平台</p>  
        <p type="p">m1:第一模型</p>  
        <p type="p">400:編譯單元</p>  
        <p type="p">SD:統計資料</p>  
        <p type="p">AD:建議資料</p>  
        <p type="p">TD:追蹤資料</p>  
        <p type="p">VD:可視資料</p>  
        <p type="p">VD':標記的可視資料</p>  
        <p type="p">1000:資料處理系統</p>  
        <p type="p">100:第一處理單元</p>  
        <p type="p">200:第二處理單元</p>  
        <p type="p">300:用戶介面</p>  
        <p type="p">u1:用戶</p>  
        <p type="p">m2:第二模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1119" publication-number="202620838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用重心座標對電泳顯示器上呈現的影像進行色彩增強的方法和系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS USING BARYCENTRIC COORDINATES FOR COLOR ENHANCEMENT IN IMAGES RENDERED ON ELECTROPHORETIC DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G09G3/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAMM, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯羅斯　肯尼士Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROUNSE, KENNETH R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於使用重心座標增強在電泳顯示器上呈現的影像中之顏色的方法及系統。此增強是在將源影像的裝置相關像素值映射至目的影像的裝置相關像素值的工作流程中執行的。輸入及輸出色彩空間各自包含複數個調色盤原色(PP)，通常是八個。將這些色彩空間劃分為由四個相鄰PP界定的複數個四面體。在輸入色彩空間及輸出色彩空間中的這些PP因具有相同的各自色調而彼此相關聯。源影像的像素值位於六個四面體中之一內，並且被轉換至重心座標。使用亮度及/或色度增強來修改重心座標，以改善最終色域映射影像在輸出色彩空間中的顯現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems are provided for enhancing colors in images rendered on electrophoretic displays using Barycentric coordinates. The enhancement is performed within the workflow for mapping device-dependent pixel values of source images to device-dependent pixel values of destination images. The input and output color spaces each contain a plurality of palette primary (PP) colors, nominally eight. The color spaces are divided into a plurality of tetrahedra defined by four adjacent PPs. The PPs in the input color space and output color space are associated with each other by having the same respective hues. Pixel values of the source image are located in one of the six tetrahedra and are converted to Barycentric coordinates. The Barycentric coordinates are modified using lightness and/or chroma enhancement to improve the appearance of the final gamut mapped image in the output color space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1120" publication-number="202621413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣裝置和半導體加工設備</chinese-title>  
        <english-title>EXHAUST DEVICES AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋新豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, XIN FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種排氣裝置和半導體加工設備，該裝置包括：排氣主體，排氣主體中設置有排氣通道，排氣通道的進氣口用於與被控壓件的排氣口連通，排氣通道的出氣口用於與廠務排氣端連通；排氣通道具有垂直通道段和位於垂直通道段底部的開口部；調節件，相對地位於垂直通道段中、且位於開口部的上方；以及連接限位組件，與調節件可相對升降的連接，且限制調節件距離開口部的最近位置，以使調節件在所受到的向上的氣體壓力大於自身重力時自最近位置上升，直至氣體壓力與重力達到平衡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an exhaust device and a semiconductor processing equipment. The exhaust device includes an exhaust main body, and an exhaust channel is arranged in the exhaust main body. An air inlet of the exhaust channel communicates with the exhaust port of the controlled pressure part, and an air outlet of the exhaust channel communicates with the factory exhaust end. The exhaust channel has a vertical channel section and an opening portion located at the bottom of the vertical channel section. An adjusting member is relatively located in the vertical channel section and above the opening portion, and a connection limit assembly is connected to the adjusting member so that it can be relatively raised and lowered, and limits the closest position of the adjusting member to the opening portion. Accordingly, the adjusting member rises from the closest position when the upward gas pressure to which it is subjected is greater than its own gravity, until the gas pressure and gravity reach a balance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:排氣裝置</p>  
        <p type="p">11:排氣主體</p>  
        <p type="p">12:調節件</p>  
        <p type="p">13:連接限位組件</p>  
        <p type="p">14:排氣通道</p>  
        <p type="p">14a:垂直通道段</p>  
        <p type="p">14b:進氣通道段</p>  
        <p type="p">14c:排氣通道段</p>  
        <p type="p">16:導桿</p>  
        <p type="p">18:調節風門</p>  
        <p type="p">12b,12b’:第二子調節件</p>  
        <p type="p">12a,12a’,12a”:第一子調節件</p>  
        <p type="p">111:開口部</p>  
        <p type="p">111a:空間</p>  
        <p type="p">111b:第二開口</p>  
        <p type="p">112:調節盒體</p>  
        <p type="p">113:進氣盒體</p>  
        <p type="p">114:排氣盒體</p>  
        <p type="p">181:壓力檢測口</p>  
        <p type="p">A0:位置</p>  
        <p type="p">B0:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1121" publication-number="202620362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127744</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子櫃之液體歧管總成</chinese-title>  
        <english-title>LIQUID MANIFOLD ASSEMBLY FOR ELECTRONICS CABINET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">F28F9/013</main-classification>  
        <further-classification edition="200601120260210B">H05K13/04</further-classification>  
        <further-classification edition="200601120260210B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商霍弗曼組件公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN ENCLOSURES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德瑪斯　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMARS, ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一伺服器機架之歧管總成包含：一歧管管件，其界定一第一面及一第二面；一流體端口，其自該第一面向外延伸；及一安裝總成，其將該歧管管件固定至該伺服器機架。該安裝總成包含：一安裝區塊，其固定至該歧管管件之該第二面；及一安裝通道，其具有自一基底延伸之一對側壁。該安裝通道之該等側壁附接至該安裝區塊之對應橫向表面以將該歧管管件固定至該伺服器機架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manifold assembly for a server rack includes a manifold tube defining a first face and a second face, a fluid port extending outwardly from the first face, and a mounting assembly to secure the manifold tube to the server rack. The mounting assembly includes a mounting block secured to the second face of the manifold tube and a mounting channel having a pair of side walls extending from a base. The side walls of the mounting channel are attached to corresponding lateral surfaces of the mounting block to secure the manifold tube to the server rack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:歧管總成</p>  
        <p type="p">102:歧管管件</p>  
        <p type="p">104:前壁</p>  
        <p type="p">105:壁/管件橫向壁</p>  
        <p type="p">106:壁/後壁/管件後壁</p>  
        <p type="p">107:壁/管件橫向壁</p>  
        <p type="p">110:端口/流體端口</p>  
        <p type="p">112:遠端</p>  
        <p type="p">120:頂部部分</p>  
        <p type="p">122:底部部分</p>  
        <p type="p">130:安裝總成</p>  
        <p type="p">132:通道/安裝通道</p>  
        <p type="p">160:導引銷</p>  
        <p type="p">A:軸線</p>  
        <p type="p">B:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1122" publication-number="202619630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對肉類替代食品用組成物賦予似肉口感的方法、被賦予似肉口感之肉類替代食品用組成物的製造方法、增強肉類替代食品用組成物的硬度的方法、肉類替代食品用組成物、以及肉類替代食品用乾燥組成物</chinese-title>  
        <english-title>METHOD FOR IMPARTING MEAT-LIKE TEXTURE TO MEAT SUBSTITUTE FOOD COMPOSITION, METHOD FOR PRODUCING MEAT SUBSTITUTE FOOD COMPOSITION IMPARTED WITH MEAT-LIKE TEXTURE, METHOD FOR ENHANCING HARDNESS OF MEAT SUBSTITUTE FOOD COMPOSITION, MEAT SUBSTITUTE FOOD COMPOSITION, AND DRIED COMPOSITION FOR MEAT SUBSTITUTE FOOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A23J3/00</main-classification>  
        <further-classification edition="201601120260202B">A23L31/00</further-classification>  
        <further-classification edition="201601120260202B">A23L33/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雪國工廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIGUNI FACTORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木和田瑞穂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIWADA, MIZUHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神田佳一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDA, KEIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>計良匡俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERA, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤真晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, MASAHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南雲弘明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGUMO, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅北耕典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEKITA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊彩乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, AYANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種肉類替代食品用組成物，具有良好的耐咀嚼質地，加熱後風味依然優異，肉質般的口感。本發明的一種態樣是對肉類替代食品用組成物賦予似肉口感的方法。包括質量百分比0.5 wt%～50.0 wt%來自菇類的固形成分，水分的含有量為質量百分比15.0 wt%～85.0 wt%，該方法具有以下各製程： &lt;br/&gt;製程（1）：將所述菇類和轉麩醯胺酸酶混合。 &lt;br/&gt;製程（2）：將所述製程（1）得到的混合物在3～60℃的環境下進行轉麩醯胺酸酶反應1.0～48.0小時。 &lt;br/&gt;該肉類替代食品用組成物具有接受轉麩醯胺酸酶反應的來自菇類的固形成分為質量百分比0.5 wt%～50.0 wt%，所述肉類替代食品組成物中水分的含有量為質量百分比15.0 wt%～85.0 wt%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A meat substitute food composition is provided, exhibiting excellent chewy texture, superior flavor retention after heating, and a meat-like texture. One embodiment of the present invention is a method for imparting a meat-like texture to a meat substitute food composition. It includes a solid content derived from mushrooms with mass percentage between 0.5 wt% and 50.0 wt%, and a moisture content with mass percentage between 15.0 wt% and 85.0 wt%. The method includes the following processes: &lt;br/&gt;Process (1): Mixing the mushrooms with transglutaminase. &lt;br/&gt;Process (2): Subjecting the mixture obtained in Process (1) to transglutaminase reaction at 3°C to 60°C for 1.0 to 48.0 hours. &lt;br/&gt;The meat substitute food composition has solid content derived from mushrooms subjected to transglutaminase reaction with mass percentage between 0.5 wt% and 50.0 wt%, and the moisture content of the meat substitute food composition is with mass percentage between 15.0 wt% and 85.0 wt%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1123" publication-number="202621509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊晶粒之無基板式半導體封裝</chinese-title>  
        <english-title>STACKED DIE SUBSTRATE-LESS SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/652</main-classification>  
        <further-classification edition="202601120260223B">H10W70/09</further-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W90/24</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　戈庫爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, GOKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔基亞　赫姆　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIAR, HEM P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中所描述之實施方案係關於各種半導體裝置總成。在一些實施方案中，一種設備包含與一積體電路晶粒堆疊中之一第二積體電路晶粒結合的一第一積體電路晶粒，其中該第一積體電路晶粒包含延伸超出該第二積體電路晶粒之一邊緣的一端部區。該設備包含：一互連結構，其與該端部區結合且電耦合至該第一積體電路晶粒之積體電路系統；及一殼體，其囊封該互連結構之至少一部分、該第一積體電路晶粒之至少一部分，及該第二積體電路晶粒之至少一部分。該設備包含一電跡線，其與該殼體之一表面結合，沿著該殼體之一輪廓安置，且電耦合至該互連結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations described herein relate to various semiconductor device assemblies. In some implementations, an apparatus includes a first integrated circuit die conjoined with a second integrated circuit die in a stack of integrated circuit dies, where the first integrated circuit die includes an end region that extends beyond an edge of the second integrated circuit die. The apparatus includes an interconnect structure that is conjoined with the end region and is electrically coupled to integrated circuitry of the first integrated circuit die and a casing that encapsulates at least a portion of the interconnect structure, at least a portion of the first integrated circuit die, and at least a portion of the second integrated circuit die. The apparatus includes an electrical trace that is conjoined with a surface of the casing, is disposed along a contour of the casing, and is electrically coupled to the interconnect structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100-1:設備</p>  
        <p type="p">100-2:設備</p>  
        <p type="p">105-1:第一積體電路</p>  
        <p type="p">105-2:第二積體電路</p>  
        <p type="p">110-1:半導體晶粒/第一積體電路晶粒</p>  
        <p type="p">110-2:半導體晶粒/第二積體電路晶粒</p>  
        <p type="p">110-3:半導體晶粒/積體電路晶粒</p>  
        <p type="p">110-4:半導體晶粒/積體電路晶粒</p>  
        <p type="p">110-5:晶粒</p>  
        <p type="p">110-6:晶粒</p>  
        <p type="p">110-7:晶粒</p>  
        <p type="p">110-8:晶粒</p>  
        <p type="p">110-9:晶粒</p>  
        <p type="p">130:互連結構</p>  
        <p type="p">135-1:互連結構</p>  
        <p type="p">135-2:互連結構</p>  
        <p type="p">140-1:重佈電路/第一部分</p>  
        <p type="p">140-2:重佈電路/第二部分</p>  
        <p type="p">140-3:重佈電路</p>  
        <p type="p">145:橫向部分</p>  
        <p type="p">150-1:傾斜部分/第一傾斜表面</p>  
        <p type="p">150-2:傾斜部分/第二傾斜表面</p>  
        <p type="p">155:保護層</p>  
        <p type="p">1000:實施方案</p>  
        <p type="p">1005:堆疊半導體封裝結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1124" publication-number="202620022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噠嗪酮及其使用方法</chinese-title>  
        <english-title>PYRIDAZINONES AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C07D471/04</main-classification>  
        <further-classification edition="200601120260205B">A61K31/519</further-classification>  
        <further-classification edition="200601120260205B">A61K31/501</further-classification>  
        <further-classification edition="200601120260205B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260205B">A61K31/075</further-classification>  
        <further-classification edition="200601120260205B">A61P13/12</further-classification>  
        <further-classification edition="200601120260205B">A61P35/00</further-classification>  
        <further-classification edition="200601120260205B">A61P1/00</further-classification>  
        <further-classification edition="200601120260205B">A61P3/00</further-classification>  
        <further-classification edition="200601120260205B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商金翅雀生技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDFINCH BIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷德波爾　馬克　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEDEBOER, MARK W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼爾斯　馬修　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANIELS, MATTHEW H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余　茂林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈曼格　貞　克里斯多夫　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARMANGE, JEAN-CHRISTOPHE P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示根據式（I）之化合物，及相關醫藥組合物。亦揭示治療方法，例如使用式（I）化合物治療腎病。 &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="216px" file="ed10126.JPG" alt="ed10126.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are compounds according to Formula (I), and related pharmaceutical compositions. Also disclosed are therapeutic methods, e.g., of treating kidney diseases, using the compounds of Formula (I). &lt;br/&gt;&lt;img align="absmiddle" height="168px" width="216px" file="ed10127.JPG" alt="ed10127.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1125" publication-number="202621064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耦合器電路及包括耦合器電路的無線通訊裝置</chinese-title>  
        <english-title>COUPLER CIRCUIT AND WIRELESS COMMUNICATION DEVICE INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260211B">H04B1/40</main-classification>  
        <further-classification edition="201801120260211B">H04B7/02</further-classification>  
        <further-classification edition="200601120260211B">H01P1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炅煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴乾淏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GEONHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炳澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, BYEONGTAEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYUNCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉相珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許準會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUR, JOONHOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耦合器電路，包括：第一變壓器，連接於第一輸入端子與第一輸出端子之間；第一電感器，連接至位於第一輸入端子與第一變壓器之間的第一節點；第一電阻器，連接至第一電感器；第一電容器，連接至第一線圈的相對的兩端部；第二電容器，連接至第二線圈的相對的兩端部；第二變壓器，連接於第二輸出端子與位於第一電感器和第一電阻器之間的第二節點之間，第二變壓器包括各自包括相對的兩端部的第三線圈及第四線圈；第三電容器，連接至第三線圈的相對的兩端部；第四電容器，連接至第四線圈的相對的兩端部；以及第二電感器，連接於第一輸出端子與第二輸出端子之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a coupler circuit including a first transformer connected between a first input terminal and a first output terminal, a first inductor connected to a first node between the first input terminal and the first transformer, a first resistor connected to the first inductor, a first capacitor connected to the opposite ends of the first coil, a second capacitor connected to the opposite ends of the second coil, a second transformer connected between a second output terminal and a second node between the first inductor and the first resistor, the second transformer comprising a third foil and a fourth coil each comprising opposite ends, a third capacitor connected to the opposite ends of the third coil, a fourth capacitor connected to the opposite ends of the fourth coil, and a second inductor connected between the first output terminal and the second output terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:耦合器電路</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">C3:第三電容器</p>  
        <p type="p">C4:第四電容器</p>  
        <p type="p">I1(Z0):第一輸入訊號</p>  
        <p type="p">IT1:第一輸入端子</p>  
        <p type="p">k:耦合係數</p>  
        <p type="p">L1:第一電感器</p>  
        <p type="p">L2:第二電感器</p>  
        <p type="p">Lx:第一線圈電感</p>  
        <p type="p">Ly:第二線圈電感</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">O1(Z1):第一輸出訊號</p>  
        <p type="p">O2(Z1):第二輸出訊號</p>  
        <p type="p">OT1:第一輸出端子</p>  
        <p type="p">OT2:第二輸出端子</p>  
        <p type="p">R1:第一電阻器</p>  
        <p type="p">TF1:第一變壓器</p>  
        <p type="p">TF2:第二變壓器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1126" publication-number="202619844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨裝置</chinese-title>  
        <english-title>POLISHING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260210B">B24B37/015</main-classification>  
        <further-classification edition="200601120260210B">B24B49/14</further-classification>  
        <further-classification edition="200601120260210B">B24B55/02</further-classification>  
        <further-classification edition="200601120260210B">B24B57/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岡亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAOKA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原望</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWABARA, NOZOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康諭基泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本島靖之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOSHIMA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦駿平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, SHUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供能夠藉由使墊溫度快速降低到比常溫低的溫度而精密控制研磨率的研磨裝置。研磨裝置具備：支承研磨墊（3）並能夠旋轉的研磨台（2）、將基板（W）按壓於旋轉的研磨墊（3）的研磨面而研磨基板（W）的研磨頭（1）、測定研磨面的溫度的至少一個墊溫度測定器（10）、調整研磨面的溫度的墊溫度調整裝置（5）及基於由墊溫度測定器（10）測定的研磨面的溫度控制墊溫度調整裝置（5）的動作的控制裝置。墊溫度調整裝置（5）包含向研磨面噴射冷卻劑的至少一個冷卻噴嘴（51）和向研磨面噴射乾氣的至少一個乾氣噴嘴（61）。冷卻劑具有環境溫度以下的沸點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:研磨頭</p>  
        <p type="p">3:研磨墊</p>  
        <p type="p">4:研磨液供給噴嘴</p>  
        <p type="p">10:墊溫度測定器</p>  
        <p type="p">51:冷卻噴嘴</p>  
        <p type="p">61:乾氣噴嘴</p>  
        <p type="p">CP:中心</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1127" publication-number="202619828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射焊接裝置及方法</chinese-title>  
        <english-title>LASER WELDING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260210B">B23K26/323</main-classification>  
        <further-classification edition="201401120260210B">B23K26/06</further-classification>  
        <further-classification edition="201401120260210B">B23K26/20</further-classification>  
        <further-classification edition="201401120260210B">B23K26/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於異質材料焊接的裝置和方法，其中在電池組製造期間使用雷射照射熱和填充材料（焊料或硬焊）將異質材料彼此焊接時，下基材不會損壞。根據示例性實施例的異質材料焊接裝置可包括上基材放置部，配置為在焊接位置配置上基材，下基材放置部，配置為配置下基材使得下基材的焊接位置和上基材的焊接位置重疊以彼此面對，焊接材料注入部，配置為在上基材和下基材之間注入焊接材料，焊接材料由上基材加熱時產生的傳導熱熔化，以及雷射照射部，配置為將雷射光束照射至上基材的頂表面以加熱上基材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an apparatus and method for welding heteromaterials, in which a lower base material is not damaged using laser irradiation heat and filler (solder or brazing) to weld the heteromaterials to each other during manufacturing of a battery pack. An apparatus for welding heteromaterials in accordance with an exemplary embodiment may include an upper base material placement part configured to dispose an upper base material at a welding position, a lower base material placement part configured to dispose the lower base material so that a welding position of the lower base material and a welding position of the upper base material overlap to face each other, a welding material injection part configured to inject a welding material, which is melted by conductive heat generated when the upper base material is heated, between the upper base material and the lower base material, and a laser irradiation part configured to irradiate a laser beam to a top surface of the upper base material so as to heat the upper base material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:上基材</p>  
        <p type="p">200:下基材</p>  
        <p type="p">110、410:熔化</p>  
        <p type="p">300:雷射照射部</p>  
        <p type="p">400:焊接材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1128" publication-number="202620476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於均勻化輻射光束之方法及設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR HOMOGENIZING A BEAM OF RADIATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G02B6/00</main-classification>  
        <further-classification edition="200601120260210B">G02B27/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　弗斯特　彼得　丹尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN VOORST, PETER DANNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於均勻化一輻射光束之一光學配置，其包含：一第一光纖，其用於接收該輻射光束；一第二光纖，其用於輸出一均勻化之輻射光束；其中該第一光纖及該第二光纖兩者經組態以均勻化該輻射光束；及一變換元件，其位於該第一光纖與該第二光纖之間；其中該第二光纖包含一長度，該長度經組態以使得離開該第二光纖之該輻射光束包含一實質上均勻化之空間強度分佈及一實質上均勻化之角強度分佈，兩者均具有至少0.60的一均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an optical arrangement for homogenizing a beam of radiation, comprising: a first fiber for receiving the beam of radiation; a second fiber for outputting a homogenized beam of radiation; wherein both the first fiber and the second fiber are configured to homogenize the beam of radiation; and a transforming element located between the first fiber and the second fiber; wherein the second fiber comprises a length configured such that the beam of radiation exiting the second fiber comprises a substantially homogenized spatial intensity distribution and a substantially homogenized angular intensity distribution, both having a homogeneity of at least 0.60.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">HRD:輻射</p>  
        <p type="p">IOA:改良光學配置</p>  
        <p type="p">MMF1:第一多模光纖</p>  
        <p type="p">MMF2-O:第二多模光纖</p>  
        <p type="p">OL:物鏡/光學透鏡</p>  
        <p type="p">RD:輻射光束</p>  
        <p type="p">TFE:變換元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1129" publication-number="202619716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＣＥＲＥＢＬＯＮ連接酶調節劑與ＢＣＭＡ　ＮＫ細胞銜接子的組合療法</chinese-title>  
        <english-title>CEREBLON LIGASE MODULATOR AND BCMA NK CELL ENGAGER COMBINATION THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">A61K31/454</main-classification>  
        <further-classification edition="200601120260212B">A61K39/395</further-classification>  
        <further-classification edition="200601120260212B">C07K16/28</further-classification>  
        <further-classification edition="200601120260212B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇隆　瑪莉埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRON, MARIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范德維爾德　海爾吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DE VELDE, HELGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維羅內　奧多斯　安吉拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIRONE-ODDOS, ANGELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德容凱雷斯　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESJONQUERES, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種用以下的組合治療癌症（例如，多發性骨髓瘤）之方法：i) 包含第一和第二抗原結合結構域（antigen binding domain，ABD）的多功能結合蛋白，其中該第一ABD特異性結合人類BCMA並且該第二ABD特異性結合人類NKp46；以及ii) cereblon調節劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method of treating cancer (e.g., multiple myeloma) with the combination of i) a multifunctional binding protein comprising a first and a second antigen binding domains (ABDs), wherein the first ABD binds specifically to human BCMA and the second ABD binds specifically to human NKp46; and ii) a cereblon modulating agent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1130" publication-number="202620597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體裝置之基於溫度的效能及可靠性控制</chinese-title>  
        <english-title>TEMPERATURE-BASED PERFORMANCE AND RELIABILITY CONTROL FOR SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260211B">G06F1/3203</main-classification>  
        <further-classification edition="200601120260211B">G01R19/32</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海達琳賈德　莫森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIDARINEJAD, MOHSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米塔爾　阿爾皮特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITTAL, ARPIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了用於半導體裝置之基於溫度的效能及可靠性控制之態樣。舉例而言，一溫度控制單元監測該半導體裝置之一元件之一溫度且維持一先前溫度臨限值。該溫度控制單元調節該元件使得該溫度保持低於該先前溫度臨限值。與該溫度控制單元耦合之一效能區塊將一動態溫度臨限值提供至該溫度控制單元。該動態溫度臨限值可基於該半導體裝置之一最近效能與一基線效能之一比較。該動態溫度臨限值亦基於與該半導體裝置耦合之一電子裝置之一使用歷史。該動態溫度臨限值可致使該溫度控制單元調節該元件之一操作參數以將該元件之溫度降低至低於經判定的溫度臨限值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of temperature-based performance and reliability control for semiconductor devices are disclosed. For example, a temperature control unit monitors a temperature of an element of the semiconductor device and maintains a prior temperature threshold. The temperature control unit throttles the element so that the temperature remains below the prior temperature threshold. A performance block coupled with the temperature control unit provides a dynamic temperature threshold to the temperature control unit. The dynamic temperature threshold may be based on a comparison of a recent performance of the semiconductor device to a baseline performance. The dynamic temperature threshold is also based on a usage history of an electronic device coupled with the semiconductor device. The dynamic temperature threshold may cause the temperature control unit to throttle an operating parameter of the element to reduce the temperature of the element below the determined temperature threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:第一回饋迴路</p>  
        <p type="p">104:元件</p>  
        <p type="p">106:溫度控制單元</p>  
        <p type="p">108:調節</p>  
        <p type="p">110:第二回饋迴路</p>  
        <p type="p">112:效能區塊</p>  
        <p type="p">114:效能最佳化器度量計算器</p>  
        <p type="p">116:效能分析器</p>  
        <p type="p">118:經判定的溫度臨限值</p>  
        <p type="p">120:效能降低度量</p>  
        <p type="p">122-1:第一環形振盪器</p>  
        <p type="p">122-2:第二環形振盪器</p>  
        <p type="p">124:耦合</p>  
        <p type="p">126:耦合</p>  
        <p type="p">128:耦合</p>  
        <p type="p">130:效能目標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1131" publication-number="202620589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉸鏈裝置及使用此鉸鏈裝置的電子機器</chinese-title>  
        <english-title>HINGE DEVICE AND ELECTRONIC EQUIPMENT USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商加藤電機（香港）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEM HONGKONG LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤哲生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田龍介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, RYUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在將電子機器設為折疊狀態或展開狀態時，能夠應對施加在軟性顯示板上的鬆弛或緊繃的鉸鏈裝置及使用此鉸鏈裝置的電子機器。該鉸鏈裝置用於跨越一對殼體的兩表面安裝軟性顯示板而成的電子機器，並可開闔地連接該一對殼體。該鉸鏈裝置設有延伸至該一對殼體其寬度方向兩端部的基座框架，該基座框架具有旋轉滑動機構、旋轉控制機構和同步旋轉機構，設於該基座框架上的一對鉸鏈軸上，其中，該旋轉滑動機構由固定凸輪構件及旋轉凸輪構件構成，該固定凸輪構件以特定間隔分別設置在該基座框架的兩端部側的前部側和後部側，內側設有彎曲導向凸部；該旋轉凸輪構件具有與各該固定凸輪構件嵌合的彎曲導向凹部，並安裝在各該殼體或安裝在各該殼體上的側框架上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a hinge device capable of coping with the slack or tension applied to a flexible display panel when the electronic device is set to a folded state or an unfolded state, and an electronic device using the hinge device. The hinge device is used for an electronic device formed by mounting a flexible display panel across two surfaces of a pair of housings, and can connect the pair of housings in a foldable and unfoldable manner. The hinge device is provided with a base frame extending to both ends of the pair of housings in the width direction, and the base frame has a rotating sliding mechanism, a rotating control mechanism, and a synchronous rotating mechanism, which are arranged on a pair of hinge shafts on the base frame. The rotating sliding mechanism is composed of a fixed cam member and a rotating cam member. The fixed cam member is respectively arranged at a specific interval on the front side and the rear side of the two end sides of the base frame, and a bending guide protrusion is provided on the inner side. The rotating cam member has a bending guide recess engaged with each of the fixed cam members, and is installed on each of the housings or a side frame installed on each of the housings.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:同步第一旋轉凸輪構件</p>  
        <p type="p">14:同步第二旋轉凸輪構件</p>  
        <p type="p">15:同步滑動凸輪構件</p>  
        <p type="p">16:彈性構件</p>  
        <p type="p">17:導向構件</p>  
        <p type="p">19:鎖定構件</p>  
        <p type="p">2、3:側框架</p>  
        <p type="p">21:旋轉支架</p>  
        <p type="p">24:中心板彈簧蓋</p>  
        <p type="p">26:雙重導向構件</p>  
        <p type="p">28:固定構件</p>  
        <p type="p">29:抵接構件</p>  
        <p type="p">30:同步滑動凸輪構件</p>  
        <p type="p">4、5:蓋構件</p>  
        <p type="p">6:中心板</p>  
        <p type="p">7:固定凸輪構件</p>  
        <p type="p">8:旋轉凸輪構件</p>  
        <p type="p">9:支架導向件</p>  
        <p type="p">A:鉸鏈裝置</p>  
        <p type="p">B:筆記型電腦</p>  
        <p type="p">D:旋轉滑動機構</p>  
        <p type="p">E:旋轉控制機構</p>  
        <p type="p">F:同步旋轉機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1132" publication-number="202620269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含穀物稈部之紙漿</chinese-title>  
        <english-title>PAPER PULP COMPRISING CEREAL STRAW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">D21C3/02</main-classification>  
        <further-classification edition="200601120260223B">D21C3/00</further-classification>  
        <further-classification edition="200601120260223B">D21C9/00</further-classification>  
        <further-classification edition="200601120260223B">D21H11/12</further-classification>  
        <further-classification edition="202001120260223B">A24C5/00</further-classification>  
        <further-classification edition="200601120260223B">A24D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商共和北美有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REPUBLIC TECHNOLOGIES (NA) LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博查頓　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOCHATON, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭克　茱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANC, JULIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布爾登　奧雷利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOURDON, AURELIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫羅　吉拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOREAU, GUILLAUME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本說明關於一種用以製造一紙漿之方法，其包含下列步驟：&lt;br/&gt; - 混合(E1)介於20%與70%之間的一重量百分比之穀物稈部(10)與一互補重量百分比之天然纖維或木纖維(20)；&lt;br/&gt; - 在一消化器中燒煮(E2)該混合物；&lt;br/&gt; - 剝解(E3)及清洗(E4)該紙漿；以及&lt;br/&gt; - 在一精煉機堆中精煉(E5)該紙漿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present explanation relates to a process for manufacturing a paper pulp, comprising the following steps:&lt;br/&gt; - mixing (E1) of a percentage by weight of cereal straw (10) between 20% and 70% with a complementary percentage by weight of natural fibre or wood fibre (20);&lt;br/&gt; - cooking (E2) of the mixture in a digester;&lt;br/&gt; - stripping-out (E3) and washing (E4) of the pulp; and&lt;br/&gt; - refining (E5) of the pulp in a refiner stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:穀物稈部</p>  
        <p type="p">20:天然纖維，木纖維</p>  
        <p type="p">E1:混合，混合步驟</p>  
        <p type="p">E2:燒煮，燒煮步驟</p>  
        <p type="p">E3:剝解，剝解步驟</p>  
        <p type="p">E4:清洗，清洗步驟</p>  
        <p type="p">E5:精煉，精煉步驟</p>  
        <p type="p">E41:提取，清洗子步驟</p>  
        <p type="p">E42:引入，清洗子步驟</p>  
        <p type="p">E43:提取，清洗子步驟</p>  
        <p type="p">E44:清洗，清洗子步驟</p>  
        <p type="p">E51:第一精煉步驟</p>  
        <p type="p">E52:第二精煉步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1133" publication-number="202619947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙箱及其胚片</chinese-title>  
        <english-title>CARTON AND BLANK THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B65D71/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商偉斯特洛克包裝系統有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTROCK PACKAGING SYSTEMS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑邁斯特　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUMEISTER, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅茨尤　朱利恩Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERZEAU, JULIEN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海廷格　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETTINGER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之態樣關於一種包裝、一種用於包裝複數個物品（B）之紙箱（90）以及一種用於形成該紙箱（90）之胚片（10）。該紙箱（90）包含複數個板片及鎖定裝置，該複數個板片包括一對板片（12、24），該鎖定裝置用於將該對板片（12、24）中之第一者與該對板片（12、24）中之第二者以面接觸配置固定。該鎖定裝置（L）包含由該對板片（12、24）中之一者提供之用於與由該對板片（12、24）中之另一者提供之第二接合元件（F、F'）接合的第一接合元件（M、M'；M1、M1'；M2、M2'；M3、M3'；M4；M5；M6）。所述第一接合元件（M、M'；M1、M1'；M2、M2'；M3、M3'；M4；M5；M6）包含鉸接連接至該對板片（12、24）中之該一者的陽舌片(male tab)（M、M'；M1、M1'；M2、M2'；M3、M3'；M4；M5；M6）。該陽舌片（M、M'；M1、M1'；M2、M2'；M3、M3'；M4；M5；M6）包含一對相對側邊緣（SE1、SE2），該對相對側邊緣中之至少一者為有齒(toothed)邊緣。第一側邊緣（SE1）界定第一假想線(notional line)（N1、N1&lt;sub&gt;B&lt;/sub&gt;；N3、N3&lt;sub&gt;B&lt;/sub&gt;；N5、N5&lt;sub&gt;B&lt;/sub&gt;；N1'、N1&lt;sub&gt;B&lt;/sub&gt;'；N3'、N3&lt;sub&gt;B&lt;/sub&gt;'；N5'、N5&lt;sub&gt;B&lt;/sub&gt;'）。第二側邊緣（SE2）界定第二假想線（N2、N2&lt;sub&gt;B&lt;/sub&gt;；N4、N4&lt;sub&gt;B&lt;/sub&gt;；N6、N6&lt;sub&gt;B&lt;/sub&gt;；N2'；N4'；N6'）。該第一假想線（N3、N3&lt;sub&gt;B&lt;/sub&gt;；N5、N5&lt;sub&gt;B&lt;/sub&gt;；N3'、N3&lt;sub&gt;B&lt;/sub&gt;'；N5'、N5&lt;sub&gt;B&lt;/sub&gt;'）及該第二假想線（N4、N4&lt;sub&gt;B&lt;/sub&gt;；N6、N6&lt;sub&gt;B&lt;/sub&gt;；N4'；N6'）相對於彼此發散地配置(divergently arranged)。該至少一個有齒邊緣界定複數個鎖定位置或部位，以便促進收納於收納開口中之不同比例之該陽舌片（M、M'；M1、M1'；M2、M2'；M3、M3'；M4；M5；M6）的固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure relate to a package, a carton (90) for packaging a plurality of articles (B), and to a blank (10) for forming the carton (90). The carton (90) comprising a plurality of panels which includes a pair of panels (12, 24) and a locking device for securing a first one of the pair of panels (12, 24) in a face-contacting arrangement with a second one of the pair of panels (12, 24). The locking device (L) comprises a first engaging element (M, M'; M1, M1'; M2, M2'; M3, M3'; M4; M5; M6) provided by one of the pair of panels (12, 24) for engaging with a second engaging element (F, F') provided by the other one of the pair of panels (12, 24). The first engaging elements (M, M'; M1, M1'; M2, M2'; M3, M3'; M4; M5; M6) comprise a male tab (M, M'; M1, M1'; M2, M2'; M3, M3'; M4; M5; M6) hingedly connected to said one of the pair of panels (12, 24). The male tab (M, M'; M1, M1'; M2, M2'; M3, M3'; M4; M5; M6) comprises a pair of opposed side edges (SE1, SE2), at least one of which is a toothed, edge. A first side edge (SE1) defines a first notional line (N1, N1&lt;sub&gt;B&lt;/sub&gt;; N3, N3&lt;sub&gt;B&lt;/sub&gt;; N5, N5&lt;sub&gt;B&lt;/sub&gt;; N1', N1&lt;sub&gt;B&lt;/sub&gt;'; N3', N3&lt;sub&gt;B&lt;/sub&gt;'; N5', N5&lt;sub&gt;B&lt;/sub&gt;'). A second side edge (SE2) defines a second notional line (N2, N2&lt;sub&gt;B&lt;/sub&gt;; N4, N4&lt;sub&gt;B&lt;/sub&gt;; N6, N6&lt;sub&gt;B&lt;/sub&gt;; N2'; N4'; N6'). The first notional line (N3, N3&lt;sub&gt;B&lt;/sub&gt;; N5, N5&lt;sub&gt;B&lt;/sub&gt;; N3', N3&lt;sub&gt;B&lt;/sub&gt;'; N5', N5&lt;sub&gt;B&lt;/sub&gt;') and second notional line (N4, N4&lt;sub&gt;B&lt;/sub&gt;; N6, N6&lt;sub&gt;B&lt;/sub&gt;; N4'; N6') are divergently arranged with respect to each other. The at least one toothed edge defines a plurality of locking positions or locations so as to facilitate securement of differing proportions of the male tab (M, M'; M1, M1'; M2, M2'; M3, M3'; M4; M5; M6) received in the receiving opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:板片</p>  
        <p type="p">16:板片</p>  
        <p type="p">16a:板片</p>  
        <p type="p">18:板片</p>  
        <p type="p">18a:板片</p>  
        <p type="p">18b:板片</p>  
        <p type="p">24:板片</p>  
        <p type="p">28a:板片</p>  
        <p type="p">32a:板片</p>  
        <p type="p">34a:板片</p>  
        <p type="p">90:紙箱/攜具/容器</p>  
        <p type="p">B:物品</p>  
        <p type="p">F':第二接合元件/第一部分/陰舌片/保持舌片</p>  
        <p type="p">H:把手結構</p>  
        <p type="p">M':第一接合元件/陽舌片/第二部分/鎖定舌片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1134" publication-number="202620350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焦爐加熱壁的維修、更換或構造</chinese-title>  
        <english-title>COKE OVEN HEATING WALL REPAIR, REPLACEMENT OR CONSTRUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">F27D1/04</main-classification>  
        <further-classification edition="200601120260202B">F27D1/16</further-classification>  
        <further-classification edition="200601120260202B">F27B13/00</further-classification>  
        <further-classification edition="200601120260202B">C10B29/06</further-classification>  
        <further-classification edition="200601120260202B">F23M5/02</further-classification>  
        <further-classification edition="200601120260202B">C10B29/02</further-classification>  
        <further-classification edition="200601120260202B">E04G23/02</further-classification>  
        <further-classification edition="200601120260202B">E04G21/16</further-classification>  
        <further-classification edition="200601120260202B">E04B2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商保羅伍斯義大利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAUL WURTH ITALIA S. P. A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維歐撒　瑟撒熱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAVIOSA, CESARE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德皮亞　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEL PIA, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡德利尼　亞伯多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARDELLINI, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種焦爐組的加熱壁，焦爐組具有沿縱向方向分佈的多個焦爐室，相鄰的焦爐室由加熱壁分隔開，加熱壁具有沿豎直方向的高度以及橫向於縱向方向延伸的寬度，加熱壁限定沿加熱壁的寬度分佈的多個豎直延伸的煙道。至少一個加熱壁由第一砌塊形成。第一砌塊包括第一磚和第二磚，第一磚和第二磚在寬度方向上錯列，第一磚和第二磚中的每個限定至少一個煙道通道。第一磚和第二磚還在豎直方向上以預定偏移量錯列。形狀配合連接裝置設置在第一砌塊的邊緣處或附近。第二磚具有與第一磚相同的形狀和高度，並通過一個側向側連接到第一磚。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a heating wall of a coke oven battery, which a plurality of coke oven chambers distributed along a longitudinal direction (X), adjacent coke oven chambers being separated by heating walls (10), wherein the heating walls have a height along a vertical direction (Z) and a width (Y) extending transversally to the longitudinal direction, and wherein the heating walls define a plurality of vertically extending flues (16) distributed along the width of the heating wall. At least one heating wall is mainly built from blocks referred to as first blocks (20). Such first block (20) is configured as a pre-formed block including a first brick (22) and a second brick (24), the first and second bricks being staggered in the width direction, each of the first and second bricks defining at least one flue passage (22.1, 24,1). The first and second bricks are further staggered in the vertical direction by a predetermined offset. Form-fit connection means (28.1-28.4) are provided at or near the edges of the first blocks. The first block (20) consists of the first and second bricks (22, 24), the second brick being of same shape and same height as the first brick, and connected thereto by one lateral side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:加熱壁</p>  
        <p type="p">12:推焦側</p>  
        <p type="p">14:焦側</p>  
        <p type="p">20:第一砌塊</p>  
        <p type="p">22:第一磚</p>  
        <p type="p">24:第二磚</p>  
        <p type="p">30:第二砌塊</p>  
        <p type="p">40:第二砌塊</p>  
        <p type="p">50:頂部砌塊</p>  
        <p type="p">62、64、66:接合部</p>  
        <p type="p">H1:高度</p>  
        <p type="p">H2:高度</p>  
        <p type="p">H3:高度</p>  
        <p type="p">H4:高度</p>  
        <p type="p">O:偏移量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1135" publication-number="202619842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光中的壓盤邊緣形狀的控制</chinese-title>  
        <english-title>CONTROL OF PLATEN EDGE-SHAPE IN CHEMICAL MECHANICAL POLISHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260213B">B24B37/005</main-classification>  
        <further-classification edition="201201120260213B">B24B37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努尼佳　史帝文Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUNIGA, STEVEN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯薩米　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURUSAMY, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JEONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處揭露了化學機械拋光設備，包括壓盤，其上表面用於支撐拋光墊，壓盤下方有環形腔室，且藉由足夠可撓性的板與壓盤上表面的部分分開，該板在環形腔室內的壓力變化下能夠彎曲；壓盤擁有通道，該通道流體連接環形腔室與壓盤內的埠；壓力源，連接至該埠以控制環形腔室內的壓力；承載頭，用於固持基板的表面抵靠在拋光墊上；以及馬達，用於產生壓盤與承載頭之間的相對運動，以便對基板上的覆蓋層進行拋光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a chemical mechanical polishing apparatus, including a platen having an upper surface to support a polishing pad, the platen having an annular chamber below and separated from a portion of an upper surface of the platen by a plate that is sufficiently flexible to deflect under a change of a pressure in the annular chamber, the platen having a channel fluidically connecting the annular chamber to a port in the platen; a pressure source coupled to the port to control the pressure in the annular chamber; a carrier head to hold a surface of a substrate against the polishing pad; and a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:系統</p>  
        <p type="p">21:馬達</p>  
        <p type="p">22:驅動軸</p>  
        <p type="p">24:壓盤</p>  
        <p type="p">25:旋轉軸</p>  
        <p type="p">28:上表面</p>  
        <p type="p">30:墊</p>  
        <p type="p">32:外部拋光層</p>  
        <p type="p">34:背襯層</p>  
        <p type="p">36:拋光表面</p>  
        <p type="p">38:拋光液</p>  
        <p type="p">39:拋光液輸送臂</p>  
        <p type="p">50:腔室</p>  
        <p type="p">52:通道</p>  
        <p type="p">54:開口</p>  
        <p type="p">56:壓力源</p>  
        <p type="p">58:上表面</p>  
        <p type="p">59:板</p>  
        <p type="p">60:區域</p>  
        <p type="p">70:承載頭</p>  
        <p type="p">71:軸</p>  
        <p type="p">72:支撐結構</p>  
        <p type="p">73:扣環</p>  
        <p type="p">74:驅動軸</p>  
        <p type="p">76:馬達</p>  
        <p type="p">77:可彎曲膜</p>  
        <p type="p">77a:加壓腔室</p>  
        <p type="p">77b:加壓腔室</p>  
        <p type="p">77c:加壓腔室</p>  
        <p type="p">90:控制器</p>  
        <p type="p">92:感測器</p>  
        <p type="p">A:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1136" publication-number="202620977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插座連接器和插頭連接器</chinese-title>  
        <english-title>RECEPTACLE CONNECTOR AND PLUG CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">H01R13/40</main-classification>  
        <further-classification edition="200601120260210B">H01R13/502</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳德金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DE-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向杲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, GAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種插座連接器，包括絕緣本體及固持於所述絕緣本體內的端子，所述絕緣本體具有兩第一插槽、兩第二插槽和第三插槽，所述第一插槽之間沿第一方向平行排列，且所述第一插槽沿與所述第一方向垂直的第二方向延伸；所述端子包括伸入對應插槽內的接觸部；兩所述第二插槽於所述第一方向上彼此對齊，所述第二插槽於所述第二方向上與相應的第一插槽對齊，且所述第三插槽位於所述第二插槽一側。與先前技術相比，本發明的訊號傳輸部分與電源傳輸部分於第二方向上齊平，且擴容電源傳輸部分，簡化插接介面的同時提高傳輸效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A receptacle connector includes an insulating housing and plural terminals retained in the insulating housing , the insulating housing comprises two first mating slots, two second mating slots and one third mating slot, the two first mating slots are parallel along a first direction and extend along a second direction perpendicular to the first direction. The terminal comprises a contacting portion extending into said mating slots, respectively, the two second mating slots are aligned with each other in the first direction, each of the second mating slots is aligned with a corresponding first mating slot in the second direction, and the third mating slot is located at one side of the two second mating slots. The signal transmitting slot and the power transmitting slot are aligned with each other along a second direction, and the receptacle connector has a extra power transmitting slot, making a simple mating face of the receptacle connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:插座連接器</p>  
        <p type="p">113:第三插槽</p>  
        <p type="p">12:導向孔</p>  
        <p type="p">152:第二安裝部</p>  
        <p type="p">211:接觸部</p>  
        <p type="p">221:接觸臂</p>  
        <p type="p">30:螺栓</p>  
        <p type="p">40:金屬殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1137" publication-number="202621451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同步銷舉升裝置</chinese-title>  
        <english-title>SYNCHRONIZING PIN LIFTING DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/76</main-classification>  
        <further-classification edition="200601120260223B">F15B13/04</further-classification>  
        <further-classification edition="200601120260223B">F15B13/044</further-classification>  
        <further-classification edition="202601120260223B">H10P72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＶＡＴ控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAT HOLDING AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卜杜拉齊茲　卡里姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELAZIZ, KARIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉索　埃馬努埃萊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRASSO, EMANUELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種銷舉升系統(1)，包括至少一第一銷舉升裝置(10)，其中該第一銷舉升裝置(10)包括一第一氣動致動器(11)，該第一氣動致動器(11)具有一第一氣動缸(12)和一可移動地安裝在該第一氣動缸(12)內的第一移動部件(13)。該系統包括一第一控制閥(21)，其連接到該第一氣動致動器(11)和一第一流體供應源，並配置為控制該第一氣動致動器(11)的加壓和/或流體的流出或流入，以提供該第一移動部件(13)的移動；一第一流體感測器(22)，其安排並配置為測量該第一氣動致動器(11)的加壓和/或流體的流出或流入；以及一控制單元(30)，其配置為藉由施加一第一控制訊號來控制該第一控制閥(21)並接收該第一流體感測器(22)的一測量訊號。該控制單元(30)配置為藉由以下方式調整該第一移動部件(13)的移動：提供一參考移動資訊，該參考移動資訊代表將一銷舉升裝置的一移動部件從起始位置移動到終止位置的至少一參考移動時間；藉由向該第一控制閥(21)施加該第一控制訊號，使該第一移動部件(13)從一第一起始位置移動到一第一終止位置；決定一關於該第一移動部件(13)從該第一起始位置移動到該第一終止位置的第一移動資訊；比較該第一移動資訊和該參考移動資訊並得出一第一移動偏差；以及基於該第一移動偏差調整該第一控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a pin lifting system (1), comprising at least a first pin lifting device (10), wherein the first pin lifting device (10) comprises a first pneumatic actuator (11) with a first pneumatic cylinder (12) and a first moving member (13) movably arranged inside of the first pneumatic cylinder (12). The system comprises a first control valve (21) connected to the first pneumatic actuator (11) and to a first fluid supply and configured to control pressurizing of and/or fluid flow out of or into the first pneumatic actuator (11) to provide movement of the first moving member (13), a first fluid sensor (22) arranged and configured to measure pressurization of and/or fluid flow out of or into the first pneumatic actuator (11), and a controlling unit (30) configured to control the first control valve (21) by applying a first controlling signal and to receive a measurement signal of the first fluid sensor (22). The controlling unit (30) is configured to adjust a movement of the first moving member (13) by providing a reference moving information, the reference moving information representing at least a reference duration of moving a moving member of a pin lifting device from a starting position to an end position, providing moving the first moving member (13) from a first starting position to a first end position by applying the first controlling signal to the first control valve (21), determining a first moving information regarding the movement of the first moving member (13) from the first starting position to the first end position, comparing the first moving information and the reference moving information and deriving a first moving deviation, and adjusting the first controlling signal based on the first moving deviation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:銷舉升系統</p>  
        <p type="p">5:基板</p>  
        <p type="p">10:第一銷舉升裝置</p>  
        <p type="p">11:第一氣動致動器</p>  
        <p type="p">12:第一氣動缸</p>  
        <p type="p">13:第一移動部件</p>  
        <p type="p">14:第二腔室</p>  
        <p type="p">15:第一腔室</p>  
        <p type="p">16:第一連桿</p>  
        <p type="p">17:第一安裝座</p>  
        <p type="p">18:第一復位元件</p>  
        <p type="p">19:第一流體通道</p>  
        <p type="p">20:舉升銷</p>  
        <p type="p">20':舉升銷</p>  
        <p type="p">21:第一控制閥</p>  
        <p type="p">22:第一流體感測器</p>  
        <p type="p">23:第二控制閥</p>  
        <p type="p">24:第二流體感測器</p>  
        <p type="p">25:第一硬止點</p>  
        <p type="p">25':第二硬止點</p>  
        <p type="p">30:控制單元</p>  
        <p type="p">40:第二銷舉升裝置</p>  
        <p type="p">41:第二氣動致動器</p>  
        <p type="p">42:第二氣動缸</p>  
        <p type="p">43:第二移動部件</p>  
        <p type="p">44:第三腔室</p>  
        <p type="p">45:第四腔室</p>  
        <p type="p">46:第二連桿</p>  
        <p type="p">47:第二安裝座</p>  
        <p type="p">48:第二復位元件</p>  
        <p type="p">49:第二流體通道</p>  
        <p type="p">M1:第一移動軸</p>  
        <p type="p">M2:第二移動軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1138" publication-number="202620185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C11D7/26</main-classification>  
        <further-classification edition="200601120260223B">C11D7/32</further-classification>  
        <further-classification edition="200601120260223B">C11D7/50</further-classification>  
        <further-classification edition="200601120260223B">B08B3/08</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>十時丈典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTOKI, TAKENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小受敦志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKE, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一態樣中，本發明提供一種能夠抑制產生細碎之暫時固定劑殘渣之半導體基板之製造方法。 &lt;br/&gt;於一態樣中，本發明係關於一種半導體基板之製造方法，其包括下述步驟1及步驟2。 &lt;br/&gt;步驟1：準備接著有膜狀之暫時固定劑之半導體基板之步驟 &lt;br/&gt;步驟2：利用包含二醇醚、烴及胺之洗淨劑將膜狀之暫時固定劑自步驟1中所獲得之半導體基板剝離之步驟</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1139" publication-number="202619868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器手</chinese-title>  
        <english-title>HAND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B25J15/08</main-classification>  
        <further-classification edition="200601120260209B">B25J15/12</further-classification>  
        <further-classification edition="200601120260209B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎本和馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOMOTO, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡朋暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠山善貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">機器手10係具備：複數個指部2，係可沿第一方向X張開閉合；本體3，係支持複數個指部2；繩帶5，係連結於複數個指部2；及開閉致動器6，係拉動繩帶5。繩帶5係以使來自開閉致動器6的張力朝第一方向X之閉合的方向施加給複數個指部2的方式纏繞在複數個指部。開閉致動器6係拉動繩帶5藉此使複數個指部2閉合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The hand (10) comprises a plurality of fingers (2) configured to open and close along a first direction (X); a body (3) that supports the plurality of fingers (2); a string (5) connected to the plurality of fingers (2); and an opening/closing actuator (6) that pulls the string (5). The string (5) is wound around the plurality of fingers (2) such that tension generated by the opening/closing actuator (6) acts on the plurality of fingers (2) in a closing direction along the first direction (X). The opening/closing actuator (6) causes the plurality of fingers (2) to close by pulling the string (5).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器手</p>  
        <p type="p">2A:第一指部</p>  
        <p type="p">2B:第二指部</p>  
        <p type="p">21:第一端部</p>  
        <p type="p">3:本體</p>  
        <p type="p">31b:第二側壁</p>  
        <p type="p">31c:第三側壁</p>  
        <p type="p">31d:第四側壁</p>  
        <p type="p">4:爪部</p>  
        <p type="p">41:爪部本體</p>  
        <p type="p">42:腳部</p>  
        <p type="p">5A:第一繩帶</p>  
        <p type="p">5B:第二繩帶</p>  
        <p type="p">51:第一導件</p>  
        <p type="p">52:第二導件</p>  
        <p type="p">53:第三導件</p>  
        <p type="p">54:第四導件</p>  
        <p type="p">55:第五導件</p>  
        <p type="p">6:共同致動器(開閉致動器、進退致動器)</p>  
        <p type="p">61:馬達</p>  
        <p type="p">62b:卡止部</p>  
        <p type="p">63:殼體</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1140" publication-number="202621146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>消除測量間隙的方法、裝置及系統</chinese-title>  
        <english-title>METHODS, DEVICE AND SYSTEM FOR CANCELLATION OF MEASUREMENT GAP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260210B">H04W36/00</main-classification>  
        <further-classification edition="202301120260210B">H04W72/232</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿瓦丁　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWADIN, MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露消除測量間隙的方法、裝置和系統，可被利用於無線通信技術中，例如5G NR技術。測量間隙消除可包括動態地修改待消除的測量間隙的時序和/或選擇，以能夠增強無線網路裝置的容量增益的方式，同時限制對移動性能的影響。測量間隙消除電路可由網路資源（例如，使用者設備（user equipment，UE）裝置、基地台等）實作，所述網路資源經組態以基於各種條件（例如，測量間隙指示的時序、UE裝置的處理時間等）判定可能為最適合消除的測量間隙，並以可能減少無線通信網路中的延遲並改善無線裝置的整體的使用者體驗（例如，減少資料中斷）的方式，在測量間隙期間啟用傳輸/接收通信（例如，測量間隙消除）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, device and system for cancellation of measurement gap are disclosed may be utilized in wireless communication technologies, such as 5G NR technology. Measurement gap canceling may include dynamically modify the timing and/or selection of measurement gaps to be canceled in a manner that can enhance capacity gains of wireless network devices, while limiting an impact to mobility performance. Measurement gap canceling circuitry may be implemented by a network resource (e.g., user equipment (UE) device, base station, etc.) that is configured to determine a measurement gap that may be optimal for canceling based on various conditions (e.g., timing of measurement gap indication(s), processing time for UE device, etc.), and enable transmission/reception communication during the measurement gaps (e.g., canceling the measurement gap) in a manner that may reduce latency in the wireless communication network and improve the overall user experience (e.g., reducing data interruptions) for wireless devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">705、710、715、720:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1141" publication-number="202620507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置以及光學裝置的控制方法</chinese-title>  
        <english-title>OPTICAL APPARATUS AND CONTROL METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G02B21/24</main-classification>  
        <further-classification edition="200601120260202B">G02B21/06</further-classification>  
        <further-classification edition="200601120260202B">G02B21/08</further-classification>  
        <further-classification edition="200601120260202B">G02B21/26</further-classification>  
        <further-classification edition="202101120260202B">G02B7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴本和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石渡研志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIWATARI, KENSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為不論物鏡的倍率為何皆可有效率地進行物鏡的對焦調整。光源1係出射照明光L1。物鏡5係將照明光L1聚焦至試樣90。光偵測器9及光偵測器10係分別設在相對於試樣90的前焦點位置及後焦點位置，偵測來自試樣90的反射光L2。光偵測器8係偵測經由物鏡5入射的反射光L2。分光鏡3係將反射光L2分離至光偵測器9和光偵測器10以及光偵測器8。對焦控制部11係基於光偵測器9和光偵測器10的偵測結果，執行物鏡5相對於試樣90的對焦調整控制。調整用透鏡7係設在分光鏡3與光偵測器9和光偵測器10之間。透鏡控制部12係將分光鏡3與光偵測器9和光偵測器10之間的光學距離調整至對應於物鏡5之倍率的數值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光源</p>  
        <p type="p">2:分光鏡</p>  
        <p type="p">3:分光鏡</p>  
        <p type="p">4:分光鏡</p>  
        <p type="p">5:物鏡</p>  
        <p type="p">6:透鏡</p>  
        <p type="p">7:調整用透鏡</p>  
        <p type="p">8:光偵測器</p>  
        <p type="p">9:光偵測器</p>  
        <p type="p">10:光偵測器</p>  
        <p type="p">11:對焦控制部</p>  
        <p type="p">12:透鏡控制部</p>  
        <p type="p">90:試樣</p>  
        <p type="p">100:光學裝置</p>  
        <p type="p">CON1:控制訊號</p>  
        <p type="p">CON2:控制訊號</p>  
        <p type="p">DET1:偵測訊號</p>  
        <p type="p">DET2:偵測訊號</p>  
        <p type="p">f1:焦點距離</p>  
        <p type="p">f2:焦點距離</p>  
        <p type="p">f3:焦點距離</p>  
        <p type="p">FP1:焦點</p>  
        <p type="p">FP2:焦點</p>  
        <p type="p">L:光學距離</p>  
        <p type="p">L1:照明光</p>  
        <p type="p">L2:反射光</p>  
        <p type="p">+Z:方向</p>  
        <p type="p">-Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1142" publication-number="202619773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>練習擊打運動的安裝方法及設備</chinese-title>  
        <english-title>INSTALLATION METHOD AND EQUIPMENT FOR PRACTISING STRIKING EXERCISES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A63B69/22</main-classification>  
        <further-classification edition="200601120260202B">A63B69/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商迪卡儂公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECATHLON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡索　克萊蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAZAUX, CLEMENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種在一平面支撐件（1）上安裝用於練習擊打運動的設備的方法，該設備包括一周邊主體（2），該周邊主體圍繞一中心空腔（3）且具有一後表面（4）與一前表面（5），該周邊主體（2）設有一氣密的前壁（15）並具有形成一擊打目標的一區域（15a），該方法包括以下步驟：將該後表面（4）放置抵靠該支撐件（1）；經由一按壓行程將該前壁（15）壓入該中心空腔（3），以從該中心空腔排出空氣；在該按壓行程結束時釋放該壓力；該按壓行程經佈置以確保該設備藉由該後表面（4）對該支撐件的該吸力效應保持在該支撐件（1）上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for installing equipment for practising striking exercises on a flat support (1), said equipment comprising a peripheral body (2) surrounding a central cavity (3) and having a rear face (4) and a front face (5), the peripheral body (2) being equipped with an airtight front wall (15) and having a zone (15a) forming a striking target, said method providing for: placing the rear face (4) against the support (1); pressing on the front wall (15) over a pressing stroke in the central cavity (3) in order to expel air from said central cavity; releasing the pressure at the end of the pressing stroke; said pressing stroke being arranged to ensure the holding of the equipment on the support (1) by the suction effect of the rear face (4) on said support.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支撐件</p>  
        <p type="p">2:周邊主體</p>  
        <p type="p">3:中心空腔</p>  
        <p type="p">4:後表面</p>  
        <p type="p">5:前表面</p>  
        <p type="p">13:墊子</p>  
        <p type="p">14:後壁</p>  
        <p type="p">15:前壁</p>  
        <p type="p">15a:區域</p>  
        <p type="p">2a:氣室</p>  
        <p type="p">A:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1143" publication-number="202621471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基於硬遮罩改質的斜角射束暴露</chinese-title>  
        <english-title>ANGLED BEAM EXPOSURE FOR HARDMASK BASED MODIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W10/00</main-classification>  
        <further-classification edition="202601120260223B">H10P30/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="200601120260223B">C23C16/513</further-classification>  
        <further-classification edition="200601120260223B">C23C16/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　仕昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIHSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　彥典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YEN-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　志方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ERIC CHIH-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴玟俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, MINJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於處理基板的方法包括於設置在處理腔室中的基板夾持具上接收基板，基板包括設置在下方層上的圖案化硬遮罩，圖案化硬遮罩包括特徵部。方法進一步包括在從處理噴嘴發射的處理射束與基板夾持具的法線方向之間形成第一角度，選擇第一角度使得處理射束透過圖案化硬遮罩中相鄰的特徵部被遮蔽而免於植入下方層中，並且以第一角度發射處理射束以沿著圖案化硬遮罩的頂面以及沿著圖案化硬遮罩中特徵部的側壁改質圖案化硬遮罩的材料，以形成經改質硬遮罩。並且，方法進一步包括依據經改質硬遮罩蝕刻下方層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a substrate includes receiving the substrate on a substrate holder disposed in a processing chamber, the substrate including a patterned hardmask disposed over an underlying layer, the patterned hardmask including features. The method further includes forming a first angle between a processing beam emitted from a processing nozzle and a normal direction of the substrate holder, the first angle selected such that the processing beam is shadowed from implanting into the underlying layer by adjacent features in the patterned hardmask, and emitting the processing beam at the first angle to modify a material of the patterned hardmask along a top surface of the patterned hardmask and along a sidewall of features in the patterned hardmask to form a modified hardmask. And the method further includes etching the underlying layer according to the modified hardmask.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:下方層</p>  
        <p type="p">130:介電層</p>  
        <p type="p">140:圖案化硬遮罩</p>  
        <p type="p">160:射束</p>  
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;:第一角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1144" publication-number="202620403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置及檢查方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01M11/00</main-classification>  
        <further-classification edition="200601120251201B">G02B6/12</further-classification>  
        <further-classification edition="200601120251201B">G01N21/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新倉史智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIKURA, FUMINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新垣隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIGAKI, RYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係檢查PIC之檢查裝置，且具備：XY載物台，其載置PIC(Photonic IC(Integrated Circuit)：光子積體電路)；聚光光學系統，其以與XY載物台對向之方式配置，將自PIC輸出之光聚光；強度、波長資訊取得部，其取得由聚光光學系統聚光之光之強度資訊及波長資訊之空間分佈資料；記憶部，其記憶PIC之設計資訊即CAD資料；及電腦，其基於空間分佈資料及CAD資料而產生檢查圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">10:XY載物台(載物台)</p>  
        <p type="p">20:光源</p>  
        <p type="p">30:聚光光學系統</p>  
        <p type="p">31:物鏡</p>  
        <p type="p">32:旋轉器</p>  
        <p type="p">50:強度、波長資訊取得部(第1取得部)</p>  
        <p type="p">60:Z載物台</p>  
        <p type="p">70:電腦(解析部)</p>  
        <p type="p">80:記憶部</p>  
        <p type="p">100:光子積體電路(PIC)</p>  
        <p type="p">108:波導</p>  
        <p type="p">109:波導</p>  
        <p type="p">110:光環共振電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1145" publication-number="202620303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防漏夾鉗緊固件</chinese-title>  
        <english-title>LEAK-RESISTANT CLINCH FASTENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">F16B19/10</main-classification>  
        <further-classification edition="200601120260203B">F16B37/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賓工程工廠公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENN ENGINEERING &amp; MANUFACTURING CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURKE, IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種夾鉗緊固件具有材料位移特徵，諸材料位移特徵在此緊固件與一附接面板之間形成一加長的洩漏路徑，而該洩漏路徑可為自該面板之一側至另一側的潛在流體洩漏路徑。該等材料位移特徵包括一帶窩坑的周邊邊沿，該周邊邊沿係使該附接面板之材料沿著該緊固件之周邊位移且加長該洩漏路徑。使用此等結構，增大的安裝按壓速度在該緊固件與該面板之間形成大氣壓力以上的陷獲的壓縮氣穴，從而提供額外的防漏性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clinch fastener has material displacing features which create a lengthened leak path boundary between the fastener and an attached panel which can be a potential leak path of fluid from one side of the panel to the other. The material displacing features include a dimpled peripheral rim which displaces material of the attached panel along the perimeter of the fastener and lengthens the leak path. An increased installation pressing speed using these structures creates trapped compressed pockets of air above atmospheric pressure between the fastener and the panel providing additional leak resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8:桿</p>  
        <p type="p">9:實施例</p>  
        <p type="p">10:主體</p>  
        <p type="p">11:凸緣</p>  
        <p type="p">12:鋸齒；邊緣</p>  
        <p type="p">13:通孔</p>  
        <p type="p">14:位移部環</p>  
        <p type="p">15:邊沿</p>  
        <p type="p">17:內底部表面</p>  
        <p type="p">20:底切區</p>  
        <p type="p">21:圓緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1146" publication-number="202619945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可選擇的離散長度封套</chinese-title>  
        <english-title>SELECTABLE DISCRETE-LENGTH ENVELOPES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B65D27/18</main-classification>  
        <further-classification edition="200601120260202B">B65D27/10</further-classification>  
        <further-classification edition="200601120260202B">B65D33/22</further-classification>  
        <further-classification edition="200601120260202B">B65D75/30</further-classification>  
        <further-classification edition="200601120260202B">B65B5/02</further-classification>  
        <further-classification edition="200601120260202B">B65B57/00</further-classification>  
        <further-classification edition="200601120260202B">B65B59/00</further-classification>  
        <further-classification edition="201701120260202B">B31B70/64</further-classification>  
        <further-classification edition="201701120260202B">B31B70/62</further-classification>  
        <further-classification edition="201701120260202B">B31B70/10</further-classification>  
        <further-classification edition="201701320260202B">B31B155/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普里吉斯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREGIS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋茨奇　湯瑪斯Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WETSCH, THOMAS D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於形成封套的網材包括接合元件（例如，熱活化材料），接合元件係以延伸跨越至少一個壁的緊密間隔的條帶的形式施加至網材，而使得可以沿著網材在所選擇位置處形成密封件，以允許改變封套的大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Webs for forming envelopes include a bonding element, such as a heat-activatable material, applied in closely-spaced strips that extend across at least one wall the web so that seals can be formed at selected locations along the web to allow the sizes of the envelopes to be varied.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:物品</p>  
        <p type="p">17a:壁間密封件</p>  
        <p type="p">19a:壁間密封件</p>  
        <p type="p">33a:片材</p>  
        <p type="p">34:熱密封材</p>  
        <p type="p">36:輥輪輪</p>  
        <p type="p">38a:條帶</p>  
        <p type="p">40a:條帶</p>  
        <p type="p">40b:條帶</p>  
        <p type="p">240:運送器</p>  
        <p type="p">300:網材</p>  
        <p type="p">301:輥輪</p>  
        <p type="p">302:套袋機器</p>  
        <p type="p">303:前驅器</p>  
        <p type="p">304:封套</p>  
        <p type="p">305:導引器</p>  
        <p type="p">308:導引器</p>  
        <p type="p">309:箭頭</p>  
        <p type="p">310:臂</p>  
        <p type="p">312:切割及密封單元</p>  
        <p type="p">313:主體</p>  
        <p type="p">314:致動器</p>  
        <p type="p">317:輥輪</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:長度</p>  
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:長度</p>  
        <p type="p">T:橫向方向</p>  
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1147" publication-number="202620921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/147</main-classification>  
        <further-classification edition="200601120260223B">H01J37/317</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上英郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種使偏向電場的強度之參差減低的電子零件。 &lt;br/&gt;　　一種電子零件，係包含：電極陣列單元，具備：基板，具有用以供複數個帶電粒子束之各者通過的複數個貫通孔；及複數個電極對，各自被設置於複數個貫通孔內，複數個電極對，係各自具有第1電極與第2電極，第1電極與第2電極，係均包含被配置為包圍對應的貫通孔之中心部的圓弧部，第1電極之端部與第2電極之端部以分別對向的方式配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第1基板</p>  
        <p type="p">10:第1電極</p>  
        <p type="p">10a:圓弧部</p>  
        <p type="p">12:端部</p>  
        <p type="p">14:端部</p>  
        <p type="p">20:第2電極</p>  
        <p type="p">20a:圓弧部</p>  
        <p type="p">22:端部</p>  
        <p type="p">24:端部</p>  
        <p type="p">30:電極對</p>  
        <p type="p">32:電極陣列單元</p>  
        <p type="p">40:絕緣膜</p>  
        <p type="p">80:第1貫通孔</p>  
        <p type="p">80e:中心部</p>  
        <p type="p">100:電子零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1148" publication-number="202621549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128392</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體裝置的連接元件</chinese-title>  
        <english-title>CONNECTING ELEMENT FOR SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W90/20</main-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W70/65</further-classification>  
        <further-classification edition="202601120260223B">H10W40/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏佐　賽普里恩　艾米卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UZOH, CYPRIAN EMEKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種結構。該結構可包括第一處理器晶粒、第二處理器晶粒、第一記憶體單元及連接元件。該第二處理器晶粒可與該第一處理器晶粒側向地間隔開。該第一記憶體單元可垂直地安置於該第一處理器晶粒上方。該連接元件可垂直地安置至該第一處理器晶粒及該第二處理器晶粒。該連接元件可包括電連接該第一處理器晶粒及該第二處理器晶粒之導體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A structure is disclosed. The structure can include a first processor die, a second processor die, a first memory unit, and a connecting element. The second processor die can be laterally spaced from the first processor die. The first memory unit can be disposed vertically above the first processor die. The connecting element can be disposed vertically to the first processor die and the second processor die. The connecting element can include a conductor electrically connecting the first processor die and the second processor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100B:經接合結構</p>  
        <p type="p">102B:連接元件</p>  
        <p type="p">104B1:處理器晶粒</p>  
        <p type="p">104B2:處理器晶粒</p>  
        <p type="p">106B1:記憶體單元</p>  
        <p type="p">106B2:記憶體單元</p>  
        <p type="p">108B1:通孔</p>  
        <p type="p">108B2:通孔</p>  
        <p type="p">110B:基板</p>  
        <p type="p">120B:邏輯</p>  
        <p type="p">122B:導體</p>  
        <p type="p">124B:導體</p>  
        <p type="p">126B:導體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1149" publication-number="202621437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對準器、機器人系統及基板的對準方法</chinese-title>  
        <english-title>ALIGNER, ROBOT SYSTEM, AND SUBSTRATE ALIGNMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="200601120260223B">B25J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村瀬大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURASE, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口侑宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松崎公治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSAKI, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在於提供一種對準器、機器人系統以及基板的對準方法。對準器(5)包括：使基板(9)繞第一軸線(Ox)旋轉的旋轉台(51)；在接收基板的基板接收位置(P1)與將基板載置在旋轉台上的基板載置位置(P2)之間移動的支承面(52a)；使支承面從基板接收位置向基板載置位置移動，並使支承面沿著繞過旋轉台上的基板的第二軌跡(T2)從基板載置位置向基板接收位置移動的支承面驅動部(53)；以及藉由經由旋轉台使基板旋轉，使旋轉台上的基板在旋轉方向(Ar)上對位的旋轉台驅動部(54)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an aligner, a robot system and a substrate alignment method. An aligner (5) includes a turntable (51) that rotates a substrate (9) about a first axis (Ox); a support surface (52a) that moves between a substrate receiving position (P1) where the substrate is received and a substrate placement position (P2) where the substrate is placed on the turntable; a support surface driver (53) that moves the support surface from the substrate receiving position to the substrate placement position and also from the substrate placement position to the substrate receiving position along a second trajectory (T2) that bypasses the substrate on the turntable; and a turntable driver (54) that rotates the substrate via the turntable to align the substrate on the turntable in the rotation direction (Ar).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5L:第一對準器</p>  
        <p type="p">7:臂部</p>  
        <p type="p">9:基板</p>  
        <p type="p">52:支承部</p>  
        <p type="p">52a:支承面</p>  
        <p type="p">Ox:第一軸線</p>  
        <p type="p">P1:基板接收位置</p>  
        <p type="p">P2:基板載置位置</p>  
        <p type="p">Pa:對準用位置</p>  
        <p type="p">T2:第二軌跡</p>  
        <p type="p">△H:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1150" publication-number="202621203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H05K1/09</main-classification>  
        <further-classification edition="200601120260213B">H05K1/11</further-classification>  
        <further-classification edition="200601120260213B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京瓷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOCERA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大村将司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHMURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早野一起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYANO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戸逸朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, ITSUROH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">配線基板具備核心基材、第1配線基材、第2配線基材、第1配線、及第2配線。核心基材具有第1面、及位於與第1面相反之位置之第2面。第1配線基材具有接合於第1面之第3面、及位於與第3面相反之位置之第4面，且含有有機材料。第2配線基材具有接合於第2面之第5面、及位於與第5面相反之位置之第6面，且含有有機材料。第1配線位於第1配線基材上，從第3面向第4面延伸。第2配線位於第2配線基材上，從第5面向第6面延伸。核心基材具備第1核心材料、第2核心材料、第1有機層、第2有機層、至少1個貫通孔、及連接導體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配線基板</p>  
        <p type="p">10:核心基材</p>  
        <p type="p">11:第1核心材料</p>  
        <p type="p">12:第2核心材料</p>  
        <p type="p">13:第1有機層</p>  
        <p type="p">14:第2有機層</p>  
        <p type="p">15:貫通孔</p>  
        <p type="p">16:連接導體</p>  
        <p type="p">17:陶瓷層</p>  
        <p type="p">18:有機樹脂</p>  
        <p type="p">19:通孔導體</p>  
        <p type="p">20:焊盤</p>  
        <p type="p">21:焊盤</p>  
        <p type="p">22:有機樹脂</p>  
        <p type="p">40:第1配線基材</p>  
        <p type="p">41:有機樹脂層</p>  
        <p type="p">50:第2配線基材</p>  
        <p type="p">51:有機樹脂層</p>  
        <p type="p">60:第1配線</p>  
        <p type="p">61:通孔</p>  
        <p type="p">62:配線層</p>  
        <p type="p">70:第2配線</p>  
        <p type="p">71:通孔</p>  
        <p type="p">72:配線層</p>  
        <p type="p">101:第1面</p>  
        <p type="p">102:第2面</p>  
        <p type="p">103:第3面</p>  
        <p type="p">104:第4面</p>  
        <p type="p">105:第5面</p>  
        <p type="p">106:第6面</p>  
        <p type="p">107:第7面</p>  
        <p type="p">108:第8面</p>  
        <p type="p">109:第9面</p>  
        <p type="p">110:第10面</p>  
        <p type="p">111:第11面</p>  
        <p type="p">112:第12面</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1151" publication-number="202621438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>精密元件定位之裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR PRECISION COMPONENT POSITIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/50</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="200601120260223B">B81C1/00</further-classification>  
        <further-classification edition="200601120260223B">G05B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商桑特拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANGTERA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　泰然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種致動器平台，用於精確定位元件，包括：一基底層，其表面定義了一個垂直於表面的z軸；一組電流體傳輸基板，其設定在基底層上；一控制埠，其耦接電流體傳輸基板中的多組電極，用於測量載體層相對於基底層的傾斜度並改變載體層的傾斜度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An actuator stage, for precision positioning of a component, includes a base layer having a surface defining a z-axis normal to the surface; a set of electro-fluidic transport substrates disposed on the base layer, and a control port, coupled to a plurality of sets of electrodes in each of the electro-fluidic transport substrates, configured to measure a tilt of a carrier layer relative to the base layer and change the tilt of the carrier layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:致動器平台</p>  
        <p type="p">102:x/y線性平台</p>  
        <p type="p">103:基底元件</p>  
        <p type="p">104:旋轉平台</p>  
        <p type="p">105:處理頭/晶粒處理頭/晶粒附著頭/頭部</p>  
        <p type="p">106:晶粒/元件晶粒/半導體晶粒</p>  
        <p type="p">107:真空管</p>  
        <p type="p">108:控制盒</p>  
        <p type="p">109:基板</p>  
        <p type="p">111:安裝板</p>  
        <p type="p">112:核心</p>  
        <p type="p">131:x/y定子層/定子層</p>  
        <p type="p">132:定子層</p>  
        <p type="p">133:x/y平移層/平移層</p>  
        <p type="p">134:旋轉層</p>  
        <p type="p">140:槽</p>  
        <p type="p">141:球軸承</p>  
        <p type="p">142:凸緣</p>  
        <p type="p">143:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1152" publication-number="202620261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高強度紅外線吸收性滌綸紗線及其製備方法</chinese-title>  
        <english-title>INFRARED ABSORBING POLYESTER YARN WITH HIGH STRENGTH AND METHOD OF PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">D01F1/10</main-classification>  
        <further-classification edition="200601120250901B">D01F6/62</further-classification>  
        <further-classification edition="200601120250901B">D02G3/02</further-classification>  
        <further-classification edition="200601120250901B">D02G3/44</further-classification>  
        <further-classification edition="200601120250901B">B60R22/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商高勝曉星高新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HS HYOSUNG ADVANCED MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李學俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAKJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金聖柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尙佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁一元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, IL WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及高強度紅外線吸收性滌綸紗線及其製備方法，更詳細地，涉及用於産業用帶狀織物、安全帶、繩索、織物等時，因紅外線吸收性能而具有使用紅外線攝像機拍攝時示出有別於普通紗線的特性的高強度紅外線吸收性滌綸紗線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a high-strength infrared-absorbing polyester yarn and a method of preparing the same. More particularly, it relates to a high-strength infrared-absorbing polyester yarn having a characteristic that makes it appear to be distinguished from general yarn when photographed with an infrared camera due to its infrared absorption performance when used in industrial webbing, safety belts, ropes, fabrics, etc.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1153" publication-number="202621196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">H05H1/46</main-classification>  
        <further-classification edition="200601120260206B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩本亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMOTO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中基裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, MOTOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電漿處理裝置，能夠在電漿產生以外的用途上不會積極導致微波能量的損失的情況下，在寬範圍的條件下產生軸對稱的電場分佈，可以實現均勻處理。該電漿處理裝置具備：隔板極化器，其將透過循環器傳播的微波向處理室傳播；循環器的一個端口分別連接至隔板極化器的一個端口和隔板極化器的另一個端口，循環器的另一個端口連接至高頻電源，隔板極化器的一個端口是將傳播的微波轉換成右旋圓偏振波的端口，隔板極化器的另一個端口是將傳播的微波轉換成左旋圓偏振波的端口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:模式轉換器</p>  
        <p type="p">12:循環器</p>  
        <p type="p">13a,13b:E角部</p>  
        <p type="p">14:E角部</p>  
        <p type="p">15:隔板</p>  
        <p type="p">16:隔板極化器</p>  
        <p type="p">20:開口部</p>  
        <p type="p">21:開口部</p>  
        <p type="p">22:端口</p>  
        <p type="p">23:端口</p>  
        <p type="p">24:端口</p>  
        <p type="p">25:端口</p>  
        <p type="p">FW:前進波</p>  
        <p type="p">RW:反射波</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1154" publication-number="202619820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合被覆軟磁性金屬粉末及其製造方法</chinese-title>  
        <english-title>COMPOSITE-COATED SOFT MAGNETIC POWDER AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260223B">B22F1/00</main-classification>  
        <further-classification edition="202201120260223B">B22F1/05</further-classification>  
        <further-classification edition="202201120260223B">B22F1/102</further-classification>  
        <further-classification edition="202201120260223B">B22F1/16</further-classification>  
        <further-classification edition="200601120260223B">H01F1/24</further-classification>  
        <further-classification edition="200601120260223B">H01F1/26</further-classification>  
        <further-classification edition="201101120260223B">B82Y25/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商同和電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田英史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, HIDEFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊達裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATE, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種藉由組合氧化矽被覆層與含有有機物質的矽化合物的被覆層，不使透磁率降低且壓粉體之絕緣性優良的複合被覆軟磁性金屬粉末及其製造方法。 &lt;br/&gt;上述課題之解決手段為藉由在含有20質量%以上的鐵的軟磁性金屬粒子的表面，形成設有平均膜厚0.1nm以上20nm以下的氧化矽被覆層的第一層，與碳數8以上20以下的直鏈烷基鍵結的矽經矽氧烷鍵結的結構之含矽被覆層的第二層的複合被覆，可得到不使透磁率降低且壓粉體的絕緣性優良的複合被覆軟磁性金屬粉末。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a composite-coated soft magnetic metal powder that has excellent insulating properties in a compacted powder form without causing a decrease in magnetic permeability by combining a silicon oxide coating layer with a coating layer of a silicon compound containing an organic substance, and a method for producing the same. As a solution, by forming a composite coating on the surface of soft magnetic metal particles containing 20% by mass or more of iron, the composite coating comprises a first layer of silicon oxide coating layer with an average thickness of 0.1 nm to 20 nm, and a second layer of silicon-containing coating layer having a structure in which silicon bonded to a linear alkyl group having 8 to 20 carbon atoms is siloxane-bonded, it is possible to obtain a composite-coated soft magnetic metal powder that has excellent insulating properties in the compacted powder without reducing magnetic permeability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1155" publication-number="202620806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用聲學透鏡的可撓性聲學感測器系統</chinese-title>  
        <english-title>FLEXIBLE ACOUSTIC SENSOR SYSTEMS USING AN ACOUSTIC LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260210B">G06V40/13</main-classification>  
        <further-classification edition="200601120260210B">G01S7/52</further-classification>  
        <further-classification edition="200601120260210B">G01S15/89</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特洛夫曼　潔西卡劉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROHMANN, JESSICA LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘查瓦赫　赫希凱什維傑庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANCHAWAGH, HRISHIKESH VIJAYKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示使用聲學透鏡的可撓性聲學感測器系統。在一些實施例中，一種設備可包括：一壓板，其具有與該壓板之一表面相關聯的一成像部分；一可撓性基材，其包括一聲學感測元件；及一聲學透鏡，其設置於該壓板與該可撓性基材之間，該聲學透鏡具有一曲率，該曲率經組態以擴大自該聲學感測元件發射的一或多個聲學信號的一傳播角度範圍，使得與該成像部分相關聯的一區域大於與該聲學感測元件相關聯的一區域；其中該可撓性基材經建構以適形於該聲學透鏡的該曲率。在一些實施方案中，該壓板可包括一彎曲壓板，其具有經組態以接觸該使用者之該身體部位的一彎曲表面；且該可撓性基材可經建構以適形於該彎曲壓板的一曲率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Flexible acoustic sensor systems using an acoustic lens are disclosed. In some embodiments, an apparatus may include: a platen having an imaging portion associated with a surface of the platen; a flexible substrate including an acoustic sensing element; and an acoustic lens disposed between the platen and the flexible substrate, the acoustic lens having a curvature configured to expand a propagation angle range of one or more acoustic signals emitted from the acoustic sensing element such that an area associated with the imaging portion is larger than an area associated with the acoustic sensing element; wherein the flexible substrate is constructed to conform to the curvature of the acoustic lens. In some implementations, the platen may include a curved platen having a curved surface configured to contact the body part of the user; and the flexible substrate may be constructed to conform to a curvature of the curved platen.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:可撓性聲學感測器系統</p>  
        <p type="p">901:手指</p>  
        <p type="p">902:感測元件</p>  
        <p type="p">903:彎曲顯示元件</p>  
        <p type="p">904:基材</p>  
        <p type="p">907:聲學信號</p>  
        <p type="p">908:彎曲壓板</p>  
        <p type="p">912:被動組件</p>  
        <p type="p">914:控制系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1156" publication-number="202621476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合的鉬襯層及鎢填充</chinese-title>  
        <english-title>INTEGRATED MOLYBDENUM LINER AND TUNGSTEN FILL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="200601120260223B">C23C16/02</further-classification>  
        <further-classification edition="200601120260223B">C23C16/14</further-classification>  
        <further-classification edition="200601120260223B">C23C16/54</further-classification>  
        <further-classification edition="200601120260223B">C23C16/56</further-classification>  
        <further-classification edition="202601120260223B">H10P14/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼迪亞　大衛　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANDIA, DAVID JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝曜聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德馬科　尼可拉斯　弗朗西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMARCO, NICHOLAS FRANCIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提出利用鎢（W）以填充特徵部之方法，可用於邏輯及記憶體應用。可沉積鉬（Mo）膜以襯著半導體基板特徵部，例如介層窗及溝槽。接著沉積鎢在鉬襯墊上做為主要導體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods of filling features with tungsten (W) that may be used for logic and memory applications. Molybdenum (Mo) films may be deposited to line semiconductor substrate features such as vias and trenches. Tungsten is then deposited on the molybdenum liner as the main conductor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401-411:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1157" publication-number="202621347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於聲學感測器應用的壓電材料及相關設備</chinese-title>  
        <english-title>PIEZOELECTRIC MATERIALS AND RELATED DEVICES FOR ACOUSTIC SENSOR APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260209B">H10N30/853</main-classification>  
        <further-classification edition="202301120260209B">H10N30/30</further-classification>  
        <further-classification edition="200601120260209B">B81B7/02</further-classification>  
        <further-classification edition="200601120260209B">G01H11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科恩布魯斯　莫迪凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORNBLUTH, MORDECHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈帕蘭　桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPALAN, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘特爾　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANTEL, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種微機電系統(MEMS)設備，其包含第一電極層、氮化鋁基壓電層及第二電極層。該氮化鋁基壓電層包含式Al&lt;sub&gt;x&lt;/sub&gt;Sc&lt;sub&gt;y&lt;/sub&gt;Yb&lt;sub&gt;z&lt;/sub&gt;N之壓電材料，其中x + y + z = 1。本發明亦揭露包含該壓電材料之聲學組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are a microelectromechanical system (MEMS) devices comprising a first electrode layer, an aluminum nitride based piezoelectric layer, and a second electrode layer. The aluminum nitride based piezoelectric layer comprises a piezoelectric material of formula Al&lt;sub&gt;x&lt;/sub&gt;Sc&lt;sub&gt;y&lt;/sub&gt;Yb&lt;sub&gt;z&lt;/sub&gt;N, wherein x + y + z = 1. Also disclosed are acoustic components comprising the piezoelectric material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:微機電系統(MEMS)設備</p>  
        <p type="p">100:基板</p>  
        <p type="p">200A:第一電極層</p>  
        <p type="p">200B:第二電極層</p>  
        <p type="p">300:壓電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1158" publication-number="202619781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128782</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可替換筒之飲用水水壺及分配器</chinese-title>  
        <english-title>DRINKING WATER PITCHER AND DISPENSER WITH INTERCHANGEABLE CARTRIDGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B01D35/30</main-classification>  
        <further-classification edition="202301120260209B">C02F1/00</further-classification>  
        <further-classification edition="202301120260209B">C02F1/28</further-classification>  
        <further-classification edition="200601120260209B">B01D24/48</further-classification>  
        <further-classification edition="200601120260209B">B01D24/12</further-classification>  
        <further-classification edition="200601120260209B">B01D61/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商庫利根國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CULLIGAN INTERNATIONAL COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威金斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIGGINS, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西格爾　布列塔尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEGLE, BRITTANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩特納　鮑勃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETNER, BOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內利　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINELLI, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡塔爾迪　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATARDI, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史雀奈德溫德　泰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDEWEND, TEDD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅特　斯科特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROTE, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅爾弗斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROLFS, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　傑克森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, JACKSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾格　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIGER, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普林奇皮　尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRINCIPI, NICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李商益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG IK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫赫　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUH, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水處理系統包括：容器（12），界定內部且具有上緣（16）；貯槽（14），可拆卸地插入內部且位於上緣，貯槽界定筒座（18），筒座（18）包括多個孔（20）與螺旋螺紋（22）相通及環形平台（24）垂直地依附於螺紋；濾筒（10），包括蓋（28）與集水主體（30）相關聯且具有濾材（42）在集水主體內，蓋具有多個銷（48）徑向向外突出且被構造及安排用於接合孔與螺旋螺紋；環形密封件（50），被放置在集水主體外部且位於蓋下方並保持距離。濾筒及筒座被配置為當蓋銷接合螺旋螺紋時，當蓋在螺紋中達到完全接合位置時，密封件被緊壓在環形平台上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water treatment system includes a container (12) defining an interior and having an upper edge (16), a reservoir (14) removably insertable into the interior and located upon the upper edge, the reservoir defining a cartridge seat (18) including a plurality of holes (20) in communication with a helical thread (22), and an annular landing (24) vertically depending from the thread, a filter cartridge (10) including a cap (28) associated with a sump body (30) and having a filter media (42) in the sump body, the cap having a plurality of radially outwardly projecting pins (48) constructed and arranged for engaging the holes and the helical thread, an annular seal (50) disposed externally on the sump body and spaced below the cap. The filter cartridge and the cartridge seat are configured so that upon the cap pins engaging the helical thread, upon reaching a fully engaged position of the cap in the thread, the seal is compressed against the annular landing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:濾筒</p>  
        <p type="p">28:蓋</p>  
        <p type="p">30:集水主體</p>  
        <p type="p">32:壁</p>  
        <p type="p">34:外部</p>  
        <p type="p">36:底部</p>  
        <p type="p">40:內部腔室</p>  
        <p type="p">44:裙部</p>  
        <p type="p">46:蓋上表面</p>  
        <p type="p">48:銷</p>  
        <p type="p">50:環形密封件</p>  
        <p type="p">52:內環</p>  
        <p type="p">56:網篩</p>  
        <p type="p">58:中心凸台</p>  
        <p type="p">60:排氣口</p>  
        <p type="p">62:握持突片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1159" publication-number="202620301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>林業、樹藝及園藝用伸縮桿段連接器</chinese-title>  
        <english-title>TELESCOPIC POLE SEGMENT COUPLER FOR FORESTRY, ARBORIST AND HORTICULTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">F16B7/04</main-classification>  
        <further-classification edition="200601120260210B">F16B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商百齡國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARNEL INTERNATIONAL, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾森　林Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NELSON, LINN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴勒　卡爾Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZELLER, KARL H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡書慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳嘉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於伸縮桿段的連接器，具有低外型的鎖定機構致動器，能提供雙重鎖定功能，以減少與樹枝的接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coupler for telescopic pole segments has low profile locking mechanism actuators for providing a double locking function that reduces engagement with branches.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:第一桿段</p>  
        <p type="p">34:第二桿段</p>  
        <p type="p">36:箭頭</p>  
        <p type="p">38:鎖定/夾緊連接機構</p>  
        <p type="p">39:插銷</p>  
        <p type="p">40:下部</p>  
        <p type="p">41:凸片構件</p>  
        <p type="p">42:螺栓</p>  
        <p type="p">44:螺栓</p>  
        <p type="p">46:上部</p>  
        <p type="p">48:凸輪式鎖定機構</p>  
        <p type="p">50:插銷致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1160" publication-number="202620378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃板之平坦度測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G01B21/30</main-classification>  
        <further-classification edition="200601120260209B">G01B5/00</further-classification>  
        <further-classification edition="200601120260209B">B25B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨永尚宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMINAGA, NAOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有田祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>爪丸昂葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUMEMARU, KOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使為較薄之玻璃板，亦可高精度地測定平坦度的玻璃板之平坦度測定方法。 &lt;br/&gt;本發明係一種測定玻璃板G之平坦度之玻璃板G之平坦度測定方法，係使玻璃板G彎曲為凸出或凹陷之弧狀而配置，使測定裝置10之觸針13接觸玻璃板G之表面，使玻璃板G及觸針13向與玻璃板G之彎曲方向Y交叉，且沿著玻璃板G之主面之測定方向X相對移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測定裝置</p>  
        <p type="p">11:測頭</p>  
        <p type="p">13:觸針</p>  
        <p type="p">20:治具</p>  
        <p type="p">21:彎曲部</p>  
        <p type="p">23:支持構件</p>  
        <p type="p">25:夾具</p>  
        <p type="p">27:基座</p>  
        <p type="p">G:玻璃板</p>  
        <p type="p">Ga:側緣部</p>  
        <p type="p">Gb:端緣部</p>  
        <p type="p">Y:彎曲方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1161" publication-number="202619948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多袋冷凍容器</chinese-title>  
        <english-title>MULTIPLE BAG FREEZING CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B65D81/18</main-classification>  
        <further-classification edition="200601120260209B">B65D25/20</further-classification>  
        <further-classification edition="202301120260209B">A61J1/16</further-classification>  
        <further-classification edition="200601120260209B">A61B10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拉尼斯　特洛伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALANIS, TROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希多　羅伯特　麥可　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHYDO, ROBERT MICHAEL JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮博迪　雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEABODY, JACOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉安納里斯　傑西　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEANNARIS, JESSIE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於諸如生物製程袋之複數個袋之容器包含經構形以直接接觸配置於一第一層中之第一複數個袋之一第一容器段及經構形以附接至該第一容器段之一第二容器段。該第二容器段經構形以直接接觸配置於一第二層中之第二複數個袋。該容器包含一壓縮層，其經構形以定位於該第一複數個袋與該第二複數個袋之間，使得當該第一容器段附接至該第二容器段時，該第一複數個袋壓靠該第一容器段且該第二複數個袋壓靠該第二容器段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Containers for a plurality of bags, such as bioprocess bags, include a first container segment configured to directly contact a first plurality of bags arranged in a first layer and a second container segment configured to be attached to the first container segment. The second container segment is configured to contact a second plurality of bags arranged in a second layer. The container includes a compression layer configured to be positioned between the first plurality of bags and the second plurality of bags such that the first plurality of bags are pressed against the first container segment and the second plurality of bags are pressed against the second container segment when the first container segment is attached to the second container segment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:容器</p>  
        <p type="p">102:第一段</p>  
        <p type="p">104:第二段</p>  
        <p type="p">106:壓縮層</p>  
        <p type="p">108:第一複數個袋</p>  
        <p type="p">110:第二複數個袋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1162" publication-number="202619668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔模組以及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">A47L11/40</main-classification>  
        <further-classification edition="200601120260203B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種清潔模組以及清潔設備。清潔模組包括清潔件、執行件和第一驅動組件，執行件與清潔件傳動連接，第一驅動組件用於驅動所述執行件升降，以使所述清潔件在抬升狀態、第一清潔狀態以及第二清潔狀態之間切換。當所述清潔件處於抬升狀態，所述清潔件與地面分離。當所述清潔件處於第一清潔狀態，所述清潔件與地面接觸。當所述清潔件處於第二清潔狀態，所述清潔件與地面接觸且相比於第一清潔狀態對地面的下壓力更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:清潔模組</p>  
        <p type="p">100:清潔件</p>  
        <p type="p">310:第二動力元件</p>  
        <p type="p">410:第一動力元件</p>  
        <p type="p">500:殼體</p>  
        <p type="p">510:第一殼體</p>  
        <p type="p">520:第二殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1163" publication-number="202621488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維積體電路、電子系統、及製造三維積體電路的方法</chinese-title>  
        <english-title>THREE-DIMENSIONAL INTEGRATED CIRCUITS, ELECTRONIC SYSTEMS, AND METHODS OF FABRICATING A THREE-DIMENSIONAL INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W29/00</main-classification>  
        <further-classification edition="202601120260223B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔哲生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂理豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, LIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白宗植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAEK, JONG SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林克翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KO HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宜誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維積體電路包含一第一微電子裝置結構，該第一微電子裝置結構包含第一導電墊、一第一介電材料及第一多材料導電墊。該等第一多材料導電墊包含一第一導電材料及一第二導電材料。該三維積體電路進一步包含一第二微電子裝置結構，該第二微電子裝置結構包含第二導電墊及一第二介電材料。該第一微電子裝置結構之該等第一導電墊及該等第一多材料導電墊接合至該第二微電子裝置結構之該等第二導電墊，且該第一微電子裝置結構之該第一介電材料接合至該第二微電子裝置結構之該第二介電材料。亦揭示製造一三維積體電路之相關電子系統及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional integrated circuit includes a first microelectronic device structure including first conductive pads, a first dielectric material, and first multi-material conductive pads. The first multi-material conductive pads include a first conductive material and a second conductive material. The three-dimensional integrated circuit further includes a second microelectronic device structure including second conductive pads and a second dielectric material. The first conductive pads and the first multi-material conductive pads of the first microelectronic device structure are bonded to the second conductive pads of the second microelectronic device structure, and the first dielectric material of the first microelectronic device structure is bonded to the second dielectric material of the second microelectronic device structure. Related electronic system and methods of fabricating a three-dimensional integrated circuit are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102a:第一晶圓或晶片</p>  
        <p type="p">102b:第二晶圓或晶片</p>  
        <p type="p">104a1至104d1:第一接合墊</p>  
        <p type="p">104a2至104d2:第二接合墊</p>  
        <p type="p">118a:第一介電材料</p>  
        <p type="p">118b:第二介電材料</p>  
        <p type="p">132b至132d:互連件</p>  
        <p type="p">134a:經接合之多材料導電墊或「樑」</p>  
        <p type="p">134e:經接合之多材料導電墊或「樑」</p>  
        <p type="p">150a:第一微電子裝置結構</p>  
        <p type="p">150b:第二微電子裝置結構</p>  
        <p type="p">160:三維積體電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1164" publication-number="202620505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統及相機模組</chinese-title>  
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G02B15/14</main-classification>  
        <further-classification edition="200601120260210B">G02B9/62</further-classification>  
        <further-classification edition="200601120260210B">G02B9/64</further-classification>  
        <further-classification edition="200601120260210B">G02B13/10</further-classification>  
        <further-classification edition="200601120260210B">G02B1/04</further-classification>  
        <further-classification edition="200601120260210B">G02B26/08</further-classification>  
        <further-classification edition="200601120260210B">G02B13/00</further-classification>  
        <further-classification edition="202301120260210B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申斗植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIN, DOO SHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例中揭露之光學系統包括：一第一反射構件；一第二反射構件，其與該第一反射構件間隔開；一第一透鏡群組，其具有安置在該第一反射構件與一物體之間且沿著一第一光軸安置之第一及第二透鏡；以及一第二透鏡群組，其具有安置在該第一反射構件與該第二反射構件之間且沿著不同於該第一光軸之一第二光軸序列對準之複數個透鏡，其中最接近該物體之該第一透鏡具有正光焦度，該第一及第二透鏡之物體側表面在該第一光軸上具有一凸形形狀，該第二透鏡群組中之透鏡之數目可為該第一透鏡群組中之透鏡數目之至少兩倍，面對該第一反射構件之該出射表面之一透鏡具有一凸形形狀之一物體側表面，且在該第二透鏡群組中之該等透鏡當中，最接近該第二反射構件之該透鏡為第n透鏡，其中n為6或更多，該第一透鏡可具有正光焦度，且該第二透鏡可具有負光焦度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The optical system disclosed in the embodiment of the invention includes: a first reflective member; a second reflective member spaced apart from the first reflective member; a first lens group having first and second lenses disposed between the first reflective member and an object and disposed along a first optical axis; and a second lens group having a plurality of lenses disposed between the first and second reflective members and sequentially aligned along a second optical axis different from the first optical axis, wherein the first lens closest to the object has positive power, object-side surfaces of the first and second lenses have a convex shape on the first optical axis, the number of lenses in the second lens group is at least twice the number of lenses in the first lens group, a lens facing the exit surface of the first reflective member has an object-side surface of a convex shape, and among the lenses in the second lens group, the lens closest to the second reflective member is the n-th lens, where n is 6 or more, the first lens may have positive power, and the second lens may have negative power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一透鏡</p>  
        <p type="p">102:第二透鏡</p>  
        <p type="p">103:第三透鏡</p>  
        <p type="p">104:第四透鏡</p>  
        <p type="p">105:第五透鏡</p>  
        <p type="p">106:最後透鏡</p>  
        <p type="p">107:第七透鏡</p>  
        <p type="p">190:影像感測器</p>  
        <p type="p">192:光學濾波器</p>  
        <p type="p">1000:光學系統</p>  
        <p type="p">CT1:中心厚度</p>  
        <p type="p">CT3:中心厚度</p>  
        <p type="p">D1:距離</p>  
        <p type="p">D2:距離</p>  
        <p type="p">imgH:對角長度</p>  
        <p type="p">LG1:第一透鏡群組</p>  
        <p type="p">LG2:第二透鏡群組</p>  
        <p type="p">MG1:中心距離</p>  
        <p type="p">OA:光軸、第二光軸</p>  
        <p type="p">OA1:第一光軸、第二光軸</p>  
        <p type="p">OA2:第二光軸、第二光軸方向</p>  
        <p type="p">P1:第一反射構件</p>  
        <p type="p">P2:第二反射構件</p>  
        <p type="p">PR1:反射表面</p>  
        <p type="p">PR2:反射表面</p>  
        <p type="p">PS1:出射表面</p>  
        <p type="p">PS2:出射表面</p>  
        <p type="p">PS3:入射表面</p>  
        <p type="p">PS4:出射表面</p>  
        <p type="p">S1:第一表面、物體側表面、物體側第一表面、透鏡表面</p>  
        <p type="p">S2:感測器側第二表面、第二表面、透鏡表面</p>  
        <p type="p">S3:第三表面、物體側第三表面、透鏡表面</p>  
        <p type="p">S4:感測器側第四表面、第四表面、透鏡表面</p>  
        <p type="p">S5:第五表面、物體側第五表面、透鏡表面</p>  
        <p type="p">S6:感測器側第六表面、第六表面、透鏡表面</p>  
        <p type="p">S7:物體側第七表面、第七表面、透鏡表面</p>  
        <p type="p">S8:感測器側第八表面、第八表面、透鏡表面</p>  
        <p type="p">S9:物體側第九表面、第九表面、透鏡表面</p>  
        <p type="p">S10:感測器側第十表面、第十表面、感測器側表面、透鏡表面</p>  
        <p type="p">S11:物體側第十一表面、第十一表面、透鏡表面</p>  
        <p type="p">S12:感測器側第十二表面、第十二表面、感測器側表面、透鏡表面</p>  
        <p type="p">S13:物體側第十三表面、第十三表面、透鏡表面</p>  
        <p type="p">S14:感測器側第十四表面、第十四表面、透鏡表面</p>  
        <p type="p">T1:第一光軸距離</p>  
        <p type="p">T2:第二光軸距離</p>  
        <p type="p">T3:第三光軸距離</p>  
        <p type="p">TD1:光軸距離、第一光軸距離</p>  
        <p type="p">TD2:距離、第二光軸距離、光軸距離</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1165" publication-number="202620506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統及相機模組</chinese-title>  
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02B15/14</main-classification>  
        <further-classification edition="200601120260211B">G02B13/00</further-classification>  
        <further-classification edition="200601120260211B">G02B9/62</further-classification>  
        <further-classification edition="200601120260211B">G02B9/64</further-classification>  
        <further-classification edition="200601120260211B">G02B1/04</further-classification>  
        <further-classification edition="200601120260211B">G02B3/00</further-classification>  
        <further-classification edition="202301120260211B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申斗植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIN, DOO SHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例中所揭露之光學系統包含：一第一反射構件；一第二反射構件，其與該第一反射構件間隔開；一第一透鏡群組，其具有安置在該第一反射構件與一物體之間且沿著一第一光軸安置之一第一透鏡；以及一第二透鏡群組，其具有安置在該第一反射構件與該第二反射構件之間且沿著不同於該第一光軸之一第二光軸序列對準之複數個透鏡，其中最接近該物體之該第一透鏡具有正光焦度，該第一透鏡之一物體側表面在該第一光軸上具有一凸形形狀，面對該第一反射構件之入射表面或出射表面之該第二透鏡具有一凸形形狀之一物體側表面，該第二透鏡群組中最接近該第二反射構件之一透鏡係一第n透鏡，n係6或更多，該第二透鏡群組中之該等透鏡中之一第n-2透鏡之一折射力之一絕對值係該第一透鏡群組及該第二透鏡群組之該等透鏡之折射力當中最大的，且該第一透鏡群組之焦距可具有一正值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The optical system disclosed in the embodiment of the invention comprises: a first reflective member; a second reflective member spaced apart from the first reflective member; a first lens group having a first lens disposed between the first reflective member and an object and disposed along a first optical axis; and a second lens group having a plurality of lenses disposed between the first and second reflective members and sequentially aligned along a second optical axis different from the first optical axis, wherein the first lens closest to the object has positive power, an object-side surface of the first lens has a convex shape on the first optical axis, the second lens facing the incident surface or the exit surface of the first reflective member has an object-side surface of a convex shape, a lens of the second lens group closest to the second reflective member is an n-th lens, n is 6 or more, an absolute value of an refractive power of an n-2th lens of the lenses in the second lens group is the largest among the refractive powers of the lenses of the first and second lens groups, and the focal length of the first lens group may have a positive value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一透鏡</p>  
        <p type="p">102:第二透鏡</p>  
        <p type="p">103:第三透鏡</p>  
        <p type="p">103A:第二殼體</p>  
        <p type="p">103B:影像表面</p>  
        <p type="p">104:第四透鏡</p>  
        <p type="p">105:第五透鏡</p>  
        <p type="p">106:第六透鏡</p>  
        <p type="p">107:最後一個透鏡/第七透鏡/透鏡</p>  
        <p type="p">190:影像感測器</p>  
        <p type="p">192:光學濾波器</p>  
        <p type="p">1000:光學系統</p>  
        <p type="p">CT1:中心厚度</p>  
        <p type="p">CT3:中心厚度</p>  
        <p type="p">D1:第一距離/距離</p>  
        <p type="p">D2:距離/第二距離</p>  
        <p type="p">ImgH:對角長度</p>  
        <p type="p">LG1:第一透鏡群組</p>  
        <p type="p">LG2:第二透鏡群組</p>  
        <p type="p">MG1:中心距離</p>  
        <p type="p">OA:光軸</p>  
        <p type="p">OA1:第一光軸</p>  
        <p type="p">OA2:第二光軸方向/第二光軸</p>  
        <p type="p">P1:第一反射構件</p>  
        <p type="p">P2:第二反射構件</p>  
        <p type="p">PR2:反射表面</p>  
        <p type="p">PS1:入射表面</p>  
        <p type="p">PS3:入射表面</p>  
        <p type="p">PS4:出射表面</p>  
        <p type="p">S1:透鏡表面/物體側第一表面/物體側表面</p>  
        <p type="p">S2:透鏡表面/感測器側第二表面</p>  
        <p type="p">S3:透鏡表面/物體側第三表面</p>  
        <p type="p">S4:透鏡表面/感測器側第四表面/第四表面/感測器側表面</p>  
        <p type="p">S5:透鏡表面/第五表面/物體側第五表面</p>  
        <p type="p">S6:透鏡表面/感測器側第六表面/第六表面</p>  
        <p type="p">S7:透鏡表面/物體側第七表面</p>  
        <p type="p">S8:透鏡表面/感測器側第八表面/感測器側表面</p>  
        <p type="p">S9:物體側第九表面/第九表面/透鏡表面</p>  
        <p type="p">S10:透鏡表面/感測器側第十表面/感測器側表面</p>  
        <p type="p">S11:透鏡表面/物體側第十一表面</p>  
        <p type="p">S12:透鏡表面/感測器側第十二表面/感測器側表面</p>  
        <p type="p">S13:透鏡表面/物體側第十三表面</p>  
        <p type="p">S14:透鏡表面/感測器側第十四表面/第十四表面</p>  
        <p type="p">T1:第一光軸距離</p>  
        <p type="p">T2:第二光軸距離</p>  
        <p type="p">T3:光軸距離</p>  
        <p type="p">TD1:光軸距離/第一光軸距離</p>  
        <p type="p">TD2:第二光軸距離/光軸距離</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1166" publication-number="202620433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同軸測試插座和印刷電路板介面的系統和方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOARD INTERFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G01R1/04</main-classification>  
        <further-classification edition="200601120260210B">G01R1/067</further-classification>  
        <further-classification edition="200601120260210B">G01R31/28</further-classification>  
        <further-classification edition="200601120260210B">G01R31/319</further-classification>  
        <further-classification edition="200601220260210B">G01R1/02</further-classification>  
        <further-classification edition="200601220260210B">G01R1/06</further-classification>  
        <further-classification edition="200601220260210B">G01R1/073</further-classification>  
        <further-classification edition="202001220260210B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史密斯英特康美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITHS INTERCONNECT AMERICAS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安拓銳高新測試技術（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTARES ADVANCED TEST TECHNOLOGIES (SUZHOU) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾瑪布蒂　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELMADBOULY, KHALED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田卓斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　家春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIACHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於將一積體電路(IC)晶片耦合至一印刷電路板(PCB)之測試插座。該測試插座包含界定自一第一表面延伸至一第二表面之複數個腔之一導電本體。該測試插座進一步包含安置於該複數個腔之一信號腔中之一信號探針。該信號探針經組態以電連接至該PCB之一信號導體且至該IC晶片之一信號襯墊。該測試插座進一步包含安置於該複數個腔之一接地腔中之一接地探針。該接地探針經組態以電連接至該PCB之一接地導體且至該IC晶片之一接地襯墊。該測試插座進一步包含安置於該接地腔中且電耦合於該導電本體與該接地探針之間的一接地裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test socket for coupling an integrated circuit (IC) chip to a printed circuit board (PCB) is provided. The test socket includes a conductive body defining a plurality of cavities extending from a first surface to a second surface. The test socket further includes a signal probe disposed in a signal cavity of the plurality of cavities. The signal probe is configured to electrically connect to a signal conductor of the PCB and to a signal pad of the IC chip. The test socket further includes a ground probe disposed in a ground cavity of the plurality of cavities. The ground probe is configured to electrically connect to a ground conductor of the PCB and to a ground pad of the IC chip. The test socket further includes a grounding device disposed in the ground cavity and electrically coupled between the conductive body and the ground probe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:測試插座</p>  
        <p type="p">106:積體電路(IC)晶片</p>  
        <p type="p">108:導電本體</p>  
        <p type="p">112:接地探針</p>  
        <p type="p">116:第一表面</p>  
        <p type="p">126:接地腔</p>  
        <p type="p">128:第一接地開口</p>  
        <p type="p">130:第二接地開口</p>  
        <p type="p">150:接地襯墊</p>  
        <p type="p">152:接地擴孔</p>  
        <p type="p">200:測試總成</p>  
        <p type="p">202:導電彈性體環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1167" publication-number="202620533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝像結構</chinese-title>  
        <english-title>CAMERA STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260210B">G03B13/36</main-classification>  
        <further-classification edition="202101120260210B">G03B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技(常熟)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　玉亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, NGOC-LUONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳力禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種攝像結構包括：移動結構包括第一移動部、第二移動部與移動件，移動件設置於第一移動部與第二移動部之間，移動件包括本體部與兩個錐體部，兩個錐體部位於本體部的兩端，第一移動部具有兩個第一支撐部，兩個第一支撐部分別對應於兩個錐體部的錐面具有兩個第一支撐斜面，第二移動部具有兩個第二支撐部，兩個第二支撐部具有第一支撐斜面，兩個第一支撐斜面分別對應於兩個錐體部的錐面，兩個第一支撐斜面抵接於錐體部的一側的錐面，兩個第二支撐斜面抵接於錐體部的另一側的錐面，移動件被設置為在第一移動部與第二移動部相對進行位移時，移動件於第一支撐斜面與第二支撐斜面移動。攝像鏡頭通過移動結構進行位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera structure includes: a moving structure including a first moving part, a second moving part and a moving member, the moving member is arranged between the first moving part and the second moving part, the moving member includes a main body and two cone parts, the two cone parts are located at two ends of the main body, the first moving part has two first supporting parts, the two first supporting parts correspond to the cone surfaces of the two cone parts respectively, and have two first supporting inclined surfaces, the second moving part has two second supporting parts, the two second supporting parts have first supporting inclined surfaces, the two first supporting inclined surfaces correspond to the cone surfaces of the two cone parts respectively, the two first supporting inclined surfaces abut against the cone surface of one side of the cone part, and the two second supporting inclined surfaces abut against the cone surface of the other side of the cone part, and the moving member is arranged so that when the first moving part and the second moving part are relatively displaced, the moving member moves on the first supporting inclined surfaces and the second supporting inclined surfaces. The camera lens is displaced by the moving structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11、11A:移動結構</p>  
        <p type="p">111、111A:第一移動部</p>  
        <p type="p">112、112A:第二移動部</p>  
        <p type="p">113、113A:移動件</p>  
        <p type="p">12:攝像鏡頭</p>  
        <p type="p">13:底座組件</p>  
        <p type="p">132:第一線圈</p>  
        <p type="p">133:第二線圈</p>  
        <p type="p">134:第三線圈</p>  
        <p type="p">14:第一移動組件</p>  
        <p type="p">1411:第一容置槽</p>  
        <p type="p">142:第一磁鐵</p>  
        <p type="p">162:第二磁鐵</p>  
        <p type="p">163:第三磁鐵</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">X:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1168" publication-number="202619669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備的動態切行方法、系統、設備及存儲介質</chinese-title>  
        <english-title>DYNAMIC PATH-CUTTING METHOD, SYSTEM, EQUIPMENT, AND STORAGE MEDIUM FOR CLEANING DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">A47L11/40</main-classification>  
        <further-classification edition="200601120260203B">A47L11/00</further-classification>  
        <further-classification edition="200601120260203B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及自動清潔設備技術領域，提出一種清潔設備的動態切行方法、系統、設備及存儲介質，該方法包括：根據獲取的地圖訊息識別待清潔範圍的邊界，根據邊界確定初始切行邊線；以初始切行邊線為基準，將邊界圍合的待清潔範圍逐行劃分為相鄰的、目標寬度不同的清潔行；各清潔行的目標寬度基於優先切大行的目的進行確定。本申請提供的方法，將邊界圍合的待清潔範圍劃分為相鄰的寬度不一的各清潔行，在涉及邊界形狀複雜或障礙物複雜的位置切行寬度更小，在涉及邊界形狀規整或無障礙物的位置切行寬度更大，從而既保證了清潔效果、又兼顧了清潔效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of automatic cleaning equipment technology and proposes a dynamic path-cutting method, system, equipment, and storage medium for cleaning devices. The method includes the following steps: identifying the boundaries of the area to be cleaned based on acquired map information, and determining the initial cutting path based on the boundaries; using the initial cutting path as a reference, dividing the area enclosed by the boundaries into adjacent cleaning paths with varying target widths; and determining the target width of each cleaning path based on the goal of prioritizing larger paths. The method provided in this application divides the area to be cleaned, enclosed by the boundaries, into adjacent cleaning paths of different widths. In areas where the boundary shape is complex or there are obstacles, smaller path widths are applied, while in areas with regular boundary shapes or no obstacles, larger path widths are used. This ensures both effective cleaning and efficient operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1169" publication-number="202619626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗生物膜劑、抗生物膜樹脂組成物、抗生物膜塗料及抗生物膜製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A01N25/04</main-classification>  
        <further-classification edition="200601120260223B">A01N31/08</further-classification>  
        <further-classification edition="200601120260223B">A01P3/00</further-classification>  
        <further-classification edition="201801120260223B">C09D7/63</further-classification>  
        <further-classification edition="200601120260223B">C09D201/00</further-classification>  
        <further-classification edition="200601120260223B">C07C39/06</further-classification>  
        <further-classification edition="200601120260223B">C07C39/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宗石徹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUNEISHI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松木信緒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUKI, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有抑制生物膜形成之優異之抗生物膜效果的抗生物膜劑、抗生物膜樹脂組成物及抗生物膜塗料。本發明之抗生物膜劑、抗生物膜樹脂組成物及抗生物膜塗料含有式（1）所示之化合物，因此式（1）所示之化合物能夠穩定地存在於基材表面，且與微生物之間表現出優異之相互作用，抑制微生物附著於基材表面，即便於微生物附著於基材表面之情形時，亦可抑制微生物於基材表面繁殖，抑制於基材表面形成生物膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1170" publication-number="202621003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力轉移</chinese-title>  
        <english-title>WIRELESS POWER TRANSFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260202B">H02J50/12</main-classification>  
        <further-classification edition="201601120260202B">H02J50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿葛弗諾弗　阿列克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGAFONOV, ALEKSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴林　安東尼爾斯　亞德瑞安　瑪莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STARING, ANTONIUS ADRIAAN MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾特曼　艾迪　葛瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELTMAN, EDDY GERRIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種將電力提供至一電力接收器(105)的無線電力傳輸器(101)，其包含回應於一驅動信號而產生一電力轉移信號的一電力轉移線圈(103)。一驅動器(201)產生該驅動信號，且一感測電路(209)產生一經測量輸出電路信號，該經測量輸出電路信號係描述包括該電力轉移線圈(103)的一輸出電路(103, 203)的一信號的一電流、一電壓、及一功率信號中之至少一者的一信號。一資料接收器電路(207)使用一同步偵測器(701)從該電力接收器(105)接收資料，該同步偵測器從一經降頻轉換信號產生資料值估計，該經降頻轉換信號係藉由使用具有一參考頻率的一降頻轉換信號對該經測量輸出電路信號進行降頻轉換而產生。一輸出產生器(703)從該等資料值估計產生所接收資料值。該降頻轉換頻率係一驅動頻率的一高次諧波頻率，該驅動頻率係該驅動信號的該頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless power transmitter (101) providing power to a power receiver (105) comprises a power transfer coil (103) generates a power transfer signal in response to a drive signal. A driver (201) generates the drive signal and a sense circuit (209) generates a measured output circuit signal being a signal describing at least one of a current, voltage, and power signal of a signal of an output circuit (103, 203) including the power transfer coil (103). A data receiver circuit (207) receives data from the power receiver (105) using a synchronous detector (701) which generates data value estimates from a downconverted signal generated by downconverting the measured output circuit signal using a downconversion signal having a reference frequency. An output generator (703) generates the received data values from the data value estimates. The downconversion frequency is a higher harmonic frequency of a drive frequency which is the frequency of the drive signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:電力傳輸器</p>  
        <p type="p">103:傳輸器線圈/電感器</p>  
        <p type="p">201:驅動器</p>  
        <p type="p">203:電容器</p>  
        <p type="p">205:電力傳輸器控制器</p>  
        <p type="p">207:資料接收器</p>  
        <p type="p">209:感測電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1171" publication-number="202619987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造玻璃帶狀物之設備以及方法</chinese-title>  
        <english-title>APPARATUS FOR MAKING GLASS RIBBON AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C03B17/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶拉塔　歐拉斯奈莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORATAV, OLUS NAILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛羅爾　柏蘭登威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOVER, BRENDAN WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯卡圖倫　布倫特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOCATULUM, BULENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SEHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　維奈Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, VINAY A</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅賓森　亞歷山大拉馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBINSON, ALEXANDER LAMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於製造一玻璃帶狀物之設備包含一成型楔及至少一個邊緣輥。該至少一個邊緣輥包含一套筒，該套筒耦接至一流體管路之一外端。該套筒進一步包含複數個孔，該複數個孔各自界定一徑向流體路徑。製造一玻璃帶狀物之方法包含用一對邊緣輥冷卻該玻璃帶狀物的邊緣部分。該方法進一步包含在該一對邊緣輥中之各邊緣輥的一部分上維持一第一溫度範圍內之一溫度梯度。該方法進一步包含在該一對邊緣輥中之各邊緣輥的一端部之一自由端上維持一第二溫度範圍內之一溫度梯度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus for making a glass ribbon comprise a forming wedge and at least one edge roller. The at least one edge roller comprises a sleeve coupled to an outer end of a fluid conduit. The sleeve further comprises a plurality of apertures that each define a radial fluid path. Methods of manufacturing a glass ribbon comprise cooling the edge portion of the glass ribbon with a pair of edge rollers. The methods further comprise maintaining a temperature gradient within a first temperature range across a portion of each edge roller of the pair of edge rollers. The methods further comprise maintaining a temperature gradient within a second temperature range across a free end of an end portion of each edge roller of the pair of edge rollers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23-23:線</p>  
        <p type="p">301:邊緣輥</p>  
        <p type="p">303:圓柱形主體</p>  
        <p type="p">305:圓柱形壁</p>  
        <p type="p">307:旋轉軸線</p>  
        <p type="p">309:外端壁</p>  
        <p type="p">311:自由端</p>  
        <p type="p">313:內圓柱形表面</p>  
        <p type="p">315,339:內表面</p>  
        <p type="p">317:腔室</p>  
        <p type="p">319:外圓柱形滾花表面</p>  
        <p type="p">320:軸</p>  
        <p type="p">321:流體管路</p>  
        <p type="p">322:軸向流體路徑</p>  
        <p type="p">323:套筒</p>  
        <p type="p">324:外端</p>  
        <p type="p">325:通道</p>  
        <p type="p">327:第一端部</p>  
        <p type="p">328:徑向流體路徑/箭頭</p>  
        <p type="p">329:第二端部</p>  
        <p type="p">333:耦接特徵</p>  
        <p type="p">337:外周表面</p>  
        <p type="p">341:絕緣層</p>  
        <p type="p">343:虛線</p>  
        <p type="p">345:角度</p>  
        <p type="p">347:保持元件</p>  
        <p type="p">400,600,800,1000,1400,1700:孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1172" publication-number="202619665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械手、機械臂機構、清潔設備與清潔系統</chinese-title>  
        <english-title>ROBOTIC HAND, ROBOTIC ARM MECHANISM, CLEANING DEVICE, AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">A47L11/24</main-classification>  
        <further-classification edition="200601120260210B">A47L11/40</further-classification>  
        <further-classification edition="200601120260210B">B25J11/00</further-classification>  
        <further-classification edition="200601120260210B">B25J18/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李长城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖智成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, ZHICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾令星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, LINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范红城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, HONGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吴健生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機械手、機械臂機構、清潔設備與清潔系統，涉及清潔設備技術領域。機械手包括：殼體、驅動組件與兩個夾爪，殼體形成有容納空間，所述驅動組件設於所述容納空間內，所述兩個夾爪的安裝端位於所述容納空間內並與所述驅動組件連接，所述兩個夾爪的夾持端伸出所述殼體外；所述驅動組件被配置為驅動所述兩個夾爪相互靠近或遠離。本揭露提供的機械手，整合驅動組件殼體內，兩個夾爪從殼體伸出，機械手整體尺寸可以更小，更輕薄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robotic hand, a robotic arm mechanism, a cleaning device, and a cleaning system are disclosed, relating to the field of cleaning device technology. The robotic arm includes: a housing, a drive assembly, and two grippers. The housing forms a housing space, with the drive assembly located within the housing space. The mounting ends of the two grippers are positioned within the housing space and connected to the drive assembly, while the gripping ends of the two grippers extend outside the housing. The drive assembly is configured to drive the two grippers to move toward or away from each other. The robotic hand provided in this disclosure integrates the drive assembly within the housing, with the two grippers extending from the housing, enabling the robotic hand to have a smaller overall size and be more compact and lightweight.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2111:底板</p>  
        <p type="p">2112:底殼</p>  
        <p type="p">2113:上殼</p>  
        <p type="p">2114:抵接件</p>  
        <p type="p">2115:安裝槽</p>  
        <p type="p">2116:線路板安裝槽</p>  
        <p type="p">2117:線路板</p>  
        <p type="p">2118:螺栓</p>  
        <p type="p">2119:緩衝支撐墊</p>  
        <p type="p">212:轉向座</p>  
        <p type="p">2127:轉軸</p>  
        <p type="p">2131:驅動電機</p>  
        <p type="p">2132:傳動齒輪</p>  
        <p type="p">2133:減速箱</p>  
        <p type="p">215:傳動件</p>  
        <p type="p">216:檢測開關</p>  
        <p type="p">2171:第一平面軸承</p>  
        <p type="p">2172:第二平面軸承</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1173" publication-number="202619871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於加工或處理聚合物材料的裝置</chinese-title>  
        <english-title>DEVICE FOR PROCESSING OR TREATING POLYMER MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B29B7/76</main-classification>  
        <further-classification edition="200601120260209B">B29B7/88</further-classification>  
        <further-classification edition="200601120260209B">B29B7/60</further-classification>  
        <further-classification edition="200601120260209B">B29B7/80</further-classification>  
        <further-classification edition="200601120260209B">B29B17/04</further-classification>  
        <further-classification edition="200601120260209B">B29B17/00</further-classification>  
        <further-classification edition="201901120260209B">B29C48/00</further-classification>  
        <further-classification edition="201901120260209B">B29C48/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商愛麗瑪工程回收機械公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EREMA ENGINEERING RECYCLING MASCHINEN UND ANLAGEN GESELLSCHAFT M.B.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費區丁格　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEICHTINGER, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡貝爾　羅嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBER, ROLAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種用於加工或處理聚合物材料特別是熱塑性廢棄塑膠以實現回收利用的裝置， 其中在容器（100）中設有至少一個、較佳多個可繞旋轉軸（200）旋轉的工具（300a、300b、…），用於移動、混合、加熱該材料，必要時進行粉碎，在容器（100）中，特別是在容器（100）的側壁（400）上，形成有容器開口（500），藉由該容器開口可將預處理後的該材料從容器（100）內部排出，工具（300a、300b、…）中的至少一個佈置於容器開口（500）區域，且是填料工具（300a、300b、…），用於產生朝該容器開口（500）方向作用於該材料的填料壓力或力，以將該材料排出容器（100）；該裝置包括至少一個擠出機或多螺桿擠出機（1），特別是雙螺桿擠出機（1），用於加工及熔化從容器（100）中排出的該材料，具有至少兩個可在共同殼體（2）中旋轉的螺桿（3a、3b、…），該擠出機（1）直接連接到容器（100）上，以接收從容器（1）的容器開口（500）排出的該材料，設有用於調節及控制至少一個填料工具（300a、300b、…）的轉速N（PCU）及/或控制至少兩個螺桿（3a、3b、…）的轉速n（ex）的控制裝置，該控制裝置被設計及/或設置為控制該至少一個填料工具（300a、300b、…）的轉速N（PCU）及/或螺桿（3a、3b、…）的轉速n（ex）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:擠出機、多螺桿擠出機、雙螺桿擠出機</p>  
        <p type="p">2:殼體</p>  
        <p type="p">3a,3b:螺桿</p>  
        <p type="p">3a',3b':縱軸</p>  
        <p type="p">4:進料口</p>  
        <p type="p">5:袋狀部</p>  
        <p type="p">6:輸送方向、縱向</p>  
        <p type="p">7,7':螺桿間隙</p>  
        <p type="p">8:內壁</p>  
        <p type="p">9:位點、端點</p>  
        <p type="p">11:末端</p>  
        <p type="p">12:橫向</p>  
        <p type="p">15:內部區域</p>  
        <p type="p">31:驅動裝置</p>  
        <p type="p">40:殼體縱軸</p>  
        <p type="p">A:進料區域</p>  
        <p type="p">B:過渡區域</p>  
        <p type="p">C:擠出區域</p>  
        <p type="p">LE:長度</p>  
        <p type="p">LT:長度區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1174" publication-number="202620025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129126</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含烴末端基之化合物、表面處理劑及物品以及被膜形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/10</main-classification>  
        <further-classification edition="200601120260223B">C07F7/21</further-classification>  
        <further-classification edition="200601120260223B">C09K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒匈隆介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKOH, RYUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由使用具有至少1個碳數3~60的直鏈狀、分支狀或者環狀的1價之烴末端基，進而具有至少1個反應性矽氮烷基之非氟系的含烴末端基之化合物，包含該化合物之表面處理劑具有速硬化性，能夠以短時間形成撥水性、滑動性、髒汙拭除性、耐磨耗性、尤其是耐鋼絲絨磨耗性優良之硬化被膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1175" publication-number="202621361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減少接縫之間隙填充後處理</chinese-title>  
        <english-title>POST-GAP FILL TREATMENT FOR SEAM REDUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/69</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達萬　蘇克蘭特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHAWAN, SUKRANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈許　蘇里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, SUPRIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈羅伊　蘇密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHA ROY, SUSMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索曼　巴斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAN, BHASKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈爾　阿奇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHAL, AKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">示範性處理方法可能包含執行含矽原子層沉積（ALD）製程。該含矽ALD製程可以在安置於半導體處理腔室的處理區域中的基板上所限定的特徵中沉積含矽材料。方法可能包含向處理區域提供含氧前驅物。方法可能包含將基板與含氧前驅物接觸。該接觸可能至少部分減少在含矽材料中存在的接縫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary processing methods may include performing a silicon-containing atomic layer deposition (ALD) process. The silicon-containing ALD process may deposit a silicon-containing material in a feature defined in a substrate disposed in a processing region of a semiconductor processing chamber. The methods may include providing an oxygen-containing precursor to a processing region. The methods may include contacting the substrate with the oxygen-containing precursor. The contacting may at least partially reduce a presence of a seam in the silicon-containing material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">205:操作</p>  
        <p type="p">210:操作</p>  
        <p type="p">215:操作</p>  
        <p type="p">220:操作</p>  
        <p type="p">225:操作</p>  
        <p type="p">230:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1176" publication-number="202620387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>屏蔽式溫度感測器</chinese-title>  
        <english-title>SHIELDED TEMPERATURE SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260213B">G01K1/08</main-classification>  
        <further-classification edition="202101120260213B">G01K1/14</further-classification>  
        <further-classification edition="202101120260213B">G01K7/02</further-classification>  
        <further-classification edition="200601120260213B">G01K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦特洛威電子製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里爾蘭　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILLELAND, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩伊　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOY, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一裝設結構包括具容納一感測器總成之一中心孔的一連接器、用於系統組件連接之一配接器配適件，以及附加於該連接器之一射頻(RF)屏蔽構件。該RF屏蔽構件圍繞該感測器總成，在多個分立位置處與其外表面接觸。此配置有效地屏蔽該感測器總成免受RF干擾，在一環境內提供更準確且可靠的感測器操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mounting structure includes a connector with a central bore accommodating a sensor assembly, an adaptor fitting for system component connection, and a radio frequency (RF) shielding member affixed to the connector. The RF shielding member surrounds the sensor assembly, making contact with its outer surface at multiple discrete locations. This configuration effectively shields the sensor assembly from RF interference, providing more accurate and reliable sensor operation within an environment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:感測器總成</p>  
        <p type="p">24:裝設結構</p>  
        <p type="p">26:系統組件</p>  
        <p type="p">28:開孔</p>  
        <p type="p">30:感測裝置</p>  
        <p type="p">32:插入部分</p>  
        <p type="p">50:第一配接器配適件</p>  
        <p type="p">52:連接器</p>  
        <p type="p">54:射頻(RF)屏蔽構件，RF屏蔽構件</p>  
        <p type="p">56:第二配接器配適件</p>  
        <p type="p">60:遠端軸部分</p>  
        <p type="p">62:近端軸部分</p>  
        <p type="p">64:螺母部分</p>  
        <p type="p">66:母連接器部件</p>  
        <p type="p">68:公連接器部件</p>  
        <p type="p">88:外管狀構件</p>  
        <p type="p">90:管狀本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1177" publication-number="202621501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源模組</chinese-title>  
        <english-title>POWER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/40</main-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="202601120260223B">H10W40/10</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洸洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANG-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓笛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供電源模組。電源模組包括第一導線框架、第一晶粒、基板、第二導線框架以及第二晶粒。第一導線框架具有第一和第二部分。第一晶粒設置在第一導線框架的第一部分的上方。第一功率裝置形成在第一晶粒的上方。基板設置在第一導線框架的第二部分的上方。第二導線框架設置在基板上。第二晶粒設置在第二導線框架的上方，其中第二晶粒上形成有第一控制電路，並且第一控制電路用以控制第一功率裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power module is provided. The power module includes a first lead frame, a first die, a substrate, a second lead frame, and a second die. The first lead frame has a first part and a second part. The first die is arranged on top of the first part of the first lead frame. A first power device is formed on the first die. The substrate is arranged on top of the second part of the first lead frame. The second lead frame is arranged on top of the substrate. The second die is arranged on top of the second lead frame. A first control circuit is formed on the second die, and the first control circuit is configured to control the first power device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源模組</p>  
        <p type="p">120:基板</p>  
        <p type="p">142,144:晶粒</p>  
        <p type="p">L12:導線框架</p>  
        <p type="p">L14:導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1178" publication-number="202621487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於高效能標準單元之雙接觸件及電力軌</chinese-title>  
        <english-title>DUAL CONTACT AND POWER RAIL FOR HIGH PERFORMANCE STANDARD CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/43</main-classification>  
        <further-classification edition="202501120260223B">H10D64/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉延　桑巴斯凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYAN, SAMBASIVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格凡　普瑞文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHAVAN, PRAVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種可實施在FinFET裝置或奈米片FET裝置中的標準單元佈局。該標準單元佈局包括來自一頂側金屬層及一背側金屬層之電力供應器連接。該標準單元中之一裝置可連接至該頂側金屬層及該背側金屬層兩者。該裝置之源極/汲極區域可使用該標準單元佈局內之通孔接觸件來連接該等金屬層。亦可在該標準單元佈局中包括從該頂側金屬層及該背側金屬層至電力供應軌的連接。該等軌可連接至一電力供應器，使得該電力供應器通過該頂側金屬層及該背側金屬層兩者將電力提供至該裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A standard cell layout that may be implemented in FinFET devices or nanosheet FET devices is disclosed. The standard cell layout includes power supply connections from both a topside metal layer and a backside metal layer. A device in the standard cell may be connected to both the topside metal layer and the backside metal layer. Source/drain regions of the device may be connected the metal layers using via contacts within the standard cell layout. Connections to power supply rails from the topside metal layer and the backside metal layer may also be included in the standard cell layout. The rails may be connected to a power supply such that the power supply provides power to the device through both the topside and backside metal layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:單元</p>  
        <p type="p">902A:閘極</p>  
        <p type="p">904:裝置</p>  
        <p type="p">906:頂側(源極/汲極)電力接觸件/接觸件</p>  
        <p type="p">907:頂側通孔/通孔</p>  
        <p type="p">908A:頂側金屬層部分</p>  
        <p type="p">908B:頂側金屬層部分</p>  
        <p type="p">910:背側通孔</p>  
        <p type="p">912A:背側金屬層部分/金屬層部分</p>  
        <p type="p">912B:背側金屬層部分/金屬層部分</p>  
        <p type="p">912C:背側金屬層部分/金屬層部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1179" publication-number="202619648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嬰兒裝置、嬰兒照護裝置及用於嬰兒照護和嬰兒照護裝置的方法</chinese-title>  
        <english-title>INFANT APPARATUS, INFANT CARE APPARATUS, AND METHOD FOR INFANT CARE AND INFANT CARE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">A47D9/02</main-classification>  
        <further-classification edition="200601120260206B">A47D13/10</further-classification>  
        <further-classification edition="200601120260206B">A47C1/00</further-classification>  
        <further-classification edition="200601120260206B">A47D15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商索利工業公司（亦以４ｍｏｍｓ名稱營業）</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THORLEY INDUSTRIES, LLC (DBA 4MOMS)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱尼維奇　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUCHNIEWICZ, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種嬰兒照護裝置包括基座。驅動機構及震動機構被耦接到基座。活動台被可移動地安裝到基座。嬰兒支撐件被耦接到活動台。驅動機構將第一循環動作施加到活動台，且將獨立於第一循環動作之第二循環動作施加到活動台的至少一部分，以及施加到震動機構，使得震動馬達使活動台震動。嬰兒支撐件被耦接到活動台且在第一循環動作和第二循環動作兩者中循環地移動。控制器配置為以可選可變的動作曲線和可選的震動模式來使嬰兒支撐件移動，可選可變的動作曲線和可選的震動模式被從不同的可選可變的動作曲線和針對不同的可選可變的動作曲線中的每一者之可選的不同震動模式中被選出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An infant care apparatus includes a base. A drive mechanism and a vibratory mechanism are coupled to the base. A movable stage is movably mounted to the base. An infant support is coupled to the movable stage. The drive mechanism imparts a first cyclic motion to the movable stage, and imparts a second cyclic motion to at least part of the movable stage independent of the first cyclic motion and to the vibratory mechanism so that the vibration motor vibrates the movable stage. The infant support is coupled to the movable stage and moves cyclically in both the first and second cyclic motions. The controller is configured to move the infant support in a selectably variable motion profile with selectable vibration modes selected from different selectably variable motion profiles and selectably different vibration modes for each of the different selectable variable motion profiles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:嬰兒照護裝置</p>  
        <p type="p">2:嬰兒支撐件</p>  
        <p type="p">3:基座</p>  
        <p type="p">4:底支撐殼體</p>  
        <p type="p">5:頂外殼</p>  
        <p type="p">5A:表面</p>  
        <p type="p">6:嬰兒床</p>  
        <p type="p">9:腿</p>  
        <p type="p">9A:腳</p>  
        <p type="p">18:儲物籃</p>  
        <p type="p">20:底面板</p>  
        <p type="p">21:(連續)側壁</p>  
        <p type="p">22:頂邊緣</p>  
        <p type="p">23:封閉空間</p>  
        <p type="p">50:控制系統</p>  
        <p type="p">51:控制器</p>  
        <p type="p">52:控制面板</p>  
        <p type="p">53:顯示器</p>  
        <p type="p">54:控制開關</p>  
        <p type="p">55:可攜式音樂播放器底座</p>  
        <p type="p">56:喇叭</p>  
        <p type="p">57:輸入插孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1180" publication-number="202620199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高爐用團塊礦</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251119B">C21B5/00</main-classification>  
        <further-classification edition="200601120251119B">C22B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田幸平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐伯成駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEKI, MICHITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友澤方成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMOZAWA, MASANARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹原健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEHARA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有更高被還原性的高爐用團塊礦。高爐用團塊礦係於前述團塊礦的剖面組織中，赤鐵礦的面積率為40%以上，磁鐵礦的面積率為30%以下，從前述赤鐵礦的結晶方位之分布所算出的前述剖面組織中之赤鐵礦粒子的平均費雷特徑為30μm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1181" publication-number="202619701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Ｗ／Ｏ／Ｗ型乳劑及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K8/92</main-classification>  
        <further-classification edition="200601120260202B">A61Q1/00</further-classification>  
        <further-classification edition="200601120260202B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三得利控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNTORY HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田絵理花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, ERIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供含有聚甘油，經時安定性良好且具有優良使用感之W/O/W型乳劑及其製造方法。本發明是有關於一種W/O/W型乳劑，其為包含內水相、油相及外水相之W/O/W型乳劑，上述內水相含有聚甘油及二甘油。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1182" publication-number="202621185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理腔室的加熱組件和方法</chinese-title>  
        <english-title>HEATING ASSEMBLY AND METHOD FOR A PROCESSING CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H05B3/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅內特　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRONET, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川　大衛正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAVID MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯洛斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURROWS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了一種用於加熱組件的反射體裝置，以及一種用於操作該加熱組件的方法。該反射體裝置包括基座，該基座具有第一側，該第一側具有供輻射穿過的開口；第二側，該第二側與該第一側相對；以及側壁，該側壁在該第一側與該第二側之間延伸。該反射體裝置進一步包括第一反射體口袋，該第一反射體口袋設置於該基座的該第一側與該第二側之間，並具有第一反射體部分。該第一反射體部分可以包括波浪形狀的區段，該波浪形狀的區段具有菲涅耳形狀。第一反射體冷卻腔室包圍著該第一反射體部分及該波浪形狀的區段。該方法包括以至少600W的功率操作設置於反射體口袋中的加熱燈，並在反射體冷卻腔室內循環冷卻劑以冷卻該加熱燈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are a reflector apparatus for a heating assembly, and a method for operating the heating assembly. The reflector apparatus includes a base that has a first side having openings for radiation to pass through, a second side opposite to the first side, and a side wall extending between the first side and the second side. The reflector apparatus further includes a first reflector pocket disposed between the first side and the second side of the base and having a first reflector portion. The first reflector portion may include a wavy section having a Fresnel shape. A first reflector cooling chamber encases the first reflector portion and the wavy section. The method includes operating a heating lamp disposed in a reflector pocket at a power of at least 600 W and circulating a coolant within a reflector cooling chamber to cool the heating lamp.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">124:基板</p>  
        <p type="p">300:處理腔室</p>  
        <p type="p">301:加熱組件</p>  
        <p type="p">302:頂部</p>  
        <p type="p">303:側面</p>  
        <p type="p">304:處理體積</p>  
        <p type="p">305:底部</p>  
        <p type="p">306:狹縫閥</p>  
        <p type="p">308:氣體入口</p>  
        <p type="p">310:氣源</p>  
        <p type="p">312:出口</p>  
        <p type="p">314:真空泵</p>  
        <p type="p">316:磁轉子</p>  
        <p type="p">318:圓形通道</p>  
        <p type="p">320:管狀構件</p>  
        <p type="p">322:邊緣環</p>  
        <p type="p">324:磁定子</p>  
        <p type="p">326:保護區域</p>  
        <p type="p">328:加熱元件</p>  
        <p type="p">330:反射體口袋</p>  
        <p type="p">332:反射體裝置</p>  
        <p type="p">334:冷卻網路</p>  
        <p type="p">336:熱感測器</p>  
        <p type="p">338:控制器</p>  
        <p type="p">340:感受器</p>  
        <p type="p">342:外環</p>  
        <p type="p">348:任選的透明穹頂</p>  
        <p type="p">350:腔室主體</p>  
        <p type="p">352:熱感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1183" publication-number="202620311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直線運動導引裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">F16C29/06</main-classification>  
        <further-classification edition="200601120250926B">F16C33/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本精工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NSK LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林丈二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, JOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之直線運動導引裝置包含殼箱，該殼箱安裝於滑塊之軸向之端部，收容含浸潤滑劑之コ字狀之潤滑劑供給構件，且按壓前述潤滑劑供給構件以與一對軌條側軌道面接觸。前述潤滑劑供給構件之袖部具有缺口部，該缺口部自接近前述導引軌條之側面之側面朝與前述導引軌條分開之方向延伸，前述殼箱具有配置於前述缺口部內之抵接於前述缺口部之上端內表面之上方抵接部及抵接於前述缺口部之下端內表面之下方抵接部。藉此，即便於潤滑劑供給構件放油收縮之情形下，亦可維持潤滑劑供給構件與軌條側軌道面之接觸，朝軌條側軌道面穩定供給潤滑劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:殼箱</p>  
        <p type="p">45:第1安裝部</p>  
        <p type="p">45a:插通孔</p>  
        <p type="p">46:第2安裝部</p>  
        <p type="p">47:第3安裝部</p>  
        <p type="p">49:第5安裝部</p>  
        <p type="p">50:潤滑劑供給構件</p>  
        <p type="p">50A:袖部</p>  
        <p type="p">50B:連接部</p>  
        <p type="p">51:第1凹部</p>  
        <p type="p">51a,56a:底部</p>  
        <p type="p">51b:緣部</p>  
        <p type="p">52:第2凹部</p>  
        <p type="p">55:突設部</p>  
        <p type="p">55A:第1抵接部/抵接部</p>  
        <p type="p">55B:第2抵接部/抵接部</p>  
        <p type="p">55C:垂直部</p>  
        <p type="p">56:第3凹部</p>  
        <p type="p">56b:側部</p>  
        <p type="p">57:缺口部</p>  
        <p type="p">57a:開口</p>  
        <p type="p">57b:狹槽部</p>  
        <p type="p">59:安裝孔</p>  
        <p type="p">c1:下部側面</p>  
        <p type="p">VII:部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1184" publication-number="202620563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產業用設備運用支援系統</chinese-title>  
        <english-title>SUPPORT SYSTEM FOR OPERATING INDUSTRIAL EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">G05B19/418</main-classification>  
        <further-classification edition="200601120260213B">G05B23/02</further-classification>  
        <further-classification edition="201201120260213B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三浦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村啓二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦浩二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於支援產業用設備的運用。產業用設備運用支援系統1係具有：複數個環境感測器5，係配置於產業用設備2；複數個控制器61，係裝備於產業用設備2；以及複數個資訊處理裝置6，係構成為可取得及蓄積由環境感測器5所檢測出的環境資訊及由控制器61所產生的運作資訊，且具有從下游側朝向上游側傳送環境資訊及運作資訊的階層構造。複數個資訊處理裝置6係在任一個以上的階層中具有：資訊處理引擎31，係對已取得之環境資訊及運作資訊執行事先規定的資訊處理；資訊蓄積平台37，係蓄積進行規定之資訊處理後的環境資訊及運作資訊；有益資訊產生引擎32，係使用資訊蓄積平台37所蓄積的環境資訊及運作資訊來產生有助於設備運用的有益資訊；以及UI提供引擎33，係提供使用者介面，該使用者介面係用以將由有益資訊產生引擎32所產生的有益資訊顯示於使用者終端40。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to support the operation of industrial equipment. &lt;br/&gt;An industrial equipment operation support system (1) comprises: &lt;br/&gt;a plurality of environment sensors (5) disposed at industrial equipment (2); &lt;br/&gt;a plurality of controllers (61) equipped in the industrial equipment (2); and &lt;br/&gt;a plurality of information processing apparatuses (6) configured to acquire and accumulate environment information detected by the environment sensors (5) and operation information generated by the controllers (61), wherein the plurality of information processing apparatuses (6) have a hierarchical structure for transmitting the environment information and the operation information from a downstream side toward an upstream side. &lt;br/&gt;In at least one or more layers, the plurality of information processing apparatuses (6) include: &lt;br/&gt;an information processing engine (31) configured to execute predefined information processing on acquired environment information and operation information; &lt;br/&gt;an information accumulation platform (37) configured to accumulate the environment information and the operation information that have undergone the predefined information processing; &lt;br/&gt;a useful information generation engine (32) configured to generate useful information contributing to equipment operation by using the environment information and the operation information accumulated in the information accumulation platform (37); and &lt;br/&gt;a UI providing engine (33) configured to provide a user interface for displaying the useful information generated by the useful information generation engine (32) on a user terminal (40).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:產業用設備運用支援系統</p>  
        <p type="p">2:產業用設備</p>  
        <p type="p">2A:第一產業用設備</p>  
        <p type="p">2B:第二產業用設備</p>  
        <p type="p">3:事業機構</p>  
        <p type="p">3A:第一事業機構</p>  
        <p type="p">3B:第二事業機構</p>  
        <p type="p">3C:第三事業機構</p>  
        <p type="p">4:工廠</p>  
        <p type="p">4A:第一工廠</p>  
        <p type="p">4B:第二工廠</p>  
        <p type="p">5:環境感測器</p>  
        <p type="p">6:資訊處理裝置</p>  
        <p type="p">7:資料收集終端</p>  
        <p type="p">61:控制器</p>  
        <p type="p">61A:微電腦</p>  
        <p type="p">61B:PLC(可程式邏輯控制器)</p>  
        <p type="p">62:邊緣電腦</p>  
        <p type="p">63:閘道</p>  
        <p type="p">64:訪客電腦</p>  
        <p type="p">65:主機電腦</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1185" publication-number="202620989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射系統、用於用紫外光將塗覆有感光塗層的半導體材料曝光之安裝方法、用於產生光束以產生發射紫外光的靶材的電漿的方法、以及用於製備微晶片或製備微晶片之半導體中間體的方法</chinese-title>  
        <english-title>LASER SYSTEM, INSTALLATION FOR EXPOSING A SEMICONDUCTOR MATERIAL COATED WITH A PHOTOSENSITIVE COATING WITH ULTRAVIOLET LIGHT, METHOD FOR GENERAT-ING A LIGHT BEAM FOR GENERATING A PLASMA OF A TARGET MATERIAL THAT EMITS EUV LIGHT AND METHOD FOR PRODUCING MICROCHIPS OR SEMICONDUCTOR INTER-MEDIATES FOR PRODUCING MICROCHIPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H01S3/00</main-classification>  
        <further-classification edition="200601120260213B">H01S3/23</further-classification>  
        <further-classification edition="200601120260213B">H01S3/07</further-classification>  
        <further-classification edition="200601120260213B">H05G2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體雷射系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒爾茲　約希姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULZ, JOACHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾哈德　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERHARD, STEFFEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特路肯　亞利桑德馬蒂斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRUYCKEN, ALEXANDER MATTHIJS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛勒里希　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROHLICH, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高德　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUDER, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛勒肯斯　阿德里安努約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHELLEKENS, ADRIANUS JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為關於雷射系統(18)，其中中繼單元(64.1,64.2)被配置為使得光束(22)在第一偏轉部件(74.1)處偏轉離開第一中繼平面(78.1)至不同於第一中繼平面(78.1)的第二中繼平面(78.2)，並前往第二偏轉部件(74.2)，其中中繼平面(78.1,78.2)實質上水平延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention concerns laser system (18) in which a relay unit (64.1, 64.2) is configured such that a light beam (22) can be deflected at a first deflection element (74.1) out of a first relay plane (78.1) into a second relay plane (78.2) different from the first relay plane (78.1) and towards the second deflection element (74.2), wherein the relay planes (78.1, 78.2) extend essentially horizontally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:放大器佈置</p>  
        <p type="p">26.1:第一光學放大器</p>  
        <p type="p">26.2:第二光學放大器</p>  
        <p type="p">30:第三光學放大器</p>  
        <p type="p">32:第四光學放大器</p>  
        <p type="p">56:光束路徑</p>  
        <p type="p">62:中繼佈置</p>  
        <p type="p">64.1:第一中繼單元</p>  
        <p type="p">64.2:第一中繼單元</p>  
        <p type="p">74.1:第一偏轉部件</p>  
        <p type="p">74.2:第二偏轉部件</p>  
        <p type="p">78.1:第一中繼平面</p>  
        <p type="p">80:中繼單元光束路徑</p>  
        <p type="p">84:主軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1186" publication-number="202621098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於SOME/IP通訊協定的車載電子系統和其資料傳輸方法</chinese-title>  
        <english-title>IN-VEHICLE ELECTRONIC SYSTEM AND DATA TRANSMISSION METHOD THEREOF BASED ON SOME/IP COMMUNICATION PROTOCOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260210B">H04L47/2425</main-classification>  
        <further-classification edition="202201120260210B">H04L67/12</further-classification>  
        <further-classification edition="202201120260210B">H04L67/51</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉智丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫志杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊潤郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, JUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於SOME/IP通訊協定的車載電子系統和其資料傳輸方法於此揭露。車載電子系統包括作為服務端的第一電子控制單元用於提供第一服務和第二服務和作為第一客戶端的第二電子控制單元用於請求或訂閱服務端所提供的服務。第一服務和第二服務各自具有服務優先級且第一服務的服務優先級高於第二服務的服務優先級。響應於第一客戶端同時請求第一服務和第二服務，或是響應於第一客戶端訂閱第一服務和第二服務且對應第一服務和第二服務的事件同時被觸發，服務端用於根據服務優先級的高低將第一服務和第二服務的資料依序傳輸給第一客戶端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An in-vehicle electronic system and a data transmission method thereof based on the SOME/IP communication protocol are disclosed. The in-vehicle electronic system includes a first electronic control unit serving as a server configured to provide a first service and a second service and a second electronic control unit serving as a first client configured to request or subscribe to the services provided by the server. The first service and the second service each have a respective service priority, in which the first service has a higher service priority than the second service. In response to the first client simultaneously requesting the first and second services, or in response to the first client subscribing to both the first and second services and the events corresponding to the first and second services being triggered simultaneously, the server is configured to transmit data of the first and second services to the first client in order according to their service priorities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:資料傳輸方法</p>  
        <p type="p">S210,S230,S250,S270:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1187" publication-number="202620599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>追蹤方法、多裝置系統及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>TRACKING METHOD, MULTI-DEVICE SYSTEM AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G06F3/01</main-classification>  
        <further-classification edition="201301120250901B">G06F3/0346</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃群凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳至謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供追蹤方法、多裝置系統及非暫態電腦可讀取儲存媒體。追蹤方法適用於多裝置系統，其中多裝置系統用以在實體環境中追蹤目標物件，並包含主機裝置以及週邊裝置。追蹤方法包含：藉由週邊裝置，追蹤週邊裝置；當主機裝置判斷要追蹤目標物件時，藉由主機裝置，追蹤週邊裝置，以產生週邊裝置與主機裝置之間的第一空間關係；以及藉由週邊裝置，依據第一空間關係追蹤目標物件，以產生目標物件與主機裝置之間的第二空間關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a tracking method, a multi-device system and a non-transitory computer readable storage medium. The tracking method is applicable to the multi-device system. The multi-device system is used to track a target object in a physical environment and includes a host device and a peripheral device. The tracking method includes: by the peripheral device, tracking the peripheral device; when the host device determines to track the target object, by the host device, tracking the peripheral device, to generate a first spatial relationship between the peripheral device and the host device; and by the peripheral device, tracking the target object according to the first spatial relationship, to generate a second spatial relationship between the target object and the host device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:追蹤方法</p>  
        <p type="p">S301~S304:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1188" publication-number="202620352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括直接浸沒式流體冷卻環路之浸沒式冷卻系統</chinese-title>  
        <english-title>IMMERSION COOLING SYSTEMS INCLUDING DIRECT IMMERSION FLUID COOLING LOOP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">F28C3/08</main-classification>  
        <further-classification edition="202101120260215B">F25B41/00</further-classification>  
        <further-classification edition="200601120260215B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特克　古斯塔沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTKER, GUSTAVO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種浸沒式冷卻系統包括一浸沒式冷卻槽，該槽界定一空腔，該空腔經定大小及定形狀用於保留一浸沒流體的液體體積及至少一個待浸沒在該浸沒流體的液體體積中之電氣組件，並用於界定該浸沒流體的液體體積上方之一蒸氣間隙，及可與該浸沒式冷卻槽結合操作之一直接浸沒式流體冷卻系統。該冷卻系統包括一蒸氣進氣管線，其定位在該浸沒式冷卻槽之該蒸氣間隙內，且可操作以將該浸沒流體的氣相抽取至其中；一熱交換器，其定位在該蒸氣進氣管線下游，且可操作以將熱從該浸沒流體中排出；及一液體管線，其連接在該熱交換器與該浸沒槽之間，以用於將該浸沒流體從該熱交換器返回至該浸沒槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An immersion cooling system includes an immersion cooling tank defining a cavity sized and shaped for retaining a liquid volume of an immersion fluid and at least one electrical component to be immersed in the liquid volume of the immersion fluid, and for defining a vapor clearance above the liquid volume of the immersion fluid, and a direct immersion fluid cooling system operable in conjunction with the immersion cooling tank. The cooling system includes a vapor intake line positioned within the vapor clearance of the immersion cooling tank and operable to draw vapor phase of the immersion fluid therein, a heat exchanger positioned downstream from the vapor intake line and operable to reject heat from the immersion fluid, and a liquid line connected between the heat exchanger and the immersion tank for returning the immersion fluid from the heat exchanger to the immersion tank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:浸沒式冷卻系統</p>  
        <p type="p">12:浸沒槽</p>  
        <p type="p">14:側表面</p>  
        <p type="p">16:下表面</p>  
        <p type="p">18:上表面</p>  
        <p type="p">19:槽蓋</p>  
        <p type="p">20:內表面</p>  
        <p type="p">22:空腔</p>  
        <p type="p">24:底表面</p>  
        <p type="p">26:流體</p>  
        <p type="p">28:電氣組件</p>  
        <p type="p">30:基材</p>  
        <p type="p">32:晶片</p>  
        <p type="p">34:冷板</p>  
        <p type="p">36:流體表面</p>  
        <p type="p">38:蒸氣</p>  
        <p type="p">40:蒸氣間隙</p>  
        <p type="p">44:通道</p>  
        <p type="p">50:流體冷卻環路</p>  
        <p type="p">52:冷凝器</p>  
        <p type="p">52a:出口</p>  
        <p type="p">54:流體冷卻器</p>  
        <p type="p">54a:入口</p>  
        <p type="p">56:泵</p>  
        <p type="p">60:熱交換器或盤管</p>  
        <p type="p">62:熱回收盤管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1189" publication-number="202621467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速調整用以處理在濕式製程中的半導體基板的至少一處理液體的溫度之方法</chinese-title>  
        <english-title>METHODS TO QUICKLY ADJUST THE TEMPERATURE OF AT LEAST ONE PROCESSING LIQUID USED TO PROCESS A SEMICONDUCTOR SUBSTRATE IN A WET PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/70</main-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪莉婭　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ELIA, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納斯曼　羅那得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASMAN, RONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供濕式製程系統、化學品供應系統以及在濕式製程期間快速且有效率地針對供應至半導體基板的至少一處理液體之溫度調整方法的多種實施例。在所揭露之實施例中，處理液體係在室溫或接近室溫下流經化學品供應系統，且處理液體的溫度係在處理液體供應至半導體基板之至少一表面的位置處或其附近藉由供應多種經加熱及/或經冷卻的流體至該處理液體來進行調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of wet processing systems, chemical supply systems and methods are provided herein to quickly and efficiently adjust a temperature of at least one processing liquid provided to a semiconductor substrate during a wet process. In the disclosed embodiments, processing liquid(s) flow through the chemical supply system at or near room temperature and the temperature of the processing liquid(s) is adjusted at or near the location(s) at which the processing liquid(s) are supplied to at least one surface of a semiconductor substrate (e.g., at or near the point of use) by supplying a variety of heated and/or cooled fluids to the processing liquid(s).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">910:步驟</p>  
        <p type="p">920:步驟</p>  
        <p type="p">930:步驟</p>  
        <p type="p">940:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1190" publication-number="202619711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氮稠環化合物、藥物組合物及其用途</chinese-title>  
        <english-title>NITROGEN-CONTAINING FUSED RING COMPOUND, PHARMACEUTICAL COMPOSITION AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/437</main-classification>  
        <further-classification edition="200601120260202B">A61K31/42</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4178</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4162</further-classification>  
        <further-classification edition="200601120260202B">A61K31/351</further-classification>  
        <further-classification edition="200601120260202B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商煙台榮昌製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RONGCHANG PHARMACEUTICALS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑　劍明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAO, JIANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王治勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉小紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAOHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明披露了含氮稠環化合物、藥物組合物及其用途。本發明提供由式II表示的化合物，其溶劑化物、其藥學上可接受的鹽或其藥學上可接受鹽的溶劑化物。本發明的化合物是強效GLP-1受體促效劑，並且可用於治療糖尿病或肥胖症。 &lt;br/&gt;&lt;img align="absmiddle" height="272px" width="185px" file="ed10648.JPG" alt="ed10648.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1191" publication-number="202621179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多讀取器中同步共通AIoT程序之方法</chinese-title>  
        <english-title>METHODS FOR SYNCHRONIZING COMMON AIOT PROCEDURES AMONG MULTIPLE READERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260202B">H04W74/0833</main-classification>  
        <further-classification edition="200901120260202B">H04W68/00</further-classification>  
        <further-classification edition="201801120260202B">H04W4/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑞達　馬提諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDA, MARTINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉　艾爾登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALA, ERDEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINIER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鍾宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯伊拉臘　雷蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIRALA, REMUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫斯塔法　亞曼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSTAFA, AHMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾漢斯　阿塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL HAMSS, AATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOOHER, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由一環境物聯網(AIoT)裝置使用之方法可包含接收一第一傳呼訊息。該第一傳呼訊息可包含一第一對話識別(ID)。該方法可包含發送對該第一傳呼訊息之一回應。該方法可包含確定對該第一傳呼訊息之該回應是否成功。該方法可包含接收一第二傳呼訊息。該第二傳呼訊息可包含一第二對話ID。該第一對話識別與該第二對話ID可係等同的。該方法可包含基於確定對該第一傳呼訊息之該回應不成功而發送對該第二傳呼訊息之一回應。該第一傳呼訊息及該第二傳呼訊息可為盤點程序命令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for use by an ambient Internet of Things (AIoT) device may comprise receiving a first paging message. The first paging message may comprise a first session identification (ID). The method may comprise sending a response to the first paging message. The method may comprise determining whether the response to the first paging message was successful. The method may comprise receiving a second paging message. The second paging message may comprise a second session ID. The first session identification and the second session ID may be equal. The method may comprise sending a response to the second paging message based on determining that the response to the first paging message was not successful. The first paging message and the second paging message may be inventory procedure commands.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:實例方法</p>  
        <p type="p">810、820、830:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1192" publication-number="202620997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池充電系統、電池模塊檢測電路、充電控制開關檢測電路、異常檢測電路、電源配置、及電池充電設備</chinese-title>  
        <english-title>BATTERY CHARGING SYSTEM, BATTERY MODULE DETECTION CIRCUIT, CONTROL SWITCH DETECTION CIRCUIT, ABNORMALITY DETECTION CIRCUIT, POWER CONFIGURATION, AND BATTERY CHARGING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">H02J7/04</main-classification>  
        <further-classification edition="200601120260204B">H01M10/44</further-classification>  
        <further-classification edition="200601120260204B">H01M10/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電能安傳科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTRANTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　拱辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KONG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鼎杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電池系統中的一組可更換電池模塊的充電和/或放電是使用在順序充電和/或放電控制鏈中所鏈接的一組充電和/或放電控制開關來自動執行的。該組電池模塊的充電和放電可以順序地或並行地完成，並且是基於硬體的，其具有最少的軟體/韌體參與。該系統可擴展並且可自動重新配置，以用於基礎設施和/或電動車輛。可更換電池模塊可以定位在電池槽中或在電池系統中抵接在一起。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The charging and/or discharging of a set of swappable battery modules in a battery system is carried out automatically using a set of charging and/or discharging control switches linked in a sequential charging and/or a discharging control chain. The charging and discharging of the set of battery modules can be done sequentially or in parallel, and is hardware-based with minimal software/firmware involvement. The system is scalable and automatically reconfigurable for use in an infrastructure and/or in an electric vehicle. The swappable battery modules may be positioned in the battery slots or butted together in the battery system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池充電系統</p>  
        <p type="p">101:鍵開關</p>  
        <p type="p">105:DC電源</p>  
        <p type="p">106:電源連接</p>  
        <p type="p">107:接地連接</p>  
        <p type="p">111、112、113、114、115、116、117、118、119:控制開關</p>  
        <p type="p">121、122、123、124、125、126、127、128、129:電池槽</p>  
        <p type="p">130:充電控制鏈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1193" publication-number="202621165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環境物聯網之適應性調變</chinese-title>  
        <english-title>ADAPTIVE MODULATION FOR AMBIENT IOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/04</main-classification>  
        <further-classification edition="201801120260202B">H04W4/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉　艾爾登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALA, ERDEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯伊拉臘　雷蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIRALA, REMUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINIER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫斯塔法　亞曼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSTAFA, AHMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾漢斯　阿塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL HAMSS, AATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑞達　馬提諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDA, MARTINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鍾宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">由裝置使用的方法包括接收頻率資源分配訊息。頻率資源分配訊息表明第一碼片持續時間及縮放係數。該方法包括確定傳輸資訊要使用的第二碼片持續時間。第二碼片持續時間基於第一碼片持續時間及縮放係數。該方法包括使用方波訊號使用所確定的第二碼片持續時間傳輸資訊。頻率資源分配訊息從讀取器被接收。將資訊傳輸至讀取器。頻率資源分配訊息包括校正訊號。第一碼片持續時間基於校正訊號的測量。確定第二碼片持續時間包括測量第一碼片持續時間及用縮放係數縮放測量的第一碼片持續時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for use by a device comprises receiving a frequency resource allocation message. The frequency resource allocation message indicates a first chip duration and a scaling coefficient. The method comprises determining a second chip duration to use for transmitting information. The second chip duration is based on the first chip duration and the scaling coefficient. The method comprises transmitting the information using a square wave signal using the determined second chip duration. The frequency resource allocation message is received from a reader. The information is transmitted to a reader. The frequency resource allocation message comprises a calibration signal. The first chip duration is based on a measurement of the calibration signal. The determining the second chip duration comprises measuring the first chip duration and scaling the measured first chip duration with the scaling coefficient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700、710、720、730:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1194" publication-number="202621154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>WLAN中接入點節能的方法、裝置、設備和系統</chinese-title>  
        <english-title>METHODS, DEVICES, EQUIPMENT, AND SYSTEMS FOR POWER SAVING OF ACCESS POINTS IN WLAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/02</main-classification>  
        <further-classification edition="200901120251201B">H04W88/08</further-classification>  
        <further-classification edition="200901120251201B">H04W84/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖后飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, HOUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宗釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, ZONGZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種WLAN中接入點節能的方法、裝置、設備和系統，屬於通信技術領域。該方法應用於WLAN中的第一接入點，第一接入點決策WLAN中其他接入點的節能機制，並且指示該其他接入點進行節能，因此，能夠降低WLAN中接入點的功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method, device, equipment, and system for power saving of access points in a WLAN, which belongs to the field of communication technology. The method is applied to a first access point in the WLAN, where the first access point decides the power-saving mechanism for other access points in the WLAN and instructs these other access points to perform power-saving operations. As a result, it is possible to reduce the power consumption of access points in the WLAN.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S61、S62、S63:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1195" publication-number="202620891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用數位療法治療精神狀況的系統與方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR TREATING A MENTAL CONDITION USING A DIGITAL THERAPEUTIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260214B">G16H20/70</main-classification>  
        <further-classification edition="200601120260214B">A61B5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商大塚精密健康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA PRECISION HEALTH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商克里克療法有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLICK THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛比斯　安素</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORBES,AINSLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡本特　丹尼爾　克立夫敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARPENTER, DANIEL CLIFTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼曲尼娃斯卡　舒魯斯曼　馬爾戈札塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHNIEWSKA-SCHLUSSMAN,MALGORZATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥西　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYSEL,JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施恩　潔西卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHEIN,JESSICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班薩爾　洛西特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANSAL,ROHIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈邁德　伊曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHMED,IMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡西雅拓爾　瑞娜塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CACCIATORE,RENATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於使用一數位療法(DTx)治療一精神疾病之方法及系統。例如，一治療方法可包含由該DTx根據一治療排程施用複數個情緒臉孔記憶任務(EFMT)，其中該複數個EFMT經分組成界定將在一給定天期間完成之總數目個EFMT之一層級。該層級包含複數個位準。各位準包含各自複數個回合且在EFMT之一給定天中不重複但在該治療排程中之另一天中重複。各回合包含將在該回合期間施用之來自該複數個EFMT中之各自一組EFMT。該治療方法可進一步包含基於一先前回合中之患者之一效能動態調整相同位準內之一N位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for treating a mental disorder using a digital therapeutic (DTx) are described. For example, a treatment method may include administering, by the DTx, a plurality of emotional face memory tasks (EFMTs) according to a treatment schedule in which the plurality of EFMTs are grouped into a hierarchy that defines a total number EFMTs to be completed during a given day. The hierarchy includes a plurality of levels. Each level includes a respective plurality of rounds and is not repeated in a given day of EFMTs but is repeated in another day in the treatment schedule. Each round includes a respective set of EFMTs, from among the plurality of EFMTs, that are to be administered during the round. The treatment method may further include dynamically adjusting, within the same level an N-level based on a performance of the patient in a prior round.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:數位療法(DTx)</p>  
        <p type="p">102:療法內容</p>  
        <p type="p">104:記憶任務練習(EFMT)</p>  
        <p type="p">106:心理治療課程</p>  
        <p type="p">108:傳訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1196" publication-number="202620999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電動車輛充電之電動車通訊控制器</chinese-title>  
        <english-title>ELECTRIC VEHICLE COMMUNICATION CONTROLLER FOR CHARGING ELECTRIC VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H02J7/40</main-classification>  
        <further-classification edition="201901120260223B">B60L53/30</further-classification>  
        <further-classification edition="201901120260223B">B60L53/60</further-classification>  
        <further-classification edition="201901120260223B">B60L53/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車大榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, DAE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於為電動車輛充電的電動車輛通訊控制器，包含：一供電模組，用於在供電模式下將一第一脈寬調變（PWM）訊號傳輸至一受電裝置；一充電模組，用於在充電模式下接收來自一供電裝置的一第二PWM訊號；一主控制器，配置用於控制該供電模組與該充電模組； 以及一子控制器，用於喚醒該主控制器，其中該充電模組包含分配該第二PWM訊號電壓的一電阻單元，以及連接至該電阻單元的一切換單元，以及該切換單元於睡眠狀態下開啟，於供電模式的有效狀態下關閉，並於充電模式的有效狀態下開啟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric vehicle communication controller for charging an electric vehicle according to one embodiment of the present invention includes a supply module for a supply mode in which a first pulse wide modulation (PWM) signal is transmitted to a power receiving device, a charging module for a charging mode in which a second PWM signal is received from a power supply device, a main controller configured to control the supply module and the charging module, and a sub-controller configured to wake up the main controller, wherein the charging module includes a resistor unit that distributes a voltage of the second PWM signal, and a switching unit connected to the resistor unit, and the switching unit is turned on in a sleep state, the switching unit is turned off in the supply mode in an active state, and the switching unit is turned on in the charging mode in the active state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121:電源</p>  
        <p type="p">122:第一脈寬調變產生器</p>  
        <p type="p">141:子控制器</p>  
        <p type="p">142:主控制器</p>  
        <p type="p">143:電力管理整合晶片</p>  
        <p type="p">600:第一電動車</p>  
        <p type="p">800:第二電動車</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1197" publication-number="202621000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電動車輛之電動車通訊控制器及其充電控制方法</chinese-title>  
        <english-title>ELECTRIC VEHICLE COMMUNICATION CONTROLLER FOR ELECTRIC VEHICLE AND CHARGING CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H02J7/40</main-classification>  
        <further-classification edition="201901120260223B">B60L53/68</further-classification>  
        <further-classification edition="201901120260223B">B60L53/60</further-classification>  
        <further-classification edition="201901120260223B">B60L53/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申桄燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KWANG SEOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適用於電動車的電動車通訊控制器，包含：一主控制器，設定連接至一第一充電埠與一第二充電埠；以及一通訊數據機，設定連接至該第一充電埠與該第二充電埠，並設置於該第一充電埠與該第二充電埠之間及該主控制器之間，其中一第一充電器設定連接至該第一充電埠，一第二充電器設定連接至該第二充電埠。當該第一充電器連接至該第一充電埠時，該主控制器依據一第一充電協議執行充電程序，該通訊數據機依據該第一充電協議執行通訊程序；當該第二充電器連接至該第二充電埠時，該主控制器依據與該第一充電協議不同的一第二充電協議執行充電程序，該通訊數據機依據該第二充電協議執行通訊程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric vehicle communication controller for an electric vehicle according to one embodiment of the present invention includes a main controller set to be connected to a first charging port and a second charging port, and a communication modem set to be connected to the first charging port and the second charging port and disposed between the first charging port and the second charging port and the main controller, wherein a first charger is set to be connected to the first charging port, and a second charger is set to be connected to the second charging port , when the first charger is connected to the first charging port, the main controller performs a charging procedure according to a first charging protocol, and the communication modem operates according to a first communication protocol, and when the second charger is connected to the second charging port, the main controller performs a charging procedure according to a second charging protocol that is different from the first charging protocol, and the communication modem operates according to a second communication protocol that is different from the first communication protocol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">410:第一充電埠</p>  
        <p type="p">420:第二充電埠</p>  
        <p type="p">1270:通訊數據機</p>  
        <p type="p">1400S:第一切換元件</p>  
        <p type="p">1400T:第一變壓器</p>  
        <p type="p">1410S:第二切換元件</p>  
        <p type="p">1410T:第二變壓器</p>  
        <p type="p">P1:第一腳位</p>  
        <p type="p">P2:第二腳位</p>  
        <p type="p">RX_1:第一接收埠</p>  
        <p type="p">RX_2:第二接收埠</p>  
        <p type="p">TX_1:第一傳輸埠</p>  
        <p type="p">TX_2:第二傳輸埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1198" publication-number="202620154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫時固定用接著劑組成物、積層體、構件的暫時固定方法及去除方法</chinese-title>  
        <english-title>TEMPORARY FIXING ADHESIVE COMPOSITION, LAMINATE, TEMPORARY FIXING METHOD FOR MEMBER, AND REMOVAL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09J11/06</main-classification>  
        <further-classification edition="200601120260223B">C09J201/06</further-classification>  
        <further-classification edition="200601120260223B">B32B7/12</further-classification>  
        <further-classification edition="200601120260223B">B32B37/12</further-classification>  
        <further-classification edition="200601120260223B">B32B43/00</further-classification>  
        <further-classification edition="200601120260223B">B08B3/08</further-classification>  
        <further-classification edition="202601120260223B">H10P70/00</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸崎広一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSAKI, KOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪口豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGUCHI, GO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏倉真人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIWAKURA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種暫時固定用接著劑，其具有對具有凹凸的結構的追隨性（段差追隨性）、高耐熱性（耐回流性）及雷射剝離性，能夠抑制支撐體剝離後的基板翹曲，溶媒去除性優異且具有對暫時固定用接著劑去除後的構件上形成的電極的良好的焊接性，並且提供一種使用所述暫時固定用接著劑的構件的暫時固定方法及去除方法。本揭示的暫時固定用接著劑組成物含有樹脂（A）、以及有機金屬化合物（B），樹脂（A）包含醇性羥基及酚性羥基中的至少一者，且是使用熱重量示差熱分析在大氣氣氛下以10℃/分鐘的速度升溫時的、相對於加熱前的質量而言的質量減少率成為5%的溫度為280℃～550℃的樹脂，甲苯或環己酮或N-甲基吡咯啶酮浸漬後的膜的厚度減少率（R）為95%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支撐體</p>  
        <p type="p">2:暫時固定用接著劑層</p>  
        <p type="p">3:構件</p>  
        <p type="p">4:積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1199" publication-number="202620318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>進動運動式減速或增速裝置</chinese-title>  
        <english-title>PRECESSIONAL MOTION SPEED-REDUCING OR SPEED-INCREASING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F16H1/32</main-classification>  
        <further-classification edition="200601120260223B">F16H55/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＨＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤秀生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫛田孝太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSHIDA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成田幸弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARITA, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可擴大負載容量之進動運動式減速或增速裝置。 &lt;br/&gt;本發明之進動運動式減速或增速裝置具備有：第1面齒輪(1)；及第2面齒輪(2)，其與第1面齒輪(1)嚙合並進行進動運動；其中，互相嚙合之第1面齒輪(1)的齒(21)的齒面(21a)與第2面齒輪(2)的齒(22)的齒面(22a)中任一者形成為凹面，而另一面形成為凸面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A precessional motion speed-reducing or speed-increasing device capable of expanding load capacity is provided. &lt;br/&gt;The precessional motion speed-reducing or speed-increasing device of the invention comprises: a first face gear (1); and a second face gear (2), which meshes with the first face gear (1) and performs precessional motion; wherein one of the tooth surfaces (21a) of the tooth (21) of the first face gear (1) and the tooth surfaces (22a) of the tooth (22) of the second face gear (2), which mesh with each other, is formed as a concave surface, and the other is formed as a convex surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第1面齒輪</p>  
        <p type="p">2:第2面齒輪</p>  
        <p type="p">21:齒</p>  
        <p type="p">21a:齒面</p>  
        <p type="p">21b:齒頂部</p>  
        <p type="p">21c:齒底部</p>  
        <p type="p">22:齒</p>  
        <p type="p">22a:齒面</p>  
        <p type="p">22b:齒頂部</p>  
        <p type="p">22c:齒底部</p>  
        <p type="p">23:避讓間隙</p>  
        <p type="p">24:嚙合位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1200" publication-number="202620264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維機械</chinese-title>  
        <english-title>TEXTILE MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">D02J1/22</main-classification>  
        <further-classification edition="200601120260203B">D01D10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMT MACHINERY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒木峻平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, SHUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島匠吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米倉踏青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKURA, TOSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明提供一種纖維機械，以簡單的結構，即使不確認絲線的品質也對是否需要進行導絲器的更換等的判斷進行輔助。 &lt;br/&gt;　　[解決手段] 紡絲牽引設備(1)具備：引導行進的絲線(Y)的導絲器(31)、及檢測部(32)。導絲器(31)具有：內層部(41)及用於供絲線(Y)接觸的表層部(42)。表層部(42)由具有與內層部(41)的材料的導電率不同的導電率的材料形成，並且配置為覆蓋內層部(41)的至少一部分。檢測部(32)與導絲器(31)電連接。檢測部(32)能夠檢測與導絲器(31)各自的帶電量相關的資訊也就是帶電資訊。表層部(42)的材料的導電率比內層部(41)的材料的導電率更高。表層部(42)與檢測部(32)直接電連接，內層部(41)經由表層部(42)而與檢測部(32)電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to assist in determining whether the replacement, etc. of a yarn guide is necessary, with a simple structure and without checking of the quality of a yarn. &lt;br/&gt;A spun yarn take-up system 1 includes a yarn guide 31 configured to guide a running yarn Y and a detection unit 32. The yarn guide 31 includes an inner layer part 41 and a surface layer part 42 provided for the contact with the yarn Y. The surface layer part 42 is made of a material whose conductivity is different from the conductivity of a material of the inner layer part 41, and located so as to cover at least a part of the inner layer part 41. The detection unit 32 is electrically connected to the yarn guide 31. The detection unit 32 is able to detect charging information which is information regarding an electric charge amount of each yarn guide 31. The conductivity of the material of the surface layer part 42 is higher than that of the material of the inner layer part 41. The surface layer part 42 is electrically and directly connected to the detection unit 32, and the inner layer part 41 is electrically connected to the detection unit 32 via the surface layer part 42.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:支點導絲器(第2導絲器)</p>  
        <p type="p">22:橫動導絲器</p>  
        <p type="p">30:更換判斷系統</p>  
        <p type="p">31:導絲器</p>  
        <p type="p">32:檢測部</p>  
        <p type="p">33:控制部(顯示資訊生成部、顯示控制部、判斷部、微分資訊生成部、通知控制部)</p>  
        <p type="p">34:顯示部(通知部)</p>  
        <p type="p">41:內層部</p>  
        <p type="p">41a:周面</p>  
        <p type="p">41b:端面</p>  
        <p type="p">42:表層部</p>  
        <p type="p">42a:周面</p>  
        <p type="p">Y:絲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1201" publication-number="202619940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於海上交通工具之負載重新定位系統</chinese-title>  
        <english-title>PAYLOAD RE-POSITIONING SYSTEM FOR A MARITIME VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">B63G13/00</main-classification>  
        <further-classification edition="200601120260214B">B63B11/02</further-classification>  
        <further-classification edition="200601120260214B">B63B43/18</further-classification>  
        <further-classification edition="202001120260214B">B63B79/10</further-classification>  
        <further-classification edition="202001120260214B">B63B79/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商薩羅尼克科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARONIC TECHNOLOGIES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德沃夏克　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DVORAK, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一海上交通工具之負載重新定位系統，該海上交通工具包含具有一第一部分及一第二部分之一船體。該海上交通工具包含安置於該第二部分內之一負載。該第一部分可包含一撞擊區及一可壓縮區。該撞擊區經配置以接合該海上交通工具外部之一目標。該可壓縮區經配置以回應於該撞擊區接合該外部目標而將該第一部分之初始長度減小至一壓縮長度，從而減小該負載與該撞擊區之間的一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A payload re-positioning system for a maritime vehicle that includes a hull having a first portion and a second portion. The maritime vehicle includes a payload disposed within the second portion. The first portion may include an impact zone and a compressible zone. The impact zone is arranged to engage a target external to the maritime vehicle. The compressible zone is arranged to reduce the initial length of the first portion to a compressed length in response to the impact zone engaging the target external, thereby reducing a distance between the payload and the impact zone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:海上交通工具</p>  
        <p type="p">204:船體</p>  
        <p type="p">205a:第一部分</p>  
        <p type="p">205b:第二部分</p>  
        <p type="p">206:負載</p>  
        <p type="p">207:艙壁</p>  
        <p type="p">208:引擎</p>  
        <p type="p">210:燃料槽</p>  
        <p type="p">212:電系統</p>  
        <p type="p">214a:控制器</p>  
        <p type="p">214b:感測器系統</p>  
        <p type="p">214c:通信系統</p>  
        <p type="p">214d:數位及/或類比處理器</p>  
        <p type="p">214e:記憶體</p>  
        <p type="p">252:總長度</p>  
        <p type="p">254:總高度</p>  
        <p type="p">262:船艏</p>  
        <p type="p">264:船艉</p>  
        <p type="p">266:龍骨</p>  
        <p type="p">268:頂部</p>  
        <p type="p">272:第一長度</p>  
        <p type="p">274:第二長度</p>  
        <p type="p">282:表面</p>  
        <p type="p">284:吃水深</p>  
        <p type="p">286:出水高</p>  
        <p type="p">290:目標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1202" publication-number="202621231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有排放式儲液槽的一體式水冷系統</chinese-title>  
        <english-title>ALL-IN-ONE LIQUID COOLING SYSTEM WITH A BLEED-IN RESERVOIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商捷控技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JETCOOL TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈伯　Ｌ　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABER, LUDWIG C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里修克　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRISCHUK, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯維尼　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEENEY, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯基亞諾　艾蓮娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIANO, ALAINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯爾　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOELLE, JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容描述一種用於電子裝置之水冷系統，其包括排放式儲液槽，該排放式儲液槽經組態以促進自循環液體冷卻劑分離及移除夾帶氣體。該排放式儲液槽經由並聯分支流體地連接至冷卻系統之主冷卻迴路，該並聯分支包含較小直徑的流體導管，以確保與通過該主冷卻迴路之流動速率相比，通過該並聯分支的液體冷卻劑之流動速率減小。該排放式儲液槽包括內部腔室，該內部腔室經組態以接收及容納液體冷卻劑及可壓縮氣體體積，且可併入有內部流量調節特徵（諸如分流器、擋板或穿孔板），以增加滯留時間、誘發湍流且增強氣液分離。沿著內部腔室壁之垂直高度策略性置放入口埠及出口埠，利用該氣體之浮力性質來促進重力分離效果。在一些具體實例中，多個排放式儲液槽可沿著該並聯分支串聯連接以提高氣體處置能力。所揭示之系統藉由逐漸地自該水冷系統移除氣體而不損害該主冷卻迴路中之壓力要求來改良熱效能、延長操作壽命及減少維護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling system for an electronic device includes a bleed-in reservoir configured to facilitate the separation and removal of entrained gases from a circulating liquid coolant. The bleed-in reservoir is fluidly connected to the main cooling loop of the cooling system via a parallel branch comprising smaller-diameter fluid conduits to ensure a reduced flow rate of liquid coolant through the parallel branch compared to the flow rate through the main cooling loop. The bleed-in reservoir includes an internal chamber configured to receive and hold liquid coolant and a compressible gas volume, and may incorporate internal flow modifying features, such as flow diverters, baffles or perforated plates, to increase residence time, induce turbulence, and enhance gas-liquid separation. Strategic placement of the inlet and outlet ports along the vertical height of the internal chamber walls promotes gravitational separation by leveraging the buoyancy properties of the gas. In some embodiments, multiple bleed-in reservoirs may be connected in series along the parallel branch to increase gas handling capacity. The disclosed system improves thermal performance, extends operational lifespan, and reduces maintenance by progressively removing gas from the liquid cooling system without compromising pressure requirements in the main cooling loop.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:冷卻模組</p>  
        <p type="p">107:產熱電子裝置</p>  
        <p type="p">110:泵</p>  
        <p type="p">115:散熱器</p>  
        <p type="p">130:導管/流動迴路</p>  
        <p type="p">200:AIO冷卻系統</p>  
        <p type="p">220:排放式儲液槽</p>  
        <p type="p">230:次要流體導管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1203" publication-number="202619922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵道車輛用車廂連接罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B61D17/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商西川橡膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA RUBBER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田知城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上寬和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤永次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今枝隆浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAEDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSHIMA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋健悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種構造簡單、富有柔軟性及剛性、可長期使用的鐵道車輛用車廂連接罩。 &lt;br/&gt;本發明之解決手段在於：自外側將鐵道車輛100之前側車體101與後側車體102之間的連結部103從屋頂至左右側面連續地覆蓋，在包圍車輛100之外周方向配置複數個車廂連接罩體111，車廂連接罩體111之前側及後側分別固定於前側車體101與後側車體102的鐵道車輛用車廂連接罩110中，車廂連接罩體111係橡膠樣彈性體且背面側開口，且其為由表面112、前面113及後面114、第一面115及第二面116構成的框體，在第一面115與第二面116之間，一體成形有自表面112向車內側垂直地突出之波型形狀的複數個中肋131、132。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:車廂連接罩體</p>  
        <p type="p">112:表面</p>  
        <p type="p">112a:上表面</p>  
        <p type="p">112b:下表面</p>  
        <p type="p">115:第一面</p>  
        <p type="p">116:第二面</p>  
        <p type="p">131A:第一中肋</p>  
        <p type="p">132A:第二中肋</p>  
        <p type="p">141,142:突起部</p>  
        <p type="p">K:貫通傷痕</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1204" publication-number="202619691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合特徵的淨模製透鏡</chinese-title>  
        <english-title>NET-SHAPE MOLDED LENSES WITH INTEGRATION FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">A61F2/16</main-classification>  
        <further-classification edition="200601120260214B">G02B27/01</further-classification>  
        <further-classification edition="200601120260214B">G02C9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿迪馬　丹尼爾羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEMA, DANIEL ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞克斯　尼歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICKS, NEAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊梅爾斯　達倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHMELS, DARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大東和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例包括一種眼科透鏡和形成該眼科透鏡的方法，如本文所示及描述。該眼科透鏡包括波導、世界側（WS）透鏡、將WS透鏡固定到波導上的WS黏合劑、WS透鏡與波導之間的WS氣隙、眼側（ES）透鏡、將ES透鏡固定到波導上的ES黏合劑，以及ES透鏡與波導之間的ES氣隙。WS黏合劑具有WS厚度，WS氣隙具有WS氣隙距離。WS氣隙距離大於WS黏合劑厚度。ES黏合劑具有ES厚度，而ES氣隙具有ES氣隙距離。ES氣隙距離大於WS黏合劑厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments includes an ophthalmic lens and a method of forming the ophthalmic lens, as shown and described herein. The ophthalmic lens includes a waveguide, world-side (WS) lens, a WS adhesive securing the WS lens to the waveguide, a WS air gap between the WS lens and the waveguide, an eye-side (ES) lens, an ES adhesive securing the ES lens to the waveguide, and an ES air gap between the ES lens and the waveguide. The WS adhesive has a WS thickness and the WS air gap has a WS air gap distance. The WS air gap distance is greater than the WS adhesive thickness. The ES adhesive having an ES thickness and the ES air gap has an ES air gap distance. The ES air gap distance is greater than the WS adhesive thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:波導</p>  
        <p type="p">200:眼科透鏡</p>  
        <p type="p">202:ES透鏡</p>  
        <p type="p">204:世界側(WS)透鏡</p>  
        <p type="p">206:眼側(ES)黏合劑</p>  
        <p type="p">208:世界側(WS)黏合劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1205" publication-number="202620270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用來自使用完畢之吸收性物品之漿泥纖維資材來製造漿泥纖維之方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">D21C5/02</main-classification>  
        <further-classification edition="202201120260223B">B09B3/80</further-classification>  
        <further-classification edition="200601120260223B">B09B5/00</further-classification>  
        <further-classification edition="202201320260223B">B09B101/67</further-classification>  
        <further-classification edition="202201320260223B">B09B101/75</further-classification>  
        <further-classification edition="202201320260223B">B09B101/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西孝義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下晃吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案發明提供一種製造漿泥纖維之方法，其係能夠從來自使用完畢之吸收性物品之漿泥纖維資材得到品質較高之漿泥纖維。 &lt;br/&gt;　　本發明為使用來自使用完畢之吸收性物品之漿泥纖維資材來製造漿泥纖維之方法。本方法具備: &lt;br/&gt;　　準備包含漿泥纖維與雜質之漿泥纖維資材，且雜質包含經多價金屬離子交聯之高吸水性聚合物、塑膠及多價金屬之準備步驟(S1)，與 &lt;br/&gt;　　在水中從漿泥纖維資材分離高吸水性聚合物之第1分離步驟(S3)，與 &lt;br/&gt;　　在有機酸水溶液中從第1分離步驟(S3)之後之漿泥纖維資材分離塑膠及多價金屬，得到漿泥纖維之第2分離步驟(S4)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:準備步驟</p>  
        <p type="p">S2:分解步驟</p>  
        <p type="p">S3:第1分離步驟</p>  
        <p type="p">S4:第2分離步驟</p>  
        <p type="p">S5:脫水步驟</p>  
        <p type="p">S6:氧化劑處理步驟</p>  
        <p type="p">S7:乾燥步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1206" publication-number="202620274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>百葉天花板裝置及百葉天花板裝置之安裝方法</chinese-title>  
        <english-title>LOUVER CEILING DEVICE AND INSTALLATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">E04F19/02</main-classification>  
        <further-classification edition="200601120260203B">E04F10/08</further-classification>  
        <further-classification edition="200601120260203B">E04B9/36</further-classification>  
        <further-classification edition="200601120260203B">E06B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下住空間股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC HOUSING SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村剛一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, GOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之百葉天花板裝置1包含：中空管狀的百葉材10；以往下方側凸出之狀態裝設於天花板側的安裝對象2，並貫通設於該百葉材之上壁部11之穿通孔11a的銷狀構件4；及從該百葉材之長邊方向端部之開口插入該百葉材內，並包含卡扣於該銷狀構件的卡扣部15，及在該卡扣部卡扣於該銷狀構件的狀態下抵接於該百葉材之上壁部的固持部18的百葉固持構件14。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A louver ceiling device 1 includes a hollow cylindrical louver member 10, a pin-shaped member 4 that is attached while protruding downward with respect to the ceiling side mounting target 2 and is inserted into a through hole 11a formed in the upper wall portion 11 of the louver member, and a louver holding member 14 which is inserted in the louver member through an opening of the end portion in the longitudinal direction of the louver member and has a holding portion 18 that abuts against the upper wall portion of the louver member while a locking portion 15 that is locked to the pin-shaped member and the locking portion are locked to the pin-shaped member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:百葉天花板裝置</p>  
        <p type="p">3:緊固件(柱狀構件)</p>  
        <p type="p">3a:支持部</p>  
        <p type="p">4:銷狀構件</p>  
        <p type="p">5:管狀構件</p>  
        <p type="p">6:中央側部位</p>  
        <p type="p">7:上側大徑部</p>  
        <p type="p">8:下側大徑部</p>  
        <p type="p">10:百葉材</p>  
        <p type="p">11:上壁部</p>  
        <p type="p">11a:穿通孔</p>  
        <p type="p">11b:貫通孔</p>  
        <p type="p">12:側壁部</p>  
        <p type="p">13:下壁部</p>  
        <p type="p">14:百葉固持構件</p>  
        <p type="p">15:卡扣部</p>  
        <p type="p">16:夾持片部</p>  
        <p type="p">17:固持空間</p>  
        <p type="p">18:固持部</p>  
        <p type="p">18a:上板部</p>  
        <p type="p">18b:中間板部</p>  
        <p type="p">18c:下板部</p>  
        <p type="p">18d:端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1207" publication-number="202620080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空樹脂粒子及其用途</chinese-title>  
        <english-title>HOLLOW RESIN PARTICLES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08F212/36</main-classification>  
        <further-classification edition="200601120260203B">C08F2/18</further-classification>  
        <further-classification edition="200601120260203B">C08F2/44</further-classification>  
        <further-classification edition="200601120260203B">B01J13/14</further-classification>  
        <further-classification edition="200601120260203B">C08J3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">依本發明之實施型態所得到的中空樹脂粒子係具有殼體部及被該殼體部所包圍的中空部分，且平均粒徑為0.1μm至1μm，在該中空樹脂粒子中，圓形度為0.97以上，且以個數基準計粒徑為5μm以上之粗大粒子的比率係小於5%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Hollow resin particles according to an embodiment of the present invention have a shell portion and a hollow portion surrounded by the shell portion, with an average particle diameter of 0.1 μm to 1 μm. The circularity of the hollow resin particles is 0.97 or more, and the ratio of coarse particles, which have a particle diameter of 5 μm or more on a number basis, is less than 5%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1208" publication-number="202620275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有滑動把手的閂鎖總成</chinese-title>  
        <english-title>LATCHING ASSEMBLY WITH SLIDE HANDLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">E05B1/04</main-classification>  
        <further-classification edition="200601120260214B">E05B3/06</further-classification>  
        <further-classification edition="200601120260214B">E05B63/00</further-classification>  
        <further-classification edition="200601120260214B">E05B15/04</further-classification>  
        <further-classification edition="200601120260214B">E05B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞薩亞布羅美國地區股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSA ABLOY AMERICAS RESIDENTIAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王斌果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林辛朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XINPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛米羅　歐斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMERO, OSCAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格托羅傑　悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGTOROJ, YOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法拉格　漢娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARAG, HANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張杰克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一門之把手總成包含一把手、一鎖眼蓋板、一驅動總成及一傳動總成。該鎖眼蓋板經構形以安裝至該門之一面。該傳動總成包含一彈簧、壓縮支架及一閂鎖小齒輪。該驅動總成之至少一部分自該把手延伸穿過該鎖眼蓋板且至該傳動總成中以接觸該壓縮支架。該把手可在平行於該門之該面之一滑動方向上在一閂鎖位置與一解鎖位置之間滑動。該把手朝向該閂鎖位置偏置且該傳動總成耦合至一閂鎖總成以延伸及縮回一鎖閂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A handle assembly for a door includes a handle, an escutcheon plate, a drive assembly, and a transmission assembly. The escutcheon plate is configured to mount to a face of the door. The transmission assembly includes a spring, compression bracket, and a latch pinion. At least a portion of the drive assembly extends from the handle through the escutcheon plate and into the transmission assembly contacting the compression bracket. The handle is slidable in a slide direction parallel to the face of the door between a latched position and an unlatched position. The handle is biased towards the latched position and the transmission assembly is coupled to a latch assembly for extension and retraction of a latch bolt.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:把手總成</p>  
        <p type="p">502:鎖眼蓋板</p>  
        <p type="p">506:後面</p>  
        <p type="p">514:鎖芯</p>  
        <p type="p">516:把手</p>  
        <p type="p">518:第一端</p>  
        <p type="p">520:第二端</p>  
        <p type="p">522:驅動總成</p>  
        <p type="p">524:傳動總成</p>  
        <p type="p">526:緊固件</p>  
        <p type="p">528:壓縮支架</p>  
        <p type="p">530:第一把手座</p>  
        <p type="p">532:第二把手座</p>  
        <p type="p">534:握持部</p>  
        <p type="p">536:對準板</p>  
        <p type="p">538:驅動臂</p>  
        <p type="p">540:輥子</p>  
        <p type="p">542:固定把手座</p>  
        <p type="p">544:偏置構件</p>  
        <p type="p">546:緊固件</p>  
        <p type="p">547:緊固件</p>  
        <p type="p">548:開口</p>  
        <p type="p">550:樞轉銷</p>  
        <p type="p">552:第一端</p>  
        <p type="p">554:第二端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1209" publication-number="202619861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動作程式生成系統</chinese-title>  
        <english-title>OPERATION PROGRAM GENERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B25J9/16</main-classification>  
        <further-classification edition="200601120260202B">G05B19/4155</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本間敏行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOMMA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本武司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓮沼仁志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASUNUMA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末元大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEMOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本多文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動作程式生成系統，係具備：任務接受部，係接受用以執行要藉由機器人的動作而使其進行作業的任務之任務資訊的輸入；以及動作程式生成部，係設定從預先記憶且含有程式之要素的複數個技能資訊中所選擇的至少一個技能資訊而據此生成機器人的動作程式，以使機器人執行由任務接受部所輸入之任務資訊的任務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This operation program generation system includes: a task reception unit that receives input of task information for executing tasks that cause the robot to perform work through its operation; and an operation program generation unit that generates the robot’s operation program based on setting at least one piece of skill information selected from multiple pieces of skill information that are including elements of program and stored in advance, in order to cause the robot to execute the task of the task information input by the task reception unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器人</p>  
        <p type="p">11:動作程式</p>  
        <p type="p">20:電腦</p>  
        <p type="p">21:控制部</p>  
        <p type="p">22:顯示部</p>  
        <p type="p">23:輸入部</p>  
        <p type="p">30:伺服器</p>  
        <p type="p">31:控制部</p>  
        <p type="p">32:記憶部</p>  
        <p type="p">32a:任務資訊</p>  
        <p type="p">32b:技能資訊</p>  
        <p type="p">32c:模擬程式</p>  
        <p type="p">40:電腦</p>  
        <p type="p">50:電腦</p>  
        <p type="p">60:電腦</p>  
        <p type="p">100:動作程式生成系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1210" publication-number="202620983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器殼體組件和連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260202B">H01R13/6461</main-classification>  
        <further-classification edition="201101120260202B">H01R13/6471</further-classification>  
        <further-classification edition="200601120260202B">H01R13/652</further-classification>  
        <further-classification edition="200601120260202B">H01R13/436</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣東泰科電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS AMP GUANGDONG LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印度商泰連印度私有有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY INDIA PRIVATE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHICHENG (SEAN)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱敬濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JINGTAO (MURPHY)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LIANG (VINCENT)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JUN (HERBERT)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>Ｋ　拉克什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>K, RAKESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種連接器殼體組件和連接器。所述連接器殼體組件包括：殼體；和金屬板，設置在所述殼體中。當連接器的上排端子和下排端子被設置到所述殼體中時，所述金屬板位於所述上排端子和所述下排端子之間且與所述上排端子和所述下排端子不接觸，用於降低所述上排端子和所述下排端子之間的信號串擾。在本發明中，設置在殼體中的金屬板能夠有效地降低上排端子和下排端子之間的信號串擾，提高連接器的信號完整性。而且，金屬板的結構簡單，易於製造和安裝，從而能夠降低連接器的成本和提高連接器的製造效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">2:端子</p>  
        <p type="p">3:金屬板</p>  
        <p type="p">11:第一子腔體</p>  
        <p type="p">12:第二子腔體</p>  
        <p type="p">21:上排端子</p>  
        <p type="p">22:下排端子</p>  
        <p type="p">41:上保持體</p>  
        <p type="p">42:下保持體</p>  
        <p type="p">51:上鎖定塊</p>  
        <p type="p">52:下鎖定塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1211" publication-number="202620675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>認證裝置、認證方法、認證電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260209B">G06F21/31</main-classification>  
        <further-classification edition="201301120260209B">G06F21/34</further-classification>  
        <further-classification edition="200601120260209B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＴＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村宇利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係解決因分配給使用者之獨有之共通編號被竊取所產生之使用者之個人資訊被盜用之問題。使用者終端係生成一次性密碼資料（S1104）。使用者將一次性密碼資料及個人資訊提交給要求裝置（S1106、S1301）。要求裝置係將一次性密碼資料及個人資訊傳送至認證裝置（S1302、S1206）。認證裝置係生成一次性密碼資料（S1205）。認證裝置係一判定一次性密碼資料為合法、而且個人資訊為合法（S1207），即生成認證資料並將其傳送至要求裝置（S1208、S1209、S1303）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1101:讀取使用者ID資料</p>  
        <p type="p">S1102:傳送使用者ID資料</p>  
        <p type="p">S1103:接收使用者認證資料</p>  
        <p type="p">S1104:生成一次性密碼資料</p>  
        <p type="p">S1105:將一次性密碼顯示於顯示器</p>  
        <p type="p">S1106:提交一次性密碼與個人資訊</p>  
        <p type="p">S1201:接收使用者ID資料</p>  
        <p type="p">S1202:使用者認證</p>  
        <p type="p">S1203:生成使用者認證資料</p>  
        <p type="p">S1204:傳送使用者認證資料</p>  
        <p type="p">S1205:生成一次性密碼資料</p>  
        <p type="p">S1206:接收一次性密碼與個人資訊</p>  
        <p type="p">S1207:執行OTP判定與個人資訊判定</p>  
        <p type="p">S1208:生成認證資料等</p>  
        <p type="p">S1209:傳送認證資料等</p>  
        <p type="p">S1301:接收一次性密碼與個人資訊</p>  
        <p type="p">S1302:傳送一次性密碼與個人資訊</p>  
        <p type="p">S1303:接收認證資料等</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1212" publication-number="202620243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻液、補給液及銅配線的形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C23F1/18</main-classification>  
        <further-classification edition="200601120260102B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＭＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEC COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊崎航介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAZAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>油座菜菜子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUZA, NANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木敬子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, KEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種銅之蝕刻液，其包含酸、氧化性金屬離子源、含氮原子之聚合物、及水，於上述蝕刻液中，上述含氮原子之聚合物之濃度為1 g/L以上，且除上述酸、上述氧化性金屬離子源及上述水以外之成分中，上述含氮原子之聚合物之含有比率為10質量%以上。該銅之蝕刻液能夠對在膜厚較薄之銅層上圖案化有蝕刻阻劑之基板上，形成具有足夠之配線寬度且直線性優異之銅配線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1213" publication-number="202619809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頂部排水管之清潔工具及其使用方法</chinese-title>  
        <english-title>CLEANING TOOL FOR A ROOF DRAIN TUBE AND METHOD OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">B08B9/04</main-classification>  
        <further-classification edition="200601120260214B">B60S3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史奈普昂公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAP-ON INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉比　尼古拉斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABBEY, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一車輛頂部排水管之清潔工具，其包含：一可撓性管線；一把手，其具有第一及第二端以及介於其等之間之一內部通道；一管，其自該把手之該第一端延伸且終止於一工作端；及一可撓性尖端，其在管之該工作端上，經構形以鄰接該車輛排水管之一入口埠。該可撓性管線自該把手之該第二端延伸，穿過該把手之該內部通道及第一端，穿過該管，且穿過該可撓性尖端。該清潔工具亦包含該把手上之用於選擇性地接合該可撓性管線之一夾具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cleaning tool for a vehicle roof drain tube includes a flexible line, a handle having first and second ends and an interior channel therebetween, a tube extending from the first end of the handle and terminating at a work end, and a flexible tip on the work end of tube that is configured to abut an entry port of the vehicle drain tube. The flexible line extends from the second end of the handle, though the interior channel and first end of the handle, through the tube, and through the flexible tip. The cleaning tool also includes a clamp on the handle for selectively engaging the flexible line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:清潔工具</p>  
        <p type="p">102:可撓性管線</p>  
        <p type="p">104:障礙物接合端</p>  
        <p type="p">106:把手</p>  
        <p type="p">108:第一端</p>  
        <p type="p">110:第二端</p>  
        <p type="p">114:管</p>  
        <p type="p">118:彎曲</p>  
        <p type="p">120:可撓性尖端</p>  
        <p type="p">122:夾具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1214" publication-number="202620244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性組成物、使用其之蝕刻方法及半導體基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23F1/18</main-classification>  
        <further-classification edition="202601120260223B">H10P50/61</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾家俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIE, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舶紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於適合在具有含銅之種子層及含鐵合金之層的半導體基板之配線形成中使用之蝕刻用之水性組成物。本發明之水性組成物，係用於在具有含銅之種子層及含鐵合金之層的半導體基板之配線形成中蝕刻前述種子層，其特徵在於包含(A)過氧化氫及(B)有機酸，(A)過氧化氫與(B)有機酸之質量比(A)/(B)為0.04~20之範圍，pH值為0.5~5.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1215" publication-number="202620428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用細胞外囊泡之疾病檢查方法及診斷方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">G01N33/575</main-classification>  
        <further-classification edition="200601120260223B">G01N33/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＲＮＡｉ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RNAI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉谷卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMATANI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種透過以簡便的方法補足及回收細胞外囊泡(EV)，並迅速地以高精確度分析回收之細胞外囊泡(EV)的特性，來進行各種疾病的檢查及診斷之技術。 &lt;br/&gt;　　一種疾病檢查方法，其包含：步驟(a)，係由受試體的活體試樣補足及/或回收多個細胞外囊泡；步驟(b)，係檢出補足及/或回收之多個細胞外囊泡；及步驟(c)，係分析檢出之細胞外囊泡的形態， &lt;br/&gt;　　步驟(a)包含：步驟(a1)，係使細胞外囊泡吸附於包含基材與離子交換體且具有細胞外囊泡的吸附能力之固相載體；步驟(a2)，係標記吸附於固相載體之細胞外囊泡；及步驟(a3)，係將標記之細胞外囊泡在吸附於固相載體的狀態下進行洗淨。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1216" publication-number="202620391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用微製造的電阻溫度感測器之熱退火校準</chinese-title>  
        <english-title>THERMAL ANNEALING CALIBRATION USING MICROFABRICATED RESISTANCE TEMPERATURE SENSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01K7/16</main-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞特納爾　查爾斯　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETTNER, CHARLES THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴德　羅素　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDD, RUSSELL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋伯　巴克尼爾　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEBB, BUCKNELL C</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於使用微製造的電阻溫度感測器來校準熱退火程序(例如，雷射退火)之技術。舉例而言，一種裝置包含一基板及安置於該基板上之一電阻溫度感測器。該電阻溫度感測器包含一第一金屬與一第二金屬之交替金屬層之一堆疊，其中該第一金屬與該第二金屬為不同類型之金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques are provided for calibrating thermal annealing processes (e.g., laser annealing) using microfabricated resistance temperature sensors. For example, a device comprises a substrate, and a resistance temperature sensor disposed on the substrate. The resistance temperature sensor comprises a stack of alternating metal layers of a first metal and a second metal, wherein the first metal and the second metal are different types of metals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1B-1B:線</p>  
        <p type="p">100:基板</p>  
        <p type="p">101:第一電極</p>  
        <p type="p">102:第二電極</p>  
        <p type="p">110:微製造的電阻溫度感測器/電阻溫度感測器</p>  
        <p type="p">111:第一接觸襯墊</p>  
        <p type="p">112:第二接觸襯墊</p>  
        <p type="p">120:電阻導線</p>  
        <p type="p">121:第一導線部分</p>  
        <p type="p">122:第二導線部分</p>  
        <p type="p">123:第三導線部分</p>  
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:第一寬度</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1217" publication-number="202620666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於模型的查詢語句的生成方法、模型的訓練方法、裝置及電子設備</chinese-title>  
        <english-title>METHOD OF GENERATING QUERY STATEMENT BASED ON MODEL, TRAINING METHOD OF MODEL, AND APPARATUS AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">G06F16/3329</main-classification>  
        <further-classification edition="202501120251001B">G06F16/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瀅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉紅寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HONGBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾博軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AI, BOXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧河建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, HEJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供一種基於模型的查詢語句的生成方法、模型的訓練方法、裝置及電子設備。該基於模型的查詢語句的生成方法包括：獲取使用者輸入的查詢提問；其中，查詢提問，為多輪對話提問中的當前輪對話提問；根據查詢提問，和多輪對話提問中的歷史輪對話提問，確定查詢提問對應的查詢語句提示詞；其中，查詢語句提示詞，用於指示對查詢語句生成過程中所產生的歷史數據進行丟棄處理；將查詢語句提示詞輸入預構建的查詢語句生成大模型中，得到查詢提問對應的查詢語句。該方法用以達到提高查詢語句的生成的準確性的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present application provide a method of generating a query statement based on a model, a training method of the model, and an apparatus and an electronic device. The method of generating a query statement based on a model includes: acquiring a query question input by a user; where the query question is a dialogue question in a current round among dialogue questions in multiple rounds; determining a query statement prompt word corresponding to the query question, based on the query question and a historical dialogue question among the dialogue questions in the multiple rounds; where, the query statement prompt word is used to indicate to perform discarding of historical data generated during a generation process of the query statement; inputting the query statement prompt word into a pre-built large query statement generation model, to obtain a query statement corresponding to the query question. This method is used to improve the accuracy of the generated query statement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201、S202、S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1218" publication-number="202620073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性塗料組合物及塗膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">C08F120/20</main-classification>  
        <further-classification edition="200601120260212B">C08F2/40</further-classification>  
        <further-classification edition="200601120260212B">C08G18/16</further-classification>  
        <further-classification edition="200601120260212B">C09D5/16</further-classification>  
        <further-classification edition="202201120260212B">C09K23/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東楚股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口周人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, SHUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田斉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小山貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OYAMA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水性塗料組合物，其含有（A）多元醇、（B）具有親水性基之封閉型聚異氰酸酯（blocked polyisocyanate）、（C）封閉劑解離觸媒及（D）水，（A）成分的酸值為2～45mgKOH／g，（C）成分包含四級銨鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1219" publication-number="202621069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性驅動光學引擎及收發器</chinese-title>  
        <english-title>LINEAR DRIVE OPTICAL ENGINE AND TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260202B">H04B10/43</main-classification>  
        <further-classification edition="200601120260202B">G02B6/12</further-classification>  
        <further-classification edition="200601120260202B">G02B6/26</further-classification>  
        <further-classification edition="200601120260202B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＮＬＭ光電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NLM PHOTONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布斯　布拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOOTH, BRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈蒙德　斯科特　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMOND, SCOTT R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰遜　路易斯　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, LEWIS E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾瓦克　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVACK, ARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特雷申斯基　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRESHINSKY, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光子積體電路(PIC)包括：分光器，經組態以劃分輸入光信號；以及第一及第二矽有機混合(SOH)調變器，耦接至分光器。第一及第二SOH調變器各包括有機電光(OEO)材料。一種直接偵測強度調變(IMDD)收發器包括此類PIC及經組態以驅動第一及第二SOH調變器之電子積體電路(EIC)。相干收發器包括：分光器，經組態以將輸入雷射劃分成用於傳輸路徑及本地振盪器路徑之兩個輸出；PIC，在傳輸路徑上，包括第一IQ調變器及第二IQ調變器。第一IQ調變器包括第一及第二SOH調變器，且第二IQ調變器包括第三及第四SOH調變器。第一、第二、第三及第四SOH調變器各包括OEO材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photonic integrated circuit (PIC) includes a splitter configured to divide an input light signal and first and second silicon-organic hybrid (SOH) modulators coupled to the splitter. Each of the first and second SOH modulators includes an organic electro-optic (OEO) material. An intensity modulation with direct detection (IMDD) transceiver includes such a PIC and an electronic integrated circuit (EIC) configured to drive the first and second SOH modulators. A coherent transceiver includes a splitter configured to divide an input laser into two outputs for a transmission path and a local oscillator path, a PIC on the transmission path including a first IQ modulator and a second IQ modulator. The first IQ modulator includes first and second SOH modulators, and the second IQ modulator includes third and fourth SOH modulators. Each of the first, second, third, and fourth SOH modulators includes an OEO material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電光裝置/收發器</p>  
        <p type="p">102:光子積體電路(PIC)</p>  
        <p type="p">104:電光調變器/矽有機混合(SOH)調變器</p>  
        <p type="p">106:光源</p>  
        <p type="p">108:電子積體電路(EIC)</p>  
        <p type="p">120:傳輸器</p>  
        <p type="p">160:接收器</p>  
        <p type="p">162:光偵測器(PD)</p>  
        <p type="p">164:放大器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1220" publication-number="202621368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="201401120260223B">B23K26/352</further-classification>  
        <further-classification edition="201401120260223B">B23K26/062</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田凌司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠更適當地單片化之半導體裝置之製造方法及半導體裝置。本實施方式之半導體裝置之製造方法具備以下步驟：於半導體晶圓之第1面形成第1槽與第2槽，第1槽與第2槽係沿具有第1面及處於第1面之相反側之第2面的半導體晶圓之切割區域延伸且並排配置。又，本製造方法具備以下步驟：自半導體晶圓之第2面側，向自上方觀察時之第1槽與第2槽之間照射第1雷射光，藉此沿著切割區域於上述半導體晶圓內形成改質部。又，本製造方法具備以下步驟：藉由劈開半導體晶圓，而將半導體晶圓單片化為複數個半導體晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體基板</p>  
        <p type="p">110:功能膜</p>  
        <p type="p">120:壓縮應力</p>  
        <p type="p">130:結晶缺陷</p>  
        <p type="p">F1:面</p>  
        <p type="p">F2:面</p>  
        <p type="p">G:槽</p>  
        <p type="p">LM:改質部</p>  
        <p type="p">T:寬度</p>  
        <p type="p">W:半導體晶圓</p>  
        <p type="p">Wc:龜裂</p>  
        <p type="p">Wc1:龜裂Wc藉由右側之槽G之下方之壓縮應力120來變更前進路徑</p>  
        <p type="p">Wc2:龜裂Wc沿著左側之槽G之結晶缺陷130於Z方向上進展</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1221" publication-number="202621062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＴＨＺ訊號源的系統和方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR THZ SIGNAL SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04B1/04</main-classification>  
        <further-classification edition="200601120260202B">H04B1/00</further-classification>  
        <further-classification edition="200601120260202B">H04B1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛特頻股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATTOTUDE, INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾奇　大衛　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WELCH, DAVID F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　光燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUANG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉斯卡爾　喬伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASKAR, JOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施莫格羅　雷內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMOGROW, RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查克拉博蒂　蘇蒂普托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKRABORTY, SUDIPTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尊土寧　埃瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNTUNEN, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">網路元件及使用方法是包含一種發送器，其包括一用戶端輸入、訊號及時脈調節區塊、一調變區塊、以及天線。所述用戶端輸入接收具有用戶資料的基頻訊號。所述訊號調節區塊調整所述基頻訊號的訊號特徵以產生中間訊號。所述時脈調節區塊接收具有一第一時脈頻率的一第一時脈訊號，並且調整所述第一時脈訊號的訊號特徵以產生一第二時脈訊號，其具有所述第一時脈頻率的一諧波或非諧波頻率。所述調變區塊是將所述中間訊號調變到所述第二時脈訊號上以產生天線饋電訊號。所述天線根據所述天線饋電訊號來產生輻射訊號，並且將所述輻射訊號耦合到中空波導中。所述輻射訊號是輻射的電磁波，其經配置以用於在300吉赫（GHz）到10兆赫（THz）之間的範圍內的傳輸頻率下的同調偵測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Network elements and methods of use, including a transmitter comprising a client-side input, signal and clock conditioning blocks, a modulation block, and antennas. The client-side input receives baseband signals having client data. The signal conditioning block adjusts signal characteristics of the baseband signals to generate intermediate signals. The clock conditioning block receives a first clock signal having a first clock frequency and adjusts signal characteristics of the first clock signal to generate a second clock signal having a harmonic or nonharmonic frequency of the first clock frequency. The modulation block modulates the intermediate signals onto the second clock signal to generate antenna feed signals. The antennas generate radiated signals based on the antenna feed signals and couple the radiated signals into hollow waveguides. The radiated signals are radiated electromagnetic waves configured for coherent detection with a transmission frequency in a range between 300 Gigahertz (GHz) and 10 Terahertz (THz).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:傳輸網路</p>  
        <p type="p">204a:第一網路元件</p>  
        <p type="p">204b:第二網路元件</p>  
        <p type="p">204c:第三網路元件</p>  
        <p type="p">204d:第四網路元件</p>  
        <p type="p">208a:第一中空波導</p>  
        <p type="p">208b:第二中空波導</p>  
        <p type="p">208c:第三中空波導</p>  
        <p type="p">208d:第四中空波導</p>  
        <p type="p">212a:第一發送器</p>  
        <p type="p">212b:第二發送器</p>  
        <p type="p">216a:第一接收器</p>  
        <p type="p">216b:第二接收器</p>  
        <p type="p">220a:第一收發器</p>  
        <p type="p">224a:第一控制模組</p>  
        <p type="p">224b:第二控制模組</p>  
        <p type="p">224c:第三控制模組</p>  
        <p type="p">224d:第四控制模組</p>  
        <p type="p">228:通訊網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1222" publication-number="202621291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造記憶體單元的電晶體的系統和方法與半導體裝置</chinese-title>  
        <english-title>SYSTEMS AND METHODS OF FABRICATION OF TRANSISTOR OF MEMORY CELL AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/17</main-classification>  
        <further-classification edition="202501120260223B">H10D64/27</further-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿格拉瓦爾　尼迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRAWAL, NIDHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納戈　安東尼　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAGO, ANTHONY JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　時雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SIWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供製造記憶體單元的電晶體的系統和方法與半導體裝置。在一個或多個示例中，系統和方法包括形成電晶體的第一絕緣體、第二絕緣體、以及半導體通道；基於移除第一絕緣體的部分形成凹槽；在第一絕緣體的表面、第二絕緣體的表面、凹槽的表面、或半導體通道的表面中的至少一者之上形成介電層；在介電層之上形成第一金屬層；移除第一金屬層的第一部分；以及在凹槽中的第一金屬層上選擇性地形成第二金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are systems and methods of fabrication of a transistor of a memory cell and a semiconductor device. In one or more examples, the systems and methods include forming a first insulator, a second insulator, and a semiconductor channel of the transistor; forming a recess based on removing a portion of the first insulator; forming a dielectric layer over at least one of a surface of the first insulator, a surface of the second insulator, a surface of the recess, or a surface of the semiconductor channel; forming a first metal layer over the dielectric layer; removing a first portion of the first metal layer; and selectively forming a second metal layer on the first metal layer in the recess.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1005、1010、1015、1020、1025、1030:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1223" publication-number="202621155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>存取點之節能控制方法、裝置、設備及系統</chinese-title>  
        <english-title>POWER-SAVING CONTROL METHOD, DEVICE, EQUIPMENT, AND SYSTEM FOR ACCESS POINTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/02</main-classification>  
        <further-classification edition="200901120251201B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">發明提供一種存取點之節能控制方法、裝置、設備及系統，其是屬於通訊技術領域。在該方法中，第一存取點藉由節能控制訊息中的第二存取點的空間串流之數目、關斷能力或頻寬，指示第二存取點如何執行節能操作，以降低第二存取點的功率消耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an energy-saving control method, device, equipment, and system for access points, which belongs to the field of communication technology. In this method, the first access point indicates to the second access point how to perform energy-saving operations by using the number of spatial streams, power-off capability, or bandwidth in the energy-saving control message, thereby reducing the power consumption of the second access point.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1224" publication-number="202620063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組合物、感光性樹脂層和使用其的半導體裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08F2/44</main-classification>  
        <further-classification edition="200601120260223B">C08F2/50</further-classification>  
        <further-classification edition="200601120260223B">C08G73/12</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/027</further-classification>  
        <further-classification edition="200601120260223B">G03F7/031</further-classification>  
        <further-classification edition="200601120260223B">G03F7/038</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYEONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金尙洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白宅晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, TAEK-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜希炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HEEKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金民兼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINGYUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜眞熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JINHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪忠範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CHUNGBEUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金知由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳虎均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, HOKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種感光性樹脂組合物、使用所述感光性樹脂組合物製造而成的感光性樹脂層以及包含所述感光性樹脂層的半導體裝置，所述感光性樹脂組合物包含：鹼溶性樹脂；可光聚合化合物；光引發劑；和溶劑，其中所述鹼溶性樹脂包含含有由化學式1表示的結構單元的聚合物和含有由化學式2表示的結構單元的聚合物，且以約1:1到約1:2的重量比包含含有由化學式1表示的結構單元的聚合物與含有由化學式2表示的結構單元的聚合物。在化學式1和化學式2中，每一取代基與詳細說明中所定義相同。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="306px" width="200px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="165px" width="545px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a photosensitive resin composition including an alkali soluble resin; a photopolymerizable compound; a photoinitiator; and a solvent, wherein the alkali soluble resin includes a polymer including a structural unit represented by Chemical Formula 1 and a polymer including a structural unit represented by Chemical Formula 2, and the polymer including a structural unit represented by Chemical Formula 1 and the polymer including a structural unit represented by Chemical Formula 2 are included in a weight ratio of about 1:1 to about 1:2, a photosensitive resin layer manufactured using the same, and a semiconductor device including the photosensitive resin layer. In Chemical Formula 1 and Chemical Formula 2, each substituent is the same as defined in the detailed description. &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="245px" width="217px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="218px" width="637px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1225" publication-number="202620218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130985</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空處理裝置及其排氣方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C14/56</main-classification>  
        <further-classification edition="200601120260223B">C23C16/448</further-classification>  
        <further-classification edition="200601120260223B">C23C16/54</further-classification>  
        <further-classification edition="202601120260223B">H10P14/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井俊充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TOSHIMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平出圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAIDE, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十嵐義也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARASHI, YOSHIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">改善能量效率，抑制占地面積的增加，且避免因處理氣體混合而產生之風險。 &lt;br/&gt;  一種真空處理裝置，係具備：多個真空處理室；以及多個處理用排氣泵；至少二個真空處理室係共有一個處理用排氣泵；真空處理裝置在至少二個真空處理室執行會使用不應混合的多種處理氣體之處理時，係藉由共有之處理用排氣泵對一個真空處理室進行排氣，且藉由與共有之處理用排氣泵不同的另一個處理用排氣泵對另一個真空處理室進行排氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13a~13f:PM</p>  
        <p type="p">28a~28c:主DP</p>  
        <p type="p">29:副DP</p>  
        <p type="p">30a~30f:氣體箱</p>  
        <p type="p">31a~31f:PC</p>  
        <p type="p">32a~32f:APC閥</p>  
        <p type="p">33a~33f:TMP</p>  
        <p type="p">34a~34f:主排氣管</p>  
        <p type="p">35a~35f:副排氣管</p>  
        <p type="p">36a~36f,37a~37f,42a~42c,48a~48f,50,53a~53d,54a~54f,86a~86f:閥</p>  
        <p type="p">38a~38f,40a~40c:CM</p>  
        <p type="p">39a~39c:共有排氣管</p>  
        <p type="p">41a,41b:QMS</p>  
        <p type="p">43a~43c:下游配管</p>  
        <p type="p">46:粗抽配管</p>  
        <p type="p">47a~47d:粗抽支管</p>  
        <p type="p">49:共有排氣管</p>  
        <p type="p">51:旁通配管</p>  
        <p type="p">52a,52c,89:旁通支管</p>  
        <p type="p">81a~81f:配管</p>  
        <p type="p">82a~82f:除害埠</p>  
        <p type="p">83:除害裝置</p>  
        <p type="p">84a~84f:閘板</p>  
        <p type="p">85a~85c:差壓計</p>  
        <p type="p">87a~87f:稀釋裝置</p>  
        <p type="p">88:真空處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1226" publication-number="202620487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光耦合零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260105B">G02B6/36</main-classification>  
        <further-classification edition="200601120260105B">G02B6/32</further-classification>  
        <further-classification edition="200601120260105B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, TSUTARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹山吉洸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEYAMA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川幸生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水本之博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUMOTO, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸達郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHI, TATSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向島健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKOJIMA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島晴香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光耦合零件將複數條光纖與光積體電路光學性耦合。光耦合零件包含：複數條光纖；光纖保持零件，其保持複數條光纖；及透鏡陣列，其具有複數個透鏡鏡頭。複數個透鏡鏡頭各者使複數條光纖各者與光積體電路之間之光路之角度變化。透鏡陣列具有光路中入射至透鏡陣列且自透鏡陣列出射為止之部分在空氣中通過之空間構造。光纖保持零件與透鏡陣列相互獨立地形成，直接或間接地相互連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:本體部</p>  
        <p type="p">4:光纖保持零件</p>  
        <p type="p">4a,5d:前端面</p>  
        <p type="p">4b,5b:底面</p>  
        <p type="p">4c,5c:頂面</p>  
        <p type="p">4d,5a:後端面</p>  
        <p type="p">5:透鏡陣列</p>  
        <p type="p">41:光纖孔</p>  
        <p type="p">42:單一光纖孔</p>  
        <p type="p">51:空間構造</p>  
        <p type="p">52:光反射面</p>  
        <p type="p">61:光纖</p>  
        <p type="p">62:樹脂被覆</p>  
        <p type="p">L:光路</p>  
        <p type="p">y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1227" publication-number="202619641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低輪廓柄緊固件</chinese-title>  
        <english-title>LOW PROFILE SHANK FASTENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A44B1/08</main-classification>  
        <further-classification edition="200601120260223B">A44B1/28</further-classification>  
        <further-classification edition="200601120260223B">A44B1/04</further-classification>  
        <further-classification edition="200601120260223B">A44B1/06</further-classification>  
        <further-classification edition="200601120260223B">A44B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商法赫蒂品牌有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAHERTY BRAND LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥科特　亞曆克斯　華盛頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKOT, ALEX WASHINGTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種柄緊固件，其包括：頭部，該頭部具有第一側部和第二側部，該第二側部具有圍繞第二側部延伸的圓形凹部；杆，該杆從第二側部的中心延伸；以及基部，該基部用於附接到杆的遠側端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shank fastener includes a head having a first side and a second side having a circular recess extending around the second side, a post extending from a center of the second side, and a base for attachment to a distal end of the post.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:柄緊固件</p>  
        <p type="p">502:頭部</p>  
        <p type="p">504:第一側部</p>  
        <p type="p">506:第二側部</p>  
        <p type="p">508:凹部</p>  
        <p type="p">510:杆</p>  
        <p type="p">512:基部</p>  
        <p type="p">514:遠側端部</p>  
        <p type="p">516:接收部</p>  
        <p type="p">518:第一端部</p>  
        <p type="p">520:第二端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1228" publication-number="202621246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有鍵合結構的半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH BONDING STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明內容涉及用於管理半導體裝置中的鍵合結構的方法、裝置、系統和技術。一種示例半導體裝置包括沿第一方向堆疊的第一半導體結構、鍵合結構和第二半導體結構。所述第一半導體結構通過所述鍵合結構鍵合至所述第二半導體結構。所述鍵合結構包括第一組接觸結構、第二組接觸結構以及圍繞所述第一組接觸結構和所述第二組接觸結構的電介質材料。所述第一組接觸結構中的第一接觸結構沿垂直於所述第一方向的第二方向與所述第二組接觸結構中的第二接觸結構相鄰。所述第一接觸結構包括第一導電材料。所述第二接觸結構包括所述第一導電材料和氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to the methods, devices, systems, and techniques for managing a bonding structure in a semiconductor device. An exemplary semiconductor device includes a first semiconductor structure, a bonding structure, and a second semiconductor structure that are stacked in a first direction. The first semiconductor structure is bonded to the second semiconductor structure through the bonding structure. The bonding structure includes a first group of contact structures, a second group of contact structures, and a dielectric material surrounding the first and second groups of contact structures. A first contact structure in the first group of contact structures is adjacent to a second contact structure in the second group of contact structures in a second direction that is perpendicular to the first direction. The first contact structure includes a first conductive material. The second contact structure includes the first conductive material and an oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102、106:半導體結構</p>  
        <p type="p">104:鍵合結構</p>  
        <p type="p">108、110:側面</p>  
        <p type="p">112、114:互連層</p>  
        <p type="p">116、118:電介質層</p>  
        <p type="p">120:鍵合介面</p>  
        <p type="p">122、124:接觸結構</p>  
        <p type="p">122a:第一部分</p>  
        <p type="p">122b:第二部分</p>  
        <p type="p">122c:第三部分</p>  
        <p type="p">126、128:互連</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1229" publication-number="202620445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變動檢測感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01R19/12</main-classification>  
        <further-classification edition="200601120260211B">G01R19/32</further-classification>  
        <further-classification edition="200601120260211B">G01R31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤英治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITOH, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKKAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有澤洋希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARISAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之變動檢測感測器200具備：非線性響應層202，其對沿著第1方向之外部能量之輸入，具有非線性之電性響應特性；及一對電極207a、207b，其等用以提取因沿著第1方向自外部輸入至非線性響應層202之能量變動而於非線性響應層202產生之電性響應信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:變動檢測感測器</p>  
        <p type="p">201:基板</p>  
        <p type="p">201S:正面</p>  
        <p type="p">202:非線性響應層</p>  
        <p type="p">203:鐵磁性層</p>  
        <p type="p">203M:自發磁化</p>  
        <p type="p">205:順磁性層</p>  
        <p type="p">205S:正面</p>  
        <p type="p">207a,207b:一對電極(電極部)</p>  
        <p type="p">B:外部磁場</p>  
        <p type="p">C:正交座標系</p>  
        <p type="p">H:熱流變動</p>  
        <p type="p">J:電流變動</p>  
        <p type="p">X,Y,Z:軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1230" publication-number="202619926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組化騎行車</chinese-title>  
        <english-title>MODULAR RIDING VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">B62H7/00</main-classification>  
        <further-classification edition="200601120260203B">B62K9/00</further-classification>  
        <further-classification edition="200601120260203B">B62K13/08</further-classification>  
        <further-classification edition="200601120260203B">B62K19/34</further-classification>  
        <further-classification edition="202001120260203B">B62J25/00</further-classification>  
        <further-classification edition="200601120260203B">B62M3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商都納控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOONA HOLDINGS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬扎爾　約夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAZAR, YOAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　禮仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DLUGASH, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開一種與後模組配合使用以形成騎行車的前組件。前組件包括一個細長框架、一個位於細長框架下方的托架、一個帶有前輪和車把的頭部組件以及一個相對於細長框架安裝的座位。細長框架的末端是兩個橫向間隔開的叉狀物，這些叉狀物可拆卸地固定到後模組的連接件。連接件和細長框架共同構成自行車車架。通過互換後模組，騎行車可以在不同構造之間轉換，例如平衡自行車和腳踏自行車。後模組可以具有不同的車輪尺寸和連接件幾何形狀，同時保持與前組件的相容性。騎行車可以包括用於在不同構造中部分包住托架的部件，並且可以折疊以便緊湊存放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A front assembly for use with a rear module to form a riding vehicle is disclosed. The front assembly includes an elongate frame, a mount disposed beneath the elongate frame, a head assembly with a front wheel and handlebar, and a seat mounted relative to the elongate frame. The elongate frame terminates in two laterally spaced apart prongs removably securable to connectors of the rear module. The connectors and elongate frame together constitute a bicycle frame. The riding vehicle may be convertible between different configurations, such as a balance bicycle and a pedal bicycle, by interchanging rear modules. The rear modules may have different wheel sizes and connector geometries while maintaining compatibility with the front assembly. The riding vehicle may include features for partially encasing the mount in different configurations and may be foldable for compact storage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:輪</p>  
        <p type="p">10:車把</p>  
        <p type="p">16:制動機構</p>  
        <p type="p">18:前組件</p>  
        <p type="p">22:頭部組件</p>  
        <p type="p">24:框架</p>  
        <p type="p">32:叉狀物</p>  
        <p type="p">50:通道</p>  
        <p type="p">52:槓桿</p>  
        <p type="p">54:托架</p>  
        <p type="p">82:凹處</p>  
        <p type="p">110:位置</p>  
        <p type="p">114:槓桿機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1231" publication-number="202620990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於雷射誘發向前轉移之遮罩對施體對準技術</chinese-title>  
        <english-title>MASK-TO-DONOR ALIGNMENT FOR LASER-INDUCED FORWARD TRANSFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H01S3/101</main-classification>  
        <further-classification edition="200601120260211B">H01S3/02</further-classification>  
        <further-classification edition="200601120260211B">G02B26/08</further-classification>  
        <further-classification edition="200601120260211B">G02B27/32</further-classification>  
        <further-classification edition="202501120260211B">H10H29/01</further-classification>  
        <further-classification edition="202201120260211B">G06V10/56</further-classification>  
        <further-classification edition="200601120260211B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商科希倫激光有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHERENT LASERSYSTEMS GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法塔希拉　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATAHILAH, MUHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里菲爾　托爾格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIFFEL, THORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILL, ANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於雷射誘發向前轉移之遮罩對施體對準方法，其包括：(a)將一雷射光束引導至一遮罩上以產生包括一或多個單獨子光束之一經遮蔽光束，各子光束由該遮罩之一各別孔洞透射，(b)檢視由承載一或多個裝置之一施體基體透射之各子光束，以獲得指示在各子光束中該一或多個裝置中之一對應者之一陰影的成像，以及(c)基於該成像，調整該經遮蔽光束及該施體基體相對於彼此之位置，以便使各裝置相對於對應子光束對準。與間接的基於基準件之對準方法相比，對該施體基體與該經遮蔽光束之間的相對對準之此原位觀測產生一改良之對準準確度。已證實優於0.2 μm之對準準確度，及相關聯之小於1 μm的LIFT定位準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mask-to-donor alignment method for laser-induced forward transfer includes (a) directing a laser beam onto a mask to produce a masked beam including one or more separate sub-beams, each sub-beam being transmitted by a respective aperture of the mask, (b) viewing each sub-beam, as transmitted by a donor substrate carrying one or more devices, to obtain imagery indicating in each sub-beam a shadow of a corresponding one of the one or more devices, and (c) based on the imagery, adjusting position of the masked beam and the donor substrate, relative to each other, so as to align each device with respect to the corresponding sub-beam. This in-situ observation of the relative alignment between the donor substrate and the masked beam produces an improved alignment accuracy, as compared to the indirect fiducial-based alignment method. Alignment accuracies better than 0.2 μm, and associated sub-1 μm LIFT positioning accuracies, have been demonstrated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:轉移過程</p>  
        <p type="p">102:遮罩對施體對準方法，對準方法</p>  
        <p type="p">102a,102b,104a,104b,104c:橫截面圖，圖</p>  
        <p type="p">104:LIFT方法</p>  
        <p type="p">110:遮罩</p>  
        <p type="p">112:基體</p>  
        <p type="p">114:層</p>  
        <p type="p">116:光透射孔洞</p>  
        <p type="p">120:施體基體</p>  
        <p type="p">122:微電子裝置，裝置</p>  
        <p type="p">124:中介層</p>  
        <p type="p">130:光束輪廓儀</p>  
        <p type="p">140:受體基體</p>  
        <p type="p">142:電接觸墊，接觸墊</p>  
        <p type="p">160:非零間隙</p>  
        <p type="p">180,182:箭頭</p>  
        <p type="p">190:雷射光束</p>  
        <p type="p">192:經遮蔽雷射光束</p>  
        <p type="p">194:部分，經透射光束部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1232" publication-number="202620180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>潤滑脂組成物</chinese-title>  
        <english-title>GREASE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C10M107/02</main-classification>  
        <further-classification edition="200601120260203B">C10M149/20</further-classification>  
        <further-classification edition="200601120260203B">C09K3/10</further-classification>  
        <further-classification edition="200601320260203B">C10N30/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＤＤＰ特種電子材料美國第９有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇切斯特　查德　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICHESTER, CHAD WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法納　凱西　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FHANER, CASSIE JO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種含有特定PAO和特定量的聚脲的潤滑脂組成物，其具有優異的耐水性和鋁腐蝕抑制。此外，該潤滑脂組成物不會不利地影響聚合物如橡膠材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A grease composition containing a specific PAO and specific amount of polyurea, having excellent water resistance and aluminum corrosion inhibition is disclosed. In addition, the grease composition does not adversely affect polymers such as rubber materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1233" publication-number="202621426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運機器人系統、基板搬運裝置、半導體製造裝置、維護方法、及基板搬運方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="200601120260223B">B25J9/10</further-classification>  
        <further-classification edition="200601120260223B">B25J13/08</further-classification>  
        <further-classification edition="202601120260223B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商安川電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA YASKAWA DENKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩﨑則久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, NORIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日野一紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上雄一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角本渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNOMOTO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板搬運機器人系統(7)，具備：基部(11)；手臂(20)；手部(30)，支撐基板；記憶部(111)，將表示手部(30)的目標位置(P1)與預定感測位置(P2)的位置關係的第一位置資訊予以記憶；控制部(112)，控制手臂(20)以使手部(30)通過感測位置(P2)；1個以上的感測器(60)，偵測通過感測位置(P2)的手部(30)；計算部(113)，根據1個以上的感測器(60)對手部(30)的偵測結果與手臂(20)的姿勢，計算表示感測位置(P2)與基部(11)的位置關係的第二位置資訊；以及生成部(114)，根據第一位置資訊與第二位置資訊，生成使手臂(20)動作之動作程式，以將手部(30)移動至該目標位置(P1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:周邊腔室</p>  
        <p type="p">7:基板搬運機器人系統</p>  
        <p type="p">11:基部</p>  
        <p type="p">20:手臂</p>  
        <p type="p">21:第一連桿</p>  
        <p type="p">22:第二連桿</p>  
        <p type="p">23:第三連桿</p>  
        <p type="p">30:手部</p>  
        <p type="p">60:感測器</p>  
        <p type="p">100:控制器</p>  
        <p type="p">111:記憶部</p>  
        <p type="p">112:控制部</p>  
        <p type="p">113:計算部</p>  
        <p type="p">114:生成部</p>  
        <p type="p">115:程式記憶部</p>  
        <p type="p">P1:目標位置</p>  
        <p type="p">P2:感測位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1234" publication-number="202619903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造自行車輪緣之方法及自行車輪緣</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A BICYCLE RIM AND BICYCLE RIM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B60B21/02</main-classification>  
        <further-classification edition="200601120260223B">B60B5/02</further-classification>  
        <further-classification edition="200601120260223B">B29C45/14</further-classification>  
        <further-classification edition="200601120260223B">B29C70/38</further-classification>  
        <further-classification edition="200601120260223B">B29C70/42</further-classification>  
        <further-classification edition="200601320260223B">B29K101/12</further-classification>  
        <further-classification edition="200601320260223B">B29K105/10</further-classification>  
        <further-classification edition="200601320260223B">B29K301/12</further-classification>  
        <further-classification edition="200601320260223B">B29L31/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＤＴ瑞士公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DT SWISS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫尼格　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENIG, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施瓦茨　安妮　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZ, ANNE FRANZISKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">自行車輪緣(50)及用於製造自行車輪緣(50)之方法及自行車輪緣(50)，其中該自行車輪緣(50)包含一輪緣本體(1)且至少一空腔(2)整合在該輪緣本體中。該空腔(2)四周被一圍繞組件壁(4)包圍。該輪緣本體(1)在與其旋轉軸(53)橫交之一輪緣平面(52)中沿360°圓周延伸。該空腔(2)形成該輪緣本體(1)中之一中空腔室(3)。形成複數組件壁(4)，其中該等組件壁包含界限該中空腔室(3)之二橫向輪緣側腹(54、55)、一徑向內輪緣基底(55)及一徑向外輪緣井(56)。該輪緣本體(1)之一支持結構(5)係由至少一纖維結構(11至14)形成。為產生該纖維結構(11至14)，一纖維束(15)藉由線元件(19)附接在一承載層(20)上且在該承載層(20)上來回地通過以形成該纖維結構(11至14)之一基底纖維層(21)。在一工具模(40)中覆蓋該纖維結構(11至14)。將一填充單元(55)放在該工具模(40)中使得該填充單元(45)保持該空腔(2)之體積且該空腔(2)被該組件壁(4)圍繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Bicycle rim (50) and method for making a bicycle rim (50) and bicycle rim (50), wherein the bicycle rim (50) comprises a rim body (1) with at least one cavity (2) integrated in it. The cavity (2) is enclosed all around by a surrounding component wall (4). The rim body (1) extends in a rim plane (52) over a circumference of 360° transverse to its rotational axis (53). The cavity (2) forms a hollow chamber (3) in the rim body (1). A plurality of component walls (4) are formed, wherein the component walls comprise two lateral rim flanks (54, 55), a radial inner rim base (55) and a radial outer rim well (56), which limit the hollow chamber (3). A support structure (5) of the rim body (1) is formed by at least one fibre structure (11-14). For the production of the fibre structure (11-14), a fibre bundle (15) is attached to a carrier layer (20) with thread elements (19) and passed back and forth on the carrier layer (20) to form a basic fibre layer (21) of the fibre structure (11-14). The fibre structure (11-14) is draped in a tool mould (40). A filling unit (55) is placed in the tool mould (40) so that the filling unit (45) keeps the volume free for the cavity (2) and the cavity (2) is surrounded by the component wall (4).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:支持結構</p>  
        <p type="p">11,13:纖維結構</p>  
        <p type="p">15:纖維束</p>  
        <p type="p">24:預定區段；補強區段</p>  
        <p type="p">25:區域</p>  
        <p type="p">54,55:輪緣側腹</p>  
        <p type="p">56:輪緣基底</p>  
        <p type="p">57:輪緣井</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1235" publication-number="202620809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙張處理裝置</chinese-title>  
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">G07D9/00</main-classification>  
        <further-classification edition="201901120260203B">G07D11/16</further-classification>  
        <further-classification edition="200601120260203B">G07D13/00</further-classification>  
        <further-classification edition="200601120260203B">B65H29/51</further-classification>  
        <further-classification edition="200601120260203B">B65H5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本金錢機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新谷直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINTANI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種紙張處理裝置，其為能夠不只是對收納部而且也對輸入輸出處理部盡可能容易地進行設置。本發明有關的紙張處理裝置1具備：具有在第1側開口之本體部101、能夠開關前述本體部之開口的門部102、具有連通口FW1之箱體100、配置於前述箱體的外部之外部支撐構件300、配置於前述箱體的內部之內部支撐構件400、可自由裝卸地從前述第1側裝設於前述外部支撐構件之輸入輸出處理部200、可自由裝卸地從前述第1側裝設於前述內部支撐構件之收納部700、及從前述輸入輸出處理部的內部通過前述連通口延伸到前述收納部的內部之搬運路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can set not only the storage portion but also the input/output processing portion as easily as possible. The paper sheet processing device 1 according to the present invention comprises a box 100 having a main body portion 101 opening to a first side, a door portion 102 that can open and close the opening of the main body portion, and a communication opening FW1, an external support member 300 arranged on the outside of the box, an internal support member 400 arranged inside the box, an input/output processing portion 200 that can be detachably installed to the external support member from the first side, a storage portion 700 that can be detachably installed to the internal support member from the first side, and a transport path that extends from the inside of the input/output processing portion through the communication opening to the inside of the storage portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:紙張處理裝置</p>  
        <p type="p">100:框體</p>  
        <p type="p">101:本體部</p>  
        <p type="p">102:前門</p>  
        <p type="p">200:輸入輸出處理裝置</p>  
        <p type="p">201:出入口</p>  
        <p type="p">300:外部支撐構件</p>  
        <p type="p">400:內部支撐構件</p>  
        <p type="p">402:側壁部</p>  
        <p type="p">402a:第1載置部</p>  
        <p type="p">402b:第2載置部</p>  
        <p type="p">403:突起部</p>  
        <p type="p">403a:本體部</p>  
        <p type="p">500:框架</p>  
        <p type="p">700:回收箱</p>  
        <p type="p">801:第1中繼構件</p>  
        <p type="p">FW:中間壁部</p>  
        <p type="p">RE1:第1凹部</p>  
        <p type="p">RE2:第2凹部</p>  
        <p type="p">SB:金庫</p>  
        <p type="p">RO1:第1棒部</p>  
        <p type="p">RO2:第2棒部</p>  
        <p type="p">AW:頂壁部</p>  
        <p type="p">BW:底壁部</p>  
        <p type="p">CW:後壁部</p>  
        <p type="p">DW:左壁部</p>  
        <p type="p">FR:本體部</p>  
        <p type="p">FR1:底壁部</p>  
        <p type="p">FR2:後壁部</p>  
        <p type="p">FR4:右壁部</p>  
        <p type="p">CP:第2中繼連接器</p>  
        <p type="p">CS:連接器支撐構件</p>  
        <p type="p">OS:第1外部支撐構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1236" publication-number="202620810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙張處理裝置</chinese-title>  
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260203B">G07D11/00</main-classification>  
        <further-classification edition="201901120260203B">G07D11/16</further-classification>  
        <further-classification edition="200601120260203B">G07D9/00</further-classification>  
        <further-classification edition="200601120260203B">G07D13/00</further-classification>  
        <further-classification edition="200601120260203B">B65H5/28</further-classification>  
        <further-classification edition="200601120260203B">B65H33/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本金錢機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新谷直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINTANI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種紙張處理裝置，其為能夠盡可能減低從輸入輸出處理部之內部通過箱體之頂壁部的連通口延伸到收納部之內部的搬運路被中斷之虞。本發明有關的紙張處理裝置1為具備：具有形成有連通口FW1及第1插穿口FW3的頂壁部FW之箱體100、配置於箱體之外部的外部支撐構件300、配置於箱體之內部的內部支撐構件400、能夠裝缷自由地裝設於外部支撐構件的輸入輸出處理部200、能夠裝缷自由地裝設於內部支撐構件的收納部700、從輸入輸出處理部之內部通過連通口而延伸到收納部之內部的搬運路；外部支撐構件及內部支撐構件中之至少一者為具有插穿第1插穿口的突起部403；突起部之長度為比頂壁部之厚度還長；外部支撐構件與內部支撐構件為透過突起部而緊固在一起。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can reduce as much as possible the risk of interruption of the conveying path extending from the inside of the input/output processing section through the communication opening in the top wall section of the box body to the inside of the storage portion. The paper sheet processing device 1 according to the present invention comprises a box 100 having a top wall portion FW in which a communication opening FW1 and a first insertion opening FW3 are formed, an external support member 300 arranged on the outside of the box, an internal support member 400 arranged on the inside of the box, an input/output processing portion 200 that can be detachably installed to the external support member, a storage portion 700 that can be detachably attached to the internal support member, and a transport path that extends from the inside of the input/output processing portion through the communication port to the inside of the storage portion, wherein at least one of the external support member and the internal support member has a protrusion 403 that is inserted into the first insertion hole, the length of the protrusion is longer than the thickness of the top wall portion, and the external support member and the internal support member are fastened via the protrusion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:框體</p>  
        <p type="p">101:本體部</p>  
        <p type="p">400:內部支撐構件</p>  
        <p type="p">401:上壁部</p>  
        <p type="p">401a:插穿口</p>  
        <p type="p">402:側壁部</p>  
        <p type="p">402a:第1載置部</p>  
        <p type="p">402b:第2載置部</p>  
        <p type="p">403:突起部</p>  
        <p type="p">403a:本體部</p>  
        <p type="p">403b:公螺紋部</p>  
        <p type="p">FW:中間壁部</p>  
        <p type="p">FW1:連通口</p>  
        <p type="p">FW2:第1插穿口</p>  
        <p type="p">FW3:第2插穿口</p>  
        <p type="p">RE1:第1凹部</p>  
        <p type="p">RE2:第2凹部</p>  
        <p type="p">BW:底壁部</p>  
        <p type="p">CW:後壁部</p>  
        <p type="p">DW:左壁部</p>  
        <p type="p">OS1:底壁部</p>  
        <p type="p">OS1a:第1插穿口</p>  
        <p type="p">OS1b:第3插穿口</p>  
        <p type="p">OS2:側壁部</p>  
        <p type="p">FM2:螺母</p>  
        <p type="p">FM3:螺母</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1237" publication-number="202620811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙張處理裝置</chinese-title>  
        <english-title>PAPER SHEET PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260203B">G07D11/00</main-classification>  
        <further-classification edition="201901120260203B">G07D11/16</further-classification>  
        <further-classification edition="200601120260203B">G07D9/00</further-classification>  
        <further-classification edition="200601120260203B">G07D13/00</further-classification>  
        <further-classification edition="200601120260203B">B65H5/02</further-classification>  
        <further-classification edition="200601120260203B">B65H33/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本金錢機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新谷直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINTANI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種紙張處理裝置，其在連通口之內部發生紙張阻塞的情況下，能夠盡可能提高對於阻塞的紙張之辨視性。本發明有關的紙張處理裝置1為具備：具有連通口FW1之箱體100、配置於前述箱體之外部的輸入輸出部200、配置於前述箱體之內部的收納部700、從前述輸入輸出部之內部起通過前述連通口而延伸到前述收納部之內部的搬運路、以及照射前述連通口之內部的發光部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a paper sheet processing device that can improve the visibility of jammed paper sheets as much as possible when a jam occurs inside a communication opening. The paper sheet processing device 1 according to the present invention comprises a box body 100 having a communication port FW1, an input/output processing portion 200 arranged outside the box body, a storage portion 700 arranged inside the box body, a transport path extending from the inside of the input/output processing portion through the communication port to the inside of the storage portion, and a light-emitting portion that illuminates the inside of the communication port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:外部支撐構件</p>  
        <p type="p">400:內部支撐構件</p>  
        <p type="p">401:上壁部</p>  
        <p type="p">401a:插穿口</p>  
        <p type="p">402:側壁部</p>  
        <p type="p">403:突起部</p>  
        <p type="p">403a:本體部</p>  
        <p type="p">700:回收箱</p>  
        <p type="p">800:中繼構件</p>  
        <p type="p">CO:第1中繼連接器</p>  
        <p type="p">CS:連接器支撐構件</p>  
        <p type="p">FM1:螺釘</p>  
        <p type="p">FM2:螺母</p>  
        <p type="p">FM3:螺母</p>  
        <p type="p">FW:中間壁部</p>  
        <p type="p">FW1:連通口</p>  
        <p type="p">IB:內部控制基板</p>  
        <p type="p">MA:本體部</p>  
        <p type="p">MA1:基體部</p>  
        <p type="p">OS:第1外部支撐構件</p>  
        <p type="p">OS1:底壁部</p>  
        <p type="p">OS1a:第1插穿口</p>  
        <p type="p">OS2:側壁部</p>  
        <p type="p">OT:第2外部支撐構件</p>  
        <p type="p">PR:光學稜鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1238" publication-number="202621282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/40</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202501120260223B">H10D84/80</further-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諶俊元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張羅衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LO-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖璁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇煥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件，半導體元件包括第一磊晶源極/汲極部件、第二磊晶源極/汲極部件、電連接至第一磊晶源極/汲極部件及第二磊晶源極/汲極部件的兩個或多個半導體層、背側源極/汲極接觸件及底部介電層。背側源極/汲極接觸件設置在第一磊晶源極/汲極部件的一側，背側源極/汲極接觸件電連接至第一磊晶源極/汲極部件的底面。底部介電層設置在半導體層的背側，並且底部介電層將背側源極/汲極接觸件與此些半導體層電隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including a first epitaxial source/drain feature, a second epitaxial source/drain feature, two or more semiconductor layers electrically connected to the first and second epitaxial source/drain features, a backside source/drain contact, and a bottom dielectric layer is provided. The backside source/drain contact is disposed on one side of the first epitaxial source/drain feature, the backside source/drain contact is electrically connected to a bottom surface of the first epitaxial source/drain feature. The bottom dielectric layer is disposed on a backside of the semiconductor layers, and the bottom dielectric layer electrically isolates the backside source/drain contact from the semiconductor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體元件</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">122:底部介電層</p>  
        <p type="p">125:矽化物層</p>  
        <p type="p">126:背側源極/汲極接觸件</p>  
        <p type="p">126a:底面</p>  
        <p type="p">126b:頂面</p>  
        <p type="p">127:襯墊層</p>  
        <p type="p">128:隔離絕緣材料</p>  
        <p type="p">144:介電間隔物</p>  
        <p type="p">146:磊晶源極/汲極部件</p>  
        <p type="p">170:閘極介電層</p>  
        <p type="p">172:閘電極層</p>  
        <p type="p">176:源極/汲極接觸件</p>  
        <p type="p">178:矽化物層</p>  
        <p type="p">D1:距離</p>  
        <p type="p">D2:距離</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1239" publication-number="202620781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不需關鍵影格之裝置端定位及追蹤</chinese-title>  
        <english-title>ON-DEVICE LOCALIZATION AND TRACKING WITHOUT KEYFRAMES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260214B">G06T7/73</main-classification>  
        <further-classification edition="202201120260214B">G06V20/20</further-classification>  
        <further-classification edition="200601120260214B">G01C21/16</further-classification>  
        <further-classification edition="201101120260214B">G06T19/00</further-classification>  
        <further-classification edition="200601120260214B">G01C21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商尼安蒂克空間股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIANTIC SPATIAL, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達　利亞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKHDA, RIYAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃凱蒂　安維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EKKATI, ANVITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後補後補</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HAOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫飛　楚托里安　艾瑞克　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURPHY-CHUTORIAN, ERIK MARSHALL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里沙卡劉　維克多　艾德里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRISACARIU, VICTOR ADRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瓦萊利　圖瑪索</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAVALLARI, TOMMASO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種定位方法對由3D點組成之一區域使用一3D地圖。一行動裝置下載該3D地圖且藉由比較由該行動裝置上之一攝影機捕獲之影像與該3D地圖來對照該3D地圖定位自身。裝置端定位消除將關鍵影格發送至該伺服器之需要且可實現更高定位準確度，因為可比較一更大數目之影像(例如，由該裝置之攝影機捕獲之所有影像)與該地圖。考慮到感測器資料(例如，慣性資料)，亦可藉由比較由該行動裝置上之一攝影機捕獲之額外影像與該3D地圖而在裝置端執行追蹤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A localization approach uses a 3D map for an area made up of 3D points. A mobile device downloads the 3D map and localizes itself against the 3D map by comparing images captured by a camera on the mobile device to the 3D map. On-device localization obviates the need to send keyframes to the server and greater localization accuracy may be achieved as a larger number of images (e.g., all of the images captured by the device’s camera) may be compared to the map. Tracking may also be performed on-device by comparing additional image captured by a camera on the mobile device to the 3D map in view of sensor data (e.g., inertial data).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p>  
        <p type="p">550:步驟</p>  
        <p type="p">560:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1240" publication-number="202621172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPRATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/21</main-classification>  
        <further-classification edition="202301120260202B">H04W72/0446</further-classification>  
        <further-classification edition="202401120260202B">H04W74/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張茂林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙悦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及裝置，能夠有效降低資料傳輸過程中的資源浪費，提高資源利用率。該方法包括：第二通信裝置根據來自第一通信裝置的第一控制幀，在第一時間段內始終維持第一模式進行資料傳輸，第一時間段對應多個TXOP或者，第一時間段對應一個TXOP，且第一時間段的結束時刻早於TXOP的結束時刻。在第一時間段對應多個TXOP的情況下，能夠實現對第二通信裝置跨TXOP級別的資料傳輸控制；在第一時間段對應一個TXOP，且第一時間段的結束時刻早於TXOP的結束時刻的情況下，能夠實現對第二通信裝置小於TXOP級別的資料傳輸控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus are provided, effectively reducing resource waste during data transmission and improving resource utilization. The method comprises: based on a first control frame from a first communication apparatus, maintaining, by a second communication apparatus, a first mode for data transmission during a first period, wherein the first period corresponds to multiple TXOPs, or the period corresponds to one TXOP, and an end time of the first period is earlier than the end of the TXOP. In a case where the first period corresponds to multiple TXOPs, the method enables cross-TXOP level data transmission for the second apparatus; in a case wherein the first period corresponds to one TXOP, the method enables sub-TXOP level data transmission for the second apparatus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1401、S1402:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1241" publication-number="202620438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針及檢查裝置</chinese-title>  
        <english-title>PROBE AND INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01R1/067</main-classification>  
        <further-classification edition="200601120260202B">G01R1/073</further-classification>  
        <further-classification edition="200601120260202B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商友華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOWO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>軣木岳史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODOROKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">探針具備：基端部；前端部，與檢查對象物接觸；及梁部，將前述前端部支持於前述基端部；該梁部具有：第一延伸部，沿著非平行於從前述前端部所位在之側往前述檢查對象物所位在之側的第一方向之方向延伸；第二延伸部，從前述第一延伸部沿著非垂直於前述第一方向之方向延伸；及第三延伸部，與前述第一延伸部沿著前述第一方向隔開距離而設置，並從前述第二延伸部沿著非平行於前述第一方向之方向延伸；前述第一延伸部及前述第三延伸部之間的前述距離係隨著遠離前述第二延伸部而至少部分地減少。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe comprising: a base end; a tip end that contacts an inspection target; and a beam portion that supports the tip end on the base end; the beam portion includes: a first extending portion that extends in a direction non-parallel to a first direction, the first direction being a direction from a side where the tip end is located toward a side where the inspection target is located; a second extending portion that extends in a direction non-perpendicular to the first direction from the first extending portion; and a third extending portion that is located at a distance from the first extending portion in the first direction, and extends from the second extending portion in a direction non-parallel to the first direction; wherein a distance between the first extending portion and the third extending portion decreases at least partially as moving away from the second extending portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:檢查對象物</p>  
        <p type="p">22:銲墊</p>  
        <p type="p">200:中繼基板</p>  
        <p type="p">300:探針</p>  
        <p type="p">310:基端部</p>  
        <p type="p">320:前端部</p>  
        <p type="p">330:梁部</p>  
        <p type="p">332:第一傾斜延伸部</p>  
        <p type="p">332a:第一端部</p>  
        <p type="p">332b:第二端部</p>  
        <p type="p">334:第一垂直延伸部</p>  
        <p type="p">334a:第三端部</p>  
        <p type="p">334b:第四端部</p>  
        <p type="p">336:第二傾斜延伸部</p>  
        <p type="p">336a:第五端部</p>  
        <p type="p">336b:第六端部</p>  
        <p type="p">338:第二垂直延伸部</p>  
        <p type="p">338a:第七端部</p>  
        <p type="p">338b:第八端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1242" publication-number="202619955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送系統及搬送方法</chinese-title>  
        <english-title>CONVEYANCE SYSTEM AND CONVEYANCE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">B65G47/52</main-classification>  
        <further-classification edition="202401120260203B">G05D1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＩＨＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種能夠抑制無人搬運車可以自由地行駛的區域受到限制，且能夠靈活地進行無人搬運車的行駛路徑的製作的搬送系統及搬送方法。本發明的解決手段為一種搬送系統及搬送方法，係使用輸送帶、無人搬運車及控制器。控制器對無人搬運車指示在經由已設定在輸送帶的正下方的停留區域而移動至轉運區域為止的路徑上的行駛，且於轉運區域執行在輸送帶與無人搬運車之間的交付物品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a conveyance system and a conveyance method that can flexibly create driving routes for unmanned guided vehicles by suppressing restrictions on areas in which the unmanned guided vehicles can travel freely. Provided as a solution in the present invention is a conveyance system and a conveyance method that use a conveyor, an unmanned guided vehicle, and a controller. The controller instructs the unmanned guided vehicle to travel along a route to a transfer area via a stay area set directly under the conveyor, and executes in the transfer area transfer of items between the conveyor and the unmanned guided vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送系統</p>  
        <p type="p">AM1至AM3:無人搬運車</p>  
        <p type="p">AR1:搬送方向</p>  
        <p type="p">AR2:升降方向</p>  
        <p type="p">CV:輸送帶</p>  
        <p type="p">FL:路面</p>  
        <p type="p">H1,H2:高度</p>  
        <p type="p">LD1,LD2:物品</p>  
        <p type="p">ST:架台</p>  
        <p type="p">TF:轉運裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1243" publication-number="202620551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以非恆定曝光速度進行的雷射寫入</chinese-title>  
        <english-title>LASER WRITING WITH A NON-CONSTANT EXPOSURE VELOCITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G03F7/20</main-classification>  
        <further-classification edition="200601120260211B">H01S3/10</further-classification>  
        <further-classification edition="200601120260211B">G05B19/406</further-classification>  
        <further-classification edition="200601120260211B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商麥可尼克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYCRONIC AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛林托夫特　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLIMTOFT, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦爾特　喬納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTHER, JONAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示一種用於控制一雷射寫入器(100)之方法及一種經組態以執行此一方法之雷射寫入器(100)。該雷射寫入器(100)包括一列印頭(102)、一調變光學器件(108)及一掃掠偏轉光學器件(110)。該列印頭(102)以一預定非恆定速度剖面相對於一列印基板(104)在一掃描方向(X)上掃描。該掃掠偏轉光學器件(110)經控制以基於該列印頭(102)沿著該掃描方向(X)之一經監測位置來執行一微掃掠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is disclosed herein a method for controlling a laser writer (100) and a laser writer (100) configured to perform such a method. The laser writer (100) comprises a printing head (102), a modulating optic (108), and a sweep deflection optic (110). The printing head (102) scans in a scanning direction (X) relative to a printing substrate (104), with a predetermined non-constant velocity profile. The sweep deflection optic (110) is controlled to carry out a micro-sweep based on a monitored position of the printing head (102) along the scan direction (X).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射寫入器</p>  
        <p type="p">102:列印頭</p>  
        <p type="p">104:列印基板</p>  
        <p type="p">104a:光阻劑層</p>  
        <p type="p">104b:基底層</p>  
        <p type="p">106:雷射束</p>  
        <p type="p">106a:部分</p>  
        <p type="p">106b:部分/經調變雷射束</p>  
        <p type="p">106c:部分/射束</p>  
        <p type="p">108:調變光學器件/聲光調變器(AOM)</p>  
        <p type="p">110:掃掠偏轉光學器件/聲光偏轉器(AOD)</p>  
        <p type="p">P&lt;sub&gt;E&lt;/sub&gt;:曝光像素</p>  
        <p type="p">P&lt;sub&gt;U&lt;/sub&gt;:未曝光像素</p>  
        <p type="p">V&lt;sub&gt;x&lt;/sub&gt;:速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1244" publication-number="202620207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從含鋰之電池中安全提取鋰之方法</chinese-title>  
        <english-title>METHOD FOR THE SAFE EXTRACTION OF LITHIUM FROM AN ELECTRIC BATTERY COMPRISING LITHIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C22B26/12</main-classification>  
        <further-classification edition="200601120260203B">C22F1/02</further-classification>  
        <further-classification edition="200601120260203B">H01M6/52</further-classification>  
        <further-classification edition="202201320260203B">B09B101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商藍海對策公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUE SOLUTIONS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德尚　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESCHAMPS, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波德涅茲　凡索</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BODENEZ, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布列許　阿伯戴禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABOULAICH, ABDELHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼耶　何南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANIEL, RONAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種從含鋰金屬之電池中提取鋰之方法（300），該方法（300）包含鋰提取階段（302），該提取階段（302）包含以下步驟，該等步驟至少部分地在外殼中進行： &lt;br/&gt;-    加熱（304）該電池至一溫度，稱為加工溫度，該溫度大於或等於鋰金屬之熔融溫度； &lt;br/&gt;-    壓縮（306）該電池以從電池中抽空經熔融之鋰； &lt;br/&gt;其特徵在於，加熱步驟（304）是藉由在該外殼中循環與該電池接觸之熱流（稱為加熱流）來進行。 &lt;br/&gt;其亦關於一種實施該方法之系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method (300) for extracting lithium from an electric battery comprising lithium metal, said method (300) comprising a lithium extraction phase (302), said extraction phase (302) comprising the following steps carried out, at least in part, in an enclosure: &lt;br/&gt;- heating (304) said battery to a temperature, called processing temperature, which is greater than or equal to the melting temperature of the lithium metal; &lt;br/&gt;- compressing (306) said battery to evacuate the molten lithium from the battery; &lt;br/&gt;characterized in that the heating step (304) is carried out by circulating, in said enclosure, a hot flow, called heating flow, which comes into contact with said battery. &lt;br/&gt;It also relates to a system implementing such a method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">302:提取階段</p>  
        <p type="p">304:加熱步驟</p>  
        <p type="p">306:壓縮步驟</p>  
        <p type="p">310:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1245" publication-number="202620614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁感應式顯示面板及使用其的磁感應式顯示裝置</chinese-title>  
        <english-title>MAGNETO-INDUCTIVE DISPLAY PANEL AND MAGNETO-INDUCTIVE DISPLAY DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260205B">G06F3/0488</main-classification>  
        <further-classification edition="200601120260205B">G06F3/041</further-classification>  
        <further-classification edition="200601120260205B">H01H36/00</further-classification>  
        <further-classification edition="200601120260205B">G09G3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂喬科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EXBRI TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁感應式顯示面板至少包括：一基板；一電路載板，設置於基板上；多個發光單元，設置於電路載板上，用於發出顯示用光線；以及多個磁感應器，設置於電路載板上，其中該多個磁感應器感應位於該多個磁感應器周圍的磁鐵的磁場特性，而產生多個磁力信號，使得磁鐵的姿態資訊可依據該多個磁力信號來決定，達成顯示觸控的功能。本發明在製程整合上不需增加太多額外步驟，且能在不接觸面板的情況下進行觸控，又能解決潮濕造成的觸控不良的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magneto-inductive display panel includes: a substrate; a circuit carrier board disposed on the substrate; light-emitting units being disposed on the circuit carrier board and outputting display light; and magnetic sensors, which are disposed on the circuit carrier board and sense magnetic field characteristics of a magnet located around the magnetic sensors to generate magnetic signals, so that state information of the magnet can be determined according to the magnetic signals, thereby achieving a display touch function. This disclosure requires minimal additional steps in manufacturing integration, and enables touch operations without panel contact, while also resolving issues caused by moisture affecting touch performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LD:顯示用光線</p>  
        <p type="p">O1:操作信號</p>  
        <p type="p">O2:第二操作信號</p>  
        <p type="p">O3:第三操作信號</p>  
        <p type="p">O4:第四操作信號</p>  
        <p type="p">SM1:磁力信號</p>  
        <p type="p">SM2:第二磁力信號</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:電路載板</p>  
        <p type="p">30:發光單元</p>  
        <p type="p">40:磁感應器</p>  
        <p type="p">45:處理器</p>  
        <p type="p">50:保護蓋板</p>  
        <p type="p">100:磁感應式顯示面板</p>  
        <p type="p">200:第一操作件</p>  
        <p type="p">210:磁鐵</p>  
        <p type="p">220:第二磁鐵</p>  
        <p type="p">230:本體</p>  
        <p type="p">400:磁感應式顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1246" publication-number="202619632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>啤酒風味無酒精飲料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A23L2/56</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商麒麟控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種味道之擴散及酸味之調和良好之新穎之啤酒風味無酒精飲料。根據本發明，提供一種γ-胺基丁酸之濃度為3 ppm以上之啤酒風味無酒精飲料。根據本發明，藉由以在規定濃度範圍內之方式使啤酒風味無酒精飲料中含有γ-胺基丁酸，能夠提供於該啤酒風味無酒精飲料中味道之擴散及酸味之調和良好者，於可滿足消費者之多樣化嗜好或需求之方面有利。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1247" publication-number="202621359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>填埋釕之方法及填埋釕之裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/42</main-classification>  
        <further-classification edition="200601120260223B">C23C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村朋陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石坂忠大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一邊反覆釕的成膜與蝕刻一邊將釕填埋至形成在基板之凹部時，能減少釕的填埋高度的差異。 &lt;br/&gt;  一種填埋釕之方法，係對具有凹部之基板填埋釕，包含：工序(a)，係對收容有該基板之處理容器內供給包含釕化合物之原料氣體以在該凹部內形成釕層；工序(b)，係對該處理容器內供給前處理氣體以進行該釕層的前處理，該前處理氣體係包含氧氣或臭氧氣體且臭氧濃度為0g/m&lt;sup&gt;3&lt;/sup&gt;以上，未達150g/m&lt;sup&gt;3&lt;/sup&gt;；以及工序(c)，係對該處理容器內供給蝕刻氣體以蝕刻該釕層的一部分，該蝕刻氣體係包含臭氧氣體且臭氧濃度為150g/m&lt;sup&gt;3&lt;/sup&gt;以上，400g/m&lt;sup&gt;3&lt;/sup&gt;以下；該填埋釕之方法係反覆會依序執行該工序(a)、該工序(b)、該工序(c)的循環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1248" publication-number="202621032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力轉換裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260223B">H02M7/48</main-classification>  
        <further-classification edition="202601120260223B">H02J4/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立產機系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田直充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, NAOMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉正将</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永俊祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即便直流電力發生變化，亦能夠實現穩定動作之電力轉換裝置。 &lt;br/&gt;本發明之電力轉換裝置1將直流電力轉換為交流電力並輸出。電力轉換裝置1之控制器18根據直流電力之檢測值(面板輸出檢測值)及有效電力修正指令值來運算有效電力指令值(加法器105)。控制器18根據有效電力指令值及有效電力檢測值來運算交流電壓之頻率指令值(頻率指令運算器107)。控制器18基於頻率指令值輸出PWM信號(積分器108、電壓指令運算器109、PWM運算器110)。控制器18使用直流電壓檢測值與直流電壓指令值之偏差、及與直流電力之檢測值對應之控制增益，來運算有效電力修正指令值(直流電壓控制器104)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:太陽能發電用電力轉換裝置</p>  
        <p type="p">2:電力系統</p>  
        <p type="p">11:太陽能面板</p>  
        <p type="p">12:AC/DC轉換器</p>  
        <p type="p">13:直流電容器</p>  
        <p type="p">14:直流電壓檢測感測器</p>  
        <p type="p">15:直流電流檢測感測器</p>  
        <p type="p">16:交流電壓檢測感測器</p>  
        <p type="p">17:交流電流檢測感測器</p>  
        <p type="p">18:控制器</p>  
        <p type="p">100:乘法器</p>  
        <p type="p">101:增益調節器</p>  
        <p type="p">102:MPPT控制器</p>  
        <p type="p">103:減法器</p>  
        <p type="p">104:直流電壓控制器</p>  
        <p type="p">105:加法器</p>  
        <p type="p">106:有效電力運算器</p>  
        <p type="p">107:頻率指令運算器</p>  
        <p type="p">108:積分器</p>  
        <p type="p">109:電壓指令運算器</p>  
        <p type="p">110:PWM運算器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1249" publication-number="202620833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G09G3/3208</main-classification>  
        <further-classification edition="200601120251201B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安淳晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SOONSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金陽完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YANGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種顯示器，包括：顯示面板，包含其中設有複數個像素的顯示區域及圍繞該顯示區域而設的非顯示區域；以及至少一個閘極驅動器，配置以施加掃描訊號及發光訊號至該等像素。補償電容器在發光時段中被短路，但在至少一個其他驅動時段中被施加直流電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display device, including: a display panel including a display region in which pixels are disposed and a non-display region disposed around the display region; and at least one gate driver configured to apply a scan signal and a light emission signal to the pixels. A compensation capacitor is shorted during a light emission period but is applied a direct current voltage during at least one other driving period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">10:時序控制器</p>  
        <p type="p">11:位準移位器</p>  
        <p type="p">20:閘極驅動器</p>  
        <p type="p">20A:掃描驅動電路</p>  
        <p type="p">20B:發光驅動電路</p>  
        <p type="p">30:資料驅動器</p>  
        <p type="p">40:供電單元</p>  
        <p type="p">50:顯示面板</p>  
        <p type="p">CONT1:閘極驅動訊號</p>  
        <p type="p">CONT2:發光驅動訊號</p>  
        <p type="p">CONT3:資料驅動控制訊號</p>  
        <p type="p">CONT4:供電控制訊號</p>  
        <p type="p">CS:控制訊號</p>  
        <p type="p">DATA:影像資料</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">EL:發光線</p>  
        <p type="p">ELVDD:高電位驅動電壓</p>  
        <p type="p">ELVSS:低電位驅動電壓</p>  
        <p type="p">GL:掃描線</p>  
        <p type="p">OA1,OA2:光學區域</p>  
        <p type="p">PL1:高電位驅動電壓線</p>  
        <p type="p">PL2:低電位驅動電壓線</p>  
        <p type="p">PX:像素</p>  
        <p type="p">RGB:視訊訊號</p>  
        <p type="p">VAR:偏壓電壓</p>  
        <p type="p">VARL:偏壓電壓線</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">VrefL:參考電壓線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1250" publication-number="202620050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合ＡＰＲＩＬ的抗體及其用途</chinese-title>  
        <english-title>ANTIBODIES BINDING APRIL AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/28</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P37/02</further-classification>  
        <further-classification edition="200601120260202B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商北京天廣實生物技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING MABWORKS BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林光忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, GUANGZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李江美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIANGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張倫峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LUNFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周雪晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, XUECHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫銘澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MINGZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種能夠與APRIL特異結合的分離的單殖株抗體或其抗原結合部分。本申請還涉及編碼該抗體或其抗原結合部分的核酸分子，用於表達該抗體或其抗原結合部分的表達載體、宿主細胞和方法，以及使用該抗體或其抗原結合部分、核酸分子、表達載體及/或宿主細胞的治療方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application provides an isolated monoclonal antibody or an antigen binding portion thereof, that specifically binds to APRIL. Also provided is a nucleic acid molecule that encodes the antibody or antigen binding portion thereof, and an expression vector, a host cell and a method for expressing the antibody or antigen binding portion thereof. The application further provides a therapeutic method using the antibody or antigen binding portion, nucleic acid molecule, expression vector, and/or host cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1251" publication-number="202620233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由氣體或壓力控制的調變進行的化學製程增強</chinese-title>  
        <english-title>CHEMICAL PROCESS ENHANCEMENT THROUGH MODULATION OF GAS OR PRESSURE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/455</main-classification>  
        <further-classification edition="200601120260223B">C23C16/52</further-classification>  
        <further-classification edition="202601120260223B">H10P14/24</further-classification>  
        <further-classification edition="200601120260223B">G05D16/20</further-classification>  
        <further-classification edition="200601120260223B">G05D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾米　撒莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELMY, SAMEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡多納　艾迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARDONA, EDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧森　克里斯多夫Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSEN, CHRISTOPHER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露大體係關於調節處理腔室內部腔室的壓力及/或調節處理氣體的速度。該處理腔室包括腔室、配置為將處理氣體導入腔室的氣體進口、配置為將處理氣體從腔室中移除的排氣裝置、位於氣體進口和排氣裝置之間的基板固持件，以及配置為將惰性或處理氣體脈衝注入腔室的第一注射器。在一個實施例中，該處理腔室進一步包括配置為將惰性氣體脈衝注入腔室的第二注射器，其中第一注射器在基板固持件之前脈衝惰性氣體，而第二注射器在基板固持件之後脈衝惰性氣體。在另一個實施例中，該處理腔室包括配置為在基板處理時關閉或部分關閉的壓力控制閥，以限制排氣裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure generally relates to modulating pressure within an inner chamber of a processing chamber and/or modulating velocity of a processing gas. The processing chamber comprises a chamber, a gas inlet configured to flow processing gas into the chamber, an exhaust configured to remove processing gas from the chamber, a substrate holder disposed between the gas inlet and the exhaust, and a first injector configured to pulse inert or process gas into the chamber. In one embodiment, the processing chamber further comprises a second injector configured to pulse the inert gas into the chamber, where the first injector pulses inert gas before the substrate holder and the second injector pulses inert gas after the substrate holder. In another embodiment, the processing chamber comprises a pressure control valve configured to close or partially close being processing of a substrate to constrict the exhaust.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:腔室/方法/處理系統</p>  
        <p type="p">302:內部腔室/反應器</p>  
        <p type="p">304:基板</p>  
        <p type="p">306:進口</p>  
        <p type="p">308:排氣裝置</p>  
        <p type="p">309:泵</p>  
        <p type="p">310:注射器</p>  
        <p type="p">312:注射器</p>  
        <p type="p">314:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1252" publication-number="202620618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設定調整</chinese-title>  
        <english-title>DISPLAY SETTING ADJUSTMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F3/147</main-classification>  
        <further-classification edition="200601120251201B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商六科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROKU, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許軒豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSUAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文公開了用於通過從感測器接收顯示狀態值並確定顯示值在預定範圍之外來調整顯示設備的顯示設定的系統、裝置、製品、方法和/或電腦程式產品實施例，和/或其組合及子組合。一個示例實施例通過從感測器接收顯示設備的顯示狀態值來操作，其中該顯示狀態值是基於顯示設備的亮度和顯示設備的顏色值中的至少一個來確定的。該示例實施例進一步通過確定顯示狀態值在預定範圍之外來操作。該示例實施例進一步通過回應於該確定來調整顯示設備的亮度和顯示設備的顏色值中的至少一個來操作，從而控制顯示設備的顯示設定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are system, apparatus, article of manufacture, method and/or computer program product embodiments, and/or combinations and sub-combinations thereof, for adjusting a display setting of a display device by receiving a display status value from a sensor and determining that a display value is outside a predetermined range. An example embodiment operates by receiving the display status value of the display device from the sensor, where the display status value is determined based on at least one of a brightness of the display device and a color value of the display device. The example embodiment further operates by determining that the display status value is outside a predetermined range. The example embodiment further operates by adjusting at least one of the brightness of the display device and the color value of the display device in response to the determination, thereby controlling the display setting of the display device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p>  
        <p type="p">410:步驟</p>  
        <p type="p">412:步驟</p>  
        <p type="p">414:步驟</p>  
        <p type="p">416:步驟</p>  
        <p type="p">418:步驟</p>  
        <p type="p">420:步驟</p>  
        <p type="p">422:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1253" publication-number="202619719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療方法</chinese-title>  
        <english-title>METHODS OF TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/4985</main-classification>  
        <further-classification edition="200601120260202B">A61K31/44</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4025</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　亞卡蘭　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, JASKARAN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供治療有需要之個體之躁鬱症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating bipolar disorder in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1254" publication-number="202620312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碟式煞車咬合點調整總成</chinese-title>  
        <english-title>DISC BRAKE BITE POINT ADJUSTMENT ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F16D55/22</main-classification>  
        <further-classification edition="200601120251231B">F16D65/14</further-classification>  
        <further-classification edition="200601120251231B">F16D65/18</further-classification>  
        <further-classification edition="200601120251231B">B62L1/02</further-classification>  
        <further-classification edition="200601120251231B">B60T1/06</further-classification>  
        <further-classification edition="201201320251231B">F16D121/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種碟式煞車主缸咬合點調整總成。咬合點調整旋鈕安裝在主缸儲液器外殼的頂部上，其允許騎士將煞車槓桿的位置設定至騎士感覺到煞車槓桿紮實的咬合點。咬合點是藉由在煞車槓桿鬆開時，改變主缸活塞的軸向停止點而調整。可旋轉的咬合點調節旋鈕包括多個供騎士接合的制動位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disc brake master cylinder bite point adjustment assembly is provided. A bite point adjustment knob is mounted on the top of a master cylinder reservoir housing which allows a rider to set a brake lever position to a bite point that the brake lever feels solid to the rider. The bite point is adjusted by changing an axial direction stopping point of the master cylinder piston when the brake lever is released . The rotatable bite point adjustment knob includes multiple detent positions for the rider to engage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碟式煞車主缸咬合點調整總成</p>  
        <p type="p">12:主缸儲液器外殼</p>  
        <p type="p">13:下部</p>  
        <p type="p">14:咬合點調整旋鈕</p>  
        <p type="p">15:上部</p>  
        <p type="p">16:煞車槓桿</p>  
        <p type="p">18:把手握把</p>  
        <p type="p">19:煞車槓桿伸距調整螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1255" publication-number="202619714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療方法</chinese-title>  
        <english-title>METHODS OF TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/44</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4025</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　亞卡蘭　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, JASKARAN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在有需要之個體中治療神經或精神疾病或病症之方法、治療與神經或精神疾病或病症相關之行為問題的方法及改善神經或精神疾病或病症之行為及/或心理症狀的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating a neurological or psychiatric disease or disorder, methods of treating behavioral problems associated with a neurological or psychiatric disease or disorder, and methods of improving behavioral and/or psychological symptoms of a neurological or psychiatric disease or disorder in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1256" publication-number="202620055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療極度重症患者之休克之針對且結合至DPP3之抗DPP3抗體</chinese-title>  
        <english-title>ANTI-DPP3 ANTIBODY DIRECTED TO AND BINDING TO DPP3 FOR THE TREATMENT OF SHOCK IN EXTREME-CRITICALLY ILL PATIENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/40</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P13/12</further-classification>  
        <further-classification edition="200601120260202B">A61P9/00</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification>  
        <further-classification edition="200601120260202B">A61P11/00</further-classification>  
        <further-classification edition="200601120260202B">A61P1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商4ＴＥＥＮ4製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>4TEEN4 PHARMACEUTICALS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯格曼　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGMANN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於治療患有休克的患者之休克之結合至DPP3之抗DPP3抗體或其片段，其中該患者為極度重症患者。在某些態樣中，本發明係關於一種用於治療患有休克之重症患者以改善或穩定腎功能之結合至DPP3之抗DPP3抗體或其片段，其中該休克患者患有急性腎損傷(AKI)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an anti-DPP3 antibody or fragment thereof binding to DPP3 for the treatment of shock in a patient having shock, wherein said patient is an extreme-critically ill patient. In certain aspects, the present invention relates to an anti-DPP3 antibody or fragment thereof binding to DPP3 for use in therapy in a critically ill patient with shock for improvement or stabilization of kidney function, wherein said shock patient has acute kidney injury (AKI).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1257" publication-number="202620965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式天線裝置與其相位校正方法</chinese-title>  
        <english-title>INTEGRATED ANTENNA DEVICE AND PHASE CALIBRATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01Q3/30</main-classification>  
        <further-classification edition="200601120251201B">H01Q21/00</further-classification>  
        <further-classification edition="201801120251201B">H04B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稜研科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹鈞丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSUAN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林先武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIAN WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露整合式天線裝置包括矩陣形式排列的多個貼片天線單元，其相位校正方法包括以下步驟。透過第一貼片天線單元與第二貼片天線單元，接收來自遠場的第一射頻信號。混合第一貼片天線單元與第二貼片天線單元反應第一射頻信號而產生的射頻信號，以產生第一混合信號。透過第一貼片天線單元與第二貼片天線單元，發射第二射頻信號至遠場。混合第一貼片天線單元與第二貼片天線單元反應第二射頻信號而產生的射頻信號，以產生第二混合信號。根據第一混合信號與第二混合信號的振幅比例，決定第一貼片天線單元與第二貼片天線單元之間的第一相位誤差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed integrated antenna device is provided with a plurality of patch antenna units arranged in a matrix form, and its phase calibration method includes the following steps. A first radio frequency signal from a far field is received through a first patch antenna unit and a second patch antenna unit. A first mixed signal is generated by mixing radio frequency signals produced in response to the first radio frequency signal by the first patch antenna unit and the second patch antenna unit. A second radio frequency signal is transmitted to the far field through the first patch antenna unit and the second patch antenna unit. A second mixed signal is generated by mixing radio frequency signals produced in response to the second radio frequency signal by the first patch antenna unit and the second patch antenna unit. A first phase error between the first patch antenna unit and the second patch antenna unit is determined according to an amplitude ratio between the first mixed signal and the second mixed signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合式天線裝置</p>  
        <p type="p">110:連接部</p>  
        <p type="p">120:匯流排介面</p>  
        <p type="p">RF_A,RF_B:射頻信號</p>  
        <p type="p">BFIC1:波束成型積體電路</p>  
        <p type="p">Ant_1~Ant_4:貼片天線單元</p>  
        <p type="p">VDD1,VDD2:外部電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1258" publication-number="202619870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>事前更換時期預測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">B29B7/28</main-classification>  
        <further-classification edition="200601120251126B">B29B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本紡錘製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON SPINDLE MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小椋宏曜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森脇安寿野</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIWAKI, ASUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明亦預測特定的更換零件以外的更換零件的事前更換時期。 &lt;br/&gt;　　[解決手段] 事前更換時期預測裝置判斷混煉材料處理裝置的更換零件是否已到達事前更換時期，前述混煉材料處理裝置具備多個更換零件，並利用前述多個更換零件對混煉材料進行處理，前述事前更換時期預測裝置具備：判斷部，係判斷前述多個更換零件中的每一個是否已到達各自的事前更換時期。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:混煉機</p>  
        <p type="p">12A~12C:分解檢測感測器</p>  
        <p type="p">20:電腦</p>  
        <p type="p">22:輸入裝置</p>  
        <p type="p">24:顯示裝置</p>  
        <p type="p">32:CPU</p>  
        <p type="p">32A:輸入處理部</p>  
        <p type="p">32B:判斷部</p>  
        <p type="p">32C:讀取部</p>  
        <p type="p">32D:設置處理部</p>  
        <p type="p">32E:獲取部</p>  
        <p type="p">32F:顯示處理部</p>  
        <p type="p">34:RAM</p>  
        <p type="p">36:NVM</p>  
        <p type="p">36P1:更換零件更換處理程式</p>  
        <p type="p">36P2:事前更換時期到達判斷處理程式</p>  
        <p type="p">38:輸入輸出(I/O埠)</p>  
        <p type="p">40:匯流排</p>  
        <p type="p">M1(~Mn):時間計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1259" publication-number="202620864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速低洩漏靜態隨機存取記憶體單元</chinese-title>  
        <english-title>FAST LOW-LEAKAGE SRAM CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260114B">G11C11/413</main-classification>  
        <further-classification edition="200601120260114B">G11C7/12</further-classification>  
        <further-classification edition="200601120260114B">G11C11/4193</further-classification>  
        <further-classification edition="200601120260114B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易敬軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, JINGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代　鐵軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, TIEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　日新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, SUNNY YAT-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭露了諸如用於數位顯示系統之快速低洩漏SRAM單元。在一項實施例中，一種位元儲存電路包含耦合在一供應電壓與接地之間的一鎖存器，以及第一至第四電晶體。該鎖存器可包括具有第一反相器及第二反相器之一對交叉耦合的反相器。該第一電晶體可至少部分地基於一第一控制信號而選擇性地將該第一反相器耦合至該供應電壓。該第二電晶體可至少部分地基於不同於該第一控制信號之一第二控制信號而選擇性地將該第一反相器之一輸入耦合至接地。該第三電晶體可至少部分地基於該第二控制信號而選擇性地將該第二反相器耦合至該供應電壓。該第四電晶體可至少部分地基於該第一控制信號而選擇性地將該第二反相器之一輸入耦合至接地。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Fast low-leakage SRAM cells, such as for digital display systems, are disclosed herein. In one embodiment, a bit storage circuit includes a latch coupled between a supply voltage and ground, and first through fourth transistors. The latch can comprise a pair of cross-coupled inverters having first and second inverters. The first transistor can selectively couple the first inverter to the supply voltage based at least in part on a first control signal. The second transistor can selectively couple an input of the first inverter to ground based at least in part on a second control signal different from the first control signal. The third transistor can selectively couple the second inverter to the supply voltage based at least in part on the second control signal. The fourth transistor can selectively couple an input of the second inverter to ground based at least in part on the first control signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">330:位元儲存電路</p>  
        <p type="p">331:第一下拉支路</p>  
        <p type="p">332:電晶體</p>  
        <p type="p">333:第二下拉支路</p>  
        <p type="p">334:電晶體</p>  
        <p type="p">336:電晶體</p>  
        <p type="p">338:電晶體</p>  
        <p type="p">340:鎖存器</p>  
        <p type="p">341:第一反相器</p>  
        <p type="p">342:電晶體/經啟動電晶體</p>  
        <p type="p">343:第二反相器</p>  
        <p type="p">344:電晶體/經啟動電晶體</p>  
        <p type="p">345a:第一鎖存節點/第一節點</p>  
        <p type="p">345b:第二鎖存節點/第二節點</p>  
        <p type="p">346:電晶體/經啟動電晶體</p>  
        <p type="p">348:電晶體/經啟動電晶體</p>  
        <p type="p">351:第一上拉支路</p>  
        <p type="p">353:第二上拉支路</p>  
        <p type="p">C:清除控制信號/控制信號/清除信號</p>  
        <p type="p">GND:接地</p>  
        <p type="p">h:輸出</p>  
        <p type="p">i:輸入</p>  
        <p type="p">j:輸入</p>  
        <p type="p">k:輸出</p>  
        <p type="p">S:設定控制信號/控制信號</p>  
        <p type="p">V0:第一供應電壓</p>  
        <p type="p">V1:第二供應電壓</p>  
        <p type="p">VDD:第一供應電壓/第二電壓</p>  
        <p type="p">WL:字線選擇信號/寫入啟用信號/列啟用信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1260" publication-number="202621169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通信方法及通信裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/0446</main-classification>  
        <further-classification edition="200901120260202B">H04W28/06</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊特拉卡　羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITRAKAR, ROJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及通信裝置，用於設計一種統一的PPDU的幀格式。本申請支援IEEE協定，例如802.11be，Wi-Fi 7，EHT，IEEE 802.11bn，UHR，Wi-Fi 8，IMMW，802.15，802.11bf等協定，也可以支援星閃協定。該方法包括：發送PPDU，所述PPDU為AMP PPDU，所述PPDU包括第一載荷、第一字段和第二字段；其中，所述第一字段用於指示是否存在充能（energizer）信號，所述第二字段用於指示所述第一載荷的調製與編碼策略MCS。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus are provided to design a unified PPDU format. This application supports IEEE protocols, such as 802.11be, Wi-Fi 7, EHT, IEEE 802.11bn, UHR, Wi-Fi 8, IMMW, 802.15, 802.11bf and other protocols, this application also can support sparklink/nearlink protocols. The method comprises: sending a PPDU, the PPDU is an AMP PPDU, and the PPDU comprises a first payload, a first field and a second field; wherein the first field indicates the presence of an energizer signal, and the second field indicates a modulation and coding scheme (MCS) of the first payload.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S501、S502、S503:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1261" publication-number="202620035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>癌症標靶胜肽、輸送載體、及醫藥組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K14/47</main-classification>  
        <further-classification edition="200601120260202B">A61K38/16</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進藤敦徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, ATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀江裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIE, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉井宏紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島秀人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樫美和子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAGI, MIWAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供：一種癌症標靶胜肽，含有由序列編號1～47中之任一者的胺基酸序列構成的胜肽；如前述癌症標靶胜肽，其以選自於由胰臟癌及肝癌構成之群組中之1種以上的癌症作為標靶；一種用以特異性地輸送至癌症的輸送載體，含有如前述任一者之癌症標靶胜肽；一種醫藥組成物，含有如前述任一者之癌症標靶胜肽；及如前述醫藥組成物，其使用於癌症治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1262" publication-number="202620182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造電子裝置之水溶液、製造光阻圖案之方法及製造裝置之方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE MANUFACTURING AQUEOUS SOLUTION, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C11D7/06</main-classification>  
        <further-classification edition="200601120260205B">C11D1/14</further-classification>  
        <further-classification edition="200601120260205B">C11D1/75</further-classification>  
        <further-classification edition="200601120260205B">C11D1/28</further-classification>  
        <further-classification edition="200601120260205B">C11D1/83</further-classification>  
        <further-classification edition="200601120260205B">G03F7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商默克專利有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳田浩志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGITA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本和磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角椋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMI, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井牧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, MAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[問題]&lt;br/&gt; 本發明提供一種能抑制缺陷之製造電子裝置之水溶液。&lt;br/&gt; [解決方法]&lt;br/&gt; 一種製造電子裝置之水溶液，其包含烴界面活性劑(A)及溶劑(S)，其中烴界面活性劑(A)不含氟，溶劑(S)包含水(S-1)，該製造電子裝置之水溶液的pH為7.5至12.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Problem]&lt;br/&gt; An electronic device manufacturing aqueous solution that enables suppression of defects is provided.&lt;br/&gt; [Means of Solution]&lt;br/&gt; An electronic device manufacturing aqueous solution, comprising a hydrocarbon surfactant (A) and a solvent (S), wherein the hydrocarbon surfactant (A) does not contain fluorine, the solvent (S) comprises water (S-1), the pH of the electronic device manufacturing aqueous solution is 7.5 to 12.0.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1263" publication-number="202620189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細胞外囊泡的純化回收方法及其套組</chinese-title>  
        <english-title>METHOD FOR PURIFYING AND RECOVERING EXTRACELLULAR VESICLES AND KIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260210B">C12N5/07</main-classification>  
        <further-classification edition="200601120260210B">G01N33/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程吉安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐辰瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方耀慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, YAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JHIH-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種目標細胞外囊泡的純化回收方法，包括以下步驟：提供樣本，其中樣本包括目標細胞外囊泡與非目標細胞外囊泡；加入檢測單元至樣本中，以使檢測單元中的抗體結合至目標細胞外囊泡而形成第一複合物，其中檢測單元包括抗體以及連接至抗體的第一核酸鏈；加入捕獲單元，以使捕獲單元中的第二核酸鏈雜交至第一核酸鏈而形成第二複合物，其中捕獲單元包括磁珠以及連接至磁珠的第二核酸鏈；進行清洗步驟，以移除非目標細胞外囊泡；以及加入第三核酸鏈，以使第三核酸鏈雜交至第二核酸鏈而釋放出含有目標細胞外囊泡的第一複合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for purifying and recovering a target extracellular vesicle includes the following steps: providing a sample, wherein the sample includes the target extracellular vesicle and a non-target extracellular vesicle; adding a detection unit to the sample so that an antibody of the detection unit binds to the target extracellular vesicle to form a first complex, wherein the detection unit includes the antibody and a first nucleic acid chain connected to the antibody; adding a capture unit so that a second nucleic acid chain of the capture unit hybridizes to the first nucleic acid chain to form a second complex, wherein the capture unit includes a magnetic bead and the second nucleic acid chain connected to the magnetic bead; performing a washing step to remove the non-target extracellular vesicle; and adding a third nucleic acid chain so that the third nucleic acid chain hybridizes to the second nucleic acid chain to release the first complex containing the target extracellular vesicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:用於純化回收目標細胞外囊泡的套組</p>  
        <p type="p">100:檢測單元</p>  
        <p type="p">110:抗體</p>  
        <p type="p">120:第一核酸鏈</p>  
        <p type="p">121、221:連接區</p>  
        <p type="p">122:第一結合位互補區</p>  
        <p type="p">200:捕獲單元</p>  
        <p type="p">210:磁珠</p>  
        <p type="p">220:第二核酸鏈</p>  
        <p type="p">222:立足點區</p>  
        <p type="p">223:結合位區</p>  
        <p type="p">300:第三核酸鏈</p>  
        <p type="p">310:第二結合位互補區</p>  
        <p type="p">320:立足點互補區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1264" publication-number="202621075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＰＤＵ傳輸方法、裝置及可讀儲存介質</chinese-title>  
        <english-title>A PPDU TRANSMISSION METHOD, APPARATUS, AND READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04L5/00</main-classification>  
        <further-classification edition="200601120260202B">H04L1/00</further-classification>  
        <further-classification edition="200901120260202B">H04W84/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊訊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種PPDU傳輸方法、裝置及可讀儲存介質，該方法包括：AMP 設備發送AMP PPDU，該AMP PPDU包括同步欄位、信令欄位、以及有效載荷，該同步欄位基於同步序列生成，該同步序列用於指示或對應至少一個資料率，信令欄位中的第一資訊用於和該同步序列結合指示有效載荷的資料率。採用本申請，可以節省信令欄位的位元數，並可以增加同步序列的檢測可靠性。本申請可以應用於AMP領域，如支援WPT，WLAN或IEEE系列協定等。如IEEE 802.11與AMP有關的協議，或者適用於IEEE 802.11系列的其他協定，例如802.11a/b/g/n/ac/ax/be/bn協定等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to a PPDU transmission method, apparatus, and readable storage medium. The method includes: an AMP device sending an AMP PPDU, which comprises a synchronization field, a signaling field, and a payload. The synchronization field is generated based on a synchronization sequence, which is used to indicate or correspond to at least one data rate. The first information in the signaling field together with the synchronization sequence are used to indicate the data rate of the payload. By adopting the method of this application, the number of bits in the signaling field can be saved, and the detection reliability of the synchronization sequence can be increased. This application can be applied in the AMP field, such as supporting WPT, WLAN, or IEEE series protocols. For example, IEEE 802.11 protocols related to AMP, or other protocols applicable to the IEEE 802.11 series, such as 802.11a/b/g/n/ac/ax/be/bn protocols, etc.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1265" publication-number="202620633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於偵測的使用者狀態及預測的使用者意圖的裝置上個人化</chinese-title>  
        <english-title>ON-DEVICE PERSONALIZATION BASED ON DETECTED USER STATE AND PREDICTED USER INTENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/44</main-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification>  
        <further-classification edition="202301120251201B">G06N3/08</further-classification>  
        <further-classification edition="202201120251201B">G06F3/0481</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤迪言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, DIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索門　梅荷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAN, MEHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓君生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JUNSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些態樣中，一種裝置可獲得一組觀察，其中該組觀察中之各觀察包括與一或多個感測器信號相關聯的一組特徵。該裝置可基於該組觀察來偵測一當前時間下的一使用者狀態。該裝置可基於該組觀察來預測一未來窗口中的一使用者意圖。該裝置可透過一網路發送一訊息以基於該當前時間下的該使用者狀態及該未來窗口中的該使用者意圖滿足與一服務相關聯的一或多個條件來請求該服務。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some aspects, a device may obtain a set of observations, wherein each observation in the set of observations includes a set of features associated with one or more sensor signals. The device may detect a user state at a current time based on the set of observations. The device may predict a user intent in a future window based on the set of observations. The device may send a message over a network to request a service based on the user state at the current time and the user intent in the future window satisfying one or more conditions associated with the service. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">320:情境組件</p>  
        <p type="p">330:外部源</p>  
        <p type="p">340:個人知識圖組件</p>  
        <p type="p">342:狀態空間映射及圖神經網路(GNN)組件</p>  
        <p type="p">344:情境儲存庫</p>  
        <p type="p">346:屬性儲存庫</p>  
        <p type="p">350:推論排程器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1266" publication-number="202620679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於多模型人工智慧的詐騙檢查器</chinese-title>  
        <english-title>MULTI-MODEL ARTIFICIAL INTELLIGENCE-BASED SCAM CHECKER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260202B">G06F21/55</main-classification>  
        <further-classification edition="202301120260202B">G06N5/022</further-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification>  
        <further-classification edition="202201120260202B">G06V10/80</further-classification>  
        <further-classification edition="202201120260202B">G06V30/412</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商趨勢科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREND MICRO INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳靖琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JING-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘明正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了一種為檢查詐騙而檢查內容的詐騙檢查器。詐騙檢查器包含多個人工智慧(AI)模型以分解輸入內容、生成用於收集證據的證據聚集計劃，前述證據用於決定收集輸入資料是否指示詐騙、收集證據，並且評估收集到的證據以生成輸入內容是否指示詐騙的摘要。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a scam checker for checking contents for scams. The scam checker includes several artificial intelligence (AI) models to decompose an input content, generate a plan for collecting evidence for determining whether the input content is indicative of a scam, collect the evidence, and evaluate the collected evidence to generate a summary that indicates whether the input content is indicative of a scam.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:詐騙檢查器</p>  
        <p type="p">101:箭頭</p>  
        <p type="p">102:箭頭</p>  
        <p type="p">103:箭頭</p>  
        <p type="p">104:箭頭</p>  
        <p type="p">105:箭頭</p>  
        <p type="p">106:箭頭</p>  
        <p type="p">120:分解模型</p>  
        <p type="p">121:模型</p>  
        <p type="p">122:模型</p>  
        <p type="p">123:模型</p>  
        <p type="p">150:資料庫</p>  
        <p type="p">151:為調模型</p>  
        <p type="p">152:人類專家</p>  
        <p type="p">153:工具</p>  
        <p type="p">154:線上資源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1267" publication-number="202621344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260205B">H10K59/131</main-classification>  
        <further-classification edition="201601120260205B">G09G3/3275</further-classification>  
        <further-classification edition="200601120260205B">G02F1/1343</further-classification>  
        <further-classification edition="202301120260205B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅世煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, SEHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安淳晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SOONSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例涉及一種顯示裝置，更具體地，涉及一種顯示裝置，其能夠透過在光學區域中差異化地佈置複數條資料連接線，其中該複數條資料連接線包含第一連接線及電阻低於第一連接線的第二連接線，以最小化因光學區域中的佈線電阻差異所造成的亮度差異。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of the present disclosure relate to a display device, and more particularly, to a display device capable of minimizing luminance variation caused by differences in wiring resistance within an optical area by differentially arranging a plurality of data connection lines, including a first connection line and a second connection line having a lower resistance than the first connection line, in the optical area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:第一區域</p>  
        <p type="p">A2:第二區域</p>  
        <p type="p">DCL1:第一連接線</p>  
        <p type="p">DCL2:第二連接線</p>  
        <p type="p">DP:鋸齒狀圖案</p>  
        <p type="p">DSL:資料子線</p>  
        <p type="p">EA1:第一發光區域</p>  
        <p type="p">OA:光學區域</p>  
        <p type="p">SP1:第一顏色子像素</p>  
        <p type="p">SP2:第二顏色子像素</p>  
        <p type="p">SP3:第三顏色子像素</p>  
        <p type="p">TA:透射區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1268" publication-number="202620621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基於遮罩之模數乘法運算之乘法器裝置、加密裝置及方法</chinese-title>  
        <english-title>MULTIPLIER DEVICE FOR MASKING-BASED MODULAR MULTIPLICATION OPERATION, ENCRYPTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F7/58</main-classification>  
        <further-classification edition="200601120260202B">G06F7/72</further-classification>  
        <further-classification edition="202201120260202B">H04L9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金省暻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種乘法器裝置包括：一遮罩電路，其基於一隨機數對一被乘數及一乘數進行遮罩，以分別獲得一經遮罩被乘數及一經遮罩乘數；一第一中間運算電路，其獲得基於該經遮罩被乘數、該經遮罩乘數及該隨機數所定義之一遮罩項，且透過該隨機數與該遮罩項之一乘法運算獲得一隨機數倍乘結果；一第二中間運算電路，其獲得該經遮罩被乘數與該經遮罩乘數之一部分乘積結果以及一模數與該模數之一商數的一模數倍乘結果；以及一累加電路，其將該部分乘積結果、該模數倍乘結果及該隨機數倍乘結果累加至前一迴圈之一中間結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multiplier device includes a masking circuit that masks a multiplicand and a multiplier based on a random number, to obtain a masked multiplicand and a masked multiplier, respectively, a first intermediate operation circuit that obtains a masking term defined based on the masked multiplicand, the masked multiplier, and the random number, and to obtain a multiple random number result through a multiplication operation of the random number and the masking term, a second intermediate operation circuit that obtains a partial product result for the masked multiplicand and the masked multiplier, and a multiple modulus result for a modulus and a quotient of the modulus, and an accumulation circuit that accumulates the partial product result, the multiple modulus result, and the multiple random number result up to an intermediate result of a previous loop.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:乘法器</p>  
        <p type="p">110:遮罩電路</p>  
        <p type="p">120:第一中間運算電路</p>  
        <p type="p">130:第二中間運算電路</p>  
        <p type="p">140:累加電路</p>  
        <p type="p">A:被乘數</p>  
        <p type="p">Ar:經遮罩被乘數</p>  
        <p type="p">B:乘數</p>  
        <p type="p">Br:經遮罩乘數</p>  
        <p type="p">MM:模數倍乘結果</p>  
        <p type="p">MR:隨機數倍乘結果</p>  
        <p type="p">PP:部分乘積結果</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1269" publication-number="202620126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯樹脂及包含其之聚酯樹脂組成物</chinese-title>  
        <english-title>POLYESTER RESIN AND POLYESTER RESIN COMPOSITION COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C08L67/06</main-classification>  
        <further-classification edition="200601120260205B">C08G63/137</further-classification>  
        <further-classification edition="200601120260205B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SE-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO-KYOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金聖基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG-GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亥里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAE-RI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慎鏞埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YONG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種聚酯樹脂及包含其之聚酯樹脂組成物。由於該聚酯樹脂具有柔軟度以及受控結晶度，故藉由其塑化獲得之聚酯樹脂組成物可使塑化劑的遷移最小化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polyester resin and to a polyester resin composition that comprises the same. Since the polyester resin has softness, along with controlled crystallinity, the polyester resin composition obtained by plasticization thereof can minimize migration of the plasticizer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1270" publication-number="202620201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海綿鐵之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C21B13/00</main-classification>  
        <further-classification edition="200601120260204B">C22B5/10</further-classification>  
        <further-classification edition="200601120260204B">B22F9/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本尚貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘆塚康佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHIZUKA, KOHSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供藉由較習知技術可提高氧化鐵粉末還原時所必要之一氧化碳的生成速率，且可以高效率製造海綿鐵的方法。本發明的海綿鐵之製造方法，係將氧化鐵粉末與碳質還原粉末裝入容器中，藉由加熱將氧化鐵粉末還原而製造海綿鐵時，對碳質還原粉末使用CuK&lt;sub&gt;α&lt;/sub&gt;線施行粉末X射線繞射，從所獲得繞射圖案中根據相當於石墨結晶(002)繞射面的繞射尖峰，由謝樂方程式(L=Kλ/(Bcosθ))所求得的晶粒大小L係0.01nm以上且25.0nm以下。其中，K係謝樂常數0.9，λ係CuK&lt;sub&gt;α&lt;/sub&gt;線的波長0.15418(nm)，B係繞射尖峰的半峰寬(rad)，θ係相當於石墨結晶(002)繞射面的布拉格角(度)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1271" publication-number="202620313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碟式煞車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">F16D55/22</main-classification>  
        <further-classification edition="200601120251008B">F16D65/02</further-classification>  
        <further-classification edition="200601120251008B">F16D65/092</further-classification>  
        <further-classification edition="200601120251008B">F16D65/18</further-classification>  
        <further-classification edition="201201320251008B">F16D125/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商安斯泰莫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTEMO, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村常愉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, JOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波多腰弦一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKOSHI, GENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種碟式煞車，其在藉由肋部維持著卡鉗本體之剛性的狀態下，實現卡鉗本體之輕量化。 &lt;br/&gt;本發明之解決手段為，利用橋接部6c將作用部6a與反作用部6b加以連結而形成卡鉗本體6，並設置遍及作用部、橋接部、反作用部之肋部。在將形成於橋接部之第2肋部23b的肋中心線與通過中間反力爪之碟盤圓周方向中央的反力爪中心線虛擬地設置於同一線上的情形下，形成在相鄰的缸孔6h、6i之間的中間肋部23係，相較於反力爪中心線將肋中心線更向與朝向缸孔之軸向底部側之力相對應之產生應力較大的缸孔6h側偏移地形成。形成在反作用部6b之第3肋部23c被形成為連繫著第2肋部23b與中間反力爪6k。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:碟式煞車</p>  
        <p type="p">2:碟盤轉子</p>  
        <p type="p">3:卡鉗支架</p>  
        <p type="p">3a:板狀部</p>  
        <p type="p">3b:墊片支撐腕</p>  
        <p type="p">3c:墊片導引溝槽</p>  
        <p type="p">4:滑動銷</p>  
        <p type="p">6:卡鉗本體</p>  
        <p type="p">6b:反作用部</p>  
        <p type="p">6c:橋接部</p>  
        <p type="p">6g:吊架銷支撐腕</p>  
        <p type="p">6h、6i:缸孔</p>  
        <p type="p">6j:碟盤旋出側反力爪</p>  
        <p type="p">6k:中間反力爪</p>  
        <p type="p">6m:碟盤旋入側反力爪</p>  
        <p type="p">7:摩擦墊片</p>  
        <p type="p">7c:耳片</p>  
        <p type="p">7d:懸吊片</p>  
        <p type="p">8:吊架銷</p>  
        <p type="p">9、10:活塞</p>  
        <p type="p">13:排放器</p>  
        <p type="p">21:旋出側肋部</p>  
        <p type="p">22:旋入側肋部</p>  
        <p type="p">23:中間肋部</p>  
        <p type="p">23b:第2肋部</p>  
        <p type="p">23c:第3肋部</p>  
        <p type="p">A:旋轉方向</p>  
        <p type="p">CL1:肋中心線</p>  
        <p type="p">CL2:反力爪中心線</p>  
        <p type="p">P1:寬度方向中央部</p>  
        <p type="p">VL1:虛擬線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1272" publication-number="202621337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電模組及其製造方法</chinese-title>  
        <english-title>PHOTOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251008B">H10H29/855</main-classification>  
        <further-classification edition="202501120251008B">H10H29/854</further-classification>  
        <further-classification edition="202501120251008B">H10H29/03</further-classification>  
        <further-classification edition="202501120251008B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TE-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧紹猷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, SHAO-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種光電模組的製造方法，其包括：提供暫時基板、第一透鏡及第二透鏡，其中第一透鏡與第二透鏡嵌入暫時基板中；設置第一光電元件於第一透鏡之上；設置第二光電元件於第二透鏡之上；形成電連接結構於  第一光電元件及第二光電元件之上；以及移除暫時基板，以暴露第一透鏡及第二透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method for a photoelectric module is provided, which includes the following steps. A temporary substrate, a first lens, and a second lens are provided, wherein the first lens and the second lens are embedded in the temporary substrate. A first photoelectric element is disposed on the first lens. A second photoelectric element is disposed on the second lens. An electrical connection structure is formed on the first and second photoelectric elements. The temporary substrate is removed to expose the first lens and second lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:光電模組</p>  
        <p type="p">11:第一透鏡</p>  
        <p type="p">12:第二透鏡</p>  
        <p type="p">11A,12A:平坦表面</p>  
        <p type="p">11B,12B:弧形凸面</p>  
        <p type="p">13:第一光電元件</p>  
        <p type="p">14:第二光電元件</p>  
        <p type="p">13A,14A:光學面</p>  
        <p type="p">13B,14B:電極面</p>  
        <p type="p">13C,14C:側表面</p>  
        <p type="p">15:中介層</p>  
        <p type="p">15A:上表面</p>  
        <p type="p">16:電連接結構</p>  
        <p type="p">D1,D2:直徑</p>  
        <p type="p">H1,H2:高度</p>  
        <p type="p">U:光電單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1273" publication-number="202619890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體、被覆材或外裝材及電氣、電子機器以及積層體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B32B15/08</main-classification>  
        <further-classification edition="201901120260202B">B32B7/025</further-classification>  
        <further-classification edition="200601120260202B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＸ金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JX ADVANCED METALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大理友希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池川迅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGAWA, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤田正昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMIDA, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種耐環境性良好之積層體。本發明之積層體係使至少1層之金屬層與至少1層之樹脂層積層而成者，且藉由X射線繞射測定，在10°～35°之繞射角度所測得之至少1層之樹脂層之結晶度為85.0%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1274" publication-number="202621283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八窪裕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAKUBO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種新穎半導體裝置。該半導體裝置包括第一電晶體至第三電晶體及輸入端子的第一電路以及第四電晶體，第一電晶體的第一端子與輸入端子、第一電晶體的閘極及第二電晶體的閘極電連接，第二電晶體的第一端子與第一佈線電連接，第一電晶體的第二端子與第三電晶體的第一端子電連接，第三電晶體的閘極與第二電晶體的第二端子、第四電晶體的閘極及第四電晶體的第一端子電連接，第三電晶體的第二端子與第二佈線電連接，第四電晶體的第二端子與輸出端子電連接，該半導體裝置包括多個第一電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10[1]:電路</p>  
        <p type="p">10[i]:電路</p>  
        <p type="p">10[n]:電路</p>  
        <p type="p">11:佈線</p>  
        <p type="p">12:佈線</p>  
        <p type="p">13:佈線</p>  
        <p type="p">100:半導體裝置</p>  
        <p type="p">IN[1]:輸入端子</p>  
        <p type="p">IN[i]:輸入端子</p>  
        <p type="p">IN[n]:輸入端子</p>  
        <p type="p">ND1:節點</p>  
        <p type="p">OUT:端子</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">M2:電晶體</p>  
        <p type="p">M3:電晶體</p>  
        <p type="p">M4:電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1275" publication-number="202620634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133174</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於裸機資源之高速、安全佈建及管理之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR HIGH SPEED AND SECURE PROVISIONING AND MANAGEMENT OF BARE METAL RESOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G06F9/44</main-classification>  
        <further-classification edition="201801120260202B">G06F9/445</further-classification>  
        <further-classification edition="200601120260202B">G06F15/17</further-classification>  
        <further-classification edition="201301120260202B">G06F21/57</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷網科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NET-THUNDER, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密特　帕克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, PARKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, KYLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史皮　卡麥隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPRY, CAMERON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔裘亞　納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STACHOWIAK, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪各斯　維司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIGGS, WES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可使用一開關將裸機資源安全地佈建至電腦系統，該開關切換(1)諸如一磁碟之一儲存目標與一遠端資料源及(2)該儲存目標與該裸機資源之間之連接。以此方式，該等經切換連接提供該裸機資源之隔離，此使其不易受網路攻擊。當啟用該遠端源-儲存目標連接時，可將諸如用於該裸機資源之一作業系統及/或啟動資訊之資料自該遠端源傳送至該儲存目標。當啟用該裸機資源-儲存目標連接時，停用該遠端源-儲存目標連接，且可將該作業系統及/或啟動資訊自該儲存目標傳送至該裸機資源。接著，該裸機資源可基於此作業系統及/或啟動資訊來啟動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Bare metal resources can be securely provisioned to computer systems using a switch that toggles connections between (1) a storage target such as a disk and a remote source of data and (2) the storage target and the bare metal resource. In this fashion, the toggled connections provide isolations of the bare metal resource that make it less susceptible to cyberattack. While the remote source-storage target connection is enabled, data such as an operating system and/or boot information for the bare metal resource can be transferred from the remote source to the storage target. While the bare metal resource-storage target connection is enabled, the remote source-storage target connection is disabled and the operating system and/or boot information can be transferred from the storage target to the bare metal resource. The bare metal resource can then boot based on this operating system and/or boot information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:裸機資源</p>  
        <p type="p">400:儲存目標</p>  
        <p type="p">500:管理裝置</p>  
        <p type="p">600:安全佈建器</p>  
        <p type="p">610:管理裝置連接</p>  
        <p type="p">620:裸機資源連接</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1276" publication-number="202619722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜芳基衍生物化合物及其用途</chinese-title>  
        <english-title>HETEROARYL DERIVATIVE COMPOUNDS, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/506</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260202B">A61K31/497</further-classification>  
        <further-classification edition="200601120260202B">A61K31/44</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4192</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260202B">A61K31/535</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商沃若諾依公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VORONOI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃善娥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SEONAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高利炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YIKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鎭堣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金恩英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, EUNYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁和善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HWASUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAEKWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及雜芳基衍生物及其用途。本發明的雜芳基衍生物對AKT和/或AKT1 E17K表現出優異的抑制活性，因此可有效地用作與AKT和/或AKT1 E17K過度激活、擴增或過表達相關的疾病的治療劑，特別是可用作癌症的治療劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a heteroaryl derivative and use thereof. The heteroaryl derivative of the present invention exhibits excellent inhibitory activity against AKT and/or AKT1 E17K, and thus can be effectively utilized as a therapeutic agent for diseases related to AKT and/or AKT1 E17K hyperactivation, amplification, or overexpression, particularly useful as a therapeutic agent for cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1277" publication-number="202619705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鼻腔炎症和黏液分泌過多的治療的藥物及裝置</chinese-title>  
        <english-title>MEDICATION AND APPARATUS FOR THE TREATMENT OF NASAL CAVITY INFLAMMATION AND MUCUS HYPERSECRETION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/16</main-classification>  
        <further-classification edition="200601120260202B">A61P11/00</further-classification>  
        <further-classification edition="200601120260202B">A61P11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏　德烽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, EDWARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏　德烽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, EDWARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">令人驚訝的是，當使用壓縮式霧化器將FEMA 4557遞送到發炎的鼻黏膜時，它緩解鼻炎受試者的鼻塞並抑制痰分泌，分別通過患者-結果回應和客觀重量法測量。FEMA 4557在以鼻滴劑或沖洗液給藥時也有效於治療鼻炎。FEMA 4557的有效治療量為每保留劑量約1至5 mg。結論是，FEMA 4557是強效、無刺激性的鼻腔和鼻竇中急性炎症的抑制劑，這是對於其它局部清涼劑以前未曾描述過的特性。因此，FEMA 4557及相關類似物可能具有用於治療鼻炎和黏液分泌過多的效用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Surprisingly, when FEMA 4557 was delivered to the inflamed nasal mucosa with a compressor-nebulizer, it relieved nasal stuffiness and inhibited phlegm secretion in subjects with rhinitis, as measured by patient-outcome responses and an objective gravimetric method, respectively. FEMA 4557 was also effective for treating rhinitis when administered in nose drops or in a rinse. The effective therapeutic amount of FEMA 4557 was about 1 to 5 mg per retained dose. The conclusion is that FEMA 4557 is a potent non-irritating suppressor of acute inflammation in the nasal cavity and sinuses, a property not previously described for other topical cooling agents. Thus, FEMA 4557 and related analogs may have therapeutic utility for treating nasal inflammation and mucus hypersecretion.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1278" publication-number="202619939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可裝設於自行車之自行車構件及用於控制外部裝置之自行車控制系統</chinese-title>  
        <english-title>BICYCLE COMPONENT MOUNTABLE TO A BICYCLE AND BICYCLE CONTROL SYSTEM FOR CONTROLLING AN EXTERNAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B62M25/08</main-classification>  
        <further-classification edition="202001120251231B">B62J45/00</further-classification>  
        <further-classification edition="200601120251231B">B62K23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船見奈央樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNAMI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米虫崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMEMUSHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種可裝設於自行車之自行車構件。該自行車構件包括第一使用者輸入部、無線通訊器和控制器。該第一使用者輸入部設置成接收使用者的一第一輸入。該無線通訊器設置成與中繼裝置進行無線通訊，其中該中繼裝置為穿戴式裝置或智慧型手機，並且其中該中繼裝置設置成與外部裝置進行通訊。該控制器設置成在接收到對該第一使用者輸入部的該第一輸入時控制該外部裝置。本發明也關於一種用於控制外部裝置之自行車控制系統。該自行車控制系統包括上述的自行車構件和中繼裝置，該中繼裝置為穿戴式裝置或智慧型手機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a bicycle component mountable to a bicycle. The bicycle component comprises a first user input portion, a wireless communicator, and a controller. The first user input portion is configured to receive a first input of a user. The wireless communicator is configured to wirelessly communicate with a relay device, wherein the relay device is a wearable device or a smartphone, and wherein the relay device is configured to communicate with an external device. The controller is configured to control the external device upon receipt of the first input to the first user input portion. The present disclosure also relates to a bicycle control system for controlling an external device. The bicycle control system comprises the above-described bicycle component and a relay device being a wearable device or a smartphone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:自行車構件</p>  
        <p type="p">14:操作裝置</p>  
        <p type="p">16:夾具</p>  
        <p type="p">17:第一使用者輸入部</p>  
        <p type="p">18:第二使用者輸入部</p>  
        <p type="p">19B:穿戴式裝置</p>  
        <p type="p">20:外部裝置</p>  
        <p type="p">22:安全帽</p>  
        <p type="p">23:帶子</p>  
        <p type="p">24:安全帽主體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1279" publication-number="202620214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包覆在奈米結構金屬焦磷酸鹽粒子中的陰極活性材料及其在鈉離子電池中的應用</chinese-title>  
        <english-title>CATHODE ACTIVE MATERIAL ENCAPSULATED IN NANOSTRUCTURED METAL PYROPHOSPHATE PARTICLES, AND USE THEREOF IN SODIUM ION BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260212B">C23C4/067</main-classification>  
        <further-classification edition="201601120260212B">C23C4/129</further-classification>  
        <further-classification edition="200601120260212B">C09C1/00</further-classification>  
        <further-classification edition="200601120260212B">H01M4/40</further-classification>  
        <further-classification edition="200601120260212B">C01B25/42</further-classification>  
        <further-classification edition="201001120260212B">H01M10/0561</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高田令</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬朝暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZHAOHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯文瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, WENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪思懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於鈉離子二次電池之經塗覆陰極活性材料，該經塗覆陰極活性材料包含包覆在藉由火焰噴霧熱解產生之奈米結構焦磷酸鋯粒子之塗覆層內的用於鈉離子二次電池之陰極活性材料之粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coated cathode active material for a sodium ion secondary battery, the coated cathode active material comprising particles of a cathode active material for a sodium ion secondary battery encapsulated within a coating layer of nanostructured zirconium pyrophosphate particles produced by flame spray pyrolysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:操作</p>  
        <p type="p">105:操作</p>  
        <p type="p">107:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1280" publication-number="202619718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環取代的嘧啶並吡喃化合物及其用途</chinese-title>  
        <english-title>HETEROCYCLIC SUBSTITUTED PYRIMIDOPYRAN COMPOUNDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/498</main-classification>  
        <further-classification edition="200601120260202B">A61K31/519</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商德昇濟醫藥（無錫）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D3 BIO (WUXI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　之鍵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆克　小羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOOK, JR. ROBERT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐵男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TIENAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱久香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JIUXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>解海波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, HAIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一類雜環取代的嘧啶並吡喃化合物，諸如式(I)化合物： &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="326px" file="ed10700.JPG" alt="ed10700.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;或者其立體異構體或其藥學上可接受的鹽，及其應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a class of heterocyclic substituted pyrimidopyran compounds, such as a compound of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="310px" file="ed10701.JPG" alt="ed10701.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a stereoisomer thereof, or a pharmaceutically acceptable salt thereof, and applications thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1281" publication-number="202620074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133309</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔震橡膠疊層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C08F136/06</main-classification>  
        <further-classification edition="200601120251001B">C08F136/08</further-classification>  
        <further-classification edition="200601120251001B">C08K3/26</further-classification>  
        <further-classification edition="200601120251001B">B32B15/06</further-classification>  
        <further-classification edition="200601120251001B">F16F15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友理工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO RIKO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲市真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAICHI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶田悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村谷圭市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATANI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本成弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, NARUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種衰減特性優異的隔震橡膠疊層體。 &lt;br/&gt;一種隔震橡膠疊層體，其具有由含有下述(A)成分及(B)成分之隔震橡膠疊層體用橡膠組成物的硫化體構成之橡膠層，以倍率15萬倍拍攝上述橡膠層之掃描穿透電子顯微鏡影像的任意1μm×1μm見方的區域中含有之3個以上的碳酸鈣粒子連接之凝聚體的個數為3~15個的範圍。 &lt;br/&gt;(A)異戊二烯橡膠及丁二烯橡膠的至少一者 &lt;br/&gt;(B)碳酸鈣</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:隔震橡膠疊層體</p>  
        <p type="p">12:橡膠塊</p>  
        <p type="p">14:金屬板</p>  
        <p type="p">16:橡膠層</p>  
        <p type="p">18:上部安裝板</p>  
        <p type="p">20:下部安裝板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1282" publication-number="202620316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>制震阻尼器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250911B">F16F15/04</main-classification>  
        <further-classification edition="200601120250911B">C08L53/02</further-classification>  
        <further-classification edition="200601120250911B">C08K5/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友理工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO RIKO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶田悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲市真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAICHI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村谷圭市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATANI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種衰減特性優異的制震阻尼器。 &lt;br/&gt;一種制震阻尼器，其以由含有下述(A)~(C)成分之橡膠組成物構成之黏彈性體作為構成構件，以倍率15萬倍拍攝上述黏彈性體之掃描穿透電子顯微鏡影像的任意的1μm×1μm見方的區域中含有之3個以上的碳酸鈣粒子連接而成之凝聚體的個數為3~15個的範圍。 &lt;br/&gt;(A)苯乙烯-異戊二烯-苯乙烯共聚物及苯乙烯-丁二烯-苯乙烯共聚物的至少一者 &lt;br/&gt;(B)選自由乙烯-丙烯-二烯三元共聚物、乙烯-丁烯-二烯三元共聚物、及丁二烯橡膠構成之群組中之一種以上 &lt;br/&gt;(C)碳酸鈣</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:制震阻尼器</p>  
        <p type="p">2:黏彈性體</p>  
        <p type="p">4,5:金屬板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1283" publication-number="202619892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔震橡膠疊層體用橡膠組成物及隔震橡膠疊層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250908B">B32B25/04</main-classification>  
        <further-classification edition="200601120250908B">B32B25/16</further-classification>  
        <further-classification edition="201901120250908B">B32B7/022</further-classification>  
        <further-classification edition="200601120250908B">C08K5/10</further-classification>  
        <further-classification edition="200601120250908B">C08K3/04</further-classification>  
        <further-classification edition="200601120250908B">F16F15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友理工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO RIKO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲市真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAICHI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶田悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村谷圭市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATANI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬化現象的抑制效果優異的隔震橡膠疊層體用橡膠組成物、及隔震橡膠疊層體。 &lt;br/&gt;一種隔震橡膠疊層體用橡膠組成物，其使用於隔震橡膠疊層體的橡膠層，含有下述(A)~(C)成分，(B)成分相對於100質量份的(A)成分之含量為10~30質量份。 &lt;br/&gt;(A)異戊二烯橡膠及丁二烯橡膠的至少一者 &lt;br/&gt;(B)分子量300~900的塑化劑 &lt;br/&gt;(C)DBP吸油量為100ml/100g以上、碘吸附量為150mg/g以上、且氮吸附比表面積為140m&lt;sup&gt;2&lt;/sup&gt;/g以上的碳黑</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:隔震橡膠疊層體</p>  
        <p type="p">12:橡膠塊</p>  
        <p type="p">14:金屬板</p>  
        <p type="p">16:橡膠層</p>  
        <p type="p">18:上部安裝板</p>  
        <p type="p">20:下部安裝板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1284" publication-number="202619891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>制震阻尼器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">B32B15/08</main-classification>  
        <further-classification edition="200601120251001B">B32B25/08</further-classification>  
        <further-classification edition="200601120251001B">B32B25/14</further-classification>  
        <further-classification edition="200601120251001B">B32B27/06</further-classification>  
        <further-classification edition="200601120251001B">B32B27/18</further-classification>  
        <further-classification edition="200601120251001B">B32B7/12</further-classification>  
        <further-classification edition="200601120251001B">C09J201/00</further-classification>  
        <further-classification edition="200601120251001B">C09J11/06</further-classification>  
        <further-classification edition="200601120251001B">E04B1/98</further-classification>  
        <further-classification edition="200601120251001B">F16F9/30</further-classification>  
        <further-classification edition="200601120251001B">F16F15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友理工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO RIKO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶田悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJITA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲市真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAICHI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村谷圭市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATANI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠抑制衰減特性的降低之制震阻尼器。 &lt;br/&gt;一種制震阻尼器，其含有按順序疊層金屬層、由含有交聯劑之黏接劑構成之黏接劑層、及由含有下述(A)成分及(B)成分之橡膠組成物構成之未交聯黏彈性體層而成之層結構，具有藉由上述交聯劑而形成之彈性模數超過1.2MPa的硬化部，上述交聯劑係從上述黏接劑層轉移至上述未交聯黏彈性體層內，上述硬化部的厚度為75μm以下的範圍。 &lt;br/&gt;(A)苯乙烯-異戊二烯-苯乙烯共聚物及苯乙烯-丁二烯-苯乙烯共聚物的至少一者 &lt;br/&gt;(B)選自由乙烯-丙烯-二烯三元共聚物、乙烯-丁烯-二烯三元共聚物、及丁二烯橡膠構成之群組中之一種以上</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:制震阻尼器</p>  
        <p type="p">2:黏彈性體</p>  
        <p type="p">4,5:金屬板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1285" publication-number="202621166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法和通信裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND COMMUNICATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/04</main-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊特拉卡　羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITRAKAR, ROJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種方法。所述方法包括：向第一站點發送第一幀，所述第一幀用於指示所述第一站點發送激勵PPDU或控制PPDU中的至少一個；回應於所述第一幀，從所述第一站點接收第一回應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is provided. The method includes: transmitting a first frame to a first station, and the first frame is for instructing the first station to transmit at least one of an energizer PPDU or a control PPDU; and receiving a first response from the first station responsive to the first frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201、202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1286" publication-number="202621150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>候選單元頻道狀態資訊獲取</chinese-title>  
        <english-title>CHANNEL STATE INFORMATION ACQUISITION OF CANDIDATE CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W36/30</main-classification>  
        <further-classification edition="200901120260202B">H04W36/00</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification>  
        <further-classification edition="200901120260202B">H04W24/10</further-classification>  
        <further-classification edition="200601120260202B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里內爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARINIER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰耶布　歐梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEYEB, OUMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑞達　馬提諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDA, MARTINO M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了用於執行候選胞元頻道狀態資訊獲取的系統、方法和工具。一種裝置（例如，WTRU）可以包括一個配置為執行一個或多個動作的處理器。本裝置可以接收配置資訊。此配置資訊可以與層1/2觸發行動性 (LTM) 頻道狀態資訊 (CSI) 資源集合相關聯。基於此配置訊息，該裝置可以對來自 LTM CSI 資源集合的 LTM CSI 資源執行測量。該裝置可以確定將 LTM CSI 資源包含在選擇的資源集合中。將 LTM CSI 資源包含在選擇的資源集合中的確定可以基於滿足的條件。此條件可以與 LTM CSI 資源上的測量相關聯。該裝置可以傳輸 LTM 報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and instrumentalities are described herein for performing channel state information acquisition of candidate cells. A device (e.g., a WTRU) may include a processor configured to perform one or more actions. The device may receive configuration information. The configuration information may be associated with a layer 1/2 triggered mobility (LTM) channel state information (CSI) resource set. Based on the configuration information, the device may perform a measurement on an LTM CSI resource from the LTM CSI resource set. The device may determine to include the LTM CSI resource in a selected resource set. The determination to include the LTM CSI resource in the selected resource set may be based on a condition being satisfied. The condition may be associated with the measurement on the LTM CSI resource. The device may transmit an LTM report.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CSI:頻道狀態資訊</p>  
        <p type="p">DCI:下鏈控制資訊</p>  
        <p type="p">LTM:層1/2觸發行動性</p>  
        <p type="p">RAN:無線電存取網路</p>  
        <p type="p">RRC:無線電資源控制</p>  
        <p type="p">WTRU:無線發射/接收單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1287" publication-number="202621151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於人工智慧之智慧漫遊</chinese-title>  
        <english-title>ARTIFICIAL INTELLIGENCE-BASED SMART ROAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W36/30</main-classification>  
        <further-classification edition="200901120251201B">H04W36/26</further-classification>  
        <further-classification edition="200901120251201B">H04W8/20</further-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈札利卡　吉恩藍詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZARIKA, GYANRANJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塔洽亞　圖許寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATTACHARYYA, TUSHNIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛加特　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOGAT, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　高朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, GAURANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納杜　法姆西克里希納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIDU, VAMSI KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆薩薩米　克里希納庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTHUSAMY, KRISHNAKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里帕蒂　奧姆普拉卡什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPATHI, OM PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝卡爾　尤嘉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEKAR, YOGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡塔　史利尼威斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAR, SRINIVAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷馬查德利　山迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOMCHAUDHURI, SANDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於基於人工智慧之智慧漫遊的方法、組件、裝置、及系統。一些態樣更具體地係關於基於人工智慧驅動之漫遊。在一些實例中，STA可將與STA之目前環境相關的一或多個參數輸入至機器學習模型。在一些實例中，機器學習模型可產生一輸出，該輸出至少包含待由STA進行關聯的目標AP。在一些實例中，機器學習模型的輸出可至少包括目標AP、候選AP清單、與候選AP清單相關聯的對應RSSI值清單，或其任何組合。在此類實例中，候選AP清單可包括位於STA的環境（諸如操作區）內的一組AP。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices and systems for artificial intelligence-based smart roaming. Some aspects more specifically relate to artificial intelligence-driven based roaming. In some examples, the STA may input one or more parameters related to a current environment of the STA into the machine learning model. In some examples, the machine learning model may generate an output comprising at least a target AP for the STA to associate with. In some examples, the output of the machine learning model may include at least a target AP, a list of candidate APs a corresponding list of RSSI values associated with the list of candidate APs, or any combination thereof. In such examples, the list of candidate APs may include a set of APs located within an environment (such as an operating area) of the STA.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方塊圖</p>  
        <p type="p">402:機器學習(ML)模型</p>  
        <p type="p">404:無線站台(STA)環境</p>  
        <p type="p">406:流量型樣；流量設定檔</p>  
        <p type="p">408:服務等級協議(SLA)</p>  
        <p type="p">410:方塊</p>  
        <p type="p">412:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1288" publication-number="202621360"> 
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      <tif no="1" file="202621360.zip"/>
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      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/60</main-classification>  
        <further-classification edition="202601120260223B">H10P14/40</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村肇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山脇佳寿子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAWAKI, KAZUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可靠性高的半導體裝置。半導體裝置包括第一至第三導電層、半導體層、第一至第五絕緣層。第三導電層、第二絕緣層、第三絕緣層及第五絕緣層都具有到達第二導電層的開口部。半導體層具有與第二導電層接觸的區域、與第三導電層接觸的區域、與開口部的第二絕緣層的側面接觸的區域、與開口部的第三絕緣層的側面接觸的區域以及與開口部的第五絕緣層的側面接觸的區域。第一導電層的至少一部分在開口部的內部隔著第一絕緣層與半導體層相對。第三絕緣層的底面與第二絕緣層接觸。第三絕緣層的其他側面與第四絕緣層接觸。第三絕緣層的頂面與第五絕緣層接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:電晶體</p>  
        <p type="p">101:絕緣層</p>  
        <p type="p">102:導電層</p>  
        <p type="p">102_1:導電層</p>  
        <p type="p">102_2:導電層</p>  
        <p type="p">102_3:導電層</p>  
        <p type="p">103:絕緣層</p>  
        <p type="p">104:絕緣層</p>  
        <p type="p">105:絕緣層</p>  
        <p type="p">106:絕緣層</p>  
        <p type="p">107:絕緣層</p>  
        <p type="p">108:導電層</p>  
        <p type="p">108_1,108_2:導電層</p>  
        <p type="p">109:半導體層</p>  
        <p type="p">110:絕緣層</p>  
        <p type="p">111:導電層</p>  
        <p type="p">111_1,111_2:導電層</p>  
        <p type="p">112:絕緣層</p>  
        <p type="p">113:絕緣層</p>  
        <p type="p">190:開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1289" publication-number="202620708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成式人工智慧模型中的經混合輸出生成</chinese-title>  
        <english-title>BLENDED OUTPUT GENERATION IN GENERATIVE ARTIFICIAL INTELLIGENCE MODELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260102B">G06N20/00</main-classification>  
        <further-classification edition="202301120260102B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伊　安尼凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROY, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博爾斯　舒班卡爾　曼格什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORSE, SHUBHANKAR MANGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡丹比　莎蕾雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADAMBI, SHREYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈亞克　安琪塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAYAK, ANKITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加雷帕利　里希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARREPALLI, RISHEEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樸孝真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯　德巴斯密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAS, DEBASMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈亞特　穆納瓦爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAT, MUNAWAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波里克利　法提赫　穆拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORIKLI, FATIH MURAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬哈姜　史薇塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHAJAN, SHWETA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於使用一生成式人工智慧模型來產生具有多個所指定的屬性的內容之技術及設備。一種實例方法大致上包括接收一請求，以產生一機器學習模型的一輸出，該請求指定該機器學習模型的該輸出的複數個屬性。經由該機器學習模型的複數個調適器來產生一中間輸出集。該複數個調適器中的各個各別調適器可與所指定的該複數個屬性中的一各別屬性相關聯，且包括與該各別調適器相關聯的一低秩維度中的一各別遮罩。將該中間輸出集合併至該機器學習模型的該複數個調適器的一經組合輸出中，且基於該複數個調適器的該經組合輸出來產生該機器學習模型的該輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques and apparatus for generating content with multiple specified attributes using a generative artificial intelligence model are described. An example method generally includes receiving a request to generate an output of a machine learning model, the request specifying a plurality of attributes of the output of the machine learning model. A set of intermediate outputs is generated via a plurality of adapters of the machine learning model. Each respective adapter of the plurality of adapters may be associated with a respective attribute of the specified plurality of attributes and include a respective mask in a low-rank dimension associated with the respective adapter. The set of intermediate outputs is merged into a combined output of the plurality of adapters of the machine learning model, and the output of the machine learning model is generated based on the combined output of the plurality of adapters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:實例操作</p>  
        <p type="p">710,720,730,740:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1290" publication-number="202620105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透濕膜的製造方法及層疊體的製造方法、以及透濕膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08J5/18</main-classification>  
        <further-classification edition="200601120260203B">C08G18/40</further-classification>  
        <further-classification edition="200601120260203B">D06N3/14</further-classification>  
        <further-classification edition="200601120260203B">B32B27/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千千和宏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIJIWA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金川善典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAGAWA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在不使用溶媒的情況下製造厚度薄且塗膜缺陷的產生得到抑制的具有高透濕性的透濕膜的方法等。另外，本發明提供層疊體的製造方法及透濕膜。一種透濕膜的製造方法，其具有以下的步驟X1和步驟X2，上述步驟X1為：將濕氣固化型聚氨酯熱熔樹脂組成物加熱熔融，在算術平均高度Sa為0.90μm以上、以及/或者光澤度為25.0以下的脫模性基材的表面連續塗布而形成厚度小於30μm的塗膜，所述步驟X2為：使上述塗膜至少濕氣固化，形成透過度為4000 g/m&lt;sup&gt;2&lt;/sup&gt;/24h以上的透濕膜，並且上述濕氣固化型聚氨酯熱熔樹脂組成物含有使包含聚乙二醇和/或聚氧乙烯聚氧丙烯二醇(a1)的多元醇(A)與聚異氰酸酯(B)進行反應而得的氨基甲酸酯預聚物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1291" publication-number="202621457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測定裝置及測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/00</main-classification>  
        <further-classification edition="200601120260223B">G01B11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯野克宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINO, KATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種能夠良好地測定包含接合基板的黏著層之高度的技術。 &lt;br/&gt;本發明之測定裝置，用以測定接合基板，此接合基板利用黏著劑接合第一基板的接合面與第二基板的接合面，藉以在上述第一基板與上述第二基板之間具有黏著層。上述測定裝置具備：紅外線感測器，從上述接合基板的上述第二基板側照射紅外光，且接收透過上述黏著層而在前述第一基板的接合面反射之上述紅外光的反射光；以及資訊處理部，接收上述紅外線感測器的檢測資訊，而基於該檢測資訊取得從上述第二基板起至包含上述黏著層之上述第一基板的接合面為止之厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8:測定裝置</p>  
        <p type="p">80:紅外線感測器</p>  
        <p type="p">AT:總厚度</p>  
        <p type="p">BS:黏著層G與處理基板W1之界面</p>  
        <p type="p">G:黏著層</p>  
        <p type="p">T:接合基板</p>  
        <p type="p">LT:下部厚度</p>  
        <p type="p">ML:金屬層</p>  
        <p type="p">Tw1:厚度</p>  
        <p type="p">W1:第一基板</p>  
        <p type="p">W1j:接合面</p>  
        <p type="p">W1n:非接合面</p>  
        <p type="p">W2:第二基板</p>  
        <p type="p">W2j:接合面</p>  
        <p type="p">W2n:非接合面</p>  
        <p type="p">Wh:凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1292" publication-number="202620888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排泄管理系統及程式</chinese-title>  
        <english-title>EXCRETION CONTROL SYSTEM AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260131B">G16H10/00</main-classification>  
        <further-classification edition="201801120260131B">G16H20/00</further-classification>  
        <further-classification edition="201801120260131B">G16H10/60</further-classification>  
        <further-classification edition="201801120260131B">G16H50/30</further-classification>  
        <further-classification edition="202101120260131B">A61B5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下住空間股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC HOUSING SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻野弘之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGINO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河合雅弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越智和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">排泄管理系統1包括：排泄資訊取得部22，取得管理對象者的排尿發生資訊及排便發生資訊；及顯示資訊產生部23，基於在該排泄資訊取得部所取得的該排尿發生資訊及該排便發生資訊，產生使複數時段之每個時段中之排尿發生位準及排便發生位準顯示於顯示部34之發生位準資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The excretion control system 1 includes an excretion information obtaining portion 22 which obtains urination occurrence information and defecation occurrence information of a control target and a display information producing portion 23 which produces occurrence level information to display a urination occurrence level and a defecation occurrence level per a plurality of time ranges on a display portion 34 based on the urination occurrence information and the defecation occurrence information which are obtained in the excretion information obtaining portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:排泄管理系統</p>  
        <p type="p">2:馬桶裝置</p>  
        <p type="p">7:使用檢測部</p>  
        <p type="p">10:排泄檢測部</p>  
        <p type="p">11:照明部</p>  
        <p type="p">12:拍攝部</p>  
        <p type="p">15:控制單元</p>  
        <p type="p">16:控制部</p>  
        <p type="p">17:記憶部</p>  
        <p type="p">18:通訊部</p>  
        <p type="p">20:伺服器</p>  
        <p type="p">21:控制部</p>  
        <p type="p">22:排泄資訊取得部</p>  
        <p type="p">23:顯示資訊產生部</p>  
        <p type="p">24:誘導需要者登錄部</p>  
        <p type="p">25:記憶部</p>  
        <p type="p">26:通訊部</p>  
        <p type="p">30:照護者終端設備</p>  
        <p type="p">31:控制部</p>  
        <p type="p">32:記憶部</p>  
        <p type="p">33:通訊部</p>  
        <p type="p">34:顯示操作部(顯示部)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1293" publication-number="202620220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、半導體裝置之製造方法、基板處理裝置及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/06</main-classification>  
        <further-classification edition="200601120260223B">C23C16/44</further-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/10</further-classification>  
        <further-classification edition="200601120260223B">G05B19/4155</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加我友紀直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGA, YUKINAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗林幸永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIBAYASHI, KOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伴苗勇樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANNAE, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供可有效率地進行選擇性成膜之技術。 &lt;br/&gt;本發明之解決手段係進行：(a)進行：(a1)對具有屬於第1物質之表面的第1表面、與屬於不同於上述第1物質之第2物質之表面的第2表面的基板，供給含有金屬元素之第1氣體的步驟；與(a2)對上述基板，供給含有上述金屬元素之第2氣體的步驟；而於上述基板上之至少一部分形成含有上述金屬元素之含金屬物質的步驟；與(b)對上述基板，供給反應氣體的步驟；而較上述第2表面上更優先地對上述第1表面上，形成含有上述金屬元素之膜的成膜步驟；(a)包含將(a1)及(a2)之至少一部分同時進行的期間Tc；上述第1氣體係依第1速率對上述含金屬物質進行蝕刻；上述第2氣體係依較上述第1速率高之第2速率對上述含金屬物質進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1294" publication-number="202619933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車構件</chinese-title>  
        <english-title>HUMAN-POWERED VEHICLE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251128B">B62J45/00</main-classification>  
        <further-classification edition="200601120251128B">B62J1/08</further-classification>  
        <further-classification edition="200901120251128B">H04W88/02</further-classification>  
        <further-classification edition="201801120251128B">H04W76/15</further-classification>  
        <further-classification edition="200901120251128B">H04W52/02</further-classification>  
        <further-classification edition="201801120251128B">H04W4/40</further-classification>  
        <further-classification edition="201501120251128B">H04B1/40</further-classification>  
        <further-classification edition="200601120251128B">G08C17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千谷尚輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIYA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田浩史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種人力驅動車構件BC1，其包括無線通訊器電路WC1。無線通訊器電路WC1設置成在人力驅動車構件BC1的第一狀態ST11下，以第一週期C1將至少兩個第一信號SG1無線傳輸到附加人力驅動車構件BC2。無線通訊器電路WC1設置成在該人力驅動車構件BC1的第二狀態ST12下，以第二週期C2將至少兩個第二信號SG2無線傳輸到附加人力驅動車構件BC2。該第二週期C2不同於該第一週期C1。該第二狀態ST12不同於該第一狀態ST11。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A human-powered vehicle component BC1 comprises wireless communicator circuitry WC1. The wireless communicator circuitry WC1 is configured to wirelessly transmit at least two first signals SG1 to an additional human-powered vehicle component BC2 at a first cycle C1 in a first state ST11 of the human-powered vehicle component BC1. The wireless communicator circuitry WC1 is configured to wirelessly transmit at least two second signals SG2 to the additional human-powered vehicle component BC2 at a second cycle C2 in a second state ST12 of the human-powered vehicle component BC1. The second cycle C2 is different from the first cycle C1. The second state ST12 is different from the first state ST11.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BC1:人力驅動車構件</p>  
        <p type="p">BC13:使用者介面電路</p>  
        <p type="p">BC2:人力驅動車構件</p>  
        <p type="p">C:週期</p>  
        <p type="p">C1:第一週期</p>  
        <p type="p">CS2:(第二)掃描週期</p>  
        <p type="p">SG:信號</p>  
        <p type="p">SG1:第一信號</p>  
        <p type="p">SG5:確認信號</p>  
        <p type="p">SS1:感測器</p>  
        <p type="p">ST11:第一狀態</p>  
        <p type="p">ST12:第二狀態</p>  
        <p type="p">ST13:第三狀態</p>  
        <p type="p">ST14:第四狀態</p>  
        <p type="p">ST22:第二掃描狀態</p>  
        <p type="p">ST23:第三掃描狀態</p>  
        <p type="p">TG1:第一信號產生持續時間</p>  
        <p type="p">TL1:第一剩餘電量臨界值</p>  
        <p type="p">TL2:第二剩餘電量臨界值</p>  
        <p type="p">TL3:第三剩餘電量臨界值</p>  
        <p type="p">TM1:第一溫度臨界值</p>  
        <p type="p">TM2:第二溫度臨界值</p>  
        <p type="p">TM3:第三溫度臨界值</p>  
        <p type="p">TN2:第二非掃描持續時間</p>  
        <p type="p">TS2:第二掃描持續時間</p>  
        <p type="p">TT:信號傳輸持續時間</p>  
        <p type="p">TT1:第一信號傳輸持續時間</p>  
        <p type="p">U1:使用者輸入</p>  
        <p type="p">U2:使用者輸入</p>  
        <p type="p">WC1:無線通訊器電路/無線通訊器/無線電路</p>  
        <p type="p">WC2:附加無線通訊器電路/無線通訊器/無線電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1295" publication-number="202620638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基於可擴縮區塊的永久安全故障容許度之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR SCALABLE BLOCK-BASED PERMANENT SAFETY FAULT TOLERANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G06F11/07</main-classification>  
        <further-classification edition="202601120260223B">G06F11/14</further-classification>  
        <further-classification edition="200601120260223B">G06F11/22</further-classification>  
        <further-classification edition="200601120260223B">G06F9/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜加爾　阿米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUGGAL, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>因賈拉普　薩蒂什庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INJARAPU, SATEESHKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈斯瓦爾　尼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAISWAL, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括偵測一功能安全故障及判定該功能安全故障係一暫態故障或一永久故障。該方法進一步包括回應於該功能安全故障經判定係一永久故障而識別發生該功能安全故障之一處理單元之一可擴縮區塊。該方法可選地包括使該可擴縮區塊電力崩潰。該方法亦包括通知一排程器以防止該排程器將未來之工作負載排程至該可擴縮區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes detecting a functional safety fault and determining whether the functional safety fault is a transient fault or a permanent fault. The method further includes identifying a scalable block of a processing unit from which the functional safety fault occurred in response to the functional safety fault being determined to be a permanent fault. The method optionally includes power collapsing the scalable block. The method also includes notifying a scheduler to prevent the scheduler from scheduling future workloads to the scalable block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:基於可擴縮區塊的處理器；處理器</p>  
        <p type="p">802:功能工作負載排程器</p>  
        <p type="p">804a:第一切片；切片</p>  
        <p type="p">804b:第二切片；切片</p>  
        <p type="p">804c:第三切片</p>  
        <p type="p">806a:第一記憶體</p>  
        <p type="p">806b:第三記憶體</p>  
        <p type="p">806c:第五記憶體</p>  
        <p type="p">808a:第二記憶體</p>  
        <p type="p">808b:第四記憶體</p>  
        <p type="p">808c:第六記憶體</p>  
        <p type="p">810:ECC故障記錄器</p>  
        <p type="p">812:故障分類組件</p>  
        <p type="p">814:切片級電力控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1296" publication-number="202620228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釕膜的成膜方法及釕膜的成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/44</main-classification>  
        <further-classification edition="200601120260223B">C23C16/50</further-classification>  
        <further-classification edition="200601120260223B">C23C16/46</further-classification>  
        <further-classification edition="200601120260223B">C23C16/06</further-classification>  
        <further-classification edition="200601120260223B">B08B3/02</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="200601120260223B">C07F15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村朋陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石坂忠大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將基板載置於載置台以使Ru膜成膜時，去除配置在載置台的周緣部的環狀構件上形成的Ru膜。 &lt;br/&gt;在具備配置於處理容器內且供載置成膜對象的基板的載置台與沿著載置台的周緣部配置的環狀構件之基板處理裝置中實施下述工序；工序(A)，係將成膜對象的基板載置於載置台，並使環狀構件成為已配置於該載置台的周緣部的狀態；工序(B)，係向處理容器內供應釕的原料氣體，以使Ru膜成膜於基板上；以及工序(C)，係在環狀構件已配置於成膜有Ru膜的基板已朝處理容器的外部被搬出後的載置台的周緣部的狀態下，向處理容器內供應清潔氣體以去除環狀構件上形成的Ru膜；反覆會依序執行該工序(A)~該工序(C)的循環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1297" publication-number="202620709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成式人工智慧模型中的經混合輸出生成</chinese-title>  
        <english-title>BLENDED OUTPUT GENERATION IN GENERATIVE ARTIFICIAL INTELLIGENCE MODELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260102B">G06N20/00</main-classification>  
        <further-classification edition="202301120260102B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伊　阿尼克特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROY, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博爾斯　舒布漢卡爾曼格甚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORSE, SHUBHANKAR MANGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡丹比　什雷亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADAMBI, SHREYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納亞克　安基塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAYAK, ANKITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加瑞帕立　里希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARREPALLI, RISHEEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴孝眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯　德巴斯米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAS, DEBASMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈亞特　莫納瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAT, MUNAWAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波里科利　費提穆瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORIKLI, FATIH MURAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬哈詹　什韋塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHAJAN, SHWETA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於使用一生成式人工智慧模型來產生具有多個所指定的屬性的內容之技術及設備。一種實例方法大致上包括接收一請求，以產生一機器學習模型的一輸出，該請求指定該機器學習模型的該輸出的複數個屬性。經由該機器學習模型的複數個調適器來產生一組中間輸出。該複數個調適器中的各各別調適器可與所指定的該複數個屬性中的一各別屬性相關聯，且包括與該各別調適器相關聯的一低秩維度中的一各別遮罩。將該組中間輸出合併至該機器學習模型的該複數個調適器的一經組合輸出中，且基於該複數個調適器的該經組合輸出來產生該機器學習模型的該輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques and apparatus for generating content with multiple specified attributes using a generative artificial intelligence model are described. An example method generally includes receiving a request to generate an output of a machine learning model, the request specifying a plurality of attributes of the output of the machine learning model. A set of intermediate outputs is generated via a plurality of adapters of the machine learning model. Each respective adapter of the plurality of adapters may be associated with a respective attribute of the specified plurality of attributes and include a respective mask in a low-rank dimension associated with the respective adapter. The set of intermediate outputs is merged into a combined output of the plurality of adapters of the machine learning model, and the output of the machine learning model is generated based on the combined output of the plurality of adapters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:操作</p>  
        <p type="p">510,520,530,540:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1298" publication-number="202619978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260121B">C01G45/1257</main-classification>  
        <further-classification edition="200601120260121B">C01B13/22</further-classification>  
        <further-classification edition="201001120260121B">H01M10/0525</further-classification>  
        <further-classification edition="201001120260121B">H01M4/50</further-classification>  
        <further-classification edition="200601120260121B">H01M4/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下西裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMONISHI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田周平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益尾雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">二次電池係具備有正極層(14)、負極層(12)以及在正極層與負極層之間傳導鋰離子的電解質層(15)。正極層中設有組成中含有Mn的正極活性物質(14a)與具備鋰離子傳導性的氧化物系離子傳導體(14b)。電解質層係含有含氟原子之含氟鋰鹽，以及可溶解前述含氟鋰鹽的溶媒。離子傳導體係可促進鋰離子自含氟鋰鹽解離的介電體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:二次電池</p>  
        <p type="p">11:負極集電體</p>  
        <p type="p">12:負極層</p>  
        <p type="p">13:正極集電體</p>  
        <p type="p">14:正極層</p>  
        <p type="p">14a:正極活性物質</p>  
        <p type="p">14b:氧化物系離子傳導體</p>  
        <p type="p">15:電解質層</p>  
        <p type="p">15a:電解液</p>  
        <p type="p">15b:絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1299" publication-number="202620814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G08B29/02</main-classification>  
        <further-classification edition="200601120251001B">G08B25/00</further-classification>  
        <further-classification edition="200601120251001B">G08B1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEDA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGAKI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在搭載有類比感測器的感測器單元彼此被串聯連接而成的感測器系統中，運用1點的訊號端子的輸出來判別感測器系統全體的狀態。 &lt;br/&gt;　　本發明之感測器系統構成為，在每一感測器具備由前述感測器與單位電子電路的成對而形成的感測器單元，各前述單位電子電路所具備的開關電路被串聯連接，各前述單位電子電路構成為當來自全部的前述感測器的輸出為正常時，全部的前述開關電路串聯導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,101:感測器單元</p>  
        <p type="p">102,103:線路</p>  
        <p type="p">110,115:感測器</p>  
        <p type="p">111,116:單位電子電路</p>  
        <p type="p">112,117:開關</p>  
        <p type="p">113,118:開關切換電路</p>  
        <p type="p">114,119:節點</p>  
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:固定電壓</p>  
        <p type="p">V&lt;sub&gt;S&lt;/sub&gt;:感測器的輸出電壓</p>  
        <p type="p">V&lt;sub&gt;SW&lt;/sub&gt;:開關切換電路的輸出</p>  
        <p type="p">V&lt;sub&gt;TH&lt;/sub&gt;:閾值電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1300" publication-number="202620515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133635</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧眼鏡</chinese-title>  
        <english-title>SMART GLASSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G02C11/00</main-classification>  
        <further-classification edition="202101120260206B">H04M1/72</further-classification>  
        <further-classification edition="200601120260206B">G10L15/16</further-classification>  
        <further-classification edition="202201120260206B">G06V20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美泰萬有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAONE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種智慧眼鏡，包含通訊裝置、語音助理配置於智慧眼鏡；其中智慧眼鏡透過通訊裝置可與AI運算裝置無線連接，以利連接大語言模型，語音助理透過通訊裝置執行網路預約、網路購物、電話應答之一或以上任意組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides smart glasses comprising a communication device and a voice assistant disposed on the smart glasses. The smart glasses can wirelessly connect to an AI computing device via the communication device to facilitate connection to a large language model. The voice assistant can execute one or any combination of online reservations, online shopping, and phone answering via the communication device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:使用者</p>  
        <p type="p">300:智慧眼鏡</p>  
        <p type="p">310:處理器</p>  
        <p type="p">320:記憶體</p>  
        <p type="p">340:顯示器</p>  
        <p type="p">405:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1301" publication-number="202620416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置以及光學裝置的控制方法</chinese-title>  
        <english-title>OPTICAL APPARATUS AND METHOD FOR CONTROLLING OPTICAL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01N21/88</main-classification>  
        <further-classification edition="200601120260211B">G01N21/01</further-classification>  
        <further-classification edition="200601120260211B">G01N21/17</further-classification>  
        <further-classification edition="200601120260211B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具備用以變更預定增益的增益變更部之光學裝置。提供一種光學裝置，係具備：第一檢測部，係檢測來自被來自光源的光照明的對象物之光，並將訊號與複數個位置建立關聯地輸出；第二檢測部，係檢測來自光源的光的一部分，並將訊號與複數個位置建立關聯地輸出；訊號修正部，係基於針對各個位置預先制定的預定增益修正第一檢測部中的訊號；以及增益變更部，係基於第二檢測部中的訊號變更預定增益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學裝置</p>  
        <p type="p">301:第一檢測部</p>  
        <p type="p">302:第二檢測部</p>  
        <p type="p">303:訊號修正部</p>  
        <p type="p">304:增益變更部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1302" publication-number="202620142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗布劑及塗膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C09D175/06</main-classification>  
        <further-classification edition="200601120260202B">C08G18/06</further-classification>  
        <further-classification edition="200601120260202B">C08G18/79</further-classification>  
        <further-classification edition="200601120260202B">C07C265/14</further-classification>  
        <further-classification edition="200601120260202B">C09D183/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三洋化成工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYO CHEMICAL INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沢田雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若月敦史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKATSUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之塗布劑（X）係含有以活性氫成分（A）及多異氰酸酯成分（B）作為構成原料之聚胺酯脲（polyurethane-urea）樹脂（U）及有機溶劑（S）而成，上述活性氫成分（A）係含有於具有2個末端之聚有機矽氧烷鏈之單末端鍵結有具有2個活性氫基之有機基的聚有機矽氧烷（a11）、於具有2個末端之聚有機矽氧烷鏈之兩末端分別鍵結有具有1個活性氫基之有機基的聚有機矽氧烷（a12）、具有2個羥基或胺基之聚醚（a2）、及高分子多元醇（a3）而成，上述多異氰酸酯成分（B）係選自由芳香族多異氰酸酯（b1）、脂肪族多異氰酸酯（b2）、脂環式多異氰酸酯（b3）、芳香脂肪族多異氰酸酯（b4）及該等多異氰酸酯之改質物（b5）所組成之群中之至少1種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1303" publication-number="202619898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圓筒形工件的周面處理裝置及周面處理方法</chinese-title>  
        <english-title>PERIPHERAL SURFACE PROCESSING APPARATUS OF THE CYLINDRICAL WORK AND PERIPHERAL SURFACE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">B41C1/05</main-classification>  
        <further-classification edition="200601120260204B">B23Q17/22</further-classification>  
        <further-classification edition="200601120260204B">B23Q15/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THINK LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>重田核</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGETA, KAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀內均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIUCHI, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種圓筒形工件的周面處理裝置及周面處理方法，其不依賴於工件精度或固定至旋轉軸的固定精度，能夠實現高精度的周面處理。 &lt;br/&gt;　　該圓筒形工件的周面處理裝置，包含：旋轉軸、周面處理設備、控制設備、周面位移感測器、及旋轉角度感測器，同步於前述旋轉角度感測器的訊號，藉由前述周面位移感測器測量所述圓筒形工件的轉一圈的位移量，從前述測量到的轉一圈的位移量，推定前述圓筒形工件固定至旋轉軸時的偏心量與偏心方向，從前述推定所得到的推定偏心量與推定偏心方向算出修正資料，基於前述修正資料對前述旋轉角度感測器的訊號進行修正，再藉由前述控制設備對前述周面處理設備進行控制之圓筒形工件的周面處理裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圓筒形工件的周面處理裝置</p>  
        <p type="p">12:旋轉軸</p>  
        <p type="p">14:周面處理設備</p>  
        <p type="p">16:控制設備</p>  
        <p type="p">18:周面位移感測器</p>  
        <p type="p">20:旋轉角度感測器</p>  
        <p type="p">22:訊號</p>  
        <p type="p">24:位移量</p>  
        <p type="p">26:推定偏心量</p>  
        <p type="p">28:推定偏心方向</p>  
        <p type="p">30:修正資料</p>  
        <p type="p">32:旋轉角度感測器的訊號</p>  
        <p type="p">34:控制</p>  
        <p type="p">W:圓筒形工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1304" publication-number="202621452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄層片移設裝置及薄層片之移設方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/76</main-classification>  
        <further-classification edition="200601120260223B">H01J37/20</further-classification>  
        <further-classification edition="200601120260223B">G01N1/28</further-classification>  
        <further-classification edition="200601120260223B">B25J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森下司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一宮豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKKU, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可從試料SAM穩定地取得薄層片LM，將薄層片LM搭載至樣品架(21)之際，抑制薄層片LM吸附於鑷子(16)。將已被製作於試料SAM上的薄層片LM藉由鑷子(16)而予以夾持，以使鑷子成為第1夾持狀態。在第1夾持狀態下，藉由令鑷子(16)做移動，以從試料SAM取得薄層片LM。其後，將薄層片LM固定於夾持調整構件AM1。藉由鬆開鑷子(16)，藉此以使鑷子(16)從薄層片LM脫離。令鑷子(16)做移動，將薄層片LM藉由鑷子(16)再次予以夾持，以使鑷子(16)成為第2夾持狀態。在第2夾持狀態下，令鑷子(16)做移動，以使薄層片LM從夾持調整構件AM1脫離。將薄層片LM搭載於樣品架(21)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1305" publication-number="202621260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有階梯式通量區域之薄膜電感器</chinese-title>  
        <english-title>THIN FILM INDUCTOR WITH STEPPED FLUX REGION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/20</main-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商能源萊堤斯科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERLATTICE TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於一種實施為一薄膜電感器之磁性裝置。該磁性裝置包括一第一磁性層、一第二磁性層及一導電線。該導電線經組態以攜載沿著一第一方向流動之一電流。該磁性裝置進一步包括在垂直於該第一方向之一橫截面上具有一變化厚度的一絕緣結構。該絕緣結構之該橫截面包括一中心區域及兩個通量區域。該中心區域將該導電線與該第一磁性層分隔。該兩個通量區域位於該中心區域之兩個相對側上且將該第二磁性層與該第一磁性層分隔。該兩個通量區域中之各者根據一通量間隔臨限值而定義，且具有小於一寄生寬度臨限值之一各別寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application is directed to a magnetic device implemented as a thin film inductor. The magnetic device includes a first magnetic layer, a second magnetic layer, and a conductive wire. The conductive wire is configured to carry an electric current flowing along a first direction. The magnetic device further includes an insulation structure having a varying thickness on a cross section that is perpendicular to the first direction. The cross section of the insulation structure includes a central region and two flux regions. The central region separates the conductive wire from the first magnetic layer. The two flux regions are located on two opposite sides of the central region and separate the second magnetic layer from the first magnetic layer. Each of the two flux regions is defined according to a flux separation threshold and has a respective width less than a parasitic width threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:磁性裝置</p>  
        <p type="p">802:薄膜電感器</p>  
        <p type="p">804:磁性薄膜層</p>  
        <p type="p">806:磁性薄膜層</p>  
        <p type="p">808:導電線</p>  
        <p type="p">810-1:第一絕緣層</p>  
        <p type="p">810-2:第二絕緣層</p>  
        <p type="p">810-3:第三絕緣層</p>  
        <p type="p">812:介電層</p>  
        <p type="p">814:基板</p>  
        <p type="p">816:底部表面</p>  
        <p type="p">818:中心區域</p>  
        <p type="p">820-1:通量區域</p>  
        <p type="p">820-2:通量區域</p>  
        <p type="p">822-1:第一階梯區域</p>  
        <p type="p">822-2:第二階梯區域</p>  
        <p type="p">824:磁通量</p>  
        <p type="p">826:階梯式間隔</p>  
        <p type="p">828:頂部表面</p>  
        <p type="p">840:側邊緣</p>  
        <p type="p">A-A':線</p>  
        <p type="p">h:階梯高度</p>  
        <p type="p">t:絕緣厚度</p>  
        <p type="p">t1:厚度</p>  
        <p type="p">t2:厚度</p>  
        <p type="p">t3:厚度</p>  
        <p type="p">t4:厚度</p>  
        <p type="p">W0:橫向尺寸</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">Wlayer1:橫向尺寸</p>  
        <p type="p">Wlayer2:橫向尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1306" publication-number="202620896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體組成數據之評估方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G16H50/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興友科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝坤昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之評估方法首先提供一生物電阻抗分析儀，生物電阻抗分析儀具有一數據資料庫，數據資料庫儲存有不同人種的母體數據，接著由一受測者於生物電阻抗分析儀輸入人種、性別及年齡等參數，之後由生物電阻抗分析儀根據受測者的身高體重及受測者所輸入的參數取得一測量數據，最後由生物電阻抗分析儀將受測者之測量數據和數據資料庫之母體數據進行分析比對，如此即可評估受測者在所屬人種當中的體組成狀況，藉以滿足不同人種的體組成評估需求及提升評估結果的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:生物電阻抗分析儀</p>  
        <p type="p">20:數據資料庫</p>  
        <p type="p">30:輸入單元</p>  
        <p type="p">40:數據建構單元</p>  
        <p type="p">50:數據分析單元</p>  
        <p type="p">60:動態更新單元</p>  
        <p type="p">70:輸出單元</p>  
        <p type="p">72:個人化體組成評估報告</p>  
        <p type="p">80:受測者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1307" publication-number="202620046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多價FZD4、WNT共同受體及VEGF結合分子及其用途</chinese-title>  
        <english-title>MULTIVALENT FZD4, WNT CO-RECEPTOR, AND VEGF BINDING MOLECULES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/22</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商眼科生物技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYEBIOTECH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半田　昌久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDA, MASAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛克特夫　亞歷山大　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOKTEV, ALEXANDER V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　邁克爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIES, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　殷杉　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, YIN SHAN ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史蒂芬斯　保羅　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEPHENS, PAUL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供活化Wnt/β-連環蛋白信號傳導路徑之多價抗體結合分子，其包括FZD4受體結合域、LRP5共同受體結合域，及VEGF結合域。本文亦闡述編碼該等分子之核酸及載體及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein are multivalent antibody binding molecules that activate a Wnt/β-catenin signaling pathway comprising a FZD4 receptor binding domain, an LRP5 co-receptor binding domain, and a VEGF binding domain. Also described herein are nucleic acids and vectors encoding said molecules and methods for their use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1308" publication-number="202621204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">H05K1/14</main-classification>  
        <further-classification edition="200601120260204B">B23K20/14</further-classification>  
        <further-classification edition="200601120260204B">B23K20/16</further-classification>  
        <further-classification edition="202001320260204B">G06F115/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯野克宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINO, KATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是在於提供一種能夠將第一基板及第二基板安定地貼合成同心圓狀的技術。 &lt;br/&gt;　　其解決手段，接合裝置接合第一基板與第二基板。 &lt;br/&gt;　　接合裝置具備： &lt;br/&gt;　　保持第一基板的第一保持部； &lt;br/&gt;　　保持第二基板的第二保持部； &lt;br/&gt;　　使第一保持部及第二保持部的一方對於另一方相對移動的移動機構；及 &lt;br/&gt;　　控制部。 &lt;br/&gt;　　第一保持部是將第一基板彎曲而保持。 &lt;br/&gt;　　第二保持部是將第二基板彎曲而保持。 &lt;br/&gt;　　控制部是控制移動機構，藉由相對移動使彎曲的第一基板的中心與彎曲的第二基板的中心一致後，使第一保持部與第二保持部相互靠近，接合第一基板與第二基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:接合模組</p>  
        <p type="p">21:處理容器</p>  
        <p type="p">22:第一保持部</p>  
        <p type="p">22s:第一保持面</p>  
        <p type="p">23:第二保持部</p>  
        <p type="p">23s:第二保持面</p>  
        <p type="p">24:基座構件</p>  
        <p type="p">25:加壓機構</p>  
        <p type="p">26:移動機構</p>  
        <p type="p">27:減壓機構</p>  
        <p type="p">28:攝像部</p>  
        <p type="p">211:第一腔室部</p>  
        <p type="p">212:第二腔室部</p>  
        <p type="p">213:密封構件</p>  
        <p type="p">221:夾頭</p>  
        <p type="p">222:加熱機構</p>  
        <p type="p">225:吸附裝置</p>  
        <p type="p">226:吸附路徑</p>  
        <p type="p">231:夾頭</p>  
        <p type="p">232:加熱機構</p>  
        <p type="p">233:基座</p>  
        <p type="p">235:吸附裝置</p>  
        <p type="p">236:吸附路徑</p>  
        <p type="p">251:伸縮體</p>  
        <p type="p">252:氣體流路</p>  
        <p type="p">253:氣體供給排放源</p>  
        <p type="p">271:吸氣路</p>  
        <p type="p">272:吸氣裝置</p>  
        <p type="p">281:第一攝像部</p>  
        <p type="p">282:第二攝像部</p>  
        <p type="p">G:黏著層</p>  
        <p type="p">W1:第一基板(處理基板)</p>  
        <p type="p">W2:第二基板(載體基板)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1309" publication-number="202620752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>優惠券資訊提供裝置、優惠券資訊提供方法、及優惠券資訊提供程式</chinese-title>  
        <english-title>COUPON INFORMATION PROVISION DEVICE, COUPON INFORMATION PROVISION METHOD, AND COUPON INFORMATION PROVISION PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260107B">G06Q30/0207</main-classification>  
        <further-classification edition="202301120260107B">G06Q30/0214</further-classification>  
        <further-classification edition="202301120260107B">G06Q30/0601</further-classification>  
        <further-classification edition="201801120260107B">G06F9/44</further-classification>  
        <further-classification edition="200601120260107B">G06F13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川朋子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]在特定的零售店用之畫面被顯示的情況下，即使是該零售店的事業者以外之發行者的優惠券，在該零售店中之利用是被設定成可能的優惠券之提示仍為可能。 &lt;br/&gt;　　[解決手段]優惠券資訊提供裝置，係在可讓使用者利用優惠券的店之中，將特定店用之畫面的要求，從終端裝置予以接收。優惠券資訊提供裝置，係基於記憶手段中所被記憶的優惠券資訊，其中，該記憶手段係針對複數個優惠券之各者而將優惠券的發行者與優惠券之利用為可能的店的特定係為可能的優惠券資訊加以記憶，而在複數個優惠券之中，將特定店之事業者為發行者的第1優惠券、與異於特定店之事業者且為將可在店中購入之商品予以製造之製造者為發行者的第2優惠券，且為在特定店的利用是被設定成可能的第2優惠券，加以特定。優惠券資訊提供裝置，係令含有第1優惠券與第2優惠券的畫面，被顯示於終端裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:優惠券服務伺服器</p>  
        <p type="p">2:店舖終端</p>  
        <p type="p">3:電子結帳伺服器</p>  
        <p type="p">4:點數卡伺服器</p>  
        <p type="p">5:優惠券設定終端</p>  
        <p type="p">6:使用者終端</p>  
        <p type="p">NW:網路</p>  
        <p type="p">S:通訊系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1310" publication-number="202621257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自旋電子裝置、磁性記憶體、電子機器及自旋電子裝置之製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260211B">H10B61/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶應義塾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIO UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能崎幸雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAKI, YUKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洞口泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORAGUCHI, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之自旋電子裝置1包含產生層4，該產生層4混存有Al及Si而成，產生自旋流。產生層4包含Al及Si之各組成比之偏差在產生層4之層厚方向上為各自之平均值之20%以內之區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自旋電子裝置/裝置</p>  
        <p type="p">4:產生層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1311" publication-number="202620197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腦脊液中之片段組學</chinese-title>  
        <english-title>FRAGMENTOMICS IN CEREBROSPINAL FLUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">C12Q1/6876</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創新診斷科技中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRE FOR NOVOSTICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　煜明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YUK-MING DENNIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　君賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KWAN CHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江培勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, PEIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾基　亞辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALKI, YASINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">各種實施例係關於分析在腦脊液(CSF)中循環之游離DNA (cfDNA)之片段化模式及潛在的應用。CSF係重要的液體活組織檢查樣本，用於研究中樞神經系統及相關病症，例如感染及惡性腫瘤。對CSF中cfDNA之片段化模式的表徵包括尺寸譜、末端模體、切割譜及表觀遺傳特徵(包括甲基化)之測定。各種應用可使用片段化模式之一或多個特性，例如，判定特定細胞類型在CSF cfDNA池中之比例占比。另一目的係藉由偵測臨床相關DNA (例如，腫瘤比例、病原體)來診斷中樞神經系統中之病變。CSF中之DNA片段可以各種方式分析，包括使用短讀定序及/或長讀定序技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments are directed to the analysis of fragmentation patterns of cell-free DNA (cfDNA) circulating in cerebrospinal fluid (CSF) and the potential applications. CSF is an important liquid biopsy sample used to study the central nervous system and related disorders, such as infection and malignancies. The characterization of fragmentation patterns of cfDNA in CSF includes the size profile, end motif, cleavage profiles, and the determination of epigenetic features, including methylation. Various applications can use one or more properties of fragmentation pattern, for example, in the determination of the proportional contribution of a particular cell types in the CSF cfDNA pool. Another purpose is the diagnosis of pathology in the central nervous system, by the detection of clinically relevant DNA (e.g., tumor fraction, pathogen). DNA fragments in CSF can be analyzed in various ways, including using short-read sequencing, and/or long-read sequencer technologies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:工作流程</p>  
        <p type="p">705:步驟</p>  
        <p type="p">710:步驟</p>  
        <p type="p">715:步驟</p>  
        <p type="p">720:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1312" publication-number="202620065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組成物、及黏著帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">C08F2/50</main-classification>  
        <further-classification edition="200601120260212B">C08F18/04</further-classification>  
        <further-classification edition="200601120260212B">C09D5/20</further-classification>  
        <further-classification edition="200601120260212B">C09J133/10</further-classification>  
        <further-classification edition="201801120260212B">C09J7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田洸造</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, KOZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的為提供一種可於接著時發揮強黏著性，且於剝離時從被接著物抑制殘膠地剝離之黏著劑組成物。又，本發明之目的為提供一種具有使用該黏著劑組成物所形成之黏著劑層的黏著帶。 &lt;br/&gt;本發明為一種黏著劑組成物，其含有（甲基）丙烯酸共聚物，上述（甲基）丙烯酸共聚物具有來自烷基（甲基）丙烯酸酯之構成單元，上述來自烷基（甲基）丙烯酸酯之構成單元包含來自具有碳數為6以上9以下之烷基的烷基（甲基）丙烯酸酯之構成單元，及來自具有碳數10以上之烷基的烷基（甲基）丙烯酸酯之構成單元，上述（甲基）丙烯酸共聚物於側鏈含有碳－碳雙鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1313" publication-number="202620320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滾珠螺桿裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260115B">F16H25/24</main-classification>  
        <further-classification edition="200601120260115B">F16H25/22</further-classification>  
        <further-classification edition="200601120260115B">F16H25/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本精工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NSK LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡渓太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種滾珠螺桿裝置，容易製造。 &lt;br/&gt;　　[技術內容]滾珠螺桿裝置的循環零件，具有：一對的前端部，配置於循環零件的長度方向的兩端部；及本體部，將一對的前端部彼此連接。在前端部中，形成有：開口部，將軌道及循環路連接；及舌部，鏟起在軌道內轉動的球。在循環零件中，形成有將前端部的一部分分割的分割面。分割面，具有：一對的第1分割面，從開口部的緣部朝本體部延伸地分割成凹狀的第1壁部及第2壁部；及第2分割面，將第1壁部從對於第1壁部被配置於靠近長度方向的中央的部分分離。循環零件，是藉由分割面，被分成：第1零件，由本體部及一對的第2壁部一體形成；及一對的第2零件，是第1壁部，且形成有舌部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:循環零件</p>  
        <p type="p">30:循環路</p>  
        <p type="p">31:前端部</p>  
        <p type="p">32:本體部</p>  
        <p type="p">33:開口部</p>  
        <p type="p">33a:緣部</p>  
        <p type="p">34:舌部</p>  
        <p type="p">35:嵌合部</p>  
        <p type="p">37:直線部</p>  
        <p type="p">38:彎曲部</p>  
        <p type="p">40:分割面</p>  
        <p type="p">41:第1分割面</p>  
        <p type="p">42:第2分割面</p>  
        <p type="p">44:第1壁部</p>  
        <p type="p">45:第2壁部</p>  
        <p type="p">50:第1零件</p>  
        <p type="p">51:第2零件</p>  
        <p type="p">52:第1接合面</p>  
        <p type="p">53:第2接合面</p>  
        <p type="p">54:第3接合面</p>  
        <p type="p">55:第4接合面</p>  
        <p type="p">M:中心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1314" publication-number="202619750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619750.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗TROP2抗體-藥物結合物療法之評分方法</chinese-title>  
        <english-title>A SCORING METHOD FOR AN ANTI-TROP2 ANTIBODY-DRUG CONJUGATE THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260202B">A61K47/68</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61K31/437</further-classification>  
        <further-classification edition="200601120260202B">A61K31/436</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商阿斯特捷利康英國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTRAZENECA UK LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡彼爾　安西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAPIL, ANSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希克　馬可斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHICK, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波斯特洛　塞巴斯欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POELSTERL, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史畢茲穆勒　安德烈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPITZMUELLER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞德　哈達薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADE, HADASSAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾邁杰　亨瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAILMEZGER, HENRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮費希特　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VONFICHT, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預測癌症患者對抗體-藥物結合物(ADC)療法將如何反應之方法，該方法涉及藉由對組織樣品中每個癌細胞的染色進行統計操作來計算預測反應分數。該ADC包括ADC有效載荷及靶向癌細胞中之滋養層抗原2(TROP2)蛋白質的ADC抗體。使用與診斷抗體連接的染料將該組織樣品染色，該診斷抗體會與該蛋白質結合。檢測在組織之數位影像中的癌細胞。針對每個癌細胞，基於每個癌細胞的細胞膜及/或細胞質中染料的染色強度、及/或相鄰癌細胞的細胞膜中染料的染色強度，而進行統計操作。基於統計操作的結果是否超過預先設定的各種臨床推導閾值，而預測癌症患者對ADC療法的反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting how a cancer patient will respond to an antibody drug conjugate (ADC) therapy involves computing a predictive response score by performing statistical operations on the staining of each cancer cell in a tissue sample. The ADC includes an ADC payload and an ADC antibody that targets the trophoblast antigen 2 (TROP2) protein in the cancer cells. The tissue sample is stained using a dye linked to a diagnostic antibody that binds to the protein. Cancer cells in digital images of tissue are detected. The statistical operations are performed for each cancer cell based on the staining intensities of the dye in the membrane and/or cytoplasm of each cancer cell and/or in the membranes of neighboring cancer cells. The response of the cancer patient to the ADC therapy is predicted based on whether the results of the statistical operations exceed various clinically derived thresholds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:預測抗TROP2 ADC療法的功效之方法</p>  
        <p type="p">11:取得已使用與診斷抗體(會與癌細胞上的蛋白質結合)連接的染料染色的組織樣品的數位影像</p>  
        <p type="p">12:使用卷積神經網路對數位影像進行影像分析，產生癌細胞、細胞膜和細胞質的影像對象</p>  
        <p type="p">13:針對每個癌細胞，確定癌細胞之膜中染料染色的平均光密度(OD)</p>  
        <p type="p">14:針對每個癌細胞，確定癌細胞細胞質中染料染色的平均光密度(OD)</p>  
        <p type="p">15:針對每個癌細胞，計算正規化膜光密度，其等於膜染色的平均光密度除以膜染色的平均光密度加上細胞質染色的平均光密度總和</p>  
        <p type="p">16:若組織樣品中癌細胞的百分比四分位數具有等於或小於正規化膜光密度閾值之正規化膜光密度值，則識別該組織樣品為正規化膜陽性</p>  
        <p type="p">17:若組織樣品為正規化膜陽性，則識別癌症患者可能受益於ADC</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1315" publication-number="202619627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>害蟲驅除用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A01N41/04</main-classification>  
        <further-classification edition="200601120260202B">A01N37/06</further-classification>  
        <further-classification edition="200601120260202B">A01N25/18</further-classification>  
        <further-classification edition="200601120260202B">A01P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田稔明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種乾燥迅速、乾燥殘渣較少、害蟲驅除性及穩定性亦優異之害蟲驅除用組合物。 &lt;br/&gt;本發明之害蟲驅除用組合物含有成分(A)：耐鹽性陰離子性界面活性劑、成分(B)：選自由非離子性界面活性劑(b11)及油性成分(b12)所組成之群中之1種以上、及成分(C)：水，且於將上述組合物中之一價金屬離子之莫耳數設為X，將上述成分(A)之莫耳數設為A之情形時，莫耳比X/A為1.2以上15以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1316" publication-number="202619724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎雙環雜芳基及雜環化合物以及其組成物及方法</chinese-title>  
        <english-title>NOVEL BICYCLIC HETEROARYL AND HETEROCYCLIC COMPOUNDS, AND COMPOSITIONS AND METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/519</main-classification>  
        <further-classification edition="200601120260202B">A61K31/5025</further-classification>  
        <further-classification edition="200601120260202B">A61K31/502</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260202B">A61K31/438</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商昂勝醫療科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENSEM THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MINGZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供新穎雙環雜芳基及雜環化合物及衍生物，其抑制維爾納氏症候群ATP依賴性解旋酶(WRN)活性。本發明亦提供包含本發明之化合物的醫藥組成物以及其用於治療與WRN活性相關聯或相關的各種疾病及病症的方法，諸如各種類型的癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides novel bicyclic heteroaryl and heterocyclic compounds and derivatives that inhibit Werner Syndrome ATP dependent helicase enzyme (WRN) activity. The invention also provides pharmaceutical compositions comprising compounds of the invention and methods thereof for treating various diseases and disorders associated with or related to WRN activity, such as various types of cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1317" publication-number="202619712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>5-HT2A受體激動劑及M4活化劑之組合及其用途</chinese-title>  
        <english-title>COMBINATION OF A 5-HT2A RECEPTOR AGONIST AND AN M4 ACTIVATOR AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/437</main-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商翼思生物醫藥（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGNIS THERAPEUTICS (SUZHOU) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫沂杉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YISHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝　俊亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, JUNLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方　群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, QUN KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳音</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAYIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示包含5-HT&lt;sub&gt;2A&lt;/sub&gt;受體激動劑及M4活化劑之組合療法、包含其之組合物及試劑盒、以及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are combination therapies comprising a 5-HT&lt;sub&gt;2A&lt;/sub&gt; receptor agonist and an M4 activator, compositions and kits comprising the same, and methods of using the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1318" publication-number="202621173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/23</main-classification>  
        <further-classification edition="200901120260202B">H04W68/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭龍華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, LONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通信方法及裝置，屬於通信領域。用以實現保證支持命令的A-IoT終端的業務流程的高效性和安全性。該方法包括：接收第一消息，根據命令的類型，確定觸發快速命令的流程或常規命令的流程。第一消息包含命令和設備資訊，第一消息用於請求對設備資訊對應的設備執行命令。快速命令的流程包括在尋呼消息中攜帶命令，常規命令的流程包括在盤存之後發送命令，尋呼消息用於尋呼設備資訊對應的設備，盤存為觸發設備資訊對應的設備上報標識。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and device, which belongs to the field of communication. It is used to ensure the efficiency and security of the procedure of A-IoT terminals that support commands. The method includes: receiving a first message, determining whether to trigger a fast command process or a regular command process based on the type of command. The first message contains the command and device information, and is used to request the execution of the command on the device corresponding to the device information. The fast command process includes carrying the command in a paging message, while the regular command process includes sending the command after inventory. The paging message is used to page the device corresponding to the device information, and the inventory is used to trigger the device corresponding to the device information to report its identifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S701、S702、S703、S704、S705、S706:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1319" publication-number="202620043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134330</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>賽帕利單抗及多伐那利單抗之組合</chinese-title>  
        <english-title>COMBINATION OF ZIMBERELIMAB AND DOMVANALIMAB</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/18</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿克思生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCUS BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　俊煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHEE, JOON WHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高熙爾　凱爾西　希微克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUTHIER, KELSEY SIVICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述使用賽帕利單抗及多伐那利單抗（除了一或多種化學治療劑之外）之組合的頭頸鱗狀細胞癌(HNSCC)之治療及預防。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are treatments and preventions for Head and Neck Squamous Cell Carcinoma (HNSCC) using the combination of zimberelimab and domvanalimab, in addition to one or more chemotherapeutic agents.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1320" publication-number="202619707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物</chinese-title>  
        <english-title>SOLID COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/192</main-classification>  
        <further-classification edition="200601120260202B">A61K47/20</further-classification>  
        <further-classification edition="200601120260202B">A61K47/10</further-classification>  
        <further-classification edition="201701120260202B">A61K47/44</further-classification>  
        <further-classification edition="200601120260202B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達紗希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, SAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関夏未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, NATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西野浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHINO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田伸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種固體組成物，其包含由布洛芬與傳明酸形成之結晶，與界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a solid composition comprising crystals formed from ibuprofen and tranexamic acid, and a surfactant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1321" publication-number="202621020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力轉換裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M1/08</main-classification>  
        <further-classification edition="202501120251201B">H10D84/80</further-classification>  
        <further-classification edition="202501120251201B">H10D12/00</further-classification>  
        <further-classification edition="200601120251201B">H03K17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美蓓亞功率半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINEBEA POWER SEMICONDUCTOR DEVICE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在使用包括具有能夠獨立地驅動的兩個閘極的IGBT的RC-IGBT的電力轉換裝置中，減小在二極體恢復時產生的恢復損耗。一種電力轉換裝置，具有：電力轉換電路，上橋臂與下橋臂串聯連接；以及驅動電路，驅動電力轉換電路，上橋臂與下橋臂由RC-IGBT構成，所述RC-IGBT包括具有能夠獨立地驅動的第一閘極及第二閘極的IGBT、以及具有能夠與IGBT的第一閘極及第二閘極獨立地施加電壓的二極體閘極的二極體，驅動電路在向對橋臂的第一閘極施加接通訊號（G1'）之前，向對橋臂的第二閘極施加接通訊號（G2'），並且在向對橋臂的第二閘極施加接通訊號（G2'）之前或同時向自身橋臂的二極體閘極施加接通訊號（DG）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DG:二極體閘極電位(接通訊號)</p>  
        <p type="p">DG2:第二二極體閘極電位</p>  
        <p type="p">G1:第一閘極電位</p>  
        <p type="p">G2:第二閘極電位</p>  
        <p type="p">G1':第一對橋臂閘極電位(接通訊號)</p>  
        <p type="p">G2':第二對橋臂閘極電位(接通訊號)</p>  
        <p type="p">Id:電流</p>  
        <p type="p">t1、t2:延遲時間</p>  
        <p type="p">T1、T2、T3、T4:期間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1322" publication-number="202621532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有邊緣側互連的半導體封裝及半導體封裝組合件以及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE SIDE INTERCONNECTION AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202301120260223B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路(IC)堆疊包含：多個彼此水平分離的積體電路(IC)結構，其中每一IC結構包括頂面、與頂面相對的底面及四個側壁，其包括第一側壁、第二側壁、第三側壁及第四側壁；其中底面或頂面的面積大於任一側壁的面積；橫向延伸RDL結構，其覆蓋該多個IC結構的每一第一側壁；及兩個相鄰IC結構之間的向上延伸導熱層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC stack includes a plurality of integrated circuit (IC) structure horizontally separate with each other, wherein each IC structure includes a top surface, a bottom surface opposite to the top surface, and four sidewalls with a first sidewall, a second sidewall, a third sidewall and a fourth sidewall; wherein the area of the bottom surface or the top surface is larger than that of any sidewall. The IC stack further includes a laterally extending RDL structure covering each first sidewall of the plurality of IC structures, and an upward extending thermal conductivity layer between two adjacent IC structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108A:主RDL</p>  
        <p type="p">108P1:主表面</p>  
        <p type="p">108P2:主表面</p>  
        <p type="p">108S1:側表面</p>  
        <p type="p">108S2:側表面</p>  
        <p type="p">108S3:側表面</p>  
        <p type="p">108S4:側表面</p>  
        <p type="p">212:導電墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1323" publication-number="202621095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於估計網路連接上之可用傳輸頻寬之方法及裝置</chinese-title>  
        <english-title>A METHOD AND A DEVICE FOR ESTIMATING AVAILABLE TRANSMISSION BANDWITH ON A NETWORK CONNECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260202B">H04L43/0876</main-classification>  
        <further-classification edition="202201120260202B">H04L43/50</further-classification>  
        <further-classification edition="202201120260202B">H04L47/25</further-classification>  
        <further-classification edition="202201120260202B">H04L47/12</further-classification>  
        <further-classification edition="201101120260202B">H04N21/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商安訊士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXIS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷蒙　喬納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREMON, JONAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比耶勒霍特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BJAREHOLT, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於估計一網路連接上之可用傳輸頻寬之方法及裝置，資料檔案將在該網路連接上在一預定傳輸時間內傳輸。為將在該網路連接上傳輸之一第一資料檔案判定一資料檔案大小且藉由將該資料檔案大小除以該預定傳輸時間來判定在該預定傳輸時間內傳輸該第一資料檔案所需之一最低平均位元速率。該第一資料檔案之一傳輸時間被劃分為一或多個第一時間間隔及一或多個第二時間間隔，其中該一或多個第一時間間隔之各者其後接著該一或多個第二時間間隔之一第二時間間隔，除非該第一時間間隔係一最後時間間隔。該第一資料檔案之資料在該一或多個第一時間間隔期間以高於該所判定之最低平均位元速率之一位元速率在該網路連接上傳輸。該第一資料檔案之剩餘資料在該一或多個第二時間間隔期間以低於該一或多個第一時間間隔期間之該位元速率之一位元速率在該網路連接上傳輸。該一或多個第二時間間隔期間之該位元速率使得該第一資料檔案之該傳輸之一所得平均位元速率等於或高於該所判定之最低平均位元速率但低於一位元速率臨限值。基於對在該一或多個第一時間間隔期間以高於該所判定之最低平均位元速率之該位元速率在該網路連接上傳輸該第一資料檔案之資料之回饋，估計該網路連接上之一可用傳輸頻寬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a device for estimating available transmission bandwidth on a network connection over which data files are to be transmitted within a predetermined transmission time. A data file size is determined for a first data file to be transmitted over the network connection and a lowest average bitrate required to transmit the first data file within the predetermined transmission time is determined by dividing the data file size by the predetermined transmission time. A transmission time of the first data file is divided into one or more first time intervals and one or more second time intervals, wherein each of the one or more first time intervals is followed by a second time interval of the one or more second time intervals unless the first time interval is a last time interval. Data of the first data file are transmitted over the network connection during the one or more first time intervals at a bitrate higher than the determined lowest average bitrate. Remaining data of the first data file are transmitted over the network connection during the one or more second time intervals at a bitrate lower than the bitrate during the one or more first time intervals. The bitrate during the one or more second time intervals is such that a resulting average bitrate of the transmission of the first data file is equal to or higher than the determined lowest average bitrate but lower than a bitrate threshold. An available transmission bandwidth over the network connection is estimated based on feedback on the transmission of data of the first data file over the network connection during the one or more first time intervals at the bitrate higher than the determined lowest average bitrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S140:步驟</p>  
        <p type="p">S150:步驟</p>  
        <p type="p">S160:步驟</p>  
        <p type="p">S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1324" publication-number="202620897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生物標記估計的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR BIOMARKER ESTIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G16H50/50</main-classification>  
        <further-classification edition="201801120260202B">G16H50/20</further-classification>  
        <further-classification edition="202301120260202B">G06N3/04</further-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅氏血糖健康醫護公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCHE DIABETES CARE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安道拉　英格雷斯　瑪吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDORRA INGLES, MAGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫瑞洛　維納斯　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERRERO VINAS, PAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">已開發出一種生物標記預測之方法。該方法包括提供程式指令集，程式指令接收對應於使用者之身體中的生物標記值之至少一個測量的資料；基於施加於基於物理學的模型的該至少一個測量來產生該使用者之該身體中的該生物標記之未來值的第一預測；使用經訓練的機器學習模型，基於該至少一個測量來產生該第一預測之估計誤差；基於該估計誤差來校正該第一預測以產生該使用者之該身體中的該生物標記之該未來值的第二預測；以及產生指示該使用者之該身體中的該生物標記之該未來值的該第二預測的輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for biomarker prediction has been developed. The method includes providing a set of program instructions which receive data corresponding to at least one measurement of a biomarker value in a body of a user, generate a first prediction of a future value of the biomarker in the body of the user based on the at least one measurement applied to a physics-based model, generate an estimated error of the first prediction based on the at least one measurement using a trained machine learning model, correct the first prediction based on the estimated error to generate a second prediction of the future value of the biomarker in the body of the user, and generate an output indicating the second prediction of the future value of the biomarker in the body of the user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:訓練/推理系統</p>  
        <p type="p">108:處理器</p>  
        <p type="p">112:通訊介面</p>  
        <p type="p">120:記憶體</p>  
        <p type="p">122:經儲存之程式指令</p>  
        <p type="p">124:訓練分析資料</p>  
        <p type="p">126:ML模型</p>  
        <p type="p">132:推理分析資料</p>  
        <p type="p">136:ML剩餘估計資料</p>  
        <p type="p">140:基於物理學的模型</p>  
        <p type="p">144:生物標記輸出</p>  
        <p type="p">148:經校正的生物標記輸出</p>  
        <p type="p">150:網路</p>  
        <p type="p">152:訓練使用者</p>  
        <p type="p">154:訓練感測器</p>  
        <p type="p">162:推理使用者</p>  
        <p type="p">164:推理感測器</p>  
        <p type="p">172:醫療保健提供者</p>  
        <p type="p">174:HCP系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1325" publication-number="202621079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於簽名資料的安全傳輸與儲存之方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEM FOR SECURE TRANSMISSION AND STORAGE OF SIGNATURE DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04L9/08</main-classification>  
        <further-classification edition="201301120260202B">G06F21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商軟體自動化控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOFTWARE AUTOMATION HOLDINGS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博恩海默　扎卡里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORNHEIMER, ZACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於產生一請求，其包含一對話期識別（ID）、一存取碼、及一簽名識別（ID）。使用該簽名識別（ID）及該存取碼建立一查表鑰。使用該存取碼、該對話期識別（ID）、及該簽名識別（ID）建立一內容鑰。該內容鑰加密與該請求相關聯的內容。該加密內容、該查表鑰、及該內容鑰被儲存於一資料庫。發送一連結至一客戶端裝置。該連結包含該簽名識別（ID）及該對話期識別（ID）。於協作網頁接收該存取碼。將該簽名識別（ID）、該對話期識別（ID）、及該存取碼自該協作網頁發送至該資料庫。基於該內容鑰、該簽名識別（ID）、該對話期識別（ID）、及該存取碼解密該內容。使用該內容鑰加密一經擷取簽名，且將其儲存於該資料庫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A request is generated including a session identification (ID), an access code, and a sign ID. A lookup key is created using the sign ID and the access code. A contents key is created using the access code, the session ID, and the sign ID. The contents key encrypts content associated with the request. The encrypted content, the look up key, and the contents key are stored at a database. A link is sent to a client device. The link includes the sign ID and the session ID. The access code is received at the facilitation webpage. The sign ID, session ID, and the access code are sent from the facilitation webpage to the database. The content is decrypted based on the contents key, the sign ID, the session ID, and the access code. A captured signature is encrypted using the contents key and stored at the database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:請求者裝置</p>  
        <p type="p">104:協調器伺服器</p>  
        <p type="p">106:資料庫伺服器/資料庫</p>  
        <p type="p">108:客戶端裝置</p>  
        <p type="p">110:操作</p>  
        <p type="p">112:協作網頁</p>  
        <p type="p">120:操作</p>  
        <p type="p">130:操作</p>  
        <p type="p">130A:操作</p>  
        <p type="p">140:操作</p>  
        <p type="p">150:操作</p>  
        <p type="p">160:操作</p>  
        <p type="p">170:操作</p>  
        <p type="p">180:操作</p>  
        <p type="p">190:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1326" publication-number="202621183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於協調存取點（ＣＡＰ）通訊的安全性</chinese-title>  
        <english-title>SECURITY FOR COORDINATED ACCESS POINT (CAP) COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W88/08</main-classification>  
        <further-classification edition="202101120260202B">H04W12/041</further-classification>  
        <further-classification edition="202101120260202B">H04W12/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊希　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHISCI, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪立南　裘尼卡勒維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALINEN, JOUNI KALEVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉姆卡　桑凱特桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALAMKAR, SANKET SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　高朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, GAURANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾瓦　謝里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELWA, SHERIEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於協調存取點(CAP)通訊的安全性的方法、組件、裝置、及系統。更具體而言，一些態樣係關於建立在與不同基本服務集(BSS)相關聯的二或更多個存取點(AP)之間共用的一密鑰及使用該共用金鑰來保護該等AP之間的成對或基於群組的傳輸。例如，二或更多個AP可交換指示該等AP的一或多個CAP安全性相關功能的訊息。該等AP可建立或以其他方式協商一或多個安全性方案，以用於保護該等AP之間的該等CAP通訊，該等CAP通訊可係成對CAP通訊或群組CAP通訊。該等AP可交換指示用於識別一成對或群組安全金鑰的資訊的一或多個訊框。該等AP可交換根據該經建立的安全金鑰保護的CAP通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices and systems for security for coordinated access point (CAP) communications. Some aspects more specifically relate to the establishment of a secret key shared between two or more access points (APs) that are associated with different basic service sets (BSSs) and the use of the shared key to secure pairwise or group-based transmissions between the APs. For example, two or more APs may exchange messages that indicate one or more CAP security-related capabilities of the APs. The APs may establish or otherwise negotiate one or more security schemes for securing the CAP communications between the APs, which may be pairwise CAP communications or group CAP communications. The APs may exchange one or more frames that indicate information for identifying a pairwise or group security key. The APs may exchange CAP communications that are protected in accordance with the established security key.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102-a,102-b:AP</p>  
        <p type="p">104:STA</p>  
        <p type="p">108-a:第一覆蓋區域</p>  
        <p type="p">108-b:第二覆蓋區域</p>  
        <p type="p">200:傳訊圖</p>  
        <p type="p">220:通訊鏈路</p>  
        <p type="p">222:CAP通訊</p>  
        <p type="p">224:安全性資訊</p>  
        <p type="p">226:安全金鑰</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1327" publication-number="202621160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非地面網路時間資源中用於無線個人區域網路通訊的最大傳輸功率</chinese-title>  
        <english-title>MAXIMUM TRANSMIT POWER FOR WIRELESS PERSONAL AREA NETWORK COMMUNICATIONS IN NON-TERRESTRIAL NETWORK TIME RESOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W52/36</main-classification>  
        <further-classification edition="200901120260202B">H04W52/34</further-classification>  
        <further-classification edition="200601120260202B">H04B7/185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊麥丹　亞希亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMADAN, YAHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉泰　卡瑪拉喀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANTI, KAMALAKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈帕爾　撒瓦特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPAL, THAWATT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種無線通訊裝置可在一或多個非地面網路(NTN)上行鏈路傳輸間隙時間資源中，根據一第一最大傳輸功率傳輸一或多個無線個人區域網路(WPAN)通訊。該無線通訊裝置可在一或多個NTN上行鏈路傳輸時間資源中，根據大於該第一最大傳輸功率的一第二最大傳輸功率傳輸該一或多個WPAN通訊。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless communication device may transmit, in one or more non-terrestrial network (NTN) uplink transmission gap time resources, one or more wireless personal area network (WPAN) communications in accordance with a first maximum transmit power. The wireless communication device may transmit, in one or more NTN uplink transmission time resources, the one or more WPAN communications in accordance with a second maximum transmit power that is greater than the first maximum transmit power. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:實例</p>  
        <p type="p">505:裝置</p>  
        <p type="p">510:無線通訊裝置(WCD)</p>  
        <p type="p">520:元件符號</p>  
        <p type="p">530:元件符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1328" publication-number="202620005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種聚合物衍生陶瓷路線製備多孔陶瓷的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C04B38/00</main-classification>  
        <further-classification edition="200601120251103B">B01D67/00</further-classification>  
        <further-classification edition="200601120251103B">B01D69/08</further-classification>  
        <further-classification edition="200601120251103B">B01D71/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商君原電子科技（海寧）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石鍺元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張倩雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃景彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種聚合物衍生陶瓷路線製備多孔陶瓷的方法，屬於陶瓷製備技術領域，包括：聚合物陶瓷前驅體的交聯：聚合物陶瓷前驅體經過多級熱處理進行交聯；鑄膜漿料的製備：將上述聚合物陶瓷前驅體製備成鑄膜漿料；相轉化成型：鑄膜漿料乾燥後得到中空纖維陶瓷膜前驅體；高溫燒結，高溫燒結成多孔陶瓷。本申請的多孔陶瓷的製備方法，聚合物衍生陶瓷技術和相轉化結合製備，只需配置鑄膜液和調控紡絲工藝參數，無需其它額外條件便能輕鬆實現纖維膜的成型，經交聯後的聚甲基倍半矽氧烷或MK配置的鑄膜液在相轉化過程固化成型快，使得中空纖維陶瓷超濾膜的製備過程更為簡便和高效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1329" publication-number="202620904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高溫超導體及用於製造其之脈衝雷射沉積方法</chinese-title>  
        <english-title>HIGH TEMPERATURE SUPERCONDUCTORS AND PULSED LASER DEPOSITION METHODS FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">H01B12/16</main-classification>  
        <further-classification edition="201701120260212B">B29C64/273</further-classification>  
        <further-classification edition="200601120260212B">H01F41/30</further-classification>  
        <further-classification edition="200601120260212B">C23C14/34</further-classification>  
        <further-classification edition="202301320260212B">H10K101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商量子設計材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTUM DESIGNED MATERIALS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋特　拉法爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GATT, REFAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞尼夫　吉利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANIV, GILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯西恩　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSIAN, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示有關於製造式(I)化合物的方法：&lt;br/&gt; L&lt;sub&gt;n&lt;/sub&gt;D&lt;sub&gt;m&lt;/sub&gt;(B&lt;sub&gt;x&lt;/sub&gt;B’&lt;sub&gt;1-x&lt;/sub&gt;)&lt;sub&gt;r&lt;/sub&gt;(Z&lt;sub&gt;t&lt;/sub&gt;Z’&lt;sub&gt;1-&lt;/sub&gt;&lt;sub&gt;t&lt;/sub&gt;)&lt;sub&gt;q&lt;/sub&gt;M&lt;sub&gt;p&lt;/sub&gt;A&lt;sub&gt;y&lt;/sub&gt;A’&lt;sub&gt;s&lt;/sub&gt;        (I)，&lt;br/&gt; 其中n、m、x、r、t、q、p、y、s、L、D、B、B'、Z、Z'、M、A及A'定義在說明書及製備方法中。這些化合物在高溫下可表現出超導性。這些方法包括使用脈衝雷射沉積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to methods for making compounds of formula (I):&lt;br/&gt; L&lt;sub&gt;n&lt;/sub&gt;D&lt;sub&gt;m&lt;/sub&gt;(B&lt;sub&gt;x&lt;/sub&gt;B’&lt;sub&gt;1-x&lt;/sub&gt;)&lt;sub&gt;r&lt;/sub&gt;(Z&lt;sub&gt;t&lt;/sub&gt;Z’&lt;sub&gt;1-&lt;/sub&gt;&lt;sub&gt;t&lt;/sub&gt;)&lt;sub&gt;q&lt;/sub&gt;M&lt;sub&gt;p&lt;/sub&gt;A&lt;sub&gt;y&lt;/sub&gt;A’&lt;sub&gt;s&lt;/sub&gt; (I),&lt;br/&gt; in which n, m, x, r, t, q, p, y, s, L, D, B, B’, Z, Z’, M, A, and A’ are defined in the specification and methods for making the same. These compounds can exhibit superconductivity at a high temperature. The methods include using pulsed laser deposition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11,12,13,14:過渡金屬離子</p>  
        <p type="p">21,22,23,24:陰離子</p>  
        <p type="p">31,32:緩衝離子/鹼金屬離子</p>  
        <p type="p">34,35:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1330" publication-number="202620219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沉積薄膜的方法及製造記憶體裝置的方法</chinese-title>  
        <english-title>METHOD OF DEPOSITING THIN FILMS AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/04</main-classification>  
        <further-classification edition="200601120260223B">C23C16/42</further-classification>  
        <further-classification edition="200601120260223B">C23C16/01</further-classification>  
        <further-classification edition="202601120260223B">H10P14/24</further-classification>  
        <further-classification edition="202301120260223B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGTM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳次英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, CHA YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金哈娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HA NA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金明鎰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MYEONG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭玹姝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HYUN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹賢植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYEON SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韓彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金才玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池誠俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, SUNG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓智娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JI YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之一實施例，一種按區域選擇性地沉積薄膜的方法，其包含：一基體提供步驟，提供一基體，其中氧化物膜及氮化物膜交替堆疊在一基體上；一抑制劑膜形成步驟，在氮化物膜上選擇性地形成一抑制劑膜；一選擇性氧化物膜形成步驟，在氧化物膜上選擇性地形成一選擇性氧化物膜；及一抑制劑膜蝕刻步驟，移除該抑制劑膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment of the present invention, a method of depositing thin films selectively by area, comprising: a substrate provision step of providing a substrate in which oxide films and nitride films are alternately stacked on a substrate; an inhibitor film formation step of selectively forming an inhibitor film on the nitride film; a selective oxide film formation step of selectively forming a selective oxide film on the oxide film; and an inhibitor film etching step of removing the inhibitor film.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1331" publication-number="202619725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療過重之方法</chinese-title>  
        <english-title>METHODS FOR THE TREATMENT OF OVERWEIGHT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/519</main-classification>  
        <further-classification edition="200601120260202B">A61K31/497</further-classification>  
        <further-classification edition="200601120260202B">A61K31/437</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4162</further-classification>  
        <further-classification edition="200601120260202B">A61K31/535</further-classification>  
        <further-classification edition="200601120260202B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商哈利亞製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALIA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比爾斯　大衛　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEARSS, DAVID JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫拉德　亞歷克西斯　亨利　亞貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLLARD, ALEXIS HENRI ABEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述對個體治療過重、體重管理、治療糖尿病、降低血糖、降低胰島素抗性、降低血清三酸甘油酯含量及/或減輕脂肪重量之方法，該等方法包含向該個體投與腸促胰島素(incretin)模擬劑及炎性體(inflammasome)調節劑。在一些實施例中，該治療方法包含投與腸促胰島素模擬劑及投與式(I)、(II)、(III)、(IV)、(V)、(V-A)、(V-B)、(VI)、(VII)或(0)化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are methods of treating overweight, weight management, treating diabetes, reducing blood glucose, reducing insulin resistance, reducing serum triglyceride levels, and/or reducing adipose weight in a subject, the methods comprising administering an incretin mimetic and an inflammasome modulator to the subject. In some embodiments the method of treatment comprises administering an incretin mimetic and administering a compound of formulae (I), (II), (III), (IV), (V), (V-A), (V-B), (VI), (VII), or (0).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1332" publication-number="202621518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W72/20</main-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀碧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUL BEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余祥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SEUNG JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周名佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, MYUNG JEA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林基泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, GI TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴東久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴坤祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KYUNG ROK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實施例中，一種電子裝置包括：基板，其具有第一導電結構；電子組件，其在所述基板的第一側處耦合到所述第一導電結構，其中所述電子組件包含面向所述基板的所述第一側的第一側和與所述第一側相對的第二側；垂直互連件，其圍繞所述電子組件，其中所述垂直互連件在所述基板的所述第一側處耦合到所述第一導電結構；插入件，其具有第二導電結構並耦合到所述多個垂直互連件；熱主體，其耦合在所述電子組件和所述插入件之間；以及囊封物，其在所述基板和所述插入件之間，圍繞所述熱主體，圍繞所述多個垂直互連件且圍繞所述電子組件。本文中還公開了其它實施例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device comprises a substrate having a first conductive structure, an electronic component coupled to the first conductive structure at a first side of the substrate, wherein the electronic component includes a first side facing the first side of the substrate and a second side opposite the first side, vertical interconnects around the electronic component, wherein the vertical interconnects are coupled to the first conductive structure at the first side of the substrate, an interposer having a second conductive structure coupled to the plurality of vertical interconnects, a thermal body coupled between the electronic component and the interposer, and an encapsulant between the substrate and the interposer, around the thermal body, around the plurality of vertical interconnects, and around the electronic component. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:電子組件</p>  
        <p type="p">118:熱界面材料</p>  
        <p type="p">130:基板</p>  
        <p type="p">132:介電結構</p>  
        <p type="p">134:導電結構</p>  
        <p type="p">136:外部端子</p>  
        <p type="p">138:內部端子</p>  
        <p type="p">140:插入件</p>  
        <p type="p">142:介電結構</p>  
        <p type="p">144:導電結構</p>  
        <p type="p">146:外部端子</p>  
        <p type="p">148:內部端子</p>  
        <p type="p">150:垂直互連件</p>  
        <p type="p">151:核心結構</p>  
        <p type="p">152:可熔材料</p>  
        <p type="p">155:熱主體</p>  
        <p type="p">160:囊封物</p>  
        <p type="p">170:外部互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1333" publication-number="202620383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超音波式流量計的箝置機構</chinese-title>  
        <english-title>CLAMP ON MECHANISM OF ULTRASONIC FLOWMETER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260211B">G01F1/66</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京計裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO KEISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島敬弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將適當的推壓強度穩定地施加於測定管，防止測定管的塑性變形，並得到精度良好的超音波訊號。箝置機構(1)由本體部(2)及蓋部(3)所構成，該本體部(2)將各種資料傳送至外部，該蓋部(3)能夠開閉地連結於本體部(2)。於本體部(2)內設有：長度方向的兩處的台座部(2b)，用於載置測定管(P)。前後的台座部(2b)由聲匹配層(2e)及薄膜的保護膜部(2f)所構成，該聲匹配層(2e)配置於壓電振動器(2d)之間且傳遞超音波，該保護膜部(2f)覆蓋聲匹配層(2e)的上側。於蓋部(3)設有：按壓片(3b)，藉由彈性體(3i)的斥力從上方按壓台座部(2b)上的測定管(P)。於相對於本體部(2)封閉蓋部(3)時，剖面圓形的測定管(P)藉由按壓片(3b)及台座部(2b)從上下方向按壓並使測定管(P)按壓擴展至寬度方向，從而變形成大致橢圓形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clamp-on mechanism is configured to apply an appropriate, stable pressing strength to a measurement tube, prevent plastic deformation of the measurement tube, and obtain highly accurate ultrasonic signals. The clamp-on mechanism includes a main body portion that transmits various data to the outside, and a lid portion that is coupled to the main body portion so as to be openable and closable. The main body portion includes base portions. The lid portion includes pressing pieces, which press the measurement tube on the base portions from above by the resilience of elastic bodies. When the lid portion is closed relative to the main body portion, the measurement tube, which is circular in cross section, is pressed in the up-down directions by the pressing pieces and the base portions. Thus, the measurement tube is expanded in the width direction and deformed into a substantially elliptical shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:箝置機構</p>  
        <p type="p">2:本體部</p>  
        <p type="p">2b:台座部</p>  
        <p type="p">2c:側壁部</p>  
        <p type="p">2e:聲匹配層</p>  
        <p type="p">2f:保護膜部</p>  
        <p type="p">2l:抵接面</p>  
        <p type="p">3:蓋部</p>  
        <p type="p">3a:封閉面</p>  
        <p type="p">3b:按壓片</p>  
        <p type="p">3e:頂面</p>  
        <p type="p">3g:彈性體固定部</p>  
        <p type="p">3h:空隙部</p>  
        <p type="p">3i:彈性體</p>  
        <p type="p">P:測定管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1334" publication-number="202620016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從醫藥成分中去除亞硝胺污染物之方法</chinese-title>  
        <english-title>METHOD FOR REMOVAL OF NITROSAMINE CONTAMINANTS FROM PHARMACEUTICAL INGREDIENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07C207/00</main-classification>  
        <further-classification edition="200601120260202B">C07B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿皮諾沃製藥創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APINOVO PHARMA INNOVATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博斯蒂安　基思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOSTIAN, KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯溫頓　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWINTON, DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄龍　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DILLON, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, VING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉布森　弗蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種從醫藥成分中去除污染性亞硝胺化合物之方法。更具體而言，該方法可用以從醫藥成分中去除小分子量亞硝胺及原料藥相關亞硝胺不純物(NDSRIs)。在一實施例中，受污染的醫藥成分被懸浮或分散到適當的溶劑中，並用特定波長及強度的光處理一段時間，隨後藉由溶劑交換沉澱或其他方法回收該醫藥成分。該方法高效且具成本效益，適用於整個藥物合成程序，從原料到最終活性醫藥成分，或藥品配方中使用之賦形劑。其提供了一種標準化方法，用於對抗致癌性亞硝胺污染藥物的風險。在另一實施例中，揭示了一種程序，其提供了一種簡化的方法來調整該方法之反應條件，以在亞硝胺去除期間最小化或消除藥品之任何降解。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for removal of contaminating nitrosamine compounds from pharmaceutical ingredients. More specifically, this method may be used to remove both small-molecular weight nitrosamines and nitrosamine drug substance-related impurities (NDSRIs) from pharmaceutical ingredients. In an embodiment, the contaminated pharmaceutical ingredient is suspended or dispersed into an appropriate solvent and treated with a defined wavelength and intensity of light for a period of time, followed by recovery of the pharmaceutical ingredient by solvent exchange precipitation, or other method. The method is efficient and cost-effective and applicable to the entire drug synthesis process, from raw ingredients to final active pharmaceutical ingredient, or excipients used in drug product formulations. It provides a standardized approach for combatting the risk of carcinogenic nitrosamine contaminant drugs. In another embodiment a process is disclosed that provides for a streamlined method to tune the reaction conditions of the method to minimize or eliminate any degradation of the pharmaceutical product during nitrosamine removal.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1335" publication-number="202621200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線電路基板及其製造方法</chinese-title>  
        <english-title>PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">H05K1/03</main-classification>  
        <further-classification edition="200601120260210B">H05K3/46</further-classification>  
        <further-classification edition="200601120260210B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今谷梨乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMATANI, RINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池泰明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高野譽大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKANO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">配線電路基板具備透明基板、與形成於透明基板上之配線層。配線層包含銅，且具有交點部及配線部。配線部的寬度是1μm以上且10μm以下。配線部具有在透明基板的一面所朝向之第1方向上和透明基板的一面隔有間距並且朝向第1方向之第1面。第1面是形成為：在和配線部延伸之第2方向正交之該配線部的剖面中，至少一部分相對於第1方向鼓起或凹陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配線電路基板</p>  
        <p type="p">10:透明基板</p>  
        <p type="p">20:配線層</p>  
        <p type="p">21:交點部</p>  
        <p type="p">22:配線部</p>  
        <p type="p">90:覆蓋絕緣層</p>  
        <p type="p">A-A:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1336" publication-number="202620678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134692</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制對記憶體位置的存取</chinese-title>  
        <english-title>CONTROLLING ACCESS TO MEMORY LOCATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260202B">G06F21/52</main-classification>  
        <further-classification edition="201301120260202B">G06F21/71</further-classification>  
        <further-classification edition="200601120260202B">G06F12/14</further-classification>  
        <further-classification edition="201801120260202B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德維克　亞力山大唐納德查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苟尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞梅里亞　伯納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了設備、方法、電腦程式及電腦可讀取儲存媒體。擷取與指令擷取位址相關聯的指令。回應於指令，有條件地執行由該指令定義的操作。將指示處理的當前處理狀態的值保存在包含執行上下文識別符暫存器的暫存器中，該執行上下文識別符暫存器保存指示當前過程的執行上下文識別符。基於指令擷取位址來決定當前區域識別符。基於當前區域識別符及執行上下文識別符來決定許可索引。許可索引用於索引到許可禁用表中，以決定許可禁用集合，並且基於許可禁用集合來決定是否禁止操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatuses, methods, computer programs and computer-readable storage media are disclosed. An instruction associated with an instruction fetch address is fetched. In response to the instruction an operation defined by the instruction is conditionally performed. Values indicative of a current processing state of processing are held in registers comprising an execution context identifier register holding an execution context identifier indicative of a current process. A current region identifier is determined based on the instruction fetch address. A permissions index is determined based on the current region identifier and the execution context identifier. The permissions index is used to index into a permissions disabling table to determine a set of permission disables and whether or not the operation is prohibited is determined based on the set of permission disables.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:設備</p>  
        <p type="p">301:指令擷取電路系統</p>  
        <p type="p">302:處理電路系統</p>  
        <p type="p">303:暫存器</p>  
        <p type="p">304:安全電路系統</p>  
        <p type="p">305:許可索引儲存器</p>  
        <p type="p">306:暫存器</p>  
        <p type="p">307:當前執行上下文識別符暫存器</p>  
        <p type="p">308:當前處理狀態暫存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1337" publication-number="202620626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有限指令的執行</chinese-title>  
        <english-title>LIMITING INSTRUCTION EXECUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G06F9/30</main-classification>  
        <further-classification edition="200601120260202B">G06F9/455</further-classification>  
        <further-classification edition="200601120260202B">G06F9/34</further-classification>  
        <further-classification edition="201301120260202B">G06F21/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德維克　亞力山大唐納德查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苟尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞梅里亞　伯納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯派爾　湯馬斯菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEIER, THOMAS PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種設備，其包括儲存配置值的存取控制暫存器並且處理電路系統執行指令。執行等級電路系統將活動執行等級的執行限制應用於功能性。限制電路系統回應於配置值係特定值而將比活動執行等級更低特權的執行等級的一或多個執行限制應用於功能性，而不影響活動執行等級。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus is provided that includes an access control register that stores a configuration value and processing circuitry executes instructions. Execution level circuitry applies execution limits of an active execution level for a functionality. Limitation circuitry applies one or more execution limits of a less privileged execution level than the active execution level for the functionality, without affecting the active execution level, in response to the configuration value being a particular value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:暫存器檔案</p>  
        <p type="p">16:執行階段</p>  
        <p type="p">20:算術/邏輯單元</p>  
        <p type="p">22:浮點單元</p>  
        <p type="p">24:分支單元</p>  
        <p type="p">28:加載/儲存單元</p>  
        <p type="p">600:資料處理設備</p>  
        <p type="p">602:程式計數器</p>  
        <p type="p">604:呼叫堆疊</p>  
        <p type="p">606:限制控制電路系統</p>  
        <p type="p">608:限制電路系統</p>  
        <p type="p">610:執行等級電路系統</p>  
        <p type="p">612:暫存器ACTLR_EL3</p>  
        <p type="p">614:暫存器ELVL_EL3</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1338" publication-number="202620044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134724</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗β類澱粉蛋白抗體及使用方法</chinese-title>  
        <english-title>ANTI-AMYLOID BETA ANTIBODIES AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C07K16/18</main-classification>  
        <further-classification edition="200601120260203B">A61K39/395</further-classification>  
        <further-classification edition="200601120260203B">C12N15/13</further-classification>  
        <further-classification edition="200601120260203B">C12N15/63</further-classification>  
        <further-classification edition="200601120260203B">C12N15/64</further-classification>  
        <further-classification edition="200601120260203B">A61P25/00</further-classification>  
        <further-classification edition="200601120260203B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商得納利醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENALI THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼斯　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENNIS, MARK S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了特異性結合β類澱粉蛋白(Aβ)之經工程改造之抗體、編碼該等抗Aβ抗體之核酸及製造該等抗Aβ抗體之方法。該等抗Aβ抗體可用於診斷或治療與Aβ蛋白聚集相關之神經退化性疾病或疾患。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are engineered antibodies that specifically bind amyloid beta (Aβ), nucleic acids encoding the anti-Aβ antibodies and methods of manufacturing the anti-Aβ antibodies. The anti-Aβ antibodies can be used to diagnose or treat neurodegenerative diseases or conditions associated with Aβ protein aggregation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1339" publication-number="202620653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制對記憶體位置的存取</chinese-title>  
        <english-title>CONTROLLING ACCESS TO MEMORY LOCATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F12/14</main-classification>  
        <further-classification edition="201601120260202B">G06F12/10</further-classification>  
        <further-classification edition="201301120260202B">G06F21/52</further-classification>  
        <further-classification edition="200601120260202B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德維克　亞力山大唐納德查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苟尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞梅里亞　伯納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了設備、方法、電腦程式、及電腦可讀取儲存媒體，其中擷取與指令擷取位址相關聯的指令，並且當指令包含指定目標記憶體位址的請求時，處理執行取決於目標記憶體位址的操作。暫存器保存指示當前處理狀態的值，並且當前執行上下文識別符暫存器保存指示導致擷取指令的當前過程內的當前執行上下文的當前執行上下文識別符。當指令包含指定目標記憶體位址的請求時，記憶體安全基於指令擷取位址來決定當前區域識別符；基於當前區域識別符及當前執行上下文識別符來決定許可索引。目標區域識別符基於目標記憶體位址決定，並且基於許可索引及目標區域識別符在許可表中的查找產生用於回應於與指定目標記憶體位址的當前執行上下文識別符及當前區域識別符相關聯的指令而發佈的請求的許可資訊。基於許可資訊，決定是否禁止請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatuses, methods, computer programs, and computer-readable storage media are disclosed, wherein an instruction associated with instruction fetch address is fetched and processing performs, when the instruction comprises a request specifying a target memory address, an operation dependent on the target memory address. Registers hold values indicative of a current processing state and a current execution context identifier register holds a current execution context identifier indicative of a current execution context within a current process that caused the instruction to be fetched. Memory security, when the instruction comprises the request specifying the target memory address, determines, based on the instruction fetch address, a current region identifier; determines, based on the current region identifier and the current execution context identifier, a permissions index. A target region identifier is determined based on the target memory address and a lookup in a permissions table, based on the permissions index and the target region identifier, yields permissions information for requests issued in response to instructions associated with the current execution context identifier and the current region identifier that specify the target memory address. Based on the permissions information it is determined whether the request is prohibited.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:設備</p>  
        <p type="p">4:處理管線</p>  
        <p type="p">6:擷取階段</p>  
        <p type="p">8:指令快取記憶體</p>  
        <p type="p">10:解碼階段</p>  
        <p type="p">12:發佈階段</p>  
        <p type="p">14:暫存器檔案</p>  
        <p type="p">16:執行階段</p>  
        <p type="p">18:寫回階段</p>  
        <p type="p">20:算術/邏輯單元</p>  
        <p type="p">22:浮點單元</p>  
        <p type="p">24:分支單元</p>  
        <p type="p">28:加載/儲存單元</p>  
        <p type="p">29:記憶體安全單元</p>  
        <p type="p">30:一級資料快取記憶體</p>  
        <p type="p">32:共享二級快取記憶體</p>  
        <p type="p">34:主系統記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1340" publication-number="202620667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用狀態空間模型在邊緣裝置上高效執行大型生成式人工智慧模型之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR EFFICIENT EXECUTION OF LARGE GENERATIVE ARTIFICIAL INTELLIGENCE MODELS ON EDGE DEVICES USING STATE-SPACE MODELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">G06F16/90</main-classification>  
        <further-classification edition="201901120260202B">G06F16/245</further-classification>  
        <further-classification edition="202301120260202B">G06N3/045</further-classification>  
        <further-classification edition="202301120260202B">G06N3/044</further-classification>  
        <further-classification edition="202201120260202B">H04L9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商智力芯片有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAINCHIP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路易士　Ｍ　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEWIS, M. ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰普森　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAPSON, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴　彥儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEI, YAN RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈帕爾　安努沙　馬登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPAL, ANUSHA MADAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種藉由一運算系統之一處理器執行之用於在一邊緣裝置上執行一大型語言模型之系統及方法，其包含使用一狀態空間模型來維持高效儲存先前網路開放之記憶之一隱藏狀態，預運算LLM之輸入背景情境，在運行時間之前儲存該經預運算背景情境，及在運行時間期間重用該經儲存之經預運算背景情境。該運算系統可將一經接收LLM查詢與該經預運算背景情境組合以查詢一LLM，該LLM可基於該經組合查詢及經預運算背景情境生成一回應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods performed by a processor of a computing system for executing a large language model on an edge device include using a state-space model to maintain a hidden state that efficiently stores the memory of previous network exposures, precomputing input contexts for the LLM, storing the precomputed context prior to runtime, and reuse the stored precomputed context during runtime. The computing system may combine a received LLM query with the precomputed context to query an LLM, which may generate a response based on the combined query and precomputed context.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">204:大型語言模型(LLM)輸入時間線</p>  
        <p type="p">206:大型語言模型(LLM)輸出時間線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1341" publication-number="202620291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風力發電組合</chinese-title>  
        <english-title>WIND POWER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251128B">F03D15/10</main-classification>  
        <further-classification edition="201601120251128B">F03D15/00</further-classification>  
        <further-classification edition="201601120251128B">F03D9/25</further-classification>  
        <further-classification edition="200601120251128B">F03D3/06</further-classification>  
        <further-classification edition="200601120251128B">F03D3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升暘科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNRISING ECO-FRIENDLY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖光陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUANG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風力發電組合，其包含至少二個動力裝置組合相鄰設置，於一個動力裝置組合中至少二個動力裝置經由一轉子軸串聯，且相鄰的二個該動力裝置之間之最長距離小於一個該動力裝置之本體之最短距離，該轉子軸經由一傳動裝置與一發電裝置的一傳動軸連接，該動力裝置傳送各該動力裝置所產生的一機械能於該傳動軸，以使該發電機產生一電能輸出，避免其中一個該動力裝置故障時對該轉子軸產生直接的影響，同時使每個該動力裝置產生之該機械能達到最大化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wind power system includes at least two power device assemblies arranged adjacent to each other, wherein each power device assembly includes at least two power devices connected in series by a rotor shaft, and the maximum distance between two adjacent power devices is smaller than the minimum length of a single power device body. The rotor shaft is linked to the transmission shaft of a generator via a transmission device. The power devices transmit the mechanical energy generated by each device to the transmission shaft, enabling the generator to produce electrical output. This design prevents a direct impact on the rotor shaft in the event of a failure of one of the power devices, while also maximizing the mechanical energy produced by each power device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:動力裝置組合</p>  
        <p type="p">11:動力裝置</p>  
        <p type="p">111:固定板</p>  
        <p type="p">1111:內側面</p>  
        <p type="p">1112:外側面</p>  
        <p type="p">112:轉子軸</p>  
        <p type="p">113:導流葉片</p>  
        <p type="p">12:固定座</p>  
        <p type="p">121:放置部</p>  
        <p type="p">122:支撐部</p>  
        <p type="p">13:傳動裝置</p>  
        <p type="p">132:傳輸帶</p>  
        <p type="p">20:發電裝置</p>  
        <p type="p">21:傳動軸</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1342" publication-number="202620045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合成細胞激素及其使用方法</chinese-title>  
        <english-title>SYNTHETIC CYTOKINES AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/18</main-classification>  
        <further-classification edition="200601120260202B">C07K16/46</further-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特格生物公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEGERBIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊兒　韋德　史丹頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAIR, WADE STANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑川　切恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKAWA, CHEYNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　月明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOO, YUEH MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅賽　安德魯　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCER, ANDREW CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩拉達　拿旦葉　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALLADA, NATHANAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於與合成細胞激素相關之方法及用途。該等合成細胞激素具有對由I型干擾素(IFN)介導之免疫系統中之受體的特異性。本發明亦關於使用本文中所揭示之合成細胞激素治療及/或預防感染(例如，病毒感染)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods and uses relating to synthetic cytokines. The synthetic cytokines have specificity to receptors in immune systems mediated by Type I interferon (IFN). The present disclosure also relates to methods for treating and/or preventing infections (e.g, viral infections) using the synthetic cytokines disclosed herein.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1343" publication-number="202619720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配體-藥物偶聯物及其醫藥用途</chinese-title>  
        <english-title>LIGAND-DRUG CONJUGATES AND THEIR MEDICAL USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/5025</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4155</further-classification>  
        <further-classification edition="201701120260202B">A61K47/68</further-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及配體-藥物偶聯物及其醫藥用途。尤其涉及一種抗體-藥物偶聯物，以及其在治療腫瘤中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to ligand-drug conjugates and their medical uses. In particular, the present disclosure relates to an antibody-drug conjugates and their medical uses, and its use in treating tumors.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1344" publication-number="202619734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可觸發基因沉默的多聚寡核苷酸</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/7088</main-classification>  
        <further-classification edition="201001120260202B">C12N15/113</further-classification>  
        <further-classification edition="200601120260202B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商倍臻生物技術（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISIRNA THERAPEUTICS (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀輝君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HUIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸劍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種可觸發基因沉默的多聚寡核苷酸及其應用，具體揭示了如式（I）所示之化合物及其應用。 &lt;br/&gt;&lt;img align="absmiddle" height="70px" width="119px" file="ed10166.JPG" alt="ed10166.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1345" publication-number="202620335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>霧捕集過濾器以及霧捕集裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">F24C15/20</main-classification>  
        <further-classification edition="200601120260213B">F24F13/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菱谷康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISHIYA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減少來自阻力板的油分、水分等的滴下的霧捕集過濾器以及霧捕集裝置。一種霧捕集過濾器，具備：旋轉過濾器（31a），具有供氣體通過的孔（31a1）；和阻力板（31b），設置在旋轉過濾器（31a）的與吸入側的面相反的面側並成為通過孔（31a1）的氣體的阻力，旋轉過濾器（31a）和阻力板（31b）構成為安裝於驅動旋轉軸而旋轉</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:霧捕集過濾器</p>  
        <p type="p">31a:孔</p>  
        <p type="p">31a11:不面對阻力板的貫通部分</p>  
        <p type="p">31a12:面對阻力板的貫通部分</p>  
        <p type="p">31b:阻力板</p>  
        <p type="p">31c:連結轂</p>  
        <p type="p">31c1、31d1:操作部</p>  
        <p type="p">31d:連結套筒</p>  
        <p type="p">33a:驅動旋轉軸</p>  
        <p type="p">L1、L2、L3:長度</p>  
        <p type="p">s:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1346" publication-number="202621315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260211B">H10F30/225</main-classification>  
        <further-classification edition="202501120260211B">H10F77/1223</further-classification>  
        <further-classification edition="202501120260211B">H10F77/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保小桃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, KOMOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保佳希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大黒聖平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKOKU, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田大凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於可改善雜訊特性。 &lt;br/&gt;本發明之光檢測裝置具備：第1電極；第1導電型之第1半導體區域，其連接於上述第1電極；第2導電型之第2半導體區域，其配置於與上述第1半導體區域不同之層，且以俯視時不與上述第1半導體區域之外周全體相接而與上述外周之一部分相接之方式配置；第2電極，其連接於上述第2半導體區域；第3半導體區域，其配置於上述第1半導體區域及上述第2半導體區域之周圍，將入射光轉換為電荷；及雪崩區域，其配置於上述第1半導體區域與上述第2半導體區域相接之部位，將由上述第3半導體區域轉換後之上述電荷倍增。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:像素</p>  
        <p type="p">2:第1電極</p>  
        <p type="p">3:第2電極</p>  
        <p type="p">4:第1半導體區域</p>  
        <p type="p">5:第2半導體區域</p>  
        <p type="p">6:第3半導體區域</p>  
        <p type="p">7:半導體區域</p>  
        <p type="p">H:PN接合區域</p>  
        <p type="p">K1:路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1347" publication-number="202621327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、光感測器、發電裝置及光電轉換方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260211B">H10F77/12</main-classification>  
        <further-classification edition="202501120260211B">H10F77/90</further-classification>  
        <further-classification edition="202501120260211B">H10F10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人理化學研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIKEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉本斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBBONS, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村優男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川直毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>十倉好紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKURA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之一實施形態之光電轉換元件係具有光電轉換部者，且，上述光電轉換部具有受光面；上述光電轉換部包含鐵電性半導體材料；藉由將上述鐵電性半導體材料於上述受光面之面內方向極化，而破壞上述光電轉換部之空間反轉對稱性；上述鐵電性半導體材料包含鹵化金屬鈣鈦礦半導體材料及含有甲脒離子之鹵化鈣鈦礦半導體材料中之一者或兩者；藉由對照射至上述受光面之照射光進行光電轉換，產生流動於上述鐵電性半導體材料之極化方向之光電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光電轉換部</p>  
        <p type="p">1a:受光面</p>  
        <p type="p">2:第1電極</p>  
        <p type="p">3:第2電極</p>  
        <p type="p">4:電流線</p>  
        <p type="p">10:光電轉換元件</p>  
        <p type="p">13:電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1348" publication-number="202620444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成型體及靜電容量感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01R5/28</main-classification>  
        <further-classification edition="200601120260223B">G01R15/12</further-classification>  
        <further-classification edition="200601120260223B">G01R29/12</further-classification>  
        <further-classification edition="202601120260223B">H05K1/18</further-classification>  
        <further-classification edition="200601120260223B">H05K1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藤倉股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKURA LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立川泰之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIKAWA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上山昌輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEYAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳥井純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORII, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">議題：提供一種成型體，其經由防止自回路部向裝飾層的凹凸轉印，而具有良好外觀。解決手段：靜電容量感測器1A具備：具有立體形狀的裝飾層21、以及接合至裝飾層21的配線組件3。配線組件3具備：具有立體形狀並接合至裝飾層21的成型基材4、以及具有形成電路的回路部5a並以對向裝飾層21的內面21b的方式重疊於成型基材4的配線板5，並且回路部5a未接合至裝飾層21。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:靜電容量感測器</p>  
        <p type="p">2:外殼部件</p>  
        <p type="p">21:裝飾層</p>  
        <p type="p">21a:外面</p>  
        <p type="p">21b:內面</p>  
        <p type="p">21c:操作面</p>  
        <p type="p">21d:下端面</p>  
        <p type="p">211:本體部</p>  
        <p type="p">212:接合部</p>  
        <p type="p">213:樑部</p>  
        <p type="p">214:鉤部</p>  
        <p type="p">22:底部外殼</p>  
        <p type="p">221:第一貫穿孔</p>  
        <p type="p">3:配線組件</p>  
        <p type="p">4:成型基材</p>  
        <p type="p">41:重疊部</p>  
        <p type="p">411:第三貫穿孔</p>  
        <p type="p">42:非重疊部</p>  
        <p type="p">421:第二貫穿孔</p>  
        <p type="p">5:配線板</p>  
        <p type="p">5a:回路部</p>  
        <p type="p">6:控制基板</p>  
        <p type="p">7:間隔物</p>  
        <p type="p">8:推壓部件</p>  
        <p type="p">100:被檢測體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1349" publication-number="202621472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層結構體及強介電體記憶體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W10/10</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D62/40</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林宏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福地厚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUCHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤英治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITOH, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKKAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有澤洋希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARISAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有新穎且簡易之結構之積層結構體，該積層結構體具備具有高結晶性之強介電體磊晶膜。又，本發明提供一種強介電體記憶體，其具備上述積層結構體。該積層結構體依序具備具有第1主面之基板、以及設置於上述基板之第1主面側之晶格匹配層及介電層。上述基板係至少第1主面側之表層部之電阻率為0.5 Ωcm以下之Si基板或SOI基板。上述晶格匹配層係電阻率為1×10&lt;sup&gt;6&lt;/sup&gt; Ωcm以下之具有螢石結構之導電性磊晶膜。上述介電層為磊晶強介電體膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1350" publication-number="202620949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能電池及可充式儲能電池的製造方法</chinese-title>  
        <english-title>ENERGY STORAGE CELL AND METHOD FOR MANUFACTURING RECHARGEABLE ENERGY STORAGE CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H01M10/04</main-classification>  
        <further-classification edition="200601120260211B">H01M10/34</further-classification>  
        <further-classification edition="200601120260211B">H01M10/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商優利電芯控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERCELL HOLDING GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊索　萊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLESSAU, LEIF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑀　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩爾米恩　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERMIEN, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特拉克　馬呂斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRACK, MARIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可充式儲能電池(1)，其中當電池(1)在使用時，一除氣端口(12)形成正極(2)的一部分。此外，對應的製造方法也被提供。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a rechargeable energy storage cell (1), in which a degassing port (12) is forming part of the anode (2) when the cell (1) is in use. Further, a corresponding manufacturing method is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電性端子/正極</p>  
        <p type="p">3:電性端子/負極</p>  
        <p type="p">4:殼體</p>  
        <p type="p">5:電力產生器和儲存元件</p>  
        <p type="p">6:蓋體</p>  
        <p type="p">7:絕緣盤</p>  
        <p type="p">10:連接元件</p>  
        <p type="p">11:絕緣元件</p>  
        <p type="p">12:開口/除氣端口</p>  
        <p type="p">13:栓塞</p>  
        <p type="p">14:蓋帽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1351" publication-number="202620924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子束裝置及用於校正像散和數值孔徑的方法</chinese-title>  
        <english-title>CHARGED PARTICLE BEAM DEVICE AND METHOD FOR CORRECTING ASTIGMATISM AND NUMERICAL APERTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H01J37/304</main-classification>  
        <further-classification edition="200601120260211B">H01J37/06</further-classification>  
        <further-classification edition="200601120260211B">G01B15/06</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商ＩＣＴ積體電路測試股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICT INTEGRATED CIRCUIT TESTING GESELLSCHAFT FUR HALBLEITERPRUFTECHNIK MBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾伯格　多明尼克派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHBERGER, DOMINIK PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREUER, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯曼　湯瑪仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMEN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一個實施例，描述了一種校正帶電粒子束的像散和調整數值孔徑的方法。使用雙消像散器來校正該像散並調整該數值孔徑。該雙消像散器具有第一消像散器和第二消像散器。該方法包括使用雙消像散器的該第二消像散器校正該帶電粒子束的該像散；並且使用該雙消像散器的該第一消像散器調整該帶電粒子束的該數值孔徑。該第一消像散器和該第二消像散器沿光軸間隔排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment, a method of correcting an astigmatism and adjusting a numerical aperture of a charged particle beam is described. The astigmatism is corrected and the numerical aperture is adjusted with a double stigmator. The double stigmator has a first stigmator and a second stigmator. The method comprises correcting the astigmatism of the charged particle beam with the second stigmator of a double stigmator; and adjusting the numerical aperture of the charged particle beam with the first stigmator of the double stigmator. The first stigmator and the second stigmator are spaced apart along an optical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光軸</p>  
        <p type="p">10:帶電粒子束源</p>  
        <p type="p">12:電容器透鏡</p>  
        <p type="p">14:物鏡</p>  
        <p type="p">20:取樣</p>  
        <p type="p">22:工作臺</p>  
        <p type="p">32:對準致偏器</p>  
        <p type="p">34:掃瞄致偏器</p>  
        <p type="p">100:帶電粒子束裝置</p>  
        <p type="p">110:雙消像散器</p>  
        <p type="p">112:第一消像散器</p>  
        <p type="p">114:第二消像散器</p>  
        <p type="p">150:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1352" publication-number="202621138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增強廣播通訊</chinese-title>  
        <english-title>ENHANCED BROADCAST COMMUNICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W4/06</main-classification>  
        <further-classification edition="202301120260202B">H04W72/30</further-classification>  
        <further-classification edition="202201120260202B">H04L65/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝穎超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, YINGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些態樣中，一種使用者裝置可針對共用廣播等時群組(BIG)廣播用於促進由多個廣播裝置進行的廣播的BIG資訊，其中該BIG具有二或更多個廣播等時串流(BIS)，包括控制BIS、第一BIS、或第二BIS中之二或更多者。該使用者裝置可經由該第一BIS廣播第一廣播通訊。該使用者裝置可經由該第二BIS接收第二廣播通訊。描述了多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some aspects, a user device may broadcast, for a shared broadcast isochronous group (BIG), BIG information for facilitating broadcasts by multiple broadcast devices, wherein the BIG has two or more broadcast isochronous streams (BISs), including two or more of a control BIS, a first BIS, or a second BIS. The user device may broadcast a first broadcast communication via the first BIS. The user device may receive a second broadcast communication via the second BIS. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110-1:第一使用者裝置</p>  
        <p type="p">110-2:第二使用者裝置</p>  
        <p type="p">110-3:第三使用者裝置</p>  
        <p type="p">600:實例</p>  
        <p type="p">605:BIG事件</p>  
        <p type="p">610-0:控制BIS</p>  
        <p type="p">610-1:第一BIS</p>  
        <p type="p">610-2:第二BIS</p>  
        <p type="p">610-3:第三BIS</p>  
        <p type="p">610-4:第四BIS</p>  
        <p type="p">615A:第一迭代</p>  
        <p type="p">615B:第二迭代</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1353" publication-number="202619751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於蛋白質降解的新型偶聯物、包含該偶聯物的組合物、和使用該偶聯物的方法</chinese-title>  
        <english-title>NOVEL CONJUGATES FOR PROTEIN DEGRADATION, COMPOSITIONS COMPRISING THE SAME, AND METHODS OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260209B">A61K47/68</main-classification>  
        <further-classification edition="200601120260209B">A61K31/497</further-classification>  
        <further-classification edition="200601120260209B">A61K31/44</further-classification>  
        <further-classification edition="200601120260209B">A61K31/403</further-classification>  
        <further-classification edition="200601120260209B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方李超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, LICHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>開曼群島商百放開曼有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOFRONT LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方李超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, LICHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁道鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, DAOPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉苗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供可用於介導靶蛋白位準並治療某些疾病的新型雙功能偶聯物、尤其是降解劑-抗體偶聯物(DAC)。本申請公開的偶聯物包含特異性結合於結合蛋白如GPRC5D、CD79b或CD19的結合部分，任選的連接子，和有效載荷降解劑，例如源自PROTAC分子的有效載荷，其為能夠誘導靶蛋白降解的生物活性部分，所述靶蛋白例如為Ikaros(“IKZF”)家族中的一種或多種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides novel bifunctional conjugates, especially degrader-antibody conjugates (DACs), that are useful in meditation the levels of target proteins and treating certain diseases. A conjugate disclosed herein comprises a binding moiety that specifically binds to a binding protein such as GPRC5D, CD79b or CD19, an optional linker, and payload degrader, such as a payload derived from a PROTAC molecule, which is a bioactive moiety capable of inducing degradation of a target protein, such as one or more of the Ikaros (“IKZF”) family.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1354" publication-number="202619729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三環５—ＨＴ２ＡＲ促效劑及其用途</chinese-title>  
        <english-title>TRICYCLIC 5-HT2AR AGONISTS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/5513</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260202B">A61K31/437</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商布蘭達里斯治療私人有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDARIS THERAPEUTICS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉伯森　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, KARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛洛斯普　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOSSOP, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟特拿　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTANA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEAL, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪瑞丹　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERIDAN, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古提瑞斯　科諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUTIERREZ, KENO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克理得藍　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRIDLAND, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於適用於活化5-羥基色胺2A受體(5-HT2AR)之化合物、其醫藥學上可接受之組合物及使用該等化合物及組合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds useful for activating 5-hydroxytryptamine 2A receptor (5-HT2AR), pharmaceutically acceptable compositions thereof, and methods of using said compounds and compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1355" publication-number="202620023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>核-殼化合物、感光性樹脂組合物和層、濾色器和感測器</chinese-title>  
        <english-title>CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION AND LAYER, COLOR FILTER AND SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07D471/14</main-classification>  
        <further-classification edition="200601120260202B">C07F7/18</further-classification>  
        <further-classification edition="200601120260202B">C09B57/00</further-classification>  
        <further-classification edition="200601120260202B">C09B67/02</further-classification>  
        <further-classification edition="200601120260202B">G03F7/004</further-classification>  
        <further-classification edition="200601120260202B">G02B5/20</further-classification>  
        <further-classification edition="202501120260202B">H10F39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文熙朝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HEEJO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴白晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BAEK SOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐光源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KWANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金益辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, ICKJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴秀彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種核-殼化合物、包含所述核-殼化合物的感光性樹脂組合物、使用所述感光性樹脂組合物製造的感光性樹脂層、包括所述感光性樹脂層的濾色器、以及包括所述濾色器的互補金屬氧化物半導體圖像感測器，所述核-殼化合物包括由化學式1表示的核和包圍所述核的殼，所述殼由化學式2表示： &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="463px" width="416px" file="ed10065.JPG" alt="ed10065.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="242px" width="546px" file="ed10066.JPG" alt="ed10066.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer manufactured using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1 and a shell surrounding the core, the shell being represented by Chemical Formula 2: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="430px" width="397px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="167px" width="394px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1356" publication-number="202620007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C25/18</main-classification>  
        <further-classification edition="200601120260223B">C07C381/12</further-classification>  
        <further-classification edition="200601120260223B">C07D317/22</further-classification>  
        <further-classification edition="200601120260223B">C07D317/24</further-classification>  
        <further-classification edition="200601120260223B">C07D317/32</further-classification>  
        <further-classification edition="200601120260223B">C07D317/68</further-classification>  
        <further-classification edition="200601120260223B">C07D317/70</further-classification>  
        <further-classification edition="200601120260223B">C07D317/72</further-classification>  
        <further-classification edition="200601120260223B">C07D321/10</further-classification>  
        <further-classification edition="200601120260223B">C07D327/06</further-classification>  
        <further-classification edition="200601120260223B">C07D327/08</further-classification>  
        <further-classification edition="200601120260223B">C07D333/46</further-classification>  
        <further-classification edition="200601120260223B">C07D333/54</further-classification>  
        <further-classification edition="200601120260223B">C07D333/76</further-classification>  
        <further-classification edition="200601120260223B">C07D335/02</further-classification>  
        <further-classification edition="200601120260223B">C07D407/04</further-classification>  
        <further-classification edition="200601120260223B">C07D493/04</further-classification>  
        <further-classification edition="200601120260223B">C07D493/10</further-classification>  
        <further-classification edition="200601120260223B">C07D497/10</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部祐大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長野雅弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種感放射線性組成物，含有：下述式（1）所表示的化合物、包含具有酸解離性基的結構單元（I）的聚合物、及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="170px" width="406px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，W為包含縮醛結構的經取代或未經取代的環狀結構；L為經取代或未經取代的碳數1～5的二價烴基、或者於該烴基的碳-碳間包含二價含雜原子的基的基；R&lt;sup&gt;1&lt;/sup&gt;為氫原子、-CN、-NO&lt;sub&gt;2&lt;/sub&gt;、-F、-CF&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;b&lt;/sup&gt;、-COR&lt;sup&gt;c&lt;/sup&gt;或一價有機基（a）；Z&lt;sup&gt;+&lt;/sup&gt;及Z&lt;sub&gt;g&lt;/sub&gt;&lt;sup&gt;+&lt;/sup&gt;為一價有機陽離子；L&lt;sup&gt;g&lt;/sup&gt;為單鍵、二價含雜原子的基或碳數1～20的二價有機基；A&lt;sup&gt;-&lt;/sup&gt;為-COO&lt;sup&gt;-&lt;/sup&gt;或-SO&lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1357" publication-number="202620401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉機器的異常診斷裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">G01M7/02</main-classification>  
        <further-classification edition="200601120260108B">G01H17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福江晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUE, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種旋轉機器的異常診斷裝置，包括：振動感測器，測量旋轉機器的振動；運轉資料庫，收集並積存所述振動感測器的測量資料；旋轉機器資訊資料庫，記錄旋轉機器的至少型式、規格及性能資訊；維護作業履歷資料庫，記錄旋轉機器的維護作業履歷；以及診斷處理部，使用各所述資料庫的資料來診斷旋轉機器的異常。所述診斷處理部針對每個型式保持診斷模型來進行診斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:旋轉機器</p>  
        <p type="p">2:振動感測器</p>  
        <p type="p">3:資料收集裝置</p>  
        <p type="p">4:運轉資料庫</p>  
        <p type="p">5:旋轉機器資訊資料庫</p>  
        <p type="p">6:診斷裝置</p>  
        <p type="p">7:診斷處理部</p>  
        <p type="p">8:維護作業履歷資料庫</p>  
        <p type="p">9:診斷對象清單</p>  
        <p type="p">10:診斷模型群資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1358" publication-number="202620366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>集成式冷板散熱裝置</chinese-title>  
        <english-title>INTEGRATED COLD PLATE COOLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250920B">F28F13/12</main-classification>  
        <further-classification edition="200601120250920B">F28F3/02</further-classification>  
        <further-classification edition="200601120250920B">F28F3/12</further-classification>  
        <further-classification edition="200601120250920B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡士凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銘宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種集成式冷板散熱裝置，包括底板和蓋板。底板包括頂面、底面以及複數個散熱鰭片，其中頂面和底面於第一方向上彼此相反設置，底面熱耦合至複數個發熱源，複數個散熱鰭片設置於頂面，於空間上相對複數個發熱源。蓋板包括入流口、至少一出流口以及複數個紊流產生器，其中蓋板沿第一方向組裝至底板的該頂面時，形成複數個腔室，其中複數個腔室分別容納複數個散熱鰭片，且連通於入流口和至少一出流口之間，其中複數個紊流產生器從蓋板朝向底板凸伸，且複數個散熱鰭片之每一者與入流口之間對應設置有複數個紊流產生器中之一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated cold plate cooling device is disclosed and includes a base plate and a cover plate. The base plate includes a top surface, a bottom surface and a plurality of heat dissipation fins. The top surface and the bottom surface are arranged opposite to each other in a first direction, the bottom surface is thermally coupled to a plurality of heat sources, and the plurality of heat dissipation fins are arranged on the top surface, and spatially corresponding to the plurality of heat sources. The cover plate includes an inlet, at least one outlet and a plurality of turbulence generators. When the cover plate is assembled to the top surface of the base plate along the first direction, a plurality of chambers are formed. The plurality of chambers are configured to respectively accommodate the plurality of heat dissipation fins and in communication between the inlet and the at least one outlet. The plurality of turbulence generators protrude from the cover plate toward the base plate, and one of the plurality of turbulence generators is correspondingly arranged between each of the plurality of heat dissipation fins and the inlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:集成式冷板散熱裝置</p>  
        <p type="p">13:散熱鰭片</p>  
        <p type="p">21:入流口</p>  
        <p type="p">22b、22c:出流口</p>  
        <p type="p">23a、23b、23c:腔室</p>  
        <p type="p">24a、24b、24c:前導通道</p>  
        <p type="p">25b、25c:導出通道</p>  
        <p type="p">3:紊流產生器</p>  
        <p type="p">9a、9b、9c:發熱源</p>  
        <p type="p">F:流向</p>  
        <p type="p">AA’:線段</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1359" publication-number="202620091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性元件、印刷配線板及印刷配線板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08G59/08</main-classification>  
        <further-classification edition="200601120260213B">C08L33/10</further-classification>  
        <further-classification edition="202501120260213B">C08L23/0869</further-classification>  
        <further-classification edition="201801120260213B">C08K3/014</further-classification>  
        <further-classification edition="200601120260213B">C08K3/36</further-classification>  
        <further-classification edition="200601120260213B">C08F2/50</further-classification>  
        <further-classification edition="200601120260213B">C08F2/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡出翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADE, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田直彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, NAOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之永久抗蝕劑用之感光性樹脂組成物含有（A）酸改質含乙烯基樹脂、（B）光聚合性化合物、（C）熱固化性樹脂、（D）無機填料、（E）光聚合起始劑及（F）聚合抑制劑，（F）聚合抑制劑包含氮氧自由基化合物，相對於（A）酸改質含乙烯基樹脂、（B）光聚合性化合物及（C）熱固化性樹脂的總量100質量份，氮氧自由基化合物的含量為0.015～0.40質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1360" publication-number="202619730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>WDR5抑制劑、化合物、醫藥組合物、及其使用方法</chinese-title>  
        <english-title>WDR5 INHIBITORS, COMPOUNDS, PHARMACEUTICAL COMPOSITIONS, AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/5513</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4178</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商亞力維克希斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALIVEXIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水喬史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺田央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADA, YOH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松木正尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUKI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛科　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINKO, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>默茲　布雷克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERTZ, BLAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格瑪迪　溫凱特碩　勞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUMMADI, VENKATESHWAR RAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德希穆克　夏拉德　錢德拉坎特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESHMUKH, SHARAD CHANDRAKANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供適用於抑制WD40重複域5 (WDR5)之化合物及組合物。 &lt;br/&gt;本文提供之化合物及組合物適用於治療由WDR5介導之疾病及病況，諸如癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are compounds and compositions useful in inhibiting WD40 repeat domain 5 (WDR5). &lt;br/&gt;The compounds and compositions provided herein are useful for treating diseases and conditions mediated by WDR5 such as cancers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1361" publication-number="202619965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬複合氧化物、複合體、氧產生觸媒、觸媒油墨及電極、以及金屬複合氧化物及複合體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C01B13/02</main-classification>  
        <further-classification edition="200601120260202B">B01J23/28</further-classification>  
        <further-classification edition="200601120260202B">H01M4/90</further-classification>  
        <further-classification edition="200601120260202B">B01J23/46</further-classification>  
        <further-classification edition="200601120260202B">C04B35/495</further-classification>  
        <further-classification edition="200601120260202B">C01G39/02</further-classification>  
        <further-classification edition="200601120260202B">B32B5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原国豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, GUOHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁建軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坪尚人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUBO, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之金屬複合氧化物包含銥、釕、及鉬。鉬氧化物為低結晶性氧化物或非晶氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1362" publication-number="202620968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電波反射體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H01Q15/14</main-classification>  
        <further-classification edition="200601120260202B">H05K9/00</further-classification>  
        <further-classification edition="200601120260202B">H01Q15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井手泰明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDE, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電波反射體，其能夠使電波反射至空間較廣之範圍，且因透明度較高而能夠保持景觀。 &lt;br/&gt;本發明提供一種電波反射體，其於基材上積層有包含導電體之導電薄膜層，且 &lt;br/&gt;上述導電薄膜層中，上述導電體為週期性地連續之金屬網圖案形狀， &lt;br/&gt;上述電波反射體之單位構造之開口面積（mm&lt;sup&gt;2&lt;/sup&gt;）為270/（x^1.11）（x：頻率（GHz））以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1363" publication-number="202621136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＥＭＳ麥克風</chinese-title>  
        <english-title>MEMS MICROPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">H04R19/04</main-classification>  
        <further-classification edition="200601120260214B">H04R1/04</further-classification>  
        <further-classification edition="200601120260214B">B81B7/02</further-classification>  
        <further-classification edition="200601120260214B">H05K1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG KWEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的一個實施例之MEMS麥克風可包括：第一基板；堆疊至第一基板上的第二基板；設置至第二基板上的MEMS結構；以及設置在第二基板上並與MEMS結構保持間隔關係的訊號處理元件，其中，第一基板包括剛性基板，第二基板包括柔性基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The MEMS microphone according to one embodiment of the present invention may comprise: a first substrate; a second substrate stacked onto the first substrate; a MEMS structure disposed on the second substrate; and a signal processing element disposed on the second substrate in spaced-apart relation to the MEMS structure, wherein the first substrate includes a rigid substrate, and the second substrate includes a flexible substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聲孔</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">200:第二基板</p>  
        <p type="p">300:MEMS結構</p>  
        <p type="p">310:主體</p>  
        <p type="p">320:振膜</p>  
        <p type="p">330:背板</p>  
        <p type="p">360:聲孔</p>  
        <p type="p">400:殼體</p>  
        <p type="p">500:訊號處理元件</p>  
        <p type="p">600:電容器</p>  
        <p type="p">700:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1364" publication-number="202620453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>速度估計失真校正</chinese-title>  
        <english-title>VELOCITY ESTIMATION DISTORTION CORRECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01S7/48</main-classification>  
        <further-classification edition="201701120260202B">G06T7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍姆　佩爾約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLM, PER JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅爾　雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROLL, JACOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩爾松　古斯塔夫尼爾斯圖雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERSSON, GUSTAV NILS TURE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾德霍爾　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIDEHALL, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些態樣中，一種設備可從一光達感測器根據表示一感測物體的二或更多次掃描的一點雲的一或多個資料點接收一定界幾何。該定界幾何可具有與該感測物體相關聯的一定界體。該設備可延伸該定界幾何的該定界體以圍封該點雲中的該等資料點之至少一子集。該設備可根據該點雲的該等資料點之二或更多個子集估計一資料點位移。該設備可根據該資料點位移估計該感測物體的一速度。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some aspects, an apparatus may receive, from a lidar sensor, a bounding geometry in accordance with one or more data points of a point cloud representing two or more scans of a sensed object. The bounding geometry may have a bounding volume associated with the sensed object. The apparatus may extend the bounding volume of the bounding geometry to enclose at least a subset of the data points in the point cloud. The apparatus may estimate a data point displacement in accordance with two or more subsets of the data points of the point cloud. The apparatus may estimate a velocity of the sensed object in accordance with the data point displacement. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:第一車輛</p>  
        <p type="p">110:第二車輛</p>  
        <p type="p">115:光達感測器</p>  
        <p type="p">205:初始定界幾何；定界幾何</p>  
        <p type="p">210:校正定界幾何</p>  
        <p type="p">500:實例</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1365" publication-number="202620734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>專案管理系統、專案管理方法及電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">G06Q10/101</main-classification>  
        <further-classification edition="202301120260202B">G06Q10/107</further-classification>  
        <further-classification edition="202301120260202B">G06Q10/0631</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安聯智通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOGIPEACE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大川(神谷)智子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWA (KAMIYA), TOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種能夠於降低專案管理所需負擔並且適切進行進度管理之專案管理系統等。本發明提供一種專案管理系統，用於管理複數個使用者所涉及的專案，包含：帳號儲存部，儲存使用者的帳號資訊；顯示控制部，顯示專案區域及聊天區域，該專案區域顯示有專案，該聊天區域顯示有聊天群組中的訊息；專案選擇部，選擇專案；訊息發送部，在複數個使用者之間發送訊息；訊息選擇部，選擇顯示於聊天區域的訊息；以及訊息儲存部，將經選擇的專案與經選擇的訊息建立關連並儲存。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:專案管理系統</p>  
        <p type="p">11:訊息選擇部</p>  
        <p type="p">13:標籤賦予部</p>  
        <p type="p">15:標籤自動賦予部</p>  
        <p type="p">17:檢索部</p>  
        <p type="p">19:機密判斷部</p>  
        <p type="p">21:整合率計算部</p>  
        <p type="p">23:模型產生部</p>  
        <p type="p">25:外部連動部</p>  
        <p type="p">3:顯示控制部</p>  
        <p type="p">31:聊天顯示控制部</p>  
        <p type="p">33:專案顯示控制部</p>  
        <p type="p">35:進度狀態顯示控制部</p>  
        <p type="p">37:標籤顯示控制部</p>  
        <p type="p">39:警告顯示控制部</p>  
        <p type="p">41:檢索顯示控制部</p>  
        <p type="p">43:附件檔案顯示控制部</p>  
        <p type="p">45:郵件顯示控制部</p>  
        <p type="p">5:儲存部</p>  
        <p type="p">51:帳戶儲存部</p>  
        <p type="p">53:專案儲存部</p>  
        <p type="p">55:訊息儲存部</p>  
        <p type="p">57:標籤儲存部</p>  
        <p type="p">59:機密儲存部</p>  
        <p type="p">61:閾值儲存部</p>  
        <p type="p">63:訓練資料儲存部</p>  
        <p type="p">65:模型儲存部</p>  
        <p type="p">67:知識儲存部</p>  
        <p type="p">7:專案選擇部</p>  
        <p type="p">9:訊息發送部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1366" publication-number="202620095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯樹脂摻合物及用於製備其之方法</chinese-title>  
        <english-title>POLYESTER RESIN BLEND AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08G63/16</main-classification>  
        <further-classification edition="200601120260202B">G01K17/00</further-classification>  
        <further-classification edition="200601120260202B">C08L67/06</further-classification>  
        <further-classification edition="200601120260202B">C08J3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃多榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, DA-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳泫遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYUN-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種聚酯樹脂摻合物、其製備方法及由其製備之物件。該聚酯樹脂摻合物包含一結晶型聚酯樹脂；及一非晶質聚酯樹脂。由該聚酯樹脂摻合物製備的物件可具有極佳的性質，諸如透明度、耐熱性、機械強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polyester resin blend, to a process for preparing the same, and to an article prepared therefrom. The polyester resin blend comprises a crystalline polyester resin; and an amorphous polyester resin. An article prepared from the polyester resin blend can have excellent properties such as transparency, thermal resistance, mechanical strength.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1367" publication-number="202619633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>源自植物之苦澀味之減輕劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260202B">A23L27/10</main-classification>  
        <further-classification edition="202501120260202B">A23G1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商江崎格力高股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EZAKI GLICO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西谷健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHITANI, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一實施形態中，本發明欲解決之課題在於提供一種新穎苦澀味減輕劑，其使用有至今未知曉具有苦澀味減輕效果的成分。於一實施形態中，本發明欲解決之課題在於提供一種包含該新穎苦澀味減輕劑之飲食品。&lt;br/&gt; 本發明提供一種源自植物之苦澀味之減輕劑，包含源自植物之木脂素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1368" publication-number="202619726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為ＣＤＫ抑制劑的三並環化合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/519</main-classification>  
        <further-classification edition="200601120260202B">A61K31/437</further-classification>  
        <further-classification edition="200601120260202B">A61K31/436</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4355</further-classification>  
        <further-classification edition="200601120260202B">A61K31/425</further-classification>  
        <further-classification edition="200601120260202B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷緣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王承啟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENGQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李玉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪紀楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開屬於醫藥化學領域，涉及作為CDK抑制劑的三並環化合物及其應用，具體涉及式（I）所示化合物、其異構體或其藥學上可接受的鹽。本公開中的化合物作為全新結構的CDK12抑制劑，其對CDK12誘導的信號傳導有良好的抑制作用，可以發展成為新型CDK12抑制劑類藥物。&lt;br/&gt;&lt;img align="absmiddle" height="195px" width="168px" file="ed10505.JPG" alt="ed10505.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1369" publication-number="202621076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04L5/00</main-classification>  
        <further-classification edition="202301120260202B">H04W72/04</further-classification>  
        <further-classification edition="200601120260202B">H04L27/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及裝置，涉及通信技術領域，能夠提供在頻寬上分佈較均勻的DRU，降低資料的峰值平均功率比的平均值，儘量避免非線性失真，提高功放效率。該方法包括：通過第一資源單元進行通信；第一資源單元包括242個子載波；242個子載波中按照頻域順序排列的第1個子載波至第m個子載波中，相鄰的子載波的索引之差的絕對值為n；242個子載波中按照頻域順序排列的第m+1個子載波至第242個子載波中，相鄰的子載波的索引之差的絕對值為n；242個子載波中按照頻域順序排列的第m個子載波與第m+1個子載波的索引之差的絕對值為n的正整數倍；n為大於1的正整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus are provided, which relate to the field of communication technologies, to provide DRUs that are relatively evenly distributed across a bandwidth, reduce an average peak-to-average power ratio of data, avoid nonlinear distortion as much as possible, and improve power amplification efficiency. The method includes: performing communication by using a first resource unit, where the first resource unit includes 242 subcarriers; from a 1&lt;sup&gt;st&lt;/sup&gt; subcarrier to an m&lt;sup&gt;th&lt;/sup&gt; subcarrier that are arranged in frequency domain order among the 242 subcarriers, an absolute value of a difference between indexes of adjacent subcarriers is n; from an (m+1)&lt;sup&gt;th&lt;/sup&gt; subcarrier to a 242nd subcarrier that are arranged in frequency domain order among the 242 subcarriers, an absolute value of a difference between indexes of adjacent subcarriers is n; and an absolute value of a difference between indexes of the m&lt;sup&gt;th&lt;/sup&gt; subcarrier and the (m+1)&lt;sup&gt;th&lt;/sup&gt; subcarrier that are arranged in frequency domain order among the 242 subcarriers is a positive integer multiple of n, where n is a positive integer greater than 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">501:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1370" publication-number="202619749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＨＥＲ２結合分子</chinese-title>  
        <english-title>HER2-BINDING MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K47/22</main-classification>  
        <further-classification edition="200601120260202B">A61K47/08</further-classification>  
        <further-classification edition="201701120260202B">A61K47/68</further-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英格拉姆　皮爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGRAM, PIERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊德　柯克普　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYD-KIRKUP, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　安琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOI, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYERS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　方正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAU, KEVIN FONGCHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　拉賈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, RAJAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　思賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOO, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達摩迪卡里　布沙恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHARMADHIKARI, BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔卡爾　迪普第</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAKKAR, DIPTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英格拉姆　皮爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGRAM, PIERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊德　柯克普　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYD-KIRKUP, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　安琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOI, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYERS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　方正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAU, KEVIN FONGCHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　拉賈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, RAJAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　思賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOO, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達摩迪卡里　布沙恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHARMADHIKARI, BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔卡爾　迪普第</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAKKAR, DIPTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供結合至HER2之抗原結合分子，該等抗原結合分子包含(i) HER2結合部分，及(ii)連接子-酬載部分，其中該連接子-酬載部分係： &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="365px" file="ed10074.JPG" alt="ed10074.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中RP&lt;sub&gt;1&lt;/sub&gt;及RP&lt;sub&gt;2&lt;/sub&gt;係： &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="633px" file="ed10075.JPG" alt="ed10075.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided here are antigen-binding molecules that bind to HER2, comprising (i) a HER2-binding moiety, and (ii) a linker-payload moiety, wherein the linker-payload moiety is: &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="364px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where RP&lt;sub&gt;1&lt;/sub&gt; and RP&lt;sub&gt;2&lt;/sub&gt; are: &lt;br/&gt;&lt;img align="absmiddle" height="260px" width="641px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1371" publication-number="202619728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619728.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＲＯＰ２結合分子</chinese-title>  
        <english-title>TROP2-BINDING MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">A61K31/55</main-classification>  
        <further-classification edition="200601120260203B">A61K31/4192</further-classification>  
        <further-classification edition="201701120260203B">A61K47/68</further-classification>  
        <further-classification edition="200601120260203B">A61K39/395</further-classification>  
        <further-classification edition="200601120260203B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英格拉姆　皮爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGRAM, PIERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊德　柯克普　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYD-KIRKUP, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　安琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOI, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYERS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　方正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAU, KEVIN FONGCHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔榮周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YOUNGJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　拉賈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, RAJAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　思賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOO, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔卡爾　迪普第</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAKKAR, DIPTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達摩迪卡里　布沙恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHARMADHIKARI, BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供結合至TROP2之抗原結合分子，該等抗原結合分子包含(i) TROP2結合部分，及(ii)連接子-酬載部分，其中該連接子-酬載部分係： &lt;br/&gt;&lt;img align="absmiddle" height="112px" width="373px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中RP&lt;sub&gt;1&lt;/sub&gt;及RP&lt;sub&gt;2&lt;/sub&gt;係： &lt;br/&gt;&lt;img align="absmiddle" height="239px" width="634px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided here are antigen-binding molecules that bind to TROP2, comprising (i) a TROP2-binding moiety, and (ii) a linker-payload moiety, wherein the linker-payload moiety is: &lt;br/&gt;&lt;img align="absmiddle" height="129px" width="365px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where RP&lt;sub&gt;1&lt;/sub&gt; and RP&lt;sub&gt;2&lt;/sub&gt; are: &lt;br/&gt;&lt;img align="absmiddle" height="256px" width="631px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1372" publication-number="202620859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於３Ｄ記憶體之字線接點</chinese-title>  
        <english-title>WORD LINE CONTACT FOR 3D MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C8/14</main-classification>  
        <further-classification edition="202301120260223B">H10B20/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202601120260223B">H10W10/10</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜昌錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHANG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北島知彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了記憶體裝置，該等記憶體裝置具有陣列區域和鄰接陣列區域的接觸區域。陣列區域包含單元電晶體和單元電容器。接觸區域包含在第一方向上延伸的複數個字線接點和在第二方向上延伸的第二複數個字線接點。記憶體堆疊包括交替佈置成複數個堆疊對之複數個導體層及對應的複數個介電層。描述了用於形成記憶體裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are memory devices having an array region and a contact region adjacent the array region. The array region includes a cell transistor and a cell capacitor. The contact region includes a plurality of word line contacts extending in a first direction and a second plurality of word line contacts extending in a second direction. The memory stack comprises a plurality of conductor layers and a corresponding plurality of dielectric layers alternatingly arranged in a plurality of stacked pairs. Methods of forming a memory device are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">90:記憶體裝置</p>  
        <p type="p">92:字線接點</p>  
        <p type="p">94:字線接點</p>  
        <p type="p">S1:頂部</p>  
        <p type="p">S2:底部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1373" publication-number="202621374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="200601120260223B">B01J4/00</further-classification>  
        <further-classification edition="200601120260223B">G05D7/06</further-classification>  
        <further-classification edition="200601120260223B">G05D16/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田原開悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAHARA, KAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀田英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORITA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明藉由進行以下步驟而對基板之表面進行蝕刻：(a)於設置於蝕刻氣體之供給配管之貯存槽內或上述供給配管之貯存區間內填充上述蝕刻氣體並進行升壓；及(b)將在上述貯存槽或上述貯存區間內經升壓之上述蝕刻氣體，自基板之外緣向面內，以沿上述基板之面之方式供給至上述基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">243a、243b、247a、247b:閥</p>  
        <p type="p">A、B、C、D:步驟</p>  
        <p type="p">O:閥打開之狀態</p>  
        <p type="p">S:閥關閉之狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1374" publication-number="202621072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>執行無設備接收增益測量的方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR PERFORMING EQUIPMENT-FREE RECEIVE GAIN MEASUREMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260202B">H04B17/318</main-classification>  
        <further-classification edition="201501120260202B">H04B17/14</further-classification>  
        <further-classification edition="201501120260202B">H04B17/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝育霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊世安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHIH-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝斯克仁　納拉亞南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASKARAN, NARAYANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線通信裝置包括一發射（TX）鏈、一回授路徑、一接收（RX）鏈、一功率檢測電路以及一處理電路。該TX鏈根據數位TX輸入生成TX訊號。該回授路徑耦合在該TX鏈的輸出節點和該RX鏈的輸入節點之間，並回授從該TX鏈生成的TX訊號以輸出RX訊號至該RX鏈。該RX鏈從該回授路徑接收該RX訊號，並根據該RX訊號生成數位RX輸出。該功率檢測電路在該RX鏈的輸入節點上對該RX訊號執行功率檢測以生成功率檢測輸出。該處理電路根據至少該功率檢測輸出和該數位RX輸出測量該無線通信裝置的RX增益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless communication device includes a transmit (TX) chain, a loopback path, a receive (RX) chain, a power detector circuit, and a processing circuit. The TX chain generates a TX signal according to a digital TX input. The loopback path is coupled between an output node of the TX chain and an input node of the RX chain, and loops back the TX signal generated from the TX chain to output an RX signal to the RX chain. The RX chain receives the RX signal from the loopback path, and generates a digital RX output according to the RX signal. The power detector circuit performs power detection upon the RX signal at the input node of the RX chain to generate a power detection output. The processing circuit measures an RX gain of the wireless communication device according to at least the power detection output and the digital RX output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:無線通信裝置</p>  
        <p type="p">101:天線</p>  
        <p type="p">102:處理電路</p>  
        <p type="p">104:TX鏈</p>  
        <p type="p">106:RX鏈</p>  
        <p type="p">108:回授路徑</p>  
        <p type="p">110:功率檢測電路</p>  
        <p type="p">112:前端(FE)晶片</p>  
        <p type="p">114:中頻(IF)晶片</p>  
        <p type="p">116:數位類比轉換器(DAC)</p>  
        <p type="p">118:低噪聲放大器(LNA)</p>  
        <p type="p">120:類比數位轉換器(ADC)</p>  
        <p type="p">122:存儲裝置</p>  
        <p type="p">124:處理器</p>  
        <p type="p">PROG:程序代碼</p>  
        <p type="p">N1:輸出節點</p>  
        <p type="p">N2:輸入節點</p>  
        <p type="p">S_TX:TX訊號</p>  
        <p type="p">S_RX:RX訊號</p>  
        <p type="p">PD_OUT:功率檢測輸出</p>  
        <p type="p">D_TX:數位TX輸入</p>  
        <p type="p">D_RX:數位RX輸出</p>  
        <p type="p">N3:矽凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1375" publication-number="202620388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260211B">G01K7/02</main-classification>  
        <further-classification edition="202301120260211B">H10N10/80</further-classification>  
        <further-classification edition="200601120260211B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上陽子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, YOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木一聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檢測系統1具備藉由溫度差而產生電動勢之熱電轉換元件2、及處理裝置6。處理裝置6執行：基準值獲取步驟(S1)，其獲取熱電轉換元件2中產生之電動勢之基準值；及計算步驟(S3)，其計算熱電轉換元件2中產生之電動勢之實際測量值相對於所獲取之基準值的比率Rn。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4,S5,S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1376" publication-number="202620300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筒狀體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">F15B15/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＯＬＡＲＩＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLARIS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島明寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部格生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, ITARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂下瞳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKASHITA, HITOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流體壓致動器用的筒狀體（11），具備圓筒狀的彈性體（11a）、及呈同心圓狀地配置於彈性體（11a）的內部的多個纖維束（11b），且構成為當因流體壓而在徑向膨脹時在軸向收縮。筒狀體（11）的特徵在於，相鄰的纖維束（11b）之間的彈性體（11a）的寬度為0.5 mm以上且1.0 mm以下，且多個纖維束（11b）的周向的間距為1.0 mm以上且1.5 mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:流體壓致動器</p>  
        <p type="p">10:致動器本體</p>  
        <p type="p">11:筒狀體</p>  
        <p type="p">11a:彈性體</p>  
        <p type="p">11b:纖維束</p>  
        <p type="p">11c、11d:開口</p>  
        <p type="p">12、13:密封體</p>  
        <p type="p">20:流體供給‧排出裝置</p>  
        <p type="p">21:加壓流體供給部</p>  
        <p type="p">22:排出閥</p>  
        <p type="p">23:供給管</p>  
        <p type="p">24:排出管</p>  
        <p type="p">O:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1377" publication-number="202621427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓處理裝置</chinese-title>  
        <english-title>WAFER PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="200601120260223B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EO TECHNICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴柾勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴成大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SEONG DAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金奇洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KI SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種根據例示性實施例的晶圓處理裝置被構成為對彼此不同尺寸的晶圓選擇性地進行處理並搬運至匣盒，且包括：加工部，對所述晶圓進行加工；對準部，被構成為將供給至所述加工部的所述晶圓對準；翻轉部，被構成為將所述晶圓中預定尺寸的晶圓翻轉；移送部，被構成為在所述加工部、所述對準部及所述翻轉部之間移送所述晶圓，所述移送部包括與所述晶圓接觸的末端執行器，且所述末端執行器可以可裝卸的方式安裝於所述移送部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓處理裝置</p>  
        <p type="p">2:匣盒</p>  
        <p type="p">4:移送部</p>  
        <p type="p">5:翻轉部</p>  
        <p type="p">6:對準部</p>  
        <p type="p">7:加工部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1378" publication-number="202621458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦程式、資訊處理方法及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/00</main-classification>  
        <further-classification edition="200601120260223B">G05B19/418</further-classification>  
        <further-classification edition="201901120260223B">G06N20/00</further-classification>  
        <further-classification edition="202001120260223B">G06F30/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可期待支援與基板處理裝置之控制相關之使用者之操作的電腦程式、資訊處理方法及資訊處理裝置。 &lt;br/&gt;本實施方式之電腦程式使電腦執行如下處理：獲取包含基板處理相關之複數個資訊之基板處理資料，基於所獲取之上述基板處理資料，推定上述複數個資訊之關係，輸出所推定之上述關係，基於所輸出之上述關係，受理對上述複數個資訊中之一個或複數個資訊之選擇，產生對所受理之上述資訊之變動進行修正之修正模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊處理裝置(電腦)</p>  
        <p type="p">3:基板處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1379" publication-number="202620106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成形用聚醯胺薄膜及積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C08J5/22</main-classification>  
        <further-classification edition="200601120260205B">B29C55/12</further-classification>  
        <further-classification edition="201901120260205B">B32B7/028</further-classification>  
        <further-classification edition="200601120260205B">B32B27/34</further-classification>  
        <further-classification edition="200601120260205B">B32B38/14</further-classification>  
        <further-classification edition="200601120260205B">B29B11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永坂彩芽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAKA, AYAME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春田雅幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARUTA, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤考道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, TAKAMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種成形用聚醯胺薄膜，其即便為單一材料的薄膜，耐熱性、吸濕時的尺寸穩定性、分子鏈的定向性、熱收縮性質的各向同性仍優良，且成形性良好，能實現薄膜的減容(減容化)而對環境友善。該成形用聚醯胺薄膜係滿足下述要求：&lt;br/&gt; (1)構成成形用聚醯胺薄膜的聚醯胺樹脂之熔點為240℃以上&lt;br/&gt; (2)於160℃時的熱收縮率無論是在流動方向還是寬度方向均為3.0%以下&lt;br/&gt; (3)於160℃時的熱收縮率在流動方向與寬度方向的差為0.3%以下&lt;br/&gt; (4)以阿貝折射計求得的Nx：薄膜的流動方向之折射率與Ny：薄膜的寬度方向之折射率為1.55以上1.58以下&lt;br/&gt; (5)吸濕伸長率無論是在流動方向還是寬度方向均為1.5%以下&lt;br/&gt; (6)吸濕應變為0.8%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1380" publication-number="202620166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱聚矽氧組成物</chinese-title>  
        <english-title>THERMALLY CONDUCTIVE SILICONE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C09K5/08</main-classification>  
        <further-classification edition="200601120260203B">C08L83/06</further-classification>  
        <further-classification edition="200601120260203B">C09J183/14</further-classification>  
        <further-classification edition="200601120260203B">C08K3/14</further-classification>  
        <further-classification edition="200601120260203B">C08K3/22</further-classification>  
        <further-classification edition="200601120260203B">C08L101/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商陶氏有機矽公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW SILICONES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嫣然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭艷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導熱組成物，其包含：(A)具有平均式(I)且在25℃下具有20至1000 mPa•s之動態黏度的有機聚矽氧烷；(B1)含有烷氧基矽基之有機聚矽氧烷；(C)指定量之導熱填料混合物，其包含：(C1) 40至60 wt%之第一導熱填料，其具有15至25 μm之D50且選自碳化矽、氮化鋁、氮化硼、或其混合物；其中以總(C1)重量計，(C1)中之碳化矽粒子以大於40 wt%之濃度存在；(C2) 15至35 wt%之第二導熱填料，其具有0.3至5 μm之D50且選自氧化鋁、氮化鋁、鋁、或其混合物；及(C3) 14至30 wt%之具有0.1至0.3 µm之D50的氧化鋅粒子；除非另有說明，否則wt%以組成物重量計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermally conductive composition comprises: (A) an organopolysiloxane having an average formula (I) and a dynamic viscosity of 20 to 1000 mPa•s at 25°C; (B1) an organopolysiloxane containing an alkoxysilyl group; (C) a specified amount of a thermally conductive filler mixture comprising: (C1) 40 to 60 wt% of a first thermally conductive filler having a D50 of 15 to 25 µm and selected from silicon carbide, aluminum nitride, boron nitride, or mixtures thereof; where silicon carbide particles in (C1) are present at a concentration greater than 40 wt%, based on total (C1) weight; (C2) 15 to 35 wt% of a second thermally conductive filler having a D50 of 0.3 to 5 µm and selected from aluminum oxide, aluminum nitride, aluminum, or mixtures thereof; and (C3) 14 to 30 wt% of zinc oxide particles having a D50 of 0.1 to 0.3 µm; wt% based on composition weight unless otherwise stated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1381" publication-number="202620538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相位偏移光罩、及顯示裝置之製造方法</chinese-title>  
        <english-title>PHASE SHIFT MASK AND METHOD OF MANUFACTURING A DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260204B">G03F1/26</main-classification>  
        <further-classification edition="201201120260204B">G03F1/56</further-classification>  
        <further-classification edition="201201120260204B">G03F1/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓國ＨＯＹＡ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA ELECTRONICS KOREA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣豪雅光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA MICROELECTRONICS TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商重慶邁特光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONGQING MASTEK ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭周永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JUYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵囧洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, KYUNGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金桐煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠精細地轉印微細之孤立圖案，且能獲得生產穩定性之相位偏移光罩。 &lt;br/&gt;本發明之相位偏移光罩之特徵在於：其於透光性基板上具備形成有轉印用圖案之相位偏移膜，轉印用圖案包含由相位偏移膜形成且孤立配置於透光性基板上之孤立圖案、及設置於孤立圖案內之輔助開口部，孤立圖案具有對向之第1圖案邊緣及第2圖案邊緣，自第1圖案邊緣至輔助開口部之中心之第1距離D1、及自第2圖案邊緣至輔助開口部之中心之第2距離D2均為1.0 μm以上4.0 μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a phase shift mask capable of precisely transferring a fine isolated pattern and achieving production stablity. &lt;br/&gt;A phase shift mask comprises a transparent substrate and a phase shift film formed on the transparent substrate and having a transfer pattern. The transfer pattern includes an isolated pattern formed by the phase shift film and arranged in isolation on the transparent substrate and an auxiliary opening formed in the isolated pattern. The isolated pattern has a first pattern edge and a second pattern edge faced to each other. Each of a first distance D1 from the first pattern edge to a center of the auxiliary opening and a second distance D2 from the second pattern edge to the center of the auxiliary opening is not smaller than 1.0 μm and not greater than 4.0 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:透光性基板</p>  
        <p type="p">20:孤立圖案</p>  
        <p type="p">20A:第1圖案邊緣</p>  
        <p type="p">20B:第2圖案邊緣</p>  
        <p type="p">20C:第3圖案邊緣</p>  
        <p type="p">30:輔助開口部</p>  
        <p type="p">D1:第1距離</p>  
        <p type="p">D2:第2距離</p>  
        <p type="p">D3:第3距離</p>  
        <p type="p">Wh:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1382" publication-number="202620488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光連接組件及光連接組件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G02B6/36</main-classification>  
        <further-classification edition="200601120260207B">G02B6/30</further-classification>  
        <further-classification edition="200601120260207B">G02B6/122</further-classification>  
        <further-classification edition="200601120260207B">G02B6/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田英一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, EIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光連接組件及光連接組件之製造方法。 &lt;br/&gt;本發明之光連接組件具備：排列變換零件，其於第一端面中沿第一方向排列複數個光波導，於第二端面中由沿第一方向排列之兩個以上之光波導形成光波導陣列，且光波導陣列於第二方向上配置成N段；及光連接零件，其具有分別包含兩個以上之光纖及保持零件之兩個以上之光纖陣列，且兩個以上之光纖陣列於第二方向上配置成N段，上述兩個以上之光纖分別連接於兩個以上之光波導，上述保持零件將兩個以上之光纖沿第一方向排列；且第n段光纖陣列中所包含之兩個以上之光纖之中心軸之各者相對於對應之第n－1段光纖陣列中所包含之兩個以上之光纖之中心軸之各者在第一方向上偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光連接組件</p>  
        <p type="p">2:連接對象零件</p>  
        <p type="p">3:主面</p>  
        <p type="p">5:光輸入輸出部</p>  
        <p type="p">10:排列變換零件</p>  
        <p type="p">11:第一端面</p>  
        <p type="p">12:第二端面</p>  
        <p type="p">15:光波導</p>  
        <p type="p">15a:第一端</p>  
        <p type="p">15b:第二端</p>  
        <p type="p">20:光連接零件</p>  
        <p type="p">20a:第一端</p>  
        <p type="p">20b:第二端</p>  
        <p type="p">25A:光纖陣列</p>  
        <p type="p">X:X方向(第一方向)</p>  
        <p type="p">Y:Y方向(第二方向)</p>  
        <p type="p">Z:Z方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1383" publication-number="202621208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乾燥裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">H05K3/22</main-classification>  
        <further-classification edition="200601120260207B">F26B3/30</further-classification>  
        <further-classification edition="200601120260207B">F26B13/10</further-classification>  
        <further-classification edition="200601120260207B">B05D3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小森公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMORI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHIMA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">乾燥裝置(11)具備：冷卻體(16)，包含接觸於基材(12)的背面之接觸部(18)；及近紅外線照射裝置(31)，將近紅外線照射在基材的表面。在基材的表面上賦與有糊料(13)。近紅外線照射裝置配置於可對接觸部照射近紅外線的位置。接觸部與基材的背面之接觸面積(α)為有效照射面積(β)以上，前述有效照射面積(β)是在基材的表面上近紅外線所照射的照射範圍之面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:乾燥裝置</p>  
        <p type="p">12:基材</p>  
        <p type="p">13:糊料</p>  
        <p type="p">15:乾燥部</p>  
        <p type="p">16:冷卻體</p>  
        <p type="p">18:接觸部</p>  
        <p type="p">22:第2張力保持構件</p>  
        <p type="p">25:輥子</p>  
        <p type="p">31:近紅外線照射裝置</p>  
        <p type="p">C:軸心</p>  
        <p type="p">IR:近紅外線</p>  
        <p type="p">L1,L2:假想線</p>  
        <p type="p">P1:接觸點</p>  
        <p type="p">P2:脫離點</p>  
        <p type="p">θ:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1384" publication-number="202621175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援多ＴＲＰ關聯ＩＤ之方法</chinese-title>  
        <english-title>METHODS FOR SUPPORTING ASSOCIATED IDS FOR MULTI TRPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/51</main-classification>  
        <further-classification edition="200901120260202B">H04W24/02</further-classification>  
        <further-classification edition="202201120260202B">H04L41/16</further-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭榮佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, YOUNG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰耶布　歐梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEYEB, OUMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華茲　迪倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATTS, DYLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾雷赫曼　哈西布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UR REHMAN, HASEEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種包括一處理器之WTRU。該處理器經配置以接收一相關聯ID及與該相關聯ID相關之一組次相關聯ID之一配置。該相關聯ID表示一網路條件。該組次相關聯ID中之每一者表示一功能性或一傳輸情景中之至少一者。該處理器進一步經配置以基於該配置而確定該相關聯ID之適用性。所確定之該適用性對應於基於該相關聯ID適用於該組次相關聯ID中之每一者之完全適用性。該適用性對應於基於該相關聯ID適用於該組次相關聯ID中之至少一者之部分適用性。該處理器進一步經配置以基於所確定之該適用性而應用該相關聯ID來執行該功能性或該傳輸情景中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A WTRU comprising a processor is provided. The processor is configured to receive a configuration of an associated ID and a set of sub-associated IDs related to the associated ID. The associated ID represents a network condition. Each of the set of sub-associated IDs represents at least one of a functionality or a transmission scenario. The processor is further configured to determine applicability of the associated ID based on the configuration. The determined applicability corresponds to full applicability based on the associated ID being applicable for each of the set of sub-associated IDs. The applicability corresponds to partial applicability based on the associated ID being applicable for at least one of the set of sub-associated IDs. The processor is further configured to apply the associated ID to perform at least one of the functionality or the transmission scenario based on the determined applicability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102a、102b、102c:無線傳輸/接收單元(WTRU)</p>  
        <p type="p">108:公用交換電話網路(PSTN)</p>  
        <p type="p">110:網際網路</p>  
        <p type="p">112:其他網路</p>  
        <p type="p">113:無線電存取網路(RAN)</p>  
        <p type="p">115:核心網路(CN)</p>  
        <p type="p">116:空中介面</p>  
        <p type="p">180a、180b、180c:gNB</p>  
        <p type="p">182a、182b:存取及行動性管理功能(AMF)</p>  
        <p type="p">183a、183b:對話管理功能(SMF)</p>  
        <p type="p">184a、184b:使用者平面功能(UPF)</p>  
        <p type="p">185a、185b:資料網路(DN)</p>  
        <p type="p">N2、N3、N4、N6、N11、Xn:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1385" publication-number="202620516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向膜的製造方法、液晶配向膜的缺陷修復方法、液晶裝置的製造方法及修復用光配向劑</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING LIQUID CRYSTAL ALIGNMENT FILM, METHOD FOR REPAIRING DEFECTS OF LIQUID CRYSTAL ALIGNMENT FILM, METHOD FOR MANUFACTURING LIQUID CRYSTAL DEVICE AND REPAIRING PHOTOALIGNMENT AGENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G02F1/13</main-classification>  
        <further-classification edition="200601120251103B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王道海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DAOHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植阪裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESAKA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種液晶配向膜的製造方法，其可簡便且精度良好地修復存在於液晶配向膜中的缺陷，可獲得顯示不良得到充分抑制的液晶裝置。藉由包括如下步驟的方法來製造液晶配向膜：膜形成步驟，在基板上塗布液晶配向劑而形成液晶配向膜；檢測步驟，對存在於液晶配向膜中的缺陷進行檢測；塗布步驟，在藉由檢測步驟檢測出缺陷的情況下，在液晶配向膜中包含缺陷的區域部分性地塗布修復用光配向劑；以及照射步驟，對包含修復用光配向劑的塗布部位的區域照射放射線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21、S22、S23、S24、S25:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1386" publication-number="202621261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及包含其的資料儲存系統</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/20</main-classification>  
        <further-classification edition="202301120260223B">H10B43/40</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="202601120260223B">H10W72/90</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞辰瑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, JINDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康范圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BUMKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成錫江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, SUKKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體裝置以及一種包括所述半導體裝置的資料儲存系統。半導體裝置包括：下部結構，具有記憶體單元陣列區域及位於記憶體單元陣列區域外部的外周邊區域；以及上部結構，位於下部結構上。上部結構包括：接墊，包括設置於外周邊區域上的第一下部導電圖案以及位於第一下部導電圖案上的上部導電圖案；以及電感器部分，自上部導電圖案延伸且與記憶體單元陣列區域交疊，且在較第一下部導電圖案更遠離下部結構的水平高度處具有螺旋線圈形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and a data storage system including the same are provided. The semiconductor device includes: a lower structure having a memory cell array area and an outer peripheral area outside the memory cell array area; and an upper structure on the lower structure. The upper structure includes: a pad including a first lower conductive pattern provided on the outer peripheral area and an upper conductive pattern on the first lower conductive pattern; and an inductor portion extending from the upper conductive pattern and overlapping the memory cell array area, and having a spiral coil shape at a level farther from the lower structure than the first lower conductive pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">190:金屬間絕緣層</p>  
        <p type="p">193a:通孔導電層</p>  
        <p type="p">193b:通孔障壁層</p>  
        <p type="p">194a:導通孔/源極導通孔</p>  
        <p type="p">194b:導通孔/第一導通孔</p>  
        <p type="p">203a:第一下部導電層</p>  
        <p type="p">203b:第二下部導電層</p>  
        <p type="p">204a:下部導電圖案/第一下部導電圖案</p>  
        <p type="p">204a':部分</p>  
        <p type="p">204b:下部導電圖案/第二下部導電圖案</p>  
        <p type="p">204b1:第一連接區</p>  
        <p type="p">204c:下部導電圖案/第三下部導電圖案</p>  
        <p type="p">204d:下部導電圖案/第四下部導電圖案</p>  
        <p type="p">209a:第一下部絕緣層</p>  
        <p type="p">209b:第二下部絕緣層</p>  
        <p type="p">210:下部絕緣結構</p>  
        <p type="p">210a:開口/第一開口</p>  
        <p type="p">210b:開口/第二開口</p>  
        <p type="p">214a:第一上部導電層</p>  
        <p type="p">214b:第二上部導電層</p>  
        <p type="p">215:電感器圖案/上部導電圖案</p>  
        <p type="p">215a:第二部分</p>  
        <p type="p">215b:第一部分/連接部分</p>  
        <p type="p">215c:第一部分/電感器部分</p>  
        <p type="p">215d:第三部分</p>  
        <p type="p">221:第一上部絕緣層</p>  
        <p type="p">224:第二上部絕緣層</p>  
        <p type="p">227:上部絕緣結構</p>  
        <p type="p">227a:接墊開口</p>  
        <p type="p">B:區</p>  
        <p type="p">PAD:接墊</p>  
        <p type="p">PADa:輸入/輸出接墊/電源接墊/第一接墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1387" publication-number="202620552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曝光裝置輻射脈衝強度調變</chinese-title>  
        <english-title>EXPOSURE APPARATUS RADIATION PULSE INTENSITY MODULATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G03F7/20</main-classification>  
        <further-classification edition="202201120260209B">G06V10/60</further-classification>  
        <further-classification edition="202201120260209B">G06V10/40</further-classification>  
        <further-classification edition="201801120260209B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉克　桑德爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOK, SANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑布里西奧　荷西　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMBRICIO, JOSE LUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬林　費爾南德斯　恩里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARIN FERNANDEZ, ENRIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種改良一曝光裝置中之對比度的方法。該曝光裝置自一輻射源接收複數個輻射脈衝，該方法包含根據一時間剖面調變該等輻射脈衝之一強度，其中該時間剖面與該曝光裝置之一投影系統之一光學轉印函數相關聯。該調變可設定該等脈衝之該強度以最大化一圖案化器件之一圖案之至少一個關鍵特徵的對比度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of improving contrast in an exposure apparatus is disclosed. The exposure apparatus receives a plurality of radiation pulses from a radiation source, the method comprises modulating an intensity of the radiation pulses according to a time profile, wherein the time profile is associated with an optical transfer function of a projection system of the exposure apparatus. The modulation may set the intensity of the pulses to maximize contrast of at least one critical feature of a pattern of a patterning device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">PI1:第一投影影像/影像</p>  
        <p type="p">PI2:第二投影影像/影像</p>  
        <p type="p">PI3:第三投影影像/影像</p>  
        <p type="p">PIN:所要標稱投影影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1388" publication-number="202620663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用基於大型語言模型之資產分析進行自然語言查詢處理</chinese-title>  
        <english-title>NATURAL LANGUAGE QUERY PROCESSING USING LARGE LANGUAGE MODEL-BASED ASSET ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">G06F16/242</main-classification>  
        <further-classification edition="201901120260202B">G06F16/245</further-classification>  
        <further-classification edition="200601120260202B">G06F3/046</further-classification>  
        <further-classification edition="202301120260202B">G06N5/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞伯拉罕　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABRAHAM, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵鈺涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, YUHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張芷博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿里　和山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALY, HOSAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例處理使用者查詢。使用一大型語言模型(LLM)基於由一使用者提供之一使用者查詢而產生一第一結構化查詢語言(SQL)敍述。基於該第一SQL敍述而提取複數個實體，包括欄、篩選欄及分類篩選器。使用該等所提取實體對複數個資料庫之一索引執行一語意搜尋以判定該複數個資料庫中之各資料庫之一置信度得分。基於該置信度得分而選擇一資料庫並提取該選定資料庫之一結構描述。藉由該LLM基於該使用者查詢及該結構描述而產生一第二SQL敍述。在該選定資料庫上執行該第二SQL敍述以產生查詢結果，將該等查詢結果呈現至該使用者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A present invention embodiment processes user queries. Using a large language model (LLM), a first Structured Query Language (SQL) statement is generated based on a user query provided by a user. A plurality of entities are extracted, based on the first SQL statement, including columns, filter columns, and categorical filters. A semantic search is performed on an index of a plurality of databases using the extracted entities to determine a confidence score for each database of the plurality of databases. A database is selected based on the confidence score and a schema of the selected database is extracted. A second SQL statement is generated by the LLM based on the user query and the schema. The second SQL statement is executed on the selected database to generate query results that are presented to the user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:操作</p>  
        <p type="p">420:操作</p>  
        <p type="p">430:操作</p>  
        <p type="p">440:操作</p>  
        <p type="p">450:操作</p>  
        <p type="p">460:操作</p>  
        <p type="p">470:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1389" publication-number="202620446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光開關、測距裝置、及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01R19/255</main-classification>  
        <further-classification edition="202201120260211B">G01B9/02</further-classification>  
        <further-classification edition="202201120260211B">G01B9/02001</further-classification>  
        <further-classification edition="200601120260211B">G01C3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野浩至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安陽太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASU, YOHTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種藉由適當控制施加至加熱器之電壓波形而縮短波導之溫度切換速度、提高光開關之切換性能之技術。 &lt;br/&gt;本技術提供光開關等，該光開關係基於熱光學效應使光之相位變化者，且具備：加熱器，其使折射率因上述熱光學效應而變化之區域之溫度變化；及波形產生部，其產生對施加至上述加熱器之電壓之時間變化進行控制之電壓波形；且上述波形產生部於盡可能短之時間內使電壓自初始電壓朝向極限電壓(最大電壓或最小電壓)變化，隨後，使電壓自上述極限電壓朝向目標電壓變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:初始電力</p>  
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:目標電力</p>  
        <p type="p">P&lt;sub&gt;Max&lt;/sub&gt;:極限電力(最大電力)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1390" publication-number="202620100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊層體</chinese-title>  
        <english-title>LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C08G73/16</main-classification>  
        <further-classification edition="200601120260205B">C09D5/25</further-classification>  
        <further-classification edition="200601120260205B">B32B27/34</further-classification>  
        <further-classification edition="201901120260205B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安孫子洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABIKO, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤利樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, RIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米浜伸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEHAMA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種疊層體，在經具有氧基矽基之化合物予以表面改質之基材上具有聚醯亞胺樹脂層，該具有氧基矽基之化合物為選自於由具有琥珀酸酐結構之化合物及具有1級胺基之化合物構成之群組中之至少1種，構成該聚醯亞胺樹脂層之聚醯亞胺樹脂具有脂環族結構，該聚醯亞胺樹脂之玻璃轉移溫度為300℃以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laminate comprising a polyimide resin layer on a substrate the surface of which has been modified with a compound having an oxysilyl group, wherein said compound having an oxysilyl group is at least one selected from the group consisting of a compound having an acid anhydride structure and a compound having a primary amino group, and wherein the polyimide resin constituting the polyimide resin layer has an alicyclic structure and has a glass transition temperature of 300 °C or higher.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1391" publication-number="202621448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓支撐體及晶圓支撐體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/72</main-classification>  
        <further-classification edition="200601120260223B">C04B35/10</further-classification>  
        <further-classification edition="200601120260223B">C04B35/645</further-classification>  
        <further-classification edition="200601120260223B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本磁性技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERROTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八代美希夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASHIRO, MIKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛藤俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETO, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUNO, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種可實現所期望之吸附力的新穎晶圓支撐體。 &lt;br/&gt;　　[解決手段] 晶圓支撐體(10)具備由陶瓷燒結體構成的基材(16)與至少一部分內包於基材的導電構件(18)。基材(16)含有氧化鋁96質量%以上，含有鋯以氧化鋯換算為0.47～1.83質量%，含有釔或鐿以氧化釔或氧化鐿換算為0～0.48質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓支撐體</p>  
        <p type="p">12:腔室</p>  
        <p type="p">14:上部電極</p>  
        <p type="p">16:基材</p>  
        <p type="p">16a:搭載面</p>  
        <p type="p">18:導電構件</p>  
        <p type="p">20:氣體供給路</p>  
        <p type="p">22:接著層</p>  
        <p type="p">24:金屬板</p>  
        <p type="p">26:流路</p>  
        <p type="p">100:蝕刻裝置</p>  
        <p type="p">G:氣體</p>  
        <p type="p">H:水</p>  
        <p type="p">P:電漿</p>  
        <p type="p">V:電壓</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1392" publication-number="202621346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合基板及其製造方法和彈性表面波元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260211B">H10N30/07</main-classification>  
        <further-classification edition="202301120260211B">H10N30/50</further-classification>  
        <further-classification edition="200601120260211B">C23C14/34</further-classification>  
        <further-classification edition="200601120260211B">C23C14/08</further-classification>  
        <further-classification edition="200601120260211B">C23C14/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高垣達朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGAKI, TATSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西谷隆志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHITANI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本岳士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩下昌正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASHITA, SHOSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供抑制電力損失且可簡便低價製造的複合基板。根據本發明實施形態的複合基板，依序具有壓電層、第一中間層、第二中間層與支撐基板。第二中間層的支撐基板側的電阻率R2&lt;sub&gt;S&lt;/sub&gt;為1000（Ωcm）以上。根據本發明實施形態的複合基板的製造方法，依序包含：在壓電基板的一側依序形成第一中間層及第二中間層；將第二中間層平滑化處理；將第二中間層與支撐基板接合；以及將壓電基板薄膜化而成為壓電層；第一中間層是藉由氧存在下中的矽的反應性濺鍍而形成；第二中間層是藉由既定量的氧存在下中的矽的反應性濺鍍而形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:壓電層</p>  
        <p type="p">20:第一中間層</p>  
        <p type="p">30:第二中間層</p>  
        <p type="p">40:支撐基板</p>  
        <p type="p">100:複合基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1393" publication-number="202619996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有改良之塗層內分層抗性之含基板及多層薄膜塗層的製品</chinese-title>  
        <english-title>ARTICLE WITH SUBSTRATE AND MULTILAYER THIN-FILM COATING WITH IMPROVED RESISTANCE TO INTRA-COATING DELAMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C03C17/34</main-classification>  
        <further-classification edition="200601120260205B">C03C17/22</further-classification>  
        <further-classification edition="200601120260205B">C03C17/245</further-classification>  
        <further-classification edition="200601120260205B">B32B5/14</further-classification>  
        <further-classification edition="201901120260205B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費海　艾伯特喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAHEY, ALBERT JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE-HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯西克威廉斯　卡洛安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSIK WILLIAMS, CARLO ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鍾基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG-KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敏納卡辛桑德倫　巴拉牡恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEENAKSHI SUNDARAM, BALAMURUGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴洙昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SOOHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏拉馬尼安　阿南莎納拉耶南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBRAMANIAN, ANANTHANARAYANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹成君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, SUNG-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製品，其包括具有主表面之基板及安置於該主表面上方之多層薄膜塗層。該多層薄膜塗層包括至少一個雙層。各雙層包括高折射率材料之高折射率層，以及在該高折射率層上的低折射率材料之低折射率層。該低折射率材料所展現之折射率比該高折射率材料所展現之折射率低。該製品在損傷軌跡接觸石油膏後，多層薄膜塗層內未出現在50×放大率下可明顯觀測到的自損傷軌跡延伸出來之分層現象。一種製造該製品之方法，其包括採用氣體壓力大於或等於2.0毫托（約0.27 Pa）的低折射率濺鍍步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An article including a substrate with a primary surface and a multilayer thin-film coating disposed over the primary surface. The multilayer thin-film coating includes at least one bilayer. Each bilayer includes a high-index layer of a high-index material and a low-index layer of a low-index material on the high-index layer. The low-index material exhibits an index of refraction that is lower than an index of refraction that the high-index material exhibits. The article exhibits no delamination within the multilayer thin-film coating extending from a damage track visibly observable under 50X magnification after contacting the damage track with petroleum jelly. A method of making the article including a low-index sputtering step that employes a gas pressure that is greater than or equal to 2.0 mTorr (~0.27 Pa).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:製品</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:多層薄膜塗層</p>  
        <p type="p">16:第一主表面</p>  
        <p type="p">22:雙層</p>  
        <p type="p">24:高折射率層</p>  
        <p type="p">26:低折射率層</p>  
        <p type="p">28:低折射率厚度</p>  
        <p type="p">30:高折射率厚度</p>  
        <p type="p">32:初始低折射率層</p>  
        <p type="p">34:總厚度</p>  
        <p type="p">36:向外表面</p>  
        <p type="p">38:外部環境</p>  
        <p type="p">40:其他功能層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1394" publication-number="202619746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療代謝和肝臟病症的醫藥組合物和方法</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITIONS AND METHODS FOR THE TREATMENT OF METABOLIC AND LIVER DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K38/30</main-classification>  
        <further-classification edition="200601120260202B">C07K14/605</further-classification>  
        <further-classification edition="200601120260202B">C07K14/65</further-classification>  
        <further-classification edition="201701120260202B">A61K47/64</further-classification>  
        <further-classification edition="200601120260202B">A61P1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維京治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIKING THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗安　布瑞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴克　傑佛瑞　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARKER, GEOFFREY E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴恩斯　莫琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARNES, MAUREEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞厄茲　開達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGIZ, KADER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡薩雷斯　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONZALEZ, JAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃努古爾蒂　布拉瑪切李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENUGURTHI, BRAHMACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　雪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHIRLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史提文斯　埃爾蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEVENS, ERLAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示小分子GLP-1促效劑及GIP/GLP-1雙重受體促效劑之口服組合物及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are oral compositions of small molecule GLP-1 agonists and GIP/GLP-1 dual receptor agonists and uses thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1395" publication-number="202621340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括低折射率材料層之裝置及裝置製造方法</chinese-title>  
        <english-title>DEVICES INCLUDING LOW-INDEX MATERIAL LAYERS AND METHODS FOR FABRICATING THE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260214B">H10K50/85</main-classification>  
        <further-classification edition="202301120260214B">H10K59/80</further-classification>  
        <further-classification edition="201101120260214B">B82Y20/00</further-classification>  
        <further-classification edition="202501120260214B">H10H20/855</further-classification>  
        <further-classification edition="202501120260214B">H10H20/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫克森寇夫　狄米崔費拉迪斯拉佛維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKSENKOV, DMITRI VLADISLAVOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種裝置，其包括一基板、一低折射率材料層（LIML）及一發光層。該LIML接近該基板。該LIML包括複數個氣體填充空隙。該發光層接近該LIML。該發光層包括發光發射體粒子。該LIML可包括一非潤濕表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a substrate, a low-index material layer (LIML), and a luminescent layer. The LIML is proximate the substrate. The LIML includes a plurality of gas filled voids. The luminescent layer is proximate the LIML. The luminescent layer includes luminescent emitter particles. The LIML may include a non-wetting surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">112,122,132:第一表面</p>  
        <p type="p">114,134:第二表面</p>  
        <p type="p">120:LIML</p>  
        <p type="p">124:第二表面，非潤濕表面</p>  
        <p type="p">130:發光層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1396" publication-number="202621284"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光半導體元件及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification>  
        <further-classification edition="202501120260223B">H10H20/811</further-classification>  
        <further-classification edition="202501120260223B">H10H20/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商同和電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門脇嘉孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOWAKI, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種改善了效率的光半導體元件。一種光半導體元件，包括：半導體積層體，具有至少一個積層有活性層及隧道結層的半導體積層結構；以及第一n型電極及第二n型電極，夾持半導體積層體，隧道結層包含與InAs進行晶格匹配的p型InAlAsSbP層及n型InAlAsSbP層，發光中心波長為2000 nm～5000 nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光半導體元件</p>  
        <p type="p">105:成長用基板</p>  
        <p type="p">120:半導體積層體</p>  
        <p type="p">121:第一n型接觸層</p>  
        <p type="p">122:第一n型窗層</p>  
        <p type="p">123:間隔物層</p>  
        <p type="p">124:活性層</p>  
        <p type="p">124b:活性層124、活性層224的障壁層/障壁層</p>  
        <p type="p">124w:活性層124、活性層224的阱層/阱層</p>  
        <p type="p">125:p型電子阻擋層</p>  
        <p type="p">126:p型窗層</p>  
        <p type="p">127:隧道結層</p>  
        <p type="p">128:第二n型窗層</p>  
        <p type="p">129:第二n型接觸層</p>  
        <p type="p">191:第一n型電極</p>  
        <p type="p">195:第二n型電極</p>  
        <p type="p">1271:p型隧道結層</p>  
        <p type="p">1272:n型隧道結層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1397" publication-number="202621547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W80/00</main-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王閔智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MINGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個範例中，一種電子裝置包括包含接觸襯墊的電子組件。第一介電結構可安置在所述電子組件上方，且可界定使所述接觸襯墊從所述第一介電結構暴露的開口。導電結構可安置在所述第一介電結構上方且耦合到所述接觸襯墊。第二介電結構可安置在所述導電結構上方且耦合到所述接觸襯墊。所述第二介電結構可包括外部側。所述導電結構的突出襯墊可包含從所述第二介電結構的所述外部側突出的貼合形狀側壁。本文還公開其它範例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device comprises an electronic component including a contact pad. A first dielectric structure can be disposed over the electronic component and can define an opening that exposes the contact pad from the first dielectric structure. A conductive structure can be disposed over the first dielectric structure and coupled to the contact pad. A second dielectric structure can be disposed over the conductive structure and coupled to the contact pad. The second dielectric structure can comprise an outer side. A protruding pad of the conductive structure can include a contoured sidewall protruding from the outer side of the second dielectric structure. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:電子組件</p>  
        <p type="p">111:第一側</p>  
        <p type="p">112:第二側</p>  
        <p type="p">113:接觸襯墊</p>  
        <p type="p">120:第一介電結構</p>  
        <p type="p">130:導電結構</p>  
        <p type="p">130a:向內端子</p>  
        <p type="p">130b:向外端子</p>  
        <p type="p">135:突出襯墊</p>  
        <p type="p">136:側壁</p>  
        <p type="p">140:第二介電結構</p>  
        <p type="p">150:外部互連件</p>  
        <p type="p">160:囊封物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1398" publication-number="202621485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/40</main-classification>  
        <further-classification edition="200601120260223B">H05K3/46</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="200601120260223B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳尙炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔仁秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, IN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊基業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KI YEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個範例中，一種電子裝置包含基板和安置在所述基板上方的第一介電質。所述第一介電質界定第一跡線開口。第一導電圖案可安置在所述跡線開口中且從所述第一介電質的上部側凹陷。所述第一導電圖案包含第一跡線。第二導電圖案可安置在所述第一介電質的所述上部側上方。所述第二導電圖案可包含在所述第一跡線上方交錯的第二跡線。第二介電質可安置在所述第二導電圖案上方且延伸到所述跡線開口中的所述第一跡線。本文中還公開其它範例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device includes a substrate and a first dielectric disposed over the substrate. The first dielectric defining first trace openings. A first conductive pattern can be disposed in the trace openings and recessed from an upper side of the first dielectric. The first conductive pattern includes first traces. A second conductive pattern can be disposed over the upper side of the first dielectric. The second conductive pattern can include second traces staggered over the first traces. A second dielectric can be disposed over the second conductive pattern and extending to the first traces in the trace openings. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:重佈線層(RDL)基板</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">110:電子組件</p>  
        <p type="p">111:組件互連件</p>  
        <p type="p">120:介電結構</p>  
        <p type="p">121:第一介電質</p>  
        <p type="p">122:第二介電質</p>  
        <p type="p">123:第三介電質</p>  
        <p type="p">124:第四介電質</p>  
        <p type="p">125:第五介電質</p>  
        <p type="p">130:導電結構</p>  
        <p type="p">130a:向內端子/基板向內端子</p>  
        <p type="p">130b:向外端子</p>  
        <p type="p">131:第一導電圖案/導電圖案</p>  
        <p type="p">132:第二導電圖案</p>  
        <p type="p">133:第三導電圖案</p>  
        <p type="p">134:第四導電圖案</p>  
        <p type="p">135:第五導電圖案</p>  
        <p type="p">136:第六導電圖案</p>  
        <p type="p">140:互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1399" publication-number="202619805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓的製造方法、加熱蒸散用的表面處理組成物、表面處理組成物的使用方法、蒸氣組成物及蒸氣組成物的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING WAFER, SURFACE-TREATING COMPOSITION FOR THERMAL VOLATILIZATION, METHOD FOR USING SURFACE-TREATING COMPOSITION, VAPOR COMPOSITION, AND METHOD FOR PRODUCING VAPOR COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">B08B3/04</main-classification>  
        <further-classification edition="200601120260211B">B08B3/10</further-classification>  
        <further-classification edition="200601120260211B">B08B3/08</further-classification>  
        <further-classification edition="200601120260211B">B08B11/00</further-classification>  
        <further-classification edition="200601120260211B">B01D69/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公文創一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMON, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤大志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, DAISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉄村美月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TETSUMURA, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之晶圓的製造方法包含：準備於表面具有凹凸圖案之晶圓的工序；對晶圓的表面供應清洗液來清洗的工序；以及對保持有清洗液的表面供應表面處理組成物的蒸氣，在表面上使蒸氣狀態變化成液體，將前述清洗液之至少一部分以前述液體置換，於表面之至少一部分形成撥水性保護膜的工序；其中表面處理組成物包含指定之矽化合物與1種或2種以上之非質子性溶媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for manufacturing wafer of the present invention includes: a process of preparing a wafer having a concave-convex pattern on its surface; a process of supplying a cleaning liquid to the surface of the wafer to clean it; and a process of supplying vapor of a surface-treating composition to the surface holding the cleaning liquid, converting the state of the vapor to a liquid, and replacing at least a portion of the cleaning liquid with the liquid, forming a water-repellent protective film on at least a portion of the surface; wherein the surface-treating composition contains a prescribed silicon compound and one or more aprotic solvents.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓</p>  
        <p type="p">2:凹凸圖案</p>  
        <p type="p">3:凸部</p>  
        <p type="p">4:凹部</p>  
        <p type="p">8:液體</p>  
        <p type="p">9:蒸氣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1400" publication-number="202619623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釣具、落水位置推測系統、及釣魚支援系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A01K89/015</main-classification>  
        <further-classification edition="200601120251231B">A01K97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠田周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUDA, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田紘貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武智邦生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKECHI, KUNIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新妻翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIITSUMA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大古瀨廣樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOGOSE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明高精度地推定被投擲之釣組之落水位置。 本發明之釣具包含：檢測部，其檢測釣組之投擲動作中之動作狀態；及計算部，其基於上述檢測部之檢測結果，推測被投擲之上述釣組之落水位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:釣具</p>  
        <p type="p">11:檢測部</p>  
        <p type="p">12:計算部</p>  
        <p type="p">13:顯示部</p>  
        <p type="p">101:釣竿</p>  
        <p type="p">102:釣具用捲線器</p>  
        <p type="p">103:釣線</p>  
        <p type="p">104:釣組</p>  
        <p type="p">121:捲筒</p>  
        <p type="p">131:連接器</p>  
        <p type="p">R1~R4:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1401" publication-number="202620361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沸騰促進部及熱導板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F28F3/04</main-classification>  
        <further-classification edition="202601120260223B">H10W40/73</further-classification>  
        <further-classification edition="202601120260223B">H10W40/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松野友暢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNO, TOMONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端秀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提昇沸騰促進效果之沸騰促進部及熱導板（vapor chamber）。 &lt;br/&gt;本發明之沸騰促進部（1）具備基底部（2）、及自基底部（2）立設之複數個鰭片（3）。鰭片（3）具有相對於基底部（2）垂直地延伸之本體部（32）、及在與基底部（2）之連接部相對於本體部（32）傾斜之傾斜部（31），且該鰭片（3）之表面整體為緞光加工面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:沸騰促進部</p>  
        <p type="p">2:基底部</p>  
        <p type="p">2A:基底部之一面</p>  
        <p type="p">2B:基底部之另一面</p>  
        <p type="p">2C:鰭片配置區域</p>  
        <p type="p">2D:緣部</p>  
        <p type="p">3:鰭片</p>  
        <p type="p">H:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1402" publication-number="202620254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單晶提拉設備</chinese-title>  
        <english-title>SINGLE CRYSTAL PULLING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C30B15/26</main-classification>  
        <further-classification edition="200601120260205B">C30B35/00</further-classification>  
        <further-classification edition="200601120260205B">C30B29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大原崇義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHARA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤塚雅紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKATSUKA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供具有優異單晶冷卻性能並且可觀察液面的單晶提拉設備。 &lt;br/&gt;[解決方案] 一種單晶提拉設備，係為採用提拉法的單晶提拉設備，具有：第一冷卻體，為筒狀，圍繞從坩堝內的熔液提拉的成長中的單晶的外周面而冷卻前述單晶；第二冷卻體，為倒圓錐筒狀，配置於前述第一冷卻體下方，圍繞前述成長中的單晶的前述外周面而冷卻前述單晶；以及拍攝設備，觀察前述熔液的液面，前述第二冷卻體的上端的內徑大於前述第一冷卻體的下端的外徑，從前述液面到前述拍攝設備形成直線狀的光路，前述光路通過前述第二冷卻體的下端與前述成長中的單晶的前述外周面之間的間隙、以及前述第二冷卻體的前述上端與前述第一冷卻體的前述下端之間的間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Subject] To provide a single crystal pulling apparatus that has excellent single crystal cooling performance and allows for observation of liquid surface. &lt;br/&gt;[Solution] A single crystal pulling apparatus uses the Czochralski method and includes: a cylindrical first cooling body that surrounds an outer peripheral surface of a single crystal being grown as it is pulled from a melt in a crucible and cools the single crystal; a second cooling body that has a shape of an inverted cone and is arranged below the first cooling body and surrounds the outer peripheral surface of the single crystal being grown and cools the single crystal; and an imaging device that observes a liquid surface of the melt. An inner diameter of an upper end of the second cooling body is larger than an outer diameter of a lower end of the first cooling body. A linear optical path is formed from the liquid surface to the imaging device through a gap between a lower end of the second cooling body and the outer peripheral surface of the single crystal being grown, and a gap between the upper end of the second cooling body and the lower end of the first cooling body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:單晶提拉設備</p>  
        <p type="p">2:單晶</p>  
        <p type="p">2a:頸部</p>  
        <p type="p">2b:肩部</p>  
        <p type="p">2c:直體部</p>  
        <p type="p">3:坩堝</p>  
        <p type="p">4:熔液</p>  
        <p type="p">4a:液面</p>  
        <p type="p">5:晶種</p>  
        <p type="p">6:晶種提拉設備</p>  
        <p type="p">6a:晶種夾持器</p>  
        <p type="p">6b:導線</p>  
        <p type="p">6c:捲繞設備</p>  
        <p type="p">7:控制設備</p>  
        <p type="p">8:主腔室</p>  
        <p type="p">8a:外周壁</p>  
        <p type="p">8b:頂壁</p>  
        <p type="p">8c:底壁</p>  
        <p type="p">9:提拉腔室</p>  
        <p type="p">9a:周壁</p>  
        <p type="p">9b:頂壁</p>  
        <p type="p">10:加熱器</p>  
        <p type="p">11:絕熱材料</p>  
        <p type="p">12:第一冷卻體</p>  
        <p type="p">13:第二冷卻體</p>  
        <p type="p">14:拍攝設備</p>  
        <p type="p">15:窗部</p>  
        <p type="p">16:熱遮蔽體</p>  
        <p type="p">16a:開口</p>  
        <p type="p">16b:底壁部</p>  
        <p type="p">16c:筒壁部</p>  
        <p type="p">16d:凸緣壁部</p>  
        <p type="p">A,B:內徑</p>  
        <p type="p">C:外徑</p>  
        <p type="p">D:距離</p>  
        <p type="p">E:長度</p>  
        <p type="p">G1,G2:間隙</p>  
        <p type="p">L:光路</p>  
        <p type="p">O:中心軸線</p>  
        <p type="p">S1:下側空間</p>  
        <p type="p">S2:上側空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1403" publication-number="202620925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於線的終點偵測</chinese-title>  
        <english-title>LINE-BASED END POINT DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/305</main-classification>  
        <further-classification edition="200601120260223B">H01J37/26</further-classification>  
        <further-classification edition="200601120260223B">G01B15/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普倫蒂斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRENTICE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種方法，用於製備一樣本，以供藉由一帶電粒子顯微鏡進行分析(例如，藉由提供一薄片)，該方法包括：從一樣本的一表面移除材料，以提供一新暴露表面；及判定該新暴露表面上的一關注區域(region of interest, ROI)。複數條線形成在該新暴露表面上，且從該樣本的一工作表面(不同於該新暴露表面)移除材料複數次。對該工作表面成像複數次，以至少擷取該複數條線，且基於在該複數條線中的二或更多條線之間的一相對空間特性來判定一終點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for preparing a sample for analysis by a charged particle microscope (for example by providing a lamella) include removing material from a surface of a sample to provide a newly exposed surface and determining a region of interest (ROI) on the newly exposed surface. A plurality of lines are formed on the newly exposed surface and material from a working surface of the sample, different from the newly exposed surface, is removed a plurality of times. The working surface is imaged a plurality of times to at least capture the plurality of lines and an endpoint is determined based on a relative spatial characteristic between two or more lines of the plurality of lines.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1404" publication-number="202620157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組合物、黏著片材及接合體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C09J133/08</main-classification>  
        <further-classification edition="200601120260204B">C08F2/50</further-classification>  
        <further-classification edition="200601120260204B">C08F2/08</further-classification>  
        <further-classification edition="201301120260204B">H01G11/62</further-classification>  
        <further-classification edition="200601120260204B">C09J9/02</further-classification>  
        <further-classification edition="200601120260204B">C09J11/04</further-classification>  
        <further-classification edition="201901120260204B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤峰花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, REIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小坂尚史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, NAOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野瑞穂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, MIZUHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種黏著劑組合物，其能夠實現接著所需之初始接著力，另一方面，由於施加電壓後之接著力極小，因此能夠實現較大之接著力下降率，具有優異之電氣剝離性能。 &lt;br/&gt;本發明之黏著劑組合物係包含聚合物及電解質者，上述電解質係該電解質之陽離子之還原物與上述聚合物之HSP距離為9 MPa&lt;sup&gt;0.5&lt;/sup&gt;以下且表面自由能為24 mJ/m&lt;sup&gt;2&lt;/sup&gt;～36 mJ/m&lt;sup&gt;2&lt;/sup&gt;者，由上述黏著劑組合物形成之黏著劑層之2分鐘後之接著力回復率未達60%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1':電氣剝離型黏著劑層</p>  
        <p type="p">5':導電性基材</p>  
        <p type="p">6:不鏽鋼板</p>  
        <p type="p">α:部位</p>  
        <p type="p">β:部位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1405" publication-number="202621164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與用於基於光的定位之蜂巢式定位協定相關聯的傳訊</chinese-title>  
        <english-title>SIGNALING ASSOCIATED WITH CELLULAR POSITIONING PROTOCOL FOR LIGHT-BASED POSITIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W64/00</main-classification>  
        <further-classification edition="201301120260202B">H04B10/80</further-classification>  
        <further-classification edition="201301120260202B">H04B10/116</further-classification>  
        <further-classification edition="201301120260202B">H04B10/114</further-classification>  
        <further-classification edition="202201120260202B">H04L67/52</further-classification>  
        <further-classification edition="200601120260202B">G01S5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古瑪迪　巴皮尼杜喬戴瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUMMADI, BAPINEEDU CHOWDARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾吉　史帝芬威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDGE, STEPHEN WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡達巴拉　拉維香卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADAMBALA, RAVI SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之態樣係關於與用於基於光的定位(light-based positioning, LBP)之蜂巢式定位協定相關聯的傳訊。在一態樣中，第一實體自第二實體接收對UE之位置資訊之請求，對位置資訊之該請求係使用用於4G、5G、或6G蜂巢式通訊中之至少一者的定位協定來定義並傳送。該第三實體傳輸該基於光的信號，且該第一實體獲得該基於光的信號之至少一個測量。該第一實體使用該定位協定基於該至少一個測量而將位置資訊傳輸至該第二實體。此類態樣提供各種技術優點，諸如經由LBP的蜂巢式通訊系統之使用者設備(user equipment, UE)的經改善位置估計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure are directed to signaling associated with cellular positioning protocol for light-based positioning (LBP). In an aspect, a first entity receives, from a second entity, a request for location information of the UE, the request for location information defined and transferred using a positioning protocol for at least one of 4G, 5G or 6G cellular communication. The third entity transmits the light-based signal, and the first entity obtains at least one measurement of the light-based signal. The first entity transmits location information based on the at least one measurement to the second entity using the positioning protocol. Such aspects provide various technical advantages, such as improved position estimation of user equipments (UEs) of cellular communications systems via LBP.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:通訊程序；程序</p>  
        <p type="p">710:步驟</p>  
        <p type="p">720:步驟</p>  
        <p type="p">730:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1406" publication-number="202621078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陣列設計方法和設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR ARRAY DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04L5/14</main-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification>  
        <further-classification edition="202301120260202B">H04W72/0446</further-classification>  
        <further-classification edition="200601120260202B">H04B7/06</further-classification>  
        <further-classification edition="200601120260202B">G01S7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任佳颖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, JIAYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　曉禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHIAUHE SHAWN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出陣列設計方法和設備，其中一種陣列設計方法包括：由設備的處理器根據一個或多個內核確定陣列，其中該陣列與資源分配相關聯，並且在至少一個內核中，元素與不可用資源單元相關聯；以及由該處理器基於與該資源分配相關聯的該陣列，執行多個信號的傳輸和接收中的至少一項。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for array design are provided. In one novel aspect, a method may involve an apparatus determining an array according to one or more kernels. The array may be associated with a resource allocation. In at least one kernel, elements may be associated with unavailable resource units. The method may also involve the apparatus performing at least one of a transmission and a reception of a plurality of signals based on the array associated with the resource allocation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:過程</p>  
        <p type="p">810-820:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1407" publication-number="202620122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜用樹脂膜及光學膜用樹脂膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08L33/10</main-classification>  
        <further-classification edition="200601120260203B">G02B1/04</further-classification>  
        <further-classification edition="200601120260203B">G02F1/13363</further-classification>  
        <further-classification edition="200601120260203B">C08J5/18</further-classification>  
        <further-classification edition="200601120260203B">C08K7/02</further-classification>  
        <further-classification edition="201901120260203B">B29C48/51</further-classification>  
        <further-classification edition="200601120260203B">B32B27/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新日本理化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森一紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村理穂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, RIHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎祥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口政之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光學膜用樹脂膜含有具有負雙折射之非晶質樹脂、及式（1）所示之二縮醛化合物。上述膜中，上述二縮醛化合物以表現出負雙折射之晶體或締合狀態析出。上述光學膜用樹脂膜表現出負雙折射。 &lt;br/&gt;&lt;img align="absmiddle" height="209px" width="439px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;相同或不同，分別表示氫原子、碳數1～4之烷基、碳數1～4之烷氧基、碳數1～4之烷氧基羰基、碳數1～4之鹵化烷基或鹵素原子，R&lt;sup&gt;7&lt;/sup&gt;表示氫原子、碳數1～4之烷基、碳數1～4之烯基、碳數1～4之烷氧基、碳數1～4之烷氧基羰基或碳數1～4之鹵化烷基）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1408" publication-number="202619721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備用於RNA合成之亞磷醯胺化物之改良化學方法</chinese-title>  
        <english-title>IMPROVED CHEMICAL METHODS FOR MANUFACTURING A PHOSPHORAMIDITE USED IN RNA SYNTHESIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/505</main-classification>  
        <further-classification edition="200601120260202B">A61K31/66</further-classification>  
        <further-classification edition="200601120260202B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利梭　約翰　羅勃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIZZO, JOHN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供製備式(I)或(I′)化合物或其鹽或互變異構體之方法，其等包括使式(II-a)或(II′-a)化合物或其鹽或互變異構體與式(II-b)化合物或其鹽偶合以獲得該式(I)或(I′)化合物或其鹽或互變異構體，其中該式(II-a)或(II′-a)化合物或其鹽或互變異構體係藉由使式(III)或(III′)化合物或其鹽或互變異構體在合適之條件下反應以獲得該式(II-a)或(II′-a)化合物或其鹽或互變異構體來製備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods of preparing a compound of Formula (I) or (I′), or a salt or tautomer thereof, comprising coupling a compound of Formula (II-a) or (II′-a), or a salt or tautomer thereof, with a compound of Formula (II-b), or a salt thereof, to obtain the compound of Formula (I) or (I′), or salt or tautomer thereof, wherein the compound of Formula (II-a) or (II′-a), or salt or tautomer thereof, is prepared by reacting a compound of Formula (III) or (III′), or a salt or tautomer thereof, under suitable conditions to obtain the compound of Formula (II-a) or (II′-a), or salt or tautomer thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1409" publication-number="202620239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135951</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於工件之表面之非沉浸式鍍覆的方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR NON-IMMERSIVE PLATING OF A SURFACE OF A WORKPIECE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C23C18/16</main-classification>  
        <further-classification edition="200601120260211B">C25D17/08</further-classification>  
        <further-classification edition="200601120260211B">C25D21/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商德國艾托特克有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATOTECH DEUTSCHLAND GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>札威爾　塞巴斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZARWELL, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜尼貝爾　瑟巴斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUENNEBEIL, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高盧　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUL, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿麥特　伊貝拉席姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHMET, IBRAHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於工件(2)之表面之非沉浸式濕化學處理的裝置，其包括：固持器件(7)，其用於固持該工件(2)而使該表面處於主要直立定向；液體施加系統(5)，其用於在該工件(2)藉由該固持器件(7)固持時使液體(6)作為沿主要向下方向流動之膜流過該工件(2)之該表面；貯器(4)，其用於收集已流過該表面並自行脫離該表面之液體(9)；及系統(11、12、16、18至20、22、24)，其用於使收集在該貯器(4)中之液體再循環至該液體施加系統(5)。用於使液體再循環之該系統(11、12、16、18至20、22、24)包括用於將噴射氣體(21)引入至該液體中之器件(22、23)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for non-immersive wet-chemical treatment of a surface of a workpiece (2) comprises: a holding device (7) for holding the workpiece (2) with the surface in a predominantly upright orientation; a liquid application system (5) for flowing liquid (6) across the surface of the workpiece (2), when held by the holding device (7), as a film flowing in a predominantly downwards direction; a receptacle (4) for collecting liquid (9) that has flowed across and detached itself from the surface; and a system (11,12,16,18‑20,22,24) for recirculating liquid collected in the receptacle (4) to the liquid application system (5). The system (11,12,16,18‑20,22,24) for recirculating liquid comprises a device (22,23) for introducing sparging gas (21) into the liquid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝置</p>  
        <p type="p">2:工件</p>  
        <p type="p">3:處理腔室</p>  
        <p type="p">4:貯器</p>  
        <p type="p">5:液體施加系統</p>  
        <p type="p">6:活性電解質/液體</p>  
        <p type="p">8:已脫離電解質</p>  
        <p type="p">9:經收集電解質/經收集液體</p>  
        <p type="p">10:第一氧感測器</p>  
        <p type="p">11:閥</p>  
        <p type="p">12:容器</p>  
        <p type="p">13:經去活化電解質/液體</p>  
        <p type="p">14:第二氧感測器</p>  
        <p type="p">15:空氣供應器</p>  
        <p type="p">16:擴散器</p>  
        <p type="p">17:氣泡</p>  
        <p type="p">18:管道入口</p>  
        <p type="p">19:泵</p>  
        <p type="p">20:除氣器</p>  
        <p type="p">21:噴射氣泡/噴射氣體</p>  
        <p type="p">22:噴射氣體入口</p>  
        <p type="p">23:噴射氣體源</p>  
        <p type="p">24:過濾器</p>  
        <p type="p">25:微氣泡</p>  
        <p type="p">26:流量計</p>  
        <p type="p">27:第三氧感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1410" publication-number="202620149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面保護膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260204B">C09J7/22</main-classification>  
        <further-classification edition="200601120260204B">C09J133/08</further-classification>  
        <further-classification edition="200601120260204B">B32B27/30</further-classification>  
        <further-classification edition="201901120260204B">B32B7/06</further-classification>  
        <further-classification edition="200601120260204B">C11D1/02</further-classification>  
        <further-classification edition="200601120260204B">C09K3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦上和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAKAMI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷陸駆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂誠治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURA, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種表面保護膜，其即便於自貼附至剝離之時間或溫度或濕度之變動下亦可表現出穩定之剝離性，亦可減少被黏著體之污染性。本發明提供一種包含此種表面保護膜之光學元件及電子元件。 &lt;br/&gt;本發明之實施方式之表面保護膜係具有基材與黏著劑層者，且該黏著劑層由丙烯酸系黏著劑構成，該丙烯酸系黏著劑由丙烯酸系黏著劑組合物形成，該丙烯酸系黏著劑組合物包含丙烯酸系聚合物與界面活性劑(A)。此處，界面活性劑(A)係(1)不具有芳香族環，且(2)具有-(CH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;O)&lt;sub&gt;n&lt;/sub&gt;-(其中，5≤n＜20)所表示之聚環氧乙烷骨架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材</p>  
        <p type="p">2:黏著劑層</p>  
        <p type="p">3:剝離襯墊</p>  
        <p type="p">10:表面保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1411" publication-number="202620051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介白素-4受體α抗體的使用方法</chinese-title>  
        <english-title>METHODS OF USE FOR INTERLEUKIN-4 RECEPTOR ALPHA ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/28</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商香港康乃德生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONNECT BIOPHARMA HONGKONG LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科拉佐　勞爾　卡洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLLAZO, RAUL CARLOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夸特　巴里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUART, BARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供特異性結合介白素-4受體(IL4R)之抗原結合蛋白、其等組合物及使用方法。本文亦提供使用該等IL4R抗原結合蛋白治療過敏性或發炎性疾病之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are antigen binding proteins that specifically bind to interleukin-4 receptor (IL4R), their compositions and methods of use. Also provided herein are methods of using the IL4R antigen binding proteins for treatment of allergic or inflammatory diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1412" publication-number="202621073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電波傳播模型之作成方法、裝置及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260209B">H04B17/391</main-classification>  
        <further-classification edition="202001120260209B">G06F30/20</further-classification>  
        <further-classification edition="200901120260209B">H04W16/18</further-classification>  
        <further-classification edition="200601120260209B">G06T17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野本之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤木良教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAGI, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福山進二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUYAMA, SHINJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕨野智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARABINO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野方敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野谷健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOYA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電波傳播模型(M2)之作成方法，其係作成用於進行對象構造物的電波傳播解析之電波傳播模型(M2)之方法，其包含：取得步驟(S1)，其取得前述對象構造物的三維模型(M1)；判定步驟(S2)，其判定三維模型(M1)中的RCS；及電波傳播模型作成步驟(S3)，其從三維模型(M1)除去RCS為閾值以下的部分來作成電波傳播模型(M2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1413" publication-number="202620096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯系密封劑膜以及使用有該聚酯系密封劑膜之包裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08G63/183</main-classification>  
        <further-classification edition="200601120260213B">C09K3/10</further-classification>  
        <further-classification edition="200601120260213B">C08J5/22</further-classification>  
        <further-classification edition="200601120260213B">B32B27/36</further-classification>  
        <further-classification edition="200601120260213B">B65D53/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉森康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMORI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤考道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, TAKAMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所請之聚酯系密封劑膜係解決課題在於：不僅熔斷密封強度、熱密封強度充分，且防止熔斷密封時之外觀不良發生，保香性優異。本發明所請之聚酯系密封劑膜係以將對苯二甲酸乙二酯作為主要構成成分的聚酯系樹脂所構成，前述聚酯系密封劑膜至少包含熱密封層A以及耐熱層B，熱密封層A積層於耐熱層B之單側或兩側，前述聚酯系密封劑膜滿足下述要件(1)至要件(3)：(1)將熱密封層A彼此相向，於膜之寬度方向上進行熔斷密封時之熔斷密封強度為5.0N/15mm以上至18N/15mm以下；(2)將熱密封層A彼此以160℃、0.2MPa、2秒鐘進行熱密封時之熱密封強度為5N/15mm以上至15N/15mm以下；(3)膜之長度方向及寬度方向於120℃之熱收縮率為0.01%以上至10.0%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1414" publication-number="202620975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電纜用連接器組件及電連接器</chinese-title>  
        <english-title>CONNECTOR ASSEMBLY FOR ELECTRIC CABLES AND ELECTRIC CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">H01R13/02</main-classification>  
        <further-classification edition="200601120260204B">H01R13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印度商泰連印度私有有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY INDIA PRIVATE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤他卡　維奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTTARKAR, VINAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡里亞帕　尤格什錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIYAPPA, YOGESHCHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種電纜(802)用連接器組件(100)，其具有預定線規(404)以沿著配接方向(110)與配接連接器(702)配接，該連接器組件(100)包括配置於共同端子平面(106)上之複數個端子(204)，該共同端子平面(106)平行於該配接方向(110)延伸；其中該等端子(104)之各者經構形以連接至至少一條導線(212)，該複數個端子(204)之各者之間在間距方向(116)上之距離(124)小於該預定線規(404)。本發明進一步係關於一種電連接器(700)，其包括如上文所描述之連接器組件(100)及/或配接連接器(702)，該配接連接器(702)包括具有等於該連接器組件(100)之該等端子(104)的該距離(124)之配接間距(1004)之複數個配接接觸件(703)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a connector assembly (100) for electric cables (802) having a predetermined wire gauge (404) to be mated with a mating connector (702) along a mating direction (110), comprising a plurality of terminals (204) that is arranged on a common terminal plane (106), the common terminal plane (106) extending parallel to the mating direction (110); wherein each of the terminals (104) is configured to be connected to at least one wire (212), the distances (124) between each of the plurality of terminals (204) in a pitch direction (116) being smaller than the predetermined wire gauge (404). The invention further relates to an electric connector (700) comprising a connector assembly (100) as described above and/or a mating connector (702) comprising a plurality of mating contacts (703) with a mating pitch (1004) that is equal to the distance (124) of the terminals (104) of the connector assembly (100).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:端子平面</p>  
        <p type="p">108:插入方向</p>  
        <p type="p">110:配接方向</p>  
        <p type="p">116:間距方向</p>  
        <p type="p">120:高度方向/第三方向</p>  
        <p type="p">202:複數個端子容槽</p>  
        <p type="p">204:複數個端子</p>  
        <p type="p">206:扣件</p>  
        <p type="p">208:扣件凹部</p>  
        <p type="p">210:複數條導線/複數條電線</p>  
        <p type="p">212:導線/電線</p>  
        <p type="p">214:導線突片</p>  
        <p type="p">216:導線側</p>  
        <p type="p">218:配接側</p>  
        <p type="p">220:配接部分</p>  
        <p type="p">222:複數個配接部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1415" publication-number="202621126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以與參考水平相關之新元數據在兩個不同動態範圍之間之引導轉換</chinese-title>  
        <english-title>GUIDED CONVERSIONS BETWEEN TWO DIFFERENT DYNAMIC RANGES WITH NEW METADATA RELATED TO REFERENCE LEVEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04N23/60</main-classification>  
        <further-classification edition="201101120260202B">H04N21/435</further-classification>  
        <further-classification edition="201401120260202B">H04N19/186</further-classification>  
        <further-classification edition="202401120260202B">G06T5/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商內數位ＣＥ專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖澤　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOUZE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普利頌諾　佛萊德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLISSONNEAU, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒納奧爾　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE NAOUR, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種方法，其包括：獲得(601)一輸入動態範圍中之輸入視訊資料及互通性元數據；使用該互通性元數據將該輸入視訊資料轉換(602)為一輸出動態範圍中之輸出視訊資料；其中該互通性元數據至少包括表示一HDR參考水平值之一資訊、表示一SDR參考水平值之一資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method comprising: obtaining (601) input video data in an input dynamic range and interoperability metadata; converting (602) the input video data in output video data in an output dynamic range using the interoperability metadata; wherein, the interoperability metadata comprise at least an information representing an HDR reference level value, an information representing an SDR reference level value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">601:步驟</p>  
        <p type="p">602:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1416" publication-number="202620159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏合劑層、黏合膜、液晶面板及有機ＥＬ面板</chinese-title>  
        <english-title>ADHESIVE LAYER, ADHESIVE FILM, LIQUID CRYSTAL PANEL, AND ORGANIC ELECTROLUMINESCENT PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C09J133/12</main-classification>  
        <further-classification edition="200601120260210B">C09J123/26</further-classification>  
        <further-classification edition="200601120260210B">C09J11/08</further-classification>  
        <further-classification edition="200601120260210B">C08F2/08</further-classification>  
        <further-classification edition="200601120260210B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商賽諾世股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZACROS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長倉毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAKURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田結子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, YUIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木史恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, FUMIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供黏合劑層、黏合膜、液晶面板及有機EL面板，黏合劑層的厚度為15μm以下也能保持高性能。黏合劑層是用於將偏光板（11）與面板（12）的層間進行貼合的用途的黏合劑層（10），黏合劑層（10）的厚度為1～15μm，將偏光板借助厚度為10μm的黏合劑層貼合於面板，即使在經過80℃×500h、85℃×85%RH×500h、105℃×500h的耐久性試驗後，偏光板與厚度為10μm的黏合劑層之間既無剝離也無發泡，將厚度為10μm的黏合劑層貼合於偏光板而結束老化後，將厚度為10μm的黏合劑層貼合於無鹼玻璃，20分鐘後的黏合力為5.0N/25mm以下，將其貼合於無鹼玻璃，23℃×10天後的黏合力為10N/25mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adhesive layer, an adhesive film, a liquid crystal panel, and an organic electroluminescent panel are provided, wherein high performance can be maintained even when the adhesive layer has a thickness of 15 μm or less. The adhesive layer (10) is for bonding between a polarizing plate (11) and a panel (12), wherein the adhesive layer (10) has a thickness of 1 to 15 μm. The polarizing plate is laminated to the panel via the adhesive layer having a thickness of 10 μm, and even after durability tests of 80°C×500h, 85°C×85%RH×500h, and 105°C×500h, there is neither peeling nor foaming between the polarizing plate and the adhesive layer having a thickness of 10 μm. After aging is completed by laminating the adhesive layer having a thickness of 10 μm to the polarizing plate, the peel adhesion measured 20 minutes after laminating the adhesive layer having a thickness of 10 μm to alkali-free glass is 5.0 N/25 mm or less, and the peel adhesion measured after 10 days at 23°C following lamination to alkali-free glass is 10 N/25 mm or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏合劑層</p>  
        <p type="p">11:偏光板</p>  
        <p type="p">12:面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1417" publication-number="202621176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧機器學習模型相關資料的收集與報告</chinese-title>  
        <english-title>COLLECTION AND REPORTING OF ARTIFICIAL INTELLIGENCE MACHINE LEARNING MODEL-RELATED DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/56</main-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪諾拉寇斯　亞力山德羅斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANOLAKOS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷札拉　穆罕默德艾莉穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRZALLAH, MOHAMMED ALI MOHAMMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　慕克許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, MUKESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卡拉卡蘭　索尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKKARAKARAN, SONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的態樣係關於人工智慧機器學習(artificial intelligence machine learning, AIML)模型相關資料的收集與報告。在一態樣中，第一裝置（例如，使用者設備(user equipment, UE)、定位參考單元(positioning reference unit, PRU)、gNB或傳輸接收點(transmission reception point, TRP)等）接收與一組資料收集組態的啟動相關聯的至少一個AIML模型相關資料收集啟動請求。第一裝置根據該組資料收集組態收集與無線通訊網路相關聯的AIML模型相關資料，並將所收集的AIML模型相關資料報告給第二裝置。此類態樣可提供各種技術優勢，諸如改善AIML訓練資料的品質，繼而增加AIML模型品質，這可改善定位、感測、波束管理、通道狀態資訊(channel state information, CSI)程序等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure are directed to collection and reporting of artificial intelligence machine learning (AIML) model-related data. In an aspect, a first device (e.g., user equipment (UE), positioning reference unit (PRU), gNB or transmission reception point (TRP), etc.) receives at least one AIML model-related data collection activation request associated with activation of a set of data collection configurations. The first device collects AIML model-related data associated with a wireless communications network in accordance with the set of data collection configurations, and reports the collected AIML model-related data to the second device. Such aspects may provide various technical advantages, such as improving the quality of AIML training data which in turn increases the AIML model quality, which may be improve positioning, sensing, beam management, channel state information (CSI) procedures, and so on.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:程序</p>  
        <p type="p">1210,1220,1230:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1418" publication-number="202620172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶聚酯組合物、顆粒及成形品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C09K19/20</main-classification>  
        <further-classification edition="200601120260210B">C08L67/03</further-classification>  
        <further-classification edition="200601120260210B">C08G63/189</further-classification>  
        <further-classification edition="200601120260210B">B29C65/40</further-classification>  
        <further-classification edition="201801120260210B">C08K3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大場矢登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種液晶聚酯組合物，其流動性優異，並且能夠形成顯示出低介電常數及低介電損耗正切且力學特性(尤其是拉伸強度與拉伸伸長率)優異之成形品。 &lt;br/&gt;本發明之液晶聚酯組合物包含：含有具有縮合芳香環之第一單體單元之液晶聚酯、及聚芳醚酮；上述液晶聚酯及上述聚芳醚酮之合計含量為80質量%以上，上述聚芳醚酮之含量相對於上述液晶聚酯100質量份為1質量份以上18質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1419" publication-number="202621292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經圖案化基板上生長的無裂紋低差排晶體</chinese-title>  
        <english-title>CRACK-FREE AND LOW-DISLOCATION CRYSTAL GROWN ON A PATTERNED SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/40</main-classification>  
        <further-classification edition="202501120260223B">H10D62/85</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美國加利福尼亞大學董事會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE REGENTS OF THE UNIVERSITY OF CALIFORNIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲留　徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INATOME, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張洵銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊薩　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚易凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, YIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村　修二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種藉由晶體在具有基於晶系之形狀圖案且具有不同晶格常數之層上進行磊晶生長(epitaxial growth)來抑制裂紋及降低缺陷密度之方法，以及一種藉由該方法獲得之基板。本發明之主要優點在於：能夠在GaN或AlN基板上獲得具有低缺陷密度的無裂紋AlGaN。另外，由於基底基板可使用任何材料，因此可選擇低成本的基板。此外，此方法亦可應用於其他材料系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of suppressing cracks and reducing defect density by epitaxial growth of crystals on a layer having a pattern of shapes based on a crystal system and having different lattice constants, and a substrate obtained by the method. The main advantage is the ability to obtain crack-free AlGaN with low defect density on GaN or AlN substrates. In addition, since any material can be used for the base substrate, a low-cost substrate can be selected. Also, this method can be applied to other material systems.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基底基板</p>  
        <p type="p">102:第一層</p>  
        <p type="p">103:硬式遮罩</p>  
        <p type="p">104:光阻劑</p>  
        <p type="p">105:第二層/圖案</p>  
        <p type="p">105a:圖案</p>  
        <p type="p">105b:圖案</p>  
        <p type="p">105c:圖案</p>  
        <p type="p">106:第二層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1420" publication-number="202621087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於離散傅立葉變換擴展正交分頻多工波形的上行鏈路資源靜默及相位追蹤參考信號</chinese-title>  
        <english-title>UPLINK RESOURCE MUTING AND PHASE TRACKING REFERENCE SIGNALS FOR DISCRETE FOURIER TRANSFORM SPREAD ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING WAVEFORMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H04L27/26</main-classification>  
        <further-classification edition="202301120260202B">H04W72/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊普拉欣　阿普杜勒拉曼穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德賽義德凱里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一使用者設備(UE)可接收與用於一離散傅立葉變換(DFT)擴展正交分頻多工(OFDM)(DFT-s-OFDM)波形的一上行鏈路資源靜默或一相位追蹤參考信號(PT-RS)中之一或多者相關聯的一組態。該UE可至少部分地基於該組態而傳輸一上行鏈路傳輸，其中該上行鏈路傳輸與該上行鏈路資源靜默及下列中之一或多者相關聯：一或多個資訊符號或一或多個PT-RS符號，且其中該一或多個資訊符號或該一或多個PT-RS符號中之該一或多者的一映射至少部分地基於該組態。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive a configuration associated with one or more of an uplink resource muting or a phase tracking reference signal (PT-RS) for a discrete Fourier transform (DFT) spread orthogonal frequency division multiplexing (OFDM) (DFT-s-OFDM) waveform. The UE may transmit an uplink transmission based at least in part on the configuration, wherein the uplink transmission is associated with the uplink resource muting and one or more of: one or more information symbols or one or more PT-RS symbols, and wherein a mapping of the one or more of the one or more information symbols or the one or more PT-RS symbols is based at least in part on the configuration. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">902:元件符號</p>  
        <p type="p">904:元件符號</p>  
        <p type="p">906:元件符號</p>  
        <p type="p">908:元件符號</p>  
        <p type="p">910:元件符號</p>  
        <p type="p">912:元件符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1421" publication-number="202621197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製程設備、起輝控制方法及相關裝置</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESS EQUIPMENT, IGNITION CONTROL METHOD, AND RELATED DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H05H1/46</main-classification>  
        <further-classification edition="200601120251103B">H01J37/32</further-classification>  
        <further-classification edition="200601120251103B">G05B15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姬雲磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, YUN LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王蕾越</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEI YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉曉行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAO HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體製程設備，在該設備中，在起輝時，首先向製程腔室提供製程氣體，並向目標電極施加直流電壓，以形成目標電場，利用目標電場加速帶電粒子，使製程腔室中游離的帶電粒子獲得能量後轟擊製程氣體，以形成第一等離子體，完成預起輝過程。由於在等離子體放電初期，主要需要能量較高的電子，因此，藉著由直流電壓形成的目標電場加速帶電粒子（例如電子）的方式，可以使帶電粒子獲得較高能量，有利於提升起輝的成功率。且向電極施加直流電壓無需匹配器等其他硬體結構，具有簡單易行的特點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a semiconductor processing apparatus. In this apparatus, during ignition, a process gas is first supplied to the process chamber, and a direct current (DC) voltage is applied to the target electrode to form a target electric field. The target electric field is used to accelerate charged particles, so that the ionized charged particles in the process chamber gain energy and bombard the process gas, thereby forming a first plasma and accomplishing the pre-ignition process. Since, in the initial stage of plasma discharge, electrons with relatively high energy are mainly required, the method of accelerating charged particles (such as electrons) by means of the target electric field formed by the DC voltage enables the charged particles to obtain higher energy, which is beneficial for improving the success rate of ignition. Moreover, applying a DC voltage to the electrode does not require additional hardware structures such as a matcher, and thus has the characteristics of simplicity and ease of implementation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20A:進氣組件</p>  
        <p type="p">20B:上電極組件</p>  
        <p type="p">20C:下電極組件</p>  
        <p type="p">21:線圈</p>  
        <p type="p">22:晶圓承載裝置</p>  
        <p type="p">23:上射頻電源</p>  
        <p type="p">25:上匹配器</p>  
        <p type="p">27:調整支架</p>  
        <p type="p">28:濾波器</p>  
        <p type="p">29:直流電源</p>  
        <p type="p">30:製程腔室本體</p>  
        <p type="p">31:介質窗</p>  
        <p type="p">100:等離子體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1422" publication-number="202620117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物及使用所述組成物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08K5/57</main-classification>  
        <further-classification edition="200601120260202B">C07D207/40</further-classification>  
        <further-classification edition="200601120260202B">C01G27/06</further-classification>  
        <further-classification edition="201201120260202B">G03F1/22</further-classification>  
        <further-classification edition="200601120260202B">C08K5/03</further-classification>  
        <further-classification edition="200601120260202B">B01J31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐也隱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YAEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜恩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, EUNMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜錫一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUKIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旻映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開一種半導體光阻組成物及使用所述半導體光阻組成物形成圖案的方法，所述半導體光阻組成物包含：有機金屬化合物；環狀二酮化合物；以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming patterns using the same, the semiconductor photoresist composition including an organometallic compound; a cyclic diketone compound; and a solvent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板/半導體基板</p>  
        <p type="p">108:光阻圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1423" publication-number="202620147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械研磨後洗淨組合物、化學機械研磨後洗淨處理方法及半導體基板之製造方法</chinese-title>  
        <english-title>POST-CHEMICAL MECHANICAL POLISHING CLEANING COMPOSITION, METHOD FOR POST-CHEMICAL MECHANICAL POLISHING CLEANING TREATMENT, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09G1/16</main-classification>  
        <further-classification edition="202601120260223B">H10P70/00</further-classification>  
        <further-classification edition="200601120260223B">C11D7/16</further-classification>  
        <further-classification edition="200601120260223B">C11D1/83</further-classification>  
        <further-classification edition="200601120260223B">C11D1/12</further-classification>  
        <further-classification edition="200601120260223B">C11D3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成田恵未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARITA, EMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種方法，能夠充分去除含有含矽材料之研磨過之研磨對象物之表面所殘留之殘渣。 &lt;br/&gt;本發明之化學機械研磨後洗淨組合物含有包含磺酸基之陰離子性高分子、及重量平均分子量2,000以上20,000以下之含氮非離子性高分子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is means that enables removing residues remaining on the surface of a polished object containing silicon-containing material sufficiently. A post-chemical mechanical polishing cleaning composition, containing a sulfonic acid group-containing anionic polymer and a nitrogen-containing nonionic polymer having a weight-average molecular weight of 2,000 or more and 20,000 or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1424" publication-number="202621116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像解碼方法、影像編碼方法、影像解碼裝置及影像編碼裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260202B">H04N19/176</main-classification>  
        <further-classification edition="201401120260202B">H04N19/17</further-classification>  
        <further-classification edition="201401120260202B">H04N19/117</further-classification>  
        <further-classification edition="201401120260202B">H04N19/80</further-classification>  
        <further-classification edition="202401120260202B">G06T5/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徳満健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMITSU, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森吉達治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYOSHI, TATSUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蝶野慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONO, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於影像解碼方法、影像編碼方法、影像解碼裝置及影像編碼裝置。本發明之影像解碼裝置，將影像位元流解碼而取得解碼畫面；識別解碼畫面中之已被刪除的部分區域；利用關注區域中與部分區域接近的接近像素之像素值，決定填充至部分區域的像素之像素值；將部分區域，以具有所決定之像素值的像素填充。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:影像解碼裝置</p>  
        <p type="p">21:影像解碼手段</p>  
        <p type="p">22:識別手段</p>  
        <p type="p">23:像素值決定手段</p>  
        <p type="p">24:填充手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1425" publication-number="202621503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能夠使處理器元件與記憶體元件之間通訊的光互連件</chinese-title>  
        <english-title>PHOTONIC INTERCONNECTS TO ENABLE COMMUNICATION BETWEEN PROCESSOR COMPONENTS AND MEMORY COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/60</main-classification>  
        <further-classification edition="200601120260223B">G02B6/122</further-classification>  
        <further-classification edition="200601120260223B">G02B6/42</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班薩利　阿密特Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHANSALI, AMEET S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那拉馬蘇　歐卡藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALAMASU, OMKARAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕逖邦德拉　納格Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIBANDLA, NAG B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUM, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克米蘭　偉恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCMILLAN, WAYNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇魯沃盧　希夫庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRUVOLU, SHIVKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統包括中介層裝置，其包括中介層，以及在中介層上的至少第一光互連件和第二光互連件。第一光互連件包括：至少一個轉向元件，位於第一介電層內；至少一個微觀發光元件，位於第二介電層內且位於轉向元件上方；以及至少一個波導，位於第一介電層內。至少一個轉向元件用於將由至少一個微觀發光元件產生的至少一個光訊號導向至至少一個波導，以便傳輸至第二光互連件。該系統進一步包括連接到中介層裝置的複數個元件。該複數個元件包括連接到第一光互連件的第一元件以及連接到第二光互連件的第二元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes an interposer device including an interposer, and at least a first photonic interconnect and a second photonic interconnect on the interposer. The first photonic interconnect includes at least one turning element within a first dielectric layer, at least one microscopic light-emitting component within a second dielectric layer and above the turning element, and at least one waveguide within the first dielectric layer. The at least one turning element is to direct at least one optical signal generated by the at least one microscopic light-emitting component to the at least one waveguide for transmission to the second photonic interconnect. The system further includes a plurality of components connected to the interposer device. The plurality of components includes a first component connected to the first photonic interconnect and a second component connected to the second photonic interconnect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">132:介電層</p>  
        <p type="p">133:介電層</p>  
        <p type="p">134:內部核心</p>  
        <p type="p">140-2:光互連件</p>  
        <p type="p">145-2:OSC</p>  
        <p type="p">210:溝槽</p>  
        <p type="p">220:轉向元件</p>  
        <p type="p">230:陣列</p>  
        <p type="p">240:隔離結構</p>  
        <p type="p">250:背板</p>  
        <p type="p">260:光檢測器/光二極體</p>  
        <p type="p">270:襯墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1426" publication-number="202620108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶聚酯製品再生方法、及再生方法的選擇方法</chinese-title>  
        <english-title>RECYCLING METHOD FOR LIQUID CRYSTAL POLYESTER PRODUCT, AND SELECTING METHOD OF RECYCLING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08J11/04</main-classification>  
        <further-classification edition="200601120260202B">C08G63/19</further-classification>  
        <further-classification edition="200601120260202B">B29B17/04</further-classification>  
        <further-classification edition="200601120260202B">B29B11/10</further-classification>  
        <further-classification edition="200601120260202B">C08F8/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, KAZUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野中壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONAKA, YOSHIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本步</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, AYUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片山隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAYAMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種再生方法，其一面提高液晶聚酯製品的再生率，一面減低能量消耗。前述再生方法係將液晶聚酯製品選擇性進行再生的方法，其中當液晶聚酯製品係所含有的液晶聚酯的總單末端量為超過12.5meq/kg的低分子量液晶聚酯製品時，將該低分子量液晶聚酯製品進行材料再生；當液晶聚酯製品係所含有的液晶聚酯的總單末端量為12.5meq/kg以下的高分子量液晶聚酯製品時，將該高分子量液晶聚酯製品進行化學再生的再生方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a recycling method which enhances a recycling rate of a liquid crystal polyester product as well as reduces energy consumption. The recycling method is a method for selectively recycling a liquid crystal polyester product, wherein when the liquid crystal polyester product is a low molecular weight liquid crystal polyester product including a liquid crystal polyester having a total amount of one-end groups of more than 12.5 meq/kg, the low molecular weight liquid crystal polyester product is subjected to a material recycling, and when the liquid crystal polyester product is a high molecular weight liquid crystal polyester product including a liquid crystal polyester having a total amount of one-end groups of 12.5 meq/kg or less, the high molecular weight liquid crystal polyester product is subjected to a chemical recycling.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1427" publication-number="202620234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於間接ＣＣＰ的有形離子阻擋板</chinese-title>  
        <english-title>SHAPED ION BLOCKER PLATE FOR INDIRECT CCP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C23C16/455</main-classification>  
        <further-classification edition="200601120260209B">H01J37/09</further-classification>  
        <further-classification edition="200601120260209B">H01J37/32</further-classification>  
        <further-classification edition="200601120260209B">H01J37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩胡　魯帕利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHU, RUPALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴許穆科　拉克斯曼維薩拉奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESHMUKH, LAXMAN VITTHALRAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERA, KALLOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉瑞曼　卡迪科揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALARAMAN, KARTHIKEYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏加爾　普拉哈洛德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, PRAHALLAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了一種用於半導體製造處理腔室的氣體分配裝置、半導體製造以及使用和形成該氣體分配裝置的方法。該氣體分配裝置具有離子阻擋板，其在離子阻擋板的外周邊區域處相對於在板的中心具有較大厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Gas distribution apparatus for a semiconductor manufacturing processing chamber, semiconductor manufacturing and methods of using and forming the gas distribution apparatus are described. The gas distribution apparatus has an ion blocker plate with a greater thickness at the outer peripheral region of the ion blocker plate relative to the center of the plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:頂部/腔室蓋</p>  
        <p type="p">130:基板/晶圓</p>  
        <p type="p">133:反應空間</p>  
        <p type="p">200:氣體分配裝置</p>  
        <p type="p">202:中心</p>  
        <p type="p">205:RF電極</p>  
        <p type="p">210:阻擋板</p>  
        <p type="p">212:前表面</p>  
        <p type="p">214:後表面</p>  
        <p type="p">215:孔</p>  
        <p type="p">216:中心區域</p>  
        <p type="p">218:外周邊區域</p>  
        <p type="p">223:過渡</p>  
        <p type="p">225:RF隔離器</p>  
        <p type="p">240:間隙</p>  
        <p type="p">245:氣體進口</p>  
        <p type="p">T&lt;sub&gt;C&lt;/sub&gt;:中心區域厚度</p>  
        <p type="p">T&lt;sub&gt;E&lt;/sub&gt;:外周邊區域厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1428" publication-number="202620242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化鎢粉末及碳化鎢混合粉末</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C23C22/54</main-classification>  
        <further-classification edition="202001120260213B">C01F17/206</further-classification>  
        <further-classification edition="200601120260213B">C04B35/56</further-classification>  
        <further-classification edition="201701120260213B">C01B32/949</further-classification>  
        <further-classification edition="200601120260213B">C22C29/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商聯合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>A.L.M.T. CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城戶保樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDO, YASUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村好博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕索斯　阿儂薩克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASEUTH, ANONGSACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱木健成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAKI, KENSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板倉剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAKURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種碳化鎢粉末，其由在表面存在第一元素之氧化物之第一碳化鎢粒子構成，且上述第一元素為選自由鈦、鋯、鈮、鉭、鉬、鈰、及釔所組成之群中之至少一者，使用穿透式電子顯微鏡所附屬之能量分散型X射線光譜裝置，自設置於上述第一碳化鎢粒子之內部、且與上述第一碳化鎢粒子之外緣之距離為10 nm以上的位置X1朝向設置於上述第一碳化鎢粒子之外部、且與上述第一碳化鎢粒子之外緣之距離為10 nm以上的位置X2，進行線分析，將所獲得之結果示於X軸為與上述位置X1之距離、且Y軸為元素之以原子數為基準之含有率的座標系統，於由此所得之第一曲線圖中，在相較於鎢之上述以原子數為基準之含有率為上述鎢之上述以原子數為基準之含有率之最大值之0.5倍的距離P1距原點更遠之距離中存在上述第一元素之上述以原子數為基準之含有率最大之距離P2、及氧之上述以原子數為基準之含有率最大之距離P3，且上述距離P2與上述距離P3之差之絕對值為0 nm以上0.5 nm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1429" publication-number="202621049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>負載校正電路</chinese-title>  
        <english-title>DUTY CORRECTION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260208B">H03K5/156</main-classification>  
        <further-classification edition="200601120260208B">H03L7/00</further-classification>  
        <further-classification edition="200601120260208B">H03K19/0175</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNGYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧東仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, DONGIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪炳柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, BYOUNG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔榮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YOUNGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許棟勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, DONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種負載校正電路包括：電容器，用以對輸入時脈進行耦合；緩衝鏈電路，經由節點而耦合至電容器以基於對經耦合輸入時脈進行放大來輸出輸出時脈；以及回饋電路，耦合至節點及緩衝鏈電路且包括：第一低通濾波器，用以對輸出時脈進行濾波；第一截波器電路，用以經由第一及第二輸入端子來接收參考電壓及經濾波輸出時脈，以及對參考電壓及經濾波輸出時脈進行截波；放大器，用以對截波訊號進行放大；第二截波器電路，用以對經放大訊號進行截波；積分回饋電路，耦合至第二輸入端子及第二截波器電路；第二低通濾波器，耦合至第二截波器電路；以及回饋路徑，用以將來自第二低通濾波器的經濾波訊號提供至節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A duty correction circuit includes a capacitor to couple an input clock, a buffer chain circuit coupled to the capacitor through a node to output an output clock based on amplifying the coupled input clock, and a feedback circuit coupled to the node and the buffer chain circuit and including a first low-pass filter to filter the output clock, a first chopper circuit to receive a reference voltage and the filtered output clock through first and second input terminals, and chop the reference voltage and the filtered output clock, an amplifier to amplify the chopping signals, a second chopper circuit to chop the amplified signals, an integration feedback circuit coupled to the second input terminal and the second chopper circuit, a second low-pass filter coupled to the second chopper circuit, and a feedback path to provide a filtered signal from the second low-pass filter to the node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:負載校正電路</p>  
        <p type="p">110:緩衝鏈電路</p>  
        <p type="p">120a:回饋電路</p>  
        <p type="p">121:第一低通濾波器(LPF)</p>  
        <p type="p">122:積分截波電路</p>  
        <p type="p">123:第二低通濾波器(LPF)</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">CLK_i:輸入時脈</p>  
        <p type="p">CLK_f:經濾波輸出時脈</p>  
        <p type="p">CLK_o:輸出時脈</p>  
        <p type="p">FP:回饋路徑</p>  
        <p type="p">FS:訊號/經濾波訊號</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">OS:輸出訊號</p>  
        <p type="p">VREF:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1430" publication-number="202620923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於以檢測環塌縮過程和觸發材料累積過程來操作多粒子束系統的方法、相關電腦程式產品、多粒子束系統以及多束粒子顯微鏡</chinese-title>  
        <english-title>METHOD FOR OPERATING A MULTIPLE PARTICLE BEAM SYSTEM WITH DETECTION OF A RING COLLAPSE PROCESS AND TRIGGERING OF A MATERIAL BUILD-UP PROCESS, ASSOCIATED COMPUTER PROGRAM PRODUCT, AND MULTIPLE PARTICLE BEAM SYSTEM AND MULTI-BEAM PARTICLE MICROSCOPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/302</main-classification>  
        <further-classification edition="200601120260223B">H01J37/244</further-classification>  
        <further-classification edition="200601120260223B">H01J37/075</further-classification>  
        <further-classification edition="200601120260223B">H01J29/51</further-classification>  
        <further-classification edition="202601120260223B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍克　瑞福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LENKE, RALF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史朵瑞克　傑洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STORECK, GERO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種多粒子束系統的操作方法，其中可以根據束電流測量及/或束電流均勻性測量，偵測該多粒子束系統的束產生設備的陰極尖端的前端琢面處環塌陷過程的開始。此偵測會觸發在陰極尖端的前端琢面處的目標性材料堆積過程。並具體闡明了該材料堆積過程的特定步驟。此外，描述了用於束電流測量及/或束電流均勻性測量的各種選項。特別是，這些測量可以在多粒子束系統的正常操作期間執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a method for operating a multiple particle beam system, in which the onset of a ring collapse process at the front facet of the cathode tip of the beam-generating apparatus of the multiple particle beam system can be detected on the basis of beam current measurements and/or beam current uniformity measurements. This detection triggers a targeted material build-up process at the front facet of the cathode tip. Specific process steps for the material build-up process are specified. Furthermore, various options for beam current measurement and/or beam current uniformity measurement are described. In particular, these measurements may be performed during the normal operation of the multiple particle beam system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">I:束電流</p>  
        <p type="p">t:時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1431" publication-number="202621414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於流量平衡之方法及設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR FLOW BALANCING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海明格　漢內洛爾　阿佐拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMMINGER, HANNELORE AZORA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁祁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳楚唯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧恩　陶德　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, TODD ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露技術之各種實施例可提供分別經由一第一氣體管線及第二氣體管線耦接至一第一反應腔室及一第二反應腔室之一容器。各氣體管線可包含一可變特徵，其中各可撓性特徵配置以改變流動通過此等氣體管線之一氣體的流動動力學。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of the present technology may provide a vessel coupled to a first reaction chamber and a second reaction chamber via a first gas line and second gas line, respectively. Each gas line may comprise a variable feature, wherein each flexible feature is configured to change the flow dynamics of a gas flowing through the gas lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">105:容器</p>  
        <p type="p">110(a):第一反應腔室</p>  
        <p type="p">110(b):第二反應腔室</p>  
        <p type="p">115(a):第一可變特徵</p>  
        <p type="p">115(b):第二可變特徵</p>  
        <p type="p">120(a):第一閥</p>  
        <p type="p">120(b):第二閥</p>  
        <p type="p">125(a):第一感測器</p>  
        <p type="p">125(b):第二感測器</p>  
        <p type="p">135(a):第一氣體管線</p>  
        <p type="p">135(b):第二氣體管線</p>  
        <p type="p">150:第三感測器</p>  
        <p type="p">155:控制器</p>  
        <p type="p">160:主氣體管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1432" publication-number="202621263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含金屬膜之形成方法、電容器之製造方法及成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/60</main-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="200601120260223B">C23C16/06</further-classification>  
        <further-classification edition="200601120260223B">C23C16/44</further-classification>  
        <further-classification edition="200601120260223B">C23C16/50</further-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤寛人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪錫亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SEOKHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大類博輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORUI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭示之一態樣的含金屬膜之形成方法，包括：準備具有高介電常數膜之基板；在將該基板控制於第一溫度之狀態下，在不對該高介電常數膜供給電漿的情況下，改質該高介電常數膜之表面；以及在將該基板控制於第二溫度之狀態下，於經改質之該高介電常數膜之該表面上形成含金屬膜，該第一溫度係與該第二溫度相同之溫度或低於該第二溫度之溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1433" publication-number="202621380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化矽及多晶矽的循環蝕刻</chinese-title>  
        <english-title>CYCLIC ETCH OF SILICON OXIDE AND POLYSILICON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/24</main-classification>  
        <further-classification edition="200601120260223B">C30B29/06</further-classification>  
        <further-classification edition="200601120260223B">C30B33/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凌　茫茫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LING, MANG-MANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONG MUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　海龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HAILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈馬尼　史林尼法斯Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMANI, SRINIVAS D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　怡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIEH, ELLIE Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">示範性的半導體處理方法可以包括將一或多個第一蝕刻前驅物提供到半導體處理腔室的處理區域。基板可以置放在處理區域內。可在基板上佈置複數對的氧化矽材料和多晶矽材料。該方法可以包括生成一或多個第一蝕刻前驅物的電漿流出物，並將基板與一或多個第一蝕刻前驅物的電漿流出物接觸，以選擇性蝕刻氧化矽材料。該方法可以包括將一或多個第二蝕刻前驅物提供到處理區域，生成一或多個第二蝕刻前驅物的電漿流出物，並將基板與一或多個第二蝕刻前驅物的電漿流出物接觸，以選擇性蝕刻多晶矽材料。處理區域內的溫度可大於或約為0°C。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor processing methods may include providing one or more first etchant precursors to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. A plurality of pairs of silicon oxide material and polysilicon material may be disposed on the substrate. The methods may include forming plasma effluents of the one or more first etchant precursors and contacting the substrate with the plasma effluents of the one or more first etchant precursors to selectively etch silicon oxide material. The methods may include providing one or more second etchant precursors to the processing region, forming plasma effluents of the one or more second etchant precursors, and contacting the substrate with the plasma effluents of the one or more second etchant precursors to selectively etch polysilicon material. A temperature within the processing region may be greater than or about 0 °C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">305:操作</p>  
        <p type="p">310:操作</p>  
        <p type="p">315:操作</p>  
        <p type="p">320:操作</p>  
        <p type="p">325:操作</p>  
        <p type="p">330:操作</p>  
        <p type="p">335:操作</p>  
        <p type="p">340:操作</p>  
        <p type="p">345:操作</p>  
        <p type="p">350:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1434" publication-number="202621054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>位準偏移電路系統裝置及方法</chinese-title>  
        <english-title>LEVEL-SHIFTING CIRCUITRY DEVICES AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">H03K19/0185</main-classification>  
        <further-classification edition="200601120260207B">G11C8/08</further-classification>  
        <further-classification edition="200601120260207B">H03K5/156</further-classification>  
        <further-classification edition="200601120260207B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　安迪旺坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ANDY WANGKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查納納　莫希特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANANA, MOHIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉傑什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJESH, .</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬　帕爾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, PARVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　耀功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG, YEW KEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於位準偏移的電路包括一脈衝成形器電路，其包含：一第一PMOS電晶體；及一位準偏移電路，其中該第一PMOS電晶體經組態以對該位準偏移電路的一字線產生路徑上的一節點進行預充電。此外，一種位準偏移的方法包括在一脈衝成形電路的一PMOS電晶體處偵測一時脈信號的一下降邊緣；且藉由該脈衝成形電路產生一脈衝來啟動該PMOS電晶體，以對一位準偏移電路的一字線產生路徑上的一節點進行預充電。另一種用於位準偏移的電路包括：一第一PMOS電晶體；及一位準偏移電路系統，其中該電路經組態以從一第一電壓域上的一時脈信號產生一第二電壓域上的一脈衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit for level-shifting includes a pulse-shaper circuit&lt;i/&gt;comprising a first PMOS transistor; and a level-shifting circuit, where the first PMOS transistor is configured to precharge a node on a wordline generation path of the level-shifting circuit. Also, a method of level-shifting includes detecting, at a PMOS transistor of a pulse-shaping circuit, a falling edge of a clock signal; and generating, by the pulse-shaping circuit, a pulse to activate the PMOS transistor to precharge a node on a wordline generation path of a level-shifting circuit. Another circuit for level-shifting includes a first PMOS transistor; and a level-shifting circuitry, where the circuit is configured to generate a pulse on a second voltage domain from a clock signal on a first voltage domain.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路</p>  
        <p type="p">110:脈衝成形器電路；脈衝成形器電路系統</p>  
        <p type="p">111:反相器</p>  
        <p type="p">112:第一PMOS電晶體</p>  
        <p type="p">113:NAND閘</p>  
        <p type="p">114:重置延遲</p>  
        <p type="p">115:競爭緩解位準偏移器(CMLS)</p>  
        <p type="p">116:第一反相器</p>  
        <p type="p">117:第二反相器</p>  
        <p type="p">118:第一輸入</p>  
        <p type="p">119:第二輸入</p>  
        <p type="p">120:位準偏移電路</p>  
        <p type="p">121:第一PMOS電晶體</p>  
        <p type="p">123:第二PMOS電晶體</p>  
        <p type="p">125:第一NMOS電晶體</p>  
        <p type="p">127:第二NMOS電晶體</p>  
        <p type="p">132:反相器</p>  
        <p type="p">142:節點</p>  
        <p type="p">gtp:控制信號</p>  
        <p type="p">gtp_ce:輸出脈衝信號</p>  
        <p type="p">nrowclk:時脈信號</p>  
        <p type="p">rowclk:列時脈信號</p>  
        <p type="p">vddp:第一操作電壓</p>  
        <p type="p">vddce:第二操作電壓</p>  
        <p type="p">xrow:時脈信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1435" publication-number="202620668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、資訊處理方法、電腦程式及電腦可讀取儲存媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G06F17/15</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商平田機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木秀幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾莫德斯羅什　蒂博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMOT DES ROCHES, THIBAUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原廉枋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAHARA, REMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一種資訊處理裝置，具備：FPO(偽陽性排除)解析部，當根據與進行相關性網絡解析的對象的多變量資料具有的要素中的種要素的相關性的排名在上位的非種要素來構成前述種要素的模組時，針對每個秩也就是編組進前述種要素的模組的前述種要素以外的要素的數量，從該秩的下限值起執行FPO解析處理至該秩的上限值為止，該FPO解析處理從與前述種要素的相關性的排名在上位的非種要素中將偽陽性的非種要素排除；模組資訊記憶部，針對個別的要素的每個秩存放最佳的模組F分數的模組的構成資訊；及FPO模組選定部，基於秩的下限值至上限值為止的各秩中的最佳的模組F分數，來選定FPO解析結果的最適合模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊處理裝置</p>  
        <p type="p">11:輸入輸出部</p>  
        <p type="p">12:記憶部</p>  
        <p type="p">13:控制部</p>  
        <p type="p">121:相關性網絡解析程式</p>  
        <p type="p">122:相關係數清單</p>  
        <p type="p">123:模組資訊</p>  
        <p type="p">124:模組整合資訊</p>  
        <p type="p">125:最終模組整合資訊</p>  
        <p type="p">126:評價值資訊</p>  
        <p type="p">127:最終模組資訊</p>  
        <p type="p">128:FPO解析完畢模組清單</p>  
        <p type="p">131:相關係數算出部</p>  
        <p type="p">132:FPO解析部</p>  
        <p type="p">133:FPO模組選定部</p>  
        <p type="p">134:FPO模組整合部</p>  
        <p type="p">135:FNI解析部</p>  
        <p type="p">136:FNI指定處理部</p>  
        <p type="p">137:P值算出部</p>  
        <p type="p">138:輸出資料產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1436" publication-number="202620863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在低功耗雙倍資料速率　(LPDDR)　記憶體中實現邏輯運算</chinese-title>  
        <english-title>ENABLING LOGICAL OPERATIONS IN LOW-POWER, DOUBLE DATA RATE (LPDDR) MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G11C11/407</main-classification>  
        <further-classification edition="200601120260202B">G06F13/14</further-classification>  
        <further-classification edition="200601120260202B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　榮天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RONGTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體設備包括雙倍資料速率(double data rate, DDR)記憶體的兩個獨立子通道。各子通道包括數個記憶體庫及具有數個後設資料暫存器的一個輸入/輸出(input/output, I/O)區塊。該記憶體設備亦包括一處理單元。該處理單元包括一算術邏輯單元(arithmetic logic unit, ALU)、耦接至該ALU之一輸出的一累加器、耦接至該ALU的一控制器、兩個多工器，各多工器將一個子通道耦接至一ALU輸入且將該累加器耦接至該ALU輸入、及兩個多工器/解多工器。各多工器/解多工器耦接在一記憶體庫、一對應的I/O區塊、該兩個多工器中之一者與該累加器之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory apparatus includes two independent subchannels of double data rate (DDR) memory. Each subchannel includes a number of memory banks, and an input/output (I/O) block having a number of meta data registers. The memory apparatus also includes a processing unit. The processing unit includes an arithmetic logic unit (ALU), an accumulator coupled to an output of the ALU, a controller coupled to the ALU, two multiplexers, each multiplexer coupling one subchannel to an ALU input, and coupling the accumulator to the ALU input, and two multiplexers/demultiplexers. Each multiplexer/demultiplexer is coupled between a memory bank, a corresponding I/O block, one of the two multiplexers, and the accumulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1002:I/O區塊</p>  
        <p type="p">1004:子通道記憶體庫</p>  
        <p type="p">1010:算術邏輯單元(ALU)</p>  
        <p type="p">1012:ALU累加器(ACC)</p>  
        <p type="p">1014:靜態隨機存取記憶體(SRAM)</p>  
        <p type="p">1016:控制器</p>  
        <p type="p">1018:多工器</p>  
        <p type="p">1020:多工器/解多工器(MUX/DEMUX)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1437" publication-number="202621470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體層積體、半導體裝置、及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/90</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10P30/00</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D62/57</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商未來瞻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRISE TECHNOLOGIES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池山和希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEYAMA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤彗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, MEGURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置的製造工程中，作為退火處理之對象的半導體層積體(100)具備：包含摻雜物的氮化物半導體層(101)、及覆蓋該氮化物半導體層的主表面(112)的保護層(103)。設置保護層是為了抑制由於退火導致氮從氮化物半導體層脫離。在本公開中，該保護層以作為結構元素不包含氧，且其阻擋氧作用於主表面的氧阻擋性高於氮化鋁層之方式形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體積層體</p>  
        <p type="p">101:氮化物半導體層</p>  
        <p type="p">102:支持基板</p>  
        <p type="p">103:保護層</p>  
        <p type="p">111:第一主表面</p>  
        <p type="p">112:第二主表面</p>  
        <p type="p">130:接合面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1438" publication-number="202619733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環烯基取代的蒽環類衍生物及用途</chinese-title>  
        <english-title>HETEROCYCLIC ALKENYL-SUBSTITUTED ANTHRACYCLINE DERIVATIVES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">A61K31/704</main-classification>  
        <further-classification edition="200601120260209B">A61K31/535</further-classification>  
        <further-classification edition="200601120260209B">A61K31/44</further-classification>  
        <further-classification edition="200601120260209B">A61K31/351</further-classification>  
        <further-classification edition="200601120260209B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐永金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覃肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張子春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZICHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文淑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WENSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王新美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XINMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶　維康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雜環烯基取代的蒽環類衍生物及用途。具體而言，本發明提供一種通式(I)所示的雜環烯基取代的蒽環類衍生物及其在製備治療和/或預防腫瘤藥物中的用途。 &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="180px" file="ed10343.JPG" alt="ed10343.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a heterocyclic alkenyl-substituted anthracycline derivative and uses thereof. Specifically, the invention provides a heterocyclic alkenyl-substituted anthracycline derivative of general formula (I) and uses thereof in the preparation of drugs for treating and/or preventing tumors. &lt;br/&gt;&lt;img align="absmiddle" height="197px" width="184px" file="ed10344.JPG" alt="ed10344.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1439" publication-number="202621005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸向磁通電機及用於軸向磁通電機之定子</chinese-title>  
        <english-title>AXIAL FLUX MACHINE AND STATOR FOR AXIAL FLUX MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H02K1/16</main-classification>  
        <further-classification edition="200601120251103B">H02K3/30</further-classification>  
        <further-classification edition="200601120251103B">H02K9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚國際能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGH TECH BATTERY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王貴雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUEI-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳育廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮光英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, QUANGANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一軸向磁通電機之定子。該定子包含大致上周向地圍繞一軸線設置之複數個單元。該等單元中之各者可操作以產生大致上平行於該軸線之一磁場。該等單元中之各者分別包含：一軸向延伸定子鐵心齒部，其界定一定子鐵心之至少一部分；及一組繞組，其纏繞在該定子鐵心齒部上。該定子包含用於促進在該定子之操作期間自該定子鐵心散熱的一散熱配置。藉由促進在該定子之操作期間耗散在該定子鐵心中產生或積聚之熱，可改進該定子之效能、效率及/或壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stator for an axial flux machine. The stator comprises a plurality of units disposed generally circumferentially around an axis. Each of the units is operable to generate a magnetic field generally parallel to the axis. Each of the units respectively comprises: an axially extending stator core tooth defining at least part of a stator core, and a set of windings wound around the stator core tooth. The stator comprises a heat dissipation arrangement for facilitating dissipation of heat from the stator core during operation of the stator. By facilitating dissipation of heat generated or accumulated in the stator core during operation of the stator, the performance, efficiency and/or lifespan of the stator can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:單元</p>  
        <p type="p">102C:繞組</p>  
        <p type="p">102T:定子鐵心齒部</p>  
        <p type="p">HD:散熱配置</p>  
        <p type="p">S:定子</p>  
        <p type="p">X:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1440" publication-number="202620979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器組件</chinese-title>  
        <english-title>CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">H01R13/504</main-classification>  
        <further-classification edition="200601120251029B">H01R13/514</further-classification>  
        <further-classification edition="200601120251029B">H01R13/585</further-classification>  
        <further-classification edition="201101120251029B">H01R13/6585</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊藤芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, TENGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾晨輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, CHENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器組件包括電連接器以及屏蔽殼體。前述電連接器設有收容插槽。前述屏蔽殼體配置為設置於前述電路板上。前述屏蔽殼體包括收容腔體，前述收容腔體與前述收容插槽相連通。前述收容腔體以及前述收容插槽配置成共同收容對接連接器。前述電連接器與前述屏蔽殼體設有相互配合的至少一個定位凸柱與至少一個定位孔，前述定位凸柱插入前述定位孔中，可以有效的固定前述電連接器的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector assembly includes an electrical connector and a shielding cage. The electrical connector includes a receiving slot. The shielding cage is configured to be mounted on a circuit board. The shielding cage includes a receiving cavity communicating with the receiving slot. The receiving cavity and the receiving slot are configured to jointly receive a mating connector. The electrical connector and the shielding cage are provided with at least one positioning protrusion and at least one positioning hole that cooperate with each other. The positioning protrusion is inserted into the positioning hole so as to effectively fix the position of the electrical connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器</p>  
        <p type="p">500:屏蔽殼體</p>  
        <p type="p">50a:收容腔體</p>  
        <p type="p">51a:第一壁部</p>  
        <p type="p">51a1:穿孔</p>  
        <p type="p">51a2:定位孔</p>  
        <p type="p">51a21:第一定位孔</p>  
        <p type="p">54a:第四壁部</p>  
        <p type="p">56a3:第二扣持部</p>  
        <p type="p">57a:接地彈片</p>  
        <p type="p">7:外殼體</p>  
        <p type="p">71:定位凸柱</p>  
        <p type="p">711:第一定位凸柱</p>  
        <p type="p">7111:支撐部</p>  
        <p type="p">7112:定位部</p>  
        <p type="p">M1:第一模組</p>  
        <p type="p">1M2:第二模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1441" publication-number="202620524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>面狀光源及面狀光源之製造方法</chinese-title>  
        <english-title>PLANAR LIGHT SOURCE AND METHOD OF MANUFACTURING PLANAR LIGHT SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G02F1/13357</main-classification>  
        <further-classification edition="200601120260207B">F21V8/00</further-classification>  
        <further-classification edition="201601320260207B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日亞化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠井大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種具備可於製造時調整光源之色調及亮度之至少一者之構造之面狀光源及其製造方法。 &lt;br/&gt;本揭示之面狀光源具備：導光板10，其包含第1主面及位於第1主面之相反側之第2主面、1維或2維排列之複數個單元區域10U、及於第1主面及第2主面開口且分別位於複數個單元區域之複數個貫通孔11；複數個光源20，其等係配置於導光板之複數個貫通孔者，上述複數個光源之至少1者與複數個單元區域之1者對應配置於貫通孔；配線基板201，其位於導光板之第2主面側，供配置複數個光源；第1透光性構件31，其於複數個單元區域之各者中，以覆蓋光源之至少側面之一部分之方式，配置於貫通孔內；及第2透光性構件32，其於複數個單元區域之各者中，至少覆蓋第1透光性構件之上表面，而配置於貫通孔內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A planar light source includes: a light guide plate including: a first principal face, a second principal face located opposite the first principal face, and a plurality of through holes that are open at the first principal face and the second principal face; a plurality of light sources, wherein at least one of the light sources is located in the through holes of the light guide plate; a wiring substrate on which the plurality of light sources are located; a first light transmissive member located in a first of the through holes so as to cover at least a portion of a lateral face of the at least one light source located in the first through hole; and a second light transmissive member located in the first through hole so as to cover at least an upper face of the first light transmissive member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導光板</p>  
        <p type="p">10a:第1主面</p>  
        <p type="p">10b:第2主面</p>  
        <p type="p">10U:單元區域</p>  
        <p type="p">11:貫通孔</p>  
        <p type="p">12:區劃槽</p>  
        <p type="p">20:光源</p>  
        <p type="p">20a:上表面</p>  
        <p type="p">20b:下表面</p>  
        <p type="p">20c:側面</p>  
        <p type="p">31:第1透光性構件</p>  
        <p type="p">32:第2透光性構件</p>  
        <p type="p">35:螢光體</p>  
        <p type="p">41:光反射性材料</p>  
        <p type="p">42:遮光構件</p>  
        <p type="p">43:光反射性薄片</p>  
        <p type="p">51:透光性接著片</p>  
        <p type="p">52:接著片</p>  
        <p type="p">65:孔</p>  
        <p type="p">70:配線</p>  
        <p type="p">80:絕緣層</p>  
        <p type="p">101:發光模組</p>  
        <p type="p">101a:上表面</p>  
        <p type="p">101b:下表面</p>  
        <p type="p">201:配線基板</p>  
        <p type="p">201a:第1主面</p>  
        <p type="p">201b:第2主面</p>  
        <p type="p">U:發光單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1442" publication-number="202620052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ITGβ6結合蛋白及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/28</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">C12N15/13</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷冬梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, DONGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李金絨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JINRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅順濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHUNTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳鈞翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEOU, JIUN-SHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及ITGβ6結合蛋白及其用途，具體而言，本發明涉及抗ITGβ6的抗體或其抗原結合片段，編碼它們的核酸分子，製備它們的方法。本發明的抗ITGβ6抗體或其抗原結合片段對ITGβ6具有高特異性和高親和力。本發明進一步涉及所述抗體或其抗原結合片段在治療和診斷疾病中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1443" publication-number="202620058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機聚矽氧烷、組成物、膜、轉印薄膜、圖案形成方法</chinese-title>  
        <english-title>ORGANOPOLYSILOXANE, COMPOSITION, FILM,TRANSFER FILM, PATTERN FORMING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C08F2/30</main-classification>  
        <further-classification edition="200601120260213B">C08G77/20</further-classification>  
        <further-classification edition="200601120260213B">G02B6/138</further-classification>  
        <further-classification edition="200601120260213B">C08F2/50</further-classification>  
        <further-classification edition="200601120260213B">C08K5/33</further-classification>  
        <further-classification edition="200601120260213B">G03F7/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲田寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INADA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤木大悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAKI, DAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的第1課題為提供一種有機聚矽氧烷，其圖案形成性能優異且所形成之圖案的光損耗少。又，本發明的第2課題為還提供一種組成物、膜、轉印薄膜及圖案形成方法。本發明的有機聚矽氧烷包含式（1）所表示之重複單元、式（2）所表示之重複單元及式（3）所表示之重複單元。 &lt;br/&gt;式（1）  [X-SiO&lt;sub&gt;3/2&lt;/sub&gt;] &lt;br/&gt;式中，X表示具有羧酸基之1價基。 &lt;br/&gt;式（2）  [Y-SiO&lt;sub&gt;3/2&lt;/sub&gt;] &lt;br/&gt;式中，Y表示具有聚合性基之1價基。 &lt;br/&gt;式（3）  [SiO&lt;sub&gt;3/2&lt;/sub&gt;-M-（SiO&lt;sub&gt;3/2&lt;/sub&gt;）&lt;sub&gt;n&lt;/sub&gt;] &lt;br/&gt;式中，M表示n+1價有機基。n表示1以上的整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1444" publication-number="202621343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251222B">H10K59/126</main-classification>  
        <further-classification edition="202301120251222B">H10K59/122</further-classification>  
        <further-classification edition="202301120251222B">H10K59/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, JI HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種顯示裝置，包括：基板，包含顯示區域和圍繞顯示區域的非顯示區域；感測器部，設置在顯示區域中；複數個第一電晶體，設置在基板上的顯示區域中並配置以包含氧化物半導體層；以及氫氣捕獲圖案，位於感測器部中並與第一電晶體的氧化物半導體層相鄰設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display device including a substrate including an display area and a non-display area surrounding the display area, a sensor portion provided in the display area, a plurality of first transistors provided in the display area on the substrate and configured to include an oxide semiconductor layer, and a hydrogen capture pattern located in the sensor portion and disposed adjacent to the oxide semiconductor layer of the first transistors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">120A:第一絕緣膜群組</p>  
        <p type="p">120B:第二絕緣膜群組</p>  
        <p type="p">129:第八絕緣膜</p>  
        <p type="p">182:第二主動層</p>  
        <p type="p">191:第二閘極電極</p>  
        <p type="p">202:第二源極汲極電極</p>  
        <p type="p">203:第三源極汲極電極</p>  
        <p type="p">280:氫氣捕獲圖案</p>  
        <p type="p">1200A:下部絕緣膜</p>  
        <p type="p">1200B:上部絕緣膜</p>  
        <p type="p">1200C:層間絕緣膜</p>  
        <p type="p">H:氫氣</p>  
        <p type="p">IR:紅外線</p>  
        <p type="p">IRS:紅外線感測器</p>  
        <p type="p">OT:氧化物電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1445" publication-number="202620019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D233/64</main-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎梨世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, RISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉祐作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YUSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原謙介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIHARA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀口陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGUCHI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種感光性樹脂組成物，含有黏合劑聚合物（A）、光聚合性化合物（B）、光聚合引發劑（C），所述感光性樹脂組成物中，所述光聚合引發劑（C）包含在分子結構中具有碳原子數3以上的烷氧基的六芳基聯咪唑化合物（C1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photosensitive resin composition contains a binder polymer (A), a photopolymerizable compound (B), and a photopolymerization initiator (C), where the photopolymerization initiator (C) includes a hexaarylbiimidazole compound (C1) having an alkoxy group with 3 or more carbon atoms in the molecular structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1446" publication-number="202620800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制影像處理階段以處理由監控攝影機所擷取影像資料的方法</chinese-title>  
        <english-title>A METHOD FOR CONTROLLING AN IMAGE PROCESSING STAGE FOR PROCESSING IMAGE DATA CAPTURED BY A SURVEILLANCE CAMERA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260211B">G06V20/52</main-classification>  
        <further-classification edition="202201120260211B">G06V10/20</further-classification>  
        <further-classification edition="202201120260211B">G06V10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商安訊士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXIS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁　嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一態樣中，提供一種用於控制一影像處理階段以處理由一監控攝影機所擷取影像資料的方法，該監控攝影機具有大於180度之一視場，且經安裝成一下視組態以監視一場景，該方法包括： &lt;br/&gt;獲得由該監控攝影機擷取之影像資料，其中該影像資料包含描繪定位於該場景中之一水平線下方之一中心場景部分之一第一組像素，及描繪定位於該水平線上方之一周邊場景部分之一第二組像素， &lt;br/&gt;執行一天花板偵測程序，該天花板偵測程序包括分析該第二組像素之像素，以判定是否組態該影像處理階段以根據一天花板操作模式操作，及 &lt;br/&gt;回應於判定組態該影像處理階段以根據該天花板操作模式操作，組態該影像處理階段以根據該天花板操作模式操作，同時處理隨後擷取之影像資料，其中該隨後擷取之影像資料包括描繪該中心場景部分之一第一組像素及描繪該周邊場景部分之一第二組像素，其中該影像處理階段包括至少一個影像處理操作，且其中該天花板操作模式包含將該至少一個影像處理操作應用於該經擷取影像資料之該第一組像素而不應用於該經擷取影像資料之該第二組像素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect there is provided a method for controlling an image processing stage for processing image data captured by a surveillance camera having a field-of-view greater than 180 degrees and being mounted in a downward looking configuration to monitor a scene, the method comprising: &lt;br/&gt;obtaining image data captured by the surveillance camera, wherein the image data includes a first set of pixels depicting a central scene portion located below a horizon in the scene, and a second set of pixels depicting a peripheral scene portion located above the horizon, &lt;br/&gt;performing a ceiling detection procedure comprising analyzing pixels of the second set of pixels, to determine whether to configure the image processing stage to operate in accordance with a ceiling operational mode, and &lt;br/&gt;in response to determining to configure the image processing stage to operate in accordance with the ceiling operational mode, configuring the image processing stage to operate in accordance with the ceiling operational mode while processing subsequently captured image data, wherein the subsequently captured image data comprises a first set of pixels depicting the central scene portion and a second set of pixels depicting the peripheral scene portion, wherein the image processing stage comprises at least one image processing operation, and wherein the ceiling operational mode includes applying the at least one image processing operation to the first set of pixels of the captured image data but not to the second set of pixels of the captured image data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:場景</p>  
        <p type="p">10a:中心場景部分</p>  
        <p type="p">10b:周邊場景部分</p>  
        <p type="p">12:天花板</p>  
        <p type="p">14:地板/地面</p>  
        <p type="p">110:監控攝影機</p>  
        <p type="p">H:水平線/虛線/水平線像素</p>  
        <p type="p">O:光軸/點/中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1447" publication-number="202621428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調度方法、調度設備及半導體製程設備</chinese-title>  
        <english-title>SCHEDULING METHOD, SCHEDULING EQUIPMENT AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="200601120260223B">G05B19/418</further-classification>  
        <further-classification edition="200601120260223B">G06F9/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李巍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周廣才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, GUANG CAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種調度方法、調度設備及半導體製程設備，調度方法包括：獲取可用製程腔室資源；可用製程腔室資源包括預釋放製程腔室；預釋放製程腔室的獲取過程包括：若檢測到當前生產任務的最後一片晶圓出片，則將被當前生產任務佔用的製程腔室釋放，以得到預釋放製程腔室；基於待分配的生產任務中目標製程任務的製程路徑和可用製程腔室資源，為目標製程任務進行資源配置；基於得到資源配置的目標製程任務，生成對應的調度序列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a scheduling method, scheduling equipment and semiconductor process equipment. The scheduling method includes obtaining available process chamber resources; the available process chamber resources include pre-release process chambers; the acquisition process of the pre-release process chambers includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber; based on the process path and available process chamber resources of the target process task in the production task to be assigned, resources are allocated for the target process task; based on the target process task with the resource allocation, a corresponding scheduling sequence is generated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201,S202,S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1448" publication-number="202620901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放射性同位素製造系統、放射性同位素製造方法、標靶固定方法及標靶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G21G1/10</main-classification>  
        <further-classification edition="200601120251231B">G21K5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明提供一種能夠增加在一次照射工序中獲得之放射性同位素的量並且提高標靶的操作性之放射性同位素製造系統、放射性同位素製造方法、標靶固定方法及標靶。 &lt;br/&gt;　　[解決手段] 依據放射性同位素製造系統(100)，在一次照射工序中對多個標靶(10)進行帶電粒子束(B)的照射。因此，與在一次照射工序中僅對一個標靶(10)進行照射之情況相比，藉由對多個標靶(10)照射帶電粒子束(B)，能夠增加所獲得之放射性同位素。又，與對一個大的標靶進行照射之情況相比，藉由對多個標靶進行照射，能夠使每一個標靶變得精巧，並且能夠在精製、搬運等中容易地進行操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:照射容器</p>  
        <p type="p">3:保持部</p>  
        <p type="p">6:射束窗</p>  
        <p type="p">10:標靶</p>  
        <p type="p">11:基板</p>  
        <p type="p">13:保持構件</p>  
        <p type="p">14:軸構件</p>  
        <p type="p">BT:照射軌跡</p>  
        <p type="p">CL2:旋轉軸</p>  
        <p type="p">RD:旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1449" publication-number="202620162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C09K3/10</main-classification>  
        <further-classification edition="200601120260213B">C08G59/06</further-classification>  
        <further-classification edition="200601120260213B">C08L63/02</further-classification>  
        <further-classification edition="200601120260213B">C08K3/22</further-classification>  
        <further-classification edition="200601120260213B">C08K5/37</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒主将司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURONUSHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小椋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURA, ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中駿介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進藤有希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻野啓志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGINO, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，其包含：(A)液態環氧樹脂、(B)無機填充材料和(C)具有特定結構的第一硫醇化合物，其中，相對於樹脂組成物的不揮發成分100體積%，(B)無機填充材料的量為20體積%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1450" publication-number="202620048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>TSLP/IL-13　雙特異性抗體及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/24</main-classification>  
        <further-classification edition="200601120260202B">C07K16/46</further-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">C12N15/13</further-classification>  
        <further-classification edition="200601120260202B">A61P37/00</further-classification>  
        <further-classification edition="200601120260202B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商和鉑醫藥(上海)有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅順濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHUNTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣洪嬌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HONGJIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳鈞翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEOU, JIUN-SHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及TSLP/IL-13雙特異性抗體及其用途，具體而言，本發明涉及抗TSLP及IL-13的抗體或其抗原結合片段、編碼它們的核酸分子、製備它們的方法。本發明抗TSLP和IL-13的抗體或其抗原結合片段對TSLP，IL-13具有高特異性和高親和力。本發明進一步涉及所述抗體或其抗原結合片段在治療疾病中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1451" publication-number="202620148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件加工用片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260223B">C09J7/20</main-classification>  
        <further-classification edition="201801120260223B">C09J7/30</further-classification>  
        <further-classification edition="201901120260223B">B32B7/022</further-classification>  
        <further-classification edition="202601120260223B">H10W80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桐畑朋佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRIHATA, TOMOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岸正憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGISHI, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種即使將工件薄化，也能夠抑制工件的裂痕等，同時在將該工件個別化而得到的工件加工物直接接合到晶圓時，能夠減少工件加工物的接合面的粒子數量的工件加工用片。 &lt;br/&gt;[解決手段]一種工件加工用片，其為對為了製造直接接合的加工物的工件進行加工時所使用的工件加工用片，工件加工用片具有基材與黏著劑層積層而成的結構，基材的在23℃下的拉伸模數是1400 MPa以上，在基材中，在與黏著劑層接觸的面中的表面自由能小於40 mN/m。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:工件加工用片</p>  
        <p type="p">10:基材</p>  
        <p type="p">11:支撐材料</p>  
        <p type="p">11b:主面</p>  
        <p type="p">12:低極性材料</p>  
        <p type="p">13:軟質材料</p>  
        <p type="p">20:黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1452" publication-number="202621391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>存在不一致底層時的前饋製程控制</chinese-title>  
        <english-title>FEED-FORWARD PROCESS CONTROL IN THE PRESENCE OF INCONSISTENT UNDERLAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/40</main-classification>  
        <further-classification edition="200601120260223B">G05B13/04</further-classification>  
        <further-classification edition="202301120260223B">G06N3/08</further-classification>  
        <further-classification edition="201201120260223B">B24B37/013</further-classification>  
        <further-classification edition="202601120260223B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑瑞安　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　哈利Ｑ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HARRY Q.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬瑟佛為卡茲　馬汀Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSEFOWICZ, MARTIN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢　駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">生成針對基板的第一訊號值序列的方法和系統；將第一訊號值序列轉換為第一有效厚度軌跡；將第一有效厚度軌跡的至少一部分應用於第一神經網路，以生成經調整的第一有效厚度軌跡；將經調整的第一有效厚度軌跡儲存於網路電腦上；生成針對跨越基板的第二感測器掃描的第二訊號值序列；將第二訊號值序列轉換為第二有效厚度軌跡；將第二有效厚度軌跡的至少一部分應用於第二神經網路，以生成經調整的第二有效厚度軌跡；檢索經調整的第一有效厚度軌跡；以及生成第二傳導層的厚度軌跡，以補償位於第二傳導層下方的第一傳導層的貢獻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for generating a first sequence of signal values for a substrate; converting the first sequence of signal values into a first effective thickness trace; applying at least a portion of the first effective thickness trace to a first neural network to generate an adjusted first effective thickness trace; storing the adjusted first effective thickness trace on a networked computer; generating a second sequence of signal values for the scan of the second sensor across the substrate; converting the second sequence of signal values into a second effective thickness trace; applying at least a portion of the second effective thickness trace to a second neural network to generate an adjusted second effective thickness trace; retrieving the adjusted first effective thickness trace; and generating a thickness trace for the second conductive layer to compensate for a contribution of the first conductive layer underlying the second conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">12:晶圓</p>  
        <p type="p">15:介電層</p>  
        <p type="p">16:層/材料</p>  
        <p type="p">18:阻障層</p>  
        <p type="p">32:拋光層</p>  
        <p type="p">102:感測器</p>  
        <p type="p">104:核心</p>  
        <p type="p">106:線圈</p>  
        <p type="p">110:磁場</p>  
        <p type="p">112a:極</p>  
        <p type="p">112b:極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1453" publication-number="202621153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多活躍網路無線裝置</chinese-title>  
        <english-title>MULTIPLE ACTIVE NETWORK WIRELESS DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260209B">H04W48/18</main-classification>  
        <further-classification edition="200901120260209B">H04W8/18</further-classification>  
        <further-classification edition="200901120260209B">H04W88/06</further-classification>  
        <further-classification edition="200901120260209B">H04W36/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商因特美羅通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERMETRO COMMUNICATIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊斯　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICE, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福格爾　克里斯多佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOGEL, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種無線裝置，該無線裝置能夠使用嵌入式使用者身份模組（eSIM）與多個活躍蜂巢網路通訊。無線裝置配置為：與複數個廣域網中的第一廣域網保持第一通訊連接；存取與複數個廣域網中的第二廣域網及第二eSIM相關的第二網路後設資料；存取與複數個廣域網中的第三廣域網及第二eSIM相關的第三網路後設資料；至少部分基於第二網路後設資料與第三網路後設資料的比較結果選擇第二廣域網；並與第二廣域網建立第二通訊連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless device capable of using embedded subscriber identity modules (SIM) to communicate with multiple active cellular networks is presented. The wireless device is configured to maintain a first communication connection with a first wide area network of the plurality of wide area networks; access second network metadata associated with a second wide area network of the plurality of wide area networks and the second eSIM; access third network metadata associated with a third wide area network of the plurality of wide area networks and the second eSIM; select the second wide area network based at least in part on a comparison between the second network metadata and the third network metadata; and establish a second communication connection with the second wide area network.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2500:通訊環境</p>  
        <p type="p">2502:無線裝置</p>  
        <p type="p">2504:處理器</p>  
        <p type="p">2506:記憶體</p>  
        <p type="p">2508:SIM卡</p>  
        <p type="p">2510:SIM卡</p>  
        <p type="p">2512:網路</p>  
        <p type="p">2514:網路</p>  
        <p type="p">2516:網路表</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1454" publication-number="202619968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳奈米管及其製造方法</chinese-title>  
        <english-title>CARBON NANOTUBES AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260206B">C01B32/158</main-classification>  
        <further-classification edition="201701120260206B">C01B32/16</further-classification>  
        <further-classification edition="200601120260206B">B82B3/00</further-classification>  
        <further-classification edition="201001120260206B">H01M4/583</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG MYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金世賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金緣伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEONYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜賢俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HYUN JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金韓娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃銖賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SUHYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於具有優異的分散性之新穎的碳奈米管，製造該碳奈米管之方法，碳奈米管分散液，包括該碳奈米管之電極結構，及包括該碳奈米管之二次電池。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to novel carbon nanotubes having excellent dispersibility, a method for manufacturing the carbon nanotubes, a carbon nanotube dispersion, an electrode structure including the carbon nanotubes, and a secondary battery including the carbon nanotubes.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1455" publication-number="202621482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於玻璃中介層之通孔及重佈線層形成製程</chinese-title>  
        <english-title>VIA AND REDISTRIBUTION LAYER FORMATION PROCESS FOR GLASS INTERPOSER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/20</main-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃茲尼　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOZNY, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏恩特　馬文路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNT, MARVIN LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了處理基板的方法和設備。在某些實施例中，處理基板的方法包括：在由玻璃製成的基板上形成第一圖案化遮罩；對基板的暴露部分進行蝕刻以形成複數個盲通孔；移除第一圖案化遮罩；在移除第一圖案化遮罩後在基板上形成第二圖案化遮罩；對基板暴露的第二部分進行蝕刻，以在複數個盲通孔中至少一個通孔的上部形成重佈線層（RDL）圖案；在複數個盲通孔及RDL圖案中沉積種晶層；並用金屬材料填充複數個盲通孔及RDL圖案，以形成複數個經填充通孔及重佈線層（RDL）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of processing a substrate includes: forming a first patterned mask on a substrate made of glass; etching exposed portions of the substrate to form a plurality of blind vias; removing the first patterned mask; forming a second patterned mask on the substrate after removing the first patterned mask; etching exposed second portions of the substrate to form a redistribution layer (RDL) pattern at an upper portion of at least one of the plurality of blind vias; depositing a seed layer in the plurality of blind vias and the RDL pattern; and filling the plurality of blind vias and the RDL pattern with a metal material to form a plurality of filled vias and a redistribution layer (RDL).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">114:步驟</p>  
        <p type="p">116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1456" publication-number="202620546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電活性化合物、包含該化合物的組合物以及圖案形成方法</chinese-title>  
        <english-title>ELECTROACTIVE COMPOUNDS, COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G03F7/004</main-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MINGQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卡德　埃馬德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AQAD, EMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫南德茲　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERNANDEZ, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　桃莉絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特雷福納斯　三世　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREFONAS III, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組合物包括：酸敏感聚合物，包括衍生自包括酸可分解基團之單體的第一重複單元；光酸產生劑化合物；非聚合物電子受體化合物，其電子親和能大於該光酸產生劑化合物之電子親和能，其中，該非聚合物電子受體化合物不產生光酸，以及其中，該非聚合物電子受體化合物不包括複數重氮萘醌(DNQ)基團；以及溶劑，其中，基於該組合物之總重量，該溶劑在該組合物中之含量大於50重量百分比，其中，該組合物係為正型EUV光阻或電子束阻劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition including an acid-sensitive polymer comprising a first repeating unit derived from a monomer comprising an acid-decomposable group; a photoacid generator compound; a non-polymeric electron acceptor compound that has a greater electron affinity than an electron affinity of the photoacid generator compound, wherein the non-polymeric electron acceptor compound does not generate a photoacid, and wherein the non-polymeric electron acceptor compound does not comprise a plurality of diazonaphthoquinone (DNQ) groups; and a solvent, wherein the solvent is present in the composition in an amount greater than 50 weight percent, based on total weight of the composition, wherein the composition is a positive-acting EUV photoresist or an electron beam resist.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1457" publication-number="202621285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括具有匹配功函數方案的堆疊晶體管的積體電路裝置及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS WITH MATCHED WORK FUNCTION SCHEME AND METHODS OF FABRICATION THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/17</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KANG-ILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供積體電路裝置和形成積體電路裝置的方法。積體電路裝置可包括基底上的第一電晶體；以及第一電晶體上的第二電晶體，其中第一電晶體在垂直於基底上表面的垂直方向上位於基底和第二電晶體之間，其中第一電晶體包括：在垂直方向上彼此間隔開的第一通道層；以及第一通道層上的第一功函數層，其中第二電晶體包括：在垂直方向上彼此間隔開的第二通道層；以及第二通道層上的第二功函數層，以及其中第二功函數層與第一通道層間隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices may include a first transistor on a substrate; and a second transistor on the first transistor, wherein the first transistor is between the substrate and the second transistor in a vertical direction that is perpendicular to an upper surface of the substrate, wherein the first transistor comprises: first channel layers that are spaced apart from each other in the vertical direction; and a first work function layer on the first channel layers, wherein the second transistor comprises: second channel layers that are spaced apart from each other in the vertical direction; and a second work function layer on the second channel layers, and wherein the second work function layer is spaced apart from the first channel layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積體電路裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:第一通道層</p>  
        <p type="p">104、110:功函數層</p>  
        <p type="p">104_I:第一內部功函數層</p>  
        <p type="p">104_O:第一外部功函數層</p>  
        <p type="p">106:絕緣體</p>  
        <p type="p">108:第二通道層</p>  
        <p type="p">110_I:第二內部功函數層</p>  
        <p type="p">110_IF:介面</p>  
        <p type="p">110_O:第二外部功函數層</p>  
        <p type="p">112、114:電晶體</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">W3:第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1458" publication-number="202620140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻燃性TPU薄膜</chinese-title>  
        <english-title>FLAME RETARDANT TPU FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C09D175/04</main-classification>  
        <further-classification edition="200601120260213B">C08L75/16</further-classification>  
        <further-classification edition="200601120260213B">C08G18/02</further-classification>  
        <further-classification edition="200601120260213B">C07H11/04</further-classification>  
        <further-classification edition="201801120260213B">C08K3/016</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨茲　奧列佛　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENZE, OLIVER STEFFEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾霍恩　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHLHORN, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種薄膜，其包含組成物（C1），該組成物（C1）包含75至98重量%範圍內之量之熱塑性聚氨酯（TPU-1）及2至25重量%範圍內之量之含磷添加劑（PA-1），以組成物（C1）之重量計，其中含磷添加劑（PA-1）選自由聚膦酸酯及磷酸酯組成之群，以及其用於黏合第一部件及第二部件之用途，特別是作為黏著膜之應用，較佳用於汽車工業製品、機械構造、消費品、電池或電動汽車製品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is directed to a film comprising a composition (C1) comprising a thermo-plastic polyurethane (TPU-1) in an amount in the range of from 75 to 98 % by weight, and a phosphorous containing additive (PA-1) in an amount in the range of from 2 to 25 % by weight, based on the weight of the composition (C1), wherein the phosphorous containing additive (PA-1) is selected from the group consisting of polyphosphonates and phosphoric acid esters.as well as the use thereof for bonding a first part and a second part, in particular for the application as an adhesive film, preferably for articles for the automobile industry, for machine construction, for consumer goods, batteries, or articles for e-mobility.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1459" publication-number="202621415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板保持裝置、基板處理裝置、及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE HOLDING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/10</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P72/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安武陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUTAKE, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川道明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MICHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井弘晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可減輕旋轉驅動部之負荷之技術。 &lt;br/&gt;本發明之基板保持裝置1具備多孔質構件21、支持構件221、旋轉驅動部25及保持驅動部24。多孔質構件21具有吸附帶框架之基板80中之膜82之吸附面21a。支持構件221包圍多孔質構件21，支持帶框架之基板80之框架81。旋轉驅動部25使支持構件221及多孔質構件21一體地旋轉。保持驅動部24係在相對於支持構件221與框架81為相反側，包含以與支持構件221隔開之狀態設置之磁鐵241，藉由磁鐵241之磁力將框架81按壓保持於支持構件221上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">21:多孔質構件</p>  
        <p type="p">21a:吸附面</p>  
        <p type="p">21b:側面</p>  
        <p type="p">21c:底面</p>  
        <p type="p">22:基座</p>  
        <p type="p">23:保持平台</p>  
        <p type="p">24:保持驅動部</p>  
        <p type="p">24a:磁極面</p>  
        <p type="p">24b:磁極面</p>  
        <p type="p">25:旋轉驅動部</p>  
        <p type="p">26:抽吸部</p>  
        <p type="p">27:驅動收容構件</p>  
        <p type="p">30:噴出部</p>  
        <p type="p">31:噴嘴</p>  
        <p type="p">32:供給管</p>  
        <p type="p">33:供給閥</p>  
        <p type="p">34:流量調整閥</p>  
        <p type="p">35:噴嘴移動驅動部</p>  
        <p type="p">71:防護件</p>  
        <p type="p">72:杯</p>  
        <p type="p">73:防護件升降驅動部</p>  
        <p type="p">80:帶框架之基板</p>  
        <p type="p">81:框架</p>  
        <p type="p">82:膜</p>  
        <p type="p">82a:主表面</p>  
        <p type="p">82b:主表面</p>  
        <p type="p">83:基板</p>  
        <p type="p">90:控制部</p>  
        <p type="p">221:支持構件</p>  
        <p type="p">222:底板</p>  
        <p type="p">241:磁鐵</p>  
        <p type="p">242:磁鐵移動驅動部</p>  
        <p type="p">251:軸</p>  
        <p type="p">252:馬達</p>  
        <p type="p">261:抽吸管</p>  
        <p type="p">262:抽吸閥</p>  
        <p type="p">263:抽吸驅動部</p>  
        <p type="p">H1:空隙</p>  
        <p type="p">Q1:旋轉軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1460" publication-number="202620001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鈣系碳酸化合物製造用之含CaO組成物、鈣系碳酸化合物之製造方法、鈣系碳酸化合物、無機質成形體及提升無機質成形體之CO2固定化率之方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260212B">C04B18/167</main-classification>  
        <further-classification edition="200601120260212B">C04B35/22</further-classification>  
        <further-classification edition="200601120260212B">C01F11/18</further-classification>  
        <further-classification edition="200601120260212B">C09K21/02</further-classification>  
        <further-classification edition="201801120260212B">C08K3/013</further-classification>  
        <further-classification edition="200601320260212B">C02F103/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神島化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONOSHIMA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松井誠二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里村秀昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOMURA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内田悠斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIDA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種能夠抑制對於環境之負荷，有效率地進行碳酸化反應之鈣系碳酸化合物製造用之含CaO組成物、使用上述含CaO組成物之鈣系碳酸化合物之製造方法、鈣系碳酸化合物、無機質成形體及提升無機質成形體之CO&lt;sub&gt;2&lt;/sub&gt;固定化率之方法。 &lt;br/&gt;[解決手段]本發明之鈣系碳酸化合物製造用之含CaO組成物之游離CaO之含有率為15質量%以上且未達50質量%，藉由雷射繞射法測得之平均粒徑為1 μm以上且50 μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1461" publication-number="202620150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱性複合矽氧片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">C09J7/22</main-classification>  
        <further-classification edition="200601120260202B">C08L83/05</further-classification>  
        <further-classification edition="200601120260202B">C08L83/14</further-classification>  
        <further-classification edition="201801120260202B">C08K3/105</further-classification>  
        <further-classification edition="200601120260202B">C09K5/06</further-classification>  
        <further-classification edition="200601120260202B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今泉圭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAIZUMI, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤晃洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村一晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導熱性複合矽氧片，具有：導熱性矽氧橡膠片、以及配置於前述導熱性矽氧橡膠片之單面或兩面且包含下述(A)～(D)之熱軟化性苯基矽氧凝膠層。藉此，可提供一種可賦予黏著性、且黏著賦予面可選擇、生產性高、且導熱性高之導熱性複合矽氧片。(A)在一分子中具有兩個以上之烯基、且苯基改質率為50%以上之苯基改質有機聚矽氧烷：100質量份；(B)有機氫聚矽氧烷：相對於上述(A)成分之烯基1莫耳，(B)成分之氫矽烷基之莫耳數為0.1莫耳～3莫耳之量；(C)鉑族金屬觸媒：相對於上述(A)成分之質量以換算成鉑族金屬原子之質量基準計為0.01 ppm～1,000 ppm；(D)非反應性苯基改質有機聚矽氧烷：相對於上述(A)成分，為1質量份～50質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1462" publication-number="202620167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱性矽氧組成物及其硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C09K5/08</main-classification>  
        <further-classification edition="200601120260210B">C09J183/05</further-classification>  
        <further-classification edition="200601120260210B">C09J183/07</further-classification>  
        <further-classification edition="200601120260210B">C08L83/10</further-classification>  
        <further-classification edition="200601120260210B">B01J23/40</further-classification>  
        <further-classification edition="200601120260210B">C08K3/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚田淳一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKADA, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種導熱性矽氧組成物，其包含如下成分：(A)一分子中具有2個以上的烯基之有機聚矽氧烷；(B)一分子中具有2個以上的矽氫基之有機氫聚矽氧烷，其由(B-1)及(B-2)所構成：(B)成分中的矽氫基相對於(A)成分中的鍵結於矽原子的烯基的總量莫耳比成為0.5～2.0的量，(B-1)由下述通式(1)表示的有機氫聚矽氧烷，(B-2)由下述通式(2)表示且僅在兩末端具有矽氫基之有機氫聚矽氧烷；(C)導熱性填充材料，其由下述(C-1)～(C-3)所構成；及，(D)鉑族金屬系硬化觸媒。藉此可提供一種導熱性矽氧組成物，其即使是高度填充有低成本的氧化鋁作為導熱性填充材料之組成物，在使組成物硬化時，硬度仍不會因自揉合結束起的時間經過發生變化而品質穩定。&lt;br/&gt;&lt;img align="absmiddle" height="180px" width="609px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="240px" width="618px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1463" publication-number="202620375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪廓形狀測定裝置以及該方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">G01B11/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神鋼科研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBELCO RESEARCH INSTITUTE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西山功兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIYAMA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古田洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明，係一種輪廓形狀測定裝置，其係根據攝像對於測定對象之周緣部，自外周之切線方向投射平行光而產生之周緣部之陰影而得之陰影圖像，測定周緣部之輪廓形狀；該輪廓形狀測定裝置之特徵為：以使平行光與測定對象之面沿著投光方向平行之方式，控制用以支承測定對象之第1至第3支承構件。前述第1至第3支承構件，係具備使測定對象之第1至第3支承位置往上下方向移動之第1至第3移動機構，於前述控制，係個別控制第1至第3移動機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:投光部</p>  
        <p type="p">2:攝像部</p>  
        <p type="p">3:光學系統保持部</p>  
        <p type="p">33:軸支承構件</p>  
        <p type="p">34:台座構件</p>  
        <p type="p">4-1:第1支承構件</p>  
        <p type="p">4-2:第2支承構件</p>  
        <p type="p">4-3:第3支承構件</p>  
        <p type="p">351:桿構件</p>  
        <p type="p">WK:測定對象</p>  
        <p type="p">AX:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1464" publication-number="202619960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對準裝置及自動搬送系統</chinese-title>  
        <english-title>ALIGNMENT APPARATUS AND AUTOMATED TRANSFER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B66F9/24</main-classification>  
        <further-classification edition="200601120260223B">B65G47/24</further-classification>  
        <further-classification edition="202401120260223B">G05D1/43</further-classification>  
        <further-classification edition="202401120260223B">G05D1/667</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商甲南設計工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONAN DESIGN INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田昌浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲川正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUKAWA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於將搭載於自動搬送機器人之載貨平台部更高精度地配置於規定之目標停止位置。 &lt;br/&gt;本發明構成為如下對準裝置1，其包含：前後位置檢測感測器3L，其用於檢測載貨平台部2之前後方向位置，固定於載貨平台部2之左右一側；前後位置檢測感測器3R，其用於檢測載貨平台部2之前後方向位置，固定於載貨平台部2之左右另一側；前後驅動機構4L，其可沿前後方向驅動載貨平台部2之左右一側；前後驅動機構4R，其可沿前後方向驅動載貨平台部2之左右另一側；左右位置檢測感測器5，其用於檢測載貨平台部2之左右方向位置，固定於載貨平台部2；及左右驅動機構6，其可沿左右方向驅動載貨平台部2；且對準裝置1可基於前後位置檢測感測器3L、3R之檢測結果，藉由前後驅動機構4L、4R進行相對於載貨平台部2之前後方向之位置調整，基於左右位置檢測感測器5之檢測結果，藉由左右驅動機構6進行載貨平台部2之左右方向之位置調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:對準裝置</p>  
        <p type="p">2:載貨平台部</p>  
        <p type="p">3L:第1前後位置檢測感測器/前後位置檢測感測器/感測器</p>  
        <p type="p">3R:第2前後位置檢測感測器/前後位置檢測感測器/感測器</p>  
        <p type="p">4L:第1前後驅動機構/前後驅動機構</p>  
        <p type="p">4R:第2前後驅動機構/前後驅動機構</p>  
        <p type="p">5:左右位置檢測感測器/感測器</p>  
        <p type="p">6:左右驅動機構</p>  
        <p type="p">7L,7R:氣缸</p>  
        <p type="p">AMR:自主移動車輛(自動搬送機器人)</p>  
        <p type="p">CO:搬送物</p>  
        <p type="p">II-II:線</p>  
        <p type="p">ML,MR:光反射標記</p>  
        <p type="p">VC:可動式V型載架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1465" publication-number="202620246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔膜、電池單元、單元堆、及氧化還原液流電池系統</chinese-title>  
        <english-title>MEMBRANE, BATTERY CELL, CELL STACK, AND REDOX FLOW BATTERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C25B1/46</main-classification>  
        <further-classification edition="200601120260209B">H01M8/20</further-classification>  
        <further-classification edition="202101120260209B">H01M50/403</further-classification>  
        <further-classification edition="202101120260209B">H01M50/426</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大矢正幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OYA, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川越吉恭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGOE, YOSHIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森内清晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIUCHI, KIYOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之隔膜係用於氧化還原液流電池系統之電池單元者，且具備：基材，其具有陽離子透過性；及被覆層，其覆蓋上述基材之第一面及第二面之至少一部分；上述被覆層包含含氮聚合物及含氟聚合物。上述含氟聚合物具有陽離子透過性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:隔膜</p>  
        <p type="p">4:基材</p>  
        <p type="p">5:被覆層</p>  
        <p type="p">10:電池單元</p>  
        <p type="p">14:正極電極</p>  
        <p type="p">15:負極電極</p>  
        <p type="p">41:第一面</p>  
        <p type="p">42:第二面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1466" publication-number="202620097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面保護膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C08G71/04</main-classification>  
        <further-classification edition="201801120260211B">C09J7/22</further-classification>  
        <further-classification edition="200601120260211B">C09J175/14</further-classification>  
        <further-classification edition="200601120260211B">B32B27/40</further-classification>  
        <further-classification edition="201901120260211B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舟木千尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNAKI, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種能夠表現出優異之捲曲抑制能力，較佳為進而能夠表現出優異之輕剝離性或優異之低污染性的表面保護膜。又，本發明之課題在於提供一種包含此種表面保護膜之光學構件或電子構件。 &lt;br/&gt;本發明之實施方式之表面保護膜係包含基材及黏著劑層者，該黏著劑層包含胺基甲酸酯系黏著劑，該胺基甲酸酯系黏著劑由胺基甲酸酯系黏著劑組合物形成，該胺基甲酸酯系黏著劑組合物包含基礎聚合物(A)、多官能異氰酸酯化合物(B)、及輕剝離劑(C)，該基礎聚合物(A)包含胺基甲酸酯預聚物，且該表面保護膜於溫度23℃下放置30分鐘後在剝離速度3 mm/分鐘下之對玻璃板之低速剪切力為1000 gf/100 mm&lt;sup&gt;2&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材</p>  
        <p type="p">2:黏著劑層</p>  
        <p type="p">3:剝離襯墊</p>  
        <p type="p">10:表面保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1467" publication-number="202620144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136966</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09G1/02</main-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification>  
        <further-classification edition="200601120260223B">C08L1/26</further-classification>  
        <further-classification edition="200601120260223B">C08L29/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井春雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, HARUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井貴俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中優己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋公亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, KOHSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種研磨後的表面之濕潤性良好、且可有效地抑制霧狀刮痕等缺陷之研磨用組合物。提供一種研磨用組合物，包括研磨粒、鹼性化合物、纖維素衍生物、縮醛化聚乙烯醇、界面活性劑及水。於此，上述界面活性劑為分子量為2900以下的界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1468" publication-number="202620163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09K3/14</main-classification>  
        <further-classification edition="200601120260223B">C09G1/02</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification>  
        <further-classification edition="201201120260223B">B24B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井春雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, HARUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井貴俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中優己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種研磨後的表面之濕潤性良好、且可有效地抑制霧狀刮痕等缺陷之研磨用組合物。提供一種研磨用組合物，包括研磨粒、鹼性化合物、纖維素衍生物、改質聚乙烯醇系聚合物A、界面活性劑及水。於此，上述改質聚乙烯醇系聚合物A的重量平均分子量Mw為90000以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1469" publication-number="202621184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>協調通訊方案中的存取點識別符指派</chinese-title>  
        <english-title>ACCESS POINT IDENTIFIER ASSIGNMENT IN COORDINATED COMMUNICATION SCHEMES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W88/08</main-classification>  
        <further-classification edition="200901120260202B">H04W28/18</further-classification>  
        <further-classification edition="200901120260202B">H04W84/12</further-classification>  
        <further-classification edition="200901120260202B">H04W24/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊希　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHISCI, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　高朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, GAURANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉姆卡　桑凱特桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALAMKAR, SANKET SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾瓦　謝里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELWA, SHERIEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於在協調通訊方案中之存取點(AP)識別符(ID)指派的方法、組件、裝置、及系統。一第一存取點傳輸包括一第一組欄位的一第一訊框。該第一組欄位可包括一第一欄位，該第一欄位提議與一第二AP相關聯的一識別符以用於可包括該第一AP及至少該第二AP的一協調AP (CAP)方案。該第一AP可接收包括一第二組欄位的一第二訊框。該第二組欄位可具有一第二欄位，該第二欄位包括該第二AP是否接受與該第二AP相關聯的該ID以用於該CAP方案的一指示。該第一AP可根據該CAP方案及該第二訊框來與一或多個無線站台(STA)通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices and systems for access point (AP) identifier (ID) assignment in coordinated communication schemes. A first access point transmit a first frame that includes a first set of fields. The first set of fields may include a first field proposing an identifier associated with a second AP for a coordinated AP (CAP) scheme, which may include the first AP and at least the second AP. The first AP may receive a second frame that includes a second set of fields. The second set of fields may have a second field including an indication of whether the second AP accepts the ID associated with the second AP for the CAP scheme. The first AP may communicate with one or more wireless stations (STAs) in accordance with the CAP scheme and the second frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102-a:無線存取點(AP)</p>  
        <p type="p">102-b:無線存取點(AP)</p>  
        <p type="p">104:無線站台(STA)</p>  
        <p type="p">300:傳訊圖</p>  
        <p type="p">302-a:訊框</p>  
        <p type="p">302-b:訊框</p>  
        <p type="p">304-a:通訊鏈路</p>  
        <p type="p">304-b:通訊鏈路</p>  
        <p type="p">304-c:通訊鏈路</p>  
        <p type="p">304-d:通訊鏈路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1470" publication-number="202621247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磊晶超晶格結構</chinese-title>  
        <english-title>EPITAXIAL SUPERLATTICE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/815</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝　瑞英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, RUIYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北島知彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜昌錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHANG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴德　艾咪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHILD, AMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在3D DRAM元件中描述了減少晶圓翹曲的方法，這些方法使用的堆疊包括磊晶矽（Si）、摻碳矽（SiC）、鍺矽（SiGe）和摻碳鍺矽（SiGeC）中的一或多者。在基板表面形成複數個膜堆疊，每個膜堆疊包含兩個具有不同摻雜物含量的摻雜矽層和可以是摻雜或未摻雜的犧牲層。也描述了3D DRAM元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of reducing wafer bowing in 3D DRAM devices are described using stacks including one or more of epitaxial silicon (Si), carbon doped silicon (SiC), silicon germanium (SiGe), and carbon-doped silicon germanium (SiGeC). A plurality of film stacks is formed on a substrate surface, each of the film stacks comprises two doped silicon layers having different dopant amounts and a sacrificial layer that may be doped or undoped. 3D DRAM devices are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">120:膜堆疊</p>  
        <p type="p">122:矽通道層</p>  
        <p type="p">124:第一摻雜矽層</p>  
        <p type="p">124b:第四摻雜矽層</p>  
        <p type="p">126:第二摻雜矽層</p>  
        <p type="p">126b:第三摻雜矽層</p>  
        <p type="p">128:層</p>  
        <p type="p">140:記憶體孔開口</p>  
        <p type="p">II:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1471" publication-number="202620103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於改善聚醯胺穩定性之低熔點羧醯胺受阻胺光穩定劑（ＨＡＬＳ）</chinese-title>  
        <english-title>LOW MELTING CARBOXAMIDE HALS FOR IMPROVED STABILIZATION OF POLYAMIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C08J3/22</main-classification>  
        <further-classification edition="200601120260205B">C08L77/02</further-classification>  
        <further-classification edition="200601120260205B">C08G69/02</further-classification>  
        <further-classification edition="201801120260205B">C08K3/014</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商克萊瑞特國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLARIANT INTERNATIONAL LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝伯倫　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHEIBELEIN, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史提夫納　帕斯寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEFFANUT, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾努普利　蘇利魯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMNUAYPORNSRI, SUREERUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史凱勒　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHALLER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫施貝克　賈娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRSCHBECK, JANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於用於增強聚合物或樹脂熔融加工及長期穩定性、耐熱性、耐光性及耐氧化性之低分子量受阻胺光穩定劑(HALS)(LMW-HALS)。本發明亦關於穩定劑母料，以及包含此等穩定劑及聚合物或樹脂之組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a low molecular weight HALS stabilizer (LMW-HALS) for enhancing the melt-processing and long-term stability, which are characterized by heat resistance, light resistance and oxidation resistance of the polymer or resin.&lt;u/&gt;The present invention also relates to a stabilizer masterbatch and a composition comprising such stabilizer and a polymer or resin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1472" publication-number="202620195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備生物晶片的方法及其製備出的生物晶片</chinese-title>  
        <english-title>METHOD FOR PREPARING BIOCHIP AND BIOCHIP PREPARED THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260209B">C12Q1/6825</main-classification>  
        <further-classification edition="200601120260209B">G01N27/414</further-classification>  
        <further-classification edition="200601120260209B">G01N33/543</further-classification>  
        <further-classification edition="200601120260209B">G01N33/569</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長典生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVASCOPE DIAGNOSTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭昶甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHANG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王亮晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁慈珮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHI-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製備生物晶片的方法。該方法包含將含有生物素(biotin)之一第一溶液塗佈一晶片，以形成一生物素塗佈晶片，其中該第一溶液中的生物素具有一第一濃度；將該生物素塗佈晶片置於含有中性親和素(neutravidin)之一第二溶液，以形成一中性親和素-生物素塗佈晶片，其中該第二溶液中的中性親和素具有一第二濃度；及將該中性親和素-生物素塗佈晶片置於含有生物素化探針之一第三溶液，以形成該生物晶片，其中該第一濃度及該第二濃度具有一第一莫耳比為1:1、1:0.25或1:2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method for preparing a biochip. The method includes coating a chip with a first solution of biotin to form a biotin-coated chip, wherein the biotin in the first solution is at a first concentration; subjecting the biotin-coated chip to a second solution of neutravidin to form a neutravidin/biotin-coated chip, wherein the neutravidin in the second solution is at a second concentration; and subjecting the neutravidin/biotin-coated chip to a third solution of a biotinylated probe to form the biochip, wherein a first molar ratio of the first concentration to the second concentration is 1:1, 1:0.25, or 1:2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1473" publication-number="202621099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於行動通訊中優化延遲狀態回報之方法及裝置</chinese-title>  
        <english-title>METHODS AND APPARATUSES FOR ENHANCED DELAY STATUS REPORTING IN MOBILE COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260202B">H04L47/28</main-classification>  
        <further-classification edition="202301120260202B">H04W72/21</further-classification>  
        <further-classification edition="200901120260202B">H04W28/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李衍毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出用於行動通訊中優化延遲狀態回報（Delay Status Reporting，DSR）的方案。適用之裝置（如：使用者設備(User Equipment，UE)）可從一網路節點接收一設定，該設定可包含一剩餘時間門檻，用於觸發針對一邏輯通道群組（Logical Channel Group，LCG）內之一或多個邏輯通道之一DSR程序。所述裝置根據該剩餘時間門檻觸發該DSR程序。接著，所述裝置於觸發該DSR程序時，向該網路節點傳送一DSR媒體存取控制（Medium Access Control，MAC）控制元素（Control Element，CE），其中該DSR MAC CE包含該LCG之複數個延遲狀態資訊項目（entry），每一項目包含一對（pair）剩餘時間欄位與緩衝區大小欄位、以及一擴展（extension，EXT）欄位，該EXT欄位係用以指示於一後續項目中是否存在針對相同LCG之額外一對剩餘時間欄位與緩衝區大小欄位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various solutions for enhanced delay status reporting (DSR) in mobile communications are described. An apparatus may receive a configuration from a network node. The configuration may include a remaining time threshold for triggering a DSR procedure for one or more logical channels within a logical channel group (LCG). Then, the apparatus may trigger the DSR procedure based on the remaining time threshold. Responsive to triggering the DSR procedure, the apparatus may transmit a DSR medium access control (MAC) control element (CE) to the network node. The DSR MAC CE may include a plurality of entries of delay status information for the LCG, each entry including a pair of a remaining time field and a buffer size field, and an extension (EXT) field indicative of whether an additional pair of the remaining time field and the buffer size field is present for the same LCG in a subsequent entry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:程序</p>  
        <p type="p">810~830:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1474" publication-number="202619768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有複合結構面板的高爾夫球桿頭</chinese-title>  
        <english-title>GOLF CLUB HEAD WITH COMPOSITE FACEPLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260210B">A63B53/04</main-classification>  
        <further-classification edition="201501120260210B">A63B53/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡斯登製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARSTEN MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>習爾　馬修Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIER, MATTHEW T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫里斯　艾力克Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORALES, ERIC J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝肯　柯瑞Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BACON, CORY S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布貝克　柯爾Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUBAKER, COLE D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫頓　泰勒Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORTON, TAYLOR T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布羅克司漢　馬克Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOXHAM, MARK C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘伯亞　耶穌Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAMBOA, JESUS D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙內特　米切爾Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMONET, MITCHELL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有複合結構面板的高爾夫球桿頭，其複合結構面板上包含有位於底部且可改善球體飛行特徵的擊球反應調節結構。該擊球反應調節結構(IRM)包括一殼體，其複數殼體壁面之間形成有一孔洞。該面板是以高強度材料形成殼體壁面，因而能夠在結構上加固IRM，藉此改善面板撓曲，同時維持充分耐用性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Golf club heads have a composite faceplate having an Impact Response Modulator disposed in the sole to improve ball flight characteristics. The Impact Response Modulator (IRM) includes a casing with a plurality of casing walls that form an aperture therebetween. The faceplate structurally reinforces the IRM by forming the casing walls out of high-strength material, thereby improving faceplate deflection while maintaining sufficient durability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:本體</p>  
        <p type="p">102:擊球面</p>  
        <p type="p">104:踵部</p>  
        <p type="p">105:插鞘</p>  
        <p type="p">106:趾部</p>  
        <p type="p">110:冠部</p>  
        <p type="p">112:底部</p>  
        <p type="p">116:底部反折區域</p>  
        <p type="p">120:擊球反應調節結構(以下稱為「IRM」)</p>  
        <p type="p">130:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1475" publication-number="202621199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路圖案的製造方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H05K1/02</main-classification>  
        <further-classification edition="200601120260223B">H05K3/10</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本發條股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NHK SPRING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野晋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種電路圖案的製造方法，其能夠不追加步驟而在電路圖案上形成凹部。[解決手段]一種電路圖案的製造方法，其具備：圖案形成步驟，其藉由對銅板材W的雙面蝕刻，形成電路圖案半製品25，所述電路圖案半製品25中圖案化之電路導體3a以相對較薄的結合部23結合；以及電路形成步驟，其藉由對電路圖案半製品25的單面蝕刻，去除結合部23並在該電路導體3a的表面形成凹部30。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:金屬基底電路基板</p>  
        <p type="p">3:電路圖案</p>  
        <p type="p">3a:電路導體</p>  
        <p type="p">3b:中間部</p>  
        <p type="p">3c:上表面</p>  
        <p type="p">3d:下表面</p>  
        <p type="p">3e,3f:表面</p>  
        <p type="p">5:金屬基板</p>  
        <p type="p">7:絕緣層</p>  
        <p type="p">30:凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1476" publication-number="202621275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D30/47</main-classification>  
        <further-classification edition="202601120260223B">H10W40/50</further-classification>  
        <further-classification edition="202501120260223B">H10D62/824</further-classification>  
        <further-classification edition="202601120260223B">H10W40/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新唐科技日本股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西尾明彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIO, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林茂生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SHIGEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可以使溫度的偵測精度提升之半導體裝置等。&lt;br/&gt; [解決手段]一種半導體裝置，具備：基板101；第1氮化物半導體層103，設置在基板101之上；第2氮化物半導體層104，設置在第1氮化物半導體層103之上；二維電子氣體層105，設置在第1氮化物半導體層103與第2氮化物半導體層104的邊界附近；源極電極301及汲極電極302，分別電連接於第1氮化物半導體層103；及閘極電極401，與源極電極301及汲極電極302隔著間隔而設置，在基板101上有活性區域701，前述半導體裝置更具備：第1溫度偵測用電阻體601，用於偵測活性區域701中的閘極電極401的第1溫度；及第2溫度偵測用電阻體602，用於偵測活性區域701中的閘極電極401與汲極電極302之間的第2溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">102:緩衝層</p>  
        <p type="p">103:第1氮化物半導體層</p>  
        <p type="p">104:第2氮化物半導體層</p>  
        <p type="p">105:二維電子氣體層</p>  
        <p type="p">106:第3氮化物半導體層</p>  
        <p type="p">201:第1絕緣層</p>  
        <p type="p">202:第2絕緣層</p>  
        <p type="p">203:第3絕緣層</p>  
        <p type="p">204:第4絕緣層</p>  
        <p type="p">301:源極電極</p>  
        <p type="p">302:汲極電極</p>  
        <p type="p">401:閘極電極</p>  
        <p type="p">501:源極場板電極(場板)</p>  
        <p type="p">601:第1溫度偵測用電阻體</p>  
        <p type="p">602:第2溫度偵測用電阻體</p>  
        <p type="p">801:第1配線層</p>  
        <p type="p">801a:源極/汲極電極連接用開口部</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1477" publication-number="202620213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎢合金線</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C22F1/18</main-classification>  
        <further-classification edition="200601120251201B">H01B5/12</further-classification>  
        <further-classification edition="200601120251201B">C22C27/04</further-classification>  
        <further-classification edition="200601120251201B">B01D39/12</further-classification>  
        <further-classification edition="200601120251201B">F02K9/34</further-classification>  
        <further-classification edition="200601120251201B">G01N23/203</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中畔哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAAZE, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸中英喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUNAKA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井孝昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TAKAMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村朗斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, AKITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本多亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鎢合金線(1)含有鎢與錸之合金作為主成分，其線徑未達40μm，在與鎢合金線(1)之線軸平行的剖面中，晶粒之長徑與短徑的長寬比之平均值係10以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鎢合金線</p>  
        <p type="p">2:捲線架</p>  
        <p type="p">10:網狀物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1478" publication-number="202621033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可變頻率高頻電源</chinese-title>  
        <english-title>VARIABLE HIGH-FREQUENCY POWER SUPPLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260212B">H02M7/48</main-classification>  
        <further-classification edition="200601120260212B">H02M1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京三製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOSAN ELECTRIC MFG. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUZURIHARA, ITSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米山知宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEYAMA, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林昌平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細山田悠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOYAMADA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之可變頻率高頻電源，係具備有：多重變流器；合成部，合成多重變流器的變流器輸出；及低通濾波器，多重變流器及合成部，係藉由相位差控制抑制第n次以下的奇數次高諧波，低通濾波器，係藉由濾波器特性，抑制雖以多重變流器之相位差控制抑制而殘餘的第(n+2)以下之高階的奇數次高諧波之高諧波。藉由相位差控制與低通濾波器，實現使輸出信號之頻率在寬頻帶成為可變的高頻電源(RF產生器)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variable high-frequency power supply of the present invention includes a multiplex inverter, a combining unit that combines inverter outputs of the multiplex inverter, and a low-pass filter. The multiplex inverter and the combining unit suppress odd harmonics of n-th order or lower by phase difference control, and the low-pass filter suppresses, due to filter characteristics, the odd harmonics of high order, which is (n+2)th order or lower, that remain after the suppression by the phase difference control by the multiplex inverter. The phase difference control and the low-pass filter implement a high-frequency power supply, or RF generator, that varies the frequency of an output signal at a wide band.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:直流電源</p>  
        <p type="p">2:多重變流器</p>  
        <p type="p">2a~2d:變流器</p>  
        <p type="p">3:控制部</p>  
        <p type="p">3A:可變頻率控制部</p>  
        <p type="p">3B:相位差控制部</p>  
        <p type="p">4:合成部</p>  
        <p type="p">5:低通濾波器</p>  
        <p type="p">10:可變頻率高頻電源</p>  
        <p type="p">Q1~Q4:切換元件</p>  
        <p type="p">β&lt;sub&gt;1&lt;/sub&gt;,β&lt;sub&gt;2&lt;/sub&gt;:相位差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1479" publication-number="202621375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及蝕刻裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P50/24</further-classification>  
        <further-classification edition="202601120260223B">H10P76/40</further-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李暁竜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種形成良好之蝕刻形狀之蝕刻方法及蝕刻裝置。 &lt;br/&gt;本發明之蝕刻方法具有以下工序：準備基板，上述基板具有含有矽之蝕刻對象層、及形成於上述蝕刻對象層之上且具有開口圖案之遮罩層；及將HBr、SF&lt;sub&gt;6&lt;/sub&gt;、O&lt;sub&gt;2&lt;/sub&gt;之混合氣體作為處理氣體，產生上述處理氣體之電漿，經由上述遮罩層之上述開口而對上述蝕刻對象層進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1480" publication-number="202620376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學總成</chinese-title>  
        <english-title>OPTICAL ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">G01B11/24</main-classification>  
        <further-classification edition="200601120260215B">G02B17/06</further-classification>  
        <further-classification edition="200601120260215B">G02B27/18</further-classification>  
        <further-classification edition="200601120260215B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁福建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, FUJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王莉蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裘布　艾達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOOBEUR, ADEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾登迪傑克　沃佛瑞德　愛德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDENDIJK, WILFRED EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一構形量測系統之光學總成，該光學總成包括：一第一反射器；一第二反射器；及一第三反射器，其定位成使得該第二反射器沿著該第一反射器與該第三反射器之間的一光學路徑定位，其中該第一反射器之一焦距與該第三反射器之一焦距不同，使得該第一反射器之該焦距與該第三反射器之該焦距的比率促成了該光學總成的一放大率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical assembly for a topography measurement system, the optical assembly including: a first reflector; a second reflector; and a third reflector located such that the second reflector is located along an optical path between the first reflector and the third reflector, wherein a focal length of the first reflector is different from a focal length of the third reflector such that the ratio of the focal length of the first reflector to the focal length of the third reflector contributes to a magnification of the optical assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:光學總成</p>  
        <p type="p">21:第一反射器</p>  
        <p type="p">22:第二反射器</p>  
        <p type="p">23:第三反射器</p>  
        <p type="p">24:反射元件</p>  
        <p type="p">25:反射元件</p>  
        <p type="p">BE1:輻射光束</p>  
        <p type="p">LSB:輻射光束</p>  
        <p type="p">LSO:輻射源</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1481" publication-number="202620036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>肽酪胺酸－酪胺酸（ＰＹＹ）類似物及ＧＬＰ－１Ｒ促效劑之組合療法</chinese-title>  
        <english-title>COMBINATION THERAPY OF PEPTIDE TYROSINE-TYROSINE (PYY) ANALOGUES AND GLP-1R AGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C07K14/575</main-classification>  
        <further-classification edition="200601120260209B">A61K31/506</further-classification>  
        <further-classification edition="200601120260209B">A61K31/44</further-classification>  
        <further-classification edition="200601120260209B">A61K31/4184</further-classification>  
        <further-classification edition="200601120260209B">A61P9/00</further-classification>  
        <further-classification edition="200601120260209B">A61P3/00</further-classification>  
        <further-classification edition="200601120260209B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡默療法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARMOT THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查克拉梵爾西　瑪奴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKRAVARTHY, MANU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里奎茲　羅德里奎茲　魯賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ RODRIGUEZ, RUBEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅　江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及：使用肽酪胺酸-酪胺酸 (PYY) 類似物與 GLP-1R 促效劑、特定而言 GLP-1R/GIPR 促效劑之組合的組合療法；該等組合療法用於治療代謝疾患之用途；以及使用該等組合療法之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to combination therapies employing a Peptide Tyrosine-Tyrosine (PYY) analogue in combination with a GLP-1R agonist, in particular a GLP-1R/GIPR agonist, the use of these combination therapies for the treatment of a metabolic disorder and methods of using the combination therapies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1482" publication-number="202620558"> 
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      <tif no="1" file="202620558.zip"/>
    </tif-files>
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      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260208B">G05B13/02</main-classification>  
        <further-classification edition="201201120260208B">G06Q50/04</further-classification>  
        <further-classification edition="202401120260208B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATOH, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]能夠一邊對二氧化碳氣體排放量施加規定限制，一邊生產物品。 &lt;br/&gt;　　[解決手段]推定部(141)，當電氣類系統消耗電力量，則推定該電力量在發電時所排放的二氧化碳氣體排放量。此電器類系統是用於物品的生產。推定部(141)，當該電氣類系統中構成系統的各個電氣機器，以規定動作模式運作，按照規定生產計劃資訊進行物品的生產時，則推定二氧化碳氣體排放量。決定部(142)，是針對構成電氣類系統的各個電氣機器，使用排放量的推定結果，決定出排放量滿足規定限制條件時的動作模式。控制部(150)，是控制構成電氣類系統的各個電氣機器，使用已決定之動作模式來進行運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:最佳化系統</p>  
        <p type="p">110:輸入受理部</p>  
        <p type="p">120:通訊部</p>  
        <p type="p">121:外部資料庫通訊功能</p>  
        <p type="p">122:算出系統通訊功能</p>  
        <p type="p">123:生產管理系統通訊功能</p>  
        <p type="p">124:PLC通訊功能</p>  
        <p type="p">130:資料囤積部</p>  
        <p type="p">140:模擬運算部</p>  
        <p type="p">141:推定部</p>  
        <p type="p">142:決定部</p>  
        <p type="p">150:控制部</p>  
        <p type="p">151:動作模式變更功能</p>  
        <p type="p">152:生產計劃變更功能</p>  
        <p type="p">160:機械學習部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1483" publication-number="202620393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01L1/00</main-classification>  
        <further-classification edition="200601120260211B">G01L1/20</further-classification>  
        <further-classification edition="201701120260211B">C01B32/158</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人電氣通信大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF ELECTRO-COMMUNICATIONS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原佳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIHARA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横井浩史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野泰之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布施啓示</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSE, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓力感測器(100)，其具備：具有導電性線狀體(20)與非導電性纖維(40)的導電性布材(10)；及設置在與前述導電性布材(10)相對向的位置的導電性構件(30)。壓力感測器(100)係前述導電性構件(30)未朝向前述導電性布材(10)靠近的方向作用有外力時，前述導電性線狀體(20)與前述導電性構件(30)被前述非導電性纖維(40)隔開，為電性絕緣的非導通狀態，前述導電性構件(30)朝向前述導電性布材(10)靠近的方向作用有外力時，前述導電性構件(30)的至少一部分推開前述非導電性纖維(40)之間，前述導電性構件(30)與前述導電性線狀體(20)為電性連接的導通狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導電性布材</p>  
        <p type="p">10A:導電性布材的第1主面</p>  
        <p type="p">10B:導電性布材的第2主面</p>  
        <p type="p">11:第1層</p>  
        <p type="p">12:第2層</p>  
        <p type="p">13:第3層</p>  
        <p type="p">20:導電性線狀體</p>  
        <p type="p">30:導電性構件</p>  
        <p type="p">30A:導電性構件的第1主面</p>  
        <p type="p">30B:導電性構件的第2主面</p>  
        <p type="p">40:非導電性纖維</p>  
        <p type="p">100:壓力感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1484" publication-number="202621392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工方法、雷射加工裝置、及半導體器件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P54/30</main-classification>  
        <further-classification edition="201401120260223B">B23K26/53</further-classification>  
        <further-classification edition="201401120260223B">B23K26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>是松克洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREMATSU, KATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三山恭弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUYAMA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射加工方法，係用以藉由對對象物照射雷射光，沿著順著前述對象物的前述雷射光的入射面的前述對象物的內部的假想面進行加工的雷射加工方法，具備：對從與前述入射面交叉的Z方向看時的前述對象物的一部分即第1部分，藉由沿著前述假想面將前述雷射光照射至前述對象物，在前述第1部分沿著前述假想面形成複數改質區域的第1加工工程；在前述第1加工工程之後，對從前述Z方向看時的前述對象物的另一部分即第2部分，藉由沿著前述假想面將前述雷射光照射至前述對象物，在前述第2部分沿著前述假想面形成複數改質區域的第2加工工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:對象物</p>  
        <p type="p">11a:第1面</p>  
        <p type="p">12:改質區域</p>  
        <p type="p">13:龜裂</p>  
        <p type="p">111:第1部分</p>  
        <p type="p">112:第2部分</p>  
        <p type="p">A:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1485" publication-number="202620906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁通產生構件、感測器以及致動器</chinese-title>  
        <english-title>MAGNETIC FLUX GENERATING COMPONENT,SENSOR, AND ACTUATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">H01F10/10</main-classification>  
        <further-classification edition="200601120260215B">H01F7/02</further-classification>  
        <further-classification edition="202101120260215B">G02B7/04</further-classification>  
        <further-classification edition="200601120260215B">H02K41/00</further-classification>  
        <further-classification edition="200601120260215B">G01D5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＤＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原良元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, RYOGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>眞保信之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMBO, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">磁通產生構件包括：基材、以及形成於前述基材之表面的磁性體膜，一個前述磁性體膜包括在相異方向上磁化的第一區域與第二區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic flux generating component includes a substrate, and a magnetic flim formed on the surface of the substrate, wherein one of said magnetic film has a first section and a second section magnetized in different directions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:磁通產生構件</p>  
        <p type="p">10:磁性體膜</p>  
        <p type="p">11:第一區域</p>  
        <p type="p">12:第二區域</p>  
        <p type="p">20:基材</p>  
        <p type="p">21:第一面</p>  
        <p type="p">22:第二面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1486" publication-number="202621460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於清洗製程的終點偵測之方法及設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR ENDPOINT DETECTION OF A CLEANING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/20</main-classification>  
        <further-classification edition="202601120260223B">H10P70/00</further-classification>  
        <further-classification edition="202601120260223B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列支敦斯登商英飛康股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFICON AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉皮多特　馬丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAPIDOT, MATAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫維契柯　伊格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUVYCHKO, IGOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於偵測或預測真空沉積系統中清洗製程的終點之設備(10)，其中該設備包括：&lt;br/&gt; 一製程室(1)，其內部可透過該清洗製程來進行清洗；&lt;br/&gt; 一真空泵裝置(2)，其透過一排氣管線(3)連接至該製程室；&lt;br/&gt; 一限流元件(4)(特別是一節流閥)，其位於該排氣管線中，用於界定在該製程室與該限流元件之間的該排氣管線之一上游部分(3')，並且用於界定在該限流元件與該真空泵裝置之間的該排氣管線之一下游部分(3'')；&lt;br/&gt; 一真空計(5)，其佈置成用於測量該排氣管線的該下游部分中的壓力；以及&lt;br/&gt; 一處理單元(6)，其佈置及配置成評估該真空計測量的壓力值之時間過程並偵測該清洗製程的終點。&lt;br/&gt; 本發明的範圍進一步包括一種裝置(11)及一種方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus (10) for detecting or predicting an end point of a cleaning process in a vacuum deposition system, wherein the apparatus comprises&lt;br/&gt; - a process chamber (1), the interior of which can be cleaned by said cleaning process,&lt;br/&gt; - a vacuum pump arrangement (2) connected to said process chamber via an exhaust line (3),&lt;br/&gt; - a flow restriction element (4), in particular a throttle valve, in said exhaust line, defining an upstream part (3') of the exhaust line between the process chamber and the flow restriction element, and defining a downstream part (3'') of the exhaust line be flow restriction element an the vacuum pump arrangement,&lt;br/&gt; - a vacuum gauge (5) arranged to measure a pressure in said downstream part of the exhaust line, and&lt;br/&gt; - a processing unit (6) arranged and configured to evaluate a time course of pressure values measured by said vacuum gauge and to detect the end point of said cleaning process.&lt;br/&gt; Further in the scope of the invention are a device (11) and a method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:製程室</p>  
        <p type="p">2:真空泵裝置</p>  
        <p type="p">3:排氣管線</p>  
        <p type="p">3':(排氣管線的)上游部分</p>  
        <p type="p">3":(排氣管線的)下游部分</p>  
        <p type="p">4:限流元件</p>  
        <p type="p">5:真空計</p>  
        <p type="p">6:處理單元</p>  
        <p type="p">7:通信連接</p>  
        <p type="p">8:顯示單元</p>  
        <p type="p">9:閥(用於進氣口)</p>  
        <p type="p">10:設備(用於偵測或預測清洗製程的終端)</p>  
        <p type="p">11:裝置</p>  
        <p type="p">C[p(t)]:根據壓力的時間過程獲得的標準</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1487" publication-number="202620422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光導製造的可切片塊中間物的小平面解析檢查</chinese-title>  
        <english-title>FACET-RESOLVED INSPECTION OF SLICEABLE BLOCK INTERMEDIATES FOR LIGHTGUIDE MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">G01N21/958</main-classification>  
        <further-classification edition="200601120260215B">G01N21/25</further-classification>  
        <further-classification edition="200601120260215B">G01B11/26</further-classification>  
        <further-classification edition="201901120260215B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商魯姆斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMUS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅寧　埃坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RONEN, EITAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅巴欽斯基　莉雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOBACHINSKY, LILYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使用來自照明源的多色的、基本上準直的照明來檢查具有相互平行的部分反射內表面的中間工作產品（堆疊或切片）塊，照明源沿著注入幾何形狀注入光束，該光束以塗層設計範圍內或附近的角度穿過表面。來自表面的部分反射形成離開輸出表面的表面特定的偏轉光束。耦合棱鏡優選地針對光束的進入和離開提供正交的外部面。具有光學器件的成像感測器對圖像採樣平面進行成像以生成顏色量化輸出圖像集。處理系統分割小平面索引區域並且評估包括顏色和可選的亮度的一個或更多個均勻性條件，並且輸出製造決策，例如接受/拒絕產品或前饋參數更新。還提供了用於驗證內表面的平行度的變型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intermediate work product (stack or slice) block with mutually parallel, partially reflective internal surfaces is inspected using multichromatic, substantially collimated illumination from an illumination source that injects a beam along an injection geometry that traverses the surfaces at angles within or near coating design ranges. Partial reflections from the surfaces form surface-specific deflected beams that exit an output surface. Coupling prisms preferably provide orthogonal external faces for entry and exit of the beams. An imaging sensor with optics images an image sampling plane to generate a color-quantifying output image set. A processing system segments facet-indexed regions and assesses one or more uniformity conditions, including color and optionally luminance, and outputs a manufacturing decision, such as accepting/rejecting the product or feedforward parameter updates. A variant for verifying parallelism of the internal surfaces is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:堆疊</p>  
        <p type="p">32:部分反射內表面</p>  
        <p type="p">38:懸突頂板</p>  
        <p type="p">52:輸入耦合棱鏡</p>  
        <p type="p">52a、53a:外表面</p>  
        <p type="p">52b:輸出表面</p>  
        <p type="p">53:輸出耦合棱鏡</p>  
        <p type="p">53b:表面</p>  
        <p type="p">6:光束</p>  
        <p type="p">60:多色照明佈置</p>  
        <p type="p">61:成像感測器</p>  
        <p type="p">66:圖像採樣平面</p>  
        <p type="p">7:偏轉光束</p>  
        <p type="p">70:致動定位台</p>  
        <p type="p">8:透鏡</p>  
        <p type="p">80:處理系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1488" publication-number="202621537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層基板、配線基板、積層基板之製造方法、配線基板之製造方法、及半導體封裝</chinese-title>  
        <english-title>LAMINATED SUBSTRATE, WIRING SUBSTRATE, METHOD OF MANUFACTURING LAMINATED SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification>  
        <further-classification edition="200601120260223B">B32B17/10</further-classification>  
        <further-classification edition="200601120260223B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神原久美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMBARA, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植木真治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEKI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北爪貴洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZUME, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤陽一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中厚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋田幸仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKITA, YUKIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡瑞樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伴野優梨子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANNO, YURIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠減少包含玻璃之無機基板對於機械破壞或熱衝擊下產生裂痕的情況之積層基板。本發明之積層基板(100)具有複數個配線基板(110)，上述配線基板(110)具有：包含玻璃之無機基板(10)；1層或2層以上之絕緣樹脂層(21、22)，其以被覆包含玻璃之無機基板(10)之至少一部分之方式配置；及配線部(3)，其配置於包含玻璃之無機基板(10)及絕緣樹脂層(21、22)之至少一表面；且包含玻璃之無機基板(10)與絕緣樹脂層(21、22)之剝離強度為0.0098 N/cm以上且未達4.9 N/cm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:配線部</p>  
        <p type="p">4:連接端子</p>  
        <p type="p">10:包含玻璃之無機基板</p>  
        <p type="p">21,22:絕緣樹脂層</p>  
        <p type="p">100:積層基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1489" publication-number="202621061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於錯誤更正碼之軟式解碼之最低可靠位元的近似值</chinese-title>  
        <english-title>APPROXIMATION OF LEAST RELIABLE BITS FOR SOFT DECODING OF ERROR CORRECTION CODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H03M13/45</main-classification>  
        <further-classification edition="200601120260209B">H03M13/37</further-classification>  
        <further-classification edition="200601120260209B">G06F11/08</further-classification>  
        <further-classification edition="200601120260209B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑞泰姆公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETYM, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡素圖　俞沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASSUTO, YUVAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施羅　班</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHILO, BEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩霍　米查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANHOLT, MICHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種錯誤更正碼(ECC)解碼器(32)包含一最低可靠位元(LRB)近似計算器(36)及解碼電路系統(40、44)。該LRB近似計算器經組態以：接收一組軟式度量，該一組軟式度量對應於ECC之一輸入碼字之各別位元；且根據該等軟式度量自該輸入碼字之該等位元當中近似計算該輸入碼字中最低可靠之一或多個LRB。該解碼電路系統經組態以基於該等軟式度量及該等經近似計算之LRB而解碼該輸入碼字。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An Error Correction Code (ECC) decoder (32) includes a Least Reliable Bit (LRB) approximator (36) and decoding circuitry (40, 44). The LRB approximator is configured to receive a set of soft metrics corresponding to respective bits of an input codeword of the ECC, and to approximate, from among the bits of the input codeword, one or more LRBs that are least reliable in the input codeword according to the soft metrics. The decoding circuitry is configured to decode the input codeword based on the soft metrics and the approximated LRBs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:接收器</p>  
        <p type="p">24:解調變器</p>  
        <p type="p">28:對數似然比(LLR)提取器</p>  
        <p type="p">32:迭代ECC解碼器/解碼器</p>  
        <p type="p">36:最低可靠位元(LRB)近似計算器</p>  
        <p type="p">40:校正子計算器</p>  
        <p type="p">44:蔡斯解碼器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1490" publication-number="202620555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測裝置、微影裝置及物品製造方法</chinese-title>  
        <english-title>DETECTION APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G03F9/02</main-classification>  
        <further-classification edition="200601120260210B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤悠樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦聖也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於對檢測表面的表面位置進行檢測的檢測裝置，包括：具有狹縫的遮罩；投影光學系統，其被構造為藉由用已經穿過狹縫的光照射檢測表面來在檢測表面上形成圖像；圖像感測器；以及光接收光學系統，其被構造為在圖像感測器上形成從檢測表面反射的光的圖像，其中滿足以下條件：β&lt;sub&gt;1&lt;/sub&gt;=tanθ&lt;sub&gt;2&lt;/sub&gt;/tanθ&lt;sub&gt;1&lt;/sub&gt;，70°＜θ&lt;sub&gt;1&lt;/sub&gt;＜85°，θ&lt;sub&gt;2&lt;/sub&gt;＜70°，並且0.03＜β&lt;sub&gt;1&lt;/sub&gt;＜0.40，其中θ&lt;sub&gt;1&lt;/sub&gt;表示光到檢測表面的入射角，θ&lt;sub&gt;2&lt;/sub&gt;表示光到圖像感測器的入射角，並且β&lt;sub&gt;1&lt;/sub&gt;表示光接收光學系統的光學倍率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection apparatus for detecting a surface position of a detection surface includes a mask with slits, a projection optical system configured to form an image on the detection surface by irradiating the detection surface with light having passed through the slits, an image sensor, and a light-receiving optical system configured to form, on the image sensor, an image of light reflected from the detection surface, wherein β&lt;sub&gt;1&lt;/sub&gt; = tanθ&lt;sub&gt;2&lt;/sub&gt;/tanθ&lt;sub&gt;1&lt;/sub&gt;, 70° ＜ θ&lt;sub&gt;1&lt;/sub&gt; ＜ 85°, θ&lt;sub&gt;2&lt;/sub&gt; ＜ 70°, and 0.03 ＜ β&lt;sub&gt;1&lt;/sub&gt; ＜ 0.40 are satisfied, where θ&lt;sub&gt;1&lt;/sub&gt; represents an incident angle of the light to the detection surface, θ&lt;sub&gt;2&lt;/sub&gt; represents an incident angle of the light to the image sensor, and β&lt;sub&gt;1&lt;/sub&gt; represents an optical magnification of the light-receiving optical system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:表面位置檢測裝置</p>  
        <p type="p">110:光投影儀</p>  
        <p type="p">111:光源</p>  
        <p type="p">112:遮罩</p>  
        <p type="p">112a:投影圖案</p>  
        <p type="p">113:投影光學系統</p>  
        <p type="p">120:光接收器</p>  
        <p type="p">121:圖像傳感器感測器</p>  
        <p type="p">122:光接收光學系統</p>  
        <p type="p">130:控制器</p>  
        <p type="p">300:檢測表面</p>  
        <p type="p">301:圖案圖像</p>  
        <p type="p">302:抗蝕劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1491" publication-number="202620098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08G73/10</main-classification>  
        <further-classification edition="200601120260210B">G03F7/028</further-classification>  
        <further-classification edition="200601120260210B">C08F2/40</further-classification>  
        <further-classification edition="200601120260210B">C08F2/50</further-classification>  
        <further-classification edition="200601120260210B">C08K5/07</further-classification>  
        <further-classification edition="200601120260210B">C08K5/33</further-classification>  
        <further-classification edition="202101120260210B">B22F12/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正木洋佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASAKI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、硬化上述樹脂組成物而成之硬化物、包含上述硬化物之積層體及上述硬化物之製造方法，前述樹脂組成物含有（a）肟聚合起始劑、（b）聚醯亞胺及（c）聚合性化合物，其中，上述聚合起始劑不包含硫原子，相對於上述組成物的總固體成分，上述聚合起始劑的含量與增感劑的含量的合計量為0.1～2.8質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1492" publication-number="202620991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光半導體裝置</chinese-title>  
        <english-title>OPTICAL SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251110B">H01S5/026</main-classification>  
        <further-classification edition="200601120251110B">H01S5/06</further-classification>  
        <further-classification edition="200601120251110B">H01S5/20</further-classification>  
        <further-classification edition="200601120251110B">H01S3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔵本恭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAMOTO, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内山麻美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIYAMA, ASAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石村栄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIMURA, EITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田征明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係獲得可防止頻段下降的光半導體裝置。 &lt;br/&gt;光調變器2係具備有：在基板3上依序形成有包含第1導電型層13、吸收層23及第2導電型層15的半導體層22、連接於第1導電型層13的第1電極6、以及連接於第2導電型層15的第2電極7。第1墊片8係連接於第1電極6。第2墊片9係連接於第2電極7。半導體層22係具備有：導波路1、以及以導波路10為界互相配置於相對向側的第1平台11與第2平台12。第1墊片8與第2墊片9係經由絕緣膜20配置於第1平台11上。在第1墊片8與第2墊片9之間，於半導體層22中形成溝渠27。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical semiconductor device includes: a substrate; an optical modulator including a semiconductor layer having a first conductive type layer, an absorbing layer and a second conductive type layer which are formed in this order on the substrate, a first electrode connected to the first conductive type layer, and a second electrode connected to the second conductive type layer; a first pad connected to the first electrode; and a second pad connected to the second electrode, wherein the semiconductor layer includes a waveguide, a first terrace and a second terrace positioned on the opposite sides with respect to the waveguide, the first pad and the second pad are placed on the first terrace via an insulating film, and a groove is formed in the semiconductor layer between the first pad and the second pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雷射部</p>  
        <p type="p">2:光調變器</p>  
        <p type="p">3:半絕緣性InP基板(基板)</p>  
        <p type="p">4:陰極電極(電極)</p>  
        <p type="p">5:陽極電極</p>  
        <p type="p">6:陰極電極(第1電極)</p>  
        <p type="p">7:陽極電極(第2電極)</p>  
        <p type="p">8:陰極墊片(第1墊片)</p>  
        <p type="p">9:陽極墊片(第2墊片)</p>  
        <p type="p">10:導波路</p>  
        <p type="p">11:第1平台</p>  
        <p type="p">12:第2平台</p>  
        <p type="p">27:溝渠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1493" publication-number="202620853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將具有垂直通道的非揮發性記憶體裝置的形成整合到CMOS流程中的方法</chinese-title>  
        <english-title>METHOD OF INTEGRATION OF NON-VOLATILE MEMORY DEVICE HAVING VERTICAL CHANNELS FORMATION INTO CMOS FLOW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C7/18</main-classification>  
        <further-classification edition="200601120260223B">G11C8/14</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W10/10</further-classification>  
        <further-classification edition="202601120260223B">H10W15/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10D80/20</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英飛淩科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFINEON TECHNOLOGIES LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　豔麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YANLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛蒂　席范達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHETTY, SHIVANANDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAK, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩　英彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, HIDEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　志正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHIZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供半導體裝置及其製造方法。此半導體裝置可包括第一區，其包括具有下源極/汲極（S/D）接面和上源極/汲極接面的至少一個非揮發性記憶體（NVM）電晶體、被設置在上源極/汲極接面和下源極/汲極接面之間並且被圓柱形記憶體薄膜堆疊圍繞的垂直通道，以及圍繞記憶體薄膜堆疊設置的閘極層。此半導體裝置還可包括第二區，其包括至少一個邏輯電晶體，每個邏輯電晶體具有覆蓋水平通道的閘極介電層、閘極層和高度增強層。本發明也敘述其它實施例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods of manufacturing the same are provided. The semiconductor device may include a first region including at least one non-volatile memory (NVM) transistor having a lower source/drain (S/D） junction and an upper S/D junction, a vertical channel disposed between the upper and lower S/D junctions and surrounded by a cylindrical memory film stack, and a gate layer disposed around the memory film stack, the device also include a second region including at least one logic transistor each having a gate dielectric layer overlying a horizontal channel, a gate layer, and a height-enhancement layer. Other embodiments are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:核心區</p>  
        <p type="p">702:下源極/汲極(S/D)區</p>  
        <p type="p">704:隔離區</p>  
        <p type="p">708:基板</p>  
        <p type="p">720:垂直通道</p>  
        <p type="p">726:上S/D區</p>  
        <p type="p">730:下S/D緩衝區</p>  
        <p type="p">732:阻擋介電層</p>  
        <p type="p">734:金屬閘極層</p>  
        <p type="p">750:NVM單元</p>  
        <p type="p">800:周邊區</p>  
        <p type="p">900:NVM裝置</p>  
        <p type="p">902:閘極氧化物層/閘極介電層</p>  
        <p type="p">904:閘極層</p>  
        <p type="p">906:MOS閘極層</p>  
        <p type="p">908:高度增強(HE)膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1494" publication-number="202619916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具、底座以及載具應用裝置</chinese-title>  
        <english-title>CARRIER, BASE AND CARRIER APPLICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B60N2/26</main-classification>  
        <further-classification edition="201801120260209B">B60N2/90</further-classification>  
        <further-classification edition="200601120260209B">A47D13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭欽明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHINMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙廣輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉維歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEIHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾雲林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, YUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玉彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供了一種載具、底座以及載具應用裝置，其中該載具包括用於將所述載具連接於車輛座椅的錨定組件，其中，所述錨定組件包括：錨定接頭，能夠與所述車輛座椅上的對應配件接合；活動支架，安裝於所述載具並與所述錨定接頭連接或形成為一體，所述活動支架設置成其一部分或整體相對於所述載具能夠移動，使得所述錨定接頭相對於所述載具的距離能夠改變。根據本公開的載具能夠與多種車型的不同車輛座椅配合使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a carrier, a base, and a carrier application device, wherein the carrier includes an anchor assembly for connecting the carrier to a vehicle seat, wherein the anchor assembly comprises: an anchor joint, capable of being engaged with a corresponding accessory on the vehicle seat; a movable support, installed on the carrier and connected to or integrally formed with the anchor joint, the movable support is arranged such that a part or the whole thereof is able to move in respect with the carrier, such that a distance of the anchor joint in respect with the carrier is able to be changed. The carrier according to the disclosure can be used in cooperation with different vehicle seats of various models.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載具、嬰兒提籃</p>  
        <p type="p">1E:前緣</p>  
        <p type="p">2:車輛座椅</p>  
        <p type="p">2A:椅座</p>  
        <p type="p">2B:椅背</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1495" publication-number="202620469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繞射光學元件及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G02B3/08</main-classification>  
        <further-classification edition="200601120260207B">G02B27/42</further-classification>  
        <further-classification edition="200601120260207B">B29C59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武本博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩﨑信賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, NOBUSATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即便使用二次以上繞射亦能抑制聚光雜訊且能夠實現高聚光度之繞射光學元件。本發明之實施方式之繞射光學元件具備設置於中央之第1透鏡部、及設置於第1透鏡部之周圍之第2透鏡部；繞射光學元件構成為利用波長處於380 nm～780 nm之範圍內之光之二次以上繞射，且數值孔徑NA為0.2以上；第2透鏡部具有朝向外周排列之複數個稜鏡；複數個稜鏡分別具有朝向外周傾斜之菲涅耳面、於繞射光學元件之光軸方向延伸之上升面、及作為菲涅耳面與上升面之連接部之頂部；第2透鏡部構成為相鄰之稜鏡之頂部之間隔朝向外周側逐漸變窄，且複數個稜鏡之高度朝向外周側逐漸減小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第1透鏡部</p>  
        <p type="p">20:第2透鏡部</p>  
        <p type="p">21:稜鏡</p>  
        <p type="p">100:繞射光學元件(高次相位菲涅耳透鏡)</p>  
        <p type="p">100a:第1主面</p>  
        <p type="p">100b:第2主面</p>  
        <p type="p">100c:光軸(中心軸)</p>  
        <p type="p">R:半徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1496" publication-number="202620685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦程式、資訊處理方法及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260223B">G06F30/27</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="200601120260223B">G05B13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村隆央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川人大希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAHITO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>筒井拓郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUI, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池尻将拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEJIRI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢崎晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAZAKI, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電腦程式、資訊處理方法及資訊處理裝置。 &lt;br/&gt;本發明之電腦程式係輸出用以修正基板變形之處理工序中應該應用之處理參數之資訊者，且使電腦執行以下處理：根據所賦予之處理參數來預測基板之變形量，對變形量之預測結果進行評估，搜尋處理工序中應該應用之處理參數，並輸出作為搜尋結果而獲得之處理參數之候補資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S108:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1497" publication-number="202620858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛置字線驅動電路系統及方法</chinese-title>  
        <english-title>DUMMY WORDLINE DRIVER CIRCUITRY AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G11C8/08</main-classification>  
        <further-classification edition="200601120260207B">G11C11/413</further-classification>  
        <further-classification edition="200601120260207B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　迪沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, DISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西索迪亞　拉吉夫庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SISODIA, RAJIV KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦加西亞　普拉尚庫馬賈揚蒂拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAGHASIA, PRASHANTKUMAR JAYANTILAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以對一虛置字線進行預充電之電路包括：一第一分支，其包含第一及第二PMOS裝置；及一第二分支，其包含一單一PMOS裝置。此外，回應於一電力供應轉換，該第二分支可經組態以透過該單一PMOS裝置對該虛置字線進行預充電。此外，一種用以對一虛置字線進行預充電之方法包括：藉由一電路之一第一分支對一虛置字線進行預充電，及回應於一電力供應轉換，透過該電路之一第二分支之一單一PMOS裝置對該虛置字線進行預充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit to precharge a dummy wordline includes a first branch comprising first and second PMOS devices; and a second branch comprising a single PMOS device. Also, in response to a power supply transition, the second branch can be configured to precharge the dummy wordline through the single PMOS device. Also, a method to precharge a dummy wordline includes: precharging, by a first branch of a circuit, a dummy wordline, and in response to a power supply transition, precharging the dummy wordline through a single PMOS device of a second branch of the circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路</p>  
        <p type="p">102:VDDPE/供應電壓電力軌/周邊電力軌</p>  
        <p type="p">104:VDDCE/核心電壓電力軌/核心電力軌</p>  
        <p type="p">110:第一電路分支/第一分支</p>  
        <p type="p">112:第一PMOS裝置</p>  
        <p type="p">114:第二PMOS裝置</p>  
        <p type="p">120:第二電路分支/第二分支</p>  
        <p type="p">122:單一PMOS裝置</p>  
        <p type="p">132:NMOS裝置</p>  
        <p type="p">151:GTP信號/GTP</p>  
        <p type="p">153:GTP_DELAYED</p>  
        <p type="p">155:NGTP</p>  
        <p type="p">157:NGTP_VDDCE</p>  
        <p type="p">162:虛置字線(DWL)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1498" publication-number="202621029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉換裝置</chinese-title>  
        <english-title>CONVERTER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H02M5/10</main-classification>  
        <further-classification edition="200601120260211B">H02M5/16</further-classification>  
        <further-classification edition="200601120260211B">H02M1/088</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉本尚人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMOTO, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木寺和憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDERA, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供可高效率地控制輕負載時的輸出功率之轉換裝置。轉換裝置(A1)，具備整流器(2)、第1變流器(3)、第1電感器(L1)、變壓器(Tr1)、第2變流器(4)、第2電感器(L2)、及控制電路(5)。控制電路(5)，控制第1變流器(3)及第2變流器(4)，使第1開關元件(Q1)及第3開關元件(Q3)在相同時序進行開關動作，並使第2開關元件(Q2)及第4開關元件(Q4)在相同時序進行開關動作。控制電路(5)，根據第2變流器(4)的輸出電壓(Vo)，控制第1開關元件(Q1)及第2開關元件(Q2)的開啟期間或關閉期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:整流器</p>  
        <p type="p">3:第1變流器</p>  
        <p type="p">4:第2變流器</p>  
        <p type="p">5:控制電路</p>  
        <p type="p">6:輸入濾波器</p>  
        <p type="p">8:交流電源</p>  
        <p type="p">11,12:輸入端子</p>  
        <p type="p">13,14:輸出端子</p>  
        <p type="p">21:連接點(第1二極體及第2二極體的連接點)</p>  
        <p type="p">31:第1串聯電路</p>  
        <p type="p">32:第2串聯電路</p>  
        <p type="p">34:連接點(第1開關元件及第2開關元件的連接點)</p>  
        <p type="p">35:連接點(第1電容器及第2電容器的連接點)</p>  
        <p type="p">44,45:連接點(輸入端)</p>  
        <p type="p">46,47:連接點(輸出端)</p>  
        <p type="p">52:檢測部</p>  
        <p type="p">53:控制部</p>  
        <p type="p">54:生成部</p>  
        <p type="p">55:判定部</p>  
        <p type="p">81:第1輸出端</p>  
        <p type="p">82:第2輸出端</p>  
        <p type="p">A1~A2:轉換裝置</p>  
        <p type="p">C1:電容器(第1電容器)</p>  
        <p type="p">C2:電容器(第2電容器)</p>  
        <p type="p">C3:電容器</p>  
        <p type="p">C4:輸出濾波器</p>  
        <p type="p">D1:二極體(第1二極體)</p>  
        <p type="p">D2:二極體(第2二極體)</p>  
        <p type="p">Iin:輸入電流</p>  
        <p type="p">i1:電流</p>  
        <p type="p">Io:輸出電流</p>  
        <p type="p">L1:第1電感器</p>  
        <p type="p">L2:第2電感器</p>  
        <p type="p">L3:電感器</p>  
        <p type="p">N1:一次繞組</p>  
        <p type="p">N2:二次繞組</p>  
        <p type="p">Q1:開關元件(第1開關元件)</p>  
        <p type="p">Q2:開關元件(第2開關元件)</p>  
        <p type="p">Q3:開關元件(第3開關元件)</p>  
        <p type="p">Q4:開關元件(第4開關元件)</p>  
        <p type="p">Q5:開關元件(第5開關元件)</p>  
        <p type="p">Q6:開關元件(第6開關元件)</p>  
        <p type="p">S1~S6:控制訊號</p>  
        <p type="p">Ton:開啟期間</p>  
        <p type="p">Toff:關閉期間</p>  
        <p type="p">Tr1:變壓器</p>  
        <p type="p">V1:輸出電壓(第1變流器的輸出電壓)</p>  
        <p type="p">V2:輸入電壓(第2變流器的輸入電壓)</p>  
        <p type="p">Vdc:輸出電壓(直流母線電壓、第2串聯電路的輸出電壓)</p>  
        <p type="p">Vin:交流電壓</p>  
        <p type="p">Vo:輸出電壓(第2變流器的輸出電壓)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1499" publication-number="202621253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成EEPROM胞元的自對準方法</chinese-title>  
        <english-title>SELF-ALIGNED METHOD OF FORMING EEPROM CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260212B">H10B41/30</main-classification>  
        <further-classification edition="200601120260212B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商超捷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊任偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳滿堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MAN-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, GINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　恩漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, NHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種EEPROM胞元，具有在半導體基板中之接面區域、源極區域及汲極區域。記憶體通道區域在源極區域與接面區域之間延伸。選擇通道區域在汲極區域與接面區域之間延伸。浮動閘極具有安置於接面區域上方且藉由第一絕緣層以與其絕緣之第一部分，以及，安置於記憶體通道區域上方且藉由第二絕緣層以與其絕緣之第二部分。感測閘極安置於浮動閘極上方。感測閘極環繞第一部分之邊緣，而不環繞第二部分之邊緣。選擇閘極安置於選擇通道區域上方。選擇閘極藉由第三絕緣層以與選擇通道區域絕緣。第三絕緣層比第二絕緣層更薄，且比第一絕緣層更厚。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An EEPROM cell with junction, source and drain regions in a semiconductor substrate. A memory channel region extends between the source and junction regions. A select channel region extends between the drain and junction regions. A floating gate has a first portion disposed over the junction region and insulated therefrom by a first insulation layer, and a second portion disposed over the memory channel region and insulated therefrom by a second insulation layer. A sense gate is disposed over the floating gate. The sense gate wraps around an edge of the first portion without wrapping around an edge of the second portion. A select gate is disposed over the select channel region. The select gate is insulated from the select channel region by a third insulation layer. The third insulation layer is thinner than the second insulation layer and thicker than the first insulation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:半導體基板</p>  
        <p type="p">38:接面區域</p>  
        <p type="p">42a:(導電層之)區塊；浮動閘極</p>  
        <p type="p">50a:(導電層之)區塊；感測閘極</p>  
        <p type="p">50b:(導電層之)區塊；選擇閘極</p>  
        <p type="p">66:源極區域</p>  
        <p type="p">68:汲極區域</p>  
        <p type="p">72:絕緣材料</p>  
        <p type="p">74:電觸點</p>  
        <p type="p">80:記憶體胞元</p>  
        <p type="p">82:記憶體通道區域</p>  
        <p type="p">84:選擇通道區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1500" publication-number="202621030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉換裝置</chinese-title>  
        <english-title>CONVERTER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H02M7/21</main-classification>  
        <further-classification edition="200601120260211B">H02M7/219</further-classification>  
        <further-classification edition="200601120260211B">H02M1/088</further-classification>  
        <further-classification edition="200601120260211B">G01R17/10</further-classification>  
        <further-classification edition="200601120260211B">G01R15/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木寺和憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDERA, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉本尚人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMOTO, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供可降低雜訊及提高功率因數之轉換裝置。轉換裝置(A1)，具備第1變流器(3)、變壓器(Tr1)、第2變流器(4)、及控制電路(5)。控制電路(5)，控制第1變流器(3)，使第1開關元件(Q1)與第2開關元件(Q2)交互地成為開啟狀態，並使開啟時間成為相同。控制電路(5)，控制第2變流器(4)，使第3開關元件(Q3)與第4開關元件(Q4)交互地成為開啟狀態，並使開啟時間與第1開關元件(Q1)的開啟時間成為相同。控制電路(5)，控制第1開關元件(Q1)及第2開關元件(Q2)的開關頻率，使直流母線電壓(Vdc)之一半的電壓值成為第1既定值；根據交流電壓(Vin)，控制開關頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:整流器</p>  
        <p type="p">3:第1變流器</p>  
        <p type="p">4:第2變流器</p>  
        <p type="p">5:控制電路</p>  
        <p type="p">6:輸入濾波器</p>  
        <p type="p">8:交流電源</p>  
        <p type="p">11,12:輸入端子</p>  
        <p type="p">13,14:輸出端子</p>  
        <p type="p">21:連接點(第1二極體及第2二極體的連接點)</p>  
        <p type="p">31:第1串聯電路</p>  
        <p type="p">32:第2串聯電路</p>  
        <p type="p">34:連接點(第1開關元件及第2開關元件的連接點)</p>  
        <p type="p">35:連接點(第1電容器及第2電容器的連接點)</p>  
        <p type="p">44:輸入端(第3開關元件及第4開關元件的連接點)</p>  
        <p type="p">45:輸入端(第5開關元件及第6開關元件的連接點)</p>  
        <p type="p">46:輸出端(第3開關元件及第5開關元件的連接點)</p>  
        <p type="p">47:輸出端(第4開關元件及第7開關元件的連接點)</p>  
        <p type="p">51:第1處理部</p>  
        <p type="p">52:第1控制部</p>  
        <p type="p">53:第2處理部</p>  
        <p type="p">54:第2控制部</p>  
        <p type="p">55:生成部</p>  
        <p type="p">81:第1輸出端</p>  
        <p type="p">82:第2輸出端</p>  
        <p type="p">A1~A3:轉換裝置</p>  
        <p type="p">C1:電容器(第1電容器)</p>  
        <p type="p">C2:電容器(第2電容器)</p>  
        <p type="p">C3:電容器</p>  
        <p type="p">C4:輸出濾波器</p>  
        <p type="p">D1:二極體(第1二極體)</p>  
        <p type="p">D2:二極體(第2二極體)</p>  
        <p type="p">fsw:開關頻率</p>  
        <p type="p">i1:電流</p>  
        <p type="p">Iin:輸入電流</p>  
        <p type="p">L1:第1電感器</p>  
        <p type="p">L2:第2電感器</p>  
        <p type="p">L3:電感器</p>  
        <p type="p">N1:一次繞組</p>  
        <p type="p">N2:二次繞組</p>  
        <p type="p">Q1:開關元件(第1開關元件)</p>  
        <p type="p">Q2:開關元件(第2開關元件)</p>  
        <p type="p">Q3:開關元件(第3開關元件)</p>  
        <p type="p">Q4:開關元件(第4開關元件)</p>  
        <p type="p">Q5:開關元件(第5開關元件)</p>  
        <p type="p">Q6:開關元件(第6開關元件)</p>  
        <p type="p">S1~S6:控制訊號</p>  
        <p type="p">Tr1:變壓器</p>  
        <p type="p">V1:輸出電壓(第1變流器的輸出電壓)</p>  
        <p type="p">V2:輸入電壓(第2變流器的輸入電壓)</p>  
        <p type="p">Vdc:輸出電壓(直流母線電壓、第2串聯電路的輸出電壓)</p>  
        <p type="p">Vdc&lt;sup&gt;*&lt;/sup&gt;:第1輸出電壓指令值</p>  
        <p type="p">Vin:交流電壓</p>  
        <p type="p">Vo:輸出電壓(第2變流器的輸出電壓)</p>  
        <p type="p">Vo&lt;sup&gt;*&lt;/sup&gt;:第1輸出電壓指令值</p>  
        <p type="p">θ:相位差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1501" publication-number="202621117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖像編碼裝置及圖像編碼方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260202B">H04N19/176</main-classification>  
        <further-classification edition="201401120260202B">H04N19/115</further-classification>  
        <further-classification edition="201401120260202B">H04N19/14</further-classification>  
        <further-classification edition="201401120260202B">H04N19/124</further-classification>  
        <further-classification edition="200601120260202B">G06T9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新唐科技日本股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古谷晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTANI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村臣二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩橋直大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAHASHI, NAOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">圖像編碼裝置(200)具備：特徵量取得器(240)，就各成分取得特徵量；比率算出器(242)，按照特徵量來算出複數個成分的特徵量比率；分散值取得器(244)，就1個成分取得分散值；平坦判定器(246)，按照分散值來進行平坦判定；目標碼量控制器(250)，按照特徵量比率來決定各成分的資料的目標碼量，按照平坦判定的結果來補正按照特徵量比率所決定的目標碼量；頻率轉換器(210)，對各成分的資料進行頻率轉換；量化處理器(220)，按照目標碼量來將各成分的資料量化；及編碼器(230)，將各成分的資料編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:圖像編碼裝置</p>  
        <p type="p">210:頻率轉換器</p>  
        <p type="p">220:量化處理器</p>  
        <p type="p">221:量化器</p>  
        <p type="p">222:量化表導出器</p>  
        <p type="p">223:比例因子決定器</p>  
        <p type="p">230:編碼器</p>  
        <p type="p">240:特徵量取得器</p>  
        <p type="p">242:比率算出器</p>  
        <p type="p">244:分散值取得器</p>  
        <p type="p">246:平坦判定器</p>  
        <p type="p">250:目標碼量控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1502" publication-number="202621068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種光網路通信方法以及通信裝置</chinese-title>  
        <english-title>A METHOD FOR OPTICAL NETWORK COMMUNICATION AND A COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251201B">H04B10/27</main-classification>  
        <further-classification edition="202201120251201B">H04L41/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳徐明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, XUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳海成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, RONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種光網路通信方法以及通信裝置，該方法應用於光纖網路，該光纖網路包括主設備和至少一個從設備，至少一個從設備包括第一從設備。其中，主設備向第一從設備發送的第一消息攜帶有第一指示信息，該第一指示信息指示了第一消息的操作類型，因此，有利於第一從設備基於第一指示信息快速決策是否生成第一消息的回應消息，從而有利於提高主設備與從設備之間的通信效率，進而有利於提高主設備對從設備的管控效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides an optical network communication method and a communication device. This method is applied to a fiber optic network, which includes a main device and at least one sub device, wherein the at least one sub device includes a first sub device. The first message sent by the main device to the first sub device carries first indication information, which indicates the operation type of the first message. Therefore, it is beneficial for the first sub device to quickly decide whether to generate a response message to the first message based on the first indication information, thereby improving the communication efficiency between the main device and the sub device, and further enhancing the control efficiency of the main device over the sub device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201、202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1503" publication-number="202621089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621089.zip"/>
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      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種光網路通信方法以及通信裝置</chinese-title>  
        <english-title>A METHOD FOR OPTICAL NETWORK COMMUNICATION AND A COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L41/044</main-classification>  
        <further-classification edition="202201120251201B">H04L41/34</further-classification>  
        <further-classification edition="201301120251201B">H04B10/80</further-classification>  
        <further-classification edition="201801120251201B">H04W4/33</further-classification>  
        <further-classification edition="201801120251201B">H04W4/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳徐明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, XUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳海成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, RONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種光網路通信方法以及通信裝置，該方法應用於光纖網路，該光纖網路包括主設備和至少一個從設備，至少一個從設備包括第一從設備。該方法中，主設備向第一從設備發送第三消息，第三消息為無線局域網管理控制介面WMCI消息，第三消息用於對第一從設備的無線局域網WLAN功能進行管理或控制，第三消息包括第四指示信息和第五指示信息，第四指示信息用於指示第一特性，第五指示信息用於指示是否啟用第一從設備的第一特性。有利於主設備靈活配置第一從設備的第一特性，從而提高主設備管控第一從設備的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method for optical network communication and a communication device. The method is applied to an optical fiber network that includes a main device and at least one sub device, wherein the at least one sub device includes a first sub device. In this method, the main device sends a third message to the first sub device. The third message is a WLAN Management Control Interface (WMCI) message, which is used to manage or control the Wireless Local Area Network (WLAN) function of the first sub device. The third message includes fourth and fifth indication information. The fourth indication information is used to indicate a first characteristic, and the fifth indication information is used to indicate whether the first characteristic of the first sub device is enabled. This facilitates the main device to flexibly configure the first characteristic of the first sub device, thereby improving the efficiency of the main device in managing and controlling the first sub device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201、202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1504" publication-number="202619881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結構分析方法以及電腦可讀取記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260210B">B29C64/112</main-classification>  
        <further-classification edition="201901120260210B">G06F17/00</further-classification>  
        <further-classification edition="201501120260210B">B33Y50/02</further-classification>  
        <further-classification edition="202401120260210B">G06T3/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木現</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, GEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係實現高精度且有效率預測積層造形體的強度。供解決該課題的結構分析方法，係包括有：將具非等向性積層造形體的形狀分割為複數元素；根據造形路徑資訊，其表示利用3D列印機造形上述具非等向性積層造形體時的噴頭移動軌跡，對經分割的元素分別賦予對應於噴頭移動方向的方向資訊；將與賦予的方向資訊對應的物性值資訊提供給元素，而製成上述具非等向性積層造形體的結構分析用模型；以及使用所製成的結構分析用模型執行結構分析。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1505" publication-number="202620704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子電腦的量子啟發式張量網路模擬器及其相關方法</chinese-title>  
        <english-title>QUANTUM-INSPIRED TENSOR NETWORK SIMULATOR FOR QUANTUM COMPUTERS AND RELATED METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260208B">G06N10/20</main-classification>  
        <further-classification edition="202001120260208B">G06F30/33</further-classification>  
        <further-classification edition="202301120260208B">G06N5/01</further-classification>  
        <further-classification edition="200601120260208B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商多元宇宙運算公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特拉　悉達多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRA, SIDDHARTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　蘇克賓德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, SUKHBINDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈赫羅米　賽義德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHROMI, SAEED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧魯斯　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORUS, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法、設備和系統涉及通過根據待模擬的量子電路的結構生成動態張量網路來模擬量子電腦。該方法包括：讀取量子電路中的雙量子位元項；為每個被讀取雙量子位元項提供雙量子位元閘，由此提供每個量子位元的張量，以及為兩個張量提供連接張量索引；通過使用值分解和保持預定數量D為大值來縮短連接張量索引；如果數量超過M，則移除至少與所需的連接張量索引一樣多的連接張量索引，以將連接張量索引的數量降低到預定閾值M。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:讀取</p>  
        <p type="p">104:選擇</p>  
        <p type="p">106:提供</p>  
        <p type="p">108:縮短</p>  
        <p type="p">110:縮短</p>  
        <p type="p">112:移除</p>  
        <p type="p">114:檢查</p>  
        <p type="p">116:提供</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1506" publication-number="202620706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子啟發式張量網路優化器、相關方法及其非暫態電腦可讀儲存介質</chinese-title>  
        <english-title>QUANTUM-INSPIRED TENSOR NETWORK OPTIMIZER, RELATED METHODS, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260208B">G06N10/60</main-classification>  
        <further-classification edition="202301120260208B">G06N5/01</further-classification>  
        <further-classification edition="200601120260208B">G06F17/16</further-classification>  
        <further-classification edition="202301120260208B">G06Q10/0631</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商多元宇宙運算公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特拉　悉達多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRA, SIDDHARTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　蘇克賓德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, SUKHBINDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈赫羅米　賽義德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHROMI, SAEED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧魯斯　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORUS, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括：將成本函數分解成二位項；將時間演變和步長變化的兩位門應用於所選擇的二位項，從而生成每位一個張量，其中在兩個張量之間具有連接張量索引；縮短連接張量索引；移除至少與所需的連接張量一樣多的連接張量以將連接張量索引的數量降低到預定閾值M；以及對於成本函數中的一個、一些或所有其他二位項執應用、縮短和移除，至少到成本函數的解達到預定收斂為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:分解</p>  
        <p type="p">104:選擇</p>  
        <p type="p">106:應用</p>  
        <p type="p">108:獲得</p>  
        <p type="p">110:縮短</p>  
        <p type="p">112:檢查</p>  
        <p type="p">114:移除</p>  
        <p type="p">116:檢查</p>  
        <p type="p">118:使用或應用</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1507" publication-number="202620840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子音樂鍵盤快速移調功能</chinese-title>  
        <english-title>RAPID TRANSPOSE FUNCTIONALITY FOR ELECTRONIC MUSICAL KEYBOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G10H1/20</main-classification>  
        <further-classification edition="200601120260202B">G10H1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷諾茲　大衛　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS, DAVID·JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷諾茲　大衛　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REYNOLDS, DAVID·JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鍵盤飛行（Claviation）是一種快速且直覺的電子音樂鍵盤即時移調方法，快到足以在彈奏期間使用鍵本身支援調性改變。彈奏者透過踏板或按鈕進入移調模式、且依序按壓兩個鍵來定義移調音程。這兩次按壓會被靜音，以免干擾音樂。此三步驟動作如音樂三連音般有效率，輕易地嵌入節拍內，而且隨著練習而變得更快。&lt;br/&gt; 至關重要的是，鍵盤飛行不需要計算、命名或概念化音程。它使彈奏者即使經過轉調依然能夠主要地在白鍵上保持音階，免去學習調號和多種指法的需要。在一個調性中學習的樂曲係在所有調性中被有效地學習。&lt;br/&gt; 鍵盤飛行加速學習、增進即興創作並在調性變化時保留空間型態，使鍵盤更易於學習、理解和創作音樂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Claviation is a rapid and intuitive method for transposing an electronic musical keyboard in real time — fast enough to support key changes during play using the keys themselves. The player enters transpose mode via a pedal or button and presses two keys in sequence to define the transposition interval. These two presses are muted to avoid disrupting the music. This three-step action is as efficient as a musical triplet, easily fitting within a beat and becoming faster with practice.&lt;br/&gt; Crucially, claviation requires no calculation, naming, or conceptualizing of intervals. It enables the player to keep scales primarily on the white keys, even through modulations, eliminating the need to learn key signatures and multiple fingerings. A piece learned in one key is effectively learned in all.&lt;br/&gt; Claviation accelerates learning, enhances improvisation, and preserves spatial patterns across key changes, making the keyboard easier to learn, understand, and compose music on.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1508" publication-number="202620099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯亞胺前驅體組合物、聚醯亞胺膜、聚醯亞胺膜/基材積層體、可撓性電子裝置、及可撓性電子裝置基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08G73/10</main-classification>  
        <further-classification edition="200601120260209B">C08L79/08</further-classification>  
        <further-classification edition="200601120260209B">C08G77/14</further-classification>  
        <further-classification edition="200601120260209B">C08G77/22</further-classification>  
        <further-classification edition="200601120260209B">C08K5/541</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＢＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本雄基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤座博人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAZA, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小濱幸徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHAMA, YUKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOU, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之聚醯亞胺前驅體組合物含有聚醯亞胺前驅體、及矽烷醇化合物等特定之矽化合物，該聚醯亞胺前驅體含有下述式(1)所表示之重複單元，且滿足特定之條件(聚醯亞胺前驅體中存在之全部X&lt;sub&gt;1&lt;/sub&gt;中之至少1個為四價芳香族基的條件等)。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="225px" width="443px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，X&lt;sub&gt;1&lt;/sub&gt;為四價芳香族基等，Y&lt;sub&gt;1&lt;/sub&gt;為二價芳香族基等，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;分別獨立為氫原子等]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1509" publication-number="202620884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137652</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在記憶體裝置中儲存後設資料之設備、系統及方法</chinese-title>  
        <english-title>APPARATUSES, SYSTEMS, AND METHODS FOR STORING METADATA IN A MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G11C29/42</main-classification>  
        <further-classification edition="200601120260211B">G11C16/06</further-classification>  
        <further-classification edition="200601120260211B">G11C16/34</further-classification>  
        <further-classification edition="200601120260211B">G06F7/38</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿亞皮瑞迪　蘇吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYYAPUREDDI, SUJEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浩爾　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOWE, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可將一記憶體裝置之一記憶體庫劃分成行平面。各行平面可與行選擇相關聯。在一些實例中，一或多個實體行平面可選擇性地組態以儲存後設資料。取決於待儲存之後設資料之數量，該等行選擇可配置至虛擬行平面中以允許資料儲存於用於後設資料之實體行平面中。該等實體行平面可配置成虛擬平面以儲存該資料。可抑制實體行平面之行選擇信號以促進該等虛擬平面。可基於所儲存之後設資料之該數量來使用不同抑制方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bank of a memory device may be divided into column planes. Each column plane may be associated with column selects. In some examples, one or more physical column planes may be selectively configured to store metadata. Depending on the amount of metadata to be stored, the column selects may be arranged into virtual column planes to allow data to be stored in physical column plane(s) used for metadata. The physical column planes may be arranged into virtual planes to store the data. Column select signals for physical column planes may be suppressed to facilitate the virtual planes. Different suppression schemes may be used based on the amount of metadata stored.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:記憶體裝置</p>  
        <p type="p">202:控制器</p>  
        <p type="p">205:命令/位址輸入電路</p>  
        <p type="p">212:位址解碼器</p>  
        <p type="p">215:命令解碼器</p>  
        <p type="p">220:時脈輸入電路</p>  
        <p type="p">230:內部時脈電路</p>  
        <p type="p">235:錯誤校正碼(ECC)電路</p>  
        <p type="p">240:列解碼器</p>  
        <p type="p">245:行解碼器</p>  
        <p type="p">250:記憶體陣列</p>  
        <p type="p">255:讀取/寫入放大器(RWAMP)</p>  
        <p type="p">260:輸入/輸出電路</p>  
        <p type="p">270:內部電壓產生器電路</p>  
        <p type="p">275:模式暫存器</p>  
        <p type="p">ACT:列啟動信號</p>  
        <p type="p">BADD:記憶體庫位址信號</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CKE:信號</p>  
        <p type="p">CK_c:外部時脈信號</p>  
        <p type="p">CK_t:外部時脈信號</p>  
        <p type="p">CS:行選擇信號</p>  
        <p type="p">DQ:資料端子</p>  
        <p type="p">ICK:內部時脈信號</p>  
        <p type="p">ICKD:內部時脈信號</p>  
        <p type="p">ICMD:內部命令信號</p>  
        <p type="p">LIOT/B:互補式局域資料線</p>  
        <p type="p">MIOT/B:互補式主資料線</p>  
        <p type="p">RDQS:資料端子</p>  
        <p type="p">SAMP:感測放大器</p>  
        <p type="p">TG:傳送閘</p>  
        <p type="p">VARY:內部電位</p>  
        <p type="p">VDD:電力供應電位</p>  
        <p type="p">VDDQ:電力供應電位</p>  
        <p type="p">VOD:內部電位</p>  
        <p type="p">VPERI:內部電位</p>  
        <p type="p">VPP:內部電位</p>  
        <p type="p">VSS:電力供應電位</p>  
        <p type="p">WL:字線</p>  
        <p type="p">XADD:經解碼列位址信號</p>  
        <p type="p">YADD:經解碼行位址信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1510" publication-number="202620875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在記憶體裝置中儲存後設資料之設備、系統及方法</chinese-title>  
        <english-title>APPARATUSES, SYSTEMS, AND METHODS FOR STORING METADATA IN A MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G11C16/06</main-classification>  
        <further-classification edition="200601120260211B">G11C16/34</further-classification>  
        <further-classification edition="200601120260211B">G11C5/02</further-classification>  
        <further-classification edition="200601120260211B">G06F7/38</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿亞皮瑞迪　蘇吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYYAPUREDDI, SUJEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浩爾　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOWE, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可將一記憶體裝置之一記憶體庫劃分成行平面。各行平面可與行選擇相關聯。在一些實例中，一或多個實體行平面可選擇性地組態以儲存後設資料。取決於待儲存之後設資料之數量，該等行選擇可配置至虛擬行平面中以允許資料儲存於用於後設資料之實體行平面中。該等實體行平面可配置成虛擬平面以儲存該資料。可抑制實體行平面之行選擇信號以促進該等虛擬平面。可基於所儲存之後設資料之該數量來使用不同抑制方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bank of a memory device may be divided into column planes. Each column plane may be associated with column selects. In some examples, one or more physical column planes may be selectively configured to store metadata. Depending on the amount of metadata to be stored, the column selects may be arranged into virtual column planes to allow data to be stored in physical column plane(s) used for metadata. The physical column planes may be arranged into virtual planes to store the data. Column select signals for physical column planes may be suppressed to facilitate the virtual planes. Different suppression schemes may be used based on the amount of metadata stored.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:記憶體裝置</p>  
        <p type="p">202:控制器</p>  
        <p type="p">205:命令/位址輸入電路</p>  
        <p type="p">212:位址解碼器</p>  
        <p type="p">215:命令解碼器</p>  
        <p type="p">220:時脈輸入電路</p>  
        <p type="p">230:內部時脈電路</p>  
        <p type="p">235:錯誤校正碼(ECC)電路</p>  
        <p type="p">240:列解碼器</p>  
        <p type="p">245:行解碼器</p>  
        <p type="p">250:記憶體陣列</p>  
        <p type="p">255:讀取/寫入放大器(RWAMP)</p>  
        <p type="p">260:輸入/輸出電路</p>  
        <p type="p">270:內部電壓產生器電路</p>  
        <p type="p">275:模式暫存器</p>  
        <p type="p">ACT:列啟動信號</p>  
        <p type="p">BADD:記憶體庫位址信號</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CKE:信號</p>  
        <p type="p">CK_c:外部時脈信號</p>  
        <p type="p">CK_t:外部時脈信號</p>  
        <p type="p">CS:行選擇信號</p>  
        <p type="p">DQ:資料端子</p>  
        <p type="p">ICK:內部時脈信號</p>  
        <p type="p">ICKD:內部時脈信號</p>  
        <p type="p">ICMD:內部命令信號</p>  
        <p type="p">LIOT/B:互補式局域資料線</p>  
        <p type="p">MIOT/B:互補式主資料線</p>  
        <p type="p">RDQS:資料端子</p>  
        <p type="p">SAMP:感測放大器</p>  
        <p type="p">TG:傳送閘</p>  
        <p type="p">VARY:內部電位</p>  
        <p type="p">VDD:電力供應電位</p>  
        <p type="p">VDDQ:電力供應電位</p>  
        <p type="p">VOD:內部電位</p>  
        <p type="p">VPERI:內部電位</p>  
        <p type="p">VPP:內部電位</p>  
        <p type="p">VSS:電力供應電位</p>  
        <p type="p">WL:字線</p>  
        <p type="p">XADD:經解碼列位址信號</p>  
        <p type="p">YADD:經解碼行位址信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1511" publication-number="202620630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保留站之發出管道共用</chinese-title>  
        <english-title>ISSUE PIPE SHARING FOR RESERVATION STATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G06F9/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　東國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, DUNG QUOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇拉　維蒂莎　瑞迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRRA, VIDISHA REDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博南諾　詹姆斯　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONANNO, JAMES JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普里亞達什　施瓦姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIYADARSHI, SHIVAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃司伯　約翰　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESPER, JOHN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於發出管道共用之方法、系統及設備，包括編碼在電腦儲存媒體上之電腦程式。該等方法中之一者包括藉由一程序使用選擇邏輯來選擇自通向PRF之N個讀取埠獲得哪些源資料元素來向不同執行單元並行發出複數個指令，該程序包括一實體暫存器檔案(PRF)、複數個執行單元及一保留站(RSV)，該保留站包括複數個發出管道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and apparatus, including computer programs encoded on computer storage media, for issue pipe sharing. One of the methods includes concurrently issuing a plurality of instructions to different execution units using selection logic to select which source data elements to obtain from the N read ports into the PRF by a process that includes a physical register file (PRF), a plurality of execution units, and a reservation station (RSV) that includes a plurality of issue pipes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">201:發出管道</p>  
        <p type="p">202:源</p>  
        <p type="p">204:源</p>  
        <p type="p">206:源</p>  
        <p type="p">208:源</p>  
        <p type="p">210:源</p>  
        <p type="p">212:第一多工器/MUX</p>  
        <p type="p">214:第二多工器/MUX</p>  
        <p type="p">220:實體暫存器檔案/PRF</p>  
        <p type="p">230:執行單元</p>  
        <p type="p">240:執行單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1512" publication-number="202619628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種含苯嘧草唑水乳劑及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">A01N43/80</main-classification>  
        <further-classification edition="200601120260213B">A01N25/02</further-classification>  
        <further-classification edition="200601120260213B">A01N43/32</further-classification>  
        <further-classification edition="200601120260213B">A01P13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江山(宜昌)作物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSHAN (YICHANG) CROP TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商南通江山農藥化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANTONG JIANGSHAN AGROCHEMICAL &amp; CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱豔梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YANMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王儼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許映蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YINGRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任新峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, XINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及水乳劑技術領域，具體涉及一種含苯嘧草唑水乳劑及其製備方法。按質量百分比計，其製備原料包括苯嘧草唑 5%~30%、溶劑10%~40%、乳化劑3%~5%、防凍劑3%~5%、消泡劑0.01%~0.1%、穩定劑0.1%~1%、水餘量。本申請提供的含苯嘧草唑水乳劑具有良好的高溫儲存穩定性，苯嘧草唑分解率小於5%，滿足2年貨架期；並且在不同硬度的水質中具有良好的分散稀釋性；與其他劑型產品飛防前簡單混合使用，桶混相容性較好，不易出現絮凝、分層等異常問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1513" publication-number="202621045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種電容位置優化方法及半導體製程設備</chinese-title>  
        <english-title>METHOD FOR OPTIMIZING CAPACITOR POSITIONS AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">H03H7/40</main-classification>  
        <further-classification edition="200601120260205B">G05B13/04</further-classification>  
        <further-classification edition="200601120260205B">G01R27/06</further-classification>  
        <further-classification edition="200601120260205B">G05D3/12</further-classification>  
        <further-classification edition="200601120260205B">H01G5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉穎欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種電容位置優化方法及半導體製程設備，該方法基於匹配裝置中各可調電容的初始位置對各可調電容的位置進行反覆運算更新，並在滿足反覆運算終止條件時基於各次反覆運算中的反射功率確定各可調電容的目標位置，其中，在當次反覆運算中，基於當前功率梯度確定當次反覆運算中各可調電容的目標調節方向和目標調節步長，當前功率梯度表徵當次反覆運算中的反射功率的第一屬性資訊，從而能夠根據反覆運算過程中反射功率的變化狀態不斷地對各可調電容的位置進行自動優化，能夠有效降低反射功率，極大降低了人力成本和時間成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method for optimizing capacitor positions and a semiconductor processing equipment. The method is based on iteratively updating the positions of each adjustable capacitor in a matching device according to their initial positions. When the iterative calculation termination condition is satisfied, the target positions of each adjustable capacitor are determined based on the reflected power in each iteration. Wherein, in the current iteration, the target adjustment direction and target adjustment step size for each adjustable capacitor are determined based on the current power gradient. The current power gradient characterizes the first attribute information of the reflected power in the current iteration. In this way, the positions of each adjustable capacitor can be automatically optimized according to the changing state of the reflected power during the iterative process, which can effectively reduce the reflected power and greatly reduce labor and time costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1514" publication-number="202619872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供聚酯薄膜資源循環價值鏈解決方案的方法、執行該方法的廢物處理裝置、包含該裝置的資源循環處理系統、存儲有電腦程式的電腦可讀記錄介質及存儲在電腦可讀記錄介質中的電腦程式</chinese-title>  
        <english-title>METHOD PROVIDING VALUE CHAIN SOLUTIONS FOR RESOURCE RECYCLING OF POLYESTER FILM, WASTE DISPOSAL APPARATUS TO PERFORM THE METHOD, RESOURCE RECYCLING PROCESSING SYSTEMS, COMPUTER-READABLE RECORDING MEDIA CONTAINING COMPUTER PROGRAMS AND COMPUTER PROGRAMS STORED IN COMPUTER-READABLE RECORDING MEDIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">B29B17/02</main-classification>  
        <further-classification edition="200601120260215B">C08J11/10</further-classification>  
        <further-classification edition="200601120260215B">C10L5/48</further-classification>  
        <further-classification edition="202301120260215B">G06Q10/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雪熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SEOL-HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金知丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰焕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧承惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, SEUNGHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高宏銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例的資源循環處理系統包括：廢棄物處理裝置，支援通過對廢棄聚酯薄膜的再利用處理來生產資源循環產品的資源循環價值鏈；產品生產裝置，利用從所述廢棄物處理裝置提供的所述化學再利用原料，生成資源循環產品；以及廢棄物收集裝置，收集所述資源循環產品中的至少一部分廢棄物，提供至所述廢棄物處理裝置，所述廢棄物處理裝置和所述產品生產裝置以及所述廢棄物收集裝置將聚酯薄膜經過所述化學再利用原料轉化為所述資源循環產品，轉化的所述資源循環產品中至少一部分被收集，作為廢棄聚酯薄膜提供至所述廢棄物分類部步驟，以支援閉環運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resource recycling processing system according to an embodiment includes: a waste disposal apparatus configured to support a resource recycling value chain for producing a resource recycled product through recycling treatment of a waste polyester film; a product production apparatus configured to generate the resource recycled product using a chemical recycled raw material provided from the waste disposal apparatus; and a waste collection apparatus configured to collect at least a portion of waste of the resource recycled product and provide the collected waste to the waste disposal apparatus. The waste disposal apparatus, the product production apparatus, and the waste collection apparatus support a closed-loop operation in which the polyester film is converted into the resource recycled product via the chemical recycled raw material, and at least a portion of the converted resource recycled product is collected and provided as the waste polyester film to a waste classification step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:資源循環處理系統</p>  
        <p type="p">210:廢棄物收集裝置</p>  
        <p type="p">220:廢棄物處理裝置</p>  
        <p type="p">230:產品生產裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1515" publication-number="202620631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保留站之共用標籤比較器</chinese-title>  
        <english-title>SHARING TAG COMPARATORS FOR RESERVATION STATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G06F9/38</main-classification>  
        <further-classification edition="200601120260202B">G06F1/10</further-classification>  
        <further-classification edition="200601120260202B">G06F7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　東國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, DUNG QUOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇拉　維蒂莎　瑞迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRRA, VIDISHA REDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博南諾　詹姆斯　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONANNO, JAMES JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普里亞達什　施瓦姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIYADARSHI, SHIVAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃司伯　約翰　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESPER, JOHN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於共用標籤比較器之方法、系統及設備，包括編碼在電腦儲存媒體上之電腦程式。該等方法中之一者包括：藉由一共用比較器獲得一廣播目的地標籤，其中該共用比較器針對儲存在RSV中之一指令進行操作；藉由一選擇邏輯模組自包括一第一源之一標籤及一第二源之一標籤的標籤當中選擇一源標籤，其中該第一源及該第二源由該指令使用；及藉由該共用比較器將所選標籤與該廣播目的地標籤進行比較。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and apparatus, including computer programs encoded on computer storage media, for sharing tag comparators. One of the methods includes obtaining, by a shared comparator, a broadcast destination tag, wherein the shared comparator operates for an instruction stored in the RSV; selecting, by a selection logic module, a source tag from among tags that include a tag of a first source and a tag of a second source, wherein the first source and the second source are used by the instruction; and comparing, by the shared comparator, the selected tag and the broadcast destination tag.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">202:RSV</p>  
        <p type="p">204:RSV指令</p>  
        <p type="p">206:指令選擇模組</p>  
        <p type="p">208:第一指令項目/第一指令/指令</p>  
        <p type="p">210:非分段式匯流排</p>  
        <p type="p">212:分段式匯流排</p>  
        <p type="p">214:CAM共用源喚醒模組</p>  
        <p type="p">216:第二指令</p>  
        <p type="p">218:第N指令</p>  
        <p type="p">220:共用CAM/共用CAM X1</p>  
        <p type="p">222:CAM/CAM X2</p>  
        <p type="p">230:源X1</p>  
        <p type="p">232:源X2</p>  
        <p type="p">234:MUX</p>  
        <p type="p">236:或閘</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1516" publication-number="202619967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合粒子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C01B21/087</main-classification>  
        <further-classification edition="200601120260210B">C23C16/453</further-classification>  
        <further-classification edition="201701120260210B">C01B32/956</further-classification>  
        <further-classification edition="200601120260210B">B01J21/06</further-classification>  
        <further-classification edition="200601120260210B">B01J21/12</further-classification>  
        <further-classification edition="200601120260210B">B01J23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日清工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSHIN ENGINEERING INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上谷文宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYA, FUMIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田大助</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複合粒子，其係產氨化合物被載持於載體而成者，且特徵在於：上述載體係選自由碳化矽、氧化鋁、氧化鈦、氧化矽、氧化鋯、氧化鈰、矽鋁（silica-alumina）、氧化鈣（calcia）、氧化鎂及碳黑所組成之群中之至少1種，上述產氨化合物係藉由加熱而使氨產生之化合物，且係對全氟己烷具有不溶性，進而，比重小於全氟己烷於20℃之比重者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1517" publication-number="202620053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＤ１２３抗體及新降解劑偶聯物</chinese-title>  
        <english-title>ANTI-CD123 ANTIBODIES AND NEODEGRADER CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/28</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">C12N15/13</further-classification>  
        <further-classification edition="201701120260202B">A61K47/68</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商歐倫醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORUM THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔東起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DONG-KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金茶永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DA-YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金敏洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MIN-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉希諾　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALACINO, JAMES J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔克魯里　胡洛德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKROURI, KHULOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　勤思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, QINSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑汀　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUTIN, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了特異性結合至CD123的結合部分及包含其的GSPT1新降解劑偶聯物。亦提供了包含該等結合部分及新降解劑偶聯物的組合物。該等化合物及組合物可用於治療疾病或疾患，例如血液癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides binding moieties that specifically bind to CD123 and GSPT1 neoDegrader conjugates comprising the same. Also provided are compositions comprising the binding moieties and neoDegrader conjugates. The compounds and compositions are useful for treating a disease or condition, e.g., hematological cancers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1518" publication-number="202621286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路裝置</chinese-title>  
        <english-title>CIRCUIT DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification>  
        <further-classification edition="202601120260223B">H10W42/00</further-classification>  
        <further-classification edition="202601120260223B">G06F1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林辰永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴永國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOUNGGOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛曉宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HYO JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KANG-ILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路裝置可包括具有基板的上表面上的第一單元結構的第一單元、具有基板的上表面上的第二單元結構的第二單元、位於基板的上表面上的信號軌跡、位於基板的下表面上的第一電源傳輸軌道、以及在第一邊界處由第一單元界定並在第二邊界處由第二單元界定的電源傳輸區域，其中第二邊界在與第一方向相交的第二方向上相對於電源傳輸區域與第一邊界相對，其中電源傳輸區域包括第一電源傳輸接點，並且其中第一電源傳輸軌道透過第一電源傳輸接點電性連接到第一單元結構和第二單元結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit device may include a first cell that includes a first cell structure on an upper surface of a substrate, a second cell that includes a second cell structure on the upper surface of the substrate, signal tracks on the upper surface of the substrate, a first power delivery track on a lower surface of the substrate, and a power delivery region that is bounded by the first cell at a first boundary and is bounded by the second cell at a second boundary, where the second boundary is opposite to the first boundary with respect to the power delivery region in a second direction that intersects the first direction, where the power delivery region includes a first power delivery contact, and where the first power delivery track is electrically connected to the first cell structure and the second cell structure through the first power delivery contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路裝置</p>  
        <p type="p">150:背面電力分配網路(BSPDN)</p>  
        <p type="p">200:單元</p>  
        <p type="p">202:基板</p>  
        <p type="p">204:擴散中斷圖案</p>  
        <p type="p">206:單元結構</p>  
        <p type="p">212-1、212-2:前側信號軌跡</p>  
        <p type="p">214:MOL結構</p>  
        <p type="p">222:主動閘極圖案</p>  
        <p type="p">224:源極/汲極圖案</p>  
        <p type="p">240、242:電源傳輸接點</p>  
        <p type="p">370:電源傳輸接點通孔</p>  
        <p type="p">B-B、C-C:虛線</p>  
        <p type="p">D1、D2、D3:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1519" publication-number="202621070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用遠端源、相干光子中介層電路及電子－光子積體電路之光學系統</chinese-title>  
        <english-title>OPTICAL SYSTEMS EXPLOITING REMOTE SOURCES, COHERENT PHOTONIC INTERPOSER CIRCUITS AND ELECTRONIC-PHOTONIC INTEGRATED CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260211B">H04B10/50</main-classification>  
        <further-classification edition="200601120260211B">G02B6/12</further-classification>  
        <further-classification edition="200601120260211B">G02B6/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施　煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈邁德　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHMADI, MOHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞佩里安　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEPEHRIAN, HASSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施　煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈邁德　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHMADI, MOHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞佩里安　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEPEHRIAN, HASSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用遠端源、相干光子中介層電路及電子-光子積體電路之光學系統，主要利用光子通信的應用中之日益增長的需求正在將重點轉向相干調變格式，以進一步提高容量。與當前光學通信網路中之常規開關鍵控調變格式相比，相干調變格式在光學信號之相位及振幅兩者上對資訊進行編碼。然而，管理相干通信比開關鍵控更為複雜，且因此，劃分電子領域及光子領域變得頗具吸引力，使得每一領域專注於最適合自己的功能性，而不是試圖將所有功能性強制納入光子領域。本發明提供了用於將電子積體電路(IC)與相干光子中介層電路及相干光子電子介面電路介接以提高介接電子IC之鏈路及光學開關的頻譜效率、頻寬及鏈路預算之系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:光子開關的通用拓撲結構</p>  
        <p type="p">102(1):固定波導光源</p>  
        <p type="p">102(2):固定波導光源</p>  
        <p type="p">102(N-1):固定波導光源</p>  
        <p type="p">102(N):固定波導光源</p>  
        <p type="p">104:NxM開關</p>  
        <p type="p">110:遠端可重新組態之光子源(RRPS)</p>  
        <p type="p">130:節點叢集</p>  
        <p type="p">130(1):計算節點</p>  
        <p type="p">130(2):計算節點</p>  
        <p type="p">130(M-1):計算節點</p>  
        <p type="p">130(M):計算節點</p>  
        <p type="p">140:波長選擇性路由器</p>  
        <p type="p">145:MxM波長路由器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1520" publication-number="202621454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有改良吸附的加熱器基座</chinese-title>  
        <english-title>HEATER PEDESTAL WITH IMPROVED CHUCKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/78</main-classification>  
        <further-classification edition="200601120260223B">C23C16/46</further-classification>  
        <further-classification edition="200601120260223B">C23C16/513</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆斯塔法　姆漢納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSTAFA, MUHANNAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴魯札　桑傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALUJA, SANJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種加熱器基座可能包括一個加熱器板。該加熱器板可能包括一個單體主體和一或多個配置在該單體主體內部的加熱元件。該單體主體可能包括一個用於支撐基板的第一表面。該單體主體可能界定：在該第一表面上的第一複數個開口；在該單體主體的第二表面上的第二複數個開口；以及複數個通道，在該複數個通道中，每一個相應通道都從該第一複數個開口中的一個相應開口延伸到該第二複數個開口中的一個相應開口。該加熱器基座可能還包括一個立柱，該立柱第一表面與該單體主體的該第二表面連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heater pedestal may include a heater plate. The heater plate may include a monolithic body and one or more heater elements disposed within the monolithic body. The monolithic body may include a first surface for supporting a substrate. The monolithic body may define: a first plurality of openings in the first surface; a second plurality of openings in a second surface of the monolithic body; and a plurality of channels, each respective channel of the plurality of channels extending from a respective opening of the first plurality of openings to a respective opening of the second plurality of openings. The heater pedestal may further include a post having a first surface coupled to the second surface of the monolithic body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:加熱器基座</p>  
        <p type="p">202:加熱器板</p>  
        <p type="p">204:立柱</p>  
        <p type="p">206:單體主體</p>  
        <p type="p">208:加熱元件</p>  
        <p type="p">210:真空吸附通道</p>  
        <p type="p">212:邊緣清洗通道</p>  
        <p type="p">214:第一通道</p>  
        <p type="p">216:第二通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1521" publication-number="202620427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於定量氣體中的酸性成分或鹼性成分濃度的標準增設管柱及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G01N30/60</main-classification>  
        <further-classification edition="200601120260207B">G01N1/22</further-classification>  
        <further-classification edition="200601120260207B">G01N30/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住化分析中心股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMIKA CHEMICAL ANALYSIS SERVICE, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安倍聡彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤佳美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YOSHIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯川玲子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIKAWA, REIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於定量氣體中的酸性成分或鹼性成分濃度的標準增設管柱，能夠藉由單純化的作業而簡便地對氣體中所含之酸性成分或鹼性成分的濃度進行定量，其係在用於捕集氣體中的酸性成分的酸性成分捕集用管柱中增設有已知量的酸性成分，或者在用於捕集氣體中的鹼性成分的鹼性成分捕集用管柱中增設有已知量的鹼性成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1522" publication-number="202620158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯酸系黏著劑、丙烯酸系黏著片材、及可撓性裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09J133/08</main-classification>  
        <further-classification edition="201801120260223B">C09J7/20</further-classification>  
        <further-classification edition="201801120260223B">C09J7/40</further-classification>  
        <further-classification edition="200601120260223B">C08F220/18</further-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井良介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方聡一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種丙烯酸系黏著劑，於低壓環境下使包含該丙烯酸系黏著劑之丙烯酸系黏著片材之黏著劑面與被黏著體貼合而成之積層體反覆彎曲之情形時，即便在該丙烯酸系黏著片材與該被黏著體之間存在微粒子，亦可抑制該丙烯酸系黏著片材與該被黏著體之間產生氣泡。 &lt;br/&gt;本發明之實施方式之丙烯酸系黏著劑係由丙烯酸系黏著劑組合物所形成，且該丙烯酸系黏著劑組合物包含作為基礎聚合物之丙烯酸系聚合物(A)、及交聯劑，該丙烯酸系聚合物(A)之根據FOX公式算出之Tg未達-50℃，該丙烯酸系聚合物(A)於特定條件下測得之蠕變為1.0%以上且未達8.0%，於特定條件下對聚醯亞胺膜之黏著力為8.0 N/25 mm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:覆蓋膜</p>  
        <p type="p">20:黏著劑層</p>  
        <p type="p">30:偏光板</p>  
        <p type="p">40:黏著劑層</p>  
        <p type="p">50:觸控感測器</p>  
        <p type="p">60:黏著劑層</p>  
        <p type="p">70:OLED</p>  
        <p type="p">80:黏著劑層</p>  
        <p type="p">90:基材層</p>  
        <p type="p">100:黏著片材</p>  
        <p type="p">1000:可撓性裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1523" publication-number="202620913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">H01G4/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄谷涼太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARAYA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島隼人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村西直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURANISHI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内田和久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIDA, KAZUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠滿足提高高溫可靠性與防止靜電電容降低這兩者之積層陶瓷電容器。本發明之積層陶瓷電容器具備配置於內層部11中之積層方向之一第1面F1側之第1外層部121、及配置於內層部11中之與積層方向正交之第1方向之一第3面F3側之第3外層部123，第1外層部121包含Mn，第3外層部包含Mg，於與積層方向及第1方向平行之剖面中，內部介電層之Mn之含量隨著自第1面F1側朝向內層部11之積層方向之中央而減少，內部介電層之Mg之含量隨著自第3面側朝向內層部11之第1方向之中央而減少。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1524" publication-number="202620066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合性組合物、硬化物及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08F2/50</main-classification>  
        <further-classification edition="200601120260210B">G03F7/028</further-classification>  
        <further-classification edition="200601120260210B">C08G71/04</further-classification>  
        <further-classification edition="200601120260210B">C08K3/22</further-classification>  
        <further-classification edition="200601120260210B">C08G77/18</further-classification>  
        <further-classification edition="200601120260210B">C08L33/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商艾迪科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>六谷翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROKUYA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤陽輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種聚合性組合物，其含有下述通式(I)所表示之光聚合起始劑(A)、胺基甲酸酯丙烯酸酯(B)、矽烷偶合劑(C)、鹼性顯影性化合物(D)、白色顏料(E)及調平劑(F)。胺基甲酸酯丙烯酸酯(B)較佳為具有羧基之胺基甲酸酯丙烯酸酯。矽烷偶合劑(C)亦較佳為下述通式(II)所表示之化合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="312px" width="353px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;(式中之符號參照說明書中之記載)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:圖案</p>  
        <p type="p">θ:角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1525" publication-number="202619670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>STATION FOR ROBOT CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A47L11/40</main-classification>  
        <further-classification edition="200601120260223B">A47L11/24</further-classification>  
        <further-classification edition="200601120260223B">A47L9/28</further-classification>  
        <further-classification edition="200601120260223B">D06F29/00</further-classification>  
        <further-classification edition="202601120260223B">F26B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳廷玩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JUNGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JUNG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種根據本發明一個實施例的清掃機器人工作站可包括：主體；清潔板；第一供應流路；第二供應流路；加熱器；以及整合式流路。熱水及/或蒸汽可通過第一供應流路供應至清潔板的清潔空間，而原水可通過第二供應流路供應至清潔空間。根據本發明的一個實施例，可迅速地進行原水及熱水（或蒸汽）的供應，原水及熱水（或蒸汽）可通過單條流路供應至清潔空間以解決流路的連接部分處的漏水，並可密集且有效地進行拖布的清潔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A station for a robot cleaner according to one embodiment of the present disclosure may include a main body, a cleaning plate, a first supply flow path, a second supply flow path, a heater, and an integrated flow path. Hot water and/or steam may be supplied to a cleaning space of the cleaning plate through the first supply flow path, and raw water may be supplied to the cleaning space through the second supply flow path. According to one embodiment of the present disclosure, supply of raw water and hot water (or steam) may be rapidly performed, raw water and hot water (or steam) may be supplied to the cleaning space through a single flow path to address water leakage at connection portions of the flow path, and cleaning of the mop may be performed intensively and effectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">170:清潔板</p>  
        <p type="p">171:清潔空間</p>  
        <p type="p">171a:第一清潔空間</p>  
        <p type="p">171b:第二清潔空間</p>  
        <p type="p">172:清潔底表面</p>  
        <p type="p">172a:第一清潔底表面</p>  
        <p type="p">172b:第二清潔底表面</p>  
        <p type="p">172c:內貫通孔</p>  
        <p type="p">173:邊界壁</p>  
        <p type="p">174:清潔水入口</p>  
        <p type="p">175a:第一引導壁</p>  
        <p type="p">175b:第二引導壁</p>  
        <p type="p">177a:第三引導壁</p>  
        <p type="p">177b:突出部、第二突出部</p>  
        <p type="p">178a:外底表面</p>  
        <p type="p">178b:外貫通孔</p>  
        <p type="p">179:外邊界壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1526" publication-number="202620130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱導性矽酮系組成物及其固化物與電子裝置</chinese-title>  
        <english-title>THERMALLY CONDUCTIVE SILICONE-BASED COMPOSITION AND CURED PRODUCT AND ELECTRONIC DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251107B">C08L83/05</main-classification>  
        <further-classification edition="200601120251107B">C08L83/07</further-classification>  
        <further-classification edition="200601120251107B">C10G45/70</further-classification>  
        <further-classification edition="200601120251107B">C08G77/08</further-classification>  
        <further-classification edition="200601120251107B">C08K3/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默曼堤效能材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOMENTIVE PERFORMANCE MATERIALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸松伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAM, SONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施狀態的熱導性矽酮系組成物包括：1）第一聚矽氧烷，包含至少一個烯基；2）第二聚矽氧烷，包含至少一個氫基；3）矽氫化觸媒；以及4）填充材料，所述填充材料包括平均粒徑為0.1微米以上且小於1微米且比表面積為6平方米/公克至8平方米/公克的第一氧化鋁，以所述填充材料的總重量為基準，所述第一氧化鋁的含量為5重量%至25重量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermally conductive silicone-based composition according to one embodiment of the present invention comprises: 1) a first polysiloxane comprising at least one alkenyl group; 2) a second polysiloxane comprising at least one hydrogen group; 3) a hydrosilylation catalyst; and 4) a filler, wherein the filler comprises first alumina having an average particle diameter of 0.1 µm or more and less than 1 µm and a specific surface area of 6 m&lt;sup&gt;2&lt;/sup&gt;/g to 8 m&lt;sup&gt;2&lt;/sup&gt;/g, and the content of the first alumina is 5 wt% to 25 wt% based on the total weight of the filler.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1527" publication-number="202620321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體控制裝置、及流體混合裝置</chinese-title>  
        <english-title>FLUID CONTROL DEVICE AND FLUID MIXING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F16K1/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA STEC, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡薩雷斯　埃斯特班</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONZALEZ, ESTEBAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普萊斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRICE, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在不使流體控制裝置的下游側處的混合歧管等結構複雜化的情況下，使氣體的供給高速化，一種流體控制裝置，其分別導入第一流體及第二流體，將該些第一流體及第二流體混合並導出，所述流體控制裝置包括：流路塊，形成有供導入第一流體的第一流路、供導入第二流體的第二流路、及連接有第一流路及第二流路的合流流路；第一流體阻力器，設置於第一流路；第一控制閥，在第一流路中設置於第一流體阻力器的上游側或下游側，對第一流體進行控制；第二流體阻力器，設置於第二流路；以及第二控制閥，在第二流路中設置於第二流體阻力器的上游側或下游側，對第二流體進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to accelerate gas supply without increasing complexity of the configuration such as a mixing manifold on a downstream side of a fluid control device. A fluid control device is provided into which a first fluid and a second fluid are respectively introduced, and the first fluid and the second fluid are mixed and discharged, the fluid control device including: a flow path block, in which a first flow path into which the first fluid is introduced, a second flow path into which the second fluid is introduced, and a merged flow path to which the first flow path and the second flow path are connected are formed; a first fluid resistor, provided in the first flow path; a first control valve, provided on an upstream side or downstream side of the first fluid resistor in the first flow path, controlling the first fluid; a second fluid resistor, provided in the second flow path; and a second control valve, provided on an upstream side or downstream side of the second fluid resistor in the second flow path, controlling the second fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3A:流體控制裝置/混合流體控制裝置</p>  
        <p type="p">31a:第一流路</p>  
        <p type="p">31a1、31b1:連接流路部</p>  
        <p type="p">31b:第二流路</p>  
        <p type="p">31x:連接部</p>  
        <p type="p">32:合流流路</p>  
        <p type="p">33a:流體阻力器/第一流體阻力器</p>  
        <p type="p">33b:流體阻力器/第二流體阻力器</p>  
        <p type="p">34a:第一控制閥</p>  
        <p type="p">34b:第二控制閥</p>  
        <p type="p">35a:第一上游側壓力感測器</p>  
        <p type="p">35b:第二上游側壓力感測器</p>  
        <p type="p">36a:第一下游側壓力感測器</p>  
        <p type="p">36b:第二下游側壓力感測器</p>  
        <p type="p">310:流路塊</p>  
        <p type="p">310M:凹部</p>  
        <p type="p">GP1:第一氣體埠</p>  
        <p type="p">GP2:第二氣體埠</p>  
        <p type="p">GP3:混合氣體埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1528" publication-number="202619783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳分離回收方法、合成物的製造方法及二氧化碳分離回收設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">B01D53/48</main-classification>  
        <further-classification edition="200601120260203B">B01D53/75</further-classification>  
        <further-classification edition="201701120260203B">C01B32/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山尚樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川祐太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沖田智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKIDA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紫垣伸行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGAKI, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種能夠自包含二氧化碳、硫化氫及羰基硫的原料氣體將去除了硫化氫及羰基硫的二氧化碳分離回收的二氧化碳分離回收方法。本發明的二氧化碳分離回收方法為自包含二氧化碳、硫化氫及羰基硫的原料氣體將二氧化碳分離回收的方法，具有：二氧化碳分離步驟，自原料氣體G01分離二氧化碳而生成含有二氧化碳的氣體G03；加濕步驟，生成提高了含有二氧化碳的氣體的氣相H&lt;sub&gt;2&lt;/sub&gt;O濃度的加濕氣體G06；及脫硫步驟，自加濕氣體G06中去除硫化氫及羰基硫的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:除濕設備</p>  
        <p type="p">6:二氧化碳分離設備</p>  
        <p type="p">7:加濕設備</p>  
        <p type="p">8:脫硫設備</p>  
        <p type="p">G01:原料氣體</p>  
        <p type="p">G02:非吸附氣體</p>  
        <p type="p">G03:含有二氧化碳的氣體</p>  
        <p type="p">G06:加濕氣體</p>  
        <p type="p">G07:含有脫硫二氧化碳的氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1529" publication-number="202621174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頻寬部分配置方法與設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR BANDWIDTH PART CONFIGURATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/23</main-classification>  
        <further-classification edition="200601120260202B">H04L25/02</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖怡茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖培凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PEI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝其軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供頻寬部分配置方法和設備。其中一實施例提供一種頻寬部分配置方法，包括：由設備的處理器通過RRC信令從網路接收配置，其中配置包括小區中多個BWP上的物理通道或信號配置，物理通道或信號配置包括至少一個第一配置，並且其中第一配置與BWP ID相關聯；以及由處理器根據配置從網路節點接收或向網路節點發送物理通道或信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and methods are provided for bandwidth part configuration. In one novel aspect, a method may involve an apparatus receiving a configuration from a network through a radio resource control (RRC) signaling. The configuration may comprise a physical channel or signal configuration across a plurality of BWPs in a cell. The physical channel or signal configuration may comprise at least one first configuration (e.g., BWP-specific configuration). The first configuration may be associated with a BWP identifier (ID). The method may also involve the apparatus receiving or transmitting physical channels or signals from or to the network node according to the configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:過程</p>  
        <p type="p">310-320:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1530" publication-number="202620914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H01G4/30</main-classification>  
        <further-classification edition="200601120260209B">H01G2/06</further-classification>  
        <further-classification edition="200601120260209B">H01G4/005</further-classification>  
        <further-classification edition="200601120260209B">H01G4/228</further-classification>  
        <further-classification edition="200601120260209B">H01G4/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富永健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMINAGA, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉由紀枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YUKIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗谷淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITANI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧田光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUDA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMATSU, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田辰徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, TATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可實現進一步之低ESL化之積層陶瓷電容器。 &lt;br/&gt;本發明之積層陶瓷電容器10包含：積層體，其具有：沿積層方向相對之第1面及第2面、沿與積層方向正交之第1方向相對之第3面及第4面、及沿與積層方向及第1方向正交之第2方向相對之第5面及第6面；第1外部電極，其配置於第1面上及第3面上；第2外部電極，其配置於第1面上及第3面上；第3外部電極，其配置於第1面上及第4面上；第4外部電極，其配置於第1面上及第4面上；第5外部電極，其配置於第1面上及第3面上、且為第1外部電極與第2外部電極之間；第6外部電極，其配置於第1面上及第6面上；第7外部電極，其配置於第1面上及第4面上、且為第3外部電極與第4外部電極之間；及第8外部電極，其配置於第1面上及第5面上；且積層體具有：第1內部電極，其露出於第3面上及第4面上，與第1外部電極至第4外部電極連接；及第2內部電極，其露出於第3面上、第4面上、第5面上及第6面，與第5外部電極至第8外部電極連接；將第1方向之尺寸設為L，將第2方向之尺寸設為W時，0.85≦L/W≦1.00。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層陶瓷電容器</p>  
        <p type="p">12:積層體</p>  
        <p type="p">12a:第1面</p>  
        <p type="p">12b:第2面</p>  
        <p type="p">12c:第3面</p>  
        <p type="p">12d:第4面</p>  
        <p type="p">12e:第5面</p>  
        <p type="p">12f:第6面</p>  
        <p type="p">30:外部電極</p>  
        <p type="p">30a:第1外部電極</p>  
        <p type="p">30b:第2外部電極</p>  
        <p type="p">30c:第3外部電極</p>  
        <p type="p">30d:第4外部電極</p>  
        <p type="p">30e:第5外部電極</p>  
        <p type="p">30f:第6外部電極</p>  
        <p type="p">30g:第7外部電極</p>  
        <p type="p">30h:第8外部電極</p>  
        <p type="p">L:積層陶瓷電容器之第2方向之尺寸</p>  
        <p type="p">T:積層陶瓷電容器之積層方向之尺寸</p>  
        <p type="p">W:積層陶瓷電容器之第1方向之尺寸</p>  
        <p type="p">x:積層方向</p>  
        <p type="p">y:第1方向</p>  
        <p type="p">z:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1531" publication-number="202621376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法、半導體器件之製造方法、蝕刻裝置及蝕刻氣體組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="200601120260223B">C09K13/06</further-classification>  
        <further-classification edition="200601120260223B">C09K13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井拓海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMORI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種即便使用作為GWP較低之氣體之含碘化合物氣體，於低溫下之蝕刻速度亦優異之蝕刻方法、半導體器件之製造方法、蝕刻裝置及蝕刻氣體組合物。 &lt;br/&gt;本發明係關於一種蝕刻方法，其使用將蝕刻氣體組合物電漿化而獲得之電漿氣體，於-20℃以下對被蝕刻對象進行蝕刻，該蝕刻氣體組合物包含含碘化合物氣體(第1氣體)、及選自由F&lt;sub&gt;2&lt;/sub&gt;、ClF&lt;sub&gt;3&lt;/sub&gt;、ClF、ClF&lt;sub&gt;5&lt;/sub&gt;、BrF&lt;sub&gt;3&lt;/sub&gt;及BrF&lt;sub&gt;5&lt;/sub&gt;所組成之群中之至少1種氣體(第2氣體)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1532" publication-number="202621074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者設備及使用者設備啟動的波束報告的方法</chinese-title>  
        <english-title>USER EQUIPMENT AND METHOD OF USER EQUIPMENT-INITIATED BEAM REPORTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04L1/18</main-classification>  
        <further-classification edition="200901120260202B">H04W24/10</further-classification>  
        <further-classification edition="200601120260202B">H04B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙默漢馬迪安　霍達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHMOHAMMADIAN, HODA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露用於波束報告的一種系統及一種方法。系統可包括使用者設備（UE），使用者設備包括無線電及處理電路，且被配置成：實行使用者設備啟動的波束報告程序，包括：經由無線電在第一通道中傳送波束報告指示訊息以啟動波束報告，以及經由無線電在第二通道中傳送波束報告；推斷使用者設備啟動的波束報告程序的通訊失敗；以及因應於推斷使用者設備啟動的波束報告程序的通訊失敗，對第一通道中的波束報告指示訊息或第二通道中的波束報告中的至少一者進行重傳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method are disclosed for beam reporting. The system can include a user equipment (UE) comprising a radio and a processing circuit, and configured to: perform a UE-initiated beam reporting procedure comprising: transmitting, via the radio, a beam reporting indication message in a first channel to initiate beam reporting; and transmitting, via the radio, a beam report in a second channel; infer a communication failure of the UE-initiated beam reporting procedure; and in response to inferring the communication failure of the UE-initiated beam reporting procedure, retransmit at least one of the beam reporting indication message in the first channel or the beam report in the second channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">402、404、406、408:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1533" publication-number="202620356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於散熱裝置的銀銅合金焊環</chinese-title>  
        <english-title>SILVER-COPPER ALLOY WELDING RING USED IN HEAT DISSIPATION DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">F28D15/02</main-classification>  
        <further-classification edition="200601120260215B">F28F3/06</further-classification>  
        <further-classification edition="200601120260215B">B23K37/04</further-classification>  
        <further-classification edition="200601120260215B">B23K35/22</further-classification>  
        <further-classification edition="200601320260215B">B23K103/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商訊強電子(惠州)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOLER MASTER (HUIZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉壘壘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LEI LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃健嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIAN-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置包含：板體，配置成與一發熱元件進行熱耦合；板蓋，安裝於板體；板體與板蓋共同界定出一均溫板；至少一內部毛細結構，設置於均溫板內；多個支撐柱，設置於均溫板內；以及多個熱管，每一熱管延伸穿過形成在板蓋中的一通孔，其中熱管是藉由在熱管與通孔之間的界面處焊接一焊環而鍵合到該板蓋，該焊環包含一種銀銅合金，其含有約66%至約76%的銀以及約24%至約34%的銅。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device includes a plate body configured to be thermally coupled to a heat-generating element, a plate cover mounted to the plate body, the plate body and the plate cover together defining a vapor chamber, at least one internal wick structure disposed within the vapor chamber, a plurality of support columns disposed within the vapor chamber, and a plurality of heat pipes, each heat pipe extending through a corresponding through hole formed in the plate cover. The heat pipe is bonded to the plate cover by soldering a welding ring at an interface between the heat pipe and the corresponding through hole, the welding ring comprising a silver-copper alloy containing about 66% to about 76% silver and about 24% to about 34% copper.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:板體</p>  
        <p type="p">104:板蓋</p>  
        <p type="p">106:熱管</p>  
        <p type="p">108:第一突起結構</p>  
        <p type="p">110:第二突起結構</p>  
        <p type="p">112:均溫板</p>  
        <p type="p">114:內部毛細結構</p>  
        <p type="p">116:支撐柱</p>  
        <p type="p">118:通孔</p>  
        <p type="p">120:焊環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1534" publication-number="202620604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容筆</chinese-title>  
        <english-title>CAPACITIVE PEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251020B">G06F3/0354</main-classification>  
        <further-classification edition="200601120251020B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊電子科技（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN ) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YULIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧經發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JINGFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種電容筆，涉及主動式電容筆技術領域。該電容筆包括筆頭、PCB板、壓力傳感組件及筆身，壓力傳感組件與PCB板通訊連接；筆身包括磁吸件及與PCB板電性連接的導電件，壓力傳感組件設置於磁吸件背離筆頭的一端，筆頭能夠通過磁吸件將壓力傳遞至壓力傳感組件，筆頭與磁吸件通過磁吸可拆卸連接，且當筆頭與磁吸件處於磁吸狀態下，筆頭與導電件電性連接。該電容筆提高了更換筆頭的效率，提升使用者體驗，簡化了結構，降低了成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a capacitive pen and relates to the technical field of active capacitive pens. The capacitive pen includes a pen head, a PCB board, a pressure sensing element and a pen body. The pressure sensing element is communicatively connected with the PCB board. The pen body includes a magnetic attraction component and a conductive component electrically connected to the PCB board. The pressure sensing element is disposed on an end of the magnetic piece facing away from the pen tip. The pen tip can transmit pressure to the pressure sensing component through the magnetic attraction component. The pen tip and the magnetic suction piece are detachably connected through magnetic suction. When the pen tip and the magnetic attraction part are in a magnetic attraction state, the pen tip and the conductive part are electrically connected. The capacitive pen improves the efficiency of replacing pen heads, improves user experience, simplifies the structure, and reduces costs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:筆頭</p>  
        <p type="p">11:第一連接件</p>  
        <p type="p">111:書寫端</p>  
        <p type="p">112:連接端</p>  
        <p type="p">12:第二連接件</p>  
        <p type="p">13:導電圈</p>  
        <p type="p">14:絕緣套</p>  
        <p type="p">2:筆芯組件</p>  
        <p type="p">21:套筒</p>  
        <p type="p">211:支撐套筒</p>  
        <p type="p">212:定位套筒</p>  
        <p type="p">213:緩衝套環</p>  
        <p type="p">22:壓力感測器</p>  
        <p type="p">23:彈簧</p>  
        <p type="p">24:磁吸件</p>  
        <p type="p">25:頂桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1535" publication-number="202621538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成半導體封裝的方法、半導體封裝組件設備與半導體基板組件</chinese-title>  
        <english-title>METHOD FOR FORMING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE ASSEMBLY APPARATUS AND SEMICONDUCTOR SUBSTRATE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商力特福斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITTELFUSE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾多　吉布里歐　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALDO, TIBURCIO A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅森　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROZEN, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德維薩　阿內爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVEZA, ARNEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯潘　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPANN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡杜特　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CADUT, ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休斯　羅德里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUGHES, RHODRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於形成半導體封裝的方法。方法可包括執行引線附接操作，包含將至少一個引線直接附接至配置為支撐一或多個半導體晶粒的基板，其中至少一個引線以單體化方式附接至基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a semiconductor package. The method may include performing a lead attachment operation, comprising attaching at least one lead directly to a substrate that is configured to support one or more semiconductor die, wherein the at least one lead is attached to the substrate in singulated fashion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:半導體基板組件</p>  
        <p type="p">121:基板</p>  
        <p type="p">122:半導體晶粒</p>  
        <p type="p">124:金屬化圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1536" publication-number="202620918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發射器及電子槍</chinese-title>  
        <english-title>EMITTER AND ELECTRON GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">H01J37/06</main-classification>  
        <further-classification edition="200601120260212B">H01J37/065</further-classification>  
        <further-classification edition="200601120260212B">H01J37/073</further-classification>  
        <further-classification edition="200601120260212B">H01J37/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之發射器，具備具有發射帶電粒子之前端（100）之發射構件（10）。發射構件（10）從前端（100）側依序具備第1部分（11）、第2部分（12）及第（3）部分（13）。第1部分（11）為粗細朝向前端（100）變粗之部分。第3部分（13）為粗細朝向遠離前端（100）之方向變粗之部分。第2部分（12）為粗細變化率小於第3部分（13）的粗細變化率之部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An emitter of the invention comprises an emission member (10) having a tip (100) that emits charged particles. The emission member (10) comprises, in order from the side of the tip (100), a first section (11), a second section (12), and a third section (13). The first section (11) thickens toward the tip (100). The third section (13) thickens in the direction away from the tip (100). The second section (12) has a rate of thickness change that is smaller than the rate of thickness change of the third section (13).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:發射構件</p>  
        <p type="p">11:第1部分</p>  
        <p type="p">12:第2部分</p>  
        <p type="p">13:第3部分</p>  
        <p type="p">100:前端</p>  
        <p type="p">101:第1平面</p>  
        <p type="p">102:前端部</p>  
        <p type="p">105:軸</p>  
        <p type="p">L&lt;sub&gt;t1&lt;/sub&gt;,L&lt;sub&gt;t3&lt;/sub&gt;:距離</p>  
        <p type="p">L2:長度</p>  
        <p type="p">d&lt;sub&gt;2r&lt;/sub&gt;,d&lt;sub&gt;2t&lt;/sub&gt;:寬度</p>  
        <p type="p">α:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1537" publication-number="202620919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發射器及電子槍</chinese-title>  
        <english-title>EMITTER AND ELECTRON GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">H01J37/06</main-classification>  
        <further-classification edition="200601120260212B">H01J37/065</further-classification>  
        <further-classification edition="200601120260212B">H01J37/073</further-classification>  
        <further-classification edition="200601120260212B">H01J37/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之發射器，具備具有發射帶電粒子之前端（100）之發射構件（10）。發射構件（10）從前端（100）側依序具備第1部分（11）、第2部分（12）及第（3）部分（13）。第1部分11為粗細朝向前端100變細之部分。第3部分13為粗細朝向前端100變細之部分。第2部分12為粗細變化率小於第1部分11的粗細變化率及第3部分13的粗細變化率中的任一個的部分。而且，第2部分12的、從發射構件10的根部朝向前端100之軸向的長度L&lt;sub&gt;2&lt;/sub&gt;為第2部分12的最小寬度的0.5倍以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An emitter of the invention comprises an emission member (10) having a tip (100) that emits charged particles. The emission member (10) comprises, in order from the side of the tip (100), a first section (11), a second section (12), and a third section (13). The first section (11) becomes narrower toward the tip (100). The third section (13) becomes narrower toward the tip (100). The second section (12) has a rate of thickness change that is smaller than both the rate of thickness change of the first section (11) and the rate of thickness change of the third section (13). Furthermore, the length (L2) in the axial direction of the second section (12) from the base of the emission member (10) toward the tip (100) is at least 0.5 times the minimum width of the second section (12).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:發射構件</p>  
        <p type="p">11:第1部分</p>  
        <p type="p">12:第2部分</p>  
        <p type="p">13:第3部分</p>  
        <p type="p">100:前端</p>  
        <p type="p">101:第1平面</p>  
        <p type="p">105:軸</p>  
        <p type="p">L&lt;sub&gt;t3&lt;/sub&gt;:距離</p>  
        <p type="p">L2:長度</p>  
        <p type="p">d&lt;sub&gt;2r&lt;/sub&gt;,d&lt;sub&gt;2t&lt;/sub&gt;:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1538" publication-number="202620092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性元件、印刷配線板及印刷配線板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C08G59/08</main-classification>  
        <further-classification edition="200601120260210B">C08F20/18</further-classification>  
        <further-classification edition="200601120260210B">C08F2/50</further-classification>  
        <further-classification edition="200601120260210B">C08F36/06</further-classification>  
        <further-classification edition="200601120260210B">C08L63/10</further-classification>  
        <further-classification edition="200601120260210B">H05K3/28</further-classification>  
        <further-classification edition="200601120260210B">G03F7/028</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部宏平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪岡諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIOKA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下直輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之永久抗蝕劑用之感光性樹脂組成物含有酸改質含乙烯基樹脂、光聚合性化合物、光聚合起始劑及彈性體，前述彈性體含有環氧當量為195g/eq以上的環氧改質聚丁二烯化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1539" publication-number="202620193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前庭支持細胞啟動子及其用途</chinese-title>  
        <english-title>VESTIBULAR SUPPORTING CELL PROMOTERS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C12N15/64</main-classification>  
        <further-classification edition="200601120260210B">C12N15/63</further-classification>  
        <further-classification edition="200601120260210B">C12N15/79</further-classification>  
        <further-classification edition="200601120260210B">C12N15/85</further-classification>  
        <further-classification edition="200601120260210B">C12N15/86</further-classification>  
        <further-classification edition="200601120260210B">A61K31/713</further-classification>  
        <further-classification edition="200601120260210B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪賽博治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECIBEL THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯恩斯　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURNS, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉勃遜　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普列格寧　蓋博雅拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREGERNIG, GABRIELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供含有SLC6A14啟動子之多核苷酸以及含有該等核苷酸之載體，其可用於促進轉殖基因在前庭支持細胞中之表現。本文所述之多核苷酸可操作連接至轉殖基因，例如編碼治療蛋白之轉殖基因，以促進該轉殖基因之前庭支持細胞表現。本文所述之多核苷酸可操作連接至治療性轉殖基因且用於治療患有前庭功能障礙或具有患上該疾病之風險之個體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides polynucleotides containing SLC6A14 promoters, as well as vectors containing the same, that can be used to promote expression of a transgene in vestibular supporting cells. The polynucleotides described herein may be operably linked to a transgene, such as a transgene encoding a therapeutic protein, so as to promote vestibular supporting cell expression of the transgene. The polynucleotides described herein may be operably linked to a therapeutic transgene and used for the treatment of subjects having or at risk of developing vestibular dysfunction.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1540" publication-number="202620224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬碳化物薄膜與相關裝置及相關方法</chinese-title>  
        <english-title>METAL CARBIDE FILMS AND RELATED DEVICES AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/32</main-classification>  
        <further-classification edition="201701120260223B">C01B32/949</further-classification>  
        <further-classification edition="200601120260223B">C23C16/08</further-classification>  
        <further-classification edition="202601120260223B">H10P14/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷特　羅柏茲　Ｌ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WRIGHT, ROBERT L. JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRIX, BRYAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提供金屬碳化物薄膜與相關裝置及相關方法。一種裝置包括一基板及定位於該基板上之一金屬碳化物薄膜。該金屬碳化物薄膜包括鉬、鎢或其等之任何組合之至少一者。該金屬碳化物薄膜包括一殘留氯組分。基於該金屬碳化物薄膜之一總組合物，該金屬碳化物薄膜具有至少10%之一碳含量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Metal carbide films and related devices and related methods are provided herein. A device comprises a substrate and a metal carbide film located on the substrate. The metal carbide film comprises at least one of a molybdenum, a tungsten, or any combination thereof. The metal carbide film comprises a residual chlorine component. The metal carbide film has a carbon content of at least 10% based on a total composition of the metal carbide film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1541" publication-number="202619878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體成形體及其製造方法</chinese-title>  
        <english-title>THREE-DIMENSIONAL MOLDED ARTICLE AND ITS MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B29C51/10</main-classification>  
        <further-classification edition="200601120260213B">B29C51/46</further-classification>  
        <further-classification edition="200601120260213B">C08J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島崇裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大庭久尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOBA, HISANAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>割野孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARINO, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含液晶聚合物，能無外觀不良地進行成形之具有深拉加工部的立體成形體及其製造方法。&lt;br/&gt; 本發明之立體成形體(1)包含含有熱塑性液晶聚合物的液晶聚合物薄膜或者含有其之薄膜狀或薄片狀的積層體，具有由底面部(11)與從底面部的周緣部立起的側面部(12)所成之構造部(10)，構造部的最大高度(H)[mm]相對於側面部的最大外徑(W)[mm]之比(H/W)為1/10～5/10，熱塑性液晶聚合物在熔點(Tm)+15℃之溫度、剪切應變速度0.1rad/s之條件下的熔融剪切黏度為3,000～90,000Pa・s，在Tm+15℃之溫度、剪切應變速度100rad/s之條件下的熔融剪切黏度為80～1,000Pa・s。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:立體成形體</p>  
        <p type="p">10:構造部</p>  
        <p type="p">11:底面部</p>  
        <p type="p">11S:底面部之背面(下面)</p>  
        <p type="p">12:側面部</p>  
        <p type="p">12T:側面部之上端</p>  
        <p type="p">13:開口部</p>  
        <p type="p">14:內部空間部</p>  
        <p type="p">D:底面部之外徑</p>  
        <p type="p">H:構造部的最大高度</p>  
        <p type="p">IC:剖面圖示意線</p>  
        <p type="p">W:側面部的最大外徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1542" publication-number="202620982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>順序驅動的配接機構（ＳＡＭＭ）</chinese-title>  
        <english-title>SEQUENTIALLY ACTUATED MATING MECHANISM (SAMM)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260208B">H01R13/629</main-classification>  
        <further-classification edition="200601120260208B">H05K7/14</further-classification>  
        <further-classification edition="200601120260208B">H05K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＣＩ美國有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FCI USA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆哈　詹姆斯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUHA, JAMES J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴克曼斯　漢斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKERMANS, HANS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅希亞　薩巴　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEJIA-SABA, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">連接器組件，可以藉由配接或脫開序列來驅動多個連接器，其中連接器對於序列的第一部分同時移動，並且對於序列的第二部分以交錯方式移動。序列的第二部分可以包括用於連接器的最大配接力的間隔，使得用於每個連接器的最大配接力發生在不同的時間。因此，用於所有連接器的最大總配接力相對於連接器在整個序列中同時移動的組件有所減少。連接器組件可以包括連接器致動器部件和驅動機構。連接器致動器部件可以安裝在沿電子托盤的一側，該托盤插入機架，並且可以永久地或可分離地耦合到端部處的驅動機構，用於與側板中的連接器接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:有線背板系統</p>  
        <p type="p">102:線卡</p>  
        <p type="p">104:交換卡</p>  
        <p type="p">106:電纜線束</p>  
        <p type="p">111:背板</p>  
        <p type="p">112:前面</p>  
        <p type="p">113:背板盒</p>  
        <p type="p">114:後面</p>  
        <p type="p">116:纜線連接器</p>  
        <p type="p">132,134,:配接連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1543" publication-number="202620564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數值控制系統及數值控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G05B19/418</main-classification>  
        <further-classification edition="200601120260202B">G05B19/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今西一剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMANISHI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供不需要對機器人再度教示工件位置、能使運用效率提升之數值控制系統及數值控制裝置。數值控制系統，具備：數值控制裝置、及機器人控制裝置；上述數值控制裝置，具備：取得部，取得對工件進行測量後之測量結果；測量執行解析部，根據上述測量結果來算出上述工件之工件位置；以及第1資料傳送接收部，將上述工件位置傳送至上述機器人控制裝置；上述機器人控制裝置，具備：第2變數記憶部，儲存所接收之上述工件位置；工件位置解析部，解析上述工件位置；以及程式解析部，解析上述機器人控制程式；上述機器人控制裝置，當解析結果中上述機器人控制程式包含往上述工件位置之移動指令之情形時，使上述機器人的控制點往上述工件位置解析部所解析出的上述工件位置移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數值控制系統</p>  
        <p type="p">2:工作機械</p>  
        <p type="p">3:機器人</p>  
        <p type="p">4:數值控制裝置</p>  
        <p type="p">5:機器人控制裝置</p>  
        <p type="p">21:測量部</p>  
        <p type="p">40:記憶部</p>  
        <p type="p">41:程式輸入部</p>  
        <p type="p">42:輸入解析部</p>  
        <p type="p">43:補間控制部</p>  
        <p type="p">44:I/O控制部</p>  
        <p type="p">45:伺服控制部</p>  
        <p type="p">46:取得部</p>  
        <p type="p">47:測量執行解析部</p>  
        <p type="p">48:變數記憶部(第1變數記憶部)</p>  
        <p type="p">49:資料傳送接收部(第1資料傳送接收部)</p>  
        <p type="p">51:記憶部</p>  
        <p type="p">52:程式輸入部</p>  
        <p type="p">53:程式解析部</p>  
        <p type="p">54:軌跡控制部</p>  
        <p type="p">55:伺服控制部</p>  
        <p type="p">56:工件位置解析部</p>  
        <p type="p">57:變數記憶部(第2變數記憶部)</p>  
        <p type="p">58:資料傳送接收部(第2資料傳送接收部)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1544" publication-number="202621477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有側邊互連的高頻寬記憶體堆疊及具有該記憶體堆疊的三維積體電路結構</chinese-title>  
        <english-title>HIGH BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND 3D IC STRUCTURE WITH THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="200601120260223B">G11C11/40</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路結構包含：記憶體堆疊，其具有彼此水平分離的半導體晶片，其中每一半導體晶片具有頂面、底面、四個側壁及多個沿著側壁佈置的邊緣墊。所述積體電路結構進一步包含：記憶體控制器，其位於第一記憶體堆疊下方且電性連接到每一半導體晶片的邊緣墊、處理器電路，其位於記憶體控制器上方並與其電性連接，以及封裝基板，其位於記憶體控制器下方並與其電性連接。記憶體控制器的晶片面積大於記憶體堆疊的水平剖面面積與處理器電路的晶片面積的總和。封裝基板與記憶體控制器之間不存在中介層，且每一半導體晶片中不存在矽通孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC structure includes a memory stack including semiconductor dies horizontally separate with each other, wherein each semiconductor die has a top surface, a bottom surface, four sidewalls, and a plurality of edge pads arranged along a sidewall. The IC structure further includes a memory controller under the first memory stack and electrically connected to the edge pads of each semiconductor die, a processor circuit disposed over and electrically connected to the memory controller, and a packaging substrate under and electrically connected to the memory controller. A die area of the memory controller is larger than the sum of a horizontal cross-section area of the memory stack and a die area of the processor circuit. There is no interposer between the packaging substrate and the memory controller, and there is no TSV in each semiconductor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:3D IC結構</p>  
        <p type="p">61:記憶體控制器</p>  
        <p type="p">63:SOC晶片</p>  
        <p type="p">64:封裝基板</p>  
        <p type="p">65:散熱器</p>  
        <p type="p">601:邊緣墊/資料墊</p>  
        <p type="p">602:半導體晶片</p>  
        <p type="p">604:高導熱層</p>  
        <p type="p">606:頂部高導熱層/特徵</p>  
        <p type="p">610:NuHBM系統/NuHBM層疊/NuHBM堆疊/層疊</p>  
        <p type="p">611:TSV</p>  
        <p type="p">612:微凸塊/混合凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1545" publication-number="202621161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於交遞之時序提前獲取</chinese-title>  
        <english-title>TIMING ADVANCE ACQUISITION FOR HANDOVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W56/00</main-classification>  
        <further-classification edition="200901120260202B">H04W64/00</further-classification>  
        <further-classification edition="200901120260202B">H04W36/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡里米德科迪　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIMIDEHKORDI, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可歐波斯　迪歐米迪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHALOPOULOS, DIOMIDIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多斯提　恩德里特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOSTI, ENDRIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥雅爾　山傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅迪納　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDINA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之示例性實施例係針對用於交遞之時序提前(TA)獲取。一種方法包含：將針對與一交遞之一候選目標網路裝置相關聯的一網路資源之時序對準資訊的一請求發送至一核心網路之一位置服務裝置；自該位置服務裝置接收該時序對準資訊；以及基於該時序對準資訊而判定在該網路資源與另一網路資源之間的時序對準偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Example embodiments of the present disclosure are directed to timing advance (TA) acquisition for handover. A method comprises sending, to a location service device of a core network, a request for timing alignment information of a network resource associated with a candidate target network device of a handover; receiving, from the location service device, the timing alignment information; and determining, based on the timing alignment information, timing alignment offset between the network resource and another network resource.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1010,1020,1030:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1546" publication-number="202621162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於交遞之時序提前獲取</chinese-title>  
        <english-title>TIMING ADVANCE ACQUISITION FOR HANDOVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W56/00</main-classification>  
        <further-classification edition="200901120260202B">H04W64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡里米德科迪　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIMIDEHKORDI, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可歐波斯　迪歐米迪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHALOPOULOS, DIOMIDIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多斯提　恩德里特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOSTI, ENDRIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥雅爾　山傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅迪納　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDINA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之示例性實施例係針對用於交遞之時序提前(TA)獲取。一種方法包含：接收與一目標網路裝置相關聯的至少一個網路資源之時序對準資訊；基於該時序對準資訊，判定在該網路資源與另一網路資源之間的時序對準偏移；以及至少部分基於該時序對準偏移而進行針對該至少一個網路資源的時序提前估計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Example embodiments of the present disclosure are directed to timing advance (TA) acquisition for handover. A method comprises receiving timing alignment information of at least one network resource associated with a target network device; determining, based on the timing alignment information, timing alignment offset between the network resource and another network resource; and performing timing advance estimation for the at least one network resource at least partially based on the timing alignment offset.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1010,1015,1020:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1547" publication-number="202621163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於交遞之時序提前獲取</chinese-title>  
        <english-title>TIMING ADVANCE ACQUISITION FOR HANDOVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W56/00</main-classification>  
        <further-classification edition="200901120260202B">H04W64/00</further-classification>  
        <further-classification edition="200901120260202B">H04W36/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡里米德科迪　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIMIDEHKORDI, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可歐波斯　迪歐米迪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHALOPOULOS, DIOMIDIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多斯提　恩德里特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOSTI, ENDRIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥雅爾　山傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅迪納　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDINA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之示例性實施例係針對用於交遞之時序提前(TA)獲取。一種方法包含：自一來源網路裝置接收與一交遞之一候選目標網路裝置相關聯的一網路資源之時序對準資訊；基於該時序對準資訊，判定在該網路資源與另一網路資源之間的時序對準偏移；以及至少部分基於該時序對準偏移而進行針對該網路資源的時序提前估計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Example embodiments of the present disclosure are directed to timing advance (TA) acquisition for handover. A method comprises receiving, from a source network device, timing alignment information of a network resource associated with a candidate target network device of a handover; determining, based on the timing alignment information, timing alignment offset between the network resource and another network resource; and performing timing advance estimation for the network resource at least partially based on the timing alignment offset.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1010,1015,1020:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1548" publication-number="202621178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具PRACH適應之條件式交遞</chinese-title>  
        <english-title>CONDITIONAL HANDOVER WITH PRACH ADAPTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260209B">H04W74/08</main-classification>  
        <further-classification edition="200901120260209B">H04W36/00</further-classification>  
        <further-classification edition="202301120260209B">H04W72/20</further-classification>  
        <further-classification edition="200901120260209B">H04W52/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉斯　阿勒姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHLASS, AHLEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩伊德哈桑　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAYED HASSAN, MOHAMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯斯凱拉　賈古　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSKELA, JARKKO TUOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供用於(例如，啟用/促進/實現)具PRACH適應(或換言之，額外PRACH資源)之條件式交遞的措施。舉例而言，此等措施可包含一使用者裝備自該使用者裝備之一伺服胞元的一基地台接收用於該使用者裝備之一條件式交遞的一條件式交遞組配，其中該條件式交遞組配指示該條件式交遞之一候選目標胞元；以及自該使用者裝備之該伺服胞元的該基地台接收關於在該候選目標胞元處組配之一或多個額外實體隨機存取通道PRACH資源之啟動的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided measures for (e.g. enabling/facilitating/realizing) conditional handover with PRACH adaptation (or, stated differently, additional PRACH resources). Such measures may, for example, comprise that a user equipment receives, from a base station of a serving cell of the user equipment, a conditional handover configuration for a conditional handover of the user equipment, wherein the conditional handover configuration indicates a candidate target cell of the conditional handover, and receives, from the base station of the serving cell of the user equipment, information about activation of one or more additional physical random access channel, PRACH, resources configured at the candidate target cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1549" publication-number="202620756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器裝置、系統、系統之動作方法、及終端裝置之程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260211B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120260211B">G06Q30/02</further-classification>  
        <further-classification edition="202301120260211B">G06Q10/087</further-classification>  
        <further-classification edition="202401120260211B">G06Q10/08</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification>  
        <further-classification edition="201401120260211B">A63F13/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商高絲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>築山文彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKIYAMA, FUMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係讓使用者於虛擬空間中之興趣亦能持續於現實空間。 &lt;br/&gt;本發明之伺服器裝置，係具有：通訊部，係進行通訊；及控制部，係將用以顯示表示使用者之虛擬化身試戴裝飾品之虛擬空間之資訊，傳送至前述使用者所使用之終端裝置，且當從前述終端裝置接收用以購買第一裝飾品之資訊時，將用以製造及配送前述第一裝飾品之資訊，各自傳送至前述第一裝飾品之製造及配送業者之資訊處理裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:伺服器裝置</p>  
        <p type="p">101:通訊部</p>  
        <p type="p">102:記憶部</p>  
        <p type="p">103:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1550" publication-number="202621144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波束管理的方法、資料收集者以及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>METHOD FOR BEAM MANAGEMENT, DATA COLLECTOR AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W24/10</main-classification>  
        <further-classification edition="202201120260202B">H04L41/16</further-classification>  
        <further-classification edition="200601120260202B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　元勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUAN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿瓦丁　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWADIN, MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩波　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABER, HAMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許允亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, YOUN HYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">波束管理的方法可包括由資料收集者向資料提供者發送第一能力報告，由資料收集者從資料提供者接收基於第一能力報告準備的定義第一配置的資料，第一配置包括與至少一個關聯識別符相關聯的第一資源集和第二資源集，由資料收集者從資料提供者收集與第一配置相關聯的測量，由資料收集者向資料提供者發送第二能力報告，由資料收集者從接收基於第二能力報告準備的定義第二配置的資料，由資料收集者利用基於與第一配置相關聯的測量訓練的模型，基於第二配置產生測量報告，以及由資料收集者發送測量報告到資料提供者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for beam management may include sending, by a data collector to a data provider, a first capability report, receiving, from the data provider by the data collector, data defining a first configuration prepared based on the first capability report, the first configuration including a first set of resources and a second set of resources associated with at least one associated identifier, collecting, from the data provider by the data collector, measurements associated with the first configuration, sending, by the data collector to the data provider, a second capability report, receiving, from by the data collector, data defining a second configuration prepared based on the second capability report, generating, by the data collector, a measurement report based on the second configuration utilizing a model trained based on the measurements associated with the first configuration, and sending, by the data collector to the data provider, the measurement report.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">805、810、815、820、825、830、835:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1551" publication-number="202619671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>STATION FOR ROBOT CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">A47L11/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛鎭赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JINHYOUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG-GEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金美素</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MISOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種配置以清洗清掃機器人的拖布的清掃機器人工作站。根據本發明的一個態樣，清掃機器人工作站包括：殼體；座部件，其中容納清掃機器人，該座部件包含清潔板；及拖布清洗部件，配置以清洗清掃機器人的拖布。拖布清洗部件包含：原水供應管，供應通過該原水供應管的原水；第一分支閥，安裝在原水供應管中並配置以將供應的原水分支為二個方向；第一導管，連接至第一分支閥且沿一個方向流動的原水穿過該第一導管；水處理過濾器，安裝在第一導管中並配置以從原水過濾致硬物質以將原水轉化為軟水；第二導管，連接至第一導管且軟水穿過該第二導管；加熱器，安裝在第二導管中並配置以加熱軟水以將軟水轉化為熱水或蒸汽；加熱清洗管線，已穿過加熱器的熱水或蒸汽通過其供應至清潔板；及原水清洗管線，連接至第一分支閥並配置以將沿另一方向上流動的原水供應至清潔板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A station for a robot cleaner configured to wash a mop of the robot cleaner is provided. According to one aspect of the present disclosure, a station for a robot cleaner includes a housing, a seating part in which the robot cleaner is accommodated, the seating part including a cleaning plate, and a mop washing part configured to wash the mop of the robot cleaner. The mop washing part includes a raw water supply pipe through which raw water is supplied, a first branch valve installed in the raw water supply pipe and configured to branch the supplied raw water in two directions, a first conduit connected to the first branch valve and through which raw water flowing in one direction passes, a water treatment filter installed in the first conduit and configured to filter hardness-causing substances from the raw water to convert the raw water into soft water, a second conduit connected to the first conduit through which the soft water passes, a heater installed in the second conduit and configured to heat the soft water to convert the soft water into hot water or steam, a heated washing line through which the hot water or steam that has passed through the heater is supplied to the cleaning plate, and a raw water washing line connected to the first branch valve and configured to supply raw water flowing in the other direction to the cleaning plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:清潔板</p>  
        <p type="p">230:水箱</p>  
        <p type="p">1610:原水供應管</p>  
        <p type="p">1621:第一分支閥</p>  
        <p type="p">1622:第二分支閥</p>  
        <p type="p">1631:第一導管</p>  
        <p type="p">1632:第二導管</p>  
        <p type="p">1640:水處理過濾器</p>  
        <p type="p">1650:加熱器</p>  
        <p type="p">1661:加熱清洗管線、熱水清洗管線</p>  
        <p type="p">1662:加熱清洗管線、蒸汽清洗管線</p>  
        <p type="p">1671:原水清洗管線</p>  
        <p type="p">1680:機器人供應管線</p>  
        <p type="p">1692:流量控制閥</p>  
        <p type="p">1693:流量感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1552" publication-number="202621147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由使用者設備執行的方法、使用者設備及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>METHOD PERFORMED BY USER EQUIPMENT, USER EQUIPMENT AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W36/00</main-classification>  
        <further-classification edition="200901120260202B">H04W36/30</further-classification>  
        <further-classification edition="202201120260202B">H04L41/16</further-classification>  
        <further-classification edition="200901120260202B">H04W24/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈利利　奧蘭　阿巴斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHALILI OLAM, ABBAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種由無線通訊系統中的使用者設備（UE）執行的方法。方法包括獲得與服務細胞和一個或多個候選細胞相關聯的量測；基於量測產生輸入資料；使用預測時間提前量（T）將人工智慧或機器學習（artificial intelligence or machine learning，AI/ML）模型應用到輸入資料，以確定是否發射量測報告或啟動從服務細胞到目標細胞的交遞；以及依據確定，執行發射量測報告或啟動交遞中的至少一個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method performed by a user equipment (UE) in a wireless communication system is provided. The method includes obtaining a measurement associated with a serving cell and one or more candidate cells; generating input data based on the measurement; applying an artificial intelligence or machine learning (AI/ML) model to the input data using a prediction time advance (T) to determine whether to transmit a measurement report or initiate a handover from the serving cell to a target cell; and in accordance with the determination, performing at least one of transmitting the measurement report or initiating the handover.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1001、1002、1003、1004:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1553" publication-number="202621362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於經由晶體生長及無機光吸收劑釋放之整合方法</chinese-title>  
        <english-title>METHOD FOR INTEGRATION THROUGH CRYSTALLOGRAPHIC GROWTH AND RELEASE FROM INORGANIC LIGHT ABSORBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P34/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/10</further-classification>  
        <further-classification edition="201901120260223B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商脈衝鍛造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PULSEFORGE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿塔爾　瓦希德　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATTAR, VAHID AKHAVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾卡尼　維克拉姆　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TURKANI, VIKRAM S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於製造一整合式電子結構之方法及對應結構。提供一臨時堆疊，該臨時堆疊包括一載體本體、一接合層，以及晶體生長於該接合層上之一電子結構基底。在該電子結構基底上建構一電子結構，從而界定包括該電子結構基底及該電子結構之一整合式電子結構。使用一光脈衝來削弱該接合層，且將該整合式電子結構與該載體本體分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and corresponding structures for fabricating an integrated electronics structure are provided. A temporary stack is provided that includes a carrier body, a bonding layer, and an electronics structure base that is crystallographically grown on the bonding layer. An electronics structure is built on the electronics structure base, defining an integrated electronics structure that includes the electronics structure base and the electronics structure. A pulse of light is used to weaken the bonding layer, and the integrated electronics structure is separated from the carrier body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊，臨時堆疊</p>  
        <p type="p">102:載體本體</p>  
        <p type="p">104:接合層</p>  
        <p type="p">106:第一電子結構基底</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1554" publication-number="202621167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138437</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於探測參考信號載波切換及上行鏈路傳輸切換的技術</chinese-title>  
        <english-title>TECHNIQUES FOR SOUNDING REFERENCE SIGNAL CARRIER SWITCHING AND UPLINK TRANSMISSION SWITCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/04</main-classification>  
        <further-classification edition="202301120260202B">H04W72/0453</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里可　艾爾法里諾　艾爾伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICO ALVARINO, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　以諾　曉光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, ENOCH SHIAO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倫塔　普拉奈　蘇迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUNGTA, PRANAY SUDEEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種使用者設備(UE)可傳輸能力資訊，該能力資訊指示與將第一數目個傳輸鏈自第一上行鏈路傳輸分量載波切換至探測參考信號(sounding reference signal, SRS)分量載波相關聯之第一能力切換時間及與將一傳輸鏈自第二上行鏈路傳輸分量載波切換至第一上行鏈路傳輸分量載波相關聯之第二能力切換時間。該UE可基於與SRS傳輸相關聯之SRS切換時間之判定而執行傳輸。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit capability information indicating a first capability switching time associated with switching a first number of transmit chains from a first uplink transmission component carrier to a sounding reference signal (SRS) component carrier and a second capability switching time associated with switching a transmit chain from a second uplink transmission component carrier to the first uplink transmission component carrier. The UE may perform a transmission based on a determination of an SRS switching time associated with an SRS transmission. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:實例</p>  
        <p type="p">325:實例</p>  
        <p type="p">350:實例</p>  
        <p type="p">375:實例</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1555" publication-number="202621119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於視訊寫碼的重疊區塊運動補償</chinese-title>  
        <english-title>OVERLAPPED BLOCK MOTION COMPENSATION FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260202B">H04N19/57</main-classification>  
        <further-classification edition="201401120260202B">H04N19/119</further-classification>  
        <further-classification edition="201401120260202B">H04N19/176</further-classification>  
        <further-classification edition="201401120260202B">H04N19/513</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞若陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, RUOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鈞棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞瑞金　法迪姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEREGIN, VADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡茲維克茲　馬塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARCZEWICZ, MARTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種解碼視訊資料之方法包括：判定視訊資料的目前區塊的第一分區及第二分區；針對第一分區及第二分區執行重疊區塊運動補償(OBMC)程序以產生經OBMC調整樣本；及對經OBMC調整樣本執行混合以針對目前區塊產生最終預測樣本。第一分區及第二分區可使用幾何預測模式(GPM)來判定，且混合可係GPM混合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of decoding video data includes determining a first partition and a second partition for a current block of video data, performing an overlapped block motion compensation (OBMC) process for the first partition and for the second partition to generate OBMC adjusted samples, and performing blending on the OBMC adjusted samples to generate final prediction samples for the current block. The first partition and the second partition may be determined using a geometrical prediction mode (GPM), and the blending may be GPM blending.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500,502,504,506,508,510:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1556" publication-number="202620221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用烷基鋁脒基化物前驅物進行鋁基薄膜之區域選擇性沉積</chinese-title>  
        <english-title>AREA SELECTIVE DEPOSITION OF ALUMINUM BASED FILMS USING ALKYL ALUMINUM AMIDINATE PRECURSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C23C16/20</main-classification>  
        <further-classification edition="200601120260203B">C23C16/448</further-classification>  
        <further-classification edition="200601120260203B">C23C16/04</further-classification>  
        <further-classification edition="200601120260203B">C07B49/00</further-classification>  
        <further-classification edition="200601120260203B">C07F5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡德　德魯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOOD, DREW MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供使用烷基鋁脒基化物前驅物進行鋁基薄膜之區域選擇性沉積及其方法。區域選擇性沉積包括在具有包含金屬之第一表面部分及包含非金屬之第二表面部分之基板上沉積烷基鋁脒基化物前驅物以在該基板上形成鋁基薄膜。該鋁基薄膜將位於該基板之該第二表面部分上及當該鋁基薄膜位於該第一表面部分上時，該第一表面部分上之薄膜之平均厚度與該第二表面部分上之薄膜之平均厚度之比率小於1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Area selective deposition of aluminum-based films using alkyl aluminum amidinate precursors and methods thereof are provided. Area selective deposition comprises depositing an alkyl aluminum amidinate precursor on a substrate with a first surface portion comprising a metal and a second surface portion comprising a non-metal to form an aluminum-based film on the substrate. The aluminum-based film will be located on the second surface portion of the substrate and when the aluminum-based film is located on the first surface portion, a ratio of an average thickness of the film on the first surface portion to an average thickness of the film on the second surface portion is less than 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1557" publication-number="202620181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空致動器用潤滑脂</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C10M107/38</main-classification>  
        <further-classification edition="200601120260203B">C10M131/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＯＫ克魯勃股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOK KLUEBER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納博特斯克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABTESCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂井歩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, AYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田孝治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種真空致動器用潤滑脂，其包含下述成分(a)及(b)： &lt;br/&gt;　　(a)作為基油之全氟聚醚，其於40℃下的動黏度為100mm&lt;sup&gt;2&lt;/sup&gt;/s以上且未達200mm&lt;sup&gt;2&lt;/sup&gt;/s，於20℃下的蒸氣壓為1.0×10&lt;sup&gt;-7&lt;/sup&gt;Pa以下； &lt;br/&gt;　　(b)作為增稠劑之聚四氟乙烯， &lt;br/&gt;　　該潤滑脂於25℃下的剪切黏度為4500mPa･s以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1558" publication-number="202621170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頻寬部分切換後的子頻帶全雙工時槽</chinese-title>  
        <english-title>SUBBAND FULL-DUPLEX SLOT AFTER BANDWIDTH PART SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04W72/0453</main-classification>  
        <further-classification edition="202301120260202B">H04W72/51</further-classification>  
        <further-classification edition="200601120260202B">H04L5/14</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏瑪　普拉桑特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, PRASHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳　在　浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JAE HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德　賽義德　凱利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一使用者設備(UE)可接收針對一頻寬部分(BWP)切換的一指示。該UE可至少部分地基於經組態用於一子頻帶全雙工(SBFD)時槽的一排程或一鏈路方向，而在與該指示相關聯的一BWP切換延遲結束之後在該SBFD時槽中傳達一訊息。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive an indication for a bandwidth part (BWP) switch. The UE may communicate a message in a subband full duplex (SBFD) slot after an end of a BWP switch delay associated with the indication, based at least in part on a schedule or a link direction configured for the SBFD slot. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:實例</p>  
        <p type="p">602:下行鏈路時槽；時槽</p>  
        <p type="p">604:BWP切換延遲</p>  
        <p type="p">606:SBFD時槽</p>  
        <p type="p">608:第一個下行鏈路時槽</p>  
        <p type="p">610:網路實體</p>  
        <p type="p">612:下行鏈路符號</p>  
        <p type="p">614:休眠BWP切換延遲</p>  
        <p type="p">620:UE</p>  
        <p type="p">625:步驟</p>  
        <p type="p">630:步驟</p>  
        <p type="p">635:步驟</p>  
        <p type="p">640:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1559" publication-number="202620152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感壓接著劑組成物、感壓接著劑層及接著片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260211B">C09J7/38</main-classification>  
        <further-classification edition="200601120260211B">C09J109/02</further-classification>  
        <further-classification edition="200601120260211B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寺岡製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAOKA SEISAKUSHO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋靖史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坪內一誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBOUCHI, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細野駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSONO, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明期待的感壓接著劑，係不致降低接著劑層的接著力、可對接著對象進行暫時固定。該課題可藉由含有：丙烯腈丁二烯橡膠(A)、及芳香族系樹脂(C)(但，酚樹脂(B)除外)的感壓接著劑組成物解決。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第1接著劑層</p>  
        <p type="p">2:感壓接著劑層</p>  
        <p type="p">3:第2接著劑層</p>  
        <p type="p">10:接著片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1560" publication-number="202619989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃板的製造方法及製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C03B35/00</main-classification>  
        <further-classification edition="200601120260204B">G01N29/04</further-classification>  
        <further-classification edition="200601120260204B">B65G49/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星野愛信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINO, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永大生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, HIROO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡康介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">玻璃板的製造方法包括檢測步驟S5，所述檢測步驟S5使用感測器組13來檢測沿搬送方向X搬送的玻璃板G的破損，所述感測器組13包含能夠檢測玻璃板G的有無的多個感測器12。感測器組13包括沿著與搬送方向X正交的方向配置的感測器列15。在檢測步驟S5中，在沿搬送方向X搬送的玻璃板G的通過範圍P內所存在的感測器列15中所含的感測器12的一部分無法檢測到玻璃板G的情況下，判定為玻璃板G破損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:第二搬送裝置(搬送裝置)</p>  
        <p type="p">6:搬送帶</p>  
        <p type="p">11:檢測裝置</p>  
        <p type="p">12:感測器</p>  
        <p type="p">12x:第一角部感測器(角部感測器)</p>  
        <p type="p">12y:第二角部感測器(角部感測器)</p>  
        <p type="p">13:感測器組</p>  
        <p type="p">15:感測器列</p>  
        <p type="p">19:氣體噴嘴</p>  
        <p type="p">C:間隙</p>  
        <p type="p">G:玻璃板</p>  
        <p type="p">Ga:前方邊部</p>  
        <p type="p">Gb:後方邊部</p>  
        <p type="p">Gc:側邊部</p>  
        <p type="p">Gd:中央平面部</p>  
        <p type="p">Gx:角部</p>  
        <p type="p">F:氣體</p>  
        <p type="p">P:通過範圍</p>  
        <p type="p">S2:姿勢變更步驟(步驟)</p>  
        <p type="p">S5:檢測步驟</p>  
        <p type="p">X:搬送方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1561" publication-number="202621186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳奈米管加熱器</chinese-title>  
        <english-title>CARBON NANOTUBE HEATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251110B">H05B3/03</main-classification>  
        <further-classification edition="200601120251110B">H05B3/34</further-classification>  
        <further-classification edition="201701120251110B">C01B32/158</further-classification>  
        <further-classification edition="201101120251110B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田健司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大工博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKU, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提高貫通孔周圍的溫度的均一性。CNT加熱器1的一對電極22在X方向上並列配置。連接片部21包括片狀的CNT成形體。連接片部21在X方向及與X方向垂直的Y方向上擴展，且將一對電極22間連接。連接片部21藉由被供給電力而發熱。附加導電部23在包含連接片部21上設置的第一貫通孔211的周緣部中的、與穿過第一貫通孔211的中心且沿X方向延伸的第一假想直線相交的區域的配置區域中，積層於連接片部21。附加導電部23的Y方向上的導電率較連接片部21的Y方向上的導電率高。藉此，可提高第一貫通孔211周圍的CNT加熱器1的溫度的均一性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pair of electrodes (22) of a CNT heater (1) is arranged in parallel in the X direction. A connection sheet part (21) is composed of a sheet-shaped CNT formed body. The connection sheet part (21) extends in the X direction and in the Y direction perpendicular to the X direction, to connect the pair of electrodes (22). The connection sheet part (21) generates heat when supplied with power. An additional conductive part (23) is laminated on the connection sheet part (21) in a disposed area that includes an area where a peripheral part of a first through hole (211) provided in the connection sheet part (21) intersects with a first virtual straight line extending in the X direction through a center of the first through hole (211). The conductivity of the additional conductive part (23) in the Y direction is higher than that of the connection sheet part (21) in the Y direction. This improves the temperature uniformity of the CNT heater (1) around the first through hole (211).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:CNT加熱器(碳奈米管加熱器)</p>  
        <p type="p">2:碳奈米管器件(CNT器件)</p>  
        <p type="p">3:被覆部</p>  
        <p type="p">21:連接片部</p>  
        <p type="p">22:電極</p>  
        <p type="p">23:附加導電部</p>  
        <p type="p">31:第一被覆部</p>  
        <p type="p">33:第二貫通孔(貫通孔)</p>  
        <p type="p">211:第一貫通孔(貫通孔)</p>  
        <p type="p">II-II:剖面線</p>  
        <p type="p">X:方向(第一方向)</p>  
        <p type="p">Y:方向(第二方向)</p>  
        <p type="p">Z:方向(第三方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1562" publication-number="202621065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在多輸入多輸出通訊系統中檢測訊號的方法</chinese-title>  
        <english-title>METHOD OF DETECTING SIGNALS IN A MULTIPLEINPUT MULTIPLE-OUTPUT COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260202B">H04B7/0413</main-classification>  
        <further-classification edition="200601120260202B">H04L25/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博蘭　賈比爾　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORRAN, JABER MOHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種在多輸入多輸出（multiple-input multiple-output，MIMO）通訊系統中檢測訊號的方法。方法包括：接收訊號向量和通道矩陣；基於訊號向量和通道矩陣計算檢測層的濾波器輸出；選擇複數個星座點作為檢測層的初始候選集合；使用初始候選集合識別一個或多個位元；計算一個或多個位元的對數似然比（log-likelihood ratio，LLR）；對LLR應用邊界操作以產生有界的LLR；以及輸出有界的LLR用於解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of detecting signals in a multiple-input multiple-output (MIMO) communication system is provided. The method includes: receiving a signal vector and a channel matrix; computing, for a detection layer, a filter output based on the signal vector and the channel matrix; selecting, as an initial candidate set for the detection layer, a plurality of constellation points; identifying one or more bits using the initial candidate set; computing log-likelihood ratios (LLRs) for the one or more bits; applying a bounding operation to the LLRs to produce bounded LLRs; and outputting the bounded LLRs for decoding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200、210、220、230、240、250、260:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1563" publication-number="202620012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具備氟氧伸烷基作為重複單元的化合物的分解方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C07C43/12</main-classification>  
        <further-classification edition="200601120260209B">C08G65/323</further-classification>  
        <further-classification edition="200601120260209B">C07C7/08</further-classification>  
        <further-classification edition="202301120260209B">C02F1/26</further-classification>  
        <further-classification edition="200601120260209B">B01D3/40</further-classification>  
        <further-classification edition="200601320260209B">C02F101/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人神奈川大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAGAWA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂野安則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKANO, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀久男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, HISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種氟聚醚化合物的新的分解處理方法。&lt;br/&gt; 本發明人於選自由鹼金屬氫氧化物及鹼土金屬氫氧化物所構成的群中的至少一種鹼性化合物的存在下，使作為分解對象的具備氟氧伸烷基作為重複單元的化合物（即氟聚醚化合物）接觸於300℃以上的亞臨界水，藉此可將其分解。分解後，因氟聚醚化合物中所含的氟原子會以氟化物離子形式殘留於反應溶液中，故亦可藉由添加鈣離子而將其以氟化鈣固體形式回收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1564" publication-number="202620101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於矽酮的樹脂組合物及其製備方法</chinese-title>  
        <english-title>SILICONE-BASED RESIN COMPOSITION AND METHOD OF PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251016B">C08G77/06</main-classification>  
        <further-classification edition="200601120251016B">C08G77/38</further-classification>  
        <further-classification edition="200601120251016B">C08G77/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商瓦克化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WACKER CHEMIE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋善植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, SUN SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋明錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, MYUNG SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種製備基於矽酮的樹脂組合物（a silicone-based resin composition）的方法，該方法包括：通過使第一烷氧基矽烷與第二烷氧基矽烷反應來製備第一聚有機矽氧烷；通過將該第一聚有機矽氧烷所包含的烷氧基改性為羥基來製備第二聚有機矽氧烷；以及通過將該第二聚有機矽氧烷中的該羥基改性成矽氧烷基團來製備第三聚有機矽氧烷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method of preparing a silicone-based resin composition, the method including: preparing a first polyorganosiloxane by reacting a first alkoxy silane with a second alkoxy silane; preparing a second polyorganosiloxane by modifying an alkoxy group included in the first polyorganosiloxane into a hydroxy group; and preparing a third polyorganosiloxane by modifying the hydroxy group included in the second polyorganosiloxane into a siloxane group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:縮合反應步驟</p>  
        <p type="p">S20:第一改性反應步驟</p>  
        <p type="p">S30:第二改性反應步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1565" publication-number="202620294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>泵系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">F04D13/12</main-classification>  
        <further-classification edition="200601120260213B">F04D15/00</further-classification>  
        <further-classification edition="200601120260213B">F04D29/60</further-classification>  
        <further-classification edition="200601120260213B">F04B23/04</further-classification>  
        <further-classification edition="200601120260213B">F04B43/08</further-classification>  
        <further-classification edition="200601120260213B">F17C9/00</further-classification>  
        <further-classification edition="200601120260213B">F17D1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山根裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田真生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之泵系統，其具備串聯地連接之複數個泵模組，複數個泵模組之各者包含：泵、連接於泵之吸入口之吸入管、連接於泵之噴出口之噴出管、以及避開泵而連通吸入管與噴出管之旁通管。複數個泵模組中配置於最下游之泵模組進一步包含最小流量管，其與噴出管之與上述旁通管連接的連接部之更下游部分連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:泵系統</p>  
        <p type="p">2、2A、2B、2C:泵模組</p>  
        <p type="p">3:吸入管</p>  
        <p type="p">4:噴出管</p>  
        <p type="p">5:旁通管</p>  
        <p type="p">6:排氣管</p>  
        <p type="p">7:控制裝置</p>  
        <p type="p">11:液化氣體源</p>  
        <p type="p">12:高壓氣體需求機器</p>  
        <p type="p">15:最小流量管</p>  
        <p type="p">16:最小流量閥</p>  
        <p type="p">17:流量感測器</p>  
        <p type="p">18:釋壓管</p>  
        <p type="p">19:限流孔</p>  
        <p type="p">21:泵</p>  
        <p type="p">22:吸入口</p>  
        <p type="p">23:噴出口</p>  
        <p type="p">24:排氣口</p>  
        <p type="p">25:液位感測器</p>  
        <p type="p">26:容器</p>  
        <p type="p">27:泵本體</p>  
        <p type="p">31:吸入閥</p>  
        <p type="p">41:止回閥</p>  
        <p type="p">51:旁通閥</p>  
        <p type="p">61:排氣閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1566" publication-number="202619788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合膜及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">B01D63/02</main-classification>  
        <further-classification edition="200601120260205B">B01D69/12</further-classification>  
        <further-classification edition="200601120260205B">B01D69/08</further-classification>  
        <further-classification edition="200601120260205B">B01D69/02</further-classification>  
        <further-classification edition="200601120260205B">B01D71/70</further-classification>  
        <further-classification edition="200601120260205B">B01D71/56</further-classification>  
        <further-classification edition="200601120260205B">B01D71/42</further-classification>  
        <further-classification edition="200601120260205B">B01D67/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尤尼吉可股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITIKA LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上邦子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, KUNIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正木辰典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASAKI, TATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬越恭平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMAKOSHI, KYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井美穗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, MIHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種複合膜及其製造方法，該複合膜用於將含有有機溶劑、以及氟化合物之有機溶液中之前述氟化合物分離，且以高水準兼具前述有機溶劑之透液性能與前述氟化合物之阻擋性能；前述有機溶劑係選自於由伸丙基二醇單甲醚乙酸酯及伸丙基二醇單甲醚所構成群組中之至少一種，前述氟化合物係分子內具有合計1～6個選自於由碳數1～6之全氟烷基及碳數1～6之全氟伸烷基所構成群組中之至少一種含氟基的氟化合物。本發明之複合膜包含聚矽氧層及高分子膜，前述高分子膜具有緻密層與支撐層且由聚矽氧以外之高分子所形成，前述聚矽氧層設置於前述緻密層之表面，前述複合膜用於將有機溶液中存在之氟化合物分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1567" publication-number="202620554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於從含金屬抗蝕劑移除邊緣珠粒的組合物、含金屬抗蝕劑的顯影劑組合物、以及使用所述組合物形成圖案的方法</chinese-title>  
        <english-title>COMPOSITION FOR REMOVING EDGE BEADS FROM METAL-CONTAINING RESISTS, DEVELOPER COMPOSITION OF METAL-CONTAINING RESISTS, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G03F7/42</main-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭澤秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, TAEKSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炯朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYUNGRANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扈鍾必</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JONGPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴時均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SI-KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴慶熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GYEONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛羅莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, ROSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種用以從含金屬抗蝕劑移除邊緣珠粒的組合物或一種含金屬抗蝕劑的顯影劑組合物、以及一種利用所述組合物和/或所述顯影劑組合物來形成或提供圖案的方法。用以從含金屬抗蝕劑移除邊緣珠粒的所述組合物或含金屬抗蝕劑的所述顯影劑組合物可包含：多酚系化合物；以及有機溶劑，其中以100重量%的所述組合物或所述顯影劑組合物計，多酚系化合物的量為約10重量%到約50重量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition to remove edge beads from a metal-containing resist or a developer composition of a metal-containing resist and a method of forming or providing patterns utilizing the composition and/or the developer composition are disclosed. The composition to remove edge beads from the metal-containing resist or the developer composition of the metal-containing resist may include a polyphenol-based compound; and an organic solvent, wherein the polyphenol-based compound is in an amount of about 10 wt% to about 50 wt% based on 100 wt% of the composition or the developer composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:襯底</p>  
        <p type="p">110P:特徵圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1568" publication-number="202621060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定義預編碼極化碼的速率設定檔以及用於設計預編碼極化碼的資訊索引集的電腦實施方法，以及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>COMPUTERIMPLEMENTED METHOD OF DEFINING RATE PROFILE OF PRECODED POLAR CODE AND FOR DESIGNING INFORMATION INDEX SET OF PRECODED POLAR CODE, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H03M13/13</main-classification>  
        <further-classification edition="200601120260202B">H03M13/09</further-classification>  
        <further-classification edition="200601120260202B">H03M13/29</further-classification>  
        <further-classification edition="200601120260202B">H03M13/37</further-classification>  
        <further-classification edition="201901120260202B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈塔米　霍馬云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAMI, HOMAYOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩波　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABER, HAMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種定義預編碼極化碼的速率設定檔的系統及方法。所述方法包括：獲得分配元組，所述分配元組為多個分量中所包括的至少一個分量規定與訊息長度相等的資訊位元位置計數；針對所述至少一個分量而自目錄選擇分量碼的與資訊位元位置計數對應的資訊集；藉由將分量碼的資訊集與偏移量序連而產生全域資訊索引集；以及經由編碼器而傳送使用基於全域資訊索引集配置的速率設定模組產生的碼字。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method of defining a rate profile of a pre-coded polar code are disclosed. The method includes obtaining an allocation tuple that specifies, for at least one component included in a plurality of components, a count of information-bit positions equal to a message length; for the at least one component, selecting, from a catalog, an information set of a component code corresponding to the count of information-bit positions; generating a global information index set by concatenating the information set of the component code with an offset; and transmitting, via an encoder, a codeword generated using a rate-profiling module configured based on the global information index set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">501、502、503、504:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1569" publication-number="202620008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C25/18</main-classification>  
        <further-classification edition="200601120260223B">C07C43/225</further-classification>  
        <further-classification edition="200601120260223B">C07C69/63</further-classification>  
        <further-classification edition="200601120260223B">C07C69/76</further-classification>  
        <further-classification edition="200601120260223B">C07C309/39</further-classification>  
        <further-classification edition="200601120260223B">C07C309/42</further-classification>  
        <further-classification edition="200601120260223B">C07C309/46</further-classification>  
        <further-classification edition="200601120260223B">C07C309/58</further-classification>  
        <further-classification edition="200601120260223B">C07C317/14</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部祐大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中義一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種於抗蝕劑圖案形成時可以充分的水準發揮感度或曝光寬容度、焦點深度、圖案矩形性、保存穩定性、顯影缺陷性能、CDU及圖案圓形性的感放射線性組成物、圖案形成方法及化合物。一種感放射線性組成物，含有：聚合物（A）、下述式（1）所表示的第一感放射線性酸產生劑（B）、產生磺酸的第二感放射線性酸產生劑（C）（其中，相當於所述第一感放射線性酸產生劑（B）者除外）及溶劑（E）。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="364px" width="360px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="186px" width="283px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1570" publication-number="202620235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批次式基板處理設備</chinese-title>  
        <english-title>BATCH TYPE SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/455</main-classification>  
        <further-classification edition="200601120260223B">F27D7/06</further-classification>  
        <further-classification edition="200601120260223B">C23C16/458</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商尤金科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晋光泫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, KWANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南成珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, SUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許凍彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, DONG BEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭春植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, CHOON SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露是有關於一種能夠改善基板處理製程的均勻性的批次式基板處理設備。根據本揭露的批次式基板處理設備可包括：外管，在垂直方向上延伸；內管，設置於外管內且在垂直方向上延伸以提供基板處理空間；噴嘴部件，被配置成將基板處理氣體供應至基板處理空間；排氣埠，被配置成對外管與內管之間的間隔空間進行排氣；基板舟，被配置成以多級方式垂直地堆疊多個基板；中空凸緣，被配置成對外管及內管進行支撐；以及密封頂蓋部件，被配置成支撐基板舟且使凸緣的敞開的下端部敞開及閉合，其中內管可包括在與垂直方向相交的方向上延伸的矩形排氣孔洞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a batch type substrate processing apparatus, which is capable of improving uniformity of a substrate processing process. The batch type substrate processing apparatus according to the present disclosure may include: an outer tube extending in a vertical direction; an inner tube disposed within the outer tube and extending in the vertical direction to provide a substrate processing space; a nozzle part configured to supply a substrate processing gas to the substrate processing space; an exhaust port configured to exhaust a spaced space between the outer tube and the inner tube; a substrate boat configured to vertically stack a plurality of substrate in multiple stages; a hollow flange configured to support the outer tube and the inner tube; and a seal cap part configured to support the substrate boat and open and close an opened lower end of the flange, wherein the inner tube may include a rectangular exhaust hole extending in a direction intersecting the vertical direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:外壁</p>  
        <p type="p">110:圓柱形外壁</p>  
        <p type="p">120:支撐本體</p>  
        <p type="p">121:階梯狀部件</p>  
        <p type="p">200:內管</p>  
        <p type="p">300:噴嘴部件</p>  
        <p type="p">310:注入孔洞</p>  
        <p type="p">350:外部處理氣體供應源</p>  
        <p type="p">500:基板舟</p>  
        <p type="p">550:基座</p>  
        <p type="p">600:凸緣/中空凸緣</p>  
        <p type="p">700:密封頂蓋部件</p>  
        <p type="p">710:密封頂蓋凸緣</p>  
        <p type="p">720:密封頂蓋板</p>  
        <p type="p">730:密封構件</p>  
        <p type="p">800:旋轉驅動部件</p>  
        <p type="p">810:旋轉軸</p>  
        <p type="p">900:裝載腔室</p>  
        <p type="p">910:移動軸</p>  
        <p type="p">920:線性移動構件</p>  
        <p type="p">930:閘門</p>  
        <p type="p">950:加熱部件</p>  
        <p type="p">S:間隔空間/空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1571" publication-number="202619919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於兒童座椅系統之滑動帶扣錨固件</chinese-title>  
        <english-title>SLIDING BUCKLE ANCHOR FOR CHILD SEAT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260216B">B60R22/10</main-classification>  
        <further-classification edition="200601120260216B">B60R22/28</further-classification>  
        <further-classification edition="200601120260216B">B60N2/427</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大衛Ａ　雷曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVID A, LEHMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷戈里Ｓ　賽勒斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREGORY S, SELLERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種兒童座椅系統，其包括一座椅部分及一胯部帶扣，該胯部帶扣附接至一胯部帶。該胯部帶耦接至該座椅部分。該胯部帶扣藉由一能量吸收裝置附連至該座椅部分。該能量吸收裝置包括一可移動組件及至少一個能量吸收構件，該可移動組件耦接至該胯部帶，該至少一個能量吸收構件可與該可移動組件接合，以限制該可移動組件之移動。在一碰撞事件期間，該可移動組件可相對於該座椅部分移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child seat system includes a seat portion and a crotch buckle attached to a crotch strap. The crotch strap is coupled to the seat portion. The crotch buckle is affixed to the seat portion by an energy absorbing device. The energy absorbing device includes a movable component coupled to the crotch strap and at least one energy absorbing member engageable with the movable component to restrict movement of the movable component. The movable component is movable relative to the seat portion during a crash event.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:能量吸收裝置</p>  
        <p type="p">22:支架</p>  
        <p type="p">24:第一臂</p>  
        <p type="p">26:第二臂</p>  
        <p type="p">28:連接構件</p>  
        <p type="p">30:第一端</p>  
        <p type="p">32:第一表面</p>  
        <p type="p">34:第二端</p>  
        <p type="p">36:第一表面</p>  
        <p type="p">42:第一錨銷</p>  
        <p type="p">46:第二錨銷</p>  
        <p type="p">48a:第一端</p>  
        <p type="p">48b:第一端</p>  
        <p type="p">52:底表面</p>  
        <p type="p">54a:安裝槽</p>  
        <p type="p">54b:安裝槽</p>  
        <p type="p">58a:錨槽</p>  
        <p type="p">58b:錨槽</p>  
        <p type="p">60:帶扣錨銷/可移動組件</p>  
        <p type="p">64:側表面</p>  
        <p type="p">70a:第一能量吸收構件</p>  
        <p type="p">70b:第二能量吸收構件</p>  
        <p type="p">76a:第一端</p>  
        <p type="p">76b:第一端</p>  
        <p type="p">78a:第一區域</p>  
        <p type="p">78b:第一區域</p>  
        <p type="p">80a:第二端</p>  
        <p type="p">82a:第二區域</p>  
        <p type="p">82b:第二區域</p>  
        <p type="p">84a:中心部分</p>  
        <p type="p">84b:中心部分</p>  
        <p type="p">C:間隙</p>  
        <p type="p">L1:縱向軸線</p>  
        <p type="p">L2:縱向軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1572" publication-number="202620018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138750</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法、及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C309/39</main-classification>  
        <further-classification edition="200601120260223B">C07C309/40</further-classification>  
        <further-classification edition="200601120260223B">C07C309/42</further-classification>  
        <further-classification edition="200601120260223B">C07C309/46</further-classification>  
        <further-classification edition="200601120260223B">C07C309/58</further-classification>  
        <further-classification edition="200601120260223B">C07C317/14</further-classification>  
        <further-classification edition="200601120260223B">C07C381/12</further-classification>  
        <further-classification edition="200601120260223B">C07D327/06</further-classification>  
        <further-classification edition="200601120260223B">C07D333/46</further-classification>  
        <further-classification edition="200601120260223B">C07D333/54</further-classification>  
        <further-classification edition="200601120260223B">C07D333/76</further-classification>  
        <further-classification edition="200601120260223B">C07D335/02</further-classification>  
        <further-classification edition="200601120260223B">C08F212/14</further-classification>  
        <further-classification edition="200601120260223B">C08F220/18</further-classification>  
        <further-classification edition="200601120260223B">C08F220/30</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/038</further-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ　股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部祐大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄川冬輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAWA, FUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種於抗蝕劑圖案形成時可以充分的水準發揮感度、或曝光寬容度、焦點深度、圖案矩形性、顯影缺陷性能、CDU、及圖案圓形性的感放射線性組成物、圖案形成方法、及化合物。一種感放射線性組成物，含有：化合物（A），由下述式（A1）表示；聚合物（B），為選自由包含具有酸解離性基的結構單元（I）的聚合物（B2）及包含具有酚性羥基的結構單元（II）的聚合物（B1）所組成的群組中的至少一種；以及溶劑（E）。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="393px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1573" publication-number="202620566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>教示裝置及教示方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G05B19/42</main-classification>  
        <further-classification edition="200601120251201B">B25J9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗原佑典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIHARA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">謀求提供一種當將事先製作的動作程式應用於進行相同作業的複數個機器人之情況下，可以為了使各個機器人進行適合的動作而進行適當的教示之教示裝置。對機器人教示動作的教示裝置具備：位置資訊記憶部，記憶機器人的位置資訊；動作命令製作部，製作機器人的動作命令；及追加參數記憶部，記憶機器人的動作命令的複數個追加參數。動作命令製作部是依據記憶於位置資訊記憶部的位置資訊來製作複數個動作命令，將記憶於追加參數記憶部的複數個追加參數附加於製作的複數個動作命令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機器人</p>  
        <p type="p">2:機器人控制裝置(教示裝置)</p>  
        <p type="p">3:教示操作盤(教示裝置)</p>  
        <p type="p">5:視覺感測器(相機)</p>  
        <p type="p">21:位置資訊記憶部</p>  
        <p type="p">22:動作命令製作部</p>  
        <p type="p">23:追加參數記憶部</p>  
        <p type="p">24:參數種類選擇部</p>  
        <p type="p">25:參數順序選擇部</p>  
        <p type="p">26:感測器資訊記憶部</p>  
        <p type="p">27:追加參數變更部</p>  
        <p type="p">100:機器人系統(熔接機器人系統)</p>  
        <p type="p">120:教示按鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1574" publication-number="202620286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於汽缸內氣壓之代表性信號資料用以同步內燃機之方法</chinese-title>  
        <english-title>METHOD FOR SYNCHRONIZING AN INTERNAL COMBUSTION ENGINE ON THE BASIS OF DATA FROM SIGNALS REPRESENTATIVE OF AIR PRESSURE IN CYLINDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260216B">F02D41/06</main-classification>  
        <further-classification edition="200601120260216B">F02D13/06</further-classification>  
        <further-classification edition="200601120260216B">F02D41/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞米　查理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMY, CHARLY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩恩　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAYEN, JULIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種用於使四缸內燃機同步的方法，每個汽缸具有一進氣壓力感測器，其中一致動器使該內燃機可以從啟動四個汽缸的配置轉變為只啟動兩個汽缸(稱為活動汽缸)的配置。該方法先接收一啟動信號，然後選擇一發動機位置假設。在曲軸的不同角度位置處，測量該兩個活動汽缸內的進氣壓力值。根據一預定裕度將這些值相互比較，以使該假設有效或無效。如果在兩個連續步驟中使該假設有效，則達到同步。如果不是，則拒絕該假設，並且該發動機透過曲軸旋轉一圈進行旋轉，然後重新開始該等步驟，直到有效為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for synchronizing a four-cylinder internal combustion engine, each cylinder having an air intake pressure sensor, with an actuator making it possible to go from a configuration in which four cylinders are activated to a configuration in which only two cylinders, referred to as active cylinders, are activated. The method begins with the reception of a start signal, then the selection of an engine position assumption. At different angular positions of the crankshaft, air intake pressure values are measured in the two active cylinders. These values are compared with one another in accordance with a predetermined margin to validate or invalidate the assumption. If the assumption is validated in two successive steps, synchronization is attained. If not, the assumption is rejected and the engine is rotated by one revolution of the crankshaft before recommencing the steps until validation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D:裝置</p>  
        <p type="p">ECU:發動機控制單元</p>  
        <p type="p">M:內燃機</p>  
        <p type="p">R:車輪</p>  
        <p type="p">V:車輛</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1575" publication-number="202620915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括具有不連續底部電極層的電容器或離子電容器的能量儲存組件</chinese-title>  
        <english-title>AN ENERGY STORAGE COMPONENT COMPRISING A CAPACITOR OR AN IONIC CAPACITOR, WITH A DISCONTINUOUS BOTTOM ELECTRODE LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260215B">H01G9/048</main-classification>  
        <further-classification edition="200601120260215B">H01G9/025</further-classification>  
        <further-classification edition="201301120260215B">H01G11/26</further-classification>  
        <further-classification edition="200601120260215B">C25D11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴佛　賴瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUFFLE, LARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙拉茲　瓦倫丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALLAZ, VALENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維諾恩　福瑞迪瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOIRON, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾瓦多　維奧萊納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALVADOR, VIOLAINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏卡西　薩米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUKASSI, SAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎伯　亞蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMPO, ALAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造包括一能量儲存組件之一整合式電氣裝置的方法，其包括： &lt;br/&gt;提供包括一多孔區(103)之一支撐件， &lt;br/&gt;形成具有一開口(OP)之一絕緣層(104)，該開口定界該多孔區之一部分， &lt;br/&gt;形成一底部電極層(105)， &lt;br/&gt;蝕刻該底部電極層以使得在該絕緣層上且在該多孔區之該部分的頂部表面上移除該底部電極層，使得在該多孔區之該部分的孔隙內部保留一底部電極層， &lt;br/&gt;形成包括一介電層或一離子導體之一中間層(106)， &lt;br/&gt;在該中間層上形成一頂部電極層(107)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing an integrated electrical device comprising an energy storage component, comprising: &lt;br/&gt;providing a support comprising a porous region (103), &lt;br/&gt;forming an insulating layer (104) having an opening (OP) delimiting a portion of the porous region, &lt;br/&gt;forming a bottom electrode layer (105), &lt;br/&gt;etching the bottom electrode layer such that the bottom electrode layer is removed on the insulating layer and on the top surface of the portion of the porous region, such that there remains a bottom electrode layer inside pores of the portion of the porous region, &lt;br/&gt;forming an intermediate layer (106) comprising a dielectric layer or an ionic conductor, &lt;br/&gt;forming a top electrode layer (107) on the intermediate layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">101:陽極化障壁層</p>  
        <p type="p">102:金屬層</p>  
        <p type="p">103:陽極多孔氧化物區</p>  
        <p type="p">104:絕緣層</p>  
        <p type="p">105:底部電極層</p>  
        <p type="p">106:中間層</p>  
        <p type="p">107:頂部電極層</p>  
        <p type="p">108:導電層</p>  
        <p type="p">EDG:邊緣</p>  
        <p type="p">L1:直徑</p>  
        <p type="p">L2:直徑</p>  
        <p type="p">L3:距離</p>  
        <p type="p">OP:開口</p>  
        <p type="p">POR:筆直孔隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1576" publication-number="202620854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括多晶粒之半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING MULTIPLE DIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C7/18</main-classification>  
        <further-classification edition="200601120260223B">G11C8/14</further-classification>  
        <further-classification edition="200601120260223B">G11C5/02</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202501120260223B">H10D62/17</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜泌圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, PILKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴在花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAEWHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文光辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, KWANGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金恩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, EUNMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李讚美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置可包括：多個晶粒，其在一垂直方向上堆疊，其中該等多個晶粒中之每一者包括：一第一基體；一胞元電容器，其在該第一基體上；一胞元電晶體，其在該胞元電容器上；一第二基體，其中該第二基體之一垂直級位比該胞元電晶體之一垂直級位更高；一周邊電路電晶體，其在該第二基體上；以及一貫穿孔，其在該垂直方向上通過該第一基體及該第二基體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a plurality of dies stacked in a vertical direction, wherein each of the plurality of dies includes: a first substrate; a cell capacitor on the first substrate; a cell transistor on the cell capacitor; a second substrate, wherein a vertical level of the second substrate is higher than a vertical level of the cell transistor; a peripheral circuit transistor on the second substrate; and a through via passing through the first substrate and the second substrate in the vertical direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體晶粒</p>  
        <p type="p">12:貫穿孔</p>  
        <p type="p">12I:貫穿孔絕緣層</p>  
        <p type="p">14I:前側絕緣層</p>  
        <p type="p">14P:前側墊</p>  
        <p type="p">16I:背側絕緣層</p>  
        <p type="p">16P:背側墊</p>  
        <p type="p">110:第一基體</p>  
        <p type="p">122:第一電極</p>  
        <p type="p">124:電容器介電層</p>  
        <p type="p">126:第二電極</p>  
        <p type="p">132:介面絕緣層</p>  
        <p type="p">134:隱埋絕緣層</p>  
        <p type="p">136:胞元佈線結構、佈線結構</p>  
        <p type="p">138:第一層間絕緣層</p>  
        <p type="p">210:第二基體</p>  
        <p type="p">210H:貫通孔</p>  
        <p type="p">220:貫穿孔接點</p>  
        <p type="p">222:通孔絕緣層</p>  
        <p type="p">230:佈線絕緣層</p>  
        <p type="p">234:第二層間絕緣層</p>  
        <p type="p">238:第三層間絕緣層</p>  
        <p type="p">A:區</p>  
        <p type="p">AP:通道層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">C1:第一晶粒</p>  
        <p type="p">C2:第二晶粒</p>  
        <p type="p">C3:第三晶粒</p>  
        <p type="p">CAP:胞元電容器</p>  
        <p type="p">CTR:胞元電晶體</p>  
        <p type="p">H1:第一貫穿通孔</p>  
        <p type="p">H2:第二貫穿通孔</p>  
        <p type="p">PTR:周邊電路電晶體</p>  
        <p type="p">UWP:下墊</p>  
        <p type="p">WL:字線</p>  
        <p type="p">WP:佈線圖案</p>  
        <p type="p">X:第一水平方向</p>  
        <p type="p">Y:第二水平方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1577" publication-number="202621461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於讀取寫入晶圓之識別資訊的方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P74/20</main-classification>  
        <further-classification edition="202201120260223B">G01B9/02091</further-classification>  
        <further-classification edition="202201120260223B">G06V30/10</further-classification>  
        <further-classification edition="200601120260223B">G01B11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商普雷茨特光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECITEC OPTRONIK GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比亞洛翁斯　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIALOWONS, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密斯　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIETH, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一種讀取以識別字符（16）形式寫入晶圓（14）之識別資訊的方法中，包括光學相干斷層掃描儀（22）或色散共焦測距感測器（110）之光學測量設備（20；110）的至少一個測量光束（24；ML）對該晶圓（14）之寫入該識別字符（16）的區域（18）進行掃描。由對該晶圓（14）之掃描所生成之測量資料識別出該識別字符（16）。基於該識別出的識別字符（16）確定與其對應的識別資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:複合結構</p>  
        <p type="p">12:晶圓</p>  
        <p type="p">14:晶圓</p>  
        <p type="p">19:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1578" publication-number="202620183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體用清洗液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C11D7/06</main-classification>  
        <further-classification edition="200601120260210B">C11D1/10</further-classification>  
        <further-classification edition="200601120260210B">C08K5/098</further-classification>  
        <further-classification edition="200601120260210B">C11D11/04</further-classification>  
        <further-classification edition="200601120260210B">C23F11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上裕史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端雄一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤泰彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, YASUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體用清洗液，其包含下述(A)~(E)，且在25℃下之pH為9~14。 &lt;br/&gt;　　(A)下述式(1)所示之四級銨離子 &lt;br/&gt;　　(B)鹵離子 &lt;br/&gt;　　(C)氫氧離子 &lt;br/&gt;　　(D)螯合劑 &lt;br/&gt;　　(E)水 &lt;br/&gt;&lt;img align="absmiddle" height="153px" width="343px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;分別獨立為碳數1~16之烷基，但R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;之中，1個以上之烷基之碳數為2~16。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:陽極</p>  
        <p type="p">2:陰極</p>  
        <p type="p">3:電源</p>  
        <p type="p">4:陽極室</p>  
        <p type="p">5:原料室</p>  
        <p type="p">6:中間室</p>  
        <p type="p">7:陰極室</p>  
        <p type="p">8:陰離子交換膜</p>  
        <p type="p">9:陽離子交換膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1579" publication-number="202620026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物及使用其形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">C08G79/12</further-classification>  
        <further-classification edition="200601120260223B">C07C33/02</further-classification>  
        <further-classification edition="200601120260223B">C07C33/03</further-classification>  
        <further-classification edition="200601120260223B">C07C33/025</further-classification>  
        <further-classification edition="200601120260223B">C07C33/042</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞勝煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, SEUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雪熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SEOL HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳釜根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, BUKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張慧眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HYEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全鐘爀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, JONGHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白載烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, JAEYEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔正敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申尙勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種半導體光阻組成物及使用其形成圖案的方法，所述半導體光阻組成物包含：有機金屬化合物；包括不飽和鍵的醇化合物；以及溶劑。本申請可提供具有改善的靈敏度和線邊緣粗糙度特性的光阻圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming patterns using the same, the semiconductor photoresist composition including an organometallic compound; an alcohol compound including an unsaturated bond; and a solvent. The present application provides a photoresist pattern having improved sensitivity and LER characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底/半導體基底</p>  
        <p type="p">108:光阻圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1580" publication-number="202620090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性聚胺酯樹脂組合物及熱塑性聚胺酯彈性纖維</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C08G18/48</main-classification>  
        <further-classification edition="200601120260204B">C08G18/10</further-classification>  
        <further-classification edition="200601120260204B">D01F6/70</further-classification>  
        <further-classification edition="200601120260204B">A61F13/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田祥吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大内宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUCHI, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤諒平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, RYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於熔融紡絲時表現出良好之紡絲性，且於加工成纖維時具有優異之耐熱性及伸縮性的熱塑性聚胺酯樹脂組合物及彈性纖維。本發明之熱塑性聚胺酯樹脂組合物包含由硬鏈段及軟鏈段所構成之樹脂，上述硬鏈段包含含活性氫化合物及二異氰酸酯化合物，上述軟鏈段包含長鏈多元醇及二異氰酸酯化合物，該熱塑性聚胺酯樹脂組合物具有以下特徵：(a)硬鏈段之數量平均分子量為800以上2400以下，軟鏈段之數量平均分子量為1900以上4800以下，且Mh分率為15%以上40%以下；(b) Mw為100,000以上300,000以下，且Mw/Mn為1.5以上3.0以下；(c)藉由SAXS測得之硬鏈段區域間距離為8 nm以上25 nm以下；以及(d)於140℃下加熱時之硬鏈段區域間距離之變化率為30%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1581" publication-number="202620145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於銀拋光之化學機械拋光組合物</chinese-title>  
        <english-title>CHEMICAL-MECHANICAL POLISHING COMPOSITION FOR SILVER POLISHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09G1/02</main-classification>  
        <further-classification edition="200601120260223B">C09K3/14</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯政遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化學機械拋光組合物，其包含：(a)研磨劑，其選自二氧化矽研磨劑、氧化鋁研磨劑及其組合，(b)拋光促進劑化合物，其包含(i)至少兩個氮原子，及(ii)至少兩個選自異亞磷酸、羧酸、醇、酸酐及其組合之化學部分，(c)形貌控制劑，其包含非離子聚合物、陰離子聚合物或其組合，(d)腐蝕抑制劑，及(e)水。本發明亦提供一種使用該組合物來化學機械拋光基板，尤其包含銀之基板的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from a silica abrasive, an alumina abrasive, and a combination thereof, (b) a polishing promoter compound comprising (i) at least two nitrogen atoms and (ii) at least two chemical moieties selected from a phosphonic acid, a carboxylic acid, an alcohol, an anhydride, and a combination thereof, (c) a topography control agent comprising a nonionic polymer, an anionic polymer, or a combination thereof, (d) a corrosion inhibitor, and (e) water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising silver, using said composition.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1582" publication-number="202620654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可組態的中斷機制</chinese-title>  
        <english-title>CONFIGURABLE INTERRUPT MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G06F13/24</main-classification>  
        <further-classification edition="200601120260209B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　拉姆普拉卡什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, RAM PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派翠克　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRICK, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUONG, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾納蒂　高塔姆庫瑪爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARNATI, GOUTHAM KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於記憶體系統的系統、方法、及裝置，其等支援由一中斷控制器結合一主機裝置的主機控制器的中斷處置。在第一態樣中，一種產生一中斷之方法可包括：在一主機控制器裝置處接收用於一中斷的複數個組態參數；傳輸一指令至該記憶體系統的一記憶體控制器，以對該記憶體系統執行一記憶體操作；接收一事件已發生的一指示；及傳輸一指令至一中斷控制器，以基於該複數個組態參數來對該中斷控制器執行一記憶體寫入操作，該記憶體寫入操作包括該指示該事件已發生。亦主張及描述其他態樣及特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides systems, methods, and devices for memory systems that support interrupt handling by an interrupt controller in conjunction with the host controller of a host device. In a first aspect, a method of generating an interrupt may include receiving at a host controller device a plurality of configuration parameters for an interrupt; transmitting, to a memory controller of the memory system, an instruction to perform a memory operation on the memory system; receiving an indication that an event has occurred; and transmitting, to an interrupt controller, an instruction to perform a memory write operation to the interrupt controller based on the plurality of configuration parameters, the memory write operation including the indication the event has occurred. Other aspects and features are also claimed and described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:記憶體系統</p>  
        <p type="p">410:主機控制器</p>  
        <p type="p">412:主機控制器介面</p>  
        <p type="p">414:第一暫存器</p>  
        <p type="p">416:第二暫存器</p>  
        <p type="p">418:第一介面</p>  
        <p type="p">420:中斷控制器</p>  
        <p type="p">422:門鈴暫存器</p>  
        <p type="p">430:第二介面</p>  
        <p type="p">432:第三介面</p>  
        <p type="p">434:第四介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1583" publication-number="202621328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光裝置中的發光二極體封裝件的布置及相關方法</chinese-title>  
        <english-title>ARRANGEMENTS OF LIGHT-EMITTING DIODE PACKAGES IN LIGHT-EMITTING DEVICES AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260105B">H10H20/80</main-classification>  
        <further-classification edition="202501120260105B">H10H20/85</further-classification>  
        <further-classification edition="202501120260105B">H10H20/852</further-classification>  
        <further-classification edition="202501120260105B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　羅伯特　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, ROBERT DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示發光二極體（LED）裝置，且更特別地，LED裝置中之LED封裝件的布置及相關方法。LED裝置包括具有藉由柵格結構判定之間距的LED封裝件陣列。LED封裝件在組裝至LED裝置中之前部分地完成，由此准許在裝置組裝之前對LED封裝件進行個別測試及分組。部分完成之LED封裝件包括部分填充其凹槽以覆蓋相關聯LED晶片之初級囊封件。在裝置組裝期間，提供過度填充囊封件，所述過度填充囊封件覆蓋所述部分完成之LED封裝件且填充各凹槽之在所述初級囊封件上方的部分。柵格結構可保留為LED裝置中之組成元件，或柵格結構可在提供過度填充囊封件之前移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Light-emitting diode (LED) devices and more particularly arrangements of LED packages in LED devices and related methods are disclosed. LED devices include arrays of LED packages with spacings determined by grid structures. LED packages are partially finished before assembly into LED devices, thereby permitting individual testing and binning of LED packages before device assembly. Partially finished LED packages include primary encapsulants that partially fill recesses thereof to cover associated LED chips. During device assembly, overfill encapsulants are provided that cover the partially finished LED packages and fill portions of each recess above the primary encapsulants. Grid structures may remain as constituent elements in LED devices, or grid structures may be removed before providing overfill encapsulants.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1B-1B:線</p>  
        <p type="p">10:LED裝置</p>  
        <p type="p">12:LED封裝件</p>  
        <p type="p">14:LED晶片</p>  
        <p type="p">16:殼體</p>  
        <p type="p">16&lt;sub&gt;R&lt;/sub&gt;:凹槽</p>  
        <p type="p">18:初級囊封件</p>  
        <p type="p">20:柵格結構</p>  
        <p type="p">22:過度填充囊封件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1584" publication-number="202621377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造包括二維材料之半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202501120260223B">H10D30/01</further-classification>  
        <further-classification edition="200601120260223B">B08B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李丞浚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭成峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, SEONGJUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李殷奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUNKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪貞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, JOUNGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴民祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪敏碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, MINSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金載浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜漢炳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HANBYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造半導體裝置之方法。該方法包括：在基體上提供二維材料層；以及向該二維材料層供應蝕刻劑以自該二維材料層移除殘留物。該向該二維材料層供應該蝕刻劑包括：向設置有該基體之腔室供應第一製程氣體；向該腔室供應微波以在該腔室中形成第一電漿；以及向該腔室供應第二製程氣體以在該腔室中形成第二電漿，該第二製程氣體包括與該第一製程氣體不同的材料，該第二電漿包括該蝕刻劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor device is provided. The method includes: providing a two-dimensional material layer on a substrate; and supplying an etchant to the two-dimensional material layer to remove a residue from the two-dimensional material layer. The supplying the etchant to the two-dimensional material layer includes: supplying a first process gas to a chamber in which the substrate is provided; supplying microwaves to the chamber to form a first plasma in the chamber; and supplying a second process gas, including a different material from the first process gas, to the chamber to form a second plasma including the etchant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S110,S120,S130:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1585" publication-number="202620434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試探針的針套及測試系統</chinese-title>  
        <english-title>SLEEVE FOR TEST PROBES AND ASSOCIATED TESTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G01R1/04</main-classification>  
        <further-classification edition="200601120251103B">G01R1/067</further-classification>  
        <further-classification edition="200601120251103B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環鴻電子(昆山)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於測試探針的針套及測試系統，用於測試探針的針套包括熔斷內管和兩個導電套筒，熔斷內管於延伸方向的兩端設置有第一開口，導電套筒的外徑與熔斷內管相匹配，兩個導電套筒分別從熔斷內管兩端的第一開口插入，熔斷內管內於兩個導電套筒相互靠近的一端之間設置間隔件，兩個導電套筒分別與熔斷內管電連接，兩個導電套筒分別於相互遠離的一端設置第二開口，兩個測試探針通過第二開口分別插設在兩個導電套筒內，並分別與相應的導電套筒電連接，熔斷內管用於在過電流時膨脹斷路，並在預設溫度時恢復，本申請通過設置熔斷內管和導電套筒，實現了過電流膨脹斷路和預設溫度恢復，從而保護被測電子產品的電性安全，提升了測試探針的檢測效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a sleeve for test probes and an associated testing system. The sleeve comprises a fusible inner tube and two conductive sleeves. The fusible inner tube includes a first opening at each of its two ends along the longitudinal direction. The outer diameter of each conductive sleeve matches the inner diameter of the fusible inner tube, and the two conductive sleeves are respectively inserted into the first openings from both ends of the fusible inner tube. A spacer is disposed within the fusible inner tube between the adjacent ends of the two conductive sleeves. Each conductive sleeve is electrically connected to the fusible inner tube. A second opening is provided at the distal end of each conductive sleeve, opposite to the spacer. Two test probes are respectively inserted into the conductive sleeves via the second openings and are electrically connected thereto. The fusible inner tube is configured to expand and break the circuit under overcurrent conditions, and to recover at a predetermined temperature. By incorporating the fusible inner tube and conductive sleeves, the design enables circuit interruption upon overcurrent and recovery at a specified temperature, thereby protecting the electrical integrity of the device under test and enhancing the testing efficiency of the test probes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:導電套筒</p>  
        <p type="p">21:第二開口</p>  
        <p type="p">3:絕緣環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1586" publication-number="202621444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電卡盤電源和半導體製程設備</chinese-title>  
        <english-title>ELECTROSTATIC CHUCK POWER SUPPLY AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀安寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, AN KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薄海英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BO, HAI YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭宇霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YU LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉曉行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIY, XIAO HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王松濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於靜電卡盤電源和半導體製程設備，包括信號發生模組、開關模組、升壓模組和整流模組，信號發生模組產生脈衝信號，開關模組在脈衝信號的控制下產生第一電壓信號，升壓模組將第一電壓信號升壓為第二電壓信號，整流模組將第二電壓信號整流成用於使靜電卡盤的至少兩個電極的電壓極性相反的第三電壓信號和第四電壓信號，因第三電壓信號和第四電壓信號的參考信號與參考信號端的參考信號相同，參考信號端不與大地連接，可使電極的電壓參考點是參考信號端而非大地，又因晶圓的電壓參考點是大地，可使電極與晶圓的電壓參考點非同一參考點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an electrostatic chuck power supply and a semiconductor process equipment, comprising a signal generation module, a switching module, a voltage boosting module, and a rectification module. The signal generation module generates a pulse signal; the switching module, under the control of the pulse signal, generates a first voltage signal; the voltage boosting module boosts the first voltage signal to a second voltage signal; the rectification module rectifies the second voltage signal into a third voltage signal and a fourth voltage signal, which are used to make the voltage polarities of at least two electrodes of the electrostatic chuck opposite to each other. Since the reference signals of the third and fourth voltage signals are the same as the reference signal at the reference signal terminal, and the reference signal terminal is not connected to ground, the voltage reference point of the electrodes can be the reference signal terminal instead of ground. Furthermore, since the voltage reference point of the wafer is ground, the voltage reference points of the electrodes and the wafer are not the same</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:信號發生模組</p>  
        <p type="p">21:開關模組</p>  
        <p type="p">22:升壓模組</p>  
        <p type="p">23:整流模組</p>  
        <p type="p">H1:第三電壓信號</p>  
        <p type="p">H2:第四電壓信號</p>  
        <p type="p">H3:參考信號</p>  
        <p type="p">K1:第一控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1587" publication-number="202620377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維感測器、機器人系統及三維計測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G01B11/25</main-classification>  
        <further-classification edition="201701120260206B">G06T7/521</further-classification>  
        <further-classification edition="200601120260206B">B25J19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOTA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田順一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, JUNICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧澤象太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIZAWA, SHOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">謀求提供一種可以在短時間內高精度地作成作業對象的三維形狀之三維感測器。三維感測器具備：投影機，對作業對象投影複數種的投影型樣；及相機，拍攝投影有投影型樣之作業對象。投影型樣包含依照第1計測演算法進行作業對象的三維計測之第1投影型樣、以及依照第2計測演算法進行作業對象的三維計測之第2投影型樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST1~ST9:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1588" publication-number="202621335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封片、顯示面板及顯示面板的製造方法</chinese-title>  
        <english-title>ENCAPSULATING SHEET, DISPLAY PANEL, AND METHOD FOR MANUFACTURING DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10H29/854</main-classification>  
        <further-classification edition="201901120260223B">B32B7/06</further-classification>  
        <further-classification edition="200601120260223B">B32B33/00</further-classification>  
        <further-classification edition="200601120260223B">G09F9/30</further-classification>  
        <further-classification edition="202601120260223B">H10W74/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南方克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAKATA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松戸和規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山蕗夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, ROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木玲二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, REIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的目的在於提供一種密封片、顯示面板及顯示面板的製造方法，所述密封片不易與LED元件沾黏、容易變更載置位置、不易產生外觀不良、且不易在凹部的底面或角部產生空隙。一種密封片，是用於對將多個發光元件作為光源的顯示器用的發光元件彼此之間進行密封的密封片，所述密封片依次配置有第一膜、密封層形成用的樹脂組成物層以及第二膜，與所述第一膜相接的面上的所述樹脂組成物層的表面粗糙度Ra為0.02 μm以上，所述樹脂組成物層通過頻率1 Hz下的扭轉模式的動態黏彈性測定而獲得的玻璃化轉變溫度為20℃以上，在100℃下的損耗正切（tanδ&lt;sub&gt;100&lt;/sub&gt;）為0.2以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:密封片</p>  
        <p type="p">2:樹脂組成物層</p>  
        <p type="p">3:第一膜</p>  
        <p type="p">4:第二膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1589" publication-number="202621416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理設備、前驅物氣體提供方法、形成層之方法</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS, METHOD OF PROVIDING PRECURSOR GAS, AND METHOD OF FORMING LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="200601120260223B">C23C16/46</further-classification>  
        <further-classification edition="200601120260223B">B08B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維瓦　亞歷山德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIVA, ALESSANDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉安納基斯　揚尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIANNAKIS, IOANNIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿努　帕納焦塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARNOU, PANAGIOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑迪拉　路西安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JDIRA, LUCIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班克瑞斯　瑞德寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANKRAS, RADKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優湯南渡　里札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKANANTO, RIZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅塞爾皮奧　達維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROSERPIO, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特后司特　赫伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERHORST, HERBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏斯特雷肯　西奧多羅斯　Ｇ　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOSTERLAKEN, THEODORUS G.M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　哈斯特　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN HAASTERT, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪　瓊吉　傑羅恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE JONGE, JEROEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾布勒德　伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONGBLOED, BERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納尼　查蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANANI, CHAGGAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科塔里　尼米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTHARI, NIMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種半導體處理設備。該半導體處理設備包含：一製程腔室，其經配置以收納複數個基板；至少一個儲積器容器，其與該製程腔室流體連通，經配置以儲存呈氣體形式之一前驅物；以及至少兩個固態前驅物儲存容器，其各自經配置以收納呈氣體形式之一前驅物，使該所收納氣體形式前驅物在該各別固態前驅物儲存容器內部轉換成一固態，且使該固態前驅物轉換成氣相。該至少兩個固態前驅物儲存容器中之各者與該至少一個儲積器容器流體連通，以便允許將呈氣體形式之前驅物提供至該儲積器容器。該至少一個儲積器容器包含一可致動元件，該可致動元件經配置以使該至少一個儲積器容器之一內部容積在致動後即改變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor processing apparatus is disclosed. The semiconductor processing apparatus comprises a process chamber configured to receive a plurality of substrates; at least one accumulator vessel in fluid communication with the process chamber, configured to store a precursor in gas form; and at least two solid state precursor storage vessels, each being configured to receive a precursor in gas form, to cause said received gas form precursor to be converted to a solid state inside the respective solid state precursor storage vessel, and to cause said solid state precursor to be converted to gas phase. Each of the at least two solid state precursor storage vessels are in fluid communication with the at least one accumulator vessel so as to allow provision of precursor in gas form to the accumulator vessel. The at least one accumulator vessel comprises an actuatable element configured to cause an internal volume of the at least one accumulator vessel to be changed upon actuation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:半導體處理設備</p>  
        <p type="p">102:製程腔室</p>  
        <p type="p">103:基板</p>  
        <p type="p">104:基板晶舟</p>  
        <p type="p">105:製程腔室氣體流動入口</p>  
        <p type="p">106:製程腔室氣體排出入口</p>  
        <p type="p">107:儲積器容器</p>  
        <p type="p">108:固態前驅物儲存容器</p>  
        <p type="p">109:第一固態前驅物儲存容器</p>  
        <p type="p">110:第二固態前驅物儲存容器</p>  
        <p type="p">111:主體前驅物供應器</p>  
        <p type="p">112:第一氣體管線</p>  
        <p type="p">113:第二氣體管線</p>  
        <p type="p">114:第一氣體流量控制閥</p>  
        <p type="p">115:第二氣體流量控制閥</p>  
        <p type="p">116:第三氣體管線</p>  
        <p type="p">117:第四氣體管線</p>  
        <p type="p">118:第三氣體流量控制閥</p>  
        <p type="p">119:第四氣體流量控制閥</p>  
        <p type="p">120:第五氣體流量控制閥</p>  
        <p type="p">121:第六氣體流量控制閥</p>  
        <p type="p">122:第二製程氣體源</p>  
        <p type="p">123:第二製程氣體流量控制閥</p>  
        <p type="p">124:沖洗氣體源</p>  
        <p type="p">125:沖洗氣體流量控制閥</p>  
        <p type="p">126:第五氣體管線</p>  
        <p type="p">127:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1590" publication-number="202621188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感應發熱輥裝置</chinese-title>  
        <english-title>INDUCTION HEATED ROLL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H05B6/06</main-classification>  
        <further-classification edition="200601120251103B">H05B6/14</further-classification>  
        <further-classification edition="201601120251103B">H02J50/12</further-classification>  
        <further-classification edition="200601120251103B">G08C23/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商特電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUDEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村昌義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供感應發熱輥裝置，在將設置於輥的溫度感測器的檢測信號向靜止側傳輸的信號傳輸裝置中，在抑制消耗電力的同時提高光傳輸的穩定性，具有：光發送部（11），設置在旋轉側，輸出與檢測信號相應的光；光接收部（12），設置在靜止側，接收來自光發送部（11）的光；旋轉變壓器（13），靜止側線圈（131）與旋轉側線圈（132）電磁耦合，以非接觸的方式向光發送部（11）供電；以及交流電壓調整部（14），調整向靜止側線圈（131）供給的交流電壓，靜止側線圈（131）以及旋轉側線圈（132）呈繞輥（2）的旋轉軸（2C）捲繞的環狀，在輥（2）的旋轉軸方向上隔開間隔相互對置設置，交流電壓調整部（14）調整交流電壓的頻率或振幅，向旋轉側線圈（132）供給光發送部（11）的動作所需的基準電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is intended to improve the stability of light transmission, while suppressing power consumption, in a signal transmission device for transmitting a detection signal of a temperature sensor provided to a roll, to a stationary side. This signal transmission device includes: a light transmission unit 11 that is provided on a rotating side and outputs light in accordance with the detection signal; a light reception unit 12 that is provided on the stationary side and receives light from the light transmission unit 11; a rotary transformer 13 in which the stationary-side coil 131 and the rotating-side coil 132 are electromagnetically coupled to each other and that supplies power to the light transmission unit 11 in a contactless manner; and an alternating-current voltage adjustment unit 14 that adjusts an alternating-current voltage supplied to the stationary-side coil 131. The stationary-side coil 131 and the rotating-side coil 132 delineate an annular shape wound around a rotation axis 2C of the roll 2, and are provided in a manner facing each other with a gap therebetween along the rotation axis direction of the roll 2. The alternating-current voltage adjustment unit 14 supplies reference voltage necessary for the light transmission unit 11 to operate, to the rotating-side coil 132, by adjusting the frequency or the amplitude of the alternating-current voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2C:旋轉軸</p>  
        <p type="p">10:信號傳輸裝置</p>  
        <p type="p">10a:旋轉側支承部</p>  
        <p type="p">10a1:旋轉側固定部件</p>  
        <p type="p">10a2:旋轉側支柱部件</p>  
        <p type="p">10b:靜止側支承部</p>  
        <p type="p">10b1:靜止側固定部件</p>  
        <p type="p">10b2:靜止側支柱部件</p>  
        <p type="p">11:光發送部</p>  
        <p type="p">12:光接收部</p>  
        <p type="p">13:旋轉變壓器</p>  
        <p type="p">13H:中央開口部</p>  
        <p type="p">22a:軸頸部</p>  
        <p type="p">33a:支承軸</p>  
        <p type="p">111:處理電路部</p>  
        <p type="p">112:發光元件</p>  
        <p type="p">113:電源電路</p>  
        <p type="p">121:接收元件</p>  
        <p type="p">122:處理電路部</p>  
        <p type="p">131:靜止側線圈</p>  
        <p type="p">132:旋轉側線圈</p>  
        <p type="p">133:靜止側樹脂密封部</p>  
        <p type="p">133h:貫通部</p>  
        <p type="p">134:旋轉側樹脂密封部</p>  
        <p type="p">134h:貫通部</p>  
        <p type="p">135:鐵氧體磁芯</p>  
        <p type="p">136:鐵氧體磁芯</p>  
        <p type="p">222:軸頸軸</p>  
        <p type="p">K1、K2、K3:基板</p>  
        <p type="p">L2:信號線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1591" publication-number="202620423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定變形特性之方法及相關系統</chinese-title>  
        <english-title>METHODS OF DETERMINING A DEFORMATION CHARACTERISTIC AND ASSOCIATED SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G01N23/203</main-classification>  
        <further-classification edition="201701120260206B">G06T7/00</further-classification>  
        <further-classification edition="200601120260206B">G01B15/06</further-classification>  
        <further-classification edition="200601120260206B">H01J37/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯帕　真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASPAR, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩特里克　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETREK, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維斯塔維爾　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VYSTAVEL, TOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍策　雅各布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLZER, JAKUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克倫　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KREN, MICHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實例中，一種方法包括：判定表徵一變形特性的一特性位移梯度(DG)張量。該方法包括：在一迭代常式中，至少部分地基於一考慮區域(ZOC)內的像素值來計算與一試驗DG張量相關聯的一目標函數值，該ZOC係至少部分地基於該試驗DG張量來自動判定。在另一實例中，一種方法包括：判定對應於一測試影像的一或多個旋轉變換分量；及至少部分地基於該（多個）旋轉變換分量來判定一特性DG張量。在另一實例中，一種系統包括一電子光學總成、一偵測器總成、及經程式化以判定一特性DG張量的一控制器。在另一實例中，一種非暫時性電腦可讀取媒體儲存指令，當由一電腦執行時，該等指令使該電腦執行一種判定一變形特性之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an example, a method includes determining a characteristic displacement gradient (DG) tensor that characterizes a deformation characteristic. The method includes, in an iterative routine, calculating an objective function value associated with a trial DG tensor based, at least in part, on pixel values within a zone of consideration (ZOC) that is determined automatically based at least in part on the trial DG tensor. In another example, a method includes determining one or more rotational transformation components corresponding to a test image and determining a characteristic DG tensor based at least in part on the rotational transformation component(s). In another example, a system includes an electron optics assembly, a detector assembly, and a controller programmed to determine a characteristic DG tensor. In another example, a non-transitory computer readable medium stores instructions which, when executed by a computer, cause the computer to perform a method of determining a deformation characteristic.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">910,912,914,916,918,920,922,924,926,928,930,932,934,936,938:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1592" publication-number="202620903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同位素衰變能量集能裝置</chinese-title>  
        <english-title>RADIATION DECAY ENERGY HARVESTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260208B">G21H1/12</main-classification>  
        <further-classification edition="200601120260208B">G21K1/08</further-classification>  
        <further-classification edition="200601120260208B">G21G4/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟金祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, CHIN-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何沂叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬翊峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, TYNG-WOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種收集同位素衰變能量並轉換為電能的集能裝置，包含一圓柱狀的供電模組，及位於該供電模組兩端的永久磁鐵，該供電模組包括位於一可撓性薄膜太陽能板表面的一隔離層及一光轉換層，該光轉換層具有一高分子基膜及多數分散於該高分子基膜的複合量子點，該等複合量子點分別具有多數可放射ß粒子之放射性同位素的配體，且該等永久磁鐵控制該等配體所放射的ß粒子的散射軌跡，該等複合量子點同時具有放射ß粒子及吸收ß粒子能量進而放出螢光的效果，再加上該等永久磁鐵限制ß粒子散射軌跡，以有效增加ß粒子碰撞量子點而可增強螢光發射的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A harvesting device for harvesting energy from isotope decay and converting it into electrical power. The harvesting device includes a cylindrical power-generating module with two permanent magnets positioned at each end. The power-generating module consists of a rollable thin-film solar panel covered by an isolation layer and a light conversion layer. This light conversion layer is composed of a polymer base film embedded with composite quantum dots. These composite quantum dots have ligands containing various radioactive isotopes capable of emitting ß particles. The permanent magnets guide the trajectories of the emitted ß particles, enhancing their interaction with the quantum dots. Through this mechanism, the quantum dots absorb energy of ß particles and emit fluorescence. The presence of the permanent magnets effectively focuses the ß particles' paths, increasing collisions with the quantum dots and thus boosting fluorescence emission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:罩殼</p>  
        <p type="p">21:殼體</p>  
        <p type="p">22:穿孔</p>  
        <p type="p">3:供電模組</p>  
        <p type="p">31:可撓性薄膜太陽能板</p>  
        <p type="p">32:光轉換層</p>  
        <p type="p">33:隔離層</p>  
        <p type="p">4:永久磁鐵</p>  
        <p type="p">5:導線單元</p>  
        <p type="p">51:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1593" publication-number="202619942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在層壓過程期間緩解玻璃表面缺陷之方法及設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR MITIGATING GLASS SURFACE DEFECTS DURING LAMINATION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">B65B33/00</main-classification>  
        <further-classification edition="200601120260204B">B65G49/06</further-classification>  
        <further-classification edition="200601120260204B">B32B37/10</further-classification>  
        <further-classification edition="200601120260204B">B05C1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　安平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUAN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王景窯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於將一膜材料塗敷至一玻璃基板之一表面的玻璃層壓設備。該設備包括一第一輥及一第二輥。該第一輥與該第二輥間隔開以在其間界定一開口，該開口之尺寸適於接收一玻璃基板。該第一輥可移動至一接合位置，其中該第一輥之一外表面經組態以在該玻璃基板移動通過該開口時壓向該玻璃基板之一第一主表面。該第一輥進一步包括一層材料，該層材料以一螺旋形圖案纏繞於該第一輥之該外表面周圍，以界定沿著該第一輥之一縱向軸線連續定位的一系列線圈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass lamination apparatus for applying a film material to a surface of a glass substrate. The apparatus includes a first roller and a second roller. The first roller is spaced-apart from the second roller to define an opening therebetween dimensioned to receive a glass substrate. The first roller is movable to an engagement position wherein an outer surface of the first roller is configured to be pressed toward a first major surface of the glass substrate as the glass substrate moves through the opening. The first roller further includes a layer material wrapped around the outer surface of the first roller in a helical pattern to define a series of coils successively positioned along a longitudinal axis of the first roller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玻璃層壓機/層壓機</p>  
        <p type="p">102:玻璃基板</p>  
        <p type="p">103A:第一主表面</p>  
        <p type="p">103B:第二主表面</p>  
        <p type="p">104:第一膜/膜</p>  
        <p type="p">106:第二膜/膜</p>  
        <p type="p">108A:上部輥/第二輥</p>  
        <p type="p">108B:上部輥/第一輥</p>  
        <p type="p">108C:下部輥/第二輥</p>  
        <p type="p">108D:下部輥/第一輥</p>  
        <p type="p">110A:第一卷</p>  
        <p type="p">110B:第二卷</p>  
        <p type="p">112A:致動器</p>  
        <p type="p">112B:致動器</p>  
        <p type="p">112C:致動器</p>  
        <p type="p">112D:致動器</p>  
        <p type="p">R1:箭頭</p>  
        <p type="p">R2:箭頭</p>  
        <p type="p">R3:箭頭</p>  
        <p type="p">R4:箭頭</p>  
        <p type="p">R5:箭頭</p>  
        <p type="p">R6:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1594" publication-number="202620710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置與由裝置或代理管理器執行的方法</chinese-title>  
        <english-title>AGENTIC EXPERIENCES PROVIDED BY AN EDGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">G06N20/00</main-classification>  
        <further-classification edition="202301120260202B">G06N5/04</further-classification>  
        <further-classification edition="200601120260202B">G06F9/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">向部署在裝置上的每個人工智慧（AI）模型發送多個預定義請求。對於每個預定義請求，從每個AI模型的推理操作中獲得一個多維度複雜度向量。該多維度複雜度向量在每個維度中指示推理操作的複雜度值。通過計算從每個預定義請求獲得的複雜度值的組合並在預定義請求上平均，來評估每個AI模型提供的代理級別。在接收到用戶請求時，估計該用戶請求所需的代理級別。將該用戶請求引導至提供所需代理級別的AI模型之一。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Multiple predefined requests are sent to each of the artificial intelligence (AI) models deployed on a device. For each predefined request, a multi-dimensional complexity vector is obtained from inference operations of each AI model. The multi-dimensional complexity vector indicates, in each dimension, a complexity value of the inference operations. The agentic level provided by each AI model is evaluated by calculating a combination of complexity values obtained from each predefined request and averaging over the predefined requests. When receiving a user request, a required agentic level of the user request is estimated. The user request is directed to one of the AI models that provides the required agentic level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:步驟</p>  
        <p type="p">420:步驟</p>  
        <p type="p">430:步驟</p>  
        <p type="p">440:步驟</p>  
        <p type="p">450:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1595" publication-number="202620324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體供給管線</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">F16K49/00</main-classification>  
        <further-classification edition="200601120260202B">F16K27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKIN INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星子泰輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHIKO, TAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊本拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAMOTO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種流體供給管線，其係能夠將於氣體管線流動之氣體充分且均等地加熱。 &lt;br/&gt;　　[解決手段]流體供給管線(1)，係具備：氣體管線(3)，係具有：第1管線部(3A)，係具有沿著流體之流動方向延伸並彼此位於相反側之第1面(3C)及第2面(3D)；第2管線部(3B)，係並排於第1管線部(3A)配置，端部係連接至第1管線部(3A)之端部，具有沿著流體之流動方向延伸並彼此位於相反側之第3面(3E)及第4面(3F)；並且，第1面(3C)及第3面(3E)係在正交於流體之流動方向之方向彼此對向；加熱器(6A)，係沿著第2面(3D)及第4面(3F)設置；以及鋁塊(4)，係將來自加熱器(6A)之熱，傳遞至第1面(3C)及第3面(3E)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:流體控制裝置</p>  
        <p type="p">2:基部板</p>  
        <p type="p">2a:凸柱插入孔</p>  
        <p type="p">3:氣體管線</p>  
        <p type="p">3A:第1管線部</p>  
        <p type="p">3B:第2管線部</p>  
        <p type="p">3C:第1面</p>  
        <p type="p">3D:第2面</p>  
        <p type="p">3E:第3面</p>  
        <p type="p">3F:第4面</p>  
        <p type="p">3G:第5面</p>  
        <p type="p">3H:第6面</p>  
        <p type="p">4B:第2塊部</p>  
        <p type="p">4B1:第1熱傳導部</p>  
        <p type="p">4B2:第2熱傳導部</p>  
        <p type="p">4c:固定孔</p>  
        <p type="p">5:凸柱</p>  
        <p type="p">5A:螺栓</p>  
        <p type="p">5b:間隙</p>  
        <p type="p">6:加熱器部</p>  
        <p type="p">6A:加熱器</p>  
        <p type="p">6B:夾具</p>  
        <p type="p">6B1:第1熱傳導部</p>  
        <p type="p">7A:入口配管</p>  
        <p type="p">7B:出口配管</p>  
        <p type="p">8:接頭</p>  
        <p type="p">11,12,13,14:流體控制機器</p>  
        <p type="p">13A,14A:固定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1596" publication-number="202620665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用戶裝置間的代理資料同步方法和裝置及代理協作方法</chinese-title>  
        <english-title>EDGE-CLOUD HYBRID AGENTIC SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">G06F16/27</main-classification>  
        <further-classification edition="201901120260202B">G06F16/178</further-classification>  
        <further-classification edition="202201120260202B">H04L67/1095</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於用戶的第一裝置與第二裝置之間進行代理資料同步的方法當第一裝置檢測雲端資料塊與邊緣資料塊之間的差異，代理資料在用戶的第一裝置與第二裝置之間進行同步。邊緣資料塊存儲於該第一裝置中，並包含從該用戶與第一個或多個人工智慧（AI）模型交互中獲得的第一組用戶偏好。該雲端資料塊是從該第二裝置上傳至雲端伺服器，並包含從該用戶與第二個或多個AI模型交互中獲得的第二組用戶偏好。當該雲端資料塊的第二時間跨度至少部分位於該邊緣資料塊的第一時間跨度之外時，下載該雲端資料塊至該第一裝置。更新的資料塊生成並作為同步後資料塊上傳至該雲端伺服器，其中該同步後資料塊包含更新的用戶偏好。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Agentic data is synchronized between a first device and a second device of a user when the first device detects a discrepancy between a cloud data chunk and an edge data chunk that are generated within a time interval. The edge data chunk is stored on the first device and contains user preferences obtained from the user interacting with first one or more artificial intelligence (AI) models. The cloud data chunk is uploaded from the second device to the cloud and contains user preferences obtained from the user interacting with second one or more AI models. The cloud data chunk is downloaded to the first device when a second timespan of the cloud data chunk is at least partially outside a first timespan of the edge data chunk. An updated data chunk is generated and uploaded to the cloud as an after-sync data chunk containing updated user preferences.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:方法</p>  
        <p type="p">1210:步驟</p>  
        <p type="p">1220:步驟</p>  
        <p type="p">1230:步驟</p>  
        <p type="p">1240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1597" publication-number="202619972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變濕吸附劑及其製備方法</chinese-title>  
        <english-title>MOISTURE SWING ADSORBENTS AND PRODUCTION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C01B33/12</main-classification>  
        <further-classification edition="200601120260210B">B01J20/16</further-classification>  
        <further-classification edition="200601120260210B">B01D53/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納斯維拉　泰瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASSIVERA, TERRY W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倫奎斯特　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNDQUIST, ERIC G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭特　柴克瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, ZACHARY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫特　納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTL, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福克斯溫克勒　雷吉娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHS-WINKLER, REGINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特雷希　格萊葛里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREICH, GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於基於經四級陽離子吸附劑化合物處理的無機多孔金屬氧化物擔體材料之變濕吸附劑、其製備方法、及此吸附劑材料用於從氣體混合物或從空氣捕獲二氧化碳之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to moisture swing adsorbents based on inorganic porous metal oxide support material treated with quaternary cationic sorbent compound, a method of manufacturing thereof and the use of such adsorbent materials for carbon dioxide capturing from a gas mixture or from air.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1598" publication-number="202621478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有邊緣墊半導體晶片的基板上晶圓上晶片積體電路結構</chinese-title>  
        <english-title>COWOS IC STRUCTURE WITH EDGE-PAD SEMICONDUCTOR DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W20/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W40/10</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="200601120260223B">G11C11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路結構包含：記憶體堆疊，其包含多個彼此水平分離的半導體晶片、記憶體控制晶片、中介層、邏輯處理器晶片及封裝基板。每一半導體晶片包含頂面、底面及四個側壁，以及多個沿著第一側壁佈置的邊緣墊。將記憶體控制晶片安置於下方且電性連接到每一半導體晶片的多個邊緣墊，其中每一半導體晶片的第一側壁面向記憶體控制晶片。將中介層安置於下方且電性連接到記憶體控制晶片。將邏輯處理器晶片電性連接到記憶體控制晶片。將封裝基板安置於下方且電性連接到中介層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC structure includes a memory stack, which includes a plurality of semiconductor dies horizontally separate with each other, a memory controller chip, an interposer, a logic processor chip and a packaging substrate. Each semiconductor die includes a top surface, a bottom surface, and four sidewalls, and a plurality of edge pads are arranged along the first sidewall. The memory controller chip is disposed under and electrically connected to the plurality of edge pads of each semiconductor die, wherein the first sidewall of each semiconductor die faces the memory controller chip. The interposer is disposed under and electrically connected to the memory controller chip. The logic processor chip is electrically connected to the memory controller chip. The packaging substrate is disposed under and electrically connected to the interposer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25:邊緣墊</p>  
        <p type="p">60:記憶體層疊</p>  
        <p type="p">61:半導體晶片</p>  
        <p type="p">61S1:第一側壁</p>  
        <p type="p">61S2:第二側壁</p>  
        <p type="p">61S3:第三側壁</p>  
        <p type="p">62:向上延伸導熱層</p>  
        <p type="p">63:頂部高導熱層</p>  
        <p type="p">64:記憶體控制晶片</p>  
        <p type="p">65:中介層</p>  
        <p type="p">66:邏輯處理器晶片</p>  
        <p type="p">67:封裝基板</p>  
        <p type="p">600:COWOS IC結構</p>  
        <p type="p">641、651:TSV</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1599" publication-number="202620333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>尾氣處理裝置和半導體製程設備</chinese-title>  
        <english-title>EXHAUST GAS TREATMENT DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F23G7/06</main-classification>  
        <further-classification edition="200601120260223B">B01D53/76</further-classification>  
        <further-classification edition="202601120260223B">H10P95/00</further-classification>  
        <further-classification edition="200601120260223B">F28F13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔祥天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, XIANG TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI KA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈海波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, HAI BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任亦楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, YI YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢存存</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, CUN CUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANG, YAO HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉一種尾氣處理裝置和半導體製程設備，屬半導體加工技術領域，尾氣處理裝置中，燃燒腔室的第一端設有用於通入助燃氣體的進氣口，燃燒腔室的第二端設置有產物出口；加熱腔室包括腔體，加熱器套設於腔體的外壁，腔體的第一端與連通管路連通，連通管路用以輸送待處理的尾氣至腔體，且腔體的第二端朝向產物出口並設有排氣口，經排氣口排出的尾氣在燃燒腔室內進行燃燒。上述尾氣處理裝置可解決目前的尾氣處理裝置工作過程中，容易出現氫氣在被加熱至燃點後即在加熱腔內進行燃燒的情況，這會對加熱腔的使用壽命產生較大的不利影響的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an exhaust gas treatment device and semiconductor processing equipment, belonging to the technical field of semiconductor processing. In the exhaust gas treatment device, a first end of the combustion chamber is provided with an air inlet for introducing a combustion-supporting gas, and a second end of the combustion chamber is provided with a product outlet. The heating chamber comprises a chamber body, with a heater sleeved on the outer wall of the chamber body. The first end of the chamber body is connected to a connecting pipeline, which is used to deliver the exhaust gas to be treated into the chamber body. The second end of the chamber body faces the product outlet and is provided with an exhaust port. The exhaust gas discharged through the exhaust port is combusted in the combustion chamber. The above exhaust gas treatment device can solve the problem in current exhaust gas treatment devices, where hydrogen gas, after being heated to its ignition point, tends to combust within the heating chamber, which has a significant adverse effect on the service life of the heating chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:加熱腔室</p>  
        <p type="p">210:腔體</p>  
        <p type="p">212:通孔</p>  
        <p type="p">220:導熱柱</p>  
        <p type="p">230:導熱片</p>  
        <p type="p">240:阻流板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1600" publication-number="202620064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化膜、半導體裝置及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C08F2/48</main-classification>  
        <further-classification edition="200601120260203B">C08G18/18</further-classification>  
        <further-classification edition="200601120260203B">G03F7/028</further-classification>  
        <further-classification edition="200601120260203B">C08F120/56</further-classification>  
        <further-classification edition="200601120260203B">C08L79/08</further-classification>  
        <further-classification edition="200601120260203B">C08G73/10</further-classification>  
        <further-classification edition="202501120260203B">H10D1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木内洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIUCHI, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田政弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種在厚膜下的圖案加工時能夠形成適當尺寸的開口部且對光阻劑剝離時的化學液的耐化學品性良好的樹脂組成物。本發明的樹脂組成物含有（a）樹脂、（b）含醯胺基的三級胺、（c）芳香族羧酸化合物、以及（d）有機溶媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板</p>  
        <p type="p">12、13:層間絕緣膜</p>  
        <p type="p">14:金屬(Cr、Ti等)膜</p>  
        <p type="p">15、16:金屬配線(Ag、Cu等)</p>  
        <p type="p">17:電極</p>  
        <p type="p">18:密封樹脂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1601" publication-number="202620209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滲透用粉末及其製造方法</chinese-title>  
        <english-title>POWDER FOR INFILTRATION AND METHOD OF PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">C22C9/00</main-classification>  
        <further-classification edition="200601120260127B">C22C9/05</further-classification>  
        <further-classification edition="200601120260127B">C22C9/06</further-classification>  
        <further-classification edition="202201120260127B">B22F1/00</further-classification>  
        <further-classification edition="200601120260127B">B22F3/26</further-classification>  
        <further-classification edition="200601120260127B">B22F9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商豐山控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POONGSAN HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大環</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAE HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露揭露了一種具優異滲透率及殘留物移除效率且無侵蝕的滲透用粉末及其製備方法。此滲透用粉末含有0.5 wt%至5 wt%的選自鐵(Fe)、鎳(Ni)及鉬(Mo)中的至少一種元素，0.6 wt%至1.8 wt%的二氧化鈦(TiO&lt;sub&gt;2&lt;/sub&gt;)，其餘為銅(Cu)，以及0.1 wt%或更少的不可避免的雜質。此滲透用粉末適用於要求優異機械性質的汽車或電氣/電子元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a powder for infiltration having excellent infiltration rate and residue removal efficiency, thus being free from erosion, and a method of producing the same. The powder for infiltration contains 0.5 to 5% by weight of at least one element selected from iron (Fe), nickel (Ni) and molybdenum (Mo), 0.6 to 1.8% by weight of titanium dioxide (TiO&lt;sub&gt;2&lt;/sub&gt;), the balance of copper (Cu), and 0.1% by weight or less of inevitable impurities. The powder for infiltration is suitable for use in automotive or electrical/electronic components requiring superior mechanical properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1602" publication-number="202620705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子位元處理方法</chinese-title>  
        <english-title>A QUBIT PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260202B">G06N10/40</main-classification>  
        <further-classification edition="202201120260202B">G06N10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商量子運動科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTUM MOTION TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西格爾　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEGEL, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡恩　哈姆扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JNANE, HAMZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡薩雷斯　札爾巴　米格爾　費爾南多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONZALEZ ZALBA, MIGUEL FERNANDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種用於在一矽晶片量子位元處理器中執行操作之方法。該方法涉及在具有一第一諧振自旋頻率之一第一量子點處提供一量子位元，並將該量子位元傳送至具有一第二諧振自旋頻率之一第二量子點。該方法涉及將一AC電磁場應用於該等第一及第二量子點以便操縱量子位元自旋狀態，其中該所應用AC電場具有從一加權平均值計算之一頻率，該加權平均值從該等第一及第二諧振自旋頻率導出。在另一配置中，該方法涉及藉由利用點間穿隧而非斯塔克移位調諧來提供g因數之一經增強可調諧範圍。該方法之一變體對沿一陣列穿梭之量子位元對應用雙量子位元操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is disclosed for performing operations in a silicon chip qubit processor. The method involves providing a qubit at a first quantum dot, having a first resonant spin frequency and transferring the qubit to a second quantum dot, having a second resonant spin frequency. The method involves applying an AC electromagnetic field to the first and second quantum dots in order to manipulate the qubit spin state, wherein the applied AC electric field has a frequency which is calculated from a weighted average, derived from the first and second resonant spin frequencies. In another arrangement the method involves providing an enhanced tuneable range of g-factors by leveraging inter-dot tunnelling rather than Stark shift tuning. A variant of the method applies two-qubit operations on pairs of qubits that are shuttled along an array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第一閘</p>  
        <p type="p">4:第二閘</p>  
        <p type="p">T1:時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1603" publication-number="202620691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>張量處理單元</chinese-title>  
        <english-title>TENSOR PROCESSING UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G06N3/06</main-classification>  
        <further-classification edition="202301120260205B">G06N3/0495</further-classification>  
        <further-classification edition="200601120260205B">G06F17/16</further-classification>  
        <further-classification edition="201801120260205B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商墨子國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昶旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王若珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種針對神經網路運算最佳化之張量處理電路。該電路包括用於儲存權重及啟動張量之一張量快取區、用於張量遮罩之一張量遮罩快取區以及一累加快取區。一收集電路基於該等張量遮罩將密集張量變換成經壓縮張量。一分散電路自經壓縮張量重建未經壓縮張量。一控制電路經由該收集電路管理將權重及啟動張量變換成經壓縮形式。一乘法器電路處理此等經壓縮張量以產生一中間張量。一累加電路藉由將該中間張量與來自該累加快取區之另一張量組合來產生一輸出張量且寫回該輸出張量。若經快取張量未經壓縮，則在產生該輸出張量之前使用該分散電路將該中間張量轉換回為一未經壓縮形式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tensor processing circuit optimized for neural network computations is disclosed. The circuit comprises a tensor cache for storing weight and activation tensors, a tensor mask cache for tensor masks, and an accumulation cache. A gather circuit transforms dense tensors into condensed tensors based on the tensor masks. A scatter circuit reconstructs uncondensed tensors from condensed tensors. A control circuit manages the transformation of weight and activation tensors into condensed forms via the gather circuit. A multiplier circuit processes these condensed tensors to generate an intermediate tensor. An accumulating circuit produces an output tensor by combining the intermediate tensor with another tensor from the accumulation cache and writes it back. If the cached tensor is uncondensed, the intermediate tensor is converted back to an uncondensed form using the scatter circuit before generating the output tensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:控制模組</p>  
        <p type="p">320:運算模組</p>  
        <p type="p">322:共用記憶體</p>  
        <p type="p">323:源張量0 L1快取區/</p>  
        <p type="p">324:源遮罩0 L1快取區/第一張量遮罩快取區</p>  
        <p type="p">325:分散電路</p>  
        <p type="p">326:收集電路</p>  
        <p type="p">327:雙分散電路</p>  
        <p type="p">328:雙收集電路</p>  
        <p type="p">329:乘法器陣列</p>  
        <p type="p">330:額外分散電路</p>  
        <p type="p">332:加法器樹</p>  
        <p type="p">334:累加L1快取區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1604" publication-number="202619680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於使用熱成像系統以監控健康狀態的系統</chinese-title>  
        <english-title>SYSTEM FOR MONITORING HEALTH STATUS USING A THERMAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">A61B5/01</main-classification>  
        <further-classification edition="200601120260211B">A61N1/08</further-classification>  
        <further-classification edition="200601120260211B">G01N21/71</further-classification>  
        <further-classification edition="202401120260211B">G06Q50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商埃默亞公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMERJA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　蓋伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示技術係關於用於藉由監控母親/嬰兒二元體之熱通量模式以監控一母親及/或嬰兒之一健康狀態的系統，以及使用該母親/嬰兒二元體之熱通量模式偵測該母親及/或嬰兒之健康異常的方法。所揭示技術亦係關於監控體溫調節轉變之方法，包括用一熱成像裝置獲得一受試者之複數個熱影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed technology relates to systems for monitoring a health status of a mother and/or infant by monitoring heat flux patterns of the mother/infant dyad, and methods of detecting health anomalies in the mother and/or infant using heat flux patterns of the mother/infant dyad. The disclosed technology also relates to methods of monitoring thermoregulation transitions comprising obtaining a plurality of thermal images of a subject with a thermal imaging device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3900:熱圖系統</p>  
        <p type="p">3902:熱成像裝置</p>  
        <p type="p">3904:處理系統</p>  
        <p type="p">3906:處理器</p>  
        <p type="p">3908:輸入/輸出(I/O)裝置</p>  
        <p type="p">3910:網路介面</p>  
        <p type="p">3912:記憶體</p>  
        <p type="p">3914:電力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1605" publication-number="202620627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統暫存器封鎖控制暫存器</chinese-title>  
        <english-title>SYSTEM REGISTER LOCKDOWN CONTROL REGISTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/30</main-classification>  
        <further-classification edition="201301120251201B">G06F21/60</further-classification>  
        <further-classification edition="201301120251201B">G06F21/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派克　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKER, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含：處理電路系統，其經組態以回應於在由該處理電路系統支援的複數個例外等級之一者中執行的指令而執行資料處理；複數個系統暫存器，其經組態以儲存系統暫存器狀態資訊；及至少一個系統暫存器封鎖控制暫存器，其回應於在除一最高特權例外等級之外的一預定例外等級中執行的一指令而可寫入，且經組態以儲存用於控制對該系統暫存器狀態資訊之一子集的更新的封鎖控制資訊。該封鎖控制資訊對於該子集中的系統暫存器狀態資訊之各項目指定該項目係處於一鎖定狀態或未鎖定狀態。回應於在該預定例外等級中執行的一系統暫存器更新指令請求對來自系統暫存器狀態資訊之該子集的系統暫存器狀態資訊之一目標項目的一更新，當該封鎖控制資訊指定系統暫存器狀態資訊之該目標項目處於該鎖定狀態時，該處理電路系統抑制對系統暫存器狀態資訊之該目標項目的該更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises processing circuitry configured to perform data processing in response to instructions executed in one of a plurality of exception levels supported by the processing circuitry; a plurality of system registers configured to store system register state information; and at least one system register lockdown control register, writable in response to an instruction executed in a predetermined exception level other than a most privileged exception level, and configured to store lockdown control information for controlling updates to a subset of the system register state information. The lockdown control information specifies, for each item of system register state information in the subset, whether that item is in a locked state or unlocked state. In response to a system register update instruction executed in the predetermined exception level requesting an update to a target item of system register state information from the subset of system register state information, when the lockdown control information specifies that the target item of system register state information is in the locked state, the processing circuitry suppresses the update to the target item of system register state information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,102,104,106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1606" publication-number="202620340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發熱裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260223B">F24V30/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商綠浄星球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEAN PLANET INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤美登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, YOSHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可提升啟動效能及耐用性的發熱裝置。發熱裝置3具有：供給含氫的氫系氣體之密閉容器5、具有第一加熱器15且設置於密閉容器5內部的第一發熱構造體8、具有藉由氫之吸收和釋放而產熱的發熱體14b及第二加熱器16且設置於密閉容器5內部且配置成包圍第一發熱構造體8的複數個第二發熱構造體9、及控制第一加熱器15及第二加熱器16之開啟/關閉的控制部21，第一加熱器15熱容量比第二加熱器16熱容量更小，控制部21執行啟動控制，在啟動時將第一加熱器15及第二加熱器16設為開啟，在啟動完成時將第二加熱器16維持開啟並將第一加熱器15設為關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱利用系統</p>  
        <p type="p">2:配管路徑</p>  
        <p type="p">3:發熱裝置</p>  
        <p type="p">4:熱利用裝置</p>  
        <p type="p">5:密閉容器</p>  
        <p type="p">6:氫氣槽</p>  
        <p type="p">7:真空泵</p>  
        <p type="p">8:第一發熱構造體</p>  
        <p type="p">9:第二發熱構造體</p>  
        <p type="p">10:導入管</p>  
        <p type="p">11:排氣管</p>  
        <p type="p">12:供給閥</p>  
        <p type="p">13:排氣閥</p>  
        <p type="p">14:發熱體</p>  
        <p type="p">14a:發熱體</p>  
        <p type="p">14b:發熱體</p>  
        <p type="p">15:第一加熱器</p>  
        <p type="p">16:第二加熱器</p>  
        <p type="p">17:溫度感測器</p>  
        <p type="p">17a:溫度感測器</p>  
        <p type="p">17b:溫度感測器</p>  
        <p type="p">18a:導電線</p>  
        <p type="p">18b:導電線</p>  
        <p type="p">19:電源</p>  
        <p type="p">20a:電極部</p>  
        <p type="p">20b:電極部</p>  
        <p type="p">21:控制部</p>  
        <p type="p">41:保護容器</p>  
        <p type="p">41a:流入口</p>  
        <p type="p">41b:流出口</p>  
        <p type="p">42:發電單元</p>  
        <p type="p">42a:燃氣渦輪機</p>  
        <p type="p">42b:發電機</p>  
        <p type="p">43:壓力泵</p>  
        <p type="p">44:流量控制閥</p>  
        <p type="p">S:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1607" publication-number="202621007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於輪內外轉子電馬達的密封組合件</chinese-title>  
        <english-title>SEAL ASSEMBLIES FOR IN-WHEEL OUTER ROTOR ELECTRIC MOTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H02K3/46</main-classification>  
        <further-classification edition="200601120260211B">H02K5/04</further-classification>  
        <further-classification edition="200601120260211B">H02K5/10</further-classification>  
        <further-classification edition="200601120260211B">H02K5/124</further-classification>  
        <further-classification edition="200601120260211B">H02K9/197</further-classification>  
        <further-classification edition="200601120260211B">F04B17/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛沙尼亞商多納實驗開發公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONUT LAB DEVELOPMENT OU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯特　葛瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTS, GARETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝斯特　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEST, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮波　維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIIPPO, VILLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西瑪　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEEMA, GEORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了用於輪內外轉子電馬達的密封組合件。一種範例輪內電馬達包括定子、轉子、軸承和端頭密封件。定子包括密封板。轉子外接定子。轉子組態以相對定子轉動。軸承位在轉子和定子之間。端頭密封件從軸承徑向地向外定位。端頭密封件包括基底和撓性端頭。基底耦合至轉子。端頭密封件從基底延伸且可相對基底移動，撓性端頭組態以當轉子未相對定子轉動時接合密封板。撓性端頭更組態以當轉子正相對定子轉動時與該密封板隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Seal assemblies for in-wheel outer rotor electric motors are disclosed. An example in-wheel electric motor includes a stator, a rotor, a bearing, and a lip seal. The stator includes a seal plate. The rotor circumscribes the stator. The rotor is configured to rotate relative to the stator. The bearing is located between the rotor and the stator. The lip seal is located radially outward from the bearing. The lip seal includes a base and a flexible lip. The base is coupled to the rotor. The flexible lip extends from and is movable relative to the base, the flexible lip is configured to engage the seal plate when the rotor is not rotating relative to the stator. The flexible lip is further configured to be spaced apart from the seal plate when the rotor is rotating relative to the stator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:電馬達</p>  
        <p type="p">402:密封組合件</p>  
        <p type="p">404:定子</p>  
        <p type="p">406:轉子</p>  
        <p type="p">408:密封板</p>  
        <p type="p">410:密封板</p>  
        <p type="p">412:軸承</p>  
        <p type="p">414:軸承</p>  
        <p type="p">416:端頭密封件</p>  
        <p type="p">418:端頭密封件</p>  
        <p type="p">502:通道</p>  
        <p type="p">504:通道</p>  
        <p type="p">506:軸承封</p>  
        <p type="p">508:軸承封</p>  
        <p type="p">510:基底</p>  
        <p type="p">512:撓性端頭</p>  
        <p type="p">514:空隙</p>  
        <p type="p">516:空隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1608" publication-number="202621294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於量子應用之矽層供體結構的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A SILICON LAYER DONOR STRUCTURE FOR THE PURPOSE OF QUANTUM APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/83</main-classification>  
        <further-classification edition="202201120260223B">G06N10/40</further-classification>  
        <further-classification edition="202601120260223B">H10P14/20</further-classification>  
        <further-classification edition="202601120260223B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商索泰克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOITEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　璧顏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, BICH-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬勒維　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALEVILLE, CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅達尼未　西薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODA NEVE, CESAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝斯納德　季堯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BESNARD, GUILLAUME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩凡特　佛羅倫絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERVANT, FLORENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希卡維　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIKAVYY, ANDRIY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製造具有一矽層(28Si&lt;sub&gt;SLay&lt;/sub&gt;)之一供體結構(DonStruct)之方法(100)，該矽層由至少99.92%的矽同位素矽28組成，該方法包括以下步驟：在一第一基板(Si_Waf&lt;sub&gt;SLay&lt;/sub&gt;)上形成(130&lt;sub&gt;SLay&lt;/sub&gt;)該矽層(28Si&lt;sub&gt;SLay&lt;/sub&gt;)，從而形成一種子結構(SLay)；在一第二基板(Si_Waf&lt;sub&gt;Car&lt;/sub&gt;)上形成(120&lt;sub&gt;Car&lt;/sub&gt;)一氮化矽阻擋層(SiN)，從而形成一載體結構(Car)；在該矽層(28Si&lt;sub&gt;SLay&lt;/sub&gt;)及該氮化矽阻擋層(SiN)當中至少一者上，形成(140&lt;sub&gt;SLay&lt;/sub&gt;)一氧化矽層(28SiO2)；接合(160)該種子結構(SLay)及該載體結構(Car)，使該第二基板(Si_Waf&lt;sub&gt;Car&lt;/sub&gt;)、該氮化矽阻擋層(SiN)、該氧化矽層(28SiO2)、該矽層(28Si&lt;sub&gt;SLay&lt;/sub&gt;)及該第一基板(Si_Waf&lt;sub&gt;SLay&lt;/sub&gt;)以此順序堆疊；及清理(170, 180)該矽層(28Si&lt;sub&gt;SLay&lt;/sub&gt;)相反於該第二基板(Si_Waf&lt;sub&gt;Car&lt;/sub&gt;)那側的一表面，從而形成該供體結構(DonStruct)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method (100) for manufacturing a donor structure (DonStruct) capable of providing a silicon layer (28Si&lt;sub&gt;SLay&lt;/sub&gt;) consisting of at least 99.92% silicon isotope &lt;sup&gt;28&lt;/sup&gt;Si, the method comprising the steps of: forming (130&lt;sub&gt;SLay&lt;/sub&gt;) the silicon layer (28Si&lt;sub&gt;SLay&lt;/sub&gt;) on a first substrate (Si_Waf&lt;sub&gt;SLay&lt;/sub&gt;), thus forming a seed structure (SLay); forming (120&lt;sub&gt;Car&lt;/sub&gt;) a silicon nitride layer (SiN) on a second substrate (Si_Waf&lt;sub&gt;Car&lt;/sub&gt;), thus forming a carrier structure (Car); forming (140&lt;sub&gt;SLay&lt;/sub&gt;) a silicon oxide layer (28SiO2) on at least one of the silicon layer (28Si&lt;sub&gt;SLay&lt;/sub&gt;) and the silicon nitride layer (SiN); assembling (160) the seed structure (SLay) and the carrier structure (Car) so that the second substrate (Si_Waf&lt;sub&gt;Car&lt;/sub&gt;), the silicon nitride layer (SiN), the oxide layer (28SiO2), the silicon layer (28Si&lt;sub&gt;SLay&lt;/sub&gt;) and the first substrate (Si_Waf&lt;sub&gt;SLay&lt;/sub&gt;) are stacked in this order; and clearing (170, 180) a surface of the silicon layer (28Si&lt;sub&gt;SLay&lt;/sub&gt;) located opposite the second substrate (Si_Waf&lt;sub&gt;Car&lt;/sub&gt;), thus forming the donor structure (DonStruct).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110&lt;sub&gt;Car&lt;/sub&gt;,110&lt;sub&gt;SLay&lt;/sub&gt;,120&lt;sub&gt;Car&lt;/sub&gt;,120&lt;sub&gt;SLay&lt;/sub&gt;,130&lt;sub&gt;SLay&lt;/sub&gt;,140&lt;sub&gt;SLay&lt;/sub&gt;,150&lt;sub&gt;SLay&lt;/sub&gt;,160~190,195:步驟</p>  
        <p type="p">28SiO2:氧化矽層</p>  
        <p type="p">28Si&lt;sub&gt;Slay&lt;/sub&gt;:種子層</p>  
        <p type="p">DonStruct:供體結構</p>  
        <p type="p">Etch(SiGe):選擇性矽鍺蝕刻</p>  
        <p type="p">Etch(Si_Waf&lt;sub&gt;SLay-1&lt;/sub&gt;):選擇性矽蝕刻</p>  
        <p type="p">Fgrl:弱化平面</p>  
        <p type="p">Fract:斷裂</p>  
        <p type="p">Set:接合件</p>  
        <p type="p">SiGe:矽鍺合金層</p>  
        <p type="p">SiN:氮化矽阻擋層</p>  
        <p type="p">Si_Waf&lt;sub&gt;Car&lt;/sub&gt;:載體基板</p>  
        <p type="p">Si_Waf&lt;sub&gt;Slay&lt;/sub&gt;:種子基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1609" publication-number="202621140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139711</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於能力精簡特徵的前向相容性傳訊</chinese-title>  
        <english-title>FORWARD COMPATIBILITY SIGNALING FOR REDUCED CAPABILITY FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W8/24</main-classification>  
        <further-classification edition="200901120260202B">H04W8/22</further-classification>  
        <further-classification edition="201801120260202B">H04W76/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北添真人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZOE, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之某些態樣提供用於無線通訊之技術。一實例方法包括接收與一使用者設備(UE)相關聯之能力資訊，該能力資訊包括具有複數個位元位置之一欄位，各位元位置對應於複數個特徵中的一各別特徵，其中該複數個特徵中的一第一組特徵可由該網路實體支援，且一第二組特徵不可由該網路實體支援；及根據該能力資訊通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure provide techniques for wireless communications. An example method includes receiving capability information associated with a user equipment (UE), the capability information including a field with a plurality of bit positions, each bit position corresponding to a respective feature of a plurality of features, wherein a first set of features of the plurality of features are supportable by the network entity and a second set of features are unsupportable by the network entity; and communicating in accordance with the capability information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:程序流程</p>  
        <p type="p">602:網路實體</p>  
        <p type="p">604:使用者設備(UE)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1610" publication-number="202620526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139738</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制光之傳遞率之裝置</chinese-title>  
        <english-title>DEVICE FOR CONTROLLING TRANSMITTANCE OF LIGHT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260216B">G02F1/1343</main-classification>  
        <further-classification edition="200601120260216B">G02B27/09</further-classification>  
        <further-classification edition="200601120260216B">G02F1/133</further-classification>  
        <further-classification edition="200601120260216B">G02B5/30</further-classification>  
        <further-classification edition="200601120260216B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商弗萊克英納寶技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉摩斯寇格　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIMMERSKOG, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈汀　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDING, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱恩　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAIN, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種光學裝置堆疊，其包含：一液晶LC層，其定位於一四分之一波片與一電極層之間，該光學堆疊經摺疊，使得該四分之一波片之一第一部分平行於該四分之一波片之一第二部分，該等平行部分組合地形成一半波片，該LC層之一第一部分平行於該LC層之一第二部分，該LC層之該第一部分及該第二部分界定第一及第二胞元，且該電極層之一第一部分平行於該電極層之一第二部分，該電極層之該第一部分及該第二部分分別與該LC層之該第一部分及該第二部分相關聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is disclosed an optical device stack comprising: a liquid crystal, LC, layer positioned between a quarter wave plate and an electrode layer, the optical stack being folded such that a first portion of the quarter wave plate is parallel to a second portion of the quarter wave plate, in combination the parallel portions forming a half wave plate, a first portion of the LC layer is parallel to a second portion of the LC layer, the first and second portions of the LC layer defining first and second cells, and a first portion of the electrode layer is parallel to a second portion of the electrode layer, the first and second portions of the electrode layer respectively being associated with the first and second portions of the LC layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一胞元，單胞元配置，第一單胞元配置，胞元配置</p>  
        <p type="p">101,103:箭頭</p>  
        <p type="p">102:第一基體層，基體，外基體</p>  
        <p type="p">104,204:液晶層，LC層</p>  
        <p type="p">106:電極層，第一電極層</p>  
        <p type="p">108:基體層，第二基體層，基體，外基體</p>  
        <p type="p">130:雙胞元配置</p>  
        <p type="p">150:層</p>  
        <p type="p">200:第二單胞元配置，胞元配置，第二胞元</p>  
        <p type="p">202:第一基體層，基體層</p>  
        <p type="p">206:電極層，第二電極層</p>  
        <p type="p">208:第二基體層</p>  
        <p type="p">510:單一平面層，延性塑膠基體，平面基體層，電極層，單一電極層，圖案化電極層，層，第一線性電極，第一複數個平行線性電極，第一複數個線性電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1611" publication-number="202621276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有使用電洞注入器/收集​​器之低臨界電壓偏移的氮化鎵(GaN)高電子遷移率電晶體(HEMT)</chinese-title>  
        <english-title>GAN HEMT WITH LOW THRESHOLD VOLTAGE SHIFT USING A HOLE INJECTOR/COLLECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260204B">H10D30/47</main-classification>  
        <further-classification edition="202501120260204B">H10D62/824</further-classification>  
        <further-classification edition="202501120260204B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高效電源轉換公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EFFICIENT POWER CONVERSION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃斯特拉達　維克托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESTRADA, VICTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瑞特瑪特　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRITTMATTER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹　建軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, JIANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢曲　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEACH, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏瑪　穆斯坎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, MUSKAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里道　亞力山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIDOW, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氮化鎵(GaN)高電子遷移率電晶體(HEMT)，其帶有連至一單一相連p-GaN閘極材料之多個金屬觸點。該電晶體之電壓臨界電壓(Vth)係透過電晶體閘極之p-GaN材料中之電洞注入及移除來控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Gallium Nitride (GaN) High Electron Mobility Transistor (HEMT) with multiple metal contacts to a single contiguous p-GaN gate material. The voltage threshold voltage (Vth) of the transistor is controlled through hole injection and removal in the p-GaN material of the transistor gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氮化鎵(GaN)高電子遷移率電晶體(HEMT)裝置；裝置；GaN裝置</p>  
        <p type="p">25:GaN材料層；GaN層；GaN材料</p>  
        <p type="p">26:電洞注入器/收集器區段；電洞注入器/收集器GaN材料區段；電洞注入器/收集器GaN材料</p>  
        <p type="p">28:橋接器區段；GaN電洞注入器/收集器區段；電洞注入器/收集器區段；GaN橋接器</p>  
        <p type="p">30:閘極；閘極電極；閘極金屬；閘極線</p>  
        <p type="p">31:閘極材料區段；GaN閘極材料區段；閘極GaN材料區段；閘極區段；閘極GaN材料</p>  
        <p type="p">32:電洞注入器/收集器電極金屬；電洞注入器/收集器電極；電洞注入器/收集器電極觸點金屬；電洞注入器/收集器電極金屬觸點；電洞注入器/移除器觸點；電洞注入觸點；金屬觸點</p>  
        <p type="p">34:露出區段；電洞注入器/收集器區段；GaN露出材料；GaN閘極材料；區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1612" publication-number="202620595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>上下電控制電路以及多電源系統</chinese-title>  
        <english-title>POWER-ON/POWER-OFF CONTROL CIRCUIT AND MULTI-POWER SUPPLY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260109B">G06F1/26</main-classification>  
        <further-classification edition="200601120260109B">G06F1/24</further-classification>  
        <further-classification edition="200601120260109B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商比亞迪股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYD COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓莎莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SHASHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋相榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, XIANGRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奇峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種上下電控制電路以及多電源系統，涉及電源控制領域，其中，電路包括第一控制子電路，第一控制子電路的輸入端與第一電源連接，第一控制子電路的輸出端與用電模組連接，第一控制子電路的電源端與第二電源連接；第一控制子電路在第二電源上電的情況下導通工作，第一控制子電路用於基於第一電源的輸出電壓，控制用電模組工作。透過根據第一電源的電壓大小生成重置信號，基於第二電源是否上電決定重置信號能否傳輸至用電模組，在用電模組接收到重置信號時則可知道第一電源的上下電狀態，實現對第一電源後上電和先下電時，對用電模組的控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a power-on/power-off control circuit and a multi-power supply system, and relates to the field of power supply control. The circuit includes a first control subcircuit, where an input terminal of the first control subcircuit is connected to a first power supply, an output terminal of the first control subcircuit is connected to a power-consuming module, and a power-supply terminal of the first control subcircuit is connected to a second power supply; where the first control subcircuit is turned on and operates when the second power supply is powered on, and the first control subcircuit is configured to control operation of the power-consuming module based on output voltage of the first power supply. The first control subcircuit is used to control the operation of the power-consuming module based on the output voltage of the first power supply. By generating a reset signal according to the voltage of the first power supply, and determining whether the reset signal can be transmitted to the power-consuming module based on a determination of whether the second power supply is powered on, it is possible to determine the power-on/power-off status of the first power supply when the power-consuming module receives the reset signal, to realize the control of the power-consuming module in a case that the first power supply is powered on later or powered off first.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一電源</p>  
        <p type="p">102:第二電源</p>  
        <p type="p">201:第一控制子電路</p>  
        <p type="p">301:用電模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1613" publication-number="202620514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種裸眼式立體顯示裝置</chinese-title>  
        <english-title>AN APPARATUS FOR AUTOSTEREOSCOPIC DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251212B">G02B30/26</main-classification>  
        <further-classification edition="200601120251212B">G02B27/02</further-classification>  
        <further-classification edition="201601120251212B">G09G3/3225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>騰騏科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOYVISION TECHNOLOGY.,CO LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡正中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHENG CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭漢遜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAN HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裸眼式立體顯示裝置，包含：一個以列與欄方式排列之顯示像素陣列；一個由多個彼此平行延伸並覆蓋於所述顯示像素之上的細長光學元件陣列，其中該光學元件相對於顯示像素欄以一定角度傾斜。對於任一顯示像素，其最佳化亮度係根據該像素與用以分隔相鄰圖像之邊界最近端的距離來決定。透過調整像素亮度，本裝置可有效降低圖像串擾，從而提升裸眼立體顯示的清晰度與畫質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An autostereoscopic display apparatus, comprising: an array of display pixels arranged in rows and columns; an array of elongated optical elements extending parallel to one another and overlying the display pixels, wherein the optical elements are slanted at an angle relative to the columns of display pixels; for any given display pixel, an optimized brightness is determined based on the distance between the pixel and the nearest end of a boundary separating adjacent images. By adjusting pixel brightness, the apparatus effectively reduces image crosstalk, thereby enhancing the clarity and quality of autostereoscopic displays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">X:列方向</p>  
        <p type="p">d:距離</p>  
        <p type="p">6:像素</p>  
        <p type="p">7:邊界</p>  
        <p type="p">8:液晶透鏡</p>  
        <p type="p">81:透鏡單元</p>  
        <p type="p">9:顯示面板</p>  
        <p type="p">100:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1614" publication-number="202620409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學計量系統及其樣品檢驗方法</chinese-title>  
        <english-title>OPTICAL METROLOGY SYSTEM AND METHOD OF SAMPLE INSPECTION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01N21/25</main-classification>  
        <further-classification edition="200601120260211B">G01J3/12</further-classification>  
        <further-classification edition="200601120260211B">G01J3/447</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商諾威股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVA LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙菲爾　德羅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAFIR, DROR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧倫　由納坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OREN, YONATAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了光學計量和檢驗的系統和方法。超連續雷射（SCL）源生成SCL輸出，該SCL輸出由脈衝展寬器調節以形成光譜色散平面。光譜平衡濾波器位於光譜色散平面中，以提供平衡的寬頻輸出，隨後，該平衡的寬頻輸出藉由脈衝展寬器進行時間色散，以形成時間色散的SCL輸出。時間色散的SCL輸出沿法向和/或斜路徑被朝向樣品表面引導，並且來自該樣品表面的反射的輻射被引導至一個或多個光譜儀以進行測量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and methods of optical metrology and inspection are provided. A supercontinuum laser (SCL) source generates an SCL output that is conditioned by a pulse stretcher to form a spectrally dispersed plane. A spectral balancing filter is positioned in the spectrally dispersed plane to provide a balanced broadband output, which is then temporally dispersed by the pulse stretcher to form a temporally dispersed SCL output. The temporally dispersed SCL output is directed along normal and/or oblique paths toward a sample surface, and reflected radiation from the sample surface is directed to one or more spectrometers for measurement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學計量系統</p>  
        <p type="p">20:樣品</p>  
        <p type="p">30:超連續雷射(SCL)源</p>  
        <p type="p">32:脈衝展寬器</p>  
        <p type="p">34:寬頻半波片</p>  
        <p type="p">36:波前整形濾波器</p>  
        <p type="p">40:控制單元</p>  
        <p type="p">100、110:光譜儀</p>  
        <p type="p">120:監測光譜儀</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1615" publication-number="202621107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種裸眼式顯示裝置及系統</chinese-title>  
        <english-title>AN AUTOSTEREOSCOPIC DISPLAY APPARATUS AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251205B">H04N13/125</main-classification>  
        <further-classification edition="201801120251205B">H04N13/133</further-classification>  
        <further-classification edition="201801120251205B">H04N13/305</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>騰騏科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOYVISION TECHNOLOGY.,CO LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡正中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHENG CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭漢遜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAN HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裸眼式顯示裝置及系統，包含：一個以列與欄方式排列之顯示像素陣列；一個由多個彼此平行延伸並覆蓋於所述顯示像素之上的細長光學元件陣列，其中該光學元件相對於顯示像素欄以一定角度傾斜。對於任一顯示像素，其最佳化亮度係根據該像素與用以分隔相鄰圖像之邊界最近端的距離來決定。透過調整像素亮度，本裝置可有效降低圖像串擾，從而提升裸眼立體顯示的清晰度與畫質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An autostereoscopic display apparatus and system, comprising: an array of display pixels arranged in rows and columns; an array of elongated optical elements extending parallel to one another and overlying the display pixels, wherein the optical elements are slanted at an angle relative to the columns of display pixels; for any given display pixel, an optimized brightness is determined based on the distance between the pixel and the nearest end of a boundary separating adjacent images. By adjusting pixel brightness, the apparatus effectively reduces image crosstalk, thereby enhancing the clarity and quality of autostereoscopic displays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">X:列方向</p>  
        <p type="p">d:距離</p>  
        <p type="p">6:像素</p>  
        <p type="p">7:邊界</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1616" publication-number="202620692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在神經網路處理單元中之混合精度介面</chinese-title>  
        <english-title>HYBRID PRECISION INTERFACE IN NEURAL NETWORK PROCESSING UNITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G06N3/06</main-classification>  
        <further-classification edition="202301120260205B">G06N3/04</further-classification>  
        <further-classification edition="200601120260205B">G06F17/16</further-classification>  
        <further-classification edition="201801120260205B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商墨子國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昶旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴恩勖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, IAN ENXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於針對神經網路運算最佳化之一處理實體(PE)陣列內之一PE之一組構介面之設備及方法。該組構介面包含一通道擴展電路及一通道壓縮電路。該通道擴展電路經組態以接收來自另一PE之第一資料，擴展該第一資料之通道維度以產生具有與一相關聯記憶體之最小資料粒度對準之一增加維度之擴展資料，及將該擴展資料儲存於該記憶體中。相反，該通道壓縮電路經組態以自該記憶體提取第二資料，壓縮該第二資料之通道維度以獲得具有一減小維度之壓縮資料，及自該PE輸出該壓縮資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus and method are disclosed for a fabric interface of a processing entity (PE) within a PE array optimized for neural network computations. The fabric interface includes a channel extension circuit and a channel compression circuit. The channel extension circuit is configured to receive first data from another PE, extend the channel dimension of the first data to produce extended data with an increased dimension that aligns with the minimum data granularity of an associated memory, and store the extended data in the memory. Conversely, the channel compression circuit is configured to fetch second data from the memory, compress the channel dimension of the second data to obtain compressed data with a reduced dimension, and output the compressed data from the PE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:組構介面</p>  
        <p type="p">310:共用記憶體</p>  
        <p type="p">320:張量擴展電路</p>  
        <p type="p">322:通道擴展電路</p>  
        <p type="p">324:位元深度擴展查找表(LUT)電路</p>  
        <p type="p">330:張量壓縮電路</p>  
        <p type="p">332:通道壓縮電路</p>  
        <p type="p">334:位元深度壓縮LUT電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1617" publication-number="202620693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單軸稀疏張量處理電路</chinese-title>  
        <english-title>SINGLE-AXIS SPARSE TENSOR PROCESSING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G06N3/06</main-classification>  
        <further-classification edition="202301120260205B">G06N3/0495</further-classification>  
        <further-classification edition="200601120260205B">G06F17/16</further-classification>  
        <further-classification edition="201801120260205B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商墨子國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昶旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王若珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種張量處理電路。該電路包含用於儲存一第一張量之一第一張量快取記憶體及用於儲存一第二張量之一第二張量快取記憶體，兩者用於神經網路操作中。一張量掩碼快取記憶體儲存對應於該第二張量之一張量掩碼以促進稀疏化。耦合至該第二張量快取記憶體及張量掩碼快取記憶體之一收集電路基於該張量掩碼將該第二張量變換成一濃縮張量以降低運算複雜性。該電路進一步包含一乘法器陣列，其接收來自該第一張量快取記憶體之資料及該濃縮第二張量以產生一中間張量。一累加電路對該中間張量及自一累加快取記憶體擷取之另一張量執行求和運算以產生神經網路運算之一輸出張量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tensor processing circuit is disclosed. The circuit includes a first tensor cache for storing a first tensor and a second tensor cache for storing a second tensor, both used in the neural network operations. A tensor mask cache stores a tensor mask corresponding to the second tensor, facilitating sparsification. A gather circuit, coupled to the second tensor cache and tensor mask cache, transforms the second tensor into a condensed tensor based on the tensor mask, reducing computational complexity. The circuit further includes a multiplier array that receives data from the first tensor cache and the condensed second tensor, producing an intermediate tensor. An accumulation circuit performs summation operations on the intermediate tensor and another tensor retrieved from an accumulate cache, generating an output tensor of the neural network computation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:控制電路</p>  
        <p type="p">150:運算模組</p>  
        <p type="p">151:第一張量L1快取記憶體</p>  
        <p type="p">153:第二張量L1快取記憶體</p>  
        <p type="p">155:張量掩碼L1快取記憶體</p>  
        <p type="p">160:可重組態收集電路</p>  
        <p type="p">161A至161C:轉換電路</p>  
        <p type="p">170:乘法器陣列</p>  
        <p type="p">180:加法器樹模組</p>  
        <p type="p">184:縮放乘法器模組</p>  
        <p type="p">186:縮放參數快取記憶體</p>  
        <p type="p">188:累加快取記憶體</p>  
        <p type="p">190:累加電路</p>  
        <p type="p">194:共用記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1618" publication-number="202620179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粒料之保管方法及粒料之保管設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260216B">C10L9/10</main-classification>  
        <further-classification edition="200601120260216B">C10L5/44</further-classification>  
        <further-classification edition="200601120260216B">A62C3/04</further-classification>  
        <further-classification edition="200601120260216B">B65G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細谷郁雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOYA, IKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種粒料之保管方法，具有以下步驟：堆積物形成步驟，係堆疊源自生質之粒料(10)而形成粒料堆積物(100b)；以及，抑制材料配置步驟，係於所形成之前述粒料堆積物(100b)及前述粒料堆疊當中之堆積物(100a)中之至少任一者之表面配置抑制水蒸氣吸附之材料(例如塗覆粒料(20))；且，前述抑制水蒸氣吸附之材料係抑制從前述粒料堆積物(100b)產生之水蒸氣吸附的材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:保管設備</p>  
        <p type="p">10:粒料</p>  
        <p type="p">20:塗覆粒料</p>  
        <p type="p">60A:第1堆料機</p>  
        <p type="p">60B:第2堆料機</p>  
        <p type="p">61A,61B:本體部</p>  
        <p type="p">62A,62B:供給部</p>  
        <p type="p">100:粒料堆積物</p>  
        <p type="p">100a:第1堆積物</p>  
        <p type="p">100b:第2堆積物</p>  
        <p type="p">DR2:粒料乾燥區域</p>  
        <p type="p">WR2:粒料濕潤區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1619" publication-number="202621378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高溫氣體供應型製程系統</chinese-title>  
        <english-title>A HOT GAS SUPPLYING TYPE OF A PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="202601120260223B">H10P72/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商維人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔佑熒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, WOO HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安重賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JOONG HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭成均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SUNG KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種高溫氣體供應型製程系統。高溫氣體供應型製程系統包括：噴淋頭（12），與靜電卡盤（13）面對設置；擋板（14），沿噴淋頭（12）的邊緣部分形成；驅動單元（16a、16b），使邊緣環（15）上下移動，以使得基板（W）上下移動；以及高溫氣體供應模組（GS），向噴淋頭（12）的下側供應高溫氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:腔室</p>  
        <p type="p">12:噴淋頭</p>  
        <p type="p">13:ESC</p>  
        <p type="p">14:擋板</p>  
        <p type="p">15:邊緣環</p>  
        <p type="p">16a、16b:驅動單元</p>  
        <p type="p">17:高溫槍</p>  
        <p type="p">18:氣體管線</p>  
        <p type="p">19_1至19_K:噴射孔</p>  
        <p type="p">W:基板</p>  
        <p type="p">GS:高溫氣體供應模組</p>  
        <p type="p">LID:蓋</p>  
        <p type="p">RPS:電漿源</p>  
        <p type="p">LM1、LM2:升降部件</p>  
        <p type="p">MFC:質量流量控制器</p>  
        <p type="p">MN:壓力計</p>  
        <p type="p">TM:溫度計</p>  
        <p type="p">PD:排出管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1620" publication-number="202620169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱性油脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">C09K5/10</main-classification>  
        <further-classification edition="200601120260206B">C10M169/04</further-classification>  
        <further-classification edition="200601120260206B">C04B35/581</further-classification>  
        <further-classification edition="200601120260206B">C08L91/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商引能仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENEOS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田　伊木悠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA IKI, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒澤修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROSAWA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗原功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIHARA, ISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井一泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, KAZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之導熱性油脂組合物係含有基礎油(A)及導熱性粒子(B)者，且上述導熱性粒子(B)之含量相對於上述導熱性油脂組合物總量為79質量%以上且未達92質量%，上述導熱性粒子(B)包含平均粒徑D50未達30 μm之氮化鋁(B1)、及平均粒徑D50為30 μm以上之氮化鋁(B2)，上述氮化鋁(B1)之含量與上述氮化鋁(B2)之含量之質量比((B2)/(B1))為1～3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1621" publication-number="202620395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空度閾值的確定方法、裝置、設備、介質及產品</chinese-title>  
        <english-title>METHOD, APPARATUS, DEVICE, MEDIUM, AND PRODUCT FOR DETERMINING VACUUM DEGREE THRESHOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">G01L21/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東方晶源微電子科技(北京)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGFANG JINGYUAN ELECTRON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XI, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁晨鍇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慶濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QING-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張洪彪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONG-BIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史晉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, JIN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓春營</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, CHUN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種真空度閾值的確定方法、裝置、設備、介質及產品，涉及電子束量測技術領域，該真空度閾值的確定方法包括：在帶電粒子束成像裝置的傳輸腔傳入目標晶圓後，對傳輸腔執行抽真空操作；獲取傳輸腔在執行抽真空操作的過程中多個時刻的真空度；從資料庫的各第一真空度曲線中查找與多個時刻的真空度相匹配的目標第一真空度曲線，資料庫中包括多個第一真空度曲線以及對應的真空度穩定值，各第一真空度曲線分別用於表徵傳輸腔在傳入不同放氣量的晶圓後真空度的變化趨勢；將目標第一真空度曲線對應的真空度穩定值確定為目標晶圓對應的傳輸腔的目標真空度閾值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method, apparatus, device, medium, and product for determining a vacuum degree threshold, relating to the technical field of electron beam measurement. The method for determining the vacuum degree threshold includes: after a target wafer is transferred into the transmission chamber of a charged particle beam imaging device, performing a vacuum-pumping operation on the transmission chamber; acquiring the vacuum degree of the transmission chamber at a plurality of time points during the vacuum-pumping operation; searching a database for a target first vacuum degree curve that matches the vacuum degrees at these time points from among a plurality of first vacuum degree curves stored in the database, wherein the database includes the first vacuum degree curves and the vacuum degree stabilization values corresponding thereto, with each first vacuum degree curve representing the trend of vacuum degree changes in the transmission chamber after transferring wafers with different outgassing levels; determining the vacuum degree stabilization value corresponding to the target first vacuum degree curve as the target vacuum degree threshold of the transmission chamber corresponding to the target wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S104:步驟流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1622" publication-number="202621248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多晶矽記憶體結構及其製造方法</chinese-title>  
        <english-title>POLYSILICON MEMORY STRUCTURE AND MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202501120260223B">H10D84/03</further-classification>  
        <further-classification edition="202601120260223B">H10P14/24</further-classification>  
        <further-classification edition="202601120260223B">H10P32/10</further-classification>  
        <further-classification edition="202601120260223B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭柏儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, PO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種多晶矽記憶體結構，其包含一矽基材層、一二氧化矽層、一多晶矽記憶通道、一介電層及一導電層。二氧化矽層層疊於矽基材層上，二氧化矽層遠離矽基材層之部分表面設有一通道設置區；多晶矽記憶通道設於通道設置區，多晶矽記憶通道內具有一部分空乏浮接基體儲存區域；介電層層疊於二氧化矽層與多晶矽記憶通道上，並包覆於多晶矽記憶通道之周緣；導電層層疊於介電層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polysilicon memory structure, which includes a silicon substrate layer, a silicon dioxide layer, a polysilicon memory channel, a dielectric layer, and a conductive layer. The silicon dioxide layer is stacked on the silicon substrate layer, and a channel setting area is formed on the surface of the silicon dioxide layer that is away from the silicon substrate layer. The polysilicon memory channel is set in the channel setting area and has a partially depleted floating body storage region. The dielectric layer is stacked on the silicon dioxide layer and the polysilicon memory channel, covering the periphery of the polysilicon memory channel. The conductive layer is stacked on the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多晶矽記憶體結構</p>  
        <p type="p">10:矽基材層</p>  
        <p type="p">20:二氧化矽層</p>  
        <p type="p">30:多晶矽記憶通道</p>  
        <p type="p">31:部分空乏浮接基體儲存區域</p>  
        <p type="p">40:介電層</p>  
        <p type="p">50:導電層</p>  
        <p type="p">70:氮化矽層</p>  
        <p type="p">80:第一四乙氧基矽烷層</p>  
        <p type="p">90:第二四乙氧基矽烷層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1623" publication-number="202619672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探測組件及清潔設備</chinese-title>  
        <english-title>DETECTION ASSEMBLY AND CLEANING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">A47L11/40</main-classification>  
        <further-classification edition="202401120260210B">G05D1/617</further-classification>  
        <further-classification edition="200601120260210B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兆达</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHAODA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赵岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種探測組件及清潔設備，探測組件包括探測裝置、安裝件、彈性件和感應裝置。探測裝置包括移動部。移動部能夠相對於安裝件沿第一方向移動。感應裝置設有感應區域，移動部與安裝件中的一者設有感應裝置，另一者具有觸發區域，感應區域與觸發區域沿第一方向相對。彈性件位於移動部與安裝件之間且能夠沿第一方向彈性伸縮。探測組件包括觸發狀態和待機狀態；在待機狀態，觸發區域與感應區域沿第一方向間隔；在觸發狀態，觸發區域與感應區域沿第一方向抵接，彈性件處於拉伸狀態或者壓縮狀態。本揭露的探測組件，通過移動部與安裝件的相對運動以觸發感應裝置實現判斷探測裝置是否受到碰撞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a detection assembly and a cleaning device. The detection assembly includes a detection device, an installation member, an elastic member, and an inductive device. The detection device includes a moving part. The moving part is capable of moving along a first direction relative to the installation member. The inductive device is provided with an inductive area. One of the moving part and the installation member is provided with the inductive device, and the other of the moving part and the installation member is provided with a trigger area. The inductive area is opposite to the trigger area along the first direction. The elastic member is located between the moving part and the installation member, and is capable of extending and compressing elastically along the first direction. The detection assembly includes a trigger state and a standby state. In the standby state, the trigger area is separated from the inductive area along the first direction. In the trigger state, the trigger area is in contact with the inductive area along the first direction, and the elastic member is in an extended state or a compressed state. In the detection assembly of the present disclosure, the relative movement between the moving part and the installation member triggers the inductive device to determine whether the detection device is collided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探測組件</p>  
        <p type="p">11:探測裝置</p>  
        <p type="p">12:安裝件</p>  
        <p type="p">111:罩殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1624" publication-number="202620792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在拆分渲染架構中之擴展實境（ＸＲ）往返延遲調整的方法</chinese-title>  
        <english-title>METHOD FOR XR ROUNDTRIP DELAY ADJUSTMENTS IN A SPLIT RENDERING ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260202B">G06T19/00</main-classification>  
        <further-classification edition="201101120260202B">G06T15/00</further-classification>  
        <further-classification edition="202201120260202B">H04L67/131</further-classification>  
        <further-classification edition="202201120260202B">H04L65/60</further-classification>  
        <further-classification edition="202201120260202B">H04L41/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商內數位ＣＥ專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫茲林　帕特里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRTZLIN, PATRICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方丹　盧瓦克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONTAINE, LOIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐諾　史帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONNO, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古杜馬蘇　斯里尼瓦斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUDUMASU, SRINIVAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費弗　達西耶　艾蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAIVRE D'ARCIER, ETIENNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱耶特　皮埃里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOUET, PIERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒列夫爾　西爾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LELIEVRE, SYLVAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩里亞德　法蘭賽斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERIARD, FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡頓　馬力歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUDON, MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法之一些實施例可包含：初始化一用戶端與一伺服器之間的一渲染工作階段；獲得關於一沉浸式場景之場景調整資訊；指示該伺服器使用該場景調整資訊執行該沉浸式場景之一第一部分之渲染；使用該場景調整資訊渲染該沉浸式場景之一第二部分；自該伺服器獲得一或多個緩衝圖框；處理該一或多個緩衝圖框以產生渲染資訊；及指示一XR執行時期裝置使用該渲染資訊組合及渲染一或多個圖框。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments of a method may include: initializing a rendering session between a client and a server; obtaining scene adjustment information regarding an immersive scene; instructing the server to perform rendering of a first portion of the immersive scene using the scene adjustment information; rendering a second portion of the immersive scene using the scene adjustment information; obtaining one or more buffer frames from the server; processing the one or more buffer frames to generate rendering information; and instructing an XR runtime device to compose and render one or more frames using the rendering information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:程序</p>  
        <p type="p">1202:SR-DCMTSI用戶端</p>  
        <p type="p">1204:IMS應用伺服器(IMS AS)</p>  
        <p type="p">1206:DCSF</p>  
        <p type="p">1208:媒體功能(MF)</p>  
        <p type="p">1210:步驟</p>  
        <p type="p">1212:步驟</p>  
        <p type="p">1214:步驟</p>  
        <p type="p">1216:步驟</p>  
        <p type="p">1218:步驟</p>  
        <p type="p">1220:步驟</p>  
        <p type="p">1222:步驟</p>  
        <p type="p">1224:步驟</p>  
        <p type="p">1226:步驟</p>  
        <p type="p">1228:步驟</p>  
        <p type="p">1230:步驟</p>  
        <p type="p">1232:步驟</p>  
        <p type="p">1234:步驟</p>  
        <p type="p">1236:步驟</p>  
        <p type="p">1238:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1625" publication-number="202620735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>診斷資訊的提示方法、診斷方法、診斷系統、程式、提示裝置及紙媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260206B">G06Q10/20</main-classification>  
        <further-classification edition="200601120260206B">G01B11/24</further-classification>  
        <further-classification edition="200601120260206B">G01B11/25</further-classification>  
        <further-classification edition="200601120260206B">G01N21/84</further-classification>  
        <further-classification edition="200601120260206B">G01M3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商華爾卡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALQUA, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本隆啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在此診斷資訊的提示方法中包含以下步驟：診斷資訊生成步驟，取得顯示診斷對象即零件的診斷面的狀態之診斷面資料，並生成包含異常處資訊之診斷資訊，前述異常處資訊是依據診斷面資料所求出之表示診斷面的異常處之資訊；及提示步驟，將在診斷資訊生成步驟中所生成之診斷資訊提示至資訊提示部。藉此，診斷零件的不良狀況，並以視覺上且感覺上的方式來提示該診斷結果等的診斷資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">26:3D掃描器</p>  
        <p type="p">28:終端裝置</p>  
        <p type="p">32:伺服器</p>  
        <p type="p">S101~S113:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1626" publication-number="202620572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260205B">G05D1/648</main-classification>  
        <further-classification edition="200601120260205B">A01K15/02</further-classification>  
        <further-classification edition="200601120260205B">B25J9/16</further-classification>  
        <further-classification edition="200601120260205B">A47L25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備，所述清潔設備的底盤上設有機械臂，所述機械臂遠離所述底盤的一端設有夾爪，用於夾取逗寵玩具，所述方法包括：響應於逗寵指令的觸發，控制所述機械臂的夾爪夾取逗寵玩具；在所述夾爪夾取逗寵玩具之後，控制所述底盤和/或所述機械臂執行逗寵動作。透過本揭露提供的技術方案能夠提升用戶體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:步驟</p>  
        <p type="p">120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1627" publication-number="202620865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於讀取及寫入操作的儲存電路系統</chinese-title>  
        <english-title>STORAGE CIRCUITRY FOR READ AND WRITE OPERATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251208B">G11C11/413</main-classification>  
        <further-classification edition="200601120251208B">G11C7/10</further-classification>  
        <further-classification edition="200601120251208B">G11C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉　凱達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLA, KEDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿加瓦爾　納文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, NAVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西索迪亞　拉吉夫庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SISODIA, RAJIV KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬克羅維　蘇尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR KROVI, SUNIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　阿布舍克庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, ABHISHEK KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬塔普利亞爾　蘇曼特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR THAPLIYAL, SUMANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">儲存電路系統裝置、系統、及方法包括：一位元單元陣列，其具有複數個位元單元，各位元單元可經由一位元線及字線存取，其中該位元單元陣列係在該儲存電路系統的一第一層處提供；一冗餘陣列，其與該位元單元陣列相關聯，該冗餘陣列具有複數個冗餘位元單元，各冗餘位元單元經由一冗餘位元線及冗餘字線存取，其中該位元單元陣列係在該儲存電路系統的一第二層處提供。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Storage circuitry devices, systems, and methods including a bitcell array having a plurality of bitcells, each bitcell accessible via a bitline and wordline, where the bitcell array is provided at a first layer of the storage circuitry; a redundant array associated with the bitcell array, the redundant array having a plurality of redundant bitcells, each redundant bitcell accessed via a redundant bitline and redundant wordline, where the bitcell array is provided at a second layer of the storage circuitry.&lt;u&gt;  &lt;/u&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:儲存電路系統</p>  
        <p type="p">102:控制邏輯</p>  
        <p type="p">104a,104b:字線選擇(WDX)電路系統</p>  
        <p type="p">106a,106b:冗餘列字線選擇(Rred)電路系統</p>  
        <p type="p">108a,108b:周邊或行選擇(Cmux)電路系統</p>  
        <p type="p">110a~110d:位元單元陣列</p>  
        <p type="p">112a~112d:冗餘陣列</p>  
        <p type="p">114b:第一側；側</p>  
        <p type="p">114c:第二側；側</p>  
        <p type="p">116a,116b:故障列位址(FRA)電路系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1628" publication-number="202621201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H05K1/03</main-classification>  
        <further-classification edition="200601120260211B">H05K3/46</further-classification>  
        <further-classification edition="200601120260211B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滝本顕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIMOTO, KENYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本郁哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, IKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建内翔馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATEUCHI, SHOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之配線電路基板1具備金屬支持層2、金屬層3、第1絕緣層4、及導體圖案5。導體圖案5具有與第1絕緣層4之一側表面S3接觸之第1面S11、及相對於第1面S11配置於第1絕緣層4之相反側之第2面S12。金屬層3之一側表面S3之明度L*為89.0以下，導體圖案5之第2面S12之亮度為155.0以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配線電路基板</p>  
        <p type="p">2:金屬支持層</p>  
        <p type="p">3:金屬層</p>  
        <p type="p">4:第1絕緣層(絕緣層之一例)</p>  
        <p type="p">5:導體圖案</p>  
        <p type="p">6:第2絕緣層</p>  
        <p type="p">31:導體層</p>  
        <p type="p">32:保護金屬層</p>  
        <p type="p">51:保護金屬層</p>  
        <p type="p">52:導體層</p>  
        <p type="p">53:被覆金屬層</p>  
        <p type="p">S1:金屬支持層之一側表面</p>  
        <p type="p">S2:金屬層之一側表面</p>  
        <p type="p">S3:第1絕緣層之一側表面</p>  
        <p type="p">S11:導體圖案之第1面</p>  
        <p type="p">S12:導體圖案之第2面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1629" publication-number="202619962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>釩酸鉍粒子的製造方法及釩酸鉍粒子，以及水分解用光觸媒薄片及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">C01B3/06</main-classification>  
        <further-classification edition="202101120260223B">C25B11/00</further-classification>  
        <further-classification edition="200601120260223B">C01G29/00</further-classification>  
        <further-classification edition="200601120260223B">C01G31/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木田貴久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDA, TAKAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤栞菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, KANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之目的在於提供可獲得光響應性的水分解反應之觸媒活性較以往之釩酸鉍粒子的製造方法還高的釩酸鉍粒子之單斜晶的釩酸鉍粒子之製造方法。本揭露提供一種釩酸鉍粒子的製造方法，其係製造釩酸鉍粒子的方法，其包含會引起使四方晶的釩酸鉍在水溶性醇之存在下變化成單斜晶的釩酸鉍之相變的步驟α。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1630" publication-number="202620862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title>MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G11C11/406</main-classification>  
        <further-classification edition="200601120260209B">G11C7/10</further-classification>  
        <further-classification edition="200601120260209B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHINAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金廣洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體系統包括：一記憶體裝置，其具有複數個排組，各排組包括複數個子排組；以及一記憶體控制器，其使用一啟動-再新命令或一啟動命令來存取該等排組中之列。該記憶體裝置管理回應於該啟動-再新命令而針對各子排組執行之隱藏再新操作的一數目，且基於隱藏再新操作之該數目來產生過度再新狀態資訊。該記憶體控制器根據該過度再新狀態資訊將該啟動-再新命令或該啟動命令傳輸至該記憶體裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system includes a memory device having a plurality of banks, each bank including a plurality of sub-banks, and a memory controller that accesses rows in the banks using either an activate-refresh command or an activate command. The memory device manages a number of hidden refresh operations performed for each sub-bank in response to the activate-refresh command and generates over-refresh state information based on the number of hidden refresh operations. The memory controller transmits the activate-refresh command or the activate command to the memory device according to the over-refresh state information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:記憶體系統</p>  
        <p type="p">100:記憶體控制器</p>  
        <p type="p">200:記憶體裝置</p>  
        <p type="p">310:記憶體胞元陣列</p>  
        <p type="p">ACT:啟動</p>  
        <p type="p">AHR:用隱藏再新啟動</p>  
        <p type="p">Bank[0]~Bank[n-1]:排組</p>  
        <p type="p">ORSI:過度再新狀態資訊</p>  
        <p type="p">SB[0],SB[1]:子排組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1631" publication-number="202619952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高架搬送車系統及保持單元之角度補正方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260131B">B65G1/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之高架搬送車系統具備有：保持物品的保持單元、使保持單元升降的升降裝置、及藉由控制器所控制並可補正保持單元之角度的補正機構。高架搬送車系統具備有1台角度測量裝置，該角度測量裝置係測量保持單元之升降範圍內複數個高度階層各者中的保持單元相對於水平面的角度。控制器係記憶藉由角度測量裝置所取得的複數個角度之測量結果，並根據高度階層各者中的角度之測量結果以控制補正機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:框架單元</p>  
        <p type="p">7:保持單元</p>  
        <p type="p">8:夾具</p>  
        <p type="p">80:測量單元</p>  
        <p type="p">90:被測量單元</p>  
        <p type="p">200:軌道</p>  
        <p type="p">210:通信部</p>  
        <p type="p">211:通信線</p>  
        <p type="p">300:裝載埠裝置(角度測量裝置)</p>  
        <p type="p">B:傳動帶</p>  
        <p type="p">LM:中間位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1632" publication-number="202621012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性馬達用電樞</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">H02K41/02</main-classification>  
        <further-classification edition="202501120260211B">H02K15/02</further-classification>  
        <further-classification edition="200601120260211B">H02K5/02</further-classification>  
        <further-classification edition="200601120260211B">H02K1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松中宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之線性馬達用電樞1，其一部分被樹脂塑模而成，具備：緊固孔構件30，其具有緊固孔31；以及積層核心10，其具有供緊固孔構件30插入之緊固孔構件插入部13；積層核心10具有：表面10a，其設於緊固孔31之開口側；以及插通孔14，其設於表面10a，並到達插入於緊固孔構件插入部13之緊固孔構件30之緊固孔31；且進一步具備：襯套40，其配置於插通孔14，並具有在配置於插通孔14之狀態下自表面10a凹陷的支承面43。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:線性馬達用電樞</p>  
        <p type="p">10:積層核心</p>  
        <p type="p">10a:表面</p>  
        <p type="p">10b:背面</p>  
        <p type="p">11:溝槽</p>  
        <p type="p">12:芯部</p>  
        <p type="p">13:緊固孔構件插入部</p>  
        <p type="p">14:插通孔</p>  
        <p type="p">20:線圈</p>  
        <p type="p">30:緊固孔構件</p>  
        <p type="p">31:緊固孔</p>  
        <p type="p">40:襯套</p>  
        <p type="p">41:貫通孔</p>  
        <p type="p">42:端面</p>  
        <p type="p">43:支承面</p>  
        <p type="p">50:模具樹脂部</p>  
        <p type="p">51:內壁部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1633" publication-number="202620396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測方法及檢漏器</chinese-title>  
        <english-title>DETECTION METHOD AND LEAK DETECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">G01M3/04</main-classification>  
        <further-classification edition="200601120260121B">G01M3/20</further-classification>  
        <further-classification edition="200601120260121B">G01M3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商普發真空公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFEIFFER VACUUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海德拉貝　史麥爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HADJ RABAH, SMAIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維里爾　克萊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERRIER, CLAIRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施瑞納　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHREINER, MATHIEU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢漏方法，其中降低測試物件(A)內部的壓力，在測試物件(A)內部監測示踪氣體的測量訊號，示踪氣體的測量訊號代表測試物件(A)周圍的環境中存在的氣體物質的流量或濃度，並尋找示踪氣體的測量訊號的降低以檢測測試物件(A)洩漏的存在。 &lt;br/&gt;　　一種檢漏方法，其中利用嗅探針(8)監測示踪氣體的測量訊號，該示踪氣體的測量訊號代表測試物件(A)周圍的環境中存在的氣體物質的流量或濃度，供應填充氣體至該測試物件(A)，以及尋找該示蹤氣體的該測量訊號的降低以檢測該測試物件(A)洩漏的存在。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Leak detection method in which the pressure inside the test object (A) is lowered, a measurement signal of a tracer gas, representative of the flow or concentration of a gaseous species present in the environment surrounding the test object (A), is monitored inside the test object (A), and a decrease in the measurement signal of the tracer gas is sought to detect the presence of a leak in the test object (A). &lt;br/&gt;Leak detection method in which a measurement signal of the tracer gas, representative of the flow or concentration of a gaseous species present in the environment surrounding the test object (A), is monitored with a sniffing probe (8), a filling gas is supplied to the test object (A), and a decrease in the measurement signal of the tracer gas is sought to detect the presence of a leak in the test object (A).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢漏器</p>  
        <p type="p">2:氣體分析儀</p>  
        <p type="p">3:密封體</p>  
        <p type="p">4:輔助泵送裝置</p>  
        <p type="p">5:泵送裝置</p>  
        <p type="p">6:填充氣體鋼瓶</p>  
        <p type="p">10:控制單元</p>  
        <p type="p">A:測試物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1634" publication-number="202621339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置、顯示模組及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260213B">H10K50/00</main-classification>  
        <further-classification edition="202301120260213B">H10K50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初見亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有攝像功能的顯示裝置。提供一種具有高視角特性及高攝像性能的顯示裝置。該顯示裝置包括受發光元件及濾色片。受發光元件包括具有發第一顏色光的功能及受第二顏色光的功能的受發光區域。濾色片位於受發光元件上，並具有透第一顏色光的功能及遮第二顏色光的功能。濾色片具有開口部。此外，從平面來看，受發光區域具有位於開口部的內側的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">11、12:基板</p>  
        <p type="p">15:元件層</p>  
        <p type="p">20h:開口部</p>  
        <p type="p">20:受發光元件</p>  
        <p type="p">21:導電層</p>  
        <p type="p">22:有機層</p>  
        <p type="p">23:導電層</p>  
        <p type="p">31:濾色片</p>  
        <p type="p">41:絕緣層</p>  
        <p type="p">42:黏合層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1635" publication-number="202619775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觀賞用玩具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A63H33/42</main-classification>  
        <further-classification edition="200601120251130B">A63H33/22</further-classification>  
        <further-classification edition="200601120251130B">A63H33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商萬代股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木久典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, HISANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種處理性佳、趣味性高之觀賞用玩具。 &lt;br/&gt;本發明之觀賞用玩具1具備顯示部10、及可支持顯示部10之支持部20，支持部20構成為能以成彎曲之狀態支持顯示部10。支持部20成彎曲、使得其中央部與顯示部10分開而能夠支持顯示部10，藉此使顯示部10與支持部20位於前後，而可藉由支持部20之正面20f進行顯示部10之裝飾展現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示部</p>  
        <p type="p">11:第1端部</p>  
        <p type="p">12:第2端部</p>  
        <p type="p">15:第5端部</p>  
        <p type="p">16:第6端部</p>  
        <p type="p">18:突起部</p>  
        <p type="p">20:支持部</p>  
        <p type="p">20f:正面</p>  
        <p type="p">20s:縫隙(扣止部)</p>  
        <p type="p">23:第3端部</p>  
        <p type="p">24:第4端部</p>  
        <p type="p">27:第7端部</p>  
        <p type="p">28:第8端部</p>  
        <p type="p">60:載置部</p>  
        <p type="p">C:角色圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1636" publication-number="202620861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括混合式雙電晶體零電容器增益胞元的裝置、系統及其方法</chinese-title>  
        <english-title>DEVICE INCLUDING HYBRID TWO TRANSISTOR ZERO CAPACITOR GAIN CELL, SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C11/40</main-classification>  
        <further-classification edition="200601120260223B">G11C7/18</further-classification>  
        <further-classification edition="200601120260223B">G11C8/14</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞霍山　卡林　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHOSAN UL KARIM, MUHAMMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席姆卡　哈索諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMKA, HARSONO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　雪蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, XUELIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　阿拉文德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ARAVINDH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供包括混合式雙電晶體零電容器增益胞元的裝置、系統及其方法。裝置包括與後段製程相容的雙電晶體零電容器增益胞元，並且雙電晶體零電容器增益胞元包括寫入電晶體和電連接到寫入電晶體的讀取電晶體。寫入電晶體包括氧化物半導體通道，讀取電晶體包括多晶矽通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device including hybrid two transistor zero capacitor gain cell, system and method thereof are provided. The device includes a two transistor zero capacitor gain cell that is back end of line compatible and includes a write transistor and a read transistor that is electrically connected to the write transistor. The write transistor includes an oxide semiconductor channel and the read transistor includes a polysilicon channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:2T0C增益胞元</p>  
        <p type="p">OS:氧化物半導體</p>  
        <p type="p">RBL:讀取位元線</p>  
        <p type="p">RWL:讀寫線</p>  
        <p type="p">SN:儲存節點</p>  
        <p type="p">Tw:寫入電晶體</p>  
        <p type="p">Tr:讀取電晶體</p>  
        <p type="p">WBL:寫入位元線</p>  
        <p type="p">WWL:寫入字元線</p>  
        <p type="p">LTPS:低溫多晶矽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1637" publication-number="202621194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H05H1/02</main-classification>  
        <further-classification edition="200601120260209B">H01J37/32</further-classification>  
        <further-classification edition="200601120260209B">C23C16/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野裕仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, HIROHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電漿處理裝置具備：電漿處理腔室；磁場產生部，其配置於上述電漿處理腔室之上方；至少1個磁場感測器；及控制部，其構成為基於上述磁場感測器之輸出來控制上述磁場產生部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通訊介面</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">10a:側壁</p>  
        <p type="p">10e:氣體排出口</p>  
        <p type="p">10s:電漿處理空間</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">13:簇射頭</p>  
        <p type="p">13a:氣體供給口</p>  
        <p type="p">13b:氣體擴散室</p>  
        <p type="p">13c:氣體導入口</p>  
        <p type="p">20:氣體供給部</p>  
        <p type="p">21:氣體源</p>  
        <p type="p">22:流量控制器</p>  
        <p type="p">30:電源系統</p>  
        <p type="p">31:電源</p>  
        <p type="p">31a:第1 RF產生部</p>  
        <p type="p">31b:第2 RF產生部</p>  
        <p type="p">32:電源</p>  
        <p type="p">32a:第1電壓產生部</p>  
        <p type="p">32b:第2電壓產生部</p>  
        <p type="p">40:排氣系統</p>  
        <p type="p">50:磁場產生部</p>  
        <p type="p">51,51a,51b,51c,51d,51e:電磁鐵</p>  
        <p type="p">59:電磁鐵激發電路</p>  
        <p type="p">60a,60b,60c,60d,60e:磁場測定部</p>  
        <p type="p">111:本體部</p>  
        <p type="p">111a:中央區域</p>  
        <p type="p">111b:環狀區域</p>  
        <p type="p">112:環組件</p>  
        <p type="p">1110:基台</p>  
        <p type="p">1110a:流路</p>  
        <p type="p">1111:靜電吸盤</p>  
        <p type="p">1111a:陶瓷構件</p>  
        <p type="p">1111b:靜電吸盤電極</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1638" publication-number="202620238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳輸通道及真空處理設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C23C16/54</main-classification>  
        <further-classification edition="200601120251201B">C23C16/513</further-classification>  
        <further-classification edition="200601120251201B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（廣州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. GUANGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒煜申</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　班</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, BAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種傳輸通道及真空處理設備，所述真空處理設備包括至少一個可被抽真空的腔室；所述傳輸通道穿設所述腔室的側壁，用於向所述腔室內的基座傳送矩形基板；所述傳輸通道的外表面包括外頂面和外底面；所述外頂面為向上凸起的弧形曲面，和/或所述外底面為向下凸起的弧形曲面。本發明的優點是：能夠滿足向真空處理設備的腔室內傳輸大尺寸厚基板的需求，在不擴大腔室體積的情況下，可以有效緩解傳輸通道應力集中，減少傳輸通道變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">X、Y、Z:軸</p>  
        <p type="p">209:傳輸通道</p>  
        <p type="p">2091:外頂面</p>  
        <p type="p">2092:外底面</p>  
        <p type="p">2093:外側面</p>  
        <p type="p">2094:內頂面</p>  
        <p type="p">2095:內底面</p>  
        <p type="p">2096:內側面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1639" publication-number="202621264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成在保護襯墊上之具有陽極氧化阻障層的整合結構及相應的方法</chinese-title>  
        <english-title>AN INTEGRATED STRUCTURE WITH AN ANODIZATION BARRIER LAYER FORMED ON A PROTECTIVE LINER, AND CORRESPONDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D1/60</main-classification>  
        <further-classification edition="202501120260223B">H10D86/80</further-classification>  
        <further-classification edition="200601120260223B">C25D11/04</further-classification>  
        <further-classification edition="200601120260223B">H01G9/04</further-classification>  
        <further-classification edition="202601120260223B">H10W10/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維諾恩　福瑞迪瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOIRON, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索利爾　布里吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOULIER, BRIGITTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙拉茲　瓦倫丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALLAZ, VALENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維隆　西莉兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAVIRON, CYRILLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾瑞拉　黛芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERREIRA, DELPHINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布丹　弗洛里安尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUDIN, FLORIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多明奎茲　塞巴斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOMINGUEZ, SEBASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合結構，其包含： &lt;br/&gt;基板(100、101)， &lt;br/&gt;導電層，該導電層具有第一空腔(102C)，該第一空腔填充有第一絕緣區域(103F)，該第一絕緣區域具有與該導電層之頂表面齊平的頂表面，從而形成第一平坦表面(F1)， &lt;br/&gt;位於該導電層之頂表面及該第一絕緣區域之頂表面上的保護襯墊(104)， &lt;br/&gt;位於該保護襯墊上之陽極氧化阻障層(105)， &lt;br/&gt;該保護襯墊及該陽極氧化阻障層具有穿過該保護襯墊及該陽極氧化阻障層且開口通向該第一絕緣區域的第二空腔(105_104C)，該第二空腔填充有第二絕緣區域(106F)，該第二絕緣區域具有與該陽極氧化阻障層之頂表面齊平的頂表面，從而形成第二平坦表面(F2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated structure comprising: &lt;br/&gt;a substrate (100, 101), &lt;br/&gt;a conductive layer, the conductive layer having a first cavity, the first cavity (102C) being filled with a first insulating region (103F), the first insulating region having a top surface flush with a top surface of the conductive layer to form a first planar surface (F1), &lt;br/&gt;a protective liner (104) on the top surface of the conductive layer and the top surface of the first insulating region, &lt;br/&gt;an anodization barrier layer (105) on the protective liner, &lt;br/&gt;the protective liner and the anodization barrier layer having a second cavity (105_104C) passing through the protective liner and the anodization barrier layer and opening onto the first insulating region, the second cavity being filled with a second insulating region (106F), the second insulating region having a top surface flush with a top surface of the anodization barrier layer to form a second planar surface (F2).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:支撐基板</p>  
        <p type="p">101:氧化層</p>  
        <p type="p">102:導電層</p>  
        <p type="p">102C:第一空腔</p>  
        <p type="p">103F:第一絕緣區域</p>  
        <p type="p">104:保護襯墊</p>  
        <p type="p">105_104C:第二空腔</p>  
        <p type="p">105:陽極氧化阻障層</p>  
        <p type="p">106F:第二絕緣區域</p>  
        <p type="p">108:多孔區域</p>  
        <p type="p">110:底電極層</p>  
        <p type="p">111:電介質層</p>  
        <p type="p">112:頂電極層</p>  
        <p type="p">F1:第一平坦表面</p>  
        <p type="p">F2:第二平坦表面</p>  
        <p type="p">G1:孔隙組</p>  
        <p type="p">G2:孔隙組</p>  
        <p type="p">G3:孔隙組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1640" publication-number="202620111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生物可降解樹脂的成核劑及包含其之生物可降解樹脂組成物</chinese-title>  
        <english-title>NUCLEATING AGENT FOR BIODEGRADABLE RESINS AND BIODEGRADABLE RESIN COMPOSITION COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260212B">C08K3/012</main-classification>  
        <further-classification edition="200601120260212B">C08L67/02</further-classification>  
        <further-classification edition="200601120260212B">C08G63/06</further-classification>  
        <further-classification edition="200601120260212B">A61K31/52</further-classification>  
        <further-classification edition="200601120260212B">C08L101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＣＪ第一製糖股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CJ CHEILJEDANG CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧素羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, SORA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成學永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HAKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金廷洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEONGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具淑熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, SOOKHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係有關於一種用於生物可降解樹脂的成核劑，其包含以黃嘌呤為主之化合物及無機物，且係有關於一種生物可降解聚酯樹脂組成物，其包含該成核劑及聚合物，諸如聚羥基烷酸酯樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a nucleating agent for a biodegradable resin, which comprises a xanthine-based compound and an inorganic substance, and to a biodegradable polyester resin composition, which comprises the nucleating agent and a polymer such as a polyhydroxyalkanoate resin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1641" publication-number="202621038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用相位移自注入以抑制閃爍噪聲之振盪器電路</chinese-title>  
        <english-title>OSCILLATOR CIRCUITS WITH FLICKER NOISE SUPPRESSION BY PHASE-SHIFTED SELF-INJECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">H03B5/04</main-classification>  
        <further-classification edition="200601120260205B">H03B5/08</further-classification>  
        <further-classification edition="200601120260205B">H03B29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳君彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIUN-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪兆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛育理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種振盪器電路包括第一交叉耦合對、第二交叉耦合對、耦合在第一交叉耦合對和第二交叉耦合對之間的諧振電路以及第一注入電路。該諧振電路包括一個第一節點輸出第一電壓訊號和一個第二節點輸出第二電壓訊號。該第一注入電路耦合到第一交叉耦合對，並注入具有第一預定相位的第一補償電流到第一交叉耦合對的預定節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oscillator circuit includes a first cross coupled pair, a second cross coupled pair, a resonant circuit coupled between the first cross coupled pair and the second cross coupled pair and a first injection circuit. The resonant circuit includes a first node outputting a first voltage signal and a second node outputting a second voltage signal. The first injection circuit is coupled to the first cross coupled pair and injects a first compensating current with a first predetermined phase to a predetermined node of the first cross coupled pair.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:振盪器電路</p>  
        <p type="p">110、120:交叉耦合對</p>  
        <p type="p">130:諧振電路</p>  
        <p type="p">140-1、140-2、140-3、140-4:注入電路</p>  
        <p type="p">T11、T12、T13、T14:晶體管</p>  
        <p type="p">VoscP:第一節點輸出電壓訊號</p>  
        <p type="p">VoscN:第二節點輸出電壓訊號</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">∠ZloadCM:共模負載阻抗相位</p>  
        <p type="p">∠ZloadDM:差模負載阻抗相位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1642" publication-number="202620484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波分裝置及其製造方法</chinese-title>  
        <english-title>WAVELENGTH DIVISION DEVICE AND WAVELENGTH DIVISION DEVICE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G02B6/293</main-classification>  
        <further-classification edition="200601120260205B">H04J14/02</further-classification>  
        <further-classification edition="200601120260205B">B29D11/00</further-classification>  
        <further-classification edition="200601120260205B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭漢檥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂引棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YIN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪健峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIEN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種波分裝置，包含具有一或多個凹槽的基板、設置於基板之一或多個凹槽中的複數個濾光條、以及設置於基板上的一稜鏡。複數個濾光條的每一者對應於一光學濾波波長。稜鏡被配置以覆蓋複數個濾光條。基板的表面被蝕刻以形成一或多個凹槽。在複數個濾光條被塗佈後，複數個濾光條被接合於基板的一或多個凹槽內。設置於基板上的樹脂係由工作模具壓印以形成稜鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wavelength division device includes a substrate having one or more grooves, a plurality of filter bars disposed in the one or more grooves of the substrate, and a prism disposed on the substrate. Each of the filter bars corresponds to an optical filtering wavelength. The prism is configured to cover the plurality of filter bars. A surface of the substrate is etched to form the one or more grooves. After the plurality of filter bars are coated, the plurality of filter bars are bonded in the one or more grooves of the substrate. A resin disposed on the substrate is imprinted by a working mold to form the prism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:波分裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:稜鏡</p>  
        <p type="p">FB1至FB4:濾光條</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1643" publication-number="202620664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實驗室儀器資料管理程式</chinese-title>  
        <english-title>LABORATORY INSTRUMENT DATA MANAGER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260205B">G06F16/25</main-classification>  
        <further-classification edition="201801120260205B">G06F9/445</further-classification>  
        <further-classification edition="200601120260205B">G06F13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商陶氏全球科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾巴哈爾　阿拉什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOWBAHAR, ARASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃格布雷希特　瑞安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGGEBRECHT, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於實驗室儀器之資料管理程式可為不同類型之實驗室儀器儲存一各別驅動程式。用於一給定類型之實驗室儀器的該驅動程式可與複數種類型中之一者之一實驗室儀器建立一連接，以一各別格式自該實驗室儀器接收資料，及將該資料自該各別格式轉換為一通用實驗室資訊管理系統(LIMS)格式。該資料管理程式可將呈該通用LIMS格式之該資料上傳至一LIMS。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data manager for laboratory instruments can store a respective driver for different types of laboratory instruments. The driver for a given type of laboratory instrument can establish a connection with a laboratory instrument of one of the plurality of types, receive data from the laboratory instrument in a respective format, and convert the data from the respective format to a common laboratory information management system (LIMS) format. The data manager can upload the data in the common LIMS format to a LIMS.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:樣本佇列</p>  
        <p type="p">104:實驗室管理程式</p>  
        <p type="p">106:資料入口網站</p>  
        <p type="p">108:LIMS</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1644" publication-number="202620390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用熱電偶判定溫度的方法和裝置</chinese-title>  
        <english-title>METHODS AND DEVICES TO DETERMINE A TEMPERATURE WITH A THERMOCOUPLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01K7/13</main-classification>  
        <further-classification edition="202101120260202B">G01K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商賀利氏電測騎士國際股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS ELECTRO-NITE INTERNATIONAL N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼恩斯　吉多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEYENS, GUIDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克斯　格特　詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEX, GERT-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及判定熱電偶之冷接頭之溫度的方法、判定高溫環境之溫度的方法、經調適以執行本發明方法的熱電偶系統及熱電偶裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method to determine the temperature of the cold junction of a thermocouple, methods to determine the temperature of a high temperature environment, thermocouple systems and thermocouple devices adapted to conduct the inventive methods.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱電偶</p>  
        <p type="p">2:熱絲</p>  
        <p type="p">3:測量接頭</p>  
        <p type="p">5:冷接頭</p>  
        <p type="p">7:測量儀器</p>  
        <p type="p">20:熱電偶系統</p>  
        <p type="p">21:連接線絲</p>  
        <p type="p">22:溫度感測器</p>  
        <p type="p">23:處理儀器</p>  
        <p type="p">T1:第一溫度</p>  
        <p type="p">p1:第一位置/開始位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1645" publication-number="202619993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝用玻璃陶瓷基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C03C10/00</main-classification>  
        <further-classification edition="200601120260223B">C03C4/00</further-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="201401120260223B">B23K26/57</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西宮隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMIYA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有結晶相與玻璃相的半導體封裝用玻璃陶瓷基板1，當結晶相的熱膨脹係數為α1[ppm/K]、玻璃相的熱膨脹係數為α2[ppm/K]時，2≦α1/α2≦8的關係成立。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體封裝用玻璃陶瓷基板</p>  
        <p type="p">1a:周緣部</p>  
        <p type="p">1b:中央部</p>  
        <p type="p">L1:縱向尺寸</p>  
        <p type="p">L2:橫向尺寸</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1646" publication-number="202620741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於NFC標籤的支付方法、設備、用戶終端、系統及介質</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251103B">G06Q20/32</main-classification>  
        <further-classification edition="200601120251103B">G06K19/07</further-classification>  
        <further-classification edition="200601120251103B">G06K7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于文海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳成錢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種基於近場通信（Near Field Communication ，NFC）標籤的支付方法、設備、用戶終端、系統及介質，屬於電子支付領域。該方法包括：回應於用戶終端對NFC標籤的近場操作，將與近場操作對應的支付應用的應用資訊或中間控制項的控制項資訊通過NFC技術傳輸至用戶終端，以使用戶終端根據得到的支付應用的應用資訊調起目標支付應用或通過中間控制項調起目標支付應用，目標支付應用為受理設備支援的至少兩個支付應用中的一個；掃描用戶終端調起的目標支付應用展示的支付碼，基於支付碼中的支付資訊進行支付。根據本發明實施例能夠提高NFC支付的靈活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201、S202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1647" publication-number="202620992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有斷電保護功能的積體電路</chinese-title>  
        <english-title>AN INTEGRATED CIRCUIT WITH POWER LOSS PROTECTION FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H02H9/00</main-classification>  
        <further-classification edition="200601120251103B">H02H1/06</further-classification>  
        <further-classification edition="200601120251103B">G01R27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王海唐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAITANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　鵬捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PENGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種具有斷電保護功能的積體電路，包括：匯流排端子，用於提供匯流排電壓；儲能端子，耦合至斷電保護電容器；充電電路，耦合在匯流排端子和儲能端子之間，被配置為利用匯流排電壓對斷電保護電容器充電，其中，充電電路包括第一充電路徑，被配置為在積體電路的啟動過程中，基於匯流排電壓提供第一恆定充電電流至斷電保護電容器以對斷電保護電容器充電，使斷電保護電容器兩端的電壓以第一固定斜率上升；以及電容偵測電路，被配置為在積體電路的啟動過程中，在通過第一充電路徑對斷電保護電容器進行充電的期間對斷電保護電容器兩端的電壓進行監測，以獲取用於計算斷電保護電容器的容值的參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses an integrated circuit with power loss protection function, comprising: a bus terminal, configured to provide a bus voltage; an energy storage terminal, coupled to a power loss protection capacitor; a charging circuit, coupled between the bus terminal and the energy storage terminal, configured to charge the power loss protection capacitor using the bus voltage, wherein the charging circuit includes a first charging path configured to provide a first constant charging current to the power loss protection capacitor based on the bus voltage to charge the power loss protection capacitor during a startup process of the integrated circuit, thereby causing a voltage across the power loss protection capacitor to rise at a first fixed slope; and a capacitance detection circuit, configured to monitor the voltage across the power loss protection capacitor while the power loss protection capacitor is being charged via the first charging path to obtain parameters for calculating the capacitance value of the power loss protection capacitor during a startup process of the integrated circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源管理電路</p>  
        <p type="p">110:充電電路</p>  
        <p type="p">111:第一充電路徑</p>  
        <p type="p">112:第二充電路徑</p>  
        <p type="p">120:輸入保護電路</p>  
        <p type="p">BUS:匯流排端子</p>  
        <p type="p">C&lt;sub&gt;STRG&lt;/sub&gt;:斷電保護電容器</p>  
        <p type="p">IN:輸入端子</p>  
        <p type="p">STRG:儲能端子</p>  
        <p type="p">V&lt;sub&gt;BUS&lt;/sub&gt;:匯流排電壓</p>  
        <p type="p">V&lt;sub&gt;STRG&lt;/sub&gt;:儲能電壓</p>  
        <p type="p">V&lt;sub&gt;STRG_FB&lt;/sub&gt;:儲能電壓回饋訊號</p>  
        <p type="p">V&lt;sub&gt;STRG_FBD&lt;/sub&gt;:數位訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1648" publication-number="202619865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人系統</chinese-title>  
        <english-title>ROBOT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B25J9/22</main-classification>  
        <further-classification edition="200601120251223B">B25J13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商達誼恆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIHEN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川慎一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供機器人系統。如作業者的想像那樣簡單地使機器人動作。機器人系統具備：顯示控制部，其使由攝像部攝像且基於至少包含產業用機器人進行作業的作業對象的攝像資訊的圖像數據顯示於畫面；取得部，其至少取得與作業對象對應的三維數據；關聯建立部，其將圖像數據以及三維數據作為用戶坐標系中的數據建立關聯；指定接受部，其在畫面上接受成為產業用機器人的作業工具部的移動目的地的目標位置的指定；坐標變換部，其將用戶坐標系中的目標位置變換為以產業用機器人的特定部位為原點的機器人坐標系中的目標位置；軌跡算出部，其算出從作業工具部的當前位置到目標位置為止的軌跡；和動作控制部，其按照所算出的軌跡使作業工具部動作至目標位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The robot is simply actuated as imagined by the operator. This robot system is provided with: a display control unit that displays, on a screen, image data that is imaged by an imaging unit and that is based on imaging information that includes at least an object to be worked by an industrial robot; an acquisition unit that acquires at least three-dimensional data corresponding to the object to be worked; a correlation establishment unit that associates the image data and the three-dimensional data as data in a user coordinate system; a designation reception unit that receives, on the screen, a designation of a target position that is a moving destination of a work tool unit of the industrial robot; a coordinate transformation unit that transforms the target position in the user coordinate system into a target position in a robot coordinate system having a specific part of the industrial robot as an origin; a trajectory calculation unit that calculates a trajectory from a current position of the work tool unit to the target position; and an operation control unit that operates the work tool unit to the target position according to the calculated trajectory.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機器人控制裝置</p>  
        <p type="p">2:機械手</p>  
        <p type="p">3:運算裝置</p>  
        <p type="p">4:攝像部</p>  
        <p type="p">5:顯示部</p>  
        <p type="p">11:控制部</p>  
        <p type="p">12:存儲部</p>  
        <p type="p">13:通訊部</p>  
        <p type="p">31:控制部</p>  
        <p type="p">32:存儲部</p>  
        <p type="p">33:通訊部</p>  
        <p type="p">100:機器人系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1649" publication-number="202619653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>特定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">A47G23/08</main-classification>  
        <further-classification edition="202401120260203B">G05D1/43</further-classification>  
        <further-classification edition="202201120260203B">G06V20/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商食與生活夥伴有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOOD &amp; LIFE COMPANIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉原正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIHARA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能夠謀求裝置構成的精簡化的特定裝置。 &lt;br/&gt;　　[解決手段]商品的提供裝置是特定沿搬送路徑搬送的被搬送物的特定裝置。具備：對通過搬送路徑上的檢測區域各自中的複數個被搬送物各自依序進行攝影的相機各自；對複數個被搬送物的圖像各自進行了攝影之後，對通過了搬送路徑上的檢測區域的各檢測區域的對象物進行攝影的相機各自；以及基於複數個被搬送物的圖像各自與對象物的圖像，來特定對象物為複數個被搬送物中的哪一個被搬送物的特定手段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:循環輸送帶</p>  
        <p type="p">102至106:供給輸送帶</p>  
        <p type="p">107至109:顧客輸送帶</p>  
        <p type="p">110至113:輥輪</p>  
        <p type="p">121至125,131至137,181至184:相機(第一及第二攝影手段的一例)</p>  
        <p type="p">141至147:擠壓裝置(第一及第二擠壓裝置的一例)</p>  
        <p type="p">151至155:觸控面板</p>  
        <p type="p">161至163:切換桿</p>  
        <p type="p">171至176:餐桌觸控系統</p>  
        <p type="p">P21至P25,P31至P37,P81至P84:檢測區域(第一及第二區域的一例)</p>  
        <p type="p">RT1至RT6,RT21至RT23,RT31至RT36,RT41至RT44:搬送路徑(搬送路徑的一例)</p>  
        <p type="p">RT11,RT12:直線軌道</p>  
        <p type="p">SF1至SF5:師傅</p>  
        <p type="p">TB1至TB6:餐桌</p>  
        <p type="p">TE:設定的路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1650" publication-number="202620009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法、聚合物及鎓鹽</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C25/18</main-classification>  
        <further-classification edition="200601120260223B">C07C381/00</further-classification>  
        <further-classification edition="200601120260223B">C07C381/12</further-classification>  
        <further-classification edition="200601120260223B">C07D307/93</further-classification>  
        <further-classification edition="200601120260223B">C07D317/70</further-classification>  
        <further-classification edition="200601120260223B">C07D327/06</further-classification>  
        <further-classification edition="200601120260223B">C07D327/08</further-classification>  
        <further-classification edition="200601120260223B">C07D333/76</further-classification>  
        <further-classification edition="200601120260223B">C08F212/14</further-classification>  
        <further-classification edition="200601120260223B">C08F220/38</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄川冬輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAWA, FUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部祐大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於圖案形成時感度、CDU、LWR及顯影缺陷抑制性優異的感放射線性組成物、圖案形成方法、聚合物及鎓鹽。一種感放射線性組成物，含有：聚合物，具有源自含有下述式（i）所表示的部分結構的鎓鹽的結構單元（I）、及包含酸解離性基的結構單元（II）；以及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="188px" width="427px" file="ed10072.JPG" alt="ed10072.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（i）中， &lt;br/&gt;X&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;為S&lt;sup&gt;-&lt;/sup&gt;或O&lt;sup&gt;-&lt;/sup&gt;。X&lt;sub&gt;2&lt;/sub&gt;及X&lt;sub&gt;3&lt;/sub&gt;分別獨立地為S或O。其中，於選自由X&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、X&lt;sub&gt;2&lt;/sub&gt;、及X&lt;sub&gt;3&lt;/sub&gt;所組成的群組中的至少一個中包含S。Z&lt;sup&gt;+&lt;/sup&gt;為有機陽離子。*分別為與所述鎓鹽中的其他原子的鍵結鍵。其中，所述鎓鹽於所述部分結構以外的部分中包含一個以上的聚合性基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1651" publication-number="202619925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251203B">B62D55/265</main-classification>  
        <further-classification edition="200601120251203B">B62D55/065</further-classification>  
        <further-classification edition="200601120251203B">B62D55/104</further-classification>  
        <further-classification edition="200601120251203B">G01N29/265</further-classification>  
        <further-classification edition="200601120251203B">G01B17/02</further-classification>  
        <further-classification edition="200601120251203B">G01B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徳元勇太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMOTO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西澤佑司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIZAWA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松藤絵夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUFUJI, EMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下啓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">移動裝置為於磁性體的表面上行駛的移動裝置，且包括：裝置主體部（框體100）；驅動部101，至少設置於裝置主體部的兩側，經由連桿機構而與裝置主體部連接，並且藉由磁力來吸附於磁性體表面；以及輔助磁鐵204，相對於磁性體表面分隔設置於驅動部101，輔助驅動部101對磁性體表面的吸附。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:框體</p>  
        <p type="p">101:驅動部</p>  
        <p type="p">102:前後的框體部</p>  
        <p type="p">103:中央的框體部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1652" publication-number="202620771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力計算裝置、電力計算方法及記錄電力計算程式之非暫時性電腦可讀記錄媒體</chinese-title>  
        <english-title>POWER CALCULATION DEVICE, POWER CALCULATION METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM FOR RECORDING POWER CALCULATION PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260202B">G06Q50/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＥＩＺＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIZO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢田大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YATA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮永修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYANAGA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種電力計算裝置、電力計算方法及電力計算程式。電力計算裝置設置於電力供給系統，電力供給系統藉由第1電力轉換部將第1轉換前電力轉換為第1轉換後電力，並將第1轉換後電力分割而分別輸出至複數個第1負載；電力計算裝置具備輸出電力計算部、轉換前電力計算部及換算電力計算部。輸出電力計算部計算複數個第1輸出電力。轉換前電力計算部基於第1轉換前電力與第1轉換後電力之關係及複數個第1輸出電力以計算第1轉換前電力。換算電力計算部基於複數個第1輸出電力之間的電力比率及第1轉換前電力以計算複數個第1換算電力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:控制部</p>  
        <p type="p">11a:輸出電力計算部</p>  
        <p type="p">11b:轉換前電力計算部</p>  
        <p type="p">11c:換算電力計算部</p>  
        <p type="p">11d:顯示控制部</p>  
        <p type="p">11e:相關關係設定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1653" publication-number="202620136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系塗料用黏性調整劑及非水系塗料組成物</chinese-title>  
        <english-title>RHEOLOGY CONTROL AGENTS FOR NON-AQUEOUS COMPOSITIONS AND NON-AQUEOUS COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260213B">C09D7/43</main-classification>  
        <further-classification edition="200601120260213B">C08G18/18</further-classification>  
        <further-classification edition="200601120260213B">C08G18/02</further-classification>  
        <further-classification edition="200601120260213B">C09D175/12</further-classification>  
        <further-classification edition="200601120260213B">C08G18/34</further-classification>  
        <further-classification edition="200601120260213B">C08K3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商楠本化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUMOTO CHEMICALS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田山俊希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYAMA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩埵雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATTA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山直生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田英希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼澤卓暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIZAWA, TSUNAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示出良好的增黏性、且能夠以固體成分100%添加於塗料中的形態的聚合物型的非水系塗料用黏性調整劑。作為非水系塗料用黏性調整劑，使用使化合物（A）與化合物（B）反應而獲得的聚合物。化合物（A）為使羥基羧酸、包含羥基羧酸的單體成分（A1）脫水縮合而獲得的聚酯、使單體成分（A1）與改質成分（A2）脫水縮合而獲得的改質聚酯中的一種以上的化合物，且羥基價/（酸價+胺價）滿足0.5以上且1.2以下。改質成分（A2）為具有一個能夠與羧基脫水縮合的官能基、且具有一個以上的無法與羧基脫水縮合的極性官能基的化合物。化合物（B）為聚異氰酸酯及其衍生物、以及碳數4～54的多羧酸中的一種以上的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:寡聚物鏈</p>  
        <p type="p">2:異三聚氰酸環</p>  
        <p type="p">3:交聯鍵</p>  
        <p type="p">4:吸附基</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1654" publication-number="202620662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>SMF記錄到系統實體之Z/OS映射</chinese-title>  
        <english-title>Z/OS MAPPING OF SMF RECORDS TO SYSTEM ENTITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">G06F16/22</main-classification>  
        <further-classification edition="200601120260202B">G06F13/10</further-classification>  
        <further-classification edition="200601120260202B">G06F11/34</further-classification>  
        <further-classification edition="200601120260202B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商泰拉克勞德私人有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERACLOUD APS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴雷特　萊納德　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARRETT,LENNARD,MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉克　米克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLARKE,MIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於將系統管理設施(SMF)記錄映射至邏輯實體之系統包含：一處理器；一儲存器，其可由該處理器存取；及一映射程式，其在由該處理器執行時引起該系統：接收含有有關該系統中發生之事件之資訊之SMF記錄；判定該等事件與相關邏輯實體之間的關連資料；產生複數個唯一鍵；使該等經產生之複數個唯一鍵之各者與該等相關邏輯實體之一對應邏輯實體相關聯；將與對應於各邏輯實體之該複數個唯一鍵之相關聯唯一鍵相關聯之該等邏輯實體之各者儲存於該儲存器中之一關係式資料庫中；及產生一報告，執行互動式使用者介面統計分析或使用該關連資料執行人工智慧(AI)處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for mapping System Management Facility (SMF) records to logical entities includes a processor, a storage accessible by the processor, and a mapping program that, when executed by the processor, causes the system to receive SMF records that contain information about events that occur in the system, determine correlation data between the events and related logical entities, generate a plurality of unique keys, associate each of the generated plurality of unique keys with a corresponding logical entity of the related logical entities, store, in a relational database in the storage, each of the logical entities associated with the associated unique key of the plurality of unique keys corresponding to each logical entity, and generate a report, perform interactive user interfaces statistical analysis, or perform artificial intelligence (AI) processing using the correlation data.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1655" publication-number="202620837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及膽固醇液晶顯示裝置的驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND METHOD FOR DRIVING CHOLESTERIC LIQUID-CRYSTAL DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G09G3/36</main-classification>  
        <further-classification edition="200601120260206B">G02F1/137</further-classification>  
        <further-classification edition="200601120260206B">H03K17/693</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊武璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WU CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示裝置，其包括膽固醇液晶顯示面板及主動矩陣驅動電路。膽固醇液晶顯示面板包括沿第一方向延伸的複數條掃描線、沿垂直於第一方向之第二方向延伸的複數條資料線及設置於該等掃描線與該等資料線的多個交叉處的複數個像素電路。主動矩陣驅動電路經配置以依序啟動各掃描線以執行影像更新程序，影像更新程序包括重置階段與接續於重置階段之後的選擇階段。在該等掃描線中的第一掃描線的重置階段的期間，主動矩陣驅動電路經配置以啟動該等掃描線中接續在第一掃描線之後的第二掃描線上的該等像素電路，以進入第二掃描線的重置階段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device is provided, which includes a cholesteric liquid-crystal display panel and an active-matrix driver circuit. The cholesteric liquid-crystal display panel includes a plurality of scanning lines extending in a first direction, a plurality of data lines extending in a second direction perpendicular to the first direction, and a plurality of pixel circuits disposed at intersections between the scanning lines and the data lines. The active-matrix driver circuit is configured to sequentially activate each scanning line to perform an image updating procedure which includes a reset phase and a selection phase following the reset phase. During the reset phase of a first scanning line of the scanning lines, the active-matrix driver circuit is configured to activate the pixel circuits on a second scanning line of the scanning lines, which is subsequent to the first scanning line, to enter the reset phase of the second scanning line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">910:步驟</p>  
        <p type="p">920:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1656" publication-number="202621148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於針對較低層觸發移動性切換之早期通道狀態資訊獲取的方法</chinese-title>  
        <english-title>METHOD FOR EARLY CSI ACQUISITION FOR LTM SWITCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260202B">H04W36/00</main-classification>  
        <further-classification edition="200901120260202B">H04W36/36</further-classification>  
        <further-classification edition="200901120260202B">H04W36/08</further-classification>  
        <further-classification edition="202301120260202B">H04W72/23</further-classification>  
        <further-classification edition="200601120260202B">H04L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽瓦賈納帕席　斯里尼瓦桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELVAGANAPATHY, SRINIVASAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥雅爾　山傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯斯凱拉　提莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSKELA, TIMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括：由一使用者裝備(UE)自一源控制單元(CU)接收一無線電資源控制(RRC)重組配訊息，其中，該RRC重組配訊息包括一L1/2觸發移動性(LTM)候選組配及/或列有用於早期CSI獲取之報告組配識別符的一清單；由該UE將一RRC重組配請求確認傳輸至該源CU；由該UE等待一胞元切換命令或MAC CE； 由該UE進行在一相關聯通道狀態資訊參考信號(CSI-RS)上的量測；以及由該UE利用該候選組配來將一報告傳輸至一目標DU。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes receiving, by a user equipment (UE), a radio resource control (RRC) reconfiguration message from a source control unit (CU), wherein the RRC reconfiguration message includes an L1/2 Triggered Mobility (LTM) candidate configuration and/or a list of reporting configuration identifiers for early CSI acquisition; transmitting, by the UE, an RRC reconfiguration request acknowledgment to the source CU; waiting, by the UE, for a cell switch command or MAC CE; performing, by the UE, a measurement on an associated channel state information reference signal (CSI-RS); and transmitting, by the UE, a report to a target DU using the candidate configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301,302,303,304,305,306,307,308,309,310,311,312,313:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1657" publication-number="202621466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將結構從實際狀態至目標狀態之轉換方法、包含基板與反應層之配置及用於執行轉換方法之裝置</chinese-title>  
        <english-title>METHOD FOR TRANSFERRING A STRUCTURE FROM AN ACTUAL STATE TO A TARGET STATE, ARRANGEMENT COMPRISING A SUBSTRATE AND A REACTION LAYER, AND DEVICE FOR PERFORMING SUCH A METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P95/40</main-classification>  
        <further-classification edition="200601120260223B">G03F7/09</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾曼　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHRMANN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫普林格　馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIMPLINGER, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾納　艾瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THALLNER, ERICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉換方法，用於將設置於基板（1，1’）處及/或嵌入基板（1，1’）中之結構（2’，2）從實際狀態轉換至目標狀態，該方法執行在基板接合的過程中，包含：提供具有處於實際狀態中之結構（2’，2）的基板（1，1’），提供至少一反應層（5r），在至少一反應層（5r）與基板（1，1’）之間建立使至少一反應層（5r）中的改變狀態導致基板（1，1’）變形的操作性連接，以影響方式（8）觸發至少一反應層（5r）的改變狀態，其中至少一反應層（5r）的改變狀態被局部地限制使結構（2’，2）從實際狀態轉換至目標狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for transferring a structure (2’, 2) arranged at a substrate (1, 1’) and/or embedded in the substrate (1, 1’) from an actual state to a target state, during bonding of substrates (1, 1’), comprising: providing the substrate (1, 1’) having the structure (2’, 2) in the actual state, providing at least one reaction layer (5r), realizing an operative connection between the at least one reaction layer (5r) and the substrate (1, 1’), wherein the operative connection is configured such that a change state in the at least one reaction layer (5r) causes a deformation in the substrate (1, 1’), triggering the change state in the at least one reaction layer (5r) by means of an influencing means (8), wherein the change state in the at least one reaction layer (5r) is caused locally limited such that the structure (2’, 2) is transferred from the target state to the actual state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1’:基板</p>  
        <p type="p">2’:結構</p>  
        <p type="p">3:層系統</p>  
        <p type="p">5:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1658" publication-number="202621548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將結構從實際狀態至目標狀態之轉移方法、包含基板與反應層之佈置及用於執行轉移方法裝置</chinese-title>  
        <english-title>METHOD FOR TRANSFERRING A STRUCTURE FROM AN ACTUAL STATE TO A TARGET STATE, ARRANGEMENT COMPRISING A SUBSTRATE AND A REACTION LAYER, AND DEVICE FOR PERFORMING SUCH A METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W80/00</main-classification>  
        <further-classification edition="202601120260223B">H10P95/40</further-classification>  
        <further-classification edition="202601120260223B">H10P56/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾曼　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHRMANN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉移方法，用於將佈置於基板及/或嵌入基板中之一結構於形成為功能單元之基板接合至形成為晶圓或功能單元之基板的結合製程期間及/或之後，及/或釋放期間從實際狀態轉移至目標狀態，包含：提供具有處於實際狀態之該結構的基板，提供至少一反應層，實現至少一反應層與基板之間的操作性連接，其中操作性連接經配置使得至少一反應層中的變化狀態引起基板中的形變，藉由影響方式觸發至少一反應層中之變化狀態，其中至少一反應層中之變化狀態以局部受限之方式引起，使得結構從實際狀態轉移至目標狀態，其中於釋放該基板期間觸發該變化狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for transferring a structure arranged at a substrate and/or embedded in the substrate from an actual state to a target state from an actual state to a target state, during and/or after a bonding process of bonding a substrate being formed as a functional unit to a substrate being formed as a wafer or as a functional unit during release, comprising: providing the substrate with the structure in the actual state, providing at least one reaction layer, which is integrated in particular into a layer system, realizing an operative connection between the at least one reaction layer and the substrate, wherein the operative connection is configured such that a change state in the at least one reaction layer causes a deformation in the substrate, triggering the change state in the at least one reaction layer by means of an influencing means, wherein the change state in the at least one reaction layer is caused locally limited such that the structure is transferred from the actual state to the target state, wherein the change state is triggered during release of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1’:形變基板</p>  
        <p type="p">2’:形變結構</p>  
        <p type="p">3:層系統</p>  
        <p type="p">5:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1659" publication-number="202621353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將結構從實際狀態至期望狀態之轉換方法、由基板與反應層構成之配置及用於執行轉換方法之裝置</chinese-title>  
        <english-title>METHOD FOR TRANSFERRING A STRUCTURE FROM AN ACTUAL STATE TO A DESIRED STATE, ARRANGEMENT CONSISTING OF A SUBSTRATE AND A REACTION LAYER, AND DEVICE FOR PERFORMING SUCH A METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P10/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/50</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾納　艾瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THALLNER, ERICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩爾納　艾瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THALLNER, ERICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉換方法，用於將佈置於基板（1，1’）處及/或嵌入基板（1,1’）中之結構（2’,2）從實際狀態轉換至目標狀態，包含：提供具有處於該實際狀態之結構（2’，2）的基板（1，1’），提供至少一反應層（5r），實現至少一反應層（5r）與基板（1,1’）之間的操作性連接，其中操作性連接經配置使得至少一反應層（5r）中的變化狀態引起基板（1,1’）中的形變，藉由影響方式（8）觸發至少一反應層（5r）中之變化狀態，其中至少一反應層（5r）中之變化狀態以局部受限之方式引起，使得結構（2’，2）從實際狀態轉換至目標狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for transferring a structure (2’, 2) arranged at a substrate (1, 1’) and/or embedded in the substrate (1, 1’), from an actual state to a target state, comprising: providing the substrate (1, 1’) having the structure (2’, 2) in the actual state, providing at least one reaction layer (5r), realizing an operative connection between the at least one reaction layer (5r) and the substrate (1, 1’), wherein the operative connection is configured such that a change state in the at least one reaction layer (5r) causes a deformation in the substrate (1, 1'), triggering the change state in the at least one reaction layer (5r) by means of an influencing means (8), wherein the change state in the at least one reaction layer (5r) is caused locally limited such that the structure (2’, 2) is transferred from the actual state to the target state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1’:基板</p>  
        <p type="p">2’:結構</p>  
        <p type="p">3:層系統</p>  
        <p type="p">5:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1660" publication-number="202620010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法、感放射線性酸產生劑及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C25/18</main-classification>  
        <further-classification edition="200601120260223B">C07C381/00</further-classification>  
        <further-classification edition="200601120260223B">C07C381/12</further-classification>  
        <further-classification edition="200601120260223B">C07D307/93</further-classification>  
        <further-classification edition="200601120260223B">C07D317/70</further-classification>  
        <further-classification edition="200601120260223B">C07D317/72</further-classification>  
        <further-classification edition="200601120260223B">C07D327/08</further-classification>  
        <further-classification edition="200601120260223B">C07D497/10</further-classification>  
        <further-classification edition="200601120260223B">C09K3/00</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄川冬輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAWA, FUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於圖案形成時感度、LWR及CDU優異的感放射線性組成物、圖案形成方法、感放射線性酸產生劑及化合物。一種感放射線性組成物，含有：具有下述式（i）所表示的部分結構的鎓鹽、具有包含酸解離性基的結構單元（I）的聚合物、及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="204px" width="325px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（i）中，X&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;為S&lt;sup&gt;-&lt;/sup&gt;或O&lt;sup&gt;-&lt;/sup&gt;；X&lt;sub&gt;2&lt;/sub&gt;及X&lt;sub&gt;3&lt;/sub&gt;分別獨立地為S或O；其中，於選自由X&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、X&lt;sub&gt;2&lt;/sub&gt;及X&lt;sub&gt;3&lt;/sub&gt;所組成的群組中的至少一個中包含S；Z&lt;sup&gt;+&lt;/sup&gt;為有機陽離子；*分別為與所述鎓鹽中的其他原子的鍵結鍵）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1661" publication-number="202620917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子束阻擋裝置及半導體製程設備</chinese-title>  
        <english-title>ION BEAM BLOCKING DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/05</main-classification>  
        <further-classification edition="200601120260223B">H01J37/32</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田甲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種離子束阻擋裝置及半導體製程設備，該離子束阻擋裝置包括沿離子運動方向依次設置，且彼此電絕緣的離子篩選件和離子收集件；離子篩選件和離子收集件之間形成封閉空間，離子篩選件具有多個用於供離子通過的篩選孔，篩選孔與封閉空間連通；在離子篩選件和離子收集件分別被施加正電位和負電位的情況下，在封閉空間中形成的電場能夠引導離子穿過篩選孔進入封閉空間中，並向離子收集件運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an ion beam blocking device and semiconductor process equipment. The ion beam blocking device includes an ion screening element and an ion collecting element which are sequentially arranged along the direction of ion movement and electrically insulated from each other. A closed space is formed between the ion screening element and the ion collecting element. The ion screening element has a plurality of screening holes for ions to pass through, and the screening holes are connected to the closed space. When the ion screening element and the ion collecting element are applied with a positive potential and a negative potential respectively, the electric field formed in the closed space can guide the ions to pass through the screening holes into the closed space, and the ions move toward the ion collecting element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:離子篩選件</p>  
        <p type="p">101a:篩選孔</p>  
        <p type="p">102:離子收集件</p>  
        <p type="p">102a:弧形凹面</p>  
        <p type="p">103:封閉空間</p>  
        <p type="p">104:第一絕緣件</p>  
        <p type="p">105:接地件</p>  
        <p type="p">105a:內周部分</p>  
        <p type="p">106:第二絕緣件</p>  
        <p type="p">109:第二固定孔</p>  
        <p type="p">110:定位凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1662" publication-number="202620076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高分子化合物及組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F212/08</main-classification>  
        <further-classification edition="200601120251201B">C08F212/12</further-classification>  
        <further-classification edition="200601120251201B">C08F120/22</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/34</further-classification>  
        <further-classification edition="200601120251201B">C08F8/32</further-classification>  
        <further-classification edition="200601120251201B">C08L33/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商捷恩智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JNC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商捷恩智石油化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JNC PETROCHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>氏家研人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UJIIYE, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀山奈央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEYAMA, NAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎木信雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOKI, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本泰弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示是有關於一種於溶解於包含在分子中具有碳酸酯結構的化合物的溶媒中時可獲得具有下限臨界溶液溫度的溶液的高分子化合物。該高分子化合物較佳為於分子中包含相對於每一分子而為10個單元以上且500個單元以下的式（1）所表示的構成單元A，R&lt;sup&gt;1&lt;/sup&gt;為氫原子或甲基，Z&lt;sup&gt;1&lt;/sup&gt;為-COO-或-OCO-，Z&lt;sup&gt;2&lt;/sup&gt;為碳數1以上且8以下的伸烷基，且L&lt;sup&gt;1&lt;/sup&gt;為陽離子性基並且L&lt;sup&gt;2&lt;/sup&gt;為陰離子，或者L&lt;sup&gt;1&lt;/sup&gt;為陰離子性基並且L&lt;sup&gt;2&lt;/sup&gt;為陽離子。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="229px" width="224px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1663" publication-number="202621118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數據流的認證</chinese-title>  
        <english-title>AUTHENTICATION OF DATA STREAMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260209B">H04N19/46</main-classification>  
        <further-classification edition="201301120260209B">G06F21/64</further-classification>  
        <further-classification edition="201401120260209B">H04N19/70</further-classification>  
        <further-classification edition="201101120260209B">H04N21/2389</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗勞恩霍夫爾協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕雅夫　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFAFF, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛茲　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINZ, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇荷寧　卡斯登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEHRING, KARSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瓦茲　希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZ, HEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史庫濱　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKUPIN, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏契茲德拉富恩特　雅構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑爾吉　寇尼拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELLGE, CORNELIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏以爾　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIERL, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬皮　迪特利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARPE, DETLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛德　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於檢查數據流的可信度的裝置和方法。根據一方面，在數據流的可信度中考慮一個或多個補充資訊訊息。根據另一方面，數據流指示某個段是否是指派段序列中的第一段或者某個段是否是指派段序列中的最後段。根據另外段，數據流的某些部分內的某些補充資訊訊息的重複不包括在可信度檢查中或者在數據流中被禁止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatuses and methods for checking a data stream on trustworthiness are described. According to an aspect, one or more supplemental information messages are considered in the trustworthiness of a data stream. According to another aspect, the data stream indicates, whether a segment is a first segment or whether a segment is a last segment of assigned sequence of segments. According to further segments, repetitions of certain supplemental information messages within certain portions of a data stream are either not included in the trustworthiness check, or are forbidden in the data stream.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:預定部分</p>  
        <p type="p">14:數據流</p>  
        <p type="p">16:有效載荷封包；數據流</p>  
        <p type="p">18:補充資訊封包</p>  
        <p type="p">19:補充資訊訊息</p>  
        <p type="p">20:裝置；解碼器</p>  
        <p type="p">21:提取器</p>  
        <p type="p">30:部分確定器</p>  
        <p type="p">41:驗證模組</p>  
        <p type="p">43:數位簽名</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1664" publication-number="202619673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備的控制方法、控制裝置、清潔設備、電腦程式產品及電腦可讀儲存媒體</chinese-title>  
        <english-title>CONTROL METHOD OF CLEANING APPARATUS, CONTROL DEVICE, CLEANING APPARATUS, COMPUTER PROGRAM PRODUCT AND COMPUTER READABLESTORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">A47L11/40</main-classification>  
        <further-classification edition="202401120260205B">G05D1/622</further-classification>  
        <further-classification edition="202001120260205B">G01S17/931</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金國軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, GUOJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李寶玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BAOYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開應用於清潔設備技術領域，提供了一種清潔設備的控制方法、裝置、清潔設備及程式產品。該控制方法包括：獲取清潔設備的第一雷達資料和第二雷達資料，其中，該第一雷達資料和第二雷達資料為清潔設備基於不同的探測範圍得到的，探測範圍包括：探測方向和/或探測距離；基於第一雷達資料和第二雷達資料，確定清潔設備是否滿足防撞觸發條件；回應於清潔設備滿足防撞觸發條件，觸發清潔設備執行防撞動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is applied to the technical field of cleaning apparatus, and provides a method of controlling cleaning apparatus, a device, a cleaning apparatus and a program product. The method comprises: acquiring first radar data and second radar data of the cleaning apparatus, wherein the first radar data and the second radar data are obtained by the cleaning apparatus based on different detection ranges, and the detection ranges comprise: a detection direction and/or a detection distance; determining whether the cleaning apparatus satisfies a collision avoidance trigger condition based on the first radar data and the second radar data; and in response to the cleaning apparatus satisfying the collision avoidance trigger condition, triggering the cleaning apparatus to execute a collision avoidance action.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S601、S602、S603:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1665" publication-number="202619674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可移動設備的控制方法、控制裝置、可移動設備、可讀儲存媒體及電腦程式產品</chinese-title>  
        <english-title>CONTROL METHOD AND CONTROL APPARATUS FOR MOVABLE DEVICE, MOVABLE DEVICE, READABLE STORAGE MEDIUM AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">A47L11/40</main-classification>  
        <further-classification edition="202401120260205B">G05D1/648</further-classification>  
        <further-classification edition="200601120260205B">B25J9/16</further-classification>  
        <further-classification edition="202201120260205B">G06V20/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供了一種可移動設備的控制方法、裝置、可移動設備和儲存媒體，涉及智能家居領域。可移動設備包括設備本體、機械臂以及設置於機械臂的第一攝像頭，機械臂設置於設備本體，可移動設備的控制方法包括：獲取可移動設備的巡航任務資訊，巡航任務資訊中至少包括巡航點位置；控制可移動設備沿巡航點位置形成的巡航路徑移動，以及在到達任一巡航點位置時，控制目標攝像頭拍攝巡航點位置的巡航圖像，目標攝像頭至少包括第一攝像頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a control method and a control apparatus for a movable device, a movable device, and a storage medium, and relates to the field of smart home. The movable device includes a device body, a mechanical arm, and a first camera arranged on the mechanical arm. The mechanical arm is arranged on the device body. The control method for the movable device includes: acquiring cruise task information of the movable device, wherein the cruise task information at least includes cruise point locations; controlling the movable device to move along a cruise path formed by the cruise point locations, and upon arriving at any cruise point location, controlling a target camera to capture a cruise image of the cruise point location, wherein the target camera at least includes the first camera.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201、S202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1666" publication-number="202620926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄片孔溝槽填充方法</chinese-title>  
        <english-title>LAMELLA HOLE TRENCH FILL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260208B">H01J37/305</main-classification>  
        <further-classification edition="200601120260208B">G01N1/44</further-classification>  
        <further-classification edition="200601120260208B">H01J37/20</further-classification>  
        <further-classification edition="200601120260208B">C23C14/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托東尼恩　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTONJIAN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路伊　查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUE, CHAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米奇森　賈文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITCHSON, GAVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里夫蘭　麥特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEVELAND, MATT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於薄片製備之領域，且特別是關於一種填充在薄片製備期間所形成的孔之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the field of lamella preparation, and in particular to a method of filling holes formed during lamella preparation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1667" publication-number="202620910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換器及其電感器組件</chinese-title>  
        <english-title>POWER CONVERTER AND INDUCTOR ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260109B">H01F27/28</main-classification>  
        <further-classification edition="200601120260109B">H02M3/04</further-classification>  
        <further-classification edition="200601120260109B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種電源電源轉換器，包括電感器組件和兩個電源晶片。該電感器組件包括共用磁芯以形成耦合電感器的兩個線圈。每個線圈包括主體、第一部分、第二部分，其主體向電感器組件的頂面延伸，其第一部分延伸至所述電感器組件的底面以形成該線圈的第一端，其第二部分延伸至所述電感器組件的底面以形成該線圈的第二端。每個電源晶片包括一對開關，該對開關形成的開關節點電連接至對應線圈的第一端，該對應線圈的第二端提供輸出電壓。該兩個線圈之間具有部分重疊區域，用於決定該耦合電感器之間的耦合係數。本發明的電感器組件根據線圈間的部分重疊區域來決定線圈間的耦合係數，從而減小了線圈的間距，使本發明的電源電源轉換器具有緊密、高效率的優勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power converter is disclosed, comprising an inductor assembly and two power dies. The inductor assembly comprises two windings sharing a common magnetic core to form coupled inductors. Each winding has a main body, a first portion, and a second portion, wherein the main body extends toward a top surface of the inductor assembly, the first portion extends toward a bottom surface of the inductor assembly to form a first end of the winding, and the second portion extends toward the bottom surface of the inductor assembly to form a second end of the winding. Each power die has a pair of switches, with a switch node formed by the pair of switches electrically connected to the first end of the corresponding winding. The second end of the corresponding winding is configured to provide an output voltage. A partially overlapped region exists between the two windings is configured to determine a coupling coefficient between the coupled inductors. In the inductor assembly of the present disclosure, the partially overlapped region between the windings determines the coupling coefficient between the windings, thereby reducing a space between the windings. Therefore, the power converter of the present disclosure has the advantages of compactness and high efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:電感器組件</p>  
        <p type="p">30-1:側面</p>  
        <p type="p">30-2:側面</p>  
        <p type="p">30-3:側面</p>  
        <p type="p">30-4:側面</p>  
        <p type="p">30-5:側面</p>  
        <p type="p">30-6:側面</p>  
        <p type="p">301:磁芯</p>  
        <p type="p">302:線圈</p>  
        <p type="p">302-1:主體</p>  
        <p type="p">302-2:部分</p>  
        <p type="p">302-3:部分</p>  
        <p type="p">303:線圈</p>  
        <p type="p">303-1:主體</p>  
        <p type="p">303-2:部分</p>  
        <p type="p">303-3:部分</p>  
        <p type="p">311:頂面</p>  
        <p type="p">312:底面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1668" publication-number="202620669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>稀疏向量處理方法及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G06F17/16</main-classification>  
        <further-classification edition="202301120260210B">G06N3/0495</further-classification>  
        <further-classification edition="201801120260210B">G06F9/44</further-classification>  
        <further-classification edition="200601120260210B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商墨子國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昶旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴恩勖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, IAN ENXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王育博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明闡述稀疏向量處理方法及系統。該稀疏向量處理方法包括：藉由用輸出遮罩對第一輸入向量進行聚集來產生第一密集資料；以及藉由用向量算術邏輯單元對第一密集資料及立即數或者對第一密集資料及第二密集資料進行操作來產生輸出向量，其中，第二密集資料係藉由用輸出遮罩對第二輸入向量進行聚集產生的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S102-1:步驟</p>  
        <p type="p">S102-2:步驟</p>  
        <p type="p">S102-3:步驟</p>  
        <p type="p">S104-1:步驟</p>  
        <p type="p">S104-2:步驟</p>  
        <p type="p">S104-3:步驟</p>  
        <p type="p">S106-1:步驟</p>  
        <p type="p">S106-2:步驟</p>  
        <p type="p">S108-1:步驟</p>  
        <p type="p">S108-2:步驟</p>  
        <p type="p">S110-1:步驟</p>  
        <p type="p">S110-2:步驟</p>  
        <p type="p">S112-1:步驟</p>  
        <p type="p">S112-2:步驟</p>  
        <p type="p">S114-1:步驟</p>  
        <p type="p">S114-2:步驟</p>  
        <p type="p">S116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1669" publication-number="202620625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理器核心</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">G06F9/06</main-classification>  
        <further-classification edition="200601120260212B">G06F13/14</further-classification>  
        <further-classification edition="200601120260212B">G06F12/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商墨子國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昶旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅江華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, JIANGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請係關於一種處理器核心，其包括多個處理器元件群組、多個直接記憶體存取引擎以及多個末級快取記憶體。作為多個處理器元件群組中之任意一個處理器元件群組之第一處理器元件群組包括多個處理器元件。作為多個處理器元件中之任意一個處理器元件之第一處理器元件包括第一直接記憶體存取控制器。第一直接記憶體存取控制器經組態以基於第一原始指令產生第一代理請求並且向多個直接記憶體存取引擎中的與第一處理器元件群組相對應之第一直接記憶體存取引擎發送第一代理請求。第一直接記憶體存取引擎經組態以基於第一代理請求自多個末級快取記憶體中的與第一直接記憶體存取引擎相對應之第一末級快取記憶體讀取資料並且將所讀取資料提供給第一處理器元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理器核心</p>  
        <p type="p">102:處理單元陣列</p>  
        <p type="p">104:直接記憶體存取引擎</p>  
        <p type="p">106:交叉開關</p>  
        <p type="p">108-1:末級快取記憶體</p>  
        <p type="p">108-2:末級快取記憶體</p>  
        <p type="p">108-3:末級快取記憶體</p>  
        <p type="p">108-4:末級快取記憶體</p>  
        <p type="p">110:交叉開關</p>  
        <p type="p">112-1:雙倍資料速率實體層介面</p>  
        <p type="p">112-2:雙倍資料速率實體層介面</p>  
        <p type="p">112-3:雙倍資料速率實體層介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1670" publication-number="202621350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於調整約瑟夫森接面的電阻的方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR TUNING THE RESISTANCE OF A JOSEPHSON JUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260208B">H10N60/12</main-classification>  
        <further-classification edition="200601120260208B">G01R27/02</further-classification>  
        <further-classification edition="202201120260208B">G06N10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商牛津量子電路有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OXFORD QUANTUM CIRCUITS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘迺迪　奧斯卡威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENNEDY, OSCAR WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝利　康納丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHELLY, CONNOR DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於調整一約瑟夫森接面之電阻之系統，該系統包含調整電壓之一源及一量測單元，該源經組態以跨該約瑟夫森接面施加作為一交流電壓之該調整電壓以允許該約瑟夫森接面達到一目標電阻，該量測單元經組態以使用該調整電壓來量測該約瑟夫森接面之該電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for tuning the resistance of a Josephson Junction, the system comprising a source of tuning voltage and a measurement unit, the source being configured to apply the tuning voltage which is an alternating voltage across the Josephson Junction to allow the Josephson Junction to reach a target resistance, the measurement unit being configured to measure the resistance of the Josephson Junction using the tuning voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:低電壓探測量測/量測電壓</p>  
        <p type="p">33:高電壓量測/量測電壓</p>  
        <p type="p">35:升高</p>  
        <p type="p">37:高溫</p>  
        <p type="p">39:探針電壓V&lt;sub&gt;p&lt;/sub&gt;/低電壓探測量測/量測電壓</p>  
        <p type="p">41:調整電壓</p>  
        <p type="p">43:探針電壓V&lt;sub&gt;p&lt;/sub&gt;/低電壓探測量測/量測電壓</p>  
        <p type="p">45:冷卻</p>  
        <p type="p">47:探針電壓/量測電壓/低電壓探測量測</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1671" publication-number="202620848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體系統及其製造方法以及被配置成對半導體組件進行電性連接的裝置</chinese-title>  
        <english-title>SEMICONDUCTOR SYSTEM AND MANUFACTURING METHOD THEREOF AND DEVICE CONFIGURED TO ELECTRICAL CONNECT SEMICONDUCTOR COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C5/02</main-classification>  
        <further-classification edition="200601120260223B">G11C11/40</further-classification>  
        <further-classification edition="202501120260223B">H10D62/10</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬蒂諾　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEAU, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體系統及製造半導體系統的方法以及被配置成對半導體組件進行電性連接的裝置。半導體系統可包括多個組件，其中組件及其連接區的尺寸及/或關係符合使得組件及其互連件能夠以各種配置組裝於一起的設計規則。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor systems and methods of manufacturing the semiconductor systems and a device configured to electrical connect semiconductor components are provided. The semiconductor systems may include a plurality of components, wherein dimensions and/or relationships of the components and their connection regions conform with design rules that enable the components and their interconnectors to be assembled together in various configurations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:組件</p>  
        <p type="p">2:本體</p>  
        <p type="p">2_L:下表面</p>  
        <p type="p">2_U:上表面</p>  
        <p type="p">10:連接區</p>  
        <p type="p">T:厚度</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1672" publication-number="202621249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括通孔的半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B12/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李定烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNGRYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權烔煇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, DONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的範例實施例的半導體裝置可包括：第一結構；以及第二結構，具有周邊電路區域，且第一結構可包括：記憶體單元；以及單元佈線互連線，電性連接到記憶體單元，且第二結構可包括：半導體本體；後絕緣層，設置在半導體本體的下表面上；第一周邊電晶體；第一穿透絕緣圖案，穿透半導體本體；以及通孔，穿透第一穿透絕緣圖案並電性連接到單元佈線互連線，且第一穿透絕緣圖案可包括第一絕緣圖案，其包括鄰近後絕緣層的第一部分和設置在第一部分上的第二部分，以及第二絕緣圖案，其設置在第二部分的側表面和半導體本體之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device according to example embodiments of the present disclosure may include: a first structure; and a second structure having a peripheral circuit region, and the first structure may include: memory cells; and a cell routing interconnection line electrically connected to the memory cells, and the second structure may include: a semiconductor body; a rear insulating layer disposed on a lower surface of the semiconductor body; a first peripheral transistor; a first through-insulating pattern penetrating through the semiconductor body; and a through-via penetrating through the first through-insulating pattern and electrically connected to the cell routing interconnection line, and the first through-insulating pattern may include a first insulating pattern including a first portion adjacent to the rear insulating layer and a second portion disposed on the first portion, and a second insulating pattern disposed between a side surface of the second portion and the semiconductor body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:第一絕緣層</p>  
        <p type="p">13:第五絕緣層</p>  
        <p type="p">49:第四阻障絕緣層</p>  
        <p type="p">35:第三水平互連線</p>  
        <p type="p">40:第三垂直通孔</p>  
        <p type="p">45:上層互連線</p>  
        <p type="p">30:第二垂直通孔</p>  
        <p type="p">25:第二水平互連線</p>  
        <p type="p">20:第一垂直通孔</p>  
        <p type="p">17:第一水平互連線</p>  
        <p type="p">70:周邊佈線互連線</p>  
        <p type="p">48:第四層間絕緣層</p>  
        <p type="p">41:第三阻障絕緣層</p>  
        <p type="p">38:第三層間絕緣層</p>  
        <p type="p">32:第二阻障絕緣層</p>  
        <p type="p">28:第二層間絕緣層</p>  
        <p type="p">21:第一阻障絕緣層</p>  
        <p type="p">19:第一層間絕緣層</p>  
        <p type="p">18:下絕緣結構</p>  
        <p type="p">15:垂直插塞</p>  
        <p type="p">31:後絕緣層</p>  
        <p type="p">60:通孔</p>  
        <p type="p">12:第四絕緣層</p>  
        <p type="p">11:第三絕緣層</p>  
        <p type="p">10:第二絕緣層</p>  
        <p type="p">133:接觸結構</p>  
        <p type="p">101:半導體本體</p>  
        <p type="p">134:插塞部分</p>  
        <p type="p">135:焊墊部分</p>  
        <p type="p">152:第二導電層</p>  
        <p type="p">150:第一導電層</p>  
        <p type="p">130:第二元件隔離圖案</p>  
        <p type="p">120:第一元件隔離圖案</p>  
        <p type="p">110:第一穿透絕緣圖案</p>  
        <p type="p">170:單元佈線互連線</p>  
        <p type="p">175:位元線接觸插塞</p>  
        <p type="p">161:第一電極</p>  
        <p type="p">162:介電層</p>  
        <p type="p">163:第二電極</p>  
        <p type="p">139:電容器互連線</p>  
        <p type="p">136:電容器通孔</p>  
        <p type="p">ST2:第二結構</p>  
        <p type="p">ST1:第一結構</p>  
        <p type="p">pGE:周邊閘極</p>  
        <p type="p">pGO:周邊閘極/周邊閘極介電層</p>  
        <p type="p">pSD:周邊源極/汲極區域</p>  
        <p type="p">pCH:周邊通道區域</p>  
        <p type="p">pTR:周邊電晶體</p>  
        <p type="p">SL:屏蔽導電結構</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">cACT:單元主動區域</p>  
        <p type="p">cSD1:第一單元源極/汲極區域</p>  
        <p type="p">cCH:單元通道區域</p>  
        <p type="p">cSD2:第二單元源極/汲極區域</p>  
        <p type="p">I-I’:線</p>  
        <p type="p">pTR:周邊電晶體</p>  
        <p type="p">“A”:區域</p>  
        <p type="p">pACT:周邊主動區域</p>  
        <p type="p">cTR:單元電晶體</p>  
        <p type="p">BG:背閘極線</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">DS:資訊儲存結構</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1673" publication-number="202621504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板</chinese-title>  
        <english-title>PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/60</main-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification>  
        <further-classification edition="202601120260223B">H10W44/20</further-classification>  
        <further-classification edition="200601120260223B">H05K1/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　性振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例的封裝基板為包括玻璃芯、上部重佈線層及下部重佈線層的封裝基板，玻璃芯為配置有穿孔的板狀玻璃，上部重佈線層配置於玻璃芯的上部，下部重佈線層配置於玻璃芯的下部。重佈線層包括佈線層及絕緣層，佈線層由具有晶粒的銅層圖案化而成，在上部重佈線層的上部設有上部面，在上部面安裝有電子元件。C為在配置於上部重佈線層的佈線層中長軸與短軸之比為3:1以上的晶粒的面積比，D為在配置於下部重佈線層的佈線層中長軸與短軸之比為3:1以上的晶粒的面積比。封裝基板的C除以D的值為0.85以上且0.99以下。實例可以提供通過控制配置於佈線層的銅的晶體結構等來提高信號完整性，並減少傳輸高頻信號時發生的電磁干擾等問題的封裝基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment provides a packaging substrate comprising: a glass core; an upper redistribution layer; and a lower redistribution layer, wherein the glass core is a plate-shaped glass in which vias are arranged, the upper redistribution layer is disposed above the glass core, and the lower redistribution layer is disposed below the glass core. The redistribution layer comprises a wiring layer and an insulating layer, the wiring layer being a patterned copper layer having grains, and an upper surface is positioned on the top of the upper redistribution layer, the upper surface being configured for mounting an electronic device thereon. C is an area ratio of grains having a major axis to minor axis ratio of 3:1 or greater in the wiring layer disposed in the upper redistribution layer, and D is an area ratio of grains having a major axis to minor axis ratio of 3:1 or greater in the wiring layer disposed in the lower redistribution layer. A value obtained by dividing C by D in the packaging substrate is 0.85 or more and 0.99 or less. The embodiment can provide a packaging substrate capable of improving signal integrity and reducing issues such as electromagnetic interference even during high-frequency signal transmission by controlling the crystal structure of copper disposed in the wiring layer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1674" publication-number="202621152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法和通信裝置</chinese-title>  
        <english-title>COMMUNICATION METHODS AND DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W48/16</main-classification>  
        <further-classification edition="202301120251201B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖后飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, HOUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種通信方法和通信裝置，該方法包括：接收來自第二設備的信道掃描信息，該信道掃描信息包括該第二設備對至少一個第一信道進行信道掃描所獲取的該至少一個第一信道中每個第一信道對應的信道信息；向該第二設備發送信道指示信息，該信道指示信息指示至少一個第二信道，該至少一個第二信道包括推薦的該第二設備待接入的信道，該第二信道是基於該信道掃描信息確定的。通過接收第二設備的信道掃描信息，該第一設備可以向該第二設備指示至少一個推薦的信道，從而可以使得該第二設備合理利用頻譜資源，提升頻譜資源利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a communication method and communication device, the method comprising: receiving channel scanning information from a second device, the channel scanning information including channel information corresponding to each first channel in at least one first channel obtained by the second device through channel scanning of the at least one first channel; Sending channel indication information to the second device, the channel indication information indicating at least one second channel, the at least one second channel including a recommended channel to be accessed by the second device, the second channel being determined based on the channel scanning information. By receiving channel scanning information from the second device, the first device can indicate at least one recommended channel to the second device, thereby enabling the second device to make reasonable use of spectrum resources and improve spectrum resource utilization.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401、S410、S420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1675" publication-number="202619827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用雷射光束偏轉系統基板切割方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260223B">B23K26/064</main-classification>  
        <further-classification edition="200601120260223B">B23K26/067</further-classification>  
        <further-classification edition="201401120260223B">B23K26/042</further-classification>  
        <further-classification edition="200601120260223B">B23K26/18</further-classification>  
        <further-classification edition="201401120260223B">B23K26/364</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛捧浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUL, BONG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鐘範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONGBUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹星進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, SUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹會淨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HOI JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全轃標</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, JIN PYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明實施例的基板切割方法，包括：在包括基板及佈線層的基板上形成保護膜的步驟；執行雷射開槽製程，以去除所述佈線層的至少一部分，從而使所述基板暴露的步驟；執行劃片製程，以切割暴露的所述基板的步驟；以及去除所述保護膜的步驟，其中，所述雷射開槽製程藉由雷射光束偏轉系統執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:雷射光束偏轉系統</p>  
        <p type="p">100:雷射裝置</p>  
        <p type="p">110:雷射發射部</p>  
        <p type="p">120:聲光偏轉器</p>  
        <p type="p">130:掃描器</p>  
        <p type="p">200:載台</p>  
        <p type="p">300:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1676" publication-number="202621383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/60</main-classification>  
        <further-classification edition="202601120260223B">H10P95/70</further-classification>  
        <further-classification edition="200601120260223B">B08B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本将也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, SHOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根本脩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMOTO, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種機構，其於噴嘴配置於基板之下方之基板處理裝置中，可進行噴嘴之位置調整，且可容易地進行更換零件時之維護作業。基板處理裝置具備噴嘴機構。噴嘴機構具備兩個以上具有噴嘴本體、與使噴嘴本體於基板之半徑方向往復移動之噴嘴驅動部之噴嘴部、以及統一支持兩個以上噴嘴部之支持部，支持部可不取下該支持部而將噴嘴部各者獨立裝卸地支持，於支持部及噴嘴部各者之噴嘴驅動部，設置有用於規定兩個以上噴嘴部各者相對於支持部之位置之凹凸形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:噴嘴塊(噴嘴機構)</p>  
        <p type="p">51,51A~51C:處理液噴出噴嘴部(噴嘴部)</p>  
        <p type="p">52:噴嘴本體</p>  
        <p type="p">53:噴嘴驅動部</p>  
        <p type="p">54:支持基座(支持部)</p>  
        <p type="p">511:噴嘴部下表面</p>  
        <p type="p">521:噴出口</p>  
        <p type="p">534:殼體</p>  
        <p type="p">538:小耳部</p>  
        <p type="p">538a:螺紋孔</p>  
        <p type="p">541:基座上表面</p>  
        <p type="p">541a:支持面</p>  
        <p type="p">542:大耳部</p>  
        <p type="p">542a:螺紋孔</p>  
        <p type="p">544:隔板</p>  
        <p type="p">544b:第2螺紋孔</p>  
        <p type="p">548:螺釘</p>  
        <p type="p">560:凹凸形狀</p>  
        <p type="p">561a:定位銷</p>  
        <p type="p">561b:銷孔</p>  
        <p type="p">582:螺母部</p>  
        <p type="p">585:管子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1677" publication-number="202620578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於影響氣體流動的閥門裝置和流體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">G05D16/20</main-classification>  
        <further-classification edition="200601120260214B">G05D7/06</further-classification>  
        <further-classification edition="200601120260214B">F16K31/02</further-classification>  
        <further-classification edition="200601120260214B">F16K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商菲斯特歐洲股份兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FESTO SE &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾柏　沃訥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBER, WERNER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑格勒　莉娜卡塔琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAEGELE, LENA KATHARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基爾布　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KILB, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLASSEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於影響氣體流動的閥門裝置(11；61)，包括配置一閥殼體(17；67)，其中形成一流體通道(40；90)，由一入口接頭(18；68)延伸至一工作接頭(19；69)，且一被容納於流體通道(40；90)內的閥構件(37；87)，其能在一第一功能位置及一第二功能位置之間活動，及一驅動裝置(38；88)，其配置對閥構件(37；87)施加運動，及一操控器(12；62)，將能量提供至驅動裝置(38；88)，及一感測器裝置，包括一入口壓力感測器(21)及一工作壓力感測器(22；72)，且與操控器(12；62)電性連接，操控器(12；62)配置對驅動裝置(38；88)進行受控控制，以執行壓力、流量或質流量控制，其中操控器(12；62)配置將出口信號提供至通信介面(28；78)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:流體系統</p>  
        <p type="p">2:操控器</p>  
        <p type="p">3:吸管尖</p>  
        <p type="p">4:壓縮空氣源</p>  
        <p type="p">5:消音器</p>  
        <p type="p">6:通信導線</p>  
        <p type="p">7:工作管線</p>  
        <p type="p">8:供應管線</p>  
        <p type="p">9:排氣管線</p>  
        <p type="p">11:閥門裝置</p>  
        <p type="p">12:操控器</p>  
        <p type="p">13:感測器導線</p>  
        <p type="p">14:感測器導線</p>  
        <p type="p">15:感測器導線</p>  
        <p type="p">16:感測器導線</p>  
        <p type="p">17:閥殼體</p>  
        <p type="p">18:入口接頭</p>  
        <p type="p">19:工作接頭</p>  
        <p type="p">20:出口接頭</p>  
        <p type="p">21:相對壓力感測器</p>  
        <p type="p">22:相對壓力感測器</p>  
        <p type="p">23:相對壓力感測器</p>  
        <p type="p">24:絕對壓力感測器</p>  
        <p type="p">25:量測導線</p>  
        <p type="p">26:量測導線</p>  
        <p type="p">27:量測導線</p>  
        <p type="p">28:通信介面</p>  
        <p type="p">29:操控導線</p>  
        <p type="p">30:操控導線</p>  
        <p type="p">31:磁閥</p>  
        <p type="p">32:磁閥</p>  
        <p type="p">37:閥構件</p>  
        <p type="p">38:驅動裝置</p>  
        <p type="p">40:流體通道</p>  
        <p type="p">41:流體管線</p>  
        <p type="p">42:流體管線</p>  
        <p type="p">43:流體管線</p>  
        <p type="p">44:流體管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1678" publication-number="202620184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔組合物和使用其製造半導體裝置的方法</chinese-title>  
        <english-title>CLEANING COMPOSITION AND METHOD OF PREPARING SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C11D7/08</main-classification>  
        <further-classification edition="200601120260223B">C11D7/10</further-classification>  
        <further-classification edition="200601120260223B">C11D7/26</further-classification>  
        <further-classification edition="200601120260223B">C11D7/32</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東友精細化工有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGWOO FINE-CHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鐘旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, JONG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李基宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GI WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種清潔組合物和使用其製造半導體裝置的方法。根據本發明實施方式的清潔組合物包含氟基化合物；有機酸鹽化合物；無機酸化合物；以及水，其中，基於所述組合物的總重量，水的含量為至少50重量%，所述清潔組合物具有0.5~4的pH。該清潔組合物可以對於透過高能製程轉化的光阻殘留物具有高清潔能力，而且不蝕刻包含金屬(例如Mo、W、Ru等)的佈線以及例如氧化矽層和氮化矽層的層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a cleaning composition and a method for manufacturing a semiconductor device using the same. The cleaning composition according to embodiments of the present invention includes a fluorine-based compound, an organic acid salt compound, an inorganic acid compound, and water, wherein water is present in an amount of at least 50 wt% based on the total weight of the composition, and the cleaning composition has a pH of 0.5 to 4. The cleaning composition can have a high cleaning capability for removing transformed photoresist residues generated through high-energy process, and does not etch wiring including metals (e.g., Mo, W, Ru, etc.) and layers such as a silicon oxide layer and a silicon nitride layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">115:靶心圖表案</p>  
        <p type="p">135:殘留物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1679" publication-number="202621417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>勻流結構、製程腔室及半導體製程設備</chinese-title>  
        <english-title>FLOW UNIFORMITY STRUCTURE, PROCESS CHAMBER AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮呂晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, LV CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種勻流結構、製程腔室及半導體製程設備，勻流結構包括：勻流本體，設置有進氣勻流孔、第一勻流腔和多個出氣勻流孔，進氣勻流孔和出氣勻流孔分別位於第一勻流腔的兩側，並與第一勻流腔連通；環形擋板，活動設置於第一勻流腔中；沿環形擋板的軸向投影方向上，進氣勻流孔的投影和部分出氣勻流孔的投影位於環形擋板的內圈內，另一部分出氣勻流孔的投影位於環形擋板上。本申請可以對流場分佈進行調節，提高製程氣體的利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flow uniformity structure, a process chamber and semiconductor process equipment are provided. The flow uniformity structure includes a uniform flow body, provided with an inlet uniform flow hole, a first uniform flow cavity, and multiple outlet uniform flow holes, wherein the inlet uniform flow hole and the outlet uniform flow holes are respectively located on either side of the first uniform flow cavity and are connected to the first uniform flow cavity. The flow uniformity structure further includes an annular baffle, movably disposed in the first uniform flow cavity. Along the axial projection direction of the annular baffle, the projections of the inlet uniform flow hole and some of the outlet uniform flow holes are located within the inner circle of the annular baffle, and the projections of the other part of the outlet uniform flow holes are located on the annular baffle. This present application can adjust the flow field distribution and improve the utilization rate of process gases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:隔環</p>  
        <p type="p">20:進氣勻流板</p>  
        <p type="p">21:進氣勻流孔</p>  
        <p type="p">30:出氣勻流板</p>  
        <p type="p">31:出氣勻流孔</p>  
        <p type="p">40:環形擋板</p>  
        <p type="p">50:驅動機構</p>  
        <p type="p">51:導向桿</p>  
        <p type="p">52:驅動源</p>  
        <p type="p">100a:勻流本體</p>  
        <p type="p">101:大尺寸晶圓</p>  
        <p type="p">102:小尺寸晶圓</p>  
        <p type="p">110:第一勻流腔</p>  
        <p type="p">120:第二勻流腔</p>  
        <p type="p">300:上蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1680" publication-number="202620227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>襯底處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C23C16/42</main-classification>  
        <further-classification edition="200601120260223B">C23F1/16</further-classification>  
        <further-classification edition="202601120260223B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種襯底處理方法，涉及半導體製造技術領域，所述處理方法包括：提供具有凸起部和溝槽的襯底，所述凸起部的表面具有第一氧化層；濕法刻蝕所述襯底，清除所述第一氧化層；在所述襯底上形成第二氧化層，其中，所述第二氧化層的厚度小於所述第一氧化層的厚度；清洗所述襯底；對所述襯底進行乾燥處理。本方法通過清除第一氧化層並重新生成第二氧化層，清除第一氧化層的刻蝕難度極大降低，如可通過提高刻蝕時間來實現，克服了對刻蝕參數的嚴格要求，此外相比單純的刻蝕處理，通過重新生成第二氧化層，還能夠精確的控制第二氧化層的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1681" publication-number="202620483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有連續波光注入之整合光學放大</chinese-title>  
        <english-title>INTEGRATED OPTICAL AMPLIFICATION WITH CONTINUOUS-WAVE LIGHT INJECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02B6/26</main-classification>  
        <further-classification edition="201301120260211B">H04B10/43</further-classification>  
        <further-classification edition="200601120260211B">H04Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萊特美特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIGHTMATTER, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿拉魯西　馬津　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALALUSI, MAZIN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴德瓦吉　阿希什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARDWAJ, ASHISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塔里　什里阿什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATTARI, SHREYASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森伯格　傑西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBERG, JESSIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中描述在不犧牲對歸因於經放大自發發射之雜訊之抑制之情況下減少半導體光放大器(SOA)中之通道串擾，由此克服習知放大器中存在之折衷之光系統。此等方案涉及將連續波(CW)光注入至該等SOA中。該CW輔助光可以一SOA之透明區內之一波長提供。在該透明區中注入CW輔助光導致載波壽命及增益恢復之一加速。CW輔助光在該透明區中之應用建立一回饋機制，藉由該回饋機制，空乏之載波愈多，載波恢復愈快。此外，CW光之該注入導致載波密度之牽制及恆定增益。CW光注入可用於使用塊體、量子井及量子點增益材料之SOA中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are optical systems that reduce channel crosstalk in semiconductor optical amplifiers (SOAs) without sacrificing suppression of noise due to amplified spontaneous emission, thereby overcoming trade-offs existing in conventional amplifiers. These schemes involve injection of continuous wave (CW) light into the SOAs. The CW assist light may be provided at a wavelength within the transparency region of an SOA. Injecting CW assist light in the transparency region results in a speed-up of the carrier lifetime and gain recovery. Application of CW assist light in the transparency region establishes a feedback mechanism by which the more carriers are depleted, the faster the carrier recovery. Furthermore, the injection of CW light results in pinning of the carrier density and constant gain. CW light injection can be used in SOAs that use bulk, quantum-well, and quantum dot gain material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:基板</p>  
        <p type="p">100:波分多工(WDM)源</p>  
        <p type="p">101&lt;sub&gt;1&lt;/sub&gt;至101&lt;sub&gt;N&lt;/sub&gt;:光調變器</p>  
        <p type="p">104:多工器</p>  
        <p type="p">106:連續波(CW)源</p>  
        <p type="p">108:2-1光耦合器</p>  
        <p type="p">110:半導體光放大器(SOA)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1682" publication-number="202620981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速、高密度　I/O　連接器組件</chinese-title>  
        <english-title>HIGH SPEED, HIGH DENSITY I/O CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">H01R13/514</main-classification>  
        <further-classification edition="200601120260108B">H01R13/03</further-classification>  
        <further-classification edition="201101120260108B">H01R12/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安費諾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　醒野</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XINGYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡恩　奧默</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAN, OMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯貝克　Ｒ　布拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUBAKER, R. BRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉官仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GALEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUOXUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐啓桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QIGUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">高速、高密度I/O連接器組件。I/O連接器組件包括籠體和散熱構件。籠體包括具有開口的頂部壁和從前面可進入的通道。散熱構件包括設置在籠體的頂部處的基座、由間隙分隔的多個部分以及藉由頂部壁的開口從基座沿第一方向突出到通道的接觸部分。每個部分包括沿與第一方向相反的方向從基座突出的鰭片。散熱構件在接觸介面處包括微型熱介面材料層。本文所描述的技術，包括部件的結構和材料組成，可以提供足夠的散熱以實現高速、高密度I/O連接器組件，仍然經濟地製造，並符合OSFP-XD標準的尺寸要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子設備</p>  
        <p type="p">110:電路板</p>  
        <p type="p">112:連接器組件</p>  
        <p type="p">114:邊緣</p>  
        <p type="p">120:面板</p>  
        <p type="p">122:開口</p>  
        <p type="p">130:籠體</p>  
        <p type="p">132A,132B,132C,132D:通道</p>  
        <p type="p">134:EMI密封件</p>  
        <p type="p">136:密封件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1683" publication-number="202619976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉺鋁鈣鈦礦組成物及相關方法及物品</chinese-title>  
        <english-title>ERBIUM ALUMINUM PEROVSKITE COMPOSITIONS AND RELATED METHODS AND ARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251110B">C01F17/206</main-classification>  
        <further-classification edition="200601120251110B">C04B35/50</further-classification>  
        <further-classification edition="200601120251110B">C04B35/10</further-classification>  
        <further-classification edition="200601120251110B">C04B35/622</further-classification>  
        <further-classification edition="200601120251110B">C23C16/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司 美國亞利桑那州錢德勒市北羅斯福大道 301 號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特恩　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STERN, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所描述者係含有呈鈣鈦礦晶體結構之氧化鉺鋁的鋁酸鹽組成物；製備含有鉺鋁鈣鈦礦之鋁酸鹽組成物之方法；含有鉺鋁鈣鈦礦之物品，以及含有鉺鋁鈣鈦礦之物品之製備方法及使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are aluminate compositions that contain erbium aluminum oxide as a perovskite crystalline structure; methods of preparing aluminate compositions that contain erbium aluminum perovskite; articles that contain erbium aluminum perovskite, and methods of preparing and methods of using articles that contain erbium aluminum perovskite. &lt;i&gt;  &lt;/i&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1684" publication-number="202619994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高吸收之不透明石英玻璃</chinese-title>  
        <english-title>OPAQUE QUARTZ GLASS HAVING HIGH ABSORPTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C03C14/00</main-classification>  
        <further-classification edition="200601120260223B">C03B19/02</further-classification>  
        <further-classification edition="200601120260223B">C03B20/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商賀利氏石英玻璃有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS QUARZGLAS GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈森多弗　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTZENDORFER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查理奇　納汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSCHOLITSCH, NADINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈默施密特　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMERSCHMIDT, JORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋斯利　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESSELY, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰內克　托爾斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENEK, TORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種在近紅外線範圍內具有高吸收之不透明石英玻璃，及一種用於生產該不透明石英玻璃之方法。本發明亦係關於根據本發明之該不透明石英玻璃或由根據本發明之該方法所得的該不透明石英玻璃在其中加工半導體晶圓的程序腔中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an opaque quartz glass having high absorption in the near infrared range and to a method for producing same. The present invention also relates to the use of the opaque quartz glass according to the invention or the opaque quartz glass resulting from the method according to the invention in process chambers in which semiconductor wafers are processed.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1685" publication-number="202621533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板</chinese-title>  
        <english-title>PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/00</main-classification>  
        <further-classification edition="202601120260223B">H10W20/40</further-classification>  
        <further-classification edition="200601120260223B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　性振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種封裝基板，包括玻璃芯、佈線層及絕緣層，玻璃芯是配置有通孔的板狀玻璃，佈線層是配置於玻璃芯的表面上的導電層，絕緣層是配置於導電層之間的空間並包含高分子樹脂與絕緣性粒子的混合物的層，封裝基板具有用於安裝電子元件的上表面和與其相對的下表面，測量點是封裝基板的表面的一個點，表面上分別配置有10個彼此不同的測量點，測量點彼此之間的距離為表面的長度的0.05倍以上；Er是在測量點通過奈米壓痕法測量的極表面換算模量值（單位：GPa），在測量點測量的極表面換算模量值的平均為Er_av，在測量點測量的極表面換算模量值的標準差為Er_stdev，測量在27℃下進行，在將Er_av看作為整體時，Er_stdev的比率為7%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging substrate according to the embodiment comprises: a glass core; a wiring layer; and an insulating layer. A measurement point is a point on the surface of the packaging substrate, and ten different measurement points are disposed on the surface. The measurement points are spaced apart by at least 0.05 times the surface length. Er is a value of extreme surface reduced modulus (unit: GPa) measured at the measurement point using a nanoindentation method, Er_av is the average of the extreme surface reduced modulus values measured at the measurement points, and Er_stdev is the standard deviation thereof. The ratio of Er_stdev to Er_av may be 7% or less. The packaging substrate according to the embodiment can reduce overall stress by adjusting variations in the extreme surface modulus according to in-plane location within a certain range.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1686" publication-number="202621508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板構造及其電子裝置</chinese-title>  
        <english-title>SUBSTRATE ARCHITECTURE AND ELECTRONIC DEVICE RELATED THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/63</main-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification>  
        <further-classification edition="200601120260223B">H05K3/40</further-classification>  
        <further-classification edition="200601120260223B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方略電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANELSEMI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李晉棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIN-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種基板構造，包括一基板、一膜層結構、與多個導電構件。基板具有複數通孔；各該通孔具一容置空間、與界定該容置空間之一內表面。膜層結構至少部分封閉所對應的該些通孔位於該基板的一表面的一開口；該膜層結構朝所對應的該開口定義一導電面，且該導電面對應該開口至少部分具導電性。該些導電構件分別位於該些通孔的該容置空間，至少部分接觸所對應的該些通孔的該內表面、並電連接至該膜層結構；其中一該導電構件沿該基板的水平面的一方向具呈連續性單一介質的一橫截面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate architecture includes a substrate, a film-layered structure, and a plurality of conductive components. The substrate defines a plurality of through-holes; each of the through-holes is defined with a reception accommodation and an inner surface designating the reception accommodation. The film-layered structure at least partially encloses an opening of the corresponding one of the through-holes located at a surface of the substrate; the film-layered structure defines a conductive face facing the opening, and where the conductive face corresponding with the opening is at least partially conductive. The conductive components are respectively arranged in the reception accommodations of the through-holes, at least partially contacting the inner surfaces of the corresponding through-holes, and electrically connected to the film-layered structure. In a direction parallel with a horizontal plane of the substrate, one of the conductive components has a cross-sectional profile characterized by a homogeneous medium.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板構造</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:通孔</p>  
        <p type="p">12:容置空間</p>  
        <p type="p">13:內表面</p>  
        <p type="p">20:膜層結構</p>  
        <p type="p">21:導電結構</p>  
        <p type="p">22:導電面</p>  
        <p type="p">22a:區域單元</p>  
        <p type="p">30:導電構件</p>  
        <p type="p">O111、O112:開口</p>  
        <p type="p">P10:水平面</p>  
        <p type="p">S101:第一表面</p>  
        <p type="p">S102:第二表面</p>  
        <p type="p">S201、S202:表面</p>  
        <p type="p">T10:板厚</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1687" publication-number="202619991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板</chinese-title>  
        <english-title>SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C03C3/06</main-classification>  
        <further-classification edition="200601120260223B">C09J163/00</further-classification>  
        <further-classification edition="200601120260223B">H05K1/03</further-classification>  
        <further-classification edition="202601120260223B">H10W76/136</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　性振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例的基板包括玻璃芯。玻璃芯包括沿厚度方向貫通所述玻璃芯的貫通穿孔。貫通穿孔的直徑為50μm至100μm。玻璃芯的硫含量（原子%）和氮含量（原子%）之和為0.2原子%至8原子%。在這種情況下，可以提供更穩定地實現貫通玻璃芯的電連接，並在高濕環境中也具有穩定的耐久性及電氣可靠性的基板（100）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the present disclosure, a substrate comprises a glass core. The glass core comprises a through via penetrating the glass core in a thickness direction. A diameter of the through via is 50 µm to 100 µm. A sum of a sulfur content (atomic %) and a nitrogen content (atomic %) of the glass core is 0.2 atomic % to 8 atomic %. In this case, it may be possible to provide a substrate that achieves more stable electrical connection through the glass core and exhibits stable durability and electrical reliability even under a high-humidity environment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">10:玻璃芯</p>  
        <p type="p">101:玻璃芯的上部面</p>  
        <p type="p">102:玻璃芯的下部面</p>  
        <p type="p">11:貫通穿孔</p>  
        <p type="p">A:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1688" publication-number="202621115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化身表示之關鍵點及地標</chinese-title>  
        <english-title>KEYPOINTS AND LANDMARKS IN AVATAR REPRESENTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260211B">H04N19/13</main-classification>  
        <further-classification edition="202201120260211B">G06F3/04815</further-classification>  
        <further-classification edition="201901120260211B">G06F16/483</further-classification>  
        <further-classification edition="201901120260211B">G06F16/487</further-classification>  
        <further-classification edition="202201120260211B">H04L45/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商內數位ＣＥ專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科瓦　雷加泰羅　若奧　佩德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COVA REGATEIRO, JOAO PEDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈瑟蘭　菲利普　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOSSELIN, PHILIPPE HENRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒　克萊爾　法蘭克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE CLERC, FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於化身關鍵點及地標表示之系統、方法及工具。可接收一檔案(例如，一MPEG化身表示格式(MARF)檔案)。該檔案可包含複數個資產。該檔案可指示關鍵點及地標組件資訊。可基於解析該檔案來從該檔案中之該複數個資產選擇一資產。可基於該選定資產以及該關鍵點及地標組件資訊來判定一容器。可基於該所判定容器來判定一關鍵點或一地標之至少一者。一關鍵點或一地標之至少一者可基於該關鍵點或地標之該至少一者來動畫化一化身。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and instrumentalities are disclosed for avatar keypoints and landmarks representation. A file (e.g., an MPEG avatar representation format (MARF) file) may be received. The file may include a plurality of assets. The file may indicate keypoint and landmark component information. An asset may be selected from the plurality of assets in the file based on parsing the file. A container may be determined based on the selected asset and the keypoint and landmark component information. At least one of a keypoint or a landmark may be determined based on the determined container. At least one of a keypoint or a landmark may animate an avatar based on the at least one of the keypoint or landmark.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:步驟</p>  
        <p type="p">402:步驟</p>  
        <p type="p">403:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">405:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">407:步驟</p>  
        <p type="p">408:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1689" publication-number="202621171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種資料傳輸方法、裝置以及系統</chinese-title>  
        <english-title>A DATA TRANSMISSION METHOD, APPARATUS, AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H04W72/20</main-classification>  
        <further-classification edition="202301120251201B">H04W72/12</further-classification>  
        <further-classification edition="200901120251201B">H04W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料傳輸方法、裝置以及系統，涉及通信領域，以完善超寬頻頻帶拼接方案中的信道使用規則，該方法可以包括：發送端生成1個或多個包括同步報頭和感知段的感知包，根據與頻帶拼接類型對應的信道使用規則，傳輸1個或多個感知包。相應的，接收端根據與頻帶拼接類型對應的信道使用規則，接收來自發送端的1個或多個包括同步報頭和感知段的感知包。其中，1個或多個感知包對應的信道遵循與頻帶拼接類型對應的信道使用規則。本申請方案可廣泛適用於通信技術領域、人工智慧、車聯網、智慧家居聯網等領域。本申請支持IEEE協定，如IEEE 802.15.4ab/UWB協定、如IEEE 802.11bf/Sensing協議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data transmission method, apparatus, and system, related to the field of communication, are provided to improve the channel usage rules in ultra-wide band splicing schemes. The method may include: a transmitting end generating one or more sensing packets that include synchronization headers and sensing segments, and transmitting the one or more sensing packets according to the channel usage rules corresponding to the frequency band splicing type. Correspondingly, a receiving end receives one or more sensing packets from the transmitting end that include synchronization headers and sensing segments according to the channel usage rules corresponding to the frequency band splicing type. Among them, the channels corresponding to one or more sensing packets follow the channel usage rules corresponding to the frequency band splicing type. This application can be widely applied in the fields of communication technology, artificial intelligence, Internet of Vehicles, smart home networking, and other areas. This application supports IEEE protocols, such as IEEE 802.15.4ab/UWB protocol and IEEE 802.11bf/Sensing protocol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201、S202、S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1690" publication-number="202621097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊裝置以及無線通訊方法</chinese-title>  
        <english-title>WIRELESS COMMUNICATION DEVICE AND WIRELESS COMMUNICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L47/24</main-classification>  
        <further-classification edition="202301120251201B">H04L1/16</further-classification>  
        <further-classification edition="200601120251201B">H04L1/00</further-classification>  
        <further-classification edition="200901120251201B">H04W28/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種無線通訊裝置，包含一編碼器電路以及一無線通訊電路。該編碼器電路用以編碼同一輸入資料來產生並輸出具有不同編碼品質的複數個訊框。該無線通訊電路用以從該編碼器電路接收該複數個訊框，並透過一無線鏈路來將該複數個訊框中選取的至少一訊框傳送至另一無線通訊裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless communication device includes an encoder circuit and a wireless communication circuit. The encoder circuit encodes the same input data to generate and output frames with different encoding quality. The wireless communication circuit receives the frames from the encoder circuit, and transmits at least one frame selected from the frames to another wireless communication device via a wireless link.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200,202:無線通訊裝置</p>  
        <p type="p">204:無線鏈路</p>  
        <p type="p">206:解碼器電路</p>  
        <p type="p">210:編碼器電路</p>  
        <p type="p">212:無線通訊電路</p>  
        <p type="p">214:選取電路</p>  
        <p type="p">216:控制電路</p>  
        <p type="p">218:TX電路</p>  
        <p type="p">220:RX電路</p>  
        <p type="p">222:高穩定PHY電路</p>  
        <p type="p">224:高速PHY電路</p>  
        <p type="p">FL:旗標</p>  
        <p type="p">ACK:確認</p>  
        <p type="p">NAK:否定確認</p>  
        <p type="p">F1:第一訊框</p>  
        <p type="p">F2:第二訊框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1691" publication-number="202620628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器語言指令和處理器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260106B">G06F9/30</main-classification>  
        <further-classification edition="200601120260106B">G06F9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商半動力技術服務有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMIDYNAMICS TECHNOLOGY SERVICES, S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯帕薩桑斯　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESPASA SANS, ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾諾蒙塔涅斯　何塞瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARNAU MONTANES, JOSEMARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫亞德爾巴里奧　維克托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOYA DEL BARRIO, VICTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塞洛巴斯卡　佩德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARCUELLO PASCUAL, PEDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種機器語言指令，該機器語言指令在由包括存儲器和向量寄存器的處理器執行時，使處理器將存儲在存儲器中的元素的二維陣列作為數據加載到向量寄存器中。此外，一種機器語言指令，該機器語言指令在由包括存儲器和向量寄存器的處理器執行時，使處理器將存儲在向量寄存器中的數據作為元素的二維陣列存儲在存儲器中。此外，本發明還揭露一種處理器，該處理器包括存儲器和向量寄存器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理器</p>  
        <p type="p">2:存儲器</p>  
        <p type="p">3:向量寄存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1692" publication-number="202619958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>操作員處理集裝箱吊運系統之起重機之協助</chinese-title>  
        <english-title>ASSISTING AN OPERATOR TO HANDLE A CRANE OF A CONTAINER LIFTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">B66C13/16</main-classification>  
        <further-classification edition="200601120260206B">B66C13/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＡＢＢ瑞士公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABB SCHWEIZ AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席歐柏　達韋迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIOBRO, DAWID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哥帕拉克里旭納　葛亞司理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPALAKRISHNAN, GAYATHRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和爾斯塔迪爾斯　林格　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALLSTADIUS LINGE, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於協助一操作員處理一集裝箱吊運系統之一起重機之方法、電腦程式及電腦程式產品、一種集裝箱吊運管理裝置以及一種集裝箱吊運系統。一種集裝箱吊運管理裝置向該操作員顯示一進度指示符(PI)，該進度指示符(PI)展示由該起重機在一操作循環中執行之數個循序步驟之表示；獲得該起重機在該操作循環期間之一當前時間點之感測器資料；基於該感測器資料判定該起重機當前執行之該操作循環之一當前步驟以及該起重機已完成該當前步驟之程度；及在該進度指示符(PI)之該當前步驟之該表示中指示該當前時間點之進度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method, computer program and computer program product for assisting an operator to handle a crane of a container lifting system, a container lifting management device as well as a container lifting system. A container lifting management device displays a progress indicator (PI) to the operator, which progress indicator (PI) shows representations of a number of sequential steps being performed by the crane in an operations cycle, obtains sensor data of the crane at a current point in time during the operations cycle, determines a current step of the operations cycle that the crane currently performs and how much of the current step the crane has completed based on the sensor data and indicates the progress at the current point in time in the representation of the current step of the progress indicator (PI).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:起始操作循環</p>  
        <p type="p">S110:向操作員顯示進度指示符PI</p>  
        <p type="p">S120:獲得在操作循環之操作期間之當前時間點與起重機相關聯之感測器資料</p>  
        <p type="p">S130:基於感測器資料判定起重機當前執行或操作之操作循環之一當前步驟以及起重機已完成當前步驟之程度</p>  
        <p type="p">S140:在進度指示符PI之當前步驟之表示中指示當前時間點之進度</p>  
        <p type="p">S150:識別及顯示連結至當前步驟之視訊串流</p>  
        <p type="p">S160:循環是否已完成</p>  
        <p type="p">S170:結束操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1693" publication-number="202620258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於調整半導體材料晶圓外圓周上切口位置的方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR ADAPTING A POSITION OF A NOTCH ON THE OUTER CIRCUMFERENCE OF A WAFER OF A SEMICONDUCTOR MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C30B33/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商世創電子材料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILTRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道布　埃里希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAUB, ERICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯卡　班尼迪克特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROESKA, BENEDIKT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇爾　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIERER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於調整半導體材料晶圓（110）外圓周（112）上切口（114）位置（φ）的方法，其中如果切口（114）未佈置在相對於晶圓的晶軸方位的預設位置（φ*），則以如下方式擴大切口（114）：使擴大後的切口（116）佈置在相對於晶圓的晶軸方位的預設位置（φ*），或至少比之前更接近該預設位置（φ*）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for adapting a position (φ) of a notch (114) on the outer circumference (112) of a wafer (110) of a semiconductor material, wherein if the notch (114) is not arranged at a preestablished position (φ*) in relation to a crystal orientation of the wafer, the notch (114) is enlarged in such a way that the enlarged notch (116) is arranged at, or at least closer to than before, the preestablished position (φ*) in relation to the crystal orientation of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶錠</p>  
        <p type="p">102:外側</p>  
        <p type="p">200:裝置</p>  
        <p type="p">210:夾緊機構</p>  
        <p type="p">220:測定儀器</p>  
        <p type="p">230:研磨儀器</p>  
        <p type="p">U:圓周方向</p>  
        <p type="p">A:縱軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1694" publication-number="202621429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運裝置</chinese-title>  
        <english-title>SUBSTRATE TRANSFER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="202601120260223B">H10P72/50</further-classification>  
        <further-classification edition="200601120260223B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>是竹竜馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORETAKE, RYOUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村瀬大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURASE, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹羽創生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIWA, SOSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>操和志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISAO, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村哲孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, AKITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住友雅彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種基板搬運裝置（1），其包括框體（10）、機器人（2）以及對準器（5），在搬運空間（15）內，該對準器（5）位於比由將連通口（171、172、173、174）沿第一方向投影所得到的軌跡形成的特定區域（191、192、193、194）靠上方的位置，且沿上下方向觀察時，該對準器（5）的至少一部分與特定區域重疊地布置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate transfer device (1) includes a housing (10), a robot (2), and an aligner (5) positioned within a transfer space (15) above specific regions (191, 192, 193, 194) formed by the trajectories of communication ports (171, 172, 173, 174) projected in a first direction. At least a portion of the aligner (5) overlaps the specific region when viewed vertically.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板搬運裝置</p>  
        <p type="p">2:機器人</p>  
        <p type="p">3:手部</p>  
        <p type="p">4:基板處理設備</p>  
        <p type="p">5:對準器</p>  
        <p type="p">8:支架</p>  
        <p type="p">9:基板</p>  
        <p type="p">10:框體</p>  
        <p type="p">11:第一縱壁</p>  
        <p type="p">12:第二縱壁</p>  
        <p type="p">13:第三縱壁</p>  
        <p type="p">14:第四縱壁</p>  
        <p type="p">15:搬運空間</p>  
        <p type="p">21:基座</p>  
        <p type="p">22:機械手臂</p>  
        <p type="p">41:第一裝載埠</p>  
        <p type="p">42:第二裝載埠</p>  
        <p type="p">43:第三裝載埠</p>  
        <p type="p">151:間隙</p>  
        <p type="p">171:第一連通口</p>  
        <p type="p">172:第二連通口</p>  
        <p type="p">173:第三連通口</p>  
        <p type="p">181:門</p>  
        <p type="p">182:門</p>  
        <p type="p">193:特定區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1695" publication-number="202621156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接入點節能交互的方法、裝置、設備和系統</chinese-title>  
        <english-title>METHOD, APPARATUS, DEVICE, AND SYSTEM FOR POWER SAVING INTERACTION OF ACCESS POINTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/02</main-classification>  
        <further-classification edition="200901120251201B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬金博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JINBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種接入點節能交互的方法、裝置、設備和系統，屬於通信技術領域。該方法包括：在FTTR網路中，第二接入點向第一接入點上報自身的至少一個節能對象的節能能力，第一接入點為至少一個節能對象確定與該節能能力匹配的節能策略，然後指示第二接入點按照該節能策略進行節能處理。這樣，不能能夠使得第二接入點進行節能處理，而且使得節能策略與自身的能力相匹配，從而能夠降低FTTR網路中接入點的整體功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method, apparatus, device, and system for energy saving interaction of access points, which belong to the field of communications technologies. The method includes: in an FTTR network, a second access point reports its energy-saving capability of at least one energy-saving object to a first access point; the first access point determines an energy-saving policy that matches the energy-saving capability for the at least one energy-saving object; and then instructs the second access point to perform energy-saving processing according to the energy-saving policy. In this way, not only can the second access point perform energy-saving processing, but also the energy-saving policy is matched with its own capability, thereby reducing the overall power consumption of access points in the FTTR network.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1696" publication-number="202621157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接入點節能的方法、裝置、設備和系統</chinese-title>  
        <english-title>METHOD, APPARATUS, DEVICE, AND SYSTEM FOR POWER SAVING OF ACCESS POINT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260102B">H04W52/02</main-classification>  
        <further-classification edition="200901120260102B">H04W88/08</further-classification>  
        <further-classification edition="200901120260102B">H04W84/12</further-classification>  
        <further-classification edition="200901120260102B">H04W24/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種接入點節能的方法、裝置、設備和系統，屬於通信技術領域。在FTTR中，第一接入點指示第二接入點進行節能，並且獲取第二接入點的業務狀態信息，根據該業務狀態信息更新第二接入點的節能操作，使得在節能時，減少對業務的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method, an apparatus, a device, and a system for power saving of access point, and pertains to the field of communications technologies. In FTTR, a first access point instructs a second access point to perform power saving, obtains service status information of the second access point, and updates the power saving operation of the second access point based on the service status information, thereby reducing the impact on services during power saving.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1697" publication-number="202620027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻劑組合物，使用該組合物形成圖案的方法以及光阻圖案</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION AND PHOTORESIST PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y30/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹厚淨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐也隱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YAEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旻映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種半導體光阻劑組合物和使用其形成或提供圖案的方法，該半導體光阻劑組合物包括由化學式1表示的有機金屬化合物；和溶劑。化學式1的描述如說明書中所述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming or providing patterns using the same, the semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1; and a solvent. The descriptions of Chemical Formula 1 are as described in the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">108:光阻圖案</p>  
        <p type="p">112:有機薄膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1698" publication-number="202620579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換式轉換器及其控制器和控制方法</chinese-title>  
        <english-title>SWITCHING CONVERTER AND CONTROLLER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260113B">G05F1/565</main-classification>  
        <further-classification edition="200601120260113B">H02M3/156</further-classification>  
        <further-classification edition="200601120260113B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭佳峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了切換式轉換器及其控制器和控制方法。該控制方法包括：基於代表切換式轉換器的輸出電壓的回饋訊號來提供比較訊號；判斷切換式轉換器的負載是否發生卸載事件；以及基於卸載事件和比較訊號來提供切換控制訊號；其中，回應於發生卸載事件，將切換控制訊號鎖定在三態以迫使切換式轉換器的高側功率開關和低側功率開關都被關斷，直到回饋訊號低於參考訊號和斜坡訊號之和時，將切換控制訊號從三態解鎖以導通高側功率開關並關斷低側功率開關。該切換式轉換器具有良好的暫態響應效能，減小了輸出電壓的過衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:負載</p>  
        <p type="p">100:切換式轉換器</p>  
        <p type="p">101:輸入節點</p>  
        <p type="p">102:輸出節點</p>  
        <p type="p">110:驅動器</p>  
        <p type="p">120:控制器</p>  
        <p type="p">121:比較電路</p>  
        <p type="p">122:負載偵測單元</p>  
        <p type="p">123:切換訊號產生器</p>  
        <p type="p">124:斜坡產生器</p>  
        <p type="p">130:切換電路</p>  
        <p type="p">CMP:比較訊號</p>  
        <p type="p">Co:輸出電容器</p>  
        <p type="p">GND:參考地</p>  
        <p type="p">IL:電流</p>  
        <p type="p">L:磁性元件</p>  
        <p type="p">LRI:負載指示訊號</p>  
        <p type="p">M1:高側功率開關</p>  
        <p type="p">M2:低側功率開關</p>  
        <p type="p">PWM:輸出接腳</p>  
        <p type="p">PWMO:切換控制訊號</p>  
        <p type="p">SW:開關節點</p>  
        <p type="p">Vfb:回饋訊號</p>  
        <p type="p">Vgh:驅動訊號</p>  
        <p type="p">Vgl:驅動訊號</p>  
        <p type="p">Vin:直流輸入電壓</p>  
        <p type="p">VOSN:輸入接腳</p>  
        <p type="p">Vout:直流輸出電壓</p>  
        <p type="p">Vref:參考訊號</p>  
        <p type="p">Vslope:斜坡訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1699" publication-number="202621513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括基於玻璃之基板及聚合物層的微電子物件</chinese-title>  
        <english-title>MICROELECTRONIC ARTICLES THAT INCLUDE GLASS-BASED SUBSTRATES AND POLYMER LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/692</main-classification>  
        <further-classification edition="202601120260223B">H10W70/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡農戈　曼達基尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANUNGO, MANDAKINI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧科羅　恰克伍迪阿祖布克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKORO, CHUKWUDI AZUBUIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西古史凱伊　史坦尼拉芙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIKULSKYI, STANISLAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦迪　拉傑許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VADDI, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種微電子物件，其包括：基於玻璃之基板，其具有第一表面及第二表面；第一聚合物層，其安置於該第一表面上；第二聚合物層，其安置於該第二表面上；至少一個再分佈層，其安置於該第一聚合物層、該第二聚合物層或這兩者上；以及金屬化玻璃通孔，其自該第一表面延伸至該第二表面。該第一聚合物層及該第二聚合物層包括孔隙且具有5%至70%之孔隙率及大於1 GPa之楊氏模數。該至少一個再分佈層包括金屬材料及介電材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microelectronic article includes a glass-based substrate having a first surface and a second surface, a first polymer layer disposed on the first surface, a second polymer layer disposed on the second surface, at least one redistribution layer disposed on the first polymer layer, the second polymer layer, or both, and a metallized through glass via extending from the first surface to the second surface. The first polymer layer and the second polymer layer include pores and have a porosity of from 5% to 70% and a Young's modulus of greater than 1 GPa. The at least one redistribution layer includes a metal material and a dielectric material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微電子物件</p>  
        <p type="p">110:基於玻璃之基板</p>  
        <p type="p">112:第一表面/表面</p>  
        <p type="p">114:第二表面/表面</p>  
        <p type="p">118:中平面</p>  
        <p type="p">120:第一聚合物層/聚合物層/多孔聚合物層</p>  
        <p type="p">130:第二聚合物層/聚合物層/多孔聚合物層</p>  
        <p type="p">140:再分佈層/RDL</p>  
        <p type="p">142:金屬材料/圖案化金屬材料</p>  
        <p type="p">144:介電材料/多孔介電材料</p>  
        <p type="p">150:玻璃通孔/金屬化玻璃通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1700" publication-number="202621514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝用玻璃基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/692</main-classification>  
        <further-classification edition="200601120260223B">C03C4/00</further-classification>  
        <further-classification edition="200601120260223B">C03C3/089</further-classification>  
        <further-classification edition="201801120260223B">C03C25/6208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西宮隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMIYA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市丸智憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIMARU, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在將半導體封裝用玻璃基板的熱膨脹係數設為α（ppm/K）、厚度設為T（mm）的情況下，α×T≦4的關係成立。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體封裝用玻璃基板</p>  
        <p type="p">1a:周緣部</p>  
        <p type="p">1b:中央部</p>  
        <p type="p">L1:縱向尺寸</p>  
        <p type="p">L2:橫向尺寸</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1701" publication-number="202620878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其操作方法</chinese-title>  
        <english-title>MEMORY DEVICE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">G11C16/10</main-classification>  
        <further-classification edition="200601120260108B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　毓明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, JOHNNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　紀舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種記憶體裝置及其操作方法。操作方法包括以下步驟：接收寫入器模式指令，以操作記憶體裝置藉由系統控制邏輯進行資料載入與編程並列操作；在資料載入與編程並列操作的資料載入期間，藉由系統控制邏輯接收並寫入多個字元資料至記憶體緩衝器；以及在資料載入與編程並列操作的資料編程期間，自記憶體緩衝器讀出這些字元資料，且將這些字元資料編程至記憶體陣列，其中資料編程期間與資料載入期間為部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device and an operating method thereof are provided. The operating method includes the following steps: receiving a writer mode command to operate the memory device to perform a data loading and programming operation in parallel via a system control logic; receiving and writing a plurality of word data into a memory buffer via the system control logic during a data programming period where data loading and programming operation are performed in parallel; and reading the word data from the memory buffer and programming the word data into a memory array during a data programming period where data loading and programming operation are performed in parallel, wherein the data programming period partially overlaps with the data loading period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">101:寫入器模式指令</p>  
        <p type="p">102_1~102_N、102_1’~102_N’:字元資料</p>  
        <p type="p">110:系統控制邏輯</p>  
        <p type="p">120:記憶體單元</p>  
        <p type="p">130:記憶體緩衝器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1702" publication-number="202619953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種可伸縮貨架</chinese-title>  
        <english-title>A RETRACTABLE SHELF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B65G1/10</main-classification>  
        <further-classification edition="200601120251128B">B65G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商捷螺智能設備(蘇州)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYROBOT TECHNOLOGY (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WEI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王道興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DAO-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　成都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANG, SENG-THOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種可伸縮貨架，涉及倉儲設備技術領域，該可伸縮貨架包括架體、貨盤和驅動機構，架體包括遮擋層以及位於遮擋層下方的置物層，置物層上設置有沿第一方向延伸的滑軌，貨盤通過滑塊滑動安裝在滑軌上，貨盤上設置有至少一個用於放置貨物的倉位，驅動機構用於驅動貨盤沿滑軌移動以使倉位移出置物層。通過本揭露的可伸縮貨架，可使倉位滑出置物層，避免在倉位上裝卸貨物時受到置物層的層高影響，提高可伸縮貨架的適應性和存儲空間的利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a retractable shelf, which includes a frame body, a pallet and a drive mechanism; the frame body comprises a shielding layer and a storage layer; a slide rail extending in the first direction is provided on the storage layer; the pallet is slidably mounted on the slide rail by means of the slider; at least one bin position for placing goods is provided on the pallet; and the drive mechanism is used for driving the pallet to move along the slide rail so as to move the bin out of the storage layer. Through the retractable shelf disclosed in this embodiment, the bin can be slid out of the storage layer, avoiding the influence of the height of the storage layer when loading and unloading goods on the bin, thereby improving the adaptability of the retractable shelf and the utilization rate of storage space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:架體</p>  
        <p type="p">11:貨盤</p>  
        <p type="p">12:驅動機構</p>  
        <p type="p">13:滑軌</p>  
        <p type="p">14:遮擋層</p>  
        <p type="p">15:置物層</p>  
        <p type="p">16:倉位底板</p>  
        <p type="p">24:顯示幕</p>  
        <p type="p">25:支架</p>  
        <p type="p">26:連接構件</p>  
        <p type="p">29:條碼讀取器</p>  
        <p type="p">30:萬向輪</p>  
        <p type="p">31:地腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1703" publication-number="202619859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人系統</chinese-title>  
        <english-title>ROBOT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B25J9/04</main-classification>  
        <further-classification edition="200601120260223B">B25J5/00</further-classification>  
        <further-classification edition="200601120260223B">B25J15/08</further-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商捷螺智能設備(蘇州)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYROBOT TECHNOLOGY (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　成都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANG, SENG-THOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WEI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種機器人系統，包括：車主體；設置於車主體的抓取機構，用於抓取並輸送物品；設置於車主體的貨盤，包括固定設置於車主體上的固定式貨盤以及沿第一方向滑動設置於車主體上的滑動式貨盤，固定式貨盤和滑動式貨盤上均設有載物工位，車主體上具有位於固定式貨盤正下方的初始位置，以及在第一方向上位於固定式貨盤一側的上料位置，滑動式貨盤配置為位於初始位置和上料位置之間移動；抓取機構抓取到物品的同時，滑動式貨盤從初始位置移動至上料位置，抓取機構將抓取的物品放置於位於上料位置的滑動式貨盤的載物工位上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a robot system, which includes: a vehicle body; a grabbing mechanism provided on the vehicle body and used for grabbing and conveying items; the pallet body comprises a fixed pallet fixed on the car body and a sliding pallet slidably arranged on the car body in a first direction, the fixed pallet and the sliding pallet are both provided with a carrier station, the car body is provided with an initial position directly below the fixed pallet, and a loading position located on one side of the fixed pallet in the first direction, and the sliding pallet is configured to move between an initial position and a loading position; the grabbing mechanism moves from an initial position to a loading position while grabbing the article, and the grabbing mechanism places the grasped item on a loading station of the sliding pallet located at the loading position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車主體</p>  
        <p type="p">20:抓取機構</p>  
        <p type="p">30:貨盤</p>  
        <p type="p">31:載物工位</p>  
        <p type="p">50:載台</p>  
        <p type="p">51:滑軌</p>  
        <p type="p">52:滑台</p>  
        <p type="p">200:機械臂元件</p>  
        <p type="p">210:機械手元件</p>  
        <p type="p">300:固定式貨盤</p>  
        <p type="p">310:滑動式貨盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1704" publication-number="202621418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種夾爪裝置</chinese-title>  
        <english-title>A CLAMPING JAW DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商捷螺智能設備(蘇州)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYROBOT TECHNOLOGY (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WEI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種夾爪裝置，用於卡緊盒體，該盒體包括設有至少兩個提拉件的頂板，該提拉件包括凹陷結構，該夾爪裝置包括：至少兩個夾爪單元，該夾爪單元包括凸起結構，該凸起結構和該凹陷結構配合；該夾爪單元沿靠近該提拉件的方向移動，使該凸起結構和該凹陷結構咬合抵接形成卡合結構。本方案中，通過夾爪單元上的凸起結構和盒體頂板上提拉件的凹陷結構的互補配合設計，二者卡緊形成卡合結構，實現對盒體的穩定夾持，從而在運輸過程中保護盒體內物品不受損傷，同時避免了因夾持力度不當導致的盒體損壞或物品從盒體滑落的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a clamping jaw device, used for clamping a box body, the box body comprising a top plate provided with at least two lifting members, the lifting member comprising a recessed structure, the clamping jaw device comprising: at least two clamping jaw units, the clamping jaw units comprising a protruding structure, and the protruding structure matching the recessed structure; the clamping jaw unit moves in a direction close to the lifting member, so that the protruding structure and the recessed structure engage and abut against each other to form a snap-fit structure. In the present solution, the protrusion structure on the clamping jaw unit and the complementary fitting design of the recessed structure of the lifting member on the top plate of the box body are clamped to form a snap-fit structure, so that the box body is stably clamped.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:盒體</p>  
        <p type="p">11:開口</p>  
        <p type="p">20:夾爪單元</p>  
        <p type="p">30:卡合結構</p>  
        <p type="p">80:殼體</p>  
        <p type="p">81:上頂板</p>  
        <p type="p">83:側板</p>  
        <p type="p">85:前板</p>  
        <p type="p">90:遮攔機構</p>  
        <p type="p">91:移動桿件</p>  
        <p type="p">92:遮擋件</p>  
        <p type="p">93:活動連接件</p>  
        <p type="p">100:頂板</p>  
        <p type="p">101:提拉件</p>  
        <p type="p">800:安裝口</p>  
        <p type="p">850:信號口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1705" publication-number="202621445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電卡盤構件、靜電卡盤裝置、及靜電卡盤構件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友大阪水泥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO OSAKA CEMENT CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾崎雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAKI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅又徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAMATA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種提高了電極與供電端子的連接的可靠性的靜電卡盤構件、靜電卡盤裝置、及靜電卡盤構件的製造方法。一種靜電卡盤構件，包括：第一基板及第二基板，沿厚度方向積層；層狀的電極，設置於第一基板與第二基板之間；以及供電端子，向電極供給電力，在第二基板設置有沿厚度方向貫通並供供電端子插入的貫通孔，電極具有位於貫通孔的內周面與供電端子的外周面之間的侵入部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:靜電卡盤構件</p>  
        <p type="p">11:第一陶瓷板(第一基板)</p>  
        <p type="p">11f:第一相向面(第一塗佈面)</p>  
        <p type="p">12:第二陶瓷板(第二基板)</p>  
        <p type="p">12f:第二相向面(第二塗佈面)</p>  
        <p type="p">12h:貫通孔</p>  
        <p type="p">12k:第二倒角部</p>  
        <p type="p">16B:第二供電端子(供電端子)</p>  
        <p type="p">16k:第一倒角部</p>  
        <p type="p">21:加熱器電極(電極)</p>  
        <p type="p">21a、22a:側面</p>  
        <p type="p">21p:侵入部</p>  
        <p type="p">22:絕緣部</p>  
        <p type="p">29:間隙</p>  
        <p type="p">D:深度</p>  
        <p type="p">H:厚度尺寸</p>  
        <p type="p">L1:第一寬度尺寸</p>  
        <p type="p">L2:第二寬度尺寸</p>  
        <p type="p">L3:第三寬度尺寸</p>  
        <p type="p">L4:第四寬度尺寸</p>  
        <p type="p">L5:第五寬度尺寸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1706" publication-number="202621430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造系統及設置方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="200601120260223B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部義之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊巻俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOMAKI, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠間一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAMA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體製造系統具有搬運基板的搬運機器人，及包含使基板待命之儲存模組的大氣搬運模組。儲存模組包含：殼體本體、設於殼體本體並在鉛直方向上延伸的棒構件、將棒構件固定於殼體本體的鎖定機構，及設於比殼體本體之頂板更下側，並使棒構件由作業者操作的操作部。棒構件係基於操作部的操作而往鉛直方向上側上升，並藉由鎖定機構予以固定，藉此維持撐持於大氣搬運模組之頂棚框架的態樣，而將儲存模組固定於大氣搬運模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41:大氣搬運容器</p>  
        <p type="p">41f:框架</p>  
        <p type="p">41f1:頂棚框架</p>  
        <p type="p">60o:開放部</p>  
        <p type="p">63:殼體本體</p>  
        <p type="p">64:螺釘</p>  
        <p type="p">65:棒構件</p>  
        <p type="p">67:上側鎖定機構</p>  
        <p type="p">68:下側鎖定機構</p>  
        <p type="p">631:頂板</p>  
        <p type="p">631h:穿通孔</p>  
        <p type="p">632:底板</p>  
        <p type="p">632h:內螺紋孔</p>  
        <p type="p">633:側板</p>  
        <p type="p">635:中間板</p>  
        <p type="p">651:棒本體</p>  
        <p type="p">651a:大徑部</p>  
        <p type="p">651b:上側螺紋部</p>  
        <p type="p">651c:下側螺紋部</p>  
        <p type="p">652:接觸部</p>  
        <p type="p">653:操作部</p>  
        <p type="p">671:內筒螺套</p>  
        <p type="p">672:上側鎖定螺帽</p>  
        <p type="p">673:下側鎖定螺帽</p>  
        <p type="p">681:鎖定螺帽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1707" publication-number="202621025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降壓-升壓變換器、控制方法、晶片及電子設備</chinese-title>  
        <english-title>BUCK-BOOST CONVERTER, CONTROL METHOD, CHIP AND ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">H02M3/156</main-classification>  
        <further-classification edition="200601120260212B">G05F1/565</further-classification>  
        <further-classification edition="200601120260212B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商珠海楠欣半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUHAI NANXIN SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>解建章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JIANZHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種降壓-升壓變換器、控制方法、晶片及電子設備。在降壓-升壓變換器處於降壓模式和輕載模式的情況下，電源控制電路控制第三功率管始終關斷，第四功率管始終導通，並控制第一功率管和第二功率管在導通或關斷之間進行切換，使電感在充電和放電之間進行切換。電源控制電路通過檢測第四功率管導通時的電壓降，確定電感在放電時的電流是否過零點。當電感在放電時的電流過零點時，電源控制電路控制第三功率管導通和第四功率管關斷，使電感兩端的電壓為零，使電感的電流維持為停止放電時的電流。進而，在電感再次充電時，電感電流從停止放電時的電流逐漸升高。從而，電感在每個開關週期內的平均電流保持不變，使降壓-升壓變換器趨於穩定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a buck-boost converter, a control method, a chip and electronic equipment. When the buck-boost converter is in a buck mode and a light load mode, the power supply control circuit controls a third power transistor to be in off-state all the time, controls a fourth power transistor to be in on-state all the time, and controls a first power transistor and a second power transistor to be switched between the on-state and the off-state, so that an inductor is switched between charging and discharging. And the power supply control circuit determines whether a current of the inductor during discharging crosses a zero point by detecting the voltage drop when the fourth power transistor is in on-state. And when the current of the inductor during discharging crosses a zero point, the power supply control circuit controls the third power transistor to be in on-state and the fourth power transistor to be in off-state, so that the voltage at the two ends between the inductor is zero, and the current of the inductor is maintained to be the current when discharging is stopped. Furthermore, when the inductor is recharged, the current of the inductor gradually increases from the current when the discharge is stopped. Therefore, the average current of the inductor in each switching period is kept unchanged, so that the buck-boost converter tends to be stable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">BUCK:降壓模式</p>  
        <p type="p">BOOST:升壓模式</p>  
        <p type="p">VFB:回饋電壓</p>  
        <p type="p">PWM':訊號</p>  
        <p type="p">ZCD':訊號</p>  
        <p type="p">T3':訊號</p>  
        <p type="p">A':功率管</p>  
        <p type="p">B':功率管</p>  
        <p type="p">C':功率管</p>  
        <p type="p">D':功率管</p>  
        <p type="p">IND':電感</p>  
        <p type="p">100:降壓-升壓變換器</p>  
        <p type="p">110:電源控制電路</p>  
        <p type="p">A:第一功率管</p>  
        <p type="p">B:第二功率管</p>  
        <p type="p">C:第三功率管</p>  
        <p type="p">D:第四功率管</p>  
        <p type="p">IND:電感</p>  
        <p type="p">111:回饋模組</p>  
        <p type="p">112:差分放大器</p>  
        <p type="p">113:電壓轉電流模組</p>  
        <p type="p">114:鉗位模組</p>  
        <p type="p">115:電流控制延時模組</p>  
        <p type="p">116:計時模組</p>  
        <p type="p">117:邏輯控制模組</p>  
        <p type="p">118:第一比較器</p>  
        <p type="p">119:第二比較器</p>  
        <p type="p">R1:第一電阻器</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">R2:第二電阻器</p>  
        <p type="p">R3:第三電阻器</p>  
        <p type="p">VC:第一電壓</p>  
        <p type="p">I1/IPFM:第一電流</p>  
        <p type="p">IC:第二電流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1708" publication-number="202620342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251121B">F25B49/00</main-classification>  
        <further-classification edition="200601120251121B">F04D13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小舘郁彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODATE, IKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原八十八</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, YASOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡正高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水池宏友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUIKE, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立花裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱野晋佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMANO, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種冷卻單元，其能夠提高作為系統整體的控制性。實施方式所涉及的冷卻單元包括多個製冷劑迴圈裝置和控制裝置。製冷劑迴圈裝置包括泵、壓力感測器和流量感測器。泵送出製冷劑。壓力感測器檢測製冷劑的壓力。流量感測器檢測製冷劑的流量。控制裝置包括控制器。控制器與多個製冷劑迴圈裝置可通信地連接，根據從多個製冷劑迴圈裝置接收的壓力感測器的檢測結果及流量感測器的檢測結果中的至少任意一方的檢測結果，控制多個製冷劑迴圈裝置的動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:冷卻單元</p>  
        <p type="p">3:製冷劑迴圈裝置</p>  
        <p type="p">4:控制裝置</p>  
        <p type="p">41:顯示操作部</p>  
        <p type="p">5:支架</p>  
        <p type="p">7:抽屜</p>  
        <p type="p">100:冷卻物件裝置</p>  
        <p type="p">101:冷卻頭</p>  
        <p type="p">102:冷卻塔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1709" publication-number="202621446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電卡盤構件、靜電卡盤裝置、及靜電卡盤構件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">H02N13/00</further-classification>  
        <further-classification edition="200601120260223B">H05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友大阪水泥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO OSAKA CEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾崎雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAKI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅又徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAMATA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種靜電卡盤構件、靜電卡盤裝置、及靜電卡盤構件的製造方法，其藉由將加熱器電極的熱有效率地傳遞至板狀試樣，可抑制板狀試樣的溫度不均。一種靜電卡盤構件，搭載有板狀試樣，所述靜電卡盤構件包括：第一基板及第二基板，沿厚度方向積層；以及層狀的加熱器電極，設置於第一基板與第二基板之間，加熱器電極自厚度方向觀察是形成規定的圖案的帶狀，在厚度方向上，將第一基板側設為第一側，將第二基板側設為第二側，板狀試樣相對於加熱器電極搭載於第一側，加熱器電極的第一側的端部的第一寬度尺寸較加熱器電極的第二側的端部的第二寬度尺寸大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:靜電卡盤構件</p>  
        <p type="p">11:第一陶瓷板(第一基板)</p>  
        <p type="p">11f:第一相向面(第一塗佈面)</p>  
        <p type="p">12:第二陶瓷板</p>  
        <p type="p">12f:第二相向面(第二塗佈面)</p>  
        <p type="p">12h:貫通孔</p>  
        <p type="p">12k:第二倒角部</p>  
        <p type="p">16B:第二供電端子</p>  
        <p type="p">16k:第一倒角部</p>  
        <p type="p">21:加熱器電極</p>  
        <p type="p">21a、22a:側面</p>  
        <p type="p">21p:侵入部</p>  
        <p type="p">22:絕緣部</p>  
        <p type="p">29:間隙</p>  
        <p type="p">D:深度</p>  
        <p type="p">H:厚度尺寸</p>  
        <p type="p">L1:第一寬度尺寸</p>  
        <p type="p">L2:第二寬度尺寸</p>  
        <p type="p">L3:第三寬度尺寸</p>  
        <p type="p">L4:第四寬度尺寸</p>  
        <p type="p">L5:第五寬度尺寸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1710" publication-number="202619776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>苯乙烯殘餘物再循環程序及相關系統</chinese-title>  
        <english-title>STYRENE RESIDUE RECYCLE PROCESSES AND RELATED SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B01D3/14</main-classification>  
        <further-classification edition="200601120251201B">C07C7/04</further-classification>  
        <further-classification edition="200601120251201B">C07C15/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商德希尼布能源法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNIP ENERGIES FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈貝爾　道格拉斯斯圖亞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBBELL, DOUGLAS STUART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於純化苯乙烯單體的系統及方法可包括苯乙烯預分餾系統、苯乙烯精製系統、及殘餘物再循環處理器。該殘餘物再循環處理器可加熱及分離來自該苯乙烯精製系統的殘餘物流，以產生與該殘餘物流相比其中具有較低濃度的C&lt;sub&gt;9&lt;/sub&gt;及C&lt;sub&gt;10&lt;/sub&gt;芳烴的殘餘物再循環流。該殘餘物再循環流可再循環回到該苯乙烯預分餾系統。用於純化苯乙烯單體的此類系統及方法可具有較少的能量消耗、較低的聚合抑制劑劑量、較少的空氣污染、及/或較少的設備結垢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for purifying styrene monomer may include a styrene prefractionation system, a styrene finishing system, and a residue recycle processer. The residue recycle processer may heat and separate a residue stream from the styrene finishing system to produce a residue recycle stream with lower concentrations of C9 and C10 aromatic hydrocarbons therein compared to the residue stream. The residue recycle stream may be recycled back to the styrene prefractionation system. Such systems and methods for purifying styrene monomer may have less energy consumption, lower polymerization inhibitor dosage, less air pollution, and/or less equipment fouling.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:富苯乙烯流</p>  
        <p type="p">104:第一部分</p>  
        <p type="p">106:第二部分</p>  
        <p type="p">108:苯乙烯精製系統</p>  
        <p type="p">110:苯乙烯單體產物流</p>  
        <p type="p">114:殘餘物流</p>  
        <p type="p">116:淨重副產物流</p>  
        <p type="p">118:組合流</p>  
        <p type="p">120:殘餘物再循環再沸器</p>  
        <p type="p">122:汽化流</p>  
        <p type="p">124:殘餘物再循環鼓</p>  
        <p type="p">126:頂部蒸氣流</p>  
        <p type="p">128:底部液體流</p>  
        <p type="p">130:再循環流</p>  
        <p type="p">132:殘餘物再循環流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1711" publication-number="202621515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括經電鍍金屬之微電子製品及其製造方法</chinese-title>  
        <english-title>MICROELECTRONIC ARTICLES INCLUDING ELECTROPLATED METAL AND METHODS OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/692</main-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification>  
        <further-classification edition="202601120260223B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡農戈　曼達基尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANUNGO, MANDAKINI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧科羅　恰克伍迪阿祖布克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKORO, CHUKWUDI AZUBUIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉多　迪亞哥約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRADO, DIEGO JOSUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史喬特　羅伯特安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAUT, ROBERT ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西古史凱伊　史坦尼拉芙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIKULSKYI, STANISLAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦迪　拉傑許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VADDI, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造一微電子製品之方法包括：將至少一個再分佈層沉積於一基於玻璃之基板上，其中該沉積該至少一個再分佈層包括以下之至少一個循環：用一金屬材料電鍍該基於玻璃之基板以形成一經電鍍金屬材料；以大於或等於0.5℃/min且小於或等於10℃/min之一升降溫速率使該基於玻璃之基板及該經電鍍金屬材料退火至大於或等於200℃且小於或等於400℃之一峰值溫度；及將一介電材料安置於該經電鍍金屬材料上或之間中之至少一者處。該經電鍍金屬材料包括大於或等於10,000 MPa·℃之一磁滯回線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of making a microelectronic article includes depositing at least one redistribution layer on a glass-based substrate, wherein the depositing the at least one redistribution layer includes at least one cycle of electroplating the glass-based substrate with a metal material to form an electroplated metal material, annealing the glass-based substrate and the electroplated metal material at a ramp rate greater than or equal to 0.5 ℃/min and less than or equal to 10 ℃/min to a peak temperature greater than or equal to 200 ℃ and less than or equal to 400 ℃, and disposing a dielectric material at least one of on or between the electroplated metal material. The electroplated metal material includes a hysteresis loop greater than or equal to 10,000 MPa·℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微電子製品</p>  
        <p type="p">110:基於玻璃之基板</p>  
        <p type="p">112:第一表面</p>  
        <p type="p">114:第二表面</p>  
        <p type="p">116:側向斷裂</p>  
        <p type="p">118:中平面</p>  
        <p type="p">140:再分佈層</p>  
        <p type="p">142:金屬材料</p>  
        <p type="p">144:介電材料</p>  
        <p type="p">150:玻璃穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1712" publication-number="202621447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種晶圓承載裝置及半導體製程設備</chinese-title>  
        <english-title>WAFER CARRIER DEVICE AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/70</main-classification>  
        <further-classification edition="200601120260223B">F28F3/12</further-classification>  
        <further-classification edition="200601120260223B">F28D15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田西強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, XI QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佘清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHE, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種晶圓承載裝置及半導體製程設備，晶圓承載裝置用於在反應腔室中承載晶圓並控制所述晶圓的溫度，包括：托盤，用於承載晶圓；液冷盤，設置在托盤的下方，並藉由導流冷卻液以對托盤以及承載於托盤的晶圓進行冷卻；背板，設置在液冷盤的下方，並承載托盤和液冷盤；其中，背板包括本體和加強結構，加強結構和液冷盤分別位於本體的兩側，且加強結構位於本體的承載液冷盤的至少部分區域中。上述的晶圓承載裝置能增大背板的結構強度，避免背板在高溫環境下變形，而能避免晶圓的溫度升高及其不同區域存在溫差，提升了晶圓的沉積品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a wafer carrier device and a semiconductor processing equipment. The wafer carrier device is used for supporting a wafer within a reaction chamber and controlling the temperature of the wafer, including: a tray, configured to support the wafer; a liquid cooling plate, disposed below the tray and cooling the tray as well as the wafer supported thereon by directing cooling liquid; and a backplate, disposed below the liquid cooling plate and supporting both the tray and the liquid cooling plate; wherein the backplate includes a main body and a reinforcing structure, the reinforcing structure and the liquid cooling plate are respectively located on opposite sides of the main body, and the reinforcing structure is located in at least a portion of the area of the main body that supports the liquid cooling plate. The aforementioned wafer carrier device can increase the structural strength of the backplate, prevent deformation of the backplate in high-temperature environments, thereby avoiding an increase in the wafer’s temperature and temperature differences across different regions of the wafer, and thus improving the deposition quality of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:托盤</p>  
        <p type="p">2:液冷盤</p>  
        <p type="p">3:背板</p>  
        <p type="p">4:彈性件</p>  
        <p type="p">7:延伸壁</p>  
        <p type="p">8:波紋管</p>  
        <p type="p">201:導流通道</p>  
        <p type="p">202:進液管</p>  
        <p type="p">203:出液管</p>  
        <p type="p">301:本體</p>  
        <p type="p">302:加強結構</p>  
        <p type="p">303:中心通孔</p>  
        <p type="p">3021:管狀加厚體</p>  
        <p type="p">3022:環形加厚體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1713" publication-number="202619797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加氫脫氯催化劑</chinese-title>  
        <english-title>HYDRODECHLORINATION CATALYST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B01J23/54</main-classification>  
        <further-classification edition="200601120260202B">B01J23/56</further-classification>  
        <further-classification edition="200601120260202B">B01J37/18</further-classification>  
        <further-classification edition="202401120260202B">B01J35/50</further-classification>  
        <further-classification edition="200601120260202B">C07C9/04</further-classification>  
        <further-classification edition="200601120260202B">C07C19/03</further-classification>  
        <further-classification edition="200601120260202B">C07C19/043</further-classification>  
        <further-classification edition="200601120260202B">C07C19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商諾比恩工業化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOBIAN INDUSTRIAL CHEMICALS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫純寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHUNNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　拉爾　科涅里　伊莉莎白　約罕納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN LARE, CORNELIS ELIZABETH JOHANNUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茲南堡　亞伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZWIJNENBURG, AALBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維輝森　伯特　馬科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WECKHUYSEN, BERT MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種催化劑用於三氯甲烷的加氫脫氯的用途，該催化劑包含載體、負載在該載體上的活性金屬以及可選地負載在或添加到該載體上的第二金屬，該催化劑選自：(i) Pt-Mo/Al₂O₃催化劑，其中該載體為氧化鋁(Al₂O₃)，該活性金屬為鉑(Pt)，且該第二金屬為鉬(Mo)；(ii) Pt-Ag/Al₂O₃催化劑，其中該載體為氧化鋁(Al₂O₃)，該活性金屬為鉑(Pt)，且該第二金屬為銀(Ag)；(iii) Pt-Co/Al₂O₃催化劑，其中該載體為氧化鋁(Al₂O₃)，該活性金屬為鉑(Pt)，且該第二金屬為鈷(Co)；或(iv) Ir/SiO₂催化劑，其中該載體為二氧化矽(SiO₂)，且該活性金屬為銥(Ir)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Use of a catalyst comprising a carrier, an active metal supported on the carrier, and an optional second metal supported on or added to the carrier, for the hydrodechlorination of trichloromethane, the catalyst being selected from: (i) a Pt-Mo/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; catalyst, where the carrier is alumina (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;), the active metal is platinum (Pt), and the second metal is molybdenum (Mo); (ii) a Pt-Ag/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; catalyst, where the carrier is alumina (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;), the active metal is platinum (Pt), and the second metal is silver (Ag); (iii) a Pt-Co/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; catalyst, where the carrier is alumina (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;), the active metal is platinum (Pt), and the second metal is cobalt (Co); or (iv) an Ir/SiO&lt;sub&gt;2&lt;/sub&gt; catalyst, wherein the carrier is silica (SiO&lt;sub&gt;2&lt;/sub&gt;), and the active metal is iridium (Ir).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1-4:供應管線</p>  
        <p type="p">5:蒸發器</p>  
        <p type="p">6:固定床反應器</p>  
        <p type="p">7:氣相色譜儀</p>  
        <p type="p">8-10:洗氣瓶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1714" publication-number="202620028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光刻膠組成物及使用組成物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">C07C205/51</further-classification>  
        <further-classification edition="200601120260223B">C07C205/52</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慶雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KYOUNGAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛乘旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SEUNG-WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜恩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, EUNMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體光刻膠組成物及使用半導體光刻膠組成物形成圖案的方法。半導體光刻膠組成物包括有機金屬化合物、由化學式1表示的羧酸化合物；以及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="162px" width="204px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are provided. The semiconductor photoresist composition including an organometallic compound, a carboxylic acid compound represented by Chemical Formula 1; and a solvent. &lt;br/&gt;&lt;img align="absmiddle" height="44px" width="198px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="134px" width="209px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102:薄膜</p>  
        <p type="p">104:抗蝕劑底層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1715" publication-number="202620161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著劑組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09J183/05</main-classification>  
        <further-classification edition="200601120260223B">C09J183/07</further-classification>  
        <further-classification edition="201801120260223B">C09J7/25</further-classification>  
        <further-classification edition="201801120260223B">C09J7/20</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification>  
        <further-classification edition="202601120260223B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳井昌樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸岡高廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臼井友輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之接著劑組成物，係用以形成設於支撐基板、半導體基板或電子裝置基板之間之接著劑層， &lt;br/&gt;前述接著劑組成物，係含有藉由矽氫化反應而硬化之接著劑成分（A）； &lt;br/&gt;前述藉由矽氫化反應而硬化之接著劑成分（A），係含有聚矽氧烷（A1）； &lt;br/&gt;前述聚矽氧烷（A1），係含有：特定結構之聚有機矽氧烷（a1）、及具有Si-H基之聚有機矽氧烷（a2）； &lt;br/&gt;前述聚有機矽氧烷（a1）之含量，相對於前述聚矽氧烷（A1）之總質量，係78～90質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1716" publication-number="202620426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於獲取超音波測量資料的測量裝置和方法</chinese-title>  
        <english-title>MEASURING ARRANGEMENT AND METHOD FOR ACQUIRING ULTRASONIC MEASUREMENT DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G01N29/26</main-classification>  
        <further-classification edition="202201120260205B">G01F1/66</further-classification>  
        <further-classification edition="201901120260205B">B29C48/92</further-classification>  
        <further-classification edition="200601120260205B">G01P5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商愛麗瑪工程回收機械公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EREMA ENGINEERING RECYCLING MASCHINEN UND ANLAGEN GESELLSCHAFT M.B.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧梅茨伯格　亞力山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMETZBERGER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾格納　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIGNER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希德　佛羅里恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIEDER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決例如磨損、沉積物、不利的壓力條件、損失輸送效率、大量的濕氣浸入、裂紋等，提供一種用於獲取超音波測量資料的測量裝置，特別是用於從管狀物體內部獲取超音波測量資料、在該管狀物體中移動之材料的超音波測量資料的測量裝置，其中，該測量裝置（100）包括具有外護套的管狀物體（2）以及至少一個用於向該管狀物體（2）內部發射超音波的超音波感測器或超音波發射器（1），其中，該超音波感測器（1）以1° ＜ α ≤ 89°的耦合角α設置在該管狀物體（2）的該外護套中和/或該外護套上，該耦合角係在該超音波感測器（1）的縱軸與垂直於該管狀物體（2）的縱軸的直線之間測得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超音波感測器、超音波發射器</p>  
        <p type="p">2:管狀物體</p>  
        <p type="p">3:聚合物熔體</p>  
        <p type="p">100:測量裝置</p>  
        <p type="p">α&lt;sub&gt;St&lt;/sub&gt;:耦合角</p>  
        <p type="p">α&lt;sub&gt;Sch&lt;/sub&gt;:折射角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1717" publication-number="202620176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化性組合物以及形成膜和製造物件之方法</chinese-title>  
        <english-title>CURABLE COMPOSITION AND METHODS FOR FORMING FILM AND MANUFACTURING ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260223B">C09K23/42</main-classification>  
        <further-classification edition="202301120260223B">H10K71/13</further-classification>  
        <further-classification edition="200601120260223B">C08L33/26</further-classification>  
        <further-classification edition="200601120260223B">C08L83/10</further-classification>  
        <further-classification edition="200601120260223B">C08F2/50</further-classification>  
        <further-classification edition="200601120260223B">C08K5/5317</further-classification>  
        <further-classification edition="202601120260223B">H10W70/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤祐斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河田功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWATA, ISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村成希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田栄一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">固化性組合物包括聚合性化合物(a)、光聚合引發劑(b)和溶劑(d)。所述固化性組合物在23℃和1 atm下具有1.3 mPa·s至60 mPa·s的黏度。相對於整個固化性組合物，溶劑(d)的量為大於5體積%至95體積%。溶劑(d)的沸點小於250℃。在不包括溶劑(d)的狀態下的固化性組合物在23℃和1 atm下的黏度為8 mPa·s至30 mPa·s。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curable composition includes a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (d). The curable composition has a viscosity of 1.3 mPa·s to 60 mPa·s at 23°C and 1 atm. The amount of the solvent (d) ranges from more than 5% to 95% by volume relative to the entire curable composition. The boiling point of the solvent (d) is less than 250°C. The curable composition in a state excluding the solvent (d) has a viscosity of 8 mPa·s to 30 mPa·s at 23°C and 1 atm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:液滴</p>  
        <p type="p">103:液膜</p>  
        <p type="p">104:液膜</p>  
        <p type="p">105:溶劑</p>  
        <p type="p">106:模具</p>  
        <p type="p">107:照射光</p>  
        <p type="p">108:固化膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1718" publication-number="202620406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>稀釋裝置及使用其之粒度測定系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G01N1/38</main-classification>  
        <further-classification edition="202201120260205B">B01F33/82</further-classification>  
        <further-classification edition="202401120260205B">G01N15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商西村化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMITECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兼重卓爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANESHIGE, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種稀釋裝置，其可簡易地以極高倍率稀釋測定試樣。本發明之稀釋裝置（100）具備：第一容器（11），其可接收來自原液供給源（20）以及稀釋介質之第一供給源（31）之液體以獲得第一稀釋液，且構成為可輸送第一稀釋液；以及第二容器（12），其可接收來自所述第一容器（11）之第一稀釋液以及來自稀釋介質之第二供給源（32）之液體以獲得第二稀釋液；且構成為：所述原液供給源（20）可於1ml～100ml範圍內定量供給原料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一容器</p>  
        <p type="p">12:第二容器</p>  
        <p type="p">13:第三容器</p>  
        <p type="p">20:原液供給源</p>  
        <p type="p">30:稀釋介質供給源</p>  
        <p type="p">31:稀釋介質之第一供給源</p>  
        <p type="p">32:稀釋介質之第二供給源</p>  
        <p type="p">33:稀釋介質之第三供給源</p>  
        <p type="p">41a:第一供給管線</p>  
        <p type="p">41b:第一輸送管線</p>  
        <p type="p">42a:第二供給管線</p>  
        <p type="p">42b:第二輸送管線</p>  
        <p type="p">43a:第三供給管線</p>  
        <p type="p">43b:第三輸送管線</p>  
        <p type="p">45:橋接供給管線</p>  
        <p type="p">51:第一供給機構</p>  
        <p type="p">52:第二供給機構</p>  
        <p type="p">52a:第一管線混合器</p>  
        <p type="p">53:第三供給機構</p>  
        <p type="p">53a:第二管線混合器</p>  
        <p type="p">60:氣體供給源</p>  
        <p type="p">70:廢液管線</p>  
        <p type="p">100:稀釋裝置</p>  
        <p type="p">200:粒度測定裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1719" publication-number="202620029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光刻膠組合物及使用所述組合物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張水民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SOOBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡閏珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, YUNJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JOONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體光刻膠組合物及使用所述半導體光刻膠組合物形成圖案的方法。半導體光刻膠組合物包含：有機金屬化合物，由化學式1表示；以及溶劑。有機金屬化合物包含錫及至少一個醯胺基配體，所述醯胺基配體含有經取代或未經取代的烯基部分或炔基部分。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="213px" width="202px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition are provided. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent. The organometallic compound includes tin and at least one amido ligand containing a substituted or unsubstituted alkenyl moiety or alkynyl moiety. &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="173px" width="161px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板/半導體基板</p>  
        <p type="p">108:光刻膠圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1720" publication-number="202621050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>時脈突波偵測電路</chinese-title>  
        <english-title>CLOCK GLITCH DETECTION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260109B">H03K5/26</main-classification>  
        <further-classification edition="200601120260109B">H03K5/125</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熵碼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUFSECURITY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵啓意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, CHI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王盛宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芷妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所申請內容揭示一種時脈突波偵測電路包括時脈產生器、計數器及偵測單元。時脈產生器接收輸入時脈信號，並在輸入時脈信號在第一電壓下時產生頻率高於輸入時脈信號的參考時脈信號。計數器在輸入時脈信號在第一電壓下時，計數參考時脈信號所經過之週期數量的目前積累數。偵測單元在輸入時脈信號從第一電壓變為第二電壓之後，計算先前積累數與目前積累數之間的差值。偵測單元依據先前目前積累數與目前積累數之間的差值產生警報信號，並將目前積累數儲存為先前積累數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a clock glitch detection circuit including a clock generator, a counter, and a detection unit. The clock generator receives an input clock signal, and generates a reference clock signal having a frequency higher than that of the input clock signal when the input clock signal is at a first voltage. The counter counts a current accumulated number of cycles of the reference clock signal that occur while the input clock signal is at the first voltage. The detection unit calculates a difference between the previous accumulated number and the current accumulated number after the input clock signal changes from the first voltage to a second voltage. The detection unit generates an alarm signal according to the difference between the previous accumulated number and the current accumulated number and stores the current accumulated number as the previous accumulated number.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:時脈突波偵測電路</p>  
        <p type="p">110:時脈產生器</p>  
        <p type="p">120:計數器</p>  
        <p type="p">130:偵測單元</p>  
        <p type="p">132,1342,1362:暫存器</p>  
        <p type="p">134:減法器</p>  
        <p type="p">136:比較邏輯電路</p>  
        <p type="p">140:時序控制單元</p>  
        <p type="p">142:反相器</p>  
        <p type="p">146:SR閂鎖器</p>  
        <p type="p">148:延遲控制單元</p>  
        <p type="p">1341:超前進位減法器</p>  
        <p type="p">1361:邏輯電路</p>  
        <p type="p">1482,1484,1486:延遲元件</p>  
        <p type="p">CR1:比較結果</p>  
        <p type="p">D:資料輸入端</p>  
        <p type="p">D1:差值</p>  
        <p type="p">NC1:目前積累數</p>  
        <p type="p">NP1:先前積累數</p>  
        <p type="p">Q:資料輸出端</p>  
        <p type="p">R:重置端</p>  
        <p type="p">S:設定端</p>  
        <p type="p">SIG&lt;sub&gt;AL1&lt;/sub&gt;:警報信號</p>  
        <p type="p">SIG&lt;sub&gt;CKIN&lt;/sub&gt;:輸入時脈信號</p>  
        <p type="p">SIG&lt;sub&gt;CT1&lt;/sub&gt;:控制信號</p>  
        <p type="p">SIG&lt;sub&gt;CT2&lt;/sub&gt;:控制信號</p>  
        <p type="p">SIG&lt;sub&gt;CT3&lt;/sub&gt;:控制信號</p>  
        <p type="p">SIG&lt;sub&gt;IVCK&lt;/sub&gt;:反相輸入時脈信號</p>  
        <p type="p">SIG&lt;sub&gt;REF1&lt;/sub&gt;:參考時脈信號</p>  
        <p type="p">SIG&lt;sub&gt;SEQ1&lt;/sub&gt;:時序控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1721" publication-number="202621545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板</chinese-title>  
        <english-title>PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/40</main-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　性振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例涉及通過調節玻璃芯的上部和下部的物性差異來提高抗熱震性、耐衝擊性、耐久性、可靠性等的封裝基板。實例的封裝基板是包括玻璃芯、佈線層及絕緣層的封裝基板，佈線層為配置於玻璃芯的表面的導電層，絕緣層為配置於導電層之間的層，封裝基板具有上部面以及下部面，配置於玻璃芯的上部的絕緣層為上部絕緣層，在絕緣層的上部還配置有覆蓋層，配置於玻璃芯的下部的絕緣層為下部絕緣層，在下部絕緣層的下部還配置有阻焊層，柔韌性指數FI為由以下式1表示的值，覆蓋層的FI具有大於阻焊層的FI的值。式1：FI=10000×（E'×tanδ）/（H×Er），在式1中，E'為儲能模量，tanδ為損耗正切，H為硬度，Er為阻尼模量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment relates to a packaging substrate having improved thermal shock resistance, impact resistance, durability, reliability and the like by controlling a difference in physical properties between an upper portion and a lower portion of a glass core. The packaging substrate of the embodiment comprises: a glass core; a wiring layer; and an insulating layer, wherein the glass core is a plate-shaped glass in which vias are disposed, the wiring layer is an electrically conductive layer disposed on a surface of the glass core, the insulating layer is a layer disposed in a space between the electrically conductive layers and comprising a mixture of a polymer resin and an insulating filler, the packaging substrate has an upper surface on which a semiconductor element is mounted and a lower surface facing the upper surface, the insulating layer disposed on an upper portion of the glass core is an upper insulating layer, a cover layer is further disposed on the upper insulating layer, the insulating layer disposed on a lower portion of the glass core is a lower insulating layer, and a solder resist layer is further disposed on the lower insulating layer. A flexibility index (FI) is a value represented by Equation 1 below, and the FI of the cover layer is greater than the FI of the solder resist layer. [Equation 1] FI = 10,000 × (E' × tan δ) / (H × Er) In Equation 1, E' is a storage modulus (GPa), tan δ is a loss tangent, H is a hardness (GPa), and Er is a reduced modulus (GPa).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:封裝基板</p>  
        <p type="p">210:玻璃芯</p>  
        <p type="p">230:穿孔</p>  
        <p type="p">300:佈線層</p>  
        <p type="p">400:絕緣層</p>  
        <p type="p">500:覆蓋層</p>  
        <p type="p">600:阻焊層</p>  
        <p type="p">A-A':線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1722" publication-number="202620241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理鈦材及接合體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C23C22/28</main-classification>  
        <further-classification edition="200601120251223B">C25D11/02</further-classification>  
        <further-classification edition="200601120251223B">C25D11/16</further-classification>  
        <further-classification edition="200601120251223B">C23C28/00</further-classification>  
        <further-classification edition="200601120251223B">B32B15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神戶製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝野大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUNO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋佑輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於接著接合且可更進一步提高接著性的表面處理鈦材、及包括所述表面處理鈦材的接合體。一種表面處理鈦材，在鈦基材的表面的至少一部分設置有矽烷皮膜，在針對設置有矽烷皮膜的區域中最表面的區域R1、與距區域R1為10 nm深度的區域R2，藉由輝光放電發光分光法測定元素分佈的情況下，區域R1中的矽的原子濃度為3.0原子%以上且30.0原子%以下。另外，基於區域R1中的矽的原子濃度A1與區域R2中的矽的原子濃度A2，藉由下述式（1）而算出的矽濃度的降低率M為50%以上。 &lt;br/&gt;&lt;br/&gt;M=（（A1-A2）/A1）×100  ･･･（1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1723" publication-number="202620141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性ＵＶ固化塗料組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">C09D175/04</main-classification>  
        <further-classification edition="200601120260127B">C09D133/08</further-classification>  
        <further-classification edition="200601120260127B">C09D4/02</further-classification>  
        <further-classification edition="200601120260127B">C08G2/02</further-classification>  
        <further-classification edition="200601120260127B">C08F2/48</further-classification>  
        <further-classification edition="200601120260127B">C08F2/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商ＰＰＧ塗料（天津）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PPG COATINGS (TIANJIN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杨文服</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋元杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YUANJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杨坡良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, POLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康鲁浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, LUHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋立明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, LIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了一種水性UV固化塗料組合物，包括第一聚氨酯丙烯酸酯樹脂和第二聚氨酯丙烯酸酯樹脂，其中所述第一聚氨酯丙烯酸酯樹脂具有6或更高的官能度，所述第二聚氨酯丙烯酸酯樹脂具有4或更低的官能度，所述第一聚氨酯丙烯酸酯樹脂包含衍生自聚碳酸酯二元醇的部分。還揭露了一種經塗覆的基材，包括基材和塗覆於至少部分基材上的所述水性UV固化塗料組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1724" publication-number="202619995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紅外線範圍內具有高吸收之不透明石英玻璃</chinese-title>  
        <english-title>OPAQUE QUARTZ GLASS HAVING HIGH ABSORPTION IN THE INFRARED RANGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C03C14/00</main-classification>  
        <further-classification edition="200601120260223B">C03B19/02</further-classification>  
        <further-classification edition="200601120260223B">C03B20/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商賀利氏石英玻璃有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS QUARZGLAS GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈森多弗　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTZENDORFER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查理奇　納汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSCHOLITSCH, NADINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈默施密特　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMERSCHMIDT, JORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰內克　托爾斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENEK, TORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋斯利　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESSELY, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種在近紅外線範圍內具有高吸收之不透明石英玻璃，及一種用於生產該不透明石英玻璃之方法。本發明亦係關於根據本發明之該不透明石英玻璃或由根據本發明之該方法所得的該不透明石英玻璃在其中加工半導體晶圓的程序腔中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an opaque quartz glass having high absorption in the near infrared range and to a method for producing same. The present invention also relates to the use of the opaque quartz glass according to the invention or the opaque quartz glass resulting from the method according to the invention in process chambers in which semiconductor wafers are processed.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1725" publication-number="202619884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在反射中展現經圖案化外觀之製品及相關聯方法</chinese-title>  
        <english-title>ARTICLES EXHIBITING PATTERNED APPEARANCE IN REFLECTION AND ASSOCIATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260206B">B32B7/023</main-classification>  
        <further-classification edition="200601120260206B">G02B5/02</further-classification>  
        <further-classification edition="200601120260206B">B44C5/04</further-classification>  
        <further-classification edition="200601120260206B">B41M3/06</further-classification>  
        <further-classification edition="200601120260206B">B41J2/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾隆佐　卡羅斯法蘭西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALONZO, CARLOS FRANCIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>季碧碧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, BIBI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵根榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, GENRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>託卡　約書亞李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKAR, JOSHUA LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中描述一種製品，其包含一基板及安置在該基板之一主表面上之一總成。該總成包括靠近該主表面安置之一第一油墨層，及一中間層。該第一油墨層採用一隨機化的液滴分佈來印刷，而該中間層經組態以反射透射通過該第一油墨層之環境光，以當自第一主表面檢視該製品時，在反射中呈現一圖案。該圖案包含一顏色邊界，該顏色邊界延伸至少5 mm之一距離，且當該第一主表面由一D65光源照射時，該顏色邊界對於一肉眼可見。該第一油墨層經印刷使得當一顯示面板定位在該總成後方且經通電以穿過該總成及基板發射光時，透過該總成及基板看不見干涉圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are article comrpsing a substrate and an assembly disposed on a major surface of the substrate. The assembly includes a first ink layer disposed proximate to the major surface and an intermediate layer. The first ink layer is printed with a randomized droplet distribution, while the intermediate layer is configured to reflect ambient light transmitted through the first ink layer to render a pattern in reflection when the article is viewed from the first major surface. The pattern comprises a color boundary that extends a distance of at least 5 mm and is visible to a naked eye when the first major surface is illuminated by a D65 light source. The first ink layer is printed such that, when a display panel is positioned behind the assembly and powered on to emit light through the assembly and substrate, no interference pattern is visible through the assembly and substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">460:總成</p>  
        <p type="p">600:中間層</p>  
        <p type="p">602:第一油墨層</p>  
        <p type="p">603a:較高折射率材料</p>  
        <p type="p">603b:較低折射率材料</p>  
        <p type="p">604:第二油墨層</p>  
        <p type="p">605:支撐結構</p>  
        <p type="p">607:第二基板</p>  
        <p type="p">609:反射體層</p>  
        <p type="p">620:對準軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1726" publication-number="202621111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視頻編解碼方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260205B">H04N19/103</main-classification>  
        <further-classification edition="201401120260205B">H04N19/157</further-classification>  
        <further-classification edition="201401120260205B">H04N19/593</further-classification>  
        <further-classification edition="201401120260205B">H04N19/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃毓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在視頻編解碼中導出最可能模式（MPM）列表的方法和裝置被披露。根據該方法，確定來自複數個MPM候選的一個或多個目標MPM候選是否滿足優先條件，其中該優先條件包括預定義的幀內預測模式索引或角度。根據是否滿足該一個或多個優先條件生成MPM列表，其中該生成MPM列表包括以下操作中的至少一項：將該一個或多個目標MPM候選插入該MPM列表，從該MPM列表中移除該一個或多個目標MPM候選，將該一個或多個目標MPM候選在該MPM列表中向後或向前移動。使用修改後的MPM列表編碼或解碼該當前塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus for deriving an MPM list in video coding are disclosed. According to this method, whether one or more target MPM (Most Probable Mode) candidates from a plurality of MPM candidates meet priority conditions are determined, wherein the priority conditions comprise pre-defined intra prediction mode indexes or angles. An MPM list is generated depending on whether said one or more priority conditions are met, wherein said generating the MPM list comprises at least one of following operations: inserting said one or more target MPM candidates into the MPM list, removing said one or more target MPM candidates from the MPM list, moving said one or more target MPM candidates backward or forward within the MPM list. The current block is encoded or decoded by using the modified MPM list.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1010-1040:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1727" publication-number="202621195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數位化阻抗匹配電路和等離子體處理設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H05H1/36</main-classification>  
        <further-classification edition="200601120260223B">H01J37/02</further-classification>  
        <further-classification edition="202601120260223B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂衛平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐亞海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝幸光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種數位化阻抗匹配電路和等離子體處理設備，等離子體處理設備包括射頻模組，射頻模組用於輸出射頻信號至負載，數位化阻抗匹配電路包括轉換電路、處理電路和阻抗匹配器。轉換電路將射頻模組的射頻信號轉換為數位信號；處理電路根據數位信號計算射頻模組的實際阻抗，並將實際阻抗與預設阻抗進行比較，並根據比較結果生成對應的控制信號；阻抗匹配器根據控制信號對射頻模組的實際阻抗進行調節，以使射頻模組與負載之間的阻抗匹配。本發明通過數位化控制方式實現射頻模組與負載之間的阻抗匹配，具有高精度、高靈活性以及高穩定性的特點，在等離子體處理設備中提供了更高的信號傳輸效率和成本效益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:阻抗匹配器</p>  
        <p type="p">20:轉換電路</p>  
        <p type="p">30:處理電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1728" publication-number="202621287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202501120260223B">H10D64/60</further-classification>  
        <further-classification edition="202501120260223B">H10D89/10</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification>  
        <further-classification edition="200601120260223B">G11C7/18</further-classification>  
        <further-classification edition="200601120260223B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEONGGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金利桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YIHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙南振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, NAMJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括：包含第一主動區的基板；與第一主動區相交並在第一方向上延伸的字元線；以及與字元線相交並在第二方向上延伸的位元線，其中位元線包括：包括半導體材料的第一位元線導電層；第一位元線導電層上的第二位元線導電層；第二位元線導電層上的第三位元線導電層；以及第三位元線導電層上的第四位元線導電層，其中第四位元線導電層包括金屬材料，其中第三位元線導電層包括所述金屬材料和第一半導體材料的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate including a first active region, a word line intersecting the first active region and extending in a first direction, and a bit line intersecting the word line and extending in a second direction, in which the bit line includes a first bit line conductive layer including a semiconductor material, a second bit line conductive layer on the first bit line conductive layer, a third bit line conductive layer on the second bit line conductive layer, and a fourth bit line conductive layer on the third bit line conductive layer, wherein the fourth bit line conductive layer includes a metallic material, wherein the third bit line conductive layer includes a compound of the metallic material and a first semiconductor material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">112:第一元件隔離層</p>  
        <p type="p">132:閘極絕緣層</p>  
        <p type="p">134:字元線頂蓋層</p>  
        <p type="p">151:第一位元線導電層</p>  
        <p type="p">153:第二位元線導電層</p>  
        <p type="p">155:第三位元線導電層</p>  
        <p type="p">156:第一位元線頂蓋層</p>  
        <p type="p">157:第四位元線導電層</p>  
        <p type="p">158:第二位元線頂蓋層</p>  
        <p type="p">640:絕緣層</p>  
        <p type="p">642:第一絕緣層</p>  
        <p type="p">644:第二絕緣層</p>  
        <p type="p">646:第三絕緣層</p>  
        <p type="p">660:絕緣圖案</p>  
        <p type="p">B-B':線</p>  
        <p type="p">AR1:第一主動區</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLC:位元線頂蓋層</p>  
        <p type="p">BLS:位元線結構</p>  
        <p type="p">DC:位元線接觸件</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR3:第三方向</p>  
        <p type="p">R3:區域</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">WLS:字元線結構</p>  
        <p type="p">WLT:字元線溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1729" publication-number="202620211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錫金合金、鑄造品及塑性加工品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">C22C13/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商能作貴稀金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOUSAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能作千春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOUSAKU, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有銀白色之金屬光澤、亦具有柔軟性、耐氧化性及耐腐蝕性、並且拉伸強度得到改善之錫金合金。一種錫金合金，包含：90質量%以上且99質量%以下之錫、1質量%以上且10質量%以下之金、以及作為剩餘部分之不可避免之雜質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1730" publication-number="202620620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於資料處理的積體電路、處理器和計算設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">G06F7/575</main-classification>  
        <further-classification edition="200601120260127B">G06F7/483</further-classification>  
        <further-classification edition="201801120260127B">G06F9/30</further-classification>  
        <further-classification edition="201801120260127B">G06F9/38</further-classification>  
        <further-classification edition="200601120260127B">G06F17/15</further-classification>  
        <further-classification edition="200601120260127B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商摩爾線程智能科技（上海）有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE THREADS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種用於資料處理的積體電路、處理器和計算設備。該積體電路包括資料儲存電路以及矩陣運算電路。資料儲存電路被配置為儲存矩陣資料。矩陣運算電路包括：控制邏輯電路，被配置為：基於指定資料格式，從資料儲存電路讀取第一矩陣和第二矩陣，其中，指定資料格式指示第一矩陣中的元素為浮點型資料，第二矩陣中的元素為整數型資料；以及，運算邏輯電路，被配置為：根據指定資料格式所指示的元素的資料類型，將第一矩陣和第二矩陣中的元素轉換為目標浮點型的元素，並基於轉換後的第一矩陣和第二矩陣的元素，確定與第一矩陣和第二矩陣相對應的結果矩陣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:積體電路</p>  
        <p type="p">210:資料儲存電路</p>  
        <p type="p">220:矩陣運算電路</p>  
        <p type="p">221:控制邏輯電路</p>  
        <p type="p">222:運算邏輯電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1731" publication-number="202619666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可移動設備的控制方法、控制裝置、可移動設備和可讀儲存媒體</chinese-title>  
        <english-title>CONTROL METHOD AND CONTROL APPARATUS FOR MOVABLE DEVICE, MOVABLE DEVICE, AND READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">A47L11/24</main-classification>  
        <further-classification edition="200601120251211B">A47L11/40</further-classification>  
        <further-classification edition="200601120251211B">B25J9/16</further-classification>  
        <further-classification edition="200601120251211B">B25J19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供了一種可移動設備的控制方法、裝置、可移動設備和儲存媒體，涉及智能家居領域。可移動設備包括設備主體以及設置於設備主體的機械臂，設備主體還設置有急停模組。該控制方法包括：檢測到急停模組被按壓，且機械臂處於工作動作或復位動作中，則控制機械臂進入急停狀態。在急停狀態下，機械臂斷電，或者機械臂帶電並保持當前位姿。本公開實施例，使用者在使用機械臂相關功能時，可以隨時實現按鍵急停，實現了及時干預處理緊急情況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a control method and a control apparatus for a movable device, a movable device, and a storage medium, and relates to the field of smart home. The movable device includes a device body and a mechanical arm arranged on the device body, and the device body is further provided with an emergency stop module. The control method includes: in a case of detecting that the emergency stop module is pressed and the mechanical arm is in a working motion or a reset motion, controlling the mechanical arm to enter an emergency stop state. In the emergency stop state, the mechanical arm is powered off, or the mechanical arm remains powered and maintains a current position and posture. According to embodiments of the present disclosure, when a user uses functions related to the mechanical arm, the user may realize an emergency stop via pressing a button at any time, thus enabling timely intervention to handle emergency situations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1732" publication-number="202621006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260108B">H02K1/27</main-classification>  
        <further-classification edition="202501120260108B">H02K15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美倍亞三美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINEBEA MITSUMI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文字山竜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONJIYAMA, RYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於例如提高轉子的生產性。例如一種轉子（160、260），包括第一磁鐵（161A）、第二磁鐵（161B）及磁性體（165A、265A），磁性體（165A、265A）包括第一側面（165Aa、265Aa）及第二側面（165Ab、265Ab），第一磁鐵（161A）與第二磁鐵（161B）經由磁性體（165A、265A）相互磁性排斥，在周向上，在第一磁鐵（161A）與第二磁鐵（161B）之間形成有具有較磁性體（165A、265A）高的磁阻且沿旋轉軸方向延伸的區域（Ga、Gb、H），第一磁鐵（161A）被磁性吸引至第一側面（165Aa、265Aa），第二磁鐵（161B）被磁性吸引至第二側面（165Ab、265Ab）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">160:轉子</p>  
        <p type="p">161:多個磁鐵(多個外側磁鐵)</p>  
        <p type="p">161A:第一磁鐵</p>  
        <p type="p">161Ab、161Ba:面</p>  
        <p type="p">161B:第二磁鐵</p>  
        <p type="p">162A:內側磁鐵</p>  
        <p type="p">163:轉子芯</p>  
        <p type="p">164:環狀部</p>  
        <p type="p">165:多個磁極片(多個磁性體、磁極片)</p>  
        <p type="p">165A:磁性體(磁極片)</p>  
        <p type="p">165Aa:第一側面</p>  
        <p type="p">165Ab:第二側面</p>  
        <p type="p">165Ac:中間部分</p>  
        <p type="p">165Ad:內周部</p>  
        <p type="p">166、167:連結部</p>  
        <p type="p">168:多個開口部</p>  
        <p type="p">c、d:箭頭</p>  
        <p type="p">C:圓筒</p>  
        <p type="p">F1a、F1b:磁性的吸引力(吸引力)</p>  
        <p type="p">F2a、F2b:磁性的排斥力(排斥力)</p>  
        <p type="p">Ga、Gb:區域(空隙)</p>  
        <p type="p">S:空間</p>  
        <p type="p">X:旋轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1733" publication-number="202619819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼的連續鑄造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">B22D11/16</main-classification>  
        <further-classification edition="200601120260121B">B22D11/12</further-classification>  
        <further-classification edition="200601120260121B">B22D11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>入江脩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIE, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒牧則親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAMAKI, NORICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西口範孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIGUCHI, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田航平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMADA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的鋼的連續鑄造方法是利用設置有多個輥段的連續鑄造機來鑄造，所述多個輥段具有夾持並支撐自鑄模抽出的鑄坯的多個鑄坯支撐輥對，所述鋼的連續鑄造方法中，將包含鑄坯的最終凝固位置的輥段設為第一輥段，將在連續鑄造機中位於鑄坯抽出方向的最下游處的所述輥段設為第二輥段，將自第一輥段以後至第二輥段為止的鑄坯的壓下量的合計即總壓下量設為6[mm]以上，且將第一輥段以後至第二輥段為止的各輥段的各自的壓下量的範圍設為0.1[mm]以上且5[mm]以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:連續鑄造機</p>  
        <p type="p">12:鋼水</p>  
        <p type="p">13:鑄模</p>  
        <p type="p">14:餵槽</p>  
        <p type="p">15:浸漬噴嘴</p>  
        <p type="p">16:鑄坯支撐輥對</p>  
        <p type="p">17:噴霧噴嘴</p>  
        <p type="p">18:鑄坯</p>  
        <p type="p">18a:未凝固部</p>  
        <p type="p">18b:最終凝固位置(凝固完成位置)</p>  
        <p type="p">19:輕壓下帶</p>  
        <p type="p">20、20Aa、20Ab、20B:輥段</p>  
        <p type="p">21:搬送輥</p>  
        <p type="p">22:下部矯正位置</p>  
        <p type="p">A1:水平帶區域</p>  
        <p type="p">D1:鑄坯抽出方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1734" publication-number="202619763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滅火用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A62D1/00</main-classification>  
        <further-classification edition="200601120260202B">A62C5/02</further-classification>  
        <further-classification edition="201001120260202B">A62C99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商森田控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安井亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富田洋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井亮輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋知也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤千尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森高喜芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITAKA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本直久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, NAOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種流動展開性、及起泡性優異，且環境負荷得到抑制之滅火用組合物。 &lt;br/&gt;本發明係一種滅火用組合物，其含有(A)烷基單甘油酯、(B)兩性界面活性劑、及(C)烷基葡萄糖苷，上述(A)與上述(C)之質量比((A)/(C))為0.8以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1735" publication-number="202621491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝模組及其製造方法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W40/22</main-classification>  
        <further-classification edition="202601120260223B">H10W74/10</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環鴻電子(昆山)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐振成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, CHEN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電子封裝模組，此電子封裝模組包含線路基板、設置於線路基板上的電子元件以及密封層、設置於密封層的凹槽內的導熱材料以及設置於導熱材料上的散熱元件。電子元件電性連接至線路基板，且具有背對線路基板的頂表面。密封層包覆電子元件，且密封層的凹槽位於電子元件上。此凹槽的底面暴露電子元件的頂表面。導熱材料位於電子元件的頂表面上，並且具有遠離電子元件的一第一表面，而密封層具有遠離線路基板的一第二表面，第一表面與第二表面齊平。導熱材料位於電子元件以及散熱元件之間。如此一來，可以提升電子封裝模組的散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package module is provided. The electronic package module includes a circuit substrate, an electronic component and an encapsulation layer disposed on the circuit substrate, a thermal conductive material disposed inside a cavity of the encapsulation layer and a heat sink disposed on the thermal conducitve material. The electronic component is electronically connected to the cirucuit substrate and has a top surface facing away the circuit substrate. The encapsulation layer encapsulates the electronic component, while the cavity of the encapsulation layer is located at the electronic component. The bottom surface of the cavity exposes the top surface of the electronic component. The thermal conductive material is located at the top surface of the electronic component and has a first surface of the electronic component which is away from the electronic component. The encapsulation layer has a second surface which is away from the circuit substrate, while the first surface is flush with the second surface. The thermal conductive material is located between the electronic component and the heat sink. Therefore, the heat dissipation of the electronic package module increases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子封裝模組</p>  
        <p type="p">102:接墊</p>  
        <p type="p">110:線路基板</p>  
        <p type="p">110f,110s,140f,160f:表面</p>  
        <p type="p">120,170,190:電子元件</p>  
        <p type="p">120t,170t:頂表面</p>  
        <p type="p">140:密封層</p>  
        <p type="p">142:凹槽</p>  
        <p type="p">142b:底面</p>  
        <p type="p">150:金屬層</p>  
        <p type="p">160:導熱材料</p>  
        <p type="p">180:散熱元件</p>  
        <p type="p">d1:深度</p>  
        <p type="p">S1,S2:焊接結構</p>  
        <p type="p">t1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1736" publication-number="202621088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260217B">H04L27/26</main-classification>  
        <further-classification edition="200901120260217B">H04W84/12</further-classification>  
        <further-classification edition="200601120260217B">H04L5/00</further-classification>  
        <further-classification edition="202301120260217B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請設計了一種適用於DRU的LTF序列，該LTF序列可以在不同DRU傳輸下均具有較低的PAPR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application relates to the field of communications technology, and more particularly to a communication method and apparatus. The application may be applied to IEEE 802.11ax, 802.11be, 802.11bn, and other IEEE 802.11 standards, such as 802.15, 802.11bf, IMMW, and spark link. The application designs a LTF sequence suitable for a DRU, which can achieve a low PAPR under different DRU transmission conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1737" publication-number="202619998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於回收玻璃之方法</chinese-title>  
        <english-title>METHOD FOR RECYCLING GLASS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260216B">C03C23/00</main-classification>  
        <further-classification edition="202201120260216B">B09B3/50</further-classification>  
        <further-classification edition="202201120260216B">B09B3/70</further-classification>  
        <further-classification edition="200601120260216B">B08B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江佩珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PEI-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周惠珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HUI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃煒琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚蒙蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, MENGMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種玻璃回收方法，其包括將該玻璃安置於一腔室中；用一雷射照射該玻璃之表面，保持一雷射照射時間；將酸性溶液引入該腔室中並將該玻璃暴露於該酸性溶液，保持一第一暴露時間；將鹼性溶液引入該腔室中並將該玻璃暴露於該鹼性溶液，保持一第二暴露時間；及在該雷射照射時間、該第一暴露時間及該第二暴露時間期間，振動並旋轉該腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass recycling method includes positing the glass in a chamber, irradiating surfaces of the glass with a laser over a laser irradiation time, introducing an acidic solution to the chamber and exposing the glass to the acidic solution over a first exposure time, introducing an alkaline solution to the chamber and exposing the glass to the alkaline solution over a second exposure time, and vibrating and rotating the chamber during the laser irradiation time, the first exposure time, and the second exposure time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:TFT玻璃</p>  
        <p type="p">3:TFT膜</p>  
        <p type="p">4:CF玻璃</p>  
        <p type="p">5:CF膜</p>  
        <p type="p">6:密封劑</p>  
        <p type="p">7:廢面板玻璃</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1738" publication-number="202621077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142635</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04L5/00</main-classification>  
        <further-classification edition="200601120260102B">H04L27/26</further-classification>  
        <further-classification edition="200901120260102B">H04W52/02</further-classification>  
        <further-classification edition="202301120260102B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請設計了一種適用於DRU的LTF序列，該LTF序列可以在不同DRU傳輸下均具有較低的PAPR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communications technologies, and in particular, to a communication method and apparatus. This application may be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or SparkLink standard. This application designs an LTF sequence suitable for DRUs, which can have a relatively low PAPR under different DRU transmissions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1739" publication-number="202621048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉壓器</chinese-title>  
        <english-title>LEVEL SHIFTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260114B">H03K5/003</main-classification>  
        <further-classification edition="200601120260114B">H03K19/0185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃智揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煒強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONG, WEI-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古惟銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾承諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉明源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種轉壓器，包括：一交叉耦合電路、一差動對電路、一反閘與一拉引元件。反閘接收輸入信號並產生反相輸入信號。交叉耦合電路連接至第一節點與第二節點，且交叉耦合電路接收第一供應電壓，且第二節點的電壓作為輸出信號。差動對電路連接至第一節點與第二節點，且差動對電路接收接地電壓、輸入信號與反向輸入信號。拉引元件連接至第二節點，且拉引元件接收致能信號。當致能信號未動作時，輸出信號維持在一特定邏輯準位。當致能信號動作時，輸出信號跟隨該輸入信號的變化而變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A level shifter includes a cross-coupled circuit, a differential pair circuit, a NOT gate and a pulling device. The NOT gate receives an input signal and generates an inverted input signal. The cross-coupled circuit is connected to a first node and a second node. The cross-coupled circuit receives a first supply voltage. The voltage at the second node is used as an output signal. The differential pair circuit is connected to the first node and the second node. The differential pair circuit receives a ground voltage, the input signal and the inverted input signal. The pulling device is connected to the second node. The pulling device receives an enable signal. When the enable signal is not activated, the output signal is maintained at a specified logic level. When the enable signal is activated, the output signal changes with a change of the input signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">212:交叉耦合電路</p>  
        <p type="p">216:反閘</p>  
        <p type="p">234:差動對電路</p>  
        <p type="p">240:轉壓器</p>  
        <p type="p">242:拉引元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1740" publication-number="202620882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具內建式自我測試的記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE WITH BUILT-IN SELF-TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">G11C29/12</main-classification>  
        <further-classification edition="200601120260108B">G11C16/06</further-classification>  
        <further-classification edition="200601120260108B">G06F11/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熵碼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUFSECURITY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵啓意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, CHI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-CHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭示了一種記憶體裝置。該記憶體裝置包含單次編程單元陣列、物理不可複製函數單元陣列、以及控制器。單次編程單元陣列包含複數個單次編程單元。物理不可複製函數單元陣列包含複數個物理不可複製函數單元。控制器對該物理不可複製函數單元陣列執行第一讀取操作以讀取複數個第一位元值，在第一讀取操作之後對物理不可複製函數單元陣列執行第二讀取操作以讀取複數個第二位元值，對等第一位元值和等第二位元值執行比較操作，以及根據比較操作的結果來判定是否允許單次編程載入操作以讀取單次編程單元陣列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a memory device. The memory device includes a one-time programmable (OTP) cell array, a physical unclonable function (PUF) cell array, and a controller. The OTP cell array includes a plurality of OTP cells. The PUF cell array includes a plurality of PUF cells. The controller performs a first read operation upon the PUF cell array to read a plurality of first bit values, performs a second read operation upon the PUF cell array to read a plurality of second bit values after the first read operation, performs a comparison operation upon the first bit values and the second bit values, and determines whether to allow an OTP load operation for reading the OTP cell array according to a result of the comparison operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M1:方法</p>  
        <p type="p">S110~S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1741" publication-number="202619839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具機</chinese-title>  
        <english-title>MACHINE TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B23Q17/00</main-classification>  
        <further-classification edition="200601120251201B">B23B31/06</further-classification>  
        <further-classification edition="200601120251201B">B23Q3/06</further-classification>  
        <further-classification edition="200601120251201B">B23B19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商星精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAR MICRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香川祐樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志鎌耕一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGAMA, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出野真敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能精密地判定夾持不良之工具機。 &lt;br/&gt;在具備具有夾持棒狀之原材料W1之筒夾夾頭48之第1主軸4，且藉由反覆執行加工動作來加工由筒夾夾頭48夾持之原材料W1而製造出複數個相同形狀之產品之NC車床1中，具備判定元件23，該判定元件23根據表示加工動作處於哪個時間點之加工時間點資訊及截至上次為止之加工動作中筒夾夾頭48夾持原材料W1時之夾持力資訊即夾持力歷程資訊中之至少一種資訊、以及本次之加工動作中筒夾夾頭48夾持原材料W1時之夾持力資訊即當前夾持力資訊，針對第1主軸4之夾持不良執行判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An NC lathe that includes a first spindle including a collet chuck that grips a material of a bar shape, and machines the material gripped by the collet chuck and manufactures a plurality of products having an identical shape by repeatedly executing a machining operation includes determination means for executing determination on a gripping failure of the first spindle based on at least one information of machining timing information and gripping force history information, and current gripping force information, the machining timing information indicating at which timing the machining operation is performed, the gripping force history information being information of a gripping force at a time when the collet chuck grips the material during the machining operations up to the previous machining operation, and the current gripping force information being information of a gripping force at a time when the collet chuck grips the material during a current machining operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S13:步驟</p>  
        <p type="p">S14:步驟</p>  
        <p type="p">S15:步驟</p>  
        <p type="p">S16:步驟</p>  
        <p type="p">S17:步驟</p>  
        <p type="p">S18:步驟</p>  
        <p type="p">S25:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1742" publication-number="202620648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具備多個韌體槽的資料儲存裝置</chinese-title>  
        <english-title>DATA STORAGE DEVICE WITH MULTIPLE FIRMWARE SLOTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F12/02</main-classification>  
        <further-classification edition="200601120260202B">G06F13/16</further-classification>  
        <further-classification edition="200601120260202B">G06F3/06</further-classification>  
        <further-classification edition="201801120260202B">G06F8/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿雷帕利　納文　庫瑪　高德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AREPALLI, NAVEEN KUMAR GOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瓦特　尼汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAWAT, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUONG, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘迪　馬尼什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDEY, MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之態樣提供用於管理資料儲存裝置中之韌體的各種系統、設備、及技術。資料儲存裝置的一實例係通用快閃儲存(Universal Flash Storage, UFS)裝置。UFS裝置可具有多個韌體槽，以儲存及維持多於一個韌體版本。多個韌體槽可在韌體更新失敗時提供冗餘及備份。此外，多個韌體槽實現在刪除目前韌體之前測試及驗證一新的韌體更新。此外，多個韌體槽提供彈性，以針對不同的使用情況提供不同的韌體版本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure provides various systems, apparatuses, and techniques for managing firmware in data storage devices. An example of a data storage device is a Universal Flash Storage (UFS) device. A UFS device can have multiple firmware slots to store and maintain more than one firmware version. Multiple firmware slots can provide redundancy and backup in case of firmware update failure. Furthermore, multiple firmware slots enable testing and validation of a new firmware update before deleting the current firmware. In addition, multiple firmware slots provide the flexibility to provision different firmware versions for different use cases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">702,704,706:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1743" publication-number="202620011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07C25/18</main-classification>  
        <further-classification edition="200601120260223B">C07C309/42</further-classification>  
        <further-classification edition="200601120260223B">C07C309/46</further-classification>  
        <further-classification edition="200601120260223B">C07C309/47</further-classification>  
        <further-classification edition="200601120260223B">C07C309/48</further-classification>  
        <further-classification edition="200601120260223B">C07C309/49</further-classification>  
        <further-classification edition="200601120260223B">C07C309/52</further-classification>  
        <further-classification edition="200601120260223B">C07C309/58</further-classification>  
        <further-classification edition="200601120260223B">C07C309/59</further-classification>  
        <further-classification edition="200601120260223B">C07C381/12</further-classification>  
        <further-classification edition="200601120260223B">C08F212/14</further-classification>  
        <further-classification edition="200601120260223B">C08F220/38</further-classification>  
        <further-classification edition="200601120260223B">C08F220/58</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/039</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="202601120260223B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川翔也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, SHOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥出諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUDE, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肥後諒大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGO, RYOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大六野翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIROKUNO, SHOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄川冬輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAWA, FUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗木隆之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIKI, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於抗蝕劑圖案形成時可以充分的水準發揮感度或LWR、製程窗口的感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物。一種感放射線性組成物，包含：含有源自下述式（1）所表示的鎓鹽化合物的結構單元（I）的聚合物、及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="263px" width="328px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，W為與兩個碳原子一起構成的環狀結構；碳-碳間的下述式表示單鍵或雙鍵； &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="128px" width="126px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;A為下述式（A-1）～式（A-7）的任一者所表示的基； &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="464px" width="529px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;A1&lt;/sup&gt;及R&lt;sup&gt;A2&lt;/sup&gt;為碳數1～20的一價有機基）R&lt;sup&gt;1&lt;/sup&gt;為碳數1～20的一價有機基、氰基、硝基、羧基、羥基、胺基、鹵素原子或硫醇基；Z&lt;sup&gt;+&lt;/sup&gt;為一價感放射線性鎓陽離子；其中，R&lt;sup&gt;A1&lt;/sup&gt;、R&lt;sup&gt;A2&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;或Z&lt;sup&gt;+&lt;/sup&gt;包含聚合性基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1744" publication-number="202620113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於評估聚醯亞胺成型品的表面電阻均勻性的方法及具有均勻表面電阻的聚醯亞胺成型品</chinese-title>  
        <english-title>METHOD FOR EVALUATING SURFACE RESISTANCE UNIFORMITY OF POLYIMIDE MOLDED PRODUCT AND POLYIMIDE MOLDED PRODUCTS WITH UNIFORM SURFACE RESISTANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C08K3/04</main-classification>  
        <further-classification edition="200601120251222B">C08G73/10</further-classification>  
        <further-classification edition="200601120251222B">C08L79/08</further-classification>  
        <further-classification edition="200601120251222B">G01G3/14</further-classification>  
        <further-classification edition="200601120251222B">G01N27/04</further-classification>  
        <further-classification edition="201901120251222B">B32B7/025</further-classification>  
        <further-classification edition="200601120251222B">B29B11/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商聚醯亞胺尖端素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PI ADVANCED MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎬誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HO-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李翼祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, IK-SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於評估聚醯亞胺成型品的表面電阻均勻性的方法、包括導電性填料的聚醯亞胺成型品及其製備方法，提供一種可透過表面電阻值的變動係數來測量聚醯亞胺成型品的表面電阻均勻性，且平均表面電阻和表面電阻值的變動係數較小的高品質的聚醯亞胺成型品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1745" publication-number="202620456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動體檢測系統、配線器具、負載系統、移動體偵測方法及程式</chinese-title>  
        <english-title>MOVING OBJECT DETECTING SYSTEM, WIRING DEVICE, LOAD SYSTEM, METHOD FOR DETECTING MOVING OBJECT, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G01S13/50</main-classification>  
        <further-classification edition="200601120260202B">G01S13/58</further-classification>  
        <further-classification edition="200601120260202B">G01S13/24</further-classification>  
        <further-classification edition="200601120260202B">G01S7/292</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊籐竜一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤弘行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的係提高檢測移動之物體的靈敏度。 &lt;br/&gt;本揭示之移動體檢測系統(1)具備：電波感測器(10)、檢測部(22)。當電波感測器(10)將發送波發送，並接收物體之反射波時，輸出依據發送波及反射波之輸出信號。檢測部(22)進行複數次差分計算處理。在差分計算處理，藉由計算於二個檢測期間，電波感測器(10)分別輸出之二個輸出信號的差分，而求出在二個檢測期間之間的差分計算期間之輸出信號的時間差分。檢測部(22)並求出累加了在複數之差分計算期間的時間差分之計算結果的累加值，依據比較了累加值與閾值之高低的比較結果，檢測有無移動之物體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:移動體檢測系統</p>  
        <p type="p">3:負載</p>  
        <p type="p">10:電波感測器</p>  
        <p type="p">11:振盪器</p>  
        <p type="p">12:發送部</p>  
        <p type="p">13:接收部</p>  
        <p type="p">14:混合器</p>  
        <p type="p">20:處理部</p>  
        <p type="p">21:取得部</p>  
        <p type="p">22:檢測部</p>  
        <p type="p">23:負載控制部</p>  
        <p type="p">30:記憶部</p>  
        <p type="p">40:驅動電路</p>  
        <p type="p">41:開關元件</p>  
        <p type="p">50:負載連接部</p>  
        <p type="p">51:連接端子</p>  
        <p type="p">52:連接端子</p>  
        <p type="p">100:配線器具</p>  
        <p type="p">200:負載系統</p>  
        <p type="p">AC:交流電源</p>  
        <p type="p">W1:電線</p>  
        <p type="p">W2:電線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1746" publication-number="202619620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142739</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作業車輛</chinese-title>  
        <english-title>WORK VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A01B69/00</main-classification>  
        <further-classification edition="200601120251130B">A01B33/08</further-classification>  
        <further-classification edition="200601120251130B">A01B63/00</further-classification>  
        <further-classification edition="200601120251130B">A01C14/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商井關農機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEKI &amp; CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原竜太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上島徳弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIJIMA, NORIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富久聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMIHISA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮内正男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAUCHI, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種作業車輛，係具備：車體；行駛裝置，係安裝在車體；作業機；以及作業連接器裝置，係將車體與作業機連結；作業車輛並具備：第一原動機，係用以驅動行駛裝置；以及第二原動機，係用以驅動作業機；作業車輛係具備：第一動力源，係専用於第一原動機；以及第二動力源，係専用於第二原動機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A work vehicle comprising: a vehicle body; a traveling device mounted on the vehicle body; a work machine; and a hitch device configured to connect the vehicle body to the work machine. The work vehicle is equipped with: a first prime mover configured to drive the traveling device; and a second prime mover configured to drive the work machine. Additionally, the work vehicle is provided with: a first power source dedicated to the first prime mover; and a second power source dedicated to the second prime mover.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車體</p>  
        <p type="p">2:行駛裝置</p>  
        <p type="p">2a:左側馬達部</p>  
        <p type="p">2b:右側馬達部</p>  
        <p type="p">3:作業機</p>  
        <p type="p">5:主架</p>  
        <p type="p">6:前側連接器</p>  
        <p type="p">7:主電池箱</p>  
        <p type="p">7a:主電池</p>  
        <p type="p">8:板</p>  
        <p type="p">9:控制裝置</p>  
        <p type="p">15:履帶</p>  
        <p type="p">26:引擎</p>  
        <p type="p">32:燃料槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1747" publication-number="202620389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快速響應食品溫度計和相關方法</chinese-title>  
        <english-title>RAPID RESPONSE FOOD THERMOMETER AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260206B">G01K7/02</main-classification>  
        <further-classification edition="200601120260206B">G01K13/10</further-classification>  
        <further-classification edition="202101120260206B">G01K1/14</further-classification>  
        <further-classification edition="200601120260206B">G01B7/26</further-classification>  
        <further-classification edition="200601120260206B">A47J37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商艾普迅實驗室有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPTION LABS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼瓦拉　特穆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIVALA, TEEMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾曼　法雷爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLEMAN, FARRELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉漢　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALLAGHAN, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海貝爾　杰羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIBEL, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉明豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, MING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種食品溫度計包括探針主體、溫度檢測尖端和插入深度傳感器。探針主體具有固定到一端的手柄和固定到另一端的溫度檢測尖端。溫度檢測尖端被配置為插入到食品項中，並確定食品項的溫度。溫度檢測尖端包括熱電偶，熱電偶包括外部熱電偶元件和內部熱電偶元件。溫度檢測尖端進一步包括熱電偶接點和穿刺尖端，熱電偶接點連接在熱電偶的外部熱電偶元件和內部熱電偶元件之間，穿刺尖端與熱電偶接點相鄰。插入深度傳感器位於探針主體內，並被配置為與微控制器通信，以確定穿刺尖端到食品項中的插入深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:快速響應食品溫度檢測尖端</p>  
        <p type="p">11:殼體</p>  
        <p type="p">12:穿刺尖端</p>  
        <p type="p">13:熱電偶</p>  
        <p type="p">14:外部同軸熱電偶元件</p>  
        <p type="p">16:內部同軸熱電偶元件</p>  
        <p type="p">17:絕緣體</p>  
        <p type="p">18:熱電偶接點</p>  
        <p type="p">19:熱電偶導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1748" publication-number="202621168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H04W72/04</main-classification>  
        <further-classification edition="200601120260102B">H04L5/00</further-classification>  
        <further-classification edition="200901120260102B">H04W52/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供通信方法及裝置，該方法可以應用於支持IEEE 協定，如802.11be/Wi-Fi 7/Wi-Fi 8協定，IEEE 802.11 Integrated mmWave協定，IEEE 802.11bf/感知協定，UWB協定，或星閃協定。該方法可應用於傳輸ELR PPDU的場景。該方法包括：生成第一PPDU，第一PPDU中承載的第一序列用於指示第一PPDU的BSS顏色和第一PPDU的傳輸方向；發送第一PPDU，由此接收端通過對第一PPDU中的第一序列進行序列檢測，可以實現根據第一PPDU的BSS顏色和第一PPDU的傳輸方向來決定丟棄該第一PPDU還是繼續解析該第一PPDU，可以節省功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and apparatus. The method may be applied to protocols supporting IEEE standards, such as 802.11be/Wi-Fi 7/Wi-Fi 8 protocol, IEEE 802.11 Integrated mmWave protocol, IEEE 802.11bf/sensing protocol, UWB protocol, or SparkLink protocol. The method may be applied to a scenario of transmitting an ELR PPDU. The method includes: generating a first PPDU, where a first sequence carried in the first PPDU is used to indicate a BSS color of the first PPDU and a transmission direction of the first PPDU; and transmitting the first PPDU. In this way, a receiving end can perform sequence detection on the first sequence in the first PPDU to determine whether to discard the first PPDU or continue to parse the first PPDU based on the BSS color and the transmission direction of the first PPDU, thereby saving power consumption.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">801、802、803:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1749" publication-number="202620430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於確定樣品表面的物理參數的裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR DETERMINING PHYSICAL PARAMETER OF SAMPLE SURFACE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260211B">G01Q20/02</main-classification>  
        <further-classification edition="201001120260211B">G01Q30/06</further-classification>  
        <further-classification edition="201001120260211B">G01Q60/24</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商布里斯托奈米動力有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRISTOL NANO DYNAMICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮科　羅倫　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICCO, LOREN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩頓　奧利弗　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAYTON, OLIVER DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於確定樣品表面的物理參數的裝置。所述裝置包括探針架、掃描台、光學檢測系統和定位模組，所述光學檢測系統包括用於將光束定位到探針上的光源，所述定位模組被配置為使成像針尖與樣品表面接觸以進行掃描。所述定位模組包括處理器，所述處理器被配置為確定探針懸臂在成像針尖的區域中的寬度值，並且指示掃描台啟動探針架與樣品表面之間的相對運動，以改變成像針尖的區域相對於靜止光束的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided an apparatus for determining a physical parameter of a sample surface. The apparatus comprises a probe mount, a scanning stage, an optical detection system comprising a light source for positioning a beam of light onto a probe, and a positioning module that is configured to bring an imaging tip into contact with a sample surface for scanning. The positioning module comprises a processor configured to determine a width value of a probe cantilever in a region of an imaging tip and to instruct the scanning stage to initiate a relative movement between the probe mount and a sample surface to vary a position of a region of the imaging tip with respect to the beam of light which is stationary.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:掃描探針顯微鏡系統</p>  
        <p type="p">403a:位置</p>  
        <p type="p">403b:位置</p>  
        <p type="p">403c:位置</p>  
        <p type="p">412:樣品</p>  
        <p type="p">416:光束</p>  
        <p type="p">418:光學檢測系統</p>  
        <p type="p">420:上表面</p>  
        <p type="p">425:選定位置</p>  
        <p type="p">430:物鏡</p>  
        <p type="p">X:X方向</p>  
        <p type="p">X0:X0位置</p>  
        <p type="p">X1:X1位置</p>  
        <p type="p">X2:X2位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1750" publication-number="202620302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可釋放膨脹螺栓及多部件之成套工具</chinese-title>  
        <english-title>RELEASABLE EXPANSION BOLT AND KIT OF PARTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">F16B13/06</main-classification>  
        <further-classification edition="200601120251216B">F16B35/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供有一種可釋放膨脹螺栓，包含具有一長軸的一軸體、以平行長軸的方式穿過軸體以容納一致動件的一內部通道、形成於軸體中的一開口以及位於開口中並被限制以沿相對軸體的長軸傾斜之一位移軸活動一膨脹件，其中膨脹件卡合於致動件的一卡合面而使得致動件於一第一方向中的位移使膨脹件向外位移而凸出超過軸體的一外周面，並使致動件於相反的一第二方向中的位移使膨脹件向內位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a releasable expansion bolt, comprising an elongate body having a longitudinal axis; an internal passageway passing through the elongate body parallel to the longitudinal axis, for receipt of an actuation member; an aperture formed in the elongate body; and an expansion member in the aperture and constrained to move along a displacement axis inclined to the longitudinal axis of the elongate body, wherein the expansion member is engaged with an engagement surface of the actuation member such that displacement of the actuation member in a first direction displaces the expansion member outwardly to project beyond an outer surface of the elongate body and displacement of the actuation member in a second, opposite direction displaces the expansion member inwardly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:螺栓</p>  
        <p type="p">2:軸體</p>  
        <p type="p">4:卡合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1751" publication-number="202619915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池管理系統、電池組、電動車輛和電池管理方法</chinese-title>  
        <english-title>BATTERY MANAGEMENT SYSTEM, BATTERY PACK, ELECTRIC VEHICLE AND BATTERY MANAGEMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260202B">B60L58/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鍾雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN-SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供電池管理系統和電池管理方法。根據本揭露的電池管理系統包括配置為獲取電池組充電狀態資訊的感測單元、配置為基於充電狀態資訊確定目標冷卻強度的控制單元、以及配置為向電池冷卻器傳輸指示目標冷卻強度的冷卻控制請求的通訊單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a battery management system and a battery management method. The battery management system according to the present disclosure includes a sensing unit configured to acquire charging status information of a battery pack, a control unit configured to determine a target cooling intensity based on the charging status information, and a communication unit configured to transmit a cooling control request indicating the target cooling intensity to a battery cooler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電動車輛</p>  
        <p type="p">2:車輛控制器</p>  
        <p type="p">10:電池組</p>  
        <p type="p">20:繼電器</p>  
        <p type="p">30:電源轉換器</p>  
        <p type="p">40:電氣負載</p>  
        <p type="p">50:周邊裝置</p>  
        <p type="p">100:電池管理系統</p>  
        <p type="p">110:感測單元</p>  
        <p type="p">111:環境溫度感測器</p>  
        <p type="p">120:控制單元</p>  
        <p type="p">130:通訊單元</p>  
        <p type="p">200:電池冷卻器</p>  
        <p type="p">210:冷卻網路</p>  
        <p type="p">220:冷卻介質循環單元</p>  
        <p type="p">A:電流感測器</p>  
        <p type="p">P1,P2:充放電端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1752" publication-number="202620936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效率非正弦偏壓電源驅動</chinese-title>  
        <english-title>HIGH-EFFICIENCY NON-SINUSOIDAL BIAS SUPPLY DRIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H01J37/32</main-classification>  
        <further-classification edition="200701120260209B">H02M7/483</further-classification>  
        <further-classification edition="200601120260209B">H03K4/00</further-classification>  
        <further-classification edition="200701120260209B">H02M1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麻薩諸塞科學研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASSACHUSETTS INSTITUTE OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斐洛特　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERREAULT, DAVID J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊斯特林　茱莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESTRIN, JULIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一種態樣，一種用於生成偏壓脈衝波形的系統包括：變流器級，其配置成從直流(DC)電源電壓生成具有偏壓脈衝的訊號；斜坡生成器，其配置成在每個偏壓脈衝之後，向所述訊號引入負電壓斜坡；以及至少一個電感性元件，其配置成允許所述變流器級的軟開關。根據另一種態樣，用於生成偏壓脈衝波形的系統包括：多階變流器級，其配置成從一或多個直流(DC)電壓生成三個或更多個不同的電壓階，以用於生成偏壓脈衝，所述偏壓脈衝具有來自所述生成的三個或更多個電壓階的最大電壓階和最小電壓階；以及變壓器，其配置成用以將所述偏壓脈衝升壓，以提供高電壓輸出脈衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to one aspect, system for generating bias pulsed waveforms includes: an inverter stage configured to generate a signal having bias pulses from a direct current (DC) supply voltage; a ramp generator configured to introduce, into the signal, a negative voltage ramp after each bias pulse; and at least one inductive element configured to allow soft switching of the inverter stage. According to another aspect, a system for generating bias pulsed waveforms includes: a multi-level inverter stage configured to produce, from one or more direct current (DC) voltages, three or more different voltage levels used for generating bias pulses, the bias pulses having a maximum voltage level and a minimum voltage level from the three or more voltage levels produced; and a transformer configured to step up the bias pulses to provide high-voltage output pulses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:圖表</p>  
        <p type="p">1102:負電壓斜坡</p>  
        <p type="p">1104:脈衝電壓激勵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1753" publication-number="202620174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種染料ＰＤＬＣ組合物及ＰＤＬＣ調光膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C09K19/46</main-classification>  
        <further-classification edition="200601120260202B">C09K19/54</further-classification>  
        <further-classification edition="200601120260202B">C09K19/60</further-classification>  
        <further-classification edition="200601120260202B">G02F1/1334</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙玉盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高豔麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉友然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳卯先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及調光膜技術領域，尤其涉及一種染料PDLC組合物及PDLC調光膜。以所述染料PDLC組合物的總重量為100%計，所述染料PDLC組合物包括如下重量百分比的組分：液晶組合物35~66%，蒽醌型二向色性染料3~7%，聚合物前驅體30~60%，光引發劑0.05~3%，間隙子0.2~1%，所述聚合物前驅體包括質量比為1：(2-7)的低聚物和活性稀釋劑。本發明提供的染料PDLC組合物各組分之間協同作用，利用其製備得到的PDLC調光膜具有較高的關態霧度、較低的開態霧度以及較低的驅動電壓，同時具有吸光隔熱、全光調光範圍寬及顏色可調等優異性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1754" publication-number="202620175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種染料ＰＤＬＣ組合物及ＰＤＬＣ調光膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C09K19/46</main-classification>  
        <further-classification edition="200601120260202B">C09K19/54</further-classification>  
        <further-classification edition="200601120260202B">C09K19/60</further-classification>  
        <further-classification edition="200601120260202B">G02F1/1334</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高豔麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙玉盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉友然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳卯先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及調光膜技術領域，尤其涉及一種染料PDLC組合物及PDLC調光膜。本發明選用了多種特定的二向色性染料，並通過調控幾者之間的配比，以及其他各組分的添加比例，使所選二向色性染料在製備PDCL調光膜的過程中不易析出，不易褪色，進而使得到的PDLC調光膜具有較高的關態霧度以及較高的對比度，且所選二向色性染料會將部分散射光吸收，從而進一步降低開態霧度；此外，採用本發明組合物製備PDCL調光膜還能大幅度提高調光膜的全光調光範圍，滿足本領域對調光膜調光範圍的要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1755" publication-number="202621266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器、包括該電容器之半導體裝置、製造該電容器之方法</chinese-title>  
        <english-title>CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR, METHOD OF FABRICATING THE CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10D1/68</main-classification>  
        <further-classification edition="202301120260102B">H10B53/20</further-classification>  
        <further-classification edition="202301120260102B">H10B53/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅炳勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, BYUNGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金聖鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金孝媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYOWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李周浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOOHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種電容器、一種包括該電容器之半導體裝置以及一種製造該電容器之方法。該電容器包括：一第一電極；一鐵電層，其在該第一電極上；一第二電極，其在該鐵電層上；以及一介面層，其在該第一電極與該鐵電層之間及/或該鐵電層與該第二電極之間，其中該介面層包含一鈣鈦礦結構材料，該鈣鈦礦結構材料包含金屬之一氧化物，該等金屬包含一二價陽離子、一四價陽離子以及一三價陽離子，且該三價陽離子包含選自以下之至少一者：Sc、Y、La、Ce、Pr、Nd、Sm、Dy、Al、Ga或In。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a capacitor, a semiconductor device including the capacitor, and a method of fabricating the capacitor. The capacitor includes a first electrode, a ferroelectric layer on the first electrode, a second electrode on the ferroelectric layer, and an interfacial layer between the first electrode and the ferroelectric layer and/or between the ferroelectric layer and the second electrode, wherein the interfacial layer comprises a perovskite structure material, the perovskite structure material comprises an oxide of metals, the metals comprising a divalent cation, a tetravalent cation, and a trivalent cation, and the trivalent cation comprises at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Dy, Al, Ga, or In.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電容器</p>  
        <p type="p">110:基體</p>  
        <p type="p">120:第一電極</p>  
        <p type="p">130:介面層</p>  
        <p type="p">140:鐵電層</p>  
        <p type="p">150:第二電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1756" publication-number="202619888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理鋁材及接合體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">B32B15/04</main-classification>  
        <further-classification edition="200601120260203B">B32B15/20</further-classification>  
        <further-classification edition="200601120260203B">B32B33/00</further-classification>  
        <further-classification edition="200601120260203B">C23C26/00</further-classification>  
        <further-classification edition="200601120260203B">B05D7/14</further-classification>  
        <further-classification edition="200601120260203B">B05D3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神戶製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝野大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUNO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋佑輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種較佳地用於接著接合且可更進一步提高與其他構件等的接著耐久性的表面處理鋁材、及包括所述表面處理鋁材的接合體。一種表面處理鋁材，在鋁基材的表面的至少一部分設置有矽烷皮膜，在針對設置有矽烷皮膜的區域中最表面的區域R1、與距區域R1為10 nm深度的區域R2，藉由輝光放電發光分光法測定元素分佈的情況下，區域R1中的矽的原子濃度為3.0原子%以上且30.0原子%以下。另外，基於區域R1中的矽的原子濃度A1與區域R2中的矽的原子濃度A2，藉由下述式（1）而算出的矽濃度的降低率M為45%以上。 &lt;br/&gt;&lt;br/&gt;M=（（A1-A2）/A1）×100  ･･･（1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1757" publication-number="202621288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH IMPROVED BREAKDOWN VOLTAGE AND ASSOCIATED MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/40</further-classification>  
        <further-classification edition="202501120260223B">H10D62/60</further-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10W15/00</further-classification>  
        <further-classification edition="202601120260223B">H10P30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳　智馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, JI-HYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連延杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, YANJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅達平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, DAPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括第一導電類型的基板和形成於該基板中的第二導電類型的類桶狀結構。該第二導電類型與該第一導電類型相反。該類桶狀結構含有埋設於所述基板的初始基板層中的第二導電類型的底層，該底層的峰值摻雜濃度平面距離所述初始基板層的頂表面具有預定埋入深度，該預定埋入深度實質上大於0.5μm。採用該類桶狀結構有助於突破現有技術製作高壓半導體裝置的技術瓶頸，例如可使得在所述基板的位於所述類桶狀結構內的部分中形成的電晶體具有超過70V、甚至尤其可達到超過100V的崩潰電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate of a first conductivity type and a tub of a second conductivity type formed in the substrate. The second conductivity type is opposite to the first conductivity type; and the tub has a tub bottom layer of the second conductivity type buried in an initial substrate layer of the substrate with a peak dopant concentration plane of the tub bottom layer substantially away from a top surface of the initial substrate layer for a predetermined buried depth that is essentially greater than 0.5µm. A transistor formed inside the tub in the substrate can have a breakdown voltage greater than 70V up to especially over 100V.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10-1:左側壁</p>  
        <p type="p">10-2:右側壁</p>  
        <p type="p">11:引出區</p>  
        <p type="p">12:井區</p>  
        <p type="p">13:埋入連接區</p>  
        <p type="p">14:底層</p>  
        <p type="p">18:連接導線結構</p>  
        <p type="p">100:半導體裝置</p>  
        <p type="p">100S:基板</p>  
        <p type="p">101:基板層</p>  
        <p type="p">102:磊晶層</p>  
        <p type="p">103:源極區</p>  
        <p type="p">104:汲極區</p>  
        <p type="p">105:體區</p>  
        <p type="p">106:體接觸區</p>  
        <p type="p">107:閘極區</p>  
        <p type="p">108:體井區</p>  
        <p type="p">109:漂移區</p>  
        <p type="p">110:RESURF區</p>  
        <p type="p">111:基板引出區</p>  
        <p type="p">112:基板連接井區</p>  
        <p type="p">113:基板連接深井區</p>  
        <p type="p">114:STI結構</p>  
        <p type="p">1071:閘介質層</p>  
        <p type="p">1072:閘導電層</p>  
        <p type="p">d1:井區深度</p>  
        <p type="p">d2:連接深度</p>  
        <p type="p">d3,d5:埋入深度</p>  
        <p type="p">d4:垂直高度</p>  
        <p type="p">d6:垂直接面崩潰控制距離</p>  
        <p type="p">S1,S2’,S4,S5:頂表面</p>  
        <p type="p">S0,S2,S3,S7,S8:底表面</p>  
        <p type="p">S6,S13:峰值摻雜濃度平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1758" publication-number="202620527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用鐵電液晶單元的裝置及其製造方法</chinese-title>  
        <english-title>DEVICE USING FERROELECTRIC LIQUID CRYSTAL CELL AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251117B">G02F1/141</main-classification>  
        <further-classification edition="200601120251117B">C09K19/02</further-classification>  
        <further-classification edition="200601120251117B">C09K19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瓦米納坦　維格納什瓦蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWAMINATHAN, VIGNESHWARAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳照藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHAOYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHEW, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦先科　Ｖ　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASHCHENKO, VALERII</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里瓦斯塔瓦　Ａ　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRIVASTAVA, ABHISHEK KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何品毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鐵電液晶單元包括上基板和下基板、上透明導電層和下透明導電層、上配向層和下配向層以及鐵電液晶層。上基板和下基板形成封閉區域。上透明導電層設置在上基板上。下透明導電層設置在下基板上。上配向層設置在上透明導電層上。下配向層設置在下透明導電層上。鐵電液晶層位於上配向層與下配向層之間。上配向層和下配向層用於為鐵電液晶層中的鐵電液晶分子提供錨定能。此錨定能與鐵電液晶層中鐵電液晶的螺旋彈性位能相平衡，從而實現穩定的分子配向和高對比的電光性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A FLC cell includes upper substrate and lower substrates, upper and lower transparent conductive layers, upper and lower alignment layers, and a FLC layer. The upper and lower substrates are arranged to define an enclosed region. The upper transparent conductive layer is disposed on the upper substrate. The lower transparent conductive layer is disposed on the lower substrate. The upper alignment layer is disposed on the upper transparent conductive layer. The lower alignment layer is disposed on the lower transparent conductive layer. The FLC layer is positioned between the upper alignment layer and the lower alignment layer. The upper alignment layer and the lower alignment layer are configured to provide an anchoring energy to FLC molecules of the FLC layer. The anchoring energy is balanced with the helical elastic energy of ferroelectric liquid crystal of the FLC layer to achieve stable molecular alignment and high-contrast electro-optical performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鐵電液晶單元</p>  
        <p type="p">102:上基板</p>  
        <p type="p">104:下基板</p>  
        <p type="p">110:上透明導電層</p>  
        <p type="p">112:下透明導電層</p>  
        <p type="p">120:上配向層</p>  
        <p type="p">122:下配向層</p>  
        <p type="p">130、132:間隔件</p>  
        <p type="p">140:鐵電液晶層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1759" publication-number="202620084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性樹脂組成物、預浸體及該些的硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08F230/02</main-classification>  
        <further-classification edition="200601120260202B">C08F283/00</further-classification>  
        <further-classification edition="200601120260202B">C08G12/40</further-classification>  
        <further-classification edition="200601120260202B">C08L43/02</further-classification>  
        <further-classification edition="200601120260202B">C08L51/08</further-classification>  
        <further-classification edition="200601120260202B">C08L61/32</further-classification>  
        <further-classification edition="200601120260202B">C08J5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠島隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHJIMA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有優異的硬化性、電特性、線膨脹係數、阻燃性、及機械特性的硬化性樹脂組成物。一種硬化性樹脂組成物，含有下述式（1）所表示的馬來醯亞胺樹脂、與下述式（2）所表示的苯乙烯化合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="336px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，R&lt;sub&gt;1&lt;/sub&gt;表示碳數1～20的烴基，p為0～4的整數。X表示碳數2～15的烴基。n為重複數的平均值，且為1＜n＜5） &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="198px" width="323px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（2）中，R&lt;sub&gt;2&lt;/sub&gt;表示碳數1～20的烴基，q為0～4的整數）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1760" publication-number="202619913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電樁通訊系統與充電樁通訊方法</chinese-title>  
        <english-title>CHARGE POINT COMMUNICATION SYSTEM AND CHARGE POINT COMMUNICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260108B">B60L53/60</main-classification>  
        <further-classification edition="201901120260108B">B60L53/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳敬奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充電樁通訊系統與充電樁通訊方法。第一閘道器充電樁可通訊地連接至一充電樁管理伺服器。多個第一客戶充電樁可通訊地連接至第一閘道器充電樁。第一閘道器充電樁基於第一充電樁群組的總電流限制，對第一充電樁群組中的第一閘道器充電樁與多個第一客戶充電樁進行充電電流配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charge point communication system and a charge point communication method are provided. A first gateway charge point is communicatively connected to a charging station management server. A plurality of first client charge points are communicatively connected to the first gateway charge point. The first gateway charge point assigns charging current to each of the first gateway charge point and the plurality of first client charge points within a first charge group based on a total current limit of the first charge point group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:充電樁通訊系統</p>  
        <p type="p">110:閘道器充電樁</p>  
        <p type="p">CS1:電樁管理伺服器</p>  
        <p type="p">120_1~120_N:客戶充電樁</p>  
        <p type="p">CG11:第一充電樁群組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1761" publication-number="202620360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷板以及冷卻結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251121B">F28F3/02</main-classification>  
        <further-classification edition="200601120251121B">F28F9/18</further-classification>  
        <further-classification edition="200601120251121B">F28F21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一態樣之冷板具備第1板與第2板。第1板由金屬形成，具有第1面、位於第1面的相反側之第2面、以及於第2面上形成之複數個鰭片。第2板由金屬形成，具有與第2面對向之第3面、以及位於第面的相反側之第4面。此外，第2板具有與複數個鰭片對向之第1區域、以及位於第1區域的外側之第2區域，並於第2區域與第1板接合。此外，複數個鰭片中之至少任一者之頂部藉由雷射焊接與第2板接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100C:冷板</p>  
        <p type="p">110a:第1面</p>  
        <p type="p">110b:第2面</p>  
        <p type="p">111:鰭片</p>  
        <p type="p">120:第2板</p>  
        <p type="p">120a:第3面</p>  
        <p type="p">120b:第4面</p>  
        <p type="p">121:熔融部</p>  
        <p type="p">125:熔融部</p>  
        <p type="p">300:熱源</p>  
        <p type="p">R1:第1區域</p>  
        <p type="p">R2:第2區域</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1762" publication-number="202621492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143015</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷板及冷卻結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W40/47</main-classification>  
        <further-classification edition="200601120260223B">F28F3/12</further-classification>  
        <further-classification edition="201401120260223B">B23K26/21</further-classification>  
        <further-classification edition="200601120260223B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一態樣之冷板具備第1板與第2板。第1板由金屬形成，具有第1面、位於第1面的相對側之第2面、以及於第2面上形成之複數個鰭片。第2板由金屬形成，具有與第2面對向之第3面、以及位於第3面的相對側之第4面。此外，第2板具有與複數個鰭片對向之第1區域、以及位於第1區域的外側之第2區域，並於第2區域藉由雷射焊接與第1板接合。此外，第2板之第2區域之厚度較第2板之第1區域之厚度薄。此外，藉由雷射焊接熔融之熔融部自第2板之第4面越過第1板與第2板之接合面延伸至第1板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第1板</p>  
        <p type="p">110a:第1面</p>  
        <p type="p">110b:第2面</p>  
        <p type="p">111:鰭片</p>  
        <p type="p">120:第2板</p>  
        <p type="p">120a:第3面</p>  
        <p type="p">120b:第4面</p>  
        <p type="p">121:熔融部</p>  
        <p type="p">300:熱源</p>  
        <p type="p">R1:第1區域</p>  
        <p type="p">R2:第2區域</p>  
        <p type="p">S1:接合面</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1763" publication-number="202620263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳纖維束及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260131B">D01F9/22</main-classification>  
        <further-classification edition="200601120260131B">D01F6/18</further-classification>  
        <further-classification edition="200601120260131B">C08J5/24</further-classification>  
        <further-classification edition="200601120260131B">C08K3/04</further-classification>  
        <further-classification edition="200601120260131B">C08K7/06</further-classification>  
        <further-classification edition="200601120260131B">D06M15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田究</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田勉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種碳纖維束及其製造方法，其在不降低股線彈性係數與股線強度的情況下，顯示出與樹脂的黏接性的界面剪切強度（IFSS）高，可提高碳纖維強化複合材料的90°彎曲強度。製成微晶尺寸為2.9 nm～3.4 nm、碳纖維表面的iPa為0.30 μA/cm&lt;sup&gt;2&lt;/sup&gt;以上的碳纖維束。一種碳纖維束的製造方法，包含：耐火化步驟，將碳纖維前驅物纖維束在氧化性氣氛中進行加熱；以及碳化步驟，將所述耐火化步驟後的耐火化纖維束在非氧化性氣氛中進行加熱，所述碳纖維束的製造方法中，使用實質上無撚的碳纖維前驅物纖維束，將所述碳化步驟的碳化溫度為1000℃以上的區域中的纖維束的伸長率設為-2.7%以上，且將碳化最高溫度設為1800℃～2200℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1764" publication-number="202621358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P14/40</main-classification>  
        <further-classification edition="202601120260223B">H10P10/00</further-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="200601120260223B">C23C16/46</further-classification>  
        <further-classification edition="200601120260223B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈政彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宗沐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TSUNG-MU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種製造半導體裝置的方法，其包含步驟：透過一沉積製程，在一批晶圓中之一第一晶圓的一第一氧化層上形成一第一捕獲電荷層；取得該第一捕獲電荷層之一第一均勻度輪廓；根據該第一均勻度輪廓和一目標均勻度輪廓中的一者，決定該第一晶圓的一第一前饋補償資訊；基於該第一前饋補償資訊，從複數個製程參數配方中選擇一第一製程配方；及依據該第一製程配方，透過消耗該第一捕獲電荷層的部分的一第一次氧化製程，形成一第二氧化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor device is provided and includes steps: forming a first charge-trapping layer on a first oxide layer on a first wafer in a lot of wafers by a deposition process; obtaining a first uniformity profile of the first charge-trapping layer; determining a first feed forward compensation information of the first wafer based on at least one of the first uniformity profile and a target uniformity profile; selecting a first process recipe in multiple process recipes based on the first feed forward compensation information; and forming a second oxide layer, according to the first process recipe, by a first oxidation process that consumes a portion of the first charge-trapping layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M100:方法</p>  
        <p type="p">S101-S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1765" publication-number="202621181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260102B">H04W84/12</main-classification>  
        <further-classification edition="200901120260102B">H04W48/10</further-classification>  
        <further-classification edition="200901120260102B">H04W36/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊懋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭宇宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請實施例提供的方案中，AP通過發送第一幀，可使得該AP所在BSS內的non-AP STA能夠結合該第一幀中的非協作BSS指示資訊獲知其所在BSS的非協作BSS。從而AP或non-AP STA在接收到inter-BSS PPDU時，可以決策是否切換到從通道，保證non-AP STA和AP在同一個通道工作。繼而提高了系統性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communications technologies, and in particular, to a communication method and apparatus. This application may be applied to the IEEE 802.11ax standard, the 802.11be standard, the 802.11bn standard, and other standards in the IEEE 802 series, such as the 802.15 standard, the 802.11bf standard, the IMMW standard, or the SparkLink standard. In the solutions provided in embodiments of this application, an AP may send a first frame, so that a non-AP STA in a BSS where the AP is located can learn of a non-collaborating BSS in the BSS where the non-AP STA is located based on the non-collaborating BSS indication information in the first frame. In this way, when receiving an inter-BSS PPDU, the AP or the non-AP STA can determine whether to switch to a secondary channel, thereby ensuring that the non-AP STA and the AP operate on the same channel. This improves system performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701、702、703、704:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1766" publication-number="202620676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合型辨識裝置及其使用方法</chinese-title>  
        <english-title>HYBRID IDENTIFICATION DEVICE AND USE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260102B">G06F21/32</main-classification>  
        <further-classification edition="202201120260102B">G06V40/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金佶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GINGY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何孟南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, MON-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PING-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐煜靈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張容芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUNG-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅元晢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YUAN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種混合型辨識裝置，包括第一辨識模組、第二辨識模組以及處理單元。第一辨識模組用以擷取生物特徵以產生生物特徵信號。第二辨識模組用以擷取圖形特徵以產生圖形特徵信號。處理單元電性連接於第一辨識模組以及第二辨識模組，用以依據生物特徵信號辨識生物特徵及/或用以依據圖形特徵信號辨識圖形特徵，進而產生處理訊號。此外，一種混合型辨識裝置的使用方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid identification device including a first identification module, a second identification module and a processing unit is provided. The first identification module is adapted to capture a biological characteristic to generate a biological characteristic signal. The second identification module is adapted to capture a graphic characteristic to generate a graphic characteristic signal. The processing unit is electrically connected to the first recognition module and the second recognition module, and is adapted for recognizing the biological characteristic according to the biological characteristic signal and/or for recognizing the graphic characteristic according to the graphic characteristic signal, so as to generate a processing signal. In addition, a use method thereof is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10,20:物件</p>  
        <p type="p">100:混合型辨識裝置</p>  
        <p type="p">110:第一辨識模組</p>  
        <p type="p">120:第二辨識模組</p>  
        <p type="p">130:處理單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1767" publication-number="202620419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針形部件的視覺檢測方法</chinese-title>  
        <english-title>VISION INSPECTION METHOD FOR PIN TYPE PARTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G01N21/95</main-classification>  
        <further-classification edition="200601120260205B">G01R1/067</further-classification>  
        <further-classification edition="201701120260205B">G06T7/00</further-classification>  
        <further-classification edition="200601120260205B">B65G54/02</further-classification>  
        <further-classification edition="200601120260205B">G05B11/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＮＳＣＡＰＥ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENSCAPE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權赫基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GWON, HYEOK GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳智滿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JI MAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔相鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SANG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONG GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈仁浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KA, IN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例的針形部件的視覺檢測方法可包括如下步驟：將針形部件以傾斜的姿態放置在檢測台的上表面；基於磁鐵將所述針形部件矯正為直立姿態；使所述針形部件旋轉，並對所述針形部件的表面進行拍攝；以及基於對所述針形部件的表面進行拍攝獲得的複數個拍攝影像，對所述針形部件進行缺陷檢測 。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">I2:修改影像</p>  
        <p type="p">I3:提取對象區域</p>  
        <p type="p">I4:合併影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1768" publication-number="202619663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸塵器</chinese-title>  
        <english-title>CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260130B">A47L9/28</main-classification>  
        <further-classification edition="200601120260130B">A47L9/10</further-classification>  
        <further-classification edition="200601120260130B">A47L9/16</further-classification>  
        <further-classification edition="200601120260130B">A47L9/20</further-classification>  
        <further-classification edition="200601120260130B">A47L5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JUNHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金翰信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HANSHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金詩容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓在勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JAEHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃仁揆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, INKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種吸塵器。該吸塵器的過濾器清潔裝置可包含：刷子、以及渦輪。刷子可設置以與裝設在殼體內部的過濾器部件接觸。渦輪被氣流旋轉。渦輪使過濾器部件及刷子中的任一者相對於過濾器部件及刷子中的另一者旋轉。由此，積聚在過濾器上的異物可被刷子清潔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cleaner is disclosed. A filter cleaning device of the cleaner may include a brush and a turbine. The brush may be disposed so as to come into contact with a filter part provided inside a housing. The turbine is rotated by a flow of air. Either one of the filter part and the brush rotates with respect to the other one of the filter part and the brush by the turbine. Through this, foreign substances accumulated on a filter may be cleaned by the brush.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">114:抽吸管</p>  
        <p type="p">115:抽吸管連接部件</p>  
        <p type="p">116:止回閥</p>  
        <p type="p">117:殼體</p>  
        <p type="p">117a:第一殼體</p>  
        <p type="p">117b:第二殼體</p>  
        <p type="p">118a:第一蓋</p>  
        <p type="p">118b:第二蓋</p>  
        <p type="p">119:排氣孔</p>  
        <p type="p">122:排氣引導件</p>  
        <p type="p">124:旋風器、第一旋風器</p>  
        <p type="p">125:網狀網</p>  
        <p type="p">127:外罩</p>  
        <p type="p">128:內罩</p>  
        <p type="p">129:旋風器、第二旋風器</p>  
        <p type="p">130:套罩</p>  
        <p type="p">130a:第一套罩</p>  
        <p type="p">130b:第二套罩</p>  
        <p type="p">132:導葉</p>  
        <p type="p">133:進氣口</p>  
        <p type="p">134:旋渦尋覓管</p>  
        <p type="p">135:上部流動路徑殼體</p>  
        <p type="p">135a:第一上部流動路徑殼體</p>  
        <p type="p">135b:第二上部流動路徑殼體</p>  
        <p type="p">136:風扇馬達罩</p>  
        <p type="p">139:過濾器部件</p>  
        <p type="p">140:前置過濾器</p>  
        <p type="p">145:HEPA過濾器</p>  
        <p type="p">148:葉輪</p>  
        <p type="p">152:旋轉軸</p>  
        <p type="p">153:轉子</p>  
        <p type="p">154:定子</p>  
        <p type="p">155a,155b:軸承</p>  
        <p type="p">156:逆變器</p>  
        <p type="p">157:把手</p>  
        <p type="p">158:電池組</p>  
        <p type="p">160:電池蓋</p>  
        <p type="p">161:電池單元</p>  
        <p type="p">168:渦輪</p>  
        <p type="p">175:減速裝置</p>  
        <p type="p">1352:流動路徑部件</p>  
        <p type="p">1354:安裝引導件</p>  
        <p type="p">1355:肋</p>  
        <p type="p">1361:下部罩</p>  
        <p type="p">1362:上部罩</p>  
        <p type="p">1481:轂</p>  
        <p type="p">1482:葉片</p>  
        <p type="p">1561:PCB</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1769" publication-number="202621390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板半導體晶圓的處理</chinese-title>  
        <english-title>PROCESSING OF SUBSTARTE SEMICONDUCTOR WAFERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P52/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/78</further-classification>  
        <further-classification edition="201201120260223B">B24B41/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商世創電子材料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILTRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡柏　安東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBER, ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種在處理裝置上處理基板半導體晶圓的方法，其中基板半導體晶圓（1）二側（1.1、1.2）中的每一側在指定給晶圓每一側的處理序列中經由指定研磨裝置進行研磨，同時該晶圓被定位在定位裝置的指定定位表面上。在此，二個定位裝置（101、102）的二個定位表面（101.1、102.1）中的至少一個呈彎曲表面形式，沿穿過指定定位裝置（101、102）的指定徑向軸觀察時，該彎曲表面限定指定定位裝置輪廓，沿指定徑向軸觀察時，該指定定位裝置輪廓被指定有300至320毫米範圍內的投影輪廓直徑，並且其曲率值變化至少在部分區段中考慮時，在7.81×10&lt;sup&gt;-5&lt;/sup&gt;至5.33×10&lt;sup&gt;-3&lt;/sup&gt;／公尺範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method of processing a substrate semiconductor wafer on a processing device, wherein each of the two sides (1.1, 1.2) of the substrate semiconductor wafer (1) is ground in a processing sequence assigned to each side of the wafer via an assigned grinding device while it is positioned on an assigned positioning surface of a positioning device. At least one of the two positioning surfaces (101.1, 102.1) of the two positioning devices (101, 102) here takes the form of a curved surface which, viewed along an assigned radial axis through the assigned positioning device (101, 102), defines an assigned positioning device contour to which there is assigned a projected contour diameter, viewed along the assigned radial axis, which has a value in the range from 300 mm to 320 mm, and where the progression of the curvature value thereof, at least in sections, is within a range from 7.81x10&lt;sup&gt;-5&lt;/sup&gt; m&lt;sup&gt;-1&lt;/sup&gt; to 5.33x10&lt;sup&gt;-3&lt;/sup&gt; m&lt;sup&gt;-1&lt;/sup&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板半導體晶圓</p>  
        <p type="p">1.1:晶圓第一側</p>  
        <p type="p">1.2:晶圓第二側</p>  
        <p type="p">101:第一定位裝置</p>  
        <p type="p">101.1:第一定位表面</p>  
        <p type="p">102:第二定位裝置</p>  
        <p type="p">102.1:第二定位表面</p>  
        <p type="p">103:第一研磨裝置</p>  
        <p type="p">103.1:第一研磨頭</p>  
        <p type="p">104:第二研磨裝置</p>  
        <p type="p">104.1:第二研磨頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1770" publication-number="202620547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光刻膠組合物及使用所述組合物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G03F7/029</main-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">C07F7/22</further-classification>  
        <further-classification edition="202601120260223B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張水民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SOOBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JOONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡閏珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, YUNJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金經睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGMOG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺雅羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, AHRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開一種半導體光刻膠組合物及利用所述半導體光刻膠組合物來形成或提供圖案的方法。所述半導體光刻膠組合物可包含由化學式1表示的有機金屬化合物、以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method of forming or providing patterns utilizing the semiconductor photoresist composition are disclosed. The semiconductor photoresist composition may include an organometallic compound represented by Chemical Formula 1 and a solvent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">108:光刻膠圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1771" publication-number="202620030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物和使用其形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">C08G79/12</further-classification>  
        <further-classification edition="200601120260223B">C08F212/14</further-classification>  
        <further-classification edition="200601120260223B">C08F220/28</further-classification>  
        <further-classification edition="200601120260223B">C08K5/57</further-classification>  
        <further-classification edition="200601120260223B">C08L33/16</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文成日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, SUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鈴根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG KEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任相均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SANGKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體光阻組成物和使用其形成圖案的方法。所述半導體光阻組成物包含：有機金屬化合物；包括由化學式M-1表示的第一結構單元和由化學式2或化學式3表示的第二結構單元的聚合物；以及溶劑。對化學式M-1、化學式2和化學式3的說明如在說明書中所述。本申請可實現具有改善的靈敏度和線邊緣粗糙度特性的圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the same are provided. The semiconductor photoresist composition includes an organometallic compound; a polymer including a first structural unit represented by Chemical Formula M-1, and a second structural unit represented by Chemical Formula 2 or Chemical Formula 3; and a solvent. The descriptions of Chemical Formula M-1, Chemical Formula 2, and Chemical Formula 3 are as described in the specification. The present application has improved sensitivity and line edge roughness (LER) characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底/半導體基底</p>  
        <p type="p">108:光阻圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1772" publication-number="202621206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路形成基板、以及電路形成基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">H05K3/12</main-classification>  
        <further-classification edition="201401120260206B">C09D11/52</further-classification>  
        <further-classification edition="200601120260206B">H05K3/38</further-classification>  
        <further-classification edition="200601120260206B">H05K3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商象科公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEPHANTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍倉正志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIKURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺田明紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可控制噴墨法中之噴墨液滴的著落位置，實現更進一步的配線微細化。一種具備配線圖案之電路形成基板，包括：絕緣性基材；含環氧樹脂之樹脂層，形成於絕緣性基材上；噴墨液滴著落層，藉由包含金屬粒子之複數噴墨液滴的著落而形成，且該複數噴墨液滴係形成於樹脂層上；以及鍍層，形成於噴墨液滴著落層上；其中，樹脂層在25℃時，儲存彈性模數（Pa）為4.0711×10&lt;sup&gt;8&lt;/sup&gt;以下；損耗彈性模數（Pa）為6.4825×10&lt;sup&gt;7&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣性基材</p>  
        <p type="p">2:樹脂層</p>  
        <p type="p">3:噴墨液滴著落層</p>  
        <p type="p">4:鍍層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1773" publication-number="202621202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路形成基板、以及電路形成基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H05K1/03</main-classification>  
        <further-classification edition="200601120251210B">H05K3/14</further-classification>  
        <further-classification edition="200601120251210B">B41M1/04</further-classification>  
        <further-classification edition="200601120251210B">B41M1/30</further-classification>  
        <further-classification edition="201001120251210B">G01Q60/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商象科公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEPHANTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍倉正志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIKURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺田明紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡居諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可控制噴墨法中之噴墨液滴的著落位置，實現更進一步的配線微細化。一種至少一部分具備配線圖案之電路形成基板，包括：絕緣性基材；含環氧樹脂之樹脂層，形成於絕緣性基材上；噴墨液滴著落層，藉由包含金屬粒子之複數噴墨液滴的著落而形成，且該複數噴墨液滴係形成於樹脂層上；以及鍍層，形成於噴墨液滴著落層上；其中，樹脂層之表面在25℃時，使用原子力顯微鏡進行測定：彈性率(Pa)為7.0×10&lt;sup&gt;6&lt;/sup&gt;以上、12.0×10&lt;sup&gt;6&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣性基材</p>  
        <p type="p">2:樹脂層</p>  
        <p type="p">3:噴墨液滴著落層</p>  
        <p type="p">4:鍍層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1774" publication-number="202621398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板清洗裝置及基板清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P70/00</main-classification>  
        <further-classification edition="202601120260223B">H10P95/70</further-classification>  
        <further-classification edition="200601120260223B">G03F7/42</further-classification>  
        <further-classification edition="202601120260223B">H10P50/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初振明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, ZHENMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐時座</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, SHIZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單昌鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, CHANGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李亞洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周梓鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種基板清洗裝置及基板清洗方法，基板清洗裝置包括槽式清洗模組、單片清洗模組和轉移模組，槽式清洗模組包括被配置為容納SPM溶液以處理一片或多片基板的第一槽體，以及被配置為容納SC1溶液以處理一片或多片所述基板的第二槽體，單片清洗模組具有至少一個單片清洗腔，單片清洗腔被配置為執行單片基板清洗製程，單片基板清洗製程包括SC1處理製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:槽式清洗模組</p>  
        <p type="p">101:第一槽體</p>  
        <p type="p">102:第二槽體</p>  
        <p type="p">20:單片清洗模組</p>  
        <p type="p">201:單片清洗腔</p>  
        <p type="p">30:轉移模組</p>  
        <p type="p">40:裝載端口</p>  
        <p type="p">50:前端模組機械手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1775" publication-number="202619810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片收納容器清洗裝置及晶片收納容器清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B08B9/20</main-classification>  
        <further-classification edition="200601120260223B">B08B9/30</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西部幸伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIBE, YUKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮迫久顕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASAKO, HISAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原淳司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三上徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKAMI, TOORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神田直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨田寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大隣仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTONARI, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於，對晶片收納容器進行檢查，並且效率良好地清洗晶片收納容器。實施形態的晶片收納容器清洗裝置包括：第一檢查部，對晶片收納容器的被把持部的狀態進行檢查；清洗部，對晶片收納容器中的至少收納晶片的收納空間進行清洗；第二檢查部，對收納空間的狀態進行檢查；機器人，至少將晶片收納容器從第一檢查部搬送至清洗部，並且將晶片收納容器從清洗部搬送至第二檢查部；以及控制部，對機器人進行控制，控制部在基於由第一檢查部所得的檢查結果而判定為晶片收納容器為能夠使用的狀態的情況下，以將晶片收納容器從第一檢查部搬送至清洗部的方式對機器人進行控制，在基於由第一檢查部所得的檢查結果而判定為晶片收納容器並非能夠使用的狀態的情況下，以將晶片收納容器從第一檢查部搬送至與清洗部不同的位置的方式對機器人進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103、S104、S105、S106、S107、S108、S109、S110、S111、S112、S113、S114、S115、S116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1776" publication-number="202620125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組合物、硬化物、底層填充材、接著劑、以及半導體封裝體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C08L63/02</main-classification>  
        <further-classification edition="200601120260211B">C08G59/22</further-classification>  
        <further-classification edition="200601120260211B">C08K3/22</further-classification>  
        <further-classification edition="200601120260211B">C08K3/28</further-classification>  
        <further-classification edition="200601120260211B">C08K3/36</further-classification>  
        <further-classification edition="202401120260211B">B01J35/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大隣雅俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTONARI, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本凌輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永隆秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, TAKAHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種窄間隙及大面積下之滲透性及散熱性能優異之環氧樹脂組合物、硬化物、底層填充材、接著劑、以及半導體封裝體及其製造方法。即，本發明提供一種環氧樹脂組合物，其係含有(A)環氧樹脂、(B)硬化劑、及(C)無機填充劑者，上述(C)無機填充劑包含除二氧化矽以外之成分，上述(C)無機填充劑包含經溶解度參數(SP值)中之極性項(δP)為4.0以上7.0以下之一種以上之矽烷化合物表面改性之無機填充劑，上述(C)無機填充劑之含量相對於上述環氧樹脂組合物之總量為70～90質量%，上述環氧樹脂組合物於100℃下之黏度(η1)為1.00 Pa・s以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1777" publication-number="202620995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力轉換器管理裝置及直流配電系統的系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H02J1/10</main-classification>  
        <further-classification edition="202601120260223B">H02J1/00</further-classification>  
        <further-classification edition="202601120260223B">H02J13/00</further-classification>  
        <further-classification edition="202401120260223B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上禎之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SADAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪諾哈　魯特卡南丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANOHAR, RUTVIKANANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>園江洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONOE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福野研一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUNO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電力轉換器管理裝置及直流配電系統的系統，即使在用戶負載變動或創能設備之發電電力變動的時候，亦能夠進行適當的控制。電力轉換裝置3係設置於直流配電系統，且管理與直流配電系統進行直流電力之交換之具有下垂特性之複數台電力轉換器的電力轉換器管理裝置，該電力轉換器管理裝置係具備控制參數生成電路33，該控制參數生成電路係構成為推測流動於直流配電系統之潮流電力或潮流電流變化時之各電力轉換器之與直流配電系統之併接點的電壓變動幅度，且根據各電力轉換器之與直流配電系統之併接點之電壓變動幅度，而生成各電力轉換器之下垂特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:CEMS</p>  
        <p type="p">22:通訊線</p>  
        <p type="p">31:通訊電路</p>  
        <p type="p">32:記憶電路</p>  
        <p type="p">33:控制參數生成電路</p>  
        <p type="p">34:運轉計劃製作電路</p>  
        <p type="p">35:傳送資料生成電路</p>  
        <p type="p">36:分散電源管理部控制電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1778" publication-number="202620367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玩具槍</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260115B">F41B11/50</main-classification>  
        <further-classification edition="201301120260115B">F41B11/54</further-classification>  
        <further-classification edition="201301120260115B">F41B11/64</further-classification>  
        <further-classification edition="200601120260115B">A63H33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京丸井股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO MARUI CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩澤隆弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAWA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩澤茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAWA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明提供在設計上制約較少的左輪手槍類型的玩具槍。 &lt;br/&gt;[解決手段] 在左輪手槍類型的玩具槍中，包括：擊錘；空氣壓力缸，容納與擊錘的活動連動地動作的活塞；彈匣，與擊錘的活動連動地繞旋轉軸旋轉，旋轉軸在內部包括從空氣壓力缸內供給的空氣的流路，彈匣包括：複數個容納部，容納BB彈；以及複數個BB噴嘴，用以對於所容納的BB彈噴出空氣，玩具槍更包括噴嘴墊圈，將在旋轉軸內的流路流動的空氣導入至複數個BB噴嘴中的一個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玩具槍</p>  
        <p type="p">101:擊錘</p>  
        <p type="p">102:壓力缸閂鎖</p>  
        <p type="p">103:壓力缸</p>  
        <p type="p">104:噴嘴墊圈</p>  
        <p type="p">106:噴嘴桿</p>  
        <p type="p">107:BB噴嘴元件</p>  
        <p type="p">108:活塞</p>  
        <p type="p">109:空氣壓力缸</p>  
        <p type="p">110:旋轉軸</p>  
        <p type="p">111:擊錘臂</p>  
        <p type="p">121:轉動軸</p>  
        <p type="p">132:壓力缸殼體後部</p>  
        <p type="p">133:凹部</p>  
        <p type="p">171:容納部</p>  
        <p type="p">172:BB噴嘴</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1779" publication-number="202620417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓級封裝裝備中視覺檢查的人工智慧解決方案</chinese-title>  
        <english-title>AN AI SOLUTION FOR VISION INSPECTION IN WAFER LEVEL PACKAGING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01N21/88</main-classification>  
        <further-classification edition="202601120260223B">H10P74/00</further-classification>  
        <further-classification edition="202301120260223B">G06N3/08</further-classification>  
        <further-classification edition="202201120260223B">G06V10/72</further-classification>  
        <further-classification edition="202201120260223B">G06V10/764</further-classification>  
        <further-classification edition="202201120260223B">G06V10/82</further-classification>  
        <further-classification edition="201801120260223B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬來西亞商正齊科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MI EQUIPMENT (M) SDN. BHD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　恩澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, EARN TZEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種使用至少一個相機捕獲的半導體元件的圖像來檢查半導體元件缺陷的方法；其中基於優化的深度學習模型而不是預定義規則來分析所述圖像，以適應所捕獲圖像的各種不規則性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method of inspecting semiconductor device for defects using images captured of said semiconductor device using at least one camera; wherein said images are being analysed based on an optimized deep learning model instead of pre-defined rules; to cater for various irregularities of images captured.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1780" publication-number="202620013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫甲醯化程序</chinese-title>  
        <english-title>HYDROFORMYLATION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07C45/50</main-classification>  
        <further-classification edition="200601120251201B">C07C45/80</further-classification>  
        <further-classification edition="200601120251201B">C07C47/02</further-classification>  
        <further-classification edition="200601120251201B">B01J31/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商陶氏科技投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW TECHNOLOGY INVESTMENTS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　格倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, GLENN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊莫　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAMMER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴瑟　德凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASER, DEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬希　安裘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHI, ANUJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲利普斯　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHILLIPS, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種氫甲醯化程序，其具有反應流體，該反應流體包含：(a)至少一種選自磷酸性化合物或羧酸化合物之酸性化合物；(b)銠-有機磷配體錯合物催化劑，其包含與有機磷配體錯合之銠；及可選地，(c)游離有機磷配體。此反應流體與水性萃取流體接觸，以促進經由萃取區水性流出物流（萃取器尾料）將至少一些酸性化合物自該反應流體中分離。隨後將該等萃取器尾料送至傾析器，以促進將包含銠之有機相自水流出物中進一步分離，該水流出物可送去進行包含廢水處理之額外處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hydroformylation process is disclosed having a reaction fluid comprising (a) at least one acidic compound selected from a phosphorus acidic compound or carboxylic acid compound, (b) a rhodium-organophosphorus ligand complex catalyst that comprises a rhodium complexed with an organophosphorous ligand, and, optionally, (c) free organophosphorus ligand. This reaction fluid is contacted with an aqueous extraction fluid to facilitate the separation of at least some of acidic compounds from the reaction fluid via an extraction zone aqueous effluent stream (extractor tails). The extractor tails are then sent to a decanter to facilitate further separation of the organic phase comprising rhodium from the water effluent, which can be sent for additional processing comprising wastewater treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:萃取器尾料流</p>  
        <p type="p">2:聚結區</p>  
        <p type="p">3:回收之有機物流</p>  
        <p type="p">4:傾析器水流出物流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1781" publication-number="202621212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143230</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於高頻電路的經表面處理的銅箔、其生產方法以及其在ＰＣＢ製造中的使用</chinese-title>  
        <english-title>SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, ITS PRODUCTION METHOD AND USE THEREOF IN PCB MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">H05K3/38</main-classification>  
        <further-classification edition="200601120260206B">H05K1/09</further-classification>  
        <further-classification edition="200601120260206B">C23C22/52</further-classification>  
        <further-classification edition="200601120260206B">C23C28/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧森堡商盧森堡銅箔公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIRCUIT FOIL LUXEMBOURG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞斯　瑪蒂爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLAUSSE, MATHILDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱迪　札伊尼亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAIDI, ZAINHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范帕森霍夫　瓦倫丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANPASSENHOVE, VALENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆宗　朱莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOUZON, JULIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用於高頻電路的經表面處理的銅箔以及對應的對銅箔進行處理的方法。該銅箔包括兩個相對的側，其中，第一側和第二側中的每一側均塗覆有相應的處理堆疊體，該處理堆疊體按以下順序包括：第一層，包括沉積在銅箔的相應側上的Mo氧化物和Zn氧化物，其中，該第一層不含Ni；以及耦聯劑層。第一層包括以Mo和Zn計算的介於3.0 mg/m&lt;sup&gt;2&lt;/sup&gt;與30 mg/m&lt;sup&gt;2&lt;/sup&gt;之間的量的Mo氧化物和Zn氧化物；並且每個處理堆疊體具有1.2 μm或更小的粗糙度Rz JIS。還公開了一種製造多層印刷電路板的方法，該方法使用內層芯，該內層芯包括在兩側上包覆有本公開的經表面處理的銅箔的襯底層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:銅箔</p>  
        <p type="p">12:銅箔</p>  
        <p type="p">12.1:鼓側</p>  
        <p type="p">12.2:電解質側</p>  
        <p type="p">14.1:處理堆疊體</p>  
        <p type="p">14.2:處理堆疊體</p>  
        <p type="p">16.1:第一層</p>  
        <p type="p">16.2:第一層</p>  
        <p type="p">18.1:第二層</p>  
        <p type="p">18.2:第二層</p>  
        <p type="p">20.1:第三層</p>  
        <p type="p">20.2:第三層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1782" publication-number="202621114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法和裝置</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/12</main-classification>  
        <further-classification edition="201401120260102B">H04N19/102</further-classification>  
        <further-classification edition="201401120260102B">H04N19/169</further-classification>  
        <further-classification edition="201401120260102B">H04N19/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅志軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIH-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於視訊編解碼的幀間多變換選擇集（MTS）的獲取方法和裝置。該方法基於當前塊或鄰近重建樣本的預測樣本計算出的梯度長條圖（HoG），獲取一個或多個虛擬幀內預測模式（VIPM）。根據所述一個或多個VIPM，獲取一個或多個目標幀間多變換選擇集（MTS）。在編碼器端，根據所述一個或多個目標幀間多變換選擇集的選定變換核對殘差資料進行正向變換，以生成變換後的資料；或者，根據所述一個或多個目標幀間多變換選擇集的選定變換核，對編解碼後的變換殘差資料進行逆向變換，以生成重建的殘差資料。最終提供編碼器端的變換資料或解碼器端的重建殘差資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of deriving inter MTS sets for video coding are disclosed. According to this method, one or more VIPMs (Virtual Intra Prediction Modes) are derived based on HoG (Histogram of Gradients) calculated from predicted samples of the current block or neighbouring reconstructed samples. One or more target inter MTS (Multiple Transform Selection) sets are derived according to said one or more VIPMs. Forward transform is applied to the residual data according to a selected transform kernel of said one or more target inter MTS sets at the encoder side to generate transformed data at the encoder side, or inverse transform is applied to the coded transformed residual data according to the selected transform kernel of said one or more target inter MTS sets to derive reconstructed residual data. The transformed data at the encoder side or the reconstructed residual data at the decoder side is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p>  
        <p type="p">550:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1783" publication-number="202621120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法和裝置</chinese-title>  
        <english-title>VIDEO CODING METHODS AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/82</main-classification>  
        <further-classification edition="201401120260102B">H04N19/117</further-classification>  
        <further-classification edition="201401120260102B">H04N19/86</further-classification>  
        <further-classification edition="201401120260102B">H04N19/513</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴貞延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHEN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱世鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露為一種使用樣本適應性偏移（SAO）或跨組件SAO（CCSAO）的視訊編解碼方法和裝置。根據該方法，目標重建樣本根據與當前塊相關的編解碼參數或編解碼資訊被分類到多個組中的目標組中。與目標組相關的目標SAO或CCSAO過程被應用於目標重建樣本以生成SAO或CCSAO處理樣本。提供SAO處理樣本。根據另一種方法，確定當前塊的一個或多個偏移或一個或多個縮放因子。SAO或CCSAO過程被應用於目標重建樣本以生成SAO或CCSAO處理樣本。一個或多個偏移或一個或多個縮放因子被應用於SAO或CCSAO處理樣本以生成進一步細化的重建樣本。提供進一步細化的重建樣本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus for video coding using SAO or CCSAO are disclosed. According to one method, a target reconstructed sample is classified into a target group among multiple groups according to coding parameter or coding information associated with the current block. Target SAO or CCSAO process associated with the target group is applied to the target reconstructed sample to generate a SAO or CCSAO processed sample. The SAO processed sample is provided. According to another method, one or more offsets or one or more scaling factors are determined for the current block. SAO or CCSAO process is applied to a target reconstructed sample to generate a SAO or CCSAO processed sample. Said one or more offsets or said one or more scaling factors are applied to the SAO or CCSAO processed sample to generate a further refined reconstruction sample. The further refined reconstruction sample is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">610-640:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1784" publication-number="202621133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音頻裝置和便攜式設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">H04R5/02</main-classification>  
        <further-classification edition="200601120260212B">H04S5/00</further-classification>  
        <further-classification edition="200601120260212B">H04R3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁平一聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHIRA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹野慶太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANNO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茶木秀斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKI, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">課題在於，提供生成良好的定位感和臨場感的“音頻裝置以及便攜式設備”。解決方案在於，在遊戲控制器100的正面側的左側的位置設置左揚聲器L_SPK，在正面側的右側的位置設置右揚聲器R_SPK，在正面側的左右方向上的中央的位置設置中央揚聲器C_SPK，在背面側的左右方向上的中央的位置設置後置中央揚聲器CU_SPK。對音源裝置1輸出的Lin、Rin的左右2個聲道的立體聲信號SigIN進行上混合，生成由Lmid、Rmid、Cmid的音頻信號構成的3個聲道的環繞音頻信號。Lmid是Lin，Rmid是Rin，Cmid是Lin、Rin的與另一方相關的成分之和。從左揚聲器L_SPK輸出Lmid，從左揚聲器R_SPK輸出Rmid，從後置中央揚聲器CU_SPK輸出對Cmid賦予了混響效果後的聲音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:音源裝置</p>  
        <p type="p">2:音響信號處理裝置</p>  
        <p type="p">21:模擬環繞音頻信號生成部</p>  
        <p type="p">22:混響效果賦予部</p>  
        <p type="p">23:效果特性控制部</p>  
        <p type="p">S:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1785" publication-number="202620345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冰箱及冰箱系統</chinese-title>  
        <english-title>REFRIGERATOR AND REFRIGERATOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">F25D29/00</main-classification>  
        <further-classification edition="200601120260210B">F25D11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小池成彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIKE, NARIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田穂乃香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, HONOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之冰箱具有：具有將收納物加以收納之貯藏室的冰箱本體；偵測貯藏室內之空氣之溫度亦即貯藏室溫度的箱內溫度感測器；將貯藏室加以冷卻的冷卻裝置；及執行將貯藏室溫度維持於常規冷卻溫度的常規運轉、及使貯藏室溫度暫時下降至低於常規冷卻溫度時之溫度的急冷運轉的控制裝置；控制裝置係在急冷運轉中，進行將低於常規冷卻溫度的第一急冷溫度作為貯藏室溫度之設定溫度而控制冷卻裝置的第一急冷控制；在貯藏室溫度達到第一急冷溫度的時點，係開始進行第一急冷控制後已經過第一判斷時間的情況下，則繼續進行第一急冷控制；在貯藏室溫度達到第一急冷溫度的時點，係開始進行第一急冷控制後未經過第一判斷時間的情況下，則結束第一急冷控制，藉此可進行食品的冷卻而令使用者容易加工食品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A refrigerator according to the present invention includes a refrigerator body having a storage compartment for storing items; an internal temperature sensor for detecting a storage compartment temperature, which is the temperature of the air in the storage compartment; a cooling device for cooling the storage compartment; and a control device for performing a normal operation to maintain the storage compartment temperature at a normal cooling temperature, and a rapid cooling operation to temporarily lower the storage compartment temperature to a temperature lower than the normal cooling temperature. During rapid cooling operation, the control device performs a first rapid cooling control in which the cooling device is controlled by setting a first rapid cooling temperature that is lower than the normal cooling temperature as the storage compartment temperature. When the storage compartment temperature reaches the first rapid cooling temperature, the control device continues the first rapid cooling control if a first judgment time has elapsed since the start of the first rapid cooling control. When the storage compartment temperature reaches the first rapid cooling temperature, the control device terminates the first rapid cooling control if the first judgment time has not elapsed since the start of the first rapid cooling control, thereby cooling foodstuff so that a user can easily process the foodstuff.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:冰箱</p>  
        <p type="p">12:製冰室</p>  
        <p type="p">101:冰箱本體</p>  
        <p type="p">105:鉸鏈</p>  
        <p type="p">106:操作顯示部</p>  
        <p type="p">106a:操作部</p>  
        <p type="p">106b:顯示部</p>  
        <p type="p">110:冷藏室門</p>  
        <p type="p">120:製冰室門</p>  
        <p type="p">130:切換室門</p>  
        <p type="p">140:蔬果室門</p>  
        <p type="p">150:冷凍室門</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1786" publication-number="202620574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用智慧導引車引導的運輸車運輸物料的系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR TRANSPORTING MATERIALS USING TRANSPORTERS GUIDED BY SMART GUIDED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260216B">G05D1/69</main-classification>  
        <further-classification edition="202401120260216B">G05D1/43</further-classification>  
        <further-classification edition="200601120260216B">G01C21/34</further-classification>  
        <further-classification edition="200601120260216B">B65G1/04</further-classification>  
        <further-classification edition="201901120260216B">G06N20/00</further-classification>  
        <further-classification edition="200601120260216B">B66F9/06</further-classification>  
        <further-classification edition="202201120260216B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商億美視覺私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMAGE VISION PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　循威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, SOON WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯瑪斯　比朱　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS, BIJU ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩漢德　亞艾庫柏　彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMED, YA'AKOB BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏　豐林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OO, PHONE LWIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MM</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　喜邱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA, HY CHIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主控智慧導引車（Smart Guided Vehicle，SGV）配備有智慧模組，以精確置位及定位一組運輸車，其被動態地分配以精確且安全地將一負載從一個位置轉移到另一位置。SGV可包括視覺模組，前饋控制方法係利用感測器來偵測影響運輸車移動的干擾或障礙物，並對SGV施加一回饋控制輸入，以使干擾的影響最小化。SGV利用路徑規劃軟體模組與人工智慧來理解其操作環境，並且獨立作用而無須依賴外部指示。智慧導引車在製造和分銷操作中的高效物料搬運方面扮演重要角色。無論載荷的大小與重量為何，物料搬運功能都可安全、及時地執行，不對載荷造成任何損壞。有助於物料搬運的主要因子為可靠性、一致性、以及動態工作負載分配，同時使外部指揮中心的干預（例如伺服器或其他設備）達最小化。智慧導引車由智慧軟體控制，該智慧軟體以機器學習技術強化，所述機器學習技術藉由自動化重複的物料搬運任務來最佳化工作流程，根據要執行的任務來利用多個運輸車模組的服務，藉此減少瓶頸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A master smart guided vehicle (SGV) equipped with an intelligent module for precisely locating and positioning a set of transporters dynamically assigned to transfer a load accurately and safely from one location to another. The SGV may comprise of Vision modules, a feed forward control method that uses sensors to detect disturbances or obstructions affecting the transporter movements and apply a feedback control input to the SGV to minimise the effect of the disturbance. Path planning software modules and artificial intelligence are utilised in the SGV to understand the environment it is operating in, and function independently without depending upon external instructions. The smart guided vehicle plays an important role in efficient material handling within a manufacturing and distribution operation. The material handling functions are performed safely and in a timely manner without causing any damage to the payload irrespective of its size and weight. The main factor attributing to material handling is reliability, consistency and dynamic workload distribution with minimal intervention from an external command centre such as a server or other device. Smart Guided Vehicle is controlled by intelligent software reinforced with Machine learning techniques that optimise workflows by automating repetitive material handling tasks, reducing bottlenecks by utilising the services of multiple transporter modules depending upon the task to be executed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8a、8b、8c:旋轉輪</p>  
        <p type="p">10a、10b、10c:指示燈</p>  
        <p type="p">12a、12b、12c:導引感測器</p>  
        <p type="p">15:全方向鏡</p>  
        <p type="p">100:智慧導引車(SGV)系統；SGV</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1787" publication-number="202620116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、積層體及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C08K5/13</main-classification>  
        <further-classification edition="200601120260223B">C08K5/1515</further-classification>  
        <further-classification edition="200601120260223B">C08K5/29</further-classification>  
        <further-classification edition="200601120260223B">C08K5/3492</further-classification>  
        <further-classification edition="200601120260223B">C08L101/00</further-classification>  
        <further-classification edition="200601120260223B">C09J11/06</further-classification>  
        <further-classification edition="200601120260223B">C09J201/00</further-classification>  
        <further-classification edition="201801120260223B">C09J7/20</further-classification>  
        <further-classification edition="200601120260223B">B32B27/00</further-classification>  
        <further-classification edition="200601120260223B">B32B27/18</further-classification>  
        <further-classification edition="202601120260223B">H10W72/30</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田昂己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青島健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOSHIMA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有本由香里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMOTO, YUKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種可以高的位置精度轉印微細且高密度地搭載的半導體晶片的組成物，其解決手段為一種組成物，包含（a）化合物及（b）化合物，所述組成物中，相對於組成物的固體成分100質量%，所述（a）化合物佔多於50質量%且95質量%以下。 &lt;br/&gt;（a）化合物：於分子內具有兩個以上與（b）化合物的交聯基反應而鍵結的基、且於波長240 nm以上且400 nm以下的範圍的任一者中具有極大吸收、且所述極大吸收波長下的克吸光係數為40 L/（g·cm）以上且4000 L/（g·cm）以下的化合物 &lt;br/&gt;（b）化合物：不與（a）化合物相符且於分子內具有兩個以上的交聯基、且所述交聯基為選自由環氧基、氧雜環丁基、烷氧基甲基、羥甲基及異氰酸酯基所組成的群組中的基的化合物</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:具有雷射透過性的第一基板(第一基板)</p>  
        <p type="p">12:硬化膜</p>  
        <p type="p">14:半導體晶片</p>  
        <p type="p">41:壓接裝置(裝置)</p>  
        <p type="p">110:第一積層體</p>  
        <p type="p">120:第二積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1788" publication-number="202620565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用CGI影片進行多模態機器人訓練</chinese-title>  
        <english-title>MULTI MODAL ROBOT TRAINING USING CGI VIDEOS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G05B19/418</main-classification>  
        <further-classification edition="200601120260209B">B25J9/16</further-classification>  
        <further-classification edition="202001120260209B">G06F30/27</further-classification>  
        <further-classification edition="201901120260209B">G06N20/00</further-classification>  
        <further-classification edition="201701120260209B">G06T7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商億美視覺私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMAGE VISION PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　循威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, SOON WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　喜邱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TA, HY CHIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　承霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONG, CHERNG LIIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提出一種關節式機器人也稱為自動化系統，通常是在部署於工業環境中以高速及高準確度執行關鍵任務。它們需要以許多不同任務進行訓練，例如負載、卸載、抓取和釋放物件等等。現代機器人能夠透過觀察人類或另一機器人執行一系列任務並且記錄動作來學習，以借助電腦來基於要由自動化系統（以下稱為機器人）執行的任務來制訂控制計畫。然而這些方法是耗時的且易生錯誤。本發明揭露一種解決方案，其利用電腦生成影像（Computer-Generated Imagery，CGI）影片結合電腦輔助設計（Computer Aided Design，CAD）流程，以產生包含於CGI輸入中的機器人控制程式。此外，控制程式中還併入機器學習、強化學習、生成式人工智慧、以及預測分析，藉由微調操作模式來幫助提升控制程式的性能，以於不同製造環境中高效且快速部署機器人。控制程式隨後可用以評估機器人的性能，並提供回饋以重新校正機器人控制程式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An articulated Robot herein referred to as an automated system is typically deployed in industrial environments to perform critical tasks at high speed and accuracy. They require to be trained at many different tasks such as loading, unloading, gripping &amp;amp; releasing an object to name a few. Modern Robots have capabilities to learn by observing a human or another Robot perform the sequence of tasks and record the movements to formulate a control plan based on the tasks to be executed by the automated system henceforth referred to as a Robot, with the aid of a computer. However such methods are time consuming and prone to errors. The present invention discloses a solution that utilises a computer-generated imagery (CGI) video in combination with Computer aided design (CAD) process, to enable the generation of a control program for a Robot as contained in the CGI input. Further, machine learning, reinforced learning, Generative Artificial Intelligence and predictive analytics are incorporated within the control program, to help enhance the performance of the control program by fine tuning the operating models for efficient and quick deployment of Robots in different manufacturing environments. The control program may subsequently be used to evaluate the robot's performance and provide feedback for recalibrating the robot control program.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:相機</p>  
        <p type="p">20:照明模組</p>  
        <p type="p">30:機器人手臂</p>  
        <p type="p">40:機器人手臂</p>  
        <p type="p">50:端效器；機器人右手</p>  
        <p type="p">60:端效器；機器人左手；機器人左端效器</p>  
        <p type="p">100:關節式機器人；機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1789" publication-number="202619954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理基板之方法及處理基板之設備</chinese-title>  
        <english-title>METHOD OF TREATING A SUBSTRATE AND APPARATUS OF TREATING A SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">B65G43/08</main-classification>  
        <further-classification edition="200601120251204B">B65G43/02</further-classification>  
        <further-classification edition="200601120251204B">B25J9/16</further-classification>  
        <further-classification edition="202301120251204B">G06N3/08</further-classification>  
        <further-classification edition="201801120251204B">G06F9/44</further-classification>  
        <further-classification edition="200601120251204B">G05B19/406</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＲＴＭ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RTM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河泰慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, TAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴珍佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JIN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奎壹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, GYU IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的示例性實施例提供一種能夠防止後續基板污染的基板處理方法及基板處理設備。根據該示例性實施例，當傳送腔室的壓力監測操作時，該方法可包括獲取表示傳送腔室隨時間推移的壓力變化的圖、及基於該圖的形狀確定傳送腔室內部是否有壓力異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An exemplary embodiment of the present invention provides a substrate treating method and a substrate treating apparatus that are capable of preventing contamination of a subsequent substrate. According to the exemplary embodiment, when the pressure monitoring operation of the transfer chamber, the method may include acquiring a graph representing the pressure change in the transfer chamber over time, and determining whether there is a pressure abnormality inside the transfer chamber based on a shape of the graph.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:容器</p>  
        <p type="p">11:第一方向</p>  
        <p type="p">12:第二方向</p>  
        <p type="p">100:索引模組</p>  
        <p type="p">120:負載埠</p>  
        <p type="p">140:索引框架</p>  
        <p type="p">142:索引機械人</p>  
        <p type="p">142a、342a:手柄</p>  
        <p type="p">148:導軌</p>  
        <p type="p">200:負載鎖定腔室</p>  
        <p type="p">300:處理模組</p>  
        <p type="p">340:傳送腔室</p>  
        <p type="p">342:傳送機器人</p>  
        <p type="p">346:第一壓力感測器</p>  
        <p type="p">348:排氣構件</p>  
        <p type="p">360、360-1、360-2、360-3、360-4:製程腔室</p>  
        <p type="p">362-1、362-2、362-3、362-4:入口</p>  
        <p type="p">364-1、364-2、364-3、364-4:門</p>  
        <p type="p">366-1、366-2、366-3、366-4:第二壓力感測器</p>  
        <p type="p">368-1、368-2、368-3、368-4:排氣構件</p>  
        <p type="p">500:控制器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1790" publication-number="202619964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超高純度碘化氫的提純方法、薄膜製造方法、半導體基板及半導體器件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">C01B7/13</main-classification>  
        <further-classification edition="200601120260203B">C23C16/455</further-classification>  
        <further-classification edition="200601120260203B">C23C16/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商秀博瑞殷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOULBRAIN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, JAE SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金德鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DEOK HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴志源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JI WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及超高純度碘化氫的提純方法，根據本發明，具有提供純度為99.999%至99.99999999%的超高純度碘化氫的提純方法的效果，該方法能夠在不分解或不吸附高純度碘化氫的情況下，僅將高純度碘化氫中包含的10ppm以下的水分去除至0.1ppm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1791" publication-number="202621379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測半導體製造過程中異常的方法及執行該方法的程式</chinese-title>  
        <english-title>METHOD OF DETECTING ABNORMALITY IN SEMICONDUCTOR MANUFACTURING PROCESS AND PROGRAM FOR PERFORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P50/20</main-classification>  
        <further-classification edition="202601120260223B">H10P74/20</further-classification>  
        <further-classification edition="200601120260223B">G01J3/443</further-classification>  
        <further-classification edition="200601120260223B">G01N21/88</further-classification>  
        <further-classification edition="202201120260223B">G06V10/762</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＲＴＭ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RTM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河泰慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, TAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNG HEUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金然模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEON MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種藉由分析在使用電漿處理基板的處理腔室內的光線，以檢測半導體製造過程中異常的方法。該方法包括聚類分類操作，將參考光線強度資料聚類成複數個聚類，參考光線強度資料根據從基板去除的去除目標的種類而變化；參考資料生成操作，生成包括複數個聚類中的每一個的異常確定數值分布的參考資料；以及異常檢測操作，藉由將檢測異常的目標資料與參考資料比較來確定目標資料是否異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method of detecting an abnormality in a semiconductor manufacturing process by analyzing light within a process chamber that processes a substrate by using plasma. The method may comprise a cluster classification operation of clustering reference light intensity data into a plurality of clusters, the reference light intensity data varying depending on a type of a removal target removed from a substrate; a reference data generation operation of generating reference data including a distribution of abnormality determination numerical values for each of the plurality of clusters; and an abnormality detection operation of determining whether the target data is abnormal by comparing target data for detecting the abnormality with the reference data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:波長選擇操作</p>  
        <p type="p">S20:選定波長資料收集操作</p>  
        <p type="p">S30:聚類分類操作</p>  
        <p type="p">S40:參考資料生成操作</p>  
        <p type="p">S50:異常檢測操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1792" publication-number="202620831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其顯示驅動晶片與顯示驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE, DISPLAY DRIVING CHIP AND DISPLAY DRIVING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251222B">G09G3/32</main-classification>  
        <further-classification edition="200601120251222B">G09G3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡佐樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, TSO-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示裝置及其顯示驅動晶片與顯示驅動方法。顯示面板的顯示區包括高刷新率顯示區和低刷新率顯示區。顯示驅動晶片產生閘時脈訊號。閘極驅動器使用閘時脈訊號去產生用以驅動高刷新率顯示區的第一掃描訊號以及用以驅動低刷新率顯示區的第二掃描訊號。在全刷幀週期內高刷新率顯示區和低刷新率顯示區均被刷新。在局刷幀週期內僅高刷新率顯示區被刷新。閘時脈訊號在全刷幀週期的不同部分中（對應於不同刷新率顯示區）具有不同工作時段或不同振幅。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a display device, a display driving chip, and a display driving method thereof. The display panel includes a high refresh rate display area and a low refresh rate display area. The display driving chip generates a gate clock signal. The gate driver uses the gate clock signal to generate first scan signals for driving the high refresh rate display area and second scan signals for driving the low refresh rate display area. Both the high refresh rate display area and the low refresh rate display area are refreshed during the full refresh frame period. Only the high refresh rate display area is refreshed during a partial refresh frame period. The gate clock signal has different active periods or different swings in different parts of the full refresh frame period (corresponding to different refresh rate display areas).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1793" publication-number="202620473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及使用其之影像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G02B5/30</main-classification>  
        <further-classification edition="200601120260207B">B32B27/32</further-classification>  
        <further-classification edition="201501120260207B">G02B1/14</further-classification>  
        <further-classification edition="201901120260207B">B32B7/023</further-classification>  
        <further-classification edition="200601120260207B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林和嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大畑浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學積層體，其係具備：由雙軸拉伸PEs薄膜構成，並具有雙折射性的光穿透性基材、及被設置於光穿透性基材之一個面的光學功能層，且總霧度為10%以下，光穿透性基材的厚度為20~70μm，從相對於基材面垂直的方向測定到的波長550nm的Re(0°)、從相對於基材面傾斜50°的方向測定到的波長550nm的Re(50°)係同時地滿足下述條件(a)~(b)。&lt;br/&gt; 20nm≦Re(0°)≦400nm                   …(a)&lt;br/&gt; 0nm≦｜Re(0°)-Re(50°)｜≦500nm   …(b)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光穿透性基材</p>  
        <p type="p">2:易接著層</p>  
        <p type="p">3:第一功能層</p>  
        <p type="p">10:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1794" publication-number="202620067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及使用其之影像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260129B">C08F2/50</main-classification>  
        <further-classification edition="200601120260129B">C08F265/06</further-classification>  
        <further-classification edition="200601120260129B">B32B27/30</further-classification>  
        <further-classification edition="201901120260129B">B32B7/035</further-classification>  
        <further-classification edition="200601120260129B">B29C51/04</further-classification>  
        <further-classification edition="200601120260129B">G02B5/30</further-classification>  
        <further-classification edition="200601120260129B">C08J5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林和嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大畑浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學積層體，其特徵在於其具備：由雙軸拉伸PEs薄膜構成，並具有雙折射性的光穿透性基材、及被設置於光穿透性基材之一個面的光學功能層，且總霧度為10%以下，光穿透性基材的厚度為20～70μm，將從相對於基材面垂直的方向測定到的遲滯設為Re(0°)、將從相對於基材面傾斜50°的方向測定到的遲滯設為Re(50°)時，在波長360～830nm的波長區域中滿足下述條件(a)。&lt;br/&gt; 0nm≦｜Re(0°)-Re(50°)｜≦500nm ・・・(a)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光穿透性基材</p>  
        <p type="p">2:易接著層</p>  
        <p type="p">3:第一功能層</p>  
        <p type="p">10:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1795" publication-number="202620525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及使用其之影像顯示裝置</chinese-title>  
        <english-title>OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02F1/13357</main-classification>  
        <further-classification edition="202301120260211B">H10K59/10</further-classification>  
        <further-classification edition="201501120260211B">G02B1/10</further-classification>  
        <further-classification edition="200601120260211B">B32B27/30</further-classification>  
        <further-classification edition="200601120260211B">B32B27/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林和嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大畑浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學積層體，其特徵在於其具備：由雙軸拉伸PEs薄膜構成，並具有雙折射性的光穿透性基材、及被設置於光穿透性基材之一個面的光學功能層，且總霧度為10%以下，光穿透性基材的厚度為20~70μm，以Re=(nx-ny)×d、Rth’=(nx-nz)×d、Nz’=Rth’/Re所分別定義的值係同時地滿足下述條件(a)~(c)。&lt;br/&gt; 20nm≦Re≦400nm    …(a)&lt;br/&gt; 0nm≦Rth’≦1500nm  …(b)&lt;br/&gt; Nz’≦18                   …(c)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光穿透性基材</p>  
        <p type="p">2:易接著層</p>  
        <p type="p">3:第一功能層</p>  
        <p type="p">10:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1796" publication-number="202619885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜及影像顯示裝置</chinese-title>  
        <english-title>OPTICAL FILM AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260203B">B32B7/023</main-classification>  
        <further-classification edition="201901120260203B">B32B7/028</further-classification>  
        <further-classification edition="200601120260203B">B32B27/36</further-classification>  
        <further-classification edition="201501120260203B">G02B1/10</further-classification>  
        <further-classification edition="200601120260203B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林和嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種使用由聚酯系樹脂構成的薄膜作為基材，係薄型，且強度及平坦性優異之光學薄膜及使用其之影像顯示裝置。一種光學薄膜，其係於基材薄膜上形成有表面處理層的光學薄膜，其中基材薄膜係平均膜厚為13μm以上60μm以下的聚酯複合材，基材薄膜之MD方向的熱收縮率及TD方向的熱收縮率之差的絕對值為1.3以下，表面處理層的平均膜厚為2.0μm以上15.0μm以下，且以下述式(1)所定義的表面處理層的膜厚變動比率Vr為15%以下。&lt;br/&gt; Vr=(V&lt;sub&gt;max&lt;/sub&gt;/T&lt;sub&gt;avg&lt;/sub&gt;)×100   (1)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學薄膜</p>  
        <p type="p">2:基材薄膜</p>  
        <p type="p">3:表面處理層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1797" publication-number="202620474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜、光學薄膜的製造方法、偏光板及有機電致發光顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">G02B5/30</main-classification>  
        <further-classification edition="200601120260213B">G02B1/04</further-classification>  
        <further-classification edition="201901120260213B">B32B7/023</further-classification>  
        <further-classification edition="200601120260213B">C08J5/18</further-classification>  
        <further-classification edition="202301120260213B">H10K77/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣芝泰祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSHIBA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學薄膜，其係包含含脂環結構聚合物及紫外線吸收劑的光學薄膜，厚度為5 μm以下，波長380 nm之光線穿透率為10%以下，前述光學薄膜更包含0.01重量%以上且10重量%以下之殘留溶媒。一種光學薄膜的製造方法，其包含：將包含前述含脂環結構聚合物、前述紫外線吸收劑、第一溶媒及第二溶媒之混合溶液塗布於基材上來形成塗膜的工序；其中前述第一溶媒係前述含脂環結構聚合物的良溶媒且係前述紫外線吸收劑的不良溶媒，前述第二溶媒係前述紫外線吸收劑的良溶媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1798" publication-number="202620583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性記憶體的參考電流產生器</chinese-title>  
        <english-title>REFERENCE CURRENT GENERATOR FOR NON-VOLATILE MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260109B">G05F3/26</main-classification>  
        <further-classification edition="200601120260109B">G05F1/565</further-classification>  
        <further-classification edition="200601120260109B">G11C16/30</further-classification>  
        <further-classification edition="200601120260109B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古惟銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉明源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種參考電流產生器，包括：二個電晶體、一電阻與一鏡射電路。第一電晶體的源極接收電源電壓，汲極連接至第一節點，閘極連接至第二節點。第二電晶體的源極接收電源電壓，汲極與閘極連接至第三節點。電阻連接於第二節點與第三節點之間。鏡射電路的輸入端接收一輸入電流，第一鏡射端連接至第二節點，第二鏡射端連接至第一節點。第一鏡射端與第二鏡射端分別產生第一鏡射電流與第二鏡射電流。其中，第一電晶體產生飽和電流。另外，參考電流等於飽和電流減去第二鏡射電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reference current generator includes two transistors, a resistor and a mirroring circuit. The first transistor includes a source receiving a supply voltage, a drain connected with a first node, and a gate connected with a second node. The second transistor includes a source receiving the supply voltage, and a drain and a gate connected with a third node. The resistor is connected between the second node and the third node. The mirroring circuit includes an input terminal receiving an input current, a first mirrored terminal connected with the second node and a second mirrored terminal connected with the first node. The first mirrored terminal and the second mirrored terminal generate a first mirroring current and a second mirroring current respectively. The first transistor generates a saturation current. A reference current is equal to the saturation current minus the second mirroring current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:參考電流產生器</p>  
        <p type="p">210:鏡射電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1799" publication-number="202620895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體組成數據之評估方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G16H50/20</main-classification>  
        <further-classification edition="201801120251201B">G16H50/70</further-classification>  
        <further-classification edition="201801120251201B">G16H50/30</further-classification>  
        <further-classification edition="200601120251201B">A61B5/107</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興友科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝坤昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之評估方法首先提供一三維人體掃描儀，三維人體掃描儀具有一數據資料庫，數據資料庫儲存有不同人種的母體數據，接著由一受測者於三維人體掃描儀輸入人種、性別、年齡及體重等參數，之後由三維人體掃描儀對受測者的身體進行掃描以取得受測者的身體尺寸，三維人體掃描儀根據所取得的身體尺寸及受測者所輸入的參數取得一測量數據，最後將受測者之測量數據和數據資料庫之母體數據進行分析比對，如此即可評估受測者在所屬人種當中的體組成狀況，藉以滿足不同人種的體組成評估需求及提升評估結果的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:三維人體掃描儀</p>  
        <p type="p">12:掃描單元</p>  
        <p type="p">20:數據資料庫</p>  
        <p type="p">30:輸入單元</p>  
        <p type="p">40:數據建構單元</p>  
        <p type="p">50:數據分析單元</p>  
        <p type="p">60:動態更新單元</p>  
        <p type="p">70:輸出單元</p>  
        <p type="p">72:個人化體組成評估報告</p>  
        <p type="p">80:受測者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1800" publication-number="202620580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多軌供電系統及其多相電壓調節器的控制器、控制方法</chinese-title>  
        <english-title>MULTI-RAIL POWER SUPPLY SYSTEM AND CONTROLLER FOR ITS MULTIPHASE VOLTAGE REGULATOR, AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G05F1/565</main-classification>  
        <further-classification edition="200601120260202B">H02M3/156</further-classification>  
        <further-classification edition="200601120260202B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬哈賈恩　阿尼魯達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHAJAN, ANIRUDHA ATUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張方禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃道成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, DAOCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種多軌供電系統、用於多軌供電系統中的多相電壓調節器的控制器及相應的控制方法，該控制器包括動態過流單元和開關控制電路。動態過流單元基於系統輸入電流來提供過流閾值，其中，系統輸入電流指示多相電壓調節器和至少一個其他電壓調節器的總輸入電流。開關控制電路提供多個開關控制訊號以控制多相電壓調節器的多個切換電路，使得多相電壓調節器的輸出電壓被調節到預設位準，並基於過流閾值來控制多個切換電路的輸出電流。本發明的控制器基於系統輸入電流來協調多個電壓調節器的過流限制，透過動態調整過流閾值，實現了多軌供電系統的熱平衡，並控制了總功耗以避免過熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-rail power supply system and controller for its multiphase voltage regulator, and a related control method are disclosed. The controller comprises &lt;br/&gt;a dynamic overcurrent unit and a switch control circuit. The dynamic overcurrent unit provides an overcurrent threshold based on a system-input current which indicates a total input current of the multiphase voltage regulator and at least another voltage regulator. The switch control circuit provides a plurality of switch control signals to control a plurality of switching circuits of the multiphase voltage regulator, such that an output voltage of the multiphase voltage regulator is regulated to a predetermined voltage level and an output current of the plurality of switching circuits is controlled based on the overcurrent threshold. The controller according to the present disclosure coordinates the over‑current limits of multiple voltage regulators based on the system-input current. By dynamically adjusting the overcurrent threshold, the multi-rail power supply system achieves a system-level thermal balance, and the total power dissipation is constrained to avoid overheating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:動態過流單元</p>  
        <p type="p">40:記憶體</p>  
        <p type="p">50:開關控制電路</p>  
        <p type="p">100:多軌供電系統</p>  
        <p type="p">101:輸入節點</p>  
        <p type="p">102~105:輸出節點</p>  
        <p type="p">106:電流偵測電路</p>  
        <p type="p">107:DC/DC轉換器</p>  
        <p type="p">108~111:功率級</p>  
        <p type="p">112~115:控制電路</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">Vo1~Vo4:輸出電壓</p>  
        <p type="p">IIN:系統輸入電流</p>  
        <p type="p">VDC:直流母線電壓</p>  
        <p type="p">PWM1~PWM4:開關控制訊號陣列</p>  
        <p type="p">PWM1_1~PWM1_2,PWM2_1~PWM2_2,PWM3_1~PWM3_2:開關控制訊號</p>  
        <p type="p">Io1~Io4:電流</p>  
        <p type="p">OCL,OCL0:過流閾值</p>  
        <p type="p">Iinsen:電流偵測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1801" publication-number="202620015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性環硫組成物、硬化物、積層體、及硬化物的製造方法</chinese-title>  
        <english-title>PHOTOCURABLE EPISULFIDE COMPOSITION, CURED PRODUCT, LAYERED BODY, AND METHODS FOR PRODUCING CURED PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07C59/19</main-classification>  
        <further-classification edition="200601120260102B">C07C211/63</further-classification>  
        <further-classification edition="200601120260102B">C07C279/04</further-classification>  
        <further-classification edition="200601120260102B">C07C323/22</further-classification>  
        <further-classification edition="200601120260102B">C07D317/54</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07F5/02</further-classification>  
        <further-classification edition="200601120260102B">C08G75/06</further-classification>  
        <further-classification edition="200601120260102B">C08L81/02</further-classification>  
        <further-classification edition="200601120260102B">C08K5/09</further-classification>  
        <further-classification edition="200601120260102B">C08K5/1565</further-classification>  
        <further-classification edition="200601120260102B">C08K5/17</further-classification>  
        <further-classification edition="200601120260102B">C08K5/31</further-classification>  
        <further-classification edition="200601120260102B">C08K5/3462</further-classification>  
        <further-classification edition="200601120260102B">C08K5/375</further-classification>  
        <further-classification edition="200601120260102B">C08K5/55</further-classification>  
        <further-classification edition="200601120260102B">C08J3/28</further-classification>  
        <further-classification edition="200601120260102B">B32B27/00</further-classification>  
        <further-classification edition="200601120260102B">B32B27/16</further-classification>  
        <further-classification edition="200601120260102B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里貝羅　奈傑爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIBEIRO, NIGEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉元祐熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性環硫組成物，含有光鹼產生劑（a）、以及環硫化合物（b），光鹼產生劑（a）為式（1）或式（2）所表示的化合物。R為取代基，X&lt;sup&gt;+&lt;/sup&gt;為陽離子，A&lt;sup&gt;1&lt;/sup&gt;及A&lt;sup&gt;2&lt;/sup&gt;為5元環～8元環結構，L及R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;4&lt;/sup&gt;為取代基。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="218px" width="611px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1802" publication-number="202621026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升壓器及參考控制電路</chinese-title>  
        <english-title>VOLTAGE BOOSTER AND REFERENCE VOLTAGE CONTROL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">H02M3/156</main-classification>  
        <further-classification edition="200601120260108B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種升壓器，包含電荷泵、升壓控制電路、帶隙電路、分壓器、以及參考控制電路。電荷泵根據輸入電源電壓產生泵電壓。升壓控制電路根據電荷泵參考電壓以及泵電壓的反饋電壓產生用於控制電荷泵的調整訊號。帶隙電路根據泵電壓產生帶隙電壓。分壓器根據輸入電源電壓產生輸入電源參考電壓。參考控制電路在帶隙電路準備就緒之前，根據輸入電源參考電壓產生電荷泵參考電壓，並在帶隙電路準備就緒之後，根據由帶隙電壓得到的帶隙參考電壓產生電荷泵參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage booster includes a charge pump, a boost control circuit, a bandgap circuit, a voltage divider, and a reference control circuit. The charge pump generates a pumped voltage according to an input power voltage. The boost control circuit generates an adjustment signal for controlling the charge pump according to a charge pump reference voltage and a feedback voltage of the pumped voltage. The bandgap circuit generates a bandgap voltage according to the pumped voltage. The voltage divider generates an input power reference voltage according to the input power voltage. The reference control circuit generates the charge pump reference voltage according to the input power reference voltage before the bandgap circuit becomes ready, and generates the charge pump reference voltage according to a bandgap reference voltage derived from the bandgap voltage after the bandgap circuit is ready.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:升壓器</p>  
        <p type="p">110:電荷泵</p>  
        <p type="p">120:升壓控制電路</p>  
        <p type="p">122:比較器</p>  
        <p type="p">130:帶隙電路</p>  
        <p type="p">140:帶隙緩衝器</p>  
        <p type="p">150:分壓器</p>  
        <p type="p">160:參考控制電路</p>  
        <p type="p">162,164:放大器</p>  
        <p type="p">170:分壓器</p>  
        <p type="p">180:低通濾波器</p>  
        <p type="p">C1,C2:電容</p>  
        <p type="p">M1P:電晶體</p>  
        <p type="p">OT1:輸出端</p>  
        <p type="p">SIG&lt;sub&gt;AD&lt;/sub&gt;:調整訊號</p>  
        <p type="p">VB:帶隙電壓</p>  
        <p type="p">VBR:帶隙參考電壓</p>  
        <p type="p">VCGR:電荷泵參考電壓</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">VFB:反饋電壓</p>  
        <p type="p">VIPR:輸入電源參考電壓</p>  
        <p type="p">VP:泵電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1803" publication-number="202620940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製備和調節電極混合物以及由所述電極混合物製備乾電極的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">H01M4/04</main-classification>  
        <further-classification edition="202201120251126B">B01F23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商古斯塔夫愛立許機械製造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCHINENFABRIK GUSTAV EIRICH GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋爾　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERL, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於製備和調製電極混合物的方法以及從電極混合物製造乾電極的方法。本發明關於一種製備和調製電極混合物的方法，該電極混合物由活性材料、可選的添加劑和黏合劑構成，該方法包括以下步驟：1）在混合容器中製備電極混合物，其中在製備期間將混合物加熱到溫度T&lt;sub&gt;H&lt;/sub&gt;，其中T&lt;sub&gt;H&lt;/sub&gt; ＞ 45℃，2）將混合容器中的電極混合物冷卻至少ΔT = 5℃、較佳地冷卻到溫度T&lt;sub&gt;MAX&lt;/sub&gt; ＜ 35℃，但不低於取出溫度T&lt;sub&gt;E&lt;/sub&gt; ＞ 24℃，3）取出具有取出溫度的電極混合物，並且將電極混合物供應至冷卻裝置，4）借助於冷卻裝置，將步驟2）之後的電極混合物冷卻至少4℃、較佳地冷卻到溫度T&lt;sub&gt;K&lt;/sub&gt; ＜ 19℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:帶有混合容器的混合機</p>  
        <p type="p">2:混合工具</p>  
        <p type="p">3:抽吸管</p>  
        <p type="p">4:容器旋轉軸</p>  
        <p type="p">5:混合工具旋轉軸</p>  
        <p type="p">6:計量元件</p>  
        <p type="p">7:緩衝容器</p>  
        <p type="p">8:細微性測量設備</p>  
        <p type="p">9:文丘里噴嘴</p>  
        <p type="p">10:第二氣力輸送管道</p>  
        <p type="p">11:第一氣力輸送管道</p>  
        <p type="p">12:摩擦篩</p>  
        <p type="p">13:多輥輥壓機</p>  
        <p type="p">14:箔帶</p>  
        <p type="p">15:邊緣條帶</p>  
        <p type="p">16:用於氣力輸送的收集裝置</p>  
        <p type="p">19:真空泵</p>  
        <p type="p">20:雙層夾套</p>  
        <p type="p">21:供給裝置</p>  
        <p type="p">22:轉運管道</p>  
        <p type="p">23:稱重感測器</p>  
        <p type="p">24:切割裝置</p>  
        <p type="p">25:輸送氣體</p>  
        <p type="p">36:氣體鬆動裝置</p>  
        <p type="p">37:分離器</p>  
        <p type="p">38:氣固分離器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1804" publication-number="202620941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產電極混合物的具有基於壓力的輸送裝置的混合器</chinese-title>  
        <english-title>MIXER FOR PRODUCING AN ELECTRODE MIXURE WITH PRESSURE-BASED CONVEYOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">H01M4/04</main-classification>  
        <further-classification edition="202201120260207B">B01F35/75</further-classification>  
        <further-classification edition="202201120260207B">B01F27/091</further-classification>  
        <further-classification edition="202201120260207B">B01F25/315</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商古斯塔夫愛立許機械製造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCHINENFABRIK GUSTAV EIRICH GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　克萊門斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, CLEMENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於用於生產電極混合物的具有基於壓力的輸送裝置的混合器。本發明關於一種用於生產電極混合物的混合器，該混合器包括：混合容器，其可繞混合容器軸線旋轉並具有旋轉對稱且較佳為圓形的容器底部以及容器壁；刮除設備，其可相對於混合容器移動並接觸容器底部或與容器底部的距離小於2mm；以及基於壓力的輸送裝置，其用於從混合容器中取出電極混合物，其中基於壓力的輸送裝置包括佈置在刮除設備上或刮除設備中的輸送通道，該輸送通道具有入口和出口，入口布置在容器底部附近。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a mixer with a pressure-based delivery device for producing electrode mixtures. The present invention relates to a mixer for producing an electrode mixture with a mixing container that can rotate around a mixing container axis and has a rotationally symmetrical and preferably circular container base and a container wall, a scraper device that is movable relative to the mixing container and contacts the container bottom or is less than 2 mm away from the container bottom, and a pressure-based conveyor device for removing the electrode mixture from the mixing container, wherein the pressure-based conveyor device has a conveyor channel arranged on or in the scraping device with an inlet arranged near the container bottom and an outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:混合器</p>  
        <p type="p">2:容器</p>  
        <p type="p">3:支腳</p>  
        <p type="p">4:旋轉軸承</p>  
        <p type="p">5:混合容器軸線</p>  
        <p type="p">6:混合工具軸線</p>  
        <p type="p">7:馬達</p>  
        <p type="p">8:傳動帶</p>  
        <p type="p">9:臂部</p>  
        <p type="p">10:攪拌元件</p>  
        <p type="p">11:刮除設備</p>  
        <p type="p">12:導向唇</p>  
        <p type="p">17:混合工具</p>  
        <p type="p">20:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1805" publication-number="202620942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由電極混合物製造乾電極的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">H01M4/04</main-classification>  
        <further-classification edition="200601120260207B">B29B17/00</further-classification>  
        <further-classification edition="200601120260207B">B02C18/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商古斯塔夫愛立許機械製造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCHINENFABRIK GUSTAV EIRICH GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋爾　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERL, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於從電極混合物製造乾電極的方法。本發明關於一種從在混合工藝和/或調製工藝中製備的電極混合物製造乾電極的方法，在該方法中，將電極混合物供應至壓延機並壓延成幅材，其中隨後將幅材的邊緣條材或多餘材料分離，以確保幅材的寬度均勻，其中，將所分離的邊緣條材或多餘材料供應至粉碎裝置，該粉碎裝置將所分離的邊緣條材分成更小的條材段，該條材段被供應至混合工藝和/或調製工藝以製備進一步的電極混合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:帶有混合容器的混合機</p>  
        <p type="p">2:混合工具</p>  
        <p type="p">3:抽吸管</p>  
        <p type="p">4:容器旋轉軸線</p>  
        <p type="p">5:混合工具旋轉軸線</p>  
        <p type="p">6:計量機構</p>  
        <p type="p">7:緩衝容器</p>  
        <p type="p">8:細微性測量設備</p>  
        <p type="p">9:文丘里噴嘴</p>  
        <p type="p">10:第二氣力輸送管線</p>  
        <p type="p">11:第一氣力輸送管線</p>  
        <p type="p">12:摩擦篩</p>  
        <p type="p">13:多輥壓延機</p>  
        <p type="p">14:料帶</p>  
        <p type="p">15:邊緣條帶</p>  
        <p type="p">16:用於氣力輸送的接收裝置</p>  
        <p type="p">19:真空泵</p>  
        <p type="p">20:雙層夾套</p>  
        <p type="p">21:供給裝置</p>  
        <p type="p">22:轉送管線</p>  
        <p type="p">23:稱重感測器</p>  
        <p type="p">24:切割裝置</p>  
        <p type="p">25:輸送氣體</p>  
        <p type="p">36:氣體鬆動裝置</p>  
        <p type="p">37:分離器</p>  
        <p type="p">38:氣固分離器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1806" publication-number="202621289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143604</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、製造其之方法及電子設備</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10D62/10</main-classification>  
        <further-classification edition="202501120260223B">H10D62/80</further-classification>  
        <further-classification edition="202501120260223B">H10D64/20</further-classification>  
        <further-classification edition="202601120260223B">H10W20/20</further-classification>  
        <further-classification edition="202601120260223B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳嬉堤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, HUIJE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭雅林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, ALUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪敏碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, MINSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置可包括一第一絕緣層及位於該第一絕緣層上之一通道形成層，其中該通道形成層可包括一二維半導體材料。該通道形成層可包括一主動半導體層及一非主動半導體層。該主動半導體層可以一第一黏著能接合至該第一絕緣層之一上部表面。該非主動半導體層可橫向接合至該主動半導體層，且可包括該主動半導體層中所包括之一元素。另外，該非主動半導體層可以一第二黏著能接合至該第一絕緣層之該上部表面。該第二黏著能可大於該第一黏著能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a first insulating layer and a channel formation layer on the first insulating layer, where the channel formation layer may include a two-dimensional semiconductor material. The channel formation layer may include an active semiconductor layer and an inactive semiconductor layer. The active semiconductor layer may be bonded to an upper surface of the first insulating layer with a first adhesion energy. The inactive semiconductor layer may be laterally bonded to the active semiconductor layer and may include an element included in the active semiconductor layer. In addition, the inactive semiconductor layer may be bonded to the upper surface of the first insulating layer with a second adhesion energy. The second adhesion energy may be greater than the first adhesion energy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1807" publication-number="202620711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>回應產生裝置及方法</chinese-title>  
        <english-title>RESPONSE GENERATION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06N20/00</main-classification>  
        <further-classification edition="202301120251201B">G06N3/08</further-classification>  
        <further-classification edition="201901120251201B">G06F16/903</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭宇劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YU-SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種回應產生裝置及方法。該裝置儲存一語言模型及一回應驗證模型。該裝置基於一使用者對話及該語言模型，產生對應於該使用者對話之一第一回應。該裝置基於該使用者對話、複數個驗證指標及該回應驗證模型，判斷該第一回應是否對應至一未通過驗證狀態。該裝置響應於判斷該第一回應對應至該未通過驗證狀態，產生對應於該使用者對話之一第二回應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A response generation device and method are provided. The device stores a language model and a response verification model. Based on a user conversation and the language model, the device generates a first response corresponding to the user conversation. The device determines whether the first response corresponds to a verification failed state based on the user conversation, verification indicators, and the response verification model. In response to determining that the first response corresponds to the verification failed state, the device generates a second response corresponding to the user conversation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:回應產生方法</p>  
        <p type="p">S701、S703、S705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1808" publication-number="202620855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊記憶體裝置及製造記憶體裝置的方法</chinese-title>  
        <english-title>STACKED MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G11C7/18</main-classification>  
        <further-classification edition="202601120260223B">H10P54/00</further-classification>  
        <further-classification edition="202601120260223B">H10W10/00</further-classification>  
        <further-classification edition="202601120260223B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DON KOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金烔完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於基於摺疊位元線和交錯半導體通道的堆疊記憶體裝置的系統、方法和裝置。系統、裝置和方法包括：相對於第二組隔離溝槽的位置偏移第一組隔離溝槽的位置；相對於第一組隔離溝槽和第二組隔離溝槽的定向以第一角度形成第一局部位元線；相對於第四組隔離溝槽的位置偏移第三組隔離溝槽的位置；以及相對於第三組隔離溝槽和第四組隔離溝槽的定向以第二角度形成第二局部位元線，第二角度與第一角度不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are systems, methods, and apparatuses for stacked memory device based on a folded bitline and staggered semiconductor channels. The systems, devices, and methods include offsetting a position of a first set of isolation trenches relative to a position of a second set of isolation trenches; forming a first local bitline at a first angle relative to an orientation of the first set of isolation trenches and the second set of isolation trenches; offsetting a position of a third set of isolation trenches relative to a position of a fourth set of isolation trenches; and forming a second local bitline at a second angle relative to an orientation of the third set of isolation trenches and the fourth set of isolation trenches, the second angle being different from the first angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:架構</p>  
        <p type="p">105:基板</p>  
        <p type="p">110,115,SA:感測放大器</p>  
        <p type="p">120,125,130,135:隔離溝槽</p>  
        <p type="p">140,145,LBL:局部位元線</p>  
        <p type="p">150,155:連接器</p>  
        <p type="p">160,165,170,175,GBL:全域位元線</p>  
        <p type="p">CC0:第一連接器</p>  
        <p type="p">CC1:第二連接器</p>  
        <p type="p">CDTI:電容式深溝槽隔離</p>  
        <p type="p">CM1:第一全域位元線</p>  
        <p type="p">CM2:第二全域位元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1809" publication-number="202621419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置、及基板處理裝置之控制方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING DEVICE AND CONTROL METHOD OF SUBSTRATE PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="200601120260223B">G05D7/00</further-classification>  
        <further-classification edition="200601120260223B">G05D16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆田崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUTA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井泰彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, YASUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関優介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西野陽祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHINO, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>枝光建治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDAMITSU, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明使供給至腔室之溶劑蒸氣之溶劑之濃度穩定。基板處理裝置所具備之控制器執行：氣體供給處理，其基於由對蒸氣產生貯槽內之壓力進行測定之壓力感測器測定出之壓力控制壓力控制調節器，藉此調整經由第1惰性氣體供給管供給至貯存有溶劑之蒸氣產生貯槽之惰性氣體之流量，於由上述壓力感測器測定出之壓力成為目標值之情形時，停止上述惰性氣體之供給；及蒸氣供給處理，其於停止上述惰性氣體之供給後，自蒸氣產生貯槽經由氣體供給管向腔室供給上述溶劑蒸氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腔室</p>  
        <p type="p">30:蒸氣產生貯槽</p>  
        <p type="p">31:氣體供給管(第1供給管)</p>  
        <p type="p">32:真空計</p>  
        <p type="p">35:貯槽排氣管</p>  
        <p type="p">50:溶劑供給部</p>  
        <p type="p">51:溶劑供給管(第3供給管)</p>  
        <p type="p">60:惰性氣體供給部</p>  
        <p type="p">61:第1惰性氣體供給管(第2供給管)</p>  
        <p type="p">62:壓力控制調節器(調節器)</p>  
        <p type="p">74:開關閥</p>  
        <p type="p">75:開關閥</p>  
        <p type="p">76:開關閥</p>  
        <p type="p">77:開關閥</p>  
        <p type="p">85:加熱器</p>  
        <p type="p">351:第1排氣口</p>  
        <p type="p">352:第2排氣口</p>  
        <p type="p">S11~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1810" publication-number="202620567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掃地機器人的控制方法、裝置、掃地機器人和儲存媒體</chinese-title>  
        <english-title>METHOD AND DEVICE FOR CONTROLLING A ROBOTIC VACUUM CLEANER, ROBOTIC VACUUM CLEANER, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260121B">G05D1/241</main-classification>  
        <further-classification edition="202401120260121B">G05D1/246</further-classification>  
        <further-classification edition="202401120260121B">G05D1/648</further-classification>  
        <further-classification edition="202401120260121B">G05D1/43</further-classification>  
        <further-classification edition="200601120260121B">A47L11/40</further-classification>  
        <further-classification edition="200601120260121B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宝玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BAOYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹丽娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, LINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露實施例適用於智慧家居技術領域，提供了一種掃地機器人的控制方法、裝置、掃地機器人和儲存媒體，該方法包括：通過掃地機器人的測距感測器採集當前方向下的環境點雲資料；根據環境點雲資料和掃地機器人當前已建地圖塊，確定環境點雲資料交集資訊；根據環境點雲資料交集資訊，控制掃地機器人執行預設動作，以採集多個方向的環境點雲資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to the field of smart home technology and provides method and device for controlling a robotic vacuum cleaner, a robotic vacuum cleaner, and a storage medium. The method includes: collecting environmental point cloud data in current direction via a distance sensor of the robotic vacuum cleaner; determining overlapping information of the environmental point cloud data based on the environmental point cloud data and the currently constructed map blocks of the robotic vacuum cleaner; and controlling the robotic vacuum cleaner to execute a preset action based on the overlapping information of the environmental point cloud data to collect environmental point cloud data in multiple directions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p>  
        <p type="p">S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1811" publication-number="202621342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜電晶體基板及使用其之顯示裝置</chinese-title>  
        <english-title>THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251117B">H10K59/123</main-classification>  
        <further-classification edition="202301120251117B">H10K59/121</further-classification>  
        <further-classification edition="201601120251117B">G09G3/3208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李道炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DOHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白朱爀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAECK, JUHEYUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁嘉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, GAWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種薄膜電晶體基板，其包含：基板；位於基板上之主動層；與主動層重疊之閘極電極；電性連接至該閘極電極且於平面視角中在閘極電極之一側與主動層重疊之第一子閘極電極；及電性連接至閘極電極且於平面視角中在閘極電極之另一側與主動層重疊之第二子閘極電極。此外，閘極電極之一側於平面視角中與閘極電極之另一側相對，且第一子閘極電極、第二子閘極電極與主動層間隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thin film transistor substrate including a substrate; an active layer on the substrate; a gate electrode overlapping the active layer; a first sub gate electrode electrically connected to the gate electrode and overlapping the active layer at one side of the gate electrode in plain view; and a second sub gate electrode electrically connected to the gate electrode and overlapping the active layer at an other side of the gate electrode in plan view. Further, the one side of the gate electrode opposed the other side opposing the one side of the gate electrode in plan view, and the first sub gate electrode and the second sub gate electrode are spaced apart from the active layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:閘極電極</p>  
        <p type="p">141:第一部分</p>  
        <p type="p">143:第二部分</p>  
        <p type="p">145:第三部分</p>  
        <p type="p">161:源極電極</p>  
        <p type="p">163:汲極電極</p>  
        <p type="p">240:第一子閘極電極</p>  
        <p type="p">241:1-1子閘極電極</p>  
        <p type="p">243:1-2子閘極電極</p>  
        <p type="p">343:2-2子閘極電極</p>  
        <p type="p">343a:2-2延伸部分</p>  
        <p type="p">343b:2-2電極部分</p>  
        <p type="p">CH1:第一接觸孔</p>  
        <p type="p">CH2:第二接觸孔</p>  
        <p type="p">d1:第一距離</p>  
        <p type="p">d2:第二距離</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">L2:第二長度</p>  
        <p type="p">W1:第一寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1812" publication-number="202620057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於環糊精之金屬有機骨架及其中疏水性吸附質之摻入</chinese-title>  
        <english-title>CYCLODEXTRIN-BASED METAL-ORGANIC FRAMEWORKS AND INCORPORATION OF HYDROPHOBIC ADSORBATES THEREIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08B37/16</main-classification>  
        <further-classification edition="200601120260202B">A61K8/35</further-classification>  
        <further-classification edition="200601120260202B">A61K8/37</further-classification>  
        <further-classification edition="200601120260202B">A61K8/34</further-classification>  
        <further-classification edition="200601120260202B">A61K8/02</further-classification>  
        <further-classification edition="200601120260202B">A61Q17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＬＣ管理公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELC MANAGEMENT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納亞拉塞里　納拉亞南　阿達什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAYARASSERY-NARAYANAN, ADARSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗里特　馬利歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WRIEDT, MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　斯內哈爾Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, SNEHAL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多伊納　約翰羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOINA, JOHN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可製備金屬有機骨架(MOF)以在其中含有高負載之一或多種疏水性吸附質。合適的金屬有機骨架可展現疏水性吸附質在該MOF之孔空間內的穩定保留，諸如至少20%的MOF負載在24小時內無明顯的環境浸出。相較於各別遊離疏水性吸附質，某些疏水性吸附質可展現非預期的更高的光穩定性及UV吸收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Metal-organic frameworks (MOFs) may be prepared to contain a high loading of one or more hydrophobic adsorbates therein. Suitable metal-organic frameworks may exhibit stable retention of hydrophobic adsorbates within the pore space of the MOF, such as MOF loadings of at least 20% without appreciable environmental leaching over 24 hours. Certain hydrophobic adsorbates may exhibit unexpectedly higher photostability and UV absorption as compared to the respective free hydrophobic adsorbates.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1813" publication-number="202619961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造ＭＥＭＳ構件的方法及ＭＥＭＳ構件</chinese-title>  
        <english-title>METHOD OF PRODUCING A MEMS COMPONENT AND MEMS COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B81C1/00</main-classification>  
        <further-classification edition="200601120260223B">B81B7/02</further-classification>  
        <further-classification edition="202601120260223B">H10P72/50</further-classification>  
        <further-classification edition="201401120260223B">G01N21/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬恩　安德列斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史官克　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWENK, CHRISTOF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種製造MEMS構件（1）的方法，該MEMS構件具有層堆疊（10），該層堆疊由在Z方向（Z）堆疊的層（12、13、14、15、16）組成，其中該層堆疊（10）的層（12、13、14、15、16）依序沉積在基板（11）上，並具體藉由微影術以相對於參考平面的界定對齊進行結構化以給出層結構（122、132、142、152）， &lt;br/&gt;其中該層堆疊（10）的下層（12）具有相對於該參考平面處以界定對齊的至少一個下對齊標記（121）。為了判定該層堆疊（10）相對於該參考平面的對齊，藉由偵測紅外光譜區（IR）中的電磁輻射，具體藉由偵測紅外對比度來偵測該下對齊標記（121）。為相對於該參考平面處以界定對齊的上層（16）提供表面結構化（20），其中該上層的該表面結構化（20）具有相對於該參考平面處以界定對齊的至少一個上對齊標記（321）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method of producing a MEMS component （1） having a layer stack （10） composed of layers （12, 13, 14, 15, 16） stacked in a Z direction （Z）, wherein layers （12, 13, 14, 15, 16） of the layer stack （10） are deposited successively on a substrate （11） and structured, in particular by lithography, in defined alignment to a reference plane to give layer structures （122, 132, 142, 152）, &lt;br/&gt;wherein a lower layer （12） of the layer stack （10） has at least one lower alignment mark （121） in defined alignment to the reference plane. The lower alignment mark （121）, in order to determine the alignment of the layer stack （10） with respect to the reference plane, is detected by detection of electromagnetic radiation in the infrared spectral region （IR）, in particular by detection of an infrared contrast. An upper layer （16） in defined alignment to the reference plane is provided with surface structuring （20）, where the surface structuring （20） of the upper layer has at least one upper alignment mark （321） in defined alignment to the reference plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:層堆疊</p>  
        <p type="p">11:基板</p>  
        <p type="p">12,120,13,14,15,16:層</p>  
        <p type="p">121:下對齊標記</p>  
        <p type="p">122:層結構</p>  
        <p type="p">221:對齊結構</p>  
        <p type="p">321:上對齊標記</p>  
        <p type="p">S1,S2,S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1814" publication-number="202620610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控驅動電路及顯示裝置</chinese-title>  
        <english-title>TOUCH DRIVING CIRCUIT AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260113B">G06F3/041</main-classification>  
        <further-classification edition="200601120260113B">G09G3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LX SEMICON CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南正權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, JEONG KWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鉦桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宰煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種根據本說明書實施例之觸控驅動電路，配置為：產生與用於初始化內部感測電路之重置訊號同步之第一觸控驅動訊號，調整第一觸控驅動訊號之相位以產生第二觸控驅動訊號，第二觸控驅動訊號經由多條傳輸線被傳輸至觸控面板之多個觸控驅動電極，進而第三觸控驅動訊號被供應至該些觸控驅動電極之每一者，以及基於第三觸控驅動訊號執行觸控感測。觸控面板中離觸控驅動電路最遠之點處之觸控效能可改善，從而增強整體觸控效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch driving circuit according to an embodiment of the present specification is configured to generate a reset signal for initializing an internal sensing circuit and a first touch driving signal synchronized with the reset signal, adjust a phase of the first touch driving signal to generate a second touch driving signal, transfer the second touch driving signal via transmission lines to a plurality of touch driving electrodes of a touch panel to supply a third touch driving signal to each of the plurality of touch driving electrodes, and perform touch sensing on the basis of the third touch driving signal. Touch performance at a point farthest from the touch driving circuit in the touch panel can be improved, thereby enhancing overall touch performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">IO_TX:觸控驅動訊號</p>  
        <p type="p">ref:上升緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1815" publication-number="202621084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通訊方法及裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04L25/02</main-classification>  
        <further-classification edition="200601120260102B">H04L1/00</further-classification>  
        <further-classification edition="201501120260102B">H04B17/309</further-classification>  
        <further-classification edition="202301120260102B">H04W72/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鋭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王碧釵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BICHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周永行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王四海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通訊方法及裝置，該方法包括：終端取得第一資料單元的特徵，根據第一資料單元的特徵決定第一CQI索引，其中，第一資料單元的特徵包括第一資料單元的重要性等級或第一資料單元的服務類型，終端發送第一資訊，第一資訊指示第一CQI索引，接收第二資訊，第二資訊指示第一MCS索引，第一MCS索引與第一CQI索引關聯。採用上述方法，透過結合資料單元的特徵決定相應的CQI，以及獲得與該CQI索引關聯的MCS索引，能夠實現結合資料單元的特徵執行訊源通道聯合編碼，從而可以提升傳輸效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">When the source satisfies the condition of progressive entropy separation, separate source coding and channel coding can achieve optimal performance. For example, in image or video compression, such as formats like H.265/H.264, the source code and channel code can be designed independently. However, when the source is biased or has memory, the channel encoder and decoder can exploit the redundancy information in the source code to reduce the overall error rate and gain performance improvements. In these cases, separate source coding and channel coding cannot achieve optimal performance; instead, joint source-channel coding is required to better enhance performance. In scenarios involving joint source-channel coding, how to effectively improve transmission performance is an important issue worth addressing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300~340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1816" publication-number="202620115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂組成物、硬化物、半導體密封材、半導體裝置、印刷配線板用絕緣材料及印刷配線板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08K5/053</main-classification>  
        <further-classification edition="200601120251216B">C08K3/36</further-classification>  
        <further-classification edition="200601120251216B">C08L63/04</further-classification>  
        <further-classification edition="200601120251216B">C08L79/08</further-classification>  
        <further-classification edition="200601120251216B">C08G59/18</further-classification>  
        <further-classification edition="200601120251216B">C08F8/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二宮淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINOMIYA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桝本雅也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUMOTO, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪広治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示所欲解決之課題在於提供一種能夠使線熱膨脹係數及彈性模數下降的熱硬化性樹脂組成物。本揭示提供一種熱硬化性樹脂組成物，其包含熱硬化性樹脂（A）、酸酐（B）、化合物（C）、以及選自由無機微粒子及纖維所組成的群組中的一種以上的填充劑（D），所述化合物（C）為選自由封端聚酯寡聚物、封端聚醚寡聚物、及封端聚醚酯寡聚物所組成的群組中的一種或兩種以上。另外，本揭示提供一種所述熱硬化性樹脂組成物的硬化物、以及包含所述熱硬化性樹脂組成物的半導體密封材、半導體裝置、印刷配線板用絕緣材料及印刷配線板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1817" publication-number="202620031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物及使用所述組成物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">C07D207/34</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/32</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y30/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜錫一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUKIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種半導體光阻組成物和使用其形成或提供圖案的方法，所述半導體光阻組成物包括有機金屬化合物、包括吡咯、吡咯衍生物或其組合的吡咯類化合物、以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming or providing patterns using the same, the semiconductor photoresist composition including an organometallic compound, a pyrrole-based compound including pyrrole, a pyrrole derivative, or a combination thereof; and a solvent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102:薄膜</p>  
        <p type="p">104:抗蝕劑底層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1818" publication-number="202620173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、液晶組成物及液晶顯示元件</chinese-title>  
        <english-title>COMPOUND, LIQUID CRYSTAL COMPOSITION AND LIQUID CRYSTAL DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K19/34</main-classification>  
        <further-classification edition="200601120251201B">C09K19/42</further-classification>  
        <further-classification edition="200601120251201B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇和成顯示科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HECHENG DISPLAY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野智廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種充分滿足對於熱或光的高的穩定性、高的透明點（或向列相的高的上限溫度）、向列相的低的下限溫度、小的黏度、適當的光學各向異性、正或負且大的介電各向異性、適當的彈性常數、與其他液晶性化合物的良好的相容性等物性的至少一個。一種化合物，由式（1）表示。&lt;br/&gt;&lt;img align="absmiddle" height="104px" width="335px" file="ed10080.JPG" alt="ed10080.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 此處，例如，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;為碳數1至20的烷基，環A&lt;sup&gt;1&lt;/sup&gt;為1,4-伸環己基、1,4-伸環己烯基或1,4-伸苯基，Z&lt;sup&gt;1&lt;/sup&gt;為單鍵、-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;-、-CH&lt;sub&gt;2&lt;/sub&gt;O-或-OCH&lt;sub&gt;2&lt;/sub&gt;-，a為0、1、2或3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a liquid crystal compound that satisfies at least one of the following properties: high stability against heat and light, high clearing point (or high upper limit temperature of the nematic phase), low lower limit temperature of the nematic phase, low viscosity, appropriate optical anisotropy, large positive or negative dielectric anisotropy, appropriate elastic constant, and good compatibility with other liquid crystal compounds. The compound represented by formula (1).&lt;br/&gt;&lt;img align="absmiddle" height="102px" width="321px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt; Here, for example, R&lt;sup&gt;1&lt;/sup&gt; and R&lt;sup&gt;2&lt;/sup&gt; are alkyl groups having 1 to 20 carbon atoms; ring A&lt;sup&gt;1&lt;/sup&gt; is 1,4-cyclohexylene, 1,4-cyclohexenylene, or 1,4-phenylene; Z&lt;sup&gt;1&lt;/sup&gt; is a single bond, -(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;-, -CH&lt;sub&gt;2&lt;/sub&gt;O-, or -OCH&lt;sub&gt;2&lt;/sub&gt;-; and a is 0, 1, 2, or 3.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1819" publication-number="202620032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物及使用所述組成物形成圖案的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/22</main-classification>  
        <further-classification edition="200601120260223B">C07C205/15</further-classification>  
        <further-classification edition="200601120260223B">C07C205/22</further-classification>  
        <further-classification edition="200601120260223B">C07D215/28</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="200601120260223B">G03F7/40</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y30/00</further-classification>  
        <further-classification edition="201101120260223B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旻映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慶雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KYOUNGAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜恩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, EUNMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐也隱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YAEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹厚淨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昇淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, SEONGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜錫一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUKIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了一種半導體光阻組成物及使用其形成圖案的方法，所述半導體光阻組成物包括有機金屬化合物、包括至少一個硝基和至少一個羥基的化合物以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming patterns using the same, the semiconductor photoresist composition including an organometallic compound, a compound including at least one nitro group and at least one hydroxyl group, and a solvent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102:薄膜</p>  
        <p type="p">104:抗蝕劑底層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1820" publication-number="202621493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有側邊緣互連和液體冷卻結構的高頻寬記憶體堆疊</chinese-title>  
        <english-title>HIGH-BANDWIDTH MEMORY STACK WITH SIDE EDGE INTERCONNECTION AND LIQUID COOLING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W40/47</main-classification>  
        <further-classification edition="202601120260223B">H10W40/22</further-classification>  
        <further-classification edition="202601120260223B">H10B80/00</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝結構包含一記憶體堆疊、一基板、一處理器晶片與一液體冷卻結構。所述記憶體堆疊包含彼此水平分隔的複數個半導體晶片，其中各半導體晶片具有頂部表面、底部表面、以及四個側壁，其中第二側壁與第一側壁相對。複數個邊緣接墊係配置在各半導體晶片的第一側壁上。基板是在記憶體堆疊下方且電連接至各所述半導體晶片的所述複數個邊緣接墊。處理器晶片是在基板上方且與記憶體堆疊相鄰。液體冷卻結構是在記憶體堆疊與處理器晶片上方，且係經由各所述半導體晶片的第二側壁與處理器晶片的頂部表面熱耦接至記憶體堆疊與處理器晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package structure includes a memory stack, a substrate, a processor die, and a liquid cooling structure. The memory stack includes a plurality of semiconductor dies horizontally separate with each other, wherein each semiconductor die has a top surface, a bottom surface, and four sidewalls, wherein the second sidewall is opposite to the first sidewall. A plurality of edge pads are arranged on the first sidewall of each semiconductor die. The substrate is under the memory stack and electrically connected to the plurality of edge pads of each of the semiconductor dies. The processor die is over the substrate and adjacent to the memory stack. The liquid cooling structure is over the memory stack and the processor die, and thermally coupled to both the memory stack and the processor die via the second sidewall of each of the semiconductor dies and the top surface of the processor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:半導體封裝結構</p>  
        <p type="p">50:記憶體堆疊</p>  
        <p type="p">51:第一基板</p>  
        <p type="p">52:中介層</p>  
        <p type="p">53:處理器晶片</p>  
        <p type="p">53S1:頂部表面</p>  
        <p type="p">53S2,551S1:底部表面</p>  
        <p type="p">54:第一散熱器</p>  
        <p type="p">54S1,54S2,552S1,552S2:表面</p>  
        <p type="p">55:液體冷卻結構</p>  
        <p type="p">56:模製材料</p>  
        <p type="p">57,503:TIM層</p>  
        <p type="p">59:第二基板</p>  
        <p type="p">501:半導體晶片</p>  
        <p type="p">501S1,501S2:側壁</p>  
        <p type="p">502:黏合層</p>  
        <p type="p">504:邊緣接墊</p>  
        <p type="p">506:導電凸塊</p>  
        <p type="p">507:記憶體控制器晶片</p>  
        <p type="p">512,522:凸塊</p>  
        <p type="p">521:導電貫孔</p>  
        <p type="p">541:鰭片</p>  
        <p type="p">541’:突起</p>  
        <p type="p">541”:HTC片</p>  
        <p type="p">542,542”:溝槽</p>  
        <p type="p">551:遮蓋</p>  
        <p type="p">552:第二散熱器</p>  
        <p type="p">553:腔室</p>  
        <p type="p">554:流入口</p>  
        <p type="p">555:流出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1821" publication-number="202620879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體編程控制電路</chinese-title>  
        <english-title>MEMORY PROGRAM CONTROL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260108B">G11C16/10</main-classification>  
        <further-classification edition="200601120260108B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭任佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體編程控制電路包括主計數器、N個暫存器、N個D型正反器、更新控制單元、群組計數器和寫入控制單元。主計數器根據時脈信號增加主計數器值。N個暫存器儲存待寫入記憶體的N個位元。更新控制單元隨主計數器值增加，用儲存在N個暫存器中的資料依序更新N個D型正反器，且當DFF被更新時，寫入緩衝區會透過儲存在對應的D型正反器中的位元進行更新。每次以第一類型位元更新D型正反器時，群組計數器會增加群組計數器值，且當群組計數器值達到M時，會產生群組寫入啟用信號，從而使寫入控制單元對記憶體執行群組寫入操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory program control circuit includes a main counter, N registers, N DFFs, an update control unit, a group counter, and a write control unit. The main counter increments a main counter value according to a clock signal. The N registers store N bits to be written into a memory. The update control unit updates the N DFFs with the data stored in the N registers sequentially as the main counter value increments, and a write buffer is updated by a bit stored in a corresponding DFF as the DFF is updated. The group counter increments a group counter value each time a DFF is updated with a bit of a first type, and generates a group write enable signal when the group counter value reaches M, thereby having the write control unit perform a group write operation upon the memory.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:寫入控制單元</p>  
        <p type="p">200:記憶體編程控制電路</p>  
        <p type="p">210:主控制單元</p>  
        <p type="p">220:主計數器</p>  
        <p type="p">230_1至230_N:暫存器</p>  
        <p type="p">240_1至240_N:D型正反器(DEF)</p>  
        <p type="p">250:更新控制單元</p>  
        <p type="p">252_1至252_N:開關</p>  
        <p type="p">254:解碼器</p>  
        <p type="p">260:群組計數器</p>  
        <p type="p">270:OR閘</p>  
        <p type="p">CK1:時脈信號</p>  
        <p type="p">CT_1至CT_N:控制信號</p>  
        <p type="p">DIN:輸入資料</p>  
        <p type="p">D_1~D_N:位元</p>  
        <p type="p">EG1,EG2:群組寫入啟用信號</p>  
        <p type="p">ENGW:群組寫入啟用信號</p>  
        <p type="p">ENPM:通知信號</p>  
        <p type="p">NC1:共用節點</p>  
        <p type="p">VG1:群組計數器值</p>  
        <p type="p">VM1:主計數器值</p>  
        <p type="p">RT1,RT2:重置信號</p>  
        <p type="p">WB_1至WB_N:寫入緩衝區</p>  
        <p type="p">WOK:寫入作業完成信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1822" publication-number="202619675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>STATION FOR ROBOT CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A47L11/40</main-classification>  
        <further-classification edition="200601120260223B">A47L11/24</further-classification>  
        <further-classification edition="200601120260223B">A47L9/28</further-classification>  
        <further-classification edition="200601120260223B">D06F29/00</further-classification>  
        <further-classification edition="202601120260223B">F26B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁仁圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, INGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛鎭赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JINHYOUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, DAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清掃機器人工作站，包括殼體；容納空間，設置在殼體內，並配置以容納清掃機器人的至少一部分；以及集塵單元，配置以將灰塵從清掃機器人中清空，並且集塵單元可以包含：集塵單元殼體，來自清掃機器人的集塵箱的灰塵流入該集塵單元殼體中；以及集塵消毒模組，配置以對集塵單元殼體內部進行消毒，使得其具有對集塵單元殼體和集塵袋進行消毒的效果，從而防止細菌生長和惡臭產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is disclosed a robot cleaner station including a housing; a accommodating space disposed within the housing and configured to accommodating at least a portion of the robot cleaner; and a dust collection unit configured to empty dust from the robot cleaner, and the dust collection unit may include a dust collection unit housing into which dust from a dust bin of a robot cleaner flows; and a dust collection unit sterilization module configured to sterilize the inside of the dust collection unit housing, so that it has the effect of sterilizing the dust collection unit housing and dust bag, thereby preventing bacterial growth and the generation of bad odors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清掃機器人系統</p>  
        <p type="p">100:清掃機器人工作站</p>  
        <p type="p">110:殼體</p>  
        <p type="p">111:外壁</p>  
        <p type="p">140:集塵單元</p>  
        <p type="p">145:集塵馬達</p>  
        <p type="p">147:第一集塵路徑</p>  
        <p type="p">160:拖布清洗單元</p>  
        <p type="p">170:拖布烘乾單元</p>  
        <p type="p">200:清掃機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1823" publication-number="202620341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷媒循環裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251121B">F25B41/40</main-classification>  
        <further-classification edition="200601120251121B">F28F9/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水池宏友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUIKE, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡慶次鋭彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKESHI, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱野晋佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMANO, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤禎晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立花裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之冷媒循環裝置具備熱交換器、殼體、一次流路、及二次流路。上述殼體收納上述熱交換器。上述一次流路供一次冷媒從上述殼體中之一次冷媒之流入口經由上述熱交換器向上述殼體中之一次冷媒之流出口流動。上述二次流路供二次冷媒從上述殼體中之二次冷媒之流入口經由上述熱交換器向上述殼體中之二次冷媒之流出口流動。上述熱交換器之第一方向之一側及上述第一方向之另一側之側面均具有一次冷媒之流入部及流出部以及上述二次冷媒之流入部及流出部中的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:熱交換器</p>  
        <p type="p">3:殼體</p>  
        <p type="p">4:一次流路</p>  
        <p type="p">5:二次流路</p>  
        <p type="p">6:電磁閥</p>  
        <p type="p">7a:第一泵</p>  
        <p type="p">7b:第二泵</p>  
        <p type="p">7c:第三泵</p>  
        <p type="p">10:冷媒循環裝置</p>  
        <p type="p">11:流量感測器</p>  
        <p type="p">14:顯示操作部</p>  
        <p type="p">41:流入口</p>  
        <p type="p">51:流入口</p>  
        <p type="p">53:流入部</p>  
        <p type="p">54:流出部</p>  
        <p type="p">81:分配歧管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1824" publication-number="202620253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提拉矽的單晶的方法</chinese-title>  
        <english-title>METHOD FOR PULLING A SINGLE CRYSTAL OF SILICON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C30B15/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商世創電子材料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILTRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多納　艾莉西亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DORNER, ALICIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克內爾　迪特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNERER, DIETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯科洛巴奈克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKROBANEK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔克米爾　路德英格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOCKMEIER, LUDWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據柴可斯基技術提拉矽的單晶的方法，包含提拉籽晶以形成細頸，其中，在提拉細頸的部分期間，提拉速度週期性地改變不少於5個週期且不多於30個週期，使得在一個週期中細頸的直徑在每種情況下從起始值開始首先線性上升，最後保持恆定，然後再次線性減小到起始值（見圖1）；在每個週期中，該細頸的直徑線性減小部位的軸向長度（L2）是該細頸的直徑線性增大部位的軸向長度（L1）至少三倍；並且在提拉中提拉速度週期性地改變細頸部分的期間，坩堝和晶種沿相同的方向旋轉，且坩堝旋轉速度和晶種旋轉速度彼此獨立地不小於0.5且不大於15轉／分鐘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for pulling a single crystal of silicon in accordance with the Czochralski technique, comprising the pulling of a seed crystal to form a thin neck, wherein, during the pulling of a part of the thin neck, the pulling velocity is altered periodically for not fewer than 5 periods and not more than 30 periods such that the diameter of the thin neck in one period, proceeding in each case from a starting value, first rises linearly, lastly is kept constant, and then decreases again linearly to the starting value (see Fig. 1); in each period, the axial length of the portion of the thin neck in which the diameter decreases linearly (L2) is at least three times the axial length of the portion of the thin neck in which the diameter rises linearly (L1); and, during the pulling of the part of the thin neck in which the pulling velocity is altered periodically, the crucible and the seed crystal rotate in the same direction and the rotational velocities of the crucible and the rotational velocities of the seed crystal independently of one another are not less than 0.5 and not more than 15 revolutions per minute.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D1:最小直徑</p>  
        <p type="p">D2:最大直徑</p>  
        <p type="p">L1、L2、L3:軸向長度</p>  
        <p type="p">R1、R2:旋轉速度</p>  
        <p type="p">L:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1825" publication-number="202620571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降方法、裝置、移動機器人及儲存介質</chinese-title>  
        <english-title>LIFTING METHOD, LIFTING APPARATUS, MOBILE ROBOT, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260102B">G05D1/628</main-classification>  
        <further-classification edition="200601120260102B">G01S17/08</further-classification>  
        <further-classification edition="202401120260102B">G05D1/648</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭明理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, MINGLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開實施例公開了一種升降方法，基於移動機器人在第一位置處，通過控制可升降器件的旋轉從而可以採集到障礙物返回的第一點雲數據，再利用第一點雲數據確定出第一點雲數據的投影位置是否屬於低矮區域，由於移動機器人在第一位置處可以採集到第一點雲數據，從而使得移動機器人在第一位置處可以提前確定出其他位置是否為低矮區域，進而能夠及時地更新地圖中的低矮區域，那麼，移動機器人在離開或進入低矮區域時可以控制可升降器件的升或者降，以順利通過低矮區域，提高了移動機器人的工作效率。本公開實施例還公開了一種升降裝置、移動機器人及儲存介質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure disclose a lifting method. The method includes: based on a mobile robot being at a first position, the first point cloud data returned by an obstacle can be collected by controlling rotation of a lifting unit, and whether a projection position of the first point cloud data belongs to a low area is then determined by using the first point cloud data. Since the mobile robot can collect the first point cloud data at the first position, the mobile robot is allowed to determine in advance whether other positions are low areas at the first position, so that the low areas in the map can be updated in a timely manner. Therefore, the lifting unit can be controlled to lift or lower when the mobile robot leaves or enters the low area, to smoothly pass through the low area and improve the work efficiency of the mobile robot. Embodiments of the present disclosure also disclose a lifting apparatus, a mobile robot, and a storage medium.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201:在移動機器人在第一位置的情況下，控制可升降器件旋轉</p>  
        <p type="p">S202:通過可升降器件，採集在旋轉過程中形成的障礙物返回的第一點雲數據</p>  
        <p type="p">S203:基於第一點雲數據，確定第一點雲數據的投影位置是否屬於第一區域</p>  
        <p type="p">S204:在移動機器人離開或進入第一區域的情況下，升或降可升降器件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1826" publication-number="202620973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡緣連接器</chinese-title>  
        <english-title>CARD EDGE CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260115B">H01R12/72</main-classification>  
        <further-classification edition="200601120260115B">H01R13/40</further-classification>  
        <further-classification edition="200601120260115B">H01R13/42</further-classification>  
        <further-classification edition="200601120260115B">H01R13/46</further-classification>  
        <further-classification edition="200601120260115B">H01R13/639</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮明議</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, MING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卜學武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, XUE-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印小虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIAO-HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種卡緣連接器，供一電子卡插入，包括左右延伸的縱長連接器本體、耳扣及解扣機構；連接器本體包括兩相對側壁、於兩側壁之間向上貫穿的卡槽及排列於卡槽兩側的導電端子；耳扣安裝於連接器本體的右端，解扣機構包括一移動件及一對解扣板，解扣板各設置於側壁，移動件橫跨卡槽且連接解扣板；解扣板的左端一體延伸有第一彈片，解扣板的右端連接耳扣；電子卡插入卡槽時，電子卡抵壓移動件以帶動解扣板左移而使第一彈片彈性形變；電子卡解除對移動件的抵壓，第一彈片恢復形變而帶動移動件右移復位，並帶動耳扣解扣；第一彈片與解扣板共面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A card edge connector for receiving an electronic card includes an elongated housing extending in a left-right direction, an ejector, and a release mechanism. The housing includes two opposite side walls, a card slot opening upwardly between the two side walls, and a plurality of conductive terminals arranged along both sides of the card slot. The ejector is installed at a right end of the housing. The release mechanism includes a moving member and a pair of release plates. The release plates are respectively disposed on the side walls. The moving member transversely spans the card slot and is connected to the release plates. A first elastic piece is integrally extended from a left end of each release plate, and a right end of each release plate is connected to the ejector. Upon insertion of the electronic card into the card slot, the electronic card presses against the moving member, thereby driving the release plates to move forward and causing the first elastic pieces to elastically deform. When the moving member is released from the electronic car, the first elastic pieces restore and drive the moving member to move rightward to a reset position, thereby actuating the ejector to release. The first elastic pieces are coplanar with the respective release plates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:凸塊</p>  
        <p type="p">311:卡接部</p>  
        <p type="p">312:橫杆</p>  
        <p type="p">32:解扣板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1827" publication-number="202619790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>渦流式流體混合器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251231B">B01F31/80</main-classification>  
        <further-classification edition="202201120251231B">B01F35/90</further-classification>  
        <further-classification edition="202201120251231B">B01F25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭有機材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI YUKIZAI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隈元康太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAMOTO, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在渦流式流體混合器中，抑制渦室的外側與內側的混合不均的發生。渦流式流體混合器111包括：渦室25，由沿著渦室中心軸線O延伸的筒形狀的周側壁13、與設在其兩端且彼此相向的第一端壁15及第二端壁17所規定；入口流路19，連接於設於周側壁13的入口開口27；以及出口流路21，連接於設於第二端壁17、或周側壁13上的第二端壁17的鄰接區域的出口開口29。在周側壁13中，在渦室中心軸線O方向上的入口開口27與第二端壁17之間設有朝向渦室中心軸線O突出的突出部31，藉由突出部31而在第一端壁15與第二端壁17之間形成有縮窄部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:周側壁</p>  
        <p type="p">15:第一端壁</p>  
        <p type="p">17:第二端壁</p>  
        <p type="p">19:入口流路</p>  
        <p type="p">21:出口流路</p>  
        <p type="p">23:匯流部</p>  
        <p type="p">23a:主流路</p>  
        <p type="p">23b:副流路</p>  
        <p type="p">25:渦室</p>  
        <p type="p">27:入口開口</p>  
        <p type="p">29:出口開口</p>  
        <p type="p">31:突出部</p>  
        <p type="p">111:渦流式流體混合器</p>  
        <p type="p">O:渦室中心軸線</p>  
        <p type="p">P1:入口流路中心軸線</p>  
        <p type="p">P2:出口流路中心軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1828" publication-number="202620024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機金屬化合物的製備方法</chinese-title>  
        <english-title>PREPARING METHOD OF ORGANOMETALLIC COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07F7/00</main-classification>  
        <further-classification edition="200601120260223B">C23C16/40</further-classification>  
        <further-classification edition="200601120260223B">C23C16/455</further-classification>  
        <further-classification edition="202601120260223B">H10P14/40</further-classification>  
        <further-classification edition="202501120260223B">H10D30/67</further-classification>  
        <further-classification edition="202501120260223B">H10D64/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓松化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOL CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炫炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN-KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴哲完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, CHEOL-WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN-KEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昔壯衒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOK, JANG-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNG-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種高收率的用於氣相沉積前驅物的有機金屬化合物的製備方法，該製備方法包括以下步驟：使包含鹵素元素的化合物與格任亞試劑(Grignard Reagent)反應；及使取代或未取代的芳香環反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1829" publication-number="202619863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人的控制方法、裝置及機器人、設備、介質</chinese-title>  
        <english-title>CONTROL METHOD AND CONTROL DEVICE OF A ROBOT, ROBOT, EQUIPMENT, AND MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251120B">B25J9/18</main-classification>  
        <further-classification edition="200601120251120B">B25J9/22</further-classification>  
        <further-classification edition="200601120251120B">B25J13/00</further-classification>  
        <further-classification edition="200601120251120B">B25J19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例揭露了一種機器人的控制方法、裝置及機器人、設備、介質，在到達機器人的目標任務的執行時間的情況下，首先，獲取該目標任務對應的目標日期類型、以及與該目標日期類型對應的任務執行策略；然後，確定當前日期與該目標日期類型之間的匹配關係；最後，基於該匹配關係和該任務執行策略，控制機器人執行該目標任務。這樣，可以根據目標任務對應的目標日期類型、以及與該目標日期類型對應的任務執行策略，靈活精準地控制機器人執行任務，從而更好地滿足用戶對機器人的任務執行需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application embodiment discloses a robot control method, device, robot, equipment, and medium. When the execution time of the robot's target task is reached, first, the target date type corresponding to the target task and the task execution strategy corresponding to the target date type are obtained; then, the matching relationship between the current date and the target date type is determined; finally, the robot is controlled to execute the target task based on the matching relationship and the task execution strategy. In this way, the robot can be flexibly and accurately controlled to execute tasks according to the target date type corresponding to the target task and the task execution strategy corresponding to the target date type, thereby better meeting the user's needs for the robot's task execution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:響應於到達所述機器人的目標任務的執行時間，獲取所述目標任務的任務配置資訊；所述任務配置資訊包括所述目標任務對應的目標日期類型、以及與所述目標日期類型對應的任務執行策略</p>  
        <p type="p">S102:確定當前日期與所述目標日期類型之間的匹配關係</p>  
        <p type="p">S103:基於所述匹配關係和所述任務執行策略，控制所述機器人執行所述目標任務</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1830" publication-number="202620573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人的控制方法、清潔機器人、裝置、設備及介質</chinese-title>  
        <english-title>CONTROL METHOD FOR CLEANING ROBOT, CLEANING ROBOT, DEVICE, EQUIPMENT, AND MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251128B">G05D1/648</main-classification>  
        <further-classification edition="200601120251128B">A47L11/40</further-classification>  
        <further-classification edition="200601120251128B">A47L11/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例揭露了一種清潔機器人的控制方法、清潔機器人、裝置、設備及介質，清潔機器人包括機身和清潔刷，清潔刷設置在機身朝向作業面的一側，清潔刷通過與作業面發生干涉進行清潔，機身與作業面之間的距離可調節。在控制清潔機器人通過清潔刷對作業面進行清潔的過程中，獲取清潔機器人的作業監測指標，並在清潔機器人的作業監測指標不滿足目標條件的情況下，調節機身與作業面之間的距離以使清潔機器人的作業監測指標滿足目標條件。其中，作業監測指標表徵清潔刷與作業面之間的干涉程度。這樣，可以更加靈活地控制清潔刷與作業面之間的干涉程度，從而能夠更好地滿足當前作業面的清潔需求，提高清潔效率，並能減小能量損耗，提高能耗效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An application embodiment discloses a control method for a cleaning robot, a cleaning robot, a device, equipment, and a medium. The cleaning robot includes a body and a cleaning brush. The cleaning brush is arranged on the side of the body facing the working surface, and performs cleaning by interfering with the working surface. The distance between the body and the working surface is adjustable. During the process of controlling the cleaning robot to clean the working surface via the cleaning brush, the operation monitoring index of the cleaning robot is obtained. When the operation monitoring index of the cleaning robot does not meet the target condition, the distance between the body and the working surface is adjusted to make the operation monitoring index of the cleaning robot meet the target condition. Among them, the operation monitoring index represents the degree of interference between the cleaning brush and the working surface. In this way, the degree of interference between the cleaning brush and the working surface can be controlled more flexibly, thereby better meeting the cleaning needs of the current working surface, improving cleaning efficiency, reducing energy consumption, and enhancing energy efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:控制所述清潔機器人通過所述清潔刷對所述作業面進行清潔</p>  
        <p type="p">S102:在清潔過程中獲取所述清潔機器人的作業監測指標；所述作業監測指標表徵所述清潔刷與所述作業面之間的干涉程度</p>  
        <p type="p">S103:在所述清潔機器人的作業監測指標不滿足目標條件的情況下，調節所述機身與所述作業面之間的距離，以使所述清潔機器人的作業監測指標滿足所述目標條件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1831" publication-number="202620569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動機器人及其重定位方法、裝置、設備、介質及產品</chinese-title>  
        <english-title>MOBILE ROBOT AND ITS RELOCATION METHOD, DEVICE, EQUIPMENT, MEDIUM, AND PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251201B">G05D1/43</main-classification>  
        <further-classification edition="202401120251201B">G05D1/24</further-classification>  
        <further-classification edition="200601120251201B">A47L11/24</further-classification>  
        <further-classification edition="200601120251201B">B25J9/10</further-classification>  
        <further-classification edition="200601120251201B">B25J19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例揭露了一種移動機器人及其重定位方法、裝置、設備、介質及產品，首先，獲取移動機器人當前所在的初始位置的上方環境資訊，然後，在初始位置的上方環境資訊滿足預設的非低矮區域特徵的情況下，控制移動機器人從初始位置開始進行移動重定位。這樣，基於移動機器人當前所在的初始位置的上方環境資訊，使移動機器人在初始位置位於非低矮區域的情況下開始進行移動重定位，可以降低周圍環境對移動機器人探測範圍的影響，減少在低矮區域下進行探測的時間，提高移動機器人的定位效率和效果，節省運行資源，進一步提高移動機器人的使用性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An application embodiment discloses a mobile robot, as well as its relocation method, device, equipment, medium, and product. First, the environmental information above the initial position where the mobile robot is currently located is acquired. Then, when the environmental information above the initial position satisfies a preset non-low-height area feature, the mobile robot is controlled to initiate mobile relocation starting from the initial position. In this way, by leveraging the environmental information above the initial position where the mobile robot is currently located, the robot begins mobile relocation when the initial position is in a non-low-height area. This approach reduces the impact of the surrounding environment on the mobile robot's detection range, shortens the time required for detection in low-height areas, improves the efficiency and effectiveness of the mobile robot's positioning, conserves operational resources, and further enhances the performance of the mobile robot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:獲取所述移動機器人當前所在的初始位置的上方環境資訊</p>  
        <p type="p">S102:在所述初始位置的上方環境資訊滿足預設的非低矮區域特徵的情況下，控制所述移動機器人從所述初始位置開始進行移動重定位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1832" publication-number="202621211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種元器件埋嵌封裝單元在PCB中的應用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251119B">H05K3/36</main-classification>  
        <further-classification edition="200601120251119B">H05K3/42</further-classification>  
        <further-classification edition="200601120251119B">H05K3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山滬利微電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUS PRINTED CIRCUIT KEPZ (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔德池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, DECHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余丞博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHENG PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種元器件埋嵌封裝單元在PCB中的應用方法，屬於印刷電路板技術領域，所述方法包括按設計要求對第二PCB基板進行加工，生成撈槽，其中生成撈槽後的第二PCB基板表面具有第二銅層；將元器件埋嵌封裝單元垂直埋嵌所述撈槽內；在第二銅層表面依次鋪設半固化片和銅箔，進行壓合，並在元器件的引腳位置加工對外導通的鐳射孔，對鐳射孔進行電鍍鍍銅，以實現PCB中的電路導通，本發明通過將元器件埋嵌封裝單元集成封裝成小單元再嵌入其他不同PCB中，這種應用的方式具有靈活性；且垂直埋嵌和傳統水準結構相比能減少平面佔用空間，增大通流密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:元器件埋嵌封裝單元</p>  
        <p type="p">11:引腳上下方金屬化孔</p>  
        <p type="p">12:第二PCB基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1833" publication-number="202619806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>被清洗物的清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B08B3/10</main-classification>  
        <further-classification edition="200601120260223B">B08B3/08</further-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification>  
        <further-classification edition="202601120260223B">H05K3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商瑞顧斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生田勝治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUTA, KATSUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡元浩幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田幸之助</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, KOUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俣野太飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATANO, TAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供清洗液的組成或量穩定並可穩定進行清洗之被清洗物的清洗方法。其係進行1次或重複進行2次以上「使被清洗物接觸至清洗液的清洗液接觸工序」與「將前述清洗液去除的清洗液去除工序」之使用清洗液清洗附著有焊劑殘渣之被清洗物的被清洗物的清洗方法，前述清洗液接觸工序具有在前述清洗液接觸至前述被清洗物之狀態下將氣體環境壓力減壓至成為4.0 kPa～26.3 kPa的減壓工序，在前述減壓工序之至少一部分中將前述清洗液的溫度保持在45℃～80℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1834" publication-number="202621423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於暫時接合及釋放產品基板與載體基板之方法及這種方法之裝置</chinese-title>  
        <english-title>METHOD FOR TEMPORARILY BONDING AND RELEASING A PRODUCT SUBSTRATE AND A CARRIER SUBSTRATE, AND DEVICE FOR SUCH A METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/10</main-classification>  
        <further-classification edition="201901120260223B">B32B7/06</further-classification>  
        <further-classification edition="200601120260223B">B32B38/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃夫　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLF, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種暫時接合方法，用於產品基板（1）與載體基板（2），包含：提供產品基板（1）及載體基板（2），接合產品基板（1）及載體基板（2），以在接合狀態下於產品基板（1）與載體基板（2）之間形成接合層（4），自載體基板（2）分離產品基板（1），產品基板（1）及載體基板（2）在主要區域（11）中在氣體逸出下於第一分離步驟中分離，且產品基板（1）及載體基板（2）在圍繞主要區域（11）之次要區域（12）中，特別是封閉及/或氣密的，於第二分離步驟中分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for temporarily bonding a product substrate (1) and a carrier substrate (2), comprising: providing the product substrate (1) and the carrier substrate (2),bonding the product substrate (1) and the carrier substrate (2) to each other to form a bonding layer (4) between the product substrate (1) and the carrier substrate (2) in a bonded state,separating the product substrate (1) from the carrier substrate (2), wherein the product substrate (1) and the carrier substrate (2) are separated in a primary area (11) under gas evolution in a first separation step and are separated in a secondary area (12) surrounding the primary area (11), in particular closed and/or gas-tight, in a second separation step</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:產品基板</p>  
        <p type="p">2:載體基板</p>  
        <p type="p">3:基板堆疊</p>  
        <p type="p">4:接合層</p>  
        <p type="p">7:間隙</p>  
        <p type="p">11:主要區域</p>  
        <p type="p">12:次要區域</p>  
        <p type="p">D,d:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1835" publication-number="202620463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衛星通訊之追蹤裝置</chinese-title>  
        <english-title>TRACKING DEVICE FOR SATELLITE COMMUNICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260202B">G01S19/14</main-classification>  
        <further-classification edition="200601120260202B">H04B7/185</further-classification>  
        <further-classification edition="200601120260202B">H01Q1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商琳森斯控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINXENS HOLDING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍科　埃馬紐埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANC, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於衛星通訊的追蹤裝置，其包括被配置為與衛星通訊的柔性印刷電路板(PCB)以及被配置為向該柔性PCB供電的電源控制模組。該柔性PCB包括微控制器、通訊模組、衛星天線和RFID天線。該電源控制模組包括能量儲存模組和能量收集模組，其中，該能量收集模組被配置為產生能量並將其提供給該能量儲存模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a tracking device for satellite communication comprising a flexible Printed Circuit Board (PCB) configured to communicate with a satellite, and a power control module configured to supply power to the flexible PCB. The flexible PCB comprises a microcontroller, a communication module, a satellite antenna, and an RFID antenna. The power control module comprises an energy-storage module and an energy-harvesting module, wherein the energy-harvesting module is configured to generate energy and provide it to the energy-storage module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:衛星通訊追蹤裝置、衛星通訊裝置、追蹤裝置</p>  
        <p type="p">110:柔性PCB層、柔性PCB、PCB層、柔性印刷電路板</p>  
        <p type="p">120:電源控制模組、電源控制模組層</p>  
        <p type="p">122:能量儲存模組、電池</p>  
        <p type="p">124:能量收集模組、太陽能電池板</p>  
        <p type="p">130:黏合層</p>  
        <p type="p">140:覆蓋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1836" publication-number="202619667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備的控制方法、裝置及設備</chinese-title>  
        <english-title>CONTROL METHOD, APPARATUS, AND EQUIPMENT FOR CLEANING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251118B">A47L11/24</main-classification>  
        <further-classification edition="202401120251118B">G05D1/648</further-classification>  
        <further-classification edition="200601120251118B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種清潔設備的控制方法、裝置及設備，涉及地面清潔技術領域，能夠避免識別清潔場景中特定空間的複雜行為路徑，提升清潔效率。其中方法包括：獲取具有清潔高度需求的至少一個標註空間區域；根據標註空間區域在不同清潔場景中的任務需求，創建清潔任務；回應於預設清潔場景中清潔任務的執行指令，根據清潔任務控制清潔設備對相應的標註空間區域執行清掃邏輯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a control method, apparatus, and equipment for cleaning equipment, which pertains to the field of floor cleaning technology. It can avoid the complex behavioral paths for identifying specific spaces in cleaning scenarios and enhance cleaning efficiency. The method includes the following steps: acquiring at least one labeled spatial area with a cleaning height requirement; creating cleaning tasks based on the task requirements of the labeled spatial areas in different cleaning scenarios; and in response to an execution instruction for a cleaning task in a preset cleaning scenario, controlling the cleaning equipment to perform a cleaning logic on the corresponding labeled spatial area according to the cleaning task.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101、102、103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1837" publication-number="202620568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔機器人的控制方法及裝置以及清潔機器人</chinese-title>  
        <english-title>CONTROL METHOD AND APPARATUS FOR CLEANING ROBOT, AND CLEANING ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251128B">G05D1/243</main-classification>  
        <further-classification edition="202401120251128B">G05D1/43</further-classification>  
        <further-classification edition="202401120251128B">G05D1/644</further-classification>  
        <further-classification edition="202401120251128B">G05D1/648</further-classification>  
        <further-classification edition="200601120251128B">A47L11/24</further-classification>  
        <further-classification edition="200601120251128B">A47L11/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提供了一種清潔機器人的控制方法及裝置、清潔機器人。其中，該方法包括：獲取針對待清潔的目的地區域設置的第一時長；第一時長用於控制清潔機器人在清潔目的地區域的過程中相鄰兩次清洗拖布的時間間隔；獲取針對目的地區域中的第一分區設置的第一清潔參數；第一清潔參數指示分區清潔後清洗拖布；在控制清潔機器人清潔第一分區的過程中，如果確定自上次清洗拖布的位置至當前位置的行走時長小於第一時長並且在當前位置時已完成對第一分區的清潔，控制清潔機器人在對目的地區域中的下一分區進行清潔之前清洗拖布。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a control method and apparatus for a cleaning robot, and the cleaning robot itself. The method comprises: acquiring a first duration set for a target area to be cleaned; wherein the first duration is used for controlling a time interval between two adjacent mopping cloth cleanings of the cleaning robot during the cleaning of the target area; acquiring a first cleaning parameter set for a first partition in the target area; the first cleaning parameter indicates cleaning the mopping cloth after partition cleaning is completed; during the process of controlling the cleaning robot to clean the first partition, if an elapsed travel time from a position of a last mopping cloth cleaning to a current position is determined to be less than the first duration and cleaning of the first partition is completed at the current position, controlling the cleaning robot to clean the mopping cloth before cleaning a next partition in the target area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1838" publication-number="202621497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/01</main-classification>  
        <further-classification edition="202601120260223B">H10W70/05</further-classification>  
        <further-classification edition="202601120260223B">H10W70/06</further-classification>  
        <further-classification edition="202601120260223B">H10W70/63</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification>  
        <further-classification edition="202601120260223B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐誠二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山惠一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種使用橋接晶粒之半導體封裝方法的一例。在該方法中，首先在玻璃基板（20）上形成表面RDL（22）。表面RDL（22）的配線寬度/配線間空間（L/S）比背面RDL（25）窄。形成表面RDL（22）之後，將柱（23）設置於表面RDL（22）上，並且例如將橋接晶粒（40）設置於表面RDL（22）上。之後，密封柱（23）和橋接晶粒（40），在其上形成與柱（23）電連接之背面RDL（25）。在該方法中，與以往不同地，首先在玻璃基板（20）上形成表面RDL（22）。藉此，能夠高精度地形成微細的表面RDL（22）。依據該方法，作為一例，能夠高精度地形成配線寬度/配線間空間（L/S）為2μm/2μm以下的表面RDL。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:載體基板(第1支撐體)</p>  
        <p type="p">21:臨時固定層</p>  
        <p type="p">22:微細配線層(第1配線層)</p>  
        <p type="p">23:柱(柱狀構件)</p>  
        <p type="p">23b:第2端</p>  
        <p type="p">24,24a:密封材料層</p>  
        <p type="p">25:配線層(第2配線層)</p>  
        <p type="p">25a:配線部</p>  
        <p type="p">25b:絕緣部</p>  
        <p type="p">26:連接凸塊</p>  
        <p type="p">30,30a,40,40a:半導體晶粒(半導體構件)</p>  
        <p type="p">34,44:內部電極(貫通電極)</p>  
        <p type="p">34b,44b:第2端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1839" publication-number="202619689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>牙科鑽機裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260131B">A61C3/02</main-classification>  
        <further-classification edition="200601120260131B">A61C1/08</further-classification>  
        <further-classification edition="200601120260131B">A61C8/02</further-classification>  
        <further-classification edition="200601120260131B">A61B17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商奧齒泰種植體有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSSTEM IMPLANT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁泳溢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YOUNG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供牙科鑽機裝置，作為沿著設置於患者的口腔內的引導裝置的導向孔進行插入的牙科鑽機裝置，其包括：柄部，與牙科手機相結合；鑽機主體部，與所述柄部的下部相連接，藉助所述牙科手機的旋轉力來進行旋轉，並支撐於所述導向孔的內周；鑽頭部，形成於所述鑽機主體部的下部；以及擋止部，形成於所述鑽機主體部和所述柄部之間，並具有大於所述導向孔的內周的直徑，所述鑽機主體部可在所述導向孔的內周以相對於所述導向孔的中心軸傾斜的狀態進行移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:牙科鑽機裝置</p>  
        <p type="p">110:柄部</p>  
        <p type="p">111:安裝部</p>  
        <p type="p">120:鑽機主體部</p>  
        <p type="p">130:擋止部</p>  
        <p type="p">131:下部面</p>  
        <p type="p">140:鑽頭部</p>  
        <p type="p">C1:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1840" publication-number="202619662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉動機構、集塵裝置與清潔系統</chinese-title>  
        <english-title>ROTATION MECHANISM, DUST COLLECTION UNIT, AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A47L5/12</main-classification>  
        <further-classification edition="200601120251201B">A47L9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙雲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提供了一種轉動機構、集塵裝置與清潔系統，有關於清潔裝置技術領域。轉動機構包括：第一連接件、第二連接件、第一殼體件與第二殼體件，第一連接件與第二連接件轉動連接；第一殼體件與第一連接件活動連接以相向或相離運動，第二殼體件與第二連接件連接；或第二殼體件與第二連接件活動連接以相向或相離運動，第一殼體件與第一連接件連接；或第一殼體件與第一連接件活動連接以相向或相離運動，第二殼體件與第二連接件活動連接以相向或相離運動。本創作提供的轉動機構，第一殼體件與第二殼體件之間連接的為可浮動式轉動結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a rotation mechanism, a dust collection unit, and a cleaning system, relating to the technical field of cleaning devices. The rotation mechanism comprises: a first connecting member, a second connecting member, a first shell member, and a second shell member, wherein the first connecting member and the second connecting member are rotatably connected; the first shell member is movably connected to the first connecting member to move toward or away from it, and the second shell member is connected to the second connecting member; or the second shell member is movably connected to the second connecting member to move toward or away from it, and the first shell member is connected to the first connecting member; or the first shell member is movably connected to the first connecting member to move toward or away from it, and the second shell member is movably connected to the second connecting member to move toward or away from it. In the rotation mechanism provided by the present disclosure, the connection between the first shell member and the second shell member is a floating-type rotation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第二殼體件</p>  
        <p type="p">20:第一殼體件</p>  
        <p type="p">30:轉動組件</p>  
        <p type="p">110:安裝槽</p>  
        <p type="p">210:第一導向結構</p>  
        <p type="p">310:第一連接件</p>  
        <p type="p">320:第二連接件</p>  
        <p type="p">330:轉軸</p>  
        <p type="p">340:第一彈性件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1841" publication-number="202619731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療CNS病症之組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING CNS DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/573</main-classification>  
        <further-classification edition="200601120260202B">A61K31/57</further-classification>  
        <further-classification edition="200601120260202B">C07J61/00</further-classification>  
        <further-classification edition="200601120260202B">C07J63/00</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽吉醫療有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGE THERAPEUTICS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅比喬德　艾伯特　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBICHAUD, ALBERT J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩突羅　法藍西司科　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALITURO, FRANCESCO G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蘭可　佩拉杜　馬利亞　耶稣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANCO-PILLADO, MARIA JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里森　柏伊德　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRISON, BOYD L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供式&lt;b&gt;(&lt;/b&gt;&lt;b&gt;I&lt;/b&gt;&lt;b&gt;-&lt;/b&gt;&lt;b&gt;I&lt;/b&gt;&lt;b&gt;)&lt;/b&gt;之化合物 &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="285px" file="ed10609.JPG" alt="ed10609.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥學上可接受之鹽，其中t、R&lt;sup&gt;7&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;9&lt;/sup&gt;、R&lt;sup&gt;6a&lt;/sup&gt;、R&lt;sup&gt;6b&lt;/sup&gt;、R&lt;sup&gt;11a&lt;/sup&gt;、R&lt;sup&gt;11b&lt;/sup&gt;、R&lt;sup&gt;15a&lt;/sup&gt;、R&lt;sup&gt;15b&lt;/sup&gt;、R&lt;sup&gt;16a&lt;/sup&gt;、R&lt;sup&gt;16b&lt;/sup&gt;、R&lt;sup&gt;17a&lt;/sup&gt;、R&lt;sup&gt;17b&lt;/sup&gt;、R&lt;sup&gt;18a&lt;/sup&gt;、R&lt;sup&gt;18b&lt;/sup&gt;、R&lt;sup&gt;19a&lt;/sup&gt;、R&lt;sup&gt;19b&lt;/sup&gt;、R&lt;sup&gt;5a&lt;/sup&gt;、R&lt;sup&gt;5b&lt;/sup&gt;、R&lt;sup&gt;8&lt;/sup&gt;及R&lt;sup&gt;13&lt;/sup&gt;如本文所定義。本文亦提供包含式&lt;b&gt;(&lt;/b&gt;&lt;b&gt;I&lt;/b&gt;&lt;b&gt;-&lt;/b&gt;&lt;b&gt;I&lt;/b&gt;&lt;b&gt;)&lt;/b&gt;之化合物的醫藥組合物及使用該等化合物例如治療CNS相關病症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is a compound of Formula &lt;b&gt;(I-I) &lt;/b&gt;&lt;br/&gt;&lt;img align="absmiddle" height="168px" width="292px" file="ed10610.JPG" alt="ed10610.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein t, R&lt;sup&gt;7&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;9&lt;/sup&gt;, R&lt;sup&gt;6a&lt;/sup&gt;, R&lt;sup&gt;6b&lt;/sup&gt;, R&lt;sup&gt;11a&lt;/sup&gt;, R&lt;sup&gt;11b&lt;/sup&gt;, R&lt;sup&gt;15a&lt;/sup&gt;, R&lt;sup&gt;15b&lt;/sup&gt;, R&lt;sup&gt;16a&lt;/sup&gt;, R&lt;sup&gt;16b&lt;/sup&gt;, R&lt;sup&gt;17a&lt;/sup&gt;, R&lt;sup&gt;17b&lt;/sup&gt;, R&lt;sup&gt;18a&lt;/sup&gt;, R&lt;sup&gt;18b&lt;/sup&gt;, R&lt;sup&gt;19a&lt;/sup&gt;, R&lt;sup&gt;19b&lt;/sup&gt;, R&lt;sup&gt;5a&lt;/sup&gt;,&lt;sub/&gt;R&lt;sup&gt;5b&lt;/sup&gt;, R&lt;sup&gt;8&lt;/sup&gt;&lt;sub/&gt;and R&lt;sup&gt;13&lt;/sup&gt; are defined herein. Also provided herein are pharmaceutical compositions comprising a compound of Formula &lt;b&gt;(I-I)&lt;/b&gt; and methods of using the compounds, &lt;i&gt;e.g.&lt;/i&gt;, in the treatment of CNS-related disorders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1842" publication-number="202620408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種濾波結構、光學檢測系統及光學檢測方法</chinese-title>  
        <english-title>FILTER STRUCTURE, AND OPTICAL DETECTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">G01N21/01</main-classification>  
        <further-classification edition="200601120260204B">G01N21/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳中科飛測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYVERSE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供了一種濾波結構、光學檢測系統及光學檢測方法，用於提升獲取待檢測對象中缺陷信號的準確性。本發明實施例中的濾波結構，包括：第一濾波結構，用於對待檢測對象中週期排布的結構單元的主衍射信號進行濾波；和第二濾波結構，用於對待檢測對象中週期排布的結構單元的次級衍射光斑進行濾波；第一濾波結構包括至少一個外周為封閉狀的濾波結構，當待檢測對象中設置有結構單元時，所述封閉狀的濾波結構內還設置有連接所述濾波結構任意兩端的擋光結構；所述第二濾波結構包括平行設置的多個擋光件，其中，所述擋光件在所述次級衍射光斑所在平面的投影不小於所述次級衍射光斑的直徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A filter structure, and an optical detection system and method are provided in embodiments of the present invention, which are used to improve the accuracy of acquiring defect signals in an object to be detected. The filter structure according to the embodiments of the present invention includes: a first filter structure configured to filter primary diffraction signals of a periodically arranged structural unit in the object to be detected; a second filter structure configured to filter secondary diffraction spots of the periodically arranged structural unit in the object to be detected. The first filter structure includes at least one filter structure with a closed outer periphery. When the structural unit is arranged in the object to be detected, a light-blocking structure connecting any two ends of the filter structure is further arranged inside the closed filter structure. The second filter structure includes a plurality of light-blocking members arranged in parallel. The projection of the light-blocking member on the plane where the secondary diffraction spot is located is not smaller than the diameter of the secondary diffraction spot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8031:第一濾波結構</p>  
        <p type="p">8032:第二濾波結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1843" publication-number="202620420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種檢測系統及檢測方法</chinese-title>  
        <english-title>DETECTION SYSTEM AND DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01N21/95</main-classification>  
        <further-classification edition="200601120260211B">G01N21/88</further-classification>  
        <further-classification edition="200601120260211B">G01N21/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳中科飛測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYVERSE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱燕明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YAN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種檢測系統及檢測方法，檢測系統包括第一明場檢測光學組件、第二明場檢測光學組件、暗場檢測光學組件、第一平臺和第二平臺；在暗場檢測光學組件用於對處於暗場位的第i個待測物進行暗場檢測的同時，目標光學組件用於對處於目標位的第i+1個待測物進行明場檢測；目標光學組件為第一明場檢測光學組件或第二明場檢測光學組件，目標位為第一明場位或第二明場位。通過將明場檢測光學組件和暗場檢測光學組件進行分離，各個光學組件獨立進行檢測，避免了光源之間的相互影響，保障了明場檢測和暗場檢測的檢測精度。此外，在對一個待測物進行明場檢測的同時，能夠對另一個待測物進行暗場檢測，即能夠實現對兩個待測物並行檢測，大大提高了檢測效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection system and a detection method are provided according to the present disclosure. The detection system includes a first bright-field detection optical component, a second bright-field detection optical component, a dark-field detection optical component, a first platform, and a second platform. While the dark-field detection optical component performs dark-field detection on an i-th to-be-detected object located at a dark-field position, a target optical component performs bright-field detection on a (i+1)-th to-be-detected object located at a target position. The target optical component is the first bright-field detection optical component or the second bright-field detection optical component, and the target position is a first bright-field position or a second bright-field position. By separation of the bright-field detection optical components and the dark-field detection optical component, each optical component performs detection independently, avoiding mutual interference between light sources and ensuring detection accuracies of both the bright-field detection and the dark-field detection. Furthermore, while performing the bright-field detection on one to-be-detected object, the dark-field detection may be performed on another to-be-detected object, so that two to-be-detected objects can be detected in parallel, significantly improving detection efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一光源</p>  
        <p type="p">100:基礎光學組件</p>  
        <p type="p">101:第一明場檢測光學組件</p>  
        <p type="p">102:第二明場檢測光學組件</p>  
        <p type="p">103:暗場檢測光學組件</p>  
        <p type="p">104:第一明場位</p>  
        <p type="p">105:第二明場位</p>  
        <p type="p">106:暗場位</p>  
        <p type="p">14:第一平臺</p>  
        <p type="p">19:第二平臺</p>  
        <p type="p">2:慢速快門</p>  
        <p type="p">20:第三反射鏡</p>  
        <p type="p">21:第一起偏模組</p>  
        <p type="p">22:調整模組</p>  
        <p type="p">23:第四反射鏡</p>  
        <p type="p">24:第三整形模組</p>  
        <p type="p">25:第一反射鏡</p>  
        <p type="p">26a:第一明場光源</p>  
        <p type="p">26b:第二明場光源</p>  
        <p type="p">27a:第一偏振片</p>  
        <p type="p">27b:第二偏振片</p>  
        <p type="p">28a:第一半透半反鏡</p>  
        <p type="p">28b:第二半透半反鏡</p>  
        <p type="p">29a:第一DIC棱鏡</p>  
        <p type="p">29b:第二DIC棱鏡</p>  
        <p type="p">3:光束指向穩定模組</p>  
        <p type="p">30a:第一物鏡</p>  
        <p type="p">30b:第二物鏡</p>  
        <p type="p">31a:第一四分之一波片</p>  
        <p type="p">31b:第二四分之一波片</p>  
        <p type="p">32a:第一筒鏡</p>  
        <p type="p">32b:第二筒鏡</p>  
        <p type="p">33a:第一濾光片</p>  
        <p type="p">33b:第二濾光片</p>  
        <p type="p">34a:第一探測器</p>  
        <p type="p">34b:第二探測器</p>  
        <p type="p">35:第二反射鏡</p>  
        <p type="p">4:擴束模組</p>  
        <p type="p">40:光束調節模組</p>  
        <p type="p">41:第十二反射鏡</p>  
        <p type="p">6:第二半波片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1844" publication-number="202620418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種缺陷檢測系統及缺陷檢測方法</chinese-title>  
        <english-title>DEFECT DETECTION SYSTEM AND DEFECT DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G01N21/88</main-classification>  
        <further-classification edition="200601120260206B">G01N21/95</further-classification>  
        <further-classification edition="200601120260206B">G01N21/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳中科飛測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYVERSE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙康俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, KANG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉英見</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種缺陷檢測系統及缺陷檢測方法，缺陷檢測系統包括用於承載待測物的載物台、位於載物台同一側的照明通道和多個檢測通道。光源發出的入射光所在的入射平面與檢測平面垂直，檢測平面為多個檢測通道的光軸所在平面；多個檢測通道包括第一檢測通道、第二檢測通道和第三檢測通道；第一檢測通道包括第一物鏡和第一檢測器，第二檢測通道包括第二物鏡和第二檢測器，第三檢測通道包括第三物鏡和第三檢測器，第一物鏡的第一數值孔徑大於第二物鏡的第二數值孔徑。本發明提供的缺陷檢測系統具有較高的檢測靈敏度以及較寬的動態範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A defect detection system and a defect detection method are provided according to the present disclosure. The defect detection system includes a stage for carrying an object to be detected, as well as an illumination channel and multiple detection channels that are located at a same side of the stage. An incident plane in which an incident light emitted from a light source is located is perpendicular to a detection plane. The detection plane is a plane in which optical axes of the multiple detection channels are located. The multiple detection channels include a first detection channel, a second detection channel, and a third detection channel. The first detection channel includes a first objective lens and a first detector, the second detection channel includes a second objective lens and a second detector, and the third detection channel includes a third objective lens and a third detector. A first numerical aperture of the first objective lens is greater than a second numerical aperture of the second objective lens. The defect detection system provided in the present disclosure has a high detection sensitivity and a wide dynamic range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:載物台</p>  
        <p type="p">102:待測物</p>  
        <p type="p">103:照明通道</p>  
        <p type="p">104:光源</p>  
        <p type="p">105:檢測光斑</p>  
        <p type="p">106:偏振調節模組</p>  
        <p type="p">107:整形模組</p>  
        <p type="p">201:第一檢測通道</p>  
        <p type="p">2011:第一物鏡</p>  
        <p type="p">2012:第一檢測器</p>  
        <p type="p">202:第二檢測通道</p>  
        <p type="p">2021:第二物鏡</p>  
        <p type="p">2022:第二檢測器</p>  
        <p type="p">203:第三檢測通道</p>  
        <p type="p">2031:第三物鏡</p>  
        <p type="p">2032:第三檢測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1845" publication-number="202620421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓缺陷檢測裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR DETECTING DEFECTS OF WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G01N21/956</main-classification>  
        <further-classification edition="202601120260223B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳中科飛測科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYVERSE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙康俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, KANG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種晶圓缺陷檢測裝置及方法。該裝置包括照明系統、運動平臺、探測系統和信號處理系統。照明系統向晶圓表面提供至少三個不同入射方向的照明光束並形成重合的線狀照明光斑；運動平臺驅動晶圓進行線掃描；探測系統包括多個光軸共面的探測通道，收集散射光並轉換為電信號，多個探測通道至少包括光軸與晶圓法線的夾角較大的大角度探測通道、光軸與晶圓法線的夾角較小的小角度探測通道，且至少一個探測通道和至少一個照明光束分處於晶圓法線的兩側；信號處理系統處理電信號確定缺陷資訊。本發明通過配置特定角度的大、小角度探測通道與特定方向的照明光束協同工作，實現對球形、類球形、扁平污染物和損傷缺陷等全類型的高靈敏度檢測，避免漏檢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus and method for detecting defects of a wafer are provided according to the present disclosure. The apparatus includes an illumination system, a motion platform, a detection system, and a signal processing system. The illumination system provides at least three illumination beams with different incident directions onto a surface of a wafer, and the at least three illumination beams form coincident linear illumination light spots. The motion platform drives the wafer for line scanning. The detection system includes multiple detection channels, of which optical axes lie on the same plane, collecting scattered light and converting the scattered light into electrical signals. The multiple detection channels includes a large-angle detection channel with a large angle between the optical axis and a normal of the wafer and a small-angle detection channel with a small angle between the optical axis and the normal of the wafer, and at least one of the detection channels and at least one of the illumination beams respectively lie on opposite sides of the normal of the wafer. The signal processing system processes the electrical signals to determine defect information. According to the present disclosure, the large-angle detection channel and the small-angle detection channel at specific angles are configured to collaboratively work with the illumination beams in specific directions, so that high-sensitivity detections of all types of defects, such as spherical defects, quasi-spherical defects, film-like contaminants, and damage defects, are achieved, thereby avoiding missed detections.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1846" publication-number="202620885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錯誤更正方法、記憶體儲存裝置及記憶體控制電路單元</chinese-title>  
        <english-title>ERROR HANDLE METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260109B">G11C29/42</main-classification>  
        <further-classification edition="200601120260109B">G11C16/06</further-classification>  
        <further-classification edition="200601120260109B">G11C11/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾士家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, SHIH-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張議方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種錯誤更正方法、記憶體儲存裝置及記憶體控制電路單元。所述錯誤更正方法包括：統計第一錯誤更正流程的第一解碼率，其中第一錯誤更正流程包括基於第一順序被執行的多個解碼操作；以及響應於第一解碼率小於第一閾值，將第一錯誤更正流程切換為第二錯誤更正流程，其中第二錯誤更正流程包括基於第二順序被執行的多個解碼操作，其中第二順序所指示的第一個解碼操作的解碼能力優於第一順序所指示的第一個解碼操作的解碼能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An error handle method, a memory storage device and a memory control circuit unit are provided. The error handle method includes: counting a first decoding rate of a first error handle process, wherein the first error handle process includes a plurality of decoding operations performed based on a first order; and in response to the first decoding rate being less than a first threshold, switching the first error handle process to a second error handle process, wherein the second error handle process includes a plurality of decoding operations performed based on a second order, wherein a decoding capability of a first decoding operation indicated by the second order is better than a decoding capability of a first decoding operation indicated by the first order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1001:步驟(統計第一錯誤更正流程的第一解碼率，其中第一錯誤更正流程包括基於第一順序被執行的多個解碼操作)</p>  
        <p type="p">S1002:步驟(響應於第一解碼率小於第一閾值，將第一錯誤更正流程切換為第二錯誤更正流程，其中第二錯誤更正流程包括基於第二順序被執行的多個解碼操作，其中第二順序所指示的第一個解碼操作的解碼能力優於第一順序所指示的第一個解碼操作的解碼能力)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1847" publication-number="202620835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光功能器件、功能面板、顯示裝置、輸入／輸出裝置、資料處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260223B">G09G3/3225</main-classification>  
        <further-classification edition="200601120260223B">G06F3/14</further-classification>  
        <further-classification edition="202601120260223B">H10K19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田太介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMADA, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新倉泰裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIKURA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初見亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下晃央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上祥子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, SACHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬尾哲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種方便性、實用性或可靠性優異的新穎的光功能器件。該光功能器件包括發光功能、光電轉換功能、第一電極、第二電極以及光功能層，發光功能將電能轉換為第一光，第一光具有第一發射光譜，第一發射光譜在第一波長示出最大峰值，第一發射光譜在第二波長具有最大峰值的80%的強度。另外，光電轉換功能具有分光靈敏度特性，分光靈敏度特性在第三波長示出420nm以上且720nm以下的範圍內的最大靈敏度，分光靈敏度特性在第四波長具有最大靈敏度的80%的靈敏度。第三波長比第一波長靠近第二波長一側，第四波長比第三波長靠近第一波長一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ABS:吸收光譜</p>  
        <p type="p">SP11:光譜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1848" publication-number="202621112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像編碼參考圖像清單發信及建構方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR SIGNALING AND CONSTRUCTION OF VIDEO CODING REFERENCEPICTURE LISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260204B">H04N19/103</main-classification>  
        <further-classification edition="201401120260204B">H04N19/105</further-classification>  
        <further-classification edition="201401120260204B">H04N19/117</further-classification>  
        <further-classification edition="201401120260204B">H04N19/124</further-classification>  
        <further-classification edition="201401120260204B">H04N19/60</further-classification>  
        <further-classification edition="201401120260204B">H04N19/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位ＶＣ控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於時間預測的參考圖像的用信號發送的改進方法及裝置。用於HEVC工作草案（WD5）中的不同參考圖像清單的用信號發送方案和建構過程被改進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Improved method and apparatus for signaling of reference pictures used for temporal prediction. The signaling schemes and construction process for different reference picture lists in HEVC Working Draft 5 (WD5) are improved.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1849" publication-number="202621028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>返馳變換器及其控制電路、控制方法</chinese-title>  
        <english-title>FLYBACK CONVERTER, CONTROL CIRCUIT AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">H02M3/335</main-classification>  
        <further-classification edition="200601120260209B">H02M1/08</further-classification>  
        <further-classification edition="200601120260209B">H02M3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杰華特微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許祥勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIANG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種返馳變換器及其控制電路、控制方法，控制方法包括：獲得返馳變換器的負載狀態；在負載狀態為輕載時工作在非連續導通模式；在負載狀態為重載時工作在臨界導通模式；在負載狀態介於輕載和重載之間時工作在混合導通模式，混合導通模式週期內包括N個開關週期，前N-1個開關週期工作在臨界導通模式，第N個開關週期工作在非連續導通模式，根據設定的混合導通模式週期最大值和設定的第一占空比控制混合導通模式週期內的每個開關週期工作在臨界導通模式或非連續導通模式。本發明可以自我調整控制混合導通模式下的各個開關週期，進而提升返馳變換器在負載狀態介於輕載和重載之間的情況下的系統效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a flyback converter, a control circuit and a control method thereof. The control method includes: obtaining a load state of the flyback converter; operating in a discontinuous conduction mode when the load state is light load; operating in a boundary conduction mode when the load state is heavy load; operating in a hybrid conduction mode when the load state is between light load and heavy load. A hybrid conduction mode cycle includes N switching cycles, with the first N-1 switching cycles operating in the boundary conduction mode and the Nth switching cycle operating in the discontinuous conduction mode. Each switching cycle in the hybrid conduction mode cycle is controlled to operate in the boundary conduction mode or discontinuous conduction mode according to a set maximum value of the hybrid conduction mode cycle and a set first duty cycle. The present disclosure can adaptively control each switching cycle in the hybrid conduction mode, thereby improving a system efficiency of the flyback converter under a load condition between light load and heavy load.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1850" publication-number="202620146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨組成物及其使用之方法</chinese-title>  
        <english-title>POLISHING COMPOSITIONS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C09G1/02</main-classification>  
        <further-classification edition="200601120260223B">C09K3/14</further-classification>  
        <further-classification edition="202601120260223B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富士軟片電子材料美國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亭凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　大爲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温　立清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, LIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　燕南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YANNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種研磨組成物，包括一磨料；一pH調整劑；一阻障膜移除速率增強劑；一低k移除速率抑制劑；一含唑腐蝕抑制劑；以及一釕移除速率增強劑。一種研磨一基材的方法，其包括下述步驟：施加本文所述之該研磨組成物至一基材之一表面，其中該表面包含釕或一硬遮罩材料；使一襯墊與該基材之該表面接觸，並相對於該基材移動該襯墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing composition, includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a ruthenium removal rate enhancer. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1851" publication-number="202620194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151982</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高ＥＰＡ含量的微生物油及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260223B">C12P7/6434</main-classification>  
        <further-classification edition="202201120260223B">C12P7/6432</further-classification>  
        <further-classification edition="202601120260223B">C12N1/14</further-classification>  
        <further-classification edition="202601120260223B">C12N1/20</further-classification>  
        <further-classification edition="201601120260223B">A23K20/158</further-classification>  
        <further-classification edition="201601120260223B">A23L33/12</further-classification>  
        <further-classification edition="200601120260223B">A61K31/202</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商帝斯曼知識產權資產管理有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DSM IP ASSETS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　逍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, XIAO DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈西亞　荷塞Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA, JOSE R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布爾夏　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURJA, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范溫登　沃特阿德里安努斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN WINDEN, WOUTER ADRIANUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強森　麥寇班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, MICHAEL BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了可包含在培養基中存在的生物質的微生物油組合物。所述生物質可以包括富含EPA的微生物油。本發明還描述了生產富含EPA的微生物油的方法。本發明還描述了包含微生物油的營養油組合物，以及由所述營養油組合物或所述微生物油製備的營養油濃縮物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1852" publication-number="202621420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114152262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高壓基板處理裝置</chinese-title>  
        <english-title>HIGH PRESSURE SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10W76/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商株式會社ＨＰＳＰ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HPSP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安宰範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JAE BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林根榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, KUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔彬泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, BIN HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種高壓基板處理裝置。所述高壓基板處理裝置包括內腔、外腔及緊固模組。所述內腔形成為用於容納待處理基板、和以高於大氣壓的第一壓力供給的反應氣體。所述外腔，具備：外殼，用於容納所述內腔；以及外門，可在與所述外殼接觸的關閉狀態和與所述外殼分開的打開狀態之間移動。所述外腔形成為用於容納以相對於所述第一壓力設定的第二壓力供給的保護氣體。所述緊固模組，具備：支撐突起，設置在所述外殼；旋轉構件，相對於所述外門可旋轉地設置；以及卡止突起，在所述旋轉構件上延長形成，配置在所述支撐突起上。所述外門包括在所述關閉狀態下與所述外殼接觸的上板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a high pressure substrate processing device. The high pressure substrate processing device includes an inner cavity, an outer cavity and a fastening module. The inner cavity is formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure. The outer cavity is provided with: a shell for accommodating the inner cavity; and an outer door movable between a closed state in contact with the shell and an open state separated from the shell. The outer cavity is formed to contain shielding gas supplied at a second pressure set relative to the first pressure. The fastening module is provided with: a supporting protrusion provided on the shell; a rotating member rotatably provided relative to the outer door; and a locking protrusion is extended on the rotating member and arranged on the supporting protrusion. The outer door includes an upper plate in contact with the shell in the closed state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:高壓基板處理裝置</p>  
        <p type="p">121:外殼</p>  
        <p type="p">125:外門</p>  
        <p type="p">126:上板</p>  
        <p type="p">127:下板</p>  
        <p type="p">128:間隔件</p>  
        <p type="p">129:密封材料</p>  
        <p type="p">150:緊固模組</p>  
        <p type="p">151:支撐突起</p>  
        <p type="p">151a:支撐面</p>  
        <p type="p">155:卡止突起</p>  
        <p type="p">155a:卡止面</p>  
        <p type="p">157:旋轉構件</p>  
        <p type="p">158:中空部</p>  
        <p type="p">159:軸承</p>  
        <p type="p">C:旋轉軸</p>  
        <p type="p">R:旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1853" publication-number="202620475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115100055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏振分光膜堆結構和偏極化分光元件</chinese-title>  
        <english-title>POLARIZING AND LIGHT-SPLITTING FILM STACKED STRUCTURE AND POLARIZING BEAM SPLITTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260112B">G02B5/30</main-classification>  
        <further-classification edition="201901120260112B">B32B7/023</further-classification>  
        <further-classification edition="200601120260112B">G02B1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤米科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VACTRONICS TECHNOLOGIES INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSANG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆正堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, CHENG-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘泓任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾冠銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偏振分光膜堆結構包含交錯地堆疊的多個高折射層和多個低折射層，該偏振分光膜堆結構對在一特定波段的第一偏振光在入射角45度的穿透率T1與該偏振分光膜堆結構對在該特定波段的第二偏振光在入射角45度的穿透率T2符合T2/T1＞1000，且該第一偏振光的偏振方向垂直於該第二偏振光的偏振方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polarizing and light-splitting film stacked structure includes high refraction layers and low refraction layers alternatively stacked up with the high refraction layers, a transmittance T1 of the polarizing and light-splitting film with respect to first polarized light in a specific waveband at an incidence angle of 45° and a transmittance T2 of the polarizing and light-splitting film with respect to second polarized light in the specific band of at the incidence angle of 45° satisfy T2/T1＞1000, and the first and second polarized light are orthogonal to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:偏振分光膜堆結構</p>  
        <p type="p">21_1:膜層</p>  
        <p type="p">22_1:膜層</p>  
        <p type="p">21_(M-1):膜層</p>  
        <p type="p">22_N:膜層</p>  
        <p type="p">21_M:膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1854" publication-number="202620465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115100056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏振分光膜堆結構和偏極化分光元件</chinese-title>  
        <english-title>POLARIZING AND LIGHT-SPLITTING FILM STACKED STRUCTURE AND POLARIZING BEAM SPLITTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260126B">G02B1/08</main-classification>  
        <further-classification edition="201901120260126B">B32B7/023</further-classification>  
        <further-classification edition="200601120260126B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤米科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VACTRONICS TECHNOLOGIES INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSANG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆正堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, CHENG-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘泓任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偏振分光膜堆結構包含交錯地堆疊的多個高折射層和多個低折射層，該偏振分光膜堆結構對在一特定波段的第一偏振光在入射角45度的穿透率T1與該偏振分光膜堆結構對在該特定波段的第二偏振光在入射角45度的穿透率T2符合T2/T1＞1000，且該第一偏振光的偏振方向垂直於該第二偏振光的偏振方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polarizing and light-splitting film stacked structure includes high refraction layers and low refraction layers alternatively stacked up with the high refraction layers, a transmittance T1 of the polarizing and light-splitting film with respect to first polarized light in a specific waveband at an incidence angle of 45° and a transmittance T2 of the polarizing and light-splitting film with respect to second polarized light in the specific band of at the incidence angle of 45° satisfy T2/T1＞1000, and the first and second polarized light are orthogonal to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:偏振分光膜堆結構</p>  
        <p type="p">21_1:膜層</p>  
        <p type="p">22_1:膜層</p>  
        <p type="p">21_(M-1):膜層</p>  
        <p type="p">22_N:膜層</p>  
        <p type="p">21_M:膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1855" publication-number="202620039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115100762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＧＬＰ－１及澱粉素受體之共促效劑之用途</chinese-title>  
        <english-title>USE OF CO-AGONISTS OF THE GLP-1 AND AMYLIN RECEPTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K14/605</main-classification>  
        <further-classification edition="200601120260202B">A61K38/26</further-classification>  
        <further-classification edition="201701120260202B">A61K47/64</further-classification>  
        <further-classification edition="200601120260202B">A61P3/04</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification>  
        <further-classification edition="200601120260202B">A61P3/10</further-classification>  
        <further-classification edition="200601120260202B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVO NORDISK A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯斯　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUSE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班克　寇達爾　安　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANK KODAL, ANNE LOUISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥德森　強尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADSEN, JOHNNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐斯特賈爾德　索倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OESTERGAARD, SOEREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何根德夫　沃特　弗雷德里克　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOGENDORF, WOUTER FREDERIK JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托諾　克里斯提恩　溫茄爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORNOEE, CHRISTIAN WENZEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史崔佛　洛傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFER, LAUGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥德森　愛麗斯　拉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADSEN, ALICE RAVN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種包括有GLP-1受體促效劑及澱粉素受體促效劑之化合物。本發明亦有關一種適於(但不限於)口服投予之包括這類化合物的醫藥調配物。該化合物及包括該化合物之醫藥調配物係可使用於患有超重、肥胖症及/或相關合併症的個體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a compound comprising a GLP-1 receptor agonist and an amylin receptor agonist. The invention also relates to a pharmaceutical formulation, suitable for but not limited to oral administration, which comprises such a compound. The compound and pharmaceutical formulation comprising it may be used for the medical treatment of subjects with overweight, obesity and associated co-morbidities.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1856" publication-number="202619727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用ＪＡＫ抑制劑治療化膿性汗腺炎</chinese-title>  
        <english-title>TREATMENT OF HIDRADENITIS SUPPURATIVA USING JAK INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/519</main-classification>  
        <further-classification edition="200601120260202B">A61K31/573</further-classification>  
        <further-classification edition="200601120260202B">A61P17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英塞特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INCYTE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈維爾　麥克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOWELL, MICHAEL D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案提供治療有需要之患者之化膿性汗腺炎的方法，其包括向該患者投與治療有效量之抑制JAK1及/或JAK2之化合物或其醫藥學上可接受之鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides methods of treating hidradenitis suppurativa in a patient in need thereof, comprising administering to the patient a therapeutically effective amount of a compound which inhibits JAK1 and/or JAK2, or a pharmaceutically acceptable salt thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1857" publication-number="202620054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇新抗原的方法、癌症疫苗組成物及其製備方法</chinese-title>  
        <english-title>METHOD FOR SELECTING NEOANTIGEN, CANCER VACCINE COMPOSITION AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K16/28</main-classification>  
        <further-classification edition="200601120260202B">A61K39/395</further-classification>  
        <further-classification edition="200601120260202B">C12N15/13</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭世煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, SEIHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔規弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOE, KYUHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金勝海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEUNGHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金永穆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGMOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂潤九</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEU, YUNKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金多恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DA EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEONGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供選擇腫瘤特異性新抗原（免疫原性胜肽）的方法和所選擇的腫瘤特異性新抗原在製備個人化癌症疫苗中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a method for selecting a tumor-specific neoantigen (immunogenic peptide) and a use of the selected tumor-specific neoantigen in preparing a personalized anti-cancer vaccine.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1858" publication-number="202621431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>門開閉系統及具備門開閉系統之載入埠</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昕芙旎雅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河合俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAI, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷山育志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIYAMA, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小宮宗一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMIYA, MUNEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>重田貴司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGETA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種當將FOUP與EFEM連通時，防止大氣侵入至FOUP及EFEM內之門開閉系統及具備門開閉系統之載入埠。</p>  
        <p type="p">具備：基座(41)，構成將搬運空間與外部空間隔離之壁的一部分；開口部(92)，設於基座(41)；門(81)，可開閉開口部(92)；第1密封構件(94)，將基座(41)與容器(7)之間密封；第2密封構件(96)，將基座(41)與門(81)之間密封；密閉空間，當處於容器(7)隔著第1密封構件(94)與開口部(92)抵接之狀態時，由基座(41)、第1密封構件(94)、第2密封構件(96)、蓋體(72)、及門(81)所構成；第1氣體注入部(87)，對密閉空間注入氣體；及第2氣體排出部(88)，將密閉空間排氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">4:載入埠</p>  
        <p type="p">7:FOUP(容器)</p>  
        <p type="p">9:搬運空間</p>  
        <p type="p">41:基座</p>  
        <p type="p">41b:基座本體</p>  
        <p type="p">41d:插入孔</p>  
        <p type="p">43:水平基部</p>  
        <p type="p">44:載置台</p>  
        <p type="p">44c:第2氣體注入噴嘴(第2氣體注入部)</p>  
        <p type="p">44d:第2氣體排出噴嘴(第2氣體排出部)</p>  
        <p type="p">44e:第2氣體注入閥</p>  
        <p type="p">44f:第2氣體排出閥</p>  
        <p type="p">45:腳部</p>  
        <p type="p">46:護罩</p>  
        <p type="p">71:本體</p>  
        <p type="p">71a:開口</p>  
        <p type="p">71b:(FOUP7的)抵接面</p>  
        <p type="p">72:蓋體</p>  
        <p type="p">73:氣體供給閥</p>  
        <p type="p">74:氣體排出閥</p>  
        <p type="p">80:開閉機構</p>  
        <p type="p">81:門部(門)</p>  
        <p type="p">83:支撐框架</p>  
        <p type="p">84:滑動支撐手段</p>  
        <p type="p">85:可動塊</p>  
        <p type="p">86:滑軌</p>  
        <p type="p">87:第1氣體注入噴嘴(第1氣體注入部)</p>  
        <p type="p">87a:第1氣體注入閥</p>  
        <p type="p">88:第1氣體排出噴嘴(第1氣體排出部)</p>  
        <p type="p">88a:第1氣體排出閥</p>  
        <p type="p">89:均壓閥</p>  
        <p type="p">90:視窗單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1859" publication-number="202621505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於改進連通性的具有重構晶粒中介體的積體電路（ＩＣ）及相關製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT (IC) WITH RECONSTITUTED DIE INTERPOSER FOR IMPROVED CONNECTIVITY, AND RELATED METHODS OF FABRICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W70/60</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　鐘海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩托　安尼奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於改進連通性的具有重構晶粒中介體的積體電路（IC）具有安裝在外部上表面上的至少一個裝置或部件，該至少一個裝置或部件耦合到該封裝內的中介層中的晶粒。中介層可具有互連結構，其中第一互連結構具有第一節距的通孔，而第二互連結構具有大於第一節距的第二節距的通孔。以此方式，中介層充當可允許具有這些節距的其他裝置的導電耦合的裝置，以支援這些裝置與中介層內的其他裝置之間的互連。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit (IC) with reconstituted die interposer for improved connectivity has at least one device or component mounted on an exterior upper surface that couples to a die in an interposer layer within the package. The interposer layer may have interconnect structures, where a first interconnect structure has vias of a first pitch and a second interconnect structure has vias of a second pitch greater than the first pitch. In this manner, the interposer layer acts as a device that can allow conductive coupling for other devices with those pitches to support interconnections between those devices and other devices within the interposer layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:IC封裝</p>  
        <p type="p">202:中介層</p>  
        <p type="p">204:第一側</p>  
        <p type="p">206:第二側</p>  
        <p type="p">210:金屬化層210</p>  
        <p type="p">210A:第一側</p>  
        <p type="p">210B:第二側</p>  
        <p type="p">212:第二中介層</p>  
        <p type="p">214:底側</p>  
        <p type="p">216:外部封裝層</p>  
        <p type="p">218:封裝互連</p>  
        <p type="p">220:第二外部封裝層</p>  
        <p type="p">222:頂側</p>  
        <p type="p">224:部件</p>  
        <p type="p">226:封裝互連</p>  
        <p type="p">228(1):晶粒</p>  
        <p type="p">228(2):晶粒</p>  
        <p type="p">228(N):晶粒</p>  
        <p type="p">230:部件互連</p>  
        <p type="p">232(1):互連結構</p>  
        <p type="p">232(2):互連結構</p>  
        <p type="p">232(M):互連結構</p>  
        <p type="p">234:通孔</p>  
        <p type="p">236:模塑材料</p>  
        <p type="p">238:第二中介層</p>  
        <p type="p">240:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1860" publication-number="202621145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621145.zip"/>
    </tif-files>
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      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援端對端ＱｏＳ方法</chinese-title>  
        <english-title>METHODS FOR SUPPORTING END TO END QOS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260206B">H04W28/16</main-classification>  
        <further-classification edition="202301120260206B">H04W72/04</further-classification>  
        <further-classification edition="200901120260206B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒　賈亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, JAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑞達　馬提諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREDA, MARTINO M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　祥德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, TUONG DUC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李汶宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MOON-IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由無線傳輸/接收單元(WTRU)執行的用於實現端到端服務品質(QoS)的方法，該方法可以包括從源WTRU接收協定資料單元(PDU)及超額時間指示，以及基於關於通道負載的測量，確定下一跳鏈路的預期潛時。它還可包括：基於所接收的超額時間指示及預期潛時，動態確定下一跳潛時預算，以及基於所確定的下一跳潛時預算，確定用於傳輸所接收的PDU的資源。如果該資源可用，則可以使用所確定的資源在下一跳上傳輸所接收的PDU。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for achieving an end-to-end quality of service (QoS) performed by a wireless transmit/receive unit (WTRU) may include receiving a protocol data unit (PDU) and an excess time indication from a source WTRU, and determining an expected latency for a next hop link based on a measure of channel load. It may also include dynamically determining a next hop latency budget based on the received excess time indication and the expected latency and determining resources for transmitting the received PDU based on the determined next hop latency budget. If the resources are available, the received PDU may be transmitted on the next hop using the determined resources.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CN:核心網路</p>  
        <p type="p">IP:網際網路協定</p>  
        <p type="p">MAC:媒體存取控制</p>  
        <p type="p">PC5:網路中繼</p>  
        <p type="p">PDCP:封包資料會聚協定</p>  
        <p type="p">RLC:無線電鏈路控制</p>  
        <p type="p">UDP:使用者資料包協定</p>  
        <p type="p">WTRU:無線傳輸/接收單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1861" publication-number="202621421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>均勻輻射加熱控制架構的方法及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>METHODS AND NON-TRANSITORY COMPUTER-READABLE MEDIUM OF UNIFORM RADIATION HEATING CONTROL ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="201901120260223B">G06N20/00</further-classification>  
        <further-classification edition="202601120260223B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅　皮瑞森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, PREETHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　蘇拉吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SURAJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚　東明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IU, DONGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞德霍德　沃夫剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADERHOLD, WOLFGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露的實施例包括模型化一快速熱處理(RTP)工具的方法。在一實施例中，該方法包括以下步驟：開發一RTP工具的一燈模型，其中該燈模型包括複數個燈區；計算針對該複數個燈區的一輻射度圖表；將該輻射度圖表中的該複數個燈區的輻射度值乘上一處理配方期間在一給定時間的一現存RTP工具的一功率；將針對該複數個燈區的乘後的該等輻射度值加總以形成該燈模型的一輻射度圖表；使用該輻射度圖表以作為對一機器學習演算法的一輸入；及從該機器學習演算法輸出跨一假設基板的溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include a method of modeling a rapid thermal processing (RTP) tool. In an embodiment, the method comprises developing a lamp model of an RTP tool, wherein the lamp model comprises a ‎plurality of lamp zones, calculating an irradiance graph for the plurality of lamp zones, multiplying irradiance values of the plurality of lamp zones in the irradiance ‎graph by a power of an existing RTP tool at a given time during a process recipe, summing the multiplied irradiance values for the plurality of lamp zones to form ‎an irradiation graph of the lamp model, using the irradiation graph as an input to a machine learning algorithm, and outputting the temperature across a hypothetical substrate from the machine ‎learning algorithm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">690:處理</p>  
        <p type="p">691~697:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1862" publication-number="202620034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620034.zip"/>
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    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種治療Ｂ型肝炎的慢病毒載體、慢病毒顆粒及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C07K14/02</main-classification>  
        <further-classification edition="200601120260210B">C12N15/33</further-classification>  
        <further-classification edition="200601120260210B">C12N7/01</further-classification>  
        <further-classification edition="200601120260210B">A61K39/29</further-classification>  
        <further-classification edition="200601120260210B">A61P31/12</further-classification>  
        <further-classification edition="200601120260210B">A61P31/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海勁威生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI JINWEI BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查尼奧　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARNEAU, PIERRE ALAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布爾吉娜　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOURGINE, MARYLINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仇超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋辛　本傑明　羅伯特　阿爾伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VESIN, BENJAMIN ROBERT ALBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種治療B型肝炎的慢病毒載體和顆粒，該慢病毒載體和顆粒包含B型肝炎病毒抗原的編碼核苷酸序列，B型肝炎病毒抗原較佳為大S抗原，可應用於在有需要的受試者中治療和/或預防B型肝炎病毒感染或治療和/或預防由B型肝炎病毒感染引起的病症的藥物組合物或疫苗中，具有優異的治療和預防效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1863" publication-number="202619717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸入用尼達尼布（ＮＩＮＴＥＤＡＮＩＢ）及尼達尼布鹽類之特定調配之組合物</chinese-title>  
        <english-title>SPECIALLY FORMULATED COMPOSITIONS OF INHALED NINTEDANIB AND NINTEDANIB SALTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/496</main-classification>  
        <further-classification edition="200601120260202B">A61K31/4412</further-classification>  
        <further-classification edition="200601120260202B">A61K9/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾弗林製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVALYN PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒伯　馬克　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURBER, MARK WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲姆　史戴分</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於氣霧化之尼達尼布(nintedanib)及其鹽、吲哚啉酮衍生化合物及其鹽之調配物；及此類調配物用於預防或治療各種纖維化、致癌性、血管及病毒傳染性疾病，包括與肺臟、心臟、腎臟、肝臟、眼部、中樞神經系統及手術部位相關之疾病之用途。本文所描述之調配物及遞送選擇方案可以有效局部遞送尼達尼布或吲哚啉酮衍生化合物或其鹽。方法包括所描述組合物之吸入程序、適應症、及製造過程與用途。亦包括鑑別化合物及可因重新調配及吸入投藥而受益之適應症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are formulations of nintedanib and salts thereof, indolinone derivative compounds and salts thereof for aerosolization and use of such formulations for the prevention or treatment of various fibrotic, carcinogenic, vascular and viral infectious diseases, including diseases associated with the lung, heart, kidney, liver, eye, central nervous system and surgical sites. Formulations and delivery options described herein allow for efficacious local delivery of nintedanib or a indolinone derivative compound or salt thereof. Methods include inhalation procedures, indications and manufacturing processes for production and use of the compositions described. Also included are methods for identifying compounds and indications that benefit by reformulation and inhalation administration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1864" publication-number="202620783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具影像序列一致性之互動影片生成系統及其方法</chinese-title>  
        <english-title>INTERACTIVE VIDEO GENERATION SYSTEM WITH IMAGE SEQUENCE CONSISTENCY AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">G06T11/60</main-classification>  
        <further-classification edition="201301120260223B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智見科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRINTAGE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂兆凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, ZHAO KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘岱樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, TAI HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具影像序列一致化處理之多模態互動二維影片系統及方法：以至少一張參考影像作為互動目標之起始/結束姿態，離線產製多個動作片段並對片段首尾執行影像序列一致化(過渡影格、運動補償重建、幾何對齊、融合、色彩校正之任一或組合)。系統建立可隨時間更新之互動區域資料(如：多邊形像素座標)，執行期接收觸發訊號(包含觸控輸入或聲音特徵)進行判定以選擇反應片段，並同步輸出單句字幕與預先生成之語音音訊；播放期間可忽略後續觸發且結束後回到待機循環。所述互動目標不限於人物，以下以人物為例說明。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a multi-modal interactive two-dimensional video system and method with image sequence consistency processing. At least one reference image is used as a start/end pose of an interactive target, and multiple action clips are generated offline, with image sequence consistency applied to the start and end frames of each clip (including any one or a combination of transition-frame generation, motion-compensated reconstruction, geometric alignment, image blending, and color correction). The system establishes time-updatable interactive region data. During runtime, trigger signals (such as touch inputs or acoustic features) are received and evaluated to select a corresponding reaction clip, and a single subtitle cue and pre-generated audio are synchronously output. Subsequent triggers may be ignored during playback, and upon completion the system returns to an idle loop. The interactive target is not limited to a human subject; a human subject is used as an illustrative example hereinafter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:觸控顯示裝置(觸控面板+顯示)</p>  
        <p type="p">105:聲音接收單元(例如麥克風)</p>  
        <p type="p">110:影片渲染/播放器</p>  
        <p type="p">120:觸控命中判定模組(Hit-Test)</p>  
        <p type="p">125:聲音特徵分析模組(例如聲音指令辨識/特徵擷取)</p>  
        <p type="p">130:互動區域資料庫(polygon roi/label)</p>  
        <p type="p">140:狀態機/片段控制器</p>  
        <p type="p">150:影片片段資料庫(idle/reaction)</p>  
        <p type="p">160:字幕渲染模組</p>  
        <p type="p">170:預寫台詞資料庫(text_i)</p>  
        <p type="p">175:字幕資料庫(cue_i)</p>  
        <p type="p">180:TTS音訊資料庫(audio_i)</p>  
        <p type="p">190:音訊播放器</p>  
        <p type="p">195:顯示輸出</p>  
        <p type="p">196:喇叭輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1865" publication-number="202620491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏡頭裝置</chinese-title>  
        <english-title>LENS DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260209B">G02B7/02</main-classification>  
        <further-classification edition="202301120260209B">H04N23/55</further-classification>  
        <further-classification edition="202301120260209B">H04N23/50</further-classification>  
        <further-classification edition="202101120260209B">G03B17/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾正德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHENG-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泳洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鏡頭裝置，包含電路板、感光元件及鏡頭模組。電路板包含第一面與第二面。感光元件設置於第一面而於第一面形成主區與設置區，其中，設置區相鄰於主區。鏡頭模組設置於感光元件上，鏡頭模組包含透鏡，透鏡包含第一切邊，其中，第一切邊為二個相對應且相互平行之直線邊，鏡頭模組更包含第一裁邊，第一裁邊為二個相對應且相互平行之直線邊，並分別對應於第一切邊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens device includes a circuit board, an image sensor, and a lens module. The circuit board includes a first surface and a second surface. The image sensor is disposed on the first surface and defines a main region and a mounting region on the first surface, wherein the mounting region is adjacent to the main region. The lens module is disposed on the image sensor. The lens module includes a lens, and the lens includes a first cut edge formed by two opposing and parallel straight edges. The lens module further includes a first trimmed edge formed by two opposing and parallel straight edges. The first trimmed edge respectively corresponds to the first cut edge of the lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:鏡頭模組</p>  
        <p type="p">30a:第一裁邊</p>  
        <p type="p">30b:第二裁邊</p>  
        <p type="p">40:電子元件</p>  
        <p type="p">60:填充材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1866" publication-number="202620468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超穎透鏡及光學系統</chinese-title>  
        <english-title>META-LENS AND OPTICAL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G02B3/02</main-classification>  
        <further-classification edition="200601120260209B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林修輊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIU-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘采慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, TSAI-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超穎透鏡，包括基板、多個柱體以及金屬層。該些柱體以陣列形式配置於基板上。金屬層包括多個金屬片，其中該些金屬片分別配置於該些柱體上。當一非偏振光穿透超穎透鏡，金屬層適於改變所述非偏振光的偏振態。一種光學系統亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A meta-lens including a substrate, a plurality of pillars and a metal layer is provided. The pillars are arranged in an array on the substrate. The metal layer includes a plurality of metal sheets, and the metal sheets are respectively disposed on the pillars. When unpolarized light passes through the meta-lens, the metal layer is adapted to change the polarization state of the unpolarized light. An optical system is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:金屬層</p>  
        <p type="p">100C:超穎透鏡</p>  
        <p type="p">101:柱體</p>  
        <p type="p">102:金屬片</p>  
        <p type="p">P1:第一平面</p>  
        <p type="p">P2:第二平面</p>  
        <p type="p">P3:第三平面</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1867" publication-number="202619743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含混合的草藥萃取物的用於預防或治療癌症的藥物組合物和保健機能性食品</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITION AND HEALTH FUNCTIONAL FOOD FOR PREVENTION OR TREATMENT OF CANCER COMPRISING MIXED HERBAL EXTRACT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K36/9066</main-classification>  
        <further-classification edition="200601120260202B">A61K36/74</further-classification>  
        <further-classification edition="200601120260202B">A61K36/185</further-classification>  
        <further-classification edition="200601120260202B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商Ｈ＆Ｏ生化公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>H&amp;O BIOSIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種含有混合萃取物的抗癌藥物組合物或保健機能性食品，具體地說，包括白花蛇舌草、夏枯草、五葉木通、莪朮和鬱金的混合萃取物。本發明的混合萃取物可有效抑制多種癌症中的癌細胞增殖和轉移，因此可有效用作抗癌藥物組合物或抗癌保健機能性食品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an anticancer pharmaceutical composition or health functional food including a mixed extract, and specifically, including a mixed extract of &lt;i&gt;Hedyotis diffusa&lt;/i&gt;, &lt;i&gt;Prunella vulgaris&lt;/i&gt;, &lt;i&gt;Akebia quinata&lt;/i&gt;, &lt;i&gt;Curcuma zedoaria&lt;/i&gt;, and &lt;i&gt;Curcumae Radix&lt;/i&gt;. The mixed extract of the present invention is effective in inhibiting cancer cell proliferation and metastasis in various carcinomas, and thus can be usefully utilized as an anticancer pharmaceutical composition or as an anticancer health functional food.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1868" publication-number="202620037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＧＩＰ／ＧＬＰ１共促效劑化合物</chinese-title>  
        <english-title>GIP/GLP1 CO-AGONIST COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07K14/575</main-classification>  
        <further-classification edition="200601120260202B">C07K14/605</further-classification>  
        <further-classification edition="200601120260202B">A61K38/26</further-classification>  
        <further-classification edition="200601120260202B">A61P3/04</further-classification>  
        <further-classification edition="200601120260202B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞伯拉罕　米拉塔　馬莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABRAHAM, MILATA MARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布魯布　艾克森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABURUB, AKTHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞利西納　佛南德茲　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALSINA-FERNANDEZ, JORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　羅伯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, ROBERT ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡布雷拉　歐佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CABRERA, OVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇斯康　塔莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSKUN, TAMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡明斯　羅伯　查威克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUMMINS, ROBERT CHADWICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達塔　曼楠　亞迷塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATTA-MANNAN, AMITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾沙耶德　穆罕默德　艾沙耶德　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELSAYED, MOHAMED ELSAYED HAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　顯英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, XIANYIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩托　菲尼爾　賈揚提拉勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, PHENIL JAYANTILAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>屈红昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QU, HONGCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史盧波　凱爾　温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLOOP, KYLE WYNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　氏　青　玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, THI THANH HUYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃利斯　詹姆士　林肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALLIS, JAMES LINCOLN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威拉德　法蘭西斯　斯塔福德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLARD, FRANCIS STAFFORD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於對人類葡萄糖依賴性促胰島素多肽(GIP)與升糖素樣肽-1 (GLP-1)受體兩者均具有活性的化合物。本發明亦關於對此等受體中之每一者具有延長之持續作用時間的化合物。另外，本發明係關於可以經口投與的化合物。該等化合物可適用於治療2型糖尿病(「T2DM」)。又，該等化合物可適用於治療肥胖症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to compounds having activity at both the human glucose-dependent insulinotropic polypeptide (GIP) and glucagon-like peptide-1 (GLP-1) receptors. The present invention also relates to compounds having an extended duration of action at each of these receptors. Furthermore, the present invention relates to compounds that may be administered orally. Compounds may be useful in the treatment of type 2 diabetes mellitus (“T2DM”). Also, the compounds may be useful in the treatment of obesity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1869" publication-number="202621052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝信號輸出電路、移位暫存器、半導體裝置、顯示模組及電子裝置</chinese-title>  
        <english-title>PULSE SIGNAL OUTPUT CIRCUIT, SHIFT REGISTER, SEMICONDUCTOR DEVICE, DISPLAY MODULE AND ELECTRIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">H03K19/0175</main-classification>  
        <further-classification edition="200601120260210B">H03K19/094</further-classification>  
        <further-classification edition="201801120260210B">G06F9/30</further-classification>  
        <further-classification edition="200601120260210B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野聖子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, SEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豐高耕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOTAKA, KOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戶英明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠紘慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUNOKI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目標為提供一種可穩定操作之脈衝信號輸出電路，及包括該脈衝信號輸出電路之移位暫存器。依據該所揭露發明之一實施例的脈衝信號輸出電路包括第一至第十電晶體。該第一電晶體之該通道寬度W相對於該通道長度L之該比例W/L，及該第三電晶體之W/L，各大於該第六電晶體之W/L。該第五電晶體之W/L大於該第六電晶體之W/L。該第五電晶體之W/L等於該第七電晶體之W/L。該第三電晶體之W/L大於該第四電晶體之W/L。基於該等結構，可提供一種可穩定操作之脈衝信號輸出電路，及包括該脈衝信號輸出電路之移位暫存器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object is to provide a pulse signal output circuit capable of operating stably and a shift register including the pulse signal output circuit. A pulse signal output circuit according to one embodiment of the disclosed invention includes first to tenth transistors. The ratio &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the channel width &lt;i&gt;W&lt;/i&gt; to the channel length &lt;i&gt;L&lt;/i&gt; of the first transistor and &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the third transistor are each larger than &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the sixth transistor. &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the fifth transistor is larger than &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the sixth transistor. &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the fifth transistor is equal to &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the seventh transistor. &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the third transistor is larger than &lt;i&gt;W&lt;/i&gt;/&lt;i&gt;L&lt;/i&gt; of the fourth transistor. With such a structure, a pulse signal output circuit capable of operating stably and a shift register including the pulse signal output circuit can be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21、22、23、24、25:輸入端子</p>  
        <p type="p">26、27:輸出端子</p>  
        <p type="p">31、32:電源線</p>  
        <p type="p">101、102、103、104、105、106、107、108、109、110、111:電晶體</p>  
        <p type="p">200:脈衝信號產生電路</p>  
        <p type="p">201:第一輸入信號產生電路</p>  
        <p type="p">202:第二輸入信號產生電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1870" publication-number="202621113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、解碼方法、編碼器、解碼器以及儲存媒介</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260209B">H04N19/119</main-classification>  
        <further-classification edition="201401120260209B">H04N19/13</further-classification>  
        <further-classification edition="201401120260209B">H04N19/517</further-classification>  
        <further-classification edition="200601120260209B">G06T9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商ＯＰＰＯ廣東移動通信有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍俊彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周璽樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊付正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉爾順</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種編碼方法、解碼方法、編碼器、解碼器以及儲存媒介，當預測模式參數指示採用GPM確定當前塊的幀間預測值時，確定當前塊的兩個分區；從運動訊息候選清單中，確定兩個分區的運動訊息，將第一和第二運動訊息索引值分別設置為第一和第二分區的運動訊息在運動訊息候選清單中的索引序號值；分別對第一和第二運動訊息索引值進行二值化處理，得到第一符號串和第二符號串；使用不同的上下文概率模型分別對第一符號串和第二符號串的第一個二元符號熵編碼；使用預設模型分別對第一符號串和第二符號串內除第一個二元符號之外的二元符號熵編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S407:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1871" publication-number="202620534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配置事件相機的電子裝置和方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD OF CONFIGURING EVENT CAMERA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260211B">G03B17/02</main-classification>  
        <further-classification edition="202101120260211B">G03B17/48</further-classification>  
        <further-classification edition="202101120260211B">G03B5/00</further-classification>  
        <further-classification edition="202201120260211B">G06V10/56</further-classification>  
        <further-classification edition="200601120260211B">G06F17/10</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡佳正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIAN, JIA-ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種配置事件相機的電子裝置和方法。方法包含：與事件相機的自動對準系統通訊，其中自動對準系統包含光源，其中事件相機包含透鏡以及與透鏡相距一距離的影像感測器；根據影像感測器所擷取的影像決定透鏡之配置距離；以及輸出配置距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a method of configuration an event camera. The method includes: communicating with an active alignment system of an event camera, wherein the active alignment system includes a light source, wherein the event camera includes a lens and an image sensor located at a distance from the lens; determining a configured distance of the lens according to an image captured by the image sensor; and output the configured distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1001,S1002,S1003:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1872" publication-number="202620496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡系統及照相機模組</chinese-title>  
        <english-title>IMAGING LENS SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G02B11/34</main-classification>  
        <further-classification edition="202101120260205B">G02B7/04</further-classification>  
        <further-classification edition="200601120260205B">G02B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立金烏工科大學校產學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMOH NATIONAL INSTITUTE OF TECHNOLOGY INDUSTRY-ACADEMIC COOPERATION FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林台淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, TAE YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弼鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, PHIL HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳在明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JAE MYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像透鏡系統，包括：第一透鏡，具有負折射力；第二透鏡，具有折射力；第三透鏡，具有正折射力；第四透鏡，具有正折射力；第五透鏡，具有負折射力；第六透鏡，具有正折射力；及第七透鏡，具有負折射力，其中所述第一透鏡至所述第七透鏡，自物體側至成像平面依序設置，其中視場寬於85度並且窄於160度，並且其中自所述第一透鏡的物體側表面至成像平面的距離大於6.0毫米且小於9.0毫米，且其中0.6 ＜ R1/ImgHT ＜ 0.7，其中R1是所述第一透鏡的所述物體側表面的曲率半徑，ImgHT是成像平面的高度。一種照相機模組亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens system includes a first lens having negative refractive power, a second lens having refractive power, a third lens having positive refractive power, a fourth lens having positive refractive power, a fifth lens having negative refractive power, a sixth lens having positive refractive power, and a seventh lens having negative refractive power. The first to seventh lens are sequentially disposed from an object side to imaging plane. A field of view is wider than 85 degrees and narrower than 160 degrees. A distance from an object-side surface of the first lens to an imaging plane is greater than 6.0 mm and less than 9.0 mm. 0.6 ＜ R1/ImgHT ＜ 0.7, where R1 is a radius of curvature of an object-side surface of the first lens and ImgHT is a height of the imaging plane. A camera module is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像透鏡系統</p>  
        <p type="p">110:第一透鏡/透鏡</p>  
        <p type="p">120:第二透鏡/透鏡</p>  
        <p type="p">130:第三透鏡/透鏡</p>  
        <p type="p">140:第四透鏡/透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">G1:第一透鏡組</p>  
        <p type="p">G2:第二透鏡組</p>  
        <p type="p">G3:第三透鏡組</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1873" publication-number="202621190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有動態可變緊急閃光模式之個別控制照明元件閃爍的系統與方法及電腦可讀儲存介質</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR INDIVIDUALLY CONTROLLED LIGHT ELEMENT FLASHING WITH DYNAMICALLY VARIABLE EMERGENCY FLASH PATTERNS AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">H05B41/38</main-classification>  
        <further-classification edition="200601120260205B">H05B41/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商惠倫工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHELEN ENGINEERING COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加勒特　迦勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARRETT, CALEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索薩　戴夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUSA, DAVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於提供緊急照明的系統、方法與儲存介質，包括：一控制器生成一驅動控制訊號；一光源接收該驅動控制訊號；該光源基於該驅動控制訊號發射光。該光源的發光強度基於驅動控制訊號以一第一週期反覆地上升和下降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system, method and storage medium for providing an emergency lighting includes generating, by a controller, a driving control signal; receiving, by a light source, the driving control signal; and emitting, by the light source, light based on the driving control signal. Intensity of the light emitted from the light source repeatedly ramps up and ramps down with a first period based on the driving control signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:緊急照明系統</p>  
        <p type="p">10:LED控制系統</p>  
        <p type="p">30:LED陣列</p>  
        <p type="p">100:微控制器</p>  
        <p type="p">110:中央處理單元(CPU)</p>  
        <p type="p">120:記憶體</p>  
        <p type="p">200:PWM驅動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1874" publication-number="202621539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴相俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金南玖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, NAMGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金璟珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GYEONGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種半導體封裝件及其製造方法。所述方法包含：提供封裝襯底，其具有第一表面和與所述第一表面相對的第二表面；將多個導電塊安裝到所述封裝襯底的第一表面上；在所述多個導電塊中的每一者上形成至少一個導電凸塊；在所述封裝襯底的第一表面上形成第一密封劑，以密封所述多個導電塊、和所述多個導電塊中的每一者上的所述導電凸塊；以及研磨所述第一密封劑以移除所述第一密封劑的上部部分、和所述多個導電塊中的每一者上的所述導電凸塊的上部部分，使得所述多個導電塊中的每一者上的所述導電凸塊的暴露表面相對於所述封裝襯底的第一表面處於相同高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:封裝襯底</p>  
        <p type="p">230-1:第一導電塊</p>  
        <p type="p">230-2:第二導電塊</p>  
        <p type="p">235-1:第一焊料凸塊</p>  
        <p type="p">235-2:第二焊料凸塊</p>  
        <p type="p">236:焊料凸塊</p>  
        <p type="p">240:第一電子元件</p>  
        <p type="p">250:第一密封劑</p>  
        <p type="p">260:第二電子元件</p>  
        <p type="p">270:第二密封劑</p>  
        <p type="p">280:遮罩件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1875" publication-number="202620500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G02B13/00</main-classification>  
        <further-classification edition="200601120260205B">G02B9/64</further-classification>  
        <further-classification edition="200601120260205B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張東赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DONG HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴一容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, IL YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學成像系統。光學成像系統包含：自物側至成像側依次配置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡以及第八透鏡，其中第一透鏡具有正折射能力，且第二透鏡具有負折射能力，其中第一透鏡至第八透鏡中的至少一個透鏡由玻璃形成，且剩餘透鏡由塑膠形成，且滿足TTL/(2×IMG HT) ＜ 0.6，其中TTL是指在光軸上自第一透鏡的物側表面至成像平面的距離，且IMG HT是指成像平面的對角線長度的一半。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system is provided. The optical imaging system includes: a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens and an eighth lens, which are arranged in order from an object side to an imaging side, wherein the first lens has positive refractive power and the second lens has negative refractive power, wherein at least one lens of the first lens to the eighth lens is formed of glass, and the remaining lenses are formed of plastic, and TTL/(2×IMG HT) ＜ 0.6 is satisfied, where TTL indicates a distance on an optical axis from an object-side surface of the first lens to an imaging plane, and IMG HT indicates half a diagonal length of the imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">190:濾光片</p>  
        <p type="p">191:成像平面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1876" publication-number="202620495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G02B11/32</main-classification>  
        <further-classification edition="202101120260205B">G02B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白在鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAIK, JAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：第一透鏡，具有正的屈光度；第二透鏡，具有正的屈光度；第三透鏡，具有正的屈光度；第四透鏡，具有負的屈光度；第五透鏡，具有正的屈光度，其中所述第五透鏡的物側面是凹的；以及第六透鏡，具有負的屈光度，其中所述第六透鏡具有形成於其像側面上的反曲點，其中所述第一透鏡至所述第六透鏡自物側朝成像平面依序設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens having a positive refractive power, a second lens having a positive refractive power, a third lens having a positive refractive power, a fourth lens having a negative refractive power, a fifth lens having a positive refractive power, wherein an object-side surface of the fifth lens is concave; and a sixth lens having a negative refractive power, wherein the sixth lens has an inflection point formed on an image-side surface thereof, wherein the first to sixth lenses are sequentially disposed from an object side toward an imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:濾波器</p>  
        <p type="p">180:成像平面</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1877" publication-number="202620501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡系統</chinese-title>  
        <english-title>IMAGING LENS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">G02B13/00</main-classification>  
        <further-classification edition="200601120260204B">G02B13/18</further-classification>  
        <further-classification edition="200601120260204B">G02B3/00</further-classification>  
        <further-classification edition="200601120260204B">G02B5/04</further-classification>  
        <further-classification edition="202101120260204B">G02B7/02</further-classification>  
        <further-classification edition="200601120260204B">G02B11/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, JAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭有鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, YOU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁召渼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SO MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種成像透鏡系統。所述成像透鏡系統包括：透鏡群組，包括多個透鏡；以及光學路徑轉換構件，設置於透鏡群組與成像平面之間。透鏡群組可包括自物體側朝向成像平面依序設置的第一透鏡、第二透鏡、第三透鏡及第四透鏡。光學路徑轉換構件可將自透鏡群組發射的光反射二或更多次以增大透鏡群組的後焦距（或者自設置於透鏡群組的最後側上的透鏡的影像側表面至成像平面的距離）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens system is provided. The imaging lens system includes a lens group including a plurality of lenses; and an optical path conversion member disposed between the lens group and an imaging plane. The lens group may include a first lens, a second lens, a third lens, and a fourth lens sequentially disposed from an object side toward the imaging plane. The optical path conversion member may reflect light emitted from the lens group two or more times to increase a rear focal length of the lens group (or a distance from an image-side surface of a lens disposed on a rearmost side of the lens group to the imaging plane).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像透鏡系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">IF:濾光器</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p>  
        <p type="p">LG:透鏡群組</p>  
        <p type="p">P:稜鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1878" publication-number="202621519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title>A SEMICONDUCTOR STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W72/20</main-classification>  
        <further-classification edition="200601120260223B">G11C11/4193</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡秀之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態提供一種可削減動作電流之半導體記憶裝置。 &lt;br/&gt;實施形態之半導體記憶裝置之第1讀出動作包含：第1讀出通路電壓供給動作，其對第1導電層供給讀出通路電壓；第1讀出電壓供給動作，其對第1導電層供給小於讀出通路電壓之讀出電壓；及第2讀出通路電壓供給動作，其對第1導電層供給讀出通路電壓。第2讀出動作包含：第2讀出電壓供給動作，其對與第1導電層相同或不同之第2導電層供給讀出電壓；及第3讀出通路電壓供給動作，其對第2導電層供給讀出通路電壓。連續執行第1讀出動作及第2讀出動作，於第2讀出通路電壓供給動作執行中至第3讀出通路電壓供給動作結束之期間，將與第1導電層或第2導電層不同之複數個第1非選擇導電層之電壓維持為讀出通路電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Add:資料</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLKy:記憶體區塊</p>  
        <p type="p">CS&lt;sub&gt;R1&lt;/sub&gt;:指令集</p>  
        <p type="p">CS&lt;sub&gt;R2&lt;/sub&gt;(1):指令集</p>  
        <p type="p">CS&lt;sub&gt;R2&lt;/sub&gt;(2):指令集</p>  
        <p type="p">CS&lt;sub&gt;R2&lt;/sub&gt;(3):指令集</p>  
        <p type="p">I&lt;sub&gt;CC&lt;/sub&gt;:動作電流</p>  
        <p type="p">LP:下級位元</p>  
        <p type="p">MP:中級位元</p>  
        <p type="p">MPx:記憶體平面</p>  
        <p type="p">MSn:記憶體串</p>  
        <p type="p">Pre:資料</p>  
        <p type="p">RBn:端子</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">T1:時間</p>  
        <p type="p">T2:時間</p>  
        <p type="p">T3:時間</p>  
        <p type="p">t301~t323:時序</p>  
        <p type="p">UP:上級位元</p>  
        <p type="p">V&lt;sub&gt;CGAR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGBR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGCR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGDR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGER&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGFR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;CGGR&lt;/sub&gt;:讀出電壓</p>  
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:供給電壓</p>  
        <p type="p">V&lt;sub&gt;READ&lt;/sub&gt;:讀出通路電壓</p>  
        <p type="p">V&lt;sub&gt;READK&lt;/sub&gt;:讀出通路電壓</p>  
        <p type="p">V&lt;sub&gt;READL&lt;/sub&gt;:讀出通路電壓</p>  
        <p type="p">V&lt;sub&gt;SS&lt;/sub&gt;:接地電壓</p>  
        <p type="p">V&lt;sub&gt;SRC&lt;/sub&gt;:供給電壓</p>  
        <p type="p">WLm:字元線</p>  
        <p type="p">WL&lt;sub&gt;S&lt;/sub&gt;:選擇字元線(第1導電層、第2導電層、第3導電層)</p>  
        <p type="p">WL&lt;sub&gt;U1&lt;/sub&gt;:非選擇字元線</p>  
        <p type="p">WL&lt;sub&gt;U2&lt;/sub&gt;:非選擇字元線</p>  
        <p type="p">WL&lt;sub&gt;U3&lt;/sub&gt;:非選擇字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1879" publication-number="202619779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102782</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過濾器洗淨系統、過濾器洗淨方法及減壓機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B01D29/62</main-classification>  
        <further-classification edition="202601120260223B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大優樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穴本篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANAMOTO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小宮洋司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMIYA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題係可有效地洗淨基板液處理裝置中使用之前的過濾器。 &lt;br/&gt;　　解決手段的本發明所致之過濾器洗淨系統，係具備貯留部、送液路徑、循環路徑、第1供給部、第2供給部。貯留部係貯留通液於過濾器的液體。送液路徑係將貯留於貯留部的液體送至前述過濾器。循環路徑係將從過濾器送出的液體送回貯留部。第1供給部係對於貯留部，供給第1液。第2供給部係對於貯留部，供給表面張力比第1液小，且具有與第1液之親和性的第2液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is described a method of decoding video data from a bitstream. The bitstream comprising video data corresponding to one or more slices. The decoding comprises parsing the syntax elements, and not permitting use of a subpicture and/or parsing of subpicture information in combination with at least one syntax element that indicates that a picture to be decoded contains only one slice. The bitstream is decoded using said syntax elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:過濾器洗淨系統</p>  
        <p type="p">2:貯留部</p>  
        <p type="p">3:送液路徑</p>  
        <p type="p">4:循環路徑</p>  
        <p type="p">5:第1供給部</p>  
        <p type="p">6:第2供給部</p>  
        <p type="p">7:減壓機構</p>  
        <p type="p">8:控制裝置</p>  
        <p type="p">31:分路路徑</p>  
        <p type="p">32:排液路徑</p>  
        <p type="p">41:第1循環路徑</p>  
        <p type="p">42:第2循環路徑</p>  
        <p type="p">51:DIW供給源</p>  
        <p type="p">52:第1供給路徑</p>  
        <p type="p">61:IPA供給源</p>  
        <p type="p">62:第2供給路徑</p>  
        <p type="p">71:槽</p>  
        <p type="p">72:分歧路徑</p>  
        <p type="p">73:分歧路徑</p>  
        <p type="p">74:大氣開放路徑</p>  
        <p type="p">75:排氣裝置</p>  
        <p type="p">81:控制部</p>  
        <p type="p">82:記憶部</p>  
        <p type="p">100:過濾器</p>  
        <p type="p">160:排液路徑</p>  
        <p type="p">201:閥</p>  
        <p type="p">202:閥</p>  
        <p type="p">203:閥</p>  
        <p type="p">204:閥</p>  
        <p type="p">205:閥</p>  
        <p type="p">206:閥</p>  
        <p type="p">207:閥</p>  
        <p type="p">208:閥</p>  
        <p type="p">209:閥</p>  
        <p type="p">210:閥</p>  
        <p type="p">211:閥</p>  
        <p type="p">212:閥</p>  
        <p type="p">213:閥</p>  
        <p type="p">311:泵</p>  
        <p type="p">312:加熱部</p>  
        <p type="p">711:排液路徑</p>  
        <p type="p">751:排氣路徑</p>  
        <p type="p">DIW:去離子水</p>  
        <p type="p">IPA:異丙醇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1880" publication-number="202620687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於曲線與直線佈線的方法、機器可讀取媒體、系統及電腦程式產品</chinese-title>  
        <english-title>METHOD, MACHINE READABLE MEDIUM, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR CURVILINEAR AND RECTILINEAR ROUTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260210B">G06F30/392</main-classification>  
        <further-classification edition="202501120260210B">H10D89/10</further-classification>  
        <further-classification edition="202001320260210B">G06F115/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ２Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一些實施例提供具有新型的非較佳方向（non-preferred direction，NPD）配線架構的積體電路。在一些實施例中，積體電路包含基板及多個配線層。該些配線層包含具有非較佳配線方向的第一組的一或多個配線層及具有較佳配線方向的第二組的一或多個配線層。在一些實施例中，第一組的配線層包含第三及第四層，而第二組的配線層包含第五及更高的金屬層，且連續的鄰近層具有不同的（例如交替的）較佳配線方向。其他實施例中的第一組的配線層包含第三配線層而不包含第四配線層，且在此實施例中第四配線層具有較佳配線方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments of the invention provide an integrated circuit (IC) that has a novel non-preferred direction (NPD) wiring architecture. In some embodiments, the IC includes a substrate and multiple wiring layers, which include a first set of one or more wiring layers with no preferred wiring directions, and a second set of one or more wiring layers with preferred wiring directions. In some embodiments, the first set of wiring layers includes the third and fourth wiring layers, while the second set of wiring layers includes the fifth and higher metal layers with successive neighboring layers having different (e.g., alternating) preferred wiring directions. The first set of wiring layers in other embodiments includes the third wiring layer but not the fourth wiring layer, which in these embodiments has a preferred wiring direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:流程</p>  
        <p type="p">805~810:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1881" publication-number="202619745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＣＮＰ綴合物的乾燥藥物製劑</chinese-title>  
        <english-title>DRY PHARMACEUTICAL FORMULATIONS OF CNP CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">A61K38/22</main-classification>  
        <further-classification edition="200601120260210B">A61K47/18</further-classification>  
        <further-classification edition="200601120260210B">A61K47/36</further-classification>  
        <further-classification edition="200601120260210B">A61K9/14</further-classification>  
        <further-classification edition="200601120260210B">A61P25/00</further-classification>  
        <further-classification edition="200601120260210B">A61P35/00</further-classification>  
        <further-classification edition="200601120260210B">A61P37/00</further-classification>  
        <further-classification edition="200601120260210B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商阿森迪斯藥物生長障礙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENDIS PHARMA GROWTH DISORDERS A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯堪德斯　安雅　Ｒ　　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKANDS, ANJA R. H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫澤爾　烏爾海西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERSEL, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>品霍爾特　夏洛特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINHOLT, CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海尼格　斯特凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEINIG, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種乾燥藥物製劑，其中所述藥物製劑包含CNP綴合物、緩衝劑和填充劑，且其中所述CNP綴合物包含共價和可逆地綴合至聚合物部分的CNP部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dry pharmaceutical formulation, wherein the pharmaceutical formulation comprises a CNP conjugate, a buffering agent and a bulking agent and wherein the CNP conjugate comprises a CNP moiety that is covalently and reversibly conjugated to a polymeric moiety</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1882" publication-number="202620226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成閘極電極結構之方法、形成包括氮化鉻層的結構之方法以及系統、包括氮化鉻層之結構</chinese-title>  
        <english-title>METHOD OF FORMING GATE ELECTRODE STRUCTURE, METHOD AND SYSTEM OF FORMING STRUCTURE INCLUDING CHROMIUM NITRIDE LAYER, AND STRUCTURE INCLUDING THE CHROMIUM NITRIDE LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C23C16/34</main-classification>  
        <further-classification edition="200601120260204B">C23C16/455</further-classification>  
        <further-classification edition="200601120260204B">C23C16/52</further-classification>  
        <further-classification edition="202501120260204B">H10D64/66</further-classification>  
        <further-classification edition="200601120260204B">C09B45/06</further-classification>  
        <further-classification edition="202501120260204B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希羅　艾瑞克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERO, ERIC JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德茲拉　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZELAH, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾尼　吉賽佩　亞雷西歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERNI, GIUSEPPE ALESSIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷薩寧　皮特里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAISANEN, PETRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示者係用於在基材表面上沉積氮化鉻層的方法和系統以及使用揭示之方法所形成的結構和裝置。一例示性方法包括了使用沉積製程，在基材的表面上沉積氮化鉻層。沉積製程可包括：提供鉻前驅物至反應室以及分開地提供氮反應物至反應室。沉積製程可係一熱循環沉積製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for depositing chromium nitride layers onto a surface of the substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a deposition process, depositing a chromium nitride layer onto a surface of the substrate. The deposition process can include providing a chromium precursor to the reaction chamber and separately providing a nitrogen reactant to the reaction chamber. The deposition process may be a thermal cyclical deposition process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102,104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1883" publication-number="202620832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動顯示面板上之複數個發光二極體之掃描電路</chinese-title>  
        <english-title>SCAN CIRCUIT APPLICABLE TO DRIVING A PLURALITY OF LIGHT-EMITTING-DIODES (LED) OF A DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260204B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱岷洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, MIN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬佑昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晉毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宣佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程智修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JHIH-SIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適於驅動顯示面板上之複數個發光二極體之掃描電路，其中，顯示面板上之每一條掃描線係電性耦接一開關元件，多個電晶體元件係對應顯示面板之多條掃描線設置，使每一電晶體元件連接於一掃描線與接地端之間。多個開關元件之共同接點係可選地電連接於一低壓差穩壓器或一全域運算放大器，該低壓差穩壓器或全域運算放大器係通過該些開關元件可選地輸出電壓到至少一條掃描線。通過採用本發明，可有效解決習知鬼影與顯示面板上訊號耦合的問題，同時大幅降低冗餘的功率浪費。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scan circuit applicable to driving a plurality of light-emitting-diodes of a display panel is provided. Each of a plurality of switching components is electrically connected with a scan line of the display panel. A plurality of power transistors are disposed corresponding to the scan lines, each connected between one scan line and a ground terminal. A low-dropout regulator circuit or global operational amplifier is alternatively connected to the plurality of switching components in common for generating an output voltage selectively to at least one of the scan lines. By employing the proposed scan circuit, the invention is effective in achieving de-ghost functioning and avoiding conventional signal coupling issues on the display panel. In addition, redundant power waste consumption is significantly reduced at the same time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Scan1、Scan2、ScanM:掃描線</p>  
        <p type="p">IOUT1、IOUT2、IOUTN:通道線</p>  
        <p type="p">LED11、LED12、LED1N、LED21、LED22、LED2N、LEDM1、LEDM2、LEDMN:發光二極體</p>  
        <p type="p">SW1、SW2、SWM:開關元件</p>  
        <p type="p">M1、M2、MM:電晶體元件</p>  
        <p type="p">LDO:低壓差穩壓器</p>  
        <p type="p">300:掃描電路</p>  
        <p type="p">303:通道電路</p>  
        <p type="p">1A:發光二極體顯示面板</p>  
        <p type="p">GND:接地端</p>  
        <p type="p">Q1:共同接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1884" publication-number="202620382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於配置在測量腔體上的感測器配置、鑑定遮罩的設備以及鑑定遮罩的方法</chinese-title>  
        <english-title>SENSOR ARRANGEMENT FOR ARRANGEMENT ON A MEASUREMENT CHAMBER, APPARATUS FOR QUALIFYING A MASK AND METHOD FOR QUALIFYING A MASK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G01D11/24</main-classification>  
        <further-classification edition="200601120260210B">G03F7/00</further-classification>  
        <further-classification edition="200601120260210B">G03F7/20</further-classification>  
        <further-classification edition="200601120260210B">G01D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克波姆　鹿茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREKERBOHM, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬泰卡　尤瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEJKA, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種用於配置在測量腔體（540）上的感測器配置（100、200、300、500）。該感測器配置（100、200、300、500）包含一感測器（124、224、324、524）、一進氣口（131、231、331）及一出口（132、232、332、532）。該感測器配置（100、200、300、500）包含在該進氣口（131、231、331）與該出口（132、232、332、532）之間的一流體連通部（133、233、333）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention proposes a sensor arrangement (100; 200; 300; 500) for arrangement on a measurement chamber (540). The sensor arrangement (100; 200; 300; 500) comprises a sensor (124; 224; 324; 524), an intake opening (131; 231; 331) and an outlet (132; 232; 332; 532). The sensor arrangement (100; 200; 300; 500) comprises a fluid connection (133; 233; 333) between the intake opening (131; 231; 331) and the outlet (132; 232; 332; 532).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感測器配置</p>  
        <p type="p">110:第二段</p>  
        <p type="p">120:電子單元</p>  
        <p type="p">121:承載板</p>  
        <p type="p">122:感測器載體</p>  
        <p type="p">123:黏合層</p>  
        <p type="p">124:感測器</p>  
        <p type="p">126:排氣</p>  
        <p type="p">131:進氣口</p>  
        <p type="p">132:出口</p>  
        <p type="p">133:流體連通部</p>  
        <p type="p">134:第一空腔</p>  
        <p type="p">135:第二空腔</p>  
        <p type="p">137:第一連通元件</p>  
        <p type="p">139:第二連通元件</p>  
        <p type="p">141:通道</p>  
        <p type="p">142:平面</p>  
        <p type="p">143:感測器裝置的第一殼體</p>  
        <p type="p">190:第一段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1885" publication-number="202620497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G02B11/34</main-classification>  
        <further-classification edition="200601120260209B">G02B3/00</further-classification>  
        <further-classification edition="202101120260209B">G02B7/02</further-classification>  
        <further-classification edition="200601120260209B">G02B13/18</further-classification>  
        <further-classification edition="200601120260209B">G02B3/02</further-classification>  
        <further-classification edition="200601120260209B">G02B9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張相鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡、第九透鏡、第十透鏡及第十一透鏡，沿著光軸自光學成像系統的物體側朝向光學成像系統的成像表面依次依序排列，其中第一透鏡具有正的折射力，第二透鏡具有負的折射力，第一透鏡至第四透鏡之中的沿著光軸依序排列的至少兩個透鏡具有小於38的阿貝數，且滿足TTL/(2×IMG HT) ＜ 0.660，其中TTL是沿著光軸自第一透鏡的物體側表面至成像表面的距離，且IMG HT是成像表面的對角線長度的一半。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, a tenth lens, and an eleventh lens sequentially arranged in order along an optical axis from an object side of the optical imaging system toward an imaging surface of the optical imaging system, wherein the first lens has a positive refractive power, the second lens has a negative refractive power, at least two lenses sequentially arranged along the optical axis among the first lens to the fourth lens have an Abbe number of less than 38, and TTL/(2×IMG HT) ＜ 0.660 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging surface, and IMG HT is one half of a diagonal length of the imaging surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">101:第一透鏡</p>  
        <p type="p">102:第二透鏡</p>  
        <p type="p">103:第三透鏡</p>  
        <p type="p">104:第四透鏡</p>  
        <p type="p">105:第五透鏡</p>  
        <p type="p">106:第六透鏡</p>  
        <p type="p">107:第七透鏡</p>  
        <p type="p">108:第八透鏡</p>  
        <p type="p">109:第九透鏡</p>  
        <p type="p">110:第十透鏡</p>  
        <p type="p">111:第十一透鏡</p>  
        <p type="p">112:濾光器</p>  
        <p type="p">113:成像表面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1886" publication-number="202620502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">G02B13/00</main-classification>  
        <further-classification edition="200601120260204B">G02B13/18</further-classification>  
        <further-classification edition="200601120260204B">G02B9/64</further-classification>  
        <further-classification edition="200601120260204B">G02B11/34</further-classification>  
        <further-classification edition="202101120260204B">G02B7/02</further-classification>  
        <further-classification edition="200601120260204B">G02B3/00</further-classification>  
        <further-classification edition="202101120260204B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫住和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JU HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弼鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, PHIL HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統。所述光學成像系統包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡和第八透鏡，從物體側朝向成像平面依序排列。其中第一透鏡具有正屈光度，且第二透鏡具有負屈光度。其中第二透鏡和第三透鏡各自具有大於1.66的折射率，且所述光學成像系統滿足以下條件表達式：TTL/(2×IMG HT) ＜ 0.64，其中TTL為第一透鏡的物側表面到成像平面的光軸上的距離，IMG HT 為成像平面對角線長度的一半。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens, sequentially arranged from an object side toward an imaging plane, wherein the first lens has positive refractive power, and the second lens has negative refractive power, wherein the second lens and the third lens each have refractive indices that are greater than 1.66, and wherein the optical imaging system satisfies the following conditional expression: TTL/(2×IMG HT) ＜ 0.64, where TTL is a distance on an optical axis from an object-side surface of the first lens to the imaging plane, and IMG HT is half a diagonal length of the imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">190:濾波器</p>  
        <p type="p">191:成像平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1887" publication-number="202620503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>3D成像鏡頭</chinese-title>  
        <english-title>THREE-DIMENSION IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G02B13/00</main-classification>  
        <further-classification edition="200601120260209B">G02B9/12</further-classification>  
        <further-classification edition="200601120260209B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘采慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, TSAI-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUAN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種3D成像鏡頭，沿著光軸依序包括第一透鏡、第二透鏡、第三透鏡以及偏振元件。第一透鏡具有負的屈光度。第二透鏡具有正的屈光度。第三透鏡具有正的屈光度。偏振元件包括多個光學單元。各光學單元包括第一偏振結構、第二偏振結構以及第三偏振結構。當光穿透第一偏振結構，產生第一線偏振光；當光穿透第二偏振結構，產生第二線偏振光；當光穿透第三偏振結構，產生第三線偏振光。第一線偏振光、第二線偏振光以及第三線偏振光彼此不平行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimension imaging lens including a first lens element, a second lens element, a third lens element and a polarizing element in sequence along an optical axis is provided. The first lens element has a negative refractive power. The second lens element has a positive refractive power. The third lens element has a positive refractive power. The polarizing element includes multiple optical units. Each optical unit includes a first polarization structure, a second polarization structure and a third polarization structure. When light passes through the first polarization structure, a first linear polarization light is formed. When light passes through the second polarization structure, a second linear polarization light is formed. When light passes through the third polarization structure, a third linear polarization light is formed. The first linear polarization light, the second linear polarization light and the third linear polarization light are not parallel to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:3D成像鏡頭</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">111、121、141、151:物側面</p>  
        <p type="p">112、122、142、152:像側面</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:光圈</p>  
        <p type="p">140:第三透鏡</p>  
        <p type="p">150:偏振元件</p>  
        <p type="p">160:成像面</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1888" publication-number="202619649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可拆卸式軟物件之兒童運載裝置及腿部耦合器</chinese-title>  
        <english-title>CHILD CARRIAGE WITH REMOVABLE SOFT GOODS AND LEG COUPLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">A47D13/02</main-classification>  
        <further-classification edition="200601120260205B">B62B7/06</further-classification>  
        <further-classification edition="200601120260205B">B62B9/12</further-classification>  
        <further-classification edition="200601120260205B">B62B9/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈滕斯汀　柯爾提絲　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTENSTINE, CURTIS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍斯特　安德魯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORST, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兒童運載裝置，包含：運載裝置框架，配置為支撐可拆卸的兒童座椅於行駛表面上方，運載裝置框架包括下框架部，下框架部包括至少一前腿部、第一後腿部及第二後腿部；以及軟物件座椅組件，配置為可拆卸地耦合至下框架部，軟物件座椅組件包括：軟物件座椅，具有椅背及座盤，座盤於座椅彎折處自椅背延伸出；以及第一腿部耦合器及第二腿部耦合器，分別設置於軟物件座椅之第一側及第二側，且配置為分別可拆卸地附接至第一後腿部及第二後腿部，以將座椅彎折處耦合至第一後腿部及第二後腿部。本文所述之實施例亦包含一種用於將軟物件座椅組件可拆卸地附接至兒童運載裝置框架之腿部耦合器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child carriage includes: a carriage frame configured to support a removable child seat above a riding surface, the carriage frame comprising a lower frame portion comprising at least one front leg, a first rear leg, and a second rear leg; and a soft goods seat assembly configured to removably couple to the lower frame, the soft goods seat assembly comprising: a soft goods seat having a seatback and a seat pan that extends from the seatback at a seat bight; and a first leg coupler and a second leg coupler disposed at first and second sides of the soft goods seat, respectively, and configured to removably attach to the first and second rear legs, respectively, so as to couple the seat bight to the first and second rear legs. Embodiments described herein also include a leg coupler for removably attaching a soft goods seat assembly to a child carriage frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:兒童運載裝置</p>  
        <p type="p">100、100':運載裝置框架</p>  
        <p type="p">132(1)、132(2):折疊轂</p>  
        <p type="p">134:扶手</p>  
        <p type="p">200:軟物件座椅組件</p>  
        <p type="p">201:軟物件座椅</p>  
        <p type="p">202:椅背</p>  
        <p type="p">204:座盤</p>  
        <p type="p">204a:座椅彎折處</p>  
        <p type="p">204b:前端</p>  
        <p type="p">206(1)、206(2):側壁</p>  
        <p type="p">208:腿墊</p>  
        <p type="p">300:頂篷</p>  
        <p type="p">400:束縛帶</p>  
        <p type="p">401:胯扣</p>  
        <p type="p">402、404:繫帶</p>  
        <p type="p">406:胯帶</p>  
        <p type="p">700:籃子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1889" publication-number="202620380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示來自可穿戴設備的方向視覺指示符以進行導航</chinese-title>  
        <english-title>DISPLAYING DIRECTIONAL VISUAL INDICATORS FROM A WEARABLE DEVICE FOR NAVIGATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">G01C21/20</main-classification>  
        <further-classification edition="200601120260206B">G01C21/36</further-classification>  
        <further-classification edition="200601120260206B">G06F3/14</further-classification>  
        <further-classification edition="201301120260206B">G04G21/04</further-classification>  
        <further-classification edition="200601120260206B">G06F1/16</further-classification>  
        <further-classification edition="201901120260206B">G06F1/3212</further-classification>  
        <further-classification edition="200601120260206B">G04G9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法達力　賽克里斯納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VADALI, SAI KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法特　蘇德哈拉尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VATTE, SUDHA RANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙荷　海蒙格傑恩特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, HEMANG JAYANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案內容提供了用於顯示可穿戴設備外部的方向視覺指示符以進行導航的系統、方法和裝置，其包括編碼在電腦可讀取媒體上的電腦程式。在一些態樣中，當可穿戴設備處於導航模式時，可穿戴設備可以接收導航訊號。導航訊號可以指示行進方向。可穿戴設備可以顯示與行進方向相對應的第一方向視覺指示符。第一方向視覺指示符可以顯示在可穿戴設備外部，指示行進方向是第一方向。第一方向視覺指示符可以是在行進方向上在可穿戴設備外部顯示的方向光或方向投影。若行進方向從第一方向改變為第二方向，則可穿戴設備可以顯示第二方向視覺指示符，該第二方向視覺指示符指示行進方向是第二方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides systems, methods, and apparatus, including computer programs encoded on computer-readable media, for displaying directional visual indicators external to a wearable device for navigation. In some aspects, a wearable device may receive navigation signals while the wearable device is in a navigation mode. The navigation signals may indicate a direction of travel. The wearable device may display a first directional visual indicator corresponding to the direction of travel. The first directional visual indicator may be displayed external to the wearable device indicating the direction of travel is a first direction. The first directional visual indicator may be a directional light or a directional projection displayed external to the wearable device in the direction of travel. If the direction of travel changes from the first direction to a second direction, the wearable device may display a second directional visual indicator indicating the direction of travel is the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:衛星</p>  
        <p type="p">200:無線通訊網路</p>  
        <p type="p">212:導航單元</p>  
        <p type="p">214:顯示模組</p>  
        <p type="p">220:可穿戴設備</p>  
        <p type="p">221:顯示器</p>  
        <p type="p">223:第一部分</p>  
        <p type="p">225:第二部分</p>  
        <p type="p">227:第三部分</p>  
        <p type="p">229:第四部分</p>  
        <p type="p">250:方向視覺指示符</p>  
        <p type="p">250A:方向視覺指示符</p>  
        <p type="p">250B:方向視覺指示符</p>  
        <p type="p">250C:方向視覺指示符</p>  
        <p type="p">250D:方向視覺指示符</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1890" publication-number="202619886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置封裝</chinese-title>  
        <english-title>OPTICAL DEVICE PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260223B">B32B7/023</main-classification>  
        <further-classification edition="200601120260223B">G02B6/12</further-classification>  
        <further-classification edition="202601120260223B">H10P72/50</further-classification>  
        <further-classification edition="202601120260223B">H10W76/10</further-classification>  
        <further-classification edition="202601120260223B">H10W76/13</further-classification>  
        <further-classification edition="202601120260223B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王盟仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MENG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡裕方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊孟融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學裝置封裝，其包含：一載體，其具有一第一表面及相對於該第一表面凹入之一第二表面；及一蓋，其安置於該載體之該第二表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學裝置封裝</p>  
        <p type="p">10:載體</p>  
        <p type="p">11:重佈結構</p>  
        <p type="p">12:電連接件</p>  
        <p type="p">13:囊封體</p>  
        <p type="p">14:半導體裝置</p>  
        <p type="p">15:光學元件</p>  
        <p type="p">16:底部填充層</p>  
        <p type="p">17:蓋</p>  
        <p type="p">18:濾光片材料</p>  
        <p type="p">19:黏著劑</p>  
        <p type="p">111:表面</p>  
        <p type="p">112:表面</p>  
        <p type="p">131:表面</p>  
        <p type="p">132:表面</p>  
        <p type="p">133:側表面</p>  
        <p type="p">135:側表面</p>  
        <p type="p">141:凸塊</p>  
        <p type="p">151:導線</p>  
        <p type="p">171:頂表面</p>  
        <p type="p">172:表面</p>  
        <p type="p">173:側表面</p>  
        <p type="p">175:孔隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1891" publication-number="202619748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸突損傷之預防</chinese-title>  
        <english-title>PREVENTION OF AXONAL DAMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">A61K39/395</main-classification>  
        <further-classification edition="200601120260210B">A61K39/00</further-classification>  
        <further-classification edition="200601120260210B">C07K16/18</further-classification>  
        <further-classification edition="200601120260210B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商梅迪繆思有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIMMUNE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝林　克雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERING, CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希姆斯　約翰　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMS, JOHN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達格　傑弗瑞　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAGE, JEFFREY L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於神經元軸突損傷之預防。更特定言之，本發明係關於使用選擇性地結合人類類澱粉蛋白β1-42肽(Aβ1-42)之結合成員預防神經元軸突損傷，其中用該結合成員處理患者會降低患者中之神經絲輕鏈(NfL)的含量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the prevention of neuronal axonal damage. More particularly, the present invention relates to the prevention neuronal axonal damage using binding members that selectively bind human amyloid beta 1-42 peptide (Aβ1- 42), wherein the treatment of a patient with said binding member decreases the level of neurofilament light chain (NfL) in patients.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1892" publication-number="202620077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性元件、及光阻圖案之形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">C08F212/08</main-classification>  
        <further-classification edition="200601120260205B">C08F220/06</further-classification>  
        <further-classification edition="200601120260205B">C08F220/10</further-classification>  
        <further-classification edition="200601120260205B">G03F7/004</further-classification>  
        <further-classification edition="200601120260205B">G03F7/027</further-classification>  
        <further-classification edition="200601120260205B">G03F7/20</further-classification>  
        <further-classification edition="200601120260205B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古谷創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTANI, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龜山奈央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEYAMA, NAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性元件，其係具備支撐膜、及含有感光性樹脂組成物之感光層；&lt;br/&gt; 前述感光性樹脂組成物，係含有以下成分：&lt;br/&gt; （A）鹼可溶性高分子，&lt;br/&gt; （B）具有乙烯性不飽和雙鍵之化合物，&lt;br/&gt; （C）聯咪唑光聚合起始劑；&lt;br/&gt; 前述（C）成分相對於該感光性樹脂組成物之所有固體成分質量含有5.0質量%以上；前述感光層之膜厚25μm之波長365nm之吸光度（Y）係0.35以下；佔前述吸光度（Y）之前述（C）成分之吸光度之貢獻度（X）係40%以上；前述貢獻度（X），藉由式（1）所計算。&lt;br/&gt; 　X（%）= 100×εc/感光層之吸光度（Y） ･･･ （1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1893" publication-number="202620937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01J37/32</main-classification>  
        <further-classification edition="200601120260223B">H05H1/46</further-classification>  
        <further-classification edition="200601120260223B">C23C16/46</further-classification>  
        <further-classification edition="202601120260223B">H10P72/70</further-classification>  
        <further-classification edition="202601120260223B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>及川翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIKAWA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤悠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今橋拓巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAHASHI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示之電漿處理裝置包含腔室、腔室內之基板支持部、電漿產生部、偏壓電源、邊緣環、提昇機構、切換器及控制部。偏壓電源及/或電漿產生部之高頻電源與基板支持部之基台電性耦合。提昇機構包含導電環、連桿、致動器及連接構件，且構成為使由導電環支持之狀態之邊緣環上下移動。連接構件提供導電環與基台之間之電性連接。切換器構成為能夠切換第1狀態與第2狀態，該第1狀態係邊緣環與基台相互電性耦合，該第2狀態係邊緣環與基台相互電性分離。控制部構成為控制切換器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1894" publication-number="202620171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在表面上圖案化塗層之方法及包括經圖案化的塗層之裝置</chinese-title>  
        <english-title>METHOD FOR PATTERNING A COATING ON A SURFACE AND DEVICE INCLUDING A PATTERNED COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C09K11/06</main-classification>  
        <further-classification edition="201501120260209B">G02B1/18</further-classification>  
        <further-classification edition="202301120260209B">H10K50/80</further-classification>  
        <further-classification edition="202301120260209B">H10K71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商ＯＴＩ盧米尼克斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTI LUMIONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　怡露</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫藍德　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELANDER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　杰克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, JACKY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　志斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佛　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光電裝置，其包括(1)一基材；(2) 一成核抑制塗層，其覆蓋該基材之一第一區域；以及(3)一導電塗層，其包括一第一部分以及一第二部分。該導電塗層之該第一部分覆蓋該基材之一第二區域，該導電塗層之該第二部分與該成核抑制塗層部分重疊，以及該導電塗層之該第二部分與該成核抑制塗層以一間隙隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An opto-electronic device includes: (1) a substrate; (2) a nucleation inhibiting coating covering a first region of the substrate; and (3) a conductive coating including a first portion and a second portion. The first portion of the conductive coating covers a second region of the substrate, the second portion of the conductive coating partially overlaps the nucleation inhibiting coating, and the second portion of the conductive coating is spaced from the nucleation inhibiting coating by a gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基材</p>  
        <p type="p">102:表面</p>  
        <p type="p">110:陰影遮罩</p>  
        <p type="p">112:孔、狹縫</p>  
        <p type="p">120:源</p>  
        <p type="p">122:箭頭</p>  
        <p type="p">140:成核抑制塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1895" publication-number="202620619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於連續生成與即時播放之互動式角色語音敘事系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CONTINUOUS GENERATION AND REAL-TIME PLAYBACK OF INTERACTIVE CHARACTER VOICE NARRATIVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G06F3/16</main-classification>  
        <further-classification edition="201301120260209B">G10L13/027</further-classification>  
        <further-classification edition="201301120260209B">G10L13/033</further-classification>  
        <further-classification edition="202001120260209B">G06F40/56</further-classification>  
        <further-classification edition="202001120260209B">G06F40/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智見科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRINTAGE , INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鈺潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘岱樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, TAI HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種語音生成與播放技術，特別是一種用於角色劇情之連續生成與即時播放的互動式語音敘事系統及其方法。本系統於接收到語音播放請求時，首先產生一可立即播放之第一音訊段，並於播放該第一音訊段期間，同步啟動文字生成模組與語音生成模組，以產生後續劇情之文字內容與對應語音內容。系統進一步透過一多時間軸同步控制機制，整合使用者實際聆聽時間軸、文字生成時間軸、語音生成時間軸及語音內容長度時間軸，動態調整生成與播放進度，利用第一音訊段之播放時間形成一運算遮蔽區間，以覆蓋後續內容生成所需之運算延遲，確保語音敘事過程之連續性，從而提供不中斷之互動式角色語音敘事體驗。於語音播放過程中，系統可接收使用者之劇情調整指令，並即時影響尚未生成或尚未播放之後續劇情內容，從而提供不中斷之互動式角色語音敘事體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an interactive voice narrative system and a method thereof, which integrates language generation and speech generation technologies. The invention aims to address the issues of excessive initial waiting time, playback interruptions, and lack of logical consistency in character narratives found in existing voice interaction systems. The system comprises a data extraction module, a text generation module, a speech generation module, a memory retrieval module, and a synchronization control module. Its operational characteristic is that when a user triggers the voice function, the data extraction module first extracts historical dialogue records as a base text, and the speech generation module prioritizes generating a voice recap for playback, thereby significantly reducing initial latency. While the recap is playing, the synchronization control module utilizes a multi-timeline synchronization mechanism to activate the language generation module and the speech generation module in parallel, establishing a playback buffer. Concurrently, the memory retrieval module retrieves character history and settings to perform memory fusion, generating subsequent narrative text with logical coherence. By calculating the time difference between playback and generation, the present invention ensures a seamless transition between voice segments, achieving a continuous voice narrative experience characterized by low latency, high immersion, and consistent character personality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:使用者裝置</p>  
        <p type="p">11:聊天室介面</p>  
        <p type="p">12:語音播放介面</p>  
        <p type="p">13:用戶輸入端</p>  
        <p type="p">20:伺服器</p>  
        <p type="p">21:資料擷取模組</p>  
        <p type="p">22:記憶檢索模組</p>  
        <p type="p">23:文字生成模組</p>  
        <p type="p">24:語音生成模組</p>  
        <p type="p">25:同步控制模組</p>  
        <p type="p">30:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1896" publication-number="202620611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極驅動電路及包含該閘極驅動電路的觸控感測顯示裝置</chinese-title>  
        <english-title>GATE DRIVING CIRCUIT AND TOUCH SENSING DISPLAY DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260207B">G06F3/047</main-classification>  
        <further-classification edition="200601120260207B">G09G3/20</further-classification>  
        <further-classification edition="200601120260207B">G11C19/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡奎哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, GYU CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控感測顯示裝置，包括：顯示面板，包括子像素；以及閘極驅動電路，配置以驅動連接至子像素的閘極線，其中，一幀包括以交替方式排列的兩個或更多個顯示週期與兩個或更多個觸控週期，其中，該閘極驅動電路包括：複數個奇數級，包括：複數個奇數主級，配置以在該兩個或更多個顯示週期期間驅動該等閘極線中的複數條奇數閘極線，該等奇數閘極線係連接至該等子像素中的複數個奇數子像素；至少一奇數重置虛擬級，不連接至該等閘極線；以及至少一奇數設定虛擬級，不連接至該等閘極線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch sensing display device comprising: a display panel including subpixels; and a gate driving circuit configured to drive gate lines connected to the subpixels, wherein a frame includes two or more display periods and two or more touch periods which are arranged in an alternating way, wherein the gate driving circuit comprises: a plurality of odd stages including a plurality of odd main stages configured to drive odd gate lines from the gate lines that are connected to odd subpixels among the subpixels during the two or more display periods, at least one odd reset dummy stage that is not connected to the gate lines and at least one odd set dummy stage that is not connected to the gate lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:顯示面板</p>  
        <p type="p">120A:第一閘極驅動器</p>  
        <p type="p">120B:第二閘極驅動器</p>  
        <p type="p">AR1,AR2:區域</p>  
        <p type="p">EL:偶數閘極線、第一偶數閘極線、第二偶數閘極線</p>  
        <p type="p">LBK1~LBK8:奇數主區塊</p>  
        <p type="p">LDM1~LDM8:奇數虛擬區塊</p>  
        <p type="p">LHB1~LHB8:顯示區塊</p>  
        <p type="p">OL:奇數閘極線、第一奇數閘極線、第二奇數閘極線</p>  
        <p type="p">RBK1~RBK8:偶數主區塊</p>  
        <p type="p">RDM1~RDM8:偶數虛擬區塊</p>  
        <p type="p">RST1(L)~RST8(L):外部奇數重置信號</p>  
        <p type="p">RST1(R)~RST8(R):外部偶數重置信號</p>  
        <p type="p">VST1(L)~VST8(L):外部奇數設定信號</p>  
        <p type="p">VST1(R)~VST8(R):外部偶數設定信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1897" publication-number="202621320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光感測系統</chinese-title>  
        <english-title>LIGHT SENSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260205B">H10F39/12</main-classification>  
        <further-classification edition="202501120260205B">H10F77/122</further-classification>  
        <further-classification edition="202501120260205B">H10F77/1226</further-classification>  
        <further-classification edition="202301120260205B">H04N25/75</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光程研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTILUX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭斯璘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳書履</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHU-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢鼎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-DIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁哲夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHE-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊億</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光感測系統，其包含：承載基板；半導體電路層，形成於承載基板上；光感測像素陣列，配置於半導體電路層上，每一光感測像素包含：半導體吸收結構，包含至少一矽層及至少一鍺矽層，矽層用以吸收可見光波段之光子，鍺矽層用以吸收紅外光或近紅外光波段之光子；形成於矽層中的第一光電二極體及第二光電二極體，其分別用以產生對應可見光之電訊號及用以產生對應紅外光或近紅外光之電訊號；互連結構，電性連接第一光電二極體及第二光電二極體至半導體電路層；光學結構，配置於光感測像素陣列上方，用以導引不同波段之入射光至光電二極體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light sensing system, comprising: a carrier substrate; a semiconductor circuit layer formed on the carrier substrate; and a light sensing pixel array disposed on the semiconductor circuit layer, wherein each light sensing pixel comprises: a semiconductor absorption structure including at least one silicon layer and at least one silicon–germanium layer, the silicon layer being configured to absorb photons in a visible light wavelength band, and the silicon–germanium layer being configured to absorb photons in an infrared or near-infrared wavelength band; a first photodiode and a second photodiode formed in the silicon layer, the first photodiode being configured to generate an electrical signal corresponding to visible light, and the second photodiode being configured to generate an electrical signal corresponding to infrared or near-infrared light; an interconnection structure electrically connecting the first photodiode and the second photodiode to the semiconductor circuit layer; and an optical structure disposed above the light sensing pixel array and configured to guide incident light of different wavelength bands to the photodiodes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1600:光電二極體陣列</p>  
        <p type="p">1602:矽光電二極體</p>  
        <p type="p">1604:摻雜晶圓</p>  
        <p type="p">1606:鍺矽光電二極體</p>  
        <p type="p">1610:互連層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1898" publication-number="202620876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在處理器排程錯誤恢復指令的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SCHEDULING ERROR RECOVERY INSTRUCTIONS AT A PROCESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G11C16/06</main-classification>  
        <further-classification edition="201801120260205B">G06F9/30</further-classification>  
        <further-classification edition="200601120260205B">G06F11/07</further-classification>  
        <further-classification edition="200601120260205B">G06F13/14</further-classification>  
        <further-classification edition="200601120260205B">G06F12/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉卡什　吉安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRAKASH, GYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑卡　維杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANKAR, VIJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">處理器，耦接至NAND記憶體裝置，包括具有n通道的n×m晶粒陣列，透過接收回應於在目標晶粒上嘗試執行讀取命令的讀取錯誤的指示，在該晶粒上執行錯誤恢復訊息排程和讀取錯誤恢復，並建立錯誤恢復訊息或指令回到於該指示。處理器判定該錯誤恢復訊息的該目標晶粒，且基於該判定的目標晶粒發送該錯誤恢復訊息至晶粒佇列。該n×m晶粒佇列可以分別進一步分為p優先順序佇列，且基於與錯誤恢復訊息相關聯的優先順序，發送該錯誤恢復訊息至該適當的晶粒優先順序佇列。處理器從每個晶粒優先順序佇列的頭部提取錯誤恢復訊息，並在目標晶粒處執行讀取錯誤恢復。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">&lt;b&gt;            &lt;/b&gt;A processor coupled to a NAND memory device comprising an &lt;i&gt;n&lt;/i&gt; by &lt;i&gt;m&lt;/i&gt; array of dies having &lt;i&gt;n&lt;/i&gt; channels performs error recovery message scheduling and read error recovery on the dies by receiving indications of read errors responsive to attempted execution of a read command on a destination die and creates an error recovery message or instruction in response to the indication. The processor determines the destination die of the error recovery message and sends the error recovery message to a die queue based on the determined destination die. The &lt;i&gt;n&lt;/i&gt; x &lt;i&gt;m&lt;/i&gt; die queues can each be further divided into &lt;i&gt;p &lt;/i&gt;priority queues, and error recovery messages are sent to the appropriate die priority queue based on a priority associated with the error recovery message. The processor fetches error recovery messages from a head of each die priority queue and performs read error recovery at the destination die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:SSD記憶體裝置系統</p>  
        <p type="p">102:主機</p>  
        <p type="p">103:匯流排</p>  
        <p type="p">104:SSD</p>  
        <p type="p">106:ASIC</p>  
        <p type="p">108:NAND記憶體裝置</p>  
        <p type="p">110:主機介面</p>  
        <p type="p">112:內部匯流排</p>  
        <p type="p">114:快閃轉譯層</p>  
        <p type="p">116:記憶體命令</p>  
        <p type="p">117:查找表</p>  
        <p type="p">118:快閃介面層</p>  
        <p type="p">119:LUT引擎</p>  
        <p type="p">120:第一通道</p>  
        <p type="p">121:快閃介面控制</p>  
        <p type="p">122:第二通道</p>  
        <p type="p">124:多組</p>  
        <p type="p">126:第一組</p>  
        <p type="p">128:第二組</p>  
        <p type="p">130:多組</p>  
        <p type="p">132:第三組</p>  
        <p type="p">134:第四組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1899" publication-number="202619813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於輥壓具有恆定厚度之材料腹板之壓延機及對應方法</chinese-title>  
        <english-title>CALENDER FOR ROLLING A WEB OF MATERIAL WITH A CONSTANT THICKNESS AND CORRESPONDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B21B31/07</main-classification>  
        <further-classification edition="200601120260209B">B21B37/24</further-classification>  
        <further-classification edition="200601120260209B">B21B37/58</further-classification>  
        <further-classification edition="200601120260209B">B21B31/16</further-classification>  
        <further-classification edition="200601120260209B">F16C13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬修斯國際有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商馬修斯國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS INTERNATIONAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞內　沃爾特斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENE, WOLTERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於輥壓具有恆定厚度之材料腹板之壓延機，該壓延機包括至少兩個平行的相鄰輥，在該等輥之間形成輥間隙，其中每一輥具有輥筒以及第一軸承軸頸及一第二軸承軸頸，該第二軸承軸頸在軸向上與該第一軸承軸頸相對，借助於該第二軸承軸頸安裝該各別輥，其中面向該輥筒之至少一個內軸承及背離該輥筒之一外軸承至少在該等輥中之第一輥之第一軸承軸頸上並且在該等輥中之第二輥之相鄰的第一軸承軸頸上彼此軸向地相鄰地佈置，使得該等內軸承相對於彼此佈置在第一軸承列中且該等外軸承相對於彼此佈置在第二軸承列中，其中該等輥之間之輥間隙及/或一預負載一方面藉由將該等內軸承相對於彼此或該等外軸承相對於彼此對準夾緊且另一方面藉由將一內軸承與一外軸承對角夾緊來設定。本發明亦係關於一種對應方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a calender for rolling a web of material, comprising at least two parallel adjacent rollers, between which a roller gap is formed, wherein each roller has a roller barrel and a first and a second bearing journal, which is axially opposite the first, by means of which the respective roller is mounted, wherein at least one inner bearing, which faces the roller barrel, and an outer bearing, which faces away from the roller barrel, are arranged axially adjacent to one another at least on a first bearing journal of a first one of the rollers and on an adjacent first bearing journal of a second one of the rollers, so that the inner bearings are arranged in a first bearing row and the outer bearings are arranged in a second bearing row relative to one another, wherein the roller gap and/or a preloading between the rollers is set by aligned clamping of the inner bearings to each other or of the outer bearings to each other on one hand and by diagonal clamping of an inner bearing with an outer bearing on the other hand. The invention also relates to a corresponding method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:壓延機</p>  
        <p type="p">2:材料腹板</p>  
        <p type="p">3:輥</p>  
        <p type="p">4:輥間隙</p>  
        <p type="p">4.2:第二輥間隙</p>  
        <p type="p">5:輥筒</p>  
        <p type="p">6:第一軸承軸頸</p>  
        <p type="p">7:第二軸承軸頸</p>  
        <p type="p">8:內(第一)軸承</p>  
        <p type="p">9:外(第二)軸承</p>  
        <p type="p">A:第一軸承列</p>  
        <p type="p">B:第二軸承列</p>  
        <p type="p">F&lt;sub&gt;D&lt;/sub&gt;:壓縮負載</p>  
        <p type="p">F&lt;sub&gt;Z&lt;/sub&gt;:拉伸負載</p>  
        <p type="p">F&lt;sub&gt;P&lt;/sub&gt;:材料腹板上之壓縮力</p>  
        <p type="p">X:軸向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1900" publication-number="202620192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有反義寡核苷酸之組成物及其用於治療裘馨氏肌肉萎縮症之用途</chinese-title>  
        <english-title>COMPOSITION CONTAINING ANTISENSE OLIGONUCLEOTIDE AND USE THEREOF TO TREAT DUCHENNE MUSCULAR DYSTROPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260205B">C12N15/113</main-classification>  
        <further-classification edition="200601120260205B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260205B">A61P21/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本新藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHINYAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇野朋典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏川隆資</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATSUKAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江川洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAWA, YOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, YOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關含有反義寡核苷酸之組成物及其用於治療裘馨氏肌肉萎縮症之用途。本發明尤其有關以處置之投予量投予時，對於治療裘馨氏肌肉萎縮症為有效之上述組成物及其使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to a composition containing antisense oligonucleotides and use thereof to treat Duchenne muscular dystrophy. Especially, the present invention is related to the above composition and use thereof to treat Duchenne muscular dystrophy when the above composition is administrated in a treating administrating amount.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1901" publication-number="202620498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G02B11/34</main-classification>  
        <further-classification edition="202101120260209B">G02B7/02</further-classification>  
        <further-classification edition="200601120260209B">G02B3/00</further-classification>  
        <further-classification edition="200601120260209B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴永楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YONGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林茂宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MAOZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張加欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIA-SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡以及第九透鏡。第一透鏡至第九透鏡各自包括朝向物側且使成像光線通過的物側面以及朝向像側且使成像光線通過的像側面。第一透鏡的像側面的圓周區域為凹面。第二透鏡具有負屈光率。第三透鏡的像側面的光軸區域為凹面。第七透鏡的物側面的光軸區域為凸面。第九透鏡的像側面的光軸區域為凹面。光學成像鏡頭的透鏡只有上述九片，並且滿足以下條件式：(T6+T7+T8+T9)/(T3+G45+T5+G78)≧1.500及V5/V2≦1.350。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens including a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element sequentially along an optical axis from an object side to an image side is provided. Each of the first lens element to the ninth lens element includes an object-side surface facing the object side and allowing imaging rays to pass through and an image-side surface facing the image side and allowing the imaging rays to pass through. A periphery region of the image-side surface of the first lens element is concave. The second lens element has negative refacting power. An optical axis region of the image-side surface of the third lens element is concave. An optical axis region of the object-side surface of the seventh lens element is convex. An optical axis region of the image-side surface of the ninth lens element is concave. Lens elements of the optical imaging lens only are the nine lens elements described above, and the optical imaging lens satisfies the conditions of (T6+T7+T8+T9)/(T3+G45+T5+G78)≧1.500 and V5/V2≦1.350.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">0:光圈</p>  
        <p type="p">1:第一透鏡</p>  
        <p type="p">2:第二透鏡</p>  
        <p type="p">3:第三透鏡</p>  
        <p type="p">4:第四透鏡</p>  
        <p type="p">5:第五透鏡</p>  
        <p type="p">6:第六透鏡</p>  
        <p type="p">7:第七透鏡</p>  
        <p type="p">8:第八透鏡</p>  
        <p type="p">9:第九透鏡</p>  
        <p type="p">10:光學成像鏡頭</p>  
        <p type="p">11、21、31、41、51、61、71、81、91、F1:物側面</p>  
        <p type="p">12、22、32、42、52、62、72、82、92、F2:像側面</p>  
        <p type="p">99:成像面</p>  
        <p type="p">113、123、213、223、313、323、413、423、513、523、613、623、713、723、813、823、913、923:光軸區域</p>  
        <p type="p">114、124、214、224、314、324、414、424、514、524、614、624、714、724、814、824、914、924:圓周區域</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p>  
        <p type="p">F:濾光片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1902" publication-number="202619979"> 
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          <doc-number>202619979</doc-number> 
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      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103947</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於金屬－空氣電池之裝置架構</chinese-title>  
        <english-title>DEVICE ARCHITECTURES FOR METAL-AIR BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">C01G49/12</main-classification>  
        <further-classification edition="200601120260210B">H01M12/02</further-classification>  
        <further-classification edition="200601120260210B">H01M12/08</further-classification>  
        <further-classification edition="200601120260210B">H01M4/86</further-classification>  
        <further-classification edition="200601120260210B">H01M4/64</further-classification>  
        <further-classification edition="202101120260210B">H01M50/103</further-classification>  
        <further-classification edition="202101120260210B">H01M50/112</further-classification>  
        <further-classification edition="201001120260210B">H01M10/0563</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福恩能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORM ENERGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
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          <inventor app-type="applicant" sequence="1"> 
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              <chinese-name name-type="organization"> 
                <last-name>偉伯　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEBER, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
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                <last-name>偉斯特伍德　米契爾　泰潤斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTWOOD, MITCHELL TERRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慕瑪　瑞秋　伊莉莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUMMA, RACHEL ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史洛肯　亞歷山大　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLOCUM, ALEXANDER H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾西堤恩　傑洛德　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILSHTEIN, JARROD DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>伍德福特　威廉　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOODFORD, WILLIAM HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>姜　一民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YET-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑拉米洛　馬提歐　克里斯俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JARAMILLO, MATEO CRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬凱　伊恩　賽爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCKAY, IAN SALMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉薛特　費基爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUSHETT, FIKILE</last-name>  
                <middle-name/>  
                <first-name/> 
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              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>凡　班雪頓　海倫</last-name>  
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                <last-name>VAN BENSCHOTEN, HELEN</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>基爾伯特　翠司騰</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>GILBERT, TRISTAN</last-name>  
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                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏金斯　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERKINS, NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>潘塔諾　喬瑟夫　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANTANO, JOSEPH ANTHONY</last-name>  
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                <first-name/> 
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              <english-country>US</english-country> 
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                <last-name>史密斯　威斯頓</last-name>  
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                <last-name>SMITH, WESTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>卡力索　克里斯頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLISLE, KRISTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡盧索　伊莎貝拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARUSO, ISABELLA</last-name>  
                <middle-name/>  
                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
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                <last-name>胡特曼　班哲明　湯瑪士</last-name>  
                <first-name/> 
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              <english-name name-type="organization"> 
                <last-name>HULTMAN, BENJAMIN THOMAS</last-name>  
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                <first-name/> 
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              <address/>  
              <english-country>US</english-country> 
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              <chinese-name name-type="organization"> 
                <last-name>湯普森　安娜莉希</last-name>  
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              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, ANNELISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　丹妮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, DANIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特拉索夫　弗拉德米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARASOV, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="23"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈特曼　凱薩琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTMAN, KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="24"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利奧塔　安德魯　海尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOTTA, ANDREW HAYNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大魯　歐奴爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TALU, ONUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="26"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高樂特　馬克　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOULET, MARC-ANTONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="27"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洽克卡拉波提　魯貝克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKRABORTY, RUPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="28"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威納　弗洛里安</last-name>  
                <first-name/> 
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              <english-name name-type="organization"> 
                <last-name>WEHNER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥爾森　布萊得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILESON, BRADLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="30"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧梭　亞莉珊卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUSSEAU, ALEXANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之各項實施例之系統及方法可提供用於電池之裝置架構。在各項實施例中，此等可係一次電池或二次電池。在各項實施例中，此等裝置可用於能量儲存。各項實施例可提供一種電池，其包含：一氧還原反應(ORR)電極；一氧析出反應(OER)電極；一金屬電極；及一電解質，其將該ORR電極及該OER電極與該金屬電極分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods of the various embodiments may provide device architectures for batteries. In various embodiments, these may be primary or secondary batteries. In various embodiments these devices may be useful for energy storage. Various embodiments may provide a battery including an Oxygen Reduction Reaction (ORR) electrode, an Oxygen Evolution Reaction (OER) electrode, a metal electrode; and an electrolyte separating the ORR electrode and the OER electrode from the metal electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池</p>  
        <p type="p">105:氣態頂部空間</p>  
        <p type="p">110:第一負電極</p>  
        <p type="p">120:第一正電極</p>  
        <p type="p">140:電解質</p>  
        <p type="p">170:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1903" publication-number="202619833"> 
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      <tif no="1" file="202619833.zip"/>
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      <volno>24</volno>  
      <isuno>10</isuno>  
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          <doc-number>202619833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面結構重組的處理方法、表面結構重組的物件及雷射加工設備</chinese-title>  
        <english-title>SURFACE STRUCTURAL REORGANIZATION PROCESSING METHOD, OBJECT WITH RECONSTRUCTED SURFACE STRUCTURE AND LASER PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260223B">B23K26/352</main-classification>  
        <further-classification edition="200601120260223B">G03F7/20</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚嶸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇培文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, PEI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種表面結構重組的處理方法、表面結構重組的物件及雷射加工設備。表面結構重組的處理方法包括提供物件。執行結構重組步驟，以飛秒雷射掃描物件的表面的至少一部分，使表面的至少一部分進行結構重組。本發明還提供一種雷射加工設備，可對所述物件進行結構重組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface structural reorganization processing method, an object with reconstructed surface structure and a laser processing equipment. The surface structural reorganization processing method includes providing an object. The structural reorganization step is performed to scan at least a portion of the surface of the object with a femtosecond laser, so that at least a portion of the surface undergoes structural reorganization. A laser processing equipment is also provided. The laser processing equipment could perform structural reorganization of the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">S1,S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1904" publication-number="202620938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260206B">H01J37/32</main-classification>  
        <further-classification edition="200601120260206B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輿水地塩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIMIZU, CHISHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示之電漿處理裝置中，高頻電源於電性偏壓能量之偏壓週期內對高頻電力之頻率進行調整。高頻電源使用基本時間序列作為偏壓週期內之高頻電力之頻率之時間序列。高頻電源重複使用經過變更之時間序列作為偏壓週期內之高頻電力之頻率之時間序列，以基於評估值改善匹配狀態。經過變更之時間序列係藉由對基本時間序列賦予相位偏移量、於頻率方向上對基本時間序列進行縮放、或者於時間方向上對基本時間序列之複數個時間區域中之兩個以上進行縮放而獲得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通信介面</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">10a:側壁</p>  
        <p type="p">10e:氣體排出口</p>  
        <p type="p">10s:電漿處理空間</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">13:簇射頭</p>  
        <p type="p">13a:氣體供給口</p>  
        <p type="p">13b:氣體擴散室</p>  
        <p type="p">13c:氣體導入口</p>  
        <p type="p">20:氣體供給部</p>  
        <p type="p">21:氣體源</p>  
        <p type="p">22:流量控制器</p>  
        <p type="p">30c:控制部</p>  
        <p type="p">30s:感測器</p>  
        <p type="p">31:高頻電源</p>  
        <p type="p">31a:放大器</p>  
        <p type="p">31g:高頻信號產生器</p>  
        <p type="p">31m:匹配器</p>  
        <p type="p">32:偏壓電源</p>  
        <p type="p">32m:匹配器</p>  
        <p type="p">40:排氣系統</p>  
        <p type="p">111:本體部</p>  
        <p type="p">111a:中央區域</p>  
        <p type="p">111b:環狀區域</p>  
        <p type="p">111c:靜電吸盤</p>  
        <p type="p">111e:基台</p>  
        <p type="p">112:環狀組件</p>  
        <p type="p">BE:電性偏壓能量</p>  
        <p type="p">RF:高頻電力</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1905" publication-number="202620541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理用於微影之物件的方法、處理用於微影之物件之表面材料的方法、處理用於微影之物件的裝置、用於微影的物件、微影處理半導體型晶圓的方法以及電腦程式</chinese-title>  
        <english-title>METHOD OF PROCESSING AN OBJECT FOR LITHOGRAPHY, METHOD OF PROCESSING A SURFACE MATERIAL OF AN OBJECT FOR LITHOGRAPHY, APPARATUS FOR PROCESSING AN OBJECT FOR LITHOGRAPHY, OBJECT FOR LITHOGRAPHY, METHOD OF LITHOGRAPHIC PROCESSING OF A SEMICONDUCTOR-BASED WAFER AND COMPUTER PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260223B">G03F1/72</main-classification>  
        <further-classification edition="200601120260223B">C23C16/04</further-classification>  
        <further-classification edition="200601120260223B">C23C16/16</further-classification>  
        <further-classification edition="200601120260223B">C23C16/34</further-classification>  
        <further-classification edition="200601120260223B">H01J37/30</further-classification>  
        <further-classification edition="200601120260223B">C23C8/04</further-classification>  
        <further-classification edition="200601120260223B">C23C8/06</further-classification>  
        <further-classification edition="202601120260223B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里諾夫　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHINOW, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾曼斯　克里斯汀菲利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERMANNS, CHRISTIAN FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩登　約翰克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VON SALDERN, JOHANN-CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪巴赫　修伯特斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARBACH, HUBERTUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯　妮可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTH, NICOLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩法蘭奈克　巴索羅卯司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SZAFRANEK, BARTHOLOMAEUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普雷歇爾　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREISCHL, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種處理用於微影的物件之方法、裝置和電腦程式。一種處理用於微影的物件之方法包含：（a）提供一第一氣體；（b）提供一第二氣體，該第二氣體包括能夠進行反轉振盪的第二分子；（c）在該物件的工作區域中提供粒子束，用於在該工作區域中至少部分基於該第一氣體和該第二氣體產生沉積材料。該第二氣體具有小於5 sccm，較佳小於2 sccm，更佳小於0.5 sccm的氣體流速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention pertains to methods, apparatuses and computer programs for processing an object for lithography. A method for processing an object for lithography comprises: (a) providing a first gas; (b) providing a second gas, the second gas including second molecules capable of performing an inversion oscillation; (c) providing a particle beam in a working region of the object for production of a deposition material in the working region based at least partly on the first gas and the second gas. The second gas is provided with a gas flow rate of less than 5 sccm, preferably less than 2 sccm, more preferably less than 0.5 sccm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">310、320、330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1906" publication-number="202619923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寵物圍護系統</chinese-title>  
        <english-title>PET CONTAINMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B62B3/02</main-classification>  
        <further-classification edition="200601120260209B">A01K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊德Ｓ　哈姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLYDE S, HARMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派崔克Ｊ　Ｇ　鮑爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRICK J.G, BOWERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS M, HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約書亞　弗格森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHUA, FERGUSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種寵物圍護系統，其包括一用於圍護寵物的圍護結構。該圍護結構可使用車輛之兒童適用的下扣式扣環和拴帶（Lower Anchors and Tethers for Children，LATCH）束縛系統或其他合適車輛扣環固定點安裝在車輛中。該系統可包括一垂直及水平可調整拴帶，用於固定穿戴諸如胸帶或背心的衣物之寵物或動物；及一圍繞寵物或動物的護欄。根據本發明的系統將寵物或動物固定在車輛中，以防止或減少寵物因車輛速度及/或方向的突然變換而受到衝擊或受傷之可能性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pet containment system includes a containment structure for containing a pet. The containment structure is mountable in a vehicle using the vehicle’s LATCH (Lower Anchors and Tethers for Children) Restraint System, or other suitable vehicle anchor point(s). The system can include a vertical and horizontally adjustable tether for securing a pet or an animal wearing a wearable such as a chest harness or a vest, and a barrier surrounding the pet or animal. The system according to the present disclosure secures the pet or the animal in the vehicle to prevent or reduce the likelihood of the pet from being impacted or injured by a sudden change in vehicle speed and/or direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:寵物圍護系統、圍護系統</p>  
        <p type="p">20:底座</p>  
        <p type="p">22:閂鎖</p>  
        <p type="p">24:支承框架</p>  
        <p type="p">30:底壁</p>  
        <p type="p">32:向上延伸周邊壁</p>  
        <p type="p">34:緊固件</p>  
        <p type="p">36:護罩</p>  
        <p type="p">40:托架</p>  
        <p type="p">44:拴帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1907" publication-number="202619807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監控纖維清潔設備中之空氣壓力及氣流的方法及裝置及非暫時性電腦可讀介質</chinese-title>  
        <english-title>METHOD AND DEVICE FOR MONITORING AIR PRESSURE AND FLOW IN A FIBER CLEANING DEVICE AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B08B5/02</main-classification>  
        <further-classification edition="200601120260210B">B08B3/08</further-classification>  
        <further-classification edition="200601120260210B">B08B5/04</further-classification>  
        <further-classification edition="200601120260210B">B08B13/00</further-classification>  
        <further-classification edition="200601120260210B">G01N15/08</further-classification>  
        <further-classification edition="200601120260210B">G02B6/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商菲爾薇解析公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIAVI SOLUTIONS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥奇　高爾登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACKAY, GORDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡薩迪　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASSADY, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里奧夫斯基　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRIOFSKE, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森諾　威廉　肖恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENAU, WILLIAM SHAWN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯勒　布拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASLER, BRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">申請涉及監測纖維清潔設備中的氣壓及氣流。一種用於清潔光纖的端面的設備可以接收來自第一壓力傳感器的第一壓力信號，其中該設備包括氣動回路，其中該氣動回路包括：一個或更多個回路部件、第一壓力傳感器及第二壓力傳感器。該設備可以接收來自第二壓力傳感器的第二壓力信號。該設備可以基於第一壓力信號及第二壓力信號來確定一個或更多個回路部件的回路部件兩端的壓差是否滿足閾值。該設備可以基於該回路部件兩端的壓差不滿足閾值來執行一個或更多個動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for cleaning an end face of an optical fiber may receive a first pressure signal from a first pressure sensor, wherein the device includes a pneumatic circuit, wherein the pneumatic circuit includes: one or more circuit components, the first pressure sensor, and a second pressure sensor. The device may receive a second pressure signal from the second pressure sensor. The device may determine, based on the first pressure signal and the second pressure signal, whether a pressure difference across a circuit component, of the one or more circuit components, satisfies a threshold. The device may perform, based on the pressure difference across the circuit component not satisfying the threshold, one or more actions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例實施方式</p>  
        <p type="p">102:纖維清潔設備</p>  
        <p type="p">104:氣動回路</p>  
        <p type="p">106:控制器</p>  
        <p type="p">108:壓力供應端口</p>  
        <p type="p">110:壓力輸出端口</p>  
        <p type="p">112:壓力調節器</p>  
        <p type="p">114:輸入空氣過濾器</p>  
        <p type="p">116:輸出空氣過濾器</p>  
        <p type="p">118:輸出閥</p>  
        <p type="p">120:真空發生器</p>  
        <p type="p">122:真空端口</p>  
        <p type="p">124:排氣端口</p>  
        <p type="p">126:真空控制閥</p>  
        <p type="p">128:供應壓力傳感器</p>  
        <p type="p">130:輸入壓力傳感器</p>  
        <p type="p">132:內部壓力傳感器</p>  
        <p type="p">134:輸出壓力傳感器</p>  
        <p type="p">136:真空壓力傳感器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1908" publication-number="202619924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乘用裝置</chinese-title>  
        <english-title>TRANSPORTATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">B62B7/08</main-classification>  
        <further-classification edition="200601120260209B">B62B9/10</further-classification>  
        <further-classification edition="200601120260209B">B62B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種乘用裝置，包含車手、後腳、前腳、座椅以及背靠。前腳樞接於後腳。座椅樞接於車手、後腳與前腳。背靠設置在座椅的後側處。車手、後腳與前腳相對收合或展開，以帶動座椅與背靠收合或展開。在座椅收合後，座椅的前側低於座椅的後側，使得座椅與背靠的分界線高於背靠遠離座椅的一端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transportation device includes a handle, a rear leg, a front leg, a seat and a backrest. The front leg is pivotally connected to the rear leg. The seat is pivotally connected to the handle, the rear leg and the front leg. The handle, the rear leg and the front leg are folded or unfolded with respect to each other to drive the seat and the backrest to be folded or unfolded. After the seat is folded, a front side of the seat is lower than a rear side of the seat, such that a boundary between the seat and the backrest is higher than an end of the backrest away from the seat.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:乘用裝置</p>  
        <p type="p">30:車手</p>  
        <p type="p">32:固定件</p>  
        <p type="p">34:後腳</p>  
        <p type="p">36:前腳</p>  
        <p type="p">38:座椅</p>  
        <p type="p">42:第二座椅連動件</p>  
        <p type="p">44:小腿靠</p>  
        <p type="p">46:扶手</p>  
        <p type="p">52:收合操作件</p>  
        <p type="p">54:鎖定機構</p>  
        <p type="p">56:背靠</p>  
        <p type="p">300:上車手</p>  
        <p type="p">302:第一下車手</p>  
        <p type="p">304:第二下車手</p>  
        <p type="p">340:連接件</p>  
        <p type="p">380:前側</p>  
        <p type="p">A1,A2:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1909" publication-number="202621333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片封裝結構及其應用</chinese-title>  
        <english-title>CHIP PACKAGE STRUCTURE AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260223B">H10H20/85</main-classification>  
        <further-classification edition="202501120260223B">H10F77/50</further-classification>  
        <further-classification edition="202601120260223B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶智達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IREACH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊琇如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSIU-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾昕展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HSIN-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳守龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHOU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝奇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡弘熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種晶片封裝結構，包括：基材，包含相對之第一表面和第二表面；支架，設於該基材的該第一表面上並圍設一晶片區；晶片組，設於該晶片區中且電性連接於該基材，其中該晶片組包括第一晶片與第二晶片，且該第二晶片之主動面與該第一晶片之主動面相對。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip package structure is provided, which includes a substrate having a first surface and a second surface opposite to the first surface; a housing arranged on the first surface of the substrate and defining a chip area enclosed by the housing; and a chip set arranged in the chip area and electrically connected to the substrate. The chip set includes a first chip and a second chip, wherein the active face of the second chip is facing toward the active face of the first chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">110:基材</p>  
        <p type="p">110A:第一表面</p>  
        <p type="p">110B:第二表面</p>  
        <p type="p">111、112:(第一)電性導通柱</p>  
        <p type="p">113、114:(第二)電性導通柱</p>  
        <p type="p">120:支架</p>  
        <p type="p">120A:晶片區</p>  
        <p type="p">121:第一電性導通結構</p>  
        <p type="p">122:第二電性導通結構</p>  
        <p type="p">130:晶片</p>  
        <p type="p">130A:發射面</p>  
        <p type="p">131:第一導電結構</p>  
        <p type="p">132:第二導電結構</p>  
        <p type="p">140:晶片</p>  
        <p type="p">140A:主動面</p>  
        <p type="p">141:第一對準連接結構</p>  
        <p type="p">142:第二對準連接結構</p>  
        <p type="p">143:第一導電連接結構</p>  
        <p type="p">144:第二導電連接結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1910" publication-number="202620686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調整實體設計的方法、機器可讀媒體、電子裝置、系統與電腦程式產品</chinese-title>  
        <english-title>METHODS, MACHINE-READABLE MEDUIM, ELECTRONIC DEVICE, SYSTEMS AND COMPUTER PROGRAM PRODUCT TO ADJUST PHYSICAL DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260209B">G06F30/27</main-classification>  
        <further-classification edition="202001120260209B">G06F30/398</further-classification>  
        <further-classification edition="200601120260209B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ２Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希拉利　納吉什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRALI, NAGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐里歐丹　唐納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIORDAN, DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種計算待製作於基板上之圖案的方法包含輸入實體設計圖案、決定實體設計圖案的多個可能鄰域、產生實體設計圖案的多個可能遮罩設計、計算基板上的多個可能圖案、根據多個可能圖案計算變化帶，以及修改實體設計圖案以減小變化帶。實施例還包含輸入一組參數給神經網路以計算待製作於基板上的圖案、在多個可能鄰域之每一者中計算實體設計之待製作於基板上的多個圖案、以所計算之多個圖案訓練神經網路，以及調整該組參數以減小待製作於基板上的所計算之多個圖案的製造變異。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for calculating a pattern to be manufactured on a substrate include inputting a physical design pattern, determining a plurality of possible neighborhoods for the physical design pattern, generating a plurality of possible mask designs for the physical design pattern, calculating a plurality of possible patterns on the substrate, calculating a variation band from the plurality of possible patterns, and modifying the physical design pattern to reduce the variation band. Embodiments also include inputting a set of parameters for a neural network to calculate a pattern to be manufactured on a substrate, calculating a plurality of patterns to be manufactured on the substrate for the physical design in each possible neighborhood of the plurality of possible neighborhoods, training the neural network with the calculated plurality of patterns, and adjusting the set of parameters to reduce the manufacturing variation for the calculated plurality of patterns to be manufactured on a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:流程圖</p>  
        <p type="p">702:實體設計圖案(實體設計)</p>  
        <p type="p">704:步驟</p>  
        <p type="p">706:步驟</p>  
        <p type="p">708:步驟</p>  
        <p type="p">710:可能遮罩設計(遮罩設計)(輸出)</p>  
        <p type="p">716:步驟(遮罩製程)</p>  
        <p type="p">718:可能遮罩圖像(計算遮罩圖像)(遮罩圖像)(步驟)</p>  
        <p type="p">720:步驟(微影模擬)</p>  
        <p type="p">722:可能(基板)圖案(步驟)</p>  
        <p type="p">724:步驟</p>  
        <p type="p">725:步驟</p>  
        <p type="p">726:檔案系統</p>  
        <p type="p">728:視埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1911" publication-number="202620492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260213B">G02B7/02</main-classification>  
        <further-classification edition="200601120260213B">G02B9/60</further-classification>  
        <further-classification edition="200601120260213B">G02B11/30</further-classification>  
        <further-classification edition="200601120260213B">G02B17/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申吉洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KIL SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：第一透鏡、第二透鏡、第三透鏡、第四透鏡及第五透鏡，自物側依次設置；以及第一反射構件及第二反射構件，設置於所述第一透鏡的物側上，各自具有自由形式表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, disposed in order from an object side, and a first reflection member and a second reflection member, disposed on an object side of the first lens, each having a freeform surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">102:透鏡組</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">C1:第一光軸</p>  
        <p type="p">C2:第二光軸</p>  
        <p type="p">C3:第三光軸</p>  
        <p type="p">IF:濾波器</p>  
        <p type="p">IP:影像感測器</p>  
        <p type="p">M:反射元件</p>  
        <p type="p">M1:第一反射構件</p>  
        <p type="p">M2:第二反射構件</p>  
        <p type="p">OP:光軸/光路</p>  
        <p type="p">P:光路折疊構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1912" publication-number="202620584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體積體電路及電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">G05F3/26</main-classification>  
        <further-classification edition="200601120260210B">G11C16/04</further-classification>  
        <further-classification edition="200601120260210B">G11C16/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長島芳和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASHIMA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種提供同時實現高品質和高速起動的半導體積體電路及電子設備。實施形態的半導體積體電路是生成第一電壓的半導體積體電路，且包括：第一電路，經配置以輸出對應於所述第一電壓的第一電流；第二電路，經配置以輸出比所述第一電流大的第二電流；電容器，與所述第一電路及所述第二電路連接；第三電路，經配置以輸出對應於所述第一電壓的第三電流；以及控制電路，經配置以執行使來自所述第一電路的所述第一電流與來自所述第二電路的所述第二電流並行地輸出至所述電容器，在將所述第二電流輸出至所述電容器起經過第一時間後，停止所述第二電流向所述電容器的輸出，在停止所述第二電流向所述電容器的輸出後，在經過比所述第一時間更長的第二時間後使來自所述第三電路的所述第三電流輸出的控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體積體電路(BGR電路)</p>  
        <p type="p">10:電壓源電路</p>  
        <p type="p">12:輸出電路</p>  
        <p type="p">14、LPF:低通濾波器</p>  
        <p type="p">20:定標電路</p>  
        <p type="p">30:分壓電路</p>  
        <p type="p">40:電流鏡電路</p>  
        <p type="p">50:控制電路</p>  
        <p type="p">BGRIout0、BGRIout1、BGRVout:輸出</p>  
        <p type="p">Bypass、Disable、Enable、FWAKE:控制狀態</p>  
        <p type="p">C:電容器</p>  
        <p type="p">Q1,Q2,Q5,Q6a,Q6b,Q7a~Q7d:MOSFET(金屬氧化物半導體場效電晶體)</p>  
        <p type="p">Q3~Q4:電晶體</p>  
        <p type="p">R1~R4,R5a,R5b,R6~R8:電阻器</p>  
        <p type="p">SW1a~SW1d,SW2a~SW2c,SW3a~SW3d,SW4~SW6,SW7a,SW7b:開關</p>  
        <p type="p">U:運算放大器</p>  
        <p type="p">Vdd:電源配線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1913" publication-number="202620331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光擴散片、背光單元、液晶顯示裝置、以及資訊機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260210B">F21S2/00</main-classification>  
        <further-classification edition="201501120260210B">F21V3/00</further-classification>  
        <further-classification edition="200601120260210B">G02B5/02</further-classification>  
        <further-classification edition="200601120260210B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260210B">G02F1/13357</further-classification>  
        <further-classification edition="201601320260210B">F21Y105/16</further-classification>  
        <further-classification edition="201601320260210B">F21Y115/10</further-classification>  
        <further-classification edition="201601320260210B">F21Y115/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商惠和股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIWA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芝悟志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狩谷憂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIYA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田忠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, TADAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扇田恩汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGIDA, ONTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種亮度均勻化之功能高的光擴散片。&lt;br/&gt; 解決手段係一種光擴散片43，係在成為出光面或入光面之第一面102a具有使光擴散的凹凸形狀。在光擴散片43中，在與第一面102a相反一側的第二面101a設置有亮度均勻化層103，前述亮度均勻化層103具有複數個粒子107或點圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">43A:第一光擴散片</p>  
        <p type="p">101:基材層</p>  
        <p type="p">101a:第二面(基材層之表面)</p>  
        <p type="p">102:光擴散層</p>  
        <p type="p">102a:第一面(光擴散層之表面)</p>  
        <p type="p">103:亮度均勻化層</p>  
        <p type="p">105:凹部</p>  
        <p type="p">106:樹脂(印墨)</p>  
        <p type="p">107:粒子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1914" publication-number="202619917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童安全座椅</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">B60N2/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方淦清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, GANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種應用於兒童載具的安全帶組件，兒童載具還包括載具本體，其特徵在於，包括：肩帶組，具有第一端和第二端；胯帶組，具有第三端和第四端，所述第三端與載具本體連接，所述第四端與所述第一端可拆卸連接；調整帶，具有第五端和第六端，所述第五端與載具本體連接，所述第六端與所述第二端連接，且調整帶在拉緊狀態和鬆弛狀態之間可切換；及自鎖機構，設於第五端和所述第六端之間；其中，調整帶穿過所述自鎖機構以與所述自鎖機構形成聯動，第四端與所述第一端連接且調整帶處於拉緊狀態時，肩帶組處於拉緊到位的狀態，自鎖機構將調整帶鎖定以限制調整帶及肩帶組的移動。本公開還涉及一種兒童載具，包括載具本體和安全帶組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11A:兒童安全座椅</p>  
        <p type="p">1100A:安全帶長度調整結構</p>  
        <p type="p">1110A:鎖塊</p>  
        <p type="p">1120A:固定座</p>  
        <p type="p">1121A:固定孔</p>  
        <p type="p">1122A:出口</p>  
        <p type="p">1123A:支座</p>  
        <p type="p">12A:底座</p>  
        <p type="p">1200A:坐部</p>  
        <p type="p">1210A:開口部</p>  
        <p type="p">1212A:底壁</p>  
        <p type="p">1213A:後壁</p>  
        <p type="p">1214A:側壁</p>  
        <p type="p">1300A:背靠部</p>  
        <p type="p">1400A:頭靠部</p>  
        <p type="p">1500A:側翼</p>  
        <p type="p">1600A:安全帶組件</p>  
        <p type="p">1610A:肩帶</p>  
        <p type="p">1620A:腰帶</p>  
        <p type="p">1630A:調整帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1915" publication-number="202619918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>存儲結構及兒童安全座椅</chinese-title>  
        <english-title>STORAGE STRUCTURE AND CHILD SAFETY SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙廣輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李如意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方淦清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, GANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於兒童安全座椅的存儲結構，用於存儲物體。存儲結構包括殼體。殼體設置在兒童安全座椅上，並形成用於存儲物體的儲物空間，其中存儲結構設置在兒童安全座椅的底座的後部，並位於所述兒童安全座椅的座部下方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A storage structure for use with a child safety seat is adapted to store an object. The storage structure includes a shell that is disposed in the child safety seat and forms a storage space for storing the object, wherein the storage structure is disposed at a rear portion of a base of the child safety seat, and is located below a seat portion of the child safety seat.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500A:座部</p>  
        <p type="p">501A:支撐桿</p>  
        <p type="p">500Aa:乘坐部分</p>  
        <p type="p">502A:避讓空間</p>  
        <p type="p">600A:底座</p>  
        <p type="p">610A:存儲結構</p>  
        <p type="p">611A:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1916" publication-number="202621314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路，供半導體製造之方法，及系統</chinese-title>  
        <english-title>INTEGRATED CIRCUIT, METHOD FOR SEMICONDUCTOR FABRICATION, AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260220B">H10D99/00</main-classification>  
        <further-classification edition="201201120260220B">G03F1/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾比斯　法爾贊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARBIZ, FARZAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMANN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　心怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIN YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於置放單元在一積體電路中之系統、設備及方法。在各種實施例中，一積體電路被劃分成複數個分割區。在易受電晶體閂鎖影響之一第一組分割區中，許多電晶體閘極條連接至電力軌之一者，而不是保持浮動。在該第一分割區中之井分接頭單元的該等電晶體閘極條之長度被縮短，但是在易受不良信號完整性影響的一第二分割區中的該等電晶體閘極條之長度増加。一或多個植入物層形成在該第一分割區及該第二分割區之各者中的該等電晶體閘極條下方，以調整防電晶體閂鎖及不良信號完整性的一保護量。包括一靜電放電電晶體，該靜電放電電晶體具有形成在一井中的多個源極區域之至少一個源極區域，該井具有與該至少一個源極區域中相同的一摻雜極性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, apparatuses, and methods for placing cells in an integrated circuit are described. In various embodiments, an integrated circuit is divided into many partitions. In a first set of partitions susceptible to transistor latch-up, the many transistor gate stripes are connected to one of the power rails rather than left floating. The lengths of the transistor gate stripes are shortened for well tap cells in the first partition, but increased in a second partition susceptible for poor signal integrity. One or more implant layers are formed underneath the transistor gate stripes in each of the first and second partitions to adjust an amount of protection against transistor latch-up and poor signal integrity. An electrostatic discharge transistor is included with at least one source region of multiple source regions formed in a well with a same doping polarity as the at least one source region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電晶體閘極條</p>  
        <p type="p">112:電晶體閘極條</p>  
        <p type="p">120:p型區域</p>  
        <p type="p">122:p型區域</p>  
        <p type="p">124:p型區域</p>  
        <p type="p">130:p井</p>  
        <p type="p">160:電晶體閘極條</p>  
        <p type="p">162:電晶體閘極條</p>  
        <p type="p">170:n型區域</p>  
        <p type="p">172:n型區域</p>  
        <p type="p">174:n型區域</p>  
        <p type="p">180:n井</p>  
        <p type="p">600:井分接頭單元</p>  
        <p type="p">610:植入物</p>  
        <p type="p">620:植入物</p>  
        <p type="p">630:植入物</p>  
        <p type="p">640:植入物</p>  
        <p type="p">650:井分接頭單元</p>  
        <p type="p">VDD:電力供應</p>  
        <p type="p">VSS:接地參考</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1917" publication-number="202620429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微機電系統（ＭＥＭＳ）加速度計及識別ＭＥＭＳ加速度計空腔之裂口之方法</chinese-title>  
        <english-title>MICROELECTROMECHANICAL SYSTEM (MEMS) ACCELEROMETER AND METHOD FOR IDENTIFYING A BREACH OF A MEMS ACCELEROMETER CAVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01P1/00</main-classification>  
        <further-classification edition="200601120260211B">G01P15/12</further-classification>  
        <further-classification edition="201301120260211B">G01P15/18</further-classification>  
        <further-classification edition="200601120260211B">G01P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應美盛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENSENSE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡巴夏尼　亞都弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIAMBASTIANI, ADOLFO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科羅納圖　路加</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORONATO, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝羅尼　伊兜亞都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLONI, EDOARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德里亞　史提凡諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELLEA, STEFANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋弗萊里　加科莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAFFORELLI, GIACOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　堯清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAOCHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種MEMS加速度計封裝，其包含多個空腔使得對應於該等空腔之一或多者中之一裂口之一壓力變化容易基於諸如一MEMS諧振器之一壓敏感測器之輸出識別。可回應於該壓力變化之識別啟動一或多個緩解。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A MEMS accelerometer package includes multiple cavities such that a change in pressure corresponding to a breach in one or more of the cavities is readily identified based on the output of a pressure-sensitive sensor such as a MEMS resonator. One or more mitigations may be initiated in response to the identification of the change in pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:微機電系統(MEMS)加速度計封裝</p>  
        <p type="p">302:z軸加速度計</p>  
        <p type="p">304:y軸加速度計</p>  
        <p type="p">306:x軸加速度計</p>  
        <p type="p">308:外壁</p>  
        <p type="p">309:第一空腔</p>  
        <p type="p">310:外壁</p>  
        <p type="p">311:第二空腔</p>  
        <p type="p">312:壓敏感測器</p>  
        <p type="p">314:額外感測器</p>  
        <p type="p">320:頂蓋</p>  
        <p type="p">322:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1918" publication-number="202619791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空心粒子</chinese-title>  
        <english-title>HOLLOW PARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">B01J13/14</main-classification>  
        <further-classification edition="200601120260210B">C08F12/36</further-classification>  
        <further-classification edition="200601120260210B">C08F2/18</further-classification>  
        <further-classification edition="200601120260210B">C08F2/44</further-classification>  
        <further-classification edition="200601120260210B">C08L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳生左京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGYU, SAKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種空心粒子的製造方法，其可減低疏水性溶劑之殘留量，可獲得電性絕緣特性及溶劑抗性優異的空心粒子。一種空心粒子的製造方法，其係具備包含樹脂之殼體及由殼體包圍之空心部且空隙率為50%以上之空心粒子的製造方法，其包含：製備包含聚合性單體、疏水性溶劑、聚合起始劑、分散穩定劑及水系媒介之混合液的工序；藉由使混合液懸浮，製備單體組成物之液滴分散於水系媒介中之懸浮液的工序；以及藉由將懸浮液供於聚合反應，製備包含具有由殼體包圍之空心部且將疏水性溶劑內包於空心部的前驅物粒子之前驅物組成物的工序；其中前述聚合性單體係烴單體，聚合性單體100質量%中，交聯性單體之含量為70質量%以上，前述疏水性溶劑係碳數5～8之烴系溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method for producing hollow particles capable of reducing a residual amount of a hydrophobic solvent and obtaining hollow particles excellent in electrical insulation characteristics and solvent resistance. A method for producing hollow particles comprising a shell containing a resin, and a hollow portion surrounded by the shell, and a void ratio of which is 50% or more, the method comprising a step comprising preparing a mixture liquid containing a polymerizable monomer, a hydrophobic solvent, a polymerization initiator, a dispersion stabilizer and an aqueous medium; a step comprising preparing a suspension in which a droplet of a monomer composition is dispersed in the aqueous medium by suspending the mixture liquid; and a step comprising preparing a precursor composition containing a precursor particle having a hollow portion surrounded by a shell and including the hydrophobic solvent in the hollow portion, by a polymerization reaction of the suspension, wherein the polymerizable monomer is a hydrocarbon monomer, a content of a crosslinkable monomer is 70% by mass or more with respect to 100% by mass of the polymerizable monomer, and the hydrophobic solvent is a hydrocarbon solvent having 5 to 8 carbon atoms.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1919" publication-number="202621329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微型ＬＥＤ以及微型ＬＥＤ顯示面板</chinese-title>  
        <english-title>MICRO LED AND MICRO LED DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260213B">H10H20/814</main-classification>  
        <further-classification edition="202501120260213B">H10H20/822</further-classification>  
        <further-classification edition="201601120260213B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧之琛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, ZHICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　偉新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, WEI SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微型LED，包括鍵合層、形成於該鍵合層上的N型半導體層、形成於該N型半導體層上的發光層、形成於該發光層上的P型半導體層以及形成於該P型半導體層上的頂部導電層。該鍵合層包括金屬鍵合層、與該N型半導體層相鍵合的金屬層，以及形成於該金屬鍵合層和該金屬層之間的透明導電層，其中該金屬層為半透明的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A micro LED includes a bonding layer; an N type semiconductor layer formed on the bonding layer, a light emitting layer formed on the N type semiconductor layer, a P type semiconductor layer formed on the light emitting layer, and a top conductive layer formed on the P type semiconductor layer. The bonding layer includes a first metal bonding layer, a second metal bonding layer bonded with the N type semiconductor layer, and a transparent bonding layer formed between the first metal bonding layer and the second metal bonding layer; and the second metal bonding layer is semi-transparent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微型LED</p>  
        <p type="p">110:IC背板</p>  
        <p type="p">120:鍵合層</p>  
        <p type="p">130:N型半導體層</p>  
        <p type="p">140:發光層</p>  
        <p type="p">150:P型半導體層</p>  
        <p type="p">160:頂部導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1920" publication-number="202621422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/00</main-classification>  
        <further-classification edition="202601120260223B">H10P72/10</further-classification>  
        <further-classification edition="202601120260223B">H10P72/30</further-classification>  
        <further-classification edition="202601120260223B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五師源太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOSHI, GENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種「可抑制被形成於基板的表面之圖案的倒塌」之技術。 &lt;br/&gt;　　[解決手段]本揭示之一態樣的基板處理裝置，係具備有：批次處理部；單片處理部；及搬送部。批次處理部，係成批地處理包含複數個基板的批次。單片處理部，係逐片處理批次所含有的基板。搬送部，係在批次處理部與單片處理部之間逐片收授基板。又，批次處理部，係具有：處理槽，儲存包含有沖洗液的處理液。又，搬送部，係具有：流體供給部，在從接收處理槽內之批次所含有的基板起至收授到單片處理部為止，將表面張力低於沖洗液之低表面張力流體供給至處理槽及基板的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">48:處理槽</p>  
        <p type="p">49:批次浸泡機構</p>  
        <p type="p">201:內槽</p>  
        <p type="p">202:外槽</p>  
        <p type="p">205:DIW供給部</p>  
        <p type="p">206:IPA供給部</p>  
        <p type="p">207:循環部</p>  
        <p type="p">251:DIW供給源</p>  
        <p type="p">252:DIW供給管線</p>  
        <p type="p">253:流量調整器</p>  
        <p type="p">261:IPA供給源</p>  
        <p type="p">262:IPA供給管線</p>  
        <p type="p">263:流量調整器</p>  
        <p type="p">271:循環管線</p>  
        <p type="p">272:處理液供給噴嘴</p>  
        <p type="p">273:過濾器</p>  
        <p type="p">274:加熱器</p>  
        <p type="p">275:泵</p>  
        <p type="p">W:晶圓</p>  
        <p type="p">L1:處理液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1921" publication-number="202620536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單孔徑低Ｆ值變焦相機</chinese-title>  
        <english-title>SINGLE-APERTURE LOW F NUMBER ZOOM CAMERAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260209B">G03B19/02</main-classification>  
        <further-classification edition="202101120260209B">G03B13/06</further-classification>  
        <further-classification edition="202101120260209B">G03B17/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商核心光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COREPHOTONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科恩　諾伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHEN, NOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金斯伯格　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GINZBURG, ANDREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝勒　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHERER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝梅什　齊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEMESH, ZIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈登堡　以法蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDENBERG, EPHRAIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙伯泰　加爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHABTAY, GAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格魯什卡　奧里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRUSHKA, ORIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏茨　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEITZ, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包含廣角或望遠相機的相機系統，每個這樣的相機包含一鏡頭和一影像感測器，該鏡頭具有N個透鏡元件L1至LN，並具有鏡頭總長TTL、有效焦距EFL、自我調整孔徑AA，及該影像感測器具有全感測器對角線SD，每個相機具有全視野F-FOV相機狀態和變焦視野Z-FOV相機狀態，該全視野F-FOV相機狀態具有相應的全視野F-FOV鏡頭孔徑直徑DA&lt;sub&gt;F-FOV&lt;/sub&gt;和該變焦視野Z-FOV相機狀態具有相應變焦視野Z-FOV透鏡孔徑直徑DA&lt;sub&gt;Z-FOV&lt;/sub&gt;。在廣角和望遠相機中，為了在全視野F-FOV相機狀態和變焦視野Z-FOV相機模式之間切換，自我調整孔徑AA可操作的在DA&lt;sub&gt;F-FOV&lt;/sub&gt;和DA&lt;sub&gt;Z-FOV&lt;/sub&gt;之間切換，使得DA&lt;sub&gt;Z-FOV&lt;/sub&gt;≧1.2 x DA&lt;sub&gt;F-FOV&lt;/sub&gt;，其中處理器可操作的裁剪影像感測器，使SD&lt;sub&gt;Z&lt;/sub&gt;≦0.8 x SD，並且其中DA&lt;sub&gt;Z-FOV&lt;/sub&gt;/SD&lt;sub&gt;Z&lt;/sub&gt;＞1.5 x DA&lt;sub&gt;F-FOV&lt;/sub&gt;/SD。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Camera systems comprising Wide or Tele cameras, each such camera comprising a lens with a plurality of N lens elements L1 – LN and having a total track length TTL, an effective focal length EFL, an adaptive aperture AA, and an image sensor having a full sensor diagonal SD, each camera having a full field-of-view F-FOV camera state with a respective F-FOV lens aperture diameter DA&lt;sub&gt;F-FOV&lt;/sub&gt;, and a zoom field-of-view Z-FOV camera state with a respective a Z-FOV lens aperture diameter DA&lt;sub&gt;Z-FOV&lt;/sub&gt;. In both Wide and Tele cameras, for switching between the F-FOV camera state and the Z-FOV camera state, the AA is operational to switch between DA&lt;sub&gt;F-FOV&lt;/sub&gt;and DA&lt;sub&gt;Z-FOV&lt;/sub&gt;such that DA&lt;sub&gt;Z-FOV&lt;/sub&gt;≥ 1.2x DA&lt;sub&gt;F-FOV&lt;/sub&gt;, wherein the processor is operational to crop the image sensor such that SD&lt;sub&gt;Z&lt;/sub&gt; ≤ 0.8x SD, and wherein DA&lt;sub&gt;Z-FOV&lt;/sub&gt;/SD&lt;sub&gt;Z&lt;/sub&gt; ＞ 1.5x DA&lt;sub&gt;F-FOV&lt;/sub&gt;/SD.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:相機</p>  
        <p type="p">162:透鏡</p>  
        <p type="p">164:影像感測器</p>  
        <p type="p">DA&lt;sub&gt;Z-FOV&lt;/sub&gt;:變焦視野透鏡孔徑直徑</p>  
        <p type="p">216:視野</p>  
        <p type="p">218:光錐</p>  
        <p type="p">EFL:有效焦距</p>  
        <p type="p">SD&lt;sub&gt;Z&lt;/sub&gt;:變焦感測器對角線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1922" publication-number="202620047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＧＤＦ１５中和抗體及其用途</chinese-title>  
        <english-title>GDF15 NEUTRALIZING ANTIBODIES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">C07K16/22</main-classification>  
        <further-classification edition="200601120260223B">A61K39/395</further-classification>  
        <further-classification edition="200601120260223B">A61P35/00</further-classification>  
        <further-classification edition="202601120260223B">G01N33/575</further-classification>  
        <further-classification edition="200601120260223B">C12N15/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海海路生物技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HAILU BIOLOGICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商揚子江藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE RIVER PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖詩驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SHIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李花利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐星辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANG, XINGCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊好冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HAODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慕松林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, SONGLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王如偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　志清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, MARK ZHIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁俊萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種結合GDF15的抗體或其抗原結合片段。所述抗體或其抗原結合片段包含：選自下列至少之一的CDR序列或與其具有至少66%同一性的胺基酸序列：重鏈可變區CDR序列：SEQ ID NO: 1~34和SEQ ID NO: 74~76；輕鏈可變區CDR序列：SEQ ID NO: 36~73和SEQ ID NO: 77~82。根據本發明的實施例，該抗體或其抗原結合片段可特異性結合GDF15，且可有效阻斷GFRAL和GDF15結合，同時還可有效抑制Treg分化，可用於預防和/或治療癌症和惡病質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1923" publication-number="202621453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡盤、及形成卡盤之方法</chinese-title>  
        <english-title>CHUCK, AND METHOD OF FORMING CHUCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10P72/76</main-classification>  
        <further-classification edition="202601120260223B">H10W40/10</further-classification>  
        <further-classification edition="202601120260223B">H10W70/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿吉拉爾　桑蒂蘭　瓦昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGUILAR SANTILLAN, JOAQUIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫塔斯　相克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTTATH, SHANKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示者係靜電卡盤及形成靜電卡盤之方法。例示性靜電卡盤包括一陶瓷本體、嵌入此陶瓷本體內的一裝置、及形成為上覆於此裝置的一界面層。例示性方法包括：在一模具內提供陶瓷前驅物材料，提供一裝置，用一界面材料塗佈此裝置以形成一經塗佈裝置，將此經塗佈裝置放置於此陶瓷前驅物材料之上或之內，及燒結此陶瓷前驅物材料以形成靜電卡盤以及介於此裝置與此燒結步驟期間所形成的陶瓷材料之間的一界面層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:晶圓</p>  
        <p type="p">202:陶瓷本體</p>  
        <p type="p">204:加熱元件</p>  
        <p type="p">206:電極</p>  
        <p type="p">207:層</p>  
        <p type="p">208:電極</p>  
        <p type="p">210:介電層</p>  
        <p type="p">212:流體腔體</p>  
        <p type="p">214:氣體供應</p>  
        <p type="p">216:電源供應器</p>  
        <p type="p">218:流體</p>  
        <p type="p">220:電源供應器</p>  
        <p type="p">222:陶瓷軸</p>  
        <p type="p">224:冷卻流體</p>  
        <p type="p">226,228,230,232:界面層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1924" publication-number="202620451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於掃描測試之設備、方法及電腦可讀取非暫時性儲存媒體</chinese-title>  
        <english-title>APPARATUS, METHOD, AND COMPUTER-READABLE, NON-TRANSITORY STORAGE MEDIUM FOR SCAN TESTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260220B">G01R31/3181</main-classification>  
        <further-classification edition="200601120260220B">G06F11/26</further-classification>  
        <further-classification edition="200601120260220B">G11C29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧利瓦　安東尼塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLIVA, ANTONIETTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽尼根　麥可　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENINGEN, MICHAEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘地　瓦蘇　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANTI, VASU P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝塔達　彼傑　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETTADA, VIJAY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包括複數個電路區塊、複數個掃描致能正反器電路、及複數個掃描特徵電路。複數個掃描致能正反器電路可跨複數個電路區塊以循序方式耦接，並經組態以將掃描鏈測試信號從測試輸入介面移位至測試輸出介面。複數個掃描特徵電路可耦接至複數個掃描致能正反器電路之子集的各別者，並經組態以回應於特定測試信號而將已知掃描鏈型樣並行地載入至掃描致能正反器電路之子集。複數個掃描致能正反器電路可進一步經組態以將已知掃描鏈型樣的至少一部分循序地輸出至測試輸出介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統單晶片(SoC)</p>  
        <p type="p">105a,105b:電路區塊</p>  
        <p type="p">110a,110b:掃描鏈</p>  
        <p type="p">115a~115e:掃描特徵電路</p>  
        <p type="p">120a~120i:掃描致能正反器電路</p>  
        <p type="p">130a,130b:測試信號</p>  
        <p type="p">150:測試輸入介面</p>  
        <p type="p">152:測試輸出介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1925" publication-number="202619966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202619966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202619966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＰＬＤ之氮化鋁鈧靶之製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING A SCANDIUM ALUMINUM NITRIDE TARGET FOR PLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C01B21/06</main-classification>  
        <further-classification edition="200601120260213B">C23C14/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫普曼　威廉　蔻尼里斯　蘭伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOPMAN, WILLEM CORNELIS LAMBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德克斯　詹　馬帝京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEKKERS, JAN MATTHIJN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於脈衝雷射沈積(PLD)之氮化鋁鈧(ScAlN)靶體之製造方法，該方法包括以下步驟：&lt;br/&gt; ˗ 提供鈧鋁合金體；&lt;br/&gt; ˗ 將該鈧鋁合金體粉碎成鈧鋁粒子；&lt;br/&gt; ˗ 將該等鈧鋁粒子氮化成氮化鋁鈧粒子；&lt;br/&gt; ˗ 將該等氮化鋁鈧粒子熱壓成氮化鋁鈧靶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for producing a scandium aluminum nitride (ScAlN) target body for pulsed laser deposition (PLD), which method comprises the steps of: &lt;br/&gt; - providing a scandium aluminum alloy body; &lt;br/&gt; - pulverizing the scandium aluminum alloy body into scandium aluminum particles; &lt;br/&gt; - nitridizing the scandium aluminum particles into scandium aluminium nitride particles; &lt;br/&gt; - hot pressing the scandium aluminum nitride particles into a scandium aluminum nitride target body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鈧鋁(ScAl)合金體</p>  
        <p type="p">2:ScAl粉末</p>  
        <p type="p">3:流化床反應器</p>  
        <p type="p">4:泵</p>  
        <p type="p">5:撓性模具</p>  
        <p type="p">6:壓力容器</p>  
        <p type="p">7:靶體</p>  
        <p type="p">P:適合壓力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1926" publication-number="202620450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機及用於測試電子元件的處理機的電子元件重新配置方法</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS AND REALIGNMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260220B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於測試電子元件的處理機。依據本發明，包括：測試台，裝載複數個電子元件；及，重新配置機構，把所述測試台的複數個臨時區域上裝載的複數個電子元件重新配置到複數個正確位置區域；所述重新配置機構包括：用於重新配置的拾取器，能握持電子元件；用於重新配置的攝影機，和所述用於重新配置的拾取器隔離地配置；及，旋轉機，讓所述用於重新配置的拾取器旋轉。適用本發明的話，縮短電子元件的重新配置所花費的時間而得以提高處理機的處理容量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:重新配置機構</p>  
        <p type="p">510:用於重新配置的拾取器</p>  
        <p type="p">520:用於重新配置的攝影機</p>  
        <p type="p">530:旋轉機</p>  
        <p type="p">540:升降機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1927" publication-number="202620306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺紋緊固件及其製作方法</chinese-title>  
        <english-title>THREADED FASTENER AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260214B">F16B39/02</main-classification>  
        <further-classification edition="200601120260214B">F16B23/00</further-classification>  
        <further-classification edition="200601120260214B">F16B33/02</further-classification>  
        <further-classification edition="200601120260214B">F16B33/06</further-classification>  
        <further-classification edition="200601120260214B">F16B35/04</further-classification>  
        <further-classification edition="200601120260214B">F16B39/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商工程組件公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENGINEERED COMPONENTS COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢瑞克森　阿恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENRIKSEN, ARNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種緊固件具有一頭部及自該頭部處之一第一端延伸至一第二端之一軸，該第二端形成一尖端。該軸具有一第一部分及一第二部分。該第一部分設置於該尖端處。該第一部分之一硬度高於該第二部分之一硬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fastener having a head and a shaft extending from a first end at the head to a second end forming a tip. The shaft has a first portion and a second portion. The first portion is disposed at the tip. A hardness of the first portion is higher than a hardness of the second portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:緊固件</p>  
        <p type="p">12:頭部</p>  
        <p type="p">14:軸</p>  
        <p type="p">16:尖端</p>  
        <p type="p">18:凹陷部分</p>  
        <p type="p">20:第一部分</p>  
        <p type="p">22:第二部分</p>  
        <p type="p">24:第三部分</p>  
        <p type="p">26:黏著劑</p>  
        <p type="p">A&lt;sub&gt;1&lt;/sub&gt;-A&lt;sub&gt;1&lt;/sub&gt;:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1928" publication-number="202621540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝和其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W74/01</main-classification>  
        <further-classification edition="202601120260223B">H10W72/50</further-classification>  
        <further-classification edition="202601120260223B">H10W74/00</further-classification>  
        <further-classification edition="202601120260223B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔涬喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HANGCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙南柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, NAMJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於製造半導體裝置的方法。所述方法包括：提供封裝基部；經由焊料凸塊將第一仲介層附接在所述封裝基部上；將第一半導體裸片附接在所述封裝基部上並且鄰近於所述第一仲介層；經由焊料凸塊將第二仲介層附接在所述第一仲介層上以形成仲介層堆疊，其中所述第一仲介層和所述第二仲介層限定階梯結構，其中所述階梯結構包括在所述仲介層堆疊的側邊分別從所述第一仲介層和所述第二仲介層延伸的兩個階梯表面；將第二半導體裸片附接在所述第一半導體裸片和所述第一仲介層兩者上；以及在所述封裝基部上形成第一密封劑層以密封所述第一仲介層、所述第二仲介層、所述第一半導體裸片和所述第二半導體裸片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝</p>  
        <p type="p">110:基底</p>  
        <p type="p">111:頂面</p>  
        <p type="p">120:仲介層堆疊</p>  
        <p type="p">120-1,120-2,120-3:仲介層</p>  
        <p type="p">121:階梯結構</p>  
        <p type="p">122-1,122-2,122-3:階梯表面</p>  
        <p type="p">123-1,123-2,123-3:豎立表面</p>  
        <p type="p">124:焊料凸塊</p>  
        <p type="p">125:焊料凸塊</p>  
        <p type="p">126:導電圖案</p>  
        <p type="p">127:連接結構</p>  
        <p type="p">130-1,130-2,130-3,130-4:半導體裸片</p>  
        <p type="p">131:焊料凸塊</p>  
        <p type="p">132:焊料凸塊，無功能凸塊</p>  
        <p type="p">140:密封劑層</p>  
        <p type="p">150:焊料凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1929" publication-number="202621039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202621039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202621039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可控制之包絡追蹤雜訊濾波器的功率放大器模組</chinese-title>  
        <english-title>POWER AMPLIFIER MODULES WITH CONTROLLABLE ENVELOPE TRACKING NOISE FILTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">H03F1/32</main-classification>  
        <further-classification edition="200601120260213B">H03F3/20</further-classification>  
        <further-classification edition="200601120260213B">H04L25/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴提努　佛羅奈爾　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALTEANU, FLORINEL G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多羅吉　斯爾吉　弗朗索瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DROGI, SERGE FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　羅伯特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, ROBERT JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法拉瓦什　沙洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARAHVASH, SHAYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩克　大衛　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEHLKE, DAVID RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨茲勒　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENZLER, STEPHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本文中提供具有可控制之包絡追蹤雜訊濾波器的功率放大器模組。在某些實施例中，一包絡追蹤系統包含一功率放大器模組及為該功率放大器模組提供基於由該功率放大器模組放大之一射頻(RF)信號之一包絡改變之一功率放大器供應電壓之一包絡追蹤器。該功率放大器模組包含對該功率放大器供應電壓濾波以提供對包絡追蹤雜訊濾波之靈活性之一可控制濾波器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Power amplifier modules with controllable envelope tracking noise filters are provided herein. In certain embodiments, an envelope tracking system includes a power amplifier module and an envelope tracker that provides the power amplifier module with a power amplifier supply voltage that changes based on an envelope of a radio frequency (RF) signal amplified by the power amplifier module. The power amplifier module includes a controllable filter that filters the power amplifier supply voltage to provide flexibility in filtering envelope tracking noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">71:功率放大器模組</p>  
        <p type="p">72:多位準供應(MLS)DC轉DC轉換器</p>  
        <p type="p">73:多位準供應(MLS)調變器</p>  
        <p type="p">74:調變器輸出濾波器</p>  
        <p type="p">81:功率放大器</p>  
        <p type="p">82:可控制濾波器</p>  
        <p type="p">83:介面</p>  
        <p type="p">100:包絡追蹤系統</p>  
        <p type="p">ENVELOPE:包絡信號</p>  
        <p type="p">RF&lt;sub&gt;IN&lt;/sub&gt;:射頻(RF)輸入信號</p>  
        <p type="p">RF&lt;sub&gt;OUT&lt;/sub&gt;:射頻(RF)輸出信號</p>  
        <p type="p">V&lt;sub&gt;BATT&lt;/sub&gt;:電池電壓</p>  
        <p type="p">V&lt;sub&gt;MLSa&lt;/sub&gt;至V&lt;sub&gt;MLSn&lt;/sub&gt;:經調節電壓</p>  
        <p type="p">V&lt;sub&gt;PA&lt;/sub&gt;:功率放大器供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1930" publication-number="202620529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202620529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>10</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202620529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有薄型光學影像穩定功能的小型折疊式遠距相機</chinese-title>  
        <english-title>COMPACT FOLDED TELE CAMERAS WITH SLIM OPTICAL IMAGE STABILIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260214B">G03B5/00</main-classification>  
        <further-classification edition="202101120260214B">G02B7/04</further-classification>  
        <further-classification edition="202101120260214B">G03B19/07</further-classification>  
        <further-classification edition="202101120260214B">G03B19/22</further-classification>  
        <further-classification edition="202101120260214B">G03B17/17</further-classification>  
        <further-classification edition="202301120260214B">H04N23/55</further-classification>  
        <further-classification edition="202101120260214B">G03B3/10</further-classification>  
        <further-classification edition="202101120260214B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商核心光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COREPHOTONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈登堡　以法蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDENBERG, EPHRAIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古林斯基　納達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOULINSKI, NADAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科恩　諾伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHEN, NOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝梅什　齊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEMESH, ZIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥諾　伊泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANOR, ITAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於行動裝置的折疊式相機模組。該折疊式相機模組包括一鏡頭，具有一有效焦距在8毫米到50毫米範圍內並且具有f/#小於3.5。該鏡頭包括一第一透鏡組（G1）和一第二透鏡組（G2）。該折疊式相機模組包括一光路折疊元件（OPFE）。該第一透鏡組位於該光路折疊元件的一物側，及該第二透鏡組位於該折疊光路元件的一像側。該折疊式相機模組還被配置為在空間上調整該第一透鏡組、該第二透鏡組和該光路折疊元件中的至少一個，以補償由於該相機模組的移動而導致進入該折疊式相機模組的光的光路偏移，從而提供光學影像穩定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A folded-camera module for a mobile device. The folded-camera module includes a lens having an effective focal length in the range of 8mm to 50mm and having a f/# lesser than 3.5. The lens is comprising a first lens group (G1) and a second lens group (G2). The folded-camera module includes an optical path folding element (OPFE). The first lens group is positioned at an object side of the OPFE, and the second lens group is positioned at an image side of the OPFE. The folded-camera module is further configured for spatially adjusting at least one of the first lens group, the second lens group, and the OPFE, so as to compensate for an optical path shift of light entering into the folded camera module due to movements of the camera module, thereby providing optical image stabilization.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:光路折疊元件</p>  
        <p type="p">106:影像感測器</p>  
        <p type="p">108:第一光路</p>  
        <p type="p">110:第二光路</p>  
        <p type="p">112:孔徑</p>  
        <p type="p">114:外殼</p>  
        <p type="p">200:相機</p>  
        <p type="p">202:箭頭</p>  
        <p type="p">204:箭頭</p>  
        <p type="p">206:箭頭</p>  
        <p type="p">102-G1:第一透鏡組</p>  
        <p type="p">102-G2:第二透鏡組</p>  
        <p type="p">AF:自動對焦</p>  
        <p type="p">BFL:後焦距</p>  
        <p type="p">H&lt;sub&gt;S&lt;/sub&gt;:感測器高度</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;~L&lt;sub&gt;7&lt;/sub&gt;:透鏡元件</p>  
        <p type="p">MHM:最小模組高度</p>  
        <p type="p">MHS:最小肩部高度</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">T&lt;sub&gt;G1&lt;/sub&gt;:厚度</p>  
        <p type="p">T&lt;sub&gt;G2&lt;/sub&gt;:厚度</p>  
        <p type="p">TTL1:鏡頭總長</p>  
        <p type="p">TTL2:鏡頭總長</p>  
        <p type="p">W&lt;sub&gt;L&lt;/sub&gt;:透鏡寬度</p>  
        <p type="p">W&lt;sub&gt;OPFE&lt;/sub&gt;:光路折疊元件寬度</p>  
        <p type="p">△LO:距離</p>  
        <p type="p">d(G1-G2)1:距離</p>  
        <p type="p">d(G1-G2)2:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application> 
</tw-patent-applications>
